TW202321351A - Silicone particles, method for producing silicone particles, sealing agent for liquid crystal dropping methods, and liquid crystal display element - Google Patents

Silicone particles, method for producing silicone particles, sealing agent for liquid crystal dropping methods, and liquid crystal display element Download PDF

Info

Publication number
TW202321351A
TW202321351A TW111135747A TW111135747A TW202321351A TW 202321351 A TW202321351 A TW 202321351A TW 111135747 A TW111135747 A TW 111135747A TW 111135747 A TW111135747 A TW 111135747A TW 202321351 A TW202321351 A TW 202321351A
Authority
TW
Taiwan
Prior art keywords
polysiloxane
liquid crystal
particles
silane compound
polysiloxane particles
Prior art date
Application number
TW111135747A
Other languages
Chinese (zh)
Inventor
上田沙織
山田恭幸
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202321351A publication Critical patent/TW202321351A/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Abstract

Provided are silicone particles which are able to have high chemical resistance and low moisture permeability. Silicone particles according to the present invention have particle diameters of from 0.1 [mu]m to 500 [mu]m (inclusive). Each of the silicone particles has a siloxane bond, a radically polymerizable group and a hydrophobic group with 5 or more carbon atoms, or is obtained by forming a siloxane bond by reacting a silane compound having a radically polymerizable group with a silane compound having a hydrophobic group with 5 or more carbon atoms, or is alternatively obtained by forming a siloxane bond by causing a reaction of a silane compound having a radically polymerizable group and a hydrophobic group with 5 or more carbon atoms.

Description

聚矽氧粒子、聚矽氧粒子之製造方法、液晶滴落法用密封劑及液晶顯示元件Polysiloxane particles, method for producing polysiloxane particles, sealant for liquid crystal dropping method, and liquid crystal display element

本發明係關於一種聚矽氧粒子及聚矽氧粒子之製造方法。又，本發明係關於一種使用上述聚矽氧粒子之液晶滴落法用密封劑及液晶顯示元件。The invention relates to a polysiloxane particle and a method for producing the polysiloxane particle. Moreover, this invention relates to the sealing compound for liquid crystal dropping methods using the said polysiloxane particle, and a liquid crystal display element.

各向異性導電膏及各向異性導電膜等各向異性導電材料廣為人知。於上述各向異性導電材料中，黏合劑樹脂中分散有導電性粒子。上述各向異性導電材料係用以將軟性印刷基板(FPC)、玻璃基板、玻璃環氧基板及半導體晶片等各種連接對象構件之電極間電性連接而獲得連接構造體。又，有使用具有基材粒子、及配置於該基材粒子之表面上之導電層的導電性粒子作為上述導電性粒子之情況。 又，液晶顯示元件係於2片玻璃基板間配置液晶而構成。於該液晶顯示元件中，為了保持2片玻璃基板之間隔(間隙)均勻且固定，使用間隔件作為間隙控制材料。 於下述專利文獻1中，記載有使用聚矽氧橡膠粉末等橡膠粉末作為上述液晶顯示元件用間隔件。 又，於下述專利文獻2中揭示有一種粒子，其含有具有不同之有機基之2種以上之聚有機矽氧烷，且其組成自粒子中心部朝向表面方向而階段性或連續地變化。 於下述專利文獻3中，揭示有藉由使具有聚合性不飽和基之多官能性矽烷化合物於界面活性劑之存在下進行水解及縮聚所獲得之粒子。專利文獻3中，上述多官能性矽烷化合物為選自特定式所表示之化合物及其衍生物中之含有至少1個自由基聚合性基之第1矽化合物。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2009-139922號公報 [專利文獻2]日本專利特開2010-229303號公報 [專利文獻3]日本專利特開2000-204119號公報 Anisotropic conductive materials such as anisotropic conductive paste and anisotropic conductive film are widely known. In the aforementioned anisotropic conductive material, conductive particles are dispersed in the binder resin. The above-mentioned anisotropic conductive material is used to electrically connect the electrodes of various connection object components such as flexible printed circuit board (FPC), glass substrate, glass epoxy substrate and semiconductor chip to obtain a connection structure. Moreover, the electroconductive particle which has a substrate particle and the electroconductive layer arrange|positioned on the surface of this substrate particle may be used as said electroconductive particle. Moreover, the liquid crystal display element is comprised by arrange|positioning liquid crystal between two glass substrates. In this liquid crystal display element, in order to keep the interval (gap) between two glass substrates uniform and constant, a spacer is used as a gap control material. In Patent Document 1 below, it is described that rubber powder such as silicone rubber powder is used as the above-mentioned spacer for a liquid crystal display element. Also, the following Patent Document 2 discloses a particle containing two or more kinds of polyorganosiloxanes having different organic groups, and its composition changes stepwise or continuously from the center of the particle toward the surface. In Patent Document 3 below, particles obtained by hydrolyzing and polycondensing a polyfunctional silane compound having a polymerizable unsaturated group in the presence of a surfactant are disclosed. In Patent Document 3, the polyfunctional silane compound is a first silicon compound containing at least one radically polymerizable group selected from compounds represented by specific formulas and derivatives thereof. [Prior Art Literature] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2009-139922 [Patent Document 2] Japanese Patent Laid-Open No. 2010-229303 [Patent Document 3] Japanese Patent Laid-Open No. 2000-204119

[發明所欲解決之問題] 於如專利文獻1～3所記載之粒子中，有耐化學品性較低、或者透濕性較高之情況。 例如，若將如專利文獻1所記載之普通聚矽氧橡膠粉末用作液晶顯示元件用間隔件，則有因聚矽氧橡膠粉末而使液晶受到污染之情況。又，於聚矽氧之材料之特性方面，有透濕性變高、液晶顯示產生不均之情況。 另一方面，對於近年之配置於陶瓷封裝內之壓力感測器、加速度感測器、CMOS(Complementary Metal Oxide Semiconductor，互補金氧半導體)感測器元件及CCD(Charge Coupled Device，電荷耦合元件)感測器元件等電子零件，即便於高溫、高壓之嚴酷條件下，亦要求高精度之感知能力。因此，上述電子零件中之2個陶瓷構件間之接合部之透濕性之改善成為重要課題。 本發明之目的在於提供可提高耐化學品性且降低透濕性之聚矽氧粒子及聚矽氧粒子之製造方法。又，本發明之目的在於提供使用上述聚矽氧粒子之液晶滴落法用密封劑及液晶顯示元件。 [解決問題之技術手段] 根據本發明之較廣之態樣，提供一種聚矽氧粒子，其係具有0.1 μm以上且500 μm以下之粒徑者，且上述聚矽氧粒子係具有矽氧烷鍵、自由基聚合性基、及碳數5以上之疏水基之聚矽氧粒子(第1聚矽氧粒子)，或藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第2聚矽氧粒子)，或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第3聚矽氧粒子)。 於本發明之聚矽氧粒子之某一特定之態樣中，上述聚矽氧粒子係具有矽氧烷鍵、於上述矽氧烷鍵之末端之自由基聚合性基、及於上述矽氧烷鍵之側鏈之碳數5以上之疏水基之聚矽氧粒子(第1聚矽氧粒子)，或藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第2聚矽氧粒子)，或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第3聚矽氧粒子)。 於本發明之聚矽氧粒子之某一特定之態樣中，上述聚矽氧粒子係具有矽氧烷鍵、於上述矽氧烷鍵之末端鍵結於矽原子之自由基聚合性基、及於上述矽氧烷鍵之側鏈鍵結於矽原子之碳數5以上之疏水基的聚矽氧粒子(第1聚矽氧粒子)，或藉由使具有鍵結於矽原子之自由基聚合性基之矽烷化合物與具有鍵結於矽原子之碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第2聚矽氧粒子)，或者藉由使具有鍵結於矽原子之自由基聚合性基且具有鍵結於矽原子之碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第3聚矽氧粒子)。 於本發明之聚矽氧粒子之某一特定之態樣中，上述聚矽氧粒子係具有2個甲基鍵結於1個矽原子之二甲基矽氧烷骨架之聚矽氧粒子。 於本發明之聚矽氧粒子之某一特定之態樣中，上述聚矽氧粒子係進行30%壓縮時之壓縮彈性模數為500 N/mm 2以下之聚矽氧粒子。 於本發明之聚矽氧粒子之某一特定之態樣中，上述聚矽氧粒子係不含金屬觸媒或者以100 ppm以下包含金屬觸媒之聚矽氧粒子。 於本發明之聚矽氧粒子之某一特定之態樣中，上述聚矽氧粒子係包含遮光劑之聚矽氧粒子。 於本發明之聚矽氧粒子之某一特定之態樣中，上述聚矽氧粒子係用於液晶滴落法用密封劑之聚矽氧粒子。 本發明之聚矽氧粒子較佳為具有矽氧烷鍵、自由基聚合性基、及碳數5以上之疏水基之聚矽氧粒子(第1聚矽氧粒子)。 本發明之聚矽氧粒子亦較佳為藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第2聚矽氧粒子)，或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第3聚矽氧粒子)。 於本發明之聚矽氧粒子之某一特定之態樣中，上述聚矽氧粒子係藉由利用自由基聚合起始劑使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物進行反應所獲得之聚矽氧粒子(第2聚矽氧粒子)，或者藉由利用自由基聚合起始劑使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物進行反應所獲得之聚矽氧粒子(第3聚矽氧粒子)。 根據本發明之較廣之態樣，提供一種聚矽氧粒子之製造方法，其係上述聚矽氧粒子之製造方法，且具備如下步驟：藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物進行反應而獲得聚矽氧粒子(第2聚矽氧粒子)、或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物進行反應而獲得聚矽氧粒子(第3聚矽氧粒子)。 於本發明之聚矽氧粒子之製造方法之某一特定之態樣中，藉由利用自由基聚合起始劑使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物進行反應而獲得聚矽氧粒子(第2聚矽氧粒子)、或者藉由利用自由基聚合起始劑使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物進行反應而獲得聚矽氧粒子(第3聚矽氧粒子)。 根據本發明之較廣之態樣，提供一種液晶滴落法用密封劑，其包含熱硬化性成分、及上述聚矽氧粒子。 根據本發明之較廣之態樣，提供一種液晶顯示元件，其具備：第1液晶顯示元件用構件；第2液晶顯示元件用構件；密封部，其於上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件對向之狀態下，將上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件之外周密封；及液晶，其於上述密封部之內側，配置於上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件之間；上述密封部係藉由使液晶滴落法用密封劑熱硬化而形成；且上述液晶滴落法用密封劑包含熱硬化性成分、及上述聚矽氧粒子。 [發明之效果] 本發明之聚矽氧粒子係具有0.1 μm以上且500 μm以下之粒徑之聚矽氧粒子，且上述聚矽氧粒子係具有矽氧烷鍵、自由基聚合性基、及碳數5以上之疏水基之聚矽氧粒子，或藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子，或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子，因此可提高耐化學品性且降低透濕性。 [Problems to be Solved by the Invention] The particles described in Patent Documents 1 to 3 may have low chemical resistance or high moisture permeability. For example, if ordinary silicone rubber powder as described in Patent Document 1 is used as a spacer for a liquid crystal display element, liquid crystals may be contaminated by the silicone rubber powder. In addition, in terms of the characteristics of the material of polysiloxane, moisture permeability may become high, and unevenness may occur in liquid crystal display. On the other hand, pressure sensors, acceleration sensors, CMOS (Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor) sensor elements and CCD (Charge Coupled Device, Charge Coupled Device) configured in ceramic packages in recent years Electronic components such as sensor elements require high-precision sensing capabilities even under severe conditions of high temperature and high pressure. Therefore, improvement of the moisture permeability of the junction part between two ceramic members in the said electronic component becomes an important subject. The object of the present invention is to provide polysiloxane particles capable of improving chemical resistance and reducing moisture permeability and a method for producing polysiloxane particles. Moreover, the object of this invention is to provide the sealing compound for liquid crystal dropping methods using the said polysiloxane particle, and a liquid crystal display element. [Technical means to solve the problem] According to a broader aspect of the present invention, there is provided a polysiloxane particle having a particle diameter of 0.1 μm or more and 500 μm or less, and the polysiloxane particle has a siloxane bonds, free radical polymerizable groups, and polysiloxane particles (first polysiloxane particles) with a hydrophobic group having a carbon number of 5 or more, or by combining a silane compound with a free radical polymerizable group with a carbon number of 5 or more Polysiloxane particles (second polysiloxane particles) obtained by reacting a silane compound with a hydrophobic group to form a siloxane bond, or by reacting a silane compound with a hydrophobic group having a radical polymerizable group and having a carbon number of 5 or more Polysiloxane particles obtained by forming siloxane bonds (third polysiloxane particles). In a specific aspect of the polysiloxane particle of the present invention, the polysiloxane particle has a siloxane bond, a radical polymerizable group at the end of the siloxane bond, and Polysiloxane particles with a hydrophobic group with 5 or more carbon atoms in the side chain of the bond (the first polysiloxane particle), or a silane compound with a free radical polymerizable group and a silane with a hydrophobic group with 5 or more carbon atoms Polysiloxane particles (second polysiloxane particles) obtained by reacting a compound to form a siloxane bond, or siloxane formed by reacting a silane compound having a radically polymerizable group and a hydrophobic group having 5 or more carbon atoms Polysiloxane particles obtained by bonding (third polysiloxane particles). In a specific aspect of the polysiloxane particle of the present invention, the polysiloxane particle has a siloxane bond, a radically polymerizable group bonded to a silicon atom at the end of the siloxane bond, and Polysiloxane particles (first polysiloxane particles) with a hydrophobic group having 5 or more carbon atoms bonded to a silicon atom at the side chain of the above-mentioned siloxane bond, or by polymerizing a free radical having a bonded silicon atom Polysiloxane particles (second polysiloxane particles) obtained by reacting a silane compound with a neutral group and a silane compound having a hydrophobic group with a carbon number of 5 or more bonded to a silicon atom to form a siloxane bond, or by making Polysiloxane particles obtained by reacting a silane compound with a radically polymerizable group bonded to a silicon atom and having a hydrophobic group with a carbon number of 5 or more bonded to a silicon atom to form a siloxane bond (third polysiloxane particle) . In a specific aspect of the polysiloxane particle of the present invention, the polysiloxane particle is a polysiloxane particle having a dimethylsiloxane skeleton in which two methyl groups are bonded to one silicon atom. In a specific aspect of the polysiloxane particles of the present invention, the above-mentioned polysiloxane particles are polysiloxane particles having a compressive elastic modulus of 500 N/mm 2 or less when subjected to 30% compression. In a specific aspect of the polysiloxane particles of the present invention, the above-mentioned polysiloxane particles are polysiloxane particles that do not contain a metal catalyst or contain a metal catalyst at 100 ppm or less. In a specific aspect of the polysiloxane particles of the present invention, the above-mentioned polysiloxane particles are polysiloxane particles containing an opacifying agent. In a certain specific aspect of the polysiloxane particle of this invention, the said polysiloxane particle is the polysiloxane particle used for the sealing agent for liquid crystal dropping methods. The polysiloxane particles of the present invention are preferably polysiloxane particles (first polysiloxane particles) having a siloxane bond, a radically polymerizable group, and a hydrophobic group having 5 or more carbon atoms. The polysiloxane particles of the present invention are also preferably polysiloxane particles obtained by reacting a silane compound having a radically polymerizable group with a silane compound having a hydrophobic group having 5 or more carbon atoms to form a siloxane bond (paragraph 2 polysiloxane particles), or polysiloxane particles obtained by reacting a silane compound having a radically polymerizable group and a hydrophobic group having 5 or more carbon atoms to form a siloxane bond (third polysiloxane particle) . In a specific aspect of the polysiloxane particle of the present invention, the polysiloxane particle is obtained by using a radical polymerization initiator to combine a silane compound having a radical polymerizable group with a hydrophobic compound having 5 or more carbon atoms. Polysiloxane particles (second polysiloxane particles) obtained by reacting a radical silane compound, or a silane with a radical polymerizable group and a hydrophobic group with a carbon number of 5 or more by using a radical polymerization initiator Polysiloxane particles (third polysiloxane particles) obtained by reacting compounds. According to a broader aspect of the present invention, there is provided a method for producing polysiloxane particles, which is the above-mentioned method for producing polysiloxane particles, and has the following steps: by making a silane compound having a radical polymerizable group and a silane compound having Polysiloxane particles (second polysiloxane particles) obtained by reacting a silane compound with a hydrophobic group with 5 or more carbon atoms, or by reacting a silane compound with a hydrophobic group with a carbon number of 5 or more. Polysiloxane particles (third polysiloxane particles) are obtained by reaction. In a specific aspect of the method for producing polysiloxane particles of the present invention, a silane compound having a radical polymerizable group and a silane compound having a hydrophobic group having 5 or more carbon atoms are combined by using a radical polymerization initiator. Compounds are reacted to obtain polysiloxane particles (second polysiloxane particles), or by using a radical polymerization initiator to react a silane compound having a radically polymerizable group and a hydrophobic group having 5 or more carbon atoms. Polysiloxane particles (third polysiloxane particles) were obtained. According to a wider aspect of this invention, the sealing compound for liquid crystal dropping methods containing a thermosetting component and the said polysiloxane particle is provided. According to a broader aspect of the present invention, there is provided a liquid crystal display element comprising: a first member for a liquid crystal display element; a second member for a liquid crystal display element; and a sealing portion between the first member for a liquid crystal display element and the above-mentioned In the state where the second member for liquid crystal display elements faces each other, the outer peripheries of the first member for liquid crystal display elements and the second member for liquid crystal display elements are sealed; Between 1 member for a liquid crystal display element and the second member for a liquid crystal display element; the sealing portion is formed by thermosetting a sealant for a liquid crystal dropping method; and the sealant for a liquid crystal dropping method includes a thermosetting Components, and the polysiloxane particles mentioned above. [Effects of the Invention] The polysiloxane particles of the present invention are polysiloxane particles having a particle diameter of 0.1 μm to 500 μm, and the polysiloxane particles have a siloxane bond, a radically polymerizable group, and Polysiloxane particles with a hydrophobic group having 5 or more carbon atoms, or polysiloxane obtained by reacting a silane compound having a radically polymerizable group with a silane compound having a hydrophobic group having 5 or more carbon atoms to form a siloxane bond Particles, or polysiloxane particles obtained by reacting a silane compound having a free radical polymerizable group and a hydrophobic group with a carbon number of 5 or more to form a siloxane bond, thus improving chemical resistance and reducing moisture permeability .

以下，對本發明進行詳細說明。 (聚矽氧粒子) 本發明之聚矽氧粒子係具有0.1 μm以上且500 μm以下之粒徑之聚矽氧粒子。 於具有0.1 μm以上且500 μm以下之粒徑之聚矽氧粒子中，本發明具備以下構成。本發明之聚矽氧粒子為(構成1)具有矽氧烷鍵、自由基聚合性基、及碳數5以上之疏水基之聚矽氧粒子(第1聚矽氧粒子)，或(構成2)藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第2聚矽氧粒子)，或者(構成3)藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第3聚矽氧粒子)。 上述第2聚矽氧粒子為具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物之反應物，且為具有矽氧烷鍵之聚矽氧粒子。上述第3聚矽氧粒子為具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物之反應物，且為具有矽氧烷鍵之聚矽氧粒子。 於本發明中，由於採用上述構成，故而可提高本發明之聚矽氧粒子之耐化學品性，且降低透濕性，提高耐濕性。 又，於在本發明之聚矽氧粒子之表面形成導電部而獲得導電性粒子並使用包含所獲得之導電性粒子之導電材料進行導電連接所得的連接構造體、使用包含本發明之聚矽氧粒子之液晶滴落法用密封劑的液晶顯示元件、或將本發明之聚矽氧粒子用作間隙調整材而接合2個陶瓷構件所得的電子零件裝置(電子機器等)中，可提高耐化學品性，且降低透濕性，可提昇高濕下之可靠性。 例如，於上述連接構造體中，可降低連接2個連接對象構件之連接部之透濕性，結果可將連接電阻維持得較低。例如，於上述液晶顯示元件中，可降低密封部之透濕性，結果可抑制水分滲入至液晶內，可防止液晶顯示之不均。例如，於上述電子零件元件中，可降低2個陶瓷構件間之接合部之透濕性，可抑制配置於陶瓷封裝內之壓力感測器、加速度感測器、CMOS感測器元件及CCD感測器元件等電子零件之劣化，提高電子零件之可靠性。 矽氧烷鍵、自由基聚合性基、及碳數5以上之疏水基之存在可藉由NMR(Nuclear Magnetic Resonance，核磁共振)等進行測定。 就可有效地提高耐化學品性且有效地降低透濕性而言，本發明之聚矽氧粒子較佳為(構成1')具有矽氧烷鍵、於上述矽氧烷鍵之末端具有自由基聚合性基、及於上述矽氧烷鍵之側鏈具有碳數5以上之疏水基的聚矽氧粒子(第1聚矽氧粒子)，或(構成2)藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第2聚矽氧粒子)，或者(構成3)藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第3聚矽氧粒子)。 矽氧烷鍵之末端上之自由基聚合性基具有使矽氧烷化合物之聚合物之分子量相對較大之效果，可藉由自由基聚合性基容易地達成本發明之聚矽氧粒子所需之粒徑，可進而提高耐化學品性。作為上述自由基聚合性基，可列舉乙烯基、(甲基)丙烯醯基、及苯乙烯基等。就提高柔軟性之觀點而言，較佳為乙烯基。 矽氧烷鍵之側鏈中之碳數5以上之疏水基具有有效地降低矽氧烷化合物之聚合物之透濕性之效果，可提高耐化學品性。作為上述碳數5以上之疏水基，可列舉碳數5～30之直鏈烷基、碳數5～30之環狀烷基、及碳數5～30之芳香族基等。就提高耐濕性之觀點而言，較佳為碳數5～30之芳香族基，進而更佳為苯基。上述碳數5以上之疏水基較佳為碳數5以上之烴基。上述疏水基之碳數較佳為6以上。 於上述構成1、上述構成1'、上述構成2、及上述構成3中，自由基聚合性基較佳為鍵結於矽原子。 就可有效地提高耐化學品性且有效地降低透濕性而言，於上述構成1、上述構成1'、上述構成1''、上述構成2、及上述構成3中，上述碳數5以上之疏水基較佳為鍵結於矽原子。 作為本發明之聚矽氧粒子之較佳態樣，該聚矽氧粒子為(構成1'')具有矽氧烷鍵、於上述矽氧烷鍵之末端具有鍵結於矽原子之乙烯基、及於上述矽氧烷鍵之側鏈具有鍵結於矽原子之苯基的聚矽氧粒子(第1聚矽氧粒子)，或(構成2')藉由使於末端具有鍵結於矽原子之乙烯基之矽烷化合物與於側鏈具有鍵結於矽原子之苯基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第2聚矽氧粒子)，或者(構成3')藉由使於末端具有鍵結於矽原子之乙烯基且於側鏈具有鍵結於矽原子之苯基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子(第3聚矽氧粒子)。 本發明之聚矽氧粒子較佳為具備上述構成1，更佳為具備上述構成1'，進而較佳為具備上述構成1''。本發明之聚矽氧粒子較佳為具備上述構成2，更佳為具備上述構成2'。本發明之聚矽氧粒子較佳為具備上述構成3，更佳為具備上述構成3'。本發明之聚矽氧粒子較佳為具備上述構成2或上述構成3，更佳為具備上述構成2'或上述構成3'。本發明之聚矽氧粒子較佳為具備上述構成1、及上述構成2或上述構成3，更佳為具備上述構成1'、及上述構成2或上述構成3，進而較佳為具備上述構成1''、及上述構成2'或上述構成3'。 就提高間隙控制效果，進而有效地提高耐化學品性，有效地降低透濕性之觀點而言，對聚矽氧粒子進行30%壓縮時之壓縮彈性模數(30%K值)較佳為1000 N/mm 2以下，更佳為500 N/mm 2以下，進而較佳為300 N/mm 2以下。上述30%K值可超過1 N/mm 2，可超過50 N/mm 2，亦可超過100 N/mm 2。 上述聚矽氧粒子之上述壓縮彈性模數(30%K值)可以如下方式測定。 使用微小壓縮試驗機，利用圓柱(直徑100 μm、金剛石製)之平滑壓頭端面於25℃、壓縮速度0.3 mN/sec、及最大試驗負載20 mN之條件下對1個聚矽氧粒子進行壓縮。測定此時之負載值(N)及壓縮位移(mm)。可由所獲得之測定值藉由下式求出上述壓縮彈性模數。作為上述微小壓縮試驗機，例如使用Fischer公司製造之「Fischerscope H-100」等。 30%K值(N/mm 2)＝(3/2 1/2)・F・S -3/2・R -1/2F：聚矽氧粒子進行30%壓縮変形時之負載值(N) S：聚矽氧粒子進行30%壓縮変形時之壓縮位移(mm) R：聚矽氧粒子之半徑(mm) 上述聚矽氧粒子之粒徑為0.1 μm以上且500 μm以下。若聚矽氧粒子之粒徑為上述下限以上及上述上限以下，則可將聚矽氧粒子較佳地用於液晶滴落法用密封劑等。上述聚矽氧粒子之粒徑較佳為1 μm以上，更佳為5 μm以上，且較佳為300 μm以下，更佳為200 μm以下，進而較佳為100 μm以下，尤佳為50 μm以下。若上述聚矽氧粒子之粒徑為上述下限以上及上述上限以下，則液晶顯示元件構件間之間隔適度，衝擊吸收性變高，不易形成凝集之聚矽氧粒子。又，粒徑為上述下限以上及上述上限以下之聚矽氧粒子容易藉由使用上述構成2及上述構成2'之矽烷化合物而獲得。 上述粒徑表示最大直徑。因此，上述粒徑於聚矽氧粒子為真球狀之情形時，表示直徑，於聚矽氧粒子為真球狀以外之情形時，表示最大直徑。 就高精度地控制2個液晶顯示元件用構件等之間隔之觀點而言，上述聚矽氧粒子之粒徑之CV(Coefficient of Variation，變異係數)值較佳為40%以下。 上述聚矽氧粒子之縱橫比較佳為2以下，更佳為1.5以下，進而較佳為1.2以下。上述縱橫比表示長徑/短徑。 上述聚矽氧粒子較佳為不含金屬觸媒、或者以100 ppm以下包含金屬觸媒。上述金屬觸媒為包含金屬原子之觸媒。於使用金屬觸媒之情形時，金屬觸媒之含量越少越好。若金屬觸媒之含量較多，則有防污染性降低之傾向。金屬觸媒之含量更佳為80 ppm以下，進一步較佳為60 ppm以下，進而較佳為50 ppm以下，更進一步較佳為40 ppm以下，尤佳為30 ppm以下，又，尤佳為20 ppm以下，最佳為10 ppm以下。 通常，聚矽氧粒子藉由使用金屬觸媒使單體進行聚合而獲得之情況較多。於此種聚矽氧粒子中，即便將其洗淨，金屬觸媒亦包含於內部，有金屬觸媒之含量超過100 ppm之情形。與此相對，於不使用金屬觸媒所獲得之聚矽氧粒子中，通常不含金屬觸媒。上述金屬觸媒表示鉑、錫等硬化觸媒。 使上述金屬觸媒為100 ppm以下之方法並無特別限定，例如可列舉藉由添加交聯性矽烷化合物而進行縮合之方法、向聚矽氧化合物導入聚合性官能基並利用聚合起始劑進行聚合之方法等。 上述金屬觸媒之含量例如可藉由電感耦合電漿發光分析裝置等進行測定。 上述聚矽氧粒子之用途並無特別限定。上述聚矽氧粒子較佳為用以獲得於表面上形成有導電層而具有上述導電層之導電性粒子、或者用作液晶顯示元件用間隔件。上述聚矽氧粒子較佳為用以獲得於表面上形成有導電層而具有上述導電層之導電性粒子。上述聚矽氧粒子較佳為用作液晶顯示元件用間隔件。 進而，上述聚矽氧粒子亦可較佳地用以接合2個陶瓷構件而獲得電子零件裝置(電子機器等)。 進而，上述聚矽氧粒子亦可較佳地用作填充材、衝擊吸收劑或振動吸收劑。例如，可使用上述聚矽氧粒子作為橡膠或彈簧等之代替品。 以下，對聚矽氧粒子之其他詳情進行說明。 聚矽氧粒子之詳情： 上述聚矽氧粒子之材料較佳為具有自由基聚合性基之矽烷化合物及具有碳數5以上之疏水基之矽烷化合物，或者較佳為具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物。上述聚矽氧粒子可經由藉由使上述矽烷化合物反應形成矽氧烷鍵而獲得聚矽氧粒子之步驟獲得。於使該等材料進行反應之情形時，形成矽氧烷鍵。於所獲得之聚矽氧粒子中，通常殘留自由基聚合性基及碳數5以上之疏水基。藉由使用此種材料，可容易地獲得具有0.1 μm以上且500 μm以下之粒徑之聚矽氧粒子，而且可提高聚矽氧粒子之耐化學品性，且降低透濕性。 於上述具有自由基聚合性基之矽烷化合物中，自由基聚合性基較佳為直接鍵結於矽原子。上述具有自由基聚合性基之矽烷化合物可僅使用1種，亦可併用2種以上。 上述具有自由基聚合性基之矽烷化合物較佳為烷氧基矽烷化合物。作為上述具有自由基聚合性基之矽烷化合物，可列舉：乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、二甲氧基甲基乙烯基矽烷、二乙氧基甲基乙烯基矽烷、二乙烯基甲氧基乙烯基矽烷、二乙烯基乙氧基乙烯基矽烷、二乙烯基二甲氧基矽烷、二乙烯基二乙氧基矽烷、及1,3-二乙烯基四甲基二矽氧烷等。 於上述具有碳數5以上之疏水基之矽烷化合物中，碳數5以上之疏水基較佳為直接鍵結於矽原子。上述具有碳數5以上之疏水基之矽烷化合物可僅使用1種，亦可併用2種以上。 上述具有碳數5以上之疏水基之矽烷化合物較佳為烷氧基矽烷化合物。作為上述具有碳數5以上之疏水基之矽烷化合物，可列舉：苯基三甲氧基矽烷、二甲氧基甲基苯基矽烷、二乙氧基甲基苯基矽烷、二甲基甲氧基苯基矽烷、二甲基乙氧基苯基矽烷、六苯基二矽氧烷、1,3,3,5-四甲基-1,1,5,5-四苯基三矽氧烷、1,1,3,5,5-五苯基-1,3,5-三甲基三矽氧烷、六苯基環三矽氧烷、苯基三(三甲基矽烷氧基)矽烷、及八苯基環四矽氧烷等。 於上述具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物中，自由基聚合性基較佳為直接鍵結於矽原子，碳數5以上之疏水基較佳為直接鍵結於矽原子。上述具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物可僅使用1種，亦可併用2種以上。 作為上述具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物，可列舉：苯基乙烯基二甲氧基矽烷、苯基乙烯基二乙氧基矽烷、苯基甲基乙烯基甲氧基矽烷、苯基甲基乙烯基乙氧基矽烷、二苯基乙烯基甲氧基矽烷、二苯基乙烯基乙氧基矽烷、苯基二乙烯基甲氧基矽烷、苯基二乙烯基乙氧基矽烷、及1,1,3,3-四苯基-1,3-二乙烯基二矽氧烷等。 為了獲得聚矽氧粒子，於使用上述具有自由基聚合性基之矽烷化合物、及上述具有碳數5以上之疏水基之矽烷化合物之情形時，上述具有自由基聚合性基之矽烷化合物與上述具有碳數5以上之疏水基之矽烷化合物較佳為按重量比計以1：1～1：20使用，更佳為以1：5～1：15使用。於上述聚矽氧粒子中，來自上述具有自由基聚合性基之矽烷化合物之骨架與來自上述具有碳數5以上之疏水基之矽烷化合物之骨架以重量比計較佳為1：1～1：20，更佳為1：5～1：15。 於用以獲得聚矽氧粒子之矽烷化合物之整體中，自由基聚合性基之數與碳數5以上之疏水基之數較佳為1：0.5～1：20，更佳為1：1～1：15。 就有效地提高耐化學品性，有效地降低透濕性，且將30%K值控制於較佳之範圍之觀點而言，上述聚矽氧粒子較佳為具有於1個矽原子鍵結有2個甲基之二甲基矽氧烷骨架，上述聚矽氧粒子之材料較佳為包含於1個矽原子鍵結有2個甲基之矽烷化合物。 就有效地提高耐化學品性，有效地降低透濕性，且將30%K值控制於較佳之範圍之觀點而言，上述聚矽氧粒子較佳為藉由自由基聚合起始劑使上述矽烷化合物進行反應而形成矽氧烷鍵。上述聚矽氧粒子較佳為上述矽烷化合物之自由基聚合反應物。上述聚矽氧粒子可經由藉由自由基聚合起始劑使上述矽烷化合物進行反應且藉由形成矽氧烷鍵而獲得聚矽氧粒子之步驟獲得。通常，難以使用自由基聚合起始劑獲得具有0.1 μm以上且500 μm以下之粒徑之聚矽氧粒子，尤其難以獲得具有100 μm以下之粒徑之聚矽氧粒子。與此相對，即便於使用自由基聚合起始劑之情形時，亦可藉由使用上述構成2及上述構成2'之矽烷化合物而獲得具有0.1 μm以上且500 μm以下之粒徑之聚矽氧粒子，亦可獲得具有100 μm以下之粒徑之聚矽氧粒子。 為了獲得上述聚矽氧粒子，亦可不使用具有鍵結於矽原子之氫原子之矽烷化合物。於該情形時，可不使用金屬觸媒而使用自由基聚合起始劑使矽烷化合物進行聚合。結果，可使聚矽氧粒子不含金屬觸媒，可減少聚矽氧粒子中之金屬觸媒之含量，進而可有效地提高耐化學品性，有效地降低透濕性，將30%K值控制於較佳之範圍。 作為上述聚矽氧粒子本體之具體之製造方法，有利用懸濁聚合法、分散聚合法、迷你乳化聚合法、或乳化聚合法等進行矽烷化合物之聚合反應而製作聚矽氧粒子之方法等。亦可於進行矽烷化合物之聚合而獲得低聚物之後，利用懸濁聚合法、分散聚合法、迷你乳化聚合法、或乳化聚合法等進行作為聚合物(低聚物等)之矽烷化合物之聚合反應而製作聚矽氧粒子。例如，可使具有乙烯基之矽烷化合物進行聚合而以聚合物(低聚物等)之形式獲得於末端具有鍵結於矽原子之乙烯基之矽烷化合物。可使具有苯基之矽烷化合物進行聚合而以聚合物(低聚物等)之形式獲得於側鏈具有鍵結於矽原子之苯基之矽烷化合物。亦可使具有乙烯基之矽烷化合物與具有苯基之矽烷化合物進行聚合，而以聚合物(低聚物等)之形式獲得於末端具有鍵結於矽原子之乙烯基且於側鏈具有鍵結於矽原子之苯基之矽烷化合物。 聚矽氧粒子亦可於外表面具有複數個粒子。於該情形時，聚矽氧粒子具備聚矽氧粒子本體、及配置於聚矽氧粒子本體之表面上之複數個粒子，且上述聚矽氧粒子本體具備上述構成1、上述構成1'、上述構成1''、上述構成2、上述構成2'、上述構成3或上述構成3'。作為上述複數個粒子，可列舉聚矽氧粒子及球狀氧化矽等。藉由上述複數個粒子之存在，可抑制聚矽氧粒子之凝集。 上述聚矽氧粒子亦可含有遮光劑。藉由使用上述遮光劑，包含聚矽氧粒子之液晶顯示元件用密封劑可適當地用作遮光密封劑。 作為上述遮光劑，例如可列舉：聚吡咯、氧化鐵、鈦黑、苯胺黑、花青黑、富勒烯、碳黑、及樹脂被覆型碳黑等。較佳為鈦黑。上述遮光材可存在於聚矽氧粒子之內部，亦可存在於外表面。 (液晶顯示元件用密封劑及液晶滴落法用密封劑) 液晶顯示元件用密封劑較佳為液晶滴落法用密封劑。上述聚矽氧粒子可適當地用於液晶滴落法用密封劑。 上述液晶滴落法用密封劑(以下，有時簡寫為密封劑)較佳為藉由加熱而硬化。上述密封劑較佳為包含熱硬化性成分、及上述聚矽氧粒子。上述密封劑可包含亦可不包含光硬化性成分。上述密封劑為了硬化可照射光，亦可不照射光。再者，於上述密封劑不含光硬化成分之情形時，亦可於光之照射下予以保管。 上述熱硬化性成分較佳為包含熱硬化性化合物、及聚合起始劑或熱硬化劑。於該情形時，亦可併用聚合起始劑與熱硬化劑。 相對於上述熱硬化性化合物100重量份，上述聚矽氧粒子之含量較佳為3重量份以上，更佳為5重量份以上，且較佳為70重量份以下，更佳為50重量份以下。若上述聚矽氧粒子之含量為上述下限以上及上述上限以下，則所獲得之液晶滴落法用密封劑之接著性變得進一步良好。 作為上述熱硬化性化合物，可列舉：氧雜環丁烷化合物、環氧化合物、環硫化合物、(甲基)丙烯酸系化合物、酚化合物、胺基化合物、不飽和聚酯化合物、聚胺基甲酸酯化合物、聚矽氧化合物及聚醯亞胺化合物等。上述熱硬化性化合物可僅使用1種，亦可併用2種以上。 就進一步提高接著性及長期可靠性之觀點而言，上述熱硬化性化合物較佳為含有(甲基)丙烯酸系化合物，更佳為含有環氧(甲基)丙烯酸酯。上述「(甲基)丙烯酸系化合物」意指具有(甲基)丙烯醯基之化合物。上述「環氧(甲基)丙烯酸酯」意指使(甲基)丙烯酸與環氧化合物中之全部環氧基進行反應所得之化合物。再者，「(甲基)丙烯酸」意指「丙烯酸」及「甲基丙烯酸」之一者或兩者，「(甲基)丙烯醯基」意指「丙烯醯基」及「甲基丙烯醯基」之一者或兩者，「(甲基)丙烯酸酯」意指「丙烯酸酯」及「甲基丙烯酸酯」之一者或兩者。 作為用以合成上述環氧(甲基)丙烯酸酯之原料之環氧化合物，例如可列舉：雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、2,2'-二烯丙基雙酚A型環氧樹脂、氫化雙酚型環氧樹脂、環氧丙烷加成雙酚A型環氧樹脂、間苯二酚型環氧樹脂、聯苯型環氧樹脂、硫化物型環氧樹脂、二苯醚型環氧樹脂、二環戊二烯型環氧樹脂、萘型環氧樹脂、酚系酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、二環戊二烯酚醛清漆型環氧樹脂、聯苯酚醛清漆型環氧樹脂、萘酚系酚醛清漆型環氧樹脂、縮水甘油胺型環氧樹脂、烷基多元醇型環氧樹脂、橡膠改性型環氧樹脂、縮水甘油酯化合物、及雙酚A型環硫樹脂等。 作為上述雙酚A型環氧樹脂之市售品，例如可列舉：jER828EL、jER1001、及jER1004(均為三菱化學公司製造)；EPICLON850-S(DIC公司製造)等。 作為上述雙酚F型環氧樹脂之市售品，例如可列舉jER806、及jER4004(均為三菱化學公司製造)等。 作為上述雙酚S型環氧樹脂之市售品，例如可列舉EPICLON EXA1514(DIC公司製造)等。 作為上述2,2'-二烯丙基雙酚A型環氧樹脂之市售品，例如可列舉RE-810NM(日本化藥公司製造)等。 作為上述氫化雙酚型環氧樹脂之市售品，例如可列舉EPICLON EXA7015(DIC公司製造)等。 作為上述環氧丙烷加成雙酚A型環氧樹脂之市售品，例如可列舉EP-4000S(ADEKA公司製造)等。 作為上述間苯二酚型環氧樹脂之市售品，例如可列舉EX-201(Nagase chemteX公司製造)等。 作為上述聯苯型環氧樹脂之市售品，例如可列舉jERYX-4000H(三菱化學公司製造)等。 作為上述硫化物型環氧樹脂之市售品，例如可列舉YSLV-50TE(新日鐵住金化學公司製造)等。 作為上述二苯醚型環氧樹脂之市售品，例如可列舉YSLV-80DE(新日鐵住金化學公司製造)等。 作為上述二環戊二烯型環氧樹脂之市售品，例如可列舉EP-4088S(ADEKA公司製造)等。 作為上述萘型環氧樹脂之市售品，例如可列舉EPICLON HP4032、及EPICLON EXA-4700(均為DIC公司製造)等。 作為上述酚系酚醛清漆型環氧樹脂之市售品，例如可列舉EPICLON N-770(DIC公司製造)等。 作為上述鄰甲酚酚醛清漆型環氧樹脂之市售品，例如可列舉EPICLON N-670-EXP-S(DIC公司製造)等。 作為上述二環戊二烯酚醛清漆型環氧樹脂之市售品，例如可列舉EPICLON HP7200(DIC公司製造)等。 作為上述聯苯酚醛清漆型環氧樹脂之市售品，例如可列舉NC-3000P(日本化藥公司製造)等。 作為上述萘酚系酚醛清漆型環氧樹脂之市售品，例如可列舉ESN-165S(新日鐵住金化學公司製造)等。 作為上述縮水甘油胺型環氧樹脂之市售品，例如可列舉：jER630(三菱化學公司製造)；EPICLON 430(DIC公司製造)；TETRAD-X(MITSUBISHI GAS CHEMICAL公司製造)等。 作為上述烷基多元醇型環氧樹脂之市售品，例如可列舉：ZX-1542(新日鐵住金化學公司製造)；EPICLON 726(DIC公司製造)；Epolight80MFA(共榮社化學公司製造)；DENACOL EX-611(Nagase chemteX公司製造)等。 作為上述橡膠改性型環氧樹脂之市售品，例如可列舉：YR-450、及YR-207(均為新日鐵住金化學公司製造)；Epolead PB(Daicel公司製造)等。 作為上述縮水甘油酯化合物之市售品，例如可列舉DENACOL EX-147(Nagase chemteX公司製造)等。 作為上述雙酚A型環硫樹脂之市售品，例如可列舉jERYL-7000(三菱化學公司製造)等。 作為上述環氧樹脂之其他市售品，例如可列舉：YDC-1312、YSLV-80XY、及YSLV-90CR(均為新日鐵住金化學公司製造)；XAC4151(旭化成公司製造)；jER1031、及jER1032(均為三菱化學公司製造)；EXA-7120(DIC公司製造)；TEPIC(日產化學公司製造)等。 作為上述環氧(甲基)丙烯酸酯之市售品，例如可列舉：EBECRYL860、EBECRYL3200、EBECRYL3201、EBECRYL3412、EBECRYL3600、EBECRYL3700、EBECRYL3701、EBECRYL3702、EBECRYL3703、EBECRYL3800、EBECRYL6040、及EBECRYL RDX63182(均為Daicel-Allnex公司製造)；EA-1010、EA-1020、EA-5323、EA-5520、EA-CHD、及EMA-1020(均為新中村化學工業公司製造)；環氧酯M-600A、環氧酯40EM、環氧酯70PA、環氧酯200PA、環氧酯80MFA、環氧酯3002M、環氧酯3002A、環氧酯1600A、環氧酯3000M、環氧酯3000A、環氧酯200EA、及環氧酯400EA(均為共榮社化學公司製造)；Denacol Acrylate DA-141、Denacol Acrylate DA-314、及Denacol Acrylate DA-911(均為Nagase chemteX公司製造)等。 作為上述環氧(甲基)丙烯酸酯以外之其他(甲基)丙烯酸系化合物，例如可列舉藉由使具有羥基之化合物與(甲基)丙烯酸進行反應所獲得之酯化合物、及藉由使具有羥基之(甲基)丙烯酸衍生物與異氰酸酯化合物進行反應所獲得之(甲基)丙烯酸胺基甲酸酯等。 作為藉由使具有羥基之化合物與上述(甲基)丙烯酸進行反應所獲得之酯化合物，可使用單官能之酯化合物、2官能之酯化合物及3官能以上之酯化合物中之任一者。 作為上述單官能之酯化合物，例如可列舉：(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異

Figure 111135747-001
基酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-甲氧基乙酯、甲氧基乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸苄酯、乙基卡必醇(甲基)丙烯酸酯、(甲基)丙烯酸苯氧基乙酯、苯氧基二乙二醇(甲基)丙烯酸酯、苯氧基聚乙二醇(甲基)丙烯酸酯、甲氧基聚乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸2,2,2-三氟乙酯、(甲基)丙烯酸2,2,3,3-四氟丙酯、(甲基)丙烯酸1H,1H,5H-八氟戊酯、醯亞胺(甲基)丙烯酸酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸異肉豆蔻酯、(甲基)丙烯酸2-丁氧基乙酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸雙環戊烯基酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸二乙胺基乙酯、(甲基)丙烯酸二甲胺基乙酯、2-(甲基)丙烯醯氧基乙基琥珀酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-羥丙基鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、(甲基)丙烯酸縮水甘油酯、及磷酸2-(甲基)丙烯醯氧基乙酯等。 作為上述2官能之酯化合物，例如可列舉：1,4-丁二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、2-正丁基-2-乙基-1,3-丙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、環氧丙烷加成雙酚A二(甲基)丙烯酸酯、環氧乙烷加成雙酚A二(甲基)丙烯酸酯、環氧乙烷加成雙酚F二(甲基)丙烯酸酯、二羥甲基二環戊二烯基二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、環氧乙烷改性異三聚氰酸二(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基-3-(甲基)丙烯醯氧基丙酯、碳酸酯二醇二(甲基)丙烯酸酯、聚醚二醇二(甲基)丙烯酸酯、聚酯二醇二(甲基)丙烯酸酯、聚己內酯二醇二(甲基)丙烯酸酯、及聚丁二烯二醇二(甲基)丙烯酸酯等。 作為上述3官能以上之酯化合物，例如可列舉：季戊四醇三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、環氧丙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、己內酯改性三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷加成異三聚氰酸三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、環氧丙烷加成甘油三(甲基)丙烯酸酯、及磷酸三(甲基)丙烯醯氧基乙酯等。 上述(甲基)丙烯酸胺基甲酸酯例如可藉由使相對於具有2個異氰酸酯基之異氰酸酯化合物1當量具有羥基之(甲基)丙烯酸衍生物2當量於觸媒量之錫系化合物存在下進行反應而獲得。又，亦可使用具有2個以上之異氰酸酯基之異氰酸酯化合物。 作為上述(甲基)丙烯酸胺基甲酸酯之原料之異氰酸酯化合物，例如可列舉：異佛爾酮二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、六亞甲基二異氰酸酯、三甲基六亞甲基二異氰酸酯、二苯甲烷-4,4'-二異氰酸酯(MDI)、氫化MDI、聚合MDI、1,5-萘二異氰酸酯、降
Figure 111135747-001
烷二異氰酸酯、聯甲苯胺二異氰酸酯、苯二甲基二異氰酸酯(XDI)、氫化XDI、離胺酸二異氰酸酯、三苯甲烷三異氰酸酯、三(異氰酸苯酯)硫代磷酸酯、四甲基二甲苯二異氰酸酯、及1,6,10-十一烷三異氰酸酯等。 作為上述(甲基)丙烯酸胺基甲酸酯之原料之異氰酸酯化合物，例如亦可使用藉由乙二醇、甘油、山梨糖醇、三羥甲基丙烷、(聚)丙二醇、碳酸酯二醇、聚醚二醇、聚酯二醇、或聚己內酯二醇等多元醇與過剩之異氰酸酯之反應所獲得之經鏈延長之異氰酸酯化合物。 作為上述(甲基)丙烯酸胺基甲酸酯之原料之具有羥基之(甲基)丙烯酸衍生物，例如可列舉：(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、及(甲基)丙烯酸2-羥基丁酯等市售品；乙二醇、丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、及聚乙二醇等二元醇之單(甲基)丙烯酸酯；三羥甲基乙烷、三羥甲基丙烷、及甘油等三元醇之單(甲基)丙烯酸酯及二(甲基)丙烯酸酯；雙酚A型環氧丙烯酸酯等環氧(甲基)丙烯酸酯等。 作為上述(甲基)丙烯酸胺基甲酸酯之市售品，例如可列舉：M-1100、M-1200、M-1210、及M-1600(均為東亞合成公司製造)；EBECRYL230、EBECRYL270、EBECRYL4858、EBECRYL8402、EBECRYL8804、EBECRYL8803、EBECRYL8807、EBECRYL9260、EBECRYL1290、EBECRYL5129、EBECRYL4842、EBECRYL210、EBECRYL4827、EBECRYL6700、EBECRYL220、及EBECRYL2220(均為Daicel-Allnex公司製造)；Artresin UN-9000H、Artresin UN-9000A、Artresin UN-7100、Artresin UN-1255、Artresin UN-330、Artresin UN-3320HB、Artresin UN-1200TPK、及Artresin SH-500B(均為根上工業公司製造)；U-122P、U-108A、U-340P、U-4HA、U-6HA、U-324A、U-15HA、UA-5201P、UA-W2A、U-1084A、U-6LPA、U-2HA、U-2PHA、UA-4100、UA-7100、UA-4200、UA-4400、UA-340P、U-3HA、UA-7200、U-2061BA、U-10H、U-122A、U-340A、U-108、U-6H、及UA-4000(均為新中村化學工業公司製造)；AH-600、AT-600、UA-306H、AI-600、UA-101T、UA-101I、UA-306T、及UA-306I(均為共榮社化學公司製造)等。 就抑制對液晶之不良影響之觀點而已，上述(甲基)丙烯酸系化合物較佳為具有-OH基、-NH-基、-NH 2基等氫鍵結性之單元。 就提高反應性之觀點而言，上述(甲基)丙烯酸系化合物較佳為具有2個或3個(甲基)丙烯醯基。 就提高液晶顯示元件用密封劑之接著性之觀點而言，上述熱硬化性化合物亦可含有環氧化合物。 作為上述環氧化合物，例如可列舉作為用以合成上述環氧(甲基)丙烯酸酯之原料之環氧化合物、或部分(甲基)丙烯酸改性環氧化合物等。 上述部分(甲基)丙烯酸改性環氧化合物意指分別具有1個以上之環氧基及(甲基)丙烯醯基之化合物。上述部分(甲基)丙烯酸改性環氧化合物例如可藉由於具有2個以上之環氧基之化合物中，使(甲基)丙烯酸與2個以上之環氧基之一部分進行反應而獲得。 作為上述部分(甲基)丙烯酸改性環氧化合物之市售品，例如可列舉KRM8287(Daicel-Allnex公司製造)等 於使用上述(甲基)丙烯酸系化合物及上述環氧化合物作為上述熱硬化性化合物之情形時，上述熱硬化性化合物整體中之(甲基)丙烯醯基與環氧基之合計100莫耳%中，環氧基較佳為20莫耳%以上，且較佳為50莫耳%以下。若上述環氧基為上述上限以下，則液晶顯示元件用密封劑對液晶之溶解性降低，更不易產生液晶污染，液晶顯示元件之顯示性能變得更良好。 作為上述聚合起始劑，可列舉自由基聚合起始劑、及陽離子聚合起始劑等。上述聚合起始劑可僅使用1種，亦可併用2種以上。 作為上述自由基聚合起始劑，可列舉藉由光照射而產生自由基之光自由基聚合起始劑、及藉由加熱而產生自由基之熱自由基聚合起始劑等。 上述自由基聚合起始劑與熱硬化劑相比，硬化速度特別快。因此，藉由使用自由基聚合起始劑，可抑制密封斷裂、或液晶污染之產生，且亦可抑制因上述聚矽氧粒子而容易產生之彈回。 作為上述光自由基聚合起始劑，例如可列舉：二苯甲酮系化合物、苯乙酮系化合物、醯基氧化膦系化合物、二茂鈦系化合物、肟酯系化合物、安息香醚系化合物、及9-氧硫𠮿
Figure 111135747-002
等。 作為上述光自由基聚合起始劑之市售品，例如可列舉：IRGACURE184、IRGACURE369、IRGACURE379、IRGACURE651、IRGACURE819、IRGACURE907、IRGACURE2959、IRGACURE OXE01、及Lucirin TPO(均為BASF Japan公司製造)；安息香甲醚、安息香乙醚、及安息香異丙醚(均為東京化成工業公司製造)等。 作為上述熱自由基聚合起始劑，例如可列舉偶氮化合物、及有機過氧化物等。較佳為偶氮化合物，更佳為作為高分子偶氮化合物之高分子偶氮起始劑。 所謂高分子偶氮化合物意指具有偶氮基、藉由熱而產生可使(甲基)丙烯醯氧基硬化之自由基且數量平均分子量為300以上之化合物。 上述高分子偶氮起始劑之數量平均分子量較佳為1000以上，更佳為5000以上，進而較佳為1萬以上，且較佳為30萬以下，更佳為10萬以下，進而較佳為9萬以下。若上述高分子偶氮起始劑之數量平均分子量為上述下限以上，則高分子偶氮起始劑不易對液晶造成不良影響。若上述高分子偶氮起始劑之數量平均分子量為上述上限以下，則容易與熱硬化性化合物混合。 上述數量平均分子量係利用凝膠滲透層析法(GPC)進行測定並藉由聚苯乙烯換算所求得之值。作為用於GPC測定之管柱，例如可列舉Shodex LF-804(昭和電工公司製造)等。 作為上述高分子偶氮起始劑，例如可列舉具有經由偶氮基而鍵結有複數個聚環氧烷或聚二甲基矽氧烷等單元之結構之高分子偶氮起始劑等。 上述具有經由偶氮基而鍵結有複數個聚環氧烷等單元之結構之高分子偶氮起始劑較佳為具有聚環氧乙烷結構。作為此種高分子偶氮起始劑，例如可列舉：4,4'-偶氮雙(4-氰基戊酸)與聚伸烷基二醇之縮聚物、及4,4'-偶氮雙(4-氰基戊酸)與具有末端胺基之聚二甲基矽氧烷之縮聚物等，具體而言，例如可列舉：VPE-0201、VPE-0401、VPE-0601、VPS-0501、VPS-1001、及V-501(均為和光純藥工業公司製造)等。 作為上述有機過氧化物，例如可列舉：過氧化酮、過氧縮酮、過氧化氫、過氧化二烷基、過氧化酯、過氧化二醯基、及過氧化二碳酸酯等。 作為上述陽離子聚合起始劑，可較佳地使用光陽離子聚合起始劑。上述光陽離子聚合起始劑藉由光照射而產生質子酸或路易斯酸。上述光陽離子聚合起始劑之種類並無特別限定，可為離子性光酸產生型，亦可為非離子性光酸產生型。 作為上述光陽離子聚合起始劑，例如可列舉：芳香族重氮鎓鹽、芳香族鹵鎓鹽、芳香族鋶鹽等鎓鹽類；鐵-丙二烯錯合物；二茂鈦錯合物；芳基矽烷醇-鋁錯合物等有機金屬錯合物類等。 作為上述光陽離子聚合起始劑之市售品，例如可列舉Adeka Optomer SP-150、及Adeka Optomer SP-170(均為ADEKA公司製造)等。 相對於上述熱硬化性化合物100重量份，上述聚合起始劑之含量較佳為0.1重量份以上，更佳為1重量份以上，且較佳為30重量份以下，更佳為10重量份以下，進而較佳為5重量份以下。若上述聚合起始劑之含量為上述下限以上，則可使液晶顯示元件用密封劑充分地硬化。若上述聚合起始劑之含量為上述上限以下，則液晶顯示元件用密封劑之貯藏穩定性變高。 作為上述熱硬化劑，例如可列舉：有機酸醯肼、咪唑衍生物、胺化合物、多酚系化合物、及酸酐等。可較佳地使用23℃下為固形之有機酸醯肼。上述熱硬化劑可僅使用1種，亦可併用2種以上。 作為上述23℃下為固形之有機酸醯肼，例如可列舉：1,3-雙(肼基羰乙基)-5-異丙基乙內醯脲、癸二醯肼、間苯二甲酸二醯肼、己二醯肼、及丙二醯肼等。 作為上述23℃下為固形之有機酸醯肼之市售品，例如可列舉：Amicure VDH、及Amicure UDH(均為Ajinomoto Fine-Techno公司製造)；SDH、IDH、ADH、及MDH(均為大塚化學公司製造)等。 相對於上述熱硬化性化合物100重量份，上述熱硬化劑之含量較佳為1重量份以上，且較佳為50重量份以下，更佳為30重量份以下。若上述熱硬化劑之含量為上述下限以上，則可使液晶顯示元件用密封劑充分地熱硬化。若上述熱硬化劑之含量為上述上限以下，則液晶顯示元件用密封劑之黏度不會變得過高，塗佈性變良好。 上述液晶顯示元件用密封劑較佳為含有硬化促進劑。藉由使用上述硬化促進劑，即便不以高溫加熱亦可充分地使密封劑硬化。 作為上述硬化促進劑，例如可列舉具有異三聚氰酸環骨架之多元羧酸或環氧樹脂胺加成物等，具體而言，例如可列舉：異氰尿酸三(2-羧基甲基)酯、異氰尿酸三(2-羧基乙基)酯、異氰尿酸三(3-羧基丙基)酯、及異氰尿酸雙(2-羧基乙基)酯等。 相對於上述熱硬化性化合物100重量份，上述硬化促進劑之含量較佳為0.1重量份以上，且較佳為10重量份以下。若上述硬化促進劑之含量為上述下限以上，則液晶顯示元件用密封劑充分地硬化，無需為了使其硬化而進行高溫下之加熱。若上述硬化促進劑之含量為上述上限以下，則液晶顯示元件用密封劑之接著性變高。 為了黏度之提高、應力分散效果引起之接著性之改善、線膨脹率之改善、硬化物之耐濕性之提高等，上述液晶顯示元件用密封劑較佳為含有填充劑。 作為上述填充劑，例如可列舉：滑石、石棉、氧化矽、矽藻土、膨潤石、膨潤土、碳酸鈣、碳酸鎂、氧化鋁、蒙脫石、氧化鋅、氧化鐵、氧化鎂、氧化錫、氧化鈦、氫氧化鎂、氫氧化鋁、玻璃珠、氮化矽、硫酸鋇、石膏、矽酸鈣、絹雲母、活性白土、及氮化鋁等無機填充劑、或聚酯粒子、聚胺基甲酸酯粒子、乙烯系聚合物粒子、丙烯酸系聚合物粒子、及核殼丙烯酸酯共聚物粒子等有機填充劑等。上述填充劑可僅使用1種，亦可併用2種以上。 上述液晶顯示元件用密封劑100重量%中，上述填充劑之含量較佳為10重量%以上，更佳為20重量%以上，且較佳為70重量%以下，更佳為60重量%以下。若上述填充劑之含量為上述下限以上，則充分地發揮改善接著性等效果。若上述填充劑之含量為上述上限以下，則液晶顯示元件用密封劑之黏度不會變得過高，塗佈性變良好。 上述液晶顯示元件用密封劑較佳為含有矽烷偶合劑。上述矽烷偶合劑主要具有作為用以將密封劑與基板等良好地接著之接著助劑之作用。矽烷偶合劑可僅使用1種，亦可併用2種以上。 關於上述矽烷偶合劑，就提高與基板等之接著性之效果優異，可藉由與硬化性樹脂進行化學鍵結而抑制硬化性樹脂流出至液晶中之情況而言，例如較佳為N-苯基-3-胺基丙基三甲氧基矽烷、3-胺基丙基三甲氧基矽烷、3-巰丙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷或3-異氰酸酯丙基三甲氧基矽烷等。 上述液晶顯示元件用密封劑100重量%中，上述矽烷偶合劑之含量較佳為0.1重量%以上，更佳為0.5重量%以上，且較佳為20重量%以下，更佳為10重量%以下。若上述矽烷偶合劑之含量為上述下限以上，則充分地發揮調配矽烷偶合劑所帶來之效果。若上述矽烷偶合劑之含量為上述上限以下，則進一步抑制液晶顯示元件用密封劑所致之液晶之污染。 上述液晶顯示元件用密封劑亦可含有遮光劑。藉由使用上述遮光劑，液晶顯示元件用密封劑可較佳地用作遮光密封劑。 作為上述遮光劑，例如可列舉：氧化鐵、鈦黑、苯胺黑、花青黑、富勒烯、碳黑、及樹脂被覆型碳黑等。較佳為鈦黑。 使用含有遮光劑之液晶顯示元件用密封劑製造之液晶顯示元件具有充分之遮光性，因此可實現不存在光洩漏而具有較高之對比度、具有優異之圖像顯示品質之液晶顯示元件。 上述鈦黑係與相對於波長300～800 nm之光之平均透過率比較，相對於紫外線區域附近、尤其是波長370～450 nm之光之透過率較高之物質。上述鈦黑具有藉由充分地遮蔽可見光區域之波長之光而對液晶顯示元件用密封劑賦予遮光性之性質，另一方面，具有使紫外線區域附近之波長之光透過之性質。較佳為液晶顯示元件用密封劑所含有之遮光劑之絕緣性高，作為絕緣性高之遮光劑，較佳為鈦黑。 上述鈦黑之每1 μm之光學密度(OD值)較佳為3以上，更佳為4以上。上述鈦黑之遮光性越高越好，上述鈦黑之OD值並無特別之較佳上限，但OD值通常為5以下。 上述鈦黑及碳黑即便未經表面處理亦可發揮充分之效果。亦可使用表面經偶合劑等有機成分處理過之鈦黑、或被氧化矽、氧化鈦、氧化鍺、氧化鋁、氧化鋯及氧化鎂等無機成分被覆之鈦黑等經表面處理之鈦黑。就可提高絕緣性而言，較佳為經有機成分處理之鈦黑。 作為上述鈦黑之市售品，例如可列舉：12S、13M、13M-C、13R-N、及14M-C(均為Mitsubishi Materials公司製造)；Tilack D(赤穗化成公司製造)等。 上述鈦黑之比表面積較佳為13 m 2/g以上，更佳為15 m 2/g以上，且較佳為30 m 2/g以下，更佳為25 m 2/g以下。 上述鈦黑之體積電阻較佳為0.5 Ω・cm以上，更佳為1 Ω・cm以上，且較佳為3 Ω・cm以下，更佳為2.5 Ω・cm以下。 上述遮光劑之一次粒徑影響2個液晶顯示元件用構件之間隔。上述遮光劑之一次粒徑較佳為1 nm以上，更佳為5 nm以上，進而較佳為10 nm以上，且較佳為5 μm以下，更佳為200 nm以下，進而較佳為100 nm以下。若上述遮光劑之一次粒徑為上述下限以上，則液晶顯示元件用密封劑之黏度或觸變性不易較大地增大，作業性變良好。若上述遮光劑之一次粒徑為上述上限以下，則液晶顯示元件用密封劑之塗佈性變良好。 相對於上述熱硬化性化合物100重量份，上述遮光劑之含量較佳為5重量%以上，更佳為10重量%以上，進而較佳為30重量%以上，且較佳為80重量%以下，更佳為70重量%以下，進而較佳為60重量%以下。若上述遮光劑之含量為上述下限以上，則獲得充分之遮光性。若上述遮光劑之含量為上述上限以下，則液晶顯示元件用密封劑之密接性或硬化後之強度變高，進而描繪性變高。 上述液晶顯示元件用密封劑亦可視需要含有應力緩和劑、反應性稀釋劑、觸變劑、間隔件、硬化促進劑、消泡劑、調平劑、聚合抑制劑、其他添加劑等。 作為製造上述液晶顯示元件用密封劑之方法並無特別限定，例如可列舉使用勻相分散機、均質攪拌機、萬能攪拌機、行星式攪拌機、捏合機、及三輥研磨機等混合機將熱硬化性化合物、聚合起始劑或熱硬化劑、聚矽氧粒子、及視需要添加之矽烷偶合劑等添加劑混合之方法等。 上述液晶顯示元件用密封劑之25℃及1 rpm下之黏度較佳為5萬Pa・s以上，且較佳為50萬Pa・s以下，更佳為40萬Pa・s以下。若上述黏度為上述下限以上及上述上限以下，則液晶顯示元件用密封劑之塗佈性變良好。上述黏度係使用E型黏度計進行測定。 (液晶顯示元件) 可使用上述液晶顯示元件用密封劑獲得液晶顯示元件。液晶顯示元件具備：第1液晶顯示元件用構件；第2液晶顯示元件用構件；密封部，其於上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件對向之狀態下，將上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件之外周密封；及液晶，其於上述密封部之內側配置於上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件之間。於該液晶顯示元件中，應用液晶滴落法，且上述密封部係藉由使液晶滴落法用密封劑熱硬化而形成。上述密封部為液晶滴落法用密封劑之熱硬化物。 圖1係模式性地表示使用聚矽氧粒子之液晶顯示元件之一例之剖視圖。 圖1所示之液晶顯示元件1具有一對透明玻璃基板2。透明玻璃基板2於對向之面具有絕緣膜(未圖示)。作為絕緣膜之材料，例如可列舉SiO 2等。於透明玻璃基板2上之絕緣膜上形成有透明電極3。作為透明電極3之材料，可列舉ITO等。透明電極3例如可藉由光微影法進行圖案化而形成。於透明玻璃基板2之表面上之透明電極3上形成有配向膜4。作為配向膜4之材料，可列舉聚醯亞胺等。 於一對透明玻璃基板2間封入有液晶5。於一對透明玻璃基板2間配置有複數個間隔件粒子7。藉由複數個間隔件粒子7限制一對透明玻璃基板2之間隔。於一對透明玻璃基板2之外周之緣部間配置有密封部6。藉由密封部6防止液晶5流出至外部。密封部6中包含聚矽氧粒子6A。於液晶顯示元件1中，位於液晶5之上側之構件為第1液晶顯示元件用構件，位於液晶之下側之構件為第2液晶顯示元件用構件。 再者，圖1所示之液晶顯示元件為一例，液晶顯示元件之結構可適當變更。 (連接構造體) 上述聚矽氧粒子係用以獲得於表面上形成有導電層而具有上述導電層之導電性粒子。藉由使用上述導電性粒子、或使用包含上述導電性粒子及黏合劑樹脂之導電材料對連接對象構件進行連接，可獲得連接構造體。 上述連接構造體較佳為具備第1連接對象構件、第2連接對象構件、及連接第1連接對象構件與第2連接對象構件之連接部，且該連接部為藉由上述導電性粒子所形成、或藉由包含上述導電性粒子及黏合劑樹脂之導電材料所形成之連接構造體。於單獨使用導電性粒子之情形時，連接部本身為導電性粒子。即，第1、第2連接對象構件由導電性粒子連接。用以獲得上述連接構造體之上述導電材料較佳為各向異性導電材料。 上述第1連接對象構件較佳為於表面具有第1電極。上述第2連接對象構件較佳為於表面具有第2電極。上述第1電極與上述第2電極較佳為由上述導電性粒子電性連接。 圖2係模式性地表示使用導電性粒子之連接構造體之一例之前視剖視圖。 圖2所示之連接構造體51具備第1連接對象構件52、第2連接對象構件53、及連接第1連接對象構件52與第2連接對象構件53之連接部54。連接部54係藉由包含導電性粒子54A及黏合劑樹脂之導電材料形成。連接部54包含導電性粒子54A。導電性粒子54A具備聚矽氧粒子、及配置於聚矽氧粒子之表面上之導電層。於圖2中，為便於圖示而概略地表示導電性粒子54A。 第1連接對象構件52於表面(上表面)具有複數個第1電極52a。第2連接對象構件53於表面(下面)具有複數個第2電極53a。第1電極52a與第2電極53a由1個或複數個導電性粒子1電性連接。因此，第1、第2連接對象構件52、53由導電性粒子1電性連接。 上述連接構造體之製造方法並無特別限定。作為連接構造體之製造方法之一例，可列舉於第1連接對象構件與第2連接對象構件之間配置上述導電材料而獲得積層體之後對該積層體進行加熱及加壓之方法等。上述加壓之壓力為9.8×10 4～4.9×10 6Pa左右。上述加熱之溫度為120～220℃左右。用以連接軟性印刷基板之電極、配置於樹脂膜上之電極及觸控面板之電極之上述加壓之壓力為9.8×10 4～1.0×10 6Pa左右。 作為上述連接對象構件，具體而言，可列舉：半導體晶片、電容器及二極體等之電子零件、以及印刷基板、軟性印刷基板、玻璃環氧基板及玻璃基板等電路基板等之電子零件等。上述導電材料較佳為用以連接電子零件之導電材料。上述導電膏較佳為膏狀之導電材料，且以膏狀之狀態塗敷於連接對象構件上。 上述導電性粒子及上述導電材料亦較佳地用於觸控面板。因此，上述連接對象構件亦較佳為軟性基板、或於樹脂膜之表面上配置有電極之連接對象構件。上述連接對象構件較佳為軟性基板，且較佳為於樹脂膜之表面上配置有電極之連接對象構件。於上述軟性基板為軟性印刷基板等之情形時，軟性基板通常於表面具有電極。 作為設置於上述連接對象構件之電極，可列舉：金電極、鎳電極、錫電極、鋁電極、銅電極、銀電極、鉬電極及鎢電極等金屬電極。於上述連接對象構件為軟性基板之情形時，上述電極較佳為金電極、鎳電極、錫電極或銅電極。於上述連接對象構件為玻璃基板之情形時，上述電極較佳為鋁電極、銅電極、鉬電極或鎢電極。再者，於上述電極為鋁電極之情形時，可為僅由鋁形成之電極，亦可為於金屬氧化物層之表面積層有鋁層之電極。作為上述金屬氧化物層之材料，可列舉摻雜有三價金屬元素之氧化銦及摻雜有三價金屬元素之氧化鋅等。作為上述三價金屬元素，可列舉Sn、Al及Ga等。 (電子零件裝置) 上述聚矽氧粒子係於第1陶瓷構件與第2陶瓷構件之外周部配置於第1陶瓷構件與第2陶瓷構件之間，且亦可用作間隙控制材料。 圖3係模式性地表示使用聚矽氧粒子之電子零件裝置之一例之剖視圖。圖4係將圖3所示之電子零件裝置中之接合部部分(圖3之虛線所包圍之部位)放大表示之剖視圖。 圖3、4所示之電子零件裝置71具備第1陶瓷構件72、第2陶瓷構件73、接合部74、電子零件75、及引線框架76。 第1、第2陶瓷構件72、73分別由陶瓷材料形成。第1、第2陶瓷構件72、73分別例如為殼體。第1陶瓷構件72例如為基板。第2陶瓷構件73例如為蓋。第1陶瓷構件72於外周部具有向第2陶瓷構件73側(上側)突出之凸部。第1陶瓷構件72於第2陶瓷構件73側(上側)具有形成用以收納電子零件75之內部空間R之凹部。再者，第1陶瓷構件72亦可不具有凸部。第2陶瓷構件73於外周部具有向第1陶瓷構件72側(下側)突出之凸部。第2陶瓷構件73於第1陶瓷構件72側(下側)具有形成用以收納電子零件75之內部空間R之凹部。再者，第2陶瓷構件73亦可不具有凸部。 接合部74將第1陶瓷構件72之外周部與第2陶瓷構件73之外周部接合。具體而言，接合部74將第1陶瓷構件72之外周部之凸部與第2陶瓷構件73之外周部之凸部接合。 藉由被接合部74接合之第1、第2陶瓷構件72、73而形成封裝。藉由封裝而形成內部空間R。接合部74將內部空間R液密及氣密地封閉。接合部74為封閉部。 電子零件75係配置於上述封裝之內部空間R內。具體而言，電子零件75係配置於第1陶瓷構件72上。於本實施形態中，使用2個電子零件75。 接合部74包含複數個聚矽氧粒子74A及玻璃74B。接合部74係使用包含與玻璃粒子不同之複數個粒子74A及玻璃74B之接合材料而形成。該接合材料為陶瓷封裝用接合材料。 接合材料可包含溶劑，亦可包含樹脂。於接合部74中，玻璃粒子等玻璃74B係於熔融及結合之後固化。 作為電子零件，可列舉感測器元件、MEMS(microelectromechanical system，微機電系統)及裸晶等。作為上述感測器元件，可列舉：壓力感測器元件、加速度感測器元件、CMOS感測器元件及CCD感測器元件等。 引線框架76係配置於第1陶瓷構件72之外周部與第2陶瓷構件73之外周部之間。引線框架76係沿封裝之內部空間R側及外部空間側延伸。電子零件75之端子與引線框架76經由導線而電性連接。 接合部74將第1陶瓷構件72之外周部與第2陶瓷構件73之外周部局部地直接接合，且局部地間接接合。具體而言，接合部74於第1陶瓷構件72之外周部與第2陶瓷構件73之外周部之間之存在引線框架76之部分中，經由引線框架76將第1陶瓷構件72之外周部與第2陶瓷構件73之外周部間接接合。於第1陶瓷構件72之外周部與第2陶瓷構件73之外周部之間之存在引線框架76之部分中，第1陶瓷構件72與引線框架76相接，引線框架76與第1陶瓷構件72及接合部74相接，接合部74與引線框架76及第2陶瓷構件73相接，且第2陶瓷構件73與接合部74相接。接合部74於第1陶瓷構件72之外周部與第2陶瓷構件73之外周部之間之不存在引線框架76之部分中，將第1陶瓷構件72之外周部與第2陶瓷構件73之外周部直接接合。於第1陶瓷構件72之外周部與第2陶瓷構件73之外周部之間之不存在引線框架76之部分中，接合部74與第1陶瓷構件72及第2陶瓷構件73相接。 於第1陶瓷構件72之外周部與第2陶瓷構件73之外周部之間之存在引線框架76之部分中，第1陶瓷構件72之外周部與第2陶瓷構件73之外周部之間隙之距離係藉由接合部74所包含之複數個粒子74A所控制。 接合部只要將第1陶瓷構件之外周部與第2陶瓷構件之外周部直接或間接接合即可。再者，亦可採用引線框架以外之電性連接方法。 如電子零件裝置71般，電子零件裝置例如具備藉由陶瓷材料所形成之第1陶瓷構件、藉由陶瓷材料所形成之第2陶瓷構件、接合部、及電子零件，上述接合部將上述第1陶瓷構件之外周部與上述第2陶瓷構件之外周部直接或間接接合，藉由被上述接合部所接合之上述第1、第2陶瓷構件而形成封裝，上述電子零件配置於上述封裝之內部空間內，且上述接合部包含複數個聚矽氧粒子及玻璃。 又，如用於電子零件裝置71之接合材料般，上述陶瓷封裝用接合材料係用以於上述電子零件裝置中形成上述接合部，且包含聚矽氧粒子及玻璃。 以下，列舉實施例及比較例而具體地說明本發明。本發明並不僅限定於以下實施例。 (實施例1) (1)聚矽氧低聚物之製作 向設置於溫浴槽內之100 ml之可分離式燒瓶加入1,3-二乙烯基四甲基二矽氧烷1重量份、及0.5重量%對甲苯磺酸水溶液20重量份。於40℃下攪拌1小時之後，添加碳酸氫鈉0.05重量份。其後，添加二甲氧基甲基苯基矽烷10重量份、二甲基二甲氧基矽烷49重量份、三甲基甲氧基矽烷0.6重量份、及甲基三甲氧基矽烷3.6重量份並攪拌1小時。其後，添加10重量%氫氧化鉀水溶液1.9重量份，升溫至85℃並利用吸出器減壓，並且攪拌10小時而進行反應。反應結束後，恢復至常壓並冷卻至40℃，添加乙酸0.2重量份且於分液漏斗內靜置12小時以上。將二層分離後之下層取出，利用蒸發器進行精製，藉此獲得聚矽氧低聚物。 (2)聚矽氧粒子(包含有機聚合物)之製作 準備使2-乙基過氧化己酸第三丁酯(聚合起始劑、日油公司製造之「PERBUTYL O」)0.5重量份溶解於所獲得之聚矽氧低聚物30重量份而成之溶解液A。又，向離子交換水150重量份混合聚氧乙烯烷基苯醚(乳化劑)0.8重量份及聚乙烯醇(聚合度：約2000、皂化度：86.5～89莫耳%、日本合成化學公司製造之「Gohsenol GH-20」)之5重量%水溶液80重量份而準備水溶液B。 向設置於溫浴槽中之可分離式燒瓶加入上述溶解液A之後，添加上述水溶液B。其後，藉由使用Shirasu Porous Glass(SPG)膜(細孔平均直徑約5 μm)而進行乳化。其後，升溫至85℃並進行9小時聚合。藉由離心分離將聚合後之粒子之總量水洗淨之後，使粒子再次分散於離子交換水100重量份而獲得分散液。其次，於向分散液添加膠體氧化矽(日產化學工業公司製造之「MP-2040」)0.7重量份之後進行冷凍乾燥，藉此獲得基材粒子。藉由對所獲得之基材粒子進行分級操作而獲得平均粒徑6.8 μm之聚矽氧粒子。 (實施例2) 除將二甲基二甲氧基矽烷49重量份變更為兩封端之甲醇改性反應性聚矽氧油(信越化學工業公司製造之「KF-6001」)49重量份以外，以與實施例1同樣之方式獲得聚矽氧粒子。 (實施例3) 除將甲基三甲氧基矽烷3.6重量份變更為四乙氧基矽烷3.6重量份以外，以與實施例1同樣之方式獲得聚矽氧粒子。 (實施例4) 除將甲基三甲氧基矽烷3.6重量份變更為苯基三甲氧基矽烷3.6重量份以外，以與實施例1同樣之方式獲得聚矽氧粒子。 (實施例5) 除將1,3-二乙烯基四甲基二矽氧烷1重量份變更為1,1,3,3-四苯基-1,3-二乙烯基二矽氧烷1.2重量份以外，以與實施例1同樣之方式獲得聚矽氧粒子。 (實施例6) 除將Shirasu Porous Glass(SPG)膜(細孔平均直徑約5 μm)變更為細孔平均直徑1 μm之膜以外，以與實施例1同樣之方式獲得聚矽氧粒子。 (實施例7) 準備使2-乙基過氧化己酸第三丁酯(聚合起始劑、日油公司製造之「PERBUTYL O」)0.5重量份溶解於兩封端之丙烯酸聚矽氧油20重量份、及對苯乙烯基三甲氧基矽烷10重量份而成之溶解液A。又，向離子交換水150重量份混合月桂基硫酸三乙醇胺鹽40重量%水溶液(乳化劑)0.8重量份及聚乙烯醇(聚合度：約2000、皂化度：86.5～89莫耳%、日本合成化學公司製造之「Gohsenol GH-20」)之5重量%水溶液80重量份而準備水溶液B。向設置於溫浴槽中之可分離式燒瓶加入上述溶解液A之後，添加上述水溶液B。其後，藉由使用Shirasu Porous Glass(SPG)膜(細孔平均直徑約20 μm)而進行乳化。其後，升溫至85℃並進行9小時聚合。藉由離心分離將聚合後之粒子之總量水洗淨之後，進行分級操作而獲得聚矽氧粒子A。 向設置於溫浴槽內之500 ml之可分離式燒瓶加入6.5重量份之所獲得之聚矽氧粒子A、溴化十六烷基三甲基銨0.6重量份、蒸餾水240重量份、及甲醇120重量份。於40℃下攪拌1小時之後，添加二乙烯苯3.0重量份及苯乙烯0.5重量份，升溫至75℃並攪拌0.5小時。其後，加入2,2'-偶氮雙(異丁酸)二甲酯0.4重量份並攪拌8小時而進行反應。藉由離心分離將聚合後之粒子之總量水洗淨而獲得聚矽氧粒子。 (比較例1) 除不添加甲氧基甲基苯基矽烷10重量份以外，以與實施例1同樣之方式獲得聚矽氧粒子。 (比較例2) 除不添加1,3-二乙烯基四甲基二矽氧烷、對甲苯磺酸、及2-乙基過氧化己酸第三丁酯以外，以與實施例1同樣之方式合成聚矽氧粒子，所獲得之粒子為凝膠狀。 (比較例3) 準備離子交換水150重量份與聚氧乙烯烷基苯醚0.8重量份及聚乙烯醇(聚合度：約2000、皂化度：86.5～89莫耳%、日本合成化學公司製造之「Gohsenol GH-20」)之5重量%水溶液80重量份之混合液。 將二甲基二甲氧基矽烷40重量份、二甲基苯基甲氧基矽烷10重量份、及甲基氫矽氧烷2重量份於常溫下混合並添加上述混合液之總量。其後，藉由使用Shirasu Porous Glass(SPG)膜(細孔平均直徑約5 μm)而進行乳化。將其轉移至可分離式燒瓶並一面攪拌一面冷卻至15℃之後，添加氯鉑酸-烯烴錯合物之甲苯溶液0.1重量份並攪拌12小時，藉此獲得聚矽氧粒子。 (評價) (1)聚矽氧粒子之粒徑 對於所獲得之聚矽氧粒子，使用雷射繞射式粒度分佈測定裝置(Malvern Instruments公司製造之「Mastersizer2000」)測定粒徑並算出平均值。 (2)聚矽氧粒子之壓縮彈性模數(30%K值) 於23℃之條件下，藉由上述方法使用微小壓縮試驗機(Fischer公司製造之「Fischerscope H-100」)對所獲得之聚矽氧粒子之上述壓縮彈性模數(30%K值)進行測定。 (3)防液晶污染性 液晶滴落法用密封劑之製備： 將雙酚A型環氧甲基丙烯酸酯(熱硬化性化合物、Daicel-Allnex公司製造之「KRM7985」)50重量份、己內酯改性雙酚A型環氧丙烯酸酯(熱硬化性化合物、Daicel-Allnex公司製造之「EBECRYL3708」)20重量份、部分丙烯酸改性雙酚E型環氧樹脂(熱硬化性化合物、Daicel-Allnex公司製造之「KRM8276」)30重量份、2,2-二甲氧基-2-苯基苯乙酮(光自由基聚合起始劑、BASF Japan公司製造之「IRGACURE651」)2重量份、丙二醯肼(熱硬化劑、大塚化學公司製造之「MDH」)10重量份、所獲得之聚矽氧粒子30重量份、氧化矽(填充劑、Admatechs公司製造之「Admafine SO-C2」)20重量份、3-縮水甘油氧基丙基三甲氧基矽烷(矽烷偶合劑、信越化學工業公司製造之「KBM-403」)2重量份、及核殼丙烯酸酯共聚物微粒子(應力緩和劑、ZEON KASEI公司製造之「F351」)進行調配，並利用行星式攪拌裝置(Thinky公司製造之「去泡攪拌太郎」)進行攪拌之後，利用陶瓷三輥研磨機使其均勻地混合而獲得液晶顯示元件用密封劑。 液晶顯示元件之製作： 相對於所獲得之各液晶顯示元件用密封劑100重量份，藉由行星式攪拌裝置使平均粒徑5 μm之間隔件粒子(積水化學工業公司製造之「Micropearl SP-2050」)1重量份均勻地分散，將所獲得之含間隔件之密封劑填充至分注用之注射器(Musashi Engineering公司製造之「PSY-10E」)中並進行脫泡處理。其後，以使用分注器(Musashi Engineering公司製造之「SHOTMASTER300」)對附ITO薄膜之透明電極基板描繪長方形框架之方式塗佈密封劑。繼而，藉由液晶滴落裝置滴落TN(Twisted Nematic，扭轉向列)液晶(Chisso公司製造之「JC-5001LA」)之微小液滴而進行塗佈，並使用真空貼合裝置於5 Pa之真空下貼合另一透明基板。使用金屬鹵化物燈對貼合後之液晶單元照射30秒鐘之100 mW/cm 2之紫外線之後，於120℃下加熱1小時而使密封劑熱硬化，從而獲得液晶顯示元件(液晶單元間隙5 μm)。 防液晶污染性之評價方法： 對於所獲得之液晶顯示元件，藉由目測對產生於密封部周邊之液晶(尤其是角部)之顯示不均進行觀察。以下述基準判定防液晶污染性。 [防液晶污染性之判定基準] ○○：完全不存在顯示不均 ○：產生少量顯示不均 △：產生明顯之顯示不均 ×：產生嚴重之顯示不均 (4)低透濕性(於高溫高濕下進行保管之後驅動之液晶顯示元件之顏色不均評價) 準備上述(3)之評價中所獲得之液晶顯示元件。 低透濕性之評價方法： 將所獲得之液晶顯示元件於溫度80℃、濕度90%RH之環境下保管72小時之後，進行AC 3.5 V之電壓驅動，藉由目測對半色調之密封劑周邊進行觀察。以下述基準判定低透濕性。 [低透濕性之判定基準] ○○：密封部周邊完全不存在顏色不均 ○：產生少量顏色不均 △：產生明顯之顏色不均 ×：產生嚴重之顏色不均 (5)耐化學品性 將所獲得之聚矽氧粒子10重量份計量至玻璃瓶中，向其添加各種溶劑100重量份並於30℃之浴槽中振動24小時。於24小時後，過濾並取出聚矽氧粒子，進行72小時之冷凍乾燥。對乾燥後之樣品之重量進行測定並評價重量減差。 將結果示於下述表1。 [表1]    聚矽氧粒子之粒徑(μm) 聚矽氧粒子之30%K值 (N/mm 2) 防液晶污染性 低透濕性 耐化學品性試驗後之重量間差(g) 實施例1 7.9 80 〇〇 〇〇 0 實施例2 7.8 50 〇〇 〇〇 0 實施例3 8.1 120 〇〇 〇〇 0 實施例4 7.8 150 〇〇 〇〇 0 實施例5 10.2 130 〇〇 〇〇 0 實施例6 3.9 80 〇〇 〇〇 0 實施例7 3.4 90 〇〇 〇〇 0 比較例1 7.5 70 〇〇 × 0 比較例2 非粒子化 無法評價 無法評價 無法評價 5.9 比較例3 6.3 50 × △ 0 Hereinafter, the present invention will be described in detail. (Polysiloxane Particles) The silicone particles of the present invention are polysiloxane particles having a particle diameter of 0.1 μm or more and 500 μm or less. In the polysiloxane particles having a particle diameter of 0.1 μm or more and 500 μm or less, the present invention has the following configurations. The polysiloxane particles of the present invention are (constituent 1) polysiloxane particles (first polysiloxane particles) having a siloxane bond, a radically polymerizable group, and a hydrophobic group having 5 or more carbon atoms, or (constitution 2 ) polysiloxane particles (second polysiloxane particles) obtained by reacting a silane compound having a radically polymerizable group with a silane compound having a hydrophobic group having 5 or more carbon atoms to form a siloxane bond, or (constituting 3) Polysiloxane particles (third polysiloxane particles) obtained by reacting a silane compound having a radically polymerizable group and a hydrophobic group having 5 or more carbon atoms to form a siloxane bond. The above-mentioned second polysiloxane particles are a reaction product of a silane compound having a radically polymerizable group and a silane compound having a hydrophobic group having 5 or more carbon atoms, and are polysiloxane particles having a siloxane bond. The third polysiloxane particle is a reactant of a silane compound having a radical polymerizable group and a hydrophobic group having 5 or more carbon atoms, and is a polysiloxane particle having a siloxane bond. In the present invention, since the above constitution is adopted, the chemical resistance of the polysiloxane particles of the present invention can be improved, the moisture permeability can be reduced, and the moisture resistance can be improved. In addition, the connection structure obtained by forming conductive parts on the surface of the polysiloxane particles of the present invention to obtain conductive particles and conducting conductive connection using a conductive material containing the obtained conductive particles uses the polysiloxane of the present invention. Chemical resistance can be improved in the liquid crystal display element of the sealant for the liquid crystal dropping method of the particles, or in the electronic component device (electronic equipment, etc.) obtained by bonding two ceramic members using the polysiloxane particles of the present invention as a gap adjustment material. quality, and reduce moisture permeability, which can improve the reliability under high humidity. For example, in the above-mentioned connection structure, the moisture permeability of the connection portion connecting two connection object members can be reduced, and as a result, the connection resistance can be kept low. For example, in the above-mentioned liquid crystal display element, the moisture permeability of the sealing part can be reduced, and as a result, the infiltration of moisture into the liquid crystal can be suppressed, and uneven display of the liquid crystal can be prevented. For example, in the above-mentioned electronic components, the moisture permeability of the junction between two ceramic members can be reduced, and the pressure sensor, acceleration sensor, CMOS sensor element, and CCD sensor arranged in the ceramic package can be suppressed. Deterioration of electronic components such as tester components, and improve the reliability of electronic components. The presence of a siloxane bond, a radically polymerizable group, and a hydrophobic group having 5 or more carbon atoms can be measured by NMR (Nuclear Magnetic Resonance, nuclear magnetic resonance) or the like. In terms of effectively improving chemical resistance and effectively reducing moisture permeability, the polysiloxane particles of the present invention preferably (constituting 1') have siloxane bonds and free Polysiloxane particles (first polysiloxane particles) having a radical polymerizable group and a hydrophobic group having 5 or more carbon atoms in the side chain of the above-mentioned siloxane bond, or (Constitution 2) by imparting radical polymerizability Polysiloxane particles (second polysiloxane particles) obtained by reacting a silane compound with a carbon number of 5 or more and a silane compound with a hydrophobic group having 5 or more carbon atoms to form a siloxane bond, or (constitution 3) by making A polysiloxane particle (third polysiloxane particle) obtained by reacting a silane compound having a hydrophobic group with a carbon number of 5 or more to form a siloxane bond. The free radical polymerizable group on the end of the siloxane bond has the effect of making the molecular weight of the polymer of the siloxane compound relatively large, and the polysiloxane particle required by the present invention can be easily achieved by the free radical polymerizable group. The particle size can further improve chemical resistance. As said radically polymerizable group, a vinyl group, a (meth)acryl group, a styryl group, etc. are mentioned. From the viewpoint of improving flexibility, vinyl is preferred. Hydrophobic groups with 5 or more carbon atoms in the side chains of siloxane bonds can effectively reduce the moisture permeability of polymers of siloxane compounds and improve chemical resistance. Examples of the above-mentioned hydrophobic group having 5 or more carbon atoms include linear alkyl groups having 5 to 30 carbon atoms, cyclic alkyl groups having 5 to 30 carbon atoms, and aromatic groups having 5 to 30 carbon atoms. From the viewpoint of improving moisture resistance, it is preferably an aromatic group having 5 to 30 carbon atoms, and more preferably a phenyl group. The above-mentioned hydrophobic group having 5 or more carbon atoms is preferably a hydrocarbon group having 5 or more carbon atoms. The carbon number of the above-mentioned hydrophobic group is preferably 6 or more. In the above constitution 1, the above constitution 1', the above constitution 2, and the above constitution 3, the radical polymerizable group is preferably bonded to a silicon atom. In the above-mentioned constitution 1, the above-mentioned constitution 1', the above-mentioned constitution 1'', the above-mentioned constitution 2, and the above-mentioned constitution 3, the said carbon number is 5 or more in order to be able to improve chemical resistance effectively and reduce moisture permeability effectively. The hydrophobic group is preferably bonded to a silicon atom. As a preferred aspect of the polysiloxane particle of the present invention, the polysiloxane particle (constituting 1'') has a siloxane bond, a vinyl group bonded to a silicon atom at the end of the siloxane bond, And the polysiloxane particle (the first polysiloxane particle) having a phenyl group bonded to a silicon atom in the side chain of the above-mentioned siloxane bond, or (constituting 2') by having a silicon atom bonded to the terminal Polysiloxane particles (second polysiloxane particles) obtained by reacting a vinyl silane compound with a silane compound having a phenyl group bonded to a silicon atom in the side chain to form a siloxane bond, or (constituting 3') Polysiloxane particles obtained by reacting a silane compound having a vinyl group bonded to a silicon atom at the terminal and a phenyl group bonded to a silicon atom in a side chain to form a siloxane bond (third polysiloxane particle ). The polysiloxane particle of the present invention preferably has the above-mentioned constitution 1, more preferably has the above-mentioned constitution 1', and still more preferably has the above-mentioned constitution 1''. The polysiloxane particle of the present invention preferably has the above-mentioned constitution 2, more preferably has the above-mentioned constitution 2'. The polysiloxane particle of the present invention preferably has the above-mentioned constitution 3, more preferably has the above-mentioned constitution 3'. The polysiloxane particle of the present invention preferably has the above-mentioned constitution 2 or the above-mentioned constitution 3, more preferably has the above-mentioned constitution 2' or the above-mentioned constitution 3'. The polysiloxane particle of the present invention preferably has the above-mentioned constitution 1, and the above-mentioned constitution 2 or the above-mentioned constitution 3, more preferably has the above-mentioned constitution 1', and the above-mentioned constitution 2 or the above-mentioned constitution 3, and still more preferably has the above-mentioned constitution 1 '', and the above-mentioned constitution 2' or the above-mentioned constitution 3'. From the point of view of improving the gap control effect, effectively improving chemical resistance, and effectively reducing moisture permeability, the compressive elastic modulus (30% K value) of polysiloxane particles when compressed by 30% is preferably 1000 N/mm 2 or less, more preferably 500 N/mm 2 or less, still more preferably 300 N/mm 2 or less. The above 30% K value may exceed 1 N/mm 2 , may exceed 50 N/mm 2 , or may exceed 100 N/mm 2 . The above-mentioned compressive elastic modulus (30%K value) of the above-mentioned polysiloxane particles can be measured as follows. Using a micro-compression tester, one polysiloxane particle was compressed using a smooth indenter end surface of a cylinder (100 μm in diameter, made of diamond) at 25°C, a compression speed of 0.3 mN/sec, and a maximum test load of 20 mN. . Measure the load value (N) and compression displacement (mm) at this time. The above-mentioned compressive modulus of elasticity can be calculated|required by the following formula from the measured value obtained. As said micro compression tester, "Fischer scope H-100" etc. by Fischer company are used, for example. 30%K value (N/mm 2 )＝(3/2 1/2 )・F・S -3/2・R -1/2 F: Load value of polysiloxane particles undergoing 30% compression deformation (N ) S: Compression displacement (mm) of polysiloxane particles undergoing 30% compression deformation (mm) R: Radius of polysiloxane particles (mm) The particle size of the above polysiloxane particles is not less than 0.1 μm and not more than 500 μm. The polysiloxane particle can be used preferably for the sealing agent for liquid crystal dropping methods etc. as the particle diameter of a polysiloxane particle is more than the said minimum and below the said upper limit. The particle size of the polysiloxane particles is preferably not less than 1 μm, more preferably not less than 5 μm, and preferably not more than 300 μm, more preferably not more than 200 μm, further preferably not more than 100 μm, especially preferably not more than 50 μm the following. When the particle size of the polysiloxane particles is not less than the above-mentioned lower limit and not more than the above-mentioned upper limit, the space between the members of the liquid crystal display element is moderate, the impact absorption becomes high, and aggregated polysiloxane particles are less likely to be formed. Moreover, the polysiloxane particle whose particle diameter is more than the said minimum and below the said upper limit can be obtained easily by using the silane compound of the said structure 2 and the said structure 2'. The above-mentioned particle diameter represents the maximum diameter. Therefore, the above-mentioned particle diameter indicates the diameter when the polysiloxane particles are truly spherical, and indicates the maximum diameter when the polysiloxane particles are not spherical. The CV (Coefficient of Variation) value of the particle diameter of the polysiloxane particles is preferably 40% or less from the viewpoint of controlling the interval between two members for liquid crystal display elements with high precision. The aspect ratio of the polysiloxane particles is preferably 2 or less, more preferably 1.5 or less, still more preferably 1.2 or less. The above-mentioned aspect ratio represents a major diameter/short diameter. The polysiloxane particles described above preferably do not contain a metal catalyst, or contain a metal catalyst at 100 ppm or less. The metal catalyst mentioned above is a catalyst containing metal atoms. In the case of using a metal catalyst, the less the content of the metal catalyst, the better. When the content of the metal catalyst is large, the anti-pollution property tends to decrease. The content of the metal catalyst is more preferably 80 ppm or less, further preferably 60 ppm or less, further preferably 50 ppm or less, still more preferably 40 ppm or less, especially preferably 30 ppm or less, and especially preferably 20 ppm or less. Below ppm, preferably below 10 ppm. In general, polysiloxane particles are often obtained by polymerizing monomers using metal catalysts. In such polysiloxane particles, even if they are washed, the metal catalyst is contained inside, and the content of the metal catalyst may exceed 100 ppm. In contrast, polysiloxane particles obtained without using a metal catalyst generally do not contain a metal catalyst. The aforementioned metal catalysts represent hardening catalysts such as platinum and tin. There are no particular limitations on the method of making the above-mentioned metal catalyst 100 ppm or less, and examples include a method of condensation by adding a crosslinkable silane compound, introducing a polymerizable functional group into a polysiloxane compound, and using a polymerization initiator. methods of aggregation, etc. The content of the above-mentioned metal catalyst can be measured by, for example, an inductively coupled plasma emission analyzer or the like. The use of the above polysiloxane particles is not particularly limited. It is preferable to use the said polysiloxane particle as the electroconductive particle which formed the conductive layer on the surface and has the said conductive layer, or it is used as the spacer for liquid crystal display elements. It is preferable that the said polysiloxane particle is the electroconductive particle which has the said conductive layer in order to obtain the conductive layer formed on the surface. The above polysiloxane particles are preferably used as spacers for liquid crystal display elements. Furthermore, the above-mentioned polysiloxane particles can also be preferably used to join two ceramic members to obtain an electronic component device (electronic equipment, etc.). Furthermore, the above polysiloxane particles can also be preferably used as a filler, impact absorber or vibration absorber. For example, the above-mentioned polysiloxane particles can be used as a substitute for rubber or springs and the like. Other details of the polysiloxane particles will be described below. Details of the polysiloxane particles: The material of the above polysiloxane particles is preferably a silane compound having a radical polymerizable group and a silane compound having a hydrophobic group with 5 or more carbon atoms, or preferably a silane compound having a radical polymerizable group and A silane compound having a hydrophobic group with 5 or more carbon atoms. The above-mentioned polysiloxane particles can be obtained through the step of obtaining polysiloxane particles by reacting the above-mentioned silane compound to form a siloxane bond. In the case of reacting these materials, a siloxane bond is formed. In the obtained polysiloxane particles, a radical polymerizable group and a hydrophobic group having 5 or more carbon atoms usually remain. By using such a material, polysiloxane particles having a particle diameter of 0.1 μm or more and 500 μm or less can be easily obtained, and the chemical resistance of the polysiloxane particles can be improved and moisture permeability can be reduced. In the above-mentioned silane compound having a radically polymerizable group, the radically polymerizable group is preferably directly bonded to a silicon atom. The silane compound which has the said radically polymerizable group may use only 1 type, and may use 2 or more types together. The aforementioned silane compound having a radically polymerizable group is preferably an alkoxysilane compound. Examples of the silane compound having a radically polymerizable group include vinyltrimethoxysilane, vinyltriethoxysilane, dimethoxymethylvinylsilane, diethoxymethylvinylsilane, Divinylmethoxyvinylsilane, divinylethoxyvinylsilane, divinyldimethoxysilane, divinyldiethoxysilane, and 1,3-divinyltetramethyldi Silicone, etc. In the above-mentioned silane compound having a hydrophobic group having 5 or more carbon atoms, the hydrophobic group having 5 or more carbon atoms is preferably directly bonded to a silicon atom. The silane compound which has the said C5 or more hydrophobic group may use only 1 type, and may use 2 or more types together. The above-mentioned silane compound having a hydrophobic group having 5 or more carbon atoms is preferably an alkoxysilane compound. Examples of the above-mentioned silane compound having a hydrophobic group having 5 or more carbon atoms include: phenyltrimethoxysilane, dimethoxymethylphenylsilane, diethoxymethylphenylsilane, dimethylmethoxysilane, Phenylsilane, Dimethylethoxyphenylsilane, Hexaphenyldisiloxane, 1,3,3,5-Tetramethyl-1,1,5,5-Tetraphenyltrisiloxane, 1,1,3,5,5-pentaphenyl-1,3,5-trimethyltrisiloxane, hexaphenylcyclotrisiloxane, phenyltris(trimethylsiloxy)silane, And octaphenylcyclotetrasiloxane, etc. Among the above-mentioned silane compounds having a radical polymerizable group and a hydrophobic group with 5 or more carbon atoms, the radical polymerizable group is preferably directly bonded to a silicon atom, and the hydrophobic group with 5 or more carbon atoms is preferably directly bonded on silicon atoms. The above-mentioned silane compound having a radically polymerizable group and a hydrophobic group having 5 or more carbon atoms may be used alone or in combination of two or more. Examples of the silane compound having a radically polymerizable group and a hydrophobic group having 5 or more carbon atoms include: phenylvinyldimethoxysilane, phenylvinyldiethoxysilane, phenylmethylvinyl Methoxysilane, Phenylmethylvinylethoxysilane, Diphenylvinylmethoxysilane, Diphenylvinylethoxysilane, Phenyldivinylmethoxysilane, Phenyldivinyl Ethoxysilane, and 1,1,3,3-tetraphenyl-1,3-divinyldisiloxane, etc. In order to obtain polysiloxane particles, when using the above-mentioned silane compound having a radical polymerizable group and the above-mentioned silane compound having a hydrophobic group having 5 or more carbon atoms, the above-mentioned silane compound having a radical polymerizable group and the above-mentioned silane compound having The silane compound having a hydrophobic group having 5 or more carbon atoms is preferably used in a weight ratio of 1:1 to 1:20, more preferably in a weight ratio of 1:5 to 1:15. In the above-mentioned polysiloxane particles, the weight ratio of the skeleton derived from the above-mentioned silane compound having a radically polymerizable group to the skeleton derived from the above-mentioned silane compound having a hydrophobic group having 5 or more carbon atoms is preferably 1:1-1:20 , more preferably 1:5 to 1:15. In the whole of the silane compound used to obtain polysiloxane particles, the number of radically polymerizable groups and the number of hydrophobic groups with 5 or more carbon atoms are preferably 1:0.5 to 1:20, more preferably 1:1 to 1:15. In terms of effectively improving chemical resistance, effectively reducing moisture permeability, and controlling the 30% K value in a better range, the above-mentioned polysiloxane particles preferably have 2 silicon atoms bonded to each other. A dimethylsiloxane skeleton with one methyl group, and the material of the above-mentioned polysiloxane particles is preferably a silane compound containing two methyl groups bonded to one silicon atom. In terms of effectively improving chemical resistance, effectively reducing moisture permeability, and controlling the 30% K value in a preferred range, the above-mentioned polysiloxane particles are preferably made by using a radical polymerization initiator to make the above-mentioned The silane compounds react to form siloxane bonds. The aforementioned polysiloxane particles are preferably free radical polymerization reactants of the aforementioned silane compounds. The above-mentioned polysiloxane particles can be obtained through the step of reacting the above-mentioned silane compound with a radical polymerization initiator and forming a siloxane bond to obtain polysiloxane particles. Generally, it is difficult to obtain polysiloxane particles having a particle diameter of 0.1 μm or more and 500 μm or less using a radical polymerization initiator, and it is particularly difficult to obtain polysiloxane particles having a particle diameter of 100 μm or less. On the other hand, even in the case of using a radical polymerization initiator, polysiloxane having a particle diameter of 0.1 μm or more and 500 μm or less can be obtained by using the silane compound of the above-mentioned composition 2 and the above-mentioned composition 2′ Particles, polysiloxane particles having a particle size of 100 μm or less can also be obtained. In order to obtain the above-mentioned polysiloxane particles, a silane compound having a hydrogen atom bonded to a silicon atom may not be used. In this case, the silane compound can be polymerized using a radical polymerization initiator without using a metal catalyst. As a result, the polysiloxane particles can be free of metal catalysts, the content of metal catalysts in the polysiloxane particles can be reduced, and the chemical resistance can be effectively improved, the moisture permeability can be effectively reduced, and the 30% K value can be reduced. controlled within a better range. As a specific production method of the above-mentioned polysiloxane particle body, there are methods such as suspension polymerization, dispersion polymerization, mini-emulsion polymerization, or emulsion polymerization to perform polymerization of silane compounds to produce polysiloxane particles. It is also possible to polymerize silane compounds as polymers (oligomers, etc.) by suspension polymerization, dispersion polymerization, mini-emulsion polymerization, or emulsion polymerization after the polymerization of silane compounds to obtain oligomers reaction to produce polysiloxane particles. For example, a silane compound having a vinyl group can be polymerized to obtain a silane compound having a vinyl group bonded to a silicon atom at the terminal as a polymer (oligomer, etc.). A silane compound having a phenyl group bonded to a silicon atom in a side chain can be obtained as a polymer (oligomer, etc.) by polymerizing a silane compound having a phenyl group. It is also possible to polymerize a silane compound with a vinyl group and a silane compound with a phenyl group to obtain a vinyl group bonded to a silicon atom at the end and a bonded side chain in the form of a polymer (oligomer, etc.) A silane compound with a phenyl group on a silicon atom. Polysiloxane particles can also have a plurality of particles on the outer surface. In this case, the polysiloxane particle has a polysiloxane particle main body and a plurality of particles arranged on the surface of the polysiloxane particle main body, and the polysiloxane particle main body has the above-mentioned structure 1, the above-mentioned structure 1', the above-mentioned Configuration 1'', the aforementioned configuration 2, the aforementioned configuration 2', the aforementioned configuration 3, or the aforementioned configuration 3'. Examples of the plurality of particles include polysiloxane particles, spherical silicon oxide, and the like. Aggregation of polysiloxane particles can be suppressed by the existence of the above-mentioned plurality of particles. The above-mentioned polysiloxane particles may also contain a light-shielding agent. By using the above-mentioned light-shielding agent, the sealing compound for liquid crystal display elements containing silicone particle can be used suitably as a light-shielding sealing compound. Examples of the light-shielding agent include polypyrrole, iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. Titanium black is preferred. The above-mentioned light-shielding material may exist in the interior of the polysiloxane particle, and may also exist on the outer surface. (Sealing compound for liquid crystal display elements and sealing compound for liquid crystal dropping methods) The sealing compound for liquid crystal display elements is preferably a sealing compound for liquid crystal dropping methods. The said silicone particle can be suitably used for the sealing compound for liquid crystal dropping methods. It is preferable that the said sealing compound for liquid crystal dropping methods (it may abbreviate as sealing compound hereafter) is hardened by heating. The sealing agent described above preferably contains a thermosetting component and the polysiloxane particles described above. The above sealing agent may or may not contain a photocurable component. The sealing agent may or may not be irradiated with light in order to be cured. In addition, when the above-mentioned sealant does not contain a photocurable component, it can also be stored under irradiation with light. The above-mentioned thermosetting component preferably contains a thermosetting compound, and a polymerization initiator or a thermosetting agent. In this case, a polymerization initiator and a thermosetting agent can also be used together. The content of the polysiloxane particles is preferably at least 3 parts by weight, more preferably at least 5 parts by weight, and preferably at most 70 parts by weight, more preferably at most 50 parts by weight, relative to 100 parts by weight of the above-mentioned thermosetting compound. . The adhesiveness of the sealing compound for liquid crystal dropping methods obtained as content of the said polysiloxane particle is more than the said minimum and below the said upper limit becomes more favorable. Examples of the thermosetting compounds include: oxetane compounds, epoxy compounds, episulfide compounds, (meth)acrylic compounds, phenolic compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, Ester compounds, polysiloxane compounds and polyimide compounds, etc. The said thermosetting compound may use only 1 type, and may use 2 or more types together. From the viewpoint of further improving adhesiveness and long-term reliability, the thermosetting compound preferably contains a (meth)acrylic compound, and more preferably contains epoxy (meth)acrylate. The above "(meth)acrylic compound" means a compound having a (meth)acryl group. The above "epoxy (meth)acrylate" means a compound obtained by reacting (meth)acrylic acid with all epoxy groups in an epoxy compound. Furthermore, "(meth)acrylic acid" means either or both of "acrylic acid" and "methacrylic acid", and "(meth)acryl" means "acryl" and "methacryl". One or both of "group", "(meth)acrylate" means one or both of "acrylate" and "methacrylate". As an epoxy compound used as a raw material for synthesizing the above-mentioned epoxy (meth)acrylate, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, 2, 2'-diallyl bisphenol A type epoxy resin, hydrogenated bisphenol type epoxy resin, propylene oxide added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin Resins, sulfide-type epoxy resins, diphenyl ether-type epoxy resins, dicyclopentadiene-type epoxy resins, naphthalene-type epoxy resins, phenolic novolac-type epoxy resins, ortho-cresol novolac-type epoxy resins Resin, dicyclopentadiene novolac epoxy resin, biphenyl novolac epoxy resin, naphthol novolac epoxy resin, glycidylamine epoxy resin, alkyl polyol epoxy resin, Rubber modified epoxy resin, glycidyl ester compound, and bisphenol A type episulfide resin, etc. As a commercial item of the said bisphenol-A type epoxy resin, jER828EL, jER1001, and jER1004 (all are the Mitsubishi Chemical Corporation make), Epiclon850-S (the DIC Corporation make), etc. are mentioned, for example. As a commercial item of the said bisphenol F type epoxy resin, jER806, jER4004 (all are the Mitsubishi Chemical Corporation make), etc. are mentioned, for example. As what is marketed as the said bisphenol S type epoxy resin, Epiclon EXA1514 (made by DIC Corporation) etc. are mentioned, for example. As a commercial item of the said 2,2'- diallyl bisphenol A type epoxy resin, RE-810NM (made by Nippon Kayaku Co., Ltd.) etc. are mentioned, for example. As what is marketed as the said hydrogenated bisphenol type epoxy resin, Epiclon EXA7015 (made by DIC Corporation) etc. are mentioned, for example. As what is marketed as the said propylene oxide addition bisphenol A type epoxy resin, EP-4000S (made by ADEKA company) etc. are mentioned, for example. As what is marketed as the said resorcinol type epoxy resin, EX-201 (made by Nagase ChemteX Co., Ltd.) etc. are mentioned, for example. As a commercial item of the said biphenyl type epoxy resin, jERYX-4000H (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example. As a commercial item of the said sulfide type epoxy resin, YSLV-50TE (made by Nippon Steel Sumikin Chemicals Co., Ltd.) etc. are mentioned, for example. As a commercial item of the said diphenyl ether type epoxy resin, YSLV-80DE (made by Nippon Steel Sumikin Chemicals Co., Ltd.) etc. are mentioned, for example. As what is marketed about the said dicyclopentadiene type epoxy resin, EP-4088S (made by ADEKA company) etc. are mentioned, for example. As a commercial item of the said naphthalene type epoxy resin, Epiclon HP4032, Epiclon EXA-4700 (all are the DIC company make), etc. are mentioned, for example. As a commercial item of the said phenolic novolak type epoxy resin, Epiclon N-770 (made by DIC Corporation) etc. are mentioned, for example. As what is marketed as the said ortho-cresol novolac type epoxy resin, Epiclon N-670-EXP-S (made by DIC Corporation) etc. are mentioned, for example. As what is marketed as the said dicyclopentadiene novolac type epoxy resin, Epiclon HP7200 (made by DIC Corporation) etc. are mentioned, for example. As a commercial item of the said biphenyl novolac type epoxy resin, NC-3000P (made by Nippon Kayaku Co., Ltd.) etc. are mentioned, for example. As a commercial item of the said naphthol type novolac type epoxy resin, ESN-165S (made by Nippon Steel Sumikin Chemicals Co., Ltd.) etc. are mentioned, for example. As a commercial item of the said glycidylamine type epoxy resin, jER630 (made by Mitsubishi Chemical Corporation), Epiclon 430 (made by DIC Corporation), Tetrad-X (made by MITSUBISHI GAS CHEMICAL) etc. are mentioned, for example. As a commercial item of the said alkyl polyol type epoxy resin, ZX-1542 (made by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.), Epiclon 726 (made by DIC Corporation), Epolight80MFA (made by Kyoeisha Chemical Co., Ltd.) is mentioned, for example; DENACOL EX-611 (manufactured by Nagase ChemteX Co., Ltd.) and the like. As a commercial item of the said rubber-modified epoxy resin, YR-450 and YR-207 (both are manufactured by Nippon Steel Sumikin Chemical Co., Ltd.), Epolead PB (made by Daicel Corporation), etc. are mentioned, for example. As a commercial item of the said glycidyl ester compound, DENACOL EX-147 (made by Nagase ChemteX Co., Ltd.) etc. are mentioned, for example. As a commercial item of the said bisphenol A type episulfide resin, jERYL-7000 (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example. As other commercial products of the above-mentioned epoxy resin, for example, YDC-1312, YSLV-80XY, and YSLV-90CR (all manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.); XAC4151 (manufactured by Asahi Kasei); jER1031 and jER1032 (both manufactured by Mitsubishi Chemical Corporation); EXA-7120 (manufactured by DIC Corporation); TEPIC (manufactured by Nissan Chemical Corporation) and the like. Examples of commercially available epoxy (meth)acrylates include: EBECRYL860, EBECRYL3200, EBECRYL3201, EBECRYL3412, EBECRYL3600, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRYL3703, EBECRYL3800, EBECRYL6 040, and EBECRYL RDX63182 (both Daicel-Allnex Manufactured by the company); EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, and EMA-1020 (all manufactured by Shin-Nakamura Chemical Industry Co., Ltd.); Epoxy Ester M-600A, Epoxy Ester 40EM , epoxy ester 70PA, epoxy ester 200PA, epoxy ester 80MFA, epoxy ester 3002M, epoxy ester 3002A, epoxy ester 1600A, epoxy ester 3000M, epoxy ester 3000A, epoxy ester 200EA, and epoxy ester 400EA (all manufactured by Kyoeisha Chemical Co.); Denacol Acrylate DA-141, Denacol Acrylate DA-314, and Denacol Acrylate DA-911 (all manufactured by Nagase ChemteX Corporation); and the like. Examples of (meth)acrylic compounds other than the above-mentioned epoxy (meth)acrylates include ester compounds obtained by reacting a compound having a hydroxyl group with (meth)acrylic acid, and ester compounds obtained by reacting a compound having a hydroxyl group with Urethane (meth)acrylate obtained by reacting a hydroxyl (meth)acrylic acid derivative with an isocyanate compound, etc. As the ester compound obtained by reacting a compound having a hydroxyl group with the above-mentioned (meth)acrylic acid, any one of a monofunctional ester compound, a bifunctional ester compound, and a trifunctional or more functional ester compound can be used. Examples of the monofunctional ester compound include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (meth)acrylic acid 2-Hydroxybutyl, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, isooctyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate , (Meth) Acrylic Iso
Figure 111135747-001
Cyclohexyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, methoxyethylene glycol (meth)acrylate, 2-ethoxyethyl (meth)acrylate , tetrahydrofurfuryl (meth)acrylate, benzyl (meth)acrylate, ethyl carbitol (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxydiethylene glycol ( Meth)acrylate, Phenoxypolyethylene glycol (meth)acrylate, Methoxypolyethylene glycol (meth)acrylate, 2,2,2-Trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, 1H,1H,5H-octafluoropentyl (meth)acrylate, imide (meth)acrylate, methyl (meth)acrylate ester, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, (meth)acrylate base) isononyl acrylate, isomyristyl (meth)acrylate, 2-butoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate Alkenyl esters, isodecyl (meth)acrylate, diethylaminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, 2-(meth)acryloxyethylsuccinate Acid, 2-(meth)acryloxyethylhexahydrophthalic acid, 2-(meth)acryloxyethyl 2-hydroxypropylphthalate, glycidyl (meth)acrylate ester, and 2-(meth)acryloxyethyl phosphate, etc. Examples of the bifunctional ester compound include: 1,4-butanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, (Meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 2-n-butyl-2-ethyl-1, 3-Propylene Glycol Di(meth)acrylate, Dipropylene Glycol Di(meth)acrylate, Tripropylene Glycol Di(meth)acrylate, Polypropylene Glycol Di(meth)acrylate, Ethylene Glycol Di(meth)acrylate ester, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene oxide added bisphenol A bis(methyl) ) acrylate, ethylene oxide added bisphenol A di(meth)acrylate, ethylene oxide added bisphenol F di(meth)acrylate, dimethylol dicyclopentadienyl di( Meth)acrylate, 1,3-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, ethylene oxide modified isocyanuric acid di(meth)acrylate ester, 2-hydroxy-3-(meth)acryloxypropyl (meth)acrylate, carbonate diol di(meth)acrylate, polyether diol di(meth)acrylate, polyester Diol di(meth)acrylate, polycaprolactone diol di(meth)acrylate, polybutadiene diol di(meth)acrylate, and the like. Examples of the above-mentioned trifunctional or higher ester compound include: pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, propylene oxide-added trimethylolpropane tri(methyl) Acrylates, ethylene oxide added trimethylolpropane tri(meth)acrylate, caprolactone modified trimethylolpropane tri(meth)acrylate, ethylene oxide added isocyanur Acid tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate Acrylates, glycerin tri(meth)acrylate, propylene oxide added glycerin tri(meth)acrylate, and tri(meth)acryloxyethyl phosphate, etc. The above (meth)acrylic urethane can be prepared, for example, by making 2 equivalents of a (meth)acrylic acid derivative having a hydroxyl group relative to 1 equivalent of an isocyanate compound having 2 isocyanate groups in the presence of a catalytic amount of a tin-based compound. obtained by the reaction. Moreover, the isocyanate compound which has 2 or more isocyanate groups can also be used. Examples of isocyanate compounds used as raw materials for the above (meth)acrylate urethane include: isophorone diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, hexamethylene diisocyanate, Isocyanate, trimethylhexamethylene diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, nor
Figure 111135747-001
Alkane diisocyanate, benzylidine diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris(isocyanate phenyl) phosphorothioate, tetramethyl Xylylene diisocyanate, and 1,6,10-undecane triisocyanate, etc. As an isocyanate compound used as a raw material of the above-mentioned (meth)acrylate urethane, for example, ethylene glycol, glycerin, sorbitol, trimethylolpropane, (poly)propylene glycol, carbonate diol, A chain-extended isocyanate compound obtained by reacting polyols such as polyether diol, polyester diol, or polycaprolactone diol with excess isocyanate. Examples of (meth)acrylic acid derivatives having a hydroxyl group as raw materials for the above-mentioned urethane (meth)acrylate include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate Ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1 , 4-butanediol, mono(meth)acrylate of diols such as polyethylene glycol; mono(meth)acrylate of trihydric alcohols such as trimethylolethane, trimethylolpropane, and glycerin Acrylates and di(meth)acrylates; epoxy (meth)acrylates such as bisphenol A epoxy acrylates, etc. Examples of commercially available urethane (meth)acrylates include: M-1100, M-1200, M-1210, and M-1600 (all manufactured by Toagosei Corporation); EBECRYL230, EBECRYL270, EBECRYL4858, EBECRYL8402, EBECRYL8804, EBECRYL8803, EBECRYL8807, EBECRYL9260, EBECRYL1290, EBECRYL5129, EBECRYL4842, EBECRYL210, EBECRYL4827, EBECRYL6700, EBECRYL YL220, and EBECRYL2220 (both manufactured by Daicel-Allnex); Artresin UN-9000H, Artresin UN-9000A, Artresin UN -7100, Artresin UN-1255, Artresin UN-330, Artresin UN-3320HB, Artresin UN-1200TPK, and Artresin SH-500B (manufactured by Negami Industries); U-122P, U-108A, U-340P, U -4HA, U-6HA, U-324A, U-15HA, UA-5201P, UA-W2A, U-1084A, U-6LPA, U-2HA, U-2PHA, UA-4100, UA-7100, UA-4200 , UA-4400, UA-340P, U-3HA, UA-7200, U-2061BA, U-10H, U-122A, U-340A, U-108, U-6H, and UA-4000 (all Xinzhongcun Chemical Industry Corporation); AH-600, AT-600, UA-306H, AI-600, UA-101T, UA-101I, UA-306T, and UA-306I (all manufactured by Kyoeisha Chemical Corporation), etc. From the viewpoint of suppressing adverse effects on liquid crystals, the (meth)acrylic compound is preferably a unit having hydrogen bonding properties such as -OH group, -NH- group, and -NH 2 group. The above-mentioned (meth)acrylic compound preferably has two or three (meth)acryloyl groups from the viewpoint of improving reactivity. The said thermosetting compound may contain an epoxy compound from a viewpoint of improving the adhesiveness of the sealing compound for liquid crystal display elements. As said epoxy compound, the epoxy compound which is a raw material for synthesizing the said epoxy (meth)acrylate, a partial (meth)acryl-modified epoxy compound, etc. are mentioned, for example. The aforementioned partially (meth)acryl-modified epoxy compound means a compound having one or more epoxy groups and (meth)acryl groups. The above-mentioned partially (meth)acrylic-modified epoxy compound can be obtained, for example, by reacting (meth)acrylic acid with one part of two or more epoxy groups among compounds having two or more epoxy groups. As a commercial product of the above-mentioned partially (meth)acrylic-modified epoxy compound, for example, KRM8287 (manufactured by Daicel-Allnex Co., Ltd.) and the like using the above-mentioned (meth)acrylic compound and the above-mentioned epoxy compound as the above-mentioned thermosetting compound In this case, the epoxy group is preferably at least 20 mol%, more preferably 50 mol% of the total 100 mol% of (meth)acryl and epoxy groups in the thermosetting compound as a whole %the following. When the said epoxy group is below the said upper limit, the solubility to the liquid crystal of the sealing compound for liquid crystal display elements will fall, and liquid crystal contamination will become less likely to generate|occur|produce, and the display performance of a liquid crystal display element will become more favorable. As said polymerization initiator, a radical polymerization initiator, a cationic polymerization initiator, etc. are mentioned. The said polymerization initiator may use only 1 type, and may use 2 or more types together. As said radical polymerization initiator, the photoradical polymerization initiator which generate|occur|produces a radical by light irradiation, the thermal radical polymerization initiator which generate|occur|produces a radical by heating, etc. are mentioned. The above-mentioned radical polymerization initiator has a particularly fast curing rate compared with a thermosetting agent. Therefore, by using the radical polymerization initiator, it is possible to suppress the occurrence of seal breakage or liquid crystal contamination, and also suppress the springback that is likely to occur due to the above-mentioned polysiloxane particles. Examples of the photoradical polymerization initiator include: benzophenone-based compounds, acetophenone-based compounds, acylphosphine oxide-based compounds, titanocene-based compounds, oxime ester-based compounds, benzoin ether-based compounds, and 9-oxosulfur
Figure 111135747-002
wait. Examples of commercially available commercially available photoradical initiators include: IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE819, IRGACURE907, IRGACURE2959, IRGACURE OXE01, and Lucirin TPO (all manufactured by BASF Japan); , Benzoin Ethyl Ether, and Benzoin Isopropyl Ether (all manufactured by Tokyo Chemical Industry Co., Ltd.), etc. As said thermal radical polymerization initiator, an azo compound, an organic peroxide, etc. are mentioned, for example. It is preferably an azo compound, more preferably a polymeric azo initiator as a polymeric azo compound. The so-called high-molecular azo compound means a compound having an azo group, generating free radicals capable of hardening (meth)acryloxy groups by heat, and having a number average molecular weight of 300 or more. The number average molecular weight of the above-mentioned high molecular weight azo initiator is preferably 1000 or more, more preferably 5000 or more, further preferably 10,000 or more, and preferably 300,000 or less, more preferably 100,000 or less, and more preferably less than 90,000. If the number average molecular weight of the said polymeric azo initiator is more than the said minimum, it will be hard for a polymeric azo initiator to exert a bad influence on a liquid crystal. When the number average molecular weight of the said high molecular weight azo initiator is below the said upper limit, it will become easy to mix with a thermosetting compound. The above-mentioned number average molecular weight is measured by gel permeation chromatography (GPC), and is a value obtained in terms of polystyrene. As a column used for GPC measurement, Shodex LF-804 (made by Showa Denko Co., Ltd.) etc. are mentioned, for example. As said polymeric azo initiator, the polymeric azo initiator etc. which have the structure which unites, such as a polyalkylene oxide or a polydimethylsiloxane, couple|bonded via an azo group are mentioned, for example. The polymeric azo initiator having a structure in which a plurality of units such as polyalkylene oxide are bonded via an azo group preferably has a polyethylene oxide structure. Examples of such polymeric azo initiators include polycondensates of 4,4'-azobis(4-cyanovaleric acid) and polyalkylene glycol, and 4,4'-azo Condensation products of bis(4-cyanovaleric acid) and polydimethylsiloxane having terminal amino groups, etc., specific examples include: VPE-0201, VPE-0401, VPE-0601, VPS-0501 , VPS-1001, and V-501 (all manufactured by Wako Pure Chemical Industries, Ltd.). Examples of the organic peroxide include ketone peroxide, peroxyketal, hydrogen peroxide, dialkyl peroxide, ester peroxide, diacyl peroxide, and peroxydicarbonate. As the above cationic polymerization initiator, a photocationic polymerization initiator can be preferably used. The above-mentioned photocationic polymerization initiator generates a protonic acid or a Lewis acid by light irradiation. The type of the above-mentioned photocationic polymerization initiator is not particularly limited, and may be an ionic photoacid generating type or a nonionic photoacid generating type. Examples of the above-mentioned photocationic polymerization initiator include: onium salts such as aromatic diazonium salts, aromatic halide onium salts, and aromatic permeic acid salts; iron-allene complexes; titanocene complexes ; Arylsilanol-aluminum complexes and other organometallic complexes, etc. As a commercial item of the said photocationic polymerization initiator, Adeka Optomer SP-150, Adeka Optomer SP-170 (all are the ADEKA company make), etc. are mentioned, for example. The content of the polymerization initiator is preferably at least 0.1 part by weight, more preferably at least 1 part by weight, and preferably at most 30 parts by weight, more preferably at most 10 parts by weight, relative to 100 parts by weight of the above-mentioned thermosetting compound. , and more preferably 5 parts by weight or less. The sealing compound for liquid crystal display elements can fully be hardened as content of the said polymerization initiator is more than the said minimum. The storage stability of the sealing compound for liquid crystal display elements becomes high that content of the said polymerization initiator is below the said upper limit. Examples of the thermosetting agent include organic acid hydrazides, imidazole derivatives, amine compounds, polyphenol compounds, and acid anhydrides. An organic acid hydrazide which is solid at 23°C can be preferably used. The said thermosetting agent may use only 1 type, and may use 2 or more types together. Examples of organic acid hydrazides that are solid at 23°C include 1,3-bis(hydrazinocarbonylethyl)-5-isopropylhydantoylurea, sebacylhydrazine, and isophthalic acid dihydrazine. Hydrazine, adipic hydrazine, malonyl hydrazine, etc. Examples of commercially available organic acid hydrazides that are solid at 23° C. include: Amicure VDH and Amicure UDH (all manufactured by Ajinomoto Fine-Techno); SDH, IDH, ADH, and MDH (all Otsuka chemical company), etc. The content of the thermosetting agent is preferably at least 1 part by weight, and is preferably at most 50 parts by weight, more preferably at most 30 parts by weight, based on 100 parts by weight of the thermosetting compound. When content of the said thermosetting agent is more than the said minimum, the sealing compound for liquid crystal display elements can be fully thermosetted. When content of the said thermosetting agent is below the said upper limit, the viscosity of the sealing compound for liquid crystal display elements will not become too high, and applicability will become favorable. It is preferable that the said sealing compound for liquid crystal display elements contains a hardening accelerator. By using the above-mentioned curing accelerator, the sealant can be sufficiently cured without heating at high temperature. Examples of the hardening accelerator include polycarboxylic acids having an isocyanuric acid ring skeleton, epoxy resin amine adducts, and the like, specifically, tris(2-carboxymethyl)isocyanurate ester, tris(2-carboxyethyl) isocyanurate, tris(3-carboxypropyl) isocyanurate, bis(2-carboxyethyl) isocyanurate, etc. The content of the curing accelerator is preferably at least 0.1 parts by weight and preferably at most 10 parts by weight relative to 100 parts by weight of the thermosetting compound. The sealing compound for liquid crystal display elements will fully harden|cure as content of the said hardening accelerator is more than the said minimum, and it is not necessary to heat at high temperature for hardening. The adhesiveness of the sealing compound for liquid crystal display elements will become high that content of the said hardening accelerator is below the said upper limit. It is preferable that the liquid crystal display element sealant contains a filler in order to increase the viscosity, improve the adhesiveness due to the stress dispersion effect, improve the linear expansion coefficient, and improve the moisture resistance of the cured product. Examples of the filler include talc, asbestos, silicon oxide, diatomaceous earth, bentonite, bentonite, calcium carbonate, magnesium carbonate, alumina, montmorillonite, zinc oxide, iron oxide, magnesium oxide, tin oxide, Titanium oxide, magnesium hydroxide, aluminum hydroxide, glass beads, silicon nitride, barium sulfate, gypsum, calcium silicate, sericite, activated clay, and inorganic fillers such as aluminum nitride, or polyester particles, polyamine-based Organic fillers such as formate particles, vinyl polymer particles, acrylic polymer particles, and core-shell acrylate copolymer particles. The said filler may use only 1 type, and may use 2 or more types together. In 100% by weight of the sealing agent for liquid crystal display elements, the content of the filler is preferably at least 10% by weight, more preferably at least 20% by weight, and is preferably at most 70% by weight, more preferably at most 60% by weight. When content of the said filler is more than the said minimum, effects, such as improvement of adhesiveness, are fully exhibited. When content of the said filler is below the said upper limit, the viscosity of the sealing compound for liquid crystal display elements will not become too high, and applicability will become favorable. It is preferable that the said sealing compound for liquid crystal display elements contains a silane coupling agent. The above-mentioned silane coupling agent mainly functions as an adhesive auxiliary agent for bonding the sealant and the substrate etc. well. A silane coupling agent may use only 1 type, and may use 2 or more types together. As for the above silane coupling agent, it is excellent in the effect of improving the adhesion with the substrate, etc., and can suppress the outflow of the curable resin into the liquid crystal by chemically bonding with the curable resin. For example, N-phenyl is preferable. -3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane or 3-isocyanate propyl Trimethoxysilane, etc. The content of the above-mentioned silane coupling agent is preferably at least 0.1% by weight, more preferably at least 0.5% by weight, and preferably at most 20% by weight, more preferably at most 10% by weight, in 100% by weight of the above-mentioned sealant for liquid crystal display elements . When content of the said silane coupling agent is more than the said minimum, the effect brought about by compounding a silane coupling agent will fully be exhibited. Contamination of the liquid crystal by the sealing compound for liquid crystal display elements as content of the said silane coupling agent is below the said upper limit will be suppressed further. The said sealing compound for liquid crystal display elements may contain a light-shielding agent. By using the above-mentioned light-shielding agent, the sealing compound for liquid crystal display elements can be used preferably as a light-shielding sealing compound. As said light-shielding agent, iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, resin-coated carbon black, etc. are mentioned, for example. Titanium black is preferred. A liquid crystal display element manufactured using a sealant for liquid crystal display elements containing a light-shielding agent has sufficient light-shielding properties, so a liquid crystal display element with high contrast and excellent image display quality without light leakage can be realized. The above-mentioned titanium black is a material with higher transmittance for light near the ultraviolet region, especially for light with a wavelength of 370-450 nm, compared with the average transmittance for light with a wavelength of 300-800 nm. The above-mentioned titanium black has the property of imparting light-shielding properties to the sealant for liquid crystal display elements by sufficiently shielding light of wavelengths in the visible region, and has the property of transmitting light of wavelengths near the ultraviolet region. It is preferable that the light-shielding agent contained in the sealing compound for liquid crystal display elements has high insulating property, and titanium black is preferable as a light-shielding agent with high insulating property. The optical density (OD value) per 1 μm of the titanium black is preferably 3 or more, more preferably 4 or more. The higher the light-shielding property of the above-mentioned titanium black, the better. There is no particular preferred upper limit for the OD value of the above-mentioned titanium black, but the OD value is usually below 5. The aforementioned titanium black and carbon black exhibit sufficient effects even without surface treatment. Titanium black whose surface has been treated with organic components such as coupling agents, or titanium black coated with inorganic components such as silicon oxide, titanium oxide, germanium oxide, aluminum oxide, zirconia, and magnesium oxide, etc., which have been surface-treated can also be used. Titanium black treated with an organic component is preferable in terms of improving insulation. Examples of commercially available titanium black include 12S, 13M, 13M-C, 13R-N, and 14M-C (all made by Mitsubishi Materials); Tilack D (manufactured by Ako Kasei). The specific surface area of the aforementioned titanium black is preferably at least 13 m 2 /g, more preferably at least 15 m 2 /g, and preferably at most 30 m 2 /g, more preferably at most 25 m 2 /g. The volume resistance of the above-mentioned titanium black is preferably at least 0.5 Ω·cm, more preferably at least 1 Ω·cm, and is preferably at most 3 Ω·cm, more preferably at most 2.5 Ω·cm. The primary particle diameter of the said light-shielding agent affects the space|interval between two members for liquid crystal display elements. The primary particle diameter of the above-mentioned light-shielding agent is preferably at least 1 nm, more preferably at least 5 nm, further preferably at least 10 nm, and more preferably at most 5 μm, more preferably at most 200 nm, further preferably at least 100 nm the following. When the primary particle diameter of the said light-shielding agent is more than the said minimum, the viscosity and thixotropy of the sealing compound for liquid crystal display elements are hard to increase largely, and workability|operativity becomes favorable. Coatability of the sealing compound for liquid crystal display elements becomes favorable that the primary particle diameter of the said light-shielding agent is below the said upper limit. The content of the opacifying agent is preferably at least 5% by weight, more preferably at least 10% by weight, further preferably at least 30% by weight, and more preferably at most 80% by weight, based on 100 parts by weight of the above-mentioned thermosetting compound. More preferably, it is 70 weight% or less, More preferably, it is 60 weight% or less. Sufficient light-shielding property will be acquired as content of the said light-shielding agent is more than the said minimum. When content of the said light-shielding agent is below the said upper limit, the adhesiveness of the sealing compound for liquid crystal display elements, or the intensity|strength after hardening will become high, and also drawing property will become high. The said sealing compound for liquid crystal display elements may contain a stress reliever, a reactive diluent, a thixotropic agent, a spacer, a hardening accelerator, an antifoamer, a leveling agent, a polymerization inhibitor, other additives etc. as needed. There are no particular limitations on the method of producing the above-mentioned sealant for liquid crystal display elements. For example, it is possible to use a mixer such as a homogeneous disperser, a homomixer, a universal mixer, a planetary mixer, a kneader, and a three-roll mill. Compounds, polymerization initiators or thermosetting agents, polysiloxane particles, and methods of mixing additives such as silane coupling agents if necessary, etc. The viscosity at 25°C and 1 rpm of the liquid crystal display element sealant is preferably not less than 50,000 Pa·s, more preferably not more than 500,000 Pa·s, more preferably not more than 400,000 Pa·s. Coatability of the sealing compound for liquid crystal display elements becomes favorable that the said viscosity is more than the said minimum and below the said upper limit. The above viscosity is measured using an E-type viscometer. (Liquid crystal display element) A liquid crystal display element can be obtained using the said sealing compound for liquid crystal display elements. The liquid crystal display element comprises: a member for a first liquid crystal display element; a member for a second liquid crystal display element; The outer peripheries of the first member for liquid crystal display element and the second member for liquid crystal display element are sealed; between. In this liquid crystal display element, the liquid crystal dropping method is applied, and the said sealing part is formed by thermosetting the sealing compound for liquid crystal dropping methods. The said sealing part is the thermosetting material of the sealing compound for liquid crystal dropping methods. Fig. 1 is a cross-sectional view schematically showing an example of a liquid crystal display element using polysiloxane particles. A liquid crystal display element 1 shown in FIG. 1 has a pair of transparent glass substrates 2 . The transparent glass substrate 2 has an insulating film (not shown) on the facing surface. As a material of an insulating film, SiO2 etc. are mentioned, for example. A transparent electrode 3 is formed on the insulating film on the transparent glass substrate 2 . As a material of the transparent electrode 3, ITO etc. are mentioned. The transparent electrode 3 can be formed by patterning, for example, by photolithography. An alignment film 4 is formed on the transparent electrode 3 on the surface of the transparent glass substrate 2 . As a material of the alignment film 4, polyimide etc. are mentioned. A liquid crystal 5 is sealed between a pair of transparent glass substrates 2 . A plurality of spacer particles 7 are arranged between a pair of transparent glass substrates 2 . The space between a pair of transparent glass substrates 2 is restricted by a plurality of spacer particles 7 . A sealing portion 6 is arranged between the outer peripheries of the pair of transparent glass substrates 2 . The liquid crystal 5 is prevented from flowing out to the outside by the sealing portion 6 . The sealing portion 6 contains silicone particles 6A. In the liquid crystal display element 1, the member positioned above the liquid crystal 5 is a first liquid crystal display element member, and the member positioned below the liquid crystal is a second liquid crystal display element member. In addition, the liquid crystal display element shown in FIG. 1 is an example, and the structure of a liquid crystal display element can be changed suitably. (Connection structure) The said polysiloxane particle is for obtaining the electroconductive particle which formed the conductive layer on the surface and has the said conductive layer. A connection structure can be obtained by connecting the members to be connected using the above-mentioned electroconductive particles or using a conductive material containing the above-mentioned electroconductive particles and a binder resin. The connection structure preferably includes a first connection object member, a second connection object member, and a connection portion connecting the first connection object member and the second connection object member, and the connection portion is formed by the conductive particles. , or a connection structure formed of a conductive material including the above-mentioned conductive particles and a binder resin. When using electroconductive particle independently, the connection part itself is electroconductive particle. That is, the 1st, 2nd connection object member is connected by electroconductive particle. The above-mentioned conductive material used to obtain the above-mentioned connection structure is preferably an anisotropic conductive material. It is preferable that the said 1st connection object member has a 1st electrode on the surface. It is preferable that the said 2nd connection object member has a 2nd electrode on the surface. It is preferable that the said 1st electrode and the said 2nd electrode are electrically connected by the said electroconductive particle. Fig. 2 is a front sectional view schematically showing an example of a connection structure using conductive particles. The connection structure 51 shown in FIG. 2 is equipped with the 1st connection object member 52, the 2nd connection object member 53, and the connection part 54 which connects the 1st connection object member 52 and the 2nd connection object member 53. The connection portion 54 is formed of a conductive material including conductive particles 54A and a binder resin. The connection part 54 contains 54 A of electroconductive particles. 54 A of electroconductive particles are equipped with the conductive layer arrange|positioned on the surface of polysiloxane particle and a polysiloxane particle. In FIG. 2, electroconductive particle 54A is schematically shown for convenience of illustration. The first connection object member 52 has a plurality of first electrodes 52a on the surface (upper surface). The second connection object member 53 has a plurality of second electrodes 53a on the surface (lower surface). The first electrode 52a and the second electrode 53a are electrically connected by one or a plurality of conductive particles 1 . Therefore, the first and second connection object members 52 and 53 are electrically connected by the electroconductive particle 1 . The manufacturing method of the said connection structure is not specifically limited. An example of a method of manufacturing a connection structure includes a method of heating and pressurizing the laminate after disposing the conductive material between the first member to be connected and the second member to be connected to obtain a laminate. The above pressure is about 9.8×10 4 to 4.9×10 6 Pa. The temperature of the above-mentioned heating is about 120-220°C. The above-mentioned pressing pressure for connecting the electrodes of the flexible printed circuit board, the electrodes arranged on the resin film, and the electrodes of the touch panel is about 9.8×10 4 to 1.0×10 6 Pa. Specific examples of the connection target members include electronic components such as semiconductor chips, capacitors, and diodes, and electronic components such as circuit substrates such as printed circuit boards, flexible printed circuit boards, glass epoxy substrates, and glass substrates. The above-mentioned conductive material is preferably a conductive material used to connect electronic parts. The above-mentioned conductive paste is preferably a paste-like conductive material, and is applied on the member to be connected in a paste-like state. The above-mentioned conductive particles and the above-mentioned conductive material are also preferably used in a touch panel. Therefore, it is also preferable that the above-mentioned connection target member is a flexible substrate or a connection target member in which electrodes are arranged on the surface of the resin film. The above-mentioned connection target member is preferably a flexible substrate, and is preferably a connection target member in which electrodes are arranged on the surface of the resin film. When the above-mentioned flexible substrate is a flexible printed circuit board or the like, the flexible substrate usually has electrodes on the surface. Examples of electrodes provided on the member to be connected include metal electrodes such as gold electrodes, nickel electrodes, tin electrodes, aluminum electrodes, copper electrodes, silver electrodes, molybdenum electrodes, and tungsten electrodes. When the above-mentioned member to be connected is a flexible substrate, the above-mentioned electrode is preferably a gold electrode, a nickel electrode, a tin electrode or a copper electrode. When the above-mentioned member to be connected is a glass substrate, the above-mentioned electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, or a tungsten electrode. Furthermore, when the above-mentioned electrode is an aluminum electrode, it may be an electrode formed only of aluminum, or may be an electrode in which an aluminum layer is deposited on the surface of the metal oxide layer. Examples of the material for the metal oxide layer include indium oxide doped with a trivalent metal element, zinc oxide doped with a trivalent metal element, and the like. Sn, Al, Ga, etc. are mentioned as said trivalent metal element. (Electronic Component Device) The polysiloxane particles are arranged between the first ceramic member and the second ceramic member on the outer peripheral portions of the first ceramic member and the second ceramic member, and can also be used as a gap control material. Fig. 3 is a cross-sectional view schematically showing an example of an electronic component device using polysiloxane particles. FIG. 4 is an enlarged cross-sectional view of a junction portion (a portion surrounded by a dotted line in FIG. 3 ) in the electronic component device shown in FIG. 3 . The electronic component device 71 shown in FIGS. 3 and 4 includes a first ceramic member 72 , a second ceramic member 73 , a bonding portion 74 , an electronic component 75 , and a lead frame 76 . The first and second ceramic members 72 and 73 are each formed of a ceramic material. The first and second ceramic members 72 and 73 are, for example, housings. The first ceramic member 72 is, for example, a substrate. The second ceramic member 73 is, for example, a cover. The first ceramic member 72 has a convex portion protruding toward the second ceramic member 73 side (upper side) on the outer peripheral portion. The 1st ceramic member 72 has the recessed part which forms the internal space R for accommodating the electronic component 75 on the 2nd ceramic member 73 side (upper side). In addition, the 1st ceramic member 72 does not need to have a convex part. The second ceramic member 73 has a convex portion protruding toward the first ceramic member 72 side (lower side) on the outer peripheral portion. The second ceramic member 73 has a concave portion forming an internal space R for accommodating the electronic component 75 on the side (lower side) of the first ceramic member 72 . In addition, the 2nd ceramic member 73 does not need to have a convex part. The joining portion 74 joins the outer peripheral portion of the first ceramic member 72 and the outer peripheral portion of the second ceramic member 73 . Specifically, the joining portion 74 joins the convex portion of the outer peripheral portion of the first ceramic member 72 and the convex portion of the outer peripheral portion of the second ceramic member 73 . A package is formed by the first and second ceramic members 72 and 73 joined by the joining portion 74 . The internal space R is formed by packaging. The joint portion 74 seals the internal space R in a liquid-tight and air-tight manner. The engaging portion 74 is a closing portion. The electronic component 75 is arranged in the internal space R of the above-mentioned package. Specifically, the electronic component 75 is arranged on the first ceramic member 72 . In this embodiment, two electronic components 75 are used. The bonding portion 74 includes a plurality of polysiloxane particles 74A and glass 74B. The bonding portion 74 is formed using a bonding material including a plurality of particles 74A different from glass particles and glass 74B. The bonding material is a bonding material for a ceramic package. The bonding material may contain a solvent or may contain a resin. In the joint portion 74, glass 74B such as glass particles is melted and bonded and then solidified. Examples of electronic components include sensor elements, MEMS (microelectromechanical system, microelectromechanical systems), and bare crystals. As said sensor element, a pressure sensor element, an acceleration sensor element, a CMOS sensor element, a CCD sensor element, etc. are mentioned. The lead frame 76 is disposed between the outer peripheral portion of the first ceramic member 72 and the outer peripheral portion of the second ceramic member 73 . The lead frame 76 extends along the inner space R side and the outer space side of the package. The terminals of the electronic component 75 and the lead frame 76 are electrically connected through wires. The joint part 74 directly joins the outer peripheral part of the 1st ceramic member 72 and the outer peripheral part of the 2nd ceramic member 73 partially, and joins partially indirectly. Specifically, the bonding portion 74 connects the outer periphery of the first ceramic member 72 and the outer periphery of the second ceramic member 73 via the lead frame 76 in a portion where the lead frame 76 exists between the outer periphery of the first ceramic member 72 and the outer periphery of the second ceramic member 73 . The outer peripheral portion of the second ceramic member 73 is indirectly bonded. In the portion where the lead frame 76 exists between the outer peripheral portion of the first ceramic member 72 and the outer peripheral portion of the second ceramic member 73, the first ceramic member 72 is in contact with the lead frame 76, and the lead frame 76 is connected to the first ceramic member 72. and the bonding portion 74 , the bonding portion 74 is in contact with the lead frame 76 and the second ceramic member 73 , and the second ceramic member 73 is in contact with the bonding portion 74 . The bonding portion 74 connects the outer periphery of the first ceramic member 72 and the outer periphery of the second ceramic member 73 in a portion where the lead frame 76 does not exist between the outer periphery of the first ceramic member 72 and the outer periphery of the second ceramic member 73 . department directly. In a portion where the lead frame 76 is not present between the outer peripheral portion of the first ceramic member 72 and the outer peripheral portion of the second ceramic member 73 , the bonding portion 74 is in contact with the first ceramic member 72 and the second ceramic member 73 . Distance between the outer periphery of the first ceramic member 72 and the outer periphery of the second ceramic member 73 in the portion where the lead frame 76 exists between the outer periphery of the first ceramic member 72 and the outer periphery of the second ceramic member 73 It is controlled by a plurality of particles 74A contained in the junction part 74 . The joining portion may directly or indirectly join the outer peripheral portion of the first ceramic member to the outer peripheral portion of the second ceramic member. Furthermore, electrical connection methods other than the lead frame can also be used. Like the electronic component device 71, the electronic component device includes, for example, a first ceramic member formed of a ceramic material, a second ceramic member formed of a ceramic material, a junction, and an electronic component. The outer peripheral portion of the ceramic member is directly or indirectly joined to the outer peripheral portion of the second ceramic member, and a package is formed by the first and second ceramic members joined by the joint portion, and the electronic components are arranged in the inner space of the package Inside, and the joint portion includes a plurality of polysiloxane particles and glass. Also, like the bonding material used for the electronic component device 71 , the bonding material for ceramic packaging is used to form the bonding portion in the electronic component device, and contains silicone particles and glass. Hereinafter, an Example and a comparative example are given, and this invention is demonstrated concretely. The present invention is not limited to the following examples. (Example 1) (1) Production of polysiloxane oligomers Add 1 part by weight of 1,3-divinyltetramethyldisiloxane to a 100 ml separable flask set in a warm bath, and 20 parts by weight of a 0.5% by weight aqueous solution of p-toluenesulfonic acid. After stirring at 40° C. for 1 hour, 0.05 parts by weight of sodium bicarbonate was added. Thereafter, 10 parts by weight of dimethoxymethylphenylsilane, 49 parts by weight of dimethyldimethoxysilane, 0.6 parts by weight of trimethylmethoxysilane, and 3.6 parts by weight of methyltrimethoxysilane were added and stirred for 1 hour. Thereafter, 1.9 parts by weight of a 10% by weight potassium hydroxide aqueous solution was added, the temperature was raised to 85° C., the pressure was reduced by an aspirator, and the mixture was stirred for 10 hours to perform a reaction. After completion of the reaction, return to normal pressure and cool to 40° C., add 0.2 parts by weight of acetic acid, and let stand in a separatory funnel for more than 12 hours. After the two layers are separated, the lower layer is taken out, and purified by an evaporator to obtain polysiloxane oligomers. (2) Preparation of polysiloxane particles (including organic polymers) Dissolve 0.5 parts by weight of tert-butyl 2-ethylperoxyhexanoate (polymerization initiator, "PERBUTYL O" manufactured by NOF Corporation) in Dissolving solution A made of 30 parts by weight of the obtained polysiloxane oligomer. Also, 0.8 parts by weight of polyoxyethylene alkylphenyl ether (emulsifier) and polyvinyl alcohol (polymerization degree: about 2000, saponification degree: 86.5-89 mole %, manufactured by Nippon Synthetic Chemicals Co., Ltd.) were mixed with 150 parts by weight of ion-exchanged water. Aqueous solution B was prepared by 80 parts by weight of a 5% by weight aqueous solution of "Gohsenol GH-20"). After adding the above-mentioned solution A to the separable flask installed in the warm bath, the above-mentioned aqueous solution B was added. Thereafter, emulsification was performed by using a Shirasu Porous Glass (SPG) membrane (average pore diameter of about 5 μm). Thereafter, the temperature was raised to 85° C., and polymerization was performed for 9 hours. After the total amount of the polymerized particles was washed with water by centrifugation, the particles were redispersed in 100 parts by weight of ion-exchanged water to obtain a dispersion. Next, 0.7 parts by weight of colloidal silicon oxide ("MP-2040" manufactured by Nissan Chemical Industries, Ltd.) was added to the dispersion, followed by freeze-drying to obtain substrate particles. Polysiloxane particles having an average particle diameter of 6.8 μm were obtained by classifying the obtained substrate particles. (Example 2) Except that 49 parts by weight of dimethyldimethoxysilane was changed to 49 parts by weight of two-capped methanol-modified reactive polysiloxane oil ("KF-6001" manufactured by Shin-Etsu Chemical Co., Ltd.) , Polysiloxane particles were obtained in the same manner as in Example 1. (Example 3) Polysiloxane particles were obtained in the same manner as in Example 1, except that 3.6 parts by weight of methyltrimethoxysilane was changed to 3.6 parts by weight of tetraethoxysilane. (Example 4) Polysiloxane particles were obtained in the same manner as in Example 1, except that 3.6 parts by weight of methyltrimethoxysilane was changed to 3.6 parts by weight of phenyltrimethoxysilane. (Example 5) Except changing 1 part by weight of 1,3-divinyltetramethyldisiloxane to 1.2 parts by weight of 1,1,3,3-tetraphenyl-1,3-divinyldisiloxane Except for parts by weight, polysiloxane particles were obtained in the same manner as in Example 1. (Example 6) Polysiloxane particles were obtained in the same manner as in Example 1, except that the Shirasu Porous Glass (SPG) film (average pore diameter of about 5 μm) was changed to a film having an average pore diameter of 1 μm. (Example 7) Prepare to dissolve 0.5 parts by weight of tert-butyl 2-ethylperoxyhexanoate (polymerization initiator, "PERBUTYL O" manufactured by NOF Corporation) in double-capped acrylic polysiloxane oil 20 10 parts by weight and 10 parts by weight of p-styryltrimethoxysilane. Also, 0.8 parts by weight of a 40% by weight aqueous solution of triethanolamine lauryl sulfate (emulsifier) and 0.8 parts by weight of polyvinyl alcohol (polymerization degree: about 2000, saponification degree: 86.5 to 89 mol%, Nippon Synthetic Aqueous solution B was prepared using 80 parts by weight of a 5% by weight aqueous solution of "Gohsenol GH-20" manufactured by a chemical company. After adding the above-mentioned solution A to the separable flask installed in the warm bath, the above-mentioned aqueous solution B was added. Thereafter, emulsification was performed by using a Shirasu Porous Glass (SPG) membrane (average pore diameter of about 20 μm). Thereafter, the temperature was raised to 85° C., and polymerization was performed for 9 hours. Polysiloxane particles A were obtained by performing a classification operation after washing the total amount of polymerized particles with water by centrifugation. Add 6.5 parts by weight of the obtained polysiloxane particles A, 0.6 parts by weight of cetyltrimethylammonium bromide, 240 parts by weight of distilled water, and 120 parts by weight of methanol to a 500 ml separable flask set in a warm bath. parts by weight. After stirring at 40° C. for 1 hour, 3.0 parts by weight of divinylbenzene and 0.5 parts by weight of styrene were added, and the mixture was heated up to 75° C. and stirred for 0.5 hours. Thereafter, 0.4 parts by weight of dimethyl 2,2'-azobis(isobutyrate) was added and stirred for 8 hours to perform a reaction. Polysiloxane particles were obtained by washing the total amount of polymerized particles with water by centrifugation. (Comparative Example 1) Polysiloxane particles were obtained in the same manner as in Example 1 except that 10 parts by weight of methoxymethylphenylsilane was not added. (Comparative Example 2) Except not adding 1,3-divinyltetramethyldisiloxane, p-toluenesulfonic acid, and tert-butyl 2-ethylperoxyhexanoate, the same method as in Example 1 was used. Polysiloxane particles were synthesized by this method, and the obtained particles were gel-like. (Comparative Example 3) Prepare 150 parts by weight of ion-exchanged water, 0.8 parts by weight of polyoxyethylene alkylphenyl ether and polyvinyl alcohol (polymerization degree: about 2000, saponification degree: 86.5-89 mol%, manufactured by Nippon Synthetic Chemicals Co., Ltd. A mixed solution of 80 parts by weight of a 5% by weight aqueous solution of "Gohsenol GH-20"). 40 parts by weight of dimethyldimethoxysilane, 10 parts by weight of dimethylphenylmethoxysilane, and 2 parts by weight of methylhydrogensiloxane were mixed at room temperature, and the total amount of the mixture was added. Thereafter, emulsification was performed by using a Shirasu Porous Glass (SPG) membrane (average pore diameter of about 5 μm). After transferring this to a separable flask and cooling to 15°C while stirring, 0.1 part by weight of a toluene solution of a chloroplatinic acid-olefin complex was added and stirred for 12 hours to obtain polysiloxane particles. (Evaluation) (1) Particle diameter of polysiloxane particles The obtained polysiloxane particles were measured for particle diameters using a laser diffraction particle size distribution analyzer ("Mastersizer 2000" manufactured by Malvern Instruments), and the average value was calculated. (2) Compressive modulus of elasticity (30%K value) of polysiloxane particles Under the condition of 23°C, use the micro-compression testing machine ("Fischerscope H-100" manufactured by Fischer) to obtain the The above compressive elastic modulus (30%K value) of polysiloxane particles was measured. (3) Preparation of sealant for liquid crystal dripping method against liquid crystal contamination: 50 parts by weight of bisphenol A epoxy methacrylate (thermosetting compound, "KRM7985" manufactured by Daicel-Allnex Co., Ltd.) Ester-modified bisphenol A type epoxy acrylate (thermosetting compound, "EBECRYL3708" manufactured by Daicel-Allnex Co., Ltd.) 20 parts by weight, partially acrylic modified bisphenol E epoxy resin (thermosetting compound, Daicel- "KRM8276" manufactured by Allnex Corporation) 30 parts by weight, 2,2-dimethoxy-2-phenylacetophenone (photoradical polymerization initiator, "IRGACURE651" manufactured by BASF Japan Corporation) 2 parts by weight, 10 parts by weight of malonyl hydrazine (thermosetting agent, "MDH" manufactured by Otsuka Chemical Co., Ltd.), 30 parts by weight of the obtained polysiloxane particles, silicon oxide (filler, "Admafine SO-C2" manufactured by Admatechs Co., Ltd.) 20 parts by weight, 2 parts by weight of 3-glycidoxypropyltrimethoxysilane (silane coupling agent, "KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.), and core-shell acrylate copolymer microparticles (stress relieving agent, "F351" manufactured by ZEON KASEI Co., Ltd.) was blended, stirred with a planetary mixer ("Foaming Stirring Taro" manufactured by Thinky Corporation), and then uniformly mixed with a ceramic three-roller mill to obtain a liquid crystal display element Use sealant. Production of liquid crystal display elements: With respect to 100 parts by weight of each obtained sealant for liquid crystal display elements, spacer particles with an average particle diameter of 5 μm ("Micropearl SP-2050 manufactured by Sekisui Chemical Industry Co., Ltd. ") 1 part by weight was uniformly dispersed, and the obtained sealant containing a spacer was filled into a dispensing syringe ("PSY-10E" manufactured by Musashi Engineering Co., Ltd.) and degassed. Thereafter, a sealant was applied so as to draw a rectangular frame on the transparent electrode substrate with an ITO thin film using a dispenser ("SHOTMASTER 300" manufactured by Musashi Engineering Co., Ltd.). Then, apply by dropping tiny droplets of TN (Twisted Nematic, twisted nematic) liquid crystal ("JC-5001LA" manufactured by Chisso Co., Ltd.) with a liquid crystal dropping device, and use a vacuum bonding device at 5 Pa. Another transparent substrate is bonded under vacuum. After irradiating the bonded liquid crystal cell with 100 mW/cm 2 of ultraviolet rays for 30 seconds using a metal halide lamp, heat at 120°C for 1 hour to heat-cure the sealant to obtain a liquid crystal display element (gap 5 μm). Evaluation method of liquid crystal contamination resistance: With regard to the obtained liquid crystal display element, the display unevenness of the liquid crystal (especially the corner) generated around the sealing part was observed visually. The liquid crystal contamination prevention property was judged by the following reference|standard. [Judgement criteria for liquid crystal contamination resistance] ○○: No display unevenness at all ○: Slight display unevenness occurs △: Significant display unevenness occurs ×: Serious display unevenness occurs (4) Low moisture permeability (at Evaluation of Color Unevenness of Liquid Crystal Display Element Driven After Storage Under High Temperature and High Humidity) The liquid crystal display element obtained in the evaluation of (3) above was prepared. Evaluation method of low moisture permeability: After storing the obtained liquid crystal display element in an environment with a temperature of 80°C and a humidity of 90%RH for 72 hours, it was driven with a voltage of AC 3.5 V, and the periphery of the halftone sealant was visually inspected. Make observations. Low moisture permeability was judged by the following criteria. [Criteria for judging low moisture permeability] ○○: There is no color unevenness around the sealing part ○: A little color unevenness occurs △: Obvious color unevenness occurs ×: Severe color unevenness occurs (5) Chemical resistance Properties 10 parts by weight of the obtained polysiloxane particles were measured into a glass bottle, 100 parts by weight of various solvents were added thereto, and the mixture was shaken in a bath at 30° C. for 24 hours. After 24 hours, the polysiloxane particles were taken out by filtration and freeze-dried for 72 hours. The weight of the sample after drying was measured and the weight loss was evaluated. The results are shown in Table 1 below. [Table 1] Particle size of polysiloxane particles (μm) 30% K value of polysiloxane particles (N/mm 2 ) Anti-liquid crystal contamination low moisture permeability Weight difference after chemical resistance test (g) Example 1 7.9 80 〇〇 〇〇 0 Example 2 7.8 50 〇〇 〇〇 0 Example 3 8.1 120 〇〇 〇〇 0 Example 4 7.8 150 〇〇 〇〇 0 Example 5 10.2 130 〇〇 〇〇 0 Example 6 3.9 80 〇〇 〇〇 0 Example 7 3.4 90 〇〇 〇〇 0 Comparative example 1 7.5 70 〇〇 x 0 Comparative example 2 non-particle Can't comment Can't comment Can't comment 5.9 Comparative example 3 6.3 50 x △ 0

1:液晶顯示元件 2:透明玻璃基板 3:透明電極 4:配向膜 5:液晶 6:密封部 6A:聚矽氧粒子 7:間隔件粒子 51:連接構造體 52:第1連接對象構件 52a:第1電極 53:第2連接對象構件 53a:第2電極 54:連接部 54A:導電性粒子 71:電子零件裝置 72:第1陶瓷構件 73:第2陶瓷構件 74:接合部 74A:聚矽氧粒子 74B:玻璃 75:電子零件 76:引線框架 R:內部空間 1: Liquid crystal display element 2: Transparent glass substrate 3: Transparent electrode 4: Alignment film 5: LCD 6: Sealing part 6A: Polysiloxane particles 7: Spacer Particles 51: Connection Construct 52: The first connection target member 52a: 1st electrode 53: The second connection target member 53a: 2nd electrode 54: Connecting part 54A: Conductive particles 71:Electronic component device 72: The first ceramic component 73: The second ceramic component 74: Joint 74A: polysiloxane particles 74B: glass 75:Electronic parts 76: Lead frame R: inner space

圖1係模式性地表示使用聚矽氧粒子之液晶顯示元件之一例之剖視圖。 圖2係模式性地表示使用導電性粒子之連接構造體之一例之前視剖視圖。 圖3係模式性地表示使用聚矽氧粒子之電子零件裝置之一例之剖視圖。 圖4係將圖3所示之電子零件裝置中之接合部部分放大表示之剖視圖。 Fig. 1 is a cross-sectional view schematically showing an example of a liquid crystal display element using polysiloxane particles. Fig. 2 is a front sectional view schematically showing an example of a connection structure using conductive particles. Fig. 3 is a cross-sectional view schematically showing an example of an electronic component device using polysiloxane particles. FIG. 4 is an enlarged cross-sectional view showing a junction portion in the electronic component device shown in FIG. 3 .

1:液晶顯示元件 1: Liquid crystal display element

2:透明玻璃基板 2: Transparent glass substrate

3:透明電極 3: Transparent electrode

4:配向膜 4: Alignment film

5:液晶 5: LCD

6:密封部 6: Sealing part

6A:聚矽氧粒子 6A: Polysiloxane particles

7:間隔件粒子 7: Spacer Particles

Claims (15)

一種聚矽氧粒子，其係具有0.1 μm以上且500 μm以下之粒徑者，且 上述聚矽氧粒子係具有矽氧烷鍵、自由基聚合性基、及碳數5以上之疏水基之聚矽氧粒子，或藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子，或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子。 A polysiloxane particle having a particle diameter of not less than 0.1 μm and not more than 500 μm, and The above-mentioned polysiloxane particles are polysiloxane particles having a siloxane bond, a free radical polymerizable group, and a hydrophobic group with a carbon number of 5 or more, or by combining a silane compound with a free radical polymerizable group and a silane compound with a carbon number of 5 Polysiloxane particles obtained by reacting a silane compound with a hydrophobic group above to form a siloxane bond, or by reacting a silane compound having a free radical polymerizable group and a hydrophobic group with 5 or more carbon atoms to form a siloxane bond The obtained polysiloxane particles. 如請求項1之聚矽氧粒子，其係具有矽氧烷鍵、於上述矽氧烷鍵之末端之自由基聚合性基、及於上述矽氧烷鍵之側鏈之碳數5以上之疏水基之聚矽氧粒子，或藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子，或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子。The polysiloxane particle according to claim 1, which has a siloxane bond, a free radical polymerizable group at the end of the siloxane bond, and a hydrophobic molecule having 5 or more carbon atoms in the side chain of the siloxane bond. Polysiloxane particles based on the base, or polysiloxane particles obtained by reacting a silane compound having a radically polymerizable group with a silane compound having a hydrophobic group having 5 or more carbon atoms to form a siloxane bond, or by using Polysiloxane particles obtained by reacting silane compounds with radical polymerizable groups and hydrophobic groups with 5 or more carbon atoms to form siloxane bonds. 如請求項2之聚矽氧粒子，其係具有矽氧烷鍵、於上述矽氧烷鍵之末端鍵結於矽原子之自由基聚合性基、及於上述矽氧烷鍵之側鏈鍵結於矽原子之碳數5以上之疏水基的聚矽氧粒子，或藉由使具有鍵結於矽原子之自由基聚合性基之矽烷化合物與具有鍵結於矽原子之碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子，或者藉由使具有鍵結於矽原子之自由基聚合性基且具有鍵結於矽原子之碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子。The polysiloxane particle according to claim 2, which has a siloxane bond, a radical polymerizable group bonded to a silicon atom at the end of the siloxane bond, and a side chain bonded to the siloxane bond Polysiloxane particles with a hydrophobic group with a carbon number of 5 or more on a silicon atom, or a silane compound having a radical polymerizable group bonded to a silicon atom and a hydrophobic group with a carbon number of 5 or more bonded to a silicon atom Polysiloxane particles obtained by reacting a silane compound based on a siloxane bond to form a siloxane bond, or by making a free radical polymerizable group bonded to a silicon atom and a hydrophobic group with a carbon number of 5 or more bonded to a silicon atom Silicone particles obtained by reacting silane compounds to form siloxane bonds. 如請求項1至3中任一項之聚矽氧粒子，其係具有2個甲基鍵結於1個矽原子之二甲基矽氧烷骨架之聚矽氧粒子。The polysiloxane particle according to any one of Claims 1 to 3, which is a polysiloxane particle having a dimethylsiloxane skeleton in which two methyl groups are bonded to one silicon atom. 如請求項1至3中任一項之聚矽氧粒子，其係進行30%壓縮時之壓縮彈性模數為500 N/mm 2以下之聚矽氧粒子。 The polysiloxane particles according to any one of claims 1 to 3, which are polysiloxane particles with a compressive elastic modulus of 500 N/mm 2 or less when subjected to 30% compression. 如請求項1至3中任一項之聚矽氧粒子，其係不含金屬觸媒或者以100 ppm以下包含金屬觸媒之聚矽氧粒子。The polysiloxane particle according to any one of claims 1 to 3, which is a polysiloxane particle that does not contain a metal catalyst or contains a metal catalyst at 100 ppm or less. 如請求項1至3中任一項之聚矽氧粒子，其係包含遮光劑之聚矽氧粒子。The polysiloxane particle according to any one of claims 1 to 3, which is polysiloxane particle containing an opacifying agent. 如請求項1至3中任一項之聚矽氧粒子，其係用於液晶滴落法用密封劑之聚矽氧粒子。The polysiloxane particle according to any one of Claims 1 to 3, which is a polysiloxane particle used in a liquid crystal drop method sealant. 如請求項1至3中任一項之聚矽氧粒子，其係具有矽氧烷鍵、自由基聚合性基、及碳數5以上之疏水基之聚矽氧粒子。The polysiloxane particle according to any one of claims 1 to 3, which is a polysiloxane particle having a siloxane bond, a radically polymerizable group, and a hydrophobic group having 5 or more carbon atoms. 如請求項1至3中任一項之聚矽氧粒子，其係藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子，或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得之聚矽氧粒子。The polysiloxane particle according to any one of claims 1 to 3, which is obtained by reacting a silane compound having a radically polymerizable group with a silane compound having a hydrophobic group having 5 or more carbon atoms to form a siloxane bond polysiloxane particles, or polysiloxane particles obtained by reacting a silane compound having a radically polymerizable group and a hydrophobic group having 5 or more carbon atoms to form a siloxane bond. 如請求項10之聚矽氧粒子，其係藉由利用自由基聚合起始劑使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物進行反應所獲得之聚矽氧粒子，或者藉由利用自由基聚合起始劑使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物進行反應所獲得之聚矽氧粒子。Such as the polysiloxane particle of claim 10, which is obtained by reacting a silane compound having a radical polymerizable group and a silane compound having a hydrophobic group having 5 or more carbon atoms using a radical polymerization initiator. Oxygen particles, or polysiloxane particles obtained by reacting a silane compound having a radical polymerizable group and a hydrophobic group having 5 or more carbon atoms with a radical polymerization initiator. 一種聚矽氧粒子之製造方法，其係如請求項10之聚矽氧粒子之製造方法，且包括如下步驟： 藉由使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得聚矽氧粒子、或者藉由使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物反應形成矽氧烷鍵而獲得聚矽氧粒子。 A method for producing polysiloxane particles, which is the method for producing polysiloxane particles according to claim 10, and includes the following steps: Polysiloxane particles are obtained by reacting a silane compound having a radically polymerizable group with a silane compound having a hydrophobic group having 5 or more carbon atoms to form a siloxane bond, or by making a radically polymerizable group and having a carbon Silane compounds with 5 or more hydrophobic groups react to form siloxane bonds to obtain polysiloxane particles. 如請求項12之聚矽氧粒子之製造方法，其係藉由利用自由基聚合起始劑使具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物進行反應而獲得聚矽氧粒子、或者藉由利用自由基聚合起始劑使具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物進行反應而獲得聚矽氧粒子。The method for producing polysiloxane particles according to claim 12, which is obtained by reacting a silane compound having a radical polymerizable group and a silane compound having a hydrophobic group having 5 or more carbon atoms by using a radical polymerization initiator Polysiloxane particles, or polysiloxane particles obtained by reacting a silane compound having a radical polymerizable group and a hydrophobic group having 5 or more carbon atoms with a radical polymerization initiator. 一種液晶滴落法用密封劑，其包含熱硬化性成分、及 如請求項1至11中任一項之聚矽氧粒子。 A liquid crystal dropping method sealant comprising a thermosetting component, and The polysiloxane particles according to any one of Claims 1 to 11. 一種液晶顯示元件，其包括： 第1液晶顯示元件用構件； 第2液晶顯示元件用構件； 密封部，其於上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件對向之狀態下，將上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件之外周密封；及 液晶，其於上述密封部之內側，配置於上述第1液晶顯示元件用構件與上述第2液晶顯示元件用構件之間； 上述密封部係藉由使液晶滴落法用密封劑熱硬化而形成；且 上述液晶滴落法用密封劑包含熱硬化性成分、及如請求項1至11中任一項之聚矽氧粒子。 A liquid crystal display element comprising: A member for a first liquid crystal display element; A member for a second liquid crystal display element; A sealing portion sealing the outer peripheries of the first liquid crystal display element member and the second liquid crystal display element member in a state where the first liquid crystal display element member and the second liquid crystal display element member face each other; and Liquid crystal disposed inside the sealing portion between the first liquid crystal display element member and the second liquid crystal display element member; The sealing portion is formed by thermosetting a sealant for a liquid crystal dropping method; and The liquid crystal dropping method sealant includes a thermosetting component and polysiloxane particles according to any one of claims 1 to 11.
TW111135747A 2015-05-08 2016-05-06 Silicone particles, method for producing silicone particles, sealing agent for liquid crystal dropping methods, and liquid crystal display element TW202321351A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-095770 2015-05-08
JP2015095770 2015-05-08

Publications (1)

Publication Number Publication Date
TW202321351A true TW202321351A (en) 2023-06-01

Family

ID=57248029

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111135747A TW202321351A (en) 2015-05-08 2016-05-06 Silicone particles, method for producing silicone particles, sealing agent for liquid crystal dropping methods, and liquid crystal display element
TW105114189A TWI776791B (en) 2015-05-08 2016-05-06 Polysiloxane particles, method for producing polysiloxane particles, sealant for liquid crystal dropping method, and liquid crystal display element

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105114189A TWI776791B (en) 2015-05-08 2016-05-06 Polysiloxane particles, method for producing polysiloxane particles, sealant for liquid crystal dropping method, and liquid crystal display element

Country Status (5)

Country Link
JP (2) JP7277069B2 (en)
KR (1) KR102569338B1 (en)
CN (1) CN107250220A (en)
TW (2) TW202321351A (en)
WO (1) WO2016181860A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102542827B1 (en) * 2015-11-11 2023-06-14 세키스이가가쿠 고교가부시키가이샤 Particles, particle materials, connection materials, and connection structures
JP7065576B2 (en) * 2017-08-29 2022-05-12 積水化学工業株式会社 Fine particles and connecting materials and connecting structures containing the fine particles
JP7209609B2 (en) * 2018-10-23 2023-01-20 株式会社トクヤマ Liquid crystal spacer made of spherical polymethylsilsesoxane
WO2023090456A1 (en) * 2021-11-22 2023-05-25 積水化学工業株式会社 Adhesive particles and laminate
TW202335853A (en) * 2021-11-22 2023-09-16 日商積水化學工業股份有限公司 Adhesive particles and laminate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09328624A (en) * 1996-06-10 1997-12-22 Nippon Shokubai Co Ltd Colored particle, its production and use
JP4031575B2 (en) * 1997-08-07 2008-01-09 宇部日東化成株式会社 Method for producing polyorganosiloxane fine particles
JP3720965B2 (en) * 1997-10-30 2005-11-30 積水化学工業株式会社 Method for producing particulate organopolysiloxane
JP4163316B2 (en) 1999-01-14 2008-10-08 株式会社日本触媒 Organic-inorganic composite particles, method for producing the same, and use thereof
TW556020B (en) * 1999-04-21 2003-10-01 Nippon Catalytic Chem Ind Spacer for liquid crystal displays, production process therefor, and liquid crystal display
JP2004262981A (en) * 2003-02-27 2004-09-24 Ube Nitto Kasei Co Ltd Preparation process for polyorganosiloxane particle and preparation process for silica particle
JP4825481B2 (en) * 2005-09-28 2011-11-30 積水化成品工業株式会社 Silica composite polymer particles and production method thereof
JP5388091B2 (en) 2007-11-16 2014-01-15 日本化薬株式会社 Liquid crystal sealant and liquid crystal display cell using the same
JP5563232B2 (en) 2009-03-27 2014-07-30 株式会社日本触媒 Core-shell type organic-inorganic composite particle production method, core-shell type organic-inorganic composite particle, and conductive fine particle
JP5704740B2 (en) * 2009-10-23 2015-04-22 株式会社日本触媒 Method for producing organic-inorganic composite particles
CN103087319B (en) * 2013-01-16 2017-01-18 长兴化学材料(珠海)有限公司 Copolymerization type silsesquioxane microsphere as well as preparation method and application thereof
WO2015002067A1 (en) * 2013-07-03 2015-01-08 積水化学工業株式会社 Sealant for liquid crystal dropping method, vertical-conduction material, liquid crystal display element, and light-shielding flexible silicone particles
JP6235297B2 (en) * 2013-10-16 2017-11-22 日本化薬株式会社 Liquid crystal sealant and liquid crystal display cell using the same

Also Published As

Publication number Publication date
JP7277069B2 (en) 2023-05-18
WO2016181860A1 (en) 2016-11-17
KR102569338B1 (en) 2023-08-22
TWI776791B (en) 2022-09-11
JP2023081959A (en) 2023-06-13
TW201702290A (en) 2017-01-16
KR20180004700A (en) 2018-01-12
JPWO2016181860A1 (en) 2018-02-22
CN107250220A (en) 2017-10-13

Similar Documents

Publication Publication Date Title
JP2023081959A (en) Silicone particle, method of manufacturing silicone particle, sealant for liquid crystal dripping technique, and liquid crystal display element
KR102414978B1 (en) Silicone particles, sealing agent for liquid crystal dropping methods, and liquid crystal display element
KR101593381B1 (en) Sealing agent for one drop fill process, vertically conducting material, and liquid crystal display element
KR101777900B1 (en) Sealant for one-drop fill process, vertical-conduction material, and liquid crystal display element
KR102341454B1 (en) Sealant for liquid crystal dropping method, vertical-conduction material, liquid crystal display element, and light-shielding flexible silicone particles
KR20190008172A (en) A sealing agent for a liquid crystal display element, an upper and lower conductive material, and a liquid crystal display element
KR20180067461A (en) Sealant for liquid crystal display elements, vertical conduction material, and liquid crystal display element
TW201702321A (en) Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element
KR20160137944A (en) Sealing agent for liquid crystal dropping methods, vertically conducting material and liquid crystal display element
JP2017227826A (en) Sealant particle, sealant and liquid crystal display device
KR102531223B1 (en) Sealant for liquid crystal display elements, vertical conduction material, and liquid crystal display element
TWI716440B (en) Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element
TWI826652B (en) Curable resin compositions, sealants for liquid crystal display elements, vertical conductive materials, and liquid crystal display elements
KR20190055015A (en) A sealing agent for a liquid crystal display element, an upper and lower conductive material, and a liquid crystal display element
KR20180103681A (en) Light-shielding sealing agent for liquid crystal display element, vertical conducting material, and liquid crystal display element
JP7127990B2 (en) Liquid crystal display element sealant, vertical conduction material, and liquid crystal display element
JP2016218257A (en) Curable resin particle used for sealant for one-drop-fill process of liquid crystal, sealant for one-drop-fill process of liquid crystal and liquid crystal display element
TWI747862B (en) Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element
TWI770092B (en) Liquid crystal display element sealing compound, vertical conduction material, and liquid crystal display element
TW202115222A (en) Curable resin composition, sealing agent for liquid crystal display element, vertically conductive material, and liquid crystal display element
KR20220058488A (en) Sealing agent for liquid crystal display elements, vertical conduction material, and liquid crystal display element
TW202104517A (en) Curable resin composition, sealing agent for liquid crystal display element, vertical conductive material, and liquid crystal display element