TW202305916A - Processing device - Google Patents
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- TW202305916A TW202305916A TW111111972A TW111111972A TW202305916A TW 202305916 A TW202305916 A TW 202305916A TW 111111972 A TW111111972 A TW 111111972A TW 111111972 A TW111111972 A TW 111111972A TW 202305916 A TW202305916 A TW 202305916A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0616—Grinders for cutting-off using a tool turning around the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
Description
本發明是有關一種對被加工物進行加工之加工裝置。The present invention relates to a processing device for processing workpieces.
IC(積體電路,Integrated Circuit)以及LSI(大型積體電路,Large Scale Integration)等之器件的晶片是在行動電話以及個人電腦等的各種電子機器中不可或缺之構成要素。Chips of devices such as IC (Integrated Circuit) and LSI (Large Scale Integration) are indispensable components in various electronic devices such as mobile phones and personal computers.
這樣的晶片是藉由例如使用切削裝置,來將於正面形成有多數個器件之晶圓等的被加工物按一個個的包含器件之區域來分割而被製造(參照例如專利文獻1)。此切削裝置具備切削單元,前述切削單元具有例如在前端部裝設有切削刀片(加工具)之主軸、及使此主軸旋轉之馬達。Such a wafer is manufactured by, for example, using a cutting device to divide a workpiece such as a wafer on which a plurality of devices are formed on the front side into regions including devices (see, for example, Patent Document 1). This cutting device includes a cutting unit including, for example, a main shaft on which a cutting blade (processing tool) is mounted at a front end, and a motor that rotates the main shaft.
此外,此切削刀片具有分散有磨粒之圓環狀的切刃(加工磨石)。並且,切削裝置是一邊藉由馬達使裝設於主軸的前端部之切削刀片旋轉,一邊使切削刀片的切刃接觸於被加工物來切削並分割被加工物。In addition, this cutting insert has an annular cutting edge (processing grindstone) in which abrasive grains are dispersed. In addition, the cutting device cuts and divides the workpiece by bringing the cutting edge of the cutting blade into contact with the workpiece while rotating the cutting blade mounted on the front end of the main shaft by the motor.
又,用於晶片的製造之被加工物,大多會以晶片的小型化以及輕量化等為目的,而使用磨削裝置在其分割前進行薄化。此磨削裝置具備磨削單元,前述磨削單元具有例如在前端部裝設有磨削輪(加工具)之主軸、及使此主軸旋轉之馬達。In addition, many workpieces used in the manufacture of wafers are thinned before being divided using a grinding device for the purpose of miniaturization and weight reduction of wafers. This grinding device includes a grinding unit having, for example, a main shaft on which a grinding wheel (grinding tool) is attached to a front end, and a motor that rotates the main shaft.
此外,此磨削輪具有圓環狀的輪基台、與固定於此輪基台的一面之複數個磨削磨石(加工磨石)。並且,磨削裝置一邊藉由馬達使裝設於主軸的前端部之磨削輪旋轉,一邊使複數個磨削磨石接觸於被加工物,藉此將被加工物磨削並薄化。 先前技術文獻 專利文獻 In addition, this grinding wheel has an annular wheel base and a plurality of grinding stones (processing grindstones) fixed to one surface of the wheel base. In addition, the grinding device makes the plurality of grinding stones contact the workpiece while the motor rotates the grinding wheel mounted on the front end of the main shaft, thereby grinding and thinning the workpiece. prior art literature patent documents
專利文獻1:日本特開2010-129623號公報Patent Document 1: Japanese Patent Laid-Open No. 2010-129623
發明欲解決之課題The problem to be solved by the invention
在切削裝置以及磨削裝置等的加工裝置中,若在加工具(切削刀片或磨削輪)的旋轉速度較低的狀態下進行被加工物的加工(切削或磨削),施加於被加工物之負荷(加工負荷)會增大。In processing devices such as cutting devices and grinding devices, if the processing (cutting or grinding) of the workpiece is performed at a low rotational speed of the processing tool (cutting blade or grinding wheel), the Material load (processing load) will increase.
並且,在此情況下,會有以下疑慮:產生在被加工物形成破裂(缺損)及裂隙之類的加工不良,而使藉由分割被加工物所製造之晶片的品質降低。In addition, in this case, there is a possibility that processing defects such as cracks (defects) and cracks are formed in the workpiece, and the quality of wafers manufactured by dividing the workpiece may be reduced.
有鑒於此點,本發明的目的在於提供一種可儘早發現阻礙包含於加工單元(切削單元或磨削單元)之主軸的旋轉的不良狀況之加工裝置。 用以解決課題之手段 In view of this point, an object of the present invention is to provide a machining device capable of early detection of a malfunction that inhibits rotation of a spindle included in a machining unit (cutting unit or grinding unit). means to solve problems
根據本發明的一個層面,可提供一種加工被加工物之加工裝置,前述加工裝置具備:加工單元,具有於前端部裝設有加工磨石之主軸、與使該主軸旋轉之馬達;及控制單元,控制該馬達的動作, 該控制單元包含判定部,前述判定部會依據藉由以事先設定之指定旋轉速度來使該主軸旋轉而得到之資訊,來判定有無該加工單元的不良狀況。 According to one aspect of the present invention, there is provided a processing device for processing a workpiece. The processing device includes: a processing unit having a main shaft on which a grinding stone is mounted at a front end; and a motor for rotating the main shaft; and a control unit. , to control the movement of the motor, The control unit includes a judging unit that judges whether there is a defect in the machining unit based on information obtained by rotating the spindle at a predetermined rotational speed set in advance.
此外,較佳的是,在本發明中,更具備測定該主軸的旋轉速度之旋轉速度測定單元,該判定部在依據以該旋轉速度測定單元所測定出之該主軸的旋轉速度,來計算從讓該馬達動作而使該主軸旋轉起到該主軸的旋轉速度達到該指定旋轉速度為止的所需時間後,會因應於該所需時間是否超出事先設定之閾值,來判定有無該加工單元的不良狀況。In addition, it is preferable that in the present invention, a rotation speed measuring unit for measuring the rotation speed of the main shaft is further provided, and the determination unit calculates a value from the rotation speed of the main shaft measured by the rotation speed measurement unit. After the motor is activated to rotate the spindle until the rotation speed of the spindle reaches the specified rotation speed, it will determine whether there is a defect in the processing unit according to whether the required time exceeds the preset threshold. situation.
或者,較佳的是,在本發明中,更具備負載電流值測定單元,前述負載電流值測定單元是測定使該主軸旋轉時的該馬達的負載電流值,該判定部是因應於使該主軸恆定地以該指定旋轉速度旋轉時,以該負載電流值測定單元所測定出之該負載電流值是否超出事先設定之閾值,來判定有無該加工單元的不良狀況。 發明效果 Alternatively, preferably, in the present invention, a load current value measuring unit is further provided, the aforementioned load current value measuring unit measures the load current value of the motor when the main shaft is rotated, and the determination unit responds to making the main shaft When constantly rotating at the specified rotation speed, it is determined whether there is a defect in the processing unit based on whether the load current value measured by the load current value measuring unit exceeds a preset threshold. Invention effect
在本發明中,控制使主軸旋轉之馬達的控制單元包含判定部,前述判定部會依據藉由以事先設定之指定旋轉速度來使主軸旋轉而得到之資訊,來判定有無加工單元的不良狀況。藉此,在本發明中,可儘早發現阻礙包含於加工單元(切削單元或磨削單元)之主軸的旋轉的不良狀況。In the present invention, the control unit that controls the motor that rotates the main shaft includes a determination unit that determines whether there is a defect in the machining unit based on information obtained by rotating the main shaft at a predetermined rotational speed set in advance. Thereby, in the present invention, it is possible to find a malfunction that hinders the rotation of the main shaft included in the machining unit (cutting unit or grinding unit) early.
用以實施發明之形態form for carrying out the invention
參照附加圖式來說明本發明的實施形態。圖1是示意地顯示本發明的加工裝置之一例(切削裝置)的立體圖。再者,圖1所示之X軸方向(前後方向、加工進給方向)以及Y軸方向(左右方向、分度進給方向)是在水平面上相互地垂直之方向,又,Z軸方向(上下方向)是垂直於X軸方向以及Y軸方向之方向(鉛直方向、切入進給方向)。Embodiments of the present invention will be described with reference to the attached drawings. Fig. 1 is a perspective view schematically showing an example (cutting device) of the processing device of the present invention. Furthermore, the X-axis direction (front-rear direction, machining feed direction) and the Y-axis direction (left-right direction, indexing feed direction) shown in FIG. 1 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction ( Up-down direction) is a direction perpendicular to the X-axis direction and the Y-axis direction (vertical direction, cutting feed direction).
圖1所示之切削裝置2具備可搭載各個構成要素之基台4。在基台4的上部安裝有覆蓋基台4的上表面側之罩蓋6。在罩蓋6的內部容置有切削被加工物11之切削單元(加工單元)8。此切削單元8已連接於切削單元移動機構(未圖示),且可例如沿著Y軸方向以及Z軸方向來移動。再者,有關於切削單元8的細節將於後文敘述。The
於切削單元8的下方設置有保持被加工物11之工作夾台10。工作夾台10已連接於工作夾台移動機構(未圖示),且可例如沿著X軸方向來移動。又,工作夾台10已連接於旋轉機構(未圖示),且可將大致平行於Z軸方向之直線作為旋轉軸來旋轉。Below the
在基台4的角部設置有片匣工作台12。在片匣工作台12的上表面載置有可容置複數個被加工物11之片匣14。此片匣工作台12已連接於片匣工作台移動機構(未圖示),且可例如沿著Z軸方向來移動。此片匣工作台移動機構會將已載置在片匣工作台12之片匣14的高度調整成可以適當地搬出搬入被加工物11。A cassette table 12 is provided at a corner of the base 4 . A
於罩蓋6的側面6a設置有作為使用者介面之觸控面板式的監視器(monitor)16。又,在罩蓋6的上表面6b設置有警告燈(指示燈(pilot lamp))18。並且,上述之切削裝置2的構成要素已連接於控制單元(在圖1中未圖示)。此控制單元具有中央處理裝置(CPU)、與包含主記憶裝置(揮發性記憶體)以及輔助記憶裝置(非揮發性記憶體)之記憶裝置,且可控制上述之切削裝置2的構成要素的動作。A touch panel-type monitor (monitor) 16 as a user interface is provided on the
圖2是示意地顯示切削單元(加工單元)8的局部剖面側視圖。切削單元8具有以大致平行於Y軸方向之直線作為旋轉軸而旋轉之主軸20。此主軸20容置在構成為筒狀之殼體22的內側的空間。在殼體22的內部(壁材的內部)設置有相對於主軸20的旋轉軸大致平行之空氣供給路22a。FIG. 2 is a partial sectional side view schematically showing a cutting unit (machining unit) 8 . The
空氣供給路22a是透過空氣供給口22b而連接於外部的空氣供給源(未圖示)。又,空氣供給路22a是透過第1供給路22c而連接於徑向空氣軸承部(徑向空氣軸承(radial air bearing))24,且透過第2供給路22d而連接於推力空氣軸承部(推力空氣軸承(thrust air bearing))26。The
可藉由從空氣供給源對徑向空氣軸承部24以及推力空氣軸承部26供給高壓的空氣,而將主軸20在殼體22的內側空間內保持為懸浮之狀態。例如,徑向空氣軸承部24是藉由朝向主軸20噴附垂直於該旋轉軸的方向之空氣,而將主軸20的位置在垂直於旋轉軸的方向上保持為一定。By supplying high-pressure air from an air supply source to the radial
另一方面,推力空氣軸承部26是藉由朝向設置於主軸20之圓盤狀的推力板(thrust plate)20a噴附平行於主軸20的旋轉軸的方向之空氣,而將主軸20的位置在平行於旋轉軸的方向上保持為一定。藉由徑向空氣軸承部24以及推力空氣軸承部26,可穩定地支撐高速旋轉之主軸20。On the other hand, the thrust
在殼體22的一端(前端)側設置有開口部22e。主軸20是將其一端部(前端部)20b插入開口部22e,以從殼體22露出。亦即,主軸20的前端部20b是從殼體22的開口部22e朝外側突出。圖3是示意地顯示主軸20的前端之構造的分解立體圖。An opening 22 e is provided on one end (front end) side of the
於主軸20的前端設置有安裝座28。安裝座28具有圓盤狀的凸緣部30、與從凸緣部30的正面30a的中央部突出之圓筒狀的支撐軸32。於凸緣部30的外周部設有從正面30a突出之環狀的凸部30b。凸部30b的前端面30c是形成為相對於正面30a大致平行。A
在支撐軸32的外周面形成有牙山32a。又,於支撐軸32的前端面的中央部形成有凹部32b。可於支撐軸32裝設對被加工物11進行切削之環狀的切削刀片(加工具)34。切削刀片34具有由鋁(Al)等金屬材料所構成之環狀的基台36、及沿著基台36的外周緣而形成之環狀的切刃(加工磨石)38。A
在基台36的中央部設置有將基台36朝厚度方向貫通成可供支撐軸32插入之開口36a。又,在基台36的開口36a的周圍設置有沿著基台36的厚度方向朝正面側突出之環狀的凸部36b。切刃38是藉由例如以鎳鍍敷層固定由鑽石等所構成之磨粒而形成。不過,對切刃38的磨粒以及結合材的材質並無限制,可因應於被加工物11的材質或加工內容等來合宜選擇。An
於支撐軸32的牙山32a可供用於固定切削刀片34之環狀的螺帽40緊固。在螺帽40的中央部形成有對應於支撐軸32的直徑之圓形的開口40a。在此開口40a形成有和已形成於支撐軸32的牙山32a對應之牙山。An
切削刀片34以對基台36的開口36a插入支撐軸32的方式裝設於安裝座28。並且,當將螺帽40螺合並鎖緊於支撐軸32的牙山32a時,切削刀片34會被凸緣部30的前端面30c與螺帽40夾持。藉此,可將包含切刃(加工磨石)38之切削刀片34裝設於主軸20的一端部(前端部)20b。The cutting
如圖2所示,在主軸20的另一端側連結有賦與用於使主軸20旋轉之力的馬達42。馬達42包含已固定於殼體22的內側之定子44、與已和主軸20一體化之轉子46。As shown in FIG. 2 , a
然後,主軸20會因應於作用在定子44與轉子46之間的磁力而旋轉。再者,在此雖然是將主軸20與轉子46一體化,但亦可為連結有各別形成之主軸20與轉子46。The
已供給至徑向空氣軸承部24以及推力空氣軸承部26之空氣的一部分,可透過主軸20的前端部20b與殼體22之間的間隙(開口部22e的一部分)往殼體22的外部排出(噴出)。可藉由此空氣的流動,將主軸20的前端部20b與殼體22的開口部22e之間的間隙密封(氣封(air seal))。Part of the air supplied to the radial
在此,在供給至徑向空氣軸承部24以及推力空氣軸承部26之空氣中混入異物,且/或此空氣的壓力瞬間降低的情況下,會有主軸20接觸到異物及/或殼體22等而損傷之情形。又,也有因切削單元8的維護中的誤操作(例如,在對徑向空氣軸承部24以及推力空氣軸承部26尚未供給有空氣之狀態下使主軸20旋轉等),而損傷主軸20之情形。Here, when a foreign matter is mixed into the air supplied to the radial
這種損傷也被稱為主軸刮傷,且會阻礙主軸20的旋轉。又,在馬達42已劣化之情況下也會阻礙主軸20的旋轉。有鑒於這些點,在切削裝置2中會在控制單元包含有判定部,前述判定部會判定有無像這樣的阻礙主軸20的旋轉之切削單元8的不良狀況。This damage is also known as spindle scratching and can impede the rotation of the
圖4以及圖5是示意地顯示用於判定有無阻礙主軸20的旋轉之切削單元8的不良狀況之切削裝置2的構成要素的圖。圖4及圖5所示之控制單元48可以控制已容置於殼體22之馬達42的動作,並使裝設於主軸20的前端部之切削刀片34旋轉。4 and 5 are diagrams schematically showing components of the
又,在圖4所示之切削裝置2中,設置有測定主軸20的旋轉速度之旋轉速度測定單元50。可隨時將以此旋轉速度測定單元50所測定出之主軸20的旋轉速度輸入到控制單元48。並且,控制單元48具有判定部48a,前述判定部48a是利用從旋轉速度測定單元50所輸入之資訊,來判定有無阻礙主軸20的旋轉之切削單元8的不良狀況。In addition, in the
在此判定所利用之資訊是例如以旋轉速度測定單元50所測定出之主軸20的旋轉速度。具體而言,判定部48a會依據以旋轉速度測定單元50所測定出之主軸20的旋轉速度,來計算從讓馬達42動作而使主軸20旋轉起到主軸20的旋轉速度達到指定旋轉速度為止的所需時間。然後,判定部48a會因應於所計算出之所需時間是否超出事先設定之閾值,來判定有無阻礙主軸20的旋轉之切削單元8的不良狀況。再者,亦可將此閾值事先記憶在控制單元48的記憶裝置。The information used in the determination here is, for example, the rotational speed of the
圖6是示意地顯示以旋轉速度測定單元50所測定出之到主軸20的旋轉速度達到指定旋轉速度V為止之主軸20的旋轉速度的隨時間的變化的例子的圖表。在以旋轉速度測定單元50所測定出之主軸20的旋轉速度以圖6所示之虛線A的形式變化的情況下,所計算之上述的所需時間不會超過閾值T1。在此情況下,判定部48a會判定為沒有阻礙主軸20的旋轉之切削單元8的不良狀況。FIG. 6 is a graph schematically showing an example of changes over time in the rotational speed of the
另一方面,在以旋轉速度測定單元50所測定出之主軸20的旋轉速度以圖6所示之一點鏈線B的形式變化的情況下,所計算之上述的所需時間會超過閾值T1。在此情況下,判定部48a會判定為有阻礙主軸20的旋轉之切削單元8的不良狀況。並且,在此情況下,控制單元48會控制監視器16及/或警告燈18,並向切削裝置2的操作人員通報切削單元8的不良狀況。On the other hand, when the rotational speed of the
又,在圖5所示之切削裝置2中,設置有測定使主軸20旋轉之馬達42的負載電流值之負載電流值測定單元52。可隨時將以此負載電流值測定單元52所測定出之馬達42的負載電流值輸入到控制單元48。並且,控制單元48具有判定部48b,前述判定部48b是利用從負載電流值測定單元52所輸入之資訊,來判定有無阻礙主軸20的旋轉之切削單元8的不良狀況。Further, in the
此判定所利用之資訊是例如在未進行由切削單元8所進行之被加工物11的切削的狀態下,使主軸20以指定旋轉速度恆定地旋轉時,以負載電流值測定單元52所測定出之馬達42的負載電流值。具體而言,判定部48b會因應於此負載電流值是否超出事先設定之閾值,來判定有無阻礙主軸20的旋轉之切削單元8的不良狀況。再者,亦可將此閾值事先記憶在控制單元48的記憶裝置。The information used for this determination is, for example, measured by the load current
圖7是示意地顯示以負載電流值測定單元52所測定出之到主軸20恆定地以指定旋轉速度旋轉為止之馬達42的負載電流值的隨時間變化的例子的圖表。在以負載電流值測定單元52所測定出之馬達42的負載電流值以圖7所示之虛線C的形式變化的情況下,主軸20恆定地以指定旋轉速度旋轉時之馬達42的負載電流值不會超過閾值T2。在此情況下,判定部48b會判定為沒有阻礙主軸20的旋轉之切削單元8的不良狀況。FIG. 7 is a graph schematically showing an example of the change with time of the load current value of the
另一方面,以負載電流值測定單元52所測定出之馬達42的負載電流值以圖7所示之一點鏈線D的形式變化的情況下,主軸20恆定地以指定旋轉速度旋轉時之馬達42的負載電流值會超過閾值T2。在此情況下,判定部48b會判定為有阻礙主軸20的旋轉之切削單元8的不良狀況。並且,在此情況下,控制單元48會控制監視器16及/或警告燈18,並向切削裝置2的操作人員通報切削單元8的不良狀況。On the other hand, when the load current value of the
在上述之切削裝置2中,控制使主軸20旋轉之馬達42的控制單元48包含判定部48a或判定部48b,前述判定部48a或判定部48b會依據藉由以事先設定之指定旋轉速度使主軸20旋轉而得到之資訊,來判定有無切削單元8的不良狀況。藉此,在上述之切削裝置2中,可儘早發現阻礙包含於切削單元8之主軸20的旋轉的不良狀況。In the above-mentioned
再者,上述之切削裝置2是本發明的加工裝置之一例,本發明之加工裝置並不限定於切削裝置2。例如,本發明之加工裝置的加工單元亦可為以下之切削單元:具有主軸與使此主軸旋轉之馬達,且前述主軸在前端部裝設有墊圈型的切削刀片(僅藉由環狀的切刃(加工磨石)所構成之切削刀片)。In addition, the above-mentioned
又,本發明之加工裝置亦可為磨削裝置,前述磨削裝置具備:加工單元,具有主軸與使此主軸旋轉之馬達,前述主軸在前端部裝設有包含複數個磨削磨石(加工磨石)之磨削輪;及控制單元,控制此馬達的動作。Moreover, the processing device of the present invention may also be a grinding device. The aforementioned grinding device includes: a processing unit having a main shaft and a motor to rotate the main shaft; grindstone) grinding wheel; and a control unit to control the movement of the motor.
又,本發明的加工裝置亦可具備包含判定部48a以及判定部48b之控制單元48、旋轉速度測定單元50及負載電流值測定單元52之全部。另外,上述之實施形態之構造及方法等,只要在不脫離本發明的目的之範圍內,皆可以合宜變更來實施。In addition, the processing apparatus of the present invention may include all of the
2:切削裝置
4:基台
6:罩蓋
6a:側面
6b:上表面
8:切削單元(加工單元)
10:工作夾台
11:被加工物
12:片匣工作台
14:片匣
16:監視器
18:警告燈(指示燈)
20:主軸
20a:推力板
20b:一端部(前端部)
22:殼體
22a:空氣供給路
22b:空氣供給口
22c:第1供給路
22d:第2供給路
22e:開口部
24:徑向空氣軸承部(徑向空氣軸承)
26:推力空氣軸承部(推力空氣軸承)
28:安裝座
30:凸緣部
30a:正面
30b,36b:凸部
30c:前端面
32:支撐軸
32a:牙山
34:切削刀片
36:基台
36a,40a:開口
38:切刃
40:螺帽
42:馬達
44:定子
46:轉子
48:控制單元
48a,48b:判定部
50:旋轉速度測定單元
52:負載電流值測定單元
A,C:虛線
B,D:一點鏈線
T1,T2:閾值
V:指定旋轉速度
X,Y,Z:方向
2: Cutting device
4: Abutment
6: cover
6a:
圖1是示意地顯示加工裝置之一例的立體圖。 圖2是示意地顯示加工單元之一例的局部剖面側視圖。 圖3是示意地顯示主軸的前端的構造之一例的分解立體圖。 圖4是示意地顯示用於判定有無阻礙主軸的旋轉之切削單元的不良狀況之切削裝置的構成要素之一例的圖。 圖5是示意地顯示用於判定有無阻礙主軸的旋轉之切削單元的不良狀況之切削裝置的構成要素之另一例的圖。 圖6是示意地顯示到主軸的旋轉速度達到指定旋轉速度為止之主軸的旋轉速度的隨時間變化的例子的圖表。 圖7是示意地顯示到主軸恆定地以指定旋轉速度旋轉為止之馬達的負載電流值的隨時間變化的例子的圖表。 FIG. 1 is a perspective view schematically showing an example of a processing apparatus. Fig. 2 is a partial cross-sectional side view schematically showing an example of a processing unit. Fig. 3 is an exploded perspective view schematically showing an example of the structure of the tip of the main shaft. 4 is a diagram schematically showing an example of components of a cutting device for determining whether there is a defect in the cutting unit that hinders the rotation of the main shaft. 5 is a diagram schematically showing another example of components of a cutting device for determining whether there is a defect in the cutting unit that hinders the rotation of the main shaft. FIG. 6 is a graph schematically showing an example of temporal changes in the rotational speed of the main shaft until the rotational speed of the main shaft reaches a predetermined rotational speed. FIG. 7 is a graph schematically showing an example of the temporal change of the load current value of the motor until the main shaft rotates at a constant rotation speed.
10:工作夾台 10: Work clamp table
20:主軸 20: Spindle
22:殼體 22: shell
34:切削刀片 34: Cutting blade
48:控制單元 48: Control unit
48a:判定部 48a: Judgment Department
50:旋轉速度測定單元 50: Rotation speed measurement unit
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JP2021067527A JP2022162634A (en) | 2021-04-13 | 2021-04-13 | Processing device |
JP2021-067527 | 2021-04-13 |
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TW202305916A true TW202305916A (en) | 2023-02-01 |
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KR (1) | KR20220141744A (en) |
CN (1) | CN115256124A (en) |
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Cited By (1)
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CN116060999A (en) * | 2023-03-07 | 2023-05-05 | 长春光华微电子设备工程中心有限公司 | Control system of machine tool |
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JP2010129623A (en) | 2008-11-26 | 2010-06-10 | Disco Abrasive Syst Ltd | Processing method for wafer |
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CN116060999A (en) * | 2023-03-07 | 2023-05-05 | 长春光华微电子设备工程中心有限公司 | Control system of machine tool |
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