TW202311308A - Composition, film, optical filter, optical sensor, image display apparatus, and structural body - Google Patents

Abstract

This composition contains a curable compound, a silicone-based surfactant A, and a solvent. Regarding the silicone-based surfactant A, when the silicone-based surfactant A is dissolved in propylene glycol monomethyl ether acetate to prepare a solution having a solid content concentration of 1000 mass ppm, the surface tension of the solution at 25 DEG C is 26 mN/m or more. The film, the optical filter, the optical sensor, the image display apparatus, and the structural body according to the present invention use said composition.

Description

Composition, film, optical filter, optical sensor, image display device, and structure

The present invention relates to a composition containing polysiloxane surfactant. Also, the present invention relates to a film, an optical filter, an optical sensor, an image display device, and a structure.

A composition containing a surfactant is used for a composition such as an optical filter for manufacturing an optical sensor provided with an optical sensor such as a color filter.

Patent Document 1 discloses an invention related to a colored resin composition containing (A) colorant, (B) dispersant, (C) solvent, (D) binder resin, and (E) photopolymerization In the initiator, the (B) dispersant contains the dispersant (b) having a predetermined repeating unit, and the colored resin composition contains 0.01% by mass or more of the (F) surfactant in the total solid content.

[Patent Document 1] Japanese Patent Laid-Open No. 2018-132554

Optical filters used in optical sensors, image display devices, etc. generally have plural types of pixels. Such an optical filter is produced by forming a first-type pixel using a first-type pixel-forming composition, and sequentially forming second-type and subsequent pixels using a second-type and subsequent pixel-forming composition.

In addition, in recent years, an attempt to install pixels of each color in the filter in a space partitioned by partition walls has also been studied. Such an optical filter is manufactured, for example, by forming partition walls for dividing each pixel on a support, and then sequentially forming various types of pixels between the partition walls.

In the manufacturing process of optical filters, etc., it is required to suppress the occurrence of color mixture. Therefore, there is a demand for a composition capable of forming a film in which color mixing is difficult to occur, and in recent years, further improvement of the above performance has been demanded.

Therefore, an object of the present invention is to provide a composition capable of forming a film that suppresses color mixing. Also, an object of the present invention is to provide a film, an optical filter, an optical sensor, an image display device, and a structure.

The present invention provides the following. <1> A composition comprising: a curable compound; a polysiloxane-based surfactant A; and a solvent, wherein the polysiloxane-based surfactant A is dissolved in When a solution having a solid content concentration of 1000 mass ppm was prepared using propylene glycol monomethyl ether acetate, the surface tension of the solution at 25° C. was 26 mN/m or more. <2> The composition according to <1>, wherein the curable compound contains a resin and a polymerizable monomer, and the composition further contains a photopolymerization initiator. <3> The composition as described in <1> or <2> which further contains a coloring material. <4> A composition comprising: inorganic particles; a polysiloxane-based surfactant A; and a solvent in which the polysiloxane-based surfactant A is dissolved in propylene glycol When a solution having a solid content concentration of 1000 mass ppm was prepared using monomethyl ether acetate, the surface tension of the solution at 25° C. was 26 mN/m or more. <5> The composition according to <4>, wherein the inorganic particles include silica particles. <6> The composition as described in <5>, wherein the silica particles are selected from the group consisting of a plurality of spherical silica particles connected in a bead shape, a plurality of spherical silica particles connected in a plane At least one of connected silica particles and hollow silica particles. <7> The composition according to any one of <4> to <6>, wherein the content of the inorganic particles in the total solid content of the composition is 20% by mass or more. <8> The composition according to any one of <1> to <7>, wherein the polysiloxane-based surfactant A has a hydroxyl value of 80 mgKOH/g or more. <9> The composition according to any one of <1> to <8>, wherein the polysiloxane-based surfactant A has a dynamic viscosity at 25° C. of 40 mm ² /s or less. <10> The composition according to any one of <1> to <9>, wherein the silicone-based surfactant A is a methanol-modified dialkylpolysiloxane. <11> The composition according to any one of <1> to <10>, wherein the polysiloxane-based surfactant A is dimethyl polysiloxane having an alkeneoxy group and a hydroxyl group. <12> The composition according to any one of <1> to <11>, wherein the content of the silicone-based surfactant A in the composition is 1 to 1000 ppm by mass. <13> A film obtained using the composition according to any one of <1> to <12>. <14> An optical filter comprising the film described in <13>. <15> An optical sensor comprising the film described in <13>. <16> An image display device comprising the film according to <13>. <17> A structure comprising: a support; partitions obtained using the composition described in <4> provided on the support; and pixels provided in regions partitioned by the partitions. [Invention effect]

According to the present invention, it is possible to provide a composition, a film, a filter, an optical sensor, an image display device, and a structure capable of forming a film that suppresses color mixing.

Hereinafter, the content of the present invention will be described in detail. In this specification, "-" is used for the meaning which includes the numerical value described before and after it as a lower limit and an upper limit. In the notation of a group (atomic group) in this specification, the notation indicating substituted and unsubstituted includes a group (atomic group) without a substituent, and also includes a group (atomic group) having a substituent. For example, "alkyl" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. In addition, examples of light used for exposure include the bright line spectrum of a mercury lamp, extreme ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, electron beams, and other actinic rays or radiation. In this specification, "(meth)acrylate" means both or either of acrylate and methacrylate, "(meth)acrylic" means both or either of acrylic and methacrylic, "( "Meth)acryl" means both or either of acryl and methacryl. In this specification, near-infrared rays refer to light having a wavelength of 700 to 2500 nm. In this specification, Me in the structural formulas represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group. In this specification, the weight average molecular weight and number average molecular weight are polystyrene conversion values measured by the GPC (gel permeation chromatography) method. In this specification, the total solid content refers to the total mass of components excluding solvents from all the components of the composition. In this specification, a pigment refers to a color material that is not easily soluble in a solvent. In this specification, the term "step" not only includes independent steps, but also includes in this term as long as the expected function of the step is exerted even if it cannot be clearly distinguished from other steps. .

＜Composition＞ The composition of the first aspect of the present invention is characterized by containing: Hardening compounds; Polysiloxane-based surfactant A; and solvent, Among the above-mentioned silicone-based surfactants A, when the silicone-based surfactant A was dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid content concentration of 1000 mass ppm, the surface of the above-mentioned solution at 25°C The tension is 26mN/m or more.

Also, the composition of the second aspect of the present invention is characterized in that it contains: Inorganic particles; Polysiloxane-based surfactant A; and solvent, Among the above-mentioned silicone-based surfactants A, when the silicone-based surfactant A was dissolved in propylene glycol monomethyl ether acetate to prepare a solution with a solid content concentration of 1000 mass ppm, the surface of the above-mentioned solution at 25°C The tension is 26mN/m or more.

According to the composition of the present invention, a film that suppresses color mixing can be formed. The reason why such an effect is obtained is presumed as follows. It is presumed that the composition of the present invention can improve the affinity of the surface of the obtained film with water by containing the polysiloxane-based surfactant A described above. Therefore, for example, when a film such as a pattern is formed using the composition of the present invention, and another pixel-forming composition is used to form another pixel or the like at a position adjacent to the film, it is easy to remove from the film with a developer or a rinse solution. It is presumed that residues of other pixel-forming compositions are less likely to be generated on the film surface as a result of removal of deposits of other pixel-forming compositions on the film surface. Therefore, it is presumed that the composition of the present invention can form a film in which color mixing is suppressed.

The composition of the present invention is preferably a composition for an optical sensor or an image display device, more preferably a composition for an optical sensor. More specifically, the composition of the present invention can be suitably used as a composition for forming optical filters, partition walls, and the like used in optical sensors, image display devices, and the like. For example, the composition of the first aspect can be preferably used as a composition for forming an optical filter. Moreover, the composition of a 2nd aspect can be used preferably as a composition for partition wall formation. In particular, when silica particles are used as the inorganic particles, since a film with a small refractive index can be formed, it can be preferably used as a composition for forming partition walls.

As an optical filter, a color filter, a near-infrared ray transmission filter, a near-infrared ray cut filter, etc. are mentioned, A color filter is preferable.

Examples of color filters include filters having colored pixels that transmit light of a specific wavelength, having at least one color selected from red pixels, blue pigments, green pixels, yellow pixels, cyan pixels, and magenta pixels A pixel filter is preferred. A color filter can be formed using a composition containing a color material.

Examples of the near-infrared cut filter include filters in which the maximum absorption wavelength exists within a wavelength range of 700 to 1800 nm. It is preferable that the maximum absorption wavelength of the near-infrared cut filter exists in the wavelength range of 700 to 1300 nm, and it is more preferable that the maximum absorption wavelength of the near-infrared cut filter exists in the wavelength range of 700 to 1100 nm. In addition, the transmittance of the near-infrared cut filter is preferably 70% or more in the entire wavelength range of 400 to 650 nm, more preferably 80% or more, and still more preferably 90% or more. Also, the transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. In addition, the ratio of the absorbance A _max at the maximum absorption wavelength of the near-infrared cut filter to the absorbance A ₅₅₀ at a wavelength of 550 nm, that is, the absorbance A _max /absorbance A ₅₅₀ is preferably 20 to 500, more preferably 50 to 500, 70-450 is more preferable, and 100-400 is especially preferable. The near-infrared cut filter can be formed using a composition including a near-infrared absorbing color material.

The near-infrared transmission filter is a filter that transmits at least part of near-infrared rays. The near-infrared transmission filter is preferably a filter that blocks at least a part of visible light and transmits at least a part of near-infrared rays. As a near-infrared ray transmission filter, it is preferable to mention that the maximum value of transmittance in the range of wavelength 400-640nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the wavelength is 1100-640nm. Filters and the like having spectral characteristics in which the minimum transmittance in the range of 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more). The near-infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5). (1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 800 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 900 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (3): The maximum value of the transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1000 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (4): The maximum value of the transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1100 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (5): The maximum value of the transmittance in the wavelength range of 400-1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1200-1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%).

Examples of the partition walls include partition walls used to partition adjacent pixels when forming pixels in the imaging region of the solid-state imaging device, and the like. Examples of the pixels include colored pixels, transparent pixels, pixels of a near-infrared ray transmission filter layer, pixels of a near-infrared ray cut filter layer, and the like. As an example, a partition wall for forming a grid structure for dividing pixels can be mentioned. As this example, JP-A-2012-227478, JP-A 2010-232537, JP-A 2009-111225, FIG. 1 of JP-A 2017-028241, JP-A 2016 -The structure described in FIG. 4D etc. of Publication No. 201524. Moreover, the partition wall etc. which form the frame structure of the periphery of filters, such as a color filter, a near-infrared ray transmission filter, and a near-infrared ray cut filter, are mentioned. As this example, the structure described in Unexamined-Japanese-Patent No. 2014-048596 can be mentioned, The content is incorporated in this specification.

The composition of the present invention can also be used as a composition for light-shielding film formation. When the composition of the present invention is used as a light-shielding film-forming composition, the composition of the present invention preferably contains a black color material as a color material, and more preferably contains a black pigment.

When the composition of the present invention is used as a composition for forming a light-shielding film, the optical density (OD: Optical Density) per 1.5 μm film thickness in the wavelength region of 400 to 1100 nm of a film formed using the composition of the present invention is ) is more than 2.5, more preferably 3.0 or more. In addition, although the upper limit is not specifically limited, Usually, 10 or less is preferable. In addition, in this specification, the optical density per 1.5 μm film thickness in the wavelength range of 400 to 1100 nm is 2.5 or more means that the optical density per 1.5 μm film thickness is 2.5 in the entire wavelength range of 400 to 1100 nm. above.

Moreover, the reflectance of the said film is preferably less than 8%, more preferably less than 6%, and still more preferably less than 4%. The lower limit is preferably 0% or more. The reflectance was obtained from the obtained reflectance spectrum by using a spectrometer V7200 (product name) VAR unit manufactured by JASCO Corporation to inject light with a wavelength of 400 to 1100 nm at an incident angle of 5°. Specifically, let the reflectance of the light of the wavelength which shows the maximum reflectance in the wavelength range of 400-1100 nm be the reflectance of a film.

It is also preferable that the composition of the present invention is a composition for pattern formation by photolithography. According to this aspect, fine-sized pixels can be easily formed. For example, a component containing an ethylenically unsaturated bond-containing group (for example, a resin having an ethylenically unsaturated bond-containing group or a monomer having an ethylenically unsaturated bond-containing group) and a photopolymerization initiator The composition of the agent can be preferably used as a composition for pattern formation by photolithography. It is also preferable that the composition for pattern formation by photolithography further contains an alkali-soluble resin.

The solid content concentration of the composition is preferably 5 to 30% by mass. The lower limit is preferably at least 7.5% by mass, more preferably at least 10% by mass. The upper limit is preferably at most 25% by mass, more preferably at most 20% by mass.

Hereinafter, each component used in the composition of this invention is demonstrated. [The composition of the first aspect] ＜＜Hardening compound＞＞ The composition of the first aspect contains a curable compound. Examples of the curable compound include polymerizable compounds, resins, and the like. The resin may be a non-polymeric resin (resin without a polymeric group) or a polymeric resin (resin with a polymeric group). Examples of the polymerizable group include ethylenically unsaturated bond-containing groups, cyclic ether groups, and the like. Examples of the ethylenically unsaturated bond-containing group include vinyl, (meth)allyl, (meth)acryl, and the like. As a cyclic ether group, an epoxy group, an oxetanyl group, etc. are mentioned, and an epoxy group is preferable. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed.

As a hardening compound, it is preferable to use what contains at least resin. Also, when the composition of the present invention is used as a composition for photolithography, a resin (preferably a resin having an acid group) and a polymerizable monomer (monomer type polymerizable compound) are used as the curable compound. More preferably, it is more preferable to use a resin (preferably a resin having an acid group) and a polymerizable monomer (a monomer type polymerizable compound) having a group containing an ethylenically unsaturated bond.

(polymeric compound) Examples of the polymerizable compound include a compound having an ethylenically unsaturated bond-containing group, a compound having a cyclic ether group, and the like. A compound having an ethylenically unsaturated bond-containing group can be preferably used as a radically polymerizable compound. Also, a compound having a cyclic ether group can be preferably used as a cationically polymerizable compound.

As a resin type polymeric compound, the resin etc. which contain the repeating unit which has a polymeric group are mentioned.

The molecular weight of the monomer type polymerizable compound (polymerizable monomer) is preferably less than 2000, more preferably 1500 or less. The lower limit of the molecular weight of the polymerizable monomer is preferably 100 or more, more preferably 200 or more. The weight average molecular weight (Mw) of the resin type polymerizable compound is preferably 2,000 to 2,000,000. The upper limit of the weight average molecular weight is preferably at most 1,000,000, more preferably at most 500,000. The lower limit of the weight average molecular weight is preferably at least 3,000, more preferably at least 5,000.

The compound having an ethylenically unsaturated bond-containing group as a polymerizable monomer is preferably a 3-15 functional (meth)acrylate compound, and a 3-6 functional (meth)acrylate compound is more preferred . Specific examples include paragraphs 0095 to 0108 of JP-A 2009-288705, paragraph 0227 of JP-A 2013-029760, paragraphs 0254-0257 of JP-A 2008-292970, JP-A Paragraph 0034-0038 of No. 2013-253224, Paragraph 0477 of Japanese Patent Application Laid-Open No. 2012-208494, Japanese Patent Laid-Open No. 2017-048367, Japanese Patent No. 6057891, Japanese Patent No. 6031807, Japanese Patent Laid-Open No. 2017 - Compounds described in Publication No. 194662, the content of which is incorporated in this specification.

Examples of the compound having an ethylenically unsaturated bond-containing group include dipenteoerythritol tri(meth)acrylate (a commercially available product: KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), Dineopenylthritol tetra(meth)acrylate (a commercially available product is KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipenteoerythritol penta(meth)acrylate (a commercially available product KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dineopentaerythritol hexa(meth)acrylate (a commercially available product is KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK ESTER A- DPH-12E; manufactured by Shin-Nakamura Chemical Co., Ltd.) and compounds in which (meth)acryloyl groups of these compounds are bonded via ethylene glycol and/or propylene glycol residues (for example, by SARTOMER Company, Inc. commercially available SR454, SR499), etc. Also, as a compound having an ethylenically unsaturated bond-containing group, diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available, M-460; TOAGOSEI CO., Ltd.), neopentylitol tetraacrylate (manufactured by Shin Nakamura Chemical Co., Ltd., NK Ester A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., Ltd.), NK Oligo UA-7200 (manufactured by Shin Nakamura Chemical Co., Ltd.), 8UH -1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL Co., Ltd.), etc.

Also, as a compound having a group having an ethylenically unsaturated bond, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane Trifunctional (meth)acrylates such as methylpropane ethylene oxide modified tri(meth)acrylate, isocyanurate ethylene oxide modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, etc. ) acrylate compounds are also preferred. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 ( Nippon Kayaku Co., Ltd.), etc.

The compound having an ethylenically unsaturated bond-containing group may also have an acid group such as a carboxyl group, a sulfonic acid group, or a phosphoric acid group. As a commercial item of these compounds, ARONIX M-305, M-510, M-520, ARONIX TO-2349 (made by TOAGOSEI CO., LTD.) etc. are mentioned.

As a compound having an ethylenically unsaturated bond-containing group, a compound having a caprolactone structure can also be used. Regarding the compound having the caprolactone structure, the description in paragraphs 0042 to 0045 of JP-A-2013-253224 can also be referred to, and the content is incorporated in this specification. As for the compound which has a caprolactone structure, DPCA-20, DPCA-30, DPCA-60, DPCA-120 etc. which are marketed as series by Nippon Kayaku Co., Ltd. are mentioned, for example.

As the compound having an ethylenically unsaturated bond-containing group, a compound having an ethylenically unsaturated bond-containing group and an alkyleneoxy group can also be used. These compounds are preferably compounds having groups containing ethylenically unsaturated bonds and ethyleneoxy and/or propyleneoxy groups, more preferably compounds having groups containing ethylenically unsaturated bonds and ethyleneoxy groups, A 3-6 functional (meth)acrylate compound having 4-20 ethyleneoxy groups is further preferred. As commercially available products, for example, SR-494 manufactured by Sartomer Company, Inc. as a tetrafunctional (meth)acrylate having four ethyleneoxy groups, Nippon Kayaku Co., Ltd. manufactured as a tetrafunctional (meth)acrylate having three vinyloxyl groups, KAYARAD TPA-330 of isobutoxy trifunctional (meth)acrylate, etc.

As a compound having an ethylenically unsaturated bond-containing group, a polymerizable compound having a fennel skeleton can also be used. As a commercial item, OGSOL EA-0200, EA-0300 (Osaka Gas Chemicals Co., Ltd. make, the (meth)acrylate monomer which has a fennel skeleton) etc. are mentioned.

It is also preferable to use a compound that does not substantially contain environmental regulation substances such as toluene as the compound having an ethylenically unsaturated bond-containing group. Commercially available products of such compounds include KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.), and the like.

As the compound having an ethylenically unsaturated bond-containing group, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA -306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL CO.,LTD.), 8UH-1006, 8UH-1012 (the above are TAISEI FINE CHEMICAL CO,.LTD .), LIGHT ACRYLATEPOB-A0 (manufactured by KYOEISHA CHEMICAL CO., LTD.), etc. are also preferable.

As a compound which has a cyclic ether group, the compound which has an epoxy group, the compound which has an oxetanyl group, etc. are mentioned, The compound which has an epoxy group is preferable. As a compound which has an epoxy group, the compound which has 1-100 epoxy groups in 1 molecule is mentioned. The upper limit of the number of epoxy groups can be set to 10 or less, for example, and can also be set to 5 or less. The lower limit of the number of epoxy groups is preferably two or more.

The compound having a cyclic ether group may be a low-molecular compound (for example, a molecular weight of less than 1,000) or a macromolecule (for example, in the case of a polymer with a molecular weight of 1,000 or more, the weight-average molecular weight of 1,000 or more) . The weight average molecular weight of the cyclic ether group is preferably from 200 to 100,000, more preferably from 500 to 50,000. The upper limit of the weight average molecular weight is preferably at most 10,000, more preferably at most 5,000, and still more preferably at most 3,000.

As compounds having a cyclic ether group, compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, compounds described in paragraphs 0147-0156 of JP-A-2014-043556, Compounds described in paragraphs 0085 to 0092 of JP-A-2014-089408 and compounds described in JP-A-2017-179172.

Examples of commercially available compounds having a cyclic ether group include DENACOL EX-212L, EX-212, EX-214L, EX-214, EX-216L, EX-216, EX-321L, EX-321, EX -850L, EX-850 (manufactured by Nagase ChemteX Corporation), ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (manufactured by ADEKA Corporation), NC-2000, NC-3000, NC- 7300, XD-1000, EPPN-501, EPPN-502 (the above are manufactured by ADEKA Corporation), CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, CELLOXIDE 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (the above are manufactured by Daicel, CYOMER Corporation) P ACA 200M, ACA 230AA, ACA Z250, ACA Z251, ACA Z300, ACA Z320 (the above are manufactured by Daicel Corporation), jER1031S, jER157S65, jER152, jER154, jER157S70 (the above are manufactured by Mitsubishi Chemical Corporation), Aron OxetaneOXT-121, O -221, OX-SQ, PNOX (manufactured by TOAGOSEI CO., LTD. above), ADEKA Glycirol ED-505 (manufactured by ADEKA Corporation, epoxy group-containing monomer), MARPROOF G-0150M, G-0105SA, G- 0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (manufactured by NOF Corporation, epoxy group-containing polymer), OXT-101, OXT-121 . Heterocyclobutyl monomer), etc.

(resin) The composition of the present invention can use a resin as a curable compound. It is preferable to use a hardening compound containing at least resin. The resin is blended for the purpose of dispersing a pigment etc. in a composition or the use of a binder, for example. In addition, the resin mainly used for dispersing a pigment etc. in a composition is called a dispersing agent. However, these uses of the resin are examples, and the resin can also be used for purposes other than these uses. In addition, the resin which has a polymeric group also corresponds to a polymeric compound.

The weight average molecular weight of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4000 or more, more preferably 5000 or more.

Examples of the resin include (meth)acrylic resins, epoxy resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyphenolic resins, polyethersulfonic resins, polyphenylene resins, Polyaryl ether phosphine oxide resin, polyimide resin, polyamide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, vinyl acetate resin, Polyvinyl alcohol resin, polyvinyl acetal resin, polyurethane resin, polyurea resin, etc. Among these resins, one type may be used alone, or two or more types may be used in combination. As the cyclic olefin resin, norbornene resin is preferable from the viewpoint of improving heat resistance. As a commercial item of norcamphene resin, the ARTON series (for example, ARTON F4520) etc. made from JSR CORPORATION are mentioned, for example. In addition, as the resin, resins described in the examples of International Publication No. 2016/088645, resins described in JP-A 2017-057265, resins described in JP-A 2017-032685, Resins described in JP-A 2017-075248, resins described in JP-A 2017-066240, resins described in JP-A 2017-167513, and resins described in JP-A 2017-173787 Resins, the resins described in paragraphs 0041 to 0060 of JP-A-2017-206689, the resins described in paragraphs 0022-0071 of JP-A-2018-010856, and the resins described in JP-A-2016-222891 The blocked polyisocyanate resin (cyanate resin), the resin described in JP-A-2020-122052, the resin described in JP-A-2020-111656, the resin described in JP-A-2020-139021, The resin described in JP 2017-138503 A includes a constituent unit having a ring structure on the main chain and a constituent unit having a biphenyl group on the side chain. In addition, as the resin, a resin having a fennel skeleton can also be preferably used. Regarding the resin having a fenugreek skeleton, reference can be made to the description of US Patent Application Publication No. 2017/0102610, which is incorporated in this specification. Also, as the resin, resins described in paragraphs 0199 to 0233 of JP-A-2020-186373, alkali-soluble resins described in JP-A-2020-186325, Korean Laid-Open Patent No. 10-2020 - Resin represented by Formula 1 described in Publication No. 0078339.

As the resin, it is preferable to use a resin having an acid group. As an acidic group, a carboxyl group, a phosphoric acid group, a sulfonic acid group, a phenolic hydroxyl group etc. are mentioned, for example. These acid groups may be only one type, or may be two or more types. A resin having an acid group can be used, for example, as an alkali-soluble resin. The acid value of the resin with acid groups is preferably 30-500 mgKOH/g. The lower limit is preferably at least 50 mgKOH/g, more preferably at least 70 mgKOH/g. The upper limit is preferably 400 mgKOH/g or less, more preferably 200 mgKOH/g or less, further preferably 150 mgKOH/g or less, most preferably 120 mgKOH/g or less.

The resin includes a resin containing a repeating unit derived from a compound represented by formula (ED1) and/or a compound represented by formula (ED2) (hereinafter, these compounds may also be referred to as "ether dimer".) Also better.

[chemical formula 1]

式（ED2）中，R表示氫原子或碳數1～30的有機基。作為式（ED2）的具體例，能夠參閱日本特開2010-168539號公報的記載。 In formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. [chemical formula 2]

In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. As a specific example of the formula (ED2), the description in JP 2010-168539 A can be referred to.

For specific examples of ether dimers, paragraph 0317 of JP-A-2013-029760 can be referred to, and the content is incorporated in this specification.

It is also preferable to use a resin having a polymerizable group as the resin. Examples of the polymerizable group include ethylenically unsaturated bond-containing groups and cyclic ether groups.

Also, as a resin, one having at least one repeating unit selected from repeating units represented by formula (Ep-1) and repeating units represented by formula (Ep-2) (hereinafter also referred to as repeating unit Ep) can also be used. The resin (hereinafter also referred to as resin Ep). The above-mentioned resin Ep may only contain any one of the repeating unit represented by the formula (Ep-1) and the repeating unit represented by the formula (Ep-2), or may contain the repeating units represented by the formula (Ep-1) unit and a repeating unit represented by formula (Ep-2). In the case of repeating units comprising both, the ratio of the repeating unit represented by formula (Ep-1) to the repeating unit represented by formula (Ep-2) is calculated in molar ratio, given by formula (Ep-1 ) represented by the repeating unit: the repeating unit represented by the formula (Ep-2)=5:95～95:5 is better, 10:90～90:10 is better, 20:80～80:20 is further good. [chemical formula 3]

In formula (Ep-1) and formula (Ep-2), L ¹ represents a single bond or a divalent linking group, and R ¹ represents a hydrogen atom or a substituent. Examples of the substituent represented by ^R1 include an alkyl group and an aryl group, and an alkyl group is preferred. The carbon number of the alkyl group is preferably 1-10, more preferably 1-5, and still more preferably 1-3. R ¹ is preferably a hydrogen atom or a methyl group. As the divalent linking group represented by ^L1 , an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylylene group (preferably an arylylene group having 6 to 20 carbon atoms), -NH -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, and groups formed by combining two or more of them. The alkylene group may be any of linear, branched and cyclic, and linear or branched is preferred. In addition, the alkylene group may have a substituent or may be unsubstituted. As a substituent, a hydroxyl group, an alkoxy group, etc. are mentioned.

The content of the repeating unit Ep in the resin Ep is preferably 1 to 100 mol % in all the repeating units of the resin Ep. The upper limit is preferably 90 mol% or less, and more preferably 80 mol% or less. The lower limit is preferably at least 2 mol%, more preferably at least 3 mol%.

The resin Ep may have other repeating units in addition to the above-mentioned repeating units Ep. As another repeating unit, the repeating unit which has an acidic group, the repeating unit which has a group containing an ethylenically unsaturated bond, etc. are mentioned.

Examples of the acid group include a phenolic hydroxyl group, a carboxyl group, a sulfo group, and a phosphoric acid group, with a phenolic hydroxyl group or a carboxyl group being preferred, and a carboxyl group being more preferred.

Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a styryl group, a (meth)allyl group, and a (meth)acryl group.

When the resin Ep contains a repeating unit having an acid group, the content of the repeating unit having an acid group in the resin Ep is preferably 5 to 85 mol% of all the repeating units in the resin Ep. The upper limit is preferably 60 mol% or less, more preferably 40 mol% or less. The lower limit is preferably at least 8 mol%, more preferably at least 10 mol%.

In the case where the resin Ep contains a repeating unit having a group containing an ethylenically unsaturated bond, the content of the repeating unit having a group containing an ethylenically unsaturated bond in the resin Ep is 1 in all the repeating units of the resin Ep ~65 mol% is better. The upper limit is preferably not more than 45 mol%, more preferably not more than 30 mol%. The lower limit is preferably at least 2 mol%, more preferably at least 3 mol%.

It is preferable that the resin Ep further contains a repeating unit having an aromatic hydrocarbon ring. As the aromatic hydrocarbon ring, a benzene ring or a naphthalene ring is preferable, and a benzene ring is more preferable. The aromatic hydrocarbon ring may have a substituent. An alkyl group etc. are mentioned as a substituent. In the case where the resin having a cyclic ether group contains a repeating unit having an aromatic hydrocarbon ring, the content of the repeating unit having an aromatic hydrocarbon ring is 1 to 65 moles in all the repeating units of the resin having a cyclic ether group % is better. The upper limit is preferably not more than 45 mol%, more preferably not more than 30 mol%. The lower limit is preferably at least 2 mol%, more preferably at least 3 mol%. Examples of the repeating unit having an aromatic hydrocarbon ring include repeating units derived from monofunctional polymerizable compounds having an aromatic hydrocarbon ring such as vinyltoluene and benzyl (meth)acrylate.

式中，R ¹表示氫原子或甲基，R ²¹及R ²²分別獨立地表示伸烷基，n表示0～15的整數。R ²¹及R ²²所表示之伸烷基的碳數為1～10為較佳，1～5為更佳，1～3為進一步較佳，2或3為特佳。n為0～5的整數為較佳，0～4的整數為更佳，0～3的整數為進一步較佳。 As the resin, it is also preferable to use a resin comprising a repeating unit derived from the compound represented by formula (X). [chemical formula 4]

In the formula, ^R1 represents a hydrogen atom or a methyl group, ^R21 and ^R22 each independently represent an alkylene group, and n represents an integer of 0-15. The carbon number of the alkylene group represented by R ²¹ and R ²² is preferably 1-10, more preferably 1-5, still more preferably 1-3, particularly preferably 2 or 3. n is preferably an integer of 0-5, more preferably an integer of 0-4, and still more preferably an integer of 0-3.

Examples of the compound represented by the formula (X) include ethylene oxide or propylene oxide modified (meth)acrylate of p-cumylphenol, and the like. As a commercial item, ARONIX M-110 (made by TOAGOSEI CO., LTD.) etc. are mentioned.

It is also preferable to use a resin (hereinafter also referred to as resin Ac) having an aromatic carboxyl group as the resin. In resin Ac, the aromatic carboxyl group may be included in the main chain of the repeating unit, or may be included in the side chain of the repeating unit. The aromatic carboxyl group is preferably contained in the main chain of the repeating unit. In addition, in this specification, an aromatic carboxyl group is a group of the structure which bonded one or more carboxyl groups to an aromatic ring. Among the aromatic carboxyl groups, the number of carboxyl groups bonded to the aromatic ring is preferably 1 to 4, more preferably 1 to 2.

The composition of the present invention preferably contains a resin as a dispersant. Examples of the dispersant include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the acidic dispersant (acidic resin) means a resin having more acidic groups than basic groups. As the acidic dispersant (acidic resin), when the total amount of the amount of acid groups and the amount of basic groups is 100 mol %, a resin with an amount of acid groups of 70 mol % or more is preferable. It is preferable that the acidic group which the acidic dispersant (acidic resin) has is a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10-105 mgKOH/g. In addition, the basic dispersant (basic resin) means a resin having more basic groups than acid groups. As the basic dispersant (basic resin), a resin having a basic group exceeding 50 mol% when the total amount of acid groups and basic groups is 100 mol% is preferable. It is preferable that the basic group which the basic dispersant has is an amine group.

It is also preferred that the resin used as the dispersant is a grafted resin. For details of the graft resin, the description in paragraphs 0025 to 0094 of JP-A-2012-255128 can be referred to, and the content is incorporated in this specification.

It is also preferable that the resin used as the dispersant is a polyimide-based dispersant containing nitrogen atoms in at least one of the main chain and the side chain. As a polyimide-based dispersant, a resin having a main chain and a side chain and having a basic nitrogen atom in at least one of the main chain and the side chain is preferable, and the main chain includes a partial structure having a functional group of pKa14 or less , the number of atoms in the side chain is 40 to 10,000. The basic nitrogen atom is not particularly limited as long as it is a basic nitrogen atom. Regarding the polyimide-based dispersant, the description in paragraphs 0102 to 0166 of JP-A-2012-255128 can be referred to, and the content is incorporated in this specification.

It is also preferable that the resin used as the dispersant has a structure in which a plurality of polymer chains are bonded to the core. Examples of such resins include dendrimers (including star polymers). Moreover, as a specific example of a dendrimer, polymer compound C-1-C-31 etc. which are described in paragraph 0196-0209 of Unexamined-Japanese-Patent No. 2013-043962 are mentioned.

It is also preferable that the resin used as a dispersant is a resin containing a repeating unit having an ethylenically unsaturated bond-containing group on a side chain. The content of the repeating unit having an ethylenically unsaturated bond-containing group on the side chain is preferably 10 mol% or more in all the repeating units of the resin, more preferably 10-80 mol%, 20-70 mol% % is further preferred.

Also, as a dispersant, resins described in JP-A-2018-087939 and block copolymers (EB-1)-(EB-1) described in paragraphs 0219-0221 of JP-A-6432077 can also be used. -9), Polyethyleneimine having a polyester side chain described in International Publication No. 2016/104803, a block copolymer described in International Publication No. 2019/125940, JP-A-2020-066687 A block polymer having an acrylamide structural unit described in , a block polymer having an acrylamide structural unit described in Japanese Patent Laid-Open No. 2020-066688, and a block polymer having an acrylamide structural unit described in International Publication No. 2016/104803 dispersant, etc.

The dispersant can also be obtained as a commercial product, and as such specific examples, the Disperbyk series manufactured by BYK Chemie (for example, Disperbyk-111, 161, 2001, etc.), the SOLSPERSE series manufactured by Lubrizol Japan Limited (for example, , SOLSPERSE 20000, 76500, etc.), AJISPER series manufactured by Ajinomoto Fine-Techno Co., Inc., etc. Moreover, the product described in paragraph 0129 of JP-A-2012-137564 and the product described in paragraph 0235 of JP-A-2017-194662 can also be used as a dispersant.

The content of the curable compound in the total solid content of the composition is preferably 1 to 70% by mass. The lower limit is preferably at least 2% by mass, more preferably at least 3% by mass, and still more preferably at least 5% by mass. The upper limit is preferably at most 65% by mass, more preferably at most 60% by mass. The composition of the present invention may contain only one type of curable compound, or may contain two or more types. When two or more curable compounds are contained, it is preferable that the total amount is within the above-mentioned range.

When the composition of the present invention contains a polymerizable compound as a curable compound, the content of the polymerizable compound is preferably 1 to 70% by mass in the total solid content of the composition. The lower limit is preferably at least 2% by mass, more preferably at least 3% by mass, and still more preferably at least 5% by mass. The upper limit is preferably at most 65% by mass, more preferably at most 60% by mass. The composition of the present invention may contain only one type of polymerizable compound, or may contain two or more types. When containing 2 or more polymeric compounds, it is preferable that these total amounts are in the said range.

When the composition of the present invention contains a polymerizable monomer as a curable compound, the content of the polymerizable monomer is preferably 1 to 50% by mass in the total solid content of the composition. The lower limit is preferably at least 2% by mass, more preferably at least 3% by mass, and still more preferably at least 5% by mass. The upper limit is preferably at most 35% by mass, more preferably at most 30% by mass, and still more preferably at most 20% by mass. The composition of the present invention may contain only one type of polymerizable monomer, or may contain two or more types. When two or more polymerizable monomers are contained, the total amount is preferably within the above range.

When the composition of the present invention contains a resin as a curable compound, the content of the resin is preferably 1 to 70% by mass in the total solid content of the composition. The lower limit is preferably at least 2% by mass, more preferably at least 3% by mass, and still more preferably at least 5% by mass. The upper limit is preferably at most 65% by mass, more preferably at most 60% by mass. Moreover, it is preferable that content of the resin which has an acid group is 1-70 mass % in the total solid content of a composition. The lower limit is preferably at least 2% by mass, more preferably at least 3% by mass, and still more preferably at least 5% by mass. The upper limit is preferably at most 65% by mass, more preferably at most 60% by mass. Moreover, it is preferable that content of alkali-soluble resin is 1-70 mass % in the total solid content of a composition. The lower limit is preferably at least 2% by mass, more preferably at least 3% by mass, and still more preferably at least 5% by mass. The upper limit is preferably at most 65% by mass, more preferably at most 60% by mass. When the composition of the present invention contains a resin as a dispersant, the content of the resin as a dispersant is preferably 0.1 to 30% by mass in the total solid content of the composition. The upper limit is preferably at most 25% by mass, and more preferably at most 20% by mass. The lower limit is preferably at least 0.5% by mass, and more preferably at least 1% by mass. Moreover, it is preferable that content of the resin which is a dispersing agent is 1-100 mass parts with respect to 100 mass parts of pigments. The upper limit is preferably at most 80 parts by mass, more preferably at most 70 parts by mass, and further preferably at most 60 parts by mass. The lower limit is preferably at least 5 parts by mass, more preferably at least 10 parts by mass, and still more preferably at least 20 parts by mass. The composition of this invention may contain only 1 type of resin, and may contain 2 or more types. When containing 2 or more types of resins, it is preferable that these total amounts are in the said range.

＜＜Polysiloxane Surfactant A (Specific Silicone Surfactant)＞＞ The composition of the first aspect contains the polysiloxane-based surfactant A (hereinafter, specific polysiloxane-based surfactant) exhibiting the specific surface tension shown below. When the specific silicone-based surfactant is dissolved in propylene glycol monomethyl ether acetate to prepare a solution having a solid content concentration of 1000 mass ppm, the surface tension of the solution at 25° C. is 26 mN/m or more. The surface tension of the above solution is preferably at least 26.5 mN/m, more preferably at least 27 mN/m, and still more preferably at least 27.2 mN/m. The upper limit is preferably 28 mN/m or less.

In addition, in this specification, a polysiloxane-type surfactant is a compound which has a repeating unit containing a siloxane bond in a main chain, and is a compound which contains a hydrophobic part and a hydrophilic part in one molecule.

It is preferable that the specific polysiloxane-based surfactant is a compound that does not contain fluorine atoms. According to this aspect, the uniformity of surface tension can be easily improved, and the effect of this invention can be acquired more remarkably.

The hydroxyl value of the specific silicone-based surfactant is preferably 80 mgKOH/g or higher, more preferably 90 mgKOH/g or higher, still more preferably 100 mgKOH/g or higher, and particularly preferably 110 mgKOH/g or higher. As long as the hydroxyl value of the specific polysiloxane-based surfactant is 80 mgKOH/g or more, the affinity between the membrane surface and water can be further improved. From the viewpoint of the function as a surfactant, the upper limit of the hydroxyl value of the specific polysiloxane-based surfactant is preferably 200 mgKOH/g or less, more preferably 190 mgKOH/g or less, and still more preferably 180 mgKOH/g or less.

The dynamic viscosity of the specific silicone-based surfactant at 25° C. is preferably 40 mm ² /s or less, more preferably 38 mm ² /s or less, and still more preferably 36 mm ² /s or less. If the dynamic viscosity of the specific polysiloxane-based surfactant is 40 mm ² /s or less, the fluidity will be improved, so the fluidity of the surface of the film formed using the composition of the present invention can be improved. Therefore, in the case of forming another pixel or the like using another pixel-forming composition at a position adjacent to a film formed using the composition of the present invention, the fluidity of the film surface is improved, so it is presumed that the film can be formed with a developing solution or The rinsing liquid removes the outermost layer of the film together with deposits of other pixel-forming compositions. As a result, residues of other pixel-forming compositions are less likely to form on the film surface, and the occurrence of color mixture can be more effectively suppressed. From the viewpoint of the function of the surfactant, the lower limit of the dynamic viscosity of the specific polysiloxane-based surfactant is preferably at least 10 mm ² /s, more preferably at least 15 mm ² /s, and still more preferably at least 20 mm ² /s , 25mm ² /s or more is especially good.

The weight average molecular weight of the specific polysiloxane-based surfactant is preferably 500-30,000.

It is preferable that the specific polysiloxane-based surfactant is a modified polysiloxane. Examples of the modified polysiloxane include compounds having a structure in which a substituent is introduced into the side chain and/or terminal of the polysiloxane. Examples of substituents include groups containing functional groups selected from amine groups, epoxy groups, alicyclic epoxy groups, hydroxyl groups, mercapto groups, carboxyl groups, fatty acid ester groups, and fatty acid amide groups, and polyether-containing groups. The chain group is preferably a group containing a hydroxyl group, and more preferably a group having an alkyleneoxy group and a hydroxyl group.

The group containing a hydroxyl group is preferably a group represented by formula (G-1) or a group represented by formula (G-2). -L ^G1 -(OR ^G1 ) _m1 OH ･･･(G-1) -L ^G1 -(R ^G1 O) _m1 H ･･･(G-2)

In formula (G-1) and formula (G-2), L ^G1 represents a single bond or a divalent linking group. Examples of the divalent linking group represented by L ^G1 include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms), an arylylene group (preferably It is an aryl group with 6 to 20 carbons, more preferably an aryl group with 6 to 12), -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO -, -S- and a group formed by combining two or more of them.

In formula (G-1) and formula (G-2), m1 represents an integer of 0 or more, preferably an integer of 1-10, more preferably an integer of 1-5.

In formula (G-1) and formula (G-2), R ^G1 represents an alkylene group. The number of carbon atoms in the alkylene group is preferably 1-10, more preferably 1-5, still more preferably 1-3, and particularly preferably 2 or 3. The alkylene group represented by R ^G1 may be either linear or branched. The alkylene groups represented by m1 R ^G1 may be the same or different.

Examples of the polyether chain-containing group include a group represented by the following formula (G-11) and a group represented by the formula (G-12).

-L ^G11 - (R ^G11 O) _m2 R ^G12 ... (G-11) -L ^G11 - (OR ^G11 ) _m2 OR ^G12 ... (G-12)

In formula (G-11) and formula (G-12), L ^G11 represents a single bond or a divalent linking group. Examples of the divalent linking group represented by ^LG11 include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms), an arylylene group (preferably It is an aryl group with 6 to 20 carbons, more preferably an aryl group with 6 to 12), -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO -, -S- and a group formed by combining two or more of them.

In formula (G-11) and formula (G-12), m2 represents the number of 2 or more, and it is preferable that it is 2-200.

In formula (G-11) and formula (G-12), R ^G11 represents an alkylene group. The number of carbon atoms in the alkylene group is preferably 1-10, more preferably 1-5, still more preferably 1-3, and particularly preferably 2 or 3. The alkylene group represented by R ^G11 may be either linear or branched. The alkylene groups represented by m2 R ^G11 may be the same or different.

In formula (G-11) and formula (G-12), R ^G12 represents an alkyl group or an aryl group. The carbon number of the alkyl group represented by R ^G12 is preferably 1-10, more preferably 1-5, and still more preferably 1-3. The alkyl group may be either linear or branched. The carbon number of the aryl group represented by R ^G12 is preferably 6-20, more preferably 6-10.

The specific polysiloxane-based surfactant is preferably methanol-modified polysiloxane, and more preferably methanol-modified dialkyl polysiloxane. Also, it is preferable that the specific polysiloxane-based surfactant is dimethylpolysiloxane having an alkyleneoxy group and a hydroxyl group.

The specific polysiloxane-based surfactant is preferably a compound represented by formula (Si-1) or formula (Si-2). [chemical formula 5]

In the formula (Si-1), R ^S1 to R ^S7 independently represent an alkyl group or an aryl group, and X ^S1 represents a group represented by the above-mentioned formula (G-1) or a group represented by the formula (G-2) Group, n1 represents the number from 2 to 200.

In formula (Si-2), R ^S11 to R ^S16 independently represent an alkyl group or an aryl group, X ^S11 and X ^S12 each independently represent a group represented by the above-mentioned formula (G-1) or a group represented by the formula (G -2) represents a group, and n11 represents a number from 2 to 200.

The alkyl groups represented by R ^S1 to R ^S7 of formula (Si-1) and the alkyl groups represented by R ^S11 to R ^S16 of formula (Si-2) have preferably 1 to 10 carbon atoms, and 1 to 5 are More preferred, 1 to 3 are further preferred, and 1 is particularly preferred. The above-mentioned alkyl group may be any of straight chain or branched chain, and straight chain is preferred. The carbon numbers of the aryl groups represented by RS1 ^- R ^S7 of formula (Si-1) and the aryl groups represented by R ^S11 -R ^S16 of formula (Si-2) are preferably 6-20, and 6-12 are Better, 6 is very good. R ^S1 to R ^S7 , R ^S11 to R ^S16 are preferably methyl or phenyl, more preferably methyl.

It is preferable that n1 and n11 are numbers of 1-100.

Specific examples of the specific polysiloxane-based surfactant include compounds described in Examples described later.

The content of the specific polysiloxane-based surfactant in the composition is preferably 1 to 1000 mass ppm. The lower limit is preferably at least 0.5 mass ppm, more preferably at least 1 mass ppm. The upper limit is preferably at most 750 mass ppm, more preferably at most 500 mass ppm.

＜＜Other surfactants＞＞ The composition of the first aspect may contain surfactants other than the above-mentioned specific polysiloxane-based surfactants (hereinafter also referred to as other surfactants). Examples of other surfactants include fluorine-based surfactants, nonionic surfactants, cationic surfactants, and anionic surfactants. Moreover, silicone-based surfactants other than the specific silicone-based surfactant mentioned above can also be used as another surfactant.

Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP 2014-041318 (corresponding to paragraphs 0060 to 0064 of International Publication No. 2014/017669), etc. The surfactants described in paragraphs 0117 to 0132 of KOKAI Publication No. 2011-132503 and the surfactants described in JP-A-2020-008634 are incorporated in this specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F- 144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F- 560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41, R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (manufactured by DIC CORPORATION), FLUORAD FC430, FC431, FC171 ( The above are manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (above manufactured by AGC INC.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (the above are manufactured by OMNOVA SOLUTIONS INC.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FTX- 218 (the above are made by NEOS), etc.

As the fluorine-based surfactant, an acrylic compound having a molecular structure having a functional group containing a fluorine atom is preferably used, and when heat is applied, the functional group containing a fluorine atom is partially cut off and the fluorine atom is volatilized. Examples of such fluorine-based surfactants include MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example, MEGAFACE DS-21.

As for the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. Examples of such fluorine-based surfactants include fluorine-based surfactants described in JP-A-2016-216602, and the content is incorporated in this specification.

上述化合物的重量平均分子量較佳為3000～50000，例如為14000。上述化合物中，表示重複單元的比例之%為莫耳%。 A block polymer can also be used as a fluorine-type surfactant. The fluorine-based surfactant can also preferably use a fluorine-containing polymer compound, which contains: a repeating unit derived from a (meth)acrylate compound having a fluorine atom; It is preferably a repeating unit of (meth)acrylate compound of 5 or more) alkyleneoxy (preferably ethyleneoxy, propyleneoxy). In addition, the fluorine-containing surfactant described in paragraphs 0016 to 0037 of JP-A-2010-032698 and the following compounds are also exemplified as the fluorine-based surfactant used in the present invention. [chemical formula 6]

The weight average molecular weight of the above compound is preferably 3000-50000, for example 14000. In the above-mentioned compounds, % representing the ratio of repeating units is mole %.

In addition, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group on a side chain can also be used. Specific examples include the compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP-A-2010-164965, MEGAFACE RS-101, RS-102, RS-718K, RS- 72-K et al. Moreover, the compound described in paragraph 0015-0158 of Unexamined-Japanese-Patent No. 2015-117327 can also be used as a fluorine-type surfactant.

Also, from the viewpoint of environmental control, it is also preferable to use the surfactant described in International Publication No. 2020/084854 as a substitute for the surfactant having a perfluoroalkyl group having 6 or more carbon atoms.

式（fi-1）中，m表示1或2，n表示1～4的整數，a表示1或2，X ^a+表示a價的金屬離子、一級銨離子、二級銨離子、三級銨離子、四級銨離子或NH ₄ ⁺。 Furthermore, it is also preferable to use a fluoroimide chlorine-containing compound represented by the formula (fi-1) as a surfactant. [chemical formula 7]

In the formula (fi-1), m represents 1 or 2, n represents an integer from 1 to 4, a represents 1 or 2, X ^a+ represents a-valent metal ions, primary ammonium ions, secondary ammonium ions, and tertiary ammonium ions , quaternary ammonium ion or NH ₄ ⁺ .

Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerol propane Oxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonyl ether Phenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF Corporation) , Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF Corporation), Solsperse 20000 (manufactured by Japan Lubrizol Corporation), NCW-101, NCW-1001, NCW-1002 (manufactured by FUJIFILM Wako Pure Chemical Corporation), PIONIN D -6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), OLFIN E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.

Examples of cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzalkonium chloride, alkylpyridinium salts, imidazolium salts, and the like. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzyl ammonium chloride, cetylpyridinium chloride, stearyl Aminomethylpyridinium chloride, etc.

Examples of anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyldiphenyl ether disulfonate, sodium alkylnaphthalenesulfonate, dioxane Sodium Sulfosuccinate, Sodium Stearate, Potassium Oleate, Dioctyl Sodium Sulfosuccinate, Sodium Polyoxyethylene Alkyl Ether Sulfate, Sodium Polyoxyethylene Alkyl Phenyl Ether Sulfate, Dialkyl Sulfonate Sodium succinate, sodium stearate, sodium oleate, tertiary octylphenoxyethoxypolyethoxyethylsulfate sodium salt, etc.

The content of other surfactants in the composition is preferably at most 1000 mass ppm, more preferably at most 500 mass ppm, and still more preferably at most 250 mass ppm. The lower limit can be, for example, 1 mass ppm or more. Also, the content of other surfactants is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, and still more preferably 25 parts by mass or less, based on 100 parts by mass of the specific polysiloxane-based surfactant. The lower limit can be set to, for example, 1 part by mass or more. It is also preferable that the composition of the present invention does not contain other surfactants.

＜＜Solvent＞＞ The composition of the first aspect contains a solvent. As a solvent, water and an organic solvent are mentioned. The type of solvent is basically not particularly limited as long as it satisfies the solubility of each component and the applicability of the composition. Examples of organic solvents include aliphatic hydrocarbon-based solvents, halogenated hydrocarbon-based solvents, alcohol-based solvents, ether-based solvents, ester-based solvents, ketone-based solvents, nitrile-based solvents, amide-based solvents, ethylene-based solvents, aromatic Department of solvents, etc. Regarding such details, refer to paragraph 0223 of International Publication No. 2015/166779, which is incorporated in this specification. Also, a cyclic alkyl-substituted ester solvent and a cyclic alkyl-substituted ketone solvent can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl celuxoacetate , ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone , 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, Butyl carbitol acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylacrylamide, 3-butoxy-N,N-di Methacrylamide, Propylene Glycol Diacetate, 3-Methoxybutanol, Methyl Ethyl Ketone, γ-Butyrolactone, Cyclobutane, Anisole, 1,4-Diacetyloxybutanol alkane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl yl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropanol, etc. However, sometimes it is better to reduce aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents due to environmental reasons (for example, it can be set to 50% by mass relative to the total amount of organic solvents) ppm (parts per million) or less, may be 10 mass ppm or less, may also be 1 mass ppm or less).

In the present invention, it is preferable to use an organic solvent with a low metal content. The metal content of the organic solvent is preferably, for example, 10 mass ppb (parts per billion, one part per billion) or less. According to needs, organic solvents of ppt (parts per trillion) level can be used, such organic solvents are provided by Toyo Gosei Co., Ltd, for example (Chemical Industry Daily, November 13, 2015).

Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and still more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene or nylon.

Organic solvents may contain isomers (compounds with the same number of atoms but different structures). In addition, isomers may contain only 1 type, and may contain plural types.

The content of the peroxide in the organic solvent is preferably at most 0.8 mmol/L, and it is more preferably not substantially containing the peroxide.

The content of the solvent in the composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, and still more preferably from 30 to 90% by mass. The composition of the present invention may contain only one solvent, or may contain two or more solvents. When two or more solvents are contained, it is preferable that the total amount is within the above range.

＜＜Color material＞＞ It is preferable that the composition of the first aspect contains a coloring material. Such a composition can be preferably used as a composition for forming an optical filter (more specifically, for forming a pixel of an optical filter).

Examples of the color material include a white color material, a black color material, a colored color material, and a near-infrared absorption color material. Furthermore, in this specification, the white color material includes not only pure white, but also light gray color materials close to white (such as off-white, thin gray, etc.).

It is preferable that the color material contains at least one selected from the group including colored color material, black color material and near-infrared color material, and at least one selected from the group including color color material and black color material More preferably, it is further more preferable to include a colored color material.

Moreover, it is also preferable that the color material contains two or more kinds of color color materials and near-infrared absorption color materials. Also, black may be formed by a combination of two or more color materials. In addition, it is also preferable that the color material includes a black color material and a near-infrared absorption color material. According to these aspects, the composition of the present invention can be preferably used as a composition for forming a near infrared transmission filter. Regarding the combination of two or more color materials to form black color materials, refer to JP-A-2013-077009, JP-A-2014-130338, International Publication No. 2015/166779, and the like.

The color material can be pigment or dye, and pigment is preferred. The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably at most 180 nm, more preferably at most 150 nm, and still more preferably at most 100 nm. In addition, in this specification, the primary particle diameter of a pigment can be calculated|required from the image photograph obtained by observing the primary particle of a pigment by a transmission electron microscope. Specifically, the projected area of the primary particle of the pigment is obtained, and the equivalent circle diameter corresponding thereto is calculated as the primary particle diameter of the pigment. Moreover, the average primary particle diameter in this specification is made into the arithmetic mean value about the primary particle diameter of the primary particle of 400 pigments. In addition, the primary particle of the pigment refers to unaggregated independent particles.

(color material) As a color material, the color material which has a maximum absorption wavelength in the wavelength range of 400-700 nm is mentioned. For example, a green color material, a red color material, a yellow color material, a purple color material, a blue color material, an orange color material, etc. are mentioned.

Examples of the green color material include phthalocyanine compounds and squarylium compounds, and phthalocyanine compounds are preferred. Also, it is preferable that the green color material is a pigment. Specific examples of green color materials include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. Also, as a green color material, a zinc halide phthalocyanine pigment with an average number of halogen atoms of 10 to 14, an average number of bromine atoms of 8 to 12, and an average number of chlorine atoms of 2 to 5 in one molecule can also be used. . Specific examples include compounds described in International Publication No. 2015/118720. In addition, as a green color material, the compound described in the specification of Chinese Patent Application No. 106909027, the phthalocyanine compound having a phosphoric acid ester as a ligand described in International Publication No. 2012/102395, Japanese Patent Laid-Open 2019 - Phthalocyanine compounds described in JP-A No. 008014, phthalocyanine compounds described in JP-A No. 2018-180023, compounds described in JP-A No. 2019-038958, JP-A No. 2020-070426 Aluminum phthalocyanine compounds described in JP 2020-076995 A, core-shell pigments described in JP 2020-076995 A, diarylmethane compounds described in JP 2020-504758 A, etc.

The green color materials are C.I. Pigment Green 7, 36, 58, 59, 62, 63 are better, and C.I. Pigment Green 7, 36, 58, 59 are more preferable.

Examples of red coloring materials include diketopyrrolopyrrole compounds, anthraquinone compounds, azo compounds, naphthol compounds, methimine compounds, ketone compounds, quinacridone compounds, perylene compounds, and thioindigo compounds. A diketopyrrolopyrrole compound, an anthraquinone compound, and an azo compound are preferable, and a diketopyrrolopyrrole compound is more preferable. Also, it is preferable that the red color material is a pigment. Specific examples of red color materials include C.I. (Color Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41 , 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1 , 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170 ,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246 , 254, 255, 264, 269, 270, 272, 279, 291, 294, 295, 296, 297 and other red pigments. In addition, as a red coloring material, diketopyrrolopyrrole compounds in which at least one bromine atom is substituted in the structure described in JP-A-2017-201384 and in paragraphs 0016 to 0022 of JP-A-6248838 can also be used. The diketopyrrolopyrrole compound described, the diketopyrrolopyrrole compound described in International Publication No. 2012/102399, the diketopyrrolopyrrole compound described in International Publication No. 2012/117965, JP 2020 - Brominated diketopyrrolopyrrole compounds described in Gazette No. 085947, naphthol azo compounds described in JP 2012-229344 Gazette, red coloring materials described in JP 6516119 Gazette, Japan The red coloring material described in Patent No. 6525101, the brominated diketopyrrolopyrrole compound described in paragraph 0229 of Japanese Patent Application Laid-Open No. 2020-090632, the Korean patent publication No. 10-2019-0140741 Anthraquinone compounds described in Korean Laid-Open Patent No. 10-2019-0140744, perylene compounds described in Japanese Patent Laid-Open No. 2020-079396, and Japanese Patent Laid-Open No. 2020-083982 Perylene compounds described in JP-A-2018-035345, diketopyrrolopyrrole compounds described in paragraphs 0025-0041 of JP-A-2020-066702, etc. Also, as a red coloring material, a compound having a structure in which an aromatic ring group obtained by introducing a group bonded to an oxygen atom, a sulfur atom or a nitrogen atom into an aromatic ring is bonded to two Ketopyrrolopyrrole skeleton. As a red color material, Lumogen F Orange 240 (manufactured by BASF, red pigment, perylene pigment) can also be used.

The red color materials are C.I. Pigment Red 122, 177, 179, 254, 255, 264, 269, 272, and 291, and C.I. Pigment Red 254, 264, and 272 are more preferable.

As a yellow coloring material, an azo compound, an imine compound, an isoindoline compound, a pteridine compound, a quinoline yellow compound, a perylene compound, etc. are mentioned. The yellow color material is a pigment, preferably an azo pigment, an imine pigment, an isoindoline pigment, a pteridine pigment, a quinoline yellow pigment or a perylene pigment, and an azo pigment or an imine pigment is more preferred . Specific examples of yellow color materials include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc. yellow paint.

Moreover, the nickel azobarbiturate complex compound of the following structure can also be used as a yellow color material. [chemical formula 8]

In addition, as a yellow coloring material, compounds described in JP-A-2017-201003, compounds described in JP-A-2017-197719, compounds 0011-0062 in JP-A-2017-171912 can also be used. Paragraphs, compounds described in paragraphs 0137-0276, compounds described in paragraphs 0010-0062, 0138-0295 of JP-A-2017-171913, paragraphs 0011-0062 of JP-A-2017-171914, Compounds described in paragraphs 0139 to 0190, compounds described in paragraphs 0010 to 0065, 0142 to 0222 of JP-A-2017-171915, and paragraphs 0011-0034 of JP-A-2013-054339 The quinophthalone compound, the quinophthalone compound described in paragraphs 0013 to 0058 of JP-A-2014-026228, the isoindoline compound described in JP-A-2018-062644, JP-A-2018 -The quinophthalone compound described in Gazette No. 203798, the quinophthalone compound described in JP-A-2018-062578, the quinophthalone compound described in JP-A-6432076, JP-A-2018- The quinophthalone compound described in Gazette No. 155881, the quinophthalone compound described in JP-A No. 2018-111757, the quinophthalone compound described in JP-A No. 2018-040835, JP-A-2017 - The quinophthalone compound described in Gazette No. 197640, the quinophthalone compound described in JP-A-2016-145282, the quinophthalone compound described in JP-A-2014-085565, JP-A The quinophthalone compound described in the 2014-021139 communique, the quinophthalone compound described in the Japanese Patent Application Publication No. 2013-209614, the quinophthalone compound described in the Japanese Patent Application Publication No. The quinophthalone compound described in the publication No. 2013-181015, the quinophthalone compound described in the Japanese Patent Application Publication No. 2013-061622, the quinophthalone compound described in the Japanese Patent Application Publication No. The quinophthalone compound described in Japanese Patent Application Laid-Open No. 2012-226110, the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-074987, the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-081565, The quinophthalone compound described in JP-A-2008-074986, the quinophthalone compound described in JP-A-2008-074985, and the quinophthalone compound described in JP-A-2008-050420 , the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-031281, the quinophthalone compound described in Japanese Patent Application Publication No. 48-032765, and the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2019-008014 Compounds, quinophthalone compounds described in Japanese Patent No. 6607427, compounds described in Korean Laid-Open Patent No. 10-2014-0034963, compounds described in Japanese Patent Laid-Open No. 2017-095706, Taiwan patents Compounds described in Application Publication No. 201920495, compounds described in Japanese Patent No. 6607427, compounds described in Japanese Patent Laid-Open No. 2020-033525, compounds described in Japanese Patent Laid-Open No. 2020-033524 Compounds, compounds described in JP 2020-033523 A, compounds described in JP 2020-033522 A, compounds described in JP 2020-033521 A, International Publication No. 2020/045200 The compounds described in International Publication No. 2020/045199, the compounds described in International Publication No. 2020/045197, the azo compounds described in Japanese Patent Application Laid-Open No. 2020-093994, the international The perylene compound described in Publication No. 2020/105346, the quinophthalone compound described in Japanese PCT Publication No. 2020-517791, the compound represented by the following formula (QP1), and the compound represented by the following formula (QP2) compound. Moreover, from the viewpoint of improving the color value, those obtained by multimerizing these compounds can also be preferably used. [chemical formula 9]

In formula (QP1), X ¹ to X ¹⁶ each independently represent a hydrogen atom or a halogen atom, and Z ¹ represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by the formula (QP1) include compounds described in paragraph 0016 of Japanese Patent No. 6443711. [chemical formula 10]

In formula (QP2), Y ¹ to Y ³ each independently represent a halogen atom. n and m represent the integer of 0-6, and p represents the integer of 0-5. (n+m) is 1 or more. Specific examples of the compound represented by the formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.

The yellow color material is C.I. Pigment Yellow 117, 129, 138, 139, 150, 185 are better.

Examples of orange color materials include C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61 , 62, 64, 71, 73 and other orange pigments.

Examples of purple color materials include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.

Examples of blue color materials include C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79 , 80, 87, 88, etc. In addition, an aluminum phthalocyanine compound having a phosphorus atom can also be used as a blue color material. Specific examples include compounds described in paragraphs 0022 to 0030 of JP-A-2012-247591 and paragraphs 0047 of JP-A-2011-157478.

Dyes can also be used as coloring materials. The dye is not particularly limited, and known dyes can be used. For example, pyrazole azo series, anilino azo series, triarylmethane series, anthraquinone series, anthrapyridine quinone series, benzylidene series, oxonol series, pyrazolotriazole azo series, Pyridone azo-based, cyanine-based, pyrrolopyrazole-based azo-based, xanthene-based, phthalocyanine-based, benzopyran-based, indigo-based, pyrromethene-based and other dyes.

A pigment multimer can also be used for a color material. It is preferable that the dye multimer is used as a dye dissolved in an organic solvent. Also, pigment multimers may form particles. When the pigment multimer is a particle, it is usually used in a dispersed state in a solvent. The pigment multimer in a particulate state can be obtained, for example, by emulsion polymerization, and specific examples thereof include compounds and production methods described in JP-A-2015-214682. The pigment multimer system has two or more pigment structures in one molecule, preferably three or more pigment structures. The upper limit is not particularly limited, but can also be set to 100 or less. The plural pigment structures contained in one molecule may be the same pigment structure or different pigment structures. The weight average molecular weight (Mw) of the pigment multimer is preferably 2,000 to 50,000. The lower limit is more preferably 3000 or more, and more preferably 6000 or more. The upper limit is more preferably 30,000 or less, and further preferably 20,000 or less. As the pigment polymer, JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, and International Publication No. 2016/031442 can also be used. Compounds described in et al.

The diarylmethane compound described in Japanese PCT Publication No. 2020-504758, the triarylmethane dye polymer described in Korean Laid-Open Patent No. 10-2020-0028160, and JP-A-2020 can be used as color materials. - The star compound described in Publication No. 117638, the phthalocyanine compound described in International Publication No. 2020/174991, the isoindoline compound described in Japanese Patent Application Laid-Open No. 2020-160279, or their salts , the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069442, the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069730, and the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10 - Compounds represented by Formula 1 described in Publication No. 2020-0069070, Compounds represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069067, Korean Patent Publication No. 10-2020-0069062 The compound represented by formula 1 described in , the zinc halide phthalocyanine pigment described in Patent No. 6809649, and the isoindoline compound described in Japanese Patent Application Laid-Open No. 2020-180176. The color material can be a rotaxane, and the pigment skeleton can be used in a cyclic structure of a rotaxane, a rod structure, or both structures.

Two or more kinds of color materials may be used in combination. Moreover, when using in combination of 2 or more types of color color materials, you may form black with the combination of 2 or more types of color color materials. Examples of such combinations include the following aspects (1) to (7). (1) The form that contains red color material and blue color material. (2) Forms containing red color material, blue color material and yellow color material. (3) Forms containing red color material, blue color material, yellow color material and purple color material. (4) Forms containing red color material, blue color material, yellow color material, purple color material and green color material. (5) Forms containing red color material, blue color material, yellow color material and green color material. (6) Forms containing red color material, blue color material and green color material. (7) Forms containing yellow and purple color materials.

(white color material) Examples of white color materials include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silicon dioxide, talc, mica, aluminum hydroxide, calcium silicate, Aluminum silicate, zinc sulfide and other inorganic pigments (white pigments). The white pigment is preferably particles having titanium atoms, more preferably titanium oxide. In addition, the white pigment is preferably particles having a refractive index of 2.10 or higher with respect to light having a wavelength of 589 nm. The aforementioned refractive index is preferably from 2.10 to 3.00, more preferably from 2.50 to 2.75.

In addition, as the white pigment, titanium oxide described in "Titanium Oxide Physical Properties and Applied Technology, Kiyono Gakushu, pp. 13-45, June 25, 1991, Gihodo Publishing" can also be used.

The white pigment is not limited to a single inorganic substance, and particles compounded with other materials may also be used. For example, particles with pores or other materials inside, particles with a plurality of inorganic particles attached to the core particle, core and core composite particles composed of a core particle including polymer particles and a shell layer including inorganic nanoparticles are used. better. As the core-core composite particle composed of the core particle including the above-mentioned polymer particle and the shell layer including inorganic nanoparticles, for example, the description in paragraphs 0012 to 0042 of Japanese Patent Laid-Open No. 2015-047520 can be referred to. incorporated into this manual.

Hollow inorganic particles can also be used as a white pigment. The hollow inorganic particle refers to an inorganic particle having a structure of a cavity inside, and refers to an inorganic particle having a cavity surrounded by an outer shell. Examples of the hollow inorganic particles include hollow inorganic particles described in JP-A-2011-075786, International Publication No. 2013/061621, JP-A-2015-164881, etc., and these contents are incorporated in this specification. .

(black color material) It does not specifically limit as a black color material, A well-known thing can be used. It is preferable that the black color material is a pigment (black pigment). In addition, in this specification, a black color material means the color material which shows absorption in the whole range of wavelength 400-700nm. For example, carbon black, titanium black, graphite, etc. are mentioned as an inorganic black color material, Carbon black and titanium black are preferable, and titanium black is more preferable. Titanium black is black particles containing titanium atoms, preferably subvalent titanium oxide or titanium oxynitride. The surface of titanium black can be modified as needed for the purpose of improving dispersibility, suppressing coagulation, and the like. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide or zirconium oxide. In addition, treatment with a water-repellent substance as disclosed in JP-A-2007-302836 can also be performed. As a black color material, color index (C.I.) Pigment Black 1, 7 can also be used. Regarding titanium black, it is preferable that both the primary particle diameter and the average primary particle diameter of each particle are small. Specifically, the average primary particle diameter is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silica particles and adjusting the content ratio of Si atoms to Ti atoms in the dispersion to be in the range of 0.20 to 0.50, etc. may be mentioned. Regarding the above-mentioned dispersion, the description in paragraphs 0020 to 0105 of JP-A-2012-169556 can also be referred to, and the content is incorporated in this specification. Examples of commercially available titanium black include titanium black 10S, 12S, 13R, 13M, 13M-C, 13R-N, 13M-T (product name: manufactured by Mitsubishi Materials Corporation), Tilack D (product name: Ako Kasei Co., Ltd.), etc.

Examples of the organic black coloring material include bisbenzofuranone compounds, imine compounds, perylene compounds, and azo compounds, among which bisbenzofuranone compounds and perylene compounds are preferred. Examples of the bisbenzofuranone compound include JP 2010-534726, JP 2012-515233, JP 2012-515234, International Publication No. 2014/208348, JP 2015 - The compound described in Publication No. 525260 etc. is available as "Irgaphor Black" manufactured by BASF Corporation, for example. C.I. Pigment Black 31, 32 etc. are mentioned as a perylene compound. Examples of the methylimine compound include compounds described in JP-A-01-170601, JP-A-02-034664, etc., for example, as "CHROMOFINE" manufactured by Dainichiseika Color & Chemicals Mfg.Co., Ltd. BLACK A1103". In addition, Perylene Black (Lumogen Black FK4280, etc.) described in paragraphs 0016 to 0020 of JP-A-2017-226821 can also be used as an organic black coloring material.

(Near-infrared-absorbing color material) The near-infrared-absorbing color material is preferably a compound in which the maximum absorption wavelength exists within a wavelength range from 700 nm to 1400 nm. The maximum absorption wavelength of the near-infrared absorbing color material is preferably 1200 nm or less, more preferably 1000 nm or less, and still more preferably 950 nm or less. The near-infrared absorbing color material is a ratio of the absorbance A ₅₅₀ at a wavelength of 550nm to the absorbance A _max at the maximum absorption wavelength, that is, A ₅₅₀ /A _max is preferably 0.1 or less, more preferably 0.05 or less, and even more preferably 0.03 or less , below 0.02 is especially good. The lower limit is not particularly limited, and may be, for example, 0.0001 or more, or 0.0005 or more. The near-infrared absorbing color material can be a pigment or a dye, preferably a pigment, and more preferably an organic pigment.

The near-infrared absorbing color material is not particularly limited, and examples thereof include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, and merocyanine compounds. Chlorine compounds, crotonium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, imine compounds, anthraquinone compounds, dibenzofuranone Compounds, disulfide metal complexes, etc. Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614 , compounds described in paragraphs 0037-0052 of JP-A-2011-068731 , International Publication No. Compounds described in paragraphs 0010 to 0033 of No. 2015/166873, etc. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of Japanese Patent Application Laid-Open No. 2011-208101, compounds described in paragraphs 0060 to 0061 of Japanese Patent No. 6065169, International Publication No. 2016/ Compounds described in Paragraph 0040 of No. 181987, compounds described in JP-A No. 2015-176046, compounds described in Paragraph 0072 of International Publication No. 2016/190162, compounds described in JP-A No. 2016-074649 Compounds described in paragraphs 0196 to 0228, compounds described in paragraph 0124 of JP-A-2017-067963, compounds described in International Publication No. 2017/135359, JP-A-2017-114956 Compounds described, compounds described in Japanese Patent No. 6197940, compounds described in International Publication No. 2016/120166, etc. Examples of cyanine compounds include compounds described in paragraphs 0044 to 0045 of JP 2009-108267 A, compounds described in paragraphs 0026 to 0030 of JP 2002-194040 A, JP 2015 - Compounds described in Publication No. 172004, Compounds described in Japanese Patent Application Laid-Open No. 2015-172102, Compounds described in Japanese Patent Application Publication No. 2008-088426, Paragraph 0090 of International Publication No. 2016/190162 Compounds described, compounds described in JP-A-2017-031394, etc. Examples of the crotonium compound include compounds described in JP-A-2017-082029. Examples of iminium compounds include compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, and compounds described in JP-A-2007-092060 . Compounds described in paragraphs 0048 to 0063 of International Publication No. 2018/043564. Examples of the phthalocyanine compound include compounds described in paragraph 0093 of JP-A-2012-077153, phthalocyanine-titanium compounds described in JP-A-2006-343631, JP-A-2013-195480 Compounds described in paragraphs 0013 to 0029, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, and compounds described in International Publication No. 2020/071470. As a naphthalocyanine compound, the compound described in paragraph 0093 of Unexamined-Japanese-Patent No. 2012-077153 is mentioned. Examples of the dithioalkene metal complexes include compounds described in Japanese Patent No. 5733804 .

In addition, as a near-infrared absorbing coloring material, squarylium compounds described in JP-A-2017-197437, squarylium compounds described in JP-A-2017-025311, International Publication No. 2016 The squaraine compound described in /154782, the squaraine compound described in Japanese Patent No. 5884953, the squaraine compound described in Japanese Patent No. 6036689, the squaraine compound described in Japanese Patent No. 5810604 The squaraine compound described, the squaraine compound described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, the compound containing a pyrrole ring described in paragraphs 0019 to 0075 of JP-A-2018-054760 , Compounds containing a pyrrole ring described in paragraphs 0078 to 0082 of JP-A-2018-040955, compounds containing a pyrrole ring described in paragraphs 0043-0069 of JP-A-2018-002773, JP-A A squarylium compound having an aromatic ring at the amide α-position described in paragraphs 0024 to 0086 of Publication No. 2018-041047, an amide-linked squarylium compound described in Japanese Patent Laid-Open Publication No. 2017-179131, Japan A compound having a pyrrole double-type squaraine skeleton or a crotonium skeleton described in JP-A-2017-141215, a dihydroxycarbazole-type squaraine compound described in JP-A-2017-082029, Asymmetric compounds described in paragraphs 0027 to 0114 of JP-A-2017-068120, pyrrole-ring-containing compounds (carbazole-type) described in JP-A-2017-067963, Japanese Patent No. 6251530 Phthalocyanine compounds described in the gazette, squarylium compounds described in Japanese Patent Laid-Open No. 2020-075959, copper complexes described in Korean Laid-Open Patent No. 10-2019-0135217, etc.

It is preferable that content of the coloring material in the total solid content of a composition is 20-80 mass %. The lower limit is preferably at least 30% by mass, more preferably at least 40% by mass, and still more preferably at least 50% by mass. The upper limit is preferably at most 75% by mass, more preferably at most 70% by mass. The composition of this invention may contain only 1 type of coloring material, and may contain 2 or more types. When containing two or more kinds of color materials, it is preferable that the total amount is within the above-mentioned range.

＜＜Photopolymerization Initiator＞＞ The colored composition of the first aspect can contain a photopolymerization initiator. When using a polymerizable monomer as a curable compound, it is preferable to contain a photopolymerization initiator. It does not specifically limit as a photoinitiator, It can select suitably from well-known photoinitiator. For example, a compound having photosensitivity to rays from the ultraviolet range to the visible range is preferable. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (for example, compounds having a trioxane skeleton, compounds having a oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic Peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, and the like. From the viewpoint of exposure sensitivity, photopolymerization initiators are trihalomethyl triazine compounds, benzyl dimethyl ketal compounds, α-hydroxy ketone compounds, α-amino ketone compounds, acyl Phosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, hexaarylbisimidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes Compounds, halomethyl oxadiazole compounds and 3-aryl substituted coumarin compounds are preferred, and compounds selected from oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds and acyl phosphine compounds are more preferred Preferably, an oxime compound is further more preferred. Also, examples of photopolymerization initiators include compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173, compounds described in JP-A-6301489, MATERIAL STAGE 37-60p, vol. .19, No.3, 2019, the peroxide-based photopolymerization initiator, the photopolymerization initiator described in International Publication No. 2018/221177, and the photopolymerization initiator described in International Publication No. 2018/110179 Photopolymerization initiator, photopolymerization initiator described in JP 2019-043864 A, photopolymerization initiator described in JP 2019-044030 A, JP 2019-167313 A The peroxide-based initiator described in JP-A-2020-055992, the aminoacetophenone-based initiator with oxazolidinyl group described in JP-A No. 2013-190459 The oxime-based photopolymerization initiators described, the polymers described in Japanese Patent Application Laid-Open No. 2020-172619, the compound represented by formula 1 described in International Publication No. 2020/152120, etc., are incorporated herein. in the manual.

Specific examples of hexaarylbisimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-bis Phenyl-1,1'-biimidazole, etc.

Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (the above are manufactured by IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure 2959, Irgacure 127 (the above are manufactured by BASF company), etc. Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (the above are manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (the above are manufactured by BASF Corporation) )wait. Examples of commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (the above are manufactured by IGM Resins B.V.), Irgacure 819, and Irgacure TPO (the above are manufactured by BASF Corporation) and the like.

Examples of the oxime compound include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, J.C.S. Compounds described in Perkin II (1979, pp.1653-1660), compounds described in J.C.S. Perkin II (1979, pp.156-162), Journal of Photopolymer Science and Technology (1995, pp.202) -232), the compound described in JP-A-2000-066385, the compound described in JP-A-2004-534797, the compound described in JP-2006-342166 Compounds, compounds described in Japanese Patent Laid-Open No. 2017-019766, compounds described in Japanese Patent No. 6065596, compounds described in International Publication No. 2015/152153, compounds described in International Publication No. 2017/051680 Compounds described, compounds described in JP-A-2017-198865, compounds described in paragraphs 0025 to 0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, etc. Specific examples of oxime compounds include 3-benzoyloxyiminobutan-2-one, 3-acetyloxyiminobutan-2-one, 3-propionyloxy Iminobutan-2-one, 2-Acetyloxyiminopentan-3-one, 2-Acetyloxyimino-1-phenylpropan-1-one, 2-Benzene Acyloxyimino-1-phenylpropan-1-one, 3-(4-tosyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino- 1-phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04 (the above are manufactured by BASF Corporation), TR-PBG-304, TR-PBG-327 (manufactured by TRONLY Corporation), ADEKA OPTOMER N-1919 ( ADEKA Corporation make, and the photoinitiator 2) described in Unexamined-Japanese-Patent No. 2012-014052. In addition, as the oxime compound, it is also preferable to use a non-coloring compound or a compound with high transparency and low discoloration. As a commercial item, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (the above are made by ADEKA CORPORATION) etc. are mentioned.

As a photopolymerization initiator, an oxime compound having an oxene ring can also be used. Specific examples of oxime compounds having a stilbene ring include compounds described in JP-A-2014-137466, compounds described in JP-A-6636081, Korean Laid-Open Patent No. 10-2016-0109444 Compounds listed in the gazette.

An oxime compound having a skeleton in which at least one benzene ring in a carbazole ring becomes a naphthalene ring can also be used as a photopolymerization initiator. Specific examples of such oxime compounds include compounds described in International Publication No. 2013/083505.

An oxime compound having a fluorine atom can also be used as a photopolymerization initiator. Specific examples of oxime compounds having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36-40 described in JP-A-2014-500852, JP-A Compound (C-3) described in Publication No. 2013-164471, etc.

As a photopolymerization initiator, an oxime compound having a nitro group can be used. It is also preferable to form an oxime compound having a nitro group as a dimer. Specific examples of oxime compounds having a nitro group include compounds described in paragraphs 0031 to 0047 of JP-A-2013-114249 and in paragraphs 0008-0012 and 0070-0079 of JP-A-2014-137466 , Compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

An oxime compound having a benzofuran skeleton can also be used as a photopolymerization initiator. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

An oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used as a photopolymerization initiator. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055, and the like.

As the photopolymerization initiator, an oxime compound (hereinafter also referred to as an oxime compound OX) having an aromatic ring group Ar ^OX1 in which an electron-withdrawing group is introduced into an aromatic ring can also be used. Examples of the electron-withdrawing group included in the aromatic ring group Ar ^OX1 include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, An arylsulfonyl group, a cyano group, an acyl group, and a nitro group are preferable, an acyl group is more preferable, and a benzoyl group is still more preferable from the viewpoint of being easy to form a film excellent in light resistance. The benzoyl group may have a substituent. As a substituent, a halogen atom, a cyano group, a nitro group, a hydroxyl group, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic epoxy group, an alkenyl group, an alkylsulfanyl group, an arylthio group Alkyl, acyl or amine are preferred, alkyl, alkoxy, aryl, aryloxy, heteroepoxy, alkylsulfanyl, arylsulfanyl or amine are more preferred, alkyl An oxy group, an alkylsulfanyl group or an amino group is further preferred.

式中，R ^X1表示烷基、烯基、烷氧基、芳基、芳氧基、雜環基、雜環氧基、烷基硫烷基、芳基硫烷基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、醯基、醯氧基、胺基、膦醯基、胺甲醯基或胺磺醯基， R ^X2表示烷基、烯基、烷氧基、芳基、芳氧基、雜環基、雜環氧基、烷基硫烷基、芳基硫烷基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、醯氧基或胺基， R ^X3～R ^X14分別獨立地表示氫原子或取代基； 但是，R ^X10～R ^X14中的至少一個為拉電子基團。 The oxime compound OX is preferably at least one selected from the compound represented by the formula (OX1) and the compound represented by the formula (OX2), more preferably the compound represented by the formula (OX2). [chemical formula 11]

In the formula, R ^X1 represents alkyl, alkenyl, alkoxy, aryl, aryloxy, heterocyclyl, heteroepoxy, alkylsulfanyl, arylsulfanyl, alkylsulfinyl , arylsulfinyl, alkylsulfonyl, arylsulfonyl, acyl, acyloxy, amino, phosphonyl, carbamoyl or sulfamoyl, R ^X2 represents alkyl, Alkenyl, alkoxy, aryl, aryloxy, heterocyclyl, heterocyclyloxy, alkylsulfanyl, arylsulfanyl, alkylsulfinyl, arylsulfinyl, alkyl A sulfonyl group, an arylsulfonyl group, an acyloxy group or an amino group, R ^X3 to R ^X14 each independently represent a hydrogen atom or a substituent; however, at least one of R ^X10 to R ^X14 is an electron-withdrawing group.

Examples of the electron-withdrawing group include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, a cyano group, and an acyl group. A group and a nitro group are preferable, an acyl group is more preferable, and a benzoyl group is still more preferable from the viewpoint of being easy to form the film excellent in light resistance.

In the above formula, R ^X12 is an electron-withdrawing group, and R ^X10 , R ^X11 , R ^X13 , and R ^X14 are preferably hydrogen atoms.

Specific examples of the oxime compound OX include compounds described in paragraphs 0083 to 0105 of Japanese Patent No. 4600600.

Specific examples of oxime compounds preferably used in the present invention are shown below, but the present invention is not limited thereto.

[化學式13]

[化學式14]

[chemical formula 12]

[chemical formula 13]

[chemical formula 14]

The oxime compound is preferably a compound having a maximum absorption wavelength within a wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength within a wavelength range of 360 to 480 nm. Also, from the viewpoint of sensitivity, the oxime compound preferably has a high molar absorption coefficient at a wavelength of 365 nm or 405 nm, more preferably 1,000 to 300,000, still more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorptivity of a compound can be measured using a known method. For example, it is preferable to measure at a concentration of 0.01 g/L using an ethyl acetate solvent with a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).

It is also preferable to use Irgacure OXE01 (manufactured by BASF) and/or Irgacure OXE02 (manufactured by BASF) in combination with Omnirad 2959 (manufactured by IGM Resins B.V.) as a photopolymerization initiator.

As the photopolymerization initiator, a bifunctional or trifunctional or higher photoradical polymerization initiator can be used. By using such radical photopolymerization initiators, two or more radicals are generated from one molecule of the radical photopolymerization initiators, so that good sensitivity can be obtained. In addition, when a compound with an asymmetric structure is used, the crystallinity is lowered, the solubility in a solvent or the like is improved, and precipitation becomes difficult over time, thereby improving the temporal stability of the composition. Specific examples of difunctional or trifunctional or more photoradical polymerization initiators include JP 2010-527339, JP 2011-524436, International Publication No. 2015/004565, JP Dimers of oxime compounds described in paragraphs 0407 to 0412 of Table No. 2016-532675, paragraphs 0039 to 0055 of International Publication No. 2017/033680, compounds described in Japanese Patent Publication No. 2013-522445 (E ) and compound (G), Cmpd 1-7 described in International Publication No. 2016/034963, the oxime ester photoinitiator described in paragraph 0007 of JP 2017-523465, JP 2017- Photoinitiators described in paragraphs 0020 to 0033 of Japanese Patent Application Publication No. 167399, photopolymerization initiators (A) described in paragraphs 0017 to 0026 of Japanese Patent Application Laid-Open No. 2017-151342, and Japanese Patent Publication No. 6469669 The oxime ester photoinitiator etc. described.

It is preferable that content of the photoinitiator in the total solid content of a composition is 0.1-20 mass %. The lower limit is preferably at least 0.5% by mass, more preferably at least 1% by mass. The upper limit is preferably at most 15% by mass, more preferably at most 10% by mass. The composition of this invention may contain only 1 type of photoinitiator, and may contain 2 or more types. When containing 2 or more types of photoinitiators, it is preferable that these total amounts are in the said range.

＜＜Pigment Derivatives＞＞ The coloring composition of the first aspect can contain a pigment derivative. Pigment derivatives are used, for example, as dispersing aids. Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton.

Examples of the dye skeleton constituting the pigment derivative include quinoline dye skeleton, benzimidazolone dye skeleton, benzisoindole dye skeleton, benzothiazole dye skeleton, iminium dye skeleton, squarylium dye Skeleton, crotonium dye skeleton, oxonol dye skeleton, pyrrolopyrrole dye skeleton, diketopyrrolopyrrole dye skeleton, azo dye skeleton, formimine dye skeleton, phthalocyanine dye skeleton, naphthalocyanine dye skeleton, Anthraquinone pigment skeleton, quinacridone pigment skeleton, di㗁𠯤 pigment skeleton, perinone (perinone) pigment skeleton, perylene pigment skeleton, thioindigo pigment skeleton, isoindoline pigment skeleton, isoindolinone pigment skeleton, Quinoline yellow pigment skeleton, iminium pigment skeleton, dithiol pigment skeleton, triarylmethane pigment skeleton, pyrromethene pigment skeleton, etc.

Examples of the acid group include a carboxyl group, a sulfonic acid group, a phosphoric acid group, a boric acid group, a carboxylic acid amide group, a sulfonic acid amine group, an imidic acid group, and salts thereof. The atoms or atomic groups constituting the salt include alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), alkaline earth metal ions (Ca ²⁺ , Mg ^{2+ ,} etc.), ammonium ions, imidazolium ions, pyridinium ions, etc. ions, phosphonium ions, etc. As the carboxylic acid amide group, a group represented by -NHCOR ^X1 is preferable. As the sulfonamide group, a group represented by -NHSO ₂ R ^X2 is preferable. As the imidic acid group, a group represented by -SO ₂ NHSO ₂ R ^X3 , -CONHSO ₂ R ^X4 , -CONHCOR ^X5 or -SO ₂ NHCOR ^X6 is preferable, and -SO ₂ NHSO ₂ R ^X3 is more preferable. R ^X1 to R ^X6 each independently represent an alkyl group or an aryl group. The alkyl and aryl groups represented by R ^X1 to R ^X6 may have a substituent. As the substituent, a halogen atom is preferable, and a fluorine atom is more preferable.

Examples of the base include an amino group, a pyridyl group and salts thereof, ammonium group salts, and phthalimidomethyl group. Examples of the atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

Pigment derivatives can also use pigment derivatives excellent in visibility and transparency (hereinafter also referred to as transparent pigment derivatives). The maximum molar absorption coefficient (εmax) of the transparent pigment derivative in the wavelength range of 400 to 700nm is preferably 3000L･mol ^-1 ･cm ^-1 or less, more preferably 1000L･mol ^-1 ･cm ^-1 or less Preferably, 100L･mol ^-1 ･cm ^-1 or less is more preferred. The lower limit of εmax is, for example, 1 L･mol ⁻¹ ･cm ⁻¹ or more, and may be 10 L･mol ⁻¹ ･cm ⁻¹ or more.

Specific examples of pigment derivatives include the compounds described in JP-A No. 56-118462, the compounds described in JP-A No. 63-264674, and the compounds described in JP-A No. 01-217077. Compounds described, compounds described in JP-A-03-009961, compounds described in JP-A-03-026767, compounds described in JP-A-03-153780, JP-A Compounds described in Japanese Patent Laid-Open No. 03-045662, Compounds described in Japanese Patent Laid-Open No. 04-285669, Compounds described in Japanese Patent Laid-Open No. 06-145546, Japanese Patent Laid-Open No. 06-212088 Compounds, compounds described in JP-A-06-240158, compounds described in JP-A-10-030063, compounds described in JP-A-10-195326, International Publication No. 2011/ Compounds described in paragraphs 0086 to 0098 of No. 024896, compounds described in paragraphs 0063 to 0094 of International Publication No. 2012/102399, compounds described in paragraph 0082 of International Publication No. 2017/038252, Japanese Patent Laid-Open Compounds described in Paragraph 0171 of Japanese Patent Laid-Open No. 2015-151530, compounds described in Paragraphs 0162 to 0183 of Japanese Patent Laid-Open No. 2011-252065, compounds described in Japanese Patent Laid-Open No. 2003-081972, Japanese Patent No. Compounds described in JP-A No. 5299151, compounds described in JP-A No. 2015-172732, compounds described in JP-A No. 2014-199308, compounds described in JP-A No. 2014-085562 , Compounds described in JP-A No. 2014-035351, compounds described in JP-A No. 2008-081565, compounds described in JP-A No. 2019-109512, JP-A No. 2019-133154 The compound described in the gazette, the diketopyrrolopyrrole compound having a thiol linker described in International Publication No. 2020/002106, the benzimidazolone compound described in JP-A-2018-168244, or the Wait for the salt.

The content of the pigment derivative is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, based on 100 parts by mass of the above-mentioned pigment. In addition, the total content of the pigment derivative and the color material is preferably 35% by mass or more in the total solid content of the composition, more preferably 40% by mass or more, still more preferably 45% by mass or more, and more than 50% by mass. Excellent. The upper limit is preferably at most 70% by mass, more preferably at most 65% by mass. The composition of the present invention may contain only one type of pigment derivative, or may contain two or more types. When containing two or more kinds of pigment derivatives, the total amount is preferably within the above range. By containing two or more kinds of pigment derivatives, the dispersion stability of the composition can be further improved. Moreover, by using a pigment derivative excellent in visible transparency, the color change of the film after a heat resistance test or a light resistance test can be suppressed, and heat resistance and light resistance are further excellent. Moreover, by using together a pigment derivative having a pigment skeleton and a pigment derivative excellent in visible transparency, dispersion stability, heat resistance, and light resistance can be coexisted at a higher level.

＜＜Polyalkyleneimine＞＞ The coloring composition of the first aspect can also contain polyalkyleneimine. Polyalkyleneimines are used, for example, as dispersing aids for pigments. The dispersing aid is a material for improving the dispersibility of the pigment in the composition. Polyalkyleneimine is a polymer of ring-opening polymerized alkyleneimine, a polymer having at least a secondary amine group. The polyalkyleneimine contains primary or tertiary amine groups in addition to secondary amine groups. It is preferable that the polyalkyleneimine is a polymer having a branched chain structure respectively containing a primary amine group, a secondary amine group and a tertiary amine group. The carbon number of the alkyleneimine is preferably 2-6, more preferably 2-4, further preferably 2 or 3, and particularly preferably 2.

The molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, still more preferably 10,000 or less, and particularly preferably 2,000 or less. In addition, about the value of the molecular weight of a polyalkylene imine, when molecular weight can be calculated from a structural formula, the molecular weight of a polyalkylene imine is the value calculated from a structural formula. On the other hand, in the case where the molecular weight of the specific amine compound cannot be calculated from the structural formula or is difficult to calculate, the value of the number average molecular weight measured by the boiling point increase method is used. Also, when it is impossible or difficult to measure by the boiling point elevation method, the value of the number average molecular weight measured by the viscosity method is used. Moreover, when it cannot measure by a viscosity method or it is difficult to measure by a viscosity method, the value of the number average molecular weight in terms of polystyrene conversion value measured by the GPC (gel permeation chromatography) method is used.

The amine value of the polyalkyleneimine is preferably at least 5 mmol/g, more preferably at least 10 mmol/g, and still more preferably at least 15 mmol/g.

Specific examples of alkyleneimine include ethyleneimine, propyleneimine, 1,2-buteneimine, 2,3-buteneimine, etc., and ethyleneimine or propyleneimine is preferable. , ethyleneimine is more preferred. The polyalkyleneimine is particularly preferably polyethyleneimine. Furthermore, relative to the total of the primary amine groups, secondary amine groups, and tertiary amine groups, polyethyleneimine preferably contains 10 mol% or more of primary amine groups, more preferably 20 mol% or more, and contains 30 mol% or more. Mole % or more is further preferred. Examples of commercially available polyethyleneimines include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (manufactured by NIPPON SHOKUBAI CO., LTD.). .

The content of the polyalkyleneimine in the total solid content of the composition is preferably 0.1 to 5% by mass. The lower limit is preferably at least 0.2% by mass, more preferably at least 0.5% by mass, and still more preferably at least 1% by mass. The upper limit is preferably at most 4.5% by mass, more preferably at most 4% by mass, and still more preferably at most 3% by mass. Moreover, it is preferable that content of polyalkyleneimine is 0.5-20 mass parts with respect to 100 mass parts of pigments. The lower limit is preferably at least 0.6 parts by mass, more preferably at least 1 part by mass, and still more preferably at least 2 parts by mass. The upper limit is preferably at most 10 parts by mass, more preferably at most 8 parts by mass. The polyalkyleneimine may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Hardening Accelerator＞＞ The coloring composition of the first aspect may contain a hardening accelerator. Examples of the curing accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine chloride compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, onium salt compounds, and the like. Specific examples of the hardening accelerator include compounds described in paragraphs 0094 to 0097 of International Publication No. 2018/056189, compounds described in paragraphs 0246 to 0253 of Japanese Patent Application Laid-Open No. 2015-034963, Japanese Patent Application Laid-Open No. Compounds described in paragraphs 0186 to 0251 of JP-A-2013-041165, ionic compounds described in JP-A-2014-055114, and paragraphs 0071-0080 of JP-A-2012-150180 Compound, an alkoxysilane compound having an epoxy group described in JP-A-2011-253054, a compound described in paragraphs 0085-0092 of JP-A No. 5765059, JP-A-2017-036379 Carboxyl-containing epoxy hardeners as described in The content of the hardening accelerator in the total solid content of the composition is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass. A hardening accelerator may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Ultraviolet absorber＞＞ The coloring composition of the first aspect may contain an ultraviolet absorber. Conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyl triazole compounds, and indole compounds can be used as ultraviolet absorbers , Three 𠯤 compounds, etc. Specific examples of such compounds include paragraphs 0038 to 0052 of JP-A-2009-217221, paragraphs 0052-0072 of JP-A-2012-208374, and paragraphs 0317-0072 of JP-A-2013-068814. The compounds described in Paragraph 0334 and Paragraphs 0061 to 0080 of JP-A-2016-162946 are incorporated in this specification. Commercially available ultraviolet absorbers include, for example, UV-503 (manufactured by DAITO CHEMICAL CO., LTD.), Tinuvin series and Uvinul series produced by BASF Corporation, Sumika Chemtex Company, Limited Sumisorb series, and the like. Moreover, as a benzotriazole compound, MYUA series by MIYOSHI OIL & FAT CO., LTD. is mentioned (Chemical Industry Daily, February 1, 2016). In addition, as the ultraviolet absorber, compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967, compounds described in paragraphs 0059 to 0076 of International Publication No. 2016/181987, and compounds described in International Publication No. 2020/137819 can also be used. Thioaryl substituted benzotriazole UV absorbers described in The content of the ultraviolet absorber in the total solid content of the composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. The ultraviolet absorber may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Polymerization inhibitor＞＞ The colored composition of the first aspect can contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, pyrogallol, tertiary butylcatechol, benzoquinone, 4,4' -Thiobis(3-methyl-6-tertiary butylphenol), 2,2'-methylenebis(4-methyl-6-tertiary butylphenol), N-nitrosophenyl Hydroxylamine salts (ammonium salts, primary cerium salts, etc.). Among them, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the composition is preferably 0.0001 to 5% by mass. A polymerization inhibitor may be used only by 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Silane coupling agent＞＞ The coloring composition of the first aspect can contain a silane coupling agent. In the present invention, the silane coupling agent refers to a silane compound having a hydrolyzable group and other functional groups. Also, the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. As a hydrolyzable group, a halogen atom, an alkoxy group, an acyloxy group etc. are mentioned, for example, An alkoxy group is preferable. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. In addition, examples of functional groups other than hydrolyzable groups include vinyl groups, (meth)allyl groups, (meth)acryl groups, mercapto groups, epoxy groups, oxetanyl groups, amino groups, Urea group, thioether group, isocyanate group, phenyl group, etc., amine group, (meth)acryl group and epoxy group are preferred. Specific examples of the silane coupling agent include N-β-aminoethyl-γ-aminopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-602), N-β-aminoethyl-γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-603), N-β-aminoethyl-γ-amine propyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-602), γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-903), γ-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-903), 3-methacryloxypropylmethyldimethoxy 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-502), 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-502) 503) etc. Further, specific examples of the silane coupling agent include compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and compounds described in paragraphs 0056-0066 of JP-A-2009-242604 , which are incorporated into this manual. The content of the silane coupling agent in the total solid content of the composition is preferably 0.01 to 15.0% by mass, more preferably 0.05 to 10.0% by mass. A silane coupling agent may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Antioxidant＞＞ The coloring composition of the first aspect can contain an antioxidant. As an antioxidant, a phenolic compound, a phosphite compound, a thioether compound, etc. are mentioned. As the phenolic compound, any phenolic compound called a phenolic antioxidant can be used. A hindered phenol compound is mentioned as a preferable phenol compound. A compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position) is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable. Moreover, it is also preferable that an antioxidant is a compound which has a phenolic group and a phosphite group in the same molecule. Moreover, phosphorus antioxidant can also be used preferably as an antioxidant. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2] Dioxaphosphine-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tertiary butyldibenzo[d,f] [1,3,2]dioxaphosphine-2-yl)oxy]ethyl]amine, bis(2,4-di-tertiary butyl-6-methylphenyl) Ethyl phosphate etc. Examples of commercially available antioxidants include ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, ADK STAB AO-330 (the above are manufactured by ADEKA Corporation), etc. In addition, as an antioxidant, compounds described in paragraphs 0023 to 0048 of Patent No. 6268967, compounds described in International Publication No. 2017/006600, compounds described in International Publication No. 2017/164024, Korean A compound described in Publication Patent No. 10-2019-0059371. The content of the antioxidant in the total solid content of the composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Antioxidant may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Other ingredients＞＞ The coloring composition of the first aspect may contain sensitizers, fillers, thermosetting accelerators, plasticizers, and other additives (such as conductive particles, defoamers, flame retardants, leveling agents, peeling agents, etc.) Accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). Properties such as film physical properties can be adjusted by appropriately containing these components. Regarding these components, for example, reference can be made to the description in paragraph 0183 and subsequent paragraphs of Japanese Patent Application Publication No. 2012-003225 (corresponding to paragraph 0237 of US Patent Application Publication No. 2013/0034812), and paragraph 0101 of Japanese Patent Application Publication No. 2008-250074. ~0104, 0107~0109 paragraphs, etc., these contents are incorporated into this specification. Moreover, the coloring composition of the 1st aspect may contain a latent antioxidant as needed. As potential antioxidants, there can be mentioned compounds in which the part that acts as an antioxidant is protected by a protecting group, and the protecting group is heated at 100 to 250°C or heated at 80 to 200°C in the presence of an acid/alkali catalyst. A compound that decomposes upon heating and acts as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219. As a commercial item of a latent antioxidant, ADEKA ARKLS GPA-5001 (made by ADEKA CORPORATION) etc. are mentioned.

The coloring composition of the first aspect may contain a light resistance improving agent. Examples of light resistance improving agents include compounds described in paragraphs 0036 to 0037 of JP-A-2017-198787, compounds described in paragraphs 0029-0034 of JP-A-2017-146350, compounds described in JP-A-2017-146350, JP-A Compounds described in paragraphs 0036-0037, 0049-0052 of No. 2017-129774, compounds described in paragraphs 0031-0034, 0058-0059 of JP-A No. 2017-129674, JP-A No. 2017-122803 Compounds described in paragraphs 0036 to 0037 and 0051 to 0054 of the publication, compounds described in paragraphs 0025 to 0039 of International Publication No. 2017/164127, and paragraphs 0034 to 0047 of Japanese Patent Application Laid-Open No. 2017-186546 The compounds described in paragraphs 0019 to 0041 of JP-A-2015-025116, the compounds described in paragraphs 0101-0125 of JP-A-2012-145604, and the compounds described in JP-A-2012-103475 Compounds described in paragraphs 0018 to 0021, compounds described in paragraphs 0015 to 0018 of JP-A-2011-257591, compounds described in paragraphs 0017-0021 of JP-A-2011-191483, JP-A-2011-257591 Compounds described in paragraphs 0108 to 0116 of Unexamined Publication No. 2011-145668, compounds described in paragraphs 0103 to 0153 of Japanese Patent Application Laid-Open No. 2011-253174, and the like.

From the viewpoint of environmental regulation, the use of perfluoroalkanesulfonic acids and their salts and perfluoroalkylcarboxylic acids and their salts are sometimes regulated. In the composition of the present invention, when the content of the above-mentioned compounds is reduced, perfluoroalkylsulfonic acid (especially, perfluoroalkylsulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group) and salts thereof and perfluoroalkylcarboxylic acids (especially perfluoroalkylcarboxylic acids with 6 to 8 carbon atoms in the perfluoroalkyl group) and salts thereof in a content rate of 0.01ppb to 1,000ppb relative to the total solid content of the composition The range is preferable, the range of 0.05ppb to 500ppb is more preferable, and the range of 0.1ppb to 300ppb is still more preferable. The composition of the present invention may not substantially contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. For example, by using a compound that can be a substitute for perfluoroalkylsulfonic acid and its salt, and a compound that can be a substitute for perfluoroalkylcarboxylic acid and its salt, it is also possible to select a compound that does not substantially contain perfluoroalkylsulfonic acid. and their salts, and compositions of perfluoroalkylcarboxylic acids and their salts. Examples of compounds that can be substituted for regulated compounds include compounds that are excluded from regulated objects due to differences in the carbon number of perfluoroalkyl groups. However, the above-mentioned content does not prevent the use of perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. The composition of the present invention may also contain perfluoroalkylsulfonic acid and its salts and perfluoroalkylcarboxylic acid and its salts within the maximum allowable range.

[The composition of the second aspect] ＜＜Inorganic particles＞＞ The composition of the second aspect contains inorganic particles. Examples of inorganic particles include silica particles, titanium oxide particles, strontium titanate particles, barium titanate particles, zinc oxide particles, magnesium oxide particles, zirconia particles, alumina particles, barium sulfate particles, and aluminum hydroxide particles , calcium silicate particles, aluminum silicate particles, zinc sulfide particles, etc., silicon dioxide particles are preferred. A composition using silica particles as the inorganic particles can be preferably used as a composition for forming partition walls.

Examples of the silica particles include silica particles in the shape of a plurality of spherical silica connected in a bead shape, silica particles in the shape of a plurality of spherical silica connected in a plane, and silica particles of a hollow structure. Silica particles, solid silica particles, etc. Examples of commercially available solid silica particles include PL-2L-IPA (manufactured by FUSO CHEMICAL CO., LTD.).

Considering that it is easier to form a film with a lower refractive index, the silica particles are those in which a plurality of spherical silicas are connected in a bead shape, and those in which a plurality of spherical silicas are connected in a plane. Silica particles and silica particles with a hollow structure are preferred. Silica particles in the shape of a plurality of spherical silica connected in a bead shape and silica particles in a shape of a plurality of spherical silica connected in a plane Silicon particles are more preferred. Hereinafter, silica particles in which a plurality of spherical silicas are connected in a bead shape and silica particles in which a plurality of spherical silicas are connected in a plane are collectively referred to as beaded silica. Furthermore, the silica particles having a shape in which a plurality of spherical silicas are connected in a bead shape may have a shape in which a plurality of spherical silicas are connected in a plane.

In addition, in this specification, "spherical shape" in "spherical silica" means what is necessary is just to be substantially spherical, and includes the meaning which can deform within the range which exhibits the effect of this invention. For example, it also includes a shape having unevenness on the surface or a flat shape having a major axis in a predetermined direction. Also, "a plurality of spherical silicas connected in a bead shape" refers to a structure in which a plurality of spherical silicas are connected in a linear and/or branched chain. For example, as shown in FIG. 1 , a structure in which a plurality of spherical silica 1 is connected to each other by a joint portion 2 smaller than the outer diameter thereof can be mentioned. In addition, in the present invention, the structure "a plurality of spherical silicas connected in a bead shape" includes not only a structure in a form connected in a ring but also a structure in a chain form having an end. Also, "a plurality of spherical silicas connected in a plane" refers to a structure in which a plurality of spherical silicas are connected on substantially the same plane. Furthermore, "approximately the same plane" not only refers to the case of being on the same plane, but can also mean shifting up and down from the same plane. For example, it may shift up and down within the range of 50% or less of the particle diameter of spherical silica.

Regarding the beaded silica, the ratio D ₁ /D 2 of the average particle diameter D 1 measured by the dynamic light scattering method to the average particle diameter _{D 2} obtained by the following formula (1) is preferably 3 or _more . The upper limit of D ₁ /D ₂ is not particularly limited, but is preferably 1,000 or less, more preferably 800 or less, and still more preferably 500 or less. By setting D ₁ /D ₂ in such a range, favorable optical characteristics can be exhibited. Furthermore, the value of D ₁ /D ₂ in beaded silica is also an indicator of the connection degree of spherical silica. D ₂ =2720/S ･･･(1) In the formula, D ₂ is the average particle size of beaded silica in nm, S is the specific surface area of beaded silica measured by nitrogen adsorption method, The unit is m ² /g.

The above-mentioned average particle diameter _D2 of beaded silica can be regarded as an average particle diameter approximate to the primary particle of spherical silica. The average particle diameter D ₂ is preferably at least 1 nm, more preferably at least 3 nm, still more preferably at least 5 nm, and particularly preferably at least 7 nm. The upper limit is preferably 100 nm or less, more preferably 80 nm or less, still more preferably 70 nm or less, still more preferably 60 nm or less, and particularly preferably 50 nm or less.

The average particle diameter _D2 can be substituted by the equivalent circle diameter (D0) in the projection image of the spherical part measured by the transmission electron microscope (TEM). Unless otherwise specified, the average particle diameter based on the equivalent circle diameter is evaluated by the number average of 50 or more particles.

The aforementioned average particle diameter _D1 of the beaded silica can be regarded as the number average particle diameter of secondary particles formed by agglomerating a plurality of spherical silica. Therefore, the relationship of D ₁ >D ₂ usually holds. The average particle diameter _D1 is preferably at least 25 nm, more preferably at least 30 nm, and particularly preferably at least 35 nm. The upper limit is preferably not more than 1000 nm, more preferably not more than 700 nm, still more preferably not more than 500 nm, and particularly preferably not more than 300 nm.

Regarding the measurement of the above-mentioned average particle diameter _D1 of beaded silica, unless otherwise specified, a dynamic light scattering type particle size distribution measuring device (NANOTRAC Wave-EX150 [product name] manufactured by Nikkiso Co., Ltd.) was used. conduct. Proceed as follows. The dispersion liquid of beaded silica was divided into 20 ml sample bottles, and diluted with toluene to adjust the solid content concentration to 0.2% by mass. The diluted sample solution was irradiated with 40 kHz ultrasonic waves for 1 minute, and immediately used for the test. Data acquisition was performed 10 times at a temperature of 25° C. using a 2 ml quartz cell for measurement, and the obtained “number average” was defined as the average particle diameter. For other detailed conditions, etc., refer to the description of JISZ8828:2013 "Particle Size Analysis-Dynamic Light Scattering Method" as necessary. Five samples were produced per level, and the average value was adopted.

As for the beaded silica, it is preferable to connect a plurality of spherical silicas with an average particle diameter of 1 to 80 nm via a connecting material. The upper limit of the average particle diameter of spherical silica is preferably at most 70 nm, more preferably at most 60 nm, and still more preferably at most 50 nm. Also, the lower limit of the average particle diameter of spherical silica is preferably at least 3 nm, more preferably at least 5 nm, and still more preferably at least 7 nm. In addition, the value of the average particle diameter of spherical silica in the present invention uses the value of the average particle diameter obtained from the equivalent circle diameter in the projected image of the spherical portion measured by a transmission electron microscope (TEM). .

Examples of the connection material for connecting spherical silicas include silicon dioxide containing metal oxides. Examples of metal oxides include oxides of metals selected from Ca, Mg, Sr, Ba, Zn, Sn, Pb, Ni, Co, Fe, Al, In, Y, and Ti. Examples of the metal oxide-containing silicon dioxide include reactants, mixtures, and the like of these metal oxides and silicon dioxide (SiO ₂ ). Regarding the connection material, the description in International Publication No. 2000/015552 can be referred to, and the contents thereof are incorporated in this specification.

As the connection number of the spherical silica in the beaded silica, 3 or more are preferable, and 5 or more are more preferable. The upper limit is preferably 1,000 or less, more preferably 800 or less, and still more preferably 500 or less. The connection number of spherical silica can be measured by TEM.

As the beaded silica, a spherical silica surface-treated with hexamethyldisilazane or the like can be used.

Silica particles can be used in the state of particle liquid (sol). As a medium for dispersing silica particles, alcohols (for example, methanol, ethanol, isopropanol), ethylene glycol, glycol ethers (for example, propylene glycol monomethyl ether), glycol ether acetates (for example, , propylene glycol monomethyl ether acetate), etc. Moreover, solvent A1, solvent A2 etc. which are mentioned later can also be used. In the particle liquid (sol), the SiO ₂ concentration is preferably 5 to 40% by mass.

As the particle liquid of beaded silica, for example, a silica sol or the like described in Japanese Patent No. 4328935 can be used. In addition, the particle liquid (sol) of beaded silica can also use a commercial item. Examples include "SNOWTEX OUP", "SNOWTEX UP", "IPA-ST-UP", "SNOWTEX PS-M", "SNOWTEX PS-MO", and "SNOWTEX PS-S" manufactured by Nissan Chemical Industries, Ltd. , "SNOWTEX PS-SO", "Fine Kata Lloyd F-120" manufactured by Catalysts & Chemicals Industries Company, "Quartron PL" manufactured by FUSO CHEMICAL CO., LTD., etc.

Moreover, the particle liquid of the silica particle of a hollow structure can also use a commercial item. For example, "Thrylya 4110" by JGC Catalysts and Chemicals Ltd. etc. are mentioned.

The content of the inorganic particles in the composition is preferably at least 4% by mass, more preferably at least 6% by mass, and still more preferably at least 7% by mass. The upper limit is preferably at most 15% by mass, more preferably at most 13% by mass, and still more preferably at most 11% by mass. In addition, the content of the inorganic particles in the total solid content of the composition is preferably 20% by mass or more, more preferably 40% by mass or more, still more preferably 50% by mass or more, still more preferably 60% by mass or more, More than 70% by mass is particularly preferred. The upper limit may be 99.95 mass % or less, may be 99.9 mass % or less, may be 99 mass % or less, and may be 95 mass % or less.

When silica particles are used as the inorganic particles, the content of the silica particles in the composition is preferably at least 4% by mass, more preferably at least 6% by mass, and still more preferably at least 7% by mass. The upper limit is preferably at most 15% by mass, more preferably at most 13% by mass, and still more preferably at most 11% by mass. In addition, the content of silica particles in the total solid content of the composition is preferably at least 20% by mass, more preferably at least 40% by mass, still more preferably at least 50% by mass, and still more preferably at least 60% by mass. Good, more than 70% by mass is particularly good. The upper limit may be 99.95 mass % or less, may be 99.9 mass % or less, may be 99 mass % or less, and may be 95 mass % or less. As long as the content of the silica particles is within the above range, it is easy to obtain a film with a low refractive index, a high antireflection effect, and suppressed defects. In addition, when no pattern is formed or a pattern is formed by etching, the content of silicon dioxide particles in the total solid content of the composition is preferably high, for example, 95% by mass or more is preferred, and 97% by mass % or more is more preferable, and 99 mass % or more is still more preferable.

＜＜Polysiloxane Surfactant A (Specific Silicone Surfactant)＞＞ The composition of the second aspect contains the above-mentioned polysiloxane-based surfactant A (specific polysiloxane-based surfactant). Examples of the specific silicone-based surfactant include those described as the specific silicone-based surfactant that can be contained in the composition of the first aspect.

The content of the specific polysiloxane-based surfactant in the composition is preferably 1 to 1000 mass ppm. The lower limit is preferably at least 0.5 mass ppm, more preferably at least 1 mass ppm. The upper limit is preferably at most 750 mass ppm, more preferably at most 500 mass ppm.

＜＜Other surfactants＞＞ The composition of the second aspect may contain a surfactant (other surfactant) other than the specific polysiloxane-based surfactant. Examples of other surfactants include those described as other surfactants that can be contained in the composition of the first aspect.

The content of other surfactants in the composition is preferably at most 1000 mass ppm, more preferably at most 500 mass ppm, and still more preferably at most 250 mass ppm. The lower limit can be, for example, 1 mass ppm or more. Also, the content of other surfactants is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, and still more preferably 25 parts by mass or less, based on 100 parts by mass of the specific polysiloxane-based surfactant. The lower limit can be set to, for example, 1 part by mass or more. It is also preferable that the composition of the second aspect does not contain other surfactants.

＜＜Solvent＞＞ The composition of the second aspect contains a solvent. As a solvent, an organic solvent and water are mentioned, It is preferable to contain an organic solvent at least. Examples of organic solvents include aliphatic hydrocarbon-based solvents, halogenated hydrocarbon-based solvents, alcohol-based solvents, ether-based solvents, ester-based solvents, ketone-based solvents, nitrile-based solvents, amide-based solvents, ethylene-based solvents, aromatic Department of solvents, etc.

The content of the solvent in the composition is preferably 70 to 99% by mass. The upper limit is preferably at most 93% by mass, more preferably at most 92% by mass, and still more preferably at most 90% by mass. The lower limit is preferably at least 75% by mass, more preferably at least 80% by mass, and still more preferably at least 85% by mass. Only 1 type may be used for a solvent, and 2 or more types may be used. When using 2 or more types, it is preferable that these total amounts are in the said range.

When the composition of the second aspect contains silica particles, it is preferable to use solvent A1 including solvent A1 having a boiling point of not less than 190°C and not more than 280°C. In addition, in this specification, the boiling point of a solvent is a value at 1 atmospheric pressure (0.1 MPa).

The boiling point of the solvent A1 is preferably 200°C or higher, more preferably 210°C or higher, and more preferably 220°C or higher. In addition, the boiling point of the solvent A1 is preferably 270°C or lower, more preferably 265°C or lower.

The viscosity of the solvent A1 is preferably 10 mPa･s or less, more preferably 7 mPa･s or less, and more preferably 4 mPa･s or less. From the viewpoint of coatability, the lower limit of the viscosity of the solvent A1 is preferably at least 1.0 mPa·s, more preferably at least 1.4 mPa·s, and still more preferably at least 1.8 mPa·s.

The molecular weight of the solvent A1 is preferably at least 100, more preferably at least 130, still more preferably at least 140, and particularly preferably at least 150. From the viewpoint of coatability, the upper limit is preferably 300 or less, more preferably 290 or less, further preferably 280 or less, and particularly preferably 270 or less.

The solubility parameter of solvent A1 is 8.5-13.3 (cal/cm ³ ), ^0.5 is better. The upper limit is preferably 12.5 (cal/cm ³ ) ^0.5 or less, more preferably 11.5 (cal/cm ³ ) ^0.5 or less, and still more preferably 10.5 (cal/cm ³ ) ^0.5 or less. The lower limit is preferably 8.7 (cal/cm ³ ) ^0.5 or more, more preferably 8.9 (cal/cm ³ ) ^0.5 or more, and still more preferably 9.1 (cal/cm ³ ) ^0.5 or more. As long as the solubility parameter of the solvent A1 is within the above-mentioned range, high affinity with silica particles is obtained, and excellent coating properties are easily obtained. In addition, 1 (cal/cm ³ ) ^0.5 is 2.0455 MPa ^0.5 . In addition, the solubility parameter of a solvent is the value calculated by HSPiP.

In addition, in this specification, the solubility parameter of a solvent uses Hansen solubility parameter (Hansen solubility parameter). Specifically, the value calculated using the Hansen solubility parameter software "HSPiP 5.0.09" was used.

It is preferable that solvent A1 is an aprotic solvent. By using an aprotic solvent as the solvent A1, aggregation of silica particles during film formation can be more effectively suppressed.

The solvent A1 is preferably an ether-based solvent or an ester-based solvent, and more preferably an ester-based solvent. Moreover, it is preferable that the ester solvent used as solvent A1 is a compound which does not contain a hydroxyl group or a terminal alkoxy group.

From the viewpoint of obtaining high affinity with silica particles and easily obtaining excellent coatability, it is preferable that solvent A1 is at least one selected from alkylene glycol diacetate and cyclic carbonate . Examples of the alkylene glycol diacetate include propylene glycol diacetate, 1,4-butanediol diacetate, 1,3-butanediol diacetate, 1,6-hexanediol diacetate, Alcohol diacetate etc. Examples of the cyclic carbonate include propylene carbonate, ethylene carbonate, and the like.

Specific examples of solvent A1 include propylene carbonate (boiling point 240°C), ethylene carbonate (boiling point 260°C), propylene glycol diacetate (boiling point 190°C), dipropylene glycol methyl-n-propyl ether (boiling point 203°C), dipropylene glycol methyl ether acetate (boiling point 213°C), 1,4-butanediol diacetate (boiling point 232°C), 1,3-butanediol diacetate (boiling point 232°C), 1,6-hexanediol diacetate (boiling point 260°C), diethylene glycol monoethyl ether acetate (boiling point 217°C), diethylene glycol monobutyl ether acetate ( Boiling point 247°C), triacetin (boiling point 260°C), dipropylene glycol monomethyl ether (boiling point 190°C), diethylene glycol monoethyl ether (boiling point 202°C), dipropylene glycol monopropyl ether ( Boiling point 212°C), dipropylene glycol monobutyl ether (boiling point 229°C), tripropylene glycol monomethyl ether (boiling point 242°C), tripropylene glycol monobutyl ether (boiling point 274°C), etc.

The solvent used in the composition of the second aspect contains preferably at least 3% by mass of the solvent A1, more preferably at least 4% by mass, and still more preferably at least 5% by mass. According to this aspect, the effects of the present invention described above can be easily and remarkably obtained. The upper limit is preferably at most 20% by mass, more preferably at most 15% by mass, and still more preferably at most 12% by mass. According to this aspect, it is easy to obtain a film with good surface properties. Solvent A1 may be used only by 1 type, and may use 2 or more types together. When the composition of the second aspect contains two or more solvents A1, it is preferable that the sum total is within the above-mentioned range.

It is preferable that the solvent used for the composition of 2nd aspect further contains the solvent A2 whose boiling point is 110 degreeC or more and less than 190 degreeC. According to this aspect, it is possible to moderately improve the drying property of the composition, effectively suppress the generation of wavy coating unevenness, and easily form a film with a good planar shape.

The boiling point of the solvent A2 is preferably 115°C or higher, more preferably 120°C or higher, and more preferably 130°C or higher. In addition, the boiling point of the solvent A2 is preferably 170°C or lower, more preferably 150°C or lower. If the boiling point of solvent A2 is in the said range, it will become easy to acquire the said effect more notably.

The molecular weight of the solvent A2 is preferably at least 100, more preferably at least 130, still more preferably at least 140, and particularly preferably at least 150, for the reason that the above-mentioned effect can be more significantly obtained. From the viewpoint of coatability, the upper limit is preferably 300 or less, more preferably 290 or less, further preferably 280 or less, and particularly preferably 270 or less.

The solubility parameter of solvent A2 is 9.0-11.4 (cal/cm ³ ), preferably ^0.5 . The upper limit is preferably 11.0 (cal/cm ³ ) ^0.5 or less, more preferably 10.6 (cal/cm ³ ) ^0.5 or less, and still more preferably 10.2 (cal/cm ³ ) ^0.5 or less. The lower limit is preferably 9.2 (cal/cm ³ ) ^0.5 or higher, more preferably 9.4 (cal/cm ³ ) ^0.5 or higher, and still more preferably 9.6 (cal/cm ³ ) ^0.5 or higher. As long as the solubility parameter of the solvent A2 is within the above-mentioned range, high affinity with silica particles is obtained, and excellent coating properties are easily obtained. Also, the absolute value of the difference between the solubility parameter of solvent A1 and the solubility parameter of solvent A2 is preferably 0.01 to 1.1 (cal/cm ³ ) ^0.5 . The upper limit is preferably 0.9 (cal/cm ³ ) to ^0.5 or less, more preferably 0.7 (cal/cm ³ ) to ^0.5 or less, still more preferably 0.5 (cal/cm ³ ) to ^0.5 or less. The lower limit is preferably 0.03 (cal/cm ³ ) ^0.5 or more, more preferably 0.05 (cal/cm ³ ) ^0.5 or more, and still more preferably 0.08 (cal/cm ³ ) ^0.5 or more.

Solvent A2 is preferably at least one selected from ether-based solvents and ester-based solvents, more preferably includes at least an ester-based solvent, and further preferably includes an ether-based solvent and an ester-based solvent. Specific examples of solvent A2 include cyclohexanol acetate (boiling point 173°C), dipropylene glycol dimethyl ether (boiling point 175°C), butyl acetate (boiling point 126°C), ethylene glycol monomethyl ether Acetate (boiling point 145°C), propylene glycol monomethyl ether acetate (boiling point 146°C), 3-methoxybutyl acetate (boiling point 171°C), propylene glycol monomethyl ether (boiling point 120°C), 3 -Methoxybutanol (boiling point 161°C), propylene glycol monopropyl ether (boiling point 150°C), propylene glycol monobutyl ether (boiling point 170°C), ethylene glycol monobutyl ether acetate (boiling point 188°C), etc. , it is preferable to contain at least propylene glycol monomethyl ether acetate in order to obtain high affinity with silica particles and to easily obtain excellent coatability.

When the solvent used for the photosensitive composition of a 2nd aspect contains solvent A2, it is preferable that content of solvent A2 is 500-5000 mass parts with respect to 100 mass parts of solvent A1. The upper limit is preferably at most 4500 parts by mass, more preferably at most 4000 parts by mass, and further preferably at most 3500 parts by mass. The lower limit is preferably at least 600 parts by mass, more preferably at least 700 parts by mass, and still more preferably at least 750 parts by mass. Also, the content of the solvent A2 in the total amount of solvents is preferably at least 50% by mass, more preferably at least 60% by mass, and still more preferably at least 70% by mass. The upper limit is preferably at most 95% by mass, more preferably at most 90% by mass, and still more preferably at most 85% by mass. When content of solvent A2 exists in the said range, the effect of this invention becomes easy to acquire more notably. Solvent A2 may be used only by 1 type, and may use 2 or more types together. When the composition of the second aspect contains two or more solvents A2, it is preferable that the sum total is within the above-mentioned range.

Also, the solvent used in the composition of the second aspect preferably contains a total of 62% by mass or more of solvent A1 and solvent A2, more preferably 72% by mass or more, and still more preferably 82% by mass or more. The upper limit may be 100 mass %, may be 96 mass % or less, and may be 92 mass % or less.

It is also preferable that the solvent used in the composition of the second aspect further contains at least one solvent A3 selected from methanol, ethanol, and 2-propanol. According to this aspect, high affinity with silica particles is obtained and excellent coatability is easily obtained. When the solvent used in the composition of the second aspect further contains solvent A3, the content of solvent A3 in the total amount of solvents is preferably 0.1 to 10% by mass. The upper limit is preferably at most 8% by mass, more preferably at most 6% by mass, and still more preferably at most 4% by mass. The lower limit is preferably at least 0.3% by mass, more preferably at least 0.5% by mass, and still more preferably at least 1% by mass. When the content of the solvent A3 is within the above-mentioned range, the above-mentioned effects are more likely to be obtained more remarkably. Solvent A3 may be used only by 1 type, and may use 2 or more types together. When the composition contains two or more solvents A3, it is preferable that the total is within the above-mentioned range.

It is also preferable that the solvent used in the composition of the second aspect further contains water. According to this aspect, high affinity with silica particles is obtained and excellent coatability is easily obtained. When the solvent used in the composition of the second aspect further contains water, the content of water in the total amount of the solvent is preferably 0.1 to 5% by mass. The upper limit is preferably at most 4% by mass, more preferably at most 2.5% by mass, and still more preferably at most 1.5% by mass. The lower limit is preferably at least 0.3% by mass, more preferably at least 0.5% by mass, and still more preferably at least 1.0% by mass. When the water content is within the above range, the above effects are more likely to be obtained more remarkably.

It is also preferable that the solvent used in the composition of the second aspect contains the above-mentioned solvent A3 and water. Obtains high affinity with silica particles and easily obtains excellent coatability. When the solvent used in the composition of the second aspect contains solvent A3 and water, the total content of solvent A3 and water in the total amount of solvents is preferably 0.2 to 15% by mass. The upper limit is preferably at most 12% by mass, more preferably at most 9% by mass, and still more preferably at most 6% by mass. The lower limit is preferably at least 0.4% by mass, more preferably at least 0.7% by mass, and still more preferably at least 1.5% by mass. If the total content of the solvent A3 and water is within the above-mentioned range, it is easy to obtain the above-mentioned effect more remarkably.

The solvent used in the composition of the second aspect may further contain solvent A4 having a boiling point exceeding 280°C. According to this aspect, it is possible to moderately improve the drying property of the composition, effectively suppress the generation of wavy coating unevenness, and easily form a film with a good planar shape. The upper limit of the boiling point of solvent A4 is preferably 400°C or lower, more preferably 380°C or lower, and still more preferably 350°C or lower. The solvent A4 is preferably at least one selected from ether solvents and ester solvents. Specific examples of the solvent A4 include polyethylene glycol monomethyl ether and the like. When the solvent used in the composition of the second aspect further contains solvent A4, the content of solvent A4 in the total amount of solvents is preferably 0.5 to 15% by mass. The upper limit is preferably at most 10% by mass, more preferably at most 8% by mass, and still more preferably at most 6% by mass. The lower limit is preferably at least 1% by mass, more preferably at least 1.5% by mass, and still more preferably at least 2% by mass. Moreover, it is also preferable that the solvent used for the composition of a 2nd aspect does not contain solvent A4 substantially. In addition, substantially not containing solvent A4 means that the content of solvent A4 in the total amount of solvents is 0.1% by mass or less, preferably 0.05% by mass or less, more preferably 0.01% by mass or less, and still more preferably not contained.

The solvent used in the composition of the second aspect may contain the above-mentioned solvent A1, solvent A2, solvent A3, solvent A4 and solvents other than water (other solvents), and it is preferable not to contain other solvents substantially. In addition, substantially not containing other solvents means that the content of other solvents in the total amount of solvents is 0.1% by mass or less, preferably 0.05% by mass or less, still more preferably 0.01% by mass or less, and is still more preferably not contained.

Regarding the solvent used in the composition of the second aspect, the content of the compound having a molecular weight (weight average molecular weight in the case of a polymer) exceeding 300 is preferably 10% by mass or less, more preferably 8% by mass or less, 5% by mass or less is more preferred, 3% by mass or less is still more preferred, and 1% by mass or less is particularly preferred. According to this aspect, it is easy to obtain a film with more excellent applicability and an excellent planar shape.

Regarding the solvent used in the composition of the second aspect, the content of the compound whose viscosity at 25°C exceeds 10 mPa･s is preferably 10 mass % or less, more preferably 8 mass % or less, and 5 mass % or less More preferably, 3% by mass or less is still more preferred, and 1% by mass or less is particularly preferred. According to this aspect, it is easy to obtain a film with more excellent applicability and an excellent planar shape.

＜＜Hardening compound＞＞ The composition of the second aspect may contain a curable compound. Examples of the curable compound include materials such as resins and polymerizable monomers described as curable compounds that can be contained in the composition of the first aspect. It is preferable that the hardening compound contains resin.

The content of the curable compound in the composition is preferably at least 0.01% by mass, more preferably at least 0.05% by mass, and still more preferably at least 0.1% by mass. The upper limit is preferably at most 10% by mass, more preferably at most 5% by mass, and still more preferably at most 3% by mass. Also, the content of the curable compound in the total solid content of the composition is preferably at least 0.1% by mass, more preferably at least 0.5% by mass, and still more preferably at least 1% by mass. The upper limit is preferably at most 30% by mass, more preferably at most 20% by mass, and still more preferably at most 10% by mass. A curable compound may be used only by 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range. It is also preferable that the composition of the second aspect does not contain a polymerizable monomer. According to this aspect, it is easy to form a film with a lower refractive index. In addition, it is easy to form a film with a small haze.

＜＜Photopolymerization Initiator＞＞ The composition of the second aspect can contain a photopolymerization initiator. As a photoinitiator, what was demonstrated as the photoinitiator which can be contained in the composition of a 1st aspect is mentioned.

The content of the photopolymerization initiator in the composition is preferably at least 0.1% by mass, more preferably at least 0.2% by mass, and still more preferably at least 0.5% by mass. The upper limit is preferably at most 10% by mass, more preferably at most 5% by mass, and more preferably at most 3% by mass. Also, the content of the photopolymerization initiator in the total solid content of the composition is preferably at least 1% by mass, more preferably at least 2% by mass, and still more preferably at least 5% by mass. The upper limit is preferably at most 30% by mass, more preferably at most 25% by mass, and more preferably at most 20% by mass. A photoinitiator may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range. It is also preferable that the composition of the second aspect does not contain a photopolymerization initiator. According to this aspect, it is easy to form a film with a lower refractive index. In addition, it is easy to form a film with a small haze.

＜＜Silane coupling agent＞＞ The composition of the second aspect may contain a silane coupling agent. Examples of the silane coupling agent include those described as the silane coupling agent that can be contained in the composition of the first aspect.

The content of the silane coupling agent in the total solid content of the composition is preferably at least 0.001% by mass, more preferably at least 0.01% by mass, and most preferably at least 0.1% by mass. The upper limit is preferably at most 20% by mass, more preferably at most 10% by mass, and most preferably at most 5% by mass. A silane coupling agent may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range. It is preferable that the composition of the second aspect does not contain a silane coupling agent.

＜＜Black color material＞＞ The composition of the second aspect can contain a black color material. Examples of the black coloring material include those described as the black coloring material that can be contained in the composition of the first aspect.

The content of the black color material in the total solid content of the composition is preferably 10% by mass or less, more preferably 5% by mass or less, and most preferably 1% by mass or less. It is also preferable that the composition of the second aspect does not substantially contain a black color material. Furthermore, when the composition does not substantially contain a black color material, it means that the content of the black color material in the total solid content of the composition is 0.1% by mass or less, preferably 0.05% by mass or less, and it is more preferable not to contain a black color material. good.

＜＜Color material＞＞ The composition of the second aspect can contain a color material. Examples of the color material include those described as the color material that can be contained in the composition of the first aspect.

The content of the coloring material in the total solid content of the composition is preferably 10% by mass or less, more preferably 5% by mass or less, and most preferably 1% by mass or less. It is also preferable that the composition of the second aspect does not contain a color material substantially. Furthermore, the fact that the composition does not substantially contain a coloring material means that the content of the coloring material in the total solid content of the composition is 0.1% by mass or less, preferably 0.05% by mass or less, and it is more preferable not to contain a coloring material. good.

＜＜Other ingredients＞＞ The composition of the second aspect may contain ultraviolet absorbers, antioxidants, latent antioxidants, polymerization inhibitors, sensitizers, fillers, thermosetting accelerators, plasticizers, and other additives (for example, conductive particles) as needed. , defoamer, flame retardant, leveling agent, peeling accelerator, fragrance, surface tension regulator, chain transfer agent, etc.). Examples of these materials include the materials described as those that can be contained in the composition of the above-mentioned first aspect.

＜Containment container＞ The container for the composition of the present invention is not particularly limited, and known containers can be used. In addition, as a storage container, for the purpose of preventing impurities from mixing into raw materials or colored compositions, it is also preferable to use a multi-layer bottle whose inner wall is formed of 6 types of 6-layer resins or a bottle with 6 types of resins in a 7-layer structure. As such a container, the container described in Unexamined-Japanese-Patent No. 2015-123351 is mentioned, for example. In addition, it is also preferable that the inner wall of the container is made of glass or stainless steel for the purpose of preventing elution of metal from the inner wall of the container, improving the storage stability of the composition, or suppressing deterioration of the components.

＜Manufacturing method of the composition＞ The composition of the present invention can be produced by mixing the aforementioned components. When producing a composition, all the components can be dissolved and/or dispersed in a solvent at the same time to produce the composition, and each component can be appropriately used as two or more solutions or dispersions as needed (at the time of coating) These are mixed to produce a composition.

Also, it is preferable to include a process of dispersing the pigment when manufacturing the composition. Examples of the mechanical force used to disperse the pigment in the process of dispersing the pigment include compression, extrusion, impact, shearing, cavitation, and the like. Specific examples of these processes include bead milling, sand milling, roller milling, ball milling, paint stirring, micro jets, high-speed impellers, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, and the like. In addition, in pulverization of pigments under sand milling (bead milling), it is preferable to perform treatment under the conditions that the pulverization efficiency can be improved by using small-diameter beads and increasing the filling rate of the microbeads. Moreover, it is preferable to remove coarse particles by filtration, centrifugation, etc. after pulverization. Also, regarding the process and dispersing machine for dispersing pigments, it is preferable to use "Compendium of Dispersion Technology, published by JOHOKIKO CO., LTD., July 15, 2005" or "Use Suspension (solid/liquid dispersion system) Dispersion technology and industrial practical application comprehensive data collection centered on it, issued by the publishing department of the Management Development Center, October 10, 1978", the process and dispersion machine recorded in paragraph 0022 of Japanese Patent Application Laid-Open No. 2015-157893. In addition, in the process of dispersing the pigment, it is possible to carry out the micronization treatment of the particles by the salt milling step. For raw materials, equipment, processing conditions and the like used in the salt milling step, for example, reference can be made to the descriptions in JP-A-2015-194521 and JP-A-2012-046629. As microbeads for dispersion, zirconia, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, aluminum oxide, stainless steel, glass or combinations thereof can be used. Moreover, the inorganic compound whose Mohs' hardness is 2 or more can be used. The above microbeads may be contained in the composition at 1 to 10000 ppm.

When producing the composition of the present invention, it is preferable to filter the composition with a filter in order to remove impurities, reduce defects, and the like. As a filter, if it is a filter conventionally used for a filtration use etc., it can use without limitation in particular. For example, fluorine resins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide-based resins such as nylon (such as nylon-6, nylon-6,6), polyethylene, polypropylene, etc. (PP) and other polyolefin resins (including high-density, ultra-high molecular weight polyolefin resins) and other materials. Among these materials, polypropylene (including high density polypropylene) and nylon are preferred.

The pore size of the filter is preferably from 0.01 to 7.0 μm, more preferably from 0.01 to 3.0 μm, and still more preferably from 0.05 to 0.5 μm. As long as the pore size of the filter is within the above range, fine impurities can be removed more reliably. For the pore diameter value of the filter, you can refer to the nominal value of the filter manufacturer. As for the filter, various filters provided by NIHON PALL Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), KITZ MICROFILTER Corporation, etc. can be used.

Moreover, it is also preferable to use a fibrous filter material as a filter. As a fibrous filter medium, a polypropylene fiber, a nylon fiber, a glass fiber etc. are mentioned, for example. Examples of commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by ROKI TECHNO CO., LTD.

When using filters, it is possible to combine different filters (for example, 1st filter and 2nd filter, etc.). In this case, the filtration by each filter may be performed only once, or may be performed two or more times. Also, filters with different pore diameters may be combined within the above range. Moreover, it is also possible to perform filtration with the 1st filter only for a dispersion liquid, and to filter with a 2nd filter after mixing other components. In addition, the filter can be appropriately selected according to the hydrophilicity/hydrophobicity of the composition.

＜Film＞ The film of the present invention is a film obtained from the above-mentioned composition of the present invention. The film of the present invention can be used for filters such as color filters, near-infrared transmission filters, and near-infrared cut filters. Moreover, the film of this invention can also be used for a light-shielding film, a partition, etc.

The film thickness of the film of the present invention can be appropriately adjusted depending on the purpose. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and still more preferably 5 μm or less. The lower limit of the film thickness is preferably at least 0.1 μm, more preferably at least 0.2 μm, and still more preferably at least 0.3 μm.

When the film of the present invention is used as a color filter, it is preferable that the film of the present invention has a hue of green, red, blue, cyan, magenta, or yellow. Also, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

When the film of the present invention is used as a near-infrared cut filter, it is preferable that the maximum absorption wavelength of the film of the present invention exists within a wavelength range of 700 to 1800 nm, more preferably within a wavelength range of 700 to 1300 nm. , It is still more preferable to exist in the range of wavelength 700-1100nm. In addition, the transmittance of the film is preferably 70% or higher in the entire wavelength range of 400 to 650 nm, more preferably 80% or higher, and still more preferably 90% or higher. In addition, it is preferable that the transmittance of the film is 20% or less in at least one point in the wavelength range of 700 to 1800 nm. In addition, the ratio of the absorbance A _max at the maximum absorption wavelength to the absorbance A ₅₅₀ at a wavelength of 550 nm, that is, the absorbance A _max /absorbance A ₅₅₀ is preferably 20 to 500, more preferably 50 to 500, and further 70 to 450. Good, 100-400 is especially good.

When the film of the present invention is used as a near-infrared ray transmission filter, it is preferable that the film of the present invention has any one of the following spectral characteristics (i1) to (i5), for example. (i1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 800 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 640 nm and transmit light exceeding the wavelength of 750 nm. (i2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 900 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 750 nm and transmit light exceeding the wavelength of 850 nm. (i3): The maximum value of the transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1000 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 830 nm and transmit light exceeding the wavelength of 950 nm. (i4): The maximum value of the transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1100 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 950 nm and transmit light exceeding the wavelength of 1050 nm. (i5): The maximum value of the transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1200 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 1050 nm and transmit light exceeding the wavelength of 1150 nm.

When the film of the present invention is used as a light-shielding film, the optical density (OD: Optical Density) per 1.5 μm film thickness of the film in the wavelength region of 400 to 1100 nm is preferably 2.5 or more, more preferably 3.0 or more . The upper limit is not particularly limited, but usually 10 or less is preferable. Moreover, the reflectance of the said film is preferably less than 8%, more preferably less than 6%, and still more preferably less than 4%. The lower limit is preferably 0% or more.

The shading film can be used in portable devices such as personal computers, tablets, mobile phones, smart phones and digital cameras; OA (Office Automation) equipment such as printing copiers and scanners; surveillance cameras, barcode readers, automatic Industrial equipment such as automated teller machines (ATM: automated teller machine), high-speed cameras, and equipment with personal authentication functions using face image recognition or biometrics; vehicle-mounted camera equipment; endoscopes, capsule endoscopes, and catheters, etc. Medical camera equipment; as well as biometric sensors, biosensors, cameras for military reconnaissance, cameras for three-dimensional maps, cameras for meteorological and ocean observation, cameras for land resource exploration, space astronomy and deep space Target detection cameras and other space equipment; filters and modules used in them. In addition, the light-shielding film can also be used for applications such as micro LEDs (Light Emitting Diodes, light emitting diodes) and micro OLEDs (Organic Light Emitting Diodes, organic light emitting diodes). Examples of micro LEDs and micro OLEDs include those described in JP-A-2015-500562 and JP-A-2014-533890. In addition, the light-shielding film can also be used for quantum dot sensors. Examples of quantum dot sensors include those described in US Patent Application Publication No. 2012/37789 and International Publication No. 2008/131313.

When the film of the present invention is used as a partition wall, the film of the present invention has a refractive index of light having a wavelength of 633 nm of preferably 1.4 or less, more preferably 1.35 or less, still more preferably 1.3 or less, and still more preferably 1.27 or less. better. In addition, the value of the said refractive index is the value in measurement temperature 25 degreeC.

＜Membrane manufacturing method＞ The film of the present invention can be produced through the step of applying the composition of the present invention to a support. In the film manufacturing method, it is preferable to further include a step of forming a pattern. As a pattern forming method, a photolithography method and a dry etching method are mentioned, and a photolithography method is preferable.

The pattern formation based on the photolithography method preferably includes the following steps: a step of using the composition of the present invention to form a composition layer on a support; a step of exposing the composition layer in a pattern; and developing to remove the unfinished composition layer The step of exposing the part to form a pattern. If necessary, a step of baking the composition layer (pre-baking step) and a step of baking the developed pattern (post-baking step) may also be provided.

In the step of forming the composition layer, the composition layer of the present invention is used to form the composition layer on the support. There are no particular limitations on the support, and it can be appropriately selected depending on the application. For example, a glass substrate, a silicon substrate, etc. are mentioned, and a silicon substrate is preferable. In addition, a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, and the like may be formed on the silicon substrate. In addition, a black matrix is sometimes formed on a silicon substrate to isolate each pixel. In addition, in order to improve the adhesion with the upper layer, prevent the diffusion of substances, or planarize the surface of the substrate, a base layer may be provided on the silicon substrate.

As a coating method of the composition, known methods can be used. For example, there may be mentioned dropping method (drip casting); slit coating method; spray method; roll coating method; spin coating method (spin coating); , the method described in Japanese Patent Laid-Open No. 2009-145395); inkjet (such as on-demand method, piezoelectric method, thermal method), nozzle jetting and other jetting printing, flexographic printing, screen printing, gravure printing, Various printing methods such as reverse offset printing and metal mask printing; transfer printing using a mold, etc.; nanoimprinting, etc. The application method in inkjet is not particularly limited, for example, "Inkjet that can be promoted and used - infinite possibilities in the patent -, issued in February 2005, Sumitbe Techon Research Co., Ltd." The method shown (especially pages 115 to 133) or Japanese Patent Application Publication No. 2003-262716, Japanese Patent Application Publication No. 2003-185831, Japanese Patent Application Publication No. 2003-261827, Japanese Patent Application Publication No. 2012-126830, The method described in Japanese Unexamined Patent Application Publication No. 2006-169325 and the like. In addition, regarding the coating method of the composition, the descriptions of International Publication No. 2017/030174 and International Publication No. 2017/018419 can be referred to, and these contents are incorporated in this specification.

The composition layer formed on the support may be dried (prebaked). In the case of producing a film by a low-temperature process, pre-baking may not be performed. In the case of prebaking, the prebaking temperature is preferably 150° C. or lower, more preferably 120° C. or lower, and still more preferably 110° C. or lower. The lower limit may be, for example, 50° C. or higher, or may be 80° C. or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and still more preferably 80 to 220 seconds. Prebaking can be performed with a hot plate, an oven, or the like.

Next, the composition layer is exposed in a pattern (exposure step). For example, by exposing the composition layer through a mask having a predetermined mask pattern using a stepper, a scanning exposure machine, etc., it is possible to expose in a pattern form. Thereby, the exposed part can be cured.

Examples of radiation (light) that can be used for exposure include g-rays, i-rays, and the like. In addition, light having a wavelength of 300 nm or less (preferably light having a wavelength of 180 to 300 nm) can also be used. Examples of light having a wavelength of 300 nm or less include KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), and KrF rays (wavelength: 248 nm) are preferred. In addition, a light source with a long wavelength of 300 nm or more can also be used.

In addition, at the time of exposure, exposure may be performed by continuously irradiating light, or may be performed by pulsed irradiation (pulse exposure). In addition, the pulse exposure is an exposure method in which light is irradiated and paused repeatedly in a cycle of a short time (eg, millisecond order or less) to perform exposure.

The amount of irradiation (exposure amount) is, for example, preferably 0.03 to 2.5 J/cm ² , more preferably 0.05 to 1.0 J/cm ² . The oxygen concentration at the time of exposure can be appropriately selected. In addition to performing in the atmosphere, for example, it can be performed in a low-oxygen environment with an oxygen concentration of 19% by volume or less (for example, 15% by volume, 5% by volume, or substantially no oxygen). Exposure may be performed under a high oxygen environment (for example, 22 volume %, 30 volume % or 50 volume %) with an oxygen concentration exceeding 21 volume %. In addition, the exposure illuminance can be appropriately set, and usually can be selected from the range of 1000 W/m ² to 100000 W/m ² (for example, 5000 W/m ² , 15000 W/m ² or 35000 W/m ² ). The conditions of oxygen concentration and exposure illuminance can be appropriately combined, for example, an oxygen concentration of 10 vol % and an illuminance of 10000 W/m ² , an oxygen concentration of 35 vol % and an illuminance of 20000 W/m ² , etc. can be set.

Next, unexposed portions of the composition layer are removed by development to form a pattern. The development and removal of the unexposed portion of the composition layer can be performed using a developer. Thereby, the composition layer of the unexposed part in the exposure step is dissolved in the developing solution, and only the photohardened part remains. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, in order to improve the residue removal performance, the step of shaking off the developing solution every 60 seconds and supplying a new developing solution may be repeated several times.

As a developing solution, an organic solvent, an alkali developing solution, etc. are mentioned, and an alkali developing solution can be used preferably. As the alkaline developing solution, an alkaline aqueous solution (alkali developing solution) obtained by diluting the alkaline agent with pure water is preferable. Examples of alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylhydrogen Ammonium Oxide, Tetrapropylammonium Hydroxide, Tetrabutylammonium Hydroxide, Ethyltrimethylammonium Hydroxide, Benzyltrimethylammonium Hydroxide, Dimethylbis(2-Hydroxyethyl)ammonium Hydroxide, Choline, pyrrole, piperidine, 1,8-diazabicyclo-[5.4.0]-7-undecene and other organic basic compounds or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, Sodium silicate, sodium metasilicate and other inorganic alkaline compounds. In terms of environment and safety, the alkali agent is preferably a compound with a large molecular weight. The concentration of the alkaline agent in the alkaline aqueous solution is preferably from 0.001 to 10% by mass, more preferably from 0.01 to 1% by mass. In addition, the developer may further contain a surfactant. From the viewpoint of convenient transportation and storage, the developer solution can be temporarily made into a concentrated solution and diluted to a desired concentration when used. The dilution ratio is not particularly limited, and can be set, for example, within a range of 1.5 to 100 times. Moreover, it is also preferable to wash (rinse) with pure water after image development. In addition, rinsing is preferably performed by supplying a rinsing liquid to the developed composition layer while rotating the support on which the developed composition layer is formed. Moreover, it is also preferable to carry out by moving the nozzle which discharges a rinse liquid from the center part of a support body to the peripheral part of a support body. At this time, when moving from the central part of the support body of the nozzle to the peripheral part, the moving speed of the nozzle may be gradually reduced while moving. By performing rinsing in this manner, in-plane variation in rinsing can be suppressed. Also, the same effect can be obtained by gradually reducing the rotational speed of the support while moving the nozzle from the center portion of the support to the peripheral portion.

After image development, it is preferable to perform additional exposure processing and heat processing (post-baking) after performing drying. Additional exposure treatment and post-baking are hardening treatments after development to make fully hardened ones. The heating temperature in the post-baking is, for example, preferably 100 to 240°C, more preferably 200 to 240°C. The film after development can be post-baked continuously or intermittently using a heating mechanism such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater so as to meet the above conditions. When performing an additional exposure process, it is preferable that the light used for exposure is light of wavelength 400nm or less. In addition, the additional exposure treatment can be performed by the method described in Korean Laid-Open Patent No. 10-2017-0122130.

It is preferable to form a pattern by dry etching including the following steps: using the composition of the present invention to form a composition layer on a support, and hardening the entire composition layer to form a hardened layer; A step of forming a photoresist layer on top of the photoresist layer; a step of developing a resist pattern after exposing the photoresist layer in a pattern; and performing dry etching on the hardened layer with the resist pattern as a mask and using an etching gas step. When forming the photoresist layer, it is better to further perform pre-baking treatment. In particular, as a formation process of the photoresist layer, a form in which heat treatment after exposure and heat treatment after development (post-baking treatment) are performed is preferable. Regarding the formation of the pattern by the dry etching method, the description in paragraphs 0010 to 0067 of JP-A-2013-064993 can be referred to, and the content is incorporated in this specification.

<structure> Next, the structural body of the present invention will be described using the drawings. FIG. 2 is a side sectional view showing one embodiment of the structure of the present invention, and FIG. 3 is a plan view viewed from directly above a support in the same structure. As shown in FIG. 2 and FIG. 3 , the structure 100 of the present invention has a support 11 , a partition 12 disposed on the support 11 , and pixels 14 disposed on the support 11 and divided by the partition 12 . Examples of the pixels include colored pixels, transparent pixels, pixels of a near-infrared ray transmission filter layer, pixels of a near-infrared ray cut filter layer, and the like. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

In the structured body of the present invention, the type of support body 11 is not particularly limited. Substrates (silicon wafers, silicon carbide wafers, silicon carbide wafers, sapphire wafers, glass wafers, etc.) used in various electronic devices such as solid-state imaging devices can be used. Moreover, the board|substrate for solid-state imaging devices etc. which formed the photodiode can also be used. In addition, an undercoat layer may be provided on these substrates as needed, and the undercoat layer is used for improving adhesion with upper layers, preventing diffusion of substances, or flattening the surface.

As shown in FIGS. 2 and 3 , partition walls 12 are formed on the support body 11 . In this embodiment, as shown in FIG. 3 , partition walls 12 are formed in a lattice shape in a plan view viewed from directly above the support body 11 . Furthermore, in this embodiment, the shape of the region divided by the partition wall 12 on the support body 11 (hereinafter also referred to as the shape of the opening of the partition wall) is a square, but the shape of the opening of the partition wall is not particularly limited. , such as a rectangle, a circle, an ellipse, or a polygon.

The partition walls 12 can be formed using the composition of the present invention (preferably the composition of the second aspect). Specifically, it can be formed through the step of forming a composition layer using the composition of the present invention and the step of patterning the composition layer by photolithography or dry etching.

The width W1 of the partition wall 12 is preferably 20 to 500 nm. The lower limit is preferably at least 30 nm, more preferably at least 40 nm, and still more preferably at least 50 nm. The upper limit is preferably 300 nm or less, more preferably 200 nm or less, and still more preferably 100 nm or less. Moreover, the height H1 of the partition wall 12 is preferably 200 nm or more, more preferably 300 nm or more, and still more preferably 400 nm or more. The upper limit is preferably not more than the thickness of the pixel 14×200%, more preferably not more than the thickness of the pixel 14×150%, and is still more preferably substantially the same as the thickness of the pixel 14. The ratio (height/width) of the height and width of the partition wall 12 is preferably 1-100, more preferably 5-50, and still more preferably 5-30.

Pixels 14 are formed on the support body 11 and in regions (openings of the partition walls) partitioned by the partition walls 12 .

The width L1 of the pixel 14 can be appropriately selected depending on the application. For example, 500-2000 nm is preferable, 500-1500 nm is more preferable, and 500-1000 nm is still more preferable. The height (thickness) H2 of the pixel 14 can be appropriately selected according to the application. For example, 300-1000 nm is preferable, 300-800 nm is more preferable, and 300-600 nm is still more preferable. Moreover, the height H2 of the pixel 14 is preferably 50 to 150% of the height H1 of the partition wall 12, more preferably 70 to 130%, and still more preferably 90 to 110%.

In the structured body of the present invention, it is also preferable that a protective layer is provided on the surface of the partition wall. By providing a protective layer on the surface of the partition wall 12, the adhesiveness between the partition wall 12 and the pixel 14 can be improved. As a material of the protective layer, various inorganic materials or organic materials can also be used. Examples of organic materials include acrylic resins, polystyrene resins, polyimide resins, organic SOG (Spin On Glass) resins, and the like. In addition, it can also be formed using a composition containing a compound having an ethylenically unsaturated bond-containing group.

The structural body of the present invention can be preferably used as an optical filter, an optical sensor, an image display device, and the like.

＜Filter＞ The optical filter of the present invention has the above-mentioned film of the present invention. As an optical filter, a color filter, a near-infrared ray transmission filter, a near-infrared ray cut filter, etc. are mentioned, A color filter is preferable. As a color filter, a colored pixel having the film of the present invention as a color filter is preferable. In addition, the optical filter may have a structure in which pixels are embedded in spaces partitioned by partition walls, for example, in a grid pattern. In addition, the optical filter may have a light-shielding film. For example, a color filter, a near-infrared ray transmission filter, a near-infrared ray cut filter, etc. may be formed in the opening of the light-shielding film formed on the support. The optical filter of the present invention can be used in optical sensors such as solid-state imaging devices, image display devices, and the like.

In the optical filter, the film thickness of the film of the present invention can be appropriately adjusted depending on the purpose. The film thickness of the pixels included in the filter is preferably 5 μm or less, more preferably 1 μm or less, and still more preferably 0.6 μm or less. The lower limit of the film thickness is preferably at least 0.1 μm, more preferably at least 0.2 μm, and still more preferably at least 0.3 μm.

The width of the pixels included in the filter is preferably 0.4 to 10.0 μm. The lower limit is preferably at least 0.4 μm, more preferably at least 0.5 μm, and still more preferably at least 0.6 μm. The upper limit is preferably 5.0 μm or less, more preferably 2.0 μm or less, still more preferably 1.0 μm or less, still more preferably 0.8 μm or less. In addition, the Young's modulus of the pixel is preferably 0.5 to 20 GPa, more preferably 2.5 to 15 GPa.

It is preferable that each pixel included in the filter has high flatness. Specifically, the surface roughness Ra of the pixel is preferably 100 nm or less, more preferably 40 nm or less, and still more preferably 15 nm or less. The lower limit is not specified, but is preferably 0.1 nm or more, for example. The surface roughness of a pixel can be measured using AFM (atomic force microscope) Dimension 3100 manufactured by Veeco, for example. Also, the water contact angle on the pixel can be appropriately set to a preferable value, but is typically in the range of 50 to 110°. The contact angle can be measured, for example, using a contact angle meter CV-DT･A type (manufactured by Kyowa Interface Science Co., LTD.). Moreover, it is preferable that the volume resistance value of a pixel is high. Specifically, the volume resistance value of the pixel is preferably 10 ⁹ Ω･cm or higher, more preferably 10 ¹¹ Ω･cm or higher. There is no upper limit, but it is preferably 10 ¹⁴ Ω･cm or less, for example. The volume resistance value of the pixel can be measured using an ultrahigh resistance meter 5410 (manufactured by Advantest Corporation).

Also, when the optical filter includes a light-shielding film, the film thickness of the light-shielding film is preferably 5 μm or less, more preferably 2.5 μm or less. The lower limit of the film thickness is preferably at least 0.1 μm, more preferably at least 0.5 μm, and still more preferably at least 1 μm.

In the optical filter, a protective layer may be provided on the surface of the film of the present invention. By providing a protective layer, various functions such as oxidation resistance, low reflection, hydrophilicity/hydrophobization, and shielding of light of a specific wavelength (ultraviolet rays, near-infrared rays, etc.) can be imparted. The thickness of the protective layer is preferably from 0.01 to 10 μm, more preferably from 0.1 to 5 μm. Examples of the method for forming the protective layer include a method of applying a composition for forming a protective layer, a chemical vapor deposition method, and a method of attaching a molded resin with an adhesive material. Examples of components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyresins, polyether resins, polyphenylene resins, Polyaryl ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin , melamine resin, polyurethane resin, aromatic polyamide resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluorine resin, polyacrylonitrile resin, cellulose resin, Si, C, W, Al ₂ O ₃ , Mo, SiO ₂ , Si ₂ N ₄ , etc., may contain two or more of these components. For example, when used as a protective layer for preventing oxidation, it is preferable that the protective layer contains polyol resin, SiO ₂ and Si ₂ N ₄ . Also, when used as a low-reflection protective layer, it is preferable that the protective layer contains (meth)acrylic resin and fluororesin.

The protective layer may contain additives such as organic/inorganic particles, absorbers for light of specific wavelengths (eg, ultraviolet rays, near-infrared rays, etc.), refractive index modifiers, antioxidants, adhesives, and surfactants, as required. Examples of organic/inorganic fine particles include polymer fine particles (for example, silicone resin particles, polystyrene particles, melamine resin particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, nitrogen Titanium oxide, titanium oxynitride, magnesium fluoride, hollow silicon dioxide, silicon dioxide, calcium carbonate, barium sulfate, etc. As the absorber for light of a specific wavelength, known absorbers can be used. The content of these additives can be appropriately adjusted, but is preferably 0.1 to 70% by mass, more preferably 1 to 60% by mass, based on the total mass of the protective layer.

Moreover, as a protective layer, the protective layer described in paragraph 0073-0092 of Unexamined-Japanese-Patent No. 2017-151176 can also be used.

＜Optical Sensor＞ The optical sensor of the present invention comprises the film of the present invention described above. As an optical sensor, a solid-state imaging element etc. are mentioned. The configuration of the solid-state imaging device is not particularly limited as long as it functions as a solid-state imaging device, but examples include the following configurations.

The structure of the imaging element is as follows: on the substrate, there are a plurality of photodiodes that constitute the light-receiving area of the solid-state imaging element (CCD (Charge Coupled Device) image sensor, CMOS (Complementary Metal Oxide Film Semiconductor) image sensor, etc.) The transmission electrode composed of polar body and polysilicon, etc. has a light-shielding film on the photodiode and the transmission electrode that only the light-receiving part of the photodiode is opened. An element protection film made of silicon nitride or the like is formed in a partial manner, and a color filter is provided on the element protection film. Furthermore, it may be a structure that has a light-condensing mechanism (for example, a microlens, etc., the same below) on the lower side of the color filter (closer to the substrate) on the device protective film, or one that has a light-condensing mechanism on the color filter. structure etc. In addition, the color filter may have a structure in which colored pixels are embedded in spaces partitioned by partition walls, for example, in a grid pattern. In this case, the refractive index of the partition wall is preferably lower than that of each colored pixel. Examples of imaging devices having such a configuration include devices described in JP-A-2012-227478, JP-A-2014-179577, and WO2018/043654. Also, as shown in JP-A-2019-211559, light resistance can also be improved by providing an ultraviolet absorbing layer within the structure of the solid-state imaging device. An imaging device equipped with a solid-state imaging device can be used not only as a digital camera or an electronic device (mobile phone, etc.) with an imaging function, but also as a vehicle camera or a surveillance camera.

＜Image Display Device＞ The image display device of the present invention includes the above-mentioned film of the present invention. As an image display device, a liquid crystal display device, an organic electroluminescent display device, etc. are mentioned. The definition of the image display device or the details of each image display device are described, for example, in "Electronic Display Devices (written by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd., 1990)", "Display Devices (Ibuki Shun Chapter, Sangyo Tosho Publishing Co., Ltd., issued in 1989)", etc. Also, liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Yellow Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)". The liquid crystal display device to which the present invention can be applied is not particularly limited, for example, it can be applied to various types of liquid crystal display devices described in the above-mentioned "next-generation liquid crystal yellow display technology". [Example]

Hereinafter, an Example is given and this invention is demonstrated further concretely. Materials, usage amounts, ratios, processing contents, processing procedures, and the like shown in the following examples can be appropriately changed unless departing from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. In addition, Ph in the structural formula shown below represents a phenyl group.

<Manufacture of Dispersion Liquid> Using a bead mill (zirconia beads with a diameter of 0.1 mm), a mixed liquid containing the raw materials listed in the following table was mixed and dispersed for 3 hours. Next, dispersion treatment was carried out at a pressure of 2000 kg/cm ² and a flow rate of 500 g/min using a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a decompression mechanism. This dispersion treatment was repeated ten times in total to obtain a dispersion liquid. The numerical value which shows the compounding quantity described in the following table is a mass part. In addition, the numerical value of the compounding quantity of a dispersing agent is a numerical value converted into solid content.

[Table 1] particle 1 particle 2 particle 3 particle 4 Dispersant Solvent 1 Solvent 2 Solvent 3 type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount Dispersion 1 PR254 10.6 PY139 4.8 D-1 4.6 S-1 80 Dispersion 2 PG36 8.5 PY150 6.9 D-1 4.6 S-1 80 Dispersion 3 PB15:6 12.3 PV23 3.1 D-1 4.6 S-1 80 Dispersion 4 PG7 15.4 D-1 4.6 S-1 80 Dispersion 5 PR122 15.4 D-1 4.6 S-1 80 Dispersion 6 PY150 15.4 D-1 4.6 S-1 80 Dispersion 7 TiO ₂ -1 15.4 D-1 4.6 S-1 80 Dispersion 8 TiON 15.4 D-1 4.6 S-1 80 Dispersion 9 TiO ₂ -2 15.4 D-1 4.6 S-1 80 Dispersion 10 Pigment A 15.4 D-1 4.6 S-1 80 Dispersion 11 PR254 5.7 PY139 2.6 PB15:6 5.5 PV23 1.5 D-1 4.6 S-1 80 Dispersion 12 PB15:6 10.1 PV23 2.8 D-1 5.1 S-1 54 S-2 25 S-3 3

[Table 2] particle 1 particle 2 Pigment derivatives Pigment derivatives Pigment derivatives Dispersant 1 Dispersant 2 solvent solvent type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount Dispersion 13 PB15:6 7.1 PV23 2.4 Syn-3 0.6 Syn-1 1.4 Syn-2 0.4 D-1 4.1 - - S-1 58.8 S-2 25.2 Dispersion 14 PB15:3 7.1 PV23 2.4 Syn-3 0.6 Syn-1 1.4 Syn-2 0.4 D-1 3.7 D-2 0.4 S-1 58.8 S-5 25.2 Dispersion 15 PB15:4 7.1 PV23 2.4 Syn-3 0.6 Syn-1 1.4 Syn-2 0.4 D-1 4.1 - - S-1 58.8 S-2 25.2 Dispersion 16 PB16 7.1 PV23 2.4 Syn-3 0.6 Syn-1 1.4 Syn-2 0.4 D-1 3.7 D-2 0.4 S-1 58.8 S-2 25.2 Dispersion 17 PB15:6 7.0 PV23 2.5 Syn-3 0.6 Syn-1 1.5 Syn-2 0.2 D-3 4.1 - - S-1 58.8 S-5 25.2 Dispersion 18 PB15:6 6.9 PV23 2.6 Syn-3 0.6 Syn-1 1.7 Syn-2 0.1 D-1 4.1 - - S-1 58.8 S-5 25.2 Dispersion 19 PB15:6 9.0 - - Syn-3 0.8 Syn-1 2.0 Syn-2 0.0 D-1 4.1 - - S-1 58.8 S-5 25.2 Dispersion 20 PB15:6 7.1 PV23 2.4 Syn-4 0.6 Syn-1 1.4 Syn-2 0.4 D-4 4.1 - - S-1 58.8 S-2 25.2 Dispersion 21 PB15:6 7.1 PV23 2.4 Syn-5 0.6 Syn-1 1.4 Syn-2 0.4 D-1 4.1 - - S-1 58.8 S-2 25.2

Among the raw materials described in the above table, the details of the raw materials indicated by abbreviations are as follows.

[Particles] PR122: CI Pigment Red 122 (red pigment) PR254: CI Pigment Red 254 (red pigment) PG7: CI Pigment Green 7 (green pigment) PG36: CI Pigment Green 36 (green pigment) PB15:3: CI Pigment Blue 15:3 (blue pigment) PB15:4: CI pigment blue 15:4 (blue pigment) PB15:6: CI pigment blue 15:6 (blue pigment) PB16: CI pigment blue 16 (blue pigment) PY139 : CI Pigment Yellow 139 (Yellow Pigment) PY150: CI Pigment Yellow 150 (Yellow Pigment) PV23: CI Pigment Violet 23 (Purple Pigment) TiON: Titanium Nitride (Black Pigment) TiO ₂ -1: TTO-51 (ISHIHARA SANGYO KAISHA , LTD., titanium oxide, white pigment) TiO ₂ -2: MPT-141 (ISHIHARA SANGYO KAISHA, LTD., titanium oxide, white pigment) Pigment A: compound with the following structure (near infrared absorbing pigment, iC ₈ The part of H ₁₇ and iC ₁₀ H ₂₁ is a mixture of isomers with different carbon numbers and branch positions) [Chemical formula 15]

Syn-2：下述結構的化合物 [化學式17]

Syn-3：下述結構的化合物 [化學式18]

Syn-4：下述結構的化合物 [化學式19]

Syn-5：下述結構的化合物 [化學式20]

[Pigment Derivatives] Syn-1: A compound of the following structure [Chemical Formula 16]

Syn-2: a compound of the following structure [Chemical Formula 17]

Syn-3: a compound of the following structure [Chemical Formula 18]

Syn-4: a compound of the following structure [Chemical Formula 19]

Syn-5: a compound of the following structure [chemical formula 20]

D-2：下述結構的樹脂 [化學式22]

D-3：下述結構的樹脂（附註於主鏈之數值為莫耳比，附註於側鏈之數值為重複單元的數量。重量平均分子量20000、酸值70mgKOH/g） [化學式23]

D-4：以下所示之樹脂（重量平均分子量8000、酸值37mgKOH/g、含乙烯性不飽和鍵之基團值0.22mmol/g） [表3]    結構單元1 結構單元2 結構單元3 種類 莫耳比 種類 莫耳比 種類 莫耳比 D-4 1-A 5 2-A 87 3-A 8 [化學式24]

[化學式25]

[化學式26]

[Dispersant] D-1: Resin with the following structure (the value attached to the main chain is the molar ratio, and the value attached to the side chain is the number of repeating units. The weight average molecular weight is 24000, and the acid value is 47mgKOH/g) [chemical formula twenty one]

D-2: Resin of the following structure [chemical formula 22]

D-3: Resin with the following structure (the value attached to the main chain is the molar ratio, and the value attached to the side chain is the number of repeating units. The weight average molecular weight is 20,000, and the acid value is 70 mgKOH/g) [Chemical formula 23]

D-4: Resin shown below (weight average molecular weight 8000, acid value 37mgKOH/g, group value containing ethylenically unsaturated bond 0.22mmol/g) [Table 3] Structural unit 1 Structural unit 2 Structural unit 3 type Morby type Morby type Morby D-4 1-A 5 2-A 87 3-A 8 [chemical formula 24]

[chemical formula 25]

[chemical formula 26]

[solvent] S-1: Propylene Glycol Monomethyl Ether Acetate (PGMEA) S-2: Cyclopentanone S-3: Propylene Glycol Monomethyl Ether (PGME) S-5: Cyclohexanone

＜Manufacture of composition＞ The raw materials listed in the following table were mixed and filtered using DFA4201NIEY (0.45 μm nylon filter) manufactured by NIHON PALL Corporation to prepare a composition. The numerical value which shows the compounding quantity described in the following table|surface is a mass part.

[Table 4] Dispersions polymerizable monomer resin Photopolymerization initiator Surfactant solvent type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount Example 1-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 2-1 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 3-1 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 4-1 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 5-1 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 6-1 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 7-1 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 8-1 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 9-1 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 10-1 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 11-1 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 13-1 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 W-1 0.008 S-1 S-4 36.7 19.0 Example 14-1 Dispersion 1 65 M-2 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 15-1 Dispersion 1 65 M-1 M-2 1.5 1.5 B-1 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 16-1 Dispersion 1 65 M-1 3 B-2 7.3 I-1 1.1 W-1 0.008 S-1 23.6 Example 17-1 Dispersion 1 65 M-1 3 B-1 B-2 3.65 3.65 I-1 1.1 W-1 0.008 S-1 23.6 Example 18-1 Dispersion 1 65 M-1 3 B-1 7.3 I-2 1.1 W-1 0.008 S-1 23.6 Example 19-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 I-2 0.55 0.55 W-1 0.008 S-1 23.6 Example 20-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-1 W-2 0.004 0.004 S-1 23.6 Example 21-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-2 23.6 Example 22-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-1 0.008 S-1 S-2 11.8 11.8

[table 5] Dispersions dye resin polymerizable monomer Photopolymerization initiator Surfactant solvent type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount Example 23-1 Dispersion 13 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 0.8 W-1 0.02 S-1 29.2 Example 24-1 Dispersion 14 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.72 0.08 W-1 0.02 S-1 29.2 Example 25-1 Dispersion 15 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-4 0.8 W-1 0.02 S-1 29.2 Example 26-1 Dispersion 16 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.64 0.16 W-1 0.02 S-1 29.2 Example 27-1 Dispersion 17 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 0.8 W-1 0.02 S-1 29.2 Example 28-1 Dispersion 18 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 0.8 W-1 0.02 S-1 29.2 Example 29-1 Dispersion 19 50.0 Dye 1 6.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.72 0.08 W-1 0.02 S-1 38.2 Example 30-1 Dispersion 20 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.72 0.08 W-1 0.02 S-1 29.2 Example 31-1 Dispersion 21 65.0 B-1 1.0 M-1 M-3 2.0 2.0 I-1 I-3 0.72 0.08 W-1 0.02 S-1 29.2

[Table 6] Dispersions polymerizable monomer resin Photopolymerization initiator Surfactant solvent type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount Example 1-2 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 2-2 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 3-2 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 4-2 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 5-2 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 6-2 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 7-2 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 8-2 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 9-2 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 10-2 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 11-2 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 W-2 0.008 S-1 23.6 Example 13-2 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 W-2 0.008 S-1 S-4 36.7 19.0

[Table 7] Dispersions polymerizable monomer resin Photopolymerization initiator Surfactant solvent type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount Example 1-3 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 2-3 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 3-3 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 4-3 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 5-3 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 6-3 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 7-3 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 8-3 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 9-3 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 10-3 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 11-3 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 W-3 0.008 S-1 23.6 Example 13-3 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 W-3 0.008 S-1 S-4 36.7 19.0

[Table 8] Dispersions polymerizable monomer resin Photopolymerization initiator Surfactant solvent type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount Comparative example 1-1 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative example 2-1 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative example 3-1 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative example 4-1 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative example 5-1 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative example 6-1 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 7-1 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 8-1 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 9-1 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 10-1 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 11-1 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 CW-1 0.008 S-1 23.6 Comparative Example 13-1 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 CW-1 0.008 S-1 S-4 36.7 19.0

[Table 9] Dispersions polymerizable monomer resin Photopolymerization initiator Surfactant solvent type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount type Blending amount Comparative example 1-2 Dispersion 1 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative example 2-2 Dispersion 2 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative example 3-2 Dispersion 3 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative example 4-2 Dispersion 4 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative example 5-2 Dispersion 5 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative example 6-2 Dispersion 6 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative example 7-2 Dispersion 7 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative example 8-2 Dispersion 8 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 9-2 Dispersion 9 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 10-2 Dispersion 10 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 11-2 Dispersion 11 65 M-1 3 B-1 7.3 I-1 1.1 CW-2 0.008 S-1 23.6 Comparative Example 13-2 Dispersion 12 39 M-2 M-3 1.2 0.5 B-2 2.2 I-1 I-2 0.7 0.7 CW-2 0.008 S-1 S-4 36.7 19.0

[Table 10] Dispersions Surfactant solvent type Blending amount type Blending amount type Blending amount Example 12-1 Silica Particle Liquid 1 44.8 W-1 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1 Example 12-2 Silica Particle Liquid 1 44.8 W-2 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1 Example 12-3 Silica Particle Liquid 1 44.8 W-3 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1 Comparative Example 12-1 Silica Particle Liquid 1 44.8 CW-1 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1 Comparative Example 12-2 Silica Particle Liquid 1 44.8 CW-2 0.2 S-11 S-12 S-13 S-14 S-15 43 8 2 1 1

Among the raw materials described in the above table, the details of the raw materials indicated by abbreviations are as follows.

[Dispersions] Dispersion 1-21: Dispersion 1-21 above Silica particle solution 1: Add 3.0 g of trimethylmethoxysilane as a hydrophobizing treatment agent to 100.0 g of propylene glycol monomethyl ether solution (silica particle concentration: 20% by mass), and react at 20°C for 6 Silica particle liquid prepared in hours, the aforementioned propylene glycol monomethyl ether solution contains a plurality of spherical silica with an average particle diameter of 15nm connected in a beaded shape by silica containing metal oxide (connecting material) of silica particles (beaded silica). Furthermore, the average particle size of spherical silica in silica particle liquid 1 is the equivalent circle in the projected image of the spherical part of 50 spherical silica measured by a transmission electron microscope (TEM). Calculate the average of the number of diameters. In addition, in the silica particle liquid 1, it was examined by TEM observation whether or not there are silica particles in a shape in which a plurality of spherical silicas are connected in a bead shape.

[Dye] Dye 1: a compound of the following structure (weight average molecular weight: 9000) [Chemical formula 27]

[polymerizable monomer] M-1: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) M-2: ARONIX TO-2349 (manufactured by TOAGOSEI CO.,LTD.) M-3: NK ESTER A-DPH-12E (manufactured by Shin-Nakamura Chemical Co., Ltd.)

B-2：下述結構的樹脂（附註於主鏈之數值為莫耳比。重量平均分子量19000。固體成分40%） [化學式29]

[Resin] B-1: Resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 11000) [Chemical formula 28]

B-2: Resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 19000. The solid content is 40%) [Chemical formula 29]

I-2：下述結構的化合物（肟化合物） [化學式31]

I-3：下述結構的化合物（肟化合物） [化學式32]

I-4：下述結構的化合物（肟化合物） [化學式33]

[Photopolymerization initiator] I-1: Compound (oxime compound) of the following structure [Chemical formula 30]

I-2: A compound of the following structure (oxime compound) [Chemical formula 31]

I-3: A compound of the following structure (oxime compound) [Chemical formula 32]

I-4: A compound of the following structure (oxime compound) [Chemical formula 33]

[Surfactant] W-1: Compound with the following structure (polysiloxane-based surfactant, hydroxyl value 120mgKOH/g, dynamic viscosity at 25°C = 35mm ² /s, surface tension at 25°C = 27.6mN /m) W-2: Compound with the following structure (polysiloxane-based surfactant, hydroxyl value 100mgKOH/g, dynamic viscosity at 25°C = 38mm ² /s, surface tension at 25°C = 27.1mN/m ) W-3: Compound with the following structure (polysiloxane-based surfactant, hydroxyl value 80mgKOH/g, dynamic viscosity at 25°C = 40mm ² /s, surface tension at 25°C = 26mN/m) [chemical formula 34]

CW-1: BYK-330 (manufactured by BYK Chemie GmbH, silicone-based surfactant, surface tension at 25°C = 25.1mN/m) CW-2: Futurgent710FM (manufactured by NEOS Corporation, fluorine-based surfactant, surface tension at 25°C = 24.3mN/m)

In addition, dynamic viscosity was measured using the Ubbelohde's viscometer. Also, the surface tension was measured as a measurement sample with a solution having a solid content concentration of 1000 mass ppm prepared by dissolving each surfactant in PGMEA. The temperature of the measurement sample was adjusted to 25° C., a surface tensiometer CBVP-Z (manufactured by Kyowa Interface Science Co., Ltd.) was used as a measurement device, and measurement was performed by the plate method using a platinum plate.

[solvent] S-1, S-11: Propylene glycol monomethyl ether acetate S-2: Cyclopentanone S-4: Butyl acetate S-12: 1,4-Butanediol diacetate S-13: Methanol S-14: Ethanol S-15: water

<Evaluation of color mixing> The composition for forming the base layer (CT-4000L, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was coated on a glass wafer with a diameter of 8 inches (20.32 cm) so that the dry film thickness became 0.1 μm, dried, and then heat-treated at 220° C. for 5 minutes to form a base layer. Next, each composition was coated on the glass wafer on which the base layer was formed by using a spin coater so that the film thickness after prebaking became 0.6 μm, and it was carried out using a hot plate at 100° C. for 120 seconds. Heat treatment (pre-baking). Next, using an i-ray stepper (FPA-3000i5+, manufactured by Canon Inc.), the entire surface of the glass wafer was irradiated with light having a wavelength of 365 nm at an exposure amount of 500 mJ/cm ² for exposure. The glass wafer having the exposed film was heat-treated (post-baked) at 200° C. for 300 seconds using a hot plate to form a film. Using a spectrometer (U-4150, manufactured by Hitachi, Ltd.), the transmittance in the wavelength range of 400 to 1100 nm was measured for the glass wafer on which the film was formed. Next, the composition for color mixing evaluation was applied using a spin coater so that the film thickness after prebaking became 0.6 μm, and heat treatment was performed for 120 seconds using a 100° C. hot plate (prebaking). In addition, in Examples 1-1, 1-2, 1-3, and Comparative Examples 1-1 and 1-2, the composition of Comparative Example 3-1 was used as the composition for color mixing evaluation. Also, about Examples 2-1 to 31-1, Examples 2-2 to 13-2, Examples 2-3 to 13-3, Comparative Examples 2-1 to 13-1, and Comparative Examples 2-2 to 13 -2. The composition of Comparative Example 1-1 was used as the composition for color mixing evaluation. Next, the glass wafer was placed on the horizontal turntable of a rotary/shower developing machine (DW-30, manufactured by CHEMITRONICS CO., Ltd.), and an alkaline developer (CD-2060, FUJIFILM Electronic Materials Co., Ltd. .system) Spin-on-immersion development was performed at 23°C for 60 seconds. Next, fix the spin-on-immersion-developed glass wafer on a horizontal turntable by means of a vacuum chuck, while the glass wafer is rotated at a speed of 50 rpm by means of a rotating device, and the glass wafer is supplied from the top of the rotation center in the form of a spray from the nozzle. water, rinsed (23 seconds x 2 times), then spin-dried, and then heat-treated (post-baked) at 200°C for 300 seconds using a hot plate to develop the composition for color mixing evaluation. Color mixing test. After the color mixing test, the transmittance in the wavelength range of 400 to 1100 nm was measured again on the glass wafer on which the film was formed using a spectrometer (U-4150, manufactured by Hitachi, Ltd.).

Regarding Examples 1-1 to 7-1, 9-1 to 31-1, Examples 1-2 to 7-2, 9-2 to 13-2, Examples 1-3 to 7-3, and 9-3 ～13-1, Comparative Examples 1-1～7-1, 9-1～13-1, Comparative Examples 1-2～7-2, 9-2～13-2, evaluated the transmission of the film before and after the color mixing test The maximum value of the rate difference, color mixing was evaluated by the following criteria. Transmittance difference=|Transmittance of the film before the color mixing test-Transmittance of the film after the color mixing test| 5: The maximum value of the transmittance difference is 1% or less 4: The maximum value of the transmittance difference exceeds 1% and is 2% or less 3: The maximum value of the transmittance difference exceeds 2% and is 3% or less 2: The maximum value of the transmittance difference exceeds 3% and is 4% or less 1: The maximum value of the transmittance difference exceeds 4%

Regarding Examples 8-1, 8-2, 8-3, and Comparative Examples 8-1 and 8-2, the spectral change rate based on the transmittance before the color mixing test was evaluated, and the color mixing was evaluated based on the following criteria. The evaluation was carried out by: spectral change rate=(1-transmittance of the film after the color mixing test/transmittance of the film before the color mixing test)×100. 5: The maximum value of the spectral change rate is less than 1% 4: The maximum value of the spectral change rate exceeds 1% and is 2% or less 3: The maximum value of the spectral change rate exceeds 2% and is 3% or less 2: The maximum value of the spectral change rate exceeds 3% and is 4% or less 1: The maximum value of the spectral change rate exceeds 4%

[Table 11] mixed color Example 1-1 5 Example 2-1 5 Example 3-1 5 Example 4-1 5 Example 5-1 5 Example 6-1 5 Example 7-1 5 Example 8-1 5 Example 9-1 5 Example 10-1 5 Example 11-1 5 Example 12-1 5 Example 13-1 5 Example 14-1 5 Example 15-1 5 Example 16-1 5 Example 17-1 5 Example 18-1 5 Example 19-1 5 Example 20-1 5 Example 21-1 5 Example 22-1 5 Example 23-1 5 Example 24-1 5 Example 25-1 5 Example 26-1 5 Example 27-1 5 Example 28-1 5 Example 29-1 5 Example 30-1 5 Example 31-1 5

[Table 12] mixed color mixed color mixed color mixed color Example 1-2 4 Example 1-3 3 Comparative example 1-1 2 Comparative example 1-2 1 Example 2-2 4 Example 2-3 3 Comparative example 2-1 2 Comparative example 2-2 1 Example 3-2 4 Example 3-3 3 Comparative example 3-1 2 Comparative example 3-2 1 Example 4-2 4 Example 4-3 3 Comparative example 4-1 2 Comparative example 4-2 1 Example 5-2 4 Example 5-3 3 Comparative example 5-1 2 Comparative example 5-2 1 Example 6-2 4 Example 6-3 3 Comparative example 6-1 2 Comparative example 6-2 1 Example 7-2 4 Example 7-3 3 Comparative Example 7-1 2 Comparative example 7-2 1 Example 8-2 4 Example 8-3 3 Comparative Example 8-1 2 Comparative example 8-2 1 Example 9-2 4 Example 9-3 3 Comparative Example 9-1 2 Comparative Example 9-2 1 Example 10-2 4 Example 10-3 3 Comparative Example 10-1 2 Comparative Example 10-2 1 Example 11-2 4 Example 11-3 3 Comparative Example 11-1 2 Comparative Example 11-2 1 Example 12-2 4 Example 12-3 3 Comparative Example 12-1 2 Comparative Example 12-2 1 Example 13-2 4 Example 13-3 3 Comparative Example 13-1 2 Comparative Example 13-2 1

As shown in the above table, the Examples were able to suppress the occurrence of color mixture as compared with the Comparative Examples.

1: Spherical silica 2: Joint 11: Support body 12: next door 14: pixel 100:Structure

FIG. 1 is an enlarged view schematically showing a plurality of spherical silica particles connected in a bead shape. Fig. 2 is a side sectional view showing an embodiment of the structure of the present invention. Fig. 3 is a plan view viewed from directly above the support body in the same structure.

none.

Claims (17)

A composition comprising: Hardening compounds; Polysiloxane-based surfactant A; and solvent, In the aforementioned polysiloxane-based surfactant A, when the aforementioned polysiloxane-based surfactant A was dissolved in propylene glycol monomethyl ether acetate to prepare a solution having a solid content concentration of 1000 mass ppm, the temperature of the aforementioned solution at 25° C. The surface tension is 26 mN/m or more. The composition as described in claim 1, wherein The aforementioned curable compound contains a resin and a polymerizable monomer, The aforementioned composition further contains a photopolymerization initiator. The composition according to claim 1 or claim 2, which further contains a coloring material. A composition comprising: Inorganic particles; Polysiloxane-based surfactant A; and solvent, In the aforementioned polysiloxane-based surfactant A, when the aforementioned polysiloxane-based surfactant A was dissolved in propylene glycol monomethyl ether acetate to prepare a solution having a solid content concentration of 1000 mass ppm, the temperature of the aforementioned solution at 25° C. The surface tension is 26 mN/m or more. The composition as described in claim 4, wherein The aforementioned inorganic particles include silica particles. The composition as described in claim 5, wherein The aforementioned silica particles include silica particles in the shape of a plurality of spherical silica connected in a bead shape, silica particles in the shape of a plurality of spherical silica connected in a plane, and silica particles of a hollow structure. At least one type of silicon particles. The composition as described in claim 4 or claim 5, wherein Content of the said inorganic particle in the total solid content of the said composition is 20 mass % or more. The composition as described in claim 1 or claim 4, wherein The hydroxyl value of the polysiloxane-based surfactant A is 80 mgKOH/g or more. The composition according to claim 1 or claim 4, wherein the polysiloxane-based surfactant A has a dynamic viscosity of 40 mm ² /s or less at 25°C. The composition as described in claim 1 or claim 4, wherein The polysiloxane-based surfactant A is a methanol-modified dialkylpolysiloxane. The composition as described in claim 1 or claim 4, wherein The aforementioned polysiloxane-based surfactant A is dimethylpolysiloxane having an alkeneoxy group and a hydroxyl group. The composition as described in claim 1 or claim 4, wherein The content of the polysiloxane-based surfactant A in the composition is 1 to 1000 ppm by mass. A film obtained by using the composition described in Claim 1 or Claim 4. An optical filter having the film described in claim 13. An optical sensor having the film described in claim 13. An image display device having the film described in claim 13. A structure that has: support body; The partition wall is obtained by using the composition described in claim 4 provided on the aforementioned support; and The pixels are arranged in the area divided by the aforementioned partition walls.

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