TW202339084A - Workpiece carrier - Google Patents
Workpiece carrier Download PDFInfo
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- TW202339084A TW202339084A TW111111080A TW111111080A TW202339084A TW 202339084 A TW202339084 A TW 202339084A TW 111111080 A TW111111080 A TW 111111080A TW 111111080 A TW111111080 A TW 111111080A TW 202339084 A TW202339084 A TW 202339084A
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- workpiece carrier
- support film
- platform
- workpieces
- annular frame
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- 238000005520 cutting process Methods 0.000 claims description 15
- 239000012528 membrane Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
本揭露是有關於一種工件載具,特別是指一種在不變更現有機台接受尺寸前提下而可極大化地運用承載面積的工件載具。The present disclosure relates to a workpiece carrier, particularly a workpiece carrier that can maximize the use of the load-bearing area without changing the accepted dimensions of the existing machine.
一般而言,在半導體產品的製造流程中,晶圓在切割形成多個晶片後,會進一步使多個晶片固定於一共同載體(例如是導線架)並配合封膠體包封多個晶片,由於是多個晶片共同封裝於一封膠體內,因此需再藉由進一步的切割製程將至少一個晶片予以單體化,形成多個具功能之封裝體。在此切割製程中,主要是使用具黏性之切割膠帶先行黏貼於機台設備所使用之圓型框架上,再將待切割之封裝結構依序黏貼在切割膠帶,並且逐一排列於在圓型框體內,以方便切割機台運輸、進行後續切割流程。然而,現行封裝結構由於採用的載體大多為長條狀(例如銅箔基板、導線框架等),受限於圓型框體的尺寸及外型限制,整個框體能承載的封裝結構的數量有限,因而無法有效利用整個切割膠帶的面積,不僅造成切割膠帶材料的浪費,相對的也無法提昇產能。Generally speaking, in the manufacturing process of semiconductor products, after the wafer is cut to form multiple wafers, the multiple wafers are further fixed on a common carrier (such as a lead frame) and encapsulated with an encapsulant. Multiple chips are packaged together in an encapsulant, so at least one chip needs to be singulated through a further cutting process to form multiple functional packages. In this cutting process, adhesive cutting tape is mainly used to first affix it to the circular frame used by the machine equipment, and then the package structures to be cut are affixed to the cutting tape in sequence, and arranged one by one on the circular frame. inside the frame to facilitate transportation of the cutting machine and subsequent cutting processes. However, because most of the carriers used in current packaging structures are strip-shaped (such as copper foil substrates, lead frames, etc.), they are limited by the size and shape of the circular frame. The number of packaging structures that the entire frame can carry is limited. Therefore, the entire cutting tape area cannot be effectively utilized, which not only results in a waste of cutting tape materials, but also fails to increase production capacity.
本揭露提供一種工件載具,其具有較高的面積使用率,進而能降低生產成本及提升生產效率。The present disclosure provides a workpiece carrier that has a high area utilization rate, thereby reducing production costs and improving production efficiency.
本揭露的一種工件載具包括環型框體及支撐膜。環型框體包括彼此相對的一內緣以及一外緣,其中內緣框圍出用以承載多個工件的一承載範圍並包括朝向外緣形成突出的多個轉折部,且多個轉折部分別對應多個工件的多個邊角。支撐膜鋪設於承載範圍並固定於環形框體上。A workpiece carrier disclosed in the present disclosure includes an annular frame and a supporting film. The annular frame includes an inner edge and an outer edge opposite to each other, wherein the inner edge frame encloses a bearing range for carrying multiple workpieces and includes a plurality of turning portions protruding toward the outer edge, and the plurality of turning portions Do not correspond to multiple corners of multiple workpieces. The supporting membrane is laid in the load-bearing range and fixed on the annular frame.
在本揭露的一實施例中,所述多個轉折部中的每一個至所述內緣的一中心的距離實質上大於所述內緣的其他處至所述中心的距離。In an embodiment of the present disclosure, a distance from each of the plurality of turning portions to a center of the inner edge is substantially greater than a distance from other parts of the inner edge to the center.
在本揭露的一實施例中,所述多個轉折部彼此呈對稱設置。In an embodiment of the present disclosure, the plurality of turning portions are arranged symmetrically with each other.
在本揭露的一實施例中,所述多個工件貼附於所述支撐膜上。In an embodiment of the present disclosure, the plurality of workpieces are attached to the support film.
在本揭露的一實施例中,所述多個工件沿一第一方向排列設置於所述支撐膜上,且所述支撐膜在所述第一方向上的一長度實質上小於所述環型框體的一內徑。In an embodiment of the present disclosure, the plurality of workpieces are arranged on the support film along a first direction, and a length of the support film in the first direction is substantially smaller than the annular shape. An inner diameter of the frame.
在本揭露的一實施例中,所述支撐膜的一周緣實質上平行於對應的所述多個工件的一長邊。In an embodiment of the present disclosure, a peripheral edge of the support film is substantially parallel to a corresponding long side of the plurality of workpieces.
在本揭露的一實施例中,所述多個轉折部的多個頂點分別與對應的所述多個邊角維持一間距。In an embodiment of the present disclosure, the plurality of vertices of the plurality of turning portions respectively maintain a distance from the corresponding plurality of corners.
在本揭露的一實施例中,所述間距實質上介於13毫米至16毫米之間。In an embodiment of the present disclosure, the distance is substantially between 13 mm and 16 mm.
在本揭露的一實施例中,所述工件載具配合使用於一切割機台之一平台上,其中所述平台設置於所述支撐膜下方以吸附及固定所述支撐膜,且所述平台的一平台外緣與所述環型框體的所述內緣維持一間距。In one embodiment of the present disclosure, the workpiece carrier is used on a platform of a cutting machine, wherein the platform is disposed below the support film to absorb and fix the support film, and the platform The outer edge of a platform maintains a distance from the inner edge of the annular frame.
在本揭露的一實施例中,所述平台的所述平台外緣包括對應所述多個轉折部的多個平台轉折部。In an embodiment of the present disclosure, the platform outer edge of the platform includes a plurality of platform turning portions corresponding to the plurality of turning portions.
基於上述,本揭露的工件載具的環型框體的內緣包括朝向其外緣突出的多個轉折部,且轉折部的位置分別對應工件的多個邊角。如此配置,環型框體透過其內緣的轉折部往外突出,以達到對工件的邊角讓位的效果,因而能在不改變環型框體的外緣形狀與尺寸的前提下承載更多的工件,提升工件載具的面積利用率,進而提升工件的產能。Based on the above, the inner edge of the annular frame of the workpiece carrier of the present disclosure includes a plurality of turning portions protruding toward its outer edge, and the positions of the turning portions respectively correspond to multiple corners of the workpiece. With this configuration, the ring-shaped frame protrudes outward through the turning part of its inner edge to achieve the effect of giving way to the corners of the workpiece, so it can carry more weight without changing the shape and size of the outer edge of the ring-shaped frame. of workpieces, improving the area utilization of the workpiece carrier, thereby increasing the productivity of workpieces.
有關本揭露之前述及其他技術內容、特點與功效,在以下配合參考圖式之各實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明,而並非用來限制本揭露。並且,在下列各實施例中,相同或相似的元件將採用相同或相似的標號。The aforementioned technical contents, features and effects of the present disclosure will be clearly presented in the following detailed description of each embodiment with reference to the drawings. Directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are illustrative and not limiting of the disclosure. Furthermore, in the following embodiments, the same or similar elements will be given the same or similar numbers.
圖1是依照本揭露的一實施例的一種工件載具的俯視示意圖。圖2是依照本揭露的一實施例的一種工件載具的側視示意圖。請同時參照圖1及圖2,在一些實施例中,工件載具100可包括環型框體110及支撐膜120。工件載具100可用於承載及固定多個工件200。舉例而言,工件載具100可在半導體製程中用於承載及固定多個封裝結構200。在本實施例中,工件載具100可在半導體製程中配合一機台上之平台130使用(圖式僅為示意非用以侷限本揭露之運用)。在本實施例中,機台可例如為切割機台,而平台130即為此切割機台的承載平台。當然,本揭露並不以此為限。工件載具100可使用於半導體製程中的任何製程機台的平台130上,用於承載及固定封裝結構200,以利後續製程的進行。在一些實施例中,環型框體110可框圍出用以承載多個工件200的承載範圍S1,而支撐膜120可鋪設於此承載範圍S1並固定於環形框體110上。如此,工件200貼附於支撐膜120上,並可透過支撐膜120而固定於環型框體110上來進行後續之製程。FIG. 1 is a schematic top view of a workpiece carrier according to an embodiment of the present disclosure. FIG. 2 is a schematic side view of a workpiece carrier according to an embodiment of the present disclosure. Please refer to FIGS. 1 and 2 simultaneously. In some embodiments, the
在一實施例中,支撐膜120可包括離型層及黏著層。離型層可設置於黏著層上方,以在封裝結構貼附於黏著層上之前防止異物沾附於黏著層上。在本實施例中,支撐膜120可為半導體製程中使用的切割膠帶,其可具有黏性,並用於在後續處理(例如切割製程)中將封裝結構200保持在定位上。在完成切割製程後,支撐膜120可藉由例如剝離製程而使封裝結構200自支撐膜120脫離(剝離)。剝離製程可使用例如蝕刻、研磨以及機械剝落(mechanical peel off)等任何適合的製程來移除支撐膜120。在某些實施例中,可藉由在支撐膜120的表面上照射雷射或紫外光來剝離支撐膜120。在一些實施例中,支撐膜120可具有與環型框體110大致上對應之形狀。在本實施例中,封裝結構200的背面可例如先貼覆於支撐膜120上,再將支撐膜120固定於環型框體110上,之後再沿著環型框體110的邊緣裁切支撐膜120。當然,本揭露並不以此為限。在一些實施例中,平台130可設置於支撐膜120的下方,以吸附與固定支撐膜120。在本實施例中,平台130可為真空吸盤(chuck)或靜電吸盤,其是例如透過真空或靜電等吸附的方式將支撐膜120均勻地吸附於平台130的上表面,以確保工件200與設置平面之間的穩固性與平整性。In one embodiment, the
在本實施例中,封裝結構200可為一已封裝之導線架條(Leadframe Strip)而工件載具100可例如用於在此切割製程中承載及固定多個條狀的封裝結構200。也就是說,本實施例的封裝結構200的形狀是呈長條型(長方形),其具有多個邊角220。如此,將具有邊角的多個封裝結構200設置於環型框體上,位在邊緣的封裝結構200的邊角容易與環型框體的內緣產生干涉而導致環型框體無法容納較多的封裝結構200。當然,本實施例僅用以舉例說明,本揭露並不以此為限。在其他實施例中,封裝結構200可為其他適合的封裝結構並可具有其他可能的形狀。只要封裝結構200具有邊角,其易與環型框體的內緣產生干涉,即可適用於本揭露的配置。In this embodiment, the
有鑒於此,在本實施例中,環型框體110可包括彼此相對的內緣114以及外緣116,其中,環型框體110的內緣114框圍出用以承載多個封裝結構200的承載範圍S1,並且,環型框體110的內緣114包括朝向外緣116突出的多個轉折部112,且轉折部112的位置分別對應封裝結構200的邊角220。如此,環型框體110透過其內緣114的轉折部112往外突出,以達到對封裝結構200的邊角220讓位的效果,因而能相較於圓型的框體承載更多個封裝結構200,提升工件載具100的空間利用率。具體而言,一般的圓型框體約可承載兩個封裝結構,而本實施例的具有多個轉折部112的環型框體110則可承載至少三個封裝結構,當然,本揭露並不以此為限。In view of this, in this embodiment, the
圖3是依照本揭露的一實施例的一種工件載具的環形框體與封裝結構的配置關係的俯視示意圖。請參照圖1及圖3,在一些實施例中,各個轉折部112至內緣114的中心的距離R1實質上大於內緣114的其他處至中心的距離R2。並且,轉折部112彼此可呈對稱設置,以分別對應多個工件200的多個邊角220。在本實施例中,轉折部112的夾角θ1約介於120度至140度之間。在本實施例中,轉折部112的頂點分別與對應的邊角220維持間距g1,以預留切割刀具所須的最小安全距離。舉例來說,轉折部112的頂點與邊角220之間的間距g1約介於13毫米至16毫米之間。雖然本實施例的工件200是呈長方形,然而,在其他實施例中,工件200也可呈例如正方形等其他多邊形的形狀,只要工件200具有多個非圓弧的邊角,皆可利用本揭露之配置,於環型框體110的內緣114設置分別對應多個邊角的轉折部112,以在不改變環型框體110的外緣形狀與尺寸的前提下容納更多數量的工件200。3 is a schematic top view of the arrangement relationship between the annular frame and the packaging structure of a workpiece carrier according to an embodiment of the present disclosure. Please refer to FIGS. 1 and 3 . In some embodiments, the distance R1 from each turning
在一些實施例中,工件200可沿第一方向D1排列設置於支撐膜120上,且支撐膜120在第一方向D1上的長度L1實質上小於環型框體110的內徑L2,也就是說,支撐膜120並未完全鋪滿環型框體110所框圍出的承載範圍S1,且支撐膜120的周緣122實質上約可平行於對應的工件200的長邊210。在本實施例中,支撐膜120可為捲帶式支撐膜,而設置支撐膜120的方法可包括先沿著工件200的長軸方向(約垂直於第一方向D1)鋪設支撐膜120於環型框體110上,再沿著環型框體110的邊緣裁切支撐膜120。如此,支撐膜120在第一方向D1上的長度L1即為此捲帶式支撐膜的寬度,且此長度L1僅須略大於工件200的設置區域即可,無須完全鋪滿整個承載範圍S1。因此,本實施例的支撐膜120在第一方向D1上的長度L1可縮短至小於環型框體110的內徑L2,以進一步降低生產成本。舉例來說,支撐膜120在第一方向D1上的長度L1約可介於300毫米至350毫米。在本實施例中,支撐膜120在第一方向D1上的長度L1約為320毫米,但本揭露並不以此為限。In some embodiments, the
圖4是依照本揭露的一實施例的一種平台與封裝結構的配置關係的俯視示意圖。請參照圖1及圖4,在本實施例中,平台130也可相似於環型框體110的配置而具有多個對應於轉折部112的多個平台轉折部132。具體而言,平台130的平台外緣134可如圖1所示之與環型框體110的內緣114維持一間距。並且,平台130的平台外緣134包括多個平台轉折部132,其分別對應於環型框體110的多個轉折部112。也就是說,平台外緣134會在對應於工件200的邊角處往外突出而形成轉折,因而可確保工件200的邊角也可受到平台130及支撐膜120的吸附與貼附。在一實施例中,平台外緣134可略大於工件200於支撐膜120上的設置範圍。在本實施例中,平台轉折部132的夾角θ2約可介於120度至140度之間。FIG. 4 is a schematic top view of the arrangement relationship between a platform and a packaging structure according to an embodiment of the present disclosure. Please refer to FIG. 1 and FIG. 4 . In this embodiment, the
綜上所述,本揭露的工件載具的環型框體的內緣包括朝向其外緣突出的多個轉折部,且轉折部的位置分別對應工件的多個邊角。如此配置,環型框體透過其內緣的轉折部往外突出,以達到對工件的邊角讓位的效果,因而能在不改變環型框體的外緣形狀與尺寸的前提下承載更多的工件,提升工件載具的空間利用率,進而提升工件的產能。並且,本揭露的工件載具進一步縮短了支撐膜在工件的排列方向上的長度,使此長度僅略大於工件的設置區域而並未完全鋪滿整個環型框體所框圍出的承載範圍,因而可進一步降低生產成本。In summary, the inner edge of the annular frame of the workpiece carrier of the present disclosure includes a plurality of turning portions protruding toward its outer edge, and the positions of the turning portions respectively correspond to multiple corners of the workpiece. With this configuration, the ring-shaped frame protrudes outward through the turning part of its inner edge to achieve the effect of giving way to the corners of the workpiece, so it can carry more weight without changing the shape and size of the outer edge of the ring-shaped frame. of workpieces, improving the space utilization of the workpiece carrier, thereby increasing the productivity of workpieces. Moreover, the workpiece carrier of the present disclosure further shortens the length of the support film in the arrangement direction of the workpieces, so that this length is only slightly larger than the installation area of the workpieces but does not completely cover the load-bearing range enclosed by the entire annular frame. , thus further reducing production costs.
100:工件載具 110:環型框體 112:轉折部 114:內緣 116:外緣 120:支撐膜 122:周緣 130:平台 132:平台轉折部 134:平台外緣 200:工件、封裝結構 210:長邊 220:邊角 D1:第一方向 g1:間距 L1:長度 L2:內徑 S1:承載範圍 R1、R2:距離 θ1、θ2:夾角 100:Workpiece carrier 110: Ring frame 112: Turning point 114:Inner edge 116:Outer edge 120: Support film 122: Zhou Yuan 130:Platform 132:Platform Turning Department 134:Outer edge of platform 200: Workpiece, packaging structure 210: long side 220: Corner D1: first direction g1: spacing L1:Length L2:Inner diameter S1: Carrying range R1, R2: distance θ1, θ2: included angle
圖1是依照本揭露的一實施例的一種工件載具的俯視示意圖。 圖2是依照本揭露的一實施例的一種工件載具的側視示意圖。 圖3是依照本揭露的一實施例的一種工件載具的環形框體與封裝結構的配置關係的俯視示意圖。 圖4是依照本揭露的一實施例的一種平台與封裝結構的配置關係的俯視示意圖。 FIG. 1 is a schematic top view of a workpiece carrier according to an embodiment of the present disclosure. FIG. 2 is a schematic side view of a workpiece carrier according to an embodiment of the present disclosure. 3 is a schematic top view of the arrangement relationship between the annular frame and the packaging structure of a workpiece carrier according to an embodiment of the present disclosure. FIG. 4 is a schematic top view of the arrangement relationship between a platform and a packaging structure according to an embodiment of the present disclosure.
100:工件載具 100:Workpiece carrier
110:環型框體 110: Ring frame
112:轉折部 112: Turning point
114:內緣 114:Inner edge
116:外緣 116:Outer edge
120:支撐膜 120: Support film
122:周緣 122: Zhou Yuan
130:平台 130:Platform
134:平台外緣 134:Outer edge of platform
200:工件、封裝結構 200: Workpiece, packaging structure
210:長邊 210: long side
220:邊角 220: Corner
D1:第一方向 D1: first direction
g1:間距 g1: spacing
L1:長度 L1:Length
L2:內徑 L2:Inner diameter
S1:承載範圍 S1: Carrying range
Claims (10)
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CN202210618348.1A CN116845020A (en) | 2022-03-24 | 2022-06-01 | Workpiece carrier |
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