TW202314671A - Light emitting panel - Google Patents

Abstract

A light emitting panel includes a pixel array substrate, a plurality of light emitting components, a black matrix layer and a transparent pattern layer. The pixel array substrate has a plurality of subpixel region and a plurality of transparent region. The light emitting components, the black matrix layer, the transparent pattern layer are disposed on the pixel array substrate. The light emitting components are located on the subpixel regions respectively. The black matrix layer is not distributed within the transparent region. The transparent pattern layer is distributed within the transparent region respectively. The black matrix layer, the transparent pattern layer and the pixel array substrate form a plurality of recesses. The recesses are located above the subpixel region. The light emitting components are located in the recesses respectively. The black matrix layer and the transparent pattern layer jointly surround the light emitting component in at least one of recesses.

Description

Luminous panel

The present invention relates to a light-emitting panel, and in particular to a light-emitting panel including a black matrix layer.

Most of the existing display panels are opaque, and the application of such opaque display panels is inevitably limited. For example, in terms of automotive displays, the opaque display panel will block the driver's line of sight, so the opaque display panel should not be directly installed on the windshield as a Head-Up Display (HUD). Similarly, the opaque display panel is not suitable for being directly installed on the visor of the safety helmet or on the glasses, so it is not suitable for some wearable devices.

At least one embodiment of the present invention provides a light-emitting panel, which utilizes a light-transmitting region and a light-transmitting pattern layer distributed in the light-transmitting region, so as to increase the application range of the light-emitting panel disclosed in at least one embodiment of the present invention.

The light-emitting panel proposed by at least one embodiment of the present invention includes a pixel array substrate, a plurality of light-emitting elements, a black matrix layer, and a light-transmitting pattern layer. The pixel array substrate has a plurality of sub-pixel regions and a plurality of light-transmitting regions, wherein one sub-pixel region is located between at least two adjacent light-transmitting regions. The light emitting elements are arranged on the pixel array substrate and electrically connected to the pixel array substrate, wherein the light emitting elements are respectively located on the sub-pixel regions. The black matrix layer is arranged on the pixel array substrate and not distributed in these light-transmitting regions. The light-transmitting pattern layer is arranged on the pixel array substrate and distributed in the light-transmitting regions, wherein the black matrix layer, the light-transmitting pattern layer and the pixel array substrate form a plurality of grooves. The grooves are respectively located on the sub-pixel regions. The light emitting elements are located in the grooves respectively. The black matrix layer and the light-transmitting pattern layer jointly surround the light-emitting element located in at least one groove.

In at least one embodiment of the present invention, the light-emitting panel further includes a plurality of filling materials. The filling materials are respectively filled into the grooves, wherein each light-emitting element has a light-emitting top surface, and the filling materials do not cover the light-emitting top surfaces of the light-emitting elements.

In at least one embodiment of the present invention, at least one of the filling materials is black glue.

In at least one embodiment of the present invention, at least one of the filling materials includes a light-reflecting material and a light-absorbing layer. The reflective material is filled in the groove. The light-absorbing layer is arranged on the light-reflecting material and covers the light-reflecting material, wherein the light-absorbing layer surrounds one of the light-emitting elements in the groove.

In at least one embodiment of the present invention, each light-emitting element has a light-emitting layer, and the height of the light-emitting layer relative to the pixel array substrate is smaller than the height of the upper surface of the reflective material relative to the pixel array substrate.

In at least one embodiment of the present invention, at least one of the filling materials includes a light-transmitting material and a light-absorbing layer. The light-transmitting material is filled in the groove. The light-absorbing layer is arranged on the light-transmitting material and covers the light-transmitting material, wherein the light-absorbing layer surrounds one of the light-emitting elements in the groove.

In at least one embodiment of the present invention, each light-emitting element has a light-emitting layer, and the height of the light-emitting layer relative to the pixel array substrate is smaller than the height of the upper surface of the light-transmitting material relative to the pixel array substrate.

In at least one embodiment of the present invention, the black matrix layer protrudes from the upper surface of the transparent pattern layer, and the height difference between the upper surface of the black matrix layer and the upper surface of the transparent pattern layer is less than or equal to 1.5 microns.

In at least one embodiment of the present invention, the pixel array substrate includes a substrate and a plurality of metal pattern layers. These metal pattern layers are disposed on the substrate and do not overlap with the transparent pattern layer, wherein in the same sub-pixel area, the vertical projection of the metal pattern layers on the substrate completely covers the vertical projection of the light emitting element on the substrate.

In at least one embodiment of the present invention, the pixel array substrate includes a substrate and a plurality of metal pattern layers. These metal pattern layers are arranged on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel area, at least a part of the vertical projection of the light-emitting element on the substrate is not perpendicular to the vertical projection of these metal pattern layers on the substrate. Drop shadows.

In at least one embodiment of the present invention, the pixel array substrate includes a substrate and a plurality of metal pattern layers. These metal pattern layers are arranged on the substrate and do not overlap with the light-transmitting pattern layer. In the same sub-pixel area, the vertical projected area of these metal pattern layers on the substrate is greater than or equal to the vertical area of the groove on the substrate. half of the projected area.

In at least one embodiment of the present invention, the pixel array substrate includes a substrate and a plurality of wires. These traces are arranged on the substrate, wherein the black matrix layer extends along these traces and covers these traces.

In at least one embodiment of the present invention, the above-mentioned light-transmitting pattern layer includes a plurality of light-transmitting layers, and the black matrix layer surrounds one of the light-transmitting layers along some of these lines, wherein at least one of the light-transmitting layers has a shape of L shape.

In at least one embodiment of the present invention, the light-transmitting pattern layer includes a plurality of light-transmitting layers, and the black matrix layer surrounds each light-transmitting layer along four traces, wherein the shape of each light-transmitting layer is asymmetrical.

Based on the above, by using the light-transmitting pattern layer and these light-transmitting regions, external light can penetrate the light-emitting panel disclosed in the above embodiments. Compared with conventional opaque display panels, the luminous panel disclosed in at least one embodiment of the present invention can have a wider range of applications. For example, the light-emitting panel of the above embodiments is suitable for making a head-up display (HUD) for a car, or suitable for being applied to a wearable device.

In the following text, in order to clearly present the technical features of this application, the dimensions (such as length, width, thickness, and depth) of elements (such as layers, films, substrates, and regions) in the drawings will be enlarged in a non-proportional manner . Therefore, the description and explanation of the following embodiments are not limited to the quantity, size and shape of the components in the drawings, but should cover the deviations in size, shape and both caused by actual manufacturing process and/or tolerance. For example, a planar surface shown in the drawings may have rough and/or non-linear features, while acute angles shown in the drawings may be rounded. Therefore, the components shown in the drawings of this case are mainly for illustration, and are not intended to accurately depict the actual shape of the components, nor are they used to limit the scope of the patent application of this case.

Secondly, words such as "about", "approximately" or "substantially" appearing in the content of this case not only cover the clearly stated values and numerical ranges, but also cover The allowable deviation range, wherein the deviation range can be determined by the error generated during the measurement, and the error is caused by the limitation of the measurement system or process conditions, for example. For example, two objects (such as a plane or trace of a substrate) are "substantially parallel" or "substantially perpendicular", where "substantially parallel" and "substantially perpendicular" represent the parallel and perpendicular between the two objects, respectively. May include non-parallel and non-perpendicular due to tolerance range.

Additionally, "about" can mean within one or more standard deviations of the above numerical values, eg, within ±30%, ±20%, ±10%, or ±5%. Words such as "about", "approximately" or "substantially" appearing in this text can choose the acceptable deviation range or standard deviation according to optical properties, etching properties, mechanical properties or other properties, not a single The standard deviation is used to apply all properties such as the above optical properties, etching properties, mechanical properties and other properties.

FIG. 1A is a schematic top view of a light-emitting panel according to at least one embodiment of the present invention. Please refer to FIG. 1A , the light-emitting panel 100 includes a pixel array substrate 110 and a black matrix layer 121 , wherein the black matrix layer 121 is disposed on the pixel array substrate 110 and located on one side of the pixel array substrate 110 . Taking FIG. 1A as an example, the black matrix layer 121 is located on the upper surface of the pixel array substrate 110 . The shape of the black matrix layer 121 can be mesh, and the black matrix layer 121 covers part of the upper surface of the pixel array substrate 110 , but does not completely cover the upper surface of the pixel array substrate 110 . The black matrix layer 121 has a black dye (such as carbon black) and is black, so the black matrix layer 121 can basically completely absorb visible light.

The pixel array substrate 110 has a plurality of sub-pixel regions 111s and a plurality of transparent regions 111t, wherein the black matrix layer 121 is not distributed in the transparent regions 111t. In other words, the light-transmitting regions 111t are formed in regions of the pixel array substrate 110 not covered by the black matrix layer 121 . These sub-pixel regions 111s can be arranged in a regular manner. Taking FIG. 1A as an example, a plurality (for example, three) sub-pixel regions 111s can be aggregated into a group GR1, and these groups GR1 can be arranged in an array, so that the sub-pixel regions 111s are arranged regularly. In addition, in this embodiment, each group GR1 can be the main pixel area of the pixel array substrate 110 .

One of the sub-pixel regions 111s may be located between at least two adjacent light-transmitting regions 111t. Taking FIG. 1A as an example, each sub-pixel region 111s may be located between and surrounded by four adjacent light-transmitting regions 111t, wherein the four adjacent light-transmitting regions 111t The area 111t can further surround three sub-pixel areas 111s, as shown in FIG. 1A.

FIG. 1B is a partially enlarged schematic view of the light emitting panel in FIG. 1A . 1A and 1B, the light emitting panel 100 also includes a plurality of light emitting elements 130, wherein these light emitting elements 130 are arranged on the pixel array substrate 110, and are respectively located on these sub-pixel regions 111s, and each light emitting element 130 can Light ray L1 is emitted.

The light emitting element 130 may be a light emitting diode (Light Emitting Diode, LED), such as a submillimeter light emitting diode (mini LED) or a micro light emitting diode (micro LED, μLED). The thickness of the miniature light-emitting diodes is less than 10 microns, such as 6 microns. Submillimeter LEDs can be divided into two types: one with encapsulant and the other without encapsulant. The thickness of the sub-millimeter light-emitting diode containing encapsulant can be less than 800 microns, and the thickness of the sub-millimeter light-emitting diode without encapsulant can be less than 100 microns. In addition, the light-emitting element 130 can also be a large-sized regular LED other than sub-millimeter light-emitting diodes and micro-light-emitting diodes, so the light-emitting element 130 is not limited to be a sub-millimeter light-emitting diode with a smaller size. body or miniature light-emitting diodes.

FIG. 1C is a schematic cross-sectional view taken along line 1C-1C in FIG. 1B . Referring to FIG. 1B and FIG. 1C , the light-emitting panel 100 further includes a light-transmitting pattern layer 122 , wherein the light-transmitting pattern layer 122 is disposed on the pixel array substrate 110 and distributed in the light-transmitting regions 111t. Therefore, the transparent pattern layer 122 is distributed in the area of the pixel array substrate 110 other than the black matrix layer 121 . The light-transmitting pattern layer 122 may include a plurality of light-transmitting layers 122p, wherein the light-transmitting layers 122p are distributed in the light-transmitting regions 111t, and the black matrix layer 121 surrounds each light-transmitting layer 122p, as shown in FIGS. 1A and 1B . The transparent pattern layer 122 can be an organic material layer or an inorganic material layer, and can be formed by inkjet, printing or photolithography.

In the embodiment shown in FIG. 1B , the light-transmitting layers 122p can completely cover the light-transmitting regions 111t , that is, the area occupied by the light-transmitting layers 122p on the pixel array substrate 110 is basically the light-transmitting regions 111t . Therefore, the light-transmitting regions 111t marked in FIG. 1B can be regarded as the light-transmitting layers 122p. In addition, from FIG. 1B , that is, in the top view of the light-emitting panel 100 , the shape of each light-transmitting layer 122p is an asymmetric shape. That is to say, the shape of the light-transmitting layer 122p is neither a line-symmetric shape nor a point-symmetric shape.

The black matrix layer 121 , the transparent pattern layer 122 and the pixel array substrate 110 can form a plurality of grooves R1 , and the light emitting elements 130 are respectively located in the grooves R1 . Wherein the pixel array substrate 110 forms the bottom of these grooves R1, and the black matrix layer 121 and the light-transmitting pattern layer 122 jointly form the sidewall of at least one groove R1, so that the black matrix layer 121 and the light-transmitting pattern layer 122 can jointly surround The light emitting element 130 is located in at least one groove R1.

Taking FIG. 1B and FIG. 1C as an example, the black matrix layer 121 and the light-transmitting pattern layer 122 can jointly form the sidewalls of each groove R1, and the black matrix layer 121 and the light-transmitting pattern layer 122 can jointly surround the light emission in each groove R1. Element 130. The grooves R1 are respectively located on the sub-pixel regions 111s, but not located on the light-transmitting region 111t. Therefore, the grooves R1 are only distributed in the sub-pixel regions 111s, and not distributed in any light-transmitting region 111t.

The pixel array substrate 110 includes a substrate 119, a plurality of metal pattern layers 112a, 112b, 112c, and 112d, and a plurality of insulating layers 113a, 113b, 113c, 113d, 113e, 115a, 115b, and 115c, wherein the metal pattern layers 112a to 112d , These insulating layers 113 a to 113 e and 115 a to 115 c are all stacked and disposed on the substrate 119 . At least one of the metal pattern layers 112a, 112b, 112c, and 112d may be composed of one or more metal layers.

At least one of the metal pattern layers 112a, 112b and 112c may have three metal layers. One metal layer may be an aluminum metal layer, and the other two metal layers may be titanium metal layers, wherein the aluminum metal layer is sandwiched between the two titanium metal layers. Alternatively, at least one of the metal pattern layers 112 a , 112 b and 112 c may have two metal layers: an aluminum metal layer and a titanium metal layer, wherein the aluminum metal layer is closer to the light emitting element 130 .

In the metal pattern layer 112 d , the metal layers of the pads P41 may include a nickel-gold layer, an aluminum metal layer, and a titanium metal layer, wherein the nickel-gold layer is closest to the light emitting element 130 . Except for the pads P41 , the film composition of other parts of the metal pattern layer 112d can also be the same as that of the metal pattern layer 112a, 112b or 112c.

In addition, before forming the nickel-gold layer, the pad P41 may also have an aluminum metal layer and two metal layers, wherein the aluminum metal layer is interposed between the two titanium metal layers. In the process of forming the nickel-gold layer, the uppermost titanium metal layer may be removed first. Afterwards, a nickel-gold layer is deposited on the aluminum metal layer by chemical means, such as electroless plating.

The substrate 119 and the insulating layers 113a, 113b, 113c, 113d, 113e, 115a, 115b, and 115c may be transparent, wherein the substrate 119 is, for example, a glass plate or a transparent polymer material substrate. The aforementioned transparent polymer material substrate is made of, for example, polyethylene terephthalate (PET) or polyimide (Polyimide, PI). Alternatively, the transparent polymer material substrate can also be made of other polymer materials.

Each of the metal pattern layers 112a, 112b, 112c and 112d may be located between adjacent two of the insulating layers 113a, 113b, 113c, 113d, 113e, 115a, 115b and 115c. Taking FIG. 1C as an example, the metal pattern layer 112a is located between the insulating layers 113a and 113b, and the metal pattern layer 112b is located between the insulating layers 113b and 115a. The metal pattern layer 112c is located between the insulating layers 115a and 115b, and the metal pattern layer 112d is located between the insulating layers 113c and 113d.

The metal pattern layer 112a is disposed on the substrate 119, and the metal pattern layers 112b and 112c are positioned between the metal pattern layers 112a and 112d, wherein the metal pattern layer 112c is positioned between the metal pattern layers 112b and 112d, and the metal pattern layer 112b is positioned between the metal pattern layers 112b and 112d. between layers 112a and 112c. In addition, the pixel array substrate 110 may further include a plurality of semiconductor layers TC1 , wherein the semiconductor layers TC1 are located on the substrate 119 , and the insulating layer 113 a covers the semiconductor layers TC1 and the substrate 119 .

The metal pattern layer 112a is located on the insulating layer 113a, and the insulating layer 113b covers the metal pattern layer 112a. The metal pattern layer 112b is located on the insulating layer 113b, and the insulating layer 115a covers the metal pattern layer 112b. The metal pattern layer 112c is located on the insulating layer 115a, and the insulating layer 115b covers the metal pattern layer 112c.

The metal pattern layer 112d and the insulating layer 113c are located on the insulating layer 115b, and the insulating layer 113d covers the metal pattern layer 112d and the insulating layer 113c, so that the insulating layer 113c is interposed between the insulating layers 115b and 113d. The insulating layers 115c and 113e are located on the insulating layer 113d, wherein the insulating layer 115c is interposed between the insulating layers 113e and 113d, and the transparent layers 122p are located on the insulating layer 113e.

In this embodiment, the insulating layers 115a, 115b and 115c can be organic material layers, and the insulating layers 113a, 113b, 113c, 113d and 113e can be inorganic material layers, which are made of silicon oxide, silicon nitride or other inorganic materials, for example. made of materials. These insulating layers 113a, 113b, 113c, 113d, and 113e have the function of blocking water vapor, so as to prevent or prevent water vapor from penetrating into the light-emitting panel 100, thereby preventing the light-emitting element 130 and the pixel array substrate 110 from being damaged by water vapor.

The pixel array substrate 110 may also include a plurality of contact windows 114b and 114c, wherein the contact windows 114b and 114c are connected to the metal pattern layers 112b, 112c and 112d, so that the metal pattern layers 112b, 112c and 112d can be electrically connected to each other . Specifically, each of the contact windows 114b and 114c is substantially a conductive column, and connects two adjacent layers of the metal pattern layers 112b, 112c, and 112d.

Taking FIG. 1C as an example, the contact holes 114b penetrate the insulating layer 115a and connect the metal pattern layers 112b and 112c, so that the metal pattern layers 112b and 112c can be electrically connected to each other. The contact windows 114c penetrate through the insulating layers 113c and 115b, and connect the metal pattern layers 112c and 112d, so that the metal pattern layers 112c and 112d can be electrically connected to each other. In this way, through the contact windows 114b and 114c, the metal pattern layers 112b, 112c and 112d can be electrically connected to each other.

In the embodiment shown in FIG. 1C , the pixel array substrate 110 may be an active device array substrate, and has a plurality of active devices TT1 , which may be a plurality of thin film transistors (Thin Film Transistor, TFT). Specifically, the pixel array substrate 110 may further include a plurality of semiconductor layers TC1, wherein the semiconductor layers TC1 are disposed on the substrate 119 and covered by the insulating layer 113a. The metal pattern layer 112a may include a plurality of gates TG1, wherein these gates TG1 are disposed on the insulating layer 113a, and respectively overlap with these semiconductor layers TC1, so that the mutually overlapping gates TG1 and the semiconductor layer TC1 are sandwiched between the gates. Part of the insulating layer 113a between the pole TG1 and the semiconductor layer TC1 can form a capacitor.

The pixel array substrate 110 may further include a plurality of contact windows 114d and 114s, wherein the contact windows 114d and 114s both penetrate the insulating layers 113a and 113b, and connect the semiconductor layer TC1 and the metal pattern layer 112b. The contact windows 114d and 114s are not directly electrically connected to the gate TG1 to avoid a short circuit. Each semiconductor layer TC1 is connected to a contact window 114d and a contact window 114s, as shown in FIG. 1C . In this way, the semiconductor layer TC1, the contact windows 114d and 114s, the gate TG1 and part of the insulating layer 113a can form an active device TT1, which can be a thin film transistor, wherein the contact windows 114d and 114s can be used as the drain and source of the active device TT1 respectively pole.

Using the contact windows 114d and 114s, the semiconductor layer TC1 can be electrically connected to a plurality of pads (not shown) of the metal pattern layer 112b. Since the metal pattern layers 112b, 112c and 112d can be electrically connected to each other through the contact windows 114b and 114c, these semiconductor layers TC1 can be electrically connected to the metal pattern layers 112c and 112d through the contact windows 114d, 114s and the metal pattern layer 112b.

It should be noted that the metal pattern layers 112a, 112b, 112c and 112d, the insulating layers 113a, 113b, 113c, 113d, 113e, 115a, 115b and 115c and the contact windows 114b, 114c, 114d and 114s depicted in FIG. It is used for illustration, and is not intended to limit the number of metal pattern layers, insulating layers and contact windows included in the pixel array substrate 110 . For example, in other embodiments, the insulating layer 113e may be omitted. Alternatively, the insulating layer 115a and the metal pattern layer 112c can be omitted, so that the insulating layer 115b can directly cover the metal pattern layer 112b.

The metal pattern layer 112d may include a plurality of traces T41 and a plurality of pads P41 , and the metal pattern layer 112a may include a plurality of traces T11 (only shown in FIG. 1B ). The traces T41 and T11 and the pads P41 are disposed on the substrate 119 , wherein the traces T41 and the pads P41 are located above the traces T11 , so the traces T41 and T11 are not coplanar with each other.

The directions of the traces T11 and T41 are different from each other. Taking FIG. 1B as an example, the traces T11 all extend along the first direction D1, and the traces T41 all extend along the second direction D2, wherein the first direction D1 is different from the second direction D2. For example, in FIG. 1B , the first direction D1 may be a horizontal direction, and the second direction D2 may be a vertical direction, so the first direction D1 and the second direction D2 may be substantially perpendicular to each other.

The traces T11 are connected to the gates TG1, and the traces T41 are electrically connected to the contact window 114s through the contact windows 114c, 114b and the metal pattern layers 112c, 112b, wherein the contact window 114s is equivalent to the source of the active device TT1. The light emitting elements 130 are electrically connected to the pads P41 respectively. For example, the light-emitting elements 130 can be electrically connected to the pads P41 through the connector SB1 , such that the light-emitting elements 130 can be electrically connected to the pixel array substrate 110 , wherein the connector SB1 is, for example, solder or indium grains.

In the embodiment of FIG. 1C , the anode (anode, not shown) of the light emitting element 130 is electrically connected to the contact window 114d through the connector SB1 , the pad P41 , the contact windows 114c, 114b and the metal pattern layers 112c and 112b. The contact window 114d is equivalent to the drain of the active device TT1, so the anode of the light emitting device 130 is electrically connected to the drain of the active device TT1.

Since the trace T11 is connected to the gate TG1, and the trace T41 is electrically connected to the contact window 114s (that is, the source of the active element TT1), the switching signal transmitted by these traces T11 can turn on or off the active element TT1, so that the trace The electrical signal transmitted by the line T41 can be input to the light-emitting element 130 through the turned-on active element TT1, so that the light-emitting element 130 emits light. In this way, the wires T11 , T41 and the active elements TT1 can control the light emitting elements 130 to emit light.

In this embodiment, the light emitting elements 130 can emit different colors of light, such as red light, green light and blue light. Taking FIG. 1B as an example, the three light emitting elements 130 located in three adjacent sub-pixel regions 111s may be red light emitting diodes, green light emitting diodes and blue light emitting diodes respectively. In this way, the wires T11 , T41 and the active elements TT1 can control the light emitting elements 130 to emit different colors of light (such as red light, green light and blue light), so that the light emitting panel 100 can generate images. In addition, the above three sub-pixel regions 111s adjacent to each other can form a group GR1, and each group GR1 can be a main pixel.

In addition, the shape of each pad P41 may be a strip shape. Taking FIG. 1B as an example, the two pads P41 located in each sub-pixel region 111s may extend along the second direction D2 and be arranged along the first direction D1. After these light emitting elements 130 are disposed on the pixel array substrate 110, the light emitting elements 130 may extend along the first direction D1, so that the light emitting elements 130 located in a single sub-pixel region 111s will not cover all the pads P41, The part of the pad P41 not covered by the light emitting element 130 can form the reserved area RA1.

One reserved area RA1 may accommodate at least one light emitting element 130 arrangement. When a light-emitting element 130 in the sub-pixel area 111s fails to emit light L1 , a normal light-emitting element 130 can be placed in the reserved area RA1 adjacent to the failed light-emitting element 130 to replace the failed light-emitting element 130 . In this way, the sub-pixel region 111s where the originally faulty light-emitting element 130 is located can still emit light L1, so as to reduce or avoid the adverse effect of the faulty light-emitting element 130 on the image quality of the light-emitting panel 100 .

It should be noted that, in this embodiment, the metal pattern layer 112d includes a plurality of traces T41, and the metal pattern layer 112a includes a plurality of traces T11. However, in other embodiments, other metal pattern layers may also include the traces T41 and T11. For example, the metal pattern layer 112c may include these traces T41, wherein the traces T41 may electrically connect the contact window 114s through the contact window 114b and the metal pattern layer 112b. Therefore, FIG. 1B and FIG. 1C are for illustration only, and do not limit the metal pattern layer 112d to include the trace T41, and the metal pattern layer 112a to include the trace T11.

Both the black matrix layer 121 and the transparent pattern layer 122 are located on the insulating layer 113e, wherein the black matrix layer 121 extends along the traces T11 and T41 and covers the traces T11 and T41. In this way, the black matrix layer 121 can reduce or prevent the traces T11 and T41 from reflecting external light, so as to improve the image quality of the light-emitting panel 100 . In addition, in the embodiment shown in FIG. 1B , the black matrix layer 121 can surround each light-transmitting layer 122p along four of the traces, namely two traces T11 and two traces T41 .

The metal pattern layers 112 a , 112 b , 112 c and 112 d and the semiconductor layer TC1 do not overlap with the transparent pattern layer 122 . In other words, the metal pattern layers 112a, 112b, 112c, and 112d and the semiconductor layers TC1 are not distributed in any light-transmitting region 111t. In this way, external light can pass through the light-transmitting pattern layer 122 and the light-transmitting region 111t without being blocked by the metal pattern layers 112a, 112b, 112c, and 112d and the semiconductor layer TC1, so that the light-emitting panel 100 is suitable for making a transparent display. In addition, since the shape of each light-transmitting layer 122p is an asymmetric shape (as shown in FIG. 1B ), the light-transmitting pattern layer 122 can reduce the diffraction effect on light, so as to reduce or prevent the defects caused by optical diffraction on the image. Influence.

The light emitting panel 100 further includes a plurality of filling materials 140, wherein the filling materials 140 are respectively filled in the grooves R1. The filling material 140 may be a black rubber material with a black dye, such as carbon black. Therefore, the color of the filling material 140 is black, and the filling material 140 can absorb visible light substantially completely. In other words, the filling material 140 can absorb external light and reduce the reflection of external light, so as to improve the image quality of the light-emitting panel 100 . In addition, the filling material 140 may be formed in the groove R1 by printing, such as inkjet.

Each light-emitting element 130 has a light-emitting top surface 131 and a light-emitting layer 132 , wherein the light-emitting layer 132 can generate light L1 , and the light L1 can exit from the light-emitting top surface 131 . The filling materials 140 do not cover the light emitting top surfaces 131 of the light emitting elements 130 . Taking FIG. 1C as an example, each light emitting element 130 may protrude from the upper surface of the filling material 140 . Therefore, the filling material 140 basically does not block the light L1 emitted from the light-emitting top surface 131 , so as to avoid adverse effects on the image quality of the light-emitting panel 100 .

Since the light emitting elements 130 can emit light of different colors, such as red light, green light and blue light, the light emitting layers 132 of the light emitting elements 130 can generate light L1 of different colors. From FIG. 1C, the height of the light-emitting layer 132 relative to the pixel array substrate 110 is smaller than the height of the upper surface of the filling material 140 relative to the pixel array substrate 110, so the filling material 140 can cover the sides of the light-emitting layer 132, as shown in FIG. 1C.

The upper surfaces of the black matrix layer 121 and the transparent pattern layer 122 may not be aligned with each other. For example, the black matrix layer 121 may protrude from the upper surface of the light-transmitting pattern layer 122 . The height difference G1 between the upper surface of the black matrix layer 121 and the upper surface of the transparent pattern layer 122 (ie, the transparent layer 122 p ) may be less than or equal to 1.5 micrometers. When the height difference G1 is greater than 1.5 μm, the filling material 140 may overflow or the filling material 140 may not be thick enough during the process of forming the filling material 140 . Therefore, the height difference G1 of less than or equal to 1.5 microns can reduce the above risks, thereby helping to improve the yield of the light emitting panel 100 . In addition, in other embodiments, the height difference G1 may be equal to or close to 0, that is, the upper surfaces of the black matrix layer 121 and the transparent pattern layer 122 may be substantially aligned with each other.

The light-emitting panel 100 may further include a transparent layer 151 , wherein the transparent layer 151 is disposed on the pixel array substrate 110 and completely covers the upper surface of the pixel array substrate 110 . Therefore, the transparent layer 151 can cover the light-emitting elements 130 , the filling materials 140 , the black matrix layer 121 and the light-transmitting pattern layer 122 , as shown in FIG. 1C , to protect the light-emitting elements 130 .

The light emitting panel 100 may further include at least one anti-reflection layer 152 . Taking FIG. 1C as an example, the light-emitting panel 100 includes two layers of anti-reflection layers 152 , wherein the two layers of anti-reflection layers 152 are respectively located on opposite sides of the pixel array substrate 110 . In other words, the pixel array substrate 110 is located between the two anti-reflection layers 152 . One of the antireflection layers 152 can be disposed on the transparent layer 151 and the light emitting elements 130 , and the other antireflection layer 152 can be disposed on the lower surface of the substrate 119 .

The anti-reflection layer 152 can allow light L1 and external light to penetrate, and can reduce the reflection of light L1 and external light. The anti-reflection layer 152 below can allow most of the external light that penetrates the light-transmitting pattern layer 122 to emit light The panel 100 emits light to reduce the reflection of the light from the light-transmitting area 111t to the outside light, thereby improving the image quality of the light-emitting panel 100 .

In the same sub-pixel region 111s, for example, in each sub-pixel region 111s, the vertical projected area MP1 of these metal pattern layers 112a, 112b, 112c and 112d and these semiconductor layers TC1 on the substrate 119 may be greater than or equal to the concave The vertical projected area of the groove R1 on the substrate 119 (corresponding to the sub-pixel region 111s shown in FIG. The projection can completely cover the vertical projection of the light emitting element 130 on the substrate 119 . In other words, the metal pattern layers 112 a , 112 b , 112 c and 112 d can cover the entire bottom surface (not shown) of the light emitting element 130 , as shown in FIG. 1C .

FIG. 1D is a partially enlarged schematic view of FIG. 1C . Referring to FIG. 1C and FIG. 1D , the black matrix layer 121 may protrude or be aligned with the edge of the outermost metal pattern layer 112 d (including the trace T41 ) of the pixel array substrate 110 . Taking the trace T41 shown in FIG. 1D as an example, the black matrix layer 121 protrudes from the edge E12 of the trace T41 and has a plurality of protruding lengths 121g. Each protruding length 121g is the length of the vertical projection of the distance between the adjacent black matrix layer 121 edge and the metal pattern layer 112d edge (for example, edge E12) on the substrate 119, wherein each protruding length 121g will be perpendicular to The normal direction 119n of the substrate 119 . In addition, in order to increase the aperture ratio of the light-emitting panel 100 , the protrusion length 121g may be greater than 0 micrometers and less than or equal to 10 micrometers within an allowable tolerance range.

FIG. 2 is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. Please refer to FIG. 2 , the light emitting panel 200 of this embodiment is similar to the above light emitting panel 100 , and both the light emitting panels 200 and 100 also include some same elements, such as the pixel array substrate 110 and the plurality of light emitting elements 130 . The differences between the light emitting panels 200 and 100 are mainly described below. In principle, the same features of the light emitting panels 200 and 100 will not be described repeatedly.

The light emitting panel 200 includes at least one filling material 240 . Taking FIG. 2 as an example, the light emitting panel 200 may include a plurality of filling materials 240, wherein the filling materials 240 are respectively filled in the grooves R1. Different from the aforementioned filling material 140 , each filling material 240 may include a light-transmitting material 241 and a light-absorbing layer 242 . The light-transmitting material 241 is filled in the groove R1 , and the light-absorbing layer 242 is disposed on the light-transmitting material 241 and covers the light-transmitting material 241 .

The methods for forming the filling material 240 and the aforementioned filling material 140 may be the same. For example, the light-transmitting material 241 and the light-absorbing layer 242 may be formed by printing (eg, inkjet). Both the light absorbing layer 242 and the aforementioned filling material 140 may be black glue material with black dye, such as carbon black. Therefore, the color of the light absorbing layer 242 is black, and the light absorbing layer 242 can basically completely absorb visible light. Therefore, the light absorbing layer 242 can reduce the reflection of external light, so as to improve the image quality of the light emitting panel 200 .

In addition, the light absorbing layer 242 surrounds the light emitting element 130 in the groove R1 and does not cover the light emitting top surface 131 . For example, each light emitting element 130 may protrude from the upper surface of the light absorbing layer 242 . In this way, the light-absorbing layer 242 basically does not block the light L1 emitted from the light-emitting top surface 131 , so as to avoid adverse effects on the image quality of the light-emitting panel 200 .

From FIG. 2 , the height of the light-emitting layer 132 relative to the pixel array substrate 110 is smaller than the height of the upper surface of the light-transmitting material 241 relative to the pixel array substrate 110 . In other words, the light-transmitting material 241 can cover the sides (not shown) of the light-emitting layer 132 , but the light-absorbing layer 242 does not cover the sides of the light-emitting layer 132 . Secondly, the light L1 can pass through the light-transmitting material 241 and pass through the light-transmitting material 241 .

Therefore, the light L1 generated by the light-emitting layer 132 can enter the light-transmitting material 241 from the side and bottom of the light-emitting element 130 . The light L1 transmitted in the light-transmitting material 241 can be incident on the metal pattern layers 112a, 112b, 112c, and 112d below the groove R1, so that the light L1 can be reflected by the metal pattern layers 112a, 112b, 112c, and 112d to increase luminescence The brightness of the panel 200.

It is worth mentioning that the light-emitting panel 200 includes the pixel array substrate 110, so in the same sub-pixel region 111s, for example, in each sub-pixel region 111s, these metal pattern layers 112a, 112b, 112c and 112d will cover The entire bottom surface of the light emitting element 130 . In this way, the light L1 incident on the light-transmitting material 241 from the side and bottom of the light-emitting element 130 will be blocked and reflected by the metal pattern layers 112a, 112b, 112c, and 112d, so that only one side of the light-emitting panel 200 presents an image.

FIG. 3 is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. Referring to FIG. 3 , the light emitting panel 300 of this embodiment is similar to the light emitting panel 200 mentioned above, but the only difference between the light emitting panels 300 and 200 is that the filling material 340 included in the light emitting panel 300 is different from the filling material 240 . The differences between the light emitting panels 300 and 200 are mainly described below. In principle, the same features of the light-emitting panels 300 and 200 will not be described repeatedly.

The light emitting panel 300 includes at least one filling material 340 . Taking FIG. 3 as an example, the light emitting panel 300 may include a plurality of filling materials 340, wherein the filling materials 340 are respectively filled in the grooves R1. Different from the aforementioned filling material 240 , each filling material 340 may include a reflective material 341 and a light absorbing layer 242 . The reflective material 341 is filled in the groove R1 , and the light absorbing layer 242 is disposed on the reflective material 341 and covers the reflective material 341 . The light absorbing layer 242 also surrounds the light emitting element 130 in the groove R1 and does not cover the light emitting top surface 131 to avoid blocking the light L1 emitted from the light emitting top surface 131 .

The forming methods of the reflective material 341 and the light absorbing layer 242 may be the same, wherein both the reflective material 341 and the light absorbing layer 242 may be formed by printing (such as inkjet). Different from the light-absorbing layer 242, the reflective material 341 can be a white rubber material with a white dye, such as titanium dioxide. Therefore, the reflective material 341 is white in color and can reflect visible light.

In the embodiment shown in FIG. 3 , the height of the light emitting layer 132 relative to the pixel array substrate 110 is smaller than the height of the upper surface of the reflective material 341 relative to the pixel array substrate 110 . In other words, the reflective material 341 can cover the sides of the light-emitting layer 132, but the light-absorbing layer 242 does not cover the sides of the light-emitting layer 132, so that the light L1 generated by the light-emitting layer 132 can enter the light-reflecting material from the side of the light-emitting element 130 341. Since the reflective material 341 can reflect visible light, the reflective material 341 can reflect the light L1 coming from the side of the light emitting element 130 , thereby increasing the brightness of the light emitting panel 300 .

FIG. 4 is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. Please refer to FIG. 4 , the light emitting panel 400 of this embodiment is similar to the aforementioned light emitting panel 300 , and the main difference between the light emitting panels 400 and 300 lies in the pixel array substrate 410 included in the light emitting panel 400 . The differences between the light emitting panels 400 and 300 are mainly described below. In principle, the same features of the light-emitting panels 400 and 300 will not be described repeatedly.

The pixel array substrate 410 of this embodiment is similar to the pixel array substrate 110 of the previous embodiment. For example, the pixel array substrate 410 also includes a plurality of metal pattern layers 112 a , 112 b , 112 c and 112 d and a substrate 119 . However, different from the pixel array substrate 110, the pixel array substrate 410 includes a smaller number of insulating layers. Specifically, the pixel array substrate 410 also includes the insulating layers 113a, 113b, 113c, 113d, 115a and 115b, but does not include the insulating layers 113e and 115c. Therefore, compared with the pixel array substrate 110 , the number of insulating layers included in the pixel array substrate 410 is less.

Since the pixel array substrate 410 does not include the insulating layers 113e and 115c, in this embodiment, the transparent pattern layer 122 and the black matrix layer 121 are both disposed on the insulating layer 113d and can directly contact the insulating layer 113d. Comparing FIG. 3 and FIG. 4 , it can also be seen that the thicknesses of the light-transmitting pattern layer 122 and the black matrix layer 121 in FIG. 4 are respectively greater than the thicknesses of the light-transmitting pattern layer 122 and the black matrix layer 121 in FIG. 3 . In addition, different from the light-emitting panel 300 shown in FIG. 3, the light-emitting panel 400 shown in the embodiment of FIG. Component 130 and filler material 340 .

FIG. 5 is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. Please refer to FIG. 5 , the light emitting panel 500 of this embodiment is similar to the light emitting panel 200 of the previous embodiment. Only the different features of the light emitting panel 500 from the light emitting panel 200 will be described below. In principle, the same features of the light-emitting panels 500 and 200 will not be repeated.

The light emitting panel 500 includes a pixel array substrate 510 . Similar to the pixel array substrate 110, the pixel array substrate 510 includes a plurality of metal pattern layers 512a, 512b, 512c, and 512d and a substrate 119, wherein these metal pattern layers 512a, 512b, 512c, and 512d are respectively the same as the metal pattern layers in the foregoing embodiments. The pattern layers 112a, 112b, 112c are similar to 112d. However, unlike the aforementioned pixel array substrate 110, in the same sub-pixel region 511s of the pixel array substrate 510, for example, in each sub-pixel region 511s, at least a part of the vertical projection of the light-emitting element 130 on the substrate 119 is not consistent with The vertical projections of the metal pattern layers 512 a , 512 b , 512 c and 512 d on the substrate 119 overlap.

Specifically, in the embodiment shown in FIG. 5 , the metal pattern layers 512a, 512b, 512c, and 512d vertically project a plurality of projection areas MP5 on the substrate 119, and each light emitting element 130 is also formed on the substrate 119. The vertical projection of multiple projection areas CP5 (only one is shown in FIG. 5 ), wherein the projection area MP5 partially overlaps with the projection area CP5, and the light-transmitting area LA5 in the projection area CP5 does not overlap with the projection area MP5. In other words, a part of the projection area CP5 (ie, the light-transmitting area LA5 ) does not overlap with the projection area CP5 .

Therefore, these metal pattern layers 512a, 512b, 512c, and 512d do not cover the entire bottom surface of the light-emitting element 130, so that the light L1 entering the light-transmitting material 241 from the bottom surface of the light-emitting element 130 can pass through these metal pattern layers 512a, 512b, 512c and 512d are emitted from the substrate 119 and the anti-reflection layer 152 below. In this way, images can be displayed on opposite sides of the light emitting panel 500 at the same time.

Tables (1) and (2) below are the results obtained by designing various light-emitting panels and measuring the reflectance of these light-emitting panels according to the above embodiments. It should be noted that in Table (1) and Table (2), the light-emitting elements 130 used in these light-emitting panels are two types of miniature light-emitting diodes with different sizes. One is a miniature light-emitting diode with a larger size, with a width and length of 34 microns x 58 microns. The other is a miniature light-emitting diode with a smaller size, width and length of 20 microns x 40 microns.

In addition, the light-emitting panels shown in Table (1) and Table (2) use two different black matrix layers 121, one of which has a higher refractive index, and is shown in Table (1) and Table ( 2) is represented by "BM high refractive index". Another type of black matrix layer 121 has a lower refractive index, and is represented by "BM low refractive index" in Table (1) and Table (2).

The composition of the black matrix layer 121 with a high refractive index (ie, BM high refractive index) contains a material with a relatively high refractive index, which may be inorganic particles, wherein the inorganic particles are made of titanium dioxide, for example. The black matrix layer 121 with a low refractive index (ie BM low refractive index) contains a material with a relatively low refractive index, which may be a gas. For example, the low-refractive-index black matrix layer 121 may contain a plurality of microbubbles, wherein the width (ie particle size) of each microbubble may be below 550 nm, and the gas inside the microbubbles may be air or nitrogen.

group Black matrix layer 121 Filling material 140 Anti-reflection layer 152 Light emitting element 130 34 microns x 58 microns 20 microns x 40 microns BM High Refractive Index BM Low Refractive Index BM High Refractive Index BM Low Refractive Index 0 none none none 22.0% 21.8% 1 have none none 12.3% 12.2% 11.9% 11.8% 2 none have none 20.2% 18.6% 3 none none single layer 19.2% 19.0% 4 none none double layer 16.8% 16.6% 5 have have none 10.5% 10.4% 8.8% 8.6% 6 have none single layer 8.3% 8.1% 7.9% 7.7% 7 have none double layer 5.9% 5.7% 5.5% 5.3% 8 have have single layer 6.5% 6.2% 4.7% 4.4% 9 have have double layer 4.1% 3.8% 2.3% 2.0% Table I)

Group 0 in Table (1) is the control group, and the light-emitting panel of group 0 does not include the black matrix layer 121, the filling material 140 and the anti-reflection layer 152, that is, the light-emitting panel of group 0 basically only includes the light-emitting element 130 and the pixel array substrate 110 . From Table (1), under the condition of no black matrix layer 121, filling material 140 and anti-reflection layer 152, the large-sized light-emitting element 130 (34 microns in width and 58 microns in length) has a reflectivity of 22%. , while the small-sized light-emitting element 130 (with a width of 20 micrometers and a length of 40 micrometers) has a reflectivity of 21.8%.

Groups 1 and 5 to 9 are light emitting panels including a black matrix layer 121 . Compared with the control group of group 0, the light-emitting panels of groups 1 and 5 to 9 obviously have lower reflectance, which can be below 12.5%. For example, in group 1, the light-emitting panel with "BM high refractive index" and large-sized light-emitting elements 130 (34 microns x 58 microns) has a reflectivity of 12.3%.

Other light-emitting panels including at least one of the filling material 140 and the anti-reflection layer 152 but not including any black matrix layer 121 , ie groups 2 to 4, had a minimum reflectance of 16.6% and a maximum reflectance of 20.2%. It can be seen that, compared with the filling material 140 and the anti-reflection layer 152 , the black matrix layer 121 is more effective in greatly reducing the reflectivity.

It is worth mentioning that the size of the light-emitting element 130 of 34 microns x 58 microns is larger than that of the light-emitting element 130 of 20 microns x 40 microns, so in the same group, the reflectivity of the light-emitting element 130 of 34 microns x 58 microns is bound to be higher. The reflectance of the light emitting element 130 is larger than 20 microns×40 microns. In addition, comparing groups 3 and 4, groups 6 and 7, and groups 8 and 9 in Table (1), it can be seen that the anti-reflection layer 152 can effectively reduce the reflectivity, and the double-layer anti-reflection layer The effect of reducing the reflectivity of the anti-reflective layer 152 is more significant than that of the single-layer anti-reflection layer 152 .

The low refractive index black matrix layer 121 can reduce the reflectivity of the light-emitting panel, so in the same group, under the condition of the same size, "BM low refractive index" has a lower reflectivity. Although the black matrix layer 121 with a low refractive index can reduce the reflectivity of the light-emitting panel, as shown in Table (1), when the reflectivity is not less than 5%, the black matrix layer 121 with a low refractive index reduces the reflectivity. The effect is limited, such as the 34 micron×58 micron light-emitting element 130 of Group 1, 5-7 and Group 8. When the reflectance is less than 5%, such as the 20 micron×40 micron light-emitting elements 130 of Group 9 and Group 8, the low refractive index black matrix layer 121 can significantly reduce the reflectance.

group Filler Metal pattern layer under the light emitting element Anti-reflection layer 152 Light emitting element 130 34 microns x 58 microns 34 microns x 58 microns BM High Refractive Index BM High Refractive Index BM High Refractive Index BM High Refractive Index 10-1 140 single layer 6.5% 6.2% 4.7% 4.4% 10-2 140 double layer 4.1% 3.8% 2.3% 2.0% 11-1 340 Titanium/Aluminum/Titanium single layer 7.1% 6.9% 4.9% 4.6% 11-2 340 Titanium/Aluminum/Titanium double layer 4.7% 4.5% 2.5% 2.2% 12-1 340 Aluminum/Titanium single layer 7.9% 7.6% 5.2% 4.9% 12-2 340 Aluminum/Titanium double layer 5.5% 5.2% 2.8% 2.5% Table II)

All groups in Table (2) use the black matrix layer 121 and the filling materials 140 and 340 . It can be seen that both the groups 10-1 and 10-2 using the filling material 140 (such as black glue) have relatively low reflectivity. Although the groups 11-1, 11-2, 12-1, and 12-2 using the filling material 340 (including the reflective material 341) have higher reflectivity, the groups 11-1, 11-2, and 12-1 The reflectivity of both group 12-2 and 12-2 is below 8%. For example, in group 12-1, the light-emitting panel with "BM high refractive index" and 34 micron x 58 micron light-emitting elements 130 has a reflectance of 7.9%. Therefore, the filling material 340 can still help reduce the reflectivity of the light emitting panel.

Although the effect of the filling material 340 on reducing the reflectivity is not as good as that of the filling material 140 , the reflective material 341 of the filling material 340 can reflect the light L1 . Therefore, the filling material 340 can increase the brightness of the light-emitting panel and improve the optical efficiency by 50% to 70%. In addition, the effect of the filling material 240 on reducing the reflectivity is not as good as that of the filling material 140, but the light-transmitting material 241 of the filling material 240 can make the light L1 be transmitted by the metal pattern layers 112a, 112b, 112c and 112d (or the metal pattern layer in FIG. 5 512a, 512b, 512c, and 512d) to increase the brightness of the light-emitting panel and increase the optical efficiency by 30% to 40%.

In Table (2), "the metal pattern layer under the light-emitting element", such as the metal pattern layer 112c (or the metal pattern layer 512c in FIG. 5 ), can be a three-layer structure or a two-layer structure. The three-layer structure includes one aluminum metal layer and two titanium metal layers, wherein the aluminum metal layer is sandwiched between the two titanium metal layers, and the "titanium/aluminum/titanium" shown in Table (2) represents the above three layers structure. The two-layer structure includes an aluminum metal layer and a titanium metal layer, wherein the aluminum metal layer is closer to the light-emitting element 130, and the "aluminum/titanium" shown in Table (2) represents the above two-layer structure. Since the reflectivity of aluminum itself is higher than that of titanium, the reflectivity of the luminous panels of groups 12-1 and 12-2 is generally higher than that of luminous panels of groups 11-1 and 11-2, as shown in Table (2) ) shown.

FIG. 6 is a schematic top view of a light-emitting panel according to another embodiment of the present invention. Please refer to FIG. 6 , the light-emitting panel 600 of this embodiment is similar to the light-emitting panel 100 of the previous embodiment, and the differences between the light-emitting panel 600 and the previous embodiment are mainly described below. In principle, the same features of the light emitting panels 600 and 100 will not be described again.

The light-emitting panel 600 includes a pixel array substrate 610, a black matrix layer 621, and a light-transmitting pattern layer (not shown), wherein the pixel array substrate 610 has a plurality of sub-pixel regions 111s, a plurality of light-transmitting regions 611t, and a plurality of routing lines DL6 and SL6. The transparent pattern layer includes a plurality of transparent layers 622p distributed in the transparent region 611t. The trace SL6 extends along the first direction D1, and the trace DL6 extends along the second direction D2. In addition, the structure and function of the line DL6 and the line T41 may be the same, and the structure and function of the line SL6 and the line T11 may also be the same.

Different from the aforementioned light-emitting panel 100, in the light-emitting panel 600, the black matrix layer 621 covers these wirings DL6 and SL6, and surrounds a light-transmitting layer 622p along some of these wirings DL6 and SL6, at least one of which is light-transmitting Layer 622p is L-shaped in shape. Taking FIG. 6 as an example, the shapes of each light-transmitting region 611t and each light-transmitting layer 622p are L-shaped.

Each L-shaped light-transmitting layer 622p can be divided into eight groups GR1 (equivalent to the main pixel area), wherein both the light-transmitting area 611t and the light-transmitting layer 622p are larger than the light-transmitting area 111t and the light-transmitting area 111t in the previous embodiment. Layer 122p. Therefore, the light-transmitting pattern layer of this embodiment can reduce the diffraction of light, reduce the intensity of multi-order light and high-frequency light, so as to reduce the edge blur of the transmitted image, thereby improving the image quality of the light-emitting panel 600 .

7A to 7C are schematic top views of light-emitting panels in other embodiments of the present invention. The light-emitting panels 700a, 700b and 700c disclosed in FIGS. 7A to 7C are similar to the foregoing embodiments, wherein each of the light-emitting panels 700a, 700b and 700c also includes a plurality of wiring lines DL6 and SL6 and a black matrix layer (such as a black matrix layer 621 , not shown in FIGS. 7A to 7C ), and the black matrix layer covers these wires DL6 and SL6 . Only the different features of the light emitting panels 700a, 700b and 700c from the previous embodiments will be described below. As for the same features of the aforementioned embodiment and the embodiment of FIG. 7A to FIG. 7C , they will not be repeated below.

Different from the foregoing embodiments, the shapes of the main pixel regions of the light emitting panels 700a, 700b and 700c are all different from the foregoing embodiments. Please refer to FIG. 7A , for example, the shape of the main pixel area M71 in FIG. 7A is a rectangle, wherein the long side of the main pixel area M71 extends along the first direction D1, and the short side extends along the second direction D2. However, in other embodiments, the long side of the main pixel region M71 may extend along the second direction D2, and the short side may extend along the first direction D1. Please refer to FIG. 7B and FIG. 7C . Other FIG. 7B and FIG. 7C respectively present a circular main pixel area M72 and an irregular main pixel area M73 .

To sum up, since external light can pass through the light-transmitting pattern layer distributed in the light-transmitting area, compared with the existing common opaque display panels, the light-emitting panel disclosed in at least one embodiment of the present invention can have a wider application range. For example, in terms of vehicle displays, the luminescent panels of the above embodiments do not block the driver's line of sight because they allow external light to pass through, so they are suitable for being directly installed on the windshield as a head-up display (HUD). Similarly, the light-emitting panels of the above embodiments are also suitable for being directly installed on the visor of a safety helmet or glasses, and thus are also suitable for wearing devices.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The protection scope of the invention shall be defined by the scope of the appended patent application.

100, 200, 300, 400, 500, 600, 700a, 700b, 700c: Luminous panel 110, 410, 510, 610: pixel array substrate 111s, 511s: sub-pixel area 111t, 611t: Translucent area 112a, 112b, 112c, 112d, 512a, 512b, 512c, 512d: metal pattern layer 113a, 113b, 113c, 113d, 113e, 115a, 115b, 115c: insulating layer 114b, 114c, 114d, 114s: contact window 119: Substrate 119n: normal direction 121, 621: black matrix layer 121g: protruding length 122: Light-transmitting pattern layer 122p, 622p: transparent layer 130: Light emitting element 131: light top surface 132: luminescent layer 140, 240, 340: filling material 151: transparent layer 152: anti-reflection layer 241: Translucent material 242: light absorbing layer 341: reflective material 460: flat layer CP5: projection area D1: the first direction D2: Second direction DL6, SL6, T11, T41: wiring E12: Edge G1: height difference GR1: group L1: light LA5: Translucent area M71, M72, M73: main pixel area MP1: vertical projected area MP5: Projection area P41: Pad R1: Groove RA1: reserved area SB1: connector TC1: Semiconductor layer TG1: gate TT1: active component

FIG. 1A is a schematic top view of a light-emitting panel according to at least one embodiment of the present invention. FIG. 1B is a partially enlarged schematic view of the light emitting panel in FIG. 1A . FIG. 1C is a schematic cross-sectional view taken along line 1C-1C in FIG. 1B . FIG. 1D is a partially enlarged schematic view of FIG. 1C . FIG. 2 is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. FIG. 6 is a schematic top view of a light-emitting panel according to another embodiment of the present invention. FIG. 7A is a schematic top view of a light-emitting panel according to another embodiment of the present invention. FIG. 7B is a schematic top view of a light-emitting panel according to another embodiment of the present invention. FIG. 7C is a schematic top view of a light-emitting panel according to another embodiment of the present invention.

100: Luminous panel

110:Pixel array substrate

111s: sub-pixel area

111t: Translucent area

121: Black matrix layer

122p: transparent layer

130: Light emitting element

D1: the first direction

D2: Second direction

GR1: group

P41: Pad

RA1: reserved area

T11, T41: wiring

Claims (14)

A light emitting panel comprising: A pixel array substrate having a plurality of sub-pixel regions and a plurality of light-transmitting regions, wherein one of the sub-pixel regions is located between at least two adjacent ones of the light-transmitting regions; A plurality of light-emitting elements are arranged on the pixel array substrate and electrically connected to the pixel array substrate, wherein the light-emitting elements are respectively located on the sub-pixel regions; A black matrix layer is arranged on the pixel array substrate and not distributed in the light-transmitting regions; and A light-transmitting pattern layer is arranged on the pixel array substrate and distributed in the light-transmitting regions, wherein the black matrix layer, the light-transmitting pattern layer and the pixel array substrate form a plurality of grooves, and these Grooves are respectively located on the sub-pixel areas, and the light-emitting elements are respectively located in the grooves. The black matrix layer and the light-transmitting pattern layer jointly surround the light-emitting elements located in at least one of the grooves. The luminescent panel as described in claim 1, further comprising: A plurality of filling materials are respectively filled in the grooves, wherein each of the light-emitting elements has a light-emitting top surface, and the filling materials do not cover the light-emitting top surfaces of the light-emitting elements. The light-emitting panel as claimed in claim 2, wherein at least one of the filling materials is a black adhesive material. The light-emitting panel as claimed in item 2, wherein at least one of the filling materials includes: a reflective material filled in the groove; and A light-absorbing layer is arranged on the light-reflecting material and covers the light-reflecting material, wherein the light-absorbing layer surrounds one of the light-emitting elements in the groove. The light-emitting panel as claimed in claim 4, wherein each of the light-emitting elements has a light-emitting layer, and the height of the light-emitting layer relative to the pixel array substrate is smaller than the height of the upper surface of the reflective material relative to the pixel array substrate. The light-emitting panel as claimed in item 2, wherein at least one of the filling materials includes: A light-transmitting material is filled in the groove; and A light-absorbing layer is arranged on the light-transmitting material and covers the light-transmitting material, wherein the light-absorbing layer surrounds one of the light-emitting elements in the groove. The light-emitting panel as described in Claim 6, wherein each of the light-emitting elements has a light-emitting layer, and the height of the light-emitting layer relative to the pixel array substrate is smaller than the height of the upper surface of the light-transmitting material relative to the pixel array substrate . The light-emitting panel as claimed in item 1, wherein the black matrix layer protrudes from the upper surface of the light-transmitting pattern layer, and the height difference between the upper surface of the black matrix layer and the upper surface of the light-transmitting pattern layer is less than or Equal to 1.5 microns. The light-emitting panel as claimed in item 1, wherein the pixel array substrate comprises: a substrate; and A plurality of metal pattern layers are arranged on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel area, the vertical projection of the metal pattern layers on the substrate completely covers the light emitting element Vertical projection on the substrate. The light-emitting panel as claimed in item 1, wherein the pixel array substrate comprises: a substrate; and A plurality of metal pattern layers are arranged on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel area, at least a part of the vertical projection of the light-emitting element on the substrate does not overlap with the metal pattern layers. The vertical projection of the pattern layer on the substrate is vertically overlapped. The light-emitting panel as claimed in item 1, wherein the pixel array substrate comprises: a substrate; and A plurality of metal pattern layers are arranged on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel area, the vertical projected area of the metal pattern layers on the substrate is greater than or equal to the half of the vertical projected area of the groove on the substrate. The light-emitting panel as claimed in item 1, wherein the pixel array substrate comprises: a substrate; and Multiple traces are arranged on the substrate, wherein the black matrix layer extends along the traces and covers the traces. The light-emitting panel as claimed in claim 12, wherein the light-transmitting pattern layer includes a plurality of light-transmitting layers, and the black matrix layer surrounds one of the light-transmitting layers along some of the lines, and at least one of the light-transmitting layers The shape of the photosphere is L-shaped. The light-emitting panel as claimed in claim 12, wherein the light-transmitting pattern layer includes a plurality of light-transmitting layers, and the black matrix layer surrounds each of the light-transmitting layers along four of the lines, wherein each of the light-transmitting layers has a shape is an asymmetric shape.

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