TW202229654A - Plating apparatus, pre-wetting treatment method and cleaning treatment method provided with a recovery member configured in a manner of recovering the treating fluid spitted from the plurality of nozzles to contact the downside of the substrate and then drop - Google Patents

Abstract

This invention provides a technology seeking for miniaturizing a plating apparatus. A plating apparatus provided by this invention is provided with a spitting module 50. The spitting module 50 is provided with a module body 51 having a plurality of nozzles 52 spitting a treating fluid upward; and a moving mechanism 60 provided with a rotating shaft 61 disposed beside a plating tank and connected to the module body and enabling the module body to move by virtue of the rotation of the rotating shaft. The moving mechanism enables the module body to move between a first position and a second position. The plurality of nozzles are disposed in a manner that the treating fluid spitted from the plurality of nozzles is in contact from the central part below a substrate to a peripheral part when the module body moves to the second position, and the module body is further provided with a recovery member configured in a manner of recovering the treating fluid spitted from the plurality of nozzles to contact the downside of the substrate and then drop.

Description

Plating apparatus, pre-wet treatment method and cleaning treatment method

The present invention relates to a plating device, a pre-wet treatment method and a cleaning treatment method.

Conventionally, a so-called cup-type plating apparatus has been known as a plating apparatus capable of plating a substrate (for example, refer to Patent Document 1). Such a plating apparatus includes: a plating tank in which an anode is arranged; a substrate holder that is arranged above the anode to hold a substrate serving as a cathode; and a rotation mechanism that rotates the substrate holder.

In addition, in the past, before the substrate was subjected to plating (that is, before the plating treatment was carried out), a pre-wetting treatment in which the substrate was wetted with a designated treatment liquid was carried out, and after the plating treatment was carried out, a designated treatment liquid was carried out. A cleaning process for cleaning the substrate is performed (for example, refer to Patent Document 2). Specifically, the coating apparatus disclosed in Patent Document 2 includes: a coating module for performing a coating process having a coating tank, a substrate holder, and a rotating mechanism; a pre-wetting module for performing a pre-wetting process; and Cleaning module for cleaning process. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-19496 [Patent Document 2] Japanese Patent Application Laid-Open No. 2020-43333

(The problem that the invention intends to solve)

In recent years, miniaturization of coating apparatuses has been continuously demanded. In this regard, there is still room for improvement in the above-mentioned conventional coating apparatuses from the viewpoint of miniaturization of the coating apparatuses.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a technique capable of reducing the size of a plating apparatus. (means to solve the problem) (pattern 1)

In order to achieve the above-mentioned object, a coating apparatus of one aspect of the present invention includes a coating module, which includes: a coating tank, which is provided with an anode; a cathode substrate; and a rotation mechanism for rotating the substrate holder; and the plating module further includes a discharge module for discharging a prescribed treatment liquid toward the lower surface of the substrate held in the substrate holder, the The ejection module is provided with: a module body, which has a plurality of nozzles for ejecting the treatment liquid toward the upper side; and a moving mechanism, which has a rotating shaft arranged beside the coating tank and connected to the module body, by The rotating shaft rotates to move the module body; the moving mechanism makes the module body in a first position where the module body is not between the base plate and the anode; and the module body is located between the base plate and the anode. During this time, the processing liquid discharged from the plurality of nozzles moves between the second positions where it contacts the lower surface of the substrate, and the plurality of nozzles are moved from the plurality of nozzles when the module body moves to the second position. The processing liquid discharged from the nozzles is arranged so as to contact from the lower surface center portion to the outer peripheral portion of the substrate, and the module body is further provided with a recovery member for recovering the processing liquid discharged from the plurality of nozzles, contacting the lower surface of the substrate, and falling down. It is formed in the way of the above-mentioned treatment liquid.

In this mode, the module body is moved from the first position to the second position by the moving mechanism, the substrate holder is rotated by the rotating mechanism, and the processing liquid is discharged from a plurality of nozzles, so that the pre-wet treatment can be performed. , and can perform cleaning processing. Therefore, when this aspect is adopted, it is not necessary to provide a pre-wetting module and a cleaning module in addition to the plating module, so that the pre-wetting treatment and the cleaning treatment can be performed. Thereby, compared with the conventional plating apparatus provided with a pre-wetting module and a cleaning module in addition to a plating module, the size reduction of a plating apparatus can be aimed at.

In addition, in this aspect, the entire lower surface of the substrate can be wetted and cleaned by making the processing liquid contact the lower surface center portion to the outer peripheral portion of the entire substrate. In addition, in this aspect, since the falling processing liquid can be collected by the recovery member, the falling processing liquid can be suppressed from entering the inside of the plating tank. (pattern 2)

In the above aspect 1, the module body extends in a direction away from the rotation axis from a plan view, and the plurality of nozzles can also be arranged in a direction of extension of the module body from a plan view, and are in the same direction as the module body. A plurality of groups are arranged in a direction perpendicular to the extending direction of the group body. (pattern 3)

In the above aspect 1 or 2, the recovery member may include a concave portion, which is formed on the upper surface of the module body, and the plurality of nozzles are arranged in the concave portion. (pattern 4)

In any of the above-mentioned aspects 1 to 3, the treatment liquid may be pure water. (pattern 5)

In addition, in order to achieve the above-mentioned object, the pre-wetting treatment method of one aspect of the present invention uses the plating apparatus of any one of the above-mentioned aspects 1 to 4, and performs the operation on the underside of the substrate held by the substrate holder. Before performing the plating process of plating, it includes a pre-wetting process in which the lower surface of the substrate is wetted with the treatment solution, and the pre-wet process includes moving the module body from the first position to the second position by the moving mechanism. and the substrate holder is rotated by the rotation mechanism, and the processing liquid is discharged from the plurality of nozzles.

In this aspect, the pre-wetting process can be performed without having to include a pre-wetting module in addition to the plating module. Therefore, it is compared with a conventional plating apparatus that includes a pre-wetting module in addition to the plating module. , the miniaturization of the coating device can be achieved. (pattern 6)

In the above-mentioned aspect 5, the plating apparatus further includes a tilting mechanism for tilting the substrate holder, and the pre-wetting treatment may also include the pre-wetting process in which the processing liquid is discharged from the plurality of nozzles so that the substrate holder is placed between the substrate holders. The inclination mechanism may incline the substrate holder so that the part close to the rotation axis of the outer peripheral edge is located below the part farther from the rotation axis. By adopting this aspect, it is possible to effectively prevent the treatment liquid that has fallen after being discharged from the nozzle from entering the inside of the coating tank. (pattern 7)

In addition, in order to achieve the above-mentioned object, the cleaning treatment method of one aspect of the present invention uses the plating apparatus of any one of the above-mentioned aspects 1 to 4, and is performed on the lower surface of the substrate held by the substrate holder. After the plating process of plating, it includes a cleaning process of cleaning the lower surface of the substrate with the treatment solution, and the cleaning process includes moving the module body from the first position to the second position by the moving mechanism. The rotation mechanism rotates the substrate holder and discharges the processing liquid from the plurality of nozzles.

In this aspect, the cleaning process can be performed without having to include a cleaning module in addition to the plating module. Therefore, compared with the conventional plating apparatus including the cleaning module in addition to the plating module, the Miniaturization of coating equipment. (pattern 8)

In the above aspect 7, the plating apparatus further includes a tilting mechanism for tilting the substrate holder, and the cleaning process may be included in the cleaning process, when the processing liquid is discharged from the plurality of nozzles, so that the substrate holder can be formed on the outer periphery of the substrate holder. The inclination mechanism may incline the substrate holder in such a manner that a part close to the rotation axis of the edge is located below a part farther from the rotation axis. By adopting this aspect, it is possible to effectively prevent the treatment liquid that has fallen after being discharged from the nozzle from entering the inside of the coating tank.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following embodiment and the modification of embodiment, the same code|symbol is attached|subjected to the same or corresponding structure, and description is abbreviate|omitted suitably. In addition, the drawings are schematically shown in order to easily understand the characteristics of the embodiment, and the dimensional ratios and the like of each element are not the same as the actual ones. In addition, in some drawings, the orthogonal coordinates of XY-Z are shown for reference. In these orthogonal coordinates, the Z direction corresponds to the upper direction, and the −Z direction corresponds to the downward direction (the direction in which gravity acts).

FIG. 1 is a perspective view showing the overall configuration of a coating apparatus 1000 according to the present embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus 1000 of the present embodiment. As shown in FIGS. 1 and 2 , the plating apparatus 1000 includes: a loading port 100 , a transfer robot 110 , an aligner 120 , a prepreg module 300 , a plating module 400 , a spin rinse dryer 600 , a transfer device 700 , and control module 800. In addition, although the plating module 400 of this embodiment is provided with the discharge module 50, the illustration of this discharge module 50 is abbreviate|omitted in FIG.

The loading port 100 is a module for carrying substrates accommodated in cassettes such as FOUPs (front opening pods), not shown, into the plating apparatus 1000 , or a module for unloading substrates from the plating apparatus 1000 to the cassettes. In this embodiment, four load ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the load ports 100 are not limited. The transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the load port 100 , the aligner 120 , and the transfer device 700 . When the transfer robot 110 and the transfer device 700 transfer substrates between the transfer robot 110 and the transfer device 700 , the transfer of the substrates can be performed via a temporary stage (not shown).

The aligner 120 is a module for aligning the positions of the orientation planes and grooves of the substrate in a specified direction. In this embodiment, two aligners 120 are arranged in parallel in the horizontal direction, but the number and arrangement of the aligners 120 are not limited.

The prepreg module 300 is etched with a treatment solution such as sulfuric acid and hydrochloric acid to remove, for example, the oxide film with high resistance existing on the surface of the seed layer on the plated surface of the substrate before the plating treatment, and cleaning or activation of the surface of the plated substrate is performed. The prepreg treatment method is constituted. In this embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the prepreg modules 300 are not limited. The plating module 400 performs a plating process on the substrate. In the present embodiment, there are two sets of plating modules 400 in which three are arranged in parallel in the vertical direction and 12 out of four are arranged in parallel in the horizontal direction, and a total of 24 plating modules 400 are provided. The quantity and configuration are not limited.

The spin-rinsing dryer 600 is a module for rotating and drying the substrate after the cleaning process at a high speed. In this embodiment, two spin-rinsing-dryers 600 are arranged in parallel in the up-down direction, but the number and arrangement of the spin-rinsing-dryers 600 are not limited. The conveying apparatus 700 is an apparatus for conveying a substrate between a plurality of modules in the plating apparatus 1000 . The control module 800 is configured to control a plurality of modules of the coating apparatus 1000, and may be configured by, for example, a general computer or a dedicated computer having an input/output interface with the operator.

The discharge module 50 is used to perform pre-wetting of the lower surface (the surface to be plated) of the substrate before the plating process is performed by wetting with the designated processing liquid PL, and replacing the air formed in the pattern on the surface of the substrate with the processing liquid PL. Processed modules. In addition, the ejection module 50 is also a module for performing cleaning treatment of the underside of the substrate after the plating treatment is performed with the treatment liquid PL in order to remove the plating liquid and the like remaining on the substrate after the plating treatment is performed. Therefore, the discharge module 50 of this embodiment has functions as a pre-wetting module and a cleaning module. The ejection module 50 will be described in detail later.

An example of a serial plating process by the plating apparatus 1000 will be described below. First, the substrates accommodated in the cassette are carried into the loading port 100 . Continuing, the transfer robot 110 takes out the substrate from the cassette of the loading port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the positions of the orientation planes, grooves, etc. of the substrate in a specified direction. The transfer robot 110 sends the substrate whose direction is aligned by the aligner 120 to the transfer device 700 .

The transfer device 700 transfers the substrate received from the transfer robot 110 to the plating module 400 . In the plating module 400, the discharge module 50 performs pre-wetting treatment on the substrate. The conveying device 700 conveys the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg processing on the substrate. The conveying device 700 conveys the prepreg-treated substrate to the plating module 400 . The plating module 400 performs plating processing on the substrate.

Next, the discharge module 50 performs a cleaning process on the substrate. The transfer device 700 transfers the substrate after the cleaning process to the spin rinse dryer 600 . The spin rinse dryer 600 performs drying processing on the substrate. The transfer device 700 sends the substrate after the drying process to the transfer robot 110 . The transfer robot 110 transfers the substrates received from the transfer device 700 to the cassettes of the loading port 100 . Finally, the cassette in which the substrates are accommodated is carried out from the load port 100 .

In addition, the structure of the coating apparatus 1000 demonstrated to FIG. 1 and FIG. 2 is only an example, and the structure of the coating apparatus 1000 is not limited to the structure of FIG. 1 and FIG. 2. FIG.

Continuing, the plating module 400 will be described. In addition, since a plurality of plating modules 400 included in the plating apparatus 1000 of the present embodiment have the same configuration, one plating module 400 will be described.

FIG. 3 is a block diagram for explaining the coating module 400 of the coating apparatus 1000 of the present embodiment. The plating apparatus 1000 of the present embodiment is a cup-type plating apparatus. The coating module 400 of the coating apparatus 1000 of the present embodiment illustrated in FIG. 3 mainly includes a coating tank 10 , an overflow tank 20 , a substrate holder 30 , a rotation mechanism 40 , a lift mechanism 45 , and a tilt mechanism 47 . In addition, as mentioned above, the plating module 400 also includes the ejection module 50, but the illustration of the ejection module 50 is omitted in FIG. 3 . In addition, in FIG. 3, the plating tank 10, the overflow tank 20, and the rotation mechanism 40 are shown in the schematic cross section.

The plating tank 10 of the present embodiment is constituted by a bottomed container having an upper opening. Specifically, the plating tank 10 has a bottom wall portion 10a, an outer peripheral wall portion 10b extending upward from the outer peripheral edge of the bottom wall portion 10a, and an upper portion of the outer peripheral wall portion 10b is open. In addition, the shape of the outer peripheral wall portion 10b of the coating tank 10 is not particularly limited, and an example of the outer peripheral wall portion 10b of the present embodiment has a cylindrical shape.

The plating solution Ps is stored inside the plating tank 10 . The plating solution Ps should just be a solution containing the ion of the metal element which comprises a plating film, and its specific example will not be specifically limited. In the present embodiment, an example of the plating treatment is the use of copper plating treatment, and an example of the plating solution Ps is the use of a copper sulfate solution. In addition, in the present embodiment, a predetermined additive is contained in the plating solution Ps. However, it is not limited to this structure, The plating liquid Ps may be comprised without an additive.

An anode 11 is arranged inside the coating tank 10 . The specific type of the anode 11 is not particularly limited, and a dissolved anode and an insoluble anode can be used. In the present embodiment, as an example of the anode 11, an insoluble anode is used. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, etc. can be used.

Inside the coating tank 10 , a separator 12 is arranged above the anode 11 . Specifically, the separator 12 is arranged at a portion between the anode 11 and the substrate Wf. An example of the diaphragm 12 of the present embodiment is connected to the outer peripheral wall portion 10b of the coating tank 10 via the holding member 10d. In addition, the diaphragm 12 of this embodiment is arrange|positioned so that the surface direction of the diaphragm 12 may become a horizontal direction.

The inside of the coating tank 10 is divided into two in the up-down direction by the diaphragm 12 . The area divided into the lower side of the separator 12 is called the anode chamber 13 , and the area above the separator 12 is called the cathode chamber 14 . The aforementioned anode 11 is disposed in the anode chamber 13 .

The separator 12 is constituted by a film that allows the passage of metal ions and suppresses the passage of additives contained in the plating solution Ps. That is, in this embodiment, the plating solution of the cathode chamber 14 contains additives, but the plating solution Ps of the anode chamber 13 does not contain additives. However, it is not limited to this structure, For example, an additive may be contained in the plating solution Ps of the anode chamber 13. However, at this time, the concentration of the additive in the anode chamber 13 is still lower than the concentration of the additive in the cathode chamber 14 . The specific type of the diaphragm 12 is not particularly limited, and a conventional diaphragm can be used. As a specific example of the separator 12, for example, an electrolytic separator can be used, and as a specific example of the electrolytic separator, for example, an electrolytic separator for plating manufactured by YUASA Membrane System Co., Ltd., an ion exchange membrane, and the like can be used.

The plating tank 10 is provided with an anode supply port 15 for supplying the plating solution Ps to the anode chamber 13 . In addition, the plating tank 10 is provided with an anode discharge port 16 for discharging the plating solution Ps in the anode chamber 13 from the anode chamber 13 . The plating solution Ps discharged from the anode discharge port 16 is temporarily stored in an anode storage tank (not shown), and then supplied to the anode chamber 13 from the anode supply port 15 again.

The plating tank 10 is provided with a cathode supply port 17 for supplying the plating solution Ps to the cathode chamber 14 . Specifically, a portion of the outer peripheral wall portion 10b of the coating tank 10 of the present embodiment corresponding to the portion of the cathode chamber 14 is provided with a protrusion portion 10c protruding from the center side of the coating tank 10, and the protrusion portion 10c The supply port 17 for cathodes is provided in it.

The overflow tank 20 is disposed outside the coating tank 10 and is formed by a bottomed container. The overflow tank 20 is a tank for temporarily storing the plating solution Ps beyond the upper end of the outer peripheral wall portion 10b of the coating tank 10 (that is, the plating solution Ps overflowing from the plating tank 10). The plating solution Ps supplied from the cathode supply port 17 to the cathode chamber 14 flows into the overflow tank 20, is discharged from the discharge port (not shown) for the overflow tank 20, and is temporarily stored in the cathode storage tank (not shown). diagram). After that, the plating solution Ps is again supplied to the cathode chamber 14 from the cathode supply port 17 .

A porous resistor 18 is arranged in the cathode chamber 14 of the present embodiment. Specifically, the resistor 18 of the present embodiment is provided in the vicinity of the upper end of the protruding portion 10c. The resistor body 18 is constituted by a porous plate member having a plurality of holes (pores). The resistor 18 is a member provided in order to uniformize the electric field formed between the anode 11 and the substrate Wf.

In addition, in this embodiment, the anode shield 19 is arranged in the anode chamber 13 . The anode shield 19 of the present embodiment is arranged so that the upper surface of the anode shield 19 is in contact with the lower surface of the separator 12 . However, the arrangement position of the anode shield 19 may be the anode chamber 13, and is not limited to the position shown in FIG. 3 . In another example, the anode mask 19 may be arranged at a position lower than the separator 12 so as to have a space between the anode mask 19 and the separator 12 . The anode shield 19 has openings 19a through which electricity flows between the anode 11 and the substrate Wf.

The substrate holder 30 is a member for holding the substrate Wf as the cathode. The lower surface Wfa of the substrate Wf corresponds to the surface to be plated. The substrate holder 30 is connected to the rotation mechanism 40 . The rotation mechanism 40 is a mechanism for rotating the substrate holder 30 . As the rotating mechanism 40, a known mechanism such as a rotating motor can be used. The rotation mechanism 40 is connected to the lift mechanism 45 . The elevating mechanism 45 is supported by a support shaft 46 extending in the up-down direction. The elevating mechanism 45 is a mechanism for elevating the substrate holder 30 , the rotating mechanism 40 and the tilting mechanism 47 in the vertical direction. As the elevating mechanism 45, a known elevating mechanism such as a linear actuator can be used. The tilt mechanism 47 is a mechanism for tilting the substrate holder 30 and the rotation mechanism 40 . As the tilt mechanism 47, a known tilt mechanism such as a piston and a cylinder can be used.

During the plating process, the rotation mechanism 40 rotates the substrate holder 30 , and the elevating mechanism 45 moves the substrate holder 30 downward to immerse the substrate Wf in the plating solution Ps in the plating tank 10 . Next, an electric current flows between the anode 11 and the substrate Wf by the energizing means. Thereby, a plating film is formed on the lower surface Wfa of the substrate Wf (that is, a plating process is performed).

The action of the coating module 400 is controlled by the control module 800 . The control module 800 includes a microcomputer including a CPU (Central Processing Unit) 801 serving as a processor, a memory unit 802 serving as a permanent storage medium, and the like. In the control module 800 , the CPU 801 controls the operation of the coating module 400 according to the command of the program stored in the memory unit 802 .

In addition, in the present embodiment, one control module 800 functions as a control device for integrally controlling the controlled portion of the coating module 400, but it is not limited to this configuration. For example, the control module 800 may also include a plurality of control devices, and the plurality of control devices individually control each of the controlled parts of the coating module 400 .

Continuing, the ejection module 50 will be described in detail. FIGS. 4(A) and 4(B) are schematic top views of the discharge module 50 . Specifically, FIG. 4(A) shows the state of the module body 51 in the first position, which will be described after the ejection of the module 50 , and FIG. 4(B) shows the state of the module body 51 in the second position. In addition, FIGS. 4(A) and 4(B) illustrate the plating tank 10 in addition to the discharge module 50 , but the illustration of the internal structure of the plating tank 10 is omitted. In addition, FIG. 5 is a schematic diagram showing the overall configuration of the discharge module 50 . In addition, in FIG. 5 , the module main body 51 and the rotating shaft 61 of the discharge module 50 are schematically shown in the cross section taken along the line A1-A1 in FIG. 4(B). In addition, in FIG. 5, the illustration of the plating tank 10 is abbreviate|omitted, and the board|substrate holder 30 and the rotation mechanism 40 are illustrated instead. FIG. 6 is a cross-sectional view schematically showing a cross-section taken along the line A2-A2 in FIG. 5 . With reference to these figures, the discharge module 50 will be described as follows.

As shown in FIG. 5 , the discharge module 50 mainly includes: a module body 51 , a moving mechanism 60 , a pump (pump 70 a and pump 70 b ), a storage tank (storage tank 71 a and storage tank 71 b ), and piping (pipe 72 a ) and piping 72b).

As shown in FIGS. 4(A) and 4(B) , an example of the module body 51 of the present embodiment has a shape extending in a direction away from a rotating shaft 61 described later in plan view (viewed from above). Specifically, the module body 51 has a rectangular shape in which the direction away from the rotating shaft 61 is the long side and the direction perpendicular thereto is the short side. As shown in FIGS. 4(A) , 4(B), 5 and 6 , the module body 51 includes at least one nozzle 52 that discharges the processing liquid PL upward. In addition, the module body 51 of the present embodiment also includes a recovery member 53 .

Specifically, the number of nozzles 52 in this embodiment is plural. In this specific example, the plurality of nozzles 52 of the present embodiment are arranged in a plurality (in one example, five) in the extending direction (long side direction) of the module body 51, and in the direction perpendicular to the extending direction (short side direction) ( or width direction) are arranged in plural (two in one example). Specifically, as shown in FIG. 6 , the two nozzles 52 arranged in the short-side direction are on one side of the center axis XL of the concave portion 54 to be described later when viewed in cross-section when the module body 51 is cut in the short-side direction. Arrange one each on the other side. As a result, the number of the plurality of nozzles 52 in the present embodiment is ten in total. However, the number of the nozzles 52 is not limited to this, and may be less than ten or more.

5, in the present embodiment, the plurality of nozzles 52 are in contact with the processing liquid PL discharged from the nozzles 52 from the central portion to the outer peripheral portion of the lower surface Wfa of the substrate Wf when the module body 51 is in the second position to be described later. way to set its configuration location. Moreover, each nozzle 52 is comprised so that the process liquid PL may be sprayed upward in a wide angle (that is, in a fan shape). Specifically, each nozzle 52 has a discharge port for jetting the processing liquid PL at a wide angle, and the processing liquid PL is jetted upward at a wide angle from the discharge port.

The processing liquid PL discharged from the nozzle 52 may be any liquid capable of performing pre-wet treatment and cleaning treatment, and the specific type thereof is not particularly limited. However, a specific example of the present embodiment uses pure water. For this pure water, it is preferable to use, for example, a resistivity of "0.1 (MΩ·cm)" or more. In addition, as the pure water, pure water obtained by degassing air (that is, degassed pure water) may be used, pure water that has not been degassed, or pure water from which ions have been removed (ie, degassed pure water) may be used. deionized water).

Referring to FIGS. 4(A) and 4(B) , the moving mechanism 60 is a mechanism for moving the module body 51 . Specifically, the moving mechanism 60 is such that the module body 51 is in the "first position (FIG. 4(A))" where the module body 51 is not between the substrate Wf and the anode 11, and the module body 51 is on the substrate Wf. Between the anode 11 and the processing liquid PL discharged from the nozzle 52, it is configured to move between "second positions (FIG. 4(B))" in contact with the lower surface Wfa of the substrate Wf. In this embodiment, the second position is the position where the nozzle 52 is located directly under the lower surface Wfa of the substrate Wf, in other words, the position where the nozzle 52 faces the lower surface Wfa of the substrate Wf.

As shown in FIG. 5 , the moving mechanism 60 of the present embodiment includes a rotating shaft 61 and an actuator 62 . The rotating shaft 61 is arranged beside the coating tank 10 . In addition, the rotating shaft 61 is connected to the module body 51 . The actuator 62 is a device for driving the rotating shaft 61 . In FIG. 5 , the rotation shaft 61 rotates around the Z axis. The module body 51 moves between the first position and the second position by the rotation of the rotating shaft 61 driven by the actuator 62 . As the actuator 62, for example, a known actuator including a motor capable of rotating in one rotational direction and the other rotational direction (that is, a motor capable of forward and reverse rotation) can be used. The action of the actuator 62 is controlled by the control module 800 .

A supply flow path 73 and a discharge flow path 74 are provided inside the module body 51 of the present embodiment and inside the rotating shaft 61 . In addition, the supply flow path 73 and the discharge flow path 74 may not pass through the inside of the rotating shaft 61 but may be connected to the pipes (the pipes 72 a and 72 b ) described later through the outside of the rotating shaft 61 . The supply flow path 73 is a flow path through which the processing liquid PL supplied to the nozzle 52 flows. The discharge flow path 74 is a flow path through which the treatment liquid PL recovered by the recovery member 53 described later is circulated.

The supply flow path 73 communicates with the storage tank 71a via the piping 72a. The processing liquid PL is stored in the storage tank 71a. The pump 70a is arranged in the piping 72a. When the pump 70a is driven by the command of the control module 800, the processing liquid PL stored in the storage tank 71a is pumped up by the pump 70a, circulates through the piping 72a and the supply channel 73, and is discharged from the nozzle 52. The discharge flow path 74 communicates with the storage tank 71b via the piping 72b. The pump 70b is connected to the piping 72b.

4(B) , 5 and 6 , the recovery member 53 is a member configured to recover the processing liquid PL discharged from the plurality of nozzles 52 and dropped after contacting the lower surface Wfa of the substrate Wf. Therefore, according to the present embodiment, since the recovery member 53 can recover the treatment liquid PL that has fallen after being ejected from the plurality of nozzles 52 upward, the dropped treatment liquid PL can be prevented from entering the coating tank 10 .

Specifically, as shown in FIG. 6 , the recovery member 53 of the present embodiment is constituted by a concave portion 54 formed on the upper surface 51 a of the module body 51 . Moreover, the groove 55 is provided in the center part of the bottom part of this recessed part 54, and the above-mentioned discharge flow path 74 is arrange|positioned in this groove 55. As shown in FIG. The discharge flow path 74 is provided with a suction port (not shown) for the treatment liquid PL collected by the concave portion 54 of the collection member 53 to flow into the discharge flow path 74 . The specific formation site of the suction port is not particularly limited, and may be, for example, the upstream end portion of the discharge flow path 74 or the side surface of the discharge flow path 74 (the side surface of the piping constituting the discharge flow path 74 ).

When the pump 70b is driven by the command of the control module 800 to form a negative pressure inside the discharge channel 74, the treatment liquid PL recovered by the recovery member 53 flows into the discharge channel 74 from the suction port, and then flows into the pipe 72b. It circulates and is stored in the storage tank 71b.

In addition, in the present embodiment, the plurality of nozzles 52 of the module body 51 are arranged in the concave portion 54 . As a result, the processing liquid PL that has fallen after being discharged from the plurality of nozzles 52 can be efficiently recovered by the concave portion 54 .

In addition, in this embodiment, the nozzle 52 arranged on one side and the nozzle 52 arranged on the other side with the center axis XL of the recessed portion 54 therebetween each discharge the processing liquid PL toward the upper side and the center side of the recessed portion 54 . Thereby, the processing liquid PL discharged from the plurality of nozzles 52 and contacting the lower surface Wfa of the substrate Wf can be easily dropped toward the center side of the concave portion 54 . Even in this respect, the processing liquid PL can be efficiently recovered by the concave portion 54 .

Next, the operation of the plating apparatus 1000 during the pre-wetting treatment and the cleaning treatment according to the present embodiment will be described. That is, the pre-wetting process method and the cleaning process method using the plating apparatus 1000 of this embodiment are demonstrated.

First, the control module 800 usually moves the module body 51 in the first position ( FIG. 4(A) ). During the pre-wetting process, the control module 800 controls the movement mechanism 60 to rotate the rotation shaft 61 to move the module body 51 to the second position ( FIG. 4(B) ). Next, the control module 800 controls the rotation mechanism 40 to rotate the substrate holder 30 and drives the pump 70 a to discharge the processing liquid PL from the nozzle 52 . In addition, the control module 800 drives the pump 70b at the same time as the pump 70a, so that the treatment liquid PL recovered to the recovery member 53 is returned to the storage tank 71b.

By rotating the substrate holder 30 and discharging the processing liquid PL from the nozzle 52, the entire processing liquid PL is adhered to the lower surface Wfa of the substrate Wf held by the substrate holder 30, and the entire lower surface Wfa of the substrate Wf can be made to be processed liquid PL. moist. The pre-wetting process is performed as above.

After the pre-wetting process is completed, the control module 800 stops the rotation of the substrate holder 30 by the rotation mechanism 40, and stops the pump 70a and the pump 70b. When the pump 70a is stopped, the discharge of the processing liquid PL from the nozzle 52 is stopped, and when the pump 70b is stopped, the recovery of the processing liquid PL by the recovery member 53 is also stopped. Next, the control module 800 rotates the rotating shaft 61 to move the module body 51 to the first position.

The control module 800 also performs the same control as the above-mentioned pre-wetting process when performing the cleaning process performed after the plating process. Specifically, the control module 800 moves the module body 51 to the second position by controlling the moving mechanism 60 to rotate the rotating shaft 61 . Next, the control module 800 controls the rotation mechanism 40 to rotate the substrate holder 30 and drives the pump 70 a to discharge the processing liquid PL from the nozzle 52 . In addition, the control module 800 drives the pump 70b at the same time as the pump 70a, so that the treatment liquid PL recovered to the recovery member 53 is returned to the storage tank 71b.

By rotating the substrate holder 30 and discharging the processing liquid PL from the nozzle 52 , the processing liquid PL can clean the entire lower surface Wfa of the substrate Wf held by the substrate holder 30 . The cleaning process is performed as above. After the cleaning process is completed, the control module 800 stops the rotation of the substrate holder 30 by the rotation mechanism 40, and stops the pump 70a and the pump 70b. In addition, the module body 51 is moved to the first position.

According to the present embodiment described above, the pre-wetting process and the cleaning process can be performed by the discharge module 50 . That is, the discharge module 50 can function as a pre-wetting module for performing pre-wetting processing and a cleaning module for performing cleaning processing. In this way, since it is not necessary to have a pre-wet module and a cleaning module in addition to the plating module 400 , the pre-wet treatment and the cleaning process can be performed. Compared with the conventional plating apparatuses of the group and the cleaning module, it is possible to achieve the miniaturization of the plating apparatus 1000 .

In addition, according to the present embodiment, as described above, since the size of the plating apparatus 1000 can be reduced, the conveyance distance of the substrate Wf can be shortened. Thereby, the throughput of the plating apparatus 1000 can be improved.

In addition, according to the present embodiment, since the plurality of nozzles 52 are arranged so that the processing liquid PL discharged from the nozzles 52 is in contact from the central portion to the outer peripheral portion of the lower surface Wfa of the substrate Wf, the entire processing liquid PL can be brought into contact with the substrate. From the central portion of Wfa under Wf to the outer peripheral portion, the entire lower surface Wfa can be wetted and washed. (Modification 1)

In the above-mentioned embodiment, although the plating apparatus 1000 uses the discharge module 50 to perform both the pre-wetting process and the cleaning process, it is not limited to this configuration. For example, the plating apparatus 1000 may not perform the cleaning process on the discharge module 50, but may perform the pre-wetting process on the discharge module 50 only. In this case, the plating apparatus 1000 should include a cleaning module for performing cleaning processing in addition to the plating module 400 .

Even in this modified example, since the pre-wetting process can be performed without having a pre-wetting module in addition to the plating module 400 , it is different from the conventional plating that includes a pre-wetting module in addition to the plating module 400 . Compared with the coating device, the size of the coating device 1000 can be reduced. (Modified example 2)

Alternatively, the plating apparatus 1000 may not perform the pre-wetting process by the discharging module 50 , but only perform the cleaning process by the discharging module 50 . In this case, the plating apparatus 1000 should include a pre-wetting module for performing pre-wetting treatment in addition to the plating module 400 .

Even in this modified example, since the cleaning process can be performed without having to include a cleaning module in addition to the plating module 400 , it is compared with the conventional plating apparatus that includes a cleaning module in addition to the plating module 400 . , the miniaturization of the coating apparatus 1000 can be achieved. (Modification 3)

FIG. 7 is a schematic diagram showing the peripheral configuration of the substrate holder 30 when the pre-wetting process or the cleaning process of the present modification is performed. In the above-described embodiment or modification 1, the pre-wetting treatment may further include, when the processing liquid PL is discharged from the nozzle 52 , in the outer periphery of the substrate holder 30 , the portion 30 a that is closer to the rotating shaft 61 than the portion that is farther from the rotating shaft 61 . The substrate holder 30 is tilted by the tilt mechanism 47 so that the 30 b is positioned downward. That is, at this time, in the pre-wetting process, the substrate holder 30 is rotated while the substrate holder 30 is tilted as described above, and the processing liquid PL is discharged from the nozzle 52 .

Similarly, in the above-described embodiment or modification 2, the cleaning process may further include rotating the outer periphery of the substrate holder 30 so that the portion 30a closer to the rotating shaft 61 is farther away than the processing liquid PL is discharged from the nozzle 52 . The substrate holder 30 is tilted by the tilt mechanism 47 so that the portion 30b of the shaft 61 is positioned downward. That is, at this time, in the cleaning process, the substrate holder 30 is rotated while the substrate holder 30 is tilted as described above, and the processing liquid PL is discharged from the nozzle 52 .

According to the present modification, it is possible to effectively prevent the processing liquid PL that has fallen after being discharged from the nozzle 52 from entering the coating tank 10 .

The embodiments and modifications of the present invention have been described in detail above, but the present invention is not limited to the specific embodiments and modifications, and various modifications and changes can be made within the scope of the gist of the present invention described in the scope of the claims.

10: Plating tank 10a: Bottom wall 10b: Peripheral wall portion 10c: Protrusion 10d: Hold the member 11: Anode 12: Diaphragm 13: Anode chamber 14: Cathode Chamber 15: Supply port for anode 16: Discharge port for anode 17: Supply port for cathode 18: Resistor body 19: Anode Mask 19a: Opening 20: Overflow tank 30: Substrate holder 40: Rotary Mechanism 45: Lifting mechanism 46: Pivot 47: Tilt Mechanism 50: Spit out mods 51: Module body 52: Nozzle 53: Recycled Components 54: Recess 55: Ditch 60: Mobile Mechanism 61: Rotary axis 62: Actuator 70a, 70b: Pump 71a, 71b: Storage tanks 72a, 72b: Piping 73: Supply flow path 74: Discharge flow path 30a: The part close to the rotation axis 30b: The part away from the rotation axis 100: Load port 110: Transfer Robot 120: Aligner 300: Prepreg module 400: Plating module 600: Spin Rinse Dryer 700: Conveyor 800: Control Module 801:CPU 802: Memory Department 1000: Coating device PL: Treatment liquid Ps: plating solution Wf: substrate Wfa: below

FIG. 1 is a perspective view showing the overall configuration of a coating apparatus according to an embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus according to the embodiment. FIG. 3 is a block diagram for explaining the plating module of the embodiment. 4(A) and 4(B) are schematic plan views of the discharge module of the embodiment. FIG. 5 is a schematic diagram showing the overall configuration of the discharge module according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a cross-section taken along the line A2-A2 in FIG. 5 . FIG. 7 is a schematic diagram showing the peripheral configuration of the substrate holder when the pre-wetting process or the cleaning process of the modification 3 of the embodiment is performed.

30: Substrate holder

40: Rotary Mechanism

50: Spit out mods

51: Module body

52: Nozzle

60: Mobile Mechanism

61: Rotary axis

62: Actuator

70a, 70b: Pump

71a, 71b: Storage tanks

72a, 72b: Piping

73: Supply flow path

74: Discharge flow path

PL: Treatment liquid

Wf: substrate

Wfa: below

Claims (8)

A plating apparatus has a plating module, which is provided with: a plating tank, which is equipped with an anode; a substrate holder, which is disposed above the anode and holds a substrate serving as a cathode; and a rotating mechanism, it rotates the aforementioned substrate holder; And the plating module is further provided with a discharge module, which discharges a prescribed treatment liquid toward the lower surface of the substrate held in the substrate holder, The aforementioned ejection module is provided with: a module body, which has a plurality of nozzles for ejecting the aforementioned processing liquid toward the upper side; and a moving mechanism, which has a rotating shaft arranged beside the aforementioned coating tank and connected to the aforementioned module body, through which The module body is moved by the rotation of the rotating shaft; The moving mechanism makes the module body in the first position where the module body is not between the base plate and the anode; and the module body is between the base plate and the anode, and the aforesaid treatment is spit out from the plurality of nozzles the liquid is moved between the second positions in contact with the underside of the aforementioned substrate, The plurality of nozzles are arranged in such a manner that when the module body is moved to the second position, the processing liquid discharged from the plurality of nozzles contacts from the lower surface center portion to the outer peripheral portion of the substrate, The module body further includes a recovery member configured to recover the processing liquid that has been discharged from the plurality of nozzles and has come into contact with the lower surface of the substrate. The coating device of claim 1, wherein the module body extends in a direction away from the rotation axis when viewed in plan, The plurality of nozzles are arranged in the extension direction of the module body from a plan view, and are also arranged in a direction perpendicular to the extension direction of the module body. The coating apparatus according to claim 1 or 2, wherein the recovery member has a concave portion formed on the upper surface of the module body, The plurality of nozzles are arranged in the concave portion. The coating apparatus according to claim 1 or 2, wherein the treatment liquid is pure water. A pre-wetting treatment method, using the coating device of any one of claims 1 to 4, In addition, before performing the plating process for performing plating on the lower surface of the substrate held in the substrate holder, a pre-wetting process for wetting the lower surface of the substrate with the treatment solution is included, The pre-wetting treatment includes moving the module body from the first position to the second position by the moving mechanism, rotating the substrate holder by the rotating mechanism, and discharging the processing liquid from the plurality of nozzles. The pre-wetting treatment method according to claim 5, wherein the coating apparatus further includes a tilting mechanism for tilting the substrate holder, The pre-wetting treatment includes the tilting mechanism such that, in the outer periphery of the substrate holder, when the processing liquid is discharged from the plurality of nozzles, a portion close to the rotation axis is located below a portion farther from the rotation axis. The aforementioned substrate holder is tilted. A cleaning treatment method, using the coating device of any one of claims 1 to 4, In addition, after performing a plating process for performing plating on the lower surface of the substrate held in the substrate holder, a cleaning process for cleaning the lower surface of the substrate with the treatment solution is included, The cleaning process includes moving the module body from the first position to the second position by the moving mechanism, rotating the substrate holder by the rotating mechanism, and discharging the processing liquid from the plurality of nozzles. The cleaning treatment method of claim 7, wherein the coating apparatus further includes a tilting mechanism for tilting the substrate holder, In the cleaning process, when the processing liquid is discharged from the plurality of nozzles, the tilting mechanism causes a portion close to the rotation axis in the outer periphery of the substrate holder to be located below a portion farther from the rotation axis. The aforementioned substrate holder is inclined.

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