TW202235815A - Measuring device - Google Patents
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- TW202235815A TW202235815A TW111102806A TW111102806A TW202235815A TW 202235815 A TW202235815 A TW 202235815A TW 111102806 A TW111102806 A TW 111102806A TW 111102806 A TW111102806 A TW 111102806A TW 202235815 A TW202235815 A TW 202235815A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
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Abstract
Description
本發明是有關於一種測量裝置。The present invention relates to a measuring device.
近年來,於半導體晶片的多段積層、硬碟驅動器用的旋轉致動器(rotary actuator)的組裝、內置於智慧型手機(smartphone)的相機模組(camera module)的組裝、及發光二極體(Light Emitting Diode,LED)的配光控制等中,對於零件的對準(alignment)要求高精度化。In recent years, in the multi-stage stacking of semiconductor wafers, the assembly of rotary actuators for hard disk drives, the assembly of camera modules built in smartphones (smartphone), and the assembly of light-emitting diodes (Light Emitting Diode, LED) light distribution control, etc., require high precision for the alignment of parts.
作為用以對包含該些零件的測定對象物進行測量及檢查的裝置,已知有利用光學系統的測量裝置。A measuring device using an optical system is known as a device for measuring and inspecting a measurement object including these components.
專利文獻1中,公開有一種與干涉方式的形狀測定裝置有關的技術。該形狀測定裝置中,確定根據測定光的光路長與參照光的光路長之差而變化的受光量的干涉圖案,基於該干涉圖案來獲取測定對象物的表面形狀。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本專利特開2018-63153號公報[Patent Document 1] Japanese Patent Laid-Open No. 2018-63153
[發明所欲解決之課題][Problem to be Solved by the Invention]
然而,專利文獻1所揭示的形狀測定裝置存在下述問題,即:需要對多點進行移動測量,或獲取龐大的資料量進行處理,因而無法高速測量等。However, the shape measuring device disclosed in
因此,本發明的目的在於提供一種高速且高精度的測量裝置。 [解決課題之手段] Therefore, an object of the present invention is to provide a high-speed and high-precision measuring device. [Means to solve the problem]
本發明的一態樣的測量裝置測量直至對象物為止的距離,且包括:光源,投射光;反射鏡;分束器,將自光源投射的光分割為導向對象物的測定光與導向反射鏡的參照光;事件相機(event based camera),針對經反射鏡反射的參照光與經對象物反射的測定光的干涉波形,探測接收的亮度值的變化而獲取資料;處理部,基於干涉波形的資料來測量直至對象物為止的距離;以及控制機構,以使事件相機獲取的受光量變化的方式進行控制。A measuring device according to an aspect of the present invention measures the distance to an object, and includes: a light source, projection light; a reflector; a beam splitter, which divides the light projected from the light source into measurement light directed to the object and a guide reflector. The reference light; the event camera (event based camera), for the interference waveform of the reference light reflected by the mirror and the measurement light reflected by the object, detects the change of the received brightness value to obtain data; the processing part, based on the interference waveform data to measure the distance to the object; and a control mechanism to control the amount of light received by the event camera to change.
根據該態樣,事件相機於所排列的各畫素中,針對經反射鏡反射的參照光與經對象物反射的測定光的干涉波形,探測接收的亮度值的變化,並於該探測的時機獲取干涉波形部分的資料,故而可獲取測量直至對象物為止的距離所需要的資料,並且減少獲取的資料量。即,測量裝置可高速且高精度地測量對象物。According to this aspect, the event camera detects the change in the brightness value received with respect to the interference waveform of the reference light reflected by the mirror and the measurement light reflected by the object in each pixel arranged, and at the timing of the detection Since the data of the interference waveform portion is obtained, the data required for measuring the distance to the object can be obtained, and the amount of data to be obtained can be reduced. That is, the measuring device can measure an object at high speed and with high precision.
所述態樣中,控制機構亦可包含:驅動部,以使測定光的光路與參照光的光路長之差變化的方式驅動反射鏡。In the above aspect, the control means may include a drive unit for driving the mirror so that the difference between the optical path length of the measurement light and the optical path length of the reference light changes.
根據該態樣,測量裝置可利用白色干涉方式的測量方法來高速且高精度地測量對象物。According to this aspect, the measuring device can measure the target object at high speed and with high precision by using the white interferometric measuring method.
所述態樣中,控制機構亦可以自光源投射的光的波長連續變化的方式,使用波長掃描光源(wavelength swept light source)作為光源。In the above aspect, the control mechanism may use a wavelength swept light source as the light source in such a manner that the wavelength of the light projected from the light source changes continuously.
根據該態樣,測量裝置可利用波長掃描方式的測量方法來高速且高精度地測量對象物。According to this aspect, the measurement device can measure the object at high speed and with high precision by using the measurement method of the wavelength scanning method.
所述態樣中,亦可包含:對數放大器(logarithmic amplifier),將事件相機獲取的受光量的增減設為極性資料,基於該極性資料的累計,算出該事件相機獲取的受光量。The above-mentioned aspect may also include: a logarithmic amplifier (logarithmic amplifier), which uses the increase and decrease of the light received by the event camera as polarity data, and calculates the light received by the event camera based on the accumulation of the polarity data.
根據該態樣,對數放大器可將事件相機獲取的受光量的增減設為極性資料而高速捕捉微小變化,因而可縮短拍攝時間。According to this aspect, the logarithmic amplifier can use the increase and decrease of the amount of light received by the event camera as polarity data to capture minute changes at high speed, thereby shortening the shooting time.
所述態樣中,亦可更包括:調整部,可調整事件相機處理的資料量。In the above aspect, it may further include: an adjustment unit, which can adjust the amount of data processed by the event camera.
根據該態樣,調整部對事件相機處理的資料量進行調整,因而即便於多個畫素中同時發生事件的情形時,事件相機亦可適當進行處理。According to this aspect, since the adjustment unit adjusts the amount of data processed by the event camera, even when an event occurs simultaneously in a plurality of pixels, the event camera can properly process it.
所述態樣中,調整部亦可具有讀出規定的一部分區域的資料的感興趣區域(Region Of Interest,ROI)功能。In the above aspect, the adjustment unit may have a Region Of Interest (ROI) function for reading data of a predetermined part of the region.
根據該態樣,使用ROI功能將對象物的測量所需要的區域設定為讀出資料的區域,因而可更適當地測量對象物。According to this aspect, by using the ROI function, an area required for measurement of an object is set as an area for reading data, so that the object can be measured more appropriately.
所述態樣中,調整部亦可包含:削光部,構成為將照射於規定的一部分區域的光導引至事件相機,且不將照射於所述一部分區域以外的區域的光導引至事件相機。In the above aspect, the adjusting unit may also include: a light cutting unit configured to guide the light irradiated on a predetermined part of the area to the event camera, and not guide the light irradiated on the area other than the part of the area to the event camera. event camera.
根據該態樣,配置有削光部,該削光部構成為將照射於規定的一部分區域的光導引至事件相機,且不將照射於所述一部分區域以外的區域的光導引至事件相機,故而可對於對象物中需要測量的區域,更適當地測量對象物。According to this aspect, the light cutting unit configured to guide the light irradiated on a predetermined part of the area to the event camera and not guide the light irradiated on the area other than the part of the area to the event camera is arranged. camera, so the object can be measured more appropriately for the area to be measured in the object.
所述態樣中,削光部亦可包含液晶面板。In the above aspect, the light-cut portion may also include a liquid crystal panel.
根據該態樣,可使用液晶面板來構成削光部,該削光部具有使照射於規定的一部分區域的光透過的透過區域、及於所述一部分區域以外的區域中遮光的遮光區域。According to this aspect, a liquid crystal panel can be used to form a light-shielded section having a transmission area that transmits light irradiated on a predetermined partial area, and a light-shielding area that blocks light in areas other than the partial area.
所述態樣中,削光部亦可配置於測定光及參照光的共同的光路上。In the above-mentioned aspect, the cutout unit may be arranged on a common optical path of the measurement light and the reference light.
根據該態樣,測定光及參照光的光路成為相同條件,因而可降低對干涉精度造成影響的可能性。According to this aspect, since the optical paths of the measurement light and the reference light are under the same condition, the possibility of affecting the interference accuracy can be reduced.
所述態樣中,規定的一部分區域亦可根據對象物的形狀而預先設定。In the above-mentioned aspect, the predetermined part of the area may be preset according to the shape of the object.
根據該態樣,根據對象物的形狀將作為對象物的特徵部分的區域、及成為測量對象的區域等設定為讀出資料或使光透過的規定的一部分區域,因而可更適當地測量對象物。 [發明的效果] According to this aspect, according to the shape of the object, the area that is the characteristic part of the object and the area to be measured are set as a predetermined part of the area that reads data or transmits light, so that the object can be measured more appropriately. . [Effect of the invention]
根據本發明,可提供一種高速且高精度的測量裝置。According to the present invention, a high-speed and high-precision measuring device can be provided.
以下,一方面參照附圖,一方面對本發明的較佳實施形態加以具體說明。再者,以下說明的實施形態僅列舉用以實施本發明的具體一例,並非限定性地解釋本發明。而且,為了使說明的理解容易,有時於各圖式中對相同的結構要素儘可能標註相同的符號,省略重覆的說明。Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the accompanying drawings. In addition, the embodiment described below is just a specific example for carrying out the present invention, and does not limitatively interpret the present invention. In addition, in order to facilitate understanding of the description, the same reference numerals may be attached to the same constituent elements as much as possible in the respective drawings, and overlapping descriptions may be omitted.
<第一實施形態>
[測量裝置的結構]
圖1為表示本發明的第一實施形態的測量裝置100的結構的概要圖。如圖1所示,測量裝置100包括光源110、光學系統120、事件相機130及處理部140。光學系統120包含分束器121、多個透鏡122~126及多個反射鏡127~129。進而,包括驅動反射鏡129的驅動部150(控制機構)。
<First Embodiment>
[Structure of measuring device]
FIG. 1 is a schematic diagram showing the configuration of a measuring device 100 according to a first embodiment of the present invention. As shown in FIG. 1 , the measuring device 100 includes a
光源110投射光L0。光源110典型而言為白色光源,例如亦可為超發光二極體(Super luminescent Diode,SLD)光源。SLD光源為具有發光二極體(LED)與半導體雷射(LD)兩個特性的寬帶域光源,相干性高於LED光源,且低於雷射光的相干性。再者,光源110以一定的強度發光,發光強度不變化。The
而且,對於光源110,除此以外亦可使用例如鹵素燈、白色LED及白色雷射光源。In addition, for the
自光源110投射的光L0透過透鏡122(例如準直透鏡)而平行化,由反射鏡127反射。經反射鏡127反射的光L0隨後藉由透過透鏡123從而聚光,並且向分束器121入射。The light L0 projected from the
分束器121將光L0分割為導向對象物T的測定光L1與導向反射鏡129的參照光。換言之,光L0的一部分由分束器121反射(測定光L1),光L0的剩餘一部分透過分束器121(參照光L2)。The
關於透鏡124(例如物鏡),測定光L1藉由透過透鏡124從而平行化。然後,測定光L1照射於對象物T的區域,經對象物T反射的測定光L1的一部分藉由透過透鏡124從而聚光,並且再次向分束器121入射。Regarding the lens 124 (for example, an objective lens), the measurement light L1 is parallelized by passing through the
另一方面,透過分束器121的參照光L2透過透鏡125而平行化,由反射鏡128反射,照射於反射鏡129。反射鏡129為所謂參照鏡。On the other hand, the reference light L2 passed through the
繼而,經反射鏡129反射的參照光L2由反射鏡128反射,藉由透過透鏡125從而聚光,並且再次向分束器121入射。Then, the reference light L2 reflected by the
由對象物T反射而入射至分束器121的測定光L1、與由反射鏡129反射而入射至分束器121的參照光L2干涉,作為干涉光L3透過透鏡126而平行化,被導引至事件相機130。事件相機130針對干涉波形L3,探測接收的亮度值的變化而獲取資料。關於事件相機130獲取的資料,將於後述。The measurement light L1 reflected by the object T and entering the
處理部140基於由事件相機130獲取的干涉波形L3的資料、及由後述的驅動部150控制的反射鏡129的位置(參照光L2的光路長)等,測量直至對象物T為止的距離。The
驅動部150(控制機構)例如為包含音圈馬達(Voice Coil Motor,VCM)等的致動器,且以參照光L2的光路長變化的方式使反射鏡129沿著光軸方向移動。The drive unit 150 (control mechanism) is, for example, an actuator including a voice coil motor (VCM), and moves the
如此,藉由使參照光L2的光路長變化,使測定光L1的光路與參照光L2的光路長之差變化,從而產生干涉波形。具體而言,能以相位差為0的位置作為中心而觀察干涉紋,於測定光L1與參照光L2的光路長一致時,產生干涉波形。利用該干涉波形來測量對象物的方法例如為被稱為白色干涉方式的測量方法。In this way, by changing the optical path length of the reference light L2, the difference between the optical path length of the measurement light L1 and the optical path length of the reference light L2 is changed to generate an interference waveform. Specifically, the interference fringe can be observed centering on the position where the phase difference is 0, and when the optical path lengths of the measurement light L1 and the reference light L2 match, an interference waveform is generated. A method of measuring an object using this interference waveform is, for example, a measurement method called a white interferometric method.
[關於事件相機]
此處,對用作攝像元件的事件相機130進行說明。事件相機130於所排列的各畫素中,探測接收的亮度值的變化,並於該探測的時機拍攝探測到變化的部分(畫素)的干涉波形,獲取亮度變化的兩極性、時間及座標的資料。
[About event camera]
Here, the
圖2為表示由用作攝像元件的事件相機130獲取資料的狀況的示意圖。如圖2所示,事件相機130於所排列的各畫素中,探測接收的亮度值的變化,並於該探測的時機獲取測量所需要的干涉波形部分的資料,於除此以外的部分中,不獲取資料。FIG. 2 is a schematic diagram showing a state of acquiring data by an
先前,用作攝像元件的互補式金屬氧化物半導體(Complementary Metal-Oxide-Semiconductor,CMOS)獲取各畫素的所有資料,其資料量龐大。換言之,事件相機130與CMOS攝像元件相比,高效率地獲取測量直至對象物T為止的距離所需要的干涉波形部分的資料。Previously, the Complementary Metal-Oxide-Semiconductor (CMOS) used as an imaging element obtained all the data of each pixel, and the amount of data was huge. In other words, the
如上文所述,使用事件相機130作為攝像元件,於所排列的各畫素中,探測接收的亮度值的變化,並於該探測的時機獲取干涉波形部分的資料,故而可獲取測量直至對象物T為止的距離所需要的資料,並且減少獲取的資料量。As mentioned above, the
圖3為表示由使用事件相機130作為攝像元件的測量裝置100測量對象物的表面形狀(直至表面為止的距離)的狀況的圖。如圖3所示,針對晶粒接合(die bonding)及相機模組的測量,事件相機130於多點(面一攬)獲取測量所需要的資料,並高效率地高速處理(讀入等)該所需要的資料。其結果為,測量裝置100可對於對象物高速且高精度地進行測量。FIG. 3 is a diagram showing how the surface shape (distance to the surface) of an object is measured by the measurement device 100 using the
進而,事件相機130亦可為了於所排列的各畫素中探測接收的亮度值的變化,並於該探測的時機獲取干涉波形部分的資料,而包含捕捉微小的受光量的變化的對數放大器。Furthermore, the
圖4為將事件相機130獲取的受光量的變化(增減)設為兩極性來表示,並表示基於該兩極性資料的累計的包絡線的圖。如圖4所示,對數放大器捕捉事件相機130獲取的受光量的微小變化,並將該變化的增減設為兩極性資料。繼而,基於該兩極性資料的累計,確定受光量分布的包絡線,算出事件相機130獲取的受光量。FIG. 4 is a diagram showing a change (increase or decrease) in the amount of light received by the
如此,藉由在事件相機130中包含對數放大器,從而可針對事件相機130獲取的受光量高速地捕捉微小變化,故而可縮短拍攝時間。In this way, by including a logarithmic amplifier in the
再者,如上文所述,事件相機130於所排列的各畫素中,分別探測受光量(亮度值)的變化等事件的發生。另外,事件相機130於探測到發生了該事件的畫素中,獲取干涉波形部分的資料。此處,亦可包括調整部,該調整部即便於多個畫素中同時發生事件的情形時,亦可根據事件相機130的容量及性能等來調整處理的資料量,以可適當進行處理。Furthermore, as mentioned above, the
[關於ROI功能]
圖5為表示使用ROI功能作為可調整事件相機130處理的資料量的調整部的一例的圖。如圖5所示,於作為事件相機130可拍攝的區域的最大有效拍攝區域中,設定有讀出資料的五個矩形區域0~4,以於其他區域中不讀出資料的方式進行設定。
[About the ROI function]
FIG. 5 is a diagram showing an example of an adjustment unit capable of adjusting the amount of data processed by the
藉此,事件相機130於排列於矩形區域0~矩形區域4內的畫素中,探測接收的亮度值的變化(事件的發生)而獲取資料,但於其他區域中,無論有無事件發生均不獲取資料。事件相機130亦可於該其他區域中,不監視有無事件發生。In this way, the
再者,此處作為讀出資料的區域,列舉設定有五個矩形區域0~4作為一例,但不限定於此,例如亦可設定有四個以下或六個以上的矩形區域。Here, five
而且,作為讀出資料的區域,各矩形區域的大小及形狀可相同亦可不同,亦可為矩形以外的形狀。In addition, as the area for reading data, the size and shape of each rectangular area may be the same or different, and may have a shape other than a rectangle.
讀出資料的區域(例如個數、形狀及位置等)只要根據事件相機130的種類、容量及性能以及測量的對象物的種類及形狀等來適當設定即可,關於該設定,可預先由用戶進行設定,亦可藉由示教而設定。The area for reading data (for example, number, shape, and position, etc.) may be appropriately set according to the type, capacity, and performance of the
圖6為表示使用事件相機130來示教讀出資料的區域的狀況的一例的圖。例如,以作為測量裝置100而測量對象物T的方式,使用事件相機130來示教讀出資料的區域。FIG. 6 is a diagram showing an example of a situation where the area where data is to be read is taught using the
如圖6所示,藉由事件相機130,針對最大有效拍攝區域中的所有畫素,使用所述白色干涉方式的測量方法來獲取資料。事件相機130例如根據種類、容量及性能等,有時無法於所有畫素中同時獲取資料,故而以可同時獲取的畫素數為單位依序獲取資料。再者,此處目的在於示教讀出資料的區域,故而於作為事件相機130獲取的資料而無需詳細資料的情形時,亦可不將所有畫素作為對象。例如,作為事件相機130獲取的資料,亦可將每幾個畫素作為對象,以經間拔的態樣獲取資料。As shown in FIG. 6 , with the
另外,基於由事件相機130獲取的資料,生成對象物T的三維(Three Dimension,3D)資料,參照該3D資料來設定讀出資料的區域。關於讀出資料的區域,例如可由用戶設定作為對象物T的特徵部分的區域、及成為測量對象的區域等,亦可針對具有規定高度的區域等而自動設定。In addition, based on the data acquired by the
再者,此處使用所述白色干涉方式的測量方法,並且藉由事件相機130針對最大有效拍攝區域的所有畫素獲取資料,但該示教中,亦可使用CMOS作為攝像元件。Furthermore, the white interferometric measurement method is used here, and the
例如,只要以與事件相機130無關而另配置的CMOS攝像元件可接收使用圖1所說明的干涉波形L3的方式,配置半反射鏡等(half mirror)即可。藉此,於示教中,CMOS攝像元件接收經該半反射鏡反射的干涉波形L3。For example, what is necessary is just to arrange|position a half mirror etc. so that the CMOS imaging element arrange|positioned separately irrespective of the
另外,若使用所述白色干涉方式的測量方法,並且藉由CMOS攝像元件針對最大有效拍攝區域的所有畫素獲取資料,則與使用圖6所說明同樣地,生成對象物T的3D資料,並參照該3D資料來設定讀出資料的區域。In addition, if the measurement method of the white interferometric method is used, and the CMOS imaging element is used to acquire data for all the pixels in the maximum effective imaging area, then the 3D data of the object T is generated in the same way as described using FIG. 6 , and An area for reading data is set with reference to the 3D data.
進而,作為藉由示教來設定讀出資料的區域的方法,例如可想到,導入對象物T的電腦輔助設計(Computer Aided Design,CAD)資料等圖式資訊,參照該圖式資訊來設定讀出資料的區域。Furthermore, as a method of setting the region for reading data by teaching, for example, it is conceivable to import schematic information such as computer-aided design (CAD) data of the object T, and set the reading area by referring to the schematic information. data area.
圖7為表示參照圖式資訊來示教讀出資料的區域的狀況的一例的圖。如圖7所示,導入測量裝置100測量的對象物T的CAD資料作為圖式資訊,參照該導入的圖式資訊,來設定讀出資料的區域。關於讀出資料的區域,例如可由用戶設定作為對象物T的特徵部分的區域、及成為測量對象的區域等,亦可針對具有規定高度的區域等而自動設定。FIG. 7 is a diagram showing an example of a situation in which an area for reading data is taught with reference to the drawing information. As shown in FIG. 7 , the CAD data of the object T to be measured by the measuring device 100 is imported as the drawing information, and the imported drawing information is referred to to set the area from which the data is read. The area where the data is read can be set by the user, for example, as a characteristic portion of the object T, or as a measurement target area, or can be automatically set for an area having a predetermined height.
而且,亦可生成距離圖像(以高度作為畫素值般的圖像資料),一方面參照距離圖像一方面進行讀出資料的區域的設定。與以3D空間上的座標資料的形式進行操作的情形相比,有可降低顯示處理的計算成本的效果。In addition, it is also possible to generate a distance image (image data whose height is the pixel value), and set the area to read the data while referring to the distance image. Compared with the case where the operation is performed as coordinate data on the 3D space, there is an effect that the calculation cost of the display processing can be reduced.
而且,亦可基於3D資料進行渲染(rendering)處理(藉由光學模擬而生成模擬的影像)而生成深淺圖像,參照深淺圖像進行區域設定。藉此,有降低顯示處理的計算成本的效果。Moreover, it is also possible to perform rendering (rendering) processing (generating a simulated image by optical simulation) based on the 3D data to generate a shaded image, and refer to the shaded image for region setting. Thereby, there is an effect of reducing the calculation cost of display processing.
[關於遮光部]
圖8為表示使用遮光部作為可調整事件相機130處理的資料量的調整部的一例的圖。如圖8所示,光學系統120中,於自光源110投射的光(L0、L1、L2)的光路中,配置包含使該光透過的區域及遮光的區域的遮光部。如圖8所示,於向光照射區域照射有光的情形時,設定有作為該光透過的區域的四個透過區域,於其他區域中以將光遮蔽的方式設定有遮光區域。
[about the shading department]
FIG. 8 is a diagram showing an example of using a light-shielding unit as an adjustment unit capable of adjusting the amount of data processed by the
藉此,事件相機130接收透過了透過區域的光,故而事件相機130中排列的多個畫素中,針對與該透過區域對應地排列的畫素,探測接收的亮度值的變化(事件的發生)而獲取資料。另一方面,事件相機130不接收經遮光區域遮蔽的光,故而事件相機130中排列的多個畫素中,針對與該遮光區域對應地排列的畫素,亦可不監視有無事件發生。Thereby, the
再者,此處作為使光透過的區域,列舉設定有四個圓形狀的透過區域作為一例,但不限定於此,例如亦可設定有三個以下或五個以上的透過區域。Here, four circular transmission regions are set as an example as the region through which light is transmitted, but the invention is not limited thereto. For example, three or less or five or more transmission regions may be set.
而且,各透過區域的大小及形狀可相同亦可不同,亦可為圓形以外(例如橢圓形、長圓形及矩形等),亦可根據測量的對象物的形狀而適當設定。Moreover, the size and shape of each transmission area may be the same or different, and may be other than circular (eg, elliptical, oblong, rectangular, etc.), and may be appropriately set according to the shape of the object to be measured.
透過區域(例如個數、形狀及位置等)只要根據事件相機130的種類、容量及性能以及測量的對象物的種類及形狀等而適當設定即可,關於該設定,可預先由用戶進行設定,亦可藉由示教而設定。The transparent area (for example, the number, shape, and position) can be appropriately set according to the type, capacity, and performance of the
再者,關於透過區域的設定,可適用上文所述的示教讀出資料的區域的方法。例如,針對圖6及圖7所示的讀出資料的區域,關於遮光部,只要將與讀出資料的區域對應的區域設定為透過區域即可,或只要將其他區域設定為遮光區域即可。Furthermore, regarding the setting of the transmission area, the above-mentioned method of teaching the area for reading data can be applied. For example, for the data-reading area shown in FIG. 6 and FIG. 7 , as for the light-shielding portion, it only needs to set the area corresponding to the data-reading area as the transmission area, or set other areas as the light-shielding area. .
進而,關於此種包括透過區域及遮光區域的遮光部,例如亦可使用液晶面板來實現。Furthermore, such a light-shielding portion including a transmissive region and a light-shielding region can also be realized using a liquid crystal panel, for example.
此處,液晶面板包含偏光濾光片(垂直)、玻璃基板(個別電極)、由配向層所夾持的液晶、玻璃基板(共用電極)及偏光濾光片(水平),偏光濾光片中成為直線偏光的光於維持該偏光方向的狀態下,無法通過偏光濾光片(水平)(遮光狀態)。另一方面,若藉由配向層所夾持的液晶使光的偏光方向彎曲90度,則可通過偏光濾光片(水平)(非遮光狀態)。玻璃基板(個別電極)與玻璃基板(共用電極)的電極以針對液晶切換遮光狀態及非遮光狀態的方式設置。Here, the liquid crystal panel includes a polarizing filter (vertical), a glass substrate (individual electrodes), liquid crystal sandwiched by an alignment layer, a glass substrate (common electrode), and a polarizing filter (horizontal). The linearly polarized light cannot pass through the polarizing filter (horizontal) while maintaining the polarization direction (blocking state). On the other hand, if the liquid crystal sandwiched by the alignment layer bends the polarization direction of the light by 90 degrees, it can pass through the polarizing filter (horizontal) (non-shielding state). The electrodes of the glass substrate (individual electrode) and the glass substrate (common electrode) are provided so as to switch between a light-shielding state and a non-light-shielding state for the liquid crystal.
圖9為表示於圖1所示的測量裝置100中配置有遮光部的結構的概要圖。如圖9所示,於透鏡122與反射鏡127之間配置有遮光部160。FIG. 9 is a schematic diagram showing a configuration in which a light shielding unit is arranged in the measurement device 100 shown in FIG. 1 . As shown in FIG. 9 , a
再者,配置遮光部160的位置不限於透鏡122與反射鏡127之間,例如亦可為光源110與透鏡122之間、反射鏡127與透鏡123之間、透鏡123與分束器121之間、分束器121與透鏡126之間、透鏡126與事件相機130之間等,只要為光學系統120中的測定光L1及參照光L2的共同的光路上(光L0及光L3的光路上)即可。Moreover, the location where the
藉由配置遮光部160,從而有所照射的光因液晶而偏光及繞射,狀態變化的可能性,但若為測定光L1及參照光L2的共同的光路上,則測定光L1及參照光L2的光路成為相同條件,因而可降低對干涉精度造成影響的可能性。By arranging the light-shielding
此處,作為包括透過區域及遮光區域的遮光部,以液晶面板為例進行了說明,但為了將照射於規定的一部分區域的光導引至事件相機130,且不將照射於所述一部分區域以外的區域的光導引至事件相機130,亦可使用數位微鏡器件(Digital Micromirror Device,DMD)來實現。Here, a liquid crystal panel has been described as an example of a light-shielding section including a transmissive area and a light-shielding area. The light in other areas is guided to the
例如,對於構成圖1所示的測量裝置100的反射鏡127使用DMD。DMD使照射於規定的一部分區域的光反射,將照射於所述一部分區域以外的區域的光吸收。即,可使照射於規定的一部分區域的光反射而向反射鏡123入射,最終導引至事件相機130。For example, DMD is used for the
如此,液晶面板及DMD等將照射於規定的一部分區域的光導引至事件相機130,且將照射於所述一部分區域以外的區域的光遮蔽或吸收,藉此以不導引至事件相機130的方式削減。即,可謂將所照射的光的一部分削減的削光部。In this way, the liquid crystal panel and the DMD guide the light irradiated on a predetermined part of the area to the
如以上般,根據本發明的第一實施形態的測量裝置100,使用事件相機130作為攝像元件,並且進而藉由對數放大器來適當捕捉受光量的微小變化,藉由ROI功能及遮光部160來適當調整事件相機130處理的資料量。其結果為,測量裝置100可更適當地對於對象物T高速且高精度地進行測量。As mentioned above, according to the measurement device 100 of the first embodiment of the present invention, the
再者,本實施形態中,光學系統120如圖1及圖9所示,包含分束器121、多個透鏡122~126及多個反射鏡127~129等,但不限定於此。例如,只要可將由光源110投射的光L0分離為測定光L1與參照光L2,最終由事件相機130接收經對象物及反射鏡反射的測定光L1與參照光L2的干涉光,可實現白色干涉方式的測量方法,則可構成任何光學系統。Furthermore, in this embodiment, the
而且,本實施形態中,作為可調整事件相機130處理的資料量的調整部,列舉ROI功能及遮光部160為例,進而對讀出資料的區域、透過區域及遮光區域等的示教進行了說明,但不限定於此。例如亦可以下述方式設定,即:減少事件相機130的畫素數(降低解析度),即便所有畫素中同時發生事件,亦可獲取資料。Furthermore, in this embodiment, the ROI function and the light-shielding
[應用例]
圖10為表示應用本發明的第一實施形態的測量裝置100的測量裝置100A的結構及功能的概要圖。如圖10所示,測量裝置100A包括光源110、光學系統120A、事件相機130及CMOS攝像元件170。再者,圖10中示意性地表示,但測量裝置100A與圖1所示的測量裝置100相比,於追加有CMOS攝像元件170及半反射鏡171A的方面不同。
[Application example]
Fig. 10 is a schematic diagram showing the configuration and functions of a measurement device 100A to which the measurement device 100 according to the first embodiment of the present invention is applied. As shown in FIG. 10 , measurement device 100A includes
測量裝置100A基本上如測量裝置100中所說明,藉由白色干涉方式的測量方法來測量對象物T。事件相機130如測量裝置100中所說明,作為對於對象物T獲取Z軸方向的資料的攝像元件發揮功能。The measurement device 100A basically measures the object T by the white interference measurement method as described in the measurement device 100 . The
進而,測量裝置100A中,CMOS攝像元件170接收經半反射鏡171A反射的光,獲取對象物T的圖像資料。更詳細而言,CMOS攝像元件170作為藉由XY軸平面的測量來獲取對象物T的圖像的攝像元件發揮功能。Furthermore, in the measurement device 100A, the
如上文所述,根據測量裝置100A,藉由使由CMOS攝像元件170所獲取的圖像、與使用事件相機130的白色干涉方式的測量方法融合,從而可對於對象物T利用一個感測器來實現XYZ座標軸的測量。As described above, according to the measurement device 100A, by fusing the image acquired by the
再者,亦可使用事件相機130來實現與CMOS攝像元件170相同的作用。事件相機130探測亮度變化,但亦有不僅輸出亮度變化的極性而且還輸出亮度變化量的類型。此時,藉由進行積分處理,從而可將亮度資訊復原。Furthermore, the
進而,亦可將所述ROI功能及削光部組合使用。可將分割畫面所得的多個ROI區域依次切換而拍攝,並合成而製成一張圖像。Furthermore, it is also possible to use the above-mentioned ROI function and the light cut unit in combination. Multiple ROI regions obtained by dividing the screen can be sequentially switched and photographed, and synthesized to form a single image.
如此,若使用事件相機130來實現與CMOS攝像元件170相同的作用,則無需新設置CMOS攝像元件170,可使結構簡單。In this way, if the
再者,測量裝置100A中,亦可適用測量裝置100中適用的對數放大器、ROI功能及遮光部160等。Furthermore, in the measurement device 100A, the logarithmic amplifier, the ROI function, the
<第二實施形態> 繼而,本發明的第二實施形態中,對下述測量裝置進行說明,該測量裝置使用波長掃描光源作為以使事件相機獲取的受光量變化的方式進行控制的控制機構。再者,本實施形態中,主要對與本發明的第一實施形態不同的結構進行詳細說明,將與第一實施形態共同的事項有關的描述省略或簡化。 <Second Embodiment> Next, in a second embodiment of the present invention, a measurement device using a wavelength-sweeping light source as a control means that controls so as to change the amount of light received by the event camera will be described. In addition, in this embodiment, the structure which differs from 1st Embodiment of this invention mainly is demonstrated in detail, and the description about the item common to 1st Embodiment is abbreviate|omitted or simplified.
圖11為表示本發明的第二實施形態的測量裝置200的結構的概要圖。如圖11所示,測量裝置200包括光源210、光學系統120、事件相機130及處理部140。光學系統120包含分束器121、多個透鏡122~126及多個反射鏡127~129。Fig. 11 is a schematic diagram showing the configuration of a measuring device 200 according to a second embodiment of the present invention. As shown in FIG. 11 , the measuring device 200 includes a
圖1所示的本發明的第一實施形態的測量裝置100中,作為以使事件相機130獲取的受光量變化的方式進行控制的控制機構,包括驅動反射鏡129的驅動部150,藉由使測定光L1的光路長與參照光L2的光路長之差變化從而產生干涉波形,利用白色干涉方式的測量方法來測量對象物T。In the measurement device 100 according to the first embodiment of the present invention shown in FIG. 1 , as a control mechanism that controls the amount of light received by the
本實施形態的測量裝置200中,作為以使事件相機130獲取的受光量變化的方式進行控制的控制機構,將波長掃描光源用作光源210,藉由使自光源210投射的光的波長連續變化從而產生測定光L1與參照光L2的干涉波形,利用被稱為波長掃描方式的測量方法來測量對象物T。In the measurement device 200 of the present embodiment, as the control mechanism that controls the amount of light received by the
光源210例如可使用微機電系統-垂直共振腔面射型雷射(Micro Electro Mechanical Systems-Vertical Cavity Surface Emitting Laser,MEMS-VCSEL)、分布回饋(Distributed feedback,DFB)雷射及超結構光柵分布布拉格反射器(Super Structure Grating-Distributed Bragg reflector,SSG-DBR)雷射等作為波長掃描光源。再者,光源210與第一實施形態的測量裝置100的光源110同樣地,以一定的強度發光,發光強度不變化。The
MEMS-VCSEL藉由利用MEMS來驅動共振鏡,從而使雷射振盪波長變化(波長掃描),DFB雷射藉由使雷射二極體的驅動電流變化從而進行波長掃描,SSGDBR於兩個共振鏡形成有被稱為分布反射器的繞射光柵,藉由注入電流從而進行波長掃描。MEMS-VCSEL uses MEMS to drive the resonant mirror to change the laser oscillation wavelength (wavelength scanning). DFB laser performs wavelength scanning by changing the driving current of the laser diode. SSGDBR uses two resonant mirrors A diffraction grating called a distributed reflector is formed, and wavelength scanning is performed by injecting current.
事件相機130針對藉由使自光源210投射的光的波長變動從而產生的測定光L1與參照光L2的干涉波形L3,與本發明的第一實施形態中所說明同樣地,探測接收的亮度值的變化而獲取資料。The
處理部140基於由事件相機130獲取的干涉波形L3的資料、及自光源210投射的光的波長(頻率)等,測定直至對象物T為止的距離。The
如以上般,根據本發明的第二實施形態的測量裝置200,於使用波長掃描光源作為光源210利用波長掃描方式的測量方法來測量對象物T時,使用事件相機130作為攝像元件,於所排列的各畫素中探測接收的亮度值的變化,並於該探測的時機獲取干涉波形部分的資料,故而可獲取測量直至對象物T為止的距離所需要的資料,並且減少獲取的資料量。As described above, according to the measurement device 200 of the second embodiment of the present invention, when the wavelength scanning light source is used as the
再者,本實施形態的測量裝置200中,亦可適用本發明的第一實施形態的測量裝置100中適用的對數放大器、ROI功能及遮光部160等。Furthermore, the logarithmic amplifier, the ROI function, the
進而,藉由如使用圖10所說明的測量裝置100A般,於本實施形態的測量裝置200中追加包括CMOS攝像元件170等,從而亦可使由CMOS攝像元件170獲取的圖像、與使用事件相機130的波長掃描方式的測量方法融合,藉此對於對象物T利用一個感測器來實現XYZ座標軸的測量。Furthermore, by adding the
以上說明的實施形態是為了使本發明的理解容易,並非用於限定地解釋本發明。實施形態所包括的各要素及其配置、材料、條件、形狀以及尺寸等不限定於例示,可適當變更。而且,可將不同實施形態所示的結構彼此局部地替換或組合。The embodiments described above are for facilitating understanding of the present invention, and are not intended to limitatively interpret the present invention. Each element included in the embodiment and its arrangement, material, condition, shape, size, etc. are not limited to the examples, and can be changed appropriately. Furthermore, the structures shown in different embodiments may be partially replaced or combined with each other.
[附註]
一種測量裝置100、200,測量直至對象物為止的距離,且包括:
光源110、210,投射光;
反射鏡129;
分束器121,將自所述光源所投射的光分割為導向所述對象物的測定光與導向所述反射鏡的參照光;
事件相機130,針對經所述反射鏡反射的參照光與經所述對象物反射的測定光的干涉波形,探測接收的亮度值的變化而獲取資料;
處理部140,基於所述干涉波形的資料來測量直至所述對象物為止的距離;以及
控制機構150,以使所述事件相機獲取的受光量變化的方式進行控制。
[Note]
A measuring device 100, 200 measures a distance to an object and includes:
100、100A、200:測量裝置
110、210:光源
120、120A:光學系統
121:分束器
122~126:透鏡
127~129:反射鏡
130:事件相機
140:處理部
150:驅動部(控制機構)
160:遮光部
170:CMOS攝像元件
171A:半反射鏡
L0~L3:光
T:對象物
100, 100A, 200: measuring
圖1為表示本發明的第一實施形態的測量裝置100的結構的概要圖。
圖2為表示由用作攝像元件的事件相機130獲取資料的狀況的示意圖。
圖3為表示由使用事件相機130作為攝像元件的測量裝置100測量對象物的表面形狀(直至表面為止的距離)的狀況的圖。
圖4為將事件相機130獲取的受光量的變化(增減)設為兩極性來表示,並表示基於該兩極性資料的累計的包絡線的圖。
圖5為表示使用ROI功能作為可調整事件相機130處理的資料量的調整部的一例的圖。
圖6為表示使用事件相機130來示教讀出資料的區域的狀況的一例的圖。
圖7為表示參照圖式資訊來示教讀出資料的區域的狀況的一例的圖。
圖8為表示使用遮光部作為可調整事件相機130處理的資料量的調整部的一例的圖。
圖9為表示於圖1所示的測量裝置100中配置有遮光部的結構的概要圖。
圖10為表示應用本發明的第一實施形態的測量裝置100的測量裝置100A的結構及功能的概要圖。
圖11為表示本發明的第二實施形態的測量裝置200的結構的概要圖。
FIG. 1 is a schematic diagram showing the configuration of a measuring device 100 according to a first embodiment of the present invention.
FIG. 2 is a schematic diagram showing a state of acquiring data by an
100:測量裝置 100: Measuring device
110:光源 110: light source
120:光學系統 120: Optical system
121:分束器 121: beam splitter
122~126:透鏡 122~126: lens
127~129:反射鏡 127~129: Mirror
130:事件相機 130:Event Camera
140:處理部 140: processing department
150:驅動部(控制機構) 150: drive unit (control mechanism)
L0~L3:光 L0~L3: light
T:對象物 T: object
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