TW202305916A - Processing device - Google Patents

Processing device Download PDF

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Publication number
TW202305916A
TW202305916A TW111111972A TW111111972A TW202305916A TW 202305916 A TW202305916 A TW 202305916A TW 111111972 A TW111111972 A TW 111111972A TW 111111972 A TW111111972 A TW 111111972A TW 202305916 A TW202305916 A TW 202305916A
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Taiwan
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unit
main shaft
cutting
rotational speed
current value
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TW111111972A
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Chinese (zh)
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木佐貫誠
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日商迪思科股份有限公司
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Publication of TW202305916A publication Critical patent/TW202305916A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67288Monitoring of warpage, curvature, damage, defects or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0616Grinders for cutting-off using a tool turning around the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

The invention provides a machining device, which can early find the bad condition that the rotation of a main shaft included in a machining unit (a cutting unit or a grinding unit) is hindered. A control unit for controlling a motor for rotating a main shaft includes a determination unit for determining the presence or absence of a defect in a machining unit on the basis of information obtained by rotating the main shaft at a predetermined rotational speed. As a result, it is possible to early find a malfunction that hinders the rotation of the main shaft included in the processing unit.

Description

加工裝置Processing device

本發明是有關一種對被加工物進行加工之加工裝置。The present invention relates to a processing device for processing workpieces.

IC(積體電路,Integrated Circuit)以及LSI(大型積體電路,Large Scale Integration)等之器件的晶片是在行動電話以及個人電腦等的各種電子機器中不可或缺之構成要素。Chips of devices such as IC (Integrated Circuit) and LSI (Large Scale Integration) are indispensable components in various electronic devices such as mobile phones and personal computers.

這樣的晶片是藉由例如使用切削裝置,來將於正面形成有多數個器件之晶圓等的被加工物按一個個的包含器件之區域來分割而被製造(參照例如專利文獻1)。此切削裝置具備切削單元,前述切削單元具有例如在前端部裝設有切削刀片(加工具)之主軸、及使此主軸旋轉之馬達。Such a wafer is manufactured by, for example, using a cutting device to divide a workpiece such as a wafer on which a plurality of devices are formed on the front side into regions including devices (see, for example, Patent Document 1). This cutting device includes a cutting unit including, for example, a main shaft on which a cutting blade (processing tool) is mounted at a front end, and a motor that rotates the main shaft.

此外,此切削刀片具有分散有磨粒之圓環狀的切刃(加工磨石)。並且,切削裝置是一邊藉由馬達使裝設於主軸的前端部之切削刀片旋轉,一邊使切削刀片的切刃接觸於被加工物來切削並分割被加工物。In addition, this cutting insert has an annular cutting edge (processing grindstone) in which abrasive grains are dispersed. In addition, the cutting device cuts and divides the workpiece by bringing the cutting edge of the cutting blade into contact with the workpiece while rotating the cutting blade mounted on the front end of the main shaft by the motor.

又,用於晶片的製造之被加工物,大多會以晶片的小型化以及輕量化等為目的,而使用磨削裝置在其分割前進行薄化。此磨削裝置具備磨削單元,前述磨削單元具有例如在前端部裝設有磨削輪(加工具)之主軸、及使此主軸旋轉之馬達。In addition, many workpieces used in the manufacture of wafers are thinned before being divided using a grinding device for the purpose of miniaturization and weight reduction of wafers. This grinding device includes a grinding unit having, for example, a main shaft on which a grinding wheel (grinding tool) is attached to a front end, and a motor that rotates the main shaft.

此外,此磨削輪具有圓環狀的輪基台、與固定於此輪基台的一面之複數個磨削磨石(加工磨石)。並且,磨削裝置一邊藉由馬達使裝設於主軸的前端部之磨削輪旋轉,一邊使複數個磨削磨石接觸於被加工物,藉此將被加工物磨削並薄化。 先前技術文獻 專利文獻 In addition, this grinding wheel has an annular wheel base and a plurality of grinding stones (processing grindstones) fixed to one surface of the wheel base. In addition, the grinding device makes the plurality of grinding stones contact the workpiece while the motor rotates the grinding wheel mounted on the front end of the main shaft, thereby grinding and thinning the workpiece. prior art literature patent documents

專利文獻1:日本特開2010-129623號公報Patent Document 1: Japanese Patent Laid-Open No. 2010-129623

發明欲解決之課題The problem to be solved by the invention

在切削裝置以及磨削裝置等的加工裝置中,若在加工具(切削刀片或磨削輪)的旋轉速度較低的狀態下進行被加工物的加工(切削或磨削),施加於被加工物之負荷(加工負荷)會增大。In processing devices such as cutting devices and grinding devices, if the processing (cutting or grinding) of the workpiece is performed at a low rotational speed of the processing tool (cutting blade or grinding wheel), the Material load (processing load) will increase.

並且,在此情況下,會有以下疑慮:產生在被加工物形成破裂(缺損)及裂隙之類的加工不良,而使藉由分割被加工物所製造之晶片的品質降低。In addition, in this case, there is a possibility that processing defects such as cracks (defects) and cracks are formed in the workpiece, and the quality of wafers manufactured by dividing the workpiece may be reduced.

有鑒於此點,本發明的目的在於提供一種可儘早發現阻礙包含於加工單元(切削單元或磨削單元)之主軸的旋轉的不良狀況之加工裝置。 用以解決課題之手段 In view of this point, an object of the present invention is to provide a machining device capable of early detection of a malfunction that inhibits rotation of a spindle included in a machining unit (cutting unit or grinding unit). means to solve problems

根據本發明的一個層面,可提供一種加工被加工物之加工裝置,前述加工裝置具備:加工單元,具有於前端部裝設有加工磨石之主軸、與使該主軸旋轉之馬達;及控制單元,控制該馬達的動作, 該控制單元包含判定部,前述判定部會依據藉由以事先設定之指定旋轉速度來使該主軸旋轉而得到之資訊,來判定有無該加工單元的不良狀況。 According to one aspect of the present invention, there is provided a processing device for processing a workpiece. The processing device includes: a processing unit having a main shaft on which a grinding stone is mounted at a front end; and a motor for rotating the main shaft; and a control unit. , to control the movement of the motor, The control unit includes a judging unit that judges whether there is a defect in the machining unit based on information obtained by rotating the spindle at a predetermined rotational speed set in advance.

此外,較佳的是,在本發明中,更具備測定該主軸的旋轉速度之旋轉速度測定單元,該判定部在依據以該旋轉速度測定單元所測定出之該主軸的旋轉速度,來計算從讓該馬達動作而使該主軸旋轉起到該主軸的旋轉速度達到該指定旋轉速度為止的所需時間後,會因應於該所需時間是否超出事先設定之閾值,來判定有無該加工單元的不良狀況。In addition, it is preferable that in the present invention, a rotation speed measuring unit for measuring the rotation speed of the main shaft is further provided, and the determination unit calculates a value from the rotation speed of the main shaft measured by the rotation speed measurement unit. After the motor is activated to rotate the spindle until the rotation speed of the spindle reaches the specified rotation speed, it will determine whether there is a defect in the processing unit according to whether the required time exceeds the preset threshold. situation.

或者,較佳的是,在本發明中,更具備負載電流值測定單元,前述負載電流值測定單元是測定使該主軸旋轉時的該馬達的負載電流值,該判定部是因應於使該主軸恆定地以該指定旋轉速度旋轉時,以該負載電流值測定單元所測定出之該負載電流值是否超出事先設定之閾值,來判定有無該加工單元的不良狀況。 發明效果 Alternatively, preferably, in the present invention, a load current value measuring unit is further provided, the aforementioned load current value measuring unit measures the load current value of the motor when the main shaft is rotated, and the determination unit responds to making the main shaft When constantly rotating at the specified rotation speed, it is determined whether there is a defect in the processing unit based on whether the load current value measured by the load current value measuring unit exceeds a preset threshold. Invention effect

在本發明中,控制使主軸旋轉之馬達的控制單元包含判定部,前述判定部會依據藉由以事先設定之指定旋轉速度來使主軸旋轉而得到之資訊,來判定有無加工單元的不良狀況。藉此,在本發明中,可儘早發現阻礙包含於加工單元(切削單元或磨削單元)之主軸的旋轉的不良狀況。In the present invention, the control unit that controls the motor that rotates the main shaft includes a determination unit that determines whether there is a defect in the machining unit based on information obtained by rotating the main shaft at a predetermined rotational speed set in advance. Thereby, in the present invention, it is possible to find a malfunction that hinders the rotation of the main shaft included in the machining unit (cutting unit or grinding unit) early.

用以實施發明之形態form for carrying out the invention

參照附加圖式來說明本發明的實施形態。圖1是示意地顯示本發明的加工裝置之一例(切削裝置)的立體圖。再者,圖1所示之X軸方向(前後方向、加工進給方向)以及Y軸方向(左右方向、分度進給方向)是在水平面上相互地垂直之方向,又,Z軸方向(上下方向)是垂直於X軸方向以及Y軸方向之方向(鉛直方向、切入進給方向)。Embodiments of the present invention will be described with reference to the attached drawings. Fig. 1 is a perspective view schematically showing an example (cutting device) of the processing device of the present invention. Furthermore, the X-axis direction (front-rear direction, machining feed direction) and the Y-axis direction (left-right direction, indexing feed direction) shown in FIG. 1 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction ( Up-down direction) is a direction perpendicular to the X-axis direction and the Y-axis direction (vertical direction, cutting feed direction).

圖1所示之切削裝置2具備可搭載各個構成要素之基台4。在基台4的上部安裝有覆蓋基台4的上表面側之罩蓋6。在罩蓋6的內部容置有切削被加工物11之切削單元(加工單元)8。此切削單元8已連接於切削單元移動機構(未圖示),且可例如沿著Y軸方向以及Z軸方向來移動。再者,有關於切削單元8的細節將於後文敘述。The cutting device 2 shown in FIG. 1 includes a base 4 on which various components can be mounted. A cover 6 covering the upper surface side of the base 4 is attached to the upper portion of the base 4 . A cutting unit (machining unit) 8 for cutting a workpiece 11 is housed inside the cover 6 . The cutting unit 8 has been connected to a cutting unit moving mechanism (not shown), and can move along the Y-axis direction and the Z-axis direction, for example. Furthermore, details about the cutting unit 8 will be described later.

於切削單元8的下方設置有保持被加工物11之工作夾台10。工作夾台10已連接於工作夾台移動機構(未圖示),且可例如沿著X軸方向來移動。又,工作夾台10已連接於旋轉機構(未圖示),且可將大致平行於Z軸方向之直線作為旋轉軸來旋轉。Below the cutting unit 8, a work holder 10 holding a workpiece 11 is provided. The work holder 10 is connected to a work holder moving mechanism (not shown), and can move along the X-axis direction, for example. In addition, the work chuck 10 is connected to a rotation mechanism (not shown), and can rotate about a straight line substantially parallel to the Z-axis direction as a rotation axis.

在基台4的角部設置有片匣工作台12。在片匣工作台12的上表面載置有可容置複數個被加工物11之片匣14。此片匣工作台12已連接於片匣工作台移動機構(未圖示),且可例如沿著Z軸方向來移動。此片匣工作台移動機構會將已載置在片匣工作台12之片匣14的高度調整成可以適當地搬出搬入被加工物11。A cassette table 12 is provided at a corner of the base 4 . A cassette 14 capable of accommodating a plurality of workpieces 11 is placed on the upper surface of the cassette table 12 . The cassette table 12 has been connected to a cassette table moving mechanism (not shown), and can move along the Z axis, for example. This cassette table moving mechanism adjusts the height of the cassette 14 placed on the cassette table 12 so that the workpiece 11 can be carried in and out appropriately.

於罩蓋6的側面6a設置有作為使用者介面之觸控面板式的監視器(monitor)16。又,在罩蓋6的上表面6b設置有警告燈(指示燈(pilot lamp))18。並且,上述之切削裝置2的構成要素已連接於控制單元(在圖1中未圖示)。此控制單元具有中央處理裝置(CPU)、與包含主記憶裝置(揮發性記憶體)以及輔助記憶裝置(非揮發性記憶體)之記憶裝置,且可控制上述之切削裝置2的構成要素的動作。A touch panel-type monitor (monitor) 16 as a user interface is provided on the side surface 6 a of the cover 6 . Furthermore, a warning lamp (pilot lamp) 18 is provided on the upper surface 6 b of the cover 6 . In addition, the above-mentioned constituent elements of the cutting device 2 are connected to a control unit (not shown in FIG. 1 ). This control unit has a central processing unit (CPU), and a memory device including a main memory device (volatile memory) and an auxiliary memory device (non-volatile memory), and can control the actions of the above-mentioned components of the cutting device 2 .

圖2是示意地顯示切削單元(加工單元)8的局部剖面側視圖。切削單元8具有以大致平行於Y軸方向之直線作為旋轉軸而旋轉之主軸20。此主軸20容置在構成為筒狀之殼體22的內側的空間。在殼體22的內部(壁材的內部)設置有相對於主軸20的旋轉軸大致平行之空氣供給路22a。FIG. 2 is a partial sectional side view schematically showing a cutting unit (machining unit) 8 . The cutting unit 8 has a main shaft 20 that rotates about a straight line substantially parallel to the Y-axis direction as a rotation axis. The main shaft 20 is accommodated in a space inside a cylindrical housing 22 . An air supply path 22 a substantially parallel to the rotation axis of the spindle 20 is provided inside the casing 22 (inside the wall material).

空氣供給路22a是透過空氣供給口22b而連接於外部的空氣供給源(未圖示)。又,空氣供給路22a是透過第1供給路22c而連接於徑向空氣軸承部(徑向空氣軸承(radial air bearing))24,且透過第2供給路22d而連接於推力空氣軸承部(推力空氣軸承(thrust air bearing))26。The air supply path 22a is connected to an external air supply source (not shown) through the air supply port 22b. In addition, the air supply path 22a is connected to the radial air bearing portion (radial air bearing) 24 through the first supply path 22c, and is connected to the thrust air bearing portion (thrust air bearing) through the second supply path 22d. air bearing (thrust air bearing) 26.

可藉由從空氣供給源對徑向空氣軸承部24以及推力空氣軸承部26供給高壓的空氣,而將主軸20在殼體22的內側空間內保持為懸浮之狀態。例如,徑向空氣軸承部24是藉由朝向主軸20噴附垂直於該旋轉軸的方向之空氣,而將主軸20的位置在垂直於旋轉軸的方向上保持為一定。By supplying high-pressure air from an air supply source to the radial air bearing portion 24 and the thrust air bearing portion 26 , the main shaft 20 can be kept in a floating state in the inner space of the housing 22 . For example, the radial air bearing unit 24 keeps the position of the main shaft 20 constant in the direction perpendicular to the rotation axis by spraying air in a direction perpendicular to the rotation axis toward the main shaft 20 .

另一方面,推力空氣軸承部26是藉由朝向設置於主軸20之圓盤狀的推力板(thrust plate)20a噴附平行於主軸20的旋轉軸的方向之空氣,而將主軸20的位置在平行於旋轉軸的方向上保持為一定。藉由徑向空氣軸承部24以及推力空氣軸承部26,可穩定地支撐高速旋轉之主軸20。On the other hand, the thrust air bearing part 26 sprays air in a direction parallel to the rotation axis of the main shaft 20 toward a disc-shaped thrust plate 20a provided on the main shaft 20, so that the main shaft 20 is positioned at The direction parallel to the axis of rotation remains constant. The high-speed rotating main shaft 20 can be stably supported by the radial air bearing 24 and the thrust air bearing 26 .

在殼體22的一端(前端)側設置有開口部22e。主軸20是將其一端部(前端部)20b插入開口部22e,以從殼體22露出。亦即,主軸20的前端部20b是從殼體22的開口部22e朝外側突出。圖3是示意地顯示主軸20的前端之構造的分解立體圖。An opening 22 e is provided on one end (front end) side of the housing 22 . The spindle 20 is exposed from the housing 22 by inserting its one end (tip end) 20b into the opening 22e. That is, the front end portion 20b of the main shaft 20 protrudes outward from the opening portion 22e of the housing 22 . FIG. 3 is an exploded perspective view schematically showing the structure of the front end of the spindle 20 .

於主軸20的前端設置有安裝座28。安裝座28具有圓盤狀的凸緣部30、與從凸緣部30的正面30a的中央部突出之圓筒狀的支撐軸32。於凸緣部30的外周部設有從正面30a突出之環狀的凸部30b。凸部30b的前端面30c是形成為相對於正面30a大致平行。A mounting base 28 is disposed at the front end of the main shaft 20 . The mount 28 has a disc-shaped flange portion 30 and a cylindrical support shaft 32 protruding from the center of the front surface 30 a of the flange portion 30 . On the outer peripheral part of the flange part 30, the annular convex part 30b which protrudes from the front surface 30a is provided. The front end surface 30c of the convex part 30b is formed substantially parallel to the front surface 30a.

在支撐軸32的外周面形成有牙山32a。又,於支撐軸32的前端面的中央部形成有凹部32b。可於支撐軸32裝設對被加工物11進行切削之環狀的切削刀片(加工具)34。切削刀片34具有由鋁(Al)等金屬材料所構成之環狀的基台36、及沿著基台36的外周緣而形成之環狀的切刃(加工磨石)38。A mountain 32 a is formed on the outer peripheral surface of the support shaft 32 . Moreover, a recessed part 32b is formed in the center part of the front-end|tip surface of the support shaft 32. As shown in FIG. A ring-shaped cutting blade (processing tool) 34 for cutting the workpiece 11 can be attached to the support shaft 32 . The cutting insert 34 has an annular base 36 made of a metal material such as aluminum (Al), and an annular cutting edge (processing grindstone) 38 formed along the outer peripheral edge of the base 36 .

在基台36的中央部設置有將基台36朝厚度方向貫通成可供支撐軸32插入之開口36a。又,在基台36的開口36a的周圍設置有沿著基台36的厚度方向朝正面側突出之環狀的凸部36b。切刃38是藉由例如以鎳鍍敷層固定由鑽石等所構成之磨粒而形成。不過,對切刃38的磨粒以及結合材的材質並無限制,可因應於被加工物11的材質或加工內容等來合宜選擇。An opening 36a that penetrates the base 36 in the thickness direction so that the support shaft 32 can be inserted is provided at the center portion of the base 36 . Also, around the opening 36a of the base 36, an annular convex portion 36b protruding toward the front side along the thickness direction of the base 36 is provided. The cutting edge 38 is formed by, for example, fixing abrasive grains made of diamond or the like with a nickel plating layer. However, there is no limitation on the abrasive grains of the cutting edge 38 and the material of the bonding material, which can be appropriately selected according to the material of the workpiece 11 or the processing content.

於支撐軸32的牙山32a可供用於固定切削刀片34之環狀的螺帽40緊固。在螺帽40的中央部形成有對應於支撐軸32的直徑之圓形的開口40a。在此開口40a形成有和已形成於支撐軸32的牙山32a對應之牙山。An annular nut 40 for fixing the cutting blade 34 can be fastened to the tooth mountain 32 a of the support shaft 32 . A circular opening 40 a corresponding to the diameter of the support shaft 32 is formed at a central portion of the nut 40 . In this opening 40a, a tooth mountain corresponding to the tooth mountain 32a formed on the support shaft 32 is formed.

切削刀片34以對基台36的開口36a插入支撐軸32的方式裝設於安裝座28。並且,當將螺帽40螺合並鎖緊於支撐軸32的牙山32a時,切削刀片34會被凸緣部30的前端面30c與螺帽40夾持。藉此,可將包含切刃(加工磨石)38之切削刀片34裝設於主軸20的一端部(前端部)20b。The cutting insert 34 is attached to the mount 28 so as to be inserted into the support shaft 32 through the opening 36 a of the base 36 . Furthermore, when the nut 40 is screwed and locked to the tooth ridge 32 a of the support shaft 32 , the cutting insert 34 is sandwiched between the front end surface 30 c of the flange portion 30 and the nut 40 . Thereby, the cutting insert 34 including the cutting edge (processing grindstone) 38 can be attached to the one end portion (front end portion) 20 b of the main shaft 20 .

如圖2所示,在主軸20的另一端側連結有賦與用於使主軸20旋轉之力的馬達42。馬達42包含已固定於殼體22的內側之定子44、與已和主軸20一體化之轉子46。As shown in FIG. 2 , a motor 42 that applies force for rotating the main shaft 20 is connected to the other end side of the main shaft 20 . The motor 42 includes a stator 44 fixed inside the casing 22 and a rotor 46 integrated with the main shaft 20 .

然後,主軸20會因應於作用在定子44與轉子46之間的磁力而旋轉。再者,在此雖然是將主軸20與轉子46一體化,但亦可為連結有各別形成之主軸20與轉子46。The spindle 20 then rotates in response to the magnetic force acting between the stator 44 and the rotor 46 . Furthermore, although the main shaft 20 and the rotor 46 are integrated here, the main shaft 20 and the rotor 46 formed separately may be connected.

已供給至徑向空氣軸承部24以及推力空氣軸承部26之空氣的一部分,可透過主軸20的前端部20b與殼體22之間的間隙(開口部22e的一部分)往殼體22的外部排出(噴出)。可藉由此空氣的流動,將主軸20的前端部20b與殼體22的開口部22e之間的間隙密封(氣封(air seal))。Part of the air supplied to the radial air bearing portion 24 and the thrust air bearing portion 26 can pass through the gap between the front end portion 20b of the main shaft 20 and the housing 22 (part of the opening 22e) and be discharged to the outside of the housing 22. (spray). This air flow can seal the gap between the front end portion 20b of the main shaft 20 and the opening portion 22e of the case 22 (air seal).

在此,在供給至徑向空氣軸承部24以及推力空氣軸承部26之空氣中混入異物,且/或此空氣的壓力瞬間降低的情況下,會有主軸20接觸到異物及/或殼體22等而損傷之情形。又,也有因切削單元8的維護中的誤操作(例如,在對徑向空氣軸承部24以及推力空氣軸承部26尚未供給有空氣之狀態下使主軸20旋轉等),而損傷主軸20之情形。Here, when a foreign matter is mixed into the air supplied to the radial air bearing portion 24 and the thrust air bearing portion 26 and/or the pressure of the air drops momentarily, the main shaft 20 may come into contact with the foreign matter and/or the housing 22 In the event of damage due to waiting. In addition, the main shaft 20 may be damaged due to misoperation during maintenance of the cutting unit 8 (for example, rotating the main shaft 20 without supplying air to the radial air bearing part 24 and the thrust air bearing part 26, etc.).

這種損傷也被稱為主軸刮傷,且會阻礙主軸20的旋轉。又,在馬達42已劣化之情況下也會阻礙主軸20的旋轉。有鑒於這些點,在切削裝置2中會在控制單元包含有判定部,前述判定部會判定有無像這樣的阻礙主軸20的旋轉之切削單元8的不良狀況。This damage is also known as spindle scratching and can impede the rotation of the spindle 20 . Also, when the motor 42 has deteriorated, the rotation of the main shaft 20 is hindered. In view of these points, the cutting device 2 includes a determination unit in the control unit, and the determination unit determines whether there is such a defect in the cutting unit 8 that hinders the rotation of the main shaft 20 .

圖4以及圖5是示意地顯示用於判定有無阻礙主軸20的旋轉之切削單元8的不良狀況之切削裝置2的構成要素的圖。圖4及圖5所示之控制單元48可以控制已容置於殼體22之馬達42的動作,並使裝設於主軸20的前端部之切削刀片34旋轉。4 and 5 are diagrams schematically showing components of the cutting device 2 for determining whether there is a defect in the cutting unit 8 that hinders the rotation of the main shaft 20 . The control unit 48 shown in FIGS. 4 and 5 can control the operation of the motor 42 housed in the casing 22 and rotate the cutting blade 34 installed at the front end of the main shaft 20 .

又,在圖4所示之切削裝置2中,設置有測定主軸20的旋轉速度之旋轉速度測定單元50。可隨時將以此旋轉速度測定單元50所測定出之主軸20的旋轉速度輸入到控制單元48。並且,控制單元48具有判定部48a,前述判定部48a是利用從旋轉速度測定單元50所輸入之資訊,來判定有無阻礙主軸20的旋轉之切削單元8的不良狀況。In addition, in the cutting device 2 shown in FIG. 4 , a rotation speed measuring unit 50 for measuring the rotation speed of the main shaft 20 is provided. The rotational speed of the spindle 20 measured by the rotational speed measuring unit 50 can be input to the control unit 48 at any time. Furthermore, the control unit 48 has a judging unit 48 a that uses information input from the rotation speed measuring unit 50 to judge whether there is a defect in the cutting unit 8 that hinders the rotation of the main shaft 20 .

在此判定所利用之資訊是例如以旋轉速度測定單元50所測定出之主軸20的旋轉速度。具體而言,判定部48a會依據以旋轉速度測定單元50所測定出之主軸20的旋轉速度,來計算從讓馬達42動作而使主軸20旋轉起到主軸20的旋轉速度達到指定旋轉速度為止的所需時間。然後,判定部48a會因應於所計算出之所需時間是否超出事先設定之閾值,來判定有無阻礙主軸20的旋轉之切削單元8的不良狀況。再者,亦可將此閾值事先記憶在控制單元48的記憶裝置。The information used in the determination here is, for example, the rotational speed of the main shaft 20 measured by the rotational speed measuring unit 50 . Specifically, based on the rotational speed of the main shaft 20 measured by the rotational speed measuring unit 50, the determination unit 48a calculates the time period from when the motor 42 is operated to rotate the main shaft 20 until the rotational speed of the main shaft 20 reaches a predetermined rotational speed. time required. Then, the judging part 48 a judges whether there is a bad condition of the cutting unit 8 that hinders the rotation of the main shaft 20 according to whether the calculated required time exceeds a preset threshold. Furthermore, the threshold value can also be stored in the memory device of the control unit 48 in advance.

圖6是示意地顯示以旋轉速度測定單元50所測定出之到主軸20的旋轉速度達到指定旋轉速度V為止之主軸20的旋轉速度的隨時間的變化的例子的圖表。在以旋轉速度測定單元50所測定出之主軸20的旋轉速度以圖6所示之虛線A的形式變化的情況下,所計算之上述的所需時間不會超過閾值T1。在此情況下,判定部48a會判定為沒有阻礙主軸20的旋轉之切削單元8的不良狀況。FIG. 6 is a graph schematically showing an example of changes over time in the rotational speed of the main shaft 20 measured by the rotational speed measuring unit 50 until the rotational speed of the main shaft 20 reaches a predetermined rotational speed V. FIG. When the rotational speed of the main shaft 20 measured by the rotational speed measuring unit 50 changes in the form of the dotted line A shown in FIG. 6 , the calculated required time does not exceed the threshold T1. In this case, the judging unit 48 a judges that there is no defect of the cutting unit 8 that hinders the rotation of the main shaft 20 .

另一方面,在以旋轉速度測定單元50所測定出之主軸20的旋轉速度以圖6所示之一點鏈線B的形式變化的情況下,所計算之上述的所需時間會超過閾值T1。在此情況下,判定部48a會判定為有阻礙主軸20的旋轉之切削單元8的不良狀況。並且,在此情況下,控制單元48會控制監視器16及/或警告燈18,並向切削裝置2的操作人員通報切削單元8的不良狀況。On the other hand, when the rotational speed of the main shaft 20 measured by the rotational speed measuring unit 50 changes in the chain line B shown in FIG. 6 , the calculated required time exceeds the threshold T1. In this case, the judging unit 48 a judges that there is a defect in the cutting unit 8 that hinders the rotation of the main shaft 20 . In addition, in this case, the control unit 48 controls the monitor 16 and/or the warning light 18 and notifies the operator of the cutting device 2 of the failure of the cutting unit 8 .

又,在圖5所示之切削裝置2中,設置有測定使主軸20旋轉之馬達42的負載電流值之負載電流值測定單元52。可隨時將以此負載電流值測定單元52所測定出之馬達42的負載電流值輸入到控制單元48。並且,控制單元48具有判定部48b,前述判定部48b是利用從負載電流值測定單元52所輸入之資訊,來判定有無阻礙主軸20的旋轉之切削單元8的不良狀況。Further, in the cutting device 2 shown in FIG. 5 , a load current value measuring unit 52 for measuring a load current value of the motor 42 that rotates the spindle 20 is provided. The load current value of the motor 42 measured by the load current value measuring unit 52 can be input to the control unit 48 at any time. Furthermore, the control unit 48 has a judging unit 48b that uses the information input from the load current value measuring unit 52 to judge whether there is a defect in the cutting unit 8 that hinders the rotation of the main shaft 20 .

此判定所利用之資訊是例如在未進行由切削單元8所進行之被加工物11的切削的狀態下,使主軸20以指定旋轉速度恆定地旋轉時,以負載電流值測定單元52所測定出之馬達42的負載電流值。具體而言,判定部48b會因應於此負載電流值是否超出事先設定之閾值,來判定有無阻礙主軸20的旋轉之切削單元8的不良狀況。再者,亦可將此閾值事先記憶在控制單元48的記憶裝置。The information used for this determination is, for example, measured by the load current value measuring unit 52 when the spindle 20 is rotated at a predetermined rotational speed while the workpiece 11 is not being cut by the cutting unit 8. The load current value of the motor 42. Specifically, the judging unit 48b judges whether there is a bad condition of the cutting unit 8 that hinders the rotation of the spindle 20 according to whether the load current value exceeds a preset threshold. Furthermore, the threshold value can also be stored in the memory device of the control unit 48 in advance.

圖7是示意地顯示以負載電流值測定單元52所測定出之到主軸20恆定地以指定旋轉速度旋轉為止之馬達42的負載電流值的隨時間變化的例子的圖表。在以負載電流值測定單元52所測定出之馬達42的負載電流值以圖7所示之虛線C的形式變化的情況下,主軸20恆定地以指定旋轉速度旋轉時之馬達42的負載電流值不會超過閾值T2。在此情況下,判定部48b會判定為沒有阻礙主軸20的旋轉之切削單元8的不良狀況。FIG. 7 is a graph schematically showing an example of the change with time of the load current value of the motor 42 measured by the load current value measuring unit 52 until the main shaft 20 rotates at a constant rotation speed at a predetermined speed. When the load current value of the motor 42 measured by the load current value measuring unit 52 changes in the form of the dotted line C shown in FIG. Threshold T2 will not be exceeded. In this case, the judging unit 48 b judges that there is no defect of the cutting unit 8 that hinders the rotation of the main shaft 20 .

另一方面,以負載電流值測定單元52所測定出之馬達42的負載電流值以圖7所示之一點鏈線D的形式變化的情況下,主軸20恆定地以指定旋轉速度旋轉時之馬達42的負載電流值會超過閾值T2。在此情況下,判定部48b會判定為有阻礙主軸20的旋轉之切削單元8的不良狀況。並且,在此情況下,控制單元48會控制監視器16及/或警告燈18,並向切削裝置2的操作人員通報切削單元8的不良狀況。On the other hand, when the load current value of the motor 42 measured by the load current value measuring unit 52 changes in the form of a dotted chain line D shown in FIG. The load current value of 42 will exceed the threshold T2. In this case, the judging unit 48b judges that there is a defect in the cutting unit 8 that hinders the rotation of the main shaft 20 . In addition, in this case, the control unit 48 controls the monitor 16 and/or the warning light 18 and notifies the operator of the cutting device 2 of the failure of the cutting unit 8 .

在上述之切削裝置2中,控制使主軸20旋轉之馬達42的控制單元48包含判定部48a或判定部48b,前述判定部48a或判定部48b會依據藉由以事先設定之指定旋轉速度使主軸20旋轉而得到之資訊,來判定有無切削單元8的不良狀況。藉此,在上述之切削裝置2中,可儘早發現阻礙包含於切削單元8之主軸20的旋轉的不良狀況。In the above-mentioned cutting device 2, the control unit 48 that controls the motor 42 that rotates the main shaft 20 includes a determination part 48a or a determination part 48b. 20 rotates the obtained information to determine whether there is a bad condition of the cutting unit 8. Thereby, in the above-mentioned cutting device 2 , it is possible to find a defect that prevents the rotation of the main shaft 20 included in the cutting unit 8 early.

再者,上述之切削裝置2是本發明的加工裝置之一例,本發明之加工裝置並不限定於切削裝置2。例如,本發明之加工裝置的加工單元亦可為以下之切削單元:具有主軸與使此主軸旋轉之馬達,且前述主軸在前端部裝設有墊圈型的切削刀片(僅藉由環狀的切刃(加工磨石)所構成之切削刀片)。In addition, the above-mentioned cutting device 2 is an example of the processing device of the present invention, and the processing device of the present invention is not limited to the cutting device 2 . For example, the processing unit of the processing device of the present invention may also be a cutting unit that has a main shaft and a motor that rotates the main shaft, and the front end of the main shaft is provided with a washer-type cutting blade (only by a ring-shaped cutting blade). Blade (processing grinding stone) composed of cutting blades).

又,本發明之加工裝置亦可為磨削裝置,前述磨削裝置具備:加工單元,具有主軸與使此主軸旋轉之馬達,前述主軸在前端部裝設有包含複數個磨削磨石(加工磨石)之磨削輪;及控制單元,控制此馬達的動作。Moreover, the processing device of the present invention may also be a grinding device. The aforementioned grinding device includes: a processing unit having a main shaft and a motor to rotate the main shaft; grindstone) grinding wheel; and a control unit to control the movement of the motor.

又,本發明的加工裝置亦可具備包含判定部48a以及判定部48b之控制單元48、旋轉速度測定單元50及負載電流值測定單元52之全部。另外,上述之實施形態之構造及方法等,只要在不脫離本發明的目的之範圍內,皆可以合宜變更來實施。In addition, the processing apparatus of the present invention may include all of the control unit 48 including the determination unit 48a and the determination unit 48b, the rotation speed measurement unit 50, and the load current value measurement unit 52. In addition, the structures, methods, etc. of the above-mentioned embodiments can be appropriately changed and implemented as long as they do not deviate from the purpose of the present invention.

2:切削裝置 4:基台 6:罩蓋 6a:側面 6b:上表面 8:切削單元(加工單元) 10:工作夾台 11:被加工物 12:片匣工作台 14:片匣 16:監視器 18:警告燈(指示燈) 20:主軸 20a:推力板 20b:一端部(前端部) 22:殼體 22a:空氣供給路 22b:空氣供給口 22c:第1供給路 22d:第2供給路 22e:開口部 24:徑向空氣軸承部(徑向空氣軸承) 26:推力空氣軸承部(推力空氣軸承) 28:安裝座 30:凸緣部 30a:正面 30b,36b:凸部 30c:前端面 32:支撐軸 32a:牙山 34:切削刀片 36:基台 36a,40a:開口 38:切刃 40:螺帽 42:馬達 44:定子 46:轉子 48:控制單元 48a,48b:判定部 50:旋轉速度測定單元 52:負載電流值測定單元 A,C:虛線 B,D:一點鏈線 T1,T2:閾值 V:指定旋轉速度 X,Y,Z:方向 2: Cutting device 4: Abutment 6: cover 6a: side 6b: Upper surface 8: Cutting unit (processing unit) 10: Work clamp table 11: Processed object 12: Cassette workbench 14: Cassette 16: Monitor 18: Warning light (indicator light) 20: Spindle 20a: Thrust plate 20b: one end (front end) 22: shell 22a: Air supply path 22b: Air supply port 22c: 1st supply road 22d: The second supply road 22e: opening 24: Radial air bearing part (radial air bearing) 26: Thrust air bearing part (thrust air bearing) 28: Mounting seat 30: Flange 30a: front 30b, 36b: convex part 30c: front face 32: Support shaft 32a: Asan 34: Cutting blade 36: abutment 36a, 40a: opening 38: cutting edge 40: Nut 42: motor 44: Stator 46: rotor 48: Control unit 48a, 48b: judging part 50: Rotation speed measurement unit 52: load current value measuring unit A,C: dotted line B, D: a little chain line T1, T2: Threshold V: specifies the rotation speed X, Y, Z: direction

圖1是示意地顯示加工裝置之一例的立體圖。 圖2是示意地顯示加工單元之一例的局部剖面側視圖。 圖3是示意地顯示主軸的前端的構造之一例的分解立體圖。 圖4是示意地顯示用於判定有無阻礙主軸的旋轉之切削單元的不良狀況之切削裝置的構成要素之一例的圖。 圖5是示意地顯示用於判定有無阻礙主軸的旋轉之切削單元的不良狀況之切削裝置的構成要素之另一例的圖。 圖6是示意地顯示到主軸的旋轉速度達到指定旋轉速度為止之主軸的旋轉速度的隨時間變化的例子的圖表。 圖7是示意地顯示到主軸恆定地以指定旋轉速度旋轉為止之馬達的負載電流值的隨時間變化的例子的圖表。 FIG. 1 is a perspective view schematically showing an example of a processing apparatus. Fig. 2 is a partial cross-sectional side view schematically showing an example of a processing unit. Fig. 3 is an exploded perspective view schematically showing an example of the structure of the tip of the main shaft. 4 is a diagram schematically showing an example of components of a cutting device for determining whether there is a defect in the cutting unit that hinders the rotation of the main shaft. 5 is a diagram schematically showing another example of components of a cutting device for determining whether there is a defect in the cutting unit that hinders the rotation of the main shaft. FIG. 6 is a graph schematically showing an example of temporal changes in the rotational speed of the main shaft until the rotational speed of the main shaft reaches a predetermined rotational speed. FIG. 7 is a graph schematically showing an example of the temporal change of the load current value of the motor until the main shaft rotates at a constant rotation speed.

10:工作夾台 10: Work clamp table

20:主軸 20: Spindle

22:殼體 22: shell

34:切削刀片 34: Cutting blade

48:控制單元 48: Control unit

48a:判定部 48a: Judgment Department

50:旋轉速度測定單元 50: Rotation speed measurement unit

Claims (3)

一種加工裝置,對被加工物進行加工,前述加工裝置具備: 加工單元,具有於前端部裝設有加工磨石之主軸、與使該主軸旋轉之馬達;及 控制單元,控制該馬達的動作, 該控制單元包含判定部,前述判定部會依據藉由以事先設定之指定旋轉速度來使該主軸旋轉而得到之資訊,來判定有無該加工單元的不良狀況。 A processing device for processing a workpiece, the processing device having: The processing unit has a main shaft with a grinding stone mounted on the front end, and a motor for rotating the main shaft; and a control unit to control the action of the motor, The control unit includes a judging unit that judges whether there is a defect in the machining unit based on information obtained by rotating the spindle at a predetermined rotational speed set in advance. 如請求項1之加工裝置,其更具備測定該主軸的旋轉速度之旋轉速度測定單元, 該判定部在依據以該旋轉速度測定單元所測定出之該主軸的旋轉速度,來計算從讓該馬達動作而使該主軸旋轉起到該主軸的旋轉速度達到該指定旋轉速度為止的所需時間後,會因應於該所需時間是否超出事先設定之閾值,來判定有無該加工單元的不良狀況。 As the processing device of claim 1, it is further provided with a rotation speed measuring unit for measuring the rotation speed of the main shaft, The determination unit calculates the time required from when the motor operates to rotate the main shaft until the main shaft reaches the specified rotational speed based on the rotational speed of the main shaft measured by the rotational speed measuring unit. Afterwards, according to whether the required time exceeds the preset threshold, it is determined whether there is a bad condition of the processing unit. 如請求項1之加工裝置,其更具備負載電流值測定單元,前述負載電流值測定單元是測定使該主軸旋轉時的該馬達的負載電流值, 該判定部是因應於使該主軸恆定地以該指定旋轉速度旋轉時,以該負載電流值測定單元所測定出之該負載電流值是否超出事先設定之閾值,來判定有無該加工單元的不良狀況。 The processing device as claimed in claim 1, further comprising a load current value measuring unit, wherein the load current value measuring unit measures the load current value of the motor when the spindle is rotated, The judging unit determines whether there is a defect in the machining unit based on whether the load current value measured by the load current value measuring unit exceeds a preset threshold when the spindle is rotated at the specified rotational speed. .
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