TW202243868A - Heat-dissipation substrate structure and method for manufacturing the same - Google Patents

Abstract

A heat-dissipation substrate structure and method for manufacturing the same are provided. The heat-dissipation substrate structure includes a base layer and a cold sprayed layer. The cold sprayed layer is formed on the surface of the base layer. The cold sprayed layer is a thin film formed on the surface of the base layer by spraying solid-phase metal powders and high-pressure compressed gas onto the base layer. The solid-phase metal powders contain the powder that has an apparent density of 3 to 4 g/cm ³and a median particle diameter (D50) of 30µm or less. The maximum depth of the bottom of the cold sprayed layer embedded into the base layer is less than or equal to 100µm.

Description

Heat dissipation substrate structure and forming method thereof

The present invention relates to a base material structure and a forming method thereof, in particular to a heat dissipation base material structure and a forming method thereof.

The cold spray coating formed by spraying solid phase metal powder and low-pressure compressed gas onto the surface of the heat dissipation substrate has low joint strength because the metal powder is in solid phase. However, the cold spray coating formed by spraying the solid phase metal powder and high-pressure compressed gas onto the surface of the heat-dissipating substrate will make the embedding depth too deep due to high-pressure spraying, and it is easy to produce complex, diverse and unpredictable microstructures Or crack.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a heat-dissipating base material structure and a forming method thereof in view of the deficiencies of the prior art.

In order to solve the above technical problems, the present invention provides a heat dissipation base material structure, comprising: a base layer, and a cold sprayed layer formed on the surface of the base layer; wherein, the cold sprayed layer is formed by Phase metal powder is sprayed onto the base layer together with high-pressure compressed gas to form a thin film on the surface of the base layer; wherein, the solid phase metal powder contains at least an apparent density of 3 to 4 g/cm ³ Film-forming powder with a median particle size (D50) of 30 µm or less; wherein, the maximum depth of the bottom of the cold sprayed layer embedded in the base layer is ≦100 µm.

In a preferred embodiment, the cold sprayed layer is a cold sprayed copper layer.

In a preferred embodiment, the base layer is an aluminum substrate.

In a preferred embodiment, the high-pressure compressed gas is a compressed gas with a pressure between 4-6Mpa.

In order to solve the above technical problems, the present invention further provides a method for forming a heat dissipation substrate structure, comprising: (a) providing a base layer, and (b) forming a cold sprayed layer on the surface of the base layer; wherein, The cold spray coating is a thin film formed on the surface of the base layer by spraying the solid phase metal powder together with high-pressure compressed gas onto the base layer; wherein, the solid phase metal powder contains at least visual A film-forming powder with a density of 3-4g/cm ³ and a median particle size (D50) of 30µm or less; wherein, the maximum depth of the bottom of the cold sprayed layer embedded in the base layer is ≦100µm.

The beneficial effect of the present invention lies at least in that the heat dissipation base material structure provided by the present invention and its forming method can pass through "the cold sprayed layer is sprayed onto the base layer by solid-phase metal powder and high-pressure compressed gas together, and A thin film formed on the surface of the base layer", "the solid-phase metal powder is a film-forming powder containing at least an apparent density of 3 to 4 g/cm ³ and a median particle size (D50) of 30 µm or less ", and "the maximum depth of the bottom of the cold spray coating embedded in the base layer≦100µm" can make the bonding strength between the cold spray coating and the base layer reach more than 40MPa, and can make the bottom of the cold spray coating embedded in the base layer The maximum depth of ≦100µm, so as to achieve the effect that the depth of high-pressure spraying is not deep, but the joint strength can still reach more than 40MPa.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

Please refer to FIG. 1 , which shows a heat dissipation substrate structure provided by the present invention. As shown in the figure, the heat dissipation substrate structure provided by the present invention has a base layer 10 and a cold sprayed layer 20 .

On top of that, the cold sprayed layer 20 is formed on the base layer 10 . In this embodiment, the base layer 10 is an aluminum heat dissipation substrate, but it can also be an aluminum heat sink, but it is not limited thereto.

In this embodiment, the cold sprayed layer 20 is a thin film formed on the surface of the base layer 10 by spraying the solid phase metal powder and high-pressure compressed gas onto the base layer 10 . Moreover, the high-pressure compressed gas in this embodiment is preferably a compressed gas with a pressure of 4-6 MPa.

Furthermore, in this embodiment, the solid-phase metal powder used to form the cold sprayed layer 20 is a film-forming powder containing at least an apparent density of 3-4 g/cm ³ and a median particle size (D50) of 30 μm or less. powder.

Moreover, according to actual experimental results, when the solid phase metal powder used to form the cold sprayed layer 20 is a film-forming powder containing at least an apparent density of 3 to 4 g/cm ³ and a median particle size (D50) of 30 μm or less , and by spraying the solid-phase metal powder and high-pressure (4~6Mpa) compressed gas onto the base layer 10, the bonding strength between the cold sprayed layer 20 and the base layer 10 can reach more than 40 MPa. Moreover, as shown in FIG. 2, the maximum depth D of the bottom of the cold sprayed layer 20 embedded in the base layer 10 is less than or equal to (≦) 100µm, or even less than 60µm, so that the depth of the high-pressure spraying effect is not deep, but the joint strength can still reach Above 40MPa, and can avoid complex and unpredictable microstructures or cracks.

In one embodiment, the cold sprayed layer 20 may be a cold sprayed copper layer. Furthermore, the cold-sprayed copper layer can be a thin film formed on the surface of the base layer 10 by spraying solid-phase copper powder and high-pressure compressed gas onto the base layer 10 .

In one embodiment, the cold sprayed layer 20 may be a cold sprayed aluminum layer. Furthermore, the cold-sprayed aluminum layer can be a thin film formed on the surface of the base layer 10 by spraying the solid-phase aluminum powder together with high-pressure compressed gas onto the base layer 10 .

In one embodiment, the cold sprayed layer 20 may be a cold sprayed nickel layer. Furthermore, the cold-sprayed nickel layer can be a thin film formed on the surface of the base layer 10 by spraying the solid-phase nickel powder together with high-pressure compressed gas onto the base layer 10 .

In one embodiment, the cold sprayed layer 20 may be a cold sprayed iron layer. Furthermore, the cold-sprayed iron layer may be a thin film formed on the surface of the base layer 10 by spraying solid-phase iron powder and high-pressure compressed gas onto the base layer 10 .

In one embodiment, the cold sprayed layer 20 may be a cold sprayed alloy layer. Further, the cold sprayed alloy layer can be sprayed onto the base layer 10 by spraying at least two of solid phase copper powder, solid phase aluminum powder, solid phase nickel powder, and solid phase iron powder together with high-pressure compressed gas, and on the base A thin film formed on the surface of layer 10.

According to the above, the present invention also provides a method for forming a heat dissipation substrate structure, which mainly includes the following steps: (a) providing a base layer, and (b) forming a cold sprayed layer on the surface of the base layer. In detail, the cold spray coating in this embodiment is a thin film formed on the surface of the base layer by spraying solid phase metal powder and high-pressure (4~6Mpa) compressed gas onto the base layer together. Moreover, the solid-phase metal powder used to form the cold spray coating is a film-forming powder containing at least an apparent density of 3-4 g/cm ³ and a median particle size (D50) of 30 μm or less. Furthermore, the maximum depth of the bottom of the cold sprayed coating embedded in the base layer is ≦100µm.

Based on the above, the heat dissipation base material structure and its forming method provided by the present invention can be achieved by "the cold spray coating is sprayed onto the base layer by solid-phase metal powder and high-pressure compressed gas, and on the A thin film formed on the surface of the base layer", "the solid-phase metal powder is a film-forming powder containing at least an apparent density of 3 to 4 g/cm ³ and a median particle size (D50) of 30 µm or less", and The technical scheme of "the maximum depth of the bottom of the cold sprayed layer embedded in the base layer≦100µm" can make the bonding strength between the cold sprayed layer 20 and the base layer 10 reach more than 40MPa, and can make the bottom of the cold sprayed layer 20 embedded in the base layer 10 The maximum depth ≦ 100µm, so as to achieve the effect that the depth of high-pressure spraying is not deep, but the joint strength can still reach more than 40MPa.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Base layer 20: cold spray coating D: maximum depth

FIG. 1 is a schematic side view of the heat dissipation substrate structure of the present invention.

FIG. 2 is an enlarged schematic view of part II of FIG. 1 .

10: Base layer

20: cold spray coating

D: maximum depth

Claims (8)

A heat dissipation substrate structure, comprising: a base layer, and a cold sprayed layer formed on the surface of the base layer; wherein, the cold sprayed layer is sprayed onto the solid phase metal powder together with high-pressure compressed gas The base layer, and a thin film formed on the surface of the base layer; wherein, the solid-phase metal powder contains at least an apparent density of 3 to 4 g/cm ³ and a median particle size (D50) of 30 μm The following film-forming powder; wherein, the maximum depth of the bottom of the cold sprayed layer embedded in the base layer is ≦100µm. The heat dissipation substrate structure according to claim 1, wherein the cold sprayed layer is a cold sprayed copper layer. The heat dissipation substrate structure according to claim 1, wherein the base layer is an aluminum substrate. The heat dissipation substrate structure according to claim 1, wherein the high-pressure compressed gas is a compressed gas with a pressure of 4-6 MPa. A method for forming a heat dissipation substrate structure, comprising: (a) providing a base layer, and (b) forming a cold sprayed layer on the surface of the base layer; wherein, the cold sprayed layer is formed by applying a solid metal The powder is sprayed onto the base layer together with high-pressure compressed gas to form a thin film on the surface of the base layer; wherein, the solid-phase metal powder contains at least an apparent density of 3 to 4 g/cm ³ and a medium Film-forming powder with a particle size (D50) of 30 μm or less; wherein, the maximum depth of the bottom of the cold sprayed layer embedded in the base layer is ≦100 μm. The method for forming a heat dissipation substrate structure according to claim 5, wherein the cold sprayed layer is a cold sprayed copper layer. The method for forming a heat dissipation substrate structure according to claim 5, wherein the base layer is an aluminum substrate. The method for forming a heat dissipation substrate structure according to claim 5, wherein the high-pressure compressed gas is a compressed gas with a pressure of 4-6 MPa.

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