TW202316100A - Detection device for plasma processing equipment and plasma processing equipment - Google Patents
Detection device for plasma processing equipment and plasma processing equipment Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/3288—Maintenance
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32889—Connection or combination with other apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Abstract
Description
本發明涉及一種用於等離子體處理設備的檢測裝置,以及等離子體處理設備、運行方法、運算方法。The invention relates to a detection device for plasma processing equipment, as well as plasma processing equipment, an operation method, and an operation method.
製造半導體元件的步驟一般包括:光刻、蝕刻、灰化、離子注入、薄膜沉積等製程。現有的半導體元件製造製程中,可以利用等離子體在晶圓表面蝕刻形成圖案。The steps of manufacturing semiconductor elements generally include: photolithography, etching, ashing, ion implantation, thin film deposition and other processes. In the existing manufacturing process of semiconductor elements, plasma can be used to etch and form patterns on the surface of the wafer.
等離子體處理設備,例如蝕刻設備,一般會在基座的四周設置聚焦環、邊緣環等環體,用於調節等離子體在基座四周的濃度,從而保證了在蝕刻製程過程中,基座四周的蝕刻均一性。但是隨著蝕刻製程次數的累加,蝕刻氣體不僅會在製程過程中蝕刻晶圓表面,同時對於聚焦環、邊緣環等環體的上表面同樣會產生蝕刻,這樣會導致這些環體的厚度逐漸減小從而被消耗,環體厚度減小後會導致蝕刻製程在晶圓邊緣位置的劣化,邊緣位置蝕刻均一性變差,這時就需要重新更換新的聚焦環來保證邊緣位置的製程品質。Plasma processing equipment, such as etching equipment, generally sets focus rings, edge rings and other rings around the base to adjust the concentration of plasma around the base, thus ensuring that the surrounding area of the base is stable during the etching process. etching uniformity. However, as the number of etching processes increases, the etching gas will not only etch the surface of the wafer during the process, but also etch the upper surfaces of the focus ring, edge ring and other rings, which will cause the thickness of these rings to gradually decrease. If the thickness of the ring is reduced, the etching process will deteriorate at the edge of the wafer, and the etching uniformity at the edge will deteriorate. At this time, it is necessary to replace the focus ring with a new one to ensure the process quality at the edge.
但是如何檢測這些被消耗的環體的消耗情況一直是該領域的痛點。現有的檢測方法有以下缺點:一、通過測量消耗環的高度差的方式來判斷消耗環的被腐蝕情況,這種方式需要測量高度差,因此需要一個基準值,但是製程過程中,消耗環等位置會發生微小位移,因此基準值會發生改變,這樣測出的高度差會有很大誤差,且需要一系列演算法。二、將感測器設置在腔體內,這樣會給腔體內部帶來污染影響製程品質。三、將感測器設置在外部,並在腔體對應感測器位置設置測量視窗,但是隨著蝕刻次數的增加,測量視窗容易附著污染物,從而降低感測器的測量精度。But how to detect the consumption of these consumed ring bodies has always been a pain point in this field. The existing detection methods have the following disadvantages: 1. The corrosion of the consumable ring is judged by measuring the height difference of the consumable ring. This method needs to measure the height difference, so a reference value is required. The position will be slightly displaced, so the reference value will change, so the measured height difference will have a large error, and a series of algorithms are required. 2. The sensor is arranged in the cavity, which will bring pollution to the inside of the cavity and affect the process quality. 3. The sensor is placed outside, and the measurement window is set at the position corresponding to the sensor in the cavity. However, as the number of etchings increases, the measurement window is easy to attach pollutants, thereby reducing the measurement accuracy of the sensor.
因此需要可以精確判斷消耗環的消耗情況的檢測方法,且不影響製程的品質。Therefore, there is a need for a detection method that can accurately determine the consumption of the consumption ring without affecting the quality of the manufacturing process.
本發明的目的在於解決上述問題,及提供能夠精確判斷消耗環的消耗情況的檢測裝置,以及包括所述檢測裝置的等離子體處理設備、運行方法、運算方法。The purpose of the present invention is to solve the above problems, and provide a detection device capable of accurately judging the consumption of a consumable ring, as well as a plasma processing device, an operation method, and an operation method including the detection device.
本發明提供一種用於等離子體處理設備的檢測裝置,所述等離子體處理設備包含:腔體、基座以及機械手,所述基座置於所述腔體中用於支撐待處理的晶圓,所述機械手能夠伸入所述腔體內取出所述晶圓; 所述檢測裝置包括: 消耗環,所述消耗環置於所述基座四周;所述消耗環包括第一材料和第二材料,所述第一材料具有第一顏色,所述第二材料具有不同於第一顏色的第二顏色;所述第一材料暴露於所述消耗環的上表面,所述第二材料未暴露於所述上表面; 探測模組,所述探測模組可拆卸地與機械手連接,所述探測模組包括顏色感測器模組,所述顏色感測器模組用於檢測所述消耗環顏色的變化。 The present invention provides a detection device for plasma processing equipment. The plasma processing equipment includes: a cavity, a base and a manipulator, and the base is placed in the cavity to support a wafer to be processed. , the manipulator can extend into the cavity to take out the wafer; The detection device includes: a consumption ring, the consumption ring is placed around the base; the consumption ring includes a first material and a second material, the first material has a first color, and the second material has a color different from the first color a second color; the first material is exposed on the upper surface of the sacrificial ring, the second material is not exposed on the upper surface; A detection module, the detection module is detachably connected with the manipulator, the detection module includes a color sensor module, and the color sensor module is used to detect the change of the color of the consumption ring.
可選的,所述第一材料和第二材料均為環形,所述第一材料位於所述第二材料的上方。Optionally, both the first material and the second material are ring-shaped, and the first material is located above the second material.
可選的,所述第一材料和第二材料均為環形,所述第一材料具有開口向下的圓環狀的凹槽,所述第二材料通過應力嵌入所述凹槽。Optionally, both the first material and the second material are ring-shaped, the first material has a circular groove opening downward, and the second material is embedded into the groove through stress.
可選的,所述消耗環還包括預警材料環,所述預警材料環的顏色與第一材料不同,所述預警材料環置於所述第一材料和第二材料之間。Optionally, the consumption ring further includes a warning material ring, the color of the warning material ring is different from that of the first material, and the warning material ring is placed between the first material and the second material.
可選的,所述第一材料的材料不同於所述第二材料,所述第一材料選自矽、碳化矽或氧化鋁,所述第二材料選自矽、碳化矽或氧化鋁。Optionally, the first material is different from the second material, the first material is selected from silicon, silicon carbide or aluminum oxide, and the second material is selected from silicon, silicon carbide or aluminum oxide.
可選的,探測模組還包括上方部分、下方部分和連接部,所述連接部用於連接所述上方部分和下方部分,所述下方部分為圓盤狀。Optionally, the detection module further includes an upper part, a lower part and a connecting part, the connecting part is used for connecting the upper part and the lower part, and the lower part is disc-shaped.
可選的,上方部分和下方部分之間具有容置部,所述容置部用於容納機械手的臂。Optionally, there is an accommodating part between the upper part and the lower part, and the accommodating part is used for accommodating the arm of the manipulator.
可選的,所述探測模組還包括與顏色感測器模組電連的充電電池、控制器、訊號傳輸器和充電接頭;所述充電電池用於給顏色感測器模組、控制器、訊號傳輸器供電,所述控制器用於接收顏色感測器模組的檢測資料並運算,所述訊號傳輸器用於將控制器的運算結果發送給終端,所述充電接頭用於給充電電池充電。Optionally, the detection module also includes a rechargeable battery, a controller, a signal transmitter and a charging connector electrically connected to the color sensor module; the rechargeable battery is used to power the color sensor module, the controller 1. The signal transmitter supplies power, the controller is used to receive the detection data of the color sensor module and calculate it, the signal transmitter is used to send the calculation result of the controller to the terminal, and the charging connector is used to charge the rechargeable battery .
可選的,訊號傳輸器的訊號傳輸方式為無線傳輸。Optionally, the signal transmission mode of the signal transmitter is wireless transmission.
可選的,所述充電電池、控制器、訊號傳輸器和充電接頭集成於所述上方部分、下方部分和連接部構成的內部空間或集成於所述上方部分的上表面Optionally, the rechargeable battery, the controller, the signal transmitter and the charging connector are integrated into the inner space formed by the upper part, the lower part and the connection part or integrated on the upper surface of the upper part
可選的,所述充電電池、控制器、訊號傳輸器和充電接頭集成於所述顏色感測器模組內。Optionally, the rechargeable battery, controller, signal transmitter and charging connector are integrated in the color sensor module.
可選的,所述顏色感測器模組為四個,置於所述下方部分的下表面周向上,且各所述顏色感測器模組在所述周向上的間隔相同。Optionally, there are four color sensor modules, which are placed in the circumferential direction of the lower surface of the lower part, and the intervals between the color sensor modules in the circumferential direction are the same.
可選的,所述下方部分的下表面設有環形軌道,所述環形軌道沿著下方部分的周向設置,所述顏色感測器模組可沿所述環形軌道移動。Optionally, a circular track is provided on the lower surface of the lower part, and the circular track is arranged along the circumference of the lower part, and the color sensor module can move along the circular track.
可選的,所述下方部分的下表面開設有向下開口的環形凹槽,所述環形凹槽的開口兩側處分別設置有臺階;所述顏色感測器模組還包括驅動部件、傳動部件、轉動輪和用於支撐所述轉動輪的支架,所述驅動部件通過傳動部件驅動所述轉動輪轉動;所述轉動輪置於所述環形凹槽內並通過所述臺階支撐。Optionally, the lower surface of the lower part is provided with an annular groove that opens downward, and steps are respectively provided on both sides of the opening of the annular groove; the color sensor module also includes a driving component, a transmission components, a rotating wheel and a bracket for supporting the rotating wheel, the driving part drives the rotating wheel to rotate through the transmission part; the rotating wheel is placed in the annular groove and supported by the step.
進一步的,本發明還公開了一種等離子體處理設備,所述等離子體處理設備包含:腔體、基座以及機械手,所述基座置於所述腔體中用於支撐待處理的晶圓,所述機械手能夠伸入所述腔體內取出所述晶圓; 還包括上述的檢測裝置,所述檢測裝置用於檢測消耗環的消耗情況,並根據消耗環的消耗情況判斷是否需要更換。 Further, the present invention also discloses a plasma processing equipment, the plasma processing equipment includes: a cavity, a base, and a manipulator, the base is placed in the cavity to support the wafer to be processed , the manipulator can extend into the cavity to take out the wafer; The above-mentioned detection device is also included, and the detection device is used for detecting the consumption of the consumable ring, and judging whether it needs to be replaced according to the consumption of the consumable ring.
進一步的,本發明還公開了一種檢測裝置的運行方法包括下列步驟:等離子體處理設備結束製程過程;機械手攜帶探測模組進入腔體內;以及,顏色感測器模組檢測消耗環的顏色並獲得檢測資料,所述探測模組接收所述顏色感測器模組的檢測資料並運算,並將運算結果發送給終端。Further, the present invention also discloses a detection device operating method comprising the following steps: the plasma processing equipment finishes the process; the manipulator carries the detection module into the cavity; and the color sensor module detects the color of the consumable ring and Obtain detection data, the detection module receives the detection data of the color sensor module and performs calculation, and sends the calculation result to the terminal.
可選的,本發明還公開了一種用於上述運行方法的運算方法,所述運算方法具體包括:將所述檢測資料與預先存儲的對應於第二材料的顏色數值進行比較,判斷所述檢測資料是否與第二材料的顏色數值匹配。Optionally, the present invention also discloses an operation method for the above operation method, the operation method specifically includes: comparing the detection data with the pre-stored color value corresponding to the second material, and judging the detection Whether the material matches the color value of the second material.
可選的,本發明還公開了一種用於上述運行方法的運算方法,所述運算方法具體包括:得到相鄰的兩次所述檢測的檢測資料,兩次所述檢測資料分別為第一資料和第二資料;將第二資料和第一資料進行比較,判斷第二資料與第一資料是否相等。Optionally, the present invention also discloses an operation method for the above operation method, the operation method specifically includes: obtaining the detection data of two adjacent detections, the two detection data are respectively the first data and the second data; compare the second data with the first data, and judge whether the second data is equal to the first data.
本發明的檢測裝置解決了現有技術中無法精確判斷消耗環被消耗情況的問題,具有以下優點:檢測裝置包括消耗環和探測模組,所述消耗環包括第一材料和第二材料,所述第一材料具有第一顏色,所述第二材料具有不同於第一顏色的第二顏色。所述探測模組可拆卸地與機械手連接,所述探測模組包括顏色感測器模組,所述顏色感測器模組用於檢測所述消耗環顏色的變化,該方法檢測簡單準確,且不會給腔體帶來污染。The detection device of the present invention solves the problem in the prior art that it is impossible to accurately judge the consumption of the consumable ring, and has the following advantages: the detection device includes a consumable ring and a detection module, the consumable ring includes a first material and a second material, and the The first material has a first color and the second material has a second color different from the first color. The detection module is detachably connected with the manipulator, the detection module includes a color sensor module, and the color sensor module is used to detect the change of the color of the consumption ring, and the detection method is simple and accurate , and will not bring pollution to the cavity.
以下參考附圖具體描述本發明的檢測裝置的實施方式。Embodiments of the detection device of the present invention will be specifically described below with reference to the accompanying drawings.
圖1是本發明的等離子體處理設備的結構示意圖。等離子體處理設備可例如等離子體蝕刻設備,現有的蝕刻設備主要有兩種:電感耦合等離子體蝕刻設備和電容耦合等離子蝕刻設備,以電容耦合等離子蝕刻設備為例,如圖1所示,所述等離子體處理設備包括:腔體100、基座103、機械手106以及檢測裝置,所述腔體100具有大致圓柱形的側壁101,所述側壁101上設置有傳輸口102,所述機械手106從所述傳輸口102進出所述腔體100,所述機械手106用於晶圓的傳輸,同時也用於檢測裝置的載入和載出。所述基座103置於所述腔體100中用於支撐待處理的晶圓,基座103同時作為下電極;基座中還設有用於提供靜電吸附力的電極109;腔體100內設置一與基座103相對的噴淋頭104,所述噴淋頭104與氣源105連接,用於向腔體100內供應反應氣體,同時作為腔體100的上電極,所述上電極和下電極之間形成一反應區域。至少一射頻電源通過匹配網路施加到所述上電極或下電極之一,在所述上電極和所述下電極之間產生射頻電場,用以將反應氣體解離為等離子體,等離子體中含有大量的電子、離子、激發態的原子、分子和自由基等活性粒子,上述活性粒子可以和待處理晶圓的表面發生多種物理和化學反應,使得晶圓表面的形貌發生改變,完成蝕刻過程。真空的腔體100的下方還設置一泵107,用於將反應副產物排出腔體,維持腔體的真空環境。在所述反應區域和非反應區域之間設置一等離子體限制環108,等離子體限制環108上設有排氣通道,通過合理設置排氣通道的深寬比例,在實現將反應氣體排出的同時,將等離子體約束在上、下電極之間的所述反應區域,避免等離子體洩露到非反應區域,造成非反應區域的部件的損傷。FIG. 1 is a schematic structural view of the plasma processing equipment of the present invention. Plasma processing equipment can be, for example, plasma etching equipment. There are mainly two types of existing etching equipment: inductively coupled plasma etching equipment and capacitively coupled plasma etching equipment. Taking capacitively coupled plasma etching equipment as an example, as shown in Figure 1, the The plasma processing equipment includes: a
如圖1所述,所述檢測裝置包括:消耗環300和探測模組200,所述消耗環300置於所述基座103的四周,所述探測模組200可拆卸地與機械手106連接。As shown in Figure 1, the detection device includes: a
如圖1所述,所述消耗環300包括第一材料301和第二材料302,所述第一材料301具有第一顏色,所述第二材料302具有不同於第一顏色的第二顏色;所述第一材料301暴露於所述消耗環300的上表面,所述第二材料302未暴露於所述上表面,所述第一材料301和第二材料302均為具有一定厚度的環形,第一材料301置於第二材料302的上表面。所述第一材料301的厚度取決於該厚度的消耗是否會影響製程品質,即:第一材料301的厚度被消耗後對製程品質的影響不大。As shown in FIG. 1 , the
如圖1所述,所述探測模組200包括顏色感測器模組401,所述顏色感測器模組401用於檢測所述消耗環300顏色的變化,由於第一材料301和第二材料302的顏色不同,因此一旦第一材料301被腐蝕消耗殆盡,顏色感測器模組401就會檢測到消耗環300的顏色的變化,說明第一材料301已經被腐蝕,消耗環300厚度減小,由於消耗環300的厚度減小會導致其調節基座103的四周等離子體濃度的功能減弱,那麼就會在接下來的蝕刻製程過程中影響晶圓邊緣的製程品質,這時就需要更換新的消耗環以解決上述問題。As shown in Figure 1, the
圖2是本發明的圖1中沿線AA’的截面圖。如圖2所示,探測模組200還包括上方部分201、下方部分202和連接部203,所述連接部203用於連接所述上方部分201和下方部分202。圖3是本發明的機械手的仰視圖,由圖3可以看出,機械手106具有兩個臂1061,所述下方部分202為圓盤狀,在所述下方部分202的下表面設置有四個顏色感測器模組401,所述顏色感測器模組401置於所述下方部分202的下表面的周向上,且各所述顏色感測器模組401在所述周向上的間隔相同或不相同,這樣的優點在於:如果消耗環300在某一個方位上被腐蝕的速率過快,有可能在該方位的消耗環300率先被消耗到可以更換的要求,如果僅設置一個顏色感測器模組401,很可能錯過了更換時間導致下一次的製程品質被影響。Fig. 2 is a sectional view along the line AA' in Fig. 1 of the present invention. As shown in FIG. 2 , the
由圖2,上方部分、下方部分和連接部的截面呈“工”字型,所述顏色感測器模組401位於下方部分202的下表面,在消耗環300的正上方。所述上方部分201和下方部分202之間具有容置部,所述容置部用於容納機械手106的臂1061,所述臂1061可以插入容置部,可以將探測模組200整體載入腔體100中,同時,機械手106還可以用於晶圓的載入和載出。這樣探測模組200可以像晶圓一樣被載入和載出腔體100,其設置並未對腔體有任何影響,因此不會影響製程品質,探測模組200的顏色感測器模組401也不會被蝕刻氣體或污染物影響,可以保證測量準確性。From FIG. 2 , the cross-sections of the upper part, the lower part and the connecting part are in the shape of an "I", and the
由圖2,所述探測模組200還包括與顏色感測器模組401電連的充電電池402、控制器403、訊號傳輸器404和充電接頭405,所述充電電池402用於給顏色感測器模組401、控制器403、訊號傳輸器404供電,所述控制器403用於接收顏色感測器模組401的檢測資料並運算,所述訊號傳輸器404用於將控制器403的運算結果發送給終端,所述充電接頭405用於給充電電池402充電。所述終端可以是等離子體處理設備的控制台或者移動通訊設備,例如手機或平板電腦。對於設置的位置,可選的,所述充電電池402、控制器403、訊號傳輸器404和充電接頭405集成於所述上方部分201、下方部分202和連接部203構成的內部空間;可選的,所述充電電池402、控制器403、訊號傳輸器404和充電接頭405集成於所述顏色感測器模組401內,這樣兩種設置可以防止攜帶的顆粒物污染腔體100內部。同樣可選的,也可以集成於所述上方部分201的上表面。2, the
檢測裝置的運行方法。在製程過程結束後,機械手106從傳輸口102進入將晶圓傳輸到腔體100外,然後機械手106將探測模組200載入腔體100內,顏色感測器模組401內的顏色感測器工作,向消耗環300發射光束,消耗環300的表面將光束反射,顏色感測器接收到反射光的訊號,並將光訊號轉換為電訊號形成檢測資料,所述控制器403接收所述檢測資料並運算,具體的運算過程為:將該檢測資料與控制器403內預先存儲的對應於第二材料302的顏色數值進行比較,判斷所述檢測資料是否與第二材料302的顏色數值匹配,並將匹配結果傳輸給訊號傳輸器404,訊號傳輸器404將運算結果發送給終端,工作人員在終端可以看到檢測結果,如果結果顯示與第二材料302的顏色數值匹配,那麼工作人員便執行更換消耗環300的步驟,如果不匹配,則繼續使用現有的消耗環300。該檢測方法無需精確的計算消耗環300的厚度,方法簡單,且不會隨著製程次數的增加降低檢測準確度,更不會給腔體100內部帶來污染影響製程品質。The method of operation of the detection device. After the process ends, the
作為可選的檢測裝置的運行方法,在製程過程前,機械手106將探測模組200載入腔體100內,顏色感測器模組401內的顏色感測器工作,向消耗環300發射光束,消耗環300的表面將光束反射,顏色感測器接收到反射光的訊號,並將光訊號轉換為電訊號形成檢測資料,所述控制器403將所述檢測資料記錄形成第一數值,那麼所述第一數值即對應了第一材料301的顏色數值,在製程過程結束後,機械手106從傳輸口102進入將晶圓傳輸到腔體100外,然後機械手106將探測模組200載入腔體內,顏色感測器模組401內的顏色感測器工作,向消耗環300發射光束,消耗環300的表面將光束反射,顏色感測器接收到反射光的訊號,並將光訊號轉換為電訊號形成檢測資料,所述控制器403接收所述檢測資料形成第二數值,那麼所述第二數值即對應了第二材料302的顏色數值,然後運算,具體的運算過程為:將所述第二資料與所述第一資料比較,得到運算結果,當第二資料與第一資料不同時,說明需要更換消耗環300,控制器403將運算結果傳輸給訊號傳輸器404,訊號傳輸器404將運算結果發送給終端,工作人員在終端可以看到檢測結果決定是否更換消耗環300。As an optional operation method of the detection device, before the manufacturing process, the
由於本發明檢測結果並非即時檢測,因此存在以下問題:一次製程結束後測量結果顯示第一材料301並未消耗完,於是進行下一次製程,這一次製程過程中,第一材料301被腐蝕殆盡,因此這次製程過程中會有部分時間製程品質衰減,製程過程結束後再更換消耗環300會滯後,影響了這次製程的品質。圖4是本發明的消耗環的又一實施方式的結構示意圖,如圖4,作為一個可選的實施方式,消耗環300還包括一預警材料環303,所述預警材料環303置於所述第一材料301和第二材料302之間,可選的,所述預警材料環303的顏色與第一材料301不同,或與第一材料301和第二材料302的顏色均不同。所述預警材料303具有一定厚度,所述厚度等於一次或多次製程所消耗的消耗環300的厚度,這樣的厚度雖然不夠精確,但是可以根據多次製程推算得到,這樣就可以在測量到預警材料環303時,根據下次製程的時間判斷是否需要更換消耗環。Since the detection result of the present invention is not real-time detection, there is the following problem: after the end of one process, the measurement result shows that the
對於如圖4這樣的層狀的消耗環300,各層之間需要通過粘接層粘接,但是粘接層會在製程過程中給腔體100內帶來污染物,從而影響了製程品質。圖5是本發明的消耗環的又一實施方式的結構示意圖,所述第一材料301和第二材料302均為環形,所述第一材料301具有開口向下的圓環狀的凹槽,所述第二材料302通過應力嵌入所述凹槽,這樣避免了採用粘接層粘接的問題。圖6是本發明的消耗環的又一實施方式的結構示意圖,在所述第一材料301和第二材料302之間還夾設有預警材料環303。For the layered
消耗環300材料的選擇。消耗環300選擇現有技術中常用的消耗環的材料,例如:矽、碳化矽或氧化鋁,這些材料腐蝕後不會對腔體帶來污染,且矽的顏色為灰金,碳化矽的顏色為灰白,氧化鋁的顏色為黃。因此第一材料和第二材料可以分別從中選擇兩種不同的材料。Choice of
圖7是本發明的探測模組的又一實施方式的結構示意圖。如圖2所式的實施方式,採用了四個顏色感測器模組401,但是也僅能測量四個方位的消耗環300的消耗狀況,且四個顏色感測器模組401還會帶來成本上的上升。作為一個可選的實施方式,所述下方部分202的下表面設有環形軌道406,所述環形軌道406沿著下方部分202的周向設置,所述顏色感測器模組401為一個,且可沿所述環形軌道406移動。在檢測裝置運行時,每次顏色感測器模組401在環形軌道406上運行一周,判斷消耗環300是否在某一方位已經消耗到需要更換的厚度,增加了準確性。Fig. 7 is a schematic structural view of another embodiment of the detection module of the present invention. In the embodiment shown in Figure 2, four
圖8是本發明的探測模組的又一實施方式的結構示意圖。作為一個可選的實施方式,所述下方部分202的下表面開設有向下開口的環形凹槽500,所述環形凹槽500的開口兩側處分別設置有臺階501;所述顏色感測器模組401還包括驅動部件、傳動部件、轉動輪408和用於支撐所述轉動輪408的支架407,所述驅動部件通過傳動部件驅動所述轉動輪408轉動;所述轉動輪408置於所述環形凹槽500內並通過所述臺階501支撐。在檢測裝置運行時,每次顏色感測器模組401沿著環形凹槽500運行一周,判斷消耗環300是否在某一方位已經消耗到需要更換的厚度。Fig. 8 is a schematic structural diagram of another embodiment of the detection module of the present invention. As an optional implementation, the lower surface of the
需要說明的是,在本發明的實施例中,術語“中心”、“縱向”、“橫向”、“長度”、“寬度”、“厚度”、“上”、“下”、“前”、“後”、“左”、“右”、“垂直”、“水平”、“頂”、“底”“內”、“外”、“順時針”、“逆時針”、“軸向”、“徑向”、“周向”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述實施例,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。此外,術語“第一”、“第二”、“第三”僅用於描述目的,而不能理解為指示或暗示相對重要性。It should be noted that, in the embodiments of the present invention, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientations or positional relationships indicated by "radial", "circumferential", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments, rather than indicating or implying that the referred device or element must have a specific orientation, are constructed and operate in a particular orientation and therefore are not to be construed as limiting the invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.
在本發明中,除非另有明確的規定和限定,術語“安裝”、“相連”、“連接”、“固定”等術語應做廣義理解,例如,可以是固定連接,也可以是可拆卸連接,或成一體;可以是機械連接,也可以是電連接;可以是直接相連,也可以通過中間媒介間接相連,可以是兩個元件內部的連通或兩個元件的相互作用關係。對於所屬技術領域中具有通常知識者而言,可以根據具體情況理解上述術語在本發明中的具體含義。In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the technical field can understand the specific meanings of the above terms in the present invention according to specific situations.
儘管本發明的內容已經通過上述較佳的實施例作了詳細介紹,但應當認識到上述的描述不應被認為是對本發明的限制。在所屬技術領域中具有通常知識者閱讀了上述內容後,對於本發明的多種修改和替代都將是顯而易見的。因此,本發明的保護範圍應由所附的申請專利範圍來限定。Although the content of the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. Various modifications and alterations to the present invention will become apparent to those of ordinary skill in the art after reading the foregoing disclosure. Therefore, the protection scope of the present invention should be defined by the appended patent application scope.
100:腔體 101:側壁 102:傳輸口 103:基座 104:噴淋頭 105:氣源 106:機械手 1061:臂 107:泵 108:等離子體限制環 109:電極 200:探測模組 201:上方部分 202:下方部分 203:連接部 300:消耗環 301:第一材料 302:第二材料 303:預警材料 401:顏色感測器模組 402:充電電池 403:控制器 404:訊號傳輸器 405:充電接頭 406:環形軌道 407:支架 408:轉動輪 500:環形凹槽 501:臺階 100: cavity 101: side wall 102: transmission port 103: base 104: sprinkler head 105: gas source 106: Manipulator 1061: arm 107: pump 108: Plasma confinement ring 109: electrode 200: detection module 201: upper part 202: the lower part 203: connection part 300: consumption ring 301: first material 302: second material 303: Early warning materials 401: Color sensor module 402: rechargeable battery 403: Controller 404: Signal Transmitter 405: charging connector 406: Ring track 407: bracket 408: Turning wheel 500: Ring groove 501: steps
圖1是本發明的等離子體處理設備的結構示意圖。 圖2是本發明的圖1中沿線AA’的截面圖。 圖3是本發明的機械手的仰視圖。 圖4是本發明的消耗環的又一實施方式的結構示意圖。 圖5是本發明的消耗環的又一實施方式的結構示意圖。 圖6是本發明的消耗環的又一實施方式的結構示意圖。 圖7是本發明的探測模組的又一實施方式的結構示意圖。 圖8是本發明的探測模組的又一實施方式的結構示意圖。 FIG. 1 is a schematic structural view of the plasma processing equipment of the present invention. Fig. 2 is a sectional view along the line AA' in Fig. 1 of the present invention. Fig. 3 is a bottom view of the manipulator of the present invention. Fig. 4 is a structural schematic diagram of another embodiment of the consumption ring of the present invention. Fig. 5 is a structural schematic diagram of another embodiment of the consumption ring of the present invention. Fig. 6 is a schematic structural diagram of another embodiment of the consumption ring of the present invention. Fig. 7 is a schematic structural view of another embodiment of the detection module of the present invention. Fig. 8 is a schematic structural diagram of another embodiment of the detection module of the present invention.
100:腔體 100: cavity
101:側壁 101: side wall
102:傳輸口 102: transmission port
103:基座 103: base
104:噴淋頭 104: sprinkler head
105:氣源 105: gas source
106:機械手 106: Manipulator
107:泵 107: pump
108:等離子體限制環 108: Plasma confinement ring
109:電極 109: electrode
200:探測模組 200: detection module
201:上方部分 201: upper part
202:下方部分 202: the lower part
300:消耗環 300: consumption ring
301:第一材料 301: first material
302:第二材料 302: second material
401:顏色感測器模組 401: Color sensor module
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