TW202332513A - Carrier with vertical grid for supporting substrates in coater - Google Patents

Abstract

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

Description

Carrier with vertical grid for supporting substrates in coating machines

Electrochromic devices can be formed on substrates in various ways. Typically, the substrate is substantially transparent and flat, and may be made of glass, plastic, or similar materials. To form an electrochromic device, a substrate is coated with various material layers, such as a transparent conductive layer, a cathodically colored electrochromic layer, and an anodically colored counter electrode layer. Additional layers may be provided as desired and may include, but are not limited to, ion conductor layers, defect mitigating insulating layers, anti-reflective layers, protective oxide or nitride layers, and the like. One or more of these layers may be formed in a coater such as a sputter coater. In some cases, all such layers can be formed in a coater. A carrier is used to support the substrate as it is processed in the coater. The carrier can support a single substrate or multiple substrates.

Various embodiments herein relate to a carrier for holding a substrate in a substantially vertical orientation as the substrate passes through a coater. The coater provides a coating on at least one front surface of the substrate. In many cases, the coating is an electrochromic device.

In one aspect of the embodiments herein, a carrier is provided for holding at least one substrate in a substantially vertical orientation as the substrate passes through a coater at which A coating is provided on at least one front surface of the at least one substrate, and the carrier includes: a bottom parting rod; a top parting rod; a plurality of vertical support rods, each of the vertical support rods having a structure allowing contact with the top part A length of joint between the connecting rod and the bottom connecting rod, wherein the plurality of vertical supporting rods includes at least one leftmost and one rightmost vertical supporting rod, and wherein the plurality of vertical supporting rods are connected to the bottom and a combination of top portioning bars defining one or more apertures; and a plurality of attachments for engaging said bottom portioning bars and said top portioning bars to permit one of said plurality of vertical support bars to At least one moves horizontally along the bottom and top splitting bars.

In certain embodiments, the carrier may further include a plurality of fasteners for fastening the ends of the base plate to the vertical support rods, wherein each vertical support rod has a plurality of fastener attachment locations for attachment to the plurality of fasteners at multiple vertical positions. In these or other embodiments, each vertical support rod may engage the substrate along a flat surface of the vertical support rod. In some embodiments, each fastener may include at least one pin or staple. In some such cases, each fastener may include at least two pins or tacks. In these or other embodiments, the plurality of fastener attachment locations may include a plurality of slots, holes, grooves, or other openings in the vertical support rod.

In some embodiments, a horizontal dimension of the at least one pore can be between about 50 inches and 200 inches. In these or other embodiments, a vertical dimension of the pores may be between about 50 inches and 150 inches.

A variety of materials can be used. In some cases, the substrate may include glass or plastic. In these or other embodiments, the substrate may be a window to be coated using an electrochromic device. In these or other embodiments, the plurality of attachments may be configured to move to accommodate thermal expansion of the substrate. In these or other embodiments, at least one of the attachments may include a spring that accommodates the thermal expansion of the substrate. In various embodiments, the bottom tap bar and/or the top tap bar can comprise metal. In these or other embodiments, the plurality of vertical support rods may comprise metal.

Several additional features are available in some cases. For example, the carrier may further comprise a transport mechanism for moving the carrier through the coater. In these or other embodiments, the carrier may include a shield configured to protect at least a portion of the carrier during coating. In these or other embodiments, the carrier may be configured to allow the substrates to be stacked in the carrier in a manner that allows substrates of different widths to be stacked vertically on top of each other. In these or other embodiments, the plurality of attachments may be configured to limit movement of the plurality of vertical support rods in a direction orthogonal to a plane defined by a vertical and a horizontal direction of the carrier .

In another aspect of embodiments herein, a carrier is provided for retaining a plurality of substrates in a substantially vertical orientation as the substrates pass through a coater. A coating is provided on at least one front surface of the plurality of substrates, and the carrier includes: a frame having a hole, the hole having a horizontal dimension and a vertical dimension; a bottom connecting rod attached to the frame and extending horizontally along a bottom portion of the aperture; a top connecting rod attached to the frame and extending horizontally along a top portion of the aperture; a plurality of vertical support rods , each having a length that (i) permits engagement with both the top portion and the bottom portion while extending vertically across the aperture, and (ii) is adapted to engage with the bottom portion and at least one of the top staging rods movably engages a movable attachment to permit horizontal movement of the vertical support rod within the aperture; and a plurality of fasteners for attaching the base plate The edges are fastened to the vertical support rods, wherein each vertical support rod has a plurality of fastener attachment locations for attachment to the fastener at a plurality of vertical positions.

In certain embodiments, the fastener may be a pin or staple. In these or other embodiments, the plurality of fastener attachment locations may include a plurality of slots, holes, grooves, or other openings in the vertical support rod. In these or other embodiments, the horizontal dimension of the pores may be between approximately 50 inches and 200 inches. In these or other embodiments, the vertical dimension of the pores may be between approximately 50 inches and 150 inches. In some cases, the movable attachment may include a track, channel, or groove.

A variety of different materials can be used. In some embodiments, the substrate may be glass or plastic. In these or other embodiments, the substrate may be a window for coating using an electrochromic device. In these or other embodiments, the frame may comprise metal. In these or other embodiments, the bottom and/or top portioning bars may include a material that accommodates thermal expansion properties of the substrate. In these or other embodiments, the bottom and/or top portioning bars may comprise metal. In these or other embodiments, the vertical support rods may comprise metal.

Several additional features may be provided in various implementations. For example, the carrier may further include a pivot peg attached to the top split rod. In these or other embodiments, the carrier may further include a transport mechanism for moving the carrier through the coater. In these or other embodiments, the carrier may further include a shield configured to protect at least a portion of the frame during coating.

In another aspect of embodiments herein, a carrier is provided for retaining a plurality of substrates in a substantially vertical orientation as the substrates pass through a coater. A coating is provided on at least one front surface of the plurality of substrates, and the carrier includes: a frame having a hole, the hole having a horizontal dimension and a vertical dimension; a bottom connecting rod attached to the frame and extending horizontally along a bottom portion of the aperture; a top connecting rod attached to the frame and extending horizontally along a top portion of the aperture; a plurality of vertical support rods , each of which (i) has a length permitting engagement with both the top tie rod and the bottom tie rod while extending vertically across the aperture, and (ii) is positioned on the substrate during coating rear, such that the rear surface of the base plate is positioned between the front surface of the base plate and the vertical support rod; and a plurality of fasteners for fastening the edge of the base plate to the vertical support rod , wherein each vertical support rod has a plurality of fastener attachment locations for attachment to the fastener at a plurality of vertical positions, and wherein the substrates are stackable in the carrier, one of the stacks This approach allows substrates of different widths to be stacked vertically on top of each other in the apertures.

In some such embodiments, the fastener may be a pin or nail. In these or other embodiments, the plurality of fastener attachment locations may include a plurality of slots, holes, grooves, or other openings in the vertical support rod. In these or other embodiments, the horizontal dimension of the pores may be between approximately 50 inches and 200 inches. In these or other embodiments, the vertical dimension of the pores may be between approximately 50 inches and 150 inches. In some cases, the movable attachment may include a track, channel, or groove.

In some cases, the substrate may be glass or plastic. In these or other embodiments, the substrate may be a window for coating using an electrochromic device. In these or other embodiments, the frame may comprise metal. In these or other embodiments, the bottom and/or top portioning bars may include a material that accommodates thermal expansion properties of the substrate. In these or other cases, the bottom and/or top portioning bars may comprise metal. In these or other cases, the vertical support rods may comprise metal.

In certain embodiments, the carrier may further include a pivot pin attached to the top split rod. In these or other embodiments, the carrier may further include a transport mechanism for moving the carrier through the coater. In these or other embodiments, the carrier may further include a shield configured to protect at least a portion of the frame during coating.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the presented embodiments. The disclosed embodiments may be practiced without some or all of these specific details. In other instances, well-known procedural operations have not been described in detail so as not to unnecessarily obscure the disclosed embodiments. Although the disclosed embodiments will be described in connection with specific embodiments, it should be understood that no limitation is intended to the disclosed embodiments.

One technique for forming electrochromic devices on substrates involves coating the substrate with layers of various materials. In many cases, the coating is formed in a coater using sputtering, physical vapor deposition (PVD), or other methods. A coater may contain several different stations, each station configured to deposit one or more layers. A carrier may be used to support one or more substrates as they translate through the coater. While certain embodiments herein relate to sputtering apparatus configured to remain as one or more substrates are translated through, for example, a sputtering apparatus used to sputter deposit one or more coatings on the substrates The carrier of the substrate, but the embodiment is not so limited. In general, the embodiments described herein may be used to secure any substantially flat substrate as it passes through processing equipment. Processing equipment is typically used to deposit one or more films (in some cases, the films form electrochromic devices), but in some cases, processing equipment can be used for etching, cleaning, particle removal, polishing, photolithography etc. Such implementations are within the scope of the disclosed embodiments. In some cases, the processing device is formed as an all-solid state and inorganic electrochromic device. Some examples of electrochromic devices can be found in U.S. Patent No. 8,300,298, which is incorporated herein by reference in its entirety.

The following terms are defined for clarity. As used herein, the term "substrate" refers to a flat or substantially flat object loaded onto a carrier and processed in processing equipment. In many cases, the substrate is glass, but in some cases plastic and other materials may be used. Typically, the dimensions of the substrate are between about 12 inches and 120 inches on each side (eg, width and height), although this is not intended to be limiting. The substrate may ultimately be formed into an electrochromic window or other product with an electrochromic device thereon, or the substrate may be a filler substrate that is not manufactured into a final product. As used herein, the term "carrier" means a structure configured to support one or more substrates as they pass through processing equipment. The carrier may be constructed from various pieces that may be permanently or releasably attached to each other. In many cases, the carrier includes a frame and voids within the frame. As used herein, the term "pore" refers to the area in a carrier where a substrate is loaded for processing. In many cases, the pores are essentially open (eg, they do not contain a solid backing). As used herein, the terms "vertical grid base" and "tap rod" are used interchangeably to refer to a horizontally oriented structure connected to a horizontal portion of a frame for fitting vertical support rods within apertures. As used herein, the term "vertical support rod" refers to a vertical rod extending between the bottom and top of a void to support a substrate in the void. Typically, a vertical support rod is assembled to the tap rod.

When used with reference to a tap bar, the term "slot" refers to an opening, hole, or recess in the tap bar into which a portion of a vertical support rod fits, or into which another piece of hardware may fit. into the slot to secure the vertical support rod to the tap rod. When used with reference to a vertical support bar, the term "slot" refers to an opening, hole, or recess in the vertical support bar into which a pin may fit to secure the base plate against the vertical support bar. When used with reference to a vertical support bar or slot, the term "pin" refers to a piece of hardware that fits within the slot to secure the base plate against the vertical support bar. When used with reference to vertical support bars or adjacent substrates, the term "clip" designates a piece of hardware positioned between two adjacent substrates to maintain separation and coplanarity between adjacent substrates.

As used herein, the term "pivot pin" refers to a portion that is fixedly or releasably attached to a carrier (e.g., typically a top portion bar or frame) and engages the top edge of a substrate when the substrate is loaded in the carrier pivot structure. In many cases, the pivot pin includes a first end that attaches to the top split rod or frame, and a second end that engages the top edge of the base plate. Pivot pins secure the edges of the substrate while allowing some movement of the substrate due to thermal expansion.

In many cases herein, the substrates are oriented vertically as they are loaded onto the carrier and passed through the processing equipment. When used herein with respect to the dimensions of the substrate, the "width" of the substrate refers to the horizontal dimension of the substrate. When used herein with respect to the dimensions of the substrate, the "height" of the substrate refers to the vertical dimension of the substrate. When used herein with respect to the dimensions of the substrate, the "thickness" of the substrate refers to the distance between two coplanar faces of the substrate. Typically, the thickness of the substrate is on the order of several millimeters. Similarly, the "width" of an aperture, frame, etc. refers to the horizontal dimension of the associated element, while the "height" of an aperture, frame, etc. refers to the vertical dimension of the associated element.

As used herein, the "front" side of the substrate refers to the processed side of the substrate. This side is the side of the substrate that is acted upon in the processing equipment. In the case where the processing equipment is a coater, the front side of the substrate is the side on which the film is deposited. The "rear" side of the substrate is the side of the substrate opposite the front side.

When making electrochromic devices, carriers are often used to immobilize one or more substrates as they pass through a coater. The substrates are secured to the carrier in such a manner that the treated surface of each substrate is substantially exposed for coating. Typically, the substrate passes through the coater in a vertical orientation. However, horizontal processing can also be used.

In various cases, the substrate can be glass, plastic, etc. The substrate may have one or more films already formed thereon. Substrates are typically flat and come in a variety of sizes and shapes. Most commonly, the substrate is rectangular or square, but other shapes may be used, such as triangles, trapezoids, other polygons, circles, semicircles, ovals, etc. The smaller substrate may be approximately 14 inches by 14 inches in size, while the larger substrate may be approximately 72 inches by 120 inches in size. Any substrate size between these examples is also possible. The stated substrate sizes are suitable for many applications and coaters, but in some cases smaller and/or larger substrates may be used. Typically, the dimensions of the substrate are accurate to within about 1/8 inch (eg, within about 3 mm or 2 mm or 1 mm).

The substrate is typically loaded onto a carrier before passing it through the coater. In many cases, multiple substrates of complementary shapes and sizes are loaded onto a single carrier. In some cases, the support includes a complete or partial frame, and pores at least partially defined by the frame. The voids are the areas of the carrier where the substrate resides when it is supported in the carrier. In many cases, the pores may be substantially open (eg, the support may lack an intact/solid backing in the pore area). Various horizontal and/or vertical support rods may be provided within the frame, fully or partially across the aperture. The base plate can be fixed against these horizontal and/or vertical support rods.

Figures 1A and 1B depict a carrier 100 that can be configured to include an adjustable grid array. 1A shows various aspects of the carrier 100 before the substrate is loaded on the carrier 100, and FIG. 1B shows the carrier 100 after several substrates 102 are loaded on the carrier 100 at the same time. In this example, carrier 100 includes vertical frame members 110, and horizontal frame members 105 and 115. Horizontal frame members 105 and 115 are welded or otherwise attached together via short struts 135 . The vertical frame member 110 cooperates (eg, bolts) with the horizontal frame members 105 and 115 to form the frame of the carrier 100 . The guide plates 120, rails 125 and overlapping sections 130 are attached (eg, bolted) to the frame of the carrier 100, as shown in Figure 1A. Apertures 101 are defined within the frame (eg, within the vertical frame member 110 and the horizontal frame member 105). Tap rod 140 may be configured along the top and bottom inner edges of aperture 101 . In some cases, tap bars 140 may be referred to as top tap bars and bottom tap bars, or as vertical grid seats. The tap bar 140 shown in Figure IA may include a plurality of studs 145 for attaching the vertical support bar 155 shown in Figure IB. The stud 145 can slidably engage the body of the tap bar 140 such that when the vertical support bar 155 is assembled to the stud 145, the assembly can move laterally along the tap bar 140 to accommodate thermal expansion of the substrate. In some cases, clamping blocks may be used in place of studs 145.

As shown in FIG. 1B , the adjustable grid array includes a number of horizontal support bars 160 , and vertical support bars 155 . The arrows surrounding certain horizontal support rods 160 and vertical support rods 155 indicate that the support rods have adjustable positions so that substrates of various sizes can be accommodated within the carrier 100 . The shield 150 may cover portions of the carrier 100 (eg, front and/or rear portions) during sputtering.

The vertical support rods 155 are assembled to the horizontal frame members using tap rods. The tap rod may comprise an alloy that expands and contracts during processing to approximate the thermal expansion and contraction of the substrate mounted on the carrier. Horizontal support rod 160 may be assembled to vertical support rod 155 via any available mechanism. In some cases, horizontal support rods 160 are slidably engaged with vertical support rods 155 . The horizontal support rod 160 may be telescopic so that its length is adjustable. The adjustable length accommodates thermal expansion and also allows each horizontal support bar 160 to be used in various manufacturing processes involving different specific substrate sizes. In many cases, vertical support rods 155 and horizontal support rods 160 are positioned at least partially in front of the substrate (eg, on the processing surface of the substrate). In many cases, this means that at least a portion of the vertical support rods 155 and horizontal support rods 160 are positioned between the substrate and the sputter target used to deposit material on the processing surface of the substrate. In the example of FIG. 1B , each substrate 102 is supported at its periphery by a combination of vertical support rods 155 and horizontal support rods 160 . The process of loading the substrate 102 onto the carrier 100 is further described below.

An example carrier consistent with the carrier 100 depicted in Figures 1A and 1B is further described in a U.S. patent application filed on November 23, 2015 titled "GLASS PALLET FOR SPUTTERING SYSTEMS" No. 14/893,502, the entire text of said patent application is incorporated herein by reference.

Because substrates come in many sizes and shapes, it is common to load a carrier with substrates of non-uniform size and/or shape, as shown in Figure 1B. In many cases, the size and shape of the substrate is selected to meet a specific customer order, which requires specific dimensions. Due to size and shape mismatch, it may be difficult to completely fill the pores of the carrier. A filler substrate (eg, in many cases a filler glass) is often used to fill the extra space in the pores not occupied by the substrate used for production. Filler substrates are sacrificial substrates that are not further processed or sold (but they can be reused). Typically, only about 60 to 70% of the aperture area is occupied by the substrate from which the electrochromic window is to be made, with the remaining area being occupied by the filler substrate.

While many different techniques can be used to position the substrate and filler substrate within the pores of the carrier, some techniques introduce certain production line issues. For example, in one approach consistent with the carrier of Figures 1A and 1B, the apertures of the carrier are provided with a grid of vertical and horizontal support rods positioned adapted to hold individual substrates in a vertical position for vertical conveyed through the coating machine. The top region of the carrier contains tap bars called top tap bars, and the lower region of the carrier contains tap bars called bottom tap bars. Attach both the top and bottom tie bars to the rest of the carrier structure (eg to a frame member). Rigid vertical support poles are attached to the top and bottom junction poles, and telescopic horizontal support poles are attached to the vertical support poles.

When a set of substrates is ready for processing (such as coating), the installer places vertical support rods within the apertures to accommodate the width of the different substrates. Substrates of the same width are stacked vertically on top of each other, for example, as shown in Figure IB. Bolt or otherwise securely attach vertical support poles to the top and bottom junction poles. The telescoping horizontal support rods are then compressed or extended to an appropriate length (eg, to accommodate the width of the existing substrates) and positioned horizontally between the vertical support rods and between adjacent substrates. Position the vertical and horizontal support rods on the processing surface of the substrate. In other words, position the vertical and horizontal support rods between the substrate and the cathode/sputter target of the coater. Thus, the vertical and horizontal support rods shield the peripheral area of the substrate during coating. In many cases, this masking is not desired, and it is preferable to deposit the film over the entire processed surface of the substrate.

In some designs, the horizontal support rods are relatively thin and bendable, and can be easily bent out of their desired shape. For example, thermal expansion (which can be caused by passing through a coater) can cause the horizontal support rods to bow outward, away from the substrate. This bowing is undesirable as it may cause the horizontal support bar to become stuck or embedded in the edge of the coater. As a result, the horizontal support rod may become displaced or cracked, or it may cause another part of the equipment, such as the guard, to become displaced or cracked. These effects may substantially interrupt the production process and in some cases may cause mechanical interruptions, electrical short circuits and undesirable downtime. Additionally, in some cases, deformed horizontal support rods may cause the base plate to crack, thereby wasting valuable production material.

Another problem introduced by the horizontal support rods, especially when the horizontal support rods are telescopic, is that such support rods can generate metal particles that fall onto the surface of the substrate and contaminate the surface of the substrate. As the horizontal support rods move/the telescopic pieces move against each other, metal particles are produced. Because metal particles conduct electricity, they can introduce drawbacks to electrochromic devices being formed on substrates.

Another problem with certain carriers, such as those shown in Figures 1A and 1B, is that the substrates stacked vertically on top of each other must have the same width. This is because vertical support bars separate entire rows of substrates, and the substrates in each row have the same width. In other words, if the bottom piece in a portion of the carrier is loaded with a 20-inch wide substrate, then all substrates loaded above the substrate must also be 20-inch wide. If a substrate has a specific width and there are no other substrates of the same width ready for processing, the rows in which the substrates are positioned within the apertures of the carrier must be filled with filler substrates. In practice, this means that a large amount of filler substrate is used and a large amount of film material is wasted deposited on the filler substrate. The requirement that all substrates in a vertical row of carriers have the same width is called "z-stacking."

Another problem with carriers such as the carrier shown in Figures 1A and 1B is the need to maintain many different pieces of horizontal support rods. Even though the horizontal support rods may be telescopic to accommodate different substrate widths, such telescoping may only accommodate a certain degree of width variation. Because of the wide range of base plate widths, many different horizontal support bars must be maintained. Considerable storage area and organization is required to store all the different horizontal support rods.

Various embodiments herein address one or more of the problems described above. Figures 2A-2P illustrate different aspects of a carrier 200 according to certain embodiments herein. In this embodiment, no horizontal support rods are used between vertically adjacent substrates 202 , and a substantial portion of each vertical support rod is positioned behind the plane behind the substrates 202 . Both of these features are in contrast to the embodiment of Figures 1A and 1B.

As shown in Figure 2A, carrier 200 includes many features similar to carrier 100 of Figures 1A and 1B. For example, carrier 200 includes horizontal frame members 205 and 215, and vertical frame member 210. Horizontal frame members 205 and 215 are connected (eg, welded) together via short struts 235 . Horizontal frame members 205 and 215 may be connected to vertical frame member 210 via any available member, and in some cases, are bolted together. The guide plate 220 may be disposed atop the upper horizontal frame member 215 and the guide rail 225 may be disposed along the bottom edge of the lower horizontal frame member 215 (eg, bolted, welded, etc.).

Tap bars 240 (sometimes referred to as upper and lower tap bars or vertical grid seats) fit to the horizontal frame member 205 . The tap bar 240 may float or otherwise move to account for non-uniform thermal expansion between the tap bar 240 and the remainder of the carrier 200 such as the horizontal frame member 205 . In some embodiments, tap bar 240 may be made from a material with a coefficient of thermal expansion that matches the different components of substrate 202 or carrier 200 .

In each case, the tap bar 240 includes a guide or track that projects and allows the vertical support bar 255 to slide along the tap bar 240 via a groove. In these or other cases, the tap bar 240 may include a channel in which the vertical support bar 255 is located and may move/slide within the channel without exiting the channel. Notably, the tracks, grooves and/or channels in tap bar 240 allow vertical support bar 155 to move freely from side to side to accommodate thermal expansion during processing. In other words, a movable attachment is provided for removably engaging at least one of the vertical support rod 255 and the tap rod 240 . This eliminates the need for precise gaps between horizontally adjacent substrates 202 because the substrates 202 can float and move as they heat and expand. Previously, where vertical support rods 255 were more fixedly attached to tap rods 240, it was necessary to provide precise gaps between horizontally adjacent substrates 202 to ensure that adjacent substrates did not move against each other as they heated and expanded in their fixed positions. Applying excessive pressure. This procedure is prone to error and can result in loss/cracking of many valuable substrates. The configuration shown in FIGS. 2A-2I is substantially more flexible and less likely to cause cracking of the substrate.

Vertical support rod 255 is assembled to tap rod 240 . Several substrates 202 are loaded onto the carrier 200 in a vertical orientation. Although not shown in Figure 2A, a shield (eg, similar to shield 150 of Figure IB) may be provided to cover the top and bottom portions of carrier 200. Figure 2A includes a number of circles labeled 2B, 2C, 2D, and 2E. Each of these circles indicates which portion of the device is being shown in Figures 2B, 2C, 2D, and 2E respectively.

The substrate 202 may be loaded onto the carrier 200 using the method 300 shown in Figure 3, which is described in the context of the structure shown in Figures 2A-2E. Method 300 begins with operation 301 where a set of substrates 202 is received for processing. During this operation, the desired substrate layout is determined (eg, where each substrate 202 will be positioned on the carrier 200 ). For example, substrates of matching widths may be grouped together in rows. Next, at operation 303, the first vertical support rod 255 is installed to the carrier 200. Vertical support rods 255 are designed to hold the substrate in place and connect the remainder of the carrier 200 to the glass, such as via tap rods 240. In some cases, the first vertical support rod 255 may remain mounted on the carrier 200 and this operation may be omitted. Typically, a first vertical support bar 255 is mounted between tap bars 240 attached to the horizontal frame members 205 . In some cases, the first vertical support rod 255 (and the remaining vertical support rods 255 ) may be slidably assembled to the tap rod 240 . For example, vertical support rods 255 may slide horizontally into position along tap rods 240 to a position effectively aligned with the vertical edges of one or more of the substrates 202 in the carrier 200 .

Figure 2C shows the first vertical support rod 255 installed against the vertical frame member 210. It is worth noting that Figure 2C (and Figures 2B and 2D-2I) show these components from a "backside" perspective view. In other words, the front side/process side of the substrate faces the page, and the back side of the substrate faces away from the page. In this example, the first vertical support bar 255 is mounted flush against the vertical frame member 210, but in some cases a spacer may be provided between the first vertical support bar 255 and the vertical frame member 210 (not shown ). Brackets 270 or other connection structures may be provided to secure the first vertical support bar 255 to the tap bar 240 as shown in Figure 2C. The bracket may surround a portion of the first vertical support bar 255 and may include one or more openings that allow the bracket to be connected to the tap bar 240 . Bracket 270 provides one example of securing first vertical support bar 255 to tap bar 240 . However, the fixation of the first vertical support rod 255 does not necessarily need to be provided by the bracket 270 fixed in place.

In another embodiment, the first vertical support rod 255 is secured to the tap rod 240 by a spring clip 219, as shown in the front perspective view in FIG. 2Q and the top cross-sectional view in FIG. 2R. Spring clips 219 may be particularly suitable for ensuring that the edges of the substrate remain in contact with and supported by the vertical support rods during the processing process. Each spring clip 219 includes an attachment portion 219a configured at a first end to be coupled to the tap by one or more fasteners (not shown) positioned within apertures of the spring clip 219 Rod 240. Each spring clip 219 also includes a hollow shaft 219c having a length and an outer surface above which the spring 219d is mounted. Spring 219d includes an unspring length that is longer than the length of shaft 219c (eg, the length when not under compression or tension). Hollow shaft member 219c is configured to receive rod 219e, one end of rod 219e is assembled to fastener 219b, which is configured to be secured to the end of first vertical support rod 255.

Rod 219e is configured to be slidably inserted through hollow shaft 219c. A distance "D" is defined between the end of the hollow shaft member 219c and the second end of the rod 219e, as shown in Figure 2Q. The distance D is maximum when the rod 219e is fully inserted through the hollow shaft member 219c so that the fastener 219b abuts the second end 219m of the spring clip. This maximum distance may be called D ₁ .

In one embodiment, assembly and assembly of the carrier includes: initially positioning vertical support rod 255 on tap rod 240; attaching rod 219e to fastener 219b; fully inserting rod 219e through hollow shaft member 219c so that the fastener Fastener 219b is against the second end 219m of the spring clip 219; place the spring 219d above the hollow shaft member 219c; secure the retainer 219f to the second end of the rod 219e; position the fastener 219b on the vertical support rod 255 above; and then assemble the attachment portion 219a to the tap rod 240. During assembly of attachment portion 219a, attachment portion 219a can be pulled away from fastener 219b, thereby compressing/preloading spring 219d. In the example of Figures 2Q and 2R, attachment portion 219a can be pulled to the left and attached at a position such that there is a gap between fastener 219b and second end 219m of spring clip 219. In this manner, the attachment portion 219a exerts a leftward force on the spring 219d, which exerts a leftward force on the retainer 219f, which exerts a leftward force on the retainer 219f. A leftward force is exerted on rod 219e, which exerts a leftward force on fastener 219b, which exerts a leftward force on vertical support rod 255. left force. This leftward force on the vertical support rod 255 ensures that the vertical support rod remains in contact with and supports the edge of the substrate 202 . Of course, spring clip 219 can be configured to provide a rightward force on these components under certain circumstances, such as by flipping and positioning spring clip 219 to the right of vertical support rod 255 . In many cases, the width of the gap between fastener 219b and second end 219m of spring clip 219 is less than the distance D ₁ described above. When the attachment portion 219a is pulled to the left during installation, the distance D between the end of the hollow shaft member 219c and the end of the rod 219e decreases to D < D ₁ . Distance D is now reduced as rod 219e remains fixed in position based on the position of vertical support rod 255 and fastener 219b, while the end of hollow shaft member 219c is pulled to the left, closer to the end of rod 219e.

When assembled in this manner, spring clip 219 and distance D accommodate and allow a limited amount of movement of vertical support rod 255 while ensuring that vertical support rod 255 remains engaged with and continues to support the edge of base plate 202 . In some cases, such movement is required to account for and accommodate different tolerances and expansion of the substrate 202 that may be caused by thermal non-uniformity and thermal expansion, all of which can cause the substrate to crack and/or detach during processing.

As shown in Figure 2S, in some embodiments, to further minimize cracking of the substrate, it may be useful to have spring 219d compressed/preloaded when positioning and securing attachment portion 219a to tap rod 240. Volume/distance optimization. For this purpose, a witness clip 233 can be used. The index clip includes a portion 233a that is coupled against the surface of fastener 219b, and a portion 233b that is coupled to tap rod 240 by the fastener positioned within an elongated slot in portion 233b. Examples of use of position indicator clip 233 include processing substrate 202 such that thermal expansion of the component will be at or near maximum. Shortly after such expansion is achieved, portion 233a is positioned abuttingly against the surface of fastener 219b, and portion 233b is secured to tap rod 240. Subsequent cooling will cause thermal contraction of the assembly, which will cause a gap to form between fastener 219b and portion 233b of the index clip. The width of this gap can be used to determine the amount/distance that spring 219d should be compressed/preloaded to achieve the desired position of attachment portion 219a. In this manner, it is ensured that the vertical support rods 255 continue to contact and support the edges of the substrate 202 even as various materials thermally expand and contract during processing.

Returning to FIG. 3 , at operation 305 , the first row of substrates 202 is loaded onto the carrier 200 by placing the substrates 202 against the first vertical support bar 255 . This situation is also shown in Figure 2C. The first vertical support bar 255 (as well as the other vertical support bars 255) includes a body area and a flange area. The flange area extends slightly horizontally outward from the front face of the vertical support rod 255 and contacts the front side of the base plate 202 . The main area of the vertical support rod 255 is positioned between adjacent row substrates 202 . In Figure 2C, the flange area of the vertical support bar 255 is shown behind the base plate 202 and behind the body area of the vertical support bar 255 (however, it should be understood that Figure 2C shows a "rear" perspective view, and therefore, when When considering the "front side" perspective commonly used when coating, the flange area is actually in front of the substrate 202 and shields the peripheral area of the substrate 202).

As shown in Figure 2C, the first vertical support rod 255 (as well as the other vertical support rods 255) includes a plurality of slots 271, each slot configured to receive a pin 275 protruding from the vertical support rod 255. Each base plate 202 is secured against the body region of the vertical support rod 255 between the edge region and the pins 275 . Pin 275 may be mounted in slot 271 all the way along the height of vertical support rod 255. In this example, pin 275 has a shaft extending in a direction parallel to the face of base plate 202 and perpendicular to the height of vertical support rod 255 . Slot 271 provides one example of a fastener attachment location for attachment pin 275 (or other fastener). However, the plurality of slots 271 shown in FIG. 2B is not limited to a shape that spans and passes through three faces of the support rod 255 .

As shown in FIG. 2T , in another embodiment, the plurality of slots 273 includes a shape that surrounds one face of the support rod 255 . In the embodiment of FIG. 2T , each slot 273 is configured to receive a respective pin 274 of the retainer 272 to couple the retainer to the vertical support rod 255 . In the embodiment of Figure 2T, retainer 272 includes two pins, however, in other embodiments, the retainer may include fewer or more pins. The retainer 272 includes two extending flanges 276 that define a flat surface configured to abut each substrate 202 between the flange 281 of the vertical support rod 255 and the extending flange 276 of the retainer 272 The main body area 282 of the vertical support rod 255 is engaged and fixed. Pin 274 includes a shaft extending in a direction orthogonal to the face of base plate 202 and perpendicular to the height of vertical support rod 255 . In some cases, the use of slots 273 has been found to provide increased structural strength to support rods 255, while the use of retainers 272 has been found to reduce substrate cracking. In some cases, one or more clips (see element 290 of Figure 2P) may be disposed between vertically adjacent substrates 202 in a particular row. In other cases, such clips may be omitted, and no physical structure may be positioned between vertically adjacent substrates 202. As shown in Figure 2P, the clip 290 may have an "H"-shaped cross-section, with a front plate, a back plate, and a shaft connecting the front and back plates. When considering the perspective used during processing, the clamp front plate can be positioned on the front side of the substrate/in front of the processing face, the clamp back plate can be positioned behind the back side of the substrate, and the shaft of the clamp can reside at the edge of the substrate so that Separate vertically adjacent substrates.

Next, in operation 307, the second vertical support rod 255 is installed to the carrier. A second vertical support bar 255 is shown, for example, in Figures 2D and 2E. The second vertical support rod 255 can slidably engage the tap rod 240 so that it can be positioned at any desired location. Typically, the second vertical support rod 255 will be installed directly against the previously installed base plate 202 in the first row. Then, in operation 309, the second row of substrates 202 is loaded onto the carrier 200. The second set of substrates 202 is loaded in the same manner as the first set of substrates 202, as shown in Figures 2D and 2E. The second set of substrates 202 is loaded onto the carrier 200 so that they are each in contact with the second vertical support rod 255 . After loading the second row of substrates 202, it is determined in operation 311 whether the carrier 200 is completely loaded with substrates. If not, the method continues with operations 313 and 315 , where additional vertical support rods 255 are installed and additional rows of substrates 202 are loaded, respectively, until the carrier 200 is full. Once the carrier 200 is completely loaded, the method continues with operation 317. Here, the final vertical support rod is mounted to the carrier as shown in Figure 2B. Movable spacers 265 may be temporarily disposed between the final vertical support rods 255 and the vertical frame members 210 to provide precise clearances to allow for thermal expansion of the substrate 202. In some embodiments, this gap can be verified via automated visual processing.

As shown in Figure 2U, in some embodiments, one or more second vertical support rods 255 may be provided with safety clips 256. In one embodiment, safety clips 256 are provided at the bottom and top of each second vertical support rod 255 . Each safety clip 256 includes an attachment portion 256a configured to be coupled to the tap rod 240 by one or more fasteners. Each safety clip 256 also includes a retaining portion 256b which, when attached to the tap bar 240, defines an opening 256c through which the end of the second vertical support bar 255 may be inserted or otherwise mounted. The retaining portion is configured to limit the distance that the second vertical support bar 255 can move or displace away from the tap bar 240 , such as may occur if the substrate 202 coupled to the support bar 255 breaks during substrate processing. . After the second vertical support rod 255 is installed in the opening 256c, each safety clip 256 continues to allow each vertical support rod to slide along the tap rod 240 within the space 256d defined by the retaining portion and the tap rod 240. Move.

Figure 2F shows the top area of carrier 200. A gap is provided between tap bar 240 and the top edge of base plate 202. This gap allows for thermal expansion of the substrate. 2G-2I illustrate pivot pins 280 installed along the top edge of base plate 202. As shown in FIGS. Figure 2G shows the pivot pin 280 in a lower position, which may be used while the substrate is cooling, such as when loading the substrate onto the carrier 200. Figure 2H shows pivot pin 280 in an upper position, which may be used when the substrate is hot and has thermally expanded, such as during sputtering. Figure 2I provides a perspective view of the pivot pin 280 that secures the base plate 202. In some cases, pivot pin 280 may be spring loaded. In many cases, gravity is sufficient to ensure that the pivot pin is adequately held in place during handling.

Pivot pin 280 includes a first end connected to tap rod 240 and a second end that secures the top edge of base plate 202 . As shown in FIGS. 2G-2I , the second end of pivot pin 280 may include a support structure secured against the front/process side of substrate 202 . In some cases, the second end of pivot pin 208 may secure the top edge of base plate 202 by contacting both the front and rear sides of base plate 202 . The first end of pivot pin 280 is connected to tap lever 240 in a manner that allows pivot pin 280 to pivot about the connector. In this manner, the pins can move between the positions shown in Figures 2G and 2H to allow for thermal expansion and contraction of the substrate and other materials.

Figures 2J-2O show close-up views of vertical support rods 255 according to three different embodiments. In each embodiment, the vertical support rod 255 includes a flange region 281 , a body region 282 , and a plurality of slots 271 in the body region 282 . Figures 2J and 2K show alternative views of the vertical support rod 255 according to the first embodiment. In this case, the body region 282 of the vertical support rod 255 is formed from a single piece of metal formed into the desired "U" shape. The flange area 281 is also made from a single piece of sheet metal, but is substantially flat. These two parts are joined together via any available means. 2L and 2M show alternative views of the vertical support rod 255 according to the second embodiment. The second embodiment differs from the first embodiment in that the second embodiment includes cutouts 283 in the metal sheet forming the flange area 281 of the vertical support rod 255 to reduce the mass of the vertical support rod 255 . Figures 2N and 2O show alternative views of the vertical support rod 255 according to the third embodiment. The third embodiment differs from the second embodiment in that the third embodiment includes additional cutouts 283 in the body region 282 of the vertical support rod 255 to further reduce the mass of the vertical support rod 255 . Furthermore, in this embodiment, the vertical support rods are made only from flat pieces (eg, the body area is formed from three pieces of metal attached together rather than a single piece of metal bent into a "U" shape). By only using flat pieces to assemble the vertical support bar 255, a thinner thickness of metal can be used to form the vertical support bar 255, thereby further reducing the mass of the vertical support bar 255. It is advantageous to reduce the mass of the vertical support rods as this will minimize thermal non-uniformities during heating and cooling.

One advantage of the embodiment shown in Figures 2A-2P is the elimination of the horizontal support rods 160 used in the carrier 100 of Figures 1A and 1B. These horizontal support rods cause considerable problems during processing and often cause breakage of the carrier, coater and/or substrate. Eliminating horizontal support rods significantly reduces the likelihood of such fractures, thereby increasing production efficiency and reducing production costs. Furthermore, with the embodiment of Figures 2A-2P, there is no need to store a large number of horizontal support rods, which are typically large and bulky and require considerable storage space. The hardware required to load the substrate onto the carrier is reduced and simplified (e.g., only a single type of pin is required, only a single type of vertical support rod is required, etc.). Overall, there are fewer parts that could potentially break and maintenance costs are substantially reduced.

Another advantage of the embodiment of Figures 2A-2P is that the likelihood of substrate cracking during processing is reduced due to automated gap verification. This type of automated gap verification is easier to implement because the flexible/slidable connection between the vertical support rods and tap rods allows all substrates and vertical support rods to be loaded onto the carrier in physical contact with each other. Only a single gap needs to be provided along the horizontal width of the carrier, rather than a precise gap between each horizontally adjacent pair of substrates. Since only a single gap is required and the gap can be set at a uniform location (eg at the edge of the carrier), automated gap verification (eg using vision processing methods) is a more feasible possibility.

Additionally, eliminating horizontal support bars will allow carriers to be loaded faster because loading the substrate and verifying clearance involves fewer and easier steps. In some embodiments, the carriers and methods described herein can be accomplished in an automated manner (eg, using a robotic arm), thereby further reducing the possibility of mismounting substrates. Eliminating horizontal support rods also eliminates potential sources of contamination of the substrate. As mentioned above, in some cases the horizontal support rods are telescopic. When metal parts move against each other, tiny metal particles can be scraped off, which can then fall onto the substrate and contaminate it.

Another advantage of the embodiment shown in Figures 2A-2P is that most of the vertical support rods are moved to a position behind the front side/process side of the substrate. Therefore, the peripheral area of the substrate shielded by the vertical support bars (sometimes referred to as the "bite area") can be smaller. Smaller bite area benefits downstream laser processing.

4A-4G present various views of alternative embodiments. In this case, the carrier 400 can more easily accommodate substrates 402 of different widths. Because the substrates are not oriented in rows, there is no need to ensure that the substrates in the same row have the same width. One technique for achieving this flexibility is to move the vertical support rods 455 so that they are close to but not at the vertical edge of the base plate 402 (of course, additional vertical support rods may also be provided). For example, instead of providing a single vertical support bar 255 horizontally adjacent a pair of substrates 202 , as shown in FIG. 2A , two vertical support bars 455 may be provided, each vertical support bar being slightly offset horizontally from the substrates. the vertical edge. The two vertical support bars are offset in opposite directions, as shown in Figure 4A, so that each adjacent substrate is supported near each of its vertical edges. In the example of FIG. 4A , four substrates 402 are loaded onto the carrier 400 and six vertical support rods 455 are used to provide support near each vertical edge of the substrates 402 .

In this example, vertical support rods 455 are positioned completely behind base plate 402 . This may be advantageous in many embodiments because there is substantially less shadowing of the substrate 402, which means that a larger proportion of the processing surface of the substrate is available for processing. This could benefit future laser processing, for example.

The embodiment in FIGS. 4A to 4G has many similarities with the embodiment described above. For example, carrier 400 includes horizontal frame members 405 and 415 connected together by short struts 435 . Vertical frame member 410 is connected to horizontal frame members 405 and 415 to form a frame. Guide plates 420 and rails 425 may be attached to horizontal frame members 415 as shown. A shield similar to shield 150 of Figure 1B may be provided (not shown).

4B is shown from a "backside" perspective and provides a close-up view of the vertical support rod 455 installed in the slot 469 of the tap rod 440. Tap bar 440 is mounted on horizontal frame member 405. Vertical support rod 455 includes a front face and two sides. Several slots 472 are formed in the front face of the vertical support rod 455. Slot 472 provides one example of a fastener attachment location for attaching pin 476 or other fasteners. Slot 472 is vertically oriented (eg, its longest dimension extends up and down) and configured to receive pin 476 . Pin 476 is one example of a fastener that can be used to secure the base plate to the vertical support pole. In this example, slot 472 includes an opening near the top of slot 472 and pin 476 can fit through the opening. Pin 476 may be located at any vertical location within slot 472. In many cases, pin 476 is located at the bottom of slot 472, but this is not always the case. Pin 476 in Figure 4B also maintains base plate 402 in a coplanar position with the forward flange area of tap bar 440, as seen more clearly in Figure 4D.

Figure 4C is shown from a "front" perspective and provides a close-up view of the pins 476 that secure the two base plates 402 to the vertical support rods 455. Pins 476 maintain the base plates 402 in place so that they are coplanar and vertically spaced apart from each other.

Figure 4D is also shown from a "front" perspective and shows the pins 476 securing the two base plates 402 to the two vertical support bars 455. Pins 476 also maintain a coplanar relationship between the base plate 402 and the front flange area of the vertical support 440. The vertical support rod 455 is disposed near but slightly away from the vertical edge where the two substrates 402 meet. The pin 476 is installed in the slot 472 of the vertical support rod.

Figure 4E shows a cross-sectional view of the configuration shown in Figure 4D. Specifically, FIG. 4E shows pin 476 installed in slot 472 to secure base plate 402 to vertical support bar 455 at the bottom of vertical support bar 455 where it connects to tap bar 440. As described above, the pins 476 secure the base plate 402 in a coplanar relationship with the forward flange area of the tap bar 440 . In Figure 4E, the substrate front side/processing side is on the left and the substrate back side is on the right.

The pin 476 includes a front plate, a rear plate, a middle plate, and a shaft connecting the front plate, the middle plate, and the rear plate. The plates are relatively small, but large enough to secure the edges of the base plate 402. In Figure 4E, the front plate is shown to the left of pin 476 (in front of the front side of base plate 402/processing face), and the back plate is shown to the right of pin 476 (behind the face of vertical support bar 455), And the middle plate is positioned between the front plate and the rear plate (and between the rear side of the base plate and the surface of the vertical support rod 455). The shaft of pin 476 extends in a direction perpendicular to the surface of base plate 402 .

Figure 4F shows a "front" view of three substrates 402 loaded onto two vertical support bars 455. Pins 476 fit into slots 472 to secure base plate 402 to vertical support rods 455 . Pins 476 are positioned vertically between adjacent edges of substrate 402 . Notably, the substrates 402 are not oriented in rows, and substrates of any width can be matched together as desired. Instead of rows, the substrates are oriented in columns, with substrates in the same column having the same height. While some substrate geometry matching may still be involved, the carrier layout allows substantially greater flexibility and eliminates the problems associated with horizontal support rods.

Figure 4G depicts a cross-sectional view of the configuration shown in Figure 4F. Specifically, Figure 4G shows pins 476 that secure and separate two vertically adjacent substrates 402. Pins 476 maintain the two substrates 402 in a coplanar relationship. The clip 476 shown in Figure 4G is similar or identical to the pin 476 shown in Figure 4E. One difference is that the clip 476 of Figure 4E is positioned between a single base plate and the forward flange area of tap bar 440, while the clip 476 of Figure 4G is positioned between two vertically adjacent base plates.

The pin 476 of Figures 4B-4G is similar to the clip 290 of Figure 2P. As clamps 290 separate vertically adjacent substrates, pins 476 perform the same operation while securing the substrates to vertical support rods 455. Clamp 290 includes only two plates (eg, front and back), while pin 476 includes an additional middle plate. These two elements function in a similar manner to secure adjacent substrates in a coplanar relationship. In some embodiments, both may be used.

Although not shown in Figures 4A-4G, pivot pins may be provided along the top edge of base plate 402, similar to pivot pins 280 shown in Figures 2G-2I. Various other details described with respect to the embodiment of FIGS. 2A-2P may also apply to the embodiment of FIGS. 4A-4G. Various hardware components can be combined according to the needs of specific applications.

The embodiment shown in Figures 4A-4G provides many of the same benefits described above with respect to the embodiment of Figures 2A-2P. A notable benefit is the elimination of horizontal support bars that previously introduced many handling challenges. Another important advantage is that the substrate is able to thermally expand (both horizontally and vertically) during processing and the likelihood of cracking is substantially reduced. In the embodiment of FIGS. 2A-2P , the substrates can expand both horizontally and vertically without cracking, eliminating the need for precise gaps between each pair of horizontally adjacent substrates because the vertical support rods can expand along the dividing lines. The post slides or otherwise moves horizontally to accommodate such expansion and contraction. In the embodiment of FIGS. 4A-4G , the substrates can expand and contract horizontally without cracking, eliminating the need for precise gaps between each pair of adjacent substrates since the substrates can expand and contract horizontally while still being secured by pins 476 The fact of moving horizontally. Therefore, the process of loading the substrate onto the carrier is substantially simplified. Instead of providing a precise gap between each pair of horizontally and/or vertically adjacent substrates, the substrates can be loaded relatively closely against each other and/or against vertical support bars. Only two gaps need to be provided, one to allow for vertical expansion (e.g., the gap between the top edge of the base plate and the upper junction bar), and one to allow for horizontal expansion (e.g., usually but not necessarily close to the vertical frame members). As the substrates expand, they can push each other slightly in the plane of the substrates, causing one or more substrates to expand into each gap. With the design described in this article, the risk of substrate and coater breakage is significantly reduced.

It should be understood that the configurations and/or methods described herein are illustrative in nature and such specific embodiments or examples should not be considered in a limiting sense as many variations are possible. The particular routines or methods described herein may represent one or more of any number of processing strategies. Thus, various actions shown may be performed in the order shown, in another order, in parallel, or in some cases omitted. Likewise, the order of the procedures described above can be changed. Certain references are incorporated herein by reference. It should be understood that any disclaimer or disclaimer made in such a reference does not necessarily apply to the embodiments described herein. Similarly, any features described as essential in such references may be omitted from the embodiments herein.

The subject matter of this disclosure includes all novel and non-obvious combinations and subcombinations of the various programs, systems, and configurations, and other features, functions, acts, and/or properties disclosed herein, and any and all equivalents thereof.

100:carrier 101:pore 102:Substrate 105:Horizontal frame components 110:Vertical frame parts 115:Horizontal frame components 120: Guide plate 125: Guide rail 130: Overlapping sections 135:Short pillar 140: Tap lever 145:Stud 150:shield 155:Vertical support rod 160: Horizontal support rod 200:carrier 202:Substrate 205:Horizontal frame components 210:Vertical frame components 215:Horizontal frame components 219: Spring clip 219a: Attachment part 219b: Fasteners 219c: Hollow shaft parts 219d:Spring 219e:Great 219f: retainer 219m: second end 220: Guide plate 225: Guide rail 233: Position indicating clip 233a: Part 233b:Part 235:Short pillar 240: Tap lever 255:Vertical support rod 256:Safety clip 256a: Attachment part 256b: keep part 256c:Open your mouth 256d:space 265: Removable spacer 270: Bracket 271:Slot 273:Slot 274:pin 275: Pin/Retainer 276:Extension flange 280: Pivot nail 281: Flange area 282:Main area 283:Incision 290:Clip 300:Method 301: Operation 303: Operation 305: Operation 307: Operation 309: Operation 311: Operation 313: Operation 315: Operation 317: Operation 400: Carrier 402:Substrate 405:Horizontal frame components 410:Vertical frame components 415:Horizontal frame components 420: Guide plate 425: Guide rail 435:Short pillar 440: Tap lever 455:Vertical support rod 469:Slot 472:Slot 476:Pin 2B: Circle 2C: Circle 2D: circle 2E: Circle D: distance

1A and 1B illustrate a carrier for supporting a substrate as it moves through processing equipment.

Figure 2A illustrates a carrier for supporting a substrate as it moves through processing equipment, according to one embodiment.

Figures 2B-2D show close-up rear side views of portions of the embodiment shown in Figure 2A showing vertical support rods mounted on the bottom tap bar at various locations along the tap bar.

2E shows a close-up rear side view of a portion of the embodiment shown in FIG. 2A showing the vertical support rods that separate two adjacent rows of substrates.

Figure 2F depicts a close-up rear side view of a portion of the embodiment shown in Figure 2A showing the top patching post.

Figures 2G-2I each show a pivot pin mounted along the top split rod and engaging the top edge of the base plate.

Figures 2J-2O show different views of vertical support rods according to several embodiments.

2P illustrates a cross-sectional view of a clip that may be used to separate vertically adjacent substrates in accordance with certain embodiments.

Figures 2Q and 2R show the first vertical support rod secured to the tap rod by spring clips.

Figure 2S depicts an example of a spring clip according to one embodiment.

Figure 2T shows retainers and pins that may be used to secure glass to vertical support rods in accordance with certain embodiments.

Figure 2U illustrates a safety clip that may be used at the edge of a vertical support pole in some embodiments.

3 is a flowchart describing a method of loading a substrate onto the carrier described with respect to FIGS. 2A-2P.

Figure 4A depicts a carrier for supporting a substrate as it moves through processing equipment, according to one embodiment.

Figure 4B shows a close-up rear side view of a portion of the embodiment of Figure 4A showing the vertical support rods mounted on the bottom split rods.

4C shows a close-up front side view of a portion of the embodiment of FIG. 4A showing pins installed in the vertical support rods to secure two vertically adjacent substrates to the vertical support rods.

Figure 4D shows a close-up front side view of a portion of the embodiment of Figure 4A showing two base plates secured to the vertical support bar and the bottom split bar through the use of pins.

Figure 4E shows a cross-sectional view of the embodiment shown in Figure 4D.

Figure 4F shows a close-up front side view of a portion of the embodiment of Figure 4A showing three substrates loaded via pins onto two vertical support rods.

Figure 4G depicts a cross-sectional view of the embodiment shown in Figure 4F.

200:carrier

202:Substrate

205:Horizontal frame components

210:Vertical frame components

215:Horizontal frame components

220: Guide plate

225: Guide rail

235:Short pillar

240: Tap lever

255:Vertical support rod

2B: Circle

2C: Circle

2D: circle

2E: Circle

Claims (10)

A carrier for holding at least one substrate in a substantially vertical orientation as it passes through a coater that provides a coating on at least one front surface of the at least one substrate layer, the carrier includes: One bottom part connects the rod; a top connecting rod; A plurality of vertical support rods, each vertical support rod having a length permitting engagement with both the top junction pole and the bottom junction pole, wherein the plurality of vertical support poles include at least a leftmost and a leftmost a right vertical support rod, and wherein the combination of said plurality of vertical support rods and said bottom and top portioning rods defines one or more apertures; and A plurality of attachments for engaging the bottom and top portioning bars to permit horizontal movement of at least one of the plurality of vertical support bars along the bottom and top portioning bars . The carrier as described in item 1 of the patent application further includes a plurality of fasteners for fastening the end of the base plate to the vertical support rod, wherein each vertical support rod has a plurality of fastener attachment locations for attachment to the plurality of fasteners at a plurality of vertical positions. The carrier as claimed in claim 1, wherein each vertical support rod is joined to the substrate along a flat surface of the vertical support rod. The carrier described in item 3 of the patent application, wherein each fastener includes at least one pin or nail. For the carrier described in item 4 of the patent application, each fastener includes at least two pins or nails. The carrier of claim 2, wherein the plurality of fastener attachment locations include a plurality of slots, holes, grooves or other openings in the vertical support rods. The carrier as claimed in claim 1, wherein a horizontal dimension of the at least one pore is between about 50 inches and 200 inches. The carrier as claimed in claim 1, wherein a vertical dimension of the pores is between about 50 inches and 150 inches. The carrier as described in item 1 of the patent application, wherein the substrate includes glass or plastic. The carrier as described in item 1 of the patent application, wherein the substrate is a window to be coated using an electrochromic device.