TW202239611A - Laminate - Google Patents

Laminate Download PDF

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Publication number
TW202239611A
TW202239611A TW111103322A TW111103322A TW202239611A TW 202239611 A TW202239611 A TW 202239611A TW 111103322 A TW111103322 A TW 111103322A TW 111103322 A TW111103322 A TW 111103322A TW 202239611 A TW202239611 A TW 202239611A
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Taiwan
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layer
group
different
water
organosilicon compound
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TW111103322A
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Chinese (zh)
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松浦拓哉
伊藤友宏
宮本知典
島崎泰治
上原満 大門
櫻井彩香
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日商住友化學股份有限公司
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Publication of TW202239611A publication Critical patent/TW202239611A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/18Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)

Abstract

A laminate according to (the first embodiment of) the present invention includes: a substrate that contains an antimicrobial component (K); and a water-repellent layer (r), said laminate being characterized in that the laminate further contains an organosilicon compound (C) that has a silicon atom to which a hydrolyzable group or a hydroxyl group has been bonded, the water-repellent layer (r) is a hardened layer of an organosilicon compound (A) that has a silicon atom to which a hydrolyzable group or a hydroxyl group has been bonded either via a linking group or without the mediation of a linking group, and the thickness of a laminated section including the water-repellent layer (r) provided on the substrate (s)is 1-50 nm, inclusive. This laminate exhibits both good water repellency and antimicrobial properties. A laminate according to (the second embodiment of) the present invention has an electrically conductive substrate (s), a layer (c) that contains elemental nitrogen, and a layer (r) that contains elemental fluorine, wherein the layer (c) is provided between the substrate (s) and the layer (r). This laminate is capable of suppressing increases in the surface resistivity of the surface of the layer that contains elemental fluorine even after use in a high-temperature environment, and providing a laminate that exhibits superior abrasion resistance.

Description

積層體laminate

本發明係關於一種積層體之發明,包括第一態樣及第二態樣。The present invention relates to an invention of a laminated body, including a first aspect and a second aspect.

(與第一態樣相關之先前技術) 於觸控面板顯示器等顯示裝置、光學元件、半導體元件、建築材料、汽車或建築物之窗玻璃等各種領域中,要求對基材之表面賦予撥水性。因此,各種撥水性之皮膜可用作撥水塗層、或撥水撥油塗層等。 (Prior technology related to the first aspect) In various fields such as display devices such as touch panel displays, optical elements, semiconductor elements, building materials, and window glass for automobiles and buildings, it is required to impart water repellency to the surface of the base material. Therefore, various water-repellent films can be used as water-repellent coatings or water-repellent and oil-repellent coatings.

例如,於專利文獻1中記載有一種撥水撥油塗層組合物,其包含:於自由端側具有全氟烷基或全氟聚醚基之含氟基與水解性基鍵結於矽原子之第一有機矽化合物(A)、及水解性矽烷低聚物、或含氟化碳之基與水解性基鍵結於矽原子之第二有機矽化合物(B)。For example, Patent Document 1 describes a water and oil repellent coating composition, which includes: a fluorine-containing group having a perfluoroalkyl group or a perfluoropolyether group on the free end side and a hydrolyzable group bonded to a silicon atom The first organosilicon compound (A), and the hydrolyzable silane oligomer, or the second organosilicon compound (B) in which the group containing carbon fluoride and the hydrolyzable group are bonded to the silicon atom.

(與第二態樣相關之先前技術) 於觸控面板顯示器等顯示裝置、光學元件、半導體元件、建築材料、汽車或建築物之窗玻璃等各種領域中,要求對基材之表面賦予撥水性。因此,使用具備各種撥水塗層之構件。 (Prior technology related to the second aspect) In various fields such as display devices such as touch panel displays, optical elements, semiconductor elements, building materials, and window glass for automobiles and buildings, it is required to impart water repellency to the surface of the base material. Therefore, members with various water-repellent coatings are used.

作為具有撥水性之層,例如可例舉含有氟元素之層,但由於其表面自由能非常小,故而難以確保與各種基材之密接性。又,含有氟元素之層具有容易帶電之性質。As a layer having water repellency, for example, a layer containing fluorine element can be mentioned, but since the surface free energy is very small, it is difficult to ensure the adhesion with various substrates. Also, the layer containing fluorine element has the property of being easily charged.

例如,於專利文獻2中揭示有一種撥水撥油構件,其係於基材之至少單側之表面上具有作為第一層之底塗層,進而於該底塗層之外表面上具有作為第二層之撥水撥油層而成,該底塗層包含以於分子中具有複數個矽烷醇基之有機矽化合物作為主成分之膜厚30~500 nm之層,且該撥水撥油層包含以水解性含氟化合物之硬化物作為主成分之膜厚0.5~30 nm之層,該撥水撥油層之外表面之表面電阻值為1.0×10 11Ω/□以下。於上述專利文獻2中,記載有藉由將底塗層之主成分設為特定者,而能夠降低於底塗層之表面所形成之撥水撥油層之外表面之表面電阻值。 先前技術文獻 專利文獻 For example, a water and oil repellent member is disclosed in Patent Document 2, which has an undercoat layer as a first layer on at least one side of the substrate, and has an undercoat layer on the outer surface of the undercoat layer. The second layer is made of a water and oil repellent layer, the primer layer contains a layer with a film thickness of 30 to 500 nm mainly composed of an organosilicon compound having multiple silanol groups in the molecule, and the water and oil repellent layer contains A layer with a film thickness of 0.5 to 30 nm mainly composed of a cured product of a hydrolyzable fluorine-containing compound, and the surface resistance of the outer surface of the water and oil repellent layer is 1.0×10 11 Ω/□ or less. In the aforementioned Patent Document 2, it is described that the surface resistance value of the outer surface of the water and oil repellent layer formed on the surface of the primer layer can be reduced by setting the main component of the primer layer to a specific one. Prior Art Documents Patent Documents

專利文獻1:國際公開第2016/076245號說明書(第一態樣) 專利文獻2:WO2020/039795號(第二態樣) Patent Document 1: Specification of International Publication No. 2016/076245 (first aspect) Patent Document 2: WO2020/039795 (Second Aspect)

[發明所欲解決之問題][Problem to be solved by the invention]

(第一態樣之課題) 近年來,針對各種菌引起之污染之問題的關注不斷提高,於上述各種領域等中,亦要求除具有良好之撥水性以外,還具有抗菌性。然而,於將撥水塗層應用於具有抗菌性之基材而製成積層體之情形時,有該積層體表面之抗菌活性降低之虞。因此,本發明(第一態樣)之目的在於提供一種兼顧良好之撥水性及抗菌性之積層體。 (Task of the first aspect) In recent years, attention to the problem of pollution caused by various bacteria has been increasing, and in the above-mentioned various fields, it is also required to have antibacterial properties in addition to good water repellency. However, when the water-repellent coating is applied to an antibacterial substrate to form a laminate, the antibacterial activity on the surface of the laminate may decrease. Therefore, an object of the present invention (first aspect) is to provide a laminate having both good water repellency and antibacterial properties.

(第二態樣之課題) 含有氟元素之層於室溫環境下之表面電阻值較高,並且於置於高於室溫之環境下後有表面電阻值進一步變高之傾向,重要的是於在較高之溫度下使用後亦可抑制表面電阻值之上升。 (Tasks of the second form) The surface resistance value of the layer containing fluorine element is higher at room temperature, and the surface resistance value tends to increase after being placed in an environment higher than room temperature. It is important to use it at a higher temperature Afterwards, the rise of the surface resistance value can also be suppressed.

進而,撥水塗層根據用途而存在對表面施加物理負載之情形,於此種情形時,亦要求不對表面造成損傷。Furthermore, depending on the application, the water-repellent coating may apply a physical load to the surface, and in this case, it is also required not to damage the surface.

因此,本發明(第二態樣)之目的在於提供一種具備於置於較高之溫度環境後亦抑制表面電阻率之上升、且耐擦傷性優異之撥水層之積層體。 [解決問題之技術手段] Therefore, an object of the present invention (aspect 2) is to provide a laminate including a water-repellent layer that suppresses an increase in surface resistivity even after being placed in a relatively high temperature environment and is excellent in scratch resistance. [Technical means to solve the problem]

(第一態樣之課題解決手段) 解決上述第一態樣之課題之本發明如以下所述。 [1]一種積層體,其係包含含有抗菌成分(K)之基材(s)、及撥水層(r)者,且 上述積層體包含具有鍵結有水解性基或羥基之矽原子之有機矽化合物(C), 上述撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)之硬化層, 包含設置於基材(s)之撥水層(r)之積層部之厚度為1 nm以上50 nm以下。 [2]如[1]所記載之積層體,其中於撥水層(r)與基材(s)之間設置有層(c), 層(c)包含有機矽化合物(C)。 [3]如[2]所記載之積層體,其中上述層(c)之厚度未達30 nm。 [4]如[1]所記載之積層體,其中基材(s)與撥水層(r)直接積層, 撥水層(r)包含有機矽化合物(C)。 [5]如[1]至[4]中任一項所記載之積層體,其中有機矽化合物(C)為具有胺基或胺骨架之化合物。 [6]如[1]至[5]中任一項所記載之積層體,其中有機矽化合物(C)為下文所述之式(c1)~(c3)之任一者所表示之化合物、或者兩種以上之式(c3)所表示之化合物藉由下述X 31~X 34之至少任一者縮合而鍵結而成之化合物。 [7]如[1]至[6]中任一項所記載之積層體,其中抗菌成分(K)包含金屬離子。 [8]如[1]至[7]中任一項所記載之積層體,其中抗菌成分(K)包含四級銨鹽。 [9]如[8]所記載之積層體,其中四級銨鹽為下文所述之式(k1)所表示之化合物。 [10]如[1]至[9]中任一項所記載之積層體,其中撥水層(r)表面之水接觸角為105°以上,且滿足選自由下述要件(α)及(β)所組成之群中之至少一個要件。 (α)進行依照JIS Z 2801:2010之抗菌活性試驗時針對金黃色葡萄球菌之抗菌活性值為0.1以上。 (β)進行依照JIS Z 2801:2010之抗菌活性試驗時針對大腸桿菌之抗菌活性值為0.1以上。 [11]如[1]至[10]中任一項所記載之積層體,其中以直徑6 mm之圓為單位施加荷重1000 g,將上述積層體之撥水層(r)表面往復摩擦1500次,進行該耐磨耗試驗後之撥水層(r)表面之水接觸角為75°以上。 [12]如[1]至[11]中任一項所記載之積層體,其中於進行施加250 g/cm 2之壓力並利用鋼絲絨摩擦上述積層體之撥水層(r)表面之磨耗試驗直至於撥水層(r)表面目視確認到剝離或損傷時,鋼絲絨於撥水層(r)表面往復之次數為100次以上。 (Means for solving the problems of the first aspect) The present invention that solves the problems of the above-mentioned first aspect is as follows. [1] A laminate comprising a substrate (s) containing an antibacterial component (K) and a water-repellent layer (r), and the laminate comprises a silicon atom bonded to a hydrolyzable group or a hydroxyl group Organosilicon compound (C), the above-mentioned water-repellent layer (r) is a hardened layer of organosilicon compound (A) having a silicon atom bonded to a hydrolyzable group or a hydroxyl group via a linking group or not via a linking group. The thickness of the layered part of the water-repellent layer (r) of the substrate (s) is not less than 1 nm and not more than 50 nm. [2] The laminate described in [1], wherein a layer (c) is provided between the water-repellent layer (r) and the substrate (s), and the layer (c) contains the organosilicon compound (C). [3] The laminate described in [2], wherein the layer (c) has a thickness of less than 30 nm. [4] The laminate described in [1], wherein the substrate (s) and the water-repellent layer (r) are directly laminated, and the water-repellent layer (r) contains the organosilicon compound (C). [5] The laminate according to any one of [1] to [4], wherein the organosilicon compound (C) is a compound having an amine group or an amine skeleton. [6] The laminate according to any one of [1] to [5], wherein the organosilicon compound (C) is a compound represented by any one of formulas (c1) to (c3) described below, Or a compound in which two or more compounds represented by the formula (c3) are bonded by condensation of at least any one of the following X 31 to X 34 . [7] The laminate according to any one of [1] to [6], wherein the antibacterial component (K) contains metal ions. [8] The laminate according to any one of [1] to [7], wherein the antibacterial component (K) contains a quaternary ammonium salt. [9] The laminate described in [8], wherein the quaternary ammonium salt is a compound represented by the formula (k1) described below. [10] The laminate described in any one of [1] to [9], wherein the water-repellent layer (r) surface has a water contact angle of 105° or more and satisfies the following requirements (α) and ( At least one element in the group formed by β). (α) When the antibacterial activity test according to JIS Z 2801:2010 is carried out, the antibacterial activity value against Staphylococcus aureus is 0.1 or more. (β) When the antibacterial activity test according to JIS Z 2801:2010 is carried out, the antibacterial activity value against Escherichia coli is 0.1 or more. [11] The laminate described in any one of [1] to [10], wherein a load of 1000 g is applied in units of a circle with a diameter of 6 mm, and the surface of the water-repellent layer (r) of the laminate is reciprocally rubbed for 1500 Second, the water contact angle on the surface of the water-repellent layer (r) after the abrasion resistance test is 75° or more. [12] The laminate described in any one of [1] to [11], wherein the surface of the water-repellent layer (r) of the laminate is rubbed with steel wool under a pressure of 250 g/cm 2 Test until peeling or damage is visually confirmed on the surface of the water-repellent layer (r), the number of times the steel wool reciprocates on the surface of the water-repellent layer (r) is more than 100 times.

(第二態樣之課題解決手段) 解決上述第二態樣之課題之本發明如以下所述。 [13]一種積層體,其係包含具有導電性之基材(s)、含有氮元素之層(c)及含有氟元素之層(r)者,且上述層(c)設置於上述基材(s)與上述層(r)之間。 [14]如[13]所記載之積層體,其中上述層(c)之厚度未達30 nm。 [15]如[13]或[14]所記載之積層體,其中上述基材(s)為含有抗靜電劑之基材,或為包含含有抗靜電劑之表層之基材。 [16]如[15]所記載之積層體,其中上述基材(s)包含樹脂基材、及上述含有抗靜電劑之表層,上述表層為硬塗層。 [17]如[16]所記載之積層體,其中上述硬塗層為選自由丙烯酸系樹脂、聚矽氧系樹脂及環氧系樹脂所組成之群中之至少一種。 [18]如[15]至[17]中任一項所記載之積層體,其中上述表層之厚度為10 μm以下。 [19]如[15]至[18]中任一項所記載之積層體,其中上述抗靜電劑為離子性化合物。 [20]如[15]至[19]中任一項所記載之積層體,其中上述抗靜電劑為具有陽離子性有機基或陰離子性有機基之離子性化合物。 [21]如[15]至[20]中任一項所記載之積層體,其中上述抗靜電劑為選自由四級銨鹽、吡啶鎓鹽、及具有一級~三級胺基之化合物所組成之群中之至少一種。 [22]如[13]至[21]中任一項所記載之積層體,其中上述層(c)與上述層(r)之合計厚度未達50 nm。 [23]如[13]至[22]中任一項所記載之積層體,其中上述層(c)為下文所述之式(c1)或(c2)所表示之有機矽化合物(C)之硬化層。 (Second aspect of problem solving) The present invention that solves the problems of the above-mentioned second aspect is as follows. [13] A laminate comprising a conductive substrate (s), a layer (c) containing a nitrogen element, and a layer (r) containing a fluorine element, wherein the layer (c) is provided on the substrate Between (s) and the above-mentioned layer (r). [14] The laminate according to [13], wherein the layer (c) has a thickness of less than 30 nm. [15] The laminate described in [13] or [14], wherein the substrate (s) is a substrate containing an antistatic agent, or a substrate containing a surface layer containing an antistatic agent. [16] The laminate according to [15], wherein the substrate (s) includes a resin substrate and the surface layer containing an antistatic agent, and the surface layer is a hard coat layer. [17] The laminate according to [16], wherein the hard coat layer is at least one selected from the group consisting of acrylic resins, silicone resins, and epoxy resins. [18] The laminate according to any one of [15] to [17], wherein the surface layer has a thickness of 10 μm or less. [19] The laminate according to any one of [15] to [18], wherein the antistatic agent is an ionic compound. [20] The laminate according to any one of [15] to [19], wherein the antistatic agent is an ionic compound having a cationic organic group or an anionic organic group. [21] The laminate described in any one of [15] to [20], wherein the antistatic agent is selected from quaternary ammonium salts, pyridinium salts, and compounds having primary to tertiary amino groups At least one of the group. [22] The laminate according to any one of [13] to [21], wherein the total thickness of the layer (c) and the layer (r) is less than 50 nm. [23] The laminate according to any one of [13] to [22], wherein the layer (c) is an organosilicon compound (C) represented by the formula (c1) or (c2) described below. hardened layer.

(第一態樣及第二態樣之課題解決手段) 又,本發明(第一態樣及第二態樣)亦包含以下發明。 [24]如[1]至[23]中任一項所記載之積層體,其中上述撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子、並且含有氟元素之有機矽化合物(A)之硬化層, 上述層(r)為含有氟元素之有機矽化合物(A)之硬化層。 [25]如[24]所記載之積層體,其中有機矽化合物(A)為具有氟聚醚結構之化合物。 [26]如[25]所記載之積層體,其中有機矽化合物(A)為下文所述之式(a1)所表示之化合物。 [27]如[1]至[26]中任一項所記載之積層體,其中撥水層(r)表面或層(r)表面之動摩擦係數為0.1以下。 [28]如[1]至[27]中任一項所記載之積層體,其中將上述積層體於80℃保持36小時之耐熱試驗後之表面電阻率未達上述耐熱試驗前之表面電阻率之6.4倍。 [29]一種視窗膜或觸控面板顯示器,其包含如[1]至[28]中任一項所記載之積層體。 [發明之效果] (Problem solving methods of the first aspect and the second aspect) Moreover, this invention (1st aspect and 2nd aspect) also includes the following invention. [24] The laminate according to any one of [1] to [23], wherein the water-repellent layer (r) is silicon having a hydrolyzable group or a hydroxyl group bonded via a linking group or not. Atoms, and the hardened layer of organosilicon compound (A) containing fluorine element, The above layer (r) is a cured layer of organosilicon compound (A) containing fluorine element. [25] The laminate according to [24], wherein the organosilicon compound (A) is a compound having a fluoropolyether structure. [26] The laminate according to [25], wherein the organosilicon compound (A) is a compound represented by the formula (a1) described below. [27] The laminate according to any one of [1] to [26], wherein the surface of the water-repellent layer (r) or the surface of the layer (r) has a dynamic friction coefficient of 0.1 or less. [28] The laminate according to any one of [1] to [27], wherein the surface resistivity after the heat resistance test of keeping the laminate at 80°C for 36 hours does not reach the surface resistivity before the heat resistance test 6.4 times. [29] A window film or a touch panel display comprising the laminate according to any one of [1] to [28]. [Effect of Invention]

(第一態樣之效果) 根據本發明(第一態樣),能夠提供一種兼顧良好之撥水性及抗菌性之積層體。 (Effect of the first aspect) According to the present invention (first aspect), it is possible to provide a laminate having both good water repellency and antibacterial properties.

(第二態樣之效果) 根據本發明(第二態樣),能夠提供一種如下之積層體,該積層體於含有氟元素之層之表面,於高溫環境下使用後亦能夠抑制表面電阻率之上升,並且耐擦傷性優異。 (The effect of the second aspect) According to the present invention (second aspect), it is possible to provide a laminate that suppresses an increase in surface resistivity even after use in a high-temperature environment on the surface of a layer containing a fluorine element and that is excellent in scratch resistance. .

(用以實施與第一態樣相關之發明之形態) 本發明(第一態樣)之積層體係包含含有抗菌成分(K)之基材(s)、及撥水層(r)者,且上述撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)之硬化層。 (Mode for implementing the invention related to the first aspect) The laminated system of the present invention (first aspect) includes a substrate (s) containing an antibacterial component (K) and a water-repellent layer (r), and the above-mentioned water-repellent layer (r) has a linking group or does not A cured layer of an organosilicon compound (A) having a silicon atom bonded to a hydrolyzable group or a hydroxyl group as a linking group.

本發明(第一態樣)之較佳之積層體係包含含有抗菌成分(K)之基材(s)、及撥水層(r)者,且上述積層體包含具有鍵結有水解性基或羥基之矽原子之有機矽化合物(C),上述撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)之硬化層。A preferred layered system of the present invention (first aspect) includes a substrate (s) containing an antibacterial component (K) and a water-repellent layer (r), and the above-mentioned layered body includes An organosilicon compound (C) containing silicon atoms, the water-repellent layer (r) is a hardened layer of an organosilicon compound (A) having a silicon atom bonded to a hydrolyzable group or a hydroxyl group via a linking group or not via a linking group .

又,本發明(第一態樣)之較佳之積層體係包含含有抗菌成分(K)之基材(s)、及撥水層(r)者,且上述撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)之硬化層,包含設置於基材(s)之撥水層(r)之積層部之厚度為1 nm以上50 nm以下。Also, the preferred laminated system of the present invention (first aspect) includes a substrate (s) containing an antibacterial component (K) and a water-repellent layer (r), and the above-mentioned water-repellent layer (r) has The thickness of the hardened layer of the organosilicon compound (A) containing a silicon atom with a hydrolyzable group or a hydroxyl group bonded to a silicon atom without a linking group, including the layered part of the water-repellent layer (r) provided on the substrate (s), is Above 1 nm and below 50 nm.

又,本發明(第一態樣)之較佳之積層體係包含含有抗菌成分(K)之基材(s)、及撥水層(r)者,且上述積層體包含具有鍵結有水解性基或羥基之矽原子之有機矽化合物(C),上述撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)之硬化層,包含設置於基材(s)之撥水層(r)之積層部之厚度為1 nm以上50 nm以下。藉由上述積層體,能夠提供一種除了兼顧良好之撥水性及抗菌性以外,選自耐磨耗性、撥油性、及耐擦傷性中之至少一種良好之積層體。Also, a preferred laminate system of the present invention (first aspect) includes a base material (s) containing an antibacterial component (K) and a water-repellent layer (r), and the laminate includes Silicone compound (C) having a silicon atom of a hydroxyl group or a hydroxyl group, the water-repellent layer (r) is an organosilicon compound (A) having a silicon atom bonded to a hydrolyzable group or a hydroxyl group via a linking group or not via a linking group The hardened layer, including the layered part of the water-repellent layer (r) provided on the substrate (s), has a thickness of not less than 1 nm and not more than 50 nm. According to the above laminate, it is possible to provide a laminate having good at least one of abrasion resistance, oil repellency, and scratch resistance in addition to good water repellency and antibacterial properties.

於本說明書中,「積層部」為包含撥水層(r)之部分,於在基材(s)之單面僅積層有撥水層(r)之情形時僅指撥水層(r),於經由與撥水層(r)不同之介隔層在基材(s)之單面積層有撥水層(r)之情形時,指介隔層及撥水層(r)。介隔層可為下文所述之層(c)。In this specification, the "laminated part" is the part that includes the water-repellent layer (r), and only refers to the water-repellent layer (r) when only the water-repellent layer (r) is laminated on one side of the substrate (s), When there is a water-repellent layer (r) on a single layer of the substrate (s) via a different interlayer from the water-repellent layer (r), it refers to the intermediary layer and the water-repellent layer (r). The spacer layer may be layer (c) described below.

可於撥水層(r)之外表面(不存在基材(s)一側之面)積層與撥水層(r)及介隔層不同之其他層,於該情形時,該其他層亦包含於積層部中。於本發明(第一態樣)之積層體中,撥水層(r)較佳為最外層。Other layers different from the water-repellent layer (r) and the intervening layer can be laminated on the outer surface of the water-repellent layer (r) (the side where the substrate (s) does not exist). Included in the Lamination Section. In the laminate of the present invention (first aspect), the water-repellent layer (r) is preferably the outermost layer.

於在基材(s)之兩面形成有撥水層(r)之情形時,積層部存在於兩面,至少一積層部具有1 nm以上50 nm以下之厚度即可。When the water-repellent layer (r) is formed on both surfaces of the substrate (s), laminated portions exist on both surfaces, and at least one laminated portion may have a thickness of not less than 1 nm and not more than 50 nm.

本發明(第一態樣)之積層體可兼顧良好之撥水性及抗菌性(較佳為抗菌性及抗病毒性)。又,根據本發明(第一態樣),亦能夠提供一種除了撥水性及抗菌性以外,較佳為選自耐磨耗性、防污性、撥油性、耐擦傷性、及透明性中之至少一種良好之積層體。The laminate of the present invention (first aspect) can have good water repellency and antibacterial properties (preferably antibacterial and antiviral properties). Also, according to the present invention (the first aspect), it is also possible to provide a water-repellent and antibacterial property, preferably selected from abrasion resistance, anti-fouling properties, oil repellency, scratch resistance, and transparency. At least one good laminate.

再者,於本說明書中,「抗菌性」不僅意指防止細菌或黴菌等菌之增殖,而且亦包含殺滅或減少菌之含義。作為菌,例如可例舉:大腸桿菌、金黃色葡萄球菌、表皮葡萄球菌、鏈球菌、肺炎球菌、流感嗜血桿菌、百日咳菌、腸炎桿菌、肺炎桿菌、綠膿桿菌、弧菌、MRSA(methicillin-resistant staphyllococcus aureus,耐甲氧西林金黃色葡萄球菌)等。Furthermore, in this specification, "antibacterial property" not only means to prevent the proliferation of bacteria such as bacteria and molds, but also includes the meaning of killing or reducing bacteria. As the bacteria, for example, Escherichia coli, Staphylococcus aureus, Staphylococcus epidermidis, Streptococcus, pneumoniae, Haemophilus influenzae, pertussis, Enteritidis, Klebsiella pneumoniae, Pseudomonas aeruginosa, Vibrio, MRSA (methicillin -resistant staphylloccus aureus, methicillin-resistant Staphylococcus aureus), etc.

又,「抗病毒性」意指使病毒之一部分滅活化,具體而言,意指抑制病毒感染力價。作為病毒,例如包括:鼻病毒、脊髓灰白質炎病毒、輪狀病毒、口蹄疫病毒、諾羅病毒、腸病毒、肝病毒、星狀病毒、沙波病毒、E型肝炎病毒、A型、B型、及C型流行性感冒病毒、副流行性感冒病毒、腮腺炎病毒(流行性腮腺炎)、麻疹病毒、人類偏肺病毒、RS(respiratory syncytial,呼吸道細胞融合)病毒、尼帕病毒、亨德拉病毒、黃熱病毒、登革熱病毒、日本腦炎病毒、西尼羅河病毒、B型及C型肝炎病毒、東部及西部馬腦炎病毒、o'nyong-nyong病毒、風疹病毒、拉薩病毒、胡甯病毒、馬丘波病毒、瓜納瑞托(Guanarito)病毒、沙比亞病毒、克里米亞-剛果出血熱病毒、糠蚊熱、漢他病毒、辛諾柏病毒、狂犬病病毒、埃博拉病毒、馬爾堡病毒、蝙蝠麗莎病毒、人類T細胞白血病病毒、人類免疫缺陷病毒、人類冠狀病毒、SARS(Severe Acute Respiratory Syndrome,嚴重急性呼吸道症候群)冠狀病毒、人類小病毒、多瘤病毒、人類乳突病毒、腺病毒、疱疹病毒、水痘帶狀疱疹病毒、EB(Epstein-Barr,艾司坦-巴爾)病毒、巨細胞病毒、天花病毒、猴痘病毒、牛痘病毒、軟疣痘病毒、副痘病毒等,本發明(第一態樣)之積層體對於具有包膜之病毒而言更有用。Also, "antiviral properties" means inactivating a part of a virus, and specifically, means suppressing virus infectivity. Examples of viruses include rhinovirus, poliovirus, rotavirus, foot-and-mouth disease virus, norovirus, enterovirus, hepatovirus, astrovirus, sapovirus, hepatitis E virus, type A, type B , and C-type influenza virus, parainfluenza virus, mumps virus (mumps), measles virus, human metapneumovirus, RS (respiratory syncytial, respiratory cell fusion) virus, Nipah virus, Henderson virus La virus, yellow fever virus, dengue virus, Japanese encephalitis virus, West Nile virus, hepatitis B and C virus, eastern and western equine encephalitis virus, o'nyong-nyong virus, rubella virus, Lassa virus, Junin Virus, Machupo virus, Guanarito virus, Sabia virus, Crimean-Congo hemorrhagic fever virus, furode fever, Hantavirus, sinobe virus, rabies virus, Ebola Viruses, Marburg virus, bat Lisa virus, human T-cell leukemia virus, human immunodeficiency virus, human coronavirus, SARS (Severe Acute Respiratory Syndrome, severe acute respiratory syndrome) coronavirus, human parvovirus, polyoma virus, human Papillomavirus, adenovirus, herpes virus, varicella zoster virus, EB (Epstein-Barr) virus, cytomegalovirus, smallpox virus, monkeypox virus, vaccinia virus, molluscum pox virus, para For poxviruses, etc., the laminate of the present invention (first aspect) is more useful for viruses having an envelope.

本發明(第一態樣)之積層體包含含有抗菌成分(K)之基材(s)及撥水層(r)。於基材(s)與撥水層(r)之間可設置有與基材(s)及撥水層(r)不同之層(以下稱為層(c)),亦可直接積層基材(s)與撥水層(r)。以下,於本說明書中,將於基材(s)與撥水層(r)之間設置有層(c)之積層體稱為「積層體(1)」,於該情形時,撥水層(r)及層(c)成為積層部。又,於本說明書中,將直接積層基材(s)與撥水層(r)之積層體稱為「積層體(2)」,於該情形時,撥水層(r)成為積層部。The laminate of the present invention (first aspect) includes a substrate (s) containing an antibacterial component (K) and a water-repellent layer (r). A layer (hereinafter referred to as layer (c)) different from the base material (s) and the water-repellent layer (r) can be provided between the base material (s) and the water-repellent layer (r), and the base material can also be directly laminated (s) and water-repellent layer (r). Hereinafter, in this specification, the laminate in which the layer (c) is provided between the substrate (s) and the water-repellent layer (r) is referred to as "laminate (1)". In this case, the water-repellent layer (r) and layer (c) become a laminated part. Moreover, in this specification, the laminated body which directly laminated|stacked a base material (s) and a water-repellent layer (r) is called "laminate (2)", and in this case, a water-repellent layer (r) becomes a laminated part.

於本發明(第一態樣)之積層體包含具有鍵結有水解性基或羥基之矽原子之有機矽化合物(C)之情形時,有機矽化合物(C)可包含於任一層中,較佳為包含於撥水層(r)或層(c)中。尤其是於積層體(1)之情形時,有機矽化合物(C)較佳為包含於撥水層(r)或層(c)中,尤佳為包含於層(c)中。又,於積層體(2)之情形時,有機矽化合物(C)較佳為包含於撥水層(r)中。In the case where the laminate of the present invention (first aspect) contains an organosilicon compound (C) having a silicon atom bonded to a hydrolyzable group or a hydroxyl group, the organosilicon compound (C) may be contained in any layer, and the Preferably, it is included in the water-repellent layer (r) or layer (c). Especially in the case of the laminate (1), the organosilicon compound (C) is preferably contained in the water-repellent layer (r) or layer (c), particularly preferably contained in the layer (c). In addition, in the case of the laminate (2), the organosilicon compound (C) is preferably contained in the water-repellent layer (r).

以下,依序對基材(s)、撥水層(r)、層(c)進行說明。Hereinafter, the substrate (s), the water-repellent layer (r), and the layer (c) will be described in order.

1-1.基材(s) 基材(s)之材質並無特別限定,可為有機系材料、無機系材料之任一種,又,基材之形狀可為平面、曲面之任一種,亦可為將該等組合而成之形狀。作為有機系材料,可例舉:丙烯酸樹脂、丙烯腈樹脂、聚碳酸酯樹脂、聚酯樹脂(例如聚對苯二甲酸乙二酯等)、苯乙烯樹脂、纖維素樹脂、聚烯烴樹脂、乙烯基系樹脂(例如聚乙烯、聚氯乙烯、乙烯基苄基氯系樹脂、聚乙烯醇等)、聚偏二氯乙烯樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚醚醯亞胺樹脂、聚醚碸樹脂、聚碸樹脂、聚乙烯醇縮醛樹脂、乙烯醚系樹脂、及該等共聚物等熱塑性樹脂;酚樹脂、尿素樹脂、三聚氰胺樹脂、環氧樹脂、氧雜環丁烷樹脂、不飽和聚酯、聚矽氧樹脂、胺基甲酸酯樹脂等熱固性樹脂等。作為無機系材料,可例舉:鐵、矽、銅、鋅、鋁、鈦、鋯、鈮、鉭、鑭等金屬;該等之金屬氧化物、或包含該等金屬之合金;陶瓷、玻璃等。該等中,較佳為有機系材料。 1-1. Substrate(s) The material of the base material (s) is not particularly limited, and may be any of organic materials and inorganic materials, and the shape of the base material may be either flat or curved, or a combination thereof. shape. Examples of organic materials include: acrylic resins, acrylonitrile resins, polycarbonate resins, polyester resins (such as polyethylene terephthalate, etc.), styrene resins, cellulose resins, polyolefin resins, vinyl Base resin (such as polyethylene, polyvinyl chloride, vinyl benzyl chloride resin, polyvinyl alcohol, etc.), polyvinylidene chloride resin, polyamide resin, polyimide resin, polyamideimide Resins, polyetherimide resins, polyetherimide resins, polyether resins, polyvinyl acetal resins, vinyl ether resins, and thermoplastic resins such as these copolymers; phenol resins, urea resins, melamine resins, epoxy resins Resins, oxetane resins, unsaturated polyesters, silicone resins, urethane resins and other thermosetting resins. Examples of inorganic materials include metals such as iron, silicon, copper, zinc, aluminum, titanium, zirconium, niobium, tantalum, and lanthanum; metal oxides of these metals, or alloys containing these metals; ceramics, glass, etc. . Among these, organic materials are preferable.

基材(s)之厚度例如為5 μm以上,較佳為10 μm以上,更佳為20 μm以上,進而較佳為30 μm以上,可為500 μm以下,較佳為200 μm以下,更佳為150 μm以下,進而較佳為100 μm以下,尤佳為60 μm以下。The thickness of the substrate (s) is, for example, 5 μm or more, preferably 10 μm or more, more preferably 20 μm or more, further preferably 30 μm or more, may be 500 μm or less, preferably 200 μm or less, more preferably It is 150 μm or less, more preferably 100 μm or less, particularly preferably 60 μm or less.

基材(s)可為單層,亦可為2層以上之多層。於基材(s)為多層之情形時,基材(s)較佳為具有於成為母體之層(s1)上設置有與層(s1)不同之層(s2)之多層結構。於基材(s)包含層(s1)及層(s2)之情形時,本發明(第一態樣)之積層體較佳為依序積層有層(s1)、層(s2)、撥水層(r)。即,於本發明(第一態樣)之積層體為上述積層體(1)之情形時,較佳為依序積層有層(s1)、層(s2)、層(c)、撥水層(r),於本發明(第一態樣)之積層體為上述積層體(2)之情形時,較佳為依序積層有層(s1)、層(s2)、撥水層(r)。The substrate (s) may be a single layer or a multilayer of two or more layers. When the substrate (s) is multilayered, the substrate (s) preferably has a multilayer structure in which a layer (s2) different from the layer (s1) is provided on a matrix layer (s1). When the substrate (s) includes the layer (s1) and the layer (s2), the laminate of the present invention (first aspect) preferably has the layer (s1), the layer (s2), the water repellent layer (r). That is, when the layered body of the present invention (first aspect) is the above-mentioned layered body (1), it is preferable that layer (s1), layer (s2), layer (c), and water-repellent layer are layered in this order. (r), when the laminated body of the present invention (first aspect) is the above-mentioned laminated body (2), it is preferable that the layer (s1), the layer (s2), and the water-repellent layer (r) are sequentially laminated. .

1-1-1.層(s1) 層(s1)之材質可為上述有機系材料及無機系材料之任一者,較佳為有機系材料,其中,更佳為選自丙烯酸樹脂、聚酯樹脂、乙烯基苄基氯系樹脂、環氧樹脂、聚矽氧樹脂、及胺基甲酸酯樹脂中之至少一種,進而較佳為丙烯酸樹脂、聚酯樹脂,尤佳為聚對苯二甲酸乙二酯。 1-1-1. Layer (s1) The material of the layer (s1) can be any one of the above-mentioned organic materials and inorganic materials, preferably an organic material, among which, it is more preferably selected from acrylic resin, polyester resin, vinyl benzyl chloride resin, At least one of epoxy resin, polysiloxane resin, and urethane resin, more preferably acrylic resin, polyester resin, especially preferably polyethylene terephthalate.

層(s1)之厚度例如為5 μm以上,較佳為10 μm以上,更佳為20 μm以上,進而較佳為30 μm以上,可為500 μm以下,較佳為200 μm以下,更佳為150 μm以下,進而較佳為100 μm以下,尤佳為60 μm以下。The thickness of the layer (s1) is, for example, 5 μm or more, preferably 10 μm or more, more preferably 20 μm or more, further preferably 30 μm or more, may be 500 μm or less, preferably 200 μm or less, more preferably 150 μm or less, more preferably 100 μm or less, especially preferably 60 μm or less.

1-1-2.層(s2) 作為層(s2),可例舉由選自由活性能量線硬化型樹脂及熱固型之樹脂所組成之群(X1)中之至少一種所形成之層。上述活性能量線係定義為能夠將產生活性種之化合物分解而使其產生活性種之能量線。作為活性能量線,可例舉:可見光、紫外線、紅外線、X射線、α射線、β射線、γ射線及電子束等。上述活性能量線硬化型樹脂包括:丙烯酸系樹脂、環氧系樹脂、氧雜環丁烷系樹脂、胺基甲酸酯系樹脂、聚醯胺系樹脂、乙烯基苄基氯系樹脂、乙烯基系樹脂(聚乙烯、氯乙烯系樹脂等)、苯乙烯系樹脂、酚系樹脂、乙烯醚系樹脂或聚矽氧系樹脂或者該等之混合樹脂等紫外線硬化型樹脂、或電子束硬化型樹脂,尤佳為紫外線硬化型樹脂。又,作為層(s2),亦可例舉由選自由鈦氧化物、鋯氧化物、鋁氧化物、鈮氧化物、鉭氧化物、鑭氧化物、及SiO 2所組成之群(X2)中之至少一種所形成之層。作為群(X1),尤佳為丙烯酸系樹脂、聚矽氧系樹脂、苯乙烯系樹脂、氯乙烯系樹脂、聚醯胺系樹脂、酚系樹脂、及環氧系樹脂。層(s2)之厚度例如為0.1 nm以上100 μm以下,較佳為1 nm以上60 μm以下,更佳為1 nm以上10 μm以下。若層(s2)之厚度過厚,則存在容易因後續之加工時之熱而捲縮之情形。 1-1-2. Layer (s2) The layer (s2) may, for example, be a layer formed of at least one selected from the group (X1) consisting of active energy ray-curable resins and thermosetting resins. The aforementioned active energy ray is defined as an energy ray capable of decomposing a compound that generates active species to generate active species. Examples of active energy rays include visible light, ultraviolet rays, infrared rays, X-rays, α-rays, β-rays, γ-rays, and electron beams. The above-mentioned active energy ray-curable resins include: acrylic resins, epoxy resins, oxetane resins, urethane resins, polyamide resins, vinyl benzyl chloride resins, vinyl UV-curable resins (polyethylene, vinyl chloride-based resins, etc.), styrene-based resins, phenol-based resins, vinyl ether-based resins, polysiloxane-based resins, or mixtures thereof, or electron beam-curable resins , especially UV curable resin. Furthermore, as the layer (s2), it is also possible to exemplify the layer (X2) selected from the group (X2) consisting of titanium oxide, zirconium oxide, aluminum oxide, niobium oxide, tantalum oxide, lanthanum oxide, and SiO2 . at least one of the formed layers. As the group (X1), particularly preferred are acrylic resins, silicone resins, styrene resins, vinyl chloride resins, polyamide resins, phenol resins, and epoxy resins. The thickness of the layer (s2) is, for example, from 0.1 nm to 100 μm, preferably from 1 nm to 60 μm, more preferably from 1 nm to 10 μm. If the thickness of the layer (s2) is too thick, it may easily shrink due to heat during subsequent processing.

於層(s2)包含由選自上述群(X1)中之至少一種所形成之層之情形時,層(s2)可發揮作為具有表面硬度之硬塗層(hc)之功能,而可對基材(s)賦予耐擦傷性。硬塗層(hc)之硬度通常以鉛筆硬度計為B以上,較佳為HB以上,進而較佳為H以上,尤佳為2H以上。於層(s2)包含硬塗層(hc)之情形時,即於層(s2)具有硬塗層之功能之情形時,硬塗層(hc)可為單層結構,亦可為多層結構。硬塗層(hc)例如較佳為包含上述紫外線硬化型樹脂,尤佳為包含丙烯酸系樹脂或聚矽氧系樹脂,為了表現高硬度,較佳為包含丙烯酸系樹脂。又,就可見基材(s)與撥水層(r)之密接性變得良好之傾向之方面而言,亦較佳為包含環氧系樹脂。再者,於下文所述之顯示裝置一欄對形成構成群(X1)之活性能量線硬化型樹脂及熱固型之樹脂之具體方法進行說明,例如藉由將包含照射活性能量線或熱能而形成交聯結構之反應性材料之組合物塗佈於層(s1)上並硬化,可形成層(s2)。再者,於下文所述之抗菌成分(K)包含於層(s2)中之情形時,使用於含有上述反應性材料之組合物中添加抗菌成分(K)之組合物即可。In the case where the layer (s2) comprises at least one layer formed from the group (X1) above, the layer (s2) can function as a hard coat layer (hc) having surface hardness, and can protect the base The material(s) imparts scratch resistance. The hardness of the hard coat layer (hc) is usually B or higher in pencil hardness, preferably HB or higher, further preferably H or higher, and particularly preferably 2H or higher. When the layer (s2) includes a hard coat layer (hc), that is, when the layer (s2) has the function of a hard coat layer, the hard coat layer (hc) may have a single-layer structure or a multi-layer structure. The hard coat layer (hc), for example, preferably includes the above-mentioned ultraviolet curable resin, more preferably includes an acrylic resin or silicone resin, and preferably includes an acrylic resin in order to express high hardness. Moreover, it is also preferable to contain an epoxy-type resin at the point which shows the tendency for the adhesiveness of a base material (s) and a water-repellent layer (r) to become favorable. Furthermore, in the column of the display device described below, a specific method of forming the active energy ray-curable resin and the thermosetting resin constituting the group (X1) will be described, for example, by including irradiating active energy rays or heat energy. A composition of reactive materials forming a cross-linked structure is coated on layer (s1) and cured to form layer (s2). Furthermore, in the case where the antibacterial component (K) described below is included in the layer (s2), a composition in which the antibacterial component (K) is added to a composition containing the above-mentioned reactive material may be used.

於層(s2)包含硬塗層(hc)之情形時,硬塗層(hc)可包含添加劑。添加劑並無限定,可例舉:無機系微粒子、有機系微粒子、或該等之混合物。作為添加劑,可例舉:紫外線吸收劑、二氧化矽、氧化鋁等金屬氧化物、聚有機矽氧烷等無機填料。藉由包含無機填料,可提高基材(s)與撥水層(r)之密接性。硬塗層(hc)之厚度例如較佳為1 μm以上,更佳為1.2 μm以上,進而較佳為1.4 μm以上,又,較佳為100 μm以下,更佳為50 μm以下,進而較佳為20 μm以下,進而更佳為10 μm以下。於上述硬塗層(hc)之厚度為1 μm以上之情形時,能夠確保充分之耐擦傷性,於為100 μm以下之情形時,能夠確保耐彎曲性,其結果為,能夠抑制硬化收縮引起之捲縮之產生。When the layer (s2) contains a hard coat layer (hc), the hard coat layer (hc) may contain additives. The additive is not limited, and examples thereof include inorganic fine particles, organic fine particles, or a mixture thereof. Examples of additives include inorganic fillers such as ultraviolet absorbers, metal oxides such as silica and alumina, and polyorganosiloxane. By including the inorganic filler, the adhesion between the substrate (s) and the water-repellent layer (r) can be improved. The thickness of the hard coat layer (hc), for example, is preferably at least 1 μm, more preferably at least 1.2 μm, further preferably at least 1.4 μm, and preferably at most 100 μm, more preferably at most 50 μm, and still more preferably It is 20 μm or less, more preferably 10 μm or less. When the thickness of the above-mentioned hard coat layer (hc) is 1 μm or more, sufficient scratch resistance can be ensured, and when it is 100 μm or less, bending resistance can be ensured, and as a result, it is possible to suppress the occurrence of curing shrinkage. The generation of curling.

於層(s2)包含由選自上述群(X2)中之至少一種所形成之層之情形時,層(s2)可發揮作為防止入射之光之反射的抗反射層(ar)之功能。於層(s2)包含抗反射層(ar)之情形時,抗反射層(ar)較佳為於380~780 nm之可見光區域表現出反射率降低至5.0%以下左右之反射特性之層。抗反射層(ar)較佳為包含由二氧化矽所形成之層。When the layer (s2) includes a layer formed of at least one selected from the group (X2) above, the layer (s2) can function as an antireflection layer (ar) that prevents reflection of incident light. When the layer (s2) includes an anti-reflection layer (ar), the anti-reflection layer (ar) is preferably a layer that exhibits reflective properties such that the reflectance decreases to about 5.0% or less in the visible light region of 380 to 780 nm. The anti-reflection layer (ar) preferably includes a layer formed of silicon dioxide.

抗反射層(ar)之結構並無特別限定,可為單層結構,亦可為多層結構。於多層結構之情形時,較佳為將低折射率層與高折射率層交替積層而成之結構,積層數較佳為合計為2~20。作為構成高折射率層之材料,可例舉:鈦氧化物、鋯氧化物、鋁氧化物、鈮氧化物、鉭氧化物或鑭氧化物,作為構成低折射率層之材料,可例舉二氧化矽。作為多層結構之抗反射層,較佳為SiO 2(二氧化矽)與ZrO 2、或SiO 2與Nb 2O 5交替積層、且與層(s1)為相反側之最外層為SiO 2之結構。抗反射層(ar)例如可藉由蒸鍍法形成。抗反射層(ar)之厚度例如為0.5 nm以上、1000 nm以下。 The structure of the anti-reflection layer (ar) is not particularly limited, and may be a single-layer structure or a multi-layer structure. In the case of a multilayer structure, a structure in which low-refractive-index layers and high-refractive-index layers are alternately laminated is preferable, and the total number of laminated layers is preferably 2 to 20. As the material constituting the high refractive index layer, titanium oxide, zirconium oxide, aluminum oxide, niobium oxide, tantalum oxide or lanthanum oxide can be cited. As the material constituting the low refractive index layer, two Silicon oxide. As an anti-reflection layer of a multilayer structure, it is preferable to alternately laminate SiO 2 (silicon dioxide) and ZrO 2 , or SiO 2 and Nb 2 O 5 , and the outermost layer on the opposite side to layer (s1) is SiO 2 . The anti-reflection layer (ar) can be formed, for example, by evaporation. The thickness of the antireflection layer (ar) is, for example, not less than 0.5 nm and not more than 1000 nm.

層(s2)可包含硬塗層(hc),亦可包含抗反射層(ar),亦可包含硬塗層(hc)及抗反射層(ar)之兩者,較佳為至少包含硬塗層(hc)。於層(s2)包含硬塗層(hc)及抗反射層(ar)之兩者之情形時,較佳為將抗反射層(ar)積層於撥水層(r)側。The layer (s2) may comprise a hard coat (hc), may also comprise an anti-reflection layer (ar), may also comprise both a hard coat (hc) and an anti-reflection layer (ar), preferably at least comprises a hard coat layer (hc). When the layer (s2) includes both the hard coat layer (hc) and the antireflection layer (ar), it is preferable to laminate the antireflection layer (ar) on the water-repellent layer (r) side.

基材(s)中含有抗菌成分(K)。The base material (s) contains an antibacterial component (K).

作為抗菌成分(K),可使用表現出抗菌性(較佳為抗菌性及抗病毒性)之化合物,可為無機系抗菌成分,亦可為有機系抗菌成分。作為抗菌成分(K),可僅使用一種,亦可使用兩種以上。As the antibacterial component (K), a compound exhibiting antibacterial properties (preferably antibacterial and antiviral properties) can be used, and it may be an inorganic antibacterial component or an organic antibacterial component. As an antibacterial component (K), only 1 type may be used, and 2 or more types may be used.

作為無機系抗菌成分,較佳為金屬離子(以下稱為金屬離子(K2)),具體而言,可例舉:銻、銀、鐵、鎳、銅、鉻、錳、金、鎵、鍺、汞、砷、鋁、鉛、鋅、鉍、錫、及鈀等之離子。作為金屬離子(K2),較佳為銀離子或銅離子。As an inorganic antibacterial component, metal ions (hereinafter referred to as metal ions (K2)) are preferred, and specifically, antimony, silver, iron, nickel, copper, chromium, manganese, gold, gallium, germanium, Ions of mercury, arsenic, aluminum, lead, zinc, bismuth, tin, and palladium. As metal ions (K2), silver ions or copper ions are preferred.

作為有機系抗菌成分,可例舉:陽離子系界面活性劑、陰離子系界面活性劑、兩性界面活性劑、非離子系界面活性劑等各種界面活性劑。其中,較佳為四級銨鹽、吡啶鎓鹽、咪唑啉鎓鹽、異喹啉鎓鹽、鏻鹽等陽離子系界面活性劑,尤佳為四級銨鹽。Examples of the organic antibacterial component include various surfactants such as cationic surfactants, anionic surfactants, amphoteric surfactants, and nonionic surfactants. Among them, cationic surfactants such as quaternary ammonium salts, pyridinium salts, imidazolinium salts, isoquinolinium salts, and phosphonium salts are preferred, and quaternary ammonium salts are particularly preferred.

又,作為有機系抗菌成分,較佳為於分子內含有1個以上鍵結水解性基或羥基(以下將兩者合併稱為反應性基(h2)之矽原子之化合物,更佳為含有1個以上鍵結反應性基(h2)之矽原子之陽離子系界面活性劑,尤佳為含有1個以上鍵結反應性基(h2)之矽原子之四級銨鹽。上述矽原子之數量於有機系抗菌成分1分子中,較佳為1以上12以下,更佳為1以上5以下,進而較佳為1以上3以下。作為上述水解性基,可例舉:烷氧基、鹵素原子、氰基、乙醯氧基、異氰酸酯基等,較佳為烷氧基,更佳為碳數1~4之烷氧基。較佳為於上述矽原子鍵結有烷氧基或羥基,尤佳為鍵結有碳數1~4之烷氧基或羥基。認為藉由有機系抗菌成分為含有鍵結反應性基(h2)之矽原子之化合物,實現分子間之反應性基(h2)彼此之縮合、或源自鍵結反應性基(h2)之矽原子之-SiOH基與源自基材中之其他化合物之活性氫(羥基等)之縮合,或許因此能夠抑制所獲得之積層體之浸水或升溫等環境變化引起之有機系抗菌成分之急遽滲出,從而基材中之有機系抗菌成分之保持變得容易。In addition, as an organic antibacterial component, it is preferable to contain one or more silicon atoms in the molecule that are bonded to hydrolyzable groups or hydroxyl groups (hereinafter both are combined and referred to as reactive groups (h2), and more preferably contain 1 A cationic surfactant with more than one silicon atom bonded to reactive groups (h2), especially a quaternary ammonium salt containing more than one silicon atom bonded to reactive groups (h2). The number of the above silicon atoms is In one molecule of the organic antibacterial component, it is preferably from 1 to 12, more preferably from 1 to 5, and still more preferably from 1 to 3. As the above-mentioned hydrolyzable group, it can be exemplified: an alkoxy group, a halogen atom, A cyano group, an acetyloxy group, an isocyanate group, etc., preferably an alkoxy group, more preferably an alkoxy group with 1 to 4 carbon atoms. It is preferably an alkoxy group or a hydroxyl group bonded to the above-mentioned silicon atom, especially preferably It is bonded with an alkoxy group or a hydroxyl group with a carbon number of 1 to 4. It is considered that the reactive group (h2) between molecules is realized by the organic antibacterial component being a compound containing a silicon atom that is bonded to the reactive group (h2). or the condensation of -SiOH groups derived from silicon atoms bonded to reactive groups (h2) and active hydrogens (hydroxyl groups, etc.) derived from other compounds in the substrate may thus be able to suppress the The rapid exudation of organic antibacterial ingredients caused by environmental changes such as water immersion or temperature rise makes it easier to maintain the organic antibacterial ingredients in the substrate.

鍵結於1個矽原子之反應性基(h2)之數量為1以上即可,亦可為2或3,較佳為2或3。The number of reactive groups (h2) bonded to one silicon atom may be 1 or more, may be 2 or 3, and is preferably 2 or 3.

作為有機系抗菌成分,較佳為式(k1)所表示之四級銨鹽(以下有時稱為四級銨鹽(K1))。 [化1]

Figure 02_image001
[於式(k1)中, R k1~R k3分別獨立地表示碳數1~30之烴基, R k4及R k5分別獨立地表示碳數1~4之烷基,於存在複數個R k5之情形時,複數個R k5可分別不同, Y k1及Y k2分別獨立地表示單鍵或碳數1~10之二價烴基, A k1及A k2分別獨立地表示水解性基或羥基,於存在複數個A k1之情形時,複數個A k1可分別不同,於存在複數個A k2之情形時,複數個A k2可分別不同, Z k1為水解性基、羥基、碳數1~4之烷基、或式(ki)所表示之基, k3表示1或2, k4表示0~2之整數, k5表示0~10之整數, 於Z k1為水解性基、羥基、或碳數1~4之烷基之情形時,n表示1,於Z k1為式(ki)所表示之基之情形時,n表示2, X表示鹵素原子; [化2]
Figure 02_image003
[於式(ki)中,R k17~R k19分別獨立地表示碳數1~30之烴基,*表示鍵結鍵]] The organic antibacterial component is preferably a quaternary ammonium salt represented by formula (k1) (hereinafter sometimes referred to as a quaternary ammonium salt (K1)). [chemical 1]
Figure 02_image001
[In formula (k1), R k1 to R k3 independently represent a hydrocarbon group with 1 to 30 carbons, R k4 and R k5 independently represent an alkyl group with 1 to 4 carbons, and where there are a plurality of R k5 In this case, a plurality of R k5 may be different, Y k1 and Y k2 independently represent a single bond or a divalent hydrocarbon group with 1 to 10 carbons, A k1 and A k2 independently represent a hydrolyzable group or a hydroxyl group, in presence In the case of a plurality of A k1 , the plurality of A k1 may be different, and in the case of a plurality of A k2 , the plurality of A k2 may be different respectively, and Z k1 is a hydrolyzable group, a hydroxyl group, or an alkane having 1 to 4 carbon atoms group, or a group represented by formula (ki), k3 represents 1 or 2, k4 represents an integer of 0 to 2, k5 represents an integer of 0 to 10, and Z k1 is a hydrolyzable group, a hydroxyl group, or a carbon number of 1 to 4 In the case of an alkyl group, n represents 1, and in the case where Z k1 is a group represented by formula (ki), n represents 2, and X represents a halogen atom;
Figure 02_image003
[In formula (ki), R k17 to R k19 each independently represent a hydrocarbon group with 1 to 30 carbons, and * represents a bond]]

作為R k1~R k3及R k17~R k19所表示之烴基,可為直鏈狀,亦可為支鏈狀,可為脂肪族烴基,亦可為芳香族烴基,又,可為飽和烴基,亦可為不飽和烴基,較佳為直鏈狀或支鏈狀之飽和脂肪族烴基(以下為烷基),更佳為直鏈狀烷基。 The hydrocarbon groups represented by R k1 to R k3 and R k17 to R k19 may be linear or branched, aliphatic or aromatic, or saturated. It may also be an unsaturated hydrocarbon group, preferably a straight-chain or branched saturated aliphatic hydrocarbon group (hereinafter referred to as an alkyl group), more preferably a straight-chain alkyl group.

R k1~R k3及R k17~R k19所表示之烴基之碳數分別獨立為1~30即可,較佳為R k1~R k3中之任一者為長鏈烷基,其餘兩者為短鏈烷基,且R k17~R k19中之任一者為長鏈烷基,其餘兩者為短鏈烷基。 長鏈烷基之主鏈(最長直鏈)之碳數較佳為5以上,更佳為8以上,進而較佳為12以上,又,較佳為25以下,更佳為20以下。 短鏈烷基之主鏈(最長直鏈)之碳數較佳為4以下,更佳為1或2,尤佳為1。 The carbon numbers of the hydrocarbon groups represented by R k1 ~ R k3 and R k17 ~ R k19 are independently 1 to 30, preferably any one of R k1 ~ R k3 is a long-chain alkyl group, and the other two are A short-chain alkyl group, and any one of R k17 to R k19 is a long-chain alkyl group, and the other two are short-chain alkyl groups. The carbon number of the main chain (the longest straight chain) of the long-chain alkyl group is preferably 5 or more, more preferably 8 or more, further preferably 12 or more, and is preferably 25 or less, more preferably 20 or less. The carbon number of the main chain (the longest straight chain) of the short-chain alkyl group is preferably 4 or less, more preferably 1 or 2, and especially preferably 1.

作為R k4、R k5、及Z k1所表示之碳數1~4之烷基,較佳為碳數1~3之烷基,更佳為甲基或乙基,尤佳為甲基。於存在複數個R k5之情形時,複數個R k5可相同,亦可各不相同。 The alkyl group having 1 to 4 carbons represented by R k4 , R k5 , and Z k1 is preferably an alkyl group having 1 to 3 carbons, more preferably methyl or ethyl, and especially preferably methyl. When there are a plurality of R k5 , the plurality of R k5 may be the same or different.

Y k1及Y k2所表示之二價烴基可為直鏈狀,亦可為支鏈狀,可為二價脂肪族烴基,亦可為二價芳香族烴基,又,可為二價飽和烴基,亦可為二價不飽和烴基,較佳為直鏈狀或支鏈狀之二價飽和脂肪族烴基(以下為伸烷基),更佳為直鏈狀伸烷基。Y k1及Y k2所表示之二價烴基之碳數較佳為2以上,又,較佳為8以下,更佳為5以下。 The divalent hydrocarbon groups represented by Y k1 and Y k2 may be linear or branched, divalent aliphatic hydrocarbon groups, divalent aromatic hydrocarbon groups, or divalent saturated hydrocarbon groups, It may also be a divalent unsaturated hydrocarbon group, preferably a linear or branched divalent saturated aliphatic hydrocarbon group (hereinafter referred to as an alkylene group), more preferably a linear chain alkylene group. The carbon number of the divalent hydrocarbon group represented by Y k1 and Y k2 is preferably 2 or more, and preferably 8 or less, more preferably 5 or less.

作為A k1、A k2、及Z k1所表示之水解性基,可例舉:烷氧基、鹵素原子、氰基、乙醯氧基、異氰酸酯基等,較佳為烷氧基或鹵素原子,更佳為碳數1~4之烷氧基,進而較佳為甲氧基或乙氧基。於存在複數個A k1之情形時,複數個A k1可相同,亦可分別不同,較佳為相同。於存在複數個A k2之情形時,複數個A k2可相同,亦可分別不同,較佳為相同。 The hydrolyzable groups represented by A k1 , A k2 , and Z k1 include, for example, alkoxy groups, halogen atoms, cyano groups, acetyloxy groups, isocyanate groups, etc., preferably alkoxy groups or halogen atoms, It is more preferably an alkoxy group having 1 to 4 carbon atoms, and still more preferably a methoxy group or an ethoxy group. When there are a plurality of A k1 , the plurality of A k1 may be the same or different, but are preferably the same. When there are a plurality of A k2 , the plurality of A k2 may be the same or different, but are preferably the same.

作為X所表示之鹵素原子,較佳為氯原子或溴原子,更佳為氯原子。The halogen atom represented by X is preferably a chlorine atom or a bromine atom, more preferably a chlorine atom.

作為R k1~R k3,較佳為R k1~R k3中之任一者為主鏈(最長直鏈)之碳數為5~25(較佳為12~20)之烷基,且其餘兩者為主鏈(最長直鏈)之碳數為1~4(較佳為1~2)之烷基,更佳為R k1~R k3中之任一者為碳數5~25(較佳為12~25)之直鏈狀烷基,且其餘兩者為碳數1~4(較佳為1~2)之直鏈狀烷基。 R k1 to R k3 are preferably alkyl groups with 5 to 25 (preferably 12 to 20) carbon atoms in the main chain (longest straight chain) of any one of R k1 to R k3 , and the other two It is an alkyl group with 1 to 4 (preferably 1 to 2) carbon atoms in the main chain (longest straight chain), more preferably any one of R k1 to R k3 has 5 to 25 carbon atoms (preferably 12-25) straight-chain alkyl, and the other two are straight-chain alkyls with 1-4 carbons (preferably 1-2).

作為R k17~R k19,較佳為R k17~R k19中之任一者為主鏈(最長直鏈)之碳數為5~25(較佳為12~20)之烷基,且其餘兩者為主鏈(最長直鏈)之碳數為1~4(較佳為1~2)之烷基,更佳為R k17~R k19中之任一者為碳數5~25(較佳為12~25)之直鏈狀烷基,且其餘兩者為碳數1~4(較佳為1~2)之直鏈狀烷基。 R k17 to R k19 are preferably alkyl groups having 5 to 25 (preferably 12 to 20) carbon atoms in the main chain (longest straight chain) of any one of R k17 to R k19 , and the other two It is an alkyl group whose main chain (longest straight chain) has 1 to 4 (preferably 1 to 2) carbon atoms, more preferably any one of R k17 to R k19 has 5 to 25 carbon atoms (preferably 12-25) straight-chain alkyl, and the other two are straight-chain alkyls with 1-4 carbons (preferably 1-2).

作為Y k1及Y k2,較佳為分別獨立為單鍵或碳數1~10之伸烷基,更佳為單鍵或碳數1~10之直鏈狀伸烷基,進而較佳為單鍵或碳數2~8之直鏈狀伸烷基,尤佳為單鍵或碳數2~5之直鏈狀伸烷基。 Y k1 and Y k2 are preferably each independently a single bond or an alkylene group having 1 to 10 carbons, more preferably a single bond or a linear alkylene group having 1 to 10 carbons, and still more preferably a single A bond or a straight-chain alkylene group having 2 to 8 carbons, particularly preferably a single bond or a straight-chain alkylene group having 2 to 5 carbons.

A k1及A k2較佳為分別獨立為烷氧基、鹵素原子、或羥基,更佳為烷氧基或羥基,進而較佳為碳數1~4之烷氧基或羥基,尤佳為甲氧基、乙氧基、或羥基。 A k1 and A k2 are preferably an alkoxy group, a halogen atom, or a hydroxyl group independently, more preferably an alkoxy group or a hydroxyl group, further preferably an alkoxy group or a hydroxyl group with 1 to 4 carbon atoms, and especially preferably a methyl group. Oxy, Ethoxy, or Hydroxy.

於Y k2為單鍵且k5為0之情形時,作為Z k1,更佳為水解性基或羥基,進而較佳為甲氧基、乙氧基、或羥基。於Y k2為碳數1~10之二價烴基或k5為1以上之整數之情形時,作為Z k1,較佳為水解性基、羥基、或式(ki)所表示之基,更佳為式(ki)所表示之基。 When Y k2 is a single bond and k5 is 0, Z k1 is more preferably a hydrolyzable group or a hydroxyl group, further preferably a methoxy group, an ethoxy group, or a hydroxyl group. When Y k2 is a divalent hydrocarbon group having 1 to 10 carbon atoms or k5 is an integer of 1 or more, Z k1 is preferably a hydrolyzable group, a hydroxyl group, or a group represented by the formula (ki), more preferably The base represented by the formula (ki).

k3及k4較佳為2。Preferably, k3 and k4 are 2.

k5較佳為0~5之整數,更佳為0或1。k5 is preferably an integer of 0-5, more preferably 0 or 1.

四級銨鹽(K1)更佳為式(k1-1)所表示之化合物。 [化3]

Figure 02_image005
[於式(k1-1)中, R k11~R k16分別獨立地表示碳數1~30之烴基, Y k11及Y k12分別獨立地表示單鍵或碳數1~10之二價烴基, A k11~A k14分別獨立地表示水解性基或羥基,於存在複數個A k13之情形時,複數個A k13可分別不同,於存在複數個A k14之情形時,複數個A k14可分別不同, k13表示0~10之整數, X表示鹵素原子] The quaternary ammonium salt (K1) is more preferably a compound represented by formula (k1-1). [Chem 3]
Figure 02_image005
[In formula (k1-1), R k11 to R k16 independently represent a hydrocarbon group with 1 to 30 carbons, Y k11 and Y k12 independently represent a single bond or a divalent hydrocarbon group with 1 to 10 carbons, A k11 to A k14 each independently represent a hydrolyzable group or a hydroxyl group. When there are a plurality of A k13 , the plurality of A k13 may be different, and when there are a plurality of A k14 , the plurality of A k14 may be different, k13 represents an integer from 0 to 10, and X represents a halogen atom]

作為R k11~R k16所表示之碳數1~30之烴基,可例舉與作為R k1~R k3及R k17~R k19所表示之碳數1~30之烴基所說明之基同樣之基,其較佳之態樣亦相同。 Examples of the hydrocarbon groups having 1 to 30 carbon atoms represented by R k11 to R k16 include the same groups as those described for the hydrocarbon groups having 1 to 30 carbon atoms represented by R k1 to R k3 and R k17 to R k19 , and its better form is also the same.

作為Y k11及Y k12所表示之碳數1~10之二價烴基,可例舉與作為Y k1及Y k2所表示之碳數1~10之二價烴基所說明之基同樣之基,其較佳之態樣亦相同。 The divalent hydrocarbon groups having 1 to 10 carbon atoms represented by Y k11 and Y k12 include the same groups as those described for the divalent hydrocarbon groups having 1 to 10 carbon atoms represented by Y k1 and Y k2 . The better form is the same.

作為A k11~A k14所表示之水解性基,可例舉與作為A k1、A k2、及Z k1所表示之水解性基所說明之基同樣之基,其較佳之態樣亦相同。 Examples of the hydrolyzable groups represented by A k11 to A k14 include the same groups as those described for the hydrolyzable groups represented by A k1 , A k2 , and Z k1 , and preferred embodiments are also the same.

X所表示之鹵素原子與上述相同。The halogen atom represented by X is the same as above.

作為R k11~R k13,較佳為R k11~R k13中之任一者為主鏈(最長直鏈)之碳數為5~25(較佳為12~20)之烷基,且其餘兩者為主鏈(最長直鏈)之碳數為1~4(較佳為1~2)之烷基,更佳為R k11~R k13中之任一者為碳數5~25(較佳為12~25)之直鏈狀烷基,且其餘兩者為碳數1~4(較佳為1~2)之直鏈狀烷基。 R k11 to R k13 are preferably alkyl groups with 5 to 25 (preferably 12 to 20) carbon atoms in the main chain (longest straight chain) of any one of R k11 to R k13 , and the other two It is an alkyl group with 1 to 4 (preferably 1 to 2) carbon atoms in the main chain (longest straight chain), more preferably any one of R k11 to R k13 has 5 to 25 carbon atoms (preferably 12-25) straight-chain alkyl, and the other two are straight-chain alkyls with 1-4 carbons (preferably 1-2).

作為R k14~R k16,較佳為R k14~R k16中之任一者為主鏈(最長直鏈)之碳數為5~25(較佳為12~20)之烷基,且其餘兩者為主鏈(最長直鏈)之碳數為1~4(較佳為1~2)之烷基,更佳為R k14~R k16中之任一者為碳數5~25(較佳為12~25)之直鏈狀烷基,且其餘兩者為碳數1~4(較佳為1~2)之直鏈狀烷基。 R k14 to R k16 are preferably alkyl groups with 5 to 25 (preferably 12 to 20) carbon atoms in the main chain (longest straight chain) of any one of R k14 to R k16 , and the other two It is an alkyl group with 1 to 4 (preferably 1 to 2) carbon atoms in the main chain (longest straight chain), more preferably any one of R k14 to R k16 has 5 to 25 carbon atoms (preferably 12-25) straight-chain alkyl, and the other two are straight-chain alkyls with 1-4 carbons (preferably 1-2).

A k11~A k14較佳為分別獨立為烷氧基、鹵素原子、或羥基,更佳為烷氧基或羥基,進而較佳為碳數1~4之烷氧基或羥基,尤佳為全部為羥基。 A k11 to A k14 are preferably independently alkoxy groups, halogen atoms, or hydroxyl groups, more preferably alkoxy groups or hydroxyl groups, further preferably alkoxy groups or hydroxyl groups with 1 to 4 carbon atoms, especially preferably all of them For hydroxyl.

作為Y k11及Y k12,較佳為分別獨立為單鍵或碳數1~10之伸烷基,更佳為單鍵或碳數1~10之直鏈狀伸烷基,尤佳為單鍵。 Y k11 and Y k12 are preferably each independently a single bond or an alkylene group having 1 to 10 carbons, more preferably a single bond or a linear alkylene group having 1 to 10 carbons, particularly preferably a single bond .

k13較佳為0~5之整數,更佳為0或1,進而較佳為1。k13 is preferably an integer of 0-5, more preferably 0 or 1, still more preferably 1.

四級銨鹽(K1)亦更佳為式(k1-2)所表示之化合物。 [化4]

Figure 02_image007
[於式(k1-2)中, R k21~R k23分別獨立地表示碳數1~30之烴基, R k24表示碳數1~4之烷基,於存在複數個R k24之情形時,複數個R k24可分別不同, Y k21表示單鍵或碳數1~10之二價烴基, A k21表示水解性基或羥基,於存在複數個A k21之情形時,複數個A k21可分別不同, k21表示1~3之整數, X表示鹵素原子] The quaternary ammonium salt (K1) is also more preferably a compound represented by formula (k1-2). [chemical 4]
Figure 02_image007
[In formula (k1-2), R k21 ~ R k23 independently represent a hydrocarbon group with 1 to 30 carbons, R k24 represents an alkyl group with 1 to 4 carbons, and when there are a plurality of R k24 , the plural Each R k24 may be different, Y k21 represents a single bond or a divalent hydrocarbon group having 1 to 10 carbons, A k21 represents a hydrolyzable group or a hydroxyl group, and when there are multiple A k21s , the multiple A k21s may be different, k21 represents an integer of 1 to 3, X represents a halogen atom]

作為R k21~R k23所表示之碳數1~30之烴基,可例舉與作為R k1~R k3及R k17~R k19所表示之碳數1~30之烴基所說明之基同樣之基,其較佳之態樣亦相同。 Examples of the hydrocarbon groups having 1 to 30 carbon atoms represented by R k21 to R k23 include the same groups as those described for the hydrocarbon groups having 1 to 30 carbon atoms represented by R k1 to R k3 and R k17 to R k19 , and its better form is also the same.

作為R k24所表示之碳數1~4之烷基,可例舉與作為R k4、R k5、及Z k1所表示之碳數1~4之烷基所說明之基同樣之基,其較佳之態樣亦相同。 The alkyl group having 1 to 4 carbon atoms represented by R k24 may, for example, be the same group as described for the alkyl group having 1 to 4 carbon atoms represented by R k4 , R k5 , and Z k1 . The good looks are the same.

作為Y k21所表示之碳數1~10之二價烴基,可例舉與作為Y k1及Y k2所表示之碳數1~10之二價烴基所說明之基同樣之基,其較佳之態樣亦相同。 As the divalent hydrocarbon group having 1 to 10 carbon atoms represented by Y k21 , the same group as described as the divalent hydrocarbon group having 1 to 10 carbon atoms represented by Y k1 and Y k2 can be exemplified, and its preferred form The same is true.

作為A k21所表示之水解性基,可例舉與作為A k1、A k2、及Z k1所表示之水解性基所說明之基同樣之基,其較佳之態樣亦相同。 Examples of the hydrolyzable group represented by A k21 include the same groups as those described as the hydrolyzable groups represented by A k1 , A k2 , and Z k1 , and preferred embodiments are also the same.

X所表示之鹵素原子與上述相同。The halogen atom represented by X is the same as above.

作為R k21~R k23,較佳為R k21~R k23中之任一者為主鏈(最長直鏈)之碳數為5~25(較佳為12~20)之烷基,且其餘兩者為主鏈(最長直鏈)之碳數為1~4(較佳為1~2)之烷基,更佳為R k21~R k23中之任一者為碳數5~25(較佳為12~25)之直鏈狀烷基,且其餘兩者為碳數1~4(較佳為1~2)之直鏈狀烷基。 R k21 to R k23 are preferably alkyl groups with 5 to 25 (preferably 12 to 20) carbon atoms in the main chain (longest straight chain) of any one of R k21 to R k23 , and the other two It is an alkyl group with 1 to 4 (preferably 1 to 2) carbon atoms in the main chain (longest straight chain), more preferably any one of R k21 to R k23 is 5 to 25 carbon atoms (preferably 12-25) straight-chain alkyl, and the other two are straight-chain alkyls with 1-4 carbons (preferably 1-2).

A k21較佳為分別獨立為烷氧基、鹵素原子、或羥基,更佳為烷氧基或羥基,進而較佳為碳數1~4之烷氧基或羥基,尤佳為甲氧基或乙氧基。 A k21 is preferably an alkoxy group, a halogen atom, or a hydroxyl group independently, more preferably an alkoxy group or a hydroxyl group, further preferably an alkoxy group or a hydroxyl group with 1 to 4 carbon atoms, especially preferably a methoxy group or Ethoxy.

k21較佳為2或3,更佳為3。k21 is preferably 2 or 3, more preferably 3.

作為Y k21,較佳為單鍵或碳數1~10之伸烷基,更佳為單鍵或碳數1~10之直鏈狀伸烷基,進而較佳為單鍵或碳數2~8(尤其是碳數2~5)之直鏈狀伸烷基,尤佳為碳數2~5之直鏈狀伸烷基。 Y k21 is preferably a single bond or an alkylene group having 1 to 10 carbons, more preferably a single bond or a linear alkylene group having 1 to 10 carbons, and further preferably a single bond or an alkylene group having 2 to 10 carbons. 8 (especially C2-5) straight-chain alkylene group, especially preferably C2-5 straight-chain alkylene group.

作為四級銨鹽(K1),較佳為至少使用式(k1-1)所表示之化合物及/或式(k1-2)所表示之化合物。As the quaternary ammonium salt (K1), it is preferable to use at least the compound represented by the formula (k1-1) and/or the compound represented by the formula (k1-2).

上述抗菌成分(K)包含於基材(s)中即可,於基材(s)為2層以上之多層之情形時,包含於任一層中即可,亦可包含於全部層中。尤其是於基材(s)包含層(s1)及層(s2)之情形時,抗菌成分(K)較佳為包含於積層於撥水層(r)側之層(s2)中,更佳為包含於層(s2)所包含之硬塗層(hc)中。The above-mentioned antibacterial component (K) may be included in the base material (s), and when the base material (s) has two or more layers, it may be included in any layer, or may be included in all layers. Especially when the substrate (s) includes a layer (s1) and a layer (s2), the antibacterial component (K) is preferably contained in the layer (s2) laminated on the side of the water-repellent layer (r), more preferably is included in the hard coat layer (hc) included in the layer (s2).

抗菌成分(K)之含量於基材(s)100質量%中,較佳為0.001質量%以上,更佳為0.005質量%以上,進而較佳為0.01質量%以上,又,較佳為50質量%以下,更佳為10質量%以下。又,於基材(s)包含層(s1)及層(s2)之情形時,可將層(s1)及層(s2)之兩層中之抗菌成分(K)之含量調整為上述範圍,較佳為將其中任一層中之抗菌成分(K)之含量調整為上述範圍,尤佳為將層(s2)中之抗菌成分(K)之含量調整為上述範圍。 尤其是於抗菌成分(K)為無機系抗菌成分之情形時,無機系抗菌成分之含量於基材(s)100質量%中,較佳為0.001質量%以上,更佳為0.005質量%以上,進而較佳為0.01質量%以上,又,較佳為50質量%以下,更佳為10質量%以下,進而較佳為5質量%以下。又,於基材(s)包含層(s1)及層(s2)之情形時,可將層(s1)及層(s2)之兩層中之無機系抗菌成分之含量調整為上述範圍,較佳為將其中任一層中之無機系抗菌成分之含量調整為上述範圍,尤佳為將層(s2)中之無機系抗菌成分之含量調整為上述範圍。 又,於抗菌成分(K)為有機系抗菌成分之情形時,有機系抗菌成分之含量於基材(s)100質量%中,較佳為0.001質量%以上,更佳為0.005質量%以上,進而較佳為0.01質量%以上,尤佳為0.1質量%以上,又,較佳為50質量%以下,更佳為25質量%以下,進而較佳為10質量%以下。又,於基材(s)包含層(s1)及層(s2)之情形時,可將層(s1)及層(s2)之兩層中之有機系抗菌成分之含量調整為上述範圍,較佳為將其中任一層中之有機系抗菌成分之含量調整為上述範圍,尤佳為將層(s2)中之有機系抗菌成分之含量調整為上述範圍。 The content of the antibacterial component (K) is preferably at least 0.001 mass %, more preferably at least 0.005 mass %, further preferably at least 0.01 mass %, and preferably 50 mass % in 100 mass % of the substrate (s). % or less, more preferably 10 mass % or less. Also, when the substrate (s) includes the layer (s1) and the layer (s2), the content of the antibacterial component (K) in the two layers of the layer (s1) and the layer (s2) can be adjusted to the above range, It is preferable to adjust the content of the antibacterial component (K) in any one of the layers to the above-mentioned range, and it is especially preferable to adjust the content of the antibacterial component (K) in the layer (s2) to the above-mentioned range. Especially when the antibacterial component (K) is an inorganic antibacterial component, the content of the inorganic antibacterial component in 100% by mass of the substrate (s), preferably 0.001% by mass or more, more preferably 0.005% by mass or more, Furthermore, it is more preferably at least 0.01% by mass, and more preferably at most 50% by mass, more preferably at most 10% by mass, and still more preferably at most 5% by mass. Also, when the base material (s) comprises a layer (s1) and a layer (s2), the content of the inorganic antibacterial components in the two layers of the layer (s1) and the layer (s2) can be adjusted to the above-mentioned range. Preferably, the content of the inorganic antibacterial component in any one of the layers is adjusted to the above-mentioned range, and it is especially preferable to adjust the content of the inorganic antibacterial component in the layer (s2) to the above-mentioned range. Also, when the antibacterial component (K) is an organic antibacterial component, the content of the organic antibacterial component in 100% by mass of the substrate (s), preferably 0.001% by mass or more, more preferably 0.005% by mass or more, Furthermore, it is preferably at least 0.01% by mass, especially preferably at least 0.1% by mass, and is preferably at most 50% by mass, more preferably at most 25% by mass, and still more preferably at most 10% by mass. Also, when the base material (s) includes the layer (s1) and the layer (s2), the content of the organic antibacterial components in the two layers of the layer (s1) and the layer (s2) can be adjusted to the above-mentioned range, compared with Preferably, the content of the organic antibacterial component in any one of the layers is adjusted to the above-mentioned range, and it is especially preferable to adjust the content of the organic antibacterial component in the layer (s2) to the above-mentioned range.

又,除了抗菌成分(K)以外,亦較佳為於基材(s)中分散無機粒子、有機粒子、橡膠粒子,又,亦可使其含有如顏料或染料之著色劑、螢光增白劑、分散劑、塑化劑、熱穩定劑、光穩定劑、紅外線吸收劑、紫外線吸收劑、抗靜電劑、抗氧化劑、潤滑劑、溶劑等調配劑。Also, in addition to the antibacterial component (K), it is also preferable to disperse inorganic particles, organic particles, and rubber particles in the substrate (s), and it may also contain coloring agents such as pigments or dyes, fluorescent whitening Agents, dispersants, plasticizers, heat stabilizers, light stabilizers, infrared absorbers, ultraviolet absorbers, antistatic agents, antioxidants, lubricants, solvents and other formulations.

作為基材(s),可使用市售品,例如可例舉:Hydro Ag +抗菌膜(FUJIFILM股份有限公司製造)、Daicel抗病毒硬塗膜S BV01、Daicel抗病毒硬塗膜S BV02(Daicel股份有限公司製造)等。 As the substrate (s), commercially available products can be used, for example: Hydro Ag + Antibacterial Film (manufactured by FUJIFILM Co., Ltd.), Daicel Antiviral Hard Coat S BV01, Daicel Antiviral Hard Coat S BV02 (Daicel Co., Ltd.), etc.

1-2.撥水層(r) 撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)之硬化層。藉由撥水層(r)為有機矽化合物(A)之硬化層,即便為薄膜亦可賦予良好之撥水性,較佳為即便為薄膜,亦可賦予良好之撥水性、以及耐磨耗性及耐擦傷性等耐久性。有機矽化合物(A)之硬化層通常藉由塗佈有機矽化合物(A)之混合組合物並使其硬化而獲得,即可認為撥水層(r)為有機矽化合物(A)之混合組合物之硬化層。以下,存在將有機矽化合物(A)之混合組合物稱為撥水層形成用組合物之情形。 1-2. Water-repellent layer (r) The water-repellent layer (r) is a cured layer of an organosilicon compound (A) having a silicon atom to which a hydrolyzable group or a hydroxyl group is bonded via a linking group or not via a linking group. Since the water-repellent layer (r) is a hardened layer of the organosilicon compound (A), good water-repellency can be imparted even if it is a thin film, and it is preferable that good water-repellency and abrasion resistance can be imparted even if it is a thin film and durability such as scratch resistance. The hardened layer of organosilicon compound (A) is usually obtained by coating a mixed composition of organosilicon compound (A) and hardening it. It can be considered that the water-repellent layer (r) is a mixed combination of organosilicon compound (A) hardened layer. Hereinafter, the mixed composition of the organosilicon compound (A) may be referred to as the composition for water-repellent layer formation.

如上所述,撥水層(r)為有機矽化合物(A)之混合組合物之硬化層,因此撥水層(r)具有源自有機矽化合物(A)之結構。有機矽化合物(A)具有鍵結於矽原子(亦可經由連結基而鍵結)之水解性基或羥基,於硬化時,有機矽化合物(A)所具有之-SiOH基或水解產生之有機矽化合物(A)之-SiOH基(亦可Si與OH經由連結基鍵結)與源自有機矽化合物(A)之-SiOH基(亦可Si與OH經由連結基鍵結)、源自其他化合物之-SiOH基、或積層體中供形成撥水層(r)之面之活性氫(羥基等)脫水縮合。因此,撥水層(r)較佳為具有源自有機矽化合物(A)之縮合結構。As mentioned above, the water-repellent layer (r) is a hardened layer of the mixed composition of the organosilicon compound (A), so the water-repellent layer (r) has a structure derived from the organosilicon compound (A). The organosilicon compound (A) has a hydrolyzable group or a hydroxyl group bonded to a silicon atom (it can also be bonded through a linking group). When hardening, the -SiOH group possessed by the organosilicon compound (A) or the organic The -SiOH group of the silicon compound (A) (Si and OH can also be bonded through a linking group) and the -SiOH group derived from the organosilicon compound (A) (Si and OH can also be bonded through a linking group), derived from other The -SiOH group of the compound, or the active hydrogen (hydroxyl group, etc.) on the surface forming the water-repellent layer (r) in the laminate is dehydrated and condensed. Therefore, the water-repellent layer (r) preferably has a condensation structure derived from the organosilicon compound (A).

1-2-1.有機矽化合物(A) 有機矽化合物(A)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基(以下將兩者合併稱為反應性基(h3))之矽原子之化合物。上述反應性基(h3)具有如下作用:經由水解、脫水縮合反應,有機矽化合物(A)彼此、有機矽化合物(A)與其他單體、或有機矽化合物(A)與塗佈撥水層形成用組合物之面之活性氫(羥基等)一起經由縮合反應而鍵結。作為上述水解性基,可例舉:烷氧基、鹵素原子、氰基、乙醯氧基、異氰酸酯基等。上述反應性基(h3)較佳為烷氧基或鹵素原子,更佳為碳數1~4之烷氧基或氯原子,尤佳為甲氧基或乙氧基。 1-2-1. Organosilicon compound (A) The organosilicon compound (A) is a compound having a silicon atom to which a hydrolyzable group or a hydroxyl group (hereinafter collectively referred to as a reactive group (h3)) is bonded via a linking group or not. The above-mentioned reactive group (h3) has the following functions: through hydrolysis and dehydration condensation reaction, organosilicon compound (A) and other monomers, or organosilicon compound (A) and coated water-repellent layer The active hydrogen (hydroxyl group, etc.) of the surface forming composition is bonded together through condensation reaction. As said hydrolyzable group, an alkoxy group, a halogen atom, a cyano group, an acetyloxy group, an isocyanate group etc. are mentioned. The above-mentioned reactive group (h3) is preferably an alkoxy group or a halogen atom, more preferably an alkoxy group with 1-4 carbon atoms or a chlorine atom, especially preferably a methoxy group or an ethoxy group.

有機矽化合物(A)較佳為除了上述矽原子以外還含有氟元素,更佳為包含氟聚醚結構。上述氟聚醚結構亦可稱為氟氧伸烷基,意指兩端為氧原子之結構。藉由有機矽化合物(A)包含氟聚醚結構,撥水性或撥油性等撥液性變得更良好。氟聚醚結構較佳為全氟聚醚結構。氟聚醚結構之最長之直鏈部分所含之碳數例如較佳為5以上,更佳為10以上,進而更佳為20以上。上述碳數之上限並無特別限定,例如為200,較佳為150。上述有機矽化合物(A)1分子中之矽原子之數量較佳為1~10,更佳為1~6。The organosilicon compound (A) preferably contains fluorine in addition to the above-mentioned silicon atoms, and more preferably contains a fluoropolyether structure. The above-mentioned fluoropolyether structure can also be called a fluorooxyalkylene group, which means a structure with oxygen atoms at both ends. When the organosilicon compound (A) contains a fluoropolyether structure, liquid repellency such as water repellency or oil repellency becomes better. The fluoropolyether structure is preferably a perfluoropolyether structure. The number of carbon atoms contained in the longest linear portion of the fluoropolyether structure is, for example, preferably 5 or more, more preferably 10 or more, and even more preferably 20 or more. The upper limit of the above-mentioned carbon number is not particularly limited, for example, it is 200, preferably 150. The number of silicon atoms in 1 molecule of the organosilicon compound (A) is preferably 1-10, more preferably 1-6.

於有機矽化合物(A)包含氟聚醚結構、矽原子及反應性基(h3)之態樣中,較佳為於鍵結鍵側之末端具有氟聚醚結構之氧原子之一價基(以下稱為FPE基)與矽原子經由連結基或不經由連結基鍵結,且矽原子與反應性基(h3)經由連結基或不經由連結基鍵結。於上述FPE基與矽原子經由連結基鍵結之情形時,上述反應性基(h3)經由連結基或不經由連結基所鍵結之矽原子可於有機矽化合物(A)之一分子中存在1或複數個,其數量例如為1以上、10以下。In the aspect where the organosilicon compound (A) includes a fluoropolyether structure, a silicon atom, and a reactive group (h3), it is preferable to have one of the valent groups of the oxygen atom of the fluoropolyether structure at the end of the bonding bond side ( Hereinafter referred to as FPE group) and the silicon atom are bonded via a linking group or not, and the silicon atom and the reactive group (h3) are bonded via a linking group or not. In the case where the above-mentioned FPE group and the silicon atom are bonded via a linking group, the silicon atom bonded to the above-mentioned reactive group (h3) via a linking group or not via a linking group may exist in a molecule of the organosilicon compound (A) 1 or plural, and the number is, for example, 1 or more and 10 or less.

上述FPE基可為直鏈狀,亦可具有側鏈,較佳為具有側鏈。作為具有側鏈之態樣,尤佳為FPE基中之氟聚醚結構具有側鏈。較佳為具有氟烷基作為側鏈,該氟烷基更佳為全氟烷基,進而較佳為三氟甲基。將上述FPE基與矽原子連結之連結基之碳數例如為1以上、20以下,較佳為2以上、15以下。上述FPE基較佳為於末端具有氟烷基之含氟基與全氟聚醚結構直接鍵結之基。含氟基可為氟烷基,亦可為於氟烷基鍵結二價芳香族烴基等連結基而成之基,較佳為氟烷基。該氟烷基較佳為全氟烷基,更佳為碳數1~20之全氟烷基。The above-mentioned FPE group may be linear or may have a side chain, but preferably has a side chain. As an aspect having a side chain, it is particularly preferable that the fluoropolyether structure in the FPE group has a side chain. It preferably has a fluoroalkyl group as a side chain, and the fluoroalkyl group is more preferably a perfluoroalkyl group, further preferably a trifluoromethyl group. The carbon number of the linking group linking the FPE group and the silicon atom is, for example, 1 to 20, preferably 2 to 15. The above-mentioned FPE group is preferably a group in which a fluorine-containing group having a fluoroalkyl group at the end is directly bonded to a perfluoropolyether structure. The fluorine-containing group may be a fluoroalkyl group, or a group formed by bonding a divalent aromatic hydrocarbon group to the fluoroalkyl group, and is preferably a fluoroalkyl group. The fluoroalkyl group is preferably a perfluoroalkyl group, more preferably a perfluoroalkyl group having 1 to 20 carbon atoms.

作為上述含氟基,例如可例舉:CF 3(CF 2) p-(p例如為1~19,較佳為1~10)、CF 3(CF 2) m-(CH 2) n-、CF 3(CF 2) m-C 6H 4-(m均為1~10,較佳為3~7,n均為1~5,較佳為2~4),較佳為CF 3(CF 2) p-或CF 3(CF 2) m-(CH 2) n-。 Examples of the fluorine-containing group include: CF 3 (CF 2 ) p - (p is, for example, 1 to 19, preferably 1 to 10), CF 3 (CF 2 ) m -(CH 2 ) n -, CF 3 (CF 2 ) m -C 6 H 4 -(m is 1-10, preferably 3-7, n is 1-5, preferably 2-4), preferably CF 3 (CF 2 ) p - or CF 3 (CF 2 ) m -(CH 2 ) n -.

上述反應性基(h3)可經由連結基鍵結於矽原子,亦可不經由連結基直接鍵結於矽原子,較佳為直接鍵結於矽原子。鍵結於1個矽原子之反應性基(h3)之數量為1個以上即可,可為2或3,較佳為2或3,尤佳為3。於鍵結於1個矽原子之反應性基(h3)之數量為2以下之情形時,可於其餘鍵結鍵鍵結有反應性基(h3)以外之一價基,例如可鍵結烷基(尤其是碳數為1~4之烷基)、H、NCO等。The above-mentioned reactive group (h3) may be bonded to the silicon atom through a linking group, or may be directly bonded to the silicon atom without a linking group, and is preferably directly bonded to the silicon atom. The number of reactive groups (h3) bonded to one silicon atom may be at least one, and may be 2 or 3, preferably 2 or 3, and especially preferably 3. When the number of reactive groups (h3) bonded to one silicon atom is 2 or less, a valent group other than the reactive group (h3) may be bonded to the remaining bonds, for example, an alkane may be bonded group (especially an alkyl group with 1 to 4 carbon atoms), H, NCO, etc.

上述有機矽化合物(A)較佳為下述式(a1)所表示之化合物。The organosilicon compound (A) is preferably a compound represented by the following formula (a1).

[化5]

Figure 02_image009
於上述式(a1)中, Rf a26、Rf a27、Rf a28、及Rf a29分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之氟化烷基或氟原子,於存在複數個Rf a26之情形時,複數個Rf a26可分別不同,於存在複數個Rf a27之情形時,複數個Rf a27可分別不同,於存在複數個Rf a28之情形時,複數個Rf a28可分別不同,於存在複數個Rf a29之情形時,複數個Rf a29可分別不同, R 25及R 26分別獨立為氫原子、鹵素原子、碳數1~4之烷基、或1個以上之氫原子被取代為鹵素原子之碳數1~4之鹵化烷基,鍵結於一個碳原子之R 25及R 26之至少一者為氫原子,於存在複數個R 25之情形時,複數個R 25可分別不同,於存在複數個R 26之情形時,複數個R 26可分別不同, R 27及R 28分別獨立為氫原子、碳數1~4之烷基、或單鍵,於存在複數個R 27之情形時,複數個R 27可分別不同,於存在複數個R 28之情形時,複數個R 28可分別不同, R 29及R 30分別獨立為碳數1~20之烷基,於存在複數個R 29之情形時,複數個R 29可分別不同,於存在複數個R 30之情形時,複數個R 30可分別不同, M 7為-O-、-C(=O)-O-、-O-C(=O)-、-NR-、-NRC(=O)-、-C(=O)NR-、-CH=CH-、或-C 6H 4-(伸苯基),上述R為氫原子、碳數1~4之烷基或碳數1~4之含氟烷基,於存在複數個M 7之情形時,複數個M 7可分別不同, M 5為氫原子、氟原子或碳數1~4之烷基,於存在複數個M 5之情形時,複數個M 5可分別不同, M 10為氫原子、或鹵素原子, M 8及M 9分別獨立為水解性基、羥基、或-(CH 2) e7-Si(OR 14) 3,e7為1~5,R 14為甲基或乙基,於存在複數個M 8之情形時,複數個M 8可分別不同,於存在複數個M 9之情形時,複數個M 9可分別不同, f21、f22、f23、f24、及f25分別獨立為0~600之整數,f21、f22、f23、f24、及f25之合計值為13以上, f26為0~20之整數, f27分別獨立為0~2之整數, g21為1~3之整數,g22為0~2之整數,且g21+g22≦3, g31為1~3之整數,g32為0~2之整數,且g31+g32≦3, 關於M 10-、-Si(M 9) g31(H) g32(R 30) 3 g31 g32、f21個-{C(R 25)(R 26)}-單元(U a1)、f22個-{C(Rf a26)(Rf a27)}-單元(U a2)、f23個-{Si(R 27)(R 28)}-單元(U a3)、f24個-{Si(Rf a28)(Rf a29)}-單元(U a4)、f25個-M 7-單元(U a5)、及f26個-[C(M 5){(CH 2) f27-Si(M 8) g21(H) g22(R 29) 3 g21 g22}]-單元(U a6),M 10-為式(a1)中之一個末端、-Si(M 9) g31(H) g32(R 30) 3 g31 g32為另一個末端,以於至少一部分形成氟聚醚結構之順序排列,只要-O-不與-O-連續,則各單元以任意順序排列而鍵結。以任意順序排列而鍵結意味著不限定於各重複單元相連而以如上述式(a1)所記載之順序排列之含義,又,意味著無需f21個單元(U a1)連續鍵結,中途亦可介隔其他單元而鍵結,只要合計為f21個即可。以f22~f26括住之單元(U a2)~(U a6)亦同樣如此。 [chemical 5]
Figure 02_image009
In the above formula (a1), Rf a26 , Rf a27 , Rf a28 , and Rf a29 are each independently a fluorinated alkyl group with 1 to 20 carbon atoms or a fluorine atom in which one or more hydrogen atoms are replaced by fluorine atoms. When there is a plurality of Rf a26 , the plurality of Rf a26 can be different, and when there is a plurality of Rf a27 , the plurality of Rf a27 can be different, and when there is a plurality of Rf a28 , the plurality of Rf a28 can be different. They are different. When there are multiple Rf a29s , the multiple Rf a29s can be different. R 25 and R 26 are independently a hydrogen atom, a halogen atom, an alkyl group with 1 to 4 carbon atoms, or one or more hydrogen atoms A halogenated alkyl group with 1 to 4 carbon atoms whose atom is replaced by a halogen atom. At least one of R25 and R26 bonded to a carbon atom is a hydrogen atom. When there are multiple R25s, the multiple R25 25 can be different respectively. When there are multiple R 26 , the multiple R 26 can be different respectively. R 27 and R 28 are independently a hydrogen atom, an alkyl group with 1 to 4 carbons, or a single bond. In the case of one R 27 , the plurality of R 27 may be different, and in the case of a plurality of R 28 , the plurality of R 28 may be different, R 29 and R 30 are independently an alkyl group with 1 to 20 carbons, When there are a plurality of R 29 , the plurality of R 29 may be different, and in the case of a plurality of R 30 , the plurality of R 30 may be different, M 7 is -O-, -C(=O)- O-, -OC(=O)-, -NR-, -NRC(=O)-, -C(=O)NR-, -CH=CH-, or -C 6 H 4 -(phenylene) , the above R is a hydrogen atom, an alkyl group with 1 to 4 carbons, or a fluorine-containing alkyl group with 1 to 4 carbons. When there are multiple M 7 s, the multiple M 7 can be different, and M 5 is a hydrogen atom , a fluorine atom or an alkyl group with 1 to 4 carbons, when there are multiple M5s , the multiple M5s can be different, M10 is a hydrogen atom or a halogen atom, M8 and M9 are independently hydrolyzed Native group, hydroxyl group, or -(CH 2 ) e7 -Si(OR 14 ) 3 , where e7 is 1 to 5, R 14 is methyl or ethyl, when there are multiple M 8 s, the multiple M 8 can be are different, when there are multiple M9s , the multiple M9s can be different respectively, f21, f22, f23, f24, and f25 are independently integers from 0 to 600, f21, f22, f23, f24, and f25 The total value is 13 or more, f26 is an integer from 0 to 20, f27 is an integer from 0 to 2 independently, g21 is an integer from 1 to 3, g22 is an integer from 0 to 2, and g21+g22≦3, g31 is 1 to 2 Integer of 3, g32 is an integer of 0 to 2, and g31+g32≦3, Regarding M 10 -, -Si(M 9 ) g31 (H) g32 (R 30 ) 3 - g31 - g32 , f21-{C(R 25 )(R 26 )}-unit (U a1 ), f22- {C(Rf a26 )(Rf a27 )}-unit (U a2 ), f23-{Si(R 27 )(R 28 )}-unit (U a3 ), f24-{Si(Rf a28 )(Rf a29 )}-unit (U a4 ), f25-M 7 -unit (U a5 ), and f26-[C(M 5 ){(CH 2 ) f27 -Si(M 8 ) g21 (H) g22 ( R 29 ) 3 g21 g22 }]-unit (U a6 ), M 10 -is one of the terminals in formula (a1), -Si(M 9 ) g31 (H) g32 (R 30 ) 3 g31 g32 The other terminal is arranged in the order that at least a part of the fluoropolyether structure is formed, and as long as -O- and -O- are not consecutive, each unit can be arranged in any order and bonded. Arranging the bonds in any order means not being limited to the meaning that the repeating units are connected but arranged in the order described in the above formula (a1), and also means that there is no need for f21 units (U a1 ) to be bonded continuously, and also in the middle They may be bonded through other units, as long as the total number is f21. The same is true for the units (U a2 )-(U a6 ) enclosed by f22-f26.

又,於R 27及R 28之至少一者為單鍵之情形時,以f23括住之單元之單鍵部分與M 7中之-O-可重複鍵結而形成支鏈狀或環狀之矽氧烷鍵。 Also, when at least one of R 27 and R 28 is a single bond, the single bond part of the unit enclosed by f23 and -O- in M 7 can be repeatedly bonded to form a branched or cyclic siloxane bond.

Rf a26、Rf a27、Rf a28、及Rf a29較佳為分別獨立為氟原子、或1個以上之氫原子被取代為氟原子之碳數1~2之氟化烷基,更佳為氟原子、或全部氫原子被取代為氟原子之碳數1~2之氟化烷基。 R 25及R 26較佳為分別獨立為氫原子、或氟原子,鍵結於一個碳原子之R 25及R 26之至少一者為氫原子,更佳為均為氫原子。 R 27及R 28較佳為分別獨立為氫原子、或碳數1~2之烷基,更佳為全部為氫原子。 R 29及R 30較佳為碳數1~5之烷基,更佳為碳數1~2之烷基。 M 7較佳為為-C(=O)-O-、-O-、-O-C(=O)-,更佳為全部為-O-。 M 5較佳為氫原子或碳數1~2之烷基,更佳為全部為氫原子。 M 10較佳為氟原子。 M 8及M 9較佳為分別獨立為烷氧基、鹵素原子,更佳為甲氧基、乙氧基、氯原子,尤佳為甲氧基、或乙氧基。 較佳為f21、f23、及f24分別為f22之1/2以下,更佳為1/4以下,進而較佳為f23或f24為0,尤佳為f23及f24為0。 f25較佳為f21、f22、f23、f24之合計值之1/5以上,為f21、f22、f23、f24之合計值以下。 f21較佳為0~20,更佳為0~15,進而較佳為1~15,尤佳為2~10。f22較佳為5~600,更佳為8~600,進而較佳為20~200,進而更佳為30~200,進而更佳為35~180,最佳為40~180。f23及f24較佳為0~5,更佳為0~3,進而較佳為0。f25較佳為4~600,更佳為4~200,進而較佳為10~200,進而更佳為30~60。f21、f22、f23、f24、f25之合計值較佳為20~600,更佳為20~250,進而較佳為50~230。f26較佳為0~18,更佳為0~15,進而較佳為0~10,進而更佳為0~5。f27較佳為0~1,更佳為0。g21及g31較佳為分別獨立為2~3,更佳為3。g22及g32較佳為分別獨立為0或1,更佳為0。g21+g22及g31+g32較佳為3。 Rf a26 , Rf a27 , Rf a28 , and Rf a29 are each independently preferably a fluorine atom, or a C1-2 fluorinated alkyl group in which one or more hydrogen atoms are replaced by fluorine atoms, more preferably a fluorine atom , or a fluorinated alkyl group having 1 to 2 carbon atoms in which all hydrogen atoms are substituted by fluorine atoms. R 25 and R 26 are preferably independently hydrogen atoms or fluorine atoms, and at least one of R 25 and R 26 bonded to a carbon atom is a hydrogen atom, more preferably both are hydrogen atoms. R 27 and R 28 are preferably each independently a hydrogen atom or an alkyl group having 1 to 2 carbons, more preferably all of them are hydrogen atoms. R 29 and R 30 are preferably an alkyl group having 1 to 5 carbons, more preferably an alkyl group having 1 to 2 carbons. M 7 is preferably -C(=O)-O-, -O-, -OC(=O)-, more preferably all of them are -O-. M 5 is preferably a hydrogen atom or an alkyl group having 1 to 2 carbons, more preferably all hydrogen atoms. M 10 is preferably a fluorine atom. M 8 and M 9 are preferably independently alkoxy and halogen atoms, more preferably methoxy, ethoxy and chlorine atoms, especially preferably methoxy or ethoxy. Preferably, f21, f23, and f24 are 1/2 or less, more preferably 1/4 or less, respectively, of f22, further preferably f23 or f24 is 0, and most preferably f23 and f24 are 0. f25 is preferably not less than 1/5 of the total value of f21, f22, f23, and f24, and is not more than the total value of f21, f22, f23, and f24. f21 is preferably 0-20, more preferably 0-15, still more preferably 1-15, particularly preferably 2-10. f22 is preferably 5-600, more preferably 8-600, still more preferably 20-200, still more preferably 30-200, still more preferably 35-180, most preferably 40-180. It is preferable that f23 and f24 are 0-5, More preferably, they are 0-3, More preferably, they are 0. f25 is preferably from 4 to 600, more preferably from 4 to 200, still more preferably from 10 to 200, still more preferably from 30 to 60. The total value of f21, f22, f23, f24, and f25 is preferably from 20 to 600, more preferably from 20 to 250, and still more preferably from 50 to 230. f26 is preferably 0-18, more preferably 0-15, still more preferably 0-10, still more preferably 0-5. f27 is preferably 0-1, more preferably 0. Preferably, g21 and g31 are each independently 2-3, More preferably, it is 3. Preferably, g22 and g32 are each independently 0 or 1, more preferably 0. Preferably, g21+g22 and g31+g32 are 3.

較佳為使用如下化合物(a11)作為有機矽化合物(A),該化合物(a11)於上述式(a1)中,R 25及R 26均為氫原子,Rf a26及Rf a27為氟原子或全部氫原子被取代為氟原子之碳數1~2之氟化烷基,M 7全部為-O-,M 8及M 9全部為甲氧基、乙氧基或氯原子(尤其是甲氧基或乙氧基),M 5為氫原子,M 10為氟原子,f21為1~10(較佳為2~7),f22為30~200(更佳為40~180),f23及f24為0,f25為30~60,f26為0~6,f27為0~1(尤佳為0),g21及g31為1~3(均較佳為2以上,更佳為3),g22及g32為0~2(均較佳為0或1,更佳為0),g21+g22及g31+g32為3。 It is preferable to use the following compound (a11) as the organosilicon compound (A), the compound (a11) in the above formula (a1), R 25 and R 26 are hydrogen atoms, Rf a26 and Rf a27 are fluorine atoms or all A fluorinated alkyl group with 1 to 2 carbon atoms in which the hydrogen atom is replaced by a fluorine atom, all of M7 are -O-, all of M8 and M9 are methoxy, ethoxy or chlorine atoms (especially methoxy or ethoxy), M 5 is a hydrogen atom, M 10 is a fluorine atom, f21 is 1-10 (preferably 2-7), f22 is 30-200 (more preferably 40-180), f23 and f24 are 0, f25 is 30-60, f26 is 0-6, f27 is 0-1 (preferably 0), g21 and g31 are 1-3 (both are preferably 2 or more, more preferably 3), g22 and g32 0 to 2 (both are preferably 0 or 1, more preferably 0), and g21+g22 and g31+g32 are 3.

有機矽化合物(A)較佳為以下述式(a2)表示。The organosilicon compound (A) is preferably represented by the following formula (a2).

[化6]

Figure 02_image011
於上述式(a2)中, Rf a1為兩端為氧原子之二價氟聚醚結構, R 11、R 12、及R 13分別獨立為碳數1~20之烷基,於存在複數個R 11之情形時,複數個R 11可分別不同,於存在複數個R 12之情形時,複數個R 12可分別不同,於存在複數個R 13之情形時,複數個R 13可分別不同, E 1、E 2、E 3、E 4、及E 5分別獨立為氫原子或氟原子,於存在複數個E 1之情形時,複數個E 1可分別不同,於存在複數個E 2之情形時,複數個E 2可分別不同,於存在複數個E 3之情形時,複數個E 3可分別不同,於存在複數個E 4之情形時,複數個E 4可分別不同,於存在複數個E 5之情形時,複數個E 5可分別不同, G 1及G 2分別獨立為具有矽氧烷鍵之二~十價有機矽氧烷基, J 1、J 2、及J 3分別獨立為水解性基、羥基或-(CH 2) e7-Si(OR 14) 3,e7為1~5,R 14為甲基或乙基,於存在複數個J 1之情形時,複數個J 1可分別不同,於存在複數個J 2之情形時,複數個J 2可分別不同,於存在複數個J 3之情形時,複數個J 3可分別不同, L 1及L 2分別獨立為可含有氧原子、氮原子、矽原子或氟原子之碳數1~12之二價連結基,且為-{C(R 25)(R 26)}-單元(U a1)、-{C(Rf a26)(Rf a27)}-單元(U a2)、-{Si(R 27)(R 28)}-單元(U a3)或-M 7-單元(U a5)之一者以上以任意順序排列而鍵結而成之連結基(R 25、R 26、R 27、R 28、Rf a26、Rf a27、M 7與上述式(a1)中者相同), a10及a14分別獨立為0或1, a11及a15分別獨立為0或1, a12及a16分別獨立為0~9, a13為0~4, 於a11為0時、或a11為1且G 1為二價時,d11為1,於a11為1且G 1為三~十價時,d11為較G 1之價數少一之數, 於a15為0時、或a15為1且G 2為二價時,d12為1,於a15為1且G 2為三~十價時,d12為較G 2之價數少一之數, a21及a23分別獨立為0~2, e11為1~3,e12為0~2,且e11+e12≦3, e21為1~3,e22為0~2,且e21+e22≦3, e31為1~3,e32為0~2,且e31+e32≦3。 [chemical 6]
Figure 02_image011
In the above formula (a2), Rf a1 is a divalent fluoropolyether structure with oxygen atoms at both ends, R 11 , R 12 , and R 13 are each independently an alkyl group with 1 to 20 carbon atoms. In the case of 11 , the plurality of R 11 may be different, and in the case of a plurality of R 12 , the plurality of R 12 may be different, and in the case of a plurality of R 13 , the plurality of R 13 may be different, E 1. E 2 , E 3 , E 4 , and E 5 are each independently a hydrogen atom or a fluorine atom. When there are multiple E 1s , the multiple E 1s can be different. When there are multiple E 2s , the plurality of E 2 can be different respectively, when there is a plurality of E 3 , the plurality of E 3 can be different respectively, in the case of a plurality of E 4 , the plurality of E 4 can be different respectively, in the case of a plurality of E In the case of 5 , the plurality of E 5 can be different, G 1 and G 2 are independently di-decavalent organosiloxane groups having siloxane bonds, and J 1 , J 2 , and J 3 are independently hydrolyzed Native group, hydroxyl group or -(CH 2 ) e7 -Si(OR 14 ) 3 , e7 is 1 to 5, R 14 is methyl or ethyl, when there are multiple J 1s , the multiple J 1s can be respectively Different, when there are multiple J 2s , the multiple J 2s can be different, and when there are multiple J 3s , the multiple J 3s can be different, and L 1 and L 2 can independently contain oxygen atoms , a nitrogen atom, a silicon atom or a divalent linking group with 1 to 12 carbon atoms of a fluorine atom, which is -{C(R 25 )(R 26 )}-unit (U a1 ), -{C(Rf a26 )( One or more of Rf a27 )}-unit (U a2 ), -{Si(R 27 )(R 28 )}-unit (U a3 ), or -M 7 -unit (U a5 ) is arranged in any order and bonded The resulting linking group (R 25 , R 26 , R 27 , R 28 , Rf a26 , Rf a27 , M 7 are the same as those in the above formula (a1), a10 and a14 are independently 0 or 1, a11 and a15 are independently 0 or 1, a12 and a16 are independently 0 to 9, a13 is 0 to 4, when a11 is 0, or a11 is 1 and G 1 is divalent, d11 is 1, and a11 is 1 and When G 1 has a valence of three to ten, d11 is a number less than the valence of G 1 , when a15 is 0, or when a15 is 1 and G 2 is bivalent, d12 is 1, and when a15 is 1 and G When 2 is three to ten valences, d12 is a number less than the valence of G 2 , a21 and a23 are independently 0 to 2, e11 is 1 to 3, e12 is 0 to 2, and e11+e12≦3, e21 is 1~3, e22 is 0~2, and e21+e22≦3, e31 is 1~3, e32 is 0 to 2, and e31+e32≦3.

再者,a10為0意指標註a10所括住之部分為單鍵,於a11、a12、a13、a14、a15、a16、a21或a23為0之情形時亦同樣如此。Furthermore, a10 being 0 means that the part enclosed by a10 is a single bond, and the same is true when a11, a12, a13, a14, a15, a16, a21 or a23 are 0.

Rf a1較佳為-O-(CF 2CF 2O) e4-、-O-(CF 2CF 2CF 2O) e5-、-O-(CF 2-CF(CF 3)O) e6-。e4、及e5均為15~80,e6為3~60。又,Rf a1亦較佳為自p莫耳之全氟丙二醇與q莫耳之全氟甲二醇無規脫水縮合而成之結構之兩末端之羥基去除氫原子所殘留之基,p+q為15~80,作為Rf a1,該態樣最佳。 Rf a1 is preferably -O-(CF 2 CF 2 O) e4 -, -O-(CF 2 CF 2 CF 2 O) e5 -, -O-(CF 2 -CF(CF 3 )O) e6 -. Both e4 and e5 are 15-80, and e6 is 3-60. In addition, Rf a1 is also preferably the group remaining by removing hydrogen atoms from the hydroxyl groups at both ends of the structure formed by the random dehydration condensation of p moles of perfluoropropylene glycol and q moles of perfluoromethanediol, and p+q is 15 ~80, this aspect is the best as Rf a1 .

R 11、R 12、及R 13較佳為分別獨立為碳數1~10之烷基,更佳為碳數1~2之烷基。 R 11 , R 12 , and R 13 are preferably each independently an alkyl group having 1 to 10 carbons, more preferably an alkyl group having 1 to 2 carbons.

E 1、E 2、E 3及E 4較佳為均為氫原子,E 5較佳為氟原子。 E 1 , E 2 , E 3 and E 4 are all preferably hydrogen atoms, and E 5 is preferably a fluorine atom.

L 1及L 2較佳為分別獨立為-{C(R 25)(R 26)}-單元(U a1)、或-{C(Rf a26)(Rf a27)}-單元(U a2)之一個以上以任意順序排列鍵結而成之含有氟原子之碳數1~12(較佳為1~10,更佳為1~5)之二價連結基,更佳為x為1~12(較佳為1~10,更佳為1~5)之-(CF 2) x-。 L 1 and L 2 are preferably independently -{C(R 25 )(R 26 )}-unit (U a1 ), or -{C(Rf a26 )(Rf a27 )}-unit (U a2 ) More than one divalent linking group with 1 to 12 carbon atoms (preferably 1 to 10, more preferably 1 to 5) containing fluorine atoms bonded in any order, more preferably x is 1 to 12 ( Preferably 1-10, more preferably 1-5) -(CF 2 ) x -.

G 1及G 2較佳為分別獨立為具有矽氧烷鍵之二~五價之有機矽氧烷基。 G 1 and G 2 are preferably independently di- to pentavalent organosiloxane groups having siloxane bonds.

J 1、J 2、及J 3較佳為分別獨立為甲氧基、乙氧基或-(CH 2) e7-Si(OR 14) 3,更佳為甲氧基或乙氧基。 J 1 , J 2 , and J 3 are preferably independently methoxy, ethoxy or -(CH 2 ) e7 -Si(OR 14 ) 3 , more preferably methoxy or ethoxy.

a10較佳為1,a11較佳為0,a12較佳為0~7,更佳為0~5,a13較佳為1~3,a14較佳為1,a15較佳為0,a16較佳為0~6,更佳為0~3,a21及a23均較佳為0或1(更佳為均為0),d11較佳為1,d12較佳為1,e11、e21及e31均較佳為2以上,亦較佳為3。e12、e22及e32較佳為均為0或1,更佳為0。e11+e12、e21+e22、及e31+e32較佳為均為3。該等較佳之範圍可滿足單個,亦可組合滿足2個以上。a10 is preferably 1, a11 is preferably 0, a12 is preferably 0-7, more preferably 0-5, a13 is preferably 1-3, a14 is preferably 1, a15 is preferably 0, and a16 is preferably 0 to 6, more preferably 0 to 3, both a21 and a23 are preferably 0 or 1 (more preferably both are 0), d11 is preferably 1, d12 is preferably 1, e11, e21 and e31 are all relatively Preferably, it is 2 or more, More preferably, it is 3. All of e12, e22 and e32 are preferably 0 or 1, more preferably 0. Preferably, all of e11+e12, e21+e22, and e31+e32 are 3. These preferred ranges can be satisfied individually, or two or more can be satisfied in combination.

作為有機矽化合物(A),較佳為使用如下化合物(a21),該化合物(a21)之上述式(a2)之Rf a1為自p莫耳之全氟丙二醇與q莫耳之全氟甲二醇無規脫水縮合而成之結構之兩末端之羥基去除氫原子所殘留之基(p+q=15~80),L 1及L 2均為碳數1~5(較佳為1~3)之全氟伸烷基,E 1、E 2、及E 3均為氫原子,E 4為氫原子,E 5為氟原子,J 1、J 2、及J 3均為甲氧基或乙氧基(尤其是甲氧基),a10為1,a11為0,a12為0~7(較佳為0~5),a13為2,a14為1,a15為0,a16為0~6(尤其是0),a21及a23分別獨立為0或1(更佳為a21及a23均為0),d11為1,d12為1,e11、e21及e31均為2~3(尤其是3),e12、e22及e32均為0或1(尤其是0),e11+e12、e21+e22、及e31+e32均為3。 As the organosilicon compound (A), it is preferable to use the following compound (a21), the Rf a1 of the above-mentioned formula (a2) of the compound (a21) is from p moles of perfluoropropylene glycol and q moles of perfluoromethanediol The hydroxyl groups at both ends of the structure formed by random dehydration condensation of alcohols are the residues left by removing the hydrogen atoms (p+q=15-80), and both L 1 and L 2 have carbon numbers of 1-5 (preferably 1-3) Perfluoroalkylene, E 1 , E 2 , and E 3 are all hydrogen atoms, E 4 is hydrogen atom, E 5 is fluorine atom, J 1 , J 2 , and J 3 are all methoxy or ethoxy (especially methoxy), a10 is 1, a11 is 0, a12 is 0-7 (preferably 0-5), a13 is 2, a14 is 1, a15 is 0, a16 is 0-6 (especially 0), a21 and a23 are independently 0 or 1 (more preferably a21 and a23 are both 0), d11 is 1, d12 is 1, e11, e21 and e31 are all 2 to 3 (especially 3), e12, Both e22 and e32 are 0 or 1 (especially 0), and e11+e12, e21+e22, and e31+e32 are all 3.

作為有機矽化合物(A),亦較佳為使用如下化合物(a22),該化合物(a22)之上述式(a2)之Rf a1為-O-(CF 2CF 2CF 2O) e5-,e5為15~80(較佳為25~40),L 1為含有氟原子及氧原子之碳數3~6之二價連結基,L 2為碳數2~10之全氟伸烷基,E 2、E 3均為氫原子,E 5為氟原子,J 2為-(CH 2) e7-Si(OCH 3) 3,e7為2~4,a10為1,a11為0,a12為0,a13為2,a14為1,a15為0,a16為0,d11為1,d12為1,e21為3。 As the organosilicon compound (A), it is also preferable to use the following compound (a22), the Rf a1 of the above formula (a2) of the compound (a22) is -O-(CF 2 CF 2 CF 2 O) e5 -, e5 15 to 80 (preferably 25 to 40), L1 is a divalent linking group with 3 to 6 carbons containing fluorine atoms and oxygen atoms, L2 is a perfluoroalkylene group with 2 to 10 carbons, E 2. E3 is a hydrogen atom, E5 is a fluorine atom, J2 is -( CH 2 ) e7 -Si(OCH 3 ) 3 , e7 is 2 to 4, a10 is 1, a11 is 0, a12 is 0, a13 is 2, a14 is 1, a15 is 0, a16 is 0, d11 is 1, d12 is 1, and e21 is 3.

作為有機矽化合物(A),更具體而言,可例舉下述式(a3)之化合物。As an organosilicon compound (A), the compound of following formula (a3) is mentioned more specifically.

[化7]

Figure 02_image013
[chemical 7]
Figure 02_image013

於上述式(a3)中,R 30為碳數1~6之全氟烷基,R 31為自p莫耳之全氟丙二醇與q莫耳之全氟甲二醇無規脫水縮合而成之結構之兩末端之羥基去除氫原子所殘留之基(p+q為15~80)或自碳數為15~240之全氟氧伸烷基二醇之兩末端之羥基去除氫原子所殘留之基(作為R 31,更佳為前者之基),R 32為碳數1~10之全氟伸烷基,R 33為碳數2~6之三價飽和烴基,R 34為碳數1~3之烷基。R 30之碳數較佳為1~4,更佳為1~3。R 32之碳數較佳為1~5。h1為1~10,較佳為1~8,更佳為1~6。h2為1以上,較佳為2以上,亦可為3。 In the above formula (a3), R 30 is a perfluoroalkyl group having 1 to 6 carbon atoms, and R 31 is formed by random dehydration condensation of p moles of perfluoropropylene glycol and q moles of perfluoromethanediol The group left by removing hydrogen atoms from the hydroxyl groups at both ends of the structure (p+q is 15-80) or the group remaining by removing hydrogen atoms from the hydroxyl groups at both ends of perfluorooxyalkylene glycol with carbon number 15-240 ( R 31 is more preferably a group of the former), R 32 is a perfluoroalkylene group with 1 to 10 carbons, R 33 is a trivalent saturated hydrocarbon group with 2 to 6 carbons, R 34 is a perfluoroalkyl group with 1 to 3 carbons alkyl. The carbon number of R 30 is preferably 1-4, more preferably 1-3. The carbon number of R 32 is preferably 1-5. h1 is 1-10, preferably 1-8, more preferably 1-6. h2 is 1 or more, preferably 2 or more, and may be 3.

作為有機矽化合物(A),亦可例舉下述式(a4)所表示之化合物。As the organosilicon compound (A), a compound represented by the following formula (a4) may also be mentioned.

[化8]

Figure 02_image015
[chemical 8]
Figure 02_image015

於上述式(a4)中,R 40為碳數2~5之全氟烷基,R 41為碳數2~5之全氟伸烷基,R 42為碳數2~5之伸烷基之氫原子之一部分被取代為氟之氟伸烷基,R 43、R 44分別獨立為碳數2~5之伸烷基,R 45為甲基或乙基。k1為1~5之整數。k2為1~3之整數,較佳為2以上,亦可為3。 In the above formula (a4), R 40 is a perfluoroalkyl group with 2 to 5 carbons, R 41 is a perfluoroalkylene group with 2 to 5 carbons, and R 42 is an alkylene group with 2 to 5 carbons. A fluoroalkylene group in which part of the hydrogen atoms is substituted with fluorine, R 43 and R 44 are independently a C 2-5 alkylene group, and R 45 is a methyl group or an ethyl group. k1 is an integer of 1-5. k2 is an integer of 1 to 3, preferably 2 or more, and may be 3.

有機矽化合物(A)之數量平均分子量較佳為2,000以上,更佳為4,000以上,進而較佳為5,000以上,進而更佳為6,000以上,尤佳為7,000以上,又,較佳為40,000以下,更佳為20,000以下,進而較佳為15,000以下。The number average molecular weight of the organosilicon compound (A) is preferably at least 2,000, more preferably at least 4,000, still more preferably at least 5,000, still more preferably at least 6,000, particularly preferably at least 7,000, and more preferably at most 40,000, More preferably, it is 20,000 or less, More preferably, it is 15,000 or less.

作為有機矽化合物(A),可僅使用一種,亦可使用兩種以上。As the organosilicon compound (A), only one type may be used, or two or more types may be used.

撥水層(r)中較佳為包含源自有機矽化合物(A)之結構例如40質量%以上,更佳為50質量%以上,進而較佳為60質量%以上,進而更佳為75質量%以上,又,可為100質量%,較佳為95質量%以下,更佳為90質量%以下。此處,源自有機矽化合物(A)之結構係指有機矽化合物(A)及有機矽化合物(A)脫水縮合後之殘基。The water-repellent layer (r) preferably contains a structure derived from the organosilicon compound (A), for example, 40% by mass or more, more preferably 50% by mass or more, further preferably 60% by mass or more, and even more preferably 75% by mass % or more, and may be 100% by mass, preferably 95% by mass or less, more preferably 90% by mass or less. Here, the structure derived from the organosilicon compound (A) refers to the organosilicon compound (A) and the residue after dehydration condensation of the organosilicon compound (A).

1-2-2.有機矽化合物(B) 撥水層(r)可具有源自上述有機矽化合物(A)之結構、及源自下述式(b1)所表示之有機矽化合物(B)之結構。具有源自有機矽化合物(A)之結構、及源自有機矽化合物(B)之結構之撥水層(r)可以上述撥水層形成用組合物之形式,藉由塗佈進而混合有有機矽化合物(B)之混合組合物並使其硬化而獲得。 1-2-2.Organosilicon compound (B) The water-repellent layer (r) may have a structure derived from the above-mentioned organosilicon compound (A) and a structure derived from the organosilicon compound (B) represented by the following formula (b1). The water-repellent layer (r) having a structure derived from the organosilicon compound (A) and a structure derived from the organosilicon compound (B) can be mixed with organic It is obtained by hardening the mixed composition of the silicon compound (B).

有機矽化合物(B)如下文所述,具有鍵結於矽原子之水解性基或羥基,通常有機矽化合物(B)所具有之-SiOH基或水解所產生之有機矽化合物(B)之-SiOH基與源自有機矽化合物(B)之-SiOH基、源自其他化合物之-SiOH基、或積層體中供形成撥水層(r)之面之活性氫(羥基等)脫水縮合,因此於較佳之態樣中,撥水層(r)具有源自有機矽化合物(A)之脫水縮合結構、及源自有機矽化合物(B)之脫水縮合結構。藉由撥水層(r)具有源自有機矽化合物(B)之脫水縮合結構,水滴等之滑落性進一步提高。The organosilicon compound (B), as described below, has a hydrolyzable group or a hydroxyl group bonded to a silicon atom. Generally, the -SiOH group of the organosilicon compound (B) or the -SiOH group of the organosilicon compound (B) produced by hydrolysis SiOH group dehydrates and condenses with -SiOH group derived from organosilicon compound (B), -SiOH group derived from other compounds, or active hydrogen (hydroxyl group, etc.) In a preferred aspect, the water repellent layer (r) has a dehydration condensation structure derived from the organosilicon compound (A) and a dehydration condensation structure derived from the organosilicon compound (B). Since the water-repellent layer (r) has the dehydration condensation structure derived from the organosilicon compound (B), the sliding property of water droplets etc. improves further.

[化9]

Figure 02_image017
[chemical 9]
Figure 02_image017

於上述式(b1)中, Rf b10為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子, R b11、R b12、R b13、R b14分別獨立為氫原子或碳數1~4之烷基,於存在複數個R b11之情形時,複數個R b11可分別不同,於存在複數個R b12之情形時,複數個R b12可分別不同,於存在複數個R b13之情形時,複數個R b13可分別不同,於存在複數個R b14之情形時,複數個R b14可分別不同, Rf b11、Rf b12、Rf b13、Rf b14分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf b11之情形時,複數個Rf b11可分別不同,於存在複數個Rf b12之情形時,複數個Rf b12可分別不同,於存在複數個Rf b13之情形時,複數個Rf b13可分別不同,於存在複數個Rf b14之情形時,複數個Rf b14可分別不同, R b15為碳數1~20之烷基,於存在複數個R b15之情形時,複數個R b15可分別不同, A 1為-O-、-C(=O)-O-、-O-C(=O)-、-NR-、-NRC(=O)-、或-C(=O)NR-,上述R為氫原子、碳數1~4之烷基或碳數1~4之含氟烷基,於存在複數個A 1之情形時,複數個A 1可分別不同, A 2為水解性基或羥基,於存在複數個A 2之情形時,複數個A 2可分別不同, b11、b12、b13、b14、b15分別獨立為0~100之整數, c為1~3之整數, 關於Rf b10-、-Si(A 2) c(R b15) 3 c、b11個-{C(R b11)(R b12)}-單元(U b1)、b12個-{C(Rf b11)(Rf b12)}-單元(U b2)、b13個-{Si(R b13)(R b14)}-單元(U b3)、b14個-{Si(Rf b13)(Rf b14)}-單元(U b4)、b15個-A 1-單元(U b5),Rf b10-為式(b1)所表示之化合物之一個末端,-Si(A 2) c(R b15) 3 c為另一個末端,未形成氟聚醚結構,只要-O-不與-O-或-F連續,則各單元(U b1)~單元(U b5)以任意之順序排列而鍵結。 In the above formula (b1), Rf b10 is an alkyl group having 1 to 20 carbon atoms or a fluorine atom in which one or more hydrogen atoms are replaced by fluorine atoms, and R b11 , R b12 , R b13 , and R b14 are independently hydrogen Atoms or alkyl groups with 1 to 4 carbons, when there are plural R b11 , the plural R b11 may be different, and when there are plural R b12 , the plural R b12 may be different respectively, when there are plural R b11 In the case of a single R b13 , the plurality of R b13 may be different, and in the case of a plurality of R b14 , the plurality of R b14 may be different, and Rf b11 , Rf b12 , Rf b13 , and Rf b14 are each independently one or more The hydrogen atom is replaced by an alkyl group with 1 to 20 carbon atoms or a fluorine atom of a fluorine atom. When there are multiple Rf b11 , the multiple Rf b11 can be different. When there are multiple Rf b12 , the multiple Each Rf b12 can be different. When there are multiple Rf b13 , the multiple Rf b13 can be different. When there are multiple Rf b14 , the multiple Rf b14 can be different. R b15 is carbon number 1~ For the alkyl group of 20, when there are multiple R b15s , the multiple R b15s can be different, and A1 is -O-, -C( = O)-O-, -OC(=O)-, -NR -, -NRC(=O)-, or -C(=O)NR-, the above-mentioned R is a hydrogen atom, an alkyl group with 1 to 4 carbons, or a fluorine-containing alkyl group with 1 to 4 carbons. In the case of A1, the plural A1s may be different, and A2 is a hydrolyzable group or a hydroxyl group. In the case of multiple A2s , the plural A2s may be different, b11, b12, b13, b14, b15 are independently an integer of 0 to 100, c is an integer of 1 to 3, about Rf b10 -, -Si(A 2 ) c (R b15 ) 3 - c , b11 -{C(R b11 )(R b12 ) }-unit (U b1 ), b12-{C(Rf b11 )(Rf b12 )}-unit (U b2 ), b13-{Si(R b13 )(R b14 )}-unit (U b3 ), b14-{Si(Rf b13 )(Rf b14 )}-unit (U b4 ), b15-A 1 -unit (U b5 ), Rf b10 -is one terminal of the compound represented by formula (b1),- Si(A 2 ) c (R b15 ) 3 c is the other end and does not form a fluoropolyether structure. As long as -O- is not continuous with -O- or -F, each unit (U b1 )~unit (U b5 ) are bonded by arranging in any order.

Rf b10較佳為分別獨立為氟原子或碳數1~10(更佳為碳數1~5)之全氟烷基。 Rf b10 is preferably each independently a fluorine atom or a perfluoroalkyl group having 1 to 10 carbons (more preferably 1 to 5 carbons).

R b11、R b12、R b13、及R b14較佳為氫原子。 R b11 , R b12 , R b13 , and R b14 are preferably hydrogen atoms.

R b15較佳為碳數1~5之烷基。 R b15 is preferably an alkyl group having 1 to 5 carbon atoms.

A 1較佳為-O-、-C(=O)-O-、或-O-C(=O)-。 A1 is preferably -O-, -C( = O)-O-, or -OC(=O)-.

作為A 2所表示之水解性基,可例舉:烷氧基、鹵素原子、氰基、乙醯氧基、異氰酸酯基等。 The hydrolyzable group represented by A2 may, for example, be an alkoxy group, a halogen atom, a cyano group, an acetyloxy group or an isocyanate group.

A 2較佳為碳數1~4之烷氧基、或鹵素原子,更佳為甲氧基、乙氧基、氯原子。 A 2 is preferably an alkoxy group having 1 to 4 carbon atoms, or a halogen atom, more preferably a methoxy group, an ethoxy group, or a chlorine atom.

b11較佳為1~30,更佳為1~25,進而較佳為1~10,尤佳為1~5,最佳為1~2。b11 is preferably 1-30, more preferably 1-25, still more preferably 1-10, particularly preferably 1-5, most preferably 1-2.

b12較佳為0~15,更佳為0~10。b12 is preferably 0-15, more preferably 0-10.

b13較佳為0~5,更佳為0~2。Preferably, b13 is 0-5, More preferably, it is 0-2.

b14較佳為0~4,更佳為0~2。Preferably, b14 is 0-4, More preferably, it is 0-2.

b15較佳為0~4,更佳為0~2。Preferably, b15 is 0-4, More preferably, it is 0-2.

c較佳為2~3,更佳為3。c is preferably 2-3, more preferably 3.

b11、b12、b13、b14、及b15之合計值較佳為2以上,更佳為3以上,進而較佳為5以上,又,較佳為80以下,更佳為50以下,進而較佳為20以下。The total value of b11, b12, b13, b14, and b15 is preferably at least 2, more preferably at least 3, more preferably at least 5, and is preferably at most 80, more preferably at most 50, still more preferably at most Below 20.

尤佳為Rf b10為氟原子或碳數1~5之全氟烷基,R b11、R b12均為氫原子,A 2為甲氧基或乙氧基,並且b11為1~5,b12為0~5,b13、b14、及b15全部為0,c為3。 Especially preferably, Rf b10 is a fluorine atom or a perfluoroalkyl group with 1 to 5 carbon atoms, R b11 and R b12 are both hydrogen atoms, A2 is methoxy or ethoxy, and b11 is 1 to 5, and b12 is 0 to 5, b13, b14, and b15 are all 0, and c is 3.

再者,於下文所記載之實施例中,若以上述式(b1)表示用作有機矽化合物(B)之FAS13E,則以如下方式確定:R b11、R b12均為氫原子,b11為2,b13、b14、及b15全部為0,c為3,A 2為乙氧基,Rf b10-{C(Rf b11)(Rf b12)} b12-為末端,而成為C 6F 13-。 Furthermore, in the examples described below, if FAS13E used as the organosilicon compound (B) is represented by the above formula (b1), it is determined as follows: R b11 and R b12 are both hydrogen atoms, and b11 is 2 , b13, b14, and b15 are all 0, c is 3, A 2 is ethoxy, Rf b10 -{C(Rf b11 )(Rf b12 )} b12 - is the terminal, and becomes C 6 F 13 -.

作為上述式(b1)所表示之化合物,具體而言,可例舉C jF 2j 1-Si-(OCH 3) 3、C jF 2j 1-Si-(OC 2H 5) 3(j為1~12之整數),其中尤佳為C 4F 9-Si-(OC 2H 5) 3、C 6F 13-Si-(OC 2H 5) 3、C 7F 15-Si-(OC 2H 5) 3、C 8F 17-Si-(OC 2H 5) 3。又,可例舉:CF 3CH 2O(CH 2) kSiCl 3、CF 3CH 2O(CH 2) kSi(OCH 3) 3、CF 3CH 2O(CH 2) kSi(OC 2H 5) 3、CF 3(CH 2) 2Si(CH 3) 2(CH 2) kSiCl 3、CF 3(CH 2) 2Si(CH 3) 2(CH 2) kSi(OCH 3) 3、CF 3(CH 2) 2Si(CH 3) 2(CH 2) kSi(OC 2H 5) 3、CF 3(CH 2) 6Si(CH 3) 2(CH 2) kSiCl 3、CF 3(CH 2) 6Si(CH 3) 2(CH 2) kSi(OCH 3) 3、CF 3(CH 2) 6Si(CH 3) 2(CH 2) kSi(OC 2H 5) 3、CF 3COO(CH 2) kSiCl 3、CF 3COO(CH 2) kSi(OCH 3) 3、CF 3COO(CH 2) kSi(OC 2H 5) 3(k均為5~20,較佳為8~15)。又,亦可例舉:CF 3(CF 2) m-(CH 2) nSiCl 3、CF 3(CF 2) m-(CH 2) nSi(OCH 3) 3、CF 3(CF 2) m-(CH 2) nSi(OC 2H 5) 3(m均為0~10,較佳為0~7,n均為1~5,較佳為2~4)。亦可例舉CF 3(CF 2) p-(CH 2) q-Si-(CH 2CH=CH 2) 3(p均為2~10,較佳為2~8,q均為1~5,較佳為2~4)。進而,可例舉:CF 3(CF 2) p-(CH 2) qSiCH 3Cl 2、CF 3(CF 2) p-(CH 2) qSiCH 3(OCH 3) 2、CF 3(CF 2) p-(CH 2) qSiCH 3(OC 2H 5) 2(p均為2~10,較佳為3~7,q均為1~5,較佳為2~4)。 As the compound represented by the above formula (b1), specifically, C j F 2j + 1 -Si-(OCH 3 ) 3 , C j F 2j + 1 -Si-(OC 2 H 5 ) 3 ( j is an integer from 1 to 12), especially C 4 F 9 -Si-(OC 2 H 5 ) 3 , C 6 F 13 -Si-(OC 2 H 5 ) 3 , C 7 F 15 -Si- (OC 2 H 5 ) 3 , C 8 F 17 -Si-(OC 2 H 5 ) 3 . Also, CF 3 CH 2 O(CH 2 ) k SiCl 3 , CF 3 CH 2 O(CH 2 ) k Si(OCH 3 ) 3 , CF 3 CH 2 O(CH 2 ) k Si(OC 2 H 5 ) 3 , CF 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) k SiCl 3 , CF 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) k Si(OCH 3 ) 3 , CF 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) k Si(OC 2 H 5 ) 3 , CF 3 (CH 2 ) 6 Si(CH 3 ) 2 (CH 2 ) k SiCl 3 , CF 3 (CH 2 ) 6 Si(CH 3 ) 2 (CH 2 ) k Si(OCH 3 ) 3 , CF 3 (CH 2 ) 6 Si(CH 3 ) 2 (CH 2 ) k Si(OC 2 H 5 ) 3 , CF 3 COO(CH 2 ) k SiCl 3 , CF 3 COO(CH 2 ) k Si(OCH 3 ) 3 , CF 3 COO(CH 2 ) k Si(OC 2 H 5 ) 3 (all k are 5-20 , preferably 8 to 15). Also, CF 3 (CF 2 ) m -(CH 2 ) n SiCl 3 , CF 3 (CF 2 ) m -(CH 2 ) n Si(OCH 3 ) 3 , CF 3 (CF 2 ) m -(CH 2 ) n Si(OC 2 H 5 ) 3 (m is 0-10, preferably 0-7, and n is 1-5, preferably 2-4). CF 3 (CF 2 ) p -(CH 2 ) q -Si-(CH 2 CH=CH 2 ) 3 (p is 2-10, preferably 2-8, q is 1-5 , preferably 2 to 4). Furthermore, CF 3 (CF 2 ) p -(CH 2 ) q SiCH 3 Cl 2 , CF 3 (CF 2 ) p -(CH 2 ) q SiCH 3 (OCH 3 ) 2 , CF 3 (CF 2 ) p -(CH 2 ) q SiCH 3 (OC 2 H 5 ) 2 (both p is 2-10, preferably 3-7, and q is 1-5, preferably 2-4).

於上述式(b1)所表示之化合物中,較佳為下述式(b2)所表示之化合物。Among the compounds represented by the above formula (b1), a compound represented by the following formula (b2) is preferred.

[化10]

Figure 02_image019
[chemical 10]
Figure 02_image019

於上述式(b2)中,R 60為碳數1~8之全氟烷基,R 61為碳數1~5之伸烷基,R 62為碳數1~3之烷基。 In the above formula (b2), R 60 is a perfluoroalkyl group having 1 to 8 carbons, R 61 is an alkylene group having 1 to 5 carbons, and R 62 is an alkyl group having 1 to 3 carbons.

作為有機矽化合物(B),可僅使用一種,亦可使用兩種以上。As the organosilicon compound (B), only one type may be used, or two or more types may be used.

於撥水層(r)包含源自有機矽化合物(B)之結構之情形時,源自有機矽化合物(B)之結構較佳為於撥水層(r)中包含3質量%以上,更佳為5質量%以上,進而較佳為10質量%以上,又,較佳為50質量%以下,更佳為40質量%以下。此處,源自有機矽化合物(B)之結構係指有機矽化合物(B)及有機矽化合物(B)脫水縮合後之殘基。When the water-repellent layer (r) contains a structure derived from the organosilicon compound (B), the structure derived from the organosilicon compound (B) is preferably contained in the water-repellent layer (r) at least 3% by mass, and more It is preferably at least 5% by mass, further preferably at least 10% by mass, and is preferably at most 50% by mass, more preferably at most 40% by mass. Here, the structure derived from the organosilicon compound (B) refers to the organosilicon compound (B) and the residue after dehydration condensation of the organosilicon compound (B).

撥水層(r)中之源自有機矽化合物(B)之結構相對於源自有機矽化合物(A)之結構之質量比較佳為0.05以上,更佳為0.08以上,進而較佳為0.10以上,又,較佳為2.0以下,更佳為1.0以下,進而較佳為0.6以下。The mass ratio of the structure derived from the organosilicon compound (B) to the structure derived from the organosilicon compound (A) in the water-repellent layer (r) is preferably at least 0.05, more preferably at least 0.08, further preferably at least 0.10 , and, preferably 2.0 or less, more preferably 1.0 or less, still more preferably 0.6 or less.

1-2-3.有機矽化合物(C) 較佳為於本發明(第一態樣)之積層體中包含有機矽化合物(C),該有機矽化合物(C)亦可包含於撥水層(r)中。尤其是於本發明(第一態樣)之積層體為積層體(2)之情形時,較佳為於撥水層(r)中包含有機矽化合物(C)。藉由撥水層(r)包含有機矽化合物(C),撥水層(r)對基材(s)之密接性變得良好,其結果為,積層體之耐磨耗性可提高。於撥水層(r)包含有機矽化合物(C)之情形時,撥水層(r)通常可藉由塗佈混合有有機矽化合物(A)、有機矽化合物(C)、及任意使用之有機矽化合物(B)之撥水層形成用組合物並使其硬化而獲得。於撥水層(r)包含有機矽化合物(C)之情形時,撥水層(r)較佳為混合存在有源自有機矽化合物(A)之結構、源自有機矽化合物(C)之結構、及源自任意使用之有機矽化合物(B)之結構之層。 1-2-3.Organosilicon compound (C) The organosilicon compound (C) is preferably included in the laminate of the present invention (first aspect), and the organosilicon compound (C) may also be included in the water-repellent layer (r). Especially when the laminate of the present invention (first aspect) is the laminate (2), it is preferable to contain the organosilicon compound (C) in the water-repellent layer (r). When the water-repellent layer (r) contains the organosilicon compound (C), the adhesion of the water-repellent layer (r) to the substrate (s) becomes good, and as a result, the abrasion resistance of the laminate can be improved. In the case where the water-repellent layer (r) contains an organosilicon compound (C), the water-repellent layer (r) can usually be mixed with an organosilicon compound (A), an organosilicon compound (C), and optionally used A composition for forming a water-repellent layer of an organosilicon compound (B) is obtained by hardening it. In the case where the water-repellent layer (r) contains an organosilicon compound (C), the water-repellent layer (r) preferably has a structure derived from the organosilicon compound (A) and a structure derived from the organosilicon compound (C). structure, and a layer derived from the structure of the organosilicon compound (B) used arbitrarily.

如下文所述,有機矽化合物(C)為具有鍵結有水解性基或羥基之矽原子之化合物,因有機矽化合物(C)所具有之-SiOH基或鍵結於矽原子之水解性基之水解所產生之有機矽化合物(C)之-SiOH基與源自有機矽化合物(C)之-SiOH基、源自其他化合物之-SiOH基、或積層體中供形成撥水層(r)之面之活性氫(羥基等)脫水縮合,因此撥水層(r)亦可含有有機矽化合物(C)之脫水縮合物(即源自有機矽化合物(C)之縮合結構)。再者,撥水層(r)所含之有機矽化合物(C)亦可全部為脫水縮合物。As described below, the organosilicon compound (C) is a compound having a silicon atom bonded to a hydrolyzable group or a hydroxyl group. The -SiOH group of the organosilicon compound (C) produced by the hydrolysis and the -SiOH group derived from the organosilicon compound (C), the -SiOH group derived from other compounds, or the laminate to form a water-repellent layer (r) The active hydrogen (hydroxyl group, etc.) on the surface is dehydrated and condensed, so the water-repellent layer (r) may also contain the dehydration condensate of the organosilicon compound (C) (that is, the condensation structure derived from the organosilicon compound (C)). Furthermore, all the organosilicon compounds (C) contained in the water-repellent layer (r) may be dehydration condensates.

有機矽化合物(C)為具有鍵結有水解性基或羥基(以下將兩者合併稱為反應性基(h1))之矽原子之化合物。上述矽原子之數量較佳為1以上10以下,更佳為1以上5以下,進而較佳為2以上5以下。作為上述水解性基,可例舉:烷氧基、鹵素原子、氰基、乙醯氧基、異氰酸酯基等,較佳為烷氧基,更佳為碳數1~4之烷氧基。較佳為於上述矽原子鍵結有烷氧基或羥基,尤佳為鍵結有碳數1~4之烷氧基或羥基。The organosilicon compound (C) is a compound having a silicon atom bonded to a hydrolyzable group or a hydroxyl group (hereinafter both are collectively referred to as a reactive group (h1)). The number of the aforementioned silicon atoms is preferably from 1 to 10, more preferably from 1 to 5, and still more preferably from 2 to 5. Examples of the hydrolyzable group include an alkoxy group, a halogen atom, a cyano group, an acetyloxy group, an isocyanate group, and the like, preferably an alkoxy group, and more preferably an alkoxy group having 1 to 4 carbon atoms. Preferably, an alkoxy group or a hydroxyl group is bonded to the above-mentioned silicon atom, and an alkoxy group or a hydroxyl group having 1 to 4 carbon atoms is particularly preferable.

鍵結於1個矽原子之反應性基(h1)之數量為1以上即可,亦可為2或3,較佳為2或3。The number of reactive groups (h1) bonded to one silicon atom may be 1 or more, may be 2 or 3, and is preferably 2 or 3.

有機矽化合物(C)較佳為除了上述矽原子以外還具有胺基或胺骨架之化合物。作為有機矽化合物(C),較佳為具有1個以上胺骨架者。再者,上述胺骨架係以-NR 10-表示,R 10為氫原子或烷基。R 10較佳為氫原子或碳數1~5之烷基。又,於有機矽化合物(C)中包含複數個胺骨架之情形時,複數個胺骨架可相同亦可不同。 The organosilicon compound (C) is preferably a compound having an amine group or an amine skeleton in addition to the silicon atom described above. The organosilicon compound (C) preferably has one or more amine skeletons. Furthermore, the aforementioned amine skeleton is represented by -NR 10 -, and R 10 is a hydrogen atom or an alkyl group. R 10 is preferably a hydrogen atom or an alkyl group having 1 to 5 carbons. Moreover, when the organosilicon compound (C) contains a plurality of amine skeletons, the plural amine skeletons may be the same or different.

有機矽化合物(C)較佳為不具有氟聚醚結構之化合物。The organosilicon compound (C) is preferably a compound not having a fluoropolyether structure.

作為有機矽化合物(C),較佳為下述式(c1)~(c3)之任一者所表示之化合物、或者兩種以上之式(c3)所表示之化合物藉由X 31~X 34之至少任一者縮合而鍵結而成之化合物。 The organosilicon compound (C) is preferably a compound represented by any one of the following formulas (c1) to (c3), or a compound represented by two or more formulas (c3) represented by X 31 to X 34 A compound formed by condensation of at least any one of them.

1-2-3-1.下述式(c1)所表示之有機矽化合物(C)(以下為有機矽化合物(C1)) [化11]

Figure 02_image021
1-2-3-1. Organosilicon compound (C) represented by the following formula (c1) (hereinafter referred to as organosilicon compound (C1)) [Chemical 11]
Figure 02_image021

於上述式(c1)中, R x11、R x12、R x13、R x14分別獨立為氫原子或碳數1~4之烷基,於存在複數個R x11之情形時,複數個R x11可分別不同,於存在複數個R x12之情形時,複數個R x12可分別不同,於存在複數個R x13之情形時,複數個R x13可分別不同,於存在複數個R x14之情形時,複數個R x14可分別不同, Rf x11、Rf x12、Rf x13、Rf x14分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf x11之情形時,複數個Rf x11可分別不同,於存在複數個Rf x12之情形時,複數個Rf x12可分別不同,於存在複數個Rf x13之情形時,複數個Rf x13可分別不同,於存在複數個Rf x14之情形時,複數個Rf x14可分別不同, R x15為碳數1~20之烷基,於存在複數個R x15之情形時,複數個R x15可分別不同, X 11為水解性基或羥基,於存在複數個X 11之情形時,複數個X 11可分別不同, Y 11為-NH-、或-S-,於存在複數個Y 11之情形時,複數個Y 11可分別不同, Z 11為乙烯基、α-甲基乙烯基、苯乙烯基、甲基丙烯醯基、丙烯醯基、胺基、異氰酸酯基、異氰尿酸酯基、環氧基、脲基、或巰基, p1為1~20之整數,p2、p3、p4分別獨立為0~10之整數,p5為0~10之整數, p6為1~3之整數, 於Z 11不為胺基之情形時,具有至少1個為-NH-之Y 11,於Y 11全部為-S-之情形或p5為0之情形時,Z 11為胺基, 關於Z 11-、-Si(X 11) p6(R x15) 3 p6、p1個-{C(R x11)(R x12)}-單元(U c11)、p2個-{C(Rf x11)(Rf x12)}-單元(U c12)、p3個-{Si(R x13)(R x14)}-單元(U c13)、p4個-{Si(Rf x13)(Rf x14)}-單元(U c14)、p5個-Y 11-單元(U c15),Z 11-為式(c1)所表示之化合物之一個末端,-Si(X 11) p6(R x15) 3 p6為另一個末端,只要-O-不與-O-連續,則各單元(U c11)~單元(U c15)以任意之順序排列而鍵結。 In the above formula (c1), R x11 , R x12 , R x13 , and R x14 are each independently a hydrogen atom or an alkyl group with 1 to 4 carbons. When there are multiple R x11 , the multiple R x11 can be respectively Different, when there is a plurality of R x12 , the plurality of R x12 can be different, when there is a plurality of R x13 , the plurality of R x13 can be different, and when there is a plurality of R x14 , the plurality of R x14 R x14 can be different respectively, Rf x11 , Rf x12 , Rf x13 , and Rf x14 are each independently an alkyl group with 1 to 20 carbons or fluorine atoms in which one or more hydrogen atoms are replaced by fluorine atoms, and there are multiple Rf x11 In the case of multiple Rf x11, the plurality of Rf x11 can be different. In the case of multiple Rf x12 , the plurality of Rf x12 can be different. In the case of multiple Rf x13 , the plurality of Rf x13 can be different. In the case of a plurality of Rf x14 , the plurality of Rf x14 can be different, and R x15 is an alkyl group with 1 to 20 carbons. In the case of a plurality of R x15 , the plurality of R x15 can be different, and X 11 is hydrolyzed In the case of a neutral group or a hydroxyl group, when there are a plurality of X 11 , the plurality of X 11 can be different, Y 11 is -NH-, or -S-, when there is a plurality of Y 11 , the plurality of Y 11 can be are different, Z 11 is vinyl, α-methylvinyl, styrene, methacryl, acryl, amine, isocyanate, isocyanurate, epoxy, urea, or mercapto, p1 is an integer of 1 to 20, p2, p3, and p4 are each independently an integer of 0 to 10, p5 is an integer of 0 to 10, p6 is an integer of 1 to 3, and when Z 11 is not an amino group , has at least one Y 11 that is -NH-, and when all Y 11 are -S- or p5 is 0, Z 11 is an amino group, and Z 11 -, -Si(X 11 ) p6 (R x15 ) 3 - p6 , p1-{C(R x11 )(R x12 )}-unit (U c11 ), p2-{C(Rf x11 )(Rf x12 )}-unit (U c12 ), p3-{Si(R x13 )(R x14 )}-unit (U c13 ), p4-{Si(Rf x13 )(Rf x14 )}-unit (U c14 ), p5-Y 11 -unit ( U c15 ), Z 11 - is one terminal of the compound represented by formula (c1), -Si(X 11 ) p6 (R x15 ) 3 - p6 is the other terminal, as long as -O- is not continuous with -O-, Then each unit (U c11 )~unit (U c15 ) is arranged in any order and bonded .

R x11、R x12、R x13、及R x14較佳為氫原子。 R x11 , R x12 , R x13 , and R x14 are preferably hydrogen atoms.

Rf x11、Rf x12、Rf x13、及Rf x14較佳為分別獨立為1個以上之氫原子被取代為氟原子之碳數1~10之烷基或氟原子。 Rf x11 , Rf x12 , Rf x13 , and Rf x14 are each independently preferably an alkyl group having 1 to 10 carbons in which one or more hydrogen atoms are substituted with fluorine atoms, or a fluorine atom.

R x15較佳為碳數1~5之烷基。 R x15 is preferably an alkyl group having 1 to 5 carbon atoms.

X 11較佳為烷氧基、鹵素原子、氰基、異氰酸酯基、或羥基,更佳為烷氧基或羥基,進而較佳為碳數1~4之烷氧基或羥基,尤佳為甲氧基、乙氧基、或羥基。 X11 is preferably an alkoxy group, a halogen atom, a cyano group, an isocyanate group, or a hydroxyl group, more preferably an alkoxy group or a hydroxyl group, further preferably an alkoxy group or a hydroxyl group with 1 to 4 carbon atoms, and especially preferably a methyl group. Oxy, Ethoxy, or Hydroxy.

Y 11較佳為-NH-。 Y 11 is preferably -NH-.

Z 11較佳為甲基丙烯醯基、丙烯醯基、巰基或胺基,更佳為巰基或胺基,尤佳為胺基。 Z 11 is preferably a methacryl group, an acryl group, a mercapto group or an amine group, more preferably a mercapto group or an amine group, and especially preferably an amine group.

p1較佳為1~15,更佳為2~10。p2、p3及p4較佳為分別獨立為0~5,更佳為全部為0~2。p5較佳為0~5,更佳為0~3,進而較佳為1~3。p6較佳為2~3,更佳為3。p1 is preferably 1-15, more preferably 2-10. It is preferable that p2, p3, and p4 are each independently 0-5, and it is more preferable that all are 0-2. p5 is preferably 0-5, more preferably 0-3, and still more preferably 1-3. p6 is preferably 2-3, more preferably 3.

作為有機矽化合物(C),較佳為使用如下化合物,該化合物於上述式(c1)中,R x11及R x12均為氫原子,Y 11為-NH-,X 11為烷氧基或羥基(尤其是甲氧基、乙氧基、或羥基),Z 11為胺基或巰基,p1為1~10,p2、p3及p4均為0,p5為0~5(尤其是1~3),p6為3。 As the organosilicon compound (C), it is preferable to use the following compound. In the above formula (c1), R x11 and R x12 are both hydrogen atoms, Y 11 is -NH-, and X 11 is an alkoxy group or a hydroxyl group. (especially methoxy, ethoxy, or hydroxyl), Z 11 is amino or mercapto, p1 is 1-10, p2, p3 and p4 are all 0, p5 is 0-5 (especially 1-3) , p6 is 3.

再者,p1個單元(U c11)無需單元(U c11)連續鍵結,中途亦可介隔其他單元鍵結,只要合計為p1個即可。以p2~p5括住之單元(U c12)~單元(U c15)亦同樣如此。 Furthermore, the p1 units (U c11 ) do not need to be bonded consecutively with the units (U c11 ), and may be bonded via other units on the way, as long as the total is p1. The same applies to units (U c12 ) to units (U c15 ) enclosed by p2 to p5.

有機矽化合物(C1)較佳為以下述式(c1-2)表示。The organosilicon compound (C1) is preferably represented by the following formula (c1-2).

[化12]

Figure 02_image023
[chemical 12]
Figure 02_image023

於上述式(c1-2)中, X 12為水解性基或羥基,於存在複數個X 12之情形時,複數個X 12可分別不同, Y 12為-NH-, Z 12為胺基、或巰基, R x16為碳數1~20之烷基,於存在複數個R x16之情形時,複數個R x16可分別不同, p為1~3之整數,q為2~5之整數,r為0~5之整數,s為0或1, 於s為0之情形時,Z 12為胺基。 In the above formula (c1-2), X 12 is a hydrolyzable group or a hydroxyl group. When there are plural X 12 , the plural X 12 may be different, Y 12 is -NH-, Z 12 is an amino group, or mercapto, R x16 is an alkyl group with 1 to 20 carbons, and when there are multiple R x16s , the multiples of R x16 can be different, p is an integer of 1 to 3, q is an integer of 2 to 5, r is an integer of 0 to 5, s is 0 or 1, and when s is 0, Z 12 is an amino group.

X 12較佳為烷氧基、鹵素原子、氰基、異氰酸酯基、或羥基,更佳為烷氧基或羥基,進而較佳為碳數1~4之烷氧基或羥基,尤佳為甲氧基、乙氧基、或羥基。 X12 is preferably an alkoxy group, a halogen atom, a cyano group, an isocyanate group, or a hydroxyl group, more preferably an alkoxy group or a hydroxyl group, further preferably an alkoxy group or a hydroxyl group with 1 to 4 carbon atoms, and especially preferably a methyl group. Oxy, Ethoxy, or Hydroxy.

Z 12較佳為胺基。 Z 12 is preferably an amino group.

R x16較佳為碳數1~10之烷基,更佳為碳數1~5之烷基。 R x16 is preferably an alkyl group having 1 to 10 carbons, more preferably an alkyl group having 1 to 5 carbons.

p較佳為2~3之整數,更佳為3。p is preferably an integer of 2-3, more preferably 3.

於s為1之情形時,較佳為q為2~3之整數,r為2~4之整數,於s為0之情形時,較佳為q與r之合計為1~5。When s is 1, it is preferable that q is an integer of 2-3, and r is an integer of 2-4, and when s is 0, it is preferable that the total of q and r is 1-5.

1-2-3-2.下述式(c2)所表示之有機矽化合物(C)(以下為有機矽化合物(C2))1-2-3-2. Organosilicon compound (C) represented by the following formula (c2) (hereinafter referred to as organosilicon compound (C2))

[化13]

Figure 02_image025
於上述式(c2)中, R x20及R x21分別獨立為氫原子或碳數1~4之烷基,於存在複數個R x20之情形時,複數個R x20可分別不同,於存在複數個R x21之情形時,複數個R x21可分別不同, Rf x20及Rf x21分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf x20之情形時,複數個Rf x20可分別不同,於存在複數個Rf x21之情形時,複數個Rf x21可分別不同, R x22及R x23分別獨立為碳數1~20之烷基,於存在複數個R x22及R x23之情形時,複數個R x22及R x23可分別不同, X 20及X 21分別獨立為水解性基或羥基,於存在複數個X 20及X 21之情形時,複數個X 20及X 21可分別不同, p20為1~30之整數,p21為0~30之整數,標註p20或p21並以括號括住之重複單元之至少一者被取代為胺骨架-NR 100-,上述胺骨架中之R 100為氫原子或烷基, p22及p23分別獨立為1~3之整數, p20個-{C(R x20)(R x21)}-單元(U c21)、p21個-{C(Rf x20)(Rf x21)}-單元(U c22)無需p20個單元(U c21)或p21個單元(U c22)連續,各單元(U c21)及單元(U c22)以任意之順序排列而鍵結,式(c2)所表示之化合物之一個末端為-Si(X 20) p22(R x22) 3 p22,另一個末端為-Si(X 21) p23(R x23) 3 p23。 [chemical 13]
Figure 02_image025
In the above formula (c2), R x20 and R x21 are each independently a hydrogen atom or an alkyl group with 1 to 4 carbons. When there are multiple R x20 , the multiple R x20 can be different. In the case of R x21 , the plurality of R x21 may be different, and Rf x20 and Rf x21 are each independently an alkyl group with 1 to 20 carbon atoms or a fluorine atom in which one or more hydrogen atoms are replaced by fluorine atoms. In the case of Rf x20 , a plurality of Rf x20 may be different, and in the case of a plurality of Rf x21 , a plurality of Rf x21 may be different, R x22 and R x23 are independently an alkyl group with 1 to 20 carbon atoms, and When there are multiple R x22 and R x23 , the multiple R x22 and R x23 can be different respectively, X20 and X21 are independently hydrolyzable groups or hydroxyl groups, and when there are multiple X20 and X21 , A plurality of X 20 and X 21 can be different respectively, p20 is an integer of 1 to 30, p21 is an integer of 0 to 30, at least one of the repeating units marked with p20 or p21 and enclosed in brackets is substituted with an amine skeleton -NR 100 -, R 100 in the above-mentioned amine skeleton is a hydrogen atom or an alkyl group, p22 and p23 are independently an integer of 1 to 3, p20 -{C(R x20 )(R x21 )}-units (U c21 ), p21-{C(Rf x20 )(Rf x21 )}-units (U c22 ) do not need p20 units (U c21 ) or p21 units (U c22 ) to be continuous, each unit (U c21 ) and unit (U c22 ) Arranging and bonding in any order, one end of the compound represented by formula (c2) is -Si(X 20 ) p22 (R x22 ) 3 p22 , and the other end is -Si(X 21 ) p23 (R x23 ) 3 - p23 .

R x20及R x21較佳為氫原子。 R x20 and R x21 are preferably hydrogen atoms.

Rf x20及Rf x21較佳為分別獨立為1個以上之氫原子被取代為氟原子之碳數1~10之烷基或氟原子。 Rf x20 and Rf x21 are each independently preferably an alkyl group having 1 to 10 carbons in which one or more hydrogen atoms are substituted with fluorine atoms, or a fluorine atom.

R x22及R x23較佳為碳數1~5之烷基。 R x22 and R x23 are preferably an alkyl group having 1 to 5 carbon atoms.

X 20及X 21較佳為烷氧基、鹵素原子、氰基、異氰酸酯基、或羥基,更佳為烷氧基或羥基,進而較佳為碳數1~4之烷氧基或羥基,尤佳為甲氧基、乙氧基、或羥基。 X20 and X21 are preferably alkoxy groups, halogen atoms, cyano groups, isocyanate groups, or hydroxyl groups, more preferably alkoxy groups or hydroxyl groups, and more preferably alkoxy groups or hydroxyl groups with 1 to 4 carbon atoms, especially Preferably it is methoxy, ethoxy, or hydroxy.

胺骨架-NR 100-如上所述,於分子內存在至少1個即可,標註p20或p21並以括號括住之重複單元之任一者被取代為上述胺骨架即可,較佳為標註p20並以括號括住之重複單元之一部分。上述胺骨架可存在複數個,該情形時之胺骨架之數量較佳為1~10,更佳為1~5,進而較佳為2~5。又,於該情形時,較佳為於相鄰之胺骨架之間具有-{C(R x20)(R x21)} p200-,p200較佳為1~10,更佳為1~5。p200包含於p20之總數中。 Amine skeleton - NR 100 - as mentioned above, at least one in the molecule is sufficient, and any one of the repeating units marked p20 or p21 and enclosed in brackets is substituted with the above-mentioned amine skeleton, preferably marked p20 part of a repeating unit enclosed in parentheses. The said amine skeleton may exist plurally, and the number of the amine skeleton in this case becomes like this. Preferably it is 1-10, More preferably, it is 1-5, More preferably, it is 2-5. Also, in this case, it is preferable to have -{C(R x20 )(R x21 )} p200 - between adjacent amine skeletons, and p200 is preferably 1-10, more preferably 1-5. p200 is included in the total number of p20.

於胺骨架-NR 100-中,於R 100為烷基之情形時,碳數較佳為5以下,更佳為3以下。胺骨架-NR 100-較佳為-NH-(R 100為氫原子)。 In the amine skeleton -NR 100 -, when R 100 is an alkyl group, the carbon number is preferably 5 or less, more preferably 3 or less. The amine skeleton -NR 100 - is preferably -NH- (R 100 is a hydrogen atom).

p20除了被取代為胺骨架之重複單元之數量以外,較佳為1~15,更佳為1~10。p20 is preferably 1-15, more preferably 1-10, except for the number of repeating units substituted with amine skeletons.

p21除了被取代為胺骨架之重複單元之數量以外,較佳為0~5,更佳為0~2。p21 is preferably 0-5, more preferably 0-2, except for the number of repeating units substituted with amine skeletons.

p22及p23較佳為2~3,更佳為3。p22 and p23 are preferably 2-3, more preferably 3.

作為有機矽化合物(C2),較佳為使用如下化合物,該化合物於上述式(c2)中,R x20及R x21均為氫原子,X 20及X 21為烷氧基或羥基(尤其是甲氧基、乙氧基、或羥基),標註p20並以括號括住之重複單元之至少1個被取代為胺骨架-NR 100-,R 100為氫原子,p20為1~10(其中,不包括取代為胺骨架之重複單元之數量),p21為0,p22及p23為3。 As organosilicon compound (C2), it is preferable to use the following compound. In the above-mentioned formula (c2), R x20 and R x21 are both hydrogen atoms, and X 20 and X 21 are alkoxy groups or hydroxyl groups (especially form oxy, ethoxy, or hydroxyl), at least one of the repeating units marked p20 and enclosed in brackets is substituted with an amine skeleton -NR 100 -, R 100 is a hydrogen atom, and p20 is 1 to 10 (wherein, not Including the number of repeating units substituted with amine backbone), p21 is 0, p22 and p23 are 3.

再者,若以上述式(c2)表示下文所記載之實施例中用作化合物(C)之日本專利特開2012-197330號公報所記載之N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷與氯丙基三甲氧基矽烷之反應物(商品名:X-12-5263HP,信越化學工業股份有限公司製造),則R x20及R x21均為氫原子,p20為8(其中,不包括取代為胺骨架之重複單元之數量),p21為0,胺骨架為2個(R 100均為氫原子),兩末端同一,p22及p23為3,X 20及X 21為甲氧基。 Furthermore, if the above-mentioned formula (c2) represents N-2-(aminoethyl)-3- The reaction product of aminopropyltrimethoxysilane and chloropropyltrimethoxysilane (trade name: X-12-5263HP, manufactured by Shin-Etsu Chemical Co., Ltd.), then R x20 and R x21 are both hydrogen atoms, p20 is 8 (excluding the number of repeating units replaced by amine skeletons), p21 is 0, amine skeletons are 2 (R 100 are hydrogen atoms), both ends are the same, p22 and p23 are 3, X 20 and X 21 is methoxy.

有機矽化合物(C2)較佳為下述式(c2-2)所表示之化合物。The organosilicon compound (C2) is preferably a compound represented by the following formula (c2-2).

[化14]

Figure 02_image027
[chemical 14]
Figure 02_image027

於上述式(c2-2)中, X 22及X 23分別獨立為水解性基或羥基,於存在複數個X 22及X 23之情形時,複數個X 22及X 23可分別不同, R x24及R x25分別獨立為碳數1~20之烷基,於存在複數個R x24及R x25之情形時,複數個R x24及R x25可分別不同, -C wH 2w-之一部分之亞甲基之至少1個被取代為胺骨架-NR 100-,R 100為氫原子或烷基, w為1~30之整數(其中,不包括取代為胺骨架之亞甲基之數量), p24及p25分別獨立為1~3之整數。 In the above formula (c2-2), X 22 and X 23 are independently hydrolyzable groups or hydroxyl groups. When there are multiple X 22 and X 23 , the multiple X 22 and X 23 can be different, respectively, R x24 and R x25 are each independently an alkyl group with 1 to 20 carbon atoms. When there are multiple R x24 and R x25 , the multiple R x24 and R x25 may be different from each other, and -C w H 2w -part of methylene At least one of the groups is substituted with an amine skeleton -NR 100 -, R 100 is a hydrogen atom or an alkyl group, w is an integer from 1 to 30 (excluding the number of methylene groups substituted with an amine skeleton), p24 and p25 are each independently an integer of 1-3.

X 22及X 23較佳為烷氧基、鹵素原子、氰基、異氰酸酯基、或羥基,更佳為烷氧基或羥基,進而較佳為碳數1~4之烷氧基或羥基,尤佳為甲氧基、乙氧基、或羥基。 X22 and X23 are preferably alkoxy groups, halogen atoms, cyano groups, isocyanate groups, or hydroxyl groups, more preferably alkoxy groups or hydroxyl groups, and more preferably alkoxy groups or hydroxyl groups with 1 to 4 carbon atoms, especially Preferably it is methoxy, ethoxy, or hydroxy.

胺骨架-NR 100-可存在複數個,該情形時之胺骨架之數量較佳為1~10,更佳為1~5,進而較佳為2~5。又,於該情形時,較佳為於相鄰之胺骨架之間具有伸烷基。上述伸烷基之碳數較佳為1~10,更佳為1~5。相鄰之胺骨架之間之伸烷基之碳數包含於w之總數。 There may be a plurality of amine skeletons -NR 100 -, and in this case, the number of amine skeletons is preferably 1-10, more preferably 1-5, still more preferably 2-5. Also, in this case, it is preferable to have an alkylene group between adjacent amine skeletons. The carbon number of the said alkylene group is preferably 1-10, more preferably 1-5. The carbon number of the alkylene group between adjacent amine skeletons is included in the total number of w.

於胺骨架-NR 100-中,於R 100為烷基之情形時,碳數較佳為5以下,更佳為3以下。胺骨架-NR 100-較佳為-NH-(R 100為氫原子)。 In the amine skeleton -NR 100 -, when R 100 is an alkyl group, the carbon number is preferably 5 or less, more preferably 3 or less. The amine skeleton -NR 100 - is preferably -NH- (R 100 is a hydrogen atom).

R x24及R x25較佳為碳數1~10之烷基,更佳為碳數1~5之烷基。 R x24 and R x25 are preferably an alkyl group having 1 to 10 carbons, more preferably an alkyl group having 1 to 5 carbons.

p24及p25較佳為2~3之整數,更佳為3。p24 and p25 are preferably an integer of 2-3, more preferably 3.

w較佳為1以上,更佳為2以上,又,較佳為20以下,更佳為10以下。w is preferably at least 1, more preferably at least 2, and is preferably at most 20, more preferably at most 10.

1-2-3-3.下述式(c3)所表示之有機矽化合物(C)(以下為有機矽化合物(C3))1-2-3-3. Organosilicon compound (C) represented by the following formula (c3) (hereinafter referred to as organosilicon compound (C3))

[化15]

Figure 02_image029
於上述式(c3)中, Z 31、Z 32分別獨立為水解性基及羥基以外之反應性官能基。作為反應性官能基,可例舉:乙烯基、α-甲基乙烯基、苯乙烯基、甲基丙烯醯基、丙烯醯基、胺基、環氧基、脲基、或巰基。作為Z 31、Z 32,較佳為胺基、巰基、或甲基丙烯醯基,尤佳為胺基。 [chemical 15]
Figure 02_image029
In the above formula (c3), Z 31 and Z 32 are each independently a hydrolyzable group and a reactive functional group other than a hydroxyl group. The reactive functional group may, for example, be a vinyl group, α-methylvinyl group, styryl group, methacryl group, acryl group, amine group, epoxy group, ureido group, or mercapto group. Z 31 and Z 32 are preferably an amino group, a mercapto group, or a methacryl group, and are particularly preferably an amino group.

R x31、R x32、R x33、R x34分別獨立為氫原子或碳數1~4之烷基,於存在複數個R x31之情形時,複數個R x31可分別不同,於存在複數個R x32之情形時,複數個R x32可分別不同,於存在複數個R x33之情形時,複數個R x33可分別不同,於存在複數個R x34之情形時,複數個R x34可分別不同。R x31、R x32、R x33、R x34較佳為氫原子或碳數1~2之烷基,更佳為氫原子。 R x31 , R x32 , R x33 , and R x34 are each independently a hydrogen atom or an alkyl group with 1 to 4 carbons. When there are multiple R x31s , the multiple R x31s can be different. When there are multiple R x32 In the case of , the plurality of Rx32 can be different, and when there is a plurality of Rx33 , the plurality of Rx33 can be different, and when there is a plurality of Rx34 , the plurality of Rx34 can be different. R x31 , R x32 , R x33 , and R x34 are preferably a hydrogen atom or an alkyl group having 1 to 2 carbons, more preferably a hydrogen atom.

Rf x31、Rf x32、Rf x33、Rf x34分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf x31之情形時,複數個Rf x31可分別不同,於存在複數個Rf x32之情形時,複數個Rf x32可分別不同,於存在複數個Rf x33之情形時,複數個Rf x33可分別不同,於存在複數個Rf x34之情形時,複數個Rf x34可分別不同。Rf x31、Rf x32、Rf x33、Rf x34較佳為1個以上之氫原子被取代為氟原子之碳數1~10之烷基或氟原子。 Rf x31 , Rf x32 , Rf x33 , and Rf x34 are each independently an alkyl group with 1 to 20 carbon atoms or a fluorine atom in which one or more hydrogen atoms are replaced by fluorine atoms. When there are multiple Rf x31 , the multiple Rf x31 can be different respectively. When there are multiple Rf x32 , the multiple Rf x32 can be different. When there are multiple Rf x33 , the multiple Rf x33 can be different. In the case of multiple Rf x34 , the plurality of Rf x34 may be different from each other. Rf x31 , Rf x32 , Rf x33 , and Rf x34 are preferably C 1-10 alkyl groups or fluorine atoms in which one or more hydrogen atoms are substituted with fluorine atoms.

Y 31為-NH-、-N(CH 3)-或-O-,於存在複數個Y 31之情形時,複數個Y 31可分別不同。Y 31較佳為-NH-。 Y 31 is -NH-, -N(CH 3 )- or -O-, and when a plurality of Y 31 exists, the plurality of Y 31 may be different from each other. Y 31 is preferably -NH-.

X 31、X 32、X 33、X 34分別獨立為-OR c(R c為氫原子、碳數1~4之烷基、或胺基C 1-3烷基二C 1-3烷氧基矽烷基),於存在複數個X 31之情形時,複數個X 31可分別不同,於存在複數個X 32之情形時,複數個X 32可分別不同,於存在複數個X 33之情形時,複數個X 33可分別不同,於存在複數個X 34之情形時,複數個X 34可分別不同。X 31、X 32、X 33、X 34較佳為R c為氫原子、或碳數1~2之烷基之-OR c,R c更佳為氫原子。 X 31 , X 32 , X 33 , and X 34 are independently -OR c (R c is a hydrogen atom, an alkyl group with 1 to 4 carbons, or an amino C 1-3 alkyldiC 1-3 alkoxy group Silyl group), when there are multiple X 31 , the multiple X 31 can be different, when there are multiple X 32 , the multiple X 32 can be different, when there are multiple X 33 , A plurality of X 33 may be different from each other, and when there are a plurality of X 34 , a plurality of X 34 may be different from each other. X 31 , X 32 , X 33 , and X 34 are preferably -OR c in which R c is a hydrogen atom or an alkyl group having 1 to 2 carbons, and R c is more preferably a hydrogen atom.

p31為0~20之整數,p32、p33、p34分別獨立為0~10之整數,p35為0~5之整數,p36為1~10之整數,p37為0或1。p31較佳為1~15,更佳為3~13,進而較佳為5~10。p32、p33及p34較佳為分別獨立為0~5,更佳為全部為0~2。p35較佳為0~3。p36較佳為1~5,更佳為1~3。p37較佳為1。p31 is an integer of 0-20, p32, p33, and p34 are each independently an integer of 0-10, p35 is an integer of 0-5, p36 is an integer of 1-10, and p37 is 0 or 1. p31 is preferably 1-15, more preferably 3-13, still more preferably 5-10. Preferably, p32, p33, and p34 are each independently 0-5, and all of them are more preferably 0-2. p35 is preferably 0-3. p36 is preferably 1-5, more preferably 1-3. Preferably p37 is 1.

有機矽化合物(C3)滿足Z 31及Z 32之至少一者為胺基、或Y 31之至少一個為-NH-或-N(CH 3)-之條件,且式(c3)所表示之化合物之一個末端為Z 31-,另一個末端為Z 32-,只要-O-不與-O-連續,則p31個-{C(R x31)(R x32)}-單元(U c31)、p32個-{C(Rf x31)(Rf x32)}-單元(U c32)、p33個-{Si(R x33)(R x34)}-單元(U c33)、p34個-{Si(Rf x33)(Rf x34)}-單元(U c34)、p35個-Y 31-單元(U c35)、p36個-{Si(X 31)(X 32)-O}-單元(U c36)、p37個-{Si(X 33)(X 34)}-單元(U c37)分別以任意之順序排列而鍵結地構成。p31個單元(U c31)無需單元(U c31)連續鍵結,中途亦可介隔其他單元鍵結,只要合計為p31個即可。以p32~p37括住之單元(U c32)~單元(U c37)亦同樣如此。 Organosilicon compound (C3) satisfying the condition that at least one of Z 31 and Z 32 is an amino group, or at least one of Y 31 is -NH- or -N(CH 3 )-, and the compound represented by formula (c3) One end is Z 31 -, the other end is Z 32 -, as long as -O- is not continuous with -O-, p31 -{C(R x31 )(R x32 )}-units (U c31 ), p32 pcs-{C(Rf x31 )(Rf x32 )}-unit(U c32 ), p33-{Si(R x33 )(R x34 )}-unit(U c33 ), p34-{Si(Rf x33 ) (Rf x34 )}-unit (U c34 ), p35-Y 31 -unit (U c35 ), p36-{Si(X 31 )(X 32 )-O}-unit (U c36 ), p37- {Si(X 33 )(X 34 )}-units (U c37 ) are respectively arranged in an arbitrary order and bonded to form a structure. The p31 units (U c31 ) do not need to be bonded consecutively by the units (U c31 ), and may be bonded via other units in the middle, as long as the total is p31. The same applies to the units (U c32 ) to (U c37 ) enclosed by p32 to p37.

作為有機矽化合物(C3),較佳為如下化合物,該化合物之Z 31及Z 32為胺基,R x31及R x32為氫原子,p31為3~13(較佳為5~10),R x33及R x34均為氫原子,Rf x31~Rf x34均為1個以上之氫原子被取代為氟原子之碳數1~10之烷基或氟原子,p32~p34均為0~5,Y 31為-NH-,p35為0~5(較佳為0~3),X 31~X 34均為-OH,p36為1~5(較佳為1~3),p37為1。 As the organosilicon compound (C3), the following compounds are preferred. Z 31 and Z 32 of the compound are amino groups, R x31 and R x32 are hydrogen atoms, p31 is 3-13 (preferably 5-10), R x33 and R x34 are both hydrogen atoms, Rf x31 to Rf x34 are all hydrogen atoms replaced by fluorine atoms with an alkyl group with 1 to 10 carbons or fluorine atoms, p32 to p34 are all 0 to 5, Y 31 is -NH-, p35 is 0-5 (preferably 0-3), X 31 -X 34 are all -OH, p36 is 1-5 (preferably 1-3), and p37 is 1.

有機矽化合物(C3)較佳為以下述式(c3-2)表示。The organosilicon compound (C3) is preferably represented by the following formula (c3-2).

[化16]

Figure 02_image031
[chemical 16]
Figure 02_image031

於上述式(c3-2)中,Z 31、Z 32、X 31、X 32、X 33、X 34、Y 31與式(c3)中之該等之含義相同,p41~p44分別獨立為1~6之整數,p45、p46分別獨立為0或1。 In the above formula (c3-2), Z 31 , Z 32 , X 31 , X 32 , X 33 , X 34 , and Y 31 have the same meanings as in formula (c3), and p41 to p44 are independently 1 An integer of ~6, p45 and p46 are independently 0 or 1, respectively.

於式(c3-2)中,Z 31及Z 32較佳為胺基、巰基、或甲基丙烯醯基,尤佳為胺基。X 31、X 32、X 33、X 34較佳為R c為氫原子、或碳數1~2之烷基之-OR c,更佳為R c為氫原子。Y 31較佳為-NH-。p41~p44較佳為1以上,又,較佳為5以下,更佳為4以下。p45、p46較佳為均為0。 In formula (c3-2), Z 31 and Z 32 are preferably amino groups, mercapto groups, or methacryl groups, and are particularly preferably amino groups. X 31 , X 32 , X 33 , and X 34 are preferably -OR c in which R c is a hydrogen atom or an alkyl group having 1 to 2 carbons, more preferably R c is a hydrogen atom. Y 31 is preferably -NH-. p41 to p44 are preferably at least 1, and are preferably at most 5, more preferably at most 4. Both p45 and p46 are preferably zero.

1-2-3-4.兩種以上之式(c3)所表示之化合物藉由X 31~X 34之至少任一者縮合而鍵結而成之化合物(以下為有機矽化合物(C3')) 有機矽化合物(C3')為兩種以上之上述有機矽化合物(C3)藉由上述X 31~X 34之至少任一者縮合而鍵結而成之化合物,兩種以上之上述有機矽化合物(C3)可鍵結成鏈狀,亦可鍵結成環狀。有機矽化合物(C3')例如為由有機矽化合物(C3)所形成之化合物。 1-2-3-4. A compound formed by bonding two or more compounds represented by formula (c3) through condensation of at least any one of X 31 to X 34 (hereinafter referred to as organosilicon compound (C3') ) The organosilicon compound (C3') is a compound formed by bonding two or more of the above-mentioned organosilicon compounds (C3) through condensation of at least any one of the above-mentioned X 31 to X 34 , and two or more of the above-mentioned organosilicon compounds (C3) may be bonded into a chain or may be bonded into a ring. The organosilicon compound (C3') is, for example, a compound formed of an organosilicon compound (C3).

作為有機矽化合物(C3'),例如可例舉藉由上述X 31或X 32縮合而成者,具體而言,為具有2個以上下述式(c31-1)所表示之結構(c31-1)且上述結構(c31-1)彼此藉由下述*3或*4以鏈狀或環狀鍵結而成之化合物,藉由下述*3或*4之鍵結係利用兩種以上上述有機矽化合物(C3)之上述X 31或X 32之縮合, 於下述式(c31-1)之*1及*2分別鍵結有下述式(c31-2)之以p31、p32、p33、p34、p35、(p36)-1、p37括住之單元之至少一種以任意之順序鍵結且末端為Z-之基,針對複數個上述結構(c31-1)各者,鍵結於*1及*2之基可不同, 成為複數個上述結構(c31-1)鍵結成鏈狀時之末端之*3為氫原子,*4為羥基。 As the organosilicon compound (C3'), for example, one obtained by condensation of the above-mentioned X31 or X32 can be mentioned, specifically, it has two or more structures represented by the following formula ( c31-1 ) ( c31- 1) In the compound where the above structure (c31-1) is bonded to each other in a chain or a ring by the following *3 or *4, two or more kinds of bonds are used by the following *3 or *4 Condensation of the above-mentioned X 31 or X 32 of the above-mentioned organosilicon compound (C3), p31, p32, p31, p32, At least one of the units enclosed by p33, p34, p35, (p36)-1, and p37 is bonded in any order and the terminal is a Z-group, and for each of the plural structures (c31-1) above, bonded to The groups of *1 and *2 may be different, and *3 at the end of a plurality of the above-mentioned structures (c31-1) bonded into a chain is a hydrogen atom, and *4 is a hydroxyl group.

[化17]

Figure 02_image033
[chemical 17]
Figure 02_image033

[化18]

Figure 02_image035
[chemical 18]
Figure 02_image035

於上述式(c31-2)中, Z為水解性基及羥基以外之反應性官能基, R x31、R x32、R x33、R x34、Rf x31、Rf x32、Rf x33、Rf x34、Y 31、X 31、X 32、X 33、X 34、p31~p37與上述式(c3)中之該等符號之含義相同。 In the above formula (c31-2), Z is a reactive functional group other than a hydrolyzable group and a hydroxyl group, R x31 , R x32 , R x33 , R x34 , Rf x31 , Rf x32 , Rf x33 , Rf x34 , Y 31 , X 31 , X 32 , X 33 , X 34 , p31 to p37 have the same meanings as those symbols in the above formula (c3).

形成有機矽化合物(C3')時之有機矽化合物(C3)之鍵結數較佳為2~10,更佳為3~8。又,構成有機矽化合物(C3')之兩種以上有機矽化合物(C3)可互不相同,較佳為全部相同。When the organosilicon compound (C3') is formed, the number of bonds of the organosilicon compound (C3) is preferably 2-10, more preferably 3-8. Moreover, two or more organosilicon compounds (C3) constituting the organosilicon compound (C3') may be different from each other, but all are preferably the same.

於構成有機矽化合物(C3')之有機矽化合物(C3)為上述式(c3-2)所表示之化合物之情形時,作為有機矽化合物(C3'),例如可例舉下述式(c31-3)所表示之結構藉由下述*3或*4以鏈狀或環狀鍵結而成之化合物。於下述式(c31-3)所表示之結構鍵結成鏈狀之情形時,成為末端之*3為氫原子,成為末端之*4為羥基。When the organosilicon compound (C3) constituting the organosilicon compound (C3') is a compound represented by the above formula (c3-2), as the organosilicon compound (C3'), for example, the following formula (c31 -3) A compound in which the structure represented by the following *3 or *4 is bonded in a chain or a ring. When the structure represented by the following formula (c31-3) is bonded in a chain, *3 at the end is a hydrogen atom, and *4 at the end is a hydroxyl group.

[化19]

Figure 02_image037
[chemical 19]
Figure 02_image037

上述式(c31-3)中之符號全部與上述式(c3-2)之符號之含義相同。All the symbols in the above formula (c31-3) have the same meanings as the symbols in the above formula (c3-2).

有機矽化合物(C3')較佳為2~10(較佳為3~8)個上述式(c31-3)所表示之結構鍵結而成之化合物。The organosilicon compound (C3') is preferably a compound in which 2 to 10 (preferably 3 to 8) structures represented by the above formula (c31-3) are bonded.

作為有機矽化合物(C),可僅使用一種,亦可使用兩種以上。作為有機矽化合物(C),較佳為使用選自由有機矽化合物(C1)~(C3)及有機矽化合物(C3')所組成之群中之至少一種,更佳為使用選自由有機矽化合物(C1)及有機矽化合物(C2)所組成之群中之至少一種。As the organosilicon compound (C), only one type may be used, or two or more types may be used. As organosilicon compound (C), it is preferable to use at least one selected from the group consisting of organosilicon compounds (C1) to (C3) and organosilicon compound (C3'), more preferably to use organosilicon compound (C1) and at least one of the group consisting of organosilicon compounds (C2).

於撥水層(r)包含有機矽化合物(C)之情形時,源自有機矽化合物(C)之結構較佳為於撥水層(r)中包含5質量%以上,更佳為10質量%以上,進而較佳為15質量%以上,又,較佳為60質量%以下,更佳為50質量%以下,進而較佳為40質量%以下,進而更佳為30質量%以下。此處,源自有機矽化合物(C)之結構係指有機矽化合物(C)及有機矽化合物(C)脫水縮合後之殘基。 尤其是於本發明(第一態樣)之積層體為積層體(2)之情形時,較佳為將源自有機矽化合物(C)之結構調整為上述範圍。又,於本發明(第一態樣)之積層體為積層體(1)之情形時,源自有機矽化合物(C)之結構較佳為於撥水層(r)中包含5質量%以下,更佳為1質量%以下,尤佳為不含源自有機矽化合物(C)之結構。 When the water-repellent layer (r) contains the organosilicon compound (C), the structure derived from the organosilicon compound (C) is preferably contained in the water-repellent layer (r) at least 5% by mass, more preferably 10% by mass % or more, more preferably at least 15 mass %, and more preferably at most 60 mass %, more preferably at most 50 mass %, further preferably at most 40 mass %, even more preferably at most 30 mass %. Here, the structure derived from the organosilicon compound (C) refers to the organosilicon compound (C) and the residue after dehydration condensation of the organosilicon compound (C). Especially when the laminate of the present invention (first aspect) is the laminate (2), it is preferable to adjust the structure derived from the organosilicon compound (C) to the above range. Also, when the laminate of the present invention (first aspect) is the laminate (1), the structure derived from the organosilicon compound (C) is preferably contained in the water-repellent layer (r) at 5% by mass or less , more preferably 1% by mass or less, and especially preferably does not contain a structure derived from an organosilicon compound (C).

又,撥水層(r)可於不阻礙本發明(第一態樣)之效果之範圍內含有矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量於撥水層(r)中較佳為0.1質量%以下,更佳為0.01質量%以下。Also, the water-repellent layer (r) may contain a silanol condensation catalyst, an antioxidant, an antirust agent, an ultraviolet absorber, a light stabilizer, and an antifungal agent within the range that does not hinder the effect of the present invention (first aspect) , antibacterial agent, antiviral agent, biological adhesion prevention agent, deodorant, pigment, flame retardant, antistatic agent and other additives. The amount of the above-mentioned additives in the water-repellent layer (r) is preferably at most 0.1% by mass, more preferably at most 0.01% by mass.

撥水層(r)之厚度較佳為1 nm以上50 nm以下,更佳為1 nm以上40 nm以下,進而較佳為2 nm以上25 nm以下,尤佳為3 nm以上15 nm以下。尤其是於本發明(第一態樣)之積層體為積層體(2)之情形時,較佳為將撥水層(r)之厚度設為上述範圍。又,於本發明(第一態樣)之積層體為積層體(1)之情形時,撥水層(r)之厚度較佳為1 nm以上20 nm以下,更佳為1 nm以上15 nm以下,進而較佳為2 nm以上10 nm以下,尤佳為3 nm以上8 nm以下。藉由將撥水層(r)之厚度設為規定值以上,不僅撥水性,而且耐磨耗性、耐擦傷性等耐久性優異,就該方面而言較佳,又,藉由將上述厚度設為規定值以下,就能夠進一步抑制積層體表面中之抗菌活性之降低(較佳為可進一步提高積層體表面中之抗菌活性)之方面、及透明性優異(換言之,能夠將霧度抑制為較低)之方面而言較佳。再者,於將撥水層(r)之厚度測定至小數點以下之情形時,較佳為將小數點以下四捨五入所得之值滿足上述範圍。The thickness of the water-repellent layer (r) is preferably from 1 nm to 50 nm, more preferably from 1 nm to 40 nm, further preferably from 2 nm to 25 nm, especially preferably from 3 nm to 15 nm. Especially when the laminated body of this invention (1st aspect) is a laminated body (2), it is preferable to make the thickness of a water-repellent layer (r) into the said range. Also, when the laminate of the present invention (first aspect) is the laminate (1), the thickness of the water-repellent layer (r) is preferably from 1 nm to 20 nm, more preferably from 1 nm to 15 nm It is less than or equal to more than 2 nm and not more than 10 nm, and is more preferably not less than 3 nm and not more than 8 nm. By setting the thickness of the water-repellent layer (r) to a predetermined value or more, not only water-repellency, but also excellent durability such as wear resistance and scratch resistance are preferred in this respect. Also, by making the above-mentioned thickness If it is below the specified value, the reduction of the antibacterial activity in the surface of the laminate can be further suppressed (preferably, the antibacterial activity in the surface of the laminate can be further improved), and the transparency is excellent (in other words, the haze can be suppressed to lower) is better. Furthermore, when the thickness of the water-repellent layer (r) is measured below the decimal point, it is preferable that the value obtained by rounding off the decimal point satisfies the above-mentioned range.

撥水層(r)之厚度可藉由撥水層形成用組合物中之固形物成分之濃度、或撥水層形成用組合物之塗佈條件進行調整。撥水層(r)之厚度可藉由橢圓偏光儀或X射線反射測定、截面方向之掃描式透過電子顯微鏡(STEM)測定、X射線光電子光譜法(XPS)、探針式薄膜輪廓儀等進行測定,可根據各層之材質或厚度適當選擇測定方法。The thickness of the water-repellent layer (r) can be adjusted by the concentration of the solid content in the water-repellent layer-forming composition or the coating conditions of the water-repellent layer-forming composition. The thickness of the water-repellent layer (r) can be measured by ellipsometer or X-ray reflection measurement, scanning transmission electron microscope (STEM) measurement of cross-sectional direction, X-ray photoelectron spectroscopy (XPS), probe film profiler, etc. For measurement, a measurement method can be appropriately selected according to the material or thickness of each layer.

於截面方向之STEM測定中,將積層體沿著垂直於基材(s)之方向進行薄片化而切下超薄切片,並利用掃描式透過電子顯微鏡(STEM)觀察該超薄切片之截面,藉此可測定撥水層(r)之厚度。 作為積層體之薄片化之方法,只要可加工成厚度100 nm以下之超薄切片即可,可例舉:聚焦離子束加工法、超薄切片機法、冷凍超薄切片機加工法等。例如於使用聚焦離子束加工法之情形時,離子源較佳為Ga,加速電壓較佳為設為30 kV左右。 於STEM觀察時,較佳為將加速電壓設為20kv~30 kV,將電流值設為50 pA~100 pA,將倍率設為50萬~100萬倍。再者,於STEM觀察中,為了容易分辨撥水層(r)與外界之界面,而可於薄片化之前,利用氈筆等將撥水層(r)之上表面塗黑後進行測定。 In the STEM measurement of the cross-sectional direction, the laminate is thinned along the direction perpendicular to the substrate (s) to cut an ultra-thin section, and the section of the ultra-thin section is observed with a scanning transmission electron microscope (STEM). This can measure the thickness of the water-repellent layer (r). As a method for thinning the laminate, any ultrathin sections with a thickness of 100 nm or less may be processed, and examples thereof include focused ion beam processing, ultramicrotome processing, and cryo-ultramicrotome processing. For example, when using the focused ion beam processing method, the ion source is preferably Ga, and the accelerating voltage is preferably set to about 30 kV. In the case of STEM observation, it is preferable to set the accelerating voltage to 20 kv to 30 kV, the current value to 50 pA to 100 pA, and the magnification to 500,000 to 1,000,000 times. In addition, in STEM observation, in order to easily distinguish the interface between the water-repellent layer (r) and the outside world, the upper surface of the water-repellent layer (r) may be blackened with a felt pen or the like prior to sheeting before measurement.

於本發明(第一態樣)之積層體為積層體(1)之情形時,亦可如下文所述之實施例所記載般,基於由使用玻璃作為基材(s)之材質之積層體樣品獲得之校準曲線,算出撥水層(r)之厚度。具體而言,使用玻璃作為基材(s)之材質,準備複數個(較佳為3個以上)層(c)之厚度相同且撥水層(r)之厚度不同之積層體樣品,使用橢圓偏光儀分別測定撥水層(r)之厚度。又,對該樣品進行XPS測定,求出源自撥水層(r)之特定之元素量與源自層(c)之特定之元素量之比,製作相對於撥水層(r)之厚度之上述比之校準曲線。然後,對實際獲得之積層體進行XPS測定,藉此求出源自撥水層(r)之特定之元素量與源自層(c)之特定之元素量之比,依照上述校準曲線,能夠算出撥水層(r)之厚度。When the laminated body of the present invention (first aspect) is the laminated body (1), it can also be based on a laminated body using glass as the material of the base material (s) as described in the examples described below. Calculate the thickness of the water-repellent layer (r) from the calibration curve obtained from the sample. Specifically, using glass as the material of the substrate (s), prepare a plurality of (preferably 3 or more) laminate samples with the same thickness of the layers (c) and different thicknesses of the water-repellent layer (r), and use an ellipse A polarimeter measures the thickness of the water-repellent layer (r) respectively. In addition, XPS measurement was performed on this sample, and the ratio of the specific element amount derived from the water-repellent layer (r) to the specific element amount derived from the layer (c) was obtained, and the thickness relative to the water-repellent layer (r) was prepared. The calibration curve of the above ratio. Then, XPS measurement is carried out on the actually obtained laminated body, thereby obtaining the ratio of the specific element amount originating from the water-repellent layer (r) to the specific element amount originating from the layer (c), and according to the above-mentioned calibration curve, it can be Calculate the thickness of the water-repellent layer (r).

再者,於基材(s)之材質為有機系材料之情形時,存在由於基材(s)與撥水層(r)之折射率差較小而導致難以利用橢圓偏光儀測定膜厚之情形。此時,進行截面方向之STEM測定或使用上述校準曲線之測定即可。Furthermore, when the material of the substrate (s) is an organic material, it is difficult to measure the film thickness with an ellipsometer due to the small difference in refractive index between the substrate (s) and the water-repellent layer (r). situation. In this case, STEM measurement in the cross-sectional direction or measurement using the above-mentioned calibration curve may be performed.

1-3.層(c) 於本發明(第一態樣)之積層體中,亦可於基材(s)與撥水層(r)之間設置有層(c)。於本發明(第一態樣)之積層體包含層(c)之情形,即為積層體(1)之情形時,較佳為具有鍵結有水解性基或羥基之矽原子之有機矽化合物(C)包含於層(c)中。於層(c)包含有機矽化合物(C)之情形時,層(c)可發揮作為撥水層(r)之底塗層之功能,撥水層(r)對基材(s)之密接性變得良好,其結果為,積層體之耐磨耗性可提高。作為層(c)所含之有機矽化合物(C),與上述所說明之有機矽化合物(C)相同,其較佳之態樣亦相同。 1-3. Layer (c) In the laminate of the present invention (first aspect), a layer (c) may be provided between the substrate (s) and the water-repellent layer (r). When the laminate of the present invention (first aspect) includes the layer (c), that is, in the case of the laminate (1), it is preferably an organosilicon compound having a silicon atom bonded to a hydrolyzable group or a hydroxyl group (C) is contained in layer (c). In the case where layer (c) contains organosilicon compound (C), layer (c) can function as a primer layer of water-repellent layer (r), and the adhesion of water-repellent layer (r) to substrate (s) As a result, the wear resistance of the laminate can be improved. The organosilicon compound (C) contained in the layer (c) is the same as the organosilicon compound (C) described above, and its preferred aspects are also the same.

於層(c)包含有機矽化合物(C)之情形時,層(c)通常可藉由塗佈有機矽化合物(C)之混合組合物(以下有時稱為層(c)形成用組合物)並使其硬化而獲得。如上文所述,有機矽化合物(C)為具有鍵結有水解性基或羥基之矽原子之化合物,鍵結於有機矽化合物(C)所具有之-SiOH基或矽原子之水解性基之水解所產生之有機矽化合物(C)之-SiOH基與源自有機矽化合物(C)之-SiOH基、或積層體中供形成層(c)之面之活性氫(羥基等)脫水縮合,因此層(c)可具有有機矽化合物(C)之脫水縮合物(即源自有機矽化合物(C)之縮合結構)。再者,層(c)所含之有機矽化合物(C)可全部為脫水縮合物。In the case where the layer (c) contains an organosilicon compound (C), the layer (c) can generally be coated with a mixed composition of the organosilicon compound (C) (hereinafter sometimes referred to as layer (c) forming composition ) and harden it. As mentioned above, the organosilicon compound (C) is a compound having a silicon atom bonded to a hydrolyzable group or a hydroxyl group, and a compound bonded to the -SiOH group possessed by the organosilicon compound (C) or a hydrolyzable group of a silicon atom The -SiOH group of the organosilicon compound (C) produced by hydrolysis dehydrates and condenses with the -SiOH group derived from the organosilicon compound (C), or the active hydrogen (hydroxyl group, etc.) on the surface of the layer (c) in the laminate, Therefore, the layer (c) may have a dehydration condensate of the organosilicon compound (C) (ie, a condensation structure derived from the organosilicon compound (C)). Furthermore, all the organosilicon compounds (C) contained in the layer (c) may be dehydration condensates.

源自有機矽化合物(C)之結構較佳為於層(c)中包含80質量%以上,更佳為包含90質量%以上,進而較佳為包含98質量%以上,又,可為100質量%。The structure derived from the organosilicon compound (C) is preferably contained in layer (c) at least 80% by mass, more preferably at least 90% by mass, still more preferably at least 98% by mass, and may be 100% by mass %.

又,層(c)可於不阻礙本發明(第一態樣)之效果之範圍內含有矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量於層(c)中較佳為0.1質量%以下,更佳為0.01質量%以下。In addition, the layer (c) may contain a silanol condensation catalyst, an antioxidant, an antirust agent, an ultraviolet absorber, a light stabilizer, an antifungal agent, an antibacterial agent, antiviral agent, anti-fouling agent, deodorant, pigment, flame retardant, antistatic agent and other additives. The amount of the aforementioned additives is preferably at most 0.1% by mass, more preferably at most 0.01% by mass, in layer (c).

於本發明(第一態樣)之積層體具有層(c)之情形時,層(c)之厚度於積層部之厚度不超過50 nm之範圍內適當調整即可,較佳為1 nm以上40 nm以下,更佳為2 nm以上35 nm以下,進而較佳為3 nm以上30 nm以下,最佳為5 nm以上25 nm以下。又,亦較佳為將層(c)之厚度設為未達30 nm。藉由將層(c)之厚度設為1 nm以上,耐磨耗性、耐擦傷性等耐久性優異,就該方面而言較佳。又,藉由將層(c)之厚度設為40 nm以下(較佳為未達30 nm),就能夠進一步抑制積層體表面中之抗菌活性之降低(較佳為可進一步提高積層體表面中之抗菌活性)之方面、及透明性優異之方面而言較佳。再者,於將層(c)之厚度測定至小數點以下之情形時,較佳為將小數點以下四捨五入所得之值滿足上述範圍。In the case where the laminate of the present invention (first aspect) has layer (c), the thickness of layer (c) can be appropriately adjusted within the range where the thickness of the laminate part does not exceed 50 nm, preferably 1 nm or more 40 nm or less, more preferably 2 nm or more and 35 nm or less, further preferably 3 nm or more and 30 nm or less, most preferably 5 nm or more and 25 nm or less. Moreover, it is also preferable to make the thickness of layer (c) less than 30 nm. By setting the thickness of the layer (c) to 1 nm or more, durability such as wear resistance and scratch resistance is excellent in this point, which is preferable. Also, by making the thickness of the layer (c) below 40 nm (preferably less than 30 nm), the reduction of the antibacterial activity in the surface of the laminate can be further suppressed (preferably, the antibacterial activity in the surface of the laminate can be further increased). Antibacterial activity) and excellent transparency are preferred. Furthermore, when measuring the thickness of the layer (c) below the decimal point, it is preferable that the value obtained by rounding off the decimal point satisfies the above-mentioned range.

層(c)之厚度可藉由層(c)形成用組合物中之固形物成分之濃度、或層(c)形成用組合物之塗佈條件進行調整。層(c)之厚度可藉由橢圓偏光儀或X射線反射測定、X射線光電子光譜法(XPS)、截面方向之STEM測定、探針式薄膜輪廓儀等進行測定,可根據各層之材質或厚度適當選擇測定方法。於藉由截面方向之STEM測定對層(c)之厚度進行測定之情形時,可與上述撥水層(r)之厚度之測定同樣地,藉由將積層體沿著垂直於基材(s)之方向進行薄片化而切下超薄切片,並對該超薄切片之截面進行STEM觀察而進行測定,亦可藉由利用與上述同樣之方法將塗佈撥水層形成用組合物之前(即於基材(s)僅設置有層(c)之狀態)之積層中間物進行薄片化,並對截面進行STEM觀察而進行測定。再者,於對積層中間物之截面進行STEM觀察之情形時,為了容易分辨層(c)與外界之界面,可於薄片化之前利用氈筆等將層(c)之上表面塗黑後進行測定。The thickness of the layer (c) can be adjusted by the concentration of the solid content in the layer (c) forming composition or the coating conditions of the layer (c) forming composition. The thickness of layer (c) can be measured by ellipsometer or X-ray reflection measurement, X-ray photoelectron spectroscopy (XPS), STEM measurement of cross-sectional direction, probe-type film profiler, etc. It can be measured according to the material or thickness of each layer Choose the measurement method appropriately. In the case of measuring the thickness of the layer (c) by STEM measurement in the cross-sectional direction, the thickness of the water-repellent layer (r) can be measured by placing the laminate along the direction perpendicular to the substrate (s ) in the direction of slicing and cutting ultra-thin slices, and measuring the cross-section of the ultra-thin slices by STEM observation, it can also be measured by using the same method as above before applying the composition for forming a water-repellent layer ( That is, the layered intermediate in the state where only the layer (c) is provided on the substrate (s) is thinned, and the cross-section is observed and measured by STEM. Furthermore, in the case of STEM observation of the cross-section of the laminated intermediate, in order to easily distinguish the interface between the layer (c) and the outside world, the upper surface of the layer (c) can be blackened with a felt pen or the like before thinning. Determination.

積層部之厚度為1 nm以上50 nm以下。積層部之厚度較佳為2 nm以上45 nm以下,更佳為5 nm以上40 nm以下,進而較佳為5 nm以上未達40 nm,進而更佳為6 nm以上30 nm以下,尤佳為6 nm以上15 nm以下。又,亦可將積層部之厚度設為未達15.0 nm。藉由將積層部之厚度設為1 nm以上,不僅撥水性,而且耐磨耗性、耐擦傷性等耐久性優異,就該方面而言較佳。又,藉由將積層部之厚度設為50 nm以下,就不會使積層體表面中之抗菌活性降低(較佳為可進一步提高積層體表面中之抗菌活性)之方面而言較佳。又,就透明性之觀點而言,積層部之厚度較佳為未達40 nm,更佳為30 nm以下。再者,於將積層部之厚度測定至小數點以下之情形時,將小數點以下四捨五入所得之值滿足上述範圍即可。The thickness of the layered part is not less than 1 nm and not more than 50 nm. The thickness of the layered part is preferably from 2 nm to 45 nm, more preferably from 5 nm to 40 nm, still more preferably from 5 nm to 40 nm, still more preferably from 6 nm to 30 nm, especially preferably Above 6 nm and below 15 nm. In addition, the thickness of the layered portion may be set to be less than 15.0 nm. By setting the thickness of the layered part to 1 nm or more, not only water repellency but also durability such as wear resistance and scratch resistance are excellent, which is preferable in this point. In addition, it is preferable that the antibacterial activity on the surface of the laminate is not reduced (preferably, the antibacterial activity on the surface of the laminate can be further increased) by setting the thickness of the laminated part to 50 nm or less. Also, from the viewpoint of transparency, the thickness of the layered portion is preferably less than 40 nm, more preferably less than 30 nm. In addition, when the thickness of the laminated part is measured below the decimal point, the value obtained by rounding off the decimal point may satisfy the above-mentioned range.

積層部之厚度可藉由截面方向之STEM測定或探針式薄膜輪廓儀、將撥水層(r)及層(c)之各層之厚度加以合計等求出,可根據各層之材質或厚度適當選擇測定方法。再者,於藉由截面方向之STEM測定對積層部之厚度進行測定之情形時,藉由與上述利用STEM測定對撥水層(r)之厚度進行測定同樣之方法進行測定即可。The thickness of the laminated part can be obtained by STEM measurement in the cross-sectional direction or a probe-type film profiler, and the total thickness of each layer of the water-repellent layer (r) and layer (c), etc., and can be determined according to the material or thickness of each layer. Select the measurement method. In addition, when measuring the thickness of the laminated part by the STEM measurement of a cross-sectional direction, it may measure by the same method as measuring the thickness of the water-repellent layer (r) by the said STEM measurement.

1-4.積層體之特性 於測定本發明(第一態樣)之積層體之撥水層(r)表面時,於觀察金屬及氟原子之情形時,所觀察之金屬與氟原子之物質量比(金屬/氟原子)較佳為0.0001以上,更佳為0.001以上,又,較佳為1以下,更佳為0.5以下,進而較佳為0.1以下。作為金屬,可例舉源自上述金屬離子(K2)之金屬。又,作為氟原子,例如可例舉源自上述有機矽化合物(A)之氟原子、及源自上述有機矽化合物(B)之氟原子。因此,藉由將測定撥水層(r)表面時之金屬與氟原子之物質量比(金屬/氟原子)設為上述範圍,而能夠同時實現更良好之撥水性及抗菌性。再者,上述撥水層(r)表面之測定可使用X射線光電子光譜法(XPS)或STEM-EDS(Energy-dispersive X-ray spectroscopy,能量分散型X射線分析)。 1-4. Characteristics of laminates When measuring the surface of the water-repellent layer (r) of the laminate of the present invention (first aspect), when observing the situation of metal and fluorine atoms, the observed mass ratio of metal to fluorine atoms (metal/fluorine atoms) It is preferably at least 0.0001, more preferably at least 0.001, and more preferably at most 1, more preferably at most 0.5, still more preferably at most 0.1. The metal may, for example, be a metal derived from the aforementioned metal ion (K2). Moreover, as a fluorine atom, the fluorine atom derived from the said organosilicon compound (A) and the fluorine atom derived from the said organosilicon compound (B) are mentioned, for example. Therefore, by setting the material mass ratio (metal/fluorine atom) of the metal and the fluorine atom when measuring the surface of the water-repellent layer (r) to the above-mentioned range, better water-repellency and antibacterial properties can be simultaneously achieved. Furthermore, X-ray photoelectron spectroscopy (XPS) or STEM-EDS (Energy-dispersive X-ray spectroscopy, energy-dispersive X-ray analysis) can be used to measure the surface of the water-repellent layer (r).

本發明(第一態樣)之積層體之撥水層(r)表面之水接觸角(初始接觸角)例如為105°以上,較佳為110°以上,更佳為115°以上,又,例如為125°以下。The water contact angle (initial contact angle) on the surface of the water-repellent layer (r) of the laminate of the present invention (first aspect) is, for example, 105° or more, preferably 110° or more, more preferably 115° or more, and, For example, it is 125° or less.

以直徑6 mm之圓為單位施加荷重1000 g,將本發明(第一態樣)之積層體之撥水層(r)表面摩擦1500次(1個往復為1次),進行該耐磨耗試驗後之撥水層(r)表面之水接觸角(1500次後接觸角)例如為75°以上,較佳為100°以上,更佳為105°以上,進而較佳為110°以上,又,例如為120°以下。於上述耐磨耗試驗中,於摩擦時較佳為利用彈性體(較佳為橡皮擦)進行摩擦。耐磨耗試驗之行程距離例如為40 mm,摩擦之速度設為40個往復/分鐘,於行程區域之大致中央測定接觸角即可。於負載荷重時,施加與以直徑6 mm之圓之面積為單位施加1000 g之荷重同等之壓力即可。Apply a load of 1000 g on a circle with a diameter of 6 mm as a unit, and rub the surface of the water-repellent layer (r) of the laminate of the present invention (first aspect) 1500 times (one reciprocation is one time) to perform the abrasion resistance The water contact angle (contact angle after 1500 times) of the surface of the water-repellent layer (r) after the test is, for example, 75° or more, preferably 100° or more, more preferably 105° or more, and more preferably 110° or more. , such as 120° or less. In the above abrasion resistance test, it is preferable to use an elastic body (preferably an eraser) for rubbing during rubbing. The stroke distance of the wear resistance test is, for example, 40 mm, the friction speed is set to 40 reciprocations/minute, and the contact angle can be measured in the approximate center of the stroke area. When loading a load, apply the same pressure as the area of a circle with a diameter of 6 mm to apply a load of 1000 g.

又,以直徑6 mm之圓為單位施加荷重1000 g,將本發明(第一態樣)之積層體之撥水層(r)表面摩擦3000次(1個往復為1次),進行該耐磨耗試驗後之撥水層(r)表面之水接觸角(3000次後接觸角)例如為73°以上,較佳為100°以上,更佳為105°以上,進而較佳為110°以上,又,例如為120°以下。再者,上述耐磨耗試驗之條件與測定1500次後接觸角時之條件相同。In addition, a load of 1000 g was applied in units of a circle with a diameter of 6 mm, and the surface of the water-repellent layer (r) of the laminate of the present invention (first aspect) was rubbed 3000 times (one reciprocation is one time), and the resistance was carried out. The water contact angle (contact angle after 3000 times) of the surface of the water-repellent layer (r) after the abrasion test is, for example, 73° or higher, preferably 100° or higher, more preferably 105° or higher, and more preferably 110° or higher , and, for example, 120° or less. In addition, the conditions of the above-mentioned abrasion resistance test are the same as the conditions for measuring the contact angle after 1500 times.

本發明(第一態樣)之撥水層(r)表面之動摩擦係數較佳為0.1以下,更佳為0.090以下,進而較佳為0.080以下,又,可為0.010以上。The kinetic friction coefficient of the surface of the water-repellent layer (r) of the present invention (first aspect) is preferably at most 0.1, more preferably at most 0.090, still more preferably at most 0.080, and may be at least 0.010.

使用油性筆於撥水層(r)表面繪製3條線,其後於利用Savina(註冊商標)將撥水層(r)表面擦拭1次時,較佳為能夠將上述線擦拭2條以上,更佳為3條均能夠擦拭。上述線可為直線狀,亦可為曲線狀,亦可為將始點與終點相連的三角形狀、四邊形狀或圓形狀。Use an oil-based pen to draw 3 lines on the surface of the water-repellent layer (r), and then use Savina (registered trademark) to wipe the surface of the water-repellent layer (r) once, preferably to be able to wipe 2 or more of the above-mentioned lines, More preferably, all three can be wiped off. The above-mentioned line may be straight, curved, or triangular, square, or circular connecting the start point and the end point.

於進行施加250 g/cm 2之壓力並利用鋼絲絨摩擦上述積層體之撥水層(r)表面之磨耗試驗直至於撥水層(r)表面目視確認到剝離或損傷時,鋼絲絨於撥水層(r)表面往復之次數例如為100次以上,較佳為300次以上,更佳為500次以上,進而較佳為3000次以上,尤佳為4000次以上,又,例如為10000次以下。 When performing an abrasion test in which a pressure of 250 g/ cm2 is applied and the surface of the water-repellent layer (r) of the above-mentioned laminate is rubbed with steel wool until peeling or damage is visually confirmed on the surface of the water-repellent layer (r), the steel wool The number of reciprocating times on the surface of the water layer (r) is, for example, more than 100 times, preferably more than 300 times, more preferably more than 500 times, more preferably more than 3000 times, especially preferably more than 4000 times, and, for example, 10000 times the following.

依照JIS Z 8722進行測定時之本發明(第一態樣)之積層體之霧度較佳為5.0以下,更佳為4.0以下,進而較佳為3.0以下,進而更佳為2.5以下,進而更佳為1.5以下,尤佳為1.0以下,又,例如為0.01以上。The haze of the laminate of the present invention (first aspect) when measured in accordance with JIS Z 8722 is preferably 5.0 or less, more preferably 4.0 or less, further preferably 3.0 or less, still more preferably 2.5 or less, still more preferably Preferably it is 1.5 or less, especially preferably 1.0 or less, and, for example, 0.01 or more.

進行依照JIS Z 2801:2010之抗菌活性試驗時之本發明(第一態樣)之積層體對金黃色葡萄球菌之抗菌活性值例如超過0,較佳為0.1以上,更佳為2.0以上,進而較佳為2.5以上,尤佳為3以上,又,例如為7以下。When the antibacterial activity test according to JIS Z 2801:2010 is carried out, the antibacterial activity value of the laminate of the present invention (first aspect) against Staphylococcus aureus exceeds 0, preferably 0.1 or above, more preferably 2.0 or above, and further Preferably it is 2.5 or more, especially preferably 3 or more, and, for example, 7 or less.

進行依照JIS Z 2801:2010之抗菌活性試驗時之本發明(第一態樣)之積層體對大腸桿菌之抗菌活性值例如超過0,較佳為0.1以上,更佳為2.0以上,進而較佳為2.5以上,尤佳為3以上,又,例如為7以下。When the antibacterial activity test according to JIS Z 2801:2010 is carried out, the antibacterial activity value of the laminate of the present invention (first aspect) against Escherichia coli is, for example, more than 0, preferably 0.1 or more, more preferably 2.0 or more, and even more preferably It is 2.5 or more, preferably 3 or more, and, for example, 7 or less.

除了變更菌以外進行與JIS Z 2801:2010所記載之抗菌活性試驗同樣之試驗時之本發明(第一態樣)之積層體對表皮葡萄球菌之抗菌活性值例如超過0,較佳為0.1以上,更佳為2.0以上,進而較佳為2.5以上,尤佳為3以上,又,例如為7以下。The antibacterial activity value of the laminate of the present invention (first aspect) against Staphylococcus epidermidis when the same test as the antibacterial activity test described in JIS Z 2801:2010 is performed except for the modified bacteria is, for example, more than 0, preferably 0.1 or more , more preferably 2.0 or more, still more preferably 2.5 or more, particularly preferably 3 or more, and, for example, 7 or less.

於將施加電壓設為500 V,於將本發明(第一態樣)之積層體於80℃保持36小時之耐熱試驗之前後測定於撥水層(r)表面所測定之表面電阻率時,耐熱試驗後之表面電阻率相對於耐熱試驗前之表面電阻率,較佳為未達6.4倍,更佳為4.0倍以下,進而較佳為3.5倍以下,尤佳為3.3倍以下,下限並無特別限定,可為1.0倍,亦可為1.5倍。再者,耐熱試驗前之表面電阻率較佳為於約0℃~35℃之範圍下所管理之本發明(第一態樣)之積層體所測定之表面電阻率。When the applied voltage was set to 500 V, and the surface resistivity measured on the surface of the water-repellent layer (r) was measured before and after a heat resistance test in which the laminate of the present invention (first aspect) was kept at 80°C for 36 hours, The surface resistivity after the heat resistance test is preferably less than 6.4 times, more preferably 4.0 times or less, further preferably 3.5 times or less, especially preferably 3.3 times or less, with respect to the surface resistivity before the heat resistance test. Especially limited, it may be 1.0 times or 1.5 times. Furthermore, the surface resistivity before the heat resistance test is preferably the surface resistivity measured in the laminated body of the present invention (first aspect) managed in the range of about 0°C to 35°C.

本發明(第一態樣)之積層體較佳為具有上述特性中之至少一種以上,更佳為組合具有上述特性中之兩種以上。再者,於實施例之欄對各特性之評價之具體之方法進行詳細說明。The laminate of the present invention (first aspect) preferably has at least one or more of the above properties, and more preferably has a combination of two or more of the above properties. In addition, the concrete method of evaluating each characteristic is demonstrated in detail in the column of an Example.

1-5.積層體之製造方法 繼而,對本發明(第一態樣)之積層體之製造方法進行說明。 1-5. Manufacturing method of laminated body Next, the manufacturing method of the laminated body of this invention (1st aspect) is demonstrated.

1-5-1.積層體(1)之製造方法 於本發明(第一態樣)之積層體為積層體(1)之情形時,製造積層體(1)之方法包括:(i)於基材(s)上塗佈層(c)形成用組合物之步驟;(ii)使上述層(c)形成用組合物之塗佈層硬化之步驟;(iii)於上述層(c)形成用組合物之塗佈面塗佈撥水層形成用組合物(以下將製造積層體(1)所使用之撥水層形成用組合物稱為撥水層形成用組合物(1))之步驟;及(iv)使上述撥水層形成用組合物(1)之塗佈層硬化之步驟,由上述層(c)形成用組合物之塗佈層形成上述層(c),由上述撥水層形成用組合物(1)之塗佈層形成上述撥水層(r)。 1-5-1. Manufacturing method of laminate (1) When the laminated body of the present invention (first aspect) is the laminated body (1), the method for manufacturing the laminated body (1) includes: (i) coating the layer (c) on the substrate (s) for forming Step of composition; (ii) step of hardening the coating layer of the composition for forming the layer (c); (iii) coating the coating surface of the composition for forming the layer (c) for forming a water-repellent layer Composition (hereinafter, the composition for forming a water-repellent layer used in the production of the laminate (1) is referred to as the composition for forming a water-repellent layer (1)); and (iv) making the composition for forming a water-repellent layer (1) The step of hardening the coating layer, forming the above-mentioned layer (c) from the coating layer of the above-mentioned layer (c)-forming composition, forming the above-mentioned coating layer from the coating layer of the above-mentioned water-repellent layer-forming composition (1). Water-repellent layer (r).

上述層(c)形成用組合物為有機矽化合物(C)之混合組合物。有機矽化合物(C)之混合組合物可藉由混合有機矽化合物(C)而獲得,於混合有機矽化合物(C)以外之成分之情形時,可藉由將有機矽化合物(C)與其他成分混合而獲得。層(c)形成用組合物亦包含混合後例如於保管中進行反應者,作為進行反應之例,可例舉上述層(c)形成用組合物包含鍵結於上述有機矽化合物(C)之矽原子之水解性基因水解而成為-SiOH基之化合物(以下有時稱為有機矽化合物(C)之水解物)。又,作為進行反應之例,亦可例舉層(c)形成用組合物包含上述有機矽化合物(C)之縮合物,作為該縮合物,可例舉有機矽化合物(C)所具有之-SiOH基或水解所產生之有機矽化合物(C)之-SiOH基與源自有機矽化合物(C)之-SiOH基、或源自其他化合物之-SiOH基脫水縮合所形成之脫水縮合物。The composition for forming the layer (c) is a mixed composition of the organosilicon compound (C). The mixed composition of organosilicon compound (C) can be obtained by mixing organosilicon compound (C), and in the case of mixing components other than organosilicon compound (C), it can be obtained by mixing organosilicon compound (C) with other Obtained by mixing ingredients. The layer (c) forming composition also includes those that react after mixing, for example, during storage. As an example of performing the reaction, the above-mentioned layer (c)-forming composition includes a compound bonded to the above-mentioned organosilicon compound (C). The hydrolyzable gene of the silicon atom is hydrolyzed to form a -SiOH group compound (hereinafter sometimes referred to as the hydrolyzate of the organosilicon compound (C)). In addition, as an example of carrying out the reaction, a condensate containing the above-mentioned organosilicon compound (C) in the composition for forming the layer (c) may be exemplified. As the condensate, - Dehydration condensation product formed by dehydration condensation of SiOH group or -SiOH group of organosilicon compound (C) generated by hydrolysis and -SiOH group derived from organosilicon compound (C) or -SiOH group derived from other compounds.

上述層(c)形成用組合物較佳為混合有溶劑(E)。溶劑(E)並無特別限定,例如可使用:水、醇系溶劑、酮系溶劑、醚系溶劑、烴系溶劑、酯系溶劑等,尤佳為酯系溶劑。The composition for forming the layer (c) is preferably mixed with a solvent (E). The solvent (E) is not particularly limited. For example, water, alcohol solvents, ketone solvents, ether solvents, hydrocarbon solvents, ester solvents, etc. can be used, and ester solvents are particularly preferred.

作為醇系溶劑,可例舉:甲醇、乙醇、1-丙醇、2-丙醇、1-丁醇等。 作為酮系溶劑,可例舉:丙酮、甲基乙基酮、甲基異丁基酮等。 作為醚系溶劑,可例舉:二乙醚、二丙醚、四氫呋喃、1,4-二㗁烷等。 作為烴系溶劑,可例舉:戊烷、己烷等脂肪族烴系溶劑;環己烷等脂環式烴系溶劑;苯、甲苯、二甲苯等芳香族烴系溶劑等。 作為酯系溶劑,可例舉:乙酸乙酯、乙酸丙酯、乙酸丁酯等。 As an alcoholic solvent, methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, etc. are mentioned. As a ketone solvent, acetone, methyl ethyl ketone, methyl isobutyl ketone, etc. are mentioned. The ether solvent may, for example, be diethyl ether, dipropyl ether, tetrahydrofuran or 1,4-dioxane. Examples of the hydrocarbon solvent include aliphatic hydrocarbon solvents such as pentane and hexane; alicyclic hydrocarbon solvents such as cyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, and xylene. Ethyl acetate, propyl acetate, butyl acetate, etc. are mentioned as an ester type solvent.

將上述層(c)形成用組合物之整體設為100質量%時之有機矽化合物(C)之量較佳為0.01質量%以上,更佳為0.05質量%以上,進而較佳為0.1質量%以上,又,較佳為5質量%以下,更佳為3質量%以下,進而較佳為1質量%以下。上述有機矽化合物(C)之量可於製備組合物時進行調整。又,有機矽化合物(C)之量亦可根據組合物之分析結果而算出。作為根據組合物之分析結果進行特定之方法,例如組合物所含之各化合物之種類可藉由利用氣相層析質譜分析法或液相層析質譜分析法等分析組合物,並對所獲得之分析結果進行庫檢索而特定出,又,組合物所含之各化合物之量可使用校準曲線法,根據上述分析結果而算出。再者,於本說明書中,於記載有各成分之量、質量比或莫耳比之範圍之情形時,該範圍可於製備組合物時進行調整。The amount of the organosilicon compound (C) when the entire composition for forming the layer (c) is 100% by mass is preferably at least 0.01% by mass, more preferably at least 0.05% by mass, still more preferably at least 0.1% by mass The above, and more preferably at most 5% by mass, more preferably at most 3% by mass, further preferably at most 1% by mass. The amount of the above organosilicon compound (C) can be adjusted during the preparation of the composition. In addition, the amount of the organosilicon compound (C) can also be calculated from the analysis results of the composition. As a specific method based on the analysis results of the composition, for example, the type of each compound contained in the composition can be analyzed by using gas chromatography-mass spectrometry or liquid chromatography-mass spectrometry, and the obtained The analysis results are identified by library search, and the amount of each compound contained in the composition can be calculated from the above analysis results using the calibration curve method. In addition, in this specification, when the range of the quantity of each component, mass ratio, or molar ratio is described, this range can be adjusted at the time of preparation of a composition.

將上述層(c)形成用組合物之整體設為100質量%時之溶劑(E)之量較佳為80質量%以上,更佳為85質量%以上,進而較佳為90質量%以上,進而更佳為95質量%以上,進而更佳為98質量%以上,又,可為99.9質量%以下。The amount of the solvent (E) when the whole composition for forming the layer (c) is 100% by mass is preferably at least 80% by mass, more preferably at least 85% by mass, still more preferably at least 90% by mass, More preferably, it is at least 95% by mass, still more preferably at least 98% by mass, and may be at most 99.9% by mass.

又,層(c)形成用組合物可於不阻礙本發明(第一態樣)之效果之範圍內混合有矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量於層(c)形成用組合物100質量%中,較佳為5質量%以下,更佳為1質量%以下。In addition, the layer (c) forming composition may contain a silanol condensation catalyst, an antioxidant, a rust inhibitor, an ultraviolet absorber, a light stabilizer, Various additives such as antifungal agents, antibacterial agents, antiviral agents, antifouling agents, deodorants, pigments, flame retardants, and antistatic agents. The amount of the aforementioned additives is preferably at most 5 mass %, more preferably at most 1 mass %, based on 100 mass % of the layer (c) forming composition.

作為塗佈上述層(c)形成用組合物之方法,例如可例舉:浸漬塗佈法、輥塗法、棒式塗佈法、旋轉塗佈法、噴塗法、模嘴塗佈法、凹版塗佈法等。As a method of coating the composition for forming the layer (c), for example, a dip coating method, a roll coating method, a bar coating method, a spin coating method, a spray coating method, a die coating method, and a gravure coating method are mentioned. coating method, etc.

於塗佈上述層(c)形成用組合物之前,較佳為預先對基材(s)之塗佈面實施易接著處理。作為易接著處理,可例舉:電暈處理、電漿處理、紫外線處理等親水化處理,更佳為電漿處理。藉由進行電漿處理等易接著處理,可於基材之表面形成OH基(尤其是於基材為環氧樹脂之情形時)或COOH基(尤其是於基材為丙烯酸樹脂之情形時)等官能基,於在基材表面形成有此種官能基之情形時,尤其可進一步提高層(c)與基材(s)之密接性。Before coating the layer (c)-forming composition, it is preferable to give an easy-adhesive treatment to the coated surface of the substrate (s). The easy-adhesive treatment includes, for example, hydrophilization treatments such as corona treatment, plasma treatment, and ultraviolet treatment, and more preferably plasma treatment. OH groups (especially when the base material is epoxy resin) or COOH groups (especially when the base material is acrylic resin) can be formed on the surface of the substrate by easy-adhesive treatment such as plasma treatment When such functional groups are formed on the surface of the substrate, the adhesion between the layer (c) and the substrate (s) can be further improved.

於塗佈層(c)形成用組合物後,於常溫、大氣中例如靜置10秒以上(通常為24小時以下),藉此使上述層(c)形成用組合物之塗佈層乾燥,而可由該塗佈層形成上述層(c)。於本發明(第一態樣)中,常溫為5~60℃,較佳為15~40℃之溫度範圍。於常溫下靜置時之濕度條件可設為50~90%RH。又,於塗佈層(c)形成用組合物後,可加熱為超過60℃之溫度(通常為100℃以下,亦可為80℃以下),並保持10秒~60分鐘(較佳為20分鐘~40分鐘)左右。After applying the composition for layer (c) formation, the coating layer of the composition for formation of layer (c) is dried by standing at room temperature and in the atmosphere, for example, for 10 seconds or more (usually less than 24 hours), Instead, the above-mentioned layer (c) can be formed from this coating layer. In the present invention (the first aspect), the normal temperature is in the range of 5 to 60°C, preferably 15 to 40°C. The humidity condition when standing at room temperature can be set to 50~90%RH. Also, after coating the layer (c) forming composition, it may be heated to a temperature exceeding 60°C (usually below 100°C, and may be below 80°C) and kept for 10 seconds to 60 minutes (preferably 20°C). minutes to 40 minutes).

繼而,將撥水層形成用組合物(1)塗佈於上述層(c)形成用組合物之塗佈面,並加以乾燥,藉此可由上述撥水層形成用組合物(1)之塗佈層形成上述撥水層(r)。Next, the water-repellent layer-forming composition (1) is applied to the coated surface of the above-mentioned layer (c)-forming composition, and dried, whereby the coating of the above-mentioned water-repellent layer-forming composition (1) can The cloth layer forms the above-mentioned water-repellent layer (r).

上述撥水層形成用組合物(1)為有機矽化合物(A)之混合組合物,可藉由混合有機矽化合物(A)而獲得。又,於混合有機矽化合物(A)以外之成分之情形時,藉由將上述有機矽化合物(A)與其他成分混合,而獲得撥水層形成用組合物(1)。上述撥水層形成用組合物(1)亦包含混合後例如於保管中進行反應者。作為進行反應之例,例如可例舉上述撥水層形成用組合物(1)包含鍵結於上述有機矽化合物(A)之矽原子(亦可經由連結基而鍵結)之水解性基因水解而成為-SiOH基(亦可Si與OH經由連結基鍵結)之化合物(以下有時稱為有機矽化合物(A)之水解物)。又,亦可例舉上述撥水層形成用組合物(1)包含有機矽化合物(A)之縮合物,作為該縮合物,例如可例舉有機矽化合物(A)所具有之-SiOH基或水解所產生之有機矽化合物(A)之-SiOH基(亦可Si與OH經由連結基鍵結)與源自有機矽化合物(A)之-SiOH基(亦可Si與OH經由連結基鍵結)、或源自其他化合物之-SiOH基脫水縮合所形成之脫水縮合物。The composition (1) for forming a water-repellent layer is a mixed composition of an organosilicon compound (A), and can be obtained by mixing an organosilicon compound (A). Moreover, when mixing components other than an organosilicon compound (A), the composition (1) for water-repellent layer formation is obtained by mixing the said organosilicon compound (A) and other components. The composition (1) for water-repellent layer formation also includes what reacts after mixing, for example, in storage. As an example of the reaction, for example, hydrolyzable gene hydrolysis in which the above-mentioned composition for forming a water-repellent layer (1) contains a silicon atom (may also be bonded via a linking group) bonded to the above-mentioned organosilicon compound (A) A compound (hereinafter sometimes referred to as a hydrolyzate of an organosilicon compound (A)) that becomes a -SiOH group (Si and OH may also be bonded via a linking group). In addition, the above-mentioned composition (1) for forming a water-repellent layer may also include a condensate containing an organosilicon compound (A). As the condensate, for example, a -SiOH group or The -SiOH group of the organosilicon compound (A) produced by hydrolysis (Si and OH can also be bonded through the linking group) and the -SiOH group derived from the organosilicon compound (A) (Si and OH can also be bonded through the linking group) ), or the dehydration condensate formed from the dehydration condensation of -SiOH group of other compounds.

將撥水層形成用組合物(1)之整體設為100質量%時之有機矽化合物(A)之量例如為0.01質量%以上,較佳為0.05質量%以上,又,較佳為0.5質量%以下,更佳為0.3質量%以下。The amount of the organosilicon compound (A) is, for example, 0.01% by mass or more, preferably 0.05% by mass or more, and preferably 0.5% by mass when the entire composition (1) for forming a water-repellent layer is 100% by mass. % or less, more preferably 0.3 mass % or less.

上述撥水層形成用組合物(1)較佳為混合有上述有機矽化合物(A)、及有機矽化合物(B)。藉此,撥水層(r)能夠包含源自有機矽化合物(B)之結構。上述撥水層形成用組合物(1)如上所述,亦包含將有機矽化合物(A)及視需要使用之有機矽化合物(B)混合後進行反應者,作為進行反應之例,可例舉上述撥水層形成用組合物(1)包含鍵結於上述有機矽化合物(B)之矽原子之水解性基因水解而成為-SiOH基之化合物(以下有時稱為有機矽化合物(B)之水解物)。又,亦可例舉上述撥水層形成用組合物(1)包含有機矽化合物(B)之縮合物,作為該縮合物,可例舉有機矽化合物(B)所具有之-SiOH基或水解所產生之有機矽化合物(B)之-SiOH基與源自有機矽化合物(B)之-SiOH基、或源自其他化合物之-SiOH基脫水縮合所形成之脫水縮合物。It is preferable that the said composition (1) for water-repellent layer formation mixes the said organosilicon compound (A) and organosilicon compound (B). Thereby, the water-repellent layer (r) can contain a structure derived from the organosilicon compound (B). The above-mentioned water-repellent layer-forming composition (1) is as described above, and also includes a mixture of the organosilicon compound (A) and the organosilicon compound (B) used if necessary, and then reacts. As an example of performing the reaction, The above-mentioned water-repellent layer-forming composition (1) contains a compound (hereinafter sometimes referred to as organosilicon compound (B)) that hydrolyzes the silicon atom bonded to the above-mentioned organosilicon compound (B) to form a -SiOH group. hydrolyzate). In addition, the above-mentioned water-repellent layer-forming composition (1) may also include a condensate containing an organosilicon compound (B), and the condensate may include -SiOH groups or hydrolyzed A dehydration condensate formed by the dehydration condensation of the -SiOH group of the organosilicon compound (B) and the -SiOH group derived from the organosilicon compound (B) or the -SiOH group derived from other compounds.

將撥水層形成用組合物(1)之整體設為100質量%時之有機矽化合物(B)之量例如為0.01質量%以上,較佳為0.03質量%以上,又,較佳為0.3質量%以下,更佳為0.2質量%以下。The amount of the organosilicon compound (B) is, for example, 0.01% by mass or more, preferably 0.03% by mass or more, and preferably 0.3% by mass when the entire composition (1) for forming a water-repellent layer is 100% by mass % or less, more preferably 0.2 mass % or less.

上述撥水層形成用組合物(1)中之有機矽化合物(B)相對於有機矽化合物(A)之質量比較佳為0.2以上,更佳為0.4以上,又,較佳為3.0以下,更佳為1.5以下。The mass ratio of the organosilicon compound (B) to the organosilicon compound (A) in the composition (1) for forming a water-repellent layer is preferably at least 0.2, more preferably at least 0.4, more preferably at most 3.0, and more preferably at least 0.4. Preferably below 1.5.

上述撥水層形成用組合物(1)可進而混合有有機矽化合物(C)。於該情形時,撥水層形成用組合物(1)可藉由將有機矽化合物(A)及有機矽化合物(C)、以及視需要所使用之其他成分混合而獲得。如上文所述,撥水層形成用組合物(1)亦包含混合後進行反應者,作為進行反應之例,可例舉上述撥水層形成用組合物(1)包含上述有機矽化合物(C)之水解物或脫水縮合物。將撥水層形成用組合物(1)之整體設為100質量%時之有機矽化合物(C)之量較佳為0.1質量%以下,更佳為0.01質量%以下,尤佳為0質量%,即尤佳為未混合有有機矽化合物(C)。The said composition (1) for water-repellent layer formation may further mix an organosilicon compound (C). In this case, the water-repellent layer forming composition (1) can be obtained by mixing an organosilicon compound (A), an organosilicon compound (C), and other components used as needed. As mentioned above, the water-repellent layer-forming composition (1) also includes those that are mixed and then reacted. As an example of the reaction, the above-mentioned water-repellent layer-forming composition (1) includes the above-mentioned organosilicon compound (C ) hydrolyzate or dehydration condensate. The amount of the organosilicon compound (C) when the entire composition (1) for forming a water-repellent layer is 100% by mass is preferably at most 0.1% by mass, more preferably at most 0.01% by mass, and most preferably at most 0% by mass , that is, preferably not mixed with the organosilicon compound (C).

上述撥水層形成用組合物(1)通常混合有溶劑(D)。作為溶劑(D),較佳為使用氟系溶劑,例如可使用氟化醚系溶劑、氟化胺系溶劑、氟化烴系溶劑、氟化醇系溶劑等,尤佳為沸點為100℃以上。作為氟化醚系溶劑,較佳為氟烷基(尤其是碳數2~6之全氟烷基)-烷基(尤其是甲基或乙基)醚等氫氟醚,例如可例舉乙基九氟丁基醚或乙基九氟異丁基醚。作為乙基九氟丁基醚或乙基九氟異丁基醚,例如可例舉Novec(註冊商標)7200(3M公司製造,分子量約264)。作為氟化胺系溶劑,較佳為氨之氫原子之至少1個被取代為氟烷基之胺,較佳為氨之全部氫原子被取代為氟烷基(尤其是全氟烷基)之三級胺,具體而言,可例舉三(七氟丙基)胺,Fluorinert(註冊商標)FC-3283(3M公司製造,分子量約521)與此相符。作為氟化烴系溶劑,可例舉:1,1,1,3,3-五氟丁烷、全氟己烷等氟化脂肪族烴系溶劑、1,3-雙(三氟甲基苯)等氟化芳香族烴系溶劑。作為1,1,1,3,3-五氟丁烷,例如可例舉Solve 55(Solvex公司製造)等。作為氟化醇系溶劑,可例舉:1,1,1,3,3,3-六氟-2-丙醇、2,2,3,3-四氟-1-丙醇、2,2,3,3,4,4,5,5-八氟-1-戊醇、2,2,3,3,4,4,5,5,6,6,7,7-十二氟-1-庚醇、全氟辛基乙醇、1H,1H,2H,2H-十三氟-1-正辛醇等。The above composition (1) for forming a water-repellent layer usually contains a solvent (D). As the solvent (D), it is preferable to use a fluorine-based solvent, for example, a fluorinated ether-based solvent, a fluorinated amine-based solvent, a fluorinated hydrocarbon-based solvent, a fluorinated alcohol-based solvent, etc., and a boiling point of 100° C. or higher is particularly preferable. . Fluorinated ether solvents are preferably hydrofluoroethers such as fluoroalkyl (especially perfluoroalkyl having 2 to 6 carbon atoms)-alkyl (especially methyl or ethyl) ethers, for example, ethyl Nonafluorobutyl ether or ethyl nonafluoroisobutyl ether. As ethyl nonafluorobutyl ether or ethyl nonafluoroisobutyl ether, for example, Novec (registered trademark) 7200 (manufactured by 3M Company, molecular weight about 264) may be mentioned. Fluorinated amine solvents are preferably amines in which at least one hydrogen atom of ammonia is substituted with a fluoroalkyl group, preferably all hydrogen atoms of ammonia are substituted with a fluoroalkyl group (especially a perfluoroalkyl group) The tertiary amine specifically includes tris(heptafluoropropyl)amine, and Fluorinert (registered trademark) FC-3283 (manufactured by 3M Company, molecular weight about 521) corresponds to this. Examples of fluorinated hydrocarbon solvents include fluorinated aliphatic hydrocarbon solvents such as 1,1,1,3,3-pentafluorobutane and perfluorohexane, 1,3-bis(trifluoromethylbenzene ) and other fluorinated aromatic hydrocarbon solvents. As 1,1,1,3,3-pentafluorobutane, Solve 55 (made by Solvex Corporation) etc. are mentioned, for example. Examples of fluorinated alcohol-based solvents include: 1,1,1,3,3,3-hexafluoro-2-propanol, 2,2,3,3-tetrafluoro-1-propanol, 2,2 ,3,3,4,4,5,5-Octafluoro-1-pentanol, 2,2,3,3,4,4,5,5,6,6,7,7-Dodecafluoro-1 -Heptanol, perfluorooctyl ethanol, 1H,1H,2H,2H-tridecafluoro-1-n-octanol, etc.

作為氟系溶劑,除了上述以外,可使用Asahiklin(註冊商標)AK225(AGC公司製造)等氫氯氟碳、Asahiklin(註冊商標)AC2000(AGC公司製造)等氫氟碳等。As the fluorine-based solvent, in addition to the above, hydrochlorofluorocarbons such as Asahiklin (registered trademark) AK225 (manufactured by AGC Corporation), and hydrofluorocarbons such as Asahiklin (registered trademark) AC2000 (manufactured by AGC Corporation), and the like can be used.

作為溶劑(D),較佳為至少使用氟化胺系溶劑。又,作為溶劑(D),較佳為使用兩種以上氟系溶劑,且較佳為使用氟化胺系溶劑與氟化烴系溶劑(尤其是氟化脂肪族烴系溶劑)。As the solvent (D), it is preferable to use at least an amine fluoride solvent. Also, as the solvent (D), it is preferable to use two or more kinds of fluorine-based solvents, and it is preferable to use a fluorinated amine-based solvent and a fluorinated hydrocarbon-based solvent (especially a fluorinated aliphatic hydrocarbon-based solvent).

將撥水層形成用組合物(1)之整體設為100質量%時之溶劑(D)之量較佳為80質量%以上,更佳為90質量%以上,進而較佳為95質量%以上,進而更佳為98質量%以上,又,可為99.9質量%以下。The amount of the solvent (D) when the whole composition (1) for water-repellent layer formation is 100 mass % is preferably at least 80 mass %, more preferably at least 90 mass %, still more preferably at least 95 mass % , and more preferably at least 98% by mass, and may be at most 99.9% by mass.

又,撥水層形成用組合物(1)可於不阻礙本發明(第一態樣)之效果之範圍內混合有矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量於撥水層形成用組合物(1)100質量%中,較佳為5質量%以下,更佳為1質量%以下。In addition, the composition (1) for forming a water-repellent layer may contain a silanol condensation catalyst, an antioxidant, an antirust agent, an ultraviolet absorber, a photostabilizing Agents, antifungal agents, antibacterial agents, antiviral agents, anti-fouling agents, deodorants, pigments, flame retardants, antistatic agents and other additives. The amount of the above-mentioned additive is preferably at most 5 mass %, more preferably at most 1 mass %, based on 100 mass % of the water-repellent layer-forming composition (1).

作為塗佈上述撥水層形成用組合物(1)之方法,例如可例舉:浸漬塗佈法、輥塗法、棒式塗佈法、旋轉塗佈法、噴塗法、模嘴塗佈法、凹版塗佈法等。Examples of the method of applying the composition (1) for forming a water-repellent layer include dip coating, roll coating, bar coating, spin coating, spray coating, and die coating. , gravure coating method, etc.

於塗佈撥水層形成用組合物(1)後,於常溫、大氣中例如靜置10秒以上(通常為24小時以下),藉此可製造積層體(1)。於常溫下靜置時之濕度條件可設為50~90%RH。又,於塗佈撥水層形成用組合物(1)後,可加熱為超過60℃之溫度(通常為100℃以下,亦可為80℃以下),並保持10秒~60分鐘(較佳為20分鐘~40分鐘)左右。After applying the composition (1) for forming a water-repellent layer, the layered body (1) can be produced by allowing to stand at room temperature and in the atmosphere, for example, for 10 seconds or more (usually 24 hours or less). The humidity condition when standing at room temperature can be set to 50~90%RH. Also, after coating the composition (1) for forming a water-repellent layer, it may be heated to a temperature exceeding 60°C (usually below 100°C, and may be below 80°C) and kept for 10 seconds to 60 minutes (preferably 20 minutes to 40 minutes).

1-5-2.積層體(2)之製造方法 於本發明(第一態樣)之積層體為積層體(2)之情形時,製造積層體(2)之方法包括:(i)於基材(s)上塗佈撥水層形成用組合物(以下將用以製造積層體(2)之撥水層形成用組合物稱為撥水層形成用組合物(2))之步驟;及(ii)使上述撥水層形成用組合物(2)硬化之步驟。 1-5-2. Manufacturing method of laminate (2) When the laminated body of the present invention (first aspect) is the laminated body (2), the method for manufacturing the laminated body (2) includes: (i) coating the combination for forming a water-repellent layer on the substrate (s) (hereinafter, the water-repellent layer-forming composition used to manufacture the laminate (2) is referred to as the water-repellent layer-forming composition (2)); and (ii) making the above-mentioned water-repellent layer-forming composition ( 2) The step of hardening.

上述撥水層形成用組合物(2)為有機矽化合物(A)之混合組合物,較佳為有機矽化合物(A)與任意使用之有機矽化合物(B)之混合組合物、或有機矽化合物(A)、有機矽化合物(C)及任意使用之有機矽化合物(B)之混合組合物。撥水層形成用組合物(2)可藉由將有機矽化合物(A)混合而獲得,又,於混合有機矽化合物(A)以外之成分之情形時,可藉由將上述有機矽化合物(A)與其他成分混合而獲得。上述撥水層形成用組合物(2)亦包含混合後例如於保管中進行反應者。作為進行反應之例,例如可例舉上述撥水層形成用組合物(2)包含有機矽化合物(A)之水解物、有機矽化合物(A)之脫水縮合物、有機矽化合物(C)之水解物、或有機矽化合物(C)之脫水縮合物等。The composition (2) for forming a water-repellent layer is a mixed composition of an organosilicon compound (A), preferably a mixed composition of an organosilicon compound (A) and an optionally used organosilicon compound (B), or an organosilicon compound (A) A mixed composition of compound (A), organosilicon compound (C) and optionally used organosilicon compound (B). The water-repellent layer-forming composition (2) can be obtained by mixing the organosilicon compound (A), and when mixing components other than the organosilicon compound (A), it can be obtained by mixing the above-mentioned organosilicon compound ( A) Obtained by mixing with other ingredients. The composition (2) for water-repellent layer formation also includes what reacts after mixing, for example, in storage. As an example of carrying out the reaction, for example, the above-mentioned water-repellent layer-forming composition (2) includes a hydrolyzate of the organosilicon compound (A), a dehydration condensate of the organosilicon compound (A), and a composition of the organosilicon compound (C). Hydrolyzate, or dehydration condensate of organosilicon compound (C), etc.

將撥水層形成用組合物(2)之整體設為100質量%時之有機矽化合物(A)之量較佳為0.01質量%以上,更佳為0.02質量%以上,進而較佳為0.03質量%以上,又,較佳為0.5質量%以下,更佳為0.3質量%以下。The amount of the organosilicon compound (A) is preferably at least 0.01% by mass, more preferably at least 0.02% by mass, and still more preferably at least 0.03% by mass, when the entire composition (2) for forming a water-repellent layer is 100% by mass % or more, and preferably at most 0.5% by mass, more preferably at most 0.3% by mass.

將撥水層形成用組合物(2)之整體設為100質量%時之有機矽化合物(C)之量例如為0.005質量%以上,較佳為0.01質量%以上,更佳為0.03質量%以上,進而較佳為0.05質量%以上,又,較佳為1質量%以下,更佳為0.5質量%以下,進而較佳為0.3質量%以下。The amount of the organosilicon compound (C) is, for example, 0.005% by mass or more, preferably 0.01% by mass or more, more preferably 0.03% by mass or more when the entire composition (2) for forming a water-repellent layer is 100% by mass , and more preferably at least 0.05% by mass, and more preferably at most 1% by mass, more preferably at most 0.5% by mass, still more preferably at most 0.3% by mass.

又,有機矽化合物(C)相對於有機矽化合物(A)之質量比較佳為10質量%以上,更佳為15質量%以上,進而較佳為20質量%以上,進而更佳為50質量%以上,尤佳為80質量%以上,又,較佳為200質量%以下,更佳為150質量%以下,亦可為45質量%以下,亦可為30質量%以下。Furthermore, the mass ratio of the organosilicon compound (C) to the organosilicon compound (A) is preferably at least 10% by mass, more preferably at least 15% by mass, further preferably at least 20% by mass, still more preferably at least 50% by mass The above is preferably at least 80% by mass, and is preferably at most 200% by mass, more preferably at most 150% by mass, may be at most 45% by mass, and may be at most 30% by mass.

上述撥水層形成用組合物(2)可進而混合有有機矽化合物(B)。上述撥水層形成用組合物(2)如上所述,亦包含將有機矽化合物(A)、視需要使用之有機矽化合物(C)、及視需要使用之有機矽化合物(B)混合後進行反應者,作為進行反應之例,可例舉上述撥水層形成用組合物(2)包含上述有機矽化合物(B)之水解物或脫水縮合物。於使用有機矽化合物(B)之情形時,將撥水層形成用組合物(2)之整體設為100質量%時之有機矽化合物(B)之量例如為0.01質量%以上,較佳為0.03質量%以上,又,較佳為0.3質量%以下,更佳為0.2質量%以下。The said composition (2) for water-repellent layer formation may further mix an organosilicon compound (B). The above-mentioned water-repellent layer-forming composition (2) is as described above, and is prepared by mixing the organosilicon compound (A), the organosilicon compound (C) if necessary, and the organosilicon compound (B) if necessary. For the reactant, as an example of performing the reaction, a hydrolyzate or a dehydration condensate containing the above-mentioned organosilicon compound (B) can be mentioned, for example, in the composition (2) for forming a water-repellent layer. In the case of using the organosilicon compound (B), the amount of the organosilicon compound (B) when the entire water-repellent layer-forming composition (2) is 100% by mass is, for example, 0.01% by mass or more, preferably 0.01% by mass or more. 0.03% by mass or more, and preferably at most 0.3% by mass, more preferably at most 0.2% by mass.

上述撥水層形成用組合物(2)中之有機矽化合物(B)相對於有機矽化合物(A)之質量比較佳為0.05以上,更佳為0.08以上,進而較佳為0.10以上,又,較佳為2.0以下,更佳為1.0以下,進而較佳為0.6以下。The mass ratio of the organosilicon compound (B) to the organosilicon compound (A) in the composition (2) for forming a water-repellent layer is preferably at least 0.05, more preferably at least 0.08, still more preferably at least 0.10, and, Preferably it is 2.0 or less, more preferably 1.0 or less, still more preferably 0.6 or less.

上述撥水層形成用組合物(2)通常混合有溶劑(D)。溶劑(D)與上述所說明者相同,其較佳之態樣亦相同。將撥水層形成用組合物(2)之整體設為100質量%時之溶劑(D)之量較佳為80質量%以上,更佳為90質量%以上,進而較佳為95質量%以上,進而更佳為98質量%以上,又,可為99.9質量%以下。The above composition (2) for forming a water-repellent layer usually contains a solvent (D). The solvent (D) is the same as described above, and its preferred aspects are also the same. The amount of the solvent (D) when the whole composition (2) for forming a water-repellent layer is 100% by mass is preferably at least 80% by mass, more preferably at least 90% by mass, still more preferably at least 95% by mass , and more preferably at least 98% by mass, and may be at most 99.9% by mass.

又,於撥水層形成用組合物為有機矽化合物(A)與有機矽化合物(C)之混合組合物之情形時,溶劑(D)亦較佳為包含氟系溶劑(D1)與非氟系溶劑(D2)。Also, when the composition for forming a water-repellent layer is a mixed composition of an organosilicon compound (A) and an organosilicon compound (C), the solvent (D) also preferably contains a fluorine-based solvent (D1) and a non-fluorine system solvent (D2).

作為氟系溶劑(D1),可例舉與上述作為氟系溶劑所說明之溶劑相同者,其中較佳為使用氟化醚系溶劑。將撥水層形成用組合物(2)之整體設為100質量%時之氟系溶劑(D1)之量較佳為50質量%以上,更佳為60質量%以上,進而較佳為70質量%以上,又,例如可為99質量%以下,亦可為95質量%以下。The fluorine-based solvent (D1) may, for example, be the same as those described above as the fluorine-based solvent, and among them, it is preferable to use a fluorinated ether-based solvent. The amount of the fluorine-based solvent (D1) when the whole composition (2) for water-repellent layer formation is 100 mass % is preferably at least 50 mass %, more preferably at least 60 mass %, still more preferably at least 70 mass % % or more, and, for example, may be 99% by mass or less, or may be 95% by mass or less.

作為非氟系溶劑(D2),可使用:水;甲醇、乙醇、1-丙醇、2-丙醇(異丙醇)、1-丁醇等醇系溶劑;丙酮、甲基乙基酮、甲基異丁基酮等酮系溶劑;二乙醚、二丙醚、四氫呋喃、1,4-二㗁烷等醚系溶劑、戊烷、己烷等脂肪族烴系溶劑、或環己烷等脂環式烴系溶劑等烴系溶劑;乙酸乙酯、乙酸丙酯、乙酸丁酯、乙酸戊酯、乙酸異戊酯等酯系溶劑等。將撥水層形成用組合物(2)之整體設為100質量%時之非氟系溶劑(D2)之量較佳為5質量%以上,更佳為10質量%以上,進而較佳為13質量%以上,上限例如可為30質量%,亦可為25質量%。As the non-fluorine-based solvent (D2), water; alcohol-based solvents such as methanol, ethanol, 1-propanol, 2-propanol (isopropanol), and 1-butanol; acetone, methyl ethyl ketone, Ketone solvents such as methyl isobutyl ketone; ether solvents such as diethyl ether, dipropyl ether, tetrahydrofuran, and 1,4-dioxane; aliphatic hydrocarbon solvents such as pentane and hexane; or aliphatic solvents such as cyclohexane Hydrocarbon-based solvents such as cyclic hydrocarbon-based solvents; ester-based solvents such as ethyl acetate, propyl acetate, butyl acetate, amyl acetate, and isoamyl acetate, etc. The amount of the non-fluorinated solvent (D2) when the whole composition (2) for water-repellent layer formation is 100 mass % is preferably at least 5 mass %, more preferably at least 10 mass %, still more preferably 13 mass % % or more by mass, the upper limit may be, for example, 30% by mass or 25% by mass.

又,撥水層形成用組合物(2)可於不阻礙本發明(第一態樣)之效果之範圍內混合有矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量於撥水層形成用組合物(2)100質量%中,較佳為5質量%以下,更佳為1質量%以下。In addition, the composition (2) for forming a water-repellent layer may contain a silanol condensation catalyst, an antioxidant, an antirust agent, an ultraviolet absorber, a photostabilizing Agents, antifungal agents, antibacterial agents, antiviral agents, anti-fouling agents, deodorants, pigments, flame retardants, antistatic agents and other additives. The amount of the above-mentioned additive is preferably at most 5 mass %, more preferably at most 1 mass %, based on 100 mass % of the water-repellent layer-forming composition (2).

於塗佈上述撥水層形成用組合物(2)之前,較佳為預先對基材(s)之塗佈面實施易接著處理。上述易接著處理與上文所述之易接著處理相同。藉由對基材(s)之塗佈面實施易接著處理,可進一步提高撥水層(r)與基材(s)之密接性。Before coating the above-mentioned water-repellent layer-forming composition (2), it is preferable to give an easy-adhesive treatment to the coated surface of the substrate (s). The above-mentioned easy-bonding treatment is the same as the above-mentioned easy-bonding treatment. The adhesiveness between the water-repellent layer (r) and the substrate (s) can be further improved by applying an easy-adhesive treatment to the coated surface of the substrate (s).

作為塗佈撥水層形成用組合物(2)之方法,可例舉與作為塗佈上述撥水層形成用組合物(1)之方法所說明之方法同樣之方法。於塗佈上述撥水層形成用組合物(2)後,於常溫、大氣中例如靜置10秒以上(通常為24小時以下),藉此可製造本發明(第一態樣)之積層體。於常溫下靜置時之濕度條件可設為50~90%RH。又,於塗佈撥水層形成用組合物(2)後,可加熱為超過60℃之溫度(通常為100℃以下,亦可為80℃以下),並保持10秒~60分鐘(較佳為20分鐘~40分鐘)左右。As a method of coating the composition (2) for water-repellent layer formation, the method similar to the method demonstrated as the method of coating the said composition (1) for water-repellent layer formation is mentioned. After applying the composition (2) for forming a water-repellent layer, the layered product of the present invention (first aspect) can be produced by allowing it to stand at room temperature and in the air for at least 10 seconds (usually less than 24 hours). . The humidity condition when standing at room temperature can be set to 50~90%RH. Also, after coating the composition (2) for forming a water-repellent layer, it may be heated to a temperature exceeding 60°C (usually below 100°C, and may be below 80°C) and kept for 10 seconds to 60 minutes (preferably 20 minutes to 40 minutes).

再者,如上所述,於經由於基材(s)上塗佈撥水層形成用組合物之步驟、及使上述撥水層形成用組合物硬化之步驟製作積層體之態樣中,於上述撥水層形成用組合物為有機矽化合物(A)與有機矽化合物(C)之混合組合物之情形時,形成於基材(s)上之硬化層可為混合存在源自有機矽化合物(A)之結構及源自有機矽化合物(C)之結構之撥水層(r),亦可為包含源自有機矽化合物(A)之結構之撥水層(r)與包含源自有機矽化合物(C)之結構之層(c)進行層分離而成者。上述層分離容易藉由調整撥水層形成用組合物所含之溶劑之揮發速度而產生。作為調整溶劑之揮發速度之方法,重要的是適當調整例如將撥水層形成用組合物進行製膜或加溫乾燥時之濕度條件,較佳為將相對濕度設為35%以上,更佳為40%以上,又,可為60%以下,亦可為50%以下。Furthermore, as described above, in the aspect of producing a laminate through the step of applying the composition for forming a water-repellent layer on the substrate (s) and the step of hardening the composition for forming a water-repellent layer, in When the composition for forming the water-repellent layer is a mixed composition of the organosilicon compound (A) and the organosilicon compound (C), the hardened layer formed on the substrate (s) may be derived from the mixed presence of the organosilicon compound The structure of (A) and the water-repellent layer (r) derived from the structure of organosilicon compound (C) can also be the water-repellent layer (r) comprising the structure derived from organosilicon compound (A) and the structure derived from organic silicon compound (C). The layer (c) of the structure of the silicon compound (C) is obtained by layer separation. The said layer separation is easy to generate|occur|produce by adjusting the volatilization rate of the solvent contained in the composition for water-repellent layer formation. As a method of adjusting the volatilization rate of the solvent, it is important to appropriately adjust the humidity conditions, for example, when the composition for forming a water-repellent layer is formed into a film or heated and dried, and the relative humidity is preferably set to 35% or more, more preferably 40% or more, and may be 60% or less, or may be 50% or less.

(用以實施與第二態樣相關之發明之形態) 本發明之積層體(第二態樣)為包含具有導電性之基材(s)、含有氮元素之層(c)及含有氟元素之層(r)之積層體,且上述層(c)設置於上述基材(s)與上述層(r)之間。以下,分別對基材(s)、含有氟元素之層(r)及含有氮元素之層(c)進行說明。 (Form for implementing the invention related to the second aspect) The laminate (second aspect) of the present invention is a laminate comprising a conductive substrate (s), a layer (c) containing nitrogen, and a layer (r) containing fluorine, and the layer (c) It is provided between the above-mentioned substrate (s) and the above-mentioned layer (r). Hereinafter, the substrate (s), the layer (r) containing fluorine element, and the layer (c) containing nitrogen element will be described respectively.

2-1.基材(s) 基材(s)之材質及厚度可全部參照上述1-1所記載之基材(s)之材質及厚度,亦包括較佳之範圍在內。 2-1. Substrate(s) The material and thickness of the base material (s) can all refer to the material and thickness of the base material (s) described in the above 1-1, and the preferred range is also included.

基材(s)可為單層,亦可為2層以上之多層。於基材(s)為多層之情形時,基材(s)較佳為具有於成為母體之層(s1)上設置有與層(s1)不同之表層(s2)之多層結構。表層(s2)係於基材(s)中存在於最靠近層(r)一側之層。於基材(s)包含層(s1)及表層(s2)之情形時,本發明(第二態樣)之積層體係將層(s1)、表層(s2)、含有氮元素之層(c)、含有氟元素之層(r)依序積層。以下,亦將表層(s2)簡稱為「層(s2)」。The substrate (s) may be a single layer or a multilayer of two or more layers. When the substrate (s) is multilayered, the substrate (s) preferably has a multilayer structure in which a surface layer (s2) different from the layer (s1) is provided on a matrix layer (s1). The surface layer (s2) is a layer present on the side closest to the layer (r) in the substrate (s). When the substrate (s) includes a layer (s1) and a surface layer (s2), the layered system of the present invention (second aspect) will layer (s1), surface layer (s2), layer (c) containing nitrogen The layers (r) containing fluorine element are sequentially laminated. Hereinafter, the surface layer (s2) is also simply referred to as "layer (s2)".

2-1-1.層(s1) 層(s1)之材質可為上述有機系材料及無機系材料之任一者,較佳為有機系材料,更佳為樹脂,具體之樹脂與上述1-1-1所例示之樹脂相同。 2-1-1. Layer (s1) The material of layer (s1) can be any one of the above-mentioned organic materials and inorganic materials, preferably an organic material, more preferably a resin, and the specific resin is the same as the resin exemplified in 1-1-1 above.

層(s1)之厚度可全部參照上述1-1-1所記載之層(s1)之厚度,亦包括較佳之範圍在內。The thickness of the layer (s1) can refer to the thickness of the layer (s1) described in the above-mentioned 1-1-1, and a preferable range is also included.

2-1-2.層(s2) 關於層(s2),可全部參照第一態樣之上述1-1-2所記載之群(X1)及群(X2)之記載及層(s2)之厚度之記載,較佳之範圍或其效果亦可全部參照。 2-1-2. Layer (s2) Regarding the layer (s2), you can refer to the description of the group (X1) and the group (X2) and the description of the thickness of the layer (s2) described in the above 1-1-2 of the first aspect, the preferred range or its effect You can also refer to them all.

於層(s2)包含由選自上述群(X1)中之至少一種所形成之層之情形時,層(s2)可發揮作為具有表面硬度之硬塗層(hc)之功能,關於硬塗層(hc)之硬度、層結構、具體之樹脂及形成方法,可全部參照第一態樣之上述1-1-2所記載之硬塗層(hc)之與該等相關之內容,於效果之記載中,上述1-1-2之說明中之第一態樣之「撥水層(r)」於第二態樣中改稱為「層(r)」即可。再者,於下文所述之抗靜電劑(AS)包含於層(s2)中之情形時,使用於包含上述反應性材料之組合物中添加有抗靜電劑(AS)之組合物即可。In the case where the layer (s2) includes a layer formed of at least one layer selected from the above-mentioned group (X1), the layer (s2) can function as a hard coat layer (hc) having surface hardness. Regarding the hard coat layer The hardness, layer structure, specific resin and formation method of (hc) can all refer to the content related to the hard coating (hc) described in the above 1-1-2 of the first aspect, and the effect In the description, the "water-repellent layer (r)" of the first aspect in the description of 1-1-2 above can be renamed as "layer (r)" in the second aspect. Furthermore, when the antistatic agent (AS) described below is included in the layer (s2), a composition in which the antistatic agent (AS) is added to the composition containing the above-mentioned reactive material may be used.

於層(s2)包含硬塗層(hc)之情形時,硬塗層(hc)可包含添加劑,與添加劑相關之記載及與硬塗層(hc)之厚度相關之記載,亦包括效果在內,全部可參照第一態樣之上述1-1-2之層(s2)所記載之內容。再者,於效果之記載中,上述1-1-2之說明中之第一態樣之「撥水層(r)」於第二態樣中改稱為「層(r)」即可。When the layer (s2) includes a hard coat layer (hc), the hard coat layer (hc) may contain additives, and the descriptions related to the additives and the descriptions related to the thickness of the hard coat layer (hc) also include effects , all can refer to the content recorded in the layer (s2) of the above-mentioned 1-1-2 of the first aspect. Furthermore, in the description of the effects, the "water-repellent layer (r)" of the first aspect in the description of 1-1-2 above can be renamed as "layer (r)" in the second aspect.

於層(s2)包含由選自上述群(X2)中之至少一種所形成之層之情形時,層(s2)可發揮作為防止所入射之光之反射之抗反射層(ar)之功能,與抗反射層(ar)相關之全部記載可全部參照第一態樣之上述1-1-2所記載之內容。When the layer (s2) includes a layer formed of at least one layer selected from the above group (X2), the layer (s2) can function as an anti-reflection layer (ar) that prevents reflection of incident light, All the descriptions related to the anti-reflection layer (ar) can refer to the content described in the above 1-1-2 of the first aspect.

層(s2)可包含硬塗層(hc),亦可包含抗反射層(ar),亦可包含硬塗層(hc)及抗反射層(ar)之兩者,較佳為至少包含硬塗層(hc),較佳為層(s2)為硬塗層。於層(s2)包含硬塗層(hc)及抗反射層(ar)之兩者之情形時,較佳為將抗反射層(ar)積層於層(r)側。The layer (s2) may comprise a hard coat (hc), may also comprise an anti-reflection layer (ar), may also comprise both a hard coat (hc) and an anti-reflection layer (ar), preferably at least comprises a hard coat Layer (hc), preferably layer (s2), is a hard coat layer. When the layer (s2) includes both the hard coat layer (hc) and the antireflection layer (ar), it is preferable to laminate the antireflection layer (ar) on the layer (r) side.

2-1-3.基材(s)之導電性 於本發明(第二態樣)中,基材(s)具有導電性,較佳為於基材(s)中含有抗靜電劑(AS)而發揮導電性。於基材(s)包含抗靜電劑(AS)且基材(s)為2層以上之多層之情形時,抗靜電劑(AS)包含於任一層中即可,亦可包含於全部層中。尤其是於基材(s)為於成為母體之層(s1)上設置有與層(s1)不同之表層(s2)之多層結構之情形時,抗靜電劑(AS)可包含於層(s1)中,亦可包含於表層(s2)中,尤佳為包含於表層(s2)中。於抗靜電劑(AS)包含於表層(s2)中之情形時,較佳為表層(s2)為硬塗層,更佳為該硬塗層為選自由丙烯酸系樹脂、聚矽氧系樹脂及環氧系樹脂所組成之群中之至少一種。 2-1-3. Conductivity of substrate(s) In the present invention (second aspect), the substrate (s) has conductivity, and it is preferable to exhibit conductivity by including an antistatic agent (AS) in the substrate (s). When the base material (s) contains the antistatic agent (AS) and the base material (s) is multi-layered with two or more layers, the antistatic agent (AS) may be included in any layer, or may be included in all layers . Especially when the substrate (s) is a multilayer structure in which a surface layer (s2) different from the layer (s1) is provided on the layer (s1) to be the matrix, the antistatic agent (AS) can be included in the layer (s1 ), may also be contained in the surface layer (s2), and is preferably contained in the surface layer (s2). When the antistatic agent (AS) is included in the surface layer (s2), it is preferred that the surface layer (s2) is a hard coat layer, more preferably the hard coat layer is selected from acrylic resins, polysiloxane resins and At least one of the group consisting of epoxy-based resins.

作為抗靜電劑(AS),例如可例舉:界面活性劑、導電性高分子、導電性粒子、離子性化合物(即鹽)、導入有受體及/或供體之共軛系高分子等。該等抗靜電劑分別混合一種或兩種以上而使用。Examples of antistatic agents (AS) include: surfactants, conductive polymers, conductive particles, ionic compounds (i.e., salts), conjugated polymers with acceptors and/or donors introduced therein, etc. . One or more of these antistatic agents are used in combination.

作為界面活性劑,可例舉:烴系界面活性劑、氟系界面活性劑、聚矽氧系界面活性劑等。The surfactant may, for example, be a hydrocarbon-based surfactant, a fluorine-based surfactant or a silicone-based surfactant.

作為導電性高分子,可例舉:聚苯胺、聚吡咯、聚乙炔、聚噻吩等。The conductive polymer may, for example, be polyaniline, polypyrrole, polyacetylene or polythiophene.

作為導電性粒子,可例舉可摻雜有磷或銻之金屬氧化物,例如可例舉:銦-錫-複合氧化物(ITO)、摻雜有銻之氧化錫(ATO)等無機氧化物粒子。Examples of conductive particles include metal oxides that may be doped with phosphorus or antimony, such as inorganic oxides such as indium-tin-composite oxide (ITO) and antimony-doped tin oxide (ATO). particle.

作為離子性化合物,較佳為具有陽離子性有機基或陰離子性有機基之離子性化合物,例如可例舉:鹼金屬鹽及/或有機陽離子-陰離子鹽。有機陽離子-陰離子鹽為包含陽離子部與陰離子部且上述陽離子部為有機物之鹽,陰離子部可為有機物,亦可為無機物,具體而言,可例舉:四級銨鹽、吡啶鎓鹽、具有一級~三級胺基之化合物等具有各種陽離子性有機基之陽離子性化合物。有機陽離子-陰離子鹽之陰離子部較佳為鹵素原子。又,鹼金屬鹽之陰離子部可包含有機物,亦可包含無機物,較佳為陰離子部包含有機物。作為陰離子部包含有機物之鹼金屬鹽,可例舉:具有磺酸鹽基、硫酸酯鹽基、磷酸酯鹽基、膦酸鹽基等陰離子性有機基之陰離子性化合物。作為離子性化合物,可例舉將上述所例舉之化合物進一步高分子量化而成之化合物。The ionic compound is preferably an ionic compound having a cationic organic group or an anionic organic group, for example, an alkali metal salt and/or an organic cation-anion salt. An organic cation-anion salt is a salt that includes a cation part and an anion part and the above-mentioned cation part is an organic substance, and the anion part can be organic or inorganic. Specifically, it can be exemplified: quaternary ammonium salt, pyridinium salt, Cationic compounds having various cationic organic groups, such as compounds with primary to tertiary amino groups. The anion portion of the organic cation-anion salt is preferably a halogen atom. Moreover, the anion part of an alkali metal salt may contain an organic substance, and may contain an inorganic substance, Preferably an anion part contains an organic substance. Examples of the alkali metal salt containing an organic substance in the anion portion include anionic compounds having anionic organic groups such as sulfonate groups, sulfate ester groups, phosphate ester groups, and phosphonate groups. As the ionic compound, a compound obtained by further increasing the molecular weight of the compounds exemplified above may be mentioned.

抗靜電劑較佳為離子性化合物,尤其有用的是更佳為如鹼金屬鹽及/或有機陽離子與陰離子之鹽之容易受到外部環境之影響的離子性化合物,進而較佳為四級銨鹽、吡啶鎓鹽、及具有一級~三級胺基之化合物之至少一種,進而更佳為四級銨鹽。四級銨鹽可為四級銨與酸或鹵素之鹽,作為酸,較佳為主要為磺酸或鹽酸等鹵酸。四級銨鹽亦較佳為下述式(as1)所表示之化合物。The antistatic agent is preferably an ionic compound, especially useful is an ionic compound that is easily affected by the external environment such as an alkali metal salt and/or a salt of an organic cation and anion, and is preferably a quaternary ammonium salt , pyridinium salt, and at least one of compounds having primary to tertiary amino groups, and more preferably a quaternary ammonium salt. The quaternary ammonium salt may be a salt of quaternary ammonium and an acid or a halogen, and the acid is preferably mainly a halogen acid such as sulfonic acid or hydrochloric acid. The quaternary ammonium salt is also preferably a compound represented by the following formula (as1).

抗靜電劑(AS)更佳為式(as1)所表示之四級銨鹽(以下有時稱為四級銨鹽(as1))。The antistatic agent (AS) is more preferably a quaternary ammonium salt represented by formula (as1) (hereinafter sometimes referred to as a quaternary ammonium salt (as1)).

[化20]

Figure 02_image039
[chemical 20]
Figure 02_image039

[式(as1)中之R k1~R k3、R k4及R k5、Y k1及Y k2、A k1及A k2、Z k1、k3、k4k5、n、X與上述式(k1)中之該等之含義相同,亦包括較佳之範圍在內,可參照上述式(k1)中之記載事項。再者,於上述式(k1)中,式(ki)可改稱為式(as-i)。 [R k1 to R k3 , R k4 and R k5 , Y k1 and Y k2 , A k1 and A k2 , Z k1 , k3, k4k5, n, X in formula (as1) and the above formula (k1) etc. have the same meaning, including the preferred range, and the items described in the above formula (k1) can be referred to. Furthermore, in the above-mentioned formula (k1), the formula (ki) can be changed to the formula (as-i).

[化21]

Figure 02_image041
[chem 21]
Figure 02_image041

[式(as-i)中,R k17~R k19分別獨立地表示碳數1~30之烴基,*表示與Y k2之鍵結鍵]] [In the formula (as-i), R k17 to R k19 independently represent a hydrocarbon group with 1 to 30 carbons, and * represents a bond with Y k2 ]]

四級銨鹽(as1)更佳為式(as1-1)所表示之化合物。The quaternary ammonium salt (as1) is more preferably a compound represented by formula (as1-1).

[化22]

Figure 02_image043
[chem 22]
Figure 02_image043

於式(as1-1)中,R k11~R k16、Y k11及Y k12、A k11~A k14、k13、X與上述式(k1-1)中之該等之含義相同,亦包括較佳之範圍在內,可參照上述式(k1-1)中之記載事項。 In formula (as1-1), R k11 to R k16 , Y k11 and Y k12 , A k11 to A k14 , k13 and X have the same meanings as those in the above formula (k1-1), including preferred ones Within the range, the items described in the above formula (k1-1) can be referred to.

四級銨鹽(as1)亦更佳為式(as1-2)所表示之化合物。The quaternary ammonium salt (as1) is also more preferably a compound represented by the formula (as1-2).

[化23]

Figure 02_image045
[chem 23]
Figure 02_image045

於式(as1-2)中,R k21~R k23、R k24、Y k21、A k21、k21、X與上述式(k1-2)中之該等之含義相同,亦包括較佳之範圍在內,可參照上述式(k1-2)中之記載事項。 In formula (as1-2), R k21 ~ R k23 , R k24 , Y k21 , A k21 , k21 and X have the same meanings as those in formula (k1-2) above, including preferred ranges , you can refer to the items described in the above formula (k1-2).

作為四級銨鹽(as1),較佳為至少使用式(as1-1)所表示之化合物及/或式(as1-2)所表示之化合物。As the quaternary ammonium salt (as1), it is preferable to use at least the compound represented by the formula (as1-1) and/or the compound represented by the formula (as1-2).

抗靜電劑(AS)之含量於基材(s)100質量%中,較佳為0.001質量%以上,更佳為0.005質量%以上,進而較佳為0.01質量%以上,又,較佳為50質量%以下,更佳為25質量%以下,進而較佳為10質量%以下。又,於基材(s)為於成為母體之層(s1)上設置有與層(s1)不同之表層(s2)之多層結構之情形時,可於層(s1)及表層(s2)之兩層中包含抗靜電劑,且將兩層中之抗靜電劑(AS)之含量調整為上述範圍,亦可於其中任一層中包含抗靜電劑,將包含抗靜電劑之層中之抗靜電劑(AS)之含量調整為上述範圍,尤佳為僅於表層(s2)中包含抗靜電劑,將表層(s2)中之抗靜電劑(AS)之含量調整為上述範圍。The content of the antistatic agent (AS) is preferably at least 0.001% by mass, more preferably at least 0.005% by mass, further preferably at least 0.01% by mass, and more preferably 50% by mass in 100% by mass of the substrate (s). Mass % or less, More preferably, it is 25 mass % or less, More preferably, it is 10 mass % or less. Also, when the substrate (s) is a multilayer structure in which a surface layer (s2) different from the layer (s1) is provided on the layer (s1) to be the matrix, the layer (s1) and the surface layer (s2) can be Include antistatic agent in two layers, and adjust the content of antistatic agent (AS) in two layers to the above-mentioned range, also can include antistatic agent in any one of them layer, will contain the antistatic agent in the layer of antistatic agent The content of the antistatic agent (AS) is adjusted to the above range, and it is more preferable to only include the antistatic agent in the surface layer (s2), and adjust the content of the antistatic agent (AS) in the surface layer (s2) to the above range.

又,於基材(s)中,除了抗靜電劑(AS)以外,亦較佳為分散無機粒子、有機粒子、橡膠粒子,又,亦可含有如顏料或染料之著色劑、螢光增白劑、分散劑、塑化劑、熱穩定劑、光穩定劑、紅外線吸收劑、紫外線吸收劑、抗靜電劑、抗氧化劑、潤滑劑、溶劑等調配劑。基材(s)中之抗靜電劑(AS)以外之調配劑之含量於基材(s)100質量%中,較佳為5質量%以下,更佳為3質量%以下,進而較佳為1質量%以下。In addition, in the substrate (s), in addition to the antistatic agent (AS), it is also preferred to disperse inorganic particles, organic particles, rubber particles, and may also contain coloring agents such as pigments or dyes, fluorescent whitening Agents, dispersants, plasticizers, heat stabilizers, light stabilizers, infrared absorbers, ultraviolet absorbers, antistatic agents, antioxidants, lubricants, solvents and other formulations. The content of the compounding agent other than the antistatic agent (AS) in the base material (s) is in 100 mass % of the base material (s), preferably 5 mass % or less, more preferably 3 mass % or less, still more preferably 1% by mass or less.

2-2.含有氟元素之層(r) 含有氟元素之層(r)通常具有撥水性,較佳為積層體中基材(s)之相反側之最表面層。 2-2. Layer containing fluorine element (r) The layer (r) containing fluorine usually has water repellency, and is preferably the outermost layer on the opposite side of the substrate (s) in the laminate.

層(r)之厚度較佳為1 nm以上20 nm以下,更佳為1 nm以上15 nm以下,進而較佳為2 nm以上10 nm以下,尤佳為3 nm以上8 nm以下。藉由將層(r)之厚度設為規定值以上,除了撥水性以外,耐擦傷性亦優異,就該方面而言較佳,又,藉由將上述厚度設為規定值以下,於積層體表面可防止帶電。The thickness of the layer (r) is preferably from 1 nm to 20 nm, more preferably from 1 nm to 15 nm, still more preferably from 2 nm to 10 nm, especially preferably from 3 nm to 8 nm. By setting the thickness of the layer (r) to a predetermined value or more, in addition to water repellency, it is also excellent in scratch resistance, which is preferable in this respect, and by making the above-mentioned thickness below a predetermined value, the laminated body The surface prevents electrification.

層(r)之厚度可藉由層(r)形成用組合物中之固形物成分之濃度或層(r)形成用組合物之塗佈條件進行調整。層(r)之厚度可藉由橢圓偏光儀或X射線反射測定、截面方向之掃描式透過電子顯微鏡(STEM)測定、X射線光電子光譜法(XPS)、探針式薄膜輪廓儀等進行測定,可根據各層之材質或厚度適當選擇測定方法。The thickness of the layer (r) can be adjusted by the concentration of the solid content in the layer (r) forming composition or the coating conditions of the layer (r) forming composition. The thickness of layer (r) can be measured by ellipsometer or X-ray reflection measurement, scanning transmission electron microscope (STEM) measurement of cross-sectional direction, X-ray photoelectron spectroscopy (XPS), probe type film profiler, etc. The measurement method can be appropriately selected according to the material or thickness of each layer.

於截面方向之STEM測定中,將積層體以包含與基材(s)厚度方向平行之面之方式進行薄片化而切下超薄切片,並利用掃描式透過電子顯微鏡(STEM)觀察該超薄切片之截面,藉此可測定層(r)之厚度。 作為積層體之薄片化之方法,只要可加工成厚度100 nm以下之超薄切片即可,可例舉:聚焦離子束加工法、超薄切片機法、冷凍超薄切片機加工法等。例如於使用聚焦離子束加工法之情形時,離子源較佳為Ga,加速電壓較佳為設為30 kV左右。 於STEM觀察時,較佳為將加速電壓設為20kv~30 kV,將電流值設為50 pA~100 pA,將倍率設為50萬~100萬倍。再者,於STEM觀察中,為了容易分辨層(r)與外界之界面,可於薄片化之前利用氈筆等將層(r)之上表面塗黑後進行測定。 In the STEM measurement of the cross-sectional direction, the laminate is sliced so as to include a surface parallel to the thickness direction of the substrate (s), and an ultrathin section is cut out, and the ultrathin section is observed with a scanning transmission electron microscope (STEM). Cross-section of a slice, whereby the thickness of layer (r) can be determined. As a method for thinning the laminate, any ultrathin sections with a thickness of 100 nm or less may be processed, and examples thereof include focused ion beam processing, ultramicrotome processing, and cryo-ultramicrotome processing. For example, when using the focused ion beam processing method, the ion source is preferably Ga, and the accelerating voltage is preferably set to about 30 kV. In the case of STEM observation, it is preferable to set the accelerating voltage to 20 kv to 30 kV, the current value to 50 pA to 100 pA, and the magnification to 500,000 to 1,000,000 times. In addition, in STEM observation, in order to easily distinguish the interface between layer (r) and the outside world, the upper surface of layer (r) may be blackened with a felt pen or the like before thinning, and then measured.

亦可如下文所述之實施例所記載般,基於由使用玻璃作為基材(s)之材質之積層體樣品所獲得之校準曲線,算出層(r)之厚度。具體而言,使用玻璃作為基材(s)之材質,準備複數個(較佳為3個以上)層(c)之厚度相同且層(r)之厚度不同之積層體樣品,使用橢圓偏光儀分辨測定層(r)之厚度。又,對該樣品進行XPS測定,求出源自層(r)之特定之元素量與源自層(c)之特定之元素量之比,製作相對於層(r)之厚度之上述比之校準曲線。然後,對實際獲得之積層體進行XPS測定,藉此求出源自層(r)之特定之元素量與源自層(c)之特定之元素量之比,依照上述校準曲線,能夠算出層(r)之厚度。The thickness of the layer (r) can also be calculated based on a calibration curve obtained from a laminate sample using glass as the material of the substrate (s), as described in the Examples described below. Specifically, using glass as the material of the substrate (s), prepare a plurality of (preferably more than 3) laminate samples with the same thickness of the layer (c) and different thicknesses of the layer (r), and use an ellipsometer Resolution measures the thickness of layer (r). In addition, this sample was subjected to XPS measurement to find the ratio of the specific element amount derived from layer (r) to the specific element amount derived from layer (c), and to prepare the above-mentioned ratio with respect to the thickness of layer (r). Calibration curve. Then, by performing XPS measurement on the actually obtained laminate, the ratio of the specific element amount originating from layer (r) to the specific element amount originating from layer (c) can be obtained, and the layer (r) the thickness.

再者,於基材(s)之材質為有機系材料之情形時,由於基材(s)與層(r)之折射率差較小,故而存在難以利用橢圓偏光儀測定膜厚之情形。此時,進行截面方向之STEM測定或使用上述校準曲線之測定即可。Furthermore, when the material of the substrate (s) is an organic material, the difference in refractive index between the substrate (s) and the layer (r) is small, so it may be difficult to measure the film thickness with an ellipsometer. In this case, STEM measurement in the cross-sectional direction or measurement using the above-mentioned calibration curve may be performed.

又,層(r)較佳為含有氟元素之有機矽化合物(A)之硬化層。藉由層(r)為有機矽化合物(A)之硬化層,即便為薄膜亦可賦予良好之撥水性(以下有時將層(r)稱為「撥水層」)。上述有機矽化合物(A)較佳為含有氟元素且具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)。有機矽化合物(A)之硬化層通常可藉由塗佈有機矽化合物(A)之混合組合物並使其硬化而獲得,即可認為層(r)為有機矽化合物(A)之混合組合物之硬化層。以下,存在將有機矽化合物(A)之混合組合物稱為撥水層形成用組合物之情形。Furthermore, layer (r) is preferably a cured layer of organosilicon compound (A) containing fluorine element. When the layer (r) is a cured layer of the organosilicon compound (A), good water repellency can be imparted even as a thin film (the layer (r) may be referred to as a "water repellent layer" hereinafter). The above-mentioned organosilicon compound (A) is preferably an organosilicon compound (A) containing fluorine element and having a silicon atom to which a hydrolyzable group or a hydroxyl group is bonded via a linking group or not. The hardened layer of the organosilicon compound (A) can usually be obtained by coating the mixed composition of the organosilicon compound (A) and curing it, that is, the layer (r) is a mixed composition of the organosilicon compound (A) hardened layer. Hereinafter, the mixed composition of the organosilicon compound (A) may be referred to as the composition for water-repellent layer formation.

於層(r)為含有氟元素且具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)的混合組合物之硬化層之情形時,層(r)具有源自有機矽化合物(A)之結構。有機矽化合物(A)具有鍵結於矽原子(亦可經由連結基而鍵結)之水解性基或羥基,於硬化時,有機矽化合物(A)所具有之-SiOH基或水解產生之有機矽化合物(A)之-SiOH基(亦可Si與OH經由連結基鍵結)與源自有機矽化合物(A)之-SiOH基(亦可Si與OH經由連結基鍵結)、源自其他化合物之-SiOH基、或積層體中供形成層(r)之面(較佳為層(c))之活性氫(羥基等)脫水縮合。因此,層(r)較佳為具有源自有機矽化合物(A)之縮合結構。When the layer (r) is a cured layer of a mixed composition of an organosilicon compound (A) containing fluorine and having a silicon atom bonded to a hydrolyzable group or a hydroxyl group via a linking group or not via a linking group, the layer (r) has a structure derived from the organosilicon compound (A). The organosilicon compound (A) has a hydrolyzable group or a hydroxyl group bonded to a silicon atom (it can also be bonded through a linking group). When hardening, the -SiOH group possessed by the organosilicon compound (A) or the organic The -SiOH group of the silicon compound (A) (Si and OH can also be bonded through a linking group) and the -SiOH group derived from the organosilicon compound (A) (Si and OH can also be bonded through a linking group), derived from other The -SiOH group of the compound, or the active hydrogen (hydroxyl group, etc.) on the surface (preferably layer (c)) forming the layer (r) in the laminate is dehydrated and condensed. Therefore, layer (r) preferably has a condensation structure derived from organosilicon compound (A).

2-2-1.有機矽化合物(A) 於較佳之態樣中,有機矽化合物(A)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基(以下將兩者合併稱為反應性基(h3))之矽原子之化合物。上述反應性基(h3)與第一態樣之上述1-2-1所說明之反應性基(h3)之含義相同。 2-2-1. Organosilicon compound (A) In a preferred aspect, the organosilicon compound (A) is a silicon atom having a hydrolyzable group or a hydroxyl group (hereinafter referred to as a reactive group (h3)) bonded via a linking group or not via a linking group compound. The above reactive group (h3) has the same meaning as the reactive group (h3) described in the above 1-2-1 of the first aspect.

有機矽化合物(A)較佳為除了上述矽原子以外還包含氟聚醚結構,與氟聚醚結構相關之記載亦全部可參照第一態樣中之記載。The organosilicon compound (A) preferably contains a fluoropolyether structure in addition to the above-mentioned silicon atoms, and all the descriptions related to the fluoropolyether structure can refer to the description in the first aspect.

於有機矽化合物(A)包含氟聚醚結構、矽原子及反應性基(h3)之態樣中,較佳為於鍵結鍵側之末端具有氟聚醚結構之氧原子之一價基(以下稱為FPE基)與矽原子經由連結基或不經由連結基鍵結,且矽原子與反應性基(h3)經由連結基或不經由連結基鍵結。於上述FPE基與矽原子經由連結基鍵結之情形時,上述反應性基(h3)經由連結基或不經由連結基所鍵結之矽原子可於有機矽化合物(A)之一分子中存在1或複數個,其數量例如為1以上、10以下。In the aspect where the organosilicon compound (A) includes a fluoropolyether structure, a silicon atom, and a reactive group (h3), it is preferable to have one of the valent groups of the oxygen atom of the fluoropolyether structure at the end of the bonding bond side ( Hereinafter referred to as FPE group) and the silicon atom are bonded via a linking group or not, and the silicon atom and the reactive group (h3) are bonded via a linking group or not. In the case where the above-mentioned FPE group and the silicon atom are bonded via a linking group, the silicon atom bonded to the above-mentioned reactive group (h3) via a linking group or not via a linking group may exist in a molecule of the organosilicon compound (A) 1 or plural, and the number is, for example, 1 or more and 10 or less.

上述FPE基亦可全部參照第一態樣之FPE基之記載,較佳為包含於上述FPE基中之含氟基可全部參照第一態樣之含氟基之記載。The above-mentioned FPE group can also refer to the description of the FPE group of the first aspect, preferably, all the fluorine-containing groups contained in the above-mentioned FPE group can refer to the description of the first aspect of the fluorine-containing group.

上述反應性基(h3)可經由連結基鍵結於矽原子,亦可不經由連結基直接鍵結於矽原子,較佳為直接鍵結於矽原子。鍵結於1個矽原子之反應性基(h3)之數量為1個以上即可,可為2或3,較佳為2或3,尤佳為3。於鍵結於1個矽原子之反應性基(h3)之數量為2以下之情形時,可於其餘鍵結鍵鍵結有反應性基(h3)以外之一價基,例如可鍵結烷基(尤其是碳數為1~4之烷基)、H、NCO等。The above-mentioned reactive group (h3) may be bonded to the silicon atom through a linking group, or may be directly bonded to the silicon atom without a linking group, and is preferably directly bonded to the silicon atom. The number of reactive groups (h3) bonded to one silicon atom may be at least one, and may be 2 or 3, preferably 2 or 3, and especially preferably 3. When the number of reactive groups (h3) bonded to one silicon atom is 2 or less, a valent group other than the reactive group (h3) may be bonded to the remaining bonds, for example, an alkane may be bonded group (especially an alkyl group with 1 to 4 carbon atoms), H, NCO, etc.

上述有機矽化合物(A)較佳為第一態樣所說明之上述式(a1)所表示之化合物。The above organosilicon compound (A) is preferably a compound represented by the above formula (a1) described in the first aspect.

有機矽化合物(A)較佳為以第一態樣所說明之上述式(a2)表示。The organosilicon compound (A) is preferably represented by the above formula (a2) described in the first aspect.

作為有機矽化合物(A),更具體而言,可例舉第一態樣所說明之上述式(a3)之化合物,亦可例舉上述式(a4)所表示之化合物。More specifically, the organosilicon compound (A) may, for example, be a compound represented by the above formula (a3) described in the first aspect, or a compound represented by the above formula (a4).

有機矽化合物(A)之數量平均分子量較佳為2,000以上,更佳為4,000以上,進而較佳為5,000以上,進而更佳為6,000以上,尤佳為7,000以上,又,較佳為40,000以下,更佳為20,000以下,進而較佳為15,000以下。The number average molecular weight of the organosilicon compound (A) is preferably at least 2,000, more preferably at least 4,000, still more preferably at least 5,000, still more preferably at least 6,000, particularly preferably at least 7,000, and more preferably at most 40,000, More preferably, it is 20,000 or less, More preferably, it is 15,000 or less.

作為有機矽化合物(A),可僅使用一種,亦可使用兩種以上。As the organosilicon compound (A), only one type may be used, or two or more types may be used.

於層(r)中,源自有機矽化合物(A)之結構較佳為包含50質量%以上,更佳為60質量%以上,又,可為100質量%,較佳為95質量%以下,進而較佳為90質量%以下。此處,源自有機矽化合物(A)之結構係指有機矽化合物(A)及有機矽化合物(A)脫水縮合後之殘基。In layer (r), the structure derived from the organosilicon compound (A) preferably contains at least 50% by mass, more preferably at least 60% by mass, and may be 100% by mass, preferably at most 95% by mass, Furthermore, it is more preferable that it is 90 mass % or less. Here, the structure derived from the organosilicon compound (A) refers to the organosilicon compound (A) and the residue after dehydration condensation of the organosilicon compound (A).

2-2-2.有機矽化合物(B) 層(r)可具有上述源自有機矽化合物(A)之結構、及第一態樣所說明之源自上述式(b1)所表示之有機矽化合物(B)之結構,亦可全部參照式(b1)之較佳之範圍。具有源自有機矽化合物(A)之結構、及源自有機矽化合物(B)之結構之層(r)可藉由塗佈於上述撥水層形成用組合物中進而混合有機矽化合物(B)而成之混合組合物並使其硬化而獲得。 2-2-2.Organosilicon compound (B) Layer (r) may have the above-mentioned structure derived from the organosilicon compound (A), and the structure described in the first aspect derived from the organosilicon compound (B) represented by the above formula (b1), and may also refer to the formula The preferred range of (b1). The layer (r) having a structure derived from the organosilicon compound (A) and a structure derived from the organosilicon compound (B) can be mixed with the organosilicon compound (B) by coating the composition for forming a water-repellent layer. ) and obtained by hardening the mixed composition.

有機矽化合物(B)如下文所述,具有鍵結於矽原子之水解性基或羥基,通常有機矽化合物(B)所具有之-SiOH基或水解所產生之有機矽化合物(B)之-SiOH基與源自有機矽化合物(B)之-SiOH基、源自其他化合物之-SiOH基、或積層體中供形成層(r)之面(尤其是層(c))之活性氫(羥基等)脫水縮合,因此於較佳之態樣中,層(r)具有源自有機矽化合物(A)之脫水縮合結構、及源自有機矽化合物(B)之脫水縮合結構。藉由層(r)具有源自有機矽化合物(B)之脫水縮合結構,水滴等之滑落性進一步提高。The organosilicon compound (B), as described below, has a hydrolyzable group or a hydroxyl group bonded to a silicon atom. Generally, the -SiOH group of the organosilicon compound (B) or the -SiOH group of the organosilicon compound (B) produced by hydrolysis SiOH group and -SiOH group derived from organosilicon compound (B), -SiOH group derived from other compounds, or active hydrogen (hydroxyl group) on the surface of layer (r) (especially layer (c)) in the laminate etc.) dehydration condensation, so in a preferred aspect, the layer (r) has a dehydration condensation structure derived from the organosilicon compound (A) and a dehydration condensation structure derived from the organosilicon compound (B). Since the layer (r) has a dehydration condensation structure derived from the organosilicon compound (B), the sliding properties of water droplets and the like are further improved.

作為上述式(b1)所表示之化合物之具體例之例示(C jF 2j 1-Si-(OCH 3) 3、C jF 2j 1-Si-(OC 2H 5) 3(j為1~12之整數)等)亦可全部參照第一態樣所例舉者。 (C j F 2j + 1 -Si-(OCH 3 ) 3 , C j F 2j + 1 -Si-(OC 2 H 5 ) 3 (j is Integers of 1 to 12), etc.) can also all refer to those exemplified in the first aspect.

於上述式(b1)所表示之化合物中,較佳為第一態樣所說明之上述式(b2)所表示之化合物。Among the compounds represented by the above formula (b1), the compound represented by the above formula (b2) described in the first aspect is preferable.

作為有機矽化合物(B),可僅使用一種,亦可使用兩種以上。As the organosilicon compound (B), only one type may be used, or two or more types may be used.

於層(r)包含源自有機矽化合物(B)之結構之情形時,源自有機矽化合物(B)之結構於層(r)中較佳為包含3質量%以上,更佳為5質量%以上,進而較佳為10質量%以上,又,較佳為50質量%以下,更佳為40質量%以下。此處,源自有機矽化合物(B)之結構係指有機矽化合物(B)及有機矽化合物(B)脫水縮合後之殘基。When the layer (r) contains the structure derived from the organosilicon compound (B), the structure derived from the organosilicon compound (B) preferably contains 3% by mass or more in the layer (r), more preferably 5% by mass % or more, more preferably at least 10 mass %, and preferably at most 50 mass %, more preferably at most 40 mass %. Here, the structure derived from the organosilicon compound (B) refers to the organosilicon compound (B) and the residue after dehydration condensation of the organosilicon compound (B).

層(r)中之源自有機矽化合物(B)之結構相對於源自有機矽化合物(A)之結構之質量比較佳為0.05以上,更佳為0.08以上,進而較佳為0.10以上,又,較佳為2.0以下,更佳為1.0以下,進而較佳為0.6以下。The mass ratio of the structure derived from the organosilicon compound (B) to the structure derived from the organosilicon compound (A) in the layer (r) is preferably at least 0.05, more preferably at least 0.08, further preferably at least 0.10, and , preferably 2.0 or less, more preferably 1.0 or less, further preferably 0.6 or less.

又,層(r)可於不阻礙本發明(第二態樣)之效果之範圍內包含矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量、即源自有機矽化合物(A)及(B)之固形物成分以外之固形物成分量於層(r)中,較佳為0.1質量%以下,更佳為0.01質量%以下。In addition, layer (r) may contain silanol condensation catalyst, antioxidant, antirust agent, ultraviolet absorber, light stabilizer, antifungal agent, antibacterial agent, antiviral agent, anti-fouling agent, deodorant, pigment, flame retardant, antistatic agent and other additives. The amount of the above-mentioned additives, that is, the amount of solid content other than the solid content derived from the organosilicon compounds (A) and (B), in layer (r) is preferably 0.1% by mass or less, more preferably 0.01% by mass or less .

2-3.含有氮元素之層(c) 含有氮元素之層(c)設置於基材(s)與含有氟元素之層(r)之間。藉由將層(c)設置於基材(s)與層(r)之間,層(r)之密接性變得良好,耐擦傷性提高,並且能夠抑制耐熱試驗後之防靜電性變差。亦可於基材(s)與含有氟元素之層(r)之間設置含有氮元素之層(c)以外之層,較佳為將層(c)與層(r)不經由其他層而直接積層,藉此,層(c)可發揮作為層(r)之底塗層之功能。又,更佳為層(c)與層(r)之間、及層(c)與基材(s)之間均不存在其他層而直接積層。 2-3. Layer (c) containing nitrogen element The layer (c) containing nitrogen element is arranged between the substrate (s) and the layer (r) containing fluorine element. By disposing the layer (c) between the substrate (s) and the layer (r), the adhesion of the layer (r) becomes good, the scratch resistance is improved, and the deterioration of the antistatic property after the heat resistance test can be suppressed . A layer other than the nitrogen element-containing layer (c) may also be provided between the substrate (s) and the fluorine element-containing layer (r), preferably the layer (c) and the layer (r) are not separated through other layers Direct lamination whereby layer (c) can function as an undercoat layer for layer (r). Moreover, it is more preferable that no other layers are present between the layer (c) and the layer (r), and between the layer (c) and the substrate (s), and they are directly laminated.

層(c)之厚度較佳為未達30 nm,更佳為25 nm以下,進而較佳為20 nm以下。藉由將層(c)之厚度設為規定以下,能夠進一步提高耐擦傷性。層(c)之厚度之下限並無特別限定,例如為3 nm。The thickness of layer (c) is preferably not more than 30 nm, more preferably not more than 25 nm, still more preferably not more than 20 nm. Scratch resistance can be further improved by making the thickness of a layer (c) into predetermined|prescribed or less. The lower limit of the thickness of the layer (c) is not particularly limited, for example, it is 3 nm.

層(c)之厚度可藉由層(c)形成用組合物中之固形物成分之濃度或層(c)形成用組合物之塗佈條件進行調整。層(c)之厚度可藉由橢圓偏光儀或X射線反射測定、X射線光電子光譜法(XPS)、截面方向之STEM測定、探針式薄膜輪廓儀等進行測定,可根據各層之材質或厚度適當選擇測定方法。於藉由截面方向之STEM測定對層(c)之厚度進行測定之情形時,可與上述層(r)之厚度之測定同樣地,藉由以包含與基材(s)之厚度方向平行之面之方式將積層體進行薄片化,切下超薄切片,並對該超薄切片之截面進行STEM觀察而進行測定,亦可藉由利用與上述同樣之方法將塗佈層(r)形成用組合物之前(即於基材(s)僅設置有層(c)之狀態)之積層中間物進行薄片化,並對截面進行STEM觀察而進行測定。再者,於對積層中間物之截面進行STEM觀察之情形時,為了容易分辨層(c)與外界之界面,可於薄片化之前利用氈筆等將層(c)之上表面塗黑後再進行測定。The thickness of the layer (c) can be adjusted by the concentration of the solid content in the layer (c) forming composition or the coating conditions of the layer (c) forming composition. The thickness of layer (c) can be measured by ellipsometer or X-ray reflection measurement, X-ray photoelectron spectroscopy (XPS), STEM measurement of cross-sectional direction, probe-type film profiler, etc. It can be measured according to the material or thickness of each layer Choose the measurement method appropriately. In the case of measuring the thickness of the layer (c) by STEM measurement in the cross-sectional direction, it can be measured by including a layer parallel to the thickness direction of the substrate (s) in the same way as the measurement of the thickness of the layer (r) above. The layered body is thinned by the surface method, and the ultra-thin section is cut out, and the cross-section of the ultra-thin section is observed and measured by STEM. It is also possible to form the coating layer (r) by using the same method as above. The layered intermediate before the composition (that is, the state where only the layer (c) is provided on the substrate (s)) is thinned, and the cross-section is observed and measured by STEM. Furthermore, in the case of STEM observation of the cross-section of the laminated intermediate, in order to easily distinguish the interface between the layer (c) and the outside world, the upper surface of the layer (c) can be blackened with a felt pen before thinning and then To measure.

又,層(c)與層(r)之合計厚度較佳為未達50 nm,較佳為40 nm以下,進而較佳為30 nm以下,尤佳為25 nm以下。藉由將層(c)與層(r)之合計厚度設為規定以下,能夠進一步提高耐擦傷性,並且外觀變得良好,因此較佳。又,層(c)與層(r)之合計厚度較佳為5 nm以上,更佳為8 nm以上。Also, the total thickness of layer (c) and layer (r) is preferably less than 50 nm, more preferably 40 nm or less, further preferably 30 nm or less, particularly preferably 25 nm or less. By making the total thickness of a layer (c) and a layer (r) into predetermined|prescribed or less, scratch resistance can be improved more, and an external appearance becomes favorable, so it is preferable. Also, the total thickness of layer (c) and layer (r) is preferably at least 5 nm, more preferably at least 8 nm.

2-3-1.有機矽化合物(C) 層(c)較佳為含有氮元素之有機矽化合物(C)之硬化層,於該情形時,層(c)通常可藉由塗佈有機矽化合物(C)之混合組合物(以下有時稱為層(c)形成用組合物)並使其硬化而獲得。有機矽化合物(C)較佳為含有氮元素且具有鍵結有水解性基或羥基之矽原子之化合物,由於有機矽化合物(C)所具有之-SiOH基或矽原子所鍵結之水解性基之水解所產生之有機矽化合物(C)之-SiOH基與源自有機矽化合物(C)之-SiOH基、或積層體中供形成層(c)之面之活性氫(羥基等)脫水縮合,故而層(c)可包含有機矽化合物(C)之脫水縮合物(即源自有機矽化合物(C)之縮合結構)。再者,層(c)所含之有機矽化合物(C)可全部為脫水縮合物。 2-3-1.Organosilicon compound (C) Layer (c) is preferably a hardened layer of organosilicon compound (C) containing nitrogen. In this case, layer (c) can usually be coated with a mixed composition of organosilicon compound (C) (hereinafter sometimes It is obtained by making it harden|cure called layer (c) composition for formation). The organosilicon compound (C) is preferably a compound containing nitrogen and having a silicon atom bonded to a hydrolyzable group or a hydroxyl group, because the -SiOH group possessed by the organosilicon compound (C) or the hydrolyzable silicon atom bonded The -SiOH group of the organosilicon compound (C) produced by the hydrolysis of the group is dehydrated from the -SiOH group of the organosilicon compound (C), or the active hydrogen (hydroxyl group, etc.) on the surface of the layer (c) in the laminate Condensation, so the layer (c) may contain the dehydration condensate of the organosilicon compound (C) (ie, derived from the condensation structure of the organosilicon compound (C)). Furthermore, all the organosilicon compounds (C) contained in the layer (c) may be dehydration condensates.

較佳之態樣中有機矽化合物(C)所具有之鍵結有水解性基或羥基(以下將兩者合併稱為反應性基(h1))之矽原子之數量於有機矽化合物(C)1分子中較佳為1以上10以下,更佳為1以上5以下,進而較佳為2以上5以下。作為上述水解性基,可例舉:烷氧基、鹵素原子、氰基、乙醯氧基、異氰酸酯基等,較佳為烷氧基,更佳為碳數1~4之烷氧基。較佳為於上述矽原子鍵結有烷氧基或羥基,尤佳為鍵結有碳數1~4之烷氧基或羥基。In a preferred aspect, the number of silicon atoms bonded to hydrolyzable groups or hydroxyl groups (hereinafter referred to as reactive groups (h1)) in the organosilicon compound (C) is greater than that of the organosilicon compound (C)1 The molecular weight is preferably from 1 to 10, more preferably from 1 to 5, and still more preferably from 2 to 5. Examples of the hydrolyzable group include an alkoxy group, a halogen atom, a cyano group, an acetyloxy group, an isocyanate group, and the like, preferably an alkoxy group, and more preferably an alkoxy group having 1 to 4 carbon atoms. Preferably, an alkoxy group or a hydroxyl group is bonded to the above-mentioned silicon atom, and an alkoxy group or a hydroxyl group having 1 to 4 carbon atoms is particularly preferable.

鍵結於1個矽原子之反應性基(h1)之數量為1以上即可,亦可為2或3,較佳為2或3。The number of reactive groups (h1) bonded to one silicon atom may be 1 or more, may be 2 or 3, and is preferably 2 or 3.

有機矽化合物(C)除了鍵結有上述反應性基(h1)之矽原子以外還含有氮元素,較佳為藉由具有胺基或胺骨架而含有氮元素。有機矽化合物(C)可具有胺基及胺骨架之任一者,具有胺基及胺骨架之兩者亦較佳。作為有機矽化合物(C),較佳為具有1個以上胺骨架。再者,上述胺骨架係以-NR 10-表示,R 10為氫原子或烷基。R 10較佳為氫原子或碳數1~5之烷基。又,於有機矽化合物(C)中包含複數個胺骨架之情形時,複數個胺骨架可相同亦可不同。 The organosilicon compound (C) contains nitrogen element in addition to the silicon atom to which the reactive group (h1) is bonded, and preferably contains nitrogen element by having an amine group or an amine skeleton. The organosilicon compound (C) may have any one of an amine group and an amine skeleton, and preferably has both an amine group and an amine skeleton. As an organosilicon compound (C), it is preferable to have one or more amine skeletons. Furthermore, the aforementioned amine skeleton is represented by -NR 10 -, and R 10 is a hydrogen atom or an alkyl group. R 10 is preferably a hydrogen atom or an alkyl group having 1 to 5 carbons. Moreover, when the organosilicon compound (C) contains a plurality of amine skeletons, the plural amine skeletons may be the same or different.

有機矽化合物(C)較佳為不具有氟聚醚結構之化合物,更佳為不具有氟元素之化合物。The organosilicon compound (C) is preferably a compound without a fluoropolyether structure, more preferably a compound without a fluorine element.

作為有機矽化合物(C),較佳為第一態樣所說明之上述式(c1)或(c2)所表示之化合物(有機矽化合物(C1)或(C2))。即,含有氮元素之層(c)較佳為上述式(c1)或(c2)所表示之有機矽化合物(C)之硬化層。The organosilicon compound (C) is preferably a compound represented by the above formula (c1) or (c2) described in the first aspect (organosilicon compound (C1) or (C2)). That is, the layer (c) containing nitrogen is preferably a cured layer of the organosilicon compound (C) represented by the above formula (c1) or (c2).

與第一態樣同樣地,有機矽化合物(C1)較佳為以上述式(c1-2)表示。As in the first aspect, the organosilicon compound (C1) is preferably represented by the above formula (c1-2).

關於有機矽化合物(C2),亦與第一態樣同樣,較佳為上述式(c2-2)所表示之化合物。As for the organosilicon compound (C2), similarly to the first aspect, a compound represented by the above formula (c2-2) is preferable.

源自有機矽化合物(C)之結構較佳為於層(c)中包含80質量%以上,更佳為包含90質量%以上,進而較佳為包含98質量%以上,又,可為100質量%。The structure derived from the organosilicon compound (C) is preferably contained in layer (c) at least 80% by mass, more preferably at least 90% by mass, still more preferably at least 98% by mass, and may be 100% by mass %.

又,層(c)可於不阻礙本發明(第二態樣)之效果之範圍內含有矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量、即源自有機矽化合物(C)之固形物成分以外之固形物成分量於層(c)中較佳為0.1質量%以下,更佳為0.01質量%以下。In addition, the layer (c) may contain a silanol condensation catalyst, an antioxidant, an antirust agent, an ultraviolet absorber, a light stabilizer, an antifungal agent, an antibacterial agent, antiviral agent, anti-fouling agent, deodorant, pigment, flame retardant, antistatic agent and other additives. The amount of the aforementioned additives, that is, the amount of solids other than those derived from the organosilicon compound (C), is preferably 0.1% by mass or less, more preferably 0.01% by mass or less in layer (c).

2-4.積層體之特性 2-4-1.防靜電性能 於將施加電壓設為500 V,於將本發明(第二態樣)之積層體於80℃保持36小時之耐熱試驗之前後測定於層(r)表面所測定之表面電阻率時,耐熱試驗後之表面電阻率相對於耐熱試驗前之表面電阻率,較佳為未達6.4倍,更佳為4.0倍以下,進而較佳為3.5倍以下,尤佳為3.3倍以下,下限並無特別限定,可為1.0倍,亦可為1.5倍。再者,耐熱試驗前之表面電阻率較佳為於約0℃~35℃之範圍下所管理之本發明(第二態樣)之積層體所測定之表面電阻率。 2-4. Characteristics of laminates 2-4-1. Antistatic performance When the surface resistivity measured on the surface of the layer (r) was measured before and after the heat resistance test in which the laminate of the present invention (second aspect) was kept at 80°C for 36 hours with the applied voltage set to 500 V, the heat resistance test The surface resistivity after the heat resistance test is preferably not more than 6.4 times, more preferably not more than 4.0 times, more preferably not more than 3.5 times, and most preferably not more than 3.3 times the surface resistivity before the heat resistance test. The lower limit is not particularly limited. , can be 1.0 times or 1.5 times. Furthermore, the surface resistivity before the heat resistance test is preferably the surface resistivity measured in the laminated body of the present invention (second aspect) managed in the range of about 0°C to 35°C.

耐熱試驗前之表面電阻率例如為1.0×10 11Ω/□以下,較佳為5.0×10 10Ω/□以下,下限並無特別限定,例如可為1.0×10 8Ω/□,亦可為1.0×10 9Ω/□。 The surface resistivity before the heat resistance test is, for example, 1.0×10 11 Ω/□ or less, preferably 5.0×10 10 Ω/□ or less. The lower limit is not particularly limited, for example, it may be 1.0×10 8 Ω/□, or it may be 1.0×10 9 Ω/□.

2-4-2.耐擦傷性 於進行利用鋼絲絨施加250 g/cm 2之壓力而將本發明(第二態樣)之積層體之層(r)表面往復摩擦1500次之磨耗試驗時,較佳為於LED(Light Emitting Diode,發光二極體)照明下於層(r)表面未觀察到損傷。 2-4-2. Scratch resistance When performing an abrasion test in which the surface of layer (r) of the laminate of the present invention (second aspect) is reciprocally rubbed 1,500 times by applying a pressure of 250 g/cm 2 with steel wool, Preferably, no damage is observed on the surface of layer (r) under LED (Light Emitting Diode, light emitting diode) illumination.

2-4-3.動摩擦係數 本發明(第二態樣)之積層體之層(r)表面之動摩擦係數較佳為0.1以下,更佳為0.090以下,進而較佳為0.080以下,又,亦可為0.010以上。 2-4-3. Dynamic friction coefficient The dynamic friction coefficient of the layer (r) surface of the laminate of the present invention (second aspect) is preferably 0.1 or less, more preferably 0.090 or less, further preferably 0.080 or less, and may be 0.010 or more.

2-5.積層體之製造方法 製造本發明(第二態樣)之積層體之較佳之方法包括:(i)於基材(s)上塗佈層(c)形成用組合物之步驟;(ii)使上述層(c)形成用組合物之塗佈層硬化之步驟;(iii)於上述層(c)形成用組合物之塗佈面塗佈撥水層形成用組合物之步驟;及(iv)使上述撥水層形成用組合物之塗佈層硬化之步驟,由上述層(c)形成用組合物之塗佈層形成上述層(c),由上述撥水層形成用組合物之塗佈層形成上述層(r)。 2-5. Manufacturing method of laminated body A preferred method of manufacturing the laminate of the present invention (second aspect) includes: (i) the step of coating the layer (c) forming composition on the substrate (s); (ii) making the above-mentioned layer (c) A step of hardening the coating layer of the composition for formation; (iii) a step of coating the composition for forming a water-repellent layer on the surface coated with the composition for formation of the layer (c); and (iv) making the above-mentioned water-repellent layer In the step of hardening the coating layer of the composition for forming the above layer (c), the above layer (c) is formed from the coating layer of the composition for forming the layer (c), and the above layer is formed by the coating layer of the composition for forming the water repellent layer ( r).

上述層(c)形成用組合物為有機矽化合物(C)之混合組合物。有機矽化合物(C)之混合組合物可藉由混合有機矽化合物(C)而獲得,於混合有機矽化合物(C)以外之成分之情形時,可藉由將有機矽化合物(C)與其他成分混合而獲得。層(c)形成用組合物亦包含混合後例如於保管中進行反應者,作為進行反應之例,可例舉上述層(c)形成用組合物包含鍵結於較佳之態樣中之上述有機矽化合物(C)之矽原子的水解性基因水解而成為-SiOH基之化合物(以下有時稱為有機矽化合物(C)之水解物)。又,作為進行反應之例,亦可例舉層(c)形成用組合物包含上述有機矽化合物(C)之縮合物,作為該縮合物,可例舉有機矽化合物(C)所具有之-SiOH基或水解所產生之有機矽化合物(C)之-SiOH基與源自有機矽化合物(C)之-SiOH基、或源自其他化合物之-SiOH基脫水縮合所形成之脫水縮合物。The composition for forming the layer (c) is a mixed composition of the organosilicon compound (C). The mixed composition of organosilicon compound (C) can be obtained by mixing organosilicon compound (C), and in the case of mixing components other than organosilicon compound (C), it can be obtained by mixing organosilicon compound (C) with other Obtained by mixing ingredients. The layer (c) forming composition also includes those that react after mixing, for example, during storage. As an example of performing the reaction, the above-mentioned layer (c) forming composition includes the above-mentioned organic compound bonded in a preferred form. The hydrolyzable gene of the silicon atom of the silicon compound (C) is hydrolyzed to form a -SiOH group compound (hereinafter sometimes referred to as the hydrolyzate of the organosilicon compound (C)). In addition, as an example of carrying out the reaction, a condensate containing the above-mentioned organosilicon compound (C) in the composition for forming the layer (c) may be exemplified. As the condensate, - Dehydration condensation product formed by dehydration condensation of SiOH group or -SiOH group of organosilicon compound (C) generated by hydrolysis and -SiOH group derived from organosilicon compound (C) or -SiOH group derived from other compounds.

上述層(c)形成用組合物較佳為混合有溶劑(E)。溶劑(E)並無特別限定,例如可使用:水、醇系溶劑、酮系溶劑、醚系溶劑、烴系溶劑、酯系溶劑等,尤佳為醇系溶劑。The composition for forming the layer (c) is preferably mixed with a solvent (E). The solvent (E) is not particularly limited, for example, water, alcohol solvents, ketone solvents, ether solvents, hydrocarbon solvents, ester solvents, etc. can be used, especially alcohol solvents.

醇系溶劑、酮系溶劑、醚系溶劑、烴系溶劑、及酯系溶劑可使用與第一態樣之溶劑(E)所例示者相同者。As the alcohol solvent, ketone solvent, ether solvent, hydrocarbon solvent, and ester solvent, the same ones as those exemplified for the solvent (E) of the first aspect can be used.

將上述層(c)形成用組合物之整體設為100質量%時之有機矽化合物(C)之量較佳為0.01質量%以上,更佳為0.05質量%以上,又,較佳為5質量%以下,更佳為3質量%以下,進而較佳為1質量%以下。上述有機矽化合物(C)之量可於製備組合物時進行調整。又,有機矽化合物(C)之量亦可根據組合物之分析結果而算出。作為根據組合物之分析結果進行特定之方法,例如組合物所含之各化合物之種類可藉由利用氣相層析質譜分析法或液相層析質譜分析法等分析組合物,並對所獲得之分析結果進行庫檢索而特定出,又,組合物所含之各化合物之量可使用校準曲線法,根據上述分析結果而算出。再者,於本說明書中,於記載有各成分之量、質量比或莫耳比之範圍之情形時,該範圍可於製備組合物時進行調整。又,層(c)形成用組合物中之固形物成分100質量%中之有機矽化合物(C)之量較佳為85質量%以上,更佳為95質量%以上。The amount of the organosilicon compound (C) when the entire composition for forming the layer (c) is 100% by mass is preferably at least 0.01% by mass, more preferably at least 0.05% by mass, and preferably 5% by mass % or less, more preferably 3 mass % or less, further preferably 1 mass % or less. The amount of the above organosilicon compound (C) can be adjusted during the preparation of the composition. In addition, the amount of the organosilicon compound (C) can also be calculated from the analysis results of the composition. As a specific method based on the analysis results of the composition, for example, the type of each compound contained in the composition can be analyzed by using gas chromatography-mass spectrometry or liquid chromatography-mass spectrometry, and the obtained The analysis results are identified by library search, and the amount of each compound contained in the composition can be calculated from the above analysis results using the calibration curve method. In addition, in this specification, when the range of the quantity of each component, mass ratio, or molar ratio is described, this range can be adjusted at the time of preparation of a composition. Also, the amount of the organosilicon compound (C) in the solid content of 100% by mass in the layer (c) forming composition is preferably at least 85% by mass, more preferably at least 95% by mass.

將上述層(c)形成用組合物之整體設為100質量%時之溶劑(E)之量較佳為80質量%以上,更佳為85質量%以上,進而較佳為90質量%以上,進而更佳為95質量%以上,進而更佳為98質量%以上,又,可為99.9質量%以下。The amount of the solvent (E) when the whole composition for forming the layer (c) is 100% by mass is preferably at least 80% by mass, more preferably at least 85% by mass, still more preferably at least 90% by mass, More preferably, it is at least 95% by mass, still more preferably at least 98% by mass, and may be at most 99.9% by mass.

又,層(c)形成用組合物可於不阻礙本發明(第二態樣)之效果之範圍內混合矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量、即有機矽化合物(C)及溶劑(E)以外所含之物之量於層(c)形成用組合物100質量%中,較佳為5質量%以下,更佳為1質量%以下。In addition, the layer (c) forming composition may be mixed with a silanol condensation catalyst, an antioxidant, an antirust agent, an ultraviolet absorber, a light stabilizer, Various additives such as fungicides, antibacterial agents, antiviral agents, antifouling agents, deodorants, pigments, flame retardants, and antistatic agents. The amount of the above-mentioned additives, that is, the amount of substances other than the organosilicon compound (C) and the solvent (E), is preferably 5% by mass or less, more preferably 1% by mass, in 100% by mass of the layer (c) forming composition. Mass% or less.

作為塗佈上述層(c)形成用組合物之方法,例如可例舉:浸漬塗佈法、輥塗法、棒式塗佈法、旋轉塗佈法、噴塗法、模嘴塗佈法、凹版塗佈法等。As a method of coating the composition for forming the layer (c), for example, a dip coating method, a roll coating method, a bar coating method, a spin coating method, a spray coating method, a die coating method, and a gravure coating method are mentioned. coating method, etc.

於塗佈上述層(c)形成用組合物之前,較佳為預先對基材(s)之塗佈面實施易接著處理,較佳之易接著處理、及其效果與第一態樣中所說明者相同。Before coating the composition for forming layer (c) above, it is preferable to perform an easy-adhesive treatment on the coated surface of the substrate (s) in advance, and the preferred easy-adhesive treatment and its effects are the same as those described in the first aspect or the same.

於塗佈層(c)形成用組合物後,於常溫、大氣中例如靜置10秒以上(通常為24小時以下),藉此使上述層(c)形成用組合物之塗佈層乾燥,而可由該塗佈層形成上述層(c)。於本發明(第二態樣)中,常溫為5~60℃,較佳為15~40℃之溫度範圍。於常溫下靜置時之濕度條件可設為50~90%RH。又,於塗佈層(c)形成用組合物後,可加熱為超過60℃之溫度(通常為120℃以下,可為100℃以下,亦可為80℃以下)並保持10秒~60分鐘(較佳為30秒~40分鐘)左右。After applying the composition for layer (c) formation, the coating layer of the composition for formation of layer (c) is dried by standing at room temperature and in the atmosphere, for example, for 10 seconds or more (usually less than 24 hours), Instead, the above-mentioned layer (c) can be formed from this coating layer. In the present invention (second aspect), normal temperature is 5-60°C, preferably 15-40°C. The humidity condition when standing at room temperature can be set to 50~90%RH. In addition, after coating the layer (c) forming composition, it may be heated to a temperature exceeding 60°C (usually 120°C or lower, may be 100°C or lower, or may be 80°C or lower) and keep it for 10 seconds to 60 minutes (Preferably 30 seconds to 40 minutes).

繼而,將撥水層形成用組合物塗佈於上述層(c)形成用組合物之塗佈面並加以乾燥,藉此可由上述撥水層形成用組合物之塗佈層形成上述層(r)。Next, the composition for forming a water-repellent layer is applied to the coated surface of the composition for forming the layer (c) and dried, whereby the layer (r ).

上述撥水層形成用組合物為有機矽化合物(A)之混合組合物,可藉由混合有機矽化合物(A)而獲得。又,於混合有機矽化合物(A)以外之成分之情形時,可藉由將上述有機矽化合物(A)與其他成分混合而獲得撥水層形成用組合物。上述撥水層形成用組合物亦包含混合後例如於保管中進行反應者。作為進行反應之例,例如可例舉上述撥水層形成用組合物包含鍵結於上述有機矽化合物(A)之矽原子(亦可經由連結基而鍵結)之水解性基因水解而成為-SiOH基(亦可Si與OH經由連結基鍵結)之化合物(以下有時稱為有機矽化合物(A)之水解物)。又,亦可例舉上述撥水層形成用組合物包含有機矽化合物(A)之縮合物,作為該縮合物,例如可例舉有機矽化合物(A)所具有之-SiOH基或水解所產生之有機矽化合物(A)之-SiOH基(亦可Si與OH經由連結基鍵結)與源自有機矽化合物(A)之-SiOH基(亦可Si與OH經由連結基鍵結)、或源自其他化合物之-SiOH基脫水縮合所形成之脫水縮合物。The composition for forming a water-repellent layer is a mixed composition of an organosilicon compound (A), and can be obtained by mixing an organosilicon compound (A). Moreover, when mixing components other than an organosilicon compound (A), the composition for water-repellent layer formation can be obtained by mixing the said organosilicon compound (A) and other components. The said composition for water-repellent layer formation also includes what reacted after mixing, for example, in storage. As an example of the reaction, for example, the composition for forming a water-repellent layer may be hydrolyzed by a hydrolyzable gene containing a silicon atom (may also be bonded via a linking group) bonded to the above-mentioned organosilicon compound (A) to become- A compound of SiOH group (Si and OH may be bonded via a linking group) (hereinafter sometimes referred to as a hydrolyzate of organosilicon compound (A)). In addition, the above-mentioned composition for forming a water-repellent layer may also include a condensate containing an organosilicon compound (A). As the condensate, for example, a -SiOH group contained in the organosilicon compound (A) or a condensate produced by hydrolysis may be exemplified. The -SiOH group of the organosilicon compound (A) (Si and OH may also be bonded via a linking group) and the -SiOH group derived from the organosilicon compound (A) (Si and OH may also be bonded via a linking group), or Dehydration condensate formed by dehydration condensation of -SiOH group derived from other compounds.

將撥水層形成用組合物之整體設為100質量%時之有機矽化合物(A)之量例如為0.01質量%以上,較佳為0.05質量%以上,又,較佳為0.5質量%以下,更佳為0.3質量%以下。The amount of the organosilicon compound (A) when the whole composition for forming a water-repellent layer is 100% by mass is, for example, at least 0.01% by mass, preferably at least 0.05% by mass, and preferably at most 0.5% by mass, More preferably, it is 0.3 mass % or less.

上述撥水層形成用組合物較佳為混合有上述有機矽化合物(A)、及有機矽化合物(B)。藉此,層(r)能夠包含源自有機矽化合物(B)之結構。上述撥水層形成用組合物如上所述,亦包含將有機矽化合物(A)及視需要使用之有機矽化合物(B)混合後進行反應者,作為進行反應之例,可例舉上述撥水層形成用組合物包含鍵結於上述有機矽化合物(B)之矽原子之水解性基因水解而成為-SiOH基之化合物(以下有時稱為有機矽化合物(B)之水解物)。又,亦可例舉上述撥水層形成用組合物包含有機矽化合物(B)之縮合物,作為該縮合物,可例舉有機矽化合物(B)所具有之-SiOH基或水解所產生之有機矽化合物(B)之-SiOH基與源自有機矽化合物(B)之-SiOH基、或源自其他化合物之-SiOH基脫水縮合所形成之脫水縮合物。It is preferable that the said composition for water-repellent layer formation mixes the said organosilicon compound (A) and organosilicon compound (B). Thereby, layer (r) can comprise a structure derived from organosilicon compound (B). The composition for forming a water-repellent layer is as described above, and also includes a mixture of an organosilicon compound (A) and an optionally used organosilicon compound (B) followed by a reaction. As an example of carrying out the reaction, the above-mentioned water-repellent The composition for layer formation contains the compound which hydrolyzed the silicon atom bonded to the said organosilicon compound (B) and became -SiOH group by hydrolysis (it may be called the hydrolyzate of organosilicon compound (B) hereafter). In addition, the above-mentioned composition for forming a water-repellent layer may also include a condensate containing an organosilicon compound (B), and the condensate may include -SiOH groups possessed by the organosilicon compound (B) or those produced by hydrolysis. A dehydration condensate formed by dehydration condensation of -SiOH group of organosilicon compound (B) and -SiOH group derived from organosilicon compound (B) or -SiOH group derived from other compounds.

將撥水層形成用組合物之整體設為100質量%時之有機矽化合物(B)之量例如為0.01質量%以上,較佳為0.03質量%以上,又,較佳為0.3質量%以下,更佳為0.2質量%以下。The amount of the organosilicon compound (B) when the entire composition for forming a water-repellent layer is 100% by mass is, for example, at least 0.01% by mass, preferably at least 0.03% by mass, and preferably at most 0.3% by mass, More preferably, it is 0.2 mass % or less.

上述撥水層形成用組合物中之有機矽化合物(B)相對於有機矽化合物(A)之質量比較佳為0.2以上,更佳為0.4以上,又,較佳為3.0以下,更佳為1.5以下。The mass ratio of the organosilicon compound (B) to the organosilicon compound (A) in the composition for forming a water-repellent layer is preferably at least 0.2, more preferably at least 0.4, and preferably at most 3.0, more preferably at least 1.5 the following.

又,將撥水層形成用組合物之整體設為100質量%時之有機矽化合物(A)及(B)之合計量較佳為0.05質量%以上,更佳為0.10質量%以上,又,較佳為0.7質量%以下,更佳為0.5質量%以下,進而較佳為0.3質量%以下。將撥水層形成用組合物中之固形物成分之合計設為100質量%時之有機矽化合物(A)及(B)之合計量較佳為85質量%以上,更佳為90質量%以上,進而較佳為95質量%以上。Also, the total amount of the organosilicon compounds (A) and (B) when the entire composition for forming a water-repellent layer is 100% by mass is preferably at least 0.05% by mass, more preferably at least 0.10% by mass. Preferably it is 0.7 mass % or less, More preferably, it is 0.5 mass % or less, More preferably, it is 0.3 mass % or less. The total amount of the organosilicon compounds (A) and (B) when the total of the solids in the composition for forming a water-repellent layer is 100% by mass is preferably at least 85% by mass, more preferably at least 90% by mass , and more preferably at least 95% by mass.

上述撥水層形成用組合物通常混合有溶劑(D)。作為溶劑(D),較佳為使用氟系溶劑,例如可使用氟化醚系溶劑、氟化胺系溶劑、氟化烴系溶劑等,尤佳為沸點為100℃以上。作為氟化醚系溶劑、氟化胺系溶劑、氟化烴系溶劑,可例舉與第一態樣之溶劑(D)所例示者相同者。The above composition for forming a water-repellent layer usually contains a solvent (D). As the solvent (D), it is preferable to use a fluorine-based solvent, for example, a fluorinated ether-based solvent, a fluorinated amine-based solvent, a fluorinated hydrocarbon-based solvent, etc., and it is particularly preferable to use a boiling point of 100° C. or higher. Examples of the fluorinated ether-based solvent, fluorinated amine-based solvent, and fluorinated hydrocarbon-based solvent include the same ones as those exemplified for the solvent (D) of the first aspect.

作為氟系溶劑,除了上述以外,可使用Asahiklin(註冊商標)AK225(AGC公司製造)等氫氯氟碳、Asahiklin(註冊商標)AC2000(AGC公司製造)等氫氟碳等。As the fluorine-based solvent, in addition to the above, hydrochlorofluorocarbons such as Asahiklin (registered trademark) AK225 (manufactured by AGC Corporation), and hydrofluorocarbons such as Asahiklin (registered trademark) AC2000 (manufactured by AGC Corporation), and the like can be used.

作為溶劑(D),較佳為至少使用氟化胺系溶劑。As the solvent (D), it is preferable to use at least an amine fluoride solvent.

將撥水層形成用組合物之整體設為100質量%時之溶劑(D)之量較佳為80質量%以上,更佳為90質量%以上,進而較佳為95質量%以上,進而更佳為98質量%以上,又,可為99.9質量%以下。The amount of the solvent (D) when the entire composition for forming a water-repellent layer is 100% by mass is preferably at least 80% by mass, more preferably at least 90% by mass, still more preferably at least 95% by mass, and still more preferably at least 90% by mass. It is preferably at least 98% by mass, and may be at most 99.9% by mass.

又,撥水層形成用組合物可於不阻礙本發明(第二態樣)之效果之範圍內混合矽烷醇縮合觸媒、抗氧化劑、防銹劑、紫外線吸收劑、光穩定劑、防黴劑、抗菌劑、抗病毒劑、生物附著防止劑、除臭劑、顏料、阻燃劑、抗靜電劑等各種添加劑。上述添加劑之量、即有機矽化合物(A)、(B)及溶劑(E)以外所含之物之量於撥水層形成用組合物100質量%中,較佳為5質量%以下,更佳為1質量%以下。In addition, the composition for forming a water-repellent layer may be mixed with a silanol condensation catalyst, an antioxidant, an antirust agent, an ultraviolet absorber, a light stabilizer, an antifungal Various additives such as antibacterial agent, antiviral agent, antifouling agent, deodorant, pigment, flame retardant, antistatic agent, etc. The amount of the above-mentioned additives, that is, the amount of substances other than the organosilicon compounds (A), (B) and the solvent (E), is preferably 5% by mass or less in 100% by mass of the composition for forming a water-repellent layer, and more preferably Preferably, it is 1% by mass or less.

作為塗佈上述撥水層形成用組合物(1)之方法,例如可例舉:浸漬塗佈法、輥塗法、棒式塗佈法、旋轉塗佈法、噴塗法、模嘴塗佈法、凹版塗佈法等。Examples of the method of applying the composition (1) for forming a water-repellent layer include dip coating, roll coating, bar coating, spin coating, spray coating, and die coating. , gravure coating method, etc.

於塗佈撥水層形成用組合物後,於常溫、大氣中例如靜置10秒以上(通常為24小時以下),藉此可製造本發明(第二態樣)之積層體。於常溫下靜置時之濕度條件可設為50~90%RH。又,於塗佈撥水層形成用組合物後,可加熱為超過60℃之溫度(通常為120℃以下,可為100℃以下,亦可為80℃以下)並保持10秒~60分鐘(較佳為30秒~40分鐘)左右。After applying the water-repellent layer-forming composition, the layered product of the present invention (second aspect) can be produced by allowing to stand at room temperature in the air for at least 10 seconds (usually less than 24 hours). The humidity condition when standing at room temperature can be set to 50~90%RH. Also, after coating the composition for forming a water-repellent layer, it may be heated to a temperature exceeding 60°C (usually below 120°C, may be below 100°C, or may be below 80°C) and kept for 10 seconds to 60 minutes ( Preferably, it is about 30 seconds to 40 minutes).

3.顯示裝置 本發明(第一態樣及第二態樣)之積層體可適宜地用於顯示裝置,尤其適宜用於軟性顯示裝置。本發明(第一態樣及第二態樣)之積層體較佳為於顯示裝置中可用作前面板,亦存在將該前面板稱為視窗膜之情況。 3. Display device The laminates of the present invention (the first aspect and the second aspect) can be suitably used for display devices, especially for flexible display devices. The laminate of the present invention (the first aspect and the second aspect) is preferably used as a front panel in a display device, and the front panel may be called a window film in some cases.

上述顯示裝置較佳為包括包含視窗膜(即本發明(第一態樣及第二態樣)之積層體)之顯示裝置用積層體、及有機EL(Electroluminescence,電致發光)顯示面板,相對於有機EL顯示面板而於視認側配置有顯示裝置用積層體。又,於軟性顯示裝置中,較佳為包括包含具有軟性特性之視窗膜之軟性顯示裝置用積層體、及有機EL顯示面板,相對於有機EL顯示面板而將軟性顯示裝置用積層體配置於視認側,以能夠彎折之方式構成。顯示裝置用積層體(較佳為軟性顯示裝置用積層體)可進而含有偏光板(較佳為圓偏光板)、觸控感測器等而構成觸控面板顯示器,該等之積層順序為任意,較佳為自視認側起依序積層有視窗膜、偏光板、觸控感測器或依序積層有視窗膜、觸控感測器、偏光板。若相較於觸控感測器而偏光板存在於視認側,則變得不易視認到觸控感測器之圖案,顯示圖像之視認性變得良好,因此較佳。各構件可使用接著劑、黏著劑等進行積層。又,顯示裝置(較佳為軟性顯示裝置)可具備於上述視窗膜、偏光板、觸控感測器之任一層之至少一面所形成之遮光圖案。The above-mentioned display device preferably includes a laminate for a display device including a window film (that is, the laminate of the present invention (the first aspect and the second aspect)) and an organic EL (Electroluminescence, electroluminescent) display panel. The laminate for display devices is arranged on the viewing side of the organic EL display panel. In addition, in the flexible display device, it is preferable to include a laminate for a flexible display device including a window film having a flexible property, and an organic EL display panel, and arrange the laminate for a flexible display device in a visually recognizable position relative to the organic EL display panel. The side is configured in a bendable manner. The laminate for a display device (preferably a laminate for a flexible display device) may further include a polarizer (preferably a circular polarizer), a touch sensor, etc. to form a touch panel display, and the lamination sequence of these is arbitrary , preferably a window film, a polarizer, and a touch sensor are laminated sequentially from the viewing side, or a window film, a touch sensor, and a polarizer are laminated in sequence. If the polarizing plate is present on the viewing side of the touch sensor, it becomes difficult to recognize the pattern of the touch sensor and the visibility of the display image becomes good, which is preferable. Each member can be laminated using an adhesive, an adhesive, or the like. In addition, the display device (preferably a flexible display device) may be equipped with a light-shielding pattern formed on at least one side of any layer of the above-mentioned window film, polarizer, and touch sensor.

(視窗膜) 視窗膜配置於顯示裝置(較佳為軟性圖像顯示裝置)之視認側,發揮保護其他構成要素免受源自外部之衝擊或溫濕度等環境變化之影響之作用。作為此種保護層,可使用玻璃,於軟性圖像顯示裝置中,視窗膜並非如玻璃般為剛性且堅硬者,可使用具有軟性特性之材料。因此,於使用本發明(第一態樣及第二態樣)之積層體作為軟性顯示裝置中之視窗膜之情形時,基材(s)較佳為具有包含軟性之透明基材之層,基材(s)亦可具有於至少一面積層有硬塗層之多層結構。 (window film) The window film is arranged on the viewing side of the display device (preferably a flexible image display device), and plays a role in protecting other components from external impacts or environmental changes such as temperature and humidity. As such a protective layer, glass can be used. In a flexible image display device, the window film is not rigid and hard like glass, and a material having soft properties can be used. Therefore, when using the laminate of the present invention (the first aspect and the second aspect) as a window film in a flexible display device, the substrate (s) preferably has a layer including a flexible transparent substrate, The substrate (s) may also have a multilayer structure with a hard coat layer on at least one area.

上述透明基材之可見光線之透過率例如為70%以上,較佳為80%以上。上述透明基材只要為具有透明性之高分子膜,則可使用任意者。具體而言,可為由如下物質所形成之膜,可使用未經延伸、單軸或雙軸延伸膜:具有包含聚乙烯、聚丙烯、聚甲基戊烯、降莰烯或環烯烴之單體之單元的環烯烴系衍生物等聚烯烴類;二乙醯基纖維素、三乙醯基纖維素、丙醯基纖維素等(改性)纖維素類;甲基丙烯酸甲酯(共)聚合物等丙烯酸類;苯乙烯(共)聚合物等聚苯乙烯類;丙烯腈-丁二烯-苯乙烯共聚物類、丙烯腈-苯乙烯共聚物類、乙烯-乙酸乙烯酯共聚物類、聚氯乙烯類、聚偏二氯乙烯類;聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯、聚碳酸酯、聚芳酯等聚酯類;尼龍等聚醯胺類;聚醯亞胺類、聚醯胺醯亞胺類、聚醚醯亞胺類、聚醚碸類、聚碸類、聚乙烯醇類、聚乙烯醇縮醛類、聚胺基甲酸酯類、環氧樹脂類等高分子。該等高分子分別可單獨使用或混合兩種以上使用。較佳為於上述所記載之透明基材中,較佳為透明性及耐熱性優異之聚醯胺膜、聚醯胺醯亞胺膜或聚醯亞胺膜、聚酯系膜、烯烴系膜、丙烯酸系膜、纖維素系膜。亦較佳為於高分子膜中分散二氧化矽等無機粒子、有機微粒子、橡膠粒子等。進而,亦可含有如顏料或染料之著色劑、螢光增白劑、分散劑、塑化劑、熱穩定劑、光穩定劑、紅外線吸收劑、紫外線吸收劑、抗靜電劑、抗氧化劑、潤滑劑、溶劑等調配劑。上述透明基材之厚度為5 μm以上200 μm以下,較佳為20 μm以上100 μm以下。尤其於用於軟性圖像顯示裝置之情形時,上述透明基材之厚度較佳為5 μm以上60 μm以下。The visible light transmittance of the transparent substrate is, for example, above 70%, preferably above 80%. Any transparent base material can be used as long as it is a transparent polymer film. Specifically, it may be a film formed of an unstretched, uniaxially or biaxially stretched film having a monolayer containing polyethylene, polypropylene, polymethylpentene, norbornene, or cycloolefin. Polyolefins such as cycloolefin derivatives of body units; (modified) celluloses such as diacetyl cellulose, triacetyl cellulose, and acryl cellulose; methyl methacrylate (co) Acrylics such as polymers; polystyrenes such as styrene (co)polymers; acrylonitrile-butadiene-styrene copolymers, acrylonitrile-styrene copolymers, ethylene-vinyl acetate copolymers, Polyvinyl chloride, polyvinylidene chloride; polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polycarbonate, polyarylate and other polyesters; Nylon and other polyamides; Polymers such as urethanes and epoxy resins. These polymers can be used alone or in combination of two or more. Among the transparent substrates described above, polyamide films, polyamideimide films or polyimide films, polyester films, and olefin films having excellent transparency and heat resistance are preferred. , Acrylic film, cellulose film. It is also preferable to disperse inorganic particles such as silicon dioxide, organic fine particles, rubber particles, etc. in the polymer film. Furthermore, coloring agents such as pigments or dyes, fluorescent whitening agents, dispersants, plasticizers, heat stabilizers, light stabilizers, infrared absorbers, ultraviolet absorbers, antistatic agents, antioxidants, lubricating agents, etc. Agents, solvents and other preparations. The thickness of the above-mentioned transparent substrate is not less than 5 μm and not more than 200 μm, preferably not less than 20 μm and not more than 100 μm. Especially when used in a flexible image display device, the thickness of the above-mentioned transparent substrate is preferably not less than 5 μm and not more than 60 μm.

使用本發明(第一態樣及第二態樣)之積層體作為視窗膜之情形時之硬塗層亦與上述硬塗層(hc)相同。如上所述,硬塗層(hc)較佳為由活性能量線硬化型樹脂及熱固型之樹脂所形成,此種樹脂可藉由包含照射活性能量線或熱能而形成交聯結構之反應性材料之硬塗組合物之硬化所形成。上述硬塗組合物含有自由基聚合性化合物及陽離子聚合性化合物之至少一種聚合物。When using the laminated body of this invention (1st aspect and 2nd aspect) as a window film, the hard-coat layer is also the same as said hard-coat layer (hc). As described above, the hard coat layer (hc) is preferably formed of an active energy ray-curable resin and a thermosetting resin that can be reactive by including irradiation of active energy ray or thermal energy to form a crosslinked structure. It is formed by the hardening of the hard coating composition of the material. The above-mentioned hard coat composition contains at least one polymer of a radically polymerizable compound and a cationically polymerizable compound.

上述自由基聚合性化合物為具有自由基聚合性基之化合物。作為上述自由基聚合性化合物所具有之自由基聚合性基,只要為能夠發生自由基聚合反應之官能基即可,可例舉含有碳-碳不飽和雙鍵之基等。具體而言,可例舉:乙烯基、(甲基)丙烯醯基等。再者,於上述自由基聚合性化合物具有2個以上自由基聚合性基之情形時,該等自由基聚合性基可分別相同,亦可分別不同。上述自由基聚合性化合物於1分子中所具有之自由基聚合性基之數量就提高硬塗層之硬度之方面而言,較佳為2個以上。作為上述自由基聚合性化合物,就反應性之高低之方面而言,其中較佳為具有(甲基)丙烯醯基之化合物,可較佳地使用1分子中具有2~6個(甲基)丙烯醯基之被稱為多官能丙烯酸酯單體之化合物或被稱為環氧(甲基)丙烯酸酯、胺基甲酸酯(甲基)丙烯酸酯、聚酯(甲基)丙烯酸酯之分子內具有數個(甲基)丙烯醯基之分子量為數百至數千之低聚物。較佳為包含選自環氧(甲基)丙烯酸酯、胺基甲酸酯(甲基)丙烯酸酯及聚酯(甲基)丙烯酸酯中之一種以上。The above radical polymerizable compound is a compound having a radical polymerizable group. The radical polymerizable group contained in the above-mentioned radical polymerizable compound may be any functional group as long as it can undergo a radical polymerization reaction, and may, for example, be a group containing a carbon-carbon unsaturated double bond. Specifically, a vinyl group, a (meth)acryl group, etc. are mentioned. In addition, when the above-mentioned radical polymerizable compound has two or more radical polymerizable groups, these radical polymerizable groups may be respectively the same or different. It is preferable that the number of the radical polymerizable group which the said radical polymerizable compound has in 1 molecule is 2 or more from the point which raises the hardness of a hard-coat layer. As the above-mentioned radical polymerizable compound, a compound having a (meth)acryl group is preferable in terms of high or low reactivity, and a compound having 2 to 6 (methyl) groups in one molecule can be preferably used. Acryl-based compounds called polyfunctional acrylate monomers or molecules called epoxy (meth)acrylates, urethane (meth)acrylates, polyester (meth)acrylates An oligomer with a molecular weight of several hundred to several thousand with several (meth)acryl groups in it. It is preferable to contain one or more types selected from epoxy (meth)acrylate, urethane (meth)acrylate, and polyester (meth)acrylate.

上述陽離子聚合性化合物為具有環氧基、氧雜環丁基、乙烯醚基等陽離子聚合性基之化合物。上述陽離子聚合性化合物於1分子中所具有之陽離子聚合性基之數量就提高硬塗層之硬度之方面而言,較佳為2個以上,進而較佳為3個以上。又,作為上述陽離子聚合性化合物,其中較佳為具有環氧基及氧雜環丁基之至少一種作為陽離子聚合性基之化合物。環氧基、氧雜環丁基等環狀醚基就聚合反應所伴隨之收縮較小之方面而言較佳。又,具有環狀醚基中之環氧基之化合物具有如下優點:容易獲得多種結構之化合物,不會對所獲得之硬塗層之耐久性造成不良影響,亦容易控制與自由基聚合性化合物之相容性。又,環狀醚基中之氧雜環丁基具有如下優點:與環氧基相比,聚合度容易變高,低毒性,加快由所獲得之硬塗層之陽離子聚合性化合物所獲得之網路形成速度,即便於與自由基聚合性化合物混合存在之區域亦不會於膜中殘留未反應之單體,形成獨立之網路等。The above-mentioned cationically polymerizable compound is a compound having a cationically polymerizable group such as an epoxy group, an oxetanyl group, or a vinyl ether group. The number of cationically polymerizable groups that the above-mentioned cationically polymerizable compound has in 1 molecule is preferably 2 or more, more preferably 3 or more, from the viewpoint of increasing the hardness of the hard coat layer. In addition, as the above-mentioned cationically polymerizable compound, a compound having at least one of an epoxy group and an oxetanyl group as a cationically polymerizable group is preferable. Cyclic ether groups such as epoxy groups and oxetanyl groups are preferable in that the shrinkage accompanying the polymerization reaction is small. In addition, the compound having the epoxy group in the cyclic ether group has the following advantages: it is easy to obtain compounds of various structures, it does not adversely affect the durability of the obtained hard coat layer, and it is easy to control the chemical composition of the radical polymerizable compound. the compatibility. In addition, the oxetanyl group in the cyclic ether group has the following advantages: compared with the epoxy group, the degree of polymerization is easily increased, low toxicity, and the network obtained by the cationic polymerizable compound of the obtained hard coat is accelerated. The road formation speed is high, and even in the area where it is mixed with the radical polymerizable compound, unreacted monomers will not remain in the film, forming an independent network, etc.

作為具有環氧基之陽離子聚合性化合物,例如可例舉:具有脂環族環之多元醇之聚縮水甘油醚、或藉由利用過氧化氫、過酸等適當之氧化劑將含有環己烯環、環戊烯環之化合物進行環氧化所獲得之脂環族環氧樹脂;脂肪族多元醇、或其環氧烷加成物之聚縮水甘油醚、脂肪族長鏈多元酸之聚縮水甘油酯、(甲基)丙烯酸縮水甘油酯之均聚物、共聚物等脂肪族環氧樹脂;藉由雙酚A、雙酚F或氫化雙酚A等雙酚類、或該等之環氧烷加成物、己內酯加成物等衍生物與表氯醇之反應所製造之縮水甘油醚、及作為酚醛清漆環氧樹脂等之由雙酚類衍生之縮水甘油醚型環氧樹脂等。 可於上述硬塗組合物中進而包含聚合起始劑。作為聚合起始劑,為自由基聚合起始劑、陽離子聚合起始劑、自由基及陽離子聚合起始劑等,可適當選擇使用。該等聚合起始劑係藉由活性能量線照射及加熱之至少一種而分解,產生自由基或陽離子而進行自由基聚合與陽離子聚合者。 Examples of cationic polymerizable compounds having epoxy groups include: polyglycidyl ethers of polyhydric alcohols having alicyclic rings; , cycloaliphatic epoxy resins obtained by epoxidizing cyclopentene ring compounds; polyglycidyl ethers of aliphatic polyhydric alcohols or their alkylene oxide adducts, polyglycidyl esters of aliphatic long-chain polybasic acids, Aliphatic epoxy resins such as homopolymers and copolymers of glycidyl (meth)acrylate; addition of bisphenols such as bisphenol A, bisphenol F, or hydrogenated bisphenol A, or alkylene oxides thereof Glycidyl ethers produced by the reaction of derivatives such as caprolactone adducts and epichlorohydrin, and glycidyl ether-type epoxy resins derived from bisphenols as novolac epoxy resins, etc. A polymerization initiator may be further contained in the above-mentioned hard coat composition. As a polymerization initiator, a radical polymerization initiator, a cationic polymerization initiator, a radical and a cationic polymerization initiator, etc. can be selected suitably and used. These polymerization initiators are decomposed by at least one of active energy ray irradiation and heating to generate free radicals or cations to carry out free radical polymerization and cationic polymerization.

自由基聚合起始劑只要能夠釋放出藉由活性能量線照射及加熱之至少任一者開始自由基聚合之物質即可。例如,作為熱自由基聚合起始劑,可例舉:過氧化氫、過苯甲酸等有機過氧化物、偶氮二丁腈等偶氮化合物等。 作為活性能量線自由基聚合起始劑,有藉由分子之分解生成自由基之Type1型自由基聚合起始劑、及與三級胺共存並藉由奪氫型反應生成自由基之Type2型自由基聚合起始劑,可分別單獨使用或併用。 The radical polymerization initiator is only required to release a substance that starts radical polymerization by at least any one of active energy ray irradiation and heating. For example, organic peroxides, such as hydrogen peroxide and perbenzoic acid, azo compounds, such as azobisbutyronitrile, etc. are mentioned as a thermal radical polymerization initiator. As active energy ray radical polymerization initiators, there are Type 1 free radical polymerization initiators that generate free radicals by molecular decomposition, and Type 2 free radicals that coexist with tertiary amines and generate free radicals through hydrogen abstraction reactions. The base polymerization initiators can be used alone or in combination.

陽離子聚合起始劑只要能夠釋放出藉由活性能量線照射及加熱之至少任一者開始陽離子聚合之物質即可。作為陽離子聚合起始劑,可使用:芳香族錪鹽、芳香族鋶鹽、環戊二烯基鐵(II)錯合物等。該等根據結構之差異,可藉由活性能量線照射或加熱之任一者或兩者開始陽離子聚合。The cationic polymerization initiator should just release a substance that starts cationic polymerization by at least any one of active energy ray irradiation and heating. As the cationic polymerization initiator, aromatic iodonium salts, aromatic permeic acid salts, cyclopentadienyl iron (II) complexes, and the like can be used. According to these structural differences, cationic polymerization can be initiated by either or both of active energy ray irradiation and heating.

上述聚合起始劑相對於上述硬塗組合物整體100重量%而可包含0.1~10重量%。於上述聚合起始劑之含量未達0.1重量%之情形時,無法充分進行硬化,難以實現最終所獲得之塗膜之機械物性或密接力,於超過10重量%之情形時,存在產生硬化收縮引起之接著力不良或開裂現象及捲縮現象。The said polymerization initiator can contain 0.1-10 weight% with respect to 100 weight% of the said hard-coat composition wholes. When the content of the above-mentioned polymerization initiator is less than 0.1% by weight, the hardening cannot be performed sufficiently, and it is difficult to realize the mechanical properties or adhesion of the coating film finally obtained. When the content exceeds 10% by weight, there may be shrinkage caused by hardening Caused by poor adhesion or cracking phenomenon and curling phenomenon.

上述硬塗組合物可進而包含進而選自由溶劑、添加劑所組成之群中一種以上。上述溶劑可使上述聚合性化合物及聚合起始劑溶解或分散,因此只要為作為本技術領域之硬塗組合物之溶劑,則可無限制地使用。上述添加劑可進而包含:無機粒子、調平劑、穩定劑、界面活性劑、抗靜電劑、潤滑劑、防污劑等。The above-mentioned hard coating composition may further contain one or more types selected from the group consisting of solvents and additives. Since the said solvent can dissolve or disperse the said polymeric compound and a polymerization initiator, if it is a solvent of the hard-coat composition of this technical field, it can use without limitation. The above-mentioned additives may further include: inorganic particles, leveling agents, stabilizers, surfactants, antistatic agents, lubricants, antifouling agents, and the like.

(圓偏光板) 本發明(第一態樣及第二態樣)之顯示裝置(較佳為軟性顯示裝置)如上所述,較佳為具備偏光板,尤佳為具備圓偏光板。圓偏光板為具有藉由將λ/4相位差板積層於直線偏光板而僅使右或左圓偏光成分透過之功能之功能層。例如用於阻斷將外界光轉換為右圓偏光並被有機EL面板反射而成為左圓偏光之外界光,僅使有機EL之發光成分透過,藉此抑制反射光之影響,而使圖像容易觀察。為了達成圓偏光功能,直線偏光板之吸收軸與λ/4相位差板之遲相軸理論上需要為45度,但實用上為45±10度。直線偏光板與λ/4相位差板未必鄰接積層,只要吸收軸與遲相軸之關係滿足上文所述之範圍即可。較佳為於全波長下達成完全圓偏光,但實用上無需一定如此,因此本發明(第一態樣及第二態樣)中之圓偏光板亦包含橢圓偏光板。亦較佳為於直線偏光板之視認側進而積層λ/4相位差膜,將出射光設為圓偏光,藉此提高佩戴偏光太陽鏡之狀態下之視認性。 (circular polarizer) As mentioned above, the display device (preferably a flexible display device) of the present invention (the first aspect and the second aspect) preferably includes a polarizing plate, and particularly preferably includes a circular polarizing plate. The circular polarizing plate is a functional layer having a function of transmitting only right or left circularly polarized light components by laminating a λ/4 retardation plate on a linear polarizing plate. For example, it is used to block the external light that converts the external light into right circularly polarized light and is reflected by the organic EL panel to become left circularly polarized light, and only transmits the light-emitting components of the organic EL, thereby suppressing the influence of reflected light and making the image easier observe. In order to achieve the circular polarization function, the absorption axis of the linear polarizer and the slow axis of the λ/4 retardation plate need to be 45 degrees in theory, but it is 45±10 degrees in practice. The linear polarizer and the λ/4 retardation film do not have to be laminated adjacent to each other, as long as the relationship between the absorption axis and the retardation axis satisfies the above-mentioned range. It is preferable to achieve complete circular polarization at all wavelengths, but this is not necessarily the case in practice. Therefore, the circular polarizers in the present invention (the first aspect and the second aspect) also include elliptical polarizers. It is also preferable to laminate a λ/4 retardation film on the viewing side of the linear polarizing plate to make the outgoing light circularly polarized, thereby improving the visibility when wearing polarized sunglasses.

直線偏光板為具有如下功能之功能層:使沿著透過軸方向振動之光通過,但阻斷與其垂直之振動分量之偏光。上述直線偏光板可為僅具備直線偏光元件或具備直線偏光元件及貼附於其至少一面之保護膜之構成。上述直線偏光板之厚度可為200 μm以下,較佳為0.5 μm以上、100 μm以下。若直線偏光板之厚度處於上述範圍,則有直線偏光板之柔軟性不易降低之傾向。The linear polarizer is a functional layer having the function of passing light vibrating along the transmission axis, but blocking polarized light of a vibration component perpendicular to it. The above-mentioned linear polarizing plate may have only a linear polarizing element or a linear polarizing element and a protective film attached to at least one side thereof. The thickness of the above-mentioned linear polarizing plate may be less than 200 μm, preferably more than 0.5 μm and less than 100 μm. When the thickness of the linear polarizing plate is within the above range, the flexibility of the linear polarizing plate tends to be less likely to decrease.

上述直線偏光元件可為藉由將聚乙烯醇(以下有時簡稱為PVA)系膜染色、延伸所製造之膜型偏光元件。碘等二色性色素吸附於藉由延伸而配向之PVA系膜、或於吸附於PVA之狀態下延伸,藉此二色性色素配向,而發揮偏光性能。於上述膜型偏光元件之製造中,除此以外亦可包括膨潤、利用硼酸進行之交聯、利用水溶液進行之洗淨、乾燥等步驟。延伸或染色步驟可僅以PVA系膜進行,亦可於與如聚對苯二甲酸乙二酯之其他膜(延伸用樹脂基材)積層之狀態下進行。所使用之PVA系膜之厚度較佳為3~100 μm,上述延伸倍率較佳為2~10倍。作為製作延伸用樹脂基材與PVA系樹脂層之積層體之方法,較佳為於延伸用樹脂基材之表面塗佈包含PVA系樹脂之塗佈液並加以乾燥之方法。The linear polarizer mentioned above may be a film-type polarizer manufactured by dyeing and stretching a polyvinyl alcohol (hereinafter sometimes abbreviated as PVA) film. A dichroic dye such as iodine is adsorbed to a PVA-based film aligned by stretching, or stretched while being adsorbed to PVA, and the dichroic dye is aligned to exhibit polarizing performance. In the manufacture of the above-mentioned film-type polarizing element, steps such as swelling, crosslinking with boric acid, washing with aqueous solution, and drying may be included in addition. The stretching or dyeing process may be performed only with the PVA-based film, or may be performed in a state of laminating with other films such as polyethylene terephthalate (resin base material for stretching). The thickness of the PVA-based film used is preferably 3-100 μm, and the above-mentioned elongation ratio is preferably 2-10 times. As a method of producing a laminate of the resin base material for stretching and the PVA-based resin layer, a method of coating a coating liquid containing a PVA-based resin on the surface of the resin base material for stretching and drying it is preferable.

尤其是若為包括於積層體之狀態下延伸PVA系樹脂層與延伸用樹脂基材之步驟及染色之步驟之製法,則即便PVA系樹脂層較薄,亦能夠藉由由延伸用樹脂基材所支持而於不存在延伸導致之斷裂等缺陷之情況下進行延伸。In particular, if it is a manufacturing method including the step of stretching the PVA-based resin layer and the stretching resin base material in the state of the laminate, and the step of dyeing, even if the PVA-based resin layer is thin, the stretching resin base material can be Supported and stretched in the absence of defects such as breakage caused by stretching.

上述偏光元件之厚度為20 μm以下,較佳為12 μm以下,更佳為9 μm以下,進而較佳為1~8 μm,尤佳為3~6 μm。若為上述範圍內,則不存在阻礙彎曲之情況,而成為較佳之態樣。The thickness of the above-mentioned polarizer is 20 μm or less, preferably 12 μm or less, more preferably 9 μm or less, further preferably 1-8 μm, especially preferably 3-6 μm. If it is in the said range, there will be no hindrance to bending, and it will be a preferable aspect.

進而,作為上述偏光元件之另一例,可例舉塗佈液晶偏光組合物所形成之液晶塗佈型偏光元件。上述液晶偏光組合物可包含液晶性化合物及二色性色素化合物。上述液晶性化合物只要具有表現出液晶狀態之性質即可,尤其是若具有層列相等高次之配向狀態,則能夠發揮出較高之偏光性能,因此較佳。又,液晶性化合物較佳為具有聚合性官能基。 上述二色性色素化合物為與上述液晶性化合物一起配向而表現出二色性之色素,可具有聚合性官能基,又,亦可為二色性色素自身具有液晶性。 液晶偏光組合物所含之化合物之任一者具有聚合性官能基。上述液晶偏光組合物可進而包含起始劑、溶劑、分散劑、調平劑、穩定劑、界面活性劑、交聯劑、矽烷偶合劑等。 上述液晶偏光層可藉由在配向膜上塗佈液晶偏光組合物形成液晶偏光層而製造。液晶偏光層可以薄於膜型偏光元件之厚度形成,其厚度較佳為0.5 μm以上10 μm以下,更佳為1 μm以上5 μm以下。 Furthermore, as another example of the above polarizing element, a liquid crystal coating type polarizing element formed by coating a liquid crystal polarizing composition may be mentioned. The above-mentioned liquid crystal polarizing composition may include a liquid crystal compound and a dichroic dye compound. The above-mentioned liquid crystal compound only needs to have the property of exhibiting a liquid crystal state. In particular, if it has a smectic high-order alignment state, it can exhibit high polarizing performance, so it is preferable. Also, the liquid crystal compound preferably has a polymerizable functional group. The above-mentioned dichroic dye compound is a dye that aligns with the above-mentioned liquid crystal compound to exhibit dichroism, and may have a polymerizable functional group, or the dichroic dye itself may have liquid crystallinity. Any one of the compounds contained in the liquid crystal polarizing composition has a polymerizable functional group. The above-mentioned liquid crystal polarizing composition may further include an initiator, a solvent, a dispersant, a leveling agent, a stabilizer, a surfactant, a crosslinking agent, a silane coupling agent, and the like. The above-mentioned liquid crystal polarizing layer can be manufactured by coating a liquid crystal polarizing composition on an alignment film to form a liquid crystal polarizing layer. The liquid crystal polarizing layer can be formed thinner than the thickness of the film-type polarizing element, and its thickness is preferably not less than 0.5 μm and not more than 10 μm, more preferably not less than 1 μm and not more than 5 μm.

上述配向膜例如可藉由在基材上塗佈配向膜形成組合物並利用摩擦、偏光照射等賦予配向性而製造。上述配向膜形成組合物包含配向劑,可進而包含溶劑、交聯劑、起始劑、分散劑、調平劑、矽烷偶合劑等。作為上述配向劑,例如可例舉:聚乙烯醇類、聚丙烯酸酯類、聚醯胺酸類、聚醯亞胺類。於使用藉由偏光照射賦予配向性之配向劑之情形時,較佳為使用包含肉桂酸酯基之配向劑。用作上述配向劑之高分子之重量平均分子量例如為10,000~1,000,000左右。上述配向膜之厚度較佳為5 nm以上10,000 nm以下,就充分表現配向限制力之方面而言,更佳為10 nm以上500 nm以下。 上述液晶偏光層可自基材剝離並轉印而積層,亦可將上述基材直接積層。亦較佳為上述基材發揮作為保護膜或相位差板、視窗膜之透明基材之作用。 The aforementioned alignment film can be produced by, for example, coating an alignment film-forming composition on a substrate and imparting alignment by rubbing, polarized light irradiation, or the like. The composition for forming an alignment film includes an alignment agent, and may further include a solvent, a crosslinking agent, an initiator, a dispersant, a leveling agent, a silane coupling agent, and the like. Examples of the alignment agent include polyvinyl alcohols, polyacrylates, polyamic acids, and polyimides. When using an alignment agent that imparts alignment by polarized light irradiation, it is preferable to use an alignment agent containing a cinnamate group. The weight average molecular weight of the polymer used as the alignment agent is, for example, about 10,000 to 1,000,000. The thickness of the above-mentioned alignment film is preferably from 5 nm to 10,000 nm, and more preferably from 10 nm to 500 nm in terms of sufficiently expressing the alignment restriction force. The above-mentioned liquid crystal polarizing layer may be peeled from the base material and transferred to be laminated, or the above-mentioned base material may be directly laminated. It is also preferable that the above-mentioned base material functions as a transparent base material for a protective film, a phase difference plate, or a window film.

作為上述保護膜,只要為透明之高分子膜即可,可使用與上述視窗膜之透明基材所使用之材料或添加劑相同者。較佳為纖維素系膜、烯烴系膜、丙烯酸系膜、聚酯系膜。又,亦可為塗佈環氧樹脂等陽離子硬化組合物或丙烯酸酯等自由基硬化組合物並硬化而獲得之塗層型之保護膜。該保護膜可視需要包含塑化劑、紫外線吸收劑、紅外線吸收劑、如顏料或染料之著色劑、螢光增白劑、分散劑、熱穩定劑、光穩定劑、抗靜電劑、抗氧化劑、潤滑劑、溶劑等。該保護膜之厚度較佳為200 μm以下,更佳為1 μm以上100 μm以下。若保護膜之厚度處於上述範圍,則有該膜之柔軟性不易降低之傾向。保護膜亦可兼具視窗膜之透明基材之作用。As the protective film, any transparent polymer film may be used, and the same materials or additives as those used for the transparent substrate of the above-mentioned window film can be used. Preferable are cellulose-based films, olefin-based films, acrylic-based films, and polyester-based films. In addition, it may be a coating type protective film obtained by applying a cation-curing composition such as epoxy resin or a radical-curing composition such as acrylate and curing it. The protective film may contain plasticizers, ultraviolet absorbers, infrared absorbers, coloring agents such as pigments or dyes, fluorescent whitening agents, dispersants, heat stabilizers, light stabilizers, antistatic agents, antioxidants, Lubricants, solvents, etc. The thickness of the protective film is preferably not more than 200 μm, more preferably not less than 1 μm and not more than 100 μm. When the thickness of a protective film exists in the said range, there exists a tendency for the flexibility of the said film to fall hard. The protective film can also serve as the transparent substrate of the window film.

上述λ/4相位差板為沿著與入射光之行進方向直行之方向(膜之面內方向)產生λ/4之相位差之膜。上述λ/4相位差板亦可為藉由將纖維素系膜、烯烴系膜、聚碳酸酯系膜等高分子膜延伸所製造之延伸型相位差板。上述λ/4相位差板可視需要包含相位差調整劑、塑化劑、紫外線吸收劑、紅外線吸收劑、如顏料或染料之著色劑、螢光增白劑、分散劑、熱穩定劑、光穩定劑、抗靜電劑、抗氧化劑、潤滑劑、溶劑等。 上述延伸型相位差板之厚度較佳為200 μm以下,更佳為1 μm以上100 μm以下。若延伸型相位差板之厚度處於上述範圍,則有該延伸型相位差板之柔軟性不易降低之傾向。 The above-mentioned λ/4 retardation plate is a film that generates a retardation of λ/4 along the direction (in-plane direction of the film) that goes straight with the traveling direction of incident light. The aforementioned λ/4 phase difference plate may also be an extended type phase difference plate manufactured by stretching polymer films such as cellulose-based films, olefin-based films, and polycarbonate-based films. The above-mentioned λ/4 phase difference plate may contain phase difference adjusting agent, plasticizer, ultraviolet absorber, infrared absorber, coloring agent such as pigment or dye, fluorescent whitening agent, dispersant, heat stabilizer, light stabilizer, etc. Agents, antistatic agents, antioxidants, lubricants, solvents, etc. The thickness of the above-mentioned extended retardation plate is preferably less than 200 μm, more preferably not less than 1 μm and not more than 100 μm. When the thickness of the stretched retardation film is within the above range, the flexibility of the stretched retardation film tends to be less likely to decrease.

進而,作為上述λ/4相位差板之另一例,可例舉塗佈液晶組合物所形成之液晶塗佈型相位差板。 上述液晶組合物包含表現出向列型、膽固醇狀、層列型等液晶狀態之液晶性化合物。上述液晶性化合物具有聚合性官能基。 上述液晶組合物可進而包含起始劑、溶劑、分散劑、調平劑、穩定劑、界面活性劑、交聯劑、矽烷偶合劑等。 上述液晶塗佈型相位差板與上述液晶偏光層同樣,可藉由將液晶組合物塗佈於底層上並硬化形成液晶相位差層而製造。液晶塗佈型相位差板可以薄於延伸型相位差板之厚度形成。上述液晶偏光層之厚度較佳為0.5 μm以上10 μm以下,更佳為1 μm以上5 μm以下。 上述液晶塗佈型相位差板可自基材剝離並轉印而積層,亦可將上述基材直接積層。亦較佳為上述基材發揮作為保護膜或相位差板、視窗膜之透明基材之作用。 Furthermore, as another example of the aforementioned λ/4 retardation plate, a liquid crystal coating type retardation plate formed by coating a liquid crystal composition may be mentioned. The above-mentioned liquid crystal composition contains liquid crystal compounds exhibiting liquid crystal states such as nematic, cholesteric, and smectic. The above-mentioned liquid crystal compound has a polymerizable functional group. The above-mentioned liquid crystal composition may further include an initiator, a solvent, a dispersant, a leveling agent, a stabilizer, a surfactant, a crosslinking agent, a silane coupling agent, and the like. The above-mentioned liquid crystal coating type retardation plate can be produced by applying a liquid crystal composition on a base layer and curing it to form a liquid crystal retardation layer similarly to the above-mentioned liquid crystal polarizing layer. The liquid crystal coating type retardation plate can be formed thinner than that of the stretched type retardation plate. The thickness of the liquid crystal polarizing layer is preferably not less than 0.5 μm and not more than 10 μm, more preferably not less than 1 μm and not more than 5 μm. The above-mentioned liquid crystal coating type phase difference plate may be peeled from the base material and transferred to be laminated, or the above-mentioned base material may be directly laminated. It is also preferable that the above-mentioned base material functions as a transparent base material for a protective film, a phase difference plate, or a window film.

通常多為波長越短雙折射越大、波長越長則表現出越小之雙折射之材料。於該情形時,由於無法於全可見光區域達成λ/4之相位差,故而面內相位差以成為較佳為100 nm以上180 nm以下、更佳為130 nm以上150 nm以下之方式設計,以便相對於視感度較高之560 nm附近成為λ/4。使用具有與通常相反之雙折射率波長分散特性之材料的逆分散λ/4相位差板於視認性變得良好之方面較佳。作為此種材料,例如延伸型相位差板可使用日本專利特開2007-232873號公報等所記載者,液晶塗佈型相位差板可使用日本專利特開2010-30979號公報等所記載者。 又,作為其他方法,亦已知有藉由與λ/2相位差板組合而獲得寬頻帶λ/4相位差板之技術(例如日本專利特開平10-90521號公報等)。λ/2相位差板亦可藉由與λ/4相位差板同樣之材料方法所製造。延伸型相位差板與液晶塗佈型相位差板之組合為任意,均可藉由使用液晶塗佈型相位差板而使厚度變薄。 為了提高傾斜方向之視認性,已知有於上述圓偏光板積層正C板之方法(例如日本專利特開2014-224837號公報等)。正C板可為液晶塗佈型相位差板,亦可為延伸型相位差板。該相位差板之厚度方向之相位差較佳為-200 nm以上-20 nm以下,更佳為-140 nm以上-40 nm以下。 Generally, the shorter the wavelength is, the larger the birefringence is, and the longer the wavelength is, the smaller the birefringence is. In this case, since the phase difference of λ/4 cannot be achieved in the entire visible light region, the in-plane phase difference is preferably designed to be not less than 100 nm and not more than 180 nm, more preferably not less than 130 nm and not more than 150 nm, so that Near 560 nm, which is relatively high in visual sensitivity, becomes λ/4. The inverse dispersion λ/4 retardation plate using a material having a birefringence wavelength dispersion characteristic opposite to that of ordinary ones is preferable in terms of good visibility. As such a material, for example, those described in Japanese Patent Laid-Open No. 2007-232873 and the like can be used, and those described in Japanese Patent Laid-Open No. 2010-30979 and the like can be used for liquid crystal coating type retardation plates. Also, as another method, a technique of obtaining a broadband λ/4 retarder by combining it with a λ/2 retarder is known (for example, Japanese Patent Application Laid-Open No. 10-90521, etc.). The λ/2 phase difference plate can also be manufactured by the same material method as the λ/4 phase difference plate. The combination of the stretched phase difference plate and the liquid crystal coating type phase difference plate is optional, and the thickness can be reduced by using the liquid crystal coating type phase difference plate. In order to improve visibility in oblique directions, there is known a method of laminating a positive C plate on the circular polarizing plate (for example, Japanese Patent Laid-Open No. 2014-224837, etc.). The positive C plate can be a liquid crystal coating type phase difference plate, or an extended type phase difference plate. The retardation in the thickness direction of the phase difference plate is preferably not less than -200 nm and not more than 20 nm, more preferably not less than -140 nm and not more than 40 nm.

(觸控感測器) 具備本發明(第一態樣及第二態樣)之積層體之顯示裝置(較佳為軟性顯示裝置)如上所述,較佳為具備觸控感測器。觸控感測器可用作輸入機構。作為觸控感測器,可例舉電阻膜方式、表面聲波方式、紅外線方式、電磁感應方式、靜電電容方式等各種樣式,較佳可例舉靜電電容方式。 靜電電容方式觸控感測器被劃分為活性區域及位於上述活性區域之外廓部之非活性區域。活性區域為與顯示面板顯示畫面之區域(顯示部)相對應之區域,為感知使用者之觸摸之區域,非活性區域為與顯示裝置不顯示畫面之區域(非顯示部)相對應之區域。觸控感測器較佳為可包括具有軟性特性之基板、形成於上述基板之活性區域之感知圖案、及用以形成於上述基板之非活性區域且經由上述感知圖案與墊部而與外部之驅動電路連接之各感測線。作為具有軟性特性之基板,可使用與上述視窗膜之透明基板同樣之材料。觸控感測器之基板中韌性為2,000 MPa%以上者就觸控感測器之龜裂抑制之方面而言較佳。更佳為韌性為2,000 MPa%以上、30,000 MPa%以下。此處,將韌性定義為藉由高分子材料之拉伸實驗所獲得之應力(MPa)-應變(%)曲線(Stress-strain curve)中至破裂點為止之曲線之下部面積。 (touch sensor) As mentioned above, the display device (preferably a flexible display device) including the laminate of the present invention (the first aspect and the second aspect) preferably includes a touch sensor. Touch sensors can be used as input mechanisms. As the touch sensor, various types such as a resistive film type, a surface acoustic wave type, an infrared type, an electromagnetic induction type, and a capacitive type are exemplified, and a capacitive type is preferably exemplified. The capacitive touch sensor is divided into an active area and an inactive area located outside the active area. The active area is the area corresponding to the display area of the display panel (display portion), and is the area that senses the user’s touch, and the inactive area is the area corresponding to the area of the display device that does not display the image (non-display portion). The touch sensor preferably can include a substrate with soft properties, a sensing pattern formed on the active area of the substrate, and a non-active area formed on the substrate and connected to the outside through the sensing pattern and the pad. The sensing lines connected to the driving circuit. As the substrate having flexible properties, the same material as the transparent substrate of the above-mentioned window film can be used. Among the substrates of the touch sensor, those having a toughness of 2,000 MPa% or more are preferable in terms of crack suppression of the touch sensor. More preferably, the toughness is not less than 2,000 MPa% and not more than 30,000 MPa%. Here, the toughness is defined as the area under the curve up to the rupture point in the stress (MPa)-strain (%) curve (Stress-strain curve) obtained by the tensile test of the polymer material.

上述感知圖案可具備沿著第1方向形成之第1圖案及沿著第2方向形成之第2圖案。第1圖案與第2圖案係沿著互不相同之方向配置。第1圖案及第2圖案形成於同一層,為了感知所觸摸之部位,必須將各圖案電性連接。第1圖案為複數個單元圖案經由套圈互相連接之形態,第2圖案為複數個單元圖案互相分離為島嶼形態之結構,因此,為了將第2圖案電性連接,需要另外之橋接電極。用於第2圖案之連接之電極可應用周知之透明電極。作為該透明電極之素材,例如可例舉:銦錫氧化物(ITO)、銦鋅氧化物(IZO)、鋅氧化物(ZnO)、銦鋅錫氧化物(IZTO)、銦鎵鋅氧化物(IGZO)、鎘錫氧化物(CTO)、PEDOT(poly(3,4-ethylenedioxythiophene),聚(3,4-乙二氧基噻吩))、奈米碳管(CNT)、石墨烯、金屬線等,較佳可例舉ITO。該等可單獨使用或混合兩種以上使用。金屬線所使用之金屬並無特別限定,例如可例舉:銀、金、鋁、銅、鐵、鎳、鈦、telenium、鉻等,該等可單獨使用或混合兩種以上使用。 橋接電極可於感知圖案上部經由絕緣層形成於上述絕緣層上部,可於基板上形成橋接電極,並於其上形成絕緣層及感知圖案。上述橋接電極亦可藉由與感知圖案相同之素材所形成,亦可由鉬、銀、鋁、銅、鈀、金、鉑、鋅、錫、鈦或該等中之兩種以上之合金所形成。 由於必須將第1圖案與第2圖案電性絕緣,故而於感知圖案與橋接電極之間形成絕緣層。該絕緣層可僅形成於第1圖案之套圈與橋接電極之間,或可形成為覆蓋感知圖案整體之層。於為覆蓋感知圖案整體之層之情形時,橋接電極可經由形成於絕緣層之接觸孔將第2圖案連接。 The sensing pattern may include a first pattern formed along the first direction and a second pattern formed along the second direction. The first pattern and the second pattern are arranged along mutually different directions. The first pattern and the second pattern are formed on the same layer, and in order to sense the touched part, the patterns must be electrically connected. The first pattern is a form in which a plurality of unit patterns are connected to each other through ferrules, and the second pattern is a structure in which a plurality of unit patterns are separated from each other in an island form. Therefore, in order to electrically connect the second patterns, additional bridge electrodes are required. As the electrodes used for the connection of the second pattern, known transparent electrodes can be used. As the material of the transparent electrode, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), indium gallium zinc oxide ( IGZO), cadmium tin oxide (CTO), PEDOT (poly(3,4-ethylenedioxythiophene), poly(3,4-ethylenedioxythiophene)), carbon nanotubes (CNT), graphene, metal wire, etc. , preferably ITO. These can be used individually or in mixture of 2 or more types. The metal used for the metal wire is not particularly limited, and examples thereof include silver, gold, aluminum, copper, iron, nickel, titanium, telenium, chromium, and the like, which may be used alone or in combination of two or more. The bridge electrode can be formed on the upper part of the sensing pattern via an insulating layer, and the bridge electrode can be formed on the substrate, and the insulating layer and the sensing pattern can be formed thereon. The above bridging electrodes can also be formed of the same material as the sensing pattern, or can be formed of molybdenum, silver, aluminum, copper, palladium, gold, platinum, zinc, tin, titanium or alloys of two or more of these. Since the first pattern and the second pattern must be electrically insulated, an insulating layer is formed between the sensing pattern and the bridging electrodes. The insulating layer may be formed only between the collar of the first pattern and the bridge electrodes, or may be formed as a layer covering the entire sensing pattern. In the case of a layer covering the entire sensing pattern, the bridge electrode can be connected to the second pattern through a contact hole formed in the insulating layer.

上述觸控感測器可進而於基板與電極之間包含光學調節層作為用以適當補償形成有感知圖案之圖案區域與未形成感知圖案之非圖案區域之間的透過率之差、具體而言為由該等區域中之折射率之差所誘發之光透過率之差之機構。該光學調節層包含無機絕緣物質或有機絕緣物質。光學調節層可將包含光硬化性有機黏合劑及溶劑之光硬化組合物塗佈於基板上而形成。上述光硬化組合物可進而包含無機粒子。藉由上述無機粒子,可提高光學調節層之折射率。 上述光硬化性有機黏合劑可於不損及本發明(第一態樣及第二態樣)之效果之範圍內例如包含丙烯酸酯系單體、苯乙烯系單體、羧酸系單體等各單體之共聚物。上述光硬化性有機黏合劑例如亦可為包含含有環氧基之重複單元、丙烯酸酯重複單元、羧酸重複單元等互不相同之各重複單元之共聚物。 作為上述無機粒子,例如可例舉:氧化鋯粒子、氧化鈦粒子、氧化鋁粒子等。 上述光硬化組合物亦可進而包含光聚合起始劑、聚合性單體、硬化輔助劑等各添加劑。 The above-mentioned touch sensor may further include an optical adjustment layer between the substrate and the electrodes to properly compensate for the difference in transmittance between the pattern area where the sensory pattern is formed and the non-pattern area where the sensory pattern is not formed, specifically It is the mechanism for the difference in light transmittance induced by the difference in refractive index in these regions. The optical adjustment layer contains an inorganic insulating substance or an organic insulating substance. The optical adjustment layer can be formed by coating a photocurable composition including a photocurable organic adhesive and a solvent on the substrate. The above photocurable composition may further contain inorganic particles. The above-mentioned inorganic particles can increase the refractive index of the optical adjustment layer. The above-mentioned photocurable organic adhesive may contain, for example, acrylate monomers, styrene monomers, carboxylic acid monomers, etc. within the range that does not impair the effects of the present invention (the first aspect and the second aspect). Copolymers of various monomers. The photocurable organic adhesive may be, for example, a copolymer including repeating units different from each other such as epoxy group-containing repeating units, acrylate repeating units, and carboxylic acid repeating units. As said inorganic particle, a zirconia particle, a titania particle, an alumina particle etc. are mentioned, for example. The above-mentioned photocurable composition may further contain various additives such as a photopolymerization initiator, a polymerizable monomer, and a curing adjuvant.

(接著層) 形成上述顯示裝置(較佳為軟性圖像顯示裝置)用積層體之各層(視窗膜、圓偏光板、觸控感測器)及構成各層之膜構件(直線偏光板、λ/4相位差板等)可藉由接著劑而接合。作為該接著劑,可使用水系接著劑、有機溶劑系、無溶劑系接著劑、固體接著劑、溶劑揮散型接著劑、濕氣硬化型接著劑、加熱固型接著劑、厭氧硬化型、活性能量線硬化型接著劑、硬化劑混合型接著劑、熱熔融型接著劑、感壓型接著劑(黏著劑)、再濕型接著劑等通常使用之接著劑等,較佳可使用水系溶劑揮散型接著劑、活性能量線硬化型接著劑、黏著劑。接著劑層之厚度可根據所要求之接著力等適當調節,較佳為0.01~500 μm,更佳為0.1~300 μm。於上述顯示裝置(較佳為軟性圖像顯示裝置)用積層體中存在複數層接著層,各層之厚度或種類可相同亦可不同。 (next layer) Each layer (window film, circular polarizing plate, touch sensor) forming the laminate for the above-mentioned display device (preferably a flexible image display device) and the film members (linear polarizing plate, λ/4 retardation plate) constituting each layer etc.) can be joined by an adhesive. As the adhesive, water-based adhesives, organic solvent-based, solvent-free adhesives, solid adhesives, solvent-evaporating adhesives, moisture-curing adhesives, heat-curing adhesives, anaerobic-curing adhesives, reactive Generally used adhesives such as energy ray-curing adhesives, hardener-mixed adhesives, hot-melt adhesives, pressure-sensitive adhesives (adhesives), remoistening adhesives, etc., preferably can be volatilized with water-based solvents type adhesive, active energy ray hardening type adhesive, adhesive. The thickness of the adhesive layer can be appropriately adjusted according to the required adhesive force, etc., preferably 0.01-500 μm, more preferably 0.1-300 μm. There are a plurality of adhesive layers in the above-mentioned laminate for a display device (preferably a flexible image display device), and the thickness or type of each layer may be the same or different.

作為上述水系溶劑揮散型接著劑,可使用聚乙烯醇系聚合物、澱粉等水溶性聚合物、乙烯-乙酸乙烯酯系乳液、苯乙烯-丁二烯系乳液等水分散狀態之聚合物作為主劑聚合物。除了上述主劑聚合物與水以外,亦可調配交聯劑、矽烷系化合物、離子性化合物、交聯觸媒、抗氧化劑、染料、顏料、無機填料、有機溶劑等。於藉由上述水系溶劑揮散型接著劑進行接著之情形時,可於將上述水系溶劑揮散型接著劑注入被接著層間而將被接著層貼合後加以乾燥,藉此賦予接著性。於使用上述水系溶劑揮散型接著劑之情形時,該接著層之厚度較佳為0.01~10 μm,更佳為0.1~1 μm。於將上述水系溶劑揮散型接著劑用於複數層之情形時,各層之厚度或種類可相同亦可不同。As the above-mentioned water-based solvent-dispersing adhesive, water-dispersed polymers such as polyvinyl alcohol-based polymers, starch and other water-soluble polymers, ethylene-vinyl acetate-based emulsions, and styrene-butadiene-based emulsions can be used as main agents. agent polymer. In addition to the above-mentioned main ingredient polymer and water, cross-linking agents, silane compounds, ionic compounds, cross-linking catalysts, antioxidants, dyes, pigments, inorganic fillers, organic solvents, etc. can also be formulated. In the case of bonding with the above-mentioned water-based solvent-evaporating adhesive, the above-mentioned water-based solvent-evaporating adhesive can be injected between the adhered layers to bond the adhered layers and then dried to impart adhesiveness. When using the above-mentioned water-based solvent-evaporating adhesive, the thickness of the adhesive layer is preferably 0.01-10 μm, more preferably 0.1-1 μm. When the above-mentioned water-based solvent-evaporating adhesive is used in multiple layers, the thickness or type of each layer may be the same or different.

上述活性能量線硬化型接著劑可藉由包含照射活性能量線而形成接著劑層之反應性材料之活性能量線硬化組合物之硬化所形成。上述活性能量線硬化組合物可含有與硬塗組合物所含者同樣之自由基聚合性化合物及陽離子聚合性化合物之至少一種聚合物。上述自由基聚合性化合物可使用與硬塗組合物中之自由基聚合性化合物相同之化合物。 上述陽離子聚合性化合物可使用與硬塗組合物中之陽離子聚合性化合物相同之化合物。 作為用於活性能量線硬化組合物之陽離子聚合性化合物,尤佳為環氧化合物。為了降低作為接著劑組合物之黏度,亦較佳為包含單官能之化合物作為反應性稀釋劑。 The above-mentioned active energy ray-curable adhesive can be formed by curing an active energy ray-curable composition containing a reactive material that forms an adhesive layer by irradiating active energy rays. The active energy ray curing composition may contain at least one polymer of the same radical polymerizable compound and cation polymerizable compound as that contained in the hard coat composition. As the radical polymerizable compound, the same compound as the radical polymerizable compound in the hard coat composition can be used. As the above-mentioned cationically polymerizable compound, the same compound as the cationically polymerizable compound in the hard coat composition can be used. Epoxy compounds are particularly preferred as the cationically polymerizable compound used in the active energy ray-curable composition. In order to reduce the viscosity of the adhesive composition, it is also preferred to include a monofunctional compound as a reactive diluent.

為了降低黏度,活性能量線組合物可包含單官能之化合物。作為該單官能之化合物,可例舉1分子中具有1個(甲基)丙烯醯基之丙烯酸酯系單體、或1分子中具有1個環氧基或氧雜環丁基之化合物、例如(甲基)丙烯酸縮水甘油酯等。 活性能量線組合物可進而包含聚合起始劑。作為該聚合起始劑,可例舉:自由基聚合起始劑、陽離子聚合起始劑、自由基及陽離子聚合起始劑等,該等可適當選擇使用。該等聚合起始劑係藉由活性能量線照射及加熱之至少一種而分解,產生自由基或陽離子而進行自由基聚合與陽離子聚合者。可使用硬塗組合物之記載中藉由活性能量線照射可開始自由基聚合或陽離子聚合內之至少任一者之起始劑。 上述活性能量線硬化組合物可進而包含離子捕捉劑、抗氧化劑、鏈轉移劑、密接賦予劑、熱塑性樹脂、填充劑、流動黏度調整劑、塑化劑、消泡劑溶劑、添加劑、溶劑。於藉由上述活性能量線硬化型接著劑將2層被接著層接著之情形時,將上述活性能量線硬化組合物塗佈於被接著層之任一者或兩者後貼合,對任一被接著層或兩被接著層照射活性能量線而使其硬化,藉此可接著。於使用上述活性能量線硬化型接著劑之情形時,該接著層之厚度較佳為0.01~20 μm,更佳為0.1~10 μm。於將上述活性能量線硬化型接著劑用於複數層接著層形成之情形時,各層之厚度或種類可相同亦可不同。 In order to reduce the viscosity, the active energy ray composition may contain a monofunctional compound. As the monofunctional compound, an acrylate-based monomer having one (meth)acryl group in one molecule, or a compound having one epoxy group or oxetanyl group in one molecule, such as Glycidyl (meth)acrylate, etc. The active energy ray composition may further contain a polymerization initiator. As this polymerization initiator, a radical polymerization initiator, a cationic polymerization initiator, a radical and a cationic polymerization initiator, etc. are mentioned, and these can be selected suitably and used. These polymerization initiators are decomposed by at least one of active energy ray irradiation and heating to generate free radicals or cations to carry out free radical polymerization and cationic polymerization. An initiator capable of starting at least any one of radical polymerization and cationic polymerization by active energy ray irradiation described in the description of the hard coat composition can be used. The above-mentioned active energy ray curing composition may further contain ion scavengers, antioxidants, chain transfer agents, adhesion imparting agents, thermoplastic resins, fillers, flow viscosity modifiers, plasticizers, defoaming agents, solvents, additives, and solvents. In the case of bonding two adhered layers with the above-mentioned active energy ray-curable adhesive, the above-mentioned active energy ray-curable composition is applied to either or both of the adhered layers and then pasted together. The adhered layer or both adhered layers can be adhered by irradiating active energy rays to harden them. When using the above-mentioned active energy ray-curable adhesive, the thickness of the adhesive layer is preferably from 0.01 to 20 μm, more preferably from 0.1 to 10 μm. When the above-mentioned active energy ray-curable adhesive is used to form a plurality of adhesive layers, the thickness or type of each layer may be the same or different.

作為上述黏著劑,亦可根據主劑聚合物使用被分類為丙烯酸系黏著劑、胺基甲酸酯系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑等之任一者。於黏著劑中,除了主劑聚合物以外,亦可調配交聯劑、矽烷系化合物、離子性化合物、交聯觸媒、抗氧化劑、黏著賦予劑、塑化劑、染料、顏料、無機填料等。將構成上述黏著劑之各成分溶解、分散於溶劑中獲得黏著劑組合物,並將該黏著劑組合物塗佈於基材上後加以乾燥,藉此形成黏著劑層接著層。黏著層可直接形成,亦可將另外形成於基材者進行轉印。為了覆蓋接著前之黏著面,亦較佳為使用脫模膜。於使用上述活性能量線硬化型接著劑之情形時,該接著層之厚度較佳為0.1~500 μm,更佳為1~300 μm。於將上述黏著劑用於複數層之情形時,各層之厚度或種類可相同亦可不同。As the adhesive, any one classified into an acrylic adhesive, a urethane adhesive, a rubber adhesive, a silicone adhesive, etc. may be used depending on the polymer of the main agent. In the adhesive, in addition to the main agent polymer, crosslinking agents, silane compounds, ionic compounds, crosslinking catalysts, antioxidants, adhesion imparting agents, plasticizers, dyes, pigments, inorganic fillers, etc. can also be formulated . The adhesive composition is obtained by dissolving and dispersing the components constituting the above adhesive in a solvent, and the adhesive composition is applied on a substrate and dried to form an adhesive layer. The adhesive layer can be formed directly, or it can be transferred to another one formed on the base material. In order to cover the adhesive surface before bonding, it is also preferable to use a release film. When using the above-mentioned active energy ray-curable adhesive, the thickness of the adhesive layer is preferably from 0.1 to 500 μm, more preferably from 1 to 300 μm. When the above-mentioned adhesive is used in multiple layers, the thickness or type of each layer may be the same or different.

(遮光圖案) 上述遮光圖案可作為上述顯示裝置(較佳為軟性圖像顯示裝置)之邊框或外殼之至少一部分而應用。藉由遮光圖案將配置於上述顯示裝置(較佳為軟性圖像顯示裝置)之邊緣部之配線隱藏而使其變得難以視認,藉此提高圖像之視認性。上述遮光圖案可為單層或多層之形態。遮光圖案之色彩並無特別限制,可為黑色、白色、金屬色等多種色彩。遮光圖案可藉由用以實現色彩之顏料與丙烯酸系樹脂、酯系樹脂、環氧系樹脂、聚胺基甲酸酯、聚矽氧等高分子所形成。亦可單獨使用該等或以兩種以上之混合物之形式使用。上述遮光圖案可藉由印刷、微影術、噴墨等各種方法所形成。遮光圖案之厚度較佳為1~100 μm,更佳為2~50 μm。又,亦較佳為沿著遮光圖案之厚度方向賦予傾斜等形狀。 (shading pattern) The above-mentioned light-shielding pattern can be used as at least a part of the frame or casing of the above-mentioned display device (preferably a flexible image display device). The light-shielding pattern hides the wiring arranged at the edge of the display device (preferably a flexible image display device) to make it difficult to see, thereby improving the visibility of the image. The above light-shielding pattern can be in the form of a single layer or a multi-layer. The color of the light-shielding pattern is not particularly limited, and it can be various colors such as black, white, and metallic. The light-shielding patterns can be formed by pigments used to realize colors and polymers such as acrylic resins, ester resins, epoxy resins, polyurethanes, and polysiloxanes. These may also be used alone or as a mixture of two or more. The above-mentioned light-shielding patterns can be formed by various methods such as printing, lithography, and inkjet. The thickness of the light-shielding pattern is preferably 1-100 μm, more preferably 2-50 μm. Moreover, it is also preferable to give shapes, such as an inclination, along the thickness direction of a light-shielding pattern.

本案主張基於2021年2月5日提出之日本專利申請案第2021-017848號、2021年6月28日提出之日本專利申請案第2021-107125號、及2022年1月7日提出之日本專利申請案第2022-001911號之優先權之利益。2021年2月5日提出之日本專利申請案第2021-017848號、2021年6月28日提出之日本專利申請案第2021-107125號、及2022年1月7日提出之日本專利申請案第2022-001911號之說明書之全部內容引用之本案用於參考。 實施例 The claims in this case are based on Japanese patent application No. 2021-017848 filed on February 5, 2021, Japanese patent application No. 2021-107125 filed on June 28, 2021, and Japanese patent application filed on January 7, 2022 Benefit of Priority of Application No. 2022-001911. Japanese Patent Application No. 2021-017848 filed on February 5, 2021, Japanese Patent Application No. 2021-107125 filed on June 28, 2021, and Japanese Patent Application No. 2022 filed on January 7, 2022 The entire contents of the specification No. 2022-001911 are cited in this case for reference. Example

(第一態樣) 以下,例舉與第一態樣相關之實施例而更具體地說明本發明(第一態樣)。當然,本發明(第一態樣)不受以下實施例所限制,可於符合上述、下述主旨之範圍內適當地施加變更而實施,該等情況均包含於本發明(第一態樣)之技術範圍中。 (first form) Hereinafter, the present invention (first aspect) will be more specifically described by way of examples related to the first aspect. Of course, the present invention (first aspect) is not limited by the following examples, and can be implemented with appropriate changes within the scope of the above and the following gist, all of which are included in the present invention (first aspect) within the technical scope.

實施例1-1 將混合作為有機矽化合物(C)而以下述式表示之日本專利特開2012-197330號公報所記載之N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷與氯丙基三甲氧基矽烷之反應物(商品名:X-12-5263HP,信越化學工業股份有限公司製造)0.25質量%、作為溶劑(E)之乙酸丁酯99.75質量%而成之溶液於室溫下加以攪拌,而獲得層(c)形成用組合物。又,準備於聚對苯二甲酸乙二酯基材(s1)積層含有銀離子作為抗菌成分(K)之硬塗層(s2)而成之基材(s)(Daicel股份有限公司製造之Daicel抗病毒硬塗膜S BV01,厚度:50 μm),使用大氣壓電漿裝置(富士機械製造股份有限公司製造)對上述基材(s)之硬塗層(s2)面進行活化處理。其後,使用MIKASA股份有限公司製造之OPTICOAT MS-A100(棒式塗佈機)、#2之棒,於0.5 ml、100 mm/sec之條件下將上述所獲得之層(c)形成用組合物塗佈於該基材(s)中之硬塗層(s2)上,於100℃乾燥30秒,而獲得形成有層(c)之積層中間物。 Example 1-1 N-2-(aminoethyl)-3-aminopropyltrimethoxysilane and chlorine A solution of 0.25% by mass of a reactant of propyltrimethoxysilane (trade name: X-12-5263HP, manufactured by Shin-Etsu Chemical Co., Ltd.) and 99.75% by mass of butyl acetate as a solvent (E) at room temperature Stirring was carried out to obtain a composition for layer (c) formation. Also, a substrate (s) (Daicel Co., Ltd. manufactured by Daicel Co., Ltd.) was prepared in which a hard coat layer (s2) containing silver ions as an antibacterial component (K) was laminated on a polyethylene terephthalate substrate (s1). Antiviral hard coat S BV01, thickness: 50 μm), using an atmospheric pressure plasma device (manufactured by Fuji Machine Manufacturing Co., Ltd.) to activate the hard coat (s2) surface of the above substrate (s). Then, using OPTICOAT MS-A100 (rod coater) manufactured by MIKASA Co., Ltd., #2 rod, the layer (c) obtained above was combined under the conditions of 0.5 ml and 100 mm/sec. coated on the hard coat layer (s2) in the base material (s), and dried at 100° C. for 30 seconds to obtain a layered intermediate with the layer (c) formed thereon.

[化24]

Figure 02_image047
[chem 24]
Figure 02_image047

繼而,將作為有機矽化合物(A)之滿足上述式(a3)之化合物(a10)、作為有機矽化合物(B)之FAS13E(C 6F 13-C 2H 4-Si(OC 2H 5) 3,東京化成工業股份有限公司製造)、及作為溶劑(D)之FC-3283(C 9F 21N,Fluorinert,3M公司製造)混合,於室溫下攪拌規定之時間,獲得撥水層形成用組合物1-1。撥水層形成用組合物1-1中之有機矽化合物(A)之比率為0.085質量%,有機矽化合物(B)之比率為0.05質量%。使用API Corporation製造之噴霧塗佈機將撥水層形成用組合物1-1塗佈於積層中間物中之層(c)上。噴塗之條件為掃描速度:600 mm/sec、間距:5 mm、液量:6 cc/min、霧化空氣:350kPa、間隙:70 mm。於100℃乾燥30秒,而形成撥水層。再者,用作有機矽化合物(A)之化合物(a10)為滿足上述化合物(a11)及(a21)之要件、並且滿足亦包括較佳之態樣在內之式(a3)之要件之化合物。藉由下文所述之「(1-7)層(c)之厚度」之測定法、及下文所述之「(1-8)撥水層(r)之厚度」之測定法所求出之積層部之厚度為5.0 nm以上15.0 nm以下之範圍內。 Then, the compound (a10) satisfying the above formula (a3) as organosilicon compound (A) and FAS13E(C 6 F 13 -C 2 H 4 -Si(OC 2 H 5 ) as organosilicon compound (B) 3 , manufactured by Tokyo Chemical Industry Co., Ltd.) and FC-3283 (C 9 F 21 N, manufactured by Fluorinert, 3M Company) as a solvent (D) were mixed, stirred at room temperature for a specified time, and a water-repellent layer was formed With composition 1-1. The ratio of the organosilicon compound (A) in the composition 1-1 for water repellent layer formation was 0.085 mass %, and the ratio of the organosilicon compound (B) was 0.05 mass %. The water-repellent layer-forming composition 1-1 was coated on the layer (c) in the laminated intermediate using a spray coater manufactured by API Corporation. The spraying conditions are scanning speed: 600 mm/sec, spacing: 5 mm, liquid volume: 6 cc/min, atomizing air: 350kPa, gap: 70 mm. Dry at 100° C. for 30 seconds to form a water-repellent layer. Furthermore, the compound (a10) used as the organosilicon compound (A) is a compound that satisfies the requirements of the above-mentioned compounds (a11) and (a21) and also satisfies the requirements of the formula (a3) including preferred aspects. Calculated by the measurement method of "(1-7) Thickness of layer (c)" described below, and the measurement method of "(1-8) Thickness of water-repellent layer (r)" described below The thickness of the layered part is within the range of not less than 5.0 nm and not more than 15.0 nm.

實施例1-2 使用於聚對苯二甲酸乙二酯基材(s1)積層含有銀離子作為抗菌成分(K)之硬塗層(s2)而成之基材(s)(Daicel股份有限公司製造之Daicel抗病毒硬塗膜S BV02,厚度:50 μm),除此以外,以與實施例1-1同樣之形式製作積層體。藉由下文所述之「(1-7)層(c)之厚度」、及下文所述之「(1-8)撥水層(r)之厚度」之測定法求出之層(c)及撥水層(r)之厚度分別為5.9 nm及4.1 nm,積層部之厚度為10.0 nm(5.9 nm+4.1 nm)。 Example 1-2 Substrate (s) in which a hard coat (s2) containing silver ions as an antibacterial component (K) is laminated on a polyethylene terephthalate substrate (s1) (Daicel Antiviral manufactured by Daicel Co., Ltd. A laminate was produced in the same manner as in Example 1-1 except that the hard coat film S BV02, thickness: 50 μm). Layer (c) obtained by measuring "(1-7) Thickness of layer (c)" described below, and "(1-8) Thickness of water-repellent layer (r)" described below The thicknesses of the water-repellent layer (r) and the water-repellent layer (r) are 5.9 nm and 4.1 nm, respectively, and the thickness of the laminated part is 10.0 nm (5.9 nm+4.1 nm).

實施例1-3 使用於Toray股份有限公司製造之聚對苯二甲酸乙二酯製基材U483(s1)(厚度50 μm)具備含有四級銨鹽之丙烯酸系硬塗層(s2)(厚度5 μm)之基材(s),除此以外,以與實施例1-1同樣之形式製作積層體。藉由下文所述之「(1-7)層(c)之厚度」、及下文所述之「(1-8)撥水層(r)之厚度」之測定法求出之層(c)及撥水層(r)之厚度分別為9.1 nm及4.5 nm,積層部之厚度為13.6 nm(9.1 nm+4.5 nm)。 Example 1-3 Substrate made of polyethylene terephthalate U483 (s1) (thickness 50 μm) manufactured by Toray Co., Ltd. with an acrylic hard coat (s2) (thickness 5 μm) containing quaternary ammonium salt Except for the material (s), a laminate was produced in the same manner as in Example 1-1. Layer (c) obtained by measuring "(1-7) Thickness of layer (c)" described below, and "(1-8) Thickness of water-repellent layer (r)" described below and water-repellent layer (r) are 9.1 nm and 4.5 nm thick respectively, and the thickness of the laminated part is 13.6 nm (9.1 nm+4.5 nm).

實施例1-4 使用Daicel抗病毒硬塗膜S BV02,除此以外,藉由與實施例1-1同樣之方法形成層(c)。其後,藉由將積層中間物之端彎折而於內側形成凹部,於其中流入4 ml之與實施例1-1同樣之撥水層形成用組合物1-1。進而於100℃乾燥15分鐘,藉此形成撥水層(r)。藉由下文所述之「(1-9)積層部之厚度」所記載之方法測定積層部之厚度,結果為40.0 nm。 Example 1-4 The layer (c) was formed by the same method as Example 1-1 except having used Daicel antiviral hard coat S BV02. Thereafter, a recess was formed inside by bending the end of the laminated intermediate, and 4 ml of the composition 1-1 for forming a water-repellent layer similar to Example 1-1 was poured into it. Furthermore, it dried at 100 degreeC for 15 minutes, and the water-repellent layer (r) was formed by this. The thickness of the laminated part was measured by the method described in "(1-9) Thickness of the laminated part" described below, and it was 40.0 nm.

實施例1-5 使用作為有機矽化合物(C)之KBM-603(信越化學工業股份有限公司製造,N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷)0.25質量%,除此以外,以與實施例1-1同樣之形式製作積層體。藉由下文所述之「(1-7)層(c)之厚度」、及下文所述之「(1-8)撥水層(r)之厚度」之測定法求出之層(c)及撥水層(r)之厚度分別為12 nm及4.5 nm,積層部之厚度為16.5 nm(12 nm+4.5 nm)。 Example 1-5 Other than 0.25% by mass of KBM-603 (manufactured by Shin-Etsu Chemical Co., Ltd., N-2-(aminoethyl)-3-aminopropyltrimethoxysilane) as organosilicon compound (C) , A laminate was produced in the same manner as in Example 1-1. Layer (c) obtained by measuring "(1-7) Thickness of layer (c)" described below, and "(1-8) Thickness of water-repellent layer (r)" described below and water-repellent layer (r) are 12 nm and 4.5 nm thick respectively, and the thickness of the laminated part is 16.5 nm (12 nm + 4.5 nm).

實施例1-6 準備於聚對苯二甲酸乙二酯基材(s1)積層含有銀離子作為抗菌成分(K)之硬塗層(s2)而成之基材(s)(Daicel股份有限公司製造之Daicel抗病毒硬塗膜S BV02,厚度:50 μm),使用大氣壓電漿裝置(富士機械製造股份有限公司製造)對上述基材(s)之硬塗層(s2)面進行活化處理。 繼而,將作為有機矽化合物(A)之化合物(a10)、作為有機矽化合物(C)之N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷與氯丙基三甲氧基矽烷之反應物(商品名:X-12-5263HP,信越化學工業股份有限公司製造)、作為溶劑(D1)之Novec(註冊商標)7300、作為溶劑(D2)之乙酸丁酯、及作為溶劑(D2)之異丙醇混合,於室溫下攪拌規定之時間,獲得撥水層形成用組合物1-2。撥水層形成用組合物1-2中之有機矽化合物(A)之比率為0.0701質量%,有機矽化合物(C)之比率為0.0842質量%,溶劑(D1)之比率為79.93質量%,乙酸丁酯之比率為3.982質量%,異丙醇之比率為15.93質量%。其後,使用MIKASA股份有限公司製造之OPTICOAT MS-A100(棒式塗佈機)、#9之棒,於0.5 ml、100 mm/sec之條件下將撥水層形成用組合物1-2塗佈於上述基材(s)中之硬塗層(s2)上,於100℃乾燥30秒,獲得形成有層(r)之積層體。藉由下文所述之「(1-9)積層部之厚度」所記載之方法測定積層部之厚度,結果為15.0 nm。 Examples 1-6 A substrate (s) prepared by laminating a hard coat layer (s2) containing silver ions as an antibacterial component (K) on a polyethylene terephthalate substrate (s1) (Daicel Antivirus manufactured by Daicel Co., Ltd. The hard coat film S BV02, thickness: 50 μm), was activated on the hard coat (s2) surface of the substrate (s) using an atmospheric pressure plasma device (manufactured by Fuji Machine Manufacturing Co., Ltd.). Then, compound (a10) as organosilicon compound (A), N-2-(aminoethyl)-3-aminopropyltrimethoxysilane as organosilicon compound (C) and chloropropyl trimethyl A reactant of oxysilane (trade name: X-12-5263HP, manufactured by Shin-Etsu Chemical Co., Ltd.), Novec (registered trademark) 7300 as a solvent (D1), butyl acetate as a solvent (D2), and Solvent (D2) and isopropanol were mixed, and stirred at room temperature for a predetermined time to obtain composition 1-2 for forming a water-repellent layer. The ratio of the organosilicon compound (A) in the composition 1-2 for forming a water-repellent layer is 0.0701% by mass, the ratio of the organosilicon compound (C) is 0.0842% by mass, the ratio of the solvent (D1) is 79.93% by mass, acetic acid The ratio of butyl ester was 3.982% by mass, and the ratio of isopropanol was 15.93% by mass. Thereafter, using OPTICOAT MS-A100 (rod coater) manufactured by MIKASA Co., Ltd., a #9 rod, the composition 1-2 for forming a water-repellent layer was coated under the conditions of 0.5 ml and 100 mm/sec. Spread on the hard coat layer (s2) in the above-mentioned substrate (s), and dry at 100°C for 30 seconds to obtain a laminate with the layer (r) formed. The thickness of the laminated part was measured by the method described in "(1-9) Thickness of the laminated part" described below, and it was 15.0 nm.

比較例1-1 使用Daicel抗病毒硬塗膜S BV02,除此以外,藉由與實施例1-1同樣之方法形成層(c)。其後,吹送含有氟樹脂之撥水噴霧(AS ONE公司製造,商品號:62-3807-13),於室溫下放置一晚,藉此形成撥水層(r)。藉由下文所述之「(1-9)積層部之厚度」所記載之方法測定積層部之厚度,結果為110 nm。 Comparative example 1-1 The layer (c) was formed by the same method as Example 1-1 except having used Daicel antiviral hard coat S BV02. Thereafter, a water-repellent spray containing fluororesin (manufactured by AS ONE, product number: 62-3807-13) was sprayed, and left overnight at room temperature to form a water-repellent layer (r). The thickness of the laminated part was measured by the method described in "(1-9) Thickness of the laminated part" described below, and it was 110 nm.

參考例1-1 準備於聚對苯二甲酸乙二酯基材(s1)積層含有銀離子作為抗菌成分(K)之硬塗層(s2)而成之基材(s)(Daicel股份有限公司製造之Daicel抗病毒硬塗膜S BV02,厚度:50 μm),使用大氣壓電漿裝置(富士機械製造股份有限公司製造)對上述基材(s)之硬塗層(s2)面進行活化處理。 繼而,將作為有機矽化合物(A)之化合物(a10)、及作為有機矽化合物(B)之FAS13E混合,於室溫下攪拌規定之時間,而獲得撥水層形成用組合物1-3。撥水層形成用組合物1-3中之有機矽化合物(A)之比率為0.085質量%,有機矽化合物(B)之比率為0.05質量%。其後,使用API Corporation製造之噴霧塗佈機,於與實施例1-1同樣之條件下將撥水層形成用組合物1-3塗佈於上述基材(s)中之硬塗層(s2)上。藉由下文所述之「(1-9)積層部之厚度」所記載之方法測定積層部之厚度,結果為4.2 nm。 Reference example 1-1 A substrate (s) prepared by laminating a hard coat layer (s2) containing silver ions as an antibacterial component (K) on a polyethylene terephthalate substrate (s1) (Daicel Antivirus manufactured by Daicel Co., Ltd. The hard coat film S BV02, thickness: 50 μm), was activated on the hard coat (s2) surface of the substrate (s) using an atmospheric pressure plasma device (manufactured by Fuji Machine Manufacturing Co., Ltd.). Next, compound (a10) which is organosilicon compound (A) and FAS13E which is organosilicon compound (B) were mixed, and stirred at room temperature for predetermined time, and the composition 1-3 for water-repellent layer formation was obtained. The ratio of the organosilicon compound (A) in the composition 1-3 for water-repellent layer formation was 0.085 mass %, and the ratio of the organosilicon compound (B) was 0.05 mass %. Thereafter, using a spray coater manufactured by API Corporation, under the same conditions as in Example 1-1, the composition 1-3 for forming a water-repellent layer was applied to the hard coat layer in the above-mentioned substrate (s) ( s2) on. The thickness of the laminated part was measured by the method described in "(1-9) Thickness of the laminated part" described below, and it was 4.2 nm.

按照以下之要領評價實施例、比較例、及參考例中所獲得之積層體。The laminates obtained in Examples, Comparative Examples, and Reference Examples were evaluated in the following manner.

(1-1)初始接觸角 於所獲得之積層體之撥水層側表面滴加3 μL之水滴,使用接觸角測定裝置(協和界面科學公司製造,DM700),藉由液滴法(解析方法:θ/2法)測定水之接觸角。將結果示於表1。 (1-1) Initial contact angle 3 μL of water droplets were dropped on the surface of the water-repellent layer side of the obtained laminate, and water was measured by the droplet method (analysis method: θ/2 method) using a contact angle measurement device (manufactured by Kyowa Interface Science Co., Ltd., DM700). the contact angle. The results are shown in Table 1.

(1-2)耐磨耗性試驗 使用具備minoan製橡皮擦之刮擦裝置,以橡皮擦與積層體相接之狀態(接觸面:直徑6 mm之圓)對所獲得之積層體之撥水層側表面施加荷重1000 g,以40 r/min之速度(一分鐘往復40次之速度)、行程40 mm使橡皮擦於積層體上往復,進行耐磨耗試驗。分別測定橡皮擦於積層體往復1500次、及3000次後之水之接觸角。將結果示於表1。 (1-2) Wear resistance test Using a scraping device equipped with a minoan eraser, apply a load of 1000 g to the water-repellent layer side surface of the obtained laminate with the eraser in contact with the laminate (contact surface: a circle with a diameter of 6 mm), and then apply a load of 40 The speed of r/min (the speed of reciprocating 40 times per minute), the stroke of 40 mm makes the eraser reciprocate on the laminated body, and the abrasion resistance test is carried out. The contact angles of water after the eraser reciprocated 1500 times and 3000 times on the laminate were respectively measured. The results are shown in Table 1.

(1-3)動摩擦係數 使用新東科學股份有限公司製造之Tribogear(表面性測定機 TYPE:38)之一定荷重測定,並使用人工皮革,測定條件設為下述條件,測定撥水層(r)側表面之動摩擦係數。將結果示於表1。 荷重轉換機:1.961 mV/V 荷重:200 g 移動距離:50 mm 移動速度:100 mm/min 採樣個數:3010 (1-3) Dynamic friction coefficient The dynamic friction coefficient of the water-repellent layer (r) side surface was measured using Tribogear (surface property measuring machine TYPE: 38) manufactured by Shinto Scientific Co., Ltd. under a constant load, using artificial leather, and the measurement conditions were set to the following conditions. The results are shown in Table 1. Load converter: 1.961 mV/V Load: 200 g Moving distance: 50mm Moving speed: 100mm/min Number of samples: 3010

(1-4)標記油墨去除 作為標記油墨去除之評價方法,使用標記油墨(Sakura製造之筆觸油性中字)於皮膜上繪製3處圓形,其後,利用拭布之Savina(註冊商標)進行擦拭。於3處標記油墨痕均被擦拭之情形時設為◎,於2處被擦拭之情形時設為○,於存在未被擦拭之處之情形時設為×。將結果示於表1。 (1-4) Marking ink removal As an evaluation method for marking ink removal, three circles were drawn on the film using a marking ink (brush stroke oily Chinese characters manufactured by Sakura), and then wiped with a Savina (registered trademark) cloth. When all three marking ink traces were wiped off, it was rated as ◎, when two spots were wiped off, it was rated as ○, and when there was a spot that was not wiped off, it was rated as ×. The results are shown in Table 1.

(1-5)耐擦傷性 使用具備鋼絲絨#0000(Bonstar公司製造)之鋼絲絨試驗機(大榮精機公司製造),於鋼絲絨與積層體之表面(撥水層(r))相接之狀態下,施加250 g/cm 2之壓力進行磨耗試驗,重複進行試驗直至目視確認到剝離、損傷為止,利用確認剝離、損傷時之試驗次數對耐擦傷性進行評價。試驗次數設為1次1個往復。再者,剝離、損傷之有無之確認係於LED照明下進行。將結果示於表1。 (1-5) Scratch resistance Use a steel wool testing machine (manufactured by Daiei Seiki Co., Ltd.) equipped with steel wool #0000 (manufactured by Bonstar Co., Ltd.), and connect the steel wool to the surface of the laminate (water-repellent layer (r)) In this state, a wear test was carried out by applying a pressure of 250 g/cm 2 , and the test was repeated until peeling and damage were visually confirmed, and the scratch resistance was evaluated by the number of tests when peeling and damage were confirmed. The number of tests was set to 1 reciprocation. In addition, the presence or absence of peeling and damage was confirmed under LED lighting. The results are shown in Table 1.

(1-6)霧度 依照JIS Z 8722,使用Konica Minolta製造之測色計(CM-3700A,光源:D65),使積層體之撥水層(r)側表面朝向光源側,對霧度進行測定,將所得之結果示於表1。 (1-6) Haze According to JIS Z 8722, using a colorimeter (CM-3700A, light source: D65) manufactured by Konica Minolta, the surface of the water-repellent layer (r) side of the laminate is facing the light source side, and the haze is measured. The obtained results are shown in Table 1.

(1-7)層(c)之厚度 對於塗佈層(c)形成用組合物並乾燥之積層中間物,利用簽字筆於上表面塗黑,利用FIB-SEM(Focused Ion Beam Scanning Electron Microscopy,聚焦離子束掃描電子顯微鏡)製作超薄切片,自截面方向利用掃描透過電子顯微鏡(STEM)進行觀察,藉此測定層(c)之厚度。 <FIB加工條件> 裝置名:HeliosG4UX(日本FEI公司製造) 離子源:Ga 加速電壓:30 kV 試樣厚度:100 nm以下 <STEM測定條件> 裝置名:HeliosG4UX(日本FEI公司製造) 加速電壓:23 kV 電流值:50 pA 倍率:100萬倍 (1-7) Thickness of layer (c) For the laminated intermediate product obtained by drying the coating layer (c) composition, the upper surface is blackened with a marker pen, and ultrathin sections are made by FIB-SEM (Focused Ion Beam Scanning Electron Microscopy) , observed from the cross-sectional direction with a scanning transmission electron microscope (STEM), thereby measuring the thickness of the layer (c). <FIB Processing Conditions> Device name: HeliosG4UX (manufactured by Japan FEI Corporation) Ion source: Ga Acceleration voltage: 30 kV Sample thickness: below 100 nm <STEM measurement conditions> Device name: HeliosG4UX (manufactured by Japan FEI Corporation) Acceleration voltage: 23 kV Current value: 50pA Magnification: 1 million times

(1-8)撥水層(r)之厚度 撥水層(r)之膜厚係依照下述記載,使用X射線光電子光譜法(XPS)進行測定。首先,藉由與實施例1-1同樣之方法於經大氣壓電漿處理之玻璃基板上製作層(c)、撥水層(r)。此時,將塗佈量改變4處而塗佈撥水層形成用組合物1-1,製作合計4種層(c)之厚度相同、撥水層(r)之膜厚不同之積層體。 繼而,使用橢圓偏光儀測定各撥水層(r)之膜厚。又,對於同一層,使用XPS法測定F元素之量、及與F元素鍵結以外之C元素之量,算出其比(F/C(C-F以外)),製作相對於撥水層(r)之膜厚之校準曲線。於該情形時,F元素之量來自撥水層(r),與F元素鍵結之C元素以外之C元素之量來自層(c)。 繼而,對實施例1-2~1-4中所製作之積層體實施XPS測定,依照上述所製作之校準曲線算出撥水層(r)之膜厚。 <XPS測定條件> 裝置名:Thermofisher Scientific製造之K-alpha X射線源:單色Al Kα 功率:72 W(12 kV,6 mA) 光點大小:400 μm 通過能量:50 eV 留置時間(Dwell time):50 ms 模式(元素):窄(F,C) 中和槍:on 又,藉由同樣之方法製作實施例1-5中之校準曲線,對實施例1-5中所獲得之積層體實施XPS測定,依照上述所製作之校準曲線,算出撥水層(r)之膜厚。 (1-8) Thickness of water-repellent layer (r) The film thickness of the water-repellent layer (r) was measured using X-ray photoelectron spectroscopy (XPS) according to the following description. First, a layer (c) and a water-repellent layer (r) were fabricated on a glass substrate treated with atmospheric pressure plasma by the same method as in Example 1-1. At this time, the composition 1-1 for forming a water-repellent layer was applied while changing the coating amount in 4 places, and a total of 4 kinds of layers (c) had the same thickness and different thicknesses of the water-repellent layer (r) were produced. Then, the film thickness of each water-repellent layer (r) was measured using an ellipsometer. Also, for the same layer, use the XPS method to measure the amount of element F and the amount of element C other than elements bonded to F, calculate the ratio (F/C (other than C-F)), and make a water-repellent layer (r) The calibration curve of the film thickness. In this case, the amount of the F element comes from the water-repellent layer (r), and the amount of the C elements other than the C element bonded to the F element comes from the layer (c). Next, XPS measurement was performed on the laminates prepared in Examples 1-2 to 1-4, and the film thickness of the water-repellent layer (r) was calculated according to the calibration curve prepared above. <XPS measurement conditions> Device name: K-alpha manufactured by Thermofisher Scientific X-ray source: monochromatic Al Kα Power: 72W (12kV, 6mA) Spot size: 400 μm Pass energy: 50 eV Dwell time: 50 ms mode (element): narrow (F, C) Neutralizing gun: on Also, the calibration curve in Examples 1-5 was prepared by the same method, the laminate obtained in Examples 1-5 was subjected to XPS measurement, and the water-repellent layer (r) was calculated according to the calibration curve prepared above. Film thickness.

(1-9)積層部之厚度 於基材上之一部分貼附膠帶進行遮蔽後,進行層(c)及撥水層(r)、或僅撥水層(r)之形成,將膠帶剝離,藉此形成與積層部之膜厚相當之階差。其後,使用探針式薄膜輪廓儀測定積層部之膜厚。 裝置名:DektakXT(Bruker公司製造) 範圍:6.5 μm 探針類型(stylus type):Radius 2 μm 探針壓力(stylus force):3 mg 速度:100 μm/s (1-9) Thickness of laminated part After sticking a tape on a part of the substrate for masking, form the layer (c) and the water-repellent layer (r), or only the water-repellent layer (r), and peel off the tape to form the film thickness of the laminated part quite a step difference. Thereafter, the film thickness of the laminated part was measured using a stylus thin film profiler. Device name: DektakXT (manufactured by Bruker Corporation) Range: 6.5 μm Probe type (stylus type): Radius 2 μm Probe pressure (stylus force): 3 mg Speed: 100 μm/s

(1-10)抗菌活性值1 實施例1-1及實施例1-3之積層體中之抗菌性試驗係於一般財團法人BOKEN品質評價機構(BOKEN QUALITY EVALUATION INSTITUTE)中進行試驗。試驗方法係基於JIS Z 2801:2010(膜密接法)進行。試驗菌株設為金黃色葡萄球菌及大腸桿菌,將菌液接種量設為0.4 mL(被覆膜之表面積:16 cm 2)。又,作為標準樣品,使用聚對苯二甲酸乙二酯基材(東洋紡股份有限公司製造之「COSMOSHINE(註冊商標)A4360」,厚度:50 μm)。於實施例1-1中,對於標準樣品,金黃色葡萄球菌之抗菌活性值為2.7,又,對於標準樣品,大腸桿菌之抗菌活性值為5.0,具有良好之抗菌性。又,於實施例1-3中,金黃色葡萄球菌之抗菌活性值為3.2,具有良好之抗菌活性值。 (1-10) Antibacterial activity value 1 The antibacterial test of the laminates of Examples 1-1 and Examples 1-3 was conducted at BOKEN Quality Evaluation Institute (BOKEN QUALITY EVALUATION INSTITUTE). The test method was based on JIS Z 2801:2010 (film adhesion method). The test strains were Staphylococcus aureus and Escherichia coli, and the inoculated amount of the bacterial solution was set to 0.4 mL (the surface area of the coating film: 16 cm 2 ). Also, as a standard sample, a polyethylene terephthalate substrate ("COSMOSHINE (registered trademark) A4360" manufactured by Toyobo Co., Ltd., thickness: 50 μm) was used. In Example 1-1, for the standard sample, the antibacterial activity value of Staphylococcus aureus was 2.7, and for the standard sample, the antibacterial activity value of Escherichia coli was 5.0, showing good antibacterial properties. Also, in Examples 1-3, the antibacterial activity value of Staphylococcus aureus was 3.2, which has a good antibacterial activity value.

(1-11)抗菌活性值2 實施例1-2、1-4、1-5、1-6、比較例1-1、參考例1-1之積層體中之抗菌性試驗係除了變更菌以外,藉由與JIS Z 2801:2010(膜密接法)同樣之方法進行,試驗菌株設為表皮葡萄球菌,將菌液接種量設為0.4 mL(被覆膜之表面積:16 cm 2)。又,作為標準樣品,使用聚對苯二甲酸乙二酯基材(東洋紡股份有限公司製造之「COSMOSHINE(註冊商標)A4360」,厚度:50 μm)。於實施例1-2中,於僅基材(s)(即僅Daicel抗病毒硬塗膜S BV02)之情形時,對於標準樣品,抗菌活性值為2.2,與此相對,實施例1-2之積層體之抗菌活性值為2.5,即便於積層層(c)及撥水層(r)之情形時,亦具有同等或其以上之抗菌性。 於實施例1-4中,積層體之抗菌活性值為2.3。 於實施例1-5中,積層體之抗菌活性值為2.7。 於實施例1-6中,積層體之抗菌活性值為3.1。 於參考例1-1中,積層體之抗菌活性值為3.3。 於比較例1-1中,積層體之抗菌活性值為0.8,因積層撥水層(r)導致基材(s)所具有之抗菌活性值受到抑制。 (1-11) Antibacterial activity value 2 The antibacterial activity test in the laminates of Examples 1-2, 1-4, 1-5, 1-6, Comparative Example 1-1, and Reference Example 1-1 was except for the change bacteria Otherwise, it was carried out by the same method as JIS Z 2801:2010 (membrane adhesion method), the test strain was Staphylococcus epidermidis, and the inoculum amount was 0.4 mL (surface area of the coating film: 16 cm 2 ). Also, as a standard sample, a polyethylene terephthalate substrate ("COSMOSHINE (registered trademark) A4360" manufactured by Toyobo Co., Ltd., thickness: 50 μm) was used. In embodiment 1-2, when only base material (s) (that is only Daicel antiviral hard coat S BV02) situation, for standard sample, antibacterial activity value is 2.2, contrast with this, embodiment 1-2 The antibacterial activity value of the laminate is 2.5, and even in the case of the laminate layer (c) and the water-repellent layer (r), it has the same or higher antibacterial activity. In Examples 1-4, the antibacterial activity value of the laminate was 2.3. In Examples 1-5, the antibacterial activity value of the laminate was 2.7. In Examples 1-6, the antibacterial activity value of the laminate was 3.1. In Reference Example 1-1, the antibacterial activity value of the laminate was 3.3. In Comparative Example 1-1, the antibacterial activity value of the laminate was 0.8, and the antibacterial activity value of the substrate (s) was suppressed due to the laminated water-repellent layer (r).

[表1]    實施例 比較例 參考例 1-1 1-2 1-3 1-4 1-5 1-6 1-1 1-1 初始接觸角 o 118.0 113.1 115.3 114.0 116.4 114.1 111.2 115.6 耐磨耗性 1500次後接觸角 o 113.4 109.6 115.4 103.6 112.7 114.3 69.5 44.3 3000次後接觸角 o 111.8 105.5 114.3 108.5 110.3 114.5 70.8 43.8 動摩擦係數    0.076 0.032 0.04 0.083 0.032 0.048 0.328 0.075 標記油墨去除    × × 耐擦傷性 500 3000 3000 3000 1500 1500 500 100 霧度    1.30 2.28 0.80 3.81 2.45 2.55 5.87 2.50 [Table 1] Example comparative example Reference example 1-1 1-2 1-3 1-4 1-5 1-6 1-1 1-1 initial contact angle o 118.0 113.1 115.3 114.0 116.4 114.1 111.2 115.6 wear resistance Contact angle after 1500 times o 113.4 109.6 115.4 103.6 112.7 114.3 69.5 44.3 Contact angle after 3000 times o 111.8 105.5 114.3 108.5 110.3 114.5 70.8 43.8 dynamic friction coefficient 0.076 0.032 0.04 0.083 0.032 0.048 0.328 0.075 Marking Ink Removal x x Scratch resistance Second-rate 500 3000 3000 3000 1500 1500 500 100 Haze 1.30 2.28 0.80 3.81 2.45 2.55 5.87 2.50

根據上述結果可知,本發明(第一態樣)之積層體能夠兼顧良好之撥水性及抗菌性。又,根據實施例1-1~1-6與參考例1-1之比較可知,藉由本發明(第一態樣)之積層體包含有機矽化合物(C),耐磨耗性、撥油性、及耐擦傷性提高。From the above results, it can be seen that the laminate of the present invention (first aspect) can achieve both good water repellency and antibacterial properties. Also, from the comparison of Examples 1-1 to 1-6 and Reference Example 1-1, it can be seen that the wear resistance, oil repellency, and improved scratch resistance.

(第二態樣) 以下,例舉與第二態樣相關之實施例而更具體地說明本發明(第二態樣)。當然,本發明(第二態樣)不受以下實施例所限制,可於符合上述、下述主旨之範圍內適當地施加變更而實施,該等情況均包含於本發明(第二態樣)之技術範圍中。 (second form) Hereinafter, the present invention (second aspect) will be more specifically described by way of examples related to the second aspect. Of course, the present invention (second aspect) is not limited by the following examples, and can be implemented with appropriate changes within the scope of the above and the following gist, all of which are included in the present invention (second aspect) within the technical scope.

實施例2-1 將混合作為有機矽化合物(C)而以下述式表示之日本專利特開2012-197330號公報所記載之N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷與氯丙基三甲氧基矽烷之反應物(商品名:X-12-5263HP,信越化學工業股份有限公司製造)0.05質量%、作為溶劑(E)之異丙醇99.95質量%而成之溶液於室溫下加以攪拌,而獲得層(c)形成用組合物。又,準備於聚對苯二甲酸乙二酯基材(s1)積層含有四級銨鹽作為抗靜電劑(AS)之硬塗層(s2)而成之基材(s)(硬塗層之厚度:5 μm,基材(s)之厚度:50 μm),使用大氣壓電漿裝置(富士機械製造股份有限公司製造)對上述基材(s)之硬塗層(s2)面進行活化處理。其後,使用MIKASA股份有限公司製造之OPTICOAT MS-A100(棒式塗佈機)、#2之棒,於0.5 ml、100 mm/sec之條件下將上述所獲得之層(c)形成用組合物塗佈於該基材(s)中之硬塗層(s2)上,於100℃乾燥30秒,而獲得形成有層(c)之積層中間物。 Example 2-1 N-2-(aminoethyl)-3-aminopropyltrimethoxysilane and chlorine A solution of 0.05% by mass of a reactant of propyltrimethoxysilane (trade name: X-12-5263HP, manufactured by Shin-Etsu Chemical Co., Ltd.) and 99.95% by mass of isopropanol as a solvent (E) at room temperature Stirring was carried out to obtain a composition for layer (c) formation. Also, prepare the base material (s) formed by laminating the hard coat layer (s2) containing the quaternary ammonium salt as the antistatic agent (AS) on the polyethylene terephthalate base material (s1) (hard coat layer Thickness: 5 μm, thickness of the substrate (s): 50 μm), the hard coat (s2) surface of the above substrate (s) was activated using an atmospheric pressure plasma device (manufactured by Fuji Machine Manufacturing Co., Ltd.). Then, using OPTICOAT MS-A100 (rod coater) manufactured by MIKASA Co., Ltd., #2 rod, the layer (c) obtained above was combined under the conditions of 0.5 ml and 100 mm/sec. coated on the hard coat layer (s2) in the base material (s), and dried at 100° C. for 30 seconds to obtain a layered intermediate with the layer (c) formed thereon.

[化25]

Figure 02_image049
[chem 25]
Figure 02_image049

繼而,將作為有機矽化合物(A)之滿足上述式(a1)之化合物(a10)、作為有機矽化合物(B)之FAS13E(C 6F 13-C 2H 4-Si(OC 2H 5) 3,東京化成工業股份有限公司製造)、作為溶劑(D)之FC-3283(C 9F 21N,Fluorinert,3M公司製造)混合,於室溫下攪拌規定之時間,獲得撥水層形成用組合物。撥水層形成用組合物中之有機矽化合物(A)之比率為0.085質量%,有機矽化合物(B)之比率為0.05質量%。使用MIKASA股份有限公司製造之OPTICOAT MS-A100(棒式塗佈機)、#2之棒,於0.5 ml、100 mm/sec之條件下將撥水層形成用組合物塗佈於積層中間物中之層(c)上,於100℃乾燥30秒,獲得形成有層(r)之積層體。再者,用作有機矽化合物(A)之化合物(a10)為滿足上述化合物(a11)及(a21)之要件、並且滿足亦包括較佳之態樣在內之式(a3)之要件之化合物。藉由下文所述之「(2-4)層(c)之厚度」之測定法、及下文所述之「(2-3)層(r)之厚度」之測定法所求出之各厚度為6.6 nm、4.3 nm,該等之合計厚度為10.9 nm。 Then, the compound (a10) satisfying the above formula (a1) as organosilicon compound (A) and FAS13E(C 6 F 13 -C 2 H 4 -Si(OC 2 H 5 ) as organosilicon compound (B) 3 , manufactured by Tokyo Chemical Industry Co., Ltd.), FC-3283 (C 9 F 21 N, manufactured by Fluorinert, 3M Company) as a solvent (D) were mixed, and stirred at room temperature for a specified time to obtain a water-repellent layer. combination. The ratio of the organosilicon compound (A) in the composition for water-repellent layer formation was 0.085 mass %, and the ratio of the organosilicon compound (B) was 0.05 mass %. Using OPTICOAT MS-A100 (rod coater) manufactured by MIKASA Co., Ltd., #2 rod, apply the water-repellent layer-forming composition to the laminated intermediate under the conditions of 0.5 ml and 100 mm/sec The layer (c) was dried at 100° C. for 30 seconds to obtain a laminate with the layer (r) formed thereon. Furthermore, the compound (a10) used as the organosilicon compound (A) is a compound that satisfies the requirements of the above-mentioned compounds (a11) and (a21) and also satisfies the requirements of the formula (a3) including preferred aspects. Each thickness obtained by the measurement method of "(2-4) Thickness of layer (c)" described below, and the measurement method of "(2-3) Thickness of layer (r)" described below 6.6 nm and 4.3 nm, and their total thickness is 10.9 nm.

實施例2-2 將層(C)形成方法之棒設為#18,除此以外,藉由與實施例2-1同樣之方式製作積層體。藉由下文所述之「(2-4)層(c)之厚度」、及下文所述之「(2-3)層(r)之厚度」之測定法所求出之層(c)及層(r)之厚度分別為18.1 nm及3.7 nm,該等之合計之厚度為21.8 nm(18.1 nm+3.7 nm)。 Example 2-2 A laminate was produced in the same manner as in Example 2-1 except that the bar of the layer (C) forming method was set to #18. The layer (c) and The thicknesses of layer (r) are 18.1 nm and 3.7 nm respectively, and their total thickness is 21.8 nm (18.1 nm+3.7 nm).

實施例2-3 將層(C)之有機矽化合物設為KBM603(N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷),除此以外,藉由與實施例2-1同樣之方式製作積層體。藉由下文所述之「(2-4)層(c)之厚度」、及下文所述之「(2-3)層(r)之厚度」之測定法所求出之層(c)及層(r)之厚度分別為5.6 nm及4.3 nm,該等之合計之厚度為9.9 nm(5.6 nm+4.3 nm)。 Example 2-3 The organosilicon compound of layer (C) was set as KBM603 (N-2-(aminoethyl)-3-aminopropyltrimethoxysilane), except that, by the same method as in Example 2-1 way to make laminates. The layer (c) and The thicknesses of layer (r) are 5.6 nm and 4.3 nm respectively, and the total thickness thereof is 9.9 nm (5.6 nm+4.3 nm).

比較例2-1 準備於聚對苯二甲酸乙二酯基材(s1)積層含有四級銨鹽作為抗靜電劑(AS)之硬塗層(s2)而成之基材(s)(硬塗層之厚度:5 μm,基材(s)之厚度:50 μm)。由於未形成層(c)及層(r),故而任一層之厚度均為0 nm,合計厚度亦為0 nm。 Comparative example 2-1 Prepare a substrate (s) formed by laminating a hard coat (s2) containing a quaternary ammonium salt as an antistatic agent (AS) on a polyethylene terephthalate substrate (s1) (thickness of the hard coat: 5 μm, the thickness of the substrate (s): 50 μm). Since neither layer (c) nor layer (r) was formed, the thickness of either layer was 0 nm, and the total thickness was also 0 nm.

比較例2-2 除了未形成層(C)以外,藉由與實施例2-1同樣之方式製作積層體。藉由下文所述之「(2-4)層(c)之厚度」、及下文所述之「(2-3)層(r)之厚度」之測定法所求出之層(c)及層(r)之厚度分別為0 nm及4.5 nm,該等合計之厚度為4.5 nm(0 nm+4.5 nm)。 Comparative example 2-2 A laminate was produced in the same manner as in Example 2-1 except that the layer (C) was not formed. The layer (c) and The thicknesses of layer (r) are 0 nm and 4.5 nm respectively, and their total thickness is 4.5 nm (0 nm+4.5 nm).

比較例2-3 將層(C)之有機矽化合物設為TEOS(四乙氧基矽烷),將形成方法之棒設為#18,除此以外,藉由與實施例2-1同樣之方式製作積層體。藉由下文所述之「(2-4)層(c)之厚度」、及下文所述之「(2-3)層(r)之厚度」之測定法所求出之層(c)及層(r)之厚度分別為31.4 nm及4.2 nm,該等合計之厚度為35.6 nm(31.4 nm+4.2 nm)。 Comparative example 2-3 A laminate was produced in the same manner as in Example 2-1 except that the organosilicon compound of the layer (C) was TEOS (tetraethoxysilane) and the bar of the formation method was #18. The layer (c) and The thicknesses of layer (r) are 31.4 nm and 4.2 nm respectively, and their total thickness is 35.6 nm (31.4 nm+4.2 nm).

按照以下要領評價實施例中所獲得之積層體。The laminates obtained in Examples were evaluated in the following manner.

(2-1)表面電阻上升率算出方法 使用Hiresta-UP(三菱ANALYTECH股份有限公司製造之MCP-HT450),於與積層體之表面相接之狀態下,以施加電壓:500 V進行測定,於積層體之耐熱試驗(80℃、36小時)後亦進行測定。再者,表面電阻上升率係藉由下述計算方法算出。 耐熱試驗後表面電阻率/試驗前表面電阻率 (2-1) Calculation method of surface resistance increase rate Using Hiresta-UP (MCP-HT450 manufactured by Mitsubishi ANALYTECH Co., Ltd.), in the state of being in contact with the surface of the laminate, the applied voltage: 500 V is used for measurement, and the heat resistance test of the laminate (80°C, 36 hours) ) were also measured. In addition, the surface resistance increase rate was calculated by the following calculation method. Surface resistivity after heat resistance test/surface resistivity before test

(2-2)耐擦傷性 使用具備鋼絲絨#0000(Bonstar公司製造)之鋼絲絨試驗機(大榮精機公司製造),於鋼絲絨與積層體之表面(層(r))相接之狀態下,施加250 g/cm 2之壓力進行磨耗試驗,往復1500次。確認磨耗後有無損傷。再者,損傷有無之確認係於LED照明下進行。 (2-2) Scratch resistance Using a steel wool testing machine (manufactured by Daiei Seiki Co., Ltd.) equipped with steel wool #0000 (manufactured by Bonstar Co., Ltd.), the steel wool is in contact with the surface (layer (r)) of the laminate. Under the pressure of 250 g/cm 2 , wear test was carried out, reciprocating 1500 times. Check for damage after abrasion. Furthermore, the confirmation of the presence or absence of damage was performed under LED lighting.

(2-3)層(r)之厚度 層(r)之膜厚係依照下述記載,使用X射線光電子光譜法(XPS)進行測定。首先,藉由與實施例1同樣之方法於經大氣壓電漿處理之玻璃基板上製作層(c)、層(r)。此時,將塗佈量改變4處而塗佈撥水層形成用組合物,製作合計4種層(c)之厚度相同、層(r)之膜厚不同之積層體。 繼而,使用橢圓偏光儀測定各層(r)之膜厚。又,對於同一層,使用XPS法測定F元素之量、及與F元素鍵結以外之C元素之量,算出其比(F/C(C-F以外)),製作相對於層(r)之膜厚之校準曲線。於該情形時,F元素之量來自層(r),與F元素鍵結之C元素以外之C元素之量來自層(c)。 繼而,對實施例中所製作之積層體實施XPS測定,依照上述所製作之校準曲線,算出層(r)之膜厚。 <XPS測定條件> 裝置名:Thermofisher Scientific製造之K-alpha X射線源:單色Al Kα 功率:72 W(12 kV,6 mA) 光點大小:400 μm 通過能量:50 eV 留置時間:50 ms 模式(元素):窄(F,C) 中和槍:on (2-3) Thickness of layer (r) The film thickness of layer (r) was measured using X-ray photoelectron spectroscopy (XPS) according to the following description. First, layer (c) and layer (r) were fabricated on a glass substrate treated with atmospheric pressure plasma by the same method as in Example 1. At this time, the composition for forming a water-repellent layer was applied while changing the coating amount in four places, and a total of four types of laminates having the same thickness of the layer (c) and different film thicknesses of the layer (r) were produced. Next, the film thickness of each layer (r) was measured using an ellipsometer. Also, for the same layer, the amount of element F and the amount of element C other than elements bonded to F are measured by XPS method, and the ratio (F/C (other than C-F)) is calculated to prepare a film for layer (r) Thick calibration curve. In this case, the amount of the F element comes from the layer (r), and the amount of the C elements other than the C element bonded to the F element comes from the layer (c). Next, XPS measurement was carried out on the laminate produced in the example, and the film thickness of the layer (r) was calculated according to the calibration curve prepared above. <XPS measurement conditions> Device name: K-alpha manufactured by Thermofisher Scientific X-ray source: Monochromatic Al Kα Power: 72W (12kV, 6mA) Spot size: 400 μm Pass energy: 50 eV Dwell time: 50 ms mode (element): narrow (F, C) Neutralizing gun: on

(2-4)層(c)之厚度 對於塗敷有層(c)及層(r)之積層體,利用FIB-SEM製作超薄切片,自截面方向利用掃描透過電子顯微鏡(STEM)進行觀察,藉此測定層(c)之厚度。 <FIB加工條件> 裝置名:HeliosG4UX(日本FEI公司製造) 離子源:Ga 加速電壓:30 kV 試樣厚度:100 nm以下 <STEM測定條件> 裝置名:HeliosG4UX(日本FEI公司製造) 加速電壓:23 kV 電流值:50 pA 倍率:100萬倍 (2-4) Thickness of layer (c) For the laminate coated with layer (c) and layer (r), ultra-thin sections were made by FIB-SEM, and the thickness of layer (c) was measured by observing with scanning transmission electron microscope (STEM) from the cross-sectional direction. <FIB Processing Conditions> Device name: HeliosG4UX (manufactured by Japan FEI Corporation) Ion source: Ga Acceleration voltage: 30 kV Sample thickness: below 100 nm <STEM measurement conditions> Device name: HeliosG4UX (manufactured by Japan FEI Corporation) Acceleration voltage: 23 kV Current value: 50pA Magnification: 1 million times

(2-5)動摩擦係數 使用新東科學股份有限公司製造之Tribogear(表面性測定機 TYPE:38)之一定荷重測定,並使用人工皮革,測定條件設為下述條件,測定撥水層(r)側表面之動摩擦係數。 荷重轉換機:1.961 mV/V 荷重:200 g 移動距離:50 mm 移動速度:100 mm/min 採樣個數:3010 (2-5) Dynamic friction coefficient The dynamic friction coefficient of the water-repellent layer (r) side surface was measured using Tribogear (surface property measuring machine TYPE: 38) manufactured by Shinto Scientific Co., Ltd. under a constant load, using artificial leather, and the measurement conditions were set to the following conditions. Load converter: 1.961 mV/V Load: 200 g Moving distance: 50mm Moving speed: 100mm/min Number of samples: 3010

關於實施例及比較例,將上述(2-1)~(2-5)之評價結果示於表2。Table 2 shows the evaluation results of the above-mentioned (2-1) to (2-5) about Examples and Comparative Examples.

[表2]    層(c) 層(r)厚度 (nm) 防靜電性能 耐擦傷性試驗 動摩擦試驗 有機矽化合物(C) 厚度 (nm) 耐熱試驗前之表面電阻率 (Ω/□) 耐熱試驗後之表面電阻率 (Ω/□) 耐熱試驗前後之表面電阻率上升率 實施例2-1 X-12-5263HP 6.6 4.3 1.1×10 10 3.8×10 10 3.5倍 無擦傷 0.041 實施例2-2 X-12-5263HP 18.1 3.7 9.8×10 9 3.2×10 10 3.3倍 無擦傷 0.042 實施例2-3 KBM603 5.6 4.3 1.4×10 10 3.7×10 10 2.6倍 無擦傷 0.045 比較例2-1 - 0 0 9.7×10 9 6.3×10 10 6.5倍 有擦傷 -(※) 比較例2-2 - 0 4.5 9.8×10 9 8.9×10 10 9.1倍 有擦傷 0.052 比較例2-3 TEOS 31.4 4.2 9.9×10 9 4.2×10 10 4.2倍 有擦傷 0.051 ※值過高而無法測定 [Table 2] layer (c) Layer (r) thickness (nm) Anti-static performance Scratch resistance test dynamic friction test Organosilicon compound (C) Thickness (nm) Surface resistivity before heat resistance test (Ω/□) Surface resistivity after heat resistance test (Ω/□) Surface resistivity increase rate before and after heat resistance test Example 2-1 X-12-5263HP 6.6 4.3 1.1×10 10 3.8×10 10 3.5 times no scratches 0.041 Example 2-2 X-12-5263HP 18.1 3.7 9.8×10 9 3.2×10 10 3.3 times no scratches 0.042 Example 2-3 KBM603 5.6 4.3 1.4×10 10 3.7×10 10 2.6 times no scratches 0.045 Comparative example 2-1 - 0 0 9.7×10 9 6.3×10 10 6.5 times have scratches -(※) Comparative example 2-2 - 0 4.5 9.8×10 9 8.9×10 10 9.1 times have scratches 0.052 Comparative example 2-3 TEOS 31.4 4.2 9.9×10 9 4.2×10 10 4.2 times have scratches 0.051 ※The value is too high to measure

根據表2可知,於具有導電性之基材(s)與上述層(r)之間設置有含有氮元素之層(c)之實施例1~3之積層體的耐熱試驗後之表面電阻率之上升受到抑制,並且耐擦傷性亦優異。 產業上之可利用性 According to Table 2, the surface resistivity after the heat resistance test of the laminates of Examples 1 to 3 in which the layer (c) containing nitrogen element is provided between the conductive substrate (s) and the above-mentioned layer (r) The rise of the carbon dioxide is suppressed, and the scratch resistance is also excellent. Industrial availability

本發明(第一態樣及第二態樣)之積層體可適宜地用於觸控面板顯示器等顯示裝置、光學元件、半導體元件、建築材料、奈米壓印技術、太陽電池、汽車或建築物之窗玻璃、烹飪器具等金屬製品、餐具等陶瓷製品、塑膠製之汽車零件等,於產業上有用。又,亦可較佳地用於廚房、浴室、洗臉槽、鏡子、衛生間周邊之各構件之物品等。The laminates of the present invention (the first aspect and the second aspect) can be suitably used in display devices such as touch panel displays, optical elements, semiconductor elements, building materials, nanoimprint technology, solar cells, automobiles, and buildings Window glass, metal products such as cooking utensils, ceramic products such as tableware, and auto parts made of plastic are useful in industry. In addition, it can also be preferably used in kitchens, bathrooms, washbasins, mirrors, and various components around the toilet.

Claims (29)

一種積層體,其係包含含有抗菌成分(K)之基材(s)、及撥水層(r)者,且 上述積層體包含具有鍵結有水解性基或羥基之矽原子之有機矽化合物(C), 上述撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子之有機矽化合物(A)之硬化層, 包含設置於基材(s)之撥水層(r)之積層部之厚度為1 nm以上50 nm以下。 A laminate comprising a substrate (s) containing an antibacterial component (K) and a water-repellent layer (r), and The above laminate contains an organosilicon compound (C) having a silicon atom bonded to a hydrolyzable group or a hydroxyl group, The above-mentioned water-repellent layer (r) is a hardened layer of an organosilicon compound (A) having a silicon atom to which a hydrolyzable group or a hydroxyl group is bonded via a linking group or not via a linking group, The thickness of the layered part including the water-repellent layer (r) provided on the substrate (s) is not less than 1 nm and not more than 50 nm. 如請求項1之積層體,其中於撥水層(r)與基材(s)之間設置有層(c), 層(c)包含有機矽化合物(C)。 The laminate according to claim 1, wherein a layer (c) is provided between the water-repellent layer (r) and the substrate (s), Layer (c) contains organosilicon compound (C). 如請求項2之積層體,其中上述層(c)之厚度未達30 nm。The laminate according to claim 2, wherein the thickness of the above-mentioned layer (c) is less than 30 nm. 如請求項1之積層體,其中基材(s)與撥水層(r)直接積層, 撥水層(r)包含有機矽化合物(C)。 Such as the laminated body of claim 1, wherein the substrate (s) and the water-repellent layer (r) are directly laminated, The water-repellent layer (r) contains organosilicon compound (C). 如請求項1至4中任一項之積層體,其中有機矽化合物(C)為具有胺基或胺骨架之化合物。The laminate according to any one of claims 1 to 4, wherein the organosilicon compound (C) is a compound having an amine group or an amine skeleton. 如請求項1至5中任一項之積層體,其中有機矽化合物(C)為式(c1)~(c3)之任一者所表示之化合物、或者兩種以上之式(c3)所表示之化合物藉由下述X 31~X 34之至少任一者縮合而鍵結而成之化合物, [化1]
Figure 03_image051
於上述式(c1)中, R x11、R x12、R x13、R x14分別獨立為氫原子或碳數1~4之烷基,於存在複數個R x11之情形時,複數個R x11可分別不同,於存在複數個R x12之情形時,複數個R x12可分別不同,於存在複數個R x13之情形時,複數個R x13可分別不同,於存在複數個R x14之情形時,複數個R x14可分別不同, Rf x11、Rf x12、Rf x13、Rf x14分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf x11之情形時,複數個Rf x11可分別不同,於存在複數個Rf x12之情形時,複數個Rf x12可分別不同,於存在複數個Rf x13之情形時,複數個Rf x13可分別不同,於存在複數個Rf x14之情形時,複數個Rf x14可分別不同, R x15為碳數1~20之烷基,於存在複數個R x15之情形時,複數個R x15可分別不同, X 11為水解性基或羥基,於存在複數個X 11之情形時,複數個X 11可分別不同, Y 11為-NH-、或-S-,於存在複數個Y 11之情形時,複數個Y 11可分別不同, Z 11為乙烯基、α-甲基乙烯基、苯乙烯基、甲基丙烯醯基、丙烯醯基、胺基、異氰酸酯基、異氰尿酸酯基、環氧基、脲基、或巰基, p1為1~20之整數,p2、p3、p4分別獨立為0~10之整數,p5為0~10之整數, p6為1~3之整數, 於Z 11不為胺基之情形時,具有至少1個為-NH-之Y 11,於Y 11全部為-S-之情形或p5為0之情形時,Z 11為胺基, 關於Z 11-、-Si(X 11) p6(R x15) 3 p6、p1個-{C(R x11)(R x12)}-單元(U c11)、p2個-{C(Rf x11)(Rf x12)}-單元(U c12)、p3個-{Si(R x13)(R x14)}-單元(U c13)、p4個-{Si(Rf x13)(Rf x14)}-單元(U c14)、p5個-Y 11-單元(U c15),Z 11-為式(c1)所表示之化合物之一個末端,-Si(X 11) p6(R x15) 3 p6為另一個末端,只要-O-不與-O-連續,則各單元(U c11)~單元(U c15)以任意之順序排列而鍵結; [化2]
Figure 03_image053
於上述式(c2)中, R x20及R x21分別獨立為氫原子或碳數1~4之烷基,於存在複數個R x20之情形時,複數個R x20可分別不同,於存在複數個R x21之情形時,複數個R x21可分別不同, Rf x20及Rf x21分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf x20之情形時,複數個Rf x20可分別不同,於存在複數個Rf x21之情形時,複數個Rf x21可分別不同, R x22及R x23分別獨立為碳數1~20之烷基,於存在複數個R x22及R x23之情形時,複數個R x22及R x23可分別不同, X 20及X 21分別獨立為水解性基或羥基,於存在複數個X 20及X 21之情形時,複數個X 20及X 21可分別不同, p20分別獨立為1~30之整數,p21分別獨立為0~30之整數,標註p20或p21並以括號括住之重複單元之至少一者被取代為胺骨架-NR 100-,上述胺骨架中之R 100為氫原子或烷基, p22及p23分別獨立為1~3之整數, p20個-{C(R x20)(R x21)}-單元(U c21)、p21個-{C(Rf x20)(Rf x21)}-單元(U c22)無需為p20個單元(U c21)或p21個單元(U c22)連續,各單元(U c21)及單元(U c22)以任意之順序排列而鍵結,式(c2)所表示之化合物之一個末端為-Si(X 20) p22(R x22) 3 p22,另一個末端為-Si(X 21) p23(R x23) 3 p23; [化3]
Figure 03_image055
於上述式(c3)中, Z 31、Z 32分別獨立為水解性基及羥基以外之反應性官能基, R x31、R x32、R x33、R x34分別獨立為氫原子或碳數1~4之烷基,於存在複數個R x31之情形時,複數個R x31可分別不同,於存在複數個R x32之情形時,複數個R x32可分別不同,於存在複數個R x33之情形時,複數個R x33可分別不同,於存在複數個R x34之情形時,複數個R x34可分別不同, Rf x31、Rf x32、Rf x33、Rf x34分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf x31之情形時,複數個Rf x31可分別不同,於存在複數個Rf x32之情形時,複數個Rf x32可分別不同,於存在複數個Rf x33之情形時,複數個Rf x33可分別不同,於存在複數個Rf x34之情形時,複數個Rf x34可分別不同, Y 31為-NH-、-N(CH 3)-或-O-,於存在複數個Y 31之情形時,複數個Y 31可分別不同, X 31、X 32、X 33、X 34分別獨立為-OR c(R c為氫原子、碳數1~4之烷基、或胺基C 1-3烷基二C 1-3烷氧基矽烷基),於存在複數個X 31之情形時,複數個X 31可分別不同,於存在複數個X 32之情形時,複數個X 32可分別不同,於存在複數個X 33之情形時,複數個X 33可分別不同,於存在複數個X 34之情形時,複數個X 34可分別不同, p31為0~20之整數,p32、p33、p34分別獨立為0~10之整數,p35為0~5之整數,p36為1~10之整數,p37為0或1, 滿足Z 31及Z 32之至少一者為胺基、或Y 31之至少一者為-NH-或-N(CH 3)-之條件,且式(c3)所表示之化合物之一個末端為Z 31-,另一個末端為Z 32-,只要-O-不與-O-連續,則p31個-{C(R x31)(R x32)}-單元(U c31)、p32個-{C(Rf x31)(Rf x32)}-單元(U c32)、p33個-{Si(R x33)(R x34)}-單元(U c33)、p34個-{Si(Rf x33)(Rf x34)}-單元(U c34)、p35個-Y 31-單元(U c35)、p36個-{Si(X 31)(X 32)-O}-單元(U c36)、p37個-{Si(X 33)(X 34)}-單元(U c37)分別以任意之順序排列而鍵結地構成。
The laminate according to any one of claims 1 to 5, wherein the organosilicon compound (C) is a compound represented by any one of formulas (c1) to (c3), or two or more compounds represented by formula (c3) The compound formed by the condensation of at least any one of the following X 31 to X 34 is bonded, [Chem. 1]
Figure 03_image051
In the above formula (c1), R x11 , R x12 , R x13 , and R x14 are each independently a hydrogen atom or an alkyl group with 1 to 4 carbons. When there are multiple R x11 , the multiple R x11 can be respectively Different, when there is a plurality of R x12 , the plurality of R x12 can be different, when there is a plurality of R x13 , the plurality of R x13 can be different, and when there is a plurality of R x14 , the plurality of R x14 R x14 can be different respectively, Rf x11 , Rf x12 , Rf x13 , and Rf x14 are each independently an alkyl group with 1 to 20 carbons or fluorine atoms in which one or more hydrogen atoms are replaced by fluorine atoms, and there are multiple Rf x11 In the case of multiple Rf x11, the plurality of Rf x11 can be different. In the case of multiple Rf x12 , the plurality of Rf x12 can be different. In the case of multiple Rf x13 , the plurality of Rf x13 can be different. In the case of a plurality of Rf x14 , the plurality of Rf x14 can be different, and R x15 is an alkyl group with 1 to 20 carbons. In the case of a plurality of R x15 , the plurality of R x15 can be different, and X 11 is hydrolyzed In the case of a neutral group or a hydroxyl group, when there are a plurality of X 11 , the plurality of X 11 can be different, Y 11 is -NH-, or -S-, when there is a plurality of Y 11 , the plurality of Y 11 can be are different, Z 11 is vinyl, α-methylvinyl, styrene, methacryl, acryl, amine, isocyanate, isocyanurate, epoxy, urea, or mercapto, p1 is an integer of 1 to 20, p2, p3, and p4 are each independently an integer of 0 to 10, p5 is an integer of 0 to 10, p6 is an integer of 1 to 3, and when Z 11 is not an amino group , has at least one Y 11 that is -NH-, and when all Y 11 are -S- or p5 is 0, Z 11 is an amino group, and Z 11 -, -Si(X 11 ) p6 (R x15 ) 3 - p6 , p1-{C(R x11 )(R x12 )}-unit (U c11 ), p2-{C(Rf x11 )(Rf x12 )}-unit (U c12 ), p3-{Si(R x13 )(R x14 )}-unit (U c13 ), p4-{Si(Rf x13 )(Rf x14 )}-unit (U c14 ), p5-Y 11 -unit ( U c15 ), Z 11 - is one terminal of the compound represented by formula (c1), -Si(X 11 ) p6 (R x15 ) 3 - p6 is the other terminal, as long as -O- is not continuous with -O-, Then each unit (U c11 )~unit (U c15 ) is arranged in any order and bonded ; [Chem 2]
Figure 03_image053
In the above formula (c2), R x20 and R x21 are each independently a hydrogen atom or an alkyl group with 1 to 4 carbons. When there are multiple R x20 , the multiple R x20 can be different. In the case of R x21 , the plurality of R x21 may be different, and Rf x20 and Rf x21 are each independently an alkyl group with 1 to 20 carbon atoms or a fluorine atom in which one or more hydrogen atoms are replaced by fluorine atoms. In the case of Rf x20 , a plurality of Rf x20 may be different, and in the case of a plurality of Rf x21 , a plurality of Rf x21 may be different, R x22 and R x23 are independently an alkyl group with 1 to 20 carbon atoms, and When there are multiple R x22 and R x23 , the multiple R x22 and R x23 can be different respectively, X20 and X21 are independently hydrolyzable groups or hydroxyl groups, and when there are multiple X20 and X21 , A plurality of X 20 and X 21 can be different, p20 is independently an integer of 1 to 30, p21 is an integer of 0 to 30, respectively, and at least one of the repeating units marked p20 or p21 and enclosed in parentheses is replaced by Amine skeleton -NR 100 -, R 100 in the above amine skeleton is a hydrogen atom or an alkyl group, p22 and p23 are independently an integer of 1 to 3, p20 -{C(R x20 )(R x21 )}-units ( U c21 ), p21-{C(Rf x20 )(Rf x21 )}-units (U c22 ) do not need to be p20 units (U c21 ) or p21 units (U c22 ) continuous, each unit (U c21 ) and Units (U c22 ) are arranged in any order and bonded. One end of the compound represented by formula (c2) is -Si(X 20 ) p22 (R x22 ) 3 p22 , and the other end is -Si(X 21 ) p23 (R x23 ) 3 - p23 ; [chemical 3]
Figure 03_image055
In the above formula (c3), Z 31 and Z 32 are independently hydrolyzable groups and reactive functional groups other than hydroxyl groups, and R x31 , R x32 , R x33 , and R x34 are independently hydrogen atoms or carbon numbers of 1 to 4 The alkyl group, when there are multiple R x31 , the multiple R x31 can be different, when there are multiple R x32 , the multiple R x32 can be different, when there are multiple R x33 , Plural R x33 may be different, and when there are multiple R x34 , multiple R x34 may be different, Rf x31 , Rf x32 , Rf x33 , Rf x34 are each independently one or more hydrogen atoms replaced by fluorine For an alkyl or fluorine atom with 1 to 20 carbon atoms, when there are multiple Rf x31 , the multiple Rf x31 may be different, and when there are multiple Rf x32 , the multiple Rf x32 may be different, When there are multiple Rf x33 , the multiple Rf x33 can be different, and when there are multiple Rf x34 , the multiple Rf x34 can be different, Y 31 is -NH-, -N(CH 3 )- Or -O-, when there are multiple Y 31s , the multiple Y 31s can be different, and X 31 , X 32 , X 33 , and X 34 are independently -OR c (R c is a hydrogen atom with a carbon number of 1 ~4 alkyl groups, or amino C 1-3 alkyl diC 1-3 alkoxysilyl groups), when there are multiple X 31s , the multiple X 31s can be different, and when there are multiple X In the case of 32 , the plurality of X 32 can be different, and in the case of a plurality of X 33 , the plurality of X 33 can be different, and in the case of a plurality of X 34 , the plurality of X 34 can be different, p31 is an integer of 0 to 20, p32, p33, and p34 are independently an integer of 0 to 10, p35 is an integer of 0 to 5, p36 is an integer of 1 to 10, p37 is 0 or 1, and satisfies the requirements of Z 31 and Z 32 At least one of them is an amino group, or at least one of Y 31 is -NH- or -N(CH 3 )-, and one terminal of the compound represented by formula (c3) is Z 31 -, and the other terminal is Z 32 -, as long as -O- is not continuous with -O-, then p31-{C(R x31 )(R x32 )}-unit (U c31 ), p32-{C(Rf x31 )(Rf x32 ) }-unit(U c32 ), p33-{Si(R x33 )(R x34 )}-unit(U c33 ), p34-{Si(Rf x33 )(Rf x34 )}-unit(U c34 ), p35-Y 31 -unit (U c35 ), p36-{Si(X 3 1 )(X 32 )-O}-unit (U c36 ), and p37-{Si(X 33 )(X 34 )}-unit (U c37 ) are respectively arranged in an arbitrary order to form a bond.
如請求項1至6中任一項之積層體,其中抗菌成分(K)包含金屬離子。The laminate according to any one of claims 1 to 6, wherein the antibacterial component (K) contains metal ions. 如請求項1至7中任一項之積層體,其中抗菌成分(K)包含四級銨鹽。The laminate according to any one of claims 1 to 7, wherein the antibacterial component (K) contains a quaternary ammonium salt. 如請求項8之積層體,其中四級銨鹽為式(k1)所表示之化合物, [化4]
Figure 03_image057
[於式(k1)中, R k1~R k3分別獨立地表示碳數1~30之烴基, R k4及R k5分別獨立地表示碳數1~4之烷基,於存在複數個R k5之情形時,複數個R k5可分別不同, Y k1及Y k2分別獨立地表示單鍵或碳數1~10之二價烴基, A k1及A k2分別獨立地表示水解性基或羥基,於存在複數個A k1之情形時,複數個A k1可分別不同,於存在複數個A k2之情形時,複數個A k2可分別不同, Z k1為水解性基、羥基、碳數1~4之烷基、或式(ki)所表示之基, k3表示1或2, k4表示0~2之整數, k5表示0~10之整數, 於Z k1為水解性基、羥基、或碳數1~4之烷基之情形時,n表示1,於Z k1為式(ki)所表示之基之情形時,n表示2, X表示鹵素原子; [化5]
Figure 03_image059
[於式(ki)中,R k17~R k19分別獨立地表示碳數1~30之烴基,*表示鍵結鍵]]。
As the laminate of claim item 8, wherein the quaternary ammonium salt is a compound represented by formula (k1), [Chemical 4]
Figure 03_image057
[In formula (k1), R k1 to R k3 independently represent a hydrocarbon group with 1 to 30 carbons, R k4 and R k5 independently represent an alkyl group with 1 to 4 carbons, and where there are a plurality of R k5 In this case, a plurality of R k5 may be different, Y k1 and Y k2 independently represent a single bond or a divalent hydrocarbon group with 1 to 10 carbons, A k1 and A k2 independently represent a hydrolyzable group or a hydroxyl group, in presence In the case of a plurality of A k1 , the plurality of A k1 may be different, and in the case of a plurality of A k2 , the plurality of A k2 may be different respectively, and Z k1 is a hydrolyzable group, a hydroxyl group, or an alkane having 1 to 4 carbon atoms group, or a group represented by formula (ki), k3 represents 1 or 2, k4 represents an integer of 0 to 2, k5 represents an integer of 0 to 10, and Z k1 is a hydrolyzable group, a hydroxyl group, or a carbon number of 1 to 4 In the case of an alkyl group, n represents 1, and in the case where Z k1 is a group represented by formula (ki), n represents 2, and X represents a halogen atom; [Chemical 5]
Figure 03_image059
[In formula (ki), R k17 to R k19 each independently represent a hydrocarbon group having 1 to 30 carbon atoms, and * represents a bonding bond]].
如請求項1至9中任一項之積層體,其中撥水層(r)表面之水接觸角為105°以上,且滿足選自由下述要件(α)及(β)所組成之群中之至少一個要件: (α)進行依照JIS Z 2801:2010之抗菌活性試驗時針對金黃色葡萄球菌之抗菌活性值為0.1以上; (β)進行依照JIS Z 2801:2010之抗菌活性試驗時針對大腸桿菌之抗菌活性值為0.1以上。 The laminate according to any one of claims 1 to 9, wherein the water contact angle on the surface of the water-repellent layer (r) is 105° or more, and satisfies the group selected from the following requirements (α) and (β) At least one of the elements: (α) The antibacterial activity value against Staphylococcus aureus in the antibacterial activity test according to JIS Z 2801:2010 is 0.1 or more; (β) When the antibacterial activity test according to JIS Z 2801:2010 is carried out, the antibacterial activity value against Escherichia coli is 0.1 or more. 如請求項1至10中任一項之積層體,其中以直徑6 mm之圓為單位施加荷重1000 g,將上述積層體之撥水層(r)表面往復摩擦1500次,進行該耐磨耗試驗後之撥水層(r)表面之水接觸角為75°以上。The laminated body according to any one of claims 1 to 10, wherein a load of 1000 g is applied on a circle with a diameter of 6 mm, and the surface of the water-repellent layer (r) of the laminated body is reciprocally rubbed 1500 times to perform the abrasion resistance The water contact angle on the surface of the water-repellent layer (r) after the test is above 75°. 如請求項1至11中任一項之積層體,其中於進行施加250 g/cm 2之壓力並利用鋼絲絨摩擦上述積層體之撥水層(r)表面之磨耗試驗直至於撥水層(r)表面目視確認到剝離或損傷時,鋼絲絨於撥水層(r)表面往復之次數為100次以上。 The laminate according to any one of Claims 1 to 11, wherein the wear test is carried out by applying a pressure of 250 g/cm 2 and utilizing steel wool to rub the surface of the water-repellent layer (r) of the above-mentioned laminate until the surface of the water-repellent layer ( r) When peeling or damage is visually confirmed on the surface, the number of times the steel wool reciprocates on the surface of the water-repellent layer (r) is 100 or more. 一種積層體,其係包含具有導電性之基材(s)、含有氮元素之層(c)及含有氟元素之層(r)者,且上述層(c)設置於上述基材(s)與上述層(r)之間。A laminate comprising a conductive substrate (s), a layer (c) containing nitrogen, and a layer (r) containing fluorine, wherein the layer (c) is provided on the substrate (s) and the layer (r) above. 如請求項13之積層體,其中上述層(c)之厚度未達30 nm。The laminate according to claim 13, wherein the thickness of the above-mentioned layer (c) is less than 30 nm. 如請求項13或14之積層體,其中上述基材(s)為含有抗靜電劑之基材,或為包含含有抗靜電劑之表層之基材。The laminate according to claim 13 or 14, wherein the substrate (s) is a substrate containing an antistatic agent, or a substrate containing a surface layer containing an antistatic agent. 如請求項15之積層體,其中上述基材(s)包含樹脂基材、及上述含有抗靜電劑之表層,上述表層為硬塗層。The laminate according to claim 15, wherein the substrate (s) includes a resin substrate and the surface layer containing an antistatic agent, and the surface layer is a hard coat layer. 如請求項16之積層體,其中上述硬塗層為選自由丙烯酸系樹脂、聚矽氧系樹脂及環氧系樹脂所組成之群中之至少一種。The laminate according to claim 16, wherein the hard coat layer is at least one selected from the group consisting of acrylic resins, polysiloxane resins, and epoxy resins. 如請求項15至17中任一項之積層體,其中上述表層之厚度為10 μm以下。The laminate according to any one of claims 15 to 17, wherein the surface layer has a thickness of 10 μm or less. 如請求項15至18中任一項之積層體,其中上述抗靜電劑為離子性化合物。The laminate according to any one of claims 15 to 18, wherein the antistatic agent is an ionic compound. 如請求項15至19中任一項之積層體,其中上述抗靜電劑為具有陽離子性有機基或陰離子性有機基之離子性化合物。The laminate according to any one of claims 15 to 19, wherein the antistatic agent is an ionic compound having a cationic organic group or an anionic organic group. 如請求項15至20中任一項之積層體,其中上述抗靜電劑為選自由四級銨鹽、吡啶鎓鹽、及具有一級~三級胺基之化合物所組成之群中之至少一種。The laminate according to any one of claims 15 to 20, wherein the antistatic agent is at least one selected from the group consisting of quaternary ammonium salts, pyridinium salts, and compounds having primary to tertiary amine groups. 如請求項13至21中任一項之積層體,其中上述層(c)與上述層(r)之合計厚度未達50 nm。The laminate according to any one of claims 13 to 21, wherein the total thickness of the layer (c) and the layer (r) is less than 50 nm. 如請求項13至22中任一項之積層體,其中上述層(c)為下述式(c1)或(c2)所表示之有機矽化合物(C)之硬化層; [化6]
Figure 03_image061
於上述式(c1)中, R x11、R x12、R x13、R x14分別獨立為氫原子或碳數1~4之烷基,於存在複數個R x11之情形時,複數個R x11可分別不同,於存在複數個R x12之情形時,複數個R x12可分別不同,於存在複數個R x13之情形時,複數個R x13可分別不同,於存在複數個R x14之情形時,複數個R x14可分別不同, Rf x11、Rf x12、Rf x13、Rf x14分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf x11之情形時,複數個Rf x11可分別不同,於存在複數個Rf x12之情形時,複數個Rf x12可分別不同,於存在複數個Rf x13之情形時,複數個Rf x13可分別不同,於存在複數個Rf x14之情形時,複數個Rf x14可分別不同, R x15為碳數1~20之烷基,於存在複數個R x15之情形時,複數個R x15可分別不同, X 11為水解性基或羥基,於存在複數個X 11之情形時,複數個X 11可分別不同, Y 11為-NH-、或-S-,於存在複數個Y 11之情形時,複數個Y 11可分別不同, Z 11為乙烯基、α-甲基乙烯基、苯乙烯基、甲基丙烯醯基、丙烯醯基、胺基、異氰酸酯基、異氰尿酸酯基、環氧基、脲基、或巰基, p1為1~20之整數,p2、p3、p4分別獨立為0~10之整數,p5為0~10之整數, p6為1~3之整數, 於Z 11不為胺基之情形時,具有至少1個為-NH-之Y 11,於Y 11全部為-S-之情形或p5為0之情形時,Z 11為胺基, 關於Z 11-、-Si(X 11) p6(R x15) 3 p6、p1個-{C(R x11)(R x12)}-單元(U c11)、p2個-{C(Rf x11)(Rf x12)}-單元(U c12)、p3個-{Si(R x13)(R x14)}-單元(U c13)、p4個-{Si(Rf x13)(Rf x14)}-單元(U c14)、p5個-Y 11-單元(U c15),Z 11-為式(c1)所表示之化合物之一個末端,-Si(X 11) p6(R x15) 3 p6為另一個末端,只要-O-不與-O-連續,則各單元(U c11)~單元(U c15)以任意之順序排列而鍵結, [化7]
Figure 03_image063
於上述式(c2)中, R x20及R x21分別獨立為氫原子或碳數1~4之烷基,於存在複數個R x20之情形時,複數個R x20可分別不同,於存在複數個R x21之情形時,複數個R x21可分別不同, Rf x20及Rf x21分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之烷基或氟原子,於存在複數個Rf x20之情形時,複數個Rf x20可分別不同,於存在複數個Rf x21之情形時,複數個Rf x21可分別不同, R x22及R x23分別獨立為碳數1~20之烷基,於存在複數個R x22及R x23之情形時,複數個R x22及R x23可分別不同, X 20及X 21分別獨立為水解性基或羥基,於存在複數個X 20及X 21之情形時,複數個X 20及X 21可分別不同, p20為1~30之整數,p21為0~30之整數,標註p20或p21並以括號括住之重複單元之至少一者被取代為胺骨架-NR 100-,上述胺骨架中之R 100為氫原子或烷基, p22及p23分別獨立為1~3之整數, p20個-{C(R x20)(R x21)}-單元(U c21)、p21個-{C(Rf x20)(Rf x21)}-單元(U c22)無需為p20個單元(U c21)或p21個單元(U c22)連續,各單元(U c21)及單元(U c22)以任意之順序排列而鍵結,式(c2)所表示之化合物之一個末端為-Si(X 20) p22(R x22) 3 p22,另一個末端為-Si(X 21) p23(R x23) 3 p23
The laminate according to any one of claims 13 to 22, wherein the layer (c) is a hardened layer of an organosilicon compound (C) represented by the following formula (c1) or (c2); [Chemical 6]
Figure 03_image061
In the above formula (c1), R x11 , R x12 , R x13 , and R x14 are each independently a hydrogen atom or an alkyl group with 1 to 4 carbons. When there are multiple R x11 , the multiple R x11 can be respectively Different, when there is a plurality of R x12 , the plurality of R x12 can be different, when there is a plurality of R x13 , the plurality of R x13 can be different, and when there is a plurality of R x14 , the plurality of R x14 R x14 can be different respectively, Rf x11 , Rf x12 , Rf x13 , and Rf x14 are each independently an alkyl group with 1 to 20 carbons or fluorine atoms in which one or more hydrogen atoms are replaced by fluorine atoms, and there are multiple Rf x11 In the case of multiple Rf x11, the plurality of Rf x11 can be different. In the case of multiple Rf x12 , the plurality of Rf x12 can be different. In the case of multiple Rf x13 , the plurality of Rf x13 can be different. In the case of a plurality of Rf x14 , the plurality of Rf x14 can be different, and R x15 is an alkyl group with 1 to 20 carbons. In the case of a plurality of R x15 , the plurality of R x15 can be different, and X 11 is hydrolyzed In the case of a neutral group or a hydroxyl group, when there are a plurality of X 11 , the plurality of X 11 can be different, Y 11 is -NH-, or -S-, when there is a plurality of Y 11 , the plurality of Y 11 can be are different, Z 11 is vinyl, α-methylvinyl, styrene, methacryl, acryl, amine, isocyanate, isocyanurate, epoxy, urea, or mercapto, p1 is an integer of 1 to 20, p2, p3, and p4 are each independently an integer of 0 to 10, p5 is an integer of 0 to 10, p6 is an integer of 1 to 3, and when Z 11 is not an amino group , has at least one Y 11 that is -NH-, and when all Y 11 are -S- or p5 is 0, Z 11 is an amino group, and Z 11 -, -Si(X 11 ) p6 (R x15 ) 3 - p6 , p1-{C(R x11 )(R x12 )}-unit (U c11 ), p2-{C(Rf x11 )(Rf x12 )}-unit (U c12 ), p3-{Si(R x13 )(R x14 )}-unit (U c13 ), p4-{Si(Rf x13 )(Rf x14 )}-unit (U c14 ), p5-Y 11 -unit ( U c15 ), Z 11 - is one terminal of the compound represented by formula (c1), -Si(X 11 ) p6 (R x15 ) 3 - p6 is the other terminal, as long as -O- is not continuous with -O-, Then each unit (U c11 )~unit (U c15 ) is arranged in any order and bonded , [C7]
Figure 03_image063
In the above formula (c2), R x20 and R x21 are each independently a hydrogen atom or an alkyl group with 1 to 4 carbons. When there are multiple R x20 , the multiple R x20 can be different. In the case of R x21 , the plurality of R x21 may be different, and Rf x20 and Rf x21 are each independently an alkyl group with 1 to 20 carbon atoms or a fluorine atom in which one or more hydrogen atoms are replaced by fluorine atoms. In the case of Rf x20 , a plurality of Rf x20 may be different, and in the case of a plurality of Rf x21 , a plurality of Rf x21 may be different, R x22 and R x23 are independently an alkyl group with 1 to 20 carbon atoms, and When there are multiple R x22 and R x23 , the multiple R x22 and R x23 can be different respectively, X20 and X21 are independently hydrolyzable groups or hydroxyl groups, and when there are multiple X20 and X21 , A plurality of X 20 and X 21 can be different respectively, p20 is an integer of 1 to 30, p21 is an integer of 0 to 30, at least one of the repeating units marked with p20 or p21 and enclosed in brackets is substituted with an amine skeleton -NR 100 -, R 100 in the above-mentioned amine skeleton is a hydrogen atom or an alkyl group, p22 and p23 are independently an integer of 1 to 3, p20 -{C(R x20 )(R x21 )}-units (U c21 ), p21-{C(Rf x20 )(Rf x21 )}-units (U c22 ) need not be continuous for p20 units (U c21 ) or p21 units (U c22 ), each unit (U c21 ) and unit (U c22 ) are arranged in any order and bonded, one end of the compound represented by formula (c2) is -Si(X 20 ) p22 (R x22 ) 3 p22 , and the other end is -Si(X 21 ) p23 (R x23 ) 3 - p23 .
如請求項1至23中任一項之積層體,其中上述撥水層(r)為具有經由連結基或不經由連結基而鍵結有水解性基或羥基之矽原子、並且含有氟元素之有機矽化合物(A)之硬化層, 上述層(r)為含有氟元素之有機矽化合物(A)之硬化層。 The laminate according to any one of Claims 1 to 23, wherein the water-repellent layer (r) has a silicon atom to which a hydrolyzable group or a hydroxyl group is bonded via a linking group or not, and contains fluorine. The hardened layer of organosilicon compound (A), The above layer (r) is a cured layer of organosilicon compound (A) containing fluorine element. 如請求項24之積層體,其中有機矽化合物(A)為具有氟聚醚結構之化合物。The laminate according to claim 24, wherein the organosilicon compound (A) is a compound having a fluoropolyether structure. 如請求項25之積層體,其中有機矽化合物(A)為式(a1)所表示之化合物; [化8]
Figure 03_image065
於上述式(a1)中, Rf a26、Rf a27、Rf a28、及Rf a29分別獨立為1個以上之氫原子被取代為氟原子之碳數1~20之氟化烷基或氟原子,於存在複數個Rf a26之情形時,複數個Rf a26可分別不同,於存在複數個Rf a27之情形時,複數個Rf a27可分別不同,於存在複數個Rf a28之情形時,複數個Rf a28可分別不同,於存在複數個Rf a29之情形時,複數個Rf a29可分別不同, R 25及R 26分別獨立為氫原子、鹵素原子、碳數1~4之烷基、或1個以上之氫原子被取代為鹵素原子之碳數1~4之鹵化烷基,鍵結於一個碳原子之R 25及R 26之至少一者為氫原子,於存在複數個R 25之情形時,複數個R 25可分別不同,於存在複數個R 26之情形時,複數個R 26可分別不同, R 27及R 28分別獨立為氫原子、碳數1~4之烷基、或單鍵,於存在複數個R 27之情形時,複數個R 27可分別不同,於存在複數個R 28之情形時,複數個R 28可分別不同, R 29及R 30分別獨立為碳數1~20之烷基,於存在複數個R 29之情形時,複數個R 29可分別不同,於存在複數個R 30之情形時,複數個R 30可分別不同, M 7為-O-、-C(=O)-O-、-O-C(=O)-、-NR-、-NRC(=O)-、-C(=O)NR-、-CH=CH-、或-C 6H 4-,上述R為氫原子、碳數1~4之烷基或碳數1~4之含氟烷基,於存在複數個M 7之情形時,複數個M 7可分別不同, M 5為氫原子、氟原子或碳數1~4之烷基,於存在複數個M 5之情形時,複數個M 5可分別不同, M 10為氫原子、或鹵素原子,M 8及M 9分別獨立為水解性基、羥基、或-(CH 2) e7-Si(OR 14) 3,e7為1~5,R 14為甲基或乙基,於存在複數個M 8之情形時,複數個M 8可分別不同,於存在複數個M 9之情形時,複數個M 9可分別不同, f21、f22、f23、f24、及f25分別獨立為0~600之整數,f21、f22、f23、f24、及f25之合計值為13以上, f26為0~20之整數, f27分別獨立為0~2之整數, g21為1~3之整數,g22為0~2之整數,且g21+g22≦3, g31為1~3之整數,g32為0~2之整數,且g31+g32≦3, 關於M 10-、-Si(M 9) g31(H) g32(R 30) 3 g31 g32、f21個-{C(R 25)(R 26)}-單元(U a1)、f22個-{C(Rf a26)(Rf a27)}-單元(U a2)、f23個-{Si(R 27)(R 28)}-單元(U a3)、f24個-{Si(Rf a28)(Rf a29)}-單元(U a4)、f25個-M 7-單元(U a5)、及f26個-[C(M 5){(CH 2) f27-Si(M 8) g21(H) g22(R 29) 3 g21 g22}]-單元(U a6),M 10-為式(a1)中之一個末端、-Si(M 9) g31(H) g32(R 30) 3 g31 g32為另一個末端,以於至少一部分形成氟聚醚結構之順序排列,只要-O-不與-O-連續,則各單元以任意順序排列而鍵結。
The laminate as claimed in item 25, wherein the organosilicon compound (A) is a compound represented by formula (a1); [Chemical 8]
Figure 03_image065
In the above formula (a1), Rf a26 , Rf a27 , Rf a28 , and Rf a29 are each independently a fluorinated alkyl group with 1 to 20 carbon atoms or a fluorine atom in which one or more hydrogen atoms are replaced by fluorine atoms. When there is a plurality of Rf a26 , the plurality of Rf a26 can be different, and when there is a plurality of Rf a27 , the plurality of Rf a27 can be different, and when there is a plurality of Rf a28 , the plurality of Rf a28 can be different. They are different. When there are multiple Rf a29s , the multiple Rf a29s can be different. R 25 and R 26 are independently a hydrogen atom, a halogen atom, an alkyl group with 1 to 4 carbon atoms, or one or more hydrogen atoms A halogenated alkyl group with 1 to 4 carbon atoms whose atom is replaced by a halogen atom. At least one of R25 and R26 bonded to a carbon atom is a hydrogen atom. When there are multiple R25s, the multiple R25 25 can be different respectively. When there are multiple R 26 , the multiple R 26 can be different respectively. R 27 and R 28 are independently a hydrogen atom, an alkyl group with 1 to 4 carbons, or a single bond. In the case of one R 27 , the plurality of R 27 may be different, and in the case of a plurality of R 28 , the plurality of R 28 may be different, R 29 and R 30 are independently an alkyl group with 1 to 20 carbons, When there are a plurality of R 29 , the plurality of R 29 may be different, and in the case of a plurality of R 30 , the plurality of R 30 may be different, M 7 is -O-, -C(=O)- O-, -OC(=O)-, -NR-, -NRC(=O)-, -C(=O)NR-, -CH=CH-, or -C 6 H 4 -, the above R is hydrogen atom, an alkyl group with 1 to 4 carbons, or a fluorine-containing alkyl group with 1 to 4 carbons, when there are multiple M7s , the multiple M7s can be different, and M5 is a hydrogen atom, a fluorine atom or a carbon For an alkyl group with a number of 1 to 4, when there are multiple M5s , the multiple M5s can be different, M10 is a hydrogen atom or a halogen atom, M8 and M9 are independently hydrolyzable groups, hydroxyl groups, Or -(CH 2 ) e7 -Si(OR 14 ) 3 , where e7 is 1 to 5, R 14 is methyl or ethyl, and when there are multiple M 8 , the multiple M 8 can be different, and when there are In the case of multiple M9s, the multiple M9s can be different, f21, f22, f23, f24, and f25 are independently integers from 0 to 600, and the total value of f21, f22, f23, f24, and f25 is 13 Above, f26 is an integer of 0 to 20, f27 is an integer of 0 to 2 independently, g21 is an integer of 1 to 3, g22 is an integer of 0 to 2, and g21+g22≦3, g31 is an integer of 1 to 3, g32 is an integer from 0 to 2, and g31+g32≦3, about M 10 -, -Si(M 9 ) g31 (H) g32 (R 30 ) 3 g31 g32 , f21-{C(R 25 )(R 26 )}-unit (U a1 ), f22-{C( Rf a26 )(Rf a27 )}-unit (U a2 ), f23-{Si(R 27 )(R 28 )}-unit (U a3 ), f24-{Si(Rf a28 )(Rf a29 )} -unit (U a4 ), f25-M 7 -unit (U a5 ), and f26-[C(M 5 ){(CH 2 ) f27 -Si(M 8 ) g21 (H) g22 (R 29 ) 3 - g21 - g22 }]-unit (U a6 ), M 10 - is one terminal in formula (a1), -Si(M 9 ) g31 (H) g32 (R 30 ) 3 - g31 - g32 is the other Terminals are arranged in the order forming at least a part of the fluoropolyether structure, and as long as -O- and -O- are not continuous, each unit can be arranged in any order and bonded.
如請求項1至26中任一項之積層體,其中撥水層(r)表面或層(r)表面之動摩擦係數為0.1以下。The laminate according to any one of claims 1 to 26, wherein the coefficient of dynamic friction of the surface of the water-repellent layer (r) or the surface of the layer (r) is 0.1 or less. 如請求項1至27中任一項之積層體,其中將上述積層體於80℃保持36小時之耐熱試驗後之表面電阻率未達上述耐熱試驗前之表面電阻率之6.4倍。The laminate according to any one of Claims 1 to 27, wherein the surface resistivity after the heat resistance test of the laminate at 80°C for 36 hours is less than 6.4 times the surface resistivity before the heat resistance test. 一種視窗膜或觸控面板顯示器,其包含如請求項1至28中任一項之積層體。A window film or a touch panel display, comprising the laminate according to any one of claims 1 to 28.
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