TW202313891A - Adhesive composition, adhesive layer, and adhesive sheet - Google Patents

Adhesive composition, adhesive layer, and adhesive sheet Download PDF

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TW202313891A
TW202313891A TW111127332A TW111127332A TW202313891A TW 202313891 A TW202313891 A TW 202313891A TW 111127332 A TW111127332 A TW 111127332A TW 111127332 A TW111127332 A TW 111127332A TW 202313891 A TW202313891 A TW 202313891A
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mentioned
adhesive
mass
millimeter
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TW111127332A
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笹原一輝
形見普史
高橋智一
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10Homopolymers or copolymers of methacrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/40Radiating elements coated with or embedded in protective material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Details Of Aerials (AREA)

Abstract

Provided are: an adhesive composition which can form an adhesive layer that has low permittivity and low dielectric loss in a high-frequency band, and which is suitable for bonding members constituting a millimeter-wave antenna; and an adhesive sheet. An adhesive composition according to the present invention comprises a mixture, partially polymerized product, or copolymer of a (meth)acrylate compound having a cross-linkable functional group and a methacrylate compound having a hydrocarbon group with six or more carbon atoms, the permittivity thereof at a frequency of 28 GHz or at a frequency of 60 GHz being 2.0-5.0.

Description

黏著劑組合物、黏著劑層以及黏著片材Adhesive composition, adhesive layer and adhesive sheet

本發明係關於一種黏著劑組合物、黏著劑層以及黏著片材。更詳細而言,本發明係關於一種適於毫米波天線之構成構件之貼合之黏著劑組合物、黏著劑層以及黏著片材。The invention relates to an adhesive composition, an adhesive layer and an adhesive sheet. More specifically, the present invention relates to an adhesive composition, an adhesive layer, and an adhesive sheet suitable for bonding components of a millimeter-wave antenna.

近年來,智慧型手機等攜帶用通信設備中之通信之高速度化、大容量化逐年進步,業界期待於作為下一代超高速資料通信標準之第五代(5G)中,與第四代(4G)相比,能夠實現100倍之超高速、大容量通信、1/10之低延遲、10倍以上之多個同時連接。In recent years, the high-speed and large-capacity communication in portable communication devices such as smartphones has been increasing year by year. Compared with 4G), it can achieve 100 times the ultra-high speed, large-capacity communication, 1/10 the low delay, and more than 10 times the number of simultaneous connections.

為了能夠實現5G中之如上所述之超高速、大容量通信、低延遲、多個同時連接,使用稱為毫米波之頻率超過24 GHz之高頻帶電磁波,且藉由波長縮短為毫米級,能夠一次傳送大量資料。In order to realize the ultra-high-speed, large-capacity communication, low-latency, and multiple simultaneous connections in 5G, it is possible to use high-frequency electromagnetic waves with a frequency exceeding 24 GHz called millimeter waves, and shorten the wavelength to the millimeter level. Send large amounts of data at once.

另一方面,毫米波與4G所使用之頻帶相比,有容易因和雨或空氣中之氧、水分子之共振吸收等而衰減,直線性較強,容易反射之性質,對毫米波通信中使用之天線(以下,有時稱為「毫米波天線」)要求高至先前之4G通信以上之天線增益。On the other hand, compared with the frequency band used by 4G, millimeter wave is easy to attenuate due to resonance absorption with rain or oxygen in the air, water molecules, etc., and has strong linearity and easy reflection properties. The antenna used (hereinafter, sometimes referred to as "millimeter wave antenna") requires higher antenna gain than the previous 4G communication.

於專利文獻1中,作為搭載於智慧型手機等攜帶用通信設備之毫米波天線,揭示有於設置有天線元件之基材上積層罩蓋構件之構成,且將黏著劑用於該等基材與罩蓋構件之貼合。Patent Document 1 discloses a configuration in which a cover member is laminated on a substrate provided with an antenna element as a millimeter-wave antenna mounted on a portable communication device such as a smartphone, and an adhesive is applied to the substrate Fitting with the cover member.

作為此種黏著劑,例如於專利文獻2中揭示有如下黏著劑,其含有使包含丙烯酸2-乙基己酯、特定之(甲基)丙烯酸烷基酯、及含羥基單體之單體混合物聚合而成之聚合物,能夠形成於頻率100 kHz下之介電常數為3.5以下之黏著劑層。As such an adhesive, for example, Patent Document 2 discloses an adhesive containing a monomer mixture including 2-ethylhexyl acrylate, a specific alkyl (meth)acrylate, and a hydroxyl-containing monomer. The polymer formed by polymerization can form an adhesive layer with a dielectric constant of 3.5 or less at a frequency of 100 kHz.

又,於專利文獻3中揭示有如下黏著劑層,其含有特定之丙烯酸系聚合物、具有聚環氧烷鏈之乙烯基單體、光聚合起始劑、及交聯劑,且於頻率1 MHz下之相對介電常數為3.5以下。 先前技術文獻 專利文獻 In addition, Patent Document 3 discloses an adhesive layer containing a specific acrylic polymer, a vinyl monomer having a polyalkylene oxide chain, a photopolymerization initiator, and a crosslinking agent, and at a frequency of 1 The relative permittivity at MHz is 3.5 or less. prior art literature patent documents

專利文獻1:日本專利特開2019-186942號公報 專利文獻2:日本專利特開2015-183178號公報 專利文獻3:日本專利特開2020-007570號公報 Patent Document 1: Japanese Patent Laid-Open No. 2019-186942 Patent Document 2: Japanese Patent Laid-Open No. 2015-183178 Patent Document 3: Japanese Patent Laid-Open No. 2020-007570

[發明所欲解決之問題][Problem to be solved by the invention]

已知對於構成毫米波天線之構件,因其素材所具有之介電損耗,毫米波會降低,為了不降低天線增益,亦要求毫米波之高頻帶下之低介電常數、尤其是低介電損耗之特性。對用於貼合構成毫米波天線之構件之黏著劑亦要求於高頻帶下之低介電常數、低介電損耗之特性。It is known that for the components that make up the millimeter wave antenna, because of the dielectric loss of the material, the millimeter wave will decrease. In order not to reduce the antenna gain, a low dielectric constant, especially a low dielectric constant in the high frequency band of the millimeter wave is also required. properties of loss. Low dielectric constant and low dielectric loss characteristics in high frequency bands are also required for the adhesive used to bond the components constituting the millimeter wave antenna.

專利文獻2之黏著劑雖然於低頻率(100 kHz)下為低介電常數,但於高頻帶下之介電損耗不夠低,同樣地,專利文獻3之黏著劑層亦雖然於低頻率(1 MHz)下為低相對介電常數,但於高頻帶下之介電損耗不夠低。又,僅為與低頻帶下之介電常數相關之記述,並未揭示與高頻帶下之介電損耗相關之資訊,且並未給出本申請案之對象課題之解決方案。Although the adhesive in Patent Document 2 has a low dielectric constant at low frequencies (100 kHz), the dielectric loss in high frequency bands is not low enough. Similarly, the adhesive layer in Patent Document 3 is also low in frequency (1 MHz) has a low relative permittivity, but the dielectric loss in the high frequency band is not low enough. Also, it is only a description related to the dielectric constant in the low frequency band, and does not disclose information related to the dielectric loss in the high frequency band, and does not provide a solution to the subject of the present application.

本發明係基於如上所述之情況而想出者,本發明之目的在於提供一種黏著劑組合物,其能夠形成於高頻帶下介電常數以及介電損耗較低,適於貼合構成毫米波天線之構件之黏著劑層。又,本發明之另一目的在於提供一種黏著劑層,其於高頻帶下介電常數以及介電損耗較低,適於貼合構成毫米波天線之構件。又,本發明之另一目的在於提供一種黏著片材,其具有於高頻帶下介電常數以及介電損耗較低,適於貼合構成毫米波天線之構件之黏著劑層。 [解決問題之技術手段] The present invention is conceived based on the above circumstances. The purpose of the present invention is to provide an adhesive composition that can be formed in a high-frequency band with low dielectric constant and dielectric loss, and is suitable for bonding to form millimeter waves. Adhesive layer for antenna components. Moreover, another object of the present invention is to provide an adhesive layer, which has low dielectric constant and dielectric loss in the high frequency band, and is suitable for laminating the components constituting the millimeter wave antenna. In addition, another object of the present invention is to provide an adhesive sheet, which has a low dielectric constant and dielectric loss in high frequency bands, and is suitable for bonding adhesive layers of components constituting millimeter wave antennas. [Technical means to solve the problem]

即,本發明提供一種第1態樣之黏著劑組合物,其於頻率28 GHz下之介電常數為2.0~5.0,於頻率28 GHz下之介電損耗為0.0001~0.05,且包含具有碳數6以上之烴基之甲基丙烯酸酯化合物、以及具有交聯性官能基之(甲基)丙烯酸酯化合物之混合物、其部分聚合物或共聚物。That is, the present invention provides an adhesive composition of the first aspect, which has a dielectric constant of 2.0 to 5.0 at a frequency of 28 GHz, a dielectric loss of 0.0001 to 0.05 at a frequency of 28 GHz, and contains A mixture of a methacrylate compound having 6 or more hydrocarbon groups, a (meth)acrylate compound having a crosslinkable functional group, a partial polymer or a copolymer thereof.

於本發明之第1態樣之黏著劑組合物中,於頻率28 GHz下之介電常數為2.0~5.0之構成於能夠提高使用黏著劑組合物貼合構成構件之毫米波天線的天線增益方面較佳。In the adhesive composition of the first aspect of the present invention, the composition having a dielectric constant of 2.0 to 5.0 at a frequency of 28 GHz can improve the antenna gain of a millimeter-wave antenna for bonding components using the adhesive composition better.

本發明之第1態樣之黏著劑組合物於頻率60 GHz下之介電常數較佳為2.0~5.0。該構成於能夠提高使用本發明之第1態樣之黏著劑組合物貼合構成構件之毫米波天線的天線增益方面較佳。The adhesive composition of the first aspect of the present invention preferably has a dielectric constant of 2.0 to 5.0 at a frequency of 60 GHz. This configuration is preferable in that the antenna gain of the millimeter-wave antenna in which the constituent members are bonded using the adhesive composition of the first aspect of the present invention can be increased.

又,本發明提供一種第2態樣之黏著劑組合物,其於頻率60 GHz下之介電常數為2.0~5.0,於頻率60 GHz下之介電損耗為0.0001~0.05,且包含具有碳數6以上之烴基之甲基丙烯酸酯化合物、以及具有交聯性官能基之(甲基)丙烯酸酯化合物之混合物、其部分聚合物或共聚物。Also, the present invention provides an adhesive composition of the second aspect, which has a dielectric constant of 2.0 to 5.0 at a frequency of 60 GHz, a dielectric loss of 0.0001 to 0.05 at a frequency of 60 GHz, and contains A mixture of a methacrylate compound having 6 or more hydrocarbon groups, a (meth)acrylate compound having a crosslinkable functional group, a partial polymer or a copolymer thereof.

於本發明之第2態樣之黏著劑組合物中,於頻率60 GHz下之介電常數為2.0~5.0之構成於能夠提高使用上述黏著劑組合物貼合構成構件之毫米波天線的天線增益方面較佳。In the adhesive composition of the second aspect of the present invention, the composition having a dielectric constant of 2.0 to 5.0 at a frequency of 60 GHz can improve the antenna gain of a millimeter wave antenna that uses the above-mentioned adhesive composition to bond components. better.

上述烴基較佳為具有脂肪族基、含脂環基或含芳香環基。The above-mentioned hydrocarbon group preferably has an aliphatic group, contains an alicyclic group, or contains an aromatic ring group.

上述混合物、其部分聚合物或共聚物中之上述具有碳數6以上之烴基之甲基丙烯酸酯化合物、或源自該化合物之結構單元之含量較佳為25質量%以上。The content of the above-mentioned methacrylate compound having a hydrocarbon group having 6 or more carbon atoms, or a structural unit derived from the compound in the above-mentioned mixture, its partial polymer or copolymer is preferably 25% by mass or more.

上述混合物、其部分聚合物或共聚物中之上述具有交聯性官能基之(甲基)丙烯酸酯化合物、或源自該化合物之結構單元之含量較佳為0.1~30質量%。It is preferable that content of the said (meth)acrylate compound which has a crosslinkable functional group, or the structural unit derived from this compound in the said mixture, its partial polymer, or a copolymer is 0.1-30 mass %.

上述烴基較佳為於末端具有脂環式基或芳香族基。The above-mentioned hydrocarbon group preferably has an alicyclic group or an aromatic group at the terminal.

又,本發明提供一種由上述黏著劑組合物形成之黏著劑層。Moreover, this invention provides the adhesive agent layer formed from the said adhesive agent composition.

又,本發明提供一種具有上述黏著劑層之黏著片材。Moreover, this invention provides the adhesive sheet which has the said adhesive agent layer.

又,本發明提供一種毫米波天線,其係至少具有上述黏著片材以及基板者,且上述基板於至少單面具備天線元件,於上述基板之具有上述天線元件之側之面上貼合有上述黏著片材。 [發明之效果] In addition, the present invention provides a millimeter wave antenna comprising at least the above-mentioned adhesive sheet and a substrate, wherein the above-mentioned substrate is provided with an antenna element on at least one side, and the above-mentioned Adhesive sheet. [Effect of Invention]

本發明之黏著劑組合物、黏著劑層能夠於毫米波之高頻帶下顯示較低之介電常數、介電損耗,將毫米波之放射損耗抑制得較低。因此,藉由使用本發明之黏著片材貼合毫米波天線之構成構件,能夠有效率地製造顯示較高之天線增益之毫米波天線。The adhesive composition and adhesive layer of the present invention can exhibit lower dielectric constant and dielectric loss in the high frequency band of millimeter waves, and suppress the radiation loss of millimeter waves to a lower level. Therefore, by bonding the constituent members of the millimeter-wave antenna using the adhesive sheet of the present invention, it is possible to efficiently manufacture a millimeter-wave antenna exhibiting higher antenna gain.

[黏著劑組合物] 本發明之第1態樣之黏著劑組合物於頻率28 GHz下之介電常數為2.0~5.0,於頻率28 GHz下之介電損耗為0.0001~0.05,且包含具有碳數6以上之烴基之甲基丙烯酸酯化合物、以及具有交聯性官能基之(甲基)丙烯酸酯化合物之混合物、其部分聚合物或共聚物。 [adhesive composition] The adhesive composition of the first aspect of the present invention has a dielectric constant of 2.0 to 5.0 at a frequency of 28 GHz, a dielectric loss of 0.0001 to 0.05 at a frequency of 28 GHz, and contains a hydrocarbon group having 6 or more carbon atoms. A mixture of a methacrylate compound and a (meth)acrylate compound having a crosslinkable functional group, a partial polymer or a copolymer thereof.

本發明之第2態樣之黏著劑組合物於頻率60 GHz下之介電常數為2.0~5.0,於頻率60 GHz下之介電損耗為0.0001~0.05,且包含具有碳數6以上之烴基之甲基丙烯酸酯化合物、以及具有交聯性官能基之(甲基)丙烯酸酯化合物之混合物、其部分聚合物或共聚物。The adhesive composition of the second aspect of the present invention has a dielectric constant of 2.0 to 5.0 at a frequency of 60 GHz, a dielectric loss of 0.0001 to 0.05 at a frequency of 60 GHz, and contains a hydrocarbon group having 6 or more carbon atoms. A mixture of a methacrylate compound and a (meth)acrylate compound having a crosslinkable functional group, a partial polymer or a copolymer thereof.

本發明之黏著劑組合物可具有任一種形態,例如可例舉:溶劑型、乳液型、熱熔融型(熱熔型)、無溶劑型(活性能量線硬化型,例如單體混合物、或單體混合物與其部分聚合物等)等。The adhesive composition of the present invention may have any form, for example, solvent type, emulsion type, heat-melt type (hot-melt type), solvent-free type (active energy ray hardening type, such as monomer mixture, or single body mixture and its part of the polymer, etc.) and so on.

如上所述,本發明之黏著劑組合物可為溶劑型,即,可含有有機溶劑。As mentioned above, the adhesive composition of the present invention may be a solvent type, that is, may contain an organic solvent.

作為上述有機溶劑,只要為可用作溶劑之有機化合物即可,例如可例舉:環己烷、己烷、庚烷、甲基環己烷等烴系溶劑;甲苯、二甲苯等芳香族系溶劑;乙酸丁酯、乙酸乙酯、乙酸甲酯等酯系溶劑;丙酮、甲基乙基酮、甲基異丁基酮等酮系溶劑;甲醇、乙醇、丙醇、丁醇、異丙醇等醇系溶劑等。上述有機溶劑亦可為包含2種以上之有機溶劑之混合溶劑。As the above-mentioned organic solvent, as long as it is an organic compound that can be used as a solvent, for example: hydrocarbon-based solvents such as cyclohexane, hexane, heptane, and methylcyclohexane; aromatic solvents such as toluene and xylene; Solvents; ester solvents such as butyl acetate, ethyl acetate, and methyl acetate; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; methanol, ethanol, propanol, butanol, isopropanol Alcohol-based solvents, etc. The above-mentioned organic solvent may be a mixed solvent containing two or more organic solvents.

本發明之第1態樣之黏著劑組合物於28 GHz下之介電常數被控制得較低,能夠抑制毫米波之放射損耗。本發明之第1態樣之黏著劑組合物於頻率28 GHz下之介電常數為5.0以下,較佳為4.5以下,更佳為4.0以下,進而較佳為3.5以下,進而更佳為3.4以下,尤佳為3.3以下,最佳為3.2以下、3.1以下、3.0以下或2.9以下。下限值並無特別限定,為2.0以上,亦可為2.1以上或2.2以上。又,較佳為第2態樣之黏著劑組合物於頻率28 GHz下之介電常數在上述範圍內。The dielectric constant of the adhesive composition of the first aspect of the present invention is controlled to be low at 28 GHz, and the radiation loss of millimeter waves can be suppressed. The dielectric constant of the adhesive composition according to the first aspect of the present invention at a frequency of 28 GHz is 5.0 or less, preferably 4.5 or less, more preferably 4.0 or less, further preferably 3.5 or less, still more preferably 3.4 or less , preferably less than 3.3, most preferably less than 3.2, less than 3.1, less than 3.0 or less than 2.9. The lower limit is not particularly limited, and may be 2.0 or more, and may be 2.1 or more or 2.2 or more. Also, it is preferable that the dielectric constant of the adhesive composition of the second aspect at a frequency of 28 GHz is within the above-mentioned range.

於本說明書中,介電常數係藉由下文揭示之實施例中所記載之方法測定者。再者,「相對介電常數」係將「介電常數」除以「真空介電常數」所得之值,但由於「真空介電常數」為1,故於本說明書中,「介電常數」與「相對介電常數」係作為同義來處理。又,有時將本發明之第1態樣之黏著劑組合物以及本發明之第2態樣之黏著劑組合物統稱為「本發明之黏著劑組合物」。In this specification, the dielectric constant is measured by the method described in the examples disclosed below. Furthermore, "relative permittivity" is a value obtained by dividing "dielectric constant" by "vacuum permittivity", but since "vacuum permittivity" is 1, in this specification, "dielectric constant" It is treated as a synonym with "relative permittivity". Also, the adhesive composition of the first aspect of the present invention and the adhesive composition of the second aspect of the present invention may be collectively referred to as "the adhesive composition of the present invention".

本發明之第1態樣之黏著劑組合物較佳為於28 GHz下之介電損耗被控制得較低,於能夠抑制毫米波之放射損耗方面較佳。本發明之第1態樣之黏著劑組合物於頻率28 GHz下之介電損耗為0.050以下,較佳為0.045以下,更佳為0.040以下,進而較佳為0.035以下,進而更佳為0.030以下,尤佳為0.025以下,最佳為0.020以下。下限值為0.0001以上,亦可為0.0005以上或0.0010以上。又,較佳為本發明之第2態樣之黏著劑組合物於頻率28 GHz下之介電損耗在上述範圍內。In the adhesive composition of the first aspect of the present invention, it is preferable that the dielectric loss at 28 GHz is controlled to be low, and it is preferable that the radiation loss of millimeter waves can be suppressed. The dielectric loss of the adhesive composition according to the first aspect of the present invention at a frequency of 28 GHz is 0.050 or less, preferably 0.045 or less, more preferably 0.040 or less, further preferably 0.035 or less, still more preferably 0.030 or less , preferably less than 0.025, most preferably less than 0.020. The lower limit may be not less than 0.0001, and may be not less than 0.0005 or not less than 0.0010. Also, it is preferable that the dielectric loss of the adhesive composition of the second aspect of the present invention at a frequency of 28 GHz is within the above-mentioned range.

本發明之第2態樣之黏著劑組合物於60 GHz下之介電常數被控制得較低,能夠抑制毫米波之放射損耗。本發明之第2態樣之黏著劑組合物於頻率60 GHz下之介電常數為5.0以下,較佳為4.5以下,更佳為4.0以下,進而較佳為3.5以下,進而更佳為3.4以下,尤佳為3.3以下,最佳為3.2以下、3.1以下、3.0以下或2.9以下。下限值並無特別限定,為2.0以上,亦可為2.1以上或2.2以上。又,較佳為本發明之第1態樣之黏著劑組合物於頻率60 GHz下之介電常數在上述範圍內。The dielectric constant of the adhesive composition of the second aspect of the present invention is controlled to be low at 60 GHz, and the radiation loss of millimeter waves can be suppressed. The dielectric constant of the adhesive composition of the second aspect of the present invention at a frequency of 60 GHz is 5.0 or less, preferably 4.5 or less, more preferably 4.0 or less, still more preferably 3.5 or less, still more preferably 3.4 or less , preferably less than 3.3, most preferably less than 3.2, less than 3.1, less than 3.0 or less than 2.9. The lower limit is not particularly limited, and may be 2.0 or more, and may be 2.1 or more or 2.2 or more. In addition, it is preferable that the dielectric constant of the adhesive composition of the first aspect of the present invention at a frequency of 60 GHz is within the above-mentioned range.

本發明之第2態樣之黏著劑組合物較佳為於60 GHz下之介電損耗被控制得較低,於能夠抑制毫米波之放射損耗方面較佳。本發明之第2態樣之黏著劑組合物於頻率60 GHz下之介電損耗為0.050以下,較佳為0.045以下,更佳為0.040以下,進而較佳為0.035以下,進而更佳為0.030以下,尤佳為0.025以下,最佳為0.020以下、0.019以下、0.018以下、0.017以下、0.016以下、0.015以下、0.014以下、0.013以下或0.012以下。於頻率60 GHz下之介電損耗之下限值為0.0001以上,亦可為0.0005以上或0.0010以上。又,較佳為本發明之第1態樣之黏著劑組合物於頻率60 GHz下之介電損耗在上述範圍內。In the adhesive composition of the second aspect of the present invention, it is preferable that the dielectric loss at 60 GHz is controlled to be low, and it is preferable that the radiation loss of millimeter waves can be suppressed. The dielectric loss of the adhesive composition of the second aspect of the present invention at a frequency of 60 GHz is 0.050 or less, preferably 0.045 or less, more preferably 0.040 or less, still more preferably 0.035 or less, still more preferably 0.030 or less , especially preferably 0.025 or less, most preferably 0.020 or less, 0.019 or less, 0.018 or less, 0.017 or less, 0.016 or less, 0.015 or less, 0.014 or less, 0.013 or less, or 0.012 or less. The lower limit of the dielectric loss at a frequency of 60 GHz is above 0.0001, and may be above 0.0005 or above 0.0010. Also, it is preferable that the dielectric loss of the adhesive composition of the first aspect of the present invention at a frequency of 60 GHz is within the above-mentioned range.

本發明之黏著劑組合物較佳為飽和吸濕率被控制得較低。若飽和吸濕率較低,則源自水分子之毫米波之共振吸收等之衰減得以抑制,故於毫米波天線等中用作黏著劑層等時之耐水性優異,於能夠抑制毫米波之放射損耗方面較佳。本發明之黏著劑組合物於25℃、90%R.H.下之飽和吸濕率較佳為2.8%以下,更佳為2.7%以下,進而較佳為2.6%以下,進而更佳為2.5%以下,尤佳為2.4%以下,最佳為2.3%以下、2.2%以下、2.1%以下、2.0%以下、1.9%以下、1.8%以下、1.7%以下、1.6%以下、1.5%以下、1.4%以下、1.3%以下、1.2%以下、1.1%以下、1.0%以下、0.9%以下、0.8%以下、0.7%以下或0.6%以下。若於25℃、90%R.H.下之飽和吸濕率較低,則可抑制室溫附近之毫米波之放射損耗。上述飽和吸濕率之下限值並無特別限定,例如可為0.3%以上,亦可為0.4%以上或0.5%以上。The adhesive composition of the present invention preferably has a lower saturated moisture absorption rate. If the saturated moisture absorption rate is low, the attenuation of resonance absorption of millimeter waves originating from water molecules can be suppressed, so it has excellent water resistance when used as an adhesive layer in millimeter wave antennas, etc., and can suppress millimeter waves. Radiation loss is better. The saturated moisture absorption rate of the adhesive composition of the present invention at 25°C and 90% R.H. is preferably 2.8% or less, more preferably 2.7% or less, further preferably 2.6% or less, and even more preferably 2.5% or less. Especially preferably less than 2.4%, most preferably less than 2.3%, less than 2.2%, less than 2.1%, less than 2.0%, less than 1.9%, less than 1.8%, less than 1.7%, less than 1.6%, less than 1.5%, less than 1.4%, Less than 1.3%, less than 1.2%, less than 1.1%, less than 1.0%, less than 0.9%, less than 0.8%, less than 0.7%, or less than 0.6%. If the saturated moisture absorption rate at 25°C and 90% R.H. is low, the radiation loss of millimeter waves near room temperature can be suppressed. The lower limit of the saturated moisture absorption rate is not particularly limited, for example, it may be 0.3% or more, 0.4% or 0.5% or more.

本發明之黏著劑組合物於65℃、90%R.H.下之飽和吸濕率較佳為2.8%以下,更佳為2.6%以下,進而較佳為2.4%以下,進而更佳為2.3%以下,尤佳為2.2%以下,最佳為2.1%以下、2.0%以下、1.9%以下、1.8%以下、1.7%以下、1.6%以下、1.5%以下、1.4%以下、1.3%以下、1.2%以下、1.1%以下、1.0%以下、0.9%以下、0.8%以下或0.7%以下。上述飽和吸濕率之下限值並無特別限定,例如可為0.4%以上,亦可為0.5%以上或0.6%以上。若於65℃、90%R.H.下之飽和吸濕率較低,則即便於在應用黏著劑層等之狀態下置於高溫環境下之情形時,亦能夠抑制毫米波之放射損耗。The saturated moisture absorption rate of the adhesive composition of the present invention at 65°C and 90% R.H. is preferably less than 2.8%, more preferably less than 2.6%, further preferably less than 2.4%, and even more preferably less than 2.3%. Especially preferably less than 2.2%, most preferably less than 2.1%, less than 2.0%, less than 1.9%, less than 1.8%, less than 1.7%, less than 1.6%, less than 1.5%, less than 1.4%, less than 1.3%, less than 1.2%, Less than 1.1%, less than 1.0%, less than 0.9%, less than 0.8%, or less than 0.7%. The lower limit of the saturated moisture absorption rate is not particularly limited, for example, it may be 0.4% or more, or 0.5% or more, or 0.6% or more. If the saturated moisture absorption rate at 65°C and 90% R.H. is low, the radiation loss of millimeter waves can be suppressed even when placed in a high-temperature environment with an adhesive layer or the like applied.

本發明之黏著劑組合物於85℃、85%R.H.下之飽和吸濕率較佳為5.0%以下,更佳為4.0%以下,進而較佳為3.5%以下,進而更佳為3.0%以下,尤佳為2.8%以下,最佳為2.6%以下、2.4%以下、2.2%以下、2.0%以下、1.8%以下、1.6%以下、1.4%以下、1.2%以下、1.0%以下或0.8%以下。上述飽和吸濕率之下限值並無特別限定,例如可為0.4%以上,亦可為0.5%以上或0.6%以上。若於85℃、85%R.H.下之飽和吸濕率較低,則即便於在應用黏著劑層等之狀態下置於高溫環境下之情形時,亦能夠抑制毫米波之放射損耗。The saturated moisture absorption rate of the adhesive composition of the present invention at 85°C and 85% R.H. is preferably 5.0% or less, more preferably 4.0% or less, further preferably 3.5% or less, and even more preferably 3.0% or less, Especially preferably 2.8% or less, most preferably 2.6% or less, 2.4% or less, 2.2% or less, 2.0% or less, 1.8% or less, 1.6% or less, 1.4% or less, 1.2% or less, 1.0% or less, or 0.8% or less. The lower limit of the saturated moisture absorption rate is not particularly limited, for example, it may be 0.4% or more, or 0.5% or more, or 0.6% or more. If the saturated moisture absorption rate at 85°C and 85% R.H. is low, the radiation loss of millimeter waves can be suppressed even when placed in a high-temperature environment with an adhesive layer applied.

於各溫度以及濕度環境下之上述飽和吸濕率例如可由乾燥狀態之樣品重量(w1)、以及將該樣品放置於65℃、90%R.H.之氛圍中而停止重量變化之時點(吸濕率飽和時)之重量(w2),藉由下述式求出。亦可於25℃、90%R.H.以及85℃、85%R.H.之條件下分別求出。再者,w1以及w2之值係設為於相同溫度以及濕度下測定者。 飽和吸濕率(%)={(w2-w1)/w1}×100 The above-mentioned saturated moisture absorption rate under various temperature and humidity environments can be obtained, for example, from the weight of the sample in a dry state (w1) and the point at which the weight change stops when the sample is placed in an atmosphere of 65°C and 90% R.H. (saturated moisture absorption rate time) weight (w2) can be obtained by the following formula. It can also be obtained under the conditions of 25°C, 90%R.H. and 85°C, 85%R.H. Furthermore, the values of w1 and w2 are those measured under the same temperature and humidity. Saturation moisture absorption rate (%)={(w2-w1)/w1}×100

本發明之黏著劑組合物較佳為由吸濕導致之介電損耗之變化量被控制得較低,於能夠抑制毫米波之放射損耗以及其經時變化方面較佳。本發明之黏著劑組合物於頻率28 GHz下之介電損耗之由吸濕導致的變化量較佳為0.006以下,更佳為0.005以下,進而較佳為0.004以下。介電常數之由吸濕導致之變化量之下限值並無特別限定,例如可為0.0001以上,亦可為0.0002以上或0.0003以上。In the adhesive composition of the present invention, it is preferable that the amount of change in dielectric loss caused by moisture absorption is controlled to be low, and it is preferable in that it can suppress the radiation loss of millimeter waves and its change over time. The change in the dielectric loss of the adhesive composition of the present invention at a frequency of 28 GHz due to moisture absorption is preferably 0.006 or less, more preferably 0.005 or less, and still more preferably 0.004 or less. The lower limit of the variation of the dielectric constant due to moisture absorption is not particularly limited, and may be, for example, 0.0001 or more, 0.0002 or 0.0003 or more.

本發明之黏著劑組合物於頻率60 GHz下之介電損耗之由吸濕導致的變化量較佳為0.003以下,更佳為0.002以下,進而較佳為0.001以下。介電常數之由吸濕導致之變化量之下限值並無特別限定,例如可為0.0001以上,亦可為0.0002以上、0.0003以上、0.0004以上、0.0005以上、0.0006以上、0.0007以上、0.0008以上或0.0009以上。The change in the dielectric loss of the adhesive composition of the present invention at a frequency of 60 GHz due to moisture absorption is preferably 0.003 or less, more preferably 0.002 or less, and still more preferably 0.001 or less. The lower limit of the change in dielectric constant caused by moisture absorption is not particularly limited, for example, it may be 0.0001 or more, or 0.0002 or more, 0.0003 or more, 0.0004 or more, 0.0005 or more, 0.0006 or more, 0.0007 or more, 0.0008 or more, or Above 0.0009.

於上述頻率28 GHz以及60 GHz下之介電損耗之變化量可於65℃、90%R.H.之氛圍中保持5天以上,其後恢復至23±1℃、52%±1%R.H.之條件下(經過時間=0分鐘),經過4分鐘後至180分鐘為止每經過10分鐘測定各頻率下之介電損耗,由其等中之最大值(D fmax)以及最小值(D fmin),藉由下述式求出。 介電損耗之變化量=D fmax-D fmin The variation of dielectric loss at the above frequency of 28 GHz and 60 GHz can be kept at 65°C, 90%RH for more than 5 days, and then restored to 23±1°C, 52%±1%RH (Elapsed time = 0 minutes), after 4 minutes to 180 minutes, measure the dielectric loss at each frequency every 10 minutes, from the maximum value (D fmax ) and minimum value (D fmin ), by Calculated by the following formula. Variation of dielectric loss = D fmax - D fmin

本發明之黏著劑組合物由於水蒸氣透過度被控制得較低,故能夠抑制水分子於黏著劑組合物中之移動,能夠抑制毫米波之放射損耗之變動。本發明之黏著劑組合物於40℃、92%R.H.下之水蒸氣透過度較佳為430 g/m 2/day以下,更佳為300 g/m 2/day以下,進而較佳為250 g/m 2/day以下,進而更佳為200 g/m 2/day以下,尤佳為150 g/m 2/day以下,最佳為100 g/m 2/day以下、50 g/m 2/day以下或30 g/m 2/day以下。水蒸氣透過度之下限值並無特別限定,例如可為10 g/m 2/day以上,亦可為20 g/m 2/day以上或25 g/m 2/day以上。 The adhesive composition of the present invention can suppress the movement of water molecules in the adhesive composition because the water vapor permeability is controlled to be low, and can suppress the change of the radiation loss of millimeter waves. The water vapor permeability of the adhesive composition of the present invention at 40°C and 92% RH is preferably 430 g/m 2 /day or less, more preferably 300 g/m 2 /day or less, and still more preferably 250 g /m 2 /day or less, more preferably 200 g/m 2 /day or less, particularly preferably 150 g/m 2 /day or less, most preferably 100 g/m 2 /day or less, 50 g/m 2 /day day or less than 30 g/m 2 /day. The lower limit of the water vapor permeability is not particularly limited, and may be, for example, not less than 10 g/m 2 /day, or not less than 20 g/m 2 /day, or not less than 25 g/m 2 /day.

上述水蒸氣透過度(Water Vapor Transmission Rate;WVTR)係基於杯式法測定之值。可藉由如下方法求出:測定於黏著劑層中已與外部隔離之氯化鈣之乾燥狀態之重量(w1)、以及將該樣品放置於40℃、92%R.H.之氛圍中並經過規定時間之時點(吸濕率飽和時)之重量(w2),將重量變化量換算為單位時間(1天)、黏著劑層之單位面積(1 m 2)。 The above water vapor transmission rate (Water Vapor Transmission Rate; WVTR) is based on the value measured by the cup method. It can be obtained by measuring the weight (w1) of the dry state of calcium chloride isolated from the outside in the adhesive layer, and placing the sample in an atmosphere of 40°C and 92%RH for a specified period of time The weight (w2) at the time point (when the moisture absorption rate is saturated), the weight change is converted into the unit time (1 day) and the unit area of the adhesive layer (1 m 2 ).

本發明之黏著劑組合物於28 GHz或60 GHz下之介電常數或介電損耗、飽和吸濕率、由吸濕導致之介電損耗之變化量以及水蒸氣透過度可藉由調整單體組成、添加劑之種類或含量等而進行調整。於本說明書中,於28 GHz或60 GHz下之介電常數或介電損耗係藉由下文揭示之實施例中所記載之方法測定者。The dielectric constant or dielectric loss of the adhesive composition of the present invention at 28 GHz or 60 GHz, the saturated moisture absorption rate, the change in dielectric loss caused by moisture absorption, and the water vapor permeability can be adjusted by adjusting the monomer Adjust the composition, type or content of additives, etc. In this specification, the dielectric constant or dielectric loss at 28 GHz or 60 GHz is measured by the method described in the examples disclosed below.

再者,本發明之黏著劑組合物之介電常數、介電損耗、飽和吸濕率以及水蒸氣透過度係指由本發明之黏著劑組合物形成之黏著劑層的介電常數、介電損耗、以及飽和吸濕率以及水蒸氣透過度。Furthermore, the dielectric constant, dielectric loss, saturated moisture absorption rate, and water vapor permeability of the adhesive composition of the present invention refer to the dielectric constant, dielectric loss, and dielectric constant of the adhesive layer formed from the adhesive composition of the present invention. , and saturated moisture absorption rate and water vapor permeability.

本發明之黏著劑組合物藉由包含特定之甲基丙烯酸酯化合物以及(甲基)丙烯酸酯化合物之混合物、其部分聚合物或共聚物,可將高頻帶下之介電常數、介電損耗控制得較低,而抑制作為介電損耗之惡化原因之吸濕。再者,有時將上述「混合物、其部分聚合物或共聚物」稱為甲基丙烯酸系共聚物。又,「甲基丙烯酸酯化合物」係具有「甲基丙烯醯基」之化合物,「(甲基)丙烯酸酯化合物」係具有「丙烯醯基」以及「甲基丙烯醯基」中之至少任一者之化合物。又,「(甲基)丙烯酸」表示「丙烯酸」以及「甲基丙烯酸」中之任一者或兩者。The adhesive composition of the present invention can control the dielectric constant and dielectric loss at high frequency bands by including a mixture of specific methacrylate compounds and (meth)acrylate compounds, or part of their polymers or copolymers. The value is lower, and the moisture absorption which is the cause of the deterioration of the dielectric loss is suppressed. In addition, the said "mixture, its partial polymer, or copolymer" may be called a methacrylic-type copolymer. Also, the "methacrylate compound" is a compound having a "methacryl group", and the "(meth)acrylate compound" is a compound having at least one of an "acryl group" and a "methacryl group". compound of those. Also, "(meth)acrylic acid" means either or both of "acrylic acid" and "methacrylic acid".

上述部分聚合物意指構成上述混合物之單體成分中之1種或2種以上的單體成分部分地聚合之組合物。The above-mentioned partial polymer means a composition in which one or two or more monomer components constituting the above-mentioned mixture are partially polymerized.

本發明之黏著劑組合物中之上述甲基丙烯酸系共聚物之含量並無特別限定,較佳為75質量%以上(例如75~99.9質量%),更佳為85質量%以上(例如85~99.9質量%)。The content of the above-mentioned methacrylic copolymer in the adhesive composition of the present invention is not particularly limited, but is preferably at least 75% by mass (for example, 75 to 99.9% by mass), more preferably at least 85% by mass (for example, 85 to 99.9% by mass). 99.9% by mass).

[混合物、其部分聚合物或共聚物(甲基丙烯酸系共聚物)] 本發明之黏著劑組合物係將混合物、其部分聚合物或共聚物(甲基丙烯酸系共聚物)作為基礎聚合物之甲基丙烯酸系黏著劑組合物。上述甲基丙烯酸系共聚物之含量並無特別限定,相對於本發明之黏著劑組合物總量100質量%,較佳為75質量%以上(例如75~99.9質量%),較佳為85質量%以上(例如85~99.9質量%)。 [Mixture, its partial polymer or copolymer (methacrylic copolymer)] The adhesive composition of the present invention is a methacrylic adhesive composition using a mixture, a partial polymer thereof, or a copolymer (methacrylic copolymer) as a base polymer. The content of the above-mentioned methacrylic copolymer is not particularly limited, but it is preferably 75% by mass or more (for example, 75 to 99.9% by mass), preferably 85% by mass relative to 100% by mass of the adhesive composition of the present invention. % or more (for example, 85 to 99.9% by mass).

作為本發明之黏著劑組合物,例如可例舉將上述共聚物作為必須成分之水分散型組合物(乳液型組合物)等、或將上述混合物或其部分聚合物作為必須成分之活性能量線硬化型組合物等,其中,較佳為將混合物或其部分聚合物作為必須成分之組合物。As the adhesive composition of the present invention, for example, a water-dispersed composition (emulsion type composition) containing the above-mentioned copolymer as an essential component, or an active energy ray containing the above-mentioned mixture or a partial polymer thereof as an essential component Among them, curable compositions and the like are preferably compositions containing a mixture or a partial polymer thereof as an essential component.

本發明之甲基丙烯酸系共聚物包含具有碳數6以上之烴基之甲基丙烯酸酯化合物、以及具有交聯性官能基之(甲基)丙烯酸酯化合物作為構成單體。The methacrylic copolymer of the present invention contains a methacrylate compound having a hydrocarbon group having 6 or more carbon atoms and a (meth)acrylate compound having a crosslinkable functional group as constituent monomers.

<具有碳數6以上之烴基之甲基丙烯酸酯化合物> 上述甲基丙烯酸系共聚物中使用之甲基丙烯酸酯化合物含有碳數6以上之烴基。上述甲基丙烯酸酯化合物之碳數6以上之烴基較佳為具有脂肪族基、含脂環基或含芳香環基。具有該等烴基之甲基丙烯酸酯化合物可單獨使用或組合兩種以上使用。 <Methacrylate compound having a hydrocarbon group with 6 or more carbon atoms> The methacrylate compound used for the above-mentioned methacrylic copolymer contains a hydrocarbon group having 6 or more carbon atoms. The hydrocarbon group having 6 or more carbon atoms in the methacrylate compound preferably has an aliphatic group, contains an alicyclic group, or contains an aromatic ring group. The methacrylate compound which has these hydrocarbon groups can be used individually or in combination of 2 or more types.

上述甲基丙烯酸系共聚物由於主結構單元源自甲基丙烯酸酯化合物且具有α-甲基,故與源自丙烯酸酯化合物之情形相比,主鏈附近之極化減少,其結果為,認為介電損耗降低。又,甲基丙烯醯基與丙烯醯基相比,疏水性較高,吸濕得以抑制,故能夠抑制由吸濕引起之於高頻帶下之介電損耗之惡化以及其變化量。Since the above-mentioned methacrylic copolymer has an α-methyl group derived from a methacrylate compound as its main structural unit, compared with the case derived from an acrylate compound, the polarization near the main chain is reduced. As a result, it is considered that Dielectric loss is reduced. In addition, methacryl group has higher hydrophobicity than acryl group and suppresses moisture absorption, so it is possible to suppress deterioration and change in dielectric loss in high frequency bands caused by moisture absorption.

若上述甲基丙烯酸酯化合物具有脂環式基或芳香族基,則於甲基丙烯酸系共聚物中容易獲得適度之凝集力,容易獲得強接著性。又,增大凝膠分率而容易獲得優異之耐發泡剝離性。進而,於黏著劑層中容易獲得適度之柔軟性,容易獲得優異之應力緩和性以及優異之階差追隨性。If the above-mentioned methacrylate compound has an alicyclic group or an aromatic group, it is easy to obtain moderate cohesive force in the methacrylic copolymer, and it is easy to obtain strong adhesiveness. In addition, it is easy to obtain excellent foaming and peeling resistance by increasing the gel fraction. Furthermore, it is easy to obtain moderate flexibility in the adhesive layer, and it is easy to obtain excellent stress relaxation property and excellent step followability.

上述碳數6以上之烴基為脂肪族基時之上述烴基中之碳數較佳為8以上,更佳為9以上,進而較佳為10以上。上述烴基中之碳數較佳為22以下,更佳為20以下,進而較佳為16以下。When the above-mentioned hydrocarbon group having 6 or more carbon atoms is an aliphatic group, the number of carbon atoms in the above-mentioned hydrocarbon group is preferably 8 or more, more preferably 9 or more, and still more preferably 10 or more. The number of carbon atoms in the hydrocarbon group is preferably 22 or less, more preferably 20 or less, and still more preferably 16 or less.

作為上述碳數6以上之烴基為脂肪族基之甲基丙烯酸酯化合物,例如可例舉:甲基丙烯酸己酯、甲基丙烯酸庚酯、甲基丙烯酸辛酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸異辛酯、甲基丙烯酸壬酯、甲基丙烯酸異壬酯、甲基丙烯酸癸酯、甲基丙烯酸異癸酯、甲基丙烯酸十一烷基酯、甲基丙烯酸月桂酯、甲基丙烯酸十三烷基酯、甲基丙烯酸十四烷基酯、甲基丙烯酸十五烷基酯、甲基丙烯酸十六烷基酯、甲基丙烯酸十七烷基酯、甲基丙烯酸十八烷基酯、甲基丙烯酸異硬脂酯、甲基丙烯酸硬脂酯、甲基丙烯酸十九烷基酯、甲基丙烯酸二十烷基酯等。其中,較佳為甲基丙烯酸月桂酯、甲基丙烯酸十三烷基酯、甲基丙烯酸異癸酯。Examples of methacrylate compounds in which the hydrocarbon group having 6 or more carbon atoms is an aliphatic group include hexyl methacrylate, heptyl methacrylate, octyl methacrylate, and 2-ethylhexyl methacrylate. ester, isooctyl methacrylate, nonyl methacrylate, isononyl methacrylate, decyl methacrylate, isodecyl methacrylate, undecyl methacrylate, lauryl methacrylate, Tridecyl Methacrylate, Myristyl Methacrylate, Pentadecyl Methacrylate, Hexadecyl Methacrylate, Heptadecyl Methacrylate, Octadecyl Methacrylate Alkyl esters, isostearyl methacrylate, stearyl methacrylate, nonadecyl methacrylate, eicosyl methacrylate, etc. Among them, lauryl methacrylate, tridecyl methacrylate, and isodecyl methacrylate are preferable.

本發明之甲基丙烯酸系共聚物中之上述碳數6以上之烴基為脂肪族基之甲基丙烯酸酯化合物的含量並無特別限定,相對於全部結構單元100質量%,較佳為25質量%以上,更佳為25.0~99.5質量%,進而較佳為30.0~99.3質量%,進而更佳為40.0~99.0質量%。從於高頻帶下之低介電常數化、低介電損耗化方面考慮,較佳為使用25質量%以上。The content of the methacrylate compound in which the hydrocarbon group having 6 or more carbon atoms is an aliphatic group in the methacrylic copolymer of the present invention is not particularly limited, but is preferably 25% by mass relative to 100% by mass of all structural units More preferably, it is 25.0-99.5 mass %, More preferably, it is 30.0-99.3 mass %, More preferably, it is 40.0-99.0 mass %. From the viewpoint of low dielectric constant and low dielectric loss in high frequency bands, it is preferable to use 25% by mass or more.

上述碳數6以上之烴基為含脂環基時之上述烴基中之碳數較佳為6以上,更佳為8以上。上述烴基中之碳數較佳為22以下,更佳為16以下。When the above-mentioned hydrocarbon group having 6 or more carbon atoms contains an alicyclic group, the number of carbon atoms in the above-mentioned hydrocarbon group is preferably 6 or more, more preferably 8 or more. The carbon number in the above-mentioned hydrocarbon group is preferably 22 or less, more preferably 16 or less.

作為上述碳數6以上之烴基為含脂環基之甲基丙烯酸酯化合物,例如可例舉:具有環烷烴環(環戊烷環、環己烷環、環庚烷環、環辛烷環等)之甲基丙烯酸環烷基酯、具有二環式烴環(蒎烷、蒎烯、𦯉烷、降𦯉烷、降莰烯等)之甲基丙烯酸酯、以及具有三環以上之脂肪族烴環(雙環戊烷環、雙環戊烯環、金剛烷環、三環戊烷環、三環戊烯環等)之甲基丙烯酸酯等。Examples of methacrylate compounds in which the above-mentioned hydrocarbon group having 6 or more carbon atoms is an alicyclic group include: ) cycloalkyl methacrylates, methacrylates with bicyclic hydrocarbon rings (pinane, pinene, alkanes, nor-alkanes, nor-camphenes, etc.), and aliphatic hydrocarbons with more than three rings Ring (dicyclopentane ring, dicyclopentene ring, adamantane ring, tricyclopentane ring, tricyclopentene ring, etc.) methacrylate, etc.

作為上述甲基丙烯酸環烷基酯,例如可例舉:甲基丙烯酸環己酯、甲基丙烯酸3,3,5-三甲基環己酯、甲基丙烯酸環庚酯、甲基丙烯酸環辛酯等。Examples of the cycloalkyl methacrylate include cyclohexyl methacrylate, 3,3,5-trimethylcyclohexyl methacrylate, cycloheptyl methacrylate, and cyclooctyl methacrylate. Esters etc.

作為上述具有二環式烴環之甲基丙烯酸酯,例如可例舉甲基丙烯酸𦯉酯、甲基丙烯酸異𦯉酯等。As the methacrylate having the above-mentioned bicyclic hydrocarbon ring, methacrylate, isomethacrylate, etc. may, for example, be mentioned.

作為上述具有三環以上之烴環之甲基丙烯酸酯,例如可例舉:甲基丙烯酸雙環戊酯、甲基丙烯酸雙環戊氧基乙酯、甲基丙烯酸三環戊酯、甲基丙烯酸1-金剛烷基酯、甲基丙烯酸2-甲基-2-金剛烷基酯、甲基丙烯酸2-乙基-2-金剛烷基酯等。Examples of methacrylates having hydrocarbon rings having three or more rings include: dicyclopentyl methacrylate, dicyclopentyloxyethyl methacrylate, tricyclopentyl methacrylate, 1- Adamantyl ester, 2-methyl-2-adamantyl methacrylate, 2-ethyl-2-adamantyl methacrylate, and the like.

上述碳數6以上之烴基為含芳香環基時之上述烴基中之碳數較佳為6~14,更佳為6~10。When the above-mentioned hydrocarbon group having 6 or more carbon atoms is an aromatic ring group, the carbon number in the above-mentioned hydrocarbon group is preferably 6-14, more preferably 6-10.

作為上述碳數6以上之烴基為含芳香環基之甲基丙烯酸酯化合物,例如可例舉具有芳香族性碳環(例如苯環等單環碳環、或萘環等縮合碳環等)之化合物,作為具體例,例如可例舉:甲基丙烯酸苄酯、甲基丙烯酸苯酯、甲基丙烯酸萘酯、甲基丙烯酸6-(1,1'-聯苯基-4-氧基)己酯等。The above-mentioned hydrocarbon group having 6 or more carbon atoms is a methacrylate compound containing an aromatic ring group, for example, one having an aromatic carbocycle (such as a monocyclic carbocycle such as a benzene ring, or a condensed carbocycle such as a naphthalene ring, etc.) Specific examples of the compound include: benzyl methacrylate, phenyl methacrylate, naphthyl methacrylate, 6-(1,1'-biphenyl-4-oxy)hexyl methacrylate Esters etc.

本發明之甲基丙烯酸系共聚物中之上述碳數6以上之烴基為含脂環基或含芳香環基之甲基丙烯酸酯化合物的合計含量並無特別限定,相對於全部結構單元100質量%,較佳為1.0~60.0質量%,更佳為5.0~55.0質量%,進而較佳為10.0~50.0質量%。In the methacrylic copolymer of the present invention, the total content of the above-mentioned hydrocarbon group having 6 or more carbon atoms as an alicyclic group-containing or aromatic ring-containing methacrylate compound is not particularly limited, and is 100% by mass relative to all structural units. , preferably 1.0 to 60.0 mass %, more preferably 5.0 to 55.0 mass %, further preferably 10.0 to 50.0 mass %.

上述甲基丙烯酸酯化合物可具有(聚)氧伸烷基鏈。於具有(聚)氧伸烷基鏈之情形時,上述碳數6以上之烴基較佳為於上述甲基丙烯酸酯化合物中之酯部之末端具有。上述(聚)氧伸烷基鏈中之氧原子數(即,氧伸烷基之重複數)較佳為1~10,更佳為1~3。上述於末端具有之碳數6以上之烴基可為脂肪族基、脂環式基、芳香族基中之任一種,但較佳為脂環式基或芳香族基,尤佳為芳香族基。The above-mentioned methacrylate compound may have a (poly)oxyalkylene chain. When having a (poly)oxyalkylene chain, it is preferable to have the said hydrocarbon group of 6 or more carbon atoms at the terminal of the ester part in the said methacrylate compound. The number of oxygen atoms in the (poly)oxyalkylene chain (ie, the number of repetitions of the oxyalkylene group) is preferably 1-10, more preferably 1-3. The above-mentioned hydrocarbon group having 6 or more carbon atoms at the terminal may be any of aliphatic group, alicyclic group, and aromatic group, but is preferably an alicyclic group or an aromatic group, and is particularly preferably an aromatic group.

本發明之甲基丙烯酸系共聚物中之上述具有(聚)氧伸烷基鏈之甲基丙烯酸酯化合物的含量並無特別限定,相對於全部結構單元100質量%,較佳為1.0~30.0質量%,更佳為5.0~25.0質量%,進而較佳為10.0~20.0質量%。The content of the above-mentioned methacrylate compound having a (poly)oxyalkylene chain in the methacrylic copolymer of the present invention is not particularly limited, but is preferably 1.0 to 30.0% by mass relative to 100% by mass of all structural units %, more preferably 5.0 to 25.0 mass %, still more preferably 10.0 to 20.0 mass %.

於上述具有(聚)氧伸烷基鏈之甲基丙烯酸酯化合物中,當於末端具有芳香族基之情形時,重複單元整體中之極化率降低,故對降低於高頻帶下之介電損耗較有效。In the above-mentioned methacrylate compound having a (poly)oxyalkylene chain, when there is an aromatic group at the end, the polarizability of the repeating unit as a whole is lowered, so the dielectric strength lowered in the high frequency band Loss is more effective.

相對於全部結構單元100質量%,上述甲基丙烯酸系共聚物中之上述具有碳數6以上之烴基之甲基丙烯酸酯化合物的合計含量較佳為25質量%以上,更佳為25.0~99.5質量%,進而較佳為30.0~99.3質量%,尤佳為40.0~99.0質量%。從於高頻帶下之低介電常數化、低介電損耗化方面考慮,較佳為使用25質量%以上。The total content of the methacrylate compounds having a hydrocarbon group having 6 or more carbon atoms in the methacrylic copolymer is preferably at least 25% by mass, more preferably 25.0 to 99.5% by mass, based on 100% by mass of all structural units. %, more preferably 30.0 to 99.3% by mass, particularly preferably 40.0 to 99.0% by mass. From the viewpoint of low dielectric constant and low dielectric loss in high frequency bands, it is preferable to use 25% by mass or more.

<含交聯性官能基之(甲基)丙烯酸酯化合物> 上述甲基丙烯酸系共聚物含有於酯部具有交聯性官能基之含交聯性官能基之(甲基)丙烯酸酯化合物,故於使用交聯劑之情形時,產生交聯而增大凝膠分率,容易獲得優異之耐發泡剝離性。又,由於容易獲得良好之凝集力,故容易獲得強接著性。進而,容易抑制於高濕環境下產生之黏著片材之變白。 <(Meth)acrylate Compounds Containing Crosslinkable Functional Groups> The above-mentioned methacrylic copolymer contains a crosslinkable functional group-containing (meth)acrylate compound having a crosslinkable functional group in the ester portion, so when a crosslinking agent is used, crosslinking occurs and the coagulation is increased. Adhesive fraction, easy to obtain excellent resistance to foaming and peeling. Also, since it is easy to obtain good cohesive force, it is easy to obtain strong adhesiveness. Furthermore, it is easy to suppress whitening of the adhesive sheet which occurs in a high-humidity environment.

作為上述含交聯性官能基之(甲基)丙烯酸酯化合物所具有之交聯性官能基,從容易調整凝膠分率方面考慮,例如可例舉:羥基、羧基、酸酐基、縮水甘油基等含環氧基之基、異氰酸基、氮丙啶基等。其中,從容易調整凝膠分率方面考慮,較佳為羥基。上述含交聯性官能基之(甲基)丙烯酸酯化合物可單獨使用或組合兩種以上使用。Examples of the crosslinkable functional group contained in the above-mentioned crosslinkable functional group-containing (meth)acrylate compound include hydroxyl group, carboxyl group, acid anhydride group, and glycidyl group from the viewpoint of easy adjustment of the gel fraction. Such as groups containing epoxy groups, isocyanate groups, aziridinyl groups, etc. Among them, a hydroxyl group is preferable from the viewpoint of easy adjustment of the gel fraction. The said crosslinkable functional group containing (meth)acrylate compound can be used individually or in combination of 2 or more types.

作為上述具有羥基之含交聯性官能基之(甲基)丙烯酸酯化合物,例如可例舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸羥基辛酯、(甲基)丙烯酸羥基癸酯、(甲基)丙烯酸羥基月桂酯、(甲基)丙烯酸4-羥基甲基環己酯等。其中,從容易獲得良好之凝集力,容易獲得高溫下之接著可靠性方面考慮,較佳為(甲基)丙烯酸2-羥基乙酯。Examples of the crosslinkable functional group-containing (meth)acrylate compound having a hydroxyl group include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, (meth)acrylate ) 2-hydroxybutyl acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, Hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, 4-hydroxymethylcyclohexyl (meth)acrylate, etc. Among them, 2-hydroxyethyl (meth)acrylate is preferred from the viewpoints of easily obtaining good cohesive force and adhesive reliability at high temperature.

相對於全部結構單元100質量%,本發明之甲基丙烯酸系共聚物中之上述含交聯性官能基之(甲基)丙烯酸酯化合物的含量較佳為0.1~30.0質量%,更佳為0.2~20.0質量%,進而較佳為0.3~10.0質量%,尤佳為0.5~5.0質量%。從調整凝膠分率方面考慮,較佳為使用0.1質量%以上,從於高頻帶下之低介電常數化、低介電損耗化方面考慮,較佳為使用30.0質量%以下。The content of the crosslinkable functional group-containing (meth)acrylate compound in the methacrylic copolymer of the present invention is preferably 0.1 to 30.0 mass %, more preferably 0.2 mass %, relative to 100 mass % of all structural units. ~20.0 mass%, More preferably, it is 0.3-10.0 mass%, Most preferably, it is 0.5-5.0 mass%. From the viewpoint of adjusting the gel fraction, it is preferable to use 0.1 mass % or more, and it is preferable to use 30.0 mass % or less from the viewpoint of low dielectric constant and low dielectric loss in a high frequency band.

<共聚性單體> 上述甲基丙烯酸系共聚物除了上述具有碳數6以上之烴基之甲基丙烯酸酯化合物、含交聯性官能基之(甲基)丙烯酸酯化合物以外,亦可含有共聚性單體。共聚性單體可單獨使用或組合兩種以上使用。 <Copolymerizable monomer> The above-mentioned methacrylic copolymer may contain a copolymerizable monomer in addition to the above-mentioned methacrylate compound having a hydrocarbon group having 6 or more carbon atoms and the crosslinkable functional group-containing (meth)acrylate compound. A copolymerizable monomer can be used individually or in combination of 2 or more types.

作為上述共聚性單體,例如可例舉:具有碳數1~24之烴基之丙烯酸酯化合物、具有碳數1~5之烴基之甲基丙烯酸酯化合物、主鏈之重複單元之所有碳具有側鏈之取代亞甲基化合物、含雜環單體、含羧基單體、含腈基單體、含異氰酸基單體、含醯胺基單體、含胺基單體、具有碳數5以下之烷氧基之(甲基)丙烯酸烷氧基烷基酯、含磺酸基單體、含磷酸基單體、乙烯酯類(乙酸乙烯酯、丙酸乙烯酯等)、芳香族乙烯系化合物(苯乙烯、乙烯基甲苯等)、烯烴類或二烯類(乙烯、丙烯、丁二烯、異戊二烯、異丁烯等)、乙烯醚類(乙烯基烷基醚等)、氯乙烯、乙烯醇、重量平均分子量30000以下之巨單體、具有2個以上之聚合性官能基之多官能性單體等。該等可單獨使用或組合兩種以上使用。Examples of the above-mentioned copolymerizable monomers include: acrylate compounds having a hydrocarbon group having 1 to 24 carbons, methacrylate compounds having a hydrocarbon group having 1 to 5 carbons, and all carbons in the repeating unit of the main chain having side Chain substituted methylene compounds, heterocycle-containing monomers, carboxyl-containing monomers, nitrile-containing monomers, isocyanate-containing monomers, amide-containing monomers, amine-containing monomers, having 5 carbon atoms The following alkoxy alkoxyalkyl (meth)acrylates, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, vinyl esters (vinyl acetate, vinyl propionate, etc.), aromatic vinyl series Compounds (styrene, vinyl toluene, etc.), olefins or dienes (ethylene, propylene, butadiene, isoprene, isobutylene, etc.), vinyl ethers (vinyl alkyl ether, etc.), vinyl chloride, Vinyl alcohol, macromonomers with a weight average molecular weight of 30,000 or less, polyfunctional monomers with two or more polymerizable functional groups, etc. These can be used individually or in combination of 2 or more types.

再者,本發明之黏著劑組合物較佳為不含或實質上不含含酸性基單體(例如含羧基單體、含磺基單體、含磷酸基單體等)。該構成於可獲得對於天線元件或配線之優異之防腐蝕效果方面較佳。再者,相對於上述黏著劑組合物總量,含酸性基單體之含量較佳為0.05重量%以下(例如0~0.05重量%)、更佳為0.01重量%以下(例如0~0.01重量%)、進而較佳為0.001重量%以下(例如0~0.001重量%)者可認為實質上不含。Furthermore, the adhesive composition of the present invention preferably does not contain or substantially does not contain acidic group-containing monomers (such as carboxyl group-containing monomers, sulfo group-containing monomers, phosphoric acid group-containing monomers, etc.). This configuration is preferable in that an excellent anti-corrosion effect on antenna elements and wiring can be obtained. Furthermore, relative to the total amount of the above-mentioned adhesive composition, the content of the acidic group-containing monomer is preferably 0.05% by weight or less (such as 0-0.05% by weight), more preferably 0.01% by weight or less (such as 0-0.01% by weight ), and more preferably 0.001% by weight or less (for example, 0 to 0.001% by weight) can be regarded as substantially free.

上述共聚性單體之中,含雜環單體、含羧基單體、含醯胺基單體、含胺基單體、含磺酸基單體、含磷酸基單體於黏著劑層容易獲得適度之凝集力,容易增大對於玻璃板或丙烯酸板之180°剝離接著力而獲得強接著性方面較佳,從防止金屬之腐蝕方面考慮,更佳為含雜環單體。Among the above-mentioned copolymerizable monomers, heterocyclic monomers, carboxyl-containing monomers, amide-containing monomers, amine-containing monomers, sulfonic acid-containing monomers, and phosphoric acid-containing monomers are easily available in the adhesive layer Moderate cohesion is better in terms of easily increasing the 180° peeling adhesion to glass plates or acrylic plates to obtain strong adhesion. From the perspective of preventing metal corrosion, heterocyclic monomers are more preferred.

作為上述具有碳數1~5之烴基之甲基丙烯酸酯化合物,例如可例舉:甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸丁酯、甲基丙烯酸戊酯、甲基丙烯酸異丙酯、甲基丙烯酸異丁酯、甲基丙烯酸第二丁酯、甲基丙烯酸第三丁酯、甲基丙烯酸異戊酯等。Examples of the methacrylate compound having a hydrocarbon group having 1 to 5 carbon atoms include methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, and pentyl methacrylate. ester, isopropyl methacrylate, isobutyl methacrylate, second butyl methacrylate, third butyl methacrylate, isoamyl methacrylate, etc.

作為上述具有碳數1~24之烴基之丙烯酸酯化合物,例如可例舉:丙烯酸甲酯、丙烯酸乙酯、丙烯酸丙酯、丙烯酸異丙酯、丙烯酸丁酯、丙烯酸異丁酯、丙烯酸第二丁酯、丙烯酸第三丁酯、丙烯酸戊酯、丙烯酸異戊酯、丙烯酸己酯、丙烯酸庚酯、丙烯酸辛酯、丙烯酸異辛酯、丙烯酸2-乙基己酯、丙烯酸壬酯、丙烯酸癸酯、丙烯酸異癸酯、丙烯酸十一烷基酯、丙烯酸十二烷基酯、丙烯酸月桂酯、丙烯酸十三烷基酯、丙烯酸十四烷基酯、丙烯酸十五烷基酯、丙烯酸十六烷基酯、丙烯酸十七烷基酯、丙烯酸十八烷基酯、丙烯酸異硬脂酯、丙烯酸硬脂酯、丙烯酸十九烷基酯、丙烯酸二十烷基酯、丙烯酸環己酯、丙烯酸3,3,5-三甲基環己酯、丙烯酸環庚酯、丙烯酸環辛酯、丙烯酸𦯉酯、丙烯酸異𦯉酯、丙烯酸雙環戊酯、丙烯酸雙環戊氧基乙酯、丙烯酸三環戊酯、丙烯酸1-金剛烷基酯、丙烯酸2-甲基-2-金剛烷基酯、丙烯酸2-乙基-2-金剛烷基酯、丙烯酸苯酯、丙烯酸萘酯、丙烯酸6-(1,1'-聯苯基-4-氧基)己酯等。Examples of the acrylate compound having a hydrocarbon group having 1 to 24 carbon atoms include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, and second butyl acrylate. ester, tertiary butyl acrylate, pentyl acrylate, isopentyl acrylate, hexyl acrylate, heptyl acrylate, octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, nonyl acrylate, decyl acrylate, Isodecyl Acrylate, Undecyl Acrylate, Lauryl Acrylate, Lauryl Acrylate, Tridecyl Acrylate, Myristyl Acrylate, Pentadecyl Acrylate, Hexadecyl Acrylate , heptadecyl acrylate, stearyl acrylate, isostearyl acrylate, stearyl acrylate, nonadecyl acrylate, eicosyl acrylate, cyclohexyl acrylate, acrylate 3,3, 5-trimethylcyclohexyl, cycloheptyl acrylate, cyclooctyl acrylate, methacrylate, isomethacrylate, dicyclopentanyl acrylate, dicyclopentyloxyethyl acrylate, tricyclopentanyl acrylate, 1-acrylate Adamantyl acrylate, 2-methyl-2-adamantyl acrylate, 2-ethyl-2-adamantyl acrylate, phenyl acrylate, naphthyl acrylate, 6-(1,1'-biphenyl acrylate Base-4-oxy)hexyl ester, etc.

上述含雜環單體係具有如下等雜環之共聚性單體:僅具有氮原子作為雜原子之雜環(吡咯啶、吡咯、咪唑、吡唑、哌啶、吡啶、嘧啶、吡咯啉、哌𠯤、吡𠯤等)、具有氮原子以及氧原子之雜環(吡咯啶酮、㗁唑、異㗁唑、嗎啉、嗎啉酮、哌啶酮、內醯胺、㗁𠯤、嗎啉二酮、丁二醯亞胺、醯亞胺等)、具有氮原子以及硫原子之雜環(噻唑、異噻唑、噻𠯤等)、具有氧原子之雜環(內酯、四氫呋喃、呋喃、四氫哌喃、二㗁烷等)、具有硫原子之雜環(四氫噻吩、噻吩、四氫噻喃、噻喃等)。The above-mentioned heterocyclic monomer system has a heterocyclic copolymerizable monomer such as the following: a heterocyclic ring having only a nitrogen atom as a heteroatom (pyrrolidine, pyrrole, imidazole, pyrazole, piperidine, pyridine, pyrimidine, pyrroline, piperidine, etc.) 𠯤, pyridone, etc.), heterocycles with nitrogen and oxygen atoms (pyrrolidone, oxazole, isoxazole, morpholine, morpholone, piperidone, lactam, 㗁𠯤, morpholinedione , succinimide, imine, etc.), heterocycles with nitrogen and sulfur atoms (thiazole, isothiazole, thiamine, etc.), heterocycles with oxygen atoms (lactone, tetrahydrofuran, furan, tetrahydropiper Furan, dioxane, etc.), heterocycles with sulfur atoms (tetrahydrothiophene, thiophene, tetrahydrothiopyran, thiopyran, etc.).

若本發明之甲基丙烯酸系共聚物含有含雜環單體,則於黏著劑層中可獲得適度之柔軟性,容易獲得優異之應力緩和性以及優異之階差追隨性。If the methacrylic acid-based copolymer of the present invention contains a heterocyclic monomer, moderate flexibility can be obtained in the adhesive layer, and excellent stress relaxation and excellent step followability can be easily obtained.

作為具有上述僅具有氮原子作為雜原子之雜環之含雜環單體,例如可例舉:N-乙烯基吡啶、N-乙烯基哌啶酮、N-乙烯基嘧啶、N-乙烯基哌𠯤、N-乙烯基吡𠯤、N-乙烯基吡咯、N-乙烯基咪唑、N-(甲基)丙烯醯基哌啶、N-(甲基)丙烯醯基吡咯啶、N-乙烯基吡唑等。As the heterocyclic ring-containing monomer having the above-mentioned heterocyclic ring having only a nitrogen atom as a heteroatom, for example, N-vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine, N-vinylpiperidine 𠯤, N-vinylpyrrole, N-vinylpyrrole, N-vinylimidazole, N-(meth)acrylpiperidine, N-(meth)acrylpyrrolidine, N-vinylpyrrole azole etc.

作為具有上述具有氮原子以及氧原子作為雜原子之雜環之含雜環單體,例如可例舉:N-乙烯基-2-吡咯啶酮、N-甲基乙烯基吡咯啶酮、N-(甲基)丙烯醯基-2-吡咯啶酮、N-乙烯基㗁唑、N-乙烯基異㗁唑、N-乙烯基嗎啉、N-乙烯基-3-嗎啉酮、N-乙烯基-2-己內醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-乙烯基-1,3-㗁 𠯤-2-酮、N-乙烯基-3,5-嗎啉二酮、N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-8-氧基六亞甲基丁二醯亞胺、N-甲基醯亞胺、N-乙基醯亞胺、N-丁基醯亞胺、N-辛基醯亞胺、N-2-乙基己基醯亞胺、N-環己基醯亞胺、N-月桂基醯亞胺等。As the heterocycle-containing monomer having the above-mentioned heterocycle having a nitrogen atom and an oxygen atom as a heteroatom, for example, N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N- (Meth)acryl-2-pyrrolidone, N-vinylxazole, N-vinylisoxazole, N-vinylmorpholine, N-vinyl-3-morpholinone, N-vinyl N-2-caprolactamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-vinyl-1,3-㗁𠯤 -2-ketone, N-vinyl-3,5-morpholinedione, N-(meth)acryloxymethylenesuccinimide, N-(meth)acryl-6- Oxyhexamethylene succinimide, N-(meth)acryl-8-oxyhexamethylene succinimide, N-methyl succinimide, N-ethyl succinimide Amines, N-butylimide, N-octylimide, N-2-ethylhexylimide, N-cyclohexylimide, N-laurylimide, and the like.

作為具有上述含有氮原子以及硫原子作為雜原子之雜環之含雜環單體,例如可例舉N-乙烯基噻唑、N-乙烯基異噻唑等。Examples of the heterocyclic ring-containing monomer having a heterocyclic ring containing a nitrogen atom and a sulfur atom as a heteroatom include N-vinylthiazole and N-vinylisothiazole.

該等之中,尤佳為N-乙烯基-2-吡咯啶酮。Among these, N-vinyl-2-pyrrolidone is particularly preferred.

作為上述含羧基單體,例如可例舉:(甲基)丙烯酸、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸等。又,上述含羧基單體中例如包含順丁烯二酸酐、伊康酸酐等含酸酐基單體。又,例如亦可為與伊康酸等進行酯鍵結而成之衍生物。As said carboxyl group-containing monomer, (meth)acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, etc. are mentioned, for example. Moreover, acid anhydride group containing monomers, such as maleic anhydride and itaconic anhydride, are contained in the said carboxyl group containing monomer, for example. Moreover, for example, a derivative obtained by ester-bonding with itaconic acid or the like may be used.

作為上述含腈基單體,例如可例舉(甲基)丙烯腈等。As said nitrile group containing monomer, (meth)acrylonitrile etc. are mentioned, for example.

作為上述含異氰酸基單體,例如可例舉(甲基)丙烯酸2-異氰酸基乙酯等。As said isocyanate group containing monomer, 2-isocyanatoethyl (meth)acrylate etc. are mentioned, for example.

作為上述含醯胺基單體,例如可例舉:(甲基)丙烯醯胺類;N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二丙基(甲基)丙烯醯胺、N,N-二異丙基(甲基)丙烯醯胺、N,N-二(正丁基)(甲基)丙烯醯胺、N,N-二(第三丁基)(甲基)丙烯醯胺等N,N-二烷基(甲基)丙烯醯胺;N-乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-正丁基(甲基)丙烯醯胺等N-烷基(甲基)丙烯醯胺;N-乙烯基乙醯胺等N-乙烯基羧醯胺類;具有羥基與醯胺基之單體,例如N-(2-羥基乙基)(甲基)丙烯醯胺、N-(2-羥基丙基)(甲基)丙烯醯胺、N-(1-羥基丙基)(甲基)丙烯醯胺、N-(3-羥基丙基)(甲基)丙烯醯胺、N-(2-羥基丁基)(甲基)丙烯醯胺、N-(3-羥基丁基)(甲基)丙烯醯胺、N-(4-羥基丁基)(甲基)丙烯醯胺等N-羥基烷基(甲基)丙烯醯胺;具有烷氧基與醯胺基之單體,例如N-甲氧基甲基(甲基)丙烯醯胺、N-甲氧基乙基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺等N-烷氧基烷基(甲基)丙烯醯胺;此外之N,N-二甲基胺基丙基(甲基)丙烯醯胺、N-(甲基)丙烯醯基嗎啉等。Examples of the amide group-containing monomer include: (meth)acrylamides; N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide Amide, N,N-dipropyl(meth)acrylamide, N,N-diisopropyl(meth)acrylamide, N,N-di(n-butyl)(meth)acrylamide Amine, N,N-di(tert-butyl)(meth)acrylamide and other N,N-dialkyl(meth)acrylamide; N-ethyl(meth)acrylamide, N- N-alkyl(meth)acrylamides such as isopropyl(meth)acrylamide, N-butyl(meth)acrylamide, N-n-butyl(meth)acrylamide; N- N-vinylcarboxamides such as vinylacetamide; monomers with hydroxyl and amido groups, such as N-(2-hydroxyethyl)(meth)acrylamide, N-(2-hydroxypropyl base) (meth)acrylamide, N-(1-hydroxypropyl)(meth)acrylamide, N-(3-hydroxypropyl)(meth)acrylamide, N-(2-hydroxypropyl) N-hydroxyalkyl groups such as butyl)(meth)acrylamide, N-(3-hydroxybutyl)(meth)acrylamide, N-(4-hydroxybutyl)(meth)acrylamide, etc. (Meth)acrylamide; monomers with alkoxy and amide groups, such as N-methoxymethyl(meth)acrylamide, N-methoxyethyl(meth)acrylamide , N-butoxymethyl(meth)acrylamide and other N-alkoxyalkyl(meth)acrylamide; in addition, N,N-dimethylaminopropyl(meth)acrylamide Amines, N-(meth)acryloylmorpholine, etc.

又,上述(甲基)丙烯醯胺類中例如亦包含各種N-烷氧基烷基(甲基)丙烯醯胺,例如可例舉N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺等。In addition, the above-mentioned (meth)acrylamides include, for example, various N-alkoxyalkyl(meth)acrylamides, for example, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide and the like.

作為上述含胺基單體,例如可例舉:(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等。Examples of the amino group-containing monomer include: Aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, tert-butylamine (meth)acrylate ethyl ethyl ester etc.

作為上述具有碳數5以下之烷氧基之(甲基)丙烯酸烷氧基烷基酯,例如可例舉:(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸甲氧基三乙二醇酯、(甲基)丙烯酸3-甲氧基丙酯、(甲基)丙烯酸3-乙氧基丙酯、(甲基)丙烯酸4-甲氧基丁酯、(甲基)丙烯酸4-乙氧基丁酯等。Examples of the alkoxyalkyl (meth)acrylate having an alkoxy group having 5 or less carbon atoms include: 2-methoxyethyl (meth)acrylate, 2-ethyl (meth)acrylate Oxyethyl ester, Methoxytriethylene glycol (meth)acrylate, 3-methoxypropyl (meth)acrylate, 3-ethoxypropyl (meth)acrylate, (meth)acrylic acid 4-methoxybutyl, 4-ethoxybutyl (meth)acrylate, etc.

作為上述含磺酸基單體,例如可例舉乙烯基磺酸鈉等。As said sulfonic acid group containing monomer, vinylsulfonate sodium etc. are mentioned, for example.

上述巨單體係複數種上述單體成分進行聚合而成之高分子量單體。於使用巨單體之情形時,於基礎聚合物中,源自構成巨單體之單體成分之結構單元會某程度連續地存在。因此,藉由使用巨單體,可於基礎聚合物中導入源自巨單體之高次結構,可容易地調整作為黏著劑所要求之特性(接著力或凝集力、階差追隨性等)。上述巨單體之重量平均分子量較佳為3000~35000,更佳為4000~30000,進而較佳為5000~25000,進而更佳為6000~20000。The above-mentioned macromonomer system is a high-molecular-weight monomer obtained by polymerizing a plurality of the above-mentioned monomer components. In the case of using a macromonomer, structural units derived from monomer components constituting the macromonomer exist continuously to some extent in the base polymer. Therefore, by using a macromonomer, a high-order structure derived from a macromonomer can be introduced into the base polymer, and the properties required as an adhesive (adhesive force or cohesive force, step followability, etc.) can be easily adjusted . The weight average molecular weight of the macromonomer is preferably 3,000-35,000, more preferably 4,000-30,000, more preferably 5,000-25,000, and even more preferably 6,000-20,000.

作為上述具有2個以上之聚合性官能基之多官能性單體,例如可例舉:己二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯苯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯等。多官能性單體可單獨使用或組合兩種以上使用。Examples of the polyfunctional monomer having two or more polymerizable functional groups include: hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol Alcohol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate , dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl (meth)acrylate, (meth) Vinyl acrylate, divinylbenzene, polyester acrylate, urethane acrylate, etc. A polyfunctional monomer can be used individually or in combination of 2 or more types.

本發明之甲基丙烯酸系共聚物中之上述多官能性單體之含量並無特別限定,相對於全部結構單元100質量%,較佳為0.5質量%以下(例如0~0.5質量%),更佳為0~0.35質量%,進而較佳為0~0.2質量%。若上述多官能性單體之含量為0.5質量%以下,則黏著劑層具有適度之凝集力,黏著力或階差吸收性容易提高而較佳。再者,於使用交聯劑之情形時,亦可不使用多官能性單體,不使用交聯劑時之多官能性單體之含量較佳為0.001~0.5質量%,更佳為0.001~0.35質量%,進而較佳為0.002~0.2質量%。The content of the polyfunctional monomer in the methacrylic copolymer of the present invention is not particularly limited, but is preferably 0.5% by mass or less (for example, 0 to 0.5% by mass) relative to 100% by mass of all structural units, and more preferably Preferably, it is 0-0.35 mass %, More preferably, it is 0-0.2 mass %. If the content of the above polyfunctional monomer is 0.5% by mass or less, the adhesive layer has moderate cohesive force, and the adhesive force or step absorbability is likely to be improved, which is preferable. Furthermore, when a crosslinking agent is used, the polyfunctional monomer may not be used, and the content of the polyfunctional monomer when not using a crosslinking agent is preferably 0.001 to 0.5% by mass, more preferably 0.001 to 0.35% by mass. % by mass, and more preferably 0.002 to 0.2% by mass.

上述甲基丙烯酸系共聚物中之上述共聚性單體之合計含量並無特別限定,相對於全部結構單元100質量%,較佳為30.0質量%以下,更佳為15.0質量%以下。The total content of the above-mentioned copolymerizable monomers in the above-mentioned methacrylic copolymer is not particularly limited, but is preferably 30.0% by mass or less, more preferably 15.0% by mass or less, based on 100% by mass of all structural units.

上述甲基丙烯酸系共聚物可藉由使上述具有碳數6以上之烴基之甲基丙烯酸酯化合物、含交聯性官能基之(甲基)丙烯酸酯化合物以及共聚性單體混合,或者藉由公知或慣用之聚合方法聚合所獲得。作為上述聚合方法,例如可例舉:溶液聚合方法、乳化聚合方法、塊狀聚合方法、利用活性能量線照射之聚合方法(活性能量線聚合方法)等。其中,從黏著劑層之透明性、耐水性、成本等方面考慮,較佳為溶液聚合方法、活性能量線聚合方法,更佳為活性能量線聚合方法。The above-mentioned methacrylic copolymer can be obtained by mixing the above-mentioned methacrylate compound having a hydrocarbon group having 6 or more carbon atoms, the (meth)acrylate compound containing a crosslinkable functional group, and a copolymerizable monomer, or by Polymerization obtained by known or customary polymerization methods. As the above-mentioned polymerization method, for example, a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by irradiating active energy rays (active energy ray polymerization method) and the like may, for example, be mentioned. Among them, in view of the transparency, water resistance, and cost of the adhesive layer, the solution polymerization method and the active energy ray polymerization method are preferable, and the active energy ray polymerization method is more preferable.

作為於上述活性能量線聚合(光聚合)時所照射之活性能量線,例如可例舉:α射線、β射線、γ射線、中子射線、電子束等游離輻射、或紫外線等,尤佳為紫外線。又,活性能量線之照射能量、照射時間、照射方法等並無特別限定,只要可使光聚合起始劑活化,產生單體成分之反應即可。The active energy rays irradiated during the above-mentioned active energy ray polymerization (photopolymerization) include, for example, ionizing radiation such as α-rays, β-rays, γ-rays, neutron rays, and electron beams, or ultraviolet rays. ultraviolet light. In addition, the irradiation energy, irradiation time, and irradiation method of active energy rays are not particularly limited, as long as the photopolymerization initiator can be activated to cause a reaction of the monomer components.

於上述甲基丙烯酸系共聚物之聚合時,亦可使用各種通常之溶劑。作為此種溶劑,例如可例舉:酯類(乙酸乙酯、乙酸正丁酯等)、芳香族烴類(甲苯、苯等)、脂肪族烴類(正己烷、正庚烷等)、脂環式烴類(環己烷、甲基環己烷等)、酮類(甲基乙基酮、甲基異丁基酮等)等有機溶劑。溶劑可單獨使用或組合兩種以上使用。Various common solvents can also be used at the time of polymerization of the said methacryl-type copolymer. As such solvents, for example, esters (ethyl acetate, n-butyl acetate, etc.), aromatic hydrocarbons (toluene, benzene, etc.), aliphatic hydrocarbons (n-hexane, n-heptane, etc.), fatty acids, etc. Cyclic hydrocarbons (cyclohexane, methylcyclohexane, etc.), ketones (methyl ethyl ketone, methyl isobutyl ketone, etc.) and other organic solvents. A solvent can be used individually or in combination of 2 or more types.

又,於上述甲基丙烯酸系共聚物之聚合時,可根據聚合反應之種類,使用熱聚合起始劑或光聚合起始劑(光起始劑)等聚合起始劑。聚合起始劑可單獨使用或組合兩種以上使用。Moreover, when superposing|polymerizing the said methacrylic-type copolymer, depending on the kind of polymerization reaction, a polymerization initiator, such as a thermal polymerization initiator or a photopolymerization initiator (photoinitiator), can be used. A polymerization initiator can be used individually or in combination of 2 or more types.

作為上述光聚合起始劑,並無特別限定,例如可例舉:安息香醚系光聚合起始劑、苯乙酮系光聚合起始劑、α-酮醇系光聚合起始劑、芳香族磺醯氯系光聚合起始劑、光活性肟系光聚合起始劑、安息香系光聚合起始劑、苯偶醯系光聚合起始劑、二苯甲酮系光聚合起始劑、縮酮系光聚合起始劑、9-氧硫𠮿 系光聚合起始劑等。光聚合起始劑可單獨使用或組合兩種以上使用。The above-mentioned photopolymerization initiator is not particularly limited, and examples thereof include: benzoin ether-based photopolymerization initiators, acetophenone-based photopolymerization initiators, α-keto alcohol-based photopolymerization initiators, aromatic Sulfonyl chloride-based photopolymerization initiators, photoactive oxime-based photopolymerization initiators, benzoin-based photopolymerization initiators, benzoyl-based photopolymerization initiators, benzophenone-based photopolymerization initiators, Ketone-based photopolymerization initiators, 9-oxothiol-based photopolymerization initiators, etc. A photopolymerization initiator can be used individually or in combination of 2 or more types.

作為上述安息香醚系光聚合起始劑,例如可例舉:安息香甲醚、安息香乙醚、安息香丙醚、安息香異丙醚、安息香異丁醚、2,2-二甲氧基-1,2-二苯乙烷-1-酮、大茴香醚甲醚等。作為上述苯乙酮系光聚合起始劑,例如可例舉:2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、4-苯氧基二氯苯乙酮、4-(第三丁基)二氯苯乙酮等。作為上述α-酮醇系光聚合起始劑,例如可例舉2-甲基-2-羥基苯丙酮、1-[4-(2-羥基乙基)苯基]-2-甲基丙烷-1-酮等。作為上述芳香族磺醯氯系光聚合起始劑,例如可例舉2-萘磺醯氯等。作為上述光活性肟系光聚合起始劑,例如可例舉1-苯基-1,1-丙二酮-2-(O-乙氧基羰基)-肟等。作為上述安息香系光聚合起始劑,例如可例舉安息香等。作為上述苯偶醯系光聚合起始劑,例如可例舉苯偶醯等。作為上述二苯甲酮系光聚合起始劑,例如可例舉:二苯甲酮、苯甲醯苯甲酸、3,3'-二甲基-4-甲氧基二苯甲酮、聚乙烯二苯甲酮、α-羥基環己基苯基酮等。作為上述縮酮系光聚合起始劑,例如可例舉:苯偶醯二甲基縮酮等。作為上述9-氧硫𠮿 系光聚合起始劑,例如可例舉:9-氧硫𠮿 、2-氯-9-氧硫𠮿 、2-甲基-9-氧硫𠮿 、2,4-二甲基-9-氧硫𠮿 、異丙基-9-氧硫𠮿 、2,4-二異丙基-9-氧硫𠮿 、十二烷基-9-氧硫𠮿 等。Examples of the benzoin ether-based photopolymerization initiator include: benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2- Diphenylethane-1-one, anisole methyl ether, etc. Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclo Hexyl phenyl ketone, 4-phenoxydichloroacetophenone, 4-(tert-butyl)dichloroacetophenone and the like. Examples of the α-ketol-based photopolymerization initiator include 2-methyl-2-hydroxypropiophenone, 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropane- 1-keto etc. As said aromatic sulfonyl chloride type photopolymerization initiator, 2-naphthalenesulfonyl chloride etc. are mentioned, for example. As said photoactive oxime type photoinitiator, 1-phenyl-1, 1-propanedione-2-(O-ethoxycarbonyl)-oxime etc. are mentioned, for example. As said benzoin type photoinitiator, a benzoin etc. are mentioned, for example. As said benzoyl photopolymerization initiator, benzoyl etc. are mentioned, for example. Examples of the benzophenone-based photopolymerization initiator include: benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyethylene Benzophenone, α-hydroxycyclohexyl phenyl ketone, etc. As said ketal type photoinitiator, a benzoyl dimethyl ketal etc. are mentioned, for example. Examples of the above-mentioned 9-oxothiophene-based photopolymerization initiator include: 9-oxothiophene, 2-chloro-9-oxothiophene, 2-methyl-9-oxothiophene, 2,4- Dimethyl-9-oxosulfur, isopropyl-9-oxosulfur, 2,4-diisopropyl-9-oxosulfur, dodecyl-9-oxosulfur, etc.

上述光聚合起始劑之使用量並無特別限定,例如,相對於上述甲基丙烯酸系共聚物之全部結構單元100質量份,較佳為0.001~10.0質量份,更佳為0.01~5.0質量份。The amount of the photopolymerization initiator used is not particularly limited, for example, it is preferably 0.001-10.0 parts by mass, more preferably 0.01-5.0 parts by mass with respect to 100 parts by mass of all the structural units of the above-mentioned methacrylic copolymer .

又,作為上述熱聚合起始劑,例如可例舉:偶氮系聚合起始劑、過氧化物系聚合起始劑(例如過氧化二苯甲醯、過氧化順丁烯二酸第三丁酯等)、氧化還原系聚合起始劑等。其中,較佳為日本專利特開2002-69411號公報中所揭示之偶氮系聚合起始劑。作為上述偶氮系聚合起始劑,可例舉:2,2'-偶氮二異丁腈(AIBN)、2,2'-偶氮雙-2-甲基丁腈(AMBN)、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸等。In addition, as the thermal polymerization initiator, for example, an azo-based polymerization initiator, a peroxide-based polymerization initiator (for example, dibenzoyl peroxide, tertiary butyl peroxymaleic acid, etc.) esters, etc.), redox system polymerization initiators, etc. Among them, the azo-based polymerization initiator disclosed in Japanese Patent Application Laid-Open No. 2002-69411 is preferable. Examples of the azo-based polymerization initiators include: 2,2'-azobisisobutyronitrile (AIBN), 2,2'-azobis-2-methylbutyronitrile (AMBN), 2, Dimethyl 2'-azobis(2-methylpropionate), 4,4'-azobis-4-cyanovaleric acid, etc.

關於上述熱聚合起始劑之使用量,例如,於上述偶氮系聚合起始劑之情形時,相對於上述甲基丙烯酸系共聚物之全部結構單元100質量份,較佳為0.05~0.5質量份,更佳為0.1~0.3質量份。The usage-amount of the said thermal-polymerization initiator is preferably 0.05-0.5 mass parts with respect to 100 mass parts of all structural units of the said methacrylic-type copolymer, for example, in the case of the said azo-type polymerization initiator. parts, more preferably 0.1 to 0.3 parts by mass.

形成本發明之黏著劑層之共聚物之重量平均分子量(Mw)較佳為100000~5000000,更佳為200000~4000000,進而較佳為300000~3000000。重量平均分子量為100000以上之構成於黏著力或保持特性提高,耐發泡剝離性提高方面較佳。重量平均分子量為5000000以下之構成於容易提高黏著力,耐發泡剝離性提高方面較佳。The weight average molecular weight (Mw) of the copolymer forming the adhesive layer of the present invention is preferably from 100,000 to 5,000,000, more preferably from 2,000,000 to 4,000,000, and still more preferably from 300,000 to 3,000,000. A composition having a weight-average molecular weight of 100,000 or more is preferable in terms of improving adhesive force and retention characteristics, and improving foaming and peeling resistance. A composition having a weight-average molecular weight of 5,000,000 or less is preferable in that it is easy to increase adhesive force and improve foaming and peeling resistance.

上述共聚物之重量平均分子量(Mw)可藉由GPC法(Gel Permeation Chromatography,凝膠滲透層析法)進行聚苯乙烯換算而求出。例如可使用高速GPC裝置(製品名「HPLC-8120GPC」,東曹股份有限公司製造),利用下述條件進行測定。 ・管柱:TSKgel SuperHZM-H/HZ4000/HZ3000/HZ2000 ・溶劑:四氫呋喃 ・流速:0.6 ml/min The weight average molecular weight (Mw) of the said copolymer can be calculated|required by polystyrene conversion by the GPC method (Gel Permeation Chromatography, gel permeation chromatography). For example, it can be measured using a high-speed GPC device (product name "HPLC-8120GPC", manufactured by Tosoh Corporation) under the following conditions. ・Column: TSKgel SuperHZM-H/HZ4000/HZ3000/HZ2000 ・Solvent: Tetrahydrofuran ・Flow rate: 0.6 ml/min

上述共聚物之玻璃轉移溫度(Tg)較佳為-70~100℃,更佳為-65~50℃,進而較佳為-60~10℃。若上述甲基丙烯酸系共聚物之玻璃轉移溫度為-70℃以上,則凝集力提高,耐發泡剝離性容易提高而較佳。又,若上述玻璃轉移溫度為100℃以下,則黏著劑組合物具有適度之柔軟性,容易獲得良好之黏著力或良好之階差吸收性,容易獲得優異之接著可靠性,故較佳。The glass transition temperature (Tg) of the above copolymer is preferably -70 to 100°C, more preferably -65 to 50°C, still more preferably -60 to 10°C. When the glass transition temperature of the said methacryl-type copolymer is -70 degreeC or more, cohesive force will improve and foaming peeling resistance will improve easily, and it is preferable. Also, if the above-mentioned glass transition temperature is 100° C. or lower, the adhesive composition has moderate flexibility, and it is easy to obtain good adhesive force or good step absorption, and it is easy to obtain excellent adhesion reliability, so it is preferable.

上述共聚物之玻璃轉移溫度(Tg)為下述FOX公式所表示之玻璃轉移溫度(理論值)。下述式中,Tg表示上述共聚物之玻璃轉移溫度(單位:K),Tg i單體i表示形成均聚物時之玻璃轉移溫度(單位:K),W i表示單體i於單體成分總量中之質量分率(i=1、2、・・・・n)。 1/Tg=W 1/Tg 1+W 2/Tg 2+・・・+W n/Tg n The glass transition temperature (Tg) of the above copolymer is the glass transition temperature (theoretical value) represented by the following FOX formula. In the following formula, Tg represents the glass transition temperature (unit: K) of the above-mentioned copolymer, Tgi monomer i represents the glass transition temperature (unit: K) when forming a homopolymer, W i represents the monomer i in the monomer The mass fraction in the total amount of ingredients (i=1, 2,・・・・n). 1/Tg=W 1 /Tg 1 +W 2 /Tg 2 +・・・+W n /Tg n

作為構成上述共聚物之單體之均聚物之Tg,可採用下述值。 ・甲基丙烯酸月桂酯                              -65℃ ・甲基丙烯酸2-乙基己酯                        -10℃ ・丙烯酸月桂酯                                    0℃ ・丙烯酸2-乙基己酯                              -70℃ ・甲基丙烯酸異癸酯                              -41℃ ・甲基丙烯酸2-羥基乙酯                        55℃ ・甲基丙烯酸甲酯                                 105℃ ・甲基丙烯酸環己酯                              66℃ ・甲基丙烯酸異𦯉酯                              173℃ ・甲基丙烯酸雙環戊酯                           175℃ ・甲基丙烯酸                                       228℃ ・N-乙烯基吡咯啶酮                             86℃ ・甲基丙烯酸2-苯氧基乙酯                     5℃ ・甲基丙烯酸苄酯                                 54℃ ・甲基丙烯酸2-(2-甲氧基乙氧基)乙酯      -3℃ As the Tg of the homopolymer of the monomers constituting the above-mentioned copolymer, the following values can be adopted. ・Lauryl methacrylate -65℃ ・2-Ethylhexyl methacrylate -10℃ ・Lauryl Acrylate 0℃ ・2-Ethylhexyl Acrylate -70℃ ・Isodecyl Methacrylate -41℃ ・2-Hydroxyethyl methacrylate 55℃ ・Methyl methacrylate 105℃ ・Cyclohexyl methacrylate 66℃ ・Isomethacrylate ・Dicyclopentyl methacrylate                                                                               ・Methacrylic acid 228℃ ・N-Vinylpyrrolidone 86℃ ・2-Phenoxyethyl methacrylate 5℃ ・Benzyl methacrylate 54℃ ・2-(2-Methoxyethoxy)ethyl methacrylate -3℃

又,作為上述未記載之單體之均聚物之Tg,可採用「聚合物手冊」(「Polymer Handbook」)(第3版,John Wiley & Sons,Inc,1989年)中所記載之數值。進而,作為上述文獻中亦未記載之單體之均聚物之Tg,可採用藉由上述測定方法獲得之值(基於黏彈性試驗之tanδ之峰頂溫度)。In addition, as the Tg of the homopolymer of the monomer not described above, the value described in "Polymer Handbook" (3rd edition, John Wiley & Sons, Inc, 1989) can be used. Furthermore, as Tg of the homopolymer of the monomer which is not described in the said document, the value obtained by the said measurement method (the peak top temperature of tan δ based on the viscoelasticity test) can be used.

於上述甲基丙烯酸系共聚物之聚合時,為了調整分子量,可使用鏈轉移劑。作為上述鏈轉移劑,例如可例舉:2-巰基乙醇、α-硫代甘油、2,3-二巰基-1-丙醇、辛基硫醇、第三壬基硫醇、十二烷基硫醇(月桂基硫醇)、第三-十二烷基硫醇、縮水甘油基硫醇、硫代乙醇酸、硫代乙醇酸甲酯、硫代乙醇酸乙酯、硫代乙醇酸丙酯、硫代乙醇酸丁酯、硫代乙醇酸第三丁酯、硫代乙醇酸2-乙基己酯、硫代乙醇酸辛酯、硫代乙醇酸異辛酯、硫代乙醇酸癸酯、硫代乙醇酸十二烷基酯、乙二醇之硫代乙醇酸酯、新戊二醇之硫代乙醇酸酯、季戊四醇之硫代乙醇酸酯、α-甲基苯乙烯二聚物等。其中,從抑制由加濕引起之黏著片材之變白方面考慮,較佳為α-硫代甘油、硫代乙醇酸甲酯,尤佳為α-硫代甘油。鏈轉移劑可單獨使用或組合兩種以上使用。In the polymerization of the above-mentioned methacrylic acid-based copolymer, a chain transfer agent may be used in order to adjust the molecular weight. Examples of the chain transfer agent include: 2-mercaptoethanol, α-thioglycerol, 2,3-dimercapto-1-propanol, octylmercaptan, tertiary nonylmercaptan, dodecyl Mercaptan (lauryl mercaptan), tertiary-dodecyl mercaptan, glycidyl mercaptan, thioglycolic acid, methyl thioglycolate, ethyl thioglycolate, propyl thioglycolate , butyl thioglycolate, tertiary butyl thioglycolate, 2-ethylhexyl thioglycolate, octyl thioglycolate, isooctyl thioglycolate, decyl thioglycolate, sulfur Lauryl glycolate, thioglycolic acid ester of ethylene glycol, thioglycolic acid ester of neopentyl glycol, thioglycolic acid ester of pentaerythritol, α-methylstyrene dimer, etc. Among these, α-thioglycerol and methyl thioglycolate are preferred, and α-thioglycerol is particularly preferred from the viewpoint of suppressing whitening of the adhesive sheet due to humidification. A chain transfer agent can be used individually or in combination of 2 or more types.

相對於上述甲基丙烯酸系共聚物之全部結構單元100質量份,上述鏈轉移劑之含量較佳為0.1~20質量份,更佳為0.2~15質量份,進而較佳為0.3~10質量份。藉由將鏈轉移劑之含量(使用量)設為上述範圍,可容易地獲得將重量平均分子量控制在1000~30000之甲基丙烯酸系共聚物。The content of the chain transfer agent is preferably from 0.1 to 20 parts by mass, more preferably from 0.2 to 15 parts by mass, and still more preferably from 0.3 to 10 parts by mass relative to 100 parts by mass of all structural units of the above-mentioned methacrylic acid-based copolymer. . By making content (amount of use) of a chain transfer agent into the said range, the methacryl-type copolymer which controlled the weight average molecular weight to 1000-30000 can be obtained easily.

本發明之黏著劑組合物較佳為含有交聯劑。若於黏著劑組合物中包含交聯劑,則基礎聚合物進行交聯而增大凝膠分率,容易提高耐發泡剝離性。作為上述交聯劑,例如可例舉:異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、此外之脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。其中,於耐發泡剝離性提高方面,較佳為異氰酸酯系交聯劑、環氧系交聯劑,更佳為異氰酸酯系交聯劑。交聯劑可單獨使用或組合兩種以上使用。The adhesive composition of the present invention preferably contains a crosslinking agent. When a crosslinking agent is included in the adhesive composition, the base polymer is crosslinked to increase the gel fraction, and it is easy to improve the resistance to foaming and peeling. Examples of the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, other urea crosslinking agents, and metal alkoxides. Crosslinking agent, metal chelate crosslinking agent, metal salt crosslinking agent, carbodiimide crosslinking agent, oxazoline crosslinking agent, aziridine crosslinking agent, amine crosslinking agent Joint agent, etc. Among them, in terms of improving foaming and peeling resistance, an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent are preferred, and an isocyanate-based crosslinking agent is more preferred. A crosslinking agent can be used individually or in combination of 2 or more types.

作為上述異氰酸酯系交聯劑(多官能異氰酸酯化合物),例如可例舉:1,2-伸乙基二異氰酸酯、1,4-伸丁基二異氰酸酯、1,6-六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯、氫化甲苯二異氰酸酯、氫化二甲苯二異氰酸酯等脂環族聚異氰酸酯類;2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族聚異氰酸酯類等。又,作為上述異氰酸酯系交聯劑,例如亦可例舉:三羥甲基丙烷/甲苯二異氰酸酯加成物(商品名「Coronate L」,日本聚胺酯工業股份有限公司製造)、三羥甲基丙烷/六亞甲基二異氰酸酯加成物(商品名「Coronate HL」,日本聚胺酯工業股份有限公司製造)、三羥甲基丙烷/苯二甲基二異氰酸酯加成物(商品名「Takenate D-110N」,三井化學股份有限公司製造)等市售品。Examples of the isocyanate-based crosslinking agent (polyfunctional isocyanate compound) include 1,2-ethylidene diisocyanate, 1,4-butylene diisocyanate, 1,6-hexamethylene diisocyanate, etc. Lower aliphatic polyisocyanates; cyclopentyl diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate and other alicyclic polyisocyanates; 2,4-toluene Aromatic polyisocyanates such as diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate, etc. In addition, examples of the above-mentioned isocyanate-based crosslinking agent include trimethylolpropane/toluene diisocyanate adduct (trade name "Coronate L", manufactured by Nippon Polyurethane Industries Co., Ltd.), trimethylolpropane / Hexamethylene diisocyanate adduct (trade name "Coronate HL", manufactured by Nippon Polyurethane Industry Co., Ltd.), trimethylolpropane/xylylene diisocyanate adduct (trade name "Takenate D-110N ", manufactured by Mitsui Chemicals Co., Ltd.) and other commercially available products.

作為上述環氧系交聯劑(多官能環氧化合物),例如可例舉:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)異氰尿酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚S二縮水甘油醚、此外之分子內具有2個以上之環氧基之環氧系樹脂等。又,作為上述環氧系交聯劑,例如亦可例舉商品名「Tetrad C」(三菱瓦斯化學股份有限公司製造)等市售品。Examples of the epoxy-based crosslinking agent (polyfunctional epoxy compound) include: N,N,N',N'-tetraglycidyl m-xylylenediamine, diglycidylaniline, 1,3 -Bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol Diglycidyl ether, Polyethylene glycol diglycidyl ether, Polypropylene glycol diglycidyl ether, Sorbitol polyglycidyl ether, Glycerin polyglycidyl ether, Pentaerythritol polyglycidyl ether, Polyglycerol polyglycidyl ether, Sorbitan Polyglycidyl ether, trimethylolpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, tris(2-hydroxyethyl)isocyanurate triglycidyl, m-phenyl Diphenol diglycidyl ether, bisphenol S diglycidyl ether, and other epoxy-based resins having two or more epoxy groups in the molecule, etc. Moreover, as said epoxy type crosslinking agent, a commercial item, such as a brand name "Tetrad C" (made by Mitsubishi Gas Chemical Co., Ltd.), can also be mentioned, for example.

作為上述黏著劑組合物中之交聯劑之含量,例如,相對於上述甲基丙烯酸系共聚物100質量份,較佳為0.001~10質量份,更佳為0.01~5質量份。若交聯劑之含量為0.001質量份以上,則耐發泡剝離性容易提高而較佳。另一方面,若交聯劑之含量為10質量份以下,則黏著劑層具有適度之柔軟性,黏著力容易提高,故較佳。As content of the crosslinking agent in the said adhesive composition, it is preferable that it is 0.001-10 mass parts with respect to 100 mass parts of said methacryl-type copolymers, and it is more preferable that it is 0.01-5 mass parts, for example. If the content of the crosslinking agent is 0.001 parts by mass or more, the foaming and peeling resistance is likely to be improved, which is preferable. On the other hand, when the content of the crosslinking agent is 10 parts by mass or less, the adhesive layer has moderate flexibility and the adhesive force is likely to increase, which is preferable.

從進一步之高頻帶下之低介電常數化、低介電損耗化方面考慮,本發明之黏著劑組合物除了上述基礎聚合物以外,亦可包含無機微粒子、有機微粒子、基礎聚合物以外之聚合物材料。該等可單獨使用或組合兩種以上使用。作為上述無機微粒子、有機微粒子,從於高頻帶下之低介電常數化、低介電損耗化方面考慮,較佳為顯示絕緣性者(絕緣性填料)。From the perspective of further lowering the dielectric constant and lowering the dielectric loss in the high-frequency band, the adhesive composition of the present invention may contain inorganic fine particles, organic fine particles, and polymers other than the basic polymer in addition to the above-mentioned base polymer. material. These can be used individually or in combination of 2 or more types. The above-mentioned inorganic fine particles and organic fine particles are preferably those exhibiting insulating properties (insulating fillers) from the viewpoint of low dielectric constant and low dielectric loss in high frequency bands.

(無機微粒子) 作為於本發明之黏著劑組合物中可調配之無機微粒子,例如可例舉:二氧化矽、氧化鋁、氧化鋯、氧化鈦等金屬氧化物;硼酸鋁、氫氧化鋁等金屬鹽、雲母等礦物、中空奈米二氧化矽等具有中空構造之無機微粒子等。該等可單獨使用或組合兩種以上使用。 (inorganic microparticles) Examples of inorganic fine particles that can be formulated in the adhesive composition of the present invention include: metal oxides such as silicon dioxide, aluminum oxide, zirconium oxide, and titanium oxide; metal salts such as aluminum borate and aluminum hydroxide; mica, etc. Minerals, hollow nano-silicon dioxide and other inorganic particles with a hollow structure, etc. These can be used individually or in combination of 2 or more types.

從基礎聚合物中之分散性方面考慮,上述無機微粒子亦可為實施了表面處理者。作為表面處理劑,可並無限制地使用公知或慣用者,例如可例舉:矽烷偶合劑、鈦偶合劑、有機酸、多元醇、聚矽氧等,較佳為矽烷偶合劑。作為矽烷偶合劑,可例舉:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、二甲基乙烯基甲氧基矽烷、二甲基乙烯基乙氧基矽烷、甲基乙烯基二甲氧基矽烷、甲基乙烯基二乙氧基矽烷、乙烯基三(2-甲氧基)矽烷、乙烯基三乙醯氧基矽烷、2-甲基丙烯醯氧基乙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、三乙氧基苯基矽烷、三甲氧基苯基矽烷、二甲氧基二苯基矽烷、甲基二乙氧基苯基矽烷、二甲氧基甲基苯基矽烷等。From the viewpoint of dispersibility in the base polymer, the above-mentioned inorganic fine particles may be surface-treated. As the surface treatment agent, known or commonly used ones can be used without limitation, for example, silane coupling agents, titanium coupling agents, organic acids, polyhydric alcohols, polysiloxane, etc., preferably silane coupling agents. Examples of silane coupling agents include: vinyltrimethoxysilane, vinyltriethoxysilane, dimethylvinylmethoxysilane, dimethylvinylethoxysilane, methylvinyldimethylsilane Oxysilane, Methylvinyldiethoxysilane, Vinyltris(2-Methoxy)silane, Vinyltriacetyloxysilane, 2-Methacryloxyethyltriethoxysilane , 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, Triethoxyphenylsilane, trimethoxyphenylsilane, dimethoxydiphenylsilane, methyldiethoxyphenylsilane, dimethoxymethylphenylsilane, etc.

從黏著劑組合物於高頻帶下之低介電常數化、低介電損耗化、透明性方面考慮,上述無機微粒子之粒徑(D50)較佳為1~100 nm,更佳為5~80 nm,進而較佳為10~50 nm。上述中心粒徑意指藉由雷射繞射、散射法測定之粒度分佈中之累計值50%時之粒徑(中值徑)。From the viewpoint of low dielectric constant, low dielectric loss, and transparency of the adhesive composition at high frequencies, the particle size (D50) of the above-mentioned inorganic fine particles is preferably 1-100 nm, more preferably 5-80 nm. nm, and more preferably 10 to 50 nm. The above-mentioned central particle diameter means the particle diameter (median diameter) at 50% of the cumulative value in the particle size distribution measured by laser diffraction and scattering method.

於本發明之黏著劑組合物包含無機微粒子之情形時,從黏著劑組合物於高頻帶下之低介電常數化、低介電損耗化、透明性方面考慮,相對於上述甲基丙烯酸系共聚物100重量份,其含量較佳為0.01~30質量份,更佳為0.05~25質量份,進而較佳為0.10~20質量份,進而更佳為0.15~10質量份,尤佳為0.2~5質量份。When the adhesive composition of the present invention contains inorganic microparticles, from the viewpoints of low dielectric constant, low dielectric loss, and transparency of the adhesive composition at high frequencies, compared to the above-mentioned methacrylic copolymer 100 parts by weight, the content is preferably 0.01 to 30 parts by mass, more preferably 0.05 to 25 parts by mass, further preferably 0.10 to 20 parts by mass, even more preferably 0.15 to 10 parts by mass, especially preferably 0.2 to 10 parts by mass 5 parts by mass.

(有機微粒子) 作為於本發明之黏著劑組合物中可調配之有機微粒子,例如可例舉包含苯乙烯系樹脂、丙烯酸系樹脂、聚矽氧系樹脂、丙烯酸-苯乙烯系樹脂、氯乙烯系樹脂、偏二氯乙烯系樹脂、醯胺系樹脂、胺基甲酸酯系樹脂、酚系樹脂、苯乙烯-共軛二烯系樹脂、丙烯酸-共軛二烯系樹脂、烯烴系樹脂、氟系樹脂等聚合物、或該等聚合物之交聯體之微粒子,進而以具有中空構造之方式包含該等聚合物-聚合物交聯體之微粒子等。該等可單獨使用或組合兩種以上使用。 (organic microparticles) As the organic microparticles that can be formulated in the adhesive composition of the present invention, for example, styrene-based resins, acrylic resins, polysiloxane-based resins, acrylic-styrene-based resins, vinyl chloride-based resins, di Polymerization of vinyl chloride resin, amide resin, urethane resin, phenol resin, styrene-conjugated diene resin, acrylic acid-conjugated diene resin, olefin resin, fluorine resin, etc. objects, or microparticles of cross-linked polymers, and microparticles of polymer-polymer cross-linked bodies in a hollow structure. These can be used individually or in combination of 2 or more types.

從黏著劑組合物於高頻帶下之低介電常數化、低介電損耗化、透明性方面考慮,上述有機微粒子之粒徑(D50)較佳為1~100 nm,更佳為5~80 nm,進而較佳為10~50 nm。上述中心粒徑意指藉由雷射繞射、散射法測定之粒度分佈中之累計值50%時之粒徑(中值徑)。From the viewpoint of low dielectric constant, low dielectric loss, and transparency of the adhesive composition at high frequencies, the particle size (D50) of the above-mentioned organic microparticles is preferably 1-100 nm, more preferably 5-80 nm. nm, and more preferably 10 to 50 nm. The above-mentioned central particle diameter means the particle diameter (median diameter) at 50% of the cumulative value in the particle size distribution measured by laser diffraction and scattering method.

於本發明之黏著劑組合物包含有機微粒子之情形時,從黏著劑組合物於高頻帶下之低介電常數化、低介電損耗化、透明性方面考慮,相對於上述甲基丙烯酸系共聚物100質量份,其含量通常為0.01~30質量份,較佳為0.05~25質量份,更佳為0.1~20質量份,進而較佳為0.15~10質量份,尤佳為0.2~5質量份。When the adhesive composition of the present invention contains organic microparticles, from the viewpoints of low dielectric constant, low dielectric loss, and transparency of the adhesive composition at high frequencies, compared to the above-mentioned methacrylic copolymer 100 parts by mass, the content is usually 0.01 to 30 parts by mass, preferably 0.05 to 25 parts by mass, more preferably 0.1 to 20 parts by mass, further preferably 0.15 to 10 parts by mass, especially preferably 0.2 to 5 parts by mass share.

(聚合物材料) 作為於本發明之黏著劑組合物中可調配之聚合物材料,較佳為介電常數、介電損耗較低,且與基礎聚合物具有相溶性者,例如可例舉:氟樹脂、氟橡膠、含氟官能基之(甲基)丙烯酸酯、聚乙烯、聚丙烯、聚苯乙烯、聚碳酸酯、降莰烯系樹脂或與烯烴類之加成共聚型樹脂、聚苯醚、雙順丁烯二醯亞胺-三𠯤樹脂、聚醚醯亞胺、聚醯亞胺、聚醚醚酮(PEEK)、液晶聚合物、橡膠彈性體、氫化聚烯烴樹脂、萜烯、異戊二烯、萜酚樹脂、芳香族改性萜烯樹脂以及該等之氫化樹脂等。該等可單獨使用或組合兩種以上使用。 (polymer material) As the polymer material that can be formulated in the adhesive composition of the present invention, it is preferable to have a low dielectric constant and dielectric loss, and have compatibility with the base polymer, for example: fluororesin, fluororubber , (meth)acrylates containing fluorine functional groups, polyethylene, polypropylene, polystyrene, polycarbonate, norbornene-based resins or addition-copolymerized resins with olefins, polyphenylene ether, bis-butadiene Ethylene imide-trimethoprene resin, polyether imide, polyimide, polyether ether ketone (PEEK), liquid crystal polymer, rubber elastomer, hydrogenated polyolefin resin, terpene, isoprene, Terpene phenol resins, aromatic modified terpene resins and their hydrogenated resins, etc. These can be used individually or in combination of 2 or more types.

於本發明之黏著劑組合物包含聚合物材料之情形時,其含量並無特別限定,從黏著劑組合物於高頻帶下之低介電常數化、低介電損耗化、透明性方面考慮,相對於上述甲基丙烯酸系共聚物100質量份,通常為0.01~50質量份,較佳為0.05~40質量份,更佳為0.1~30質量份。When the adhesive composition of the present invention contains a polymer material, its content is not particularly limited. Considering the low dielectric constant, low dielectric loss, and transparency of the adhesive composition at high frequency bands, It is 0.01-50 mass parts normally with respect to 100 mass parts of said methacryl-type copolymers, Preferably it is 0.05-40 mass parts, More preferably, it is 0.1-30 mass parts.

(防銹劑) 本發明之黏著劑組合物可進而含有防銹劑。若於黏著劑組合物中包含防銹劑,則於可獲得對於天線元件、金屬配線之優異之防腐蝕效果方面較佳。 (Rust inhibitor) The adhesive composition of the present invention may further contain a rust inhibitor. When an antirust agent is included in the adhesive composition, it is preferable in terms of obtaining an excellent anticorrosion effect on antenna elements and metal wiring.

防銹劑係防止金屬之鏽(rust)或腐蝕之化合物。作為防銹劑,例如可例舉:胺化合物、苯并三唑系化合物、亞硝酸鹽類等。除此以外,亦可例舉:苯甲酸銨、鄰苯二甲酸銨、硬脂酸銨、棕櫚酸銨、油酸銨、碳酸銨、二環己基胺苯甲酸鹽、脲、六亞甲四胺(Urotropine)、硫脲、胺基甲酸苯酯、N-環己基胺基甲酸環己基銨(CHC)等。防銹劑可單獨使用或組合兩種以上使用。Rust inhibitors are compounds that prevent rust or corrosion of metals. As a rust preventive agent, an amine compound, a benzotriazole compound, nitrite etc. are mentioned, for example. In addition, ammonium benzoate, ammonium phthalate, ammonium stearate, ammonium palmitate, ammonium oleate, ammonium carbonate, dicyclohexylamine benzoate, urea, hexamethylene tetra Amine (Urotropine), thiourea, phenyl carbamate, cyclohexyl ammonium N-cyclohexyl carbamate (CHC), etc. The rust inhibitors can be used alone or in combination of two or more.

作為上述胺化合物,例如可例舉:2-胺基-2-甲基-1-丙醇、單乙醇胺、單異丙醇胺、二乙基乙醇胺、氨或氨水等含羥基之胺化合物;嗎啉等環狀胺;環己基胺等環狀烷基胺化合物;3-甲氧基丙基胺等直鏈狀烷基胺等。又,作為亞硝酸鹽類,例如可例舉:亞硝酸二環己基銨(DICHAN)、亞硝酸二異丙基銨(DIPAN)、亞硝酸鈉、亞硝酸鉀、亞硝酸鈣等。As the above-mentioned amine compound, for example, hydroxyl-containing amine compounds such as 2-amino-2-methyl-1-propanol, monoethanolamine, monoisopropanolamine, diethylethanolamine, ammonia or ammonia water; Cyclic amines such as morphine; Cyclic alkylamine compounds such as cyclohexylamine; Linear alkylamines such as 3-methoxypropylamine, etc. Moreover, as nitrites, dicyclohexylammonium nitrite (DICHAN), diisopropylammonium nitrite (DIPAN), sodium nitrite, potassium nitrite, calcium nitrite etc. are mentioned, for example.

關於上述防銹劑之含量,相對於上述甲基丙烯酸系共聚物100質量份,較佳為包含0.02~15質量份。若上述含量為0.02質量份以上,則容易獲得良好之防腐蝕性能而較佳。另一方面,若上述含量為15質量份以下,則容易確保透明性,又,容易確保耐發泡剝離性等接著可靠性而較佳。It is preferable to contain 0.02-15 mass parts with respect to 100 mass parts of said methacryl-type copolymers about content of the said rust preventive agent. If the said content is 0.02 mass part or more, since favorable anticorrosion performance is easy to be acquired, it is preferable. On the other hand, when the said content is 15 parts by mass or less, it is easy to ensure transparency, and it is easy to ensure adhesive reliability, such as foaming-resistant peeling property, and it is preferable.

其中,從可均衡地以較高之等級獲得對於上述甲基丙烯酸系共聚物之接著可靠性、透明性以及防腐蝕性之特性,可獲得優異之外觀性方面考慮,上述防銹劑較佳為苯并三唑系化合物。Among them, the above-mentioned antirust agent is preferably Benzotriazole compounds.

作為上述苯并三唑系化合物,只要為具有苯并三唑骨架之化合物,則並無特別限定,從可獲得更優異之防腐蝕效果之觀點考慮,較佳為具有下述式(1)所表示之結構。 [化1]

Figure 02_image001
(其中,上述式(1)中,R 1以及R 2相同或不同,R 1為苯環上之取代基,表示碳數1~6之烷基、碳數1~6之烷氧基、碳數6~14之芳基、胺基、單或二C 1-10烷基胺基、胺基-C 1-6烷基、單或二C 1-10烷基胺基-C 1-6烷基、巰基、碳數1~6之烷氧基羰基、或碳數1~6之烷氧基等取代基,n為0~4之整數,於n為2以上之情形時,n個R 1可相同亦可不同,R 2表示氫原子、碳數1~12之烷基、碳數1~12之烷氧基、碳數6~14之芳基、胺基、單或二C 1-10烷基胺基、胺基-C 1-6烷基、單或二C 1-10烷基胺基-C 1-6烷基、巰基、碳數1~12之烷氧基羰基、或碳數1~12之烷氧基等取代基) The above-mentioned benzotriazole-based compound is not particularly limited as long as it is a compound having a benzotriazole skeleton. From the viewpoint of obtaining a more excellent anti-corrosion effect, one having the following formula (1) is preferred. representation structure. [chemical 1]
Figure 02_image001
(wherein, in the above formula (1), R 1 and R 2 are the same or different, and R 1 is a substituent on the benzene ring, representing an alkyl group with 1 to 6 carbons, an alkoxy group with 1 to 6 carbons, a carbon Aryl, amino, mono or di C 1-10 alkyl amino, amino-C 1-6 alkyl, mono or di C 1-10 alkyl amino-C 1-6 alkane with the number 6-14 Substituents such as radical, mercapto, alkoxycarbonyl with 1 to 6 carbons, or alkoxy with 1 to 6 carbons, n is an integer of 0 to 4, when n is 2 or more, n R1 Can be the same or different, R2 represents a hydrogen atom, an alkyl group with 1 to 12 carbons, an alkoxy group with 1 to 12 carbons, an aryl group with 6 to 14 carbons, an amino group, a single or two C 1-10 Alkylamino, amino-C 1-6 alkyl, mono- or di-C 1-10 alkylamino-C 1-6 alkyl, mercapto, alkoxycarbonyl with 1 to 12 carbons, or carbon number 1 to 12 substituents such as alkoxy)

從可獲得更優異之防腐蝕效果之觀點考慮,作為R 1,較佳為碳數1~3之烷基、烷氧基羰基等,更佳為甲基等。又,n較佳為0或1。從同樣之觀點考慮,作為R 2,較佳為氫原子、單或二C 1-10烷基胺基-C 1-6烷基等,更佳為氫原子、二C 1-8烷基胺基C 1-4烷基等。 From the standpoint of obtaining a more excellent anti-corrosion effect, R 1 is preferably an alkyl group having 1 to 3 carbon atoms, an alkoxycarbonyl group, or the like, more preferably a methyl group, or the like. Also, n is preferably 0 or 1. From the same point of view, R 2 is preferably a hydrogen atom, mono- or di-C 1-10 alkylamino-C 1-6 alkyl, etc., more preferably a hydrogen atom, di-C 1-8 alkylamine Group C 1-4 alkyl and so on.

相對於上述甲基丙烯酸系共聚物100質量份,上述苯并三唑系化合物之含量較佳為0.02~3質量份,更佳為0.02~2.5質量份,進而較佳為0.02~2質量份。若苯并三唑系化合物之量在一定範圍內,則可確實地確保耐發泡剝離性等接著可靠性,且亦可確實地防止黏著片材之霧度之上升。The content of the benzotriazole-based compound is preferably from 0.02 to 3 parts by mass, more preferably from 0.02 to 2.5 parts by mass, and still more preferably from 0.02 to 2 parts by mass, based on 100 parts by mass of the above-mentioned methacrylic acid-based copolymer. When the amount of the benzotriazole-based compound is within a certain range, adhesion reliability such as resistance to foaming and peeling can be reliably ensured, and an increase in the haze of the adhesive sheet can also be reliably prevented.

(矽烷偶合劑) 本發明之黏著劑組合物亦可進而含有矽烷偶合劑。若於黏著劑組合物中包含矽烷偶合劑,則於容易獲得對於玻璃之優異之接著性(尤其是高溫高濕下對於玻璃之優異之接著可靠性)方面較佳。 (silane coupling agent) The adhesive composition of the present invention may further contain a silane coupling agent. If a silane coupling agent is included in the adhesive composition, it is preferable in terms of easily obtaining excellent adhesion to glass (especially excellent adhesion reliability to glass under high temperature and high humidity).

作為上述矽烷偶合劑,可例舉:γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、γ-胺基丙基三甲氧基矽烷、N-苯基-胺基丙基三甲氧基矽烷等。其中,較佳為γ-縮水甘油氧基丙基三甲氧基矽烷。作為上述矽烷偶合劑,例如亦可例舉商品名「KBM-403」(信越化學工業股份有限公司製造)等市售品。矽烷偶合劑可單獨使用或組合兩種以上使用。Examples of the silane coupling agent include: γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N- Phenyl-aminopropyltrimethoxysilane, etc. Among them, γ-glycidoxypropyltrimethoxysilane is preferred. As said silane coupling agent, a commercial item, such as a brand name "KBM-403" (made by Shin-Etsu Chemical Co., Ltd.), can also be mentioned, for example. A silane coupling agent can be used individually or in combination of 2 or more types.

從對於玻璃之接著可靠性提高方面考慮,相對於上述甲基丙烯酸系共聚物100質量份,上述矽烷偶合劑之含量較佳為0.01~1質量份,更佳為0.03~0.5質量份。From the viewpoint of improving the bonding reliability to glass, the content of the silane coupling agent is preferably from 0.01 to 1 part by mass, more preferably from 0.03 to 0.5 parts by mass, based on 100 parts by mass of the above-mentioned methacrylic copolymer.

(其他添加劑) 於本發明之黏著劑組合物中,可視需要於不損害本發明特性之範圍內,包含抗氧化劑、交聯促進劑、交聯延遲劑、黏著賦予樹脂(松脂衍生物、聚萜烯樹脂、油溶性苯酚等)、抗老化劑、著色劑(顏料或染料等)、紫外線吸收劑、鏈轉移劑、塑化劑、軟化劑、界面活性劑、防靜電劑等公知之添加劑。該等可單獨使用或組合兩種以上使用。 (other additives) In the adhesive composition of the present invention, antioxidants, crosslinking accelerators, crosslinking retarders, adhesion-imparting resins (rosin derivatives, polyterpene resins, oil soluble phenol, etc.), anti-aging agents, colorants (pigments or dyes, etc.), ultraviolet absorbers, chain transfer agents, plasticizers, softeners, surfactants, antistatic agents and other known additives. These can be used individually or in combination of 2 or more types.

於本發明之黏著劑組合物包含黏著賦予劑之情形時,從賦予適度之黏著性方面考慮,相對於上述甲基丙烯酸系共聚物100質量份,其含量較佳為0.01質量份以上,更佳為0.05質量份以上。又,從避免剝離強度變得過高方面考慮,較佳為50質量份以下,更佳為40質量份以下。When the adhesive composition of the present invention contains an adhesive imparting agent, its content is preferably at least 0.01 parts by mass based on 100 parts by mass of the above-mentioned methacrylic copolymer, more preferably It is 0.05 mass parts or more. Moreover, from the viewpoint of avoiding that the peeling strength becomes too high, it is preferably at most 50 parts by mass, more preferably at most 40 parts by mass.

[黏著劑層] 本發明之黏著劑層係由本發明之黏著劑組合物形成,故於高頻帶(28~60 GHz)之毫米波下,顯示出低介電常數、低介電損耗。即,本發明之黏著劑層能夠抑制毫米波之放射損耗。 [adhesive layer] The adhesive layer of the present invention is formed from the adhesive composition of the present invention, so it exhibits low dielectric constant and low dielectric loss under millimeter waves in the high frequency band (28-60 GHz). That is, the adhesive layer of the present invention can suppress the radiation loss of millimeter waves.

本發明之黏著劑層於28 GHz下之介電常數較低,於能夠抑制毫米波之放射損耗方面較佳。本發明之黏著劑層於頻率28 GHz下之介電常數較佳為2.00~5.00,更佳為2.05~4.50,進而較佳為2.10~4.00,進而更佳為2.15~3.50,尤佳為2.20~3.40,最佳為2.20~3.30、2.20~3.20、2.20~3.10、2.20~3.00或2.20~2.90。The adhesive layer of the present invention has a lower dielectric constant at 28 GHz, which is better in suppressing the radiation loss of millimeter waves. The dielectric constant of the adhesive layer of the present invention at a frequency of 28 GHz is preferably 2.00-5.00, more preferably 2.05-4.50, further preferably 2.10-4.00, further preferably 2.15-3.50, especially preferably 2.20- 3.40, the best is 2.20-3.30, 2.20-3.20, 2.20-3.10, 2.20-3.00 or 2.20-2.90.

本發明之黏著劑層於28 GHz下之介電常數可藉由調整構成用以形成黏著劑層之黏著劑組合物的基礎聚合物之種類、單體組成、添加劑之種類或含量等來進行調整。The dielectric constant of the adhesive layer of the present invention at 28 GHz can be adjusted by adjusting the type of base polymer, monomer composition, type or content of additives, etc. constituting the adhesive composition used to form the adhesive layer .

本發明之黏著劑層於28 GHz下之介電損耗較低,於能夠抑制毫米波之放射損耗方面較佳。本發明之黏著劑層於頻率28 GHz下之介電損耗較佳為0.050以下,更佳為0.045以下,進而較佳為0.040以下,進而更佳為0.035以下,尤佳為0.030以下,最佳為0.025以下或0.020以下。下限值並無特別限定,較佳為0.0001以上,亦可為0.0005以上或0.0010以上。The dielectric loss of the adhesive layer of the present invention is lower at 28 GHz, and it is better in suppressing the radiation loss of millimeter waves. The dielectric loss of the adhesive layer of the present invention at a frequency of 28 GHz is preferably less than 0.050, more preferably less than 0.045, further preferably less than 0.040, still more preferably less than 0.035, especially preferably less than 0.030, and most preferably less than 0.030. 0.025 or less or 0.020 or less. The lower limit is not particularly limited, but is preferably 0.0001 or more, and may be 0.0005 or more or 0.0010 or more.

本發明之黏著劑層於28 GHz下之介電損耗可藉由調整構成用以形成黏著劑層之黏著劑組合物的基礎聚合物之種類、單體組成、添加劑之種類或含量等來進行調整。The dielectric loss of the adhesive layer of the present invention at 28 GHz can be adjusted by adjusting the type of base polymer, the monomer composition, the type or content of additives, etc. constituting the adhesive composition used to form the adhesive layer .

本發明之黏著劑層於60 GHz下之介電常數較低,於能夠抑制毫米波之放射損耗方面較佳。本發明之黏著劑層於頻率60 GHz下之介電常數較佳為2.0~5.0,更佳為2.1~4.5,進而較佳為2.2~4.0,進而更佳為2.2~3.5,尤佳為2.2~3.4,最佳為2.2~3.3、2.2~3.2、2.2~3.1、2.2~3.0或2.2~2.9。The adhesive layer of the present invention has a lower dielectric constant at 60 GHz, which is better in suppressing the radiation loss of millimeter waves. The dielectric constant of the adhesive layer of the present invention at a frequency of 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, further preferably 2.2 to 4.0, further preferably 2.2 to 3.5, especially preferably 2.2 to 3.4, the best is 2.2-3.3, 2.2-3.2, 2.2-3.1, 2.2-3.0 or 2.2-2.9.

本發明之黏著劑層於60 GHz下之介電常數可藉由調整構成用以形成黏著劑層之黏著劑組合物的基礎聚合物之種類、單體組成、添加劑之種類或含量等來進行調整。The dielectric constant of the adhesive layer of the present invention at 60 GHz can be adjusted by adjusting the type of base polymer, monomer composition, type or content of additives, etc. constituting the adhesive composition used to form the adhesive layer .

本發明之黏著劑層較佳為於60 GHz下之介電損耗被控制得較低,於能夠抑制毫米波之放射損耗方面較佳。本發明之黏著劑層於頻率60 GHz下之介電損耗較佳為0.050以下,更佳為0.045以下,進而較佳為0.040以下,進而更佳為0.035以下,尤佳為0.030以下,最佳為0.025以下或0.020以下。於頻率60 GHz下之介電損耗之下限值較佳為0.0001以上,亦可為0.0005以上或0.0010以上。In the adhesive layer of the present invention, the dielectric loss at 60 GHz is preferably controlled to be relatively low, and it is preferable in that the radiation loss of millimeter waves can be suppressed. The dielectric loss of the adhesive layer of the present invention at a frequency of 60 GHz is preferably less than 0.050, more preferably less than 0.045, further preferably less than 0.040, still more preferably less than 0.035, especially preferably less than 0.030, and most preferably less than 0.030. 0.025 or less or 0.020 or less. The lower limit of the dielectric loss at a frequency of 60 GHz is preferably not less than 0.0001, and may be not less than 0.0005 or not less than 0.0010.

本發明之黏著劑層於60 GHz下之介電損耗可藉由調整構成用以形成黏著劑層之黏著劑組合物的基礎聚合物之種類、單體組成、添加劑之種類或含量等來進行調整。The dielectric loss of the adhesive layer of the present invention at 60 GHz can be adjusted by adjusting the type of base polymer, the monomer composition, the type or content of additives, etc. constituting the adhesive composition used to form the adhesive layer .

本發明之黏著劑層透明,或者具有透明性。因此,介隔上述黏著劑組合物之視認性或外觀性優異。如此,本發明之黏著劑層可適宜地用於光學用途。The adhesive layer of the present invention is transparent or has transparency. Therefore, the visibility and appearance through the said adhesive composition are excellent. Thus, the pressure-sensitive adhesive layer of this invention can be used suitably for an optical use.

本發明之黏著劑層之霧度(依據JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而更佳為0.9%以下,尤佳為0.8%以下。若霧度例如為1.2%以下,則容易獲得優異之透明性或優異之外觀。上述霧度例如可設為黏著劑層厚度25 μm,將其於常態(23℃,50%R.H.)下靜置至少24小時,其後貼合於載玻片(例如全光線透過率91.8%,霧度0.4%),將所得者設為試樣,並使用霧度計(製品名「HM-150」,村上色彩技術研究所股份有限公司製造)進行測定。The haze of the adhesive layer of the present invention (based on JIS K7136) is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, further preferably 1.0% or less, still more preferably 0.9% or less, especially Preferably less than 0.8%. When the haze is, for example, 1.2% or less, excellent transparency or an excellent appearance can be easily obtained. For example, the above-mentioned haze can be set to a thickness of 25 μm of the adhesive layer, which is left to stand at a normal state (23°C, 50% R.H.) for at least 24 hours, and then attached to a glass slide (for example, the total light transmittance is 91.8%, haze 0.4%), and the obtained product was used as a sample, and measured using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Laboratory Co., Ltd.).

本發明之黏著劑層於可見光波長區域中之全光線透過率(依據JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而更佳為90%以上,尤佳為91%以上,最佳為92%以上。若全光線透過率為85%以上,則容易獲得優異之透明性或優異之外觀。上述全光線透過率例如可設為黏著劑層厚度25 μm,將其於常態(23℃,50%R.H.)下靜置至少24小時,其後於具有間隔件之情形時將其剝離,貼合於載玻片(例如全光線透過率91.8%,霧度0.4%),將所得者設為試樣,並使用霧度計(製品名「HM-150」,村上色彩技術研究所股份有限公司製造)進行測定。The total light transmittance (according to JIS K7361-1) of the adhesive layer of the present invention in the visible light wavelength region is not particularly limited, but is preferably 85% or more, more preferably 88% or more, and still more preferably 89% or more, Furthermore, it is more preferably 90% or more, especially preferably 91% or more, most preferably 92% or more. When the total light transmittance is 85% or more, it is easy to obtain excellent transparency or excellent appearance. The above-mentioned total light transmittance can be set, for example, to a thickness of 25 μm of the adhesive layer, which is left to stand at a normal state (23°C, 50% R.H.) for at least 24 hours, and then peeled off when there is a spacer, and bonded On a slide glass (for example, total light transmittance 91.8%, haze 0.4%), set the resultant as a sample, and use a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd. ) to measure.

本發明之黏著劑層之霧度、全光線透過率可藉由調整構成用以形成黏著劑層之黏著劑組合物之基礎聚合物的種類、單體組成、添加劑之種類或含量等來進行調整。The haze and total light transmittance of the adhesive layer of the present invention can be adjusted by adjusting the type of base polymer, monomer composition, type or content of additives, etc. constituting the adhesive composition used to form the adhesive layer. .

本發明之黏著劑層之凝膠分率(不溶成分之比率)較佳為30~95%,更佳為35~90%,進而較佳為40~85%,進而更佳為45~80%,尤佳為50~75%。若凝膠分率為30%以上,則上述黏著劑層之凝集力提高,於操作時不易產生凹痕,又,於高溫環境下與被接著體之界面處之發泡或剝離得以抑制,容易獲得優異之耐發泡剝離性而較佳。若凝膠分率為95%以下,則可獲得適度之柔軟性,接著性、階差追隨性進一步提高,又,不易吸收異物而較佳。The gel fraction (ratio of insoluble components) of the adhesive layer of the present invention is preferably 30-95%, more preferably 35-90%, still more preferably 40-85%, still more preferably 45-80% , preferably 50-75%. If the gel fraction is more than 30%, the cohesive force of the above-mentioned adhesive layer is improved, and it is difficult to produce dents during operation. In addition, foaming or peeling at the interface with the adherend in a high-temperature environment is suppressed, and it is easy to It is preferred to obtain excellent resistance to foaming and peeling. If the gel fraction is 95% or less, moderate flexibility can be obtained, the adhesiveness and step followability can be further improved, and foreign matter is less likely to be absorbed, which is preferable.

上述凝膠分率(溶劑不溶成分之比率)例如能夠以如下方式算出。The said gel fraction (ratio of a solvent-insoluble component) can be calculated as follows, for example.

自黏著劑層取約0.1 g,包裹於平均孔徑0.2 μm之多孔質四氟乙烯片材(商品名「NTF1122」,日東電工股份有限公司製造)中,其後以風箏線紮緊,測定此時之質量,將該質量設為浸漬前質量(Z)。該浸漬前質量為黏著劑層、四氟乙烯片材、及風箏線之總質量。又,亦預先測定四氟乙烯片材與風箏線之合計質量,將該質量設為包裝質量(Y)。 其次,將以四氟乙烯片材包裹黏著劑層並以風箏線紮緊者(稱為「樣品」)放入裝滿乙酸乙酯或甲苯之50 ml容器中,於23℃下靜置7天。其後,自容器中取出樣品(乙酸乙酯或甲苯處理後),轉移至鋁製杯中,於130℃下於乾燥機中乾燥2小時而將乙酸乙酯或甲苯去除,其後測定質量,並將該質量設為浸漬後質量(X)。 並且,根據下述式算出凝膠分率。 凝膠分率(%)={(X-Y)/(Z-Y)}×100 About 0.1 g was taken from the adhesive layer, wrapped in a porous tetrafluoroethylene sheet with an average pore size of 0.2 μm (trade name "NTF1122", manufactured by Nitto Denko Co., Ltd.), and then tied tightly with a kite string to measure the time The mass of the mass is set as the mass before immersion (Z). The mass before dipping is the total mass of the adhesive layer, the tetrafluoroethylene sheet, and the kite string. In addition, the total mass of the tetrafluoroethylene sheet and the kite string was also measured in advance, and this mass was set as the packaging mass (Y). Next, put the adhesive layer wrapped with tetrafluoroethylene sheet and tied tightly with kite string (called "sample") into a 50 ml container filled with ethyl acetate or toluene, and let stand at 23°C for 7 days . Thereafter, the sample was taken out from the container (after treatment with ethyl acetate or toluene), transferred to an aluminum cup, dried in a drier at 130° C. for 2 hours to remove ethyl acetate or toluene, and then the mass was measured. Let this mass be the mass after immersion (X). And, the gel fraction was calculated according to the following formula. Gel fraction (%)={(X-Y)/(Z-Y)}×100

本發明之黏著劑層之凝膠分率例如可藉由單體組成、重量平均分子量、交聯劑之使用量、其他添加劑之種類或使用量等來進行控制。The gel fraction of the adhesive layer of the present invention can be controlled by, for example, monomer composition, weight average molecular weight, usage amount of crosslinking agent, type or usage amount of other additives, and the like.

本發明之黏著劑層於25℃下之儲存模數較佳為0.01 MPa以上,更佳為0.02 MPa以上,進而較佳為0.03 MPa以上,進而更佳為0.04 MPa以上,尤佳為0.05 MPa以上,最佳為0.10 MPa以上。若上述儲存模數為0.01 MPa以上,則於操作時不易產生凹痕,又,容易獲得良好之接著可靠性,故較佳。又,從階差追隨性、異物吸收性方面考慮,上述黏著劑層於25℃下之儲存模數較佳為5 MPa以下,更佳為4.5 MPa以下,進而較佳為4.0 MPa以下,進而更佳為3.5 MPa以下,尤佳為3.0 MPa以下,最佳為2.5 MPa以下或2.0 MPa以下。黏著劑層之儲存模數係於頻率1 Hz下實施動態黏彈性測定時所測定者。上述儲存模數為雜數所表示之剪切彈性模數之實部,拉伸彈性模數等可考慮樣品之泊松比而進行換算。The storage modulus of the adhesive layer of the present invention at 25°C is preferably at least 0.01 MPa, more preferably at least 0.02 MPa, still more preferably at least 0.03 MPa, still more preferably at least 0.04 MPa, especially preferably at least 0.05 MPa , preferably above 0.10 MPa. If the above-mentioned storage modulus is 0.01 MPa or more, dents are less likely to be generated during handling, and good bonding reliability can be easily obtained, which is preferable. In addition, from the viewpoint of step followability and foreign matter absorption, the storage modulus of the above-mentioned adhesive layer at 25° C. is preferably 5 MPa or less, more preferably 4.5 MPa or less, further preferably 4.0 MPa or less, and still more preferably 4.0 MPa or less. Preferably it is 3.5 MPa or less, more preferably 3.0 MPa or less, most preferably 2.5 MPa or less or 2.0 MPa or less. The storage modulus of the adhesive layer is measured when dynamic viscoelasticity is measured at a frequency of 1 Hz. The above storage modulus is the real part of the shear elastic modulus represented by a miscellaneous number, and the tensile elastic modulus can be converted by considering the Poisson's ratio of the sample.

本發明之黏著劑層之儲存模數可藉由單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或使用量等來進行控制。The storage modulus of the adhesive layer of the present invention can be controlled by monomer composition, weight average molecular weight, usage amount (addition amount) of crosslinking agent, type or usage amount of other additives, and the like.

本發明之黏著劑層之300%拉伸殘留應力並無特別限定,較佳為2~24 N/cm 2,更佳為2.5~20 N/cm 2,進而較佳為3~16 N/cm 2。若上述300%拉伸殘留應力為2 N/cm 2以上,則容易獲得良好之耐發泡剝離性,若為24 N/cm 2以下,則可獲得良好之應力緩和性,容易獲得良好之階差追隨性而較佳。 The 300% tensile residual stress of the adhesive layer of the present invention is not particularly limited, preferably 2-24 N/cm 2 , more preferably 2.5-20 N/cm 2 , and still more preferably 3-16 N/cm 2 2 . If the above-mentioned 300% tensile residual stress is 2 N/cm 2 or more, it is easy to obtain good foaming and peeling resistance, and if it is 24 N/cm 2 or less, it is easy to obtain good stress relaxation and good step Poor followability is better.

若本發明之黏著劑層之上述300%拉伸殘留應力在上述範圍內,則容易獲得優異之應力緩和性,容易發揮優異之階差追隨性,例如對較大之階差(45 μm左右,例如20~50 μm之高度)亦可良好地追隨。If the above-mentioned 300% tensile residual stress of the adhesive layer of the present invention is within the above-mentioned range, it is easy to obtain excellent stress relaxation, and it is easy to exert excellent step followability, for example, for larger steps (about 45 μm, For example, a height of 20-50 μm) can also be tracked well.

上述300%拉伸殘留應力為如下值(N/cm 2),其係於23℃、50%R.H.之環境下,將黏著劑層沿長度方向拉伸至伸長率(應變)300%,保持該伸長率,求出對自拉伸結束起經過300秒後之黏著劑層施加之拉伸荷重,並將該拉伸荷重除以黏著劑層之初始截面積(拉伸前之截面積)所得。再者,黏著劑層之初始伸長率為100%。 The above-mentioned 300% tensile residual stress is the following value (N/cm 2 ), which is in an environment of 23°C and 50%RH, stretching the adhesive layer along the length direction to an elongation (strain) of 300%, and maintaining the For elongation, the tensile load applied to the adhesive layer after 300 seconds from the end of stretching was obtained, and the tensile load was divided by the initial cross-sectional area of the adhesive layer (the cross-sectional area before stretching). Furthermore, the initial elongation of the adhesive layer is 100%.

本發明之黏著劑層之300%拉伸殘留應力可藉由基礎聚合物之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或使用量等來進行控制。The 300% tensile residual stress of the adhesive layer of the present invention can be controlled by the monomer composition of the base polymer, the weight average molecular weight, the amount (addition amount) of the crosslinking agent, the type or amount of other additives, etc. .

本發明之黏著劑層由於飽和吸濕率被控制得較低,故能夠抑制毫米波之放射損耗。本發明之黏著劑層於25℃、90%R.H.下之飽和吸濕率較佳為2.8%以下,更佳為2.7%以下,進而較佳為2.6%以下,進而更佳為2.5%以下,尤佳為2.4%以下,最佳為2.3%以下、2.2%以下、2.1%以下、2.0%以下、1.9%以下、1.8%以下、1.7%以下、1.6%以下、1.5%以下、1.4%以下、1.3%以下、1.2%以下、1.1%以下、1.0%以下、0.9%以下、0.8%以下、0.7%以下或0.6%以下。若於25℃、90%R.H.下之飽和吸濕率較低,則可抑制室溫附近之毫米波之放射損耗。上述飽和吸濕率之下限值並無特別限定,例如可為0.3%以上,亦可為0.4%以上或0.5%以上。The adhesive layer of the present invention can suppress the radiation loss of millimeter waves because the saturated moisture absorption rate is controlled to be low. The saturated moisture absorption rate of the adhesive layer of the present invention at 25°C and 90% R.H. is preferably 2.8% or less, more preferably 2.7% or less, further preferably 2.6% or less, and even more preferably 2.5% or less, especially The best is less than 2.4%, the best is less than 2.3%, less than 2.2%, less than 2.1%, less than 2.0%, less than 1.9%, less than 1.8%, less than 1.7%, less than 1.6%, less than 1.5%, less than 1.4%, less than 1.3 % or less, 1.2% or less, 1.1% or less, 1.0% or less, 0.9% or less, 0.8% or less, 0.7% or less, or 0.6% or less. If the saturated moisture absorption rate at 25°C and 90% R.H. is low, the radiation loss of millimeter waves near room temperature can be suppressed. The lower limit of the saturated moisture absorption rate is not particularly limited, for example, it may be 0.3% or more, 0.4% or 0.5% or more.

本發明之黏著劑層於65℃、90%R.H.下之飽和吸濕率較佳為2.8%以下,更佳為2.6%以下,進而較佳為2.4%以下,進而更佳為2.3%以下,尤佳為2.2%以下,最佳為2.1%以下、2.0%以下、1.9%以下、1.8%以下、1.7%以下、1.6%以下、1.5%以下、1.4%以下、1.3%以下、1.2%以下、1.1%以下、1.0%以下、0.9%以下、0.8%以下或0.7%以下。上述飽和吸濕率之下限值並無特別限定,例如可為0.4%以上,亦可為0.5%以上或0.6%以上。若於65℃、90%R.H.下之飽和吸濕率較低,則於置於高溫環境下之情形時,亦能夠抑制毫米波之放射損耗。The saturated moisture absorption rate of the adhesive layer of the present invention at 65°C and 90% R.H. is preferably 2.8% or less, more preferably 2.6% or less, further preferably 2.4% or less, and even more preferably 2.3% or less, especially The best is less than 2.2%, the best is less than 2.1%, less than 2.0%, less than 1.9%, less than 1.8%, less than 1.7%, less than 1.6%, less than 1.5%, less than 1.4%, less than 1.3%, less than 1.2%, and less than 1.1 % or less, 1.0% or less, 0.9% or less, 0.8% or less, or 0.7% or less. The lower limit of the saturated moisture absorption rate is not particularly limited, for example, it may be 0.4% or more, or 0.5% or more, or 0.6% or more. If the saturated moisture absorption rate at 65°C and 90% R.H. is low, it can also suppress the radiation loss of millimeter waves when placed in a high temperature environment.

本發明之黏著劑層於85℃、85%R.H.下之飽和吸濕率較佳為5.0%以下,更佳為4.0%以下,進而較佳為3.5%以下,進而更佳為3.0%以下,尤佳為2.8%以下,最佳為2.6%以下、2.4%以下、2.2%以下、2.0%以下、1.8%以下、1.6%以下、1.4%以下、1.2%以下、1.0%以下或0.8%以下。上述飽和吸濕率之下限值並無特別限定,例如可為0.4%以上,亦可為0.5%以上或0.6%以上。若於85℃、85%R.H.下之飽和吸濕率較低,則於置於高溫環境下之情形時,亦能夠抑制毫米波之放射損耗。The saturated moisture absorption rate of the adhesive layer of the present invention at 85°C and 85% R.H. is preferably 5.0% or less, more preferably 4.0% or less, further preferably 3.5% or less, and even more preferably 3.0% or less, especially Preferably it is 2.8% or less, most preferably 2.6% or less, 2.4% or less, 2.2% or less, 2.0% or less, 1.8% or less, 1.6% or less, 1.4% or less, 1.2% or less, 1.0% or less, or 0.8% or less. The lower limit of the saturated moisture absorption rate is not particularly limited, for example, it may be 0.4% or more, or 0.5% or more, or 0.6% or more. If the saturated moisture absorption rate at 85°C and 85% R.H. is low, the radiation loss of millimeter waves can also be suppressed when placed in a high temperature environment.

於各溫度以及濕度環境下之上述飽和吸濕率例如可由乾燥狀態之樣品重量(w1)、以及將該樣品放置於65℃、90%R.H.之氛圍中而停止重量變化之時點(吸濕率為飽和時)之重量(w2),藉由下述式求出。亦可於25℃、90%R.H.以及85℃、85%R.H.之條件下分別求出。再者,w1以及w2之值係設為於相同溫度以及濕度下測定者。 飽和吸濕率(%)={(w2-w1)/w1}×100 The above-mentioned saturated moisture absorption rate under various temperature and humidity environments can be obtained, for example, from the weight of the sample in a dry state (w1) and the point at which the weight change stops when the sample is placed in an atmosphere of 65°C and 90% R.H. (the moisture absorption rate The weight (w2) at the time of saturation) can be obtained by the following formula. It can also be obtained under the conditions of 25°C, 90%R.H. and 85°C, 85%R.H. Furthermore, the values of w1 and w2 are those measured under the same temperature and humidity. Saturation moisture absorption rate (%)={(w2-w1)/w1}×100

本發明之黏著劑層由於由吸濕導致之介電損耗之變化量被控制得較低,故能夠抑制毫米波之放射損耗。本發明之黏著劑層於頻率28 GHz下之介電損耗之由吸濕導致的變化量較佳為0.006以下,更佳為0.005以下,進而較佳為0.004以下。飽和吸濕率之下限值並無特別限定,例如可為0.0001以上,亦可為0.0002以上或0.0003以上。The adhesive layer of the present invention can suppress the radiation loss of millimeter waves because the variation of dielectric loss caused by moisture absorption is controlled to be low. The change in the dielectric loss of the adhesive layer of the present invention at a frequency of 28 GHz due to moisture absorption is preferably 0.006 or less, more preferably 0.005 or less, and still more preferably 0.004 or less. The lower limit of the saturated moisture absorption rate is not particularly limited, and may be, for example, not less than 0.0001, or not less than 0.0002, or not less than 0.0003.

本發明之黏著劑層於頻率60 GHz下之介電損耗之由吸濕導致的變化量較佳為0.003以下,更佳為0.002以下,進而較佳為0.001以下。飽和吸濕率之下限值並無特別限定,例如可為0.0001以上,亦可為0.0002以上、0.0003以上、0.0004以上、0.0005以上、0.0006以上、0.0007以上、0.0008以上或0.0009以上。The change in the dielectric loss of the adhesive layer of the present invention at a frequency of 60 GHz due to moisture absorption is preferably 0.003 or less, more preferably 0.002 or less, and still more preferably 0.001 or less. The lower limit of the saturated moisture absorption rate is not particularly limited. For example, it may be at least 0.0001, or at least 0.0002, at least 0.0003, at least 0.0004, at least 0.0005, at least 0.0006, at least 0.0007, at least 0.0008, or at least 0.0009.

於上述頻率28 GHz以及60 GHz下之介電損耗之變化量可於65℃、90%R.H.之氛圍中保持5天以上,其後恢復至23±1℃、52%±1%R.H.之條件下(經過時間=0分鐘),經過4分鐘後至180分鐘為止每經過10分鐘測定各頻率下之介電損耗,由其等中之最大值(D fmax)以及最小值(D fmin),藉由下述式求出。 介電損耗之變化量=D fmax-D fmin The variation of dielectric loss at the above frequency of 28 GHz and 60 GHz can be kept at 65°C, 90%RH for more than 5 days, and then restored to 23±1°C, 52%±1%RH (Elapsed time = 0 minutes), after 4 minutes to 180 minutes, measure the dielectric loss at each frequency every 10 minutes, from the maximum value (D fmax ) and minimum value (D fmin ), by Calculated by the following formula. Variation of dielectric loss = D fmax - D fmin

本發明之黏著劑層由於水蒸氣透過度被控制得較低,故能夠抑制毫米波之放射損耗。本發明之黏著劑層於40℃、92%R.H.下之水蒸氣透過度較佳為430 g/m 2/day以下,更佳為300 g/m 2/day以下,進而更佳為250 g/m 2/day以下,進而更佳為200 g/m 2/day以下,尤佳為150 g/m 2/day以下,最佳為100 g/m 2/day以下、50 g/m 2/day以下或30 g/m 2/day以下。若於40℃、92%R.H.下之水蒸氣透過度較低,則黏著劑層之耐水性提高,可抑制該黏著劑層中之毫米波之放射損耗。水蒸氣透過度之下限值並無特別限定,例如可為10 g/m 2/day以上,亦可為20 g/m 2/day以上或25 g/m 2/day以上。 The adhesive layer of the present invention can suppress the radiation loss of millimeter waves because the water vapor permeability is controlled to be low. The water vapor permeability of the adhesive layer of the present invention at 40°C and 92%RH is preferably 430 g/m 2 /day or less, more preferably 300 g/m 2 /day or less, and even more preferably 250 g/m 2 /day m 2 /day or less, more preferably 200 g/m 2 /day or less, especially 150 g/m 2 /day or less, most preferably 100 g/m 2 /day or less, 50 g/m 2 /day below or below 30 g/m 2 /day. If the water vapor permeability at 40°C and 92%RH is low, the water resistance of the adhesive layer will be improved, and the radiation loss of millimeter waves in the adhesive layer can be suppressed. The lower limit of the water vapor permeability is not particularly limited, for example, it may be 10 g/m 2 /day or more, 20 g/m 2 /day or 25 g/m 2 /day or more.

上述水蒸氣透過度(Water Vapor Transmission Rate;WVTR)係基於杯式法測定之值。可藉由如下方法求出:測定於黏著劑層與外部隔離之氯化鈣之乾燥狀態之重量(w1)、以及將該樣品放置於40℃、92%R.H.之氛圍中並經過規定時間之時點(吸濕率為飽和時)之重量(w2),將重量變化量換算為單位時間(1天)、單位面積(1 m 2)。 The above water vapor transmission rate (Water Vapor Transmission Rate; WVTR) is based on the value measured by the cup method. It can be obtained by measuring the weight (w1) of the dry state of calcium chloride isolated from the outside by the adhesive layer, and placing the sample in an atmosphere of 40°C and 92%RH for a predetermined time. The weight (w2) when the moisture absorption rate is saturated, and the weight change is converted into unit time (1 day) and unit area (1 m 2 ).

本發明之黏著劑層於28 GHz或60 GHz下之介電常數或介電損耗、飽和吸濕率、由吸濕導致之介電損耗之變化量以及水蒸氣透過度可藉由調整單體組成、添加劑之種類或含量等而進行調整。The dielectric constant or dielectric loss of the adhesive layer of the present invention at 28 GHz or 60 GHz, the saturated moisture absorption rate, the change in dielectric loss caused by moisture absorption, and the water vapor permeability can be adjusted by adjusting the monomer composition , the type or content of additives, etc.

本發明之黏著劑層之厚度並無特別限定,較佳為10~500 μm,更佳為11~400 μm,進而較佳為12~350 μm,進而更佳為12~300 μm。若厚度為一定以上,則階差追隨性或接著可靠性容易提高。又,若厚度為一定以下,則有操作時異物不易被吸收,又,製造性優異之傾向。The thickness of the adhesive layer of the present invention is not particularly limited, but is preferably 10-500 μm, more preferably 11-400 μm, further preferably 12-350 μm, and even more preferably 12-300 μm. When the thickness is equal to or greater than a certain level, step followability or adhesion reliability tends to improve. Moreover, if the thickness is not more than a certain value, foreign substances are not easily absorbed during handling, and the manufacturability tends to be excellent.

作為上述黏著劑層之製造方法,並無特別限定,例如可例舉如下方法:將上述黏著劑組合物塗佈(塗敷)於基材或剝離襯墊上,視需要使其乾燥、硬化、或乾燥以及硬化。硬化可藉由照射活性能量線、加熱乾燥等來進行。The method for producing the above-mentioned adhesive layer is not particularly limited, and for example, a method of applying (coating) the above-mentioned adhesive composition on a substrate or a release liner, drying, curing, and Or dry and harden. Curing can be performed by irradiating active energy rays, heating and drying, or the like.

再者,上述黏著劑組合物之塗佈(塗敷)亦可使用公知之塗佈法。例如,亦可使用凹版輥式塗佈機、逆向輥式塗佈機、接觸輥式塗佈機、浸漬輥式塗佈機、棒式塗佈機、刮刀塗佈機、噴霧塗佈機、缺角輪塗佈機、直接塗佈機等塗佈機。In addition, a well-known coating method can also be used for coating (coating) of the said adhesive composition. For example, a gravure roll coater, reverse roll coater, touch roll coater, dip roll coater, rod coater, knife coater, spray coater, etc. Corner wheel coater, direct coater and other coating machines.

[黏著片材] 本發明之黏著片材只要具有本發明之黏著劑層即可,於其他方面並無特別限定。 [adhesive sheet] The adhesive sheet of the present invention is not particularly limited in other respects as long as it has the adhesive layer of the present invention.

本發明之黏著片材可為雙面均為黏著劑層表面之雙面黏著片材,亦可為僅單面為黏著劑層表面之單面黏著片材。其中,從將2個構件彼此貼合方面考慮,較佳為雙面黏著片材。再者,於本說明書中,於稱為「黏著片材」之情形時設為帶狀者,即,「黏著帶」亦包含在內者。又,於本說明書中,有時將黏著劑層表面稱為「黏著面」。The adhesive sheet of the present invention may be a double-sided adhesive sheet with both sides being the surface of the adhesive layer, or a single-sided adhesive sheet with only one side being the surface of the adhesive layer. Among these, a double-sided adhesive sheet is preferable from the viewpoint of bonding two members together. In addition, in this specification, when referring to an "adhesive sheet", what is made into a belt shape is also included in an "adhesive tape". Also, in this specification, the surface of the adhesive layer may be referred to as an "adhesive surface".

本發明之黏著片材亦可至使用時前於黏著面設置有間隔件(剝離襯墊)。The adhesive sheet of the present invention may be provided with a spacer (release liner) on the adhesive surface before use.

本發明之黏著片材可為不具有基材(基材層)之所謂「無基材型」之黏著片材(以下,有時稱為「無基材黏著片材」),亦可為具有基材之類型之黏著片材(以下,有時稱為「附基材之黏著片材」)。作為上述無基材黏著片材,例如可例舉:僅包含上述黏著劑層之雙面黏著片材、或包含上述黏著劑層、及上述黏著劑層以外之黏著劑層(有時稱為「其他黏著劑層」)之雙面黏著片材等。另一方面,作為附基材之黏著片材,可例舉於基材之至少單面側具有上述黏著劑層之黏著片材等。其中,較佳為無基材黏著片材(無基材雙面黏著片材),更佳為僅包含上述黏著劑層之無基材雙面黏著片材。又,亦較佳為於基材之雙面具有上述黏著劑層之黏著片材(附基材之雙面黏著片材)。上述附基材之雙面黏著片材中之雙面的黏著劑層可均為本發明之黏著劑層,亦可一面為本發明之黏著劑層且另一面為其他黏著劑層。再者,上述「基材(基材層)」不含於黏著片材之使用(貼附)時剝離之間隔件。The adhesive sheet of the present invention may be a so-called "substrate-less type" adhesive sheet (hereinafter, sometimes referred to as "substrate-less adhesive sheet") that does not have a substrate (substrate layer), or may have Adhesive sheet of substrate type (hereinafter, sometimes referred to as "adhesive sheet with substrate"). Examples of the base-less adhesive sheet include, for example, a double-sided adhesive sheet including only the above-mentioned adhesive layer, or a double-sided adhesive sheet including the above-mentioned adhesive layer and an adhesive layer other than the above-mentioned adhesive layer (sometimes referred to as "" Other adhesive layers") double-sided adhesive sheets, etc. On the other hand, as an adhesive sheet with a base material, the adhesive sheet etc. which have the said adhesive agent layer on the at least one side of a base material are mentioned. Among them, a substrate-less adhesive sheet (substrate-free double-sided adhesive sheet) is preferred, and a substrate-less double-sided adhesive sheet comprising only the above-mentioned adhesive layer is more preferred. Moreover, it is also preferable that it is an adhesive sheet which has the said adhesive agent layer on both surfaces of a base material (double-sided adhesive sheet with base material). The adhesive layers on both sides of the above-mentioned double-sided adhesive sheet with substrate may be the adhesive layer of the present invention, or one side may be the adhesive layer of the present invention and the other side may be another adhesive layer. In addition, the above-mentioned "substrate (substrate layer)" does not include a spacer that is peeled off when the adhesive sheet is used (attached).

為了避免由基材導致之毫米波之放射損耗,本發明之黏著片材較佳為無基材黏著片材。其中,於基材包含低介電常數、低介電損耗之材料之情形時,亦可為附基材之黏著片材。基材較理想為無論毫米波之偏光狀態如何均可使用,故較佳為無延伸者,尤佳為各向同性者。In order to avoid the radiation loss of millimeter waves caused by the substrate, the adhesive sheet of the present invention is preferably an adhesive sheet without a substrate. Wherein, when the base material includes a material with low dielectric constant and low dielectric loss, it can also be an adhesive sheet with the base material. Ideally, the base material can be used regardless of the polarization state of the millimeter wave, so it is preferably non-stretching, and especially isotropic.

本發明之黏著片材對於玻璃板之拉伸速度300 mm/min下的180°剝離接著力(尤其是由本發明之黏著劑層提供之黏著面對於玻璃板之180°剝離接著力)並無特別限定,若接著力較高,則從可獲得對天線元件之充分之密接方面考慮,較佳為3 N/20 mm以上,更佳為3.5 N/20 mm以上,進而較佳為4 N/20 mm以上,進而更佳為5 N/20 mm,尤佳為6 N/20 mm以上,最佳為7 N/20 mm以上、8 N/20 mm以上、9 N/20 mm以上或10 N/20 mm以上。若上述剝離接著力為一定值以上,則對玻璃之接著性、階差中之隆起之抑制性更優異。再者,本發明之黏著片材對於玻璃板之拉伸速度300 mm/min下之180°剝離接著力的上限值並無特別限定,例如,較佳為30 N/20 mm以下,更佳為25 N/20 mm以下,進而較佳為22 N/20 mm以下,進而更佳為20 N/20 mm,尤佳為19 N/20 mm以下,最佳為18 N/20 mm以下、17 N/20 mm以下、16 N/20 mm以下、15 N/20 mm、14 N/20 mm以下、13 N/20 mm以下、12 N/20 mm以下或11 N/20 mm以下。對於玻璃板之拉伸速度300 mm/min下之180°剝離接著力係藉由下述180°剝離接著力之測定方法求出。The adhesive sheet of the present invention has no special 180° peel adhesion to the glass plate at a tensile speed of 300 mm/min (especially the 180° peel adhesion of the adhesive surface provided by the adhesive layer of the present invention to the glass plate) Restricted, if the adhesive force is high, it is preferably 3 N/20 mm or more, more preferably 3.5 N/20 mm or more, and more preferably 4 N/20 from the aspect of obtaining sufficient adhesion to the antenna element. mm or more, more preferably 5 N/20 mm or more, particularly preferably 6 N/20 mm or more, most preferably 7 N/20 mm or more, 8 N/20 mm or more, 9 N/20 mm or more or 10 N/20 mm or more More than 20mm. When the above-mentioned peeling adhesive strength is at least a certain value, the adhesiveness to glass and the suppression of swelling in the step difference are more excellent. Furthermore, the adhesive sheet of the present invention has no particular limitation on the upper limit of the 180° peel adhesive force at a tensile speed of 300 mm/min for the glass plate, for example, it is preferably below 30 N/20 mm, more preferably 25 N/20 mm or less, more preferably 22 N/20 mm or less, more preferably 20 N/20 mm, especially 19 N/20 mm or less, most preferably 18 N/20 mm or less, 17 N/20 mm or less, 16 N/20 mm or less, 15 N/20 mm or less, 14 N/20 mm or less, 13 N/20 mm or less, 12 N/20 mm or less, or 11 N/20 mm or less. The 180° peel adhesion force for the glass plate at a tensile speed of 300 mm/min is obtained by the following method for measuring the 180° peel adhesion force.

作為上述玻璃板,例如可例舉商品名「鈉鈣玻璃(SODA-LIME GLASS) ♯0050」(松浪玻璃工業股份有限公司製造)。又,亦可例舉無鹼玻璃或化學強化玻璃等。As said glass plate, a brand name "soda-lime glass (SODA-LIME GLASS)♯0050" (made by Songnang Glass Industry Co., Ltd.) can be mentioned, for example. Moreover, non-alkali glass, chemically strengthened glass, etc. are also mentioned.

對於玻璃板之拉伸速度300 mm/min下之180°剝離接著力係藉由下述測定方法求出。將黏著片材之黏著面貼合於被接著體,於2 kg輥、往返一次之壓接條件下進行壓接,於23℃、50%R.H.之氛圍下進行30分鐘老化後,依據JIS Z0237,於23℃、50%R.H.之氛圍下,於拉伸速度300 mm/min、剝離角度180°之條件下,將黏著片材自被接著體剝離,測定180°剝離接著力(N/20 mm)。The 180° peel adhesion force at a tensile speed of 300 mm/min for a glass plate was obtained by the following measurement method. Attach the adhesive surface of the adhesive sheet to the adherend, and perform crimping under the conditions of 2 kg roller, one reciprocation, and aging for 30 minutes in an atmosphere of 23°C and 50% R.H. According to JIS Z0237, Under the atmosphere of 23°C and 50% R.H., under the conditions of tensile speed 300 mm/min and peeling angle 180°, the adhesive sheet was peeled off from the adherend, and the 180° peeling adhesion force was measured (N/20 mm) .

本發明之黏著片材之180°剝離接著力可藉由基礎聚合物(丙烯酸系聚合物)之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或使用量等來進行控制。The 180° peel adhesion of the adhesive sheet of the present invention can be determined by the monomer composition of the base polymer (acrylic polymer), the weight average molecular weight, the amount of crosslinking agent used (addition amount), the type or use of other additives amount etc. to control.

本發明之黏著片材之厚度(總厚度)並無特別限定,較佳為10~500 μm,更佳為11~400 μm,進而較佳為12~350 μm,進而更佳為12~300 μm。若厚度為一定以上,則不易產生於階差部位之剝離。又,若厚度為一定以下,則於製造時容易保持優異之外觀。再者,本發明之黏著片材之厚度不包括間隔件之厚度。The thickness (total thickness) of the adhesive sheet of the present invention is not particularly limited, but is preferably 10-500 μm, more preferably 11-400 μm, further preferably 12-350 μm, and still more preferably 12-300 μm . If the thickness is equal to or greater than a certain level, peeling at the step portion is less likely to occur. Moreover, if the thickness is not more than a certain value, it will be easy to maintain an excellent appearance at the time of manufacture. Furthermore, the thickness of the adhesive sheet of the present invention does not include the thickness of the spacer.

本發明之黏著片材之霧度(依據JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而更佳為0.9%以下,尤佳為0.8%以下。若霧度為1.2%以下,則容易獲得優異之透明性或優異之外觀。上述霧度例如可設為黏著劑層厚度25 μm,將其於常態(23℃,50%R.H.)下靜置至少24小時,其後貼合於載玻片(例如全光線透過率91.8%,霧度0.4%),將所得者設為試樣,並使用霧度計(製品名「HM-150」,村上色彩技術研究所股份有限公司製造)進行測定。The haze (in accordance with JIS K7136) of the adhesive sheet of the present invention is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, further preferably 1.0% or less, still more preferably 0.9% or less, especially Preferably less than 0.8%. When the haze is 1.2% or less, it is easy to obtain excellent transparency or an excellent appearance. For example, the above-mentioned haze can be set to a thickness of 25 μm of the adhesive layer, which is left to stand at a normal state (23°C, 50% R.H.) for at least 24 hours, and then attached to a glass slide (for example, the total light transmittance is 91.8%, haze 0.4%), and the obtained product was used as a sample, and measured using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Laboratory Co., Ltd.).

本發明之黏著片材於可見光波長區域中之全光線透過率(依據JIS K7361-1)較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而更佳為90%以上,尤佳為91%以上,最佳為92%以上。若全光線透過率為85%以上,則容易獲得優異之透明性或優異之外觀。上述全光線透過率例如可設為黏著劑層厚度25 μm,將其於常態(23℃,50%R.H.)下靜置至少24小時,其後於具有間隔件之情形時將其剝離,貼合於載玻片(例如全光線透過率91.8%,霧度0.4%),將所得者設為試樣,並使用霧度計(製品名「HM-150」,村上色彩技術研究所股份有限公司製造)進行測定。The total light transmittance (according to JIS K7361-1) of the adhesive sheet of the present invention in the visible light wavelength region is preferably 85% or more, more preferably 88% or more, further preferably 89% or more, and still more preferably 90% More than 91%, preferably more than 91%, and most preferably more than 92%. When the total light transmittance is 85% or more, it is easy to obtain excellent transparency or excellent appearance. The above-mentioned total light transmittance can be set, for example, to a thickness of 25 μm of the adhesive layer, which is left to stand at a normal state (23°C, 50% R.H.) for at least 24 hours, and then peeled off when there is a spacer, and bonded On a slide glass (for example, total light transmittance 91.8%, haze 0.4%), set the resultant as a sample, and use a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd. ) to measure.

本發明之黏著劑層之霧度、全光線透過率可藉由調整單體組成、添加劑之種類或含量等而進行調整。The haze and total light transmittance of the adhesive layer of the present invention can be adjusted by adjusting the monomer composition, the type or content of additives, and the like.

本發明之黏著片材並無特別限定,較佳為依據公知或慣用之製造方法製造。例如,於本發明之黏著片材為無基材黏著片材之情形時,可藉由在間隔件上藉由上述方法形成上述黏著劑層而獲得。又,於本發明之黏著片材為附基材之黏著片材之情形時,可藉由在基材表面直接形成上述黏著劑層而獲得(直印法),亦可藉由暫時於間隔件上形成上述黏著劑層,其後轉印(貼合)於基材,藉此於基材上設置上述黏著劑層而獲得(轉印法)。The adhesive sheet of the present invention is not particularly limited, and is preferably manufactured according to known or customary manufacturing methods. For example, when the adhesive sheet of the present invention is a substrate-less adhesive sheet, it can be obtained by forming the above-mentioned adhesive layer on a separator by the above-mentioned method. Also, when the adhesive sheet of the present invention is an adhesive sheet with a base material, it can be obtained by directly forming the above-mentioned adhesive layer on the surface of the base material (direct printing method), or by temporarily applying the adhesive layer on the spacer. Form the above-mentioned adhesive layer on the substrate, and then transfer (laminate) to the substrate, thereby obtaining the above-mentioned adhesive layer on the substrate (transfer printing method).

本發明之黏著片材除了上述黏著劑層以外,還可具有其他層。作為其他層,例如可例舉:其他黏著劑層(除了上述黏著劑層以外之黏著劑層(除了由本發明之黏著劑組合物形成之黏著劑層以外之黏著劑層))、中間層、底塗層等。再者,本發明之黏著片材亦可具有2層以上之其他層。The adhesive sheet of the present invention may have other layers in addition to the above-mentioned adhesive layer. Examples of other layers include: other adhesive layers (adhesive layers other than the above-mentioned adhesive layer (adhesive layer other than the adhesive layer formed from the adhesive composition of the present invention)), intermediate layer, base layer, etc. coating etc. In addition, the adhesive sheet of this invention may have other layers of 2 or more layers.

作為本發明之黏著片材為附基材之黏著片材時之基材,例如可例舉:塑膠膜、抗反射(AR)膜、偏光板、相位差板等各種光學膜。作為上述塑膠膜等素材,例如可例舉:聚對苯二甲酸乙二酯(PET)等聚酯系樹脂;聚甲基丙烯酸甲酯(PMMA)等(甲基)丙烯酸系樹脂;聚碳酸酯、三乙醯纖維素(TAC)、聚碸、聚芳酯、聚醯亞胺、聚氯乙烯、聚乙酸乙烯酯、聚乙烯、聚丙烯、乙烯-丙烯共聚物、商品名「Arton(環狀烯烴系聚合物,JSR股份有限公司製造)」、商品名「Zeonor(環狀烯烴系聚合物,日本Zeon股份有限公司製造)」等環狀烯烴系聚合物;氟系聚合物等塑膠材料。再者,該等塑膠材料可單獨使用或組合兩種以上使用。又,上述「基材」係於將黏著片材貼附於被接著體時,與黏著劑層一併貼附於被接著體之部分。於黏著片材之使用時(貼附時)剝離之間隔件(剝離襯墊)不包括於「基材」中。When the adhesive sheet of the present invention is an adhesive sheet with a base material, for example, various optical films such as plastic films, anti-reflection (AR) films, polarizing plates, and retardation plates may be mentioned. Examples of materials such as the aforementioned plastic film include: polyester resins such as polyethylene terephthalate (PET); (meth)acrylic resins such as polymethyl methacrylate (PMMA); polycarbonate , triacetyl cellulose (TAC), polystyrene, polyarylate, polyimide, polyvinyl chloride, polyvinyl acetate, polyethylene, polypropylene, ethylene-propylene copolymer, trade name "Arton (cyclic Olefin-based polymers, manufactured by JSR Co., Ltd.), cyclic olefin-based polymers such as "Zeonor (cyclic olefin-based polymers, manufactured by Japan Zeon Co., Ltd.)" and "Zeonor"; fluorine-based polymers and other plastic materials. Furthermore, these plastic materials can be used alone or in combination of two or more. In addition, the above-mentioned "substrate" refers to the part that is attached to the adherend together with the adhesive layer when the adhesive sheet is attached to the adherend. The spacer (release liner) to be peeled off when the adhesive sheet is used (attached) is not included in the "substrate".

上述基材較佳為透明。上述基材於可見光波長區域中之全光線透過率(依據JIS K7361-1)較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而更佳為90%以上,尤佳為91%以上,最佳為92%以上。又,上述基材之霧度(依據JIS K7136)較佳為1.0%以下,更佳為0.8%以下。作為此種透明之基材,例如可例舉:PET膜、或商品名「Arton」、商品名「Zeonor」等無配向膜等。尤其是無配向膜由於其特性不取決於毫米波之電場方向,故較佳。The aforementioned substrate is preferably transparent. The total light transmittance (according to JIS K7361-1) of the above substrate in the visible light wavelength region is preferably 85% or more, more preferably 88% or more, further preferably 89% or more, and still more preferably 90% or more, The best is above 91%, and the best is above 92%. Moreover, the haze of the said base material (according to JIS K7136) becomes like this. Preferably it is 1.0 % or less, More preferably, it is 0.8 % or less. As such a transparent base material, non-alignment films, such as a PET film, a brand name "Arton", and a brand name "Zeonor", etc. are mentioned, for example. In particular, a non-alignment film is preferable because its characteristics do not depend on the direction of the electric field of the millimeter wave.

上述基材之厚度並無特別限定,例如較佳為12~500 μm。再者,上述基材可具有單層以及複層中之任一種形態。又,亦可對上述基材表面適當實施例如電暈放電處理、電漿處理、電子束處理等物理處理;底塗處理等化學處理等公知慣用之表面處理。The thickness of the above substrate is not particularly limited, for example, it is preferably 12-500 μm. Furthermore, the aforementioned base material may have any form of a single layer or a multi-layer. In addition, known and conventional surface treatments such as physical treatments such as corona discharge treatment, plasma treatment, and electron beam treatment; and chemical treatments such as primer treatment can also be appropriately performed on the surface of the above-mentioned substrate.

本發明之黏著片材亦可至使用時前於黏著面設置有間隔件(剝離襯墊)。再者,於本發明之黏著片材為雙面黏著片材之情形時,各黏著面可分別利用2片間隔件保護,亦可利用1片雙面為剝離面之間隔件,以捲繞為卷狀之形態保護。間隔件係用作黏著劑層之保護材,並於貼附於被接著體時剝離。又,於本發明之黏著片材為無基材黏著片材之情形時,間隔件亦負責作為黏著劑層之支持體之作用。再者,間隔件亦可未必設置。The adhesive sheet of the present invention may be provided with a spacer (release liner) on the adhesive surface before use. Furthermore, when the adhesive sheet of the present invention is a double-sided adhesive sheet, each adhesive surface can be protected by two spacers, or one spacer can be used as a double-sided peeling surface, and the winding can be Rolled shape protection. The spacer is used as a protective material for the adhesive layer, and it is peeled off when it is attached to the adherend. In addition, when the adhesive sheet of the present invention is a substrate-less adhesive sheet, the spacer also serves as a support for the adhesive layer. Furthermore, the spacer may not necessarily be provided.

作為上述間隔件,可使用慣用之剝離紙等,並無特別限定。例如可例舉:具有剝離處理層之基材、包含氟聚合物之低接著性基材或包含無極性聚合物之低接著性基材等。作為上述具有剝離處理層之基材,例如可例舉利用聚矽氧系、長鏈烷基系、氟系、硫化鉬等剝離處理劑進行了表面處理之塑膠膜或紙等。作為上述包含氟聚合物之低接著性基材中之氟系聚合物,例如可例舉:聚四氟乙烯、聚氯三氟乙烯、聚氟乙烯、聚偏二氟乙烯、四氟乙烯-六氟丙烯共聚物、氯氟乙烯-偏二氟乙烯共聚物等。又,作為上述無極性聚合物,例如可例舉烯烴系樹脂(例如聚乙烯、聚丙烯等)等,亦可使用聚酯系基材(聚對苯二甲酸乙二酯系基材、聚萘二甲酸乙二酯系基材、聚對苯二甲酸丁二酯系基材等)等。再者,間隔件可藉由公知或慣用之方法而形成。又,間隔件之厚度等亦並無特別限定。As the separator, a commonly used release paper or the like can be used without any particular limitation. For example, a base material having a release treatment layer, a low-adhesion base material containing a fluoropolymer, or a low-adhesion base material containing a non-polar polymer, etc. may be mentioned. Examples of the base material having the release treatment layer include plastic films or paper surface-treated with a release treatment agent such as silicone-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide. As the fluorine-based polymer in the above-mentioned low-adhesion base material containing a fluoropolymer, for example, polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoroethylene Fluoropropylene copolymer, chlorofluorovinyl-vinylidene fluoride copolymer, etc. In addition, as the above-mentioned nonpolar polymer, for example, olefin-based resins (such as polyethylene, polypropylene, etc.) can be exemplified, and polyester-based substrates (polyethylene terephthalate-based substrates, polynaphthalene-based substrates, etc.) can also be used. Diformate-based substrates, polybutylene terephthalate-based substrates, etc.), etc. Furthermore, the spacers can be formed by known or customary methods. Moreover, the thickness etc. of a spacer are not specifically limited, either.

本發明之黏著片材由於具有本發明之黏著劑層,故接著性以及耐發泡剝離性優異,進而,應力緩和性優異,階差追隨性優異。因此,接著可靠性、尤其是高溫時之接著可靠性優異。又,外觀性優異。Since the adhesive sheet of the present invention has the adhesive layer of the present invention, it is excellent in adhesiveness and foaming and peeling resistance, furthermore, it is excellent in stress relaxation and excellent in step followability. Therefore, adhesion reliability, especially adhesion reliability at high temperature is excellent. Moreover, it is excellent in appearance.

因此,本發明之黏著片材可有用地用於構件之貼合,該構件於高溫時於界面處容易產生發泡。例如,聚甲基丙烯酸甲酯樹脂(PMMA)有時會包含未反應單體,於高溫時容易產生由異物引起之發泡。又,聚碳酸酯(PC)於高溫時容易產生水與二氧化碳之釋氣。本發明之黏著片材由於耐發泡剝離性優異,故亦可有用地用於包含此種樹脂之塑膠被接著體。Therefore, the adhesive sheet of the present invention can be usefully used for lamination of members which tend to generate foaming at the interface at high temperature. For example, polymethyl methacrylate resin (PMMA) sometimes contains unreacted monomers, and foaming caused by foreign matter is likely to occur at high temperatures. In addition, polycarbonate (PC) is prone to outgassing of water and carbon dioxide at high temperature. Since the adhesive sheet of the present invention is excellent in foaming and peeling resistance, it can also be usefully used for a plastic adherend including such a resin.

又,本發明之黏著片材除了可有用地用於線膨脹係數較小之被接著體以外,亦可有用地用於線膨脹係數較大之被接著體。再者,作為上述線膨脹係數較小之被接著體,例如可例舉:玻璃板(線膨脹係數0.3×10 -5~0.8×10 -5/℃)、聚對苯二甲酸乙二酯基材(PET膜,線膨脹係數1.5×10 -5~2×10 -5/℃)等。又,作為上述線膨脹係數較大之被接著體,例如可例舉線膨脹係數較大之樹脂基材,更具體而言,可例舉:聚碳酸酯樹脂基材(PC,線膨脹係數7×10 -5~8×10 -5/℃)、聚甲基丙烯酸甲酯樹脂基材(PMMA,線膨脹係數7×10 -5~8×10 -5/℃)、環烯烴聚合物基材(COP,線膨脹係數6×10 -5~7×10 -5/℃)、商品名「Zeonor」(日本Zeon股份有限公司製造)、商品名「Arton」(JSR股份有限公司製造)等。 In addition, the adhesive sheet of the present invention can be usefully used for an adherend having a relatively large linear expansion coefficient as well as being useful for an adherend having a relatively small linear expansion coefficient. In addition, as an adherend with a small linear expansion coefficient, for example, a glass plate (with a linear expansion coefficient of 0.3×10 -5 to 0.8×10 -5 /°C), a polyethylene terephthalate base material (PET film, coefficient of linear expansion 1.5×10 -5 to 2×10 -5 /°C), etc. In addition, as the adhered body with a large linear expansion coefficient, for example, a resin base material with a large linear expansion coefficient can be cited, and more specifically, a polycarbonate resin base material (PC, with a linear expansion coefficient of 7 ×10 -5 ~8×10 -5 /℃), polymethyl methacrylate resin substrate (PMMA, linear expansion coefficient 7×10 -5 ~8×10 -5 /℃), cycloolefin polymer substrate (COP, coefficient of linear expansion 6×10 -5 to 7×10 -5 /°C), trade name “Zeonor” (manufactured by Japan Zeon Co., Ltd.), trade name “Arton” (manufactured by JSR Co., Ltd.), etc.

本發明之黏著片材可有用地用於線膨脹係數較小之被接著體與線膨脹係數較大之被接著體的貼合。具體而言,本發明之黏著片材可較佳地用於玻璃被接著體(例如玻璃板、化學強化玻璃、玻璃透鏡等)與上述線膨脹係數較大之樹脂基材之貼合。The adhesive sheet of the present invention can be usefully used for laminating an adherend with a small coefficient of linear expansion and an adherend with a large coefficient of linear expansion. Specifically, the adhesive sheet of the present invention can be preferably used for laminating glass substrates (such as glass plates, chemically strengthened glass, glass lenses, etc.) and the above-mentioned resin substrates with a large coefficient of linear expansion.

如此,本發明之黏著片材對各種素材之被接著體彼此之貼合有用,尤其可有用地用於玻璃被接著體與塑膠被接著體之貼合。再者,塑膠被接著體亦可為於表面具有ITO(Indium Tin Oxide,氧化銦錫)(銦與錫之氧化物)層之塑膠膜之類的光學膜。In this way, the adhesive sheet of the present invention is useful for laminating adherends of various materials, especially for lamination of glass adherends and plastic adherends. Furthermore, the plastic adherend can also be an optical film such as a plastic film having an ITO (Indium Tin Oxide) (indium and tin oxide) layer on its surface.

進而,本發明之黏著片材除了可有用地用於表面平滑之被接著體以外,亦可有用地用於表面具有階差之被接著體。尤其是即便玻璃被接著體以及上述線膨脹係數較大之樹脂基材中之至少一者於表面具有階差,本發明之黏著片材亦可有用地用於玻璃被接著體與上述線膨脹係數較大之樹脂基材之貼合。Furthermore, the adhesive sheet of this invention can be usefully used not only for the adherend which has a smooth surface, but also usefully for the adherend which has a level difference in the surface. In particular, even if at least one of the glass substrate and the aforementioned resin substrate having a large linear expansion coefficient has a step difference on the surface, the adhesive sheet of the present invention can be usefully used for a glass substrate and the above-mentioned resin substrate having a large linear expansion coefficient. Bonding of larger resin substrates.

本發明之黏著片材可較佳地用於可攜式電子設備之製造用途。作為上述可攜式電子設備,例如可例舉:行動電話、PHS(Personal Handyphone System,個人便攜式電話系統)、智慧型手機、平板(平板型電腦)、行動電腦(行動PC)、攜帶型資訊終端(PDA)、電子記事本、攜帶型電視或攜帶型收音機等攜帶型廣播收發機、攜帶型遊戲機、隨身聽、可攜式DVD(數位化多功能光碟,Digital Versatile Disc)播放器、數位相機等相機、攝錄像機(camcorder)型之攝錄影機等。The adhesive sheet of the present invention can be preferably used in the manufacture of portable electronic devices. As above-mentioned portable electronic equipment, for example can enumerate: mobile phone, PHS (Personal Handyphone System, personal portable telephone system), smart phone, tablet (tablet type computer), mobile computer (mobile PC), portable information terminal (PDA), electronic notepad, portable TV or portable radio and other portable broadcast transceivers, portable game consoles, walkmans, portable DVD (Digital Versatile Disc) players, digital cameras Such as cameras, camcorder type camcorders, etc.

本發明之黏著片材例如可較佳地用於構成可攜式電子設備之構件或模組彼此之貼附、或構成可攜式電子設備之構件或模組向殼體之固定等。更具體而言,可例舉:覆蓋玻璃或透鏡(尤其是玻璃透鏡)與觸控面板或觸控感測器、天線模組之貼合;覆蓋玻璃或透鏡(尤其是玻璃透鏡)向殼體之固定;顯示面板向殼體之固定;天線模組向殼體之固定;片狀鍵盤或觸控面板等輸入裝置向殼體之固定;資訊顯示部之保護面板與殼體之貼合;殼體彼此之貼合;殼體與裝飾用片材之貼合;構成可攜式電子設備之各種構件或模組之固定或貼合等。再者,於本說明書中,顯示面板係指至少包含透鏡(尤其是玻璃透鏡)以及觸控面板之構造物。又,本說明書中之透鏡係包含顯示光之折射作用之透明體、以及無光之折射作用的透明體兩者之概念。即,本說明書中之透鏡亦包含無折射作用之單純之窗面板。The adhesive sheet of the present invention can be preferably used for attaching components or modules constituting a portable electronic device to each other, or fixing components or modules constituting a portable electronic device to a housing, etc., for example. More specifically, it can be exemplified: bonding of cover glass or lens (especially glass lens) to touch panel or touch sensor, antenna module; cover glass or lens (especially glass lens) to the housing Fixing of the display panel to the casing; fixing of the antenna module to the casing; fixing of input devices such as sheet keyboards or touch panels to the casing; bonding of the protective panel of the information display part and the casing; Bonding of bodies; bonding of shells and decorative sheets; fixing or bonding of various components or modules that constitute portable electronic devices, etc. Furthermore, in this specification, a display panel refers to a structure including at least a lens (especially a glass lens) and a touch panel. In addition, the lens in this specification includes both the concept of the transparent body which shows the refraction action of light, and the transparent body which does not have the refraction action of light. That is, the lens in this specification also includes a simple window panel without refraction.

進而,本發明之黏著片材可較佳地用於光學用途。即,本發明之黏著片材較佳為用於光學用途之光學用黏著片材。更具體而言,例如,較佳為用於貼合光學構件之用途(光學構件貼合用)或使用上述光學構件之製品(光學製品)之製造用途等。Furthermore, the adhesive sheet of this invention can be used preferably for an optical use. That is, the adhesive sheet of the present invention is preferably an optical adhesive sheet used for optical use. More specifically, for example, it is preferably used for bonding optical members (for bonding optical members), or manufacturing applications of products (optical products) using the above-mentioned optical members, and the like.

作為光學構件,可例舉如下光學構件,其係至少具有上述黏著片材以及基板者,且上述基板於至少單面具備金屬電極以及配線(例如銅、銀、ITO配線等),於上述基板之具有上述金屬電極以及配線之側的面上貼合有本發明之黏著劑層。再者,上述黏著片材可至使用時前於黏著面設置有間隔件,但本發明之光學構件中之上述黏著片材為使用時之黏著片材,故不具有間隔件。As an optical member, the following optical members may be mentioned, which are those having at least the above-mentioned adhesive sheet and a substrate, and the above-mentioned substrate is provided with metal electrodes and wiring (such as copper, silver, ITO wiring, etc.) The adhesive layer of the present invention is bonded to the surface on the side having the above-mentioned metal electrodes and wiring. Furthermore, the above-mentioned adhesive sheet may be provided with a spacer on the adhesive surface before use, but the above-mentioned adhesive sheet in the optical member of the present invention is an adhesive sheet for use, and therefore does not have a spacer.

進而,上述光學構件較佳為在上述基板之與具有上述金屬電極以及配線之側相反之側具有上述黏著劑層,進而較佳為在上述基板之與具有上述金屬電極以及配線之側相反之側的面上貼合有上述黏著劑層。Furthermore, it is preferable that the optical member has the adhesive layer on the side of the substrate opposite to the side having the metal electrodes and wiring, and it is further more preferable that it has the adhesive layer on the side of the substrate opposite to the side having the metal electrodes and wiring. The above-mentioned adhesive layer is pasted on the surface.

作為構成上述金屬電極以及配線之材料,例如可例舉:鈦、矽、鈮、銦、鋅、錫、金、銀、銅、鋁、鈷、鉻、鎳、鉛、鐵、鈀、鉑、鎢、鋯、鉭、鉿等金屬;ITO(銦與錫之氧化物)、氧化鋅、氧化錫等金屬氧化物。進而,亦可例舉含有2種以上之該等金屬、金屬氧化物者、或以該等金屬作為主成分之合金。其中,從導電性方面考慮,較佳為金、銀、銅、ITO,從導電性以及成本方面考慮,更佳為銀、銅、ITO,從透明性方面考慮,進而較佳為ITO。即,上述金屬電極以及配線較佳為銀、銅或ITO配線,尤佳為ITO配線。再者,構成下述毫米波天線元件之材料亦同樣。上述金屬電極以及配線為了防止由金屬之反射導致之視認性之降低,亦可出於隱蔽電極以及/或配線之目的,藉由形成該金屬之氮化物、氧化物、硫化物等皮膜而實施黑化處理。Examples of materials constituting the metal electrodes and wiring include titanium, silicon, niobium, indium, zinc, tin, gold, silver, copper, aluminum, cobalt, chromium, nickel, lead, iron, palladium, platinum, and tungsten. , zirconium, tantalum, hafnium and other metals; ITO (indium and tin oxide), zinc oxide, tin oxide and other metal oxides. Furthermore, those containing two or more of these metals and metal oxides, or alloys containing these metals as main components can also be exemplified. Among them, gold, silver, copper, and ITO are preferable from the viewpoint of conductivity, silver, copper, and ITO are more preferable from the viewpoint of conductivity and cost, and ITO is further preferable from the viewpoint of transparency. That is, the above-mentioned metal electrodes and wiring are preferably silver, copper, or ITO wiring, more preferably ITO wiring. In addition, the same applies to the materials constituting the millimeter-wave antenna element described below. The above-mentioned metal electrodes and wirings can be blackened by forming films such as nitrides, oxides, sulfides, etc. processing.

光學構件係指具有光學特性(例如偏光性、光折射性、光散射性、光反射性、光透過性、光吸收性、光繞射性、旋光性、視認性、電磁波透過性等)之構件。作為構成上述光學構件之基板,例如可例舉:顯示裝置(圖像顯示裝置)、輸入裝置等設備(光學設備)、構成天線模組之基板或用於該等設備之基板,例如可例舉:偏光板、波片、相位差板、光學補償膜、增亮膜、導光板、反射膜、抗反射膜、天線基板、硬塗膜(於PET膜等塑膠膜之至少單面實施了硬塗處理之膜)、透明導電膜(例如表面具有ITO層之塑膠膜(較佳為PET-ITO、聚碳酸酯、環烯烴聚合物等ITO膜)等)、設計膜、裝飾膜、表面保護板、稜鏡、透鏡、彩色濾光片、透明基板(玻璃感測器、玻璃製顯示面板(LCD等)、附有透明電極之玻璃板等玻璃基板等)、或進而積層有該等之基板(有時將該等統稱為「功能性膜」)等。又,該等膜可具有金屬奈米線層或導電性高分子層等。又,於該等膜上可篩網印刷有金屬細線。又,於該等膜上可具有天線元件。再者,上述「板」以及「膜」分別設為包含板狀、膜狀、片狀等形態者,例如,「偏光膜」係設為包含「偏光板」以及「偏光片材」等者。又,「膜」係設為包含膜感測器等者。Optical components refer to components with optical properties (such as polarization, light refraction, light scattering, light reflection, light transmission, light absorption, light diffraction, optical rotation, visibility, electromagnetic wave transmission, etc.) . As the substrate constituting the above-mentioned optical member, for example, devices such as display devices (image display devices) and input devices (optical devices), substrates constituting antenna modules, or substrates used for such devices, for example, : Polarizing plate, wave plate, phase difference plate, optical compensation film, brightness enhancement film, light guide plate, reflective film, anti-reflective film, antenna substrate, hard coating film (hard coating is implemented on at least one side of plastic film such as PET film) treated film), transparent conductive film (such as plastic film with ITO layer on the surface (preferably ITO film such as PET-ITO, polycarbonate, cycloolefin polymer, etc.), etc.), design film, decorative film, surface protection board, Glasses, lenses, color filters, transparent substrates (glass sensors, glass display panels (LCD, etc.), glass substrates with transparent electrodes, etc.), or substrates on which these are laminated (with collectively referred to as "functional film"), etc. In addition, these films may have a metal nanowire layer, a conductive polymer layer, or the like. In addition, thin metal lines may be screen-printed on these films. Also, antenna elements may be provided on the films. In addition, the above-mentioned "plate" and "film" are respectively defined to include forms such as plate, film, sheet, etc., for example, "polarizing film" is defined to include "polarizing plate" and "polarizing sheet". In addition, "film" is assumed to include film sensors and the like.

上述金屬細線為了防止由金屬之反射引起之視認性之降低,出於隱蔽之目的,亦可藉由形成該金屬之氮化物、氧化物、硫化物等皮膜,預先實施黑化處理。The metal thin wires may be blackened in advance by forming a film of nitride, oxide, sulfide, etc. of the metal in order to prevent degradation of visibility due to metal reflection and for the purpose of concealment.

作為上述顯示裝置,例如可例舉:液晶顯示裝置、有機EL(電致發光)顯示裝置、PDP(電漿顯示面板)、電子紙等。又,作為上述輸入裝置,可例舉觸控面板等。又,作為天線模組,可例舉下文揭示之毫米波天線等。As said display device, a liquid crystal display device, an organic EL (electroluminescence) display device, a PDP (plasma display panel), electronic paper, etc. are mentioned, for example. Moreover, a touch panel etc. are mentioned as said input device. Moreover, as an antenna module, the millimeter-wave antenna etc. which are disclosed below can be mentioned, for example.

作為構成上述光學構件之基板,例如可例舉包含玻璃、(甲基)丙烯酸系樹脂、聚碳酸酯、聚對苯二甲酸乙二酯、環烯烴聚合物、金屬薄膜等之基板(例如片狀或膜狀、板狀基板等)等。再者,於本發明中之「光學構件」中,如上所述,亦包含保持顯示裝置或輸入裝置之視認性,且負責裝飾或保護作用之構件(設計膜、裝飾膜或表面保護膜等)。As the substrate constituting the above-mentioned optical member, for example, a substrate (such as a sheet-shaped Or film, plate substrate, etc.) and so on. Furthermore, the "optical member" in the present invention, as mentioned above, also includes a member that maintains the visibility of the display device or input device and is responsible for decoration or protection (design film, decorative film or surface protection film, etc.) .

若本發明之黏著片材為附基材之黏著片材,且上述黏著片材構成具有光學特性之構件,則上述基材可與上述基板同樣看待,且可認為上述黏著片材亦為本發明之光學構件。If the adhesive sheet of the present invention is an adhesive sheet with a substrate, and the above-mentioned adhesive sheet constitutes a member with optical properties, the above-mentioned substrate can be treated in the same way as the above-mentioned substrate, and the above-mentioned adhesive sheet can also be considered to be a part of the present invention. The optical components.

於本發明之黏著片材為附基材之黏著片材,且使用上述功能性膜作為上述基材之情形時,亦可使用本發明之黏著片材作為「黏著型功能性膜」,該「黏著型功能性膜」於功能性膜之至少單面側具有上述黏著劑層。When the adhesive sheet of the present invention is an adhesive sheet with a substrate, and the above-mentioned functional film is used as the above-mentioned substrate, the adhesive sheet of the present invention can also be used as an "adhesive functional film". "Adhesive functional film" has the above-mentioned adhesive layer on at least one side of the functional film.

[毫米波天線] 由於本發明之黏著片材具有毫米波等高頻帶下之介電常數、介電損耗較低之黏著劑層(本發明之黏著劑層),故能夠抑制毫米波之放射損耗。因此,本發明之黏著片材可用於將構件貼合之用途,該構件構成用於毫米波通信之天線(毫米波天線)。 [millimeter wave antenna] Since the adhesive sheet of the present invention has an adhesive layer (adhesive layer of the present invention) with a lower dielectric constant and lower dielectric loss at high frequency bands such as millimeter waves, the radiation loss of millimeter waves can be suppressed. Therefore, the adhesive sheet of the present invention can be used for bonding members constituting an antenna for millimeter wave communication (millimeter wave antenna).

於本說明書中,「毫米波通信」意指於20 GHz~300 GHz之頻帶下之通信。In this specification, "millimeter wave communication" refers to communication in the frequency band of 20 GHz to 300 GHz.

作為構成毫米波天線之構件,可例舉於至少單面具備用以收發毫米波之天線元件(以下,有時稱為「毫米波天線元件」)之基板(以下,有時稱為「毫米波天線基板」)。As a member constituting a millimeter-wave antenna, there may be, for example, a substrate (hereinafter, sometimes referred to as a "millimeter-wave antenna element") for at least one side of an antenna element (hereinafter, sometimes referred to as a "millimeter-wave antenna element") for transmitting and receiving millimeter waves. Antenna Substrate").

作為毫米波天線基板,可例示上述黏著片材之基材中使用之塑膠膜,從能夠抑制毫米波之放射損耗方面考慮,較佳為低介電常數、低介電損耗之素材,尤佳為商品名「Arton」(JSR股份有限公司製造)、商品名「Zeonor」(日本Zeon股份有限公司製造)等環狀烯烴系聚合物。As the millimeter-wave antenna substrate, the plastic film used in the base material of the above-mentioned adhesive sheet can be exemplified. From the viewpoint of suppressing the radiation loss of the millimeter-wave, it is preferably a material with a low dielectric constant and low dielectric loss, especially Cyclic olefin-based polymers such as trade name "Arton" (manufactured by JSR Co., Ltd.) and trade name "Zeonor" (manufactured by Japan Zeon Co., Ltd.).

從抑制毫米波之放射損耗方面考慮,毫米波天線基板於28 GHz及/或60 GHz下之介電常數較佳為2.0~5.0,更佳為2.1~4.5,進而較佳為2.2~4.0,進而更佳為2.2~3.5,尤佳為2.2~3.4,最佳為2.2~3.3、2.2~3.2、2.2~3.1或2.2~3.0。又,從抑制毫米波之放射損耗方面考慮,毫米波天線基板於28 GHz及/或60 GHz下之介電損耗較佳為0.0001~0.05,更佳為0.001~0.029,進而較佳為0.002~0.028,進而更佳為0.003~0.027,尤佳為0.004~0.026,最佳為0.005~0.025、0.006~0.024、0.007~0.023、0.008~0.022、0.009~0.021、0.010~0.020、0.011~0.019、0.012~0.018、0.013~0.017、0.014~0.016或0.014~0.015。From the aspect of suppressing the radiation loss of the millimeter wave, the dielectric constant of the millimeter wave antenna substrate at 28 GHz and/or 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, further preferably 2.2 to 4.0, and further More preferably 2.2-3.5, especially preferably 2.2-3.4, most preferably 2.2-3.3, 2.2-3.2, 2.2-3.1 or 2.2-3.0. Also, from the aspect of suppressing the radiation loss of the millimeter wave, the dielectric loss of the millimeter wave antenna substrate at 28 GHz and/or 60 GHz is preferably 0.0001-0.05, more preferably 0.001-0.029, and more preferably 0.002-0.028 , and more preferably 0.003-0.027, especially 0.004-0.026, most preferably 0.005-0.025, 0.006-0.024, 0.007-0.023, 0.008-0.022, 0.009-0.021, 0.010-0.020, 0.011-0.019, 0.0 12~0.018 , 0.013~0.017, 0.014~0.016 or 0.014~0.015.

毫米波天線基板較佳為透明。毫米波天線基板於可見光波長區域中之全光線透過率(依據JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而更佳為90%以上,尤佳為91%以上,最佳為92%以上。又,毫米波天線基板之霧度(依據JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而更佳為0.9%以下,尤佳為0.8%以下。The millimeter wave antenna substrate is preferably transparent. The total light transmittance (according to JIS K7361-1) of the millimeter-wave antenna substrate in the visible light wavelength region is not particularly limited, but is preferably 85% or more, more preferably 88% or more, further preferably 89% or more, and even more preferably The best is more than 90%, the best is more than 91%, and the best is more than 92%. Also, the haze of the millimeter-wave antenna substrate (based on JIS K7136) is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, further preferably 1.0% or less, still more preferably 0.9% or less, especially Preferably less than 0.8%.

從安裝毫米波天線元件,並且抑制毫米波之放射損耗方面考慮,毫米波天線基板之厚度較佳為5~250 μm。再者,毫米波天線基板可具有單層以及複層中之任一種形態。又,亦可對毫米波天線基板之表面適當實施例如電暈放電處理、電漿處理等物理處理;底塗處理等化學處理;硬塗等塗層等之公知慣用之表面處理。Considering the installation of the millimeter-wave antenna element and the suppression of the radiation loss of the millimeter-wave, the thickness of the millimeter-wave antenna substrate is preferably 5-250 μm. Furthermore, the millimeter-wave antenna substrate may have any form of a single layer or a multi-layer. In addition, the surface of the millimeter-wave antenna substrate may be appropriately subjected to known and conventional surface treatments such as physical treatment such as corona discharge treatment and plasma treatment; chemical treatment such as primer treatment; and coating such as hard coating.

作為毫米波天線基板所具備之毫米波天線元件,只要能夠收發毫米波,則並無特別限定,從利用智慧型手機等攜帶型通信設備有效率地接收毫米波方面考慮,可較佳地使用相陣列天線。相陣列天線為藉由將複數個天線元件排列為陣列狀,控制各天線元件之相位,而能夠沿所需方向進行收發的天線。即,相陣列天線無論天線之方向如何,均能夠藉由以電子方式控制各天線元件之相位(光束轉向),而沿所需方向發送電波或接收電波。The millimeter-wave antenna element included in the millimeter-wave antenna substrate is not particularly limited as long as it can transmit and receive millimeter waves. From the viewpoint of efficiently receiving millimeter waves with portable communication devices such as smartphones, it is preferable to use related array antenna. The phase array antenna is an antenna capable of transmitting and receiving in a desired direction by arranging a plurality of antenna elements in an array and controlling the phase of each antenna element. That is, the phase array antenna is capable of transmitting or receiving radio waves in a desired direction by electronically controlling the phase (beam steering) of each antenna element regardless of the direction of the antenna.

作為毫米波天線元件,可並無特別限定地使用公知之天線,例如可例舉具有共振元件之天線元件,該共振元件係由環形天線構造體、貼片天線構造體、堆疊型貼片天線構造體、具有寄生元件之貼片天線構造體、倒F天線構造體、槽孔天線構造體、平面倒F天線構造體、單極、偶極、螺旋天線構造體、八木(八木/宇田)天線構造體、表面積體波導構造體、該等設計之混合等形成。對於不同頻帶之組合,可使用不同種類之毫米波天線元件。從利用智慧型手機等攜帶型通信設備有效率地接收毫米波方面考慮,較佳為將貼片天線元件排列為陣列狀之相陣列天線。Known antennas can be used without particular limitation as the millimeter wave antenna element, for example, an antenna element having a resonant element constructed from a loop antenna structure, a patch antenna structure, or a stacked patch antenna Body, patch antenna structure with parasitic elements, inverted F antenna structure, slot antenna structure, planar inverted F antenna structure, monopole, dipole, helical antenna structure, Yagi (Yagi/Uda) antenna structure Bulk, surface-area bulk waveguide structures, mixtures of these designs, etc. For combinations of different frequency bands, different kinds of mmWave antenna elements can be used. From the viewpoint of efficiently receiving millimeter waves with portable communication devices such as smartphones, a phase array antenna in which patch antenna elements are arranged in an array is preferable.

構成毫米波天線元件之素材亦並無特別限定,例如可例舉:鈦、矽、鈮、銦、鋅、錫、金、銀、銅、鋁、鈷、鉻、鎳、鉛、鐵、鈀、鉑、鎢、鋯、鉭、鉿等金屬;ITO(銦與錫之氧化物)、氧化鋅、氧化錫等金屬氧化物。進而亦可例舉含有2種以上之該等金屬或金屬氧化物者、或將該等金屬作為主成分之合金。其中,從導電性之觀點考慮,較佳為銀、銅、ITO,從透明性、視認性方面考慮,更佳為ITO。即,上述毫米波天線元件尤佳為包含ITO。The material constituting the millimeter wave antenna element is not particularly limited, for example, titanium, silicon, niobium, indium, zinc, tin, gold, silver, copper, aluminum, cobalt, chromium, nickel, lead, iron, palladium, Platinum, tungsten, zirconium, tantalum, hafnium and other metals; ITO (indium and tin oxide), zinc oxide, tin oxide and other metal oxides. Furthermore, one containing two or more of these metals or metal oxides, or an alloy containing these metals as a main component may also be exemplified. Among them, silver, copper, and ITO are preferable from the viewpoint of conductivity, and ITO is more preferable from the viewpoint of transparency and visibility. That is, the millimeter-wave antenna element described above preferably contains ITO.

又,於天線元件包含銀、銅等金屬之情形時,出於隱蔽天線元件以防止由金屬之反射引起之視認性之降低之目的,亦可藉由形成該金屬之氮化物、氧化物、硫化物等皮膜,預先實施黑化處理。In addition, when the antenna element contains metals such as silver and copper, for the purpose of hiding the antenna element and preventing the degradation of visibility caused by the reflection of the metal, it can also be formed by forming the nitride, oxide, or sulfide of the metal. The film of objects and the like shall be blackened in advance.

又,毫米波天線基板亦可具備傳輸線路徑,該傳輸線路徑用於將毫米波天線元件所收發之信號傳送至收發機電路。傳輸線路徑可包含同軸電纜路徑、微帶傳輸線、帶狀線傳輸線、邊緣耦合微帶傳輸線、邊緣耦合帶狀線傳輸線、用以利用毫米波頻帶傳遞信號之波導構造體(例如共面波導或經接地之共面波導)、由該等種類之傳輸線之組合形成之傳輸線等。構成傳輸線路徑之素材亦並無特別限定,可使用構成毫米波天線元件之素材。In addition, the millimeter-wave antenna substrate may also have a transmission line path for transmitting signals received and received by the millimeter-wave antenna element to the transceiver circuit. Transmission line paths may include coaxial cable paths, microstrip transmission lines, stripline transmission lines, edge-coupled microstrip transmission lines, edge-coupled stripline transmission lines, waveguide structures (such as coplanar waveguides or grounded coplanar waveguide), a transmission line formed by a combination of these types of transmission lines, etc. The material constituting the transmission line path is also not particularly limited, and the material constituting the millimeter wave antenna element can be used.

作為構成毫米波天線之構件,可例舉罩蓋構件,其為了保護排列於毫米波天線基板上之毫米波天線元件而積層於毫米波天線基板上。作為罩蓋構件,例如可使用玻璃或塑膠膜等光學膜。As a member constituting the millimeter wave antenna, there may be mentioned a cover member which is laminated on the millimeter wave antenna substrate in order to protect the millimeter wave antenna elements arranged on the millimeter wave antenna substrate. As a cover member, optical films, such as glass or a plastic film, can be used, for example.

作為塑膠膜等素材,例如可例舉:聚對苯二甲酸乙二酯(PET)等聚酯系樹脂;聚甲基丙烯酸甲酯(PMMA)等(甲基)丙烯酸系樹脂;聚碳酸酯;三乙醯纖維素(TAC);聚碸;聚芳酯;聚醯亞胺;透明聚醯亞胺;聚氯乙烯;聚乙酸乙烯酯;氟系樹脂;聚乙烯、聚丙烯、乙烯-丙烯共聚物等聚烯烴系樹脂;商品名「Arton」(JSR股份有限公司製造)、商品名「Zeonor」(日本Zeon股份有限公司製造)等環狀烯烴系聚合物等塑膠材料。該等塑膠材料可單獨使用或組合兩種以上使用。Examples of materials such as plastic films include: polyester resins such as polyethylene terephthalate (PET); (meth)acrylic resins such as polymethyl methacrylate (PMMA); polycarbonate; Triacetyl cellulose (TAC); Polyethylene; Polyarylate; Polyimide; Transparent polyimide; Polyvinyl chloride; Polyvinyl acetate; Fluorine resin; Polyethylene, polypropylene, ethylene-propylene copolymer Plastic materials such as polyolefin-based resins such as polyolefin resins; trade names "Arton" (manufactured by JSR Co., Ltd.) and "Zeonor" (manufactured by Japan Zeon Co., Ltd.) and other cyclic olefin-based polymers. These plastic materials can be used alone or in combination of two or more.

從抑制毫米波之放射損耗方面考慮,罩蓋構件於28 GHz及/或60 GHz下之介電常數較佳為2.0~5.0,更佳為2.1~4.5,進而較佳為2.2~4.0,進而更佳為2.2~3.5,尤佳為2.2~3.4,最佳為2.2~3.3、2.2~3.2、2.2~3.1或2.2~3.0。又,從抑制毫米波之放射損耗方面考慮,罩蓋構件於28 GHz及/或60 GHz下之介電損耗較佳為0.0001~0.050,更佳為0.001~0.02,進而較佳為0.002~0.019,進而更佳為0.003~0.018,尤佳為0.004~0.017,最佳為0.005~0.016、0.006~0.015、0.007~0.014、0.008~0.013、0.009~0.012或0.010~0.011。Considering the suppression of radiation loss of millimeter waves, the dielectric constant of the cover member at 28 GHz and/or 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, more preferably 2.2 to 4.0, and even more preferably Preferably it is 2.2-3.5, especially preferably 2.2-3.4, most preferably 2.2-3.3, 2.2-3.2, 2.2-3.1 or 2.2-3.0. Also, from the aspect of suppressing the radiation loss of millimeter waves, the dielectric loss of the cover member at 28 GHz and/or 60 GHz is preferably 0.0001-0.050, more preferably 0.001-0.02, and still more preferably 0.002-0.019, Furthermore, it is more preferably 0.003 to 0.018, especially preferably 0.004 to 0.017, most preferably 0.005 to 0.016, 0.006 to 0.015, 0.007 to 0.014, 0.008 to 0.013, 0.009 to 0.012, or 0.010 to 0.011.

上述罩蓋構件較佳為透明。罩蓋構件於可見光波長區域中之全光線透過率(依據JIS K7361-1)較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而更佳為90%以上,尤佳為91%以上,最佳為92%以上。又,罩蓋構件之霧度(依據JIS K7136)較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而更佳為0.9%以下,尤佳為0.8%以下。The above-mentioned cover member is preferably transparent. The total light transmittance (according to JIS K7361-1) of the cover member in the visible light wavelength region is preferably 85% or more, more preferably 88% or more, further preferably 89% or more, and still more preferably 90% or more, The best is above 91%, and the best is above 92%. Also, the haze of the cover member (in accordance with JIS K7136) is preferably 1.2% or less, more preferably 1.1% or less, further preferably 1.0% or less, still more preferably 0.9% or less, especially preferably 0.8% or less.

從抑制毫米波之放射損耗方面考慮,罩蓋構件之厚度較佳為0.025~1.5 mm。再者,罩蓋構件可具有單層以及複層中之任一種形態。又,亦可對罩蓋構件之表面適當實施例如電暈放電處理、電漿處理等物理處理;底塗處理等化學處理;硬塗等塗層等之公知慣用之表面處理。In view of suppressing the radiation loss of millimeter waves, the thickness of the cover member is preferably 0.025-1.5 mm. Furthermore, the cover member may have either a single layer or a multilayer form. In addition, the surface of the cover member may be suitably subjected to known and commonly used surface treatments such as physical treatment such as corona discharge treatment and plasma treatment; chemical treatment such as primer treatment; and coating such as hard coating.

本發明之黏著片材可較佳地用於攜帶型通信設備中使用之毫米波天線之製造用途。作為上述攜帶型通信設備,例如可例舉:行動電話、PHS、智慧型手機、平板(平板型電腦)、行動電腦(行動PC)、攜帶型資訊終端(PDA)等。The adhesive sheet of the present invention can be preferably used in the manufacture of millimeter-wave antennas used in portable communication devices. As said portable communication device, a mobile phone, PHS, a smart phone, a tablet (tablet computer), a mobile computer (mobile PC), a portable information terminal (PDA), etc. are mentioned, for example.

毫米波天線可具有上述毫米波天線基板、罩蓋構件、黏著片材以外之構件,例如可具有偏光板、波片、相位差板、光學補償膜、增亮膜、導光板、反射膜、抗反射膜、硬塗膜、透明導電膜、設計膜、裝飾膜、表面保護板、稜鏡、透鏡、彩色濾光片、透明基板、或圖像顯示面板(例如液晶顯示面板、有機EL面板、電漿顯示面板等)等。圖像顯示面板可為具有觸控感測器者。The millimeter-wave antenna may have members other than the above-mentioned millimeter-wave antenna substrate, cover member, and adhesive sheet, such as a polarizer, a wave plate, a phase difference plate, an optical compensation film, a brightness enhancement film, a light guide plate, a reflection film, an anti- Reflective film, hard coat film, transparent conductive film, design film, decorative film, surface protection plate, stencil, lens, color filter, transparent substrate, or image display panel (such as liquid crystal display panel, organic EL panel, electric pulp display panel, etc.), etc. The image display panel may have a touch sensor.

毫米波天線可配置於攜帶型通信設備之任何位置,具體而言,可配置於攜帶型通信設備之正面、背面、側面。再者,攜帶型通信設備之正面係於使用者使用攜帶型通信設備時,與使用者對向之面,例如,具有顯示面板之面相當於正面,殼體相當於背面、側面。再者,顯示面板係指至少包含透鏡(尤其是玻璃透鏡)以及觸控面板之構成物。The millimeter wave antenna can be arranged at any position of the portable communication device, specifically, it can be arranged at the front, back and side of the portable communication device. Moreover, the front of the portable communication device refers to the surface facing the user when the user uses the portable communication device. For example, the surface with the display panel corresponds to the front, and the housing corresponds to the back and side. Furthermore, a display panel refers to a composition including at least a lens (especially a glass lens) and a touch panel.

毫米波天線之大小(面積)亦無限定,可形成於攜帶型通信設備之各面之整個面,亦可配置於一部分。又,毫米波天線之形狀亦並無特別限定,例如亦可為方形、圓形、配線狀。又,亦能夠以邊框狀配置。進而,配置於攜帶型通信設備之毫米波天線數亦無限定,可為一個,亦可於任意位置配置有複數個。於配置複數個毫米波天線之情形時,大小(面積)可相同亦可不同。於攜帶型通信設備之未配置毫米波天線之部位,為了提高視認性,亦可配置不具備毫米波天線之虛設圖案。The size (area) of the millimeter wave antenna is also not limited, and it may be formed on the entire surface of each surface of the portable communication device, or arranged on a part thereof. Also, the shape of the millimeter wave antenna is not particularly limited, and may be, for example, square, circular, or wire-shaped. Moreover, it is also possible to arrange|position in frame shape. Furthermore, the number of millimeter-wave antennas arranged in the portable communication device is not limited, and may be one, or a plurality of antennas may be arranged at any position. When a plurality of millimeter-wave antennas are arranged, the sizes (areas) may be the same or different. In order to improve the visibility, a dummy pattern without a millimeter wave antenna can also be arranged on the part of the portable communication device that does not have a millimeter wave antenna.

本發明之毫米波天線係至少具有上述黏著片材以及基板者,只要上述基板於單面具備天線元件(毫米波天線元件),且於上述基板(毫米波天線基板)之具有上述天線元件之側之面上貼合有上述黏著片材即可,於其他方面並無特別限定。再者,由於本發明之毫米波天線中之上述黏著片材為使用時之黏著片材,故不具有間隔件。The millimeter-wave antenna of the present invention has at least the above-mentioned adhesive sheet and a substrate, as long as the above-mentioned substrate is provided with an antenna element (millimeter-wave antenna element) on one side, and on the side of the above-mentioned substrate (millimeter-wave antenna substrate) that has the above-mentioned antenna element It only needs to stick the above-mentioned adhesive sheet on the surface, and there is no special limitation on other aspects. Furthermore, since the above-mentioned adhesive sheet in the millimeter wave antenna of the present invention is an adhesive sheet for use, there is no spacer.

作為上述毫米波天線,較佳為將毫米波天線基板與其他光學構件(可具有上述黏著片材,亦可不具有,但從進而抑制毫米波之放射損耗方面考慮,較佳為具有)貼合而構成之態樣。又,上述其他光學構件可為單數,亦可為複數。As the above-mentioned millimeter-wave antenna, it is preferable to bond the millimeter-wave antenna substrate to other optical members (the above-mentioned adhesive sheet may or may not be provided, but it is preferable to have it in view of further suppressing the radiation loss of the millimeter-wave). form of composition. In addition, the above-mentioned other optical members may be singular or plural.

作為上述態樣之情形時之本發明之毫米波天線與上述其他光學構件之貼合態樣,例如可例舉:(1)經由本發明之黏著片材將本發明之毫米波天線基板與上述其他光學構件貼合之態樣、(2)將包含或構成毫米波天線基板之本發明之黏著片材貼合於上述其他光學構件之態樣、(3)經由本發明之黏著帶將毫米波天線基板貼合於毫米波天線基板以外之構件之態樣、(4)將包含或構成毫米波天線基板之本發明之黏著帶貼合於毫米波天線基板以外的構件之態樣等。再者,於上述(2)之態樣中,本發明之黏著片材較佳為基材為毫米波天線基板之雙面黏著片材。In the case of the above-mentioned aspect, the bonding aspect of the millimeter-wave antenna of the present invention and the above-mentioned other optical members can be exemplified, for example: (1) The millimeter-wave antenna substrate of the present invention is bonded to the above-mentioned optical member through the adhesive sheet of the present invention. Aspects of attaching other optical components, (2) Aspects of adhering the adhesive sheet of the present invention including or constituting a millimeter-wave antenna substrate to the above-mentioned other optical components, (3) attaching the millimeter-wave antenna substrate through the adhesive tape of the present invention An aspect of attaching the antenna substrate to members other than the millimeter wave antenna substrate, (4) an aspect of attaching the adhesive tape of the present invention including or constituting the millimeter wave antenna substrate to members other than the millimeter wave antenna substrate. Furthermore, in the aspect of (2) above, the adhesive sheet of the present invention is preferably a double-sided adhesive sheet whose base material is a millimeter-wave antenna substrate.

其次,參照圖式而對本發明之毫米波天線之較佳實施方式進行說明。Next, preferred embodiments of the millimeter-wave antenna of the present invention will be described with reference to the drawings.

圖1中記載有如下毫米波天線1A,其係至少具有黏著片材10、以及作為毫米波天線基板11之基板之毫米波天線,且毫米波天線基板11於單面具備毫米波天線元件2,黏著片材10係貼合於毫米波天線基板11之具有毫米波天線元件2之側之面上。FIG. 1 shows a millimeter-wave antenna 1A having at least an adhesive sheet 10 and a millimeter-wave antenna substrate 11 as a substrate. The millimeter-wave antenna substrate 11 has a millimeter-wave antenna element 2 on one side. The adhesive sheet 10 is pasted on the surface of the millimeter-wave antenna substrate 11 on the side with the millimeter-wave antenna element 2 .

圖2中記載有如下毫米波天線1B,其依序於相互接觸之狀態下具有罩蓋構件12、黏著片材10以及毫米波天線基板11。毫米波天線基板11於黏著片材10側之面具備毫米波天線元件2,黏著片材10係貼合於毫米波天線基板11之具有毫米波天線元件2之側之面上。罩蓋構件12較佳為玻璃,從低介電常數、低介電損耗方面考慮,毫米波天線基板11較佳為COP,毫米波天線元件2較佳為銅、銀、或ITO。FIG. 2 shows a millimeter-wave antenna 1B having a cover member 12 , an adhesive sheet 10 , and a millimeter-wave antenna substrate 11 sequentially in contact with each other. The millimeter-wave antenna substrate 11 is provided with the millimeter-wave antenna element 2 on the side of the adhesive sheet 10 , and the adhesive sheet 10 is attached to the surface of the millimeter-wave antenna substrate 11 on the side having the millimeter-wave antenna element 2 . The cover member 12 is preferably glass. In view of low dielectric constant and low dielectric loss, the millimeter-wave antenna substrate 11 is preferably COP, and the millimeter-wave antenna element 2 is preferably copper, silver, or ITO.

圖3中記載有如下毫米波天線1C,其於依序相互接觸之狀態下具有罩蓋構件12、黏著片材10a、毫米波天線基板11、黏著片材10b以及圖像顯示面板13。毫米波天線基板11於黏著片材10a側之面具備毫米波天線元件2,黏著片材10a係貼合於毫米波天線基板11之具有毫米波天線元件2之側之面上。罩蓋構件12較佳為玻璃,從低介電常數、低介電損耗方面考慮,毫米波天線基板11較佳為COP,從透明性、視認性方面考慮,毫米波天線元件2較佳為ITO、或利用氮化物、氧化物、硫化物等皮膜進行了黑化處理之銀或銅。黏著片材10b可為本發明之黏著片材,亦可不為本發明之黏著片材,但較佳為本發明之黏著片材。圖像顯示面板13可具有觸控感測器(圖示略)。FIG. 3 shows a millimeter-wave antenna 1C having a cover member 12 , an adhesive sheet 10 a , a millimeter-wave antenna substrate 11 , an adhesive sheet 10 b , and an image display panel 13 in sequential contact with each other. The millimeter-wave antenna substrate 11 is provided with the millimeter-wave antenna element 2 on the side of the adhesive sheet 10 a , and the adhesive sheet 10 a is bonded to the surface of the millimeter-wave antenna substrate 11 on the side having the millimeter-wave antenna element 2 . The cover member 12 is preferably made of glass. In terms of low dielectric constant and low dielectric loss, the millimeter-wave antenna substrate 11 is preferably COP. In terms of transparency and visibility, the millimeter-wave antenna element 2 is preferably ITO. , or silver or copper that has been blackened with a film such as nitride, oxide, or sulfide. The adhesive sheet 10b may or may not be the adhesive sheet of the present invention, but is preferably the adhesive sheet of the present invention. The image display panel 13 may have a touch sensor (not shown).

於圖1~3之毫米波天線1A~1C中,由於黏著片材10、10a以及較佳之黏著片材10b包含高頻帶下之介電常數、介電損耗較低之本發明之黏著劑層,故毫米波之放射損耗得以抑制,能夠有效率地進行毫米波通信。又,由於能夠有效率地進行毫米波通信,故可使天線面積小型化,而可使天線微細化。 [實施例] In the millimeter-wave antennas 1A-1C of FIGS. 1-3, since the adhesive sheets 10, 10a and the preferred adhesive sheet 10b include the adhesive layer of the present invention with low dielectric constant and low dielectric loss in the high-frequency band, Therefore, the radiation loss of the millimeter wave can be suppressed, and the millimeter wave communication can be carried out efficiently. In addition, since millimeter wave communication can be efficiently performed, the area of the antenna can be reduced and the antenna can be miniaturized. [Example]

以下,基於實施例更詳細地說明本發明,但本發明並不受該等實施例之任何限定。Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited by these examples.

(實施例1) 於具備冷凝管、氮氣導入管、溫度計以及攪拌裝置之反應容器中,以單體成分成為70質量%之方式投入甲基丙烯酸C 12-13烷基酯(共榮社化學股份有限公司製造,商品名「L-7MA」)99.0質量份、甲基丙烯酸羥基乙酯(HEMA)1.0質量份之混合物、作為熱聚合起始劑之2,2'-偶氮二異丁腈(AIBN)0.2質量份、作為聚合溶劑之乙酸乙酯,流入氮氣,一面攪拌一面進行約1小時之氮氣置換。其後,將反應容器加熱至70℃,並進行6小時反應。進而,將反應容器加熱至80℃,進行3小時反應而獲得重量平均分子量(Mw)40萬之(甲基)丙烯酸系聚合物。於該(甲基)丙烯酸系聚合物之溶液(固形物成分100質量份)中,以固形物成分基準計添加異氰酸酯系交聯劑(商品名「Coronate HX」,東曹股份有限公司製造,固形物成分濃度100%)0.1質量份、作為交聯促進劑之二月桂酸二辛基錫(商品名「EMBILIZEROL-1」,東京精細化學股份有限公司製造)0.01質量份、作為交聯延遲劑之乙醯丙酮5質量份,均勻地混合,而製備本例之黏著劑組合物。 (Example 1) In a reaction vessel equipped with a condenser tube, a nitrogen gas introduction tube, a thermometer, and a stirring device, C12-13 alkyl methacrylate (Kyoeisha Chemical Co., Ltd. Co., Ltd., product name "L-7MA") 99.0 parts by mass, 1.0 parts by mass of hydroxyethyl methacrylate (HEMA), 2,2'-azobisisobutyronitrile ( AIBN) 0.2 parts by mass, ethyl acetate as a polymerization solvent, nitrogen gas was flowed in, and nitrogen substitution was performed for about 1 hour while stirring. Thereafter, the reaction vessel was heated to 70° C., and reacted for 6 hours. Furthermore, the reaction container was heated at 80 degreeC, it reacted for 3 hours, and the (meth)acrylic-type polymer with a weight average molecular weight (Mw) of 400,000 was obtained. In this (meth)acrylic polymer solution (100 parts by mass of solid content), an isocyanate-based crosslinking agent (trade name "Coronate HX", manufactured by Tosoh Co., Ltd., solid content) was added on the basis of solid content. 0.1 part by mass of dioctyltin dilaurate (trade name "EMBILIZEROL-1", manufactured by Tokyo Fine Chemicals Co., Ltd.) as a crosslinking accelerator, 0.01 part by mass as a crosslinking retarder 5 parts by mass of acetylacetone were uniformly mixed to prepare the adhesive composition of this example.

以最終厚度(黏著劑層之厚度)成為25 μm之方式,將上述黏著劑組合物塗佈於聚對苯二甲酸乙二酯(PET)間隔件(商品名「MRF38」,三菱化學股份有限公司製造)上,形成塗佈層(黏著劑組合物層)。繼而,利用130℃之乾燥機進行120分鐘乾燥處理,使殘留單體揮發。進而,於上述塗佈層上,設置PET間隔件(商品名「MRE38」,三菱化學股份有限公司製造),獲得無基材雙面黏著片材,該無基材雙面黏著片材僅包含黏著劑層,且黏著劑層之雙面由間隔件保護。The above-mentioned adhesive composition was applied to a polyethylene terephthalate (PET) spacer (trade name "MRF38", Mitsubishi Chemical Corporation Manufacturing), a coating layer (adhesive composition layer) is formed. Then, drying treatment was carried out for 120 minutes using a dryer at 130° C. to volatilize the residual monomers. Furthermore, a PET spacer (trade name "MRE38", manufactured by Mitsubishi Chemical Co., Ltd.) was placed on the above-mentioned coating layer to obtain a double-sided adhesive sheet without a substrate. The double-sided adhesive sheet without a substrate only includes an adhesive The adhesive layer, and both sides of the adhesive layer are protected by spacers.

(實施例2~38) 除了以成為表1、2所示之調配量之方式調配各單體成分以外,以與實施例1同樣之方式獲得無基材雙面黏著片材。 (Examples 2-38) A substrate-less double-sided adhesive sheet was obtained in the same manner as in Example 1, except that each monomer component was prepared in the amount shown in Tables 1 and 2.

(比較例1) 於具備冷凝管、氮氣導入管、溫度計以及攪拌裝置之反應容器中,以成為表2所示之調配量之方式混合丙烯酸2-乙基己酯(2EHA)、丙烯酸異癸酯(IDA)、丙烯酸(MA)、丙烯酸4-羥基丁酯(4HBA)、作為熱聚合起始劑之2,2'-偶氮二異丁腈(AIBN),以單體成分成為40%之方式投入作為聚合溶劑之乙酸乙酯,流入氮氣,一面攪拌一面進行約1小時之氮氣置換。其後,將反應容器加熱至60℃,並進行6小時反應。進而,將反應容器加熱至75℃,進行2小時反應而獲得丙烯酸系聚合物。除此以外,以與實施例1同樣之方式獲得無基材雙面黏著片材。 (comparative example 1) Mix 2-ethylhexyl acrylate (2EHA), isodecyl acrylate (IDA), acrylic acid (MA), 4-hydroxybutyl acrylate (4HBA), and 2,2'-azobisisobutyronitrile (AIBN) as a thermal polymerization initiator are put into the polymerization solvent so that the monomer component becomes 40%. Ethyl acetate was flowed into nitrogen, and nitrogen replacement was performed for about 1 hour while stirring. Thereafter, the reaction vessel was heated to 60° C., and reacted for 6 hours. Furthermore, the reaction container was heated to 75 degreeC, it reacted for 2 hours, and the acryl-type polymer was obtained. Except for this, the substrate-less double-sided adhesive sheet was obtained in the same manner as in Example 1.

再者,表1、2所示之使用單體如下所述。 ・LMA:甲基丙烯酸月桂酯 ・LA:丙烯酸月桂酯 ・2-EHA:丙烯酸2-乙基己酯 ・i-NA:丙烯酸異壬酯 ・L-7MA:甲基丙烯酸C 12-13烷基酯 ・IDMA:甲基丙烯酸異癸酯 ・HEMA:甲基丙烯酸2-羥基乙酯 ・MMA:甲基丙烯酸甲酯 ・MMA-巨單體:甲基丙烯酸甲酯 ・CHMA:甲基丙烯酸環己酯 ・IBXMA:甲基丙烯酸異𦯉酯 ・MAA:甲基丙烯酸 ・NVP:N-乙烯基吡咯啶酮 ・PHE-1G:甲基丙烯酸2-苯氧基乙酯 ・BzMA:甲基丙烯酸苄酯 ・M-20G:甲基丙烯酸2-(2-甲氧基乙氧基)乙酯 ・IDA:丙烯酸異癸酯 ・MA:丙烯酸甲酯 ・4-HBA:丙烯酸4-羥基丁酯 In addition, the monomers used shown in Tables 1 and 2 are as follows.・LMA: Lauryl methacrylate ・LA: Lauryl acrylate ・2-EHA: 2-Ethylhexyl acrylate ・i-NA: Isononyl acrylate ・L-7MA: C 12-13 alkyl methacrylate・IDMA: Isodecyl methacrylate ・HEMA: 2-Hydroxyethyl methacrylate ・MMA: Methyl methacrylate ・MMA-macromonomer: Methyl methacrylate ・CHMA: Cyclohexyl methacrylate・IBXMA: Isomethacrylate ・MAA: Methacrylic acid ・NVP: N-vinylpyrrolidone ・PHE-1G: 2-phenoxyethyl methacrylate ・BzMA: Benzyl methacrylate ・M- 20G: 2-(2-methoxyethoxy)ethyl methacrylate・IDA: Isodecyl acrylate・MA: Methyl acrylate・4-HBA: 4-Hydroxybutyl acrylate

[特性評價] 對實施例以及比較例之無基材雙面黏著片材,進行下述測定或評價。評價結果係示於表1、2。 [Characteristic evaluation] The following measurements and evaluations were performed on the substrate-less double-sided adhesive sheets of Examples and Comparative Examples. The evaluation results are shown in Tables 1 and 2.

(1)介電常數、介電損耗之評價 對實施例或比較例中獲得之黏著劑層單體(自雙面黏著片材將實施了聚矽氧處理之PET間隔件剝離者),利用以下之裝置,測定於頻率28 GHz以及60 GHz下之介電常數以及介電損耗。關於測定,於28 GHz之情形時係對直徑8 cm之圓之區域實施,於60 GHz之情形時係對直徑4 cm之圓之區域實施。各檢體製作至少3樣品,將其等3樣品之測定值之最大最小之值去除後,將平均值設為各頻率下之介電常數、介電損耗。 ・測定方法:開放型共振器法 JIS R1660-2 ・裝置:KEYCOM股份有限公司製造,干涉型共振器法介電常數測定系統 ・測定環境:23±1℃、52%±1%R.H. (1) Evaluation of dielectric constant and dielectric loss For the adhesive layer monomer obtained in the examples or comparative examples (those obtained by peeling the silicone-treated PET spacer from the double-sided adhesive sheet), the following equipment was used to measure at frequencies of 28 GHz and 60 GHz The dielectric constant and dielectric loss. About the measurement, in the case of 28 GHz, it was carried out on the area of the circle with a diameter of 8 cm, and in the case of 60 GHz, it was carried out on the area of the circle with the diameter of 4 cm. Make at least 3 samples for each sample, remove the maximum and minimum values of the measured values of the 3 samples, and set the average value as the dielectric constant and dielectric loss at each frequency. ・Measurement method: Open type resonator method JIS R1660-2 ・Device: Made by KEYCOM Co., Ltd., dielectric constant measurement system by interference type resonator method ・Measurement environment: 23±1℃, 52%±1%R.H.

(2)全光線透過率以及霧度 自雙面黏著片材將一間隔件剝離,將該雙面黏著片材貼合於載玻片(松浪玻璃工業股份有限公司製造,「白研磨 No.1」,厚度0.8~1.0 mm,全光線透過率92%,霧度0.2%),進而將另一間隔件剝離,而製作具有雙面黏著片材(黏著劑層)/載玻片之層構成之試片。使用霧度計(製品名「HM-150」,村上色彩研究所股份有限公司製造),於23±1℃、52±1%RH之環境下測定上述試片於可見光區域中之全光線透過率以及霧度。各檢體製作3樣品,將其等3樣品之測定值之平均設為於可見光區域中之全光線透過率以及霧度。再者,試片之厚度越大,全光透過率之值越減小,霧度之值越增大。 (2) Total light transmittance and haze Peel off one spacer from the double-sided adhesive sheet, and attach the double-sided adhesive sheet to a glass slide (manufactured by Songnang Glass Industry Co., Ltd., "White Polishing No. 1", thickness 0.8-1.0 mm, full light The transmittance is 92%, the haze is 0.2%), and then the other spacer is peeled off to make a test piece with a double-sided adhesive sheet (adhesive layer)/glass slide layer. Using a haze meter (product name "HM-150", manufactured by Murakami Color Research Institute Co., Ltd.), measure the total light transmittance of the above test piece in the visible light region in an environment of 23±1°C and 52±1%RH and haze. Three samples were prepared for each specimen, and the average of the measured values of the three samples was defined as the total light transmittance and haze in the visible light region. Furthermore, the greater the thickness of the test piece, the lower the value of the total light transmittance, and the greater the value of the haze.

(3)收發特性 實施例或比較例中獲得之黏著劑層(自雙面黏著片材將實施了聚矽氧處理之PET間隔件剝離者)之收發特性係利用圖4所示之方形微帶天線(參照電子通信資訊學會4組2卷5章「平面天線」,URL:http://www.ieice hbkb.org/files/04/04Gun_02hen_05.pdf)進行評價。具體而言,製作天線膜46,其於作為天線基板44之厚度100 μm之COP基材(商品名「Zeonor」,日本Zeon股份有限公司製造)表面形成有圖4所示之形狀之毫米波用貼片天線43,且於背面形成有1 μm厚之銅接地層45。毫米波用貼片天線43之尺寸係於和各實施例、比較例之黏著劑積層時成為最佳之方式進行調整(縱向A:2.8~3.2 mm,橫向B:4.13 mm)。於上述天線膜46之貼片天線43側,貼附各實施例、比較例之黏著劑層42以使氣泡或異物不會進入,繼而貼合於作為覆蓋玻璃41之厚度0.7 mm之化學強化玻璃(康寧公司製造),而製作覆蓋玻璃41/黏著劑層42/天線膜46之天線積層體4。自各種天線積層體4之與毫米波用貼片天線43連接之微帶線路43a供電,評價於30 GHz之頻帶下之收發特性,將與不使用黏著劑層時(於覆蓋玻璃41接近配置有天線膜46者)之增益(5.7 dB)相比提高者評價為○,將降低(惡化)者評價為×。 (3) Sending and receiving characteristics The transmitting and receiving characteristics of the adhesive layer obtained in the examples or comparative examples (from the double-sided adhesive sheet to which the silicone-treated PET spacer was peeled off) were obtained using the square microstrip antenna shown in FIG. 4 (refer to Electronic Communications "Planar Antenna", Chapter 5, Volume 2, Group 4, Information Society, URL: http://www.ieice hbkb.org/files/04/04Gun_02hen_05.pdf) for evaluation. Specifically, an antenna film 46 was produced, which was formed on the surface of a COP base material (trade name "Zeonor", manufactured by Zeon Co., Ltd., Japan) with a thickness of 100 μm as the antenna substrate 44. The shape shown in FIG. A patch antenna 43, and a copper ground layer 45 with a thickness of 1 μm is formed on the back. The dimensions of the millimeter wave patch antenna 43 were adjusted so as to be optimal for lamination with the adhesives of the examples and comparative examples (vertical A: 2.8 to 3.2 mm, horizontal B: 4.13 mm). On the patch antenna 43 side of the above-mentioned antenna film 46, the adhesive layer 42 of each example and comparative example is pasted so that air bubbles or foreign matter do not enter, and then bonded to chemically strengthened glass with a thickness of 0.7 mm as the cover glass 41 (manufactured by Corning Incorporated), and the antenna laminate 4 of the cover glass 41/adhesive layer 42/antenna film 46 was produced. Power is supplied from the microstrip line 43a connected to the millimeter-wave patch antenna 43 of various antenna laminates 4, and the transmission and reception characteristics at a frequency band of 30 GHz are evaluated. The gain (5.7 dB) of the antenna film 46) was evaluated as ◯, and the case where the gain (5.7 dB) was improved was evaluated as ×.

[表1] 表1    實施例 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 使用單體 (質量份) LMA 質量份    99.0    86.0 86.0 98.9 96.9 94.9 94.9 86.0 79.0 66.0 50.0 86.0 79.0 66.0 86.0 79.0 66.0 L-7MA 99.0                                                       IDMA       99                                                 HEMA 1.0 1.0 1.0 1.0 1.0 0.1 0.1 0.1 0.1 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 MMA          13.0                                              MMA-巨單體             13.0                                           CHMA                            13.0 20.0 33.0 49.0                   DCPMA                                                 13.0 20.0 33.0 IBXMA                                        13.0 20.0 33.0          MAA                1.0 3.0 5.0                                  NVP                         5.0                               AIBN(質量份) 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 介電常數 28 GHz    2.27 2.32 2.41 2.47 2.30 2.24 2.69 2.26 2.31 2.18 2.26 2.46 2.34 2.55 2.38 2.35 2.32 2.56 2.63 60 GHz 2.39 2.33 2.44 2.12 2.47 2.44 2.66 2.66 2.23 2.13 2.44 2.49 2.48 2.35 2.34 2.89 2.19 2.24 2.49 介電損耗 28 GHz 0.004 0.005 0.006 0.004 0.006 0.003 0.004 0.003 0.005 0.005 0.004 0.004 0.004 0.004 0.003 0.003 0.003 0.004 0.003 60 GHz 0.001 0.003 0.004 0.003 0.004 0.002 0.004 0.002 0.003 0.003 0.003 0.002 0.003 0.002 0.003 0.002 0.004 0.002 0.003 透明性 全光線透過率 % 93.0 93.0 92.8 92.8 92.6 92.9 92.7 92.8 92.8 92.4 92.8 92.6 92.5 92.8 92.7 92.7 92.8 92.7 92.6 霧度 0.20 0.30 0.40 0.60 1.20 0.20 0.60 0.80 0.30 0.40 0.50 0.70 0.88 0.30 0.50 0.20 0.40 0.50 0.80 接著力 N/20 mm 4.8 5.0 16.2 7.5 6.1 8.3 13.2 12.2 6.0 8.5 12.1 19.0 0.2 9.1 12.6 19.6 8.0 12.6 21.6 接收特性 [Table 1] Table 1 Example 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 Monomers used (parts by mass) LMA parts by mass 99.0 86.0 86.0 98.9 96.9 94.9 94.9 86.0 79.0 66.0 50.0 86.0 79.0 66.0 86.0 79.0 66.0 L-7MA 99.0 IDMA 99 HEMA 1.0 1.0 1.0 1.0 1.0 0.1 0.1 0.1 0.1 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 MMA 13.0 MMA - macromonomer 13.0 CHMA 13.0 20.0 33.0 49.0 DCPMA 13.0 20.0 33.0 IBXMA 13.0 20.0 33.0 MAA 1.0 3.0 5.0 NVP 5.0 AIBN (parts by mass) 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Dielectric constant 28GHz 2.27 2.32 2.41 2.47 2.30 2.24 2.69 2.26 2.31 2.18 2.26 2.46 2.34 2.55 2.38 2.35 2.32 2.56 2.63 60GHz 2.39 2.33 2.44 2.12 2.47 2.44 2.66 2.66 2.23 2.13 2.44 2.49 2.48 2.35 2.34 2.89 2.19 2.24 2.49 Dielectric loss 28GHz 0.004 0.005 0.006 0.004 0.006 0.003 0.004 0.003 0.005 0.005 0.004 0.004 0.004 0.004 0.003 0.003 0.003 0.004 0.003 60GHz 0.001 0.003 0.004 0.003 0.004 0.002 0.004 0.002 0.003 0.003 0.003 0.002 0.003 0.002 0.003 0.002 0.004 0.002 0.003 transparency Total light transmittance % 93.0 93.0 92.8 92.8 92.6 92.9 92.7 92.8 92.8 92.4 92.8 92.6 92.5 92.8 92.7 92.7 92.8 92.7 92.6 Haze 0.20 0.30 0.40 0.60 1.20 0.20 0.60 0.80 0.30 0.40 0.50 0.70 0.88 0.30 0.50 0.20 0.40 0.50 0.80 Adherence N/20 mm 4.8 5.0 16.2 7.5 6.1 8.3 13.2 12.2 6.0 8.5 12.1 19.0 0.2 9.1 12.6 19.6 8.0 12.6 21.6 reception characteristics

[表2] 表2    實施例 比較例 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 1 使用單體 LMA 質量份 86.0 79.0 86.0 79.0 86.0 95.0 90.0 80.0 84.5 79.5 74.5 49.5 24.5 74.5 74.5 36.0 50.0 44.5       LA                                        24.5                   2-EHA                         14.5 19.5 24.5 49.5 74.5       50.0          40.0 i-NA                                           24.5                IDMA                                                 39.0 44.5 89.0    HEMA 1.0 1.0 1.0 1.0 1.0 5.0 10.0 20.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0    CHMA                                              13.0 10.0 10.0 10.0    PHE-1G       13.0 20.0                                                 BzMA 13.0 20.0                                                       IDA                                                          50.00 MA                                                          9.5 4-HBA             13.0                                           0.5 AIBN(質量份) 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 介電常數 28 GHz    2.33 2.30 2.52 2.59 2.54 2.26 2.26 2.30 2.31 2.49 2.46 2.25 2.38 2.29 2.45 2.50 2.69 2.61 2.50 2.57 60 GHz 2.28 2.32 2.37 3.29 2.19 2.22 2.26 2.64 2.28 2.47 2.39 2.19 2.44 2.18 2.21 2.47 2.58 2.51 2.44 2.47 介電損耗 28 GHz 0.004 0.005 0.005 0.007 0.029 0.008 0.013 0.019 0.006 0.007 0.007 0.012 0.019 0.006 0.007 0.012 0.004 0.004 0.005 0.030 60 GHz 0.003 0.004 0.004 0.003 0.016 0.003 0.009 0.008 0.004 0.006 0.004 0.008 0.011 0.004 0.004 0.008 0.002 0.004 0.005 0.017 透明性 全光線透過率 % 92.7 92.6 92.7 92.7 92.8 92.8 92.8 92.7 92.8 92.8 92.9 93.0 92.9 92.9 92.9 92.8 92.7 92.7 92.7 92.1 霧度 0.30 0.40 0.30 0.40 0.30 0.50 0.70 0.10 0.20 0.10 0.40 0.60 0.10 0.10 0.20 0.20 0.40 0.40 0.50 0.3 接著力 N/20 mm 7.9 9.0 10.2 11.4 7.0 5.5 7.9 10.0 6.8 5.9 3.5 3.3 2.9 1.7 4.2 5.1 11.9 13.4 17.0 2.2 接收特性 [Table 2] Table 2 Example comparative example 20 twenty one twenty two twenty three twenty four 25 26 27 28 29 30 31 32 33 34 35 36 37 38 1 use monomer LMA parts by mass 86.0 79.0 86.0 79.0 86.0 95.0 90.0 80.0 84.5 79.5 74.5 49.5 24.5 74.5 74.5 36.0 50.0 44.5 LA 24.5 2-EHA 14.5 19.5 24.5 49.5 74.5 50.0 40.0 i-NA 24.5 IDMA 39.0 44.5 89.0 HEMA 1.0 1.0 1.0 1.0 1.0 5.0 10.0 20.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 CHMA 13.0 10.0 10.0 10.0 PHE-1G 13.0 20.0 BYZGR 13.0 20.0 IDA 50.00 MA 9.5 4-HBA 13.0 0.5 AIBN (parts by mass) 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Dielectric constant 28GHz 2.33 2.30 2.52 2.59 2.54 2.26 2.26 2.30 2.31 2.49 2.46 2.25 2.38 2.29 2.45 2.50 2.69 2.61 2.50 2.57 60GHz 2.28 2.32 2.37 3.29 2.19 2.22 2.26 2.64 2.28 2.47 2.39 2.19 2.44 2.18 2.21 2.47 2.58 2.51 2.44 2.47 Dielectric loss 28GHz 0.004 0.005 0.005 0.007 0.029 0.008 0.013 0.019 0.006 0.007 0.007 0.012 0.019 0.006 0.007 0.012 0.004 0.004 0.005 0.030 60GHz 0.003 0.004 0.004 0.003 0.016 0.003 0.009 0.008 0.004 0.006 0.004 0.008 0.011 0.004 0.004 0.008 0.002 0.004 0.005 0.017 transparency Total light transmittance % 92.7 92.6 92.7 92.7 92.8 92.8 92.8 92.7 92.8 92.8 92.9 93.0 92.9 92.9 92.9 92.8 92.7 92.7 92.7 92.1 Haze 0.30 0.40 0.30 0.40 0.30 0.50 0.70 0.10 0.20 0.10 0.40 0.60 0.10 0.10 0.20 0.20 0.40 0.40 0.50 0.3 Adherence N/20 mm 7.9 9.0 10.2 11.4 7.0 5.5 7.9 10.0 6.8 5.9 3.5 3.3 2.9 1.7 4.2 5.1 11.9 13.4 17.0 2.2 reception characteristics

1A:毫米波天線 1B:毫米波天線 1C:毫米波天線 2:毫米波天線元件 4:天線積層體 10:黏著片材 10a:黏著片材 10b:黏著片材 11:毫米波天線基板 12:罩蓋構件 13:圖像顯示面板 41:覆蓋玻璃 42:黏著劑層 43:毫米波用貼片天線 43a:微帶線路 44:天線基板 45:銅接地層 46:天線膜 1A: Millimeter wave antenna 1B: Millimeter wave antenna 1C: Millimeter wave antenna 2: Millimeter wave antenna elements 4: Antenna laminate 10: Adhesive sheet 10a: Adhesive sheet 10b: Adhesive sheet 11: Millimeter wave antenna substrate 12: cover member 13: Image display panel 41: cover glass 42: Adhesive layer 43: Patch antenna for millimeter wave 43a: Microstrip line 44: Antenna substrate 45: copper ground plane 46: Antenna film

圖1係表示本發明之毫米波天線之一實施方式之模式圖(剖視圖)。 圖2係表示本發明之毫米波天線之一實施方式之模式圖(剖視圖)。 圖3係表示本發明之毫米波天線之一實施方式之模式圖(剖視圖)。 圖4係表示收發特性評價中使用之天線積層體之模式圖(剖視圖)。圖4(a)為側方剖視圖,圖4(b)為上方投影圖。 FIG. 1 is a schematic diagram (sectional view) showing one embodiment of the millimeter wave antenna of the present invention. Fig. 2 is a schematic diagram (sectional view) showing an embodiment of the millimeter wave antenna of the present invention. Fig. 3 is a schematic diagram (sectional view) showing an embodiment of the millimeter wave antenna of the present invention. Fig. 4 is a schematic diagram (cross-sectional view) showing an antenna laminate used for evaluation of transmission and reception characteristics. Fig. 4(a) is a side sectional view, and Fig. 4(b) is a top projection view.

Claims (10)

一種黏著劑組合物,其於頻率28 GHz下之介電常數為2.0~5.0, 於頻率28 GHz下之介電損耗為0.0001~0.05,且 包含具有碳數6以上之烴基之甲基丙烯酸酯化合物、以及具有交聯性官能基之(甲基)丙烯酸酯化合物之混合物、其部分聚合物或共聚物。 An adhesive composition having a dielectric constant of 2.0 to 5.0 at a frequency of 28 GHz, The dielectric loss at the frequency of 28 GHz is 0.0001~0.05, and A mixture of a methacrylate compound having a hydrocarbon group having 6 or more carbon atoms and a (meth)acrylate compound having a crosslinkable functional group, a partial polymer or a copolymer thereof. 如請求項1之黏著劑組合物,其於頻率60 GHz下之介電常數為2.0~5.0。As for the adhesive composition of claim 1, its dielectric constant at a frequency of 60 GHz is 2.0-5.0. 一種黏著劑組合物,其於頻率60 GHz下之介電常數為2.0~5.0, 於頻率60 GHz下之介電損耗為0.0001~0.05,且 包含具有碳數6以上之烴基之甲基丙烯酸酯化合物、以及具有交聯性官能基之(甲基)丙烯酸酯化合物之混合物、其部分聚合物或共聚物。 An adhesive composition having a dielectric constant of 2.0 to 5.0 at a frequency of 60 GHz, The dielectric loss at the frequency of 60 GHz is 0.0001~0.05, and A mixture of a methacrylate compound having a hydrocarbon group having 6 or more carbon atoms and a (meth)acrylate compound having a crosslinkable functional group, a partial polymer or a copolymer thereof. 如請求項1至3中任一項之黏著劑組合物,其中上述烴基具有脂肪族基、含脂環基或含芳香環基。The adhesive composition according to any one of claims 1 to 3, wherein the above-mentioned hydrocarbon group has an aliphatic group, contains an alicyclic group, or contains an aromatic ring group. 如請求項1至4中任一項之黏著劑組合物,其中上述混合物、其部分聚合物或共聚物中之上述具有碳數6以上之烴基之甲基丙烯酸酯化合物、或源自該化合物之結構單元之含量為25質量%以上。The adhesive composition according to any one of claims 1 to 4, wherein the above-mentioned methacrylate compound having a hydrocarbon group having 6 or more carbon atoms in the above-mentioned mixture, a part of its polymer or a copolymer, or a methacrylate compound derived from the compound The content of the structural unit is 25% by mass or more. 如請求項1至5中任一項之黏著劑組合物,其中上述混合物、其部分聚合物或共聚物中之上述具有交聯性官能基之(甲基)丙烯酸酯化合物、或源自該化合物之結構單元之含量為0.1~30質量%。The adhesive composition according to any one of claims 1 to 5, wherein the above-mentioned (meth)acrylate compound having a crosslinkable functional group in the above-mentioned mixture, its partial polymer or copolymer, or derived from the compound The content of the structural unit is 0.1 to 30% by mass. 如請求項1至6中任一項之黏著劑組合物,其中上述烴基於末端具有脂環式基或芳香族基。The adhesive composition according to any one of claims 1 to 6, wherein the above-mentioned hydrocarbon has an alicyclic group or an aromatic group based on the terminal. 一種黏著劑層,其係由如請求項1至7中任一項之黏著劑組合物形成。An adhesive layer formed from the adhesive composition according to any one of claims 1 to 7. 一種黏著片材,其具有如請求項8之黏著劑層。An adhesive sheet having an adhesive layer according to claim 8. 一種毫米波天線,其係至少具有如請求項9之黏著片材以及基板者,且上述基板於至少單面具備天線元件,於上述基板之具有上述天線元件之側之面上貼合有上述黏著片材。A millimeter wave antenna, which has at least the adhesive sheet and the substrate according to claim 9, and the above-mentioned substrate has an antenna element on at least one side, and the above-mentioned adhesive is pasted on the surface of the above-mentioned substrate having the above-mentioned antenna element Sheet.
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