TW202220776A - Apparatus and method for generating a defined laser line on a working plane - Google Patents

Apparatus and method for generating a defined laser line on a working plane Download PDF

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TW202220776A
TW202220776A TW110136546A TW110136546A TW202220776A TW 202220776 A TW202220776 A TW 202220776A TW 110136546 A TW110136546 A TW 110136546A TW 110136546 A TW110136546 A TW 110136546A TW 202220776 A TW202220776 A TW 202220776A
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axis
laser
optical
working plane
platform
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TW110136546A
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Chinese (zh)
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安德烈斯 海梅斯
朱利安 赫爾斯特恩
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德商創浦雷射與系統科技有限公司
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02678Beam shaping, e.g. using a mask

Abstract

An apparatus for generating a defined laser line (12) on a working plane (14) includes a laser light source (22) configured to generate a laser raw beam (24). It further includes an optical arrangement (26) that receives the laser raw beam (24) and transforms it along an optical axis (40) into an illumination beam (28). The illumination beam (28) defines a beam direction (29) that intersects the working plane (14) and has, in the region of the working plane (14), a beam profile (50) that has, perpendicular to the beam direction (29), a long axis (52) with a long axis beam width and a short axis (54) with a short axis beam width. The optical arrangement (26) is movable relative to the working plane (14) along a direction of movement (20) in order to process a workpiece (16) by means of the illumination beam (28). The beam profile (50) has a defined intensity characteristic (62) along the short-axis beam width, which intensity characteristic (62) has a leading edge (56) in the direction of movement (20), a trailing edge (58) in the direction of movement (20) and a plateau (60) lying between the leading edge (56) and the trailing edge (58). The plateau (60) has a higher intensity level in the region of the leading edge (56) than in the region of the trailing edge (58). The optical arrangement (26) is adjusted in such a way that the plateau (60) has a continuously decreasing mean (64) intensity level.

Description

用於在工作平面上產生限定雷射光線的設備和方法Apparatus and method for generating defined laser rays on a work plane

本發明涉及一種用於在工作平面上產生限定雷射光線的設備,包括設置成產生雷射原始光束的雷射光源,並且包括接收雷射原始光束並將其轉換成沿光軸的照明光束之光學配置,其中該照明光束限定與工作平面相交的光束方向,其中該照明光束在工作平面的區域中具有光束輪廓,該光束輪廓垂直於光束方向具有具備長軸光束寬度的長軸和具備短軸光束寬度的短軸,其中該光學配置可沿移動方向相對於工作平面移動,以便通過該照明光束處理工件,並且其中該光束輪廓具有沿短軸光束寬度定義的強度特性,該強度特性在移動方向上具有前緣,在移動方向上的後緣和位於前緣與後緣之間的平台,其中該平台在該前緣區域中具有比在該後緣區域中更高的強度位準。The present invention relates to an apparatus for generating a defined laser beam on a working plane, comprising a laser light source arranged to generate a laser raw beam, and comprising a method of receiving the laser raw beam and converting it into an illumination beam along the optical axis Optical configuration, wherein the illumination beam defines a beam direction intersecting the work plane, wherein the illumination beam has a beam profile in a region of the work plane, the beam profile perpendicular to the beam direction having a major axis having a major axis beam width and having a minor axis the short axis of the beam width, wherein the optical configuration is movable relative to the work plane in the direction of movement in order to process a workpiece with the illumination beam, and wherein the beam profile has an intensity characteristic defined along the short axis of the beam width, the intensity characteristic in the direction of movement has a leading edge, a trailing edge in the direction of movement, and a platform located between the leading edge and the trailing edge, wherein the platform has a higher strength level in the leading edge region than in the trailing edge region.

本發明另關於一種用於在工作平面上產生限定雷射光線的方法,包括以下步驟: –   提供產生雷射原始光束的雷射光源, –   提供一光學配置,其接收該雷射原始光束並將其沿一光軸轉換成限定與工作平面相交的光束方向之照明光束,該光學配置具有多個光學元件並且可沿移動方向相對於該工作平面移動,以便通過該照明光束處理工件,以及 –   將雷射光源投入運作, 其中該照射光束在工作平面的區域中獲得光束輪廓,該光束輪廓垂直於光束方向具有具備長軸光束寬度的長軸和具備短軸光束寬度的短軸,其中該光束輪廓沿該短軸光束寬度具有限定的強度特性,該強度特性獲得移動方向上的前緣、移動方向上的後緣以及位於該前緣與該後緣之間的平台,並且其中該平台在該前緣區域中具有比在該後緣區域中更高的強度位準。 The present invention further relates to a method for generating a defined laser beam on a work plane, comprising the steps of: – Provides a laser light source that produces the original laser beam, – Provide an optical configuration that receives the laser raw beam and converts it along an optical axis into an illumination beam defining a beam direction intersecting the work plane, the optical configuration having a plurality of optical elements and being movable relative to the laser beam in the direction of movement the work plane is moved so that the workpiece is processed by this illumination beam, and – put the laser light source into operation, wherein the illumination beam obtains a beam profile in the region of the working plane, the beam profile perpendicular to the beam direction having a long axis with a long axis beam width and a short axis with a short axis beam width, wherein the beam profile is along the short axis beam width has a defined strength characteristic that obtains a leading edge in the direction of travel, a trailing edge in the direction of travel, and a platform located between the leading edge and the trailing edge, and wherein the platform has a ratio in the leading edge region Higher intensity levels in the trailing edge region.

這種設備和相應方法從US 2014/0027417 A1已知。Such a device and a corresponding method are known from US 2014/0027417 A1.

已知設備在工作平面上產生線形雷射照明,來處理工件。尤其是,工件可為載板上的非晶矽。非晶矽通過雷射光線逐行熔化,並通過冷卻轉化為多晶矽。這種應用在實踐中通常稱為固態雷射退火(SLA)或準分子雷射退火(ELA)。Known devices produce linear laser illumination on a work plane for processing workpieces. In particular, the workpiece may be amorphous silicon on a carrier. Amorphous silicon is melted row by row by laser light and converted to polysilicon by cooling. This application is commonly referred to in practice as solid state laser annealing (SLA) or excimer laser annealing (ELA).

這種應用要求工作平面上的雷射光線在一個方向上盡可能長,以便覆蓋盡可能寬的工作區域,而在另一方向上則非常短,以提供相應處理所需的能量密度。因此,需要平行於工作平面的細長雷射光線。通常,雷射光線行進的方向稱為長軸,線厚度稱為所謂光束輪廓的短軸。通常,雷射光線應具有沿兩個軸定義的強度特性。尤其是,希望長軸上的類射線具有盡可能矩形或可能是梯形的強度特性,如果將幾條這樣的雷射光線連接在一起以形成更長的整體線,則後者是有利的。在短軸上,SLA應用通常需要理想的矩形強度特性(所謂的禮帽輪廓),其在移動方向上具有前緣,在移動方向上具有後緣以及位於該前緣與該後緣之間的平坦平台。This application requires the laser beam on the work plane to be as long as possible in one direction to cover the widest possible work area, and very short in the other direction to provide the energy density required for the corresponding treatment. Therefore, elongated laser rays parallel to the working plane are required. Generally, the direction in which the laser light travels is called the long axis, and the thickness of the line is called the short axis of the so-called beam profile. In general, laser rays should have intensity properties defined along two axes. In particular, it is desirable for the ray-like rays on the long axis to have as rectangular as possible or possibly trapezoidal intensity characteristics, the latter being advantageous if several such laser rays are connected together to form a longer overall line. On the short axis, SLA applications typically require ideal rectangular strength characteristics (the so-called top hat profile) with a leading edge in the direction of travel, a trailing edge in the direction of travel, and a flat between the leading and trailing edges platform.

然而,US 2014/0027417 A1揭示一種改進的、在某種意義上的兩階段禮帽輪廓,其對於SLA或ELA處理是有利的,因為當雷射光線相對於工件移動時,多晶矽的形成分幾個連續的步驟進行,並且隨著移動的進行,熔化材料的最佳能量密度會降低。雷射光線在相對於工件移動時以脈衝形式產生,工件的每個部分在移動時被大約20個雷射脈衝照亮。在此揭示雷射脈衝多次熔化矽並改變其特性。為此,US 2014/0027417 A1提出使用在工作平面區域中重疊的兩個雷射原始光束來產生雷射光線的光束輪廓。該光學配置包括用於兩個雷射原始光束中每一者的單獨光束路徑。兩個光束路徑中每一者都沿短軸產生大致為禮帽形的光束輪廓。兩個禮帽光束輪廓在工作平面上的短軸方向上相互偏移,從而形成具有限定台階的整體光束輪廓,將兩個大部分平坦的平台區段分開。However, US 2014/0027417 A1 discloses an improved, in a sense two-stage top hat profile, which is advantageous for SLA or ELA processing, since the polysilicon is formed in several parts as the laser beam moves relative to the workpiece Successive steps are performed, and as the movement progresses, the optimal energy density of the molten material decreases. The laser light is generated in pulses as it moves relative to the workpiece, and each part of the workpiece is illuminated by approximately 20 laser pulses as it moves. Here it is revealed that laser pulses melt silicon multiple times and change its properties. To this end, US 2014/0027417 A1 proposes to use two laser original beams that overlap in the area of the working plane to generate a beam profile of the laser rays. The optical configuration includes separate beam paths for each of the two laser raw beams. Each of the two beam paths produces a roughly top hat-shaped beam profile along the minor axis. The two top hat beam profiles are offset from each other in the direction of the minor axis on the work plane, resulting in an overall beam profile with a defined step separating the two mostly flat platform segments.

該解決方案的一個缺點為提供兩個雷射原始光束和兩個平行光束路徑的費用。有鑑於此,本發明的一個目的為提供一種上述類型的設備和方法,其允許以替代方式在工件的SLA處理期間提供盡可能最佳的能量密度。One disadvantage of this solution is the expense of providing two laser original beams and two parallel beam paths. In view of this, it is an object of the present invention to provide an apparatus and method of the type described above, which allows, in an alternative manner, to provide the best possible energy density during the SLA processing of workpieces.

根據本發明的一個態樣,在此提供一種上述類型的設備,其中調整該光學配置,使得該平台具有連續降低的平均強度位準。更進一步,提供一種上述類型的方法,其中以這種方式調整光學元件,使得平台獲得連續降低的平均強度位準。According to one aspect of the present invention, there is provided an apparatus of the type described above, wherein the optical configuration is adjusted such that the stage has a continuously decreasing average intensity level. Still further, a method of the type described above is provided wherein the optical elements are adjusted in such a way that the stage achieves a continuously decreasing average intensity level.

如在上述設備和方法中,照明光束較佳以脈衝形式產生,特別是通過以脈衝形式發射雷射原始光束的雷射光源。與此無關,此處沿短軸的光束輪廓之強度特性以與移動方向相反的大部分線性方式,從前緣區域中較高的第一級下降到後緣區域中較低的第二級。因此,新設備和相應方法的強度特性類似於單斜屋頂。在建築物中,單斜屋頂是一種屋頂形狀,只有一個傾斜的屋頂表面。因此,光束輪廓沿短軸具有單斜屋頂形狀的強度特性。較佳是,該平台沒有階梯。精通技術領域人士清楚,該設備和方法的強度特性在現實中並不理想地平坦,而是在與移動方向相反傾斜的高原中可能存在小的波浪和波紋。由於衍射效應和製造公差,小波浪和波紋是不可避免的。然而,與高原的高度相比,波浪和波紋很小,在理想化圖式中可忽略。在一些具體實施例中,相對於平台的強度位準,波浪和波紋可小於10%,較佳小於5%。因此,如果從與移動方向相反的方向看,新設備和方法的平台平均連續下降,特別是在考慮穿過波浪和波紋的回歸線時。As in the apparatus and method described above, the illumination beam is preferably generated in pulses, in particular by a laser light source that emits the laser raw beam in pulses. Irrespective of this, the intensity characteristic of the beam profile along the short axis here falls in a mostly linear fashion opposite to the direction of movement, from a higher first order in the leading edge region to a lower second order in the trailing edge region. Therefore, the strength properties of the new device and the corresponding method are similar to those of a mono-pitched roof. In buildings, a monopitch roof is a roof shape with only one sloping roof surface. Therefore, the beam profile has mono-pitched roof-shaped intensity characteristics along the short axis. Preferably, the platform has no steps. It is clear to those skilled in the art that the strength characteristics of the apparatus and method are not ideally flat in reality, but rather that there may be small waves and ripples in plateaus inclined opposite to the direction of movement. Small waves and ripples are unavoidable due to diffraction effects and manufacturing tolerances. However, compared to the height of the plateau, the waves and ripples are small and negligible in the idealized schema. In some embodiments, the waves and ripples may be less than 10%, preferably less than 5%, relative to the strength level of the platform. Therefore, if viewed from the opposite direction of the movement, the platform of the new device and method has an average continuous decline, especially when considering the regression line that crosses waves and ripples.

由於強度位準的持續降低,新的設備和方法能夠實現更均勻的工件加工。更進一步,其通常允許僅使用一個雷射光束實現更簡單且更便宜的實施。結果,通過以所示方式重新調整用於短軸輪廓的光束路徑中之光學元件,新設備和方法可以與舊的、已經存在的設備一起實施。以後安裝額外光學元件是可以想像的,但通常沒有必要。事實證明,在許多情況下,單斜強度特性已經可以通過光學元件的改進微調來實現。上述目的因此以簡單且具備成本效益的方式實現。New equipment and methods enable more uniform workpiece machining due to the continued reduction in strength levels. Still further, it generally allows simpler and cheaper implementation using only one laser beam. As a result, new devices and methods can be implemented with older, already existing devices by readjusting the optics in the beam path for short-axis profiles in the manner shown. It is conceivable to install additional optics later, but is usually not necessary. It turns out that, in many cases, monoclinic intensity properties can already be achieved with improved fine-tuning of the optics. The above-mentioned objects are thus achieved in a simple and cost-effective manner.

在本發明的較佳改進中,該光學配置設置成利用單個雷射管束產生平台。因此,在較佳具體實施例中,平台係用單個雷射原始光束所產生。In a preferred refinement of the invention, the optical arrangement is arranged to generate the platform with a single laser tube bundle. Therefore, in the preferred embodiment, the platform is produced with a single laser raw beam.

在此改進中,新設備和方法受益於上面已指出的有利可能性。工件的同質SLA處理以特別經濟的方式成為可能。In this refinement, the new device and method benefit from the advantageous possibilities already pointed out above. Homogeneous SLA processing of workpieces is possible in a particularly economical way.

在進一步改進中,該光學配置包括形成相對於光束輪廓短軸的光束路徑之多個光學元件,其中該等多個光學元件中之一光學元件是位於光束路徑末端的物鏡,並且其中該光束路徑照亮偏離中心的物鏡。In a further refinement, the optical configuration includes a plurality of optical elements forming a beam path relative to the minor axis of the beam profile, wherein one of the plurality of optical elements is an objective lens located at the end of the beam path, and wherein the beam path Illuminate off-center objectives.

在較佳示範具體實施例中,物鏡將照明光束聚焦到工作平面上。較佳是,物鏡對於光束輪廓的短軸具有主要屈光力,而對於光束輪廓的長軸則不起作用。短軸光束路徑相對於短軸光束路徑的光軸,將雷射光束不對稱地放置在物鏡上。非對稱或偏離中心的照明會導致物鏡的球面像差影響在光軸一側比在另一側更多地重塑雷射光束。這有利地導致短軸光束輪廓的強度特性中之傾斜平台。事實證明,短軸光束路徑中光學元件的特定調整可有利地有助於偏離中心照亮物鏡,以便以簡單且具有成本效益的方式,在短軸光束輪廓的強度特性中實現類似單斜平台。In a preferred exemplary embodiment, the objective lens focuses the illumination beam onto the working plane. Preferably, the objective has dominant power with respect to the short axis of the beam profile and has no effect on the long axis of the beam profile. The short-axis beam path places the laser beam asymmetrically on the objective with respect to the optical axis of the short-axis beam path. Asymmetric or off-center illumination can cause the spherical aberration effect of the objective to reshape the laser beam more on one side of the optical axis than on the other. This advantageously results in a tilted plateau in the intensity characteristic of the short-axis beam profile. It turns out that specific adjustments of optics in the short-axis beam path can advantageously facilitate off-center illumination of the objective to achieve a monoclinic stage-like stage in the intensity characteristics of the short-axis beam profile in a simple and cost-effective manner.

在進一步的改進中,多個光學元件包括在光束路徑中的伸縮透鏡,該伸縮透鏡相對於光軸偏離中心。In a further refinement, the plurality of optical elements includes a telescoping lens in the beam path, the telescoping lens being off-center with respect to the optical axis.

這種改進是建立單斜平台的一種非常經濟有效之方式,因為無論如何在光學配置的(短軸)光束路徑中通常都需要伸縮配置。有利地,伸縮透鏡對於光束輪廓的短軸具有主要屈光力,而對於光束輪廓的長軸則不起作用。偏離中心調整的伸縮透鏡可方便且廉價地幫助將雷射光束偏離中心放置在上述物鏡上,以形成傾斜平台。This improvement is a very cost-effective way of building a monoclinic stage, since a telescoping configuration is usually required in the (short-axis) beam path of the optical configuration anyway. Advantageously, the telescoping lens has the dominant power for the short axis of the beam profile and has no effect on the long axis of the beam profile. An off-center-adjusted telescoping lens can conveniently and inexpensively assist in placing the laser beam off-center on the aforementioned objective to form a tilted stage.

在進一步的改進中,多個光學元件包括在光束路徑中的伸縮透鏡,該伸縮透鏡相對於光軸傾斜。In a further refinement, the plurality of optical elements includes a telescoping lens in the beam path, the telescoping lens being inclined with respect to the optical axis.

這種改進也是建立單斜平台的一種非常經濟有效之方式,因為無論如何在光學配置的(短軸)光束路徑中通常都需要伸縮配置。有利地,伸縮透鏡對於光束輪廓的短軸具有主要屈光力,而對於光束輪廓的長軸則不起作用。在較佳示範具體實施例中,可通過在調整光學佈置時繞長軸旋轉伸縮透鏡,來實現傾斜的伸縮透鏡。同樣,這提供一種將雷射光束偏離中心放置在上述物鏡上的簡單且廉價之方法。在一些較佳示範具體實施例中,伸縮透鏡可相對於短軸光束路徑的光軸偏離中心定位,此外,還可相對於短軸光束路徑的光軸傾斜或繞長軸旋轉。在這些示範具體實施例中,可以簡單且具備成本效益的方式最佳化平台的傾斜度。This improvement is also a very cost-effective way to build a monoclinic stage, since a telescoping configuration is usually required in the (short-axis) beam path of the optical configuration anyway. Advantageously, the telescoping lens has the dominant power for the short axis of the beam profile and has no effect on the long axis of the beam profile. In a preferred exemplary embodiment, a tilted telescoping lens can be achieved by rotating the telescoping lens about its long axis when adjusting the optical arrangement. Again, this provides a simple and inexpensive way to place the laser beam off-centre on the aforementioned objective. In some preferred exemplary embodiments, the telescoping lens can be positioned off-center relative to the optical axis of the short-axis beam path, and can also be tilted or rotated about the long-axis relative to the optical axis of the short-axis beam path. In these exemplary embodiments, the tilt of the platform can be optimized in a simple and cost-effective manner.

在進一步的改進中,多個光學元件包括折疊光束路徑的多個反射鏡,其中多個反射鏡中的至少一個反射鏡設置成偏離中心照明物鏡。In a further refinement, the plurality of optical elements includes a plurality of mirrors that fold the beam path, wherein at least one mirror of the plurality of mirrors is arranged to illuminate the objective off-center.

光束路徑的折疊,特別是相對於短軸的折疊,使得新設備有緊湊的設計。通過對該配置的一或多個反射鏡之新調整,可以非常簡單且具備成本效益之方式實現平台的傾斜。更進一步,運用這種改進,可通過主要針對高光束品質調整該光學配置的透鏡,來實現高光束品質,而平台的傾斜通過一或多個折疊反射鏡來實現。另外或此外,平台的傾斜可通過如上所述調整透鏡和通過調整一或多個反射鏡來實現,這允許靈活最佳化新設備。The folding of the beam path, especially with respect to the short axis, allows for a compact design of the new device. Tilting of the platform can be achieved in a very simple and cost-effective manner by new adjustments to one or more mirrors of this configuration. Still further, with this improvement, high beam quality can be achieved by tuning the lenses of this optical configuration primarily for high beam quality, while the tilting of the platform is achieved by one or more folding mirrors. Alternatively or additionally, the tilting of the platform can be achieved by adjusting the lens as described above and by adjusting one or more mirrors, which allows flexibility to optimize new equipment.

不言而喻,上述特徵和下面將要解釋的特徵不僅可在每種情況下以組合方式使用,而且可以其他組合方式或單獨使用,而不脫離本發明的範疇。It goes without saying that the features mentioned above and those yet to be explained below can be used not only in combination in each case, but also in other combinations or alone without departing from the scope of the present invention.

在圖1中,新設備的示範具體實施例整體由參考編號10表示。設備10在工作平面14的區域中產生雷射光線12,以便處理工件16,該工件在此放置在工作平面14的區域中。在此,雷射光線12沿x軸方向(圖2)延伸,並且在此沿y軸方向觀察線寬。因此,下文中的x軸表示形成於工作平面14(圖2)上的光束輪廓之長軸,y軸表示短軸。In FIG. 1 , an exemplary embodiment of the new device is generally designated by reference numeral 10 . The device 10 generates the laser beam 12 in the region of the working plane 14 in order to process the workpiece 16 , which is here placed in the region of the working plane 14 . Here, the laser beam 12 extends in the direction of the x-axis ( FIG. 2 ), and the line width is observed here in the direction of the y-axis. Therefore, the x-axis hereinafter represents the long axis of the beam profile formed on the working plane 14 (FIG. 2), and the y-axis represents the short axis.

在較佳示範具體實施例中,工件16可包括非晶矽層,其熔化並使用雷射光線12轉化為多晶矽。圖1以形成雷射光線短軸的短軸光束路徑18之簡化和示意圖顯示設備10。因此,在圖1的「側視圖」中(沿x軸),雷射光線僅能看做是一點。為了處理工件16,雷射光線12可沿箭頭20的方向相對於工件16移動。In a preferred exemplary embodiment, workpiece 16 may include a layer of amorphous silicon that is melted and converted to polysilicon using laser light 12 . FIG. 1 shows apparatus 10 in a simplified and schematic diagram of a short-axis beam path 18 that forms the short-axis of a laser ray. Therefore, in the "side view" of Figure 1 (along the x-axis), the laser ray can only be seen as a point. To process workpiece 16 , laser beam 12 may be moved relative to workpiece 16 in the direction of arrow 20 .

裝置10具有雷射光源22,其可為例如產生紅外線範圍或紫外線範圍內的雷射光線之固態雷射。例如,雷射光源22可包括具有1030 nm範圍內波長的Nd:YAG雷射。在進一步範例中,雷射光源22可包括二極體雷射、準分子雷射或固態雷射,其中的每一者都可產生波長在150 nm和360 nm、500 nm和530 nm或900 nm到1070 nm之間的雷射。The device 10 has a laser light source 22, which may be, for example, a solid state laser that generates laser light in the infrared range or the ultraviolet range. For example, laser light source 22 may comprise an Nd:YAG laser having a wavelength in the 1030 nm range. In further examples, the laser light source 22 may comprise a diode laser, an excimer laser, or a solid state laser, each of which can produce wavelengths between 150 nm and 360 nm, 500 nm and 530 nm, or 900 nm Lasers between 1070 nm.

例如,雷射光源22發射雷射原始光束24,該光束可經由光纖耦合到光學配置26。雷射原始光束24由光學配置26轉換成限定光束方向29的照明光束28。光束方向29與工作平面14相交。For example, laser light source 22 emits a laser raw beam 24, which may be coupled to optical arrangement 26 via an optical fiber. The laser raw beam 24 is converted by an optical arrangement 26 into an illumination beam 28 defining a beam direction 29 . The beam direction 29 intersects the working plane 14 .

光學配置26包括在x方向(對應於長軸)上擴展雷射原始光束24的光束變換器30。在一些示範具體實施例中,光束變換器30可實施為在WO 2018/019374 A1中詳細描述的光束變換器。因此,WO 2018/019374 A1通過關於光束變換器和光學配置的其他細節(例如特別是長軸光束成形)之參考併入本文中。The optical configuration 26 includes a beam transformer 30 that expands the laser original beam 24 in the x-direction (corresponding to the long axis). In some demonstrative embodiments, beam transformer 30 may be implemented as a beam transformer as described in detail in WO 2018/019374 A1. Accordingly, WO 2018/019374 A1 is incorporated herein by reference for additional details regarding beam converters and optical configurations, such as in particular long-axis beam shaping.

根據WO 2018/019374 A1,光束變換器30可包括透明的、單片的、板狀構件,其具有彼此基本平行的前側和後側。板狀元件可相對於雷射原始光束24成銳角設置。前側和後側可各自包括反射塗層,使得傾斜耦合到前側的板狀元件中之雷射原始光束24在板狀元件的後側散開之前,在板狀元件中經歷多次反射。According to WO 2018/019374 A1, the beam converter 30 may comprise a transparent, monolithic, plate-like member having front and rear sides substantially parallel to each other. The plate-like elements may be arranged at an acute angle with respect to the original laser beam 24 . The front and rear sides may each include a reflective coating such that the laser raw beam 24 coupled obliquely into the plate-like element on the front side undergoes multiple reflections in the plate-like element before it spreads out at the rear side of the plate-like element.

光學配置26包括長軸光學裝置(此處未示出),其在長軸上對已變換雷射光束24進行整形。尤其是,長軸光學裝置可包括一或多個微透鏡陣列(此處未示出)和主要在長軸上具有正光焦度的一或多個透鏡。微透鏡陣列和一或多個透鏡可包括在y方向上延伸的筒形透鏡,並且具體形成一成像均化器,其在長軸上均化雷射原始光束24,以在長軸上提供有益的禮帽強度特性。The optical arrangement 26 includes long-axis optics (not shown here) that shape the transformed laser beam 24 on the long axis. In particular, the long-axis optics may include one or more microlens arrays (not shown here) and one or more lenses having positive power predominantly on the long axis. The microlens array and one or more lenses may include barrel lenses extending in the y-direction and specifically form an imaging homogenizer that homogenizes the laser raw beam 24 in the long axis to provide a benefit in the long axis The top hat strength properties.

光學配置26另包括多個光學元件32、34、36、38,這些光學元件對短軸上的已擴展雷射光束進行整形和聚焦到工作平面上。光學元件32、34、36、38沿光軸40佈置,並且這裡包括一起形成望遠鏡配置42的第一透鏡32和第二透鏡34。參考編號38表示一反射鏡配置,包括沿短軸折疊光束路徑18的多個反射鏡44、46、48(見圖2)。在此,光學元件38是將照明光束28聚焦到工作平面14上的物鏡。The optical arrangement 26 further includes a plurality of optical elements 32, 34, 36, 38 that shape and focus the expanded laser beam on the short axis onto the working plane. The optical elements 32 , 34 , 36 , 38 are arranged along the optical axis 40 and here include a first lens 32 and a second lens 34 which together form a telescope arrangement 42 . Reference numeral 38 designates a mirror arrangement comprising a plurality of mirrors 44, 46, 48 (see FIG. 2) that fold the beam path 18 along the minor axis. Here, the optical element 38 is the objective lens that focuses the illumination beam 28 onto the working plane 14 .

光學配置26設置成在工作平面14的區域中產生具有限定光束輪廓50的照明光束28。圖3以理想化的圖式顯示這樣的光束輪廓50。光束輪廓50將工作平面14上的雷射輻射強度I描述為沿x軸和y軸的相應位置之函數。如圖所示,光束輪廓50具有長軸52和短軸54,長軸在x方向上具有長軸光束寬度,短軸在y方向上具有短軸光束寬度。短軸光束寬度54例如可定義為半高全寬(FWHM)或90%強度值之間的寬度(90%最大全寬,FW@90%)。這裡,光束輪廓50在短軸上具有禮帽輪廓,其具有第一邊緣56、第二邊緣58和從第一邊緣56連續下降到第二邊緣58的平台60。較佳是,平台60從第一邊緣56到第二邊緣58基本上線性下降,如圖3中簡化形式所示。The optical configuration 26 is arranged to generate an illumination beam 28 having a defined beam profile 50 in the area of the working plane 14 . FIG. 3 shows such a beam profile 50 in an idealized diagram. The beam profile 50 describes the laser radiation intensity I on the working plane 14 as a function of corresponding positions along the x- and y-axes. As shown, the beam profile 50 has a major axis 52 having a major axis beam width in the x-direction and a minor axis having a minor axis beam width in the y-direction, and a minor axis 54 . The short-axis beam width 54 may be defined, for example, as the full width at half maximum (FWHM) or the width between 90% intensity values (90% full width maximum, FW@90%). Here, the beam profile 50 has a top hat profile on the short axis with a first edge 56 , a second edge 58 and a platform 60 descending continuously from the first edge 56 to the second edge 58 . Preferably, the platform 60 descends substantially linearly from the first edge 56 to the second edge 58 , as shown in simplified form in FIG. 3 .

如圖1和圖2內所示,光束輪廓50相對於工作平面14平行於y軸移動,以處理工件16。在一些較佳示範具體實施例中,工件16佈置在可於y方向上移動的工作台上。因此,第一邊緣56沿移動方向20前進,而第二邊緣58沿移動方向20(圖2)後退。平台60在與移動方向相反的方向上傾斜,並且在平行於x軸的視圖中呈單斜形狀。為了良好的順序,應該注意的是,具有邊緣56、58和平台60的短軸光束輪廓在圖1和2中被大幅放大,以用於說明。在較佳示範具體實施例中,短軸光束寬度FWHM在50 µm和150 µm之間的範圍內。長軸光束寬度可在20 mm和1200 mm之間的範圍內。As shown in FIGS. 1 and 2 , the beam profile 50 is moved relative to the work plane 14 parallel to the y-axis to process the workpiece 16 . In some preferred exemplary embodiments, the workpiece 16 is disposed on a table that is movable in the y-direction. Thus, the first edge 56 advances in the direction of movement 20 and the second edge 58 retreats in the direction of movement 20 (FIG. 2). The platform 60 is inclined in a direction opposite to the direction of movement and has a monoclinic shape in a view parallel to the x-axis. For good order, it should be noted that the short-axis beam profile with edges 56, 58 and plateau 60 is greatly exaggerated in Figures 1 and 2 for illustration. In a preferred exemplary embodiment, the short-axis beam width FWHM is in the range between 50 μm and 150 μm. Long-axis beam widths can range between 20 mm and 1200 mm.

圖4顯示根據新設備10的示範具體實施例,光束輪廓50在短軸上的示範強度特性62。如此處可見,真實的短軸光束輪廓62具有許多波紋和波浪,特別是在平台60的區域中。邊緣56、58具有有限斜率,但理想情況下,在每種情況下都需要垂直邊緣。參考編號64表示平均線,例如可為通過波紋和波浪66的回歸線。從平均線64可看出,光束輪廓62的平台60在此從前緣56向後緣58傾斜。在例示的示範具體實施例中,傾斜度約為3%。較佳是,平台60的傾斜度在0.5%和5%之間,包括兩個端點值。FIG. 4 shows an exemplary intensity characteristic 62 on the short axis of the beam profile 50 according to an exemplary embodiment of the new device 10 . As can be seen here, the real short-axis beam profile 62 has many ripples and waves, especially in the region of the platform 60 . The edges 56, 58 have finite slopes, but ideally vertical edges are required in each case. Reference numeral 64 denotes an average line, which may be, for example, a regression line through ripples and waves 66 . As can be seen from the mean line 64 , the plateau 60 of the beam profile 62 here slopes from the leading edge 56 to the trailing edge 58 . In the illustrated exemplary embodiment, the slope is about 3%. Preferably, the inclination of the platform 60 is between 0.5% and 5%, inclusive.

在新方法的較佳示範具體實施例中,平台60的傾斜度通過光學元件32、34、36、38的選擇性調整來實現。尤其是,如圖1和圖2所示,伸縮透鏡34和/或反射鏡44、46,48可用於調整短軸光束路徑18,從而使物鏡38的照明相對於光軸40偏離中心。尤其是,伸縮透鏡34可沿著光軸,即在z方向上移動,如箭頭68所示,和/或其可圍繞長軸(平行於x軸)樞轉,如箭頭70所示。此外,物鏡38和/或短軸光束路徑18的其他透鏡之偏離中心照明可在y方向上移動,如箭頭72所示。最後,反射鏡配置的一或多個反射鏡44、46、48可樞轉。在根據圖4的示範具體實施例中,伸縮透鏡32在y方向上移動100 µm。此外,伸縮透鏡34在z方向上進一步位移-40 mm。作為伸縮透鏡32在y方向上位移的替代方案,伸縮透鏡34在此可樞轉0.5°的角度74。In a preferred exemplary embodiment of the new method, the inclination of the platform 60 is achieved by selective adjustment of the optical elements 32, 34, 36, 38. In particular, as shown in FIGS. 1 and 2 , telescoping lens 34 and/or mirrors 44 , 46 , 48 may be used to adjust short-axis beam path 18 such that the illumination of objective 38 is off-center relative to optical axis 40 . In particular, the telescoping lens 34 can be moved along the optical axis, ie, in the z-direction, as indicated by arrow 68 , and/or it can be pivoted about its long axis (parallel to the x-axis) as indicated by arrow 70 . Additionally, off-center illumination of the objective 38 and/or other lenses of the short-axis beam path 18 may be moved in the y-direction, as indicated by arrow 72 . Finally, one or more mirrors 44, 46, 48 of the mirror arrangement can be pivoted. In the exemplary embodiment according to FIG. 4 , the telescopic lens 32 is moved by 100 μm in the y-direction. In addition, the telescopic lens 34 is further displaced -40 mm in the z-direction. As an alternative to the telescoping lens 32 being displaced in the y-direction, the telescoping lens 34 is here pivotable by an angle 74 of 0.5°.

10:設備 12:雷射光線 14:工作平面 16:工件 18:光束路徑 20、68、70、72:箭頭 22:雷射光源 24:雷射原始光束 26:光學配置 28:照明光束 29:光束方向 30:光束變換器 32、34、36、38:光學元件 40:光軸 42:望遠鏡配置 44、46、48:反射鏡 50:限定光束輪廓 52:長軸 54:短軸 56:第一邊緣 58:第二邊緣 60:平台 62:強度特性 64:平均線 66:波紋和波浪 74:角度 10: Equipment 12: Laser light 14: Work plane 16: Workpiece 18: Beam Path 20, 68, 70, 72: Arrow 22: Laser light source 24: Laser original beam 26: Optical configuration 28: Lighting Beam 29: Beam direction 30: Beam changer 32, 34, 36, 38: Optical Components 40: Optical axis 42: Telescope Configuration 44, 46, 48: Reflector 50: Define beam profile 52: long axis 54: Short axis 56: First Edge 58: Second Edge 60: Platform 62: Strength properties 64: Average Line 66: Ripple and Waves 74: Angle

本發明的示範具體實施例在附圖中示出,並且在以下描述中更詳細解釋。這些都顯示在:Exemplary embodiments of the present invention are illustrated in the accompanying drawings and are explained in greater detail in the following description. These are displayed in:

圖1為新設備的第一示範具體實施例之短軸光束路徑的簡化示意圖;1 is a simplified schematic diagram of the short-axis beam path of a first exemplary embodiment of the new device;

圖2為反射鏡折疊的簡化圖,以解釋新設備的另一個示範具體實施例;Figure 2 is a simplified diagram of mirror folding to explain another exemplary embodiment of the new device;

圖3為根據新設備的示範具體實施例之光束輪廓的簡化圖;3 is a simplified diagram of a beam profile according to an exemplary embodiment of the new apparatus;

圖4為根據新設備的示範具體實施例之短軸光束輪廓的簡化圖。4 is a simplified diagram of a short-axis beam profile according to an exemplary embodiment of the new apparatus.

10:設備 10: Equipment

12:雷射光線 12: Laser light

14:工作平面 14: Work plane

16:工件 16: Workpiece

18:光束路徑 18: Beam Path

20、68、70、72:箭頭 20, 68, 70, 72: Arrow

22:雷射光源 22: Laser light source

24:雷射原始光束 24: Laser original beam

26:光學配置 26: Optical configuration

28:照明光束 28: Lighting Beam

29:光束方向 29: Beam direction

30:光束變換器 30: Beam changer

32、34、36、38:光學元件 32, 34, 36, 38: Optical Components

40:光軸 40: Optical axis

42:望遠鏡配置 42: Telescope Configuration

60:平台 60: Platform

74:角度 74: Angle

Claims (7)

一種用於在一工作平面(14)上產生限定雷射光線(12)的設備,包括設置成產生一雷射原始光束(24)的一雷射光源(22),並且包括接收該雷射原始光束(24)並將其轉換成沿一光軸(40)的照明光束(28)之光學配置(26),其中該照明光束(28)限定與該工作平面(14)相交的一光束方向(29),其中該照明光束(28)在該工作平面(14)的區域中具有一光束輪廓(50),該光束輪廓(50)垂直於該光束方向(29)具有具備長軸光束寬度的長軸(52)和具備短軸光束寬度的短軸(54),其中該光學配置(26)可沿一移動方向(20)相對於該工作平面(14)移動,以便通過該照明光束(28)處理一工件(16),並且其中該光束輪廓(50)具有沿短軸光束寬度定義的一限定強度特性(62),該強度特性(62)具有在該移動方向(20)上的一前緣(56),在該移動方向(20)上的一後緣(58)和位於該前緣(56)與該後緣(58)之間的一平台(60),其中該平台(60)在該前緣(56)的區域中具有比在該後緣(58)的區域中更高之強度位準,特徵在於該光學配置(26)以這樣的方式調整,使得該平台(60)具有連續降低的平均(64)強度位準。A device for generating a defined laser beam (12) on a working plane (14), comprising a laser light source (22) arranged to generate a laser raw beam (24), and comprising receiving the laser raw beam (24) Optical configuration (26) of light beam (24) and converting it into an illumination beam (28) along an optical axis (40), wherein the illumination beam (28) defines a beam direction ( 29), wherein the illumination beam (28) in the region of the working plane (14) has a beam profile (50) perpendicular to the beam direction (29) having a long beam width with a long axis an axis (52) and a short axis (54) having a short axis beam width, wherein the optical arrangement (26) is movable relative to the working plane (14) in a direction of movement (20) in order to pass the illumination beam (28) Processing a workpiece (16) and wherein the beam profile (50) has a defined intensity characteristic (62) defined along the short-axis beam width, the intensity characteristic (62) having a leading edge in the direction of travel (20) (56), a trailing edge (58) in the direction of movement (20) and a platform (60) located between the leading edge (56) and the trailing edge (58), wherein the platform (60) is The leading edge ( 56 ) has a higher intensity level in the region of the trailing edge ( 58 ), characterized in that the optical configuration ( 26 ) is adjusted in such a way that the platform ( 60 ) has a continuous Reduced average (64) intensity level. 如請求項1所述之設備,特徵在於該光學配置(26)設置成用單個雷射原始光束(24)產生該平台(60)。The apparatus of claim 1, characterized in that the optical arrangement (26) is arranged to generate the platform (60) with a single laser raw beam (24). 如請求項1或2所述之設備,特徵在於該光學配置(26)包括形成相對於該光束輪廓(50)短軸的光束路徑(18)之多個光學元件(32、34、36、38),其中該等多個光學元件中之一光學元件是位於該光束路徑末端的一物鏡(38),並且其中該光束路徑(18)照亮偏離中心的該物鏡(38)。Apparatus according to claim 1 or 2, characterized in that the optical arrangement (26) comprises a plurality of optical elements (32, 34, 36, 38) forming a beam path (18) with respect to the minor axis of the beam profile (50) ), wherein one of the optical elements is an objective (38) at the end of the beam path, and wherein the beam path (18) illuminates the objective (38) off-center. 如請求項3所述之設備,特徵在於該等多個光學元件(32、34、36、38)包括在該光束路徑(18)中的一伸縮透鏡(34),該伸縮透鏡(34)相對於該光軸(40)偏離中心。Apparatus as claimed in claim 3, characterized in that the plurality of optical elements (32, 34, 36, 38) comprise a telescopic lens (34) in the beam path (18), the telescopic lens (34) opposing off-center from the optical axis (40). 如請求項3或4所述之設備,特徵在於該等多個光學元件(32、34、36、38)包括在該光束路徑(18)中的一伸縮透鏡(34),該伸縮透鏡(34)佈置於相對該光軸(40)傾斜。Apparatus as claimed in claim 3 or 4, characterized in that the plurality of optical elements (32, 34, 36, 38) comprise a telescopic lens (34) in the beam path (18), the telescopic lens (34) ) arranged to be inclined relative to the optical axis (40). 如請求項3至5任一項所述之設備,特徵在於該等多個光學元件(32、34、36、38)包括折疊該光束路徑(18)的多個反射鏡(44、46、48),其中該等多個反射鏡(44、46、48)中的至少一個反射鏡設置成偏離中心照明該物鏡(38)。Apparatus according to any of claims 3 to 5, characterized in that the plurality of optical elements (32, 34, 36, 38) comprise a plurality of mirrors (44, 46, 48) that fold the beam path (18) ), wherein at least one of the plurality of mirrors (44, 46, 48) is arranged to illuminate the objective (38) off-centre. 一種用於在一工作平面(14)上產生一限定雷射光線(12)的方法,包括以下步驟: –    提供產生一雷射原始光束(24)的一雷射光源(22), –    提供一光學配置(26),其接收該雷射原始光束(24)並將其沿一光軸(40)轉換成限定與該工作平面(14)相交的一光束方向(29)之照明光束(28),該光學配置(26)具有多個光學元件(32、34、36、38)並且可沿一移動方向(20)相對於該工作平面(14)移動,以便通過該照明光束(28)處理一工件(16),以及 –    將該雷射光源(22)投入運作, 其中該照射光束(28)在該工作平面(14)的區域中獲得一光束輪廓(50),該光束輪廓垂直於該光束方向(29)具有具備長軸光束寬度的一長軸(52)和具備短軸光束寬度的一短軸(54),其中該光束輪廓(50)沿該短軸光束寬度具有一限定的強度特性(62),該強度特性(62)獲得該移動方向(20)上的一前緣(56)、該移動方向(20)上的一後緣(58)以及位於該前緣(56)與該後緣(58)之間的一平台(60),並且其中該平台(60)在該前緣(56)的區域中具有比在該後緣(58)的區域中更高的強度位準,特徵在於該光學元件(32、34、36、38)以這種方式調整,使得該平台(60)獲得連續降低的平均(64)強度位準。 A method for generating a defined laser ray (12) on a working plane (14), comprising the steps of: – providing a laser light source (22) generating a laser original beam (24), – providing an optical arrangement (26) that receives the laser raw beam (24) and converts it along an optical axis (40) into an illumination beam defining a beam direction (29) intersecting the working plane (14) (28), the optical arrangement (26) having a plurality of optical elements (32, 34, 36, 38) and movable relative to the working plane (14) in a direction of movement (20) in order to pass the illumination beam (28) ) process a workpiece (16), and – put the laser light source (22) into operation, wherein the illumination beam ( 28 ) acquires a beam profile ( 50 ) in the region of the working plane ( 14 ), the beam profile having a long axis ( 52 ) with a long axis beam width perpendicular to the beam direction ( 29 ) and A short axis (54) having a short axis beam width, wherein the beam profile (50) has a defined intensity characteristic (62) along the short axis beam width, the intensity characteristic (62) obtained in the direction of movement (20) A leading edge (56) of the moving direction (20), a trailing edge (58) in the moving direction (20), and a platform (60) between the leading edge (56) and the trailing edge (58), and wherein the platform (60) having a higher intensity level in the region of the leading edge (56) than in the region of the trailing edge (58), characterized in that the optical elements (32, 34, 36, 38) are in this way Adjusted so that the platform (60) achieves a continuously decreasing average (64) intensity level.
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