TW202219117A - 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件 - Google Patents

樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件 Download PDF

Info

Publication number
TW202219117A
TW202219117A TW110130930A TW110130930A TW202219117A TW 202219117 A TW202219117 A TW 202219117A TW 110130930 A TW110130930 A TW 110130930A TW 110130930 A TW110130930 A TW 110130930A TW 202219117 A TW202219117 A TW 202219117A
Authority
TW
Taiwan
Prior art keywords
group
resin composition
preferable
compound
compounds
Prior art date
Application number
TW110130930A
Other languages
English (en)
Chinese (zh)
Inventor
吉田健太
山口修平
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202219117A publication Critical patent/TW202219117A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW110130930A 2020-08-26 2021-08-20 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件 TW202219117A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020142847 2020-08-26
JP2020-142847 2020-08-26

Publications (1)

Publication Number Publication Date
TW202219117A true TW202219117A (zh) 2022-05-16

Family

ID=80353281

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110130930A TW202219117A (zh) 2020-08-26 2021-08-20 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件

Country Status (4)

Country Link
JP (1) JPWO2022045059A1 (ja)
KR (1) KR20230043165A (ja)
TW (1) TW202219117A (ja)
WO (1) WO2022045059A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006309202A (ja) * 2005-03-29 2006-11-09 Toray Ind Inc 感光性樹脂組成物およびそれを用いた半導体装置
JP2007094342A (ja) * 2005-09-02 2007-04-12 Kaneka Corp 難燃性を有する感光性樹脂組成物及びその利用
JP5641652B2 (ja) * 2011-03-31 2014-12-17 日本化薬株式会社 感光性樹脂組成物
WO2018003726A1 (ja) * 2016-06-29 2018-01-04 富士フイルム株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイス、積層体の製造方法、半導体デバイスの製造方法およびポリイミド前駆体
KR102279447B1 (ko) * 2017-06-06 2021-07-20 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 및 반도체 디바이스
TWI779162B (zh) * 2018-01-29 2022-10-01 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、積層體的製造方法、半導體器件

Also Published As

Publication number Publication date
WO2022045059A1 (ja) 2022-03-03
KR20230043165A (ko) 2023-03-30
JPWO2022045059A1 (ja) 2022-03-03

Similar Documents

Publication Publication Date Title
TW202219034A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202212425A (zh) 硬化物的製造方法、積層體的製造方法及半導體元件的製造方法
TWI835240B (zh) 硬化物之製造方法、積層體之製造方法及半導體元件之製造方法以及處理液
TW202212992A (zh) 硬化物的製造方法、積層體的製造方法及半導體元件的製造方法
TW202112836A (zh) 硬化膜的製造方法、光硬化性樹脂組成物、積層體的製造方法及電子元件的製造方法
TW202235490A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
JP7498281B2 (ja) 硬化性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス
TW202222912A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202219637A (zh) 感光性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件
TW202136375A (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
TW202311304A (zh) 永久膜之製造方法、積層體之製造方法及裝置之製造方法以及永久膜
TW202219161A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TW202225268A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TW202219119A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法、半導體器件、聚醯亞胺前驅物及其製造方法
TW202225840A (zh) 硬化物的製造方法、積層體的製造方法及半導體元件的製造方法
TW202219092A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件以及光鹼產生劑
TW202212424A (zh) 複合圖案的製造方法、樹脂組成物、積層體的製造方法及半導體裝置的製造方法
TW202219118A (zh) 聚醯亞胺前驅物之製造方法及硬化性樹脂組成物之製造方法
TW202210557A (zh) 硬化物的製造方法、積層體的製造方法及電子元件的製造方法
TW202219117A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件
TW202225227A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TW202219080A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法、半導體器件、聚醯亞胺前驅物及其製造方法
TW202222911A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TW202219120A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件以及化合物
TW202208511A (zh) 硬化物的製造方法、樹脂組成物、顯影液、積層體的製造方法及半導體器件的製造方法