TW202223043A - Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet - Google Patents

Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet Download PDF

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TW202223043A
TW202223043A TW110135475A TW110135475A TW202223043A TW 202223043 A TW202223043 A TW 202223043A TW 110135475 A TW110135475 A TW 110135475A TW 110135475 A TW110135475 A TW 110135475A TW 202223043 A TW202223043 A TW 202223043A
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acrylate
meth
weight
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monomer
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TW110135475A
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形見普史
笹原一輝
仲野武史
野中崇弘
高橋智一
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

Provided are: a pressure-sensitive adhesive composition which can form pressure-sensitive adhesive layers low in permittivity and dielectric loss in a high-frequency band and suitable for bonding members for constituting millimeter-wave antennas; and a pressure-sensitive adhesive sheet. A pressure-sensitive adhesive composition according to a first aspect of the present invention has a permittivity at 28-GHz frequency of 2-5 and a dielectric loss at 28-GHz frequency of 0.0001-0.05. A pressure-sensitive adhesive composition according to a second aspect of the present invention has a permittivity at 60-GHz frequency of 2-5 and a dielectric loss at 60-GHz frequency of 0.0001-0.05.

Description

黏著劑組合物、黏著劑層、及黏著片材Adhesive composition, adhesive layer, and adhesive sheet

本發明係關於一種黏著劑組合物、黏著劑層、及黏著片材。更詳細而言,本發明係關於一種適於貼合毫米波天線之構成構件之黏著劑組合物、黏著劑層、及黏著片材。The present invention relates to an adhesive composition, an adhesive layer, and an adhesive sheet. More specifically, the present invention relates to an adhesive composition, an adhesive layer, and an adhesive sheet suitable for bonding a constituent member of a millimeter-wave antenna.

近年來,智慧型手機等攜帶用通信機器之通信之高速化、大容量化逐年發展,而期待作為下一代超高速資料通信標準之第五代(5G)相較於第四代(4G),能夠實現100倍之超高速/大容量通信、1/10之低延遲、10倍以上之多數同時連接。In recent years, the high-speed and large-capacity communication of portable communication devices such as smartphones has been developed year by year, and it is expected that the fifth generation (5G), which is the next-generation ultra-high-speed data communication standard, will be compared with the fourth generation (4G). It can achieve 100 times the ultra-high-speed/large-capacity communication, 1/10 the low latency, and more than 10 times the number of simultaneous connections.

為了能夠實現5G下如上述之超高速/大容量通信、低延遲、多數同時連接,而使用稱為毫米波之頻率超過24 GHz之高頻帶之電磁波,藉由使波長短至毫米級,能夠一次發送大量資料。In order to realize the above-mentioned ultra-high-speed/large-capacity communication, low latency, and multiple simultaneous connections under 5G, electromagnetic waves with a frequency exceeding 24 GHz called millimeter waves are used. Send a lot of information.

另一方面,毫米波與4G所使用之頻帶相比,有容易因與雨或空氣中之氧、水分子之共振吸收等而衰減、直線性較強且容易反射之性質,對於毫米波通信所使用之天線(以下有時稱為「毫米波天線」)而言,需要高至先前之4G通信以上之天線增益。On the other hand, compared with the frequency band used by 4G, millimeter waves are easily attenuated due to resonant absorption with rain, oxygen in the air, water molecules, etc., have strong linearity, and are easy to reflect. The antenna used (hereinafter sometimes referred to as "millimeter-wave antenna") requires an antenna gain higher than that of the previous 4G communication.

於專利文獻1中,作為搭載於智慧型手機等攜帶用通信機器之毫米波天線,揭示有一種於設置有天線元件之基材積層罩蓋構件之構成,且將該等基材與罩蓋構件貼合時使用黏著劑。 先前技術文獻 專利文獻 Patent Document 1 discloses a configuration in which a cover member is laminated on a base material provided with an antenna element as a millimeter-wave antenna mounted on a portable communication device such as a smartphone, and the base material and the cover member are laminated. Use adhesive when attaching. prior art literature Patent Literature

專利文獻1:日本專利特開2019-186942號公報Patent Document 1: Japanese Patent Laid-Open No. 2019-186942

[發明所欲解決之問題][Problems to be Solved by Invention]

對於構成毫米波天線之構件,已知其素材所具有之介電損失會導致毫米波減少,為了不降低天線增益,亦要求毫米波於高頻帶下之低介電常數、尤其是低介電損失之特性。對於構成毫米波天線之構件之貼合所使用之黏著劑,亦要求於高頻帶下之低介電常數、低介電損失之特性。For components constituting millimeter-wave antennas, it is known that the dielectric loss of the material will reduce the millimeter-wave. In order not to reduce the antenna gain, the millimeter-wave is also required to have a low dielectric constant in high frequency bands, especially low dielectric loss. characteristics. The adhesive used for lamination of the components constituting the millimeter-wave antenna also requires the characteristics of low dielectric constant and low dielectric loss in high frequency bands.

本發明係基於如以上之情況而想出者,本發明之目的在於提供一種可形成於高頻帶下介電常數及介電損失較低、適於貼合構成毫米波天線之構件的黏著劑層之黏著劑組合物。 又,本發明之其他目的在於提供一種於高頻帶下介電常數及介電損失較低、適於貼合構成毫米波天線之構件的黏著劑層。 又,本發明之其他目的在於提供一種具有於高頻帶下介電常數及介電損失較低、適於貼合構成毫米波天線之構件之黏著劑層之黏著片材。 [解決問題之技術手段] The present invention was conceived based on the above-mentioned circumstances, and an object of the present invention is to provide an adhesive layer that can be formed in a high frequency band with low dielectric constant and dielectric loss, and is suitable for bonding to a member constituting a millimeter-wave antenna The adhesive composition. In addition, another object of the present invention is to provide an adhesive layer with low dielectric constant and dielectric loss in a high frequency band, which is suitable for attaching to a member constituting a millimeter-wave antenna. In addition, another object of the present invention is to provide an adhesive sheet having a low dielectric constant and dielectric loss in a high frequency band and suitable for bonding an adhesive layer to a member constituting a millimeter-wave antenna. [Technical means to solve problems]

本發明之第一態樣提供一種於頻率28 GHz下之介電常數為2~5、於頻率28 GHz下之介電損失為0.0001~0.05之黏著劑組合物。The first aspect of the present invention provides an adhesive composition having a dielectric constant of 2-5 at a frequency of 28 GHz and a dielectric loss of 0.0001-0.05 at a frequency of 28 GHz.

於本發明之第一態樣之黏著劑組合物中,於頻率28 GHz下之介電常數為2~5之構成於可提高使用本發明之第一態樣之黏著劑組合物貼合構成構件之毫米波天線之天線增益之方面較佳。In the adhesive composition of the first aspect of the present invention, the dielectric constant at a frequency of 28 GHz is 2 to 5, so that the adhesive composition of the first aspect of the present invention can be used to improve the adhesion of the constituent members. The antenna gain of the millimeter-wave antenna is better.

於本發明之第一態樣之黏著劑組合物中,於頻率28 GHz下之介電損失為0.0001~0.05之構成於可提高使用本發明之第一態樣之黏著劑組合物貼合構成構件之毫米波天線之天線增益之方面較佳。In the adhesive composition of the first aspect of the present invention, the dielectric loss at a frequency of 28 GHz is 0.0001 to 0.05, which can improve the adhesion of the adhesive composition using the adhesive composition of the first aspect of the present invention. The antenna gain of the millimeter-wave antenna is better.

於本發明之第一態樣之黏著劑組合物中,較佳為於頻率60 GHz下之介電常數為2~5。該構成於可提高使用本發明之第一態樣之黏著劑組合物貼合構成構件之毫米波天線之天線增益之方面較佳。In the adhesive composition of the first aspect of the present invention, the dielectric constant at a frequency of 60 GHz is preferably 2-5. This configuration is preferable in that the antenna gain of the millimeter-wave antenna to which the constituent member is attached using the adhesive composition of the first aspect of the present invention can be improved.

於本發明之第一態樣之黏著劑組合物中,較佳為於頻率60 GHz下之介電損失為0.0001~0.05。該構成於可提高使用本發明之第一態樣之黏著劑組合物貼合構成構件之毫米波天線之天線增益之方面較佳。In the adhesive composition of the first aspect of the present invention, the dielectric loss at a frequency of 60 GHz is preferably 0.0001-0.05. This configuration is preferable in that the antenna gain of the millimeter-wave antenna to which the constituent member is attached using the adhesive composition of the first aspect of the present invention can be improved.

本發明之第二態樣提供一種於頻率60 GHz下之介電常數為2~5、於頻率60 GHz下之介電損失為0.0001~0.05之黏著劑組合物。The second aspect of the present invention provides an adhesive composition with a dielectric constant of 2-5 at a frequency of 60 GHz and a dielectric loss of 0.0001-0.05 at a frequency of 60 GHz.

於本發明之第二態樣之黏著劑組合物中,於頻率60 GHz下之介電常數為2~5之構成於可提高使用本發明之第二態樣之黏著劑組合物貼合構成構件之毫米波天線之天線增益之方面較佳。In the adhesive composition of the second aspect of the present invention, the dielectric constant of 2 to 5 at a frequency of 60 GHz can improve the adhesion of the adhesive composition of the second aspect of the present invention to the structural member. The antenna gain of the millimeter-wave antenna is better.

於本發明之第二態樣之黏著劑組合物中,於頻率60 GHz下之介電損失為0.0001~0.05之構成於可提高使用本發明之第二態樣之黏著劑組合物貼合構成構件之毫米波天線之天線增益之方面較佳。In the adhesive composition of the second aspect of the present invention, the dielectric loss at a frequency of 60 GHz is 0.0001 to 0.05, which can improve the adhesion of the adhesive composition of the second aspect of the present invention to the structural member. The antenna gain of the millimeter-wave antenna is better.

又,本發明之第三態樣提供一種藉由本發明之第一態樣之黏著劑組合物或本發明之第二態樣之黏著劑組合物所形成之黏著劑層。又,本發明之第四態樣提供一種具有本發明之第三態樣之黏著劑層之黏著片材。由於本發明之第三態樣之黏著劑層係由本發明之第一態樣之黏著劑組合物或本發明之第二態樣之黏著劑組合物所形成,故而於28 GHz、60 GHz等高頻帶下介電常數及介電損失降低。因此,藉由將具有本發明之第三態樣之黏著劑層的本發明之第四態樣之黏著片材用於構成毫米波天線之構件之貼合,可提高毫米波天線之天線增益而較佳。Furthermore, a third aspect of the present invention provides an adhesive layer formed by the adhesive composition of the first aspect of the present invention or the adhesive composition of the second aspect of the present invention. Moreover, the 4th aspect of this invention provides the adhesive sheet which has the adhesive bond layer of the 3rd aspect of this invention. Since the adhesive layer of the third aspect of the present invention is formed from the adhesive composition of the first aspect of the present invention or the adhesive composition of the second aspect of the present invention, it can be used at high frequencies such as 28 GHz and 60 GHz. The dielectric constant and dielectric loss are reduced in the frequency band. Therefore, by using the adhesive sheet of the fourth aspect of the present invention having the adhesive layer of the third aspect of the present invention for lamination of members constituting the millimeter-wave antenna, the antenna gain of the millimeter-wave antenna can be improved and the better.

又,本發明之第五態樣提供一種毫米波天線,其至少具有本發明之第四態樣之黏著片材及基板,且上述基板至少於單面具備天線元件,於上述基板之具有上述天線元件一側之面上貼著有上述黏著片材。本發明之第五態樣之毫米波天線由於搭載於基板上之天線元件係藉由本發明之第四態樣之黏著片材而貼著,故而可將所接收之毫米波之輻射損失抑制為較低,可提高本發明之第五態樣之毫米波天線之天線增益而較佳。 [發明之效果] In addition, a fifth aspect of the present invention provides a millimeter-wave antenna comprising at least the adhesive sheet and substrate of the fourth aspect of the present invention, wherein the substrate has an antenna element on at least one side, and the substrate has the antenna. The above-mentioned adhesive sheet is attached to one side of the component. In the millimeter-wave antenna of the fifth aspect of the present invention, since the antenna element mounted on the substrate is attached by the adhesive sheet of the fourth aspect of the present invention, the radiation loss of the received millimeter-wave can be suppressed to a relatively low level. low, which can improve the antenna gain of the millimeter-wave antenna of the fifth aspect of the present invention. [Effect of invention]

本發明之黏著劑組合物、黏著劑層於毫米波之高頻帶下表現出較低之介電常數、介電損失,可將毫米波之輻射損失抑制為較低。因此,藉由使用本發明之黏著片材貼合毫米波天線之構成構件,可有效率地製造表現出較高之天線增益之毫米波天線。The adhesive composition and the adhesive layer of the present invention exhibit lower dielectric constant and dielectric loss in the high frequency band of millimeter waves, and can suppress the radiation loss of millimeter waves to a lower level. Therefore, by bonding the constituent members of the millimeter-wave antenna using the adhesive sheet of the present invention, a millimeter-wave antenna exhibiting high antenna gain can be efficiently manufactured.

[1.黏著劑組合物] 本發明之第一態樣之黏著劑組合物只要於頻率28 GHz下之介電常數為2~5,於頻率28 GHz下之介電損失為0.0001~0.05即可,於其他方面並無特別限定。 本發明之第二態樣之黏著劑組合物只要於頻率60 GHz下之介電常數為2~5,於頻率60 GHz下之介電損失為0.0001~0.05即可,於其他方面並無特別限定。 本發明之第三態樣之黏著劑層只要藉由本發明之第一態樣之黏著劑組合物或本發明之第二態樣之黏著劑組合物形成即可,於其他方面並無特別限定。 本發明之第四態樣之黏著片材只要具有本發明之第三態樣之黏著劑層即可,於其他方面並無特別限定。 於本說明書中,存在將本發明之第一態樣之黏著劑組合物及本發明之第二態樣之黏著劑組合物總稱而簡稱為「本發明之黏著劑組合物」之情形。又,存在將本發明之第三態樣之黏著劑層簡稱為「本發明之黏著劑層」之情形。又,存在將本發明之第四態樣之黏著片材簡稱為「本發明之黏著片材」之情形。 [1. Adhesive composition] The adhesive composition of the first aspect of the present invention only needs to have a dielectric constant of 2 to 5 at a frequency of 28 GHz, and a dielectric loss of 0.0001 to 0.05 at a frequency of 28 GHz, and is not particularly limited in other aspects. . The adhesive composition of the second aspect of the present invention only needs to have a dielectric constant of 2 to 5 at a frequency of 60 GHz and a dielectric loss of 0.0001 to 0.05 at a frequency of 60 GHz, and is not particularly limited in other aspects. . The adhesive layer of the third aspect of the present invention may be formed by the adhesive composition of the first aspect of the present invention or the adhesive composition of the second aspect of the present invention, and is not particularly limited in other respects. The pressure-sensitive adhesive sheet of the fourth aspect of the present invention is not particularly limited in other respects as long as it has the pressure-sensitive adhesive layer of the third aspect of the present invention. In this specification, the adhesive composition of the first aspect of the present invention and the adhesive composition of the second aspect of the present invention are collectively referred to as "the adhesive composition of the present invention" for short. In addition, there is a case where the adhesive layer of the third aspect of the present invention is simply referred to as "the adhesive layer of the present invention". In addition, there is a case where the adhesive sheet of the fourth aspect of the present invention is simply referred to as "the adhesive sheet of the present invention".

本發明之黏著劑組合物可具有任意形態,例如可例舉:溶劑型、乳液型、熱熔融型(熱熔型)、無溶劑型(活性能量線硬化型,例如單體混合物、或單體混合物及其部分聚合物等)等。The adhesive composition of the present invention can have any form, for example, solvent type, emulsion type, hot melt type (hot melt type), solvent-free type (active energy ray hardening type, such as monomer mixture, or monomer type) mixture and some of its polymers, etc.), etc.

本發明之黏著劑組合物如上所述,可為溶劑型,即可含有有機溶劑。作為上述有機溶劑,只要為用作溶劑之有機化合物,則無特別限定,例如可例舉:環己烷、己烷、庚烷、甲基環己烷等烴系溶劑;甲苯、二甲苯等芳香族系溶劑;乙酸丁酯、乙酸乙酯、乙酸甲酯等酯系溶劑;丙酮、甲基乙基酮、甲基異丁基酮等酮系溶劑;甲醇、乙醇、丙醇、丁醇、異丙醇等醇系溶劑等。再者,上述有機溶劑亦可為包含2種以上有機溶劑之混合溶劑。As mentioned above, the adhesive composition of the present invention may be in a solvent type, or may contain an organic solvent. The organic solvent is not particularly limited as long as it is an organic compound used as a solvent, and examples thereof include hydrocarbon-based solvents such as cyclohexane, hexane, heptane, and methylcyclohexane; aromatics such as toluene and xylene. family solvents; ester solvents such as butyl acetate, ethyl acetate, methyl acetate; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone; methanol, ethanol, propanol, butanol, isobutyl ketone, etc. Alcohol-based solvents such as propanol, etc. In addition, the above-mentioned organic solvent may be a mixed solvent containing two or more kinds of organic solvents.

本發明之第一態樣之黏著劑組合物於28 GHz下之介電常數被控制為較低,可抑制毫米波之輻射損失。本發明之第一態樣之黏著劑組合物之頻率為5以下,較佳為4.5以下,更佳為4以下,進而較佳為3.5以下,亦可為3.4以下、3.3以下、3.2以下、3.1以下、3.0以下、或2.9以下。於頻率28 GHz下之介電常數之下限值並無特別限定,較佳為2以上,亦可為2.1以上、或2.2以上。又,本發明之第二態樣之黏著劑組合物較佳為於頻率28 GHz下之介電常數為上述範圍內。The dielectric constant of the adhesive composition of the first aspect of the present invention is controlled to be low at 28 GHz, which can suppress the radiation loss of millimeter waves. The frequency of the adhesive composition of the first aspect of the present invention is 5 or less, preferably 4.5 or less, more preferably 4 or less, still more preferably 3.5 or less, and may be 3.4 or less, 3.3 or less, 3.2 or less, or 3.1 below, below 3.0, or below 2.9. The lower limit value of the dielectric constant at a frequency of 28 GHz is not particularly limited, but is preferably 2 or more, and may be 2.1 or more, or 2.2 or more. Furthermore, the adhesive composition of the second aspect of the present invention preferably has a dielectric constant within the above-mentioned range at a frequency of 28 GHz.

本發明之黏著劑組合物之於28 GHz下之介電常數可藉由調整構成黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。 於本說明書中,介電常數係藉由下文揭示之實施例所記載之方法進行測定。 再者,「相對介電常數」係「介電常數」除以「真空之介電常數」所得之值,但由於「真空之介電常數」為1,故而於本說明書中,將「介電常數」與「相對介電常數」處理為含義相同者。 The dielectric constant of the adhesive composition of the present invention at 28 GHz can be adjusted by adjusting the type of the base polymer, the monomer composition, the type or content of additives, etc. that constitute the adhesive composition. In this specification, the dielectric constant is measured by the method described in the examples disclosed below. Furthermore, the “relative permittivity” is the value obtained by dividing the “dielectric constant” by the “dielectric constant of a vacuum”, but since the “dielectric constant of a vacuum” is 1, in this specification, the “dielectric constant” is referred to as “dielectric constant”. "Constant" and "relative permittivity" are treated as having the same meaning.

本發明之第一態樣之黏著劑組合物於28 GHz下之介電損失被控制為較低,可抑制毫米波之輻射損失。本發明之第一態樣之黏著劑組合物於頻率28 GHz下之介電損失為0.05以下,較佳為0.045以下,更佳為0.04以下,進而較佳為0.035以下,進而較佳為0.03以下,進而更佳為0.025以下,尤佳為0.02以下。於頻率28 GHz下之介電損失之下限值並無特別限定,較佳為0.0001以上,亦可為0.0005以上、或0.001以上。又,本發明之第二態樣之黏著劑組合物較佳為於頻率28 GHz下之介電損失為上述範圍內。The dielectric loss of the adhesive composition of the first aspect of the present invention is controlled to be low at 28 GHz, which can suppress the radiation loss of millimeter waves. The dielectric loss of the adhesive composition of the first aspect of the present invention at a frequency of 28 GHz is 0.05 or less, preferably 0.045 or less, more preferably 0.04 or less, more preferably 0.035 or less, and still more preferably 0.03 or less , more preferably 0.025 or less, and still more preferably 0.02 or less. The lower limit value of the dielectric loss at a frequency of 28 GHz is not particularly limited, but is preferably 0.0001 or more, and may be 0.0005 or more, or 0.001 or more. In addition, the adhesive composition of the second aspect of the present invention preferably has a dielectric loss in the above-mentioned range at a frequency of 28 GHz.

本發明之黏著劑組合物之於28 GHz下之介電損失可藉由調整構成黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。 於本說明書中,介電損失係藉由下文揭示之實施例所記載之方法進行測定。 The dielectric loss of the adhesive composition of the present invention at 28 GHz can be adjusted by adjusting the type of the base polymer, the monomer composition, the type or content of additives, etc. that constitute the adhesive composition. In this specification, the dielectric loss is measured by the method described in the examples disclosed below.

本發明之第二黏著劑組合物於60 GHz下之介電常數被控制為較低,可抑制毫米波之輻射損失。本發明之第二黏著劑組合物於頻率60 GHz下之介電常數為5以下,較佳為4.5以下,更佳為4以下,進而較佳為3.5以下,亦可為3.4以下、3.3以下、3.2以下、3.1以下、3.0以下、或2.9以下。於頻率60 GHz下之介電常數之下限值並無特別限定,較佳為2以上,亦可為2.1以上、或2.2以上。又,本發明之第一態樣之黏著劑組合物較佳為於頻率60 GHz下之介電常數為上述範圍內。The dielectric constant of the second adhesive composition of the present invention is controlled to be low at 60 GHz, which can suppress radiation loss of millimeter waves. The dielectric constant of the second adhesive composition of the present invention at a frequency of 60 GHz is 5 or less, preferably 4.5 or less, more preferably 4 or less, further preferably 3.5 or less, and may also be 3.4 or less, 3.3 or less, 3.2 or less, 3.1 or less, 3.0 or less, or 2.9 or less. The lower limit value of the dielectric constant at a frequency of 60 GHz is not particularly limited, but is preferably 2 or more, and may be 2.1 or more, or 2.2 or more. Furthermore, the adhesive composition of the first aspect of the present invention preferably has a dielectric constant within the above-mentioned range at a frequency of 60 GHz.

本發明之黏著劑組合物之於60 GHz下之介電常數可藉由調整構成黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。The dielectric constant of the adhesive composition of the present invention at 60 GHz can be adjusted by adjusting the type of the base polymer, the composition of monomers, the type or content of additives, etc. that constitute the adhesive composition.

本發明之第二黏著劑組合物於60 GHz下之介電損失被控制為較低,可抑制毫米波之輻射損失。本發明之第二態樣之黏著劑組合物於頻率60 GHz下之介電損失為0.05以下,較佳為0.045以下,更佳為0.04以下,進而較佳為0.035以下,進而較佳為0.03以下,進而更佳為0.025以下,尤佳為0.02以下,亦可為0.019以下、0.018以下、0.017以下、0.016以下、0.015以下、0.014以下、0.013以下、或0.012以下。於頻率60 GHz下之介電損失之下限值並無特別限定,較佳為0.0001以上,亦可為0.0005以上、或0.001以上。又,本發明之第一態樣之黏著劑組合物較佳為於頻率60 GHz下之介電損失為上述範圍內。The dielectric loss of the second adhesive composition of the present invention at 60 GHz is controlled to be low, and the radiation loss of millimeter waves can be suppressed. The dielectric loss of the adhesive composition of the second aspect of the present invention at a frequency of 60 GHz is 0.05 or less, preferably 0.045 or less, more preferably 0.04 or less, more preferably 0.035 or less, and still more preferably 0.03 or less Furthermore, it is more preferably 0.025 or less, particularly preferably 0.02 or less, and may be 0.019 or less, 0.018 or less, 0.017 or less, 0.016 or less, 0.015 or less, 0.014 or less, 0.013 or less, or 0.012 or less. The lower limit value of the dielectric loss at a frequency of 60 GHz is not particularly limited, but is preferably 0.0001 or more, and may be 0.0005 or more, or 0.001 or more. Furthermore, the adhesive composition of the first aspect of the present invention preferably has a dielectric loss in the above-mentioned range at a frequency of 60 GHz.

本發明之黏著劑組合物之於60 GHz下之介電損失可藉由調整構成黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。The dielectric loss of the adhesive composition of the present invention at 60 GHz can be adjusted by adjusting the type of the base polymer, the monomer composition, the type or content of additives, etc. which constitute the adhesive composition.

作為構成本發明之黏著劑組合物之基礎聚合物,並無特別限定,例如可例舉:丙烯酸系黏著劑組合物作為基礎聚合物所含有之丙烯酸系聚合物、橡膠系黏著劑組合物(天然橡膠系黏著劑組合物或合成橡膠系黏著劑組合物等)作為基礎聚合物所含有之橡膠系聚合物、聚矽氧系黏著劑組合物作為基礎聚合物所含有之聚矽氧系聚合物、聚酯系黏著劑組合物作為基礎聚合物所含有之聚酯系聚合物、胺基甲酸酯系黏著劑組合物作為基礎聚合物所含有之胺基甲酸酯系聚合物、聚醯胺系黏著劑組合物作為基礎聚合物所含有之聚醯胺系聚合物、環氧系黏著劑組合物作為基礎聚合物所含有之環氧系聚合物、乙烯基烷基醚系黏著劑組合物作為基礎聚合物所含有之乙烯基烷基醚系聚合物、氟系黏著劑組合物作為基礎聚合物所含有之氟系聚合物等。其中,上述基礎聚合物就將於高頻帶下之介電常數、介電損失控制為較低、透明性、耐候性、接著可靠性等方面而言,較佳為丙烯酸系聚合物、橡膠系聚合物。即,本發明之黏著劑組合物較佳為含有下文所述之丙烯酸系聚合物作為基礎聚合物之丙烯酸系黏著劑組合物、含有下文所述之橡膠系聚合物作為基礎聚合物之橡膠系黏著劑組合物。再者,基礎聚合物可單獨使用或組合2種以上而使用。The base polymer constituting the adhesive composition of the present invention is not particularly limited, and examples thereof include acrylic polymers, rubber-based adhesive compositions (natural rubber-based adhesive composition or synthetic rubber-based adhesive composition, etc.) as a base polymer containing a rubber-based polymer, a polysiloxane-based adhesive composition as a base polymer containing a polysiloxane-based polymer, Polyester-based polymer contained in polyester-based adhesive composition as base polymer, urethane-based polymer contained in urethane-based adhesive composition as base polymer, and polyamide-based polymer The polyamide-based polymer contained in the adhesive composition as the base polymer, and the epoxy-based adhesive composition contained as the base polymer The epoxy-based polymer and vinyl alkyl ether-based adhesive composition contained as the base The vinyl alkyl ether-based polymer contained in the polymer, the fluorine-based polymer contained in the fluorine-based adhesive composition as the base polymer, and the like. Among them, the above-mentioned base polymer is preferably an acrylic polymer or a rubber-based polymer in terms of controlling the dielectric constant and dielectric loss in a high frequency band to be low, transparency, weather resistance, adhesion reliability, etc. thing. That is, the adhesive composition of the present invention is preferably an acrylic adhesive composition containing the below-described acrylic polymer as a base polymer, and a rubber-based adhesive composition containing the below-described rubber-based polymer as a base polymer agent composition. In addition, a base polymer can be used individually or in combination of 2 or more types.

於本說明書中,「基礎聚合物」係指黏著劑組合物所含之聚合物成分中之主要成分(調配比率最大之成分。以下相同),典型而言指占上述聚合物成分之大於50重量%之比率之成分。 又,於本說明書中,於提及「基礎聚合物」時,包含「構成基礎聚合物之單體成分之混合物或構成基礎聚合物之單體成分之混合物之部分聚合物」。 於本說明書中,上述「單體成分之混合物」包括包含單一之單體成分之情形與包含2種以上單體成分之情形。又,上述「單體成分之混合物之部分聚合物」意指上述「單體成分之混合物」之構成單體成分中之1種或2種以上單體成分部分聚合之組合物。 In this specification, "base polymer" refers to the main component of the polymer components contained in the adhesive composition (the component with the largest compounding ratio. The same below), typically refers to more than 50 weight of the above polymer components % ratio of ingredients. In addition, in this specification, when referring to a "base polymer", "a mixture of monomer components constituting a base polymer or a partial polymer of a mixture of monomer components constituting a base polymer" is included. In this specification, the above-mentioned "mixture of monomer components" includes the case of including a single monomer component and the case of including two or more monomer components. In addition, the above-mentioned "partial polymer of a mixture of monomer components" means a composition in which one or two or more of the monomer components constituting the above-mentioned "mixture of monomer components" are partially polymerized.

本發明之黏著劑組合物中之上述基礎聚合物之含量並無特別限定,較佳為75重量%以上(例如75~99.9重量%),更佳為85重量%以上(例如85~99.9重量%)。The content of the above-mentioned base polymer in the adhesive composition of the present invention is not particularly limited, but is preferably 75% by weight or more (eg, 75-99.9% by weight), more preferably 85% by weight or more (eg, 85-99.9% by weight) ).

本發明之黏著劑組合物較佳為不含有或實質上不含有含酸性基之單體(例如含羧基之單體、含有磺基之單體、含有磷酸基之單體等)。該構成於可獲得針對天線元件或配線之優異之防腐蝕效果之方面而言較佳。再者,含酸性基之單體之含量相對於上述黏著劑組合物總量而較佳為0.05重量%以下(例如0~0.05重量%)、更佳為0.01重量%以下(例如0~0.01重量%)、進而較佳為0.001重量%以下(例如0~0.001重量%)者可認為實質上不含有。The adhesive composition of the present invention preferably does not contain or substantially does not contain acidic group-containing monomers (eg, carboxyl group-containing monomers, sulfo group-containing monomers, phosphoric acid group-containing monomers, etc.). This configuration is preferable in that an excellent anticorrosion effect for antenna elements or wirings can be obtained. Furthermore, the content of the acid group-containing monomer is preferably 0.05 wt % or less (eg, 0 to 0.05 wt %), more preferably 0.01 wt % or less (eg, 0 to 0.01 wt %) with respect to the total amount of the adhesive composition. %), and more preferably 0.001% by weight or less (for example, 0 to 0.001% by weight) can be considered to be substantially not contained.

[1-1.丙烯酸系聚合物(A)] 本發明之黏著劑組合物較佳為以丙烯酸系聚合物作為主要成分之丙烯酸系黏著劑組合物。於本說明書中,存在將作為基礎聚合物而含有於丙烯酸系黏著劑組合物中之丙烯酸系聚合物稱為「丙烯酸系聚合物(A)」之情形。丙烯酸系聚合物(A)之具體之含量並無特別限定,相對於本發明之黏著劑組合物總量(總重量、100重量%),較佳為75重量%以上(例如75~99.9重量%),更佳為85重量%以上(例如85~99.9重量%)。 [1-1. Acrylic polymer (A)] The adhesive composition of the present invention is preferably an acrylic adhesive composition containing an acrylic polymer as a main component. In this specification, the acrylic polymer contained in the acrylic adhesive composition as a base polymer may be referred to as "acrylic polymer (A)". The specific content of the acrylic polymer (A) is not particularly limited, but is preferably 75% by weight or more (for example, 75 to 99.9% by weight relative to the total amount (total weight, 100% by weight) of the adhesive composition of the present invention. ), more preferably 85% by weight or more (eg, 85 to 99.9% by weight).

作為含有丙烯酸系聚合物(A)作為主要成分之黏著劑組合物,並無特別限定,例如可例舉:以丙烯酸系聚合物(A)作為必需成分之組合物;以構成丙烯酸系聚合物(A)之單體成分之混合物(有時稱為「單體混合物」)或其部分聚合物作為必需成分之組合物等。並無特別限定,但作為前者,例如可例舉所謂之溶劑型、水分散型組合物(乳液型組合物)等,作為後者,例如可例舉所謂之活性能量線硬化型組合物等。再者,上述黏著劑組合物可視需要包含其他添加劑。The adhesive composition containing the acrylic polymer (A) as a main component is not particularly limited, for example, a composition containing the acrylic polymer (A) as an essential component; A) a mixture of monomer components (sometimes referred to as "monomer mixture") or a partial polymer thereof as a composition of essential components, etc. Although not particularly limited, examples of the former include so-called solvent-type and water-dispersed compositions (emulsion-type compositions), and examples of the latter include so-called active energy ray-curable compositions. Furthermore, the above-mentioned adhesive composition may optionally contain other additives.

上述「單體混合物」包括包含單一之單體成分之情形、包含2種以上單體成分之情形。又,上述「部分聚合物」意指上述單體混合物之構成成分中之1種或2種以上成分部分聚合之組合物。其中,上述黏著劑組合物較佳為以單體混合物或其部分聚合物作為必需成分之組合物。The above-mentioned "monomer mixture" includes the case of containing a single monomer component and the case of containing two or more types of monomer components. In addition, the above-mentioned "partial polymer" means a composition in which one or two or more of the constituent components of the above-mentioned monomer mixture are partially polymerized. Among them, the above-mentioned adhesive composition is preferably a composition containing a monomer mixture or a partial polymer thereof as an essential component.

上述單體成分可為巨單體。巨單體係複數之上述單體成分聚合而成之高分子量單體。於使用巨單體之情形時,於基礎聚合物中,來自構成巨單體之單體成分之結構單元以某種程度連續存在。因此,藉由使用巨單體,可將來自巨單體之高次結構導入基礎聚合物中,而可容易地調整作為黏著劑所要求之特性(接著力或凝集力、階差追隨性等)。上述巨單體之重量平均分子量較佳為3000~35000,更佳為4000~30000,進而較佳為5000~25000,尤佳為6000~20000。The above-mentioned monomer components may be macromonomers. A macromonomer system is a high molecular weight monomer obtained by polymerizing a plurality of the above-mentioned monomer components. In the case of using a macromonomer, structural units derived from monomer components constituting the macromonomer exist continuously to some extent in the base polymer. Therefore, by using a macromonomer, the higher-order structure derived from the macromonomer can be introduced into the base polymer, and the properties required as an adhesive (adhesion force, cohesion force, step followability, etc.) can be easily adjusted. . The weight-average molecular weight of the aforementioned macromonomer is preferably 3,000-35,000, more preferably 4,000-30,000, further preferably 5,000-25,000, particularly preferably 6,000-20,000.

丙烯酸系聚合物(A)係含有丙烯酸系單體(acrylic monomer)作為必需之單體單元(monomer unit,單體結構單元)之聚合物(polymer)。換言之,丙烯酸系聚合物(A)係含有來自丙烯酸系單體之結構單元作為結構單元之聚合物。即,丙烯酸系聚合物(A)係以丙烯酸系單體作為必需之單體成分所構成(形成)之聚合物。The acrylic polymer (A) is a polymer (polymer) containing an acrylic monomer as a necessary monomer unit (monomer unit). In other words, the acrylic polymer (A) is a polymer containing a structural unit derived from an acrylic monomer as a structural unit. That is, the acrylic polymer (A) is a polymer composed (formed) with an acrylic monomer as an essential monomer component.

丙烯酸系聚合物(A)較佳為含有具有直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯(以下有時簡稱為「(甲基)丙烯酸烷基酯」)作為必需之單體單元之聚合物。再者,於本說明書中,「(甲基)丙烯酸基」表示「丙烯酸基」及「甲基丙烯酸基」中之任意一者或兩者,其他亦為同樣。The acrylic polymer (A) preferably contains an alkyl (meth)acrylate having a linear or branched alkyl group (hereinafter sometimes abbreviated as "alkyl (meth)acrylate") as essential A polymer of monomeric units. In addition, in this specification, "(meth)acryl group" means either one or both of "acryl group" and "methacryl group", and the other is the same.

丙烯酸系聚合物(A)較佳為作為單體單元而含有具有碳數10~24之支鏈狀之烷基之(甲基)丙烯酸烷基酯(以下有時稱為「(甲基)丙烯酸烷基酯(A1)」)及/或具有碳數6以上之烴基之甲基丙烯酸酯(以下有時稱為「甲基丙烯酸酯(A2)」)之聚合物。即,上述丙烯酸系聚合物(A)較佳為藉由使含有如(甲基)丙烯酸烷基酯(A1)之具有長鏈之支鏈狀之烷基之(甲基)丙烯酸烷基酯、或如甲基丙烯酸酯(A2)之具有長鏈之烴基之甲基丙烯酸酯的單體成分進行聚合所獲得者。藉由上述長鏈之支鏈狀之烷基或上述長鏈之烴基及甲基丙烯酸基部之作用,可於高頻帶下實現低介電常數、低介電損失之黏著劑組合物,於貼附於具備毫米波天線之基板上之情形時,由於藉由黏著劑組合物所形成之黏著劑層於高頻帶下亦為低介電常數、低介電損失,故而可抑制毫米波之照射損失。再者,(甲基)丙烯酸烷基酯(A1)及甲基丙烯酸酯(A2)可分別含有相當於該等之任一者之化合物。The acrylic polymer (A) is preferably an alkyl (meth)acrylate having a branched alkyl group having 10 to 24 carbon atoms as a monomer unit (hereinafter sometimes referred to as "(meth)acrylic acid) A polymer of alkyl ester (A1)") and/or methacrylate (hereinafter sometimes referred to as "methacrylate (A2)") having a hydrocarbon group having a carbon number of 6 or more. That is, the above-mentioned acrylic polymer (A) is preferably an alkyl (meth)acrylate containing a long-chain branched alkyl group such as an alkyl (meth)acrylate (A1), Or obtained by polymerizing the monomer component of methacrylate having a long-chain hydrocarbon group such as methacrylate (A2). Through the action of the above-mentioned long-chain branched alkyl group or the above-mentioned long-chain hydrocarbon group and methacrylic acid group, the adhesive composition with low dielectric constant and low dielectric loss can be realized in high frequency band. In the case of a substrate with a millimeter-wave antenna, since the adhesive layer formed by the adhesive composition also has a low dielectric constant and low dielectric loss in a high frequency band, the radiation loss of the millimeter-wave can be suppressed. In addition, (meth)acrylate (A1) and methacrylate (A2) may contain the compound corresponding to any of these, respectively.

為了降低高頻帶下之介電常數、介電損失,根據克勞修斯-莫梭提(Clausius-Mossotti)方程式,認為減小分子之偶極矩且增大莫耳體積即可。於本發明之黏著劑組合物中之作為主要成分之基礎聚合物為丙烯酸系聚合物(A)之情形時,若使用(甲基)丙烯酸烷基酯(A1)作為主單體單元,則認為由於具有長鏈之支鏈狀之烷基,故而於由本發明之黏著劑組合物所獲得之黏著劑層中,莫耳體積增加,進而烷基具有支鏈,藉此偶極矩減小。如上所述,認為如莫耳體積增加、偶極矩變小之具有雙方之平衡的黏著劑組合物於使用具有碳數10~24之支鏈狀之烷基作為烷基之(甲基)丙烯酸烷基酯(A1)之情形時發揮作用。In order to reduce the dielectric constant and dielectric loss in the high frequency band, according to the Clausius-Mossotti equation, it is considered that the dipole moment of the molecule can be reduced and the molar volume can be increased. In the case where the base polymer serving as the main component in the adhesive composition of the present invention is the acrylic polymer (A), if the alkyl (meth)acrylate (A1) is used as the main monomer unit, it is considered that Due to the long-chain branched alkyl group, in the adhesive layer obtained from the adhesive composition of the present invention, the molar volume is increased, and the alkyl group has a branched chain, whereby the dipole moment is reduced. As described above, it is considered that an adhesive composition having a balance of both, such as an increase in molar volume and a decrease in dipole moment, is suitable for (meth)acrylic acid using a branched alkyl group having a carbon number of 10 to 24 as the alkyl group. It works in the case of the alkyl ester (A1).

又,於本發明之黏著劑組合物中之作為主要成分之基礎聚合物為丙烯酸系聚合物(A)之情形時,若使用甲基丙烯酸酯(A2)作為主單體單元,則認為相對於丙烯酸烷基酯之極化偏向作為側鏈之丙烯酸基部,甲基丙烯酸酯(A2)中之甲基丙烯酸基部藉由具有α-甲基,主鏈附近之極化得以減輕,其結果為介電損失得以降低。又,認為甲基丙烯酸基部之疏水性高於丙烯酸基部,由此可抑制吸濕引起之介電損失之惡化。Moreover, when the base polymer as the main component in the adhesive composition of the present invention is the acrylic polymer (A), if methacrylate (A2) is used as the main monomer unit, it is considered that relative to The polarization of the alkyl acrylate tends to be the acrylic group of the side chain, and the methacrylic group in the methacrylate (A2) has an α-methyl group, the polarization near the main chain is reduced, and the result is a dielectric Losses are reduced. In addition, it is considered that the hydrophobicity of the methacrylic base is higher than that of the acrylic base, whereby deterioration of dielectric loss due to moisture absorption can be suppressed.

(甲基)丙烯酸烷基酯(A1)(具有碳數10~24之支鏈狀之烷基之(甲基)丙烯酸烷基酯)之均聚物之Tg較佳為-80~0℃,進而較佳為-70~-10℃。若均聚物之Tg為-80℃以上,則可抑制黏著劑層於常溫下之彈性模數過度降低。若均聚物之Tg為0℃以下,則可確保適度之接著力。均聚物之Tg係利用示差掃描熱量計(DSC)所測得之值。又,支鏈狀之烷基就可滿足高頻帶下之介電常數、介電損失與適度之彈性模數之方面而言,碳數為10~24,可藉由丙烯酸系聚合物(A)之製造方法適當地選擇具有烷基之(甲基)丙烯酸烷基酯。例如,於藉由溶液聚合等製造(甲基)丙烯酸系聚合物(A)之情形時,上述烷基進而較佳為碳數10~18,進而較佳為碳數10~16,進而較佳為碳數10~14。於藉由輻射聚合等製造丙烯酸系聚合物(A)之情形時,上述烷基進而較佳為碳數12~18,進而較佳為碳數14~18。再者,即便(甲基)丙烯酸烷基酯之均聚物之Tg為-80~0℃,若烷基為直鏈或碳數為9以下,則於高頻帶下將黏著劑組合物進行低介電常數化、低介電損失之效果亦不大。The Tg of the homopolymer of the alkyl (meth)acrylate (A1) (alkyl (meth)acrylate having a branched alkyl group having 10 to 24 carbon atoms) is preferably -80 to 0°C, More preferably, it is -70--10 degreeC. If the Tg of the homopolymer is -80°C or higher, the elastic modulus of the adhesive layer at room temperature can be suppressed from being excessively lowered. If the Tg of the homopolymer is 0° C. or lower, an appropriate adhesive force can be secured. The Tg of the homopolymer is the value measured by a differential scanning calorimeter (DSC). In addition, the branched alkyl group has a carbon number of 10 to 24 from the viewpoint of satisfying the dielectric constant, dielectric loss and moderate elastic modulus in high frequency bands, and can be prepared by the acrylic polymer (A) As the production method, the alkyl (meth)acrylate having an alkyl group is appropriately selected. For example, when the (meth)acrylic polymer (A) is produced by solution polymerization or the like, the alkyl group is more preferably carbon number 10 to 18, more preferably carbon number 10 to 16, more preferably It has 10 to 14 carbon atoms. When the acrylic polymer (A) is produced by radiation polymerization or the like, the alkyl group is more preferably carbon number 12-18, more preferably carbon number 14-18. Furthermore, even if the Tg of the homopolymer of alkyl (meth)acrylate is -80 to 0°C, if the alkyl group is straight chain or the number of carbon atoms is 9 or less, the adhesive composition will be reduced in high frequency band. The effect of increasing the dielectric constant and reducing the dielectric loss is also small.

作為(甲基)丙烯酸烷基酯(A1),例如可例示:丙烯酸異癸酯(碳數10,均聚物之Tg=-60℃,以下簡記為Tg)、甲基丙烯酸異癸酯(碳數10,Tg=-41℃)、丙烯酸異肉豆蔻酯(碳數14,Tg=-56℃)、丙烯酸異硬脂酯(碳數18,Tg=-18℃)、丙烯酸2-丙基庚酯、丙烯酸異十一烷基酯、丙烯酸異十二烷基酯、丙烯酸異十三烷基酯、丙烯酸異十五烷基酯、丙烯酸異十六烷基酯、丙烯酸異十七烷基酯、及上述例示之甲基丙烯酸酯系單體。(甲基)丙烯酸烷基酯(A1)可單獨使用1種或可組合使用2種以上。Examples of the alkyl (meth)acrylate (A1) include isodecyl acrylate (10 carbon atoms, Tg of homopolymer = -60°C, hereinafter abbreviated as Tg), isodecyl methacrylate (carbon number 10, Tg=-41℃), isomyristyl acrylate (carbon number 14, Tg=-56℃), isostearyl acrylate (carbon number 18, Tg=-18℃), 2-propylheptyl acrylate esters, isoundecyl acrylate, isododecyl acrylate, isotridecyl acrylate, isopentadecyl acrylate, isohexadecyl acrylate, isoheptadecyl acrylate, and the methacrylate-based monomers exemplified above. Alkyl (meth)acrylate (A1) may be used alone or in combination of two or more.

又,於上述碳數10~24之支鏈狀之烷基中,認為於酯基之末端具有第三丁基等支鏈狀之烷基者尤其可獲得莫耳體積增加、偶極矩減小、具有雙方之平衡之黏著劑組合物,於該方面而言較佳。又,就上述丙烯酸系聚合物(A)與下文所述之添加劑之相容性優異之方面而言亦較佳。作為於酯基之末端所具有之支鏈狀之烷基,較佳為第三丁基、新戊基、第三丁基等碳數4~6之支鏈狀之烷基,尤佳為第三丁基。作為於酯基之末端具有第三丁基之(甲基)丙烯酸烷基酯(A1)之較佳之例,可例舉下述式所表示之丙烯酸異硬脂酯。 [化1]

Figure 02_image001
In addition, among the above-mentioned branched alkyl groups having 10 to 24 carbon atoms, those having branched alkyl groups such as tertiary butyl groups at the end of the ester group are considered to be particularly capable of increasing the molar volume and decreasing the dipole moment. . Adhesive compositions with a balance of both are preferred in this respect. Moreover, it is also preferable at the point which is excellent in the compatibility of the said acrylic polymer (A) and the additive mentioned later. The branched alkyl group at the end of the ester group is preferably a branched alkyl group having 4 to 6 carbon atoms such as tert-butyl, neopentyl, and tert-butyl, and more preferably Tributyl. As a preferable example of the alkyl (meth)acrylate (A1) which has a tertiary butyl group at the terminal of an ester group, the isostearyl acrylate represented by the following formula is mentioned. [hua 1]
Figure 02_image001

又,作為(甲基)丙烯酸烷基酯(A1),甲基丙烯酸烷基酯與丙烯酸烷基酯相比,就藉由莫耳體積之增加與偶極矩之減小使黏著劑組合物於高頻帶下低介電常數化、低介電損失化的效果之方面而言較佳。另一方面,丙烯酸烷基酯與甲基丙烯酸烷基酯相比,就可縮短丙烯酸系聚合物(A)之聚合時間而提高生產性之方面而言較佳。尤其是於藉由輻射聚合使上述丙烯酸系聚合物(A)硬化之情形時,適宜為丙烯酸烷基酯。In addition, as the alkyl (meth)acrylate (A1), compared with the alkyl methacrylate, the molar volume is increased and the dipole moment is decreased by the increase in the molar volume and the decrease in the dipole moment. It is preferable in terms of the effect of lowering the dielectric constant and lowering the dielectric loss in the high frequency band. On the other hand, the acrylic acid alkyl ester is preferable in that the polymerization time of the acrylic polymer (A) can be shortened and the productivity can be improved compared with the methacrylic acid alkyl ester. In particular, when the above-mentioned acrylic polymer (A) is cured by radiation polymerization, alkyl acrylate is suitable.

丙烯酸系聚合物(A)之全部單體單元(構成丙烯酸系聚合物(A)之單體成分總量)中之上述(甲基)丙烯酸烷基酯(A1)之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%),較佳為3~60重量%,更佳為5~55重量%,進而較佳為10~50重量%。使用3重量%以上於高頻帶下之低介電常數化、低介電損失化之方面較佳,以60重量%以下使用於接著力、階差追隨性之維持之方面較佳。The content (ratio) of the above-mentioned alkyl (meth)acrylate (A1) in all monomer units of the acrylic polymer (A) (the total amount of monomer components constituting the acrylic polymer (A)) is not particularly Limited to the total amount (100% by weight) of the monomer components constituting the acrylic polymer (A), preferably 3 to 60% by weight, more preferably 5 to 55% by weight, and still more preferably 10 to 50% by weight %. It is preferable to use 3 wt % or more for low dielectric constant and low dielectric loss in high frequency band, and it is preferable to use 60 wt % or less for the maintenance of adhesive force and step followability.

甲基丙烯酸酯(A2)於酯部分具有碳數6以上之烴基。甲基丙烯酸酯(A2)中之上述碳數6以上之烴基可例舉:脂肪族基、含有脂環之基、含有芳香環之基。作為上述脂肪族基,可例舉直鏈或支鏈狀之脂肪族基。The methacrylate (A2) has a hydrocarbon group having 6 or more carbon atoms in the ester moiety. Examples of the hydrocarbon group having 6 or more carbon atoms in the methacrylate (A2) include an aliphatic group, an alicyclic group-containing group, and an aromatic ring-containing group. As said aliphatic group, a linear or branched aliphatic group is mentioned.

上述碳數6以上之烴基為脂肪族基之情形時之上述烴基中之碳數較佳為8以上,更佳為9以上,進而較佳為10以上。上述烴基中之碳數較佳為22以下,更佳為20以下,進而較佳為16以下。When the hydrocarbon group having 6 or more carbon atoms is an aliphatic group, the number of carbon atoms in the hydrocarbon group is preferably 8 or more, more preferably 9 or more, and still more preferably 10 or more. The number of carbon atoms in the hydrocarbon group is preferably 22 or less, more preferably 20 or less, and still more preferably 16 or less.

作為甲基丙烯酸酯(A2)中之上述碳數6以上之烴基為脂肪族基之甲基丙烯酸酯(A2),例如可例舉:甲基丙烯酸己酯、甲基丙烯酸庚酯、甲基丙烯酸辛酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸異辛酯、甲基丙烯酸壬酯、甲基丙烯酸異壬酯、甲基丙烯酸癸酯、甲基丙烯酸異癸酯、甲基丙烯酸十一烷基酯、甲基丙烯酸月桂酯、甲基丙烯酸十三烷基酯、甲基丙烯酸十四烷基酯、甲基丙烯酸十五烷基酯、甲基丙烯酸十六烷基酯、甲基丙烯酸十七烷基酯、甲基丙烯酸十八烷基酯、甲基丙烯酸異硬脂酯、甲基丙烯酸硬脂酯、甲基丙烯酸十九烷基酯、甲基丙烯酸二十烷基酯等甲基丙烯酸烷基酯。其中,較佳為甲基丙烯酸月桂酯、甲基丙烯酸十三烷基酯、甲基丙烯酸異癸酯。Examples of the methacrylate (A2) in which the hydrocarbon group having 6 or more carbon atoms in the methacrylate (A2) is an aliphatic group include, for example, hexyl methacrylate, heptyl methacrylate, and methacrylic acid. Octyl, 2-ethylhexyl methacrylate, isooctyl methacrylate, nonyl methacrylate, isononyl methacrylate, decyl methacrylate, isodecyl methacrylate, ten methacrylate Monoalkyl esters, lauryl methacrylate, tridecyl methacrylate, tetradecyl methacrylate, pentadecyl methacrylate, cetyl methacrylate, methacrylic acid Heptadecyl ester, octadecyl methacrylate, isostearyl methacrylate, stearyl methacrylate, nonadecyl methacrylate, eicosyl methacrylate and other methyl esters Alkyl Acrylate. Among them, lauryl methacrylate, tridecyl methacrylate, and isodecyl methacrylate are preferred.

上述碳數6以上之烴基為含有脂環之基之情形時之上述烴基中之碳數較佳為8以上,更佳為10以上。上述烴基中之碳數較佳為22以下,更佳為16以下。When the hydrocarbon group having 6 or more carbon atoms is a group containing an alicyclic ring, the number of carbon atoms in the hydrocarbon group is preferably 8 or more, more preferably 10 or more. The number of carbon atoms in the hydrocarbon group is preferably 22 or less, more preferably 16 or less.

作為甲基丙烯酸酯(A2)中之上述碳數6以上之烴基為含有脂環之基之甲基丙烯酸酯(A2),例如可例舉:具有環烷烴環(環戊烷環、環己烷環、環庚烷環、環辛烷環等)之甲基丙烯酸環烷基酯、具有二環式烴環(蒎烷環、蒎烯環、𦯉烷環、降𦯉烷環、降𦯉烯環等)之甲基丙烯酸酯、具有三環以上之脂肪族烴環(二環戊烷環、二環戊烯環、金剛烷環、三環戊烷環、三環戊烯環等)之甲基丙烯酸酯等。The above-mentioned hydrocarbon group having 6 or more carbon atoms in the methacrylate (A2) is a methacrylate (A2) containing an alicyclic group, for example, those having a cycloalkane ring (cyclopentane ring, cyclohexane ring) Cycloalkyl methacrylate of ring, cycloheptane ring, cyclooctane ring, etc.), having a bicyclic hydrocarbon ring (pinane ring, pinene ring, alkane ring, noralkane ring, noralkene ring methacrylates, etc.), methyl groups having aliphatic hydrocarbon rings with three or more rings (dicyclopentane, dicyclopentene, adamantane, tricyclopentane, tricyclopentene, etc.) Acrylate etc.

作為上述甲基丙烯酸環烷基酯,例如可例舉:甲基丙烯酸環己酯、甲基丙烯酸3,3,5-三甲基環己酯、甲基丙烯酸環庚酯、甲基丙烯酸環辛酯等。作為上述具有二環式烴環之甲基丙烯酸酯,例如可例舉:甲基丙烯酸𦯉基酯、甲基丙烯酸異𦯉基酯等甲基丙烯酸烷基酯。作為上述具有三環以上之烴環之甲基丙烯酸酯,例如可例舉:甲基丙烯酸二環戊酯、甲基丙烯酸二環戊氧基乙酯、甲基丙烯酸三環戊酯、甲基丙烯酸1-金剛烷基酯、甲基丙烯酸2-甲基-2-金剛烷基酯、甲基丙烯酸2-乙基-2-金剛烷基酯等甲基丙烯酸烷基酯。As said cycloalkyl methacrylate, for example, cyclohexyl methacrylate, 3,3,5-trimethylcyclohexyl methacrylate, cycloheptyl methacrylate, and cyclooctyl methacrylate may be mentioned. esters, etc. As a methacrylate which has the said bicyclic hydrocarbon ring, alkyl methacrylates, such as methacrylate, methacrylate, and iso-xyl methacrylate, are mentioned, for example. As the methacrylate having the above-mentioned hydrocarbon ring having three or more rings, for example, dicyclopentyl methacrylate, dicyclopentyloxyethyl methacrylate, tricyclopentyl methacrylate, methacrylic acid may be mentioned. Alkyl methacrylates such as 1-adamantyl ester, 2-methyl-2-adamantyl methacrylate, 2-ethyl-2-adamantyl methacrylate, etc.

上述碳數6以上之烴基為含有芳香環之基之情形時上述烴基中之碳數較佳為6~14,更佳為6~10。When the hydrocarbon group having 6 or more carbon atoms is a group containing an aromatic ring, the number of carbon atoms in the hydrocarbon group is preferably 6-14, more preferably 6-10.

作為甲基丙烯酸酯(A2)中之上述碳數6以上之烴基為含有芳香環之基的甲基丙烯酸酯(A2),例如可例舉具有芳香族性碳環(例如苯環等單環碳環、或萘環等縮合碳環等)之化合物,具體而言,可例舉:甲基丙烯酸苄酯、甲基丙烯酸苯酯、甲基丙烯酸萘酯、甲基丙烯酸6-(1,1'-聯苯-4-基氧基)己酯等甲基丙烯酸酯。As the methacrylate (A2) in which the hydrocarbon group having 6 or more carbon atoms in the methacrylate (A2) is a group containing an aromatic ring, for example, an aromatic carbocyclic ring (for example, a monocyclic carbon such as a benzene ring) may be mentioned. ring, or condensed carbocyclic ring such as naphthalene ring, etc.), specifically, benzyl methacrylate, phenyl methacrylate, naphthyl methacrylate, 6-(1,1' methacrylate) - Methacrylates such as biphenyl-4-yloxy)hexyl ester.

甲基丙烯酸酯(A2)可具有(聚)氧伸烷基鏈。於具有(聚)氧伸烷基鏈之情形時,上述碳數6以上之烴基較佳為存在於甲基丙烯酸酯(A2)中之酯部末端。上述(聚)氧伸烷基鏈中之氧原子數(即氧伸烷基之重複數)較佳為1~10,更佳為1~3。上述末端所具有之碳數6以上之烴基可為脂肪族基、脂環式基、芳香族基之任一者,較佳為脂環式基或芳香族基。The methacrylate (A2) may have a (poly)oxyalkylene chain. In the case of having a (poly)oxyalkylene chain, it is preferable that the above-mentioned hydrocarbon group having 6 or more carbon atoms is the terminal of the ester moiety present in the methacrylate (A2). The number of oxygen atoms in the (poly)oxyalkylene chain (that is, the number of repetitions of the oxyalkylene group) is preferably 1-10, more preferably 1-3. The hydrocarbon group having 6 or more carbon atoms at the terminal may be any of an aliphatic group, an alicyclic group, and an aromatic group, preferably an alicyclic group or an aromatic group.

作為具有(聚)氧伸烷基鏈及上述碳數6以上之烴基之甲基丙烯酸酯(A2),例如可例舉甲基丙烯酸2-苯氧基乙酯等。As a methacrylate (A2) which has a (poly)oxyalkylene chain and the said C6 or more hydrocarbon group, 2-phenoxyethyl methacrylate etc. are mentioned, for example.

丙烯酸系聚合物(A)之全部單體單元(構成丙烯酸系聚合物(A)之單體成分總量)中之上述甲基丙烯酸酯(A2)之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%),較佳為10重量%以上(例如10~99.9重量%),更佳為15重量%以上(例如15~99.7重量%),進而較佳為20重量%以上(例如20~99.5重量%)。使用15重量%以上於高頻帶下之低介電常數化、低介電損失化之方面較佳。使用99.9重量%以下於接著力、階差追隨性之維持之方面較佳。The content (ratio) of the above-mentioned methacrylate (A2) in all the monomer units of the acrylic polymer (A) (the total amount of the monomer components constituting the acrylic polymer (A)) is not particularly limited, and relative to the The total amount (100% by weight) of the monomer components constituting the acrylic polymer (A) is preferably 10% by weight or more (for example, 10 to 99.9% by weight), more preferably 15% by weight or more (for example, 15 to 99.7% by weight) ), and more preferably 20% by weight or more (for example, 20 to 99.5% by weight). It is preferable to use 15 wt % or more in terms of low dielectric constant and low dielectric loss in high frequency bands. It is preferable to use 99.9% by weight or less in order to maintain the adhesion and step followability.

丙烯酸系聚合物(A)之全部單體單元(構成丙烯酸系聚合物(A)之單體成分總量)中之上述(甲基)丙烯酸烷基酯(A1)及上述甲基丙烯酸酯(A2)之合計之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%),較佳為3~99.9重量%,更佳為5~99.7重量%,進而較佳為10~99.5重量%。使用3重量%以上於高頻帶下之低介電常數化、低介電損失化之方面較佳,使用99.9重量%以下於接著力、階差追隨性之維持之方面較佳。The above-mentioned alkyl (meth)acrylate (A1) and the above-mentioned methacrylate (A2) in the total monomer units of the acrylic polymer (A) (the total amount of the monomer components constituting the acrylic polymer (A)) ) of the total content (ratio) is not particularly limited, but is preferably 3 to 99.9 wt %, more preferably 5 to 99.7 wt % with respect to the total amount (100 wt %) of the monomer components constituting the acrylic polymer (A). % by weight, more preferably 10 to 99.5% by weight. It is preferable to use 3 wt % or more in terms of low dielectric constant and dielectric loss in high frequency bands, and 99.9 wt % or less is preferable in terms of maintaining adhesion and step followability.

丙烯酸系聚合物(A)可除了含有(甲基)丙烯酸烷基酯(A1)及/或甲基丙烯酸酯(A2)以外,或取代(甲基)丙烯酸烷基酯(A1)及/或甲基丙烯酸酯(A2),而含有(甲基)丙烯酸烷基酯(A1)及甲基丙烯酸酯(A2)以外之(甲基)丙烯酸烷基酯(以下有時稱為「(甲基)丙烯酸烷基酯(B)」)作為單體成分。藉由含有(甲基)丙烯酸烷基酯(B),可調整丙烯酸系聚合物(A)本身之Tg,調節由本發明之黏著劑組合物所形成之黏著劑層之凝集力及接著力,又,可提高應力緩和性,改善階差追隨性。Acrylic polymer (A) may contain (meth)acrylic acid alkyl ester (A1) and/or methacrylic acid ester (A2) in addition to, or substituted (meth)acrylic acid alkyl ester (A1) and/or methyl acrylate acrylic acid ester (A2), and contains (meth)acrylic acid alkyl ester other than (meth)acrylic acid alkyl ester (A1) and methacrylic acid ester (A2) (hereinafter sometimes referred to as "(meth)acrylic acid) Alkyl ester (B)") as a monomer component. By containing the alkyl (meth)acrylate (B), the Tg of the acrylic polymer (A) itself can be adjusted, the cohesive force and the adhesive force of the adhesive layer formed by the adhesive composition of the present invention can be adjusted, and the , which can improve stress relaxation and step follow-up.

作為上述(甲基)丙烯酸烷基酯(B),可例舉:具有碳數為1~24之直鏈狀之烷基之丙烯酸烷基酯、具有碳數為3~9之支鏈狀之烷基之丙烯酸烷基酯、具有碳數為1~5之直鏈狀之烷基之甲基丙烯酸烷基酯、具有碳數為3~5之支鏈狀之烷基之甲基丙烯酸烷基酯,就實現本發明之黏著劑組合物之於高頻帶下之低介電常數、低介電損失之觀點而言,較佳為具有碳數為10~24之直鏈狀之烷基之丙烯酸烷基酯。(甲基)丙烯酸烷基酯(B)可單獨使用1種或可組合使用2種以上。Examples of the above-mentioned alkyl (meth)acrylate (B) include alkyl acrylates having a linear alkyl group having 1 to 24 carbon atoms, and alkyl acrylates having a branched chain having 3 to 9 carbon atoms. Alkyl acrylate having an alkyl group, alkyl methacrylate having a straight-chain alkyl group having 1 to 5 carbon atoms, and alkyl methacrylate having a branched alkyl group having a carbon number of 3 to 5 Esters, from the viewpoint of realizing low dielectric constant and low dielectric loss in high frequency bands of the adhesive composition of the present invention, are preferably acrylic acid having a linear alkyl group having 10 to 24 carbon atoms Alkyl esters. Alkyl (meth)acrylate (B) may be used alone or in combination of two or more.

作為上述具有碳數為1~24之直鏈狀之烷基之丙烯酸烷基酯,可例舉:丙烯酸甲酯、丙烯酸乙酯、丙烯酸丙酯、丙烯酸丁酯(丙烯酸正丁酯)、丙烯酸戊酯、丙烯酸己酯、丙烯酸庚酯、丙烯酸辛酯、丙烯酸壬酯、丙烯酸癸酯、丙烯酸十一烷基酯、丙烯酸十二烷基酯、丙烯酸十三烷基酯、丙烯酸十四烷基酯、丙烯酸十五烷基酯、丙烯酸十六烷基酯、丙烯酸十七烷基酯、丙烯酸十八烷基酯、丙烯酸十九烷基酯、丙烯酸二十烷基酯等。Examples of the above-mentioned alkyl acrylate having a linear alkyl group having 1 to 24 carbon atoms include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate (n-butyl acrylate), and amyl acrylate. ester, hexyl acrylate, heptyl acrylate, octyl acrylate, nonyl acrylate, decyl acrylate, undecyl acrylate, dodecyl acrylate, tridecyl acrylate, tetradecyl acrylate, Pentadecyl acrylate, hexadecyl acrylate, heptadecyl acrylate, octadecyl acrylate, nonadecyl acrylate, eicosyl acrylate, etc.

作為具有碳數為3~9之支鏈狀之烷基之丙烯酸烷基酯,可例舉:丙烯酸異丙酯、丙烯酸異丁酯、丙烯酸第二丁酯、丙烯酸第三丁酯、丙烯酸異戊酯、丙烯酸2-乙基己酯、丙烯酸異辛酯、丙烯酸異壬酯等。Examples of the alkyl acrylate having a branched alkyl group having 3 to 9 carbon atoms include isopropyl acrylate, isobutyl acrylate, 2-butyl acrylate, 3-butyl acrylate, and isoamyl acrylate. ester, 2-ethylhexyl acrylate, isooctyl acrylate, isononyl acrylate, etc.

作為上述具有碳數為1~5之直鏈狀之烷基之甲基丙烯酸烷基酯,可例舉:甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸丁酯(甲基丙烯酸正丁酯)、甲基丙烯酸戊酯等。作為上述具有碳數為3~5之支鏈狀之烷基之甲基丙烯酸烷基酯,可例舉:甲基丙烯酸異丙酯、甲基丙烯酸異丁酯、甲基丙烯酸第二丁酯、甲基丙烯酸第三丁酯、甲基丙烯酸異戊酯等。Examples of the alkyl methacrylate having a linear alkyl group having 1 to 5 carbon atoms include methyl methacrylate, ethyl methacrylate, propyl methacrylate, and butyl methacrylate. ester (n-butyl methacrylate), amyl methacrylate, etc. Examples of the alkyl methacrylate having a branched alkyl group having 3 to 5 carbon atoms include isopropyl methacrylate, isobutyl methacrylate, second butyl methacrylate, Tertiary butyl methacrylate, isoamyl methacrylate, etc.

(甲基)丙烯酸烷基酯(B)之均聚物之Tg並無特別限定,較佳為-100℃以上(例如-100~150℃),更佳為-90~140℃,進而較佳為-90~120℃。又,上述均聚物之Tg可為-30℃以下,亦可為-40℃以下。若均聚物之Tg為-100℃以上,則可抑制黏著劑層於常溫下之彈性模數過度降低。藉由將均聚物之Tg較高之(甲基)丙烯酸烷基酯(B)與丙烯酸系聚合物(A)混合使用,可調整黏著劑層之凝集力及接著力,且可適當賦予應力緩和性或階差追隨性。The Tg of the homopolymer of the alkyl (meth)acrylate (B) is not particularly limited, but is preferably -100°C or higher (for example, -100 to 150°C), more preferably -90 to 140°C, and still more preferably It is -90~120℃. Moreover, the Tg of the said homopolymer may be -30 degrees C or less, and may be -40 degrees C or less. If the Tg of the homopolymer is -100° C. or higher, the elastic modulus of the adhesive layer at room temperature can be suppressed from being excessively lowered. By mixing the alkyl (meth)acrylate (B) with a high homopolymer Tg with the acrylic polymer (A), the cohesive force and adhesive force of the adhesive layer can be adjusted, and stress can be appropriately imparted Ease or step following.

其中,作為上述(甲基)丙烯酸烷基酯(B),就改善黏著劑層之應力緩和性而調整階差追隨性之方面而言,較佳為具有碳數為6~9之支鏈狀之烷基之丙烯酸烷基酯,更佳為具有碳數為7~9之支鏈狀之烷基之丙烯酸烷基酯,尤佳為丙烯酸2-乙基己酯(碳數8之支鏈狀烷基,Tg=-70℃)。又,就於高頻帶下之低介電常數化、低介電損失化之觀點而言,較佳為具有烷基之碳數為8~24之直鏈狀之烷基之丙烯酸烷基酯,更佳為具有烷基之碳數為10~24之直鏈狀之烷基之丙烯酸烷基酯,尤佳為丙烯酸月桂酯(碳數12之直鏈狀烷基,Tg=-50℃)。Among them, the alkyl (meth)acrylate (B) preferably has a branched chain having 6 to 9 carbon atoms in terms of improving the stress relaxation properties of the adhesive layer and adjusting the step followability. The alkyl acrylate of the alkyl group is more preferably an alkyl acrylate having a branched alkyl group with a carbon number of 7 to 9, especially 2-ethylhexyl acrylate (branched chain with a carbon number of 8). alkyl, Tg=-70°C). In addition, from the viewpoint of lowering the dielectric constant and lowering the dielectric loss in high frequency bands, alkyl acrylates having a linear alkyl group having 8 to 24 carbon atoms in the alkyl group are preferred, More preferably, it is an alkyl acrylate having a linear alkyl group having an alkyl group of 10 to 24 carbon atoms, and particularly preferably lauryl acrylate (a linear alkyl group having 12 carbon atoms, Tg=-50°C).

又,作為(甲基)丙烯酸烷基酯(B),甲基丙烯酸烷基酯與丙烯酸烷基酯相比,就藉由莫耳體積之增加與偶極矩之減小使黏著劑層於高頻帶下低介電常數化、低介電損失化之效果之方面而言較佳。另一方面,丙烯酸烷基酯與甲基丙烯酸烷基酯相比,就可縮短丙烯酸系聚合物(A)之聚合時間而提高生產性之方面而言較佳。尤其是於藉由輻射聚合使上述丙烯酸系聚合物(A)硬化之情形時,適宜為丙烯酸烷基酯。In addition, as the alkyl (meth)acrylate (B), compared with the alkyl acrylate, the molar volume is increased and the dipole moment is decreased by the increase in the molar volume and the decrease in the dipole moment. It is preferable in terms of the effect of lowering the dielectric constant and lowering the dielectric loss in the frequency band. On the other hand, the acrylic acid alkyl ester is preferable in that the polymerization time of the acrylic polymer (A) can be shortened and the productivity can be improved compared with the methacrylic acid alkyl ester. In particular, when the above-mentioned acrylic polymer (A) is cured by radiation polymerization, alkyl acrylate is suitable.

丙烯酸系聚合物(A)之全部單體單元(構成丙烯酸系聚合物(A)之單體成分總量)中之上述(甲基)丙烯酸烷基酯(B)之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%),較佳為1重量%以上(例如1~95重量%),更佳為3~93重量%,進而較佳為10~90重量%,尤佳為20~85重量%。使用1重量%以上於接著力、階差追隨性、高頻帶(28~60 GHz)下之低介電常數化、低介電損失之方面較佳。The content (ratio) of the above-mentioned alkyl (meth)acrylate (B) in all the monomer units of the acrylic polymer (A) (the total amount of monomer components constituting the acrylic polymer (A)) is not particularly It is limited to preferably 1% by weight or more (for example, 1 to 95% by weight), more preferably 3 to 93% by weight, relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer (A), and further It is preferably 10 to 90% by weight, particularly preferably 20 to 85% by weight. It is preferable to use 1 wt % or more in terms of adhesive force, step followability, low dielectric constant in high frequency band (28 to 60 GHz), and low dielectric loss.

丙烯酸系聚合物(A)之全部單體單元(構成丙烯酸系聚合物(A)之單體成分總量)中之具有碳數為1~24之直鏈狀之烷基的丙烯酸烷基酯(更佳為具有烷基之碳數為10~24之直鏈狀之烷基之丙烯酸烷基酯)及具有碳數為1~5之直鏈狀之烷基的甲基丙烯酸烷基酯之合計之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%),較佳為0.1重量%以上(例如0.1~97重量%),更佳為1~95重量%,進而較佳為3~90重量%,進而較佳為10~80重量%,進而較佳為15~75重量%,尤佳為20~70重量%。使用0.1重量%以上於高頻帶(28~60 GHz)下之低介電常數化、低介電損失之方面較佳。Alkyl acrylate ( More preferably, it is the sum of alkyl acrylate having a straight-chain alkyl group having an alkyl group of 10 to 24 carbon atoms) and alkyl methacrylate having a straight-chain alkyl group having a carbon number of 1 to 5 The content (ratio) is not particularly limited, but is preferably 0.1% by weight or more (for example, 0.1 to 97% by weight) relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer (A), more preferably It is 1-95 weight%, More preferably, it is 3-90 weight%, More preferably, it is 10-80 weight%, More preferably, it is 15-75 weight%, Especially preferably, it is 20-70 weight%. It is preferable to use 0.1 wt% or more in terms of low dielectric constant and low dielectric loss in high frequency band (28 to 60 GHz).

丙烯酸系聚合物(A)之全部單體單元(構成丙烯酸系聚合物(A)之單體成分總量)中之上述具有碳數為3~9之支鏈狀的烷基之丙烯酸烷基酯(較佳為具有碳數為6~9之支鏈狀之烷基之丙烯酸烷基酯)及具有碳數為3~5之支鏈狀之烷基的甲基丙烯酸烷基酯之合計之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%),較佳為0.1重量%以上(例如0.1~80重量%),更佳為1~70重量%,進而較佳為3~60重量%,進而較佳為10~60重量%,尤佳為20~50重量%。使用0.1重量%以上於接著力、階差追隨性之方面較佳。The above-mentioned alkyl acrylate having a branched alkyl group having 3 to 9 carbon atoms in all monomer units of the acrylic polymer (A) (the total amount of monomer components constituting the acrylic polymer (A)) (Preferably, the alkyl acrylate having a branched alkyl group having a carbon number of 6 to 9) and the total content of the alkyl methacrylate having a branched alkyl group having a carbon number of 3 to 5 (Ratio) is not particularly limited, but is preferably 0.1% by weight or more (for example, 0.1 to 80% by weight), more preferably 1, with respect to the total amount (100% by weight) of the monomer components constituting the acrylic polymer (A). -70 wt%, more preferably 3 to 60 wt%, still more preferably 10 to 60 wt%, particularly preferably 20 to 50 wt%. It is preferable to use 0.1% by weight or more in terms of adhesive force and step followability.

丙烯酸系聚合物(A)中,作為單體單元,除了上述(甲基)丙烯酸烷基酯(A1)、上述甲基丙烯酸酯(A2)、上述(甲基)丙烯酸烷基酯(B)以外,亦可含有可共聚合之單體(共聚性單體)。即,丙烯酸系聚合物(A)亦可含有共聚性單體作為構成之單體成分。再者,共聚性單體可單獨使用或組合使用2種以上。In the acrylic polymer (A), as monomer units, other than the above-mentioned alkyl (meth)acrylate (A1), the above-mentioned methacrylate (A2), and the above-mentioned alkyl (meth)acrylate (B) , and may also contain copolymerizable monomers (comonomers). That is, the acrylic polymer (A) may contain a copolymerizable monomer as a constituent monomer component. In addition, a comonomer can be used individually or in combination of 2 or more types.

作為上述共聚性單體,可例舉含羥基之單體。若丙烯酸系聚合物(A)含有含羥基之單體作為單體單元,則於使構成之單體成分進行聚合時容易使其聚合,又,容易獲得良好之凝集力。因此,容易獲得強接著性,又,容易增大凝膠分率而獲得優異之耐發泡剝離性。進而,容易抑制存在於高濕環境下產生之情況之黏著片材之白化。另一方面,若丙烯酸系聚合物(A)大量含有含羥基之單體作為單體單元,則於高頻帶下之介電常數、介電損失有提高之傾向。As said copolymerizable monomer, the monomer containing a hydroxyl group is mentioned. When the acrylic polymer (A) contains a hydroxyl group-containing monomer as a monomer unit, it is easy to polymerize the monomer components constituting the polymer, and it is easy to obtain a good cohesive force. Therefore, it is easy to obtain strong adhesiveness, and it is easy to increase the gel fraction to obtain excellent resistance to foaming and peeling. Furthermore, it is easy to suppress the whitening of the adhesive sheet that occurs in a high-humidity environment. On the other hand, when the acrylic polymer (A) contains a large amount of a hydroxyl group-containing monomer as a monomer unit, the dielectric constant and dielectric loss in a high frequency band tend to increase.

相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%)的上述含羥基之單體之含量(比率)並無特別限定。若含羥基之單體之量為一定以上,則因凝集力而容易獲得接著性、耐發泡剝離性等接著可靠性。上述含羥基之單體之含量較佳為0.01重量%以上,更佳為0.05重量%以上,進而較佳為0.1重量%以上,進而更佳為0.5重量%以上,尤佳為1重量%以上。又,上述含羥基之單體之含量就實現高頻帶下之低介電常數、低介電損失之方面而言,較佳為30重量%以下,更佳為25重量%以下,進而較佳為20重量%以下,尤佳為15重量%以下。又,於本發明之若干實施形態中,上述丙烯酸系聚合物(A)亦可不含有含羥基之單體。The content (ratio) of the above-mentioned hydroxyl group-containing monomer with respect to the total amount (100% by weight) of the monomer components constituting the acrylic polymer (A) is not particularly limited. When the amount of the hydroxyl group-containing monomer is a certain value or more, adhesion reliability such as adhesiveness and foaming peeling resistance can be easily obtained due to the cohesive force. The content of the hydroxyl group-containing monomer is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, still more preferably 0.1% by weight or more, still more preferably 0.5% by weight or more, and particularly preferably 1% by weight or more. In addition, the content of the above-mentioned hydroxyl group-containing monomer is preferably 30 wt % or less, more preferably 25 wt % or less, and still more preferably 30 wt % or less, in terms of realizing low dielectric constant and low dielectric loss in high frequency bands. 20% by weight or less, particularly preferably 15% by weight or less. Moreover, in some embodiment of this invention, the said acrylic polymer (A) may not contain the monomer containing a hydroxyl group.

進而,作為上述共聚性單體,可例舉含氮原子之單體。若丙烯酸系聚合物(A)含有含氮原子之單體作為單體單元,則容易獲得適度之凝集力。因此,容易增大對玻璃板之180°(度)剝離接著力及對丙烯酸系樹脂板之180°剝離接著力,獲得強接著性,又,容易增大凝膠分率而獲得優異之耐發泡剝離性。進而,黏著劑層容易獲得適度之柔軟性,容易將300%拉伸殘留應力調整為特定之範圍內,而獲得優異之應力緩和性及優異之階差追隨性。再者,下文揭示之防銹劑針對單體之溶解性具有選擇性,例如,作為防銹劑之一之苯并三唑系化合物對含氮原子之單體具有良好之溶解性。Furthermore, as said copolymerizable monomer, the monomer containing a nitrogen atom is mentioned. When the acrylic polymer (A) contains a nitrogen atom-containing monomer as a monomer unit, an appropriate cohesive force is easily obtained. Therefore, it is easy to increase the 180° (degree) peel adhesion force to the glass plate and the 180° peel adhesion force to the acrylic resin plate to obtain strong adhesion, and it is easy to increase the gel fraction to obtain excellent hair resistance. Foam peelability. Furthermore, the adhesive layer is easy to obtain moderate flexibility, and it is easy to adjust the 300% tensile residual stress within a specific range, so that excellent stress relaxation and excellent step followability are obtained. Furthermore, the rust inhibitor disclosed below is selective with respect to the solubility of the monomer, for example, the benzotriazole-based compound, which is one of the rust inhibitors, has good solubility for the monomer containing nitrogen atom.

於上述丙烯酸系聚合物(A)含有上述含氮原子之單體作為構成聚合物之單體成分之情形時,上述構成丙烯酸系聚合物(A)之全部單體成分(100重量%)中之上述含氮原子之單體之比率並無特別限定,較佳為1重量%以上,更佳為3重量%以上,進而較佳為5重量%以上。若上述比率為1重量%以上,則就容易獲得良好之凝集力、容易獲得高溫下之接著可靠性之觀點而言較佳。進而,可進一步提高高濕環境下之白濁化之抑制與耐久性,可獲得針對被接著體之更高之接著可靠性而較佳。又,上述含氮原子之單體之比率就獲得具有適度之柔軟性之黏著劑層之方面、獲得透明性優異之黏著劑層之方面而言,較佳為30重量%以下,更佳為25重量%以下,進而較佳為20重量%以下,進而更佳為15重量%以下,尤佳為10重量%以下。When the above-mentioned acrylic polymer (A) contains the above-mentioned nitrogen atom-containing monomer as a monomer component constituting the polymer, among the above-mentioned all monomer components (100% by weight) constituting the acrylic polymer (A) The ratio of the nitrogen atom-containing monomer is not particularly limited, but is preferably 1% by weight or more, more preferably 3% by weight or more, and still more preferably 5% by weight or more. If the said ratio is 1 weight% or more, it is preferable from a viewpoint that favorable cohesion force is easy to be obtained, and the adhesion reliability at high temperature is easy to be obtained. Furthermore, the suppression and durability of cloudiness in a high-humidity environment can be further improved, and higher bonding reliability with respect to the adherend can be obtained, which is preferable. In addition, the ratio of the above-mentioned nitrogen atom-containing monomer is preferably 30% by weight or less, more preferably 25% by weight, in terms of obtaining an adhesive layer having moderate flexibility and obtaining an adhesive layer having excellent transparency. % by weight or less, more preferably 20% by weight or less, still more preferably 15% by weight or less, particularly preferably 10% by weight or less.

進而,作為上述共聚性單體,可例舉含脂環結構之單體。若丙烯酸系聚合物(A)含有含脂環結構之單體作為單體單元,則容易獲得適度之凝集力。因此,容易增大對玻璃板之180°(度)剝離接著力及對丙烯酸系樹脂板之180°剝離接著力,獲得強接著性,又,容易增大凝膠分率而獲得優異之耐發泡剝離性。進而,黏著劑層容易獲得適度之柔軟性,容易將300%拉伸殘留應力調整為特定之範圍內,而獲得優異之應力緩和性及優異之階差追隨性。Furthermore, as said copolymerizable monomer, the monomer containing an alicyclic structure can be mentioned. When the acrylic polymer (A) contains an alicyclic structure-containing monomer as a monomer unit, it is easy to obtain an appropriate cohesive force. Therefore, it is easy to increase the 180° (degree) peel adhesion force to the glass plate and the 180° peel adhesion force to the acrylic resin plate to obtain strong adhesion, and it is easy to increase the gel fraction to obtain excellent hair resistance. Foam peelability. Furthermore, the adhesive layer is easy to obtain moderate flexibility, and it is easy to adjust the 300% tensile residual stress within a specific range, so that excellent stress relaxation and excellent step followability are obtained.

於上述丙烯酸系聚合物(A)含有上述含脂環結構之單體作為構成聚合物之單體成分之情形時,上述構成丙烯酸系聚合物(A)之全部單體成分(100重量%)中之上述含脂環結構之單體之比率並無特別限定,就提高耐久性、獲得較高之接著可靠性之方面而言,較佳為1重量%以上,更佳為5重量%以上,進而較佳為10重量%以上。又,上述含脂環結構之單體之比率就獲得具有適度之柔軟性之黏著劑層之方面而言,較佳為50重量%以下,更佳為45重量%以下,進而較佳為40重量%以下,進而較佳為30重量%以下,進而較佳為25重量%以下,尤佳為20重量%以下。又,於本發明之若干實施形態中,上述丙烯酸系聚合物(A)亦可不含有含脂環結構之單體。When the above-mentioned acrylic polymer (A) contains the above-mentioned alicyclic structure-containing monomer as a monomer component constituting the polymer, in the total monomer components (100% by weight) constituting the above-mentioned acrylic polymer (A) The ratio of the above-mentioned alicyclic structure-containing monomer is not particularly limited, but from the viewpoint of improving durability and obtaining high bonding reliability, it is preferably 1% by weight or more, more preferably 5% by weight or more, and further Preferably it is 10 weight% or more. In addition, the ratio of the above-mentioned alicyclic structure-containing monomer is preferably 50 wt % or less, more preferably 45 wt % or less, and still more preferably 40 wt %, in terms of obtaining an adhesive layer having moderate flexibility. % or less, more preferably 30 wt % or less, still more preferably 25 wt % or less, particularly preferably 20 wt % or less. Moreover, in some embodiment of this invention, the said acrylic polymer (A) may not contain the monomer containing an alicyclic structure.

上述丙烯酸系聚合物(A)可藉由利用公知或慣用之聚合方法使上述單體單元(單體成分)聚合而獲得。作為上述丙烯酸系聚合物(A)之聚合方法,例如可例舉:溶液聚合方法、乳化聚合方法、塊狀聚合方法、利用活性能量線照射之聚合方法(活性能量線聚合方法)等。其中,就黏著劑層之透明性、耐水性、成本等方面而言,較佳為溶液聚合方法、活性能量線聚合方法,更佳為活性能量線聚合方法。The said acrylic polymer (A) can be obtained by polymerizing the said monomer unit (monomer component) by a well-known or usual polymerization method. As a polymerization method of the said acrylic polymer (A), a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by active energy ray irradiation (active energy ray polymerization method) etc. are mentioned, for example. Among them, in terms of transparency, water resistance, cost, and the like of the adhesive layer, a solution polymerization method and an active energy ray polymerization method are preferred, and an active energy ray polymerization method is more preferred.

作為於上述活性能量線聚合(光聚合)時所照射之活性能量線,例如可例舉:α射線、β射線、γ射線、中子射線、電子束等游離輻射或紫外線等,尤佳為紫外線。又,活性能量線之照射能量、照射時間、照射方法等並無特別限定,只要可使光聚合起始劑活化而發生單體成分之反應即可。Examples of active energy rays to be irradiated during the above-mentioned active energy ray polymerization (photopolymerization) include ionizing radiation such as alpha rays, beta rays, gamma rays, neutron rays, and electron beams, and ultraviolet rays, and ultraviolet rays are particularly preferred. . In addition, the irradiation energy, irradiation time, irradiation method, etc. of the active energy rays are not particularly limited, as long as the photopolymerization initiator can be activated to cause the reaction of the monomer components.

於上述丙烯酸系聚合物(A)之聚合時,可使用各種通常之溶劑。作為此種溶劑,例如可例舉:乙酸乙酯、乙酸正丁酯等酯類;甲苯、苯等芳香族烴類;正己烷、正庚烷等脂肪族烴類;環己烷、甲基環己烷等脂環式烴類;甲基乙基酮、甲基異丁基酮等酮類等有機溶劑。再者,溶劑可單獨使用或組合使用2種以上。In the polymerization of the above-mentioned acrylic polymer (A), various common solvents can be used. Examples of such solvents include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; Alicyclic hydrocarbons such as hexane; organic solvents such as ketones such as methyl ethyl ketone and methyl isobutyl ketone. In addition, a solvent can be used individually or in combination of 2 or more types.

又,於上述丙烯酸系聚合物(A)之聚合時,可根據聚合反應之種類使用熱聚合起始劑或光聚合起始劑(光起始劑)等聚合起始劑。再者,聚合起始劑可單獨使用或組合使用2種以上。Moreover, at the time of superposition|polymerization of the said acrylic polymer (A), a polymerization initiator, such as a thermal polymerization initiator and a photoinitiator (photoinitiator), can be used according to the kind of polymerization reaction. In addition, a polymerization initiator can be used individually or in combination of 2 or more types.

作為上述光聚合起始劑,並無特別限定,例如可例舉:安息香醚系光聚合起始劑、苯乙酮系光聚合起始劑、α-酮醇系光聚合起始劑、芳香族磺醯氯系光聚合起始劑、光活性肟系光聚合起始劑、安息香系光聚合起始劑、苯偶醯系光聚合起始劑、二苯甲酮系光聚合起始劑、縮酮系光聚合起始劑、9-氧硫𠮿

Figure 110135475-0000-3
系光聚合起始劑等。再者,光聚合起始劑可單獨使用或組合使用2種以上。It does not specifically limit as said photoinitiator, For example, benzoin ether type photoinitiator, acetophenone type photoinitiator, α-ketol type photoinitiator, aromatic Sulfonyl chloride-based photopolymerization initiator, photoactive oxime-based photopolymerization initiator, benzoin-based photopolymerization initiator, benzoin-based photopolymerization initiator, benzophenone-based photopolymerization initiator, condensate Ketone-based photopolymerization initiator, 9-oxysulfur 𠮿
Figure 110135475-0000-3
It is a photopolymerization initiator, etc. In addition, a photopolymerization initiator can be used individually or in combination of 2 or more types.

作為上述安息香醚系光聚合起始劑,例如可例舉:安息香甲醚、安息香乙醚、安息香丙醚、安息香異丙醚、安息香異丁醚、2,2-二甲氧基-1,2-二苯乙烷-1-酮、大茴香醚甲醚等。作為上述苯乙酮系光聚合起始劑,例如可例舉:2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、4-苯氧基二氯苯乙酮、4-(第三丁基)二氯苯乙酮等。作為上述α-酮醇系光聚合起始劑,例如可例舉:2-甲基-2-羥基苯丙酮、1-[4-(2-羥基乙基)苯基]-2-甲基丙烷-1-酮等。作為上述芳香族磺醯氯系光聚合起始劑,例如可例舉:2-萘磺醯氯等。作為上述光活性肟系光聚合起始劑,例如可例舉:1-苯基-1,1-丙二酮-2-(鄰乙氧基羰基)-肟等。作為上述安息香系光聚合起始劑,例如可例舉:安息香等。作為上述苯偶醯系光聚合起始劑,例如可例舉:苯偶醯等。作為上述二苯甲酮系光聚合起始劑,例如可例舉:二苯甲酮、苯甲醯苯甲酸、3,3'-二甲基-4-甲氧基二苯甲酮、聚乙烯基二苯甲酮、α-羥基環己基苯基酮等。作為上述縮酮系光聚合起始劑,例如可例舉:苯偶醯二甲基縮酮等。作為上述9-氧硫𠮿

Figure 110135475-0000-3
系光聚合起始劑,例如可例舉:9-氧硫𠮿
Figure 110135475-0000-3
、2-氯-9-氧硫𠮿
Figure 110135475-0000-3
、2-甲基-9-氧硫𠮿
Figure 110135475-0000-3
、2,4-二甲基-9-氧硫𠮿
Figure 110135475-0000-3
、異丙基-9-氧硫𠮿
Figure 110135475-0000-3
、2,4-二異丙基-9-氧硫𠮿
Figure 110135475-0000-3
、十二烷基-9-氧硫𠮿
Figure 110135475-0000-3
等。As said benzoin ether-based photopolymerization initiator, for example, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2- Diphenylethane-1-one, anisole, etc. As the above-mentioned acetophenone-based photopolymerization initiator, for example, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxy ring Hexyl phenyl ketone, 4-phenoxydichloroacetophenone, 4-(tert-butyl)dichloroacetophenone, etc. As the above-mentioned α-ketoalcohol-based photopolymerization initiator, for example, 2-methyl-2-hydroxypropiophenone, 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropane may be mentioned. -1-keto, etc. As said aromatic sulfonyl chloride-based photopolymerization initiator, 2-naphthalenesulfonyl chloride etc. are mentioned, for example. As said photoactive oxime type|system|group photoinitiator, 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime etc. are mentioned, for example. As said benzoin type photopolymerization initiator, benzoin etc. are mentioned, for example. As the above-mentioned benzil-based photopolymerization initiator, for example, benzil and the like may be mentioned. As the above-mentioned benzophenone-based photopolymerization initiator, for example, benzophenone, benzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyethylene benzophenone, α-hydroxycyclohexyl phenyl ketone, etc. As said ketal type photopolymerization initiator, benzalkonium dimethyl ketal etc. are mentioned, for example. As the above-mentioned 9-oxosulfur 𠮿
Figure 110135475-0000-3
It is a photopolymerization initiator, for example, 9-oxysulfur 𠮿
Figure 110135475-0000-3
, 2-chloro-9-oxysulfur
Figure 110135475-0000-3
, 2-methyl-9-oxothio
Figure 110135475-0000-3
, 2,4-dimethyl-9-oxothio
Figure 110135475-0000-3
, isopropyl-9-oxothioate
Figure 110135475-0000-3
, 2,4-diisopropyl-9-oxothio
Figure 110135475-0000-3
, dodecyl-9-oxysulfur
Figure 110135475-0000-3
Wait.

上述光聚合起始劑之使用量並無特別限定,例如相對於丙烯酸系聚合物(A)之全部單體單元(構成丙烯酸系聚合物(A)之單體成分總量)100重量份,較佳為0.001~1重量份,更佳為0.01~0.5重量份。The usage amount of the above-mentioned photopolymerization initiator is not particularly limited. It is preferably 0.001 to 1 part by weight, more preferably 0.01 to 0.5 part by weight.

又,作為上述熱聚合起始劑,並無特別限定,例如可例舉:偶氮系聚合起始劑、過氧化物系聚合起始劑(例如,過氧化二苯甲醯、過氧化馬來酸第三丁酯等)、氧化還原系聚合起始劑等。其中,較佳為日本專利特開2002-69411號公報所揭示之偶氮系聚合起始劑。作為上述偶氮系聚合起始劑,可例舉:2,2'-偶氮二異丁腈(以下有時稱為「AIBN」)、2,2'-偶氮雙-2-甲基丁腈(以下有時稱為「AMBN」)、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸等。Further, the thermal polymerization initiator is not particularly limited, and examples thereof include azo-based polymerization initiators, peroxide-based polymerization initiators (for example, dibenzyl peroxide, maleic peroxide, etc.) acid tert-butyl ester, etc.), redox-based polymerization initiators, and the like. Among them, the azo-based polymerization initiator disclosed in Japanese Patent Laid-Open No. 2002-69411 is preferable. As the above-mentioned azo-based polymerization initiator, 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as "AIBN"), 2,2'-azobis-2-methylbutyronitrile, Nitrile (hereinafter sometimes referred to as "AMBN"), 2,2'-azobis(2-methylpropionic acid) dimethyl ester, 4,4'-azobis-4-cyanovaleric acid, and the like.

上述熱聚合起始劑之使用量並無特別限定,例如於上述偶氮系聚合起始劑之情形時,相對於丙烯酸系聚合物(A)之全部單體單元(構成丙烯酸系聚合物(A)之單體成分總量)100重量份,較佳為0.05~0.5重量份,更佳為0.1~0.3重量份。The usage amount of the above-mentioned thermal polymerization initiator is not particularly limited. ) of the total amount of monomer components) 100 parts by weight, preferably 0.05 to 0.5 parts by weight, more preferably 0.1 to 0.3 parts by weight.

[1-2.含羧基之單體等] 於本發明之黏著劑組合物含有丙烯酸系聚合物(A)作為基礎聚合物之情形時,作為構成丙烯酸系聚合物(A)之單體成分,可含有含羧基之單體,較佳為實質上不含含羧基之單體。再者,「實質上不含」係指除了不可避免地混入的情形以外不主動調配。又,含羧基之單體意指分子內具有至少一個羧基之單體。就獲得更優異之防腐蝕效果之觀點而言,具體而言,含羧基之單體之含量相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%)而較佳為0.05重量%以下(例如,0~0.05重量%)、更佳為0.01重量%以下(例如,0~0.01重量%)、進而較佳為0.001重量%以下(例如,0~0.001重量%)者可認為實質上不含有。再者,作為上述含羧基之單體,例如可例舉:(甲基)丙烯酸、伊康酸、馬來酸、富馬酸、丁烯酸、異丁烯酸等。又,上述含羧基之單體中例如亦含有馬來酸酐、伊康酸酐等含酸酐基之單體。又,例如亦可為與伊康酸等酯鍵結而成之衍生物。 [1-2. Carboxyl group-containing monomer, etc.] When the adhesive composition of the present invention contains the acrylic polymer (A) as the base polymer, as the monomer component constituting the acrylic polymer (A), a carboxyl group-containing monomer may be contained, and a substantial amount is preferred. It does not contain carboxyl-containing monomers. In addition, "substantially not containing" means that it does not voluntarily mix unless it is unavoidably mixed. In addition, the carboxyl group-containing monomer means a monomer having at least one carboxyl group in the molecule. From the viewpoint of obtaining a more excellent anti-corrosion effect, specifically, the content of the carboxyl group-containing monomer is preferably 0.05 with respect to the total amount (100% by weight) of the monomer components constituting the acrylic polymer (A). % by weight or less (for example, 0 to 0.05 wt %), more preferably 0.01 wt % or less (for example, 0 to 0.01 wt %), and still more preferably 0.001 wt % or less (for example, 0 to 0.001 wt %) Essentially does not contain. In addition, as said carboxyl group-containing monomer, (meth)acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, etc. are mentioned, for example. Moreover, the monomer containing an acid anhydride group, such as maleic anhydride and itaconic anhydride, is also contained in the said carboxyl group-containing monomer, for example. Moreover, for example, the derivative|guide_body couple|bonded with esters, such as itonic acid, may be sufficient.

於本發明之黏著劑組合物含有丙烯酸系聚合物(A)作為基礎聚合物之情形時,進而就獲得更優異之防腐蝕效果之觀點而言,較佳為作為構成丙烯酸系聚合物(A)之單體成分,不僅實質上不含有含羧基之單體,而且作為構成丙烯酸系聚合物(A)之單體成分,實質上亦不含有具有羧基以外之酸性基(磺基、磷酸基等)之單體。即,丙烯酸系聚合物(A)較佳為作為構成之單體成分,實質上不含有含羧基之單體與具有其他酸性基之單體之任一者。具體而言,作為構成丙烯酸系聚合物(A)之單體成分之含羧基之單體及具有其他酸性基之單體之總量相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%)而較佳為0.05重量%以下(例如,0~0.05重量%)、更佳為0.01重量%以下(例如,0~0.01重量%)、進而較佳為0.001重量%以下(例如,0~0.001重量%)者可認為實質上不含有。When the adhesive composition of the present invention contains the acrylic polymer (A) as a base polymer, it is preferable to use the acrylic polymer (A) as the constituent acrylic polymer from the viewpoint of obtaining a more excellent anticorrosion effect. The monomer component does not substantially contain a carboxyl group-containing monomer, but also does not substantially contain an acidic group other than a carboxyl group (sulfo group, phosphoric acid group, etc.) as a monomer component constituting the acrylic polymer (A). of the monomer. That is, it is preferable that the acrylic polymer (A) does not substantially contain any of a carboxyl group-containing monomer and a monomer having another acidic group as a constituent monomer component. Specifically, the total amount of the carboxyl group-containing monomers and monomers having other acidic groups as the monomer components constituting the acrylic polymer (A) is relative to the total amount of the monomer components constituting the acrylic polymer (A) (100% by weight), preferably 0.05% by weight or less (for example, 0 to 0.05% by weight), more preferably 0.01% by weight or less (for example, 0 to 0.01% by weight), and still more preferably 0.001% by weight or less (for example, , 0 to 0.001% by weight) can be considered to be substantially not contained.

又,本發明之黏著劑組合物就同樣之觀點而言,較佳為作為構成丙烯酸系聚合物(A)以外之聚合物之單體成分,亦不含有或實質上不含有含酸性基之單體。例如,較佳為實質上不含含羧基之單體。再者,「實質上不含」之含義、較佳之程度、及具有羧基以外之酸性基之單體等與為構成丙烯酸系聚合物(A)之單體成分之情形相同。Furthermore, from the same viewpoint, the adhesive composition of the present invention preferably contains no or substantially no acid group-containing monomer as a monomer component constituting a polymer other than the acrylic polymer (A). body. For example, it is preferable that the carboxyl group-containing monomer is not substantially contained. In addition, the meaning of "substantially not containing", the preferable degree, the monomer which has an acidic group other than a carboxyl group, etc. are the same as the case of the monomer component which comprises an acrylic polymer (A).

[1-3.含鹼性基之單體] 再者,於本發明之黏著劑組合物含有丙烯酸系聚合物(A)作為基礎聚合物之情形時,作為構成丙烯酸系聚合物(A)之單體成分,較佳為不含有或實質上不含有含鹼性基之單體。又,作為構成丙烯酸系聚合物(A)以外之聚合物之單體成分,亦較佳為實質上不含有含鹼性基之單體,即便於不為構成各種聚合物之單體成分之情形時,較佳為上述黏著劑層中實質上不含有含鹼性基之單體之方面亦與含羧基之單體之情形相同。又,「實質上不含」之含義、較佳之程度等亦相同。 [1-3. Monomers containing basic groups] Furthermore, when the adhesive composition of the present invention contains the acrylic polymer (A) as a base polymer, it is preferable that the monomer component constituting the acrylic polymer (A) does not contain or substantially does not contain the acrylic polymer (A). Contains basic group-containing monomers. Moreover, it is also preferable that the monomer component constituting polymers other than the acrylic polymer (A) does not substantially contain a basic group-containing monomer, even if it is not a monomer component constituting various polymers When it is preferable that the said adhesive layer does not contain the monomer containing a basic group substantially, it is the same as the case of the monomer containing a carboxyl group. In addition, the meaning of "substantially does not contain", the preferable degree, etc. are also the same.

[1-4.含羥基之單體] 含羥基之單體意指分子內具有至少一個羥基之單體。又,分子內具有至少一個羥基且分子內具有至少一個羧基之單體為含羧基之單體,並非含羥基之單體。作為上述含羥基之單體,並無特別限定,具體而言,例如可例舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸羥基辛酯、(甲基)丙烯酸羥基癸酯、(甲基)丙烯酸羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)酯等含羥基之(甲基)丙烯酸酯;乙烯醇、烯丙醇等。其中,作為上述含羥基之單體,就容易獲得良好之凝集力、容易獲得高溫下之接著可靠性之觀點而言,較佳為含羥基之(甲基)丙烯酸酯,更佳為丙烯酸2-羥基乙酯(HEA)、(甲基)丙烯酸2-羥基丙酯(HPA)、丙烯酸4-羥基丁酯(4HBA)。再者,含羥基之單體可單獨使用或組合使用2種以上。 [1-4. Hydroxyl-containing monomer] The hydroxyl group-containing monomer means a monomer having at least one hydroxyl group in the molecule. Moreover, the monomer which has at least one hydroxyl group in a molecule|numerator and has at least one carboxyl group in a molecule|numerator is a monomer containing a carboxyl group, and is not a monomer containing a hydroxyl group. Although it does not specifically limit as said hydroxyl group-containing monomer, Specifically, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, -Hydroxybutyl, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, (meth)acrylate ) Hydroxydecyl acrylate, hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl) (meth)acrylate and other hydroxyl-containing (meth)acrylates; vinyl alcohol, allyl alcohol, etc. Among them, as the above-mentioned hydroxyl group-containing monomer, from the viewpoint of easily obtaining good cohesive force and easily obtaining adhesion reliability at high temperature, hydroxyl group-containing (meth)acrylates are preferred, and 2-acrylic acid is more preferred. Hydroxyethyl ester (HEA), 2-hydroxypropyl (meth)acrylate (HPA), 4-hydroxybutyl acrylate (4HBA). Furthermore, the hydroxyl group-containing monomer may be used alone or in combination of two or more.

[1-5.含氮原子之單體] 含氮原子之單體意指分子內(1分子內)具有至少一個氮原子之單體。但上述含羥基之單體不包括上述含氮原子之單體。即,於本說明書中,含氮原子之單體包括分子內具有羥基及氮原子之單體。又,分子內具有至少一個氮原子且分子內具有至少一個羧基之單體為含羧基之單體,並非含氮原子之單體。 [1-5. Monomers containing nitrogen atoms] The nitrogen atom-containing monomer means a monomer having at least one nitrogen atom in the molecule (in 1 molecule). However, the above-mentioned hydroxyl-containing monomer does not include the above-mentioned nitrogen atom-containing monomer. That is, in this specification, the monomer containing a nitrogen atom includes the monomer which has a hydroxyl group and a nitrogen atom in a molecule|numerator. Moreover, the monomer which has at least one nitrogen atom in a molecule|numerator and has at least one carboxyl group in a molecule|numerator is a monomer containing a carboxyl group, and is not a monomer containing a nitrogen atom.

作為上述含氮原子之單體,就提高耐發泡剝離性之觀點而言,較佳為N-乙烯基環狀醯胺、(甲基)丙烯醯胺類等。再者,含氮原子之單體可單獨使用或組合使用2種以上。As the above-mentioned nitrogen atom-containing monomer, N-vinyl cyclic amides, (meth)acrylamides and the like are preferred from the viewpoint of improving the foaming and peeling resistance. In addition, the monomer containing a nitrogen atom can be used individually or in combination of 2 or more types.

作為上述N-乙烯基環狀醯胺,就容易獲得良好之凝集力、容易獲得高溫下之接著可靠性之觀點而言,較佳為下述式(1)所表示之N-乙烯基環狀醯胺。 [化2]

Figure 02_image003
(式(1)中,R 1表示二價之有機基) The N-vinyl cyclic amide is preferably an N-vinyl cyclic amide represented by the following formula (1) from the viewpoint of easily obtaining a good cohesive force and easily obtaining adhesion reliability at high temperature as the N-vinyl cyclic amide amide. [hua 2]
Figure 02_image003
(In formula (1), R 1 represents a divalent organic group)

上述式(1)中之R 1為二價之有機基,較佳為二價之飽和烴基或不飽和烴基,更佳為二價之飽和烴基(例如,碳數3~5之伸烷基等)。 R 1 in the above formula (1) is a divalent organic group, preferably a divalent saturated hydrocarbon group or an unsaturated hydrocarbon group, more preferably a divalent saturated hydrocarbon group (for example, an alkylene group having 3 to 5 carbon atoms, etc. ).

作為上述式(1)所表示之N-乙烯基環狀醯胺,就進一步提高耐發泡剝離性、苯并三唑系化合物之相容性之觀點而言,較佳為N-乙烯基-2-吡咯啶酮(NVP)、N-乙烯基-2-哌啶酮、N-乙烯基-2-己內醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-乙烯基-3-嗎啉酮、N-乙烯基-1,3-㗁𠯤-2-酮、N-乙烯基-3,5-嗎啉二酮等,更佳為N-乙烯基-2-吡咯啶酮、N-乙烯基-2-己內醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺,進而較佳為N-乙烯基-2-吡咯啶酮。The N-vinyl cyclic amide represented by the above formula (1) is preferably N-vinyl- 2-Pyrrolidone (NVP), N-vinyl-2-piperidinone, N-vinyl-2-caprolactamide, N,N-dimethyl(meth)acrylamide, N,N -Diethyl(meth)acrylamide, N-vinyl-3-morpholinone, N-vinyl-1,3-㗁𠯤-2-one, N-vinyl-3,5-morpholinone Diketones, etc., more preferably N-vinyl-2-pyrrolidone, N-vinyl-2-caprolactamide, N,N-dimethyl(meth)acrylamide, N,N-diketone Ethyl(meth)acrylamide, more preferably N-vinyl-2-pyrrolidone.

作為上述(甲基)丙烯醯胺類,例如可例舉:(甲基)丙烯醯胺、N-烷基(甲基)丙烯醯胺、N,N-二烷基(甲基)丙烯醯胺等。作為上述N-烷基(甲基)丙烯醯胺,例如可例舉:N-乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-正丁基(甲基)丙烯醯胺、N-辛基丙烯醯胺等。進而,上述N-烷基(甲基)丙烯醯胺亦包括如二甲胺基乙基(甲基)丙烯醯胺、二乙胺基乙基(甲基)丙烯醯胺、二甲胺基丙基(甲基)丙烯醯胺之具有胺基之(甲基)丙烯醯胺。作為上述N,N-二烷基(甲基)丙烯醯胺,例如可例舉:N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二丙基(甲基)丙烯醯胺、N,N-二異丙基(甲基)丙烯醯胺、N,N-二正丁基(甲基)丙烯醯胺、N,N-二第三丁基(甲基)丙烯醯胺等。As said (meth)acrylamides, for example: (meth)acrylamides, N-alkyl (meth)acrylamides, N,N-dialkyl (meth)acrylamides Wait. As said N-alkyl (meth)acrylamide, for example, N-ethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N-n-butyl ( Methyl) acrylamide, N-octyl acrylamide, etc. Furthermore, the above-mentioned N-alkyl(meth)acrylamide also includes, for example, dimethylaminoethyl(meth)acrylamide, diethylaminoethyl(meth)acrylamide, and dimethylaminopropyl (meth)acrylamide having an amine group based on (meth)acrylamide. As said N,N-dialkyl (meth)acrylamide, for example: N,N- dimethyl (meth)acrylamide, N,N- diethyl (meth)acrylamide Amine, N,N-Dipropyl(meth)acrylamide, N,N-Diisopropyl(meth)acrylamide, N,N-Di-n-butyl(meth)acrylamide, N , N-di-tert-butyl (meth) acrylamide and so on.

又,上述(甲基)丙烯醯胺類例如亦包括各種N-羥基烷基(甲基)丙烯醯胺。作為上述N-羥基烷基(甲基)丙烯醯胺,例如可例舉:N-羥甲基(甲基)丙烯醯胺、N-(2-羥基乙基)(甲基)丙烯醯胺、N-(2-羥基丙基)(甲基)丙烯醯胺、N-(1-羥基丙基)(甲基)丙烯醯胺、N-(3-羥基丙基)(甲基)丙烯醯胺、N-(2-羥基丁基)(甲基)丙烯醯胺、N-(3-羥基丁基)(甲基)丙烯醯胺、N-(4-羥基丁基)(甲基)丙烯醯胺、N-甲基-N-2-羥基乙基(甲基)丙烯醯胺等。In addition, the above-mentioned (meth)acrylamides include, for example, various N-hydroxyalkyl(meth)acrylamides. As said N-hydroxyalkyl(meth)acrylamide, for example, N-methylol(meth)acrylamide, N-(2-hydroxyethyl)(meth)acrylamide, N-(2-hydroxypropyl)(meth)acrylamide, N-(1-hydroxypropyl)(meth)acrylamide, N-(3-hydroxypropyl)(meth)acrylamide , N-(2-hydroxybutyl)(meth)acrylamide, N-(3-hydroxybutyl)(meth)acrylamide, N-(4-hydroxybutyl)(meth)acrylamide amine, N-methyl-N-2-hydroxyethyl (meth)acrylamide, etc.

又,上述(甲基)丙烯醯胺類例如亦包括各種N-烷氧基烷基(甲基)丙烯醯胺。作為上述N-烷氧基烷基(甲基)丙烯醯胺,例如可例舉:N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺等。In addition, the above-mentioned (meth)acrylamides include, for example, various N-alkoxyalkyl(meth)acrylamides. As said N-alkoxyalkyl (meth)acrylamide, for example: N-methoxymethyl (meth)acrylamide, N-butoxymethyl (meth)acrylamide Amines etc.

又,作為上述N-乙烯基環狀醯胺、上述(甲基)丙烯醯胺類以外之含氮原子之單體,例如可例舉:(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二甲胺基丙酯、(甲基)丙烯酸第三丁基胺基乙酯等含胺基之單體;丙烯腈、甲基丙烯腈等含氰基之單體;(甲基)丙烯醯基嗎啉、N-乙烯基哌𠯤、N-乙烯基吡咯、N-乙烯基咪唑、N-乙烯基吡𠯤、N-乙烯基嗎啉、N-乙烯基吡唑、乙烯基吡啶、乙烯基嘧啶、乙烯基㗁唑、乙烯基異㗁唑、乙烯基噻唑、乙烯基異噻唑、乙烯基嗒𠯤、(甲基)丙烯醯基吡咯啶酮、(甲基)丙烯醯基吡咯啶、(甲基)丙烯醯基哌啶、N-甲基乙烯基吡咯啶酮等含雜環之單體;N-環己基馬來醯亞胺、N-異丙基馬來醯亞胺、N-月桂基馬來醯亞胺、N-苯基馬來醯亞胺等馬來醯亞胺系單體、N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-月桂基伊康醯亞胺、N-環己基伊康醯亞胺等伊康醯亞胺系單體、N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基丁二醯亞胺等丁二醯亞胺系單體等含醯亞胺基之單體;異氰酸2-(甲基)丙烯醯氧基乙酯等含異氰酸基之單體等。Moreover, as a nitrogen atom-containing monomer other than the said N-vinyl cyclic amides and the said (meth)acrylamides, for example, aminoethyl (meth)acrylate, (methyl) Amine group-containing monomers such as dimethylaminoethyl acrylate, dimethylaminopropyl (meth)acrylate, and tert-butylaminoethyl (meth)acrylate; acrylonitrile, methacrylonitrile, etc. Monomers of cyano groups; (meth)acryloylmorpholine, N-vinylpiperidine, N-vinylpyrrole, N-vinylimidazole, N-vinylpyridine, N-vinylmorpholine, N-vinyl - vinylpyrazole, vinylpyridine, vinylpyrimidine, vinyloxazole, vinylisoxazole, vinylthiazole, vinylisothiazole, vinylpyrrolidone, (meth)acryloylpyrrolidone, (Meth) acryl pyrrolidine, (meth) acryl piperidine, N-methyl vinyl pyrrolidone and other heterocyclic monomers; N-cyclohexyl maleimide, N-iso Maleimide monomers such as propylmaleimide, N-laurylmaleimide, N-phenylmaleimide, N-methyliconimide, N-ethyl Iconimide, N-butyl Iconimide, N-Octyl Iconimide, N-2-Ethylhexyl Iconimide, N-Lauryl Iconimide, Iconimide-based monomers such as N-cyclohexyliconimide, N-(meth)acryloyloxymethylenesuccinimide, N-(meth)acryloyl-6- Butadiimide-based monomers such as oxyhexamethylene butanediimide, N-(meth)acryloyl-8-oxyoctamethylene butanediimide, etc., containing imide groups monomers; 2-(meth)acryloyloxyethyl isocyanate and other monomers containing isocyanate groups, etc.

[1-6.含脂環結構之單體] 含脂環結構之單體意指具有(甲基)丙烯醯基或乙烯基等具有不飽和雙鍵之聚合性之官能基、且具有脂環結構之單體(但相當於甲基丙烯酸酯(A2)者除外)。例如,具有環烷基之(甲基)丙烯酸烷基酯包含於上述含脂環結構之單體中。但分子內具有至少一個脂環結構且分子內具有至少一個羧基之單體為含羧基之單體,並非含脂環結構之單體。再者,含脂環結構之單體可單獨使用或組合2種以上而使用。 [1-6. Monomer containing alicyclic structure] The alicyclic structure-containing monomer refers to a monomer having a polymerizable functional group having an unsaturated double bond such as a (meth)acryloyl group or a vinyl group, and having an alicyclic structure (but equivalent to methacrylate ( A2) is excluded). For example, an alkyl (meth)acrylate having a cycloalkyl group is included in the above-mentioned alicyclic structure-containing monomer. However, monomers having at least one alicyclic structure in the molecule and at least one carboxyl group in the molecule are carboxyl group-containing monomers, not alicyclic structure-containing monomers. In addition, the monomer containing an alicyclic structure can be used individually or in combination of 2 or more types.

上述含脂環結構之單體中之脂環結構為環狀之烴結構,較佳為碳數5以上,更佳為碳數6~24,進而較佳為碳數6~15,尤佳為碳數6~10。The alicyclic structure in the above-mentioned alicyclic structure-containing monomer is a cyclic hydrocarbon structure, preferably carbon number 5 or more, more preferably carbon number 6-24, more preferably carbon number 6-15, particularly preferably The carbon number is 6-10.

作為上述含脂環結構之單體,例如可例舉:(甲基)丙烯酸環丙酯、(甲基)丙烯酸環丁酯、(甲基)丙烯酸環戊酯、丙烯酸環己酯、丙烯酸3,3,5-三甲基環己酯、丙烯酸環庚酯、丙烯酸環辛酯、丙烯酸異𦯉基酯、丙烯酸二環戊酯、下述式(2)所表示之HPMPA、下述式(3)所表示之TMA-2、下述式(4)所表示之HCPA等(甲基)丙烯酸系單體。再者,於下述式(4)中,以線相連之環己基環與括號內之結構式之鍵結位置並無特別限定。該等中,較佳為丙烯酸異𦯉基酯、丙烯酸環己酯、丙烯酸3,3,5-三甲基環己酯。 [化3]

Figure 02_image005
[化4]
Figure 02_image007
[化5]
Figure 02_image009
As the monomer containing the alicyclic structure, for example, cyclopropyl (meth)acrylate, cyclobutyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl acrylate, acrylic acid 3, 3,5-trimethylcyclohexyl acrylate, cycloheptyl acrylate, cyclooctyl acrylate, isocyanyl acrylate, dicyclopentyl acrylate, HPMPA represented by the following formula (2), and the following formula (3) (meth)acrylic monomers, such as TMA-2 represented, and HCPA represented by following formula (4). In addition, in the following formula (4), the bonding position of the cyclohexyl ring connected by a line and the structural formula in the parentheses is not particularly limited. Among these, isocyanic acid acrylate, cyclohexyl acrylate, and 3,3,5-trimethylcyclohexyl acrylate are preferred. [hua 3]
Figure 02_image005
[hua 4]
Figure 02_image007
[hua 5]
Figure 02_image009

[1-7.其他共聚性單體] 作為丙烯酸系聚合物(A)中之共聚性單體,除了上述含氮原子之單體、含羥基之單體、含脂環結構之單體以外,例如可例舉:(甲基)丙烯酸烷氧基烷基酯[例如,(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸甲氧基三乙二醇酯、(甲基)丙烯酸3-甲氧基丙酯、(甲基)丙烯酸3-乙氧基丙酯、(甲基)丙烯酸4-甲氧基丁酯、(甲基)丙烯酸4-乙氧基丁酯、(甲基)丙烯酸2-(2-甲氧基乙氧基)乙酯等];含環氧基之單體[例如,(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸甲基縮水甘油酯等];含磺酸基之單體[例如,乙烯基磺酸鈉等];含有磷酸基之單體;具有芳香族烴基之(甲基)丙烯酸酯(但相當於甲基丙烯酸酯(A2)者除外)[例如,丙烯酸苯酯、丙烯酸苯氧基乙酯、丙烯酸苄酯等];乙烯酯類[例如,乙酸乙烯酯、丙酸乙烯酯等];芳香族乙烯系化合物[例如,苯乙烯、乙烯基甲苯等];烯烴類或二烯類[例如,乙烯、丙烯、丁二烯、異戊二烯、異丁烯等];乙烯醚類[例如,乙烯基烷基醚等];氯乙烯;主鏈之重複單元之全部碳具有側鏈之取代亞甲基化合物等。 [1-7. Other comonomers] As the copolymerizable monomer in the acrylic polymer (A), in addition to the above-mentioned nitrogen atom-containing monomer, hydroxyl group-containing monomer, and alicyclic structure-containing monomer, for example, alkyl (meth)acrylates may be mentioned. Oxyalkyl esters [for example, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, (meth)acrylate base) 3-methoxypropyl acrylate, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, 4-ethoxybutyl (meth)acrylate, 2-(2-methoxyethoxy)ethyl (meth)acrylate, etc.]; epoxy group-containing monomers [eg, glycidyl (meth)acrylate, methylglycidyl (meth)acrylate esters, etc.]; sulfonic acid group-containing monomers [for example, sodium vinylsulfonate, etc.]; phosphoric acid group-containing monomers; (meth)acrylates with aromatic hydrocarbon groups (but equivalent to methacrylates (A2 )) [for example, phenyl acrylate, phenoxyethyl acrylate, benzyl acrylate, etc.]; vinyl esters [for example, vinyl acetate, vinyl propionate, etc.]; aromatic vinyl compounds [for example, benzene ethylene, vinyltoluene, etc.]; olefins or dienes [eg, ethylene, propylene, butadiene, isoprene, isobutylene, etc.]; vinyl ethers [eg, vinyl alkyl ether, etc.]; vinyl chloride ; All carbons of the repeating units of the main chain have side chain substituted methylene compounds, etc.

進而,作為上述丙烯酸系聚合物(A)中之共聚性單體,亦可例舉多官能性單體。多官能性單體作為交聯成分發揮作用。作為上述多官能性單體,例如可例舉:己二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯基苯、環氧丙烯酸酯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯等。再者,多官能性單體可單獨使用或組合使用2種以上。Furthermore, as a copolymerizable monomer in the said acrylic polymer (A), a polyfunctional monomer can also be mentioned. The multifunctional monomer functions as a crosslinking component. As said polyfunctional monomer, for example, hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, ( Poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate , trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl(meth)acrylate, vinyl(meth)acrylate, divinylbenzene, cyclic Oxyacrylates, polyester acrylates, urethane acrylates, etc. In addition, a polyfunctional monomer can be used individually or in combination of 2 or more types.

丙烯酸系聚合物(A)之全部單體單元中之上述多官能性單體之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(A)之單體成分總量(100重量%),較佳為0.5重量%以下(例如,0~0.5重量%),更佳為0~0.35重量%,進而較佳為0~0.2重量%。若多官能性單體之含量為0.5重量%以下,則黏著劑層具有適度之凝集力,容易提高黏著力或階差吸收性而較佳。再者,於使用交聯劑之情形時亦可不使用多官能性單體,不使用交聯劑之情形時之多官能性單體之含量較佳為0.001~0.5重量%,更佳為0.001~0.35重量%,進而較佳為0.002~0.2重量%。The content (ratio) of the above-mentioned polyfunctional monomer in all the monomer units of the acrylic polymer (A) is not particularly limited, and is based on the total amount (100% by weight) of the monomer components constituting the acrylic polymer (A). ), preferably 0.5% by weight or less (for example, 0 to 0.5% by weight), more preferably 0 to 0.35% by weight, still more preferably 0 to 0.2% by weight. If the content of the polyfunctional monomer is 0.5% by weight or less, the adhesive layer has a moderate cohesive force, and it is easy to improve the adhesive force or the level difference absorption, which is preferable. Furthermore, when a cross-linking agent is used, the polyfunctional monomer may not be used. When the cross-linking agent is not used, the content of the polyfunctional monomer is preferably 0.001-0.5 wt %, more preferably 0.001- 0.35% by weight, more preferably 0.002 to 0.2% by weight.

上述丙烯酸系聚合物(A)之重量平均分子量(Mw)較佳為100000~5000000,更佳為500000~4000000,進而較佳為750000~3000000。丙烯酸系聚合物(A)之重量平均分子量為100000以上之構成於提高黏著力或保持特性、提高耐發泡剝離性之方面較佳。另一方面,丙烯酸系聚合物(A)之重量平均分子量為5000000以下之構成於容易提高黏著力、提高耐發泡剝離性之方面較佳。The weight average molecular weight (Mw) of the acrylic polymer (A) is preferably 100,000 to 5,000,000, more preferably 500,000 to 4,000,000, and still more preferably 750,000 to 3,000,000. The structure in which the weight average molecular weight of the acrylic polymer (A) is 100,000 or more is preferable in terms of improving the adhesive force or retention properties, and improving the resistance to foaming and peeling. On the other hand, the weight-average molecular weight of the acrylic polymer (A) is preferably 5,000,000 or less in that it is easy to improve the adhesive force and improve the foaming peeling resistance.

上述丙烯酸系聚合物(A)之重量平均分子量(Mw)可藉由GPC(Gel Permeation Chromatography,凝膠滲透層析)法進行聚苯乙烯換算而求出。例如可使用Tosoh股份有限公司製造之高速GPC裝置「HPLC-8120GPC」,藉由下述條件進行測定。 管柱:TSKgel SuperHZM-H/HZ4000/HZ3000/HZ2000 溶劑:四氫呋喃 流速:0.6 ml/分鐘 The weight average molecular weight (Mw) of the said acrylic polymer (A) can be calculated|required by polystyrene conversion by GPC (Gel Permeation Chromatography) method. For example, the measurement can be performed under the following conditions using a high-speed GPC apparatus "HPLC-8120GPC" manufactured by Tosoh Co., Ltd. Column: TSKgel SuperHZM-H/HZ4000/HZ3000/HZ2000 Solvent: Tetrahydrofuran Flow rate: 0.6 ml/min

上述丙烯酸系聚合物(A)之玻璃轉移溫度(Tg)並無特別限定,較佳為-70~100℃,更佳為-65~50℃,進而較佳為-60~10℃。若丙烯酸系聚合物(A)之玻璃轉移溫度為-70℃以上,則容易提高凝集力且提高耐發泡剝離性而較佳。又,若丙烯酸系聚合物(A)之玻璃轉移溫度為100℃以下,則黏著劑層具有適度之柔軟性,容易獲得良好之黏著力或良好之階差吸收性,容易獲得優異之接著可靠性,因此較佳。Although the glass transition temperature (Tg) of the said acrylic polymer (A) is not specifically limited, -70-100 degreeC is preferable, -65-50 degreeC is more preferable, -60-10 degreeC is still more preferable. When the glass transition temperature of the acrylic polymer (A) is -70°C or higher, it is easy to improve the cohesive force and improve the resistance to foaming and peeling, which is preferable. In addition, when the glass transition temperature of the acrylic polymer (A) is 100° C. or lower, the adhesive layer has moderate flexibility, and it is easy to obtain good adhesive force or good level difference absorption, and it is easy to obtain excellent adhesion reliability. , so it is better.

上述丙烯酸系聚合物(A)之玻璃轉移溫度(Tg)為由下述FOX之式所表示之玻璃轉移溫度(理論值)。 1/Tg=W 1/Tg 1+W 2/Tg 2+・・・+W n/Tg n上述式中,Tg表示丙烯酸系聚合物(A)之玻璃轉移溫度(單位:K),Tg i表示單體i形成均聚物時之玻璃轉移溫度(單位:K),W i表示單體i之單體成分總量中之重量分率(i=1、2、・・・・n)。 作為構成上述丙烯酸系聚合物(A)之單體之均聚物之Tg,可採用下述值。 丙烯酸2-乙基己酯                            -70℃ 丙烯酸正己酯                                  -65℃ 丙烯酸正辛酯                                  -65℃ 丙烯酸異壬酯                                  -60℃ 丙烯酸正壬酯                                  -58℃ 丙烯酸正丁酯                                  -55℃ 丙烯酸乙酯                                     -20℃ 丙烯酸月桂酯                                  0℃ 甲基丙烯酸2-乙基己酯                      -10℃ 丙烯酸甲酯                                     8℃ 甲基丙烯酸正丁酯                            20℃ 甲基丙烯酸甲酯                               105℃ 甲基丙烯酸月桂酯                            -65℃ 甲基丙烯酸異癸酯                            -41℃ 甲基丙烯酸環己酯                            66℃ 甲基丙烯酸異𦯉基酯                         173℃ 甲基丙烯酸二環戊酯                         175℃ 甲基丙烯酸2-苯氧基乙酯                   5℃ 甲基丙烯酸苄酯                               54℃ 甲基丙烯酸2-(2-甲氧基乙氧基)乙酯    -3℃ 甲基丙烯酸2-羥基乙酯                      55℃ 丙烯酸                                            106℃ 甲基丙烯酸                                     228℃ N-乙烯基吡咯啶酮                           86℃ 乙酸乙烯酯                                     32℃ 苯乙烯                                            100℃ The glass transition temperature (Tg) of the said acrylic polymer (A) is the glass transition temperature (theoretical value) represented by the following formula of FOX. 1/Tg=W 1 /Tg 1 +W 2 /Tg 2 +・・・+W n /Tg n In the above formula, Tg represents the glass transition temperature (unit: K) of the acrylic polymer (A), and Tg i represents the single The glass transition temperature (unit: K) when the monomer i is formed into a homopolymer, and Wi represents the weight fraction in the total amount of the monomer components of the monomer i (i=1, 2, ... n). As Tg of the homopolymer of the monomer which comprises the said acrylic polymer (A), the following value can be employ|adopted. 2-ethylhexyl acrylate-70℃ n-hexyl acrylate-65℃ n-octyl acrylate-65℃ isononyl acrylate-60℃ n-nonyl acrylate-58℃ n-butyl acrylate-55℃ ethyl acrylate-20℃ Lauryl acrylate 0℃ 2-ethylhexyl methacrylate-10℃ Methyl acrylate 8℃ N-butyl methacrylate 20℃ Methyl methacrylate 105℃ Lauryl methacrylate-65℃ Isodecyl methacrylate Ester-41℃ Cyclohexyl methacrylate 66℃ Isoyl methacrylate 173℃ Dicyclopentyl methacrylate 175℃ 2-phenoxyethyl methacrylate 5℃ Benzyl methacrylate 54℃ Methyl 2-(2-methoxyethoxy)ethyl methacrylate-3℃ 2-hydroxyethyl methacrylate 55℃ Acrylic acid 106℃ Methacrylic acid 228℃ N-vinylpyrrolidone 86℃ Vinyl acetate 32 ℃ Styrene 100℃

又,作為上述未記載之單體之均聚物之Tg,可採用「Polymer Handbook」(第3版,John Wiley & Sons, Inc,1989年)所記載之數值。進而,作為上述文獻亦未記載之單體之均聚物之Tg,可採用藉由上述測定方法所得之值(利用黏彈性試驗獲得之tanδ之峰頂溫度)。In addition, the value described in "Polymer Handbook" (3rd edition, John Wiley & Sons, Inc., 1989) can be used as the Tg of the homopolymer of the monomer not described above. Furthermore, as the Tg of the homopolymer of the monomer not described in the above-mentioned document, the value obtained by the above-mentioned measurement method (the peak top temperature of tan δ obtained by the viscoelasticity test) can be used.

[1-8.丙烯酸系聚合物(B)] 於本發明之黏著劑組合物含有丙烯酸系聚合物(A)作為基礎聚合物之情形時,上述黏著劑組合物較佳為含有上述丙烯酸系聚合物(A)及重量平均分子量為1000~30000之丙烯酸系聚合物(B)。若含有丙烯酸系聚合物(B),則對黏著片材中之界面處之被接著體之接著性提高,因此容易獲得強接著性,又,容易獲得優異之耐發泡剝離性。再者,於本說明書中,存在將「重量平均分子量為1000~30000之丙烯酸系聚合物(B)」簡稱為「丙烯酸系聚合物(B)」之情形。 [1-8. Acrylic polymer (B)] When the adhesive composition of the present invention contains an acrylic polymer (A) as a base polymer, the adhesive composition preferably contains the acrylic polymer (A) and has a weight average molecular weight of 1,000 to 30,000. Acrylic polymer (B). When the acrylic polymer (B) is contained, the adhesiveness to the adherend at the interface in the adhesive sheet is improved, so that strong adhesiveness is easily obtained, and excellent foaming and peeling resistance is easily obtained. In addition, in this specification, "the acrylic polymer (B) whose weight average molecular weight is 1,000-30,000" may be abbreviated as "acrylic polymer (B)".

作為上述丙烯酸系聚合物(B),較佳可例舉以分子內具有環狀結構之(甲基)丙烯酸酯作為必需之單體成分所構成之丙烯酸系聚合物,更佳可例舉以分子內具有環狀結構之(甲基)丙烯酸酯及具有直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯作為必需之單體成分所構成之丙烯酸系聚合物。即,作為上述丙烯酸系聚合物(B),較佳可例舉含有分子內具有環狀結構之(甲基)丙烯酸酯作為單體單元之丙烯酸系聚合物,更佳可例舉含有分子內具有環狀結構之(甲基)丙烯酸酯及具有直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯作為單體單元之丙烯酸系聚合物。As the above-mentioned acrylic polymer (B), preferably, an acrylic polymer composed of a (meth)acrylate having a cyclic structure in the molecule as an essential monomer component, more preferably a molecular An acrylic polymer composed of a (meth)acrylate having a cyclic structure and an alkyl (meth)acrylate having a linear or branched alkyl group as essential monomer components. That is, as said acrylic polymer (B), the acrylic polymer containing the (meth)acrylate which has a cyclic structure in a molecule|numerator as a monomer unit is preferably mentioned, The (meth)acrylate of a cyclic structure and the acrylic polymer having a linear or branched alkyl (meth)acrylate as a monomer unit.

上述分子內(1分子內)具有環狀結構之(甲基)丙烯酸酯(以下有時稱為「含環之(甲基)丙烯酸酯」)之環狀結構(環)可為芳香族性環、非芳香族性環之任一者,並無特別限定。作為上述芳香族性環,例如可例舉:芳香族性碳環[例如,苯環等單環碳環、或萘環等縮合碳環等]、各種芳香族性雜環等。作為上述非芳香族性環,例如可例舉:非芳香族性脂肪族環(非芳香族性脂環式環)[例如,環戊烷環、環己烷環、環庚烷環、環辛烷環等環烷烴環;環己烯環等環烯烴環等]、非芳香族性橋接環[例如,蒎烷環、蒎烯環、𦯉烷環、降𦯉烷環、降𦯉烯環等中之二環式烴環;金剛烷環等中之三環以上之脂肪族烴環(橋接式烴環)等]、非芳香族性雜環[例如,環氧環、氧雜環戊烷環、氧雜環丁烷環等]等。The cyclic structure (ring) of the (meth)acrylate having a cyclic structure in the molecule (in one molecule) (hereinafter sometimes referred to as "ring-containing (meth)acrylate") may be an aromatic ring , any of the non-aromatic rings is not particularly limited. As said aromatic ring, an aromatic carbocyclic ring [for example, a monocyclic carbocyclic ring, such as a benzene ring, or a condensed carbocyclic ring, such as a naphthalene ring, etc.], various aromatic heterocyclic rings, etc. are mentioned, for example. As said non-aromatic ring, for example, non-aromatic alicyclic ring (non-aromatic alicyclic ring) [for example, cyclopentane ring, cyclohexane ring, cycloheptane ring, cyclooctane ring, Cycloalkane rings such as alkane rings; cycloalkene rings such as cyclohexene rings, etc.], non-aromatic bridged rings [for example, pinane rings, pinene rings, alkane rings, noralkane rings, noralkene rings, etc. bicyclic hydrocarbon rings; aliphatic hydrocarbon rings with three or more rings (bridged hydrocarbon rings) among the adamantane rings, etc.], non-aromatic heterocycles [for example, epoxy rings, oxolane rings, oxetane ring, etc.] etc.

作為上述三環以上之脂肪族烴環(三環以上之橋接式烴環),例如可例舉:下述式(5a)所表示之二環戊基、下述式(5b)所表示之二環戊烯基、下述式(5c)所表示之金剛烷基、下述式(5d)所表示之三環戊基、下述式(5e)所表示之三環戊烯基等。 [化6]

Figure 02_image011
Examples of the aliphatic hydrocarbon rings having three or more rings (bridged hydrocarbon rings having three or more rings) include, for example, a dicyclopentyl group represented by the following formula (5a), and a dicyclopentyl group represented by the following formula (5b), for example. A cyclopentenyl group, an adamantyl group represented by the following formula (5c), a tricyclopentenyl group represented by the following formula (5d), a tricyclopentenyl group represented by the following formula (5e), and the like. [hua 6]
Figure 02_image011

即,作為上述含環之(甲基)丙烯酸酯,例如可例舉:(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸環庚酯、(甲基)丙烯酸環辛酯等(甲基)丙烯酸環烷基酯;(甲基)丙烯酸異𦯉基酯等具有二環式之脂肪族烴環之(甲基)丙烯酸酯;(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊氧基乙酯、(甲基)丙烯酸三環戊酯、(甲基)丙烯酸1-金剛烷基酯、(甲基)丙烯酸2-甲基-2-金剛烷基酯、(甲基)丙烯酸2-乙基-2-金剛烷基酯等具有三環以上之脂肪族烴環之(甲基)丙烯酸酯;(甲基)丙烯酸苯酯等(甲基)丙烯酸芳基酯、(甲基)丙烯酸苯氧基乙酯等(甲基)丙烯酸芳氧基烷基酯、(甲基)丙烯酸苄酯等(甲基)丙烯酸芳基烷基酯等具有芳香族性環之(甲基)丙烯酸酯等。其中,作為上述含環之(甲基)丙烯酸酯,尤其較佳為含有非芳香族性環之(甲基)丙烯酸酯,更佳為丙烯酸環己酯(CHA)、甲基丙烯酸環己酯(CHMA)、丙烯酸二環戊酯(DCPA)、甲基丙烯酸二環戊酯(DCPMA),進而較佳為丙烯酸二環戊酯(DCPA)、甲基丙烯酸二環戊酯(DCPMA)。再者,含環之(甲基)丙烯酸酯可單獨使用或組合使用2種以上。That is, as the above-mentioned ring-containing (meth)acrylate, for example, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, cycloheptyl (meth)acrylate, and (meth)acrylate may, for example, be mentioned. Cycloalkyl (meth)acrylates such as cyclooctyl acrylate; (meth)acrylates having bicyclic aliphatic hydrocarbon rings such as iso(meth)acrylates; dicyclopentane (meth)acrylates ester, dicyclopentyloxyethyl (meth)acrylate, tricyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl (meth)acrylate (Meth)acrylates having aliphatic hydrocarbon rings of three or more rings, such as alkyl esters and 2-ethyl-2-adamantyl (meth)acrylates; (meth)acrylates such as phenyl (meth)acrylates Aryl acrylate, aryloxyalkyl (meth)acrylate such as phenoxyethyl (meth)acrylate, arylalkyl (meth)acrylate such as benzyl (meth)acrylate, etc. have aromatic (meth)acrylate of sexual ring, etc. Among them, as the above-mentioned ring-containing (meth)acrylate, a non-aromatic ring-containing (meth)acrylate is particularly preferred, and cyclohexyl acrylate (CHA), cyclohexyl methacrylate ( CHMA), dicyclopentyl acrylate (DCPA), dicyclopentyl methacrylate (DCPMA), and more preferably dicyclopentyl acrylate (DCPA) and dicyclopentyl methacrylate (DCPMA). In addition, a ring-containing (meth)acrylate can be used individually or in combination of 2 or more types.

上述含有非芳香族性環之(甲基)丙烯酸酯中,於使用具有三環以上之脂肪族烴環(尤其是三環以上之橋接式烴環)之(甲基)丙烯酸酯之情形時,尤其於不易引起聚合抑制之方面較佳。又,於使用具有不含不飽和鍵之上述式(5a)所表示之二環戊基、上述式(5c)所表示之金剛烷基、上述式(5d)所表示之三環戊基之(甲基)丙烯酸酯之情形時,可進一步提高耐發泡剝離性,進而,可顯著提高對聚乙烯或聚丙烯等低極性之被接著體之接著性。Among the above-mentioned non-aromatic ring-containing (meth)acrylates, in the case of using (meth)acrylates having an aliphatic hydrocarbon ring having three or more rings (especially a bridged hydrocarbon ring having three or more rings), In particular, it is preferable that polymerization inhibition is not easily caused. In addition, when using a dicyclopentyl group represented by the above formula (5a) without an unsaturated bond, an adamantyl group represented by the above formula (5c), and a tricyclopentyl group represented by the above formula (5d) ( In the case of meth)acrylate, the resistance to foaming and peeling can be further improved, and further, the adhesiveness to a low-polarity adherend such as polyethylene or polypropylene can be remarkably improved.

丙烯酸系聚合物(B)之全部單體單元(構成丙烯酸系聚合物(B)之單體成分總量)中之上述含環之(甲基)丙烯酸酯之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(B)之單體成分總量(100重量%),較佳為10~90重量%,更佳為20~80重量%。若上述含環之(甲基)丙烯酸酯之含量為10重量%以上,則容易提高耐發泡剝離性而較佳。又,若含量為90重量%以下,則黏著劑層具有適度之柔軟性,容易提高黏著力或階差吸收性等而較佳。The content (ratio) of the above-mentioned ring-containing (meth)acrylate in all monomer units of the acrylic polymer (B) (the total amount of monomer components constituting the acrylic polymer (B)) is not particularly limited, It is preferably 10 to 90% by weight, more preferably 20 to 80% by weight, with respect to the total amount (100% by weight) of the monomer components constituting the acrylic polymer (B). When content of the said ring-containing (meth)acrylate is 10 weight% or more, it is easy to improve foaming peeling resistance, and it is preferable. In addition, when the content is 90% by weight or less, the adhesive layer has moderate flexibility, and it is easy to improve the adhesive force, the level difference absorption, and the like, which is preferable.

又,關於作為丙烯酸系聚合物(B)之單體單元之上述具有直鏈或支鏈狀之烷基的(甲基)丙烯酸烷基酯,例如可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等烷基之碳數為1~20之(甲基)丙烯酸烷基酯等。其中,就與丙烯酸系聚合物(A)之相容性變得良好之方面而言,較佳為甲基丙烯酸甲酯(MMA)。再者,上述(甲基)丙烯酸烷基酯可單獨使用或組合使用2種以上。Moreover, as the monomeric unit of the acrylic polymer (B), the (meth)acrylic acid alkyl ester having the above-mentioned linear or branched alkyl group includes, for example, methyl (meth)acrylate, Ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate ester, tert-butyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, (meth)acrylic acid Octyl ester, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, ( Isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate ester, pentadecyl (meth)acrylate, cetyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, (meth)acrylate The carbon number of the alkyl group, such as nonadecyl acrylate and eicosyl (meth)acrylate, is an alkyl (meth)acrylate having 1 to 20 carbon atoms, and the like. Among them, methyl methacrylate (MMA) is preferable in that the compatibility with the acrylic polymer (A) becomes favorable. In addition, the said alkyl (meth)acrylate can be used individually or in combination of 2 or more types.

丙烯酸系聚合物(B)之全部單體單元(構成丙烯酸系聚合物(B)之單體成分總量)中之上述具有直鏈或支鏈狀烷基之(甲基)丙烯酸烷基酯之含量(比率)並無特別限定,就耐發泡剝離性之方面而言,相對於構成丙烯酸系聚合物(B)之單體成分總量(100重量%),較佳為10重量%以上(例如10~90重量%),更佳為20~80重量%,進而較佳為20~60重量%。若含量為10重量%以上,則尤其容易提高針對丙烯酸樹脂或聚碳酸酯制之被接著體之黏著力而較佳。Among the total monomer units of the acrylic polymer (B) (the total amount of the monomer components constituting the acrylic polymer (B)), the above-mentioned alkyl (meth)acrylate having a linear or branched alkyl group The content (ratio) is not particularly limited, but from the point of view of resistance to foaming and peeling, it is preferably 10% by weight or more ( For example, 10 to 90% by weight), more preferably 20 to 80% by weight, still more preferably 20 to 60% by weight. When the content is 10% by weight or more, it is particularly easy to improve the adhesive force to the adherend made of acrylic resin or polycarbonate, which is preferable.

作為丙烯酸系聚合物(B)之單體單元,除了上述含環之(甲基)丙烯酸酯及具有直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯以外,亦可含有可與該等單體共聚合之單體(共聚性單體)。再者,丙烯酸系聚合物(B)之全部單體單元(構成丙烯酸系聚合物(B)之單體成分總量)中之上述共聚性單體之含量(比率)並無特別限定,相對於構成丙烯酸系聚合物(B)之單體成分總量(100重量%),較佳為49.9重量%以下(例如,0~49.9重量%),更佳為30重量%以下。又,共聚性單體可單獨使用或組合使用2種以上。As the monomer unit of the acrylic polymer (B), in addition to the above-mentioned ring-containing (meth)acrylate and (meth)acrylate alkyl having a linear or branched alkyl group, optionally Monomers (comonomers) copolymerized with these monomers. In addition, the content (ratio) of the above-mentioned copolymerizable monomer in all the monomer units of the acrylic polymer (B) (the total amount of the monomer components constituting the acrylic polymer (B)) is not particularly limited, and relative to The total amount (100% by weight) of the monomer components constituting the acrylic polymer (B) is preferably 49.9% by weight or less (for example, 0 to 49.9% by weight), more preferably 30% by weight or less. Moreover, a comonomer can be used individually or in combination of 2 or more types.

關於作為丙烯酸系聚合物(B)之單體單元之上述共聚性單體(構成丙烯酸系聚合物(B)之上述共聚性單體),例如可例舉:(甲基)丙烯酸烷氧基烷基酯[例如,(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸甲氧基三乙二醇酯、(甲基)丙烯酸3-甲氧基丙酯、(甲基)丙烯酸3-乙氧基丙酯、(甲基)丙烯酸4-甲氧基丁酯、(甲基)丙烯酸4-乙氧基丁酯等];含羥基之單體[例如,(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯等(甲基)丙烯酸羥基烷基酯、乙烯醇、烯丙醇等];含醯胺基之單體[例如,(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、N-羥基乙基(甲基)丙烯醯胺等];含胺基之單體[例如,(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等];含氰基之單體[例如,丙烯腈、甲基丙烯腈等];含磺酸基之單體[例如,乙烯基磺酸鈉等];含有磷酸基之單體[例如,2-羥基乙基丙烯醯磷酸酯等];含異氰酸基之單體[例如,異氰酸2-甲基丙烯醯氧基乙酯等]、含醯亞胺基之單體[環己基馬來醯亞胺、異丙基馬來醯亞胺等]等。About the said comonomer (the said comonomer which comprises acrylic polymer (B)) which is the monomer unit of acrylic polymer (B), (meth)acrylic acid alkoxyalkane is mentioned, for example: base ester [eg, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, (meth)acrylic acid 3-methoxypropyl, (meth)acrylate 3-ethoxypropyl, (meth)acrylate 4-methoxybutyl, (meth)acrylate 4-ethoxybutyl, etc.]; containing Monomers of hydroxyl [for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate) [ For example, (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)propylene amide, N-butoxymethyl (meth) acrylamide, N-hydroxyethyl (meth) acrylamide, etc.]; amine group-containing monomers [for example, (meth)acrylate aminoethyl esters, dimethylaminoethyl (meth)acrylate, tert-butylaminoethyl (meth)acrylate, etc.]; cyano group-containing monomers [for example, acrylonitrile, methacrylonitrile, etc.]; containing Monomers containing sulfonic acid groups [for example, sodium vinylsulfonate, etc.]; monomers containing phosphoric acid groups [for example, 2-hydroxyethyl acryl phosphate, etc.]; monomers containing isocyanate groups [for example, isocyanato group 2-methacryloyloxyethyl cyanate, etc.], monomers containing imide groups [cyclohexylmaleimide, isopropylmaleimide, etc.], etc.

如上所述,丙烯酸系聚合物(B)較佳為含有分子內具有環狀結構之(甲基)丙烯酸酯及具有直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯作為單體單元之丙烯酸系聚合物。其中,較佳為含有含環之(甲基)丙烯酸酯、及上述具有直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯作為單體單元之丙烯酸系聚合物。於上述含有含環之(甲基)丙烯酸酯及具有直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯作為單體單元之丙烯酸系聚合物中,相對於構成丙烯酸系聚合物(B)之單體成分總量(100重量%)之含環之(甲基)丙烯酸酯之量並無特別限定,較佳為10~90重量%,更佳為20~80重量%。又,具有直鏈或支鏈狀之烷基之(甲基)丙烯酸烷基酯之含量並無特別限定,較佳為10~90重量%,更佳為20~80重量%,進而較佳為20~60重量%。As described above, the acrylic polymer (B) preferably contains (meth)acrylic acid ester having a cyclic structure in the molecule and (meth)acrylic acid alkyl ester having a linear or branched alkyl group as a single Acrylic polymers of monomer units. Among them, an acrylic polymer containing a ring-containing (meth)acrylate and the above-mentioned (meth)acrylate having a linear or branched alkyl group as monomer units is preferable. In the above-mentioned acrylic polymer containing a ring-containing (meth)acrylate and a (meth)acrylic acid alkyl ester having a linear or branched alkyl group as monomer units, relative to the constituent acrylic polymer The amount of the ring-containing (meth)acrylate in the total monomer component (100% by weight) of (B) is not particularly limited, but is preferably 10 to 90% by weight, more preferably 20 to 80% by weight. In addition, the content of the alkyl (meth)acrylate having a linear or branched alkyl group is not particularly limited, but is preferably 10 to 90% by weight, more preferably 20 to 80% by weight, and still more preferably 20 to 60% by weight.

進而,作為丙烯酸系聚合物(B)之尤佳之具體構成,可例舉含有(1)選自由丙烯酸二環戊酯、甲基丙烯酸二環戊酯、丙烯酸環己酯、及甲基丙烯酸環己酯所組成之群中之至少1種單體、以及(2)甲基丙烯酸甲酯作為單體單元之丙烯酸系聚合物。上述尤佳之具體構成之丙烯酸系聚合物(B)中的丙烯酸系聚合物(B)之全部單體單元中之(1)丙烯酸二環戊酯、甲基丙烯酸二環戊酯、丙烯酸環己酯、及甲基丙烯酸環己酯之含量(於含有2種以上之情形時為該等之合計量)相對於構成丙烯酸系聚合物(B)之單體成分總量(100重量%),較佳為30~70重量%,(2)甲基丙烯酸甲酯之含量較佳為30~70重量%。但上述丙烯酸系聚合物(B)並不限定於上述具體構成。Furthermore, as a particularly preferable specific structure of the acrylic polymer (B), (1) a ring selected from the group consisting of dicyclopentyl acrylate, dicyclopentyl methacrylate, cyclohexyl acrylate, and methacrylic acid can be mentioned. At least one monomer in the group consisting of hexyl ester, and (2) an acrylic polymer having methyl methacrylate as a monomer unit. (1) Dicyclopentyl acrylate, dicyclopentyl methacrylate, cyclohexyl acrylate among all monomer units of acrylic polymer (B) in the above-mentioned particularly preferred acrylic polymer (B) The content of ester and cyclohexyl methacrylate (in the case of containing two or more kinds, the total amount of these) is higher than the total amount (100% by weight) of the monomer components constituting the acrylic polymer (B). It is preferably 30 to 70% by weight, and (2) the content of methyl methacrylate is preferably 30 to 70% by weight. However, the said acrylic polymer (B) is not limited to the said specific structure.

丙烯酸系聚合物(B)可藉由利用公知或慣用之聚合方法使上述單體成分聚合而獲得。作為上述丙烯酸系聚合物(B)之聚合方法,例如可例舉:溶液聚合方法、乳化聚合方法、塊狀聚合方法、利用活性能量線照射之聚合方法(活性能量線聚合方法)等。其中,較佳為塊狀聚合方法、溶液聚合方法,更佳為溶液聚合方法。The acrylic polymer (B) can be obtained by polymerizing the above-mentioned monomer components by a known or conventional polymerization method. As a polymerization method of the said acrylic polymer (B), a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by active energy ray irradiation (active energy ray polymerization method) etc. are mentioned, for example. Among them, the block polymerization method and the solution polymerization method are preferable, and the solution polymerization method is more preferable.

於丙烯酸系聚合物(B)之聚合時,可使用各種通常之溶劑。作為上述溶劑,例如可例舉:乙酸乙酯、乙酸正丁酯等酯類;甲苯、苯等芳香族烴類;正己烷、正庚烷等脂肪族烴類;環己烷、甲基環己烷等脂環式烴類;甲基乙基酮、甲基異丁基酮等酮類等有機溶劑。再者,此種溶劑可單獨使用或組合使用2種以上。In the polymerization of the acrylic polymer (B), various common solvents can be used. Examples of the solvent include: esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane, methylcyclohexane and the like Alkane and other alicyclic hydrocarbons; methyl ethyl ketone, methyl isobutyl ketone and other ketones and other organic solvents. In addition, such a solvent can be used individually or in combination of 2 or more types.

進而,於丙烯酸系聚合物(B)之聚合時,可使用公知或慣用之聚合起始劑(例如,熱聚合起始劑或光聚合起始劑等)。再者,聚合起始劑可單獨使用或組合使用2種以上。Furthermore, at the time of superposing|polymerizing an acrylic polymer (B), a well-known or usual polymerization initiator (for example, a thermal polymerization initiator, a photopolymerization initiator, etc.) can be used. In addition, a polymerization initiator can be used individually or in combination of 2 or more types.

作為熱聚合起始劑,例如可例舉:2,2'-偶氮二異丁腈(AIBN)、2,2'-偶氮雙-2-甲基丁腈(AMBN)、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸、2,2'-偶氮雙(4-甲氧基-2,4-二甲基戊腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、1,1'-偶氮雙(環己烷-1-甲腈)、2,2'-偶氮雙(2,4,4-三甲基戊烷)等偶氮系起始劑;過氧化苯甲醯、第三丁基過氧化氫、二第三丁基過氧化物、過氧化苯甲酸第三丁酯、二異丙苯基過氧化物、1,1-雙(第三丁基過氧基)-3,3,5-三甲基環己烷、1,1-雙(第三丁基過氧基)環十二烷等過氧化物系起始劑等。再者,於進行溶液聚合之情形時,較佳為使用油溶性之聚合起始劑。又,熱聚合起始劑可單獨使用或組合使用2種以上。As a thermal polymerization initiator, for example, 2,2'-azobisisobutyronitrile (AIBN), 2,2'-azobis-2-methylbutyronitrile (AMBN), 2,2' -Azobis(2-methylpropionic acid) dimethyl ester, 4,4'-azobis-4-cyanovaleric acid, 2,2'-azobis(4-methoxy-2,4 -Dimethylvaleronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2 '-Azobis(2,4,4-trimethylpentane) and other azo initiators; benzyl peroxide, tertiary butyl hydroperoxide, di-tertiary butyl peroxide, peroxide tert-butyl benzoate, dicumyl peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis A peroxide-based initiator such as (tert-butylperoxy)cyclododecane and the like. Furthermore, in the case of performing solution polymerization, it is preferable to use an oil-soluble polymerization initiator. Moreover, a thermal polymerization initiator can be used individually or in combination of 2 or more types.

作為上述熱聚合起始劑之使用量,並無特別限定,例如,相對於丙烯酸系聚合物(B)之全部單體單元(構成丙烯酸系聚合物(B)之單體成分總量)100重量份為0.1~15重量份。The usage-amount of the said thermal polymerization initiator is not specifically limited, For example, it is 100 weight with respect to all monomeric units of acrylic polymer (B) (total amount of monomer components constituting acrylic polymer (B)) part is 0.1 to 15 parts by weight.

又,作為上述光聚合起始劑,並無特別限定,例如可例舉與上述所例舉之於丙烯酸系聚合物(A)之聚合時所使用之光聚合起始劑相同之光聚合起始劑。上述光聚合起始劑之使用量並無特別限定,可適當選擇。In addition, the photopolymerization initiator is not particularly limited, and for example, the same photopolymerization initiator as the photopolymerization initiator used in the polymerization of the acrylic polymer (A) mentioned above can be mentioned. agent. The usage-amount of the said photoinitiator is not specifically limited, It can select suitably.

於上述丙烯酸系聚合物(B)之聚合時,為了調整分子量(具體而言,將重量平均分子量調整為1000~30000),可使用鏈轉移劑。作為上述鏈轉移劑,例如可例舉:2-巰基乙醇、α-硫代甘油、2,3-二巰基-1-丙醇、辛基硫醇、第三壬基硫醇、十二烷基硫醇(月桂基硫醇)、第三-十二烷基硫醇、縮水甘油基硫醇、硫代乙醇酸、硫代乙醇酸甲酯、硫代乙醇酸乙酯、硫代乙醇酸丙酯、硫代乙醇酸丁酯、硫代乙醇酸第三丁酯、硫代乙醇酸2-乙基己酯、硫代乙醇酸辛酯、硫代乙醇酸異辛酯、硫代乙醇酸癸酯、硫代乙醇酸十二烷基酯、乙二醇之硫代乙醇酸酯、新戊二醇之硫代乙醇酸酯、季戊四醇之硫代乙醇酸酯、α-甲基苯乙烯二聚物等。其中,就抑制加濕引起之黏著片材之白化之觀點而言,較佳為α-硫代甘油、硫代乙醇酸甲酯,尤佳為α-硫代甘油。再者,鏈轉移劑可單獨使用或組合使用2種以上。At the time of superposition|polymerization of the said acrylic polymer (B), in order to adjust a molecular weight (specifically, to adjust a weight average molecular weight to 1000-30000), a chain transfer agent can be used. As said chain transfer agent, 2-mercaptoethanol, alpha-thioglycerol, 2, 3- dimercapto- 1-propanol, octyl mercaptan, tertiary nonyl mercaptan, dodecyl, for example, can be mentioned. Thiol (lauryl mercaptan), tri-dodecyl mercaptan, glycidyl mercaptan, thioglycolic acid, methyl thioglycolate, ethyl thioglycolate, propyl thioglycolate , butyl thioglycolate, tert-butyl thioglycolate, 2-ethylhexyl thioglycolate, octyl thioglycolate, isooctyl thioglycolate, decyl thioglycolate, sulfur Dodecyl glycolate, thioglycolic acid ester of ethylene glycol, thioglycolic acid ester of neopentyl glycol, thioglycolic acid ester of pentaerythritol, α-methylstyrene dimer, etc. Among them, from the viewpoint of suppressing whitening of the adhesive sheet due to humidification, α-thioglycerol and methyl thioglycolate are preferred, and α-thioglycerol is particularly preferred. In addition, a chain transfer agent can be used individually or in combination of 2 or more types.

上述鏈轉移劑之含量(使用量)並無特別限定,相對於丙烯酸系聚合物(B)之全部單體單元(構成丙烯酸系聚合物(B)之單體成分總量)100重量份,較佳為0.1~20重量份,更佳為0.2~15重量份,進而較佳為0.3~10重量份,進而更佳為0.5~5重量份,尤佳為0.75~3重量份。藉由將鏈轉移劑之含量(使用量)設為上述範圍,可容易地獲得重量平均分子量被控制為1000~30000之丙烯酸系聚合物。The content (amount of use) of the above chain transfer agent is not particularly limited, but is more than 0.1-20 weight part is preferable, 0.2-15 weight part is more preferable, 0.3-10 weight part is still more preferable, 0.5-5 weight part is still more preferable, 0.75-3 weight part is especially preferable. By making the content (amount of use) of the chain transfer agent in the above-mentioned range, an acrylic polymer whose weight average molecular weight is controlled to be 1,000 to 30,000 can be easily obtained.

上述丙烯酸系聚合物(B)之重量平均分子量(Mw)為1000~30000,較佳為1000~20000,更佳為1500~10000,進而較佳為2000~8000,尤佳為4000~6000。由於丙烯酸系聚合物(B)之重量平均分子量為1000以上,故而黏著力或保持特性提高,耐發泡剝離性提高。另一方面,由於丙烯酸系聚合物(B)之重量平均分子量為30000以下,故而容易提高黏著力,耐發泡剝離性提高。The weight average molecular weight (Mw) of the acrylic polymer (B) is 1,000-30,000, preferably 1,000-20,000, more preferably 1,500-10,000, still more preferably 2,000-8,000, particularly preferably 4,000-6,000. Since the weight-average molecular weight of the acrylic polymer (B) is 1,000 or more, the adhesive force and the holding properties are improved, and the foaming and peeling resistance is improved. On the other hand, since the weight-average molecular weight of the acrylic polymer (B) is 30,000 or less, the adhesive force is easily improved, and the foaming and peeling resistance is improved.

上述丙烯酸系聚合物(B)之重量平均分子量(Mw)可藉由GPC法進行聚苯乙烯換算而求出。例如可使用Tosoh股份有限公司製造之高速GPC裝置「HPLC-8120GPC」,藉由下述條件進行測定。 管柱:TSKgel SuperHZM-H/HZ4000/HZ3000/HZ2000 溶劑:四氫呋喃 流速:0.6 ml/分鐘 The weight average molecular weight (Mw) of the said acrylic polymer (B) can be calculated|required by polystyrene conversion by GPC method. For example, the measurement can be performed under the following conditions using a high-speed GPC apparatus "HPLC-8120GPC" manufactured by Tosoh Co., Ltd. Column: TSKgel SuperHZM-H/HZ4000/HZ3000/HZ2000 Solvent: Tetrahydrofuran Flow rate: 0.6 ml/min

上述丙烯酸系聚合物(B)之玻璃轉移溫度(Tg)並無特別限定,較佳為20~300℃,更佳為30~250℃,進而較佳為40~200℃,進而較佳為50~150℃,進而較佳為60~120℃,進而較佳為70~100℃,尤佳為80~90℃。若丙烯酸系聚合物(B)之玻璃轉移溫度為20℃以上,則容易提高耐發泡剝離性而較佳。又,若丙烯酸系聚合物(B)之玻璃轉移溫度為300℃以下,則黏著劑層具有適度之柔軟性,容易獲得良好之黏著力或良好之階差吸收性,容易獲得優異之接著可靠性,因此較佳。The glass transition temperature (Tg) of the acrylic polymer (B) is not particularly limited, but is preferably 20 to 300°C, more preferably 30 to 250°C, more preferably 40 to 200°C, and still more preferably 50 ~150°C, more preferably 60 to 120°C, still more preferably 70 to 100°C, particularly preferably 80 to 90°C. When the glass transition temperature of the acrylic polymer (B) is 20° C. or higher, it is easy to improve the foaming peeling resistance, which is preferable. In addition, if the glass transition temperature of the acrylic polymer (B) is 300° C. or lower, the adhesive layer has moderate flexibility, and it is easy to obtain good adhesive force or good level difference absorption, and it is easy to obtain excellent adhesion reliability. , so it is better.

上述丙烯酸系聚合物(B)之玻璃轉移溫度(Tg)為由上述FOX之式所表示之玻璃轉移溫度(理論值)。 作為上述構成丙烯酸系聚合物(B)之單體之均聚物之Tg,可採用下述表1所記載之值。又,作為表1未記載之單體之均聚物之Tg,可採用「Polymer Handbook」(第3版,John Wiley & Sons, Inc,1989年)所記載之數值。進而,作為上述文獻亦未記載之單體之均聚物之Tg,可採用藉由上述測定方法所得之值(利用黏彈性試驗獲得之tanδ之峰頂溫度)。 The glass transition temperature (Tg) of the said acrylic polymer (B) is the glass transition temperature (theoretical value) represented by the formula of the said FOX. As Tg of the homopolymer of the monomer which comprises the said acrylic polymer (B), the value described in the following Table 1 can be employ|adopted. In addition, as Tg of the homopolymer of the monomer not described in Table 1, the numerical value described in "Polymer Handbook" (3rd edition, John Wiley & Sons, Inc., 1989) can be used. Furthermore, as the Tg of the homopolymer of the monomer not described in the above-mentioned document, the value obtained by the above-mentioned measurement method (the peak top temperature of tan δ obtained by the viscoelasticity test) can be used.

[表1] 表1    組成 Tg[℃] 均聚物 甲基丙烯酸甲酯(MMA) 105 甲基丙烯酸二環戊酯(DCPMA) 175 丙烯酸二環戊酯(DCPA) 120 甲基丙烯酸異𦯉基酯(IBXMA) 173 丙烯酸異𦯉基酯(IBXA) 97 甲基丙烯酸環己酯(CHMA) 66 甲基丙烯酸1-金剛烷基酯(ADMA) 250 丙烯酸1-金剛烷基酯(ADA) 153 共聚物 DCPMA/MMA=60/40 144 再者,表1中之「DCPMA/MMA=60/40」之共聚物意指DCPMA 60重量份與MMA 40重量份之共聚物。 [Table 1] Table 1 composition Tg[℃] Homopolymer Methyl Methacrylate (MMA) 105 Dicyclopentyl methacrylate (DCPMA) 175 Dicyclopentyl acrylate (DCPA) 120 Isoyl methacrylate (IBXMA) 173 Isoyl Acrylate (IBXA) 97 Cyclohexyl Methacrylate (CHMA) 66 1-Adamantyl methacrylate (ADMA) 250 1-Adamantyl Acrylate (ADA) 153 Copolymer DCPMA/MMA=60/40 144 Furthermore, the copolymer of "DCPMA/MMA=60/40" in Table 1 means a copolymer of 60 parts by weight of DCPMA and 40 parts by weight of MMA.

本發明之黏著劑組合物含有丙烯酸系聚合物(A)及(B)之情形時之丙烯酸系聚合物(B)之含量並無特別限定,相對於上述丙烯酸系聚合物(A)100重量份,較佳為1~30重量份,更佳為2~20重量份,進而較佳為2~10重量份,進而更佳為2~5重量份。即,上述黏著劑組合物中之丙烯酸系聚合物(B)之含量並無特別限定,相對於上述丙烯酸系聚合物(A)之全部單體單元100重量份,較佳為1~30重量份,更佳為2~20重量份,進而較佳為2~10重量份,進而更佳為2~5重量份。本發明之黏著劑組合物中之丙烯酸系聚合物(B)之含量並無特別限定,例如,相對於上述單體混合物100重量份,較佳為1~30重量份,更佳為2~20重量份,進而較佳為2~10重量份,進而更佳為2~5重量份。若丙烯酸系聚合物(B)之含量為1重量份以上,則容易獲得優異之接著性及優異之耐發泡剝離性而較佳。又,若丙烯酸系聚合物(B)之含量為30重量份以下,則容易獲得優異之透明性與接著可靠性而較佳。When the adhesive composition of the present invention contains the acrylic polymers (A) and (B), the content of the acrylic polymer (B) is not particularly limited, and is based on 100 parts by weight of the above acrylic polymer (A). , preferably 1 to 30 parts by weight, more preferably 2 to 20 parts by weight, still more preferably 2 to 10 parts by weight, still more preferably 2 to 5 parts by weight. That is, the content of the acrylic polymer (B) in the above-mentioned adhesive composition is not particularly limited, but is preferably 1 to 30 parts by weight relative to 100 parts by weight of all monomer units of the above-mentioned acrylic polymer (A) , more preferably 2 to 20 parts by weight, still more preferably 2 to 10 parts by weight, still more preferably 2 to 5 parts by weight. The content of the acrylic polymer (B) in the adhesive composition of the present invention is not particularly limited, for example, relative to 100 parts by weight of the monomer mixture, preferably 1-30 parts by weight, more preferably 2-20 parts by weight The weight part is more preferably 2 to 10 parts by weight, still more preferably 2 to 5 parts by weight. When the content of the acrylic polymer (B) is 1 part by weight or more, excellent adhesiveness and excellent foaming peeling resistance are easily obtained, which is preferable. Moreover, when content of an acrylic polymer (B) is 30 weight part or less, it is easy to obtain excellent transparency and adhesive reliability, and it is preferable.

作為含有丙烯酸系聚合物(A)及(B)之上述黏著劑組合物之製作方法,並無特別限定。例如,視需要於構成丙烯酸系聚合物(A)之單體成分之混合物或構成丙烯酸系聚合物(A)之單體成分之混合物之部分聚合物(形成丙烯酸系聚合物(A)之單體混合物或其部分聚合物)中添加丙烯酸系聚合物(B)、添加劑等並加以混合,經此製作上述黏著劑組合物。It does not specifically limit as a manufacturing method of the said adhesive composition containing an acrylic polymer (A) and (B). For example, if necessary, in the mixture of the monomer components constituting the acrylic polymer (A) or the partial polymer of the mixture of the monomer components constituting the acrylic polymer (A) (monomers constituting the acrylic polymer (A) An acrylic polymer (B), an additive, etc. are added to a mixture or its partial polymer), and it mixes, and the said adhesive composition is produced by this.

[1-9.橡膠系聚合物] 作為本發明之黏著劑組合物之其他較佳之一實施形態,可例舉以橡膠系聚合物作為主要成分之橡膠系黏著劑組合物。作為橡膠系聚合物,可例舉:天然橡膠;苯乙烯丁二烯橡膠(SBR);聚異戊二烯(PIP);聚異丁烯(PIB);以丁烯(指1-丁烯、及順式-或反式-2-丁烯)及/或2-甲基丙烯(異丁烯)作為主要單體之丁烯系聚合物;A-B-A型嵌段共聚物橡膠及其氫化物,例如苯乙烯-丁二烯-苯乙烯嵌段共聚物橡膠(SBS)、苯乙烯-異戊二烯-苯乙烯嵌段共聚物橡膠(SIS)、苯乙烯-異丁烯-苯乙烯嵌段共聚物橡膠(SIBS)、苯乙烯-乙烯/異戊二烯-苯乙烯嵌段共聚物橡膠(SVIS)、作為SBS之氫化物之苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物橡膠(SEBS)、作為SIS之氫化物之苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物橡膠(SEPS)等各種橡膠系聚合物。該等橡膠系聚合物可單獨使用1種或可組合使用2種以上。 [1-9. Rubber-based polymer] As another preferred embodiment of the adhesive composition of the present invention, a rubber-based adhesive composition containing a rubber-based polymer as a main component can be exemplified. Examples of the rubber-based polymer include: natural rubber; styrene butadiene rubber (SBR); polyisoprene (PIP); polyisobutylene (PIB); Butene-based polymers with formula- or trans-2-butene) and/or 2-methylpropene (isobutylene) as main monomers; A-B-A type block copolymer rubbers and their hydrogenated products, such as styrene-butyl Diene-styrene block copolymer rubber (SBS), styrene-isoprene-styrene block copolymer rubber (SIS), styrene-isobutylene-styrene block copolymer rubber (SIBS), benzene Ethylene-ethylene/isoprene-styrene block copolymer rubber (SVIS), styrene-ethylene-butylene-styrene block copolymer rubber (SEBS) as hydride of SBS, hydride as SIS Various rubber-based polymers such as styrene-ethylene-propylene-styrene block copolymer rubber (SEPS). These rubber-based polymers may be used alone or in combination of two or more.

本發明之黏著劑組合物就於高頻帶下之進一步之低介電常數化、低介電損失化之觀點而言,除了上述基礎聚合物以外,可含有無機微粒子、有機微粒子、基礎聚合物以外之聚合物材料,亦可將該等單獨含有或組合含有2種以上。作為上述無機微粒子、有機微粒子,就於高頻帶下之低介電常數化、低介電損失化之觀點而言,較佳為表現出絕緣性者(絕緣性填料)。The adhesive composition of the present invention may contain inorganic fine particles, organic fine particles, and base polymers in addition to the above-mentioned base polymer from the viewpoint of further lowering the dielectric constant and lowering the dielectric loss in the high frequency band. These polymer materials may be contained alone or in combination of two or more. As the inorganic fine particles and organic fine particles, those exhibiting insulating properties (insulating fillers) are preferred from the viewpoint of lowering the dielectric constant and lowering the dielectric loss in the high frequency band.

[1-10.無機微粒子] 作為可於本發明之黏著劑組合物中調配之無機微粒子,並無特別限定,例如可例舉:二氧化矽、氧化鋁、氧化鋯、氧化鈦等金屬氧化物;硼酸鋁、氫氧化鋁等金屬鹽、雲母等礦物、中空奈米二氧化矽等具有中空結構之無機微粒子等,可將該等單獨使用或組合使用2種以上。 [1-10. Inorganic fine particles] The inorganic fine particles that can be formulated in the adhesive composition of the present invention are not particularly limited, and examples thereof include metal oxides such as silicon dioxide, aluminum oxide, zirconium oxide, and titanium oxide; aluminum borate, aluminum hydroxide, etc. Metal salts, minerals such as mica, inorganic fine particles having a hollow structure such as hollow nano-silica, etc., may be used alone or in combination of two or more.

上述無機微粒子就基礎聚合物中之分散性之觀點而言,較佳為經實施表面處理者。作為表面處理劑,可無限制地使用公知或慣用者,例如可例舉:矽烷偶合劑、鈦偶合劑、有機酸、多元醇、聚矽氧等,較佳為矽烷偶合劑。作為矽烷偶合劑,可例舉:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、二甲基乙烯基甲氧基矽烷、二甲基乙烯基乙氧基矽烷、甲基乙烯基二甲氧基矽烷、甲基乙烯基二乙氧基矽烷、乙烯基三(2-甲氧基)矽烷、乙烯基三乙醯氧基矽烷、2-甲基丙烯醯氧基乙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基-丙基甲基二甲氧基矽烷、三乙氧基苯基矽烷、三甲氧基苯基矽烷、二甲氧基二苯基矽烷、甲基二乙氧基苯基矽烷、二甲氧基甲基苯基矽烷等。The above-mentioned inorganic fine particles are preferably those subjected to surface treatment from the viewpoint of dispersibility in the base polymer. As a surface treatment agent, a well-known or conventional thing can be used without limitation, For example, a silane coupling agent, a titanium coupling agent, an organic acid, a polyol, a polysiloxane, etc. are mentioned, Preferably it is a silane coupling agent. As a silane coupling agent, vinyltrimethoxysilane, vinyltriethoxysilane, dimethylvinylmethoxysilane, dimethylvinylethoxysilane, methylvinyldimethylsilane may, for example, be mentioned. Oxysilane, methylvinyldiethoxysilane, vinyltris(2-methoxy)silane, vinyltriacetoxysilane, 2-methacryloyloxyethyltriethoxysilane , 3-methacryloyloxypropyltrimethoxysilane, 3-methacryloyloxypropyltriethoxysilane, 3-methacryloyloxy-propylmethyldimethoxysilane , Triethoxyphenylsilane, trimethoxyphenylsilane, dimethoxydiphenylsilane, methyldiethoxyphenylsilane, dimethoxymethylphenylsilane, etc.

上述無機微粒子之粒徑(D50)並無特別限定,就黏著劑組合物之於高頻帶下之低介電常數化、低介電損失化、透明性之觀點而言,較佳為1~100 nm,更佳為5~80 nm,進而較佳為10~50 nm。再者,上述中心粒徑意指藉由雷射繞射/散射法所測得之粒度分佈中之以累計值50%計之粒徑(中值徑)。The particle size (D50) of the above-mentioned inorganic fine particles is not particularly limited, but is preferably 1 to 100 from the viewpoints of low dielectric constant, low dielectric loss, and transparency of the adhesive composition in high frequency bands. nm, more preferably 5 to 80 nm, still more preferably 10 to 50 nm. In addition, the above-mentioned central particle diameter means the particle diameter (median diameter) at 50% of the cumulative value in the particle size distribution measured by the laser diffraction/scattering method.

於本發明之黏著劑組合物含有無機微粒子之情形時,其含量並無特別限定,就黏著劑組合物之於高頻帶下之低介電常數化、低介電損失化、透明性之觀點而言,相對於基礎聚合物(100重量份),通常為0.01~30重量份,較佳為0.05~25重量份,更佳為0.1~20重量份,進而較佳為0.15~10重量份,尤佳為0.2~5重量份。When the adhesive composition of the present invention contains inorganic fine particles, the content thereof is not particularly limited, and is considered from the viewpoints of low dielectric constant, low dielectric loss, and transparency of the adhesive composition in high frequency bands. In other words, relative to the base polymer (100 parts by weight), it is usually 0.01 to 30 parts by weight, preferably 0.05 to 25 parts by weight, more preferably 0.1 to 20 parts by weight, further preferably 0.15 to 10 parts by weight, especially It is preferably 0.2 to 5 parts by weight.

[1-11.有機微粒子] 作為可於本發明之黏著劑組合物中調配之有機微粒子,並無特別限定,例如可例舉:苯乙烯系樹脂、丙烯酸系樹脂、聚矽氧系樹脂、丙烯酸-苯乙烯系樹脂、氯乙烯系樹脂、偏二氯乙烯系樹脂、醯胺系樹脂、胺基甲酸酯系樹脂、酚系樹脂、苯乙烯-共軛二烯系樹脂、丙烯酸-共軛二烯系樹脂、烯烴系樹脂、氟系樹脂等聚合物;或包含該等聚合物之交聯體之微粒子;進而藉由該等聚合物/聚合物交聯體以具有中空結構之方式構成之微粒子等,可將該等單獨使用或組合使用2種以上。 [1-11. Organic Microparticles] There are no particular limitations on the organic fine particles that can be formulated in the adhesive composition of the present invention, and examples thereof include styrene-based resins, acrylic-based resins, polysiloxane-based resins, acrylic-styrene-based resins, vinyl chloride resin, vinylidene chloride-based resin, amide-based resin, urethane-based resin, phenol-based resin, styrene-conjugated diene-based resin, acrylic-conjugated diene-based resin, olefin-based resin, Polymers such as fluorine-based resins; or microparticles comprising cross-linked products of these polymers; and micro-particles formed by these polymers/polymer cross-linked bodies to have a hollow structure, etc., these can be used alone Or use two or more in combination.

上述有機微粒子之粒徑(D50)並無特別限定,就黏著劑組合物之於高頻帶下之低介電常數化、低介電損失化、透明性之觀點而言,較佳為1~100 nm,更佳為5~80 nm,進而較佳為10~50 nm。再者,上述中心粒徑意指藉由雷射繞射/散射法所測得之粒度分佈中之以累計值50%計之粒徑(中值徑)。The particle diameter (D50) of the above-mentioned organic fine particles is not particularly limited, but is preferably 1 to 100 from the viewpoints of low dielectric constant, low dielectric loss, and transparency of the adhesive composition in high frequency bands. nm, more preferably 5 to 80 nm, still more preferably 10 to 50 nm. In addition, the above-mentioned central particle diameter means the particle diameter (median diameter) at 50% of the cumulative value in the particle size distribution measured by the laser diffraction/scattering method.

於本發明之黏著劑組合物含有有機微粒子之情形時,其含量並無特別限定,就黏著劑組合物之於高頻帶下之低介電常數化、低介電損失化、透明性之觀點而言,相對於基礎聚合物(100重量份),通常為0.01~30重量份,較佳為0.05~25重量份,更佳為0.1~20重量份,進而較佳為0.15~10重量份,尤佳為0.2~5重量份。When the adhesive composition of the present invention contains organic fine particles, the content thereof is not particularly limited, and is considered from the viewpoints of low dielectric constant, low dielectric loss, and transparency of the adhesive composition in high frequency bands. In other words, relative to the base polymer (100 parts by weight), it is usually 0.01 to 30 parts by weight, preferably 0.05 to 25 parts by weight, more preferably 0.1 to 20 parts by weight, further preferably 0.15 to 10 parts by weight, especially It is preferably 0.2 to 5 parts by weight.

[1-12.聚合物材料] 作為可於本發明之黏著劑組合物中調配之聚合物材料,並無特別限定,較佳為介電常數、介電損失較低且與基礎聚合物具有相容性者,例如可例舉:氟樹脂、氟橡膠、聚乙烯、聚丙烯、聚苯乙烯、聚碳酸酯、降𦯉烯系樹脂或與烯烴類之加成共聚合型樹脂、聚苯醚、雙馬來醯亞胺-三𠯤-樹脂、聚醚醯亞胺、聚醯亞胺、聚醚醚酮(PEEK)、液晶聚合物、橡膠-彈性體、氫化聚烯烴樹脂、萜烯、異戊二烯、萜烯酚樹脂、芳香族改性萜烯樹脂及該等之氫化樹脂等,可將該等單獨使用或組合使用2種以上。 [1-12. Polymer material] The polymer material that can be formulated in the adhesive composition of the present invention is not particularly limited, but preferably one with low dielectric constant and low dielectric loss and compatibility with the base polymer, such as: Fluorine resin, fluorine rubber, polyethylene, polypropylene, polystyrene, polycarbonate, nor-ene resin or addition copolymerization resin with olefins, polyphenylene ether, bismaleimide-tris - Resins, polyetherimide, polyimide, polyetheretherketone (PEEK), liquid crystal polymers, rubber-elastomers, hydrogenated polyolefin resins, terpenes, isoprene, terpene phenol resins, aromatics As for the group-modified terpene resin and these hydrogenated resins, these can be used alone or in combination of two or more.

於本發明之黏著劑組合物含有聚合物材料之情形時,其含量並無特別限定,就黏著劑組合物之於高頻帶下之低介電常數化、低介電損失化、透明性之觀點而言,相對於基礎聚合物(100重量份),通常為0.01~50重量份,較佳為0.05~40重量份,更佳為0.1~30重量份,進而較佳為0.15~20重量份,尤佳為0.2~10重量份。When the adhesive composition of the present invention contains a polymer material, its content is not particularly limited, from the viewpoints of low dielectric constant, low dielectric loss, and transparency of the adhesive composition in high frequency bands For the base polymer (100 parts by weight), it is usually 0.01 to 50 parts by weight, preferably 0.05 to 40 parts by weight, more preferably 0.1 to 30 parts by weight, and still more preferably 0.15 to 20 parts by weight, 0.2-10 weight part is especially preferable.

[1-13.防銹劑] 本發明之黏著劑組合物較佳為進而含有防銹劑。若於黏著劑層中含有防銹劑,則於可獲得針對天線元件、金屬配線之優異之防腐蝕效果之方面而言較佳。 [1-13. Rust inhibitor] The adhesive composition of the present invention preferably further contains a rust inhibitor. When a rust inhibitor is contained in the adhesive layer, it is preferable in that an excellent anticorrosion effect for antenna elements and metal wiring can be obtained.

防銹劑係防止金屬之鏽或腐蝕之化合物。作為防銹劑,並無特別限定,例如可例舉:胺化合物、苯并三唑系化合物、亞硝酸鹽類等。除此以外,亦可例舉:苯甲酸銨、鄰苯二甲酸銨、硬脂酸銨、棕櫚酸銨、油酸銨、碳酸銨、二環己胺苯甲酸鹽、脲、優洛托品(urotropin)、硫脲、胺基甲酸苯酯、N-環己基胺基甲酸環己基銨(CHC)等。再者,防銹劑可單獨使用或組合2種以上而使用。Rust inhibitors are compounds that prevent rust or corrosion of metals. Although it does not specifically limit as a rust inhibitor, For example, an amine compound, a benzotriazole type compound, a nitrite, etc. are mentioned. In addition, ammonium benzoate, ammonium phthalate, ammonium stearate, ammonium palmitate, ammonium oleate, ammonium carbonate, dicyclohexylamine benzoate, urea, urotropine (urotropin), thiourea, phenyl carbamate, cyclohexylammonium N-cyclohexylcarbamate (CHC), etc. In addition, a rust inhibitor can be used individually or in combination of 2 or more types.

作為上述胺化合物,例如可例舉:2-胺基-2-甲基-1-丙醇、單乙醇胺、單異丙醇胺、二乙基乙醇胺、氨或氨水等含羥基之胺化合物;嗎啉等環狀胺;環己胺等環狀烷基胺化合物;3-甲氧基丙基胺等直鏈狀烷基胺等。又,作為亞硝酸鹽類,例如可例舉:亞硝酸二環己基銨(DICHAN)、亞硝酸二異丙基銨(DIPAN)、亞硝酸鈉、亞硝酸鉀、亞硝酸鈣等。Examples of the above-mentioned amine compounds include hydroxyl-containing amine compounds such as 2-amino-2-methyl-1-propanol, monoethanolamine, monoisopropanolamine, diethylethanolamine, ammonia, or ammonia water; Cyclic amines such as cyclohexylamine; cyclic alkylamine compounds such as cyclohexylamine; linear alkylamines such as 3-methoxypropylamine, etc. Moreover, as a nitrite, dicyclohexylammonium nitrite (DICHAN), diisopropylammonium nitrite (DIPAN), sodium nitrite, potassium nitrite, calcium nitrite, etc. are mentioned, for example.

上述防銹劑之含量並無特別限定,相對於基礎聚合物100重量份,較佳為含有0.02~15重量份。若上述含量為0.02重量份以上,則容易獲得良好之腐蝕防止性能而較佳。另一方面,若上述含量未達15重量份,則容易確保透明性,又,容易確保耐發泡剝離性等接著可靠性而較佳。The content of the rust inhibitor is not particularly limited, but is preferably 0.02 to 15 parts by weight relative to 100 parts by weight of the base polymer. When the said content is 0.02 weight part or more, favorable corrosion prevention performance is easy to be obtained, and it is preferable. On the other hand, when the said content is less than 15 weight part, it is easy to ensure transparency, and it is easy to ensure adhesion reliability, such as foaming peeling resistance, and it is preferable.

其中,上述防銹劑就針對基礎聚合物之相容性、透明性之方面而言,較佳為苯并三唑系化合物。尤其是就可平衡性良好且以較高之水準獲得接著可靠性、透明性及腐蝕防止性之特性之方面及可獲得優異之外觀性之方面而言,上述防銹劑較佳為苯并三唑系化合物。Among them, the above-mentioned rust inhibitor is preferably a benzotriazole-based compound in terms of compatibility and transparency with respect to the base polymer. In particular, the above-mentioned rust inhibitor is preferably benzotrian in terms of good balance and high level of properties of adhesion reliability, transparency, and corrosion resistance, and excellent appearance can be obtained. azole compounds.

苯并三唑系化合物之含量並無特別限定,相對於基礎聚合物100重量份,較佳為0.02~3重量份,更佳為0.02~2.5重量份,進而較佳為0.02~2重量份。由於苯并三唑系化合物之量為一定以下,故而可確實地確保耐發泡剝離性等接著可靠性,進而亦可確實地防止黏著片材之霧度之上升。The content of the benzotriazole-based compound is not particularly limited, but is preferably 0.02 to 3 parts by weight, more preferably 0.02 to 2.5 parts by weight, and still more preferably 0.02 to 2 parts by weight relative to 100 parts by weight of the base polymer. Since the amount of the benzotriazole-based compound is below a certain level, adhesion reliability such as resistance to foaming and peeling can be surely ensured, and an increase in the haze of the adhesive sheet can also be surely prevented.

作為上述苯并三唑系化合物,只要為具有苯并三唑骨架之化合物,則並無特別限定,就可獲得更優異之防腐蝕效果之觀點而言,較佳為具有下述式(6)所表示之結構。 [化7]

Figure 02_image013
(其中,於上述式(6)中,R 2及R 3相同或不同,R 2為苯環上之取代基,表示碳數1~6之烷基、碳數1~6之烷氧基、碳數6~14之芳基、胺基、單或二C 1-10烷基胺基、胺基-C 1-6烷基、單或二C 1-10烷基胺基-C 1-6烷基、巰基、碳數1~6之烷氧基羰基、或碳數1~6之烷氧基等取代基,n為0~4之整數,於n為2以上之情形時,n個R 2可相同,亦可不同,R 3表示氫原子、碳數1~12之烷基、碳數1~12之烷氧基、碳數6~14之芳基、胺基、單或二C 1-10烷基胺基、胺基-C 1-6烷基、單或二C 1-10烷基胺基-C 1-6烷基、巰基、碳數1~12之烷氧基羰基、或碳數1~12之烷氧基等取代基) The above-mentioned benzotriazole-based compound is not particularly limited as long as it is a compound having a benzotriazole skeleton, and from the viewpoint of obtaining a more excellent anti-corrosion effect, it is preferably a compound having the following formula (6) represented structure. [hua 7]
Figure 02_image013
(wherein, in the above formula (6), R 2 and R 3 are the same or different, and R 2 is a substituent on the benzene ring, representing an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, Aryl, amine group, mono- or di-C 1-10 alkyl amine group, amino-C 1-6 alkyl group, mono- or di-C 1-10 alkyl amine group-C 1-6 with carbon number of 6-14 Substituents such as alkyl group, mercapto group, alkoxycarbonyl group having 1 to 6 carbon atoms, or alkoxy group having 1 to 6 carbon atoms, n is an integer of 0 to 4, and when n is 2 or more, n R 2 may be the same or different, and R 3 represents a hydrogen atom, an alkyl group with 1 to 12 carbon atoms, an alkoxy group with a carbon number of 1 to 12, an aryl group with 6 to 14 carbon atoms, an amine group, a single or two C 1 -10 alkylamino group, amino group-C 1-6 alkyl group, mono- or di-C 1-10 alkylamino group-C 1-6 alkyl group, mercapto group, alkoxycarbonyl group with 1 to 12 carbon atoms, or Substituents such as alkoxy with 1 to 12 carbon atoms)

就獲得更優異之防腐蝕效果之觀點而言,作為R 2,較佳為碳數1~3之烷基、烷氧基羰基等,更佳為甲基等。又,n較佳為0或1。 就同樣之觀點而言,作為R 3,較佳為氫原子、單或二C 1-10烷基胺基-C 1-6烷基等,更佳為氫原子、二C 1-8烷基胺基C 1-4烷基等。 From the viewpoint of obtaining a more excellent anti-corrosion effect, R 2 is preferably an alkyl group having 1 to 3 carbon atoms, an alkoxycarbonyl group, or the like, and more preferably a methyl group or the like. Moreover, n is preferably 0 or 1. From the same viewpoint, R 3 is preferably a hydrogen atom, a mono- or di-C 1-10 alkylamino-C 1-6 alkyl group, or the like, more preferably a hydrogen atom, a di-C 1-8 alkyl group Amino C 1-4 alkyl, etc.

[1-14.矽烷偶合劑] 本發明之黏著劑組合物較佳為進而含有矽烷偶合劑。若於黏著劑層中含有矽烷偶合劑,則於容易獲得對玻璃之優異接著性(尤其是於高溫高濕下對玻璃之優異之接著可靠性)之方面而言較佳。 [1-14. Silane coupling agent] The adhesive composition of the present invention preferably further contains a silane coupling agent. When a silane coupling agent is contained in an adhesive bond layer, it is preferable at the point which is easy to obtain the excellent adhesion|attachment to glass (especially excellent adhesion reliability to glass under high temperature and high humidity).

作為上述矽烷偶合劑,並無特別限定,可例舉:γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、γ-胺基丙基三甲氧基矽烷、N-苯基-胺基丙基三甲氧基矽烷等。其中,較佳為γ-縮水甘油氧基丙基三甲氧基矽烷。進而,作為上述矽烷偶合劑,例如亦可例舉商品名「KBM-403」(信越化學工業股份有限公司製造)等市售品。再者,矽烷偶合劑可單獨使用或組合使用2種以上。It does not specifically limit as said silane coupling agent, However, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-aminopropyltrimethoxysilane may, for example, be mentioned. Silane, N-phenyl-aminopropyltrimethoxysilane, etc. Among them, γ-glycidoxypropyltrimethoxysilane is preferable. Furthermore, as said silane coupling agent, a commercial item, such as a brand name "KBM-403" (made by Shin-Etsu Chemical Co., Ltd.), can also be mentioned, for example. In addition, a silane coupling agent can be used individually or in combination of 2 or more types.

上述矽烷偶合劑之含量並無特別限定,就提高對玻璃之接著可靠性之方面而言,相對於基礎聚合物100重量份,較佳為0.01~1重量份,更佳為0.03~0.5重量份。The content of the above-mentioned silane coupling agent is not particularly limited, but from the viewpoint of improving the bonding reliability to glass, it is preferably 0.01 to 1 part by weight, more preferably 0.03 to 0.5 part by weight with respect to 100 parts by weight of the base polymer .

[1-15.交聯劑] 本發明之黏著劑組合物較佳為進而含有交聯劑。若於黏著劑組合物中含有交聯劑,則基礎聚合物交聯而增大凝膠分率,容易提高耐發泡剝離性。例如,由於可使丙烯酸系聚合物交聯而容易增大凝膠分率之控制,故而容易提高耐發泡剝離性。作為上述交聯劑,例如除了氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑以外,可例舉:脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。其中,於上述黏著劑層為含有丙烯酸系聚合物作為基礎聚合物之黏著劑組合物之情形時,於提高耐發泡剝離性之方面而言,較佳為異氰酸酯系交聯劑、環氧系交聯劑,更佳為異氰酸酯系交聯劑。再者,交聯劑可單獨使用或組合使用2種以上。 [1-15. Cross-linking agent] The adhesive composition of the present invention preferably further contains a crosslinking agent. When a crosslinking agent is contained in the adhesive composition, the base polymer is crosslinked to increase the gel fraction, and it becomes easy to improve the foaming and peeling resistance. For example, since the acrylic polymer can be crosslinked and the control of the gel fraction can be easily increased, the resistance to foaming and peeling can be easily improved. As the above-mentioned crosslinking agent, for example, in addition to a cyanate-based crosslinking agent, an epoxy-based crosslinking agent, a melamine-based crosslinking agent, and a peroxide-based crosslinking agent, a urea-based crosslinking agent, a metal alkane, Oxide-based cross-linking agent, metal chelate-based cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, oxazoline-based cross-linking agent, aziridine-based cross-linking agent, amine Department of cross-linking agents, etc. Among them, when the above-mentioned adhesive layer is an adhesive composition containing an acrylic polymer as a base polymer, an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, an isocyanate-based crosslinking agent, an epoxy-based A crosslinking agent, more preferably an isocyanate-based crosslinking agent. In addition, a crosslinking agent can be used individually or in combination of 2 or more types.

作為上述異氰酸酯系交聯劑(多官能異氰酸酯化合物),例如可例舉:1,2-伸乙基二異氰酸酯、1,4-伸丁基二異氰酸酯、1,6-六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛酮二異氰酸酯、氫化甲苯二異氰酸酯、氫化二甲苯二異氰酸酯等脂環族聚異氰酸酯類;2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族聚異氰酸酯類等。又,作為上述異氰酸酯系交聯劑,例如亦可例舉:三羥甲基丙烷/甲苯二異氰酸酯加成物[Nippon Polyurethane Industry股份有限公司製造,商品名「Coronate L」]、三羥甲基丙烷/六亞甲基二異氰酸酯加成物[Nippon Polyurethane Industry股份有限公司製造,商品名「Coronate HL」]、三羥甲基丙烷/苯二甲基二異氰酸酯加成物[三井化學股份有限公司製造,商品名「Takenate D-110N」]等市售品。As said isocyanate type crosslinking agent (polyfunctional isocyanate compound), 1, 2- ethylidene diisocyanate, 1, 4- butylene diisocyanate, 1, 6- hexamethylene diisocyanate etc. are mentioned, for example Lower aliphatic polyisocyanates; cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate and other cycloaliphatic polyisocyanates; 2,4-toluene diisocyanate Aromatic polyisocyanates such as isocyanates, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate, and the like. Moreover, as said isocyanate type crosslinking agent, for example, a trimethylolpropane/toluene diisocyanate adduct [Nippon Polyurethane Industry Co., Ltd. make, brand name "Coronate L"], trimethylolpropane can also be mentioned, for example. / Hexamethylene diisocyanate adduct [manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL"], trimethylolpropane/xylylene diisocyanate adduct [manufactured by Mitsui Chemicals Co., Ltd., Commercial products such as the brand name "Takenate D-110N"].

作為上述環氧系交聯劑(多官能環氧化合物),例如可例舉:N,N,N',N'-四縮水甘油基-間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨糖醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨糖醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)異氰尿酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚、以及分子內具有2個以上環氧基之環氧系樹脂等。又,作為上述環氧系交聯劑,例如亦可例舉:Mitsubishi Gas Chemical股份有限公司製造,商品名「Tetrad C」等市售品。As the epoxy-based crosslinking agent (polyfunctional epoxy compound), for example, N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1, 3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, Propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan Anhydrous sugar polyglycidyl ether, trimethylolpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl tris(2-hydroxyethyl)isocyanurate , Resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule. Moreover, as said epoxy-type crosslinking agent, a Mitsubishi Gas Chemical Co., Ltd. make, brand name "Tetrad C" etc. are also mentioned, for example.

作為上述黏著劑組合物中之交聯劑之含量,並無特別限定,例如,於上述黏著劑組合物含有丙烯酸系聚合物作為基礎聚合物之情形時,相對於丙烯酸系聚合物100重量份,較佳為0.001~10重量份,更佳為0.01~5重量份。若交聯劑之含量為0.001重量份以上,則容易提高耐發泡剝離性而較佳。另一方面,若交聯劑之含量為10重量份以下,則黏著劑層具有適度之柔軟性,容易提高黏著力,因此較佳。The content of the crosslinking agent in the above-mentioned adhesive composition is not particularly limited. For example, when the above-mentioned adhesive composition contains an acrylic polymer as a base polymer, with respect to 100 parts by weight of the acrylic polymer, Preferably it is 0.001-10 weight part, More preferably, it is 0.01-5 weight part. When the content of the crosslinking agent is 0.001 part by weight or more, it is easy to improve the resistance to foaming and peeling, which is preferable. On the other hand, if the content of the crosslinking agent is 10 parts by weight or less, the adhesive layer has moderate flexibility, and it is easy to improve the adhesive force, which is preferable.

[1-16.添加劑] 於本發明之黏著劑組合物中可以不損及本發明之特性之範圍視需要含有抗氧化劑、交聯促進劑、黏著賦予樹脂(松香衍生物、聚萜烯樹脂、油溶性酚等)、防老化劑、著色劑(顏料或染料等)、紫外線吸收劑、鏈轉移劑、塑化劑、軟化劑、界面活性劑、抗靜電劑等公知之添加劑。再者,此種添加劑可單獨使用或組合使用2種以上。 [1-16. Additives] The adhesive composition of the present invention may contain antioxidants, cross-linking accelerators, adhesion-imparting resins (rosin derivatives, polyterpene resins, oil-soluble phenols, etc.), anti-oxidants, etc. Well-known additives such as aging agents, colorants (pigments or dyes, etc.), ultraviolet absorbers, chain transfer agents, plasticizers, softeners, surfactants, and antistatic agents. In addition, such an additive can be used individually or in combination of 2 or more types.

於本發明之黏著劑組合物含有黏著賦予劑之情形時,其含量就賦予適度之黏著性之觀點而言,相對於基礎聚合物100重量份,較佳為設為0.01重量份以上,更佳為設為0.05重量份以下。又,就避免剝離強度變得過高之觀點而言,相對於基礎聚合物100重量份,較佳為設為50重量份以下,更佳為設為40重量份以下。 又,於若干態樣中,於可藉由基礎聚合物之組成或Tg、黏著劑之凝膠分率等有效地控制黏著力之情形時,於不使用黏著賦予劑之態樣下亦可較佳地實施。 When the adhesive composition of the present invention contains an adhesion-imparting agent, the content thereof is preferably 0.01 part by weight or more with respect to 100 parts by weight of the base polymer from the viewpoint of imparting moderate adhesiveness, more preferably to be 0.05 part by weight or less. Moreover, from a viewpoint of preventing the peeling strength from becoming too high, it is preferable to set it as 50 weight part or less with respect to 100 weight part of base polymers, and it is more preferable to set it as 40 weight part or less. Also, in some aspects, when the adhesive force can be effectively controlled by the composition of the base polymer or Tg, the gel fraction of the adhesive, etc., it can also be compared without the use of an adhesive imparting agent. Well implemented.

[2.黏著劑層] [2-1.黏著劑層之介電常數、介電損失] 本發明之黏著劑層係由本發明之黏著劑組合物所形成,因此於高頻帶(28~60 GHz)之毫米波下表現出低介電常數、低介電損失。即,本發明之黏著劑層可抑制毫米波之輻射損失。 [2. Adhesive layer] [2-1. Dielectric constant and dielectric loss of adhesive layer] The adhesive layer of the present invention is formed by the adhesive composition of the present invention, so it exhibits low dielectric constant and low dielectric loss under the millimeter wave of high frequency band (28-60 GHz). That is, the adhesive layer of the present invention can suppress radiation loss of millimeter waves.

本發明之黏著劑層於頻率28 GHz下之介電常數較佳為5以下,更佳為4.5以下,進而較佳為4以下,進而更佳為3.5以下,亦可為3.4以下、3.3以下、3.2以下、3.1以下、3.0以下、或2.9以下。於頻率28 GHz下之介電常數之下限值並無特別限定,較佳為2以上,亦可為2.1以上、或2.2以上。The dielectric constant of the adhesive layer of the present invention at a frequency of 28 GHz is preferably 5 or less, more preferably 4.5 or less, still more preferably 4 or less, still more preferably 3.5 or less, and may also be 3.4 or less, 3.3 or less, 3.2 or less, 3.1 or less, 3.0 or less, or 2.9 or less. The lower limit value of the dielectric constant at a frequency of 28 GHz is not particularly limited, but is preferably 2 or more, and may be 2.1 or more, or 2.2 or more.

本發明之黏著劑層之於28 GHz下之介電常數可藉由如下方式進行調整,即對構成用以形成黏著劑層之黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。The dielectric constant of the adhesive layer of the present invention at 28 GHz can be adjusted by adjusting the type of the base polymer, the composition of monomers, and the amount of additives constituting the adhesive composition for forming the adhesive layer. The type or content can be adjusted.

本發明之黏著劑層於28 GHz下之介電損失被控制為較低,可抑制毫米波之輻射損失。本發明之黏著劑層於頻率28 GHz下之介電損失較佳為0.05以下,更佳為0.045以下,進而較佳為0.04以下,進而較佳為0.035以下,進而更佳為0.03以下,進而更佳為0.025以下,尤佳為0.02以下。於頻率28 GHz下之介電損失之下限值並無特別限定,較佳為0.0001以上,亦可為0.0005以上、或0.001以上。The dielectric loss of the adhesive layer of the present invention is controlled to be low at 28 GHz, and the radiation loss of millimeter waves can be suppressed. The dielectric loss of the adhesive layer of the present invention at a frequency of 28 GHz is preferably 0.05 or less, more preferably 0.045 or less, more preferably 0.04 or less, more preferably 0.035 or less, still more preferably 0.03 or less, and still more Preferably, it is 0.025 or less, and more preferably, it is 0.02 or less. The lower limit value of the dielectric loss at a frequency of 28 GHz is not particularly limited, but is preferably 0.0001 or more, and may be 0.0005 or more, or 0.001 or more.

本發明之黏著劑層之於28 GHz下之介電損失可藉由如下方式進行調整,即對構成用以形成黏著劑層之黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。The dielectric loss at 28 GHz of the adhesive layer of the present invention can be adjusted by adjusting the type of the base polymer, the composition of monomers, and the amount of additives constituting the adhesive composition for forming the adhesive layer. The type or content can be adjusted.

本發明之黏著劑層較佳為將於60 GHz下之介電常數控制為較低,於可抑制毫米波之輻射損失之方面而言較佳。本發明之黏著劑層於頻率60 GHz下之介電常數並無特別限定,較佳為5以下,更佳為4.5以下,進而較佳為4以下,進而更佳為3.5以下,亦可為3.4以下、3.3以下、3.2以下、3.1以下、3.0以下、或2.9以下。於頻率60 GHz下之介電常數之下限值並無特別限定,較佳為2以上,亦可為2.1以上、或2.2以上。The adhesive layer of the present invention is preferably controlled to have a low dielectric constant at 60 GHz, which is preferable in terms of suppressing radiation loss of millimeter waves. The dielectric constant of the adhesive layer of the present invention at a frequency of 60 GHz is not particularly limited, but is preferably 5 or less, more preferably 4.5 or less, still more preferably 4 or less, still more preferably 3.5 or less, and may also be 3.4 below, below 3.3, below 3.2, below 3.1, below 3.0, or below 2.9. The lower limit value of the dielectric constant at a frequency of 60 GHz is not particularly limited, but is preferably 2 or more, and may be 2.1 or more, or 2.2 or more.

本發明之黏著劑層之於60 GHz下之介電常數可藉由如下方式進行調整,即對構成用以形成黏著劑層之黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。The dielectric constant of the adhesive layer of the present invention at 60 GHz can be adjusted by adjusting the type of the base polymer, the composition of monomers, and the amount of additives constituting the adhesive composition for forming the adhesive layer. The type or content can be adjusted.

本發明之黏著劑層較佳為將於60 GHz下之介電損失控制為較低,於可抑制毫米波之輻射損失之方面而言較佳。本發明之黏著劑層於頻率60 GHz下之介電損失並無特別限定,較佳為0.05以下,更佳為0.045以下,進而較佳為0.04以下,進而較佳為0.035以下,進而更佳為0.03以下,進而更佳為0.025以下,尤佳為0.02以下,亦可為0.019以下、0.018以下、0.017以下、0.016以下、0.015以下、0.014以下、0.013以下、或0.012以下。於頻率60 GHz下之介電損失之下限值並無特別限定,較佳為0.0001以上,亦可為0.0005以上、或0.001以上。In the adhesive layer of the present invention, the dielectric loss at 60 GHz is preferably controlled to be low, and the radiation loss of the millimeter wave can be suppressed. The dielectric loss of the adhesive layer of the present invention at a frequency of 60 GHz is not particularly limited, and is preferably 0.05 or less, more preferably 0.045 or less, more preferably 0.04 or less, more preferably 0.035 or less, and still more preferably 0.03 or less, more preferably 0.025 or less, particularly preferably 0.02 or less, and may be 0.019 or less, 0.018 or less, 0.017 or less, 0.016 or less, 0.015 or less, 0.014 or less, 0.013 or less, or 0.012 or less. The lower limit value of the dielectric loss at a frequency of 60 GHz is not particularly limited, but is preferably 0.0001 or more, and may be 0.0005 or more, or 0.001 or more.

本發明之黏著劑層之於60 GHz下之介電損失可藉由如下方式進行調整,即對構成用以形成黏著劑層之黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。The dielectric loss at 60 GHz of the adhesive layer of the present invention can be adjusted by adjusting the type of the base polymer, the composition of monomers, and the amount of additives constituting the adhesive composition for forming the adhesive layer. The type or content can be adjusted.

[2-2.黏著劑層之霧度、全光線透過率] 本發明之黏著劑層為透明或具有透明性。因此,經由上述黏著劑層之視認性或外觀性優異。由此,本發明之黏著劑層可適宜地用於光學用途。 [2-2. Haze and total light transmittance of the adhesive layer] The adhesive layer of the present invention is transparent or has transparency. Therefore, the visibility and appearance through the above-mentioned adhesive layer are excellent. Thus, the adhesive layer of the present invention can be suitably used for optical applications.

本發明之黏著劑層之霧度(依照JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而較佳為0.9%以下,尤佳為0.8%以下。若霧度為1.2%以下,則可獲得優異之透明性或優異之外觀而較佳。再者,關於上述霧度,例如可製成黏著劑層(厚度:100 μm),將其於常態(23℃、50%RH)下靜置至少24小時後,貼合於載玻片(例如全光線透過率為91.8%、霧度為0.4%者),以所獲得者作為試樣,使用測霧計(村上色彩技術研究所股份有限公司製造,商品名「HM-150」)進行測定。The haze (according to JIS K7136) of the adhesive layer of the present invention is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, still more preferably 1.0% or less, still more preferably 0.9% or less, especially Preferably it is 0.8% or less. If the haze is 1.2% or less, excellent transparency or excellent appearance can be obtained, which is preferable. Furthermore, regarding the above-mentioned haze, for example, an adhesive layer (thickness: 100 μm) can be prepared, and after standing at a normal state (23° C., 50% RH) for at least 24 hours, it can be attached to a glass slide (e.g. A total light transmittance of 91.8% and a haze of 0.4%) were measured using a haze meter (manufactured by Murakami Color Technology Laboratory Co., Ltd., trade name "HM-150") using the obtained sample as a sample.

本發明之黏著劑層之可見光波長區域中之全光線透過率(依照JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而較佳為90%以上,進而較佳為91%以上,尤佳為92%以上。若全光線透過率為85%以上,則可獲得優異之透明性或優異之外觀而較佳。再者,關於上述全光線透過率,例如可製成黏著劑層(厚度:100 μm),將其於常態(23℃、50%RH)下靜置至少24小時後,於具有隔離膜之情形時將其剝離,貼合於載玻片(例如全光線透過率為91.8%、霧度為0.4%者),以所獲得者作為試樣,使用測霧計(村上色彩技術研究所股份有限公司製造,商品名「HM-150」)進行測定。The total light transmittance (according to JIS K7361-1) in the visible light wavelength region of the adhesive layer of the present invention is not particularly limited, but is preferably 85% or more, more preferably 88% or more, and more preferably 89% or more, More preferably, it is 90% or more, more preferably 91% or more, and still more preferably 92% or more. If the total light transmittance is 85% or more, excellent transparency or excellent appearance can be obtained, which is preferable. Furthermore, regarding the above-mentioned total light transmittance, for example, an adhesive layer (thickness: 100 μm) can be formed, and after it is allowed to stand for at least 24 hours under normal conditions (23° C., 50% RH), in the case of having an isolation film When peeling it off, attach it to a glass slide (for example, one with a total light transmittance of 91.8% and a haze of 0.4%), using the obtained sample as a sample, using a hazemeter (Murakami Color Institute Co., Ltd. manufacture, trade name "HM-150") was measured.

本發明之黏著劑層之霧度、全光線透過率可藉由如下方式進行調整,即對構成用以形成黏著劑層之黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量等進行調整。The haze and total light transmittance of the adhesive layer of the present invention can be adjusted by adjusting the type of the base polymer, the monomer composition, and the type of additives constituting the adhesive composition for forming the adhesive layer. or content, etc.

[2-3.黏著劑層之凝膠分率] 本發明之黏著劑層之凝膠分率(不溶成分之比率)並無特別限定,較佳為30~95%,更佳為35~90%,進而較佳為40~85%,進而更佳為45~80%,尤佳為50~75%。若凝膠分率為30%以上,則上述黏著劑層之凝集力提高,不易因操作產生凹痕,又,抑制於高溫環境下與被接著體之界面處之發泡或剝離,容易獲得優異之耐發泡剝離性,故而較佳。再者,若凝膠分率為95%以下,則可獲得適度之柔軟性,接著性、階差追隨性進一步提高,又,不易吸收異物,故而較佳。 [2-3. Gel fraction of adhesive layer] The gel fraction (ratio of insoluble components) of the adhesive layer of the present invention is not particularly limited, but is preferably 30 to 95%, more preferably 35 to 90%, still more preferably 40 to 85%, and still more 45 to 80%, preferably 50 to 75%. If the gel fraction is 30% or more, the cohesive force of the adhesive layer is improved, dents are not easily generated due to handling, and foaming or peeling at the interface with the adherend in a high-temperature environment is suppressed, and excellent results are easily obtained. It has better resistance to foaming and peeling. Furthermore, when the gel fraction is 95% or less, moderate flexibility can be obtained, adhesiveness and step followability are further improved, and foreign matter is not easily absorbed, which is preferable.

(凝膠分率) 上述凝膠分率(溶劑不溶成分之比率)具體而言,例如為藉由以下之「凝膠分率之測定方法」所算出之值。 (gel fraction) Specifically, the said gel fraction (ratio of a solvent-insoluble component) is a value calculated by the following "measurement method of gel fraction", for example.

自黏著片材採集黏著劑層:約0.1 g,包裹於平均孔徑0.2 μm之多孔質四氟乙烯片材(商品名「NTF1122」,日東電工股份有限公司製造)中後,以風箏線捆綁,測定此時之重量,將該重量設為浸漬前重量(Z)。再者,該浸漬前重量為黏著劑層(上述所採集之黏著劑層)、四氟乙烯片材、及風箏線之總重量。又,亦預先測定四氟乙烯片材與風箏線之合計重量,將該重量作為包裝袋重量(Y)。 繼而,將以四氟乙烯片材包裹黏著劑層並以風箏線捆綁而成者(稱為「樣品」)裝入充滿乙酸乙酯或甲苯之50 ml容器中,於23℃靜置7天。其後,自容器中取出樣品(乙酸乙酯或甲苯處理後),轉移至鋁製承杯中,以130℃在乾燥機中乾燥2小時而將乙酸乙酯或甲苯去除後,測定重量,以該重量作為浸漬後重量(X)。 然後,根據下述之式算出凝膠分率。 凝膠分率[%(重量%)]=(X-Y)/(Y-Z)×100 The adhesive layer collected from the self-adhesive sheet: about 0.1 g, wrapped in a porous tetrafluoroethylene sheet (trade name "NTF1122", manufactured by Nitto Denko Co., Ltd.) with an average pore diameter of 0.2 μm, tied with a kite string, and measured. The weight at this time was made into the weight (Z) before immersion. Furthermore, the weight before dipping is the total weight of the adhesive layer (the adhesive layer collected above), the tetrafluoroethylene sheet, and the kite string. In addition, the total weight of the tetrafluoroethylene sheet and the kite string was also measured in advance, and this weight was taken as the weight (Y) of the packaging bag. Then, the adhesive layer wrapped with tetrafluoroethylene sheet and bundled with kite string (referred to as "sample") was placed in a 50 ml container filled with ethyl acetate or toluene, and left to stand at 23° C. for 7 days. Then, the sample (after treatment with ethyl acetate or toluene) was taken out from the container, transferred to an aluminum beaker, dried in a dryer at 130° C. for 2 hours to remove ethyl acetate or toluene, and then the weight was measured to give This weight was taken as the weight after immersion (X). Then, the gel fraction was calculated according to the following formula. Gel fraction [% (weight %)]=(X-Y)/(Y-Z)×100

再者,凝膠分率例如可藉由用以形成黏著劑層之黏著劑組合物之基礎聚合物(例如丙烯酸系聚合物等)之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或使用量等進行控制。Furthermore, the gel fraction can be determined by, for example, the monomer composition, the weight average molecular weight, and the amount of the crosslinking agent used in the base polymer (eg, acrylic polymer, etc.) of the adhesive composition used to form the adhesive layer. Addition amount), the type or usage amount of other additives, etc.

[2-4.黏著劑層之儲存彈性模數] 本發明之黏著劑層於25℃下之儲存彈性模數並無特別限定,較佳為0.01 MPa以上,更佳為0.02 MPa以上,進而較佳為0.03 MPa以上,進而較佳為0.04 MPa以上,進而較佳為0.05 MPa以上,尤佳為0.1 MPa以上。若上述儲存彈性模數為0.01 MPa以上,則不易因操作產生凹痕,又,容易獲得良好之接著可靠性,故而較佳。又,就階差追隨性、異物吸收性之觀點而言,上述黏著劑層於25℃下之儲存彈性模數較佳為5 MPa以下,更佳為4.5 MPa以下,進而較佳為4.0 MPa以下,進而較佳為3.5 MPa以下,進而較佳為3.0 MPa以下,進而較佳為2.5 MPa以下,尤佳為2.0 MPa以下。黏著劑層之儲存彈性模數係於頻率1 Hz下實施動態黏彈性測定時所得者。上述儲存彈性模數為以複數表示之剪切彈性模數之實部,可考慮樣品之泊松比而換算為拉伸彈性模數等。 [2-4. Storage elastic modulus of adhesive layer] The storage elastic modulus of the adhesive layer of the present invention at 25°C is not particularly limited, and is preferably 0.01 MPa or more, more preferably 0.02 MPa or more, further preferably 0.03 MPa or more, and further preferably 0.04 MPa or more, More preferably, it is 0.05 MPa or more, and particularly preferably 0.1 MPa or more. When the storage elastic modulus is 0.01 MPa or more, dents are not easily generated due to handling, and good adhesion reliability is easily obtained, which is preferable. In addition, from the viewpoint of step followability and foreign matter absorption, the storage elastic modulus of the adhesive layer at 25°C is preferably 5 MPa or less, more preferably 4.5 MPa or less, and still more preferably 4.0 MPa or less , more preferably 3.5 MPa or less, still more preferably 3.0 MPa or less, still more preferably 2.5 MPa or less, particularly preferably 2.0 MPa or less. The storage elastic modulus of the adhesive layer is obtained when the dynamic viscoelasticity is measured at a frequency of 1 Hz. The above-mentioned storage elastic modulus is the real part of the shear elastic modulus expressed as a complex number, and can be converted into tensile elastic modulus, etc. in consideration of the Poisson's ratio of the sample.

本發明之黏著劑層之儲存彈性模數可藉由基礎聚合物(丙烯酸系聚合物)之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或使用量等進行控制。The storage elastic modulus of the adhesive layer of the present invention can be determined by the monomer composition of the base polymer (acrylic polymer), the weight average molecular weight, the use amount (addition amount) of the crosslinking agent, and the type or use amount of other additives. etc. to control.

[2-5.黏著劑層之300%拉伸殘留應力] 本發明之黏著劑層之300%拉伸殘留應力並無特別限定,較佳為2~24 N/cm 2,更佳為2.5~20 N/cm 2,進而較佳為3~16 N/cm 2。若上述300%拉伸殘留應力為2 N/cm 2以上,則容易獲得良好之耐發泡剝離性而較佳。又,若上述300%拉伸殘留應力為24 N/cm 2以下,則可獲得良好之應力緩和性,容易獲得良好之階差追隨性,而較佳。 [2-5. 300% tensile residual stress of the adhesive layer] The 300% tensile residual stress of the adhesive layer of the present invention is not particularly limited, but is preferably 2 to 24 N/cm 2 , more preferably 2.5 to 2.5 20 N/cm 2 , more preferably 3 to 16 N/cm 2 . When the above-mentioned 300% tensile residual stress is 2 N/cm 2 or more, good foaming peeling resistance can be easily obtained, which is preferable. In addition, when the 300% tensile residual stress is 24 N/cm 2 or less, good stress relaxation properties can be obtained, and good step followability can be easily obtained, which is preferable.

本發明之黏著片材若具有300%拉伸殘留應力為特定之範圍內之上述黏著劑層,則容易獲得優異之應力緩和性,容易發揮優異之階差追隨性。例如,對於較大之階差(例如,具有45 μm左右之高度之階差,尤其是具有20~50 μm之高度之階差)亦可良好地追隨。If the adhesive sheet of the present invention has the above-mentioned adhesive layer in which the 300% tensile residual stress is within a specific range, it is easy to obtain excellent stress relaxation properties and to exhibit excellent step followability. For example, it can also follow a relatively large level difference (for example, a level difference with a height of about 45 μm, especially a level difference with a height of 20 to 50 μm).

上述300%拉伸殘留應力係如下值(N/cm 2):於23℃ 50%RH之環境下,將黏著劑層沿著長度方向拉伸至伸長率(應變)300%,並保持該伸長率,求出自拉伸結束起經過300秒後對黏著劑層施加之拉伸荷重,以該拉伸荷重除以黏著劑層之初始之截面面積(拉伸前之截面面積)。再者,黏著劑層之初始之伸長率為100%。 The above-mentioned 300% tensile residual stress is the following value (N/cm 2 ): in an environment of 23°C and 50% RH, the adhesive layer is stretched along the length direction to an elongation (strain) of 300%, and the elongation is maintained. The tensile load applied to the adhesive layer after 300 seconds from the end of stretching was obtained, and the tensile load was divided by the initial cross-sectional area of the adhesive layer (the cross-sectional area before stretching). Furthermore, the initial elongation of the adhesive layer was 100%.

本發明之黏著劑層之300%拉伸殘留應力可藉由基礎聚合物(丙烯酸系聚合物)之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或使用量等進行控制。The 300% tensile residual stress of the adhesive layer of the present invention can be determined by the monomer composition of the base polymer (acrylic polymer), the weight average molecular weight, the use amount (addition amount) of the crosslinking agent, the type of other additives or Control the usage, etc.

[2-6.黏著劑層之厚度] 本發明之黏著劑層之厚度並無特別限定,較佳為10~500 μm,更佳為11~400 μm,進而較佳為12~350 μm,尤佳為12~300 μm。若厚度為一定以上,則階差追隨性或接著可靠性提高而較佳。又,若厚度為一定以下,則不易吸收操作中之異物,又,製造性尤其優異,而較佳。 [2-6. Thickness of adhesive layer] The thickness of the adhesive layer of the present invention is not particularly limited, and is preferably 10-500 μm, more preferably 11-400 μm, further preferably 12-350 μm, particularly preferably 12-300 μm. When the thickness is more than a certain level, step followability and adhesion reliability are improved, which is preferable. Moreover, when the thickness is below a certain level, foreign matter during handling is difficult to absorb, and the manufacturability is particularly excellent, which is preferable.

[2-7.黏著劑層之製造方法] 作為上述黏著劑層之製造方法,並無特別限定,例如可例舉將上述黏著劑組合物塗佈(塗敷)於基材或剝離襯墊上,視需要進行乾燥、硬化、或乾燥及硬化。硬化可藉由活性能量線之照射、加熱乾燥等進行。 [2-7. Manufacturing method of adhesive layer] It does not specifically limit as the manufacturing method of the said adhesive layer, For example, apply (coat) the said adhesive composition on a base material or a release liner, and dry, harden, or dry and harden as needed. . Hardening can be performed by irradiation of active energy rays, heating and drying, or the like.

再者,上述黏著劑組合物之塗佈(塗敷)亦可使用公知之塗佈法。例如可使用凹版輥式塗佈機、逆輥塗佈機、接觸輥塗佈機、浸漬輥塗佈機、棒式塗佈機、刮刀塗佈機、噴霧塗佈機、缺角輪塗佈機、直接塗佈機等塗佈機。In addition, the coating (coating) of the said adhesive composition can also use a well-known coating method. For example, a gravure roll coater, a reverse roll coater, a touch roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a notch roll coater can be used , Direct coating machine and other coating machines.

[3.黏著片材] 本發明之黏著片材只要具有上述本發明之黏著劑層即可,於其他方面並無特別限定。 [3. Adhesive sheet] The pressure-sensitive adhesive sheet of the present invention is not particularly limited in other respects as long as it has the pressure-sensitive adhesive layer of the present invention.

本發明之黏著片材可為兩面均成為黏著劑層表面之雙面黏著片材,亦可為僅單面成為黏著劑層表面之單面黏著片材。其中,就將兩個構件彼此貼合之觀點而言,較佳為雙面黏著片材。再者,於本說明書中,於提及「黏著片材」之情形時,亦包括帶狀者、即「黏著帶」。又,於本說明書中,存在將黏著劑層表面稱為「黏著面」之情形。The adhesive sheet of the present invention may be a double-sided adhesive sheet in which both sides become the surface of the adhesive layer, or a single-sided adhesive sheet in which only one side becomes the surface of the adhesive layer. Among them, a double-sided adhesive sheet is preferable from the viewpoint of bonding two members to each other. Furthermore, in this specification, when referring to the "adhesive sheet", a belt-shaped one, that is, an "adhesive tape" is also included. In addition, in this specification, the surface of an adhesive layer may be called "adhesion surface".

本發明之黏著片材可於使用之前於黏著面設置有隔離膜(剝離襯墊)。The adhesive sheet of the present invention may be provided with a release film (release liner) on the adhesive surface before use.

本發明之黏著片材可為不具有基材(基材層)、即所謂之「無基材型」之黏著片材(以下有時稱為「無基材之黏著片材」),亦可為具有基材之類型之黏著片材(以下有時稱為「附基材之黏著片材」)。作為上述無基材之黏著片材,例如可例舉:僅由上述黏著劑層構成之雙面黏著片材、或包含上述黏著劑層與上述黏著劑層以外之黏著劑層(有時稱為「其他黏著劑層」)之雙面黏著片材等。另一方面,作為附基材之黏著片材,可例舉於基材之至少單面側具有上述黏著劑層之黏著片材等。其中,較佳為無基材之黏著片材(無基材之雙面黏著片材),更佳為僅由上述黏著劑層構成之無基材之雙面黏著片材。又,亦較佳為於基材之兩面具有上述黏著劑層之黏著片材(附基材之雙面黏著片材)。上述附基材之雙面黏著片材中之兩面之黏著劑層可均為本發明之黏著劑層,亦可一者為本發明之黏著劑層而另一者為其他黏著劑層。再者,上述「基材(基材層)」中不含於使用(貼附)黏著片材時剝離之隔離膜。The adhesive sheet of the present invention may be an adhesive sheet without a base material (base material layer), that is, a so-called "base material-free type" (hereinafter sometimes referred to as a "base material-free adhesive sheet"), or may be It is a type of adhesive sheet with a base material (hereinafter sometimes referred to as "adhesive sheet with base material"). Examples of the above-mentioned base-free pressure-sensitive adhesive sheet include a double-sided pressure-sensitive adhesive sheet composed of only the above-mentioned pressure-sensitive adhesive layer, or a double-sided pressure-sensitive adhesive layer including the above-mentioned pressure-sensitive adhesive layer and other than the above-mentioned pressure-sensitive adhesive layer (sometimes referred to as the pressure-sensitive adhesive layer). "Other adhesive layer") double-sided adhesive sheet, etc. On the other hand, as an adhesive sheet with a base material, the adhesive sheet etc. which have the said adhesive bond layer on at least one side of a base material are mentioned. Among them, an adhesive sheet without a substrate (a double-sided adhesive sheet without a substrate) is preferable, and a double-sided adhesive sheet without a substrate composed of only the above-mentioned adhesive layer is more preferable. Moreover, it is also preferable that it is an adhesive sheet (double-sided adhesive sheet with a base material) which has the said adhesive bond layer on both surfaces of a base material. The adhesive layers on both sides of the above-mentioned double-sided adhesive sheet with base material can be the adhesive layers of the present invention, or one can be the adhesive layer of the present invention and the other can be other adhesive layers. In addition, the above-mentioned "substrate (substrate layer)" does not contain a release film that is peeled off when the adhesive sheet is used (attached).

本發明之黏著片材於為附基材之黏著片材之情形時,會產生基材引起之毫米波之輻射損失,因此較佳為無基材之黏著片材。但於基材包含低介電常數、低介電損失之材料之情形時,亦可為附基材之黏著片材。When the adhesive sheet of the present invention is an adhesive sheet with a base material, radiation loss of millimeter waves caused by the base material will occur, so it is preferably an adhesive sheet without a base material. However, when the base material includes materials with low dielectric constant and low dielectric loss, it can also be an adhesive sheet attached to the base material.

[3-1.黏著片材之180°剝離接著力] 本發明之黏著片材針對玻璃板之拉伸速度300 mm/分鐘下之180°剝離接著力(尤其是藉由本發明之黏著劑層所提供之黏著面針對玻璃板之180°剝離接著力)並無特別限定,就接著力越高越可獲得對天線元件之充分之密接之觀點而言,較佳為3 N/20 mm以上,更佳為3.5 N/20 mm以上,進而較佳為4 N/20 mm以上,進而較佳為5 N/20 mm,進而較佳為6 N/20 mm以上,進而較佳為7 N/20 mm以上,進而較佳為8 N/20 mm以上,進而較佳為9 N/20 mm以上,尤佳為10 N/20 mm以上。若本發明之黏著片材針對玻璃板之拉伸速度300 mm/分鐘下之180°剝離接著力為一定之值以上,則對玻璃之接著性、階差中之隆起之抑止性更優異。再者,本發明之黏著片材針對玻璃板之拉伸速度300 mm/分鐘下之180°剝離接著力之上限值並無特別限定,例如,較佳為30 N/20 mm以下,更佳為25 N/20 mm以下,進而較佳為22 N/20 mm以下,尤佳為20 N/20 mm以下,亦可為19 N/20 mm以下、18 N/20 mm以下、17 N/20 mm以下、16 N/20 mm以下、15 N/20 mm以下、14 N/20 mm以下、13 N/20 mm以下、12 N/20 mm以下、或11 N/20 mm以下。針對玻璃板之拉伸速度300 mm/分鐘下之180°剝離接著力可藉由下述180°剝離接著力之測定方法求出。 [3-1. 180° peeling force of adhesive sheet] The 180° peel adhesion of the adhesive sheet of the present invention to the glass plate at a tensile speed of 300 mm/min (especially the 180° peel adhesion of the adhesive surface provided by the adhesive layer of the present invention to the glass plate) and It is not particularly limited, but from the viewpoint that the higher the adhesive force, the more sufficient adhesion to the antenna element can be obtained, it is preferably 3 N/20 mm or more, more preferably 3.5 N/20 mm or more, and more preferably 4 N /20 mm or more, more preferably 5 N/20 mm, more preferably 6 N/20 mm or more, more preferably 7 N/20 mm or more, more preferably 8 N/20 mm or more, and more Preferably it is 9 N/20 mm or more, more preferably 10 N/20 mm or more. When the 180° peel adhesion force of the adhesive sheet of the present invention to a glass plate at a tensile speed of 300 mm/min is a certain value or more, it is more excellent in the adhesion to glass and the suppression of bulging in the level difference. Furthermore, the upper limit of the 180° peel adhesion force of the adhesive sheet of the present invention is not particularly limited with respect to the tensile speed of the glass plate at 300 mm/min. For example, it is preferably 30 N/20 mm or less, more preferably It is 25 N/20 mm or less, more preferably 22 N/20 mm or less, particularly preferably 20 N/20 mm or less, and may be 19 N/20 mm or less, 18 N/20 mm or less, 17 N/20 mm or less, 16 N/20 mm or less, 15 N/20 mm or less, 14 N/20 mm or less, 13 N/20 mm or less, 12 N/20 mm or less, or 11 N/20 mm or less. The 180° peel adhesion force at a tensile speed of 300 mm/min for a glass plate can be obtained by the following measuring method of 180° peel adhesion force.

作為上述玻璃板,並無特別限定,例如可例舉商品名「鈉鈣玻璃 #0050」(松浪硝子工業股份有限公司製造)。又,亦可例舉無鹼玻璃或化學強化玻璃等。Although it does not specifically limit as said glass plate, For example, a brand name "soda lime glass #0050" (made by Matsunami Glass Co., Ltd.) can be mentioned. Moreover, alkali-free glass, chemically strengthened glass, etc. can also be mentioned.

(180°剝離接著力之測定方法) 將黏著片材之黏著面貼合於被接著體,於2 kg輥、往返一次之壓接條件下進行壓接,於23℃、50%RH之環境下老化30分鐘。老化後,依照JIS Z 0237,於23℃、50%RH之環境下,於拉伸速度300 mm/分鐘、剝離角度180°之條件下,自被接著體剝離黏著片材,測定180°剝離接著力(N/20 mm)。 (Measurement method of 180° peel adhesion) The adhesive surface of the adhesive sheet was attached to the body to be adhered, and it was crimped under the conditions of crimping with a 2 kg roller and one round trip, and aged at 23°C and 50% RH for 30 minutes. After aging, in accordance with JIS Z 0237, under the conditions of 23°C, 50% RH, under the conditions of a tensile speed of 300 mm/min and a peeling angle of 180°, the adhesive sheet was peeled off from the adherend, and the 180° peeling adhesion was measured. force (N/20 mm).

本發明之黏著片材之180°剝離接著力可藉由基礎聚合物(丙烯酸系聚合物)之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或使用量等進行控制。The 180° peeling adhesive force of the adhesive sheet of the present invention can be determined by the monomer composition of the base polymer (acrylic polymer), the weight average molecular weight, the use amount (addition amount) of the crosslinking agent, the type or use of other additives quantity etc. to be controlled.

[3-2.黏著片材之厚度] 本發明之黏著片材之厚度(總厚度)並無特別限定,較佳為10~500 μm,更佳為11~400 μm,進而較佳為12~350 μm,較佳為12~300 μm。若厚度為一定以上,則階差部位不易發生剝離而較佳。又,若厚度為一定以下,則於製造時容易保持優異之外觀而較佳。再者,本發明之黏著片材之厚度不包括隔離膜之厚度。 [3-2. Thickness of adhesive sheet] The thickness (total thickness) of the adhesive sheet of the present invention is not particularly limited, but is preferably 10-500 μm, more preferably 11-400 μm, still more preferably 12-350 μm, more preferably 12-300 μm. When the thickness is more than a certain level, peeling is less likely to occur at the level difference portion, which is preferable. Moreover, it is preferable that it is easy to maintain the outstanding external appearance at the time of manufacture when the thickness is below a certain level. Furthermore, the thickness of the adhesive sheet of the present invention does not include the thickness of the release film.

[3-3.黏著片材之霧度、全光線透過率] 本發明之黏著片材之霧度(依照JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而較佳為0.9%以下,尤佳為0.8%以下。若霧度為1.2%以下,則可獲得優異之透明性或優異之外觀而較佳。再者,關於上述霧度,例如可將黏著片材於常態(23℃、50%RH)下靜置至少24小時後,於具有隔離膜之情形時將其剝離,貼合於載玻片(例如全光線透過率為91.8%、霧度為0.4%者),以所獲得者作為試樣,使用測霧計(村上色彩技術研究所股份有限公司製造,商品名「HM-150」)進行測定。 [3-3. Haze and total light transmittance of the adhesive sheet] The haze (according to JIS K7136) of the adhesive sheet of the present invention is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, still more preferably 1.0% or less, further preferably 0.9% or less, especially Preferably it is 0.8% or less. If the haze is 1.2% or less, excellent transparency or excellent appearance can be obtained, which is preferable. Furthermore, regarding the above-mentioned haze, for example, the adhesive sheet can be left to stand for at least 24 hours under normal conditions (23° C., 50% RH), then peeled off when there is a separator, and attached to a glass slide ( For example, with a total light transmittance of 91.8% and a haze of 0.4%), a haze meter (manufactured by Murakami Color Technology Laboratory Co., Ltd., trade name "HM-150") was used as a sample for measurement. .

本發明之黏著片材之可見光波長區域中之全光線透過率(依照JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而較佳為90%以上,進而較佳為91%以上,尤佳為92%以上。若全光線透過率為85%以上,則可獲得優異之透明性或優異之外觀而較佳。再者,關於上述全光線透過率,例如可將黏著片材於常態(23℃、50%RH)下靜置至少24小時後,於具有隔離膜之情形時將其剝離,貼合於載玻片(例如全光線透過率為91.8%、霧度為0.4%者),以所獲得者作為試樣,使用測霧計(村上色彩技術研究所股份有限公司製造,商品名「HM-150」)進行測定。The total light transmittance (according to JIS K7361-1) in the visible light wavelength region of the adhesive sheet of the present invention is not particularly limited, but is preferably 85% or more, more preferably 88% or more, and further preferably 89% or more, More preferably, it is 90% or more, more preferably 91% or more, and still more preferably 92% or more. If the total light transmittance is 85% or more, excellent transparency or excellent appearance can be obtained, which is preferable. Furthermore, regarding the above-mentioned total light transmittance, for example, the adhesive sheet can be left standing for at least 24 hours under normal conditions (23° C., 50% RH), then peeled off when there is a separator, and attached to a glass slide. A sheet (for example, one with a total light transmittance of 91.8% and a haze of 0.4%) was used as a sample, and a hazemeter (manufactured by Murakami Color Institute Co., Ltd., trade name "HM-150") was used. to measure.

本發明之黏著片材之霧度、全光線透過率可藉由調整構成用以形成黏著劑層之黏著劑組合物之基礎聚合物之種類、單體組成、添加劑之種類或含量、基材種類或厚度等進行調整。The haze and total light transmittance of the adhesive sheet of the present invention can be adjusted by adjusting the type of base polymer, the composition of monomers, the type or content of additives, and the type of substrates constituting the adhesive composition for forming the adhesive layer. or thickness, etc.

[3-4.黏著片材之製造方法] 本發明之黏著片材並無特別限定,較佳為依照公知或慣用之製造方法進行製造。例如,於本發明之黏著片材為無基材之黏著片材之情形時,可藉由利用上述方法於隔離膜上形成上述黏著劑層而獲得。又,於本發明之黏著片材為附基材之黏著片材之情形時,可藉由將上述黏著劑層直接形成於基材之表面而獲得(直印法),亦可藉由暫時於隔離膜上形成上述黏著劑層後,轉印(貼合)至基材,藉此於基材上設置上述黏著劑層而獲得(轉印法)。 [3-4. Manufacturing method of adhesive sheet] The adhesive sheet of the present invention is not particularly limited, and is preferably produced according to a known or conventional production method. For example, when the adhesive sheet of the present invention is an adhesive sheet without a base material, it can be obtained by forming the above-mentioned adhesive layer on the release film by the above-mentioned method. In addition, when the adhesive sheet of the present invention is an adhesive sheet with a base material, it can be obtained by directly forming the above-mentioned adhesive layer on the surface of the base material (direct printing method), or by temporarily placing the adhesive layer on the surface of the base material. After the above-mentioned adhesive layer is formed on the separator, it is transferred (bonded) to the base material, whereby the above-mentioned pressure-sensitive adhesive layer is provided on the base material to obtain (transfer method).

[3-5.黏著片材之其他層] 本發明之黏著片材除了上述黏著劑層以外,亦可具有其他層。作為其他層,例如可例舉:其他黏著劑層(上述黏著劑層以外之黏著劑層(藉由本發明之黏著劑組合物所形成之黏著劑層以外之黏著劑層))、中間層、下塗層等。再者,本發明之黏著片材可具有2層以上其他層。 [3-5. Other layers of adhesive sheet] The adhesive sheet of the present invention may have other layers in addition to the above-mentioned adhesive layer. Examples of other layers include other adhesive layers (adhesive layers other than the above-mentioned adhesive layers (adhesive layers other than the adhesive layers formed by the adhesive composition of the present invention)), intermediate layers, lower layers coating etc. Furthermore, the adhesive sheet of the present invention may have two or more other layers.

[3-6.黏著片材之基材] 作為本發明之黏著片材為附基材之黏著片材之情形時之基材,並無特別限定,例如可例舉:塑膠膜、抗反射(AR)膜、偏光板、相位差板等各種光學膜。作為上述塑膠膜等之素材,例如可例舉:聚對苯二甲酸乙二酯(PET)等聚酯系樹脂、聚甲基丙烯酸甲酯(PMMA)等(甲基)丙烯酸系樹脂、聚碳酸酯、三乙醯纖維素(TAC)、聚碸、聚芳酯、聚醯亞胺、聚氯乙烯、聚乙酸乙烯酯、聚乙烯、聚丙烯、乙烯-丙烯共聚物、商品名「ARTON(環狀烯烴系聚合物,JSR股份有限公司製造)」、商品名「ZEONOR(環狀烯烴系聚合物,Nippon Zeon股份有限公司製造)」等環狀烯烴系聚合物、氟系聚合物等塑膠材料。再者,該等塑膠材料可單獨使用或組合使用2種以上。又,亦可於上述基材之單面或兩面適當形成硬塗層、抗黏連層、抗反射層、抗靜電層、易接著層、防濕層之類之公知慣用之具有單一功能、或兼具複數種功能之表面處理層。又,上述「基材」係於將黏著片材貼附於被接著體時與黏著劑層一起貼附於被接著體之部分。於使用黏著片材時(貼附時)剝離之隔離膜(剝離襯墊)不包括於「基材」中。 [3-6. Base material for adhesive sheet] The base material in the case where the adhesive sheet of the present invention is an adhesive sheet with a base material is not particularly limited, for example, various kinds of plastic films, anti-reflection (AR) films, polarizing plates, retardation plates, etc. optical film. As a material of the said plastic film etc., for example, polyester resins, such as polyethylene terephthalate (PET), (meth)acrylic resins, such as polymethyl methacrylate (PMMA), polycarbonate, etc. Ester, triacetyl cellulose (TAC), polyamide, polyarylate, polyimide, polyvinyl chloride, polyvinyl acetate, polyethylene, polypropylene, ethylene-propylene copolymer, trade name "ARTON (cyclic Cyclic olefin-based polymers, manufactured by JSR Co., Ltd.)", trade names "ZEONOR (cyclic olefin-based polymers, manufactured by Nippon Zeon Co., Ltd.)" and other cyclic olefin-based polymers, fluorine-based polymers and other plastic materials. Furthermore, these plastic materials may be used alone or in combination of two or more. In addition, a hard coat layer, an anti-adhesion layer, an anti-reflection layer, an anti-static layer, an easy-bonding layer, a moisture-proof layer and the like can be appropriately formed on one or both sides of the above-mentioned substrate. A surface treatment layer with multiple functions. In addition, the above-mentioned "base material" is a part attached to the to-be-adhered body together with the adhesive layer when the pressure-sensitive adhesive sheet is attached to the to-be-adhered body. The release film (release liner) that is peeled off when the adhesive sheet is used (attached) is not included in the "substrate".

上述基材較佳為透明。上述基材之可見光波長區域中之全光線透過率(依照JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上。又,上述基材之霧度(依照JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而較佳為0.9%以下,尤佳為0.8%以下。作為此種透明之基材,例如可例舉:PET膜、或商品名「ARTON」、商品名「ZEONOR」等無配向膜等。尤其是無配向膜之特性不依賴於毫米波之電場之方向,因此較佳。The above-mentioned base material is preferably transparent. The total light transmittance (according to JIS K7361-1) of the above-mentioned base material in the visible light wavelength region is not particularly limited, but is preferably 85% or more, more preferably 88% or more. Moreover, the haze of the above-mentioned base material (according to JIS K7136) is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, still more preferably 1.0% or less, still more preferably 0.9% or less, particularly preferably 0.8% or less. As such a transparent base material, non-alignment films, such as a PET film, a brand name "ARTON", a brand name "ZEONOR", etc. are mentioned, for example. In particular, the properties of the non-aligned film do not depend on the direction of the millimeter-wave electric field, which is preferable.

上述基材之厚度並無特別限定,例如,較佳為12~500 μm。再者,上述基材可具有單層及多層之任一形態。又,可對上述基材之表面適當實施例如電暈放電處理、電漿處理、電子束處理等物理處理、底塗處理等化學處理等公知慣用之表面處理。The thickness of the said base material is not specifically limited, For example, it is preferable that it is 12-500 micrometers. In addition, the said base material may have any form of a single layer and a multilayer. In addition, known and conventional surface treatments such as physical treatments such as corona discharge treatment, plasma treatment, and electron beam treatment, and chemical treatments such as primer treatment can be appropriately performed on the surface of the above-mentioned base material.

[3-7.黏著片材之隔離膜] 本發明之黏著片材可於使用之前於黏著面設置有隔離膜(剝離襯墊)。再者,於本發明之黏著片材為雙面黏著片材之情形時,各黏著面可分別藉由兩片隔離膜加以保護,亦可藉由兩面成為剝離面之一片隔離膜以捲繞為卷狀之形態加以保護。隔離膜係作為黏著劑層之保護材使用,於貼附於被接著體時剝離。又,於本發明之黏著片材為無基材之黏著片材之情形時,隔離膜亦發揮作為黏著劑層之支持體之作用。再者,未必一定設置隔離膜。 [3-7. Release film for adhesive sheet] The adhesive sheet of the present invention may be provided with a release film (release liner) on the adhesive surface before use. Furthermore, when the adhesive sheet of the present invention is a double-sided adhesive sheet, each adhesive surface can be protected by two separate sheets of release film, or can be wound by using a piece of release film that becomes a peeling side on both sides. Protected in roll form. The separator is used as a protective material for the adhesive layer, and peels off when it is attached to the adherend. Moreover, in the case where the adhesive sheet of the present invention is an adhesive sheet without a base material, the release film also functions as a support for the adhesive layer. In addition, it is not always necessary to provide a separator.

作為上述隔離膜,可使用慣用之剝離紙等,並無特別限定。例如可例舉:具有剝離處理層之基材、包含氟聚合物之低接著性基材或包含無極性聚合物之低接著性基材等。作為上述具有剝離處理層之基材,例如可例舉藉由聚矽氧系、長鏈烷基系、氟系、硫化鉬等剝離處理劑進行表面處理之塑膠膜或紙等。作為上述包含氟聚合物之低接著性基材中之氟系聚合物,例如可例舉:聚四氟乙烯、聚氯三氟乙烯、聚氟乙烯、聚偏二氟乙烯、四氟乙烯-六氟丙烯共聚物、氯氟乙烯-偏二氟乙烯共聚物等。又,作為上述無極性聚合物,例如可例舉:烯烴系樹脂(例如,聚乙烯、聚丙烯等)等,亦可使用聚酯系基材(聚對苯二甲酸乙二酯系基材、聚萘二甲酸乙二酯系基材、聚對苯二甲酸丁二酯系基材等)等。再者,隔離膜可藉由公知或慣用之方法形成。又,隔離膜之厚度等亦無特別限定。As said separator, a conventional release paper etc. can be used, and it does not specifically limit. For example, a base material having a release treatment layer, a low-adhesion base material containing a fluoropolymer, or a low-adhesion base material containing a non-polar polymer can be mentioned. As the base material having the above-mentioned release treatment layer, for example, a plastic film, paper, etc., which are surface-treated with release treatment agents such as polysiloxane-based, long-chain alkyl-based, fluorine-based, and molybdenum sulfide, can be exemplified. Examples of the fluorine-based polymer in the above-mentioned fluoropolymer-containing low-adhesion base material include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, and tetrafluoroethylene-hexafluoroethylene. Fluoropropylene copolymer, chlorofluorovinylidene fluoride copolymer, etc. Moreover, as said nonpolar polymer, for example, olefin resins (for example, polyethylene, polypropylene, etc.) etc. are mentioned, polyester type base material (polyethylene terephthalate base material, polyethylene naphthalate-based substrates, polybutylene terephthalate-based substrates, etc.) and the like. Furthermore, the isolation film can be formed by a known or conventional method. Moreover, the thickness etc. of a separator are not specifically limited, either.

[3-8.黏著片材之用途等] 本發明之黏著片材由於具有本發明之黏著劑層,故而接著性及耐發泡剝離性優異,進而,應力緩和性優異,階差追隨性優異。因此,接著可靠性、尤其是高溫時之接著可靠性優異。又,外觀性優異。 [3-8. Application of adhesive sheet, etc.] Since the adhesive sheet of the present invention has the adhesive layer of the present invention, it is excellent in adhesiveness and foaming and peeling resistance, and further, it is excellent in stress relaxation property and excellent in step followability. Therefore, the adhesion reliability, especially the adhesion reliability at high temperature, is excellent. Moreover, it is excellent in appearance.

因此,本發明之黏著片材對於高溫時界面容易產生發泡之構件之貼合有用。例如,聚甲基丙烯酸甲酯樹脂(PMMA)存在包含未反應單體之情況,於高溫時容易產生異物引起之發泡。又,聚碳酸酯(PC)於高溫時容易產生水與二氧化碳之釋氣。本發明之黏著片材之耐發泡剝離性優異,因此對於包含此種樹脂之塑膠被接著體而言亦有用。Therefore, the adhesive sheet of the present invention is useful for laminating members whose interfaces are likely to foam at high temperatures. For example, polymethyl methacrylate resin (PMMA) may contain unreacted monomers, and it is easy to generate foaming caused by foreign matter at high temperature. In addition, polycarbonate (PC) is prone to outgassing of water and carbon dioxide at high temperatures. Since the adhesive sheet of the present invention is excellent in foaming and peeling resistance, it is also useful for a plastic adherend containing such a resin.

又,本發明之黏著片材除了對於線膨脹係數較小之被接著體有用以外,對於線膨脹係數較大之被接著體而言亦有用。再者,作為上述線膨脹係數較小之被接著體,並無特別限定,例如可例舉:玻璃板(線膨脹係數:0.3×10 -5~0.8×10 -5/℃)、聚對苯二甲酸乙二酯基材(PET膜,線膨脹係數:1.5×10 -5~2×10 -5/℃)等。又,作為上述線膨脹係數較大之被接著體,並無特別限定,例如可例舉線膨脹係數較大之樹脂基材,更具體而言,可例舉:聚碳酸酯樹脂基材(PC,線膨脹係數:7×10 -5~8×10 -5/℃)、聚甲基丙烯酸甲酯樹脂基材(PMMA,線膨脹係數:7×10 -5~8×10 -5/℃)、環烯烴聚合物基材(COP,線膨脹係數:6×10 -5~7×10 -5/℃)、商品名「ZEONOR」(Nippon Zeon股份有限公司製造)、商品名「ARTON」(JSR股份有限公司製造)等。 Moreover, the adhesive sheet of this invention is useful not only for the to-be-adhered body with a small linear expansion coefficient, but also for the to-be-adhered body with a large linear expansion coefficient. In addition, it does not specifically limit as a to-be-adhered body with a small linear expansion coefficient, For example, a glass plate (linear expansion coefficient: 0.3×10 -5 to 0.8×10 -5 /°C), polyparaphenylene An ethylene diformate base material (PET film, linear expansion coefficient: 1.5×10 -5 to 2×10 -5 /°C) and the like. In addition, as the adherend having a large linear expansion coefficient, it is not particularly limited, for example, a resin substrate having a large linear expansion coefficient can be exemplified, and more specifically, a polycarbonate resin substrate (PC , linear expansion coefficient: 7×10 -5 ~8×10 -5 /℃), polymethyl methacrylate resin substrate (PMMA, linear expansion coefficient: 7×10 -5 ~8×10 -5 /℃) , Cycloolefin polymer substrate (COP, coefficient of linear expansion: 6×10 -5 to 7×10 -5 /°C), trade name "ZEONOR" (manufactured by Nippon Zeon Co., Ltd.), trade name "ARTON" (JSR Co., Ltd.), etc.

本發明之黏著片材對於線膨脹係數較小之被接著體與線膨脹係數較大之被接著體之貼合而言有用。具體而言,本發明之黏著片材可較佳地用於玻璃被接著體(例如,玻璃板、化學強化玻璃、玻璃透鏡等)與上述線膨脹係數較大之樹脂基材之貼合。The adhesive sheet of the present invention is useful for bonding an adherend with a small coefficient of linear expansion and an adherend with a large coefficient of linear expansion. Specifically, the adhesive sheet of the present invention can be preferably used for laminating glass substrates (eg, glass plates, chemically strengthened glass, glass lenses, etc.) and the above-mentioned resin substrates with large linear expansion coefficients.

如上所述,本發明之黏著片材對於各種素材之被接著體彼此之貼合而言有用,尤其是對於玻璃被接著體與塑膠被接著體之貼合而言有用。再者,塑膠被接著體亦可為如表面具有ITO(銦與錫之氧化物)層之塑膠膜之光學膜。As described above, the adhesive sheet of the present invention is useful for bonding between adherends of various materials, especially for bonding a glass adherend and a plastic adherend. Furthermore, the plastic bonded body can also be an optical film such as a plastic film with an ITO (indium and tin oxide) layer on the surface.

進而,本發明之黏著片材除了對於表面平滑之被接著體而言有用以外,對於表面具有階差之被接著體而言亦有用。尤其是本發明之黏著片材即便玻璃被接著體及上述線膨脹係數較大之樹脂基材中之至少一者於表面具有階差,對於玻璃被接著體與上述線膨脹係數較大之樹脂基材之貼合而言亦有用。Furthermore, the adhesive sheet of the present invention is useful not only for an adherend having a smooth surface, but also for an adherend having a level difference on the surface. In particular, in the adhesive sheet of the present invention, even if at least one of the glass substrate and the resin substrate with the larger coefficient of linear expansion has a level difference on the surface, the glass substrate and the resin substrate with the larger coefficient of linear expansion are It is also useful for material bonding.

本發明之黏著片材可較佳地用於可攜式電子機器之製造用途。作為上述可攜式電子機器,例如可例舉:行動電話、PHS(Personal Handy-phone System,個人電話系統)、智慧型手機、平板(平板型電腦)、行動電腦(行動PC)、攜帶型資訊終端(PDA)、電子記事本、攜帶型電視或攜帶型收音機等攜帶型廣播接收機、攜帶型遊戲機、可攜式影音播放器、可攜式DVD(Digital Versatile Disc,數位多功能光碟)播放器、數位相機等相機、攝錄像機(camcorder)型之攝錄影機等。The adhesive sheet of the present invention can be preferably used in the manufacture of portable electronic devices. As the above-mentioned portable electronic equipment, for example, a mobile phone, a PHS (Personal Handy-phone System), a smart phone, a tablet (tablet computer), a mobile computer (mobile PC), a portable information device can be mentioned. Terminals (PDA), electronic notebooks, portable broadcast receivers such as portable TVs or portable radios, portable game consoles, portable audio-visual players, portable DVD (Digital Versatile Disc, Digital Versatile Disc) playback cameras, digital cameras and other cameras, camcorder-type camcorders, etc.

本發明之黏著片材可較佳地用於例如構成可攜式電子機器之構件或模組彼此之貼附、或者構成可攜式電子機器之構件或模組於殼體上之固定等。更具體而言,可例舉:覆蓋玻璃或透鏡(尤其是玻璃透鏡)與觸控面板或觸控感測器、天線模組之貼合、覆蓋玻璃或透鏡(尤其是玻璃透鏡)之於殼體上之固定、顯示面板之於殼體上之固定、天線模組之於殼體上之固定、片狀鍵盤或觸控面板等輸入裝置之於殼體上之固定、資訊顯示部之保護面板與殼體之貼合、殼體彼此之貼合、殼體與裝飾用片材之貼合、構成可攜式電子機器之各種構件或模組之固定或貼合等。再者,於本說明書中,顯示面板係指至少包含透鏡(尤其是玻璃透鏡)及觸控面板之結構物。又,本說明書中之透鏡係包括表現出光之折射作用之透明體及不具有光之折射作用之透明體之兩者的概念。即,本說明書中之透鏡中亦包括不具有折射作用之簡單之窗面板。The adhesive sheet of the present invention can be preferably used, for example, for attaching components or modules constituting a portable electronic machine to each other, or for fixing components or modules constituting a portable electronic machine on a casing. More specifically, it can be exemplified: the cover glass or lens (especially the glass lens) is attached to the touch panel or the touch sensor, the antenna module, the cover glass or the lens (especially the glass lens) is attached to the case Fixing on the body, Fixing the display panel on the casing, Fixing the antenna module on the casing, Fixing the input device such as a sheet keyboard or touch panel on the casing, Protecting the information display panel Lamination with the casing, lamination of the casings with each other, lamination of the casing and decorative sheets, fixing or lamination of various components or modules constituting a portable electronic machine, etc. Furthermore, in this specification, the display panel refers to a structure including at least a lens (especially a glass lens) and a touch panel. In addition, the lens in this specification includes the concept of both a transparent body which exhibits the refraction effect of light and a transparent body which does not have the refraction effect of light. That is, the lens in this specification also includes a simple window panel that does not have a refraction effect.

進而,本發明之黏著片材可較佳地用於光學用途。即,本發明之黏著片材較佳為用於光學用途之光學用黏著片材。更具體而言,例如較佳為用於貼合光學構件之用途(光學構件貼合用)或使用上述光學構件之製品(光學製品)之製造用途等。Furthermore, the adhesive sheet of the present invention can be preferably used for optical applications. That is, the adhesive sheet of the present invention is preferably an optical adhesive sheet used for optical applications. More specifically, for example, it is preferably used for the purpose of bonding an optical member (for optical member bonding), or the production use of a product (optical product) using the above-mentioned optical member.

[3-9.光學構件] 作為光學構件,可例舉至少具有本發明之黏著片材及基板之光學構件,且上述基板至少於單面具備金屬電極及配線(例如銅、銀、ITO配線等),於上述基板之具有上述金屬電極及配線一側之面上貼著有本發明之黏著劑層。再者,上述黏著片材可於使用之前於黏著面設置有隔離膜,上述光學構件中之上述黏著片材為使用時之黏著片材,因此不具有隔離膜。 [3-9. Optical components] Examples of the optical member include an optical member including at least the adhesive sheet of the present invention and a substrate, and the substrate is provided with metal electrodes and wirings (for example, copper, silver, ITO wiring, etc.) on at least one side, and the substrate has the above-mentioned The adhesive layer of the present invention is adhered to one side of the metal electrode and the wiring. Furthermore, the above-mentioned adhesive sheet may be provided with a separator on the adhesive surface before use, and the above-mentioned adhesive sheet in the above-mentioned optical member is an adhesive sheet at the time of use, and therefore does not have a separator.

進而,上述光學構件較佳為於上述基板之具有上述金屬電極及配線一側之相反側具有上述黏著劑層,進而較佳為於上述基板之具有上述金屬電極及配線一側之相反側之面上貼著有上述黏著劑層。Furthermore, it is preferable that the said optical member has the said adhesive layer on the side opposite to the side which has the said metal electrode and the wiring of the said board|substrate, and it is more preferable that it has the said board|substrate on the side opposite to the side which has the said metal electrode and the wiring. The above-mentioned adhesive layer is attached thereon.

作為構成上述金屬電極及配線之材料,並無特別限定,例如可例舉:鈦、矽、鈮、銦、鋅、錫、金、銀、銅、鋁、鈷、鉻、鎳、鉛、鐵、鈀、鉑、鎢、鋯、鉭、鉿等金屬;ITO(銦與錫之氧化物)、氧化鋅、氧化錫等金屬氧化物。進而,亦可例舉含有2種以上該等金屬、金屬氧化物者、或以該等金屬作為主要成分之合金。其中,就導電性之方面而言,較佳為金、銀、銅、ITO,就導電性及成本之方面而言,更佳為銀、銅、ITO,就透明性之方面而言進而較佳為ITO。即,上述金屬電極及配線較佳為銀、銅或ITO配線,尤佳為ITO配線。再者,構成下文所述之毫米波天線元件之材料亦為同樣。 上述金屬電極及配線為了防止金屬之反射引起之視認性降低而將電極及/或配線隱蔽,以此為目的,可藉由形成該金屬之氮化物、氧化物、硫化物等皮膜而實施黑化處理。 The material constituting the above-mentioned metal electrodes and wirings is not particularly limited, and examples thereof include titanium, silicon, niobium, indium, zinc, tin, gold, silver, copper, aluminum, cobalt, chromium, nickel, lead, iron, Palladium, platinum, tungsten, zirconium, tantalum, hafnium and other metals; ITO (indium and tin oxide), zinc oxide, tin oxide and other metal oxides. Furthermore, two or more kinds of these metals, metal oxides, or alloys containing these metals as a main component can also be exemplified. Among them, gold, silver, copper, and ITO are preferred in terms of conductivity, silver, copper, and ITO are more preferred in terms of conductivity and cost, and even more preferred in terms of transparency for ITO. That is, it is preferable that the said metal electrode and wiring are silver, copper, or ITO wiring, and it is especially preferable that it is ITO wiring. Furthermore, the same applies to the materials constituting the millimeter-wave antenna elements described below. The above-mentioned metal electrodes and wirings can be blackened by forming a film of nitride, oxide, sulfide, etc. of the metal by concealing the electrodes and/or wiring in order to prevent the reduction of visibility caused by the reflection of the metal. deal with.

光學構件係指具有光學特性(例如,偏光性、光折射性、光散射性、光反射性、光透過性、光吸收性、光繞射性、旋光性、視認性、電磁波透過性等)之構件。作為構成上述光學構件之基板,並無特別限定,例如可例舉構成顯示裝置(圖像顯示裝置)、輸入裝置等機器(光學機器)、天線模組之基板或該等機器所使用之基板,例如可例舉:偏光板、波長板、相位差板、光學補償膜、增亮膜、導光板、反射膜、抗反射膜、天線基板、硬塗膜(對PET膜等塑膠膜之至少單面實施硬塗處理而成之膜)、透明導電膜(例如,表面具有ITO層之塑膠膜(較佳為PET-ITO、聚碳酸酯、環烯烴聚合物等ITO膜)等)、設計膜、裝飾膜、表面保護板、稜鏡、透鏡、彩色濾光片、透明基板(玻璃感測器、玻璃製顯示面板(LCD(liquid crystal display,液晶顯示器)等)、附透明電極之玻璃板等玻璃基板等)、或進而積層有該等之基板(有時將該等總稱為「功能性膜」)等。又,該等膜亦可具有金屬奈米線層或導電性高分子層等。又,亦可於該等膜網狀印刷金屬細線。又,該等膜亦可具有天線元件。再者,上述「板」及「膜」分別包括板狀、膜狀、片狀等形態,例如「偏光膜」包括「偏光板」及「偏光片材」等。又,「膜」包括膜感測器等。 上述金屬細線為了防止金屬之反射引起之視認性降低而隱蔽,以此為目的,可藉由形成該金屬之氮化物、氧化物、硫化物等皮膜而實施黑化處理。 Optical member refers to a material having optical properties (for example, polarization, light refraction, light scattering, light reflectivity, light transmittance, light absorption, light diffraction, optical rotation, visibility, electromagnetic wave transmittance, etc.). member. The substrate constituting the above-mentioned optical member is not particularly limited, and for example, a display device (image display device), a device (optical device) such as an input device, a substrate for an antenna module, or a substrate used for these devices may be mentioned. For example, polarizing plates, wavelength plates, retardation plates, optical compensation films, brightness enhancement films, light guide plates, reflective films, anti-reflection films, antenna substrates, hard coating films (for at least one side of plastic films such as PET films) Hard coating film), transparent conductive film (for example, plastic film with ITO layer on the surface (preferably ITO film such as PET-ITO, polycarbonate, cycloolefin polymer, etc.), etc.), design film, decoration Glass substrates such as film, surface protection plate, lens, lens, color filter, transparent substrate (glass sensor, glass display panel (LCD (liquid crystal display), etc.), glass plate with transparent electrodes, etc. etc.), or a substrate in which these are further laminated (these are sometimes collectively referred to as "functional films"), and the like. In addition, these films may have a metal nanowire layer, a conductive polymer layer, or the like. In addition, thin metal lines may be mesh-printed on these films. Moreover, these films may have an antenna element. In addition, the above-mentioned "plate" and "film" include forms such as plate shape, film shape, and sheet shape, respectively. For example, "polarizing film" includes "polarizing plate" and "polarizing sheet". In addition, "film" includes a film sensor and the like. The above-mentioned metal thin wires are concealed in order to prevent the reduction of visibility caused by the reflection of the metal, and for this purpose, a blackening treatment can be performed by forming a film such as nitride, oxide, or sulfide of the metal.

作為上述顯示裝置,例如可例舉:液晶顯示裝置、有機EL(電致發光)顯示裝置、PDP(電漿顯示面板)、電子紙等。又,作為上述輸入裝置,可例舉觸控面板等。又,作為天線模組,可例舉下文揭示之毫米波天線等。As said display apparatus, a liquid crystal display apparatus, an organic EL (electroluminescence) display apparatus, a PDP (plasma display panel), an electronic paper etc. are mentioned, for example. Moreover, as said input device, a touch panel etc. are mentioned. Moreover, as an antenna module, the millimeter-wave antenna etc. which are disclosed below can be mentioned.

作為構成上述光學構件之基板,並無特別限定,例如可例舉:包含玻璃、丙烯酸樹脂、聚碳酸酯、聚對苯二甲酸乙二酯、環烯烴聚合物、金屬薄膜等之基板(例如,片狀或膜狀、板狀之基板等)等。再者,本發明中之「光學構件」如上所述,亦包括顯示裝置或輸入裝置保持視認性並且發揮加飾或保護之作用之構件(設計膜、裝飾膜或表面保護膜等)。The substrate constituting the optical member is not particularly limited, and examples thereof include substrates including glass, acrylic resin, polycarbonate, polyethylene terephthalate, cycloolefin polymer, metal thin film, and the like (for example, Sheet-like or film-like, plate-like substrates, etc.) Furthermore, the "optical member" in the present invention is as described above, and also includes a member (design film, decorative film, surface protection film, etc.) that maintains the visibility of the display device or the input device and plays a role of decoration or protection.

若本發明之黏著片材為附基材之黏著片材,且上述黏著片材構成具有光學特性之構件,則上述基材可同視為上述基板,可認為上述光學構件亦為本發明之黏著片材。If the adhesive sheet of the present invention is an adhesive sheet with a base material, and the above-mentioned adhesive sheet constitutes a member having optical properties, the above-mentioned base material can be regarded as the above-mentioned substrate, and the above-mentioned optical member can also be regarded as the above-mentioned adhesive sheet of the present invention. material.

於本發明之黏著片材為附基材之黏著片材,且使用上述功能性膜作為上述基材之情形時,亦可將本發明之黏著片材用作於功能性膜之至少單面側具有上述黏著劑層之「黏著型功能性膜」。When the adhesive sheet of the present invention is a substrate-attached adhesive sheet and the above-mentioned functional film is used as the above-mentioned substrate, the adhesive sheet of the present invention can also be used as at least one side of the functional film An "adhesive-type functional film" having the above-mentioned adhesive layer.

[3-10.毫米波天線] 本發明之黏著片材具有於毫米波等高頻帶下之介電常數、介電損失較低之黏著劑層(本發明之黏著劑層),因此可抑制毫米波之輻射損失。因此,本發明之黏著片材對於將構成用於毫米波通信之天線(毫米波天線)之構件貼合之用途而言有用。 於本說明書中,「毫米波通信」意指於20 GHz~300 GHz之頻帶下之通信。 [3-10. Millimeter wave antenna] The adhesive sheet of the present invention has an adhesive layer (the adhesive layer of the present invention) with low dielectric constant and low dielectric loss in high frequency bands such as millimeter waves, so that radiation loss of millimeter waves can be suppressed. Therefore, the adhesive sheet of the present invention is useful for bonding a member constituting an antenna for millimeter wave communication (millimeter wave antenna). In this specification, "millimeter wave communication" means communication in the frequency band of 20 GHz to 300 GHz.

作為構成毫米波天線之構件,可例舉至少於單面具備用以發送接收毫米波之天線元件(以下有時稱為「毫米波天線元件」)之基板(以下有時稱為「毫米波天線基板」)。As a member constituting a millimeter wave antenna, a substrate (hereinafter sometimes referred to as a "millimeter wave antenna") including an antenna element (hereinafter sometimes referred to as a "millimeter wave antenna element") for transmitting and receiving millimeter waves on at least one side can be mentioned. substrate").

作為毫米波天線基板,可例示上述黏著片材之基材所使用之塑膠膜,就可抑制毫米波之輻射損失之觀點而言,較佳為低介電常數、低介電損失之素材,尤佳為商品名「ARTON(環狀烯烴系聚合物,JSR股份有限公司製造)」、商品名「ZEONOR(環狀烯烴系聚合物,Nippon Zeon股份有限公司製造)」等環狀烯烴系聚合物。As the millimeter wave antenna substrate, the plastic film used as the base material of the above-mentioned adhesive sheet can be exemplified. From the viewpoint of suppressing the radiation loss of the millimeter wave, a material with low dielectric constant and low dielectric loss is preferable, especially Cyclic olefin-based polymers such as trade name "ARTON (cyclic olefin-based polymer, manufactured by JSR Co., Ltd.)" and trade name "ZEONOR (cyclic olefin-based polymer, manufactured by Nippon Zeon Co., Ltd.)" are preferable.

毫米波天線基板之於28 GHz及或60 GHz下之介電常數就抑制毫米波之輻射損失之觀點而言,較佳為2.0~5.0,更佳為2.1~4.5,進而較佳為2.2~4.0,進而較佳為2.2~3.5,進而較佳為2.2~3.4,進而較佳為2.2~3.3,進而較佳為2.2~3.2,進而較佳為2.2~3.1,尤佳為2.2~3.0。又,毫米波天線基板之於28 GHz及或60 GHz下之介電損失就抑制毫米波之輻射損失之觀點而言,較佳為0.0001~0.05,更佳為0.001~0.02,進而較佳為0.002~0.019,進而較佳為0.003~0.018,進而較佳為0.004~0.017,進而較佳為0.005~0.016,進而較佳為0.006~0.015,進而較佳為0.007~0.014,進而較佳為0.008~0.013,進而較佳為0.009~0.012,尤佳為0.01~0.011。The dielectric constant of the millimeter wave antenna substrate at 28 GHz and/or 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, and still more preferably 2.2 to 4.0 from the viewpoint of suppressing the radiation loss of the millimeter wave. , more preferably 2.2-3.5, still more preferably 2.2-3.4, still more preferably 2.2-3.3, still more preferably 2.2-3.2, still more preferably 2.2-3.1, particularly preferably 2.2-3.0. In addition, the dielectric loss of the millimeter-wave antenna substrate at 28 GHz and/or 60 GHz is preferably 0.0001 to 0.05, more preferably 0.001 to 0.02, and still more preferably 0.002 from the viewpoint of suppressing the radiation loss of the millimeter wave. ~0.019, more preferably 0.003~0.018, still more preferably 0.004~0.017, still more preferably 0.005~0.016, still more preferably 0.006~0.015, still more preferably 0.007~0.014, still more preferably 0.008~0.013 , more preferably 0.009 to 0.012, particularly preferably 0.01 to 0.011.

毫米波天線基板較佳為透明。毫米波天線基板之可見光波長區域中之全光線透過率(依照JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而較佳為90%以上,進而較佳為91%以上,尤佳為92%以上。又,毫米波天線基板之霧度(依照JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而較佳為0.9%以下,尤佳為0.8%以下。The millimeter-wave antenna substrate is preferably transparent. The total light transmittance (according to JIS K7361-1) in the visible light wavelength region of the millimeter-wave antenna substrate is not particularly limited, preferably 85% or more, more preferably 88% or more, more preferably 89% or more, and more It is preferably 90% or more, more preferably 91% or more, and particularly preferably 92% or more. In addition, the haze of the millimeter-wave antenna substrate (according to JIS K7136) is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, more preferably 1.0% or less, further preferably 0.9% or less, especially Preferably it is 0.8% or less.

毫米波天線基板之厚度就安裝毫米波天線元件並且抑制毫米波之輻射損失之觀點而言,較佳為5~250 μm。再者,毫米波天線基板可具有單層及多層之任一形態。又,可對毫米波天線基板之表面適當實施例如電暈放電處理、電漿處理等物理處理、底塗處理等化學處理、硬塗層等塗佈層等公知慣用之表面處理。The thickness of the millimeter-wave antenna substrate is preferably 5 to 250 μm from the viewpoint of mounting the millimeter-wave antenna element and suppressing radiation loss of the millimeter-wave. Furthermore, the millimeter-wave antenna substrate may have either a single-layer or a multi-layer form. The surface of the millimeter-wave antenna substrate can be appropriately subjected to known and conventional surface treatments such as physical treatments such as corona discharge treatment and plasma treatment, chemical treatments such as primer treatment, and coating layers such as hard coat layers.

作為毫米波天線基板所具備之毫米波天線元件,只要可發送接收毫米波,則無特別限定,就利用智慧型手機等攜帶通信機器高效地接收毫米波之觀點而言,可較佳地使用相位陣列天線。相位陣列天線係將複數個天線元件排列為陣列狀,並對各天線元件之相位進行控制,藉此可向所需之方向發送接收之天線。即,相位陣列天線可不論天線之方向如何,藉由對各天線元件之相位進行電子式控制(波束控制),而可向所需之方向發送電波或接收電波。The millimeter-wave antenna element included in the millimeter-wave antenna substrate is not particularly limited as long as it can transmit and receive millimeter waves. From the viewpoint of efficiently receiving millimeter waves by portable communication devices such as smartphones, phase can be preferably used. array antenna. A phased array antenna is an antenna that arranges a plurality of antenna elements in an array, and controls the phase of each antenna element, thereby transmitting and receiving in the desired direction. That is, the phased array antenna can transmit or receive radio waves in a desired direction by electronically controlling the phase of each antenna element (beam steering) regardless of the direction of the antenna.

作為毫米波天線元件,可無特別限定地使用公知之天線,例如可例舉:環形天線結構體、貼片天線結構體、堆疊型貼片天線結構體、具有寄生元件之貼片天線結構體、倒F天線結構體、槽孔天線結構體、平板倒F天線結構體、單極、偶極、螺旋天線結構體、八木(八木-宇田)天線結構體、表面積體波導結構體、具有由該等設計之混合等所形成之共振元件之天線元件。對於不同之頻帶之組合,可使用種類不同之毫米波天線元件。就利用智慧型手機等攜帶通信機器高效地接收毫米波之觀點而言,較佳為將貼片天線元件排列為陣列狀之相位陣列天線。As the millimeter-wave antenna element, known antennas can be used without particular limitation, and examples include loop antenna structures, patch antenna structures, stacked patch antenna structures, patch antenna structures having parasitic elements, Inverted-F Antenna Structure, Slot Antenna Structure, Flat Inverted-F Antenna Structure, Monopole, Dipole, Helical Antenna Structure, Yagi (Yagi-Uda) Antenna Structure, Surface Area Body Waveguide Structure, Antenna elements of resonant elements formed by mixing designs etc. For different combinations of frequency bands, different types of millimeter-wave antenna elements can be used. From the viewpoint of efficiently receiving millimeter waves by a portable communication device such as a smartphone, a phased array antenna in which patch antenna elements are arranged in an array shape is preferable.

構成毫米波天線元件之素材亦無特別限定,例如可例舉:鈦、矽、鈮、銦、鋅、錫、金、銀、銅、鋁、鈷、鉻、鎳、鉛、鐵、鈀、鉑、鎢、鋯、鉭、鉿等金屬;ITO(銦與錫之氧化物)、氧化鋅、氧化錫等金屬氧化物。進而,亦可例舉含有2種以上該等金屬或金屬氧化物者、或者以該等金屬為主要成分之合金。其中,就導電性之觀點而言,較佳為銀、銅、ITO,就透明性、視認性之方面而言,更佳為ITO。即,上述毫米波天線元件尤佳為包含ITO。 又,於天線元件包含銀、銅等金屬之情形時,為了防止金屬之反射引起之視認性降低而將天線元件隱蔽,以此為目的,可藉由形成該金屬之氮化物、氧化物、硫化物等皮膜而實施黑化處理。 The material constituting the millimeter wave antenna element is not particularly limited, and examples thereof include titanium, silicon, niobium, indium, zinc, tin, gold, silver, copper, aluminum, cobalt, chromium, nickel, lead, iron, palladium, and platinum. , tungsten, zirconium, tantalum, hafnium and other metals; ITO (indium and tin oxide), zinc oxide, tin oxide and other metal oxides. Furthermore, what contains 2 or more types of these metals or metal oxides, or the alloy which has these metals as a main component can also be mentioned. Among them, silver, copper, and ITO are preferable from the viewpoint of electrical conductivity, and ITO is more preferable from the viewpoint of transparency and visibility. That is, it is particularly preferable that the above-mentioned millimeter wave antenna element contains ITO. In addition, when the antenna element contains metals such as silver and copper, the antenna element is concealed in order to prevent the reduction of visibility caused by the reflection of the metal. Blackening treatment is carried out on the film such as material.

又,毫米波天線基板亦可具備用以將毫米波天線元件所發送接收之信號傳送至發送接收機電路之傳輸線路徑。傳輸線路徑可包括同軸電纜路徑、微帶傳輸線、帶線傳輸線、邊緣結合微帶傳輸線、邊緣結合帶線傳輸線、用以於毫米波頻帶下傳遞信號之波導結構體(例如,共面波導或接地之共面波導)、由該等種類之傳輸線之組合所形成之傳輸線等。構成傳輸線路徑之素材亦無特別限定,可使用構成毫米波天線元件之素材。In addition, the millimeter-wave antenna substrate may also include a transmission line path for transmitting the signals transmitted and received by the millimeter-wave antenna element to the transceiver circuit. Transmission line paths may include coaxial cable paths, microstrip transmission lines, stripline transmission lines, edge-bonded microstrip transmission lines, edge-bonded stripline transmission lines, waveguide structures (eg, coplanar waveguides or grounded ones) for transmitting signals in the millimeter-wave band. Coplanar waveguide), transmission lines formed by combinations of these types of transmission lines, etc. The material constituting the transmission line path is also not particularly limited, and the material constituting the millimeter wave antenna element can be used.

作為構成毫米波天線之構件,可列舉為了保護排列於毫米波天線基板上之毫米波天線元件而積層於毫米波天線基板之罩蓋構件。作為罩蓋構件,並無特別限定,例如可使用玻璃或塑膠膜等光學膜。作為塑膠膜等素材,例如可例舉:聚對苯二甲酸乙二酯(PET)等聚酯系樹脂、聚甲基丙烯酸甲酯(PMMA)等(甲基)丙烯酸系樹脂、聚碳酸酯、三乙醯纖維素(TAC)、聚碸、聚芳酯、聚醯亞胺、透明聚醯亞胺、聚氯乙烯、聚乙酸乙烯酯、氟系樹脂、聚乙烯、聚丙烯、乙烯-丙烯共聚物、商品名「ARTON(環狀烯烴系聚合物,JSR股份有限公司製造)」、商品名「ZEONOR(環狀烯烴系聚合物,Nippon Zeon股份有限公司製造)」等環狀烯烴系聚合物等塑膠材料。再者,該等塑膠材料可單獨使用或組合使用2種以上。As a member constituting the millimeter-wave antenna, a cover member that is laminated on the millimeter-wave antenna substrate in order to protect the millimeter-wave antenna element arranged on the millimeter-wave antenna substrate can be mentioned. It does not specifically limit as a cover member, For example, optical films, such as glass and a plastic film, can be used. Examples of materials such as plastic films include polyester resins such as polyethylene terephthalate (PET), (meth)acrylic resins such as polymethyl methacrylate (PMMA), polycarbonate, Triacetyl cellulose (TAC), polyamide, polyarylate, polyimide, transparent polyimide, polyvinyl chloride, polyvinyl acetate, fluorine-based resin, polyethylene, polypropylene, ethylene-propylene copolymer products, cyclic olefin polymers such as trade names "ARTON (cyclic olefin polymer, manufactured by JSR Co., Ltd.)", trade name "ZEONOR (cyclic olefin polymer, manufactured by Nippon Zeon Co., Ltd.)", etc. plastic material. Furthermore, these plastic materials may be used alone or in combination of two or more.

罩蓋構件之於28 GHz及或60 GHz下之介電常數就抑制毫米波之輻射損失之觀點而言,較佳為2.0~5.0,更佳為2.1~4.5,進而較佳為2.2~4.0,進而較佳為2.2~3.5,進而較佳為2.2~3.4,進而較佳為2.2~3.3,進而較佳為2.2~3.2,進而較佳為2.2~3.1,尤佳為2.2~3.0。又,罩蓋構件之於28 GHz及或60 GHz下之介電損失就抑制毫米波之輻射損失之觀點而言,較佳為0.0001~0.05,更佳為0.001~0.02,進而較佳為0.002~0.019,進而較佳為0.003~0.018,進而較佳為0.004~0.017,進而較佳為0.005~0.016,進而較佳為0.006~0.015,進而較佳為0.007~0.014,進而較佳為0.008~0.013,進而較佳為0.009~0.012,尤佳為0.01~0.011。From the viewpoint of suppressing radiation loss of millimeter waves, the dielectric constant of the cover member at 28 GHz and or 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, further preferably 2.2 to 4.0, More preferably, it is 2.2-3.5, More preferably, it is 2.2-3.4, More preferably, it is 2.2-3.3, More preferably, it is 2.2-3.2, More preferably, it is 2.2-3.1, More preferably, it is 2.2-3.0. In addition, the dielectric loss of the cover member at 28 GHz and or 60 GHz is preferably 0.0001-0.05, more preferably 0.001-0.02, still more preferably 0.002- 0.019, more preferably 0.003-0.018, more preferably 0.004-0.017, more preferably 0.005-0.016, more preferably 0.006-0.015, more preferably 0.007-0.014, and more preferably 0.008-0.013, More preferably, it is 0.009-0.012, More preferably, it is 0.01-0.011.

上述罩蓋構件較佳為透明。罩蓋構件之可見光波長區域中之全光線透過率(依照JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而較佳為90%以上,進而較佳為91%以上,尤佳為92%以上。又,罩蓋構件之霧度(依照JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而較佳為0.9%以下,尤佳為0.8%以下。The above-mentioned cover member is preferably transparent. The total light transmittance (according to JIS K7361-1) in the visible light wavelength region of the cover member is not particularly limited, but is preferably 85% or more, more preferably 88% or more, more preferably 89% or more, and more preferably It is 90% or more, more preferably 91% or more, particularly preferably 92% or more. Moreover, the haze of the cover member (according to JIS K7136) is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, still more preferably 1.0% or less, still more preferably 0.9% or less, particularly preferably 0.8% or less.

罩蓋構件之厚度就抑制毫米波之輻射損失之觀點而言,較佳為0.025~1.5 mm。再者,罩蓋構件可具有單層及多層之任一形態。又,可對罩蓋構件之表面適當實施例如電暈放電處理、電漿處理等物理處理、底塗處理等化學處理、硬塗層等塗佈層等公知慣用之表面處理。The thickness of the cover member is preferably 0.025 to 1.5 mm from the viewpoint of suppressing radiation loss of millimeter waves. Furthermore, the cover member may have either a single-layer or a multi-layer form. The surface of the cover member may be appropriately subjected to known and conventional surface treatments such as physical treatments such as corona discharge treatment and plasma treatment, chemical treatments such as primer treatment, and coating layers such as hard coat layers.

本發明之黏著片材可較佳地用於攜帶通信機器所使用之毫米波天線之製造用途。作為上述攜帶通信機器,例如可例舉:行動電話、PHS、智慧型手機、平板(平板型電腦)、行動電腦(行動PC)、攜帶型資訊終端(PDA)等。The adhesive sheet of the present invention can be preferably used for the manufacture of millimeter-wave antennas used in portable communication equipment. As said portable communication apparatus, a mobile phone, a PHS, a smart phone, a tablet (tablet PC), a mobile computer (mobile PC), a portable information terminal (PDA), etc. are mentioned, for example.

毫米波天線可具有上述毫米波天線基板、罩蓋構件、黏著片材以外之構件,例如可具有:偏光板、波長板、相位差板、光學補償膜、增亮膜、導光板、反射膜、抗反射膜、硬塗膜、透明導電膜、設計膜、裝飾膜、表面保護板、稜鏡、透鏡、彩色濾光片、透明基板、或圖像顯示面板(例如液晶顯示面板、有機EL面板、電漿顯示面板等)等。圖像顯示面板可為具有觸控感測器者。The millimeter-wave antenna may have components other than the above-mentioned millimeter-wave antenna substrate, cover member, and adhesive sheet, for example, a polarizing plate, a wavelength plate, a retardation plate, an optical compensation film, a brightness enhancement film, a light guide plate, a Anti-reflection film, hard coat film, transparent conductive film, design film, decorative film, surface protection plate, lens, lens, color filter, transparent substrate, or image display panel (such as liquid crystal display panel, organic EL panel, plasma display panel, etc.), etc. The image display panel may have a touch sensor.

毫米波天線可配置於攜帶通信機器之任意位置,具體而言,可配置於攜帶通信機器之前面、背面、側面。再者,攜帶通信機器之前面係使用者使用攜帶通信機器時與使用者相向之面,例如,具有顯示面板之面相當於前面,殼體相當於背面、側面。再者,顯示面板係指至少包含透鏡(尤其是玻璃透鏡)及觸控面板之結構物。The millimeter-wave antenna can be arranged at any position of the portable communication device, and specifically, it can be arranged on the front, back, and side surfaces of the portable communication device. Furthermore, the front surface of the portable communication device is the surface facing the user when the user uses the portable communication device. For example, the surface with the display panel corresponds to the front, and the casing corresponds to the back and side surfaces. Furthermore, the display panel refers to a structure including at least a lens (especially a glass lens) and a touch panel.

毫米波天線之大小(範圍)亦無限定,可形成於攜帶通信機器之各面之整個面,亦可配置於一部分。又,毫米波天線之形狀亦無特別限定,例如可為方形、圓形、配線狀。又,亦可以邊框狀配置。進而,配置於攜帶通信機器之毫米波天線之數量亦無限定,可為一根,亦可於任意之位置配置複數根。於配置複數根毫米波天線之情形時,大小(範圍)可相同亦可不同。為了提高視認性,可於攜帶通信機器之未配置毫米波天線之部位配置不具備毫米波天線之虛設圖案。The size (range) of the millimeter-wave antenna is also not limited, and it may be formed on the entire surface of each surface of the portable communication device, or may be arranged on a part of it. In addition, the shape of the millimeter-wave antenna is not particularly limited, and may be, for example, a square, a circle, or a wire shape. Moreover, you may arrange|position in a frame shape. Furthermore, the number of millimeter-wave antennas arranged in the portable communication device is not limited, and it may be one, or a plurality of antennas may be arranged at arbitrary positions. When configuring a plurality of mmWave antennas, the sizes (ranges) may be the same or different. In order to improve visibility, a dummy pattern without a millimeter-wave antenna may be placed on a portion of a portable communication device where a millimeter-wave antenna is not placed.

本發明之第五態樣之毫米波天線係至少具有上述黏著片材及基板之毫米波天線,只要上述基板於單面具備天線元件(毫米波天線元件),且於上述基板(毫米波天線基板)之具有上述天線元件一側之面上貼著有上述黏著片材即可,於其他方面並無特別限定。再者,本發明之毫米波天線中之上述黏著片材為使用時之黏著片材,因此不具有隔離膜。The millimeter-wave antenna of the fifth aspect of the present invention is a millimeter-wave antenna having at least the above-mentioned adhesive sheet and substrate, as long as the above-mentioned substrate has an antenna element (millimeter-wave antenna element) on one side, and the above-mentioned substrate (millimeter-wave antenna substrate) ), the above-mentioned adhesive sheet may be adhered to the surface on the side having the above-mentioned antenna element, and is not particularly limited in other respects. Furthermore, the above-mentioned adhesive sheet in the millimeter-wave antenna of the present invention is an adhesive sheet at the time of use, and therefore does not have an isolation film.

作為上述毫米波天線,較佳為將毫米波天線基板與其他光學構件(未必具有上述黏著片材,亦可不具有,就進一步抑制毫米波之輻射損失之觀點而言,較佳為具有)貼合所構成之態樣。又,上述其他光學構件可為單數,亦可為複數。As the millimeter-wave antenna, it is preferable to attach the millimeter-wave antenna substrate to other optical members (it is not necessary to have the above-mentioned adhesive sheet, but it is preferable to have it from the viewpoint of further suppressing the radiation loss of the millimeter-wave). constituted form. In addition, the above-mentioned other optical members may be singular or plural.

作為上述態樣之情形時之本發明之毫米波天線與上述其他光學構件之貼合之態樣,並無特別限定,例如可例舉:(1)經由本發明之黏著片材將本發明之毫米波天線基板與上述其他光學構件貼合之態樣;(2)將包含或構成毫米波天線基板之本發明之黏著片材貼合於上述其他光學構件之態樣;(3)經由本發明之黏著帶將毫米波天線基板貼合於毫米波天線基板以外之構件之態樣;(4)將包含或構成毫米波天線基板之本發明之黏著帶貼合於毫米波天線基板以外之構件之態樣等。再者,於上述(2)之態樣中,本發明之黏著片材較佳為基材為毫米波天線基板之雙面黏著片材。The aspect of bonding the millimeter-wave antenna of the present invention and the above-mentioned other optical members in the case of the above aspects is not particularly limited, for example: (1) The adhesive sheet of the present invention is used to attach the A state in which the millimeter-wave antenna substrate is bonded to the above-mentioned other optical members; (2) A state in which the adhesive sheet of the present invention, which includes or constitutes the millimeter-wave antenna substrate, is bonded to the above-mentioned other optical members; (3) Through the present invention The state of attaching the millimeter-wave antenna substrate to the member other than the millimeter-wave antenna substrate with the adhesive tape; (4) the adhesive tape of the present invention including or constituting the millimeter-wave antenna substrate is attached to the member other than the millimeter-wave antenna substrate. form, etc. Furthermore, in the aspect (2) above, the adhesive sheet of the present invention is preferably a double-sided adhesive sheet whose base material is a millimeter-wave antenna substrate.

繼而,參照圖式對本發明之毫米波天線之較佳之實施形態進行說明。 圖1記載了毫米波天線1A,該毫米波天線1A為至少具有黏著片材10及作為毫米波天線基板11之基板之毫米波天線,毫米波天線基板11於單面具備毫米波天線元件2,黏著片材10貼著於毫米波天線基板11之具有毫米波天線元件2一側之面上。 Next, a preferred embodiment of the millimeter-wave antenna of the present invention will be described with reference to the drawings. FIG. 1 shows a millimeter-wave antenna 1A. The millimeter-wave antenna 1A is a millimeter-wave antenna having at least an adhesive sheet 10 and a substrate serving as a millimeter-wave antenna substrate 11. The millimeter-wave antenna substrate 11 has a millimeter-wave antenna element 2 on one side. The adhesive sheet 10 is attached to the side of the millimeter-wave antenna substrate 11 having the millimeter-wave antenna element 2 .

圖2記載了以依序相接之狀態具有罩蓋構件12、黏著片材10、及毫米波天線基板11之毫米波天線1B。毫米波天線基板11於黏著片材10側之面具備毫米波天線元件2,黏著片材10貼著於毫米波天線基板11之具有毫米波天線元件2一側之面上。罩蓋構件12較佳為玻璃,毫米波天線基板11就低介電常數、低介電損失之方面而言,較佳為COP,毫米波天線元件2較佳為銅、銀、或ITO。FIG. 2 shows the millimeter-wave antenna 1B having the cover member 12 , the adhesive sheet 10 , and the millimeter-wave antenna substrate 11 in a state of being connected to each other in this order. The millimeter-wave antenna substrate 11 is provided with the millimeter-wave antenna element 2 on the side of the adhesive sheet 10 , and the adhesive sheet 10 is attached to the side of the millimeter-wave antenna substrate 11 with the millimeter-wave antenna element 2 . The cover member 12 is preferably glass, the millimeter-wave antenna substrate 11 is preferably COP in terms of low dielectric constant and low dielectric loss, and the millimeter-wave antenna element 2 is preferably copper, silver, or ITO.

圖3中記載了毫米波天線1C,其以依序相接之狀態具有罩蓋構件12、黏著片材10a、毫米波天線基板11、黏著片材10b、及圖像顯示面板13。毫米波天線基板11於黏著片材10a側之面具備毫米波天線元件2,黏著片材10a貼著於毫米波天線基板11之具有毫米波天線元件2一側之面上。罩蓋構件12較佳為玻璃,就低介電常數、低介電損失之方面而言,毫米波天線基板11較佳為COP,就透明性、視認性之觀點而言,毫米波天線元件2較佳為ITO或經氮化物、氧化物、硫化物等皮膜黑化處理之銀或銅。黏著片材10b可為本發明之黏著片材,亦可不為本發明之黏著片材,較佳為本發明之黏著片材。圖像顯示面板13亦可具有觸控感測器(省略圖示)。3 shows the millimeter-wave antenna 1C, which includes a cover member 12 , an adhesive sheet 10 a , a millimeter-wave antenna substrate 11 , an adhesive sheet 10 b , and an image display panel 13 in a connected state in order. The millimeter-wave antenna substrate 11 is provided with the millimeter-wave antenna element 2 on the side of the adhesive sheet 10 a, and the adhesive sheet 10 a is attached to the side of the millimeter-wave antenna substrate 11 on the side with the millimeter-wave antenna element 2 . The cover member 12 is preferably glass. In terms of low dielectric constant and low dielectric loss, the millimeter-wave antenna substrate 11 is preferably COP. In terms of transparency and visibility, the millimeter-wave antenna element 2 It is preferably ITO or silver or copper which has been blackened with a film such as nitride, oxide, sulfide, etc. The adhesive sheet 10b may or may not be the adhesive sheet of the present invention, and is preferably the adhesive sheet of the present invention. The image display panel 13 may also have a touch sensor (not shown).

於圖1~3之毫米波天線1A~1C中,黏著片材10、10a、及較佳為黏著片材10b包含高頻帶下之介電常數、介電損失較低之本發明之黏著劑層,因此可抑制毫米波之輻射損失,而可有效率地進行毫米波通信。又,由於可有效率地進行毫米波通信,故而可將天線面積小型化,可將天線微細化。 實施例 In the millimeter-wave antennas 1A to 1C of FIGS. 1 to 3 , the adhesive sheets 10 , 10 a , and preferably the adhesive sheet 10 b include the adhesive layer of the present invention with low dielectric constant and low dielectric loss in high frequency bands. , so the radiation loss of the millimeter wave can be suppressed, and the millimeter wave communication can be carried out efficiently. In addition, since millimeter wave communication can be performed efficiently, the antenna area can be reduced in size, and the antenna can be miniaturized. Example

以下,基於實施例更詳細地說明本發明,但本發明不受該等實施例任何限定。Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited by these examples at all.

[實施例1] 於包含丙烯酸2-乙基己酯(2EHA)43重量份、丙烯酸異硬脂酯(ISTA)43重量份、N-乙烯基-2-吡咯啶酮(NVP)12重量份、及丙烯酸4-羥基丁酯(4HBA)1重量份之單體混合物中調配光聚合起始劑(商品名「Irgacure 184」,BASF公司製造)0.035重量份、及光聚合起始劑(商品名「Irgacure 651」,BASF公司製造)0.035重量份後,照射紫外線直至黏度(BH黏度計No.5轉子,10 rpm,測定溫度30℃)達到約20 Pa・s,而獲得上述單體成分之一部分已聚合之預聚物組合物。 繼而,於該預聚物組合物100重量份中添加己二醇二丙烯酸酯(HDDA)0.075重量份、及矽烷偶合劑(商品名「KBM-403」,信越化學工業股份有限公司製造)0.3重量份並加以混合,而獲得黏著劑組合物(硬化前組合物)。 [Example 1] 43 parts by weight of 2-ethylhexyl acrylate (2EHA), 43 parts by weight of isostearyl acrylate (ISTA), 12 parts by weight of N-vinyl-2-pyrrolidone (NVP), and 4-hydroxy acrylate 0.035 parts by weight of a photopolymerization initiator (trade name "Irgacure 184", manufactured by BASF), and a photopolymerization initiator (trade name "Irgacure 651", BASF) were prepared in 1 part by weight of the monomer mixture of butyl ester (4HBA). Company) 0.035 parts by weight, irradiated with ultraviolet light until the viscosity (BH viscometer No.5 rotor, 10 rpm, measurement temperature 30 ° C) reached about 20 Pa s, and obtained a prepolymer in which a part of the above monomer components have been polymerized combination. Next, 0.075 parts by weight of hexanediol diacrylate (HDDA) and 0.3 parts by weight of a silane coupling agent (trade name "KBM-403", manufactured by Shin-Etsu Chemical Co., Ltd.) were added to 100 parts by weight of the prepolymer composition. parts and mixed to obtain an adhesive composition (pre-hardening composition).

將上述黏著劑組合物以最終厚度(黏著劑層之厚度)成為25 μm之方式塗佈於聚對苯二甲酸乙二酯(PET)隔離膜(商品名「MRF50」,Mitsubishi Chemical股份有限公司製造)上,而形成塗佈層(黏著劑組合物層)。繼而,於上述塗佈層上設置PET隔離膜(商品名「MRF38」,Mitsubishi Chemical股份有限公司製造),被覆塗佈層以阻隔氧。然後,獲得MRF50/塗佈層(黏著劑組合物層)/MRF38之積層體。 繼而,對於該積層體,利用黑光燈(東芝股份有限公司製造)自積層體之上表面(MRF38側)照射照度5 mW/cm 2之紫外線300秒。進而,利用90℃之乾燥機進行2分鐘乾燥處理,使殘存單體揮發。然後,獲得僅由黏著劑層所構成且黏著劑層之兩面由隔離膜保護的無基材之雙面黏著片材。 The above-mentioned adhesive composition was coated on a polyethylene terephthalate (PET) release film (trade name "MRF50", manufactured by Mitsubishi Chemical Co., Ltd.) so that the final thickness (thickness of the adhesive layer) was 25 μm. ) to form a coating layer (adhesive composition layer). Next, a PET separator (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) was placed on the above-mentioned coating layer, and the coating layer was covered to block oxygen. Then, a laminate of MRF50/coating layer (adhesive composition layer)/MRF38 was obtained. Next, ultraviolet rays with an illuminance of 5 mW/cm 2 were irradiated from the upper surface (MRF38 side) of the laminate with a black light lamp (manufactured by Toshiba Corporation) for 300 seconds to this laminate. Furthermore, the drying process was performed for 2 minutes with a 90 degreeC dryer, and the residual monomer was volatilized. Then, a substrate-free double-sided adhesive sheet composed of only the adhesive layer and both sides of the adhesive layer being protected by the release film was obtained.

[實施例2] 除使用包含丙烯酸2-乙基己酯(2EHA)25重量份、丙烯酸月桂酯(LA)62重量份、N-乙烯基-2-吡咯啶酮(NVP)8重量份、及丙烯酸4-羥基丁酯(4HBA)5重量份之單體混合物獲得預聚物組合物以外,以與實施例1同樣之方式獲得無基材之雙面黏著片材。 [Example 2] Except for the use of 25 parts by weight of 2-ethylhexyl acrylate (2EHA), 62 parts by weight of lauryl acrylate (LA), 8 parts by weight of N-vinyl-2-pyrrolidone (NVP), and 4-hydroxybutyl acrylate A double-sided adhesive sheet without a substrate was obtained in the same manner as in Example 1, except that the monomer mixture of 5 parts by weight of ester (4HBA) was used to obtain the prepolymer composition.

[實施例3] 將聚異丁烯(商品名「OPPANOL N80」,Mw:1,050,000,Mn:440,000,Mw/Mn:2.4,BASF公司製造)100重量份與作為黏著賦予劑之完全氫化萜烯酚(軟化點:135℃、羥值:160之完全氫化萜烯酚)22重量份於甲苯中調配,而製備固形物成分為13重量%之黏著劑組合物(溶液)。將所獲得之黏著劑組合物(溶液)以最終厚度(黏著劑層之厚度)成為50 μm之方式塗佈於PET隔離膜(商品名「MRF50」,Mitsubishi Chemical股份有限公司製造)上,而形成塗佈層(黏著劑組合物層)。繼而,將塗佈層於130℃乾燥5分鐘,形成黏著劑層,而製作黏著劑層之厚度為50 μm之黏著片材。又,以剝離處理面與上述黏著劑層相接之方式將PET隔離膜(商品名「MRF38」,Mitsubishi Chemical股份有限公司製造)貼合於黏著片材之黏著面。獲得黏著劑層之兩面經隔離膜保護之無基材之雙面黏著片材。 [Example 3] 100 parts by weight of polyisobutylene (trade name "OPPANOL N80", Mw: 1,050,000, Mn: 440,000, Mw/Mn: 2.4, manufactured by BASF Corporation) and fully hydrogenated terpene phenol (softening point: 135° C., Hydroxyl value: 22 parts by weight of fully hydrogenated terpene phenol of 160 was prepared in toluene to prepare an adhesive composition (solution) with a solid content of 13% by weight. The obtained adhesive composition (solution) was coated on a PET separator (trade name "MRF50", manufactured by Mitsubishi Chemical Co., Ltd.) so that the final thickness (thickness of the adhesive layer) was 50 μm to form Coating layer (adhesive composition layer). Then, the coating layer was dried at 130° C. for 5 minutes to form an adhesive layer, and an adhesive sheet with a thickness of the adhesive layer of 50 μm was produced. Moreover, a PET separator (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) was attached to the adhesive surface of the adhesive sheet so that the peeling-treated surface was in contact with the above-mentioned adhesive layer. A double-sided adhesive sheet without a substrate with both sides of the adhesive layer protected by a release film is obtained.

[實施例4] 將作為黏著劑組合物之聚苯乙烯-聚(乙烯/丙烯)-聚苯乙烯嵌段共聚物橡膠(SEPS:KURARAY製造之「Septon 2063」,苯乙烯含量:13%)100重量份與300重量份之甲苯混合,而製備黏著劑組合物。以乾燥後厚度成為20 μm之方式將上述黏著劑組合物塗佈於PET隔離膜(商品名「MRF50」,Mitsubishi Chemical股份有限公司製造)之剝離處理面後,於130℃加熱5分鐘去除溶劑,而製作黏著片材。又,以剝離處理面與上述黏著劑層相接之方式將PET隔離膜(商品名「MRF38」,Mitsubishi Chemical股份有限公司製造)貼合於黏著片材之黏著面。獲得黏著劑層之兩面經隔離膜保護之無基材之雙面黏著片材。 [Example 4] 100 parts by weight and 300 parts by weight of polystyrene-poly(ethylene/propylene)-polystyrene block copolymer rubber (SEPS: "Septon 2063" manufactured by KURARAY, styrene content: 13%) as an adhesive composition parts of toluene were mixed to prepare an adhesive composition. After drying, the above-mentioned adhesive composition was applied to the peeling-treated surface of a PET separator (trade name "MRF50", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying was 20 μm, and the solvent was removed by heating at 130° C. for 5 minutes. And make the adhesive sheet. Moreover, a PET separator (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) was attached to the adhesive surface of the adhesive sheet so that the peeling-treated surface was in contact with the above-mentioned adhesive layer. A double-sided adhesive sheet without a substrate with both sides of the adhesive layer protected by a release film is obtained.

[比較例1] 除使用包含丙烯酸丁酯(BA)65重量份、丙烯酸環己酯(CHA)13重量份、丙烯酸2-羥基乙酯(HEA)7重量份、及丙烯酸4-羥基丁酯(4HBA)30重量份之單體混合物獲得預聚物組合物以外,以與實施例1同樣之方式獲得無基材之雙面黏著片材。 [Comparative Example 1] Except using 65 parts by weight of butyl acrylate (BA), 13 parts by weight of cyclohexyl acrylate (CHA), 7 parts by weight of 2-hydroxyethyl acrylate (HEA), and 30 parts by weight of 4-hydroxybutyl acrylate (4HBA) A double-sided adhesive sheet without a substrate was obtained in the same manner as in Example 1 except that the prepolymer composition was obtained from the monomer mixture.

[實施例5~42] 以單體成分成為70重量%之方式於具備冷卻管、氮氣導入管、溫度計及攪拌裝置之反應容器中投入表2所示之單體成分之混合物、作為熱聚合起始劑之2,2'-偶氮二異丁腈(AIBN)0.2重量份、及作為聚合溶劑之乙酸乙酯,通入氮氣,一面攪拌一面進行約1小時之氮氣置換。其後,將反應容器加熱至70℃,反應6小時。進而,將反應容器加熱至80℃,反應3小時,而獲得重量平均分子量(Mw)40萬之(甲基)丙烯酸系聚合物。於該(甲基)丙烯酸系聚合物之溶液(固形物成分100重量份)中添加作為異氰酸酯系交聯劑(商品名「Coronate HX」,Tosoh股份有限公司製造,固形物成分濃度100重量%)以固形物成分基準計為0.1重量份、作為交聯促進劑之二月桂酸二辛基錫(商品名「Enbilizer OL-1」,Tokyo Fine Chemical股份有限公司製造)0.01重量份、及作為交聯延遲劑之乙醯丙酮5重量份,並混合均勻,而製備本例之黏著劑組合物。 [Examples 5 to 42] The mixture of the monomer components shown in Table 2 and 2,2' as a thermal polymerization initiator were put into a reaction vessel equipped with a cooling pipe, a nitrogen introduction pipe, a thermometer, and a stirring device so that the monomer components were 70% by weight. -0.2 parts by weight of azobisisobutyronitrile (AIBN), and ethyl acetate as a polymerization solvent, nitrogen gas was introduced, and nitrogen replacement was performed for about 1 hour while stirring. Then, the reaction container was heated to 70 degreeC, and it was made to react for 6 hours. Furthermore, the reaction container was heated to 80 degreeC, and it was made to react for 3 hours, and the (meth)acrylic-type polymer of the weight average molecular weight (Mw) 400,000 was obtained. To this (meth)acrylic polymer solution (solid content 100 parts by weight) was added as an isocyanate-based crosslinking agent (trade name "Coronate HX", manufactured by Tosoh Co., Ltd., solid content concentration 100% by weight) 0.1 part by weight based on solid content, 0.01 part by weight of dioctyltin dilaurate (trade name "Enbilizer OL-1", manufactured by Tokyo Fine Chemical Co., Ltd.) as a crosslinking accelerator, and 0.01 part by weight as a crosslinking accelerator 5 parts by weight of acetone acetone as the retarder was mixed uniformly to prepare the adhesive composition of this example.

將上述黏著劑組合物以最終之厚度(黏著劑層之厚度)成為25 μm之方式塗佈於聚對苯二甲酸乙二酯(PET)隔離膜(商品名「MRF38」,Mitsubishi Chemical股份有限公司製造)上,而形成塗佈層(黏著劑組合物層)。繼而,利用130℃之乾燥機進行120分鐘乾燥處理,使溶劑及殘存單體揮發。進而,於上述塗佈層上設置PET隔離膜(商品名「MRE38」,Mitsubishi Chemical股份有限公司製造),獲得僅由黏著劑層所構成且黏著劑層之兩面經隔離膜保護之無基材之雙面黏著片材。The above adhesive composition was coated on a polyethylene terephthalate (PET) release film (trade name "MRF38", Mitsubishi Chemical Co., Ltd. manufacturing) to form a coating layer (adhesive composition layer). Then, the drying process was performed for 120 minutes with a dryer at 130° C. to volatilize the solvent and residual monomers. Furthermore, a PET separator (trade name "MRE38", manufactured by Mitsubishi Chemical Co., Ltd.) was placed on the above-mentioned coating layer to obtain a substrate-free film composed of only an adhesive layer and both sides of the adhesive layer were protected by the separator. Double-sided adhesive sheet.

表2所示之數值之單位為「重量份」。又,表2所示之各單體成分如以下所述。 LMA:甲基丙烯酸月桂酯 LA:丙烯酸月桂酯 2-EHA:丙烯酸2-乙基己酯 i-NA:丙烯酸異壬酯 L-7MA:甲基丙烯酸C 12-13烷基酯 IDMA:甲基丙烯酸異癸酯 HEMA:甲基丙烯酸2-羥基乙酯 MMA:甲基丙烯酸甲酯 MMA-巨單體:甲基丙烯酸甲酯巨單體 CHMA:甲基丙烯酸環己酯 IBXMA:甲基丙烯酸異𦯉基酯 MAA:甲基丙烯酸 NVP:N-乙烯基吡咯啶酮 PHE-1G:甲基丙烯酸2-苯氧基乙酯 BzMA:甲基丙烯酸苄酯 M-20G:甲基丙烯酸2-(2-甲氧基乙氧基)乙酯 The unit of the numerical value shown in Table 2 is "weight part". In addition, each monomer component shown in Table 2 is as follows. LMA: lauryl methacrylate LA: lauryl acrylate 2-EHA: 2-ethylhexyl acrylate i-NA: isononyl acrylate L-7MA: C 12-13 alkyl methacrylate IDMA: methacrylic acid Isodecyl ester HEMA: 2-hydroxyethyl methacrylate MMA: methyl methacrylate MMA-macromonomer: methyl methacrylate macromonomer CHMA: cyclohexyl methacrylate IBXMA: iso-yl methacrylate Ester MAA: methacrylate NVP: N-vinylpyrrolidone PHE-1G: 2-phenoxyethyl methacrylate BzMA: benzyl methacrylate M-20G: 2-(2-methoxy methacrylate) ethoxy) ethyl ester

[表2] (表2)    單體成分 LMA LA 2-EHA i-NA L-7MA IDMA HEMA MMA MMA-巨單體 CHMA IBXMA DCPMA MAA NVP PHE-1G BzMA M-20G 實施例5 - - - - 99 - 1 - - - - - - - - - - 實施例6 99 - - - - - 1 - - - - - - - - - - 實施例7 - - - - - 99 1 - - - - - - - - - - 實施例8 86 - - - - - 1 13 - - - - - - - - - 實施例9 86 - - - - - 1 - 13 - - - - - - - - 實施例10 98.9 - - - - - 0.1 - - - - - 1 - - - - 實施例11 96.9 - - - - - 0.1 - - - - - 3 - - - - 實施例12 94.9 - - - - - 0.1 - - - - - 5 - - - - 實施例13 94.9 - - - - - 0.1 - - - - - - 5 - - - 實施例14 86 - - - - - 1 - - 13 - - - - - - - 實施例15 79 - - - - - 1 - - 20 - - - - - - - 實施例16 66 - - - - - 1 - - 33 - - - - - - - 實施例17 50 - - - - - 1 - - 49 - - - - - - - 實施例18 86 - - - - - 1 - - - 13 - - - - - - 實施例19 79 - - - - - 1 - - - 20 - - - - - - 實施例20 66 - - - - - 1 - - - 33 - - - - - - 實施例21 86 - - - - - 1 - - - - 13 - - - - - 實施例22 79 - - - - - 1 - - - - 20 - - - - - 實施例23 66 - - - - - 1 - - - - 33 - - - - - 實施例24 86 - - - - - 1 - - - - - - - - 13 - 實施例25 79 - - - - - 1 - - - - - - - - 20 - 實施例26 86 - - - - - 1 - - - - - - - 13 - - 實施例27 79 - - - - - 1 - - - - - - - 20 - - 實施例28 86 - - - - - 1 - - - - - - - - - 13 實施例29 95 - - - - - 5 - - - - - - - - - - 實施例30 90 - - - - - 10 - - - - - - - - - - 實施例31 80 - - - - - 20 - - - - - - - - - - 實施例32 84.5 - 14.5 - - - 1 - - - - - - - - - - 實施例33 79.5 - 19.5 - - - 1 - - - - - - - - - - 實施例34 74.5 - 24.5 - - - 1 - - - - - - - - - - 實施例35 49.5 - 49.5 - - - 1 - - - - - - - - - - 實施例36 24.5 - 74.5 - - - 1 - - - - - - - - - - 實施例37 74.5 24.5 - - - - 1 - - - - - - - - - - 實施例38 74.5 - - 24.5 - - 1 - - - - - - - - - - 實施例39 36 - 50 - - - 1 - - 13 - - - - - - - 實施例40 50 - - - - 39 1 - - 10 - - - - - - - 實施例41 44.5 - - - - 44.5 1 - - 10 - - - - - - - 實施例42    - - - - 89 1 - - 10 - - - - - - - [Table 2] (Table 2) Monomer components LMA LA 2-EHA i-NA L-7MA IDMA HEMA MMA MMA - Giant Monomer CHMA IBXMA DCPMA MAA NVP PHE-1G BzMA M-20G Example 5 - - - - 99 - 1 - - - - - - - - - - Example 6 99 - - - - - 1 - - - - - - - - - - Example 7 - - - - - 99 1 - - - - - - - - - - Example 8 86 - - - - - 1 13 - - - - - - - - - Example 9 86 - - - - - 1 - 13 - - - - - - - - Example 10 98.9 - - - - - 0.1 - - - - - 1 - - - - Example 11 96.9 - - - - - 0.1 - - - - - 3 - - - - Example 12 94.9 - - - - - 0.1 - - - - - 5 - - - - Example 13 94.9 - - - - - 0.1 - - - - - - 5 - - - Example 14 86 - - - - - 1 - - 13 - - - - - - - Example 15 79 - - - - - 1 - - 20 - - - - - - - Example 16 66 - - - - - 1 - - 33 - - - - - - - Example 17 50 - - - - - 1 - - 49 - - - - - - - Example 18 86 - - - - - 1 - - - 13 - - - - - - Example 19 79 - - - - - 1 - - - 20 - - - - - - Example 20 66 - - - - - 1 - - - 33 - - - - - - Example 21 86 - - - - - 1 - - - - 13 - - - - - Example 22 79 - - - - - 1 - - - - 20 - - - - - Example 23 66 - - - - - 1 - - - - 33 - - - - - Example 24 86 - - - - - 1 - - - - - - - - 13 - Example 25 79 - - - - - 1 - - - - - - - - 20 - Example 26 86 - - - - - 1 - - - - - - - 13 - - Example 27 79 - - - - - 1 - - - - - - - 20 - - Example 28 86 - - - - - 1 - - - - - - - - - 13 Example 29 95 - - - - - 5 - - - - - - - - - - Example 30 90 - - - - - 10 - - - - - - - - - - Example 31 80 - - - - - 20 - - - - - - - - - - Example 32 84.5 - 14.5 - - - 1 - - - - - - - - - - Example 33 79.5 - 19.5 - - - 1 - - - - - - - - - - Example 34 74.5 - 24.5 - - - 1 - - - - - - - - - - Example 35 49.5 - 49.5 - - - 1 - - - - - - - - - - Example 36 24.5 - 74.5 - - - 1 - - - - - - - - - - Example 37 74.5 24.5 - - - - 1 - - - - - - - - - - Example 38 74.5 - - 24.5 - - 1 - - - - - - - - - - Example 39 36 - 50 - - - 1 - - 13 - - - - - - - Example 40 50 - - - - 39 1 - - 10 - - - - - - - Example 41 44.5 - - - - 44.5 1 - - 10 - - - - - - - Example 42 - - - - 89 1 - - 10 - - - - - - -

[特性評價] 對實施例及比較例之無基材之雙面黏著片材進行下述測定或評價。將評價結果示於表3及表4。 [Characteristic evaluation] The following measurements or evaluations were performed on the double-sided adhesive sheets without substrates of Examples and Comparative Examples. The evaluation results are shown in Table 3 and Table 4.

(1)介電常數、介電損失之評價 對於實施例或比較例中所獲得之黏著劑層單獨體(自雙面黏著片材剝離已實施聚矽氧處理之PET隔離膜而成者),藉由以下裝置,測定於頻率28 GHz及60 GHz下之介電常數及介電損失。測定於28 GHz之情形時係對直徑8 cm之圓之區域實施,於60 GHz之情形時係對直徑4 cm之圓之區域實施。利用各檢體製作3個樣品,以該等3個樣品之測定值之平均值作為相對介電常數、介電損失。 測定方法:開放型共振器法 JIS R1660-2 裝置:KEYCOM股份有限公司製造,干涉型共振器法介電常數測定系統 測定環境:23±1℃、52±1%RH (1) Evaluation of dielectric constant and dielectric loss The adhesive layer alone (the one obtained by peeling off the polysiloxane-treated PET separator from the double-sided adhesive sheet) obtained in Examples or Comparative Examples was measured by the following apparatus at frequencies of 28 GHz and 60 Dielectric constant and dielectric loss at GHz. Measurements were performed on a circle with a diameter of 8 cm in the case of 28 GHz, and a circle with a diameter of 4 cm in the case of 60 GHz. Three samples were prepared from each specimen, and the average value of the measured values of the three samples was used as the relative permittivity and dielectric loss. Measurement method: Open resonator method JIS R1660-2 Device: Interferometric resonator method dielectric constant measurement system manufactured by KEYCOM Co., Ltd. Measurement environment: 23±1℃, 52±1%RH

(2)全光線透過率及霧度 自雙面黏著片材剝離其中一隔離膜,將該雙面黏著片材貼合於載玻片(松浪硝子工業股份有限公司製造,「白研磨 No.1」,厚度0.8~1.0 mm、全光線透過率92%、霧度0.2%),進而剝離另一隔離膜,製作具有雙面黏著片材(黏著劑層)/載玻片之層構成之試驗片。 使用測霧計(裝置名「HM-150」,村上色彩研究所股份有限公司製造)於23±1℃、52±1%RH之環境下測定上述試驗片之可見光區域中之全光線透過率及霧度。利用各檢體製作3個樣品,以該等3個樣品之測定值之平均值作為可見光區域中之全光線透過率及霧度。 (2) Total light transmittance and haze One of the separators was peeled off from the double-sided adhesive sheet, and the double-sided adhesive sheet was attached to a glass slide (manufactured by Songnami Glass Industrial Co., Ltd., "White Grinding No. 1", thickness 0.8-1.0 mm, full light transmittance of 92% and haze of 0.2%), and then peeled off the other separator to prepare a test piece having a layered structure of a double-sided adhesive sheet (adhesive layer)/glass slide. The total light transmittance and haze. Three samples were prepared from each specimen, and the average value of the measured values of the three samples was used as the total light transmittance and haze in the visible light region.

(3)發送接收特性 實施例或比較例中所獲得之黏著劑層(自雙面黏著片材剝離已實施聚矽氧處理之PET隔離膜而成者)之發送接收特性係藉由圖4所示之方形微帶天線(參照電子通信資訊學會4群2編5章「平面天線」,URL:http://www.ieice hbkb.org/files/04/04gun_02hen_05.pdf)進行評價。具體而言,製作於作為天線基板44之厚度100 μm之COP基材(商品名:ZEONOR,Nippon Zeon股份有限公司製造)之表面形成有圖4所示之形狀之毫米波用貼片天線43、於背面形成有1 μm厚之銅接地層45之天線膜46。毫米波用貼片天線43之尺寸以與各實施例、比較例之黏著劑積層時成為最佳之方式進行調整(縱A:2.8~3.2 mm、橫B:4.13 mm)。於上述天線膜46之貼片天線43側貼附各實施例、比較例之黏著劑層42以避免氣泡或異物進入,繼而貼合於作為覆蓋玻璃41之厚度0.7 mm之化學強化玻璃(Corning公司製造),而製作覆蓋玻璃41/黏著劑層42/天線膜46之天線積層體4。自連接於各種天線積層體4之毫米波用貼片天線43之微帶線路43a供電,對30 GHz之頻帶下之發送接收特性進行評價,將相較於不使用黏著劑層之情形時(於覆蓋玻璃41接近配置天線膜46而成者)之增益(5.7dB)而提高者設為〇,將降低(變差)者設為×。 (3) Send and receive characteristics The transmission and reception characteristics of the adhesive layer obtained in the example or the comparative example (the one obtained by peeling off the polysiloxane-treated PET separator from the double-sided adhesive sheet) were obtained by using the square microstrip antenna shown in FIG. 4 . (Refer to Chapter 5, "Planar Antennas", 4 Group 2, Series 2, Institute of Electronic Communication and Information, URL: http://www.ieice hbkb.org/files/04/04gun_02hen_05.pdf) for evaluation. Specifically, a COP substrate (trade name: ZEONOR, manufactured by Nippon Zeon Co., Ltd.) having a thickness of 100 μm as the antenna substrate 44 was formed on the surface of the millimeter-wave patch antenna 43 , the shape shown in FIG. 4 , and the An antenna film 46 with a copper ground layer 45 having a thickness of 1 μm is formed on the backside. The dimensions of the millimeter-wave patch antenna 43 were adjusted so as to be optimal when laminated with the adhesives of the examples and comparative examples (vertical A: 2.8 to 3.2 mm, horizontal B: 4.13 mm). The adhesive layer 42 of each embodiment and the comparative example is attached to the side of the patch antenna 43 of the above-mentioned antenna film 46 to avoid the entry of air bubbles or foreign matter, and is then attached to a chemically strengthened glass (Corning company) with a thickness of 0.7 mm as the cover glass 41. manufacturing), and the antenna laminate 4 of the cover glass 41/adhesive layer 42/antenna film 46 was manufactured. The transmission and reception characteristics in the frequency band of 30 GHz were evaluated by supplying power from the microstrip line 43a of the millimeter-wave patch antenna 43 connected to the various antenna laminates 4, compared with the case where no adhesive layer was used (in The cover glass 41 is close to the gain (5.7 dB) of the antenna film 46, and the gain (5.7 dB) is set as 0, and the decrease (deterioration) is set as ×.

[表3] (表3)    28 GHz 60 GHz 透明性 接收特性 介電常數 介電損失 介電常數 介電損失 全光線透過率 霧度 實施例1 2.41 0.022 2.33 0.011 92.3 0.24 實施例2 2.67 0.049 2.61 0.020 92.5 0.26 實施例3 2.84 0.002 2.38 0.001 92.1 0.30 實施例4 2.36 0.001 2.22 0.001 91.9 0.32 比較例1 2.90 0.175 2.75 0.058 92.3 0.24 × 實施例5 2.27 0.004 2.39 0.001 93.0 0.20 實施例6 2.32 0.005 2.33 0.003 93.0 0.30 實施例7 2.41 0.006 2.44 0.004 92.8 0.40 實施例8 2.47 0.004 2.12 0.003 92.8 0.60 實施例9 2.30 0.006 2.47 0.004 92.6 1.20 實施例10 2.24 0.003 2.44 0.002 92.9 0.20 實施例11 2.69 0.004 2.66 0.004 92.7 0.60 實施例12 2.26 0.003 2.66 0.002 92.8 0.80 實施例13 2.31 0.005 2.23 0.003 92.8 0.30 實施例14 2.18 0.005 2.13 0.003 92.4 0.40 實施例15 2.26 0.004 2.44 0.003 92.8 0.50 實施例16 2.46 0.004 2.49 0.002 92.6 0.70 實施例17 2.34 0.004 2.48 0.003 92.5 0.88 實施例18 2.55 0.004 2.35 0.002 92.8 0.30 實施例19 2.38 0.003 2.34 0.003 92.7 0.50 實施例20 2.35 0.003 2.89 0.002 92.7 0.20 [table 3] (table 3) 28GHz 60GHz transparency Receive characteristics Dielectric constant Dielectric loss Dielectric constant Dielectric loss total light transmittance haze Example 1 2.41 0.022 2.33 0.011 92.3 0.24 Example 2 2.67 0.049 2.61 0.020 92.5 0.26 Example 3 2.84 0.002 2.38 0.001 92.1 0.30 Example 4 2.36 0.001 2.22 0.001 91.9 0.32 Comparative Example 1 2.90 0.175 2.75 0.058 92.3 0.24 × Example 5 2.27 0.004 2.39 0.001 93.0 0.20 Example 6 2.32 0.005 2.33 0.003 93.0 0.30 Example 7 2.41 0.006 2.44 0.004 92.8 0.40 Example 8 2.47 0.004 2.12 0.003 92.8 0.60 Example 9 2.30 0.006 2.47 0.004 92.6 1.20 Example 10 2.24 0.003 2.44 0.002 92.9 0.20 Example 11 2.69 0.004 2.66 0.004 92.7 0.60 Example 12 2.26 0.003 2.66 0.002 92.8 0.80 Example 13 2.31 0.005 2.23 0.003 92.8 0.30 Example 14 2.18 0.005 2.13 0.003 92.4 0.40 Example 15 2.26 0.004 2.44 0.003 92.8 0.50 Example 16 2.46 0.004 2.49 0.002 92.6 0.70 Example 17 2.34 0.004 2.48 0.003 92.5 0.88 Example 18 2.55 0.004 2.35 0.002 92.8 0.30 Example 19 2.38 0.003 2.34 0.003 92.7 0.50 Example 20 2.35 0.003 2.89 0.002 92.7 0.20

[表4] (表4)    28 GHz 60 GHz 透明性 接收特性 介電常數 介電損失 介電常數 介電損失 全光線透過率 霧度    實施例21 2.32 0.003 2.19 0.004 92.8 0.40 實施例22 2.56 0.004 2.24 0.002 92.7 0.50 實施例23 2.63 0.003 2.49 0.003 92.6 0.80 實施例24 2.33 0.004 2.28 0.003 92.7 0.30 實施例25 2.30 0.005 2.32 0.004 92.6 0.40 實施例26 2.52 0.005 2.37 0.004 92.7 0.30 實施例27 2.59 0.007 3.29 0.003 92.7 0.40 實施例28 2.54 0.029 2.19 0.016 92.8 0.30 實施例29 2.26 0.008 2.22 0.003 92.8 0.50 實施例30 2.26 0.013 2.26 0.009 92.8 0.70 實施例31 2.30 0.019 2.64 0.008 92.7 0.10 實施例32 2.31 0.006 2.28 0.004 92.8 0.20 實施例33 2.49 0.007 2.47 0.006 92.8 0.10 實施例34 2.46 0.007 2.39 0.004 92.9 0.40 實施例35 2.25 0.012 2.19 0.008 93.0 0.60 實施例36 2.38 0.019 2.44 0.011 92.9 0.10 實施例37 2.29 0.006 2.18 0.004 92.9 0.10 實施例38 2.45 0.007 2.21 0.004 92.9 0.20 實施例39 2.50 0.012 2.47 0.008 92.8 0.20 實施例40 2.69 0.004 2.58 0.002 92.7 0.40 實施例41 2.61 0.004 2.51 0.004 92.7 0.40 實施例42 2.50 0.005 2.44 0.005 92.7 0.50 [Table 4] (Table 4) 28GHz 60GHz transparency Receive characteristics Dielectric constant Dielectric loss Dielectric constant Dielectric loss total light transmittance haze Example 21 2.32 0.003 2.19 0.004 92.8 0.40 Example 22 2.56 0.004 2.24 0.002 92.7 0.50 Example 23 2.63 0.003 2.49 0.003 92.6 0.80 Example 24 2.33 0.004 2.28 0.003 92.7 0.30 Example 25 2.30 0.005 2.32 0.004 92.6 0.40 Example 26 2.52 0.005 2.37 0.004 92.7 0.30 Example 27 2.59 0.007 3.29 0.003 92.7 0.40 Example 28 2.54 0.029 2.19 0.016 92.8 0.30 Example 29 2.26 0.008 2.22 0.003 92.8 0.50 Example 30 2.26 0.013 2.26 0.009 92.8 0.70 Example 31 2.30 0.019 2.64 0.008 92.7 0.10 Example 32 2.31 0.006 2.28 0.004 92.8 0.20 Example 33 2.49 0.007 2.47 0.006 92.8 0.10 Example 34 2.46 0.007 2.39 0.004 92.9 0.40 Example 35 2.25 0.012 2.19 0.008 93.0 0.60 Example 36 2.38 0.019 2.44 0.011 92.9 0.10 Example 37 2.29 0.006 2.18 0.004 92.9 0.10 Example 38 2.45 0.007 2.21 0.004 92.9 0.20 Example 39 2.50 0.012 2.47 0.008 92.8 0.20 Example 40 2.69 0.004 2.58 0.002 92.7 0.40 Example 41 2.61 0.004 2.51 0.004 92.7 0.40 Example 42 2.50 0.005 2.44 0.005 92.7 0.50

於以下備註本發明之變化。 [備註1]一種黏著劑組合物,其於頻率28 GHz下之介電常數為2~5, 於頻率28 GHz下之介電損失為0.0001~0.05。 [備註2]如附記1所記載之黏著劑組合物,其於頻率60 GHz下之介電常數為2~5, 於頻率60 GHz下之介電損失為0.0001~0.05。 [備註3]一種黏著劑組合物,其於頻率60 GHz下之介電常數為2~5, 於頻率60 GHz下之介電損失為0.0001~0.05。 [備註4]一種黏著劑層,其係藉由如備註1至3中任一項所記載之黏著劑組合物所形成。 [備註5]一種黏著片材,其具有如備註4所記載之黏著劑層。 [備註6]一種毫米波天線,其係至少具有如備註5所記載之黏著片材及基板者,且上述基板至少於單面具備天線元件,於上述基板之具有上述天線元件一側之面上貼著有上述黏著片材。 Variations of the present invention are noted below. [Note 1] An adhesive composition having a dielectric constant of 2 to 5 at a frequency of 28 GHz, The dielectric loss at a frequency of 28 GHz is 0.0001 to 0.05. [Note 2] The adhesive composition as described in Note 1, whose dielectric constant at a frequency of 60 GHz is 2 to 5, The dielectric loss at a frequency of 60 GHz is 0.0001 to 0.05. [Note 3] An adhesive composition having a dielectric constant of 2 to 5 at a frequency of 60 GHz, The dielectric loss at a frequency of 60 GHz is 0.0001 to 0.05. [Note 4] An adhesive layer formed from the adhesive composition according to any one of Notes 1 to 3. [Note 5] An adhesive sheet having the adhesive layer as described in Note 4. [Note 6] A millimeter-wave antenna comprising at least the adhesive sheet and a substrate as described in Note 5, and the substrate has an antenna element on at least one side, and the substrate has the antenna element on the side on the side The above-mentioned adhesive sheet is attached.

1A:毫米波天線 1B:毫米波天線 1C:毫米波天線 2:毫米波天線元件 4:天線積層體 10:黏著片材 10a:黏著片材 10b:黏著片材 11:毫米波天線基板 12:罩蓋構件 13:圖像顯示面板 41:覆蓋玻璃 42:黏著劑層 43:毫米波用貼片天線 43a:微帶線路 44:天線基板 45:銅接地層 46:天線膜 1A: mmWave antenna 1B: mmWave antenna 1C: mmWave antenna 2: mmWave antenna elements 4: Antenna laminated body 10: Adhesive sheet 10a: Adhesive sheet 10b: Adhesive sheet 11: mmWave antenna substrate 12: Cover member 13: Image display panel 41: Cover glass 42: Adhesive layer 43: Patch Antennas for Millimeter Waves 43a: Microstrip line 44: Antenna substrate 45: Copper ground plane 46: Antenna film

圖1係表示本發明之毫米波天線之一實施形態之模式圖(剖視圖)。 圖2係表示本發明之毫米波天線之一實施形態之模式圖(剖視圖)。 圖3係表示本發明之毫米波天線之一實施形態之模式圖(剖視圖)。 圖4係表示發送接收特性評價所使用之天線積層體之模式圖(剖視圖)。圖4(a)係側方剖視圖,圖4(b)係上方投影圖。 FIG. 1 is a schematic view (sectional view) showing an embodiment of the millimeter wave antenna of the present invention. FIG. 2 is a schematic view (sectional view) showing an embodiment of the millimeter wave antenna of the present invention. FIG. 3 is a schematic diagram (cross-sectional view) showing an embodiment of the millimeter-wave antenna of the present invention. FIG. 4 is a schematic view (sectional view) showing an antenna laminate used for evaluation of transmission and reception characteristics. Fig. 4(a) is a side sectional view, and Fig. 4(b) is a top projection view.

Claims (6)

一種黏著劑組合物,其於頻率28 GHz下之介電常數為2~5, 於頻率28 GHz下之介電損失為0.0001~0.05。 An adhesive composition having a dielectric constant of 2 to 5 at a frequency of 28 GHz, The dielectric loss at a frequency of 28 GHz is 0.0001 to 0.05. 如請求項1之黏著劑組合物,其於頻率60 GHz下之介電常數為2~5, 於頻率60 GHz下之介電損失為0.0001~0.05。 As claimed in the adhesive composition of claim 1, its dielectric constant at a frequency of 60 GHz is 2 to 5, The dielectric loss at a frequency of 60 GHz is 0.0001 to 0.05. 一種黏著劑組合物,其於頻率60 GHz下之介電常數為2~5, 於頻率60 GHz下之介電損失為0.0001~0.05。 An adhesive composition having a dielectric constant of 2 to 5 at a frequency of 60 GHz, The dielectric loss at a frequency of 60 GHz is 0.0001 to 0.05. 一種黏著劑層,其係藉由如請求項1至3中任一項之黏著劑組合物所形成。An adhesive layer formed by the adhesive composition according to any one of claims 1 to 3. 一種黏著片材,其具有如請求項4之黏著劑層。An adhesive sheet having the adhesive layer as claimed in claim 4. 一種毫米波天線,其係至少具有如請求項5之黏著片材及基板者,且上述基板至少於單面具備天線元件,於上述基板之具有上述天線元件一側之面上貼著有上述黏著片材。A millimeter-wave antenna, which at least has the adhesive sheet and substrate as claimed in claim 5, and the substrate is provided with an antenna element on at least one side, and the adhesive is attached to the side of the substrate with the antenna element. Sheet.
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