TW202233780A - adhesive sheet - Google Patents
adhesive sheet Download PDFInfo
- Publication number
- TW202233780A TW202233780A TW111117102A TW111117102A TW202233780A TW 202233780 A TW202233780 A TW 202233780A TW 111117102 A TW111117102 A TW 111117102A TW 111117102 A TW111117102 A TW 111117102A TW 202233780 A TW202233780 A TW 202233780A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive sheet
- layer
- adhesive
- gas generating
- generating layer
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 308
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 297
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims abstract description 45
- 239000010410 layer Substances 0.000 claims description 380
- 239000012790 adhesive layer Substances 0.000 claims description 105
- 238000000034 method Methods 0.000 claims description 29
- 239000004215 Carbon black (E152) Substances 0.000 claims description 26
- 229930195733 hydrocarbon Natural products 0.000 claims description 26
- 150000002430 hydrocarbons Chemical class 0.000 claims description 24
- 239000013585 weight reducing agent Substances 0.000 claims description 24
- 238000002834 transmittance Methods 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 16
- 230000000977 initiatory effect Effects 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 10
- 238000003672 processing method Methods 0.000 claims description 10
- 230000008016 vaporization Effects 0.000 claims description 9
- 238000004458 analytical method Methods 0.000 claims description 8
- 238000009834 vaporization Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 6
- 238000002411 thermogravimetry Methods 0.000 claims description 6
- 230000000630 rising effect Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000004868 gas analysis Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000008439 repair process Effects 0.000 claims description 3
- 238000001228 spectrum Methods 0.000 claims description 2
- 238000010023 transfer printing Methods 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 238000004949 mass spectrometry Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 140
- -1 2-ethylhexyl Chemical group 0.000 description 81
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 75
- 238000004519 manufacturing process Methods 0.000 description 68
- 229920000642 polymer Polymers 0.000 description 60
- 239000003431 cross linking reagent Substances 0.000 description 50
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 45
- 229920000139 polyethylene terephthalate Polymers 0.000 description 44
- 239000005020 polyethylene terephthalate Substances 0.000 description 44
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 39
- 239000000178 monomer Substances 0.000 description 34
- 239000002243 precursor Substances 0.000 description 32
- 229920005989 resin Polymers 0.000 description 32
- 239000011347 resin Substances 0.000 description 32
- 239000006096 absorbing agent Substances 0.000 description 30
- 239000003795 chemical substances by application Substances 0.000 description 29
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 28
- 150000001875 compounds Chemical class 0.000 description 28
- 230000005540 biological transmission Effects 0.000 description 25
- 239000012948 isocyanate Substances 0.000 description 25
- 238000005259 measurement Methods 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 229920001296 polysiloxane Polymers 0.000 description 23
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- 150000002513 isocyanates Chemical class 0.000 description 22
- 239000000463 material Substances 0.000 description 22
- 239000000523 sample Substances 0.000 description 22
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- 238000006073 displacement reaction Methods 0.000 description 21
- 239000005060 rubber Substances 0.000 description 21
- 238000011156 evaluation Methods 0.000 description 19
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- 239000000243 solution Substances 0.000 description 18
- 238000007373 indentation Methods 0.000 description 16
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- 239000000047 product Substances 0.000 description 16
- 241000894007 species Species 0.000 description 16
- 125000000217 alkyl group Chemical group 0.000 description 15
- 239000006260 foam Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
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- 239000002904 solvent Substances 0.000 description 13
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- 101150070263 TGA10 gene Proteins 0.000 description 11
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- SITYOOWCYAYOKL-UHFFFAOYSA-N 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-(3-dodecoxy-2-hydroxypropoxy)phenol Chemical compound OC1=CC(OCC(O)COCCCCCCCCCCCC)=CC=C1C1=NC(C=2C(=CC(C)=CC=2)C)=NC(C=2C(=CC(C)=CC=2)C)=N1 SITYOOWCYAYOKL-UHFFFAOYSA-N 0.000 description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 9
- 230000008859 change Effects 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
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- 125000000524 functional group Chemical group 0.000 description 8
- 229960003742 phenol Drugs 0.000 description 8
- 239000004814 polyurethane Substances 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 239000003522 acrylic cement Substances 0.000 description 7
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 7
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- 150000003839 salts Chemical class 0.000 description 6
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- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- 125000005907 alkyl ester group Chemical group 0.000 description 5
- KQNZLOUWXSAZGD-UHFFFAOYSA-N benzylperoxymethylbenzene Chemical compound C=1C=CC=CC=1COOCC1=CC=CC=C1 KQNZLOUWXSAZGD-UHFFFAOYSA-N 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 125000000623 heterocyclic group Chemical group 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
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- 239000003505 polymerization initiator Substances 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Chemical group OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- 101100481031 Arabidopsis thaliana TGA5 gene Proteins 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical group OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
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- 238000000411 transmission spectrum Methods 0.000 description 4
- OLFNXLXEGXRUOI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-phenylpropan-2-yl)phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=C(O)C(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 OLFNXLXEGXRUOI-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
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- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
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- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Chemical group OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
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- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
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- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
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- JREYOWJEWZVAOR-UHFFFAOYSA-N triazanium;[3-methylbut-3-enoxy(oxido)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].CC(=C)CCOP([O-])(=O)OP([O-])([O-])=O JREYOWJEWZVAOR-UHFFFAOYSA-N 0.000 description 3
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- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
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- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellityc acid Natural products OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- VOVUARRWDCVURC-UHFFFAOYSA-N thiirane Chemical compound C1CS1 VOVUARRWDCVURC-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Materials For Medical Uses (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本發明係關於一種黏著片材。The present invention relates to an adhesive sheet.
先前,於對電子零件進行處理(加工)時,存在進行如下操作之情形,即,於處理時將被處理體經由黏著片材而暫時固定於固定台,於處理後將被處理體自該黏著片材剝離。作為此種操作中所使用之黏著片材,存在使用如下黏著片材之情形,該黏著片材於處理時具有特定之黏著力,於處理後黏著力可下降。作為此種黏著片材之一,提出有使黏著劑層中含有熱膨脹性微小球而構成之黏著片材(例如專利文獻1)。含有熱膨脹性微小球之黏著片材具有如下特徵:具有特定之黏著力,且藉由利用加熱使熱膨脹性微小球膨脹,而於黏著面形成凹凸,從而使接觸面積減小,因此黏著力會下降或消失。此種黏著片材具有無外應力便可容易地剝離被處理體之優點。In the past, when processing (processing) electronic parts, there were cases where the object to be processed was temporarily fixed to a fixing table through an adhesive sheet during processing, and the object to be processed was removed from the adhesion after processing. Sheet peeling. As the adhesive sheet used in such an operation, there is a case where an adhesive sheet is used which has a specific adhesive force at the time of processing, and the adhesive force can be lowered after the treatment. As one of such adhesive sheets, an adhesive sheet composed of thermally expandable microspheres contained in an adhesive layer has been proposed (for example, Patent Document 1). The adhesive sheet containing heat-expandable microspheres has the following characteristics: it has a specific adhesive force, and by heating the heat-expandable microspheres to expand, irregularities are formed on the adhesive surface, so that the contact area is reduced, and the adhesive force is reduced. or disappear. Such an adhesive sheet has the advantage that the object to be treated can be easily peeled off without external stress.
然而,含有熱膨脹性微小球之黏著片材之透光性較低,於使用該黏著片材之情形時,產生如下問題:難以隔著黏著片材視認為了顯示電子零件之暫時固定位置而設於固定台之標記。 先前技術文獻 專利文獻 However, the light transmittance of the adhesive sheet containing the thermally expandable microspheres is low, and when the adhesive sheet is used, the following problem arises: it is difficult to view the temporary fixed position of the display electronic parts through the adhesive sheet and install it on the The marking of the fixed table. prior art literature Patent Literature
專利文獻1:日本專利特開2001-131507號公報Patent Document 1: Japanese Patent Laid-Open No. 2001-131507
[發明所欲解決之問題][Problems to be Solved by Invention]
本發明係為了解決上述先前之課題而完成者,其目的在於提供一種同時實現優異之黏著性與剝離性,且被黏著體視認性(隔著黏著片材之視認性)優異之黏著片材。 [解決問題之技術手段] The present invention has been accomplished in order to solve the aforementioned problems, and an object of the present invention is to provide an adhesive sheet which achieves both excellent adhesiveness and releasability, and which is excellent in the visibility of the attached body (visibility through the adhesive sheet). [Technical means to solve problems]
本發明之黏著片材具備藉由雷射光照射而產生氣體之氣體產生層,且霧度值為50%以下。 於一實施方式中,上述氣體產生層之厚度為0.1 μm~50 μm。 於一實施方式中,上述氣體產生層為可吸收紫外線之層。 於一實施方式中,上述氣體產生層含有紫外線吸收劑。 於一實施方式中,上述黏著片材之波長360 nm之紫外線透過率為30%以下。 於一實施方式中,上述黏著片材之波長500 nm之紫外線透過率為50%~100%。 於一實施方式中,上述氣體產生層為產生烴系氣體之層。 於一實施方式中,上述氣體產生層之氣化起始溫度為150℃~500℃。 於一實施方式中,上述黏著片材之10%重量減少溫度為200℃~500℃。 於一實施方式中,上述黏著片材於上述氣體產生層之至少單側進而具備黏著劑層,該黏著劑層係其表面藉由對該黏著片材照射雷射光而變形之層。 於一實施方式中,上述黏著劑層之厚度為0.1 μm~50 μm。 於一實施方式中,上述黏著劑層藉由對上述黏著片材照射雷射光而發泡。 根據本發明之其他態樣,提供一種電子零件之處理方法。該電子零件之處理方法包括:將電子零件貼附於上述黏著片材上;及對該黏著片材照射雷射光而自該黏著片材剝離該電子零件。 於一實施方式中,上述電子零件之剝離係選擇位置地進行。 於一實施方式中,上述處理方法包括:於將上述電子零件貼附於上述黏著片材後且自該黏著片材剝離該電子零件前,對該電子零件進行特定處理。 於一實施方式中,上述處理為研磨加工、切割加工、黏晶、打線接合、蝕刻、蒸鍍、成型、電路形成、檢查、產品檢驗、洗淨、轉印、排列、修復或裝置表面保護。 根據本發明之其他態樣,提供一種電子零件之處理方法。該電子零件之處理方法包括:自上述黏著片材剝離上述電子零件之後,將電子零件配置於其他片材。 [發明之效果] The adhesive sheet of the present invention includes a gas generating layer that generates gas by irradiation with laser light, and has a haze value of 50% or less. In one embodiment, the thickness of the gas generating layer is 0.1 μm˜50 μm. In one embodiment, the gas generating layer is a layer that can absorb ultraviolet rays. In one embodiment, the gas generating layer contains an ultraviolet absorber. In one embodiment, the ultraviolet transmittance at a wavelength of 360 nm of the adhesive sheet is 30% or less. In one embodiment, the ultraviolet transmittance of the above-mentioned adhesive sheet with a wavelength of 500 nm is 50% to 100%. In one embodiment, the gas generating layer is a layer that generates hydrocarbon-based gas. In one embodiment, the gasification initiation temperature of the gas generating layer is 150°C to 500°C. In one embodiment, the 10% weight reduction temperature of the adhesive sheet is 200°C to 500°C. In one embodiment, the adhesive sheet is further provided with an adhesive layer on at least one side of the gas generating layer, and the adhesive layer is a layer whose surface is deformed by irradiating the adhesive sheet with laser light. In one embodiment, the thickness of the adhesive layer is 0.1 μm˜50 μm. In one embodiment, the adhesive layer is foamed by irradiating the adhesive sheet with laser light. According to another aspect of the present invention, a method for processing electronic parts is provided. The processing method of the electronic component includes: attaching the electronic component to the above-mentioned adhesive sheet; and irradiating the adhesive sheet with laser light to peel off the electronic component from the adhesive sheet. In one embodiment, the peeling of the above-mentioned electronic components is performed at selected positions. In one embodiment, the processing method includes: performing specific processing on the electronic component after the electronic component is attached to the adhesive sheet and before the electronic component is peeled off from the adhesive sheet. In one embodiment, the above-mentioned treatment is grinding, cutting, die bonding, wire bonding, etching, evaporation, molding, circuit formation, inspection, product inspection, cleaning, transfer printing, alignment, repair, or device surface protection. According to another aspect of the present invention, a method for processing electronic parts is provided. The processing method of this electronic component includes arranging the electronic component on another sheet after peeling the electronic component from the adhesive sheet. [Effect of invention]
根據本發明,可提供一種同時實現優異之黏著性與剝離性,且被黏著體視認性(隔著黏著片材之視認性)優異之黏著片材。According to the present invention, it is possible to provide an adhesive sheet that achieves both excellent adhesiveness and releasability, and that is excellent in the visibility of the adhered body (visibility through the adhesive sheet).
A. 黏著片材之概要圖1(a)係本發明之較佳實施方式之黏著片材之概略剖視圖。黏著片材100具備氣體產生層10。氣體產生層10藉由雷射光照射而產生氣體。更詳細而言,氣體產生層10係藉由利用雷射光照射使其成分氣化而產生氣體之層。作為雷射光,代表性而言使用UV(ultraviolet,紫外線)雷射光。氣體產生層10可具有特定之黏著力。
A. Outline of Adhesive Sheet FIG. 1( a ) is a schematic cross-sectional view of an adhesive sheet according to a preferred embodiment of the present invention. The
圖1(b)係本發明之其他實施方式之黏著片材之概略剖視圖。黏著片材100'具備氣體產生層10與配置於氣體產生層10之單面之至少一層之黏著劑層20。黏著劑層20之表面會藉由對黏著片材(實質上為氣體產生層)照射雷射光而變形。於一實施方式中,該變形會因自氣體產生層10產生之氣體,而產生於黏著劑層20之與氣體產生層10相反之側。Fig. 1(b) is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention. The
本發明之黏著片材可於氣體產生層或黏著劑層貼附電子零件等被處理體而使用。本發明之黏著片材具備氣體產生層,藉由雷射光照射而於微小範圍局部地產生氣體。藉由此種氣體之產生,而產生貼附面之變形,其結果,可使被黏著體良好地剝離。於黏著片材具備黏著劑層之情形時,如上所述,因該氣體之產生,而於黏著劑層產生變形,其結果,於照射過雷射光之部分表現剝離性。代表性而言,雷射光自氣體產生層之與黏著劑層相反之側照射。根據本發明,能以如上所述之方式於微小範圍產生變形,故而於對極其微細之小型電子零件進行處理(加工)時,亦可使該小型電子零件良好地剝離。又,即便於需要剝離之小型電子零件與不需要剝離之小型電子零件相鄰地暫時固定之情形時,亦可於剝離對象之部位進行剝離,於剝離對象外之部位不進行剝離,即,可僅使需要剝離之小型電子零件剝離,亦可防止小型電子零件之不需要之脫離。為使黏著劑層之變形良好地產生,較佳為以上述產生之氣體之至少一部分不自黏著片材逸出之方式阻隔,黏著劑層可作為氣體阻隔層發揮作用。The adhesive sheet of the present invention can be used by adhering a to-be-processed object such as an electronic component to a gas generating layer or an adhesive layer. The pressure-sensitive adhesive sheet of the present invention is provided with a gas generating layer, and generates gas locally in a small area by laser light irradiation. By the generation of such a gas, deformation of the attached surface occurs, and as a result, the adherend can be peeled off favorably. When the adhesive sheet has an adhesive layer, as described above, the adhesive layer is deformed due to the generation of the gas, and as a result, the part irradiated with laser light exhibits peelability. Typically, the laser light is irradiated from the opposite side of the gas generating layer from the adhesive layer. According to the present invention, deformation can be generated in a minute range as described above, so that when handling (processing) an extremely fine small electronic component, the small electronic component can be peeled off favorably. In addition, even when the small electronic components that need to be peeled off and the small electronic components that do not need to be peeled off are temporarily fixed adjacent to each other, the peeling can be performed at the site of the peeling object, and the peeling can be performed at the site other than the peeling object. Only the small electronic parts that need to be peeled off can be peeled off, and the unwanted detachment of the small electronic parts can also be prevented. In order to generate the deformation of the adhesive layer well, it is preferable to block in such a way that at least a part of the generated gas does not escape from the adhesive sheet, and the adhesive layer can function as a gas barrier layer.
所謂黏著劑層之變形係指於黏著劑層之法線方向(厚度方向)與水平方向(與厚度方向正交之方向)產生之位移。黏著劑層之變形例如藉由如下方式產生:藉由使用波長355 nm、光束直徑約20 μm 之UV雷射光,於0.80 mW功率、40 kHz頻率下進行脈衝掃描,而自氣體產生層產生氣體。關於變形後之形狀,例如對於脈衝掃描過之任意1點,於雷射光照射結束24小時後,根據共聚聚焦雷射顯微鏡或非接觸型干涉顯微鏡(WYKO)等之測定進行觀測。其形狀可為發泡(凸)、貫通孔(凹凸)、凹陷(凹),藉由該等變形而可產生剝離性。於要沿法線方向將電子零件效率良好地剝離時,較佳為雷射光照射前後之法線方向之位移變化較大,尤其適合形成發泡形狀者。發泡(凸)係以未照射部之黏著片材表面為基準,將最高點定義為垂直位移Y,將半峰全幅值定義為水平位移X(直徑)。關於雷射光照射後形成孔之貫通孔(凹凸)與凹陷(凹),將最高點與最低點之差定義為垂直位移Y,將孔之直徑定義為水平位移X。以下,亦將藉由雷射光照射而變形之部分稱為「變形部」。 The so-called deformation of the adhesive layer refers to the displacement generated in the normal direction (thickness direction) and the horizontal direction (direction orthogonal to the thickness direction) of the adhesive layer. Deformation of the adhesive layer is produced, for example, by using a wavelength of 355 nm and a beam diameter of about 20 μm The UV laser light is pulsed at 0.80 mW power and 40 kHz frequency, and gas is generated from the gas generating layer. The shape after deformation is observed, for example, by measurement of a confocal laser microscope or a non-contact interference microscope (WYKO) 24 hours after the completion of laser light irradiation at any point scanned by the pulse. Its shape can be foamed (convex), through-hole (concave-convex), and concave (concave), and releasability can be produced by these deformations. When the electronic parts are to be efficiently peeled off along the normal direction, it is preferable that the displacement in the normal direction before and after the laser light irradiation changes greatly, and it is especially suitable for forming a foamed shape. Foaming (convex) is based on the surface of the adhesive sheet in the unirradiated part, the highest point is defined as vertical displacement Y, and the full width at half maximum is defined as horizontal displacement X (diameter). Regarding the through-hole (concave-convex) and concave (concave) formed holes after laser irradiation, the difference between the highest point and the lowest point is defined as the vertical displacement Y, and the diameter of the hole is defined as the horizontal displacement X. Hereinafter, the portion deformed by the irradiation of laser light is also referred to as a "deformed portion".
圖2係本發明之其他實施方式之黏著片材之概略剖視圖。黏著片材200於氣體產生層10與黏著劑層20之間進而具備中間層30。藉由設置中間層,可容易地控制黏著劑層之變形(詳情於後文敍述)。又,中間層可與黏著劑層協作而作為氣體阻隔層發揮作用。因此,藉由設置中間層,氣體阻隔性會提高,可獲得黏著劑層更佳地變形之黏著片材。中間層可為單層,亦可為複數層。2 is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention. The
雖未圖示,但上述黏著片材可進而具備其他層。例如,亦可於氣體產生層之與黏著劑層為相反側之面設有基材、其他黏著劑層等。作為基材,例如使用包含任意適當之樹脂之膜。Although not shown, the above-mentioned adhesive sheet may further include other layers. For example, a base material, another adhesive layer, etc. may be provided on the surface of the gas generating layer on the opposite side to the adhesive layer. As the base material, for example, a film containing any appropriate resin is used.
本發明之黏著片材之特徵在於,霧度值為50%以下。本發明中,可不含有不溶性之填料等而形成氣體產生層、黏著劑層及中間層,因此可獲得霧度值較小,透光性較高,白濁得到抑制之黏著片材。上述黏著片材於雷射照射前(暫時固定時),透明性較高。若使用此種黏著片材,則例如可隔著黏著片材視認被黏著體(例如,用於暫時固定電子零件之台),從而例如可隔著該黏著片材較佳地視認為了顯示電子零件之暫時固定位置而設於固定台之標記。此種效果為利用含有不溶性之填料之黏著片材(例如,作為剝離性表現層之黏著劑層中含有熱膨脹性微小球之黏著片材)無法獲得之優異效果。The adhesive sheet of the present invention is characterized in that the haze value is 50% or less. In the present invention, the gas generating layer, the adhesive layer, and the intermediate layer can be formed without insoluble fillers, so that an adhesive sheet with low haze value, high light transmittance, and suppressed white turbidity can be obtained. The above-mentioned adhesive sheet has high transparency before laser irradiation (at the time of temporary fixation). If such an adhesive sheet is used, for example, an adherend (for example, a table for temporarily fixing electronic components) can be visually recognized through the adhesive sheet, and, for example, a display electronic component can be preferably viewed through the adhesive sheet. The temporary fixed position is set on the mark on the fixed table. Such an effect is an excellent effect that cannot be obtained by an adhesive sheet containing an insoluble filler (for example, an adhesive sheet containing thermally expandable microspheres in an adhesive layer serving as a releasable presentation layer).
本發明之黏著片材之霧度值較佳為0%~50%,更佳為0.01%~40%,進而較佳為0.05%~30%,尤佳為0.1%~20%。若為此種範圍,則本發明之上述效果變得更顯著。The haze value of the adhesive sheet of the present invention is preferably 0% to 50%, more preferably 0.01% to 40%, further preferably 0.05% to 30%, particularly preferably 0.1% to 20%. Within such a range, the above-mentioned effects of the present invention become more remarkable.
本發明之黏著片材之黏著劑層相對於SUS430之黏著力較佳為0.1 N/20 mm以上,更佳為0.2 N/20 mm~50 N/20 mm,進而較佳為0.5 N/20 mm~40 N/20 mm,尤佳為0.7 N/20 mm~20 N/20 mm,最佳為1 N/20 mm~10 N/20 mm。若為此種範圍,則可獲得例如作為電子零件之製造中所使用之暫時固定用片材而表現出良好之黏著性之黏著片材。本說明書中,所謂黏著力係指於23℃之環境下藉由依照JIS(Japanese Industrial Standards,日本工業標準) Z 0237:2000之方法(貼合條件:2 kg輥1個往返,拉伸速度:300 mm/min,剝離角度180°)而測定出之黏著力。The adhesive force of the adhesive layer of the adhesive sheet of the present invention to SUS430 is preferably 0.1 N/20 mm or more, more preferably 0.2 N/20 mm to 50 N/20 mm, and more preferably 0.5 N/20 mm ~40 N/20 mm, preferably 0.7 N/20 mm ~ 20 N/20 mm, and most preferably 1 N/20 mm ~ 10 N/20 mm. Within such a range, for example, an adhesive sheet which exhibits good adhesiveness can be obtained as a temporary fixing sheet used in the manufacture of electronic parts. In this specification, the so-called adhesive force refers to the method in accordance with JIS (Japanese Industrial Standards) Z 0237: 2000 under the environment of 23°C (bonding conditions: 2 kg roller 1 round trip, stretching speed: 300 mm/min, peeling angle 180°) and the measured adhesive force.
於一實施方式中,上述氣體產生層具有特定之黏著力。本發明之黏著片材之氣體產生層相對於SUS430之黏著力較佳為0.1 N/20 mm以上,更佳為0.5 N/20 mm~50 N/20 mm,進而較佳為1 N/20 mm~40 N/20 mm,尤佳為1.5 N/20 mm~30 N/20 mm,最佳為2 N/20 mm~20 N/20 mm。若為此種範圍,則可獲得例如作為電子零件之製造中所使用之暫時固定用片材而表現出良好之黏著性之黏著片材。In one embodiment, the gas generating layer has a specific adhesive force. The adhesive force of the gas generating layer of the adhesive sheet of the present invention to SUS430 is preferably 0.1 N/20 mm or more, more preferably 0.5 N/20 mm to 50 N/20 mm, and more preferably 1 N/20 mm ~40 N/20 mm, preferably 1.5 N/20 mm ~ 30 N/20 mm, and most preferably 2 N/20 mm ~ 20 N/20 mm. Within such a range, for example, an adhesive sheet which exhibits good adhesiveness can be obtained as a temporary fixing sheet used in the manufacture of electronic parts.
本發明之黏著片材之厚度較佳為2 μm~200 μm,更佳為3 μm~150 μm,進而較佳為5 μm~120 μm。The thickness of the adhesive sheet of the present invention is preferably 2 μm to 200 μm, more preferably 3 μm to 150 μm, and still more preferably 5 μm to 120 μm.
本發明之黏著片材之水蒸氣透過率較佳為5000 g/(m 2・day)以下,更佳為4800 g/(m 2・day)以下,進而較佳為4500 g/(m 2・day)以下,進而較佳為4200 g/(m 2・day)以下。具備具有此種範圍之水蒸氣透過率之黏著劑層(視需要進而具備中間層)之黏著片材中,防止藉由雷射光照射而產生之氣體之逸出,於黏著劑層形成優異形狀之變形部。若使用此種黏著片材,則可精度良好地使小型被黏著體(例如,電子零件)剝離。本發明之黏著片材之水蒸氣透過率越小越佳,其下限值例如為0.1 g/(m 2・day)。水蒸氣透過率可於30℃、90% RH之環境下藉由依照JIS K7129B之測定法而測定。 The water vapor transmission rate of the adhesive sheet of the present invention is preferably 5000 g/(m 2 ·day) or less, more preferably 4800 g/(m 2 ·day) or less, still more preferably 4500 g/(m 2 ·day) or less day) or less, more preferably 4200 g/(m 2 ·day) or less. In an adhesive sheet with an adhesive layer (and an intermediate layer if necessary) having a water vapor transmission rate of this range, the escape of gas generated by irradiation with laser light is prevented, and the adhesive layer is formed into an excellent shape. Deformation Department. When such an adhesive sheet is used, a small to-be-adhered body (for example, an electronic component) can be peeled off with high precision. The water vapor transmission rate of the adhesive sheet of the present invention is preferably as small as possible, and the lower limit thereof is, for example, 0.1 g/(m 2 ·day). The water vapor transmission rate can be measured by the measurement method according to JIS K7129B in an environment of 30°C and 90% RH.
包含上述黏著劑層與中間層之積層體之水蒸氣透過率較佳為10000 g/(m 2・day)以下,更佳為7000 g/(m 2・day)以下,進而較佳為5000 g/(m 2・day)以下,進而較佳為4800 g/(m 2・day)以下,尤佳為4500 g/(m 2・day)以下,最佳為4200 g/(m 2・day)以下。若為此種範圍,則包含黏著劑層與中間層之積層體作為氣體阻隔層良好地發揮作用,於黏著劑層形成優異形狀之變形部。若使用此種黏著片材,則可精度良好地使小型被黏著體(例如,電子零件)剝離。包含黏著劑層與中間層之積層體之水蒸氣透過率越小越佳,其下限值例如為1 g/(m 2・day)。 The water vapor transmission rate of the laminate comprising the above-mentioned adhesive layer and the intermediate layer is preferably 10000 g/(m 2 ·day) or less, more preferably 7000 g/(m 2 ·day) or less, and still more preferably 5000 g /(m 2 ·day) or less, more preferably 4800 g/(m 2 ·day) or less, more preferably 4500 g/(m 2 ·day) or less, most preferably 4200 g/(m 2 ·day) the following. Within such a range, the laminate including the adhesive layer and the intermediate layer functions well as a gas barrier layer, and a deformed portion having an excellent shape is formed in the adhesive layer. When such an adhesive sheet is used, a small to-be-adhered body (for example, an electronic component) can be peeled off with high precision. The water vapor transmission rate of the laminate including the adhesive layer and the intermediate layer is preferably as small as possible, and the lower limit is, for example, 1 g/(m 2 ·day).
包含上述黏著劑層與中間層之積層體之穿刺強度度較佳為10 mN~5000 mN,更佳為30 mN~4000 mN,進而較佳為50 mN~3000 mN,尤佳為100 mN~2000 mN。若為此種範圍,則包含黏著劑層與中間層之積層體作為氣體阻隔層良好地發揮作用,且較佳地產生藉由氣體之產生所引起之形狀變化,其結果,於黏著劑層形成優異形狀之變形部。若使用此種黏著片材,則可精度良好地使小型被黏著體(例如,電子零件)剝離。穿刺強度係如圖3所示,使用壓縮試驗機6(Kato Tech公司製造,商品名「KES-G5」),將樣品4(例如,積層體)夾於具有直徑11.28 mm之圓形開口部之試樣保持器5A、5B而測定。更詳細而言,可於23℃之測定溫度下,於該圓形開口部之圓形開口部中心,將穿刺針(曲率半徑:1 mm)對樣品穿刺(穿刺速度:0.1 mm/s),將於破裂點之最大負荷作為穿刺強度。The puncture strength of the laminate comprising the above-mentioned adhesive layer and the intermediate layer is preferably 10 mN to 5000 mN, more preferably 30 mN to 4000 mN, further preferably 50 mN to 3000 mN, particularly preferably 100 mN to 2000 mN mN. Within such a range, the laminate including the adhesive layer and the intermediate layer functions well as a gas barrier layer, and the shape change due to the generation of gas preferably occurs, and as a result, the adhesive layer is formed Deformation part of excellent shape. When such an adhesive sheet is used, a small to-be-adhered body (for example, an electronic component) can be peeled off with high precision. The puncture strength is shown in Fig. 3. Using a compression tester 6 (manufactured by Kato Tech, trade name "KES-G5"), a sample 4 (for example, a laminate) is sandwiched between a circular opening having a diameter of 11.28 mm. The
包含上述黏著劑層與中間層之積層體之波長360 nm之紫外線透過率較佳為50%~100%,更佳為60%~95%。The ultraviolet transmittance at a wavelength of 360 nm of the laminate comprising the above-mentioned adhesive layer and the intermediate layer is preferably 50% to 100%, more preferably 60% to 95%.
上述黏著片材之波長360 nm之紫外線透過率較佳為30%以下,更佳為20%以下,進而較佳為15%以下,尤佳為10%以下,最佳為5%以下。黏著片材之波長360 nm之紫外線透過率之下限例如為0%(較佳為0.05%,更佳為0.1%)。The ultraviolet transmittance of the above-mentioned adhesive sheet at a wavelength of 360 nm is preferably 30% or less, more preferably 20% or less, further preferably 15% or less, particularly preferably 10% or less, and most preferably 5% or less. The lower limit of the ultraviolet transmittance at the wavelength of 360 nm of the adhesive sheet is, for example, 0% (preferably 0.05%, more preferably 0.1%).
上述黏著片材之波長500 nm之紫外線透過率較佳為50%~100%,更佳為60%~99%,進而較佳為70%~98%,尤佳為80%~97%。The ultraviolet transmittance of the above-mentioned adhesive sheet having a wavelength of 500 nm is preferably 50% to 100%, more preferably 60% to 99%, further preferably 70% to 98%, particularly preferably 80% to 97%.
上述黏著片材之10%重量減少溫度較佳為200℃~500℃,更佳為220℃~450℃,進而較佳為250℃~400℃,尤佳為270℃~370℃。若為此種範圍,則可獲得藉由雷射光照射而可形成更良好之變形部之黏著片材。所謂黏著片材之10%重量減少溫度係指使黏著片材升溫時之TGA分析中,相對於升溫前之重量而減少10重量%(即,黏著片材之重量相對於照射前之重量而成為90%)之時間點之溫度。The 10% weight reduction temperature of the above-mentioned adhesive sheet is preferably 200°C to 500°C, more preferably 220°C to 450°C, further preferably 250°C to 400°C, particularly preferably 270°C to 370°C. Within such a range, an adhesive sheet that can form a better deformed portion by laser light irradiation can be obtained. The 10% weight reduction temperature of the adhesive sheet means that in the TGA analysis when the adhesive sheet is heated up, the weight of the adhesive sheet is reduced by 10% by weight relative to the weight before heating (that is, the weight of the adhesive sheet becomes 90% relative to the weight before irradiation). %) the temperature at the time point.
B. 氣體產生層氣體產生層可為能吸收紫外線之層。於一實施方式中,氣體產生層含有紫外線吸收劑。藉由含有紫外線吸收劑,可形成可吸收雷射光而進行氣化之氣體產生層。代表性而言,氣體產生層含有紫外線吸收劑與黏著劑A。較佳為紫外線吸收劑溶解於黏著劑A而存在。若紫外線吸收劑溶解於黏著劑A而存在,則可獲得如下黏著片材,其可於貼附面(氣體產生層表面及/或黏著劑層表面)之任意部位產生變形部(例如,凹凸部),且變形部(例如,凹凸部)之形狀之偏差較少。若使用此種黏著片材,則可於所需部位精度良好地產生變形部(例如,凹凸部),本發明之效果變得顯著。再者,本說明書中,所謂「溶解於黏著劑而存在」之狀態係指紫外線吸收劑未以粒子之形式存在於氣體產生層中。更具體而言,上述氣體產生層中,較佳為不含利用X射線CT(computer tomography,電腦斷層掃描)之氣體產生層截面內之粒子分佈測定中粒徑為10 μm以上之紫外線吸收劑。再者,氣體產生層可於黏著劑中含有不溶之成分,亦可不含有。於一實施方式中,氣體產生層中之不溶成分之有無及含量藉由氣體產生層之霧度值而評價,霧度值越小,評價為氣體產生層中之不溶成分之含量越少。較佳為氣體產生層於黏著劑中實質上不含不溶之成分。 B. Gas-generating layer The gas-generating layer can be a layer that can absorb ultraviolet rays. In one embodiment, the gas generating layer contains an ultraviolet absorber. By containing an ultraviolet absorber, a gas generating layer that can absorb and vaporize the laser light can be formed. Typically, the gas generating layer contains an ultraviolet absorber and an adhesive A. Preferably, the ultraviolet absorber is dissolved in the adhesive A and exists. If the ultraviolet absorber is dissolved in the adhesive A, an adhesive sheet can be obtained that can generate deformed parts (for example, uneven parts) on any part of the adhesion surface (the surface of the gas generating layer and/or the surface of the adhesive layer). ), and the deviation of the shape of the deformed part (eg, the concave-convex part) is small. When such an adhesive sheet is used, a deformation|transformation part (for example, uneven|corrugated part) can be precisely produced|generated in a desired part, and the effect of this invention becomes remarkable. In addition, in this specification, the state "dissolved in the adhesive and exists" means that the ultraviolet absorber does not exist in the gas generating layer in the form of particles. More specifically, the gas generating layer preferably does not contain an ultraviolet absorber having a particle size of 10 μm or more in particle distribution measurement in the cross section of the gas generating layer by X-ray CT (computer tomography). Furthermore, the gas generating layer may or may not contain an insoluble component in the adhesive. In one embodiment, the presence or absence and content of the insoluble components in the gas generating layer are evaluated by the haze value of the gas generating layer, and the smaller the haze value is, the less the content of the insoluble components in the gas generating layer is evaluated. It is preferable that the gas generating layer contains substantially no insoluble components in the adhesive.
上述氣體產生層截面之利用奈米壓痕法所得之彈性模數較佳為0.01 MPa~1000 MPa,更佳為0.05 MPa~800 MPa。若為此種範圍,則較佳地產生藉由氣體之產生所引起之氣體產生層之形狀變化,其結果,於貼附面(氣體產生層表面及/或黏著劑層表面)形成優異形狀之變形部。所謂利用奈米壓痕法所得之彈性模數係指跨及負載時、卸載時連續地測定將壓頭壓入至試樣(例如,黏著面)時對壓頭之負載負荷與壓入深度,並根據所得之負載負荷-壓入深度曲線而求出之彈性模數。利用奈米壓痕法所得之彈性模數係以如下方式獲得:對於藉由將金剛石製之Berkovich型(三角錐型)探針垂直地壓抵於測定對象層切出之截面而獲得之位移-負荷遲滯曲線,利用測定裝置附帶之軟體(triboscan)進行數值處理。本說明書中,所謂截面之利用奈米壓痕法所得之彈性模數係使用奈米壓痕儀(Hysitron Inc公司製造之Triboindenter TI-950),藉由在特定溫度(25℃)之單一壓入法,於壓入速度約500 nm/sec、拔出速度約500 nm/sec、壓入深度約1500 nm之測定條件下測定出之彈性模數。再者,氣體產生層之彈性模數可藉由該層中所含之材料之種類、構成材料之基礎聚合物之結構、添加至該層中之添加劑之種類、量等而進行調整。再者,本說明書中,於未言及截面或表面而僅記作利用奈米壓痕法所得之彈性模數時,該彈性模數係指截面之利用奈米壓痕法所得之彈性模數。The elastic modulus of the cross section of the gas generating layer obtained by the nanoindentation method is preferably 0.01 MPa to 1000 MPa, more preferably 0.05 MPa to 800 MPa. Within such a range, the shape change of the gas generating layer due to the generation of the gas preferably occurs, and as a result, the adhering surface (the surface of the gas generating layer and/or the surface of the adhesive layer) is formed with an excellent shape. Deformation Department. The so-called elastic modulus obtained by the nanoindentation method refers to the continuous measurement of the load load and the indentation depth of the indenter when the indenter is pressed into the sample (for example, the adhesive surface) when it is spanned and loaded, and when it is unloaded. And according to the obtained load load-indentation depth curve to calculate the elastic modulus. The elastic modulus obtained by the nanoindentation method is obtained as follows: For the displacement obtained by pressing a diamond-made Berkovich type (triangular pyramid type) probe vertically against the section cut out of the measurement object layer - The load hysteresis curve was numerically processed using the software (triboscan) attached to the measuring device. In this specification, the elastic modulus of the cross section obtained by the nanoindentation method is obtained by using a nanoindenter (Triboindenter TI-950 manufactured by Hysitron Inc.) by a single indentation at a specific temperature (25°C). The elastic modulus was measured under the measurement conditions of the indentation speed of about 500 nm/sec, the extraction speed of about 500 nm/sec, and the indentation depth of about 1500 nm. Furthermore, the elastic modulus of the gas generating layer can be adjusted by the kind of material contained in the layer, the structure of the base polymer constituting the material, the kind and amount of additives added to the layer, and the like. Furthermore, in this specification, when the cross-section or surface is not mentioned and only the elastic modulus obtained by the nano-indentation method is described, the elastic modulus refers to the elastic modulus of the cross-section obtained by the nano-indentation method.
上述氣體產生層表面之利用奈米壓痕法所得之彈性模數較佳為0.01 MPa~1000 MPa,更佳為0.05 MPa~800 MPa。若為此種範圍,則較佳地產生藉由氣體之產生所引起之氣體產生層之形狀變化,其結果,於黏著劑層形成優異形狀之變形部。所謂利用奈米壓痕法所得之彈性模數係指跨及負載時、卸載時連續地測定將壓頭壓入至試樣(例如,黏著面)時對壓頭之負載負荷與壓入深度,並根據所得之負載負荷-壓入深度曲線而求出之彈性模數。利用奈米壓痕法所得之彈性模數係以如下方式獲得:對於藉由將金剛石製之Berkovich型(三角錐型)探針垂直地壓抵於測定對象層切出之截面而獲得之位移-負荷遲滯曲線,利用測定裝置附帶之軟體(triboscan)進行數值處理。本說明書中,所謂表面之利用奈米壓痕法所得之彈性模數係使用奈米壓痕儀(Hysitron Inc公司製造之Triboindenter TI-950),藉由在特定溫度(25℃)之單一壓入法,於壓入速度約500 nm/sec、拔出速度約500 nm/sec、壓入深度約3000 nm之測定條件下測定出之彈性模數。再者,氣體產生層之彈性模數可藉由該層中所含之材料之種類、構成材料之基礎聚合物之結構、添加至該層中之添加劑之種類、量等而進行調整。本發明中,將截面作為測定面藉由上述方法而測定之利用奈米壓痕法所得之彈性模數、與將表面作為測定面藉由上述方法而測定之利用奈米壓痕法所得之彈性模數並無顯著差異,於難以進行自截面之測定之情形時可採用自表面測定之值作為自截面之測定值。The elastic modulus of the surface of the gas generating layer obtained by the nano-indentation method is preferably 0.01 MPa to 1000 MPa, more preferably 0.05 MPa to 800 MPa. Within such a range, a change in the shape of the gas generating layer due to gas generation is preferably generated, and as a result, a deformed portion having an excellent shape is formed in the adhesive layer. The so-called elastic modulus obtained by the nanoindentation method refers to the continuous measurement of the load load and the indentation depth of the indenter when the indenter is pressed into the sample (for example, the adhesive surface) when it is spanned and loaded, and when it is unloaded. And according to the obtained load load-indentation depth curve to calculate the elastic modulus. The elastic modulus obtained by the nanoindentation method is obtained as follows: For the displacement obtained by pressing a diamond-made Berkovich type (triangular pyramid type) probe vertically against the section cut out of the measurement object layer - The load hysteresis curve was numerically processed using the software (triboscan) attached to the measuring device. In this specification, the so-called elastic modulus of the surface obtained by the nanoindentation method is a nanoindenter (Triboindenter TI-950 manufactured by Hysitron Inc.), by a single indentation at a specific temperature (25°C). The elastic modulus was measured under the measurement conditions of the indentation speed of about 500 nm/sec, the extraction speed of about 500 nm/sec, and the indentation depth of about 3000 nm. Furthermore, the elastic modulus of the gas generating layer can be adjusted by the kind of material contained in the layer, the structure of the base polymer constituting the material, the kind and amount of additives added to the layer, and the like. In the present invention, the elastic modulus obtained by the nanoindentation method measured by the above method with the cross section as the measurement surface, and the elasticity obtained by the nanoindentation method measured by the above method with the surface as the measurement surface There is no significant difference in modulus, and the value measured from the surface can be used as the measured value from the cross-section when it is difficult to measure from the cross-section.
上述氣體產生層之氣化起始溫度較佳為150℃~500℃,更佳為170℃~450℃,進而較佳為190℃~420℃,尤佳為200℃~400℃。若為此種範圍,則可獲得藉由雷射光照射而可形成更良好之變形部之黏著片材。再者,本說明書中,所謂氣體產生層之氣化起始溫度係指根據使黏著片材升溫時之EGA分析(evolved gas analysis,釋出氣體分析)算出之氣體產生上升溫度。所謂氣體產生上升溫度係以達到根據EGA分析所得之EGA/MS圖譜之最大氣體產生峰值之半值的溫度而定義。氣化起始溫度越低,雷射光照射時開始產生氣體之溫度越低,於利用更小功率進行雷射光照射之情形時亦會產生充分之氣體量。於一實施方式中,氣體產生層之氣化起始溫度相當於紫外線吸收劑之氣化起始溫度。The gasification initiation temperature of the gas generating layer is preferably 150°C to 500°C, more preferably 170°C to 450°C, further preferably 190°C to 420°C, particularly preferably 200°C to 400°C. Within such a range, an adhesive sheet that can form a better deformed portion by laser light irradiation can be obtained. In addition, in this specification, the vaporization initiation temperature of the gas generating layer means the gas generating rising temperature calculated from EGA analysis (evolved gas analysis, evolved gas analysis) when raising the temperature of the adhesive sheet. The so-called rising temperature of gas generation is defined as the temperature which reaches the half value of the maximum gas generation peak of the EGA/MS spectrum obtained by EGA analysis. The lower the starting temperature of vaporization, the lower the temperature at which the gas starts to be generated when the laser light is irradiated, and a sufficient amount of gas will be generated when the laser light is irradiated with a smaller power. In one embodiment, the vaporization initiation temperature of the gas generating layer corresponds to the vaporization initiation temperature of the ultraviolet absorber.
上述氣體產生層之10%重量減少溫度較佳為150℃~500℃,更佳為170℃~450℃,進而較佳為200℃~400℃。若為此種範圍,則可獲得藉由雷射光照射而可形成更良好之變形部之黏著片材。所謂氣體產生層之10%重量減少溫度係指使黏著片材升溫時(例如,藉由雷射光照射而升溫時)之TGA分析(thermogravimetric analysis,熱重量分析)中,氣體產生層之重量相對於升溫前之重量而減少10重量%(即,氣體產生層之重量相對於升溫前之重量而成為90%)之時間點的溫度。The 10% weight reduction temperature of the gas generating layer is preferably 150°C to 500°C, more preferably 170°C to 450°C, and still more preferably 200°C to 400°C. Within such a range, an adhesive sheet that can form a better deformed portion by laser light irradiation can be obtained. The so-called 10% weight reduction temperature of the gas-generating layer refers to the weight of the gas-generating layer relative to the temperature in TGA analysis (thermogravimetric analysis, thermogravimetric analysis) when the adhesive sheet is heated up (for example, when the temperature is raised by laser light irradiation). The temperature at the time point at which the weight of the gas generating layer is reduced by 10% by weight from the previous weight (that is, the weight of the gas generating layer becomes 90% with respect to the weight before the temperature increase).
上述氣體產生層之厚度較佳為0.1 μm~50 μm,更佳為1 μm~40 μm,進而較佳為2 μm~30 μm,尤佳為5 μm~20 μm。若為此種範圍,則可獲得藉由雷射光照射而可形成更良好之變形部之黏著片材。The thickness of the gas generating layer is preferably 0.1 μm to 50 μm, more preferably 1 μm to 40 μm, further preferably 2 μm to 30 μm, particularly preferably 5 μm to 20 μm. Within such a range, an adhesive sheet that can form a better deformed portion by laser light irradiation can be obtained.
上述氣體產生層之利用奈米壓痕法所得之彈性模數Er(gas)[單位:MPa]與厚度h(gas)[單位:μm]滿足下述式(1)。 Log(Er(gas)×10 6)≧8.01×h(gas) -0.116・・・(1) 本發明中,藉由以滿足上述式(1)之方式構成氣體產生層,而防止因自氣體產生層產生之氣體所引起之過度變形,從而黏著片材藉由雷射光照射而良好地變形。藉由形成此種氣體產生層,而無需配置較厚之阻隔層(黏著劑層)作為防止過度變形之層便可產生微小範圍內之表面變形。更具體而言,可利用氣體產生層單獨體使表面變形,或柔軟地構成黏著劑層(氣體阻隔層)。 The elastic modulus Er (gas) [unit: MPa] and the thickness h (gas) [unit: μm] of the gas generating layer obtained by the nanoindentation method satisfy the following formula (1). Log(Er(gas)×10 6 )≧8.01×h(gas) -0.116・・・(1) In the present invention, by configuring the gas generating layer so as to satisfy the above-mentioned formula (1), it is possible to prevent the Excessive deformation caused by the gas generated by the layer is generated, so that the adhesive sheet is well deformed by the irradiation of the laser light. By forming such a gas generating layer, surface deformation in a small range can be generated without disposing a thicker barrier layer (adhesive layer) as a layer for preventing excessive deformation. More specifically, the surface can be deformed by the gas generating layer alone, or an adhesive layer (gas barrier layer) can be formed flexibly.
於一實施方式中,利用奈米壓痕法所得之彈性模數Er(gas)[單位:MPa]與厚度h(gas)[單位:μm]滿足下述式(2)。於一實施方式中,利用奈米壓痕法所得之彈性模數Er(gas)[單位:MPa]與厚度h(gas)[單位:μm]滿足下述式(3)。 Log(Er(gas)×10 6)≧7.66×h(gas) -0.092・・・(2) Log(Er(gas)×10 6)≧7.52×h(gas) -0.081・・・(3) 若為此種範圍,則上述效果變得更顯著。 In one embodiment, the elastic modulus Er (gas) [unit: MPa] and the thickness h (gas) [unit: μm] obtained by the nanoindentation method satisfy the following formula (2). In one embodiment, the elastic modulus Er (gas) [unit: MPa] and the thickness h (gas) [unit: μm] obtained by the nanoindentation method satisfy the following formula (3). Log(Er(gas)×10 6 )≧7.66×h(gas) -0.092・・・(2) Log(Er(gas)×10 6 )≧7.52×h(gas) -0.081・・・(3) Within such a range, the above-mentioned effect becomes more remarkable.
於一實施方式中,利用奈米壓痕法所得之彈性模數Er(gas)[單位:MPa]與厚度h(gas)[單位:μm]進而滿足下述式(4)。 Log(Er(gas)×10 6)≦47.675×h(gas) -0.519・・・(4) In one embodiment, the elastic modulus Er (gas) [unit: MPa] and the thickness h (gas) [unit: μm] obtained by the nanoindentation method further satisfy the following formula (4). Log(Er(gas)×10 6 )≦47.675×h(gas) -0.519・・・(4)
上述氣體產生層之波長360 nm之紫外線透過率較佳為30%以下,更佳為20%以下,進而較佳為15%以下,尤佳為10%以下,最佳為5%以下。氣體產生層之波長360 nm之紫外線透過率之下限例如為0%(較佳為0.05%,更佳為0.1%)。The ultraviolet transmittance of the above-mentioned gas generating layer having a wavelength of 360 nm is preferably 30% or less, more preferably 20% or less, further preferably 15% or less, particularly preferably 10% or less, and most preferably 5% or less. The lower limit of the ultraviolet transmittance of the wavelength 360 nm of the gas generating layer is, for example, 0% (preferably 0.05%, more preferably 0.1%).
上述氣體產生層之霧度值較佳為55%以下,更佳為0.1%~50%,進而較佳為0.5%~40%。該霧度值成為氣體產生層中之黏著劑(實質上為基礎聚合物)與紫外線吸收劑之相容性之指標。霧度值係根據入射可見光區域(波長:380 nm~780 nm)之光時擴散透過光相對於全光線透過光之比率而求出。於將光之波長尺寸視為最小單位,在波長尺寸以上,濃度與組成均勻之情形時,透明性較高,即,相容性較高。另一方面,於濃度與組成不均勻之情形時,產生光之散射,產生白濁,即,相容性變低。若氣體產生層之霧度為上述範圍,則可成為紫外線吸收劑無偏倚地存在而構成之黏著片材。此種黏著片材藉由雷射光照射而精度良好地表現剝離性。The haze value of the gas generating layer is preferably 55% or less, more preferably 0.1% to 50%, and still more preferably 0.5% to 40%. The haze value becomes an indicator of the compatibility of the adhesive (substantially the base polymer) and the ultraviolet absorber in the gas generating layer. The haze value is obtained from the ratio of diffuse transmitted light to total light transmitted light when light in the visible light region (wavelength: 380 nm to 780 nm) is incident. Considering the wavelength size of light as the smallest unit, when the concentration and composition are uniform above the wavelength size, the transparency is high, that is, the compatibility is high. On the other hand, when the concentration and the composition are not uniform, scattering of light occurs and cloudiness occurs, that is, compatibility becomes low. When the haze of the gas generating layer is in the above-mentioned range, an adhesive sheet in which the ultraviolet absorber exists without bias can be obtained. Such an adhesive sheet precisely expresses peelability by laser light irradiation.
B-1.紫外線吸收劑 作為紫外線吸收劑,只要獲得本發明之效果,則可使用任意適當之紫外線吸收劑。作為紫外線吸收劑,例如可例舉:二苯甲酮系紫外線吸收劑、三𠯤系紫外線吸收劑、苯并三唑系紫外線吸收劑、水楊酸酯系紫外線吸收劑、氰基丙烯酸酯系紫外線吸收劑等。其中較佳為三𠯤系紫外線吸收劑。尤其於使用丙烯酸系黏著劑作為黏著劑A之情形時,三𠯤系紫外線吸收劑由於與該丙烯酸系黏著劑之基礎聚合物之相容性較高,故而可較佳地使用。藉由使用三𠯤系紫外線吸收劑,可形成霧度值較小之氣體產生層。三𠯤系紫外線吸收劑更佳為包含具有羥基之化合物,尤佳為包含羥基苯基三𠯤系化合物之紫外線吸收劑(羥基苯基三𠯤系紫外線吸收劑)。 B-1. UV Absorber As the ultraviolet absorber, any appropriate ultraviolet absorber can be used as long as the effect of the present invention is obtained. As the ultraviolet absorber, for example, a benzophenone-based ultraviolet absorber, a trisulfan-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, a salicylate-based ultraviolet absorber, and a cyanoacrylate-based ultraviolet absorber may, for example, be mentioned. absorbent, etc. Among them, three-series ultraviolet absorbers are preferred. Especially in the case of using an acrylic adhesive as the adhesive A, the tri-type ultraviolet absorber can be preferably used because of its high compatibility with the base polymer of the acrylic adhesive. By using a three-series ultraviolet absorber, a gas generating layer with a small haze value can be formed. The tris'-based ultraviolet absorber is more preferably a compound having a hydroxyl group, and particularly preferably an ultraviolet absorber comprising a hydroxyphenyl tris'-based compound (hydroxyphenyl tris-based ultraviolet absorber).
作為羥基苯基三𠯤系紫外線吸收劑,例如可例舉:2-(4,6-雙(2,4-二甲基苯基)-1,3,5-三𠯤-2-基)-5-羥基苯與[(C10-C16(主要是C12-C13)烷氧基)甲基]環氧乙烷之反應產物(商品名「TINUVIN 400」,BASF公司製造)、2-[4,6-雙(2,4-二甲基苯基)-1,3,5-三𠯤-2-基]-5-[3-(十二烷氧基)-2-羥基丙氧基]苯酚、2-(2,4-二羥基苯基)-4,6-雙-(2,4-二甲基苯基)-1,3,5-三𠯤與縮水甘油酸(2-乙基己基)酯之反應產物(商品名「TINUVIN 405」,BASF公司製造)、2,4-雙(2-羥基-4-丁氧基苯基)-6-(2,4-二丁氧基苯基)-1,3,5-三𠯤(商品名「TINUVIN 460」,BASF公司製造)、2-(4,6-二苯基-1,3,5-三𠯤-2-基)-5-[(己基)氧基]苯酚(商品名「TINUVIN 1577」,BASF公司製造)、2-(4,6-二苯基-1,3,5-三𠯤-2-基)-5-[2-(2-乙基己醯氧基)乙氧基]苯酚(商品名「Adekastab LA-46」,ADEKA股份有限公司製造)、2-(2-羥基-4-[1-辛氧基羰基乙氧基]苯基)-4,6-雙(4-苯基苯基)-1,3,5-三𠯤(商品名「TINUVIN 479」,BASF公司製造)、BASF公司製造之商品名「TINUVIN 477」等。As a hydroxyphenyl tris-based ultraviolet absorber, for example, 2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-tris-2-yl)- Reaction product of 5-hydroxybenzene and [(C10-C16 (mainly C12-C13)alkoxy)methyl]oxirane (trade name "TINUVIN 400", manufactured by BASF Corporation), 2-[4,6 -Bis(2,4-dimethylphenyl)-1,3,5-tris-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, 2-(2,4-Dihydroxyphenyl)-4,6-bis-(2,4-dimethylphenyl)-1,3,5-tris(2-ethylhexyl)-glycidic acid Reaction product of ester (trade name "TINUVIN 405", manufactured by BASF Corporation), 2,4-bis(2-hydroxy-4-butoxyphenyl)-6-(2,4-dibutoxyphenyl) -1,3,5-Tris(trade name "TINUVIN 460", manufactured by BASF Corporation), 2-(4,6-diphenyl-1,3,5-tris-2-yl)-5-[ (hexyl)oxy]phenol (trade name "TINUVIN 1577", manufactured by BASF Corporation), 2-(4,6-diphenyl-1,3,5-tris-2-yl)-5-[2- (2-ethylhexyloxy)ethoxy]phenol (trade name "Adekastab LA-46", manufactured by ADEKA Co., Ltd.), 2-(2-hydroxy-4-[1-octyloxycarbonylethoxy] base]phenyl)-4,6-bis(4-phenylphenyl)-1,3,5-tris(trade name "TINUVIN 479", manufactured by BASF Corporation), trade name "TINUVIN 477 manufactured by BASF Corporation" "Wait.
作為苯并三唑系紫外線吸收劑(苯并三唑系化合物),例如可例舉:2-(2-羥基-5-第三丁基苯基)-2H-苯并三唑(商品名「TINUVIN PS」,BASF公司製造)、苯丙酸及3-(2H-苯并三唑-2-基)-5-(1,1-二甲基乙基)-4-羥基(C7-9側鏈及直鏈烷基)之酯化合物(商品名「TINUVIN 384-2」,BASF公司製造)、3-[3-第三丁基-4-羥基-5-(5-氯-2H-苯并三唑-2-基)苯基]丙酸辛酯及3-[3-第三丁基-4-羥基-5-(5-氯-2H-苯并三唑-2-基)苯基]丙酸2-乙基己酯之混合物(商品名「TINUVIN 109」,BASF公司製造)、2-(2H-苯并三唑-2-基)-4,6-雙(1-甲基-1-苯基乙基)苯酚(商品名「TINUVIN 900」,BASF公司製造)、2-(2H-苯并三唑-2-基)-6-(1-甲基-1-苯基乙基)-4-(1,1,3,3-四甲基丁基)苯酚(商品名「TINUVIN 928」,BASF製造)、3-(3-(2H-苯并三唑-2-基)-5-第三丁基-4-羥基苯基)丙酸甲酯/聚乙二醇300之反應產物(商品名「TINUVIN 1130」,BASF公司製造)、2-(2H-苯并三唑-2-基)對甲酚(商品名「TINUVIN P」,BASF公司製造)、2-(2H-苯并三唑-2-基)-4,6-雙(1-甲基-1-苯基乙基)苯酚(商品名「TINUVIN 234」,BASF公司製造)、2-[5-氯-2H-苯并三唑-2-基]-4-甲基-6-(第三丁基)苯酚(商品名「TINUVIN 326」,BASF公司製造)、2-(2H-苯并三唑-2-基)-4,6-二-第三戊基苯酚(商品名「TINUVIN 328」,BASF公司製造)、2-(2H-苯并三唑-2-基)-4-(1,1,3,3-四甲基丁基)苯酚(商品名「TINUVIN 329」,BASF公司製造)、2,2'-亞甲基雙[6-(2H-苯并三唑-2-基)-4-(1,1,3,3-四甲基丁基)苯酚](商品名「TINUVIN 360」,BASF公司製造)、3-(3-(2H-苯并三唑-2-基)-5-第三丁基-4-羥基苯基)丙酸甲酯與聚乙二醇300之反應產物(商品名「TINUVIN 213」,BASF公司製造)、2-(2H-苯并三唑-2-基)-6-十二烷基-4-甲基苯酚(商品名「TINUVIN 571」,BASF公司製造)、2-[2-羥基-3-(3,4,5,6-四氫鄰苯二甲醯亞胺基甲基)-5-甲基苯基]苯并三唑(商品名「Sumisorb 250」,住友化學股份有限公司製造)、2-(3-第三丁基-2-羥基-5-甲基苯基)-5-氯-2H-苯并三唑(商品名「SEESORB 703」,Shipro Kasei公司製造)、2-(2H-苯并三唑-2-基)-4-甲基-6-(3,4,5,6-四氫鄰苯二甲醯亞胺基甲基)苯酚(商品名「SEESORB 706」,Shipro Kasei公司製造)、2-(4-苯甲醯氧基-2-羥基苯基)-5-氯-2H-苯并三唑(Shipro Kasei公司製造之商品名「SEESORB 7012BA」)、2-第三丁基-6-(5-氯-2H-苯并三唑-2-基)-4-甲基苯酚(商品名「KEMISORB 73」,Chemipro Kasei公司製造)、2,2'-亞甲基雙[6-(2H-苯并三唑-2-基)-4-第三辛基苯酚](商品名「Adekastab LA-31」,ADEKA股份有限公司製造)、2-(2H-苯并三唑-2-基)對甲酚(商品名「Adekastab LA-32」,ADEKA股份有限公司製造)、2-(5-氯-2H-苯并三唑-2-基)-6-第三丁基-4-甲基苯酚(商品名「Adekastab LA-36」,ADEKA股份有限公司製造)等。Examples of benzotriazole-based ultraviolet absorbers (benzotriazole-based compounds) include 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole (trade name "" TINUVIN PS", manufactured by BASF Corporation), phenylpropionic acid, and 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy (C7-9 side chain and straight-chain alkyl) ester compound (trade name "TINUVIN 384-2", manufactured by BASF Corporation), 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzo octyl triazol-2-yl)phenyl]propionate and 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate Mixture of acid 2-ethylhexyl ester (trade name "TINUVIN 109", manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1- Phenylethyl)phenol (trade name "TINUVIN 900", manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)- 4-(1,1,3,3-Tetramethylbutyl)phenol (trade name "TINUVIN 928", manufactured by BASF), 3-(3-(2H-benzotriazol-2-yl)-5- The reaction product of methyl tert-butyl-4-hydroxyphenyl)propionate/polyethylene glycol 300 (trade name "TINUVIN 1130", manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl) ) p-cresol (trade name "TINUVIN P", manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl) Phenol (trade name "TINUVIN 234", manufactured by BASF Corporation), 2-[5-chloro-2H-benzotriazol-2-yl]-4-methyl-6-(tert-butyl)phenol (trade name "TINUVIN 326", manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-4,6-di-tert-pentylphenol (trade name "TINUVIN 328", manufactured by BASF Corporation), 2 -(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol (trade name "TINUVIN 329", manufactured by BASF Corporation), 2,2'- Methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol] (trade name "TINUVIN 360", manufactured by BASF Corporation ), the reaction product of methyl 3-(3-(2H-benzotriazol-2-yl)-5-tert-butyl-4-hydroxyphenyl) propionate and polyethylene glycol 300 (trade name " TINUVIN 213", manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-6-dodecyl-4-methylphenol (trade name "TINUVIN 571", BASF company), 2-[2-hydroxy-3-(3,4,5,6-tetrahydrophthalimidomethyl)-5-methylphenyl]benzotriazole (trade name "Sumisorb 250", manufactured by Sumitomo Chemical Co., Ltd.), 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chloro-2H-benzotriazole (trade name "SEESORB" 703", manufactured by Shipro Kasei Corporation), 2-(2H-benzotriazol-2-yl)-4-methyl-6-(3,4,5,6-tetrahydrophthalimide Methyl)phenol (trade name "SEESORB 706", manufactured by Shipro Kasei Corporation), 2-(4-benzyloxy-2-hydroxyphenyl)-5-chloro-2H-benzotriazole (Shipro Kasei Corporation) Manufactured under the trade name "SEESORB 7012BA"), 2-tert-butyl-6-(5-chloro-2H-benzotriazol-2-yl)-4-methylphenol (trade name "KEMISORB 73", Chemipro Kasei Corporation), 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-tert-octylphenol] (trade name "Adekastab LA-31", ADEKA Corporation Co., Ltd.), 2-(2H-benzotriazol-2-yl)-p-cresol (trade name "Adekastab LA-32", manufactured by ADEKA Co., Ltd.), 2-(5-chloro-2H-benzoyl) Triazol-2-yl)-6-tert-butyl-4-methylphenol (trade name "Adekastab LA-36", manufactured by ADEKA Co., Ltd.) and the like.
於一實施方式中,使用不含鹵素原子之紫外線吸收劑。若使用此種紫外線吸收劑,則可獲得難以污染電極等被黏著體之黏著片材。In one embodiment, a halogen-free UV absorber is used. When such an ultraviolet absorber is used, an adhesive sheet which is hard to contaminate an adherend such as an electrode can be obtained.
構成上述紫外線吸收劑之化合物之分子量較佳為200~1500,更佳為250~1200,進而較佳為300~1000。若為此種範圍,則可獲得藉由雷射光照射而可形成更良好之變形部之黏著片材。200-1500 are preferable, as for the molecular weight of the compound which comprises the said ultraviolet absorber, 250-1200 are more preferable, and 300-1000 are still more preferable. Within such a range, an adhesive sheet that can form a better deformed portion by laser light irradiation can be obtained.
上述紫外線吸收劑之最大吸收波長較佳為300 nm~450 nm,更佳為320 nm~400 nm,進而較佳為330 nm~380 nm。The maximum absorption wavelength of the above-mentioned ultraviolet absorber is preferably 300 nm to 450 nm, more preferably 320 nm to 400 nm, and still more preferably 330 nm to 380 nm.
相對於氣體產生層100重量份,上述紫外線吸收劑之含有比率較佳為1重量份~100重量份,更佳為1重量份~50重量份,進而較佳為5重量份~30重量份。若為此種範圍,則可獲得藉由雷射光照射而可形成更良好之變形部之黏著片材。The content ratio of the ultraviolet absorber is preferably 1 to 100 parts by weight, more preferably 1 to 50 parts by weight, and still more preferably 5 to 30 parts by weight relative to 100 parts by weight of the gas generating layer. Within such a range, an adhesive sheet that can form a better deformed portion by laser light irradiation can be obtained.
B-2.黏著劑A 作為上述氣體產生層中所含之黏著劑A,較佳地使用感壓黏著劑A。作為黏著劑A,例如可例舉:丙烯酸系黏著劑、橡膠系黏著劑、乙烯基烷基醚系黏著劑、矽酮系黏著劑、聚酯系黏著劑、聚醯胺系黏著劑、胺基甲酸酯系黏著劑、苯乙烯-二烯嵌段共聚物系黏著劑等。其中較佳為丙烯酸系黏著劑或橡膠系黏著劑,更佳為丙烯酸系黏著劑。再者,上述黏著劑可單獨使用或組合2種以上而使用。 B-2. Adhesive A As the adhesive A contained in the above-mentioned gas generating layer, the pressure-sensitive adhesive A is preferably used. Examples of the adhesive A include acrylic adhesives, rubber-based adhesives, vinyl alkyl ether-based adhesives, silicone-based adhesives, polyester-based adhesives, polyamide-based adhesives, amine-based adhesives Formate based adhesives, styrene-diene block copolymer based adhesives, etc. Among them, an acrylic adhesive or a rubber-based adhesive is preferable, and an acrylic adhesive is more preferable. In addition, the said adhesive can be used individually or in combination of 2 or more types.
作為上述丙烯酸系黏著劑,例如可例舉將使用(甲基)丙烯酸烷基酯之1種或2種以上作為單體成分之丙烯酸系聚合物(均聚物或共聚物)作為基礎聚合物之丙烯酸系黏著劑等。作為(甲基)丙烯酸烷基酯之具體例,可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等(甲基)丙烯酸C1-20烷基酯。其中,可較佳地使用具有碳數為1~20之直鏈狀或分枝狀之烷基之(甲基)丙烯酸烷基酯,可更佳地使用具有碳數為2~20之直鏈狀或分枝狀之烷基之(甲基)丙烯酸烷基酯。As the above-mentioned acrylic adhesive, for example, an acrylic polymer (homopolymer or copolymer) using one or two or more of alkyl (meth)acrylates as a monomer component can be mentioned as a base polymer. Acrylic adhesives, etc. Specific examples of alkyl (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, Butyl (meth)acrylate, isobutyl (meth)acrylate, 2nd butyl (meth)acrylate, 3rd butyl (meth)acrylate, amyl (meth)acrylate, (meth)acrylic acid Hexyl ester, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, (meth)acrylate Base) isononyl acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, (meth)acrylate Tridecyl acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, cetyl (meth)acrylate, heptadecyl (meth)acrylate , C1-20 alkyl esters of (meth)acrylates such as octadecyl (meth)acrylate, nonadecyl (meth)acrylate, and eicosyl (meth)acrylate. Among them, alkyl (meth)acrylates having linear or branched alkyl groups with 1 to 20 carbon atoms can be preferably used, and those with 2 to 20 carbon atoms can be preferably used. Alkyl (meth)acrylate of an alkyl-like or branched-like group.
於一實施方式中,使用具有碳數為4以上(較佳為4~20,更佳為4~18)之直鏈狀或分枝狀之烷基之(甲基)丙烯酸烷基酯A。使用此種單體而形成之具有較長側鏈之丙烯酸系聚合物於與紫外線吸收劑之親和性(相容性)較高之方面有利。相對於構成丙烯酸系聚合物之全部結構單元,上述(甲基)丙烯酸烷基酯A之含有比率較佳為30重量%以上,更佳為50重量%以上,進而較佳為70重量%~100重量%,尤佳為80重量%~100重量%。若為此種範圍,則可提高丙烯酸系聚合物與紫外線吸收劑之相容性。相對於丙烯酸系聚合物之總量100重量份,包含源自上述(甲基)丙烯酸烷基酯A之結構單元之丙烯酸系聚合物之含有比率較佳為30重量份~100重量份,更佳為70重量份~100重量份。In one embodiment, alkyl (meth)acrylate A having a linear or branched alkyl group having a carbon number of 4 or more (preferably 4 to 20, more preferably 4 to 18) is used. An acrylic polymer having a long side chain formed using such a monomer is advantageous in that the affinity (compatibility) with the ultraviolet absorber is high. The content ratio of the above-mentioned alkyl (meth)acrylate A is preferably 30% by weight or more, more preferably 50% by weight or more, and still more preferably 70% by weight to 100% by weight with respect to all the structural units constituting the acrylic polymer. % by weight, more preferably 80% by weight to 100% by weight. Within such a range, the compatibility between the acrylic polymer and the ultraviolet absorber can be improved. With respect to 100 parts by weight of the total amount of the acrylic polymer, the content ratio of the acrylic polymer including the structural unit derived from the above-mentioned alkyl (meth)acrylate A is preferably 30 parts by weight to 100 parts by weight, more preferably 70 to 100 parts by weight.
於一實施方式中,組合使用具有碳數為4以上(較佳為4~20,更佳為4~18)之直鏈狀或分枝狀之烷基之(甲基)丙烯酸烷基酯A、與三𠯤系紫外線吸收劑。(甲基)丙烯酸烷基酯A與三𠯤系紫外線吸收劑之相容性尤其優異,具備使用該等化合物而形成之氣體產生層之黏著片材之視認性顯著優異。In one embodiment, alkyl (meth)acrylate A having a linear or branched alkyl group having a carbon number of 4 or more (preferably 4 to 20, more preferably 4 to 18) is used in combination , and three 𠯤 UV absorbers. In particular, the alkyl (meth)acrylate A has excellent compatibility with the tris-based ultraviolet absorber, and the visibility of the adhesive sheet having the gas generating layer formed using these compounds is remarkably excellent.
上述丙烯酸系聚合物亦能以凝聚力、耐熱性、交聯性等之改質為目的,視需要含有對應於可與上述(甲基)丙烯酸烷基酯共聚之其他單體成分之單元。作為此種單體成分,例如可例舉:丙烯酸、甲基丙烯酸、丙烯酸羧乙酯、丙烯酸羧戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等含羧基之單體;順丁烯二酸酐、伊康酸酐等酸酐單體;(甲基)丙烯酸羥乙酯、(甲基)丙烯酸羥丙酯、(甲基)丙烯酸羥丁酯、(甲基)丙烯酸羥己酯、(甲基)丙烯酸羥辛酯、(甲基)丙烯酸羥癸酯、(甲基)丙烯酸羥基月桂酯、甲基丙烯酸(4-羥甲基環己基)甲酯等含羥基之單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基之單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等(N-取代)醯胺系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基酯系單體;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯系單體;N-環己基順丁烯二醯亞胺、N-異丙基順丁烯二醯亞胺、N-月桂基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺等順丁烯二醯亞胺系單體;N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、N-月桂基伊康醯亞胺等伊康醯亞胺系單體;N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基丁二醯亞胺等丁二醯亞胺系單體;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基𠰌啉、N-乙烯基羧醯胺類、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺等乙烯基系單體;丙烯腈、甲基丙烯腈等氰基丙烯酸酯單體;(甲基)丙烯酸縮水甘油酯等含環氧基之丙烯酸系單體;(甲基)丙烯酸聚乙二醇、(甲基)丙烯酸聚丙二醇、(甲基)丙烯酸甲氧基乙二醇、(甲基)丙烯酸甲氧基聚丙二醇等二醇系丙烯酸酯單體;(甲基)丙烯酸四氫呋喃甲酯、氟(甲基)丙烯酸酯、矽酮(甲基)丙烯酸酯等具有雜環、鹵素原子、矽原子等之丙烯酸酯系單體;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、丙烯酸聚酯、丙烯酸胺基甲酸酯等多官能單體;異戊二烯、丁二烯、異丁烯等烯烴系單體;乙烯醚等乙烯醚系單體等。該等單體成分可單獨使用或組合2種以上而使用。其中,尤其就與紫外線吸收劑之親和性(相容性)較高之觀點而言,較佳地使用丙烯酸、甲基丙烯酸、丙烯酸羧乙酯、丙烯酸羧戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等含羧基之單體;順丁烯二酸酐、伊康酸酐等酸酐單體;(甲基)丙烯酸羥乙酯、(甲基)丙烯酸羥丙酯、(甲基)丙烯酸羥丁酯、(甲基)丙烯酸羥己酯、(甲基)丙烯酸羥辛酯、(甲基)丙烯酸羥癸酯、(甲基)丙烯酸羥基月桂酯、甲基丙烯酸(4-羥甲基環己基)甲酯等含羥基之單體。相對於丙烯酸系聚合物之總量100重量份,上述含羧基之單體之含有比率較佳為0.5重量份~15重量份,更佳為1重量份~10重量份,進而較佳為3重量份~9.5重量份。相對於丙烯酸系聚合物之總量100重量份,上述酸酐單體之含有比率較佳為0.5重量份~15重量份,更佳為1重量份~10重量份,進而較佳為3重量份~9.5重量份。相對於丙烯酸系聚合物之總量100重量份,上述含羥基之單體之含有比率較佳為0.5重量份~15重量份,更佳為1重量份~10重量份,進而較佳為3重量份~9.5重量份。The said acrylic polymer can also contain the unit corresponding to the other monomer component which can be copolymerized with the said alkyl (meth)acrylate for the purpose of improvement, such as cohesion force, heat resistance, crosslinking property, etc. as needed. Examples of such monomer components include carboxyl-containing groups such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Monomers; anhydride monomers such as maleic anhydride and itaconic anhydride; (meth) hydroxyethyl acrylate, (meth) hydroxypropyl acrylate, (meth) hydroxybutyl acrylate, (meth)acrylic acid Hydroxyhexyl, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl methacrylate, etc. body; styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate , (meth)acryloyloxynaphthalenesulfonic acid and other monomers containing sulfonic acid groups; (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N-butyl (methyl) (N-substituted) amide monomers such as acrylamide, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide, etc.; (meth)acrylate amine Aminoalkyl (meth)acrylate monomers such as ethyl ethyl ester, N,N-dimethylaminoethyl (meth)acrylate, tert-butylaminoethyl (meth)acrylate, etc.; ( (meth)acrylic acid alkoxyalkyl ester monomers such as methoxyethyl meth)acrylate and ethoxyethyl (meth)acrylate; N-cyclohexylmaleimide, N- Isopropyl maleimide, N-lauryl maleimide, N-phenylmaleimide and other maleimide monomers; N-methyl Iconimide, N-Ethyl Iconimide, N-Butyl Iconimide, N-Octyl Iconimide, N-2-Ethylhexyl Iconimide, N -Iconimide monomers such as Cyclohexyl Iconimide, N-Lauryl Iconimide, etc.; Butadiimide such as meth)acryloyl-6-oxyhexamethylene butadiimide, N-(meth)acryloyl-8-oxyoctamethylene butadiimide, etc. Monomers; vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperidone, vinyl Ethylene such as pyridine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylpyridine, N-vinylcarboxyamide, styrene, α-methylstyrene, N-vinylcaprolactam base monomers; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; acrylic monomers containing epoxy groups such as glycidyl (meth)acrylate; (meth)acrylic acid polyethylene glycol, ( Glycol acrylate monomers such as meth)acrylic acid polypropylene glycol, (meth)acrylic acid methoxyethylene glycol, (meth)acrylic acid methoxypolypropylene glycol; (meth)acrylic acid tetrahydrofuran methyl ester, fluorine (methyl) base) acrylate, silicone (meth)acrylate and other acrylate monomers with heterocycle, halogen atom, silicon atom, etc.; hexanediol di(meth)acrylate, (poly)ethylene glycol di( Meth)acrylate, (poly)propylene glycol Di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate , Dipentaerythritol hexa(meth)acrylate, epoxy acrylate, acrylic polyester, acrylic urethane and other multifunctional monomers; Isoprene, butadiene, isobutylene and other olefin monomers; Vinyl ether and other vinyl ether-based monomers. These monomer components may be used alone or in combination of two or more. Among them, acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, and maleic acid are preferably used from the viewpoint of high affinity (compatibility) with the ultraviolet absorber. Carboxyl-containing monomers such as diacid, fumaric acid and crotonic acid; acid anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate , hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, methacrylic acid ( Hydroxyl-containing monomers such as 4-hydroxymethylcyclohexyl) methyl ester. The content ratio of the carboxyl group-containing monomer is preferably 0.5 to 15 parts by weight, more preferably 1 to 10 parts by weight, and more preferably 3 parts by weight relative to 100 parts by weight of the total amount of the acrylic polymer parts to 9.5 parts by weight. The content ratio of the acid anhydride monomer is preferably 0.5 parts by weight to 15 parts by weight, more preferably 1 part by weight to 10 parts by weight, and more preferably 3 parts by weight to 100 parts by weight of the total amount of the acrylic polymer. 9.5 parts by weight. The content ratio of the above-mentioned hydroxyl group-containing monomer is preferably 0.5 to 15 parts by weight, more preferably 1 to 10 parts by weight, and more preferably 3 parts by weight relative to 100 parts by weight of the total amount of the acrylic polymer parts to 9.5 parts by weight.
作為上述橡膠系黏著劑,例如可例舉將如下者作為基礎聚合物之橡膠系黏著劑:天然橡膠;聚異戊二烯橡膠、苯乙烯-丁二烯(SB)橡膠、苯乙烯-異戊二烯(SI)橡膠、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS)橡膠、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)橡膠、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS)橡膠、苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物(SEPS)橡膠、苯乙烯-乙烯-丙烯嵌段共聚物(SEP)橡膠、再生橡膠、丁基橡膠、聚異丁烯、該等之改性體等合成橡膠等。As the above-mentioned rubber-based adhesive, for example, rubber-based adhesives containing the following as a base polymer: natural rubber; polyisoprene rubber, styrene-butadiene (SB) rubber, styrene-isoprene Diene (SI) rubber, styrene-isoprene-styrene block copolymer (SIS) rubber, styrene-butadiene-styrene block copolymer (SBS) rubber, styrene-ethylene-butylene Styrene-styrene block copolymer (SEBS) rubber, styrene-ethylene-propylene-styrene block copolymer (SEPS) rubber, styrene-ethylene-propylene block copolymer (SEP) rubber, recycled rubber, butyl Synthetic rubber such as base rubber, polyisobutylene, modified products of these, etc.
自上述氣體產生層產生之氣體較佳為烴(較佳為脂肪族烴)系氣體。可產生烴系氣體之氣體產生層例如以烴系化合物為主成分而構成。氣體產生層較佳為不含有含鹵素元素之化合物。若產生之氣體為烴系氣體,則可防止作為被加工物之電子零件之腐蝕。此種效果藉由形成不含有含鹵素元素之化合物之氣體產生層而變得更顯著。自氣體產生層之產生離子式量較佳為10 m/z~800 m/z,更佳為11 m/z~700 m/z,進而較佳為12 m/z~500 m/z,尤佳為13 m/z~400 m/z。The gas generated from the gas generating layer is preferably a hydrocarbon (preferably aliphatic hydrocarbon)-based gas. The gas generating layer capable of generating hydrocarbon-based gas is composed of, for example, a hydrocarbon-based compound as a main component. The gas generating layer preferably contains no halogen-containing compound. If the generated gas is a hydrocarbon-based gas, the corrosion of the electronic parts as the workpiece can be prevented. This effect becomes more pronounced by forming a gas generating layer that does not contain a compound containing a halogen element. The amount of ions generated from the gas generating layer is preferably 10 m/z to 800 m/z, more preferably 11 m/z to 700 m/z, further preferably 12 m/z to 500 m/z, especially Preferably, it is 13 m/z to 400 m/z.
上述黏著劑A可視需要含有任意適當之添加劑。作為該添加劑,例如可例舉:交聯劑、黏著賦予劑(例如,松香系黏著賦予劑、萜烯系黏著賦予劑、烴系黏著賦予劑等)、塑化劑(例如,偏苯三甲酸酯系塑化劑、均苯四甲酸酯系塑化劑)、顏料、染料、抗老化劑、導電材、抗靜電劑、光穩定劑、剝離調整劑、軟化劑、界面活性劑、阻燃劑、抗氧化劑等。The above-mentioned adhesive A may contain any appropriate additives as needed. Examples of such additives include crosslinking agents, adhesion imparting agents (for example, rosin-based adhesion imparting agents, terpene-based adhesion imparting agents, hydrocarbon-based adhesion imparting agents, etc.), plasticizers (for example, trimellitic acid) Ester plasticizer, pyromellitic acid ester plasticizer), pigment, dye, anti-aging agent, conductive material, antistatic agent, light stabilizer, peeling regulator, softener, surfactant, flame retardant agents, antioxidants, etc.
作為上述交聯劑,例如可例舉:異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、以及脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。其中,較佳為異氰酸酯系交聯劑或環氧系交聯劑。As said crosslinking agent, for example, an isocyanate type crosslinking agent, an epoxy type crosslinking agent, a melamine type crosslinking agent, a peroxide type crosslinking agent, a urea type crosslinking agent, a metal alkoxide type crosslinking agent are mentioned, for example Cross-linking agent, metal chelate-based cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, oxazoline-based cross-linking agent, aziridine-based cross-linking agent, amine-based cross-linking agent agent, etc. Among them, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferred.
作為上述異氰酸酯系交聯劑之具體例,可例舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(Nippon Polyurethane Industry公司製造,商品名「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(Nippon Polyurethane Industry公司製造,商品名「Coronate HL」)、六亞甲基二異氰酸酯之異氰尿酸酯體(Nippon Polyurethane Industry公司製造,商品名「Coronate HX」)等異氰酸酯加成物等。異氰酸酯系交聯劑之含量可根據所需之黏著力而設定為任意適當之量,相對於基礎聚合物100重量份,代表性而言為0.1重量份~20重量份,更佳為0.5重量份~10重量份。Specific examples of the above-mentioned isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophor Alicyclic isocyanates such as Erone diisocyanate; Aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; Trimethylolpropane/toluene diisocyanate Isocyanate trimer adduct (manufactured by Nippon Polyurethane Industry, trade name "Coronate L"), trimethylolpropane/hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry, trade name "" Isocyanate adducts such as Coronate HL") and isocyanurate of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry, trade name "Coronate HX"). The content of the isocyanate-based crosslinking agent can be set to any appropriate amount according to the required adhesive force, and is typically 0.1 to 20 parts by weight, more preferably 0.5 parts by weight, relative to 100 parts by weight of the base polymer. ~10 parts by weight.
作為上述環氧系交聯劑,例如可例舉:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油基胺基甲基)環己烷(三菱瓦斯化學公司製造,商品名「Tetrad C」)、1,6-己二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 1600」)、新戊二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 1500NP」)、乙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 40E」)、丙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 70P」)、聚乙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL E-400」)、聚丙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL P-200」)、山梨醇聚縮水甘油醚(Nagase chemteX公司製造,商品名「Denacol EX-611」)、甘油聚縮水甘油醚(Nagase chemteX公司製造,商品名「Denacol EX-314」)、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚(Nagase chemteX公司製造,商品名「Denacol EX-512」)、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥乙基)異氰尿酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙苯酚-S-二縮水甘油醚、分子內具有2個以上之環氧基之環氧系樹脂等。環氧系交聯劑之含量可根據所需之黏著力而設定為任意適當之量,相對於基礎聚合物100重量份,代表性而言為0.01重量份~10重量份,更佳為0.03重量份~5重量份。As said epoxy type crosslinking agent, for example, N,N,N',N'-tetraglycidyl m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N- Glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrad C"), 1,6-hexanediol diglycidyl ether (manufactured by Kyeisha Chemical Co., Ltd., trade name "Epolight 1600" ”), neopentyl glycol diglycidyl ether (manufactured by Kyeisha Chemical Co., Ltd., trade name “Epolight 1500NP”), ethylene glycol diglycidyl ether (manufactured by Kyeisha Chemical Co., Ltd., trade name “Epolight 40E”), Propylene glycol diglycidyl ether (manufactured by Kyeisha Chemical Co., Ltd., trade name "Epolight 70P"), polyethylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL E-400"), polypropylene glycol diglycidyl Ether (manufactured by NOF Corporation, trade name "EPIOL P-200"), sorbitol polyglycidyl ether (manufactured by Nagase chemteX, trade name "Denacol EX-611"), glycerol polyglycidyl ether (manufactured by Nagase chemteX, trade name "Denacol EX-314"), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase ChemteX, trade name "Denacol EX-512"), sorbitan polyglycidyl ether, trimethylol Propane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl tris(2-hydroxyethyl) isocyanurate, resorcinol diglycidyl ether, bisphenol -S-diglycidyl ether, an epoxy resin having two or more epoxy groups in the molecule, and the like. The content of the epoxy-based crosslinking agent can be set to any appropriate amount according to the required adhesive force, and is typically 0.01 to 10 parts by weight, more preferably 0.03 parts by weight, relative to 100 parts by weight of the base polymer. parts to 5 parts by weight.
C. 黏著劑層上述黏著劑層含有任意適當之黏著劑B。作為黏著劑B,可為感壓黏著劑B1,亦可為硬化型黏著劑B2。 C. Adhesive Layer The above-mentioned adhesive layer contains any appropriate adhesive B. As the adhesive B, the pressure-sensitive adhesive B1 may be used, or the curable adhesive B2 may be used.
上述黏著劑層之厚度較佳為0.1 μm~50 μm,更佳為0.5 μm~40 μm,進而較佳為1 μm~30 μm,尤佳為2 μm~20 μm。若為此種範圍,則可形成具有較佳黏著力,且作為氣體阻隔層良好地發揮作用之黏著劑層。The thickness of the above-mentioned adhesive layer is preferably 0.1 μm to 50 μm, more preferably 0.5 μm to 40 μm, further preferably 1 μm to 30 μm, particularly preferably 2 μm to 20 μm. Within such a range, an adhesive layer having favorable adhesive force and functioning well as a gas barrier layer can be formed.
上述黏著劑層之水蒸氣透過率較佳為20000 g/(m 2・day)以下,更佳為10000 g/(m 2・day)以下,進而較佳為7000 g/(m 2・day)以下,進而較佳為5000 g/(m 2・day)以下,尤佳為4800 g/(m 2・day)以下,最佳為4500 g/(m 2・day)以下。若為此種範圍,則黏著劑層作為氣體阻隔層良好地發揮作用,形成優異形狀之變形部。若使用此種黏著片材,則可精度良好地使小型被黏著體(例如,電子零件)剝離。黏著劑層之水蒸氣透過率越小越佳,其下限值例如為100 g/(m 2・day)。 The water vapor transmission rate of the above-mentioned adhesive layer is preferably 20000 g/(m 2 ·day) or less, more preferably 10000 g/(m 2 ·day) or less, and still more preferably 7000 g/(m 2 ·day) or less, more preferably 5000 g/(m 2 ·day) or less, more preferably 4800 g/(m 2 ·day) or less, and most preferably 4500 g/(m 2 ·day) or less. Within such a range, the adhesive layer functions well as a gas barrier layer, and a deformed portion having an excellent shape is formed. When such an adhesive sheet is used, a small to-be-adhered body (for example, an electronic component) can be peeled off with high precision. The water vapor transmission rate of the adhesive layer is preferably as small as possible, and the lower limit is, for example, 100 g/(m 2 ·day).
上述黏著劑層之穿刺強度較佳為10 mN~3000 mN,更佳為30 mN~2500 mN,進而較佳為50 mN~2000 mN,尤佳為100 mN~2000 mN。若為此種範圍,則黏著劑層作為氣體阻隔層良好地發揮作用,且較佳地產生藉由氣體之產生所引起之形狀變化,其結果,形成優異形狀之變形部。若使用此種黏著片材,則可精度良好地使小型被黏著體(例如,電子零件)剝離。The puncture strength of the above-mentioned adhesive layer is preferably 10 mN to 3000 mN, more preferably 30 mN to 2500 mN, further preferably 50 mN to 2000 mN, and particularly preferably 100 mN to 2000 mN. Within such a range, the adhesive layer functions well as a gas barrier layer, and the shape change due to the generation of gas preferably occurs, and as a result, a deformed portion having an excellent shape is formed. When such an adhesive sheet is used, a small to-be-adhered body (for example, an electronic component) can be peeled off with high precision.
上述黏著劑層之波長360 nm之紫外線透過率較佳為50%~100%,更佳為60%~95%。The ultraviolet transmittance of the above-mentioned adhesive layer with a wavelength of 360 nm is preferably 50% to 100%, more preferably 60% to 95%.
C-1.感壓黏著劑B1 作為上述感壓黏著劑B1,例如可例舉:丙烯酸系黏著劑、橡膠系黏著劑、乙烯基烷基醚系黏著劑、矽酮系黏著劑、聚酯系黏著劑、聚醯胺系黏著劑、胺基甲酸酯系黏著劑、苯乙烯-二烯嵌段共聚物系黏著劑等。其中較佳為丙烯酸系黏著劑或橡膠系黏著劑,更佳為丙烯酸系黏著劑。作為含有感壓黏著劑之黏著劑層所含有之黏著劑B1,可使用B-2項中說明之黏著劑。 C-1. Pressure Sensitive Adhesive B1 Examples of the pressure-sensitive adhesive B1 include acrylic adhesives, rubber-based adhesives, vinyl alkyl ether-based adhesives, silicone-based adhesives, polyester-based adhesives, and polyamide-based adhesives. , Urethane based adhesives, styrene-diene block copolymer based adhesives, etc. Among them, an acrylic adhesive or a rubber-based adhesive is preferable, and an acrylic adhesive is more preferable. As the adhesive B1 contained in the pressure-sensitive adhesive-containing adhesive layer, the adhesive described in Section B-2 can be used.
C-2.硬化型黏著劑B2 作為硬化型黏著劑B2,例如可例舉:熱固型黏著劑、活性能量線硬化型黏著劑等。較佳為使用活性能量線硬化型黏著劑。藉由該活性能量線硬化型黏著劑而形成之上述黏著劑層為照射活性能量線而形成之黏著劑層,即,為於活性能量線照射後具有特定黏著力之黏著劑層。 C-2. Hardening adhesive B2 As a hardening type adhesive agent B2, a thermosetting type adhesive agent, an active energy ray hardening type adhesive agent, etc. are mentioned, for example. It is preferable to use an active energy ray hardening type adhesive. The said adhesive agent layer formed by this active energy ray hardening type adhesive agent is an adhesive agent layer formed by irradiating an active energy ray, that is, it is an adhesive agent layer which has specific adhesive force after active energy ray irradiation.
作為構成上述活性能量線硬化型黏著劑之樹脂材料,例如可例舉:紫外線硬化系統(加藤清視著,綜合技術中心發行(1989))、光硬化技術(技術資訊協會編(2000))、日本專利特開2003-292916號公報、日本專利4151850號等中記載之樹脂材料。更具體而言,可例舉含有成為母劑之聚合物與活性能量線反應性化合物(單體或低聚物)之樹脂材料(B2-1)、含有活性能量線反應性聚合物之樹脂材料(B2-2)等。Examples of the resin material constituting the above-mentioned active energy ray-curable adhesive include: ultraviolet curing system (by Kiyomi Kato, published by the General Technology Center (1989)), photocuring technology (edited by the Technical Information Association (2000)), The resin material described in Japanese Patent Laid-Open No. 2003-292916, Japanese Patent No. 4151850 and the like. More specifically, the resin material (B2-1) containing the polymer and the active energy ray-reactive compound (monomer or oligomer) serving as the mother agent, and the resin material containing the active energy ray-reactive polymer can be exemplified. (B2-2) and so on.
作為上述成為母劑之聚合物,例如可例舉:天然橡膠、聚異丁烯橡膠、苯乙烯-丁二烯橡膠、苯乙烯-異戊二烯-苯乙烯嵌段共聚物橡膠、再生橡膠、丁基橡膠、聚異丁烯橡膠、腈橡膠(NBR(Nitrile Butadiene Rubber,丁腈橡膠))等橡膠系聚合物;矽酮系聚合物;丙烯酸系聚合物等。該等聚合物可單獨使用或組合2種以上而使用。Examples of the polymer to be used as the above-mentioned master batch include natural rubber, polyisobutylene rubber, styrene-butadiene rubber, styrene-isoprene-styrene block copolymer rubber, reclaimed rubber, butyl Rubber, polyisobutylene rubber, nitrile rubber (NBR (Nitrile Butadiene Rubber)) and other rubber-based polymers; silicone-based polymers; acrylic polymers, etc. These polymers can be used alone or in combination of two or more.
作為上述活性能量線反應性化合物,例如可例舉含有複數個丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基、乙炔基等具有碳-碳多重鍵之官能基之光反應性之單體或低聚物。其中,較佳地使用具有乙烯性不飽和官能基之化合物,更佳地使用具有乙烯性不飽和官能基之(甲基)丙烯酸系化合物。具有乙烯性不飽和官能基之化合物藉由紫外線而容易生成自由基,因此若使用該化合物,則可形成可於短時間硬化之黏著劑層。又,若使用具有乙烯性不飽和官能基之(甲基)丙烯酸系化合物,則可形成硬化後具有適度硬度之黏著劑層。作為光反應性之單體或低聚物之具體例,可例舉:三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯系化合物等含(甲基)丙烯醯基之化合物;該含(甲基)丙烯醯基之化合物之二聚物~五聚物等。該等化合物可單獨使用或組合2種以上而使用。Examples of the active energy ray-reactive compound include photoreactive compounds containing a plurality of functional groups having carbon-carbon multiple bonds, such as acryl, methacryloyl, vinyl, allyl, and ethynyl groups. Monomer or oligomer. Among them, a compound having an ethylenically unsaturated functional group is preferably used, and a (meth)acrylic compound having an ethylenically unsaturated functional group is more preferably used. A compound having an ethylenically unsaturated functional group easily generates radicals by ultraviolet rays, so if this compound is used, an adhesive layer that can be cured in a short time can be formed. Moreover, if the (meth)acrylic-type compound which has an ethylenically unsaturated functional group is used, the adhesive layer which has moderate hardness after hardening can be formed. Specific examples of the photoreactive monomer or oligomer include trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate ) acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, (meth)acryloyl group-containing compounds such as 1,6-hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and (meth)acrylate urethane-based compounds ; The (meth)acryloyl group-containing compound dimer to pentamer and the like. These compounds may be used alone or in combination of two or more.
又,作為上述活性能量線反應性化合物,可使用環氧化丁二烯、甲基丙烯酸縮水甘油酯、丙烯醯胺、乙烯基矽氧烷等單體;或由該單體構成之低聚物。含有該等化合物之樹脂材料(B2-1)可藉由紫外線、電子束等高能量線而硬化。Further, as the above-mentioned active energy ray-reactive compound, monomers such as epoxidized butadiene, glycidyl methacrylate, acrylamide, vinylsiloxane, etc., or oligomers composed of these monomers can be used. The resin material (B2-1) containing these compounds can be cured by high-energy rays such as ultraviolet rays and electron beams.
進而,作為上述活性能量線反應性化合物,可使用鎓鹽等有機鹽類與分子內具有複數個雜環之化合物之混合物。該混合物藉由活性能量線(例如,紫外線、電子束)之照射,有機鹽會裂解而生成離子,其成為起始種而引發雜環之開環反應,從而可形成三維網狀結構。作為上述有機鹽類,例如可例舉:錪鹽、鏻鹽、銻鹽、鋶鹽、硼酸鹽等。作為上述分子內具有複數個雜環之化合物中之雜環,可例舉:環氧乙烷、氧雜環丁烷、氧雜環戊烷、環硫乙烷、氮丙啶等。Furthermore, as the above-mentioned active energy ray-reactive compound, a mixture of organic salts such as onium salts and a compound having a plurality of heterocycles in the molecule can be used. When the mixture is irradiated with active energy rays (eg, ultraviolet rays, electron beams), the organic salts are cleaved to generate ions, which become the starting species to initiate the ring-opening reaction of the heterocyclic ring, thereby forming a three-dimensional network structure. As said organic salts, an iodonium salt, a phosphonium salt, an antimony salt, a pernium salt, a borate etc. are mentioned, for example. As a heterocycle in the compound which has a plurality of heterocycles in the said molecule|numerator, ethylene oxide, oxetane, oxolane, ethylene sulfide, aziridine, etc. are mentioned.
含有上述成為母劑之聚合物與活性能量線反應性化合物之樹脂材料(B2-1)中,相對於成為母劑之聚合物100重量份,活性能量線反應性化合物之含有比率較佳為0.1重量份~500重量份,更佳為1重量份~300重量份,進而較佳為10重量份~200重量份。In the resin material (B2-1) containing the polymer serving as the base agent and the active energy ray-reactive compound, the content ratio of the active energy ray-reactive compound is preferably 0.1 with respect to 100 parts by weight of the polymer serving as the master agent. Part by weight to 500 parts by weight, more preferably 1 part by weight to 300 parts by weight, and still more preferably 10 parts by weight to 200 parts by weight.
作為上述活性能量線反應性聚合物,例如可例舉含有丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基、乙炔基等具有碳-碳多重鍵之活性能量線反應性官能基之聚合物。較佳為使用具有乙烯性不飽和官能基之化合物(聚合物),更佳為使用具有丙烯醯基或甲基丙烯醯基之(甲基)丙烯酸系聚合物。作為具有活性能量線反應性官能基之聚合物之具體例,可例舉包含多官能(甲基)丙烯酸酯之聚合物等。該包含多官能(甲基)丙烯酸酯之聚合物較佳為於側鏈具有碳數為4以上之烷基酯,更佳為具有碳數為6以上之烷基酯,進而較佳為具有碳數為8以上之烷基酯,尤佳為具有碳數為8~20之烷基酯,最佳為具有碳數為8~18之烷基酯。As the active energy ray-reactive polymer, for example, one containing an active energy ray-reactive functional group having a carbon-carbon multiple bond, such as acryl group, methacryl group, vinyl group, allyl group, and ethynyl group, can be mentioned. polymer. It is preferable to use a compound (polymer) having an ethylenically unsaturated functional group, and it is more preferable to use a (meth)acrylic polymer having an acryl group or a methacryl group. As a specific example of the polymer which has an active energy ray-reactive functional group, the polymer etc. which contain polyfunctional (meth)acrylate are mentioned. The polymer containing polyfunctional (meth)acrylate preferably has an alkyl ester with a carbon number of 4 or more in the side chain, more preferably an alkyl ester with a carbon number of 6 or more, and more preferably has a carbon number of 6 or more. The alkyl ester having 8 or more carbon atoms is preferably an alkyl ester having 8 to 20 carbon atoms, and most preferably an alkyl ester having 8 to 18 carbon atoms.
含有上述活性能量線反應性聚合物之樹脂材料(B2-2)亦可進而含有上述活性能量線反應性化合物(單體或低聚物)。The resin material (B2-2) containing the above-mentioned active energy ray-reactive polymer may further contain the above-mentioned active energy ray-reactive compound (monomer or oligomer).
上述活性能量線硬化型黏著劑可藉由活性能量線之照射而硬化。本發明之黏著片材中,於使黏著劑硬化前貼附被黏著體之後,照射活性能量線而使黏著劑硬化,藉此可使該被黏著體密接。作為活性能量線,例如可例舉:γ射線、紫外線、可見光線、紅外線(熱線)、射頻波、α射線、β射線、電子束、電漿流、電離輻射、粒子束等。活性能量線之波長、照射量等條件可根據使用之樹脂材料之種類等而設定為任意適當之條件。例如,可照射10~1000 mJ/cm 2照射量之紫外線而使黏著劑硬化。 The said active energy ray hardening-type adhesive agent can harden|cure by irradiation of an active energy ray. In the adhesive sheet of the present invention, after the adherend is attached before the adhesive is hardened, the adherend is irradiated with active energy rays to harden the adhesive, thereby making the adherend adhere. Examples of active energy rays include gamma rays, ultraviolet rays, visible rays, infrared rays (heat rays), radio frequency waves, alpha rays, beta rays, electron beams, plasma currents, ionizing radiation, particle beams, and the like. Conditions such as the wavelength of the active energy ray, the irradiation dose, etc., can be set to any appropriate conditions according to the type of the resin material used, and the like. For example, the adhesive can be cured by irradiating ultraviolet rays with an irradiation dose of 10 to 1000 mJ/cm 2 .
D. 中間層作為上述中間層之形態,例如可例舉樹脂層、具有黏著性之層等。 D. Intermediate layer As the form of the above-mentioned intermediate layer, for example, a resin layer, a layer having adhesiveness, etc. may be mentioned.
於一實施方式中,上述中間層含有熱塑性樹脂。此種中間層可為含有熱塑性樹脂之樹脂膜、含有包含熱塑性樹脂之黏著劑C之層等。於其他實施方式中,上述中間層含有硬化型樹脂(例如,紫外線硬化型樹脂、熱固型樹脂)。此種中間層可為含有硬化型樹脂之樹脂膜、含有硬化型黏著劑D之層等。In one embodiment, the intermediate layer contains a thermoplastic resin. Such an intermediate layer may be a resin film containing a thermoplastic resin, a layer containing an adhesive C containing a thermoplastic resin, or the like. In another embodiment, the said intermediate layer contains curable resin (for example, ultraviolet curable resin, thermosetting resin). Such an intermediate layer may be a resin film containing a curable resin, a layer containing a curable adhesive D, or the like.
中間層之厚度較佳為0.1 μm~50 μm,更佳為1 μm~40 μm,進而較佳為1.5 μm~30 μm。若為此種範圍,則可形成作為氣體阻隔層良好地發揮作用之中間層。The thickness of the intermediate layer is preferably 0.1 μm to 50 μm, more preferably 1 μm to 40 μm, and still more preferably 1.5 μm to 30 μm. Within such a range, an intermediate layer that functions well as a gas barrier layer can be formed.
上述中間層之水蒸氣透過率較佳為5000 g/(m 2・day)以下,更佳為4800 g/(m 2・day)以下,進而較佳為4500 g/(m 2・day)以下,進而較佳為4200 g/(m 2・day)以下。若為此種範圍,則中間層作為氣體阻隔層良好地發揮作用,形成優異形狀之變形部。若使用此種黏著片材,則可精度良好地使小型被黏著體(例如,電子零件)剝離。中間層之水蒸氣透過率越小越佳,其下限值例如為0.1 g/(m 2・day)。 The water vapor transmission rate of the above-mentioned intermediate layer is preferably 5000 g/(m 2 ·day) or less, more preferably 4800 g/(m 2 ·day) or less, still more preferably 4500 g/(m 2 ·day) or less , and more preferably 4200 g/(m 2 ·day) or less. Within such a range, the intermediate layer functions well as a gas barrier layer, and a deformed portion having an excellent shape is formed. When such an adhesive sheet is used, a small to-be-adhered body (for example, an electronic component) can be peeled off with high precision. The water vapor transmission rate of the intermediate layer is preferably as small as possible, and the lower limit is, for example, 0.1 g/(m 2 ·day).
上述中間層之穿刺強度較佳為300 mN~5000 mN,更佳為500 mN~4500 mN,進而較佳為1000 mN~4000 mN。若為此種範圍,則中間層作為氣體阻隔層良好地發揮作用,且較佳地產生藉由氣體之產生所引起之形狀變化,其結果,形成優異形狀之變形部。若使用此種黏著片材,則可精度良好地使小型被黏著體(例如,電子零件)剝離。The puncture strength of the above-mentioned intermediate layer is preferably 300 mN to 5000 mN, more preferably 500 mN to 4500 mN, and still more preferably 1000 mN to 4000 mN. Within such a range, the intermediate layer functions well as a gas barrier layer, and a shape change due to gas generation is preferably generated, and as a result, a deformed portion having an excellent shape is formed. When such an adhesive sheet is used, a small to-be-adhered body (for example, an electronic component) can be peeled off with high precision.
上述中間層之波長360 nm之紫外線透過率較佳為50%~100%,更佳為60%~95%。The ultraviolet transmittance of the above-mentioned intermediate layer with a wavelength of 360 nm is preferably 50% to 100%, more preferably 60% to 95%.
D-1.作為樹脂層之中間層 作為樹脂層之中間層例如由樹脂膜形成。作為形成該樹脂膜之樹脂,例如可例舉:聚對苯二甲酸乙二酯系樹脂、聚烯烴系樹脂、苯乙烯系彈性體樹脂(例如SEBS等)、紫外線硬化型樹脂、熱固性樹脂、胺基甲酸酯系樹脂、環氧系樹脂等。於一實施方式中,上述樹脂膜包含熱塑性樹脂。 D-1. As the intermediate layer of the resin layer The intermediate layer as the resin layer is formed of, for example, a resin film. Examples of the resin forming the resin film include polyethylene terephthalate-based resins, polyolefin-based resins, styrene-based elastomer resins (for example, SEBS, etc.), ultraviolet curable resins, thermosetting resins, amines Carbamate-based resin, epoxy-based resin, etc. In one embodiment, the resin film includes a thermoplastic resin.
上述樹脂膜之厚度較佳為0.1 μm~50 μm,更佳為0.5 μm~30 μm,進而較佳為1 μm~20 μm。The thickness of the resin film is preferably 0.1 μm to 50 μm, more preferably 0.5 μm to 30 μm, and still more preferably 1 μm to 20 μm.
D-2.作為具有黏著性之層之中間層 關於作為具有黏著性之層之中間層,可例舉:含有感壓黏著劑之中間層、含有硬化型黏著劑之中間層等。較佳為配置含有硬化型黏著劑D之中間層。尤其若作為黏著劑層而將含有感壓黏著劑A之黏著劑層與含有硬化型黏著劑D之中間層組合,則可獲得藉由雷射光照射而可形成更良好之變形部之黏著片材。作為硬化型黏著劑D,可使用C-2項中說明之黏著劑。 D-2. An intermediate layer as an adhesive layer As an intermediate layer as an adhesive layer, an intermediate layer containing a pressure-sensitive adhesive, an intermediate layer containing a curable adhesive, and the like may, for example, be mentioned. It is preferable to arrange|position the intermediate layer containing the hardening adhesive D. In particular, if the adhesive layer containing the pressure-sensitive adhesive A and the intermediate layer containing the curable adhesive D are combined as the adhesive layer, an adhesive sheet that can form a better deformed part by laser light irradiation can be obtained. . As the hardening adhesive D, the adhesive described in the item C-2 can be used.
作為具有黏著性之層之中間層之厚度較佳為5 μm~50 μm,更佳為5 μm~30 μm。The thickness of the intermediate layer as an adhesive layer is preferably 5 μm to 50 μm, more preferably 5 μm to 30 μm.
E. 黏著片材之製造方法本發明之黏著片材可藉由任意適當之方法而製造。關於本發明之黏著片材,例如可例舉如下方法:於特定基材上直接塗佈含有黏著劑A及紫外線吸收劑之氣體產生層形成用組合物而形成氣體產生層,並於該氣體產生層上塗佈含有黏著劑B之黏著劑層形成用組合物而形成黏著劑層。於一實施方式中,於黏著片材具有中間層之情形時,在形成黏著劑層之前,將中間層形成用組合物塗佈於氣體產生層上而形成中間層,並於該中間層上塗佈黏著劑層形成用組合物而形成黏著劑層。又,亦可將各層分別形成之後進行貼合而形成黏著片材。 E. Manufacturing Method of Adhesive Sheet The adhesive sheet of the present invention can be manufactured by any appropriate method. The adhesive sheet of the present invention may be, for example, a method of directly coating a gas-generating layer-forming composition containing the adhesive A and an ultraviolet absorber on a specific substrate to form a gas-generating layer; The adhesive layer-forming composition containing the adhesive B is applied on the layer to form an adhesive layer. In one embodiment, when the adhesive sheet has an intermediate layer, before forming the adhesive layer, the composition for forming an intermediate layer is coated on the gas generating layer to form an intermediate layer, and the intermediate layer is coated The composition for forming a cloth adhesive layer forms an adhesive layer. Moreover, after forming each layer separately, you may bond and form an adhesive sheet.
作為上述組合物之塗佈方法,可採用任意適當之塗佈方法。例如,可於塗佈後進行乾燥而形成各層。作為塗佈方法,例如可例舉使用多輥塗佈機、模嘴塗佈機、凹版塗佈機、敷料器等之塗佈方法。作為乾燥方法,例如可例舉:自然乾燥、加熱乾燥等。進行加熱乾燥之情形時之加熱溫度可根據成為乾燥對象之物質之特性而設定為任意適當之溫度。又,可根據各層之形態而進行活性能量線照射(例如,紫外線照射)。As a coating method of the above-mentioned composition, any appropriate coating method can be adopted. For example, each layer can be formed by drying after coating. As a coating method, the coating method using a multi-roll coater, a die coater, a gravure coater, an applicator, etc. is mentioned, for example. As a drying method, natural drying, heat drying, etc. are mentioned, for example. In the case of heating and drying, the heating temperature can be set to any appropriate temperature according to the properties of the substance to be dried. Moreover, active energy ray irradiation (for example, ultraviolet irradiation) can be performed according to the form of each layer.
F. 電子零件之處理方法本發明之電子零件之處理方法包括:將電子零件貼附於上述黏著片材;及對該黏著片材照射雷射光,而自該黏著片材剝離電子零件。作為電子零件,例如可例舉:半導體晶片、LED(Light-emitting diode,發光二極體)晶片、MLCC(Multi-layer Ceramic Capacitor,積層陶瓷電容)等。 F. Processing method of electronic parts The processing method of electronic parts of the present invention includes: attaching electronic parts to the above-mentioned adhesive sheet; and irradiating the adhesive sheet with laser light to peel off the electronic parts from the adhesive sheet. As an electronic component, a semiconductor wafer, LED (Light-emitting diode, light-emitting diode) wafer, MLCC (Multi-layer Ceramic Capacitor, multilayer ceramic capacitor) etc. are mentioned, for example.
上述電子零件之剝離可選擇位置地進行。具體而言,將複數個電子零件貼附、固定於黏著片材,能以使電子零件之一部分剝離,讓其他電子零件仍保持固定之方式進行電子零件之剝離。The peeling of the above-mentioned electronic components can be carried out selectively. Specifically, by attaching and fixing a plurality of electronic components to the adhesive sheet, the electronic components can be peeled off in such a way that a part of the electronic components is peeled off, and other electronic components are kept fixed.
於一實施方式中,本發明之電子零件之處理方法包括:於將電子零件貼附於黏著片材後且自黏著片材剝離電子零件前,對該電子零件進行特定處理。上述處理並無特別限定,例如可例舉:研磨加工、切割加工、黏晶、打線接合、蝕刻、蒸鍍、成型、電路形成、檢查、產品檢驗、洗淨、轉印、排列、修復、裝置表面保護等處理。In one embodiment, the processing method of an electronic component of the present invention includes: performing specific processing on the electronic component after the electronic component is attached to the adhesive sheet and before the electronic component is peeled off from the adhesive sheet. The above-mentioned treatment is not particularly limited, and examples include: grinding, cutting, die bonding, wire bonding, etching, vapor deposition, molding, circuit formation, inspection, product inspection, cleaning, transfer, alignment, repair, and installation Surface protection, etc.
上述電子零件之尺寸(貼附面之面積)例如為1 μm 2~250000 μm 2。於一實施方式中,可將電子零件之尺寸(貼附面之面積)為1 μm 2~6400 μm 2之電子零件供至處理。於其他實施方式中,可將電子零件之尺寸(貼附面之面積)為1 μm 2~2500 μm 2之電子零件供至處理。 The size (area of the attached surface) of the electronic component is, for example, 1 μm 2 to 250000 μm 2 . In one embodiment, an electronic component having a size (area of an attached surface) of 1 μm 2 to 6400 μm 2 can be supplied for processing. In other embodiments, electronic components whose size (area of the attached surface) is 1 μm 2 to 2500 μm 2 can be supplied to the processing.
於一實施方式中,如上所述可將複數個電子零件配置於黏著片材上。電子零件之間隔例如為1 μm~500 μm。本發明中,於可縮小間隔地暫時固定被處理體之方面有利。In one embodiment, a plurality of electronic components may be arranged on the adhesive sheet as described above. The interval between electronic components is, for example, 1 μm to 500 μm. In the present invention, it is advantageous in that the object to be processed can be temporarily fixed with a narrow interval.
作為雷射光,例如可使用UV雷射光。雷射光之照射功率例如為1 μJ~1000 μJ。UV雷射光之波長例如為240 nm~380 nm。As the laser light, for example, UV laser light can be used. The irradiation power of the laser light is, for example, 1 μJ to 1000 μJ. The wavelength of UV laser light is, for example, 240 nm to 380 nm.
於一實施方式中,上述電子零件之處理方法包括:於電子零件之剝離後,將該電子零件配置於其他片材(例如,黏著片材、基板等)。 實施例 In one embodiment, the processing method of the electronic component includes: after the electronic component is peeled off, disposing the electronic component on another sheet (eg, an adhesive sheet, a substrate, etc.). Example
以下,利用實施例對本發明進行具體說明,但本發明並不受該等實施例限定。實施例中之評價方法如下所述。再者,下述評價中,使用剝離隔離膜後之黏著片材。又,實施例中,只要無特別明確記載,則「份」及「%」為重量基準。Hereinafter, the present invention will be specifically described using examples, but the present invention is not limited to these examples. The evaluation methods in the examples are as follows. In addition, in the following evaluation, the adhesive sheet after peeling a separator was used. In addition, in the Examples, unless otherwise specified, "parts" and "%" are on the basis of weight.
(1)透過率 於具有中間層之黏著片材之情形時,將黏著片材設置於分光光度計(商品名「UV-VIS紫外可見分光光度計 SolidSpec3700」,島津製作所公司製造),讓入射光向樣品之氣體阻隔層側垂直地入射,測定300 nm~800 nm之波長區域之透光率。抽選所得之透射光譜之360 nm及500 nm之波長下之透過率。於僅由黏著層構成之黏著片材之情形時,於保留單側之剝離襯墊之狀態下設置於分光光度計而進行測定,其後,測定剝離襯墊單獨體之透射光譜,藉由進行減法運算而獲得黏著層單獨體之透射光譜。抽選所得之透射光譜之360 nm與500 nm之波長下之透過率。 (2)最大氣體產生峰值溫度 將黏著片材試樣約0.5 mg設置於加熱爐型熱解器,藉由對加熱而揮發之成分進行質量分析之EGA-MS分析,而獲得質量色譜圖。利用加熱爐型熱解器(Frontier Laboratories公司製造,商品名「PY2020iD」)以10℃/min升溫速度自40℃升溫至500℃,使用GC/MS(Gas chromatography/mass spectrometry,氣相層析質譜)分析裝置(JEOL公司製造,商品名「JMS-T100GCV」),根據質量範圍m/z=10~800之質量色譜圖而算出最大氣體產生峰值溫度。 (3)氣化起始溫度 利用與上述(2)同樣之方法使黏著片材升溫,將根據EGA分析而算出之氣體產生上升溫度作為氣化起始溫度。氣體產生上升溫度係以達到根據EGA分析所得之EGA/MS色譜之最大氣體產生峰值之半值的溫度而定義。 (4)產生氣體種 將黏著片材試樣設置於自動試樣燃燒裝置(三菱化學分析技術公司製造,商品名「AQF-2100H」),捕獲以400℃加熱30分鐘而產生之氣體。藉由利用離子層析法對捕獲液進行分析,而特定出產生氣體種。 (5) 5%重量減少溫度 使用示差熱分析裝置(TA Instruments公司製造,商品名「Discovery TGA」),於10℃/min升溫溫度、N 2氛圍下,將流量設為25 ml/min,針對黏著片材測定重量減少5%之溫度。 (6) 10%重量減少溫度 使用示差熱分析裝置(TA Instruments公司製造,商品名「Discovery TGA」),於10℃/min升溫溫度、N 2氛圍下,將流量設為25 ml/min,針對黏著片材測定重量減少10%之溫度。 針對黏著片材、氣體產生層(UV吸收劑)分別測定10%重量減少溫度。 (7)水蒸氣透過率 以覆蓋具有10 mm×10 mm之開口部之Al治具之開口部的方式貼附試樣而製作測定樣品,並將測定樣品設置於水蒸氣透過度測定裝置(MOCON公司製造,商品名「PERMATRAN-W3/34G」)之第1腔室與第2腔室之間,利用MOCON測定法進行評價。溫濕度條件設為30℃/90% RH,氣體(水蒸氣)流量設為10.0±0.5 cc/min,測定時間設為20小時。 針對黏著片材、黏著劑層、中間層分別測定水蒸氣透過率。 (8)表面形狀變化 於黏著片材之氣體產生層側(與黏著劑層相反之側)貼合玻璃板(松波硝子公司製造,大型載玻片S9112(標準大型白色磨邊No.2))而獲得測定樣品。自測定樣品之玻璃板側,使用波長355 nm、光束直徑約20 μm 之UV雷射光,以0.80 mW功率、40 kHz頻率進行脈衝掃描,而使氣體自氣體產生層產生。對於與脈衝掃描過之任意1點對應之黏著劑層表面(實施例1及比較例1中為氣體產生層表面),於雷射光照射結束24小時後,利用共聚聚焦雷射顯微鏡進行觀察,而測定垂直位移Y與水平位移X(直徑;半峰全幅值)。 於位移Y為8 μm以上之情形時,剝離性顯著優異(表中,◎);於位移Y為0.6 μm以上且未達8 μm之情形時,剝離性良好(表中,〇);於位移Y未達0.6 μm之情形時,剝離性不充分(表中,×)。 (9)霧度值 於具有中間層之黏著片材之情形時,將剝離襯墊剝離後設置於霧度計,使入射光向樣品垂直地入射而測定霧度值。於僅由黏著層構成之黏著片材之情形時,於保留單側之剝離襯墊之狀態下設置於霧度計而進行測定,其後測定剝離襯墊單獨體之霧度值,藉由進行減法運算而獲得黏著層單獨體之霧度值。 於霧度值為20%以下之情形時,評價為被黏著體視認性:良(表中,〇),於霧度值為20%以上50%以下之情形時,評價為被黏著體視認性:可(表中,△),於霧度值為50%以上之情形時,評價為被黏著視認性:差(表中,×)。 (10)黏著力(氣體產生層側) 於黏著片材之黏著劑層側貼合PET#25而獲得測定樣品。對於測定樣品之氣體產生層側相對於SUS430之黏著力,藉由依照JIS Z 0237:2000之方法(貼合條件:2 kg輥1個往返,拉伸速度:300 mm/min,剝離角度180°)進行測定。 (11)黏著力(黏著劑層) 於黏著片材之氣體產生層側貼合PET#25而獲得測定樣品。對於測定樣品之黏著劑層側相對於SUS430之黏著力,藉由依照JIS Z 0237:2000之方法(貼合條件:2 kg輥1個往返,拉伸速度:300 mm/min,剝離角度180°)進行測定。 (12)變形之面內均一性 以上述(8)之方式對氣體產生層照射UV雷射光。 利用顯微鏡對隨機選擇之2 mm×2 mm範圍之變形部進行觀察,於凸部之90個%以上為相同尺寸之情形時設為良(表中,〇),於凸部之80個%以上且未達90個%為相同尺寸之情形時設為可(表中,△),於凸部之未達80個%為相同尺寸之情形時設為差(表中,×)。所謂相同尺寸係指位移X之差在±20%以內。 (13)變形之位置選擇性 以上述(8)之方式對氣體產生層照射UV雷射光。 將僅雷射光照射部單獨變形之情形設為合格(〇),將於雷射照射部周邊亦有複數處變形之情形設為不合格(×)。 (14)彈性模數 使用奈米壓痕儀(Hysitron Inc公司製造之Triboindenter TI-950),藉由在特定溫度(25℃)之單一壓入法,於壓入速度約500 nm/sec、拔出速度約500 nm/sec、壓入深度約1500 nm之測定條件下測定彈性模數。 (1) Transmittance In the case of an adhesive sheet with an intermediate layer, set the adhesive sheet on a spectrophotometer (trade name "UV-VIS Ultraviolet-Vis Spectrophotometer SolidSpec3700", manufactured by Shimadzu Corporation), and let incident light The sample was vertically incident on the gas barrier layer side, and the transmittance in the wavelength region of 300 nm to 800 nm was measured. The transmittance at the wavelengths of 360 nm and 500 nm of the transmission spectrum obtained by sampling. In the case of an adhesive sheet composed of only an adhesive layer, the measurement was performed by setting the spectrophotometer with the release liner on one side left, and then measuring the transmission spectrum of the release liner alone by performing the measurement. Subtraction is used to obtain the transmission spectrum of the adhesive layer alone. The transmittance at the wavelengths of 360 nm and 500 nm of the transmission spectrum obtained by sampling. (2) Maximum gas generation peak temperature About 0.5 mg of the adhesive sheet sample was set in a heating furnace type pyrolyzer, and a mass chromatogram was obtained by EGA-MS analysis of mass analysis of components volatilized by heating. The temperature was raised from 40°C to 500°C at a heating rate of 10°C/min using a furnace-type pyrolyzer (manufactured by Frontier Laboratories, trade name "PY2020iD"), using GC/MS (Gas chromatography/mass spectrometry, gas chromatography mass spectrometry ) analyzer (manufactured by JEOL, trade name "JMS-T100GCV"), and calculated the maximum gas generation peak temperature from the mass chromatogram in the mass range m/z=10 to 800. (3) Evaporation initiation temperature The pressure-sensitive adhesive sheet was heated in the same manner as in (2) above, and the gas generation elevation temperature calculated by EGA analysis was taken as the vaporization initiation temperature. The gas generation rise temperature is defined as the temperature at which the half value of the maximum gas generation peak of the EGA/MS chromatogram obtained according to the EGA analysis is reached. (4) Generation of gas species The adhesive sheet sample was set in an automatic sample combustion apparatus (manufactured by Mitsubishi Chemical Analytical Technologies, trade name "AQF-2100H"), and the gas generated by heating at 400°C for 30 minutes was captured. The generated gas species is identified by analyzing the captured liquid by ion chromatography. (5) 5% weight loss temperature Using a differential thermal analyzer (manufactured by TA Instruments, trade name "Discovery TGA"), the flow rate was set to 25 ml/min at a heating temperature of 10°C/min under N2 atmosphere, and the The temperature at which the weight of the adhesive sheet is reduced by 5% is measured. (6) 10% weight reduction temperature Using a differential thermal analyzer (manufactured by TA Instruments, trade name "Discovery TGA"), the flow rate was set to 25 ml/min at a heating temperature of 10°C/min under N2 atmosphere, and the The temperature at which the weight of the adhesive sheet is reduced by 10% is measured. The 10% weight reduction temperature was measured for the adhesive sheet and the gas generating layer (UV absorber), respectively. (7) Water Vapor Transmission Rate The sample was attached so as to cover the opening of an Al jig having an opening of 10 mm×10 mm to prepare a measurement sample, and the measurement sample was set in a water vapor transmission rate measuring device (MOCON). Between the first chamber and the second chamber of the company's product, trade name "PERMATRAN-W3/34G"), the MOCON measurement method was used for evaluation. The temperature and humidity conditions were set to 30°C/90% RH, the gas (steam) flow rate was set to 10.0±0.5 cc/min, and the measurement time was set to 20 hours. The water vapor transmission rate was measured for the adhesive sheet, the adhesive layer, and the intermediate layer, respectively. (8) The surface shape is changed to the gas generating layer side of the adhesive sheet (the side opposite to the adhesive layer) and a glass plate (manufactured by Songbo Glass Co., Ltd., large glass slide S9112 (standard large white edging No.2)) A measurement sample is obtained. From the glass plate side of the sample to be measured, use a wavelength of 355 nm and a beam diameter of about 20 μm The UV laser light is pulsed at a power of 0.80 mW and a frequency of 40 kHz, and the gas is generated from the gas generating layer. For the surface of the adhesive layer corresponding to any point scanned by the pulse (the surface of the gas generating layer in Example 1 and Comparative Example 1), 24 hours after the laser irradiation was completed, it was observed with a confocal laser microscope, and The vertical displacement Y and the horizontal displacement X (diameter; full amplitude at half maximum) were determined. When the displacement Y was 8 μm or more, the peelability was remarkably excellent (in the table, ⊚); when the displacement Y was 0.6 μm or more and less than 8 μm, the peelability was good (in the table, 0); When Y was less than 0.6 μm, the peelability was insufficient (x in the table). (9) Haze value In the case of an adhesive sheet having an intermediate layer, the release liner was peeled off, and the haze value was measured by making the incident light perpendicular to the sample and setting it in a haze meter. In the case of an adhesive sheet composed of only an adhesive layer, the measurement is performed by setting the haze meter with the release liner on one side left, and then measuring the haze value of the release liner alone by performing the measurement. Subtraction operation is used to obtain the haze value of the adhesive layer alone. When the haze value was 20% or less, it was evaluated as the visibility of the adherent body: good (in the table, 0), and when the haze value was 20% or more and 50% or less, it was evaluated as the adherend body visibility. : OK (in the table, Δ), and when the haze value was 50% or more, the adhesion visibility was evaluated: poor (in the table, ×). (10) Adhesion (gas generating layer side) PET#25 was bonded to the adhesive layer side of the adhesive sheet to obtain a measurement sample. For the measurement of the adhesion of the gas generating layer side of the sample to SUS430, by a method according to JIS Z 0237:2000 (bonding conditions: 1 reciprocation of a 2 kg roller, stretching speed: 300 mm/min, peeling angle 180° ) to measure. (11) Adhesion (adhesive layer) PET#25 was bonded to the gas generating layer side of the adhesive sheet to obtain a measurement sample. For the measurement of the adhesive force of the adhesive layer side of the sample with respect to SUS430, by a method in accordance with JIS Z 0237: 2000 (bonding conditions: 1 reciprocating roll of 2 kg, stretching speed: 300 mm/min, peeling angle 180° ) to measure. (12) In-plane uniformity of deformation The gas generating layer was irradiated with UV laser light in the manner of (8) above. A randomly selected deformed part in the range of 2 mm × 2 mm was observed with a microscope, and when 90% or more of the convex parts were the same size, it was regarded as good (in the table, 0), and when 80% or more of the convex parts were the same size And when less than 90% were the same size, it was set as acceptable (in the table, △), and when less than 80% of the convex parts were the same size, it was set as poor (in the table, x). The so-called same size means that the difference of displacement X is within ±20%. (13) Position selectivity of deformation The gas generating layer is irradiated with UV laser light in the manner of (8) above. The case where only the laser-irradiated part was deformed alone was set as pass (0), and the case where there were multiple deformations around the laser-irradiated part was set as unacceptable (x). (14) Modulus of elasticity Using a nanoindenter (Triboindenter TI-950 manufactured by Hysitron Inc), by a single indentation method at a specific temperature (25°C), the indentation speed is about 500 nm/sec, the pull The elastic modulus was measured under the measurement conditions of an exit speed of about 500 nm/sec and an indentation depth of about 1500 nm.
[製造例1]氣體產生層形成用組合物a之製備 向甲苯中添加丙烯酸2-乙基己酯30重量份、丙烯酸乙酯70重量份、丙烯酸2-羥乙酯4重量份、甲基丙烯酸甲酯5重量份、及作為聚合起始劑之過氧化苯甲醯0.2重量份後,加熱至70℃而獲得丙烯酸系共聚物(聚合物A)之甲苯溶液。 將聚合物A之甲苯溶液(聚合物A:100重量份)、異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)1.5重量份、紫外線吸收劑(BASF公司製造,商品名「Tinuvin 477」,結構:[化1])20重量份混合而製備氣體產生層形成用組合物a。將氣體產生層形成用組合物a之組成示於表1。 [Production Example 1] Preparation of the composition a for forming a gas generating layer To toluene were added 30 parts by weight of 2-ethylhexyl acrylate, 70 parts by weight of ethyl acrylate, 4 parts by weight of 2-hydroxyethyl acrylate, 5 parts by weight of methyl methacrylate, and peroxide as a polymerization initiator After 0.2 weight part of benzyl, it heated to 70 degreeC, and obtained the toluene solution of an acrylic copolymer (polymer A). A toluene solution of polymer A (polymer A: 100 parts by weight), 1.5 parts by weight of an isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane, trade name "Coronate L"), an ultraviolet absorber (manufactured by BASF, trade name "Coronate L") Tinuvin 477", structure: [Chemical 1]) 20 parts by weight were mixed to prepare a composition a for forming a gas generating layer. Table 1 shows the composition of the composition a for forming a gas generating layer.
[化1] [hua 1]
[製造例2]氣體產生層形成用組合物b之製備 將UV吸收劑之調配量設為10重量份,除此以外,以與製造例1同樣之方式製備氣體產生層形成用組合物b。將氣體產生層形成用組合物b之組成示於表1。 [Production Example 2] Preparation of composition b for forming gas generating layer A composition b for forming a gas generating layer was prepared in the same manner as in Production Example 1, except that the blending amount of the UV absorber was 10 parts by weight. Table 1 shows the composition of the composition b for forming a gas generating layer.
[製造例3]氣體產生層形成用組合物c之製備 作為UV吸收劑,使用2,4-雙(2-羥基-4-丁氧基苯基)-6-(2,4-二丁氧基苯基)-1,3,5-三𠯤(商品名「TINUVIN 460」,BASF公司製造,結構:[化2])10重量份,除此以外,以與製造例1同樣之方式製備氣體產生層形成用組合物c。將氣體產生層形成用組合物c之組成示於表1。 [Production Example 3] Preparation of composition c for forming gas generating layer As the UV absorber, 2,4-bis(2-hydroxy-4-butoxyphenyl)-6-(2,4-dibutoxyphenyl)-1,3,5-tris(commercial product) was used. A composition c for forming a gas generating layer was prepared in the same manner as in Production Example 1, except that the name was "TINUVIN 460", manufactured by BASF Corporation, structure: [Chem. 2]) 10 parts by weight. Table 1 shows the composition of the composition c for forming a gas generating layer.
[化2] [hua 2]
[製造例4]氣體產生層形成用組合物d之製備 作為UV吸收劑,使用2-(4,6-雙(2,4-二甲基苯基)-1,3,5-三𠯤-2-基)-5-羥基苯與[(C10-C16(主要為C12-C13)烷氧基)甲基]環氧乙烷之反應產物(商品名「TINUVIN 400」,BASF公司製造,結構:[化3])20重量份,除此以外,以與製造例1同樣之方式製備氣體產生層形成用組合物d。將氣體產生層形成用組合物d之組成示於表1。 [Production Example 4] Preparation of the composition d for forming a gas generating layer As a UV absorber, 2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-tris-2-yl)-5-hydroxybenzene and [(C10-C16 (mainly C12-C13) alkoxy) methyl] oxirane reaction product (trade name "TINUVIN 400", manufactured by BASF Corporation, structure: [Chemical 3]) 20 parts by weight, in addition to A composition d for forming a gas generating layer was prepared in the same manner as in Production Example 1. Table 1 shows the composition of the composition d for forming a gas generating layer.
[化3] [hua 3]
[製造例5]氣體產生層形成用組合物e之製備 向乙酸乙酯中添加丙烯酸2-乙基己酯30重量份、丙烯酸甲酯70重量份、丙烯酸10重量份、及作為聚合起始劑之過氧化苯甲醯0.2重量份後,加熱至70℃而獲得丙烯酸系共聚物(聚合物B)之乙酸乙酯溶液。 將聚合物B之乙酸乙酯溶液(聚合物B:100重量份)、異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)1重量份、及紫外線吸收劑(BASF公司製造,商品名「Tinuvin477」)20重量份混合而製備氣體產生層形成用組合物e。將氣體產生層形成用組合物e之組成示於表1。 [Production Example 5] Preparation of composition e for forming gas generating layer After adding 30 parts by weight of 2-ethylhexyl acrylate, 70 parts by weight of methyl acrylate, 10 parts by weight of acrylic acid, and 0.2 parts by weight of benzyl peroxide as a polymerization initiator to ethyl acetate, it was heated to 70°C Thus, an ethyl acetate solution of the acrylic copolymer (polymer B) was obtained. An ethyl acetate solution of polymer B (polymer B: 100 parts by weight), 1 part by weight of an isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane, trade name "Coronate L"), and an ultraviolet absorber (manufactured by BASF, Trade name "Tinuvin 477") was mixed with 20 parts by weight to prepare a composition e for forming a gas generating layer. Table 1 shows the composition of the composition e for forming a gas generating layer.
[製造例6]氣體產生層形成用組合物f之製備 向乙酸乙酯中添加丙烯酸2-乙基己酯95重量份、丙烯酸5重量份、及作為聚合起始劑之過氧化苯甲醯0.15重量份後,加熱至70℃而獲得丙烯酸系共聚物(聚合物C)之乙酸乙酯溶液。 將聚合物C之乙酸乙酯溶液(聚合物C:100重量份)、異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)1重量份、及紫外線吸收劑(BASF公司製造,商品名「Tinuvin477」)20重量份混合而製備氣體產生層形成用組合物f。將氣體產生層形成用組合物f之組成示於表1。 [Production Example 6] Preparation of the composition f for forming a gas generating layer After adding 95 parts by weight of 2-ethylhexyl acrylate, 5 parts by weight of acrylic acid, and 0.15 parts by weight of benzyl peroxide as a polymerization initiator to ethyl acetate, it was heated to 70° C. to obtain an acrylic copolymer ( Polymer C) in ethyl acetate. An ethyl acetate solution of polymer C (polymer C: 100 parts by weight), 1 part by weight of an isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane, trade name "Coronate L"), and an ultraviolet absorber (manufactured by BASF, 20 parts by weight (trade name "Tinuvin 477") was mixed to prepare a composition f for forming a gas generating layer. Table 1 shows the composition of the composition f for forming a gas generating layer.
[製造例7]氣體產生層形成用組合物g之製備 向乙酸乙酯中添加丙烯酸2-乙基己酯95重量份、丙烯酸5重量份、及作為聚合起始劑之過氧化苯甲醯0.15重量份後,加熱至70℃而獲得丙烯酸系共聚物(聚合物C)之乙酸乙酯溶液。 將聚合物C之乙酸乙酯溶液(聚合物C:100重量份)、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「TETRAD-C」)0.1重量份、及紫外線吸收劑(BASF公司製造,商品名「Tinuvin 477」)20重量份混合而製備氣體產生層形成用組合物g。將氣體產生層形成用組合物g之組成示於表1。 [Production Example 7] Preparation of composition g for forming gas generating layer After adding 95 parts by weight of 2-ethylhexyl acrylate, 5 parts by weight of acrylic acid, and 0.15 parts by weight of benzyl peroxide as a polymerization initiator to ethyl acetate, it was heated to 70° C. to obtain an acrylic copolymer ( Polymer C) in ethyl acetate. An ethyl acetate solution of polymer C (polymer C: 100 parts by weight), 0.1 part by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C"), and an ultraviolet absorber (BASF The composition g for forming a gas generating layer was prepared by mixing 20 parts by weight of the company's product, trade name "Tinuvin 477". Table 1 shows the composition of the composition g for forming a gas generating layer.
[製造例8]氣體產生層形成用組合物h之製備 將順丁烯二酸改性苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS:苯乙烯部位/乙烯-丁烯部位(重量比)=30/70,酸值:10(mg-CH 3ONa/g),旭化成化學公司製造,商品名「Tuftec M1913」)100重量份、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「TETRAD-C」)3重量份、紫外線吸收劑(BASF公司製造,商品名「Tinuvin 477」)20重量份、及作為溶劑之甲苯混合而製備氣體產生層形成用組合物h。將氣體產生層形成用組合物h之組成示於表1。 [Production Example 8] Preparation of composition h for forming gas generating layer A maleic acid-modified styrene-ethylene-butene-styrene block copolymer (SEBS: styrene moiety/ethylene-butene moiety ( weight ratio) = 30/70, acid value: 10 (mg-CH 3 ONa/g), manufactured by Asahi Kasei Chemical Co., Ltd., trade name "Tuftec M1913") 100 parts by weight, epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd. , trade name "TETRAD-C") 3 weight parts, ultraviolet absorber (manufactured by BASF, trade name "Tinuvin 477") 20 weight parts, and toluene as a solvent were mixed to prepare a composition h for forming a gas generating layer. Table 1 shows the composition of the composition h for forming a gas generating layer.
[製造例8']氣體產生層形成用組合物i之製備 向甲苯中添加丙烯酸丁酯100重量份、丙烯酸5重量份、及作為聚合起始劑之過氧化苯甲醯0.2重量份後,加熱至70℃而獲得丙烯酸系共聚物(聚合物D)之甲苯溶液。 將聚合物D之甲苯溶液(聚合物D:100重量份)、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「TETRAD-C」)0.1重量份、及紫外線吸收劑(BASF公司製造,商品名「Tinuvin 400」)20重量份混合而製備氣體產生層形成用組合物i。將氣體產生層形成用組合物i之組成示於表1。 [Production Example 8'] Preparation of composition i for forming gas generating layer After adding 100 parts by weight of butyl acrylate, 5 parts by weight of acrylic acid, and 0.2 parts by weight of benzyl peroxide as a polymerization initiator to toluene, it was heated to 70° C. to obtain toluene of the acrylic copolymer (polymer D). solution. A toluene solution of polymer D (polymer D: 100 parts by weight), 0.1 part by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C"), and an ultraviolet absorber (manufactured by BASF Corporation) , trade name "Tinuvin 400") 20 parts by weight were mixed to prepare a composition i for forming a gas generating layer. Table 1 shows the composition of the composition i for forming a gas generating layer.
[製造例8'']氣體產生層形成用組合物j之製備 以與製造例5同樣之方式獲得丙烯酸系共聚物(聚合物B)之乙酸乙酯溶液。 將聚合物B之乙酸乙酯溶液(聚合物B:100重量份)、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「TETRAD-C」)0.1重量份、及紫外線吸收劑(BASF公司製造,商品名「Tinuvin400」)20重量份混合而製備氣體產生層形成用組合物j。將氣體產生層形成用組合物j之組成示於表1。 [Production Example 8″] Preparation of composition j for forming gas generating layer In the same manner as in Production Example 5, an ethyl acetate solution of the acrylic copolymer (polymer B) was obtained. An ethyl acetate solution of polymer B (polymer B: 100 parts by weight), 0.1 part by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C"), and an ultraviolet absorber (BASF The composition j for forming a gas generating layer was prepared by mixing 20 parts by weight of the company's product, trade name "Tinuvin 400". Table 1 shows the composition of the composition j for forming a gas generating layer.
[製造例8''']氣體產生層形成用組合物k之製備 向甲苯中添加丙烯酸丁酯50重量份、丙烯酸乙酯50重量份、丙烯酸5重量份、丙烯酸2-羥乙酯0.1重量份、三羥甲基丙烷三丙烯酸酯0.3重量份、及作為聚合起始劑之過氧化苯甲醯0.1重量份後,加熱至70℃而獲得丙烯酸系共聚物(聚合物E)甲苯溶液。 將聚合物E之甲苯溶液(聚合物E:100重量份)、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「TETRAD-C」)0.1重量份、及紫外線吸收劑(BASF公司製造,商品名「Tinuvin 400」)20重量份混合而製備氣體產生層形成用組合物k。將氣體產生層形成用組合物k之組成示於表1。 [Production Example 8″'] Preparation of composition k for forming gas generating layer To toluene were added 50 parts by weight of butyl acrylate, 50 parts by weight of ethyl acrylate, 5 parts by weight of acrylic acid, 0.1 part by weight of 2-hydroxyethyl acrylate, 0.3 part by weight of trimethylolpropane triacrylate, and as a polymerization starter After adding 0.1 part by weight of benzyl peroxide as the agent, it was heated to 70° C. to obtain an acrylic copolymer (polymer E) toluene solution. A toluene solution of polymer E (polymer E: 100 parts by weight), 0.1 part by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C"), and an ultraviolet absorber (manufactured by BASF Corporation) , trade name "Tinuvin 400") 20 parts by weight were mixed to prepare a composition k for forming a gas generating layer. Table 1 shows the composition of the composition k for forming a gas generating layer.
[製造例9]氣體產生層形成用組合物I之製備 作為UV吸收劑,使用2-[5-氯-2H-苯并三唑-2-基]-4-甲基-6-(第三丁基)苯酚(商品名「TINUVIN 326」,BASF公司製造)20重量份,除此以外,以與製造例1同樣之方式製備氣體產生層形成用組合物I。將氣體產生層形成用組合物I之組成示於表1。 [Production Example 9] Preparation of the composition I for forming a gas generating layer As a UV absorber, 2-[5-chloro-2H-benzotriazol-2-yl]-4-methyl-6-(tert-butyl)phenol (trade name "TINUVIN 326", manufactured by BASF Corporation was used ) 20 parts by weight, except that the composition I for forming a gas generating layer was prepared in the same manner as in Production Example 1. Table 1 shows the composition of the composition for forming a gas generating layer I.
[製造例10]含熱膨脹性微小球之組合物II之製備 不調配紫外線吸收劑,將交聯劑之調配量設為1.4重量份,且調配熱膨脹性微小球(松本油脂製藥公司製造,商品名「Matsumoto Microsphere F-50D」)30重量份、及萜酚系黏著賦予樹脂(住友電木公司製造,商品名「SUMILITERESIN PR51732」)10重量份,除此以外,以與製造例5同樣之方式製備含熱膨脹性微小球之組合物II。 [Production Example 10] Preparation of Composition II Containing Thermally Expandable Microspheres Without preparing the ultraviolet absorber, the blending amount of the crosslinking agent was 1.4 parts by weight, and 30 parts by weight of thermally expandable microspheres (manufactured by Matsumoto Oil Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50D"), and terpene phenol-based Thermally expandable microsphere-containing composition II was prepared in the same manner as in Production Example 5, except for 10 parts by weight of an adhesion-imparting resin (manufactured by Sumitomo Bakelite Co., Ltd., trade name "SUMILITERESIN PR51732").
[製造例11]含熱膨脹性微小球之組合物III之製備 代替萜酚系黏著賦予樹脂(住友電木公司製造,商品名「SUMILITERESIN PR51732」)10重量份,使用萜酚系黏著賦予樹脂(Yasuhara Chemical公司製造,商品名「YS POLYSTER T160」)20重量份,除此以外,以與製造例5同樣之方式製備含熱膨脹性微小球之組合物III。 [Production Example 11] Preparation of Composition III Containing Thermally Expandable Microspheres In place of 10 parts by weight of a terpene phenol-based tackifier resin (manufactured by Sumitomo Bakelite Co., Ltd., trade name "SUMILITERESIN PR51732"), 20 parts by weight of a terpene phenol-based tackifier resin (manufactured by Yasuhara Chemical Co., Ltd., trade name "YS POLYSTER T160") was used, Except for this, a thermally expandable microsphere-containing composition III was prepared in the same manner as in Production Example 5.
[表1]
[製造例12]黏著劑a之製備 以與製造例1同樣之方式獲得丙烯酸系共聚物(聚合物A)之甲苯溶液。 將聚合物A之甲苯溶液(聚合物A:100重量份)、異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)3重量份、及界面活性劑(花王公司製造,商品名「EXCEPARL IPP」)5重量份混合而製備黏著劑a。將黏著劑a之組成示於表2。 [Manufacturing example 12] Preparation of adhesive a In the same manner as in Production Example 1, a toluene solution of the acrylic copolymer (polymer A) was obtained. A toluene solution of polymer A (polymer A: 100 parts by weight), 3 parts by weight of an isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane, trade name "Coronate L"), and a surfactant (manufactured by Kao, trade name) "EXCEPARL IPP") was mixed with 5 parts by weight to prepare adhesive a. The composition of the adhesive a is shown in Table 2.
[製造例12']黏著劑b之製備 以與製造例6同樣之方式獲得丙烯酸系共聚物(聚合物C)之甲苯溶液。 將聚合物C之甲苯溶液(聚合物C:100重量份)、異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名「Coronate L」)3重量份、及環氧系交聯劑(三菱瓦斯化學公司製造,商品名「TETRAD-C」)1重量份混合而製備黏著劑b。將黏著劑b之組成示於表2。 [Manufacturing example 12'] Preparation of adhesive b In the same manner as in Production Example 6, a toluene solution of the acrylic copolymer (polymer C) was obtained. A toluene solution of polymer C (polymer C: 100 parts by weight), 3 parts by weight of an isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane, trade name "Coronate L"), and an epoxy-based crosslinking agent (Mitsubishi Gas Chemical) Company manufacture, brand name "TETRAD-C") 1 weight part was mixed to prepare adhesive b. The composition of the adhesive b is shown in Table 2.
[製造例13]黏著劑I之製備 將交聯劑之調配量設為1重量份,且不含有界面活性劑,除此以外,以與製造例12同樣之方式製備黏著劑I。將黏著劑I之組成示於表2。 [Manufacturing Example 13] Preparation of Adhesive I Adhesive I was prepared in the same manner as in Production Example 12, except that the blending amount of the crosslinking agent was 1 part by weight and the surfactant was not contained. The composition of Adhesive I is shown in Table 2.
[表2]
[製造例14]中間層形成用組合物a之製備 以與製造例5同樣之方式獲得丙烯酸系共聚物(聚合物B)之乙酸乙酯溶液。 將聚合物B之乙酸乙酯溶液(聚合物B:100重量份)、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「Tetrad C」)1重量份、UV低聚物(三菱化學公司製造,商品名「紫光UV-1700B」)50重量份、及光聚合起始劑(BASF公司製造,商品名「Omnirad 127」)3重量份混合而製備中間層形成用組合物a。將中間層形成用組合物a之組成示於表3。 [Production Example 14] Preparation of the composition a for forming an intermediate layer In the same manner as in Production Example 5, an ethyl acetate solution of the acrylic copolymer (polymer B) was obtained. An ethyl acetate solution of polymer B (polymer B: 100 parts by weight), 1 part by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrad C"), a UV oligomer (Mitsubishi Chemical The composition a for intermediate layer formation was prepared by mixing 50 parts by weight of the company's product, trade name "violet UV-1700B", and 3 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name "Omnirad 127"). The composition of the composition a for intermediate layer formation is shown in Table 3.
[製造例15]中間層形成用組合物b之製備 將順丁烯二酸改性苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS:苯乙烯部位/乙烯-丁烯部位(重量比)=30/70,酸值:10(mg-CH 3ONa/g),旭化成化學公司製造,商品名「Tuftec M1913」)100重量份、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「TETRAD-C」)3重量份、脂肪酸酯系界面活性劑(花王公司製造,商品名「EXCEPARL IPP」,分子量:298.5,烷基之碳數:16)3重量份、及作為溶劑之甲苯混合而獲得中間層形成用組合物b。將中間層形成用組合物b之組成示於表3。 [Production Example 15] Preparation of composition b for intermediate layer formation Maleic acid-modified styrene-ethylene-butylene-styrene block copolymer (SEBS: styrene moiety/ethylene-butene moiety (weight ratio) = 30/70, acid value: 10 (mg-CH 3 ONa/g), manufactured by Asahi Kasei Chemical Co., Ltd., trade name "Tuftec M1913") 100 parts by weight, epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., Trade name "TETRAD-C") 3 parts by weight, fatty acid ester surfactant (manufactured by Kao Corporation, trade name "EXCEPARL IPP", molecular weight: 298.5, carbon number of alkyl group: 16) 3 parts by weight, and as a solvent and mixed with toluene to obtain a composition b for forming an intermediate layer. Table 3 shows the composition of the composition b for forming an intermediate layer.
[表3]
[實施例1] 將製造例1中獲得之氣體產生層形成用組合物a以溶劑揮發(乾燥)後之厚度成為7 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(東麗公司製造,商品名「Cerapeel」厚度:38 μm),其後進行乾燥,而獲得於該聚對苯二甲酸乙二酯膜上僅包含氣體產生層之黏著片材。 將所得之黏著片材供於上述評價(1)~(13)。將結果示於表4。 [Example 1] The composition a for forming a gas generating layer obtained in Production Example 1 was applied to a polyethylene terephthalate with a silicone release agent-treated surface so that the thickness after volatilization (drying) of the solvent was 7 μm. A film (manufactured by Toray Industries, Ltd., trade name "Cerapeel" thickness: 38 μm) was then dried to obtain an adhesive sheet comprising only a gas generating layer on the polyethylene terephthalate film. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 4.
[實施例2] 將製造例12中獲得之黏著劑a以溶劑揮發(乾燥)後之厚度成為15 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(厚度:75 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成黏著劑層前驅層a。 將製造例1中獲得之氣體產生層形成用組合物a以溶劑揮發(乾燥)後之厚度成為7 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(東麗公司製造,商品名「Cerapeel」厚度:38 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成氣體產生層前驅層a。 將上述黏著劑層前驅層a與上述氣體產生層前驅層a於輥間層壓而貼合,獲得夾於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜之間的黏著片材(黏著劑層/氣體產生層)。 將所得之黏著片材供於上述評價(1)~(13)。將結果示於表4。 [Example 2] The adhesive a obtained in Production Example 12 was applied to a polyethylene terephthalate film (thickness: 75 μm) with a silicone release agent-treated surface so that the thickness after the solvent was volatilized (dried) became 15 μm. μm), followed by drying to form an adhesive layer precursor layer a on the polyethylene terephthalate film. The composition a for forming a gas generating layer obtained in Production Example 1 was applied to a polyethylene terephthalate with a silicone release agent-treated surface so that the thickness after volatilization (drying) of the solvent was 7 μm. A film (manufactured by Toray Industries, Ltd., trade name "Cerapeel" thickness: 38 μm) was dried to form a gas generating layer precursor layer a on the polyethylene terephthalate film. The above-mentioned adhesive layer precursor layer a and the above-mentioned gas generating layer precursor layer a are laminated between rolls and bonded to obtain a film sandwiched between polyethylene terephthalate films with a silicone release agent-treated surface. Adhesive sheet (adhesive layer/gas generating layer). The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 4.
[實施例3] 將製造例12中獲得之黏著劑a以溶劑揮發(乾燥)後之厚度成為15 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(厚度:75 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成黏著劑層前驅層a。 將製造例14中獲得之中間層形成用組合物a以溶劑揮發(乾燥)後之厚度成為15 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(東麗公司製造,商品名「Cerapeel」厚度:38 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成中間層前驅層a。 繼而,將上述黏著劑層前驅層a與上述中間層前驅層a於輥間層壓而貼合,自中間層前驅層側於500 mJ/cm 2之條件下進行UV照射,而獲得夾於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜之間的積層體前驅層a。 將製造例1中獲得之氣體產生層形成用組合物a以溶劑揮發(乾燥)後之厚度成為7 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(東麗公司製造,商品名「Cerapeel」厚度:38 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成氣體產生層前驅層a。 將上述積層體前驅層a之中間層前驅層a側之帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜剝離後,將積層體前驅層a之中間層前驅層a與上述氣體產生層前驅層a於輥間層壓而貼合,獲得夾於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜之間的黏著片材(黏著劑層/中間層/氣體產生層)。 將所得之黏著片材供於上述評價(1)~(13)。將結果示於表4。 [Example 3] The adhesive a obtained in Production Example 12 was coated on a polyethylene terephthalate with a silicone release agent-treated surface so that the thickness after volatilization (drying) of the solvent was 15 μm film (thickness: 75 μm), and then dried to form an adhesive layer precursor layer a on the polyethylene terephthalate film. The composition a for forming an intermediate layer obtained in Production Example 14 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface so that the thickness after volatilization (drying) of the solvent was 15 μm. (Made by Toray Industries, Ltd., trade name "Cerapeel" Thickness: 38 μm), after that, drying was performed to form an intermediate layer precursor layer a on the polyethylene terephthalate film. Then, the above-mentioned adhesive layer precursor layer a and the above-mentioned intermediate layer precursor layer a are laminated between rolls and bonded, and UV irradiation is performed from the intermediate layer precursor layer side under the condition of 500 mJ/cm 2 to obtain a sandwiched belt. Laminate precursor layer a between polyethylene terephthalate films with silicone release agent treated surfaces. The composition a for forming a gas generating layer obtained in Production Example 1 was applied to a polyethylene terephthalate with a silicone release agent-treated surface so that the thickness after volatilization (drying) of the solvent was 7 μm. A film (manufactured by Toray Industries, Ltd., trade name "Cerapeel" thickness: 38 μm) was dried to form a gas generating layer precursor layer a on the polyethylene terephthalate film. After peeling off the polyethylene terephthalate film with the silicone release agent-treated surface on the intermediate layer precursor layer a side of the laminate precursor layer a, the intermediate layer precursor layer a of the laminate precursor layer a and The gas generating layer precursor layer a is laminated between rolls and bonded to obtain an adhesive sheet (adhesive layer/intermediate) sandwiched between polyethylene terephthalate films with a silicone release agent-treated surface. layer/gas generating layer). The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 4.
[實施例4] 將製造例12中獲得之黏著劑a以溶劑揮發(乾燥)後之厚度成為15 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(厚度:75 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成黏著劑層前驅層a。 將製造例15中獲得之中間層形成用組合物b以溶劑揮發(乾燥)後之厚度成為15 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(東麗公司製造,商品名「Cerapeel」厚度:38 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成中間層前驅層a。 繼而,將上述黏著劑層前驅層a與上述中間層前驅層b於輥間層壓而貼合,獲得夾於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜之間的積層體前驅層b。 將製造例1中獲得之氣體產生層形成用組合物a以溶劑揮發(乾燥)後之厚度成為7 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(東麗公司製造,商品名「Cerapeel」厚度:38 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成氣體產生層前驅層a。 將上述積層體前驅層b之中間層前驅層b側之帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜剝離後,將積層體前驅層b之中間層前驅層b與上述氣體產生層前驅層a於輥間層壓而貼合,獲得夾於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜之間的黏著片材(黏著劑層/中間層/氣體產生層)。 將所得之黏著片材供於上述評價(1)~(13)。將結果示於表4。 [Example 4] The adhesive a obtained in Production Example 12 was applied to a polyethylene terephthalate film (thickness: 75 μm) with a silicone release agent-treated surface so that the thickness after the solvent was volatilized (dried) became 15 μm. μm), followed by drying to form an adhesive layer precursor layer a on the polyethylene terephthalate film. The composition b for forming an intermediate layer obtained in Production Example 15 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface so that the thickness after volatilization (drying) of the solvent was 15 μm. (Made by Toray Industries, Ltd., trade name "Cerapeel" Thickness: 38 μm), after that, drying was performed to form an intermediate layer precursor layer a on the polyethylene terephthalate film. Then, the above-mentioned adhesive layer precursor layer a and the above-mentioned intermediate layer precursor layer b are laminated between rolls and bonded to obtain sandwiched between the polyethylene terephthalate films with the silicone release agent-treated surface. The laminate precursor layer b. The composition a for forming a gas generating layer obtained in Production Example 1 was applied to a polyethylene terephthalate with a silicone release agent-treated surface so that the thickness after volatilization (drying) of the solvent was 7 μm. A film (manufactured by Toray Industries, Ltd., trade name "Cerapeel" thickness: 38 μm) was dried to form a gas generating layer precursor layer a on the polyethylene terephthalate film. After peeling off the polyethylene terephthalate film with the silicone release agent-treated surface on the intermediate layer precursor layer b side of the laminate precursor layer b, the intermediate layer precursor layer b of the laminate precursor layer b and The gas generating layer precursor layer a is laminated between rolls and laminated to obtain an adhesive sheet (adhesive layer/intermediate) sandwiched between polyethylene terephthalate films with a silicone release agent-treated surface. layer/gas generating layer). The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 4.
[實施例5] 將製造例12中獲得之黏著劑a以溶劑揮發(乾燥)後之厚度成為15 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(厚度:75 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成黏著劑層前驅層a。 將製造例1中獲得之氣體產生層形成用組合物a以溶劑揮發(乾燥)後之厚度成為7 μm之方式塗佈於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜(東麗公司製造,商品名「Cerapeel」厚度:38 μm),其後進行乾燥,而於該聚對苯二甲酸乙二酯膜上形成氣體產生層前驅層a。 將上述黏著劑層前驅層a於輥間層壓而貼合於聚對苯二甲酸乙二酯膜(東麗公司製造,商品名「Lumirror#2F51N」厚度:2 μm)之單側。 繼而,將氣體產生層前驅層a於輥間層壓而貼合於上述聚對苯二甲酸乙二酯膜之與黏著劑層前驅層a相反之側。 以此方式獲得夾於帶有矽酮脫模劑處理面之聚對苯二甲酸乙二酯膜之間的黏著片材(黏著劑層/中間層/氣體產生層)。 將所得之黏著片材供於上述評價(1)~(13)。將結果示於表4。 [Example 5] The adhesive a obtained in Production Example 12 was applied to a polyethylene terephthalate film (thickness: 75 μm) with a silicone release agent-treated surface so that the thickness after the solvent was volatilized (dried) became 15 μm. μm), followed by drying to form an adhesive layer precursor layer a on the polyethylene terephthalate film. The composition a for forming a gas generating layer obtained in Production Example 1 was applied to a polyethylene terephthalate with a silicone release agent-treated surface so that the thickness after volatilization (drying) of the solvent was 7 μm. A film (manufactured by Toray Industries, Ltd., trade name "Cerapeel" thickness: 38 μm) was dried to form a gas generating layer precursor layer a on the polyethylene terephthalate film. The above-mentioned adhesive layer precursor layer a was laminated between rolls and attached to one side of a polyethylene terephthalate film (manufactured by Toray Industries, Ltd., trade name "Lumirror #2F51N" thickness: 2 μm). Next, the gas generating layer precursor layer a was laminated between rolls and attached to the opposite side of the adhesive layer precursor layer a of the polyethylene terephthalate film. In this way, an adhesive sheet (adhesive layer/intermediate layer/gas generating layer) sandwiched between the polyethylene terephthalate films with the silicone release agent-treated surface was obtained. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 4.
[實施例6] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物b,除此以外,以與實施例5同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表5。 [Example 6] An adhesive sheet was obtained in the same manner as in Example 5, except that the composition b for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 5.
[實施例7] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物c,除此以外,以與實施例5同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表5。 [Example 7] An adhesive sheet was obtained in the same manner as in Example 5, except that the composition c for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 5.
[實施例8] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物d,除此以外,以與實施例5同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表5。 [Example 8] An adhesive sheet was obtained in the same manner as in Example 5, except that the composition d for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 5.
[實施例9] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物e,除此以外,以與實施例5同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表5。 [Example 9] An adhesive sheet was obtained in the same manner as in Example 5, except that the composition e for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 5.
[實施例10] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物f,除此以外,以與實施例5同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表5。 [Example 10] An adhesive sheet was obtained in the same manner as in Example 5, except that the composition f for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 5.
[實施例11] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物g,除此以外,以與實施例1同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價。將結果示於表6。 [Example 11] An adhesive sheet was obtained in the same manner as in Example 1, except that the composition g for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above evaluation. The results are shown in Table 6.
[實施例12] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物h,除此以外,以與實施例1同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價。將結果示於表6。 [Example 12] An adhesive sheet was obtained in the same manner as in Example 1, except that the composition h for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above evaluation. The results are shown in Table 6.
[表4]
[表5]
[表6]
[比較例1] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物I,除此以外,以與實施例1同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表7。 [Comparative Example 1] An adhesive sheet was obtained in the same manner as in Example 1, except that the composition for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 7.
[比較例2] 代替氣體產生層形成用組合物a而使用氣體產生層形成用組合物I,除此以外,以與實施例5同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表7。 [Comparative Example 2] An adhesive sheet was obtained in the same manner as in Example 5, except that the composition for forming a gas generating layer was used instead of the composition a for forming a gas generating layer. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 7.
[比較例3] 代替黏著劑a而使用黏著劑I,將黏著劑層之厚度設為10 μm,使用厚度188 μm之PET膜作為中間層,代替氣體產生層形成用組合物a而使用含熱膨脹性微小球之組合物II形成48 μm之氣體產生層,除此以外,以與實施例5同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表7。 [Comparative Example 3] In place of the adhesive a, the adhesive I was used, the thickness of the adhesive layer was 10 μm, a PET film with a thickness of 188 μm was used as the intermediate layer, and the composition containing thermally expandable microspheres was used instead of the composition a for forming a gas generating layer. An adhesive sheet was obtained in the same manner as in Example 5, except that a gas generating layer of 48 μm was formed in Compound II. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 7.
[比較例4] 代替黏著劑a而使用黏著劑I,將黏著劑層之厚度設為10 μm,使用厚度100 μm之PET膜作為中間層,代替氣體產生層形成用組合物a而使用含熱膨脹性微小球之組合物III形成48 μm之氣體產生層,除此以外,以與實施例5同樣之方式獲得黏著片材。將所得之黏著片材供於上述評價(1)~(13)。將結果示於表7。 [Comparative Example 4] The adhesive agent I was used instead of the adhesive agent a, the thickness of the adhesive agent layer was 10 μm, the PET film with a thickness of 100 μm was used as the intermediate layer, and the composition containing heat-expandable microspheres was used instead of the composition a for forming a gas generating layer. An adhesive sheet was obtained in the same manner as in Example 5, except that the gas generating layer of 48 μm was formed in Compound III. The obtained adhesive sheet was used for the above-mentioned evaluations (1) to (13). The results are shown in Table 7.
[表7]
4:樣品
5A,5B:試樣保持器
6:壓縮試驗機
10:氣體產生層
20:黏著劑層
30:中間層
100,100',200:黏著片材
4:
圖1(a)、(b)係本發明之一實施方式之黏著片材之概略剖視圖。 圖2係本發明之其他實施方式之黏著片材之概略剖視圖。 圖3係對穿刺強度之測定方法進行說明之概略圖。 1(a) and (b) are schematic cross-sectional views of an adhesive sheet according to an embodiment of the present invention. 2 is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention. Fig. 3 is a schematic diagram for explaining a method of measuring puncture strength.
10:氣體產生層 10: Gas generating layer
20:黏著劑層 20: Adhesive layer
100,100':黏著片材 100,100': Adhesive sheet
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CN (1) | CN114846098A (en) |
TW (2) | TWI824509B (en) |
WO (1) | WO2021124855A1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2024015735A (en) * | 2022-07-25 | 2024-02-06 | 株式会社レゾナック | Film for temporary fixing, laminate for temporary fixing, manufacturing method of semiconductor device, and composition for temporary fixing |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6151140A (en) * | 1984-08-21 | 1986-03-13 | Fuji Photo Film Co Ltd | Heat developable photosensitive material |
JP3594853B2 (en) | 1999-11-08 | 2004-12-02 | 日東電工株式会社 | Heat release adhesive sheet |
JP2004186200A (en) * | 2002-11-29 | 2004-07-02 | Sekisui Chem Co Ltd | Method of manufacturing semiconductor chip |
JP2010202833A (en) * | 2009-03-05 | 2010-09-16 | Sekisui Chem Co Ltd | Adhesive tape for processing electronic element |
JPWO2011118488A1 (en) * | 2010-03-24 | 2013-07-04 | 積水化学工業株式会社 | Adhesive composition and adhesive tape |
JP2013159743A (en) * | 2012-02-07 | 2013-08-19 | Nitto Denko Corp | Method for peeling pressure-sensitive adhesive agent laminate and pressure-sensitive adhesive agent layer used therein |
JP6054208B2 (en) * | 2013-03-04 | 2016-12-27 | 日東電工株式会社 | Thermally peelable adhesive sheet |
JP7088736B2 (en) * | 2017-10-06 | 2022-06-21 | 積水化学工業株式会社 | Surface protection film |
KR20210021063A (en) * | 2018-09-10 | 2021-02-24 | 쇼와 덴코 가부시키가이샤 | Adhesive sheet |
-
2020
- 2020-11-30 CN CN202080088628.5A patent/CN114846098A/en active Pending
- 2020-11-30 WO PCT/JP2020/044512 patent/WO2021124855A1/en active Application Filing
- 2020-11-30 JP JP2021565431A patent/JPWO2021124855A1/ja active Pending
- 2020-11-30 KR KR1020227020301A patent/KR20220117232A/en unknown
- 2020-12-16 TW TW111117102A patent/TWI824509B/en active
- 2020-12-16 TW TW109144492A patent/TWI767453B/en active
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TW202126767A (en) | 2021-07-16 |
TWI824509B (en) | 2023-12-01 |
KR20220117232A (en) | 2022-08-23 |
CN114846098A (en) | 2022-08-02 |
JPWO2021124855A1 (en) | 2021-06-24 |
TWI767453B (en) | 2022-06-11 |
WO2021124855A1 (en) | 2021-06-24 |
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