TW202249307A - Sheet for optical semiconductor device encapsulation and method for manufacturing optical semiconductor device - Google Patents

Abstract

The invention provides a sheet for sealing an optical semiconductor element, which has excellent sealing performance of the optical semiconductor element and is not easy to be damaged when adjacent optical semiconductor devices are separated from each other and not easy to be adhered to the adjacent optical semiconductor devices. A sheet (1) for sealing an optical semiconductor element is a sheet for sealing one or more optical semiconductor elements (6) disposed on a substrate (5). A sheet (1) for sealing an optical semiconductor element is provided with a base part (2) and a sealing part (3) provided on one surface of the base part (2). And a sealing part (3) for sealing the optical semiconductor element (6), the sealing part (3) having a radiation non-curable adhesive layer (32) and a radiation-curable resin layer (31) laminated on the radiation non-curable adhesive layer (32). The radiation-non-curable adhesive layer (32) is located on the surface on the optical semiconductor element (6) side when sealing the optical semiconductor element (6).

Description

Sheet for sealing optical semiconductor element and manufacturing method of optical semiconductor device

The present invention relates to a sheet for sealing an optical semiconductor element. More specifically, the present invention relates to a sheet for sealing one or more optical semiconductor elements arranged on a substrate. Also, the present invention relates to a method of manufacturing an optical semiconductor device.

For example, it is known that a backlight device used in a liquid crystal display device has a structure in which a plurality of LEDs (Light-Emitting Diodes) are disposed on a substrate, and the plurality of LEDs are encapsulated by a sealing resin. seal. As a method of sealing the plurality of LEDs together using the sealing resin, there is known a method in which a liquid resin is poured into a region where the plurality of LEDs are arranged to bury the plurality of LEDs, and thereafter, the plurality of LEDs are sealed by heat or ultraviolet rays. Irradiation hardens the liquid resin (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-66390

[Problem to be solved by the invention]

However, the method of sealing optical semiconductor elements such as LEDs with a liquid resin has a problem of poor workability, such as dripping and adhesion of the liquid resin to undesired areas when the liquid resin is applied.

In view of this, the industry thinks that by adopting the form of a sealing sheet having a sealing layer for sealing an optical semiconductor element without using a liquid resin, it is possible to seal the optical semiconductor easily and in a short time in simple steps element. Here, it is important that the said sheet|seat for sealing is excellent in sealing property to an optical-semiconductor element, and it is excellent in adhesiveness to an optical-semiconductor element or the board|substrate provided with an optical-semiconductor element, and to fully seal an optical-semiconductor element.

By the way, with the improvement of image quality such as 4K and 8K, the demand for image display devices with larger screens is increasing. In addition, the use of large-screen image display devices is also increasing in outdoor and public facility advertising displays or signs such as signage boards. However, if an image display device with a large screen is manufactured, there will be a problem of lower yield rate and higher manufacturing cost. In order to manufacture large-screen image display devices at a lower cost, the industry is arranging a plurality of optical semiconductor devices such as image display devices into a brick-shaped collage-type display. When a plurality of photo-semiconductor devices are arranged in a brick shape, that is, a collage, position correction is performed when adjacently arranged photo-semiconductor devices are displaced from each other or need to be rearranged.

Here, when bonding the optical semiconductor devices in a state where the optical semiconductor elements are sealed by the sealing sheet, in order to perform position correction, it is necessary to temporarily pull apart the adjacent optical semiconductor devices at the time of bonding. However, when pulled apart, there are sometimes disadvantages such as that the sealing sheet in one optical semiconductor device is in close contact with the sealing sheet in another adjacent optical semiconductor device and is attracted to each other, resulting in a single optical semiconductor device. One of the sealing sheets was chipped, and a part of one sealing sheet was transferred and adhered to the other optical semiconductor device. Such a problem is particularly likely to occur in a sealing sheet having excellent adhesion to an optical semiconductor element or a substrate.

The present invention was conceived based on the above circumstances, and its object is to provide a sheet for sealing optical semiconductor elements, which has excellent sealing properties for optical semiconductor elements and is less likely to cause damage when adjacent optical semiconductor devices are pulled apart from each other. The sheet is missing or the sheet of the adjacent photo-semiconductor device is attached. [Technical means to solve the problem]

The inventors of the present invention conducted earnest research to achieve the above object, and as a result, found that an optical semiconductor having a sealing portion having a radiation non-curable adhesive layer and a radiation-curable resin layer in which the radiation non-curable adhesive layer is located in the sealing portion The optical semiconductor element sealing sheet on the surface of the element side makes the sealing performance of the optical semiconductor element excellent, and when the adjacent optical semiconductor devices are pulled apart, it is difficult to cause the sheet to be damaged or the adjacent optical semiconductor device to be damaged material attached. This invention was completed based on these knowledge.

That is, the present invention provides a sheet for sealing an optical semiconductor element, which is a sheet for sealing one or more optical semiconductor elements arranged on a substrate, The sheet for encapsulating an optical semiconductor element includes a base portion, and a sealing portion provided on one surface of the base portion and sealing the optical semiconductor element; and The sealing portion has a radiation non-curable adhesive layer positioned on the surface of the optical semiconductor element side when sealing the optical semiconductor element, and a radiation curable resin layer laminated on the radiation non-curable adhesive layer.

As mentioned above, the said sheet|seat for optical-semiconductor element sealing is equipped with the sealing part which laminated|stacked the radiation non-curable adhesive agent layer and a radiation curable resin. The said sealing part is a region which seals an optical-semiconductor element in the said sheet|seat for optical-semiconductor element sealing. And when sealing an optical semiconductor element, a radiation non-hardening adhesive layer is located in the surface of the sealing part which becomes an optical semiconductor element side. When the above-mentioned radiation non-curable adhesive layer is located on the above-mentioned surface, when the above-mentioned optical-semiconductor element sealing sheet seals an optical-semiconductor element, the above-mentioned radiation-non-curable adhesive layer has excellent adhesion to the optical-semiconductor element and the substrate, and the optical semiconductor The sealing performance of components is excellent. Furthermore, after sealing, the said radiation curable resin layer is cured by irradiation with radiation, and the adhesiveness of the side surface of the sheet|seat for sealing is reduced. Thereby, in the collage state, the sealing parts of the adjacent optical semiconductor devices have low adhesion to each other, and when the adjacent optical semiconductor devices are pulled apart, it is difficult to cause sheet defects or damage the adjacent optical semiconductor devices. The sheet is attached. Moreover, the said base material part becomes the support body of the said sealing part, and the handling property of the said sheet|seat for optical-semiconductor element sealing is excellent by providing the said base material part. In addition, when an optical semiconductor device is manufactured by sealing the optical semiconductor device with a sheet for sealing the optical semiconductor device, and then dicing, the stickiness of the cut part can be further suppressed, and an optical semiconductor device with a good appearance can be produced.

The radiation curable resin layer is preferably thicker than the radiation non-curable adhesive layer. With such a configuration, compared with the high adhesion between the radiation non-curable adhesive layers in adjacent optical semiconductor devices in the collage state, the radiation curable resin layers in adjacent optical semiconductor devices are hardened. Low adhesion is dominant, so the adhesion between the sealing parts is lower, and when the adjacent optical semiconductor devices are pulled apart, it is less likely to cause sheet defects or adhesion of adjacent optical semiconductor devices. In addition, when an optical semiconductor device is manufactured by sealing the optical semiconductor device with a sheet for sealing the optical semiconductor device, and then dicing, the stickiness of the cut part can be further suppressed, and an optical semiconductor device with a good appearance can be produced.

The said sealing part may contain the layer containing a coloring agent. By having such a structure, when the above-mentioned optical semiconductor device is combined and applied to a display, it is possible to suppress color mixing of light emitted from each optical semiconductor element when the optical semiconductor device is used, and to adjust the appearance of the display when the optical semiconductor device is not used. .

It is preferable that the said sheet|seat for optical-semiconductor element sealing has the layer which has antiglare property and/or antireflection property. By having such a structure, when the above-mentioned optical semiconductor device is laminated and applied to a display, glossiness or reflection of light of the display can be suppressed, and the appearance of the display can be improved.

It is preferable that the said sheet|seat for optical-semiconductor element sealing has the layer which has a polyester resin and/or a polyimide resin as a main component. By having such a structure, the heat resistance of the said sheet|seat for optical-semiconductor element sealing is excellent, the thermal expansion of the sheet|seat for optical-semiconductor element sealing can be suppressed in a high-temperature environment, and dimensional stability improves. Moreover, since rigidity as a sheet can be imparted, handleability and holding|maintenance are improved.

In the cured cross-section of the radiation-curable resin layer, the hardness measured by nanoindentation method at a temperature of 23° C. is preferably 1.4 MPa or more. With such a configuration, the radiation-curable resin layer has an appropriate hardness after curing, and when the adjacent optical semiconductor devices are pulled apart in a pasted state, it is less likely to cause chipping or adjacent light. Sheet attachment of semiconductor devices.

Furthermore, the present invention provides an optical semiconductor device comprising a substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element, wherein the radiation curable resin layer is cured and formed. into a hardened object. In such an optical semiconductor device, after curing of the above-mentioned radiation curable resin, when adjacent optical semiconductor devices are separated from each other, chipping of the sheet or adhesion of adjacent optical semiconductor devices is less likely to occur. Also, when dicing, the stickiness of the cut part can be suppressed, and an optical semiconductor device with a good appearance can be produced.

The aforementioned optical semiconductor device may also be a backlight device for a liquid crystal display. Moreover, the above-mentioned optical semiconductor device may be a self-luminous display device. The above-mentioned optical semiconductor device can be preferably used as a backlight device of a liquid crystal screen or a self-luminous display device because it has a good appearance when applied to an optical semiconductor device having a display.

Furthermore, the present invention provides an image display device including the above-mentioned backlight device and a display panel.

Furthermore, the present invention provides an image display device including the above-mentioned self-luminous display device.

Also, the present invention provides a method of manufacturing an optical semiconductor device, which includes a step of dicing a laminate to obtain an optical semiconductor device, the laminate having a substrate, an optical semiconductor element arranged on the substrate, and the optical semiconductor device. A cured product obtained by curing the radiation-curable resin layer of the above-mentioned optical-semiconductor element-encapsulating sheet for element sealing.

When the radiation curable resin layer is irradiated with radiation to be cured, hardening is suppressed on the side where oxygen exists, and hardening tends to become insufficient. On the other hand, according to the above-mentioned production method having the above-mentioned cutting step, for the laminate having the cured product of the optical-semiconductor element sealing sheet including the hardened sealing layer obtained by curing the above-mentioned radiation-curable resin layer by irradiation with radiation, by By cutting off the insufficiently hardened side end portion in the above-mentioned dicing step, an optical semiconductor device can be obtained in which the region where the adhesiveness has been reduced due to sufficient hardening is exposed to the side surface. Since the adhesiveness of the cured side of the radiation-curable resin layer of the photo-semiconductor device manufactured in this way is sufficiently reduced, when the adjacent photo-semiconductor devices are pulled apart from each other in the collage state, it is difficult to cause sheet defects or damage. Adjacent sheets of optical semiconductor devices are attached.

The above-mentioned production method may further include a radiation irradiation step of irradiating radiation to the laminated body including the above-mentioned substrate, an optical semiconductor element arranged on the above-mentioned substrate, and The said optical-semiconductor element sealing sheet which seals the said optical-semiconductor element.

The above-mentioned production method may also include a sealing step: bonding the above-mentioned optical-semiconductor element sealing sheet to the above-mentioned optical-semiconductor element provided on the above-mentioned substrate, and sealing the above-mentioned optical-semiconductor element by the above-mentioned sealing part; thereafter, performing The aforementioned radiation exposure step.

The above-mentioned manufacturing method may further include a tiling step of arranging the plurality of optical semiconductor devices obtained in the above-mentioned dicing step so as to be in contact with each other in the planar direction. [Effect of Invention]

According to the sheet for sealing an optical semiconductor device of the present invention, the sealing property of the optical semiconductor device is excellent, and when adjacent optical semiconductor devices are pulled apart, sheet chipping or adhesion of adjacent optical semiconductor device sheets is less likely to occur. Therefore, after the collage of optical semiconductor devices, when adjacent optical semiconductor devices are shifted from each other or rearranged, position correction can be easily performed without any trouble, and the burden of optical semiconductor devices can be reduced. On the other hand, a display with good appearance can be manufactured economically.

[Sheets for sealing optical semiconductor elements] The sheet|seat for optical-semiconductor element sealing of this invention is equipped with the sealing part provided in one surface of the said base part, and sealing an optical-semiconductor element at least. In addition, in this specification, the sheet|seat for optical-semiconductor element sealing means the sheet|seat for sealing one or more optical-semiconductor elements arrange|positioned on the board|substrate. Moreover, in this specification, "encapsulating an optical semiconductor element" means embedding at least a part of an optical semiconductor element in a sealing part.

The sheet for optical-semiconductor element sealing of this invention may be equipped with the release liner other than the said base material part and the said sealing part. In this case, the release liner is bonded to the surface of the sealing portion opposite to the base portion. The release liner is used as a protective material for the above-mentioned sealing portion, and is peeled when sealing the optical semiconductor element. Furthermore, it is not necessary to provide a release liner.

Moreover, the sheet|seat for optical-semiconductor element sealing of this invention may be equipped with the surface protection film on the said base material part surface (surface on the side opposite to the said sealing part). For example, when using the following optical film as the said base part, a protective film can be protected before using an optical film. Furthermore, it is not necessary to provide a surface protection film.

Hereinafter, one Embodiment of the sheet|seat for optical-semiconductor element sealing of this invention is demonstrated. Fig. 1 is a cross-sectional view showing an embodiment of the sheet for sealing an optical semiconductor element of the present invention. As shown in FIG. 1 , the sheet 1 for optical-semiconductor element sealing can be used for sealing one or more optical-semiconductor elements arrange|positioned on the board|substrate, and is provided with the base material part 2, the sealing part 3, and the release liner 4. The sealing part 3 is provided on one surface of the base part 2 . The release liner 4 is attached to the surface of the sealing portion 3 (the surface on the opposite side to the side having the base material portion 2 ). In other words, the sheet|seat 1 for optical-semiconductor element sealing is provided with the base material part 2, the sealing part 3, and the release liner 4 in this order.

It is preferable that the said sheet|seat for optical-semiconductor element sealing has the layer which has antiglare property and/or antireflection property. By having such a structure, when the above-mentioned optical semiconductor device is laminated and applied to a display, glossiness or reflection of light of the display can be suppressed, and the appearance of the display can be improved. As the above-mentioned layer having anti-glare property, an anti-glare treatment layer may, for example, be mentioned. As the above-mentioned layer having antireflection properties, an antireflection treated layer may, for example, be mentioned. Antiglare treatment and antireflection treatment can be implemented by known or customary methods respectively. The above-mentioned anti-glare layer and the above-mentioned anti-reflection layer may be the same layer or different layers. The above-mentioned layer having antiglare property and/or antireflection property may have only one layer, or may have two or more layers.

The layer having antiglare and/or antireflection properties may be a layer included in the base material part, a layer included in the sealing part, or any other layer that is not included in the base material part and the sealing part. One layer is preferably a layer included in the aforementioned base material portion and/or the aforementioned sealing portion, more preferably a layer included in the aforementioned base material portion.

It is preferable that the said sheet|seat for optical-semiconductor element sealing has the layer which has polyester-type resin and/or polyimide-type resin as a main component (the component with the highest mass ratio among constituent resins). By having such a structure, the said sheet|seat for optical-semiconductor element sealing is excellent in heat resistance, the thermal expansion of the sheet|seat for optical-semiconductor element sealing can be suppressed in a high-temperature environment, and dimensional stability improves. Moreover, since rigidity as a sheet can be imparted, handleability and holding|maintenance are improved. The layer mainly composed of the polyester-based resin and/or polyimide-based resin may have only one layer, or may have two or more layers.

The layer mainly composed of the polyester-based resin and/or polyimide-based resin may be a layer included in the base material part, a layer included in the sealing part, or the base material part and the sealing part. Any other layer not included in is preferably a layer included in the above-mentioned base material part and/or the above-mentioned sealing part, more preferably a layer included in the above-mentioned base material part.

(sealing part) The sealing portion includes a resin layer cured by radiation (radiation curable resin layer) and an adhesive layer not cured by radiation (radiation non-curable adhesive layer). And when sealing an optical semiconductor element, the said radiation non-hardening adhesive layer is located in the surface of the sealing part which becomes an optical semiconductor element side. Specifically, when sealing an optical semiconductor element, the radiation non-curable adhesive layer is located on the surface of the sheet for sealing an optical semiconductor element on the optical semiconductor element side (in the case of a release liner, after removing the release liner) the surface of the sheet). For example, in the sheet|seat 1 for optical-semiconductor element sealing shown in FIG. 1, the sealing part 3 contains the radiation curable resin layer 31 and the radiation non-curable adhesive agent layer 32. The radiation non-hardening adhesive layer 32 is located in the surface of the sheet|seat 1 for optical-semiconductor element sealing which remove|eliminated the release liner 4 by the side opposite to the base material part 2.

When the above-mentioned radiation non-curable adhesive layer is located on the above-mentioned surface, when the above-mentioned optical-semiconductor element sealing sheet seals an optical-semiconductor element, the above-mentioned radiation-non-curable adhesive layer has excellent adhesion to the optical-semiconductor element and the substrate, and the optical semiconductor The sealing performance of components is excellent. And after sealing, the said radiation curable resin layer is cured by radiation irradiation, and the adhesiveness of the side surface of the sheet|seat for sealing is reduced. Thereby, the adhesiveness of the sealing parts in the adjacent optical semiconductor devices in the collage state is low, and when the adjacent optical semiconductor devices are pulled apart, it is difficult to cause sheet defects or damage the adjacent optical semiconductor devices. material attached. Moreover, the said base material part becomes the support body of the said sealing part, and the handling property of the said sheet|seat for optical-semiconductor element sealing is excellent by providing the said base material part. In addition, when an optical semiconductor device is manufactured by sealing the optical semiconductor device with a sheet for sealing the optical semiconductor device, and then dicing, the stickiness of the cut part can be further suppressed, and an optical semiconductor device with a good appearance can be produced.

In the sealing part, the radiation non-curable adhesive layer and the radiation curable resin are laminated. The radiation non-curable adhesive layer and the radiation curable resin layer may be directly laminated without intervening other layers, or may be interposed via other laminated layers. The above radiation non-curable adhesive layer and the above radiation curable resin layer may be a single layer, or may be multiple layers of the same or different compositions or thicknesses. When the sealing portion has a plurality of at least one of the radiation non-curable adhesive layer and the radiation curable resin layer, the plurality of layers may be laminated continuously or through other laminated layers. Furthermore, in the case of having a plurality of the above-mentioned non-radiation-curable adhesive layers, one layer may be provided on the surface of the sheet for sealing an optical semiconductor element opposite to the base portion, and the other non-radiation-curable adhesive layer The location is not particularly limited.

The ratio of the thickness (total thickness) of the radiation curable resin layer to the thickness (total thickness) of the radiation non-curable adhesive layer [thickness of the radiation curable resin layer/thickness of the radiation non-curable adhesive layer] is higher than Preferably, it is 0.1 or more, More preferably, it is 0.8 or more, More preferably, it exceeds 1.0, Most preferably, it is 4 or more. When the said ratio is 0.1 or more, when adjacent optical-semiconductor devices are pulled apart, sheet|seat chipping and the sheet|seat adhesion of an adjacent optical-semiconductor device will not occur further. Moreover, the above-mentioned ratio is preferably 200 or less, more preferably 150 or less.

The radiation curable resin layer is preferably thicker than the radiation non-curable adhesive layer. With such a configuration, compared with the high adhesion between the radiation non-curable adhesive layers in adjacent optical semiconductor devices in the collage state, the radiation curable resin layers in adjacent optical semiconductor devices are hardened. Low adhesion is dominant, so the adhesion between the sealing parts is lower, and when the adjacent optical semiconductor devices are pulled apart, it is less likely to cause sheet defects or adhesion of adjacent optical semiconductor devices. In addition, when an optical semiconductor device is manufactured by sealing the optical semiconductor device with a sheet for sealing the optical semiconductor device, and then dicing, the stickiness of the cut part can be further suppressed, and an optical semiconductor device with a good appearance can be produced. Furthermore, when there are a plurality of the above-mentioned radiation-curable resin layers or the above-mentioned non-radiation-curable adhesive layers, the above-mentioned thickness is the total thickness (total thickness) of the multiple layers.

The thickness of the radiation non-curable adhesive layer located on the surface of the above-mentioned optical semiconductor element sealing sheet (that is, the surface of the above-mentioned sealing portion) is preferably at least 1 μm, more preferably at least 4 μm, and still more preferably at least 15 μm. above. When the said thickness is 1 micrometer or more, the adhesiveness of the sheet|seat for optical-semiconductor element sealing with respect to an optical-semiconductor element or a board|substrate will be more excellent. The aforementioned thickness is preferably at most 500 μm, more preferably at most 300 μm, and still more preferably at most 200 μm. If the above-mentioned thickness is 500 μm or less, when adjacent optical semiconductor devices are separated from each other, it is less likely to cause sheet damage or adhesion of adjacent optical semiconductor devices. In addition, when cutting an optical semiconductor device, the stickiness of the cut part can be further suppressed, and an optical semiconductor device with a good appearance can be produced.

The thickness (total thickness) of the radiation-curable resin layer is preferably from 20 to 800 μm, more preferably from 30 to 700 μm, and still more preferably from 50 to 600 μm. If the above-mentioned thickness is 20 μm or more, when the adjacent optical semiconductor devices are separated from each other, it is less likely to cause sheet chipping or adhesion of adjacent optical semiconductor devices. When the said thickness is 800 micrometers or less, the thickness of a sealing part can be made thin, and an optical semiconductor device can be made thinner.

It is preferable that the said sheet|seat for optical-semiconductor element sealing has a radiation curable resin layer, and the thickness of one layer is the thickest among all the layers which comprise the said sealing part. In addition, the layer which laminated|stacked the several layers of the same composition as it is is regarded as 1 layer. Also, when there are two or more thickest layers, any one layer belongs to the thickest layer.

The ratio of the thickness (total thickness) of the above-mentioned radiation curable resin layer is preferably 5 to 90%, more preferably 100% of the total thickness of the sheet for sealing optical semiconductor elements (excluding the release liner and the surface protection film). Preferably it is 10-85%, More preferably, it is 40-80%. If the above-mentioned ratio is 5% or more, when the adjacent optical semiconductor devices are separated from each other, it is less likely to cause sheet damage or adhesion of adjacent optical semiconductor devices. If the said thickness is 90% or less, the thickness of a sealing part can be made thinner, and an optical semiconductor device can be made thinner.

The radiation-curable resin layer has a hardness of at least 1.4 MPa, more preferably at least 11.0 MPa, and still more preferably at least 63.0 MPa, as measured by nanoindentation at a temperature of 23° C. in the cross section of the cured layer. Regarding the above-mentioned hardness measured by the nanoindentation method, when the indenter is pressed into the object surface, the load on the indenter and the indentation depth are continuously measured when the indenter is loaded and unloaded. According to the obtained load- The indentation depth curve is used to obtain the hardness measured by the nano-indentation method. If the above-mentioned hardness is 1.4 MPa or more, the above-mentioned radiation-curable resin layer has an appropriate hardness after curing, and when the adjacent optical semiconductor devices are pulled apart in a pasted state, it is less likely to cause sheet defects or adjacent light. Sheet attachment of semiconductor devices.

The radiation curable resin layer has radiation curability. Examples of the aforementioned radiation include electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, and X-rays.

Examples of the aforementioned radiation-curable resin layer include: a layer containing a base polymer and a radiation-polymerizable monomer component or oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond; Functional polymer as layer of base polymer: etc.

As the resin constituting the above-mentioned radiation curable resin layer, there may be mentioned: known or commonly used radiation curable resins, for example, acrylic resins, urethane acrylate resins, epoxy resins, Epoxy acrylate resin, oxetane resin, silicone resin, silicone acrylic resin, polyester resin, etc. The above-mentioned resins may be used alone or in combination of two or more.

The radiation-curable resin layer is preferably an adhesive resin layer, that is, a radiation-curable adhesive layer. By having such a structure, when sealing the optical semiconductor element, the optical semiconductor element can be easily buried, and before the radiation curing, the base portion and the radiation non-curable adhesive layer on the side surface of the optical semiconductor element are in close contact. Excellent performance, the sealing performance of optical semiconductor elements is even more excellent.

As the adhesive for forming the radiation non-curable adhesive layer, a known or conventional pressure-sensitive adhesive that does not have radiation curability, that is, does not contain a radiation curable compound, can be used. However, it may contain a small amount of unavoidable radiation-hardening compounds that migrate and invade from other layers of the laminated layer. Examples of the above-mentioned adhesives include: acrylic adhesives, rubber adhesives (natural rubber, synthetic rubber, and mixtures thereof), silicone adhesives, polyester adhesives, amine-based adhesives, etc. Formate-based adhesives, polyether-based adhesives, polyamide-based adhesives, fluorine-based adhesives, etc. The said adhesive agent may use only 1 type, and may use 2 or more types.

The sealing part may have layers other than the radiation curable resin layer and the radiation non-curable adhesive layer. Among them, the ratio of the total thickness of the radiation curable resin layer and the radiation non-curable adhesive layer to 100% of the thickness of the sealing portion is preferably 70% or more, more preferably 80% or more, and still more preferably 80% or more. More than 90%, preferably more than 96%.

The said sealing part may contain the layer containing a coloring agent. By having such a structure, when the above-mentioned optical semiconductor device is combined and applied to a display, it is possible to suppress color mixing of light emitted from each optical semiconductor element when the optical semiconductor device is used, and to adjust the appearance of the display when the optical semiconductor device is not used. . The layer containing the said coloring agent may have only one layer, and may have two or more layers.

The above-mentioned layer containing a coloring agent may be the above-mentioned radiation curable resin layer, the above-mentioned radiation non-curable adhesive layer, and other layers other than these, preferably the above-mentioned radiation-curable resin layer and/or the above-mentioned radiation non-curable adhesive layer. The adhesive layer is a layer containing a colorant, and it is more preferable that the radiation non-curable adhesive layer is a layer containing a colorant.

As said coloring agent, a black coloring agent is preferable. As the above-mentioned black coloring agent, known or customary coloring agents (pigments, dyes, etc.) for presenting black can be used, for example, carbon black (furnace black, channel black, acetylene black, thermal carbon black, lamp black , pine smoke, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnet Ore, chromium oxide, iron oxide, molybdenum disulfide, chromium complexes, anthraquinone colorants, zirconium nitride, etc. One type of black coloring agent may be used, or two or more types may be used. Moreover, it is also possible to use a coloring agent which functions as a black-type coloring agent combining and preparing the coloring agent which expresses the color other than black.

(Substrate Department) The said base material part becomes the support body of the said sealing part, and the handling property of the said sheet|seat for optical-semiconductor element sealing is excellent by providing the said base material part. The above-mentioned base material portion may be a single layer, or may be multiple layers of the same or different compositions or thicknesses. In the case where the above-mentioned base material portion is multi-layered, each layer can be bonded via another layer such as an adhesive layer. Furthermore, when the optical semiconductor element is sealed with a sheet for sealing the optical semiconductor element, the base material layer used in the base portion is attached to the portion of the substrate having the optical semiconductor element together with the sealing portion, and the sealing portion for the optical semiconductor element is The release liner that is peeled off when the sheet is used (attached), or the surface protection film that only protects the surface of the base part is not included in the "base part".

As a base material layer which comprises the said base material part, a glass or a plastic base material (especially a plastic film) etc. are mentioned, for example. As the resin constituting the above-mentioned plastic substrate, for example, low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, intercalated Segment copolymer polypropylene, homopolypropylene, polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylate (random, alternating) copolymer , ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cycloolefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer and other polyolefin resins; polyurethane; poly Polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); polycarbonate; polyimide resins; polyether ether ketone; Polyetherimide; polyamides such as aromatic polyamide and wholly aromatic polyamide; polyphenylene sulfide; fluororesin; polyvinyl chloride; polyvinylidene chloride; triacetyl cellulose (TAC), etc. Cellulose resins; silicone resins; acrylic resins such as polymethyl methacrylate (PMMA); polyphenols; polyarylates; polyvinyl acetate, etc. The above-mentioned resins may be used alone or in combination of two or more.

The aforementioned substrate layer can be various optical films such as an anti-reflection (AR) film, a polarizing plate, a retardation plate, and the like. When the said base material part has an optical film, the said sheet|seat for optical-semiconductor element sealing can be applied to an optical member as it is.

The above-mentioned plastic film preferably contains polyester resin and/or polyimide resin as main components (components with the highest mass ratio among the resins). By having such a structure, the said sheet|seat for optical-semiconductor element sealing is excellent in heat resistance, the thermal expansion of the sheet|seat for optical-semiconductor element sealing can be suppressed in a high-temperature environment, and dimensional stability improves. Moreover, since rigidity as a sheet can be imparted, handleability and holding|maintenance are improved.

The thickness of the plastic film is preferably 20-200 μm, more preferably 40-150 μm. When the said thickness is 20 micrometers or more, the supportability and handleability of the sheet|seat for optical-semiconductor element sealing will improve more. When the said thickness is 200 micrometers or less, the thickness of the sheet|seat for optical-semiconductor element sealing can be made thinner, and an optical-semiconductor device can be made thinner.

The above-mentioned base material part preferably includes a plastic film mainly composed of a polyester-based resin and/or a polyimide-based resin, and an optical film. Generally speaking, the supportability or operability of optical films such as polarizing plates tends to deteriorate. By using them in combination with the above-mentioned plastic films, two advantages can be flexibly utilized. In this case, especially in the base material part, the plastic film is preferably on the side of the sealing part.

It is preferable that the said base material part has the layer which has antiglare property and/or antireflection property. Regarding the above-mentioned layer having anti-glare property and/or anti-reflection property, for example, the above-mentioned anti-glare treatment layer or anti-reflection treatment layer is obtained by subjecting at least one surface of the above-mentioned substrate layer to anti-glare treatment and/or anti-reflection treatment . The above-mentioned anti-glare treatment layer and the above-mentioned anti-reflection treatment layer may be the same layer or different layers. Antiglare treatment and antireflection treatment can be implemented by known or customary methods respectively.

Regarding the surface of the above-mentioned base material portion provided with the above-mentioned sealing portion, in order to improve the adhesion and retention with the sealing portion, for example, the following surface treatment may be performed: corona discharge treatment, plasma treatment, frosting treatment, ozone exposure Physical treatments such as flame exposure treatment, high-voltage electric shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; easy-adhesive treatment using coating agents (primers); etc. The surface treatment for improving the adhesiveness is preferably performed on the entire surface of the sealing part side in the base part.

In the sheet 1 for sealing optical semiconductor elements shown in FIG. 1 , the base portion 2 is a multilayer having an optical film 21 and a plastic film 23 , and the optical film 21 and the plastic film 23 are bonded via an adhesive layer 22 . Moreover, antiglare treatment and antireflection treatment are performed on the surface of the optical film 21 that faces the plastic film 23 .

The thickness of the base material part is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent function as a support and excellent surface scratch resistance. The thickness of the base material portion is preferably 300 μm or less, more preferably 200 μm or less, from the viewpoint of more excellent transparency.

(peel liner) The release liner is used to cover and protect an element on the surface of the sealing portion, and when the sheet for sealing an optical semiconductor element is bonded to a substrate on which an optical semiconductor element is arranged, the release liner can be peeled off from the sheet.

Examples of the above-mentioned release liner include: polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, release by a fluorine-based release agent or a long-chain alkyl acrylate-based release agent, etc. Plastic films or papers that are surface-coated with agents.

The thickness of the release liner is, for example, 10-200 μm, preferably 15-150 μm, more preferably 20-100 μm. When the thickness is 10 μm or more, the release liner is less likely to be broken by notches during processing. When the said thickness is 200 micrometers or less, it becomes easier to peel off a release liner from the said sealing part at the time of use.

(Sheet for sealing optical semiconductor elements) Ratio of the total thickness of the above-mentioned base part and the above-mentioned sealing part in the above-mentioned sheet for optical-semiconductor element sealing with respect to 100% of the thickness of the above-mentioned sheet for sealing an optical-semiconductor element (excluding the release liner and the surface protection film) Preferably it is 80% or more, more preferably 90% or more. Moreover, it is preferable that the ratio of the thickness from the surface of a base part including a base part and a sealing part to the surface of a sealing part falls within the said range.

The total thickness of the said base material part and the said sealing part in the said sheet|seat for optical-semiconductor element sealing becomes like this. Preferably it is 100-900 micrometers, More preferably, it is 200-800 micrometers. Moreover, it is preferable that the thickness from the base material part surface to the sealing part surface including a base material part and a sealing part falls within the said range.

One embodiment of the manufacturing method of the sheet|seat for optical-semiconductor element sealing of this invention is demonstrated. For example, the sheet|seat 1 for optical-semiconductor element sealing shown in FIG. 1 can be produced by the following method. First, the radiation curable resin layer 31 is formed on the plastic film 23 constituting the base portion 2 . The above-mentioned radiation curable resin layer 31 can be produced by applying the resin composition for forming the radiation curable resin layer 31 on one surface of the plastic film 23 to form a resin composition layer, followed by heating. The resin composition layer is cured by curing other than radiation irradiation such as solvent removal or thermal curing. When making the thickness of the radiation-curable resin layer 31 thicker, the radiation-curable resin layer formed in the same manner on the release-treated surface of the release liner can also be superimposed on the plastic film 23 formed above. Laminate on the radiation curable resin layer.

The resin composition forming the radiation curable resin layer may be in any form as long as it does not impair the radiation curability of the radiation curable resin layer. For example, the adhesive composition may be an emulsion type, a solvent type (solution type), a heat-melt type (hot-melt type), or the like. Among them, a solvent type is preferable at the point that it is easy to obtain an adhesive layer excellent in productivity.

On the other hand, a radiation non-curable adhesive layer 32 is formed on the release-treated surface of the release liner 4 prepared separately. The radiation non-curable adhesive layer 32 can be produced by applying the adhesive composition forming the radiation non-curable adhesive layer 32 on the release-treated surface of the release liner 4 to form the adhesive composition layer, followed by desolvation or hardening by heating to cure the adhesive composition layer. Then, the above-mentioned radiation non-curable adhesive layer is laminated on the above-mentioned radiation-curable resin layer. In this way, a laminate having a composition of [plastic film 23/radiation curable resin layer 31/radiation non-curable adhesive layer 32/release liner 4] can be obtained.

The adhesive composition forming the above radiation non-curable adhesive layer may be in any form. For example, the adhesive composition may be an emulsion type, a solvent type (solution type), an active energy ray hardening type, a heat-melt type (hot-melt type), or the like. Among them, solvent-based and active energy ray-curable adhesive compositions are preferable in terms of easily obtaining an adhesive layer having excellent productivity.

On the other hand, the laminated body of the optical film 21 and the adhesive layer 22 was produced. Specifically, for example, it can be produced by forming the adhesive layer 22 in the same manner as the radiation non-curable adhesive layer 32 on the release-treated surface of a separately prepared release liner, and then attaching the optical film 21 is pasted on the adhesive layer 22 . Then, the release liner was peeled off to expose the adhesive layer 22, and it was bonded to the surface of the plastic film 23 of the above-mentioned laminate on which the radiation-curable resin layer 31 was not formed. As the coating method of the above-mentioned resin composition or adhesive composition, for example, known or usual coating methods can be used, and examples thereof include roll coating, screen coating, gravure coating, and the like. Moreover, lamination|stacking of various layers can be performed using a well-known roll or laminating machine. In this way, the sheet|seat 1 for optical-semiconductor element sealing shown in FIG. 1 can be produced.

Furthermore, the optical-semiconductor element sealing sheet of the present invention is not limited to the above-mentioned method, and when the substrate part includes a multilayer, it can be produced by the following method, that is, firstly, the substrate part is produced, and radiation curing is appropriately combined A resin layer and a non-radiation-curable adhesive layer are sequentially laminated on the substrate so that the non-radiation-curable adhesive layer is located on the surface.

Using the sheet for encapsulating optical semiconductor devices of the present invention, the radiation non-curable adhesive layer is bonded to the substrate on which the optical semiconductor elements are arranged, and the optical semiconductor elements are sealed by the sealing portion, whereby an optical semiconductor device can be obtained. Specifically, first, the release liner is peeled from the sheet for optical-semiconductor element sealing of this invention, and a radiation non-hardening adhesive layer is exposed. Then, the radiation non-hardening adhesive layer is attached to the substrate surface of the optical member on which the optical semiconductor element is arranged. The optical member has a substrate and an optical semiconductor element (preferably a plurality of optical semiconductor elements) arranged on the substrate. ), the above-mentioned non-radiation-curable adhesive layer is the exposed surface of the optical-semiconductor element sealing sheet of the present invention, and when the above-mentioned optical member has a plurality of optical-semiconductor elements, the radiation-non-curable adhesive layer is further arranged to The layer fills the gaps between a plurality of optical semiconductor elements, and seals a plurality of optical semiconductor elements at one time. In this way, an optical semiconductor element can be sealed using the sheet|seat for optical semiconductor device sealing of this invention. Moreover, the optical-semiconductor element can also be sealed by using the sheet|seat for optical-semiconductor device sealing of this invention, and bonding under reduced pressure environment or pressurization. Such a method may, for example, be the method disclosed in JP-A-2016-29689 or JP-A-6-97268.

[Optical semiconductor device] An optical semiconductor device can be produced using the sheet|seat for optical-semiconductor element sealing of this invention. An optical semiconductor device manufactured using the optical semiconductor element sealing sheet of the present invention includes a substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet of the present invention that seals the optical semiconductor element is cured become hardened. The above-mentioned cured product is a cured product obtained by curing the sheet for sealing optical semiconductor elements of the present invention by irradiation with radiation. Specifically, the radiation curable resin layer in the sheet for sealing optical semiconductor elements of the present invention has Hardened sealing layer hardened by radiation exposure.

As said optical semiconductor element, light emitting diodes (LED), such as a blue light emitting diode, a green light emitting diode, a red light emitting diode, and an ultraviolet light emitting diode, are mentioned, for example.

In the above-mentioned optical semiconductor device, the optical semiconductor element sealing sheet of the present invention is excellent in conformability to unevenness when the optical semiconductor element is formed as a convex portion and the gap between a plurality of optical semiconductor elements is formed as a concave portion. Since the embedding property of the optical semiconductor element is excellent, it is preferable to seal a plurality of optical semiconductor elements at once.

FIG. 2 shows one embodiment of an optical semiconductor device using the sheet 1 for sealing an optical semiconductor element shown in FIG. 1 . An optical semiconductor device 10 shown in FIG. 2 includes a substrate 5 , a plurality of optical semiconductor elements 6 arranged on one surface of the substrate 5 , and a cured product 1 ′ of an optical semiconductor element sealing sheet that seals the optical semiconductor element 6 . The cured product 1' of the sheet for sealing optical semiconductor elements is formed by peeling the release liner 4 from the sheet 1 for sealing optical semiconductor elements, and forming a cured sealing layer formed by curing the radiation curable resin layer 31 by irradiation with radiation. 31'. The plurality of optical semiconductor elements 6 are sealed at once by the sealing portion. The radiation non-curable adhesive layer 32 in the sealing portion follows the concave-convex shape formed by the plurality of optical semiconductor elements 6 and is in close contact with the optical semiconductor elements 6 and the substrate 5 to embed the optical semiconductor elements 6 .

Furthermore, in the optical semiconductor device 10 shown in FIG. 2 , the optical semiconductor element 6 is completely embedded and sealed in the radiation non-curable adhesive layer 32 , and indirectly sealed by the hardened sealing layer 31 ′. The above-mentioned optical semiconductor device is not limited to this aspect, and may be an aspect in which a part of the optical semiconductor element 6 protrudes from the radiation non-curable adhesive layer 32, and this part is embedded in the cured sealing layer 31', The optical semiconductor element 6 is completely embedded and sealed by the radiation non-curable adhesive layer 32 and the cured sealing layer 31 ′.

As described above, the above optical semiconductor device seals the optical semiconductor element with the radiation non-curable adhesive layer and the cured sealing layer which is the cured product of the radiation curable resin layer. Therefore, the optical semiconductor element is in close contact with the radiation non-hardening adhesive layer. Since the optical semiconductor element has excellent sealing performance, and the adhesiveness of the side surface of the hardened sealing layer is low, when the adjacent optical semiconductor element is pasted together, When the devices are pulled apart from each other, they can be easily pulled apart, and it is difficult to cause sheet defects or adhesion of adjacent optical semiconductor device sheets.

The above-mentioned optical semiconductor device may be a collage of individual optical semiconductor devices. That is, the above-mentioned optical semiconductor device may be one in which a plurality of optical semiconductor devices are arranged in a brick shape in the planar direction.

FIG. 3 shows an embodiment of an optical semiconductor device manufactured by arranging a plurality of optical semiconductor devices. The photo-semiconductor device 20 shown in FIG. 3 is a plurality of photo-semiconductor devices 10 arranged (collaged) in a brick shape in the planar direction, with 4 in the vertical direction and 4 in the horizontal direction, a total of 16. At the junction 20a between two adjacent optical semiconductor devices 10, although the optical semiconductor devices 10 are adjacent to each other, they can be easily pulled apart, and it is not easy to cause defects on the side of the sealing part, or the missing resin on the side of the sealing part is not easy to come out. One of the adjacent photo-semiconductor devices is attached to the other.

The above-mentioned optical semiconductor device is preferably a backlight device for a liquid crystal display, more preferably a backlight device of the whole-surface-direct type. In addition, an image display device can be obtained by combining the above-mentioned backlight device with a display panel. When the above-mentioned optical semiconductor device is a backlight device of a liquid crystal display, the optical semiconductor element is an LED element. For example, in the above-mentioned backlight device, a metal wiring layer for sending a light emission control signal to each LED element is laminated on the above-mentioned substrate. LED elements that emit red (R), green (G), and blue (B) lights are alternately arranged on the substrate of the display panel through metal wiring layers. The metal wiring layer can be formed of metal such as copper, which reflects the light emitted by each LED element and reduces the visibility of the image. In addition, the light emitted from each LED element of each color of RGB is mixed, and the contrast ratio is lowered.

In addition, the above-mentioned optical semiconductor device is preferably a self-luminous display device. Furthermore, an image display device can be obtained by combining the above-mentioned self-luminous display device with an optional display panel. When the above-mentioned optical semiconductor device is a self-luminous display device, the optical semiconductor element is an LED element. As said self-luminous display device, an organic electroluminescence (organic EL) display device etc. are mentioned, for example. For example, in the above-mentioned self-luminous display device, a metal wiring layer for sending a light-emission control signal to each LED element is laminated on the above-mentioned substrate. LED elements that emit light of each color of red (R), green (G), and blue (B) are alternately arranged on the substrate through metal wiring layers. The metal wiring layer can be formed of metals such as copper, and adjusts the luminescence level of each LED element to display various colors.

The sheet for encapsulating optical semiconductor elements of the present invention can be used for optical semiconductor devices that are bent and used, for example, those with a bendable image display device (flexible display) (especially a foldable image display device (foldable display)) Optical semiconductor device. Specifically, it can be used in a foldable backlight device, a foldable self-luminous display device, and the like.

Since the photo-semiconductor element sealing sheet of the present invention has excellent embedding properties of the photo-semiconductor element, it can be preferably used in any of the following cases: the case where the above-mentioned photo-semiconductor device is a small LED display device and the above-mentioned photo-semiconductor device is a miniature The situation of LED display device.

[Manufacturing method of optical semiconductor device] The above-mentioned optical semiconductor device can be manufactured, for example, by a manufacturing method comprising at least a dicing step of obtaining an optical semiconductor device by dicing a laminate comprising a substrate, an optical-semiconductor element arranged on the substrate, and A cured product obtained by curing the above-mentioned radiation-curable resin layer of the sheet for sealing an optical-semiconductor element of the present invention that seals the above-mentioned optical-semiconductor element. The above-mentioned cured product is a cured product obtained by curing the sheet for sealing optical semiconductor elements of the present invention by irradiation with radiation. Specifically, the radiation curable resin layer in the sheet for sealing optical semiconductor elements of the present invention has Hardened sealing layer hardened by radiation exposure.

When the radiation-curable resin layer is irradiated with radiation to be cured, hardening is suppressed on the side where oxygen exists, and hardening tends to become insufficient. On the other hand, according to the above-mentioned production method having the above-mentioned cutting step, for the laminate having the cured product of the optical-semiconductor element sealing sheet including the hardened sealing layer obtained by curing the above-mentioned radiation-curable resin layer by irradiation with radiation, by By cutting off the insufficiently hardened side end portion in the above-mentioned dicing step, an optical semiconductor device can be obtained in which the region where the adhesiveness has been reduced due to sufficient hardening is exposed to the side surface. Since the adhesiveness of the cured side of the radiation-curable resin layer of the photo-semiconductor device manufactured in this way is sufficiently reduced, when the adjacent photo-semiconductor devices are pulled apart from each other in the collage state, it is difficult to cause sheet defects or damage. Adjacent sheets of optical semiconductor devices are attached.

The above-mentioned production method may further include a radiation irradiation step of irradiating radiation to the laminated body including the above-mentioned substrate, an optical semiconductor element arranged on the above-mentioned substrate, and The said optical-semiconductor element sealing sheet which seals the said optical-semiconductor element.

The aforementioned production method may include, before the aforementioned radiation irradiation step, a sealing step of bonding the aforementioned optical-semiconductor element sealing sheet to the aforementioned optical-semiconductor element provided on the aforementioned substrate, and sealing the aforementioned optical-semiconductor element through the aforementioned sealing portion. seal.

In addition, the above-mentioned manufacturing method may further include a tiling step of arranging the plurality of optical semiconductor devices obtained in the above-mentioned dicing step so as to be in contact with each other in the planar direction. Hereinafter, the method of manufacturing the optical semiconductor device 10 shown in FIG. 2 and the optical semiconductor device 20 shown in FIG. 3 will be described as appropriate.

(sealing step) In the said sealing process, the sheet|seat for optical-semiconductor element sealing of this invention is bonded to the board|substrate in which the optical-semiconductor element was arrange|positioned, and the optical-semiconductor element is sealed by the sealing part. In the above-mentioned sealing step, specifically, as shown in FIG. 4 , the radiation non-curable adhesive layer 32 of the sheet 1 for sealing an optical semiconductor element from which the release liner 4 has been peeled off is placed on the substrate 5 on which the optical semiconductor element is arranged. The faces of the elements 6 are arranged facing each other, and the optical semiconductor element sealing sheet 1 is bonded to the surface of the substrate 5 on which the optical semiconductor elements 6 are arranged, and the optical semiconductor elements 6 are embedded in the sealing part as shown in FIG. 5 3 in. As shown in FIG. 4 , the substrate 5 for lamination extends wider in the plane direction than the substrate 5 in the optical semiconductor device 10 shown in FIG. 2 , and no optical semiconductor elements are arranged near the end of the substrate 5. 6. Moreover, the sheet|seat 1 for optical-semiconductor element sealing to be bonded is extended in the planar direction rather than the board|substrate 5 used for bonding. That is, the area of the surface of the sheet 1 for sealing optical-semiconductor elements bonded in the sealing step that faces the substrate 5 is larger than the area of the surface of the substrate 5 bonded in the sealing step that faces the sheet 1 for sealing optical-semiconductor elements. area. The reason for this is that, in the laminated body of the optical semiconductor element sealing sheet 1 and the substrate 5, the optical semiconductor element sealing sheet 1 and the substrate 5 are sufficiently cured in the subsequent radiation irradiation step in the region where the optical semiconductor device is used. , and the vicinity of the ends that may be insufficiently hardened will be cut and removed in a subsequent cutting step.

The temperature at the time of the above lamination is, for example, within a range from room temperature to 110°C. In addition, at the time of the above-mentioned bonding, decompression or pressurization may be performed. By reducing or increasing the pressure, it is possible to suppress the formation of voids between the sealing portion and the substrate or the optical semiconductor element. Moreover, in the said sealing process, it is preferable to bond the sheet|seat for optical-semiconductor element sealing together under reduced pressure, and to pressurize after that. The pressure at the time of decompression is, for example, 1 to 100 Pa, and the decompression time is, for example, 5 to 600 seconds. In addition, the pressure at the time of pressurization is, for example, 0.05 to 0.5 MPa, and the decompression time is, for example, 5 to 600 seconds.

(Radiation Exposure Procedure) In the above-mentioned radiation irradiation step, radiation is irradiated to the laminate obtained by bonding the above-mentioned optical-semiconductor element sealing sheet on the above-mentioned substrate on which the above-mentioned optical-semiconductor element is arranged (for example, the laminate obtained in the above-mentioned sealing step), The aforementioned radiation curable resin layer is cured. In the above-mentioned radiation irradiation step, specifically, as shown in FIG. 6 , the radiation-curable resin layer 31 is cured to form a cured sealing layer 31 ′ to obtain a cured product 1 ′ of the sheet 1 for sealing an optical semiconductor element. As the radiation, electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, X-rays and the like are mentioned above. Among them, ultraviolet rays are preferred. The temperature during radiation irradiation is, for example, in the range from room temperature to 100° C., and the irradiation time is, for example, 1 minute to 1 hour.

(cutting step) In the dicing step, a laminate (for example, the laminate passed through the radiation irradiation step) is cut, and the laminate includes a substrate, an optical semiconductor element arranged on the substrate, and a substrate for sealing the optical semiconductor element. The cured product of the invention's sealing sheet for optical semiconductor devices. Here, in the laminated body which passed through the dicing process, the hardened|cured material 1' of the sheet|seat for optical-semiconductor element sealing, and the board|substrate 5 are extended in the plane direction more widely than the optical-semiconductor device 10 finally obtained as mentioned above. Then, in the above-mentioned cutting step, the cured product of the sheet for optical-semiconductor element sealing and the side end portion of the substrate are cut and removed. Specifically, cutting is performed at the position of the chain line shown in FIG. 7 to remove the side end. The above-mentioned cutting can be performed by a known or customary method, for example, a method using a dicing blade or laser irradiation. In this way, for example, the optical semiconductor device 10 shown in FIG. 2 can be manufactured.

Here, in the above-mentioned manufacturing method, it is important to perform dicing in a state where the radiation-curable resin layer presented by passing through the above-mentioned radiation irradiation step and the like is cured, for example. When dicing is performed in an uncured state of the radiation-curable resin layer, when it is attempted to remove the side end of the optical-semiconductor element sealing sheet after dicing, the following disadvantages may occur : The side end to be removed and the radiation-curable resin layer in the remaining optical semiconductor device have high adhesion to each other, and the two are closely connected and attracted to each other, resulting in the generation of radiation-curable resin layer in the remaining optical semiconductor device. In the defect, a part of the radiation curable resin layer at the side end to be removed is transferred and attached to the remaining optical semiconductor device. On the other hand, by having the cutting step in which the radiation-curable resin layer is cured, the radiation-curable resin layer is cured to form a hardened sealing layer, so that the side surface of the cut portion has low adhesion and can suppress Occurrence of the above adverse conditions.

Also, when the radiation-curable resin layer is irradiated with radiation to be cured, hardening is suppressed on the side where oxygen exists, and hardening tends to be insufficient. In view of this, according to the above-mentioned manufacturing method having the above-mentioned cutting step, by cutting off the end portion that is insufficiently hardened in the above-mentioned cutting step in the state where the above-mentioned radiation curable resin layer is hardened, it is possible to obtain a side surface that is sufficiently hardened so that the adhesiveness can be obtained. Lower light semiconductor device. Since the adhesiveness of the side surface of the photo-semiconductor device manufactured in this way is sufficiently reduced after the radiation-curable resin layer is cured, when the adjacent photo-semiconductor devices are pulled apart from each other in a collage state, it is not easy to cause sheet damage. Defective or adjacent photo-semiconductor device sheet adhesion. On the other hand, in the absence of the above-mentioned dicing step, since the insufficiently hardened side surface is in contact with the adjacent optical semiconductor device during lamination, when trying to pull the adjacent optical semiconductor devices apart, the following is likely to occur: Disadvantages: The side surfaces are closely attached to each other and attract each other, resulting in a defect in the radiation curable resin layer in one optical semiconductor device, or part of the radiation curable resin layer in the other optical semiconductor device is transferred and attached to one optical semiconductor device.

(collage step) In the above-mentioned bonding step, the plurality of optical semiconductor devices obtained in the above-mentioned cutting step are arranged so as to be in contact with each other in the planar direction, and bonded together. In this way, for example, the optical semiconductor device 20 shown in FIG. 3 can be manufactured. The photo-semiconductor elements of the photo-semiconductor devices obtained after bonding are excellent in sealing properties, and when the adjacent photo-semiconductor devices are pulled apart, it is difficult to cause sheet defects or adhesion of the sheets of adjacent photo-semiconductor devices. [Example]

Hereinafter, the present invention will be described in more detail with examples given, but the present invention is not limited by these examples.

Example 1 ＜TAC film/adhesive adhesive layer＞ 69.7 parts by mass of 2-ethylhexyl acrylate (2EHA), 10 parts by mass of 2-methoxyethyl acrylate (MEA), 13 parts by mass of 2-hydroxyethyl acrylate (HEA), N- 6 parts by mass of vinyl-2-pyrrolidone (NVP), 1.3 parts by mass of N-hydroxyethylacrylamide (HEAA), 0.1 part by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator , and 200 parts by mass of ethyl acetate as a polymerization solvent were charged into a separable flask, and stirred for 1 hour while introducing nitrogen gas. In this way, after removing oxygen in the polymerization system, the temperature was raised to 63° C., and the reaction was carried out for 10 hours, and ethyl acetate was added to obtain an acrylic polymer solution with a solid content concentration of 30% by mass. With respect to 100 parts by mass of the above-mentioned acrylic polymer, 0.2 parts by mass of an isocyanate-based crosslinking agent (trade name "Takenate D110N", manufactured by Mitsui Chemicals Co., Ltd.) as a crosslinking agent, and γ-glycidol as a silane coupling agent were added Oxypropyltrimethoxysilane (trade name "KBM-403", manufactured by Shin-Etsu Chemical Co., Ltd.) 0.15 parts by mass, a polyol obtained by adding propylene oxide and ethylenediamine as a crosslinking accelerator (trade name "EDP-300", manufactured by ADEKA Co., Ltd.) 0.2 parts by mass to prepare an adhesive composition (solution). Next, the above-mentioned adhesive composition (solution) was applied to the release-treated surface of a release liner (separator) (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying became 25 μm. , under normal pressure, heat and dry at 60°C for 1 minute, and heat and dry at 155°C for 1 minute to obtain a double-sided adhesive sheet as an adhesive layer. Also, for the non-treated surface of a triacetyl cellulose (TAC) film (trade name "DSR3-LR", manufactured by Dainippon Printing Co., Ltd., total thickness 45 μm, anti-glare/anti-reflective treatment), a manual roller was used, Attach the adhesive surface of the adhesive adhesive layer in such a way that no air bubbles remain. In this way, a laminate having a configuration of [TAC film/adhesive adhesive layer/release liner] was produced.

＜PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer＞ (ultraviolet curable adhesive layer) Put butyl acrylate ( 189.77 parts by mass of BA), 38.04 parts by mass of cyclohexyl acrylate (CHA), 85.93 parts by mass of 2-hydroxyethyl acrylate (HEA), 0.94 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator , and 379.31 parts by mass of methyl ethyl ketone as a polymerization solvent, while stirring, nitrogen replacement was performed at room temperature for 6 hours. Thereafter, the mixture was kept at 65° C. for 4 hours for polymerization and kept at 75° C. for 2 hours while stirring while blowing nitrogen gas, to obtain a resin solution. Next, the obtained resin solution was cooled to room temperature. Thereafter, 57.43 parts by mass of 2-isocyanatoethyl methacrylate (trade name "Karenz MOI", manufactured by Showa Denko Co., Ltd.) as a compound having a polymerizable carbon-carbon double bond was added to the resin solution. Further, 0.29 parts by mass of dibutyltin(IV) dilaurate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added, and stirred at 50° C. for 24 hours in an air atmosphere to obtain a base polymer. With respect to 100 parts by mass of the solid content of the obtained base polymer, 1.5 parts by mass of an isocyanate compound (trade name "Coronate L", manufactured by Tosoh Co., Ltd., 75 mass % of solid content), and 2,2- 1 part by mass of dimethoxy-1,2-diphenyl-1-one (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) was mixed. Using toluene as a diluting solvent, it adjusted so that the solid content rate might become 20-40 mass %, and obtained the adhesive agent solution (1).

This adhesive solution (1) was applied to the treated surface of a PET film (trade name "T912E75(UE80-)", manufactured by Mitsubishi Chemical Co., Ltd., thickness 75 μm) so that the thickness after drying became 112.5 μm. Under normal pressure, heat and dry at 50° C. for 1 minute, and heat and dry at 125° C. for 5 minutes to form an ultraviolet curable adhesive layer (1). On the other hand, the adhesive solution (1) obtained above was applied to the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying became 112.5 μm. , under normal pressure, heat and dry at 50° C. for 1 minute, and heat and dry at 125° C. for 5 minutes to form an ultraviolet curable adhesive layer (2).

Then, use a manual roller to separate the UV-curable adhesive layer (1) formed on the PET film and the adhesive layer of the UV-curable adhesive layer (2) formed on the release liner so that no air bubbles remain. They are attached to each other to form a UV-curable adhesive layer. Thereafter, the release liner was peeled off. Thus, the laminated body which has the structure of [PET film/ultraviolet curable adhesive layer] was produced.

(Radiation non-hardening adhesive layer) Put butyl acrylate ( 189.77 parts by mass of BA), 38.04 parts by mass of cyclohexyl acrylate (CHA), 85.93 parts by mass of 2-hydroxyethyl acrylate (HEA), 0.94 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator , and 379.31 parts by mass of methyl ethyl ketone as a polymerization solvent, while stirring, nitrogen replacement was performed at room temperature for 6 hours. Thereafter, the mixture was kept at 65° C. for 4 hours for polymerization and kept at 75° C. for 2 hours while stirring while blowing nitrogen gas, to obtain a resin solution. 1.5 parts by mass of an isocyanate compound (trade name "Coronate L", manufactured by Tosoh Co., Ltd., solid content 75% by mass) based on 100 parts by mass of the solid content of the base polymer was mixed with the obtained resin solution . Using toluene as a diluting solvent, it adjusted so that the solid content rate might become 20-40 mass %, and obtained the adhesive agent solution (2).

The adhesive solution (2) was applied to the release surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying became 25 μm, and the adhesive solution (2) was placed under normal pressure on Heat and dry at 125°C for 2 minutes to form a radiation non-hardening adhesive layer.

(PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer) Using a manual roller, the above-mentioned radiation non-curable adhesive layer was attached to the ultraviolet curable adhesive layer of the laminate having the composition of [PET film/ultraviolet curable adhesive layer] so that no air bubbles remained. In this manner, a laminate having a configuration of [PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer/release liner] was produced.

＜Sheet for optical semiconductor device sealing＞ Using a manual roller, peel off the adhesive adhesive layer exposed by the release liner from the laminate having the composition of [TAC film/adhesive adhesive layer/release liner] so that no air bubbles remain. The PET film surface of the laminate composed of [PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer/release liner]. Thereafter, aging was carried out at 50°C for 48 hours to produce a layer consisting of [TAC film/adhesive adhesive layer/PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer/release liner] The sheet for encapsulating an optical semiconductor element of Example 1.

Example 2 The thickness of the UV curable adhesive layer (1) was set to 100 μm, the thickness of the UV curable adhesive layer (2) was set to 100 μm (total thickness of the UV curable adhesive layer: 200 μm), and the radiation Except having set the thickness of the non-hardening adhesive layer to 50 micrometers, it carried out similarly to Example 1, and produced the sheet|seat for optical-semiconductor element sealing of Example 2.

Example 3 ＜PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer＞ (ultraviolet curable adhesive layer) The adhesive solution (1) prepared in Example 1 was applied to a PET film (trade name "T912E75(UE80-)", manufactured by Mitsubishi Chemical Co., Ltd., thickness 75 μm) so that the thickness after drying became 125 μm. On the treated surface, heat-dry at 50°C for 1 minute and at 125°C for 5 minutes under normal pressure to form a UV curable adhesive layer.

(Radiation non-hardening adhesive layer) The adhesive solution (2) prepared in Example 1 was applied to the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying became 125 μm. Under normal pressure, heat and dry at 50° C. for 1 minute, and heat and dry at 125° C. for 5 minutes to form a radiation non-hardening adhesive layer.

＜Sheet for optical semiconductor device sealing＞ The sheet|seat for optical-semiconductor element sealing of Example 3 was produced in the same manner as Example 1 except having used the radiation non-curable adhesive layer and ultraviolet curable adhesive layer obtained above.

Example 4 The adhesive solution (1) prepared in Example 1 was applied to a PET film (trade name "T912E75(UE80-)", manufactured by Mitsubishi Chemical Co., Ltd., thickness 75 μm) so that the thickness after drying became 125 μm. The treated surface was heated and dried at 50°C for 1 minute and at 125°C for 5 minutes under normal pressure to form an ultraviolet curable adhesive layer (1). On the other hand, peeling treatment of applying the adhesive solution (1) prepared in Example 1 to a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying becomes 125 μm On the surface, under normal pressure, heat-dry at 50°C for 1 minute, and heat-dry at 125°C for 5 minutes to form an ultraviolet curable adhesive layer (2). Then, three layers of the separately produced above-mentioned ultraviolet-curable adhesive layer (2) were sequentially laminated on the above-mentioned ultraviolet-curable adhesive layer (1) to prepare an ultraviolet-curable adhesive layer with a total thickness of 500 μm.

The adhesive solution (2) prepared in Example 1 was applied to the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying became 5 μm. Under normal pressure, heat and dry at 125° C. for 2 minutes to form a radiation non-hardening adhesive layer.

The sheet|seat for optical-semiconductor element sealing of Example 4 was produced in the same manner as Example 1 except having used the radiation non-curable adhesive layer and ultraviolet curable adhesive layer obtained above.

Example 5 The adhesive solution (1) prepared in Example 1 was applied to a PET film (trade name "T912E75(UE80-)", manufactured by Mitsubishi Chemical Co., Ltd., thickness 75 μm) so that the thickness after drying became 25 μm. The treated surface was heated and dried at 50°C for 1 minute and at 125°C for 2 minutes under normal pressure to form an ultraviolet curable adhesive layer.

The adhesive solution (2) prepared in Example 1 was applied to the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying became 112.5 μm. Under normal pressure, heat and dry at 50° C. for 1 minute, and then heat and dry at 125° C. for 5 minutes to form a radiation non-hardening adhesive layer (1).

Then, using a manual roller, the adhesive layers of the ultraviolet curable adhesive layer formed on the PET film and the radiation non-curable adhesive layer (1) formed on the release liner were attached to each other in such a manner that air bubbles would not remain. and then peel off the release liner. In this manner, a laminate having a composition of [PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer (1)] was produced.

On the other hand, peeling treatment of applying the adhesive solution (2) prepared in Example 1 to a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying becomes 112.5 μm On the surface, under normal pressure, heat-dry at 50°C for 1 minute and at 125°C for 5 minutes to form a radiation non-hardening adhesive layer (2).

Then, the non-radiation-curable adhesive in the laminate having the composition of [PET film/ultraviolet-curable adhesive layer/radiation-non-curable adhesive layer (1)] was placed using a hand roller so that air bubbles would not remain. The layer (1) and the adhesive layer of the radiation non-curable adhesive layer (2) formed on the release liner are attached to each other to form a radiation non-curable adhesive layer. In this manner, a laminate having a configuration of [PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer/release liner] was produced.

Using a manual roller, peel off the adhesive exposed on the release liner from the laminate having the composition of [TAC film/adhesive adhesive layer/release liner] produced in Example 1, and adhere without leaving air bubbles. The adhesive layer is bonded to the PET film surface of a laminate having a composition of [PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer/release liner]. Thereafter, aging was carried out at 50°C for 48 hours to produce a layer consisting of [TAC film/adhesive adhesive layer/PET film/ultraviolet curable adhesive layer/radiation non-curable adhesive layer/release liner] The sheet for encapsulating an optical semiconductor element of Example 5.

Comparative example 1 The adhesive solution (2) prepared in Example 1 was applied to a PET film (trade name "T912E75(UE80-)", manufactured by Mitsubishi Chemical Co., Ltd., thickness 75 μm) so that the thickness after drying became 125 μm. The treated surface was heated and dried at 50°C for 1 minute and at 125°C for 5 minutes under normal pressure to form a radiation non-hardening adhesive layer (1). On the other hand, peeling treatment of applying the adhesive solution (2) produced in Example 1 to a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying becomes 125 μm On the surface, under normal pressure, heat-dry at 50°C for 1 minute and at 125°C for 5 minutes to form a radiation non-hardening adhesive layer (2).

Then, using a hand roller, adhere the radiation non-curable adhesive layer (1) formed on the PET film to the radiation non-curable adhesive layer (2) formed on the release liner so that air bubbles do not remain. The adhesive layers are attached to each other to form a radiation non-hardening adhesive layer. In this way, a laminate having a configuration of [PET film/radiation non-curable adhesive layer/release liner] was produced.

Using a manual roller, peel off the adhesive exposed on the release liner from the laminate having the composition of [TAC film/adhesive adhesive layer/release liner] produced in Example 1, and adhere without leaving air bubbles. The agent layer was bonded to the PET film surface of the laminate having the composition of [PET film/radiation non-hardening adhesive layer/release liner]. Thereafter, aging was carried out at 50° C. for 48 hours, and an optical semiconductor element of Comparative Example 1 having a layer composition of [TAC film/adhesive adhesive layer/PET film/radiation non-curable adhesive layer/release liner] was produced. Sealing sheet.

Comparative example 2 The adhesive solution (1) prepared in Example 1 was applied to a PET film (trade name "T912E75(UE80-)", manufactured by Mitsubishi Chemical Co., Ltd., thickness 75 μm) so that the thickness after drying became 125 μm. The treated surface was heated and dried at 50°C for 1 minute and at 125°C for 5 minutes under normal pressure to form an ultraviolet curable adhesive layer (1). On the other hand, peeling treatment of applying the adhesive solution (1) prepared in Example 1 to a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying becomes 125 μm On the surface, under normal pressure, heat-dry at 50°C for 1 minute, and heat-dry at 125°C for 5 minutes to form an ultraviolet curable adhesive layer (2).

Then, use a manual roller to separate the UV-curable adhesive layer (1) formed on the PET film and the adhesive layer of the UV-curable adhesive layer (2) formed on the release liner so that no air bubbles remain. They are attached to each other to form a UV-curable adhesive layer. Thus, the laminated body which has the structure of [PET film/ultraviolet curable adhesive layer/release liner] was produced.

Using a manual roller, peel off the adhesive exposed on the release liner from the laminate having the composition of [TAC film/adhesive adhesive layer/release liner] produced in Example 1, and adhere without leaving air bubbles. The adhesive layer was bonded to the PET film surface of the laminate having the composition of [PET film/ultraviolet curable adhesive layer/release liner]. Thereafter, aging was carried out at 50° C. for 48 hours, and the photo-semiconductor element sealing of Comparative Example 2 having a layer composition of [TAC film/adhesive adhesive layer/PET film/ultraviolet curable adhesive layer/release liner] was produced. Use sheet.

Comparative example 3 The adhesive solution (2) prepared in Example 1 was applied to a PET film (trade name "T912E75(UE80-)", manufactured by Mitsubishi Chemical Co., Ltd., thickness 75 μm) so that the thickness after drying became 25 μm. The treated surface was heated and dried at 50°C for 1 minute and at 125°C for 2 minutes under normal pressure to form a radiation non-hardening adhesive layer.

The adhesive solution (1) prepared in Example 1 was applied to the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying became 112.5 μm. Under normal pressure, heat and dry at 50° C. for 1 minute, and heat and dry at 125° C. for 5 minutes to form an ultraviolet curable adhesive layer (1).

Then, using a manual roller, the adhesive layers of the radiation non-curable adhesive layer formed on the PET film and the ultraviolet curable adhesive layer (1) formed on the release liner were attached to each other in such a manner that air bubbles would not remain. and then peel off the release liner. In this manner, a laminate having a constitution of [PET film/radiation non-curable adhesive layer/ultraviolet curable adhesive layer (1)] was produced.

On the other hand, peeling treatment of applying the adhesive solution (1) prepared in Example 1 to a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying becomes 112.5 μm On the surface, under normal pressure, heat-dry at 50°C for 1 minute, and heat-dry at 125°C for 5 minutes to form an ultraviolet curable adhesive layer (2).

Then, using a hand roller, place the ultraviolet curable adhesive layer in the laminate having the composition of [PET film/radiation non-curable adhesive layer/ultraviolet curable adhesive layer (1)] so that no air bubbles remain. (1) The adhesive layers of the ultraviolet curable adhesive layer (2) formed on the release liner are attached to each other to form one ultraviolet curable adhesive layer. In this manner, a laminate having a configuration of [PET film/radiation non-curable adhesive layer/ultraviolet curable adhesive layer/release liner] was produced.

Using a manual roller, peel off the adhesive exposed on the release liner from the laminate having the composition of [TAC film/adhesive adhesive layer/release liner] produced in Example 1, and adhere without leaving air bubbles. The adhesive layer is bonded to the PET film surface of a laminate having a composition of [PET film/radiation non-curable adhesive layer/ultraviolet curable adhesive layer/release liner]. Thereafter, aging was carried out at 50°C for 48 hours to produce a layer consisting of [TAC film/adhesive adhesive layer/PET film/radiation non-curable adhesive layer/ultraviolet curable adhesive layer/release liner] The sheet for encapsulating an optical semiconductor element of Comparative Example 3.

＜Evaluation＞ The following evaluation was performed about the ultraviolet curable adhesive layer and the sheet|seat for optical-semiconductor element sealing obtained in the Example and the comparative example. The results are shown in the table.

(1) Hardness measured by nanoindentation method Regarding the sheets for sealing optical semiconductor elements obtained in Examples and Comparative Examples, ultraviolet irradiation was carried out under the following ultraviolet irradiation conditions from the TAC film side to make the ultraviolet curable The adhesive layer hardens. Thereafter, after freezing at -40°C to -30°C for 10 to 15 minutes, cut in the thickness direction using an ultramicrotome under the freezing conditions to expose the cross-section of the cured UV-curable adhesive layer . Then, by solidifying Pentel correction fluid (article number "XEZL1-W"), the photo-semiconductor element sealing sheet with the cross section exposed was fixed on the metal platform equipped with the device, and then the polyimide film Stick it on the window of the device, etc. to shield it from light, and then evaluate it. Using a nanoindenter (trade name "TriboIndenter", manufactured by HYSITRON Inc.), nanoindentation measurement was performed on the surface of the cured ultraviolet curable adhesive layer under the following nanoindentation measurement conditions. Then, the obtained hardness is shown in Table 1. <Ultraviolet irradiation conditions> Ultraviolet irradiation device: product name "UM810", manufactured by Nitto Seiki Co., Ltd. Light source: high-pressure mercury lamp Irradiation intensity: 50 mW/cm ² (measurement device: product name "Ultraviolet Illuminance Meter UT-101", Ushio Electric Manufactured by Co., Ltd.) Irradiation time: 100 seconds Cumulative light intensity: 5000 mJ/cm ² <Nanoindentation measurement conditions> Indenter used: Berkovich (triangular pyramid type) Measurement method: Single indentation measurement Measurement temperature: Indentation at 23°C Depth setting: 3.0 μm Loading speed: 500 nm/s Unloading speed: 500 nm/s

(2) Cutting evaluation For the optical semiconductor element sealing sheets obtained in Examples and Comparative Examples, the entire surface of the adhesive layer exposed by peeling off the release liner was bonded to the substrate (trade name "Lead Free") with a manual roller. Universal Board ICB93SGPBF", manufactured by Sunhayato Co., Ltd.), and made test samples. Furthermore, the area of the adhesive layer of the sheet for optical semiconductor element sealing is larger than the area of the substrate to be bonded. The bonding system is carried out in an environment with a temperature of 22°C and a humidity of 50%, in such a way that no air bubbles remain. Thereafter, the above test sample was irradiated with ultraviolet rays under the following ultraviolet irradiation conditions (1) from the TAC film side to harden the ultraviolet curable adhesive layer. In addition, ultraviolet irradiation was not performed about the test sample using the sheet|seat for optical-semiconductor element sealing of the comparative example 1 which does not have an ultraviolet curable adhesive layer. <Ultraviolet irradiation conditions (1)> Ultraviolet irradiation device: Product name " ^UM810 ", manufactured by Nitto Seiki Co., Ltd. Light source: High-pressure mercury lamp Irradiation intensity: 50 mW/cm , manufactured by Ushio Electric Co., Ltd.) Irradiation time: 100 seconds Cumulative light intensity: 5000 mJ/cm ²

After ultraviolet irradiation, a dicing tape (trade name "NBD-5172K", manufactured by Nitto Denko Co., Ltd.) was attached to the substrate surface of the test sample on the side where the optical-semiconductor element sealing sheet was not attached. Attach the dicing ring for dicing to the adhesive side of the dicing tape. After attaching, place it under shading and at a temperature of 22°C for 30 minutes. Thereafter, the laminate of the test sample and the dicing tape was diced with a blade at a position 5 mm inward from the side end of the substrate under the following dicing conditions. ＜Cutting conditions＞ Cutting device: Trade name "DFD-6450", manufactured by DISCO Co., Ltd. Cutting method: single cut Cutting speed: 30 mm/sec Cutting blade: Product name "P1A861 SDC400N75BR597", manufactured by DISCO Co., Ltd. Cutting blade speed: 30,000 rpm Blade height: 85 μm Water volume: 1.5 L/min Cutting interval: 10 mm The distance of 1 cut: the full length of the test sample

Furthermore, the blade used for cutting was obtained by grinding and cutting by the following method. A dicing ring and a plate (trade name "DRESSER BOARD BGCA0172", manufactured by DISCO Co., Ltd.) were attached to the adhesive layer of a dicing tape (trade name "NBD-7163K", manufactured by Nitto Denko Co., Ltd.) to prepare a handle The workpiece. Next, the obtained workpiece was cut under the grinding and cutting conditions described below to obtain the above-mentioned blade for cutting the blade. ＜Grinding and cutting conditions＞ Cutting device: product name "DFD-6450", manufactured by DISCO Co., Ltd. Cutting method: single cut Cutting speed: 55 mm/sec Cutting blade: Product name "P1A861 SDC400N75BR597" (new product), manufactured by DISCO Co., Ltd. Cutting blade speed: 35,000 rpm Blade height: 500 μm Water volume: 1.5 L/min The distance of 1 cut: the whole length of the board Cutting interval: in units of 1 mm Cutting times: 100 times

After cutting with the blade, under the following ultraviolet irradiation condition (2), irradiate ultraviolet light from the substrate side of the dicing tape to reduce the peel strength of the dicing tape to the substrate. <Ultraviolet irradiation conditions ( ² )> Ultraviolet irradiation device: Product name "UM810", manufactured by Nitto Seiki Co., Ltd. , manufactured by Ushio Electric Co., Ltd.) Irradiation time: 10 seconds Cumulative light intensity: 500 mJ/cm ²

Thereafter, the laminate of the test sample and the substrate cut into short strips by blade dicing was peeled off from the dicing tape, and those whose peeling was confirmed from the substrate of the test sample during dicing were evaluated as "B", and those whose peeling was not confirmed were rated as "B". Rated "A".

(3) Drawing evaluation The laminate of two test samples cut into short strips and the substrate in the above-mentioned dicing evaluation was peeled off from the dicing tape. Next, the cut surfaces exposed by dicing of the above-mentioned two laminates were adhered to each other, and in this state, they were left to stand in an environment at a temperature of 50° C. for 24 hours. Thereafter, the above-mentioned 2 short strips were taken out and placed in an environment with a temperature of 22° C. and a humidity of 50% for 3 hours. Afterwards, try to peel off the bonded cut surfaces by hand, and evaluate as "D" those who have not peeled off or those who have been peeled but have a string of adhesive layer clearly confirmed, and those who have peeled off but have a slight adhesive layer. Those who need to be peeled off forcefully but can be peeled off without stringing of the adhesive layer are rated as "B", those who do not need to be peeled off with special force and can be peeled off without stringing of the adhesive layer rated as "A".

[Table 1] (Table 1) Example 1 Example 2 Example 3 Example 4 Example 5 Comparative example 1 Comparative example 2 Comparative example 3 Thickness of UV curable adhesive layer [μm] 225 200 125 500 25 - 250 225 Thickness of radiation non-hardening adhesive layer [μm] 25 50 125 5 225 250 - 25 Thickness of sheet for optical semiconductor element sealing [μm] 395 395 395 650 395 395 395 395 Ratio of thickness of ultraviolet curable resin layer [%] 57 51 32 77 6 0 63 57 [UV curable resin layer thickness/radiation non-curable adhesive layer thickness] 9 4 1 100 0.11 0 - 9 Equipped with ultraviolet curable resin layer and radiation non-curable adhesive layer have have have have have Do not have Do not have have Adhesive layer on the side of optical semiconductor element Radiation non-hardening adhesive layer Radiation non-hardening adhesive layer Radiation non-hardening adhesive layer Radiation non-hardening adhesive layer Radiation non-hardening adhesive layer Radiation non-hardening adhesive layer UV curable adhesive layer UV curable adhesive layer thickest layer UV curable adhesive layer UV curable adhesive layer UV curable adhesive layer UV curable adhesive layer Radiation non-hardening adhesive layer Radiation non-hardening adhesive layer UV curable adhesive layer UV curable adhesive layer Hardness measured by nanoindentation method [MPa] 63.9 63.9 63.9 63.9 63.9 - 63.9 63.9 cut evaluation A A A A A A B B Drawing evaluation A A B A C D. A A

As shown in Table 1, the evaluation of the sheet for sealing an optical semiconductor element of the present invention (Example) is that the result of the cutting evaluation is good, the sheet is excellent in adhesion to the optical semiconductor element and the substrate, and the sealing property of the optical semiconductor element is excellent. . In addition, it was evaluated that the result of the stringing evaluation was good, the adhesiveness of the side surface of the sealing part was low, and when the adjacent optical semiconductor devices were pulled apart, it was difficult to cause sheet chipping or adhesion of adjacent optical semiconductor devices.

On the other hand, in the case of not having an ultraviolet curable adhesive layer (Comparative Example 1), the result of stringiness evaluation was poor. Also, when there is no radiation non-curable adhesive layer (Comparative Example 2), and when the layer located on the surface of the optical semiconductor element side is an ultraviolet curable adhesive layer (Comparative Example 3), cutting evaluation The result was poor, and it was evaluated that the sealing property of the optical semiconductor element was poor.

1: Sheet for sealing optical semiconductor elements 1': Hardened sheet for sealing optical semiconductor elements 2: Substrate part 3: Sealing part 4: Peel off the liner 5: Substrate 6: Optical semiconductor device 10: Optical semiconductor device 20: Optical semiconductor device 20a: Junction 21: Optical film 22: Adhesive layer 23: plastic film 31: radiation curable resin layer 31': hardened sealant 32: Radiation non-hardening adhesive layer

Fig. 1 is a cross-sectional view of a sheet for sealing an optical semiconductor element according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of an optical semiconductor device using the sheet for sealing an optical semiconductor element according to one embodiment of the present invention. FIG. 3 is an external view showing an embodiment of an optical semiconductor device fabricated by laminating the optical semiconductor devices shown in FIG. 2 . FIG. 4 is a cross-sectional view showing the state of a sealing step in one embodiment of the method of manufacturing an optical semiconductor device. FIG. 5 shows a cross-sectional view showing the laminate obtained after the sealing step shown in FIG. 4 . FIG. 6 is a cross-sectional view showing a laminate obtained by irradiating the laminate shown in FIG. 5 with radiation. Fig. 7 is a cross-sectional view showing cutting positions in the cutting step of the laminate shown in Fig. 6 .

1: Sheet for sealing optical semiconductor elements

2: Substrate part

3: Sealing part

4: Peel off the liner

21: Optical film

22: Adhesive layer

23: plastic film

31: radiation curable resin layer

32: Radiation non-hardening adhesive layer

Claims (15)

A sheet for sealing an optical semiconductor element, which is a sheet for sealing one or more optical semiconductor elements arranged on a substrate, The sheet for encapsulating an optical semiconductor element includes a base portion, and a sealing portion provided on one surface of the base portion and sealing the optical semiconductor element; and The sealing portion has a radiation non-curable adhesive layer positioned on the surface of the optical semiconductor element side when sealing the optical semiconductor element, and a radiation curable resin layer laminated on the radiation non-curable adhesive layer. The sheet for encapsulating an optical semiconductor element according to claim 1, wherein the radiation curable resin layer is thicker than the radiation non-curable adhesive layer. The sheet for encapsulating an optical semiconductor element according to claim 1 or 2, wherein the sealing portion contains a layer containing a coloring agent. The sheet for encapsulating an optical semiconductor element according to claim 1 or 2, which is provided with a layer having anti-glare properties and/or anti-reflection properties. The sheet for encapsulating an optical semiconductor element according to claim 1 or 2, which includes a layer mainly composed of a polyester resin and/or a polyimide resin. The sheet for encapsulating optical semiconductor elements according to claim 1 or 2, wherein the hardness of the hardened cross-section of the radiation-curable resin layer at 23° C. measured by nanoindentation method is 1.4 MPa or more. An optical semiconductor device comprising a substrate, an optical semiconductor element disposed on the substrate, and the radiation curing of the optical semiconductor element sealing sheet according to any one of claims 1 to 6 for sealing the optical semiconductor element A hardened product formed by hardening the permanent resin layer. The optical semiconductor device according to Claim 7, which is a backlight device for a liquid crystal display. An image display device comprising a backlight device and a display panel according to Claim 8. The optical semiconductor device according to claim 7, which is a self-luminous display device. An image display device comprising the self-luminous display device according to claim 10. A method for manufacturing an optical semiconductor device, comprising a step of dicing a laminate to obtain an optical semiconductor device, wherein the laminate includes a substrate, an optical semiconductor element arranged on the substrate, and a device for sealing the optical semiconductor element. A cured product obtained by curing the radiation-curable resin layer of the sheet for encapsulating an optical semiconductor element according to any one of claims 1 to 6. The method for manufacturing an optical semiconductor device according to claim 12, further comprising a radiation irradiation step of irradiating the laminated body with radiation to harden the radiation-curable resin layer to obtain the cured product, the laminated body having the substrate and being disposed on the substrate The optical-semiconductor element above, and the said optical-semiconductor element sealing sheet which seals the said optical-semiconductor element. The method for manufacturing an optical semiconductor device according to claim 13, which includes a sealing step: bonding the optical semiconductor element sealing sheet to the optical semiconductor element provided on the substrate, and sealing the optical semiconductor with the sealing part The element is sealed; thereafter, the above-mentioned radiation irradiation step is performed. The method for manufacturing an optical semiconductor device according to Claim 12, which further includes a collage step: arranging the plurality of optical semiconductor devices obtained in the cutting step so as to be in contact with each other in the planar direction.

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