TW202242528A - Shape memory alloy actuators and module assembly thereof - Google Patents

Shape memory alloy actuators and module assembly thereof Download PDF

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TW202242528A
TW202242528A TW111106425A TW111106425A TW202242528A TW 202242528 A TW202242528 A TW 202242528A TW 111106425 A TW111106425 A TW 111106425A TW 111106425 A TW111106425 A TW 111106425A TW 202242528 A TW202242528 A TW 202242528A
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bimorph
actuator
sma
arm
buckle
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TW111106425A
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Chinese (zh)
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萊恩 N 魯茲卡
坂本康史
馬克 A 米勒
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美商哈欽森技術股份有限公司
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/12Fluid-filled or evacuated lenses
    • G02B3/14Fluid-filled or evacuated lenses of variable focal length
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/10Bifocal lenses; Multifocal lenses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/061Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
    • F03G7/0614Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element using shape memory elements
    • F03G7/06143Wires
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/064Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by its use
    • F03G7/0645Clamping, fixing or crimping parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/066Actuator control or monitoring
    • F03G7/0665Actuator control or monitoring controlled displacement, e.g. by using a lens positioning actuator
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G02B27/646Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/09Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10Power-operated focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00Adjustment of optical system relative to image or object surface other than for focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0007Movement of one or more optical elements for control of motion blur
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053Driving means for the movement of one or more optical element
    • G03B2205/0076Driving means for the movement of one or more optical element using shape memory alloys

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Lens Barrels (AREA)
  • Prostheses (AREA)
  • Adjustment Of Camera Lenses (AREA)
  • Studio Devices (AREA)

Abstract

SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

Description

形狀記憶合金致動器及其模組總成Shape memory alloy actuator and its module assembly

本發明之實施例係關於形狀記憶合金系統之領域。更特定而言,本發明之實施例係關於形狀記憶合金致動器及其相關方法之領域。Embodiments of the present invention are in the field of shape memory alloy systems. More particularly, embodiments of the present invention relate to the field of shape memory alloy actuators and related methods.

形狀記憶合金(「SMA」)系統具有例如可結合一相機鏡頭元件一起用作一自動聚焦驅動器之一移動總成或結構。此等系統可被諸如一屏蔽罩之一結構包圍。移動總成經支撐以藉由諸如複數個滾珠之一軸承在一支撐總成上移動。由諸如磷青銅或不鏽鋼之金屬形成之撓曲元件具有一移動板及撓曲件。撓曲件在移動板與靜止支撐總成之間延伸且用作彈簧以使移動總成能夠相對於靜止支撐總成移動。滾珠允許移動總成以很小阻力移動。移動總成及支撐總成藉由在該等總成之間延伸之四個形狀記憶合金(SMA)線耦接。該等SMA線之各者具有附接至支撐總成之一端及附接至移動總成之一相對端。藉由將電驅動信號施加至SMA線來驅動懸架。然而,此等類型之系統受系統複雜性之困擾,從而導致需要一大覆蓋區及一大高度間隙之龐大系統。此外,本系統未能提供具有一緊湊、低分佈覆蓋區之一高Z衝程範圍。Shape memory alloy ("SMA") systems have a moving assembly or structure that can be used, for example, in conjunction with a camera lens element as an autofocus drive. These systems may be surrounded by a structure such as a shield. The moving assembly is supported for movement on a support assembly by bearings such as balls. Flexure elements formed of metal such as phosphor bronze or stainless steel have a moving plate and flexure. A flexure extends between the moving plate and the stationary support assembly and acts as a spring to enable movement of the moving assembly relative to the stationary support assembly. The balls allow the moving assembly to move with little resistance. The moving and supporting assemblies are coupled by four shape memory alloy (SMA) wires extending between the assemblies. Each of the SMA wires has one end attached to the support assembly and an opposite end attached to the moving assembly. The suspension is driven by applying an electrical drive signal to the SMA wire. However, these types of systems suffer from system complexity, resulting in bulky systems that require a large footprint and a large height gap. Furthermore, the present system fails to provide a high Z-stroke range with a compact, low profile footprint.

描述SMA致動器及相關方法。一致動器之一項實施例包含:一基座;複數個帶扣臂;及至少一第一形狀記憶合金線,其與該複數個帶扣臂之一對帶扣臂耦接。一致動器之另一實施例包含一基座及至少一個雙壓電晶片致動器,該至少一個雙壓電晶片致動器包含一形狀記憶合金材料。該雙壓電晶片致動器經附接至該基座。SMA actuators and related methods are described. An embodiment of an actuator includes: a base; a plurality of buckle arms; and at least one first shape memory alloy wire coupled to a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator is attached to the base.

本發明之實施例之其他特徵及優點將自隨附圖式及自後續詳細描述而變得顯而易見。Other features and advantages of embodiments of the present invention will become apparent from the accompanying drawings and from the ensuing detailed description.

相關申請案之交叉參考Cross References to Related Applications

本申請案主張2021年2月22日申請之美國臨時專利申請案第63/152,299號及2022年1月5日申請之美國專利申請案第17/569,268號之權益,該兩個案之全部內容以引用的方式併入本文中。This application claims the benefit of U.S. Provisional Patent Application No. 63/152,299, filed February 22, 2021, and U.S. Patent Application No. 17/569,268, filed January 5, 2022, the entire contents of both cases Incorporated herein by reference.

本文中描述一SMA致動器之實施例,其包含一緊湊覆蓋區且提供一高致動高度,例如在正z軸方向(z方向)之移動,本文中稱為z衝程。SMA致動器之實施例包含一SMA帶扣致動器及一SMA雙壓電晶片致動器。SMA致動器可用於諸多應用(包含但不限於作為一自動聚焦致動器之一透鏡總成、一微流體泵、一感測器移位、光學影像穩定、光學變焦總成)中以機械地撞擊兩個表面以產生通常在觸覺回饋感測器及裝置以及其中使用一致動器之其他系統中發現之振動感覺。例如,本文中所描述之一致動器之實施例可用作在手機或可穿戴裝置中使用之一觸覺回饋致動器,該手機或或可穿戴裝置經組態以向使用者提供一警報、通知、警告、觸控區域或按下按鈕回應。此外,一個以上SMA致動器可用於一系統中以達成一更大衝程。Described herein is an embodiment of an SMA actuator that includes a compact footprint and provides a high actuation height, such as movement in the positive z-axis direction (z-direction), referred to herein as the z-stroke. Examples of SMA actuators include an SMA buckle actuator and an SMA bimorph actuator. SMA actuators can be used in many applications including, but not limited to, lens assemblies as an autofocus actuator, a microfluidic pump, a sensor shift, optical image stabilization, optical zoom assemblies, etc. The two surfaces are struck to produce the vibratory sensation commonly found in tactile feedback sensors and devices and other systems in which an actuator is used. For example, embodiments of an actuator described herein can be used as a haptic feedback actuator for use in a cell phone or wearable device configured to provide the user with an alert, Respond to notifications, warnings, touch areas or press buttons. Additionally, more than one SMA actuator can be used in a system to achieve a larger stroke.

針對各項實施例,SMA致動器具有大於0.4毫米之一z衝程。此外,針對各項實施例,當SMA致動器處於其初始、非致動位置時,SMA致動器在z方向具有2.2毫米或更小之一高度。經組態為一透鏡總成中之一自動聚焦致動器之SMA致動器之各項實施例可具有比透鏡內徑(「ID」)大僅3毫米之一覆蓋區。根據各項實施例,SMA致動器可具有在一個方向更寬之一覆蓋區以容納包含但不限於感測器、線、跡線及連接器之組件。根據一些實施例,一SMA致動器之覆蓋區在一個方向大0.5毫米,例如SMA致動器之長度比寬度大0.5毫米。For various embodiments, the SMA actuator has a z-stroke greater than 0.4 mm. Furthermore, for various embodiments, the SMA actuator has a height in the z-direction of 2.2 millimeters or less when the SMA actuator is in its initial, non-actuated position. Embodiments of an SMA actuator configured as an autofocus actuator in a lens assembly can have a footprint that is only 3 millimeters larger than the inner diameter ("ID") of the lens. According to various embodiments, SMA actuators may have a footprint that is wider in one direction to accommodate components including but not limited to sensors, wires, traces, and connectors. According to some embodiments, the footprint of an SMA actuator is 0.5 mm larger in one direction, eg the length of the SMA actuator is 0.5 mm larger than the width.

圖1a繪示根據一實施例之包含經組態為一帶扣致動器之一SMA致動器之一透鏡總成。圖1b繪示根據一實施例之經組態為一帶扣致動器之一SMA致動器。帶扣致動器102與一基座101耦接。如圖1b中所繪示,SMA線100經附接至帶扣致動器102,使得當SMA線100被致動且收縮時,此致使帶扣致動器102扣住,其導致各帶扣致動器102之至少中心部分104在z衝程方向(例如正z方向)移動,如由箭頭108所指示。根據一些實施例,當透過諸如一壓接物結構106之一線保持器將電流供應至SMA線100之一端時致動該線。電流流過SMA線100,從而歸因於製成SMA線100之SMA材料固有之電阻而加熱SMA線100。SMA線100之另一側具有一線保持器,諸如連接SMA線100以使電路接地之一壓接物結構106。將SMA線材100加熱至一足夠溫度致使獨特材料性質自馬氏體結晶構變為奧氏體結晶結構,此致使該線之一長度變化。改變電流會改變溫度且因此會改變該線之長度,此用來致動及撤銷致動該致動器以控制該致動器在至少z方向之移動。熟習此項技術者將理解,可使用其他技術來將電流提供至一SMA線。Figure 1a illustrates a lens assembly including an SMA actuator configured as a buckle actuator, according to one embodiment. Figure 1b illustrates an SMA actuator configured as a buckle actuator according to one embodiment. The buckle actuator 102 is coupled to a base 101 . As shown in FIG. 1 b, the SMA wire 100 is attached to the buckle actuator 102 such that when the SMA wire 100 is actuated and retracted, this causes the buckle actuator 102 to buckle, which causes each buckle to buckle. At least central portion 104 of actuator 102 moves in the z-stroke direction (eg, positive z-direction), as indicated by arrow 108 . According to some embodiments, the SMA wire 100 is actuated when current is supplied to one end of the wire through a wire holder, such as a crimp structure 106 . Current flows through the SMA wire 100 , heating the SMA wire 100 due to the inherent electrical resistance of the SMA material from which the SMA wire 100 is made. The other side of the SMA wire 100 has a wire holder, such as a crimp structure 106 that connects the SMA wire 100 to ground the circuit. Heating the SMA wire 100 to a sufficient temperature causes the unique material properties to change from a martensite crystal structure to an austenite crystal structure, which causes a change in the length of the wire. Changing the current changes the temperature and thus the length of the wire, which is used to actuate and de-actuate the actuator to control movement of the actuator in at least the z-direction. Those skilled in the art will understand that other techniques can be used to provide current to an SMA wire.

圖2繪示根據一實施例之經組態為一SMA雙壓電晶片致動器之一SMA致動器。如圖2中所繪示,SMA致動器包含與一基座204耦接之雙壓電晶片致動器202。雙壓電晶片致動器202包含一SMA帶206。雙壓電晶片致動器202經組態以隨著SMA帶206收縮而在z衝程方向208移動雙壓電晶片致動器202之至少未固定端。Figure 2 illustrates an SMA actuator configured as an SMA bimorph actuator according to one embodiment. As shown in FIG. 2 , the SMA actuator includes a bimorph actuator 202 coupled to a base 204 . The bimorph actuator 202 includes a SMA tape 206 . The bimorph actuator 202 is configured to move at least the unsecured end of the bimorph actuator 202 in the z-stroke direction 208 as the SMA tape 206 contracts.

圖3繪示根據一實施例之包含一SMA致動器之一自動聚焦總成的一分解視圖。如所繪示,一SMA致動器302經組態為根據本文中所描述之實施例之一帶扣致動器。自動聚焦總成亦包含光學影像穩定器(「OIS」) 304、經組態以使用包含此項技術中已知之技術的技術固持一或多個光學透鏡之一透鏡托架306、一復位彈簧308、一垂直滑動軸承310及一引導蓋312。當SMA線使用包含本文中所描述之技術的技術來致動且拉動及扣住帶扣致動器302時,透鏡托架306經組態以隨著SMA致動器302在z衝程方向(例如正z軸方向)移動而抵靠垂直滑動軸承310滑動。復位彈簧308經組態以使用包含此項技術中已知之技術的技術在透鏡托架306上沿與z衝程方向相反之方向施加一力。根據各項實施例,復位彈簧308經組態以當SMA線中之張力隨著撤銷致動SMA線而降低時,在z衝程方向之相反方向移動透鏡托架306。當SMA線中之張力降低至初始值時,透鏡托架306在z衝程方向移動至最低高度。圖4繪示根據圖3中所繪示之一實施例之包含一SMA線致動器之自動聚焦總成。Figure 3 illustrates an exploded view of an autofocus assembly including an SMA actuator according to one embodiment. As shown, an SMA actuator 302 is configured as a buckle actuator according to embodiments described herein. The autofocus assembly also includes an optical image stabilizer ("OIS") 304, a lens carrier 306 configured to hold one or more optical lenses using techniques including techniques known in the art, a return spring 308 , a vertical sliding bearing 310 and a guide cover 312 . When the SMA wire actuates and pulls and buckles the buckle actuator 302 using techniques including those described herein, the lens holder 306 is configured to follow the SMA actuator 302 in the z-stroke direction (e.g. positive z-axis direction) to slide against the vertical slide bearing 310. Return spring 308 is configured to exert a force on lens carrier 306 in a direction opposite to the z-stroke direction using techniques including techniques known in the art. According to various embodiments, the return spring 308 is configured to move the lens holder 306 in the opposite direction of the z-stroke direction when the tension in the SMA wire decreases as the SMA wire is deactivated. When the tension in the SMA wire is reduced to the initial value, the lens holder 306 moves to the lowest height in the z-stroke direction. FIG. 4 illustrates an autofocus assembly including an SMA wire actuator according to one embodiment depicted in FIG. 3 .

圖5繪示根據一實施例之包含一感測器之一SMA線致動器。針對各項實施例,感測器502經組態以使用包含此項技術中已知之技術的技術量測SMA致動器在z方向之移動或彼SMA致動器正在移動之一組件之移動。SMA致動器包含經組態以使用類似於本文中所描述之SMA線之一或多個SMA線508致動的一或多個帶扣致動器506。例如,在參考圖4所描述之自動聚焦總成中,該感測器經組態以使用包含此項技術中已知之技術的技術判定透鏡托架306在z方向504自一初始位置移動之移動量。根據一些實施例,該感測器係一隧道磁阻(「TMR」)感測器。Figure 5 illustrates an SMA wire actuator including a sensor according to one embodiment. For various embodiments, the sensor 502 is configured to measure the movement of the SMA actuator in the z-direction or the movement of a component that the SMA actuator is moving using techniques including techniques known in the art. The SMA actuators include one or more buckle actuators 506 configured to actuate using one or more SMA wires 508 similar to those described herein. For example, in the autofocus assembly described with reference to FIG. 4, the sensor is configured to determine movement of the lens carrier 306 in the z-direction 504 from an initial position using techniques including techniques known in the art quantity. According to some embodiments, the sensor is a tunneling magnetoresistive ("TMR") sensor.

圖6繪示根據一實施例之經組態為一帶扣致動器之一SMA致動器602的一俯視圖及一側視圖,SMA致動器602配備有一透鏡托架604。圖7繪示根據圖6中所繪示之實施例之SMA致動器602之一區段的一側視圖。根據圖7中所繪示之實施例,SMA致動器602包含一滑動基座702。根據一實施例,滑動基座702係使用包含此項技術中已知之技術的技術由諸如不鏽鋼之金屬形成。然而,熟習此項技術者將理解,可使用其他材料來形成滑動基座702。此外,根據一些實施例,滑動基座702具有與SMA致動器602耦接之彈簧臂612。根據各項實施例,彈簧臂612經組態以用作兩個功能。第一功能係幫助將例如一透鏡托架604之一物件推入一引導蓋之垂直滑動表面。針對此實例,彈簧臂612抵靠此表面向上預加載透鏡托架604以確保透鏡在致動期間將不會傾斜。針對一些實施例,垂直滑動表面708經組態以與該引導蓋配合。彈簧臂612之第二功能係繼SMA線608在z衝程方向(即,z正方向)移動SMA致動器602之後,幫助例如在z負方向上向下回拉SMA致動器602。因此,當SMA線608被致動時,其等收縮以在z衝程方向移動SMA致動器602且當SMA線被撤銷致動時,彈簧臂612經組態以在z衝程方向之相反方向移動SMA致動器602。6 shows a top view and a side view of an SMA actuator 602 configured as a belt buckle actuator equipped with a lens holder 604 according to one embodiment. FIG. 7 illustrates a side view of a section of an SMA actuator 602 according to the embodiment depicted in FIG. 6 . According to the embodiment depicted in FIG. 7 , the SMA actuator 602 includes a sliding base 702 . According to one embodiment, slide base 702 is formed from a metal, such as stainless steel, using techniques including techniques known in the art. However, those skilled in the art will appreciate that other materials may be used to form the slide base 702 . Additionally, the sliding base 702 has a spring arm 612 coupled to the SMA actuator 602 according to some embodiments. According to various embodiments, the spring arm 612 is configured to serve two functions. The first function is to help push an object such as a lens holder 604 into the vertical sliding surface of a guide cover. For this example, the spring arm 612 preloads the lens carrier 604 upward against this surface to ensure that the lens will not tilt during actuation. For some embodiments, vertical sliding surface 708 is configured to mate with the guide cover. A second function of the spring arm 612 is to help pull the SMA actuator 602 back, eg, in the negative z direction, after the SMA wire 608 has moved the SMA actuator 602 in the z-stroke direction (ie, the positive z direction). Thus, when the SMA wire 608 is actuated, it contracts to move the SMA actuator 602 in the z-stroke direction and when the SMA wire is deactivated, the spring arm 612 is configured to move in the opposite direction of the z-stroke direction. SMA actuator 602 .

SMA致動器602亦包含一帶扣致動器710。針對各項實施例,帶扣致動器710由諸如不鏽鋼之金屬形成。此外,帶扣致動器710包含帶扣臂610及一或多個線保持器606。根據圖6及圖7中所繪示之實施例,帶扣致動器710包含四個線保持器606。四個線保持器606各經組態以接納一SMA線608之一端且保持SMA線608之端,使得SMA線608經附裝至帶扣致動器710。針對各項實施例,四個線保持器606係壓接物,其等經組態以向下夾持於SMA線608之一部分上以將該線附裝至該壓接物。熟習此項技術者將理解,可使用此項技術中已知之技術將SMA線608附裝至一線保持器606,包含但不限於黏合劑、焊料及機械附裝。智慧型記憶合金(「SMA」)線608在一對線保持器606之間延伸,使得帶扣致動器710之帶扣臂610經組態以在SMA線608被致動時移動,此導致該對線保持器606被拉得更近。根據各項實施例,當將一電流施加至SMA線608時,SMA線608經電致動以移動且控制帶扣臂610之位置。當電流被移除或低於一臨限值時,撤銷致動SMA線608。此將該對線保持器606移開且帶扣臂610在與SMA線608被致動時相反之方向移動。根據各項實施例,當SMA線處於其初始位置被撤銷致動時,帶扣臂610經組態以相對於滑動基座702具有5度之一初始角度。而且,根據各項實施例,在全衝程或當SMA線被完全致動時,帶扣臂610經組態以相對於滑動基座702具有10度至12度之一角度。The SMA actuator 602 also includes a buckle actuator 710 . For various embodiments, buckle actuator 710 is formed from a metal, such as stainless steel. Additionally, the buckle actuator 710 includes a buckle arm 610 and one or more wire retainers 606 . According to the embodiment depicted in FIGS. 6 and 7 , the buckle actuator 710 includes four wire retainers 606 . Each of the four wire holders 606 is configured to receive an end of an SMA wire 608 and hold the end of the SMA wire 608 such that the SMA wire 608 is attached to the buckle actuator 710 . For various embodiments, four wire retainers 606 are crimps configured to clamp down on a portion of SMA wire 608 to attach the wire to the crimp. Those skilled in the art will understand that the SMA wire 608 can be attached to the wire holder 606 using techniques known in the art, including but not limited to adhesives, solder, and mechanical attachment. A smart memory alloy ("SMA") wire 608 extends between a pair of wire retainers 606 such that the buckle arm 610 of the buckle actuator 710 is configured to move when the SMA wire 608 is actuated, which results in The pair of wire holders 606 are drawn closer together. According to various embodiments, the SMA wire 608 is electrically actuated to move and control the position of the buckle arm 610 when a current is applied to the SMA wire 608 . When the current is removed or falls below a threshold, the SMA wire 608 is deactivated. This moves the pair of wire holders 606 apart and the buckle arm 610 moves in the opposite direction to when the SMA wire 608 is actuated. According to various embodiments, when the SMA wire is deactivated in its initial position, the buckle arm 610 is configured to have an initial angle of 5 degrees relative to the slide base 702 . Also, according to various embodiments, at full stroke or when the SMA wire is fully actuated, buckle arm 610 is configured to have an angle of between 10 and 12 degrees relative to slide base 702 .

根據圖6及圖7中所繪示之實施例,SMA致動器602亦包含組態於滑動基座702與線保持器606之間的滑動軸承706。滑動軸承706經組態以最小化滑動基座702與一帶扣臂610及/或一線保持器606之間的任何摩擦。針對一些實施例,滑動軸承經附裝至線保持器606。根據各項實施例,滑動軸承由聚甲醛(「POM」)形成。熟習此項技術者將理解,可使用其他結構來降低該帶扣致動器與該基座之間的任何摩擦。According to the embodiment depicted in FIGS. 6 and 7 , the SMA actuator 602 also includes a sliding bearing 706 configured between the sliding base 702 and the wire holder 606 . Sliding bearing 706 is configured to minimize any friction between sliding base 702 and buckle arm 610 and/or wire holder 606 . For some embodiments, a slide bearing is attached to the wire holder 606 . According to various embodiments, the sliding bearing is formed from polyoxymethylene ("POM"). Those skilled in the art will understand that other structures can be used to reduce any friction between the buckle actuator and the base.

根據各項實施例,滑動基座702經組態以與諸如一自動聚焦總成之一自動聚焦基座之一總成基座704耦接。根據一些實施例,致動器基座704包含一蝕刻墊片。當SMA致動器602係諸如一自動聚焦總成之一總成之部分時,此一蝕刻墊片可用來為線及壓接物提供間隙。According to various embodiments, the sliding base 702 is configured to couple with an assembly base 704 such as an autofocus base of an autofocus assembly. According to some embodiments, the actuator base 704 includes an etched spacer. Such an etched spacer can be used to provide clearance for wires and crimps when the SMA actuator 602 is part of an assembly such as an autofocus assembly.

圖8繪示相對於一x軸、一y軸及一z軸之一帶扣致動器802之一實施例的多個視圖。如圖8中所定向,帶扣臂804經組態以當SMA線如本文中所描述般被致動及撤銷致動時在z軸上移動。根據圖8中所繪示之實施例,帶扣臂804透過諸如一吊床部分806之一中心部分彼此耦接。根據各項實施例,一吊床部分806經組態以撐持由帶扣致動器所作用之一物件(例如由帶扣致動器使用包含本文中所描述之技術的技術移動之一透鏡托架)之一部分。根據一些實施例,一吊床部分806經組態以在致動期間向帶扣致動器提供側向剛性。針對其他實施例,一帶扣致動器不包含一吊床部分806。根據此等實施例,帶扣臂經組態以作用於一物件上以移動該物件。例如,帶扣臂經組態以直接作用於一透鏡托架之特徵上以上推該透鏡托架。FIG. 8 shows views of an embodiment of a buckle actuator 802 relative to an x-axis, a y-axis, and a z-axis. As oriented in Figure 8, the buckle arm 804 is configured to move in the z-axis when the SMA wire is actuated and de-actuated as described herein. According to the embodiment depicted in FIG. 8 , buckle arms 804 are coupled to each other through a central portion, such as a hammock portion 806 . According to various embodiments, a hammock portion 806 is configured to support an object acted upon by the buckle actuator (such as a lens holder moved by the buckle actuator using techniques including the techniques described herein ) part of. According to some embodiments, a hammock portion 806 is configured to provide lateral stiffness to the buckle actuator during actuation. For other embodiments, the buckle actuator does not include a hammock portion 806 . According to these embodiments, the buckle arm is configured to act on an object to move the object. For example, the buckle arm is configured to act directly on a feature of a lens carrier to push up the lens carrier.

圖9繪示根據一實施例之經組態為一SMA雙壓電晶片致動器之一SMA致動器。SMA雙壓電晶片致動器包含雙壓電晶片致動器902,包含本文中所描述之雙壓電晶片致動器。根據圖9中所繪示之實施例,雙壓電晶片致動器902之各者之一端906經附裝至一基座908。根據一些實施例,該端906經焊接至基座908。然而,熟習此項技術者將理解,可使用另一技術來將該端906附裝至基座908。圖9亦繪示一透鏡托架904,其經配置使得雙壓電晶片致動器902經組態以當被致動時在z方向捲曲且在z軸方向抬起該托架904。針對一些實施例,使用一復位彈簧來將雙壓電晶片致動器902回推至一初始位置。一復位彈簧可如本文中所描述般組態以輔助將雙壓電晶片致動器下推至其等初始、撤銷致動位置。由於雙壓電晶片致動器之小覆蓋區,因此可製作與當前致動器技術相比具有一減小的覆蓋區之SMA致動器。Figure 9 illustrates an SMA actuator configured as an SMA bimorph actuator according to one embodiment. SMA bimorph actuators include bimorph actuators 902, including bimorph actuators described herein. According to the embodiment depicted in FIG. 9 , one end 906 of each of the bimorph actuators 902 is attached to a base 908 . According to some embodiments, the end 906 is welded to the base 908 . However, those skilled in the art will understand that another technique may be used to attach the end 906 to the base 908 . FIG. 9 also depicts a lens carrier 904 configured such that the bimorph actuator 902 is configured to curl in the z-direction and lift the carrier 904 in the z-axis direction when actuated. For some embodiments, a return spring is used to push the bimorph actuator 902 back to an initial position. A return spring may be configured as described herein to assist in pushing down the bimorph actuator to its initial, de-actuated position. Due to the small footprint of the bimorph actuator, it is possible to fabricate SMA actuators with a reduced footprint compared to current actuator technology.

圖10繪示根據一實施例之包含一SMA致動器之一自動聚焦總成之一剖視圖,該SMA致動器包含一位置感測器,諸如一TMR感測器。自動聚焦總成1002包含附接至一移動彈簧1006之一位置感測器1004,及附接至包含諸如本文中所描述之SMA致動器的一SMA致動器之一自動聚焦總成之一透鏡托架1010之一磁體1008。位置感測器1004經組態以使用包含此項技術中已知之技術的技術、基於磁體1008距位置感測器1004之一距離來判定透鏡托架1010在z方向1005上自一初始位置移動之移動量。根據一些實施例,位置感測器1004使用一光學影像穩定總成之一移動彈簧1006之一彈簧臂上之複數個電跡線與一控制器或一處理器(諸如一中央處理單元)電耦接。10 illustrates a cross-sectional view of an autofocus assembly including an SMA actuator including a position sensor, such as a TMR sensor, according to one embodiment. Autofocus assembly 1002 includes a position sensor 1004 attached to a moving spring 1006, and one of the autofocus assemblies attached to an SMA actuator including an SMA actuator such as the one described herein A magnet 1008 of the lens holder 1010 . The position sensor 1004 is configured to determine the movement of the lens holder 1010 from an initial position in the z-direction 1005 based on the distance of the magnet 1008 from the position sensor 1004 using techniques including techniques known in the art amount of movement. According to some embodiments, the position sensor 1004 is electrically coupled to a controller or a processor (such as a central processing unit) using electrical traces on a spring arm of a moving spring 1006 of an optical image stabilization assembly. catch.

圖11a至圖11c繪示根據一些實施例之雙壓電晶片致動器之視圖。根據各項實施例,一雙壓電晶片致動器1102包含一樑1104及一或多種SMA材料1106,諸如一SMA帶1106b (例如,如根據圖11b之實施例之包含一SMA帶之一雙壓電晶片致動器之一透視圖中所繪示)或SMA線1106a (例如,如根據圖11a之實施例之包含一SMA線之一雙壓電晶片致動器的一橫截面中所繪示)。使用包含本文中所描述之技術的技術將SMA材料1106附裝至樑1104。根據一些實施例,使用黏合膜材料1108將SMA材料1106附裝至一樑1104。針對各項實施例,SMA材料1106之端與接觸件1110電耦接及機械耦接,接觸件1110經組態以使用包含此項技術中已知之技術的技術將電流供應至SMA材料1106。根據各項實施例,接觸件1110 (例如,如圖11a及圖11b中所繪示)係鍍金的銅墊。根據實施例,具有近似1毫米之一長度之一雙壓電晶片致動器1102經組態以產生一大衝程且50毫牛頓(「mN」)之推力用作一透鏡總成之部分,例如如圖11c中所繪示。根據一些實施例,具有大於1毫米之一長度之一雙壓電晶片致動器1102之使用將產生比具有1毫米之一長度之雙壓電晶片致動器更大之衝程但更小之力。針對一實施例,一雙壓電晶片致動器1102包含一20微米厚SMA材料1106、一20微米厚絕緣體1112 (諸如聚酰亞胺絕緣體)及一30微米厚不鏽鋼樑1104或鹼金屬。各項實施例包含一第二絕緣體,該第二絕緣體經安置於包含接觸件1110之一接觸層與SMA材料1106之間。根據一些實施例,第二絕緣體經組態以使SMA材料1106與未用作接觸件1110之接觸層之部分絕緣。針對一些實施例,第二絕緣體係一表塗層,諸如聚酰亞胺絕緣體。熟習此項技術者將理解,可使用其他尺寸及材料來滿足所欲設計特性。11a-11c illustrate views of a bimorph actuator according to some embodiments. According to various embodiments, a bimorph actuator 1102 includes a beam 1104 and one or more SMA materials 1106, such as an SMA tape 1106b (e.g., a bimorph including a SMA tape as in the embodiment of FIG. piezo actuator shown in a perspective view) or SMA wire 1106a (eg, as depicted in a cross-section of a bimorph actuator comprising an SMA wire according to the embodiment of FIG. 11a Show). SMA material 1106 is attached to beam 1104 using techniques including those described herein. According to some embodiments, the SMA material 1106 is attached to a beam 1104 using an adhesive film material 1108 . For various embodiments, the ends of the SMA material 1106 are electrically and mechanically coupled to contacts 1110 configured to supply electrical current to the SMA material 1106 using techniques including techniques known in the art. According to various embodiments, the contacts 1110 (eg, as depicted in FIGS. 11 a and 11 b ) are gold-plated copper pads. According to an embodiment, a bimorph actuator 1102 having a length of approximately 1 millimeter is configured to generate a large stroke and 50 millinewtons ("mN") of thrust as part of a lens assembly, e.g. As shown in Figure 11c. According to some embodiments, the use of a bimorph actuator 1102 having a length greater than 1 mm will produce a greater stroke but less force than a bimorph actuator having a length of 1 mm . For one embodiment, a bimorph actuator 1102 includes a 20 micron thick SMA material 1106, a 20 micron thick insulator 1112 such as polyimide insulator, and a 30 micron thick stainless steel beam 1104 or alkali metal. Embodiments include a second insulator disposed between a contact layer including contacts 1110 and SMA material 1106 . According to some embodiments, the second insulator is configured to insulate the SMA material 1106 from portions of the contact layer not used as contacts 1110 . For some embodiments, the second insulation system is a surface coating, such as a polyimide insulation. Those skilled in the art will understand that other dimensions and materials may be used to meet the desired design characteristics.

圖12繪示根據一實施例之一雙壓電晶片致動器之一實施例之視圖。如圖12中所繪示之實施例包含用於施加電力之一中心饋電1204。在SMA材料1202 (線或帶)(諸如本文中所描述之SMA材料)之中心處供應電力。SMA材料1202之端在端墊1203處作為一返回路徑接地至樑1206或鹼金屬。端墊1203與接觸層1214之其餘部分電隔離。根據實施例,一樑1206或鹼金屬沿SMA材料1202之整個長度極為接近SMA材料1202 (諸如一SMA線)會在電流被關斷時(即,雙壓電晶片致動器被撤銷致動)提供更快線冷卻。結果係一更快線撤銷啟動及致動器回應時間。SMA線或帶之熱分佈予以改良。例如,熱分佈更均勻使得可將一較高總電流可靠地傳遞至該線。在沒有一均勻散熱片之情況下,該線之部分(諸如一中心區)可能過熱且受損,因此需要一減小的電流及減少的運動來可靠地操作。中心饋電1204提供SMA材料1202之線啟動/致動更快(加熱更快)及電力消耗減少(電阻路徑長度更低)而回應時間更快之益處。此允許一更快致動器運動及以一更高移動頻率操作之能力。Figure 12 shows a view of one embodiment of a bimorph actuator according to one embodiment. The embodiment as depicted in Figure 12 includes a central feed 1204 for applying power. Power is supplied at the center of an SMA material 1202 (wire or ribbon), such as the SMA material described herein. The end of the SMA material 1202 is grounded at the end pad 1203 to the beam 1206 or alkali metal as a return path. Terminal pad 1203 is electrically isolated from the rest of contact layer 1214 . According to an embodiment, a beam 1206 or alkali metal in close proximity to the SMA material 1202 (such as an SMA wire) along the entire length of the SMA material 1202 will when the current is turned off (i.e., the bimorph actuator is deactivated) Provides faster wire cooling. The result is a faster line deactivation activation and actuator response time. The heat distribution of the SMA wire or tape is improved. For example, more uniform heat distribution allows a higher total current to be reliably delivered to the wire. Without a uniform heat sink, portions of the line, such as a central region, may overheat and become damaged, thus requiring a reduced current and reduced motion to operate reliably. The center feed 1204 provides the benefits of faster start/actuation of the wires of the SMA material 1202 (faster heating) and reduced power consumption (lower resistive path length) with faster response time. This allows for a faster actuator movement and the ability to operate at a higher frequency of movement.

如圖12中所繪示,樑1206包含與樑1206之其餘部分隔離以形成中心饋電1204之一中心金屬1208。諸如本文中所描述之絕緣體的一絕緣體1210經安置於樑1206上方。絕緣體1210經組態為具有一或多個開口或通孔1212以提供對樑1206之電通路,例如以耦接接觸層之一接地區段1214b,且提供與中心金屬1208之接觸以形成中心饋電1204。根據一些實施例,一接觸層1214 (諸如本文中所描述之接觸層)包含一電源區段1214a及一接地區段1214b,以藉由一電力供應器接觸件1216及一接地接觸件1218來將致動/控制信號提供至雙壓電晶片致動器。一表塗層1220 (諸如本文中所描述之表塗層)經安置於接觸層1214上方以電隔離接觸層,惟在電耦接係所欲的接觸層1214中耦接之部分(例如,一或多個接觸件)處除外。As shown in FIG. 12 , beam 1206 includes a center metal 1208 isolated from the rest of beam 1206 to form center feed 1204 . An insulator 1210 , such as the insulator described herein, is disposed over beam 1206 . The insulator 1210 is configured with one or more openings or vias 1212 to provide electrical access to the beam 1206, for example to couple to a ground section 1214b of the contact layer, and to provide contact to the center metal 1208 to form a center feed. Electric 1204. According to some embodiments, a contact layer 1214, such as described herein, includes a power section 1214a and a ground section 1214b to connect Actuation/control signals are provided to the bimorph actuator. A topcoat 1220, such as the topcoat described herein, is disposed over the contact layer 1214 to electrically isolate the contact layer except for portions of the contact layer 1214 where the electrical coupling is desired (e.g., a or multiple contacts) except at.

圖13繪示根據如圖12中所繪示之一實施例之一雙壓電晶片致動器的一端墊橫截面。如上文所描述,端墊1203藉由形成於端墊1203與接觸層1214之間的一間隙1222而與接觸層1214之其餘部分電隔離。根據一些實施例,使用包含此項技術中已知之蝕刻技術的蝕刻技術形成該間隙。端墊1203包含經組態以電耦接端墊1203與樑1206之一通孔區段1224。通孔區段1224經形成於絕緣體1210中形成之一通孔1212中。SMA材料1202電耦接至端墊1203。SMA材料1202可使用包含但不限於焊料、電阻焊接、雷射焊接及直接電鍍之技術電耦接至端墊1203。FIG. 13 shows a cross-section of an end pad of a bimorph actuator according to an embodiment as shown in FIG. 12 . As described above, the terminal pad 1203 is electrically isolated from the rest of the contact layer 1214 by a gap 1222 formed between the terminal pad 1203 and the contact layer 1214 . According to some embodiments, the gap is formed using etching techniques including etching techniques known in the art. End pad 1203 includes a via segment 1224 configured to electrically couple end pad 1203 to beam 1206 . A via section 1224 is formed in a via 1212 formed in the insulator 1210 . SMA material 1202 is electrically coupled to terminal pad 1203 . SMA material 1202 may be electrically coupled to terminal pads 1203 using techniques including, but not limited to, solder, resistance welding, laser welding, and direct plating.

圖14繪示根據如圖12中所繪示之一實施例之一雙壓電晶片致動器之一中心饋電橫截面。中心饋電1204透過接觸層1214與一電力供應器電耦接且藉由中心饋電1204中之一通孔區段1224與中心金屬1208電耦接及熱耦接,通孔區段1224經形成於絕緣體1210中形成之一通孔1212中。FIG. 14 shows a central feed cross-section of a bimorph actuator according to an embodiment as shown in FIG. 12 . Center feed 1204 is electrically coupled to a power supply through contact layer 1214 and is electrically and thermally coupled to center metal 1208 by a via segment 1224 in center feed 1204 formed in A via hole 1212 is formed in the insulator 1210 .

本文中所描述之致動器可用來形成使用多個帶扣及/或多個雙壓電晶片致動器之一致動器總成。根據一實施例,該等致動器可彼此堆疊以便增加可達成之一衝程距離。The actuators described herein can be used to form an actuator assembly using multiple buckles and/or multiple bimorph actuators. According to one embodiment, the actuators can be stacked on top of each other in order to increase the achievable stroke distance.

圖15繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一分解視圖。根據本文中所描述之實施例,兩個帶扣致動器1302、1304相對於彼此配置以使用其等運動彼此相對。針對各項實施例,兩個帶扣致動器1302、1304經組態以彼此成一逆關係移動以定位一透鏡托架1306。例如,第一帶扣致動器1302經組態以接收發送至第二帶扣致動器1304之一電力信號的一逆電力信號。Figure 15 depicts an exploded view of an SMA actuator comprising two buckle actuators according to one embodiment. According to embodiments described herein, the two buckle actuators 1302, 1304 are configured relative to each other to use their motion relative to each other. For various embodiments, the two buckle actuators 1302 , 1304 are configured to move in an inverse relationship to each other to position a lens holder 1306 . For example, first buckle actuator 1302 is configured to receive a power signal inverse of a power signal sent to second buckle actuator 1304 .

圖16繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器。帶扣致動器1302、1304經組態使得各帶扣致動器1302、1304之帶扣臂1310、1312彼此面對且各帶扣致動器1302、1304之滑動基座1314、1316係該兩個帶扣致動器之一外表面。根據各項實施例,各SMA致動器1302、1304之一吊床部分1308經組態以撐持由一或多個帶扣致動器1302、1304所作用之一物件(例如由該等帶扣致動器使用包含本文中所描述之技術的技術來移動之一透鏡托架1306)之一部分。Figure 16 illustrates an SMA actuator comprising two buckle actuators according to one embodiment. The buckle actuators 1302, 1304 are configured such that the buckle arms 1310, 1312 of each buckle actuator 1302, 1304 face each other and the sliding base 1314, 1316 of each buckle actuator 1302, 1304 is on the The outer surface of one of the two buckle actuators. According to various embodiments, a hammock portion 1308 of each SMA actuator 1302, 1304 is configured to support an object to which one or more buckle actuators 1302, 1304 act (eg, caused by the buckles). The actuator moves a portion of a lens holder 1306) using techniques including those described herein.

圖17繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一側視圖,其繪示導致在一正z方向或在一向上方向移動諸如一透鏡托架之一物件之SMA線1318之方向。17 illustrates a side view of an SMA actuator comprising two buckle actuators shown causing movement of one such as a lens holder in a positive z-direction or in an upward direction, according to one embodiment. The direction of the SMA line 1318 of the object.

圖18繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一側視圖,其繪示導致在一負z方向或在一向下方向移動諸如一透鏡托架之一物件之SMA線1318之方向。18 illustrates a side view of an SMA actuator comprising two buckle actuators shown causing movement of one such as a lens holder in a negative z-direction or in a downward direction, according to one embodiment. The direction of the SMA line 1318 of the object.

圖19繪示根據一實施例之包含一SMA致動器之一總成的一分解視圖,該SMA致動器包含兩個帶扣致動器。帶扣致動器1902、1904經組態使得各帶扣致動器1902、1904之帶扣臂1910、1912係該兩個帶扣致動器之一外表面,且各帶扣致動器1902、1904之滑動基座1914、1916彼此面對。根據各項實施例,各SMA致動器1902、1904之一吊床部分1908經組態以撐持由一或多個帶扣致動器1902、1904所作用之一物件(例如由該等帶扣致動器使用包含本文中所描述之技術的技術來移動之一透鏡托架1906)之一部分。針對一些實施例,SMA致動器包含經組態以接納第二帶扣致動器1904的一基座部分1918。SMA致動器亦可包含一蓋部分1920。圖20繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器,該SMA致動器包含一基座部分及一蓋部分。19 depicts an exploded view of an assembly including an SMA actuator including two buckle actuators, according to one embodiment. The buckle actuators 1902, 1904 are configured so that the buckle arm 1910, 1912 of each buckle actuator 1902, 1904 is attached to one of the outer surfaces of the two buckle actuators, and each buckle actuator 1902 The sliding bases 1914, 1916 of , 1904 face each other. According to various embodiments, a hammock portion 1908 of each SMA actuator 1902, 1904 is configured to support an object to which one or more buckle actuators 1902, 1904 is actuated (e.g., by the buckles). The actuator moves a portion of a lens holder 1906) using techniques including those described herein. For some embodiments, the SMA actuator includes a base portion 1918 configured to receive the second buckle actuator 1904 . The SMA actuator may also include a cover portion 1920 . Figure 20 illustrates an SMA actuator comprising two buckle actuators comprising a base portion and a cover portion, according to one embodiment.

圖21繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器。針對一些實施例,帶扣致動器1902、1904相對於彼此配置使得第一帶扣致動器1902之吊床部分1908自第二帶扣致動器1904之吊床部分旋轉約90度。90度組態實現諸如一透鏡托架1906之一物件之縱傾(pitch)及側滾(roll)旋轉。此提供對透鏡托架1906之移動之更好控制。針對各項實施例,將差分電力信號施加至各帶扣致動器對之SMA線,此為傾斜OIS運動提供透鏡托架之縱傾及側滾旋轉。Figure 21 illustrates an SMA actuator comprising two buckle actuators according to one embodiment. For some embodiments, the buckle actuators 1902, 1904 are configured relative to each other such that the hammock portion 1908 of the first buckle actuator 1902 is rotated approximately 90 degrees from the hammock portion of the second buckle actuator 1904. The 90 degree configuration enables pitch and roll rotation of an object such as a lens holder 1906 . This provides better control over the movement of the lens holder 1906 . For various embodiments, a differential power signal is applied to the SMA wires of each pair of buckle actuators, which provides pitch and roll rotation of the lens carriage for tilt OIS motion.

包含兩個帶扣致動器之SMA致動器之實施例消除具有一復位彈簧之需要。當使用SMA線電阻進行位置回饋時,兩個帶扣致動器之使用可改良/減少磁滯。與包含一復位彈簧之SMA致動器相比,包含兩個帶扣致動器之反作用力SMA致動器歸因於較低磁滯而輔助更準確的位置控制。針對一些實施例,諸如圖22中所繪示之實施例,包含兩個帶扣致動器2202、2204之SMA致動器使用差分電力向各帶扣致動器2202、2204之左SMA線2218a及右SMA線2218b提供2軸傾斜。例如,一左SMA線2218a以高於一右SMA線2218b之電力來致動。此致使透鏡托架2206之左側下移且右側上移(傾斜)。針對一些實施例,第一帶扣致動器2202之SMA線保持處於相等電力以充當用於差動地推動SMA線2218a、2218b以致使傾斜運動之一支點。反轉施加至SMA線之電力信號,例如將相等電力施加至第二帶扣致動器2204之SMA線及將差分電力用於第二帶扣致動器2204之左SMA線2218a及右SMA線2218b導致透鏡托架2206在另一方向之一傾斜。此提供使諸如一透鏡托架之一物件在任一運動軸上傾斜之能力,或可解諧透鏡與感測器之間的任何傾斜以獲得良好動態傾斜,其導致跨所有像素之更好圖片品質。Embodiments of the SMA actuator comprising two buckle actuators eliminate the need to have a return spring. The use of two buckle actuators improves/reduces hysteresis when using SMA wire resistors for position feedback. A reaction force SMA actuator comprising two buckle actuators facilitates more accurate position control due to lower hysteresis compared to an SMA actuator comprising one return spring. For some embodiments, such as the one depicted in FIG. 22, an SMA actuator comprising two buckle actuators 2202, 2204 uses differential power to the left SMA wire 2218a of each buckle actuator 2202, 2204. and right SMA wire 2218b provides 2-axis tilt. For example, a left SMA wire 2218a is actuated with a higher power than a right SMA wire 2218b. This causes the left side of the lens carrier 2206 to move down and the right side to move up (tilt). For some embodiments, the SMA wires of the first buckle actuator 2202 are held at equal power to act as a fulcrum for differentially pushing the SMA wires 2218a, 2218b to cause tilting motion. Inverting the power signal applied to the SMA wires, such as applying equal power to the SMA wires of the second buckle actuator 2204 and using differential power to the left and right SMA wires 2218a of the second buckle actuator 2204 2218b causes lens carrier 2206 to tilt in one of the other directions. This provides the ability to tilt an object such as a lens mount in either axis of motion, or any tilt between the lens and sensor can be untuned for good dynamic tilt, which results in better picture quality across all pixels .

圖23繪示根據一實施例之包含兩個帶扣致動器及一耦接器之一SMA致動器。SMA致動器包含兩個帶扣致動器,諸如本文中所描述之帶扣致動器。一第一帶扣致動器2302經組態以使用諸如一耦接器環2305之一耦接器與一第二帶扣致動器2304耦接。帶扣致動器2302、2304相對於彼此配置使得第一帶扣致動器2302之吊床部分2308自第二帶扣致動器2304之吊床部分2309旋轉約90度。用於移動之一有效負載(諸如一透鏡或透鏡總成)經附接至經組態以安置於第一帶扣致動器2302之一滑動基座上之一透鏡托架2306。Figure 23 illustrates an SMA actuator comprising two buckle actuators and a coupler, according to one embodiment. The SMA actuator includes two buckle actuators, such as the buckle actuator described herein. A first buckle actuator 2302 is configured to couple with a second buckle actuator 2304 using a coupler, such as a coupler ring 2305 . The buckle actuators 2302, 2304 are arranged relative to each other such that the hammock portion 2308 of the first buckle actuator 2302 is rotated approximately 90 degrees from the hammock portion 2309 of the second buckle actuator 2304 . A payload for movement, such as a lens or lens assembly, is attached to a lens carrier 2306 configured to rest on a sliding base of the first buckle actuator 2302 .

針對各項實施例,可將相等電力施加至第一帶扣致動器2302及第二帶扣致動器2304之SMA線。此可導致最大化SMA致動器在正z方向之z衝程。針對一些實施例,SMA致動器之衝程可具有等於或大於包含兩個帶扣致動器之其他SMA致動器之衝程之兩倍之一z衝程。針對一些實施例,當自SMA致動器移除電力信號時,可新增一額外彈簧以推抵兩個帶扣致動器以輔助向下回推致動器總成及有效負載。可將相同且相反之電力信號施加至第一帶扣致動器2302及第二帶扣致動器2304的SMA線。此使SMA致動器能夠藉由一帶扣致動器在正z軸方向移動且藉由一帶扣致動器在負z方向移動,其實現SMA致動器之位置之準確控制。此外,可將相等且相反之電力信號(差分電力信號)施加至第一帶扣致動器2302及第二帶扣致動器2304之左及右SMA線,以使諸如一透鏡托架2306之一物件在兩個軸之至少一者上傾斜。For various embodiments, equal power may be applied to the SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304 . This can result in maximizing the z-stroke of the SMA actuator in the positive z-direction. For some embodiments, the stroke of the SMA actuator may have a z-stroke that is equal to or greater than twice the stroke of other SMA actuators including two buckle actuators. For some embodiments, an additional spring can be added to push against both buckle actuators to assist in pushing back the actuator assembly and payload down when the power signal is removed from the SMA actuator. The same and opposite electrical signals may be applied to the SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304 . This enables the SMA actuator to move in the positive z-direction with the buckle actuator and in the negative z-direction with the buckle actuator, which enables accurate control of the position of the SMA actuator. In addition, equal and opposite power signals (differential power signals) can be applied to the left and right SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304, so that, for example, a lens holder 2306 An object is tilted on at least one of two axes.

包含兩個帶扣致動器及一耦接器之SMA致動器(諸如圖23中所繪示之SMA致動器)之實施例可與一額外帶扣致動器及帶扣致動器對耦接以達成大於單個SMA致動器之衝程之一所欲衝程。Embodiments of an SMA actuator comprising two buckle actuators and a coupler, such as the one depicted in FIG. 23, can be combined with an additional buckle actuator and buckle actuator The pair is coupled to achieve a desired stroke greater than that of a single SMA actuator.

圖24繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解視圖,該SMA致動器包含具有一層壓吊床之一帶扣致動器。如本文中所描述,針對一些實施例,SMA系統經組態以結合一或多個相機鏡頭元件一起用作一自動聚焦驅動器。如圖24中所繪示,SMA系統包含一復位彈簧2403,復位彈簧2403根據各項實施例經組態以當SMA線2408中之張力隨著撤銷致動SMA線而降低時,在z方向之相反方向移動一透鏡托架2405。針對一些實施例,SMA系統包含一殼體2409,殼體2409經組態以接納復位彈簧2403且作用於一滑動軸承以在z衝程方向引導透鏡托架。殼體2409亦經組態以安置於帶扣致動器2402上。帶扣致動器2402包含類似於本文中所描述之滑動基座之一滑動基座2401。帶扣致動器2402包含與一吊床部分(諸如由一層壓板形成之一層壓吊床2406)耦接之帶扣臂2404。帶扣致動器2402亦包含一SMA線附接結構,諸如一層壓形成壓接物連接件2412。24 depicts an exploded view of an SMA system including an SMA actuator including a buckle actuator with a laminated hammock, according to one embodiment. As described herein, for some embodiments, an SMA system is configured to function as an autofocus driver in conjunction with one or more camera lens elements. As shown in FIG. 24 , the SMA system includes a return spring 2403 configured according to various embodiments so that when the tension in the SMA wire 2408 decreases as the SMA wire is deactivated, the tension in the z-direction Move a lens holder 2405 in the opposite direction. For some embodiments, the SMA system includes a housing 2409 configured to receive a return spring 2403 and act on a sliding bearing to guide the lens carrier in the z-stroke direction. Housing 2409 is also configured to seat over buckle actuator 2402 . Buckle actuator 2402 includes a sliding base 2401 similar to that described herein. The buckle actuator 2402 includes a buckle arm 2404 coupled to a hammock portion, such as a laminated hammock 2406 formed from laminated sheets. The buckle actuator 2402 also includes an SMA wire attachment structure, such as a laminate formed crimp connector 2412 .

如圖24中所繪示,滑動基座2401經安置於一選用適配器板2414上。該適配器板經組態以使SMA系統或帶扣致動器2402與另一系統(諸如一OIS、額外SMA系統或其他組件)配合。圖25繪示根據一實施例之包含一SMA致動器之一SMA系統2501,該SMA致動器包含具有一層壓吊床之一帶扣致動器2402。As shown in FIG. 24 , the sliding base 2401 is seated on an optional adapter plate 2414 . The adapter board is configured to mate the SMA system or buckle actuator 2402 with another system, such as an OIS, additional SMA system, or other components. Figure 25 illustrates an SMA system 2501 comprising an SMA actuator comprising a buckle actuator 2402 with a laminated hammock, according to one embodiment.

圖26繪示根據一實施例之包含一層壓吊床之一帶扣致動器。帶扣致動器2402包含帶扣臂2404。帶扣臂2404經組態以當SMA線2408如本文中所描述般致動及撤銷致動時在z軸上移動。使用層壓板成形壓接物連接件2412將SMA線2408附接至該帶扣致動器。根據圖26中所繪示之實施例,帶扣臂2404透過諸如一層壓吊床2406之一中心部分彼此耦接。根據各項實施例,一層壓吊床2406經組態以撐持由該帶扣致動器所作用之一物件(例如由該帶扣致動器使用包含本文中所描述之技術的技術來移動之一透鏡托架)之一部分。Figure 26 illustrates a buckle actuator comprising a laminated hammock according to one embodiment. Buckle actuator 2402 includes a buckle arm 2404 . Buckle arm 2404 is configured to move in the z-axis when SMA wire 2408 is actuated and de-actuated as described herein. SMA wire 2408 is attached to the buckle actuator using laminate forming crimp connector 2412 . According to the embodiment depicted in FIG. 26 , the buckle arms 2404 are coupled to each other through a central portion, such as a laminated hammock 2406 . According to various embodiments, laminated hammock 2406 is configured to support an object acted upon by the buckle actuator (eg, one moved by the buckle actuator using techniques including those described herein). part of the lens holder).

圖27繪示根據一實施例之一SMA致動器之一層壓吊床。針對一些實施例,層壓吊床2406材料係一低剛性材料因此其不抵抗致動運動。例如,層壓吊床2406係使用安置於一第一聚酰亞胺層上之一銅層與安置於該銅上之一第二聚酰亞胺層形成。針對一些實施例,使用包含此項技術中已知之沈積及蝕刻技術的沈積及蝕刻技術在帶扣臂2404上形成層壓吊床2406。針對其他實施例,層壓吊床2406獨立於帶扣臂2404形成且使用包含焊接、黏合劑及此項技術中已知之其他技術的技術附接至帶扣臂2404。針對各項實施例,在層壓吊床2406上使用膠水或其他黏合劑以確保帶扣臂2404保持於相對於一透鏡托架之一位置。Figure 27 depicts a laminated hammock with an SMA actuator according to one embodiment. For some embodiments, the laminated hammock 2406 material is a low stiffness material so it does not resist actuation motion. For example, laminated hammock 2406 is formed using a copper layer disposed on a first polyimide layer and a second polyimide layer disposed on the copper. For some embodiments, laminated hammock 2406 is formed on buckle arm 2404 using deposition and etching techniques including those known in the art. For other embodiments, laminated hammock 2406 is formed separately from buckle arm 2404 and is attached to buckle arm 2404 using techniques including welding, adhesives, and other techniques known in the art. For various embodiments, glue or other adhesives are used on the laminated hammock 2406 to ensure that the buckle arm 2404 remains in a position relative to a lens holder.

圖28繪示根據一實施例之一SMA致動器之一層壓形成壓接物連接件。層壓形成壓接物連接件2412經組態以將一SMA線2408附接至帶扣致動器且與SMA線2408一起產生一電路接頭。針對各項實施例,層壓形成壓接物連接件2412包含由一絕緣體之一或多個層及形成於一壓接物上之導電層之一或多個層形成之一層壓板。Figure 28 illustrates a lamination of an SMA actuator to form a crimp connection according to one embodiment. The lamination forms a crimp connector 2412 configured to attach an SMA wire 2408 to the buckle actuator and create an electrical connection with the SMA wire 2408 . For various embodiments, lamination to form a crimp connection 2412 includes a laminate formed from one or more layers of an insulator and one or more layers of a conductive layer formed on a crimp.

例如,將聚酰亞胺層安置於形成一壓接物2413之不鏽鋼部分之至少一部分上。接著將諸如銅之一導電層安置於聚酰亞胺層上,該聚酰亞胺層與安置於帶扣致動器上之一或多個信號跡線2415電耦接。使壓接物變形以與其中之SMA線接觸亦使SMA線與導電層電接觸。因此,與一或多個信號跡線之導電層用來使用包含本文中所描述之技術的技術將電力信號施加至SMA線。針對一些實施例,在導電層上方之導電層將不與SMA線接觸之區域中形成一第二聚酰亞胺層。針對一些實施例,使用包含此項技術中已知之沈積及蝕刻技術的沈積及蝕刻技術在一壓接物2413上形成層壓形成壓接物連接件2412。針對其他實施例,層壓形成壓接物連接件2412及一或多個電跡線獨立於壓接物2413及帶扣致動器形成且使用包含焊接、黏合劑及此項技術中已知之其他技術附接至壓接物2413及帶扣致動器。For example, a layer of polyimide is disposed on at least a portion of the stainless steel portion forming a crimp 2413 . A conductive layer, such as copper, is then disposed on the polyimide layer that is electrically coupled to one or more signal traces 2415 disposed on the buckle actuator. Deforming the crimp to make contact with the SMA wires therein also brings the SMA wires into electrical contact with the conductive layer. Accordingly, a conductive layer with one or more signal traces is used to apply power signals to the SMA wires using techniques including those described herein. For some embodiments, a second polyimide layer is formed over the conductive layer in areas where the conductive layer will not be in contact with the SMA lines. For some embodiments, a laminate forming crimp connection 2412 is formed on a crimp 2413 using deposition and etching techniques including those known in the art. For other embodiments, the lamination to form the crimp connection 2412 and one or more electrical traces is formed independently of the crimp 2413 and the buckle actuator and using other methods including soldering, adhesives, and other methods known in the art. The technology is attached to the crimp 2413 and the buckle actuator.

圖29繪示包含具有一層壓吊床之一帶扣致動器之一SMA致動器。如圖29中所繪示,當施加一電力信號時,SMA線收縮或縮短以在正z軸方向移動帶扣臂及層壓吊床。與一物件接觸之層壓吊床繼而在正z軸方向移動彼物件,諸如一透鏡托架。當電力信號減小或移除時,SMA線延長且在一負z軸方向移動帶扣臂及層壓吊床。Figure 29 depicts an SMA actuator comprising a buckle actuator with a laminated hammock. As shown in Figure 29, when a power signal is applied, the SMA wire contracts or shortens to move the buckle arm and laminate hammock in the positive z-axis direction. A laminated hammock in contact with an object then moves that object, such as a lens holder, in the positive z-axis direction. When the power signal is reduced or removed, the SMA wire extends and moves the buckle arm and laminate hammock in a negative z-axis direction.

圖30繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解視圖,該SMA致動器包含一帶扣致動器。如本文中所描述,針對一些實施例,SMA系統經組態以結合一或多個相機鏡頭元件一起用作一自動聚焦驅動器。如圖30中所繪示,SMA系統包含一復位彈簧3003,復位彈簧3003根據各項實施例經組態以當SMA線3008中之張力隨著撤銷致動該SMA線而降低時在z衝程方向之相反方向移動一透鏡托架3006。針對一些實施例,SMA系統包含安置於復位彈簧3003上之一加強件3000。針對一些實施例,SMA系統包含由兩個部分形成之一殼體3009,該兩個部分經組態以接納復位彈簧3003且作用於一滑動軸承以在z衝程方向引導透鏡托架。殼體3009亦經組態以安置於帶扣致動器3002上。帶扣致動器3002包含類似於本文中所描述之一滑動基座之滑動基座3001,滑動基座3001由兩部分形成。滑動基座3001經分裂以電隔離2側(例如一側係接地,另一側係電源),因為根據一些實施例,電流透過滑動基座3001部分流動至該線。30 depicts an exploded view of an SMA system including an SMA actuator, including a belt buckle actuator, according to one embodiment. As described herein, for some embodiments, an SMA system is configured to function as an autofocus driver in conjunction with one or more camera lens elements. As shown in FIG. 30 , the SMA system includes a return spring 3003 configured according to various embodiments to act in the z-stroke direction when the tension in the SMA wire 3008 decreases as the SMA wire is deactivated. Move a lens holder 3006 in the opposite direction. For some embodiments, the SMA system includes a stiffener 3000 disposed on a return spring 3003 . For some embodiments, the SMA system includes a housing 3009 formed from two parts configured to receive a return spring 3003 and act on a sliding bearing to guide the lens carrier in the z-stroke direction. Housing 3009 is also configured to seat over buckle actuator 3002 . The buckle actuator 3002 includes a slide base 3001 similar to the one described herein, the slide base 3001 being formed from two parts. The slide base 3001 is split to electrically isolate 2 sides (eg one side is grounded and the other side is powered) because according to some embodiments current flows partially through the slide base 3001 to the line.

帶扣致動器3002包含帶扣臂3004。各對帶扣致動器3002經形成於帶扣致動器3002之一單獨部分上。帶扣致動器3002亦包含一SMA線附接結構,諸如一電阻焊線壓接物3012。SMA系統視情況包含用於將SMA線3008電耦接至一或多個控制電路之一撓性電路3020。Buckle actuator 3002 includes a buckle arm 3004 . Each pair of buckle actuators 3002 is formed on a separate portion of the buckle actuators 3002 . Buckle actuator 3002 also includes an SMA wire attachment structure, such as a resistance bond wire crimp 3012 . The SMA system optionally includes a flex circuit 3020 for electrically coupling the SMA wire 3008 to one or more control circuits.

如圖30中所繪示,滑動基座3001經安置於一選用適配器板3014上。該適配器板經組態以使SMA系統或帶扣致動器3002與另一系統(諸如一OIS、額外SMA系統或其他組件)配合。圖31繪示根據一實施例之包含一SMA致動器之一SMA系統3101,該SMA致動器包含一帶扣致動器3002。As shown in FIG. 30 , the sliding base 3001 is placed on an optional adapter plate 3014 . The adapter board is configured to mate the SMA system or buckle actuator 3002 with another system, such as an OIS, additional SMA system, or other components. Figure 31 illustrates an SMA system 3101 comprising an SMA actuator comprising a belt buckle actuator 3002 according to one embodiment.

圖32繪示根據一實施例之包含一帶扣致動器之一SMA致動器。帶扣致動器3002包含帶扣臂3004。帶扣臂3004經組態以當SMA線3008如本文中所描述般致動及撤銷致動時在z軸上移動。SMA線3008經附接至電阻焊線壓接物3012。根據圖32中所繪示之實施例,帶扣臂3004經組態以與諸如一透鏡托架之一物件配合,而無需使用一雙軛捕獲接頭之一中心部分。Figure 32 illustrates an SMA actuator including a buckle actuator according to one embodiment. Buckle actuator 3002 includes a buckle arm 3004 . Buckle arm 3004 is configured to move in the z-axis when SMA wire 3008 is actuated and de-actuated as described herein. SMA wire 3008 is attached to resistance bond wire crimp 3012 . According to the embodiment depicted in FIG. 32, the buckle arm 3004 is configured to mate with an object, such as a lens holder, without the use of a double yoke to capture a central portion of the joint.

圖33繪示根據一實施例之一SMA致動器之一對帶扣臂之一雙軛捕獲接頭。圖33亦繪示用來將可選撓性電路附接至滑動基座之電鍍墊。針對一些實施例,電鍍墊3022係使用金形成。圖34繪示根據一實施例之一SMA致動器之一電阻焊壓接物,該SMA致動器用來將一SMA線附接至帶扣致動器。針對一些實施例,膠水或黏合劑亦可經放置於焊之頂部上以輔助機械強度且在操作及衝擊加載期間起到緩解疲勞應變消除(fatigue strain relief)之作用。Figure 33 illustrates a double yoke capture joint of a buckle arm of an SMA actuator according to one embodiment. Figure 33 also shows the plated pads used to attach the optional flex circuit to the slide base. For some embodiments, plating pad 3022 is formed using gold. 34 illustrates a resistance weld crimp of an SMA actuator used to attach an SMA wire to a buckle actuator, according to one embodiment. For some embodiments, glue or adhesive may also be placed on top of the solder to aid in mechanical strength and to function as fatigue strain relief during handling and impact loading.

圖35繪示包含具有一雙軛捕獲接頭之一帶扣致動器的一SMA致動器。如圖35中所繪示,當施加一電力信號時,SMA線收縮或縮短以在正z方向移動帶扣臂。雙軛捕獲接頭與一物件接觸,繼而在正z方向移動彼物件,諸如一透鏡托架。當電力信號減小或消除時,SMA線延長且在一負z軸方向移動帶扣臂。該軛捕獲特徵確保帶扣臂相對於透鏡托架保持於正確位置。Figure 35 shows an SMA actuator including a buckle actuator with a double yoke capture joint. As shown in Figure 35, when a power signal is applied, the SMA wire contracts or shortens to move the buckle arm in the positive z direction. The double-yoke capture joint contacts an object, which in turn moves the object, such as a lens holder, in the positive z-direction. When the power signal is reduced or eliminated, the SMA wire lengthens and moves the buckle arm in a negative z-axis direction. This yoke capture feature ensures that the buckle arm remains in the correct position relative to the lens holder.

圖36繪示根據一實施例之一SMA雙壓電晶片液體透鏡。SMA雙壓電晶片液體透鏡3501包含一液體透鏡子總成3502、一殼體3504及具有SMA致動器3506之一電路。針對各項實施例,SMA致動器包含4個雙壓電晶片致動器3508,諸如本文中所描述之實施例。雙壓電晶片致動器3508經組態以推動定位於一撓性隔膜3512上之一成形環3510。該環纏繞隔膜3512/液體3514,從而改變通過隔膜3512/液體3514之光路徑。一體容納環3516用來容納隔膜3512與透鏡3518之間的液體3514。來自雙壓電晶片致動器之相等力改變影像在Z方向之焦點(法向於透鏡),此允許其用作一自動聚焦裝置。根據一些實施例,來自雙壓電晶片致動器3508之差分力可使光線在X、Y軸方向移動,此允許其用作一光學影像穩定器。藉由對各致動器進行恰當控制,可同時達成OIS功能及AF功能兩者。針對一些實施例,使用3個致動器。具有SMA致動器之電路3506包含用於控制信號致動SMA致動器之一或多個接觸件3520。根據包含4個SMA致動器之一些實施例,具有SMA致動器之電路3506包含用於各SMA致動器之4個電力電路控制接觸件及一共同復位接觸件。Figure 36 illustrates a SMA bimorph liquid lens according to one embodiment. SMA bimorph liquid lens 3501 includes a liquid lens subassembly 3502 , a housing 3504 and an electrical circuit with SMA actuator 3506 . For various embodiments, the SMA actuator includes 4 bimorph actuators 3508, such as the embodiments described herein. The bimorph actuator 3508 is configured to push a forming ring 3510 positioned on a flexible diaphragm 3512 . The ring wraps around the membrane 3512/fluid 3514, changing the path of light through the membrane 3512/fluid 3514. Integral containment ring 3516 is used to contain liquid 3514 between diaphragm 3512 and lens 3518 . Equal force from the bimorph actuator changes the focus of the image in the Z direction (normal to the lens), which allows it to be used as an autofocus device. According to some embodiments, the differential force from the bimorph actuator 3508 can move light in the X, Y axis, which allows it to be used as an optical image stabilizer. By properly controlling each actuator, both the OIS function and the AF function can be achieved simultaneously. For some embodiments, 3 actuators are used. The circuit 3506 with the SMA actuator includes one or more contacts 3520 for the control signal to actuate the SMA actuator. According to some embodiments that include 4 SMA actuators, the circuit with SMA actuators 3506 includes 4 power circuit control contacts and a common reset contact for each SMA actuator.

圖37繪示根據一實施例之一透視SMA雙壓電晶片液體透鏡。圖38繪示根據一實施例之SMA雙壓電晶片液體透鏡的一橫截面及一仰視圖。Figure 37 illustrates a see-through SMA bimorph liquid lens according to one embodiment. 38 illustrates a cross-section and a bottom view of an SMA bimorph liquid lens according to an embodiment.

圖39繪示根據一實施例之包含具有雙壓電晶片致動器之一SMA致動器3902之一SMA系統。SMA致動器3902包含使用本文中所描述之技術之4個雙壓電晶片致動器。該等雙壓電晶片致動器之兩者經組態為正z衝程致動器3904且另兩者經組態為負z衝程致動器3906,如圖40中所繪示,圖40繪示根據一實施例之具有雙壓電晶片致動器之SMA致動器3902。相對致動器3906、3904經組態以在整個衝程範圍內控制兩個方向之運動。此提供調諧控制碼以補償傾斜之能力。針對各項實施例,附接至組件頂部之兩個SMA線3908實現正z衝程位移。附接至一組件底部之兩個SMA線實現負z衝程位移。針對一些實施例,使用用來接合諸如一透鏡支架3910之一物件之突片附接各雙壓電晶片致動器至該物件。SMA系統包含一頂部彈簧3912,頂部彈簧3912經組態以提供透鏡托架3910在垂直於z衝程軸之軸上(例如,在x軸及y軸之方向)之穩定性。此外,一頂部間隔件3914經配置以安置於頂部彈簧3912與SMA致動器3902之間。一底部間隔件3916經配置於SMA致動器3902與一底部彈簧3918之間。底部彈簧3918經組態以提供透鏡支架3910在垂直於z衝程軸之軸上(例如在x軸及y軸之方向)之穩定性。底部彈簧3918經組態以安置於一基座3920上,諸如本文中所描述之基座。FIG. 39 illustrates an SMA system including an SMA actuator 3902 with a bimorph actuator, according to one embodiment. SMA actuator 3902 includes 4 bimorph actuators using techniques described herein. Two of the bimorph actuators are configured as positive z-stroke actuators 3904 and the other two are configured as negative z-stroke actuators 3906, as shown in FIG. An SMA actuator 3902 with a bimorph actuator is shown according to one embodiment. Opposite actuators 3906, 3904 are configured to control motion in both directions throughout the range of stroke. This provides the ability to tune the control code to compensate for tilt. For various embodiments, two SMA wires 3908 attached to the top of the assembly enable positive z-stroke displacement. Two SMA wires attached to the bottom of a component achieve negative z-stroke displacement. For some embodiments, each bimorph actuator is attached to an object such as a lens holder 3910 using tabs used to engage the object. The SMA system includes a top spring 3912 configured to provide stability of the lens holder 3910 in an axis perpendicular to the z-stroke axis (eg, in the directions of the x-axis and y-axis). Additionally, a top spacer 3914 is configured to be disposed between the top spring 3912 and the SMA actuator 3902 . A bottom spacer 3916 is disposed between the SMA actuator 3902 and a bottom spring 3918 . Bottom spring 3918 is configured to provide stability of lens holder 3910 in an axis perpendicular to the z-stroke axis, such as in the directions of the x-axis and y-axis. Bottom spring 3918 is configured to rest on a base 3920, such as those described herein.

圖41繪示一雙壓電晶片致動器之4103長度4102及用於一SMA線4106使線長度延伸超出雙壓電晶片致動器之一接合墊4104之位置。長於雙壓電晶片致動器之線用來增加衝程及力。因此,SMA線4106超出雙壓電晶片致動器4103之延伸長度4108用來設定雙壓電晶片致動器4103之衝程及力。Figure 41 shows the length 4102 of a bimorph actuator 4103 and the location of a bond pad 4104 for an SMA wire 4106 to extend the wire length beyond the bimorph actuator. Wire longer than the bimorph actuator is used to increase stroke and force. Thus, the extension length 4108 of the SMA wire 4106 beyond the bimorph actuator 4103 is used to set the stroke and force of the bimorph actuator 4103 .

圖42繪示根據一實施例之包含一SMA雙壓電晶片致動器4202之一SMA系統的一分解視圖。根據各項實施例,SMA系統經組態以使用單獨金屬材料及非導電黏合劑來產生一或多個電路以獨立地為SMA線供電。一些實施例不具有AF大小影響且包含4個雙壓電晶片致動器,諸如本文中所描述之雙壓電晶片致動器。該等雙壓電晶片致動器之兩者經組態為正z衝程致動器且另兩者經組態為負z衝程致動器。圖43繪示根據一實施例之SMA致動器之一子區段的一分解視圖。該子區段包含一負致動器信號連接件4302、具有雙壓電晶片致動器4306的一基座4304。負致動器信號連接件4302包含用於使用包含本文中所描述之技術的技術連接一雙壓電晶片致動器4306之一SMA線之一線接合墊4308。使用一黏合劑層4310將負致動器信號連接件4302附裝至基座4304。該子區段亦包含具有一線接合墊4316之一正致動器信號連接件4314,正致動器信號連接件4314用於使用包含本文中所描述之技術的技術連接一雙壓電晶片致動器4306之一SMA線4312。使用一黏合劑層4318將正致動器信號連接件4314附裝至基座4304。基座4304、負致動器信號連接件4302及正致動器信號連接件4314之各者由金屬形成,例如不鏽鋼。基座4304、負致動器信號連接件4302及正致動器信號連接件4314之各者上之連接墊4322經組態以電耦接控制信號及接地以使用包含本文中所描述之技術的技術致動雙壓電晶片致動器4306。針對一些實施例,連接墊4322係鍍金的。圖44繪示根據一實施例之SMA致動器之一子區段。針對一些實施例,在不鏽鋼層上形成鍍金墊以進行焊料接合或其他已知電端接方法。此外,成形線接合墊用於信號接頭以電耦接用於電力信號之SMA線。Figure 42 shows an exploded view of an SMA system including an SMA bimorph actuator 4202 according to one embodiment. According to various embodiments, the SMA system is configured to use a single metal material and a non-conductive adhesive to create one or more circuits to independently power the SMA wires. Some embodiments have no AF size effect and include 4 bimorph actuators, such as the bimorph actuators described herein. Two of the bimorph actuators were configured as positive z-stroke actuators and the other two were configured as negative z-stroke actuators. Figure 43 depicts an exploded view of a subsection of an SMA actuator according to one embodiment. The subsection includes a negative actuator signal connection 4302 , a base 4304 with a bimorph actuator 4306 . The negative actuator signal connection 4302 includes wire bond pads 4308 for connecting the SMA wires of a bimorph actuator 4306 using techniques including techniques described herein. The negative actuator signal connection 4302 is attached to the base 4304 using an adhesive layer 4310 . This subsection also includes a positive actuator signal connection 4314 with a wire bond pad 4316 for connecting a bimorph actuator using techniques including those described herein. One of the devices 4306 is an SMA wire 4312. The positive actuator signal connection 4314 is attached to the base 4304 using an adhesive layer 4318 . Each of base 4304, negative actuator signal connection 4302, and positive actuator signal connection 4314 are formed from metal, such as stainless steel. The connection pads 4322 on each of the base 4304, negative actuator signal connection 4302, and positive actuator signal connection 4314 are configured to electrically couple control signals and ground for use using a system that includes the techniques described herein. Technology actuates the bimorph actuator 4306. For some embodiments, connection pads 4322 are gold plated. Figure 44 depicts a sub-section of an SMA actuator according to one embodiment. For some embodiments, gold plated pads are formed on the stainless steel layer for solder bonding or other known electrical termination methods. Additionally, shaped wire bond pads are used for signal contacts to electrically couple SMA wires for power signals.

圖45繪示根據一實施例之一5軸感測器移位系統。5軸感測器移位系統經組態以相對於一或多個透鏡在5軸上移動一物件,諸如一影像感測器。此包含X/Y/Z軸平移及縱傾/側滾傾斜。視情況,該系統經組態以僅使用4軸,且X/Y軸平移及縱傾/側滾傾斜連同頂部上之一單獨AF一起進行Z運動。其他實施例包含經組態以相對於一影像感測器移動一或多個透鏡之5軸感測器移位系統。針對一些實施例,靜態透鏡堆疊經安裝於頂蓋上且插入ID內部(不接觸內部之橙色移動托架)。Figure 45 illustrates a 5-axis sensor displacement system according to one embodiment. The 5-axis sensor shift system is configured to move an object, such as an image sensor, in 5 axes relative to one or more lenses. This includes X/Y/Z axis translation and pitch/roll tilt. Optionally, the system is configured to use only 4 axes, with X/Y translation and pitch/roll tilt for Z motion along with a single AF on top. Other embodiments include 5-axis sensor shift systems configured to move one or more lenses relative to an image sensor. For some embodiments, the static lens stack is mounted on the top cover and inserted inside the ID (without touching the orange mobile bracket inside).

圖46繪示根據一實施例之一5軸感測器移位系統的一分解視圖。5軸感測器移位系統包含2個電路組件:一撓性感測器電路4602、雙壓電晶片致動器電路4604;及使用包含本文中所描述之技術的技術建置至雙壓電晶片電路組件上之8至12個雙壓電晶片致動器4606。5軸感測器移位系統包含經組態以固持一或多個透鏡之移動托架4608及一外殼4610。根據一實施例,雙壓電晶片致動器電路4604包含8至12個SMA致動器,諸如本文中所描述之SMA致動器。SMA致動器經組態以在類似於本文中所描述之其他5軸系統之5軸上移動移動托架4608,諸如在x方向、在y方向、在z方向、縱傾及側滾。Figure 46 depicts an exploded view of a 5-axis sensor displacement system according to one embodiment. The 5-axis sensor displacement system consists of 2 circuit components: a flexible sensor circuit 4602, bimorph actuator circuit 4604; and built into the bimorph using techniques including those described herein 8 to 12 bimorph actuators 4606 on the circuit assembly. The 5-axis sensor displacement system includes a moving carriage 4608 and a housing 4610 configured to hold one or more lenses. According to one embodiment, the bimorph actuator circuit 4604 includes 8 to 12 SMA actuators, such as the SMA actuators described herein. The SMA actuators are configured to move the mobile carriage 4608 in 5 axes similar to other 5-axis systems described herein, such as in the x-direction, in the y-direction, in the z-direction, pitch and roll.

圖47繪示根據一實施例之包含整合至此電路中以進行所有運動之雙壓電晶片致動器之一SMA致動器。一SMA致動器之實施例可包含8至12個雙壓電晶片致動器4606。然而,其他實施例可包含更多或更少雙壓電晶片致動器4606。圖48繪示根據一實施例之包含整合至此電路中以進行所有運動之雙壓電晶片致動器之一SMA致動器4802,SMA致動器4802部分地形成為配備於一對應外殼4804內部。圖49繪示根據一實施例之一5軸感測器移位系統的一橫截面。Figure 47 shows an SMA actuator including a bimorph actuator integrated into this circuit for all motions, according to one embodiment. An embodiment of an SMA actuator may include 8 to 12 bimorph actuators 4606 . However, other embodiments may include more or fewer bimorph actuators 4606 . FIG. 48 shows an SMA actuator 4802 including a bimorph actuator integrated into this circuit for all motions, partly formed to fit inside a corresponding housing 4804, according to one embodiment. Figure 49 depicts a cross-section of a 5-axis sensor displacement system according to one embodiment.

圖50繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器5002。SMA致動器5002經組態以使用4側安裝SMA雙壓電晶片致動器5004來在x及y方向移動一影像感測器、透鏡或其他各種有效負載。圖51繪示包含在不同的x及y位置中移動一影像感測器、透鏡或其他各種有效負載之雙壓電晶片致動器之一SMA致動器的一俯視圖。FIG. 50 illustrates an SMA actuator 5002 including a bimorph actuator, according to one embodiment. The SMA actuator 5002 is configured to move an image sensor, lens or other various payloads in the x and y directions using the 4-side mounted SMA bimorph actuator 5004. 51 shows a top view of an SMA actuator comprising a bimorph actuator that moves an image sensor, lens, or other various payloads in different x and y positions.

圖52繪示根據一實施例之包含經組態為一盒式雙壓電晶片自動聚焦裝置之雙壓電晶片致動器5202之一SMA致動器。四個頂部及底部安裝SMA雙壓電晶片致動器(諸如本文中所描述之SMA雙壓電晶片致動器)經組態以一起移動以在z衝程方向產生移動以進行自動聚焦運動。圖53繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器,且兩個頂部安裝雙壓電晶片致動器5302經組態以下推一或多個透鏡。圖54繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器,且兩個底部安裝雙壓電晶片致動器5402經組態以上推一或多個透鏡。圖55繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器以展示四個頂部及底部安裝SMA雙壓電晶片致動器5502 (諸如本文中所描述之SMA雙壓電晶片致動器)用來移動一或多個透鏡以產生傾斜運動。FIG. 52 illustrates an SMA actuator including a bimorph actuator 5202 configured as a cartridge bimorph autofocus device, according to one embodiment. Four top and bottom mounted SMA bimorph actuators, such as the SMA bimorph actuators described herein, are configured to move together to generate movement in the z-stroke direction for autofocus motion. Figure 53 illustrates an SMA actuator comprising a bimorph actuator with two top mounted bimorph actuators 5302 configured to push down one or more lenses according to one embodiment. Figure 54 illustrates an SMA actuator comprising a bimorph actuator with two bottom mounted bimorph actuators 5402 configured to push up one or more lenses, according to one embodiment. 55 depicts an SMA actuator including a bimorph actuator to show four top and bottom mounted SMA bimorph actuators 5502 (such as the SMA bimorph described herein) according to one embodiment. Electric wafer actuator) is used to move one or more lenses to produce tilting motion.

圖56繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器。針對一些實施例,雙軸透鏡移位OIS經組態以在X/Y軸上移動一透鏡。針對一些實施例,Z軸移動來自一單獨AF,諸如本文中所描述之AF。4個雙壓電晶片致動器推動自動聚焦裝置之側以進行OIS運動。圖57繪示根據一實施例之包含一SMA致動器5802之SMA系統的一分解視圖,SMA致動器5802包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器5806。圖58繪示根據一實施例之包含一SMA致動器5802之SMA系統的一橫截面,SMA致動器5802包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器5806。圖59繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器5802,盒式雙壓電晶片致動器5802經組態為在其經成形為配備於該系統中之前被製造之一雙軸透鏡移位OIS。此一系統可經組態為具有高OIS衝程OIS (例如,+/-200 um或更高)。此外,此等實施例經組態以使用諸如POM滑動軸承之4個滑動軸承而具有一寬運動範圍及良好OIS動態傾斜。該等實施例經組態以容易地與AF設計(例如,VCM或SMA)整合在一起。Figure 56 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator configured as a biaxial lens shift OIS, according to one embodiment. For some embodiments, the dual-axis lens shift OIS is configured to move a lens in the X/Y axis. For some embodiments, the Z-axis movement is from a separate AF, such as the AF described herein. 4 bimorph actuators push the sides of the autofocus unit for OIS movement. 57 depicts an exploded view of an SMA system including an SMA actuator 5802 including a bimorph actuator 5806 configured as a biaxial lens shift OIS, according to one embodiment. . Figure 58 illustrates a cross-section of an SMA system comprising an SMA actuator 5802 comprising a bimorph actuator 5806 configured as a biaxial lens shift OIS, according to one embodiment . FIG. 59 illustrates a cartridge bimorph actuator 5802 for use in an SMA system configured to fit in the system when it is formed, according to one embodiment. One of the biaxial lens shift OIS was manufactured before. Such a system can be configured to have a high OIS excursion OIS (eg, +/- 200 um or higher). Furthermore, the embodiments are configured to have a wide range of motion and good OIS dynamic tilt using 4 slide bearings such as POM slide bearings. These embodiments are configured to be easily integrated with AF designs such as VCM or SMA.

圖60繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一5軸透鏡移位OIS及自動聚焦裝置之雙壓電晶片致動器。針對一些實施例,5軸透鏡移位OIS及自動聚焦裝置經組態以在X/Y/Z軸上移動一透鏡。針對一些實施例,縱傾及側傾(yaw)軸運動用於動態傾斜調諧能力。使用本文中所描述之技術,8個雙壓電晶片致動器用來提供針對自動聚焦裝置及OIS的運動。圖61繪示根據一實施例之包含一SMA致動器6202之SMA系統的一分解視圖,SMA致動器6202包含根據一實施例經組態為一5軸透鏡移位OIS及自動聚焦裝置之雙壓電晶片致動器6204。圖62繪示根據一實施例之包含一SMA致動器6202之SMA系統的一橫截面,SMA致動器6202包含經組態為一5軸透鏡移位OIS及自動聚焦裝置之雙壓電晶片致動器6204。圖63繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器6202,盒式雙壓電晶片致動器6202經組態為在其經成形為配備於該系統中之前被製造之一5軸透鏡移位OIS及自動聚焦裝置。此一系統可經組態為具有高OIS衝程OIS (例如,+/-200 um或更高)及一高自動聚焦衝程(例如,400 um或更高)。此外,此等實施例能夠解諧任何傾斜且消除對一單獨自動聚焦總成之需要。Figure 60 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator configured as a 5-axis lens shift OIS and autofocus device, according to one embodiment. For some embodiments, the 5-axis lens shift OIS and autofocus device is configured to move a lens in X/Y/Z axes. For some embodiments, pitch and roll (yaw) axis motion is used for dynamic pitch tuning capabilities. Using the techniques described herein, 8 bimorph actuators were used to provide motion for the autofocus device and OIS. 61 depicts an exploded view of an SMA system including an SMA actuator 6202 including a 5-axis lens shift OIS and autofocus device configured according to an embodiment. Bimorph Actuator 6204. Figure 62 depicts a cross-section of an SMA system comprising an SMA actuator 6202 comprising a bimorph configured as a 5-axis lens shift OIS and autofocus device, according to one embodiment Actuator 6204. FIG. 63 illustrates a cartridge bimorph actuator 6202 for use in an SMA system configured to fit in the system when it is formed, according to one embodiment. One of the previously manufactured 5-axis lens shift OIS and autofocus devices. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 200 um or higher) and a high autofocus stroke (eg, 400 um or higher). Furthermore, these embodiments are able to detune any tilt and eliminate the need for a separate autofocus assembly.

圖64繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一外推盒之雙壓電晶片致動器。針對一些實施例,雙壓電晶片致動器總成經組態以纏繞於諸如一透鏡托架之一物件周圍。由於電路總成隨透鏡托架一起移動,因此一撓性部分經組態以用於低X/Y/Z剛性。該電路之尾部墊係靜態的。外推盒可經組態以用於4個或8個雙壓電晶片致動器兩者。因此,外推盒可經組態為位於OIS側上且在X及Y軸上移動之一4雙壓電晶片致動器。外推盒可經組態為在頂部及底部上之一4雙壓電晶片致動器以在z軸上移動時自動聚焦。外推盒可經組態為位於OIS及自動聚焦裝置之頂部、底部及側上且在x、y及z軸上移動及能夠進行3軸傾斜(縱傾/側滾/側傾)之一8雙壓電晶片致動器。圖65繪示根據一實施例之包含一SMA致動器6602之一SMA系統的一分解視圖,SMA致動器6602包含經組態為一外推盒之雙壓電晶片致動器6604。因此,SMA致動器經組態使得雙壓電晶片致動器作用於外殼6504上以使用本文中所描述之技術移動透鏡托架6506。圖66繪示根據一實施例之包含一SMA致動器6602之一SMA系統,SMA致動器6602包含經組態以部分地成形為接納一透鏡托架6603之一外推盒之雙壓電晶片致動器。圖67繪示根據一實施例之包含一SMA致動器6602之一SMA系統,SMA致動器6602包含經組態為在其經成形為配備於該系統中之前被製造之一外推盒之雙壓電晶片致動器6604。Figure 64 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator configured as an extrapolation box, according to one embodiment. For some embodiments, the bimorph actuator assembly is configured to wrap around an object, such as a lens holder. A flexible section is configured for low X/Y/Z stiffness since the circuit assembly moves with the lens holder. The tail pads of this circuit are static. The extrapolation box can be configured for both 4 or 8 bimorph actuators. Thus, the extrapolation box can be configured as a 4-bimorph actuator located on the OIS side and moving in the X and Y axes. The extrapolate box can be configured as a 4-bimorph actuator on the top and bottom to autofocus when moving in the z-axis. Extrapolation boxes can be configured to sit on the top, bottom and sides of OIS and autofocus devices and move in x, y and z axes and capable of one of 3 axes of tilt (pitch/roll/roll)8 Bimorph actuator. 65 shows an exploded view of an SMA system including an SMA actuator 6602 including a bimorph actuator 6604 configured as an extrapolation box, according to one embodiment. Accordingly, the SMA actuator is configured such that the bimorph actuator acts on the housing 6504 to move the lens carrier 6506 using the techniques described herein. FIG. 66 illustrates an SMA system including an SMA actuator 6602 comprising a bimorph configured to receive a pusher box partially shaped to receive a lens holder 6603, according to one embodiment. wafer actuator. Figure 67 illustrates an SMA system comprising an SMA actuator 6602 comprising an extrapod configured to be manufactured before it is shaped to fit in the system, according to one embodiment. Bimorph Actuator 6604.

圖68繪示根據一實施例之包含一SMA致動器6802之一SMA系統,SMA致動器6802包含經組態為一3軸感測器移位OIS之雙壓電晶片致動器6806。針對一些實施例,z軸移動來自一單獨自動聚焦系統。4個雙壓電晶片致動器經組態以使用本文中所描述之技術推動一感測器托架6804之側以提供針對OIS的運動。圖69繪示根據一實施例之包含一SMA致動器6802之SMA的一分解視圖,SMA致動器6802包含經組態為一3軸感測器移位OIS之雙壓電晶片致動器6806。圖70繪示根據一實施例之包含一SMA致動器6802之SMA系統的一橫截面,SMA致動器6802包含經組態為一3軸感測器移位OIS之雙壓電晶片致動器6806。圖71繪示根據一實施例之用於一SMA系統中之一盒式雙壓電晶片致動器6802組件,該盒式雙壓電晶片致動器6802組件經組態為在其經成形為配備於該系統中之前被製造之一3軸感測器移位OIS。圖72繪示根據一實施例之用於一SMA系統中之一撓性感測器電路,該撓性感測器電路經組態為一3軸感測器移位OIS。此一系統可經組態為具有高OIS衝程OIS (例如,+/-200 um或更高)及一高自動聚焦衝程(例如,400 um或更高)。此外,此等實施例經組態以使用諸如POM滑動軸承之4個滑動軸承而具有一寬雙軸運動範圍及良好OIS動態傾斜。該等實施例經組態以容易地與AF設計(例如,VCM或SMA)整合在一起。Figure 68 illustrates an SMA system comprising an SMA actuator 6802 comprising a bimorph actuator 6806 configured as a 3-axis sensor shift OIS, according to one embodiment. For some embodiments, the z-axis movement comes from a separate autofocus system. 4 bimorph actuators were configured to push the side of a sensor bracket 6804 to provide motion for OIS using techniques described herein. Figure 69 depicts an exploded view of an SMA including an SMA actuator 6802 comprising a bimorph actuator configured as a 3-axis sensor shift OIS, according to one embodiment 6806. 70 illustrates a cross-section of an SMA system including an SMA actuator 6802 comprising a bimorph actuated configured as a 3-axis sensor shift OIS, according to one embodiment. device 6806. FIG. 71 illustrates a cartridge bimorph actuator 6802 assembly for use in an SMA system, the cartridge bimorph actuator 6802 assembly configured so that it is formed as A 3-axis sensor shift OIS was equipped in the system previously manufactured. 72 illustrates a flexible sensor circuit for use in an SMA system configured as a 3-axis sensor shift OIS, according to one embodiment. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 200 um or higher) and a high autofocus stroke (eg, 400 um or higher). Furthermore, these embodiments are configured to have a wide dual axis range of motion and good OIS dynamic tilt using 4 slide bearings such as POM slide bearings. These embodiments are configured to be easily integrated with AF designs such as VCM or SMA.

圖73繪示根據一實施例之包含一SMA致動器之一SMA系統,SMA致動器包含經組態為一6軸感測器移位OIS及自動聚焦裝置之雙壓電晶片致動器7404。針對一些實施例,6軸感測器移位OIS及自動聚焦裝置經組態以在X/Y/Z/縱傾/側傾/側滾軸上移動一透鏡。針對一些實施例,縱傾及側傾軸運動用於動態傾斜調諧能力。使用本文中所描述之技術,8個雙壓電晶片致動器用來提供針對自動聚焦裝置及OIS的運動。圖74繪示根據一實施例之包含一SMA致動器7402之SMA系統的一分解視圖,SMA致動器7402包含經組態為一6軸感測器移位OIS及自動聚焦裝置之雙壓電晶片致動器7404。圖75繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面,SMA致動器7402包含經組態為一6軸感測器移位OIS及自動聚焦裝置之雙壓電晶片致動器。圖76繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器7402,盒式雙壓電晶片致動器7402經組態為在其經成形為配備於該系統中之前被製造之一6軸感測器移位OIS及自動聚焦裝置。圖77繪示根據一實施例之用於一SMA系統中之一撓性感測器電路,該撓性感測器電路經組態為一3軸感測器移位OIS。此一系統可經組態為具有高OIS衝程OIS (例如,+/-200 um或更高)及一高自動聚焦衝程(例如,400 um或更高)。此外,此等實施例能夠解諧任何傾斜且消除對一單獨自動聚焦總成之需要。73 illustrates an SMA system including an SMA actuator comprising a bimorph actuator configured as a 6-axis sensor shift OIS and autofocus device, according to one embodiment. 7404. For some embodiments, the 6-axis sensor shift OIS and autofocus device is configured to move a lens on the X/Y/Z/pitch/roll/roll axes. For some embodiments, pitch and roll axis motion is used for dynamic pitch tuning capabilities. Using the techniques described herein, 8 bimorph actuators were used to provide motion for the autofocus device and OIS. 74 depicts an exploded view of an SMA system including an SMA actuator 7402 including dual pressure configured as a 6-axis sensor shift OIS and autofocus device, according to one embodiment. Electric wafer actuator 7404. 75 depicts a cross-section of an SMA system including an SMA actuator 7402 comprising a bimorph configured as a 6-axis sensor shift OIS and autofocus device, according to one embodiment. wafer actuator. 76 illustrates a cartridge bimorph actuator 7402 for use in an SMA system configured to fit in the system when it is formed, according to one embodiment. One of the previously manufactured 6-axis sensor shift OIS and autofocus devices. 77 illustrates a flexible sensor circuit for use in an SMA system configured as a 3-axis sensor shift OIS, according to one embodiment. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 200 um or higher) and a high autofocus stroke (eg, 400 um or higher). Furthermore, these embodiments are able to detune any tilt and eliminate the need for a separate autofocus assembly.

圖78繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一雙軸相機傾斜OIS之雙壓電晶片致動器。針對一些實施例,雙軸相機傾斜OIS經組態以在縱傾/側傾軸上移動一相機。使用本文中所描述之技術,4個雙壓電晶片致動器用來推動自動聚焦裝置之頂部及底部以獲得OIS縱傾及側傾運動的整個相機運動。圖79繪示根據一實施例之包含一SMA致動器7902之SMA系統的一分解視圖,SMA致動器7902包含經組態為一雙軸相機傾斜OIS之雙壓電晶片致動器7904。圖80繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面,該SMA致動器包含經組態為一雙軸相機傾斜OIS之雙壓電晶片致動器。圖81繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器,該盒式雙壓電晶片致動器經組態為在成形為配備於該系統中之前被製造之一雙軸相機傾斜OIS。圖82繪示根據一實施例之用於一SMA系統中之一撓性感測器電路,該撓性感測器電路經組態為一雙軸相機傾斜OIS。此一系統可經組態為具有高OIS衝程OIS (例如,正/負3度或更高)。該等實施例經組態以容易地與自動聚焦(「AF」)設計(例如,VCM或SMA)整合在一起。Figure 78 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator configured as a two-axis camera tilt OIS, according to one embodiment. For some embodiments, the dual-axis camera tilt OIS is configured to move a camera on the pitch/roll axis. Using the techniques described herein, 4 bimorph actuators are used to push the top and bottom of the autofocus device to obtain the entire camera motion for OIS pitch and roll motion. 79 shows an exploded view of an SMA system including an SMA actuator 7902 including a bimorph actuator 7904 configured as a two-axis camera tilt OIS, according to one embodiment. 80 depicts a cross-section of an SMA system comprising an SMA actuator comprising a bimorph actuator configured as a two-axis camera tilt OIS, according to one embodiment. 81 depicts a cartridge bimorph actuator for use in an SMA system configured to be mounted before being formed into the system, according to one embodiment. Manufacture one dual axis camera tilt OIS. 82 illustrates a flexible sensor circuit for use in an SMA system configured as a two-axis camera tilt OIS, according to one embodiment. Such a system can be configured to have a high OIS excursion OIS (eg, plus/minus 3 degrees or more). The embodiments are configured to be easily integrated with autofocus ("AF") designs (eg, VCM or SMA).

圖83繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一3軸相機傾斜OIS之雙壓電晶片致動器。針對一些實施例,三軸相機傾斜OIS經組態以在縱傾/側傾/側滾軸上移動一相機。使用本文中所描述之技術,4個雙壓電晶片致動器用來推動自動聚焦裝置之頂部及底部以獲得OIS縱傾及側傾運動的整個相機運動,且使用本文中所描述之技術,4個雙壓電晶片致動器用來推動自動聚焦裝置之側以獲得OIS側滾運動之整個相機運動。圖84繪示根據一實施例之包含一SMA致動器8402之SMA系統的一分解視圖,SMA致動器8402包含經組態為一3軸相機傾斜OIS之雙壓電晶片致動器8404。圖85繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面,該SMA致動器包含經組態為一3軸相機傾斜OIS之雙壓電晶片致動器。圖86繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器,該盒式雙壓電晶片致動器經組態為在其經成形為配備於該系統中之前被製造之一3軸相機傾斜OIS。圖87繪示根據一實施例之用於一SMA系統中之一撓性感測器電路,該撓性感測器電路經組態為一3軸相機傾斜OIS。此一系統可經組態為具有高OIS衝程OIS (例如,正/負3度或更高)。該等實施例經組態以容易地與AF設計(例如,VCM或SMA)整合在一起。Figure 83 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator configured as a 3-axis camera tilt OIS, according to one embodiment. For some embodiments, the three-axis camera tilt OIS is configured to move a camera on the pitch/roll/roll axis. Using the technique described in this article, 4 bimorph actuators are used to push the top and bottom of the autofocus device to obtain the entire camera movement of OIS pitch and roll motion, and using the technique described in this article, 4 A bimorph actuator is used to push the side of the autofocus unit to obtain the full camera motion for the OIS roll motion. Figure 84 shows an exploded view of an SMA system including an SMA actuator 8402 including a bimorph actuator 8404 configured as a 3-axis camera tilt OIS, according to one embodiment. 85 depicts a cross-section of an SMA system comprising an SMA actuator comprising a bimorph actuator configured as a 3-axis camera tilt OIS, according to one embodiment. Figure 86 illustrates a cartridge bimorph actuator for use in an SMA system configured to fit in the system when it is shaped, according to one embodiment One of the 3-axis cameras with tilt OIS was manufactured before. 87 illustrates a flexible sensor circuit for use in an SMA system configured as a 3-axis camera tilt OIS, according to one embodiment. Such a system can be configured to have a high OIS excursion OIS (eg, plus/minus 3 degrees or more). These embodiments are configured to be easily integrated with AF designs such as VCM or SMA.

圖88繪示根據實施例之一SMA致動器之一雙壓電晶片致動器之實例性尺寸。該等尺寸係較佳實施例,但熟習此項技術者將理解,可基於一SMA致動器之所欲特性使用其他尺寸。FIG. 88 illustrates exemplary dimensions of a bimorph actuator of an SMA actuator according to an embodiment. These dimensions are preferred embodiments, but those skilled in the art will understand that other dimensions may be used based on the desired characteristics of an SMA actuator.

圖89繪示根據一實施例之用於一折疊式相機的一透鏡系統。該折疊式相機包含一折疊透鏡8902,折疊透鏡8902經組態以將光彎曲至包含一或多個透鏡8903a至8903d的一透鏡系統8901。針對一些實施例,該折疊透鏡係一稜鏡及透鏡之任何一或多者。透鏡系統8901經組態為具有一主軸8904,主軸8904相對於一透射軸8906成一角度,透射軸8906平行於光到達折疊透鏡8902之前的行進方向。例如,在一相機電話系統中使用一折疊式相機以減小一透鏡系統8901在一透射軸8906方向之高度。Figure 89 illustrates a lens system for a folded camera according to an embodiment. The folded camera includes a folded lens 8902 configured to bend light to a lens system 8901 comprising one or more lenses 8903a-8903d. For some embodiments, the folding lens is any one or more of a lens and a lens. The lens system 8901 is configured to have a primary axis 8904 that is angled relative to a transmission axis 8906 that is parallel to the direction of travel of light before reaching the folded lens 8902 . For example, a folded camera is used in a camera phone system to reduce the height of a lens system 8901 in the direction of a transmission axis 8906 .

透鏡系統之實施例包含一或多個液體透鏡,諸如本文中所描述之液體透鏡。圖89中所繪示之實施例包含兩個液體透鏡8903b、8903d,諸如本文中所描述之液體透鏡。一或多個液體透鏡8903b、8903d經組態以使用包含本文中所描述之技術的技術來致動。使用致動器致動一液體透鏡,包含但不限於帶扣致動器、雙壓電晶片致動器及其他SMA致動器。圖108繪示根據一實施例之使用帶扣致動器60致動之一液體透鏡。該液體透鏡包含一成形環耦接器64、一液體透鏡總成61、一或多個帶扣致動器60 (諸如本文中所描述之帶扣致動器)、一滑動基座65及一基座62。一或多個帶扣致動器60經組態以移動成形環/耦接器64以改變液體透鏡總成61之一撓性隔膜之形狀以使光線移動或成形,例如如本文中所描述。針對一些實施例,使用3或4個致動器。一液體透鏡可獨自地或組合其他透鏡組態以充當一自動聚焦裝置或光學影像穩定器。一液體透鏡亦可經組態以依其他方式將一影像引導至一影像感測器上。Embodiments of the lens system include one or more liquid lenses, such as the liquid lenses described herein. The embodiment depicted in Figure 89 includes two liquid lenses 8903b, 8903d, such as those described herein. One or more liquid lenses 8903b, 8903d are configured to be actuated using techniques including those described herein. A liquid lens is actuated using actuators, including but not limited to buckle actuators, bimorph actuators, and other SMA actuators. FIG. 108 illustrates a liquid lens actuated using buckle actuator 60 according to one embodiment. The liquid lens includes a forming ring coupler 64, a liquid lens assembly 61, one or more buckle actuators 60 (such as the buckle actuators described herein), a slide base 65, and a Base 62. One or more buckle actuators 60 are configured to move the shaping ring/coupler 64 to change the shape of the flexible membrane of the liquid lens assembly 61 to move or shape light, eg, as described herein. For some embodiments, 3 or 4 actuators are used. A liquid lens can act alone or in combination with other lens configurations to act as an autofocus device or optical image stabilizer. A liquid lens can also be configured to otherwise direct an image onto an image sensor.

圖90繪示一透鏡系統9001之若干實施例,透鏡系統9001包含液體透鏡9002a至9002h以將一影像聚焦於一影像感測器9004上。如所繪示,液體透鏡9002a至9002h可包含任何透鏡形狀且經組態以使用包含本文中所描述之技術的技術動態地調整穿過透鏡之光路徑。FIG. 90 illustrates several embodiments of a lens system 9001 comprising liquid lenses 9002a through 9002h to focus an image on an image sensor 9004. As shown, the liquid lenses 9002a-9002h may comprise any lens shape and be configured to dynamically adjust the path of light through the lens using techniques including those described herein.

用於一折疊式相機的一透鏡系統經組態為包含一致動式折疊透鏡9100。一致動式折疊透鏡之一實例係一傾斜稜鏡,諸如圖91中所繪示之傾斜稜鏡。在圖91中所繪示之實例中,折疊透鏡係安置於一致動器9104上之一稜鏡9102。該致動器包含但不限於一SMA致動器,包含本文中所描述之SMA致動器。針對一些實施例,該傾斜稜鏡經安置於包含4個雙壓電晶片致動器9106之一SMA致動器上,諸如本文中所描述之雙壓電晶片致動器。根據一些實施例,使用包含本文中所描述之技術的技術,致動式折疊透鏡9100經組態為一光學影像穩定器。例如,一致動式折疊透鏡經組態為包含一SMA系統,諸如圖39中所繪示之SMA系統。一致動式折疊透鏡之另一實例可包含一SMA致動器,諸如圖21中所繪示之SMA致動器。然而,折疊透鏡亦可包含其他致動器。A lens system for a folded camera is configured to include an actuated fold lens 9100 . An example of an actuated fold lens is a tilted lens, such as the one depicted in FIG. 91 . In the example depicted in FIG. 91 , the folded lens is mounted on an actuator 9104 in a pan 9102 . The actuator includes, but is not limited to, an SMA actuator, including the SMA actuators described herein. For some embodiments, the tilt plate is mounted on an SMA actuator comprising 4 bimorph actuators 9106, such as the bimorph actuators described herein. According to some embodiments, the actuated folded lens 9100 is configured as an optical image stabilizer using techniques including those described herein. For example, an actuated folded lens is configured to include an SMA system, such as the one depicted in FIG. 39 . Another example of an actuated folded lens may include an SMA actuator, such as the one depicted in FIG. 21 . However, the fold lens may also include other actuators.

圖92繪示根據一實施例之具有一偏移之一雙壓電晶片臂。雙壓電晶片臂9201包含具有一長度9208及一成形偏移9203之一雙壓電晶片樑9202。與沒有一偏移之一雙壓電晶片臂相比,成形偏移9203增加機械優勢以產生一更高力。根據一些實施例,偏移9204之深度(在本文中亦稱為彎曲平面z偏移9204)及偏移9206之長度(在本文中亦稱為槽寬度9206)經組態以定義雙壓電晶片臂之特性,例如峰值力。例如,圖106中之曲線圖繪示根據一實施例之彎曲平面z偏移9204、槽寬度9206與一雙壓電晶片樑9202之峰值力之間的關係。Figure 92 illustrates a bimorph arm with an offset, according to one embodiment. The bimorph arm 9201 includes a bimorph beam 9202 having a length 9208 and a shaped offset 9203 . The shaped offset 9203 adds mechanical advantage to produce a higher force compared to a bimorph arm without an offset. According to some embodiments, the depth of offset 9204 (also referred to herein as curved plane z offset 9204) and the length of offset 9206 (also referred to herein as slot width 9206) are configured to define a bimorph Properties of the arm, such as peak force. For example, the graph in FIG. 106 illustrates the relationship between bending plane z-offset 9204, slot width 9206, and peak force of a bimorph beam 9202 according to one embodiment.

雙壓電晶片臂包含諸如一SMA帶或SMA線9210之一或多種SMA材料,諸如本文中所描述之SMA材料。使用包含本文中所描述之技術的技術將SMA材料附裝至該樑。針對一些實施例,將諸如一SMA線9210之SMA材料附裝至雙壓電晶片臂之一固定端9212及雙壓電晶片臂之一負載點端9214,使得成形偏移9203在附裝SMA材料之兩端之間。針對各項實施例,SMA材料之端與經組態以使用包含此項技術中已知之技術的技術將電流供應至SMA材料之接觸件電耦接及機械耦接。具有一偏移之雙壓電晶片臂可包含於諸如本文中所描述之SMA致動器及系統之SMA致動器及系統中。The bimorph arms comprise one or more SMA materials, such as an SMA tape or SMA wire 9210, such as those described herein. The SMA material was attached to the beam using techniques including those described herein. For some embodiments, SMA material such as an SMA wire 9210 is attached to a fixed end 9212 of the bimorph arm and a point-of-load end 9214 of the bimorph arm such that the formed offset 9203 is attached to the SMA material between the two ends. For various embodiments, the ends of the SMA material are electrically and mechanically coupled to contacts configured to supply current to the SMA material using techniques including techniques known in the art. Bimorph arms with an offset can be included in SMA actuators and systems such as those described herein.

圖93繪示根據一實施例之具有一偏移及一限制器之一雙壓電晶片臂。雙壓電晶片臂9301包含具有一成形偏移9303及相鄰於成形偏移9303之一限制器9304之一雙壓電晶片樑9302。與沒有一偏移之雙壓電晶片臂9301相比,偏移9303增加機械優勢以產生一更高力且限制器9304防止該臂在遠離雙壓電晶片致動器之未固定、負載點端9306之方向運動。具有一成形偏移9303及限制器9304之雙壓電晶片臂9301可包含於諸如本文中所描述之SMA致動器及系統的SMA致動器及系統中。雙壓電晶片臂9301包含諸如一SMA帶或SMA線9308之一或多種SMA材料,諸如使用包含本文中所描述之技術的技術附裝至雙壓電晶片臂9301之本文中所描述之SMA材料。Figure 93 illustrates a bimorph arm with an offset and a limiter, according to one embodiment. The bimorph arm 9301 includes a bimorph beam 9302 having a shaped offset 9303 and a limiter 9304 adjacent to the shaped offset 9303 . The offset 9303 adds the mechanical advantage to produce a higher force and the limiter 9304 prevents the arm from moving away from the unsecured, point-of-load end of the bimorph actuator compared to the bimorph arm 9301 without an offset. Movement in the direction of 9306. The bimorph arm 9301 with a shaped offset 9303 and limiter 9304 can be included in SMA actuators and systems such as those described herein. The bimorph arm 9301 comprises one or more SMA materials such as an SMA tape or SMA wire 9308, such as those described herein attached to the bimorph arm 9301 using techniques including the techniques described herein .

圖94繪示根據一實施例之具有一偏移及一限制器之一雙壓電晶片臂。雙壓電晶片臂9401包含具有一成形偏移9403及相鄰於成形偏移9403之一限制器9404之一雙壓電晶片樑9402。限制器9404經形成為用於雙壓電晶片臂9401的一基座9406之部分。基座9406經組態以接納一雙壓電晶片臂9401且包含經組態以接納雙壓電晶片樑之偏移部分之一凹部9408。該凹部之底部經組態為相鄰於成形偏移9403之一限制器9404。基座9406亦可包含經組態以在雙壓電晶片臂未被致動時支撐雙壓電晶片臂之部分之一或多個部分9410。具有一成形偏移9403及限制器9404之雙壓電晶片臂9401可包含於諸如本文中所描述之SMA致動器及系統的SMA致動器及系統中。雙壓電晶片臂9401包含諸如一SMA帶或SMA線之一或多種SMA材料,諸如使用包含本文中所描述之技術的技術附裝至雙壓電晶片臂9401之本文中所描述之SMA材料。Figure 94 illustrates a bimorph arm with an offset and a limiter, according to one embodiment. The bimorph arm 9401 includes a bimorph beam 9402 having a shaped offset 9403 and a limiter 9404 adjacent to the shaped offset 9403 . The limiter 9404 is formed as part of a base 9406 for the bimorph arm 9401 . The base 9406 is configured to receive a bimorph arm 9401 and includes a recess 9408 configured to receive the offset portion of the bimorph beam. The bottom of the recess is configured as a limiter 9404 adjacent to the formed offset 9403 . The base 9406 may also include one or more portions 9410 configured to support the bimorph arm when the bimorph arm is not actuated. The bimorph arm 9401 with a shaped offset 9403 and limiter 9404 can be included in SMA actuators and systems such as those described herein. The bimorph arm 9401 comprises one or more SMA materials, such as an SMA tape or SMA wire, such as those described herein attached to the bimorph arm 9401 using techniques including the techniques described herein.

圖95繪示根據一實施例之包含具有一偏移之一雙壓電晶片臂的一基座之一實施例。雙壓電晶片臂9501包含具有一成形偏移9504之一雙壓電晶片樑9502。該雙壓電晶片臂亦可使用包含本文所描述之技術的技術之一限制器。雙壓電晶片臂9501包含諸如一SMA帶或SMA線9506之一或多種SMA材料,諸如使用包含本文中所描述之技術的技術附裝至雙壓電晶片臂9501之本文中所描述之SMA材料。Figure 95 illustrates an embodiment of a pedestal including a bimorph arm with an offset, according to an embodiment. The bimorph arm 9501 includes a bimorph beam 9502 with a shaped offset 9504 . The bimorph arm may also use a limiter including techniques described herein. The bimorph arm 9501 comprises one or more SMA materials such as an SMA tape or SMA wire 9506, such as those described herein attached to the bimorph arm 9501 using techniques including techniques described herein .

圖96繪示根據一實施例之包含具有一偏移之兩個雙壓電晶片臂的一基座9608之一實施例。各雙壓電晶片臂9601a、9601b包含具有一成形偏移9604a、9604b之一雙壓電晶片光樑9602a、9602b。各雙壓電晶片臂9601a、9601b包含諸如一SMA帶或SMA線9606a、9606b之一或多種SMA材料,諸如使用包含本文中所描述之技術的技術附裝至雙壓電晶片臂9601之本文中所描述之SMA材料。各雙壓電晶片臂9601a、9601b亦可使用包含本文中所描述之技術的技術之一限制器。一些實施例包含一基座,該基座包含使用包含本文中所描述之技術的技術形成之兩個以上雙壓電晶片臂。根據一些實施例,雙壓電晶片臂9601與基座9608一體地形成。針對其他實施例,使用包含但不限於焊料、電阻焊接、雷射焊接及黏合劑之技術,雙壓電晶片臂9601a、9601b之一或多者獨立於基座9608形成且附裝至基座9608。針對一些實施例,兩個或更多個雙壓電晶片臂9601a、9601b經組態以作用於單個物件上。此實現有能力增加施加至一物件之力。以下圖107中之曲線圖繪示作為環繞整個雙壓電晶片致動器之一盒之一近似物之一盒體積如何與每個雙壓電晶片組件之功相關之實例。使用雙壓電晶片致動器9612之一長度、雙壓電晶片致動器9610之一寬度及雙壓電晶片致動器9614之高度來近似盒體積(統稱為「盒體積」)。Figure 96 illustrates an embodiment of a base 9608 comprising two bimorph arms with an offset, according to an embodiment. Each bimorph arm 9601a, 9601b includes a bimorph beam 9602a, 9602b with a shaped offset 9604a, 9604b. Each bimorph arm 9601a, 9601b comprises one or more SMA materials, such as an SMA tape or SMA wire 9606a, 9606b, such as herein attached to the bimorph arm 9601 using techniques including those described herein. The SMA material described. Each bimorph arm 9601a, 9601b may also use one of the limiters including techniques described herein. Some embodiments include a base that includes two or more bimorph arms formed using techniques including those described herein. According to some embodiments, the bimorph arms 9601 are integrally formed with the base 9608 . For other embodiments, one or more of the bimorph arms 9601a, 9601b are formed separately from and attached to the base 9608 using techniques including, but not limited to, solder, resistance welding, laser welding, and adhesives . For some embodiments, two or more bimorph arms 9601a, 9601b are configured to act on a single object. This implementation has the ability to increase the force applied to an object. The graph in Figure 107 below shows an example of how the volume of the box, which is an approximation of a box surrounding the entire bimorph actuator, relates to the work of each bimorph component. The length of the bimorph actuator 9612, the width of the bimorph actuator 9610, and the height of the bimorph actuator 9614 were used to approximate the cartridge volume (collectively "cartridge volume").

圖97繪示根據一實施例之包含負載點延伸部之一帶扣臂。帶扣臂9701包含一樑部分9702及自樑部分9702延伸之一或多個負載點延伸部9704a、9704b。帶扣臂9701之各端9706a、9706b經組態以使用包含本文中所描述之技術的技術附裝至或一體地形成至或一板或其他基座。根據一些實施例,一或多個負載點延伸部9704a、9704b以自樑部分9702之一負載點9710a、9710b之一偏移與樑部分9702附裝或一體地形成。負載點9710a、9710b係樑部分9702之部分,其經組態以將帶扣臂9701之力傳遞至另一物件。針對一些實施例,負載點9710a、9710b係樑部分9702之中心。針對其他實施例,負載點9710a、9710b在除樑部分9702之中心之外之一位置處。一負載點延伸9704a、9704b經組態以在樑部分9702之縱軸方向自連結至樑部分9702之點朝向樑部分9702之負載點9710a、9710b延伸。針對一些實施例,負載點延伸部9704a、9704b之端延伸至樑部分9702之至少負載點9710a、9704b。帶扣臂9701包含諸如一SMA帶或SMA線9712之一或多種SMA材料,諸如本文中所描述之SMA材料。諸如一SMA線9712之SMA材料經附裝於樑部分9702之相對端處。SMA材料使用包含本文中所描述之技術的技術附裝至樑部分之相對端。針對一些實施例,負載點延伸部9704a、9704b之長度可經組態為帶扣臂9701之相關聯平坦(撤銷致動)樑部分9702之縱向長度內所含之任何長度。Figure 97 depicts a buckle arm including a point of load extension according to one embodiment. The buckle arm 9701 includes a beam portion 9702 and one or more point-of-load extensions 9704a, 9704b extending from the beam portion 9702. Each end 9706a, 9706b of the buckle arm 9701 is configured to be attached to or integrally formed with or to a board or other base using techniques including those described herein. According to some embodiments, one or more point-of-load extensions 9704a, 9704b are attached to or integrally formed with the beam portion 9702 at an offset from one of the point-of-load 9710a, 9710b of the beam portion 9702 . Load points 9710a, 9710b are portions of beam portion 9702 configured to transfer the force of buckle arm 9701 to another object. For some embodiments, the load point 9710a, 9710b is the center of the beam portion 9702. For other embodiments, the load point 9710a, 9710b is at a location other than the center of the beam portion 9702. A point of load extension 9704a, 9704b is configured to extend in the direction of the longitudinal axis of the beam portion 9702 from the point of attachment to the beam portion 9702 towards the point of load 9710a, 9710b of the beam portion 9702. For some embodiments, the ends of the point-of-load extensions 9704a, 9704b extend to at least the point-of-load 9710a, 9704b of the beam portion 9702 . Buckle arm 9701 comprises one or more SMA materials, such as an SMA tape or SMA wire 9712, such as those described herein. SMA material such as an SMA wire 9712 is attached at opposite ends of the beam portion 9702 . The SMA material was attached to the opposite end of the beam section using techniques including those described herein. For some embodiments, the length of the point-of-load extensions 9704a, 9704b may be configured to be any length contained within the longitudinal length of the associated flat (de-actuation) beam portion 9702 of the buckle arm 9701 .

圖98繪示根據一實施例之包含處於一致動位置之負載點延伸部9810之一帶扣臂9801。使用包含本文中所描述之技術的技術致動附裝至樑部分9802之相對端的SMA材料。負載點9804使帶扣臂9801能夠在沒有延伸部之情況下增加帶扣臂上之衝程範圍。因此,包含負載點延伸部之帶扣臂可實現一更大的最大垂直衝程。具有負載點延伸部之帶扣臂可包含於諸如本文中所描述之SMA致動器及系統的SMA致動器及系統中。Figure 98 depicts a buckle arm 9801 including a point of load extension 9810 in an actuated position, according to one embodiment. The SMA material attached to the opposite end of the beam portion 9802 is actuated using techniques including those described herein. The load point 9804 enables the buckle arm 9801 to increase the range of stroke on the buckle arm without extensions. Thus, a greater maximum vertical stroke can be achieved for the buckle arm including the point-of-load extension. Buckle arms with point-of-load extensions may be included in SMA actuators and systems such as those described herein.

圖99繪示根據一實施例之包含負載點延伸部之一雙壓電晶片臂。雙壓電晶片臂9901包含一樑部分9902及自該樑部分延伸之一或多個負載點延伸部9904a、9904b。雙壓電晶片臂9901之一端經組態以使用包含本文中所描述之技術的技術附裝或一體地形成至一板或其他基座。樑部分9902中與附裝或一體形成端相對之端係不固定的且可自由移動。根據一些實施例,一或多個負載點延伸部9904a、9904b以自樑部分9902之自由端之一偏移與樑部分9902附裝或一體地形成。負載點延伸部9904a、9904b經組態以在遠離包含樑部分9902之縱軸之一平面之一方向自連結至樑部分9902之點延伸。例如,負載點延伸部9904a、9904b在該樑部分之自由端在被致動時延伸之方向延伸。一雙壓電晶片臂9901之一些實施例包含具有一縱軸之一或多個負載點延伸部9904a、9904b,該縱軸與包含該樑部分之縱軸之一平面形成包含1度至90度之一角度。針對一些實施例,負載點延伸部9904a、9904b之端9910a、9910b經組態以接合經組態以被移動之一物件。Figure 99 depicts a bimorph arm including a point-of-load extension according to one embodiment. The bimorph arm 9901 includes a beam portion 9902 and one or more point-of-load extensions 9904a, 9904b extending from the beam portion. One end of the bimorph arm 9901 is configured to be attached or integrally formed to a plate or other base using techniques including those described herein. The end of the beam portion 9902 opposite the attached or integrally formed end is unfixed and free to move. According to some embodiments, one or more point-of-load extensions 9904a, 9904b are attached or integrally formed with the beam portion 9902 at an offset from one of the free ends of the beam portion 9902 . The point-of-load extensions 9904a, 9904b are configured to extend from a point of attachment to the beam portion 9902 in a direction away from a plane containing the longitudinal axis of the beam portion 9902 . For example, point of load extensions 9904a, 9904b extend in the direction that the free ends of the beam portions extend when actuated. Some embodiments of a bimorph arm 9901 include one or more point-of-load extensions 9904a, 9904b having a longitudinal axis that forms a plane that includes the longitudinal axis of the beam portion from 1 degree to 90 degrees inclusive. one angle. For some embodiments, the ends 9910a, 9910b of the point-of-load extensions 9904a, 9904b are configured to engage an object configured to be moved.

雙壓電晶片臂9901包含諸如一SMA帶或SMA線9906之一或多種SMA材料,諸如本文中所描述之SMA材料。諸如一SMA線9906之SMA材料經附裝於樑部分9902之相對端處。SMA材料使用包含本文中所描述之技術的技術附裝至樑部分9902之相對端。針對一些實施例,負載點延伸部9904a、9904b之長度可經組態為任何長度。根據一些實施例,由負載點延伸部9904a、9904b之一端9910a、9910b接合一物件之點之位置可經組態為沿樑部分9902之縱向長度之任何點。當一負載點延伸部之端之樑部分係平坦(撤銷致動)時,該樑部分上方之高度可經組態為任何高度。針對一些實施例,當雙壓電晶片臂被致動時,負載點延伸部可經組態為至少在雙壓電晶片臂之其他部分上方。The bimorph arm 9901 comprises one or more SMA materials, such as an SMA tape or SMA wire 9906, such as those described herein. SMA material such as an SMA wire 9906 is attached at opposite ends of the beam portion 9902 . The SMA material is attached to the opposite end of the beam portion 9902 using techniques including those described herein. For some embodiments, the length of the point-of-load extensions 9904a, 9904b can be configured to be any length. According to some embodiments, the location of the point where an object is joined by an end 9910a, 9910b of a point of load extension 9904a, 9904b may be configured to be any point along the longitudinal length of the beam portion 9902. When the beam portion at the end of a point-of-load extension is flat (deactivated), the height above the beam portion can be configured to be any height. For some embodiments, the point-of-load extension may be configured to be at least above other portions of the bimorph arm when the bimorph arm is actuated.

圖100繪示根據一實施例之包含處於一致動位置之負載點延伸部之一雙壓電晶片臂。使用包含本文中所描述之技術的技術致動附裝至樑部分2之相對端的SMA材料。與沒有延伸部之雙壓電晶片臂相比,負載點延伸部10使雙壓電晶片臂1能夠增加衝程力。因此,包含負載點延伸部10之雙壓電晶片臂1實現由雙壓電晶片臂1施加一更大力。具有負載點延伸部10之雙壓電晶片臂1可包含於諸如本文中所描述之SMA致動器及系統的SMA致動器及系統中。Figure 100 illustrates a bimorph arm including a point-of-load extension in an actuated position, according to one embodiment. The SMA material attached to the opposite end of the beam portion 2 is actuated using techniques including those described herein. The point-of-load extension 10 enables the bimorph arm 1 to increase the stroke force compared to a bimorph arm without the extension. Thus, the bimorph arm 1 comprising the point-of-load extension 10 enables a greater force to be exerted by the bimorph arm 1 . The bimorph arm 1 with the point-of-load extension 10 may be included in SMA actuators and systems such as those described herein.

圖101繪示根據一實施例之一SMA光學影像穩定器。SMA光學影像穩定器20包含一移動板22及一靜態板24。移動板22包含與移動板22一體地形成之彈簧臂26。針對一些實施例,移動板22及靜態板24各經形成為單一、一件式板。移動板22包含一第一SMA材料附接部分28a及一第二SMA材料附接部分28b。靜態板24包含一第一SMA材料附接部分30a及一第二SMA材料附接部分30b。各SMA材料附接部分28、30經組態以使用電阻焊接頭將諸如一SMA線之一SMA材料固定至一板。移動板22之第一SMA材料附接部分28a包含安置於其與該靜態板之一第一SMA材料附接部分30a之間的一第一SMA線32a及安置於其與靜態板24之第二SMA附接部分30b之間的一第二SMA線32b。移動板22之第二SMA材料附接部分28b包含安置於其與該靜態板之一第二SMA材料附接部分30b之間的一第三SMA線32c及安置於其與靜態板24之第一SMA附接部分30a之間的一第四SMA線32d。使用包含本文中所描述之技術的技術致動各SMA線使移動板22遠離靜態板24移動。圖102繪示根據一實施例之一移動部分之一SMA材料附接部分40。SMA材料附接部分經組態為具有電阻焊接至SMA材料附接部分40之SMA材料,諸如一SMA線41。圖103繪示根據一實施例之其中電阻焊接SMA線43附接至其之一靜態板之一SMA附接部分42。FIG. 101 illustrates an SMA optical image stabilizer according to one embodiment. The SMA optical image stabilizer 20 includes a moving plate 22 and a static plate 24 . The moving plate 22 includes a spring arm 26 integrally formed with the moving plate 22 . For some embodiments, moving plate 22 and static plate 24 are each formed as a single, one-piece plate. The moving plate 22 includes a first SMA material attachment portion 28a and a second SMA material attachment portion 28b. The static plate 24 includes a first SMA material attachment portion 30a and a second SMA material attachment portion 30b. Each SMA material attachment portion 28, 30 is configured to secure SMA material, such as an SMA wire, to a board using a resistance weld joint. The first SMA material attachment portion 28a of the moving plate 22 includes a first SMA wire 32a disposed between it and a first SMA material attachment portion 30a of the static plate and a second SMA wire 32a disposed between it and the static plate 24. A second SMA wire 32b between the SMA attachment portions 30b. The second SMA material attachment portion 28b of the moving plate 22 includes a third SMA wire 32c disposed between it and a second SMA material attachment portion 30b of the static plate and a first SMA wire 32c disposed between it and the static plate 24. A fourth SMA wire 32d between the SMA attachment portions 30a. Actuating each SMA wire moves the moving plate 22 away from the static plate 24 using techniques including those described herein. Figure 102 illustrates a SMA material attachment portion 40 of a moving portion according to one embodiment. The SMA material attachment portion is configured to have SMA material, such as an SMA wire 41 , resistively welded to the SMA material attachment portion 40 . FIG. 103 illustrates an SMA attachment portion 42 in which a resistance soldered SMA wire 43 is attached to one of its static plates, according to an embodiment.

圖104繪示根據一實施例之包含一帶扣致動器之一SMA致動器45。帶扣致動器46包含帶扣臂47,諸如本文中所描述之帶扣臂。帶扣臂47經組態以當使用包含本文中所描述之技術的技術致動及撤銷致動SMA線48時在z軸上移動。使用電阻焊接將各SMA線48附接至一各自電阻焊線壓接物部49。各電阻焊線壓接物49包含與金屬隔離之一島狀物50,島狀物50在SMA線48之至少一側上形成帶扣臂47。該島狀物結構可用於其他致動器、光學影像穩定器及自動聚焦系統中以將一SMA線之至少一側連接至形成於鹼金屬層中之一隔離島狀物結構,諸如圖101中所展示之OIS應用。Figure 104 illustrates an SMA actuator 45 comprising a buckle actuator according to one embodiment. Buckle actuator 46 includes a buckle arm 47, such as the buckle arm described herein. Buckle arm 47 is configured to move in the z-axis when actuating and deactivating SMA wire 48 using techniques including techniques described herein. Each SMA wire 48 is attached to a respective resistance bond wire crimp 49 using resistance welding. Each resistance wire crimp 49 includes an island 50 isolated from the metal that forms a buckle arm 47 on at least one side of the SMA wire 48 . The island structure can be used in other actuators, optical image stabilizers, and autofocus systems to connect at least one side of an SMA wire to an isolated island structure formed in an alkali metal layer, such as in FIG. 101 OIS application shown.

圖105繪示根據一實施例之包含用於一SMA致動器之一島狀物之一電阻焊壓接物,該SMA致動器用來使用包含本文所描述之技術的技術將一SMA線48附接至一帶扣致動器46。圖105a繪示SMA致動器45之一底部部分。根據一些實施例,SMA致動器45由一不鏽鋼基層51形成。諸如聚酰亞胺層之一介電層52經安置於不鏽鋼基層51之底部部分上。根據一些實施例,一導體層53透過介電層52中之一通孔電連接至不鏽鋼島狀物50,從而能夠在焊接至不鏽鋼島狀物50之線與附接至該不鏽鋼島狀物之導體電路之間建立電連接。根據一些實施例,自不鏽鋼基層50蝕刻一島狀物50。介電層52將島狀物50之位置維持於不鏽鋼基層51內。島狀物50經組態以使用包含本文中所描述之技術的技術(例如,電阻焊接)將一SMA線附接至其。圖105b繪示包含一島狀物50之SMA致動器45之一頂部部分。針對一些實施例,膠水或黏合劑亦可經放置於焊之頂部上以輔助機械強度且在操作及衝擊負載期間起到疲勞應變消除之作用。105 illustrates a resistance weld crimp including an island for an SMA actuator used to bond an SMA wire 48 using techniques including those described herein, according to one embodiment. Attached to belt buckle actuator 46 . FIG. 105 a shows a bottom portion of the SMA actuator 45 . According to some embodiments, the SMA actuator 45 is formed from a stainless steel base 51 . A dielectric layer 52 such as a polyimide layer is disposed on the bottom portion of the base layer 51 of stainless steel. According to some embodiments, a conductor layer 53 is electrically connected to the stainless steel island 50 through a via in the dielectric layer 52, thereby enabling a connection between a wire soldered to the stainless steel island 50 and a conductor attached to the stainless steel island. An electrical connection is established between the circuits. According to some embodiments, an island 50 is etched from the base layer of stainless steel 50 . The dielectric layer 52 maintains the position of the islands 50 within the base stainless steel 51 . Island 50 is configured to have an SMA wire attached thereto using techniques including those described herein (eg, resistance welding). FIG. 105b shows a top portion of an SMA actuator 45 comprising an island 50 . For some embodiments, glue or adhesive may also be placed on top of the welds to aid in mechanical strength and serve as fatigue strain relief during handling and impact loading.

圖108包含根據一實施例之具有帶扣致動器之一SMA致動器的一透鏡系統。該透鏡系統包含安置於一基座62上之一液體透鏡總成61。該透鏡系統亦包含與帶扣致動器60機械地耦接之一成形環/耦接器64。包含諸如本文中所描述之帶扣致動器的帶扣致動器60之SMA致動器經安置於一滑動基座65上,滑動基座65經安置於基座62上。SMA致動器經組態以藉由使用包含本文中所描述之技術的技術致動帶扣致動器60來沿液體透鏡總成61之光學軸移動成形環/耦接器64。此使成形環/耦接器64移動以改變液體透鏡總成中之液體透鏡之焦點。Figure 108 includes a lens system with an SMA actuator of a buckle actuator according to an embodiment. The lens system includes a liquid lens assembly 61 mounted on a base 62 . The lens system also includes a forming ring/coupler 64 mechanically coupled to the buckle actuator 60 . SMA actuators including buckle actuators 60 such as those described herein are mounted on a slide base 65 which is mounted on base 62 . The SMA actuator is configured to move the forming ring/coupler 64 along the optical axis of the liquid lens assembly 61 by actuating the buckle actuator 60 using techniques including the techniques described herein. This moves the shaping ring/coupler 64 to change the focal point of the liquid lens in the liquid lens assembly.

圖109繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端。一雙壓電晶片臂之未固定、負載點端70包含一平坦表面71以附裝SMA材料,諸如一SMA線72。SMA線72藉由一電阻焊73附裝至平坦表面71。電阻焊73係使用包含此項技術中已知之技術的技術形成。Figure 109 depicts one of the unsecured, point-of-load ends of a bimorph arm according to one embodiment. The unsecured, point-of-load end 70 of a bimorph arm includes a flat surface 71 for attaching SMA material, such as an SMA wire 72 . SMA wire 72 is attached to planar surface 71 by a resistance weld 73 . Resistance weld 73 is formed using techniques including those known in the art.

圖110繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端。一雙壓電晶片臂之未固定、負載點端76包含一平坦表面77以附裝SMA材料,諸如一SMA線78。SMA線78藉由類似於圖109中所繪示之電阻焊的一電阻焊附裝至平坦表面77。一黏合劑79經安置於電阻焊上。此實現SMA線78與未固定、負載點端76之間的一更可靠接頭。黏合劑79包含但不限於導電黏合劑、非導電黏合劑及此項技術中已知之其他黏合劑。Figure 110 depicts an unsecured, point-of-load end of a bimorph arm, according to one embodiment. The free, point-of-load end 76 of a bimorph arm includes a flat surface 77 for attaching SMA material, such as an SMA wire 78 . SMA wire 78 is attached to planar surface 77 by a resistance weld similar to that depicted in FIG. 109 . An adhesive 79 is placed on the resistance weld. This enables a more reliable joint between the SMA wire 78 and the unsecured, point-of-load end 76 . Adhesive 79 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

圖111繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端。一雙壓電晶片臂之未固定、負載點端80包含一平坦表面81以附裝SMA材料,諸如一SMA線82。一金屬夾層84經安置於平坦表面81上。金屬夾層84包含但不限於一金層、一鎳層或合金層。SMA線82藉由一電阻焊83附裝至安置於平坦表面81上之金屬夾層84。電阻焊83係使用包含此項技術中已知之技術的技術形成。金屬夾層84實現與未固定、負載點端80之更好黏合。Figure 111 depicts an unsecured, point-of-load end of a bimorph arm, according to one embodiment. The free, point-of-load end 80 of a bimorph arm includes a flat surface 81 for attaching SMA material, such as an SMA wire 82 . A metal interlayer 84 is disposed on the flat surface 81 . The metal interlayer 84 includes but is not limited to a gold layer, a nickel layer or an alloy layer. SMA wires 82 are attached by a resistance weld 83 to a metal interlayer 84 disposed on a flat surface 81 . Resistance weld 83 is formed using techniques including those known in the art. The metal interlayer 84 enables better adhesion to the unsecured, point-of-load end 80 .

圖112繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端。一雙壓電晶片臂之未固定、負載點端88包含一平坦表面89以附裝SMA材料,諸如一SMA線90。一金屬夾層92經安置於平坦表面89上。金屬夾層92包含但不限於一金層、一鎳層或合金層。SMA線90藉由類似於圖111中所繪示之電阻焊的一電阻焊附裝至平坦表面89。一黏合劑91經安置於電阻焊上。此實現SMA線90與未固定、負載點端88之間的一更可靠接頭。黏合劑91包含但不限於導電黏合劑、非導電黏合劑及此項技術中已知之其他黏合劑。Figure 112 depicts an unsecured, point-of-load end of a bimorph arm, according to one embodiment. The free, point-of-load end 88 of a bimorph arm includes a flat surface 89 for attaching SMA material, such as an SMA wire 90 . A metal interlayer 92 is disposed on the flat surface 89 . The metal interlayer 92 includes but is not limited to a gold layer, a nickel layer or an alloy layer. SMA wire 90 is attached to planar surface 89 by a resistance weld similar to that depicted in FIG. 111 . An adhesive 91 is placed on the resistance weld. This enables a more reliable joint between the SMA wire 90 and the unsecured, point-of-load end 88 . Adhesive 91 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

圖113繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端95包含一平坦表面96以附裝SMA材料,諸如一SMA線97。SMA線97藉由一電阻焊98附裝至平坦表面96。電阻焊98係使用包含此項技術中已知之技術的技術形成。Figure 113 depicts a fixed end of a bimorph arm according to one embodiment. The fixed end 95 of a bimorph arm includes a flat surface 96 for attaching SMA material, such as an SMA wire 97 . SMA wire 97 is attached to planar surface 96 by a resistance weld 98 . Resistance weld 98 is formed using techniques including those known in the art.

圖114繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端120包含一平坦表面121以附裝SMA材料,諸如一SMA線122。SMA線122藉由類似於圖113中所繪示之電阻焊的一電阻焊附裝至平坦表面121。一黏合劑123經安置於電阻焊上。此實現SMA線122與固定端120之間的一更可靠接頭。黏合劑123包含但不限於導電黏合劑、非導電黏合劑及此項技術中已知之其他黏合劑。Figure 114 depicts a fixed end of a bimorph arm according to one embodiment. The fixed end 120 of a bimorph arm includes a flat surface 121 for attaching SMA material, such as an SMA wire 122 . SMA wire 122 is attached to planar surface 121 by a resistance weld similar to that depicted in FIG. 113 . An adhesive 123 is placed on the resistance weld. This enables a more reliable joint between the SMA wire 122 and the fixed end 120 . Adhesive 123 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

圖115繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端126包含一平坦表面127以附裝SMA材料,諸如一SMA線128。一金屬夾層130經安置於平坦表面127上。金屬夾層130包含但不限於一金層、一鎳層或合金層。SMA線128藉由一電阻焊129附裝至安置於平坦表面127上之金屬夾層130。電阻焊129係使用包含此項技術中已知之技術的技術形成。金屬夾層130實現與固定端126之更好黏合。Figure 115 depicts a fixed end of a bimorph arm according to one embodiment. The fixed end 126 of a bimorph arm includes a flat surface 127 for attaching SMA material, such as an SMA wire 128 . A metal interlayer 130 is disposed on the flat surface 127 . The metal interlayer 130 includes but is not limited to a gold layer, a nickel layer or an alloy layer. The SMA wire 128 is attached by a resistance weld 129 to the metal interlayer 130 disposed on the flat surface 127 . Resistance weld 129 is formed using techniques including those known in the art. The metal interlayer 130 achieves better adhesion to the fixed end 126 .

圖116繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端135包含一平坦表面136以附裝SMA材料,諸如一SMA線137。一金屬夾層138經安置於平坦表面136上。金屬夾層138包含但不限於一金層、一鎳層或合金層。SMA線137藉由類似於圖115中所繪示之電阻焊的一電阻焊附裝至平坦表面136。一黏合劑139經安置於電阻焊上。此實現SMA線137與固定端135之間的一更可靠接頭。黏合劑139包含但不限於導電黏合劑、非導電黏合劑及此項技術中已知之其他黏合劑。Figure 116 depicts a fixed end of a bimorph arm according to one embodiment. The fixed end 135 of a bimorph arm includes a flat surface 136 for attaching SMA material, such as an SMA wire 137 . A metal interlayer 138 is disposed on the flat surface 136 . The metal interlayer 138 includes but is not limited to a gold layer, a nickel layer or an alloy layer. SMA wire 137 is attached to planar surface 136 by a resistance weld similar to that depicted in FIG. 115 . An adhesive 139 is placed on the resistance weld. This enables a more reliable joint between the SMA wire 137 and the fixed end 135 . Adhesives 139 include, but are not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

圖117繪示根據一實施例之一雙壓電晶片臂之一固定端之一後視圖。根據本文中所描述之實施例組態該雙壓電晶片臂。一雙壓電晶片臂之固定端143包含與固定端143之外部145隔離之一島狀物144。此使島狀物144與外部145能夠電及/或熱隔離。針對一些實施例,附裝至雙壓電晶片臂之固定端143之相對側之SMA材料透過一通孔與諸如一SMA線之SMA材料電耦接。島狀物144經安置於一絕緣體146上,諸如本文中所描述之絕緣體。島狀物144可使用包含此項技術中已知之蝕刻技術的蝕刻技術形成。Figure 117 depicts a rear view of a fixed end of a bimorph arm according to one embodiment. The bimorph arm is configured according to embodiments described herein. The fixed end 143 of a bimorph arm includes an island 144 isolated from the exterior 145 of the fixed end 143 . This enables the island 144 to be electrically and/or thermally isolated from the exterior 145 . For some embodiments, the SMA material attached to the opposite side of the fixed end 143 of the bimorph arm is electrically coupled to the SMA material, such as an SMA wire, through a via. Islands 144 are disposed on an insulator 146, such as the insulators described herein. Islands 144 may be formed using etching techniques including etching techniques known in the art.

圖118繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端870。一雙壓電晶片臂之未固定、負載點端870包含經組態以包含自電阻焊區873延伸出之輻射表面區域874之一平坦表面871。輻射表面區域874包含一遠端部分876及一近端部分875。平坦表面871經組態以具有附裝至平坦表面871之SMA材料,諸如一SMA線872。根據一些實施例,SMA線872藉由一電阻焊在一電阻焊區873處附裝至平坦表面871。電阻焊係使用包含此項技術中已知之技術的技術形成。針對其他實施例,SMA線872係使用包含本文中所描述之附接技術的其他附接技術附裝至平坦表面871。Figure 118 depicts an unsecured, point-of-load end 870 of a bimorph arm according to one embodiment. The free, point-of-load end 870 of a bimorph arm includes a planar surface 871 configured to include a radiating surface area 874 extending from a resistive pad 873 . Radiating surface area 874 includes a distal portion 876 and a proximal portion 875 . The flat surface 871 is configured to have SMA material, such as an SMA wire 872 , attached to the flat surface 871 . According to some embodiments, SMA wire 872 is attached to planar surface 871 at a resistance land 873 by a resistance weld. Resistance welding is formed using techniques including those known in the art. For other embodiments, SMA wire 872 is attached to planar surface 871 using other attachment techniques including those described herein.

未固定、負載點端870之一溫度降低與SMA線872之相變溫度相關。輻射表面區域874顯著增加未固定負載點端870之表面積。A temperature drop at the unsecured, point-of-load terminal 870 is related to the phase transition temperature of the SMA wire 872 . The radiating surface area 874 significantly increases the surface area of the unsecured point-of-load end 870 .

增加的表面積改良未固定、負載點端870之溫度降低。增加的表面積實現冷卻以防止在致動期間之形狀記憶合金相變。The increased surface area improves the temperature reduction of the unsecured, point-of-load end 870 . The increased surface area enables cooling to prevent shape memory alloy phase transformation during actuation.

圖119繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端170。一雙壓電晶片臂之未固定、負載點端170包含經組態以包含自電阻焊區173延伸出之輻射表面區域174之一平坦表面171。Figure 119 depicts an unsecured, point-of-load end 170 of a bimorph arm according to one embodiment. The free, point-of-load end 170 of a bimorph arm includes a planar surface 171 configured to include a radiating surface area 174 extending from a resistive pad 173 .

輻射表面區域174包含一遠端部分176及一近端部分175。平坦表面171經組態以具有附裝至平坦表面171之SMA材料,諸如一SMA線172。根據一些實施例,SMA線172藉由至一電阻焊區173之一電阻焊附裝至平坦表面171。針對其他實施例,SMA線172係使用包含本文中所描述之附接技術的其他附接技術附裝至平坦表面171。Radiating surface area 174 includes a distal portion 176 and a proximal portion 175 . The planar surface 171 is configured to have SMA material, such as an SMA wire 172 , attached to the planar surface 171 . According to some embodiments, SMA wire 172 is attached to planar surface 171 by resistance welding to a resistance welding zone 173 . For other embodiments, SMA wire 172 is attached to planar surface 171 using other attachment techniques including those described herein.

未固定、負載點端170亦包含藉由電阻焊區173分離之一近端孔徑178及一遠端孔徑179。近端孔徑178及遠端孔徑179係使用包含此項技術中已知之技術的技術形成。雖然孔徑178及179被繪示為全通特徵,但在一些實例中可部分地蝕刻孔徑178及179。The unsecured, point-of-load terminal 170 also includes a proximal aperture 178 and a distal aperture 179 separated by a resistive land 173 . Proximal aperture 178 and distal aperture 179 are formed using techniques including techniques known in the art. Although apertures 178 and 179 are shown as full-through features, in some examples apertures 178 and 179 may be partially etched.

近端孔徑178及一遠端孔徑179實體上破壞平坦表面171且界定電阻焊區173之位置。根據一些實施例,孔徑178及179經組態以減輕線172與靠近電阻焊區173之平坦表面171之間的干擾。A proximal aperture 178 and a distal aperture 179 physically disrupt the planar surface 171 and define the location of the resistive pad 173 . According to some embodiments, apertures 178 and 179 are configured to mitigate interference between wire 172 and planar surface 171 near resistive land 173 .

圖120繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端270。一雙壓電晶片臂之未固定、負載點端270包含經組態以包含自電阻焊區273延伸出之輻射表面區域274之一平坦表面271。平坦表面271經組態以具有附裝至平坦表面271之SMA材料,諸如一SMA線272。根據一些實施例,SMA線272藉由至一電阻焊區273之一電阻焊附裝至平坦表面271。針對其他實施例,SMA線272係使用包含本文中所描述之附接技術的其他附接技術附裝至平坦表面271。Figure 120 depicts an unsecured, point-of-load end 270 of a bimorph arm according to one embodiment. The free, point-of-load end 270 of a bimorph arm includes a planar surface 271 configured to include a radiating surface area 274 extending from a resistive pad 273 . The planar surface 271 is configured to have SMA material, such as an SMA wire 272 , attached to the planar surface 271 . According to some embodiments, SMA wire 272 is attached to planar surface 271 by resistance welding to a resistance welding zone 273 . For other embodiments, SMA wire 272 is attached to planar surface 271 using other attachment techniques including those described herein.

未固定、負載點端270亦包含藉由電阻焊區273分離之一近端孔徑278及一遠端孔徑279。未固定、負載點端270亦包含對應於SMA線272之一區段之一長形孔徑280。長形孔徑280可經移除以產生SMA線272之一線間隙。在一些實施例中,長形孔徑280自近端孔徑278延伸。雖然孔徑278、279及280被繪示為全通特徵,但在一些實例中可部分地蝕刻孔徑278、279及280。The unsecured, point-of-load terminal 270 also includes a proximal aperture 278 and a distal aperture 279 separated by a resistive weld 273 . Unsecured, point-of-load end 270 also includes an elongated aperture 280 corresponding to a section of SMA wire 272 . Elongated aperture 280 may be removed to create a wire gap for SMA wire 272 . In some embodiments, elongated aperture 280 extends from proximal aperture 278 . Although apertures 278, 279, and 280 are depicted as full-through features, in some examples apertures 278, 279, and 280 may be partially etched.

近端孔徑278及一遠端孔徑279實體上破壞平坦表面271且界定電阻焊區273之位置。類似地,長形孔徑280實體上破壞平坦表面271且界定SMA線272之位置。根據一些實施例,孔徑278、279及280經組態以減輕線272與靠近電阻焊區273之平坦表面271之間的干擾。A proximal aperture 278 and a distal aperture 279 physically disrupt the planar surface 271 and define the location of the resistive pad 273 . Similarly, elongated aperture 280 physically disrupts planar surface 271 and defines the location of SMA wire 272 . According to some embodiments, apertures 278 , 279 , and 280 are configured to mitigate interference between wire 272 and planar surface 271 near resistive land 273 .

圖121繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端370。平坦表面371經組態以具有附裝至平坦表面371之SMA材料,諸如一SMA線372。根據一些實施例,SMA線372藉由至一電阻焊區373之一電阻焊附裝至平坦表面371,電阻焊區373至少部分地被一非線性孔徑378隔離。在一些組態中,非線性孔徑378係u形的,以實體上隔離高達90%之電阻焊區373。電阻焊區373可經安裝於由非線性孔徑378界定之一焊舌上。針對其他實施例,SMA線372係使用包含本文中所描述之附接技術的其他附接技術附裝至平坦表面371。雖然非線性孔徑378被繪示為全通特徵,但在一些實例中可部分地蝕刻非線性孔徑378。Figure 121 depicts an unsecured, point-of-load end 370 of a bimorph arm according to one embodiment. The flat surface 371 is configured to have SMA material, such as an SMA wire 372 , attached to the flat surface 371 . According to some embodiments, SMA wire 372 is attached to planar surface 371 by resistance welding to a resistance welding zone 373 at least partially isolated by a non-linear aperture 378 . In some configurations, the nonlinear aperture 378 is u-shaped to physically isolate up to 90% of the resistive pad 373 . Resistive pad 373 may be mounted on a solder tongue bounded by non-linear aperture 378 . For other embodiments, SMA wire 372 is attached to planar surface 371 using other attachment techniques including those described herein. Although non-linear aperture 378 is depicted as an all-pass feature, non-linear aperture 378 may be partially etched in some examples.

來自輻射表面區域374之增加的表面積實現冷卻以防止在致動期間之形狀記憶合金相變。在一些替代實施例中,可自未固定、負載點端370完全蝕刻電阻焊區373。替代地,電阻焊區373亦可含有一部分蝕刻狹槽以增加該舌之順應性。The increased surface area from the radiating surface region 374 enables cooling to prevent shape memory alloy phase transformation during actuation. In some alternative embodiments, the resistive land 373 may be completely etched from the unsecured, point-of-load terminal 370 . Alternatively, the resistive land 373 may also contain a portion of an etched slot to increase the compliance of the tongue.

圖122繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端470。提供相鄰平坦表面471以附裝SMA材料,諸如一SMA線472。SMA線472藉由一電阻焊區473附裝至平坦表面471,電阻焊區473至少部分地被一非線性孔徑478隔離。Figure 122 depicts an unsecured, point-of-load end 470 of a bimorph arm according to one embodiment. Adjacent flat surface 471 is provided for attaching SMA material, such as an SMA wire 472 . SMA wire 472 is attached to planar surface 471 by a resistive pad 473 at least partially isolated by a non-linear aperture 478 .

電阻焊區473可使用非線性孔徑478中之一部分蝕刻狹槽479安裝。在一些組態中,非線性孔徑478實體上破壞平坦表面471且界定電阻焊區473之位置。根據一些實施例,孔徑478經組態以減輕線472與靠近電阻焊區473之平坦表面471之間的干擾。雖然孔徑478被繪示為全通特徵,但在一些實例中可部分地蝕刻孔徑478。Resistive pads 473 may be installed using a partially etched slot 479 in nonlinear aperture 478 . In some configurations, the nonlinear aperture 478 physically disrupts the planar surface 471 and defines the location of the resistive pad 473 . According to some embodiments, the aperture 478 is configured to mitigate interference between the wire 472 and the planar surface 471 near the resistive pad 473 . Although aperture 478 is depicted as a full pass feature, in some examples aperture 478 may be partially etched.

來自輻射表面區域474之增加的表面積實現冷卻以防止在致動期間之形狀記憶合金相變。The increased surface area from the radiating surface area 474 enables cooling to prevent shape memory alloy phase transformation during actuation.

所揭示實施例可應用於雙壓電晶片臂之固定端。圖123至圖125在本文中被提供為併入所揭示實施例之固定端之實例實施例。The disclosed embodiments can be applied to the fixed end of a bimorph arm. 123-125 are provided herein as example embodiments incorporating fixed ends of the disclosed embodiments.

圖123繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端895包含一平坦表面896以附裝SMA材料,諸如一SMA線897。SMA線897藉由一電阻焊區898附裝至平坦表面896。電阻焊區898係使用包含此項技術中已知之技術的技術形成。Figure 123 depicts a fixed end of a bimorph arm according to one embodiment. The fixed end 895 of a bimorph arm includes a flat surface 896 for attaching SMA material, such as an SMA wire 897 . SMA wire 897 is attached to planar surface 896 by a resistive land 898 . Resistive pads 898 are formed using techniques including those known in the art.

固定端895包含藉由電阻焊區898分離之一近端孔徑893及一遠端孔徑894。近端孔徑893及遠端孔徑894係使用包含此項技術中已知之技術的技術形成。Fixed end 895 includes a proximal aperture 893 and a distal aperture 894 separated by a resistive solder land 898 . Proximal aperture 893 and distal aperture 894 are formed using techniques including techniques known in the art.

近端孔徑893及一遠端孔徑894實體上破壞平坦表面896且界定電阻焊縫898之位置。根據一些實施例,孔徑893及894經組態以減輕SMA線897與靠近電阻焊區898之平坦表面896之間的干擾。雖然孔徑893及894被繪示為全通特徵,但在一些實例中可部分地蝕刻孔徑893及894。A proximal aperture 893 and a distal aperture 894 physically disrupt the planar surface 896 and define the location of the resistance weld 898 . According to some embodiments, apertures 893 and 894 are configured to mitigate interference between SMA wire 897 and planar surface 896 near resistance pad 898 . Although apertures 893 and 894 are shown as full-through features, in some examples apertures 893 and 894 may be partially etched.

圖124繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端195包含一平坦表面196以附裝SMA材料,諸如一SMA線197。SMA線197藉由一電阻焊區198處之一電阻焊附裝至平坦表面196。電阻焊區198係使用包含此項技術中已知之技術的技術形成。Figure 124 depicts a fixed end of a bimorph arm according to one embodiment. The fixed end 195 of a bimorph arm includes a flat surface 196 for attaching SMA material, such as an SMA wire 197 . SMA wire 197 is attached to planar surface 196 by a resistance weld at a resistance land 198 . Resistive pads 198 are formed using techniques including techniques known in the art.

固定端195包含藉由電阻焊區198分離之一近端孔徑193及一遠端孔徑194。近端孔徑193及遠端孔徑194係使用包含此項技術中已知之技術的技術形成。The fixed end 195 includes a proximal aperture 193 and a distal aperture 194 separated by a resistive solder land 198 . Proximal aperture 193 and distal aperture 194 are formed using techniques including techniques known in the art.

固定端195亦包含對應於SMA線197之一區段之一長形孔徑160。長形孔徑160可經移除以提供SMA線197之一線間隙。在一些實施例中,長形孔徑160自遠端孔徑194延伸。Fixed end 195 also includes an elongated aperture 160 corresponding to a section of SMA wire 197 . Elongated aperture 160 may be removed to provide wire clearance for SMA wire 197 . In some embodiments, elongated aperture 160 extends from distal aperture 194 .

近端孔徑193及一遠端孔徑194至少部分地實體上隔離電阻焊區198。長形孔徑160實體上破壞平坦表面196且界定SMA線197之位置。根據一些實施例,孔徑193及孔徑194經組態以減輕SMA線197與靠近電阻焊區198之平坦表面196之間的干擾。雖然孔徑193及194被繪示為全通特徵,但在一些實例中可部分地蝕刻孔徑193及194。A proximal aperture 193 and a distal aperture 194 at least partially physically isolate the resistance pad 198 . Elongated aperture 160 physically disrupts planar surface 196 and defines the location of SMA wire 197 . According to some embodiments, aperture 193 and aperture 194 are configured to mitigate interference between SMA wire 197 and planar surface 196 proximate resistive pad 198 . Although apertures 193 and 194 are shown as full-through features, in some examples apertures 193 and 194 may be partially etched.

圖125繪示根據一實施例之一雙壓電晶片臂之一固定端295。一雙壓電晶片臂之固定端295包含一平坦表面296以附裝SMA材料,諸如一SMA線297。SMA線297藉由一電阻焊區298處之一電阻焊附裝至平坦表面296。Figure 125 illustrates a fixed end 295 of a bimorph arm according to one embodiment. A fixed end 295 of a bimorph arm includes a flat surface 296 for attaching SMA material, such as an SMA wire 297 . The SMA wire 297 is attached to the planar surface 296 by a resistance weld at a resistance land 298 .

電阻焊區298至少部分地被一非線性孔徑294隔離。在一些組態中,非線性孔徑294係u形的,以實體上隔離高達90%之電阻焊區298。電阻焊區298可安裝於由非線性孔徑294界定之一焊舌上。Resistive pads 298 are at least partially isolated by a non-linear aperture 294 . In some configurations, the non-linear aperture 294 is u-shaped to physically isolate up to 90% of the resistive pad 298 . Resistive pad 298 may be mounted on a solder tongue defined by nonlinear aperture 294 .

非線性孔徑294實體上破壞平坦表面296且界定電阻焊區298之位置。根據一些實施例,線性孔徑294經組態以減輕SMA線297與靠近電阻焊區298之平坦表面296之間的干擾。在一些替代實施例中,可自固定端295完全蝕刻電阻焊區298。替代地,電阻焊區298亦可含有一部分蝕刻狹槽以減小一接觸面積。Non-linear aperture 294 physically disrupts planar surface 296 and defines the location of resistive pad 298 . According to some embodiments, the linear aperture 294 is configured to mitigate interference between the SMA wire 297 and the planar surface 296 near the resistance pad 298 . In some alternative embodiments, the resistive pad 298 may be completely etched from the fixed end 295 . Alternatively, the resistance pad 298 may also include a portion of etched slots to reduce a contact area.

圖126繪示根據一實施例之一平衡雙壓電晶片致動器。平衡雙壓電晶片致動器440包含使用包含本文中所描述之技術的技術形成及組態之兩個雙壓電晶片臂442、443。針對一些實施例,雙壓電晶片致動器440經固定至一基座441,諸如用於安裝至一外殼體之一托架。雙壓電晶片致動器440係使用包含此項技術中已知之技術的技術(諸如黏合劑及焊料)固定至該基座。平衡雙壓電晶片致動器440經組態以藉由最小化或消除其等自身之摩擦分量444a、444b來減小雙壓電晶片致動器440之淨摩擦力,因為其包含配置於相反方向上之兩個雙壓電晶片臂442、443。各雙壓電晶片臂442、443之摩擦力分量444a、444b作用於不同於各雙壓電晶片臂442、443之所想要力衝程445a、445b之一方向。根據一些實施例,一平衡雙壓電晶片致動器440包含至少一第一雙壓電晶片臂442及經組態以具有作用於第一雙壓電晶片臂442之一相反方向之一摩擦力分量444a、444b之至少另一雙壓電晶片臂443。因此,平衡雙壓電晶片致動器440經組態以平衡由一或多個雙壓電晶片臂因摩擦力分量所致之滑動摩擦。此可實現更精確控制,而較少需要或無需主動抵消非所要摩擦力。包含本文中所描述之平衡雙壓電晶片致動器的平衡雙壓電晶片致動器克服在尖端處產生一摩擦力分量之其他雙壓電晶片致動器之問題。此等其他雙壓電晶片致動器在Y方向上產生推力且歸因於在X方向上沿該致動器之推動構件之表面滑動而在X方向上產生一非所要力。此將在X方向上產生控制系統將必須補償之少量非所要運動。然而,此等補償雙壓電晶片致動器亦將引發其等自身之非所要摩擦力。此需要複雜控制演算法來達成例如如用於一光學影像穩定系統中之良好運動效能。Figure 126 illustrates a balanced bimorph actuator according to one embodiment. Balanced bimorph actuator 440 includes two bimorph arms 442, 443 formed and configured using techniques including those described herein. For some embodiments, bimorph actuator 440 is secured to a base 441 , such as a bracket for mounting to an outer housing. The bimorph actuator 440 is secured to the base using techniques including techniques known in the art, such as adhesives and solder. The balanced bimorph actuator 440 is configured to reduce the net friction of the bimorph actuator 440 by minimizing or eliminating its own friction components 444a, 444b, as it includes configurations on opposite sides Two bimorph arms 442,443 in the direction. The friction force component 444a, 444b of each bimorph arm 442, 443 acts in a direction different from the desired force stroke 445a, 445b of each bimorph arm 442, 443. According to some embodiments, a balanced bimorph actuator 440 includes at least one first bimorph arm 442 and is configured to have a frictional force acting in an opposite direction of the first bimorph arm 442 At least one other bimorph arm 443 of the components 444a, 444b. Accordingly, the balanced bimorph actuator 440 is configured to balance the sliding friction due to the friction component of one or more bimorph arms. This allows for more precise control with less or no need to actively counteract unwanted friction forces. Balanced bimorph actuators including the balanced bimorph actuators described herein overcome the problems of other bimorph actuators that create a friction component at the tip. These other bimorph actuators generate thrust in the Y direction and an unwanted force in the X direction due to sliding along the surface of the actuator's pushing member in the X direction. This will produce a small amount of unwanted motion in the X direction that the control system will have to compensate for. However, such compensating bimorph actuators will also induce their own unwanted friction forces. This requires complex control algorithms to achieve good motion performance eg as used in an optical image stabilization system.

圖127繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統。所有側上之平衡雙壓電晶片致動器448a至448d用來消除其等自身之摩擦分量,因為其等係使用包含本文中所描述之技術的技術配置於相反方向上。在近似淨零摩擦之情況下,存在最小開環位置誤差。在一些實例中,小誤差將歸因於典型總成及組件大小容限且可藉由使用一閉環控制系統容易地校正。Figure 127 illustrates an optical image stabilization system including balanced bimorph actuators according to one embodiment. Balanced bimorph actuators 448a-448d on all sides serve to cancel their own frictional components as they are configured in opposite directions using techniques including those described herein. With approximately net zero friction, there is a minimum open loop position error. In some instances, small errors will be due to typical assembly and component size tolerances and can be easily corrected by using a closed loop control system.

圖128繪示根據一實施例之一平衡雙壓電晶片致動器。平衡雙壓電晶片致動器450包含以一直列式、鏡像定向配置之兩個雙壓電晶片臂452a、452b,諸如本文中所描述之雙壓電晶片臂。針對一些實施例,雙壓電晶片致動器450經固定至一基座453,諸如用於安裝至一外殼體之一托架。雙壓電晶片致動器450係使用包含此項技術中已知之技術的技術(諸如黏合劑及焊料)固定至該基座。根據一些實施例,一第一雙壓電晶片臂452a經組態以主要在平行於平衡雙壓電晶片致動器之一縱軸之第一雙壓電晶片臂之固定端456a之方向上具有一摩擦力分量454a。第二雙壓電晶片臂452b經組態以與第一雙壓電晶片臂452a直列式組態使得第二雙壓電晶片臂之固定端456b相鄰於第一雙壓電晶片臂456a之固定端。第二雙壓電晶片臂452b經組態以在與第一雙壓電晶片臂452a相反之一方向上具有一摩擦力分量454b。此導致雙壓電晶片致動器經組態以藉由最小化或消除淨摩擦力來減小雙壓電晶片致動器之淨摩擦力。針對一些實施例,對於平衡雙壓電晶片致動器,淨摩擦力近似為一零淨總摩擦力。針對一些實施例,平衡雙壓電晶片致動器之各雙壓電晶片臂452a、452b包含一SMA線458a、458b。SMA線458a、458b串聯連接且經組態以接收至兩個線之相等電流。針對一些實施例,第一SMA線458a例如透過用來控制致動器之致動之一1通道輸入、透過與一控制輸入墊451a耦接之一第一雙壓電晶片臂452a與一致動控制件耦接。第二SMA線458b透過與一接地墊451b耦接之一第二雙壓電晶片臂452b與接地耦接。Figure 128 illustrates a balanced bimorph actuator according to one embodiment. Balanced bimorph actuator 450 includes two bimorph arms 452a, 452b configured in an in-line, mirror image orientation, such as the bimorph arms described herein. For some embodiments, the bimorph actuator 450 is secured to a base 453, such as a bracket for mounting to an outer housing. The bimorph actuator 450 is secured to the base using techniques including techniques known in the art, such as adhesives and solder. According to some embodiments, a first bimorph arm 452a is configured to have a direction primarily parallel to the fixed end 456a of the first bimorph arm of a longitudinal axis of the balanced bimorph actuator. A friction component 454a. The second bimorph arm 452b is configured to be in-line with the first bimorph arm 452a such that the fixed end 456b of the second bimorph arm is adjacent to the fixed end of the first bimorph arm 456a. end. The second bimorph arm 452b is configured to have a friction component 454b in an opposite direction to the first bimorph arm 452a. This results in the bimorph actuator being configured to reduce the net friction of the bimorph actuator by minimizing or eliminating the net friction. For some embodiments, for a balanced bimorph actuator, the net friction is approximately a net total friction of zero. For some embodiments, each bimorph arm 452a, 452b of the balanced bimorph actuator includes an SMA wire 458a, 458b. The SMA wires 458a, 458b are connected in series and configured to receive equal current to both wires. For some embodiments, the first SMA wire 458a is connected to an actuation control via a first bimorph arm 452a coupled to a control input pad 451a, for example through a 1-channel input for controlling the actuation of the actuator. Component coupling. The second SMA line 458b is coupled to ground through a second bimorph arm 452b coupled to a ground pad 451b.

圖129繪示根據一實施例之包含經組態以固持及隔離金屬組件之聚酰亞胺層459之一平衡雙壓電晶片致動器。平衡雙壓電晶片致動器之其他實施例不包含聚酰亞胺層。針對沒有聚酰亞胺層之平衡雙壓電晶片致動器之一些實施例,一控制輸入墊、一接地墊及一共同基座島狀物經固定至第一雙壓電晶片臂與第二雙壓電晶片臂之固定端之間的一基層。針對一些實施例,控制輸入墊、接地墊及共同基座島狀物使用一黏合劑(諸如此項技術中已知之黏合劑)固定至一基層。圖130繪示根據一實施例之包含一共同基座島狀物460之一平衡雙壓電晶片致動器。共同基座島狀物460經組態以用於附接一第一SMA線之一端及一第二SMA線之一端。針對一些實施例,在將任何SMA線附裝至共同基座島狀物460之前,共同基座島狀物460與一控制輸入墊461a及一接地墊461b電隔離。共同基座島狀物460經形成於第一雙壓電晶片臂462a及第二雙壓電晶片臂462b之固定端上。FIG. 129 illustrates a balanced bimorph actuator including a polyimide layer 459 configured to hold and isolate metal components, according to one embodiment. Other embodiments of balanced bimorph actuators do not include a polyimide layer. For some embodiments of a balanced bimorph actuator without a polyimide layer, a control input pad, a ground pad, and a common base island are secured to the first bimorph arm and the second bimorph arm. A base layer between the fixed ends of the bimorph arms. For some embodiments, the control input pads, ground pads, and common base islands are secured to a base layer using an adhesive, such as those known in the art. FIG. 130 illustrates a balanced bimorph actuator including a common base island 460 according to one embodiment. Common base island 460 is configured for attaching an end of a first SMA wire and an end of a second SMA wire. For some embodiments, the common base island 460 is electrically isolated from a control input pad 461a and a ground pad 461b before any SMA wires are attached to the common base island 460 . A common base island 460 is formed on the fixed ends of the first bimorph arm 462a and the second bimorph arm 462b.

圖131繪示根據一實施例之一平衡雙壓電晶片致動器。平衡雙壓電晶片致動器包含以一反向直列式定向配置之兩個雙壓電晶片臂464a、464b,諸如本文中所描述之雙壓電晶片臂。針對一些實施例,雙壓電晶片致動器經固定至一基座463,諸如用於安裝至一外殼體之一托架。雙壓電晶片致動器係使用包含此項技術中已知之技術的技術(諸如黏合劑及焊料)固定至該基座。根據一些實施例,一第一雙壓電晶片臂464a經組態以主要在平行於平衡雙壓電晶片致動器之一縱軸之第一雙壓電晶片臂464a之固定端468a之方向上具有一摩擦力分量466a。第二雙壓電晶片臂464b經組態以與第一雙壓電晶片臂464a直列式組態使得雙壓電晶片臂464a、464b之固定端468a、468b係在雙壓電晶片致動器之相對端處。因此,第一雙壓電晶片臂之未固定端469a及第二雙壓電晶片臂之未固定端469b靠近彼此配置。第二雙壓電晶片臂464b經組態以在與第一雙壓電晶片臂464a相反之方向上具有一摩擦力分量466b。此導致雙壓電晶片致動器經組態以藉由最小化或消除淨摩擦力來減小雙壓電晶片致動器之淨摩擦力。針對一些實施例,對於平衡雙壓電晶片致動器,淨摩擦力近似為一零淨總摩擦力。針對一些實施例,平衡雙壓電晶片致動器之各雙壓電晶片臂464a、464b包含一SMA線467a、467b。SMA線467a、467b串聯連接且經組態以例如透過用來控制致動器之致動之一1通道輸入接收至兩個線之相等電流。針對一些實施例,第一SMA線467a例如透過用來控制致動器之致動之一1通道輸入、透過與一控制輸入墊451a耦接之一第一雙壓電晶片臂452a與一致動控制件耦接。第二SMA線458b透過與一接地墊451b耦接之一第二雙壓電晶片臂452b與接地耦接。Figure 131 illustrates a balanced bimorph actuator according to one embodiment. The balanced bimorph actuator includes two bimorph arms 464a, 464b configured in an opposite in-line orientation, such as the bimorph arms described herein. For some embodiments, the bimorph actuator is secured to a base 463, such as a bracket for mounting to an outer housing. The bimorph actuator is secured to the base using techniques including techniques known in the art, such as adhesives and solder. According to some embodiments, a first bimorph arm 464a is configured to be primarily in a direction parallel to the fixed end 468a of the first bimorph arm 464a to a longitudinal axis of the balanced bimorph actuator. There is a friction component 466a. The second bimorph arm 464b is configured to be in-line with the first bimorph arm 464a such that the fixed ends 468a, 468b of the bimorph arms 464a, 464b are attached between the bimorph actuators. at the opposite end. Thus, the unsecured end 469a of the first bimorph arm and the unsecured end 469b of the second bimorph arm are disposed close to each other. The second bimorph arm 464b is configured to have a friction component 466b in the opposite direction to the first bimorph arm 464a. This results in the bimorph actuator being configured to reduce the net friction of the bimorph actuator by minimizing or eliminating the net friction. For some embodiments, for a balanced bimorph actuator, the net friction is approximately a net total friction of zero. For some embodiments, each bimorph arm 464a, 464b of the balanced bimorph actuator includes an SMA wire 467a, 467b. The SMA wires 467a, 467b are connected in series and configured to receive equal current to both wires, for example through a 1-channel input used to control the actuation of the actuator. For some embodiments, the first SMA wire 467a is connected to an actuation control via a first bimorph arm 452a coupled to a control input pad 451a, such as through a 1-channel input for controlling the actuation of the actuator. Component coupling. The second SMA line 458b is coupled to ground through a second bimorph arm 452b coupled to a ground pad 451b.

圖132繪示根據一實施例之使用本文中所描述之技術之包含經組態以固持及隔離金屬組件之聚酰亞胺層570之一平衡雙壓電晶片致動器。平衡雙壓電晶片致動器之其他實施例不包含聚酰亞胺層。針對沒有聚酰亞胺層之平衡雙壓電晶片致動器之一些實施例,一控制輸入墊及一接地墊經固定於第一雙壓電晶片臂及第二雙壓電晶片臂附近。針對一些實施例,控制輸入墊及一接地墊係使用一黏合劑(諸如此項技術中已知之黏合劑)固定至一基層。圖133繪示根據一實施例之使用本文中所描述之技術之包含一控制輸入墊572及一接地墊573之一平衡雙壓電晶片致動器。FIG. 132 illustrates a balanced bimorph actuator including a polyimide layer 570 configured to hold and isolate metal components using techniques described herein, according to one embodiment. Other embodiments of balanced bimorph actuators do not include a polyimide layer. For some embodiments of a balanced bimorph actuator without a polyimide layer, a control input pad and a ground pad are secured near the first bimorph arm and the second bimorph arm. For some embodiments, control input pads and a ground pad are secured to a base layer using an adhesive, such as those known in the art. FIG. 133 illustrates a balanced bimorph actuator including a control input pad 572 and a ground pad 573 using the techniques described herein, according to one embodiment.

圖134繪示根據一實施例之一平衡雙壓電晶片致動器。平衡雙壓電晶片致動器包含以一直列式、鏡像定向配置之兩個雙壓電晶片臂574a、574b,諸如本文中所描述之雙壓電晶片臂。針對一些實施例,雙壓電晶片致動器經固定至一基座571,諸如用於安裝至一外殼體之一托架。雙壓電晶片致動器係使用包含此項技術中已知之技術的技術(諸如黏合劑及焊料)固定至該基座。根據一些實施例,一第一雙壓電晶片臂574a經組態以主要在平行於平衡雙壓電晶片致動器之一縱軸之第一雙壓電晶片臂之固定端576a之方向上具有一摩擦力分量575a。第二雙壓電晶片臂574b經組態以與第一雙壓電晶片臂574a直列式組態使得第二雙壓電晶片臂之固定端576b相鄰於第一雙壓電晶片臂之固定端576a。第二雙壓電晶片臂574b經組態以在與第一雙壓電晶片臂之摩擦力分量575a相反之一方向上具有一摩擦力分量575b。此導致雙壓電晶片致動器經組態以藉由最小化或消除淨摩擦力來減小雙壓電晶片致動器之淨摩擦力。針對一些實施例,對於平衡雙壓電晶片致動器,淨摩擦力近似為一零淨總摩擦力。針對一些實施例,使用單個SMA線578且SMA線578之各端經耦接至各雙壓電晶片臂577a、577b之一各自未固定端。單個SMA線578可實現平衡雙壓電晶片致動器之更多衝程。Figure 134 illustrates a balanced bimorph actuator according to one embodiment. A balanced bimorph actuator includes two bimorph arms 574a, 574b configured in an in-line, mirror-image orientation, such as the bimorph arms described herein. For some embodiments, the bimorph actuator is secured to a base 571, such as a bracket for mounting to an outer housing. The bimorph actuator is secured to the base using techniques including techniques known in the art, such as adhesives and solder. According to some embodiments, a first bimorph arm 574a is configured to have a direction primarily parallel to the fixed end 576a of the first bimorph arm of a longitudinal axis of the balanced bimorph actuator. A friction component 575a. The second bimorph arm 574b is configured to be in-line with the first bimorph arm 574a such that the fixed end 576b of the second bimorph arm is adjacent to the fixed end of the first bimorph arm 576a. The second bimorph arm 574b is configured to have a friction component 575b in a direction opposite to the friction component 575a of the first bimorph arm. This results in the bimorph actuator being configured to reduce the net friction of the bimorph actuator by minimizing or eliminating the net friction. For some embodiments, for a balanced bimorph actuator, the net friction is approximately a net total friction of zero. For some embodiments, a single SMA wire 578 is used and each end of the SMA wire 578 is coupled to a respective unsecured end of each bimorph arm 577a, 577b. A single SMA wire 578 enables more stroke of the balanced bimorph actuator.

圖135繪示根據一實施例之使用本文中所描述之技術之包含單個SMA線579之一平衡雙壓電晶片致動器。圖136繪示根據一實施例之使用本文中所描述之技術之一平衡雙壓電晶片致動器,該平衡雙壓電晶片致動器經組態以用於單個SMA線,且包含一控制輸入墊480及一接地墊481。針對一些實施例,平衡雙壓電晶片致動器經組態以包含經組態以固持及隔離金屬組件之聚酰亞胺層。平衡雙壓電晶片致動器之其他實施例不包含聚酰亞胺層。針對沒有聚酰亞胺層之平衡雙壓電晶片致動器之一些實施例,一控制輸入墊及一接地墊經固定至第一雙壓電晶片臂與第二雙壓電晶片臂之固定端之間的一基層。針對一些實施例,控制輸入墊及一接地墊係使用一黏合劑(諸如此項技術中已知之黏合劑)固定至一基層。Figure 135 illustrates a balanced bimorph actuator comprising a single SMA wire 579 using the techniques described herein, according to one embodiment. 136 illustrates a balanced bimorph actuator configured for use with a single SMA wire and including a control, according to one embodiment, using the techniques described herein. Input pad 480 and a ground pad 481 . For some embodiments, the balanced bimorph actuator is configured to include a polyimide layer configured to hold and isolate metal components. Other embodiments of balanced bimorph actuators do not include a polyimide layer. For some embodiments of a balanced bimorph actuator without a polyimide layer, a control input pad and a ground pad are secured to fixed ends of the first bimorph arm and the second bimorph arm a layer in between. For some embodiments, control input pads and a ground pad are secured to a base layer using an adhesive, such as those known in the art.

圖137繪示根據一實施例之一平衡雙壓電晶片致動器。平衡雙壓電晶片致動器包含以一交錯定向配置之兩個雙壓電晶片臂482a、482b,諸如本文中所描述之雙壓電晶片臂。針對一些實施例,雙壓電晶片致動器經固定至一基座489,諸如用於安裝至一外殼體之一托架。雙壓電晶片致動器係使用包含此項技術中已知之技術的技術(諸如黏合劑及焊料)固定至該基座。根據一些實施例,一第一雙壓電晶片臂482a經組態以主要在平行於第一雙壓電晶片臂之一縱軸之第一雙壓電晶片臂482a之固定端484a之方向上具有一摩擦力分量483a。第二雙壓電晶片臂482b經組態以與第一雙壓電晶片臂482a交錯使得該第二雙壓電晶片臂之縱軸大致平行於該第一雙壓電晶片臂之縱軸。此外,雙壓電晶片臂482a、482b之固定端484a、484b係在雙壓電晶片致動器之相對端處。因此,第一雙壓電晶片臂482a之未固定端及第二雙壓電晶片482b之未固定端相對於彼此交錯。第二雙壓電晶片臂482a經組態以在與第一雙壓電晶片臂482a相反之一方向上具有一摩擦力分量483a。此導致雙壓電晶片致動器經組態以藉由最小化或消除淨摩擦力來減小雙壓電晶片致動器之淨摩擦力。針對一些實施例,對於平衡雙壓電晶片致動器,淨摩擦力近似為一零淨總摩擦力。針對一些實施例,平衡雙壓電晶片致動器之各雙壓電晶片臂482a、482b包含一SMA線485a、485b。SMA線485a、485b串聯連接且經組態以例如透過用來控制致動器(諸如本文中所描述之致動器)之致動之一1通道輸入接收至兩個線之相等電流。Figure 137 illustrates a balanced bimorph actuator according to one embodiment. A balanced bimorph actuator includes two bimorph arms 482a, 482b arranged in a staggered orientation, such as the bimorph arms described herein. For some embodiments, the bimorph actuator is secured to a base 489, such as a bracket for mounting to an outer housing. The bimorph actuator is secured to the base using techniques including techniques known in the art, such as adhesives and solder. According to some embodiments, a first bimorph arm 482a is configured to have a direction primarily parallel to the fixed end 484a of the first bimorph arm 482a along a longitudinal axis of the first bimorph arm. A friction component 483a. The second bimorph arms 482b are configured to interleave with the first bimorph arms 482a such that the longitudinal axis of the second bimorph arms is substantially parallel to the longitudinal axis of the first bimorph arms. In addition, the fixed ends 484a, 484b of the bimorph arms 482a, 482b are at opposite ends of the bimorph actuator. Thus, the unsecured ends of the first bimorph arms 482a and the unsecured ends of the second bimorph arms 482b are staggered relative to each other. The second bimorph arm 482a is configured to have a friction component 483a in an opposite direction to the first bimorph arm 482a. This results in the bimorph actuator being configured to reduce the net friction of the bimorph actuator by minimizing or eliminating the net friction. For some embodiments, for a balanced bimorph actuator, the net friction is approximately a net total friction of zero. For some embodiments, each bimorph arm 482a, 482b of the balanced bimorph actuator includes an SMA wire 485a, 485b. The SMA wires 485a, 485b are connected in series and configured to receive equal current to both wires, eg, through a 1-channel input used to control the actuation of an actuator such as that described herein.

圖138繪示根據一實施例之具有一交錯定向之一平衡雙壓電晶片致動器,該平衡雙壓電晶片致動器包含經組態以固持及隔離金屬組件之聚酰亞胺層486。平衡雙壓電晶片致動器之其他實施例不包含聚酰亞胺層。針對沒有聚酰亞胺層之平衡雙壓電晶片致動器之一些實施例,一控制輸入墊及一接地墊相鄰於第一雙壓電晶片臂及第二雙壓電晶片臂固定。針對一些實施例,控制輸入墊及一接地墊係使用一黏合劑(諸如本文中所描述之黏合劑)固定至該基層。圖139繪示根據一實施例之包含一控制輸入墊487及一接地墊488之一平衡雙壓電晶片致動器。Figure 138 depicts a balanced bimorph actuator having a staggered orientation comprising a polyimide layer 486 configured to hold and isolate metal components according to one embodiment . Other embodiments of balanced bimorph actuators do not include a polyimide layer. For some embodiments of a balanced bimorph actuator without a polyimide layer, a control input pad and a ground pad are fixed adjacent to the first bimorph arm and the second bimorph arm. For some embodiments, control input pads and a ground pad are secured to the base layer using an adhesive, such as those described herein. Figure 139 illustrates a balanced bimorph actuator including a control input pad 487 and a ground pad 488 according to one embodiment.

圖140繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統。由於所有側上之平衡雙壓電晶片致動器經配置於相反方向上,因此該等平衡雙壓電晶片致動器用來消除其等自身之摩擦分量。在近似淨零摩擦之情況下,存在最小開環位置誤差。在一些實例中,小誤差將歸因於典型總成及組件大小容限且可藉由使用一閉環控制系統容易地校正。Figure 140 illustrates an optical image stabilization system including balanced bimorph actuators according to one embodiment. Since the balanced bimorph actuators on all sides are configured in opposite directions, the balanced bimorph actuators serve to cancel their own frictional components. With approximately net zero friction, there is a minimum open loop position error. In some instances, small errors will be due to typical assembly and component size tolerances and can be easily corrected by using a closed loop control system.

圖141繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統的一分解視圖。該光學影像穩定系統經組態以接納本身齊平地定位至圍繞外殼體511之周邊之一凹穴510a至510d中之雙壓電晶片致動器,諸如本文中所描述之雙壓電晶片致動器。此配置藉由使雙壓電晶片致動器514a至514d (諸如本文中所描述之平衡雙壓電晶片致動器)共用相同於外殼體511之X/Y空間來實現雙壓電晶片模組512a至512d之一更小X/Y覆蓋區。此亦藉由使雙壓電晶片致動器510a至510d能夠在最後一個步驟自外部插入來簡化雙壓電晶片模組512a至512d之組裝。外殼體511可由模製塑膠、金屬或其他材料製成。Figure 141 depicts an exploded view of an optical image stabilization system including balanced bimorph actuators according to one embodiment. The optical image stabilization system is configured to receive a bimorph actuator, such as the bimorph actuator described herein, positioned itself flush into one of the pockets 510a-510d around the perimeter of the outer housing 511. device. This configuration enables bimorph modules by having bimorph actuators 514a-514d (such as the balanced bimorph actuators described herein) share the same X/Y space as outer housing 511 One of 512a-512d has a smaller X/Y footprint. This also simplifies the assembly of the bimorph modules 512a-512d by enabling the bimorph actuators 510a-510d to be externally inserted in a final step. Outer housing 511 may be made of molded plastic, metal or other materials.

圖142繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統。光學影像穩定外殼體516經組態以接納本身齊平地定位至該外殼體516上之一凹穴中之雙壓電晶片致動器518a至518d,諸如本文中所描述之雙壓電晶片致動器。此配置藉由使雙壓電晶片致動器518a至518d (諸如本文中所描述之平衡雙壓電晶片致動器)共用相同於該外殼體之X/Y空間來實現雙壓電晶片模組520a至520d之一更小X/Y覆蓋區。此亦藉由使雙壓電晶片致動器518a至518d能夠在最後一個步驟自外部插入來簡化雙壓電晶片模組520a至520d之組裝。外殼體516可由模製塑膠、金屬或其他材料製成。Figure 142 illustrates an optical image stabilization system including balanced bimorph actuators according to one embodiment. The optical image stabilization outer housing 516 is configured to receive bimorph actuators 518a-518d, such as the bimorph actuators described herein, positioned themselves flush into a recess on the outer housing 516. device. This configuration enables bimorph modules by having bimorph actuators 518a-518d (such as the balanced bimorph actuators described herein) share the same X/Y space as the outer housing One of 520a-520d has a smaller X/Y footprint. This also simplifies assembly of the bimorph modules 520a-520d by enabling the bimorph actuators 518a-518d to be externally inserted in a final step. Outer housing 516 may be made of molded plastic, metal or other materials.

圖143繪示根據一實施例之包含雙壓電晶片致動器之一感測器移位光學影像穩定系統。該光學影像穩定系統經組態以接納經組態為一平衡托架/模組522a至522d之平衡雙壓電晶片致動器,諸如本文中所描述之平衡雙壓電晶片致動器。雙壓電晶片托架/模組522a至522d經組態以自感測器移位OIS模組之外部插入。針對一些實施例,感測器移位OIS模組使用雙壓電晶片致動器之偏心設計以亦引發安裝於可經控制以用於抑制側滾激勵以及X/Y激勵之一移動影像感測器托架528上之影像感測器524之旋轉。此配置藉由使雙壓電晶片致動器 (諸如本文中所描述之平衡雙壓電晶片致動器)共用相同於外殼體526之X/Y空間來實現雙壓電晶片模組522a至522d之一更小X/Y覆蓋區。藉由使雙壓電晶片致動器可在最後階段從外部置入,亦簡化了雙壓電晶片模組522a-d之組裝。外殼體526可由模製塑膠、金屬或其他材料製成。Figure 143 illustrates a sensor-shift optical image stabilization system including bimorph actuators according to one embodiment. The optical image stabilization system is configured to receive a balanced bimorph actuator configured as a balanced bracket/module 522a-522d, such as the balanced bimorph actuator described herein. The bimorph brackets/modules 522a-522d are configured to be inserted from the outside of the sensor shift OIS module. For some embodiments, the sensor shift OIS module uses an eccentric design of the bimorph actuator to also induce a moving image sensor mounted on a roll that can be controlled for suppression of roll excitation as well as X/Y excitation. Rotation of the image sensor 524 on the sensor bracket 528. This configuration enables bimorph modules 522a-522d by having bimorph actuators, such as the balanced bimorph actuators described herein, share the same X/Y space as outer housing 526 One of the smaller X/Y footprints. Assembly of the bimorph modules 522a-d is also simplified by allowing the bimorph actuators to be inserted externally at a final stage. Outer housing 526 may be made of molded plastic, metal or other materials.

圖144繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統。該光學影像穩定系統經組態以接納本身齊平地定位至一光學影像穩定系統之外殼體532上之一凹穴530中之雙壓電晶片致動器,諸如本文中所描述之雙壓電晶片致動器。此配置藉由使雙壓電晶片致動器(諸如本文中所描述之平衡雙壓電晶片致動器)共用相同於外殼體532之X/Y空間來實現雙壓電晶片模組534a至534d之一更小X/Y覆蓋區。此亦藉由使雙壓電晶片致動器能夠在最後一個步驟自外部插入來簡化雙壓電晶片模組534a至534d之組裝。外殼體532可由模製塑膠、金屬或其他材料製成。Figure 144 illustrates an optical image stabilization system including balanced bimorph actuators according to one embodiment. The optical image stabilization system is configured to receive a bimorph actuator, such as the bimorph described herein, which is itself flush positioned into a recess 530 on an optical image stabilization system outer housing 532 actuator. This configuration enables bimorph modules 534a to 534d by having bimorph actuators, such as the balanced bimorph actuators described herein, share the same X/Y space as outer housing 532 One of the smaller X/Y footprints. This also simplifies the assembly of the bimorph modules 534a to 534d by enabling the bimorph actuators to be externally inserted as a last step. Outer housing 532 may be made of molded plastic, metal or other materials.

圖145繪示根據本文中所描述之實施例之用於一光學影像穩定系統之一金屬外殼體536,該光學影像穩定系統被製造為在一插入成型程序中與模製塑膠538a至538d附接之成形金屬。圖146繪示一金屬外殼/殼體536實施例,其包含形成至金屬外殼/殼體536之4側中之經組態以允許齊平地安裝雙壓電晶片致動器544a至544d (諸如本文中所描述之雙壓電晶片致動器)之凹穴542a至542d。Figure 145 illustrates a metal outer housing 536 for an optical image stabilization system manufactured to be attached with molded plastics 538a-538d in an insert molding process according to embodiments described herein Formed metal. Figure 146 depicts a metal housing/housing 536 embodiment that includes formed into 4 sides of the metal housing/housing 536 configured to allow for flush mounting of bimorph actuators 544a-544d (such as herein The pockets 542a to 542d of the bimorph actuator described in

圖147繪示根據一實施例之包含平衡雙壓電晶片致動器及多個定心彈簧之一光學影像穩定(OIS)系統的一分解視圖。該光學影像穩定系統包含一自動聚焦(AF)致動器400,AF致動器400具有四個AF焊料連接件402或在AF致動器400與一聚焦控制電路之間傳遞電流之其他電連接件。針對一些實施例,自動聚焦致動器400包含一或多個SMA致動器,諸如本文中所揭示之SMA致動器。根據一些實施例,AF致動器400經安置於與AF致動器400耦接之一基座404上。根據一些實施例,基座404包含四個隔離區段,其中該等隔離區段之各者經附接至彈簧406a至406d。針對一些實施例,基座404及彈簧406a至406d各由單個平坦組件形成,該平坦組件被分成四個隔離區段以產生四個電板簧電路以控制一物件之移動,例如一光學影像穩定系統之X/Y軸移動及/或一自動焦點之一Z軸移動。Figure 147 depicts an exploded view of an optical image stabilization (OIS) system including a balanced bimorph actuator and centering springs, according to one embodiment. The optical image stabilization system includes an autofocus (AF) actuator 400 with four AF solder connections 402 or other electrical connections that pass current between the AF actuator 400 and a focus control circuit pieces. For some embodiments, autofocus actuator 400 includes one or more SMA actuators, such as the SMA actuators disclosed herein. According to some embodiments, the AF actuator 400 is mounted on a base 404 coupled with the AF actuator 400 . According to some embodiments, base 404 includes four isolation sections, where each of the isolation sections is attached to springs 406a-406d. For some embodiments, the base 404 and the springs 406a-406d are each formed from a single flat member that is divided into four isolated sections to create four electrical leaf spring circuits to control the movement of an object, such as an optical image stabilization X/Y axis movement of the system and/or Z axis movement of an automatic focus.

針對一些實施例,基座404及/或彈簧406a至406d之隔離區段使用一蝕刻程序或其他製造技術(諸如此項技術中已知之技術)形成。為了形成四個板簧電路,將彈簧406a至406d焊接至基座404使得四個彈簧406a至406d之各者經焊接至基座404之四個隔離區段之一者。針對一些實施例,焊接係在包含於四個板簧電路之各者上之焊點408a至408d處,將彈簧406a至406d固定至基座404之隔離區段以產生四個隔離電路徑。針對一些實施例,四個隔離電路徑經組態以用於閉環AF。四個OIS焊料連接件410a至410d經組態以將板簧電路連接至包含於雙壓電晶片OIS致動器412中之OIS控制電路。OIS控制電路經組態以連接至印刷電路板(PCB)以啟用一相機控制電路以操作一AF致動器400及一OIS致動器412,諸如本文中所揭示之實施例。For some embodiments, isolated sections of pedestal 404 and/or springs 406a-406d are formed using an etching process or other fabrication techniques such as those known in the art. To form four leaf spring circuits, the springs 406 a - 406 d are soldered to the base 404 such that each of the four springs 406 a - 406 d is soldered to one of the four isolated sections of the base 404 . For some embodiments, soldering secures springs 406a-406d to isolated sections of base 404 at solder points 408a-408d included on each of the four leaf spring circuits to create four isolated electrical paths. For some embodiments, four isolated electrical paths are configured for closed loop AF. Four OIS solder connections 410 a - 410 d are configured to connect the leaf spring circuit to the OIS control circuit contained in the bimorph OIS actuator 412 . The OIS control circuit is configured to connect to a printed circuit board (PCB) to enable a camera control circuit to operate an AF actuator 400 and an OIS actuator 412, such as the embodiments disclosed herein.

圖148繪示包含四個板簧電路之一OIS系統之一俯視圖。根據一些實施例,板簧電路414a至414d經組態為一不鏽鋼(SST)電路以實現用於控制一影像感測器之移動之一低成本解決方案。針對一些實施例,板簧電路414a至414d由鍍金的100微米不鏽鋼形成。包含板簧電路414a至414d之彈簧之剛性實現可用於使AF致動器相對於一影像感測器居中或以其他方式控制AF致動器之移動之一可靠且穩定的彈簧力。包含於板簧電路414a至414d中之彈簧416a至416d經組態以在移動(例如在一x軸及/或一y軸上之一正或負方向上之移動)之大變化期間產生低應力。例如,針對一些實施例,在330微米之衝程運動期間一彈簧上之最大應力係425兆帕(Mpa)。最小化彈簧上之應力可延長使用壽命(例如,具有低於<638 MPa之無限疲勞極限之一疲勞),由此相對於其他運動控制解決方案改良OIS系統之可靠性。該彈簧亦經組態以在一支撐總成之軸承(例如,軸承)上提供一向下力以對一AF模組及/或一OIS系統提供近零動態傾斜影響。Figure 148 shows a top view of an OIS system comprising four leaf spring circuits. According to some embodiments, the leaf spring circuits 414a-414d are configured as a stainless steel (SST) circuit to enable a low-cost solution for controlling the movement of an image sensor. For some embodiments, the leaf spring circuits 414a-414d are formed from gold plated 100 micron stainless steel. The stiffness of the springs comprising the leaf spring circuits 414a-414d achieves a reliable and stable spring force that can be used to center the AF actuator relative to an image sensor or otherwise control the movement of the AF actuator. The springs 416a-416d included in the leaf spring circuits 414a-414d are configured to produce low stress during large changes in movement, such as movement in a positive or negative direction on an x-axis and/or a y-axis . For example, for some embodiments, the maximum stress on a spring during a stroke motion of 330 microns is 425 megapascals (Mpa). Minimizing the stress on the springs can prolong the service life (eg, one with an infinite fatigue limit below <638 MPa), thereby improving the reliability of the OIS system relative to other motion control solutions. The spring is also configured to provide a downward force on a bearing (eg, bearing) supporting the assembly to provide near-zero dynamic tilt effects on an AF module and/or an OIS system.

圖149繪示包含四個彈簧之一基座。根據一實施例,彈簧418a至418d自由形成以產生一預載(例如,該等彈簧可自由形成以使該彈簧之自由端在一z軸上之一正或負方向上自該基座延伸達6.4毫米(mm))。針對一些實施例,一彈簧自由形成以具有在包含15毫牛頓至35毫牛頓之一範圍內之一預載。一OIS系統中之一彈簧之預載經組態以確保一移動質量(諸如一AF致動器)抵靠一或多個軸承固持。Figure 149 shows a base containing four springs. According to one embodiment, the springs 418a to 418d are freely formed to create a preload (e.g., the springs can be freely formed such that the free ends of the springs extend from the base in a positive or negative direction on a z-axis for 6.4 millimeters (mm)). For some embodiments, a spring is freely formed to have a preload in a range inclusive of 15 millinewtons to 35 millinewtons. The preload of a spring in an OIS system is configured to ensure that a moving mass, such as an AF actuator, is held against one or more bearings.

自由形成彈簧418a至418d可減少彈簧418a至418d之偏轉(例如,該彈簧之偏轉減少至正或負0.1 mm)以降低板簧電路之總高度要求,例如恰當操作所需之在z軸上之空間量。圖150繪示在將彈簧429焊接至基座以產生板簧電路之後的彈簧429。在自由形成該彈簧之前,可在該彈簧中形成一或多個扁平彎曲部。針對一些實施例,一彈簧429包含靠近彈簧429之各端之一扁平彎曲部。例如,一彈簧包含:一第一扁平彎曲部430,其經組態以在一負方向上具有一彎曲,例如一z軸上之一負3.5度;及/或一第二扁平彎曲部431,其經組態以在一正方向上具有一彎曲,例如一z軸上之一正3.5度。針對一些實施例,該扁平彎曲部係在包含0度至正或負7度之一範圍內。該彈簧之其他實施例包含經組態以具有在如所期望之一範圍內之彎曲以滿足設計約束之扁平彎曲部。該彈簧之一或多個扁平彎曲部使該彈簧能夠達成一向下力(例如,+/-25微牛頓(mN)),同時最小化彈簧偏轉量(例如,在正常條件下之臂偏轉<0.1 mm及在全彈簧高度處之臂偏轉<0.2 mm)。該彈簧之一或多個扁平彎曲部亦組態該彈簧以在一個方向(例如,一正z軸方向)上移動以最小化板簧電路下方所需之間隙空間。最小化彈簧偏轉量及最小化在一正z軸方向上之彈簧偏轉減小由板簧電路佔用之空間量(例如,在z軸上之+/-0.2 mm)。據此,使板簧電路中之彈簧之一或多個彎曲部扁平最小化OIS致動器對總相機高度之影響,從而實現更小且更緊湊的電子相機系統之組裝。Free forming of the springs 418a-418d can reduce the deflection of the springs 418a-418d (for example, the deflection of the springs is reduced to plus or minus 0.1 mm) to reduce the overall height requirement of the leaf spring circuit, such as required in the z-axis for proper operation. amount of space. Figure 150 shows the spring 429 after it has been soldered to the base to create a leaf spring circuit. One or more flat bends may be formed in the spring before the spring is freely formed. For some embodiments, a spring 429 includes a flat bend near each end of the spring 429 . For example, a spring includes: a first flat bend 430 configured to have a bend in a negative direction, such as a minus 3.5 degrees in a z-axis; and/or a second flat bend 431, It is configured to have a curvature in a positive direction, for example a positive 3.5 degrees in a z-axis. For some embodiments, the flattened portion is within a range between 0 degrees and plus or minus 7 degrees inclusive. Other embodiments of the spring include flat bends configured to have a bend within a range as desired to meet design constraints. The one or more flat bends of the spring enable the spring to achieve a downward force (e.g., +/- 25 microNewtons (mN)) while minimizing the amount of spring deflection (e.g., <0.1 arm deflection under normal conditions) mm and arm deflection at full spring height <0.2 mm). The one or more flat bends of the spring also configure the spring to move in one direction (eg, a positive z-axis direction) to minimize the clearance space required below the leaf spring circuit. Minimizing the amount of spring deflection and minimizing spring deflection in a positive z-axis direction reduces the amount of space taken up by the leaf spring circuit (eg, +/- 0.2 mm in the z-axis). Accordingly, flattening one or more bends of the spring in the leaf spring circuit minimizes the impact of the OIS actuator on the overall camera height, enabling smaller and more compact assembly of electronic camera systems.

圖151繪示根據一實施例之包含一壓接物之一雙壓電晶片致動器。根據各項實施例,一雙壓電晶片致動器1512包含一樑1514 (諸如本文中所描述之樑)及一或多種SMA材料1516 (諸如一SMA帶或SMA線1516)。針對一些實施例,SMA材料(諸如一SMA線1516)經附裝至雙壓電晶片致動器之一固定端1518 (諸如本文中所描述之彼等固定端),及雙壓電晶片致動器之一負載點端1520 (諸如本文中所描述之負載點端),使得樑1514係在其中附裝SMA材料之兩端之間。固定端1518包含經組態以向下夾持於SMA線1516之一部分上以將該線附裝至固定端1518之一壓接物部分1522。負載點端1520包含經組態以向下夾持於SMA線1516之一部分上以將該線附裝至負載點端1520之一壓接物部分1524。針對各項實施例,SMA材料之端與經組態以使用包含此項技術中已知之技術的技術將電流供應至SMA材料之接觸件電及機械耦接。Figure 151 illustrates a bimorph actuator including a crimp according to one embodiment. According to various embodiments, a bimorph actuator 1512 includes a beam 1514 (such as the beams described herein) and one or more SMA materials 1516 (such as an SMA tape or SMA wire 1516). For some embodiments, SMA material (such as an SMA wire 1516) is attached to a fixed end 1518 of the bimorph actuator (such as those described herein), and the bimorph actuates A point-of-load end 1520 of the device, such as the point-of-load end described herein, such that the beam 1514 is tied between the two ends in which the SMA material is attached. Fixed end 1518 includes a crimp portion 1522 configured to clamp down on a portion of SMA wire 1516 to attach the wire to fixed end 1518 . The point-of-load end 1520 includes a crimp portion 1524 configured to clamp down on a portion of the SMA wire 1516 to attach the wire to the point-of-load end 1520 . For various embodiments, the ends of the SMA material are electrically and mechanically coupled to contacts configured to supply current to the SMA material using techniques including techniques known in the art.

將理解,如本文中用作方便術語之諸如「頂部」、「底部」、「上方」、「下方」及x方向、y方向及z方向之術語表示部件相對於彼此而非任何特定空間或重力定向之空間關係。因此,該等術語意欲於涵蓋組件部件之一總成,而不管該總成是否呈圖式中所展示及說明書中所描述之特定定向而定向,自彼定向倒置或任何其他旋轉變動。It will be understood that terms such as "top," "bottom," "above," "below," and x, y, and z directions, as used herein as terms of convenience, denote parts relative to one another rather than any particular spatial or gravitational force. The spatial relationship of orientation. Accordingly, these terms are intended to cover an assembly of component parts, whether or not the assembly is oriented in the particular orientation shown in the drawings and described in the specification, inverted from that orientation, or any other rotational variation.

將明白,如本文中所使用之術語「本發明」不應被解釋為意謂僅呈現具有單個基本元件或元件群組或之單個發明。類似地,亦將明白,術語「本發明」涵蓋數個單獨創新,該等創新可各被視為係單獨發明。儘管已關於較佳實施例及其圖式詳細地描述本發明,但對於熟習此項技術者應顯而易見的是,可在不脫離本發明之精神及範疇之情況下實現本發明之實施例之各種調適及修改。另外,本文中所描述之技術可用來製作具有兩個、三個、四個、五個、六個或更通常n個雙壓電晶片致動器及帶扣致動器之一裝置。據此,應理解,如上文中所闡述之詳細描述及隨附圖示並非意欲於限制本發明之廣度,該廣度僅應自下文發明申請專利範圍及其適當解釋之合法等效物來推斷。It will be appreciated that the term "the present invention" as used herein should not be interpreted to mean that only a single invention having a single basic element or group of elements or elements is presented. Similarly, it will also be understood that the term "the invention" covers several separate innovations, each of which may be regarded as a separate invention. Although the invention has been described in detail with respect to preferred embodiments and drawings thereof, it should be apparent to those skilled in the art that various embodiments of the invention can be practiced without departing from the spirit and scope of the invention. Adapt and modify. Additionally, the techniques described herein can be used to make a device with two, three, four, five, six, or more typically n bimorph actuators and buckle actuators. Accordingly, it should be understood that the detailed description and accompanying drawings, as set forth above, are not intended to limit the breadth of the present invention, which breadth should be inferred only from the following claims and their legal equivalents when properly construed.

1:雙壓電晶片臂 2:樑部分 10:負載點延伸部 20:形狀記憶合金(SMA)光學影像穩定器 22:移動板 24:靜態板 26:彈簧臂 28a:第一SMA材料附接部分 28b:第二SMA材料附接部分 30a:第一SMA材料附接部分 30b:第二SMA材料附接部分 32a-d:第一SMA線 40:SMA材料附接部分 41a:SMA線 41b:SMA線 43a:SMA線 43b:SMA線 42:SMA附接部分 46a:帶扣致動器 46b:帶扣致動器 47a-d:帶扣臂 48a:SMA線 48b:SMA線 49a:電阻焊線壓接物 49b:電阻焊線壓接物 45:SMA致動器 50:島狀物 51:金屬/不鏽鋼基層 52:介電層 53:導體層 60:帶扣致動器 61:液體透鏡總成 62:基座 64:成形環耦接器/成形環/耦接器 65:滑動基座 70:未固定、負載點端 71:平坦表面 72:SMA線 73:電阻焊 76:未固定、負載點端 77:平坦表面 78:SMA線 79:黏合劑 80:未固定、負載點端 81:平坦表面 82:SMA線 83:電阻焊 84:金屬夾層 88:未固定、負載點端 89:平坦表面 90:SMA線 91:黏合劑 92:金屬夾層 95:固定端 96:平坦表面 97:SMA線 98:電阻焊 100:形狀記憶合金(SMA)線 101:基座 102:帶扣致動器 104:中心部分 106:壓接物結構 108:z衝程方向 120:固定端 121:平坦表面 122:SMA線 123:黏合劑 126:固定端 127:平坦表面 128:SMA線 129:電阻焊 130:金屬夾層 135:固定端 136:平坦表面 137:SMA線 138:金屬夾層 139:黏合劑 143:雙壓電晶片臂/固定端 144:島狀物 145:外部 146:絕緣體 160:長形孔徑 170:未固定、負載點端 171:平坦表面 172:SMA線 173:電阻焊區 174:輻射表面區域 175:近端部分 176:遠端部分 178:近端孔徑 179:遠端孔徑 193:近端孔徑 194:遠端孔徑 195:固定端 196:平坦表面 197:SMA線 198:電阻焊區 202:雙壓電晶片致動器 204:基座 206:SMA帶 208:z衝程方向 270:未固定、負載點端 271:平坦表面 272:SMA線 273:電阻焊區 274:輻射表面區域 278:近端孔徑 279:遠端孔徑 280:長形孔徑 294:非線性孔徑 295:固定端 296:平坦表面 297:SMA線 298:電阻焊區 302:SMA致動器 304:光學影像穩定器(「OIS」) 306:透鏡托架 308:復位彈簧 310:垂直滑動軸承 312:引導蓋 370:未固定、負載點端 371:平坦表面 372:SMA線 373:電阻焊區 374:輻射表面區域 378:非線性孔徑 400:自動聚焦(AF)致動器 402:AF焊料連接件 404:基座 406a至406d:彈簧 408a至408d:焊點 410a至410d:OIS焊料連接件 412:雙壓電晶片OIS致動器 414a至414d:板簧電路 416a至416d:彈簧 418a至418d:彈簧 429:彈簧 430:第一扁平彎曲部 431:第二扁平彎曲部 440:平衡雙壓電晶片致動器 441:基座 442:雙壓電晶片臂/第一雙壓電晶片臂 443:雙壓電晶片臂/另一雙壓電晶片臂 444a:摩擦分量/摩擦力分量 444b:摩擦分量/摩擦力分量 445a:力衝程 445b:力衝程 448a至448d:平衡雙壓電晶片致動器 450:平衡雙壓電晶片致動器 451a:控制輸入墊 451b:接地墊 452a:雙壓電晶片臂/第一雙壓電晶片臂 452b:雙壓電晶片臂/第二雙壓電晶片臂 453:基座 454a:摩擦力分量 454b:摩擦力分量 456a:第一雙壓電晶片臂 456b:第二雙壓電晶片臂 458a:SMA線/第一SMA線 458b:SMA線/第二SMA線 459:聚酰亞胺層 460:共同基座島狀物 461a:控制輸入墊 461b:接地墊 462a:第一雙壓電晶片臂 462b:第二雙壓電晶片臂 463:基座 464a:雙壓電晶片臂/第一雙壓電晶片臂 464b:雙壓電晶片臂/第二雙壓電晶片臂 466a:摩擦力分量 466b:摩擦力分量 467a:SMA線/第一SMA線 467b:SMA線/第二SMA線 468a:固定端 468b:固定端 469a:第一雙壓電晶片臂 469b:第二雙壓電晶片 470:未固定、負載點端 471:平坦表面 472:SMA線 473:電阻焊區 474:輻射表面區域 478:非線性孔徑 479:部分蝕刻槽 480:控制輸入墊 481:接地墊 482a:雙壓電晶片臂/第一雙壓電晶片臂 482b:雙壓電晶片臂/第二雙壓電晶片臂 483a:摩擦力分量 483b:摩擦力分量 484a:固定端 484b:固定端 485a:SMA線 485b:SMA線 486:聚酰亞胺層 487:控制輸入墊 488:接地墊 489:基座 502:感測器 504:z方向 506:帶扣致動器 508:SMA線 510a至510d:凹穴 511:外殼體 512a至512d:雙壓電晶片模組 514a至514d:雙壓電晶片致動器 516:光學影像穩定外殼體 518a至518d:雙壓電晶片致動器 520a至520d:雙壓電晶片模組 522a至522d:平衡托架/模組、雙壓電晶片托架/模組 524:影像感測器 526:外殼體 528:移動影像感測器托架 530:凹穴 532:外殼體 534a至534d:雙壓電晶片模組 536:金屬外殼體、金屬外殼/殼體 536a至536d:金屬外殼體、金屬外殼/殼體 538a至538d:模製塑膠 542a至542d:凹穴 570:聚酰亞胺層 571:基座 572:控制輸入墊 573:接地墊 574a:雙壓電晶片臂/第一雙壓電晶片臂 574b:雙壓電晶片臂/第二雙壓電晶片臂 575a:摩擦力分量 575b:摩擦力分量 576a:第一雙壓電晶片臂 576b:第二雙壓電晶片臂 577a:雙壓電晶片臂 577b:雙壓電晶片臂 578:SMA線 579:SMA線 604:透鏡托架 606:線保持器 608:智慧型記憶合金(「SMA」)線/智慧型記憶合金(「SMA」)線 610:帶扣臂 612:彈簧臂 702:滑動基座 704:總成基座 706:滑動軸承 708:垂直滑動表面 710:帶扣致動器 802:帶扣致動器 804:帶扣臂 806:吊床部分 870:未固定、負載點端 871:平坦表面 872:SMA線 873:電阻焊區 874:輻射表面區域 875:近端部分 876:遠端部分 893:近端孔徑 894:遠端孔徑 895:固定端 896:平坦表面 897:SMA線 898:電阻焊區 902:雙壓電晶片致動器 904:透鏡托架 906:端 908:基座 1002:自動聚焦總成 1004:位置感測器 1005:z方向 1006:移動彈簧 1008:磁體 1010:透鏡托架 1102a:雙壓電晶片致動器 1102b:雙壓電晶片致動器 1104a:樑 1104b:樑 1106b:SMA帶 1108b:黏合膜材料 1110a:接觸件 1110b:接觸件 1110c:接觸件 1112b:20微米厚絕緣體 1112c:20微米厚絕緣體 1202:SMA材料 1203a:端墊 1203b:端墊 1204:中心饋電 1206:樑 1208:中心金屬 1210:絕緣體 1212:開口或通孔 1214a:電源區段 1214b:接地區段 1216:電力供應器接觸件 1218:接地接觸件 1220:表塗層 1222:間隙 1224:通孔區段 1226:通孔區段 1302:第一帶扣致動器 1304:第二帶扣致動器 1306:透鏡托架 1308a:吊床部分 1308b:吊床部分 1310a:帶扣臂 1310b:帶扣臂 1312a:帶扣臂 1312b:帶扣臂 1314:滑動基座 1316:滑動基座 1318a:SMA線 1318b:SMA線 1512:雙壓電晶片致動器 1514:樑 1516:SMA材料/SMA帶或SMA線 1518:固定端 1520:負載點端 1522:壓接物部分 1524:壓接物部分 1902:第一帶扣致動器 1904:第二帶扣致動器 1906:透鏡托架 1908a:吊床部分 1908b:吊床部分 1914:滑動基座 1916:滑動基座 1918:基座部分 1920:蓋部分 2202:第一帶扣致動器 2204:第二帶扣致動器 2206:透鏡托架 2218a:左SMA線 2218b:右SMA線 2302:第一帶扣致動器 2304:第二帶扣致動器 2305:耦接器環 2306:透鏡托架 2308a:吊床部分 2309b:吊床部分 2401:滑動基座 2402:帶扣致動器 2403:復位彈簧 2404a至2404d:帶扣臂 2405:透鏡托架 2406:透鏡托架 2406a:層壓吊床 2406b:層壓吊床 2408a:SMA線 2408b:SMA線 2409:殼體 2412a至2412d:層壓形成壓接物連接件 2413:壓接物 2414:適配器板 2415:信號跡線 2501:SMA系統 3000:加強件 3001a:滑動基座 3001b:滑動基座 3002:帶扣致動器 3003:復位彈簧 3004a至3004d:帶扣臂 3006:透鏡托架 3008a:SMA線 3008b:SMA線 3009a:殼體 3009b:殼體 3012a至3012d:電阻焊線壓接物 3014:適配器板 3020:撓性電路 3022a:電鍍墊 3022b:電鍍墊 3101:SMA系統 3501:SMA雙壓電晶片液體透鏡 3502:液體透鏡子總成 3504:殼體 3506:SMA致動器 3508:雙壓電晶片致動器 3510:成形環 3512:撓性隔膜 3514:液體 3516:體容納環 3518:透鏡 3520:接觸件 3902:SMA致動器 3904:正z衝程致動器 3906:負z衝程致動器 3908:SMA線 3910:透鏡支架 3912:頂部彈簧 3914:頂部間隔件 3916:底部間隔件 3918:底部彈簧 3920:基座 4102:長度 4103:雙壓電晶片致動器 4104:接合墊 4106:SMA線 4108:延伸長度 4202:SMA雙壓電晶片致動器 4302:負致動器信號連接件 4304:基座 4306a:雙壓電晶片致動器 4306b:雙壓電晶片致動器 4308:線接合墊 4310:黏合劑層 4312b:SMA線 4314:正致動器信號連接件 4316:線接合墊 4318:黏合劑層 4322:連接墊 4602:撓性感測器電路 4604:雙壓電晶片致動器電路 4606:雙壓電晶片致動器 4606a至4606h:雙壓電晶片致動器 4608:移動托架 4610:外殼 4802:SMA致動器 4804:外殼 5002:SMA致動器 5004:4側安裝SMA雙壓電晶片致動器 5202:雙壓電晶片致動器 5402:底部安裝雙壓電晶片致動器 5502:頂部及底部安裝SMA雙壓電晶片致動器 5802:SMA致動器/盒式雙壓電晶片致動器 5806:雙壓電晶片致動器 5806a至5806d:雙壓電晶片致動器 6202:SMA致動器/盒式雙壓電晶片致動器 6204:雙壓電晶片致動器 6204a至6204h:雙壓電晶片致動器 6504:外殼 6506:透鏡托架 6602:SMA致動器 6604:雙壓電晶片致動器/透鏡托架 6604a至6604h:雙壓電晶片致動器 6802:SMA致動器/盒式雙壓電晶片致動器 6804:感測器托架 6806a至6806d:雙壓電晶片致動器 7402:SMA致動器/盒式雙壓電晶片致動器 7404:雙壓電晶片致動器 7404a至7404d:雙壓電晶片致動器 7902:SMA致動器 7904:雙壓電晶片致動器 8402:SMA致動器 8404:雙壓電晶片致動器 8404a至8404d:雙壓電晶片致動器 8901:透鏡系統 8902:折疊透鏡 8903a至8903d:透鏡 8904:主軸 8906:透射軸 9001:透鏡系統 9002a至9002h:液體透鏡 9004:影像感測器 9100:致動式折疊透鏡 9102:稜鏡 9104:致動器 9106:雙壓電晶片致動器 9201:雙壓電晶片臂 9202:雙壓電晶片樑 9203:成形偏移 9204:偏移/彎曲平面z偏移 9206:偏移/槽寬度 9208:長度 9210:SMA帶或SMA線 9212:固定端 9214:負載點端 9301:雙壓電晶片臂 9302:雙壓電晶片樑 9303:成形偏移 9304:限制器 9306:未固定、負載點端 9308:SMA帶或SMA線 9401:雙壓電晶片臂 9402:雙壓電晶片樑 9403:成形偏移 9404:限制器 9406:基座 9408:凹部 9410:部分 9501:雙壓電晶片臂 9502:雙壓電晶片樑 9504:成形偏移 9506:SMA帶或SMA線 9601a:雙壓電晶片臂 9601b:雙壓電晶片臂 9602a:雙壓電晶片光樑 9602b:雙壓電晶片光樑 9604a:成形偏移 9604b:成形偏移 9606a:SMA帶或SMA線 9606b:SMA帶或SMA線 9608:基座 9610:雙壓電晶片致動器 9612:雙壓電晶片致動器 9614:雙壓電晶片致動器 9701:帶扣臂 9702:樑部分 9704a:負載點延伸部 9704b:負載點延伸部 9706a:端 9706b:端 9710a:負載點 9710b:負載點 9712:SMA帶或SMA線 9801:帶扣臂 9802:樑部分 9804:負載點 9810:負載點延伸部 9901:雙壓電晶片臂 9902:樑部分 9904a:負載點延伸部 9904b:負載點延伸部 9906:SMA帶或SMA線 9910a:端 9910b:端 1: Bimorph arm 2: beam part 10: Point of load extension 20: Shape memory alloy (SMA) optical image stabilizer 22: Mobile board 24: static board 26: spring arm 28a: First SMA material attachment portion 28b: Second SMA material attachment portion 30a: first SMA material attachment portion 30b: Second SMA material attachment portion 32a-d: 1st SMA wire 40: SMA material attachment part 41a: SMA wire 41b: SMA wire 43a: SMA wire 43b: SMA wire 42: SMA attachment part 46a: Buckle actuator 46b: Buckle Actuator 47a-d: buckle arm 48a: SMA wire 48b: SMA wire 49a: Resistance bonding wire crimp 49b: Resistance bonding wire crimp 45: SMA actuator 50: island 51: Metal/stainless steel substrate 52: Dielectric layer 53: conductor layer 60: Buckle Actuator 61: Liquid lens assembly 62: base 64: Forming ring coupler / forming ring / coupler 65: sliding base 70: Unfixed, point-of-load end 71: flat surface 72: SMA line 73: resistance welding 76: Unfixed, point-of-load end 77: flat surface 78: SMA line 79: Adhesive 80: Unfixed, point-of-load end 81: flat surface 82: SMA line 83: resistance welding 84: metal interlayer 88: Unfixed, point-of-load end 89: flat surface 90: SMA line 91: Adhesive 92: metal interlayer 95: fixed end 96: flat surface 97: SMA line 98: resistance welding 100: Shape memory alloy (SMA) wire 101: base 102: buckle actuator 104: central part 106: Crimp structure 108:z stroke direction 120: fixed end 121: flat surface 122: SMA line 123: Adhesive 126: fixed end 127: flat surface 128: SMA line 129: resistance welding 130: metal interlayer 135: fixed end 136: flat surface 137: SMA line 138: metal interlayer 139: Adhesive 143: Bimorph arm/fixed end 144: island 145: external 146: insulator 160: Long aperture 170: Unfixed, point-of-load end 171: flat surface 172: SMA line 173: resistance welding area 174: Radiation Surface Area 175: Proximal part 176: Distal part 178: proximal aperture 179: Distal Aperture 193: proximal aperture 194: Distal Aperture 195: fixed end 196: flat surface 197: SMA line 198: resistance welding area 202: Bimorph Actuator 204: base 206: SMA belt 208:z stroke direction 270: Unfixed, point-of-load end 271: flat surface 272: SMA line 273: resistance welding area 274: Radiation Surface Area 278: proximal aperture 279: Distal Aperture 280: Long aperture 294: Nonlinear Aperture 295: fixed end 296: flat surface 297: SMA line 298: resistance welding area 302: SMA actuator 304: Optical Image Stabilizer ("OIS") 306: Lens bracket 308: return spring 310: vertical sliding bearing 312: boot cover 370: Unfixed, point-of-load end 371: flat surface 372: SMA line 373: resistance welding area 374: Radiation Surface Area 378:Nonlinear Aperture 400: Auto Focus (AF) Actuator 402: AF solder connector 404: base 406a to 406d: Spring 408a to 408d: solder joints 410a to 410d: OIS solder connections 412: Bimorph OIS Actuator 414a to 414d: leaf spring circuit 416a to 416d: Spring 418a to 418d: Spring 429: spring 430: the first flat curved part 431: second flat curved part 440: Balanced Bimorph Actuator 441: base 442: Bimorph Arm/First Bimorph Arm 443: bimorph arm/another bimorph arm 444a: Friction component/Friction force component 444b: Friction component/Friction component 445a: force stroke 445b: force stroke 448a to 448d: Balanced bimorph actuators 450: Balanced Bimorph Actuator 451a: Control input pad 451b: Ground pad 452a: Bimorph Arm/First Bimorph Arm 452b: Bimorph Arm/Second Bimorph Arm 453: base 454a: Friction component 454b: Friction component 456a: First bimorph arm 456b: Second bimorph arm 458a: SMA line / first SMA line 458b: SMA line/Second SMA line 459: polyimide layer 460:Common base island 461a: Control input pad 461b: Ground pad 462a: First bimorph arm 462b: Second bimorph arm 463:Pedestal 464a: Bimorph Arm/First Bimorph Arm 464b: Bimorph Arm/Second Bimorph Arm 466a: Friction component 466b: Friction component 467a: SMA line / first SMA line 467b: SMA line/Second SMA line 468a: fixed end 468b: fixed end 469a: First bimorph arm 469b: Second bimorph 470: Unfixed, point-of-load end 471: flat surface 472: SMA line 473: resistance welding area 474: Radiation Surface Area 478:Nonlinear Aperture 479: Partial etching groove 480:Control Input Pad 481: Ground pad 482a: Bimorph Arm/First Bimorph Arm 482b: Bimorph Arm/Second Bimorph Arm 483a: Friction component 483b: Friction component 484a: fixed end 484b: fixed end 485a: SMA wire 485b: SMA wire 486: polyimide layer 487:Control Input Pad 488: Ground pad 489:Pedestal 502: sensor 504: z direction 506: Buckle Actuator 508: SMA line 510a to 510d: pockets 511: Outer shell 512a to 512d: bimorph modules 514a to 514d: bimorph actuators 516: Optical image stabilization housing 518a to 518d: bimorph actuators 520a to 520d: bimorph modules 522a to 522d: Balance Bracket/Module, Bimorph Bracket/Module 524: image sensor 526: Outer shell 528:Mobile Image Sensor Bracket 530: pit 532: Outer shell 534a to 534d: bimorph modules 536: Metal shell, metal shell/shell 536a to 536d: Metal outer shell, metal shell/housing 538a to 538d: molded plastic 542a to 542d: pockets 570: polyimide layer 571: base 572:Control Input Pad 573: Ground pad 574a: Bimorph Arm/First Bimorph Arm 574b: Bimorph Arm/Second Bimorph Arm 575a: Friction component 575b: Friction component 576a: First bimorph arm 576b: Second bimorph arm 577a: Bimorph arm 577b: Bimorph Arm 578: SMA line 579: SMA line 604: Lens bracket 606: wire retainer 608:Smart Memory Alloy (“SMA”) Wire/Smart Memory Alloy (“SMA”) Wire 610: buckle arm 612: spring arm 702: sliding base 704: Assembly base 706: sliding bearing 708: Vertical sliding surface 710: buckle actuator 802: Buckle Actuator 804: buckle arm 806: hammock part 870: Unfixed, point-of-load end 871: flat surface 872: SMA line 873: resistance welding area 874: Radiation Surface Area 875:proximal part 876: Distal part 893: Proximal Aperture 894: Distal Aperture 895: fixed end 896: flat surface 897: SMA line 898: resistance welding area 902: Bimorph Actuator 904: Lens bracket 906: end 908: base 1002: Auto focus assembly 1004: Position sensor 1005: z direction 1006: mobile spring 1008: magnet 1010: Lens bracket 1102a: Bimorph Actuator 1102b: Bimorph Actuator 1104a: Beam 1104b: Beam 1106b: SMA belt 1108b: adhesive film material 1110a: contact piece 1110b: contact piece 1110c: contact piece 1112b: 20 micron thick insulator 1112c: 20 micron thick insulator 1202: SMA material 1203a: End pad 1203b: End pad 1204: Center feed 1206: Beam 1208: center metal 1210: insulator 1212: Opening or through hole 1214a: Power section 1214b: Grounding section 1216: Power supply contact piece 1218: Ground contact 1220: surface coating 1222: gap 1224: through hole section 1226: through hole section 1302: First Buckle Actuator 1304: Second Buckle Actuator 1306: Lens bracket 1308a: Hammock part 1308b: Hammock part 1310a: buckle arm 1310b: buckle arm 1312a: buckle arm 1312b: buckle arm 1314: sliding base 1316: sliding base 1318a: SMA wire 1318b: SMA wire 1512: Bimorph Actuator 1514: Beam 1516: SMA material/SMA tape or SMA wire 1518: fixed end 1520: point of load terminal 1522: Crimp part 1524: Crimp part 1902: First Buckle Actuator 1904: Second Buckle Actuator 1906: Lens holder 1908a: Hammock section 1908b: Hammock section 1914: Sliding base 1916: Sliding base 1918: Base section 1920: cover part 2202: First Buckle Actuator 2204: Second Buckle Actuator 2206: Lens bracket 2218a: left SMA wire 2218b: Right SMA wire 2302: First Buckle Actuator 2304:Second Buckle Actuator 2305: Coupler ring 2306: Lens bracket 2308a: Hammock part 2309b: Hammock part 2401: sliding base 2402: Buckle Actuator 2403: return spring 2404a to 2404d: buckle arm 2405: Lens bracket 2406: Lens bracket 2406a: Laminated Hammock 2406b: Laminated Hammock 2408a: SMA wire 2408b: SMA wire 2409: shell 2412a to 2412d: lamination to form crimp connections 2413: Crimp 2414: Adapter board 2415: signal trace 2501: SMA system 3000: reinforcement 3001a: sliding base 3001b: sliding base 3002: Buckle Actuator 3003: return spring 3004a to 3004d: buckle arm 3006: Lens bracket 3008a: SMA wire 3008b: SMA wire 3009a: shell 3009b: shell 3012a to 3012d: Resistance Bonding Wire Crimps 3014: Adapter board 3020: Flexible Circuits 3022a: Plating Pad 3022b: Plating Pads 3101: SMA system 3501: SMA Bimorph Liquid Lens 3502: Liquid Lens Subassembly 3504: shell 3506: SMA Actuator 3508: Bimorph Actuator 3510: forming ring 3512: flexible diaphragm 3514: liquid 3516: body containment ring 3518: lens 3520: contact piece 3902: SMA Actuator 3904: Positive z-stroke actuator 3906: Negative z-stroke actuator 3908: SMA wire 3910: Lens Holder 3912: top spring 3914: top spacer 3916: Bottom spacer 3918: bottom spring 3920:Pedestal 4102: Length 4103: Bimorph Actuator 4104: Bonding Pad 4106: SMA wire 4108: Extended length 4202: SMA Bimorph Actuator 4302: Negative Actuator Signal Connection 4304: base 4306a: Bimorph Actuator 4306b: Bimorph Actuator 4308: Wire Bonding Pads 4310: adhesive layer 4312b: SMA wire 4314: Positive Actuator Signal Connection 4316: Wire Bonding Pads 4318: adhesive layer 4322: connection pad 4602: Flexible Sensor Circuit 4604: Bimorph Actuator Circuit 4606: Bimorph Actuator 4606a to 4606h: Bimorph Actuators 4608: Mobile bracket 4610: shell 4802: SMA Actuator 4804: Shell 5002:SMA Actuator 5004: 4 Side Mount SMA Bimorph Actuators 5202: Bimorph Actuator 5402: Bottom Mounted Bimorph Actuator 5502: Top and Bottom Mount SMA Bimorph Actuators 5802: SMA Actuator / Cassette Bimorph Actuator 5806: Bimorph Actuator 5806a to 5806d: Bimorph Actuators 6202: SMA Actuator / Cassette Bimorph Actuator 6204: Bimorph Actuator 6204a to 6204h: Bimorph Actuators 6504: Shell 6506: Lens holder 6602: SMA Actuator 6604: Bimorph Actuator/Lens Holder 6604a to 6604h: Bimorph Actuators 6802: SMA Actuator / Cassette Bimorph Actuator 6804: Sensor bracket 6806a to 6806d: Bimorph Actuators 7402: SMA Actuator / Cassette Bimorph Actuator 7404: Bimorph Actuator 7404a to 7404d: Bimorph Actuators 7902: SMA Actuator 7904: Bimorph Actuator 8402: SMA Actuator 8404: Bimorph Actuator 8404a to 8404d: Bimorph Actuators 8901: lens system 8902: folding lens 8903a to 8903d: Lenses 8904:Spindle 8906: Transmission Axis 9001: Lens system 9002a to 9002h: Liquid lenses 9004: image sensor 9100: Actuated Folding Lenses 9102: 稜鏡 9104: Actuator 9106: Bimorph Actuator 9201: Bimorph arm 9202: Bimorph Beam 9203: Forming offset 9204: Offset/bend plane z offset 9206: Offset/slot width 9208: length 9210: SMA tape or SMA wire 9212: fixed end 9214: Point of load terminal 9301: Bimorph Arm 9302: Bimorph Beam 9303: Forming offset 9304: limiter 9306: Unfixed, point-of-load 9308: SMA tape or SMA wire 9401: Bimorph Arm 9402: Bimorph Beam 9403: Forming offset 9404: limiter 9406: base 9408: Concave 9410: part 9501: Bimorph Arm 9502: Bimorph Beam 9504: Forming offset 9506: SMA tape or SMA wire 9601a: Bimorph Arm 9601b: Bimorph Arm 9602a: Bimorph Light Beam 9602b: Bimorph Light Beam 9604a: Forming Offset 9604b: Form offset 9606a: SMA tape or SMA wire 9606b: SMA tape or SMA wire 9608: base 9610: Bimorph Actuator 9612: Bimorph Actuator 9614: Bimorph Actuator 9701: buckle arm 9702: beam part 9704a: Point of Load Extension 9704b: Point of Load Extension 9706a: terminal 9706b: end 9710a: Point of Load 9710b: Point of Load 9712: SMA tape or SMA wire 9801: buckle arm 9802: beam part 9804: Point of load 9810: Point of Load Extension 9901: Bimorph Arm 9902: beam part 9904a: Point of Load Extension 9904b: Point of Load Extension 9906: SMA tape or SMA wire 9910a: terminal 9910b: terminal

在隨附圖式之圖中以實例且非限制之方式繪示本發明之實施例,其中類似元件符號指示類似元件且其中:Embodiments of the present invention are depicted by way of example and not limitation in the figures of the accompanying drawings, wherein like element numbers indicate like elements and wherein:

圖1a繪示根據一實施例之包含經組態為一帶扣致動器之一SMA致動器之一透鏡總成;Figure 1a illustrates a lens assembly including an SMA actuator configured as a buckle actuator according to one embodiment;

圖1b繪示根據一實施例之一SMA致動器;Figure 1b illustrates an SMA actuator according to an embodiment;

圖2繪示根據一實施例之一SMA致動器;Figure 2 illustrates an SMA actuator according to an embodiment;

圖3繪示根據一實施例之包含一SMA線致動器之一自動聚焦總成的一分解視圖;Figure 3 illustrates an exploded view of an autofocus assembly including an SMA wire actuator according to one embodiment;

圖4繪示根據一實施例之包含一SMA致動器之自動聚焦總成;Figure 4 illustrates an autofocus assembly including an SMA actuator according to one embodiment;

圖5繪示根據一實施例之包含一感測器之一SMA致動器;Figure 5 illustrates an SMA actuator including a sensor according to one embodiment;

圖6繪示根據一實施例之經組態為一帶扣致動器之一SMA致動器的一俯視圖及一側視圖,該SMA致動器配備有一透鏡托架;6 depicts a top view and a side view of an SMA actuator configured as a buckle actuator equipped with a lens holder according to one embodiment;

圖7繪示根據該實施例之SMA致動器之一區段的一側視圖;Figure 7 shows a side view of a section of the SMA actuator according to the embodiment;

圖8繪示一帶扣致動器之一實施例的多個視圖;Figure 8 depicts multiple views of an embodiment of a belt buckle actuator;

圖9繪示根據一實施例之具有一透鏡托架之一雙壓電晶片致動器;Figure 9 illustrates a bimorph actuator with a lens holder according to one embodiment;

圖10繪示根據一實施例之包含一SMA致動器之一自動聚焦總成之一剖視圖;10 illustrates a cross-sectional view of an autofocus assembly including an SMA actuator, according to one embodiment;

圖11a至圖11c繪示根據一些實施例之雙壓電晶片致動器之視圖;11a-11c illustrate views of bimorph actuators according to some embodiments;

圖12繪示根據一實施例之一雙壓電晶片致動器之一實施例之視圖;12 illustrates a view of an embodiment of a bimorph actuator according to an embodiment;

圖13繪示根據一實施例之一雙壓電晶片致動器的一端墊橫截面;13 illustrates a cross-section of an end pad of a bimorph actuator according to an embodiment;

圖14繪示根據一實施例之一雙壓電晶片致動器的一中心供應墊橫截面;Figure 14 illustrates a central supply pad cross-section of a bimorph actuator according to one embodiment;

圖15繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一分解視圖;Figure 15 illustrates an exploded view of an SMA actuator comprising two buckle actuators according to one embodiment;

圖16繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器;Figure 16 illustrates an SMA actuator comprising two buckle actuators according to one embodiment;

圖17繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一側視圖;Figure 17 illustrates a side view of an SMA actuator comprising two buckle actuators according to one embodiment;

圖18繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一側視圖;Figure 18 illustrates a side view of an SMA actuator comprising two buckle actuators according to one embodiment;

圖19繪示根據一實施例之包含一SMA致動器之一總成的一分解視圖,該SMA致動器包含兩個帶扣致動器;Figure 19 depicts an exploded view of an assembly including an SMA actuator including two buckle actuators according to one embodiment;

圖20繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器;Figure 20 illustrates an SMA actuator comprising two buckle actuators according to one embodiment;

圖21繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器;Figure 21 illustrates an SMA actuator comprising two buckle actuators according to one embodiment;

圖22繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器;Figure 22 illustrates an SMA actuator comprising two buckle actuators according to one embodiment;

圖23繪示根據一實施例之包含兩個帶扣致動器及一耦接器之一SMA致動器;Figure 23 illustrates an SMA actuator comprising two buckle actuators and a coupler, according to one embodiment;

圖24繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解視圖,該SMA致動器包含具有一層壓吊床之一帶扣致動器;24 depicts an exploded view of an SMA system including an SMA actuator including a buckle actuator with a laminated hammock, according to one embodiment;

圖25繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含具有一層壓吊床之一帶扣致動器2402;Figure 25 illustrates an SMA system comprising an SMA actuator comprising a buckle actuator 2402 with a laminated hammock, according to one embodiment;

圖26繪示根據一實施例之包含一層壓吊床之一帶扣致動器;Figure 26 illustrates a buckle actuator comprising a laminated hammock according to one embodiment;

圖27繪示根據一實施例之一SMA致動器之一層壓吊床;Figure 27 illustrates a laminated hammock with an SMA actuator according to one embodiment;

圖28繪示根據一實施例之一SMA致動器之一層壓形成壓接物連接件;Figure 28 illustrates a lamination of an SMA actuator to form a crimp connection according to one embodiment;

圖29繪示包含具有一層壓吊床之一帶扣致動器之一SMA致動器;Figure 29 depicts an SMA actuator comprising a buckle actuator with a laminated hammock;

圖30繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解視圖,該SMA致動器包含一帶扣致動器;30 illustrates an exploded view of an SMA system including an SMA actuator including a belt buckle actuator, according to one embodiment;

圖31繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含一帶扣致動器;Figure 31 illustrates an SMA system comprising an SMA actuator comprising a buckle actuator, according to one embodiment;

圖32繪示根據一實施例之包含一帶扣致動器之一SMA致動器;Figure 32 illustrates an SMA actuator including a buckle actuator according to one embodiment;

圖33繪示根據一實施例之一SMA致動器之一對帶扣臂之一雙軛捕獲接頭;Figure 33 illustrates a double yoke capture joint of a buckle arm of an SMA actuator according to one embodiment;

圖34繪示根據一實施例之一SMA致動器之一電阻焊壓接物,該SMA致動器用來將一SMA線附接至帶扣致動器;34 illustrates a resistance weld crimp of an SMA actuator used to attach an SMA wire to a buckle actuator, according to one embodiment;

圖35繪示包含具有一雙軛捕獲接頭之一帶扣致動器之一SMA致動器;Figure 35 depicts an SMA actuator comprising a buckle actuator with a double yoke capture joint;

圖36繪示根據一實施例之一SMA雙壓電晶片液體透鏡;Figure 36 illustrates a SMA bimorph liquid lens according to one embodiment;

圖37繪示根據一實施例之一透視SMA雙壓電晶片液體透鏡;Figure 37 illustrates a see-through SMA bimorph liquid lens according to one embodiment;

圖38繪示根據一實施例之SMA雙壓電晶片液體透鏡的一橫截面及一仰視圖;38 illustrates a cross-section and a bottom view of an SMA bimorph liquid lens according to an embodiment;

圖39繪示根據一實施例之包含具有雙壓電晶片致動器之一SMA致動器之一SMA系統;39 illustrates an SMA system including an SMA actuator with a bimorph actuator, according to one embodiment;

圖40繪示根據一實施例之具有雙壓電晶片致動器之SMA致動器;Figure 40 illustrates an SMA actuator with a bimorph actuator according to one embodiment;

圖41繪示一雙壓電晶片致動器之長度及用於一SMA線使線長度延伸超出雙壓電晶片致動器之一接合墊之位置;Figure 41 depicts the length of a bimorph actuator and the location of a bond pad for an SMA wire extending the wire length beyond the bimorph actuator;

圖42繪示根據一實施例之包含一雙壓電晶片致動器之一SMA系統的一分解視圖;Figure 42 depicts an exploded view of an SMA system including a bimorph actuator according to one embodiment;

圖43繪示根據一實施例之SMA致動器之一子區段的一分解視圖;Figure 43 depicts an exploded view of a subsection of an SMA actuator according to one embodiment;

圖44繪示根據一實施例之SMA致動器之一子區段;Figure 44 depicts a subsection of an SMA actuator according to one embodiment;

圖45繪示根據一實施例之一5軸感測器移位系統;Figure 45 illustrates a 5-axis sensor displacement system according to one embodiment;

圖46繪示根據一實施例之一5軸感測器移位系統的一分解視圖;Figure 46 depicts an exploded view of a 5-axis sensor displacement system according to one embodiment;

圖47繪示根據一實施例之包含整合至此電路中以用於所有運動之雙壓電晶片致動器之一SMA致動器;Figure 47 depicts an SMA actuator including a bimorph actuator integrated into the circuit for all motions, according to one embodiment;

圖48繪示根據一實施例之包含整合至此電路中以用於所有運動之雙壓電晶片致動器之一SMA致動器;Figure 48 depicts an SMA actuator including a bimorph actuator integrated into the circuit for all motions, according to one embodiment;

圖49繪示根據一實施例之一5軸感測器移位系統的一橫截面;Figure 49 depicts a cross-section of a 5-axis sensor displacement system according to one embodiment;

圖50繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器;Figure 50 illustrates an SMA actuator including a bimorph actuator according to one embodiment;

圖51繪示根據一實施例之包含在不同的x及y位置中移動一影像感測器之雙壓電晶片致動器之一SMA致動器的一俯視圖;51 illustrates a top view of an SMA actuator comprising a bimorph actuator that moves an image sensor in different x and y positions, according to one embodiment;

圖52繪示根據一實施例之經組態為一盒式雙壓電晶片自動聚焦裝置之包含雙壓電晶片致動器之一SMA致動器;52 illustrates an SMA actuator including a bimorph actuator configured as a cassette bimorph autofocus device according to one embodiment;

圖53繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器;Figure 53 illustrates an SMA actuator comprising a bimorph actuator according to one embodiment;

圖54繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器;Figure 54 illustrates an SMA actuator comprising a bimorph actuator according to one embodiment;

圖55繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器;Figure 55 illustrates an SMA actuator comprising a bimorph actuator according to one embodiment;

圖56繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 56 illustrates an SMA system including an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖57繪示根據一實施例之包含一SMA致動器之SMA系統的一分解視圖,該SMA致動器包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器;57 depicts an exploded view of an SMA system comprising an SMA actuator comprising a bimorph actuator configured as a biaxial lens shift OIS, according to one embodiment;

圖58繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面,該SMA致動器包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器;58 depicts a cross-section of an SMA system comprising an SMA actuator comprising a bimorph actuator configured as a biaxial lens shift OIS, according to one embodiment;

圖59繪示根據一實施例之一盒式雙壓電晶片致動器;Figure 59 illustrates a cartridge bimorph actuator according to one embodiment;

圖60繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 60 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖61繪示根據一實施例之包含一SMA致動器之SMA系統的一分解視圖,該SMA致動器包含雙壓電晶片致動器;61 depicts an exploded view of an SMA system including an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖62繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面,該SMA致動器包含雙壓電晶片致動器;Figure 62 depicts a cross-section of an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖63繪示根據一實施例之盒式雙壓電晶片致動器;Figure 63 illustrates a cassette bimorph actuator according to one embodiment;

圖64繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 64 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖65繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解視圖,該SMA致動器包含雙壓電晶片致動器;Figure 65 illustrates an exploded view of an SMA system including an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖66繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 66 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖67繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 67 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖68繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 68 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖69繪示根據一實施例之包含一SMA致動器之SMA的一分解視圖,該SMA致動器包含雙壓電晶片致動器;69 depicts an exploded view of an SMA including an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖70繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面,該SMA致動器包含經組態為一3軸感測器移位OIS之雙壓電晶片致動器;70 depicts a cross-section of an SMA system including an SMA actuator including a bimorph actuator configured as a 3-axis sensor shift OIS, according to one embodiment. ;

圖71繪示根據一實施例之一盒式雙壓電晶片致動器組件;Figure 71 depicts a cassette bimorph actuator assembly according to one embodiment;

圖72繪示根據一實施例之用於一SMA系統中之一撓性感測器電路;Figure 72 illustrates a flexible sensor circuit for use in an SMA system according to one embodiment;

圖73繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 73 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖74繪示根據一實施例之包含一SMA致動器之SMA系統的一分解視圖,該SMA致動器包含雙壓電晶片致動器;74 depicts an exploded view of an SMA system including an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖75繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面;Figure 75 depicts a cross-section of an SMA system including an SMA actuator, according to one embodiment;

圖76繪示根據一實施例之盒式雙壓電晶片致動器;Figure 76 illustrates a cassette bimorph actuator according to one embodiment;

圖77繪示根據一實施例之用於一SMA系統中之一撓性感測器電路;Figure 77 illustrates a flexible sensor circuit for use in an SMA system according to one embodiment;

圖78繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 78 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖79繪示根據一實施例之包含一SMA致動器之SMA系統的一分解視圖,該SMA致動器包含雙壓電晶片致動器;79 depicts an exploded view of an SMA system including an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖80繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面;Figure 80 depicts a cross-section of an SMA system including an SMA actuator, according to one embodiment;

圖81繪示根據一實施例之盒式雙壓電晶片致動器;Figure 81 illustrates a cassette bimorph actuator according to one embodiment;

圖82繪示根據一實施例之用於一SMA系統中之一撓性感測器電路;Figure 82 illustrates a flexible sensor circuit for use in an SMA system according to one embodiment;

圖83繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;Figure 83 illustrates an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖84繪示根據一實施例之包含一SMA致動器之SMA系統的一分解視圖;Figure 84 depicts an exploded view of an SMA system including an SMA actuator according to one embodiment;

圖85繪示根據一實施例之包含一SMA致動器之SMA系統的一橫截面,該SMA致動器包含雙壓電晶片致動器;Figure 85 depicts a cross-section of an SMA system comprising an SMA actuator comprising a bimorph actuator, according to one embodiment;

圖86繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器;Figure 86 illustrates a cassette bimorph actuator for use in an SMA system according to one embodiment;

圖87繪示根據一實施例之用於一SMA系統中之一撓性感測器電路;Figure 87 illustrates a flexible sensor circuit for use in an SMA system according to one embodiment;

圖88繪示根據實施例之一SMA致動器之一雙壓電晶片致動器之實例性尺寸;88 illustrates exemplary dimensions of a bimorph actuator of an SMA actuator according to an embodiment;

圖89繪示根據一實施例之用於一折疊式相機的一透鏡系統;Figure 89 illustrates a lens system for a foldable camera according to an embodiment;

圖90繪示根據一實施例之包含液體透鏡的一透鏡系統之若干實施例;Figure 90 illustrates several embodiments of a lens system including liquid lenses according to an embodiment;

圖91繪示根據一實施例之作為一稜鏡、安置於一致動器上之一折疊透鏡;FIG. 91 illustrates a folded lens as a lens mounted on an actuator according to one embodiment;

圖92繪示根據一實施例之具有一偏移之一雙壓電晶片臂;Figure 92 illustrates a bimorph arm with an offset, according to one embodiment;

圖93繪示根據一實施例之具有一偏移及一限制器之一雙壓電晶片臂;Figure 93 illustrates a bimorph arm with an offset and a limiter, according to one embodiment;

圖94繪示根據一實施例之具有一偏移及一限制器之一雙壓電晶片臂;Figure 94 illustrates a bimorph arm with an offset and a limiter, according to one embodiment;

圖95繪示根據一實施例之包含具有一偏移之一雙壓電晶片臂的一基座之一實施例;Figure 95 illustrates an embodiment of a base including a bimorph arm with an offset, according to an embodiment;

圖96繪示根據一實施例之包含具有一偏移之兩個雙壓電晶片臂的一基座之一實施例;Figure 96 illustrates an embodiment of a base comprising two bimorph arms with an offset, according to an embodiment;

圖97繪示根據一實施例之包含負載點延伸部之一帶扣臂;Figure 97 depicts a buckle arm including a point of load extension according to one embodiment;

圖98繪示根據一實施例之包含負載點延伸部9810之一帶扣臂9801;Figure 98 depicts a buckle arm 9801 including a point of load extension 9810 according to one embodiment;

圖99繪示根據一實施例之包含負載點延伸部之一雙壓電晶片臂;Figure 99 depicts a bimorph arm including a point-of-load extension, according to one embodiment;

圖100繪示根據一實施例之包含負載點延伸部之一雙壓電晶片臂;Figure 100 illustrates a bimorph arm including a point-of-load extension, according to one embodiment;

圖101繪示根據一實施例之一SMA光學影像穩定器;Figure 101 illustrates an SMA optical image stabilizer according to an embodiment;

圖102繪示根據一實施例之一移動部分之一SMA材料附接部分40;Figure 102 illustrates a SMA material attachment portion 40 of a moving portion according to an embodiment;

圖103繪示根據一實施例之一靜態板之一SMA附接部分,其中電阻焊接SMA線經附接至該SMA附接部分;Figure 103 depicts an SMA attachment portion of a static plate with resistance welded SMA wires attached to the SMA attachment portion, according to an embodiment;

圖104繪示根據一實施例之包含一帶扣致動器之一SMA致動器45;Figure 104 depicts an SMA actuator 45 comprising a buckle actuator according to one embodiment;

圖105a至圖105b繪示根據一實施例之包含用於一SMA致動器之一島狀物之一電阻焊壓接物;Figures 105a-105b illustrate a resistance welding crimp including an island for an SMA actuator according to one embodiment;

圖106繪示根據一實施例之彎曲平面z偏移、槽寬度與一雙壓電晶片樑之峰值力之間的關係;Figure 106 depicts the relationship between bending plane z-offset, slot width and peak force of a bimorph beam according to one embodiment;

圖107繪示根據一實施例之作為環繞整個雙壓電晶片致動器之一盒之一近似物之一盒體積如何與每個雙壓電晶片組件之功相關之實例;Figure 107 shows an example of how the volume of the box, which is an approximation of a box surrounding the entire bimorph actuator, relates to the work of each bimorph element, according to one embodiment;

圖108繪示根據一實施例之使用帶扣致動器致動之一液體透鏡;Figure 108 depicts a liquid lens actuated using a buckle actuator according to one embodiment;

圖109繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 109 depicts an unsecured, point-of-load end of a bimorph arm according to one embodiment;

圖110繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 110 depicts an unsecured, point-of-load end of a bimorph arm, according to an embodiment;

圖111繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 111 depicts an unsecured, point-of-load end of a bimorph arm according to one embodiment;

圖112繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 112 depicts an unsecured, point-of-load end of a bimorph arm according to one embodiment;

圖113繪示根據一實施例之一雙壓電晶片臂之一固定端;Figure 113 depicts a fixed end of a bimorph arm according to one embodiment;

圖114繪示根據一實施例之一雙壓電晶片臂之一固定端;Figure 114 depicts a fixed end of a bimorph arm according to one embodiment;

圖115繪示根據一實施例之一雙壓電晶片臂之一固定端;Figure 115 depicts a fixed end of a bimorph arm according to one embodiment;

圖116繪示根據一實施例之一雙壓電晶片臂之一固定端;Figure 116 depicts a fixed end of a bimorph arm according to one embodiment;

圖117繪示根據一實施例之一雙壓電晶片臂之一固定端之一後視圖;Figure 117 depicts a rear view of a fixed end of a bimorph arm according to one embodiment;

圖118繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 118 depicts an unsecured, point-of-load end of a bimorph arm according to one embodiment;

圖119繪示根據一替代實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 119 depicts an unsecured, point-of-load end of a bimorph arm according to an alternate embodiment;

圖120繪示根據一替代實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 120 depicts an unsecured, point-of-load end of a bimorph arm according to an alternative embodiment;

圖121繪示根據一替代實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 121 depicts an unsecured, point-of-load end of a bimorph arm according to an alternate embodiment;

圖122繪示根據一替代實施例之一雙壓電晶片臂之一未固定、負載點端;Figure 122 depicts an unsecured, point-of-load end of a bimorph arm according to an alternate embodiment;

圖123繪示根據一實施例之一雙壓電晶片臂之一固定端;Figure 123 depicts a fixed end of a bimorph arm according to one embodiment;

圖124繪示根據一實施例之一雙壓電晶片臂之一固定端;Figure 124 depicts a fixed end of a bimorph arm according to one embodiment;

圖125繪示根據一實施例之一雙壓電晶片臂之一固定端;Figure 125 depicts a fixed end of a bimorph arm according to one embodiment;

圖126繪示根據一實施例之包含以一交錯定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器;Figure 126 illustrates a balanced bimorph actuator comprising two bimorph arms arranged in a staggered orientation, according to one embodiment;

圖127繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統;Figure 127 illustrates an optical image stabilization system including balanced bimorph actuators according to one embodiment;

圖128繪示根據一實施例之包含以一直列式定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器;Figure 128 illustrates a balanced bimorph actuator comprising two bimorph arms arranged in an in-line orientation, according to one embodiment;

圖129繪示根據一實施例之包含以一直列式定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器之一俯視圖;129 depicts a top view of a balanced bimorph actuator comprising two bimorph arms arranged in an in-line orientation, according to one embodiment;

圖130繪示根據一實施例之包含一共同基座島狀物之一平衡雙壓電晶片致動器之一俯視圖;Figure 130 illustrates a top view of a balanced bimorph actuator including a common base island, according to one embodiment;

圖131繪示根據一實施例之包含以一反向直列式定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器之一側視圖;Figure 131 depicts a side view of a balanced bimorph actuator comprising two bimorph arms arranged in a reverse in-line orientation, according to one embodiment;

圖132繪示根據一實施例之包含以一反向直列式定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器之一俯視圖;132 depicts a top view of a balanced bimorph actuator comprising two bimorph arms arranged in a reverse in-line orientation, according to one embodiment;

圖133繪示根據一實施例之包含以一反向直列式定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器之一俯視圖;133 depicts a top view of a balanced bimorph actuator comprising two bimorph arms arranged in a reverse in-line orientation, according to one embodiment;

圖134繪示根據一實施例之包含以一直列式定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器;Figure 134 illustrates a balanced bimorph actuator comprising two bimorph arms arranged in an in-line orientation, according to one embodiment;

圖135繪示根據一實施例之包含以一直列式定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器之一俯視圖;135 depicts a top view of a balanced bimorph actuator comprising two bimorph arms arranged in an in-line orientation, according to one embodiment;

圖136繪示根據一實施例之包含以一直列式定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器之一俯視圖;136 depicts a top view of a balanced bimorph actuator comprising two bimorph arms arranged in an in-line orientation, according to one embodiment;

圖137繪示根據一實施例之包含以一交錯定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器;Figure 137 illustrates a balanced bimorph actuator comprising two bimorph arms arranged in a staggered orientation, according to one embodiment;

圖138繪示根據一實施例之包含以一交錯定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器之一俯視圖;138 depicts a top view of a balanced bimorph actuator comprising two bimorph arms arranged in a staggered orientation, according to one embodiment;

圖139繪示根據一實施例之包含以一交錯定向配置之兩個雙壓電晶片臂之一平衡雙壓電晶片致動器之一俯視圖;139 depicts a top view of a balanced bimorph actuator comprising two bimorph arms arranged in a staggered orientation, according to one embodiment;

圖140繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統;Figure 140 illustrates an optical image stabilization system including balanced bimorph actuators according to one embodiment;

圖141繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統的一分解視圖;Figure 141 depicts an exploded view of an optical image stabilization system including balanced bimorph actuators according to one embodiment;

圖142繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統;Figure 142 illustrates an optical image stabilization system including balanced bimorph actuators according to one embodiment;

圖143繪示根據一實施例之包含雙壓電晶片致動器之一感測器移位光學影像穩定系統;Figure 143 illustrates a sensor-shift optical image stabilization system including bimorph actuators according to one embodiment;

圖144繪示根據一實施例之包含平衡雙壓電晶片致動器之一光學影像穩定系統;Figure 144 illustrates an optical image stabilization system including balanced bimorph actuators according to one embodiment;

圖145繪示根據一實施例之一光學影像穩定系統之一外殼體;Fig. 145 illustrates an outer casing of an optical image stabilization system according to an embodiment;

圖146繪示根據一實施例之包含一外殼體之一光學影像穩定系統的一橫截面;Figure 146 depicts a cross-section of an optical image stabilization system including an outer housing according to one embodiment;

圖147繪示根據一實施例之包含板簧電路之一光學影像穩定系統的一分解視圖;Figure 147 illustrates an exploded view of an optical image stabilization system including leaf spring circuits according to one embodiment;

圖148繪示根據一實施例之包含板簧電路之一光學影像穩定系統之一橫截面;Figure 148 depicts a cross-section of an optical image stabilization system including leaf spring circuits according to one embodiment;

圖149繪示根據一實施例之包含彈簧之一基座;Figure 149 depicts a base including springs according to one embodiment;

圖150繪示根據一實施例之一板簧電路;及Figure 150 illustrates a leaf spring circuit according to one embodiment; and

圖151繪示根據一實施例之包含一壓接物之一雙壓電晶片致動器。Figure 151 illustrates a bimorph actuator including a crimp according to one embodiment.

100:形狀記憶合金(SMA)線 100: Shape memory alloy (SMA) wire

101:基座 101: base

102:帶扣致動器 102: buckle actuator

104:中心部分 104: central part

106:壓接物結構 106: Crimp structure

108:z衝程方向 108:z stroke direction

Claims (21)

一種致動器,其包括: 複數個雙壓電晶片臂,其等經組態以減小該複數個雙壓電晶片臂之一淨摩擦力。 An actuator comprising: A plurality of bimorph arms configured to reduce net friction in one of the plurality of bimorph arms. 如請求項1之致動器,其中該複數個雙壓電晶片臂之各者包含一形狀記憶合金(SMA)線,且 附接至該複數個雙壓電晶片臂之該等SMA線串聯連接且經組態以接收至各SMA線之電流以控制該致動器之致動。 The actuator of claim 1, wherein each of the plurality of bimorph arms comprises a shape memory alloy (SMA) wire, and The SMA wires attached to the plurality of bimorph arms are connected in series and configured to receive current to each SMA wire to control actuation of the actuator. 如請求項1之致動器,其中該複數個雙壓電晶片臂係以一直列式、鏡像定向配置。The actuator of claim 1, wherein the plurality of bimorph arms are arranged in an in-line, mirror image orientation. 如請求項3之致動器,其中該直列式、鏡像定向包含該複數個雙壓電晶片臂之一第一雙壓電晶片臂及該複數個雙壓電晶片臂之一第二雙壓電晶片臂,該第二雙壓電晶片臂與該第一雙壓電晶片臂直列式配置使得該第二雙壓電晶片臂之一固定端相鄰於該第一雙壓電晶片臂之一固定端。The actuator of claim 3, wherein the in-line, mirror image orientation comprises a first bimorph arm of the plurality of bimorph arms and a second bimorph arm of the plurality of bimorph arms. a wafer arm, the second bimorph arm configured in-line with the first bimorph arm such that a fixed end of the second bimorph arm is fixed adjacent to one of the first bimorph arms end. 如請求項4之致動器,其中該第一雙壓電晶片臂經組態以在平行於該致動器之一縱軸之該第一雙壓電晶片臂之一固定端之一方向上具有一摩擦力分量,且 該第二雙壓電晶片臂經組態以在與該第一雙壓電晶片臂相反之一方向上具有一摩擦力分量以將淨總摩擦減小至零。 The actuator of claim 4, wherein the first bimorph arm is configured to have a direction parallel to a fixed end of the first bimorph arm along a longitudinal axis of the actuator. a friction component, and The second bimorph arm is configured to have a friction component in a direction opposite to the first bimorph arm to reduce the net total friction to zero. 如請求項4之致動器,其包括具有一第一端及一第二端之一單個形狀記憶合金線,該形狀記憶合金之該第一端與該複數個雙壓電晶片臂之該第一雙壓電晶片臂耦接且該形狀記憶合金之該第二端與該複數個雙壓電晶片臂之該第二雙壓電晶片臂耦接。The actuator of claim 4, which includes a single shape memory alloy wire having a first end and a second end, the first end of the shape memory alloy and the first end of the plurality of bimorph arms A bimorph arm is coupled and the second end of the shape memory alloy is coupled to the second bimorph arm of the plurality of bimorph arms. 如請求項1之致動器,其中該複數個雙壓電晶片臂係以一反向直列式定向配置。The actuator of claim 1, wherein the plurality of bimorph arms are arranged in a reverse in-line orientation. 如請求項7之致動器,其中該反向直列式定向包含該複數個雙壓電晶片臂之一第一雙壓電晶片臂及該複數個雙壓電晶片臂之一第二雙壓電晶片臂,其中該第二雙壓電晶片臂與該第一雙壓電晶片臂直列式配置使得該第一雙壓電晶片臂之一固定端經定位於該致動器之一端處,該端與相鄰於該第二雙壓電晶片臂之一固定端之該致動器之一端相對。The actuator of claim 7, wherein the reverse in-line orientation comprises a first bimorph arm of the plurality of bimorph arms and a second bimorph arm of the plurality of bimorph arms a wafer arm, wherein the second bimorph arm is arranged in-line with the first bimorph arm such that a fixed end of the first bimorph arm is positioned at an end of the actuator, the end Opposite an end of the actuator adjacent to a fixed end of the second bimorph arm. 如請求項8之致動器,其中該第一雙壓電晶片臂經組態以在平行於該致動器之一縱軸之該第一雙壓電晶片臂之該固定端之一方向上具有一摩擦力分量,且 該第二雙壓電晶片臂經組態以在與該第一雙壓電晶片臂相反之一方向上具有一摩擦力分量以將該淨總摩擦減小至零。 The actuator of claim 8, wherein the first bimorph arm is configured to have a direction parallel to a longitudinal axis of the actuator at the fixed end of the first bimorph arm a friction component, and The second bimorph arm is configured to have a friction component in an opposite direction to the first bimorph arm to reduce the net total friction to zero. 如請求項1之致動器,其中該複數個雙壓電晶片臂係以一交錯定向配置。The actuator of claim 1, wherein the plurality of bimorph arms are arranged in a staggered orientation. 如請求項10之致動器,其中該交錯定向包含該複數個雙壓電晶片臂之一第一雙壓電晶片臂及該複數個雙壓電晶片臂之一第二雙壓電晶片臂,其中該第二雙壓電晶片臂與該第一雙壓電晶片臂交錯使得該第二雙壓電晶片臂之一縱軸平行於該第一雙壓電晶片臂之一縱軸,且該第一雙壓電晶片臂之一固定端係在該致動器之一端處,該端與相鄰於該第二雙壓電晶片臂之一固定端之該致動器之一端相對。The actuator of claim 10, wherein the interleaved orientation comprises a first bimorph arm of the plurality of bimorph arms and a second bimorph arm of the plurality of bimorph arms, wherein the second bimorph arms are interleaved with the first bimorph arms such that a longitudinal axis of the second bimorph arms is parallel to a longitudinal axis of the first bimorph arms, and the first bimorph arms A fixed end of a bimorph arm is tied at an end of the actuator opposite an end of the actuator adjacent to a fixed end of the second bimorph arm. 如請求項11之致動器,其中該第一雙壓電晶片臂經組態以在平行於該第一雙壓電晶片臂之該縱軸之該第一雙壓電晶片臂之該固定端之一方向上具有一摩擦力分量,且 該第二雙壓電晶片臂經組態以在與該第一雙壓電晶片臂相反之一方向上具有一摩擦力分量以將該淨總摩擦減小至零。 The actuator of claim 11, wherein the first bimorph arm is configured to be at the fixed end of the first bimorph arm parallel to the longitudinal axis of the first bimorph arm has a friction component in one direction, and The second bimorph arm is configured to have a friction component in an opposite direction to the first bimorph arm to reduce the net total friction to zero. 一種致動器模組總成,其包括: 一外殼體,其組態有圍繞該外殼體之一周邊之凹穴,該等凹穴經組態以自外部接納一或多個雙壓電晶片致動器。 An actuator module assembly comprising: An outer housing configured with pockets around a perimeter of the outer housing, the pockets configured to externally receive one or more bimorph actuators. 如請求項13之致動器模組總成,其中該外殼體由塑膠製成。The actuator module assembly according to claim 13, wherein the outer casing is made of plastic. 如請求項13之致動器模組總成,其中該外殼體由金屬製成。The actuator module assembly according to claim 13, wherein the outer casing is made of metal. 如請求項13之致動器模組總成,其包含一或多個雙壓電晶片致動器,該一或多個雙壓電晶片致動器包含以一直列式、鏡像定向配置之兩個雙壓電晶片臂。The actuator module assembly of claim 13, which includes one or more bimorph actuators, the one or more bimorph actuators comprising two bimorph arm. 如請求項13之致動器模組總成,其中該一或多個雙壓電晶片致動器包含以一交錯定向配置之兩個雙壓電晶片臂。The actuator module assembly of claim 13, wherein the one or more bimorph actuators comprise two bimorph arms arranged in a staggered orientation. 一種致動器,其包括: 複數個板簧電路,其等經組態以產生多個隔離電路徑,該複數個板簧電路之各者包含經組態以具有控制一物件之一移動之一剛性之一彈簧。 An actuator comprising: A plurality of leaf spring circuits configured to create isolated electrical paths, each of the plurality of leaf spring circuits including a spring configured to have a stiffness that controls movement of an object. 如請求項18之致動器,其中該等彈簧之各者包含至少一個扁平彎曲部,該至少一個扁平彎曲部經組態以減小彈簧之一間隙空間且控制該彈簧之一移動方向。The actuator of claim 18, wherein each of the springs includes at least one flat bend configured to reduce a clearance space of the spring and to control a direction of movement of the spring. 如請求項18之致動器,其包括一外殼體,該外殼體組態有圍繞該外殼體之一周邊之一或多個凹穴,各一或多個凹穴經組態以自該外殼體之該外部接納一或多個雙壓電晶片致動器,該複數個板簧電路經安置於該外殼體內。As the actuator of claim 18, it includes an outer shell configured with one or more pockets around a periphery of the outer shell, each one or more pockets configured to receive from the shell The exterior of the body receives one or more bimorph actuators, and the plurality of leaf spring circuits are disposed within the housing. 如請求項20之致動器,其中該一或多個雙壓電晶片致動器包含以一直列式、鏡像定向或以一交錯定向配置之兩個雙壓電晶片臂。The actuator of claim 20, wherein the one or more bimorph actuators comprise two bimorph arms arranged in an in-line, mirror image orientation, or in a staggered orientation.
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