TW202234494A - Attachment method film attaching to an annular frame in such a way that the film is hard to be peeled off from the annular frame - Google Patents

Attachment method film attaching to an annular frame in such a way that the film is hard to be peeled off from the annular frame Download PDF

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TW202234494A
TW202234494A TW111106231A TW111106231A TW202234494A TW 202234494 A TW202234494 A TW 202234494A TW 111106231 A TW111106231 A TW 111106231A TW 111106231 A TW111106231 A TW 111106231A TW 202234494 A TW202234494 A TW 202234494A
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adhesive film
film
annular
annular frame
attaching
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TW111106231A
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Chinese (zh)
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木村公
陳曄
波岡伸一
藤澤晋一
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

A film is attached to an annular frame in such a way that the film is hard to be peeled off from the annular frame. Provided is an attachment method, which attaches a film to which a workpiece is attached to an annular frame, and includes: an expansion step, which expands the adhesive film around; a configuration step, which the annular frame is configured to the film in a state that the film has been expanded; a first attaching step, which pushes the film to one side of the annular frame along the inner circumference of the opening, thereby attaching the film to the first annular area of one side; a relaxing step, which relaxes the tension of the expanded film; a second attaching step, which attaches the film to the second annular area located outside the first annular area on one side; and a separation step, which cuts the film into a circular shape along the inner circumference of the opening in a state where the cutting edge has been cut into a predetermined position of the film located further outside than the first annular area, thereby cutting the film into a circular area and a peripheral area.

Description

貼附方法Attachment method

本發明係關於一種將貼附有工件之膠膜貼附於環狀框架之貼附方法。The present invention relates to an attaching method for attaching an adhesive film attached to a workpiece to an annular frame.

以下方法已被實用化：藉由對在正面側形成有多個元件之半導體晶圓等工件照射雷射光束而在工件的內部形成有脆弱的區域（所謂改質層）後，將貼附於工件的背面側之矩形狀的黏著膠膜（以下為膠膜）往四周擴張，藉此將工件分割成多個元件晶片。A method has been put into practice in which a fragile region (so-called modified layer) is formed inside the workpiece by irradiating a workpiece such as a semiconductor wafer with a plurality of elements formed on the front side with a laser beam, and then a The rectangular adhesive film (hereinafter referred to as the adhesive film) on the back side of the workpiece expands around, thereby dividing the workpiece into a plurality of component wafers.

在擴張膠膜之際，使用擴張裝置。例如，擴張裝置係在分別在縱橫長度不同之多個元件晶片之間形成相同程度的間隔時，以在膠膜的縱方向與橫方向擴張量不同之方式進行擴張（例如，參閱專利文獻1）。擴張膠膜後，藉由在工件的外側貼附環狀膠膜，而即使解除由擴張裝置所進行之膠膜的擴張後，仍維持元件晶片間的間隔。 [習知技術文獻] [專利文獻] When expanding the membrane, a dilation device is used. For example, the expansion device expands the film so that the longitudinal and lateral expansion amounts of the film are different when the same degree of space is formed between a plurality of element wafers with different longitudinal and lateral lengths (for example, refer to Patent Document 1). . After expanding the adhesive film, by attaching a ring-shaped adhesive film to the outer side of the workpiece, even after the expansion of the adhesive film by the expanding device is released, the space between the element wafers is still maintained. [Previously known technical literature] [Patent Literature]

[專利文獻1]日本特開2014-22382號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-22382

[發明所欲解決的課題] 但是，在已擴張膠膜之際，與膠膜的基材層同時地，膠膜的黏貼層亦被往四周擴張，因此黏著層的厚度變薄。因此，對於環狀框架之黏著力會隨著時間的經過而降低，最終有膠膜會從環狀框架剝落之問題。 [Problems to be solved by the invention] However, when the adhesive film is expanded, the adhesive layer of the adhesive film is also expanded to the surrounding at the same time as the base material layer of the adhesive film, so that the thickness of the adhesive layer becomes thinner. Therefore, the adhesive force to the ring frame decreases with time, and eventually there is a problem that the adhesive film is peeled off from the ring frame.

本發明係鑑於此問題點而完成者，且目的在於以膠膜難以從環狀框架剝落之方式將膠膜貼附於環狀框架。The present invention is made in view of this problem, and aims to attach the adhesive film to the annular frame in such a manner that the adhesive film is difficult to peel off from the annular frame.

[解決課題的技術手段] 根據本發明的一態樣，提供一種貼附方法，其將貼附有工件之膠膜貼附於環狀框架，且具備：擴張步驟，其將該膠膜往四周擴張；配置步驟，其在已擴張該膠膜之狀態下，以該工件位於該環狀框架的開口部之方式，將該環狀框架配置於該膠膜；第一貼附步驟，其在該配置步驟之後，沿著該開口部的內周圓將該膠膜推壓往該環狀框架的一面，藉此將該膠膜貼附於該一面的第一環狀區域；緩和步驟，其在該第一貼附步驟之後，緩和經擴張之該膠膜的張力；第二貼附步驟，其在該緩和步驟之後，沿著該開口部的內周圓將該膠膜推壓往該環狀框架的該一面，藉此將該膠膜貼附於該一面中之位於該第一環狀區域的外側之第二環狀區域；以及分離步驟，其在該第二貼附步驟之後，在已使切刃切入位於比該第一環狀區域更外側之該膠膜的預定位置之狀態下，沿著該開口部的內周圓將該膠膜切取成圓形，藉此將該膠膜分離成圓形區域與外周區域，所述圓形區域係該工件及該環狀框架成為一體而成，所述外周區域位於該圓形區域的外側。 [Technical means to solve the problem] According to an aspect of the present invention, there is provided an attaching method, which attaches an adhesive film attached to a workpiece to a ring-shaped frame, and includes: an expansion step, which expands the adhesive film around; an arrangement step, which is in the In the state where the adhesive film has been expanded, the annular frame is arranged on the adhesive film in such a way that the workpiece is located at the opening of the annular frame; in the first attaching step, after the disposing step, the annular frame is arranged along the adhesive film. The inner circumference of the opening portion pushes the adhesive film to one side of the annular frame, thereby attaching the adhesive film to the first annular area of the side; the relaxation step is after the first attaching step , relax the tension of the expanded adhesive film; the second attaching step, after the relaxing step, push the adhesive film to the side of the annular frame along the inner circumference of the opening, thereby The adhesive film is attached to the second annular region located on the outer side of the first annular region in the surface; and a separation step, after the second attaching step, after the cutting edge has been cut into In the state of the predetermined position of the adhesive film on the outer side of the first annular area, the adhesive film is cut into a circle along the inner circumference of the opening, thereby separating the adhesive film into a circular area and an outer peripheral area , the circular area is formed by integrating the workpiece and the annular frame, and the outer peripheral area is located outside the circular area.

較佳為，在該分離步驟中，在已使該切刃切入與該第二環狀區域對應之該膠膜的對應區域的外周緣之狀態下，將該膠膜切取成圓形。Preferably, in the separation step, in a state where the cutting edge has been cut into the outer periphery of the corresponding area of the adhesive film corresponding to the second annular area, the adhesive film is cut into a circular shape.

[發明功效] 在本發明的一態樣之貼附方法中，在將膠膜貼附於環狀框架的一面的第一環狀區域之第一貼附步驟後，進行緩和經擴張之膠膜的張力之緩和步驟。藉此，在第一環狀區域的內側保持著膠膜的張力，而在第一環狀區域的外側則緩和膠膜的張力。 [Inventive effect] In the attaching method of one aspect of the present invention, after the first attaching step of attaching the adhesive film to the first annular region on one side of the annular frame, relaxation of the tension of the expanded adhesive film is performed step. Thereby, the tension of the adhesive film is maintained inside the first annular region, and the tension of the adhesive film is relieved outside the first annular region.

然後，在緩和步驟後，進行將膠膜貼附於位於第一環狀區域的外側之第二環狀區域之第二貼附步驟。貼附於第二環狀區域之膠膜的黏著層的厚度，相較於與第一環狀區域對應之區域，其黏著層的厚度更厚，因此可抑制膠膜的黏著力隨時間經過而降低。因此，黏著力穩定發揮，膠膜難以從環狀框架剝落。Then, after the relaxation step, a second attaching step of attaching the adhesive film to the second annular region located outside the first annular region is performed. The thickness of the adhesive layer of the adhesive film attached to the second annular area is thicker than that of the area corresponding to the first annular area, so that the adhesive force of the adhesive film can be suppressed from changing with time. reduce. Therefore, the adhesive force is stably exerted, and the adhesive film is difficult to peel off from the ring frame.

參閱圖式，針對本發明的一態樣之實施方式進行說明。首先，針對本實施方式的貼附方法所使用之擴張裝置2進行說明。圖1係擴張裝置2的立體圖。此外，圖1所示之X軸方向、Y軸方向及Z軸方向（高度方向）互相正交。Referring to the drawings, an embodiment of an aspect of the present invention will be described. First, the expansion device 2 used in the sticking method of the present embodiment will be described. FIG. 1 is a perspective view of the expansion device 2 . In addition, the X-axis direction, the Y-axis direction, and the Z-axis direction (height direction) shown in FIG. 1 are orthogonal to each other.

擴張裝置2具有支撐多個構成要素之基台4。在基台4的中央部設有矩形狀的開口4a。在開口4a的上方配置有圓板狀的卡盤台（保持台）6。卡盤台6具有金屬製的框體。The expansion device 2 has a base 4 that supports a plurality of constituent elements. A rectangular opening 4 a is provided in the center portion of the base 4 . A disk-shaped chuck table (holding table) 6 is arranged above the opening 4a. The chuck table 6 has a metal frame.

在框體形成有圓板狀的凹部，在此凹部固定有圓板狀的多孔質陶瓷。在框體形成有預定的流路（未圖示），在此流路連接有噴射器等吸引源（未圖示）。A disc-shaped concave portion is formed in the frame body, and the disc-shaped porous ceramic is fixed to the concave portion. A predetermined flow path (not shown) is formed in the housing, and a suction source (not shown) such as an ejector is connected to the flow path.

若使吸引源動作，則將負壓傳遞至多孔質陶瓷的上表面。多孔質陶瓷及框體的各上表面發揮作為吸引並保持後述膠膜15之保持面的功能。When the suction source is activated, the negative pressure is transmitted to the upper surface of the porous ceramic. Each upper surface of the porous ceramics and the frame functions as a holding surface for attracting and holding the adhesive film 15 to be described later.

在卡盤台6的側部設有四個夾具機構（未圖示）。四個夾具機構係沿著卡盤台6的圓周方向大致等間隔地配置，並以消除膠膜15的鬆弛之程度拉伸膠膜15的四角。Four clamp mechanisms (not shown) are provided on the side of the chuck table 6 . The four clamp mechanisms are arranged at approximately equal intervals along the circumferential direction of the chuck table 6 , and stretch the four corners of the adhesive film 15 to the extent that the slack of the adhesive film 15 is eliminated.

在卡盤台6的下部連結有能在上下方向升降之圓柱形的升降單元8。升降單元8係以通過開口4a之方式使卡盤台6升降。To the lower part of the chuck table 6, a cylindrical lift unit 8 which can be raised and lowered in the vertical direction is connected. The lift unit 8 lifts and lowers the chuck table 6 so as to pass through the opening 4a.

在升降單元8的下部設有直徑大於升降單元8之圓板狀的支撐板（未圖示）。支撐板被配置成與升降單元8呈同心圓狀。在此支撐板的下部設有馬達等旋轉驅動源（未圖示）。A disk-shaped support plate (not shown) having a diameter larger than that of the elevating unit 8 is provided at the lower part of the elevating unit 8 . The support plate is arranged concentrically with the elevating unit 8 . A rotational drive source (not shown) such as a motor is provided below the support plate.

旋轉驅動源被配置於基台4的下方之移動板（未圖示）所支撐。移動板係能滑動地安裝於沿著預定的方向所配置之一對導軌（未圖示）。移動板的下表面側設有螺帽部（未圖示）。The rotational drive source is supported by a moving plate (not shown) arranged below the base 4 . The moving plate is slidably attached to a pair of guide rails (not shown) arranged along a predetermined direction. A nut portion (not shown) is provided on the lower surface side of the moving plate.

與導軌大致平行地配置之滾珠螺桿（未圖示）能旋轉地連結於螺帽部。在滾珠螺桿的一端部連結有馬達（未圖示）。移動板、一對導軌、滾珠螺桿、馬達等構成使卡盤台6在水平方向（例如X軸方向）移動之移動機構。A ball screw (not shown) arranged substantially parallel to the guide rail is rotatably coupled to the nut portion. A motor (not shown) is connected to one end of the ball screw. A moving plate, a pair of guide rails, a ball screw, a motor, and the like constitute a moving mechanism for moving the chuck table 6 in the horizontal direction (eg, the X-axis direction).

在支撐於支撐板之態樣，在卡盤台6的側部設有第一輥10（參閱圖5（A））、第二輥12（參閱圖7（A））及切刃14（參閱圖8）。A first roller 10 (refer to FIG. 5(A) ), a second roller 12 (refer to FIG. 7(A) ), and a cutting edge 14 (refer to Figure 8).

第一輥10設於氣缸10a的上端部（參閱圖5（A））。第一輥10具有較小的寬度（圓筒的長度）。第一輥10例如具有與後述的環狀框架17的徑向的寬度（亦即，外徑與內徑的差）的1/9～1/7左右對應之寬度。The 1st roller 10 is provided in the upper end part of the cylinder 10a (refer FIG.5(A)). The first roll 10 has a smaller width (the length of the cylinder). The first roller 10 has, for example, a width corresponding to about 1/9 to 1/7 of the radial width (that is, the difference between the outer diameter and the inner diameter) of the annular frame 17 described later.

同樣地，第二輥12設於氣缸12a的上端部（參閱圖7（A））。第二輥12具有較大的寬度。第二輥12例如具有與環狀框架17的徑向的寬度的6/7～8/9左右對應之寬度。並且，切刃14設於氣缸14a的上端部（參閱圖8）。Similarly, the 2nd roller 12 is provided in the upper end part of the cylinder 12a (refer FIG.7(A)). The second roll 12 has a larger width. The second roller 12 has, for example, a width corresponding to about 6/7 to 8/9 of the radial width of the annular frame 17 . Moreover, the cutting edge 14 is provided in the upper end part of the air cylinder 14a (refer FIG. 8).

氣缸10a、12a、14a配置於支撐板的外周部。若使旋轉驅動源動作，則第一輥10、第二輥12及切刃14與卡盤台6一起繞著升降單元8旋轉。The cylinders 10a, 12a, and 14a are arranged on the outer peripheral portion of the support plate. When the rotational drive source is actuated, the first roller 10 , the second roller 12 , and the cutting blade 14 rotate around the lift unit 8 together with the chuck table 6 .

在基台4的上方，在X軸方向的一端部設有第一夾持單元20a。第一夾持單元20a具有移動板22。移動板22具有突出部22a，所述突出部22a能滑動地嵌合在設於基台4之引導槽4b。Above the base 4, a first clamping unit 20a is provided at one end in the X-axis direction. The first clamping unit 20a has a moving plate 22 . The moving plate 22 has a protruding portion 22 a that is slidably fitted in a guide groove 4 b provided on the base 4 .

在移動板22設有滾珠螺桿24貫通之貫通孔，此滾珠螺桿24能旋轉地連結至設於移動板22的下表面之螺帽部（未圖示）。The moving plate 22 is provided with a through hole through which the ball screw 24 passes, and the ball screw 24 is rotatably connected to a nut portion (not shown) provided on the lower surface of the moving plate 22 .

在滾珠螺桿24的一端部設有脈衝馬達26。若使脈衝馬達26在預定方向旋轉，則移動板22會靠近開口4a，若使脈衝馬達26在預定方向的相反方向旋轉，則移動板22會從開口4a遠離。A pulse motor 26 is provided at one end of the ball screw 24 . When the pulse motor 26 is rotated in a predetermined direction, the moving plate 22 approaches the opening 4a, and when the pulse motor 26 is rotated in a direction opposite to the predetermined direction, the moving plate 22 moves away from the opening 4a.

在移動板22的一端部設有在Z軸方向延伸之支撐柱28。在支撐柱28的開口4a側的一側面形成有凸部30。上側臂32及下側臂42的各凹部能滑動地嵌合於凸部30。A support column 28 extending in the Z-axis direction is provided at one end of the moving plate 22 . A convex portion 30 is formed on one side surface of the support column 28 on the side of the opening 4a. Each of the concave portions of the upper arm 32 and the lower arm 42 is slidably fitted to the convex portion 30 .

在上側臂32的基端部設有螺帽部34。螺帽部34係通過設於凸部30之開口而位於支撐柱28的另一面側。與Z軸方向大致平行地配置之導軌36能旋轉地連結於螺帽部34。The base end portion of the upper arm 32 is provided with a nut portion 34 . The nut portion 34 is located on the other surface side of the support column 28 through the opening provided in the convex portion 30 . A guide rail 36 arranged substantially parallel to the Z-axis direction is rotatably coupled to the nut portion 34 .

在滾珠螺桿36的上端部連結有脈衝馬達38。若使脈衝馬達38在預定方向旋轉，則上側臂32會往下方移動，若使脈衝馬達38在預定方向的相反方向旋轉，則上側臂32會往上方移動。A pulse motor 38 is connected to the upper end of the ball screw 36 . When the pulse motor 38 is rotated in a predetermined direction, the upper arm 32 moves downward, and when the pulse motor 38 is rotated in a direction opposite to the predetermined direction, the upper arm 32 moves upward.

在上側臂32的前端部設有長方體形狀的上側夾持部32a，所述上側夾持部32a於水平方向中在與上側臂32的長邊方向正交之方向具有長邊部。在上側夾持部32a設有沿著其長邊方向之各為圓柱狀的多個滾輪（未圖示）。各滾輪的旋轉軸被配置成與上側臂32的長邊方向大致平行。A rectangular parallelepiped-shaped upper holding portion 32 a is provided at the front end of the upper arm 32 , and the upper holding portion 32 a has a long side in a direction orthogonal to the long side direction of the upper arm 32 in the horizontal direction. The upper clamping part 32a is provided with a plurality of rollers (not shown) each having a cylindrical shape along the longitudinal direction thereof. The rotation axis of each roller is arranged substantially parallel to the longitudinal direction of the upper arm 32 .

在下側臂42的基端部設有螺帽部44。螺帽部44係通過設於凸部30之開口而位於支撐柱28的另一面側。與Z軸方向大致平行地設置之滾珠螺桿46能旋轉地連結於螺帽部34。The base end portion of the lower arm 42 is provided with a nut portion 44 . The nut portion 44 is located on the other surface side of the support column 28 through the opening provided in the convex portion 30 . A ball screw 46 provided substantially parallel to the Z-axis direction is rotatably coupled to the nut portion 34 .

在滾珠螺桿46的下端部連結有脈衝馬達48。若使脈衝馬達48在預定方向旋轉，則下側臂42往上方移動，若使脈衝馬達48在預定方向的相反方向旋轉，則下側臂42往下方移動。A pulse motor 48 is connected to the lower end of the ball screw 46 . When the pulse motor 48 is rotated in a predetermined direction, the lower arm 42 moves upward, and when the pulse motor 48 is rotated in a direction opposite to the predetermined direction, the lower arm 42 moves downward.

在上側臂42的前端部設有長方體形狀的下側夾持部42a，所述下側夾持部42a於水平方向中在與下側臂42的長邊方向正交之方向具有長邊部。在下側夾持部42a設有沿著其長邊方向之各為圓柱狀的多個滾輪42b。各滾輪42b的旋轉軸被配置成與下側臂42的長邊部大致平行。A rectangular parallelepiped-shaped lower gripping portion 42 a is provided at the front end of the upper arm 42 , and the lower gripping portion 42 a has a long side in a direction orthogonal to the longitudinal direction of the lower arm 42 in the horizontal direction. A plurality of rollers 42b each having a cylindrical shape along the longitudinal direction thereof are provided on the lower clamping portion 42a. The rotation axis of each roller 42b is arranged so as to be substantially parallel to the long side of the lower arm 42 .

在相對於開口4a之第一夾持單元20a的相反側設有第二夾持單元20b。第二夾持單元20b的構造與第一夾持單元20a大致相同。第一夾持單元20a及第二夾持單元20b具有將膠膜15往X軸方向擴張之功能。A second holding unit 20b is provided on the opposite side of the first holding unit 20a with respect to the opening 4a. The configuration of the second clamping unit 20b is substantially the same as that of the first clamping unit 20a. The first clamping unit 20a and the second clamping unit 20b have the function of expanding the adhesive film 15 in the X-axis direction.

同樣地，以在Y軸方向將開口4a夾在中間之方式，設有第三夾持單元20c及第四夾持單元20d。第三夾持單元20c及第四夾持單元20d分別具有與第一夾持單元20a大致相同之構造，並具有將膠膜15往Y軸方向擴張之功能。Similarly, the third holding unit 20c and the fourth holding unit 20d are provided so as to sandwich the opening 4a in the Y-axis direction. The third clamping unit 20c and the fourth clamping unit 20d have substantially the same structure as the first clamping unit 20a, respectively, and have the function of expanding the adhesive film 15 in the Y-axis direction.

接著，參閱圖2至圖8，針對將貼附有工件11之膠膜15（參閱圖3等）貼附於環狀框架17（參閱圖4等）之貼附方法進行說明。圖2係貼附方法的流程圖。Next, referring to FIGS. 2 to 8 , a description will be given of a method of attaching the adhesive film 15 (see FIG. 3 , etc.) to which the workpiece 11 is attached to the annular frame 17 (see FIG. 4 , etc.). Figure 2 is a flow chart of the attaching method.

本實施方式的工件11係在正面側形成有IC（Integrated Circuit，積體電路）等元件之半導體晶圓。但是，工件11係沿著分割預定線形成改質層，更在之後研削背面側。The workpiece 11 of the present embodiment is a semiconductor wafer in which elements such as ICs (Integrated Circuits) are formed on the front side. However, in the workpiece 11, the modified layer is formed along the line to be divided, and the back side is ground afterward.

具體而言，在工件11的正面側已貼附保護膠膜（未圖示）之狀態下，對工件11依序進行改質層的形成、背面側的研削，藉此裂痕會以改質層為起點到達工件11的正面及背面。Specifically, in a state where a protective film (not shown) has been attached to the front side of the workpiece 11 , the workpiece 11 is sequentially formed with a modified layer and ground on the back side, so that cracks can be formed by the modified layer. It reaches the front and back of the workpiece 11 as a starting point.

研削後，在已將工件11的正面側吸引保持於卡盤台6之狀態下，在工件11的背面側貼附有樹脂製的膠膜15。膠膜15具有層積構造，所述層積構造具有基材層與設於基材層的一面之黏著層（糊層）。After grinding, in a state where the front side of the workpiece 11 is sucked and held by the chuck table 6 , the resin film 15 is attached to the back side of the workpiece 11 . The adhesive film 15 has a laminated structure including a base material layer and an adhesive layer (paste layer) provided on one surface of the base material layer.

基材層例如係以聚烯烴、聚氯乙烯、聚對苯二甲酸乙二醇酯等樹脂所構成，黏著層例如係以丙烯酸系、聚矽氧系、橡膠系或丙烯酸系的黏著劑所形成。The base layer is made of resin such as polyolefin, polyvinyl chloride, polyethylene terephthalate, for example, and the adhesive layer is made of acrylic, polysiloxane, rubber, or acrylic adhesive, for example. .

貼附膠膜15後，在以設於卡盤台6的四周之夾具機構夾持膠膜15的四角而消除膠膜15的鬆弛之狀態下，以未圖示的剝離機構從工件11的正面側剝離保護膠膜。After the adhesive film 15 is attached, in a state where the four corners of the adhesive film 15 are clamped by the clamp mechanism arranged around the chuck table 6 to eliminate the slack of the adhesive film 15, the unillustrated peeling mechanism is used to remove the workpiece from the front surface of the workpiece 11. Side peel protective film.

之後，藉由移動機構而使卡盤台6往開口4a的下方移動，再進一步藉由升降單元8而使卡盤台6上升至與第一挾持單元20a等大致相同的高度為止。After that, the chuck table 6 is moved below the opening 4a by the moving mechanism, and the chuck table 6 is further raised by the elevating unit 8 to approximately the same height as the first clamping unit 20a and the like.

接著，藉由第一夾持單元20a、第二夾持單元20b、第三夾持單元20c及第四夾持單元20d夾持膠膜15的四邊後，解除夾具機構。藉此，工件11及膠膜15的層積體被轉移至擴張裝置2。Next, after the four sides of the adhesive film 15 are clamped by the first clamping unit 20a, the second clamping unit 20b, the third clamping unit 20c and the fourth clamping unit 20d, the clamp mechanism is released. Thereby, the laminate of the workpiece 11 and the adhesive film 15 is transferred to the expansion device 2 .

在此狀態下，首先，使第一夾持單元20a及第二夾持單元20b以從開口4a遠離之方式，沿著X軸方向僅移動預定距離（例如10mm）。接著，使第三夾持單元20c及第四夾持單元20d以從開口4a遠離之方式，沿著Y軸方向僅移動預定距離（例如10mm）。In this state, first, the first holding unit 20a and the second holding unit 20b are moved only a predetermined distance (for example, 10 mm) along the X-axis direction so as to be separated from the opening 4a. Next, the third holding unit 20c and the fourth holding unit 20d are moved only a predetermined distance (for example, 10 mm) along the Y-axis direction so as to be separated from the opening 4a.

如此進行，將膠膜15往四周擴張（擴張步驟10）。圖3係表示擴張步驟S10之圖。此外，在圖3之後的圖式中，省略第三夾持單元20c及第四夾持單元20d。In this way, the adhesive film 15 is expanded around (expansion step 10 ). FIG. 3 is a diagram showing the expansion step S10. In addition, in the figures after FIG. 3, the 3rd clamping unit 20c and the 4th clamping unit 20d are abbreviate|omitted.

然而，在擴張步驟S10中，亦可在沿著Y軸方向擴張膠膜15後，沿著X軸方向擴張膠膜15。並且，X軸方向的膠膜15的擴張量與Y軸方向的膠膜15的擴張量可因應元件晶片13的形狀而適當調整。However, in the expanding step S10 , after expanding the adhesive film 15 along the Y-axis direction, the adhesive film 15 may also be expanded along the X-axis direction. In addition, the expansion amount of the adhesive film 15 in the X-axis direction and the expansion amount of the adhesive film 15 in the Y-axis direction can be appropriately adjusted according to the shape of the element wafer 13 .

擴張步驟S10之後，維持著已擴張膠膜15之狀態，將環狀框架17配置於膠膜15的黏著層側（配置步驟S20）。圖4係表示配置步驟S20之圖。After the expansion step S10 , the annular frame 17 is disposed on the adhesive layer side of the adhesive film 15 while maintaining the expanded state of the adhesive film 15 (arranging step S20 ). FIG. 4 is a diagram showing the configuration step S20.

在本實施方式中，以圓板狀的吸附單元50吸引保持金屬製的環狀框架17的上表面17a側並進行搬送，以工件11位於環狀框架17的開口部17b之方式，將環狀框架17配置於膠膜15上。In the present embodiment, the upper surface 17 a side of the metal ring frame 17 is sucked and held by the disk-shaped suction unit 50 and conveyed, and the workpiece 11 is placed in the opening 17 b of the ring frame 17 . The frame 17 is disposed on the adhesive film 15 .

但是，在配置步驟S20中，較佳為將環狀框架17從膠膜15僅分離微小距離（數mm。例如1mm至3mm）。藉此，在後述的緩和步驟S40中，膠膜15可與其黏著層一起順利地收縮。However, in the arrangement step S20, it is preferable to separate the annular frame 17 from the adhesive film 15 by only a small distance (several mm. For example, 1 mm to 3 mm). Thereby, in the relaxation step S40 described later, the adhesive film 15 can be smoothly shrunk together with the adhesive layer.

配置步驟S20之後，如圖5（A）所示般，繼續維持著已擴張膠膜15之狀態，使第一輥10上升至比卡盤台6更上方。此時，第一輥10推壓環狀框架17的下表面（一面）17c中之開口部17c的內周圓附近的一部分。After the arrangement step S20 , as shown in FIG. 5(A) , the state of the expanded film 15 is continued, and the first roller 10 is raised above the chuck table 6 . At this time, the first roller 10 presses a part of the vicinity of the inner circumference of the opening portion 17 c in the lower surface (one surface) 17 c of the annular frame 17 .

在此狀態下，藉由使支柱16旋轉，而沿著開口部17b的內周圓以第一輥10推壓膠膜15，將膠膜15貼附於第一環狀區域17c 1，所述第一環狀區域17c 1位於下表面17c中之開口部17b的內周圓附近（第一貼附步驟S30）。 In this state, by rotating the support 16, the adhesive film 15 is pressed by the first roller 10 along the inner circumference of the opening 17b, and the adhesive film 15 is attached to the first annular region 17c 1 . The first annular region 17c 1 is located near the inner circumference of the opening 17b in the lower surface 17c (first attaching step S30).

圖5（A）係表示第一貼附步驟S30之圖。第一環狀區域17c 1被設定成從開口部17b的內周圓起至環狀框架17的寬度的1/9～1/7左右為止的範圍。例如，第一環狀區域17c 1係具有從開口部17b的內周圓起至2mm～3mm左右的寬度之區域。 FIG. 5(A) is a diagram showing the first attaching step S30. The first annular region 17c 1 is set in a range from the inner circumference of the opening 17b to about 1/9 to 1/7 of the width of the annular frame 17 . For example, the first annular region 17c 1 is a region having a width of about 2 mm to 3 mm from the inner circumference of the opening 17b.

藉由第一貼附步驟S30，工件11、膠膜15及環狀框架17被一體化而形成工件單元19。圖5（B）係工件單元19的俯視圖。此外，在圖5（B）中，以虛線表示第一環狀區域17c 1的外周緣。 Through the first attaching step S30 , the workpiece 11 , the adhesive film 15 and the annular frame 17 are integrated to form the workpiece unit 19 . FIG. 5(B) is a plan view of the workpiece unit 19 . In addition, in FIG.5(B), the outer peripheral edge of the 1st annular area|region 17c1 is shown by a broken line.

但是，在第一環狀區域17c 1中，因貼附有黏著層也會與基材層一起被擴張之膠膜15，故隨時間經過，對環狀框架17之黏著力會下降，而有膠膜15從環狀框架17剝落之疑慮。 However, in the first annular region 17c1, since the adhesive film 15, which is also expanded together with the base material layer, is attached, the adhesive force to the annular frame 17 decreases over time, and there are Doubt that the adhesive film 15 is peeled off from the ring frame 17 .

於是，在本實施方式中，在第一貼附步驟S30後，藉由使膠膜15的張力（亦即，拉力）緩和，而使膠膜15某程度地收縮（緩和步驟S40）。圖6係表示緩和步驟S40之圖。Therefore, in the present embodiment, after the first attaching step S30 , the adhesive film 15 is shrunk to a certain extent by relaxing the tension (ie, the pulling force) of the adhesive film 15 (alleviation step S40 ). FIG. 6 is a diagram showing the alleviation step S40.

在緩和步驟S40中，使第一夾持單元20a至第四夾持單元20d的每一個以接近開口4a之方式僅移動擴張步驟S10的移動距離的大約一半左右（例如5mm）。In the relaxation step S40, each of the first to fourth gripping units 20a to 20d is moved only about half (eg, 5 mm) of the moving distance of the expanding step S10 so as to approach the opening 4a.

緩和步驟S40之後，使用第二棍12，將經緩和張力之區域貼附於環狀框架17的下表面17c（第二貼附步驟S50）。圖7（A）係表示第二貼附步驟S50之圖。After the relaxation step S40, the tension-relieved area is attached to the lower surface 17c of the annular frame 17 using the second stick 12 (second attachment step S50). FIG. 7(A) is a diagram showing the second attaching step S50.

在第二貼附步驟S50中，使第一輥10下降，取而代之，使寬度大於第一輥10之第二輥12上升至較卡盤台6更上方，以第二輥12推壓比第一環狀區域17c 1更外側的區域。 In the second attaching step S50 , the first roller 10 is lowered, and instead, the second roller 12 with a width larger than the first roller 10 is raised to be higher than the chuck table 6 , and the second roller 12 is pushed more than the first roller 12 . The region further outside the annular region 17c 1 .

在已將第二輥12按壓至膠膜15之狀態下使支柱16旋轉，藉此沿著開口部17b的內周圓以第二輥12推壓膠膜15。藉此，將膠膜15貼附於第二環狀框架17c 2，所述第二環狀框架17c 2位於比環狀框架17中之第一環狀框架17c 1更外側。 The support 16 is rotated in a state where the second roller 12 has been pressed against the adhesive film 15, whereby the adhesive film 15 is pressed by the second roller 12 along the inner circumference of the opening portion 17b. Thereby, the adhesive film 15 is attached to the second annular frame 17c 2 , the second annular frame 17c 2 is located outside of the first annular frame 17c 1 of the annular frames 17 .

此外，在第二貼附步驟S50中，可以第二輥12推壓下表面17c整體，亦可僅推壓比第一環狀區域17c 1更外側。圖7（B）係第二貼附步驟S50後的工件單元19的俯視圖。在圖7（B）中，以虛線表示第二環狀區域17c 2的外周緣。 In addition, in the 2nd sticking step S50, the whole lower surface 17c may be pressed by the 2nd roller 12, and only the outer side than the 1st annular area 17c1 may be pressed. FIG. 7(B) is a plan view of the workpiece unit 19 after the second attaching step S50. In FIG. 7(B) , the outer peripheral edge of the second annular region 17c 2 is indicated by a broken line.

在貼附於第二環狀區域17c 2之膠膜15的對應區域15a（參閱圖7（A））中，相較於與第一環狀區域17c 1對應之膠膜15的區域，其黏著層更厚，因此可抑制膠膜15的黏著力隨時間經過而降低。因此，膠膜15的黏著力穩定發揮，膠膜15變得難以從環狀框架17剝落。 In the corresponding area 15a (see FIG. 7(A) ) of the adhesive film 15 attached to the second annular area 17c 2 , compared with the area of the adhesive film 15 corresponding to the first annular area 17c 1 , its adhesion The layer is thicker, so that the adhesive force of the adhesive film 15 can be suppressed from decreasing over time. Therefore, the adhesive force of the adhesive film 15 is stably exerted, and the adhesive film 15 becomes difficult to peel off from the annular frame 17 .

第二貼附步驟S50之後，將膠膜15切取成圓形，並分離成圓形區域15b與位於圓形區域15b的外側之外周區域15c（分離步驟S60）。圖8係表示分離步驟S60之圖。After the second attaching step S50 , the adhesive film 15 is cut into a circle and separated into a circular area 15b and an outer peripheral area 15c located outside the circular area 15b (separation step S60 ). FIG. 8 is a diagram showing the separation step S60.

在分離步驟S60中，使第二輥12下降，取而代之，使切刃14上升至較卡盤台6更上方。然後，將切刃14切入位於比第一環狀區域17c 1更外側之膠膜15的預定位置，並使支柱16旋轉。 In the separation step S60 , the second roller 12 is lowered, and the cutting edge 14 is raised above the chuck table 6 instead. Then, the cutting edge 14 is cut into a predetermined position of the adhesive film 15 located outside the first annular region 17c 1 , and the support column 16 is rotated.

在本實施方式中，在已將切刃14切入膠膜15的對應區域15a的外周緣之狀態下使支柱16旋轉，而沿著開口部17b的內周圓將膠膜15切取成圓形。藉此，將膠膜15分離成圓形區域15b與外周區域15c。In this embodiment, the support 16 is rotated while the cutting edge 14 has been cut into the outer periphery of the corresponding region 15a of the adhesive film 15, and the adhesive film 15 is cut into a circular shape along the inner periphery of the opening 17b. Thereby, the adhesive film 15 is separated into a circular area 15b and an outer peripheral area 15c.

藉由以對應區域15a的外周緣為邊界切取膠膜15，而可使貼附於第二環狀區域17c 2之膠膜15的對應區域15a大致全部留下。因此，例如，相較於在第二環狀區域17c 2的寬度方向的大約一半的位置切取膠膜15之情形，膠膜15變得難以從環狀框架17剝落。 By cutting the adhesive film 15 with the outer periphery of the corresponding area 15a as the boundary, substantially all the corresponding area 15a of the adhesive film 15 attached to the second annular area 17c 2 can be left. Therefore, for example, the adhesive film 15 becomes difficult to peel off from the annular frame 17 compared to the case where the adhesive film 15 is cut at a position about half of the width direction of the second annular region 17c 2 .

分離步驟S60之後，透過膠膜15的圓形區域15b而以環狀框架17支撐有工件11之工件單元19係藉由吸附單元50而被搬送至其他處理區域，實施下一個步驟的處理。After the separation step S60, the workpiece unit 19 supporting the workpiece 11 by the annular frame 17 through the circular area 15b of the adhesive film 15 is transported to another processing area by the suction unit 50, and the processing of the next step is performed.

在本實施方式中，因與第二環狀區域17c 2對應之膠膜15的對應區域15a的黏著層比與第一環狀區域17c 1對應之膠膜15的區域的黏著層更厚，故可抑制膠膜15的黏著力隨時間經過而降低。因此，膠膜15的黏著力穩定發揮，膠膜15變得難以從環狀框架17剝落。 In this embodiment, since the adhesive layer of the corresponding region 15a of the adhesive film 15 corresponding to the second annular region 17c2 is thicker than the adhesive layer of the region of the adhesive film 15 corresponding to the first annular region 17c1, so The adhesive force of the adhesive film 15 can be suppressed from decreasing with time. Therefore, the adhesive force of the adhesive film 15 is stably exerted, and the adhesive film 15 becomes difficult to peel off from the annular frame 17 .

另外，上述實施方式之構造、方法等，在不脫離本發明的目的之範圍內可進行適當變更並實施。例如，可使用旋切刀的切刃作為切刃14。In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed and implemented in the range which does not deviate from the objective of this invention. For example, the cutting edge of a rotary cutter can be used as the cutting edge 14 .

並且，在第二貼附步驟S50中，可將貼附有膠膜15之下表面17c的範圍的外徑擴張至與環狀框架17的外周部的直線部分對應之位置為止。如此，第二環狀區域17c 2的直徑愈大，愈可確保膠膜15的黏著力。 Furthermore, in the second attaching step S50 , the outer diameter of the range where the lower surface 17 c of the adhesive film 15 is attached can be expanded to a position corresponding to the linear portion of the outer peripheral portion of the annular frame 17 . In this way, the larger the diameter of the second annular region 17c 2 is, the better the adhesive force of the adhesive film 15 can be ensured.

2:擴張裝置 4:基台 4a:開口 4b:引導槽 6:卡盤台（保持台） 8:升降單元 10:第一輥 12:第二輥 14:切刃 10a,12a,14a:氣缸 16:支柱 11:工件 13:元件晶片 15:膠膜 15a:對應區域 15b:圓形區域 15c:外周區域 17:環狀框架 17a:上表面 17b:開口部 17c:下表面（一面） 17c 1:第一環狀區域 17c 2:第二環狀區域 19:工件單元 20a:第一夾持單元 20b:第二夾持單元 20c:第三夾持單元 20d:第四夾持單元 22:移動板 22a:突出部 24:滾珠螺桿 26:脈衝馬達 28:支撐柱 30:凸部 32:上側臂 32a:上側夾持部 34:螺帽部 36:滾珠螺桿 38:脈衝馬達 42:下側臂 42a:下側夾持部 42b:滾輪 44:螺帽部 46:滾珠螺桿 48:脈衝馬達 50:吸附單元 2: Expansion device 4: Base 4a: Opening 4b: Guide groove 6: Chuck table (holding table) 8: Elevating unit 10: First roller 12: Second roller 14: Cutting edges 10a, 12a, 14a: Air cylinder 16 : Support 11 : Work 13 : Element wafer 15 : Adhesive film 15a : Corresponding area 15b : Circular area 15c : Outer peripheral area 17 : Ring frame 17a : Upper surface 17b : Opening 17c : Lower surface (one side) 17c 1 : First An annular area 17c 2 : second annular area 19 : workpiece unit 20a : first clamping unit 20b : second clamping unit 20c : third clamping unit 20d : fourth clamping unit 22 : moving plate 22a : Protruding part 24: Ball screw 26: Pulse motor 28: Support column 30: Protruding part 32: Upper arm 32a: Upper clamping part 34: Nut part 36: Ball screw 38: Pulse motor 42: Lower arm 42a: Lower side Grip part 42b: Roller 44: Nut part 46: Ball screw 48: Pulse motor 50: Adsorption unit

圖1係擴張裝置的立體圖。 圖2係貼附方法的流程圖。 圖3係表示擴張步驟之圖。 圖4係表示配置步驟之圖。 圖5（A）係表示第一貼附步驟之圖，圖5（B）係工件單元的俯視圖。 圖6係表示緩和步驟之圖。 圖7（A）係表示第二貼附步驟之圖，圖7（B）係工件單元的俯視圖。 圖8係表示分離步驟之圖。 Figure 1 is a perspective view of an expansion device. Figure 2 is a flow chart of the attaching method. FIG. 3 is a diagram showing the expansion step. FIG. 4 is a diagram showing the arrangement steps. FIG. 5(A) is a diagram showing the first attaching step, and FIG. 5(B) is a plan view of the workpiece unit. FIG. 6 is a diagram showing a relaxation step. FIG. 7(A) is a diagram showing the second attaching step, and FIG. 7(B) is a plan view of the workpiece unit. Fig. 8 is a diagram showing the separation step.

11:工件 11: Workpiece

12:第二輥 12: Second roll

12a:氣缸 12a: Cylinder

13:元件晶片 13: Component wafer

15:膠膜 15: Adhesive film

15a:對應區域 15a: Corresponding area

16:支柱 16: Pillars

17:環狀框架 17: Ring Frame

17a:上表面 17a: Upper surface

17b:開口部 17b: Opening

17c:下表面(一面) 17c: Lower surface (one side)

17c1:第一環狀區域 17c 1 : the first annular region

17c2:第二環狀區域 17c 2 : Second annular region

19:工件單元 19: Workpiece unit

20a:第一夾持單元 20a: The first clamping unit

20b:第二夾持單元 20b: Second clamping unit

32a:上側夾持部 32a: Upper clamping part

42a:下側夾持部 42a: Lower clamping part

50:吸附單元 50: Adsorption unit

Claims (2)

一種貼附方法，其將貼附有工件之膠膜貼附於環狀框架，且特徵在於，具備： 擴張步驟，其將該膠膜往四周擴張； 配置步驟，其在已擴張該膠膜之狀態下，以該工件位於該環狀框架的開口部之方式，將該環狀框架配置於該膠膜； 第一貼附步驟，其在該配置步驟之後，沿著該開口部的內周圓將該膠膜推壓往該環狀框架的一面，藉此將該膠膜貼附於該一面的第一環狀區域； 緩和步驟，其在該第一貼附步驟之後，緩和經擴張之該膠膜的張力； 第二貼附步驟，其在該緩和步驟之後，沿著該開口部的內周圓將該膠膜推壓往該環狀框架的該一面，藉此將該膠膜貼附於該一面中之位於該第一環狀區域的外側之第二環狀區域；以及 分離步驟，其在該第二貼附步驟之後，在已使切刃切入位於比該第一環狀區域更外側之該膠膜的預定位置之狀態下，沿著該開口部的內周圓將該膠膜切取成圓形，藉此將該膠膜分離成圓形區域與外周區域，該圓形區域係該工件及該環狀框架成為一體而成，該外周區域位於該圓形區域的外側。 An attaching method, which attaches an adhesive film attached to a workpiece to a ring-shaped frame, and is characterized in that it has: an expansion step, which expands the film around; an arranging step of disposing the annular frame on the adhesive film in such a way that the workpiece is located at the opening of the annular frame in a state where the adhesive film has been expanded; The first attaching step, after the arranging step, pushes the adhesive film to one side of the annular frame along the inner circumference of the opening, thereby attaching the adhesive film to the first side of the side. annular area; an alleviation step, after the first attaching step, alleviating the tension of the expanded adhesive film; In the second attaching step, after the relaxation step, the adhesive film is pressed to the one side of the annular frame along the inner circumference of the opening, thereby attaching the adhesive film to one of the sides. a second annular region located outside the first annular region; and The separation step, after the second attaching step, in a state where the cutting edge has been cut into the predetermined position of the adhesive film located outside the first annular region, along the inner circumference of the opening portion. The adhesive film is cut into a circle, whereby the adhesive film is separated into a circular area and a peripheral area. The circular area is formed by integrating the workpiece and the annular frame, and the peripheral area is located outside the circular area. . 如請求項1之貼附方法，其中，在該分離步驟中，在已使該切刃切入與該第二環狀區域對應之該膠膜的對應區域的外周緣之狀態下，將該膠膜切取成圓形。The attaching method of claim 1, wherein, in the separating step, in a state where the cutting edge has been cut into the outer periphery of the corresponding area of the adhesive film corresponding to the second annular area, the adhesive film is Cut into circles.
TW111106231A 2021-02-24 2022-02-21 Attachment method film attaching to an annular frame in such a way that the film is hard to be peeled off from the annular frame TW202234494A (en)

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