TW202227750A - Light source module for illumination device - Google Patents

Light source module for illumination device Download PDF

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Publication number
TW202227750A
TW202227750A TW110100587A TW110100587A TW202227750A TW 202227750 A TW202227750 A TW 202227750A TW 110100587 A TW110100587 A TW 110100587A TW 110100587 A TW110100587 A TW 110100587A TW 202227750 A TW202227750 A TW 202227750A
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Taiwan
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light
substrate
light source
source module
emitting diode
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TW110100587A
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Chinese (zh)
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郭明騰
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軒帆光電科技股份有限公司
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Publication of TW202227750A publication Critical patent/TW202227750A/en

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Abstract

A light source module for an illumination device is provided. The illumination device comprises a reflective surface. The reflective surface is able to be compatible with a halogen filament, which defines a filament length and a filament diameter. The light source module includes a substrate assembly, a first lighting group, and a second lighting group. The substrate assembly has a first surface and a second surface. The first lighting group is disposed on the first surface of the substrate assembly. The first lighting group has a first lighting surface. The first lighting surface has a first long side length, and the first long side length has positive correlation with the filament length. The second lighting group is disposed on the second surface of the substrate assembly. The second lighting group has a second lighting surface. The second lighting surface has a second long side length, and the second long side length has positive correlation with the filament length. The first lighting surface and the second lighting surface define a light source module thickness, and the light source module thickness has positive correlation with the filament diameter.

Description

用於照明裝置之光源模組Light source module for lighting device

本發明係關於一種用於照明裝置之光源模組,特別是一種用於車用照明裝置之光源模組。The present invention relates to a light source module for a lighting device, in particular to a light source module for a vehicle lighting device.

有別於一般照明,車用照明必須考量車輛行駛時的使用情境及安全性,因此有其特殊的規範及法規限制。其中,車燈所照射的區域中,亮區與暗區之間的交界線稱為截止線(cut-off line),而截止線若模糊,會導致照度分配不當,即亮區不夠亮而暗區不夠暗,導致駕駛人正前方視野處的照度不足,而不需要照明的區域則過亮,甚至對於對向來車造成眩光(glare)。Different from general lighting, vehicle lighting must consider the use situation and safety of the vehicle when driving, so it has its own special specifications and regulatory restrictions. Among them, in the area illuminated by the headlight, the boundary line between the bright area and the dark area is called the cut-off line, and if the cut-off line is blurred, it will lead to improper distribution of illumination, that is, the bright area is not bright enough and dark. If the area is not dark enough, the illumination in the field of vision in front of the driver is insufficient, and the area that does not need lighting is too bright, even causing glare to oncoming vehicles.

如圖1所示,習知的車燈結構1中,在燈罩11的中央處設置有光源13,光源13的選擇早期最常見為鹵素燈。鹵素燈係以鹵素燈絲131進行全周發光,其所產生的光線經由燈罩11反射後,在車燈前方形成照明區域A。習知燈車燈結構1所設計的燈罩11,是用於匹配鹵素燈絲131,如圖2所示,此鹵素燈絲131具有一燈絲長度L H及一燈絲直徑D H。藉此,希望能在照明區域A形成清楚的截止線,以符合車燈的設計規範及法規限制。 As shown in FIG. 1 , in the conventional vehicle lamp structure 1 , a light source 13 is disposed at the center of the lampshade 11 , and the light source 13 is most commonly selected from a halogen lamp in the early stage. The halogen lamp uses the halogen filament 131 to emit light all around, and the light generated by the halogen filament 131 is reflected by the lampshade 11 to form an illumination area A in front of the vehicle lamp. The lampshade 11 designed in the conventional lamp structure 1 is used to match the halogen filament 131 . As shown in FIG. 2 , the halogen filament 131 has a filament length L H and a filament diameter DH . Therefore, it is hoped that a clear cut-off line can be formed in the lighting area A so as to meet the design specifications and regulatory restrictions of the vehicle lamp.

隨著技術的演進,目前市場上的光源選擇已不侷限於鹵素燈。其中,發光二極體(Light Emitting Diode;LED)在單位瓦數下具有更高之流明輸出、更佳之照明功效以及更長之使用壽命等優點,已成為車燈光源的更佳選擇。然而,在車用照明生產廠商或消費者欲更換為不同光源時,因發光二極體屬於面光源,其對應的照明裝置之光學設計與幾近360度發光之鹵素燈光源不同,故無法單純將鹵素燈置換為發光二極體光源模組,車用照明生產廠商需另外進行光路設計,開發適用於發光二極體光源模組之模具,而消費者則需更換整個車用照明裝置。對產業界抑或消費者,均是額外的成本開銷,造成替換不同光源之阻礙。With the evolution of technology, the light source options on the market today are not limited to halogen lamps. Among them, Light Emitting Diode (LED) has the advantages of higher lumen output, better lighting efficiency and longer service life per unit wattage, and has become a better choice for vehicle light sources. However, when automotive lighting manufacturers or consumers want to change to a different light source, since the light-emitting diode is a surface light source, the optical design of the corresponding lighting device is different from the halogen light source that emits nearly 360 degrees, so it is impossible to simply To replace halogen lamps with LED light source modules, automotive lighting manufacturers need to additionally design the light path and develop molds suitable for LED light source modules, while consumers need to replace the entire vehicle lighting device. For the industry or consumers, it is an additional cost, which hinders the replacement of different light sources.

此外,現有的發光二極體光源模組中,每一顆發光二極體封裝體包含上半部的晶粒及下半部的陶瓷基板,透過陶瓷基板將發光二極體晶粒產生的熱傳導出,可省卻額外的絕緣層,提高發光二極體封裝體的整體導熱率,然而此種封裝體卻會提升光源模組的厚度,增加發光二極體光源模組與習知鹵素燈光源的光學設計差異。In addition, in the existing light-emitting diode light source module, each light-emitting diode package includes the upper half of the die and the lower half of the ceramic substrate, and the heat generated by the light-emitting diode die is conducted through the ceramic substrate. However, this kind of package will increase the thickness of the light source module and increase the difference between the light emitting diode light source module and the conventional halogen light source. Optical design differences.

有鑑於此,設計一種使用發光二極體的的光源模組,不僅能匹配既有鹵素燈的光學設計、增加照明區域的照度、提供清晰的截止線、及有效均勻地散熱,乃是業界亟待解決的問題。In view of this, designing a light source module using light-emitting diodes, which can not only match the optical design of the existing halogen lamps, increase the illuminance of the lighting area, provide a clear cut-off line, and effectively and uniformly dissipate heat, is an urgent need in the industry. solved problem.

本發明之一目的在於提供一種用於一照明裝置之光源模組, 此光源模組能雙面發光,且光源模組在雙面提供之發光二極體光源近似於習知鹵素燈,進而使光源模組能提供近似於傳統光源之全周光照明光線,讓無論是車輛照明裝置之生產廠商或是一般消費者,都能簡易地與傳統光源模組直接替換。One object of the present invention is to provide a light source module for a lighting device, the light source module can emit light on both sides, and the light emitting diode light source provided by the light source module on both sides is similar to the conventional halogen lamp, so that the The light source module can provide full ambient illumination light similar to the traditional light source, so that both the manufacturer of the vehicle lighting device or the general consumer can easily and directly replace the traditional light source module.

更詳細而言,相較於既有的雙面光源之發光二極體光源模組,本發明光源模組以既有的鹵素燈之燈絲長度及燈絲直徑作為模擬對象,且具有相同的光學中心,使得本發明採用發光二極體的光源模組規格與習知鹵素燈的規格相當,進而能與既有的鹵素燈燈罩匹配,產生預期的光形及截止線。藉此,生產廠商便無需為了更換成不同類型的光源模組,而額外花費時間及成本重新設計光路、重新開模製作模具,以符合所需的光形及截止線。In more detail, compared with the existing light-emitting diode light source module of double-sided light source, the light source module of the present invention takes the filament length and filament diameter of the existing halogen lamp as the simulation objects, and has the same optical center. , so that the specification of the light source module using the light-emitting diode of the present invention is equivalent to the specification of the conventional halogen lamp, and can be matched with the existing halogen lamp shade to generate the expected light shape and cut-off line. In this way, the manufacturer does not need to spend extra time and cost to redesign the light path and re-open the mold to make the mold to meet the required light shape and cut-off line in order to replace the light source module with a different type.

為達上述目的,本發明提供一種用於一照明裝置之光源模組。照明裝置包含一反射面,反射面可用於匹配一鹵素燈絲,其定義一燈絲長度及一燈絲直徑。光源模組包含一基板總成、一第一發光組以及一第二發光組。基板總成具有一第一面與一第二面。第一發光組設置於基板總成之第一面,第一發光組具有一第一發光面,第一發光面具有一第一長邊長度,第一長邊長度與燈絲長度正相關。第二發光組設置於基板總成之第二面,第二發光組具有一第二發光面,第二發光面具有一第二長邊長度,第二長邊長度與燈絲長度正相關。第一發光面與第二發光面共同界定一光源模組厚度,光源模組厚度與燈絲直徑正相關。In order to achieve the above object, the present invention provides a light source module for a lighting device. The lighting device includes a reflective surface that can be used to match a halogen filament, which defines a filament length and a filament diameter. The light source module includes a substrate assembly, a first light-emitting group and a second light-emitting group. The substrate assembly has a first surface and a second surface. The first light-emitting group is disposed on the first surface of the substrate assembly, the first light-emitting group has a first light-emitting surface, the first light-emitting surface has a first long side length, and the first long side length is positively correlated with the filament length. The second light-emitting group is disposed on the second surface of the substrate assembly, the second light-emitting group has a second light-emitting surface, the second light-emitting surface has a second long side length, and the second long side length is positively correlated with the filament length. The first light-emitting surface and the second light-emitting surface jointly define a thickness of a light source module, and the thickness of the light source module is positively correlated with the diameter of the filament.

於另一態樣中,鹵素燈絲具有一鹵素燈光學中心,光源模組之一光學中心與鹵素燈光學中心相同。In another aspect, the halogen filament has a halogen light optical center, and an optical center of the light source module is the same as the halogen light optical center.

於又一態樣中,光源模組厚度小於4公釐。In yet another aspect, the thickness of the light source module is less than 4 mm.

於再一態樣中,第一長邊長度與第二長邊長度均小於4公釐。In yet another aspect, the length of the first long side and the length of the second long side are both less than 4 mm.

於另一態樣中,照明裝置更包含一燈座,基板總成具有一第一基板與一第二基板,第一基板與第二基板夾設於燈座之兩側,第一面係位於第一基板之一第一外側表面,第二面係位於第二基板之一第二外側表面。In another aspect, the lighting device further includes a lamp holder, the substrate assembly has a first substrate and a second substrate, the first substrate and the second substrate are sandwiched on both sides of the lamp holder, and the first surface is located on the lamp holder. A first outer surface of the first substrate and a second surface are located on a second outer surface of the second substrate.

於又一態樣中,第一發光組與第二發光組各包含一第一發光二極體單元、一第二發光二極體單元和一第三發光二極體單元,第一發光二極體單元串聯至相互並聯的第二發光二極體單元及第三發光二極體單元。In yet another aspect, the first light-emitting group and the second light-emitting group each include a first light-emitting diode unit, a second light-emitting diode unit and a third light-emitting diode unit, the first light-emitting diode The body unit is connected in series to the second light emitting diode unit and the third light emitting diode unit which are connected in parallel.

於再一態樣中,光源模組更包含一第一載板與一第二載板,第一發光組之該等發光二極體單元設置於第一載板後,透過第一載板設置於基板總成之第一面,第二發光組之該等發光二極體單元設置於第二載板後,透過第二載板設置於基板之第二面。In another aspect, the light source module further includes a first carrier board and a second carrier board, and the light-emitting diode units of the first light-emitting group are arranged on the first carrier board and are arranged through the first carrier board On the first side of the substrate assembly, the light-emitting diode units of the second light-emitting group are arranged on the second side of the substrate through the second carrier after being arranged on the second carrier.

於另一態樣中,第一發光組與第二發光組更各包含一第四發光二極體單元,基板總成具有一第一基板與一第二基板,第一基板與第二基板分別具有一金屬基材層、一絕緣層及一線路層,並定義有至少一熱電分離區域,第一基板與第二基板之所述熱電分離區域中,絕緣層與線路層在所述熱電分離區域為鏤空並填充一導體,第一發光二極體單元與第二發光二極體單元藉由所述熱電分離區域中的該導體進行串聯,再與透過線路層並聯之第三發光二極體單元與第四發光二極體單元域進行串聯。In another aspect, each of the first light-emitting group and the second light-emitting group further includes a fourth light-emitting diode unit, the substrate assembly has a first substrate and a second substrate, and the first substrate and the second substrate are respectively It has a metal base material layer, an insulating layer and a circuit layer, and defines at least one thermoelectric separation area. In the thermoelectric separation area of the first substrate and the second substrate, the insulating layer and the circuit layer are in the thermoelectric separation area. In order to hollow out and fill a conductor, the first light-emitting diode unit and the second light-emitting diode unit are connected in series by the conductor in the thermoelectric separation area, and then connected to the third light-emitting diode unit connected in parallel through the circuit layer In series with the fourth light emitting diode unit domain.

於本發明其中一態樣中,第一發光組與第二發光組各包含一發光二極體單元,基板總成具有一第一基板與一第二基板,第一基板與第二基板分別具有一金屬基材層、一絕緣層及一線路層,並定義有至少一熱電分離區域,第一基板與第二基板之所述熱電分離區域中,絕緣層與線路層在所述熱電分離區域為鏤空並填充一導體,發光二極體單元之正負電極之其中之一直接貼附於所述熱電分離區域中的該導體。In one aspect of the present invention, each of the first light-emitting group and the second light-emitting group includes a light-emitting diode unit, the substrate assembly has a first substrate and a second substrate, and the first substrate and the second substrate respectively have A metal base material layer, an insulating layer and a circuit layer are defined, and at least one thermoelectric separation area is defined. In the thermoelectric separation area of the first substrate and the second substrate, the insulating layer and the circuit layer in the thermoelectric separation area are A conductor is hollowed out and filled, and one of the positive and negative electrodes of the light-emitting diode unit is directly attached to the conductor in the thermoelectric separation area.

於本發明其中一態樣中,第一發光組與該第二發光組各包含一第一發光二極體單元及一第二發光二極體單元,基板總成具有一第一基板及一第二基板,第一基板與第二基板分別具有一金屬基材層、一絕緣層及一線路層,並定義有至少一熱電分離區域,第一基板與第二基板之所述熱電分離區域中,絕緣層與線路層在所述熱電分離區域為鏤空並填充一導體,第一發光二極體單元與第二發光二極體單元藉由所述熱電分離區域中的導體進行串聯。In one aspect of the present invention, the first light-emitting group and the second light-emitting group each include a first light-emitting diode unit and a second light-emitting diode unit, and the substrate assembly has a first substrate and a first light-emitting diode unit. Two substrates. The first substrate and the second substrate respectively have a metal base material layer, an insulating layer and a circuit layer, and define at least one thermoelectric separation area. In the thermoelectric separation area of the first substrate and the second substrate, The insulating layer and the circuit layer are hollowed out and filled with a conductor in the thermoelectric separation area, and the first light emitting diode unit and the second light emitting diode unit are connected in series by the conductor in the thermoelectric separation area.

於又一態樣中,照明裝置更包含一固定座,燈座包含一散熱體,散熱體設置於燈座遠離設置光源模組之一端,散熱體與固定座相組配,使光源模組固定於照明裝置之固定座上。In another aspect, the lighting device further includes a fixing base, the lamp base includes a heat sink, the heat sink is disposed at an end of the lamp base away from the light source module, and the heat sink is assembled with the fixing base to fix the light source module. on the fixture of the lighting device.

於再一態樣中,照明裝置更包含一殼體,殼體內具有反射面,殼體之一光源開口與固定座連接,殼體之一透鏡開口遠離固定座向外延伸以形成一容置空間,固定座為環形而形成一中空區域,燈座穿過中空區域定位於容置空間內。In yet another aspect, the lighting device further includes a casing, the casing has a reflective surface, a light source opening of the casing is connected to the fixing base, and a lens opening of the casing extends outward away from the fixing base to form an accommodating space. , the fixed seat is annular to form a hollow area, and the lamp holder is positioned in the accommodating space through the hollow area.

為讓上述目的、技術特徵和優點能更明顯易懂,下文係以較佳實施例配合所附圖式進行詳細說明。In order to make the above objects, technical features and advantages more obvious and easy to understand, the following is a detailed description of the preferred embodiments in conjunction with the accompanying drawings.

以下將透過實施例來解釋本發明內容,本發明的實施例並非用以限制本發明須在如實施例所述之任何特定的環境、應用或特殊方式方能實施。因此,關於實施例之說明僅為闡釋本發明之目的,而非用以限制本發明。須說明者,以下實施例及圖式中,與本發明非直接相關之元件已省略而未繪示;且圖式中各元件間之尺寸關係僅為求容易瞭解,非用以限制實際比例。The content of the present invention will be explained by the following examples, which are not intended to limit the implementation of the present invention in any specific environment, application or special manner as described in the embodiments. Therefore, the description of the embodiments is only for the purpose of illustrating the present invention, rather than limiting the present invention. It should be noted that, in the following embodiments and drawings, elements not directly related to the present invention have been omitted and not shown; and the dimensional relationships among the elements in the drawings are only for easy understanding, and are not intended to limit the actual proportions.

請同時參考圖3、圖4及圖5,圖3為一照明裝置3之側視圖,圖4為用於此照明裝置3之本發明第一實施例的一種光源模組4之俯視立體爆炸圖,而圖5則為用於此照明裝置3之本發明第一實施例的一種光源模組4之仰視立體爆炸圖。於實際應用中,照明裝置3為車用之照明裝置。Please refer to FIGS. 3 , 4 and 5 at the same time. FIG. 3 is a side view of a lighting device 3 , and FIG. 4 is a top perspective exploded view of a light source module 4 used in the lighting device 3 according to the first embodiment of the present invention. 5 is a bottom perspective exploded view of a light source module 4 according to the first embodiment of the present invention for the lighting device 3 . In practical applications, the lighting device 3 is a vehicle lighting device.

請先參考圖3,照明裝置3包含光源模組4、一燈座31、一殼體33及一透鏡35。殼體33略呈半球形並形成一容置空間S,其兩端分別具有一光源開口331及一透鏡開口333。透鏡35係嵌設於直徑較大之透鏡開口333上;設置有光源模組4之燈座31該端則穿過光源開口331而環罩於殼體33之容置空間S中,燈座31之另一端則在殼體33之外,並與光源驅動電路(圖未示出)電性連接。殼體33,亦即業界所習稱之燈罩或燈杯,具有一上半部反射面335及一下半部反射面337。當光源模組4提供光線時,光線會先經由上半部反射面335及下半部反射面337反射至透鏡35,再由透鏡35集中於照明裝置3前方,以形成一照明區域。更詳細而言,照明裝置3之光學設計為反射式,本發明第一實施例之光源模組4向上半部反射面335提供用於照明區域之部分光線,亦向下部反射面337提供用於照明區域之部分光線。以下將詳細說明本發明第一實施例之光源模組4之內部元件與周邊元件配置及其光線提供機制。Please refer to FIG. 3 first, the lighting device 3 includes a light source module 4 , a lamp socket 31 , a casing 33 and a lens 35 . The casing 33 is slightly hemispherical and forms an accommodating space S, and two ends of the casing 33 respectively have a light source opening 331 and a lens opening 333 . The lens 35 is embedded in the lens opening 333 with a larger diameter; the end of the lamp holder 31 provided with the light source module 4 passes through the light source opening 331 and is enclosed in the accommodating space S of the housing 33 . The lamp holder 31 The other end is outside the casing 33 and is electrically connected to the light source driving circuit (not shown). The housing 33 , also known as a lampshade or a lamp cup in the industry, has an upper reflecting surface 335 and a lower reflecting surface 337 . When the light source module 4 provides light, the light is first reflected to the lens 35 through the upper half reflecting surface 335 and the lower half reflecting surface 337 , and then concentrated in front of the lighting device 3 by the lens 35 to form an illuminated area. In more detail, the optical design of the lighting device 3 is a reflective type. The light source module 4 of the first embodiment of the present invention provides the upper half reflecting surface 335 with part of the light used for the lighting area, and also provides the lower reflecting surface 337 with light for the lighting area. Part of the light in the illuminated area. The configuration of the internal components and peripheral components of the light source module 4 according to the first embodiment of the present invention and the light supply mechanism thereof will be described in detail below.

如圖4及圖5所示,光源模組4包含一基板總成41、一第一發光組43以及一第二發光組45。As shown in FIGS. 4 and 5 , the light source module 4 includes a substrate assembly 41 , a first light-emitting group 43 and a second light-emitting group 45 .

基板總成41具有一第一基板411、一第二基板413、一第一面415與一第二面417。第一基板411與第二基板413夾設於燈座31之兩側,如圖所示,第一面415係位於第一基板411之一第一外側表面,第二面417係位於第二基板413之一第二外側表面。The substrate assembly 41 has a first substrate 411 , a second substrate 413 , a first surface 415 and a second surface 417 . The first substrate 411 and the second substrate 413 are sandwiched between two sides of the lamp holder 31. As shown in the figure, the first surface 415 is located on a first outer surface of the first substrate 411, and the second surface 417 is located on the second substrate 413 a second outer side surface.

為了模擬習知的鹵素燈,進而提供類似於全周光之照明,第一發光組43設置於基板總成41之第一面415,第二發光組45則設置於基板總成41之第二面417,藉此使光源模組4的兩側均能提供照明光線。In order to simulate a conventional halogen lamp and provide illumination similar to full-circle light, the first light-emitting group 43 is disposed on the first surface 415 of the substrate assembly 41 , and the second light-emitting group 45 is disposed on the second surface 417 of the substrate assembly 41 , so that both sides of the light source module 4 can provide illumination light.

進一步而言,請同時參考圖2至圖5。採用本發明之光源模組4的照明裝置3中,其殼體33之上半部反射面335及下半部反射面337適可與習知鹵素燈車燈結構1之鹵素燈絲131相匹配,而此習知的鹵素燈絲131係定義有燈絲長度L H及燈絲直徑D H。本發明之第一發光組43具有一第一發光面431,第一發光面431具有一第一長邊長度L 1,第一長邊長度L 1與燈絲長度L H正相關。第二發光組45具有一第二發光面451,第二發光面451具有一第二長邊長度L 2,第二長邊長度L 2與燈絲長度L H正相關。第一發光面431與第二發光面451共同界定一光源模組厚度T,光源模組厚度T與燈絲直徑D H正相關。是故,第一發光組43之第一發光面431的長度與第二發光組45之第二發光面451的長度均與燈絲長度L H正相關,而第一發光組43之第一發光面431與第二發光組45之第二發光面451兩者之間的距離也與燈絲直徑D H正相關。 For further details, please refer to FIG. 2 to FIG. 5 at the same time. In the lighting device 3 using the light source module 4 of the present invention, the upper half reflecting surface 335 and the lower half reflecting surface 337 of the housing 33 are suitable for matching with the halogen filament 131 of the conventional halogen lamp vehicle lamp structure 1. The conventional halogen filament 131 is defined with a filament length L H and a filament diameter DH . The first light emitting group 43 of the present invention has a first light emitting surface 431 , and the first light emitting surface 431 has a first long side length L 1 , and the first long side length L 1 is positively correlated with the filament length L H. The second light-emitting group 45 has a second light-emitting surface 451 , the second light-emitting surface 451 has a second long side length L 2 , and the second long side length L 2 is positively correlated with the filament length L H . The first light emitting surface 431 and the second light emitting surface 451 together define a thickness T of the light source module, and the thickness T of the light source module is positively correlated with the diameter DH of the filament. Therefore, the length of the first light-emitting surface 431 of the first light-emitting group 43 and the length of the second light-emitting surface 451 of the second light-emitting group 45 are both positively related to the filament length L H , and the first light-emitting surface of the first light-emitting group 43 The distance between 431 and the second light-emitting surface 451 of the second light-emitting group 45 is also positively related to the filament diameter DH .

更詳細來說,習知鹵素燈車燈結構1之鹵素燈絲131具有一鹵素燈光學中心,而本發明光源模組4之一光學中心便與此鹵素燈光學中心相同。因此,本發明之光源模組4,不僅在發光二極體之光源尺寸上貼近鹵素燈絲131的尺寸規格,更使兩者之光學中心一致,降低兩種不同光源的差異性。More specifically, the halogen filament 131 of the conventional halogen lamp structure 1 has a halogen lamp optical center, and an optical center of the light source module 4 of the present invention is the same as the halogen lamp optical center. Therefore, the light source module 4 of the present invention is not only close to the size of the halogen filament 131 in terms of the light source size of the light emitting diode, but also makes the optical centers of the two consistent, reducing the difference between the two different light sources.

需說明的是,由於習知鹵素燈車燈結構1之鹵素燈絲131具有各種不同規格,其所搭配的殼體33亦具有不同的反射曲面設計,因此本發明之光源模組4中的第一發光組43及第二發光組45,仍係依前述概念對應調整,並可因應殼體33之反射曲面設計進行優化調整。It should be noted that, since the halogen filament 131 of the conventional halogen lamp structure 1 has various specifications, and the matching shell 33 also has different reflective surface designs, the first one in the light source module 4 of the present invention is the first one. The light-emitting group 43 and the second light-emitting group 45 are still correspondingly adjusted according to the aforementioned concept, and can be optimally adjusted according to the design of the reflective curved surface of the casing 33 .

除上述規格特徵外,較佳地,本發明之光源模組厚度T小於4公釐,且第一長邊長度L 1與第二長邊長度L 2均小於4公釐。於實際應用中,第一發光面431與第二發光面451之長寬分別可小於或等於4公釐與2公釐。更佳地,光源模組厚度T小於或等於2公釐。 In addition to the above specification features, preferably, the thickness T of the light source module of the present invention is less than 4 mm, and the first long side length L 1 and the second long side length L 2 are both less than 4 mm. In practical applications, the length and width of the first light-emitting surface 431 and the second light-emitting surface 451 may be less than or equal to 4 mm and 2 mm, respectively. More preferably, the thickness T of the light source module is less than or equal to 2 mm.

圖6所示為照明裝置之另一態樣的側視圖。與前述態樣相同之處在此不另贅述。於此態樣中,照明裝置6除了光源模組4、燈座31、殼體33及透鏡35之外,更包含一固定座61,燈座31則包含一散熱體311。散熱體311設置於燈座31遠離設置光源模組4之一端,散熱體311與固定座61相組配,使光源模組4固定於照明裝置6之固定座61上。更詳細而言,於此態樣中,殼體33之光源開口331與固定座61連接,固定座61為環形而形成一中空區域,燈座31穿過中空區域定位於容置空間S內。光源模組4所產生的熱,除了導引至散熱體311之外,更可進一步經由固定座61導引至殼體33,藉此,可提升散熱面積及整體之散熱效率。FIG. 6 is a side view of another aspect of the lighting device. The same points as the aforementioned aspects will not be repeated here. In this aspect, in addition to the light source module 4 , the lamp holder 31 , the casing 33 and the lens 35 , the lighting device 6 further includes a fixing base 61 , and the lamp holder 31 includes a heat sink 311 . The heat sink 311 is disposed at one end of the lamp holder 31 away from the light source module 4 . More specifically, in this aspect, the light source opening 331 of the housing 33 is connected to the fixing seat 61 , the fixing seat 61 is annular and forms a hollow area, and the lamp holder 31 is positioned in the accommodating space S through the hollow area. The heat generated by the light source module 4 can be further guided to the housing 33 through the fixing seat 61 in addition to being guided to the heat sink 311 , thereby improving the heat dissipation area and the overall heat dissipation efficiency.

接著請參考圖7至圖9,圖7為本發明第二實施例之光源模組7之局部俯視圖,圖8為本發明第二實施例之光源模組7之第一發光組73之電路簡圖,圖9則為本發明第二實施例之光源模組7之局部剖面圖。Next, please refer to FIGS. 7 to 9 . FIG. 7 is a partial top view of the light source module 7 according to the second embodiment of the present invention, and FIG. 8 is a schematic circuit diagram of the first light-emitting group 73 of the light source module 7 according to the second embodiment of the present invention. 9 is a partial cross-sectional view of the light source module 7 according to the second embodiment of the present invention.

本實施例之光源模組7亦包含一基板總成71、一第一發光組73以及一第二發光組75,基板總成71位於照明裝置之燈座31的兩側。為便於繪示說明,圖7與圖8僅以基板總成71及第一發光組73進行說明,第二發光組75之配置係與第一發光組73相同,故不重複描述。本實施例與第一實施例之差異在於,第一發光組73與第二發光組75各包含一第一發光二極體單元731、751、一第二發光二極體單元733、753和一第三發光二極體單元735、755。其中,第一發光組73之第二發光二極體單元733與第三發光二極體單元735兩者並聯,第一發光組73之第一發光二極體731再串聯至相互並聯的第一發光組73之第二發光二極體單元733與第一發光組73之第三發光二極體單元735。同樣地,第二發光組75之第二發光二極體單元753與第三發光二極體單元755兩者並聯,第二發光組75之第一發光二極體751再串聯至相互並聯的第二發光組75之第二發光二極體單元753與第二發光組75之第三發光二極體單元755。如圖所示,串聯及並聯配置的發光二極體單元,將經由導電線路70連接至正負電極。The light source module 7 of this embodiment also includes a substrate assembly 71 , a first light-emitting group 73 and a second light-emitting group 75 . The substrate assembly 71 is located on both sides of the lamp socket 31 of the lighting device. For ease of illustration, FIGS. 7 and 8 only illustrate the substrate assembly 71 and the first light-emitting group 73 . The configuration of the second light-emitting group 75 is the same as that of the first light-emitting group 73 , so the description is not repeated. The difference between this embodiment and the first embodiment is that the first light-emitting group 73 and the second light-emitting group 75 each include a first light-emitting diode unit 731, 751, a second light-emitting diode unit 733, 753, and a The third light emitting diode units 735 and 755 . The second light-emitting diode unit 733 and the third light-emitting diode unit 735 of the first light-emitting group 73 are connected in parallel, and the first light-emitting diode unit 731 of the first light-emitting group 73 is connected in series to the first light-emitting diode unit 731 connected in parallel with each other. The second light emitting diode unit 733 of the light emitting group 73 and the third light emitting diode unit 735 of the first light emitting group 73 are. Similarly, the second light-emitting diode unit 753 and the third light-emitting diode unit 755 of the second light-emitting group 75 are connected in parallel, and the first light-emitting diode unit 751 of the second light-emitting group 75 is connected in series to the second light-emitting diode unit 751 connected in parallel with each other. The second light-emitting diode unit 753 of the two light-emitting groups 75 and the third light-emitting diode unit 755 of the second light-emitting group 75 . As shown, the light emitting diode units arranged in series and in parallel will be connected to the positive and negative electrodes via conductive lines 70 .

由於發光二極體單元所產生的光強度與所施加的電流相關,藉由上述的串聯及並聯電路配置,並聯之第二發光二極體單元733、753與第三發光二極體單元735、755上個別通過的電流較小,而通過串聯之第一發光二極體單元731、751的電流則較大(為第二發光二極體單元733與第三發光二極體單元735的電流總和),是故第一發光組73和第二發光組75所提供之發光面中,光強度最強的區域便會偏離中心處而移向更靠近第一發光二極體731的位置。藉由前述串聯、並聯的配置變更,便能改變出光的光強度分佈,使照明區域在需要光強度的部分提高強度,不需要的部分則降低,因此能調整至符合車輛照明法規的照明區域需求,使亮區夠亮、暗區夠暗,以提供清晰明顯的截止線。Since the light intensity generated by the light-emitting diode unit is related to the applied current, the second light-emitting diode unit 733, 753 and the third light-emitting diode unit 735, The current passing through the 755 is relatively small, while the current passing through the first LED units 731 and 751 in series is relatively large (the sum of the currents of the second LED unit 733 and the third LED unit 735). ), therefore, in the light-emitting surfaces provided by the first light-emitting group 73 and the second light-emitting group 75 , the area with the strongest light intensity will deviate from the center and move to a position closer to the first light-emitting diode 731 . By changing the configuration of the series and parallel, the light intensity distribution of the light can be changed, so that the intensity of the lighting area can be increased in the part where the light intensity is required, and the intensity of the unneeded part can be reduced, so it can be adjusted to meet the lighting area requirements of vehicle lighting regulations. , making the bright areas bright enough and the dark areas dark enough to provide a clear cutoff line.

如圖7及圖9所示,於本實施例中,為達成前述的串聯及並聯之電路連接,光源模組7更包含一第一載板77與一第二載板79,第一發光組73之該等發光二極體單元731、733、735設置於第一載板77後,透過第一載板77設置於基板總成71之第一面711。第二發光組75之該等發光二極體單元751、753、755設置於第二載板79後,透過第二載板79設置於基板總成71之第二面713。第一載板77與第二載板79上佈有導電線路70,藉此導電線路70將第一載板77與第二載板79上的該等發光二極體進行前述串聯及並聯之電路連接。其中,第一載板77與第二載板79即為業界習稱的次黏著基板(Sub-mount),係由陶瓷燒製而成,其材料包含但不限於氮化鋁和氧化鋁。因此,第一載板77與第二載板79不僅能達成該等發光二極體單元之外部電路連接,更能協助該等發光二極體單元產生的熱均勻散佈,提升光源模組7的散熱效率。As shown in FIG. 7 and FIG. 9 , in this embodiment, in order to achieve the aforementioned circuit connection in series and parallel, the light source module 7 further includes a first carrier board 77 and a second carrier board 79 . The first light-emitting group After the light-emitting diode units 731 , 733 , and 735 of 73 are disposed on the first carrier plate 77 , they are disposed on the first surface 711 of the substrate assembly 71 through the first carrier plate 77 . The light emitting diode units 751 , 753 and 755 of the second light emitting group 75 are disposed on the second surface 713 of the substrate assembly 71 through the second carrier plate 79 after being disposed on the second carrier plate 79 . Conductive circuits 70 are arranged on the first carrier board 77 and the second carrier board 79 , whereby the conductive circuits 70 connect the light-emitting diodes on the first carrier board 77 and the second carrier board 79 to the aforementioned series and parallel circuits connect. The first carrier board 77 and the second carrier board 79 are known as sub-mounts in the industry, which are fired from ceramics, and the materials thereof include but are not limited to aluminum nitride and aluminum oxide. Therefore, the first carrier board 77 and the second carrier board 79 can not only achieve the external circuit connection of the light-emitting diode units, but also help the heat generated by the light-emitting diode units to be distributed evenly, thereby improving the performance of the light source module 7 cooling efficiency.

請參考圖10至圖12,圖10為本發明第三實施例之光源模組10之局部俯視圖,圖11為本發明第三實施例之光源模組10之第一發光組101之電路簡圖,圖12則為本發明第三實施例之光源模組10之局部剖面圖。Please refer to FIGS. 10 to 12. FIG. 10 is a partial top view of the light source module 10 according to the third embodiment of the present invention, and FIG. 11 is a schematic circuit diagram of the first light-emitting group 101 of the light source module 10 according to the third embodiment of the present invention. 12 is a partial cross-sectional view of the light source module 10 according to the third embodiment of the present invention.

同樣地,本實施例之光源模組10亦包含一基板總成(圖未示出)、一第一發光組101以及一第二發光組(圖未示出)。為便於繪示說明,圖10至圖12僅以第一發光組101作為示意,第二發光組之配置係與第一發光組101相同,故不重複描述。Similarly, the light source module 10 of this embodiment also includes a substrate assembly (not shown in the figure), a first light-emitting group 101 and a second light-emitting group (not shown in the figure). 10 to 12 only use the first light-emitting group 101 as a schematic diagram, and the configuration of the second light-emitting group is the same as that of the first light-emitting group 101, so the description is not repeated.

本實施例與第二實施例之差異,一者在於,第一發光組101包含一第一發光二極體單元1011、一第二發光二極體單元1013、一第三發光二極體單元1015和一第四發光二極體單元1017,第二發光組亦包含一第一發光二極體單元、一第二發光二極體單元、一第三發光二極體單元和一第四發光二極體單元(圖未示)。其中,第一發光組101之第三發光二極體單元1015與第一發光組101之第四發光二極體單元1017並聯後,再與第一發光組101之第一發光二極體單元1011、第一發光組101之第二發光二極體1013串聯。同樣地,第二發光組之第三發光二極體單元與第二發光組之第四發光二極體單元並聯後,再與第二發光組之第一發光二極體單元、第二發光組之第二發光二極體串聯。如圖所示,經串聯及並聯配置的發光二極體單元,再經由導電線路103連接至正負電極,而圖12的虛線則為電流的路徑。The difference between this embodiment and the second embodiment is that the first light-emitting group 101 includes a first light-emitting diode unit 1011 , a second light-emitting diode unit 1013 , and a third light-emitting diode unit 1015 and a fourth light-emitting diode unit 1017, the second light-emitting group also includes a first light-emitting diode unit, a second light-emitting diode unit, a third light-emitting diode unit and a fourth light-emitting diode unit body unit (not shown). The third light-emitting diode unit 1015 of the first light-emitting group 101 is connected in parallel with the fourth light-emitting diode unit 1017 of the first light-emitting group 101 and then connected to the first light-emitting diode unit 1011 of the first light-emitting group 101 and the second light emitting diodes 1013 of the first light emitting group 101 are connected in series. Similarly, after the third light-emitting diode unit of the second light-emitting group is connected in parallel with the fourth light-emitting diode unit of the second light-emitting group, it is connected to the first light-emitting diode unit and the second light-emitting group of the second light-emitting group. The second light emitting diodes are connected in series. As shown in the figure, the light emitting diode units arranged in series and in parallel are connected to the positive and negative electrodes through the conductive lines 103, and the dotted line in FIG. 12 is the path of the current.

再者,於本實施例中,第一發光組101與第二發光組之該等發光二極體的串聯及並聯,係單純在基板總成上透過金屬基板線路103進行電路連接,而不另外透過第一載板與第二載板,藉此減少光源模組10之整體厚度。Furthermore, in this embodiment, the series and parallel connection of the light-emitting diodes of the first light-emitting group 101 and the second light-emitting group is simply performed on the substrate assembly through the metal substrate circuit 103 for circuit connection, without additional Through the first carrier board and the second carrier board, the overall thickness of the light source module 10 is reduced.

為了提高本實施例相較於第二實施例之散熱效率,本實施例之基板總成同樣具有一第一基板105與一第二基板,第一基板105與第二基板夾設於燈座之兩側。請參考圖12,其以燈座一側之第一基板105為例。第一基板105與第二基板分別具有一金屬基材層1051、一絕緣層1053及一線路層1055,並定義有一熱電分離區域100。如圖所示,在第一基板105與第二基板各自的熱電分離區域100中,絕緣層1053與線路層1055在熱電分離區域100為鏤空,並在鏤空處填充一導體107。故更詳細而言,第一發光組101之第三發光二極體單元1015與第四發光二極體單元1017係透過第一基板105之線路層1055先並聯,而第一發光組101之第一發光二極體單元1011與第一發光組101之第二發光二極體單元1013於第一基板105之熱電分離區域100進行串聯。同樣地,第二發光組之第三發光二極體單元與第四發光二極體單元係透過第二基板之線路層並聯,而第二發光組之第一發光二極體單元與第二發光組之第二發光二極體單元於第二基板之熱電分離區域進行串聯。In order to improve the heat dissipation efficiency of the present embodiment compared with the second embodiment, the substrate assembly of the present embodiment also has a first substrate 105 and a second substrate, and the first substrate 105 and the second substrate are sandwiched between the lamp sockets. sides. Please refer to FIG. 12 , which takes the first substrate 105 on one side of the lamp socket as an example. The first substrate 105 and the second substrate respectively have a metal base material layer 1051 , an insulating layer 1053 and a circuit layer 1055 , and define a thermoelectric separation region 100 . As shown in the figure, in the thermoelectric separation area 100 of the first substrate 105 and the second substrate, the insulating layer 1053 and the circuit layer 1055 are hollowed out in the thermoelectric separation area 100 , and a conductor 107 is filled in the hollowed out area. Therefore, in more detail, the third light emitting diode unit 1015 and the fourth light emitting diode unit 1017 of the first light emitting group 101 are connected in parallel through the circuit layer 1055 of the first substrate 105, and the first light emitting diode unit 101 of the first light emitting group 101 is connected in parallel. A light-emitting diode unit 1011 and the second light-emitting diode unit 1013 of the first light-emitting group 101 are connected in series in the thermoelectric separation region 100 of the first substrate 105 . Similarly, the third light-emitting diode unit and the fourth light-emitting diode unit of the second light-emitting group are connected in parallel through the circuit layer of the second substrate, and the first light-emitting diode unit and the second light-emitting diode unit of the second light-emitting group are The second light emitting diode units of the group are connected in series in the thermoelectric separation region of the second substrate.

於本實施例中,填充之導體107可為錫膏或凸銅。由於導體107之散熱效果遠優於絕緣層1053,發光二極體所產生的熱可以直接從導體107往下傳導至金屬基材層1051,並由燈座均勻將熱散逸出。另一方面,因燈座並未電性連接線路,是故透過位於熱電分離區域100之導體107進行串聯的第一發光二極體單元1011與該第二發光二極體單元1013,流經兩者的電流會走最小電阻之途徑,不致造成電流短路。也就是說,本實施例之導體107除了提供直接將熱傳導至金屬基材層1051的熱傳導路徑,同時提供作為第一發光二極體單元1011與該第二發光二極體單元1013之間的電流傳導路徑。In this embodiment, the filled conductors 107 may be solder paste or bumped copper. Since the heat dissipation effect of the conductor 107 is much better than that of the insulating layer 1053, the heat generated by the light emitting diode can be directly conducted from the conductor 107 down to the metal base layer 1051, and the heat is evenly dissipated by the lamp holder. On the other hand, since the lamp holder is not electrically connected to the circuit, the first light-emitting diode unit 1011 and the second light-emitting diode unit 1013 connected in series through the conductor 107 in the thermoelectric separation area 100 flow through the two The current of the other will take the path of the least resistance, so as not to cause a short circuit of the current. That is to say, the conductor 107 in this embodiment not only provides a heat conduction path for directly conducting heat to the metal base material layer 1051 , but also provides a current between the first light emitting diode unit 1011 and the second light emitting diode unit 1013 . conduction path.

需說明的是,本發明可依據需求調整第一發光組及第二發光組所包含的發光二極體單元的數量、大小、設置於基板上的位置、操作功率和發光二極體單元彼此間串聯或並聯的方式,且第一發光組及第二發光組的配置方式也可以是彼此不相同,而熱電分離區域係因應該等發光二極體單元而配置,故於其他實施態樣中,亦可適當調整熱電分離區域之設置位置及數量。舉例而言,於本發明其中一實施例中,第一發光組及第二發光組可分別包含單一的發光二極體單元,基板總成具有一第一基板及一第二基板,第一基板及第二基板分別具有一金屬基材層、一絕緣層及一線路層,並定義有至少一熱電分離區域,第一基板與第二基板之所述熱電分離區域中,絕緣層與線路層在所述熱電分離區域為鏤空並填充一導體,發光二極體的正負電極之其中之一直接貼附於所述熱電分離區域中的導體。It should be noted that, the present invention can adjust the number, size, position on the substrate, operating power, and the distance between the light-emitting diode units included in the first light-emitting group and the second light-emitting group according to requirements. in series or in parallel, and the configuration of the first light-emitting group and the second light-emitting group can also be different from each other, and the thermoelectric separation area is configured due to the light-emitting diode units, so in other embodiments, The location and number of thermoelectric separation areas can also be adjusted appropriately. For example, in one embodiment of the present invention, the first light-emitting group and the second light-emitting group can respectively include a single light-emitting diode unit, the substrate assembly has a first substrate and a second substrate, the first substrate and the second substrate respectively have a metal base material layer, an insulating layer and a circuit layer, and define at least one thermoelectric separation area, in the thermoelectric separation area of the first substrate and the second substrate, the insulating layer and the circuit layer are The thermoelectric separation area is hollowed out and filled with a conductor, and one of the positive and negative electrodes of the light-emitting diode is directly attached to the conductor in the thermoelectric separation area.

又或者是,於本發明另一實施例中,第一發光組與第二發光組各包含二個發光二極體單元分別為一第一發光二極體單元及一第二發光二極體單元,基板總成具有一第一基板及一第二基板,第一基板與第二基板分別具有一金屬基材層、一絕緣層及一線路層,並定義有至少一熱電分離區域,第一基板與第二基板之所述熱電分離區域中,絕緣層與線路層在所述熱電分離區域為鏤空並填充一導體,第一發光二極體單元與第二發光二極體單元藉由所述熱電分離區域中的導體進行串聯。Or, in another embodiment of the present invention, each of the first light-emitting group and the second light-emitting group includes two light-emitting diode units, which are a first light-emitting diode unit and a second light-emitting diode unit, respectively. , the substrate assembly has a first substrate and a second substrate, the first substrate and the second substrate respectively have a metal substrate layer, an insulating layer and a circuit layer, and define at least one thermoelectric separation area, the first substrate In the thermoelectric separation area from the second substrate, the insulating layer and the circuit layer are hollowed out and filled with a conductor in the thermoelectric separation area, and the first light emitting diode unit and the second light emitting diode unit are connected by the thermoelectric The conductors in the separated regions are connected in series.

由於發光二極體的發光面及光源模組尺寸會影響照明光線之光分佈,本發明藉由光源模組的尺寸規格設計及光學安排,使用近似二維平面發光的發光二極體光源做到原先全周光光源的發光結果,故能匹配傳統全周光鹵素燈之燈具光學設計,與既有的傳統光源共機構,提供模組化的發光二極體光源,讓消費者依需求在傳統光源和發光二極體光源之間依需求直接替換,車用照明裝置的生產廠商亦不須額外開發模具,降低整體燈具的總開發成本。Since the light-emitting surface of the light-emitting diode and the size of the light source module will affect the light distribution of the illumination light, the present invention uses the light-emitting diode light source that approximates two-dimensional plane light emission through the size specification design and optical arrangement of the light source module. The luminous results of the original full-circle light source can match the optical design of the traditional full-circle halogen lamp, and share the structure with the existing traditional light source to provide a modular light-emitting diode light source, allowing consumers to use the traditional light source according to their needs. The light source and the light-emitting diode light source can be directly replaced according to the needs, and the manufacturer of the automotive lighting device does not need to develop additional molds, which reduces the total development cost of the overall lamp.

此外,本發明透過發光二極體之電路安排,亦能輕易調控光形各區域之光強度,藉此提供清楚的光源解析度和清晰的截止線,並透過陶瓷基板或填充導體提高光源模組之整體散熱效率。In addition, through the circuit arrangement of the light-emitting diodes, the present invention can also easily control the light intensity of each area of the light shape, thereby providing a clear light source resolution and a clear cut-off line, and improving the light source module through the ceramic substrate or the filling conductor. the overall cooling efficiency.

上述之實施例僅用來例舉本發明之實施態樣,以及闡釋本發明之技術特徵,並非用來限制本發明之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本發明所主張之範圍,本發明之權利保護範圍應以申請專利範圍為準。The above-mentioned embodiments are only used to illustrate the embodiments of the present invention and to illustrate the technical characteristics of the present invention, and are not used to limit the protection scope of the present invention. Any changes or equality arrangements that can be easily accomplished by those skilled in the art fall within the claimed scope of the present invention, and the scope of protection of the present invention should be subject to the scope of the patent application.

1:車燈結構 11:燈罩 13:光源 131:鹵素燈絲 3:照明裝置 31:燈座 311:散熱體 33:殼體 331:光源開口 333:透鏡開口 335:上半部反射面 337:下半部反射面 35:透鏡 4:光源模組 41:基板總成 411:第一基板 413:第二基板 415:第一面 417:第二面 43:第一發光組 431:第一發光面 45:第二發光組 451:第二發光面 6:照明裝置 61:固定座 7:光源模組 70:導電線路 71:基板總成 73:第一發光組 75:第二發光組 731:第一發光二極體單元 733:第二發光二極體單元 735:第三發光二極體單元 751:第一發光二極體單元 753:第二發光二極體單元 755:第三發光二極體單元 77:第一載板 79:第二載板 10:光源模組 101:第一發光組 1011:第一發光二極體單元 1013:第二發光二極體單元 1015:第三發光二極體單元 1017:第四發光二極體單元 103:金屬基板線路 105:第一基板 1051:金屬基材層 1053:絕緣層 1055:線路層 107:導體 A:照明區域 D H:燈絲直徑 L H:燈絲長度 L 1:第一長邊長度 L 2:第二長邊長度 S:容置空間 T:光源模組厚度 1: Lamp structure 11: Lampshade 13: Light source 131: Halogen filament 3: Lighting device 31: Lamp holder 311: Heat sink 33: Housing 331: Light source opening 333: Lens opening 335: Upper half reflecting surface 337: Lower half Partial reflection surface 35: Lens 4: Light source module 41: Substrate assembly 411: First substrate 413: Second substrate 415: First surface 417: Second surface 43: First light-emitting group 431: First light-emitting surface 45: Second lighting group 451: Second lighting surface 6: Lighting device 61: Mounting base 7: Light source module 70: Conductive circuit 71: Substrate assembly 73: First lighting group 75: Second lighting group 731: First lighting 2 Pole unit 733: Second LED unit 735: Third LED unit 751: First LED unit 753: Second LED unit 755: Third LED unit 77: First carrier board 79: Second carrier board 10: Light source module 101: First light-emitting group 1011: First light-emitting diode unit 1013: Second light-emitting diode unit 1015: Third light-emitting diode unit 1017: Fourth light emitting diode unit 103: metal substrate circuit 105: first substrate 1051: metal substrate layer 1053: insulating layer 1055: circuit layer 107: conductor A: lighting area DH: filament diameter L H : filament length L 1 : Length of the first long side L 2 : Length of the second long side S: accommodating space T: thickness of the light source module

圖1為習知照明裝置之側視圖; 圖2為習知照明裝置之光源之側視圖; 圖3為包含本發明第一實施例之光源模組之照明裝置側視圖; 圖4為本發明第一實施例之光源模組之俯視立體爆炸圖; 圖5為本發明第一實施例之光源模組之仰視立體爆炸圖; 圖6為包含本發明第一實施例之光源模組之另一態樣照明裝置側視圖; 圖7為本發明第二實施例之光源模組之局部俯視圖; 圖8為本發明第二實施例之光源模組之第一發光組之電路簡圖; 圖9為本發明第二實施例之光源模組之局部剖面圖; 圖10為本發明第三實施例之光源模組之局部俯視圖; 圖11為本發明第三實施例之光源模組之第一發光組之電路簡圖;以及 圖12為本發明第三實施例之光源模組之局部剖面圖。 1 is a side view of a conventional lighting device; 2 is a side view of a light source of a conventional lighting device; 3 is a side view of a lighting device including the light source module according to the first embodiment of the present invention; FIG. 4 is a top perspective exploded view of the light source module according to the first embodiment of the present invention; FIG. 5 is a bottom three-dimensional exploded view of the light source module according to the first embodiment of the present invention; 6 is a side view of another aspect of the lighting device including the light source module according to the first embodiment of the present invention; 7 is a partial top view of a light source module according to a second embodiment of the present invention; 8 is a schematic circuit diagram of the first light-emitting group of the light source module according to the second embodiment of the present invention; 9 is a partial cross-sectional view of a light source module according to a second embodiment of the present invention; 10 is a partial top view of a light source module according to a third embodiment of the present invention; 11 is a schematic circuit diagram of the first light-emitting group of the light source module according to the third embodiment of the present invention; and 12 is a partial cross-sectional view of a light source module according to a third embodiment of the present invention.

31:燈座 31: lamp holder

4:光源模組 4: Light source module

41:基板總成 41: Substrate assembly

411:第一基板 411: First substrate

413:第二基板 413: Second substrate

415:第一面 415: first side

43:第一發光組 43: The first light-emitting group

431:第一發光面 431: The first light-emitting surface

L1:第一長邊長度 L 1 : Length of the first long side

Claims (12)

一種用於一照明裝置之光源模組,該照明裝置包含一反射面,該反射面可用於匹配一鹵素燈絲,其定義一燈絲長度及一燈絲直徑,該光源模組包含: 一基板總成,具有一第一面與一第二面; 一第一發光組,設置於該基板總成之該第一面,該第一發光組具有一第一發光面,該第一發光面具有一第一長邊長度,該第一長邊長度與該燈絲長度正相關;以及 一第二發光組,設置於該基板總成之該第二面,該第二發光組具有一第二發光面,該第二發光面具有一第二長邊長度,該第二長邊長度與該燈絲長度正相關; 其中,該第一發光面與該第二發光面共同界定一光源模組厚度,該光源模組厚度與該燈絲直徑正相關。 A light source module for an illuminating device, the illuminating device includes a reflective surface, the reflective surface can be used to match a halogen filament, which defines a filament length and a filament diameter, the light source module includes: a base plate assembly having a first surface and a second surface; A first light-emitting group is disposed on the first surface of the substrate assembly, the first light-emitting group has a first light-emitting surface, the first light-emitting surface has a first long side length, and the first long side length is the same as the filament length is positively related; and A second light-emitting group is disposed on the second surface of the substrate assembly, the second light-emitting group has a second light-emitting surface, the second light-emitting surface has a second long side length, and the second long side length is the same as The filament length is positively correlated; Wherein, the first light-emitting surface and the second light-emitting surface jointly define a thickness of a light source module, and the thickness of the light source module is positively correlated with the diameter of the filament. 如請求項1所述的光源模組,其中該鹵素燈絲具有一鹵素燈光學中心,該光源模組之一光學中心與該鹵素燈光學中心相同。The light source module of claim 1, wherein the halogen filament has a halogen light optical center, and an optical center of the light source module is the same as the halogen light optical center. 如請求項1所述的光源模組,其中該光源模組厚度小於4公釐。The light source module according to claim 1, wherein the thickness of the light source module is less than 4 mm. 如請求項1所述的光源模組,其中該第一長邊長度與該第二長邊長度均小於4公釐。The light source module of claim 1, wherein the length of the first long side and the length of the second long side are both less than 4 mm. 如請求項1所述的光源模組,其中該照明裝置更包含一燈座,該基板總成具有一第一基板與一第二基板,該第一基板與該第二基板夾設於該燈座之兩側,該第一面係位於該第一基板之一第一外側表面,該第二面係位於該第二基板之一第二外側表面。The light source module of claim 1, wherein the lighting device further comprises a lamp socket, the substrate assembly has a first substrate and a second substrate, and the first substrate and the second substrate are sandwiched between the lamp On both sides of the seat, the first surface is located on a first outer surface of the first substrate, and the second surface is located on a second outer surface of the second substrate. 如請求項1所述的光源模組,其中該第一發光組與該第二發光組各包含一第一發光二極體單元、一第二發光二極體單元和一第三發光二極體單元,該第一發光二極體單元串聯至相互並聯的該第二發光二極體單元及該第三發光二極體單元。The light source module of claim 1, wherein the first light-emitting group and the second light-emitting group each comprise a first light-emitting diode unit, a second light-emitting diode unit, and a third light-emitting diode unit a unit, the first light emitting diode unit is connected in series to the second light emitting diode unit and the third light emitting diode unit which are connected in parallel. 如請求項6所述的光源模組,其中該光源模組更包含一第一載板與一第二載板,該第一發光組之該等發光二極體單元設置於該第一載板後,透過該第一載板設置於該基板總成之該第一面,該第二發光組之該等發光二極體單元設置於該第二載板後,透過該第二載板設置於該基板之該第二面。The light source module of claim 6, wherein the light source module further comprises a first carrier board and a second carrier board, and the light-emitting diode units of the first light-emitting group are disposed on the first carrier board After that, the light-emitting diode units of the second light-emitting group are arranged on the first surface of the substrate assembly through the first carrier board, and then arranged on the second carrier board through the second carrier board. the second side of the substrate. 如請求項6所述的光源模組,其中該第一發光組與該第二發光組更各包含一第四發光二極體單元,該基板總成具有一第一基板與一第二基板,該第一基板與該第二基板分別具有一金屬基材層、一絕緣層及一線路層,並定義有至少一熱電分離區域,該第一基板與該第二基板之所述熱電分離區域中,該絕緣層與該線路層在所述熱電分離區域為鏤空並填充一導體,該第一發光二極體單元與該第二發光二極體單元藉由所述熱電分離區域中的該導體進行串聯,再與透過該線路層並聯之該第三發光二極體單元與該第四發光二極體單元進行串聯。The light source module of claim 6, wherein each of the first light-emitting group and the second light-emitting group further comprises a fourth light-emitting diode unit, and the substrate assembly has a first substrate and a second substrate, The first substrate and the second substrate respectively have a metal base material layer, an insulating layer and a circuit layer, and define at least one thermoelectric separation area, in the thermoelectric separation area of the first substrate and the second substrate , the insulating layer and the circuit layer are hollowed out and filled with a conductor in the thermoelectric separation area, and the first light emitting diode unit and the second light emitting diode unit are connected by the conductor in the thermoelectric separation area connected in series, and then connected in series with the third light emitting diode unit and the fourth light emitting diode unit connected in parallel through the circuit layer. 如請求項1項所述的光源模組,其中該第一發光組與該第二發光組各包含一發光二極體單元,該基板總成具有一第一基板與一第二基板,該第一基板與該第二基板分別具有一金屬基材層、一絕緣層及一線路層,並定義有至少一熱電分離區域,該第一基板與該第二基板之所述熱電分離區域中,該絕緣層與該線路層在所述熱電分離區域為鏤空並填充一導體,該發光二極體單元之正負電極之其中之一直接貼附於所述熱電分離區域中的該導體。The light source module of claim 1, wherein each of the first light-emitting group and the second light-emitting group includes a light-emitting diode unit, the substrate assembly has a first substrate and a second substrate, the first substrate A substrate and the second substrate respectively have a metal base material layer, an insulating layer and a circuit layer, and define at least one thermoelectric separation area. In the thermoelectric separation area of the first substrate and the second substrate, the The insulating layer and the circuit layer are hollowed out and filled with a conductor in the thermoelectric separation area, and one of the positive and negative electrodes of the light emitting diode unit is directly attached to the conductor in the thermoelectric separation area. 如請求項1項所述的光源模組,其中該第一發光組與該第二發光組各包含一第一發光二極體單元及一第二發光二極體單元,該基板總成具有一第一基板及一第二基板,該第一基板與該第二基板分別具有一金屬基材層、一絕緣層及一線路層,並定義有至少一熱電分離區域,該第一基板與該第二基板之所述熱電分離區域中,該絕緣層與該線路層在所述熱電分離區域為鏤空並填充一導體,該第一發光二極體單元與該第二發光二極體單元藉由所述熱電分離區域中的該導體進行串聯。The light source module of claim 1, wherein the first light-emitting group and the second light-emitting group each comprise a first light-emitting diode unit and a second light-emitting diode unit, and the substrate assembly has a A first substrate and a second substrate, the first substrate and the second substrate respectively have a metal base material layer, an insulating layer and a circuit layer, and define at least one thermoelectric separation area, the first substrate and the first substrate In the thermoelectric separation area of the two substrates, the insulating layer and the circuit layer are hollowed out and filled with a conductor in the thermoelectric separation area, and the first light emitting diode unit and the second light emitting diode unit are connected by the The conductors in the thermoelectric separation region are connected in series. 如請求項5所述的光源模組,其中該照明裝置更包含一固定座,該燈座包含一散熱體,該散熱體設置於該燈座遠離設置該光源模組之一端,該散熱體與該固定座相組配,使該光源模組固定於該照明裝置之該固定座上。The light source module according to claim 5, wherein the lighting device further comprises a fixing base, the lamp base comprises a heat sink, the heat sink is disposed at an end of the lamp base away from the light source module, and the heat sink is connected to an end of the lamp base away from the light source module. The fixing bases are matched with each other, so that the light source module is fixed on the fixing base of the lighting device. 如請求項11所述的光源模組,其中該照明裝置更包含一殼體,該殼體內具有該反射面,該殼體之一光源開口與該固定座連接,該殼體之一透鏡開口遠離該固定座向外延伸以形成一容置空間,該固定座為環形而形成一中空區域,該燈座穿過該中空區域定位於該容置空間內。The light source module of claim 11, wherein the lighting device further comprises a casing, the casing has the reflection surface, a light source opening of the casing is connected to the fixing seat, and a lens opening of the casing is far away from The fixing seat extends outward to form an accommodating space, the fixing seat is annular and forms a hollow area, and the lamp holder is positioned in the accommodating space through the hollow area.
TW110100587A 2021-01-07 2021-01-07 Light source module for illumination device TW202227750A (en)

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