TW202330855A - Resin composition for forming temporary fixative, temporary fixative, support tape for substrate conveyance, and method for producing electronic device - Google Patents

Abstract

This resin composition for forming a temporary fixative contains an acrylic rubber having an epoxy group and a silicone compound having an amine group. When a film is formed by heating this composition for 5 minutes at 90 DEG C and for 5 minutes at 140 DEG C, the modulus of this film is 2 MPa or greater at 100 DEG C and the modulus of this film after heating for 2 hours at 170 DEG C is 500 MPa or greater at 25 DEG C.

Description

Resin composition for forming temporary fixing material, temporary fixing material, support tape for substrate transfer, and manufacturing method of electronic device

This disclosure relates to a resin composition for forming a temporary fixing material, a temporary fixing material, a support tape for transferring a substrate, and a method of manufacturing an electronic device.

With the miniaturization and high performance of electronic devices such as smartphones and tablet PCs, the mounting density of semiconductor elements and semiconductor packages used in electronic devices is increasing. For example, with respect to connection between a wiring board and a semiconductor chip, instead of wire bonding, flip chip mounting or the like is employed. In addition, in order to cope with high-density mounting, a multilayer wiring board having a core layer and wiring layers with a build-up structure provided on both sides thereof is also used. As a method of manufacturing a semiconductor package using these, for example, the following Patent Document 1 discloses a method in which after forming a solder resist layer on a multilayer wiring board, the wiring of the wiring board is connected to the semiconductor chip with a solder material by reflow soldering. .

[Patent Document 1] International Publication No. 2009/081518

In order to achieve further thinning of electronic components such as semiconductor elements and semiconductor packages, attempts have been made to use thin organic substrates as substrates. Specifically, the development of coreless substrates that do not use a core layer impregnated with a thermosetting resin in glass cloth is being actively pursued. A coreless substrate does not have a core layer, so the layer thickness of the substrate can be reduced. On the other hand, since it does not have a highly elastic core layer, it is difficult to ensure the rigidity of the substrate itself, and the workability in the manufacturing process of electronic components becomes a problem.

From such a background, the present inventors tried a method of securing rigidity and improving workability in the manufacturing process of electronic components by attaching a support body to a substrate via a temporary fixing material as a laminate. However, in the above-mentioned manufacturing process, processes such as formation of solder resist including heat treatment and reflow are performed in the state of the above-mentioned laminated body, so there are gaps between the support body and the substrate (between the support body and the temporary fixing material) during processing. Sometimes between the temporarily fixed material and the substrate) is prone to peeling or the problem of foaming that becomes the starting point of peeling. In addition, after the processing, the temporary fixing material and the support body will be peeled off from the substrate. In this case, it is not preferable if the temporary fixing material remains on the substrate side.

In view of the above circumstances, an object of the present disclosure is to provide a temporary fixing material capable of both suppressing peeling between the support body and the substrate during processing including heat treatment and releasability from the substrate after processing, and a method for forming the temporary fixing material. A resin composition for forming a temporary fixing material, a support tape for substrate transfer, and a method for manufacturing an electronic device.

In order to solve the above-mentioned problems, the present inventors tried to embed a temporary fixing material having a low modulus of elasticity into the fine unevenness on the substrate to suppress foaming in the reflow process, but it was found that it is difficult to adjust the unevenness according to the aspect ratio or depth of the unevenness in this case. Adjust the modulus of elasticity suitable for embedding. If the modulus of elasticity is excessively lowered, the temporary fixing material is likely to remain on the substrate side when the temporary fixing material and the support are peeled off from the substrate at room temperature after the reflow process. Therefore, as a result of the present inventors' attempt to suppress peeling in the reflow step by deliberately reducing the embedability of the temporary fixing material for unevenness, it was found that by combining a specific thermoplastic resin and a specific silicone compound, the temporary fixing material The modulus of elasticity is adjusted within a specific range so that both the suppression of peeling in the reflow step and the ease of peeling after the reflow step can be achieved in the temporary fixing material, and the present invention has been completed.

One aspect of the present disclosure provides a resin composition for forming a temporary fixing material, which is used to form a temporary fixing material for temporarily fixing a support for substrate transfer to an organic substrate, comprising an acrylic rubber having an epoxy group and an acrylic rubber having an amine group. Silicone compound, when heating at 90°C for 5 minutes and then heating at 140°C for 5 minutes to form a film, the elastic modulus of the film is 2 MPa or more at 100°C, and the elastic modulus of the above film after heating at 170°C for 2 hours The number is 500MPa or more at 25°C.

According to the above resin composition for forming a temporary fixing material, it is possible to form a temporary fixing material capable of suppressing peeling between the support body and the substrate during processing including heat treatment and releasability from the substrate after processing. The present inventors consider the reason why such an effect is exhibited as follows. First, it is considered that when a film is formed from a resin composition, the acrylic rubber having an epoxy group reacts with the silicone compound having an amine group, thereby increasing the modulus of elasticity when the film before curing is attached to a substrate. Embedding, but the wettability to the substrate is improved, thereby sufficiently suppressing peeling during processing. In addition, the present inventors speculate that, in addition to suppressing the embedding property, the elastic modulus at room temperature of the cured film is sufficiently increased so that when the temporary fixing material and the support are peeled off from the substrate at room temperature after processing, , sufficiently suppresses the temporary fixing material from remaining on the substrate side.

The above resin composition for forming a temporary fixing material may further contain an epoxy curing agent.

The content of the silicone compound in the temporary fixing material-forming resin composition may be 1 to 10 parts by mass relative to 100 parts by mass of the acrylic rubber. When the content of the silicone compound is within the above range, it is easy to form a temporary fixing material having an elastic modulus at 100° C. of 2 MPa or more, and it is easy to obtain wettability to the above substrate.

The present disclosure also provides a temporary fixing material formed using the resin composition for forming a temporary fixing material of the present disclosure described above. According to this temporary fixing material, it is possible to achieve both the suppression of detachment between the support body and the substrate during processing including heat treatment, and the detachability of detachment from the substrate after processing.

The disclosure also provides a support belt for transporting a substrate, which includes: a support film for transporting an organic substrate; and a temporary fixing material layer disposed on the support film and used for temporarily fixing the organic substrate and the support film, and temporarily fixing the material layer It is formed using the above-mentioned resin composition for forming a temporary fixing material of the present disclosure.

The above-mentioned support belt for substrate transfer can improve the handleability of the organic substrate, and can achieve both the suppression of peeling between the support body and the substrate during processing including heat treatment and the peelability of peeling the temporary fixing material from the substrate after processing.

The present disclosure also provides a method for manufacturing an electronic device, which includes: a first step of attaching a support to an organic substrate via a temporary fixing material to obtain a laminate; a second step of heating the temporary fixing material of the laminate; In the third step, processing including heat treatment is performed on the laminated body passed through the second step; and in the fourth step, the support body and the temporary fixing material are peeled off from the organic substrate of the laminated body passed through the third step, and the temporary fixing material is used in the above-mentioned disclosure A resin composition former for temporary fixation material formation.

According to the above method of manufacturing an electronic device, it is possible to manufacture an electronic device including thinned electronic components using an organic substrate with high productivity. That is, in the above-mentioned production method, the temporary fixing material is formed using the temporary fixing resin composition of the present disclosure, whereby the following effects can be exerted: (i) the organic substrate and the support can be bonded in the first step, And improve the handling of thin organic substrates (for example, easy to transport thin organic substrates); (ii) The temporary fixing material in the second step can fully fix the organic substrate and support in the third step, and can perform well including heat treatment (iii) can be easily peeled off from the organic substrate without soiling the surface of the substrate in the fourth step; etc.

In the above manufacturing method, the processing in the third step may include at least one of solder resist formation and reflow.

In the above-mentioned manufacturing method, the thickness of the above-mentioned organic substrate may be 200 μm or less. In addition, the above-mentioned organic substrate may be a coreless substrate. [Invention effect]

According to the present disclosure, it is possible to provide a temporary fixing material capable of suppressing detachment between a support body and a substrate during processing including heat treatment and detachability from the substrate after processing, and a temporary fixing material formation for forming the temporary fixing material. A method for manufacturing a resin composition, a support tape for substrate transfer, and an electronic device.

The resin composition for forming a temporary fixing material of the present disclosure can form a temporary fixing material capable of sufficiently fixing an organic substrate and a transport support and easily peeling the support from the organic substrate without soiling the surface of the substrate. The support belt for substrate transfer disclosed in the present disclosure can improve the handleability of the organic substrate, and can be easily peeled off from the organic substrate without soiling the surface of the substrate.

Hereinafter, embodiments for implementing the present disclosure will be described in detail with reference to the drawings as the case may be. However, this disclosure is not limited to the following embodiments. In addition, in this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, and "(meth)acrylate" means acrylate or the methacrylate corresponding to it. "A or B" only needs to contain any one of A and B, and may contain both simultaneously.

In addition, in this specification, the term "layer" includes not only the structure of the shape formed on the entire surface but also the structure of the shape formed in a part when viewed as a plan view. In addition, in this specification, the term "step" not only includes an independent step, but also includes in this term as long as the desired action of the step can be achieved even if it cannot be clearly distinguished from other steps. In addition, the numerical range displayed using "~" shows the range which includes the numerical values before and after "~" as a minimum value and a maximum value, respectively.

[Resin composition for temporary fixing material formation] The resin composition for forming a temporary fixing material according to this embodiment contains an acrylic rubber having an epoxy group and a silicone compound having an amine group. The temporary fixing material forming resin composition may further contain an epoxy curing agent or other components in addition to the above components.

The resin composition for temporary fixing material formation of this embodiment can be used as a temporary fixing material for temporarily fixing the support body for substrate conveyance to an organic substrate.

＜Acrylic Rubber with Epoxy Group＞ As the acrylic rubber having an epoxy group, a (meth)acrylic copolymer having an epoxy group may be used, which may have an epoxy group in the polymer chain or may have an epoxy group at the end of the polymer chain.

As the (meth)acrylic copolymer having an epoxy group, one obtained by polymerization methods such as bead polymerization and solution polymerization may be used, or a commercially available product may be used. Glycidyl (meth)acrylate, (meth)acrylic acid, (meth)acrylate, styrene etc. are mentioned as a monomer which comprises a copolymer.

In the epoxy group-containing (meth)acrylic copolymer, the blending amount of glycidyl (meth)acrylate may be 1 to 20% by mass or 5 to 15% by mass based on the total amount of monomers constituting the copolymer. %.

The glass transition temperature (hereinafter, sometimes referred to as "Tg") of the acrylic rubber having an epoxy group is preferably -50°C to 50°C, more preferably -40°C to 20°C. When Tg is within such a range, it is possible to obtain more sufficient fluidity while suppressing deterioration of handling properties due to excessive increase in adhesive force.

Tg is an intermediate point glass transition temperature value when measuring a thermoplastic resin using differential scanning calorimetry (DSC, for example, "Thermo Plus 2" manufactured by Rigaku Corporation). Specifically, the above-mentioned Tg is the midpoint glass transition temperature calculated by measuring the heat change under the conditions of a temperature increase rate of 10°C/min and a measurement temperature of -80 to 80°C, and calculated by a method based on JIS K 7121:1987.

The weight average molecular weight of the acrylic rubber having an epoxy group is not particularly limited, and may be 100,000 to 1,200,000, or 200,000 to 1,000,000. When the weight average molecular weight of the acrylic rubber is within such a range, it is easy to secure film-forming properties and fluidity. The weight average molecular weight is a polystyrene-equivalent value using a calibration line based on standard polystyrene in gel permeation chromatography (GPC).

The acrylic rubber having an epoxy group may be used alone or in combination of two or more.

The acrylic acid having an epoxy group in the resin composition for forming a temporary fixing material according to the present embodiment takes into account both suppression of detachment between the support body and the substrate during processing including heat treatment and detachability from the substrate after processing. The content of the rubber may be 40 to 90 parts by mass, 60 to 80 parts by mass, or 70 to 80 parts by mass with respect to 100 parts by mass of the total composition.

The resin composition for temporary fixing material formation of this embodiment may contain thermoplastic resin other than the acrylic rubber which has an epoxy group. The thermoplastic resin may be a resin that forms a cross-linked structure by heating or the like. As such resin, the polymer which has a crosslinkable functional group is mentioned. Examples of polymers having crosslinkable functional groups include thermoplastic polyimide resins, (meth)acrylic copolymers having crosslinkable functional groups, urethane resins, polyphenylene ether resins, and polyetherimides. resin, phenoxy resin, modified polyphenylene ether resin, etc.

The polymer having a crosslinkable functional group may have a crosslinkable functional group in a polymer chain, or may have a crosslinkable functional group at a polymer chain terminal. As a specific example of a crosslinkable functional group, an alcoholic hydroxyl group, a phenolic hydroxyl group, a carboxyl group, etc. are mentioned.

The Tg of the thermoplastic resin may be -50°C to 50°C, or may be -40°C to 20°C. The weight average molecular weight of the thermoplastic resin is not particularly limited, and may be 100,000 to 1,200,000, or 200,000 to 1,000,000.

＜Silicone compounds with amine groups＞ As the silicone compound having an amino group, known silicones can be used. For example, it may be a modified silicone oil in which the methyl group of dimethyl silicone oil is replaced by an amino group-containing organic group. The amine group can be included in the terminal (two terminals or one terminal) of the silicone main chain, or in the side chain, or in the terminal (two terminals or one terminal) and the side chain.

The molecular weight of the silicone main chain is not particularly limited, and the functional group (amine group) equivalent weight may be 10-3000 g/mol.

The silicone compound having an amino group may be used alone or in combination of two or more.

From the viewpoint of ensuring the adhesion of the temporary fixing material to the substrate, suppressing embedding into the substrate, and improving wettability with the substrate, the resin composition for forming a temporary fixing material according to this embodiment contains an amine The content of the silicone compound having an epoxy group may be 1 to 10 parts by mass, or may be 4 to 6 parts by mass relative to 100 parts by mass of the acrylic rubber having an epoxy group.

＜Epoxy curing agent＞ As the epoxy curing agent, commonly used known curing agents can be used. Examples of epoxy curing agents include: amines; polyamides; acid anhydrides; polysulfides; boron trifluoride; Hydroxyl bisphenols; novolak resin, bisphenol A novolac resin, cresol novolak resin and other phenolic resins; etc.

The epoxy curing agent may be a novolak resin from the viewpoint of suppressing embedding into the substrate. As such an epoxy curing agent, commercial items such as "PSM-4326" (made by Gunei Chemical Industry Co., Ltd., brand name) and "MEH-7800M" (made by Meiwa Plastic Industries, Ltd., brand name) can be used.

One type of epoxy curing agent may be used alone, or two or more types may be used in combination.

The content of the epoxy curing agent in the resin composition for forming a temporary fixing material according to this embodiment may be 5 to 40 parts by mass, or may be 15 to 25 parts by mass with respect to 100 parts by mass of the acrylic rubber having an epoxy group. When the content of the epoxy curing agent is within the above range, the temporary fixing material is likely to have sufficient adhesion, heat resistance, curability, and peelability. Also, if the content of the epoxy curing agent is more than 15 parts by mass, it can be cured in a short period of time, the heat resistance is improved, and the retention of the organic substrate during the manufacture of the electronic device is also improved, and the parts that constitute the electronic device ( For example, semiconductor wafers, etc.) tend to be less susceptible to damage. Furthermore, it is easy to increase the modulus of elasticity at 100° C. of the temporary fixing material before curing, and it is easy to obtain good peelability by suppressing unevenness embedded in the substrate. On the other hand, when the content of the epoxy curing agent is 25 parts by mass or less, the elastic modulus at 100° C. of the temporary fixing material before curing is less likely to become too high, and it is easy to ensure adhesion. In addition, the elastic modulus at 25°C of the cured temporary fixing material is less likely to become too high, and the fixing effect at the time of peeling can be suppressed, and it tends to be easier to achieve a higher level of retentivity of the organic substrate and the organic substrate and the support. peelability.

＜Other ingredients＞ Components other than the above-mentioned components include thermosetting resins, inorganic fillers (inorganic fillers), organic fillers (organic fillers), curing accelerators, silicone compounds other than amine-group-containing silicone compounds, and silanes. Coupling agent, etc.

Examples of thermosetting resins include epoxy resins, acrylic resins, silicone resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins.

Examples of the inorganic filler include silica, alumina, boron nitride, titanium dioxide, glass, iron oxide, ceramics and the like. The inorganic filler may be added for the purpose of imparting low thermal expansion and low hygroscopicity to the temporary fixing material. An inorganic filler may be used individually by 1 type, and may use it in combination of 2 or more types.

Examples of the organic filler include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, polyimide fine particles, and the like. One type of organic filler may be used alone, or two or more types may be used in combination.

Examples of curing accelerators include imidazoles, cyanoguanidine derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenyl borate, 2-ethyl-4-methylimidazole -Tetraphenyl borate, 1,8-diacribicyclo[5,4,0]undecene-7-tetraphenyl borate, etc. The curing accelerator can be used alone or in combination of two or more.

As other silicone compounds, those having a polysiloxane structure can be used without particular limitation. For example, silicone modified resin, pure silicone oil, non-reactive modified silicone oil, reactive modified silicone oil, etc. are mentioned. A silicone compound can be used individually by 1 type or in combination of 2 or more types.

When the resin composition for forming a temporary fixing material according to this embodiment forms a film, the elastic modulus of the film is 2 MPa or more at 100°C, and the elastic modulus of the film after heating at 170°C for 2 hours at 25°C is Above 500MPa.

The film can be produced by coating a base material with a varnish of a resin composition for forming a temporary fixing material, and drying the coating film by heating (for example, heating at 90°C for 5 minutes and heating at 140°C for 5 minutes) to form Temporarily pins the material layer.

<Elastic modulus of the film before heating (before curing) at 100°C> The elastic modulus at 100° C. of the film before heating was measured in the following procedure. First, a temporary fixing material layer with a thickness of 30 μm was formed on the substrate by the above-mentioned method. First, eight sheets of the temporary fixing material layer were laminated at 60° C. to fabricate a film with a thickness of 240 μm. This film was cut into width 4mm and length 33mm. Set the cut film in a dynamic viscoelastic device (trade name: Rheogel-E4000, manufactured by UMB Co., Ltd.), and apply a tensile load. The distance between chucks: 20mm, frequency 10Hz, heating rate 5°C/min, constant velocity The storage elastic modulus E' at 23° C. to 260° C. was measured under the measurement conditions of temperature rise, and the value of the storage elastic modulus E' at 100° C. was obtained.

From the viewpoint of achieving a high level of release from the viewpoint of suppressing the unevenness of the temporary fixing material embedded in the substrate when it is attached to the substrate, and peeling the temporary fixing material from the substrate after processing including heat treatment (for example, reflow), the above-mentioned 100°C The lower elastic modulus may be 2 MPa or more, 3 MPa or more, or 4 MPa or more. The modulus of elasticity at 100° C. may be 8 MPa or less or 6 MPa or less from the viewpoint of ensuring easy adhesion of the temporary fixing material to the substrate.

The above modulus of elasticity at 100°C can be adjusted, for example, by appropriately changing the amount of acrylic rubber with epoxy groups, epoxy curing agent, silicone compound with amino groups, curing accelerator, etc., and the amount of acrylic rubber with epoxy groups Tg or epoxy equivalent to adjust.

<Elastic modulus at 25°C of the heated (cured) film> The elastic modulus at 25°C of the heated film was measured in the following procedure. First, a temporary fixing material layer with a thickness of 30 μm was formed on the substrate by the above-mentioned method. First, eight sheets of the temporary fixing material layer were laminated at 60° C. to fabricate a film with a thickness of 240 μm. This film was heated in an oven at 170° C. for 1 hour, and cut into width 4 mm and length 33 mm along the thickness direction. Set the cut film in a dynamic viscoelastic device (trade name: Rheogel-E4000, manufactured by UMB Co., Ltd.), apply a tensile load, measure at a frequency of 10 Hz, and a heating rate of 5 °C/min, and apply a tensile load. The distance between chucks: 20mm, frequency 10Hz, heating rate 5°C/min, constant temperature rise, measure the storage elastic modulus E' at 23°C to 260°C, and obtain the storage elastic modulus E' at 25°C value.

The elastic modulus at 25° C. may be 500 MPa or more or 600 MPa or more from the viewpoint of suppressing peeling during processing including heat treatment (for example, reflow). From the viewpoint of suppressing the fixing effect at the time of peeling, the modulus of elasticity at 25° C. may be 1000 MPa or less or 900 MPa or less.

The above-mentioned modulus of elasticity at 25°C can be determined by appropriately changing the amount of acrylic rubber with epoxy groups, epoxy curing agent, curing accelerator, etc., and the Tg or epoxy equivalent of acrylic rubber with epoxy groups. Adjustment.

[Temporarily fixed material] The temporary fixing material of this embodiment is formed using the resin composition for temporary fixing material formation of this embodiment mentioned above. In particular, according to the resin composition for forming a temporary fixing material of this embodiment, a film-like temporary fixing material can be formed. In this case, it is easier to control the film thickness of the temporary fixing material, and it is possible to reduce the thickness unevenness of the laminated body of the organic substrate, the temporary fixing material, and the support body. In addition, the film-like temporary fixing material can be bonded to an organic substrate or a support by a simple method such as lamination, and is also excellent in workability.

The film-like temporary fixing material can be formed by applying a varnish of a resin composition for forming a temporary fixing material on a base material, and heating and drying the coating film at 90 to 140°C.

The thickness of the film-form temporary fixing material is not particularly limited, and may be 10 to 350 μm or 10 to 200 μm from the viewpoint of sufficiently fixing the organic substrate and the support for transportation. If the thickness is 10 μm or more, the thickness unevenness at the time of coating is reduced, and the thickness is sufficient, so the strength of the temporary fixing material or the cured product of the temporary fixing material becomes good, and the organic substrate and the support for transportation can be fixed more fully. . If the thickness is 350 μm or less, it is difficult to produce uneven thickness of the temporary fixing material, and it is easy to reduce the amount of residual solvent in the temporary fixing material by sufficient drying, and it is possible to further reduce foaming when heating the cured product of the temporary fixing material.

[Support belt for substrate transfer] The support belt for substrate conveyance of this embodiment includes: a support film for conveying an organic substrate; The temporary fixing material of the embodiment is formed of a resin composition.

The elastic modulus at 100° C. of the temporarily fixing material layer may be 2 MPa or more, and the elastic modulus at 25° C. after heating at 170° C. for 1 hour may be 500 MPa or more. In addition, the modulus of elasticity at 100°C and the modulus of elasticity at 25°C may be within the above-mentioned ranges, respectively.

1 is a diagram showing an embodiment of a support belt for substrate transfer, FIG. 1(A) is a top view, and FIG. 1(B) is a schematic cross-sectional view cut along line I-I of FIG. 1(A). The support belt 10 for substrate transfer shown in these figures is equipped with the support film 1, the temporary fixing material layer 2A formed using the resin composition for temporary fixing material formation of this embodiment, and the protective film 3 in this order.

The support film 1 is not particularly limited as long as it can transport the organic substrate, for example, polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, etc. film, polyethylene film, polypropylene film, polyamide film and polyimide film. From the viewpoint of excellent flexibility and toughness, the support film 1 can be polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, polypropylene film, polyamide The amine film and the polyimide film may further be a polyimide film from the viewpoint of heat resistance and strength.

The thickness of the support film 1 can be appropriately set according to the target strength and flexibility, and can be 3 to 350 μm. When the thickness is 3 μm or more, sufficient film strength tends to be obtained, and when the thickness is 350 μm or less, sufficient flexibility tends to be obtained. From such a viewpoint, the thickness of the support film 1 may be 5-200 μm, or 7-150 μm.

The protective film 3 is not particularly limited, and examples thereof include polyethylene terephthalate films, polybutylene terephthalate films, polyethylene naphthalate films, polyethylene films, and polypropylene films. . From the viewpoint of flexibility and toughness, the protective film 3 may be a polyethylene terephthalate film, a polyethylene film, or a polypropylene film. Also, from the viewpoint of improving the releasability from the temporary fixing material layer, a film that has been subjected to a release treatment from a silicone compound, a fluorine compound, or the like can be used as the protective film 3 .

The thickness of the protective film 3 can be appropriately set according to the target strength and flexibility, and can be, for example, 10 to 350 μm. When the thickness is 10 μm or more, sufficient film strength tends to be obtained, and when the thickness is 350 μm or less, sufficient flexibility tends to be obtained. From such a viewpoint, the thickness of the protective film 3 may be 15 to 200 μm, or may be 20 to 150 μm.

The temporary fixing material layer 2A can be formed by mixing and kneading the components constituting the temporary fixing material forming resin composition of the present embodiment described above in an organic solvent to prepare a varnish, and applying the prepared varnish Drying is carried out on the support film 1.

The organic solvent is not particularly limited, and can be determined in consideration of volatility during film formation and the like from the boiling point. Specifically, methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, , acetone, methyl isobutyl ketone, toluene, xylene and other solvents with lower boiling points. In addition, for the purpose of improving film formability, for example, solvents having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone can be used. These solvents may be used alone or in combination of two or more. The solid content concentration in the varnish may be 10 to 80% by mass.

Mixing and kneading are carried out using a normal dispersing machine such as a mixer, a beater, a three-axis roll mill, or a ball mill, and these can be appropriately combined. Drying is not particularly limited as long as the organic solvent used is sufficiently volatilized. From the viewpoint of easy adjustment of the above-mentioned elastic modulus at 100°C and elastic modulus at 25°C to the desired range, you can use Heat at 90-140°C, 120-140°C or 130-140°C for 5-10 minutes.

After forming the temporary fixing material layer 2A on the support film 1, the protective film 3 is bonded on the temporary fixing material layer 2A, and the support tape 10 for board|substrate conveyance can be obtained by this.

In addition, it is also possible to apply a temporary fixing material layer on any film that has been subjected to mold release treatment instead of coating on the support film, and store it in a state where the protective film is attached, and when attaching the substrate, the protective film can be replaced. for the supporting membrane. In this case, instead of the support film, a substrate or the like obtained by thermosetting a laminate of glass fibers impregnated with an epoxy resin may be used as a support material.

[Manufacturing method of electronic device] The method of manufacturing an electronic device using the temporary fixing material of this embodiment can be roughly divided into the following four steps. (a) In the first step, a support body is bonded to an organic substrate via a temporary fixing material (temporary fixing material layer) to obtain a laminate. (b) In the second step, the temporary fixing material of the laminate is heated. (c) In the third step, processing including heat treatment is performed on the laminate obtained in the second step. (d) In the fourth step, the support body and the temporary fixing material are peeled off from the organic substrate of the laminate obtained in the third step.

2 and 3 are schematic cross-sectional views illustrating an embodiment of a method of manufacturing an electronic device. Furthermore, in FIG. 2 and FIG. 3, the temporary fixing material (temporary fixing material layer) is illustrated as the temporary fixing material layer 2A of the substrate transfer support belt 10 shown in FIG. The composition of the material is not limited to this.

＜(a) Step 1＞ In the first step, an organic substrate 30 is prepared ( FIG. 2( a )), and the support film 1 is bonded to the organic substrate 30 via the temporary fixing material layer 2A to obtain a laminate 15 ( FIG. 2( b )).

The organic substrate 30 shown in FIG. 2( a ) includes a core layer 32 , wiring layers 35 of a build-up structure provided on both surfaces of the core layer 32 , and a solder resist layer 38 provided on one of the wiring layers 35 . The organic substrate 30 includes via electrodes 36 and wiring 34 . The core layer 32 can be formed of an interlayer insulating material such as “Ajinomoto Build-up Film” (ABF) (manufactured by Ajinomoto Co., Inc., trade name). The wiring layer 35 can be formed using a buildup material such as an epoxy resin composition. The solder resist layer 38 may be formed of a composition containing an acrylic resin.

The organic substrate 30 is not limited to the structure shown in FIG. 2( a ), and various known substrates can be used.

As the organic substrate 30 , for example, a substrate having a thickness of 10 to 1000 μm can be used. From the viewpoint of thinning electronic components or electronic devices, the thickness of the organic substrate 30 may be 200 μm or less, or may be 100 μm or less. From the viewpoint of maintaining the strength of electronic components such as semiconductor packages and reducing warpage, the thickness of the organic substrate 30 may be 30 μm or more, or may be 50 μm or more.

The organic substrate 30 may be a coreless substrate. Here, the coreless substrate refers to a substrate that does not include a core layer obtained by impregnating a reinforcing fiber such as glass cloth with a thermosetting resin.

As shown in FIG. 2( b ), when the laminate 15 is obtained using the substrate transport support belt 10 , the organic substrate 30 and the support film 1 can be laminated via the temporary fixing material layer 2A using a roll laminator. When the support belt 10 for board|substrate conveyance is provided with the protective film 3, the protective film 3 may be peeled off before lamination, and the temporary fixing material layer 2A and the support film 1 may be laminated|stacked while peeling the protective film 3.

As a roll laminator, the roll laminator VA400III (trade name) manufactured by Taisei Laminator Co., LTD. is mentioned, for example. When this device is used, the organic substrate 30 and the support film 1 can be bonded via the temporary fixing material layer 2A under the conditions of a pressure of 0.1MPa-1.0MPa, a temperature of 40°C-150°C, and a speed of 0.1-1.0m/min.

It is also possible to use a vacuum laminator instead of a roll laminator.

Examples of the vacuum laminator include NPC Incorporated vacuum laminator LM-50×50-S (trade name) and Nichigo-Morton Co., Ltd. vacuum laminator V130 (trade name). As the lamination conditions, the air pressure is below 1hPa, the crimping temperature is 40°C~150°C (preferably 60°C~120°C), the lamination pressure is 0.01~0.5MPa (preferably 0.1~0.5MPa), and the holding time is 1 second~ The organic substrate 30 and the support film 1 are bonded together via the temporary fixing material layer 2A under the condition of 600 seconds (preferably 30 seconds to 300 seconds).

＜(b) Step 2＞ In the second step, the temporary fixing material layer 2A of the laminate 15 is heated. Through this step, the organic substrate 30 and the support film 1 can be sufficiently fixed by the cured temporary fixing material layer 2C ( FIG. 2( c )), and the handleability of the organic substrate 30 can be improved.

Heating can be performed, for example, using an explosion-proof dryer. The heating conditions are preferably curing at 100-200° C. for 10-300 minutes (more preferably 20-210 minutes). If the temperature is 100°C or higher, the temporary fixing material can be sufficiently cured without causing problems in subsequent steps. If the temperature is lower than 200°C, it is difficult to generate outgassing when curing the temporary fixing material, and the peeling of the temporary fixing material can be further suppressed. . Moreover, if the heating time is 10 minutes or more, it is difficult to cause a problem in the subsequent step, and if it is 300 minutes or less, the working efficiency is difficult to deteriorate. The temporary fixing material layer 2C in FIG. 2( c ) shows a cured body of the temporary fixing material layer 2A.

＜(c) Step 3＞ In the third step, processing including heat treatment can be performed. As this process, formation of a solder resist (for example, the solder resist layer 39 shown in FIG.3(d)), mounting of a semiconductor wafer, reflow, sealing, etc. are mentioned. Processing may include at least one of solder mask formation and reflow.

Mounting of the semiconductor wafer can be carried out by mounting the semiconductor wafer on the organic substrate using, for example, a flip chip bonder. As an apparatus for mounting, for example, FC3000L (trade name) manufactured by TORAY ENGINEERING Co., Ltd. is mentioned, and mounting conditions can be arbitrarily selected according to desired organic substrates and semiconductor wafers.

The reflow step may be performed by heating at a temperature at which the solder melts. The heating temperature can be adjusted according to the type of solder, for example, it can be 190-280°C or 220-270°C. By applying the temporary fixing material formed using the resin composition for forming a temporary fixing material of this embodiment, even when the reflow step is performed at the above-mentioned temperature, it is possible to suppress the bonding of the organic substrate 30 through the temporary fixing material layer 2A. and the support film 1 are peeled in the reflow step, and the support film 1 can be easily peeled from the organic substrate 30 while suppressing the temporary fixing material layer 2A from remaining on the organic substrate 30 at room temperature after the reflow step.

Also, in this embodiment, after the semiconductor chip 40 is connected via the solder 42 on the organic substrate 30 by the reflow step, the semiconductor chip 40 mounted on the organic substrate 30 can be sealed with a sealing material 50 (see FIG. )). As a sealing device, for example, FFT1030G (trade name) manufactured by TOWA JAPAN is mentioned, and the sealing conditions can be arbitrarily selected according to desired organic substrates, semiconductor wafers, and sealing materials. In addition, the curing conditions of the sealing material after sealing can be arbitrarily selected according to the type of sealing material.

＜(d) Step 4＞ In the fourth step, as shown in FIG. 3(e), the support film 1 and the temporary fixing material layer are peeled off from the organic substrate 30 of the laminate (semiconductor chip mounting substrate 55 on which the semiconductor chip is mounted and sealed) passed through the third step. 2C. As the peeling method, the following methods can be mentioned: one of the organic substrate or the support film is fixed horizontally, and the other is pulled up at an angle to the horizontal direction; and a protective film is pasted on the organic substrate, and A method of peeling off an organic substrate and a protective film from a support film; etc.

These peeling methods are usually implemented at room temperature, but may be implemented at a temperature of about 40 to 100°C.

In this embodiment, when the temporary fixing material partially remains on the semiconductor chip mounting substrate, a cleaning step for removing the temporary fixing material may be provided. The temporary fixing material can be removed by cleaning the semiconductor wafer mounting substrate, for example.

The cleaning solution is not particularly limited as long as it is a cleaning solution capable of removing locally remaining temporary fixing materials. As such a cleaning solution, for example, the above-mentioned organic solvents that can be used for dilution of the resin composition for temporary fixing material formation are mentioned. These organic solvents may be used alone or in combination of two or more.

Also, when it is difficult to remove the remaining temporary fixing material, alkalis and acids may be added to the organic solvent. As examples of bases, amines such as ethanolamine, diethanolamine, triethanolamine, triethylamine and ammonia; and ammonium salts such as tetramethylammonium hydroxide can be used. As acids, organic acids such as acetic acid, oxalic acid, benzenesulfonic acid, and dodecylbenzenesulfonic acid can be used. The addition amount may be 0.01 to 10% by mass in terms of the concentration in the cleaning solution. Also, in order to improve the removability of residues, conventional surfactants may be added to the cleaning solution.

The washing method is not particularly limited, and examples thereof include a method of washing with stirring using the above-mentioned washing liquid, a washing method of spraying with a sprayer, and a method of immersing in a bath of washing liquid. A suitable temperature is 10-80°C, preferably 15-65°C, and finally wash with water or alcohol, and dry to obtain a semiconductor chip mounting substrate.

Furthermore, as described above, according to the temporary fixing material of this embodiment, it can be detached from the organic substrate well, and the temporary fixing material can be suppressed from remaining on the organic substrate, so the cleaning step can be omitted.

In this embodiment, the semiconductor chip mounting substrate 55 on which the semiconductor chip is mounted and sealed is further diced into individual semiconductor elements 60 ( FIG. 4( f ) and FIG. 4( g )). Again, the DL of Fig. 4(f) shows the cutting line.

FIG. 4(h) schematically shows a cross-sectional view of the electronic device 100 manufactured through the above steps. In the electronic device 100 , a plurality of semiconductor elements 60 are arranged on a wiring board 70 via solder balls 65 .

As mentioned above, although embodiment of this indication was demonstrated, this indication is not necessarily limited to the said embodiment, It can change suitably in the range which does not deviate from the summary. [Example]

Hereinafter, the present disclosure will be further specifically described with examples and comparative examples, but the present disclosure is not limited to the following examples.

[Synthesis of acrylic rubber K-1] 200 g of deionized water and acrylic acid were prepared in a 500 cc detachable flask equipped with a stirrer, a thermometer, a nitrogen replacement device (nitrogen inflow tube) and a reflux cooler with a moisture receiving container. 70g of butyl ester, 9.5g of methyl methacrylate, 10g of 2-hydroxyethyl methacrylate, 10g of glycidyl methacrylate, 0.5g of styrene, 1.94g of 1.8% polyvinyl alcohol aqueous solution, 0.2g of lauryl peroxide And n-octyl mercaptan 0.04g. Next, N ₂ gas was blown into the flask for 60 minutes to remove air in the system, and then the temperature in the system was raised to 65° C., and polymerization was performed for 5 hours. Furthermore, the temperature in the system was raised to 90° C., stirring was continued for 2 hours, and the polymerization was completed. The transparent beads obtained by the polymerization reaction were separated by filtration, washed with deionized water, and dried in a vacuum dryer at 50° C. for 6 hours to obtain acrylic rubber K-1.

As a result of measuring the weight average molecular weight of the acrylic rubber K-1 by GPC, the weight average molecular weight was 600,000 in terms of polystyrene. Also, the Tg of the acrylic rubber K-1 was -28°C.

[Synthesis of acrylic rubber K-2] 200 g of deionized water and acrylic acid were prepared in a 500 cc detachable flask equipped with a stirrer, a thermometer, a nitrogen replacement device (nitrogen inflow tube) and a reflux cooler with a moisture receiving container. 70g of butyl ester, 9.5g of methyl methacrylate, 10g of 2-hydroxyethyl methacrylate, 10g of glycidyl methacrylate, 0.5g of styrene, 1.94g of 1.8% polyvinyl alcohol aqueous solution, 0.2g of lauryl peroxide And n-octyl mercaptan 0.06g. Next, N ₂ gas was blown into the flask for 60 minutes to remove air in the system, and then the temperature in the system was raised to 65° C., and polymerization was performed for 5 hours. Furthermore, the temperature in the system was raised to 90° C., stirring was continued for 2 hours, and the polymerization was completed. The transparent beads obtained by the polymerization reaction were separated by filtration, washed with deionized water, and dried in a vacuum dryer at 50° C. for 6 hours to obtain acrylic rubber K-2.

As a result of measuring the weight average molecular weight of the acrylic rubber K-2 by GPC, the weight average molecular weight was 400,000 in terms of polystyrene. Also, the Tg of the acrylic rubber K-2 was -28°C.

[Synthesis of acrylic rubber K-3] 200 g of deionized water and acrylic acid were prepared in a 500 cc detachable flask equipped with a stirrer, a thermometer, a nitrogen replacement device (nitrogen inflow tube) and a reflux cooler with a moisture receiving container. 77.5g of butyl ester, 2g of methyl methacrylate, 10g of 2-hydroxyethyl methacrylate, 10g of glycidyl methacrylate, 0.5g of styrene, 1.94g of 1.8% polyvinyl alcohol aqueous solution, 0.2g of lauryl peroxide And n-octyl mercaptan 0.04g. Next, N ₂ gas was blown into the flask for 60 minutes to remove air in the system, and then the temperature in the system was raised to 65° C., and polymerization was performed for 5 hours. Furthermore, the temperature in the system was raised to 90° C., stirring was continued for 2 hours, and the polymerization was completed. The transparent beads obtained by the polymerization reaction were separated by filtration, washed with deionized water, and dried in a vacuum dryer at 50° C. for 6 hours to obtain acrylic rubber K-3.

As a result of measuring the weight average molecular weight of the acrylic rubber K-3 by GPC, the weight average molecular weight was 600,000 in terms of polystyrene. Also, the Tg of the acrylic rubber K-3 was -37°C.

(Examples 1-5, Comparative Examples 1-3) [Creation of temporarily fixed material (temporarily fixed material layer)] The varnish of the resin composition for forming the temporary fixing material layer was prepared with the composition shown in Table 1 in parts by mass, respectively. The prepared varnish was coated on a release-treated polyethylene terephthalate (PET) film with a thickness of 38 μm, heated and dried at 90°C for 5 minutes, and then heated and dried at 140°C for 5 minutes. A temporary fixing material layer with a thickness of 30 μm was formed. Then, a protective film was bonded on the temporary fixing material layer, and the tape which has the structure of a PET film, a temporary fixing material layer, and a protective film was obtained.

【Table 1】 Example 1 Example 2 Example 3 Example 4 Example 5 Comparative example 1 Comparative example 2 Comparative example 3 thermoplastic resin Acrylic Rubber K-1 100 - - 100 100 100 100 100 Acrylic Rubber K-2 - 100 - - - - - - Acrylic Rubber K-3 - - 100 - - - - - Hardener PSM-4326 20 20 30 20 20 20 - 20 MEH-7800M - - - - - - 20 - Amino modified silicone PAM-E 5 5 5 5 5 - - 5 Inorganic Filler YA050C-HHG - - - 20 - - - - curing accelerator 2PZ-CN 1 1 1 1 - 1 1 1 Non-volatile content (mass%) Solvent: cyclohexanone twenty three twenty three twenty three twenty three twenty three twenty three twenty three twenty three

The details of each component described in Table 1 are as follows. (thermoplastic resin) Acrylic rubber K-1: Acrylic rubber synthesized above (weight average molecular weight measured by GPC is 600,000, glycidyl methacrylate is 10% by mass, Tg is -28°C) Acrylic rubber K-2: Acrylic rubber synthesized above (weight average molecular weight measured by GPC is 400,000, glycidyl methacrylate is 10% by mass, Tg is -28°C) Acrylic rubber K-3: Acrylic rubber synthesized above (weight average molecular weight measured by GPC is 600,000, glycidyl methacrylate is 10% by mass, Tg is -37°C) (Hardener) PSM-4326: Phenolic resin (manufactured by Gunei Chemical Industry Co., Ltd., trade name) MEH-7800M: Phenolic resin (manufactured by MEIWA PLASTIC INDUSTRIES, LTD., brand name) (Amine modified silicone) PAM-E: Silicone modified with two terminal amino groups (manufactured by Shin-Etsu Chemical Co., Ltd., trade name) (inorganic filler material) YA050C-HHG: Vinylsilane surface-treated silica filler (manufactured by ADMATECHS COMPANY LIMITED, trade name, average particle size 50nm) (curing accelerator) 2PZ-CN: Imidazole-based curing accelerator (manufactured by SHIKOKU CHEMICALS CORPORATION, brand name)

The modulus of elasticity of the temporarily fixing material layer and the elastic modulus of the temporarily fixing material layer after hardening were evaluated with the method shown below about the produced example and the comparative example tape. The evaluation results are shown in Table 2.

[Measurement of elastic modulus of temporarily fixed material layer] The modulus of elasticity of the temporary fixing material layer was measured in the following procedure. First, each varnish was coated on a PET film, and heated and dried at 90°C for 5 minutes, and then at 140°C for 5 minutes to form a temporary fixing material layer with a thickness of 30 μm, and eight sheets of the temporary fixing material layer were laminated at 60°C. The material layer was fixed, thereby producing a film with a thickness of 240 μm. This film was cut into width 4mm and length 33mm. Set the cut film in a dynamic viscoelastic device (trade name: Rheogel-E4000, manufactured by UMB Co., Ltd.), and apply a tensile load. The distance between chucks: 20mm, frequency 10Hz, heating rate 5°C/min, constant velocity The storage elastic modulus E' at 23°C to 260°C was measured under the measurement conditions of temperature rise, and the value of the storage elastic modulus E' at 100°C was obtained.

[Measurement of Elastic Modulus of Cured Temporary Fixing Material Layer] The elastic modulus of the cured temporary fixing material layer was measured in the following procedure. First, a film having a thickness of 240 µm was produced in the same manner as above. After heating in an oven at 170° C. for 1 hour, it was cut into width 4 mm and length 33 mm along the thickness direction. Set the cut film in a dynamic viscoelastic device (trade name: Rheogel-E4000, manufactured by UMB Co., Ltd.), apply a tensile load, measure at a frequency of 10 Hz, and a heating rate of 5 °C/min, and apply a tensile load. The distance between chucks: 20mm, frequency 10Hz, heating rate 5°C/min, and constant temperature rise under the conditions of measuring the storage elastic modulus E' from 23°C to 260°C, and obtaining the storage elastic modulus E' at 25°C value.

The presence or absence of peeling during reflow and the peelability after reflow were evaluated with respect to the support tapes for substrate transfer produced using the tapes of Examples and Comparative Examples by the method shown below. The evaluation results are shown in Table 2.

[Evaluation of peeling during reflow] The protective film of the tapes produced in Examples and Comparative Examples was peeled off, and a polyimide film (UBE Corporation, Inc. (manufactured, trade name: Upilex 25SGA, thickness: 25 μm) to obtain a support tape for substrate transfer.

Next, an organic substrate (material: glass epoxy substrate) with a surface thickness of 1000 μm having solder resist AUS308 (manufactured by TAIYO INK MFG. CO., LTD., trade name: PSR-4000 AUS308) was placed on a roll laminator (Taisei On a stage made by Laminator Co., LTD., VA-400III), the PET film is laminated and peeled off in such a way that the temporary fixing material layer is attached to the organic substrate side at a temperature of 100°C, a pressure of 0.2 MPa, and a pressure of 0.2 m/min. A support belt for substrate transfer to obtain a laminate of support film (polyimide film)/temporary fixing material layer/organic substrate.

After heating the laminate obtained above in an oven at 170°C for 1 hour, the sample was placed on a hot plate for 5 minutes so that the organic substrate was in contact with a hot plate heated to 260°C, and the organic substrate and the hot plate were visually confirmed. Whether peeling (foaming) occurs between the support films (that is, between the organic substrate and the temporary fixing material layer and/or between the support film and the temporary fixing material layer). Then, the peeling state at the time of reflow was evaluated according to the following evaluation criteria. A: No peeling (foaming) occurred between the organic substrate and the temporary fixing material layer or between the support film and the temporary fixing material layer. B: Slight peeling (foaming) occurred at least at one point between the organic substrate and the temporary fixing material layer and between the support film and the temporary fixing material layer. The area of the peeled (foamed) portion is 2% or less of the total area. C: Peeling (foaming) occurred at least at one point between the organic substrate and the temporary fixing material layer and between the support film and the temporary fixing material layer. The area of the peeled (foamed) portion exceeds 2% of the total area.

[Evaluation of peelability after reflow] After the samples evaluated for peeling during reflow were cooled to room temperature (25°C), the support film was peeled off from the organic substrate, and it was checked with the naked eye whether the temporary fixing material layer remained on the organic substrate or not. Then, the peelability after reflow was evaluated according to the following evaluation criteria. A: The temporary fixing material layer did not remain on the organic substrate. B: A part of the temporary fixing material layer remained on the organic substrate. C: Peeling occurred between the support film and the temporary fixing material layer, and most of the temporary fixing material layer remained on the organic substrate.

【Table 2】 Example 1 Example 2 Example 3 Example 4 Example 5 Comparative example 1 Comparative example 2 Comparative example 3 Elastic modulus at 100°C of temporarily fixed material layer (MPa·s) 4.2 4 3 4 3.5 0.6 0.2 2.5 Elastic modulus at 25°C of cured temporary fixing material layer (MPa·s) 638 621 546 523 504 637 536 301 Whether there is peeling during reflow A A A A B B B C Peelability after reflow A A B A B C C C

From the results shown in Table 2, it was confirmed that the modulus of elasticity at 100°C was 2 MPa or more based on the resin compositions of Examples 1 to 5 containing silicone with amine groups and acrylic rubber with epoxy groups. , A support tape for transporting a substrate with a temporary fixing material layer having an elastic modulus of 500 MPa or more at 25°C when heated at 170°C for 1 hour, which can suppress peeling between the support film and the organic substrate during reflow, and can obtain Excellent peelability for peeling off the temporarily fixed material layer from the organic substrate after reflow.

1: Support membrane 2A: Temporarily fix the material layer 2C: Temporarily fixed material layer after curing 3: Protective film 10: Support belt 15: laminated body 30: Organic substrate 40: Semiconductor wafer 50: sealing material 55: Semiconductor chip mounting substrate 60: Semiconductor components 65: solder ball 70: Wiring substrate 100: Electronic machinery and equipment

1 is a diagram showing an embodiment of a support belt for substrate transfer, FIG. 1(A) is a top view, and FIG. 1(B) is a schematic cross-sectional view cut along line I-I of FIG. 1(A). 2( a ) to FIG. 2( c ) are schematic cross-sectional views for explaining one embodiment of a method of manufacturing an electronic device. 3( d ) to 3( e ) are schematic cross-sectional views for explaining one embodiment of a method of manufacturing an electronic device. 4( f ) to 4 ( h ) are schematic cross-sectional views for explaining one embodiment of a method of manufacturing an electronic device.

Claims (9)

A resin composition for forming a temporary fixing material, which is used to form a temporary fixing material for temporarily fixing a support for substrate transfer to an organic substrate, Contains acrylic rubber with epoxy groups and silicone compounds with amine groups, When a film is formed by heating at 90°C for 5 minutes and at 140°C for 5 minutes, the elastic modulus of the film is 2 MPa or more at 100°C, and the elastic modulus of the film after heating at 170°C for 2 hours is 25°C. The lower is above 500MPa. The resin composition for forming a temporary fixing material according to claim 1, further comprising an epoxy curing agent. The resin composition for forming a temporary fixing material according to claim 1 or claim 2, wherein The content of the silicone compound having an amino group is 1 to 10 parts by mass relative to 100 parts by mass of the acrylic rubber having an epoxy group. A temporary fixing material formed using the resin composition for forming a temporary fixing material according to any one of claims 1 to 3. A support belt for transporting a substrate, comprising: a supporting film for transporting the organic substrate; and a temporary fixing material layer disposed on the supporting film and used for temporarily fixing the aforementioned organic substrate and the aforementioned supporting film, The temporary fixing material layer is formed using the resin composition for forming a temporary fixing material according to any one of claim 1 to claim 3 . A method of manufacturing an electronic machine device, comprising: In the first step, a support body is bonded to an organic substrate via a temporary fixing material to obtain a laminate. In a second step, heating the temporary fixing material of the laminate; In the third step, processing including heat treatment is carried out on the above-mentioned laminated body after the above-mentioned second step; and In a fourth step, peeling off the support and the temporary fixing material from the organic substrate of the laminate obtained in the third step, The aforementioned temporary fixing material is formed using the resin composition for forming a temporary fixing material described in any one of claim 1 to claim 3 . The manufacturing method of the electronic machine device as described in Claim 6, wherein The aforementioned process in the aforementioned third step includes at least one of formation of a solder resist and reflow. The manufacturing method of the electronic machine device as described in Claim 6 or Claim 7, wherein The aforementioned organic substrate has a thickness of 200 μm or less. The method of manufacturing an electronic device according to any one of claim 6 to claim 8, wherein The aforementioned organic substrate is a coreless substrate.

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