TW202229890A - Temperature management method based on automatic test equipment - Google Patents

Abstract

A temperature management method based on automatic test equipment includes: establishing a mathematic model; performing simulation; analyzing a predicted result, and determining whether temperature is uniform and stable, if the temperature is uniform and stable, performing the last step, or if the temperature is not uniform and stable, performing the next step; deriving a new plan for adjusting a rotation speed of a fan; checking whether a difference exists between the new plan and the previous plan, if the difference exists, performing the last step, or if the difference does not exist, performing the next step; setting the new plan as a new element condition and performing the previous steps again; and storing the current plan for adjusting the rotation speed of the fan as a final plan.

Description

Temperature management method based on automatic testing machine

The invention relates to the technical field of semiconductor testing, in particular to a temperature management method based on an automatic testing machine.

Semiconductor automatic test machines provide a large number of test pins. A set of test circuits of a certain kind is connected behind each pin. The test pins are connected to the pins of the tested chip one-to-one. The test machine runs the test program, generates a predefined excitation signal to the input pins of the tested chip, and measures the voltage and current responses of all the connected pins of the chip. , to determine whether it meets expectations.

During this process, a large amount of heat generated by the test circuit inside the machine needs to be discharged in time. In order to ensure the safety of the equipment, the system heat dissipation design is often designed according to the maximum theoretical heat generation. Due to the modular design, each sub-module must be designed according to the worst scenario. The price is increased structural design difficulty, system volume, weight, fan noise and other issues. But in fact, the actual heating situation is highly correlated with the test program. If the heating conditions of different spaces inside the test machine can be predicted according to the test program, the test program can be optimized to balance the heat inside the machine, and there is a chance that the hardware design does not design heat dissipation according to the maximum theoretical heat generation, but finds the test program. When unreasonable causes local overheating, a warning is issued, and the test program is optimized to meet the cooling constraints of the system.

During the running process of the whole test program, the voltage and current laws of each test pin of the test machine are clearly expected. If the wafer under test behaves exactly as expected, the power consumption of the test circuit behind each pin of the test bench is also completely predictable.

In order to overcome the deficiencies of the prior art, the present invention provides a temperature management method based on an automatic testing machine. According to a series of mathematical modeling and simulation calculations, the optimal temperature management scheme is reasonably derived to prolong the service life of the automatic testing.

In order to achieve the above purpose, a temperature management method based on automatic testing machine is designed, including:

Step 1: According to the method of establishing a mathematical model and combining various element conditions, establish a mathematical model for systematically distributed temperature prediction;

Step 2: carry out simulation calculation according to the mathematical model, and obtain the prediction result of the distributed temperature change of the system;

Step 3: Analyze the prediction result, and judge whether the temperature of the automatic testing machine is uniform and stable. If the temperature is uniform, go to Step 7, otherwise, go to the next step;

Step 4: According to the prediction results, deduce the optimization scheme of fan speed adjustment;

Step 5: Compare whether there is a difference between the new optimization scheme and the last optimization scheme, if there is no difference, go to step 7, otherwise go to the next step 6;

Step 6: Re-execute steps 1 to 5 with the fan speed of the optimization scheme as the new factor condition, and the other factor conditions remain unchanged; and

Step 7: Save the current fan speed control scheme as the final optimization scheme.

The described method for establishing a mathematical model, the specific process is as follows:

Step 1-1: Combine the characteristics of the unit circuit, analyze the test program, and obtain the values of the transient output voltage and transient output current of the unit circuit;

Step 1-2: establish a transient power consumption model of the unit circuit;

Step 1-3: establish a power consumption model of the unit circuit;

Steps 1-4: Establish a single-module two-dimensional (2D) power consumption model;

Steps 1-5: A single-module three-dimensional (3D) finite element temperature model is established by combining the heat conduction model and the air cooling model; and

Steps 1-6: Build a 3D finite element temperature model of the system.

The specific method of the step 1-1 is as follows:

(1) Can combine the characteristics of the unit circuit, analyze the test program, and obtain the value of the transient output voltage and transient output current of the unit circuit;

(2) According to the design of the automatic testing machine, for 9 types of unit circuits, the names are Pin Electric Channel (PE), Component Power Channel (DPS), Parameter Measurement Unit (PMU), High Voltage Channel (HV), High-speed Arbitrary Waveform Generation (HSAWG), high-resolution arbitrary waveform generator (HRAWG), frequency measurement unit (FMU), high-speed digital converter (HSDTZ), high-resolution digital converter (HRDTZ);

(3) There are several known or standard parameters for the specifications of the chip under test, from which the component power supply voltage (VDD), component power supply current (IDD), and load resistance (Rload) are exported;

(4) For the unit circuit named Pin Electric Channel (PE), which is the main heat source of the automatic testing machine, the transient output voltage and transient output can be obtained by applying the Pin Electric Channel (PE) transient working model the value of the current;

(5) For the unit circuit named the component power supply channel (DPS), the transient output voltage is the component power supply voltage Vout=VDD, and the transient output current is the component power supply current;

(6) For the unit circuits named Parameter Measurement Unit (PMU), High Voltage Channel (HV), High Speed Arbitrary Waveform Generator (HSAWG) and High Resolution Arbitrary Waveform Generator (HRAWG), the transient output voltage is directly determined by the test Program import, that is, the test program will clearly set the transient output voltage when using these unit circuits, and the transient output current is the transient output voltage divided by the load resistance; and

(7) For the unit circuits named frequency measurement unit (FMU), high-speed digital converter (HSDTZ), and high-resolution digital converter (HRDTZ), the transient output voltage is 0, and the transient output current is 0.

The specific methods of the steps 1-2 are as follows:

(1) Set the equivalent output resistance inside the unit circuit;

(2) Calculate the calorific value of the equivalent output resistance: it is known that the power supply voltage of the unit circuit is Vps, the transient output voltage is Vout, and the transient output current is Iout, then the transient power consumption of Rs is P_Rs=(Vps-Vout ) × Iout; and

(3) The formula of the transient power consumption model of the unit circuit: heating power consumption = static power consumption + dynamic heating power consumption = static power consumption + (power supply voltage - output voltage) × output current, that is, Psump = Ws + (Vps - Vout ) × Iout, where Psump is the heating power consumption, Ws is the static power consumption of the circuit, Vps is the power supply voltage of the test circuit, Vout is the output voltage of the test circuit, and Iout is the output current.

The specific methods of the steps 1-3 are as follows:

(1) According to the transient power consumption model of the unit circuit, take the period of the main clock pulse of the test program as the time unit, and convert the time change curve of the heating power consumption of the unit circuit according to the output voltage function and the output current function;

(2) Perform power integration in units of time windows, reduce the time resolution of the time-varying curve of heating power consumption, reduce the amount of data, and obtain a lookup data table that can retrieve the heating power consumption of the unit at any time; and

(3) Combine and output the lookup data table of heating power consumption of all unit circuits of the entire automatic testing machine, and obtain a lookup data table that can index the heating power consumption of all unit circuits of the system at all times.

The specific methods of the steps 1-4 are as follows:

(1) Simplify each module as a sheet rectangle, and build a 2D model for this;

(2) The rectangular area of each sheet rectangle is divided into a small rectangle of m*n, and the division density is determined according to the area and layout characteristics of the unit circuit on the module;

(3) Assign a number to each small rectangle according to the coordinates, establish an index table, and the data stored in the table is the unit circuit to which the rectangle belongs;

(4) The average occupied area of each type of unit circuit is calibrated, divided by the area of the finite element, and converted to the number of finite elements; and

(5) According to the reference data table of the heating power consumption obtained by the power consumption model of the unit circuit, find the power consumption of each type of unit circuit, divide it by the number of its finite elements, and calculate the power consumption of each finite element .

The specific methods of the steps 1-5 are as follows:

(1) According to the thickness of the module, the 2D model of the power consumption model of the unit module is simply expanded into a 3D model, that is, all 2D finite elements are added with a unified height parameter and converted into 3D finite elements;

(2) Calculated according to the following formula: temperature change per unit finite element = heat change per unit time / heat capacity per unit finite element;

(3) Calculated according to the following formula: heat change per unit time = self-heating of unit finite element + heat conduction between unit finite element and adjacent finite elements + heat change caused by air-cooled airflow;

(4) Calculated according to the following formula: self-heating of unit finite element = heating power consumption per unit of finite element * unit time;

(5) Calculated according to the following formula: heat conduction between unit finite element and adjacent finite elements = ∑ temperature difference between adjacent finite elements * heat conduction coefficient * unit time;

(6) Calculated according to the following formula: heat change caused by fan airflow = airflow temperature difference * airflow heat exchange coefficient * airflow flux * unit finite element cross-sectional area; and

(7) Calculated according to the following formula: airflow flux = percentage of fan speed * maximum air volume of fan / cross-sectional area of air duct occupied by fan.

The specific methods of the steps 1-6 are as follows:

(1) Treat the system as a blade architecture, treat each module as the same shape, and combine the unit module 3D finite element temperature model into a system 3D finite element according to the spatial arrangement of each module in the system. element temperature model;

(2) Remove the shell, power supply module and other auxiliary structures of the system to simplify the model.

The specific method of the step 4 is as follows:

(1) Set the adjustment coefficient of the fan speed corresponding to the temperature change, the initial value is set to 1%/℃, that is, the adjustment amount of the fan speed per degree Celsius is 1%;

(2) Set the fan pre-adjustment time advance to 5 seconds;

(3) Calculation results of distributed temperature prediction using finite element simulation calculation;

(4) Calculate the time curve of the average temperature of all finite elements involved in the airflow channel corresponding to each fan from the results;

(5) Multiply the difference between the time curve of the average temperature and the target stable temperature by the fan speed adjustment coefficient, and convert it into a time curve of the fan speed adjustment;

(6) Advance the fan speed adjustment curve by 5 seconds on the time axis, and then add it to the last fan speed control curve to generate a new fan speed control curve; if the value is greater than 100%, the limit is 100% and less than 0 then the limit is 0; and

(7) Apply method steps (1) to (6) to all fans to generate new speed control curves for all fans.

Compared with the prior art, the present invention provides a temperature management method based on an automatic testing machine. According to a series of mathematical modeling and simulation calculations, the optimal temperature management scheme can be reasonably derived to prolong the service life of the automatic testing.

The present invention will be further described below according to the accompanying drawings.

A temperature management method based on an automatic testing machine, the specific process is as follows:

Step 1: According to the method of establishing a mathematical model and combining various element conditions, establish a mathematical model for systematically distributed temperature prediction;

Step 2: carry out simulation calculation according to the mathematical model, and obtain the prediction result of the distributed temperature change of the system;

Step 3: Analyze the prediction result and judge whether the temperature is uniform and stable. If the temperature is uniform, go to Step 7, otherwise, go to the next step;

Step 4: According to the prediction results, deduce the optimization scheme of fan speed adjustment;

(1) Set the adjustment coefficient of the fan speed corresponding to the temperature change, the initial value is set to 1%/℃, that is, the adjustment amount of the fan speed per degree Celsius is 1%;

(2) Set the fan pre-adjustment time advance to 5 seconds;

(3) Calculation results of distributed temperature prediction using finite element simulation calculation;

(4) Calculate the time curve of the average temperature of all finite elements involved in the airflow channel corresponding to each fan from the results;

(5) Multiply the difference between the time curve of the average temperature and the target stable temperature by the fan speed adjustment coefficient, and convert it into a time curve of the fan speed adjustment;

(6) Advance the fan speed adjustment curve by 5 seconds on the time axis, and then add it to the last fan speed control curve to generate a new fan speed control curve; if the value is greater than 100%, the limit is 100% and less than 0 then the limit is 0;

(7) Apply method steps (1) to (6) to all fans to generate new speed control curves for all fans.

Step 5: Compare whether there is a difference between the new optimization scheme and the last optimization scheme, if there is no difference, then jump to step 7, otherwise go to the next step;

Step 6: Take the fan speed of the optimization scheme as the new factor condition, and the other factor conditions remain unchanged, and perform steps 1 to 5 again;

Step 7: Save the current fan speed control scheme as the final optimization scheme. When the system is actually running, the speed of each fan inside the machine is controlled according to this scheme, so as to achieve the effect of uniform and stable temperature inside the test machine.

As shown in FIG. 1, the method 100 for establishing a mathematical model, the specific process is as follows:

Step 1: Combine the characteristics of the unit circuit, analyze the test program, and obtain the transient Vout and Iout values of the unit circuit;

(1) It can analyze the test program in combination with the characteristics of the unit circuit, and obtain the values of the transient output voltage Vout and the transient output current Iout of the unit circuit;

(2) According to the design of the automatic testing machine, for 9 types of unit circuits, the names are Pin Electric Channel (PE), Component Power Channel (DPS), Parameter Measurement Unit (PMU), High Voltage Channel (HV), High-speed Arbitrary Waveform Generation (HSAWG), high-resolution arbitrary waveform generator (HRAWG), frequency measurement unit (FMU), high-speed digital converter (HSDTZ), high-resolution digital converter (HRDTZ);

(3) There are several known or standard parameters for the specifications of the chip under test, from which the component power supply voltage (VDD), component power supply current (IDD), and load resistance (Rload) are exported;

(4) For the unit circuit named Pin Electric Channel (PE), which is the main heating source of the automatic testing machine, the transient output voltage Vout and transient output current Iout are obtained by applying the PE transient working model; There are several known or standard parameters for the specifications of the chip under test, from which the parameters of each pin of the chip under test can be exported: 0-state input voltage (VIL), 0-state input current (IIL), 1-state input voltage (VIH), 1-state input current (IIH), 1-state output voltage (VOH), 1-state output current (IOH), 0-state output voltage (VOL), 0-state output current (IOL), as shown in Figure 2. The pin electric channel (PE) has defined 6 working states: 0, 1, C, K, H, L. The meanings of the above working states are output 0, output 1, output positive pulse, output negative pulse, detect 1, detect 0. Each step of the test program sets the state of the PE and executes one clock cycle, so in each clock cycle, the PE will be in one of the states. The transient output voltage Vout and the transient output current Iout in various states are given by the table shown in FIG. 2 .

(5) For the unit circuit named component power supply channel (DPS), the transient output voltage Vout=VDD, and the transient output current Iout=IDD;

(6) For the unit circuits named parameter measurement unit (PMU), high voltage channel (HV), high-speed arbitrary waveform generator (HSAWG) and high-resolution arbitrary waveform generator (HRAWG), Vout is directly imported by the test program, That is, the test program will clearly set the transient output voltage Vout when using these unit circuits, and the transient output current is the transient output voltage divided by the load resistance (ie Iout=Vout/Rload);

(7) For the unit circuits named frequency measurement unit (FMU), high-speed digital converter (HSDTZ), and high-resolution digital converter (HRDTZ), the transient output voltage Vout=0, and the transient output current Iout=0;

Step 2: Establish the transient power consumption model of the unit circuit;

(1) As shown in Figure 3, for the equivalent circuit of the power consumption model of each type of unit circuit, set the equivalent output resistance inside the unit circuit as Rs;

(2) Calculate the calorific value of the equivalent output resistance Rs: given the supply voltage Vps of the unit circuit, the transient output voltage Vout, and the transient output current Iout, the transient power consumption of the equivalent output resistance Rs is P_Rs=(Vps -Vout) × Iout;

(3) Use the following formula to establish the transient power consumption model of the unit circuit: heating power consumption = static power consumption + dynamic heating power consumption = static power consumption + (supply voltage - output voltage) × output current, that is, Psump=Ws+( Vps-Vout) × Iout, where Psump is the heating power consumption, Ws is the static power consumption of the circuit, Vps is the power supply voltage of the test circuit, Vout is the output voltage of the test circuit, and Iout is the output current. Among them, Ws and Vps are fixed values, which are only related to the type of test circuit and have nothing to do with the test program. The test machine has calibrated the power consumption model parameters of each type of unit circuit in advance and saved them as constants. The specific example is shown in the table in Figure 4. The specific calibration process of Vps is obtained by direct measurement with a voltmeter. The specific calibration process of Ws is to switch the unit circuit between the power-off state and the static working state, and see the change in the total power consumption of the system.

Step 3: Establish a unit circuit power consumption model;

(1) According to the transient power consumption model of the unit circuit, take the period of the main clock pulse of the test program as the time unit, and convert it into the heating power consumption of the unit circuit according to the output voltage function Vout(t) and the output current function Iout(t) Time curve of Psump(t);

(2) Perform power integration in the unit of time window (preset 1 second), reduce the time resolution of thermal power consumption Psump(t), reduce the amount of data, and obtain a lookup data table that can retrieve the thermal power consumption of the unit at any time ;

(3) Combine and output the lookup data table of heating power consumption of all unit circuits of the entire automatic testing machine, and obtain a lookup data table that can index the heating power consumption of all unit circuits of the system at all times.

Step 4: Establish a single-module 2D (two-dimensional space) power consumption model;

(1) Simplify each module as a sheet rectangle, and build a 2D model for this;

(2) The rectangular area is divided into m*n small rectangles, and the division density is determined according to the area and layout characteristics of the unit circuit on the module;

(3) Assign numbers to each small rectangle according to the coordinates, and establish an index table. The data stored in the table are the unit circuits to which the rectangle belongs (including circuit types and specific numbers);

(4) The average occupied area of each type of unit circuit is calibrated, divided by the area of the finite element, and converted into the number of finite elements;

(5) Find the power consumption of each type of unit circuit based on the reference data table of the heating power consumption obtained from the power consumption model of the unit circuit, and then divide it by the number of its finite elements to calculate the power of each finite element. consumption.

For example, the transition from a unit circuit power consumption model to a single module power consumption model is described as follows: According to the planar distribution of all unit circuits on a single module, combined with the power consumption models of all unit circuits, the power consumption of the single module is obtained. Consumption flat distribution. The planar distribution of various unit circuits on the single module is simplified to a limited number of squares (the above-mentioned rectangles). These squares are distributed according to row-column (eg, m rows and n columns), and each square is numbered, and each square is associated with a specific unit circuit number.

For example, if the power consumption of a unit circuit is W, and its circuit area is equivalent to the area of 100 finite elements, the power consumption of each finite element of the unit circuit is W÷100. According to the finite element number, the power consumption W of the unit circuit to which it belongs can be indexed, and the power consumption W_o of the finite element of this number can be calculated.

Step 5: Combine the heat conduction model and the air cooling model to establish a single-module 3D (three-dimensional space) finite element temperature model;

(1) According to the thickness of the module, the 2D model of the power consumption model of the unit module is simply expanded into a 3D model, that is, all 2D finite elements are added with a unified height parameter and converted into 3D finite elements;

(2) Calculated according to the following formula: temperature change per unit finite element = heat change per unit time / heat capacity per unit finite element;

(3) Calculated according to the following formula: heat change per unit time = self-heating of unit finite element + heat conduction between unit finite element and adjacent finite elements + heat change caused by air-cooled airflow;

(4) Calculated according to the following formula: self-heating of unit finite element = heating power consumption per unit of finite element * unit time;

(5) Calculated according to the following formula: heat conduction between unit finite element and adjacent finite elements = ∑ temperature difference between adjacent finite elements * heat conduction coefficient * unit time;

(6) Calculate according to the following formula: heat change caused by fan airflow = airflow temperature difference * airflow heat exchange coefficient * airflow flux * cross-sectional area of unit finite element;

(7) Calculated according to the following formula: airflow flux = percentage of fan speed * maximum air volume of fan / cross-sectional area of air duct occupied by fan.

Step 6: Establish a 3D finite element temperature model of the system.

(1) The system is regarded as a blade-type architecture, and each module is regarded as the same shape. According to the spatial arrangement of each module in the system, the unit module 3D finite element temperature model is combined into a system 3D finite element temperature model. element temperature model;

(2) Remove the shell, power supply module and other auxiliary structures of the system to simplify the model.

100: Methods of Building Mathematical Models Vps: Supply voltage Rs: Equivalent output resistance Vout: Transient output voltage Iout: Transient output current Rload: load resistance

[Fig. 1] is a flow chart of the derivation process of establishing a model for the present invention; [Figure 2] is the parameter table of each pin of the tested chip; [Fig. 3] is an equivalent circuit diagram of a power consumption model of a unit circuit; and [Fig. 4] is the parameter table of the transient power consumption model of the unit circuit.

100: Methods of Building Mathematical Models

Claims (9)

An automatic testing machine-based temperature management method, comprising: Step 1: According to the method of establishing a mathematical model and combining various element conditions, establish a mathematical model for systematically distributed temperature prediction; Step 2: carry out simulation calculation according to the mathematical model, and obtain a prediction result of the distributed temperature change of the system; Step 3: analyze the prediction result to determine whether the temperature of an automatic testing machine is uniform and stable, if the temperature is uniform and stable, then jump to step 7, otherwise, go to the next step 4; Step 4: according to the prediction result, deduce an optimization scheme for adjusting the speed of the fan; Step 5: Compare whether there is a difference between the new optimization scheme and the last optimization scheme, if there is no difference, go to step 7, otherwise go to the next step 6; Step 6: Take the fan speed of the optimization scheme as the new factor condition, and the other factor conditions remain unchanged, and perform steps 1 to 5 again; and Step 7: Save the current fan speed control scheme as a final optimization scheme. The temperature management method based on an automatic testing machine of claim 1, wherein the method for establishing a mathematical model comprises: Step 1-1: Combine the characteristics of a unit circuit, analyze the test program, and obtain the values of a transient output voltage and a transient output current of the unit circuit; Step 1-2: establish a transient power consumption model of the unit circuit; Step 1-3: establish a power consumption model of the unit circuit; Steps 1-4: Establish a single-module two-dimensional (2D) power consumption model; Steps 1-5: Combine a heat-conduction model and an air-cooling model to create a single-module three-dimensional (3D) finite element temperature model; and Steps 1-6: Build a systematic 3D finite element temperature model. The temperature management method based on an automatic testing machine of claim 2, wherein the step 1-1 includes: (1) The test program can be analyzed in combination with the characteristics of the unit circuit, and the values of the transient output voltage and the transient output current of the unit circuit can be obtained; (2) According to the design of the automatic testing machine, for 9 types of unit circuits, the names are Pin Electric Channel (PE), Component Power Channel (DPS), Parameter Measurement Unit (PMU), High Voltage Channel (HV), High-speed Arbitrary Waveform Generation (HSAWG), high-resolution arbitrary waveform generator (HRAWG), frequency measurement unit (FMU), high-speed digital converter (HSDTZ), high-resolution digital converter (HRDTZ); (3) There are several known or standard parameters for the specifications of the chip under test, from which the component power supply voltage (VDD), component power supply current (IDD), and load resistance (Rload) are exported; (4) For the unit circuit named the electric channel (PE) of this pin, which is the main heat source of the automatic test machine, the transient output voltage and the value of the transient output current; (5) For the unit circuit named the power supply channel (DPS) of the component, the transient output voltage is the power supply voltage of the component, and the transient output current is the power supply current of the component; (6) For the unit circuits named the parameter measurement unit (PMU), the high voltage channel (HV), the high-speed arbitrary waveform generator (HSAWG) and the high-resolution arbitrary waveform generator (HRAWG), the transient The output voltage is directly imported by the test program, that is, the test program will explicitly set the transient output voltage when using these unit circuits, and the transient output current is the transient output voltage divided by the load resistance; and (7) For the unit circuit named the frequency measurement unit (FMU), the high-speed digital converter (HSDTZ), and the high-resolution digital converter (HRDTZ), the transient output voltage is 0, and the transient output Current is 0. The temperature management method based on an automatic testing machine of claim 2, wherein the step 1-2 includes: (1) Set an equivalent output resistance inside the unit circuit; (2) Calculate the calorific value of the equivalent output resistance: it is known that the power supply voltage of the unit circuit is Vps, the transient output voltage is Vout, and the transient output current is Iout, then the transient power of the equivalent output resistance is The consumption is P_Rs=(Vps-Vout)×Iout; and (3) The transient power consumption model of the unit circuit is established according to the following formula: heating power consumption = static power consumption + dynamic heating power consumption = static power consumption + (supply voltage - output voltage) × output current, that is, Psump= Ws+(Vps-Vout) × Iout, where Psump is the heating power consumption, Ws is the static power consumption of the circuit, Vps is the power supply voltage of the test circuit, Vout is the output voltage of the test circuit, and Iout is the output current. The temperature management method based on an automatic testing machine of claim 2, wherein the steps 1-3 include: (1) According to the transient power consumption model of the unit circuit, take the cycle of the main clock pulse of the test program as the time unit, and convert it into a heating power consumption of the unit circuit according to an output voltage function and an output current function. time curve; (2) Perform power integration in units of a time window, reduce the time resolution of the time change curve of the heating power consumption, reduce the amount of data, and obtain a lookup data table that can retrieve the heating power consumption of the unit at any time; and (3) Combine and output the lookup data table of heating power consumption of all unit circuits of the entire automatic testing machine, and obtain a lookup data table that can index the heating power consumption of all unit circuits of the system at all times. The temperature management method based on an automatic testing machine of claim 2, wherein the steps 1-4 include: (1) Simplify each module as a sheet rectangle, and build a 2D model for this; (2) The area of the rectangle that divides each sheet rectangle is a small rectangle of m*n, and the division density is determined according to the area and layout characteristics of the unit circuit on the module; (3) Assign a number to each small rectangle according to the coordinates, establish an index table, and the data stored in the table is the unit circuit to which the rectangle belongs; (4) The average occupied area of each type of unit circuit is calibrated, divided by the area of the finite element, and converted to a number of finite elements; and (5) According to the lookup data table of the heating power consumption obtained by the power consumption model of the unit circuit, find the power consumption of each type of unit circuit, and then divide it by the number of finite elements to calculate the power consumption of each finite element . The temperature management method based on an automatic testing machine of claim 2, wherein the steps 1-5 include: (1) According to the thickness of the module, the 2D model of the power consumption model of the unit module is simply expanded into a 3D model, that is, all 2D finite elements are added with a unified height parameter and converted into 3D finite elements; (2) Calculated according to the following formula: temperature change per unit finite element = heat change per unit time / heat capacity per unit finite element; (3) Calculated according to the following formula: heat change per unit time = self-heating of unit finite element + heat conduction between unit finite element and adjacent finite elements + heat change caused by air-cooled airflow; (4) Calculated according to the following formula: self-heating of unit finite element = heating power consumption per unit of finite element * unit time; (5) Calculated according to the following formula: heat conduction between unit finite element and adjacent finite elements = ∑ temperature difference between adjacent finite elements * heat conduction coefficient * unit time; (6) Calculate according to the following formula: heat change caused by fan airflow = airflow temperature difference * airflow heat exchange coefficient * airflow flux * cross-sectional area of unit finite element; and (7) Calculated according to the following formula: airflow flux = percentage of fan speed * maximum air volume of fan / cross-sectional area of air duct occupied by fan. The temperature management method based on an automatic testing machine of claim 2, wherein the steps 1-6 include: (1) The system is regarded as a blade-type architecture, and each module is regarded as the same shape. According to the spatial arrangement of each module in the system, the unit module 3D finite element temperature model is combined into a system 3D finite element temperature model. the meta-temperature model; and (2) Remove the shell, power supply module and other auxiliary structures of the system to simplify the model. The temperature management method based on an automatic testing machine of claim 1, wherein step 4 includes: (1) Set the adjustment coefficient of the fan speed corresponding to the temperature change, the initial value is set to 1%/℃, that is, the adjustment amount of the fan speed per degree Celsius is 1%; (2) Set the fan pre-adjustment time advance to 5 seconds; (3) Calculation results of distributed temperature prediction using finite element simulation calculation; (4) Calculate the time curve of the average temperature of all finite elements involved in the airflow channel corresponding to each fan from the results; (5) Multiply the difference between the time curve of the average temperature and the target stable temperature by the fan speed adjustment coefficient, and convert it into a time curve of the fan speed adjustment; (6) Advance the fan speed adjustment curve by 5 seconds on the time axis, and then add it to the last fan speed control curve to generate a new fan speed control curve; if the value is greater than 100%, the limit is 100% and less than 0 then the limit is 0; and (7) Apply the aforementioned steps (1) to (6) to all fans to generate new speed control curves for all fans.

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