TW202313871A - Curable composition for inkjet and for partition wall formation, light-emitting device, and method for manufacturing light-emitting device - Google Patents

Abstract

Provided is a curable composition which is for an inkjet and for partition wall formation, and from which a partition wall having a large aspect ratio and a high infrared light shielding property can be formed. A curable composition for an inkjet and for partition wall formation according to the present invention comprises: a photocurable compound having (meth)acryloyl groups and vinyl groups in a total number of at least two, while not having a cyclic ether group; a thermosetting compound having a cyclic ether group; a photopolymerization initiator; a thermosetting agent; and an infrared shielding agent.

Description

Curable composition for inkjet and barrier rib formation, light-emitting device, and method for producing light-emitting device

The present invention relates to a curable composition for inkjet and barrier rib formation which is applied by using an inkjet device. Also, the present invention relates to a light-emitting device using the above-mentioned curable composition and a method for manufacturing the light-emitting device.

In recent years, light-emitting devices capable of irradiating infrared light have been widely used. As said light emitting device, the smart phone etc. which mount the face authentication system are mentioned, for example. A conventional light-emitting device includes a first member such as a substrate, a second member such as a glass member, a light-emitting member capable of irradiating infrared light arranged on the surface of the first member, and a plastic case connecting the first member and the second member. body. The above-mentioned plastic casing is usually arranged to surround the light-emitting component, and is formed of a material that does not easily leak infrared light (for example, the following patent document 1). [Prior Art Literature] [Patent Document]

[Patent Document 1] WO2015/025593A1

[Problem to be solved by the invention]

In recent years, the miniaturization of light emitting devices has been continuously developed. However, it is not easy to sufficiently reduce the distance between the light-emitting member and the plastic case in the previous light-emitting device using a plastic case, and thus, the miniaturization of the light-emitting device is limited.

In order to achieve miniaturization of the light-emitting device, it is conceivable to use an inkjet device to apply a curable composition in a frame shape around the light-emitting member, and to cure the applied curable composition to form a barrier wall, thereby manufacturing a light-emitting device. . In this case, regarding the performance of the above-mentioned curable composition, performance that can form a barrier rib having a large aspect ratio (height/width) and high infrared light shielding property is required.

However, conventional inkjet curable compositions are not easy to form barrier ribs with a large aspect ratio. Moreover, the conventional curable composition for inkjet was difficult to improve the infrared light shielding property of a barrier rib.

An object of the present invention is to provide a curable composition for inkjet and barrier rib formation capable of forming barrier ribs with a large aspect ratio and high infrared light shielding property. In addition, the object of the present invention is to provide a light-emitting device using the above-mentioned curable composition and a method for manufacturing the light-emitting device. [Technical means to solve the problem]

According to a broad aspect of the present invention, there is provided a curable composition for inkjet and barrier rib formation (hereinafter, sometimes simply referred to as "curable composition"), which comprises: a total of two or more (meth)acrylic Photocurable compounds with acyl and vinyl groups without cyclic ether groups, thermosetting compounds with cyclic ether groups, photopolymerization initiators, thermosetting agents, and infrared light shielding agents.

In a specific aspect of the curable composition of the present invention, the infrared light shielding agent includes carbon black, a metal complex having a phthalocyanine skeleton, or a metal complex having a naphthalocyanine skeleton.

In a specific aspect of the curable composition of the present invention, the metal complex of the above-mentioned metal complexes having a phthalocyanine skeleton is a vanadium complex or a copper complex, and the above-mentioned metal complexes having a naphthalocyanine skeleton Metal complexes in metal complexes are vanadium complexes or copper complexes.

In a specific aspect of the curable composition of the present invention, the carbon black has an average primary particle diameter of not less than 20 nm and not more than 100 nm.

In a specific aspect of the curable composition of the present invention, the thermosetting compound includes a thermosetting compound having two or more cyclic ether groups.

In a specific aspect of the curable composition of the present invention, the photocurable compound includes a photocurable compound having a dicyclopentadiene skeleton.

In a specific aspect of the curable composition of the present invention, the thermosetting compound includes a light and thermosetting compound having a (meth)acryl group.

In a specific aspect of the curable composition of the present invention, the photocurable compound includes a photocurable compound having a total of three or more (meth)acryl groups and vinyl groups.

In a specific aspect of the curable composition of the present invention, the content of the above-mentioned photocurable compound is not less than 10% by weight and not more than 75% by weight.

In a specific aspect of the curable composition of the present invention, the thermosetting agent includes an aromatic amine compound.

In a specific aspect of the curable composition of the present invention, the aromatic amine compound includes 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy) Phenyl] Phenyl.

In a specific aspect of the curable composition of the present invention, the curable composition further includes a dispersant.

In a specific aspect of the curable composition of the present invention, the acid value of the above-mentioned dispersant is not less than 10 mgKOH/g and not more than 100 mgKOH/g, and the amine value of the above-mentioned dispersant is not less than 10 mgKOH/g and not more than 100 mgKOH/g the following.

According to a broad aspect of the present invention, there is provided a light-emitting device comprising a first member, a light-emitting member disposed on a first surface of the first member, and a barrier rib disposed on the first surface of the first member. , and the barrier rib is a cured product of the curable composition for inkjet and barrier rib formation.

In a specific aspect of the light-emitting device of the present invention, the light-emitting device includes a second member, the light-emitting member is a light-emitting member capable of irradiating infrared light, and the barrier wall is disposed on the first member so as to surround the light-emitting member. on the first surface, and the barrier wall connects the first member and the second member.

According to a broad aspect of the present invention, there is provided a method of manufacturing a light-emitting device, which includes the following steps: a coating step, which is to use an inkjet device to apply the above-mentioned curable composition for inkjet and barrier rib formation to a configuration Forming a curable composition layer on the first surface of the first member having the light-emitting member; and a photocuring step of curing the curable composition layer by light irradiation to form a B-staged compound layer.

In a specific aspect of the method for manufacturing a light-emitting device of the present invention, the method for manufacturing a light-emitting device includes the following steps: an arranging step of arranging a second layer on the surface of the B-stage compound layer opposite to the first member 2 members; and a thermosetting step of thermally curing the B-stage compound layer by heating, and in the arranging step, arranging the above-mentioned 2nd member. [Effect of Invention]

The curable composition for inkjet and barrier rib formation of the present invention includes: a photocurable compound having a total of two or more (meth)acryl groups and vinyl groups and not having a cyclic ether group; Thermosetting compound, photopolymerization initiator, thermosetting agent and infrared light shielding agent. In the curable composition for inkjet and barrier rib formation of the present invention, since it has the above-mentioned constitution, it is possible to form a barrier rib having a large aspect ratio and high infrared light shielding property.

Hereinafter, the present invention will be described in detail.

(Curable composition for inkjet and barrier rib formation) The curable composition for inkjet and barrier rib formation of the present invention (hereinafter, sometimes simply referred to as "curable composition") is applied by using an inkjet device (use of the curable composition using an inkjet device) Coating and use to form barrier walls). The curable composition of the present invention differs from a curable composition applied by screen printing, and from a curable composition applied by a dispenser.

The curable composition of the present invention includes: a photocurable compound having a total of two or more (meth)acryl groups and vinyl groups and not having a cyclic ether group, a thermosetting compound having a cyclic ether group, a photopolymerizable Initiator, thermosetting agent and infrared light shielding agent.

In this specification, the said "photocurable compound which has a total of 2 or more (meth)acryloyl groups and vinyl groups and does not have a cyclic ether group" may be called "(A) photocurable compound".

In this specification, the above-mentioned "thermosetting compound having a cyclic ether group" may be referred to as "(B) thermosetting compound".

Therefore, the curable composition of the present invention includes (A) a photocurable compound, (B) a thermosetting compound, a photopolymerization initiator, a thermosetting agent, and an infrared light shielding agent.

In the curable composition of this invention, since it has the said structure, the barrier rib with a large aspect ratio and high infrared light shielding property can be formed. The curable composition of the present invention can form a barrier rib having an aspect ratio (height/width) required for a light-emitting device. Also, in the light emitting device, if the infrared light irradiated by the light emitting member leaks to an unintended area, the performance of the light emitting device will be degraded. The curable composition of the present invention can form a barrier wall with high shielding property for infrared light, so that the infrared light irradiated by the light-emitting member is difficult to leak to unintended places.

In addition, the curable composition of the present invention can be applied to the vicinity of the light-emitting member with high precision using an inkjet device, so that the light-emitting device can be miniaturized.

Moreover, in the curable composition of this invention, since it has the said structure, the bonding strength of a member to be bonded and a barrier rib can be improved.

The above-mentioned curable composition contains (A) a photocurable compound and (B) a thermosetting compound, so it is a photo and thermosetting composition. The above-mentioned curable composition is preferably used after hardening by light irradiation and then hardening by heating.

Hereinafter, the details of each component contained in the said curable composition are demonstrated. Furthermore, in this specification, "(meth)acryl" means either or both of "acryl" and "methacryl", and "(meth)acrylate" means " One or both of "acrylate" and "methacrylate". In addition, in this specification, the _CH2 =C(H or _CH3 ) group which a (meth)acryloyl group has is not included in the above-mentioned vinyl group.

＜(A) Photocurable compound＞ The said curable composition contains (A) photocurable compound. (A) The photocurable compound is a photocurable compound which has a total of two or more (meth)acryl groups and vinyl groups and does not have a cyclic ether group. (A) The photocurable compound may have a (meth)acryl group, may have a vinyl group, and may have both a (meth)acryl group and a vinyl group. (A) The photocurable compound has a (meth)acryl group or a vinyl group. In this case, (A) photocurable compound has at least 1 sort(s) of a (meth)acryl group and a vinyl group. (A) The photocurable compound may have a (meth)acryl group and a vinyl group. (A) The photocurable compound may have a (meth)acryl group, and may have a vinyl group. The (meth)acryl group and the vinyl group are photocurable functional groups. (A) The photocurable compound does not have an epoxy group (cyclic ether group), for example. (A) The photocurable compound may use only 1 type, and may use 2 or more types together.

(A) The photocurable compound has two or more (meth)acryl groups and vinyl groups in total. In the case where the curable composition contains an infrared light shielding agent, generally speaking, the photoreactivity (photocurability) of the curable composition tends to decrease, but in the present invention, since the number of photocurable functional groups used is relatively small The more (A) photohardenable compound, the number of points that respond to light irradiation increases. As a result, in this invention, hardening of the said curable composition can be made to advance favorably by light irradiation. Also, in the present invention, by using (A) a photocurable compound having a large number of photocurable functional groups, the curing of the above-mentioned curable composition can be carried out well by light irradiation, and it can be improved after photocuring. The ratio of forming a three-dimensional structure in the cross-linked state. As a result, in the present invention, even when the curable composition contains an infrared light shielding agent, a barrier rib having a large aspect ratio can be formed.

(A) The photocurable compound preferably contains a photocurable compound having a total of 3 or more (meth)acryl groups and vinyl groups, and more preferably contains a total of 4 or more (meth)acryl groups and vinyl groups. Based photohardening compound. (A) The photocurable compound further preferably contains a photocurable compound having a total of 5 or more (meth)acryl groups and vinyl groups, and particularly preferably contains a total of 6 or more (meth)acryl groups and Photohardening compound for vinyl. In this case, photocurability can be further improved, and the barrier rib with a larger aspect ratio can be formed. (A) The total number of (meth)acryl groups and vinyl groups in the photocurable compound may be 100 or less, 50 or less, or 10 or less.

(A) The photocurable compound preferably includes a photocurable compound having a total of two (meth)acryl groups and vinyl groups, and a photocurable compound having a total of three or more (meth)acryl groups and vinyl groups Sexual compounds. (A) The photocurable compound is more preferably a photocurable compound having a total of two (meth)acryl groups and vinyl groups, and a photocurable compound having a total of four or more (meth)acryl groups and vinyl groups Sexual compounds. (A) The photocurable compound further preferably includes a photocurable compound having a total of two (meth)acryl groups and vinyl groups, and a photocurable compound having a total of five or more (meth)acryl groups and vinyl groups. hardening compound. (A) The photocurable compound preferably includes a photocurable compound having a total of 2 (meth)acryl groups and vinyl groups, and a photocurable compound having a total of 6 or more (meth)acryl groups and vinyl groups. Sexual compounds. In this case, photocurability can be further improved, and the barrier rib with a larger aspect ratio can be formed.

(A) The photocurable compound preferably has a (meth)acryl group from the viewpoint of forming a curable composition layer with high precision and further improving photocurability and forming barrier ribs with a larger aspect ratio. , preferably having two or more (meth)acryloyl groups. (A) The photocurable compound is preferably a (meth)acrylate compound, more preferably a polyfunctional (meth)acrylate compound.

(A) The photocurable compound may contain difunctional (meth)acrylate compounds, trifunctional (meth)acrylate compounds, tetrafunctional (meth)acrylate compounds, or pentafunctional The (meth)acrylate compound may also include a hexafunctional (meth)acrylate compound. (A) The photocurable compound may contain a (meth)acrylate compound having more than seven functions. For example, "difunctional" in a difunctional (meth)acrylate compound means that there are two (meth)acryl groups.

(A) The photocurable compound preferably contains a difunctional (meth)acrylate compound, more preferably contains a trifunctional or higher (meth)acrylate compound, and further preferably contains a tetrafunctional or higher (meth)acrylate compound. Acrylate compound. (A) The photocurable compound is more preferably a (meth)acrylate compound containing five or more functions, particularly preferably a (meth)acrylate compound containing six or more functions. In this case, photocurability can be further improved, and the barrier rib with a larger aspect ratio can be formed. Also, a curable composition layer can be formed with higher precision.

Examples of the difunctional (meth)acrylate compound include: ethoxylated bisphenol A di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, 1,4-butanedimethacrylate Alcohol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonane di(meth)acrylate, 1,10-decanediol di(meth)acrylate Acrylates, Neopentyl glycol di(meth)acrylate, 2,4-Dimethyl-1,5-pentanediol di(meth)acrylate, Butylethylpropylene glycol di(meth)acrylate , Ethoxylated cyclohexanemethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate , 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate And dipropylene glycol di(meth)acrylate, etc.

As the above-mentioned trifunctional (meth)acrylate compound, for example, glycerol propoxy tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri( Meth)acrylate, alkylene oxide modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate ((meth)acryloxypropyl)ether, isocyanuric acid alkylene oxide modified tri(meth)acrylate, dipentaerythritol propionate tri(meth)acrylate, isocyanuric acid tri(( Meth)acryloxyethyl) ester, sorbitol tri(meth)acrylate, etc.

Examples of the tetrafunctional (meth)acrylate compound include: pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate And dipentaerythritol propionate tetra(meth)acrylate, etc.

As said pentafunctional (meth)acrylate compound, a sorbitol penta (meth)acrylate and a dipentaerythritol penta (meth)acrylate are mentioned, for example.

Examples of the hexafunctional (meth)acrylate compound include: dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene. Acrylic etc.

As (A) photocurable compound which has a vinyl group, vinyl ethers, a vinyl derivative, dicyclopentadiene, etc. are mentioned.

(A) The photocurable compound preferably contains a photocurable compound having a polyol skeleton, and more preferably contains a (meth)acrylate compound having a polyol skeleton. In this case, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be further increased.

The (meth)acryl group (functional number) of the above-mentioned (meth)acrylate compound having a polyol skeleton may be 2, may be 2 or more, may be 3 or more, or may be 4 More than one, may be more than five, may be more than six. The number of (meth)acryl groups contained in the (meth)acrylate compound having a polyol skeleton may be 100 or less, 50 or less, or 10 or less.

(A) The photocurable compound preferably contains a photocurable compound having a dicyclopentadiene skeleton, and more preferably contains a (meth)acrylate compound having a dicyclopentadiene skeleton. In this case, since the hardening shrinkage of the curable composition is reduced by making the dicyclopentadiene skeleton a rigid skeleton, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be further improved .

The (meth)acryl group (functional number) of the above-mentioned (meth)acrylate compound having a dicyclopentadiene skeleton may be 2, or 2 or more, or 3 or more, or Four or more, five or more, or six or more may be used. The number of (meth)acryl groups contained in the (meth)acrylate compound having a dicyclopentadiene skeleton may be 100 or less, 50 or less, or 10 or less.

In 100% by weight of the above-mentioned curable composition, the content of (A) photocurable compound is preferably at least 10% by weight, more preferably at least 15% by weight, further preferably at least 20% by weight, and more preferably at least 75% by weight % or less, more preferably 70% by weight or less, further preferably 65% by weight or less. Photocurability can be further improved as content of (A) photocurable compound is more than the said minimum and below the said upper limit, and the barrier rib with a larger aspect ratio can be formed. Moreover, if content of (A) photocurable compound is below the said upper limit, the adhesive strength of a bonding object member (1st member and 2nd member) and a barrier rib can be improved further.

In 100% by weight of the curable composition, the content of the photocurable compound having a polyol skeleton is preferably at least 10% by weight, more preferably at least 15% by weight, further preferably at least 20% by weight, and more preferably It is 75 weight% or less, More preferably, it is 70 weight% or less, More preferably, it is 65 weight% or less. When content of the photocurable compound which has the said polyol skeleton is more than the said minimum and below the said upper limit, photocurability can be improved further, and the barrier rib with a larger aspect ratio can be formed. Moreover, when content of the photocurable compound which has the said polyol skeleton is more than the said minimum and below the said upper limit, the bonding strength of the member to be bonded (1st member and 2nd member) and a barrier rib can be further improved.

(A) In 100% by weight of the photocurable compound, the content of the photocurable compound having a polyol skeleton is preferably at least 10% by weight, more preferably at least 20% by weight, and more preferably at most 90% by weight, and more preferably at least 90% by weight. Preferably, it is at most 80% by weight. When content of the photocurable compound which has the said polyol skeleton is more than the said minimum and below the said upper limit, photocurability can be improved further, and the barrier rib with a larger aspect ratio can be formed. Moreover, when content of the photocurable compound which has the said polyol skeleton is more than the said minimum, the adhesive strength of the member to be bonded (1st member and 2nd member) and a barrier rib can be improved further.

In 100% by weight of the above-mentioned curable composition, the content of (A) photocurable compound other than the above-mentioned photocurable compound having a polyol skeleton is preferably at least 10% by weight, more preferably at least 20% by weight, and even more preferably It is preferably at least 30% by weight, and is preferably at most 65% by weight, more preferably at most 60% by weight, and still more preferably at most 55% by weight. When content of (A) photocurable compound other than the photocurable compound which has the said polyol skeleton is more than the said minimum, photocurability can be improved further, and the barrier rib with a larger aspect ratio can be formed. Also, if the content of the (A) photocurable compound other than the above photocurable compound having a polyol skeleton is below the above upper limit, the bond between the member to be bonded (the first member and the second member) and the barrier rib can be further increased. Then intensity.

In 100% by weight of the curable composition, the content of the photocurable compound having a dicyclopentadiene skeleton is preferably at least 5% by weight, more preferably at least 10% by weight, and still more preferably at least 15% by weight. And it is preferably 65% by weight or less, more preferably 60% by weight or less, and still more preferably 55% by weight or less. When content of the photocurable compound which has the said dicyclopentadiene frame|skeleton is more than the said minimum, photocurability can be improved further, and the barrier rib with a larger aspect ratio can be formed. Moreover, if content of the photocurable compound which has the said dicyclopentadiene skeleton is below the said upper limit, the adhesive strength of the member to be bonded (1st member and 2nd member) and a barrier rib can be improved further.

(A) The content of the photocurable compound having a dicyclopentadiene skeleton in 100% by weight of the photocurable compound is preferably at least 10% by weight, more preferably at least 20% by weight, and more preferably 90% by weight or less, more preferably 80% by weight or less. When content of the photocurable compound which has the said dicyclopentadiene frame|skeleton is more than the said minimum, photocurability can be improved further, and the barrier rib with a larger aspect ratio can be formed. Moreover, when content of the photocurable compound which has the said dicyclopentadiene skeleton is more than the said minimum and below the said upper limit, the bonding strength of the member to be bonded (1st member and 2nd member) and a barrier rib can be further improved.

＜(B) Thermosetting compound＞ The said curable composition contains (B) a thermosetting compound. (B) The thermosetting compound is a thermosetting compound having a cyclic ether group. The cyclic ether group is a thermosetting functional group. (B) The thermosetting compound may use only 1 type, and may use 2 or more types together.

(B) As said cyclic ether group which a thermosetting compound has, an epoxy group etc. are mentioned. (B) The thermosetting compound may have only 1 type of cyclic ether group, and may have 2 or more types of cyclic ether groups.

(B) It is preferable that the said cyclic ether group which a thermosetting compound has is an epoxy group. (B) The thermosetting compound preferably has an epoxy group. (B) The thermosetting compound is preferably an epoxy compound. In this case, the curable composition layer can be formed with high precision. In addition, thermosetting properties can be further improved, and barrier ribs with a larger aspect ratio can be formed. In addition, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be further improved.

(B) The thermosetting compound may include a thermosetting compound having one cyclic ether group, a thermosetting compound having two cyclic ether groups, or a thermosetting compound having two or more cyclic ether groups. The thermosetting compound may also include a thermosetting compound having three or more cyclic ether groups. (B) The thermosetting compound may include an epoxy compound having one epoxy group, an epoxy compound having two epoxy groups, or an epoxy compound having two or more epoxy groups, or An epoxy compound having three or more epoxy groups may be contained. (B) The number of cyclic ether groups or epoxy groups in the thermosetting compound may be 100 or less, 50 or less, or 10 or less.

From the viewpoint of exerting the effects of the present invention more effectively, the (B) thermosetting compound preferably includes a thermosetting compound having two or more cyclic ether groups, more preferably a thermosetting compound having two or more epoxy groups. of epoxy compounds. In this case, the curable composition layer can be formed with high precision. In addition, thermosetting properties can be further improved, and barrier ribs with a larger aspect ratio can be formed. In addition, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be further improved.

As said epoxy compound, bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol S type epoxy compound, phenolic novolak type epoxy compound, biphenyl type epoxy compound, Biphenyl novolak type epoxy compound, biphenol type epoxy compound, naphthalene type epoxy compound, fennel type epoxy compound, phenol aralkyl type epoxy compound, naphthol aralkyl type epoxy compound, dicyclopentadiene Diene-type epoxy compounds, anthracene-type epoxy compounds, epoxy compounds with an adamantane skeleton, epoxy compounds with a tricyclodecane skeleton, naphthyl ether-type epoxy compounds, and those with a three-skeleton nucleus epoxy compounds etc.

(B) The thermosetting compound may have a (meth)acryl group, and may not have a (meth)acryl group. (B) The thermosetting compound may contain a thermosetting compound having a (meth)acryl group, or may not contain a thermosetting compound having a (meth)acryl group.

The (B) thermosetting compound having a (meth)acryloyl group is a light and thermosetting compound.

In this specification, the said "(B) thermosetting compound which has a (meth)acryloyl group" may be referred to as "(B1) light and thermosetting compound".

(B1) The photo- and thermosetting compound is a photo- and thermosetting compound having a (meth)acryl group and a cyclic ether group. (B1) Light and thermosetting compounds may be used alone or in combination of two or more.

(B) It is preferable that a thermosetting compound contains (B1) light and a thermosetting compound. In this case, the photocurability can be further improved, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be maintained well, and a barrier rib with a larger aspect ratio can be formed.

(B1) The light and thermosetting compound may have 1 (meth)acryl group, and may have 2 or more (meth)acryl groups.

As (B1) light and thermosetting compound, glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, etc. are mentioned.

(B1) The light and thermosetting compound preferably contains glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, more preferably contains 4-hydroxybutyl (methyl) Acrylate Glycidyl Ether. In this case, photocurability can be further improved, and the barrier rib with a larger aspect ratio can be formed.

The content of the thermosetting compound (B) in 100% by weight of the curable composition is preferably at least 5% by weight, more preferably at least 10% by weight, still more preferably at least 15% by weight, and even more preferably at least 20% by weight % or more, especially preferably more than 30% by weight. The content of (B) thermosetting compound in 100% by weight of the curable composition is preferably at most 80% by weight, more preferably at most 70% by weight, further preferably at most 60% by weight, and even more preferably at most 40% by weight % or less, preferably less than 35% by weight, particularly preferably less than 30% by weight. A curable composition layer can be formed with high precision as content of (B) a thermosetting compound is more than the said minimum and below the said upper limit. In addition, thermosetting properties can be further improved, and barrier ribs with a larger aspect ratio can be formed. Furthermore, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be further improved.

In 100% by weight of the above-mentioned curable composition, the content of the light and thermosetting compound (B1) is preferably at least 10% by weight, more preferably at least 20% by weight, and still more preferably at least 30% by weight. In 100% by weight of the above curable composition, the content of (B1) light and thermosetting compound is preferably 80% by weight or less, more preferably 70% by weight or less, further preferably 60% by weight or less, and even more preferably 40% by weight or less, preferably 35% by weight or less, particularly preferably 30% by weight or less. When the content of the (B1) light and thermosetting compound is more than the above-mentioned minimum and below the above-mentioned upper limit, photocurability and thermosetting properties can be further improved, and barrier ribs with a larger aspect ratio can be formed. Moreover, if content of (B1) light and a thermosetting compound is more than the said minimum, the adhesive strength of the member to be bonded (1st member and 2nd member) and a barrier rib can be improved further.

(B) In 100% by weight of the thermosetting compound, the content of (B1) light and thermosetting compound is preferably at least 10% by weight, more preferably at least 20% by weight, further preferably at least 30% by weight, and more preferably Preferably it is 90 weight% or less, More preferably, it is 80 weight% or less, More preferably, it is 70 weight% or less. When content of (B1) light and a thermosetting compound is more than the said minimum, photocurability can be improved further, and the barrier rib with a larger aspect ratio can be formed. Moreover, if content of (B1) light and a thermosetting compound is below the said upper limit, the adhesive strength of the member to be bonded (1st member and 2nd member) and a barrier rib can be improved further.

The total content of the (A) photocurable compound and (B) thermosetting compound is preferably at least 55% by weight, more preferably at least 60% by weight, and still more preferably 65% by weight in 100% by weight of the curable composition. %above. A curable composition layer can be formed with high precision as the said total content is more than the said minimum. Moreover, when the said total content is more than the said minimum, photocurability and thermosetting property can be improved further, and the barrier rib with a larger aspect ratio can be formed. Furthermore, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be further improved. The upper limit of the total content of (A) photocurable compound and (B) thermosetting compound in 100 weight% of said curable composition is not specifically limited. The total content of the (A) photocurable compound and (B) thermosetting compound in 100% by weight of the curable composition is preferably at most 95% by weight, more preferably 90% by weight, and still more preferably 85% by weight the following.

＜Photopolymerization Initiator＞ The above curable composition contains a photopolymerization initiator. The said photoinitiator may use only 1 type, and may use 2 or more types together.

As said photoinitiator, a photoradical polymerization initiator, a photocationic polymerization initiator, etc. are mentioned. The aforementioned photopolymerization initiator is preferably a photoradical polymerization initiator.

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、2,4-二異丙基9-氧硫𠮿

等9-氧硫𠮿

化合物；苯乙酮二甲基縮酮、苯偶醯二甲基縮酮等縮酮化合物；2,4,6-三甲基苯甲醯基二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦等醯基氧化膦化合物；1,2-辛二酮、1-[4-(苯硫基)-2-(鄰苯甲醯基肟)]、乙酮、1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-1-(鄰乙醯基肟)等肟酯化合物；雙(環戊二烯基)二苯基鈦、雙(環戊二烯基)二氯鈦、雙(環戊二烯基)-雙(2,3,4,5,6-五氟苯基)鈦、雙(環戊二烯基)-雙(2,6-二氟-3-(吡咯-1-基)苯基)鈦等二茂鈦化合物等。上述光自由基聚合起始劑可僅使用1種，亦可併用2種以上。The above-mentioned photoradical polymerization initiator is a compound used to generate free radicals by light irradiation to start the radical polymerization reaction. Examples of the aforementioned photoradical polymerization initiator include: benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; 2-hydroxy-2-methyl-1-phenyl-propan-1-one Isophenone compounds; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloro Acetophenone compounds such as acetophenone; 2-methyl-1-[4-(methylthio)phenyl]-2-?olinylpropan-1-one, 2-benzyl-2-dimethylamine Base-1-(4-𠰌linylphenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-𠰌linylphenyl)-butanone-1 , 2-(Dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-𠰌linyl)phenyl]-1-butanone, N,N -Aminoacetophenone compounds such as dimethylaminoacetophenone; anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, and 2-tert-butylanthraquinone; 2,4-dimethylanthraquinone 9-oxosulfur

, 2,4-Diethyl 9-oxosulfur 𠮿

, 2-Chloro9-oxosulfur 𠮿

, 2,4-Diisopropyl 9-oxosulfur 𠮿

9-oxosulfur

Compounds; ketal compounds such as acetophenone dimethyl ketal and benzoyl dimethyl ketal; 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis(2,4,6 Acyl phosphine oxide compounds such as -trimethylbenzoyl)-phenylphosphine oxide; ], ethyl ketone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(o-acetyl oxime) and other oxime ester compounds; Bis(cyclopentadienyl)diphenyl titanium, bis(cyclopentadienyl)dichlorotitanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl ) titanium, titanocene compounds such as bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)phenyl)titanium, and the like. The said photoradical polymerization initiator may use only 1 type, and may use 2 or more types together.

A photopolymerization initiation adjuvant may be used together with the photoradical polymerization initiator described above. Examples of the photopolymerization initiation aid include ethyl N,N-dimethylaminobenzoate, isoamyl N,N-dimethylaminobenzoate, 4-dimethylaminobenzene Amyl formate, triethylamine and triethanolamine, etc. A photopolymerization initiation adjuvant other than these may also be used. The said photopolymerization start adjuvant may use only 1 type, and may use 2 or more types together.

In addition, titanocene compounds such as CGI-784 (manufactured by Ciba Specialty Chemical Co., Ltd.) that absorb in the visible light region can be used to promote photoreaction.

As said photocationic polymerization initiator, a percilium salt, an odonium salt, a metallocene compound, benzoin tosylate, etc. are mentioned. The said photocationic polymerization initiator may use only 1 type, and may use 2 or more types together.

The content of the photopolymerization initiator is preferably at least 0.1% by weight, more preferably at least 0.5% by weight, further preferably at least 1% by weight, and more preferably 30% by weight in 100% by weight of the curable composition. or less, more preferably 20% by weight or less, further preferably 10% by weight or less.

＜Thermohardener＞ The above curable composition contains a thermosetting agent. The said thermosetting agent may use only 1 type, and may use 2 or more types together.

Examples of the thermosetting agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. As the thermosetting agent, modified polyamine compounds such as amine-epoxy adducts can be used. Thermosetting agents other than these may also be used.

The aforementioned amine compound means a compound having one or more amino groups. The above-mentioned amine compounds may be primary amines, secondary amines, or tertiary amines. Examples of the amine compound include aliphatic amine compounds, alicyclic amine compounds, aromatic amine compounds, hydrazine, and guanidine derivatives. The aforementioned aliphatic amine compound may be an aliphatic polyamine. The aforementioned alicyclic amine compound may be an alicyclic polyamine. The above-mentioned aromatic amine compound may be an aromatic polyamine. In addition, the above-mentioned amine compound can use epoxy compound addition polyamine (reaction product of epoxy compound and polyamine), Michael can add polyamine (reaction product of α,β-unsaturated ketone and polyamine), Manny Greek addition polyamine (condensate of polyamine, formalin and phenol), thiourea addition polyamine (reaction product of thiourea and polyamine), ketone-blocked polyamine (reaction product of ketone compound and polyamine[ Ketimine]) and other adducts.

As said aliphatic polyamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, etc. are mentioned.

Examples of the above-mentioned cycloaliphatic polyamines include: menthanediamine, isophoronediamine, N-aminoethylpiperone, 3,9-bis(3-aminopropyl)-2,4 ,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane and bis(4-aminocyclohexyl)methane, etc.

Examples of the aromatic polyamine include m-phenylenediamine, p-phenylenediamine, o-xylylenediamine, m-xylylenediamine, p-xylylenediamine, 4,4-diaminodiphenylmethane , 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diamine Diphenylphenylene, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-amino Phenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]pyridine, bis[4-( 3-aminophenoxy)phenyl]pyridine, 1,3-bis(3-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline) and 4,4-bis Aminodiphenylsulfone, etc.

As said hydrazide, carbohydrazide, adipate dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, isophthalic acid dihydrazine, etc. are mentioned.

Examples of the above-mentioned guanidine derivatives include: dicyandiamide, 1-o-tolylbiguanide, α-2,5-dimethylguanidine, α,ω-diphenylbiguanide, α,α-biformamidinyl Guanidinyl diphenyl ether, p-chlorophenyl biguanide, α,α-hexamethylene bis[ω-(p-chlorophenol)] biguanide, phenyl biguanide oxalate, acetylguanidine and diethyl Cyanoacetylguanidine, etc.

As said phenol compound, a polyphenol compound etc. are mentioned. Examples of the polyphenol compound include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4' -Biphenylphenol, phenolic novolak resins containing naphthalene skeleton, phenolic novolac resins containing xylylene skeleton, phenolic novolac resins containing dicyclopentadiene skeleton, and phenolic novolak resins containing fennel skeleton Varnish resin, etc.

Examples of the acid anhydride include: phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl phthalic anhydride, dodecane Succinic anhydride, chlorendic anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, methylcyclohexene tetracarboxylic dianhydride, trimellitic anhydride and polyazelaic anhydride, etc.

The above-mentioned thermosetting agent preferably contains an amine compound, preferably an amine compound. The aforementioned amine compound is preferably an aromatic amine compound. From the viewpoint of improving the inkjet dischargeability of the curable composition and forming a barrier wall with a larger aspect ratio, the aromatic amine compound preferably contains 1,3-bis(3-aminophenoxy)benzene or Bis[4-(3-aminophenoxy)phenyl]pyridine. In this case, the above-mentioned aromatic amine compound contains at least one of 1,3-bis(3-aminophenoxy)benzene and bis[4-(3-aminophenoxy)phenyl]pyridine. The above-mentioned aromatic amine compound may include 1,3-bis(3-aminophenoxy)benzene and bis[4-(3-aminophenoxy)phenyl]pyridine. The above-mentioned aromatic amine compound may include 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]pyridine. When the above-mentioned thermosetting agent contains these preferred compounds, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be further improved.

In 100% by weight of the curable composition, the content of the thermosetting agent is preferably at least 1% by weight, more preferably at least 5% by weight, further preferably at least 10% by weight, and more preferably at most 40% by weight, More preferably, it is 30 weight% or less, More preferably, it is 25 weight% or less.

＜Infrared light shielding agent＞ The above curable composition contains an infrared light shielding agent. By making the said curable composition contain an infrared light shielding agent, the infrared light shielding property of the barrier rib formed from the said curable composition can be improved. The said infrared light shielding agent may use only 1 type, and may use 2 or more types together.

The above-mentioned infrared light shielding agent is not particularly limited as long as it is a particle or a compound having the property of shielding infrared light.

Examples of the infrared shielding agent include carbon black, carbon nanotubes, graphene, lanthanum hexaboride compounds, cesium tungsten oxide compounds, dithiol compounds, naphthoquinone compounds, ammonium compounds, imonium compounds, Nitrogen compounds, phthalocyanine compounds, naphthalocyanine compounds, anthracene phthalocyanine compounds, quinacridone compounds, amphenene compounds, dioxin compounds, perylene compounds, indole compounds, etc.

In terms of further improving the infrared light shielding property, the infrared light shielding agent preferably contains carbon black, a phthalocyanine compound or a naphthalocyanine compound, more preferably contains carbon black, a metal complex having a phthalocyanine skeleton, or A metal complex with a naphthalocyanine skeleton. In this case, the infrared light shielding agent includes at least one of carbon black, a phthalocyanine compound, and a naphthalocyanine compound. The infrared light shielding agent may contain at least two of carbon black, phthalocyanine compounds, and naphthalocyanine compounds, and may also contain carbon black, phthalocyanine compounds, and naphthalocyanine compounds. The above-mentioned infrared light shielding agent may contain carbon black, may also contain phthalocyanine compounds, and may also contain naphthalocyanine compounds. The infrared light shielding agent further preferably contains carbon black from the viewpoint of being excellent in light absorption in a wide range from near-infrared light to infrared light and further improving infrared light-shielding properties. From the point of view of excellent light absorption in the local area of near-infrared light, formation of barrier ribs with larger aspect ratio without inhibiting the photohardening reaction of (A) photocurable compound, and further improvement of infrared light shielding properties, the above-mentioned The infrared light shielding agent further preferably contains a metal complex having a phthalocyanine skeleton.

When the curable composition includes an infrared light shielding agent, the average primary particle size of the carbon black is preferably at least 15 nm, more preferably at least 20 nm, further preferably at least 30 nm, and more preferably at least 100 nm. nm or less, more preferably 90 nm or less. When the average primary particle diameter of the above-mentioned carbon black is more than the above-mentioned lower limit, the dispersion of the carbon black in the curable composition can be further improved when the above-mentioned curable composition is heated and circulated for coating using an inkjet device. Therefore, it can improve the inkjet ejectability of the curable composition and form a barrier wall with a larger aspect ratio.

The average primary particle diameter of the above-mentioned carbon black can be measured using a transmission electron microscope (TEM). As a transmission electron microscope, "JEM-ARM200F" by JEOL Ltd. etc. are mentioned, for example. The long axis and short axis of the particle image obtained by a transmission electron microscope were measured, and the geometric mean value (long axis x short axis) ^1/2 of the measured values was used as the primary particle diameter of the above-mentioned carbon black. It is preferable to measure the primary particle diameter of 100 pieces of the above-mentioned carbon black, and perform an arithmetic average to obtain the average primary particle diameter of the above-mentioned carbon black.

The aforementioned metal complexes having a phthalocyanine skeleton are phthalocyanine compounds. From the viewpoint of further improving infrared light shielding properties, the metal complexes among the metal complexes having a phthalocyanine skeleton are preferably vanadium complexes or copper complexes. The above-mentioned phthalocyanine compound is preferably a phthalocyanine containing a vanadium atom or a copper atom.

The aforementioned metal complex having a naphthalocyanine skeleton is a naphthalocyanine compound. From the viewpoint of further improving infrared light shielding properties, the metal complex among the metal complexes having a naphthalocyanine skeleton is preferably a vanadium complex or a copper complex. The aforementioned naphthalocyanine compound is preferably naphthalocyanine containing a vanadium atom or a copper atom.

In 100% by weight of the curable composition, the content of the infrared light shielding agent is preferably at least 0.1% by weight, more preferably at least 0.5% by weight, and preferably at most 10% by weight, more preferably at most 5% by weight. If the content of the above-mentioned infrared light shielding agent is more than the above-mentioned lower limit and below the above-mentioned upper limit, the infrared light shielding property can be further improved, and a barrier wall with a larger aspect ratio can be formed.

＜(C) Photocurable compound＞ The above-mentioned curable composition may contain a photocurable compound having a total of one (meth)acryl group and vinyl group and not having a cyclic ether group. In this case, the storage stability of a curable composition can be further improved.

In this specification, the said "photocurable compound which has one (meth)acryloyl group and a vinyl group in total and does not have a cyclic ether group" may be called "(C) photocurable compound".

(C) The photocurable compound may have a (meth)acryl group, and may have a vinyl group. (C) The photocurable compound has only one of a (meth)acryl group and a vinyl group. (C) The photocurable compound may have a (meth)acryl group, and may have a vinyl group. The (meth)acryl group and the vinyl group are photocurable functional groups. (C) The photocurable compound does not have an epoxy group (cyclic ether group), for example. (C) The photocurable compound may use only 1 type, and may use 2 or more types together.

As (C) photocurable compound (monofunctional (meth)acrylate compound) which has a (meth)acryloyl group, Methyl (meth)acrylate, ethyl (meth)acrylate, ( n-propyl methacrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, (meth)acrylic acid Tertiary butyl ester, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, ( 3-hydroxybutyl methacrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, (meth)acrylate ) phenyl acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxytriethyl Glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, isodecyl (meth)acrylate, isononyl (meth)acrylate, Iso(meth)acrylate, dicyclopentadienyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono(meth)acrylate, (meth)acrylate base) 2-ethylhexyl acrylate, dihydroxycyclopentadienyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, (meth)acrylate base) dicyclopentyl acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, lauryl (meth)acrylate and stearyl (meth)acrylate, etc.

Examples of the photocurable compound (C) having a vinyl group include vinyl ethers, vinyl derivatives, styrene, chloromethylstyrene, α-methylstyrene, maleic anhydride, and N-vinylpyrrole. Pyridone and N-vinylformamide, etc.

The content of the photocurable compound (C) in 100% by weight of the curable composition is preferably at most 30% by weight, more preferably at most 20% by weight, and even more preferably at most 10% by weight. If the content of the (C) photocurable compound is below the above-mentioned upper limit, the content of the (A) photocurable compound that can be included in the curable composition can be increased. Great barrier. The lower limit of content of (C) photocurable compound in 100 weight% of said curable compositions is not specifically limited. The content of the photocurable compound (C) in 100% by weight of the curable composition may be 0% by weight or more, may exceed 0% by weight, may be 1% by weight or more, or may be 5% by weight or more. The said curable composition does not need to contain (C) photocurable compound.

The total content of the (A) photocurable compound, (B) thermosetting compound, and (C) photocurable compound is preferably at least 55% by weight, more preferably 60% by weight, in 100% by weight of the curable composition. or more, and more preferably 65% by weight or more. A curable composition layer can be formed with high precision as the said total content is more than the said minimum. Also, barrier ribs with a larger aspect ratio can be formed. Furthermore, the bonding strength between the members to be bonded (the first member and the second member) and the barrier rib can be further improved. The upper limit of the total content of (A) photocurable compound, (B) thermosetting compound, and (C) photocurable compound is not specifically limited. The total content of (A) photocurable compound, (B) thermosetting compound, and (C) photocurable compound is preferably at most 95% by weight, more preferably at most 90% by weight, further preferably at most 85% by weight .

＜Hardening Accelerator＞ The above-mentioned curable composition may contain a curing accelerator, or may not contain a curing accelerator. The said hardening accelerator may use only 1 type, and may use 2 or more types together.

As said hardening accelerator, a tertiary amine, an imidazole, a quaternary ammonium salt, a quaternary phosphonium salt, an organic metal salt, a phosphorus compound, a urea compound, etc. are mentioned.

The content of the hardening accelerator is preferably at least 0.01% by weight, more preferably at least 0.05% by weight, and preferably at most 10% by weight, more preferably at most 5% by weight, based on 100% by weight of the curable composition.

<Solvent> The said curable composition may contain a solvent, and may not contain a solvent. The said solvent may use only 1 type, and may use 2 or more types together.

As said solvent, water, an organic solvent, etc. are mentioned.

From the viewpoint of further improving the removability of residues, the above-mentioned solvent is preferably an organic solvent.

Examples of the organic solvent include: alcohols such as ethanol; ketones such as acetone, methyl ethyl ketone, and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; Cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether and other glycol ethers ; Ethyl acetate, butyl acetate, butyl lactate, acetic acid cellosolve, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, di Esters such as propylene glycol monomethyl ether acetate and propylene carbonate; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether and naphtha, etc.

From the viewpoint of further improving the thickness accuracy of the curable composition layer, the less the content of the solvent in the curable composition, the better.

When the above-mentioned curable composition contains the above-mentioned solvent, the content of the above-mentioned solvent in 100% by weight of the above-mentioned curable composition is preferably 5% by weight or less, more preferably 1% by weight or less, and still more preferably 0.5% by weight the following. The above-mentioned curable composition preferably does not contain the above-mentioned solvent.

＜Dispersant＞ The above curable composition may or may not contain a dispersant. The curable composition described above preferably contains a dispersant. When the above-mentioned curable composition contains a dispersant, when the above-mentioned curable composition is heated and circulated for coating using an inkjet device, the dispersibility of carbon black in the curable composition is further improved, and by This can improve the inkjet ejectability of the curable composition and form a barrier wall with a larger aspect ratio.

The above-mentioned dispersant has a structure in which a hydrophilic skeleton and an lipophilic skeleton are covalently bonded in one molecule. Examples of the above-mentioned dispersants include cationic dispersants, anionic dispersants, nonionic dispersants, amphoteric dispersants, silicone-based dispersants, fluorine-based dispersants, and polymer-based dispersants. agent. The above-mentioned dispersants may be used alone or in combination of two or more.

As said cationic dispersant, the resin and compound etc. which have an amino group are mentioned. The above-mentioned cationic dispersant preferably has an amino group. The above-mentioned cationic dispersant may have one amine group, may have two amine groups, may have three amine groups, or may have four amine groups. The number of amine groups in the cationic dispersant may be 100 or less, 50 or less, or 10 or less. The above-mentioned cationic dispersant need not be a thermosetting agent.

As said anionic dispersant, the resin and compound etc. which have a carboxyl group, a sulfonic acid group, a sulfate ester group, or a phosphoric acid ester group are mentioned. The above-mentioned anionic dispersant preferably has a carboxyl group, a sulfonic acid group, a sulfate ester group or a phosphate ester group.

As said nonionic dispersant, the nonionic dispersant which has a polyoxyethylene group, the nonionic dispersant which has an amide group, etc. are mentioned. Examples of the nonionic dispersant having the polyoxyethylene group include polyoxyethylene alkyl ether, polyoxyethylene alkylaryl ether, acetylene glycol, and polyoxyethylene glycol ester copolymer. Examples of the nonionic dispersant having an amide group include polyoxyethylene fatty acid amide and the like.

Examples of the polymer-based dispersant include BYK-9076 (manufactured by BYK), DISPERBYK-145 (manufactured by BYK), Flowlen GW-1500 (manufactured by Kyoeisha Chemical Co., Ltd.), Efka PX4701 (manufactured by BASF) and Hinoact T-6000 (manufactured by Chuanyan Fine Chemical Co., Ltd.), etc.

From the viewpoint of improving the inkjet dischargeability of the curable composition and forming a barrier wall with a larger aspect ratio, the molecular weight of the above-mentioned dispersant is preferably 500 or more, more preferably 1000 or more, still more preferably 2000 or more, and Preferably it is 50,000 or less, more preferably 25,000 or less, and still more preferably 10,000 or less.

The acid value of the above-mentioned dispersant is preferably above 0 mgKOH/g, more preferably above 10 mgKOH/g, more preferably above 20 mgKOH/g, and preferably below 100 mgKOH/g, more preferably below 90 mgKOH/g below g. When the acid value of the dispersant is not less than the above-mentioned lower limit and not more than the above-mentioned upper limit, the inkjet ejectability of the curable composition can be improved, a barrier wall with a larger aspect ratio can be formed, and the pot life can be improved. The amine value of the above-mentioned dispersant is preferably 0 mgKOH/g or more, more preferably 10 mgKOH/g or more, further preferably 20 mgKOH/g or more, and preferably 100 mgKOH/g or less, more preferably 90 mgKOH/g below g. When the amine value of the dispersant is not less than the above-mentioned lower limit and not more than the above-mentioned upper limit, the inkjet ejectability of the curable composition can be improved, a barrier wall with a larger aspect ratio can be formed, and the pot life can be improved. In terms of improving the inkjet dischargeability of the curable composition, forming a barrier wall with a larger aspect ratio, and improving the pot life, it is preferable that the acid value of the above-mentioned dispersant is not less than 10 mgKOH/g and not more than 100 mgKOH/g , the amine value of the above-mentioned dispersant is not less than 10 mgKOH/g and not more than 100 mgKOH/g.

＜Other ingredients＞ The above-mentioned curable composition may contain other components other than the above-mentioned components. The above-mentioned other components are not particularly limited, and examples thereof include adhesive aids such as coupling agents, fillers, leveling agents, defoamers, and polymerization inhibitors.

(Other details of curable composition) Since the curable composition is applied using an inkjet device, it is generally in a liquid state at 25°C. The viscosity of the above curable composition at 25°C and 10 rpm is preferably at least 3 mPa･s, more preferably at least 5 mPa･s, still more preferably at least 10 mPa･s, still more preferably 160 mPa･s Above, and preferably 2000 mPa･s or less, more preferably 1600 mPa･s or less, still more preferably 1500 mPa･s or less. From the perspective of further improving the thickness accuracy of the curable composition layer and making the curable composition layer less likely to generate pores, the viscosity of the above curable composition at 25°C and 10 rpm is preferably 160 mPa･s or more Below 1600 mPa･s.

The above-mentioned viscosity is measured at 25° C. using an E-type viscometer (for example, “TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.

Using the curable composition described above, the first member and the second member can be bonded together, and a barrier wall can be formed. The above-mentioned curable composition is preferably used for coating on the first surface of the above-mentioned first member. The above-mentioned curable composition is preferably applied on the first surface of the first member so as to surround the light-emitting member arranged on the first surface of the first member. The above-mentioned curable composition is preferably used for coating on the first surface of the first member in a frame shape. The above curable composition is preferably used to form a frame-shaped barrier rib. Preferably, a light-emitting member exists inside the above-mentioned frame-shaped barrier rib. It is preferable that an internal space exists inside the above-mentioned barrier wall. It is preferable that a void portion exists inside the above-mentioned barrier wall.

In addition, the details of the above-mentioned first member, the above-mentioned second member, and the above-mentioned light emitting member will be described below.

(Light-emitting device and manufacturing method of light-emitting device) The light-emitting device of the present invention includes a first member, a light-emitting member arranged on the first surface of the first member, and a barrier wall arranged on the first surface of the first member, and the barrier wall is the inkjet. and a cured product of the curable composition for barrier rib formation.

The light emitting device described above preferably includes a second member. In the above light-emitting device, it is preferable that the barrier ribs bond the first member and the second member together. In the above-mentioned light-emitting device, it is preferable that the barrier rib is arranged on the first surface of the first member so as to surround the light-emitting member.

The manufacturing method of the above-mentioned light-emitting device preferably includes the following steps (1)-(4). (1) Coating step, which is to use an inkjet device to apply the above-mentioned curable composition for inkjet and barrier rib formation on the first surface of the first member on which the light emitting member is arranged to form a curable composition layer. (2) A photocuring step of curing the curable composition layer by light irradiation to form a B-staged layer. (3) An arranging step of arranging a second member on the surface of the B-stage compound layer opposite to the first member. (4) Thermal hardening step, which is to thermally harden the above-mentioned B-stage compound layer by heating.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. In addition, in the following drawings, for convenience of illustration, the size, thickness, shape, etc. may differ from the actual size, thickness, shape, etc. in some cases.

Fig. 1(a) is a plan view schematically showing a light emitting device obtained by using the curable composition for inkjet and barrier rib formation according to the first embodiment of the present invention, and Fig. 1(b) schematically shows the light emitting device The cross-sectional view. Fig. 1(b) is a sectional view along the I-I line of Fig. 1(a).

A light emitting device 10 shown in FIG. 1 includes a first member 1 , a second member 2 , a barrier wall 3 , and a light emitting member 4 . The barrier wall 3 is a cured product of the above curable composition. The barrier rib 3 is a light and thermosetting product of the above-mentioned curable composition. The barrier wall 3 connects the first surface 1 a of the first member 1 and the first surface 2 a of the second member 2 . The barrier wall 3 is arranged on the first surface 1 a of the first member 1 and on the first surface 2 a of the second member 2 . The barrier wall 3 is disposed on the first surface 1 a of the first member 1 so as to surround the light emitting member 4 . The barrier wall 3 is not disposed on the surface of the light emitting member 4 . The shape of the barrier wall 3 is a frame shape. A space is formed by the portion surrounded by the first member 1 , the second member 2 and the barrier wall 3 .

An example of a method of manufacturing the light-emitting device shown in FIG. 1 will be described with reference to FIGS. 2( a ) to ( c ) and FIGS. 3( d ) to ( f ).

First, as shown in FIG. 2( a), the curable composition is coated on the first surface 1 a of the first member 1 on which the light-emitting member 4 is disposed using an inkjet device to form a curable composition layer 3A (coated with a curable composition). cloth step). A curable composition is applied on the upper surface of the first member 1 to form a curable composition layer 3A. The curable composition is ejected from the ejection unit 51 of the inkjet device.

Then, as shown in FIG. 2( b), the curable composition layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device to harden the curable composition layer 3A to form a B-staged layer 3B (photocuring step ). The B-stage compound layer 3B is a pre-cured layer of the curable composition.

Furthermore, in the above-mentioned method of manufacturing a light-emitting device, after the curable composition is applied to a specific region, the entire applied curable composition may be irradiated with light to form a B-staged layer. In the above-mentioned method for producing a light-emitting device, each time a plurality of drops of the curable composition is applied, the applied curable composition may be irradiated with light to form a B-staged layer. In the above-mentioned method for producing a light-emitting device, each time a drop of the curable composition is applied, the applied curable composition may be irradiated with light to form a B-staged layer.

After the photohardening step, it is judged whether it is necessary to repeat the coating step and the photohardening step. When it is necessary to repeat the above-mentioned coating step and the above-mentioned photocuring step, the curable composition is applied to the surface side opposite to the first member side of the formed B-stage compound layer.

FIG. 2(c) and FIG. 3(d) are diagrams showing the second coating step and the second photocuring step, respectively. As shown in FIG. 2(c), a curable composition is applied on the surface of the B-staged compound layer 3B opposite to the first member 1 using an inkjet device, thereby forming a curable composition on the surface of the B-staged compound layer 3B. Composition Layer 3A. Next, as shown in FIG. 3( d ), the applied curable composition layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device to form the B-staged compound layer 3B.

In Figures 2 and 3, the above-mentioned coating step and the above-mentioned photocuring step are carried out twice in the thickness direction of the curable composition layer, that is, Figure 2(a) and Figure 2(b), Figure 2(c) and Figure 2 3(d). By performing the above-mentioned coating step and the above-mentioned photocuring step multiple times in the thickness direction of the curable composition layer, the thickness of the B-staged layer can be increased, and the aspect ratio (thickness/ width). The above-mentioned coating step and the above-mentioned photocuring step may be performed two or more times, or three or more times.

By repeating the above-mentioned coating step and the above-mentioned photocuring step, the B-staged compound layer 3B arranged so as to surround the light emitting member 4 is formed.

Next, as shown in FIG. 3( e ), the second member 2 is arranged on the surface of the B-stage compound layer 3B arranged to surround the light-emitting member 4 , which is opposite to the first member 1 (arranging step). The second member 2 is disposed on the surface of the frame-shaped B-stage compound layer 3B. Pressure can be applied when placing the second member.

Next, as shown in FIG. 3( f ), the B-staged compound layer 3B is thermally hardened by heating (thermal hardening step). The B-stage compound layer 3B is thermally cured by heating the laminated structure including the first member 1 , the second member 2 , and the B-stage compound layer 3B obtained in FIG. 3( e ). Thereby, barrier rib 3 is formed. The barrier wall 3 is a light and thermosetting material layer of a curable composition.

In this way, the light emitting device 10 shown in FIG. 1 can be obtained.

In the coating step, it is preferable to apply (discharge) while circulating the curable composition from the viewpoint of forming a barrier rib having a larger aspect ratio.

The above-mentioned inkjet device is not particularly limited, and an inkjet device capable of coating the curable composition of the present invention can be used. The above-mentioned inkjet device preferably has: an ink cartridge storing the above-mentioned curable composition; a discharge part connected to the above-mentioned ink cartridge and ejecting the above-mentioned curable composition; part, and the other end is connected to the above-mentioned ink cartridge, and the above-mentioned curable composition flows inside. In this case, the inkjet discharge property of the said curable composition can be improved, and the barrier rib with a larger aspect ratio can be formed.

The circulation channel part may have a buffer tank and a pump in the circulation channel part, or may not have a buffer tank and a pump. It is preferable that the said circulation flow path part has the said buffer tank in the said circulation flow path part, and it is preferable to have the said pump. In addition, the circulation flow path may include a flow meter, a thermometer, a filter, a liquid level sensor, and the like in addition to the buffer tank and the pump in the circulation flow path.

From the viewpoint of improving the inkjet dischargeability of the curable composition and forming barrier ribs with a larger aspect ratio, it is preferable to circulate the curable composition while heating it. When circulating the curable composition while heating, the temperature of the curable composition can be adjusted by introducing a heater into the ink cartridge or using a heater in the circulation flow path.

From the viewpoint of improving the inkjet dischargeability of the curable composition and forming barrier ribs with a larger aspect ratio, the temperature of the curable composition to be circulated is preferably 30°C or higher, more preferably 40°C or higher, Preferably it is below 120°C, more preferably below 100°C.

In the above-mentioned photocuring step, it is preferable to irradiate with ultraviolet rays. The illuminance and irradiation time of ultraviolet light in the above-mentioned photocuring step can be appropriately changed according to the composition of the curable composition and the coating thickness of the curable composition. The illuminance of ultraviolet rays in the photocuring step can be, for example, 1000 mW/cm ² or more, 5000 mW/cm ² or more, and can be 10000 mW/cm ² or less, or 8000 mW/cm ² or less. The irradiation time of the ultraviolet rays in the above-mentioned photocuring step may be, for example, 0.01 second or more, may be 0.1 second or longer, and may be 400 seconds or less, or may be 100 seconds or less.

In the arranging step, it is preferable to arrange the second member on the surface of the B-stage compound layer arranged to surround the light emitting member. In the above arrangement step, it is preferable to bond the surface of the frame-shaped B-stage compound layer to the second member.

The above thermal hardening step is preferably performed after the above configuration step.

The heating temperature and heating time in the above-mentioned thermosetting step can be appropriately changed according to the composition of the curable composition and the thickness of the B-staged layer. The heating temperature in the above-mentioned thermosetting step may be, for example, 100° C. or higher, or 120° C. or higher, and may be 250° C. or lower, or 200° C. or lower. The heating time in the above-mentioned thermosetting step may be, for example, not less than 5 minutes, not less than 30 minutes, not more than 600 minutes, or not more than 300 minutes.

The width, height, shape, etc. of the above-mentioned barrier ribs can be changed as appropriate.

The width of the barrier rib is preferably at least 5 μm, more preferably at least 10 μm, still more preferably at least 25 μm, and more preferably at most 300 μm, more preferably at most 200 μm, even more preferably at most 100 μm. The intensity|strength of a barrier rib can be improved that the width|variety of the said barrier rib is more than the said minimum. The light-emitting device can be further miniaturized as the width of the said barrier rib is below the said upper limit. Infrared light shielding property can be further improved that the width|variety of the said barrier rib is more than the said minimum.

The height of the barrier ribs is preferably at least 50 μm, more preferably at least 100 μm, further preferably at least 200 μm, and more preferably at most 3000 μm, more preferably at most 2000 μm, even more preferably at most 1000 μm. When the height of the said barrier rib is more than the said minimum, the barrier rib with a larger aspect ratio can be formed. When the height of the said barrier rib is below the said upper limit, a light-emitting device can be further miniaturized. Moreover, when the height of the said barrier rib is below the said upper limit, generation|occurrence|production of deformation|transformation of a barrier rib can be suppressed effectively.

The aspect ratio (the ratio of height to width (height/width)) of the barrier rib is preferably 3 or more, more preferably 5 or more, further preferably 10 or more, and is preferably 100 or less, more preferably 50 or less , and more preferably 30 or less. When the said aspect ratio (height/width) is more than the said minimum, a light-emitting device can be further miniaturized. The strength of a barrier rib can be improved that the said aspect-ratio (height/width) is below the said upper limit.

As the above-mentioned first member, a circuit board, a semiconductor element, a silicon substrate, and the like may, for example, be mentioned.

As said 2nd member, a transparent member etc. are mentioned. Regarding the above-mentioned second member as the above-mentioned transparent member, transparent glass members such as diffusion glass and IR (infrared, infrared) cut glass, etc. are mentioned, for example. The above-mentioned second member is preferably a transparent glass member.

The above light emitting member is preferably a light emitting member capable of irradiating infrared light. As the light emitting member, a 3D (three-dimensional, three-dimensional) sensor light source and the like may, for example, be mentioned.

Hereinafter, the present invention will be further described in detail by way of examples. The present invention is not limited to the following examples.

Prepare the following materials.

((A) Photocurable compound) Hexafunctional (meth)acrylate compound: dipentaerythritol hexaacrylate ("DPHA" manufactured by DAICEL-ALLNEX) Trifunctional (meth)acrylate compound: Trimethylolpropane triacrylate ("TMPTA" manufactured by DAICEL-ALLNEX) Difunctional (meth)acrylate compound 1: Ethoxylated bisphenol A diacrylate ("APG-700" manufactured by Shin-Nakamura Chemical Industry Co., Ltd., (meth)acrylate compound having a polyol skeleton) Difunctional (meth)acrylate compound 2: Tricyclodecane dimethanol diacrylate ("IRR214K" manufactured by DAICEL-ALLNEX, a (meth)acrylate compound having a dicyclopentadiene skeleton) Difunctional (meth)acrylate compound 3: 1,6-hexanediol diacrylate ("HDDA" manufactured by DAICEL-ALLNEX)

((B) thermosetting compound) (B1) Light and thermosetting compound: 4-hydroxybutyl (meth)acrylate glycidyl ether ("4HBAGE" manufactured by Mitsubishi Chemical Corporation) Difunctional epoxy compound: Bisphenol A type epoxy compound ("850CRP" manufactured by DIC Corporation)

((C) photocurable compound) Monofunctional (meth)acrylate compound: 2-ethylhexyl acrylate ("2EHA" manufactured by Nippon Shokubai Co., Ltd.)

(photopolymerization initiator) 2-(Dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-(4-metholinyl)phenyl]-1-butanone (manufactured by IGM "Irg379")

(Thermohardener) 1,3-Bis(3-aminophenoxy)benzene ("APB-N" manufactured by Mitsui Chemicals Co., Ltd.) Bis[4-(3-aminophenoxy)phenyl]pyridine ("BAPS-M" manufactured by Seika Corporation) 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane ("Curehard MED" manufactured by Combination Chemicals Co., Ltd.) Dicyandiamide ("DICY7" manufactured by Mitsubishi Chemical Corporation)

(silane coupling agent) 3-Glycidyloxypropylmethyldimethoxysilane ("KBM-402" manufactured by Shin-Etsu Chemical Co., Ltd.) 3-Glycidoxypropylmethyldiethoxysilane ("KBE-402" manufactured by Shin-Etsu Chemical Co., Ltd.)

(infrared light shielding agent) Phthalocyanine vanadium complex ("HA-1" manufactured by Nippon Shokubai Co., Ltd.) Copper phthalocyanine complex ("FDN-006" manufactured by Yamada Chemical Industry Co., Ltd.) Phthalocyanine metal complex ("FDN-008" manufactured by Yamada Chemical Industry Co., Ltd.) Carbon black 1 ("SF Black BJ2296" manufactured by Sanyo Pigment Co., Ltd., with an average primary particle size of 35 nm) Carbon black 2 ("MA600" manufactured by Mitsubishi Chemical Corporation, the average primary particle size is 20 nm) Carbon black 3 ("PD-605" manufactured by Mikuni Pigment Co., Ltd., with an average primary particle size of 65 nm) Carbon black 4 ("#10" manufactured by Mitsubishi Chemical Corporation, the average primary particle size is 75 nm) Carbon black 5 ("#20" manufactured by Mitsubishi Chemical Corporation, the average primary particle size is 50 nm) Carbon black 6 ("#85" manufactured by Mitsubishi Chemical Corporation, the average primary particle size is 40 nm) Carbon black 7 ("MA220" manufactured by Mitsubishi Chemical Corporation, the average primary particle size is 55 nm) Carbon black 8 ("MCF88" manufactured by Mitsubishi Chemical Corporation, the average primary particle size is 18 nm) Carbon black 9 ("#850" manufactured by Mitsubishi Chemical Corporation, the average primary particle size is 17 nm)

(Dispersant) Wetting and dispersing agent ("BYK9076" manufactured by BYK, acid value 38 mgKOH/g, amine value 44 mgKOH/g) Wetting and dispersing agent ("DISPERBYK-145" manufactured by BYK, acid value 76 mgKOH/g, amine value 71 mgKOH/g) Wetting and dispersing agent ("Flowlen GW-1500" manufactured by Kyoeisha Chemical Co., Ltd., acid value 55 mgKOH/g, amine value 0 mgKOH/g) Wetting and dispersing agent ("EfkaPX4701" manufactured by BASF, acid value 0 mgKOH/g, amine value 40 mgKOH/g)

(Examples 1 to 40 and Comparative Examples 1 and 2) The components shown in Tables 1 to 9 were prepared in the compounding amounts (pure components) shown in Tables 1 to 9, and mixed uniformly to obtain curable compositions for inkjet and barrier rib formation.

(evaluate) (1) Formation of barrier ribs with large aspect ratio (1) Formation of barrier ribs with a width of 300 μm and a height of 1 mm, 2) Formation of barrier ribs with a width of 200 μm and a height of 1 mm, and 3) Formation of a barrier rib with a width of 100 μm Formability of barrier ribs with μm and height of 1 mm) The obtained curable composition was coated on the first member using an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device (coating step). Next, ultraviolet rays are irradiated to the applied curable composition to form a B-staged compound layer (photocuring step). The above-mentioned coating step and the above-mentioned photocuring step are repeated in the thickness direction of the formed B-staged compound layer. Next, the obtained B-stage compound layer is heated and thermally cured to form barrier ribs (light and thermal cured layer) (thermal curing step). The shape of the barrier rib was observed using a laser microscope ("OLS4100" by Olympus Corporation).

As described above, it was confirmed whether 1) a barrier rib with a width of 300 μm and a height of 1 mm, 2) a barrier rib with a width of 200 μm and a height of 1 mm, and 3) a barrier rib with a width of 100 μm and a height of 1 mm could be formed. In addition, in the table, "A" means that the barrier rib having the above-mentioned shape can be formed, and "B" means that the barrier rib having the above-mentioned shape cannot be formed.

(2) Infrared light shielding property of the barrier wall The obtained curable composition was coated on the first member using an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device (coating step). Next, ultraviolet rays are irradiated to the applied curable composition to form a B-staged compound layer (photocuring step). The above-mentioned coating step and the above-mentioned photocuring step are repeated in the thickness direction of the formed B-staged compound layer. Next, the obtained B-stage compound layer is heated and thermally cured (thermal curing step). Using a spectrophotometer ("U-4100" manufactured by Hitachi High-Tech Co., Ltd.), the obtained light and the infrared transmittance (optical path length: 100 μm) at a wavelength of 950 nm of the heat-cured layer were measured.

<Criteria for judging the infrared light shielding property of the barrier wall> ○○: Infrared transmittance of 950 nm wavelength is less than 0.1% ○: Infrared transmittance at wavelength 950 nm is 0.1% to 10% ×: The transmittance of infrared rays with a wavelength of 950 nm exceeds 10%

(3) Adhesion between the target member and the barrier wall A glass substrate (5 cm x 5 cm) was prepared as a member to be bonded. On the glass substrate, the obtained curable composition was coated on the glass substrate using an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device (coating step). Next, ultraviolet rays are irradiated to the applied curable composition to form a B-staged compound layer (photocuring step). The above-mentioned coating step and the above-mentioned photocuring step are repeated in the thickness direction of the formed B-staged compound layer. Next, the obtained B-stage compound layer was heated and thermally cured to form barrier ribs (light and thermal curable layer) with a height of 150 μm (thermal curing step). In the obtained barrier rib, incisions were made in the vertical and horizontal directions at intervals of 1 mm to make 100 squares. Each grid of the barrier rib was observed using a laser microscope ("OLS4100" manufactured by Olympus Corporation), and the adhesion between the bonding object member and the barrier rib was determined based on the following criteria.

[Criteria for judging the adhesion between the target member and the barrier wall] ○○: The number of squares where the barrier wall is peeled off is 0 to 10 〇: The number of squares where the barrier wall is peeled off is 11 to 30 ×: The number of squares where the barrier wall is peeled off is 31 or more

(4) Inkjet ejectability A test was performed in which the obtained curable composition was ejected from the inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device. Inkjet discharge properties were judged based on the following criteria.

[Judgment criteria for inkjet ejection performance] A: The curable composition can be sprayed continuously for more than 100 hours without uneven spraying B: The curable composition can be sprayed without unevenness during the continuous spraying period of 10 hours, but slightly uneven discharge occurs during the continuous spraying period of more than 10 hours and less than 100 hours C: The curable composition can be sprayed continuously for more than 10 hours, but the spraying is slightly uneven during the continuous spraying period of 10 hours D: The curable composition can be ejected, but cannot be ejected continuously for more than 10 hours E: The curable composition can be ejected, but the ejection is uneven at the initial stage F: Cannot be sprayed at the initial stage of spraying the curable composition

The compositions and results are shown in Tables 1 to 9 below.

[Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA 10 10 10 10 Trifunctional (meth)acrylate compound TMPTA Difunctional (meth)acrylate compound 1 APG-700 Difunctional (meth)acrylate compound 2 IRR214K 10 10 10 10 Difunctional (meth)acrylate compound 3 HDDA 30 (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 30 10 10 10 10 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE 40 40 40 40 Difunctional epoxy compound 850CRP 20 heat hardener APB-N 9 20 20 20 20 BAPS-M Curehard MED DICY7 Silane coupling agent KBM-402 0.5 0.5 0.5 0.5 0.5 KBE-402 0.5 0.5 0.5 0.5 0.5 Photopolymerization initiator Irg379 9 8 8 8 8 Dispersant BYK-9076 DISPERBYK-145 Flowlen GW-1500 EfkaPX4701 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 1 1 1.5 copper phthalocyanine complex FDN-006 1 Phthalocyanine metal complexes FDN-008 1 carbon black 1 SF Black BJ2296 carbon black 2 MA600 carbon black 3 PD-605 carbon black 4 #10 carbon black 5 #20 carbon black 6 #85 carbon black 7 MA220 carbon black 8 MCF88 carbon black 9 #850 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A A A A A 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm B A A A A 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm B A A A A Adhesion between the object component and the barrier wall 〇〇 〇 〇 〇 〇 Infrared light shielding property of the barrier wall 〇 〇 〇 〇 〇〇 Inkjet Discharge A A A A A

[Table 2] Example 6 Example 7 Example 8 Example 9 Example 10 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA 10 10 10 10 Trifunctional (meth)acrylate compound TMPTA Difunctional (meth)acrylate compound 1 APG-700 20 Difunctional (meth)acrylate compound 2 IRR214K 10 10 10 10 Difunctional (meth)acrylate compound 3 HDDA 10 (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 10 10 10 10 30 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE 40 40 40 40 Difunctional epoxy compound 850CRP 20 heat hardener APB-N 20 20 20 20 9 BAPS-M Curehard MED DICY7 Silane coupling agent KBM-402 0.5 0.5 0.5 0.5 0.5 KBE-402 0.5 0.5 0.5 0.5 0.5 Photopolymerization initiator Irg379 8 8 8 8 9 Dispersant BYK-9076 DISPERBYK-145 Flowlen GW-1500 EfkaPX4701 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 1 copper phthalocyanine complex FDN-006 Phthalocyanine metal complexes FDN-008 carbon black 1 SF Black BJ2296 1 1.5 carbon black 2 MA600 1 carbon black 3 PD-605 1 carbon black 4 #10 carbon black 5 #20 carbon black 6 #85 carbon black 7 MA220 carbon black 8 MCF88 carbon black 9 #850 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A A A A A 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm A A A B B 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm B B B B B Adhesion between the object component and the barrier wall 〇 〇 〇 〇 〇〇 Infrared light shielding property of the barrier wall 〇 〇 〇 〇〇 〇 Inkjet Discharge C C C C A

[table 3] Example 11 Example 12 Example 13 Example 14 Example 15 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA Trifunctional (meth)acrylate compound TMPTA 10 10 Difunctional (meth)acrylate compound 1 APG-700 15 Difunctional (meth)acrylate compound 2 IRR214K 20 15 30 Difunctional (meth)acrylate compound 3 HDDA 10 20 20 (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 30 30 15 30 15 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE 30 15 Difunctional epoxy compound 850CRP 20 20 20 15 heat hardener APB-N 9 9 15 9 15 BAPS-M Curehard MED DICY7 Silane coupling agent KBM-402 0.5 0.5 0.5 0.5 0.5 KBE-402 0.5 0.5 0.5 0.5 0.5 Photopolymerization initiator Irg379 9 9 8 9 8 Dispersant BYK-9076 DISPERBYK-145 Flowlen GW-1500 EfkaPX4701 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 1 copper phthalocyanine complex FDN-006 1 Phthalocyanine metal complexes FDN-008 1 carbon black 1 SF Black BJ2296 carbon black 2 MA600 1 carbon black 3 PD-605 1 carbon black 4 #10 carbon black 5 #20 carbon black 6 #85 carbon black 7 MA220 carbon black 8 MCF88 carbon black 9 #850 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A A A A A 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm B B A A A 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm B B B B B Adhesion between the object component and the barrier wall 〇〇 〇〇 〇〇 〇〇 〇〇 Infrared light shielding property of the barrier wall 〇 〇 〇 〇 〇 Inkjet Discharge A A A A A

[Table 4] Example 16 Example 17 Example 18 Example 19 Example 20 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA 10 10 10 10 10 Trifunctional (meth)acrylate compound TMPTA Difunctional (meth)acrylate compound 1 APG-700 Difunctional (meth)acrylate compound 2 IRR214K 9 10 10 10 10 Difunctional (meth)acrylate compound 3 HDDA (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 40 10 10 10 10 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE 40 40 40 40 Difunctional epoxy compound 850CRP 20 heat hardener APB-N 9 20 20 20 BAPS-M 20 Curehard MED DICY7 Silane coupling agent KBM-402 0.5 0.5 0.5 0.5 0.5 KBE-402 0.5 0.5 0.5 0.5 0.5 Photopolymerization initiator Irg379 10 8 8 8 8 Dispersant BYK-9076 DISPERBYK-145 Flowlen GW-1500 EfkaPX4701 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 1 1 copper phthalocyanine complex FDN-006 Phthalocyanine metal complexes FDN-008 carbon black 1 SF Black BJ2296 carbon black 2 MA600 carbon black 3 PD-605 carbon black 4 #10 0.5 0.5 carbon black 5 #20 0.5 carbon black 6 #85 carbon black 7 MA220 carbon black 8 MCF88 carbon black 9 #850 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A A A A A 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm A A A A A 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm A A B B B Adhesion between the object component and the barrier wall 〇〇 〇 〇 〇 〇 Infrared light shielding property of the barrier wall 〇 〇 〇 〇 〇 Inkjet Discharge A A C C C

[table 5] Example 21 Example 22 Example 23 Example 24 Example 25 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA 10 10 10 10 10 Trifunctional (meth)acrylate compound TMPTA Difunctional (meth)acrylate compound 1 APG-700 Difunctional (meth)acrylate compound 2 IRR214K 10 10 10 10 10 Difunctional (meth)acrylate compound 3 HDDA (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 10 10 10 10 10 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE 40 40 40 40 40 Difunctional epoxy compound 850CRP heat hardener APB-N 20 20 20 20 20 BAPS-M Curehard MED DICY7 Silane coupling agent KBM-402 0.5 0.5 0.5 0.5 0.5 KBE-402 0.5 0.5 0.5 0.5 0.5 Photopolymerization initiator Irg379 8 8 8 8 8 Dispersant BYK-9076 0.5 DISPERBYK-145 Flowlen GW-1500 EfkaPX4701 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 copper phthalocyanine complex FDN-006 Phthalocyanine metal complexes FDN-008 carbon black 1 SF Black BJ2296 carbon black 2 MA600 carbon black 3 PD-605 carbon black 4 #10 0.5 carbon black 5 #20 carbon black 6 #85 0.5 carbon black 7 MA220 0.5 carbon black 8 MCF88 0.5 carbon black 9 #850 0.5 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A A A A A 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm A A A A A 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm B B B B B Adhesion between the object component and the barrier wall 〇 〇 〇 〇 〇 Infrared light shielding property of the barrier wall 〇 〇 〇 〇 〇 Inkjet Discharge C C D. D. A

[Table 6] Example 26 Example 27 Example 28 Example 29 Example 30 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA 10 10 10 10 10 Trifunctional (meth)acrylate compound TMPTA Difunctional (meth)acrylate compound 1 APG-700 Difunctional (meth)acrylate compound 2 IRR214K 10 10 10 10 10 Difunctional (meth)acrylate compound 3 HDDA (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 10 10 10 10 10 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE 40 40 40 40 40 Difunctional epoxy compound 850CRP heat hardener APB-N 20 20 20 BAPS-M 20 Curehard MED 20 DICY7 Silane coupling agent KBM-402 0.5 0.5 0.5 0.5 0.5 KBE-402 0.5 0.5 0.5 0.5 0.5 Photopolymerization initiator Irg379 8 8 8 8 8 Dispersant BYK-9076 0.5 DISPERBYK-145 0.5 Flowlen GW-1500 0.5 EfkaPX4701 0.5 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 copper phthalocyanine complex FDN-006 Phthalocyanine metal complexes FDN-008 carbon black 1 SF Black BJ2296 carbon black 2 MA600 carbon black 3 PD-605 carbon black 4 #10 0.5 0.5 0.5 0.5 0.5 carbon black 5 #20 carbon black 6 #85 carbon black 7 MA220 carbon black 8 MCF88 carbon black 9 #850 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A A A A A 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm A A A A A 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm B B B B B Adhesion between the object component and the barrier wall 〇 〇 〇 〇 〇 Infrared light shielding property of the barrier wall 〇 〇 〇 〇 〇 Inkjet Discharge A A B B D.

[Table 7] Example 31 Example 32 Example 33 Example 34 Example 35 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA 10 10 10 Trifunctional (meth)acrylate compound TMPTA Difunctional (meth)acrylate compound 1 APG-700 Difunctional (meth)acrylate compound 2 IRR214K 10 10 10 40 Difunctional (meth)acrylate compound 3 HDDA 20 (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 10 10 10 30 10 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE 40 40 40 40 Difunctional epoxy compound 850CRP 10 heat hardener APB-N 9 20 BAPS-M Curehard MED 20 DICY7 20 20 Silane coupling agent KBM-402 0.5 0.5 0.5 0.5 0.5 KBE-402 0.5 0.5 0.5 0.5 0.5 Photopolymerization initiator Irg379 8 8 8 9 9 Dispersant BYK-9076 0.5 0.5 DISPERBYK-145 Flowlen GW-1500 EfkaPX4701 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 1 1 copper phthalocyanine complex FDN-006 Phthalocyanine metal complexes FDN-008 carbon black 1 SF Black BJ2296 carbon black 2 MA600 carbon black 3 PD-605 carbon black 4 #10 0.5 0.5 0.5 carbon black 5 #20 carbon black 6 #85 carbon black 7 MA220 carbon black 8 MCF88 carbon black 9 #850 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A A A A A 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm A B A B A 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm B B B B B Adhesion between the object component and the barrier wall 〇 〇 〇 〇〇 〇 Infrared shielding property of the barrier wall 〇 〇 〇 〇 〇 Inkjet Discharge B E. C A A

[Table 8] Example 36 Example 37 Example 38 Example 39 Example 40 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA 10 10 5 Trifunctional (meth)acrylate compound TMPTA 10 Difunctional (meth)acrylate compound 1 APG-700 Difunctional (meth)acrylate compound 2 IRR214K 20 30 30 10 15 Difunctional (meth)acrylate compound 3 HDDA (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 10 30 30 10 10 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE 40 40 40 Difunctional epoxy compound 850CRP 10 10 heat hardener APB-N 20 9 9 20 20 BAPS-M Curehard MED DICY7 Silane coupling agent KBM-402 0.5 0.5 0.5 0.5 0.5 KBE-402 0.5 0.5 0.5 0.5 0.5 Photopolymerization initiator Irg379 8 9 8 8 8 Dispersant BYK-9076 DISPERBYK-145 Flowlen GW-1500 EfkaPX4701 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 1 1 1 1 copper phthalocyanine complex FDN-006 Phthalocyanine metal complexes FDN-008 carbon black 1 SF Black BJ2296 carbon black 2 MA600 carbon black 3 PD-605 carbon black 4 #10 1 carbon black 5 #20 carbon black 6 #85 carbon black 7 MA220 carbon black 8 MCF88 carbon black 9 #850 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A A A A A 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm A A A B A 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm B B A B B Adhesion between the object component and the barrier wall 〇〇 〇 〇 〇 〇 Infrared light shielding property of the barrier wall 〇 〇 〇 〇〇 〇 Inkjet Discharge A A A C A

[Table 9] Comparative example 1 Comparative example 2 Deployment ingredients (weight parts) (A) Photocurable compound Hexafunctional (meth)acrylate compound DPHA Trifunctional (meth)acrylate compound TMPTA Difunctional (meth)acrylate compound 1 APG-700 Difunctional (meth)acrylate compound 2 IRR214K Difunctional (meth)acrylate compound 3 HDDA 30 (C) Photocurable compound Monofunctional (meth)acrylate compounds 2EHA 30 60 (B) Thermosetting compound (B1) Light and thermosetting compounds 4HBAGE Difunctional epoxy compound 850CRP 20 20 heat hardener APB-N 9 9 BAPS-M Curehard MED DICY7 Silane coupling agent KBM-402 0.5 0.5 KBE-402 0.5 0.5 Photopolymerization initiator Irg379 10 10 Dispersant BYK-9076 DISPERBYK-145 Flowlen GW-1500 EfkaPX4701 Infrared light shielding agent Phthalocyanine Vanadium Complex HA-1 copper phthalocyanine complex FDN-006 Phthalocyanine metal complexes FDN-008 carbon black 1 SF Black BJ2296 carbon black 2 MA600 carbon black 3 PD-605 carbon black 4 #10 1 carbon black 5 #20 carbon black 6 #85 carbon black 7 MA220 carbon black 8 MCF88 carbon black 9 #850 evaluate 1) Formability of barrier ribs with a width of 300 μm and a height of 1 mm A B 2) Formability of barrier ribs with a width of 200 μm and a height of 1 mm B B 3) Formability of barrier ribs with a width of 100 μm and a height of 1 mm B B Adhesion between the object component and the barrier wall 〇 〇 Infrared light shielding property of the barrier wall x 〇 Inkjet Discharge A A

1: 1st member 1a: Surface 1 2: 2nd member 2a: Surface 1 3: barrier wall 3A: Hardening composition layer 3B: B-stage compound layer 4: Luminous components 10: Lighting device 51: ejection part 52: Light irradiation department

Fig. 1(a) is a plan view schematically showing a light emitting device obtained by using the curable composition for inkjet and barrier rib formation according to the first embodiment of the present invention, and Fig. 1(b) schematically shows the light emitting device The cross-sectional view. 2( a ) to ( c ) are cross-sectional views for explaining each step of the manufacturing method of the light-emitting device shown in FIG. 1 . 3( d ) to ( f ) are sectional views for explaining each step of the manufacturing method of the light-emitting device shown in FIG. 1 .

1: 1st component

1a: Surface 1

2: 2nd member

2a: Surface 1

3: barrier wall

4: Luminous components

10: Lighting device

Claims (17)

A curable composition for inkjet and barrier rib formation, comprising: a photocurable compound having a total of two or more (meth)acryl groups and vinyl groups and not having a cyclic ether group, Thermosetting compounds with cyclic ether groups, photopolymerization initiator, heat hardener, and Infrared light shielding agent. The curable composition for inkjet and barrier rib formation according to claim 1, wherein the infrared light shielding agent includes carbon black, a metal complex having a phthalocyanine skeleton, or a metal complex having a naphthalocyanine skeleton. The curable composition for inkjet and barrier rib formation according to claim 2, wherein the metal complex in the metal complexes having a phthalocyanine skeleton is a vanadium complex or a copper complex, and The metal complexes in the above-mentioned metal complexes having a naphthalocyanine skeleton are vanadium complexes or copper complexes. The curable composition for inkjet and barrier rib formation according to claim 2 or 3, wherein the average primary particle diameter of the carbon black is not less than 20 nm and not more than 100 nm. The curable composition for inkjet and barrier rib formation according to any one of claims 1 to 3, wherein the thermosetting compound includes a thermosetting compound having two or more cyclic ether groups. The curable composition for inkjet and barrier rib formation according to any one of claims 1 to 3, wherein the photocurable compound includes a photocurable compound having a dicyclopentadiene skeleton. The curable composition for inkjet and barrier rib formation according to any one of claims 1 to 3, wherein the thermosetting compound includes a light and thermosetting compound having a (meth)acryl group. The curable composition for inkjet and barrier rib formation according to any one of claims 1 to 3, wherein the photocurable compound contains a photocurable compound having a total of 3 or more (meth)acryl groups and vinyl groups. compound. The curable composition for inkjet and barrier rib formation according to any one of claims 1 to 3, wherein the content of the photocurable compound is 10% by weight or more and 75% by weight or less. The curable composition for inkjet and barrier rib formation according to any one of claims 1 to 3, wherein the thermosetting agent contains an aromatic amine compound. The curable composition for inkjet and barrier rib formation according to claim 10, wherein the aromatic amine compound contains 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-amino phenoxy)phenyl]pyridine. The curable composition for inkjet and barrier rib formation according to any one of claims 1 to 3, further comprising a dispersant. The curable composition for inkjet and barrier rib formation according to claim 12, wherein the acid value of the above-mentioned dispersant is not less than 10 mgKOH/g and not more than 100 mgKOH/g, and The amine value of the above-mentioned dispersant is not less than 10 mgKOH/g and not more than 100 mgKOH/g. A light emitting device comprising a first member, a light emitting member disposed on the first surface of the first member, and the barrier rib disposed on the first surface of the first member, and The barrier rib is a cured product of the curable composition for inkjet and barrier rib formation according to any one of claims 1 to 13. The light-emitting device according to claim 14, which includes a second member, The above-mentioned light-emitting member is a light-emitting member capable of irradiating infrared light, The barrier wall is disposed on the first surface of the first member so as to surround the light-emitting member, and The barrier wall connects the first member and the second member together. A method of manufacturing a light-emitting device, which includes the following steps: a coating step, which is to use an inkjet device to apply the curable composition for inkjet and barrier wall formation according to any one of claims 1 to 13 on forming a curable composition layer on the first surface of the first member on which the light-emitting member is disposed; and The photocuring step is to harden the above-mentioned curable composition layer by light irradiation to form a B-staged compound layer. The method of manufacturing a light-emitting device according to claim 16, which includes the following steps: an arranging step of arranging a second member on the surface of the B-stage compound layer opposite to the first member; and a thermal hardening step of thermally hardening the above-mentioned B-staged compound layer by heating, and In the arranging step, the second member is arranged on the surface of the B-stage compound layer arranged to surround the light emitting member.

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