TW202321318A - Photosensitive resin composition, photosensitive resin layer using the same, and color filter - Google Patents

Abstract

Provided are a photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter including the same, the photosensitive resin composition including (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the binder resin essentially includes specific structural units.

Description

Photosensitive resin composition, photosensitive resin layer using photosensitive resin composition, and color filter

This application claims priority and benefit to Korean Patent Application No. 10-2021-0158819 filed with the Korean Intellectual Property Office on November 17, 2021, the entire contents of which are incorporated herein by reference.

The present disclosure relates to a photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter.

Among many types of displays, liquid crystal display devices have advantages in brightness, thinness, low cost, low operating power consumption, and improved adhesion to integrated circuits, and have been more widely used in laptops, monitors and TV screens. The liquid crystal display device includes: a lower substrate on which a black matrix, a color filter, and an ITO graphic element electrode are formed; and an upper substrate on which an active layer including a liquid crystal layer, a thin film transistor, and a capacitor layer is formed. Circuit part and ITO picture element electrode.

In the primitive area, each primitive is formed by sequentially stacking a plurality of color filters (generally, formed of three primary colors such as red (R), green (G) and blue (B)) in a predetermined order. A color filter is formed, and a black matrix layer is arranged in a predetermined pattern on a transparent substrate to form a boundary between picture elements. The pigment dispersion method as a method of forming a color filter provides a color thin film by repeating a series of processes , such as applying a photopolymerizable composition containing a colorant on a transparent substrate containing a black matrix, exposing the formed pattern to light, removing the unexposed part with a solvent, and allowing it to be thermally cured. Used to produce color according to the pigment dispersion method The color photosensitive resin composition of an optical filter usually contains an alkali-soluble resin, a photopolymerizable monomer, a photopolymerization initiator, an epoxy resin, a solvent, other additives, etc. The pigment dispersion method is effectively applied to produce LCDs, such as mobile phones , laptop, monitor and TV.

Recently, in order to overcome the limitations of brightness and contrast caused by the fineness of pigments, studies have been conducted on mixed photosensitive resin compositions in which dyes which do not form particles with pigments have been used. However, the mixed photosensitive resin color filter composition has a high moisture absorption rate compared with the pigment type composition, and thus has a problem of deterioration in yield due to liquid crystal bubble defects that occur during the LCD manufacturing process.

On the other hand, in order to reduce the moisture absorption rate of the color filter composition, a method of increasing the curing density during exposure and baking has generally been used. For example, a method of increasing crosslink density by using a multifunctional monomer or increasing the content of an initiator or a thermosetting agent has been used to manufacture color filters. However, current methods have limitations in significantly reducing the moisture absorption rate emission of color filter compositions.

One embodiment provides a photosensitive resin composition having low moisture absorption rate and excellent processability.

Another embodiment provides a photosensitive resin layer produced using a photosensitive resin composition.

Another embodiment provides a color filter manufactured using a photosensitive resin layer.

An embodiment of the present invention provides a photosensitive resin composition comprising: (A) binder resin; (B) photopolymerizable compound; (C) photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the binder resin comprises a first structural unit derived from a monomer represented by Chemical Formula 1, a second structural unit derived from a monomer represented by Chemical Formula 2, and a compound derived from a monomer represented by Chemical Formula 3 The third structural unit derived from the monomer:

[chemical formula 1]

In Chemical Formula 1, R is ^C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl;

[chemical formula 2]

In Chemical Formula 2, R is ^C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; and R is ^C11 to C20 substituted or unsubstituted alkyl or C11 to C20 substituted or unsubstituted alkenyl;

[chemical formula 3]

In Chemical Formula 3, R is ^C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; R is ^C1 to C10 alkyl or C1 to C10 alkenyl; and R ⁵ is substituted with 1 to 3 fluorines.

R ¹ may be CH ₂ =CH-* or CH ₂ =C(CH ₃ )-*.

The monomer represented by Chemical Formula 1 may be included in an amount of 10% by weight to 25% by weight in the total amount of monomers constituting the binder resin.

Herein ^R2 can be C2 to C5 substituted or unsubstituted alkenyl; and ^R3 can be C11 to C18 substituted or unsubstituted alkyl.

The monomer represented by Chemical Formula 2 may be included in an amount of 10% by weight to 50% by weight in the total amount of monomers constituting the binder resin.

Herein, R ⁴ may be C2 to C5 substituted or unsubstituted alkenyl; and R ⁵ may be C1 to C5 alkyl; and R ⁵ may be substituted by 1 to 3 fluorines.

The monomer represented by Chemical Formula 3 may be included in an amount of 3% by weight to 40% by weight in the total amount of monomers constituting the binder resin.

The binder resin may further include a fourth structural unit derived from a monomer represented by Chemical Formula 4, a fifth structural unit derived from a monomer represented by Chemical Formula 5, or a combination thereof:

[chemical formula 4]

In Chemical Formula 4, R ^is hydrogen or C1 to C10 alkyl; and L is a single bond or C1 to C10 alkylene;

[chemical formula 5]

In Chemical Formula 5, R ⁷ is hydrogen, C1 to C10 alkyl or C6 to C10 aryl.

In the total amount of monomers constituting the binder resin, the fourth structural unit may be included in an amount of 0.01% by weight to 40% by weight, and the fifth structural unit may be included in an amount of 0.01% by weight to 15% by weight.

The weight average molecular weight of the binder resin may be 5000 g/mol to 30000 g/mol.

The colorant may include phthalocyanine-based pigments, xanthene-based dyes, or combinations thereof.

Based on the total solid content of the photosensitive resin composition, the photosensitive resin composition may include: 1% by weight to 60% by weight of (A) binder resin; 10% by weight to 50% by weight of (B) colorant; 1% by weight to 60% by weight of (C) a photopolymerizable compound; 0.1% by weight to 15% by weight of (D) a photopolymerization initiator; and the balance of (E) a solvent.

The photosensitive resin composition may further comprise at least one additive selected from the following: malonic acid; 3-amino-1,2-propanediol; a coupling agent containing vinyl or (meth)acryloxy; leveling agent; fluorosurfactant; and free radical polymerization initiator.

Another embodiment provides a photosensitive resin layer manufactured using a photosensitive resin composition.

Another embodiment provides a color filter including a photosensitive resin layer.

Another embodiment provides a display device including a color filter.

Other embodiments of the invention are included in the following detailed description.

Compared with photosensitive resin compositions including different binder resins, the photosensitive resin composition according to the embodiment may have a lower Moisture absorption and excellent processability.

Hereinafter, embodiments of the present invention are described in detail. However, these embodiments are exemplary, the present invention is not limited thereto and the present invention is defined by the scope of the claims.

In this specification, when no specific definition is otherwise provided, "substituted" means that at least one hydrogen of the compound is replaced by the following substituents: halogen atom (F, Cl, Br or I), hydroxyl, C1 to C20 alkane Oxygen, nitro, cyano, amino, imino, azido, amidino, hydrazino, hydrazino, carbonyl, carbamoyl, thiol, ester, ether, carboxyl or their salts, Sulfonic acid or its salt, phosphoric acid or its salt, C1 to C20 alkyl, C2 to C20 alkenyl, C2 to C20 alkynyl, C6 to C30 aryl, C3 to C20 cycloalkyl, C3 to C20 cycloalkenyl, C3 to C20 cycloalkynyl, C2 to C20 heterocycloalkyl, C2 to C20 heterocycloalkenyl, C2 to C20 heterocycloalkynyl, or combinations thereof.

In this specification, when no specific definition is provided otherwise, "heterocycloalkyl", "heterocycloalkenyl", "heterocycloalkynyl" and "heterocycloalkylene" refer to Cycloalkyl, cycloalkenyl, cycloalkynyl and cycloalkylene cyclic compounds with at least one heteroatom in P.

In this specification, "(meth)acrylate" means "acrylate" and "methacrylate" when no specific definition is otherwise provided.

In this specification, when a specific definition is not otherwise provided, the term "combination" means mixing or copolymerization. In addition, "copolymerization" means block copolymerization to random copolymerization, and "copolymer" means block copolymer to random copolymerization.

In the chemical formulas in this specification, when a chemical bond is not drawn at a position that should be given when a specific definition is not otherwise provided, the hydrogen bond is at the position.

In addition, in the present specification, when no specific definition is otherwise provided, "*" indicates a point of bonding the same or different atoms or chemical formulas.

The embodiment provides a photosensitive resin composition: including (A) binder resin; (B) photopolymerizable compound; (C) photopolymerization initiator; (D) colorant; and (E) solvent, wherein The mixture resin comprises a first structural unit derived from a monomer represented by Chemical Formula 1, a second structural unit derived from a monomer represented by Chemical Formula 2, and a third structural unit derived from a monomer represented by Chemical Formula 3:

[chemical formula 1]

In Chemical Formula 1, R is ^C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl;

[chemical formula 2]

In Chemical Formula 2, R is ^C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; and R is ^C11 to C20 substituted or unsubstituted alkyl or C11 to C20 substituted or unsubstituted alkenyl; and

[chemical formula 3]

In Chemical Formula 3, R is ^C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; R is ^C1 to C10 alkyl or C1 to C10 alkenyl; and R ⁵ is substituted with 1 to 3 fluorines.

The binder resin may be an acrylic composite binder resin in which the first structural unit is derived from a monomer having an acid value (monomer represented by Chemical Formula 1), and the second structural unit is derived from a high molecular weight (methyl ) alkyl acrylate monomer (monomer represented by Chemical Formula 2), and the third structural unit is derived from a fluorine-based monomer (monomer represented by Chemical Formula 3) having extremely high hydrophobicity.

Specifically, the second structural unit and the third structural unit reduce the moisture absorption rate of the photosensitive resin composition due to a higher carbon number and high hydrophobicity, respectively, and the first structural unit ensures excellent development processability.

Therefore, compared with photosensitive resin compositions including different binder resins, the photosensitive resin compositions according to the examples simultaneously have Low moisture absorption and excellent processability.

Hereinafter, each component is described in detail.

(A) Binder resin

As mentioned above, the photosensitive resin composition according to the embodiment is an acrylic composite adhesive resin, and includes an adhesive resin substantially including the first to third structural units.

The first structural unit is derived from a monomer having a lower molecular weight and acid value than the second structural unit, and having an 'acid value' means having a 'carboxyl group'.

Specifically, the first structural unit is derived from a monomer containing a carboxyl group and a C1 to C10 substituted or unsubstituted alkyl group or a C2 to C10 substituted or unsubstituted alkenyl group. More specifically, R ¹ can be a C2 to C5 substituted or unsubstituted alkenyl. For example, R ¹ is CH ₂ =CH-* or CH ₂ =C(CH ₃ )-*, and the monomer represented by Chemical Formula 1 may be acrylate or methacrylate.

The monomer represented by Chemical Formula 1 may have a weight average molecular weight of 5,000 g/mol to 30,000 g/mol. In addition, the binder prepared including the monomer represented by Chemical Formula 1 has an acid value of 30 mg potassium hydroxide/g to 220 mg potassium hydroxide/g, and exhibits excellent development processability by reacting with alkaline developer sex.

The monomer represented by Chemical Formula 1 may be included in an amount of 10% by weight to 25% by weight in the total amount of monomers constituting the binder resin. Specifically, in the total amount of monomers constituting the binder resin, the monomer represented by Chemical Formula 1 may be greater than or equal to 10% by weight, greater than or equal to 11% by weight, or greater than or equal to 12% by weight and less than or equal to 25% by weight, less than or equal to 20% by weight, or less than or equal to 18% by weight. When this range is satisfied, the photosensitive resin composition can ensure excellent processability.

The second structural unit is derived from an ester monomer having a higher molecular weight than the first structural unit.

Specifically, the second structural unit is derived from an esterified compound: an acid comprising a C1 to C10 substituted or unsubstituted alkyl or a C2 to C10 substituted or unsubstituted alkenyl; and an acid comprising a C11 to C20 substituted Or unsubstituted alkyl or C11 to C20 substituted or unsubstituted alkenyl alcohol. More specifically, R ² is C2 to C5 substituted or unsubstituted alkenyl; and R ³ may be C11 to C15 substituted or unsubstituted alkyl. For example, when R ² is CH ₂ =CH-* or CH ₂ =C(CH ₃ )-*, and R ³ is C12 unsubstituted alkyl, the monomer represented by Chemical Formula 2 may be lauryl acrylate or lauryl methacrylate.

Since the monomer represented by Chemical Formula 2 has a molecular weight of 120 g/mol to 400 g/mol and has hydrophobicity, affinity of the binder to water may be reduced. Therefore, the binder prepared including the monomer represented by Chemical Formula 2 may allow the photosensitive resin composition to have a lower moisture absorption rate.

The monomer represented by Chemical Formula 2 may be included in an amount of 10% by weight to 50% by weight in the total amount of monomers constituting the binder resin. Specifically, in the total amount of monomers constituting the binder resin, it may be greater than or equal to 10% by weight, greater than or equal to 15% by weight, or greater than or equal to 20% by weight and less than or equal to 50% by weight, less than or equal to The monomer represented by Chemical Formula 2 is included in an amount of 49% by weight or less than or equal to 48% by weight. When this range is satisfied, the photosensitive resin composition may have a lower moisture absorption rate.

The third structural unit is derived from a fluorine-based monomer having a lower molecular weight and extremely high hydrophobicity than the second structural unit.

Specifically, the third structural unit is derived from an esterified compound: an acid comprising a C1 to C10 substituted or unsubstituted alkyl group or a C2 to C10 substituted or unsubstituted alkenyl group; and via 1 to 3 fluorine Alcohols that are substituted and contain C1 to C10 alkyl or C1 to C10 alkenyl groups. More specifically, ^R4 can be C2 to C5 substituted or unsubstituted alkenyl; and ^R5 can be C1 to C5 alkyl; and ^R5 can be substituted with 1 to 3 fluorines. For example, when R ⁴ is CH ₂ =CH-* or CH ₂ =C(CH ₃ )-*, and R ⁵ is C2 unsubstituted alkyl, the monomer represented by Chemical Formula 3 is trifluoroethylene acrylate or trifluoroethyl methacrylate.

The monomer represented by Chemical Formula 3 may be included in an amount of 3% by weight to 40% by weight in the total amount of monomers constituting the binder resin. Specifically, in the total amount of monomers constituting the binder resin, it may be greater than or equal to 3% by weight, greater than or equal to 4% by weight, or greater than or equal to 5% by weight and less than or equal to 40% by weight, less than or equal to The monomer represented by Chemical Formula 3 is included in an amount of 30% by weight or less than or equal to 15% by weight. When this range is satisfied, the photosensitive resin composition may have a lower moisture absorption rate.

Meanwhile, the binder resin may further include a fourth structural unit derived from a monomer represented by Chemical Formula 4, a fifth structural unit derived from a monomer represented by Chemical Formula 5, or a combination thereof:

[chemical formula 4]

In Chemical Formula 4, R ⁶ is hydrogen or C1 to C10 alkyl; and L is a single bond or C1 to C10 alkylene. Specifically, ^R6 can be hydrogen or methyl, and L can be a single bond. For example, the monomer represented by Chemical Formula 4 may be tricyclodecanyl methacrylate (TCDMA) represented by Chemical Formula 4-1.

[chemical formula 4-1]

[chemical formula 5]

In Chemical Formula 5, R ⁷ is hydrogen, C1 to C10 alkyl or C6 to C10 aryl. For example, when R ⁷ is phenyl, the monomer represented by Chemical Formula 5 may be phenylmaleimide represented by Chemical Formula 5-1.

[chemical formula 5-1]

The monomer represented by Chemical Formula 4 has an effect of increasing close contact force due to its ring structure, and the monomer represented by Chemical Formula 5 has an effect of enhancing heat resistance due to its imide structure. Therefore, the photosensitive resin composition further including the fourth structural unit derived from the monomer represented by Chemical Formula 4, the fifth structural unit derived from the monomer represented by Chemical Formula 5, or a combination thereof may exhibit excellent processability.

In the total amount of monomers constituting the binder resin, the fourth structural unit may be included in an amount of 0.01% by weight to 40% by weight, and the fifth structural unit may be included in an amount of 0.01% by weight to 15% by weight. Specifically, in the total amount of monomers constituting the binder resin, it may be greater than or equal to 0.01% by weight, greater than or equal to 1% by weight, or greater than or equal to 3% by weight and less than or equal to 40% by weight, less than or equal to The monomer represented by Chemical Formula 4 is included in an amount of 30% by weight or less than or equal to 15% by weight. When this range is satisfied, the photosensitive resin composition may have a lower moisture absorption rate.

The weight average molecular weight of the binder resin may be 5000 g/mol to 30000 g/mol. When the weight-average molecular weight of the binder resin is within the above range, the photosensitive resin composition has excellent physical and chemical properties, has an appropriate viscosity, and has excellent close-contact properties to a substrate when manufacturing a color filter.

The binder resin may further contain acrylic resin.

The acrylic resin may be a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may be a resin including at least one acrylic repeating unit.

The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group. Examples of monomers include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or combinations thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight, based on the total amount of the acrylic binder resin.

The second ethylenically unsaturated monomer can be an aromatic vinyl compound, such as styrene, α-methylstyrene, vinyl toluene, vinyl benzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound, such as (methyl ) methyl acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxy butyl (meth) acrylate, benzyl (meth) acrylate ester, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, etc.; unsaturated carboxylic acid aminoalkyl ester compounds, such as 2-aminoethyl (meth)acrylate, 2-dimethacrylate Methyl amino ethyl ester, etc.; vinyl carboxylic acid ester compounds, such as vinyl acetate, vinyl benzoate, etc.; glycidyl unsaturated carboxylic acid ester compounds, such as glycidyl (meth)acrylate, etc.; vinyl cyanide compounds, such as ( Meth)acrylonitrile and the like; unsaturated amide compounds such as (meth)acrylamide and the like; and the like. These may be used alone or as a mixture of two or more.

Specific examples of the acrylic resin may be (meth)acrylic acid/benzyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene copolymer, (meth)acrylic acid/methacrylate Benzyl acrylate/2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymer, etc., but not limited thereto. These may be used alone or as a mixture of two or more.

The binder resin may further include an epoxy-based binder resin.

Binder Resin Heat resistance may be improved by further including an epoxy-based binder resin. The epoxy-based adhesive resin may comprise, for example, phenol novolac epoxy resin, tetramethylbiphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, cycloaliphatic epoxy resin, or combinations thereof, But not limited to this.

Furthermore, the binder resin including the epoxy-based binder resin ensures dispersion stability of a colorant such as a pigment as will be described later, and at the same time contributes to the formation of a picture element with a desired resolution during a developing process.

The epoxy-based binder resin may be included in an amount of 1% by weight to 10% by weight, for example, 5% by weight to 10% by weight, based on the total amount of the binder resin. When the epoxy-based binder resin is included in the above range, the film residue rate and chemical resistance can be greatly improved.

The epoxy equivalent of the epoxy-based binder resin may be 150 g/equivalent to 200 g/equivalent. When the epoxy-based binder resin having an epoxy equivalent within the above range is included in the binder resin, the binder may improve the degree of curing of the pattern and promote the adhesion of the colorant in the pattern-forming structure.

The binder resin is in the form of solid content, and can be dissolved in a solvent to be described later to constitute a photosensitive resin composition. In this case, the binder resin in a solid state may be about 10% by weight to 50% by weight, for example, 20% by weight to 40% by weight, based on the total amount of the binder resin solution dissolved in the solvent.

The binder resin may be included in an amount of 1% to 60% by weight, for example, 3% to 10% by weight, based on the total solid content of the photosensitive resin composition. When the binder resin is present within the above range, developability and crosslinking are improved to provide excellent surface smoothness during manufacture of a color filter.

(B) Photopolymerizable compound

The photopolymerizable compound may be a monofunctional or polyfunctional ester of (meth)acrylic acid containing at least one ethylenically unsaturated double bond.

Due to the ethylenically unsaturated double bond, the photopolymerizable compound can cause sufficient polymerization during exposure during pattern formation and form a pattern having excellent heat resistance, light resistance, and chemical resistance.

Specific examples of photopolymerizable compounds may be ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate Acrylates, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di( Meth)acrylate, Pentaerythritol Di(meth)acrylate, Pentaerythritol Tri(meth)acrylate, Pentaerythritol Tetra(meth)acrylate, Pentaerythritol Hexa(meth)acrylate, Dipentaerythritol Di(meth)acrylate Dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy (meth)acrylate, ethylene glycol monomethacrylate Ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tri(meth)acryloxyethyl phosphate, novolac epoxy (meth)acrylate, etc.

Commercially available examples of the photopolymerizable compound may be as follows. Monofunctional (meth)acrylates may include Aronix M-101®, M-111®, M-114® (Toagosei Chemistry Industry Co., Ltd.); KAYARAD TC-110S®, TC-120S® (Nippon Kayaku Co., Ltd.); V-158®, V-2311® (Osaka Organic Chemical Ind., Ltd.), etc. Examples of difunctional (meth)acrylates may include Aronix M-210®, M-240®, M-6200® (Toagosei Chemical Industry Co., Ltd.); KAYARAD HDDA®, HX-220®, R-604® ( Nippon Kayaku Co., Ltd.); V-260®, V-312®, V-335 HP® (Osaka Organic Chemical Industry Co., Ltd.), etc. Examples of trifunctional (meth)acrylates may include Aronix M-309®, M-400®, M-405®, M-450®, M-7100®, M-8030®, M-8060® (Toya Synthetic Chemical Industry Co., Ltd.); KAYARAD TMPTA®, DPCA-20®, DPCA-30®, DPCA-60®, DPCA-120® (Nippon Kayaku Co., Ltd.); V-295®, V-300®, V-360 ®, V-GPT®, V-3PA®, V-400® (Osaka Yuki Kayaku Kogyo Co. Ltd.), etc. These can be used alone or as a mixture of two or more use.

The photopolymerizable compound may be treated with an anhydride to improve developability.

The photopolymerizable compound may be included in an amount of 1% to 60% by weight, for example, 0.1% to 5% by weight, based on the total amount of the photosensitive resin composition. When the photopolymerizable compound is contained within the range, the photopolymerizable compound is sufficiently cured and has excellent reliability during exposure during pattern formation, and developability of an alkaline developer may be improved.

(C) Photopolymerization initiator

The photopolymerization initiator can be a photopolymerization initiator commonly used in photosensitive resin compositions, such as acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, triazine compounds, Oxime compounds or combinations thereof.

Examples of acetophenones can be 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyl Trichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4- (Methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc. .

Examples of benzophenone compounds may be benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4, 4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichloro Benzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

Examples of thioxanthone compounds may be thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone , 2-chlorothioxanthone, etc.

Examples of benzoin-based compounds may be benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

Examples of triazine compounds can be 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'- Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)- s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)- s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphthol-yl )-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthol-yl)-4,6-bis(trichloromethyl)-s-triazine, 2- 4-bis(trichloromethyl)-6-helianthyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine and the like.

Examples of oxime compounds can be O-acyl oxime compounds, 2-(O-benzoyl oxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1- (O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-oxazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxygen Amino-1-phenylpropan-1-one, etc. Specific examples of O-acyl oximes may be 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-benzene base)-butan-1-one, 1-(4-phenylthiophenyl)-butane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylthiophenyl Base)-octane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylthiophenyl)-octane-1-one oxime-O-acetate, 1- (4-Phenylthiophenyl)-butan-1-one oxime-O-acetate, etc.

In addition to the above compounds, the photopolymerization initiator may further include oxazole-based compounds, diketone-based compounds, boronic acid-based compounds, diazo-based compounds, imidazole-based compounds, biimidazole-based compounds, fluorene-based compounds, and the like.

The photopolymerization initiator can be used together with a photosensitizer capable of causing a chemical reaction by absorbing light and becoming excited and then transferring its energy.

Examples of the photosensitizer may be tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, dipentaerythritol tetra-3-mercaptopropionate, and the like.

The photopolymerization initiator may be included in an amount of 0.1 wt % to 15 wt %, for example, 0.1 wt % to 3 wt %, based on the total solid content of the photosensitive resin composition. When the photopolymerization initiator is contained within the range, excellent reliability can be ensured due to sufficient curing during exposure during pattern formation, and the pattern can have excellent resolution and close contact properties as well as excellent heat resistance properties, light resistance, and chemical resistance, and prevents deterioration of transmittance due to non-reactive initiators.

(D) colorant

The colorant may include phthalocyanine-based pigments, xanthene-based dyes, or combinations thereof.

Phthalocyanine pigments cover the light blue to green region, and are known as materials with excellent color strength and chemical stability. Phthalocyanine pigments are phthalocyanine blue pigments, and can be used alone or in combination of two or more substances having the same color index (color index; C.I.) number (for example, C.I Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6) of each pigment.

Xanthene-based dyes are materials that exhibit fluorescence of yellow to pink, blue, and bright hues, and for example, compounds represented by the following chemical formulas can be used.

When the colorant includes a phthalocyanine-based pigment and a xanthene-based dye, a dispersant may be used together to form a composition. Specifically, the pigment may be pretreated with a dispersant or added to the surface to prepare a composition.

The dispersant may be a nonionic dispersant, anionic dispersant, cationic dispersant, or the like. Specific examples of dispersants may be polyalkylene glycols and their esters, polyoxyalkylenes, polyol ester alkylene oxide addition products, alcohol alkylene oxide addition products, sulfonates, sulfonates, carboxylates, Carboxylate, alkylamide alkylene oxide addition product, alkylamine, etc., and these may be used alone or as a mixture of two or more.

Commercially available examples of the dispersant may include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK- 164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc.; EFKA-47, EFKA-47EA, manufactured by EFKA Chemicals Co. EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc.; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000 manufactured by Zeneka Co. Solsperse24000GR, Solsperse 27000, Solsperse 28000, etc.; or PB711, PB821 manufactured by Ajinomoto Inc.

The dispersant may be included in an amount of 0.1% by weight to 15% by weight based on the total amount of the photosensitive resin composition. When the dispersant is contained within the range, the composition has excellent stability, developability, and patternability due to improved dispersion properties during manufacture of the color filter.

Pigments can be pretreated with water soluble inorganic salts and wetting agents. When the pigment is pretreated, the average particle size of the pigment can become finer.

Pretreatment may be performed by kneading the pigment with a water-soluble inorganic salt and a wetting agent, and then filtering and washing the kneaded pigment.

The kneading may be performed at a temperature of 40°C to 100°C, and filtration and washing may be performed by filtering the pigment after washing away the inorganic salt with water or the like.

Examples of water-soluble inorganic salts may be sodium chloride, potassium chloride, etc., but are not limited thereto. The wetting agent can uniformly mix and pulverize the pigment and the water-soluble inorganic salt. Examples of wetting agents include: alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc.; and alcohols such as ethanol, isopropanol, butanol, Hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerol polyethylene glycol, etc., and these may be used alone or as a mixture of two or more.

The average particle size of the pigment after kneading may range from 5 nm to 200 nm, for example, from 5 nm to 150 nm. When the average particle diameter of the pigment is within the range, the stability of the pigment dispersion liquid may be improved and the picture element resolution may not be deteriorated.

The solvent used to form the pigment dispersion can be ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, and the like.

Specifically, the pigment may be used in the form of a pigment dispersion liquid containing a dispersant and a solvent which will be described later, and the pigment dispersion liquid may contain a solid pigment, a dispersant, and a solvent. The solid pigment may be contained in an amount of 5% to 20% by weight, for example, 8% to 15% by weight, based on the total amount of the pigment dispersion.

Based on the total amount of the photosensitive resin composition, the colorant may be included in an amount of 10% to 50% by weight, for example, 20% to 50% by weight. When the colorant is contained within the range, dyeing effect and developability are improved.

(E) Solvent

The solvent is a material that has compatibility with, but does not react with, the colorant, binder resin, photopolymerizable compound, and photopolymerization initiator.

Examples of the solvent may include: alcohols such as methanol, ethanol, etc.; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether, Ethylene glycol monoethyl ether, etc.; ethyl glycol acetate, such as methyl glycol acetate, ethyl glycol acetate, diethyl glycol acetate, etc.; carbitol, such as methyl ethyl carbitol Must alcohol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, etc. ; Propylene glycol alkyl ether acetate, such as propylene glycol methyl ether acetate, propylene glycol propyl ether acetate, etc.; Aromatic hydrocarbons, such as toluene, xylene, etc.; Ketones, such as methyl ethyl ketone, cyclohexanone, 4- Hydroxy-4-methyl-2-pentanone, methyl n-acetone, methyl n-butanone, methyl n-pentanone, 2-heptanone, etc.; saturated aliphatic monocarboxyalkyl esters, such as ethyl acetate, acetic acid N-butyl ester, isobutyl acetate, etc.; Lactate esters, such as methyl lactate, ethyl lactate, etc.; Alkyl oxyacetate, such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc. ;Alkyl alkoxyacetate, such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; 3-oxyl Alkyl propionate, such as methyl 3-oxypropionate, ethyl 3-oxypropionate, etc.; alkyl 3-alkoxypropionate, such as methyl 3-methoxypropionate, 3- Ethyl methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; alkyl 2-oxypropionate, such as methyl 2-oxypropionate, 2 -Ethyl oxypropionate, propyl 2-oxypropionate, etc.; alkyl 2-alkoxypropionate, such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, Ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate, etc.; 2-oxy-2-methylpropionate, such as methyl 2-oxy-2-methylpropionate, 2 - ethyl oxy-2-methylpropionate, etc.; alkyl monooxymonocarboxylates of 2-alkoxy-2-methylalkylpropionates, such as 2-methoxy-2-methoxy Methyl propionate, ethyl 2-ethoxy-2-methylpropionate, etc.; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate , 2-hydroxy-3-methyl butyrate, etc.; keto esters, such as ethyl pyruvate, etc. In addition, high-boiling solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformaniline, N-methylacetamide, N,N-di Methylacetamide, N-Methylpyrrolidone, Dimethylsulfoxide, Benzyl Ether, Dihexyl Ether, Acetyl Acetone, Isophorone, Caproic Acid, Caprylic Acid, 1-Octanol, 1-Nonanol, Benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, gamma-butyrolactone, ethylene carbonate, propylene carbonate, phenylglycol ethyl acetate, etc.

In consideration of miscibility and reactivity, ketones such as cyclohexanone, etc.; glycol ethers, such as ethylene glycol monoethyl ether, etc.; glycol alkyl ether acetates, such as ethyl glycol ethyl acetate are ideally used etc.; esters, such as 2-hydroxyethyl propionate, etc.; carbitol, such as diethylene glycol monomethyl ether, etc.; propylene glycol alkyl ether acetates, such as propylene glycol methyl ether acetate, propylene glycol propyl ether acetate wait.

Based on the total amount of the photosensitive resin composition, the solvent may be contained in a balance, for example, 30% to 70% by weight, such as 35% to 65% by weight. When the solvent is contained within the above range, coating properties of the photosensitive resin composition are improved and a coating film having excellent flatness can be obtained.

(F) Other additives

The photosensitive resin composition may further comprise at least one additive selected from the following: malonic acid; 3-amino-1; 2-propanediol; a coupling agent containing vinyl or (meth)acryloxy; a leveling agent ; a surfactant; and a radical polymerization initiator in order to prevent stains or spots during coating, to adjust leveling or to prevent pattern residue due to non-development.

Additives can be controlled depending on the desired properties.

The coupling agent may be a silane-based coupling agent, and examples of the silane-based coupling agent may include trimethoxysilylbenzoic acid, γ-methacrylpropoxytrimethoxysilane, vinyltriacetyloxy Silane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-epoxycyclohexylethyltrimethoxysilane, etc. These may be used alone or in admixture of two or more.

Specifically, based on 100 parts by weight of the photosensitive resin composition, the silane coupling agent can be used in an amount of 0.01 to 1 part by weight.

In addition, the photosensitive resin composition for a color filter may further contain a surfactant, such as a fluorine-based surfactant, if necessary.

Examples of the fluorine-based surfactant may include, but are not limited to, F-482, F-484, F-478 and the like manufactured by DIC Co., Ltd.

The surfactant is desirably included in an amount of 0.01% by weight to 5% by weight, and more desirably 0.01% by weight to 2% by weight, based on the total amount of the photosensitive resin composition. When the amount exceeds the above range, foreign substances may be generated after development, which is not undesirable.

In addition, the photosensitive resin composition may contain predetermined amounts of other additives such as antioxidants, stabilizers, etc. unless the additives degrade the properties of the photosensitive resin composition.

According to another embodiment, there is provided a photosensitive resin layer manufactured using the photosensitive resin composition according to the embodiment.

According to another embodiment, the aforementioned photosensitive resin composition is used to manufacture a color filter.

A method of manufacturing a color filter is as follows.

The above-mentioned photosensitive resin composition is coated by an appropriate method such as spin coating, roll coating, spray coating, etc. to form a photosensitive resin composition layer with a thickness of 0.5 μm to 10 μm on the glass substrate.

Subsequently, the substrate having the photosensitive resin composition layer is irradiated with light to form a desired pattern for the color filter. As a light source for irradiation, UV, electron beams, or X-rays may be used, and, for example, UV may be irradiated in a region of 190 nm to 450 nm, specifically, 200 nm to 400 nm. During the irradiation process, a photoresist mask can further be used. After performing the irradiation process in this way, the photosensitive resin composition layer irradiated with the light source is treated with a developing solution. At this time, the unexposed portion of the photosensitive resin composition layer is dissolved to form a pattern necessary for the color filter. By repeating this process for a large number of desired colors, a color filter with a desired pattern can be obtained. In addition, when the image pattern obtained by development in the above process is cured by heating again or by radiation with actinic rays, crack resistance and solvent resistance may be improved.

According to another embodiment, there is provided a display device including the aforementioned color filter. The display device may be, for example, a liquid crystal display (LCD).

Hereinafter, the present invention is shown in more detail with reference to examples, however, these examples are not construed as limiting the scope of the present invention in any sense.

(synthetic binder resin)

Synthetic Example 1 to Synthetic Example 7 and Comparative Synthetic Example 1 to Comparative Synthetic Example 4

3.5 parts by weight of AIBN as an initiator (based on 100 parts by weight of the total amount of monomers used for polymerization excluding AIBN) was placed in a 100 ml beaker at the ratios shown in Table 1 and Table 2 below The monomers for polymerization were sequentially added thereto (based on 100% by weight of the total amount of monomers), and then stirred for 30 minutes. Subsequently, to continue the polymerization reaction, 70 g of PGMEA was placed in a 250 ml glass reactor equipped with a cooler, and then heated to 85° C., and the prepared monomer solution was added dropwise to the reactor for 3 hours . After the reaction was further performed at the same temperature for 6 hours, the temperature was lowered to room temperature to complete the reaction, which was performed under a nitrogen atmosphere.

(Table 1) monomer type Comparative Synthesis Example 1 Comparative Synthesis Example 2 Comparative Synthesis Example 3 Comparative Synthesis Example 4 unit Methacrylate 15 15 15 15 weight% lauryl methacrylate 0 45 25 25 weight% Trifluoroethyl methacrylate 30 0 2 41 weight% Tricyclodecanyl Methacrylate (TCDMA) 40 25 43 4 weight% Phenylmaleimide 15 15 15 15 weight% AIBN 3.5 3.5 3.5 3.5 parts by weight Molecular weight (Mw) 11500 11500 11500 11500 g/mol

(Table 2) monomer type Synthetic Example 1 Synthetic example 2 Synthetic Example 3 Synthetic Example 4 Synthetic Example 5 Synthetic Example 6 Synthetic Example 7 unit Methacrylate 15 15 15 15 15 15 15 weight% lauryl methacrylate 25 25 25 35 45 37 20 weight% Trifluoroethyl methacrylate 10 20 30 20 20 3 40 weight% Tricyclodecanyl Methacrylate (TCDMA) 35 25 15 15 5 30 10 weight% Phenylmaleimide 15 15 15 15 15 15 15 weight% AIBN 3.5 3.5 3.5 3.5 3.5 3.5 3.5 parts by weight Molecular weight (Mw) 12000 11500 12500 12000 12000 12000 12000 g/mol

(Preparation of photosensitive resin composition)

Example 1 to Example 7 and Comparative Example 1 to Comparative Example 4

Each photosensitive resin composition according to Example 1 to Example 7 and Comparative Example 1 to Comparative Example 4 was prepared by mixing the following components in each composition shown in Table 3 and Table 4 below.

Specifically, a photopolymerization initiator is dissolved in a solvent, and then stirred at room temperature, and a binder resin and a photopolymerizable compound are added thereto, and then stirred at room temperature. Subsequently, dye and pigment dispersion liquids as colorants were added to the obtained reactant, and then stirred at room temperature. Next, the product was filtered three times to remove impurities to prepare a photosensitive resin composition.

(table 3)

(unit weight%) components Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 (A) Binder resin A-1 3.8 3.8 3.8 3.8 A-2 0.5 0.5 0.5 0.5 A-3 4.1 - - - A-4 4.1 - - A-5 - 4.1 - A-6 - - - 4.1 A-7 - - - - A-8 - - - - A-9 - - - - A-10 - - - A-11 - - - A-12 - - - - A-13 - - - - (B) Photopolymerizable compound B-1 4.0 4.0 4.0 4.0 B-2 0.4 0.4 0.4 0.4 (C) Photopolymerization initiator C-1 0.3 0.3 0.3 0.3 C-2 0.2 0.2 0.2 0.2 (D) colorant D-1 25.5 25.5 25.5 25.5 D-2 2.8 2.8 2.8 2.8 (E) Solvent E-1 58.4 58.4 58.4 58.4 (F) Additives F-1 0.0 0.0 0.0 0.0 total 100 100 100 100

(Table 4)

(unit weight%) components Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 (A) Binder resin A-1 3.8 3.8 3.8 3.8 3.8 3.8 3.8 A-2 0.5 0.5 0.5 0.5 0.5 0.5 0.5 A-3 - - - - - - - A-4 - - - - - - - A-5 - - - - - - - A-6 - - - - - - - A-7 4.1 - - - - - - A-8 - 4.1 - - - - - A-9 - - 4.1 - - - - A-10 - - - 4.1 - - - A-11 - - - - 4.1 - - A-12 - - - - - 4.1 - A-13 - - - - - - 4.1 (B) Photopolymerizable compound B-1 4.0 4.0 4.0 4.0 4.0 4.0 4.0 B-2 0.4 0.4 0.4 0.4 0.4 0.4 0.4 (C) Photopolymerization initiator C-1 0.3 0.3 0.3 0.3 0.3 0.3 0.3 C-2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 (D) colorant D-1 25.5 25.5 25.5 25.5 25.5 25.5 25.5 D-2 2.8 2.8 2.8 2.8 2.8 2.8 2.8 (E) Solvent E-1 58.4 58.4 58.4 58.4 58.4 58.4 58.4 (F) Additives F-1 0.0 0.0 0.0 0.0 0.0 0.0 0.0 total 100 100 100 100 100 100 100

(A) Binder resin

(A-1) Acrylic binder resin (product name: NPR ⁵ 216, manufacturer: Miwon)

(A-2) Epoxy-based adhesive resin (product name: EHPE3150, manufacturer: Daicel Corporation (Dicel))

(A-3) Acrylic Composite Binder Resin (Comparative Synthesis Example 1)

(A-4) Acrylic composite binder resin (comparative synthesis example 2)

(A-5) Acrylic composite binder resin (comparative synthesis example 3)

(A-6) Acrylic Composite Binder Resin (Comparative Synthesis Example 4)

(A-7) Acrylic composite binder resin (Synthesis Example 1)

(A-8) Acrylic composite binder resin (Synthesis Example 2)

(A-9) Acrylic composite binder resin (Synthesis Example 3)

(A-10) Acrylic composite binder resin (Synthesis Example 4)

(A-11) Acrylic composite binder resin (Synthesis Example 5)

(A-12) Acrylic composite binder resin (synthesis example 6)

(A-13) Acrylic composite binder resin (Synthesis Example 7)

(B) Photopolymerizable compound

(B-1) Photopolymerizable monomer (substance name: polydipentaerythritol hexaacrylate (DPHA), manufacturer: Nippon Kayaku Co., Ltd.)

(B-2) Developability-imparting photopolymerizable monomer (product name: V1000, manufacturer: Gongyeong)

(C) Photopolymerization initiator

(C-1) SPI-03 (Manufacturer: Samyang Corporation)

(C-2) PBG-305 (manufacturer: Tronly)

(D) colorant

(D-1) Phthalocyanine pigment dispersion (product name: B15:6, manufacturer: Sanyo)

(D-2) Mixed dispersion of phthalocyanine pigment and xanthene dye represented by the following formula (weight ratio of B15:6 to xanthene dye = 70:30, manufacturer: Iridos) )

(E) Solvent

(E-1) Propylene glycol monomethyl ether acetate (PGMEA, manufacturer: Sigma-Aldrich)

(F) Additives

(F-1) Fluorinated surfactant (F-554, manufacturer: Dainippon Ink & Chemicals Co., Ltd. (DIC))

(evaluate)

Evaluation 1: Moisture Absorption, Resolution, and PTN Tear Properties

The photosensitive resin compositions according to Examples 1 to 7 and Comparative Examples 1 to 4 were measured with respect to moisture absorption, resolution, and PTN tearing properties, respectively, and the results are shown in Tables 5 and 6.

Herein, each method of measuring the moisture absorption rate, the resolution, and the tear property of the PTN is provided as follows.

1) Moisture absorption rate: each photosensitive resin composition is spin-coated on glass to a thickness of 2.6 microns, heated on a 90°C heating plate for 90 seconds, exposed at 50 mJ by using a UV exposure device, and placed in an oven at 230°C Heat for 20 minutes to make an entire surface sample. The front sample was immersed in distilled water for 120 minutes, and then measured by TGA analysis (TA instrument (room temperature → 150°C (10°C/min) → hold for 20 minutes)) relative to weight loss rate (%).

2) Resolution: Each photosensitive resin composition is spin-coated on glass to a thickness of 2.6 microns, heated on a heating plate at 90°C for 90 seconds, exposed at 50 millijoules by using a UV exposure device, and passed under a pressure of 1.0 kgf The developer (SVS-2000) was developed in a KOH developer solution for 60 seconds, and washed with water for 60 seconds, and then measured relative to the remaining minimum horizontal stripe pattern size.

3) Pattern tearing characteristics: Each photosensitive resin composition was spin-coated on glass to a thickness of 2.6 microns, heated on a 90°C heating plate for 90 seconds, exposed at 50 mJ by using a UV exposure device, and exposed at 2.0 kgf It was developed under pressure by using a developer (SVS-2000) in a KOH developer solution for 120 seconds, and washed with water for 60 seconds, and then measured with respect to the number of edge tears of the horizontal stripe pattern in the same area.

(table 5) Evaluation Project Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Moisture absorption rate (%) 1 1.8 2 0.3 Resolution (microns) 50 20 10 40 PTN tear (unit(ea)) 95 3 15 30

(Table 6) Evaluation Project Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Moisture absorption rate (%) 1.3 1.1 0.9 1.0 0.8 1.8 0.5 Resolution (microns) 20 20 20 20 10 10 10 PTN tear (pieces) 14 25 32 15 2 5 35

Referring to Table 5 and Table 6, the photosensitive resin composition according to one example has a lower moisture absorption rate than the photosensitive resin compositions according to Comparative Example 1 to Comparative Example 4, but relatively excellent resolution and excellent machinability.

In addition, comparing the photosensitive resin compositions of Examples 1 to 7, it can be seen that properties such as moisture absorption rate, resolution, processability, etc. can be controlled by appropriately adjusting the mixing ratio of the components.

While the invention has been described in connection with what are presently considered to be practical example embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover the scope of the invention included within the spirit and scope of the appended claims. Various modifications and equivalent arrangements of .

none.

none.

none.

Claims (16)

A photosensitive resin composition comprising: (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the binder The mixture resin comprises a first structural unit derived from a monomer represented by Chemical Formula 1, a second structural unit derived from a monomer represented by Chemical Formula 2, and a third structural unit derived from a monomer represented by Chemical Formula 3: [ Chemical formula 1]

Wherein, in Chemical Formula 1, R ¹ is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; [Chemical Formula 2]

Wherein, in Chemical Formula 2, R ² is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; and R ³ is C11 to C20 substituted or unsubstituted Alkyl or C11 to C20 substituted or unsubstituted alkenyl; [chemical formula 3]

Wherein, in Chemical Formula 3, R is ^C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; and R is ^C1 to C10 alkyl or C1 to C10 alkenyl and R ⁵ is substituted by 1 to 3 fluorines. The photosensitive resin composition as claimed in claim 1, wherein R ¹ is C2 to C5 substituted or unsubstituted alkenyl. The photosensitive resin composition as described in Claim 1, wherein The monomer represented by Chemical Formula 1 is included in an amount of 10% by weight to 25% by weight in the total amount of monomers constituting the binder resin. The photosensitive resin composition as claimed in claim 1, wherein R ² is C2 to C5 substituted or unsubstituted alkenyl; and R ³ is C11 to C18 substituted or unsubstituted alkyl. The photosensitive resin composition as described in Claim 1, wherein The monomer represented by Chemical Formula 2 is included in an amount of 10% by weight to 50% by weight in the total amount of monomers constituting the binder resin. The photosensitive resin composition as claimed in claim 1, wherein R ⁴ is C2 to C5 substituted or unsubstituted alkenyl; and R ⁵ is C1 to C5 alkyl; and R ⁵ is substituted by 1 to 3 fluorine . The photosensitive resin composition as described in Claim 1, wherein The monomer represented by Chemical Formula 3 is included in an amount of 3% by weight to 40% by weight in the total amount of monomers constituting the binder resin. The photosensitive resin composition according to claim 1, wherein the binder resin further comprises a fourth structural unit derived from a monomer represented by Chemical Formula 4, a fifth structure derived from a monomer represented by Chemical Formula 5 A unit or combination thereof: [Chemical formula 4]

Wherein, in Chemical Formula 4, R ⁶ is hydrogen or C1 to C10 alkyl; and L is a single bond or C1 to C10 alkylene; [Chemical Formula 5]

Wherein, in Chemical Formula 5, R ⁷ is hydrogen, C1 to C10 alkyl or C6 to C10 aryl. The photosensitive resin composition as described in Claim 8, wherein In the total amount of monomers constituting the binder resin, the fourth structural unit is included in an amount of 0.01% by weight to 40% by weight, and the fourth structural unit is included in an amount of 0.01% by weight to 15% by weight. fifth structural unit. The photosensitive resin composition as described in Claim 1, wherein The weight average molecular weight of the binder resin is 5000 g/mol to 30000 g/mol. The photosensitive resin composition as described in Claim 1, wherein The colorant includes phthalocyanine pigments, xanthene dyes or combinations thereof. The photosensitive resin composition as described in Claim 1, wherein According to the total solid content of the photosensitive resin composition, the photosensitive resin composition comprises: 1% by weight to 60% by weight of the (A) binder resin; 10% to 50% by weight of said (B) colorant; 1% to 60% by weight of said (C) photopolymerizable compound; 1% by weight to 15% by weight of the (D) photopolymerization initiator; and The remainder of the (E) solvent. The photosensitive resin composition as described in Claim 1, wherein The photosensitive resin composition further comprises at least one additive selected from the following: malonic acid; 3-amino-1,2-propanediol; a coupling agent containing vinyl or (meth)acryloxy; leveling agents; fluorosurfactants; and free radical polymerization initiators. A photosensitive resin layer manufactured using the photosensitive resin composition described in any one of Claims 1 to 13. A color filter comprising the photosensitive resin layer as claimed in claim 14. A display device comprising the color filter as claimed in claim 15.