TW202314985A - 用於高速應用封裝的感測線 - Google Patents

用於高速應用封裝的感測線 Download PDF

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Publication number
TW202314985A
TW202314985A TW111122547A TW111122547A TW202314985A TW 202314985 A TW202314985 A TW 202314985A TW 111122547 A TW111122547 A TW 111122547A TW 111122547 A TW111122547 A TW 111122547A TW 202314985 A TW202314985 A TW 202314985A
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TW
Taiwan
Prior art keywords
substrate
resin sheath
conductive paste
ground shield
package
Prior art date
Application number
TW111122547A
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English (en)
Chinese (zh)
Inventor
元 李
安尼奇 佩托
弘博 魏
阿布杜勒雷札 蘭加里
張莉莎
Original Assignee
美商高通公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商高通公司 filed Critical 美商高通公司
Publication of TW202314985A publication Critical patent/TW202314985A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/427—Power or ground buses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW111122547A 2021-07-27 2022-06-17 用於高速應用封裝的感測線 TW202314985A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/386,278 US20230036650A1 (en) 2021-07-27 2021-07-27 Sense lines for high-speed application packages
US17/386,278 2021-07-27

Publications (1)

Publication Number Publication Date
TW202314985A true TW202314985A (zh) 2023-04-01

Family

ID=82608159

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111122547A TW202314985A (zh) 2021-07-27 2022-06-17 用於高速應用封裝的感測線

Country Status (7)

Country Link
US (1) US20230036650A1 (enExample)
EP (1) EP4377994A1 (enExample)
JP (1) JP2024528851A (enExample)
KR (1) KR20240034194A (enExample)
CN (1) CN117652019A (enExample)
TW (1) TW202314985A (enExample)
WO (1) WO2023009918A1 (enExample)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9385077B2 (en) * 2014-07-11 2016-07-05 Qualcomm Incorporated Integrated device comprising coaxial interconnect
US9807867B2 (en) * 2016-02-04 2017-10-31 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnect structure and method of manufacturing the same
US10070525B2 (en) * 2016-12-28 2018-09-04 Intel Corporation Internal to internal coaxial via transition structures in package substrates
KR102145219B1 (ko) * 2018-07-27 2020-08-18 삼성전자주식회사 반도체 패키지 및 이를 포함하는 안테나 모듈
KR102150250B1 (ko) * 2018-08-22 2020-09-01 삼성전자주식회사 반도체 패키지 및 이를 포함하는 안테나 모듈
US10658331B2 (en) * 2018-08-28 2020-05-19 Ferric Inc. Processor module with integrated packaged power converter
US11869842B2 (en) * 2019-07-24 2024-01-09 Intel Corporation Scalable high speed high bandwidth IO signaling package architecture and method of making
US11450581B2 (en) * 2020-08-26 2022-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method

Also Published As

Publication number Publication date
CN117652019A (zh) 2024-03-05
KR20240034194A (ko) 2024-03-13
JP2024528851A (ja) 2024-08-01
EP4377994A1 (en) 2024-06-05
US20230036650A1 (en) 2023-02-02
WO2023009918A1 (en) 2023-02-02

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