CN115527825A - Detection device for plasma processing equipment and plasma processing equipment - Google Patents

Detection device for plasma processing equipment and plasma processing equipment Download PDF

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Publication number
CN115527825A
CN115527825A CN202110711147.1A CN202110711147A CN115527825A CN 115527825 A CN115527825 A CN 115527825A CN 202110711147 A CN202110711147 A CN 202110711147A CN 115527825 A CN115527825 A CN 115527825A
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CN
China
Prior art keywords
ring
color
color sensor
detection
plasma etching
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CN202110711147.1A
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Chinese (zh)
Inventor
赵宏波
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Advanced Micro Fabrication Equipment Inc Shanghai
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Advanced Micro Fabrication Equipment Inc Shanghai
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Priority to CN202110711147.1A priority Critical patent/CN115527825A/en
Priority to TW111116443A priority patent/TWI817478B/en
Publication of CN115527825A publication Critical patent/CN115527825A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32889—Connection or combination with other apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Abstract

The invention discloses a detection device for a plasma processing device and the plasma processing device, which comprises a consumption ring and a detection module, wherein the consumption ring comprises a first material and a second material, the first material has a first color, and the second material has a second color different from the first color. The detection module is detachably connected with the manipulator and comprises a color sensor module, and the color sensor module is used for detecting the color change of the consumption ring.

Description

Detection device for plasma processing equipment and plasma processing equipment
Technical Field
The present invention relates to a detection device for a plasma processing apparatus, and a plasma processing apparatus.
Background
The steps of fabricating a semiconductor device generally include: photoetching, etching, ashing, ion implantation, film deposition and the like. In the existing semiconductor device manufacturing process, a pattern can be formed on the surface of a wafer by etching with plasma.
Plasma processing equipment, such as etching equipment, generally has a focus ring, an edge ring and other rings arranged around a susceptor for adjusting the concentration of plasma around the susceptor, thereby ensuring the uniformity of etching around the susceptor during the etching process. However, with the accumulation of the number of times of the etching process, the etching gas not only etches the surface of the wafer in the process, but also etches the upper surfaces of the ring bodies such as the focus ring and the edge ring, which causes the thickness of the ring bodies to be gradually reduced and consumed, and the thickness of the ring bodies is reduced to cause the deterioration of the etching process at the edge position of the wafer, and the etching uniformity at the edge position is poor, so that a new focus ring needs to be replaced to ensure the process quality at the edge position.
But how to detect the depletion of these depleted loops has been a pain point in the field. The existing detection method has the following defects: 1. the corroded condition of the consumable ring is judged by measuring the height difference of the consumable ring, the height difference needs to be measured, and therefore a reference value is needed, but in the process, the position of the consumable ring and the like can slightly shift, so the reference value can change, the measured height difference has large errors, and a series of algorithms are needed. 2. The sensor is arranged in the cavity, so that pollution is brought to the interior of the cavity to influence the process quality. 3. The sensor is arranged outside, and the measuring window is arranged at the position, corresponding to the sensor, of the cavity, but with the increase of the etching times, pollutants are easily attached to the measuring window, so that the measuring precision of the sensor is reduced.
There is therefore a need for a detection method that can accurately determine the consumption of the consumable loops without affecting the quality of the process.
Disclosure of Invention
An object of the present invention is to solve the above-mentioned problems and to provide a detection device capable of accurately judging the consumption condition of a consumption ring, and a plasma etching apparatus including the detection device.
The present invention provides a detection device for a plasma processing apparatus, the plasma processing apparatus comprising: the wafer processing device comprises a cavity, a base and a manipulator, wherein the base is arranged in the cavity and used for supporting a wafer to be processed, and the manipulator can extend into the cavity and take out the wafer;
the detection device includes:
a consumable ring disposed about the base; the sacrificial ring comprises a first material having a first color and a second material having a second color different from the first color; the first material is exposed to an upper surface of the sacrificial ring, the second material is not exposed to the upper surface;
the detection module is detachably connected with the manipulator and comprises a color sensor module, and the color sensor module is used for detecting the color change of the consumption ring.
Optionally, the first material and the second material are both ring-shaped, and the first material is located above the second material.
Optionally, the first material and the second material are both annular, the first material has an annular groove with a downward opening, and the second material is embedded in the groove through stress.
Optionally, the consumption ring further comprises an early warning material ring, the color of the early warning material ring is different from that of the first material, and the early warning material ring is arranged between the first material and the second material.
Optionally, the first material is different from the second material, the first material is selected from silicon, silicon carbide or aluminum oxide, and the second material is selected from silicon, silicon carbide or aluminum oxide.
Optionally, the detection module further includes an upper portion, a lower portion, and a connecting portion, the connecting portion is used to connect the upper portion and the lower portion, and the lower portion is in a shape of a disk.
Optionally, there is a receptacle between the upper and lower portions for receiving an arm of a robot.
Optionally, the detection module further comprises a rechargeable battery electrically connected with the color sensor module, a controller, a signal transmitter and a charging connector; the rechargeable battery is used for supplying power to the color sensor module, the controller and the signal transmitter, the controller is used for receiving detection data of the color sensor module and calculating, the signal transmitter is used for sending an operation result of the controller to the terminal, and the charging connector is used for charging the rechargeable battery.
Optionally, the signal transmission mode of the signal transmitter is wireless transmission.
Optionally, the rechargeable battery, the controller, the signal transmitter and the charging connector are integrated in an inner space formed by the upper portion, the lower portion and the connecting portion or integrated on an upper surface of the upper portion
Optionally, the rechargeable battery, the controller, the signal transmitter and the charging connector are integrated in the color sensor module.
Optionally, the number of the color sensor modules is four, the color sensor modules are arranged on the circumferential direction of the lower surface of the lower portion, and the intervals of the color sensor modules in the circumferential direction are the same.
Optionally, the lower surface of the lower portion is provided with an annular rail, the annular rail is arranged along the circumference of the lower portion, and the color sensor module can move along the annular rail.
Optionally, the lower surface of the lower portion is provided with an annular groove which is opened downwards, and steps are respectively arranged at two sides of the opening of the annular groove; the color sensor module further comprises a driving part, a transmission part, a rotating wheel and a bracket for supporting the rotating wheel, wherein the driving part drives the rotating wheel to rotate through the transmission part; the rotating wheel is arranged in the annular groove and supported by the step.
Further, the present invention also discloses a plasma processing apparatus comprising: the wafer processing device comprises a cavity, a base and a manipulator, wherein the base is arranged in the cavity and used for supporting a wafer to be processed, and the manipulator can extend into the cavity and take out the wafer;
the detection device is used for detecting the consumption condition of the consumption ring and judging whether the consumption ring needs to be replaced or not according to the consumption condition of the consumption ring.
Further, the invention also discloses an operation method of the detection device, which comprises the following steps: the plasma processing equipment finishes the process; the mechanical arm carries the detection module to enter the cavity; the color sensor module detects the color of the consumption ring and obtains detection data, and the detection module receives and calculates the detection data of the color sensor module and sends the calculation result to the terminal.
Optionally, the operation method specifically includes: and comparing the detection data with a prestored color numerical value corresponding to the second material, and judging whether the detection data is matched with the color numerical value of the second material.
Optionally, the operation method specifically includes: obtaining detection data of two adjacent detections, wherein the detection data of two times are respectively first data and second data; and comparing the second data with the first data, and judging whether the second data is equal to the first data.
The detection device solves the problem that the consumed condition of the consumption ring cannot be accurately judged in the prior art, and has the following advantages:
drawings
Fig. 1 is a schematic structural view of a plasma etching apparatus of the present invention.
FIG. 2 is a cross-sectional view of the invention taken along line AA' in FIG. 1.
Fig. 3 is a bottom view of the robot of the present invention.
Fig. 4 is a schematic structural view of still another embodiment of the sacrificial ring of the present invention.
Fig. 5 is a schematic structural view of still another embodiment of the consumption ring of the present invention.
Fig. 6 is a schematic structural view of still another embodiment of the consumption ring of the present invention.
Fig. 7 is a schematic structural diagram of another embodiment of the detection module of the present invention.
Fig. 8 is a schematic structural diagram of another embodiment of the detection module of the present invention.
Detailed Description
Embodiments of the detection apparatus of the present invention are specifically described below with reference to the drawings.
Fig. 1 is a schematic structural view of a plasma etching apparatus of the present invention. The existing etching equipment mainly comprises two types: an inductively coupled plasma etching apparatus and a capacitively coupled plasma etching apparatus, taking the capacitively coupled plasma etching apparatus as an example, as shown in fig. 1, the etching apparatus includes: the wafer detection device comprises a cavity 100, a base 103, a mechanical arm 106 and a detection device, wherein the cavity 100 is provided with a roughly cylindrical side wall 101, a transmission port 102 is formed in the side wall 101, the mechanical arm 106 enters and exits the cavity 100 from the transmission port 102, and the mechanical arm 106 is used for transmitting wafers and simultaneously used for loading and unloading the detection device. The pedestal 103 is arranged in the cavity 100 and used for supporting a wafer to be processed, and the pedestal 103 is simultaneously used as a lower electrode; an electrode 109 for providing electrostatic adsorption force is also arranged in the base; a shower head 104 is disposed in the chamber 100 opposite to the susceptor 103, and the shower head 104 is connected to a gas source 105 for supplying a reaction gas into the chamber and also serves as an upper electrode of the chamber, and a reaction region is formed between the upper electrode and the lower electrode. At least one radio frequency power supply is applied to one of the upper electrode or the lower electrode through a matching network, a radio frequency electric field is generated between the upper electrode and the lower electrode and is used for dissociating reaction gas into plasma, the plasma contains a large number of active particles such as electrons, ions, excited atoms, molecules, free radicals and the like, and the active particles can generate various physical and chemical reactions with the surface of a wafer to be processed, so that the appearance of the surface of the wafer is changed, and the etching process is completed. A pump 107 is also disposed below the vacuum chamber 100 to evacuate reaction byproducts from the chamber and maintain a vacuum environment in the chamber. A plasma limiting ring 108 is arranged between the reaction region and the non-reaction region, an exhaust channel is arranged on the plasma limiting ring 108, and through reasonably setting the depth-width ratio of the exhaust channel, the plasma is confined in the reaction region between the upper electrode and the lower electrode while the reaction gas is exhausted, so that the plasma is prevented from leaking to the non-reaction region to cause the damage of the components of the non-reaction region.
As shown in fig. 1, the detection apparatus includes: the consumption ring 300 is arranged on the periphery of the base 103, and the detection module 200 is detachably connected with the manipulator 106.
As shown in fig. 1, the consumable ring 300 includes a first material 301 and a second material 302, the first material 301 having a first color and the second material 302 having a second color different from the first color; the first material 301 is exposed to an upper surface of the consumption ring, the second material 302 is not exposed to the upper surface, the first material 301 and the second material 302 are both in a ring shape having a certain thickness, and the first material 301 is disposed on the upper surface of the second material 302. The thickness of the first material 301 depends on whether the consumption of this thickness affects the process quality, i.e.: the thickness of the first material 301 is consumed with little impact on the process quality.
As shown in fig. 1, the detection module 200 includes a color sensor module 401, the color sensor module 401 is configured to detect a color change of the consumable ring 300, and since the first material 301 and the second material 302 have different colors, once the first material 301 is consumed by corrosion, the color sensor module will detect the color change of the consumable ring 300, which indicates that the first material 301 has been corroded, the thickness of the consumable ring 300 is reduced, and the function of the consumable ring 300 for adjusting the plasma concentration around the susceptor is reduced due to the reduced thickness, the process quality of the wafer edge will be affected during the following etching process, and a new consumable ring needs to be replaced to solve the above problem.
FIG. 2 is a cross-sectional view of the invention taken along line AA' in FIG. 1. As shown in fig. 2, the detection module 200 further comprises an upper portion 201, a lower portion 202 and a connection portion 203, wherein the connection portion 203 is used for connecting the upper portion 201 and the lower portion 202. Fig. 3 is a bottom view of the robot hand of the present invention, and as can be seen from fig. 3, the robot hand 106 has two arms 1061, the lower portion 202 is in a disk shape, four color sensor modules 401 are disposed on the lower surface of the lower portion 202, the color sensor modules 401 are disposed on the lower surface of the lower portion in the circumferential direction, and the intervals of the color sensor modules 401 in the circumferential direction are the same or different, which is advantageous in that: if the consumption ring is corroded at an excessively high rate in a certain direction, the consumption ring in the direction may be consumed to a replaceable requirement, and if only one color sensor module is arranged, the replacement time is likely to be missed, so that the next process quality is affected.
From fig. 2, the cross-section of the upper portion, the lower portion, and the connecting portion is in an i shape, and the color sensor module 401 is located on the lower surface of the lower portion 202, right above the consumable ring 300. The upper portion 201 and the lower portion 202 have a receptacle therebetween for receiving an arm 1061 of the robot 106, the arm 1061 being insertable into the receptacle to load the probe module 200 into the chamber 100 as a whole, and the robot 106 being adapted to load and unload wafers. Thus, the detection module 200 can be loaded into and out of the chamber 100 like a wafer, the arrangement of the detection module does not affect the chamber, the process quality is not affected, the color sensor module 401 of the detection module 200 is not affected by etching gas or pollutants, and the measurement accuracy can be ensured.
From fig. 2, the detection module 200 further includes a rechargeable battery 402 electrically connected to the color sensor module 401, a controller 403, a signal transmitter 404 and a charging connector 405, the rechargeable battery 402 is used for supplying power to the color sensor module 401, the controller 403 and the signal transmitter 404, the controller 403 is used for receiving detection data of the color sensor module and performing operation, the signal transmitter 404 is used for sending an operation result of the controller to a terminal, and the charging connector 405 is used for charging the rechargeable battery. The terminal may be a control panel of a plasma processing device or a mobile communication device, such as a mobile phone or tablet computer. For the set position, optionally, the rechargeable battery, the controller, the signal transmitter and the charging connector are integrated in an inner space formed by the upper part, the lower part and the connecting part; optionally, the rechargeable battery, the controller, the signal transmitter and the charging connector are integrated in the color sensor module 401, so that the carried particulate matters can be prevented from polluting the inside of the cavity by the two settings. Also optionally, it may be integral with the upper surface of the upper portion.
Method for operating a detection device. After the process is finished, the robot 106 enters from the transmission port 102 to transmit the wafer to the outside of the chamber 100, then the robot 106 loads the detection module 200 into the chamber, the color sensor in the color sensor module 401 works to emit a light beam to the consumption ring 300, the surface of the consumption ring 300 reflects the light beam, the color sensor receives the signal of the reflected light and converts the light signal into an electrical signal to form detection data, the controller 403 receives the detection data and performs operation, and the specific operation process is as follows: comparing the detected data with a color value corresponding to the second material 302, which is pre-stored in the controller 403, determining whether the detected data matches the color value of the second material 302, and transmitting the matching result to the signal transmitter 404, the signal transmitter 404 transmitting the operation result to the terminal, the staff can see the detection result at the terminal, if the result shows that the detected data matches the color value of the second material 302, the staff performs the step of replacing the consumption ring 300, and if the detected data does not match the color value of the second material 302, the staff continues to use the existing consumption ring 300. The detection method does not need to accurately calculate the thickness of the consumption ring 300, is simple, does not reduce the detection accuracy along with the increase of the process times, and does not bring pollution to the interior of the cavity to influence the process quality.
As an operation method of an optional detection device, before a process, the robot 106 loads the detection module 200 into the cavity, the color sensor in the color sensor module 401 works to emit a light beam to the consumption ring 300, the surface of the consumption ring 300 reflects the light beam, the color sensor receives a signal of the reflected light and converts the light signal into an electrical signal to form detection data, the controller 403 records the detection data to form a first value, the first value corresponds to the color value of the first material 301, after the process is finished, the robot 106 enters from the transmission port 102 to transmit the wafer out of the cavity 100, the robot 106 loads the detection module 200 into the cavity, the color sensor in the color sensor module 401 works to emit a light beam to the consumption ring 300, the surface of the consumption ring 300 reflects the light beam, the color sensor receives a signal of the reflected light and converts the optical signal into an electrical signal to form detection data, the controller 403 receives the detection data to form a second value, the second value corresponds to the color value of the second material 302, and then a specific operation process is as follows: and comparing the second data with the first data to obtain an operation result, when the second data is different from the first data, the consumption ring 300 needs to be replaced, transmitting the operation result to the signal transmitter 404 by the controller, transmitting the operation result to the terminal by the signal transmitter 404, and allowing a worker to see the detection result at the terminal to determine whether to replace the consumption ring 300.
Because the detection result of the invention is not real-time detection, the following problems exist: the measurement result after the process is finished shows that the first material 301 is not consumed, so the next process is performed, and in the process, the first material 301 is corroded to be used up, so the process quality is degraded in a part of time in the process, and after the process is finished, the replacement of the consumption ring 300 is delayed, so the quality of the process is influenced. Fig. 4 is a schematic view of a consumption ring according to another embodiment of the present invention, and as an alternative embodiment, the consumption ring 300 further includes a warning material ring 303, wherein the warning material ring 303 is disposed between the first material 301 and the second material 302, and optionally, the warning material ring 303 has a color different from the first material 301 or different from the first material and the second material. The early warning material 303 has a certain thickness, which is equal to the thickness of the consumption ring consumed by one or more processes, and although the thickness is not accurate enough, the thickness can be calculated according to a plurality of processes, so that when the early warning material ring 303 is measured, whether the consumption ring needs to be replaced can be judged according to the time of the next process.
For a laminated sacrificial ring 300 such as that shown in fig. 4, the layers need to be bonded by an adhesive layer, but the adhesive layer may bring contaminants into the cavity during the process, thereby affecting the process quality. Fig. 5 is a schematic structural view of a further embodiment of the sacrificial ring of the present invention, wherein the first material 301 and the second material 302 are both in a ring shape, the first material 301 has a ring-shaped groove with a downward opening, and the second material 302 is embedded in the groove by stress, so that the problem of bonding by using a bonding layer is avoided. Fig. 6 is a schematic structural diagram of a further embodiment of the consumption ring of the present invention, and a warning material ring 303 is further sandwiched between the first material 301 and the second material 302.
Selection of the material of the sacrificial ring 300. The consumable ring 300 is selected from materials commonly used in the art for consumable rings, such as: the silicon, the silicon carbide or the aluminum oxide can not pollute the cavity after being corroded, and the silicon is grey gold in color, the silicon carbide is grey white in color, and the aluminum oxide is yellow in color. The first material and the second material may thus be selected from two different materials, respectively.
Fig. 7 is a schematic structural diagram of a further embodiment of the detection module of the present invention. In the embodiment shown in fig. 2, four color sensor modules 401 are used, but the consumption status of the consumption ring 300 in four orientations can be measured, and the four color sensor modules will also increase the cost. As an alternative embodiment, the lower surface of the lower portion 202 is provided with an annular track 406, the annular track 406 is arranged along the circumference of the lower portion 202, and the color sensor module 401 is one and can move along the annular track 406. When the detection device runs, each time the color sensor module 401 runs for a circle on the annular track 406, whether the consumption ring is consumed to the thickness needing to be replaced in a certain position is judged, and the accuracy is improved.
Fig. 8 is a schematic structural diagram of a further embodiment of the detection module of the present invention. As an optional embodiment, the lower surface of the lower portion 202 is provided with an annular groove 500 which is opened downwards, and steps 501 are respectively arranged at two sides of the opening of the annular groove 500; the color sensor module further comprises a driving component, a transmission component, a rotating wheel 408 and a bracket 407 for supporting the rotating wheel 408, wherein the driving component drives the rotating wheel 408 to rotate through the transmission component; the rotating wheel 408 is disposed in the annular groove 500 and supported by the step 501. When the detecting device is operated, each time the color sensor module 401 is operated for one round along the annular groove 500, it is determined whether the consumable ring has been consumed to a thickness required to be replaced in a certain position.
It should be noted that, in the embodiments of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship shown in the drawings, and are only for convenience of describing the embodiments, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be limited only by the attached claims.

Claims (18)

1. A detection apparatus for a plasma processing apparatus, the plasma processing apparatus comprising: the wafer processing device comprises a cavity, a base and a manipulator, wherein the base is arranged in the cavity and used for supporting a wafer to be processed, and the manipulator can extend into the cavity and take out the wafer;
characterized in that the detection device comprises:
a consumable ring disposed about the base; the sacrificial ring comprises a first material having a first color and a second material having a second color different from the first color; the first material is exposed to an upper surface of the sacrificial ring, the second material is not exposed to the upper surface;
the detection module is detachably connected with the manipulator and comprises a color sensor module, and the color sensor module is used for detecting the color change of the consumption ring.
2. The detecting apparatus for a plasma etching apparatus as claimed in claim 1, wherein the first material and the second material are both ring-shaped, and the first material is located above the second material.
3. The detecting device for plasma etching equipment as claimed in claim 1, wherein the first material and the second material are both ring-shaped, the first material has a ring-shaped groove with a downward opening, and the second material is embedded in the groove by stress.
4. The detecting apparatus for a plasma etching apparatus according to claim 2 or 3, wherein the sacrificial ring further comprises a pre-warning material ring, the pre-warning material ring being different in color from the first material, the pre-warning material ring being interposed between the first material and the second material.
5. The detecting device for a plasma etching apparatus according to claim 1 or 2, wherein the first material is different from the second material, the first material being selected from silicon, silicon carbide, or aluminum oxide, and the second material being selected from silicon, silicon carbide, or aluminum oxide.
6. The detecting device for a plasma etching apparatus as claimed in claim 1, wherein the detecting module further comprises an upper portion, a lower portion and a connecting portion for connecting the upper portion and the lower portion, the lower portion being disk-shaped.
7. The inspection apparatus for a plasma etching apparatus as recited in claim 6, wherein the upper portion and the lower portion have a receiving portion therebetween, the receiving portion being configured to receive an arm of a robot.
8. The detecting device for a plasma etching apparatus as claimed in claim 7, wherein the detecting module further comprises a rechargeable battery electrically connected to the color sensor module, a controller, a signal transmitter and a charging connector; the charging battery is used for supplying power to the color sensor module, the controller and the signal transmitter, the controller is used for receiving detection data of the color sensor module and calculating, the signal transmitter is used for sending an operation result of the controller to the terminal, and the charging connector is used for charging the charging battery.
9. The detecting device for plasma etching equipment as claimed in claim 8, wherein the signal transmission mode of the signal transmitter is wireless transmission.
10. The detecting apparatus for a plasma etching apparatus as claimed in claim 8, wherein the rechargeable battery, the controller, the signal transmitter and the charging connector are integrated in an inner space formed by the upper portion, the lower portion and the connecting portion or integrated in an upper surface of the upper portion.
11. The detecting device for a plasma etching apparatus as claimed in claim 8, wherein the rechargeable battery, the controller, the signal transmitter and the charging connector are integrated in the color sensor module.
12. The detecting device for a plasma etching apparatus as claimed in claim 6, wherein the number of the color sensor modules is four, and the color sensor modules are disposed in a circumferential direction of a lower surface of the lower portion, and intervals of the color sensor modules in the circumferential direction are the same.
13. The detecting apparatus for a plasma etching apparatus as claimed in claim 11, wherein the lower surface of the lower portion is provided with an annular rail provided along a circumferential direction of the lower portion, the color sensor module being movable along the annular rail.
14. The detecting device for plasma etching equipment as recited in claim 11, wherein the lower surface of the lower portion is provided with an annular groove which is opened downwards, and steps are respectively provided at two sides of the opening of the annular groove; the color sensor module further comprises a driving part, a transmission part, a rotating wheel and a bracket for supporting the rotating wheel, wherein the driving part drives the rotating wheel to rotate through the transmission part; the rotating wheel is arranged in the annular groove and supported by the step.
15. A plasma processing apparatus, comprising: the wafer processing device comprises a cavity, a base and a manipulator, wherein the base is arranged in the cavity and used for supporting a wafer to be processed, and the manipulator can extend into the cavity and take out the wafer;
the detection device as claimed in any of claims 1 to 14, further comprising a detection device for detecting the consumption of the consumable ring and determining whether replacement is required based on the consumption of the consumable ring.
16. A method of operating a test device according to any of claims 1-14, comprising:
the plasma processing equipment finishes the process;
the mechanical arm carries the detection module to enter the cavity;
the color sensor module detects the color of the consumption ring and obtains detection data, and the detection module receives and calculates the detection data of the color sensor module and sends the calculation result to the terminal.
17. An operation method of the detection apparatus according to claim 16, wherein the operation method specifically includes:
and comparing the detection data with a prestored color numerical value corresponding to the second material, and judging whether the detection data is matched with the color numerical value of the second material.
18. An operation method of the detection apparatus according to claim 16, wherein the operation method specifically includes:
obtaining detection data of two adjacent detections, wherein the detection data of the two detections are respectively first data and second data;
and comparing the second data with the first data, and judging whether the second data is equal to the first data.
CN202110711147.1A 2021-06-25 2021-06-25 Detection device for plasma processing equipment and plasma processing equipment Pending CN115527825A (en)

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Application Number Priority Date Filing Date Title
CN202110711147.1A CN115527825A (en) 2021-06-25 2021-06-25 Detection device for plasma processing equipment and plasma processing equipment
TW111116443A TWI817478B (en) 2021-06-25 2022-04-29 Detection device for plasma processing equipment and plasma processing equipment, operation method, and calculation method

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Application Number Priority Date Filing Date Title
CN202110711147.1A CN115527825A (en) 2021-06-25 2021-06-25 Detection device for plasma processing equipment and plasma processing equipment

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