TW202243783A - Integrated laser and microwave annealing system and annealing method - Google Patents

Abstract

An integrated laser and microwave annealing system and an annealing method are disclosed. The annealing system comprises a microwave power source system, a laser heating source system, and a measurement and control system. The microwave power source system provides a first microwave energy to a first region of an object to be annealed, so as to anneal the first region of the object. The laser heating source system provides a laser energy to a second area of the object to be annealed, so as to anneal the second area of the object. A measurement and control system is provided to monitor and control the microwave and/or laser power. The invention can reduce the required overall annealing time, and can avoid cracks or defects due to large stress difference.

Description

Annealing system and annealing method integrating laser and microwave

The present invention relates to an annealing system and an annealing method, in particular to an annealing system and an annealing method integrating laser and microwave.

Although microwave annealing can provide faster heating and cooling rates, the limit of the heating rate of the microwave resonant cavity is 200 degrees Celsius per minute, and it is not suitable for annealing large-sized wafers, let alone mass processing. At present, although laser annealing technology is used, the energy of laser annealing is excessively concentrated on the laser spot, which is prone to the problem of excessive diffusion of implanted ions, and is limited by the area of the laser spot, which makes it impossible to uniformly heat the object to be annealed, resulting in its focal point Excessive temperature difference from the non-focus point can easily cause stress and cracks or defects.

In view of this, an object of the present invention is to provide an annealing system and an annealing method integrating laser and microwave, so as to solve the above-mentioned problems in the prior art.

In order to achieve the aforementioned purpose, the present invention proposes an annealing system integrating laser and microwave, including: a microwave power source system, which provides a microwave energy to a first region of an object to be annealed, so as to anneal the The first region of the object to be annealed; a laser heating source system that provides a laser energy to a second region of the object to be annealed, thereby annealing the second region of the object to be annealed ; and a measurement and control system, the measurement and control system includes a temperature measurement device, a power measurement device and a control device, the temperature measurement device is to monitor a temperature value of the object to be annealed, the power measurement device is to measure the A power change of at least one of the microwave power source system providing the microwave energy and the laser heating source system providing the laser energy, wherein the control device adjusts the microwave power source system correspondingly according to the temperature value and the power change Providing a first power of the microwave energy and/or adjusting the laser heating source system to provide a second power of the laser energy.

Wherein, the first area includes the second area.

Wherein, the microwave power source system provides the microwave energy to the first region of the object to be annealed integrally, and the laser heating source system provides the laser energy to the second region of the object to be annealed in a scanning manner.

Wherein, a first time period in which the microwave power source system provides the microwave energy to the first region covers a second time period in which the laser heating source system provides the laser energy to the second region.

Wherein, the second time interval of the laser heating source system providing the laser energy to the second area covers the first time interval of the microwave power source system providing the microwave energy to the first area.

Wherein, the microwave energy provided by the microwave power source system is provided to the first region along a first axis, and the laser energy provided by the laser heating source system is provided along a second axis For the second region, the included angle between the first axis and the second axis ranges from 0° to 180°.

Wherein, the laser heating source system includes a laser generator and a lens group, the laser generator generates a laser, and the lens group guides the laser to the second area of the object to be annealed superior.

Wherein, the microwave power source system includes at least one microwave generator and a resonant cavity, the microwave generator generates a microwave, and the resonant cavity guides the microwave to the first region of the object to be annealed.

Wherein, the microwave power source system and the laser heating source system respectively provide the microwave energy and the laser energy from opposite sides of the object to be annealed.

Wherein, the microwave power source system and the laser heating source system respectively provide the microwave energy and the laser energy from the same side of the object to be annealed.

Wherein, the lens group of the laser heating source system is coaxially arranged on the resonant cavity of the microwave power source system, so as to guide the laser to the second region of the object to be annealed.

Wherein, the microwave power source system and the laser heating source system respectively provide the microwave energy and the laser energy to the object to be annealed from the vertical side of the object to be annealed.

Wherein, the microwave power source system includes two microwave generators and a resonant cavity, the two microwave generators generate two microwaves, and the resonant cavity guides the two microwaves to the on the first region of the object to be annealed.

Wherein, a microwave absorbing element is further included, and the microwave absorbing element and the microwave power source system are located on opposite sides of the object to be annealed.

Wherein, the resonance cavity of the microwave power source system runs through an opening, and the object to be annealed moves in the resonance cavity through the opening to receive the microwave energy.

Wherein, the power measurement device measures a forward signal and/or of at least one of the microwave power source system providing the microwave energy with a microwave and the laser heating source system providing the laser energy with a laser A reflected signal is used to obtain the power change.

Wherein, the power measuring device includes measuring at least one of the forward signal and a reflected signal of the microwave energy provided by the microwave power source system and the laser heating source system provided by a laser. at least one of a forward signal and a reflected signal.

Wherein, the microwave power source system also includes an isolator and a matching device arranged between the microwave generator and the resonant cavity.

Wherein, the first region or the second region is located in a depth or on a surface of the object to be annealed.

In order to achieve the aforementioned purpose, the present invention proposes an annealing method integrating laser and microwave, comprising: performing a microwave annealing procedure, thereby utilizing a microwave power source system to anneal a first region of an object to be annealed with a microwave energy; performing a A laser annealing process, whereby a laser heating source system is used to provide a laser energy to a second area of the object to be annealed; A temperature value, a power change of at least one of the microwave energy provided by the microwave power source system and the laser energy provided by the laser heating source system, so as to adjust the microwave power source system to provide one of the microwave energy accordingly The first power and/or the laser heating source system provides a second power of the laser energy.

Wherein, the first area includes the second area.

Wherein, the microwave power source system provides the microwave energy to the first region of the object to be annealed integrally, and the laser heating source system provides the laser energy to the second region of the object to be annealed in a scanning manner.

Wherein, a first time period in which the microwave power source system provides the microwave energy to the first region covers a second time period in which the laser heating source system provides the laser energy to the second region.

Wherein, the second time interval of the laser heating source system providing the laser energy to the second area covers the first time interval of the microwave power source system providing the microwave energy to the first area.

Wherein, the microwave power source system provides the microwave energy to the first region along a first axis, and the laser heating source system provides the laser energy to the second region along a second axis, The included angle between the first axis and the second axis ranges from 0° to 180°.

Wherein, the microwave power source system provides the microwave energy to the first region from two opposite directions of the first axis.

Based on the above, the integrated laser and microwave annealing system and annealing method of the present invention have the following advantages:

(1) The present invention uses microwave energy and laser energy to carry out a synergistic annealing procedure, which helps to combine the advantages of microwave annealing and laser annealing.

(2) Using microwave energy to increase the temperature of the annealed object helps to increase the laser energy absorption rate of the annealed object, so it can reduce the laser energy required for the laser annealing process, or reduce the overall annealing time required.

(3) By using microwave energy to increase the temperature of the second area and other areas (not the second area) of the object to be annealed, the temperature difference between the two areas (Thermal Shock) can be reduced to avoid cracks or cracks caused by large stress differences. defect.

(4) The present invention uses microwave energy to anneal the whole object to be annealed, which can avoid defects caused by large temperature gradients, and can also solve the problem of excessive diffusion of implanted ions.

(5) The present invention uses microwave energy to anneal the entire object to be annealed, and selects a specific laser wavelength corresponding to the annealing target, and can selectively perform laser annealing on a specific depth area.

Herein, in order to make Jun Shen have a further understanding and understanding of the technical characteristics of the present invention and the technical effects that can be achieved, the preferred embodiment and detailed description are as follows.

In order to facilitate the understanding of the technical features, content and advantages of this creation and the effects it can achieve, this creation is hereby combined with the drawings and described in detail in the form of embodiments as follows, and the ideas used in it are only for the purpose of For the purpose of illustration and auxiliary instructions, it may not be the true proportion and precise configuration of this creation after its implementation. Therefore, the scale and configuration relationship of the attached drawings should not be interpreted or limited to the scope of rights of this creation in actual implementation. In addition, for ease of understanding, the same elements in the following embodiments are described with the same symbols.

In addition, the terms used in the entire specification and patent claims generally have the ordinary meanings of each term used in this field, in the disclosed content and in the special content, unless otherwise specified. Certain terms used to describe the invention are discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance in describing the invention.

Regarding the use of "first", "second", "third", etc. in this article, it does not specifically refer to the meaning of order or order, nor is it used to limit the creation, it is just to distinguish components described with the same technical terms or operation only.

Secondly, if the words "comprising", "including", "having", "containing" etc. are used in this article, they are all open terms, meaning including but not limited to.

Please refer to Fig. 1 to Fig. 3, Fig. 1 is the schematic diagram showing the operation of the annealing system integrating laser and microwave of the present invention, Fig. 2 is the operation flowchart of the annealing method integrating laser and microwave of the present invention, Fig. 3 is A schematic diagram of the annealing system integrating laser and microwave of the present invention. The present invention proposes an annealing system and annealing method integrating laser and microwave, which uses a microwave power source system 30 to provide microwave energy to the first region of an object to be annealed 100, and uses a laser heating source system 50 to provide laser energy The second area of the object to be annealed is provided, so that the annealing effect can be achieved, and the microwave energy and laser energy to be provided can also be controlled, and for example, the time required for the overall annealing can be reduced. In addition, the present invention can monitor and control the operation of the microwave power source system 30 and the laser heating source system 50 through the measurement and control system 80 . In addition, according to actual process requirements, the above-mentioned first region and second region can be defined at any suitable position of the object to be annealed 100 , can have any suitable area or volume, and can also have any suitable positional relationship. The microwave power source system 30 can provide microwave energy at any suitable first time interval, and the laser heating source system 50 can also provide laser energy at any suitable second time interval.

For example, the first region of the present invention is not limited to partially overlap, completely overlap or not overlap with the second region, and the area or volume of the first region of the present invention is not limited to be greater than, equal to or smaller than the second region. For example, the first area may include the second area, or the second area may include the first area, or the first area may also be adjacent to the second area, or even the first area and the second area may be independently defined on the object to be annealed 100 . Moreover, the first time interval during which the microwave power source system 30 provides microwave energy may partially overlap, completely overlap or not overlap with the second time interval during which the laser heating source system 50 provides laser energy. For example, the first time interval may include the second time interval, or the second time interval may include the first time interval, or the first time interval and the second time interval are immediately adjacent to each other, or the first time interval and the second time interval The two time intervals may be independent. The length of the first time interval may also be, for example, greater than, less than or equal to the length of the second time interval.

To continue, for example, the present invention proposes an annealing system and annealing method that integrates laser and microwave, using microwave energy to perform microwave annealing on the first region of the object to be annealed to increase the temperature, and with laser The laser energy performs laser annealing on the second region in the first region. The present invention uses microwave energy to increase the temperature of the object to be annealed, thus helping to increase the laser energy absorption rate of the object to be annealed (semiconductor materials such as silicon or silicon carbide), so the present invention can reduce the cost of the laser annealing process The laser energy that needs to be provided may reduce the time required for the overall annealing. Conversely, the present invention can also use laser energy to increase the temperature of the object to be annealed, which helps the object to be annealed to absorb microwave energy. Moreover, the present invention provides microwave energy integrally for the non-second region and the second region, which can reduce the temperature difference (Thermal Shock ) to avoid cracks or defects due to large stress differences.

The above-mentioned first region is defined on part or all of the object to be annealed, and the above-mentioned second region is, for example, defined on part or all of the first region. The above-mentioned first region and second region are not limited to be located on a depth or a surface of the object to be annealed. Moreover, the area, volume, and positional relationship between the first region and the second region of the present invention are not limited to the examples described later, as long as the time required for the overall annealing can be reduced, the stress difference can be reduced, or the laser annealing process can be reduced. The laser energy, all belong to the scope of protection of the present invention. The above-mentioned object to be annealed can be, for example, any material suitable for annealing treatment, such as a substrate that has undergone modification treatment, separation treatment, ion implantation treatment, or other semiconductor manufacturing processes. This substrate can be, for example, a wafer or crystal ingot, etc. Semiconductor process materials, such as, but not limited to, substrate materials such as Si, SiC, SiGe, Ge, GaAs, GaN or InP. For example, the object to be annealed 100 is, for example, a silicon substrate that has completed ion implantation. Microwave annealing is used for the first region (surface source, gate), and for the second region (deep P or N well)) using laser annealing. Alternatively, after the substrate is stripped due to modification or external force, the modified area or the stripped surface (first area/second area) is annealed, and microwave and laser are used for annealing at the same time to achieve defect repair and lattice reset. Effect. In addition, the microwave power source system of the present invention is not limited to raising the temperature of the object to be annealed to a specific temperature. Any elevated temperature value can be applied to the this invention.

Please refer to FIG. 2 and FIG. 3 , the annealing system 10 of the present invention includes at least one microwave power source system 30 , a laser heating source system 50 and a measurement and control system 80 . As shown in step S10, a microwave annealing procedure is first carried out, wherein the microwave power source system 30 generates microwaves 33, and makes the microwaves 33 irradiate on the first region 110 of the object to be annealed 100, so as to use the microwave energy of the microwaves 33 to enhance the first region 110. The temperature of the first region 110 can achieve the effect of microwave annealing process. The object to be annealed 100 is, for example, carried on a carrier 150 , which is, for example, a mobile carrier, but is not limited thereto. The carrier can also be, for example, a fixed carrier. The microwave power source system 30 provides microwave energy with a first power, and the microwave energy is provided to the first region 110 along the first axis D1. As shown in step S20 , the laser heating source system 50 of the present invention generates a laser 54 and irradiates the second region 120 of the object to be annealed 100 with the laser. The microwave power source system 30 provides microwave energy at a first power. The laser heating source system 50 provides laser energy with the second power, and the laser energy is provided to the second region 120 along the second axis D2. The included angle between the first axis and the second axis ranges from about 0° to 180°. For example, the first axis can be, for example, parallel (like the direction or opposite direction) or perpendicular to the second axis. The output mode of the microwave power source system 30 can be a continuous microwave source or an intermittent microwave source with a pulse width ranging from about 1 μs to about 1 ms. The first time interval in which the microwave power source system 30 provides microwave energy to the first region 110 can cover the second time interval in which the laser heating source system 50 provides laser energy to the second region 120, that is, the second time interval is preferably completely Overlaps the first time interval. Alternatively, the second time interval during which the laser heating source system 50 provides laser energy to the second region 120 may cover the first time interval during which the microwave power source system 30 provides microwave energy to the first region 110 . However, this is just an example and not intended to limit the present invention, that is, the second time interval may also, for example, only partially overlap the first time interval, or even not completely overlap the first time interval. Any time correspondence relationship between the microwave energy provided by the microwave power source system 30 and the laser energy provided by the laser heating source system 50, as long as it can reduce the time required for the overall annealing, reduce the stress difference, or reduce the amount of energy required for the laser annealing process. Laser energy all belong to the scope of protection claimed by the present invention.

In the microwave power source system 30 of the present invention, the microwave wavelength ranges from about 1 mm to about 1 m, and the microwave frequency ranges from about 300 GHz to about 0.3 GHz. Microwave power ranges from about 200 watts to about 5,000 watts. The present invention belongs to industrial application, and its available frequency belongs to ISM frequency band (Industrial Scientific Medical Band). According to the ITU Radio Regulations, the microwave frequency ranges are: 433.05-434.79 MHz, 902-928 MHz, 2400-2483.5 MHz...etc. The present invention can use microwave frequencies of about 2400-2483.5 MHz, and even use frequencies that are not regulated by ITU Radio Regulations, such as 500 MHz or other frequencies that need to apply for a license. In the laser heating source system 50 of the present invention, the laser wavelength is, for example, about 150nm to about 1600nm, the range of moving speed is about 10 mm/s to about 1000 mm/s, the power range is about 10 mW to about 100 kW, the focus The diameter (spot size) ranges from about 1 μm to about 50 μm; the laser can be pulsed laser, its frequency can range from about 1 Hz to about 1 MHz, and the pulse width can range from about 100 fs to about 100 ns.

The measurement and control system 80 of the annealing system 10 of the present invention includes a temperature measurement device 82 , a power measurement device 84 and a control device 86 . As in step S30, the present invention further includes a measurement and control program, wherein the temperature measuring device 82 monitors a temperature value of the object to be annealed 100, and the power measuring device 84 measures at least the microwave power source system 30 and the laser heating source system 50. One of the power changes, wherein the control device 86 correspondingly adjusts the first power of the microwave power source system 30 to provide microwave energy and/or adjusts the laser heating source system 50 to provide laser energy according to the above-mentioned temperature value and power change the second power. For example, the present invention can increase the first power of the microwave power source system 30 or reduce the first power of the microwave power source system 30 according to the monitored temperature value of the object to be annealed 100 and the power change of the microwave power source system 30 and/or the laser heating source system 50. Radiate the second power of the heat source system 50. It can be seen that the present invention can reduce the time required for the overall annealing, or can reduce the laser energy required for the laser annealing process.

The temperature measuring device 82 is, for example, an optical pyrometer, such as an infrared pyrometer, which is preferably used to monitor the temperature of the object to be annealed 100 in real time. The control device 86 is, for example, a computer, and the control device 86 receives the monitoring signal of the temperature measuring device 82 and the power change measured by the power measuring device 84, so as to control the microwave power source system 30 and the laser heating source system 50, such as raising the microwave The first power of the power source system 30, or the second power of the laser heating source system 50 is reduced. The power measurement device 84 further includes, for example, a directional coupler (Directional Coupler) 84a and a power meter (Power Meter) 84b. The directional coupler 84a is used to detect input and reflected microwave/laser signals, and the detected signals are sent to the power meter. A meter 84b is used to monitor the coupling of microwave/laser and the object 100 to be annealed. That is, the directional coupler 84a can be used to detect the forward signal of the microwave provided by the microwave power source system 30 and the reflected signal from the object to be annealed 100, and/or detect the forward signal of the laser provided by the laser heating source system 50 And the reflected signal from the object 100 to be annealed. Then, the directional coupler 84a sends the detected signals to the power meter 84b for real-time monitoring of coupling changes (such as power changes) between the microwave and/or laser and the object to be annealed 100 . In this way, the control device 86 can receive the power change data and generate an adjustment command accordingly in real time according to the above power change, so as to control the operation of at least one of the microwave power source system 30 and the laser heating source system 50 . In addition, the measurement and control system 80 of the present invention may optionally include, for example, a monitor electrically connected to the control device 86, so as to display the monitoring results of each component of the measurement and control system 80 in real time, for example, all microwave, laser and temperature data can be input into the computer for recording and processed and displayed on the monitor immediately.

Please refer to FIG. 1 to FIG. 4 . FIG. 4 is a structural schematic view of microwave energy and laser energy supplied to the object to be annealed from opposite sides in the annealing system according to the first embodiment of the present invention. In the first embodiment, the microwave power source system 30 provides microwave energy to the object to be annealed 100 in the first region 110 in an integrated manner, and the laser heating source system 50 provides laser energy to the objects in the second region 120 in a scanning manner. 150 objects to be annealed. In the first embodiment, the first region 110 includes the second region 120 , that is, the area and volume of the first region 110 are larger than the second region 120 . Moreover, in the first embodiment, the first time interval during which the microwave power source system 30 provides microwave energy to the first region 110 may cover the second time interval during which the laser heating source system 50 provides laser energy to the second region 120, That is, the second time interval completely overlaps the first time interval. Wherein, the microwave energy is supplied to the first region 110 of the object to be annealed from the first axis D1 (from bottom to top as shown in FIG. 4 ), and the laser energy is supplied from the second axis D2 (as shown in FIG. 4 ). (shown from top to bottom) is provided on the second region 120 of the object to be annealed, and the first axis D1 is overlapped with the second axis D2. The annealing system 10 of the present invention includes a microwave power source system 30 , a laser heating source system 50 and a measurement and control system 80 . The microwave power source system 30 includes at least one microwave generator 32 and a resonant cavity 34. The microwave generator 32 is, for example, a magnetron for generating the microwave 33 mentioned above. The resonant cavity 34 is, for example, a coaxial resonant cavity. For example, the resonant cavity 34 is, for example, a TE ₁₀ mode resonant cavity, and its interior can be a hollow or solid waveguide element, which can be adjusted depending on the actual use, as long as it can guide the microwave and make the microwave resonate therein. applicable to the present invention. The microwaves generated by the microwave generator 32 are transmitted to the resonant cavity 34, for example, guided by the metal rod 31, and the resonant cavity 34 guides the microwaves generated by the microwave generator 32 to the first region 110 of the object to be annealed 100, The first region 110 of the object to be annealed 100 is heated integrally to increase its temperature. The microwave power source system 30 also optionally includes, for example, an isolator (Isolator) 36 and a matcher 38 disposed between the microwave generator 32 and the resonant cavity 34 . The microwave power source system 30 generates microwaves 33 by a microwave generator 32 (such as a magnetron), and transmits them to the first region 110 of the object to be annealed 100 through the guidance of a resonant cavity (Coaxial Resonator) 34, thereby performing Microwave annealing procedure. Wherein, the microwave transmission path (such as the resonant cavity 34) is preferably also provided with a matching device 38, which can reduce the amount of microwave reflection, so that the microwave can effectively enter the resonant cavity 34, so as to follow the cavity in the resonant cavity 34 ( such as a ring columnar chamber) is transferred to the object to be annealed 100 . Wherein, the axis of the resonant cavity 34 is not limited to a hollow or solid structure, as long as it can guide microwaves, it is suitable for use in the present invention. The adapter 38 is, for example, composed of a coaxial tube 38a, a metal plate 38b and a metal rod 38c. The isolator 36 is preferably disposed between the microwave generator 32 and the resonant cavity 34 , which can provide the effect of one-way transmission of microwaves, and the isolator 36 is preferably disposed between the microwave generator 32 and the matching device 38 . However, the components and configurations of the above-mentioned microwave power source system 30 are only an example, and are not intended to limit the present invention. The microwave power source system 30 can be any form of microwave source, as long as it can provide microwaves, it belongs to the claimed protection of the present invention. scope.

In the annealing system of the first embodiment, the laser heating source system 50 generates a laser 54 by the laser generator 52, the laser 54 is a kind of pulsed light, and the laser 54 is transmitted through the lens group 56 onto the second region 120 of the object to be annealed 100 . The present invention can use the mobile stage to move the object to be annealed 100 horizontally (as shown by the horizontal double arrow C1 in FIG. 4 ) or the laser generator 52 to horizontally move the pulsed light (as shown by the horizontal double arrow L1 in FIG. 4 ), so that the pulsed light scans horizontally to irradiate the second region 120 of the object to be annealed 100 . In addition, the present invention can also vertically move the object 100 to be annealed by using a mobile stage (that is, the laser generator 52 is fixed longitudinally, and the stage is movable longitudinally, as shown by the vertical double arrow C2 on the right side of FIG. 4 ) or It is the laser generator 52 that moves the pulsed light vertically (that is, the laser generator 52 is movable longitudinally, and the stage is fixed longitudinally, as shown by the vertical double arrow L2 in FIG. The second region 120 of the annealed object 100 . In other words, the present invention can selectively adjust the depth of the focus point of the pulsed light generated by the laser generator 52 to irradiate the object 100 to be annealed according to the form (such as the shape) of the object to be annealed 100 during the annealing process, so as to achieve Better annealing effect.

Based on the above, the second area 120 can be selectively located on part or all of the first area 110, depending on actual needs. The laser 54 generated by the laser generator 52 can, for example, scan along the direction of the radial section (Radial Section) or the direction of the axial section (Axial Section) to provide energy to the second region 120 of the object to be annealed 100, wherein the laser 54 can also be scanned along the direction of the radial section or the axial section, and the scanning path is not particularly limited, as long as it can provide laser energy to the second region 120 of the object to be annealed 100, it can be applied to the present invention . Moreover, since the second region 120 is located in the first region 110, and the present invention has raised the temperature of the first region 110 (including the second region 120) by the microwave energy provided by the microwave power source system 30, it contributes to The laser energy absorptivity of the object to be annealed 100 in the second region 120 is increased, so the present invention can reduce the required laser energy for the laser annealing process, or can reduce the time required for the overall annealing. Moreover, the present invention provides integrated microwave energy for the first region 110 and the second region 120, which can reduce the temperature between the second region 120 (ie, the laser annealing area) and the non-second area (ie, the non-laser annealing area). Poor to avoid cracks or defects due to large stress differences.

In addition, the annealing system 10 of the present invention can optionally be provided with a microwave absorbing (Microwave Absorbing) element 70, and the microwave absorbing element 70 and the microwave power source system 30 (such as the microwave generator 32) are located on the opposite side of the object to be annealed 100, which The purpose is to reduce the reflection of microwaves from the other side, avoid unnecessary scattering, and improve the uniformity of microwave absorption. If the microwave absorbing element 70 is located between the laser heating source system 50 and the object to be annealed 100, the microwave absorbing element 70 may be provided with perforations according to actual conditions for the lens group 56 or the laser to penetrate. The microwave absorbing element 70 can be a microwave absorbing element layer composed of any microwave absorbing material, as long as it can provide the effect of absorbing microwaves, it all belongs to the protection scope of the present invention.

Please refer to FIG. 1 , FIG. 2 and FIG. 5 . FIG. 5 is a schematic diagram of the structure of the annealing system in which microwave energy and laser energy are provided from the same side to the object to be annealed in the second embodiment of the present invention. The difference between the second embodiment and the first embodiment is that the microwave energy and the laser energy of the second embodiment are provided to the object to be annealed 100 from the same direction of the first axis, and the laser heating source system 50 produces The laser 54 is coaxial with the microwave 33 provided by the microwave power source system 30 . For example, the microwave 33 passes through the resonant cavity 34 along the first axis D1 (from top to bottom as shown in FIG. The second axis D2 (same as the first axis D1 from top to bottom as shown in FIG. 5 ) passes through the resonant cavity 34 and is transmitted to the second region 120 of the object to be annealed 100 . For example, the lens group 56 of the laser heating source system 50 is coaxially arranged on the resonant cavity 34 of the microwave power source system 30. The lens group 56 is preferably located on the axis of the resonant cavity 34, and is not limited to being located at the resonant cavity. The outside of the cavity 34 or penetrates into it (as shown in FIG. 5 ), so the resonant cavity 34 is not limited to transparent or opaque material, as long as it can allow the laser to irradiate to the second region 120 of the object to be annealed 100, all belong to this invention. The scope of protection claimed for the invention.

Please refer to FIG. 1 , FIG. 2 and FIG. 6 . FIG. 6 is a schematic diagram of the structure of the annealing system in which microwave energy and laser energy are provided from the vertical side to the object to be annealed in the third embodiment of the present invention. The difference between the third embodiment and other embodiments is that the design of the microwave power source system 30 is different, and wherein the microwave energy is provided from the first axis D1 (from right to left as shown in FIG. 6 ) to the first annealing object. On a region 110, the laser energy is provided from the second axis D2 (from top to bottom as shown in FIG. 6 ) to the second region 120 of the object to be annealed, and the first axis D1 is perpendicular to the second Axial D2. The microwave power source system 30 of the third embodiment includes at least one microwave generator 32 and a resonant cavity 34 arranged coaxially. The microwave power source system 30 also optionally includes the above-mentioned isolator 36 disposed between the microwave generator 32 and the resonant cavity 34 , which can provide the effects of one-way transmission of microwaves and absorption of reflected microwaves. In addition, the microwave power source system 30 can also optionally include the above-mentioned matching device (not shown) located between the microwave generator 32 and the resonant cavity 34, and preferably between the isolator 36 and the resonant cavity 34, which The amount of microwave reflection can be reduced, so that the microwave can effectively enter the resonant cavity 34 so as to be transmitted to the object to be annealed 100 . The resonant cavity 34 of the third embodiment has an opening 35 more selectively, so that the carrier 150 can use the opening 35 to send the first region 110 to be processed on the object to be annealed 100 into the resonant cavity 34, or in the resonant cavity 34 Move position. In this way, the resonant cavity 34 can also be used as a microwave reaction cavity at the same time, so that microwave annealing can be performed in the resonant cavity 34 . The lens group 56 of the laser heating source system 50 is arranged on the resonant cavity 34 of the microwave power source system 30. The lens group 56 can be located on the resonant cavity 34, and is not limited to being located outside the resonant cavity 34 or penetrating into it. Therefore, the resonant cavity 34 can be made of transparent or opaque material, or the resonant cavity 34 can also have a hole to allow the laser to pass through, as long as the laser can be irradiated from the second axis D2 to the second region 120 of the object to be annealed 100, all belong to the The scope of protection claimed by the present invention.

Please refer to FIG. 1 , FIG. 2 , FIG. 7 and FIG. 8 . FIG. 7 is a schematic diagram of the structure of microwave energy and laser energy supplied to the object to be annealed from the vertical side in the annealing system of the fourth embodiment of the present invention. FIG. 8 is a schematic diagram obtained from another viewing angle of FIG. 7 . The difference between the fourth embodiment of the present invention and the third embodiment is that the microwave power source system 30 of the fourth embodiment has dual microwave generators (i.e. two microwave generators 32), wherein the dual microwave generators generate dual microwave And the two opposite directions of the resonant cavity 34 are respectively introduced into the resonant cavity 34, so as to guide the double microwaves to the first region 110 of the object to be annealed 100, so that the first region 110 of the object to be annealed 100 is evenly heated.

In the above-mentioned embodiments, the carrier 150 of the present invention, for example, has a carrier base 160 for carrying the object to be annealed 100 . The bearing base 160 is not limited to a specific material, it can be made of any suitable material, and the shape of the bearing base 160 is not particularly limited, it can be a plate shape, a groove shape or a box shape, as long as it can carry the object to be annealed 100, can be applicable to the present invention. For example, the carrying base 160 may be made of a microwave absorbing material, and allow more than 50% of the microwave to penetrate to heat the object to be annealed 100 . Porosity and sintered silicon carbide with a porosity of 20% to 30% is a suitable material for the supporting base 160. The porous silicon carbide manufactured by sintering has a greater penetration depth and can reach the above-mentioned supporting base 160. function, at the same time it can be heated and cooled many times without cracking, and has a long service life. In addition, graphite can also be used as the material of the supporting base 160 . Taking the silicon carbide wafer as an example of the object to be annealed 100, since the thickness of the silicon carbide wafer is very thin, if it is directly exposed to microwaves, it is easy to generate a high electric field intensity distribution at its edge, which will cause overheating and even tip discharge. Therefore, the supporting base 160 can cover the edge of the silicon carbide wafer to be annealed, so as to prevent the edge of the silicon carbide wafer from overheating. For example, the carrying base 160 includes a base and an upper cover, wherein the upper cover is detachably covered on the base so as to surround the chamber, and the object to be annealed 100 is detachably positioned on the base and the upper cover surrounded by it. In the containment room. Although the carrying base 160 is used for illustration above, it is not intended to limit the present invention. As long as the carrying base 160 can place the object to be annealed 100, it belongs to the protection scope of the present invention.

In addition, in each of the above-mentioned preferred embodiments, as shown in FIG. 9 , the annealing device of the present invention may further include, for example, a heat source for heating the object to be annealed 100 when performing the above-mentioned annealing procedure. Wherein, the heat source is, for example, a laser heating source system 50 , a microwave power source system 30 , a heating liquid tank 90 , another laser heating source system and/or an infrared light source. Taking the heat source as the heating liquid tank 90 as an example, there is a liquid 92 in the heating liquid tank 90 so that the object to be annealed 100 is immersed in the liquid 92 . The heating liquid tank 90 can be, for example, a hot oil tank and has an oil, preferably a hot oil, more preferably a high temperature resistant oil, such as fluorine oil, and in all or some steps of the above-mentioned annealing procedure, the object to be annealed 100 can be soaked in oil, which can reduce unnecessary cracks or crack expansion caused by thermal shock, and can increase thermal uniformity. In addition, the heating liquid tank 90 is not limited to the above-mentioned oil, and can also be selected according to requirements. The liquid is placed in the tank as a heat source.

In summary, the annealing system and annealing method integrating laser and microwave of the present invention have the following advantages:

(1) The present invention uses microwave energy and laser energy to carry out a synergistic annealing procedure, which helps to combine the advantages of microwave annealing and laser annealing.

(2) Using microwave energy to increase the temperature of the annealed object helps to increase the laser energy absorption rate of the annealed object, so it can reduce the laser energy required for the laser annealing process, or reduce the overall annealing time required.

(3) By using microwave energy to increase the temperature of the second area and other areas (not the second area) of the object to be annealed, the temperature difference between the two areas (Thermal Shock) can be reduced to avoid cracks or cracks caused by large stress differences. defect.

(4) The present invention uses microwave energy to anneal the whole object to be annealed, which can avoid defects caused by large temperature gradients, and can also solve the problem of excessive diffusion of implanted ions.

(5) The present invention uses microwave energy to anneal the entire object to be annealed, and selects a specific laser wavelength corresponding to the annealing target, and can selectively perform laser annealing on a specific depth area.

The above descriptions are illustrative only, not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the appended patent application.

10: Annealing system 30:Microwave power source system 31: metal rod 32:Microwave generator 33: microwave 34: Resonant cavity 35: opening 36: Isolator 38: Matcher 38a: coaxial tube 38b: metal plate 38c: metal rod 50:Laser heating source system 52:Laser generator 54:Laser 56: Lens group 70:Microwave absorbing element 80:Measurement and control system 82:Temperature measuring device 84: Power measurement device 84a: Directional coupler 84b:Power meter 86: Control device 90: Heated liquid tank 92: liquid 100: object to be annealed 110: The first area 120: Second area 150: carrier 160: carrying base L1: horizontal double arrow L2: vertical double arrow C1: Horizontal double arrow C2: vertical double arrow S10: Perform microwave annealing procedure S20: Perform laser annealing procedure S30: Carry out measurement and control program D1: the first axis D2: second axis

FIG. 1 is a schematic diagram of the operation of the integrated laser and microwave annealing method of the present invention.

FIG. 2 is a flowchart of the operation of the integrated laser and microwave annealing system of the present invention.

FIG. 3 is a system schematic diagram of an annealing system integrating laser and microwave according to the present invention.

FIG. 4 is a schematic structural view of the annealing system of the first embodiment of the present invention.

FIG. 5 is a schematic structural view of an annealing system according to a second embodiment of the present invention.

FIG. 6 is a schematic structural view of an annealing system according to a third embodiment of the present invention.

FIG. 7 is a schematic structural view of an annealing system according to a fourth embodiment of the present invention.

FIG. 8 is a schematic diagram obtained from another viewing angle of FIG. 7 .

Fig. 9 is a schematic diagram of the annealing device of the present invention performing annealing in a heat source.

10: Annealing system

30:Microwave power source system

50:Laser heating source system

80:Measurement and control system

82:Temperature measuring device

84: Power measurement device

84a: Directional coupler

84b:Power meter

86: Control device

100: object to be annealed

Claims (26)

An annealing system integrating laser and microwave, including: A microwave power source system that provides a microwave energy to a first region of an object to be annealed, thereby annealing the first region of the object to be annealed; A laser heating source system, which provides a laser energy to a second region of the object to be annealed, thereby annealing the second region of the object to be annealed; and A measurement and control system, the measurement and control system includes a temperature measurement device, a power measurement device and a control device, the temperature measurement device monitors a temperature value of the object to be annealed, the power measurement device measures the microwave power A power change of at least one of the microwave energy provided by the source system and the laser heating source system provided by the laser energy, wherein the control device adjusts the microwave power source system to provide the microwave power correspondingly according to the temperature value and the power change A first power of microwave energy and/or adjusting the laser heating source system to provide a second power of laser energy. The integrated laser and microwave annealing system as claimed in claim 1, wherein the first region includes the second region. The integrated laser and microwave annealing system as described in Claim 1, wherein the microwave power source system provides the microwave energy to the first region of the object to be annealed integrally, and the laser heating source system provides scanning The laser energy is given to the second region of the object to be annealed. The integrated laser and microwave annealing system as described in claim 1, 2 or 3, wherein the microwave power source system provides the microwave energy to the first region for a first time interval covering the laser heating source system The laser energy is given to a second time interval in the second area. The integrated laser and microwave annealing system as described in claim 1, 2 or 3, wherein the laser heating source system provides the laser energy to the second region for a second time interval covering the microwave power source system The microwave energy is provided to the first region for a first time interval. The integrated laser and microwave annealing system as described in Claim 1, wherein the microwave energy provided by the microwave power source system is provided to the first region along a first axis, and the laser heating source system is provided The laser energy provided is provided to the second region along a second axis, and the included angle between the first axis and the second axis ranges from 0° to 180°. An annealing system integrating laser and microwave as described in Claim 1, wherein the laser heating source system includes a laser generator and a lens group, the laser generator generates a laser, and the lens group will The laser is directed onto the second region of the object to be annealed. An annealing system integrating laser and microwave as described in Claim 7, wherein the microwave power source system includes at least one microwave generator and a resonant cavity, the microwave generator generates a microwave, and the resonant cavity is the microwave directed onto the first region of the object to be annealed. The integrated laser and microwave annealing system as described in Claim 6, wherein the microwave power source system and the laser heating source system respectively provide the microwave energy and the laser energy from opposite sides of the object to be annealed. The integrated laser and microwave annealing system as described in Claim 6, wherein the microwave power source system and the laser heating source system respectively provide the microwave energy and the laser energy from the same side of the object to be annealed. The integrated laser and microwave annealing system as described in Claim 8, wherein the lens group of the laser heating source system is coaxially arranged on the resonant cavity of the microwave power source system, so as to guide the laser onto the second region of the object to be annealed. The integrated laser and microwave annealing system as described in Claim 6, wherein the microwave power source system and the laser heating source system respectively provide the microwave energy and the laser energy to the object from the vertical side of the object to be annealed to be annealed. An annealing system integrating laser and microwave as described in Claim 6, wherein the microwave power source system includes two microwave generators and a resonant cavity, the two microwave generators generate two microwaves, and the resonant cavity is obtained from the first Two opposite axial directions guide the two microwaves to the first region of the object to be annealed respectively. The integrated laser and microwave annealing system as described in claim 6, 9, 10, 12 or 13 further comprises a microwave absorbing element, the microwave absorbing element and the microwave power source system are located on opposite sides of the object to be annealed . The annealing system integrating laser and microwave as described in claim 8 or 13, wherein the resonant cavity of the microwave power source system runs through an opening, and the object to be annealed is moved in the resonant cavity through the opening to receive the microwave energy. The integrated laser and microwave annealing system as described in Claim 1, wherein the power measurement device measures the microwave power source system provides the microwave energy with a microwave and the laser heating source system provides the microwave energy with a laser A forward signal and/or a reflected signal of the at least one of laser energy to obtain the power variation. The integrated laser and microwave annealing system as described in Claim 1, wherein the power measuring device includes measuring at least one of a forward signal and a reflected signal of the microwave energy provided by the microwave power source system and The laser heating source system uses a laser to provide at least one of a forward signal and a reflected signal of the laser energy. The integrated laser and microwave annealing system as described in claim 8 or 13, wherein the microwave power source system further includes an isolator and a matching device arranged between the microwave generator and the resonant cavity. The integrated laser and microwave annealing system as described in claim 1, wherein the first region or the second region is located in a depth or on a surface of the object to be annealed. An annealing method integrating laser and microwave, comprising: performing a microwave annealing procedure whereby a first region of an object to be annealed is annealed with a microwave energy using a microwave power source system; performing a laser annealing process, whereby a laser heating source system is used to provide a laser energy to a second region of the object to be annealed; and Carrying out a measurement and control program, which is to measure and depend on a power change of at least one of the temperature value of the object to be annealed, the microwave energy provided by the microwave power source system, and the laser energy provided by the laser heating source system, Thereby correspondingly adjusting the microwave power source system to provide the first power of the microwave energy and/or the laser heating source system to provide the second power of the laser energy. The integrated laser and microwave annealing method as claimed in claim 20, wherein the first region includes the second region. The integrated laser and microwave annealing method as described in Claim 20, wherein the microwave power source system provides the microwave energy to the first region of the object to be annealed in an integrated manner, and the laser heating source system provides scanning The laser energy is given to the second region of the object to be annealed. The annealing method integrating laser and microwave as described in claim 20, 21 or 22, wherein the microwave power source system provides the microwave energy to the first region for a first time interval covering the laser heating source system provided The laser energy is given to a second time interval in the second area. The integrated laser and microwave annealing method as described in claim 20, 21 or 22, wherein the laser heating source system provides the laser energy to the second region for a second time interval covering the microwave power source system The microwave energy is provided to the first region for a first time interval. The integrated laser and microwave annealing method as described in claim 20, wherein the microwave power source system provides the microwave energy to the first region along a first axis, and the laser heating source system is along a The second axis provides the laser energy to the second region, and the angle between the first axis and the second axis ranges from 0° to 180°. The integrated laser and microwave annealing method as described in claim 25, wherein the microwave power source system provides the microwave energy to the first region from two opposite directions of the first axis.

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