TW202240171A - Test socket for semiconductor integrated circuits - Google Patents

Abstract

A test socket for an IC includes a socket body, a rotational contact, and an elastomer retainer. The socket body includes a top surface that faces the IC, and a bottom surface that faces a load board. The socket body defines a slot extending from the top surface to an aperture in the bottom surface. The rotational contact is positioned in the slot. The elastomer retainer captures the rotational contact in the socket body and includes a round section about which the rotational contact rotates. The elastomer retainer compresses under translatory force from the rotational contact when translating from the free state to the pre-load state upon engagement with the load board, and compresses under rotational force from the rotational contact when rotating from the pre-load state to the loaded state upon engagement with the IC.

Description

Semiconductor integrated circuit test socket

The technical field of the present invention relates generally to a test socket for a semiconductor integrated circuit, and more specifically, the technical field of the present invention relates to a test socket having the ability to translate or "rub" on the contact pads of the integrated circuit under test. Test socket for rotary contact.

Semiconductor integrated circuits (ICs) are produced in a variety of packages or chip configurations including, for example, quad flat no-leads (QFN) packages that are common in many IC applications and are mass-produced. Producing ICs in any quantity generally includes testing the ICs in a manner that simulates an end-user application of the ICs. One way to test the ICs is to connect each IC to a printed circuit board (PCB) that trains the contacts of the IC and various functions. A PCB is sometimes referred to as a load board and can be reused for testing many ICs. One of the basic components of the load board that enables this testing is a test socket for the IC that can be reused many times to test a large number of ICs. The test socket electrically and mechanically connects the IC to the load board. The degree of reusability of a test socket is quantified by the number of "cycles" it can withstand without degrading performance (eg, signal performance). Each time an IC is inserted or secured into a test socket is referred to as one cycle. Generally, after many cycles, the electrical and mechanical properties of the contacts and structure of the test socket begin to degrade due to, for example, oxidation, abrasion, compression, tension, or other forms of wear. This degradation ultimately affects the integrity of the test itself when the test socket reaches the end of its useful life. Therefore, it is desirable for the test socket to maintain good electrical and mechanical performance over a long life cycle.

In one aspect, a test socket for a flat leadless semiconductor IC includes a socket body, a rotary contact, and an elastomeric retainer. The socket body includes a top surface configured to face the flat leadless semiconductor IC and a bottom surface configured to face a load board opposite the top surface. The socket body defines a slot extending from the top surface to an aperture in the bottom surface. The rotary joint is positioned in the slot. The rotary joint is configured to translate between a free state and a preloaded state and to rotate about a circular segment of the elastomeric retainer between the preloaded state and a loaded state. The elastomer retainer captures the swivel joint in the socket body. The elastomeric retainer is configured to compress under the translational force from the rotary joint when translating from the free state to the preloaded state after engagement with the load board and after engagement with the flat leadless semiconductor IC Compression under the rotational force from the rotary joint when rotating from the preloaded state to the loaded state.

In another aspect, a test system includes a load board and a test socket. The test socket includes a top surface configured to face a semiconductor IC and a bottom surface mounted to the load board. The socket body defines a slot extending from the top surface to an aperture in the bottom surface. The rotary joint is positioned in the slot in a preloaded state. The rotary joint is configured to rotate about a circular segment of the elastomeric retainer between the preloaded state and a loaded state. The elastomer retainer captures the swivel joint in the socket body. The elastomeric retainer is compressed between a socket frame and the rotary joint and is configured to withstand rotational force from the rotary joint when rotating from the preloaded state to the loaded state after engagement with the semiconductor IC. Compress further.

In yet another aspect, a method of assembling a test system for a semiconductor IC is provided. The method includes positioning a plurality of rotary contacts in corresponding slots of a socket body of a test socket. The method includes positioning an elastomeric retainer over the rotary joints. The method includes installing a socket frame over the plurality of rotary joints and the elastomer retainer.

Embodiments of the test socket described herein provide a rotary joint that, when engaged with a load board and an IC under test, creates friction on a contact pad of the IC. The described test socket is configured to accept a flat no-lead IC package, such as a QFN IC, where friction on the contact pads of the IC can be expected to reduce the contact resistance of the electrical connection between the IC and the rotary contacts of the test socket . In contrast, the test sockets described herein generally minimize translation or friction by rotating the joints on the PCB contacts of the load board.

FIG. 1 is a cross-sectional view of an exemplary IC test system 100 for testing a semiconductor IC 102 . IC 102 is one or more electronic circuits packaged into a single semiconductor die, which typically includes a plurality of contact pads 104 for conducting signals to and from the circuits within the package. The IC testing system 100 includes a load board 106 on which a test socket 108 is mounted. Load board 106 includes PCB contacts 110 (integrated with load board 106 ) that connect IC 102 to a load circuit or test circuit (not shown). The test socket 108 is used to connect the units of the IC 102 to a reusable interface of the load board 106 . FIG. 2 is a perspective view of test socket 108 for a QFN IC, such as IC 102 . The test socket 108 includes a socket body 112 that defines a socket 114 that receives the IC 102 . In a particular embodiment of test socket 108 , socket body 112 includes guide walls 116 which may be straight or tapered to guide IC 102 into socket 114 to ensure proper alignment of contact pads 104 with PCB contacts 110 . More specifically, the guide walls 116 align the contact pads 104 with corresponding contacts (not shown) of the test socket 108 . The contacts of the test socket 108 extend through the socket body 112 to electrically connect each contact pad 104 of the IC 102 to a corresponding PCB contact 110 on the load board 106 .

3 is an illustration of one embodiment of a rotary joint 300 in the test socket 108 (shown in FIG. 1 ) in a free state (i.e., before the test socket 108 is mounted to the load board 106 and before the IC 102 is secured). A cross-sectional view. 4 is a cross-sectional view of rotary joint 300 in a preloaded state (ie, test socket 108 mounted to load board 106, but IC 102 not yet secured). 5 is a cross-sectional view of rotary joint 300 in a loaded state (ie, test socket 108 mounted to load board 106 and IC 102 secured in socket 114 ). FIG. 6 is a perspective view of the rotary joint 300 detached from the test socket 108 . Rotary joint 300 is constructed of a conductive material such as, for example, copper, copper alloys, aluminum, aluminum alloys, steel or other conductive metals, or some combination thereof.

The rotary joint 300 is positioned in a slot 302 in the socket body 112 . The rotary contact 300 extends from the socket 114 to a hole 304 in the socket body 112 , wherein the rotary contact protrudes and engages the PCB contact 110 . The rotary joint 300 includes a surface 306 and an arm 308 resting on a surface 310 of the socket body 112 and a supporting edge 312 respectively when the rotary joint 300 is in a free state. The rotary joint 300 is captured in the socket 302 by an elastomeric retainer 314 which holds or biases the rotary joint 300 against the surface 310 and the support edge 312 . Elastomeric retainer 314 provides force to maintain a good connection between rotary joint 300 and contact pad 104 of IC 102 and between rotary joint 300 and PCB contact 110 of load board 106 .

Rotary joint 300 terminates at a first end with a tip 316 that engages and translates or rubs on contact pad 104 of IC 102 and includes a rounded edge 318 connecting tip 316 to a lower surface of arm 308 . The swivel joint 300 terminates at a second end opposite the tip 316 having a stud 320 and a flat portion 322 .

Tip 316 of rotary contact 300 should be pointed or “sharp” to be able to rub effectively on contact pad 104 of IC 102 . For example, in one embodiment, tip 316 is rounded to a radius of about 0.05 millimeter (mm). More generally, the tip 316 should be rounded to a radius not exceeding 0.10 mm.

The rounded edge 318 connecting the tip 316 to the lower surface of the arm 308 of the swivel joint 300 is rounded to a sufficient radius to enable smooth movement during assembly of the test socket 108 in a free state and to enable smooth rotational movement within the socket 302 . For example, in one embodiment, rounded edge 318 has a radius of about 0.15 mm.

The arm 308 of the swivel joint is substantially straight and, in a particular embodiment, narrower at the tip 316 than at the opposite end of the swivel joint 300 . For example, arm 308 may have a narrow width W near tip 316 that tapers to a wider width W near the contact with PCB contact 110 . The taper of the arm 308 achieves increased mechanical strength of the rotary joint 300 due to the increased width W. The taper of the arms 308 also enables efficient current conduction by avoiding surface discontinuities of the rotary joint 300 . The width W of the arm 308 also partially defines (by the shape of the surface 306 ) where the swivel joint 300 rests on the socket body 112 at the surface 310 and the support edge 312 .

Surface 306 of rotary joint 300 rests on surface 310 of socket body 112 when test socket 108 is in a free state and rises away from surface 310 when in a preloaded or loaded state. The stud 320 engages the elastomeric retainer 314 when the rotary joint moves into the preloaded state. The studs 320 are rounded to provide smooth deformation of the elastomeric retainer 314 and reduce wear on the elastomeric retainer 314 when deformed. In one embodiment, for example, round peg 320 has a radius of about 0.18 mm. More generally, the studs 320 should have a radius of at least 0.10 mm to achieve smooth deformation and minimize wear on the elastomeric retainer 314 .

When the test socket 108 is mounted on the load plate 106 (ie, the preloaded state shown in FIG. 4 ), the PCB contacts 110 engage the rotary joint 300 and the load plate 106 engages the socket body 112 . After engaging the swivel joint 300 , the PCB contact 110 forces the swivel joint 300 upward to compress the elastomeric retainer 314 against one of the socket frames 324 of the test socket 108 . More specifically, the rotary joint 300 translates toward the socket frame 324 to compress and deform the elastomeric retainer 314 against a first head 326 and a second head 328 of the socket frame 324 . Flat portion 322 of swivel joint 300 enables smooth translation of swivel joint 300 along a wall of socket body 112 partially defining slot 302 . After engaging the load plate 106 and compressing the elastomeric retainer 314 , the elastomeric retainer 314 applies a preload force to the rotary joint 300 . The preload force applied to rotary joint 300 ensures good electrical contact between rotary joint 300 and PCB contact 110 and must be at least partially overcome by inserting IC 102 into socket 114 . The amount of preload provided by the elastomeric retainer 314 can be customized for a given application by selecting appropriate properties of the elastomeric retainer 314 .

When IC 102 is inserted or secured into socket 114 of test socket 108 , contact pad 104 engages tip 316 of rotary contact 300 to force tip 316 down into socket 302 in socket body 112 . Downward movement of tip 316 into slot 302 causes rotational movement of swivel joint 300 about elastomeric retainer 314 . The supporting edge 312 of the socket body 112 also acts as a fulcrum or pivot point to convert the downward force of the IC 102 into a compressive force or a contact force applied by the peg 320 of the rotary joint 300 to the elastomeric retainer 314 , the elastomer retainer 314 is further deformed against the first head 326 and the second head 328 of the socket frame 324 . Likewise, the PCB contact 110 also serves as a pivot point to convert the downward force of the IC 102 into a rotational force to compress the elastomeric retainer 314 . Because the motion of the rotary joint 300 is rotational, the peg 320 rotates away from the wall of the socket body 112 and likewise the tip 316 of the rotary joint 300 translates or rubs along the contact pad 104 . The friction created by the rotational motion of the rotary contact 300 and, more specifically, the tip 316 reduces the resistance of the connection between the contact pads 104 and the rotary contact 300 and ultimately reduces the distance between the contact pads 104 of the IC 102 and the load board 106. The contact resistance of the electrical connection between the PCB contacts 110 . Rotation about the elastomeric retainer 314 and across the PCB joint 110 can reduce friction on the PCB pad 110 of the load board 106 .

When the IC 102 is removed from the receptacle 114 of the test socket 108, the elastomeric retainer 314, which was previously deformed under the rotational force, returns to the preloaded state and reverses the rotational force on the rotary joint 300, and by a restoring force Return the rotary joint 300 to the preload state.

FIG. 7 is a perspective view of the rotary joint 300 (as shown in FIGS. 3-6 ) positioned in the test socket 108 in a free state. FIG. 7 shows the contact pads 104 separated from the IC 102 and shows the PCB contacts 110 separated from the load board 106 . The rotary joint 300 is positioned in a slot 302 defined in the socket body 112 . FIG. 7 shows only the portion of the socket body 112 close to the rotary contact 300 shown. Embodiments of the test socket 108 may include any number of rotary joints 300 packaged in respective sockets 302 along one or more dimensions. For example, one embodiment of the test socket 108 shown in FIG. 2 is configured for a QFN IC with a plurality of rotary contacts 300 disposed on all four sides of the socket body 112 . In this embodiment, for example, socket 302 is defined independently in socket body 112 to constrain the motion of rotary joint 300 to rotational motion in the plane shown in FIGS. 3-5 . Rather, in certain embodiments, the elastomeric retainer 314 and the receptacle frame 324 span the plurality of rotary joints 300 positioned in their respective sockets 302 .

Elastomeric retainer 314 provides force to maintain a good or “tight” connection between rotary joint 300 and contact pad 104 of IC 102 and between rotary joint 300 and PCB contact 110 of load board 106 . The elastomeric retainer 314 includes a circular segment 702 that engages the swivel joint 300 to create a preload force. Elastomeric retainer 314 includes a quadrangular section 704 that deforms under a contact force from IC 102 when rotary joint 300 transitions to the loaded state and that is deformed by a contact force when IC 102 is removed from socket 114 of test socket 108. The restoring force pushes the rotary joint 300 back to the preload state. The first head 326 of the receptacle frame 324 is positioned to align with an apex or tip of the nail 320 . Likewise, the second head 328 of the socket frame 324 is positioned to align with a centerline of the circular section 702 of the elastomeric retainer 314 .

FIG. 8 is a flowchart of a method 800 of assembling the test socket 108 shown in FIGS. 3-5 and 7 . The rotary contact 300 is positioned 802 in a corresponding slot 302 of a socket body 112 . Each rotary joint 300 is positioned on a surface 310 and a supporting edge 312 . Next, the elastomeric retainer 314 is positioned 804 over the swivel joint 300 to capture the swivel joint 300 between the elastomeric retainer 314 and the socket body 112 . Mounting 806 the socket frame 324 over the rotary joint 300 and the elastomeric retainer 314 holds both the elastomeric retainer 314 and the rotary joint 300 in place. When the swivel joint 300 is in a free state (ie, prior to mounting the test socket 108 on a load board), the elastomeric retainer 314 is not compressed. Next, the test socket 108 is mounted 808 on the load board 106 to transition the rotary joint 300 from the free state to the preload state. The rotary joint 300 translates towards the socket frame 324 into a preloaded state to compress the elastomeric retainer 314 against the socket frame 324 . More specifically, the elastomeric retainer 314 compresses and deforms against the first head 326 and the second head 328 of the receptacle frame 324 .

Securing 810 the semiconductor IC 102 into the test socket 108 causes the rotary joint 300 to transition from the preloaded state to the loaded state. Rotation of the rotary joints 300 about the elastomeric retainer 314 rotates the peg 320 of each rotary joint 300 into the elastomeric retainer 314 to compress the elastomeric retainer 314 against the socket frame 324 . The tip 316 of each rotary joint 300 translates across a corresponding one of the contact pads 104 of the semiconductor IC 102 .

When the semiconductor IC 102 is removed from the test socket 108, the rotary joint 300 rotates back to the preload state. When transitioning back from the loaded state to the preloaded state, the elastomeric retainer 314 releases the spike 320 and rotates the spike 320 back toward the surface 310 of the socket body 112 thereby rotating the tip 316 back toward the socket frame 324 .

Technical effects of the systems and apparatus described herein may include: (a) providing customizable preload forces via an elastomeric retainer; (b) being able to rub across semiconductor IC contact pads when securing the IC into a test socket ; (c) reduce the contact resistance between the test socket and the IC by introducing friction when securing the IC in the test socket; and (d) reduce the friction of the PCB contact across the load board by rotating the contact .

In the above specification and the claims below, reference is made to certain terms with the following meanings.

As used herein, an element or step recited in the singular and preceded by the word "a" should be understood as not excluding plural elements or steps, unless such exclusion is explicitly recited. Furthermore, references to "an exemplary embodiment" or "an embodiment" of the present invention are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.

"Optional" or "as the case may be" means that an event or circumstance to be described subsequently may or may not occur, and that the description includes instances where the event occurs and instances where the event does not occur.

As used herein throughout the specification and claims, approximating terms may be used to modify any quantitative representation that permissible changes can be made without resulting in a change in the basic function to which it is associated. Accordingly, a value modified by a term or terms such as "about", "approximately" and "substantially" is not to be limited to the precise value specified. In at least some instances, approximate terms may correspond to the precision of an instrument used to measure a value. Here and throughout the specification and claims, range limitations may be combined or interchanged. These ranges are identified and include all subranges subsumed therein unless context or terminology indicates otherwise.

Disjunctions such as the phrase "at least one of X, Y, or Z" are generally understood in the context to indicate that an item, term, etc. may be X, Y, or Z, or one of X, Y, or Z, unless expressly stated otherwise. Any combination (eg X, Y and/or Z). Thus, this disjunctive term is generally not intended and should not imply that a particular embodiment requires at least one of X, at least one of Y, or at least one of Z each to be present. In addition, conjunctions such as the phrase "at least one of X, Y, and Z" should also be understood to mean X, Y, Z, or any combination thereof (including X, Y, and/or or Z).

The systems and methods described herein are not limited to the particular embodiments described herein, but rather, components of the systems and/or steps of the methods may be utilized independently and separately from other components and/or steps described herein .

Although specific features of various embodiments of the invention may be shown in some drawings and not in others, this is for convenience only. In accordance with the principles of the invention, any feature of a drawing may be referred to and/or claimed in combination with any feature of any other drawing.

This disclosure uses examples to provide details of the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patent scope of the present invention is defined by the scope of patent application, and may include other examples that occur to those skilled in the art. If these other examples have structural elements that do not differ from the literal terms of the claimed claim, or if these other examples include equivalent structural elements that do not differ substantially from the literal terms of the claimed claim, they are intended to be included in the claimed claim. within the category.

100: Integrated circuit (IC) test system 102: Semiconductor IC 104: contact pad 106: Load board 108: Test socket 110: Printed circuit board (PCB) contacts/PCB pads 112: socket body 114: socket 116: guide wall 300: rotary joint 302: slot 304: porosity 306: surface 308: arm 310: surface 312: support edge 314: Elastomer retainer 316: tip 318: round edge 320: round nail 322: flat part 324: socket frame 326: first head 328: second head 702: circular segment 704: quadrilateral segment 800: method 802: Locate a plurality of rotary contacts in corresponding slots of a socket body of a test socket 804: Positioning an elastomeric retainer over the rotary joint 806: Install a socket frame above a plurality of rotary joints and elastomer holders 808: Mounting the socket body on a load plate and translating the rotary joints toward the socket frame to compress the elastomeric retainer against the socket frame 810: Securing the semiconductor IC into the test socket and rotating the plurality of rotary joints around corresponding support edges, whereby one nail of each rotary joint is rotated into the elastomeric holder to compress the elastomeric holder against the socket frame W: width

FIG. 1 is a cross-sectional view of one of an exemplary IC testing system;

Figure 2 is a perspective view of an exemplary test socket for a QFN IC;

3 is a cross-sectional view of an embodiment of a rotary joint in the test socket shown in FIG. 1 in a free state;

Figure 4 is a cross-sectional view of the rotary joint shown in Figure 3 in a preloaded state;

Figure 5 is a cross-sectional view of the rotary joint shown in Figures 3 and 4 in a loaded state;

Figure 6 is a perspective view of the rotary joint shown in Figures 3 to 5;

Figure 7 is a perspective view of the rotary joint shown in Figures 3 to 5 in a free state; and

8 is a flowchart of a method of assembling a test system for a semiconductor IC.

104: contact pad

108: Test socket

110: Printed circuit board (PCB) contacts/PCB pads

112: socket body

114: socket

300: rotary joint

302: slot

304: porosity

310: surface

312: support edge

314: Elastomer retainer

316: tip

324: socket frame

326: first head

328: second head

702: circular segment

704: quadrilateral segment

Claims (20)

A test socket for a flat leadless semiconductor integrated circuit (IC), comprising: A socket body comprising a top surface configured to face the flat leadless semiconductor IC and a bottom surface configured to face a load board opposite the top surface, the socket body defined to extend from the top surface to a slot in an aperture in the bottom surface; a rotary joint positioned in the socket, the rotary joint configured to translate between a free state and a preloaded state and to rotate between the preloaded state and a loaded state; and an elastomeric retainer that captures the rotary joint in the socket body, the elastomeric retainer comprising a circular segment about which the rotary joint rotates, the elastomeric retainer configured to be in contact with the The load plate is compressed under the translational force from the rotary joint after bonding while translating from the free state to the preload state and rotates from the preload state to the loaded state after bonding with the flat leadless semiconductor IC Compressed under the rotational force from the rotary joint. The test socket of claim 1, wherein the rotary contact includes a tip proximate to the top surface of the socket body, the tip being configured to engage the rotary contact when the rotary contact is rotated from the preloaded state to the loaded state One of the contact pads of a flat leadless semiconductor IC. The test socket of claim 2, wherein the tip of the rotary contact is configured to translate across the contact pad of the flat leadless semiconductor IC as the rotary contact rotates from the preloaded state to the loaded state. The test socket of claim 2, wherein the rotary joint further includes a spike at an end opposite the tip, the spike configured to travel when the rotary joint is rotated from the preloaded state to the loaded state away from one wall of the socket body. As the test socket of claim 2, wherein the rotary contact further includes: a raised portion proximate the bottom surface of the socket body and configured to engage a printed circuit board (PCB) pad of the load board when in the preloaded state and the loaded state; and An arm extending between the tip and the boss is configured to pivot within the slot on a support edge of the socket body. The test socket of claim 1, further comprising a socket frame defining a socket into which the flat leadless semiconductor IC is configured to be fixed. The test socket of claim 6, wherein the socket frame is disposed over the elastomeric retainer, and wherein the elastomeric retainer is configured to compress against the socket frame under translational force from the rotary joint and to The rotary force from the rotary contact compresses against the socket frame. A test system for a semiconductor integrated circuit (IC), the test system comprising: a load plate; and A test socket comprising: a socket body comprising a top surface configured to face the semiconductor IC and a bottom surface mounted to the load board, the socket body defining a socket extending from the top surface to an aperture in the bottom surface; a rotary joint positioned in the slot in a preloaded state, the rotary joint configured to rotate between the preloaded state and a loaded state; and an elastomeric retainer that captures the swivel joint in the socket body, the elastomeric retainer comprising a circular segment that the swivel joint is configured to rotate about and incorporating a contact force and a return Force is provided to a quadrilateral section of the rotary joint, the elastomeric retainer is compressed between a socket frame and the rotary joint and is configured to rotate from the preloaded state to the rotary joint after engagement with the semiconductor IC. The load state is further compressed under the rotational force from the rotary joint. The test system of claim 8, wherein the rotary joint includes a tip proximate the top surface of the socket body, the tip being configured to engage the rotary joint when the rotary joint is rotated from the preloaded state to the loaded state One of the contact pads of a semiconductor IC. The test system of claim 9, wherein the tip of the rotary joint is configured to translate across the contact pad of the semiconductor IC as the rotary joint rotates from the preloaded state to the loaded state. The testing system of claim 9, wherein the rotary joint further includes a spike at an end opposite the tip, the spike configured to travel when the rotary joint is rotated from the preloaded state to the loaded state away from one wall of the socket body. The test system as claimed in item 9, wherein the rotary joint further comprises: a raised portion proximate the bottom surface of the socket body and configured to engage a printed circuit board (PCB) pad of the load board when in the preloaded state and the loaded state; and An arm extends between the tip and the boss, the arm being configured to pivot within the slot on the supporting edge of the socket body. The test system according to claim 8, wherein the socket frame defines a socket, and the semiconductor IC is configured to be fixed into the socket. The test system according to claim 13, wherein the socket frame includes a tapered guide wall configured to align a contact pad of the semiconductor IC with the rotary contact. A method of assembling a test system for a semiconductor integrated circuit (IC), the method comprising: positioning a plurality of rotary contacts in corresponding slots of a socket body of a test socket; positioning an elastomeric retainer over the rotary joints; and A socket frame is installed above the plurality of rotary joints and the elastic body holder. The method according to claim 15, wherein positioning the plurality of rotary joints comprises: for each rotary joint of the plurality of rotary joints, positioning the rotary joint on a supporting edge of the socket body. The method as claimed in item 15, further comprising: mounting the socket body on a load plate; and Translating the plurality of rotary joints toward the socket frame into a preloaded state compresses the elastomeric retainer against the socket frame. The method of claim 17, further comprising: securing the semiconductor IC into the test socket; and rotating the plurality of revolving joints about the elastomeric retainer into a loaded state, whereby a pin of each revolving joint is rotated into the elastomeric retainer to compress the elastomeric retainer against the socket frame . The method of claim 18, wherein rotating the plurality of rotary joints comprises translating a tip of each rotary joint across a corresponding contact pad of the semiconductor IC. The method of claim 18, further comprising removing the semiconductor IC from the test socket and rotating the plurality of rotary contacts back to the preload state.

Images