TW202228500A - Heat-dissipating circuit module and circuit board structure - Google Patents

Abstract

The present invention provides a heat-dissipating circuit module and a circuit board structure. The circuit board structure includes a main board and a heat pipe that is embedded in the main board. The main board includes a heat- conductive circuit net connected to the heat pipe, and has a plurality of heat-dissipating holes and a plurality of heat-absorbing holes, which correspond in position to the heat-transmission circuit net. The heat pipe is in an elongated shape and has a heat-conductive fluid therein. Portions of the heat-conductive circuit net corresponding in position to the heat-dissipating holes and the heat-absorbing holes are respectively connected to heat-dissipating regions and heat-absorbing regions of the heat pipe that are located in different positions in a longitudinal direction of the heat pipe. Heat energy absorbed by at least one of the heat-absorbing regions can be transmitted by the heat- conductive circuit net so as to allow the heat-conductive fluid to form two thermal-cycles for heat-dissipation of two of the heat-dissipating holes.

Description

Circuit cooling module and circuit board structure

The invention relates to a circuit board, in particular to a circuit heat dissipation module and a circuit board structure.

At present, common electronic products, such as mobile phones and notebook computers, are under the trend of miniaturization, and the overall packaging and module stacking density is getting higher and higher. Therefore, electronic products have more and more functions, and consume more and more power, so that electronic products generate a lot of heat energy during operation, thereby increasing the temperature of electronic products.

Accordingly, in order to reduce the reliability degradation of electronic products due to excessive temperature, copper pillars are usually designed on the circuit board as heat dissipation paths for electronic components. However, the heat dissipation efficiency of the above-mentioned circuit boards with copper pillars has gradually become insufficient. Therefore, how to improve the heat dissipation efficiency of the circuit boards has become one of the main research and development issues in the industry.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

The embodiments of the present invention provide a circuit heat dissipation module and a circuit board structure, which can effectively improve the defects that may occur in the existing circuit boards.

The embodiment of the present invention discloses a circuit heat dissipation module, which includes: a circuit board structure, including: a main board body, including a heat-conducting circuit network, and the main board body is formed with a plurality of heat-dissipating circuits whose positions correspond to the heat-conducting circuit network holes and a plurality of heat absorption holes; and a heat pipe embedded in the main body and connected to the heat conduction circuit network; wherein, a heat conduction fluid is arranged in the heat pipe, and the heat pipe is elongated and defines a length direction ; Wherein, the parts of the heat-conducting circuit network corresponding to a plurality of the heat-dissipating holes are respectively connected to a plurality of heat-dissipating areas of the heat pipe, and the parts of the heat-conducting circuit network corresponding to the plurality of the heat-absorbing holes are respectively connected to A plurality of heat-absorbing regions of the heat pipe, and a plurality of the heat-dissipating regions and a plurality of the heat-absorbing regions are located at different positions in the longitudinal direction; a plurality of heat-dissipating elements are respectively arranged in the plurality of the heat-dissipating holes and connected to the heat-dissipating circuit network; and a plurality of heating elements, respectively arranged in the plurality of the heat-absorbing holes and connected to the heat-conducting circuit network; wherein, the heat energy generated by at least one of the heating elements is used to pass the The transmission of the heat-conducting circuit network enables the heat-conducting fluid in the heat pipe to form two heat cycles, and then dissipate heat in the two heat-dissipating elements respectively.

The embodiment of the present invention also discloses a circuit board structure, which includes: a main board body including a heat conduction circuit network, and the main board body is formed with a plurality of heat dissipation holes and a plurality of heat absorption holes corresponding to the heat conduction circuit network; and a heat pipe, embedded in the main board body and connected to the heat conduction circuit network; wherein, a heat conduction fluid is arranged in the heat pipe, and the heat pipe is elongated and defines a length direction; wherein, corresponding to a plurality of The parts of the heat conduction circuit network of the heat dissipation holes are respectively connected to a plurality of heat dissipation areas of the heat pipe, and the parts of the heat conduction circuit network corresponding to the plurality of heat absorption holes are respectively connected to a plurality of heat absorption parts of the heat pipe. area, and a plurality of the heat dissipation areas and a plurality of the heat absorption areas are located at different positions in the length direction respectively; wherein, the heat energy absorbed by at least one of the heat absorption areas is used for transmission through the heat conduction circuit network , so that the heat-conducting fluid in the heat pipe forms two thermal cycles, and then dissipates heat in the two heat-dissipating holes respectively.

To sum up, the circuit heat dissipation module and the circuit board structure disclosed in the embodiments of the present invention are matched with the heat pipe through the heat conduction circuit network of the main board body, so that the heat energy transmission path constitutes a multi-input multi-channel structure. The output shunt heat dissipation structure enables the circuit board structure to be suitable for a plurality of the heat generating elements with different heat generation efficiencies, thereby effectively improving the heat dissipation effect.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

The following are specific embodiments to illustrate the embodiments of the "circuit heat dissipation module and circuit board structure" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[Example 1]

Please refer to FIG. 1 to FIG. 10 , which are Embodiment 1 of the present invention. This embodiment discloses a circuit board structure 100 and a manufacturing method thereof, and the circuit board structure 100 is manufactured by the manufacturing method of the circuit board structure in this embodiment, but the invention is not limited thereto. In order to facilitate the understanding of this embodiment, the following will first describe the manufacturing method of the circuit board structure, and then briefly describe the structure of the circuit board structure 100; The section line VIII-VIII is used to facilitate the description of the manufacturing method of the circuit board structure.

As shown in FIG. 2 to FIG. 9 , the manufacturing method of the circuit board structure in this embodiment sequentially includes a pre-step S110 , a tube selection step S120 , a configuration step S130 , a burying step S140 , and a build-up layer. Step S150, a heat conduction step S160, and a solder mask step S170, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the manufacturing method of the circuit board structure may also omit at least one of the above steps (eg, the heat conduction step S160 and/or the solder mask step S170 ) , or with other steps.

As shown in FIG. 2 and FIG. 3 , in the pre-step S110 , a penetrating slot hole 14 is formed on a circuit substrate 1 , and a conductive connection layer 15 is formed on the hole wall of the slot hole 14 . Wherein, the circuit substrate 1 includes a first circuit layer 11 and a second circuit layer 12 respectively located on opposite sides (eg, the top side and the bottom side of the circuit substrate 1 ), and a first circuit layer 12 located on the first circuit substrate 1 . At least one inner circuit layer 13 between the circuit layer 11 and the second circuit layer 12 .

Further, after the conductive connection layer 15 is formed, the conductive connection layer 15 may be connected to the first circuit layer 11 , the second circuit layer 12 , and at least one of the inner circuit layers 13 at least one of them. Furthermore, the conductive connection layer 15 can be further oxidized with a potion (not shown in the figure), so as to improve the bonding between the conductive connection layer 15 and subsequent components (such as the heat pipe 6 of 5 ), The second circuit layer 12 may be patterned according to design requirements, but the invention is not limited thereto.

As shown in FIG. 4 , the pipe selection step S120 is to select a heat pipe 6 with a heat transfer fluid 6c inside. Wherein, an outer diameter D6 of the heat pipe 6 is larger than the hole depth D14 of the slot hole 14 , and the volume of the heat pipe 6 is preferably between 70% and 110% of the volume of the slot hole 14 . More specifically, the heat pipe 6 is closed in this embodiment and has a pipe (not shown, such as a copper pipe), a capillary structure disposed on the inner wall of the pipe, and a capillary structure accommodated in the pipe The heat transfer fluid 6c (eg: water, alcohol) inside.

More specifically, the heat pipe 6 in this embodiment includes a first end portion 61 and a second end portion respectively located on opposite sides (as shown in FIG. 4 , the top side and the bottom side of the heat pipe 6 ) 62 , and two side edges 63 located on opposite sides (as shown in FIG. 4 , the left and right sides of the heat pipe 6 ), and between the first end 61 and the second end 62 The maximum distance is defined as the outer diameter D6.

As shown in FIG. 4 , in the configuration step S130 : place the heat pipe 6 in the slot 14 of the circuit substrate 1 , and make a part of the heat pipe 6 (eg, the first end 61 ) ) protrudes out of the slot 14 . Wherein, the heat pipe 6 is preferably not in contact with the conductive connection layer 15; that is, the two side edges 63 of the heat pipe 6 face the conductive connection layer 15, and each of the side edges 63 and the portion of the conductive connection layer 15 facing each other are arranged at intervals.

As shown in FIG. 5 , the embedding step S140 : squeeze the heat pipe 6 , so that the heat pipe 6 is deformed to abut the conductive connection layer 15 , and the heat pipe 6 is completely located in the slot hole within 14. In this embodiment, the heat pipe 6 may be pressed by the first end portion 61 and the second end portion 62, so that the two side edges 63 face the adjacent ones respectively. The portion of the conductive connection layer 15 is deformed and extended, so that each of the side edges 63 abuts against the portion of the conductive connection layer 15 that it faces.

In more detail, the heat pipe 6 can be squeezed and deformed into different shapes according to design requirements or different pipe selection conditions (eg, the volume of the heat pipe 6 is 70% to 110% of the volume of the slot hole 14 ). shape. For example, as shown in FIG. 5 , after the heat pipe 6 is extruded and deformed, each of the side edges 63 is flat and is flat on the portion of the conductive connection layer 15 it faces. One end portion 61 is aligned with the first circuit layer 11 , and the second end portion 62 is aligned with the second circuit layer 12 . Alternatively, as shown in FIG. 9 , after the heat pipe 6 is squeezed and deformed, each of the side edges 63 is in the shape of an arc and abuts against a part of the portion of the conductive connection layer 15 facing the heat pipe 6 . The first end portion 61 is aligned with the first circuit layer 11 , and the second end portion 62 is aligned with the second circuit layer 12 .

As shown in FIG. 6 , the layer build-up step S150 : a first build-up layer 2 is formed on one side (eg, the top side) of the circuit substrate 1 and the heat pipe 6 , and a first build-up layer 2 is formed on the circuit substrate 1 and the heat pipe 6 . A second additional layer 3 is formed on the other side (eg, the bottom side) of the heat pipe 6 . In this embodiment, the first circuit layer 11 is embedded in the first extension layer 2 , the second circuit layer 12 is embedded in the second extension layer 3 , and the first extension layer is The layer 2 and the second additional layer 3 fill the gap between the heat pipe 6 and the conductive connection layer 15 .

As shown in FIG. 7 , in the heat conduction step S160 : forming a plurality of first heat conduction columns 21 embedded in the first additional layer 2 , and one end (eg, the top end of the plurality of first heat conduction columns 21 ) is formed. ) is exposed outside the first additional layer 2 , and the other ends (eg, bottom ends) of the first thermal conductive pillars 21 are respectively connected to the first circuit layer 11 and the heat pipes 6 . The first end portion 61 is described.

Furthermore, in the heat-conducting step S160 , a plurality of second heat-conducting pillars 31 may be embedded in the second additional layer 3 , and one end (eg, the bottom end) of the plurality of second heat-conducting pillars 31 may be formed. It is exposed outside the second additional layer 3 , and the other ends (eg, the top ends) of the plurality of first thermally conductive columns 21 are connected to the second ends 62 of the heat pipes 6 .

In addition, in other embodiments not shown in the present invention, a plurality of second thermally conductive pillars 31 connected to the second circuit layer 12 can be further added in the second additional layer 3 , and one end of which is also exposed to the outside the second additional layer 3 .

As shown in FIG. 8 , in the solder mask step S170 : a first solder mask layer 4 is formed on the first extension layer 2 , and a second solder mask layer 5 is formed on the second extension layer 3 ; Wherein, the one end (eg: top end) of the plurality of first thermally conductive pillars 21 is exposed outside the first solder resist layer 4 , and the one end (eg: The bottom end) is exposed outside the second solder resist layer 5 .

According to the above, the circuit board structure 100 can be formed by implementing the above steps S110-S170, and the circuit board structure 100 is deformed into a suitable shape by pressing the heat pipe 6, so that the heat pipe 6 can be properly embedded in the circuit substrate 1, thereby effectively improving the heat dissipation performance. Further, in the circuit board structure 100 , a plurality of the first thermally conductive pillars 21 and a plurality of the second thermally conductive pillars 31 can be used to connect heat dissipation elements (eg, heat dissipation fins) according to design requirements Or a heating element (such as an electronic chip), so as to achieve the effect of rapid heat dissipation through the heat pipe 6 .

In addition, the specific structure of the circuit board structure 100 can be adjusted and changed according to design requirements, and is not limited to the drawings of this embodiment.

[Example 2]

Please refer to FIG. 11 to FIG. 14 , which are Embodiment 2 of the present invention. This embodiment discloses a circuit heat dissipation module 1000 and a circuit board structure 100. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated (for example, the circuit board structure of this embodiment) 100 can be made by the manufacturing method of the circuit board described in the first embodiment), and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

In this embodiment, the circuit heat dissipation module 1000 includes a circuit board structure 100, a plurality of heat dissipation elements 200 (eg, heat dissipation fins) disposed on the circuit board structure 100, and disposed on the circuit board. A plurality of heating elements 300 (eg, electronic chips) on the structure 100 . It should be noted that although the circuit board structure 100 is described as being matched with a plurality of the heat dissipation elements 200 and a plurality of the heating elements 300 in this embodiment, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the circuit board structure 100 may be matched with at least one heat dissipation element 200 and/or at least one heating element 300 ; or, the circuit board structure 100 It can also be used individually (eg, sold).

In order to facilitate the description of the circuit heat dissipation module 1000 of the present embodiment, the circuit board structure 100 will be described first, and then the circuit board structure 100 will be described in a timely manner compared with the plurality of the heat dissipation elements 200 and the plurality of heat dissipation elements 200 . The connection relationship between the heating elements 300 is described.

As shown in FIGS. 12 to 14 , the circuit board structure 100 includes a main board body M and a heat pipe 6 embedded in the main board body M; wherein, the heat pipe 6 is elongated and defines a length direction L , and the structure of the heat pipe 6 in this embodiment is equivalent to the structure of the heat pipe 6 embedded in the circuit board structure 100 in the above-mentioned first embodiment, so it is not repeated here.

The mainboard body M includes a heat-conducting circuit network N connected to the heat pipe 6, and the mainboard body M is formed with a plurality of heat dissipation holes 41, 51 and a plurality of heat-absorbing holes corresponding to the heat-conducting circuit network N. 42, 52. The parts of the heat conduction circuit network N corresponding to the plurality of heat dissipation holes 41 and 51 are respectively connected to the plurality of heat dissipation areas 64 of the heat pipe 6 , and the parts of the heat dissipation holes 42 and 52 corresponding to the plurality of heat absorption holes 42 and 52 are respectively connected to the plurality of heat dissipation regions 64 of the heat pipe 6 . The parts of the heat conducting circuit network N are respectively connected to the plurality of heat absorption regions 65 of the heat pipe 6 , and the plurality of the heat dissipation regions 64 and the plurality of the heat absorption regions 65 are located at different positions in the longitudinal direction L, respectively.

Further, any one of the heat-dissipating regions 64 is spaced apart from any one of the adjacent heat-absorbing regions 65 in the longitudinal direction L, so that the heat-conducting fluid 6c in the heat pipe 6 can A thermal cycle is formed within the distance. To put it another way, the heat energy absorbed by at least one of the heat-absorbing regions 65 is used for transmission through the heat-conducting circuit network N, so that the heat-conducting fluid 6c in the heat pipe 6 forms two heat cycles, which are respectively The two heat dissipation holes 41 and 51 conduct heat dissipation.

Accordingly, in this embodiment, the circuit board structure 100 is matched with the heat pipe 6 through the heat conduction circuit network N of the main board body M, so that the heat energy transmission path forms a multi-input multi-output split heat dissipation structure , so that the circuit board structure 100 can be applied to a plurality of the heating elements 300 with different heat generating efficiencies, so as to effectively improve the heat dissipation effect.

It should be additionally noted that the circuit board structure 100 is described in this embodiment as a structure similar to that of the first embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the heat pipe 6 in the circuit board structure 100 can be embedded in the main board body M with an initial shape without any extrusion deformation .

In more detail, the main board body M in this embodiment includes a circuit substrate 1, a first additional layer 2 and a second additional layer 3 respectively located on opposite sides of the circuit substrate 1, formed on the circuit substrate 1. A first solder resist layer 4 of the first additional layer 2 , and a second solder resist layer 5 formed on the second additional layer 3 .

The circuit substrate 1 in this embodiment includes a first circuit layer 11 embedded in the first extension layer 2 and a second circuit layer embedded in the second extension layer 3 12. and at least one inner circuit layer 13 between the first circuit layer 11 and the second circuit layer 12; the circuit substrate 1, the first extension layer 2, and the second extension layer 3. The heat-conducting circuit network N is formed together.

Furthermore, the circuit substrate 1 is formed with a slot hole 14 penetrating from the first circuit layer 11 to the second circuit layer 12 , and a conductive connection layer 15 formed on the wall of the slot hole 14 . , and the first circuit layer 11 , the second circuit layer 12 , and at least one of the inner circuit layers 13 are all connected to the conductive connection layer 15 .

Further, the heat pipe 6 is embedded in the slot hole 14 and abuts against the conductive connection layer 15 , and the heat pipe 6 is preferably an extrusion deformation structure and is completely located in the slot hole 14 Inside, the conductive connection layer 15 is a post-oxidation structure, and the first extension layer 2 and the second extension layer 3 fill the gap between the heat pipe 6 and the conductive connection layer 15 . The detailed connection relationship between the heat pipe 6 and the circuit substrate 1 is the same as that in the first embodiment corresponding to the related descriptions in FIGS. 8 and 9 , and details are not repeated here.

In other words, the first extension layer 2 and the second extension layer 3 are respectively formed on opposite sides of the circuit substrate 1 and the heat pipe 6 . Furthermore, the positions of the plurality of heat dissipation holes 41 and 51 and the plurality of heat absorption holes 42 and 52 respectively correspond to at least one of the first extension layer 2 and the second extension layer 3 ; or In other words, a plurality of the heat dissipation holes 41 and 51 and a plurality of the heat absorption holes 42 and 52 are formed in at least one of the first solder resist layer 4 and the second solder resist layer 5 . In this embodiment, a plurality of the heat dissipation holes 41 and 51 and a plurality of the heat absorption holes 42 and 52 are respectively formed in the first solder resist layer 4 and the second solder resist layer 5 .

In more detail, a plurality of first thermally conductive pillars 21 are embedded in the first additional layer 2 , and one end of the plurality of first thermally conductive pillars 21 is exposed to at least one of the heat dissipation holes 41 , 51 and at least one of the heat dissipation holes 41 and 51 . Outside the heat absorption holes 42 and 52 , the other ends of the plurality of first thermally conductive pillars 21 are respectively connected to the first circuit layer 11 and the heat pipe 6 . That is to say, the one ends of the plurality of first thermal conductive pillars 21 are exposed to the heat dissipation holes 41 , 51 and the heat absorption holes 42 , 52 formed in the first solder resist layer 4 .

Furthermore, a plurality of second thermally conductive pillars 31 are embedded in the second additional layer 3 , and one end of the plurality of second thermally conductive pillars 31 is exposed to at least one of the heat dissipation holes 41 and 51 and at least one of the heat dissipation holes 41 and 51 . Besides the heat absorption holes 42 and 52 , the other ends of the plurality of second thermally conductive pillars 31 are connected to the heat pipe 6 and the second circuit layer 12 . That is to say, the ends of the plurality of second thermally conductive pillars 31 are exposed to the heat dissipation holes 41 , 51 and the heat absorption holes 42 , 52 formed in the second solder resist layer 5 .

Accordingly, the positions of the plurality of heat dissipation holes 41 , 51 and the plurality of heat absorption holes 42 , 52 in this embodiment correspond to the plurality of first thermal conductive pillars 21 of the first additional layer 2 respectively. and a plurality of the second thermal conductive pillars 31 of the second additional layer 3 . Furthermore, the thermally conductive circuit network N includes the first circuit layer 11 , the conductive connection layer 15 , a plurality of the first thermally conductive pillars 21 , the second circuit layer 12 , and a plurality of the first circuit layers 12 . Two thermally conductive pillars 31 .

In addition, in other embodiments not shown in the present invention, the plurality of second thermal conductive pillars 31 in the second additional layer 3 may only be exposed outside the heat dissipation holes 41 and 51 and connected to the heat pipe 6; alternatively, the plurality of second thermal conductive pillars 31 in the second additional layer 3 may only be exposed outside the heat absorption holes 42 and 52 and connected to the second circuit layer 12; or, The second additional layer 3 may not be provided with any of the second thermally conductive pillars 31 , and the thermally conductive circuit network N includes the first circuit layer 11 , the conductive connection layer 15 , and a plurality of The first thermal conductive column 21 is described.

The above is a description of the structure of the circuit board structure 100 in this embodiment, and the following describes the connection relationship between the circuit board structure 100 compared to the plurality of heat dissipation elements 200 and the plurality of the heating elements 300 . Wherein, a plurality of the heat dissipation elements 200 are respectively arranged in the plurality of the heat dissipation holes 41 and 51 of the circuit board structure 100 to be connected to the heat conduction circuit network N, and the plurality of the heating elements 300 are respectively arranged in the plurality of the heat dissipation holes 41 and 51 of the circuit board structure 100 The plurality of the heat absorption holes 42 and 52 of the circuit board structure 100 are connected to the heat conduction circuit network N.

Accordingly, the heat energy generated by at least one of the heating elements 300 is used for transmission through the heat-conducting circuit network N, so that the heat-conducting fluid 6c in the heat pipe 6 forms two heat cycles, and then the heat-conducting fluid 6c in the heat pipe 6 is divided into two The heat dissipation element 200 dissipates heat. In other words, in this embodiment, the circuit board structure 100 can be matched with the heat pipe 6 through the heat conduction circuit network N (for example, the plurality of heat dissipation areas 64 and the plurality of heat absorption areas 65 are located in are located at different positions in the longitudinal direction L), and are further suitable for a plurality of the heating elements 300 with different heat generation efficiencies.

[Technical effects of the embodiments of the present invention]

To sum up, in the circuit board structure and the manufacturing method thereof disclosed in the embodiments of the present invention, in the first embodiment, the heat pipe is deformed into a suitable shape by extruding the heat pipe, so that the heat pipe can be properly buried placed in the circuit substrate, thereby effectively improving the heat dissipation performance.

Furthermore, in the circuit heat dissipation module and the circuit board structure disclosed in the embodiment of the present invention, in the second embodiment, the heat conduction circuit network of the main board body is matched with the heat pipe, so that the heat energy transmission path is formed. The multi-input and multi-output shunt heat dissipation structure enables the circuit board structure to be suitable for a plurality of the heat generating elements with different heat generation efficiencies, thereby effectively improving the heat dissipation effect.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

1000: circuit cooling module 100: Circuit Board Structure 1: circuit substrate 11: The first circuit layer 12: Second circuit layer 13: Internal circuit layer 14: Slotted hole 15: Conductive connection layer 2: The first additional floor 21: The first thermal column 3: The second additional floor 31: Second thermal column 4: The first solder mask 41: cooling holes 42: Endothermic hole 5: The second solder mask 51: cooling holes 52: Endothermic hole 6: Heat pipe 6c: Thermal fluid 61: First end 62: Second end 63: Lateral edge 64: heat dissipation area 65: Endothermic zone M: mainboard body N: heat conduction circuit network 200: cooling element 300: heating element L: length direction D6: outer diameter D14: hole depth S110: Preliminary Steps S120: Pipe selection step S130: Configuration steps S140: Embedding step S150: Layer-Up Step S160: Thermal Conduction Step S170: Solder Mask Step

FIG. 1 is a three-dimensional schematic diagram of a circuit board structure according to Embodiment 1 of the present invention.

FIG. 2 is a schematic diagram (1) of the pre-steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

FIG. 3 is a schematic diagram (2) of the pre-steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

FIG. 4 is a schematic diagram of the tube selection steps and the configuration steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

FIG. 5 is a schematic diagram of the embedding steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

FIG. 6 is a schematic diagram of the build-up steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

FIG. 7 is a schematic diagram of a heat conduction step of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

FIG. 8 is a schematic diagram of a solder mask step of the manufacturing method of the circuit board structure according to the first embodiment of the present invention, which is a schematic cross-sectional view taken along the line VIII-VIII in FIG. 1 .

FIG. 9 is a schematic diagram of another aspect of FIG. 8 .

FIG. 10 is a schematic partial perspective cross-sectional view of FIG. 1 .

11 is a schematic perspective view of a circuit heat dissipation module according to Embodiment 2 of the present invention.

FIG. 12 is a partial perspective cross-sectional schematic diagram (1) of FIG. 11 .

FIG. 13 is a schematic partial perspective cross-sectional view (2) of FIG. 11 .

FIG. 14 is a schematic cross-sectional view along the line XIV-XIV of FIG. 11 .

1000: circuit cooling module

100: Circuit Board Structure

1: circuit substrate

11: The first circuit layer

12: Second circuit layer

13: Internal circuit layer

14: Slotted hole

15: Conductive connection layer

2: The first additional floor

21: The first thermal column

3: The second additional floor

31: Second thermal column

4: The first solder mask

41: cooling holes

42: Endothermic hole

5: The second solder mask

51: cooling holes

52: Endothermic hole

6: Heat pipe

6c: Thermal fluid

61: First end

62: Second end

64: heat dissipation area

65: Endothermic zone

M: mainboard body

N: heat conduction circuit network

200: cooling element

300: heating element

L: length direction

Claims (10)

A circuit heat dissipation module, comprising: A circuit board structure, including: a mainboard body, including a heat-conducting circuit network, and the mainboard body is formed with a plurality of heat dissipation holes and a plurality of heat-absorbing holes corresponding to the heat-conducting circuit network; and a heat pipe, embedded in the main board body and connected to the heat conduction circuit network; wherein, a heat conduction fluid is arranged in the heat pipe, and the heat pipe is elongated and defines a length direction; Wherein, the parts of the heat conduction circuit network corresponding to the plurality of heat dissipation holes are respectively connected to the plurality of heat dissipation areas of the heat pipe, and the parts of the heat conduction circuit network corresponding to the plurality of heat absorption holes are respectively connected to the plurality of heat dissipation holes. a plurality of heat-absorbing regions of the heat pipe, and the plurality of the heat-dissipating regions and the plurality of the heat-absorbing regions are respectively located at different positions in the length direction; a plurality of heat-dissipating elements, respectively disposed in the plurality of the heat-dissipating holes and connected to the heat-dissipating circuit network; and A plurality of heating elements are respectively arranged in a plurality of the heat-absorbing holes and connected to the heat-conducting circuit network; wherein, the heat energy generated by at least one of the heating elements is used for transmission through the heat-conducting circuit network, so as to make the heat-conducting circuit network The heat-conducting fluid in the heat pipe forms two heat cycles, and then dissipates heat in the two heat-dissipating elements respectively. The circuit heat dissipation module according to claim 1, wherein the mainboard body comprises: a circuit substrate formed with a slot hole and a conductive connection layer formed on the hole wall of the slot hole; wherein the heat pipe is embedded in the slot hole and abuts against the conductive connection layer; a first additional layer formed on one side of the circuit substrate and the heat pipe; and a second additional layer formed on the other side of the circuit substrate and the heat pipe; The positions of the plurality of heat dissipation holes and the plurality of heat absorption holes respectively correspond to at least one of the first extension layer and the second extension layer; the circuit substrate and the first extension layer , and the second additional layer together form the circuit heat conduction network. The circuit heat dissipation module of claim 2, wherein the main board body includes a first solder resist layer formed on the first additional layer and a second anti-soldering layer formed on the second additional layer A solder layer, and a plurality of the heat dissipation holes and a plurality of the heat absorption holes are formed in at least one of the first solder resist layer and the second solder resist layer. The circuit heat dissipation module of claim 2, wherein the circuit substrate includes a first circuit layer embedded in the first extension layer, and the first circuit layer is connected to the conductive connection A plurality of first heat conduction columns are embedded in the first additional layer, and one end of the plurality of first heat conduction columns is exposed outside at least one of the heat dissipation holes and at least one of the heat absorption holes, while many The other ends of each of the first thermally conductive pillars are respectively connected to the first circuit layer and the heat pipe; wherein, the thermally conductive circuit network includes the first circuit layer, the conductive connection layer, and a plurality of The first heat conduction column is described. The circuit heat dissipation module of claim 4, wherein the circuit substrate includes a second circuit layer embedded in the second extension layer, and the second circuit layer is connected to the conductive connection layer, a plurality of second heat-conducting columns are embedded in the second additional layer, and one end of the plurality of second heat-conducting columns is exposed outside at least one of the heat dissipation holes, and the other ends of the plurality of the heat-conducting columns are exposed. One end is connected to the heat pipe; wherein, the heat-conducting circuit network further includes the second circuit layer and a plurality of the second heat-conducting columns. The circuit heat dissipation module of claim 4, wherein the circuit substrate includes a second circuit layer embedded in the second extension layer, and the second circuit layer is connected to the conductive connection layer, a plurality of second heat-conducting columns are embedded in the second additional layer, and one end of the plurality of second heat-conducting columns is exposed outside at least one of the heat-absorbing holes, and the other ends of the plurality of the heat-conducting columns are exposed. One end is connected to the second circuit layer; wherein, the heat-conducting circuit network further includes the second circuit layer and a plurality of the second heat-conducting pillars. The circuit heat dissipation module according to claim 2, wherein the heat pipe is an extrusion deformation structure and is completely located in the slot hole, the conductive connection layer is an oxidized structure, and the first additional The layer and the second extension layer fill the gap between the heat pipe and the conductive connection layer. The circuit heat dissipation module according to claim 7, wherein the heat pipe includes two side edges facing the conductive connection layer, and each side edge of the heat pipe in the extrusion deformation structure is a It is planar and flatly attached to the portion of the conductive connection layer that it faces. The circuit heat dissipation module according to claim 7, wherein the heat pipe includes two side edges facing the conductive connection layer, and each side edge of the heat pipe in the extrusion deformation structure is a It is arc-shaped and is in contact with a part of the portion of the conductive connection layer that it faces. A circuit board structure comprising: a mainboard body including a heat-conducting circuit network, and the mainboard body is formed with a plurality of heat dissipation holes and a plurality of heat-absorbing holes corresponding to the heat-conducting circuit network; and a heat pipe, embedded in the main board body and connected to the heat conduction circuit network; wherein, a heat conduction fluid is arranged in the heat pipe, and the heat pipe is elongated and defines a length direction; Wherein, the parts of the heat conduction circuit network corresponding to the plurality of heat dissipation holes are respectively connected to the plurality of heat dissipation areas of the heat pipe, and the parts of the heat conduction circuit network corresponding to the plurality of heat absorption holes are respectively connected to the plurality of heat dissipation holes. a plurality of heat-absorbing regions of the heat pipe, and the plurality of the heat-dissipating regions and the plurality of the heat-absorbing regions are respectively located at different positions in the length direction; Wherein, the heat energy absorbed by at least one of the heat-absorbing regions is used for transmission through the heat-conducting circuit network, so that the heat-conducting fluid in the heat pipe forms two heat cycles, and then the heat-conducting fluid is carried out in the two heat-dissipating holes respectively. heat dissipation.

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