TW202337680A - Resin film heat treatment device and resin film heat treatment method capable of achieving cost reduction of heat treatment of a resin film - Google Patents
Resin film heat treatment device and resin film heat treatment method capable of achieving cost reduction of heat treatment of a resin film Download PDFInfo
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- TW202337680A TW202337680A TW111139236A TW111139236A TW202337680A TW 202337680 A TW202337680 A TW 202337680A TW 111139236 A TW111139236 A TW 111139236A TW 111139236 A TW111139236 A TW 111139236A TW 202337680 A TW202337680 A TW 202337680A
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- resin film
- endless belt
- heat treatment
- heating furnace
- film
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- 229920005989 resin Polymers 0.000 title claims abstract description 269
- 239000011347 resin Substances 0.000 title claims abstract description 269
- 238000010438 heat treatment Methods 0.000 title claims abstract description 189
- 238000000034 method Methods 0.000 title claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 13
- 238000011084 recovery Methods 0.000 claims abstract description 11
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 39
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 39
- 238000004804 winding Methods 0.000 claims description 27
- 229920001169 thermoplastic Polymers 0.000 claims description 21
- 239000004416 thermosoftening plastic Substances 0.000 claims description 20
- 229910001220 stainless steel Inorganic materials 0.000 claims description 14
- 239000010935 stainless steel Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 11
- 238000007689 inspection Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000004064 recycling Methods 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0277—Apparatus with continuous transport of the material to be cured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/02—Thermal after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Description
本發明是有關於一種樹脂薄膜熱處理裝置和樹脂薄膜的熱處理方法。The invention relates to a resin film heat treatment device and a resin film heat treatment method.
在日本特開2005-103989號公報中公開了熱塑性液晶聚合物薄膜的製造方法。在該公報所公開的熱塑性液晶聚合物薄膜的製造方法中,由能夠形成光學各向異性的熔融相的熱塑性聚合物形成的薄膜(以下,將其稱為熱塑性液晶聚合物薄膜)以接合於片狀的支撐體的狀態被連續地進行熱處理,接著熱塑性液晶聚合物薄膜從支撐體分離。此處,公開了以下的內容:在熱塑性液晶聚合物薄膜的熔點(Tm)-15℃以上且小於熔點(Tm)的溫度下實施5~60秒與支撐體接合的狀態的熱塑性液晶聚合物薄膜的熱處理,使熱塑性液晶聚合物薄膜的熱膨脹係數比熱處理前的熱膨脹係數高。在該公報中,從卷出輥卷出的縱長的熱塑性液晶聚合物薄膜以與從卷出輥卷出的由金屬箔形成的片狀的支撐體重合的狀態送入到加熱輥,通過熱壓接而接合來製作層疊體。然後,將該層疊體送入到加熱處理裝置而進行熱處理,之後,將層疊體分離為熱塑性液晶聚合物薄膜和支撐體,從而獲得熱膨脹係數提高的熱塑性液晶聚合物薄膜。在該公報中,此外,片狀的支撐體的厚度優選7~200μm的範圍,更優選7~75μm的範圍。 [現有技術文獻] [專利文獻] Japanese Patent Application Publication No. 2005-103989 discloses a method for producing a thermoplastic liquid crystal polymer film. In the method for producing a thermoplastic liquid crystal polymer film disclosed in this publication, a film made of a thermoplastic polymer capable of forming an optically anisotropic melt phase (hereinafter referred to as a thermoplastic liquid crystal polymer film) is bonded to the sheet. The state of the support is continuously heat-treated, and then the thermoplastic liquid crystal polymer film is separated from the support. Here, the following content is disclosed: a thermoplastic liquid crystal polymer film in a state where it is bonded to a support at a temperature of -15° C. or more and less than the melting point (Tm) of the thermoplastic liquid crystal polymer film for 5 to 60 seconds. The heat treatment causes the thermal expansion coefficient of the thermoplastic liquid crystal polymer film to be higher than that before heat treatment. In this publication, a vertically long thermoplastic liquid crystal polymer film unrolled from a unwinding roller is fed to a heating roller in a state of overlapping with a sheet-shaped support made of metal foil unrolled from the unwinding roller, and is heated by the heat roller. They are pressed and joined to produce a laminated body. Then, the laminated body is sent to a heat treatment device for heat treatment, and then the laminated body is separated into a thermoplastic liquid crystal polymer film and a support, thereby obtaining a thermoplastic liquid crystal polymer film with an increased thermal expansion coefficient. In this publication, the thickness of the sheet-like support is preferably in the range of 7 to 200 μm, and more preferably in the range of 7 to 75 μm. [Prior art documents] [Patent Document]
專利文獻1:日本特開2005-103989號公報Patent Document 1: Japanese Patent Application Publication No. 2005-103989
[發明要解決的問題] 另外,熱塑性液晶聚合物薄膜不能單獨地進行熱處理,需要像上述那樣黏貼於片狀的支撐體而進行熱處理,需要準備片狀的支撐體。 [用於解決問題的方案] [Problem to be solved by invention] In addition, the thermoplastic liquid crystal polymer film cannot be heat-treated alone. It needs to be adhered to a sheet-like support and heat-treated as described above, and a sheet-like support needs to be prepared. [A solution to the problem]
此處公開的樹脂薄膜熱處理裝置包括:環形帶,其由金屬片形成;帶驅動機構,其使環形帶沿著預先確定的行進路徑行進;加熱爐,其以覆蓋環形帶的行進路徑的局部的方式配置;樹脂薄膜黏貼機,其在加熱爐的上游側,向環形帶供給樹脂薄膜,將樹脂薄膜黏貼於環形帶;以及樹脂薄膜回收機,其在加熱爐的下游側,從環形帶剝離而回收樹脂薄膜。根據該樹脂薄膜熱處理裝置,在循環的環形帶上,連續地進行樹脂薄膜的熱處理。環形帶循環,能夠長時間持續地使用。因此,樹脂薄膜的熱處理的成本被抑制得較低。The resin film heat treatment device disclosed here includes: an endless belt formed of a metal sheet; a belt drive mechanism that causes the endless belt to travel along a predetermined traveling path; and a heating furnace that covers a portion of the traveling path of the endless belt. configuration; a resin film pasting machine, which is on the upstream side of the heating furnace, supplies resin film to the endless belt, and adheres the resin film to the endless belt; and a resin film recycling machine, which is on the downstream side of the heating furnace, peeling off the endless belt. Recycle resin film. According to this resin film heat treatment apparatus, the heat treatment of the resin film is continuously performed on the circulating endless belt. The endless belt loops can be used continuously for a long time. Therefore, the cost of heat treatment of the resin film is kept low.
此處,環形帶也可以是不銹鋼製。此外,成為熱處理的對象的樹脂薄膜例如可以是液晶聚合物薄膜。樹脂薄膜黏貼機也可以包括加熱環形帶的預熱裝置。此外,樹脂薄膜黏貼機也可以包括在環形帶和樹脂薄膜上重疊另一片的機構。此處,另一片也可以是聚醯亞胺薄膜。Here, the endless belt may be made of stainless steel. The resin film to be heat-treated may be a liquid crystal polymer film, for example. The resin film pasting machine may also include a preheating device for heating the endless belt. In addition, the resin film pasting machine may include a mechanism for overlapping another piece on the endless belt and the resin film. Here, the other piece may also be a polyimide film.
在此處公開的樹脂薄膜的熱處理方法中,使用帶爐,該帶爐具有:金屬製的環形帶;帶驅動機構,其使環形帶沿著預先確定的行進路徑行進;以及加熱爐,其以覆蓋環形帶的行進路徑的局部的方式配置。樹脂薄膜的熱處理方法包含以下的步驟。 在加熱爐的上游側,以重疊於環形帶的方式供給樹脂薄膜,將樹脂薄膜按壓於環形帶而將樹脂薄膜黏貼於環形帶; 熱處理步驟,在該步驟中,在加熱爐中樹脂薄膜與環形帶熱膨脹相應地伸長且被加熱;以及 在加熱爐的下游側,從所述環形帶剝離而回收樹脂薄膜。 而且,在使環形帶在黏貼樹脂薄膜的步驟、熱處理步驟、回收的步驟循環的同時對黏貼於環形帶的樹脂薄膜進行熱處理。 In the heat treatment method of the resin film disclosed here, a belt furnace is used. The belt furnace has: a metal endless belt; a belt drive mechanism that causes the endless belt to travel along a predetermined travel path; and a heating furnace that Arranged in a manner that covers part of the traveling path of the annular belt. The heat treatment method of the resin film includes the following steps. On the upstream side of the heating furnace, the resin film is supplied so as to overlap the endless belt, the resin film is pressed against the endless belt, and the resin film is adhered to the endless belt; a heat treatment step in which the resin film is elongated and heated in response to thermal expansion of the endless belt in a heating furnace; and On the downstream side of the heating furnace, the resin film is peeled off from the endless belt and recovered. Furthermore, the resin film attached to the endless belt is heat-treated while the endless belt is circulated through the step of attaching the resin film, the step of heat treatment, and the step of recycling.
根據該熱處理方法,在循環的環形帶上,連續地進行樹脂薄膜的熱處理。環形帶循環,能夠長時間持續地使用。因此,樹脂薄膜的熱處理的成本被抑制得較低。According to this heat treatment method, the heat treatment of the resin film is continuously performed on the circulating endless belt. The endless belt loops can be used continuously for a long time. Therefore, the cost of heat treatment of the resin film is kept low.
此處,也可以是,熱處理前的樹脂薄膜以捲繞於捲繞軸的狀態被準備,從捲繞軸引出,在加熱爐的上游側,以重疊於環形帶的方式供給樹脂薄膜。 此外,也可以是,在回收的步驟中,樹脂薄膜從環形帶剝離而捲繞於捲繞軸。 Here, the resin film before heat treatment may be prepared in a state of being wound around a winding shaft, taken out from the winding shaft, and supplied so as to overlap an endless belt on the upstream side of the heating furnace. In addition, in the step of collecting, the resin film may be peeled off from the endless belt and wound around a winding shaft.
樹脂薄膜也可以是熱塑性液晶聚合物薄膜。環形帶也可以是不銹鋼製。也可以是,在將樹脂薄膜黏貼於環形帶的步驟中,在重疊於環形帶的樹脂薄膜上重疊另一片,經由該另一片而樹脂薄膜按壓於環形帶。此處,另一片也可以是聚醯亞胺薄膜。The resin film may also be a thermoplastic liquid crystal polymer film. The endless belt can also be made of stainless steel. In the step of adhering the resin film to the endless belt, another piece may be stacked on the resin film overlapping the endless belt, and the resin film may be pressed against the endless belt via the other piece. Here, the other piece may also be a polyimide film.
以下,參照附圖,詳細地說明本公開的典型的實施方式之一。另外,在以下的附圖中,對起到相同的作用的構件、部位標註相同的附圖標記來說明。此外,各圖中的尺寸關係(長度、寬度、厚度等)並非反映實際的尺寸關係。Hereinafter, one of the typical embodiments of the present disclosure will be described in detail with reference to the drawings. In addition, in the following drawings, the same reference numerals are attached|subjected to the members and parts which have the same function, and are demonstrated. In addition, the dimensional relationships (length, width, thickness, etc.) in each figure do not reflect actual dimensional relationships.
《樹脂薄膜熱處理裝置10》 圖1是示意性地表示樹脂薄膜熱處理裝置10的側視圖。 此處公開的樹脂薄膜熱處理裝置10包括環形帶11、帶驅動機構12、樹脂薄膜黏貼機14、加熱爐15、樹脂薄膜回收機16。 "Resin Film Heat Treatment Device 10" FIG. 1 is a side view schematically showing the resin film heat treatment apparatus 10 . The resin film heat treatment device 10 disclosed here includes an endless belt 11 , a belt driving mechanism 12 , a resin film pasting machine 14 , a heating furnace 15 , and a resin film recovery machine 16 .
〈環形帶11〉 環形帶11由金屬片形成。作為構成環形帶11的金屬片的材料的例子,能夠舉出鋁、銅、不銹鋼、鈦、鐵、鉻鋼、鎳等。此外,可以具有適合黏貼樹脂薄膜例如熱塑性液晶聚合物薄膜的表面粗糙度。優選的是,即使環形帶11利用帶驅動機構12行進,表面也維持為平滑。此外,在樹脂薄膜51的熱處理中,樹脂薄膜51在加熱爐15中與環形帶11的熱膨脹相應地伸長。在該觀點上,構成環形帶11的金屬片可以具有適度的熱膨脹率。這樣,環形帶11所使用的材料可以考慮耐腐蝕性、耐久性、平滑性、熱處理所需要的熱膨脹率來選擇。環形帶11的寬度可以比黏貼的樹脂薄膜51的寬度寬。 〈Endless belt 11〉 The endless belt 11 is formed from sheet metal. Examples of the material of the metal sheet constituting the endless belt 11 include aluminum, copper, stainless steel, titanium, iron, chromium steel, nickel, and the like. In addition, it may have a surface roughness suitable for adhering a resin film such as a thermoplastic liquid crystal polymer film. It is preferable that even if the endless belt 11 travels using the belt driving mechanism 12, the surface remains smooth. Furthermore, in the heat treatment of the resin film 51 , the resin film 51 is elongated in accordance with the thermal expansion of the endless belt 11 in the heating furnace 15 . From this point of view, the metal sheet constituting the endless belt 11 can have a moderate thermal expansion coefficient. In this way, the material used for the endless belt 11 can be selected considering corrosion resistance, durability, smoothness, and thermal expansion rate required for heat treatment. The width of the endless belt 11 may be wider than the width of the adhered resin film 51 .
〈帶驅動機構12〉 帶驅動機構12是使環形帶11沿著預先確定的行進路徑行進的機構。在該實施方式中,帶驅動機構12包括供環形帶11沿著預先確定的行進路徑掛繞的多個帶輪12a~12d和驅動其中一個帶輪12b的馬達12f。此處,圖1中的箭頭C1~C3分別表示環形帶11的正旋轉的方向。例如,通過控制馬達12f的轉速來調整環形帶11的輸送速度。在該觀點上,馬達12f可以使用伺服馬達。 〈Belt drive mechanism 12〉 The belt drive mechanism 12 is a mechanism that causes the endless belt 11 to travel along a predetermined travel path. In this embodiment, the belt drive mechanism 12 includes a plurality of pulleys 12a to 12d around which the endless belt 11 is wound along a predetermined travel path, and a motor 12f that drives one of the pulleys 12b. Here, arrows C1 to C3 in FIG. 1 respectively indicate the forward rotation direction of the endless belt 11 . For example, the conveying speed of the endless belt 11 is adjusted by controlling the rotation speed of the motor 12f. From this point of view, a servo motor can be used for the motor 12f.
帶驅動機構12也可以包括用於維持環形帶11的張力的張緊器。張緊器的構造沒有特別限定,可以應用各種構造。在帶驅動機構12設置張緊器的位置也沒有特別的限定,只要是不妨礙樹脂薄膜51的熱處理的位置即可。例如,在環形帶11通過加熱爐的區域中,可以對環形帶11施加適度的張力。在該情況下,在環形帶11通過加熱爐的線路上,可以設有張緊器。此處,帶驅動機構12的帶輪12a~12d可以使用軸向的中央部適當地隆起的所謂的凸起型。通過使用凸起型的帶輪,能夠抑制環形帶11的偏移、曲折。The belt drive mechanism 12 may also include a tensioner for maintaining the tension of the endless belt 11 . The structure of the tensioner is not particularly limited, and various structures can be applied. The position where the tensioner is installed in the belt drive mechanism 12 is not particularly limited as long as it is a position that does not interfere with the heat treatment of the resin film 51 . For example, in the area where the endless belt 11 passes through the heating furnace, a moderate tension can be applied to the endless belt 11 . In this case, a tensioner may be provided on the route of the endless belt 11 through the heating furnace. Here, the pulleys 12 a to 12 d of the belt driving mechanism 12 may be of a so-called convex type in which the central portion in the axial direction is appropriately raised. By using a convex pulley, the endless belt 11 can be prevented from deflecting and meandering.
〈樹脂薄膜黏貼機14〉 樹脂薄膜黏貼機14配置於加熱爐15的上游側。樹脂薄膜黏貼機14是向環形帶11供給樹脂薄膜51並將樹脂薄膜51黏貼於環形帶11的裝置。在該實施方式中,樹脂薄膜黏貼機14具有供給樹脂薄膜51的供給部14a和將樹脂薄膜51按壓於環形帶11的黏貼部14b。 〈Resin film pasting machine 14〉 The resin film pasting machine 14 is arranged on the upstream side of the heating furnace 15 . The resin film pasting machine 14 is a device that supplies the resin film 51 to the endless belt 11 and adheres the resin film 51 to the endless belt 11 . In this embodiment, the resin film pasting machine 14 has a supply part 14a which supplies the resin film 51, and a pasting part 14b which presses the resin film 51 to the endless belt 11.
〈樹脂薄膜51〉 此處,被進行熱處理的樹脂薄膜51可以是熱塑性樹脂。在該實施方式中,被進行熱處理的樹脂薄膜51是熱塑性的液晶聚合物薄膜。液晶聚合物薄膜不特別限定於熱塑性液晶聚合物。液晶聚合物薄膜例如可以使用日本特開2005-103989號公報所公開的材料。樹脂薄膜51的種類、寬度、厚度可以根據各種用途、需求而確定。例如,熱塑性液晶聚合物薄膜的寬度例如是200mm、300mm、500mm等,熱塑性液晶聚合物薄膜的厚度是10μm~數十μm等,可以根據用途而適當地確定。 〈Resin film 51〉 Here, the heat-treated resin film 51 may be a thermoplastic resin. In this embodiment, the heat-treated resin film 51 is a thermoplastic liquid crystal polymer film. The liquid crystal polymer film is not particularly limited to thermoplastic liquid crystal polymer. For example, the liquid crystal polymer film disclosed in Japanese Patent Application Publication No. 2005-103989 can be used. The type, width, and thickness of the resin film 51 can be determined according to various uses and requirements. For example, the width of the thermoplastic liquid crystal polymer film is 200 mm, 300 mm, 500 mm, etc., and the thickness of the thermoplastic liquid crystal polymer film is 10 μm to several tens of μm, etc., and can be appropriately determined according to the application.
〈供給部14a〉 在該實施方式中,熱處理前的樹脂薄膜51以呈卷狀捲繞於捲繞軸51b的捲筒51a的狀態被準備。熱處理前的樹脂薄膜51預先成形為縱長的帶狀的薄膜。這樣的樹脂薄膜51例如是熱塑性樹脂,通過熔融並從預定形狀的模具擠出的擠出成形而成形。在供給部14a中,熱處理前的樹脂薄膜51從捲筒51a朝向環形帶11引出。 <Supply part 14a> In this embodiment, the resin film 51 before heat treatment is prepared in a state of being wound around the roll 51a of the winding shaft 51b. The resin film 51 before heat treatment is previously formed into a vertically elongated strip-shaped film. Such a resin film 51 is, for example, a thermoplastic resin, and is formed by extrusion molding in which the resin is melted and extruded from a die of a predetermined shape. In the supply part 14a, the resin film 51 before heat treatment is drawn out from the roll 51a toward the endless belt 11.
〈黏貼部14b〉 黏貼部14b是熱處理前的樹脂薄膜51黏貼於環形帶11的部位。黏貼部14b包括輥14b1和一對輥14b2。在該實施方式中,樹脂薄膜黏貼機14包括預熱裝置。此外,樹脂薄膜黏貼機14包括在環形帶11和樹脂薄膜51上重疊另一片52的機構14c。 〈Adhesive part 14b〉 The adhesive portion 14b is a portion where the resin film 51 before heat treatment is adhered to the endless belt 11. The sticking part 14b includes a roller 14b1 and a pair of rollers 14b2. In this embodiment, the resin film pasting machine 14 includes a preheating device. Furthermore, the resin film pasting machine 14 includes a mechanism 14 c for overlapping another piece 52 on the endless belt 11 and the resin film 51 .
輥14b1是引導從捲筒51a朝向環形帶11引出的熱處理前的樹脂薄膜51以使其重疊於環形帶11上的輥。熱處理前的樹脂薄膜51利用輥14b1重疊於環形帶11的表面上。之後,進給到一對輥14b2。The roller 14b1 is a roller that guides the resin film 51 before heat treatment drawn out from the roll 51a toward the endless belt 11 so that it may overlap the endless belt 11. The resin film 51 before heat treatment is overlapped on the surface of the endless belt 11 by the roller 14b1. After that, it is fed to a pair of rollers 14b2.
一對輥14b2是將熱處理前的樹脂薄膜51黏貼於環形帶11的構件。在該實施方式中,一對輥14b2包括預熱裝置。通過一對輥14b2包括預熱裝置,從而熱處理前的樹脂薄膜51的表面熔融,黏貼於環形帶11。預熱裝置例如可以加熱環形帶11。預熱裝置也可以由安裝於環形帶11側的輥14b2的電熱線構成。此外,也可以由在環形帶11側的輥14b2旋轉時在不與環形帶11接觸的位置對輥14b2施加熱的加熱器構成。此外,將熱處理前的樹脂薄膜51黏貼於環形帶11的構件在該實施方式中是輥形態,對輸送熱處理前的樹脂薄膜51的環形帶11以低摩擦連續地按壓。The pair of rollers 14b2 is a member that adheres the resin film 51 before heat treatment to the endless belt 11. In this embodiment, the pair of rollers 14b2 includes preheating means. The pair of rollers 14b2 includes a preheating device, so that the surface of the resin film 51 before heat treatment is melted and adhered to the endless belt 11. The preheating device can, for example, heat the endless belt 11 . The preheating device may be constituted by a heating wire attached to the roller 14b2 on the endless belt 11 side. In addition, when the roller 14b2 on the endless belt 11 side rotates, it may be comprised with the heater which applies heat to the roller 14b2 at the position which does not contact the endless belt 11. In addition, the member for bonding the resin film 51 before heat treatment to the endless belt 11 is in the form of a roller in this embodiment, and continuously presses the endless belt 11 conveying the resin film 51 before heat treatment with low friction.
〈重疊另一片52的機構14c〉 另外,在熱處理前的樹脂薄膜51重疊於環形帶11之後,若直接通過一對輥14b2之間,則有時樹脂薄膜51過度熔融等而緊貼於輥14b2。相對於此,在該實施方式中,設有重疊另一片52的機構14c。重疊另一片52的機構14c在熱處理前的樹脂薄膜51重疊於環形帶11之後、通過黏貼的一對輥14b2之前將另一片52供給到樹脂薄膜51上。由此,以片52重疊於樹脂薄膜51上的狀態被一對輥14b2夾持。由此,熱處理前的樹脂薄膜51不與一對輥14b2直接接觸。 〈Mechanism 14c that overlaps another piece of 52〉 In addition, if the resin film 51 before heat treatment is directly passed between the pair of rollers 14b2 after being overlapped on the endless belt 11, the resin film 51 may be excessively melted and tightly adhere to the rollers 14b2. On the other hand, in this embodiment, a mechanism 14c for overlapping the other piece 52 is provided. The mechanism 14c for overlapping the other sheet 52 supplies the other sheet 52 onto the resin film 51 after the resin film 51 before heat treatment is overlapped on the endless belt 11 and before passing through the pair of bonding rollers 14b2. Thereby, the sheet 52 is sandwiched between the pair of rollers 14b2 in a state overlapping the resin film 51. Thereby, the resin film 51 before heat treatment does not come into direct contact with the pair of rollers 14b2.
因此,熱處理前的樹脂薄膜51不易緊貼於輥14b2,此外,不易損傷樹脂薄膜51。在該觀點上,可以適當地選擇片52所使用的材料、片52的厚度等。片52例如可以使用聚醯亞胺薄膜。另外,對於作為緩衝材料的薄膜的另一片52,例示了聚醯亞胺薄膜,但只要是具有需要的耐熱性的薄膜,就可以代替聚醯亞胺薄膜。不過,當在熱處理前的樹脂薄膜51重疊於環形帶11之後直接通過一對輥14b2之間也不發生樹脂薄膜51緊貼於輥14b2這樣的現象的情況下,也可以沒有重疊另一片52的機構14c。Therefore, the resin film 51 before heat treatment is not easily in close contact with the roller 14b2, and the resin film 51 is not easily damaged. From this point of view, the material used for the sheet 52, the thickness of the sheet 52, and the like can be appropriately selected. For example, a polyimide film can be used as the sheet 52 . In addition, a polyimide film is exemplified as the other sheet 52 of the film as a cushioning material, but the polyimide film may be replaced by a film having required heat resistance. However, when the resin film 51 before heat treatment is overlapped on the endless belt 11 and passes directly between the pair of rollers 14b2 without the phenomenon that the resin film 51 is in close contact with the rollers 14b2, the other piece 52 does not need to be overlapped. Agency 14c.
例如,在本發明人獲得的見解中,在一對輥14b2均為金屬的情況下,可以在輥14b2和樹脂薄膜51之間夾持作為另一片52的薄膜。由此,樹脂薄膜51更均勻地層壓於環形帶11。並且,根據本發明人獲得的見解,通過將一對輥14b2中的一個輥14b2設為樹脂輥而將另一個輥14b2變為金屬,也能夠得到同樣的結果。在該情況下,也可以沒有重疊另一片52的機構14c。For example, in the knowledge obtained by the present inventors, when both of the pair of rollers 14b2 are made of metal, the film as the other sheet 52 can be sandwiched between the roller 14b2 and the resin film 51. Thereby, the resin film 51 is laminated|stacked on the endless belt 11 more uniformly. Furthermore, according to the findings obtained by the present inventors, the same result can be obtained by using one roller 14b2 of the pair of rollers 14b2 as a resin roller and the other roller 14b2 as a metal. In this case, the mechanism 14c for overlapping the other piece 52 does not need to be provided.
〈加熱爐15〉 加熱爐15以覆蓋環形帶11的行進路徑的局部的方式配置。在該實施方式中,帶輪12a~帶輪12b之間的行進路徑由較長的直線構成。加熱爐15在該直線部位以覆蓋環形帶11的方式具有通道狀的爐體15a。在加熱爐15中,在該爐體15a中設置有加熱器15b。 〈Heating furnace 15〉 The heating furnace 15 is arranged to cover part of the traveling path of the endless belt 11 . In this embodiment, the traveling path between the pulleys 12a to 12b is composed of a long straight line. The heating furnace 15 has a channel-shaped furnace body 15a in this linear portion so as to cover the endless belt 11. In the heating furnace 15, a heater 15b is provided in the furnace body 15a.
加熱器15b例如也可以是陶瓷加熱器、遠紅外線加熱器。此外,也可以是,加熱器15b包括送風機,向黏貼於環形帶11而輸送的樹脂薄膜51吹送熱風。此外,雖然省略圖示,但也可以在加熱爐15中設有氣體供給口、氣體排出口以調整內部空間的氣氛。例如,能夠在氮氣這樣的非活性氣體氣氛下對樹脂薄膜51進行熱處理。此外,也可以在加熱爐15的內部存在隔熱壁那樣的分隔件15c。通過對行進路徑以分隔加熱爐15的內部的空間的方式設置分隔件15c,能夠針對由分隔件劃分的每個空間調整溫度、氣氛。例如,能夠沿著行進路徑使加熱爐15的內部氣氛階段性地升溫或階段性地降溫。另外,加熱爐15的內部的溫度條件可以根據被進行熱處理的樹脂薄膜51的材料、輸送速度而適當地確定。The heater 15b may be a ceramic heater or a far-infrared heater, for example. In addition, the heater 15b may include an air blower and blow hot air to the resin film 51 attached to the endless belt 11 and conveyed. In addition, although illustration is omitted, the heating furnace 15 may be provided with a gas supply port and a gas discharge port to adjust the atmosphere of the internal space. For example, the resin film 51 can be heat-treated in an inert gas atmosphere such as nitrogen. In addition, a partition 15c such as a heat insulating wall may be provided inside the heating furnace 15. By providing the partition 15c on the traveling path so as to partition the space inside the heating furnace 15, the temperature and atmosphere can be adjusted for each space divided by the partition. For example, the temperature inside the heating furnace 15 can be increased or decreased in steps along the traveling path. In addition, the temperature conditions inside the heating furnace 15 can be appropriately determined depending on the material and conveying speed of the resin film 51 to be heat-treated.
環形帶11在加熱爐15中被加熱,根據環形帶11所使用的材料的熱膨脹率而伸長。在環形帶11伸長時,與之對應,黏貼於環形帶11的樹脂薄膜51伸長。通過樹脂薄膜51被加熱且適度地伸長,從而樹脂薄膜51的耐熱性提高。在該觀點上,環形帶11的熱膨脹率可以比熱處理前的樹脂薄膜51的熱膨脹率大。The endless belt 11 is heated in the heating furnace 15 and stretches according to the thermal expansion coefficient of the material used for the endless belt 11 . When the endless belt 11 stretches, the resin film 51 adhered to the endless belt 11 stretches accordingly. When the resin film 51 is heated and stretched appropriately, the heat resistance of the resin film 51 is improved. From this viewpoint, the thermal expansion coefficient of the endless belt 11 may be larger than the thermal expansion coefficient of the resin film 51 before heat treatment.
例如,在液晶聚合物薄膜的熱處理中,通過對液晶聚合物薄膜施加熱能,從而共聚的微細構造變化為更牢固的構造,薄膜的熱變形溫度變高。此外,通過使熱處理的溫度階段性地降溫,能夠階段性地提高液晶聚合物薄膜的熱變形溫度。樹脂薄膜熱處理裝置10能夠調整環形帶11的輸送速度、加熱爐15內的氣氛、溫度,能夠調整每個該氣氛的滯留時間等。由此,能夠將輸送的環形帶11、樹脂薄膜51調整為目標的溫度。並且,在樹脂薄膜熱處理裝置10中,除了對液晶聚合物薄膜施加熱能之外,液晶聚合物薄膜隨著環形帶11的熱膨脹而伸長。由此,能夠調整液晶聚合物薄膜的熱膨脹率。For example, in the heat treatment of a liquid crystal polymer film, thermal energy is applied to the liquid crystal polymer film, so that the copolymerized fine structure is changed into a stronger structure, and the heat deformation temperature of the film becomes higher. In addition, by lowering the temperature of the heat treatment step by step, the heat deformation temperature of the liquid crystal polymer film can be increased step by step. The resin film heat treatment apparatus 10 can adjust the conveyance speed of the endless belt 11, the atmosphere and temperature in the heating furnace 15, and can adjust the residence time for each atmosphere, etc. Thereby, the conveyed endless belt 11 and the resin film 51 can be adjusted to a target temperature. Furthermore, in the resin film heat treatment apparatus 10 , in addition to applying thermal energy to the liquid crystal polymer film, the liquid crystal polymer film stretches as the endless belt 11 thermally expands. Thereby, the thermal expansion coefficient of the liquid crystal polymer film can be adjusted.
液晶聚合物薄膜能夠謀求作為撓性的電子電路基板的利用。通過上述熱處理,液晶聚合物薄膜的耐熱性提高,並且能夠調整為液晶聚合物薄膜的熱膨脹率與由金屬箔形成的層疊體、安裝部件的熱膨脹率的差減小。由此,電子電路的可靠性提高。在成為熱處理的物件的樹脂薄膜51是液晶聚合物薄膜的情況下,可以在提高液晶聚合物薄膜的耐熱性的觀點、調整熱膨脹率的觀點上選擇環形帶11所使用的材料。在該觀點上,環形帶11例如優選不銹鋼或鋁的帶。The liquid crystal polymer film can be used as a flexible electronic circuit board. By the above-mentioned heat treatment, the heat resistance of the liquid crystal polymer film is improved, and the difference between the thermal expansion coefficient of the liquid crystal polymer film and the thermal expansion coefficient of the laminate made of metal foil and the mounting member can be reduced. As a result, the reliability of the electronic circuit is improved. When the resin film 51 to be heat-treated is a liquid crystal polymer film, the material used for the endless belt 11 can be selected from the viewpoint of improving the heat resistance of the liquid crystal polymer film and adjusting the thermal expansion coefficient. From this viewpoint, the endless belt 11 is preferably a stainless steel or aluminum belt, for example.
〈樹脂薄膜回收機16〉 樹脂薄膜回收機16是在加熱爐15的下游側從環形帶11剝離而回收樹脂薄膜51的裝置。樹脂薄膜回收機16包括一對輥16a、16b和捲繞輥16c。一對輥16a、16b是成為從環形帶11剝離樹脂薄膜51的基點的輥。捲繞輥16c是用於捲繞從環形帶11剝離的樹脂薄膜51的輥。樹脂薄膜51在通過一對輥16a、16b之後從環形帶11剝離,以捲繞於捲繞輥16c的狀態設置於樹脂薄膜回收機16。另外,在即使沒有環形帶11的下側的輥16b也能夠剝離的情況下,也可以沒有輥16b。樹脂薄膜回收機16與環形帶11的旋轉配合地使捲繞輥16c旋轉。在輥16c可以安裝有捲繞從環形帶11剝離的樹脂薄膜51的捲繞軸61。通過與環形帶11的行進配合地使捲繞輥16c旋轉,從而將樹脂薄膜51捲繞於捲繞軸61。 〈Resin film recycling machine 16〉 The resin film recovery machine 16 is a device that peels off the endless belt 11 on the downstream side of the heating furnace 15 and recovers the resin film 51 . The resin film recovery machine 16 includes a pair of rollers 16a, 16b and a winding roller 16c. The pair of rollers 16 a and 16 b serve as a base point for peeling the resin film 51 from the endless belt 11 . The winding roller 16 c is a roller for winding the resin film 51 peeled off from the endless belt 11 . The resin film 51 is peeled off from the endless belt 11 after passing through the pair of rollers 16a and 16b, and is set in the resin film recovery machine 16 in a state of being wound around the winding roller 16c. In addition, when the endless belt 11 can be peeled off even without the roller 16b on the lower side, the roller 16b may not be needed. The resin film recovery machine 16 rotates the winding roller 16c in conjunction with the rotation of the endless belt 11. The roller 16 c may be provided with a winding shaft 61 for winding the resin film 51 peeled off from the endless belt 11 . The resin film 51 is wound around the winding shaft 61 by rotating the winding roller 16c in conjunction with the movement of the endless belt 11 .
這樣,根據此處公開的樹脂薄膜熱處理裝置10,能夠在使環形帶11在樹脂薄膜黏貼機14、加熱爐15、樹脂薄膜回收機16依次循環的同時對樹脂薄膜51進行熱處理。在該情況下,能夠在使環形帶11循環的同時連續地對樹脂薄膜51進行熱處理。也可以是,在環形帶11的行進路徑中包括清掃部18,在回收樹脂薄膜51之後、黏貼樹脂薄膜51之前,該清掃部18清掃環形帶11的表面。清掃部18例如也可以將清潔器按壓於環形帶11的表面。In this manner, according to the resin film heat treatment apparatus 10 disclosed here, the resin film 51 can be heat treated while the endless belt 11 is sequentially circulated through the resin film pasting machine 14, the heating furnace 15, and the resin film recovery machine 16. In this case, the resin film 51 can be continuously heat-treated while circulating the endless belt 11 . You may include the cleaning part 18 in the traveling path of the endless belt 11, and the cleaning part 18 may clean the surface of the endless belt 11 after collecting the resin film 51 and before pasting the resin film 51. The cleaning part 18 may press a cleaner against the surface of the endless belt 11, for example.
作為清潔器,例如,也可以使用無紡布、海綿這樣的構件。此外,作為清潔器,也可以是輥狀的構件。作為清潔器,例如,可以使用株式會社RAYON工業製的清潔輥等。並且,也可以是,在環形帶11的行進路徑中包括設有檢查裝置的檢查部19,在回收樹脂薄膜51之後、黏貼樹脂薄膜51之前,該檢查裝置檢查環形帶11。As the cleaner, for example, a member such as a non-woven fabric or a sponge may be used. In addition, the cleaner may be a roller-shaped member. As the cleaner, for example, a cleaning roller manufactured by Rayon Industrial Co., Ltd. can be used. Moreover, the inspection part 19 provided with an inspection device may be included in the traveling path of the endless belt 11, and the inspection device may inspect the endless belt 11 after collecting the resin film 51 and before pasting the resin film 51.
檢查部19例如可以檢查環形帶11的平滑度。例如,也可以向行進中的環形帶11照射網狀的光,觀察光的照射方式,檢測環形帶11的平滑度的異常。在樹脂薄膜51使用不易剝離的材料的情況等下,也可以在環形帶11的行進路徑中設置有塗布裝置20,在回收樹脂薄膜51之後、黏貼樹脂薄膜51之前,該塗布裝置20塗布剝離劑。For example, the inspection unit 19 can inspect the smoothness of the endless belt 11 . For example, the traveling endless belt 11 may be irradiated with mesh-shaped light and the pattern of light irradiation may be observed to detect abnormalities in the smoothness of the endless belt 11 . When the resin film 51 is made of a material that is difficult to peel off, a coating device 20 may be provided in the traveling path of the endless belt 11 , and the coating device 20 may apply a release agent after the resin film 51 is collected and before the resin film 51 is pasted. .
根據該樹脂薄膜熱處理裝置10,環形帶11在樹脂薄膜黏貼機14、加熱爐15、樹脂薄膜回收機16依次循環。而且,在循環的環形帶11上,連續地進行樹脂薄膜51的熱處理。環形帶11循環,能夠長時間持續地使用。因此,樹脂薄膜51的熱處理的成本被抑制得較低。According to this resin film heat treatment apparatus 10, the endless belt 11 circulates sequentially through the resin film pasting machine 14, the heating furnace 15, and the resin film recovery machine 16. Furthermore, the heat treatment of the resin film 51 is continuously performed on the circulating endless belt 11 . The endless belt has 11 cycles and can be used continuously for a long time. Therefore, the cost of heat treatment of the resin film 51 is kept low.
因此,環形帶11可以具備需要的耐久性。在液晶聚合物薄膜的熱處理中,環形帶11可以在加熱爐15中通過熱膨脹而適度地伸長。在該觀點上,環形帶11所使用的材料例如優選不銹鋼。其中,在液晶聚合物薄膜的熱處理中,可以使用具有與此適合的熱膨脹率的不銹鋼。作為該不銹鋼,能夠舉出SUS304、SUS632J1等,但沒有特別限定。此外,環形帶11可以反復用於樹脂薄膜51的熱處理。因此,可以具有考慮到耐久性的需要的厚度。在該觀點上,環形帶11所使用的不銹鋼的厚度例如是0.3mm~1.0mm左右(例如,0.6mm等)。Therefore, the endless belt 11 can have the required durability. In the heat treatment of the liquid crystal polymer film, the endless belt 11 can be moderately elongated by thermal expansion in the heating furnace 15 . From this point of view, the material used for the endless belt 11 is preferably stainless steel, for example. Among them, stainless steel having a thermal expansion coefficient suitable for the heat treatment of the liquid crystal polymer film can be used. Examples of the stainless steel include SUS304, SUS632J1, etc., but are not particularly limited. Furthermore, the endless belt 11 can be repeatedly used for heat treatment of the resin film 51 . Therefore, it is possible to have a required thickness considering durability. From this point of view, the thickness of the stainless steel used for the endless belt 11 is, for example, about 0.3 mm to 1.0 mm (for example, 0.6 mm, etc.).
以上,說明了此處公開的樹脂薄膜熱處理裝置10。像上述那樣,樹脂薄膜熱處理裝置10具有:金屬製的環形帶11;帶驅動機構12,其使環形帶11沿著預先確定的行進路徑行進;以及加熱爐15,其以覆蓋環形帶11的行進路徑的局部的方式配置。環形帶11、帶驅動機構12、加熱爐15構成所謂的帶爐。The resin film heat treatment apparatus 10 disclosed here has been described above. As described above, the resin film heat treatment apparatus 10 includes the metal endless belt 11 , the belt drive mechanism 12 that makes the endless belt 11 travel along a predetermined travel path, and the heating furnace 15 that covers the travel of the endless belt 11 The path is configured in a local way. The endless belt 11, the belt drive mechanism 12, and the heating furnace 15 constitute a so-called belt furnace.
由樹脂薄膜熱處理裝置10具體化的樹脂薄膜的熱處理方法包含將樹脂薄膜51黏貼於環形帶11的步驟S1、熱處理步驟S2、從環形帶11剝離而回收樹脂薄膜51的步驟S3。The heat treatment method of the resin film implemented by the resin film heat treatment apparatus 10 includes step S1 of sticking the resin film 51 to the endless belt 11 , heat treatment step S2 , and step S3 of peeling off the endless belt 11 to recover the resin film 51 .
在將樹脂薄膜51黏貼於環形帶11的步驟S1中,在帶爐的加熱爐15的上游側,以重疊於環形帶11的方式供給樹脂薄膜51。然後,通過將樹脂薄膜51按壓於環形帶11而將樹脂薄膜51黏貼於環形帶11。 在熱處理步驟S2中,在加熱爐15中樹脂薄膜51與環形帶11熱膨脹相應地伸長且被加熱。 從環形帶11剝離而回收樹脂薄膜51的步驟S3在加熱爐15的下游側實施。 這樣,在此處公開的樹脂薄膜的熱處理方法中,能夠在使環形帶11在將樹脂薄膜51黏貼於環形帶11的步驟、熱處理步驟、回收的步驟循環的同時使黏貼於環形帶11的樹脂薄膜51通過加熱爐15而進行熱處理。 In the step S1 of attaching the resin film 51 to the endless belt 11 , the resin film 51 is supplied on the upstream side of the heating furnace 15 of the belt furnace so as to overlap the endless belt 11 . Then, the resin film 51 is pressed against the endless belt 11 to adhere the resin film 51 to the endless belt 11 . In the heat treatment step S2, the resin film 51 is elongated and heated in accordance with the thermal expansion of the endless belt 11 in the heating furnace 15. Step S3 of peeling off the endless belt 11 and recovering the resin film 51 is performed on the downstream side of the heating furnace 15 . In this way, in the heat treatment method of the resin film disclosed here, the resin adhered to the endless belt 11 can be recycled while the endless belt 11 is cycled through the steps of adhering the resin film 51 to the endless belt 11 , the heat treatment step, and the recovery step. The film 51 passes through the heating furnace 15 and undergoes heat treatment.
根據該樹脂薄膜的熱處理方法,在循環的環形帶11上,連續地進行樹脂薄膜51的熱處理。環形帶11循環,能夠長時間持續地使用。因此,樹脂薄膜51的熱處理的成本被抑制得較低。According to this resin film heat treatment method, the heat treatment of the resin film 51 is continuously performed on the circulating endless belt 11 . The endless belt has 11 cycles and can be used continuously for a long time. Therefore, the cost of heat treatment of the resin film 51 is kept low.
如圖1所示,熱處理前的樹脂薄膜51以捲繞於捲繞軸51b的狀態被準備,從捲繞軸51b引出,在加熱爐15的上游側,以重疊於環形帶11的方式供給樹脂薄膜51。因此,能夠對帶狀的樹脂薄膜51連續地進行熱處理。此外,在回收的步驟中,也可以是,如圖1所示,樹脂薄膜51以從環形帶11剝離而捲繞於捲繞軸61的方式構成。由此,熱處理後的樹脂薄膜51捲繞於捲繞軸61,因此回收的樹脂薄膜51的處理變得容易。該樹脂薄膜的熱處理方法可以適當地應用於熱塑性液晶聚合物薄膜的熱處理。此外,在該情況下,環形帶11可以適當地使用不銹鋼製。As shown in FIG. 1 , the resin film 51 before heat treatment is prepared in a state of being wound around the winding shaft 51 b, and is taken out from the winding shaft 51 b, and is supplied with the resin so as to overlap the endless belt 11 on the upstream side of the heating furnace 15 Film 51. Therefore, the strip-shaped resin film 51 can be continuously heat-treated. In addition, in the recycling step, as shown in FIG. 1 , the resin film 51 may be peeled off from the endless belt 11 and wound around the winding shaft 61 . Thereby, since the heat-treated resin film 51 is wound around the winding shaft 61, the processing of the recovered resin film 51 becomes easy. The heat treatment method of the resin film can be appropriately applied to the heat treatment of the thermoplastic liquid crystal polymer film. In this case, the endless belt 11 may be made of stainless steel as appropriate.
在將樹脂薄膜51黏貼於環形帶11的步驟S1中,也可以是,如圖1所示,以在重疊於環形帶11的樹脂薄膜51上重疊另一片52,經由該另一片52而樹脂薄膜51按壓於環形帶11的方式構成。由此,在將樹脂薄膜51黏貼於環形帶11時,樹脂薄膜51不易損傷。另一片52可以是聚醯亞胺薄膜。聚醯亞胺薄膜例如在成為熱處理的對象的樹脂薄膜51是液晶聚合物薄膜的情況下是優選的。In the step S1 of pasting the resin film 51 to the endless belt 11, as shown in FIG. 51 is pressed against the endless belt 11. Therefore, when the resin film 51 is adhered to the endless belt 11, the resin film 51 is less likely to be damaged. The other piece 52 may be a polyimide film. A polyimide film is preferable, for example, when the resin film 51 to be heat-treated is a liquid crystal polymer film.
另外,此處,在重疊於環形帶11的樹脂薄膜51上重疊另一片52,但只要沒有特別提及,就也可以沒有該處理。例如,在即使沒有該處理樹脂薄膜51也不易損傷的情況、在之後的熱處理中消除樹脂薄膜51的損傷這樣的情況、或者,即使因將樹脂薄膜51黏貼於環形帶11的步驟S1而對樹脂薄膜51造成一些損傷也沒有問題的情況等下,也可以不在重疊於環形帶11的樹脂薄膜51上重疊另一片52。In addition, here, another sheet 52 is overlapped on the resin film 51 overlapped on the endless belt 11, but this process does not need to be performed unless otherwise mentioned. For example, when the resin film 51 is not easily damaged even without this treatment, when the damage to the resin film 51 is eliminated by subsequent heat treatment, or when the resin film 51 is attached to the endless belt 11 in step S1, the resin film 51 is not easily damaged. If there is no problem even if the film 51 is slightly damaged, the other piece 52 may not be overlapped on the resin film 51 overlapped with the endless belt 11 .
對於樹脂薄膜51,例示了帶狀且以卷對卷的方式黏貼於環形帶11的形態。對於樹脂薄膜51而言,例如,也可以是,預先確定的大小的樹脂薄膜黏貼於帶狀的基材,按壓、轉印於環形帶11,導入到加熱爐。之後,也可以是,在剛剛離開加熱爐之後,從環形帶11剝離。在該情況下,也可以適當地停止環形帶11而剝離樹脂薄膜。在該情況下,也可以使刮刀沿著環形帶11連續地剝離樹脂薄膜。此外,也可以在使環形帶11旋轉的同時使樹脂薄膜轉印於其他基材。這樣,只要沒有特別提及,樹脂薄膜51就不限定於帶狀且以卷對卷的方式黏貼於環形帶11的形態。The resin film 51 is exemplified in a strip-shaped form and is adhered to the endless belt 11 in a roll-to-roll manner. For the resin film 51, for example, a resin film of a predetermined size may be adhered to a belt-shaped base material, pressed and transferred to the endless belt 11, and then introduced into a heating furnace. Thereafter, it may be peeled off from the endless belt 11 just after leaving the heating furnace. In this case, the endless belt 11 may be stopped appropriately and the resin film may be peeled off. In this case, the scraper may be used to continuously peel off the resin film along the endless belt 11 . In addition, the resin film may be transferred to another base material while the endless belt 11 is rotated. In this way, unless otherwise mentioned, the resin film 51 is not limited to the form of a belt and is adhered to the endless belt 11 in a roll-to-roll manner.
以上,進行了此處公開的發明的詳細的說明,但這些只是例示,不限定申請專利範圍。此外,此處的公開能夠進行各種變更,只要不產生特別的問題,就可以適當地省略或適當地組合各構成要素、此處提及的各處理。The invention disclosed here has been described in detail above, but these are only examples and do not limit the scope of the patent application. In addition, various changes can be made to the disclosure here, and each component and each process mentioned here can be appropriately omitted or appropriately combined as long as no particular problem arises.
此處的公開包含以下的項(item)。The disclosure here includes the following items.
項1: 一種樹脂薄膜熱處理裝置,其中, 該樹脂薄膜熱處理裝置包括: 環形帶,其由金屬片形成; 帶驅動機構,其使所述環形帶沿著預先確定的行進路徑行進; 加熱爐,其以覆蓋所述環形帶的行進路徑的局部的方式配置; 樹脂薄膜黏貼機,其在所述加熱爐的上游側,向所述環形帶供給樹脂薄膜,將所述樹脂薄膜黏貼於所述環形帶;以及 樹脂薄膜回收機,其在所述加熱爐的下游側,從所述環形帶剝離而回收樹脂薄膜。 Item 1: A resin film heat treatment device, wherein, The resin film heat treatment device includes: An endless belt formed from sheet metal; a belt drive mechanism that causes the endless belt to travel along a predetermined travel path; A heating furnace configured to cover part of the traveling path of the endless belt; A resin film pasting machine, which supplies a resin film to the endless belt on the upstream side of the heating furnace and adheres the resin film to the endless belt; and A resin film recovery machine is provided on the downstream side of the heating furnace, which peels off the endless belt and recovers the resin film.
項2: 根據項1所述的樹脂薄膜熱處理裝置,其中, 所述環形帶是不銹鋼製。 Item 2: The resin film heat treatment device according to item 1, wherein, The endless belt is made of stainless steel.
項3: 根據項1或2所述的樹脂薄膜熱處理裝置,其中, 所述樹脂薄膜是液晶聚合物薄膜。 Item 3: The resin film heat treatment device according to item 1 or 2, wherein, The resin film is a liquid crystal polymer film.
項4: 根據項1~3中任一項所述的樹脂薄膜熱處理裝置,其中, 所述樹脂薄膜黏貼機包括加熱所述環形帶的預熱裝置。 Item 4: The resin film heat treatment apparatus according to any one of items 1 to 3, wherein, The resin film pasting machine includes a preheating device for heating the endless belt.
項5: 根據項1~4中任一項所述的樹脂薄膜熱處理裝置,其中, 所述樹脂薄膜黏貼機包括在所述環形帶和所述樹脂薄膜上重疊另一片的機構。 Item 5: The resin film heat treatment apparatus according to any one of items 1 to 4, wherein: The resin film pasting machine includes a mechanism for overlapping another piece on the endless belt and the resin film.
項6: 根據項5所述的樹脂薄膜熱處理裝置,其中, 所述另一片是聚醯亞胺薄膜。 Item 6: The resin film heat treatment device according to item 5, wherein, The other piece is a polyimide film.
項7: 根據項1~6中任一項所述的樹脂薄膜熱處理裝置,其中, 在所述環形帶的行進路徑中設有清潔器,在回收所述樹脂薄膜之後、黏貼所述樹脂薄膜之前,該清潔器清掃所述環形帶的表面。 Item 7: The resin film heat treatment apparatus according to any one of items 1 to 6, wherein, A cleaner is provided in the traveling path of the endless belt, and the cleaner cleans the surface of the endless belt after recovering the resin film and before pasting the resin film.
項8: 根據項1~7中任一項所述的樹脂薄膜熱處理裝置,其中, 在所述環形帶的行進路徑設有檢查裝置,在回收所述樹脂薄膜之後、黏貼所述樹脂薄膜之前,該檢查裝置檢查所述環形帶。 Item 8: The resin film heat treatment device according to any one of items 1 to 7, wherein: An inspection device is provided along the traveling path of the endless belt, and the inspection device inspects the endless belt after recovering the resin film and before pasting the resin film.
項9: 根據項1~8中任一項所述的樹脂薄膜熱處理裝置,其中, 在所述環形帶的行進路徑中設有塗布裝置,在回收所述樹脂薄膜之後、黏貼所述樹脂薄膜之前,該塗布裝置在所述環形帶塗布剝離劑。 Item 9: The resin film heat treatment apparatus according to any one of items 1 to 8, wherein: A coating device is provided in the traveling path of the endless belt. After recovering the resin film and before pasting the resin film, the coating device applies a release agent to the endless belt.
項10: 一種樹脂薄膜的熱處理方法,其中, 該熱處理方法使用帶爐,該帶爐具有:金屬製的環形帶;帶驅動機構,其使所述環形帶沿著預先確定的行進路徑行進;以及加熱爐,其以覆蓋所述環形帶的行進路徑的局部的方式配置, 該熱處理方法包含以下的步驟: 在所述加熱爐的上游側,以重疊於所述環形帶的方式供給樹脂薄膜,將所述樹脂薄膜按壓於所述環形帶而將所述樹脂薄膜黏貼於所述環形帶; 熱處理步驟,在該步驟中,在所述加熱爐中樹脂薄膜與所述環形帶熱膨脹相應地伸長且被加熱;以及 在所述加熱爐的下游側,從所述環形帶剝離而回收樹脂薄膜, 在使所述環形帶在黏貼所述樹脂薄膜的步驟、所述熱處理步驟、所述回收的步驟循環的同時使黏貼於所述環形帶的所述樹脂薄膜通過所述加熱爐而進行熱處理。 Item 10: A heat treatment method for a resin film, wherein: This heat treatment method uses a belt furnace that has: a metal endless belt; a belt drive mechanism that makes the endless belt travel along a predetermined travel path; and a heating furnace that covers the travel of the endless belt. The path is configured in a local way, The heat treatment method includes the following steps: On the upstream side of the heating furnace, a resin film is supplied to overlap the endless belt, the resin film is pressed against the endless belt, and the resin film is adhered to the endless belt; a heat treatment step in which the resin film is elongated and heated in response to thermal expansion of the endless belt in the heating furnace; and On the downstream side of the heating furnace, the resin film is peeled off from the endless belt and recovered, While the endless belt is cycled through the steps of attaching the resin film, the heat treatment step, and the recycling step, the resin film attached to the endless belt is passed through the heating furnace to undergo heat treatment.
項11: 根據項10所述的熱處理方法,其中, 熱處理前的樹脂薄膜以捲繞於捲繞軸的狀態被準備,從所述捲繞軸引出,在所述加熱爐的上游側,以重疊於所述環形帶的方式供給樹脂薄膜。 Item 11: The heat treatment method according to item 10, wherein, The resin film before heat treatment is prepared in a state of being wound around a winding shaft, is pulled out from the winding shaft, and is supplied to the upstream side of the heating furnace so as to overlap the endless belt.
項12: 根據項10或11所述的熱處理方法,其中, 在所述回收的步驟中,所述樹脂薄膜從所述環形帶剝離而捲繞於捲繞軸。 Item 12: The heat treatment method according to item 10 or 11, wherein, In the step of recovering, the resin film is peeled off from the endless belt and wound around a winding shaft.
項13: 根據項10~12中任一項所述的熱處理方法,其中, 所述樹脂薄膜是熱塑性液晶聚合物薄膜。 Item 13: The heat treatment method according to any one of items 10 to 12, wherein, The resin film is a thermoplastic liquid crystal polymer film.
項14: 根據項10~13中任一項所述的熱處理方法,其中, 所述環形帶是不銹鋼製。 Item 14: The heat treatment method according to any one of items 10 to 13, wherein, The endless belt is made of stainless steel.
項15: 根據項10~14中任一項所述的熱處理方法,其中, 在將所述樹脂薄膜黏貼於所述環形帶的步驟中,在重疊於所述環形帶的所述樹脂薄膜上重疊另一片,經由該另一片而所述樹脂薄膜按壓於所述環形帶。 Item 15: The heat treatment method according to any one of items 10 to 14, wherein, In the step of adhering the resin film to the endless belt, another piece is overlapped on the resin film overlapping the endless belt, and the resin film is pressed against the endless belt through the other piece.
項16: 根據項15所述的熱處理方法,其中, 所述另一片是聚醯亞胺薄膜。 Item 16: The heat treatment method according to item 15, wherein, The other piece is a polyimide film.
10:樹脂薄膜熱處理裝置 11:環形帶 12:帶驅動機構 12a~12d:帶輪 12f:馬達 14:樹脂薄膜黏貼機 14a:供給部 14b:黏貼部 14b1:輥 14b2:輥 14c:重疊另一片52的機構 15:加熱爐 15a:爐體 15b:加熱器 15c:分隔件 16:樹脂薄膜回收機 16a、16b:輥 16c:輥 18:清掃部 19:檢查部 20:塗布裝置 51:樹脂薄膜 51a:捲筒 51b:捲繞軸 52:片 61:捲繞軸 C1~C3:箭頭 S1~S3:步驟 10:Resin film heat treatment device 11: Ring belt 12:With drive mechanism 12a~12d: pulley 12f: motor 14: Resin film pasting machine 14a: Supply Department 14b: Pasting part 14b1:Roller 14b2:Roller 14c: Overlap another piece of 52 body 15:Heating furnace 15a: Furnace body 15b: heater 15c: Divider 16:Resin film recycling machine 16a, 16b: roller 16c:Roller 18:Cleaning Department 19:Inspection Department 20: Coating device 51:Resin film 51a:Reel 51b: Winding shaft 52:piece 61: Winding shaft C1~C3: arrow S1~S3: steps
圖1是示意性地表示樹脂薄膜熱處理裝置10的側視圖。FIG. 1 is a side view schematically showing the resin film heat treatment apparatus 10 .
10:樹脂薄膜熱處理裝置 10:Resin film heat treatment device
11:環形帶 11: Ring belt
12:帶驅動機構 12:With drive mechanism
12a~12d:帶輪 12a~12d: pulley
12f:馬達 12f: motor
14:樹脂薄膜黏貼機 14: Resin film pasting machine
14a:供給部 14a: Supply Department
14b:黏貼部 14b: Pasting part
14b1:輥 14b1:Roller
14b2:輥 14b2:Roller
14c:重疊另一片52的機構 14c: Overlap another piece of 52 body
15:加熱爐 15:Heating furnace
15a:爐體 15a: Furnace body
15b:加熱器 15b: heater
15c:分隔件 15c: Divider
16:樹脂薄膜回收機 16:Resin film recycling machine
16a、16b:輥 16a, 16b: roller
16c:輥 16c:Roller
18:清掃部 18:Cleaning Department
19:檢查部 19:Inspection Department
20:塗布裝置 20: Coating device
51:樹脂薄膜 51:Resin film
51a:捲筒 51a:Reel
51b:捲繞軸 51b: Winding shaft
52:片 52:piece
61:捲繞軸 61: Winding shaft
C1~C3:箭頭 C1~C3: arrow
S1~S3:步驟 S1~S3: steps
Claims (16)
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JP2022040032A JP7121212B1 (en) | 2022-03-15 | 2022-03-15 | RESIN FILM HEAT TREATMENT APPARATUS AND RESIN FILM HEAT TREATMENT METHOD |
JP2022-040032 | 2022-03-15 |
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TW202337680A true TW202337680A (en) | 2023-10-01 |
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TW111139236A TW202337680A (en) | 2022-03-15 | 2022-10-17 | Resin film heat treatment device and resin film heat treatment method capable of achieving cost reduction of heat treatment of a resin film |
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JP (1) | JP7121212B1 (en) |
KR (1) | KR20230134967A (en) |
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JPS5091322A (en) * | 1973-12-12 | 1975-07-22 | ||
US5529740A (en) | 1994-09-16 | 1996-06-25 | Jester; Randy D. | Process for treating liquid crystal polymer film |
WO2004078450A1 (en) | 2003-03-04 | 2004-09-16 | Mitsubishi Rayon Co., Ltd. | Heat treating apparatus and heat treating method for sheet-like article |
JP3968068B2 (en) | 2003-09-30 | 2007-08-29 | 株式会社クラレ | Method for producing liquid crystal polymer film |
JP5057890B2 (en) | 2007-08-29 | 2012-10-24 | 三菱レイヨン株式会社 | Curling correction method for thermoplastic resin strips |
JP6463931B2 (en) | 2014-09-10 | 2019-02-06 | 東京応化工業株式会社 | Baking apparatus, baking method, manufacturing system, and manufacturing method |
CN112313057A (en) | 2018-07-10 | 2021-02-02 | 电化株式会社 | Thermoplastic liquid crystal polymer film, method for producing same, and flexible copper-clad laminate |
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CN116766638A (en) | 2023-09-19 |
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