TW202319739A - Inspection method and inspection system of electron beam inspection image - Google Patents

Abstract

An inspection method of an electron beam inspection image including the following steps is provided. The electron beam inspection machine is used to scan a wafer to be tested to collect run time images. An electronic device is used to score image quality of each of the run time images to obtain a quality score of each of the run time images. The electronic device is used to compare each of the run time images with a standard image to obtain a matching score of each of the run time images. The electronic device is used to automatically determine whether the run time image is available according to the quality score and the matching score of the run time image.

Description

Detection method and detection system for electron beam detection image

Embodiments of the present invention relate to an image detection method and a detection system, and in particular to an electron beam detection image detection method and detection system.

In defect detection technology of semiconductor elements, a method of detecting defects using electron beams has been developed. However, in the current electron beam inspection (EBI) method, there are still many steps that need to manually determine whether the image is usable, which increases the process time and reduces the throughput.

The invention provides a detection method and a detection system for an electron beam detection image, which can shorten the process time and further increase the production capacity.

The invention proposes a detection method for electron beam detection image, which includes the following steps. The wafer under test is scanned using an electron beam inspection tool to collect multiple run time images. The image quality of each runtime image is scored electronically to obtain a quality score for each runtime image. Each run-time image is electronically compared to a standard image (golden image) to obtain a match score for each run-time image. The electronic device is used to automatically determine whether the runtime image is available according to the quality score and the matching score of the runtime image.

According to an embodiment of the present invention, in the above inspection method of electron beam inspection images, the method of using the electron beam inspection machine to collect a plurality of run-time images may include collecting at a plurality of predetermined positions on the wafer to be inspected .

According to an embodiment of the present invention, in the detection method of the electron beam detection image, the image quality is, for example, focus quality, contrast quality, brightness quality or a combination thereof.

According to an embodiment of the present invention, in the above-mentioned electron beam detection image detection method, the method of using an electronic device to automatically determine whether the runtime image is available may include checking whether the quality score of the runtime image meets the requirements, and checking whether the runtime image is available. Whether the matching score of the image meets the requirements.

According to an embodiment of the present invention, the above-mentioned electron beam detection image detection method may further include the following steps. Import standard images to electronic devices.

The invention proposes a detection system for electron beam detection image, which includes an electron beam detection machine and an electronic device. The electron beam inspection tool is used to scan the wafer under test to collect multiple run-time images. The electronic device is coupled to the electron beam inspection machine and at least performs the following operations. Score the image quality of each runtime image to obtain a quality score for each runtime image. Each runtime image is compared to a standard image to obtain a match score for each runtime image. Automatically determine whether a runtime image is available or not based on the quality score and matching score of the runtime image.

According to an embodiment of the present invention, in the detection system for detecting images with electron beams, the number of electronic devices may be one.

According to an embodiment of the present invention, in the detection system for detecting images with electron beams, the number of electronic devices may be multiple.

According to an embodiment of the present invention, in the inspection system for the above-mentioned electron beam inspection image, the electronic device can be integrated in the electron beam inspection machine.

According to an embodiment of the present invention, in the above inspection system for electron beam inspection image, the electronic device can be located outside the electron beam inspection machine.

Based on the above, in the detection method and detection system of the electron beam detection image proposed by the present invention, the electron beam detection machine is used to collect a plurality of running time images, and the quality score and matching score of each running time image are obtained by the electronic device , and the electronic device is used to automatically determine whether the runtime image is available according to the quality score and the matching score of the runtime image. Therefore, it is possible to reduce the steps of manually determining whether the image is available, thereby reducing the processing time and increasing the throughput.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

FIG. 1 is a schematic diagram of an electron beam detection image detection system according to an embodiment of the present invention.

Referring to FIG. 1 , an inspection system 10 for electron beam inspection image includes an electron beam inspection machine 100 and an electronic device 102 . The electron beam inspection machine 100 is used for scanning the wafer to be tested to collect a plurality of run time images. In this embodiment, the method of collecting multiple run-time images by the electron beam inspection tool 100 may include collecting multiple predetermined positions on the wafer to be tested.

The electronic device 102 can include a memory 104 and a processor 106 . The memory 104 can be used to store a standard image (golden image) and a run-time image for access by the processor 106, thereby realizing the related means and the detection method of the electron beam detection image described in various embodiments of the present invention. The processor 106 is coupled to the memory 104 . In this embodiment, the processor 106 may be a graphics processing unit (graphics processing unit, GPU), an image processor (image signal processor, ISP), a central processing unit (central processing unit, CPU) or other programmable General purpose or special purpose microprocessor (microprocessor), digital signal processor (digital signal processor, DSP), programmable controller, application specific integrated circuits (application specific integrated circuits, ASIC), programmable logic device (programmable logic device, PLD), other similar processors, or a combination of these processor circuits.

The electronic device 102 is coupled to the electron beam inspection machine 100 and at least performs the following operations. For example, the processor 106 of the electronic device 102 can be used to perform the following operations. The electronic device 102 scores the image quality of each runtime image to obtain a quality score for each runtime image, where the image quality is, for example, focus quality, contrast quality, brightness quality or a combination thereof. The electronic device 102 compares each runtime image with the standard image to obtain a matching score for each runtime image. The electronic device 102 automatically determines whether the runtime image is available according to the quality score and the matching score of the runtime image. In addition, the method for the electronic device 102 to automatically determine whether the runtime image is available may include the following steps. The electronic device 102 detects whether the quality score of the runtime image meets a requirement, and detects whether the matching score of the runtime image meets a requirement.

In addition, the number of electronic devices 102 may be one or more. In addition, the electronic device 102 can be integrated in the electron beam inspection machine 100 or located outside the electron beam inspection machine 100 . In some embodiments, the number of electronic devices 102 may be multiple, and some of the electronic devices 102 may be integrated in the electron beam inspection machine 100 , and some of the electronic devices 102 may be located outside the electron beam inspection machine 100 . In some embodiments, the number of the electronic device 102 may be one, and the electronic device 102 may be integrated in the electron beam inspection machine 100 . In some embodiments, the number of the electronic device 102 may be one, and the electronic device 102 may be located outside the electron beam inspection machine 100 .

FIG. 2 is a flowchart of an electron beam detection image detection method according to an embodiment of the present invention. FIG. 3A is a schematic diagram of quality scores of multiple run-time images at multiple predetermined locations on the wafer under test according to an embodiment of the present invention. FIG. 3B is a schematic diagram of matching scores of multiple run-time images at multiple predetermined locations on the wafer under test according to an embodiment of the present invention. FIG. 4A is a schematic diagram of a standard image according to an embodiment of the invention. FIG. 4B is a schematic diagram of a runtime image according to an embodiment of the invention.

Referring to FIG. 1 and FIG. 2 , step S100 can be performed to import the standard image into the electronic device 102 . For example, the standard image can be stored in the memory 104 of the electronic device 102 .

Next, proceed to step S102 , using the electron beam inspection machine 100 to scan the wafer to be tested to collect a plurality of runtime images. In addition, collecting multiple run-time images using the electron beam inspection tool 100 may include collecting multiple predetermined locations on the wafer to be tested.

Then, proceed to step S104 , using the electronic device 102 to score the image quality of each runtime image to obtain a quality score of each runtime image. The image quality is, for example, focus quality, contrast quality, brightness quality or a combination thereof. For example, the quality score of the runtime image can be rated from 0 to 10 according to the image quality of the runtime image, and the higher the quality score, the better the image quality of the runtime image, but the invention is not limited thereto. . Please refer to FIG. 3A . FIG. 3A shows quality scores of runtime images of multiple predetermined locations on the wafer W to be tested. In some embodiments, the quality score may be a composite score of focus quality, contrast quality and brightness quality. In some embodiments, the quality scores may be individual scores for focus quality, contrast quality, or brightness quality.

In addition, step S106 is performed, using the electronic device 102 to compare each runtime image with the standard image to obtain a matching score for each runtime image. For example, the matching score of the runtime image can be rated from 0 to 10 according to the degree of matching between the runtime image and the standard image, and a higher matching score indicates a higher degree of matching between the runtime image and the standard image, but the present invention It is not limited to this. For example, the running time image 300 of FIG. 4B is very different from the standard image 200 of FIG. 4A , that is, the matching degree between the running time image 300 of FIG. 4B and the standard image 200 of FIG. Image 300 has a matching score of 0. Please refer to FIG. 3B . FIG. 3B shows matching scores of run-time images at multiple predetermined locations on the wafer W to be tested.

In some embodiments, step S104 may be performed first, and then step S106 may be performed. In some embodiments, step S106 may be performed first, and then step S104 may be performed. In some embodiments, step S104 and step S106 can be performed simultaneously. In this embodiment, step S100 is performed before step S102 is performed, but the present invention is not limited thereto. As long as step S100 is performed before step S106 is performed, it falls within the scope of the present invention.

Next, proceed to step S108 , using the electronic device 102 to automatically determine whether the runtime image is available according to the quality score and the matching score of the runtime image. The method of using the electronic device 102 to automatically determine whether the runtime image is available may include checking whether the quality score of the runtime image meets a requirement, and checking whether the matching score of the runtime image meets a requirement. If both the quality score and the matching score of the runtime image are above the required passing score, the runtime image is determined to be an available image. If the quality score and the matching score of the runtime image do not both reach the required passing score, the runtime image is determined to be an unusable image. In addition, the passing score of the quality score and the passing score of the matching score may be set separately. That is, the qualifying score for the Quality Score and the qualifying score for the Matching Score may be the same or different.

For example, please refer to FIG. 3A and FIG. 3B , under the condition that both the qualified score of the quality score and the qualified score of the matching score are set to 6 points, the operation collected on the predetermined positions P1-P3 of the wafer W to be tested The temporal image is an unusable image (i.e., at least one of the quality score of FIG. 3A and the matching score of FIG. 3B does not reach 6 points), and the run-time images collected on the remaining predetermined positions of the wafer W to be tested are Available images (ie, the quality score of Figure 3A and the matching score of Figure 3B are both above 6 points).

Based on the above embodiments, it can be seen that in the electron beam inspection image inspection method and the electron beam inspection image inspection system 10, the electron beam inspection machine 100 is used to collect a plurality of runtime images, and each runtime image is obtained by the electronic device 102. The quality score and the matching score of the runtime image are automatically determined by the electronic device 102 according to the quality score and the matching score of the runtime image. Therefore, it is possible to reduce the steps of manually determining whether the image is available, thereby reducing the processing time and increasing the throughput. In addition, if an unusable run-time image is found, it may indicate a possible hardware problem (e.g., electron gun degradation, wafer stage offset, or a combination thereof) and/or software problem (e.g., e.g. , programming problems, parameter setting problems, or combinations thereof, etc.). In this way, users can identify problems early and solve them as soon as possible.

To sum up, since the detection method and detection system of the electron beam detection image in the above embodiments can reduce the steps of manually determining whether the image is available, the process time can be reduced, and the production capacity can be increased.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

10: Detection system for electron beam detection image 100:Electron beam inspection machine 102:Electronic device 104: memory 106: Processor 200: standard image 300: runtime image S100, S102, S104, S106, S108: steps W: Wafer to be tested P1~P3: predetermined position

FIG. 1 is a schematic diagram of an electron beam detection image detection system according to an embodiment of the present invention. FIG. 2 is a flowchart of an electron beam detection image detection method according to an embodiment of the present invention. FIG. 3A is a schematic diagram of quality scores of multiple run-time images at multiple predetermined locations on the wafer under test according to an embodiment of the present invention. FIG. 3B is a schematic diagram of matching scores of multiple run-time images at multiple predetermined locations on the wafer under test according to an embodiment of the present invention. FIG. 4A is a schematic diagram of a standard image according to an embodiment of the invention. FIG. 4B is a schematic diagram of a runtime image according to an embodiment of the invention.

S100, S102, S104, S106, S108: steps

Claims (10)

A detection method for an electron beam detection image, comprising: Scan the wafer under test using an electron beam inspection tool to collect multiple run-time images; scoring the image quality of each of the runtime images using an electronic device to obtain a quality score for each of the runtime images; comparing each of said run-time images to a standard image using said electronic device to obtain a match score for each of said run-time images; and Using the electronic device to automatically determine whether the runtime image is available according to the quality score and the matching score of the runtime image. The detection method of the electron beam inspection image according to claim 1, wherein the method of using the electron beam inspection machine to collect a plurality of the runtime images includes collecting at a plurality of predetermined positions on the wafer to be inspected . The inspection method for electron beam inspection image according to claim 1, wherein the image quality includes focus quality, contrast quality, brightness quality or a combination thereof. The detection method of electron beam detection image according to claim 1, wherein the method of using an electronic device to automatically determine whether the runtime image is available includes: checking whether the quality score of the runtime image meets a requirement; and Checking whether the matching score of the runtime image meets a requirement. The detection method of the electron beam detection image as described in claim 1, further comprising: Importing the standard image into the electronic device. A detection system for electron beam detection image, comprising: An electron beam inspection tool to scan the wafer under test to collect multiple run-time images; and An electronic device, coupled to the electron beam inspection machine, at least performs the following operations: scoring the image quality of each of the runtime images to obtain a quality score for each of the runtime images; comparing each of said run-time images to a standard image to obtain a match score for each of said run-time images; and Whether the runtime image is available is automatically determined according to the quality score and the matching score of the runtime image. The detection system for electron beam detection image as claimed in claim 6, wherein the number of said electronic device is one. The detection system for electron beam detection image as claimed in claim 6, wherein the number of said electronic devices is multiple. The inspection system for electron beam inspection image according to claim 6, wherein the electronic device is integrated in the electron beam inspection machine. The inspection system for electron beam inspection image according to claim 6, wherein the electronic device is located outside the electron beam inspection machine.

Images