TW202324851A - Bidirectional electrical connector - Google Patents
Bidirectional electrical connector Download PDFInfo
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- TW202324851A TW202324851A TW111128023A TW111128023A TW202324851A TW 202324851 A TW202324851 A TW 202324851A TW 111128023 A TW111128023 A TW 111128023A TW 111128023 A TW111128023 A TW 111128023A TW 202324851 A TW202324851 A TW 202324851A
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Abstract
Description
本發明係有關於一種電連接器,特別係指一種雙向電連接器。 The present invention relates to an electrical connector, in particular to a bidirectional electrical connector.
現今電腦設備最普及的訊號傳輸規格莫過於通用序列匯流排(Universal Serial Bus,簡稱USB),以此規格製作的連接器插座及傳輸線可使外接於電腦的周邊設備,如滑鼠、鍵盤、隨身碟等,即時為電腦所測得並立即使用。 The most popular signal transmission specification for computer equipment today is Universal Serial Bus (USB for short). Connector sockets and transmission lines made of this specification can be used to connect external peripheral equipment to the computer, such as mouse, keyboard, portable Discs, etc., are measured by the computer and used immediately.
目前USB母座及USB接頭皆為單向電連接,為了確保USB接頭插入USB母座時能電連接,兩者在對接上具有防呆設計,即當USB接頭反向插入時則無法插入,使用者即會再換另一個方向插入,方向正確了才能插入,如此即可確保插入後具有電連接。 At present, both the USB socket and the USB connector are connected electrically in one direction. In order to ensure that the USB connector can be electrically connected when it is inserted into the USB socket, the two have a fool-proof design on the docking, that is, when the USB connector is inserted in the opposite direction, it cannot be inserted. Use Or it will be inserted in another direction, and it can be inserted only when the direction is correct, so as to ensure that there is an electrical connection after insertion.
目前USB有2.0及3.0兩種規格,請參閱圖1及圖2,係為現有之USB2.0規格且具有板片型接頭之碟身碟1,其設有一塑膠座體10及一電路板15,該電路板15後段為該塑膠座體10包覆,該電路板15前段僅一板面露出該塑膠座體10外,該板面設有一排四個接點16。
At present, there are two specifications of USB 2.0 and 3.0, please refer to Fig. 1 and Fig. 2, which is the existing USB 2.0 specification and has a plate
請參閱圖3,係為現有之USB2.0規格之電連接母座20,其設有一金屬殼
25及一舌片22,該金屬殼25內形成一連接槽21,該舌片22位於連接槽偏上位置,該舌片僅下面設有一排4個接點23,該金屬殼25之頂面及底面各沖壓凸出二個彈片24。
Please refer to Fig. 3, it is the
請參閱圖4,在使用上,該隨身碟1必需接點16朝上插入連接槽21才可與位於該舌片22下面之一排接點23電連接,該四個彈片24係抵緊該碟身碟1;該碟身碟1若是反面插入連接槽21則無法電連接,使用者通常是隨機插入,故插不進去之機率是1/2,故常常是插兩次,造成使用上之不便。
Please refer to Fig. 4, in use, the
為了使用上之方便性,仍需以正反雙向皆可電連接較能符合需求,故申請人研發一種具有雙面電連接功能之正反雙面接頭之電子裝置,為了配合雙面電連接功能,則接頭必需設計二排接點,然而在使用上又恐電連接母座之彈片24抵接另一板面之接點而造成短路,故亦需克服此問題。
For the convenience of use, it is still necessary to be electrically connected in both directions to meet the requirements. Therefore, the applicant has developed an electronic device with a double-sided electrical connection function and a front-to-back double-sided connector. , then the connector must be designed with two rows of contacts. However, in use, it is feared that the
本發明申請人潛心研究上述產品之雙面插接設計,終於提出克服上述潛在問題之產品改良結構。 The applicant of the present invention devoted himself to researching the double-sided plug-in design of the above-mentioned products, and finally proposed an improved product structure to overcome the above-mentioned potential problems.
本發明之主要目的在於提供一種雙向電連接器,其中對接構造之上下兩板面皆具有接點,達到使用上之方便性及多元性。 The main purpose of the present invention is to provide a two-way electrical connector, wherein both the upper and lower boards of the docking structure have contact points, so as to achieve convenience and versatility in use.
為達上述目的,本發明系提供一種雙向電連接器,其系可雙向對接一對接電連接器,其包括有:一對接構造,該對接構造設有一絕緣體,該絕緣體前端設有一連接部,該連接部為一連接板,該連接板設有上下兩板面,該上下兩板面各設有一連接介面,該二連接介面各設有至少一排接點,該至少二排接點各設有多個不同電路之接點,該至少二排接點設於該連接板 之上下二板面,該至少二排接點形成在至少一排端子,該至少一排端子定位於該對接構造之絕緣體,該對接構造之該連接板之形狀可正反雙面對接定位於一對接電連接器之一連接槽;其特徵在於該連接板之後段較前段為厚。 In order to achieve the above purpose, the present invention provides a bidirectional electrical connector, which is a bidirectional butt joint electrical connector, which includes: a butt joint structure, the butt joint structure is provided with an insulator, the front end of the insulator is provided with a connecting part, the The connecting part is a connecting plate, and the connecting plate is provided with upper and lower board surfaces, each of which is provided with a connection interface, each of the two connection interfaces is provided with at least one row of contacts, and each of the at least two rows of contacts is provided with A plurality of contacts of different circuits, the at least two rows of contacts are arranged on the connecting plate On the upper and lower board surfaces, the at least two rows of contacts are formed on at least one row of terminals, and the at least one row of terminals is positioned on the insulator of the butt joint structure. One of the connection slots of the docking electrical connector; the characteristic is that the rear section of the connection plate is thicker than the front section.
藉由以上構造,本發明可達到使用上之方便性及多元性。 With the above structure, the present invention can achieve convenience and diversity in use.
本發明之上述及其他目的、優點和特色由以較佳實施例之詳細說明中並參考圖式當可更加明白。 The above and other objects, advantages and features of the present invention can be more clearly understood from the detailed description of the preferred embodiments with reference to the drawings.
1:隨身碟 1: Pen drive
3:隨身碟 3: Pen drive
10:塑膠座體 10:Plastic seat body
15:電路板 15: Circuit board
16:接點 16: contact
20:電連接母座 20: electrical connection socket
21:連接槽 21: Connection slot
22:舌片 22: tongue
23:接點 23: contact
25:金屬殼 25: metal shell
24:彈片 24: Shrapnel
30:外覆體 30: Outer body
31:下座 31: Take a seat
32:上蓋 32: Upper cover
33:容室 33: Containment room
34:上絕緣座體 34: Upper insulating base body
34’:下絕緣座體 34': Lower insulating seat body
35:定位凹槽 35: positioning groove
36:定位彈片 36: positioning shrapnel
37:塑膠板 37:Plastic board
38:金屬殼 38: metal shell
39:空間 39: space
312:塑膠塊 312: plastic block
301:透空孔 301: hollow hole
4:電子單元 4: Electronic unit
40:電路板 40: circuit board
41:第一接點 41: first contact
42:貫穿孔 42: Through hole
43:記憶體 43: memory
44:記憶體 44: memory
45:控制電路 45: Control circuit
46:蕭基二極體 46: Schottky diode
47:IC控制晶片 47: IC control chip
48:接點 48: contact
49:電路 49: circuit
410:連接槽 410: connection slot
411:第一接點 411: first contact
412:第二接點 412: second contact
413:舌片 413: tongue
417:接點 417: contact
418:接點 418: contact
419:電線 419: wire
420:導電部 420: conductive part
422:上電路板 422: Upper circuit board
423:下電路板 423: Lower circuit board
424:第二電路板 424: Second circuit board
425:插梢 425: plug
430:導電接點 430: conductive contact
432:焊接區 432: welding area
434:焊接區 434: welding area
52:卡槽 52: card slot
50:限位構造 50: limit structure
55:連接板 55: Connection board
56:穿孔 56: perforation
57:凹面 57: Concave
58:對接構造 58: Butt structure
59:補強板 59: Reinforcing board
591:焊板 591: welding plate
593:導電片 593: conductive sheet
60:第一端子 60: first terminal
61:延伸部 61: Extension
62:第一接點 62: First contact
63:第一接點 63: first contact
64:接腳 64: pin
66:前端 66: front end
70:第二端子 70: Second terminal
71:延伸部 71: Extension
72:第二接點 72: Second contact
80:偵測構造 80: Detect Structure
81:可動端子 81: Movable terminal
82:可動端子 82: Movable terminal
83:固定端子 83: Fixed terminal
85:凸點 85: bump
86:接點 86: contact
90:切換開關裝置 90: Diverter switch device
91:滑動鈕 91:Sliding button
92:滑槽 92: Chute
93:導電部 93: Conductive part
圖1 係習知之隨身碟之立體圖。 Fig. 1 is a three-dimensional view of a conventional flash drive.
圖2 係習知之隨身碟之前視剖面圖。 Fig. 2 is a front sectional view of a known flash drive.
圖3 係習知之電連接母座前視圖。 Fig. 3 is a front view of a conventional electrical connection socket.
圖4 係習知之隨身碟插入電連接母座前視圖。 Fig. 4 is a front view of a conventional USB flash drive inserted into an electrical connection socket.
圖5 係本發明第一實施例之立體分解圖。 Fig. 5 is a three-dimensional exploded view of the first embodiment of the present invention.
圖6 係本發明第一實施例之立體組合圖。 Fig. 6 is a three-dimensional assembled view of the first embodiment of the present invention.
圖7 係本發明第一實施例之前視剖面圖。 Fig. 7 is a front sectional view of the first embodiment of the present invention.
圖8 係本發明第一實施例之二排第一接點串接示意圖。 Fig. 8 is a schematic diagram of the series connection of two rows of first contacts in the first embodiment of the present invention.
圖9 係本發明第一實施例之使用狀態圖。 Fig. 9 is a diagram of the use state of the first embodiment of the present invention.
圖10係本發明第二實施例之立體組合圖。 Fig. 10 is a three-dimensional assembled view of the second embodiment of the present invention.
圖11係本發明第二實施例之前視剖面圖。 Fig. 11 is a front sectional view of the second embodiment of the present invention.
圖12係本發明第三實施例之立體組合圖。 Fig. 12 is a three-dimensional assembled view of the third embodiment of the present invention.
圖13係本發明第三實施例之二排第一接點串接示意圖。 Fig. 13 is a schematic diagram of the series connection of two rows of first contacts in the third embodiment of the present invention.
圖14係本發明第四實施例之側視剖面圖。 Fig. 14 is a side sectional view of the fourth embodiment of the present invention.
圖15係本發明第四實施例之前視圖。 Fig. 15 is a front view of a fourth embodiment of the present invention.
圖16係本發明第五實施例之立體組合圖。 Fig. 16 is a three-dimensional assembled view of the fifth embodiment of the present invention.
圖17係本發明第六實施例之立體分解圖。 Fig. 17 is an exploded perspective view of the sixth embodiment of the present invention.
圖18係本發明第六實施例之立體組合圖。 Fig. 18 is a three-dimensional assembled view of the sixth embodiment of the present invention.
圖19係本發明第七實施例之立體組合圖。 Fig. 19 is a three-dimensional assembled view of the seventh embodiment of the present invention.
圖20係本發明第八實施例正面之立體組合圖。 Fig. 20 is a three-dimensional assembled view of the front of the eighth embodiment of the present invention.
圖21係本發明第八實施例反面之立體組合圖。 Fig. 21 is a three-dimensional assembled view of the reverse side of the eighth embodiment of the present invention.
圖22係本發明第九實施例之側視剖面圖。 Fig. 22 is a side sectional view of the ninth embodiment of the present invention.
圖23係本發明第十實施例之側視剖面圖。 Fig. 23 is a side sectional view of the tenth embodiment of the present invention.
圖24係本發明第十一實施例之側視剖面圖。 Fig. 24 is a side sectional view of an eleventh embodiment of the present invention.
圖25係本發明第十二實施例之立體組合圖。 Fig. 25 is a three-dimensional assembled view of the twelfth embodiment of the present invention.
圖26係本發明第十二實施例之前視剖面圖。 Fig. 26 is a front sectional view of the twelfth embodiment of the present invention.
圖27係本發明第十二實施例之側視剖面圖。 Fig. 27 is a side sectional view of a twelfth embodiment of the present invention.
圖28係本發明第十二實施例之切換開關裝置及控制電路示意圖。 Fig. 28 is a schematic diagram of a switch device and a control circuit according to a twelfth embodiment of the present invention.
圖29係本發明第十二實施例之切換開關裝置及控制電路示意圖。 Fig. 29 is a schematic diagram of a switch device and a control circuit according to a twelfth embodiment of the present invention.
圖30係本發明第十二實施例之切換開關裝置及控制電路示意圖。 Fig. 30 is a schematic diagram of a switch device and a control circuit according to a twelfth embodiment of the present invention.
圖31係本發明第十三實施例之切換開關裝置及控制電路示意圖。 Fig. 31 is a schematic diagram of a switch device and a control circuit according to a thirteenth embodiment of the present invention.
圖32係本發明第十四實施例之切換開關裝置及控制電路示意圖。 Fig. 32 is a schematic diagram of a changeover switch device and a control circuit according to a fourteenth embodiment of the present invention.
圖33係本發明第十五實施例之正面平面圖。 Fig. 33 is a front plan view of the fifteenth embodiment of the present invention.
圖34係本發明第十五實施例之反面平面圖。 Fig. 34 is a reverse plan view of the fifteenth embodiment of the present invention.
圖35係本發明第十六實施例之前視剖面圖。 Fig. 35 is a front sectional view of the sixteenth embodiment of the present invention.
圖36係本發明第十七實施例之正面平面圖。 Fig. 36 is a front plan view of a seventeenth embodiment of the present invention.
圖37係本發明第十七實施例之反面平面圖。 Fig. 37 is a reverse plan view of the seventeenth embodiment of the present invention.
圖38係本發明第十八實施例之上視圖。 Fig. 38 is a top view of the eighteenth embodiment of the present invention.
圖39係本發明第十八實施例之側視剖面圖。 Fig. 39 is a side sectional view of an eighteenth embodiment of the present invention.
圖39A係本發明第十八實施例之前視剖面圖。 Fig. 39A is a front sectional view of the eighteenth embodiment of the present invention.
圖40係本發明第十九實施例之立體組合圖。 Fig. 40 is a three-dimensional assembled view of the nineteenth embodiment of the present invention.
圖41係本發明第十九實施例之側視剖面圖。 Fig. 41 is a side sectional view of a nineteenth embodiment of the present invention.
圖42係本發明第二十實施例之側視剖面圖。 Fig. 42 is a side sectional view of a twentieth embodiment of the present invention.
圖43係本發明第二十一實施例之側視剖面圖。 Fig. 43 is a side sectional view of the twenty-first embodiment of the present invention.
圖44係本發明第二十一實施例之前視剖面圖。 Fig. 44 is a front sectional view of the twenty-first embodiment of the present invention.
圖45係本發明第二十二實施例之側視剖面圖。 Fig. 45 is a side sectional view of the twenty-second embodiment of the present invention.
圖46係本發明第二十二實施例之前視圖。 Fig. 46 is a front view of the twenty-second embodiment of the present invention.
圖47係本發明第二十三實施例之側視剖面圖。 Fig. 47 is a side sectional view of the twenty-third embodiment of the present invention.
圖48係本發明第二十三實施例之連接板立體圖。 Fig. 48 is a perspective view of the connecting plate of the twenty-third embodiment of the present invention.
圖49係本發明第二十四實施例之立體組合圖。 Fig. 49 is a three-dimensional assembled view of the twenty-fourth embodiment of the present invention.
圖50係本發明第二十五實施例之立體組合圖。 Fig. 50 is a three-dimensional assembled view of the twenty-fifth embodiment of the present invention.
圖51係本發明第二十六實施例之立體組合圖。 Fig. 51 is a three-dimensional assembled view of the twenty-sixth embodiment of the present invention.
圖52係本發明第二十七實施例之側視剖面圖。 Fig. 52 is a side sectional view of the twenty-seventh embodiment of the present invention.
圖53係本發明第二十八實施例之側視剖面圖。 Fig. 53 is a side sectional view of the twenty-eighth embodiment of the present invention.
圖54係本發明第二十九實施例之側視剖面圖。 Fig. 54 is a side sectional view of the twenty-ninth embodiment of the present invention.
圖55係本發明第三十實施例之側視剖面圖。 Fig. 55 is a side sectional view of a thirtieth embodiment of the present invention.
圖56係本發明第三十一實施例之立體組合圖。 Fig. 56 is a three-dimensional assembled view of the thirty-first embodiment of the present invention.
圖57係本發明第三十一實施例之前視剖面圖。 Fig. 57 is a front sectional view of the thirty-first embodiment of the present invention.
圖58係本發明第三十二實施例之立體組合圖。 Fig. 58 is a three-dimensional assembled view of the thirty-second embodiment of the present invention.
圖59係本發明第三十三實施例之立體組合圖。 Fig. 59 is a three-dimensional assembled view of the thirty-third embodiment of the present invention.
圖60係本發明第三十四實施例之上視圖。 Fig. 60 is a top view of the thirty-fourth embodiment of the present invention.
圖61係本發明第三十四實施例之側視剖面圖。 Fig. 61 is a side sectional view of a thirty-fourth embodiment of the present invention.
圖62係本發明第三十四實施例之前視剖面圖。 Fig. 62 is a front sectional view of the thirty-fourth embodiment of the present invention.
圖63係本發明第三十四實施例之立體圖。 Fig. 63 is a perspective view of the thirty-fourth embodiment of the present invention.
圖63A 係本發明第三十四實施例之另一立體圖。 Fig. 63A is another perspective view of the thirty-fourth embodiment of the present invention.
圖64係本發明第三十五實施例之立體圖。 Fig. 64 is a perspective view of the thirty-fifth embodiment of the present invention.
圖65係本發明第三十六實施例之側視剖面圖。 Fig. 65 is a side sectional view of a thirty-sixth embodiment of the present invention.
圖66係本發明第三十七實施例之側視剖面圖。 Fig. 66 is a side sectional view of a thirty-seventh embodiment of the present invention.
圖67係本發明第三十八實施例之側視剖面圖。 Fig. 67 is a side sectional view of a thirty-eighth embodiment of the present invention.
圖68係本發明第三十八實施例之前視剖面圖。 Fig. 68 is a front sectional view of the thirty-eighth embodiment of the present invention.
圖69係本發明第三十九實施例之上視圖。 Fig. 69 is a top view of the thirty-ninth embodiment of the present invention.
圖70係本發明第三十九實施例之側視剖面圖。 Fig. 70 is a side sectional view of the thirty-ninth embodiment of the present invention.
圖71係本發明第三十九實施例之前視剖面圖。 Fig. 71 is a front sectional view of the thirty-ninth embodiment of the present invention.
圖72係本發明第四十實施例之上視圖。 Fig. 72 is a top view of the fortieth embodiment of the present invention.
圖73係本發明第四十實施例之側視剖面圖。 Fig. 73 is a side sectional view of a fortieth embodiment of the present invention.
圖74係本發明第四十實施例之前視剖面圖。 Fig. 74 is a front sectional view of the fortieth embodiment of the present invention.
圖75係本發明第四十一實施例之上視圖。 Fig. 75 is a top view of the forty-first embodiment of the present invention.
圖76係本發明第四十一實施例之側視剖面圖。 Fig. 76 is a side sectional view of a forty-first embodiment of the present invention.
圖77係本發明第四十一實施例之前視圖。 Fig. 77 is a front view of the forty-first embodiment of the present invention.
圖78係本發明第四十二實施例之側視剖面圖。 Fig. 78 is a side sectional view of a forty-second embodiment of the present invention.
圖79係本發明第四十三實施例之側視剖面圖。 Fig. 79 is a side sectional view of a forty-third embodiment of the present invention.
圖80係本發明第四十四實施例之側視剖面圖。 Fig. 80 is a side sectional view of a forty-fourth embodiment of the present invention.
圖81係本發明第四十五實施例之上視圖。 Fig. 81 is a top view of the forty-fifth embodiment of the present invention.
圖82係本發明第四十五實施例之側視剖面圖。 Fig. 82 is a side sectional view of a forty-fifth embodiment of the present invention.
圖83係本發明第四十五實施例之前視剖面圖。 Fig. 83 is a front sectional view of the forty-fifth embodiment of the present invention.
圖84係本發明第四十六實施例之立體圖(外覆體取下)。 Fig. 84 is a perspective view of the forty-sixth embodiment of the present invention (with the outer cover removed).
圖85係本發明第四十六實施例之立體圖。 Fig. 85 is a perspective view of the forty-sixth embodiment of the present invention.
圖86係本發明第四十七實施例之側視剖面圖。 Fig. 86 is a side sectional view of a forty-seventh embodiment of the present invention.
圖87係本發明第四十八實施例之立體圖。 Fig. 87 is a perspective view of the forty-eighth embodiment of the present invention.
圖88係本發明第四十八實施例之側視剖面圖。 Fig. 88 is a side sectional view of a forty-eighth embodiment of the present invention.
圖89係本發明第四十九實施例之側視剖面圖。 Fig. 89 is a side sectional view of a forty-ninth embodiment of the present invention.
圖90係本發明第四十九實施例之後視剖面圖。 Fig. 90 is a rear sectional view of the forty-ninth embodiment of the present invention.
圖91係本發明第五十實施例之後視圖。 Fig. 91 is a rear view of the fiftieth embodiment of the present invention.
圖92係本發明第五十一實施例之後視圖。 Fig. 92 is a rear view of the fifty-first embodiment of the present invention.
圖93係本發明第五十二實施例之後視圖。 Fig. 93 is a rear view of the fifty-second embodiment of the present invention.
圖94係本發明第五十三實施例之側視剖面圖。 Fig. 94 is a side sectional view of the fifty-third embodiment of the present invention.
圖95係本發明第五十三實施例之後視圖。 Fig. 95 is a rear view of the fifty-third embodiment of the present invention.
圖96係本發明第五十四實施例之側視剖面圖。 Fig. 96 is a side sectional view of a fifty-fourth embodiment of the present invention.
圖97係本發明第五十四實施例之後視圖。 Fig. 97 is a rear view of the fifty-fourth embodiment of the present invention.
圖98係本發明第五十五實施例之側視剖面圖。 Fig. 98 is a side sectional view of a fifty-fifth embodiment of the present invention.
圖99係本發明第五十五實施例之後視圖。 Fig. 99 is a rear view of the fifty-fifth embodiment of the present invention.
圖100係本發明第五十六實施例之後視圖。 Fig. 100 is a rear view of the fifty-sixth embodiment of the present invention.
圖101係本發明第五十七實施例之後視圖。 Fig. 101 is a rear view of the fifty-seventh embodiment of the present invention.
圖102係本發明第五十八實施例之後視圖。 Fig. 102 is a rear view of the fifty-eighth embodiment of the present invention.
圖103係本發明第五十九實施例之後視圖。 Fig. 103 is a rear view of the fifty-ninth embodiment of the present invention.
圖104係本發明第六十實施例之側視剖面圖。 Fig. 104 is a side sectional view of a sixtieth embodiment of the present invention.
圖105係本發明第六十實施例之前視剖面圖。 Fig. 105 is a front sectional view of the sixtieth embodiment of the present invention.
圖106係本發明第六十實施例之立體組合圖。 Fig. 106 is a three-dimensional assembled view of the sixtieth embodiment of the present invention.
圖107係本發明第六十實施例之底層立體圖。 Fig. 107 is a bottom perspective view of the sixtieth embodiment of the present invention.
圖108係本發明第六十一實施例之立體組合圖。 Fig. 108 is a three-dimensional assembled view of the sixty-first embodiment of the present invention.
圖109係本發明第六十二實施例之立體組合圖。 Fig. 109 is a three-dimensional assembled view of the sixty-second embodiment of the present invention.
圖110係本發明第六十三實施例之立體分解圖。 Fig. 110 is an exploded perspective view of the sixty-third embodiment of the present invention.
圖111係本發明第六十四實施例之正面立體分解圖。 Fig. 111 is a front perspective exploded view of the sixty-fourth embodiment of the present invention.
圖112係本發明第六十四實施例之反面立體分解圖。 Fig. 112 is an exploded perspective view of the reverse side of the sixty-fourth embodiment of the present invention.
圖113係本發明第六十四實施例封膠後之正面立體分解圖。 Fig. 113 is a front perspective exploded view of the sixty-fourth embodiment of the present invention after sealing.
圖114係本發明第六十四實施例封膠後之正面立體組合圖。 Fig. 114 is a front perspective assembled view of the sixty-fourth embodiment of the present invention after sealing.
圖115係本發明第六十五實施例封膠後之正面立體分解圖。 Fig. 115 is a front perspective exploded view of the sixty-fifth embodiment of the present invention after sealing.
圖116係本發明第六十五實施例封膠後之正面立體組合圖。 Fig. 116 is a front perspective assembled view of the sixty-fifth embodiment of the present invention after sealing.
請參閱圖5、圖6、及圖7,係為本發明第一實施例,其係為一USB2.0規格之隨身碟,其可正反雙面電連接一電連接母座,其包括一外覆體30、一電路板40、一連接板55、一電子單元4及一限位構造50,其中:
Please refer to Figure 5, Figure 6, and Figure 7, which are the first embodiment of the present invention, which is a USB2.0 flash drive, which can be electrically connected to an electrical connection socket on both sides, which includes a The
本實施例中之連接板55為一連接部。
The connecting
該外覆體30為一塑膠材質,其設有一下座31及一上蓋32,該下座31設有一容室33。
The
該電路板40置於該外覆體30之容室33,該電路板40之後段為該外覆體30所包覆,該電路板40之前段露出該外覆體30外,即為該連接板55,故該連接板55係直接接觸並固定於該外覆體30,該連接板55之兩板面(上下板面)各設有一排第一接點41,該二排第一接點41係為電路板40上形成之電路接點,該二排第一接點41皆為4個,可分別傳送1.VCC(電源)、2.USB D-(訊號)、3.USB D+(訊號)及4.GND(接地)等電路,該二排第一接點41係為平貼接點且相同之連接介面且電路序號相互為反向排列,如圖7所示,該連接板55上板面之一排第一接點41之電路序號由右至左為a1,a2,a3,a4,該連接板55下板面之一排第一接點41之電路序號由右至左為b4,b3,b2,b1。另外,該連接板55之形狀正反面對稱,故可正反雙面對接定位於一電連接母座。
The circuit board 40 is placed in the chamber 33 of the outer covering body 30, the rear section of the circuit board 40 is covered by the outer covering body 30, and the front section of the circuit board 40 is exposed outside the outer covering body 30, which is the connection plate 55, so the connection plate 55 is in direct contact with and fixed on the outer covering body 30, and the two board surfaces (upper and lower board surfaces) of the connection board 55 are each provided with a row of first contact points 41, and the two rows of first contact points 41 is the circuit contact formed on the circuit board 40, and the first contact 41 of the second row is 4, which can transmit 1.VCC (power supply), 2.USB D- (signal), 3.USB D+ ( signal) and 4.GND (grounding) and other circuits, the two rows of first contacts 41 are flat contacts with the same connection interface and the circuit numbers are arranged in reverse order, as shown in Figure 7, the connection plate 55 The circuit number of a row of the first contact 41 on the upper plate is a1, a2, a3, a4 from right to left, and the circuit number of a row of the first contact 41 on the lower plate of the connecting plate 55 is from right to left: b4, b3, b2, b1. In addition, the shape of the connecting
該外覆體30及連接板55結合成一對接構造,下述第二實施例至第六十五實施例皆同為外覆體30及連接板55結合成一對接構造,即連接板55為對接構造之一部份。
The
請參閱圖8,該二排第一接點41相同之電路序號者電連接而串接成一組,即a1和b1電連接,a2和b2電連接,a3和b3電連接,a4和b4電連接,其中a1和b1係為電源接點,絕不可造成短路,故a1和b1皆先經一蕭基二極體46再相互電連接,該蕭基二極體46之作用主要是防止電流逆流,如此可達到防短路效果。
Please refer to Fig. 8, those with the same circuit number of the
上述使用蕭基二極體防短路係為一種電子式防逆流或防短路之電路安 全保護手段的一種方式,然而亦有多種方式如設置防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段,藉以達到電路安全保護效果。 The above-mentioned use of Schottky diodes to prevent short-circuit is an electronic anti-backflow or anti-short circuit safety device. One way of full protection means, but there are also many ways such as setting anti-backflow electronic components or anti-short circuit electronic components or circuit safety protection components or safety circuit setting means to achieve the effect of circuit safety protection.
該電子單元4為一儲存單元,其電連接於該電路板40上且為該外覆體30所包覆,其包括一記憶體43及一控制電路45,該記憶體43可為但不限於快閃記憶體(flash memory)或唯讀記憶體(ROM),該記憶體43之容量大小不限,該控制電路45係控制該電子單元之記憶體43之運作,該二排第一接點41電連接該電子單元4。
The
該限位構造50與該外覆體30一體成型,該限位構造50於該連接板55兩板面分別形成四條前後方向之凸肋,該限位構造50較該連接板55兩板面之第一接點41凸出藉以保護該二排第一接點41及防止短路,該連接板55上設有二貫穿孔42配合該限位構造50中間之二條凸肋。
The limiting
請參閱圖9,藉由以上構造,本實施例之隨身碟3插入一電連接母座20時,由於該連接板之形狀可正反雙面對接定位於該電連接母座20且該連接板兩板面設有相同之連接介面且電路序號相互為反向排列之二排第一接點41,故使用者採任一板面插入電連接母座20之連接槽21均可定位並電連接,如圖所示,當一排第一接點a1、a2、a3、a4與電連接母座20之一排接點23電連接時,電連接母座20之彈片24係抵到另一板面之限位構造50而不致碰觸該第一接點b1、b4造成短路。再者由於該第一接點b1係電連接該蕭基二極體46,故電流不會逆流至第一接點b1,故更可確保該電源接點即第一接點b1不會短路。
Please refer to Fig. 9, by the above structure, when the
另外,本實施例更可包括一控制手段與該USB2.0規格之隨身碟相結 合,以對該儲存單元進行一資料儲存與控制程序。 In addition, this embodiment may further include a control means combined with the flash drive of the USB2.0 specification combined to perform a data storage and control program on the storage unit.
上述實施例之外覆體30為一塑膠殼體,該電子單元4係焊接於該電路板,該外覆體30將該電路板40及電子單元4包覆,然而為了使整體隨身碟較為輕薄,該電子單元4之記憶體及控制電路亦可採晶片直接封裝方式(Chip On Board,簡稱COB)封裝於電路板40上,如此該電子單元4同樣電連接於電路板且為一外覆體封裝包覆,採COB方式者仍屬本發明之範圍。
The
請參閱圖10及圖11,係本發明第二實施例,其大致與第一實施例相同,其差異在於本實施例之限位構造50為一金屬層,係以電鍍方式鍍在該連接板55兩板面之兩側。
Please refer to Fig. 10 and Fig. 11, it is the second embodiment of the present invention, which is roughly the same as the first embodiment, the difference is that the limiting
請參閱圖12及圖13,係本發明第三實施例,其大致與第二實施例相伺,其差異在於本實施例之連接板55兩板面完全沒有設限位構造,為了確保不短路,一排第一接點a1、a2、a3、a4及一排第一接點b1、b2、b3、b4皆各自電連接一蕭基二極體46,防止電流逆流,達到防短路效果。
Please refer to Fig. 12 and Fig. 13, which is the third embodiment of the present invention, which is roughly the same as the second embodiment. A row of first contacts a1, a2, a3, a4 and a row of first contacts b1, b2, b3, b4 are respectively electrically connected to a
請參閱圖14及圖15,係本發明第四實施例,其大致與第一實施例相同,本實施例同樣設有一外覆體30、一電路板40、一連接板55及一電子單元及一限位構造50,其差異在於該連接板55與該外覆體30一體成型,其設有一排四個第一端子60及一偵測構造80,每一第一端子60設有第一接點62、63分別平貼於該連接板55之兩板面,該偵測構造80固定於外覆體30,其設有二可動端子81、82及一固定端子83,該二可動端子81、82位於該固定端子83之上、下方且皆設有一凸點85及一接點86,該兩凸點分別凸出該連接板55上、下板面,該兩接點86接近該固定端子83,當本實施例之隨身碟正面插入電連接母座電連接時,若是該一排第一接點62電連接該電連接母座時,該可動端子
81被觸壓而與固定端子83導通完成偵測,如此控制電路可知得是該一排第一接點62電連接而採用對應之電路訊號傳輸;反之,隨身碟反面插入電連接母座電連接時,則是該一排第一接點63電連接該電連接母座時,該可動端子82被觸壓而與固定端子83導通完成偵測,如此控制電路可知是該一排第一接點63電連接而可作與前述相反電路訊號傳輸。
Please refer to Fig. 14 and Fig. 15, it is the fourth embodiment of the present invention, and it is substantially the same as the first embodiment, and this embodiment is also provided with an
請參閱圖16,係本發明第五實施例,其係為一USB3.0規格之隨身碟,其大致與第一實施例相同,本實施例同樣設有一外覆體30、一電路板40、一連接板55及一電子單元及一限位構造50,其差異在於本實施增設有二排各五個第二端子70,該第二端子70設有一可彈動之延伸部71,該延伸部71一端延伸至該連接板55並設有一凸出之第二接點72,該延伸部另一端設有接腳焊接於該電路板40而與該電子單元電連接,該二排第二接點72分別凸出該連接板55之兩板面且位於該二排第一接點41之後,該第二接點72可隨該延伸部71上下彈動。
Please refer to Fig. 16, which is the fifth embodiment of the present invention, which is a flash drive with USB3.0 specification, which is roughly the same as the first embodiment, and this embodiment is also provided with an
請參閱圖17及圖18,係為本發明第六實施例,其係為一USB3.0規格之隨身碟,其可正反雙面電連接一電連接母座,其包括一外覆體30、一電路板40、一連接板55、一電子單元4、二排第一端子60及二排第二端子70,其中:
Please refer to Fig. 17 and Fig. 18, it is the sixth embodiment of the present invention, it is a USB3.0 standard flash drive, it can be electrically connected to an electrical connection socket on both sides, and it includes an
該外覆體30為一塑膠材質,其設有一下座31及一上蓋32,該下座31設有一容室33。
The
該電路板40置於該外覆體30之容室33,該電路板40為該外覆體30所包覆
The
該連接板55一體成型設於該外覆體30前端,該連接板55之形狀可正反雙面對接定位於該電連接母座,該連接板55上下板面皆設有一排四個凹面57且該凹面57之後設有一排5個穿孔56。
The
該電子單元4為一儲存單元,其電連接於該電路板40上且為該外覆體30所包覆,其包括一記憶體43及一控制電路45,該記憶體43之容量大小不限,該控制電路45係控制該電子單元之記憶體43之運作。
The
該二排第一端子60各自為4個,該第一端子60設有不可彈動之延伸部61,該延伸部61一端延伸至該連接板55並設有一第一接點62平貼於該凹面57,該第一接點62為平貼接點,該延伸部61另一端設有接腳焊接於該電路板40而與該電子單元4電連接,該二排第一接點62為前排接點分別平貼該連接板55兩板面之凹面57。
There are four
該二排第二端子70各自為5個,該第二端子70設有一可彈動之延伸部71,該延伸部一端延伸至該連接板55並設有一凸出之第二接點72,該延伸部另一端設有接腳焊接於該電路板40而與該電子單元4電連接,該二排第二接點72為後排接點分別凸出該連接板55之兩板面且位於該二排第一接點62之後,該第二接點72可隨該延伸部71上下彈動。
There are five
依USB協會規範之USB3.0連接介面係為前排4個第一接點,分別為1.VBUS(電源)、2.USB D-(訊號)、3.USB D+(訊號)及4.GND(接地)等電路,後排5個第二接點,分別為5.RX-(訊號)、6.RX+(訊號)、7.GND(接地)、8.TX-(訊號)、9.TX+(訊號)等電路,此為USB協會規範在此補述。 According to the USB Association standard, the USB3.0 connection interface is the first 4 contacts in the front row, which are 1.VBUS (power supply), 2.USB D- (signal), 3.USB D+ (signal) and 4.GND (Ground) and other circuits, the 5 second contacts in the back row are 5.RX-(signal), 6.RX+(signal), 7.GND(ground), 8.TX-(signal), 9.TX+ (Signal) and other circuits, this is the specification of the USB Association.
本實施之二排第一接點62及二排第二接點72皆係為相同之連接介面且電路序號相互為反向排列,其中a7和b7是相同電路且上下對齊,本實施雖未設有限位構造,然而可設置電子式防逆流或防短路之電路安全保護手段的一種方式,然而亦有多種方式如設置蕭基二極體或防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段,藉以達到電路安
全保護效果。
The
請參閱圖19,係本發明第七實施例,其大致與第六實施例相同,其差異在於本實施例設有凸出該連接板55兩板面之限位構造50。
Please refer to FIG. 19 , which is the seventh embodiment of the present invention, which is roughly the same as the sixth embodiment, the difference being that this embodiment is provided with a position-limiting
請參閱圖20及圖21,係本發明第八實施例,其大致與第五實施例相同,其差異在於本實施例之電子單元更設有一記憶體44,連接板55一板面之連接介面係電連接該記憶體43,其與第五實施例為相同介面,皆為USB3.0之連接介面,而連接板55另一板面係設有一排9個第一接點41,其係為miCard之連接介面,該一排9個第一接點41電連接該記憶體44。
Please refer to Fig. 20 and Fig. 21, it is the eighth embodiment of the present invention, and it is roughly the same as the fifth embodiment, and its difference is that the electronic unit of this embodiment is further provided with a
請參閱圖22,係本發明第九實施例,其係為一USB3.0規格之隨身碟,其大致與第七實施例相同,本實施例同樣設有一外覆體30、一電路板40、一連接板55及一電子單元4、二排第一端子60及二排第二端子70及一限位構造,其差異在於本實施例增設有一偵測構造,該偵測構造包括有二可動端子及二接點,該二可動端子分別為二排第二端子70中之一端子,該二接點分別為設於該電路板40兩板面之接點417、418,該接點417、418電連接控制電路45,該電子單元4之控制電路45包括有安全電路設置手段,在使用上,當隨身碟正面插入電連接母座,當連接板55上板面之一排第一端子60及一排第二端子70電連接該電連接母座時,該其中一第二端子70與該接點417導通而完成偵測,如此控制電路45可知是連接板55上板面之一排第一端子60及一排第二端子70電連接該電連接母座,而可作適當之電路安全保護,防止連接板55下板面之一排第一端子60及一排第二端子70造成短路;反之,當隨身碟反面插入電連接母座,當連接板55下板面之一排第一端子60及一排第二端子70電連接該電連接母座時,該其中一第二端子70與該接點418導通而完成
偵測,如此控制電路45可知是連接板55下板面之一排第一端子60及一排第二端子70電連接該電連接母座,而可作適當之電路安全保護,防止連接板55上板面之一排第一端子60及一排第二端子70造成短路。
Please refer to FIG. 22 , which is the ninth embodiment of the present invention, which is a flash drive with USB3.0 specification, which is roughly the same as the seventh embodiment. This embodiment is also provided with an
請參閱圖23,係本發明第十實施例,其係為一USB3.0規格之隨身碟,其大致與第九實施例相同,其差異在於本實施僅設有一排第一端子60,每一第一端子60設有第一接點62、63分別平貼於該連接板55之兩板面。
Please refer to Fig. 23, which is the tenth embodiment of the present invention, which is a flash drive with USB3. The
請參閱圖24,係本發明第十一實施例,其係為一USB3.0規格之隨身碟,其大致與第九實施例相同,其差異在於本實施例電子單元4除了包括有一記憶體43及一控制電路45外更包括有另一記憶體44,該連接板55一板面之一排第一端子60之第一接點及一排第二端子70之第二接點電連接該記憶體43,而該連接板另一板面之一排第一端子60之第一接點及一排第二端子70之第二接點電連接該記憶體44。
Please refer to Fig. 24, which is the eleventh embodiment of the present invention, which is a USB3.0 flash drive, which is roughly the same as the ninth embodiment, except that the
請參閱圖25、圖26及圖27,係本發明第十二實施例,其係為一USB2.0規格之隨身碟,其大致與第一、二實施例相同,其差異在於本實施例之電子單元4除了包括有一記憶體43(A)及一控制電路45外更包括有另一記憶體44(B),另外設有一切換開關裝置90,該切換開關裝置90係於該外覆體30上設有一滑動鈕91及一滑槽92,該滑動鈕91可於該滑槽92滑動作A、B及C之切換,如圖28所示,該滑動鈕91內面設有二排導電部93,該二排導電部93各為四個,該控制電路45設有一IC控制晶片47,該二排第一接點41係為相同連接介面且電路序號相互為反向排列,兩者相同之電路序號者電連接而串接成一組後與該IC控制晶片47電連接,該IC控制晶片47分別各藉由四條電路49電連接該記憶體A及記憶體B,每該條電路49各設有一對分開之接點48,該
四條電連接該記憶體A之電路之4對接點48成一排,該四條電連接該記憶體B之電路之4對接點48亦成一排,該滑動鈕91之二排導電部93可單一導接該四條電連接該記憶體A之電路之4對接點48或單一導接該四條電連接該記憶體B之電路之4對接點48或同時導接該四條電連接該記憶體A之電路之4對接點48和該四條電連接該記憶體B之電路之4對接點48。
Please refer to Fig. 25, Fig. 26 and Fig. 27, it is the twelfth embodiment of the present invention, which is a USB2. In addition to including a memory 43 (A) and a
請參閱圖28,當滑動鈕91切換至A位置時,該滑動鈕91之一排導電部93係單一導接該四條電連接該記憶體A之電路之4對接點48,此時該記憶體A可雙面作電連接,該控制電路45僅對記憶體A運作,而該記憶體B此時成斷路狀態而可防讀寫;請參閱圖29,當滑動鈕91切換至B位置時,該滑動鈕91之一排導電部93係單一導接該四條電連接該記憶體B之電路之4對接點48,此時該記憶體B可雙面作電連接,該控制電路45僅對記憶體B運作,而該記憶體A此時成斷路狀態而可防讀寫;請參閱圖30,當滑動鈕91切換至C位置時,該滑動鈕91之二排導電部93係同時導接該四條電連接該記憶體A之電路之4對接點48和該四條電連接該記憶體B之電路之4對接點48,此時該記憶體A及B均可雙面作電連接,該控制電路45同時對記憶體A及B運作。
Please refer to Fig. 28, when the sliding
請參閱圖31,係本發明第十三實施例,其係為一USB2.0規格之隨身碟,其大致與第十二實施例相同,其差異在於本實施例之控制電路45設有二IC控制晶片47,一IC控制晶片47電連接該記憶體A及一排第一接點a1、a2、a3、a4,另一IC控制晶片47電連接該記憶體B及一排第一接點b1、b2、b3、b4。
Please refer to Fig. 31, which is the thirteenth embodiment of the present invention, which is a USB2.0 standard flash drive, which is roughly the same as the twelfth embodiment, and the difference is that the
請參閱圖32,係本發明第十四實施例,其係為一USB2.0規格之隨身碟,其大致與第十二實施例相同,其差異在於本實施例之控制電路45設有二IC控制晶片47,一IC控制晶片47電連接該記憶體A,另一IC控制晶片47電連接
該記憶體B。
Please refer to Fig. 32, which is the fourteenth embodiment of the present invention, which is a USB2.0 flash drive, which is roughly the same as the twelfth embodiment, and the difference is that the
請參閱圖33及圖34,係為本發明第十五實施例,其係為一安全數碼卡(Secure Digital Card簡稱SDC),其可正反雙面電連接一電連接母座,其包括一外覆體30、一電路板40、一連接板55、一限位構造50及一電子單元4,其中:
Please refer to Fig. 33 and Fig. 34, it is the fifteenth embodiment of the present invention, it is a secure digital card (Secure Digital Card referred to as SDC), and it can be electrically connected to an electrical connection socket on both sides, which includes a The
該外覆體30為一塑膠材質。
The
該連接板55一體成型設於該外覆體30前端,該連接板55之形狀左右對稱,故可正反雙面對接定位於該電連接母座。
The
該電路板40為該外覆體30所包覆,該電路板40之前段延伸至該連接板55,該電路板40之前段兩板面各設有一排第一接點41,以網狀線所示,該二排第一接點41露出該連接板55兩板面,該二排第一接點41皆為9個係為相同之連接介面且電路序號相互為反向排列,該二排第一接點41為設有多個較長平貼接點及多個較短平貼接點,另外,該連接板55之形狀正反面對稱,故可正反雙面對接定位於一電連接母座。
The
該電子單元4為一儲存單元,其電連接於該電路板40上且為該外覆體30所包覆,該二排第一接點41電連接該電子單元4。
The
該限位構造50亦與該外覆體30和連接板55一體成型,該限位構造50設於該連接板55兩板面且較該二排第一接點41為凸出,藉以防止二排第一接點41刮傷及短路。
The limiting
藉由以上構造,該SDC正反雙面插入一電連接母座之連接槽均可定位並電連接。 With the above structure, the front and back sides of the SDC can be inserted into the connection groove of an electrical connection socket and can be positioned and electrically connected.
另外,有關miCard、micro SDC、mini SDC、記憶條卡(Memory Stick Card 簡稱MSC)、記憶條小卡(Memory Stick Dou Card簡稱MS-Dou C)….等等其他記憶卡皆可如第十五實施例般實施。 In addition, about miCard, micro SDC, mini SDC, Memory Stick Card (Memory Stick Card MSC for short), memory stick small card (Memory Stick Dou Card for short MS-Dou C)... and other memory cards can be implemented as in the fifteenth embodiment.
請參閱圖35,係本發明第十六實施例,其大致與第七實施例相同,其差異在於本實施例之連接板55兩板面之二排第一接點62係為不同連接介面,且連接板55兩板面之限位構造50亦上下錯開。
Please refer to Fig. 35, which is the sixteenth embodiment of the present invention, which is roughly the same as the seventh embodiment, the difference being that the two rows of first contact points 62 on the two board surfaces of the
請參閱圖36及圖37,係為本發明第十七實施例,其係為一IC晶片卡(簡稱智慧卡),其可正反雙面電連接一電連接母座,其包括一外覆體、一連接板及一電子單元4,其中:
Please refer to Fig. 36 and Fig. 37, it is the seventeenth embodiment of the present invention, it is an IC chip card (smart card for short), and it can be electrically connected to an electrical connection female seat on both sides, and it includes an outer cover Body, a connecting plate and an
該外覆體及連接板係為塑膠材質一體成型呈板片狀之對接構造58,該對接構造58前段為連接板55,其形狀可正反雙面對接定位於一電連接母座,該連接板55之兩板面各平貼設有相同連接介面且電路序號相互為反向排列之一排第一接點62及一排第二接點72,該二排第二接點72位於該二排第一接點62之後。
The outer covering body and the connecting plate are a butt
該電子單元4為一IC晶片,其設於該對接構造58內,且該二排第一接點62及二排第二接點72電連接該電子單元4。
The
藉由以上構造,該IC晶片卡正反雙面插入一電連接母座之連接槽均可定位並電連接。 With the above structure, the front and back sides of the IC chip card can be inserted into the connection groove of an electrical connection female seat and can be positioned and electrically connected.
請參閱圖38、圖39及圖39A,係為本發明第十八實施例,其係為一USB2.0規格之電連接線,其可正反雙面電連接一電連接母座,其包括一外覆體30、一電子單元4、一連接板55及二排第一端子60及一電子單元4,其中:
Please refer to Fig. 38, Fig. 39 and Fig. 39A, which are the eighteenth embodiment of the present invention, which is an electrical connection line of USB2.0 specification, which can be electrically connected to an electrical connection socket on both sides, which includes An
該外覆體30為一塑膠材質。
The
該連接板55一體成型於該外覆體30前端。
The connecting
該電子單元4為一組4條電線419,其為該外覆體30所包覆。
The
該二排第一端子60固定於該外覆體30,該二排第一端子60各自為4個,可分別傳送VCC、USB D-、USB D+及GND等訊號,該第一端子60設有不可彈動之延伸部,該延伸部一端延伸至該連接板55並設有一第一接點62平貼於該連接板55一板面,該延伸部另一端與該電子單元4之一電線電連接,該二排第一接點62分別平貼該連接板55兩板面,該二排第一接點62係為相同之連接介面且電路序號相互為反向排列,如圖39A所示,正面之電路序號由右至左為1,2,3,4,而反面之電路序號由右至左則為4,3,2,1,二排第一接點62相同電路序號者電連接該電子單元4之同一電線。
The two rows of
藉由以上構造,該電連接線正反雙面插入一電連接母座之連接槽均可定位並電連接,而該電連接線的另一端可電連接如鍵盤、滑鼠、LED燈、風扇、轉接器…等等各種電子裝置。 With the above structure, the front and back sides of the electrical connection wire can be inserted into the connection groove of an electrical connection socket to be positioned and electrically connected, and the other end of the electrical connection wire can be electrically connected to such as keyboard, mouse, LED lamp, fan, etc. , adapters... and other electronic devices.
請參閱圖40及圖41,係為本發明第十九實施例,其係為一USB2.0規格之無線收發裝置,其可正反雙面電連接一電連接母座,其包括一外覆體30、一電路板40、一電子單元4、一連接板55、及一限位構造50,其中:
Please refer to Figure 40 and Figure 41, it is the nineteenth embodiment of the present invention, it is a wireless transceiver device of USB2.
該外覆體30為一塑膠材質。
The
該連接板55一體成型於該外覆體30前端。
The connecting
該電路板40之後段為該外覆體30所包覆,該電路板40之前段露出該外覆體30外,即為該連接板55,該連接板55之兩板面設有二排第一接點41,該二排第一接點41係為電路板40上形成之電路接點,該二排第一接點41皆為4個係為相同之連接介面且電路序號相互為反向排列。
The rear section of the
該電子單元4為一無線收發模組,其電連接於該電路板40上且為該外覆
體30所包覆,其可將電子訊號作無線收發,該二排第一接點41電連接該電子單元4。
The
該限位構造50為一金屬層,係以電鍍方式鍍在該連接板55兩板面之兩側,該限位構造50藉以保護該連接板55上之二排第一接點41,避免受到刮傷。
The limiting
藉由以上構造,該無線收發裝置正反雙面插入一電連接母座之連接槽均可定位並電連接。 With the above structure, the front and back sides of the wireless transceiver device can be inserted into the connection groove of an electrical connection female seat and can be positioned and electrically connected.
本實施例之無線收發裝置可為無線網卡、藍牙接收器、2.4G無線傳輸接收器(如無線滑鼠之收發器)…等等電子裝置。 The wireless transceiver device of this embodiment can be a wireless network card, a bluetooth receiver, a 2.4G wireless transmission receiver (such as a wireless mouse transceiver) ... and other electronic devices.
請參閱圖42,係為本發明第二十實施例,其係為一USB3.0規格之轉接電連接器,其可正反雙面電連接一電連接母座,其包括一外覆體30、一電子單元4、一連接板55、一電路板40、二排第一端子60及二排第二端子60,其中:
Please refer to Fig. 42, which is the twentieth embodiment of the present invention, which is a USB3.0 standard transfer electrical connector, which can be electrically connected to an electrical connection socket on both sides, and which includes an
該外覆體30為一塑膠材質。
The
該連接板55為一塑膠板,其結合固定於該外覆體30前端,其後端一體成型一固定座59固定於該外覆體30內,該連接板55露出該外覆體30外。
The connecting
電路板40設於該外覆體30內。
The
該電子單元4為一USB3.0規格之電連接公頭及一轉接電路,其部份為該外覆體30所包覆,其電連接於該電路板40。
The
該二排第一端子60固定於該外覆體30,該二排第一端子60各自為4個,該第一端子60設有不可彈動之延伸部,該延伸部一端延伸至該連接板55並設有一第一接點62平貼於該連接板55一板面,該延伸部另一端與該電路板40焊接而與該電子單元4電連接,該二排第一接點62分別平貼該連接板55兩板
面。
The two rows of
該二排第二端子70各自為5個,該第二端子70設有一可彈動之延伸部,該延伸部一端延伸至該連接板55並設有一凸出之第二接點72,該延伸部另一端設焊接於該電路板40而與該電子單元4電連接,該二排第二接點72分別凸出該連接板55之兩板面且位於該二排第一接點62之後,該第二接點72可隨該延伸部71上下彈動。
There are five
本實施之二排第一接點62及二排第二接點72皆係為相同之連接介面且電路序號相互為反向排列。
In this embodiment, the two rows of
藉由以上構造,該轉接電連接器以該連接板55正反雙面插入一電連接母座之連接槽均可定位並電連接。
With the above structure, the transfer electrical connector can be positioned and electrically connected by inserting the front and back sides of the
請參閱圖43及圖44,係為本發明第二十一實施例,其係為一具有雙連接介面之轉接電連接器,其包括一外覆體30、一電路板40、一連接板55、一電子單元4及一限位構造50,其中:
Please refer to Fig. 43 and Fig. 44, which is the twenty-first embodiment of the present invention, which is a transfer electrical connector with dual connection interfaces, which includes an
該外覆體30為一塑膠材質。
The
該電路板40之後段固定於該外覆體30內,該電路板40之前段露出該外覆體30外,即為該連接板55,該連接板55之兩板面設有二排第一接點41,該二排第一接點41係為電路板40上形成之電路接點,該二排第一接點41係為不同之連接介面。另外,該連接板55之形狀正反面對稱,故可正反雙面對接定位於一電連接母座。
The rear section of the
該電子單元4為一USB2.0規格之電連接母座及一轉接電路,其設於該外覆體30內,其電連接於該電路板40,該二排第一接點41電連接該電子單元4。
The
藉由以上構造,該轉接電連接器以該連接板55正反雙面插入不同連接
介面之電連接母座之連接槽作電連接。
With the above structure, the transfer electrical connector can be inserted into different connections with the front and back sides of the
請參閱圖45及圖46,係本發明第二十二實施例,其係為一USB2.0規格之轉接電連接器,其大致與第二十一實施例相同,其差異在於本實施之二排第一接點41皆為4個係為相同之連接介面且電路序號相互為反向排列,該電子單元4為一雙連接介面之電連接母座及一轉接電路,如圖46所示,該電子單元4之舌片413兩板面分別設有一排第一接點411,該二排第一接點411係為不同之連接介面,該電子單元4設於該外覆體30內,其電連接於該電路板40,該二排第一接點41電連接該電子單元4。
Please refer to Fig. 45 and Fig. 46, which is the twenty-second embodiment of the present invention, which is a USB2.0 specification transfer electrical connector, which is roughly the same as the twenty-first embodiment, and the difference lies in the present implementation The
請參閱圖47及圖48,係本發明第二十三實施例,其係為一USB3.0規格之轉接電連接器,其大致與第二十實施例相同,其差異在於本實施之電子單元4為一雙面電連接之電連接公頭及一轉接電路,該電子單元4之電連接構造之連接槽410之頂面415及底面416皆設有一排第一接點411及一排第二接點412,該頂面之一排第一接點411及一排第二接點412和底面之一排第一接點411及一排第二接點412係為相同之連接介面且電路序號相互為反向排列,該電連接構造之二連接介面電連接該轉接電路,該電連接槽410前端為插入口417,該頂面415及底面416之後段較前段為高,且該第二接點412高於第一接點411,該電連接構造之對接構造設有一外殼體包覆絕緣體;另外該連接板55之上下板面皆設有凸出之限位構造50。
Please refer to Figure 47 and Figure 48, it is the twenty-third embodiment of the present invention, which is a USB3. The
該電子單元4之電連接構造之對接構造之形狀可正反雙面對接定位於一電連接母座,該電連接母座構造型態大致如同圖45所示之電連接母座,該電連接母座之舌片之上下二板面各設有至少一排接點(411),該舌片之上下二板面之至少一排接點分別與該電子單元4之電連接構造之二連接介面
電連接,該電路板40後段兩面各設有一排焊墊401藉以焊接端子60、70之接腳。
The shape of the docking structure of the electrical connection structure of the
另外,圖47右邊之電連接構造之連接板55係可正反雙向對接定位於類似左邊之電連接構造之一電連接構造之連接槽410,該連接槽410之頂面及底面之二排接點分別與該連接板上下二板面之二排接點電連接。
In addition, the
請參閱圖49,係本發明第二十四實施例,其係為一USB2.0規格之隨身碟,其大致與第一實施例相同,其差異在於本實施之連接板55和限位構造50為塑膠一體成型,該連接板55之上下板面各平貼設有一排4個第一接點62,該二排第一接點62形成在二排第一端子60,該二排第一接點62為相同連接介面且電路序號相互反向排列,該外覆體30為一金屬殼,該外覆體30包覆該連接板55之周邊只令上下板面露出,該連接板55兩側之外覆體30設有一定位凹部,該定位凹部為一定位凹槽35,該定位凹槽35設有金屬材質之凹陷底面351及卡定面352,當該隨身碟插入一母座時可藉由該定位凹槽35的卡定面352與母座卡定。
Please refer to Fig. 49, which is the twenty-fourth embodiment of the present invention, which is a USB2.0 standard flash drive, which is roughly the same as the first embodiment, the difference lies in the connecting
其中該二排第一端子60可採塑膠射出成型定位於該連接板55或是採組裝方式定位於該連接板55。
The two rows of
該金屬殼係一體設置有一連接部金屬殼38及一絕緣體金屬殼310,該連接部金屬殼38套設包覆抵接該連接板周邊之前邊,左右二側邊及後段,該絕緣體金屬殼310僅包覆該連接板後端之對接構造且套設抵接該該連接板後端之絕緣體之上下二面及左右二側邊,該連接部金屬殼38及該絕緣體金屬殼310皆高出該連接板55之上下兩板面及該二排第一接點62。
The metal shell is integrally provided with a connecting
請參閱圖50,係本發明第二十五實施例,其係為一USB2.0規格之隨身
碟,其大致與第二十四實施例相同,其差異在於本實施之定位凹槽35略為不同。
Please refer to Figure 50, which is the twenty-fifth embodiment of the present invention, which is a USB2.0 standard portable
The dish is substantially the same as the twenty-fourth embodiment, the difference being that the
請參閱圖51,係本發明第二十六實施例,其係為一USB2.0規格之隨身碟,其大致與第二十四實施例相同,其差異在於本實施之連接板55兩側之外覆體30設有一定位彈片36,當該隨身碟插入一母座時可藉由該定位彈片36與母座卡定。
Please refer to Fig. 51, which is the twenty-sixth embodiment of the present invention, which is a USB2.0 specification flash drive, which is roughly the same as the twenty-fourth embodiment, and the difference lies in the two sides of the connecting
請參閱圖52,係本發明第二十七實施例,其係為一USB2.0規格之隨身碟,其包括一外覆體30、一電路板40、一連接板55、一電子單元4及一限位構造50,其大致與第一實施例相同,其差異在於本實施之連接板55和限位構造50為塑膠一體成型,該電路板40較薄,該連接板55後端設有一套接槽52供該電路板40一端插入卡定,該連接板55之上下板面各平貼設有一排4個第一接點62,該二排第一接點62形成在二排第一端子60,該二排第一接點62為相同連接介面且電路序號相互反向排列,該二排第一接點62皆電連接該電路板40,該電子單元4為一儲存單元,其電連接於該電路板40上且為該外覆體30所包覆,其包括一記憶體43及一控制電路45,該控制電路45係控制該電子單元之記憶體43之運作,該二排第一接點62電連接該電子單元4。
Please refer to Fig. 52, which is the twenty-seventh embodiment of the present invention, which is a USB2.0 standard flash drive, which includes an
藉由以上構造,該電路板40可採用較薄板體,當該外覆體30之厚度大致與連接板55之厚度相同時,位於該外覆體30內之電路板40上尚有足夠空間設置該電子單元4。
With the above structure, the
請參閱圖53,係本發明第二十八實施例,其係為一USB2.0規格之隨身碟,其包括一外覆體30、一電路板40、一連接板55、一電子單元4及一限位構造50,其大致與第一實施例相同,其差異在於本實施之電路板40較薄,該
電路板40前段上下二板面分別疊合一上、下電路板422、423,該疊合之上電路板422、電路板40及下電路板422伸出該外覆體30前端而形成該連接板55,該上、下電路板422、423各設有一排4個第一接點41,該二排第一接點41為相同連接介面且電路序號相互反向排列,該二排第一接點41藉由貫穿連接板55之導電部420皆電連接該電路板40,該導電部420係採鑽孔再填錫而成,該電子單元4為一儲存單元,其電連接於該電路板40上且為該外覆體30所包覆,其包括一記憶體43及一控制電路45,該控制電路45係控制該電子單元之記憶體43之運作,該二排第一接點41電連接該電子單元4。
Please refer to Fig. 53, which is the twenty-eighth embodiment of the present invention, which is a USB2.0 standard flash drive, which includes an
請參閱圖54,相係本發明第二十九實施例,其係為一USB2.0規格之隨身碟,其大致與第二十八實施例相同,其差異在於本實施之電路板40前段下板面疊合一塑膠板37及一下電路板423,該疊合之電路板40、塑膠板37及下電路板422伸出該外覆體30前端而形成該連接板55,另外,該導電部420係採鑽孔再插入一端子焊接而成。
Please refer to Fig. 54, which is related to the twenty-ninth embodiment of the present invention, which is a USB2.0 specification flash drive, which is roughly the same as the twenty-eighth embodiment, and the difference lies in the front section of the
請參閱圖55,係本發明第三十實施例,其係為一雙介面之隨身碟,其大致與第二十九實施例相同,其差異在於本實施設有二電路板40及一電子單元4,該二電路板40前段疊合一塑膠板37並伸出該外覆體30前端而形成該連接板55,該連接板55之上下板面各設有一排第一接點41,該二排第一接點41為不同之連接介面,該電子單元為一儲存單元且為該外覆體30所包覆,該電子單元4包括一記憶體43、一記憶體44及二控制電路45,該二控制電路45分別控制該記憶體43、44之運作,其中一電路板40設有該記憶體43及一控制電路45,該記憶體43及一控制電路45電連接其上之一排第一接點41,另一電路板40設有該記憶體44及另一控制電路45,該記憶體44及另一控制電路45
電連接其上之一排第一接點41。
Please refer to Fig. 55, which is the thirtieth embodiment of the present invention, which is a dual-interface flash drive, which is roughly the same as the twenty-ninth embodiment, and the difference is that this embodiment is provided with two
請參閱圖56及圖57,係本發明第三十一實施例,其係為一USB2.0規格之電連接線,其大致與第十八實施例相同,其差異在於本實施之連接板55兩板面皆一體成型設有凸出之限位構造50,藉以防止第一接點62短路,另外連接板55兩板面電路序號為1(傳送VCC)之第一接點62皆各自電連接一蕭基二極體46,再電連接至電連接線之一電線,在設計上可設置一電路板藉由該蕭基二極體46可防止電流逆流,達到確保傳送VCC之第一接點62不會短路,除了使用蕭基二極體防短路外,亦可採用其他防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段,藉以達到電路安全保護效果。
Please refer to Fig. 56 and Fig. 57, which is the thirty-first embodiment of the present invention, which is a USB2.0 electrical connection cable, which is roughly the same as the eighteenth embodiment, the difference lies in the
本實施例的連接板55的前邊、左右二側邊、前段上下二面之二側及後段套設包覆有一對接金屬殼38,該對接金屬殼38僅套設包覆抵接該連接板後段周邊之上下二面及左右二側邊而成環狀包覆抵接,僅令該上下二板面之該二前段板面之中間部位及該二排第一接點62露出,該對接金屬殼38之高度為高於該二排第一接點62之高度,該對接金屬殼38兩側各設有一定位凹槽35,該定位凹槽35設有金屬材質之凹陷底面351及卡定面352,當該電連接線插入一母座時可藉由該定位凹槽35的卡定面352與母座卡定。
The front side, the left and right sides, the two sides of the upper and lower sides of the front section, and the rear section of the
如此該連接板55之上下兩板面之後段板面呈較高之高面551且前段板面設有較低之低面552,該低面552與高面551呈一階差,該上下二板面的任一板面的該後段板面較該前段板面凸出一高度且兩者呈一階差,使該上下兩板面各形成高低階差。
In this way, the upper and lower two plate surfaces of the connecting
請參閱圖58,係本發明第三十二實施例,其係為一USB2.0規格之電連
接線,其大致與第三十一實施例相同,其差異在於本實施之連接板55厚度之中間更設有一金屬材質之補強板59,該補強板59分隔二排第一端子60和二排第一接點62。
Please refer to Figure 58, which is the thirty-second embodiment of the present invention, which is a USB2.0 standard electrical connection
Wiring, which is roughly the same as the thirty-first embodiment, the difference is that a reinforcing
請參閱圖59,係本發明第三十三實施例,其係為一USB2.0規格之電連接線,其大致與第三十二實施例相同,該連接板55內亦設有一金屬材質之補強板59,其差異在於本實施不設有金屬殼,該連接板55之上下兩板面之後段板面呈較高之高面551且前段板面設有較低之低面552,該低面552與高面551呈一階差,該上下二板面的任一板面的該後段板面較該前段板面凸出一高度且兩者呈一階差,使該上下兩板面各形成高低階差。
Please refer to Fig. 59, which is the thirty-third embodiment of the present invention, which is a USB2.0 electrical connection wire, which is roughly the same as the thirty-second embodiment, and a metal material is also arranged in the
本發明之連接板直接接觸並固定於該外覆體,與顯示卡上之封裝之電子元件透過接腳固定於電路板不同,在此特別聲明區別。 The connection board of the present invention is directly contacted and fixed on the outer covering body, which is different from the packaged electronic components on the display card fixed on the circuit board through pins, and the difference is specifically stated here.
請參閱圖60、圖61、圖62、及圖63,係為本發明第三十四實施例,其係為一USB2.0規格之隨身碟,其可正反雙面電連接一電連接母座,其包括一外覆體30、一電路板40、一連接板55、一電子單元4、一限位構造50及一排第一端子60,其中:
Please refer to Figure 60, Figure 61, Figure 62, and Figure 63, which are the thirty-fourth embodiment of the present invention, which is a USB2.0 flash drive, which can be electrically connected to an electrical connection female on both sides. The seat includes an
該電路板40前段上面設有一絕緣座體34而形成該連接板55,本實施之連接板55為一對接構造,該絕緣座體34設有該一排4個第一端子60,每一第一端子60設有一第一接點62平貼於該連接板55上板面且延伸一接腳64與該電路板55焊接,該接腳64係由該連接板55前端彎折向下至該電路板40上面以SMT方式焊接,如此不佔用該電路板40後段上面區域,有利於該電路板40後段上面之利用,該電路板40前段下面設有一排四個金手指之第一接點41,該一排第一接點41形成該連接板55下板面之連接介面,該絕緣座體34截面呈
ㄇ形狀,使該絕緣座體34與電路板40前段間呈一空間39,如此電路板40前段上面仍可配置電子元件430,該電路板40為薄板,約為0.3mm至0.5mm。
The front section of the
該二排第一接點62、41皆為USB2.0連接介面,係可分別傳送VCC、USB D-、USB D+及GND等訊號,該二排第一接點41係為相同之連接介面且電路序號相互為反向排列,如圖62所示,該連接板55上板面之一排第一接點62之電路序號由右至左為a1,a2,a3,a4,該連接板55下板面之一排第一接點41之電路序號由右至左為b4,b3,b2,b1。另外,該連接板55之形狀正反面對稱,故可正反雙面對接定位於一電連接母座。
The two rows of
該二排第一接點62、41相同之電路序號者電連接而串接成一組,即a1和b1電連接,a2和b2電連接,a3和b3電連接,a4和b4電連接,其中a1和b1係為電源接點,絕不可造成短路,故a1和b1皆先經一蕭基二極體46再相互電連接,該蕭基二極體46之作用主要是防止電流逆流,如此可達到防短路效果。
The two rows of
上述使用蕭基二極體防短路係為一種電子式防逆流或防短路之電路安全保護手段的一種方式,然而亦有多種方式如設置防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段,藉以達到電路安全保護效果。 The above-mentioned use of Schottky diodes to prevent short-circuit is a way of electronic circuit safety protection against backflow or short-circuit, but there are also many ways such as setting anti-backflow electronic components or anti-short circuit electronic components or circuit safety protection components or The safety circuit setting method is used to achieve the effect of circuit safety protection.
該外覆體30及連接板55結合成一對接構造,該外覆體30與該絕緣座體34為塑膠一體射出成型,該外覆體30覆蓋該電路板40後段上面,該外覆體30截面亦呈ㄇ形狀,使該外覆體30與電路板40後段間亦呈一空間39。
The
該電子單元4為一儲存單元,其電連接於該電路板40後段上面且為該外覆體30所覆蓋,其包括一記憶體及一控制電路,該記憶體可為但不限於快閃記憶體(flash memory)或唯讀記憶體(ROM),該記憶體之容量大小不限,該
控制電路係控制該電子單元之記憶體之運作,該二排第一接點62、41電連接該電子單元4。
The
另外,本實施例更可包括一控制手段與該USB2.0規格之隨身碟相結合,以對該儲存單元進行一資料儲存與控制程序。 In addition, this embodiment may further include a control means combined with the USB2.0 flash drive to perform a data storage and control program on the storage unit.
該限位構造50與該絕緣座體34一體成型,該限位構造50於該連接板55兩板面二側各形成一條前後方向之凸肋,該限位構造50較該連接板55兩板面之第一接點62、41凸出藉以保護該二排第一接點41。
The limiting
該補強板59為金屬材質且截面呈ㄈ形狀,其設於該絕緣座體34之二側,該補強板59由連接板55延伸至該電路板40後段且設有焊板591與該電路板40焊接固定。
The reinforcing
另外,在實施上該絕緣座體34亦可直接均設有多個小面積之焊板,藉由該焊板與電路板焊接亦可達到補強效果。
In addition, in practice, the insulating
藉由以上構造,本實施例更具有以下優點: With the above structure, this embodiment has the following advantages:
1.連接板55內形成空間39可使電路板40前段上面仍可配置電子元件430。
1. The
2.該外覆體30與該絕緣座體34為塑膠一體射出成型,如此製造上甚為簡易。
2. The
3.同時設計電子式防短路之蕭基二極體46及機構式防刮傷及防短路之限位構造50,可確保雙面插接之電路安全。
3. Simultaneously design the electronic anti-short
本實施例之製造方法包括以下步驟: The manufacturing method of this embodiment includes the following steps:
一、提供一電路板,該電路板一面設有2組依序反向排列USB2.0連接介面的串接電路、一組USB2.0連接介面的接點、防逆流或防短路或其他電子 式電路安全保護裝置的電路及接點、一電子單元的電路及接點、及補強板的焊接區,該2組依序反向排列連接介面的串接電路與該電子單元的電路電連接,該電路板另一面設有一組USB2.0連接介面,其為金手指; 1. Provide a circuit board, one side of the circuit board is equipped with two sets of serial circuits of USB2.0 connection interface in reverse order, a set of contacts of USB2.0 connection interface, anti-backflow or short-circuit prevention or other electronic The circuit and contacts of the type circuit safety protection device, the circuit and contacts of an electronic unit, and the welding area of the reinforcing plate, the two groups of serial circuits arranged in reverse order and connected to the interface are electrically connected to the circuit of the electronic unit, The other side of the circuit board is provided with a set of USB2.0 connection interfaces, which are golden fingers;
二、提供一絕緣座體,該絕緣座體為一塑膠座體且設有一組端子結構的USB2.0連接介面,該端子設有接腳,絕緣座體下方與電路板間成一空間,藉由該空間可排列電子元件,該絕緣座體設有補強板,該絕緣座體一體延伸座體長度而形成一外覆體,該絕緣座體和該電路前後齊平,使完全蓋合該電路板上排放電子元件的區域; 2. Provide an insulating seat body, which is a plastic seat body and is provided with a USB2.0 connection interface with a terminal structure. The terminals are provided with pins, and a space is formed between the bottom of the insulating seat body and the circuit board. Electronic components can be arranged in the space, the insulating base body is provided with a reinforcing plate, and the insulating base body extends the length of the base body integrally to form an outer covering body, the insulating base body is flush with the circuit front and back, so that the circuit board is completely covered The area where electronic components are discharged;
三、提供防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置; 3. Provide anti-backflow electronic components or anti-short circuit electronic components or Schottky diodes or other electronic circuit safety protection devices;
四、提供一電子單元,該電子單元為一儲存單元,包括有記憶體及控制電路; 4. Provide an electronic unit, which is a storage unit, including a memory and a control circuit;
五、提供焊接材料塗抹於該電路板之接點及補強板的焊接區; 5. Provide welding materials to smear the contacts of the circuit board and the welding area of the reinforcement board;
六、將該防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置、電子單元、及絕緣座體分別排列貼放於該電路板的接點,該絕緣座體完全蓋合該電路板上排放電子元件的區域;以及 6. The anti-backflow electronic components or anti-short circuit electronic components or Schottky diodes or other electronic circuit safety protection devices, electronic units, and insulating bases are respectively arranged and pasted on the contacts of the circuit board. The body completely covers the area on the circuit board where electronic components are discharged; and
七、將分別貼放於該電路板上的元件,進行迴焊焊板加工,完成該簡易板片式雙面連接介面電子裝置的加工製程。 7. Reflow soldering processing is performed on the components respectively attached to the circuit board to complete the processing process of the simple board-type double-sided connection interface electronic device.
上述製造方法中,該電路板之2組USB2,0連接介面的串接電路,其中電路序號1之電路各自電連接該一防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置,另外該絕緣座體設有防短路凸出二組USB2.0連接介面之限位構造。
In the above-mentioned manufacturing method, two sets of USB2, 0 connection interfaces of the circuit board are serially connected circuits, wherein the circuits with the
另外,該電子單元可為一無線收發單元而成一無線收發裝置,或可為一連接線材而成一電連接線公頭,或可為一轉接電路及一電連接器而成一轉接電連接器,或可為一擴充電路及一組電連接插座而成一擴充插座,或可為一控制單元而成一IC控制器。。 In addition, the electronic unit can be a wireless transceiver unit to form a wireless transceiver device, or can be a connecting wire to form a male electrical connection line, or can be a transfer circuit and an electrical connector to form a transfer electrical connector , or can be an expansion circuit and a group of electrical connection sockets to form an expansion socket, or can be a control unit to form an IC controller. .
本發明之相關製造方法,在其他實施例中亦有揭露說明。 Related manufacturing methods of the present invention are also disclosed in other embodiments.
請參閱圖63A,該第三十四實施例之外覆體30之上面及二側面和該絕緣座體34之兩側面皆可設置透空孔301,如此在外覆體30和絕緣座體34熱封於電路板40或迴焊焊板加工時具有空氣對流,而有較佳之熱封效果或較佳迴焊焊板加工。
Please refer to FIG. 63A , the upper surface and two side surfaces of the
請參閱圖64,係本發明第三十五實施例,其係為一USB2.0規格之隨身碟,其大致與第三十四實施例相同,其差異在於本實施例之電路板40較厚,約為0.8mm至1.1mm。
Please refer to Fig. 64, which is the thirty-fifth embodiment of the present invention, which is a USB2.0 flash drive, which is roughly the same as the thirty-fourth embodiment, the difference being that the
請參閱圖65,係本發明第三十六實施例,其係為一USB2.0規格之隨身碟,其大致與第三十四實施例相同,其差異在於本實施例之一排第一端子60之接腳64係由該連接板55後端彎折向下至該電路板後段上面以SMT方式焊接。
Please refer to Figure 65, which is the thirty-sixth embodiment of the present invention, which is a USB2.0 flash drive, which is roughly the same as the thirty-fourth embodiment, the difference lies in the first row of terminals in this embodiment The
請參閱圖66,係本發明第三十七實施例,其係為一USB2.0規格之隨身碟,其大致與第三十六實施例相同,其差異在於本實施例之一排第一端子60之接腳64係穿過該電路板作焊接,且該外覆體30係為封膠體,其以封膠方式覆蓋該電路板40上面,同時將連接板55之絕緣座體與電路板40之空間補滿以增加強度,此亦為補強手段之一種方式。
Please refer to Figure 66, which is the thirty-seventh embodiment of the present invention, which is a USB2.0 flash drive, which is roughly the same as the thirty-sixth embodiment, the difference lies in the first row of terminals in this embodiment The
請參閱圖67及圖68,係本發明第三十八實施例,其係為一USB2.0規格之
隨身碟,其大致與第三十七實施例相同,其差異在於本實施例之電路板40前段上面疊合一第二電路板422而形成該連接板55,該連接板上板面之一排第一接點41形成在該第二電路板上面且為一排金手指,該連接板下板面之一排第一接點41形成在該電路板40前段下面且為一排金手指,另外,該限位構造50為二絕緣座體,其分別凸出該連接板55之上下面且在二排第一接點之電路序號1,2之間及電路序號3,4之間。
Please refer to Figure 67 and Figure 68, which is the thirty-eighth embodiment of the present invention, which is a USB2.0 specification
Pen drive, it is roughly the same as the thirty-seventh embodiment, and its difference is that a
請參閱圖69、圖70及圖71,係本發明第三十九實施例,其係為一USB2.0規格之隨身碟,其大致與第三十七實施例相同,其差異在於本實施例之連接板55之絕緣座體與該外覆體30皆為封膠體,其以封膠方式覆蓋該電路板40上面,該一排第一端子60係前後端皆向下彎折接腳64至該電路板上面以SMT方式焊接,另外在封膠時直接形成該限位構造50,該限位構造50位置則與第三十八實施例相同。
Please refer to Fig. 69, Fig. 70 and Fig. 71, which is the thirty-ninth embodiment of the present invention, which is a USB2.0 standard flash drive, which is roughly the same as the thirty-seventh embodiment, and the difference lies in this embodiment The insulating seat body of the connecting
請參閱圖72、圖73及圖74,係本發明第四十實施例,其係為一USB2.0規格之隨身碟,其大致與第三十七實施例相同,其差異在於本實施例之電路板40為厚板,約為1.0mm,該連接板55之絕緣座體37與電路板40前段間沒有空間。
Please refer to Fig. 72, Fig. 73 and Fig. 74, it is the fortieth embodiment of the present invention, which is a USB2. The
請參閱圖75、圖76及圖77,係本發明第四十一實施例,其係為一USB2.0規格之隨身碟,其大致與第二十七實施例相同,其差異在於本實施之該二排第一端子60埋入該連接板55中射出成型,該外覆體30係為封膠體,其以封膠方式覆蓋該電路板40上面,另外該連接板55兩側各設有一補強板59,補強板59為金屬材質且截面呈凹字形,該補強板59由連接板55延伸至該電路板40,該補強板59與該電路板40夾合固定。
Please refer to Fig. 75, Fig. 76 and Fig. 77, it is the forty-first embodiment of the present invention, which is a USB2. The two rows of
請參閱圖78,係本發明第四十二實施例,其係為一USB2.0規格之隨身碟,其大致與第四十一實施例相同,其差異在於本實施之二排第一端子60之接腳64皆焊接於該電路板40上面。
Please refer to Fig. 78, which is the forty-second embodiment of the present invention, which is a flash drive with USB2.0 specification, which is roughly the same as the forty-first embodiment, and the difference lies in the second row of
請參閱圖79,係本發明第四十三實施例,其係為一USB2.0規格之隨身碟,其大致與第四十一實施例相同,其差異在於本實施例之連接板不設卡槽卡定該電路板40。
Please refer to Figure 79, which is the forty-third embodiment of the present invention, which is a USB2.0 flash drive, which is roughly the same as the forty-first embodiment, and the difference is that the connection board of this embodiment does not have a card The slot locks the
請參閱圖80,係本發明第四十四實施例,其係為一USB2.0規格之隨身碟,其大致與第四十二實施例相同,其差異在於本實施例之二排第一端子60之接腳64皆焊接於該電路板40下面。
Please refer to Fig. 80, which is the forty-fourth embodiment of the present invention, which is a USB2.0 standard flash drive, which is roughly the same as the forty-second embodiment, the difference lies in the second row of first terminals of this embodiment The
請參閱圖81、圖82及圖83,係本發明第四十五實施例,其係為一USB2.0規格之隨身碟,其大致與第三十四實施例相同,其差異在於本實施例之電路板40前段下面兩側各設有一塑膠塊312,該二塑膠塊312再疊合一第二電路板424而形成該連接板55,該第二電路板424和該電路板40間呈一空間且兩者前後對齊,該連接板55一板面之一排第一接點41形成在該第二電路板424外面且為一排金手指,該連接板55另一板面之一排第一接點41形成在該電路板40前段外面且為一排金手指。
Please refer to Fig. 81, Fig. 82 and Fig. 83, it is the forty-fifth embodiment of the present invention, which is a USB2.0 specification flash drive, which is roughly the same as the thirty-fourth embodiment, the difference lies in this embodiment A
該第二電路板424和該電路板40藉由插梢425與該二塑膠塊312結合固定,另外該二塑膠塊312一體成型有該限位構造50,該外覆體30係為封膠體,其以封膠方式覆蓋該電路板40和該第二電路板425之內面。
The
請參閱圖84及圖85,係本發明第四十六實施例,其係為一USB2.0規格之電子裝置,其大致與第三十六實施例相同,其差異在於本實施之外覆體30係為一高度較連接板55大之塑膠盒體,如此該電路板40在外覆體30內中間,
該電路板40兩面與外覆體30均有足夠空間可配置相關之電子元件。
Please refer to Figure 84 and Figure 85, which is the forty-sixth embodiment of the present invention, which is an electronic device with USB2.0 specification, which is roughly the same as the thirty-sixth embodiment, the difference lies in the outer covering body of this
請參閱圖86,係本發明第四十七實施例,其係為一USB2.0規格之電子裝置,其大致與第三十實施例相同,其差異在於本實施之外覆體30係為一高度較連接板55大之塑膠盒體,且該二電路板40皆為約0.3mm之薄板,如此該二電路板40在外覆體30內中間,該二電路板40兩面均有足夠空間可配置相關之電子元件,可縮短整個電子裝置之長度。
Please refer to Fig. 86, which is the forty-seventh embodiment of the present invention, which is an electronic device with USB2. The height of the plastic box is larger than that of the connecting
請參閱圖87及圖88,係本發明第四十八實施例,其係為一迷你型USB2.0規格之電子裝置,其大致與第三十四實施例相同,其差異在於本實施之連接板55為一對接構造,該對接構造為一塑膠材質之絕緣座體34下方結合一電路板40,該絕緣座體設有一排第一端子60,該對接構造一板面之一排第一接點62形成在該一排第一端子60,該一排第一端子60延伸接腳與該電路板40電連接,該對接構造另一板面之一排第一接點41形成在該電路板40下面且為一排金手指,絕緣座體34與該電路板40間呈一空間,該電子單元4設於該連接板55內且電連接於該電路板40上。
Please refer to Figure 87 and Figure 88, which is the forty-eighth embodiment of the present invention, which is a miniature USB2.0 electronic device, which is roughly the same as the thirty-fourth embodiment, the difference lies in the connection of this embodiment The
上述第三十四實施例至第四十八實施例中之電子單元4除了可為一儲存單元而成一隨身碟外,或可為一無線收發單元而成一無線收發裝置,或可為一連接線材而成一電連接線公頭,或可為一轉接電路及一電連接器而成一轉接電連接器,或可為一擴充電路及一組電連接插座而成一擴充插座,或可為一控制單元而成一IC控制器。
The
在第三十四實施例中所述之製造方法中,其中該電路板之2組依序反向排列USB2.0連接介面的串接電路及接點的後方更設有另2組依序反向排列的連接介面的串接電路及焊墊;該絕緣座體設有另2組彈動端子結構的 USB3.0連接介面,該彈動端子設有接腳,USB3.0連接介面在USB2.0連接介面在之後;該電路板設有供該彈動端子連接介面彈動的透空槽;如此即可製造一USB3.0規格之電子產品。 In the manufacturing method described in the thirty-fourth embodiment, two sets of the circuit board are arranged in reverse order in sequence, behind the serial circuit and contacts of the USB2.0 connection interface, there are another two sets in reverse order. The series connection circuit and welding pad of the connection interface are arranged; the insulating base is provided with another two sets of spring terminal structures USB3.0 connection interface, the elastic terminal is provided with pins, and the USB3.0 connection interface is behind the USB2.0 connection interface; the circuit board is provided with a hollow slot for the elastic terminal connection interface to bounce; thus It can manufacture an electronic product with USB3.0 specification.
另外,在製造上該絕緣座體亦可直接均設有多個小面積之焊板,藉由該焊板與電路板焊接亦可達到補強效果,該絕緣座體亦可分開延伸座體長度而形成一外覆體完全蓋合該電路板上排放電子元件的區域。 In addition, in manufacturing, the insulating base body can also be directly equipped with a plurality of small-area welding plates, and the reinforcing effect can also be achieved by welding the welding plates with the circuit board. The insulating base body can also be separated to extend the length of the base body An outer cover is formed to completely cover the area where the electronic components are disposed on the circuit board.
請參閱圖89及圖90,係本發明第四十九實施例,其係為一USB2.0規格之隨身碟,其大致與第四十一實施例相同,本實施同樣是該連接板55與該二排第一端子60以埋入方式塑膠射出成型,該連接板55兩側各設有一補強板59,補強板59為金屬材質且截面呈字形,該補強板59由連接板55延伸至該電路板40,該補強板59與該電路板40夾合固定,本實施之差異在於暫時未設有封膠體覆蓋該電路板40上面並將該電子單元4覆蓋。
Please refer to Fig. 89 and Fig. 90, which is the forty-ninth embodiment of the present invention, which is a USB2.0 standard flash drive, which is roughly the same as the forty-first embodiment, and this implementation is also the connecting
另外,該二排第一接點62、41皆為USB2.0連接介面,係可分別傳送VCC、USB D-、USB D+及GND等訊號,該二排第一接點41係為相同之連接介面且電路序號相互為反向排列,如圖62所示,該連接板55上板面之一排第一接點62之電路序號由右至左為a1,a2,a3,a4,該連接板55下板面之一排第一接點41之電路序號由右至左為b4,b3,b2,b1。另外,該連接板55之形狀正反面對稱,故可正反雙面對接定位於一電連接母座。
In addition, the first contact points 62 and 41 of the two rows are both USB2.0 connection interfaces, which can respectively transmit signals such as VCC, USB D-, USB D+ and GND, and the first contact points 41 of the second row are the same connection The interface and the circuit numbers are arranged in opposite directions. As shown in Figure 62, the circuit numbers of the
該二排第一接點62、41相同之電路序號者電連接而串接成一組,即a1和b1電連接,a2和b2電連接,a3和b3電連接,a4和b4電連接,其中a1和b1係為電源接點,絕不可造成短路,故a1和b1皆先經一蕭基二極體46再相互電連接,該蕭基二極體46之作用主要是防止電流逆流,如此可達到防短路效果。
The two rows of
上述使用蕭基二極體防短路係為一種電子式防逆流或防短路之電路安全保護手段的一種方式,然而亦有多種方式如設置防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段,藉以達到電路安全保護效果。 The above-mentioned use of Schottky diodes to prevent short-circuit is a way of electronic circuit safety protection against backflow or short-circuit, but there are also many ways such as setting anti-backflow electronic components or anti-short circuit electronic components or circuit safety protection components or The safety circuit setting method is used to achieve the effect of circuit safety protection.
請參閱圖91,係本發明第五十實施例,其大致與第四十九實施例相同,其差異在於本實施之補強板59截面呈形。
Please refer to Fig. 91, which is the fiftieth embodiment of the present invention, which is roughly the same as the forty-ninth embodiment, the difference is that the reinforcing
請參閱圖92,係本發明第五十一實施例,其大致與第四十九實施例相同,其差異在於本實施之補強板59截面呈形。
Please refer to Fig. 92, which is the fifty-first embodiment of the present invention, which is roughly the same as the forty-ninth embodiment, the difference is that the reinforcing
請參閱圖93,係本發明第五十二實施例,其大致與第四十九實施例相同,其差異在於本實施之補強板59截面亦呈形,然並未卡合電路板40。
Please refer to Figure 93, which is the fifty-second embodiment of the present invention, which is roughly the same as the forty-ninth embodiment, the difference is that the section of the
請參閱圖94及圖95,係本發明第五十三實施例,其係為一USB2.0規格之隨身碟,其大致與第四十九實施例相同,本實施之差異在於該補強板59與該連接板55為塑膠一體成型,該補強板59一體連接於該連接板55後端二側向後延伸,該補強板59截面亦呈凹字形套合該電路板40兩側。
Please refer to Figure 94 and Figure 95, which is the fifty-third embodiment of the present invention, which is a USB2.0 flash drive, which is roughly the same as the forty-ninth embodiment, the difference of this implementation is the reinforcing
另外,該補強板59之截面可為其他形狀,以套合或卡合或粘合該電路板兩側。
In addition, the cross-section of the reinforcing
請參閱圖96及圖97,係本發明第五十四實施例,其係為一USB2.0規格之隨身碟,其大致與第四十九實施例相同,本實施之差異在於該補強構造為設於該連接板55之套接槽52,該電路板40前段套接卡定於該套接槽52,套接槽52位於連接板55厚度中間,該套接槽52包覆抵接該電路板40前段之左右側面及上下面。
Please refer to Figure 96 and Figure 97, which is the fifty-fourth embodiment of the present invention, which is a USB2.0 flash drive, which is roughly the same as the forty-ninth embodiment, the difference of this implementation is that the reinforcing structure is Set in the
請參閱圖98及圖99,係本發明第五十五實施例,其係為一USB2.0規
格之隨身碟,其大致與第四十實施例及第四十九實施例相同,本實施同樣是該連接板55包括一絕緣座體34及該電路板40之前段,該絕緣座體34設於該電路板40之前段上,該絕緣座體34上面設有該一排第一接點62,該絕緣座體上之一排第一接點62係形成在一排第一端子60,該第一端子60設有接腳64電連接或焊接在該電路板40,該電路板40之前段下面設有該一排第一接點41,該電路板之一排第一接點41為電路接點,該絕緣座體34兩側各設有一補強板59,該補強板59及一排第一端子60與該絕緣座體34係為埋入塑膠射出成型,補強板59為金屬材質且截面呈形,該補強板59延伸至該電路板40後段且焊接該電路板40,本實施之差異在於暫時未設有封膠體覆蓋該電路板40上面並將該電子單元4覆蓋。
Please refer to Figure 98 and Figure 99, which is the fifty-fifth embodiment of the present invention, which is a USB2.0 standard flash drive, which is roughly the same as the fortieth embodiment and the forty-ninth embodiment, and this implementation is the same The
請參閱圖100,係本發明第五十六實施例,其大致與第五十五實施例相同,其差異在於本實施之補強板59截面呈形。
Please refer to Fig. 100, which is the fifty-sixth embodiment of the present invention, which is roughly the same as the fifty-fifth embodiment, the difference is that the reinforcing
請參閱圖101,係本發明第五十七實施例,其大致與第五十五實施例相同,其差異在於本實施之補強板59截面呈形。
Please refer to Fig. 101, which is the fifty-seventh embodiment of the present invention, which is roughly the same as the fifty-fifth embodiment, the difference is that the reinforcing
請參閱圖102,係本發明第五十八實施例,其大致與第五十五實施例相同,其差異在於本實施之補強板59截面呈形。
Please refer to Fig. 102, which is the fifty-eighth embodiment of the present invention, which is roughly the same as the fifty-fifth embodiment, the difference is that the reinforcing
請參閱圖103,係本發明第五十九實施例,其大致與第五十五實施例相同,其差異在於本實施之補強板59截面呈形。
Please refer to Fig. 103, which is the fifty-ninth embodiment of the present invention, which is roughly the same as the fifty-fifth embodiment, the difference is that the reinforcing
請參閱圖104、圖105、圖106及圖107,係本發明第六十實施例,其係為一USB2.0規格之隨身碟,其大致與第三十九實施例相同,本實施之差異在於設有一電路板40及一第二電路板424,該電路板40下面前段設有一排四個第一接點41,該電路板40上面係先焊接一電子單元4、二側焊接二前後延伸
之補強板59及前段焊上四個呈ㄈ形之導電片593後,再以封膠方式形成一外覆體30覆蓋該電路板40上面及電子單元4,同時使該二補強板59及四個導電片593上端露出,如圖107所示,該第二電路板424上面係設有一排四個第一接點41且下面設有對應該二補強板59及四個導電片593之焊墊,上面之一排四個第一接點41係呈反向排列藉由導電部420電連接至下面之焊墊,該第二電路板424疊合於該外覆體30前段且下面之焊墊焊接於該二補強板59及四個導電片593上端而形成一連接板55,如此該連接板55上下面即各形成一排電路序號依序反向排列之第一接點。
Please refer to Fig. 104, Fig. 105, Fig. 106 and Fig. 107, which are the sixtieth embodiment of the present invention, which is a USB2.0 specification flash drive, which is roughly the same as the thirty-ninth embodiment, the difference of this implementation
本實施例之製造方法,包括以下步驟: The manufacturing method of this embodiment includes the following steps:
一、提供一電路板40,該電路板40設有2組導電接點、該2組導電接點依序反向排列的串接電路、防逆流或防短路或其他電子式電路安全保護裝置的電路及接點、一電子單元4的電路及接點、及補強板59的接點,該2組導電接點依序反向排列的串接電路與該電子單元4的電路電連接,該2組導電接點分別設於該電路板不同面,該電路板40前段相對於設有該電子單元4的接點之另一面之1組導電接點為一組連接介面,即一排4個第一接點41,其為USB2.0之連接介面;
1. A
二、提供一絕緣體,該絕緣體為一第二電路板424,其上設有該另一組連接介面,即一排第一接點41,其為USB2.0之連接介面;
2. Provide an insulator, the insulator is a
三、提供防逆流電子元件或防短路電子元件或蕭基二極體46或其他電子式電路安全保護裝置;
3. Provide anti-backflow electronic components or anti-short circuit electronic components or
四、提供一電子單元4、外加之一組導電接點及補強板59,該外加之一組導電接點為一組導電片593;
4. Provide an
五、提供焊接材料塗抹於該電路板40之接點;
5. Provide soldering material to smear on the contacts of the
六、將該防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置、電子單元4、及二補強板59分別排列貼放於該電路板40對應的接點,該一組導電片593貼放於電路板該面之一組導電接點;
6. The anti-backflow electronic components or anti-short circuit electronic components or Schottky diodes or other electronic circuit safety protection devices, the
七、將分別貼放於該電路板40上的元件,進行迴焊焊板加工;
7. Perform reflow soldering processing on the components respectively attached to the
八、將該焊接有上述元件之電路板40一面進行封裝而形成一外覆體30,並使並使該電路板40和外覆體30結合成一封裝體,且使該一組導電片593及二補強板59露出外覆體30上表面,且該電路板另一面之一組連接介面,即一排4個第一接點41露出該封裝體之電路板一面;
8. Encapsulate the
九、提供焊接材料塗抹於該外覆體上表面之一組導電片593及補強板59;以及
9. Provide a set of
十、將該第二電路板424疊合於該外覆體30上表面前段,該第二電路板424之一組連接介面的焊接點連接該一組導電片593且第二電路板424設有焊接點連接該二補強板59,最後再進行迴焊焊板加工。
10. Lay the
上述之補強構造係採用補強板59,然亦可採用焊板,該第二電路板424可以超音波或高週波方式結合於該外覆體30上。
The above-mentioned reinforcing structure adopts the reinforcing
請參閱圖108,係本發明第六十一實施例,其大致與第六十實施例相同,其差異在於本實施之外覆體30更包覆該電路板40兩側面。
Please refer to FIG. 108 , which is the sixty-first embodiment of the present invention, which is roughly the same as the sixtieth embodiment, the difference being that the
請參閱圖109,係本發明第六十二實施例,其大致與第六十實施例相同,其差異在於本實施之外覆體30上係疊合一絕緣座體34,該絕緣座體34上面設有該一排第一接點62,該一排第一接點62係形成在一排第一端子60,該絕緣座體34與該一排第一端子60係採埋入塑膠射出成型方式,該第一端子
60設有接腳焊接在該外覆體30前段上面之四個導電片上端,該絕緣座體34可以超音波或高週波方式結合該外覆體30上。
Please refer to Figure 109, which is the sixty-second embodiment of the present invention, which is roughly the same as the sixtieth embodiment, the difference is that an insulating
請參閱圖110,係本發明第六十三實施例,其大致與第三十四實施例相同,其差異在於本實施之外覆體30與絕緣座體34係分開設置而非一體成型,該外覆體30與絕緣座體34可以超音波或高週波方式結合於該電路板40上。
Please refer to Fig. 110, which is the sixty-third embodiment of the present invention, which is roughly the same as the thirty-fourth embodiment, the difference is that the
請參閱圖111、圖112、圖113及圖114,係本發明第六十四實施例,其係為一USB2.0規格之隨身碟,其大致與第三十四實施例相同,本實施包括有一電路板40、上、下絕緣座體34、34’、一電子單元4、及一外覆體30,其中:
Please refer to Fig. 111, Fig. 112, Fig. 113 and Fig. 114, which are the sixty-fourth embodiment of the present invention, which is a USB2.0 flash drive, which is roughly the same as the thirty-fourth embodiment, and this embodiment includes There is a
該電路板40上下面皆設有一組導電接點430且前端各設有二焊接區432,另電路板40下面二側各設有一前後延伸之焊接區434。
The upper and lower sides of the
該上、下絕緣座體34、34’上各設有一組導電接點,該一組導電接點係為一排四個第一接點62,其為USB2.0之連接介面,該二排第一接點62係形成在二排第一端子60,該上、下絕緣座體34、34’與該二排第一端子60係分別採埋入塑膠射出成型方式,該二排第一端子60設有接腳64分別焊接於該電路板40上下面之一組導電接點430,該二排第一端子60之前端66焊接於該電路板40上下面之焊接區432,該上、下絕緣座體34、34’前端對應該焊接區432各設有二缺口342,藉由該缺口342可補焊,另外該絕緣座體34較大,其兩側邊大致與電路板40齊平,其兩側各設有一前後延伸之補強板59,該補強板59焊接該焊接區434。
The upper and lower insulating
該電子單元4為一儲存單元,其包括有相關之電子元件及控制電路,該電子單元4電連接於該電路板40上面。
The
該外覆體30為一絕緣之封膠體,其將該電路板40焊接有電子單元4及絕緣座體34’之一面封膠覆蓋,只令該下絕緣座體34’上一排第一接點62露出該外覆體30上表面。
The
藉由以上構造,該電路板40前段上下面分別設有一絕緣座體而形成該連接板55,該該連接板55兩面各有一組連接介面,即該一排第一接點62。
With the above structure, the upper and lower sides of the front section of the
本實施例之製造方法,包括以下步驟: The manufacturing method of this embodiment includes the following steps:
一、提供一電路板40,該電路板設有2組導電接點430、該2組導電接點依序反向排列的串接電路、防逆流或防短路或其他電子式電路安全保護裝置的電路及接點、一電子單元的電路及接點及補強板59的焊接區434,該串接電路與該電子單元的電路電連接,該2組導電接點430分別設於該電路板40不同面;
1. Provide a
二、提供一絕緣體,該絕緣體為一上絕緣座體34,其上設有一組USB2.0之連接介面及補強板59,其為一排4個第一接點62,該一排第一接點62係形成在一排第一端子60,該上絕緣座體34與該一排第一端子60係採埋入塑膠射出成型方式;
2. Provide an insulator, the insulator is an upper insulating
三、提供防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置; 3. Provide anti-backflow electronic components or anti-short circuit electronic components or Schottky diodes or other electronic circuit safety protection devices;
四、提供一電子單元4及外加之一組導電接點,該外加之一組導電接點係設在一下絕緣座體34’上,其為一組USB2.0之連接介面,其為一排4個第一接點62,該一排第一接點62係形成在一排第一端子60,該下絕緣座體34’與該一排第一端子60係採埋入塑膠射出成型方式;
4. Provide an
五、提供焊接材料塗抹於該電路板40一面之接點及焊接區432;
5. Provide soldering material to smear the contacts and
六、將該防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置及電子單元4分別排列貼放於該電路板40上對應之接點,該外加之一組導電接點,即該下絕緣座體34’之一排第一端子60之接腳64貼放於電路板該面之一組導電接點430,其中兩第一端子60之前端66連接該焊接區432;
6. The anti-backflow electronic components or anti-short circuit electronic components or Schottky diodes or other electronic circuit safety protection devices and
七、將分別貼放於該電路板40上的元件,進行迴焊焊板加工;
7. Perform reflow soldering processing on the components respectively attached to the
八、將該焊接有上述元件之電路板一面進行封裝而形成一外覆體30,並使該電路板40和外覆體30結合成一封裝體,且使該外加之一組導電接點,即該一排第一端子60之第一接點62露出該封裝體之外覆體30上表面,且該電路板另一面之一組導電接點露出該封裝體之電路板一面;
8. Encapsulate one side of the circuit board welded with the above components to form an
九、提供焊接材料塗抹於該電路板一面之一組導電接點430、焊接區432及補強板之焊接區434;以及
9. A set of
十、將該絕緣座體34疊合於該封裝體之電路板40前段,該上絕緣座體34之一排第一端子60之接腳64連接於該塗抹有焊接材料之一組導電接點430,其中兩第一端子60之前端66連接該焊接區432,該補強板59連接於該焊接區434,並進行迴焊焊板加工。
10. Lay the insulating
本實施例之電路板40前段上面之絕緣座體係採較小的下絕緣座體34'以封膠體封膠結合成與電路板40兩側齊平之絕緣座體,該封膠體埋入該絕緣座體34’並結合該電路板,該下絕緣座體34'主要係用以先結合該一排第一端子60以達到製造上之簡便,然而亦可將該一排第一端子60直接焊在該電路板40上再封膠直接形成一絕緣座體。
The insulating seat system on the front section of the
上述之補強構造係採用補強板59,然亦可採用焊板,該上絕緣座體34
亦可以超音波或高週波方式結合於該電路板40。
The above-mentioned reinforcing structure adopts a reinforcing
請參閱圖115及圖116,係本發明第六十五實施例,其係為一USB2.0規格之隨身碟,其大致與第六十四實施例相同,其差異在於本實施之絕緣座體34二側一體設有限位構造50凸出該一組連接介面及相對於該一組連接介面之一組導電接點,即該限位構造50凸出該連接板55兩面之一排第一接點62。
Please refer to Figure 115 and Figure 116, which is the sixty-fifth embodiment of the present invention, which is a USB2.0 standard flash drive, which is roughly the same as the sixty-fourth embodiment, the difference lies in the insulating base of this implementation The two sides of 34 are integrally provided with a limiting
上述第四十九實施例至第六十五實施例中之電子單元4除了可為一儲存單元而成一隨身碟外,或可為一無線收發單元而成一無線收發裝置,或可為一連接線材而成一電連接線公頭,或可為一轉接電路及一電連接器而成一轉接電連接器,或可為一擴充電路及一組電連接插座而成一擴充插座,或可為一控制單元而成一IC控制器。
The
在較佳實施例之詳細說明中所提出之具體的實施例僅為了易於說明本發明之技術內容,而並非將本發明狹義地限制於該實施例,在不超出本發明之精神及以下申請專利範圍之情況,可作種種變化實施。 The specific embodiment proposed in the detailed description of the preferred embodiment is only for the ease of explaining the technical content of the present invention, but not restricting the present invention to this embodiment in a narrow sense, without exceeding the spirit of the present invention and applying for a patent below Depending on the scope of the situation, various changes can be made.
4:電子單元 4: Electronic unit
30:外覆體 30: Outer body
40:電路板 40: circuit board
50:限位構造 50: limit structure
55:連接板 55: Connection board
410:連接槽 410: connection slot
411:第一接點 411: first contact
412:第二接點 412: second contact
60:第一端子 60: first terminal
62:第一接點 62: First contact
70:第二端子 70: Second terminal
72:第二接點 72: Second contact
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TW111128023A TWI844897B (en) | 2011-03-31 | 2011-08-29 | Bidirectional electrical connector |
TW108100836A TWI727248B (en) | 2011-03-31 | 2011-08-29 | Electronic device with positive and negative double-sided electrical connection with control function |
TW105103082A TWI648920B (en) | 2011-03-31 | 2011-08-29 | Double-sided positive and negative electrical connection structure and its manufacturing method |
TW100130945A TWI535119B (en) | 2011-03-31 | 2011-08-29 | Pros and cons of two-sided joint of the electronic device and its manufacturing method |
TW109141870A TWI776289B (en) | 2011-03-31 | 2011-08-29 | Electronic device with double-sided electrical connection structure switching with locking structure |
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TW105103082A TWI648920B (en) | 2011-03-31 | 2011-08-29 | Double-sided positive and negative electrical connection structure and its manufacturing method |
TW100130945A TWI535119B (en) | 2011-03-31 | 2011-08-29 | Pros and cons of two-sided joint of the electronic device and its manufacturing method |
TW109141870A TWI776289B (en) | 2011-03-31 | 2011-08-29 | Electronic device with double-sided electrical connection structure switching with locking structure |
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JP5941446B2 (en) | 2013-09-05 | 2016-06-29 | 株式会社フジクラ | Printed wiring board and connector for connecting the wiring board |
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TWI535119B (en) | 2016-05-21 |
TW202139534A (en) | 2021-10-16 |
TWI776289B (en) | 2022-09-01 |
TW201939825A (en) | 2019-10-01 |
TW201703361A (en) | 2017-01-16 |
TWI727248B (en) | 2021-05-11 |
TWI648920B (en) | 2019-01-21 |
TW201242180A (en) | 2012-10-16 |
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