TW202312844A - Heat dissipation system and electronic device - Google Patents

Abstract

A heat dissipation system including casing, first tubing, second tubing and condenser. Casing includes base and partition. Base includes accommodation space, inlet and outlet. Partition divides accommodation space into first and second accommodation space. First accommodation space is located above second accommodation space along gravitational direction. Inlet and outlet are respectively connected to first and second accommodation space. Partition includes first and second drop holes. First and second accommodation spaces are connected via first and second drop holes. First and second heat source is located in second accommodation space and spaced apart from each other. Working fluid drops to first heat source via first drop hole and to second heat source via second drop hole. Aperture ratio of first drop hole on first region of partition is different from that of second drop hole on second region of partition.

Description

Cooling system and electronic device

The present invention relates to a heat dissipation system and an electronic device, in particular to a heat dissipation system comprising a plurality of drip holes with different opening ratios and an electronic device comprising the heat dissipation system.

In a general immersion cooling system, the heat source will be immersed in the dielectric fluid delivered to the server, and the dielectric fluid will effectively absorb the heat generated by the heat source and evaporate from a liquid state to a gas state. And, in order to prevent the servos stacked in parallel in the direction parallel to the direction of gravity from hindering the movement of the air bubbles generated when the dielectric fluid evaporates, the servos are usually arranged in the direction perpendicular to the direction of gravity in this immersion cooling system set up.

However, although the volume of the heat source is small relative to the volume of the entire server, the dielectric fluid needs to fill the entire server to submerge the heat source. Therefore, such an immersion cooling system needs to use a large amount of dielectric fluid and has a problem of high cost. In addition, general cabinets are used to install servers along an arrangement direction parallel to the direction of gravity. Therefore, the servers arranged in the direction perpendicular to the direction of gravity in this immersion cooling system cannot be installed in the existing cabinet, so that the maintenance personnel need the assistance of tools to move the vertically arranged servos when performing maintenance. device.

The present invention provides a heat dissipation system and an electronic device to reduce the usage of working fluid and enable the shell to be installed in the existing cabinet.

The heat dissipation system disclosed in an embodiment of the present invention is used for circulating a working fluid and cooling a first heat source and a second heat source. The cooling system includes a shell, a first pipeline, a second pipeline and a condenser. The casing includes a base and a partition. The base includes an accommodating space, an inlet and an outlet. The partition plate is fixed on the base and located in the accommodation space to divide the accommodation space into a first accommodation space and a second accommodation space. The first accommodating space is located on the upper side of the second accommodating space in a gravity direction. The inflow port communicates with the first accommodating space. The outflow port communicates with the second accommodating space. The separator includes a first region, a second region, at least one first drop hole and at least one second drop hole. The first area and the second area are spaced apart from each other. At least one first drip hole is located in the first area. At least one second drip hole is located in the second area. The first accommodating space and the second accommodating space communicate with each other through at least one first drop hole and at least one second drop hole. The first heat source and the second heat source are located in the second accommodating space and are spaced apart from each other. The working fluid is used to drop to the first heat source through at least one first drop hole and to drop to the second heat source through at least one second drop hole. One end of the first pipeline communicates with the inflow port. One end of the second pipeline communicates with the outflow port. The first pipeline communicates with the second pipeline through the condenser. The opening ratio of the at least one first drop hole in the first region is different from the opening ratio of the at least one second drop hole in the second region.

An electronic device disclosed in another embodiment of the present invention is used to circulate a working fluid and includes a casing, a first pipeline, a second pipeline, a condenser, a first heat source and a second heat source . The casing includes a base and a partition. The base includes an accommodating space, an inlet and an outlet. The partition plate is fixed on the base and located in the accommodation space to divide the accommodation space into a first accommodation space and a second accommodation space. The first accommodating space is located on the upper side of the second accommodating space in a gravity direction. The inflow port communicates with the first accommodating space. The outflow port communicates with the second accommodating space. The separator includes a first region, a second region, at least one first drop hole and at least one second drop hole. The first area and the second area are spaced apart from each other. At least one first drip hole is located in the first area. At least one second drip hole is located in the second area. The first accommodating space and the second accommodating space communicate with each other through at least one first drop hole and at least one second drop hole. One end of the first pipeline communicates with the inflow port. One end of the second pipeline communicates with the outflow port. The first pipeline communicates with the second pipeline through the condenser. The first heat source is located in the second accommodating space of the base. The working fluid drops to the first heat source through the first drip hole. The second heat source is located in the second accommodating space of the base and is spaced from the first heat source. The working fluid is used to drop to the second heat source through at least one second drop hole. The opening ratio of the at least one first drop hole in the first region is different from the opening ratio of the at least one second drop hole in the second region.

According to the heat dissipation system and the electronic device disclosed in the above embodiments, since the opening ratio of the first drop hole in the first region is different from the opening ratio of the second drop hole in the second region, it can be based on the calorific value of the heat source or Other properties determine the amount of working fluid that drops to the heat source. In this way, the amount of working fluid can be reduced while still efficiently cooling each heat source.

The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation modes, the content is enough for anyone with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement them accordingly, and according to the disclosure of this specification Anyone with ordinary knowledge in the art can easily understand the related objectives and advantages of the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.

Please refer to Figure 1 and Figure 2. FIG. 1 is a schematic side view of an electronic device according to a first embodiment of the present invention. FIG. 2 is a schematic side sectional view of the casing of the electronic device in FIG. 1 .

The electronic device 10 is used for circulating a working fluid F, and the working fluid F is, for example, a dielectric fluid. In this embodiment, the electronic device 10 includes a cabinet 50, a casing 100, a first pipeline 200, a second pipeline 300, a third pipeline 340, a condenser 400, and a liquid storage tank 450 , a pump 460 , a circuit board 480 , a first heat source 500 , a second heat source 600 and a third heat source 700 . It should be noted that the housing 100 , the first pipeline 200 , the second pipeline 300 , the third pipeline 340 , the condenser 400 , the liquid storage tank 450 and the pump 460 can also serve as a cooling system.

The casing 100 is disposed on the cabinet 50 and includes a base 101 and a partition 102 . Moreover, the casing 100 is, for example, a server casing. In this embodiment, the base 101 includes a bottom plate 103 , a side plate 104 , an accommodating space 105 , an inlet 106 , an outlet 107 and an overflow hole 108 . The side panels 104 stand on the bottom panel 103 . The partition plate 102 is fixed on the side plate 104 and located in the accommodating space 105 to divide the accommodating space 105 into a first accommodating space 1051 and a second accommodating space 1052 . The first accommodating space 1051 is located on the upper side of the second accommodating space 1052 in a direction G of gravity. Moreover, the second accommodating space 1052 is jointly formed by the bottom plate 103 , the side plate 104 and the partition plate 102 . The inlet 106 communicates with the first accommodating space 1051 . The outlet 107 is located on the side plate 104 and communicates with the second accommodating space 1052 . In this embodiment, the overflow hole 108 is located on the side plate 104 , and the overflow hole 108 is closer to the bottom plate 103 than the outlet 107 . In this embodiment, the minimum height H1 of the overflow hole 108 relative to the bottom plate 103 is equal to a predetermined liquid level H2 of the working fluid F in the second accommodating space 1052 relative to the bottom plate 103 . That is to say, when the liquid level of the working fluid F exceeds the preset liquid level H2, the working fluid F will overflow from the overflow hole 108 . In this way, the amount of accumulated working fluid F accumulated on the bottom plate 103 can be controlled through the overflow hole 108 , thereby preventing waste of the working fluid F.

The separator 102 includes a first region 1021 , a second region 1022 , a plurality of first drop holes 1023 and a plurality of second drop holes 1024 . The first area 1021 and the second area 1022 are spaced apart from each other. In addition, the total area of the first region 1021 is equal to the total area of the second region 1022 , for example. The first drip hole 1023 is located in the first region 1021 . The second drip hole 1024 is located in the second area 1022 . The first accommodating space 1051 and the second accommodating space 1052 communicate with each other through the first drop hole 1023 and the second drop hole 1024 . The opening ratio of the first drop hole 1023 in the first region 1021 is different from the opening ratio of the second drop hole 1024 in the second region 1022 . Specifically, in this embodiment, the size of each first drop hole 1023 is equal to the size of each second drop hole 1024 , and the number of first drop holes 1023 is greater than the number of second drop holes 1024 . Therefore, in this embodiment, the opening ratio of the first drop hole 1023 in the first region 1021 is greater than the opening ratio of the second drop hole 1024 in the second region 1022 . It should be noted that the opening ratio of the first drop holes 1023 in the first region 1021 refers to the ratio of the total opening area of the first drop holes 1023 to the total area of the first region 1021 .

It should be noted that, in other embodiments, the opening ratio of the first drop hole in the first region may also be smaller than the opening ratio of the second drop hole in the second region. In addition, in other embodiments, the number of the first drop hole can also be equal to the number of the second drop hole, and the size of each first drop hole can also be greater than the size of each second drop hole so that the first drop hole is at the same level as the second drop hole. The opening ratio of the first region is greater than the opening ratio of the second drop hole in the second region.

In this embodiment, the first pipeline 200 includes a first connecting pipe 201 and a second connecting pipe 202 . The opposite ends of the first connecting pipe 201 communicate with the condenser 400 and the liquid storage tank 450 respectively. The two opposite ends of the second connecting pipe 202 communicate with the pump 460 and the inlet 106 of the base 101 respectively. The two opposite ends of the second pipeline 300 communicate with the outlet 107 of the base 101 and the condenser 400 respectively. Two opposite ends of the third pipeline 340 communicate with the liquid storage tank 450 and the overflow hole 108 of the base 101 respectively. In addition, in this embodiment, the condenser 400 is disposed on the cabinet 50 , and the condenser 400 is located on the upper side of the base 101 in the direction G of gravity. In addition, in this embodiment, the condenser 400 is disposed outside the base 101 of the casing 100 . That is to say, the condenser 400 and the base 101 of the casing 100 are disposed in the cabinet 50 independently of each other. The liquid storage tank 450 and the pump 460 are disposed in the cabinet 50 , and the liquid storage tank 450 is connected to the pump 460 .

The circuit board 480 is located in the second accommodating space 1052 of the base 101 . The first heat source 500 , the second heat source 600 and the third heat source 700 are disposed on the circuit board 480 and located in the second accommodating space 1052 . Moreover, the first heat source 500 , the second heat source 600 and the third heat source 700 are spaced apart from each other. The working fluid F drops to the first heat source 500 through the first drop hole 1023 . The working fluid F drops to the second heat source 600 through the second drop hole 1024 . In this embodiment, the calorific value of the first heat source 500 is greater than that of the second heat source 600 , and the opening ratio of the first drip hole 1023 is greater than that of the second drip hole 1024 . In addition, the calorific value of the third heat source 700 is smaller than the calorific value of the first heat source 500 and the second heat source 600, and the maximum height H3 of the third heat source 700 relative to the bottom plate 103 is smaller than that of the working fluid F in the second accommodating space 1052 Relative to the preset liquid level H2 of the bottom plate 103 , the third heat source 700 can be fully immersed in the working fluid F. Therefore, the partition 102 does not have holes for the third heat source 700 and only passes through the working fluid F accumulated in the second accommodating space 1052 to cool the third heat source 700 . That is to say, in the present invention, the amount of working fluid F dropped to the first heat source 500, the second heat source 600 and the third heat source 700 is based on the calorific value of the first heat source 500, the second heat source 600 and the third heat source 700 and determined by height. In other embodiments, when the calorific value of the first heat source is equal to the calorific value of the second heat source but the height of the first heat source is smaller than the height of the second heat source, the opening ratio of the second drop hole can also be greater than that of the first drop hole The opening ratio is such that the working fluid dripping onto the second heat source is more than the working fluid dripping onto the first heat source.

The working fluid F flows from the liquid storage tank 450 to the second connecting pipe 202 with the help of the pump 460 , and enters the first accommodating space 1051 through the inlet 106 . The working fluid F entering the first accommodating space 1051 drops to the first heat source 500 and the second heat source 600 along the gravity direction G through the first drop hole 1023 and the second drop hole 1024 respectively. The working fluid F accumulated in the second accommodating space 1052 will submerge the third heat source 700 . When the working fluid F absorbs the heat generated by the first heat source 500 , the second heat source 600 and the third heat source 700 and evaporates into a gas, the gaseous working fluid F will flow out of the second accommodating space 1052 from the outlet 107 along the outflow direction D . The gaseous working fluid F flowing out of the second accommodating space 1052 will flow into the condenser 400 through the second pipeline 300 to be condensed into a liquid state, and then flow back to the liquid storage tank 450 through the first connecting pipe 201 .

Please refer to FIG. 3 . FIG. 3 is a schematic side view of an electronic device according to a second embodiment of the present invention. In this embodiment, the housing 100a of the electronic device 10a, the second connecting pipe 202a, the second pipeline 300a, the third pipeline 340a, the circuit board 480a, the first heat source 500a, the second heat source 600a and the third heat source 700a The number of is two. The two casings 100a are arranged parallel to the cabinet 50a along the gravity direction G, so that the first heat source 500a, the second heat source 600a and the third heat source 700a on the second circuit board 480a are cooled in two independent spaces. In this way, the second housing 100a serving as the server housing can be installed in the existing cabinet 50a without the problem of difficult maintenance of the electronic components in the housing 100a. In addition, the working fluid can effectively cool the first heat source 500a, the second heat source 600a, and the third heat source 700a by using independent spaces. Other details of this embodiment should be understood by referring to the above descriptions with reference to FIG. 1 to FIG. 3 , so details are not repeated here.

According to the heat dissipation system and the electronic device disclosed in the above embodiments, since the opening ratio of the first drop hole in the first region is different from the opening ratio of the second drop hole in the second region, it can be based on the calorific value of the heat source or Other properties determine the amount of working fluid that drops to the heat source. In this way, the amount of working fluid can be reduced while still efficiently cooling each heat source.

In one embodiment of the present invention, the heat dissipation system of the present invention can be applied to servers, which can be used for artificial intelligence (English: Artificial Intelligence, AI for short) computing, edge computing (Edge Computing), and can also be used as It can be used as a 5G server, cloud server or Internet of Vehicles server.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10,10a: Electronic devices 50,50a: cabinet 100,100a: Shell 101: base 102: Partition 1021: the first area 1022: second area 1023: The first drip hole 1024: Second drip hole 103: Bottom plate 104: side panel 105:Accommodating space 1051: The first storage space 1052: The second storage space 106: Inflow port 107: outflow port 108: overflow hole 200: the first pipeline 201: the first connecting pipe 202,202a: the second connecting pipe 300,300a: the second pipeline 340,340a: the third pipeline 400: condenser 450: Liquid storage tank 460: pump 480, 480a: circuit board 500,500a: first heat source 600,600a: second heat source 700,700a: third heat source F: working fluid G: Gravity direction H1: minimum height H2: preset liquid level H3: maximum height D: outflow direction

FIG. 1 is a schematic side view of an electronic device according to a first embodiment of the present invention. FIG. 2 is a schematic side sectional view of the casing of the electronic device in FIG. 1 . FIG. 3 is a schematic side view of an electronic device according to a second embodiment of the present invention.

100: Shell

101: base

102: Partition

1021: the first area

1022: second area

1023: The first drip hole

1024: Second drip hole

103: Bottom plate

104: side panel

105:Accommodating space

1051: The first storage space

1052: The second storage space

106: Inflow port

107: outflow port

108: overflow hole

202: the second connecting pipe

300: the second pipeline

340: The third pipeline

480: circuit board

500: first heat source

600: second heat source

700: The third heat source

F: working fluid

G: Gravity direction

H1: minimum height

H2: preset liquid level

H3: maximum height

D: outflow direction

Claims (10)

A heat dissipation system for circulating a working fluid and cooling a first heat source and a second heat source. The heat dissipation system includes: a casing including a base and a partition, and the base includes an accommodating space , an inlet and an outlet, the partition plate is fixed on the base and located in the accommodation space to divide the accommodation space into a first accommodation space and a second accommodation space, the first accommodation space is in Located on the upper side of the second accommodating space in the direction of gravity, the inflow port communicates with the first accommodating space, the outflow port communicates with the second accommodating space, the partition includes a first area, a second region, at least one first drop hole and at least one second drop hole, the first region and the second region are spaced apart from each other, at least one first drop hole is located in the first region, and the at least one second drop hole is located in the In the second area, the first accommodating space and the second accommodating space communicate with each other through the at least one first drop hole and the at least one second drop hole, and the first heat source and the second heat source are used to locate the In the second accommodating space and spaced apart from each other, the working fluid is used to drop to the first heat source through the at least one first drop hole and to drop to the second heat source through the at least one second drop hole; a first first drop hole a pipeline, one end of the first pipeline communicates with the inlet; a second pipeline, one end of the second pipeline communicates with the outlet; and a condenser, the first pipeline communicates through the condenser In the second pipeline; wherein, the opening ratio of the at least one first drop hole in the first region is different from the opening ratio of the at least one second drop hole in the second region. The cooling system as described in claim 1, wherein the number of the at least one first drop hole is multiple, the number of the at least one second drop hole is multiple, and the size of each first drop hole is equal to the size of each second drop hole. The size of the drop holes, the number of the first drop holes is different from the number of the second drop holes. The cooling system as described in claim 1, wherein the number of the at least one first drop hole is multiple, the number of the at least one second drop hole is multiple, and the number of the first drop holes is equal to the number of the second drop holes The number of drop holes, the size of each first drop hole is different from the size of each second drop hole. The heat dissipation system as described in claim 1, wherein the base further includes a bottom plate and a side plate, the side plate stands on the bottom plate, the bottom plate, the side plate and the partition jointly form the second accommodating space, the outflow port located on the side panel. The heat dissipation system according to claim 4, wherein the base further includes an overflow hole, the overflow hole is located on the side plate, and the overflow hole is closer to the bottom plate than the outlet. The heat dissipation system as claimed in claim 5, wherein the minimum height of the overflow hole relative to the bottom plate is equal to a preset liquid level of the working fluid in the second accommodating space relative to the bottom plate. An electronic device is used to circulate a working fluid. The electronic device includes: a casing, including a base and a partition, the base includes an accommodating space, an inlet and an outlet, and the partition is fixed on The base is located in the accommodating space and divides the accommodating space into a first accommodating space and a second accommodating space, the first accommodating space is located in a direction of gravity On the upper side, the inlet is connected to the first accommodating space, the outflow is connected to the second accommodating space, and the partition includes a first area, a second area, at least one first drop hole and at least one first drop hole. Two drop holes, the first area and the second area are spaced apart from each other, at least one first drop hole is located in the first area, the at least one second drop hole is located in the second area, the first accommodating space and the The second accommodating space communicates with each other through the at least one first drop hole and the at least one second drop hole; a first pipeline, one end of the first pipeline communicates with the inlet; a second pipeline, One end of the second pipeline communicates with the outlet; a condenser, through which the first pipeline communicates with the second pipeline; a first heat source, located in the second accommodating space of the base wherein, the working fluid drips to the first heat source through the first drip hole; and a second heat source is located in the second accommodation space of the base and is spaced from the first heat source, and the working fluid is used for drop to the second heat source through the at least one second drop hole; wherein, the opening ratio of the at least one first drop hole in the first region is different from the opening ratio of the at least one second drop hole in the second region porosity. The electronic device according to claim 7, wherein the opening ratio of the at least one first drop hole is greater than the opening ratio of the at least one second drop hole, and the heat generation of the first heat source is greater than the heat generation of the second heat source quantity. The electronic device according to claim 7, wherein the base further includes a bottom plate and a side plate, the side plate stands on the bottom plate, the bottom plate, the side plate and the partition jointly form the second accommodating space, and the at least one The opening ratio of the first drop hole is greater than that of the at least one second drop hole, and the maximum height of the first heat source relative to the bottom plate is greater than the maximum height of the second heat source relative to the bottom plate. The electronic device as described in claim 7 further includes a third heat source, the base further includes a bottom plate and a side plate, the side plate stands on the bottom plate, the bottom plate, the side plate and the partition jointly form the second container storage space, the third heat source is located in the second storage space and is spaced from the first heat source and the second heat source, and the maximum height of the third heat source relative to the bottom plate is smaller than that of the working fluid in the second storage space The working fluid dripped onto the first heat source and the second heat source is accumulated in the second accommodating space to cool the third heat source at a preset liquid level relative to the bottom plate.

Images