TW202242911A - electrode - Google Patents
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Abstract
Description
本發明係關於一種電極。The present invention relates to an electrode.
已知有一種具備分散有金奈米粒子之導電性碳層之電極(參照下述專利文獻1)。專利文獻1中揭示有導電性碳層中之金奈米粒子之含量為10原子%~22原子%。又,專利文獻1之實施例2中,金奈米粒子之含量為17原子%。又,實施例2之導電性碳層中,sp
3鍵結原子相對於sp
3鍵結原子與sp
2鍵結原子之合計之比率(sp
3/(sp
3+sp
2))較低,為0.20。
[先前技術文獻]
[專利文獻]
An electrode having a conductive carbon layer in which gold nanoparticles are dispersed is known (see
[專利文獻1]日本專利特開2016-065815號[Patent Document 1] Japanese Patent Laid-Open No. 2016-065815
[發明所欲解決之問題][Problem to be solved by the invention]
於上述之sp
3鍵結原子之比率(sp
3/(sp
3+sp
2))相對較低為0.20之情形時,如專利文獻1中所揭示般,只要金奈米粒子之含量為10原子%以上,則能夠獲得較強之訊號強度。
In the case where the ratio of sp 3 bonded atoms (sp 3 /(sp 3 +sp 2 )) is relatively low at 0.20, as disclosed in
另一面,若電極之測定對象之濃度較低,則能夠獲得較低之訊號強度,因此要求較高之信噪比(S/N比)。On the other hand, if the concentration of the measurement object of the electrode is low, a low signal strength can be obtained, so a high signal-to-noise ratio (S/N ratio) is required.
但是,專利文獻1中所記載之電極中,存在無法獲得上述之較高之信噪比之異常。However, in the electrode described in
本發明提供一種具有較高之信噪比之電極。 [解決問題之技術手段] The invention provides an electrode with a higher signal-to-noise ratio. [Technical means to solve the problem]
因此,本案發明人等發現只要sp 3鍵結原子之比率(sp 3/(sp 3+sp 2))為0.25以上之較高之比率,則令人驚訝的是藉由使金奈米粒子之含有比率低至未達10原子%,便能夠獲得較高之信噪比,從而完成了本發明。 Therefore, the inventors of the present invention found that as long as the ratio of sp 3 bonded atoms (sp 3 /(sp 3 +sp 2 )) is a high ratio of 0.25 or more, it is surprising that by making gold nanoparticles contain When the ratio is as low as less than 10 atomic %, a higher signal-to-noise ratio can be obtained, thus completing the present invention.
本發明(1)包括一種電極,其朝向厚度方向之一側依序具備基材、及導電性碳層,上述導電性碳層含有未達10原子%之分散於上述導電性碳層中之金奈米粒子,上述導電性碳層包含sp 3鍵結原子、及sp 2鍵結原子,sp 3鍵結原子相對於sp 3鍵結原子與sp 2鍵結原子之合計之比率(sp 3/(sp 3+sp 2))為0.25以上。 The present invention (1) includes an electrode comprising a base material and a conductive carbon layer sequentially facing one side in the thickness direction, and the conductive carbon layer contains gold dispersed in the conductive carbon layer of less than 10 atomic %. In the nanoparticle, the above-mentioned conductive carbon layer includes sp 3 bonded atoms and sp 2 bonded atoms, and the ratio of sp 3 bonded atoms to the total of sp 3 bonded atoms and sp 2 bonded atoms (sp 3 /( sp 3 +sp 2 )) is 0.25 or more.
本發明(2)包括如(1)中所記載之電極,其中上述導電性碳層中之上述金奈米粒子之含有比率未達5原子%。 [發明之效果] The present invention (2) includes the electrode described in (1), wherein the content ratio of the gold nanoparticles in the conductive carbon layer is less than 5 atomic %. [Effect of Invention]
本發明之電極可獲得較高之信噪比。The electrode of the present invention can obtain a higher signal-to-noise ratio.
<一實施方式> 參照圖1,對本發明之電極之一實施方式進行說明。 <An embodiment> One embodiment of the electrode of the present invention will be described with reference to FIG. 1 .
<電極1>
如圖1所示,電極1在與厚度方向正交之面方向上延伸。電極1具有厚度方向上之一面、及在厚度方向上之與一面隔開間隔之另一面。
<
電極1具備基材2、及配置於基材2之厚度方向上之一面之導電性碳層3。即,電極1中,朝向厚度方向之一側依序具備基材2、及導電性碳層3。較佳為電極1僅具備基材2、及導電性碳層3。The
<基材2>
基材2形成電極1之厚度方向上之另一面。作為基材2,例如可例舉:無機基材、及有機基材。作為無機基材,例如可例舉:矽、及玻璃。作為有機基材,例如可例舉聚對苯二甲酸乙二酯。作為基材2之材料,亦可較佳地使用其他公知之材料。基於電極活性之觀點而言,較佳為可例舉無機基材,更佳為可例舉矽。於基材2之材料為矽之情形時,例如準備矽晶圓作為基材2。
<
基材2之厚度並無限定。基材2之厚度例如為0.1 μm以上,較佳為0.5 μm以上,更佳為1 μm以上;又,例如為1000 μm以下,較佳為500 μm,更佳為100 μm以下。The thickness of the
<導電性碳層3>
導電性碳層3形成電極1之厚度方向上之一面。導電性碳層3具有導電性。導電性碳層3與基材2之厚度方向上之一面接觸。
<Conductive carbon layer 3>
The conductive carbon layer 3 forms one surface of the
導電性碳層3含有複數個金奈米粒子5。複數個金奈米粒子5分散於導電性碳層3中。具體而言,導電性碳層3例如含有碳矩陣4、及複數個金奈米粒子5。The conductive carbon layer 3 contains a plurality of
碳矩陣4係導電性碳層3之主要部分。The
碳矩陣4含有具有sp
2鍵之碳及具有sp
3鍵之碳。即,碳矩陣4係具有石墨型結構及金剛石型結構之微晶晶疇。藉此,導電性碳層3具備良好之導電性,同時具備化學穩定之結構與較低之背景雜訊。其結果為,充分地提高對於測定對象之感度。
The
導電性碳層3中,sp 3鍵結原子數相對於sp 3鍵結原子數與sp 2鍵結原子數之和之比率(sp 3/(sp 3+sp 2))為0.25以上。 In the conductive carbon layer 3 , the ratio of the number of sp 3 bonded atoms to the sum of the number of sp 3 bonded atoms and the number of sp 2 bonded atoms (sp 3 /(sp 3 +sp 2 )) is 0.25 or more.
導電性碳層3中,只要sp 3鍵結原子數相對於sp 3鍵結原子數與sp 2鍵結原子數之和之比率(sp 3/(sp 3+sp 2))未達0.25,則信噪比變低。 In the conductive carbon layer 3, as long as the ratio of the number of sp 3 bonded atoms to the sum of the number of sp 3 bonded atoms and the number of sp 2 bonded atoms (sp 3 /(sp 3 +sp 2 )) does not reach 0.25, the The noise ratio becomes lower.
導電性碳層3中,sp 3鍵結原子數相對於sp 3鍵結原子數與sp 2鍵結原子數之和之比率(sp 3/(sp 3+sp 2))較佳為0.30以上,更佳為0.35以上,再較佳為0.40以上。 In the conductive carbon layer 3, the ratio of the number of sp 3 bonded atoms to the sum of the number of sp 3 bonded atoms and the number of sp 2 bonded atoms (sp 3 /(sp 3 +sp 2 )) is preferably 0.30 or more, more preferably It is preferably at least 0.35, and more preferably at least 0.40.
導電性碳層3中,sp 3鍵結原子數相對於sp 3鍵結原子數與sp 2鍵結原子數之和之比率(sp 3/(sp 3+sp 2))較佳為0.95以下,更佳為0.90以下,再較佳為0.75以下,尤其較佳為0.60以下。只要sp 3鍵結原子數之比率(sp 3/(sp 3+sp 2))為上述之上限以下,則可確保導電性碳層3中之優異之導電性。 In the conductive carbon layer 3, the ratio of the number of sp 3 bonded atoms to the sum of the number of sp 3 bonded atoms and the number of sp 2 bonded atoms (sp 3 /(sp 3 +sp 2 )) is preferably 0.95 or less, more preferably Preferably it is 0.90 or less, more preferably 0.75 or less, especially preferably 0.60 or less. As long as the ratio (sp 3 /(sp 3 +sp 2 )) of the number of sp 3 bonding atoms is not more than the above-mentioned upper limit, excellent conductivity in the conductive carbon layer 3 can be ensured.
sp 3鍵結原子數之比率(sp 3/(sp 3+sp 2))之測定方法記載於後述之實施例中。 The method of measuring the ratio (sp 3 /(sp 3 + sp 2 )) of the number of sp 3 bonded atoms is described in Examples described later.
再者,碳矩陣4中容許混入微量之不可避免之雜質。作為不可避免之雜質,例如可例舉:氧、氬、及氮。Furthermore, a small amount of unavoidable impurities are allowed to be mixed into the
金奈米粒子5均勻地分散於碳矩陣4中。金奈米粒子5之中值粒徑例如為0.1 nm以上,較佳為1 nm以上;且例如為20 nm以下,較佳為10 nm以下。
複數個金奈米粒子5之一部分自碳矩陣4之厚度方向上之一面露出。於本實施方式中,導電性碳層3中,露出之金奈米粒子5之前端部(一端緣)位於厚度方向之最外側。Parts of the plurality of
導電性碳層3中之金奈米粒子5之含有比率未達10原子%。The content rate of the
導電性碳層3中,於sp
3鍵結原子數之比率(sp
3/(sp
3+sp
2))為0.25以上之情形時,導電性碳層3中之導電性碳層3中之金奈米粒子5之含有比率只要為10原子%以上,則信噪比變低。
In the conductive carbon layer 3, when the ratio of the number of sp 3 bonding atoms (sp 3 /(sp 3 + sp 2 )) is 0.25 or more, the chennai in the conductive carbon layer 3 If the content rate of the
導電性碳層3中之金奈米粒子5之含有比率較佳為9原子%以下,更佳為7原子%以下,再較佳為6原子%以下,尤其較佳為5原子%以下;進而較合適為未達5原子%,進而較合適為4原子%以下,且進而較合適為3原子%以下。The content ratio of the
導電性碳層3中之金奈米粒子5之含有比率之下限並無限定。導電性碳層3中之金奈米粒子5之含有比率例如超過0原子%,較佳為0.1原子%以上,更佳為0.5原子%以上,再較佳為1原子%以上,尤其較佳為2原子%以上。The lower limit of the content ratio of the
導電性碳層3中之金奈米粒子5之含有比率記載於後述之實施例中。The content ratio of the
導電性碳層3之厚度例如為0.1 nm以上,較佳為0.2 nm以上;又,為100 nm以下,較佳為50 nm以下。The thickness of the conductive carbon layer 3 is, for example, not less than 0.1 nm, preferably not less than 0.2 nm; and not more than 100 nm, preferably not more than 50 nm.
導電性碳層3之厚度方向上之一面中之表面電阻Rs例如為電極1.0×10 4Ω/□以下,較佳為1.0×10 3Ω/□以下。 The surface resistance Rs of one surface in the thickness direction of the conductive carbon layer 3 is, for example, 1.0×10 4 Ω/□ or less, preferably 1.0×10 3 Ω/□ or less.
電極1之厚度係基材2及導電性碳層3之總厚度,具體而言,例如為0.1 μm以上,較佳為0.5 μm以上,更佳為1 μm以上;又,例如為1000 μm以下,較佳為500 μm以下,更佳為100 μm以下。The thickness of the
<電極1之製造方法>
接著,對電極1之製造方法進行說明。
<Manufacturing method of
首先,在該方法中,準備基材2。First, in this method, a
接下來,在基材2之厚度方向一面形成導電性碳層3。作為導電性碳層3之形成方法,例如可例舉乾式方法。作為乾式方法,例如可例舉:PVD法(物理蒸鍍法)、及CVD法(化學蒸鍍法)。作為乾式方法,較佳為可例舉PVD法。作為PVD法,例如可例舉:濺鍍、真空蒸鍍、雷射蒸鍍、及離子鍍覆(電弧蒸鍍)。
較佳為可例舉濺鍍。
Next, a conductive carbon layer 3 is formed on one side of the
作為濺鍍,例如可例舉:非平衡磁控濺鍍(UBM濺鍍)、高功率脈衝濺鍍、電子迴旋共振濺鍍、RF(Radio Frequency,射頻)濺鍍、DC(Direct Current,直流)濺鍍(DC磁控濺鍍)、DC脈衝濺鍍、及離子束濺鍍。更佳為可例舉UBM濺鍍。As sputtering, for example, unbalanced magnetron sputtering (UBM sputtering), high-power pulse sputtering, electron cyclotron resonance sputtering, RF (Radio Frequency, radio frequency) sputtering, DC (Direct Current, direct current) Sputtering (DC magnetron sputtering), DC pulse sputtering, and ion beam sputtering. More preferably, UBM sputtering may be mentioned.
作為實施濺鍍時之靶,例如可例舉:燒結碳及金。濺鍍裝置中具備靶。2個靶設置於濺鍍裝置中。又,濺鍍裝置例如具備成膜構件。作為成膜構件,例如可例舉:成膜板(成膜基板)、及成膜輥。成膜構件與靶係隔開間隔地對向配置。靶及成膜構件分別能夠施加所需之電力及電壓。電力及電壓係根據金奈米粒子5之含有比率、及導電性碳層3中之sp
3之比率,適當地進行設定。再者,由於施加於成膜構件之電壓具有使與成膜構件碰撞之濺鍍氣體離子之速度加速之效果,因此稱為離子加速電壓。
As a target at the time of sputtering, sintered carbon and gold are mentioned, for example. A target is provided in a sputtering apparatus. Two targets were installed in the sputtering apparatus. Moreover, a sputtering apparatus is equipped with a film formation means, for example. As a film-forming member, a film-forming plate (film-forming substrate) and a film-forming roll are mentioned, for example. The film forming member and the target system are arranged facing each other at a distance from each other. The target and the film forming member can apply required electric power and voltage respectively. The power and voltage are appropriately set according to the content ratio of
作為向濺鍍裝置導入之濺鍍氣體,例如可例舉惰性氣體。惰性氣體例如包含氬氣。實施濺鍍時之壓力例如為1 Pa以下。As a sputtering gas introduced into a sputtering apparatus, an inert gas is mentioned, for example. The inert gas includes, for example, argon. The pressure at the time of performing sputtering is 1 Pa or less, for example.
藉此,獲得在厚度方向一側依序具備基材2、及導電性碳層3之電極1。Thereby, the
<電極1之用途>
電極1可用作各種電極,較佳為可用作實施電化學測定法之電化學測定用之電極,具體而言可用作實施循環伏安法(CV)之作用電極(工作電極);實施方波伏安法(SWV)、陽極析出伏安測定法(ASV)、電流測定法之作用電極(工作電極)。
<Application of
尤其是,該電極1較適宜地用作對於在2019年由IUPAC(International Union of Pure and Applied Chemistry,國際純化學暨應用化學聯合會)所規定之週期表中歸類於第14族至第15族之金屬元素而言信噪比較高之電極(工作電極)。電極1較佳為較適宜地用作對於第15族之金屬元素而言信噪比較高之電極(工作電極),更佳為較適宜地用作對於砷(具體而言,三價砷離子)而言信噪比較高之電極(工作電極)。In particular, the
<一實施方式之作用效果>
該電極1中,由於導電性碳層3含有未達10原子%之金奈米粒子5,sp
3鍵結原子之比率(sp
3/(sp
3+sp
2))為0.25以上,因此信噪比較高。
<Effect of One Embodiment> In this
尤其是,只要該電極1用作測定歸類於第14族至第15族之金屬元素、具體而言測定砷之用途之電極,則能夠獲得較高之信噪比。In particular, a high signal-to-noise ratio can be obtained as long as the
<變化例> 變化例中,對於與一實施方式相同之構件及步驟,附上相同之參照符號,並省略其詳細說明。又,除了特殊記載以外,變化例可起到與一實施方式相同之作用效果。進而,可適當地組合一實施方式及其變化例。 <Changed example> In the modified example, the same reference numerals are assigned to the same components and steps as those in the first embodiment, and detailed description thereof will be omitted. In addition, unless otherwise specified, the modified example can have the same operation and effect as that of the first embodiment. Furthermore, one embodiment and its modifications can be combined as appropriate.
如圖1所示,一實施方式中,電極1具備1層基材2、及1層導電性碳層3。另一方面,雖未圖示,但變化例中具備1層基材2、及複數層(具體而言,2層)導電性碳層3。即,電極1中,相對於1層基材2而言可具備複數層(具體而言,2層)導電性碳層3。於電極1具備2層導電性碳層3之情形時,導電性碳層3、基材2、及導電性碳層3在厚度方向上依序配置。配置於基材2之厚度方向上之另一面之導電性碳層3係利用與配置於基材2之厚度方向上之一面之導電性碳層3之形成方法相同之方法來形成。As shown in FIG. 1 , in one embodiment, an
亦可在基材2與導電性碳層3之間、或在基材2之下側進而具備1層或2層以上之功能層。作為功能層,例如可例舉:基礎層、氣體障壁層、導電層、密接層、表面平滑層等。
[實施例]
Between the
以下,示出實施例及比較例,對本發明進而具體地進行說明。再者,本發明並不受限於任何實施例及比較例。以下之記載中所使用之調配比率(含有比率)、物性值、參數等具體之數值可代替為上述之「實施方式」中所記載之與該等對應之調配比率(含有比率)、物性值、參數等相應記載之上限值(定義為「以下」、「未達」之數值)或下限值(定義為「以上」、「超過」之數值)。Hereinafter, an Example and a comparative example are shown, and this invention is demonstrated more concretely. Furthermore, the present invention is not limited to any Examples and Comparative Examples. Specific numerical values such as the blending ratio (content ratio), physical property value, and parameters used in the following descriptions can be replaced by the corresponding blending ratio (content ratio), physical property value, etc. described in the above "embodiment" The upper limit value (defined as the value of "below" or "less than") or the lower limit value (defined as the value of "above" or "exceeding") of the parameters and other corresponding records.
<實施例1>
準備厚度280 μm之包含矽晶圓之基材2。
<Example 1>
A
接下來,將基材2設置於濺鍍裝置中。濺鍍裝置中獨立地具備第1靶、第2靶、及成膜板。藉由使用該濺鍍裝置來進行濺鍍,從而在基材2之厚度方向上之一面形成目標厚度40 nm之導電性碳層3。藉此,製得具備基材2、及分散有金奈米粒子5之導電性碳層3之電極1。濺鍍條件如下所述。Next, the
第1靶:燒結碳 第2靶:金 濺鍍氣體:氬氣 壓力:0.6 Pa 施加於成膜板之電壓(離子加速電壓):75 V 施加於第1靶之電力:400 W 施加於第2靶之電力:50 W 1st target: sintered carbon Target 2: Gold Sputtering Gas: Argon Pressure: 0.6Pa Voltage applied to the film-forming plate (ion acceleration voltage): 75 V Power applied to the first target: 400 W Power applied to the second target: 50 W
<實施例2~實施例4、比較例1~比較例4>
與實施例1同樣地製得電極1。其中,如表1中所記載般變更施加於成膜板之電壓、施加於第1靶之電力、及施加於第2靶之電力。
<Example 2 to Example 4, Comparative Example 1 to Comparative Example 4>
<評價>
針對實施例1~實施例4及比較例1~比較例4之電極1,對以下之項目進行評價。
<Evaluation>
Regarding the
(1)導電性碳層3中之金奈米粒子之含有比率、及sp
3/(sp
3+sp
2)
導電性碳層3中之金奈米粒子5之含有比率、及sp
3/(sp
3+sp
2)係使用X射線光電子光譜法(XPS、島津製作所)來進行觀察。
(1) The content ratio of gold nanoparticles in the conductive carbon layer 3, and sp 3 /(sp 3 +sp 2 ) The content ratio of the
(2)測定低濃度砷離子(三價)時之信噪比 將具有直徑2 mm之孔之絕緣膠帶貼附於導電性碳層3之一面而製得已知電極面積之樣品電極。將該樣品電極作為工作電極,插入至0.05 M H 2SO 4水溶液中,並與恆電位器(CHI Instruments公司製造、ALS730C)連接。又,同樣地,亦將參考電極(Ag/AgCl)及相對電極(Pt)插入至H 2SO 4溶液中,並與恆電位器連接。 (2) Signal-to-noise ratio when measuring low-concentration arsenic ions (trivalent) Attach an insulating tape with a hole with a diameter of 2 mm to one side of the conductive carbon layer 3 to prepare a sample electrode with a known electrode area. This sample electrode was used as a working electrode, inserted into a 0.05 M H 2 SO 4 aqueous solution, and connected to a potentiostat (manufactured by CHI Instruments, ALS730C). Also, similarly, the reference electrode (Ag/AgCl) and the counter electrode (Pt) were inserted into the H 2 SO 4 solution and connected to the potentiostat.
接著,以H
2SO
4水溶液中之砷離子(三價)之濃度變為0 ppb、100 ppb之方式,分別製備H
2SO
4水溶液。設定還原沈積電位-0.8 V、沈積時間120秒鐘而使砷離子(三價)還原沈積於電極1上。其後,設定頻率50 Hz、電位增加量3 mV、振幅25 mV,並按濃度不同分別實施波伏安法(SWV)測定,從而獲得SWV曲線。在所獲得之SWV曲線中,根據於砷離子(三價)之濃度100 ppb之情形時在0.2 V附近所觀察出之來自砷離子(三價)之峰值響應電流值、與溶液濃度0 ppb之情形時在與該峰值相同電位下之電流值(相當於雜訊之值)之比,求出信噪比(S/N比、Signal/Noise ratio)。
Next, H 2 SO 4 aqueous solutions were prepared so that the concentrations of arsenic ions (trivalent) in the H 2 SO 4 aqueous solution became 0 ppb and 100 ppb, respectively. The reduction deposition potential was set at -0.8 V, and the deposition time was 120 seconds so that arsenic ions (trivalent) were reduced and deposited on the
[表1]
再者,上述發明雖作為本發明之例示之實施方式提供,但其僅為單純之例示,並不可限定性地解釋。該技術領域之業者所知之本發明之變化例亦包含於後述之申請專利範圍內。 [產業上之可利用性] In addition, although the said invention was provided as embodiment of the illustration of this invention, it is a mere illustration and should not interpret it restrictively. Variations of the present invention known to those in the technical field are also included in the scope of the patent application described below. [Industrial availability]
電極例如用於電化學測定用之電極。The electrodes are used, for example, for electrochemical measurements.
1:電極 2:基材 3:導電性碳層 4:碳矩陣 5:金奈米粒子 1: electrode 2: Substrate 3: Conductive carbon layer 4: Carbon matrix 5: Gold nanoparticles
圖1係本發明之一實施方式之電極之剖視圖。Fig. 1 is a cross-sectional view of an electrode according to an embodiment of the present invention.
1:電極 1: electrode
2:基材 2: Substrate
3:導電性碳層 3: Conductive carbon layer
4:碳矩陣 4: Carbon matrix
5:金奈米粒子 5: Gold nanoparticles
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