TW202238062A - 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 - Google Patents

蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 Download PDF

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Publication number
TW202238062A
TW202238062A TW111108765A TW111108765A TW202238062A TW 202238062 A TW202238062 A TW 202238062A TW 111108765 A TW111108765 A TW 111108765A TW 111108765 A TW111108765 A TW 111108765A TW 202238062 A TW202238062 A TW 202238062A
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TW
Taiwan
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mentioned
body surface
land
steam
capillary structure
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TW111108765A
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English (en)
Chinese (zh)
Inventor
小田和範
高橋伸一郎
武田利彦
太田貴之
山木誠
小鶴洋次
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日商大日本印刷股份有限公司
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Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202238062A publication Critical patent/TW202238062A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW111108765A 2021-03-10 2022-03-10 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 TW202238062A (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2021-038444 2021-03-10
JP2021-038465 2021-03-10
JP2021038444 2021-03-10
JP2021038465 2021-03-10
JP2021058317 2021-03-30
JP2021-058317 2021-03-30
JP2021075258 2021-04-27
JP2021-075258 2021-04-27
JP2021119907 2021-07-20
JP2021-119907 2021-07-20

Publications (1)

Publication Number Publication Date
TW202238062A true TW202238062A (zh) 2022-10-01

Family

ID=83226768

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111108765A TW202238062A (zh) 2021-03-10 2022-03-10 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器

Country Status (5)

Country Link
US (1) US12538454B2 (https=)
JP (1) JP7833131B2 (https=)
KR (1) KR20230156088A (https=)
TW (1) TW202238062A (https=)
WO (1) WO2022191240A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12520457B2 (en) * 2019-09-06 2026-01-06 Dai Nippon Printing Co., Ltd. Vapor chamber having condensate flow paths and vapor flow paths with varying cross-sectional areas in linear parts and a curved part, electronic device, and sheet for such vapor chamber
JP7479204B2 (ja) * 2020-06-04 2024-05-08 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
CN121252541A (zh) * 2025-11-07 2026-01-02 华南理工大学 一种气液共面微沟槽吸液芯结构超薄均热板及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4352091B2 (ja) 2008-03-27 2009-10-28 株式会社東芝 電子機器、冷却装置
US8857502B2 (en) 2011-07-26 2014-10-14 Kunshan Jue-Chung Electronics Co., Ltd. Vapor chamber having heated protrusion
JP6057952B2 (ja) 2014-07-09 2017-01-11 東芝ホームテクノ株式会社 シート型ヒートパイプ
JP6191561B2 (ja) 2014-08-28 2017-09-06 東芝ホームテクノ株式会社 シート型ヒートパイプ
TWI794886B (zh) 2017-02-24 2023-03-01 日商大日本印刷股份有限公司 蒸氣腔、電子機器及蒸氣腔之製造方法
JP7137783B2 (ja) * 2017-08-24 2022-09-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
CN107401941B (zh) 2017-08-28 2023-09-26 华南理工大学 一种超薄均热板结构
JP7145412B2 (ja) * 2017-09-28 2022-10-03 大日本印刷株式会社 ベーパーチャンバおよび電子機器
KR20250005523A (ko) 2017-09-28 2025-01-09 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
JP6888751B2 (ja) * 2019-03-11 2021-06-16 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート
WO2021070544A1 (ja) 2019-10-09 2021-04-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JPWO2021141110A1 (https=) 2020-01-10 2021-07-15

Also Published As

Publication number Publication date
WO2022191240A1 (ja) 2022-09-15
JPWO2022191240A1 (https=) 2022-09-15
KR20230156088A (ko) 2023-11-13
US12538454B2 (en) 2026-01-27
US20240172395A1 (en) 2024-05-23
JP7833131B2 (ja) 2026-03-19

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