TW202300226A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method. A substrate processing apparatus includes a substrate holder, a nozzle 8, a first supply pipe 114, a first opening and closing section 111, a first flow rate adjusting section 112, a second supply pipe 124, and a flow rate controller 200. The second supply pipe 124 supplies a processing liquid to the nozzle 8. The flow rate controller 200 controls the first opening and closing section 111 and the first flow rate adjusting section 112. The flow rate controller 200 determines an opening of the first flow rate adjusting section 112 to be a first opening under feedback control of the opening of the first flow rate adjusting section 112 with the first supply pipe 114 opened in a first period. The flow rate controller 200 opens and closes the first supply pipe 114 not under feedback control of the opening of the first flow adjusting section 112 with the first flow rate adjusting section 112 opened at the first opening during a second period. The first period is before the second period.

Description

Substrate processing apparatus and substrate processing method

The invention relates to a substrate processing device and a substrate processing method.

In the manufacturing process of semiconductor devices, semiconductor wafers are processed by substrate processing equipment. For example, as a substrate processing apparatus, an etching apparatus that sets the film thickness of a film to be processed included in a semiconductor wafer to a target film thickness is known (for example, refer to Patent Document 1). For example, an etching apparatus supplies an etchant from a supply pipe toward a semiconductor wafer to etch the semiconductor wafer.

Also, it is necessary to change the discharge amount of processing liquid such as etching liquid according to various processing. Therefore, an adjustment valve for adjusting the flow rate of the treatment liquid is provided in the supply pipe. [Prior technical literature] [Patent literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-85174

[Problem to be solved by the invention]

In general, in order to accurately discharge a specific discharge amount of processing liquid onto a substrate, PID control (feedback control) is performed on the opening of the regulating valve. Also, it is necessary to change the discharge amount of the processing liquid according to the position in the semiconductor wafer. However, in order to perform PID control of the opening of the adjustment valve, time or fluctuations are generated for adjusting the discharge amount of the processing liquid to a specific discharge amount, and the specific discharge amount of the processing liquid cannot be quickly discharged toward the semiconductor wafer.

The present invention was made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can more quickly discharge a specific discharge amount of processing liquid toward a nozzle. [Technical means to solve problems]

The substrate processing apparatus of the present invention includes a substrate holding unit, a nozzle, a first supply pipe, a first opening and closing unit, a first flow rate adjustment unit, a second supply pipe, and a flow control unit. The aforementioned substrate holding portion holds a substrate. The nozzle supplies the processing liquid to the substrate. The first supply pipe supplies the treatment liquid to the nozzle. The first opening and closing unit opens and closes the first supply pipe. The first flow rate regulator adjusts the flow rate of the treatment liquid flowing through the first supply pipe. The second supply pipe supplies the treatment liquid to the nozzle. The flow control unit controls the first opening and closing unit and the first flow adjustment unit. During the first period, the flow rate control unit performs feedback control on the opening degree of the first flow rate adjustment unit in the state of opening the first supply pipe, and determines the opening degree of the first flow rate adjustment unit as the first opening. During the second period, the flow rate control unit does not perform feedback control on the opening degree of the first flow rate adjustment unit while setting the opening degree of the first flow rate control unit to the first opening degree, and turns the first flow rate control unit to the first opening degree. The supply pipe opens and closes. The first period mentioned above is the period before the second period mentioned above.

In one embodiment, a flow meter is further provided, and the flow meter measures the flow rate of the treatment liquid flowing through the first supply pipe. The flow control unit outputs an opening and closing signal to the first opening and closing unit, and outputs an opening signal to the first flow adjustment unit. The opening/closing signal indicates either the open state or the closed state of the first supply pipe. The opening degree signal indicates the opening degree of the first flow rate regulator. The aforementioned feedback control includes proportional control, integral control, and differential control based on the detection results of the aforementioned flowmeter.

In a certain embodiment, during the second period, the nozzle sprays a first discharge amount of the treatment liquid to the peripheral portion of the substrate, and discharges a second discharge amount that is larger than the first discharge amount to the center portion of the substrate. Discharge amount of the aforementioned treatment liquid. The treatment liquid of the first discharge amount is the treatment liquid supplied from the second supply pipe. The treatment liquid of the second discharge amount is the treatment liquid supplied from the first supply pipe and the treatment liquid supplied from the second supply pipe.

In one embodiment, it further includes a substrate rotating unit that rotates the substrate around a rotation axis extending in the vertical direction. During the second period, the substrate is rotated relative to the nozzle.

In one embodiment, a driving unit is further provided, and the driving unit moves the nozzle with respect to the substrate during the second period.

In a certain embodiment, the detection part which detects the drive state of the said drive part is further provided. During the second period, the flow control unit opens and closes the first supply pipe based on the detection result of the detection unit.

In one embodiment, the driving unit can change the moving speed of the nozzle. When the flow control unit opens and closes the first supply pipe, the moving speed of the nozzle is slowed down.

In one embodiment, it further includes: a second opening and closing unit that opens and closes the second supply pipe; and a second flow rate adjustment unit that adjusts the flow rate of the treatment liquid flowing through the second supply pipe. During the third period, the flow control unit performs feedback control on the opening degree of the second flow adjustment unit in the state of opening the second supply pipe, and determines the opening degree of the second flow adjustment unit to be the second opening. During the second period, in the state where the opening degree of the second flow rate adjustment part is set to the second opening degree, feedback control is not performed on the opening degree of the second flow rate adjustment part, and the second supply pipe is opened and closed. . The aforementioned third period is the period preceding the aforementioned second period.

The substrate processing method of the present invention includes the following steps: holding the substrate; spraying the processing liquid from the nozzle to the substrate; supplying the processing liquid to the nozzle from the first supply pipe; adjusting the first supply pipe by the first flow rate adjustment unit The flow rate of the above-mentioned processing liquid circulating in the center; the above-mentioned processing liquid is supplied to the above-mentioned nozzle from the second supply pipe; in the state of opening the above-mentioned first supply pipe, the opening degree of the above-mentioned first flow adjustment part is feedback controlled, and the The opening degree of the first flow rate adjustment part is determined as the first opening degree; and in the state where the opening degree of the first flow rate adjustment part is set to the first opening degree, the opening degree of the first flow rate adjustment part is not adjusted. Feedback control is to open and close the aforementioned first supply pipe.

In one embodiment, it further includes the step of rotating the substrate about a rotation axis extending in the vertical direction.

In one embodiment, it further includes the step of moving the nozzle relative to the substrate. [Effect of Invention]

According to the substrate processing apparatus and the substrate processing method of the present invention, it is possible to more quickly discharge a specific discharge amount of processing liquid toward the substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings (FIGS. 1 to 11). However, the present invention is not limited to the following embodiments. In addition, there are cases where it is appropriate to omit descriptions for parts that are repeated in descriptions. In addition, the same reference numerals are given to the same or corresponding parts in the drawings, and descriptions thereof will not be repeated.

The substrate processing apparatus and substrate processing method of the present invention can be used as the "substrate" to be processed, such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, and FED (Field Emission Display, Various substrates such as substrates for field emission displays, substrates for optical disks, substrates for magnetic disks, and substrates for optical magnetic disks. Hereinafter, this embodiment will be described mainly by taking a substrate processing apparatus and a substrate processing method that regard a disc-shaped semiconductor wafer as an object of processing as an example. Various other substrates can also be applied in the same way. Also, the shape of the substrate is not limited to a disc shape, and the substrate processing apparatus and substrate processing method of the present invention can be applied to substrates of various shapes.

[Embodiment 1] Hereinafter, Embodiment 1 of the present invention will be described with reference to Fig. 1 to Fig. 10 . First, a substrate processing apparatus 100 according to this embodiment will be described with reference to FIG. 1 . FIG. 1 is a schematic diagram of a substrate processing apparatus 100 according to this embodiment. In detail, FIG. 1 is a schematic top view of a substrate processing apparatus 100 . The substrate processing apparatus 100 processes a substrate W. As shown in FIG. More specifically, the substrate processing apparatus 100 is a monolithic apparatus that processes substrates W one by one.

As shown in FIG. 1 , the substrate processing apparatus 100 includes a plurality of processing units 1 , a fluid housing 100A, a plurality of fluid tanks 100B, a plurality of load tables LP, an indexer robot IR, a center robot CR, and a control device 101 .

Each of the loading tables LP stacks and accommodates a plurality of substrates W. The indexer robot IR transfers the substrate W between the load table LP and the center robot CR. The central robot CR conveys the substrate W between the indexer robot IR and the processing unit 1 . In addition, an apparatus configuration may be employed in which a stage (path) on which the substrate W is temporarily placed is provided between the indexer robot IR and the center robot CR, and the substrate is indirectly transferred between the indexer robot IR and the center robot CR via the stage. W.

A plurality of processing units 1 are formed with a plurality of towers TW (four towers TW in FIG. 1 ) arranged so as to surround the central robot CR in plan view. Each tower TW includes a plurality of processing units 1 stacked up and down (three processing units 1 in FIG. 1 ). Each of the processing units 1 supplies the processing liquid to the substrate W to process the substrate W.

The fluid case 100A accommodates processing liquid. The fluid tanks 100B each correspond to one of the plurality of columns TW. The processing liquid in the fluid housing 100A is supplied to all the processing units 1 included in the tower TW corresponding to the fluid tank 100B via any fluid tank 100B.

In this embodiment, the processing liquid includes an etching liquid, a rinse liquid, SC1, and SC2. The etchant etches the substrate W. FIG. The etchant is, for example, fluorinated nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO ₃ ), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol) liquid), or phosphoric acid (H ₃ PO ₄ ). The rinse liquid rinses the substrate W. Specifically, the rinse solution is used to rinse the etching solution remaining on the substrate W. As shown in FIG. The rinsing solution is, for example, deionized water, carbonated water, electrolyzed ionized water, hydrogen water, ozone water, or hydrochloric acid water at a diluted concentration (for example, about 10 ppm to 100 ppm). Each of SC1 and SC2 cleans the substrate W. SC1 is, for example, a mixed solution containing NH ₄ OH and H ₂ O ₂ . Although the processing liquid is not particularly limited, in Embodiment 1, the case where the processing liquid is a rinse liquid will be described below.

Next, the control device 101 will be described. The control device 101 controls the operation of each part of the substrate processing apparatus 100 . For example, the control device 101 controls the load table LP, the indexer robot IR, and the center robot CR. The control device 101 includes a control unit 102 and a memory unit 103 .

The control unit 102 has a processor. The control unit 102 has, for example, a CPU (Central Processing Unit, central processing unit) or an MPU (Micro Processing Unit, micro processing unit). Alternatively, the control unit 102 may have a general-purpose computer.

The memory unit 103 stores data and computer programs. The data includes process condition data. The process condition data includes information representing a plurality of process conditions. Each of the plurality of process conditions defines the processing content and processing steps of the substrate W.

The memory unit 103 has a main memory. The main memory device is, for example, a semiconductor memory. The memory unit 103 may further have an auxiliary memory device. The auxiliary memory device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit 103 may include removable media. The control unit 102 controls the operation of each unit of the substrate processing apparatus 100 based on the computer programs and data stored in the storage unit 103 .

Next, the substrate processing apparatus 100 of this embodiment will be further described with reference to FIGS. 1 and 2 . FIG. 2 is a schematic diagram of the processing unit 1 included in the substrate processing apparatus 100 of the present embodiment. In detail, FIG. 2 is a schematic cross-sectional view of the processing unit 1 .

As shown in FIG. 2 , the processing unit 1 includes a chamber 2 , a spin chuck 3 , a spin motor unit 5 , a nozzle 8 , a nozzle moving mechanism 9 , and a guide 10 . Furthermore, the fluid tank 100B of the substrate processing apparatus 100 includes a rinse liquid supply unit 4 . The control device 101 (control unit 102 ) controls the spin chuck 3 , the spin motor unit 5 , and the nozzle moving mechanism 9 .

The chamber 2 has a substantially box shape. The chamber 2 accommodates the substrate W, the spin chuck 3 , the spin motor unit 5 , the guide 10 , the nozzle 8 , the nozzle moving mechanism 9 , and part of the rinse liquid supply unit 4 .

The spin chuck 3 holds the substrate W horizontally. The spin chuck 3 is an example of the "substrate holding part". Specifically, the spin chuck 3 has a plurality of chuck members 32 and a spin base 33 . A plurality of chuck members 32 are disposed on the rotating base 33 along the periphery of the substrate W. As shown in FIG. The plurality of chuck members 32 hold the substrate W in a horizontal posture. The rotary base 33 is substantially disc-shaped, and supports the plurality of chuck members 32 in a horizontal posture.

The rotation motor unit 5 rotates the substrate W integrally with the spin chuck 3 around the first rotation axis AX1 . The first rotation axis AX1 extends in the vertical direction. In the present embodiment, the first rotation axis AX1 extends in a substantially vertical direction. The first rotation axis AX1 is an example of the central axis, and the rotation motor unit 5 is an example of the “substrate rotation unit”. Specifically, the rotation motor unit 5 rotates the rotation base 33 around the first rotation axis AX1. Therefore, the rotation base 33 rotates around the first rotation axis AX1. As a result, the substrate W held by the spin chuck 3 rotates around the first rotation axis AX1.

Specifically, the rotary motor unit 5 has a motor body 51 , a shaft 53 , and an encoder 55 . The shaft 53 is combined with the rotation base 33 . The motor body 51 rotates the shaft 53 . As a result, the spin base 33 rotates.

The encoder 55 detects the rotational position of the substrate W, and outputs a signal indicating the rotational position of the substrate W to the control device 101 (control unit 102 ). Hereinafter, the signal indicating the rotational position of the substrate W is described as a "rotational position signal". The control unit 102 calculates the rotational speed of the substrate W or the rotational speed [rpm] of the substrate W based on the rotational position signal.

The nozzle 8 sprays the rinse liquid toward the substrate W from above the substrate W. As shown in FIG. Specifically, the nozzle 8 sprays the rinse liquid toward the rotating substrate W. As shown in FIG.

The guide 10 has a substantially cylindrical shape. The guide 10 receives the rinse liquid discharged from the substrate W. As shown in FIG.

The nozzle moving mechanism 9 moves the nozzle 8 substantially horizontally. Specifically, the nozzle moving mechanism 9 moves the nozzle 8 in the circumferential direction centering on the second rotation axis AX2 along the substantially vertical direction.

Specifically, the nozzle moving mechanism 9 includes a nozzle arm 91 , a first rotation shaft 93 , a drive unit 95 , and an encoder 94 . The nozzle arm 91 extends substantially horizontally. The nozzle 8 is arranged at the front end of the nozzle arm 91 . The nozzle arm 91 is coupled to the first rotation shaft 93 . The first rotation shaft 93 extends in a substantially vertical direction.

The drive unit 95 rotates the first rotation shaft 93 around the second rotation axis AX2, and turns the nozzle arm 91 along a substantially horizontal plane around the first rotation shaft 93. As a result, the nozzle 81 moves along a substantially horizontal plane. Specifically, the nozzle 8 moves around the first rotation shaft 93 in the circumferential direction around the second rotation axis AX2. The driving unit 95 includes, for example, a stepping motor. Alternatively, the driving unit 95 may include a motor and a speed reducer.

The encoder 94 detects the driving state of the driving unit 95 . The encoder 94 is an example of the "detection unit". Specifically, the encoder 94 detects the rotational state of the drive unit 95, and outputs a signal indicating the amount of rotation of the drive unit 95 to the control device 101 (control unit 102). Hereinafter, the signal indicating the rotation amount of the drive unit 95 is described as a “drive unit rotation amount signal”. The drive unit rotation amount signal is, for example, a pulse signal. The control unit 102 calculates the position of the nozzle 8 relative to the substrate W and the moving speed of the nozzle 8 based on the driving unit rotation amount signal.

Next, nozzle movement processing and substrate rotation processing will be described with reference to FIG. 3( a ) and FIG. 3( b ). Figure 3(a) is a top view showing the nozzle movement process. Fig. 3(b) is a top view showing substrate rotation processing. First, the nozzle movement process will be described with reference to FIG. 3( a ). The nozzle moving process indicates the process of moving the nozzle 8 . The control unit 102 described with reference to FIG. 1 controls the nozzle moving mechanism 9 to move the nozzle 8 .

As shown in FIG. 3( a ), the nozzle moving mechanism 9 can move the nozzle 8 along the arc-shaped trajectory TJ1 in a plan view. The track TJ1 passes through the edge portion EG of the substrate W, the central portion CT of the substrate W, and the outer PO of the substrate W. The edge part EG represents the peripheral part of the board|substrate W. As shown in FIG.

Furthermore, referring to FIG. 3( b ), the substrate rotation process will be described. The substrate rotation process refers to a process of rotating the substrate W. As shown in FIG. 3( b ), the nozzle 8 is arranged at the processing position P during the substrate rotation processing. The processing position P represents the position where the substrate W is processed. In addition, the nozzle 8 discharges the rinse liquid to the processing position P during the substrate rotation processing. Therefore, the nozzle 8 discharges the rinse liquid toward the processing position P along the circumferential direction CD of the substrate W. As shown in FIG.

In Embodiment 1, the nozzle moving mechanism 9 ejects the rinse liquid toward the rotating substrate W while moving the nozzle 8 along the trajectory TJ1 between the center portion CT and the edge portion EG.

Next, the rinse liquid supply unit 4 will be described with reference to FIG. 4 . Fig. 4 is a schematic diagram showing the rinse liquid supply unit 4 of the first embodiment. As shown in FIG. 4 , the rinse liquid supply unit 4 includes a first supply unit 110 , a second supply unit 120 , and a flow rate control unit 200 .

First, the first supply unit 110 will be described. The first supply unit 110 includes a first supply pipe 114 , a first flow meter 113 , a first adjustment valve 112 , and a first on-off valve 111 . The first flow meter 113 , the first regulating valve 112 , and the first on-off valve 111 are arranged in this order on the first supply pipe 114 from downstream to upstream of the first supply pipe 114 . The first adjustment valve 112 is an example of the "first flow rate adjustment unit". The first on-off valve 111 is an example of the "first on-off section".

The first supply pipe 114 supplies the rinse liquid to the nozzle 8 . Specifically, the rinse liquid is supplied to the nozzle 8 from the groove 210 of the fluid housing 100A through the first supply pipe 114 . The first supply pipe 114 is a tubular member through which the flushing fluid flows.

The first on-off valve 111 opens and closes the first supply pipe 114 . That is, the first on-off valve 111 switches between supply and stop of the rinse liquid from the first supply pipe 114 to the nozzle 8 .

The first adjusting valve 112 adjusts the flow rate of the flushing liquid flowing through the first supply pipe 114 . "Flow rate" means, for example, the flow rate of flushing liquid passing through a unit area per unit time. The opening of the first regulating valve 112 is adjusted to adjust the flow rate of the flushing liquid flowing through the first supply pipe 114 . The first regulating valve 112 is, for example, a motor needle valve. Specifically, the first regulating valve 112 includes: a valve body (not shown) with a valve seat inside, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. device (not shown).

The first flow meter 113 measures the flow rate of the flushing liquid flowing through the first supply pipe 114 . The first flowmeter 113 outputs a signal indicating the flow rate to the flow control unit 200 . The signal indicating the flow rate is an example of the "detection result", and indicates the flow rate of the flushing liquid flowing through the first supply pipe 114 . Hereinafter, the signal indicating the flow rate will be described as "the first flow rate signal FA".

Next, the second supply unit 120 will be described. A second supply pipe 124 , a second flowmeter 123 , a second adjustment valve 122 , and a second on-off valve 121 are included. The second flow meter 123 , the second regulating valve 122 , and the second on-off valve 121 are arranged in this order on the second supply pipe 124 from downstream to upstream of the second supply pipe 124 . The second adjustment valve 122 is an example of the "second flow rate adjustment unit". The second on-off valve 121 is an example of the "second on-off section".

The second supply pipe 124 supplies the rinse liquid to the nozzle 8 . Specifically, the rinse liquid is supplied from the tank 210 to the nozzle 8 through the second supply pipe 124 . The second supply pipe 124 is a tubular member through which the flushing fluid flows.

The second on-off valve 121 opens and closes the second supply pipe 124 . That is, the second on-off valve 121 switches between supply and stop of the rinse liquid from the second supply pipe 124 to the nozzle 8 .

The second adjusting valve 122 adjusts the flow rate of the flushing liquid flowing through the second supply pipe 124 . The opening of the second regulating valve 122 is adjusted to adjust the flow rate of the flushing liquid flowing through the second supply pipe 124 . The second regulating valve 122 is, for example, a motor needle valve. Specifically, the second regulating valve 122 includes: a valve body (not shown) with a valve seat inside, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. device (not shown).

The second flow meter 123 measures the flow rate of the flushing liquid flowing through the second supply pipe 124 . The second flowmeter 123 outputs a signal indicating the flow rate to the flow control unit 200 . The signal indicating the flow rate indicates the flow rate of the flushing liquid flowing through the second supply pipe 124 . Hereinafter, the signal indicating the flow rate will be described as "second flow rate signal FB".

Next, the flow rate control unit 200 will be described. The flow control unit 200 controls each configuration of the rinse liquid supply unit 4 . The flow control unit 200 has a processor. The flow control unit 200 includes, for example, a CPU (Central Processing Unit, central processing unit) or an MPU (Micro Processing Unit, micro processing unit). For example, the flow control unit 200 controls the first on-off valve 111 , the first regulating valve 112 , the second on-off valve 121 , and the second regulating valve 122 .

First, a method of controlling the first supply unit 110 will be described. The flow control unit 200 outputs an opening and closing signal SNA to the first opening and closing valve 111 . The opening/closing signal SNA indicates either the open state or the closed state of the first supply pipe 114 . Specifically, the flow control unit 200 outputs the opening and closing signal SNA indicating the open state to the first on-off valve 111 , and the first on-off valve 111 opens the first supply pipe 114 . On the other hand, the flow control unit 200 outputs the opening and closing signal SNA indicating the closed state to the first on-off valve 111 , and the first on-off valve 111 closes the first supply pipe 114 .

Furthermore, the flow rate control unit 200 outputs an opening degree signal SMA to the first regulating valve 112 . The opening degree signal SMA indicates the opening degree of the first regulating valve 112 . For example, in the case where the nozzle 8 ejects a rinse liquid of a first specific flow rate toward the substrate W, the opening degree signal SMA includes the first specific opening amount, and the first specific opening amount is used to flow through the first supply pipe 114. The first regulating valve 112 is opened so that the flow rate of the flushing liquid becomes the first specific flow rate. Specifically, the flow control unit 200 outputs the opening signal AMA including the first specific opening amount to the first regulating valve 112, and the first regulating valve 112 opens with the first specific opening amount.

Furthermore, the flow control unit 200 can perform feedback control on the opening degree of the first regulating valve 112 . Specifically, the flow control unit 200 receives the first flow signal FA from the first flow meter 113 . The flow rate control unit 200 outputs an opening signal AMA indicating an opening amount smaller than the first specific opening amount to the first regulating valve 112 when the flow rate indicated by the first flow rate signal FA is greater than the first specific flow rate. On the other hand, when the flow rate indicated by the first flow signal FA is less than the first specified flow rate, the flow control unit 200 outputs the opening signal AMA indicating an opening amount larger than the first specified opening amount to the first regulating valve. 112. As a result, the flow rate control unit 200 compares the flow rate indicated by the first flow rate signal FA with the first specific flow rate, and the flow rate of the flushing liquid flowing through the first supply pipe 114 becomes the first specific flow rate.

More specifically, the feedback control includes proportional control, integral control, and differential control based on the first flow signal FA. The flow control unit 200 performs proportional control, integral control, and differential control based on the flow rate indicated by the first flow signal FA, and outputs the opening degree signal AMA indicating the opening amount after the execution of the proportional control, integral control, and differential control to the first regulator. Valve 112. Feedback control is, for example, PID control.

In addition, in the case where the nozzle 8 ejects a rinse liquid at a second specific flow rate different from the first specific flow rate toward the substrate W, the opening degree signal SMA includes the second specific opening amount, and the second specific opening amount is used to The first regulating valve 112 is opened so that the flow rate of the flushing liquid flowing through the first supply pipe 114 becomes the second specific flow rate. Specifically, the flow rate control unit 200 outputs the opening signal AMA including the second specific opening amount to the first regulating valve 112, and the first regulating valve 112 opens with the second specific opening amount. Furthermore, the flow control unit 200 performs feedback control on the opening degree of the first regulating valve 112 . As a result, the flow rate control unit 200 compares the flow rate indicated by the first flow rate signal FA with the second specific flow rate, and the flow rate of the flushing liquid flowing through the first supply pipe 114 becomes the second specific flow rate.

Next, the control method of the 2nd supply part 120 is demonstrated. The flow control unit 200 outputs an opening and closing signal SNB to the second on-off valve 121 . The opening and closing signal SNB indicates either the open state or the closed state of the second supply pipe 124 . Specifically, the flow control unit 200 outputs the opening and closing signal SNB indicating the open state to the second on-off valve 121 , and the second on-off valve 121 opens the second supply pipe 124 . On the other hand, the flow control unit 200 outputs the opening and closing signal SNB indicating the closed state to the second on-off valve 121 , and the second on-off valve 121 closes the second supply pipe 124 .

Also, the flow rate control unit 200 outputs an opening degree signal SMB to the second regulating valve 122 . The opening degree signal SMB indicates the opening degree of the second regulating valve 122 . For example, in the case where the nozzle 8 ejects a rinse liquid of a third specific flow rate toward the substrate W, the opening degree signal SMB includes a third specific opening amount for flowing through the second supply pipe 124. The second regulating valve 122 is opened so that the flow rate of the flushing liquid becomes the third specific flow rate. Specifically, the flow rate control unit 200 outputs the opening degree signal AMB including the third specific opening amount to the second regulating valve 122, and the second regulating valve 122 opens at the second specific opening amount. Furthermore, the flow control unit 200 can perform feedback control on the opening degree of the second regulating valve 122 . As a result, the flow rate control unit 200 compares the flow rate indicated by the second flow rate signal FB with the third specific flow rate, and the flow rate of the flushing liquid flowing through the second supply pipe 124 becomes the third specific flow rate.

Next, "first substrate processing (mode 1)" performed by the substrate processing apparatus 100 will be described with reference to FIG. 5 . Fig. 5 is a schematic diagram showing the rinse liquid supply unit 4 of the first embodiment. In addition, FIG. 5 is a diagram showing a state in which the flow control unit 200 executes the "first substrate processing". "First substrate processing" means that the nozzle 8 sprays the rinse liquid at a first specific flow rate toward the upper surface of the substrate W. Also, open valves are shown in white, and closed valves are shown in black.

In the "first substrate processing", the control unit 102 arranges the nozzle 8 at the center portion CT of the substrate W. Furthermore, the flow control unit 200 outputs the opening and closing signal SNB indicating the closed state to the second on-off valve 121 , and the second on-off valve 121 closes the second supply pipe 124 . On the other hand, the flow control unit 200 outputs the opening and closing signal SNA indicating an open state to the first on-off valve 111 , and the first on-off valve 111 opens the first supply pipe 114 . In other words, the second supply unit 120 is not used in the "first substrate processing".

Furthermore, the flow control unit 200 outputs the opening degree signal AMA indicating the first specific opening amount to the first regulating valve 112, so that the first regulating valve 112 is opened at the first specific opening amount. The flow control unit 200 receives the first flow signal FA from the first flow meter 113 . The flow rate control unit 200 compares the flow rate indicated by the first flow rate signal FA with the first specific flow rate, and the flow rate of the flushing liquid flowing through the first supply pipe 114 becomes the first specific flow rate. When the flow rate of the flushing liquid flowing through the first supply pipe 114 becomes the first specific flow rate, the flow rate control unit 200 stops outputting the opening degree signal AMA to the first regulating valve 112 . As a result, the nozzle 8 continuously sprays the rinse liquid at the first specific flow rate toward the upper surface of the substrate W. As shown in FIG. And the nozzle moving mechanism 9 moves the nozzle 8 between the center part CT and the edge part EG along trajectory TJ1.

Next, "second substrate processing (mode 2)" different from "first substrate processing (mode 1)" will be described with reference to Fig. 3(a) to Fig. 7 . "Second substrate processing" is that the nozzle 8 sprays the rinse liquid of the first discharge amount toward the peripheral area including the edge portion EG on the upper surface of the substrate W, and the nozzle 8 ejects toward the central area including the central portion CT on the upper surface of the substrate W The treatment of the flushing liquid of the second spray volume. The peripheral region including the edge portion EG on the upper surface of the substrate W is an example of “the peripheral portion of the substrate”. Specifically, the peripheral area including the edge portion EG on the upper surface of the substrate W is, for example, the upper edge side of a certain value in the radial direction of the substrate W. The central region including the central portion CT on the upper surface of the substrate W is an example of the “central portion of the substrate”. In other words, the state of spraying the rinse liquid of the first discharge amount and the state of spraying the rinse liquid of the second discharge amount are switched. The second discharge amount is larger than the first discharge amount. As a result, it is possible to prevent the rinse liquid from detouring to the back surface of the substrate W. FIG. The first discharge amount is, for example, 500 ml/min, and the second discharge amount is, for example, 2000 ml/min.

In the first embodiment, in order to execute the "second substrate processing" in the second period, the "first preparatory processing" is executed in the first period. The first period is the period preceding the second period. Although the first period is not particularly limited, it is a period immediately before performing the "second substrate processing".

Referring again to FIG. 3( a ) and FIG. 5 , the "first preparation process" will be described. The "first preparation process" is a process of adjusting the flow rate of the flushing liquid flowing through the first supply pipe 114 in advance. In the "first substrate processing" shown in FIG. 5 , the nozzle 8 is arranged at the center portion CT of the substrate W, but in the "first preparatory processing", for example, the nozzle 8 is arranged at a specific position (HOME position). Although the specific position is not particularly limited, it is, for example, the outer PO of the substrate W.

In the "first preparation process", the control unit 102 arranges the nozzle 8 on the outer PO of the substrate W. Furthermore, the flow control unit 200 outputs the opening and closing signal SNB indicating the closed state to the second on-off valve 121 , and the second on-off valve 121 closes the second supply pipe 124 . On the other hand, the flow control unit 200 outputs the opening and closing signal SNA indicating an open state to the first on-off valve 111 , and the first on-off valve 111 opens the first supply pipe 114 .

Moreover, the flow control unit 200 outputs the opening signal AMA including the first opening amount to the first regulating valve 112, and the first regulating valve 112 is opened at the first opening amount, and the first opening amount is used to control the first opening amount by the first opening amount. 1. The first regulating valve 112 is opened so that the flow rate of the flushing liquid flowing through the supply pipe 114 becomes the first flow rate. The first flow rate is the difference between the first discharge amount and the second discharge amount. The first flow rate is, for example, 1500 ml/min.

The flow control unit 200 receives the first flow signal FA from the first flow meter 113 . The flow rate control unit 200 compares the flow rate indicated by the first flow rate signal with the first flow rate, and the flow rate of the flushing liquid flowing through the first supply pipe 114 becomes the first flow rate. As a result, the nozzle 8 ejects the rinse liquid at the first flow rate toward the outside PO. At this time, the opening degree of the first regulating valve 112 is the first opening degree. In other words, the first opening degree represents the opening degree of the first regulating valve 112 for passing the flushing fluid of the first flow rate through the first supply pipe 114 . Furthermore, the flow control unit 200 determines the opening degree of the first regulating valve 112 at the time of performing the "second substrate processing" as the first opening degree.

After the flow control unit 200 determines the opening degree of the first regulating valve 112 as the first opening degree, the flow control unit 200 outputs the opening and closing signal SNA indicating the closed state to the first opening and closing valve 111, and the first opening and closing valve 111 The first supply pipe 114 is closed. As a result, the flow rate of the flushing liquid flowing through the first supply pipe 114 becomes zero.

Next, "second substrate processing" will be described with reference to FIGS. 6 and 7 . 6 and 7 are schematic diagrams showing the rinse liquid supply unit 4 of the first embodiment. In addition, FIG. 6 is a diagram showing a state in which the nozzle 8 sprays the first discharge amount of rinse liquid toward the peripheral region including the edge portion EG on the upper surface of the substrate W. As shown in FIG. 7 is a diagram showing a state in which the nozzle 8 sprays the rinse liquid of the second discharge amount toward the central region including the central portion CT on the upper surface of the substrate W. As shown in FIG.

As shown in FIG. 6 , the flow control unit 200 outputs the opening and closing signal SNB indicating the open state to the second on-off valve 121 , and the second on-off valve 121 opens the second supply pipe 124 . Furthermore, the flow control unit 200 outputs to the second regulating valve 122 an opening signal SMB indicating a second opening amount for making the flow rate of the flushing liquid flowing through the second supply pipe 124 the second flow rate. In this way, the second regulating valve 122 is opened. The flushing liquid of the second flow rate flows through the second supply pipe 124 . The second flow rate is the first discharge amount.

The flow control unit 200 outputs an opening degree signal SMA indicating the first opening degree to the first regulating valve 112 in advance. Furthermore, the flow control unit 200 outputs the opening and closing signal SNA indicating the closed state to the first on-off valve 111 , and the first on-off valve 111 closes the first supply pipe 114 . In other words, the flow control unit 200 outputs an opening/closing signal indicating a closed state to the first opening/closing valve 111 in a state where the opening degree of the first regulating valve 112 is set to the first opening degree. As a result, the nozzle 8 discharges the rinse liquid in the first discharge amount toward the substrate W. As shown in FIG.

On the other hand, as shown in FIG. 7 , the flow control unit 200 outputs the opening and closing signal SNB indicating the open state to the second on-off valve 121 , and the second on-off valve 121 opens the second supply pipe 124 . Furthermore, the flow control unit 200 outputs to the second regulating valve 122 an opening signal SMB indicating a second opening amount for making the flow rate of the flushing liquid flowing through the second supply pipe 124 the second flow rate. In this way, the second regulating valve 122 is opened. The flushing liquid of the second flow rate flows through the second supply pipe 124 .

Furthermore, the flow rate control unit 200 outputs an opening degree signal SMA indicating the first opening degree to the first regulating valve 112 in advance. Moreover, the flow rate control part 200 outputs the opening-closing signal SNA which shows an open state to the 1st on-off valve 111, and the 1st on-off valve 111 opens the 1st supply pipe 114. In other words, the flow control unit 200 outputs an opening/closing signal indicating an open state to the first on-off valve 111 in a state where the opening degree of the first regulating valve 112 is set to the first opening degree. As a result, the nozzle 8 discharges the rinse liquid in the second discharge amount toward the substrate W. As shown in FIG.

Here, referring to FIG. 8 , the switching between the state of ejecting the rinse liquid of the first ejection amount and the state of ejecting the rinse liquid of the second ejection amount will be described. FIG. 8 is a graph (graph) showing an example of the relationship between the discharge amount of the flushing liquid from the nozzle 8 and time. As shown in FIG. 8 , the horizontal axis represents time, and the vertical axis represents discharge amount.

The time T1 represents the time when the flow control unit 200 outputs the opening and closing signal SNA indicating the open state to the first opening and closing valve 111 . The time T2 represents the time when the flow control unit 200 outputs the opening and closing signal SNA indicating the closed state to the first opening and closing valve 111 . Time T3 represents the time when the flow control unit 200 outputs the opening and closing signal SNB indicating the closed state to the second opening and closing valve 121 .

Also, the first discharge amount X1 is, for example, 500 ml/min. The second discharge amount X2 is, for example, 2000 ml/min.

Within a short period ΔT (for example, within 1 second) from the time T1, the discharge amount of the rinse liquid changes from the first discharge amount X1 to the second discharge amount X2. Also, the discharge amount of the rinse liquid is changed from the first discharge amount X1 to the second discharge amount X2 without fluctuation. The fluctuation means, for example, that the discharge amount of the flushing liquid is repeatedly greater or less than the second discharge amount X2. In other words, fluctuation means that the ejection amount is not stable.

In the above, Embodiment 1 of the present invention has been described. According to Embodiment 1, the flow rate control unit 200 does not control the opening of the first regulating valve 112 during the second period ("second substrate processing") with the opening degree of the first regulating valve 112 at the first opening degree. The opening degree is feedback-controlled, and an on-off signal indicating the open state is output to the first on-off valve 111 . As a result, the rinse liquid of the second discharge amount X2 can be supplied to the substrate W more quickly than when the opening degree of the first regulating valve 112 is feedback-controlled. Moreover, compared with the case where the opening degree of the first regulating valve 112 is feedback-controlled, the rinse liquid of the second discharge amount X2 can be supplied to the substrate W without fluctuation.

Also, since the feedback control includes proportional control, integral control, and differential control based on the first flow signal FA, the flow control unit 200 can determine the opening degree of the first regulating valve 112 as the first opening degree with higher accuracy.

Also, since the flushing liquid of the first ejection amount X1 is the flushing liquid supplied from the second supply pipe 124, the flushing liquid of the second ejection amount X2 is the flushing liquid supplied from the first supply pipe 114 and the flushing liquid supplied from the second supply pipe 124. The supplied rinsing liquid, therefore, can suppress fluctuations and switch more quickly during the second period: the rinsing liquid of the first ejection amount X1 is ejected toward the peripheral region of the upper surface of the substrate W including the edge portion EG, and the second ejection amount X1 The rinsing liquid of the ejection amount X2 is ejected toward the central region of the upper surface of the substrate W including the central portion CT.

Furthermore, when the rotation motor unit 5 rotates the substrate W and the spin chuck 3 integrally, the rinse liquid of the second discharge amount X2 can be discharged toward a desired position of the substrate W more quickly. Furthermore, when the nozzle moving mechanism 9 moves the nozzle 8, the rinse liquid of the second discharge amount X2 can be discharged toward a desired position of the substrate W more quickly.

More specifically, the encoder 94 outputs the drive unit rotation amount signal to the control device 101 and outputs it to the flow rate control unit 200 . The flow control unit 200 opens and closes the first supply pipe 114 based on the drive unit rotation amount signal from the encoder 94 during the second period. For example, when the rotation amount indicated by the rotation amount signal of the driving part is less than a specific rotation amount, the on-off signal SNA indicating the closed state is output to the first on-off valve 111 . Specifically, when the number of pulses indicated by the rotation amount signal of the drive unit does not reach the threshold value, the on-off signal SNA indicating the open state is not output to the first on-off valve 111 . As a result, the nozzle 8 discharges the rinse liquid in the first discharge amount X1 toward the peripheral region of the substrate W including the edge portion EG.

On the other hand, when the rotation amount indicated by the drive unit rotation amount signal is equal to or greater than a specific rotation amount, the opening/closing signal SNA indicating an open state is output to the first on/off valve 111 . Specifically, when the number of pulses indicated by the drive unit rotation amount signal is equal to or greater than the threshold value, the on-off signal SNA indicating the open state is output to the first on-off valve 111 . In other words, when the nozzle 8 is arranged above the central region including the central portion CT of the substrate W, the on-off signal SNA indicating the open state is output to the first on-off valve 111 . As a result, the nozzle 8 discharges the rinse liquid of the second discharge amount X2 toward the central region of the substrate W including the central portion CT. Therefore, the flow control unit 200 can control the first on-off valve 111 based on the drive unit rotation amount signal without receiving a control signal from the control unit 102 (computer that controls the operation of each unit of the substrate processing apparatus 100 ).

In addition, when changing from the first period to the second period, the state of feedback control of the opening of the first regulating valve 112 is switched to the state of not performing feedback control, but the state of performing feedback control of the opening of the first regulating valve 112 The timing at which the feedback control state is switched to the non-feedback control state may be, for example, the timing at which a certain period elapses from the first period, or the timing at which the nozzle 8 moves to a specific position (processing start position). The specific timing of moving to a specific position can be, for example, the timing of disposing the nozzle 8 from the outer PO of the substrate W to the central portion CT of FIG. 3( a ).

Next, the substrate processing method according to this embodiment will be described with reference to FIGS. 9 and 10 . The substrate processing method of this embodiment is performed by the substrate processing apparatus 100 described with reference to FIGS. 1 to 7 . 9 and 10 are flowcharts showing processes performed by the control unit 102 and the flow rate control unit 200 included in the substrate processing apparatus 100 of the present embodiment.

First, the flow control unit 200 outputs the opening/closing signal SNA indicating the closed state to the first opening/closing valve 111 so that the first opening/closing valve 111 closes the first supply pipe 114 . Moreover, the flow control unit 200 outputs the opening and closing signal SNB indicating the closed state to the second opening and closing valve 121, so that the second opening and closing valve 121 closes the second supply pipe 124 (step S101).

Next, the control part 102 controls the nozzle moving mechanism 9 so that the nozzle 8 may move to a specific position (step S2). The specific location is, for example, the outer PO of the substrate W.

Next, the flow control unit 200 outputs the opening and closing signal SNB indicating the open state to the first opening and closing valve 111, so that the first opening and closing valve 111 opens the first supply pipe 114 (step S103).

Next, the flow control unit 200 receives the first flow signal FA from the first flow meter 113 (step S104).

Next, the flow rate control unit 200 determines whether the difference between the flow rate indicated by the first flow rate signal FA and the first flow rate is equal to or greater than a threshold value (step S105). When the control unit 102 determines that the difference between the flow rate indicated by the first flow signal FA and the first flow rate is greater than the threshold value (Yes in step S105), the flow control unit 200 executes the flow rate based on the flow rate indicated by the first flow signal FA. Proportional control, integral control, and differential control, and an opening degree signal AMA indicating the opening amount after proportional control, integral control, and differential control is output to the first adjusting valve 112 (step S106).

On the other hand, when the control unit 102 determines that the difference between the flow rate indicated by the first flow rate signal FA and the first flow rate is not greater than the threshold value (NO in step S105), the flow rate control unit 200 sets the closed state to The on-off signal SNA is output to the first on-off valve 111 so that the first on-off valve 111 closes the first supply pipe 114 . Furthermore, the flow control unit 200 outputs the opening and closing signal SNB indicating the open state to the second opening and closing valve 121, so that the second opening and closing valve 121 opens the second supply pipe 124 (step S107). In other words, the flow control unit 200 sets the opening degree of the first regulating valve 112 at the time of performing the "second substrate processing" as the first opening degree.

Then, the flow rate control unit 200 determines whether or not the position of the nozzle 8 is in the central region including the central portion CT of the substrate W during execution of the "second substrate processing" (step S108 ). When the flow control unit 200 determines that the position of the nozzle 8 is the central region including the central portion CT of the substrate W (Yes in step S108), the flow control unit 200 outputs the opening and closing signal SNA indicating the open state to the first opening and closing valve. 111, and the first on-off valve 111 opens the first supply pipe 114 (step S109). As a result, the nozzle 8 discharges the rinse liquid of the second discharge amount X2 toward the substrate W. As shown in FIG.

On the other hand, when the flow control unit 200 determines that the position of the nozzle 8 is not the central area including the center portion CT of the substrate W (No in step S108), the flow control unit 200 outputs the switch signal SNA indicating the closed state to the first 1 on-off valve 111, and the first on-off valve 111 closes the first supply pipe 114 (step S110). As a result, the nozzle 8 discharges the rinse liquid in the first discharge amount X1 toward the substrate W. As shown in FIG.

[Embodiment 2] Again, referring to FIG. 4, Embodiment 2 of the present invention will be described. However, matters different from those in Embodiment 1 will be described, and descriptions of matters that are the same as those in Embodiment 1 will be omitted. Embodiment 2 differs from Embodiment 1 in that the discharge amount of the rinse liquid is switched to four types: 0, the first discharge amount, the second discharge amount, and the third discharge amount.

In the second embodiment, in order to execute the "second substrate processing" in the second period, the "second preparatory processing" is executed in the third period. The third period is the period preceding the second period. The third period may be the same as the first period.

The "second preparation process" is a process of adjusting the flow rate of the rinse liquid flowing through the second supply pipe 124 in advance. In the "second preparation process", for example, the nozzle 8 is arranged at a specific position.

In the "second preparation process", the control unit 102 arranges the nozzle 8 on the outer PO of the substrate W. Furthermore, the flow control unit 200 outputs the opening and closing signal SNA indicating the closed state to the first on-off valve 111 , and the first on-off valve 111 closes the first supply pipe 114 . On the other hand, the flow control unit 200 outputs the opening and closing signal SNB indicating the open state to the second on-off valve 121 , and the second on-off valve 121 opens the second supply pipe 124 .

Furthermore, the flow control unit 200 outputs the opening signal AMB including the second opening amount to the second regulating valve 122, and the second regulating valve 122 is opened at the second opening amount, and the second opening amount is used to control the second opening amount by the second opening amount. 2. Open the second regulating valve 122 so that the flow rate of the flushing liquid flowing through the supply pipe 124 becomes the second flow rate. The flow rate control unit 200 receives the second flow rate signal FB from the second flow meter 123 . The flow rate control unit 200 compares the flow rate indicated by the second flow rate signal FB with the second flow rate, and the flow rate of the flushing liquid flowing through the second supply pipe 124 becomes the second flow rate. As a result, the nozzle 8 ejects the rinse liquid of the second flow rate toward the outside PO. At this time, the opening degree of the second regulating valve 122 is the second opening degree. In other words, the second opening degree represents the opening degree of the second regulating valve 122 for passing the flushing fluid of the second flow rate through the second supply pipe 124 . The flow control unit 200 determines the opening degree of the second regulating valve 122 as the second opening degree.

During the second period, the flow control unit 200 outputs an opening degree signal SMB indicating the second opening degree to the second regulating valve 122 in advance. Moreover, the flow rate control part 200 outputs the opening and closing signal SNB to the 2nd opening and closing valve 121, and the 2nd opening and closing valve 121 opens and closes the 2nd supply pipe 124. In other words, the flow rate control unit 200 outputs an opening and closing signal to the second on-off valve 121 in a state where the opening degree of the second regulating valve 122 is set to the second opening degree during the second period.

In the above, Embodiment 2 of the present invention has been described. According to Embodiment 2, the flow control unit 200 sets the opening degree of the first regulating valve 112 to the first opening degree and the opening degree of the second regulating valve 122 to the second period ("second substrate processing"). In the state of the second opening degree, an opening and closing signal indicating the open state is output to the first on-off valve 111 and the second on-off valve 121 . As a result, the rinse liquid can be supplied to the substrate W in four types of discharge amounts: 0, the first discharge amount, the second discharge amount, and the third discharge amount.

[Embodiment 3] Next, Embodiment 3 of the present invention will be described with reference to FIG. 11 . Fig. 11 is a schematic diagram showing the rinse liquid supply unit 4 of the third embodiment. However, matters different from those in Embodiment 2 will be described, and descriptions of matters that are the same as those in Embodiment 2 will be omitted. The third embodiment differs from the second embodiment in that the rinse liquid supply unit 4 further includes a third supply unit 130 .

Specifically, the third supply unit 130 includes a third supply pipe 134 , a third flow meter 133 , a third adjustment valve 132 , and a third on-off valve 131 . The third flow meter 133 , the third regulating valve 132 , and the third on-off valve 131 are arranged in this order on the third supply pipe 134 from downstream to upstream of the third supply pipe 134 .

The third supply pipe 134 supplies the rinse liquid to the nozzle 8 . Specifically, the rinse liquid is supplied from the tank 210 to the nozzle 8 through the third supply pipe 134 . The third supply pipe 134 is a tubular member through which the flushing liquid flows.

The third on-off valve 131 opens and closes the third supply pipe 134 . That is, the third on-off valve 131 switches between supply and stop of the rinse liquid from the third supply pipe 134 to the nozzle 8 .

The third adjusting valve 132 adjusts the flow rate of the flushing liquid flowing through the third supply pipe 134 . The opening of the third regulating valve 132 is adjusted to adjust the flow rate of the flushing liquid flowing through the third supply pipe 134 . The third regulating valve 132 is, for example, a motor needle valve. Specifically, the third regulating valve 132 includes: a valve body (not shown) with a valve seat inside, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. device (not shown).

The third flowmeter 133 measures the flow rate of the flushing liquid flowing through the third supply pipe 134 . The third flowmeter 133 outputs a signal indicating the flow rate to the flow control unit 200 . The signal indicating the flow rate indicates the flow rate of the flushing liquid flowing through the third supply pipe 134 . Hereinafter, the signal indicating the flow rate will be referred to as "the third flow rate signal".

The flow control unit 200 further controls the third on-off valve 131 and the third adjustment valve 132 .

In the above, Embodiment 3 of the present invention has been described. According to Embodiment 3, seven kinds of discharge amounts of 0, the first discharge amount, the second discharge amount, the third discharge amount, the fourth discharge amount, the fifth discharge amount, and the sixth discharge amount can be supplied to the substrate W more quickly. of rinse solution. 0. The first discharge amount, the second discharge amount, the third discharge amount, the fourth discharge amount, the fifth discharge amount, and the sixth discharge amount are different from each other. As a result, detailed control can be performed regarding the discharge amount.

The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 11). However, this invention is not limited to the above-mentioned embodiment, It can implement in various forms in the range which does not deviate from the said summary. In addition, the plurality of components disclosed in the above-mentioned embodiments can be appropriately changed. For example, one of all the constituent elements shown in a certain embodiment may be added to the constituent elements of another embodiment, or some of all the constituent elements shown in a certain embodiment may be deleted from the embodiment. constituent elements.

In order to make the invention easy to understand, the drawings schematically show each constituent element on the main body, and the thickness, length, number, interval, etc. of each constituent element shown in the illustration may be different from the actual situation for the convenience of making the drawing. Moreover, the structure of each component shown in the above-mentioned embodiment is an example, and is not specifically limited, It goes without saying that various changes can be made in the range which does not substantially deviate from the effect of this invention.

(1) For example, the nozzle 8 described with reference to FIG. 3 moves at a constant speed around the first rotation axis 93 in the circumferential direction centered on the second rotation axis AX2, but it is not particularly limited. It is possible that the nozzle moving mechanism 9 (drive unit 95 ) can change the moving speed of the nozzle 8 . For example, when the flow control unit 200 opens and closes the first supply pipe 114 , the nozzle moving mechanism 9 (drive unit 95 ) can slow down the moving speed of the nozzle 8 . As a result, the rinse liquid can be ejected toward a desired position on the substrate W with higher precision.

(2) For example, the flow control unit 200 detects the position of the nozzle 8 based on the driving unit rotation amount signal from the encoder 94 , but can detect the position of the nozzle 8 based on the driving time of the driving unit 95 .

(3) For example, the spin chuck 3 described with reference to FIG. 2 is a clamping chuck in which a plurality of chuck members 32 are brought into contact with the peripheral end surface of the substrate W. However, as long as the method of holding the substrate W can hold the substrate W horizontally, There is no particular limitation. For example, the spin chuck 3 can be a vacuum chuck or a Bernoulli chuck. [Industrial availability]

The invention is useful in the field of processing substrates.

1: Processing unit 2: Chamber 3: Rotary chuck 4: Rinse liquid supply unit 5: Rotary motor unit 8: Nozzle 9: Nozzle moving mechanism 10: Guide 32: Chuck member 33: Third adjustment valve 51: Motor body 53: Shaft 55: Encoder 91: Nozzle arm 93: First rotating shaft 94: Encoder 95: Drive unit 100: Substrate processing apparatus 100A: Fluid case 100B: Fluid tank 101: Control unit 102: Control unit 103 : memory unit 110: first supply unit 111: first on-off valve (first on-off unit) 112: first adjustment valve (first flow rate adjustment unit) 113: first flow meter 114: first supply pipe 120: second Supply part 121: Second on-off valve (Second on-off part) 122: Second regulating valve (Second flow rate adjustment part) 123: Second flow meter 124: Second supply pipe 130: Third supply part 131: Third on-off Valve 132: 3rd adjustment valve 133: 3rd flowmeter 134: 3rd supply pipe 200: Flow rate control unit 210: Groove AX1: 1st rotation axis AX2: 2nd rotation axis CD: Circumferential direction of substrate CR: Center robot CT : Central part of substrate = EG: Edge part FA: First flow signal FB: Second flow signal IR: Indexer robot LP: Loading table MP: P: Processing position PO: External SMA of the substrate, SMB: Opening signal SNA, SNB: open Close signal T1~T3: Time TJ1: Trajectory TW: Tower W: Substrate X1: 1st discharge amount X2: 2nd discharge amount ΔT: Short period

FIG. 1 is a schematic diagram of a substrate processing apparatus according to Embodiment 1 of the present invention. FIG. 2 is a schematic diagram of a processing unit included in the substrate processing device of Embodiment 1. Figure 3(a) is a top view showing the nozzle movement process. (b) is a top view showing substrate rotation processing. Fig. 4 is a schematic diagram showing the flushing liquid supply part of Embodiment 1. Fig. 5 is a schematic diagram showing the flushing liquid supply part of Embodiment 1. Fig. 6 is a schematic diagram showing the flushing liquid supply part of Embodiment 1. Fig. 7 is a schematic diagram showing the flushing liquid supply part of Embodiment 1. Fig. 8 is a graph showing an example of the relationship between the amount of flushing liquid ejected from the nozzle and time. FIG. 9 is a flow chart showing the processing performed by the control unit and the flow control unit included in the substrate processing apparatus according to the first embodiment. FIG. 10 is a flow chart showing processing performed by the control unit and the flow control unit included in the substrate processing apparatus according to the first embodiment. Fig. 11 is a schematic diagram showing the flushing liquid supply part of Embodiment 3 of the present invention.

8: Nozzle

91: nozzle arm

94: Encoder

95: drive unit

100A: Fluid housing

100B: Fluid tank

101: Control device

110: The first supply department

111: The first opening and closing valve (the first opening and closing part)

112: 1st adjustment valve (1st flow adjustment part)

113: 1st flow meter

114: No. 1 supply pipe

120: The 2nd supply department

121: The second opening and closing valve (the second opening and closing part)

122: The second adjustment valve (the second flow adjustment part)

123: The second flow meter

124: The second supply pipe

200: flow control department

210: slot

FA: 1st flow signal

FB: 2nd flow signal

SMA, SMB: opening signal

SNA, SNB: open and close signal

Claims (11)

A substrate processing device, comprising: a substrate holding part that holds a substrate; a nozzle that sprays a processing liquid onto the substrate; a first supply pipe that supplies the processing liquid to the nozzle; a first opening and closing part that feeds the first 1 opening and closing of the supply pipe; a first flow adjustment part, which adjusts the flow rate of the aforementioned processing liquid circulating in the aforementioned first supply pipe; a second supply pipe, which supplies the aforementioned processing liquid to the aforementioned nozzle; and a flow control part, which controls The aforementioned first opening and closing portion and the aforementioned first flow rate adjusting portion; and The aforementioned flow rate control portion performs feedback control on the opening degree of the aforementioned first flow rate adjusting portion while opening the aforementioned first supply pipe during the first period , set the opening degree of the first flow adjustment part as the first opening degree, during the second period, in the state where the opening degree of the first flow adjustment part is set as the first opening degree The opening of the flow adjustment part is feedback-controlled to open and close the aforementioned first supply pipe, and the aforementioned first period is a period earlier than the aforementioned second period. The substrate processing device according to claim 1, further comprising a flow meter, the flow meter measures the flow rate of the aforementioned processing liquid circulating in the aforementioned first supply pipe; The aforementioned first flow adjustment part outputs an opening signal; The aforementioned opening and closing signal indicates either the open state or the closed state of the aforementioned first supply pipe; The aforementioned opening signal indicates the opening degree of the aforementioned first flow adjustment part; The aforementioned feedback control It includes proportional control, integral control, and differential control based on the detection results of the aforementioned flowmeter. The substrate processing device according to claim 1 or 2, wherein during the second period, the nozzle sprays the first discharge amount of the treatment liquid toward the peripheral portion of the substrate; The above-mentioned processing liquid of the second discharge amount with the largest discharge amount, the above-mentioned processing liquid of the first discharge amount is the above-mentioned processing liquid supplied from the second supply pipe; the above-mentioned processing liquid of the second discharge amount is from the above-mentioned The processing liquid supplied from the first supply pipe, and the processing liquid supplied from the second supply pipe. The substrate processing apparatus according to claim 3, further comprising a substrate rotating unit that rotates the substrate centering on a rotation axis extending in the vertical direction; and during the second period, rotates the substrate relative to The aforementioned nozzles rotate. The substrate processing apparatus according to claim 3, further comprising a drive unit configured to move the nozzle relative to the substrate during the second period. The substrate processing apparatus according to claim 5, further comprising a detection unit that detects the driving state of the driving unit; and During the second period, the flow control unit opens and closes the first supply pipe based on the detection result of the detection unit . The substrate processing apparatus according to claim 6, wherein the driving unit can change the moving speed of the nozzle; and the flow control unit slows down the moving speed of the nozzle when opening and closing the first supply pipe. The substrate processing device according to claim 1 or 2, which further includes: a second opening and closing part, which opens and closes the aforementioned second supply pipe; flow rate; and the above-mentioned flow control part, during the third period, in the state of opening the above-mentioned second supply pipe, performs feedback control on the opening of the above-mentioned second flow adjustment part, and the opening of the above-mentioned second flow adjustment part Set as the second opening, during the second period, in the state where the opening of the second flow adjustment part is set to the second opening, feedback control is not performed on the opening of the second flow adjustment part, The aforementioned 2nd supply pipe is opened and closed, and the aforementioned 3rd period is a period before the aforementioned 2nd period. A substrate processing method comprising the following steps: holding a substrate; spraying a processing liquid from a nozzle to the substrate; supplying the processing liquid to the nozzle from a first supply pipe; adjusting the first supply pipe by a first flow rate adjustment unit The flow rate of the aforementioned processing liquid circulating in the center; The aforementioned processing liquid is supplied to the aforementioned nozzle from the second supply pipe; In the state where the aforementioned first supply pipe is opened, feedback control is performed on the opening degree of the aforementioned first flow rate adjustment part, and the The opening degree of the first flow adjustment part is set as the first opening degree; and In the state where the opening degree of the first flow adjustment part is set as the first opening degree, the opening degree of the first flow adjustment part is not adjusted The feedback control is to open and close the aforementioned first supply pipe. The substrate processing method according to claim 9, further comprising a step of rotating the substrate around a rotation axis extending in the vertical direction. The substrate processing method according to claim 9 or 10, further comprising the step of moving the nozzle relative to the substrate.

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