TW202305999A - 晶片搬送裝置及黏晶機 - Google Patents
晶片搬送裝置及黏晶機 Download PDFInfo
- Publication number
- TW202305999A TW202305999A TW111127794A TW111127794A TW202305999A TW 202305999 A TW202305999 A TW 202305999A TW 111127794 A TW111127794 A TW 111127794A TW 111127794 A TW111127794 A TW 111127794A TW 202305999 A TW202305999 A TW 202305999A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- chuck
- substrate
- support base
- wafer chuck
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75261—Laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75261—Laser
- H01L2224/75263—Laser in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
- H01L2224/75305—Shape of the pressing surface comprising protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/7531—Shape of other parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75824—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75841—Means for moving parts of the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75841—Means for moving parts of the bonding head
- H01L2224/75842—Rotational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75841—Means for moving parts of the bonding head
- H01L2224/75842—Rotational mechanism
- H01L2224/75843—Pivoting mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
[課題]可抑制固定元件晶片之位置的偏差。[解決手段]將元件晶片搬送往基板的預定的電極上之搬送單元具有:晶片卡盤,其吸引保持元件晶圓的一側的面;支撐基台,其能傾動地固定晶片卡盤;以及移動單元,其移動支撐基台,並且,將晶片卡盤固定於支撐基台之固定機構具有從晶片卡盤往側邊放射狀地延伸之多個板彈簧,多個板彈簧與晶片卡盤的周圍的支撐基台連接,藉由多個板彈簧彼此互相拉伸而將晶片卡盤能傾動地支撐於空中。
Description
本發明關於一種晶片搬送裝置及黏晶機。
已知有一種黏晶機,其將半導體元件晶片裝配於框架基板等各種基板並進行固定(例如,參照專利文獻1)。
[習知技術文獻]
[專利文獻]
[專利文獻]日本特開2013-065629號公報
[發明所欲解決的課題]
伴隨半導體元件的配線的細微化,半導體元件晶片的電極間距離變窄,以黏晶機將半導體元件晶片裝配於具有配線之樹脂基板或具有配線之矽晶圓之位置的精度亦要求高精度化。目前為止的黏晶機,一般而言是以掛在搬送單元之棒狀的筒夾保持座(頭)的下端的筒夾吸引保持晶片,但若筒夾保持座搖晃,則半導體元件晶片會容易在橫方向移動,而有裝配之位置會偏差之課題。
因此,本發明之目的在於提供可抑制固定元件晶片之位置的偏差之晶片搬送裝置及黏晶機。
[發明功效]
根據本發明的一態樣,提供一種晶片搬送裝置,其將元件晶片搬送往基板的固定位置,且特徵在於,具備:晶片卡盤,其吸引保持元件晶圓的一側的面;支撐基台,其能傾動地固定該晶片卡盤;移動單元,其移動該支撐基台;以及固定機構,其將該晶片卡盤固定於該支撐基台,並且,該固定機構具有從該晶片卡盤往側邊放射狀地延伸之多個板彈簧,該多個板彈簧與該晶片卡盤的周圍的該支撐基台連接,藉由該多個板彈簧彼此互相拉伸而將該晶片卡盤能傾動地支撐於空中。
較佳為,該晶片卡盤在與吸引元件晶片之面為相反側的面連接有具可撓性之管,透過該管使來自吸引源的負壓作用於該晶片卡盤。
根據本發明的另一態樣,提供一種黏晶機,其將元件晶片搬送至基板的固定位置,以雷射光線進行加熱並固定,且具備:卡盤台,其固定該基板;晶片搬送裝置,其將晶片搬送至固定於該卡盤台之該基板;以及雷射接合單元,其對被搬送至該基板之晶片照射雷射光線而進行加熱,將該晶片的電極進行加熱而與該基板的電極連接,並且,該晶片搬送裝置包含:晶片卡盤,其吸引保持元件晶圓的一側的面;支撐基台,其能傾動地固定該晶片卡盤;移動單元,其移動該支撐基台;以及固定機構,其將該晶片卡盤固定於該支撐基台,並且,該固定機構具有從該晶片卡盤往側邊放射狀地延伸之多個板彈簧,該多個板彈簧與該晶片卡盤的周圍的該支撐基台連接,藉由該多個板彈簧彼此互相拉伸而將該晶片卡盤能傾動地支撐於空中。
[發明功效]
本發明發揮可抑制固定元件晶片之位置的偏差之功效。
以下,針對本發明的實施方式,一邊參照圖式一邊詳細地說明。本發明不受限於以下的實施方式所記載之內容。並且,以下所記載之構成要素中包含本發明所屬技術領域中具有通常知識者容易思及者、實質上相同者。再者,以下所記載之構成能進行適當組合。並且,在不背離本發明的主旨之範圍內可進行構成的各種省略、取代或變更。
基於圖式,說明本發明的實施方式之晶片搬送裝置及黏晶機。圖1係示意性地表示實施方式之黏晶機的構成例之圖。圖2係元件晶片被圖1所示之黏晶機的搬送單元拾取之晶圓的立體圖。圖3係被圖1所示之黏晶機的搬送單元拾取之元件晶片的立體圖。圖4係藉由圖1所示之黏晶機而安裝元件晶片之基板的立體圖。
實施方式之圖1所示之黏晶機1係從圖2所示之晶圓200拾取被分割成一個個之圖3所示之元件晶片201,且將所拾取之元件晶片201安裝於圖4所示之基板220之裝置。
(晶圓)
在實施方式中,元件晶片201被圖1所示之黏晶機1拾取之晶圓200係將矽、藍寶石、鎵等做成基板202之圓板狀的半導體晶圓或光元件晶圓等。晶圓200係在基板202的正面的藉由形成為格子狀之多條分割預定線而被劃分成格子狀之區域形成有元件203。在實施方式中,晶圓200係在正面204的背側的背面205黏貼有已將環狀框架211裝設於外周緣之黏著膠膜210,而被環狀框架211所支撐。並且,晶圓200係沿著分割預定線而被單體化成一個個元件晶片201。
(元件晶片)
如圖3所示,元件晶片201具備:基板202;以及元件203,其形成於基板202的正面。在實施方式中,元件晶片201在基板202內設置未圖示之貫通電極(亦稱為Through-Silicon Via(TSV,矽穿孔)電極),且在形成有元件203之正面204的背側的背面205側具有凸塊206(相當於電極),所述凸塊206安裝於基板202且與貫通電極連接。
並且,元件晶片201的元件203的正面被氧化膜等所保護。各元件晶片201亦即晶圓200係在銅或焊料等配置於凸塊206之狀態下黏貼於黏著膠膜210。此外,對元件晶片201與晶圓200的相同部分標註相同符號並進行說明。元件晶片201的正面204為元件晶片201的一側的面。
(基板)
基板220如圖4所示地形成為矩形狀,在正面形成有藉由焊料固定凸塊206之未圖示之電極,且具備導體圖案,所述導體圖案係將電極彼此遵循預定之圖案而電性連接。
(黏晶機)
黏晶機1係將元件晶片201從晶圓200搬送至基板220的預定的電極(相當於固定位置)上,且以雷射光線31進行加熱而將凸塊206固定於預定的電極之裝置,亦即,係將元件晶片201固定並安裝於基板220的預定的電極之裝置。如圖1所示,黏晶機1具備拾取台10、卡盤台20、雷射接合單元30、晶片搬送裝置亦即搬送單元40及未圖示之控制單元。
拾取台10以與水平方向呈平行之保持面11固定晶圓200。拾取台10為圓筒狀且能在水平方向移動之工作台,且將環狀框架211支撐於保持面11。拾取台10在內部具有晶片頂起單元,所述晶片頂起單元透過黏著膠膜210而頂起元件晶片201。拾取台10係內部的空間透過未圖示之吸引路徑而與未圖示之真空吸引源連接。保持面11透過黏著膠膜210而載置晶圓200的背面205側。在拾取台10的周圍配置有多個夾具12,所述夾具12夾持將晶圓200支撐於開口內之環狀框架211。拾取台10藉由內部的空間被真空吸引源吸引,而透過黏著膠膜210吸引保持載置於保持面11上之晶圓200,且以夾具12夾持環狀框架211。拾取台10係在將晶圓200吸引保持於保持面11之狀態下,晶片頂起單元透過黏著膠膜210而頂起元件晶片201。
卡盤台20以與水平方向呈平行之保持面21固定基板220。保持面21為由多孔陶瓷等所形成之矩形狀,且透過未圖示之吸引路徑而與未圖示之真空吸引源連接。保持面21載置基板220。卡盤台20藉由保持面21被真空吸引源吸引,而吸引保持載置於保持面21上之基板220,將基板220固定於保持面21。
雷射接合單元30對被搬送至基板220的預定的電極上之元件晶片201照射雷射光線31而進行加熱,加熱元件晶片201的凸塊206使焊料暫時融化,而將元件晶片201的凸塊206固定、連接於基板220的電極。雷射接合單元30因對每一個固定於基板220之元件晶片201照射雷射光線31而進行加熱,故亦可變更對每個元件晶片201進行加熱之溫度,即使在雷射光線31的照射點之中亦可調整所期望的區域的能量密度。因此,雷射接合單元30可進行調整,所述調整為照射使在元件晶片201之中凸塊密集之區域的能量密度變高之雷射光線31等。
搬送單元40從被保持於拾取台10之晶圓200拾取元件晶片201,將所拾取之元件晶片201搬送往固定於卡盤台20之基板220的預定的電極上。
接著,基於圖式說明搬送單元40。圖5係表示圖1所示之黏晶機的搬送單元的主體部、支撐基台、固定機構、晶片卡盤等之立體圖。圖6係以剖面表示圖5所示之搬送單元的主體部、支撐基台、固定機構、晶片卡盤等之立體圖。圖7係表示圖5所示之搬送單元的支撐基台、固定機構、晶片卡盤之立體圖。圖8係表示圖7所示之固定機構及晶片卡盤之立體圖。圖9係圖8所示之固定機構及晶片卡盤的剖面圖。圖10係示意性地表示圖9所示之晶片卡盤傾動之狀態之剖面圖。圖11係示意性地表示圖10所示之晶片卡盤的傾動中心之俯視圖。
如圖1所示,搬送單元40具備:晶片卡盤41,其吸引保持元件晶片201的正面204;支撐基台42,其能傾動地固定晶片卡盤41;主體部43,其安裝有支撐基台42及雷射接合單元30;移動單元44,其移動支撐基台42;固定機構60(圖5等所示),其將晶片卡盤41固定於支撐基台42;以及攝影機單元45。
如圖1所示,在主體部43安裝有雷射接合單元30。並且,如圖5及圖6所示,主體部43一體地具備圓筒部46。
移動單元44藉由將主體部43橫越拾取台10的上方與卡盤台20的上方移動,而移動支撐基台42。如圖1所示,移動單元44具備水平移動單元47與升降單元48。水平移動單元47將主體部43橫越拾取台10的上方與卡盤台20的上方而沿著水平方向移動。升降單元48將主體部43亦即支撐基台42沿著垂直方向升降。
攝影機單元45安裝於主體部43,且拍攝被保持於拾取台10之晶圓200及被保持於卡盤台20之基板220。攝影機單元45具備沿著垂直方向拍攝位於下方之物之CCD(Charge Coupled Device,電荷耦合元件)攝像元件或CMOS(Complementary MOS,互補金屬氧化物半導體)攝像元件等攝像元件。攝影機單元45亦可為IR(紅外線)攝影機,此情形,可拍攝基板220的配線的電極,且亦可從元件晶片201的正面204側拍攝元件晶片201的背面205側的凸塊206,而變得能以一個攝影機進行基板220的配線的電極與元件晶片201的背面205側的凸塊206的對位。
攝影機單元45取得攝像元件所拍攝之圖像,將所取得之圖像輸出至控制單元。並且,攝影機單元45拍攝被保持於拾取台10的保持面11之晶圓200,取得用於執行對準的圖像,所述對準係進行晶圓200與晶片卡盤41的對位。此外,所謂對準,係指將晶片卡盤41相對於保持於拾取台10之晶圓200而定位於可僅吸引保持晶圓200的多個元件晶片201之中所期望的元件晶片201之位置。
並且,攝影機單元45拍攝被保持於卡盤台20的保持面21之基板220,取得用於執行對準的圖像,所述對準係進行基板220與晶片卡盤41的對位。此外,所謂對準,係指將晶片卡盤41定位於可將晶片卡盤41所保持之元件晶片201載置於被保持於卡盤台20之基板220的預定的電極上之位置。
支撐基台42被形成為筒狀。在實施方式中,如圖5、圖6及圖7所示,支撐基台42被形成為圓環狀。在實施方式中,支撐基台42被形成為內外徑大於圓筒部46的外徑,且在主體部43的下端固定於與圓筒部46成為同軸之位置。
圖6、圖7、圖8及圖9所示,晶片卡盤41具備卡盤構件49與吸引力傳遞構件50。在實施方式中,卡盤構件49與吸引力傳遞構件50被形成為俯視形狀為四角形(在實施方式中為正方形)的扁平的板狀。卡盤構件49的厚度比吸引力傳遞構件50的厚度更薄。
晶片卡盤41係將卡盤構件49安裝於固定機構60的彈簧構件61的下表面,且將吸引力傳遞構件50安裝於彈簧構件61的上表面。卡盤構件49的下表面係與拾取台10上的晶圓200及卡盤台20上的基板220沿著垂直方向相對之支撐面51(相當於支撐被吸引之元件晶片201之面)。支撐面51係為了防止作用於晶片卡盤41的凹部之負壓的洩漏而將元件晶片201與凹部的空間密封並支撐元件晶片201之面。卡盤構件49具備:凹部53,其從外緣被框部52包圍之支撐面51凹陷;以及多個柱部54,其從凹部53的底立設,所述卡盤構件49係吸引孔55在厚度方向貫通。框部52的前端面為支撐面51。柱部54的前端面位於與支撐面51相同平面上。吸引孔55貫通卡盤構件49的中央,且在凹部53的底設有開口。晶片卡盤41因有凹部53,故即使在元件晶片201的被吸引之面有一些凹凸亦可進行吸引保持。
吸引力傳遞構件50係透過貫通彈簧構件61之孔66而使與卡盤構件49的吸引孔55連通之連通孔56(圖6及圖9所示)貫通中央。連通孔56在吸引力傳遞構件50的支撐面51的相反側的面亦即上表面設有開口。如圖6所示,吸引力傳遞構件50的支撐面51的相反側的面亦即上表面連接有管57,所述管57係與連通孔56連通且由具有可撓性之樹脂等所構成。管57係通過圓筒部46內而與吸引源58連接。
晶片卡盤41係在與支撐面51為相反側的吸引力傳遞構件50的上表面連接有管57,並透過管57而與吸引源58連接。晶片卡盤41使元件晶片201的正面204接觸支撐面51,透過管57使來自吸引源58的負壓作用於晶片卡盤41的凹部53,吸引支撐面51,藉此將元件晶片201吸引保持於支撐面51。
如圖6所示,固定機構60具備彈簧構件61與彈簧固定構件62。彈簧構件61係由公知的彈簧鋼而被形成為薄板狀。彈簧構件61因由彈簧鋼所形成,故彈性變形自如。彈簧構件61一體地具備卡盤固定部63、多個板彈簧64及板彈簧固定部65。卡盤固定部63被形成為俯視形狀為四角形(在實施方式中,為正方形)。在實施方式中,卡盤固定部63的俯視形狀係與卡盤構件49及吸引力傳遞構件50的俯視形狀為相同形狀。卡盤固定部63中,孔66貫通中央,在下表面安裝有卡盤構件49,且在上表面安裝有吸引力傳遞構件50。
設有至少兩條板彈簧64。在實施方式中,板彈簧64設有四條。板彈簧64係一端與卡盤固定部63連接,且往遠離卡盤固定部63之方向直線狀地延伸。在實施方式中,互相相鄰之板彈簧64彼此形成之角度為90度。在本發明中,互相相鄰之板彈簧64彼此形成之角度為將360度除以板彈簧64的數量而計算出之角度。如此,板彈簧64係從卡盤固定部63在以此卡盤固定部63為中心之圓周方向等間隔地配置,且從安裝於卡盤固定部63之晶片卡盤41往側邊放射狀地延伸。板彈簧固定部65被形成為圓環狀,且將板彈簧64的遠離卡盤固定部63之側的另一端彼此連結。
彈簧固定構件62被形成為內外徑與支撐基台42同等的圓環狀,且在與支撐基台42之間夾持將彈簧構件61的板彈簧64的另一端彼此連結而成之板彈簧固定部65並安裝於支撐基台42。板彈簧64係在支撐基台42與彈簧固定構件62之間夾持將另一端彼此連結而成之板彈簧固定部65,且與晶片卡盤41的周圍的支撐基台42連接。彈簧固定構件62係在與支撐基台42之間夾持將彈簧構件61的板彈簧64的另一端彼此連結而成之板彈簧固定部65,而將彈簧構件61固定於支撐基台42。
固定機構60的彈簧構件61係藉由彈簧鋼所形成,且彈簧構件61的尤其是板彈簧64為彈性變形自如。並且,固定機構60的板彈簧64的一端係與安裝於晶片卡盤41之卡盤固定部63連接,另一端係藉由彈簧固定構件62而被固定於支撐基台42。因此,固定機構60中,若板彈簧64彈性變形,則板彈簧64產生將板彈簧64本身的兩端彼此互相拉伸之彈性恢復力。固定機構60藉由已彈性變形之板彈簧64將兩端彼此互相拉伸,而晶片卡盤41能傾動地被支撐於支撐基台42的內側的空間內。
此外,本發明中所謂的晶片卡盤41能傾動地被支撐,係指晶片卡盤41在以晶片卡盤41為中心之圓周方向的任一側視下,皆位於俯視下之中心且以傾動中心70(圖10及圖11所示)為中心旋轉自如,所述傾動中心70為將彈簧構件61亦即板彈簧64的厚度進行二等分之位置。在板彈簧64未彈性變形之狀態下,傾動中心70與被保持於支撐面51之元件晶片201的下表面之距離h(圖12所示)係大於0mm且10mm以下,較佳為5mm以下,更佳為2mm以下。
控制單元分別控制黏晶機1的上述之各構成要素,使黏晶機1實施各元件晶片201的搬送動作與元件晶片201的固定動作。控制單元為具有以下裝置之電腦:運算處理裝置,其具有如CUP(central processing unit,中央處理器)般的微處理器;記憶裝置,其具有如ROM(read only memory,唯讀記憶體)或RAM(random access memory,隨機存取記憶體)般的記憶體;以及輸入輸出介面裝置。控制單元的運算處理裝置遵循被記憶於記憶裝置之電腦程式而實施運算處理,將用於控制黏晶機1的控制訊號透過輸入輸出介面裝置輸出至黏晶機1的上述之各構成要素。
並且,控制單元係與顯示單元及輸入單元連接,所述顯示單元具有顯示搬送動作及固定動作的狀態或圖像等之顯示畫面,所述輸入手段係與控制單元連接且在操作員將資訊等輸入黏晶機1的控制單元之際使用。
接著,說明實施方式之黏晶機1的搬送動作及固定動作。圖12係示意性地說明圖10所示之晶片卡盤將元件晶片載置於基板之際的偏差之圖。圖13係示意性地表示對圖10所示之晶片卡盤所載置之元件晶片照射雷射光線之狀態之側視圖。
黏晶機1將晶圓200載置於拾取台10,且將基板220載置於卡盤台20,並透過輸入手段等而將動作條件輸入控制單元。若控制單元受理操作員的動作開始指示,則黏晶機1將晶圓200吸引保持於拾取台10的保持面11,並將基板220吸引保持於卡盤台20的保持面11。
黏晶機1中,控制單元控制移動單元44,將攝影機單元45定位於拾取台10上的晶圓200的上方,以攝影機單元45拍攝拾取台10上的晶圓200,執行晶片卡盤41與晶圓200的對準,使晶片卡盤41的支撐面51抵接搬送對象的元件晶片201。黏晶機1中,控制單元將搬送對象的元件晶片201吸引保持於晶片卡盤41的支撐面51,控制單元控制移動單元44,從黏著膠膜210拾取已吸引保持於晶片卡盤41的支撐面51之搬送對象的元件晶片201,將攝影機單元45定位於卡盤台20上的基板220的上方。
黏晶機1係控制單元以攝影機單元45拍攝卡盤台20上的基板220,執行晶片卡盤41與基板220的對準,將吸引保持於晶片卡盤41的支撐面51之元件晶片201定位於基板220的預定的電極上。黏晶機1中,控制單元控制移動單元44,使吸引保持於晶片卡盤41的支撐面51之元件晶片201下降。
此時,在基板220與已吸引保持元件晶片201之晶片卡盤41如圖12般地傾斜之情形中,吸引保持於晶片卡盤41之元件晶片201的角抵接基板220,且隨著元件晶片201下降,板彈簧64以元件晶片201與基板220成為平行之方式進行彈性變形。然後,若將元件晶片201載置於基板220上,則元件晶片201與基板220成為平行。
說明晶片卡盤41的從傾動中心70起至支撐面51為止的距離與元件晶片201相對於基板220之偏差。圖12中,從虛線所示之位置起至實線所示為止,晶片卡盤41相對於基板220之傾斜會變化,藉此元件晶片201會沿著基板220移動ΔX並偏差。
若使用前述之距離h、圖12中從虛線所示之位置起至實線所示為止晶片卡盤41相對於基板220之傾斜的變化θ,則此元件晶片201的移動距離亦即偏差ΔX可藉由以下的式1表示。
ΔX=hsinθ・・・式1
黏晶機1中,若將元件晶片201載置於基板220的預定的電極上,則停止元件晶片201往支撐面51的吸引保持,控制單元控制移動單元44,使晶片卡盤41上升。黏晶機1控制移動單元44,使雷射接合單元30與載置於基板220的預定的電極上之元件晶片201相對後,如圖13所示,從雷射接合單元30將雷射光線31照射至元件晶片201,將元件晶片201固定於基板220。
若黏晶機1將以動作條件決定之元件晶片201依序搬送至基板220並固定於基板220,則結束搬送動作及固定動作。
如以上說明,實施方式之搬送單元40及黏晶機1,因將晶片卡盤41的卡盤構件49安裝於傾動自如地支撐晶片卡盤41之板彈簧64的下表面,故可抑制前述之距離h。
其結果,搬送單元40及黏晶機1藉由式1而發揮可抑制固定元件晶片201之位置的偏差ΔX之功效。
並且,因實施方式之搬送單元40及黏晶機1為以板彈簧64懸吊之構成,所述板彈簧64從吸引保持元件晶片201之晶片卡盤41往側邊放射狀地延伸且彼此互相拉伸,故可抑制晶片卡盤41的往橫方向的偏差ΔX,且晶片卡盤41能往上下方向移動,因此也發揮可吸收將元件晶片201裝配於基板220之際的衝擊之功效。
尤其,實施方式之搬送單元40及黏晶機1藉由極力縮小晶片卡盤41的吸引保持元件晶片201之支撐面51與板彈簧64的高度的差,而即使晶片卡盤41已傾斜,亦極力縮小元件晶片201往橫方向的偏差ΔX。
實施方式之搬送單元40及黏晶機1在例如傾度的變化θ為0.01rad之情形中,藉由將距離h設成0.5mm以下,可藉由式1而將偏差ΔX設成5μm以下。
此外,本發明不受限於上述實施方式等。亦即,在不背離本發明的精神之範圍內可進行各種變形並實施。在本發明中,亦可為所謂覆晶接合,其以晶片卡盤41的支撐面51吸引保持元件晶片201的與元件面為相反側的背面205並配置於基板220。
1:黏晶機
20:卡盤台
30:雷射接合單元
31:雷射光線
40:搬送單元(晶片搬送裝置)
41:晶片卡盤
42:支撐基台
44:移動單元
51:支撐面(吸引之面)
57:管
58:吸引源
60:固定機構
64:板彈簧
201:元件晶片
204:正面(一側的面)
206:凸塊(電極)
220:基板
圖1係示意性地表示實施方式之黏晶機的構成例之圖。
圖2係元件晶片被圖1所示之黏晶機的搬送單元拾取之晶圓的立體圖。
圖3係被圖1所示之黏晶機的搬送單元拾取之元件晶片的立體圖。
圖4係藉由圖1所示之黏晶機而安裝元件晶片之基板的立體圖。
圖5係圖1所示之黏晶機的立體圖。
圖6係以縱剖面表示圖5所示之黏晶機的一部分之立體圖。
圖7係表示圖5所示之搬送單元的支撐基台之立體圖。
圖8係表示裝配於圖7所示之支撐基台之固定機構及晶片卡盤之立體圖。
圖9係圖8所示之固定機構及晶片卡盤的剖面圖。
圖10係示意性地表示圖9所示之晶片卡盤傾動之狀態之剖面圖。
圖11係示意性地表示圖10所示之晶片卡盤的傾動中心之俯視圖。
圖12係示意性地表示圖10所示之晶片卡盤將元件晶片載置於基板之際的偏差之圖。
圖13係示意性地表示對圖10所示之晶片卡盤所載置之元件晶片照射雷射光線之狀態之側視圖。
1:黏晶機
40:搬送單元(晶片搬送裝置)
41:晶片卡盤
42:支撐基台
43:主體部
46:圓筒部
49:卡盤構件
50:吸引力傳遞構件
55:吸引孔
56:連通孔
57:管
58:吸引源
60:固定機構
61:彈簧構件
62:彈簧固定構件
63:卡盤固定部
64:板彈簧
65:板彈簧固定部
Claims (3)
- 一種晶片搬送裝置,其將元件晶片搬送往基板的固定位置,且特徵在於,具備: 晶片卡盤,其吸引保持元件晶圓的一側的面; 支撐基台,其能傾動地固定該晶片卡盤; 移動單元,其移動該支撐基台;以及 固定機構,其將該晶片卡盤固定於該支撐基台, 該固定機構具有從該晶片卡盤往側邊放射狀地延伸之多個板彈簧, 該多個板彈簧與該晶片卡盤的周圍的該支撐基台連接,藉由該多個板彈簧彼此互相拉伸而將該晶片卡盤能傾動地支撐於空中。
- 如請求項1之晶片搬送裝置,其中,該晶片卡盤在與吸引該元件晶片之面為相反側的面連接有具可撓性之管,透過該管使來自吸引源的負壓作用於該晶片卡盤。
- 一種黏晶機,其將元件晶片搬送至基板的固定位置,以雷射光線進行加熱並固定,且具備: 卡盤台,其固定該基板; 晶片搬送裝置,其將晶片搬送至固定於該卡盤台之該基板;以及 雷射接合單元,其對被搬送至該基板之晶片照射雷射光線而進行加熱,將該晶片的電極進行加熱而與該基板的電極連接, 該晶片搬送裝置包含: 晶片卡盤,其吸引保持元件晶圓的一側的面; 支撐基台,其能傾動地固定該晶片卡盤; 移動單元,其移動該支撐基台;以及 固定機構,其將該晶片卡盤固定於該支撐基台, 該固定機構具有從該晶片卡盤往側邊放射狀地延伸之多個板彈簧, 該多個板彈簧與該晶片卡盤的周圍的該支撐基台連接,藉由該多個板彈簧彼此互相拉伸而將該晶片卡盤能傾動地支撐於空中。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-123711 | 2021-07-28 | ||
JP2021123711A JP2023019189A (ja) | 2021-07-28 | 2021-07-28 | チップ搬送装置及びダイボンダ |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202305999A true TW202305999A (zh) | 2023-02-01 |
Family
ID=85038180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111127794A TW202305999A (zh) | 2021-07-28 | 2022-07-25 | 晶片搬送裝置及黏晶機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11929344B2 (zh) |
JP (1) | JP2023019189A (zh) |
KR (1) | KR20230017732A (zh) |
CN (1) | CN115692278A (zh) |
TW (1) | TW202305999A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI826308B (zh) * | 2023-04-21 | 2023-12-11 | 梭特科技股份有限公司 | 利用正壓保持晶圓或晶粒的位置的移載裝置及方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023019189A (ja) * | 2021-07-28 | 2023-02-09 | 株式会社ディスコ | チップ搬送装置及びダイボンダ |
CN116906423B (zh) * | 2023-07-31 | 2024-03-08 | 东莞市鼎力自动化科技有限公司 | 一种晶拖和塑胶板的粘合装置 |
CN116884887B (zh) * | 2023-09-06 | 2023-12-08 | 北京华卓精科科技股份有限公司 | 一种压合装置及压合方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4266106B2 (ja) * | 2001-09-27 | 2009-05-20 | 株式会社東芝 | 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法 |
JP5865639B2 (ja) | 2011-09-15 | 2016-02-17 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
JP2023019189A (ja) * | 2021-07-28 | 2023-02-09 | 株式会社ディスコ | チップ搬送装置及びダイボンダ |
-
2021
- 2021-07-28 JP JP2021123711A patent/JP2023019189A/ja active Pending
-
2022
- 2022-07-07 US US17/811,213 patent/US11929344B2/en active Active
- 2022-07-13 CN CN202210818768.4A patent/CN115692278A/zh active Pending
- 2022-07-18 KR KR1020220087896A patent/KR20230017732A/ko unknown
- 2022-07-25 TW TW111127794A patent/TW202305999A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI826308B (zh) * | 2023-04-21 | 2023-12-11 | 梭特科技股份有限公司 | 利用正壓保持晶圓或晶粒的位置的移載裝置及方法 |
Also Published As
Publication number | Publication date |
---|---|
US20230031977A1 (en) | 2023-02-02 |
US11929344B2 (en) | 2024-03-12 |
KR20230017732A (ko) | 2023-02-06 |
JP2023019189A (ja) | 2023-02-09 |
CN115692278A (zh) | 2023-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW202305999A (zh) | 晶片搬送裝置及黏晶機 | |
TWI782169B (zh) | 接合系統及接合方法 | |
WO2005112537A9 (ja) | 部品供給ヘッド装置及び部品実装ヘッド装置 | |
TW201732961A (zh) | 黏晶裝置及半導體裝置的製造方法 | |
CN112447574B (zh) | 裸片拾取模块和包括其的裸片接合装置 | |
EP1378932A2 (en) | Semiconductor chip mounting apparatus and mounting method | |
JP2000150970A (ja) | 発光素子のボンディング方法および装置 | |
JP2007003326A (ja) | トレー部品検査方法と装置 | |
JPH08162502A (ja) | 電子部品実装装置 | |
TWI692834B (zh) | 電子零件的封裝裝置以及封裝方法 | |
JP2013093509A (ja) | 半導体装置の製造方法、及び半導体製造装置 | |
TWI765549B (zh) | 電子零件的安裝裝置 | |
TWI827281B (zh) | 電子零件的安裝裝置及電子零件的安裝方法 | |
KR20190118359A (ko) | 듀얼 헤드 플립칩 본딩 장치 | |
TWI835316B (zh) | 電子零件的操作裝置、安裝裝置及安裝方法 | |
KR20210029413A (ko) | 다이 본딩 장치 | |
JP3666471B2 (ja) | ワークの位置決め装置およびワークの位置決め方法 | |
JP2003092313A (ja) | チップ反転装置およびダイボンダ | |
KR101584672B1 (ko) | 반도체 칩 가압 본딩장치 | |
JPH08139096A (ja) | 電子部品及び電子部品の実装方法並びに電子部品の実装装置 | |
TWI807957B (zh) | 電子零件的安裝裝置 | |
TW202314939A (zh) | 電子零件的操作裝置、安裝裝置及安裝方法 | |
JPH06140470A (ja) | フリップチップボンディング装置 | |
KR20180001890A (ko) | 실리콘 기판 직접 접합 방법, 그 장치, 및 실리콘 기판 직접 접합 장치의 정렬부 검증 방법 | |
KR20160068070A (ko) | 반도체 칩 상승장치 |