TW202318276A - 用於通過近紅外光譜學和機器學習技術在製造過程中進行端點檢測之設備和方法,及相關電腦可讀取媒體 - Google Patents

用於通過近紅外光譜學和機器學習技術在製造過程中進行端點檢測之設備和方法,及相關電腦可讀取媒體 Download PDF

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TW202318276A
TW202318276A TW111150433A TW111150433A TW202318276A TW 202318276 A TW202318276 A TW 202318276A TW 111150433 A TW111150433 A TW 111150433A TW 111150433 A TW111150433 A TW 111150433A TW 202318276 A TW202318276 A TW 202318276A
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manufacturing process
time
classification model
steady state
spectral data
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TW111150433A
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章民 熊
鵬 鄒
孫嵐
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美商菲爾薇解析公司
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition
    • G06F18/20Analysing
    • G06F18/24Classification techniques
    • G06F18/241Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2411Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on the proximity to a decision surface, e.g. support vector machines
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00Computing arrangements using knowledge-based models
    • G06N5/04Inference or reasoning models
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • G06N20/10Machine learning using kernel methods, e.g. support vector machines [SVM]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/359Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using near infrared light
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition
    • G06F18/20Analysing
    • G06F18/21Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/214Generating training patterns; Bootstrap methods, e.g. bagging or boosting
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • G06N20/20Ensemble learning

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  • General Engineering & Computer Science (AREA)
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  • Computing Systems (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
  • Bioinformatics & Cheminformatics (AREA)
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  • Bioinformatics & Computational Biology (AREA)
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  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computational Linguistics (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • General Factory Administration (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
TW111150433A 2017-05-04 2018-04-17 用於通過近紅外光譜學和機器學習技術在製造過程中進行端點檢測之設備和方法,及相關電腦可讀取媒體 TW202318276A (zh)

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US15/586,678 2017-05-04
US15/586,678 US10984334B2 (en) 2017-05-04 2017-05-04 Endpoint detection in manufacturing process by near infrared spectroscopy and machine learning techniques

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TW111150433A TW202318276A (zh) 2017-05-04 2018-04-17 用於通過近紅外光譜學和機器學習技術在製造過程中進行端點檢測之設備和方法,及相關電腦可讀取媒體
TW107113053A TWI744518B (zh) 2017-05-04 2018-04-17 用於通過近紅外光譜學和機器學習技術在製造過程中進行端點檢測之設備和方法,及相關電腦可讀取媒體
TW110136910A TWI825490B (zh) 2017-05-04 2018-04-17 用於通過近紅外光譜學和機器學習技術在製造過程中進行端點檢測之設備和方法,及相關電腦可讀取媒體

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TW110136910A TWI825490B (zh) 2017-05-04 2018-04-17 用於通過近紅外光譜學和機器學習技術在製造過程中進行端點檢測之設備和方法,及相關電腦可讀取媒體

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EP (2) EP4553722A1 (enExample)
JP (2) JP6968745B2 (enExample)
KR (2) KR102305566B1 (enExample)
CN (2) CN108805168B (enExample)
CA (1) CA3002340A1 (enExample)
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TWI825490B (zh) 2023-12-11
CN108805168A (zh) 2018-11-13
HK1257430A1 (zh) 2019-10-18
TW201843600A (zh) 2018-12-16
KR20210118029A (ko) 2021-09-29
EP3399472A1 (en) 2018-11-07
EP4553722A1 (en) 2025-05-14
KR102576834B1 (ko) 2023-09-08
US10984334B2 (en) 2021-04-20
CN108805168B (zh) 2023-10-13
TW202203098A (zh) 2022-01-16
JP7237124B2 (ja) 2023-03-10
HK1257428A1 (en) 2019-10-18
KR102305566B1 (ko) 2021-10-07
JP2018189638A (ja) 2018-11-29
CN117290780A (zh) 2023-12-26
EP3399472C0 (en) 2024-07-17
JP2022017405A (ja) 2022-01-25
US20180322399A1 (en) 2018-11-08
KR20180122955A (ko) 2018-11-14
CA3002340A1 (en) 2018-11-04
JP6968745B2 (ja) 2021-11-17
US20210224672A1 (en) 2021-07-22
TWI744518B (zh) 2021-11-01
EP3399472B1 (en) 2024-07-17

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