TW202309349A - Horizontal electroplating system - Google Patents

Abstract

A horizontal electroplating system is provided, including: an electroplating tank for containing electroplating solution; a spray module, disposed at the bottom of the electroplating tank and provided with a plurality of spray holes, the spray holes spraying electroplating solution upwards; an anode plate, disposed on the spray module and not covering the spray holes; a substrate clamping device, for fixing a substrate with a surface to be electroplated facing downwards; a flow-guide module, including a rotatable flow-guide plate, the flow-guide plate being disposed with a plurality of blades distributed at the central area, the flow-guide plate being located between the substrate clamping device and the spray module; when the flow-guide plate rotating, the blades guiding the electroplating solution to the surface to be electroplated. As such, the invention improves the electroplating flow field uniformity and efficiency, and is applicable tor electroplating a single large-size panel or multiple wafers.

Description

Horizontal Plating System

The invention belongs to the technical field of an electroplating system, in particular to an electroplating equipment related to a wafer or a panel.

The factors that generally determine the quality of electroplating are mainly: efficiency, reliability, and uniformity. The common electroplating process is submerged, and the substrate is placed upright. The advantage is that the size of the equipment can be reduced for large-size panel-level packaging applications. However, the upright substrate is likely to make it difficult to manufacture the automatic clamping and leak-proof device. The larger the substrate size The larger the size, the easier it is for the electroplating solution to leak to the back of the substrate, causing the back of the board to contact the electroplating solution and then be covered by the electroplating metal, which affects the calculation of the electroplating area, resulting in poor reliability and uniformity. In order to improve this problem, some substrates adopt a cup-type horizontal electroplating process. At this time, the substrate is placed horizontally, and the electroplating solution is poured from the bottom up, and the electroplating operation is performed on the substrate with the electroplated side facing down. The uniformity of this method is adopted. Although the reliability is high, the floor area of the equipment will be too large because the horizontal plating equipment is used for plating large-size substrates. Therefore, the plating tanks in the equipment design can be stacked upwards to save floor space. In addition, and The purpose of fully automated mass production can be achieved by automatically processing the upper and lower substrates, and the present invention is made accordingly.

In order to solve the above problems, the main purpose of the present invention is to provide a horizontal electroplating system. The substrate is placed horizontally, and the electroplating solution flows out from bottom to top. There are several blades in the center of the plate. When the guide plate rotates, the blades are used to increase the flow rate and flow field control of the electroplating solution, maintain appropriate pressure, flow rate and uniform flow field, and increase the replacement rate of the plating solution on the surface of the substrate to be plated, so that the plating is uniform High accuracy and reliability, and can improve the efficiency and uniformity of electroplating.

In order to achieve the above-mentioned purpose, the present invention is a horizontal electroplating system, comprising: an electroplating tank for containing the electroplating solution; a jet flow module, which is arranged on the bottom of the electroplating tank or around it and is provided with several jet holes, and the jet holes are sprayed by An electroplating solution flowing from bottom to top; an anode plate, which is set on the jet flow module, so as not to cover the jet flow holes; a substrate clamping device, which fixes the substrate and makes the plated surface of the substrate face downward; a diversion mold group, including a rotatable guide plate, with several blades distributed in the center of the guide plate, the guide plate is located between the substrate clamping device and the jet module, when the guide plate rotates, the blades are used to guide the electroplating solution towards the surface to be plated Flow, thereby improving the uniformity and efficiency of electroplating.

As one of the preferred embodiments, the center of the electroplating tank is the main tank chamber, and an overflow chamber is arranged around it, and the surrounding height of the overflow chamber is higher than that of the main tank chamber.

As one of the preferred embodiments, the spray module includes a cavity, a plurality of spray holes are distributed on the surface of the cavity, and the openings of the spray holes face upward.

As one of the preferred embodiments, the anode plate includes a plurality of concentric rings that radially increase from the center to the outside, and the connected concentric rings are connected by conductors.

As one of the preferred embodiments, the concentric rings are quadrilateral rings.

As one of the preferred implementations, the substrate clamping device has a downward mounting surface, and several coupling holes are distributed on the mounting surface, and the cathode of the power supply is connected in the coupling hole. In addition, a cover frame is provided, and the cover frame is provided with several conductive holes. Pillars and conductive sheets, the middle is a hollowed out area, the size of the hollowed out area is smaller than the size of the substrate, the number and position of the conductive pillars correspond to the bonding holes, when the substrate is placed on the mounting surface, cover the cover frame and insert several conductive pillars into the number to combine The substrate can be fixed on the installation surface by letting the conductive sheet contact the substrate, and the substrate to be plated is exposed downward. The pillars and conductive strips conduct electricity to the plated surface of the substrate, and the full frame conduction can improve the uniformity of the electric field of the substrate.

As one of the preferred implementations, the diversion module also includes several supports and drive components. The drive component includes a rotating component and a power device capable of driving the rotary component. The drive component is located above the electroplating tank. The ends are respectively connected with the rotating part and the guide plate, when the power device drives the rotating part to rotate, the guide plate located below can also rotate synchronously.

As one of the preferred implementations, the substrate holding device can be connected with another rotating lifting mechanism, so that the substrate holding device can rotate synchronously during the electroplating process.

As one of the preferred embodiments, the substrate clamping device has a rectangular end surface, and the matching cover frame is also rectangular, and the fixed substrate is a semiconductor advanced packaging panel.

As one of the preferred implementations, the end face of the substrate holding device is circular in shape, the matched cover frame is also circular, and the fixed substrate is a micro light emitting diode (Micro LED) wafer substrate.

The technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments and accompanying drawings. It should be noted that when an element is referred to as being "mounted or fixed on" another element, it means that it may be directly on another element or there may be an intervening element. When an element is said to be "connected" to another element, it means that it may be directly connected to the other element or intervening elements may also be present. In the illustrated embodiment, the directions meaning up, down, left, right, front and rear, etc. are relative to explain that the structure and movement of the different components are relative in this case. These representations are pertinent when the components are in the positions shown in the figures. However, if the description of the location of elements changes, these representations are considered to change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in Fig. 1 and Fig. 2, it is a cross-sectional junction schematic diagram and a three-dimensional structural schematic diagram of the horizontal electroplating system of the present invention. The present invention is a horizontal electroplating system, comprising: an electroplating tank 1 for accommodating electroplating solution A therein; a jet flow module 2 arranged at the bottom or around the inner bottom of the electroplating tank 1 and provided with several jet holes 21 and 21 The electroplating solution is sprayed upward, so that the electroplating solution A gushes out from bottom to top; an anode plate 3 is arranged on the jet flow module 2 and will not cover the jet flow hole 21; a substrate clamping device 4 fixes the substrate, and Make the plated surface of the substrate face down; a diversion module 5 includes a rotatable diversion plate 51, and several blades 511 are distributed in the center of the diversion disc 51, and the diversion disc 51 is located between the substrate clamping device 4 and the jet module 2, when the deflector plate 51 rotates, the vanes 511 are used to guide the electroplating solution A to flow toward the surface to be electroplated, thereby improving the uniformity and efficiency of electroplating.

Then make a detailed description of the structure of each component:

The electroplating tank 1 is an upwardly facing container for accommodating the electroplating solution A. The electroplating solution A is the relative composition according to the electroplating operation. The central area of the electroplating tank 1 is the main tank chamber 11, which is the main working area of the electroplating operation, and an overflow chamber 12 is also arranged around it. outflowing plating solution. A recovery pipe 131 is provided at the bottom of the overflow chamber 12 , and the recovered electroplating solution A can be filtered or adjusted in concentration by the pump 13 and then sent to the spray module 2 through the delivery pipe 132 .

The jet flow module 2 is arranged at the bottom or around the electroplating tank 1 . The jet flow module 2 includes a cavity 22 and a plurality of jet flow holes 21 distributed on its surface. The jet flow holes 21 open upward, and the number and distribution positions of the jet flow holes 21 are designed to achieve the required flow field. The aforementioned conveying pipe 132 sends a large amount of electroplating solution A into the chamber tank 22. Before spraying through the small-diameter spray hole 21, the cavity 2 can be used to achieve the effect of pressurization, and after spraying, a water flow from bottom to top is formed to increase the flow rate. , direction and pressure meet the set requirements.

The anode plate 3 is placed on the periphery of the cavity 22 of the flow module 2, and is connected to the positive terminal of the power line during the electroplating process. In this embodiment, the anode plate 3 is in the form of concentric rings 31 radially increasing from the center to the outside, and all the concentric rings 31 are connected by conductors 32 to facilitate electrical transmission. In the embodiment, the concentric ring body 31 is a quadrangular ring, but it is not limited thereto, and may also be circular or other geometric shapes.

The deflector module 5 includes a rotatable deflector plate 51. Several blades 511 are distributed in the center of the deflector plate 51. When the deflector plate 51 rotates, the vanes 511 are used to guide the electroplating solution A from the spray module 2 to the substrate B. Plated surface flows. In order to drive the deflector plate 51 to rotate, the deflector module 5 also includes a support member 52 and a drive assembly 53. The drive assembly 53 includes a rotating member 351 and a power unit 532. The power unit 532 is responsible for driving the rotating member 351 to rotate. In this embodiment, a gear can be provided on the periphery of the rotating member 351, and the power device 532 drives a pinion gear to mesh with the gear for transmission, but this is only one embodiment and is not limited thereto. The upper and lower ends of the support member 52 are respectively fixed to the rotating member 351 and the deflector plate 51 , and several support members 52 are evenly distributed around them at equal angles. In this way, when the driving assembly 53 is actuated, the guide plate 51 can be rotated synchronously by using the support member 52 .

The substrate clamping device 4 is used for clamping a substrate B, and makes the electroplated surface of the substrate B face down. In this embodiment, the substrate B is a semiconductor advanced packaging panel, but it is not limited thereto, and may also be a wafer. A group of lifting mechanisms (not shown in the figure) can be installed on the top of the substrate clamping device 4 to drive it to rise or fall vertically, and immerse the fixed substrate B into the electroplating solution A when it descends. The inside of the substrate clamping device 4 is also provided with a cathode circuit that can contact the fixed substrate B to facilitate the electroplating operation. The substrate clamping device 4 can be in various types as required, and this embodiment only provides one of them, but not limited thereto. As shown in FIG. 3 , the substrate clamping device 4 has a downward mounting surface 41 , and several connecting holes 411 are distributed around the mounting surface, and the connecting holes 411 are connected with the cathode of the power supply. In addition, a cover frame 42 is provided. The middle of the cover frame 42 is a hollow area 420 , and a plurality of conductive columns 421 and conductive sheets 422 are arranged around the cover frame 42 . The size of the hollow area 420 must be smaller than the size of the substrate B. As shown in FIG. The number and position of the conductive posts 421 correspond to the bonding holes 411 . When the substrate B is placed on the mounting surface 41, cover the cover frame 42 and insert the digital conductive column 421 into the digital coupling hole 41, the conductive sheet 422 contacts the substrate B, fix the substrate B on the mounting surface 41, and make the substrate B The surface to be plated faces downwards and is exposed. Of course, the inner or outer frame edge of the cover frame 42 is provided with a sealing strip 423 to ensure that the liquid will not penetrate into the inside when immersed in the electroplating solution A. The current conduction method of the present invention is that the clamping device 4 on the back of the substrate B conducts electricity to the front of the substrate B through a plurality of conductive columns 421 and conductive sheets 422 around the cover frame 42. The entire frame conduction can improve the uniformity of the electric field of the substrate B. , and due to the leak-proof design, prevent the conductive column 421 and the conductive sheet 422 from contacting the electroplating solution, causing the conductive device to become the object to be plated.

Based on the above, the horizontal electroplating system of the present invention is that the jet flow module 2 continuously sprays the electroplating solution A during the electroplating process to form a circulating water flow flowing from bottom to top, and the substrate clamping device 4 immerses the fixed substrate B in the electroplating process. In the liquid A, utilize the deflector plate 52 to rotate, make the electroplating liquid A continue and keep the appropriate pressure to flow to the surface to be plated, increase the replacement rate of the electroplating liquid A on the surface of the plated surface, and the corresponding electrodes on the anode plate 3 and the substrate B respectively After electrification, the surface to be electroplated can gradually form deposits with uniform thickness, and the electroplating efficiency is high and the quality is good, which meets the requirements for patent application.

As shown in Fig. 4, it is another embodiment of the present invention. In the above-mentioned embodiment, the substrate clamping device 4 achieves the purpose of rising and falling by a lifting mechanism, but it is not limited to this, and a rotating lifting mechanism (not shown in the figure) can be combined with the substrate clamping device 4 The connection enables the substrate clamping device 4 to rotate synchronously during the electroplating process, which also helps to increase the replacement rate of the electroplating solution A on the surface to be electroplated and improve the electroplating effect.

As shown in FIG. 5 , it is a schematic view of another embodiment of the substrate clamping device of the present invention. In the above-mentioned embodiment, since the substrate B is a semiconductor advanced packaging panel, and is a single large-scale panel, the shape of the end face of the substrate clamping device 4 is rectangular, but in this embodiment, since the substrate B1 is a micro light-emitting diode ( Micro LED) wafer substrate, the end face of the relative substrate clamping device 4A is also circular, in addition, in this embodiment, multiple micro light emitting diodes (Micro LED) wafer substrates can be fixed at one time, and the relative substrate clamping device The mounting surface 41A of 4A is provided with a plurality of circular cover frames 42A for fixing a plurality of wafers.

However, the above-mentioned embodiments are only illustrative of the effects of the present invention, and are not intended to limit the present invention. Any person familiar with this technical field can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. . In addition, the numbers of elements in the above-mentioned embodiments are for illustrative purposes only, and are not intended to limit the present invention. Therefore, the protection scope of the present invention should be as listed in the scope of patent application below.

1: Plating tank 11: Main tank chamber 12: Overflow chamber 13: pump 131: Recovery tube 132: delivery pipe 2: jet module 21: jet hole 22: Cavity 3: Anode plate 31: concentric ring body 32: Conductor 4: Substrate clamping device 4A: Substrate clamping device 41: Mounting surface 41A: Mounting surface 411: binding hole 42: cover frame 42A: cover frame 420: hollow area 421: Conductive column 422: conductive sheet 423: sealing strip 5: diversion module 51: deflector plate 511: blade 52: Support column 53: Drive device 531:Rotary 532: power unit A: Plating solution B: Substrate B1: Substrate

Fig. 1 is a schematic diagram of the planar structure of the horizontal electroplating system of the present invention;

Fig. 2 is the three-dimensional schematic view of horizontal electroplating system of the present invention;

3 is a schematic diagram of a substrate clamping device of a horizontal electroplating system of the present invention;

Fig. 4 is the schematic diagram of another embodiment of horizontal electroplating system of the present invention;

FIG. 5 is a schematic diagram of another embodiment of the substrate clamping device of the horizontal electroplating system of the present invention.

1: Plating tank

11: Main tank chamber

12: Overflow chamber

13: pump

131: Recovery tube

132: delivery pipe

2: jet module

21: jet hole

22: Cavity

3: Anode plate

4: Substrate clamping device

5: diversion module

51: deflector plate

511: blade

52: Support column

53: Drive device

531:Rotary

532: power unit

A: Plating solution

B: Substrate

Claims (10)

A horizontal electroplating system comprising: An electroplating tank for containing the electroplating solution; A jet flow module, which is arranged at the bottom or around the electroplating tank and is provided with several jet holes, and the jet holes spray out the electroplating solution flowing from bottom to top; An anode plate is arranged on the jet flow module and will not cover the jet flow hole; A substrate clamping device, which fixes at least one substrate, and makes the surface of the substrate to be electroplated face down; A deflector module, including a rotatable deflector plate, with several blades distributed in the central area of the deflector plate, the deflector plate is located between the substrate clamping device and the spray module, when the deflector plate rotates , using the vane to guide the electroplating solution to flow toward the surface to be electroplated. As for the horizontal electroplating system described in claim 1, the center of the electroplating tank is the main tank chamber, and an overflow chamber is arranged around it, and the surrounding height of the overflow chamber is higher than that of the main tank chamber. According to the horizontal electroplating system described in Claim 1, the spray flow module includes a cavity, the plurality of spray holes are distributed on the surface of the cavity, and the openings of the spray holes face upward. According to the horizontal electroplating system described in Claim 1, the anode plate includes a plurality of concentric rings radially increasing from the center to the outside, and conductors are connected between the concentric rings. In the horizontal electroplating system described in Claim 4, the concentric ring is a quadrangular ring. As for the horizontal electroplating system described in Claim 1, the substrate clamping device has a downward mounting surface, and several coupling holes are distributed on the mounting surface, and the cathode of the power supply is connected to the coupling hole, and a cover frame is also provided. The cover frame is provided with several conductive posts and conductive sheets, and the middle is a hollowed out area. The size of the hollowed out area is smaller than the size of the substrate. The number and position of the conductive posts correspond to the bonding holes. When the substrate is placed on the mounting surface, the cover Putting on the frame cover and inserting several conductive posts into several bonding holes, and making the conductive sheet contact the substrate, the substrate can be fixed on the mounting surface, and the plated surface of the substrate can be exposed downward. , the electrification method is to electrify the clamping device on the back of the substrate, conduct the electricity to the plated surface of the substrate through several conductive columns and the conductive sheet around the cover frame, and the electric field uniformity of the substrate can be improved by the whole frame conduction . As in the electroplating system described in claim 1, the diversion module further includes a support member and a driving assembly, the driving assembly includes a rotating member and a power device capable of driving the rotating member, the driving assembly is located above the electroplating tank, The upper and lower ends of several support members are respectively connected with the rotating member and the guide plate. When the power device drives the rotating member to rotate, the guide plate located below can also rotate synchronously. According to the electroplating system described in claim 1, the substrate holding device can be connected with another rotating lifting mechanism, so that the substrate holding device can rotate synchronously during the electroplating process. As for the electroplating system described in item 1, the end face of the substrate clamping device is rectangular, the matching cover frame is also rectangular, and the fixed substrate is a semiconductor advanced packaging panel. For the electroplating system described in item 1, the end face of the substrate clamping device is circular in shape, and the matched cover frame is also circular, and the fixed substrate is a Micro LED (Micro LED) wafer substrate .

Images