TW202217223A - Modular conducted electrical weapon - Google Patents
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- TW202217223A TW202217223A TW110131493A TW110131493A TW202217223A TW 202217223 A TW202217223 A TW 202217223A TW 110131493 A TW110131493 A TW 110131493A TW 110131493 A TW110131493 A TW 110131493A TW 202217223 A TW202217223 A TW 202217223A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
- F41H13/00—Means of attack or defence not otherwise provided for
- F41H13/0012—Electrical discharge weapons, e.g. for stunning
- F41H13/0031—Electrical discharge weapons, e.g. for stunning for remote electrical discharge by means of a wireless projectile
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
- F41H13/00—Means of attack or defence not otherwise provided for
- F41H13/0012—Electrical discharge weapons, e.g. for stunning
- F41H13/0025—Electrical discharge weapons, e.g. for stunning for remote electrical discharge via conducting wires, e.g. via wire-tethered electrodes shot at a target
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Abstract
Description
本發明之實施例係關於一種模組化導電武器(「MCEW」)。Embodiments of the present invention relate to a modular conductive weapon ("MCEW").
導電武器(「CEW」)透過人體或動物目標之組織提供及傳送一電流。電流會干擾目標之自主運動,例如步行、跑步、移動等等。電流可引起促使目標停止自主運動之疼痛或其他不適。電流可藉由使目標之骨骼肌變得僵硬、鎖定及/或凍結以破壞肌肉之自主控制來引起神經肌肉失能。此失能干擾由目標之自主運動。典型CEW發射兩個或更多電極以透過目標組織遠端傳送電流。兩個或更多個電極使用電線系鏈電耦合至CEW,且在部署電極之前、部署電極期間及部署電極之後保持耦合至CEW。Conductive Weapons ("CEW") provide and transmit an electrical current through the tissue of a human or animal target. The current can interfere with the voluntary movement of the target, such as walking, running, moving, etc. The electrical current can cause pain or other discomfort that prompts the target to stop voluntary movement. The electrical current can cause neuromuscular incapacitation by stiffening, locking, and/or freezing the targeted skeletal muscle to disrupt autonomic control of the muscle. This disability interferes with the voluntary movement of the target. A typical CEW fires two or more electrodes to deliver electrical current distally through the target tissue. Two or more electrodes are electrically coupled to the CEW using a wire tether and remain coupled to the CEW before, during, and after deployment of the electrodes.
在各種實施例中,揭示一種用於一模組化導電武器(「MCEW」)之部署外殼。該部署外殼可包括:一部署端,其界定一前開口;一轉換端,其界定一後開口;及一本體,其界定該部署端與該轉換端之間的一機架,其中該機架能夠自該部署端或該轉換端接收一部署單元,且其中該部署端經構形以轉移該部署單元離開該機架且遠離該MCEW。In various embodiments, a deployment enclosure for a Modular Conductive Weapon ("MCEW") is disclosed. The deployment housing may include: a deployment end defining a front opening; a transition end defining a rear opening; and a body defining a rack between the deployment end and the transition end, wherein the rack A deployment unit can be received from the deployment end or the conversion end, and wherein the deployment end is configured to transfer the deployment unit away from the rack and away from the MCEW.
在各種實施例中,該轉換端可進一步界定與該機架流體連通之一底部開口。該機架可經構形以自該轉換端之該後開口或該底部開口之至少一者接收該部署單元。該本體可進一步界定鄰近該底部開口之一配件埠。該配件埠可與該底部開口流體連通。該配件埠可經定大小及塑形以使一配件能夠回應於該部署單元接收於該本體內而與該部署單元介接。該本體可包括一第一側壁及與該第一側壁對置之一第二側壁,且其中該第一側壁或該第二側壁之至少一者界定一導引通道。該主要外殼可進一步包括耦合至該本體之一安裝表面,其中該安裝表面經構形以使該本體耦合至一物件。該主要外殼可進一步包括安置於該機架內之一梭動機構。該梭動機構可包括至少部分暴露於該本體外之一橫桿,其中該橫桿經構形以操作該梭動機構。In various embodiments, the transition end can further define a bottom opening in fluid communication with the frame. The rack can be configured to receive the deployment unit from at least one of the rear opening or the bottom opening of the transition end. The body may further define a fitting port adjacent the bottom opening. The fitting port can be in fluid communication with the bottom opening. The accessory port can be sized and shaped to enable an accessory to interface with the deployment unit in response to the deployment unit being received within the body. The body may include a first side wall and a second side wall opposite to the first side wall, wherein at least one of the first side wall or the second side wall defines a guide channel. The main housing may further include a mounting surface coupled to the body, wherein the mounting surface is configured to couple the body to an item. The main housing may further include a shuttle mechanism disposed within the frame. The shuttle mechanism may include a rail at least partially exposed outside the body, wherein the rail is configured to operate the shuttle mechanism.
在各種實施例中,揭示一種模組化導電武器(「MCEW」)。該MCEW可包括界定一機架之一外殼、一前開口、一後開口及一底部開口。該前開口、該後開口及該底部開口之各者可經構形以容納一部署單元之轉移。該機架可經構形以透過該後開口及該底部開口之至少一者接收該部署單元。該MCEW可包括安置於該機架內之一梭動機構,其中該梭動機構經構形以使該部署單元移動至該機架中之一發射位置中且透過該前開口自該外殼彈出該部署單元。In various embodiments, a modular conductive weapon ("MCEW") is disclosed. The MCEW may include a housing defining a chassis, a front opening, a rear opening, and a bottom opening. Each of the front opening, the rear opening, and the bottom opening can be configured to accommodate transfer of a deployment unit. The rack can be configured to receive the deployment unit through at least one of the rear opening and the bottom opening. The MCEW can include a shuttle mechanism disposed within the rack, wherein the shuttle mechanism is configured to move the deployment unit into a firing position in the rack and eject the housing from the housing through the front opening Deployment unit.
在各種實施例中,該機架可經構形以容納一後部署單元及一前向部署單元;該梭動機構可經構形以迫使該後部署單元向前;且該後部署單元之向前移動可經構形以迫使該前向部署單元向前且離開該前開口。該梭動機構可包括經構形以接合該後部署單元以迫使該後部署單元向前之一對臂。該梭動機構可包括經構形以使該前向部署單元保持於該機架內之一前向匣止動件。該梭動機構可包括一外部橫桿,其中該外部橫桿經構形以促進該梭動機構移動。該梭動機構可包括可滑動地安置於該機架內之一梭子;及連接至該梭子之一外部橫桿,其中該外部橫桿經構形以使該梭子可操作地滑動於該機架內。該梭動機構可進一步包括經構形以朝向該發射位置偏置該梭子及該部署單元之一彈簧。In various embodiments, the rack can be configured to accommodate a rear-deployed unit and a forward-deployed unit; the shuttle mechanism can be configured to force the rear-deployed unit forward; and the direction of the rear-deployed unit The forward movement can be configured to force the forward deployment unit forward and out of the front opening. The shuttle mechanism may include a pair of arms configured to engage the rear deployment unit to force the rear deployment unit forward. The shuttle mechanism may include a forward pocket stop configured to retain the forward deployment unit within the frame. The shuttle mechanism may include an outer rail, wherein the outer rail is configured to facilitate movement of the shuttle mechanism. The shuttle mechanism may include a shuttle slidably disposed within the frame; and an outer rail connected to the shuttle, wherein the outer rail is configured to operably slide the shuttle over the frame Inside. The shuttle mechanism may further include a spring configured to bias the shuttle and the deployment unit toward the fired position.
在各種實施例中,揭示一種操作一模組化導電武器(「MCEW」)之方法。該方法可包括操作,該等操作包括:將一梭動機構操作至一外殼中之一第一位置,其中在該第一位置中,該梭動機構使一第一部署單元定位至一發射位置中;將該梭動機構操作至該外殼中之一第二位置,其中在該第二位置中,該梭動機構接合定位於該第一部署單元後面之一第二部署單元;及將該梭動機構操作至該外殼中之該第一位置,其中返回該第一位置中,該梭動機構使該第一部署單元自該外殼彈射且將該第二部署單元定位至該發射位置中。In various embodiments, a method of operating a modular conductive weapon ("MCEW") is disclosed. The method may include operations comprising: operating a shuttle mechanism to a first position in a housing, wherein in the first position the shuttle mechanism positions a first deployment unit to a firing position operating the shuttle mechanism to a second position in the housing, wherein in the second position the shuttle mechanism engages a second deployment unit positioned behind the first deployment unit; and the shuttle The shuttle mechanism operates to the first position in the housing, wherein returning to the first position, the shuttle mechanism ejects the first deployment unit from the housing and positions the second deployment unit into the firing position.
在各種實施例中,在該發射位置中,該第一部署單元或該第二部署單元經構形以啟動以透過該外殼中之一前開口發射一射彈。該梭動機構可藉由迫使該第二部署單元向前抵靠該第一部署單元來使該第一部署單元自該外殼彈射,且其中該第二部署單元使該第一部署單元透過該前開口自該外殼彈出。In various embodiments, in the firing position, the first deployment unit or the second deployment unit is configured to activate to fire a projectile through a front opening in the housing. The shuttle mechanism can eject the first deployment unit from the housing by forcing the second deployment unit forward against the first deployment unit, and wherein the second deployment unit causes the first deployment unit to pass through the front The opening pops out of the housing.
上述特徵及元件可依各種組合方式組合而不具排他性,除非本文中另有明確指示。將鑑於以下描述及附圖更明白此等特徵及元件以及所揭示實施例之操作。The above-described features and elements may be combined in various combinations without being exclusive, unless expressly indicated otherwise herein. These features and elements, as well as the operation of the disclosed embodiments, will become more apparent in view of the following description and accompanying drawings.
本文中之例示性實施例之詳細描述參考藉由繪示方式來展示例示性實施例之附圖。儘管足夠詳細地描述此等實施例以使熟習技術者能夠實踐本發明,且應瞭解可實現其他實施例及可根據本發明及本文中之教示來對設計及建構作出邏輯改變及調整。因此,本文中之詳細描述僅為了繪示目的呈現且不具限制性。The detailed description of exemplary embodiments herein refers to the accompanying drawings, which illustrate exemplary embodiments by way of illustration. Although these embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, it is to be understood that other embodiments can be implemented and that logical changes and adjustments can be made to the design and construction in accordance with the invention and the teachings herein. Accordingly, the detailed description herein is presented for purposes of illustration only and is not limiting.
本發明之範疇應藉由隨附申請專利範圍及其合法等效物而非僅僅藉由所描述之實例來界定。例如,任何方法或程序描述中敘述之步驟可依任何次序執行且未必限於所呈現之次序。此外,對單數之任何參考包含複數實施例,且對一個以上組件或步驟之任何參考可包含一單數實施例或步驟。此外,對附接、固定、耦合、連接或其類似者之任何參考可包含永久、可移動、暫時、部分、全部及/或任何其他可行附接選項。另外,對無接觸(或類似片語)之任何參考亦可包含減少接觸或最少接觸。表面陰影線可在整個圖式中用於指示不同部分但未必指示相同或不同材料。The scope of the invention should be defined by the appended claims and their legal equivalents, rather than by the examples described only. For example, the steps recited in any method or procedure description may be performed in any order and are not necessarily limited to the order presented. Furthermore, any reference to the singular includes the plural embodiment, and any reference to more than one component or step may include a singular embodiment or step. Furthermore, any reference to attached, fixed, coupled, connected or the like may include permanent, removable, temporary, partial, full and/or any other possible attachment options. Additionally, any reference to no contact (or similar phrases) may also include reduced contact or minimal contact. Surface hatching may be used throughout the drawings to indicate different parts but not necessarily the same or different materials.
系統、方法及設備可用於干擾一目標之自主運動(例如步行、跑步、移動等等)。例如,一CEW可用於透過一人體或動物目標之組織傳送一電流(例如刺激信號、電流脈衝、電荷脈衝等等)。儘管通常指稱一導電武器,如本文中所描述,一「CEW」可指代一導電武器、一能量傳導武器、一電子控制裝置及/或經構形以透過一或多個部署射彈(例如電極)提供一刺激信號之任何其他類似裝置或設備。The systems, methods, and apparatus can be used to interfere with the voluntary movement of a target (eg, walking, running, moving, etc.). For example, a CEW can be used to deliver a current (eg, stimulation signal, current pulse, charge pulse, etc.) through the tissue of a human or animal target. Although commonly referred to as a conductive weapon, as described herein, a "CEW" may refer to a conductive weapon, an energy-conducting weapon, an electronic control device, and/or configured to pass through one or more deployed projectiles (eg, electrode) any other similar device or apparatus that provides a stimulation signal.
一刺激信號將一電荷攜載至目標組織中。刺激信號可干擾目標之自主運動。刺激信號會引起疼痛。疼痛亦可作用以促進目標停止移動。刺激信號會引起目標之骨骼肌變得僵硬(例如鎖定、凍結等等)。肌肉回應於一刺激信號而僵硬可指稱神經肌肉失能(「NMI」)。NMI干擾目標之肌肉之自主控制。目標無法控制其肌肉干擾目標之運動。A stimulation signal carries a charge into the target tissue. The stimulus signal can interfere with the voluntary movement of the target. Stimulation signals cause pain. Pain can also act to prompt the target to stop moving. The stimulus signal causes the target's skeletal muscle to become stiff (eg, lock, freeze, etc.). Stiffening of a muscle in response to a stimulus signal can be referred to as neuromuscular insufficiency ("NMI"). NMI interferes with the voluntary control of the target's muscles. The target's inability to control its muscles interferes with the target's movement.
一刺激信號可經由耦合至CEW之端子透過目標傳送。經由端子之傳送可指稱一區域傳送(例如一區域眩暈、一驅動眩暈等等)。在區域傳送期間,可藉由將CEM定位成鄰近目標來使端子靠近目標。刺激信號經由端子透過目標之組織傳送。為提供區域傳送,CEW之使用者通常在目標之臂範圍內且使CEW之端子接觸或鄰近目標。A stimulation signal can be delivered through the target via terminals coupled to the CEW. A transfer via a terminal may refer to a zone transfer (eg, a zone stun, a drive stun, etc.). During zone transfer, the terminals can be brought close to the target by positioning the CEM adjacent to the target. Stimulation signals are delivered through the terminals through the target's tissue. To provide area delivery, the user of the CEW is usually within the arm of the target and has the terminals of the CEW in contact with or adjacent to the target.
一刺激信號可經由一或多個(通常至少兩個)電線系鏈電極透過目標傳送。經由電線系鏈電極之傳送可指稱一遠端傳送(例如一遠端眩暈)。在一遠端傳送期間,CEW可與目標分離達電線系鏈之長度(例如15英尺、20英尺、30英尺等等)。CEW朝向目標發射電極。當電極朝向目標行進時,各自電線系鏈部署在電極後面。電線系鏈將CEW電耦合至電極。電極可電耦合至目標,藉此使CEW電耦合至目標。回應於電極與目標之組織連接、撞擊於組織上或定位成鄰近組織,電流可經由電極透過目標提供(例如,一電流透過第一系鏈及第一電極、目標之組織及第二電極及第二系鏈形成)。A stimulation signal can be delivered through the target via one or more (usually at least two) wire tether electrodes. Delivery via a wire tether electrode may refer to a distal delivery (eg, a distal stun). During a remote delivery, the CEW may be separated from the target by the length of the wire tether (eg, 15 feet, 20 feet, 30 feet, etc.). CEW towards the target emitter electrode. The respective wire tethers are deployed behind the electrodes as they travel towards the target. A wire tether electrically couples the CEW to the electrodes. The electrodes can be electrically coupled to the target, thereby electrically coupling the CEW to the target. In response to the electrode being attached to the tissue of the target, impinging on the tissue, or positioned adjacent to the tissue, an electrical current may be provided through the target through the electrode (eg, an electrical current through the first tether and the first electrode, the tissue of the target and the second electrode and the second electrode). secondary tether formation).
接觸或鄰近目標之組織之端子或電極透過目標傳送刺激電流。使一端子或電極與目標之組織接觸建立與目標之組織之一電耦合(例如電路)。電極可包含可刺穿目標之組織以接觸目標之一矛頭。鄰近目標之組織之一端子或電極可使用離子化來建立與目標之組織之一電耦合。離子化亦可指稱電弧作用。Terminals or electrodes in tissue contacting or adjacent to the target deliver stimulation current through the target. Contacting a terminal or electrode with the target tissue establishes an electrical coupling (eg, a circuit) with the target tissue. The electrode may comprise a spearhead that can pierce the tissue of the target to contact the target. A terminal or electrode adjacent to the target tissue can use ionization to establish an electrical coupling with the target tissue. Ionization can also be referred to as arcing.
在使用中(例如,在部署期間),一端子或電極可藉由目標之服裝或一氣隙來與目標之組織分離。在各種實施例中,CEW之一信號產生器可在一高壓(例如在40,000伏至100,000伏之範圍內)提供刺激信號(例如電流、電流脈衝等等)以離子化使端子或電極與目標之組織分離之服裝中之空氣或間隙中之空氣。離子化空氣建立自端子或電極至目標之組織之一低阻抗離子化路徑,其可用於經由離子化路徑將刺激信號傳送至目標之組織。只要經由離子化路徑提供刺激信號之一脈衝電流,電離路徑就會持續存在(例如,保持存在、持續等等)。當電流停止或降低至一臨限值(例如安培數、電壓)以下時,離子化路徑崩潰(例如,不再存在)且端子或電極不再電耦合至目標之組織。缺乏離子化路徑,端子或電極與目標組織之間的阻抗很高。約50,000伏之範圍內之一高電壓可離子化高達約1英寸之一間隙中之空氣。In use (eg, during deployment), a terminal or electrode can be separated from the target's tissue by the target's garment or an air gap. In various embodiments, a signal generator of the CEW may provide stimulation signals (eg, current, current pulses, etc.) at a high voltage (eg, in the range of 40,000 volts to 100,000 volts) to ionize the terminals or electrodes to the target Air in garments or interstitial spaces for tissue separation. The ionized air establishes a low impedance ionization path from the terminal or electrode to the target tissue, which can be used to transmit stimulation signals to the target tissue via the ionization path. The ionization path persists (eg, remains present, persists, etc.) as long as a pulsed current of the stimulation signal is provided via the ionization path. When the current stops or falls below a threshold value (eg, amperage, voltage), the ionization path collapses (eg, no longer exists) and the terminal or electrode is no longer electrically coupled to the target tissue. Absent an ionization pathway, the impedance between the terminal or electrode and the target tissue is high. A high voltage in the range of about 50,000 volts can ionize air in a gap of up to about 1 inch.
一CEW可提供一刺激信號作為一系列電流脈衝。各電流脈衝可包含一高電壓部分(例如40,000伏至100,000伏)及一低電壓部分(例如500伏至6,000伏)。一刺激信號之一脈衝之高電壓部分可離子化一電極或端子與一目標之間的一間隙中之空氣以使電極或端子電耦合至目標。回應於電極或端子電耦合至目標,脈衝之低電壓部分經由離子化路徑將一定量之電荷傳送至目標之組織。回應於電極或端子藉由接觸(例如觸碰、嵌入組織中之矛頭等等)電耦合至目標,脈衝之高電壓部分及脈衝之低電壓部分兩者將電荷傳送至目標之組織。一般而言,脈衝之低電壓部分將脈衝之大部分電荷傳送至目標之組織中。在各種實施例中,刺激信號之一脈衝之高電壓部分可指稱火花或離子化部分。一脈衝之低電壓部分可指稱肌肉部分。A CEW can provide a stimulation signal as a series of current pulses. Each current pulse may include a high voltage portion (eg, 40,000 volts to 100,000 volts) and a low voltage portion (eg, 500 volts to 6,000 volts). The high voltage portion of a pulse of a stimulation signal can ionize air in a gap between an electrode or terminal and a target to electrically couple the electrode or terminal to the target. In response to the electrode or terminal being electrically coupled to the target, the low voltage portion of the pulse delivers an amount of charge to the target's tissue via the ionization pathway. In response to the electrode or terminal being electrically coupled to the target by contact (eg, touch, spearhead embedded in tissue, etc.), both the high voltage portion of the pulse and the low voltage portion of the pulse transfer charge to the target tissue. In general, the low voltage portion of the pulse transfers most of the charge of the pulse into the target tissue. In various embodiments, the high voltage portion of a pulse of the stimulation signal may be referred to as the sparking or ionizing portion. The low voltage portion of a pulse may be referred to as a muscle portion.
在各種實施例中,CEW之一信號產生器可僅在一低電壓(例如小於2,000伏)提供刺激信號(例如電流、電流脈衝等等)。低電壓刺激信號可不離子化使端子或電極與目標之組織分離之服裝中之空氣或間隙中之空氣。具有僅在一低電壓提供刺激信號之一信號產生器(例如一低電壓產生器)之一CEW會需要經部署電極藉由接觸(例如觸碰、嵌入至組織中之矛頭等等)電耦合至目標。In various embodiments, one of the signal generators of the CEW may provide stimulation signals (eg, current, current pulses, etc.) only at a low voltage (eg, less than 2,000 volts). The low voltage stimulation signal may not ionize the air in the garment or the air in the gap that separates the terminals or electrodes from the target tissue. A CEW with a signal generator (eg, a low voltage generator) that provides the stimulation signal only at a low voltage would require the deployed electrodes to be electrically coupled to the Target.
一CEW可包含CEW之面部處之至少兩個端子。一CEW可包含用於接收一部署單元(例如匣)之各機架之兩個端子。端子可彼此間隔開。回應於機架中之部署單元之電極未被部署,施加於端子兩端之高電壓會導致端子之間的空氣離子化。端子之間的電弧可能肉眼可見。回應於一經發射電極未電耦合至一目標,將經由電極提供之電流可經由端子電弧橫跨CEW之表面。A CEW may include at least two terminals at the face of the CEW. A CEW may include two terminals for each rack that receives a deployment unit (eg, cassette). The terminals may be spaced apart from each other. In response to the electrodes of the deployed units in the rack not being deployed, the high voltage applied across the terminals causes air ionization between the terminals. Arcing between terminals may be visible to the naked eye. In response to an emitter electrode not being electrically coupled to a target, the current to be provided through the electrode can be arced across the surface of the CEW via the terminal.
當傳送刺激信號之電極間隔至少6英寸(15.24厘米)使得來自刺激信號之電流流過目標組織之至少6英寸時,刺激信號會引起NMI之概率增加。在各種實施例中,電極較佳地應在目標上間隔開至少12英寸(30.48厘米)。因為一CEW上之端子通常間隔小於6英寸,所以經由端子透過目標組織傳送之刺激信號可能不會引起NMI,只會引起疼痛。When the electrodes delivering the stimulation signal are separated by at least 6 inches (15.24 cm) such that the current from the stimulation signal flows through at least 6 inches of the target tissue, the stimulation signal will cause an increased probability of NMI. In various embodiments, the electrodes should preferably be spaced at least 12 inches (30.48 cm) apart on the target. Because the terminals on a CEW are typically less than 6 inches apart, stimulation signals delivered through the target tissue through the terminals may not cause NMI, but only pain.
一系列脈衝可包含兩個或更多個在時間上分離之脈衝。各脈衝向目標組織傳送一定量之電荷。回應於適當間隔之電極(如上文所討論),隨著各脈衝傳送每脈衝55微庫侖至71微庫侖之範圍內之一電荷量,誘發NMI之概率增加。當脈衝傳送速率(例如速率、脈衝率、重複率等等)在每秒11個脈衝(「pps」)及50pps之間時,誘發NMI之概率增加。依一較高速率傳送之脈衝可提供較少每脈衝電荷以誘發NMI。每脈衝傳送更多電荷之脈衝可依一較低速率傳送以誘發NMI。在各種實施例中,一CEW可被手持且使用電池來提供刺激信號之脈衝。回應於每脈衝之電荷量較高且脈衝率較高,CEW可使用比誘發NMI所需之更多能量。使用比所需更多之能量會更快地耗盡電池。A series of pulses may contain two or more pulses that are separated in time. Each pulse delivers a certain amount of electrical charge to the target tissue. In response to properly spaced electrodes (as discussed above), the probability of inducing an NMI increases as each pulse delivers an amount of charge in the range of 55 to 71 microcoulombs per pulse. The probability of inducing NMI increases when the pulse delivery rate (eg, rate, pulse rate, repetition rate, etc.) is between 11 pulses per second ("pps") and 50 pps. Pulses delivered at a higher rate can provide less charge per pulse to induce NMI. Pulses that deliver more charge per pulse can be delivered at a lower rate to induce NMI. In various embodiments, a CEW can be held in hand and use a battery to provide pulses of stimulation signals. In response to a higher amount of charge per pulse and a higher pulse rate, CEWs can use more energy than needed to induce NMI. Using more energy than needed will drain the battery faster.
經驗測試表明,回應於脈衝率小於44pps且每一脈衝之電荷約為63微庫侖,電池之功率可能會被保存且很大概率引起NMI。經驗測試表明,當電極間距至少為12英寸(30.48厘米)時,經由一對電極之22pps之一脈衝率及每一脈衝63微庫侖將誘發NMI。Empirical testing has shown that in response to a pulse rate of less than 44pps and a charge of approximately 63 microcoulombs per pulse, battery power may be conserved and a high probability of causing NMI occurs. Empirical testing has shown that a pulse rate of 22 pps and 63 microcoulombs per pulse through a pair of electrodes will induce NMI when the electrodes are spaced at least 12 inches (30.48 cm) apart.
在各種實施例中,一CEW可包含一手柄及一或多個部署單元。手柄可包含用於接收部署單元之一或多個機架。各部署單元可移除地定位於(例如,插入至、耦合至等等)一機架中。各部署單元可釋放地電氣、電子及/或機械耦合至一機架。CEW之一部署可朝向一目標發射一或多個電極以透過目標遠端遞送刺激信號。In various embodiments, a CEW may include a handle and one or more deployment units. The handle may contain one or more racks for receiving the deployment unit. Each deployment unit is removably positioned (eg, inserted into, coupled to, etc.) in a rack. Each deployment unit is releasably coupled electrically, electronically and/or mechanically to a rack. A deployment of the CEW can fire one or more electrodes toward a target to deliver stimulation signals distal to the target.
在各種實施例中,一部署單元可包含同時發射之兩個或更多個電極。在各種實施例中,一部署單元可包含可在不同時間個別發射之兩個或更多個電極。發射電極可指稱啟動(例如,發射)一部署單元。在使用(例如啟動、發射)之後,一部署單元可自機架移除且用一未使用(例如,未發射、未啟動)部署單元替換以允許發射額外電極。In various embodiments, a deployment unit may include two or more electrodes that emit simultaneously. In various embodiments, a deployment unit can include two or more electrodes that can be individually fired at different times. A transmit electrode may be referred to as activating (eg, transmitting) a deployment unit. After use (eg, activation, firing), a deployment unit can be removed from the rack and replaced with an unused (eg, non-fired, non-activated) deployment unit to allow additional electrodes to be fired.
在各種實施例中,且參考圖1,揭示一CEW 1。CEW 1可類似於本文中所討論之任何CEW或具有與本文中所討論之任何CEW類似之態樣及/或組件。CEW 1可包括一外殼10及一或多個部署單元20 (例如匣)。熟習技術者應瞭解,圖1係CEW 1之一示意表示,且CEW 1之組件之一或多者可位於外殼10內或外殼10外之任何適合位置中。In various embodiments, and with reference to FIG. 1, a
外殼10可經構形以容置經構形以實現部署單元20之部署之CEW 1之各種組件,向部署單元20提供一電流且依其他方式幫助CEW 1之操作,如本文中將進一步討論。儘管在圖1中被描繪成一槍枝,但外殼10可包括任何適合形狀及/或大小。外殼10可包括與一部署端14對置之一手柄端12。部署端14可經構形且經量定大小及塑形以接收一或多個部署單元20。手柄端12可經定大小及塑形以固持於一使用者之一手中。例如,手柄端12可經塑形為用於實現由使用者手動操作CEW之一手柄。在各種實施例中,手柄端12亦可包括經塑形以適合一使用者之手之輪廓,例如符合人體工程學之一抓握。手柄端12可包含一表面塗層,諸如(例如)一防滑表面、一抓握墊、一橡膠紋理及/或其類似者。作為一進一步實例,手柄端12可根據期望包繞於皮革、一彩色印刷品及/或任何其他適合材料中。
在各種實施例中,外殼10可包括經構形以幫助執行CEW 1之功能之各種機械、電子及/或電性組件。例如,外殼10可包括一或多個觸發器18、控制介面30、處理電路35、電源40及/或信號產生器45。外殼10可包含一護罩16。護罩16可界定形成於外殼10中之一開口。護罩16可定位於外殼10之一中心區域上(例如,如圖1中所描繪),及/或外殼10上之任何其他適合位置中。觸發器18可安置於護罩16內。護罩16可經構形以保護觸發器18免於意外實體接觸(例如觸發器18之一意外啟動)。護罩16可將觸發器18環繞於外殼10內。In various embodiments,
在各種實施例中,觸發器18耦合至外殼10之一外表面,且可經構形以在施加實體接觸之後即移動、滑動、旋轉或依其他方式實體下壓或移動。例如,觸發器18可由自護罩16內施加至觸發器18之實體接觸致動。觸發器18可包括一機械或機電開關、按鈕、觸發器或其類似者。例如,觸發器18可包括一開關、一推鈕及/或任何其他適合類型之觸發器。觸發器18可機械及/或電子耦合至處理電路35。回應於觸發器18被啟動(例如,由使用者下壓、推動等等),處理電路35可實現來自CEW 1之一或多個部署單元20之部署,如本文中將進一步討論。In various embodiments, trigger 18 is coupled to an outer surface of
在各種實施例中,電源40可經組態以向CEW 1之各種組件提供電力。例如,電源40可提供用於操作CEW 1之電子及/或電性組件(例如部件、子系統、電路等等)及/或一或多個部署單元20之能量。電源40可提供電力。提供電力可包含在一電壓處提供一電流。電源40可電耦合至處理電路35及/或信號產生器45。在各種實施例中,回應於控制介面30包括電子性質及/或組件,電源40可電耦合至控制介面30。在各種實施例中,回應於觸發器18包括電子性質或組件,電源40可電耦合至觸發器18。電源40可在一電壓處提供一電流。來自電源40之電力可經提供為一直流電(「DC」)。來自電源40之電力可經提供為一交流電(「AC」)。電源40可包含一電池。電源40之能量可為可再生的或可耗盡的,及/或可替換的。例如,電源40可包括一或多個可再充電或一次性電池。在各種實施例中,來自電源40之能量可自一個形式(例如電性、磁性、熱性)轉換成另一形式亦執行一系統之功能。In various embodiments,
電源40可提供用於執行CEW 1之功能之能量。例如,電源40可向信號產生器45提供透過一目標提供以阻礙目標運動(例如,經由部署單元20)之電流。電源40可針對一刺激信號提供能量。電源40可針對其他信號(包含一觸發信號及/或一整合信號)提供能量,如本文中將進一步討論。
在各種實施例中,處理電路35可包括經組態以執行本文中所討論之各種操作及功能之任何電路系統、電性組件、電子組件、軟體及/或其類似者。例如,處理電路35可包括一處理電路、一處理器、一數位信號處理器、一微控制器、一微處理器、一專用積體電路(ASIC)、一可程式化邏輯裝置、邏輯電路系統、狀態機、MEMS裝置、信號調節電路系統、通信電路系統、一電腦、一基於電腦之系統、一無線電、一網路設備、一資料匯流排、一位址匯流排及/或其等之任何組合。在各種實施例中,處理電路35可包含被動電子裝置(例如電阻器、電容器、電感器等等)及/或主動電子裝置(例如運算放大器、比較器、類比轉數位轉換器、數位轉類比轉換器、可程式化邏輯、SRC、電晶體等等)。在各種實施例中,處理電路35可包含資料匯流排、輸出埠、輸入埠、計時器、記憶體、算術單元及/或其類似者。In various embodiments, processing
處理電路35可經組態以提供及/或接收數位及/或類比形式之電信號。處理電路35可使用任何協定來經由一資料匯流排提供及/或接收數位資訊。處理電路35可接收資訊、操縱經接收資訊且提供經操縱資訊。處理電路35可儲存資訊且擷取經儲存資訊。由處理電路35接收、儲存及/或操縱之資訊可用於執行一功能、控制一功能及/或執行一操作或執行一經儲存程式。Processing
處理電路35可控制CEW 1之其他電路及/或組件之操作及/或功能。處理電路35可接收關於其他組件之操作之狀態資訊,執行關於狀態資訊之計算,且向一或多個其他組件提供命令(例如指令)。處理電路35可命令另一組件開始操作、繼續操作、改變操作、暫停操作、停止操作或其類似者。命令及/或狀態可經由包含任何類型之資料/位址匯流排之任何類型之匯流排(例如SPI匯流排)傳達於處理電路35與其他電路及/或組件之間。Processing
在各種實施例中,處理電路35可機械地及/或電子地耦合至觸發器18。處理電路35可經組態以偵測觸發器18之一啟動、致動、下壓、輸入等等(統稱為一「啟動事件」)。回應於偵測到啟動事件,處理電路35可經組態以執行各種操作及/或功能,如本文中將進一步討論。處理電路35亦可包含附接至觸發器18且經組態以偵測觸發器18之一啟動事件之一感測器(例如一觸發器感測器)。感測器可包括能夠偵測觸發器18中之一啟動事件且將啟動事件報告給處理電路35之任何適合感測器,諸如一機械及/或電子感測器。In various embodiments, processing
在各種實施例中,處理電路35可機械地及/或電子地耦合至控制介面30。處理電路35可經組態以偵測控制介面30之一啟動、致動、下壓、輸入等等(統稱為一「控制事件」)。回應於偵測到控制事件,處理電路35可經組態以執行各種操作及/或功能,如本文中將進一步討論。處理電路35亦可包含附接至控制介面30且經組態以偵測控制介面30之一控制事件之一感測器(例如一控制感測器)。感測器可包括能夠偵測控制介面30中之一控制事件且將控制事件報告給處理電路35之任何適合機械及/或電子感測器。In various embodiments, processing
在各種實施例中,處理電路35可電性地及/或電子地耦合至電源40。處理電路35可自電源40接收電力。自電源40接收之電力可由處理電路35用於接收信號、處理信號且將信號傳輸至CEW 1中之各種其他組件。處理電路35可使用來自電源40之電力來偵測觸發器18之一啟動事件、控制介面30之一控制事件或其類似者,且回應於經偵測事件而產生一或多個控制信號。控制信號可基於控制事件及啟動事件。控制信號可為一電信號。In various embodiments, processing
在各種實施例中,處理電路35可電性地及/或電子地耦合至信號產生器45。處理電路35可經組態以回應於偵測觸發器18之一啟動事件而向信號產生器45傳輸或提供控制信號。可將多個控制信號自微處理器35串聯提供至信號產生器45。回應於接收控制信號,信號產生器45可經組態以執行各種功能及/或操作,如本文中將進一步討論。In various embodiments, processing
在各種實施例中,信號產生器45可經組態以自處理電路35接收一或多個控制信號。信號產生器45可基於控制信號來向部署單元20提供一觸發信號。信號產生器45可電性地及/或電子地耦合至處理電路35及/或部署單元20。信號產生器45可電耦合至電源40。信號產生器45可使用自電源40接收之電力來產生一觸發信號。例如,信號產生器45可自電源40接收具有第一電流值及電壓值之一電信號。信號產生器45可將電信號轉換成具有第二電流值及電壓值之一觸發信號。經轉換第二電流值及/或經轉換第二電壓值可不同於第一電流值及/或電壓值。經轉換第二電流值及/或經轉換第二電壓值可相同於第一電流值及/或電壓值。信號產生器45可暫時儲存來自電源40之電力且完全或部分依賴於經儲存電力來提供觸發信號。信號產生器45亦可在無需暫時儲存電力之情況下完全或部分依賴於自電源40接收之電力來提供觸發信號。In various embodiments,
信號產生器45可由處理電路35完全或部分地控制。在各種實施例中,信號產生器45及處理電路35可為單獨組件(例如,實體不同及/或邏輯離散)。信號產生器45及處理電路35可為一單一組件。例如,外殼10內之一控制電路可至少包含信號產生器45及處理電路35。控制電路亦可包含其他組件及/或配置,包括將此等元件之對應功能進一步整合至一單一組件或電路中之組件及/或配置,以及將某些功能進一步分離成單獨組件或電路之組件及/或配置。The
信號產生器45可由控制信號控制以產生具有一預定電流值之一觸發信號。例如,信號產生器45可包含一電流源。控制信號可由信號產生器45接收以在電流源之一電流值處啟動電流源。可接收一額外控制信號以減小電流源之電流。例如,信號產生器45可包含耦合於一電流源與控制電路之一輸出之間的一脈寬修正電路。可由信號產生器45接收一第二控制信號以啟動脈寬修正電路,藉此減少由電流源產生之一信號之一非零週期及隨後由控制電路輸出之一觸發信號之一總電流。脈寬修正電路可與電流源之一電路分離,或替代地,整合於電流源之一電路內。可替代地或另外採用各種其他形式之信號產生器45,包含在一或多個不同電阻上施加一電壓以產生具有不同電流之信號之信號產生器。在各種實施例中,信號產生器45可包含經組態以傳送具有一高電壓之一電流之一高電壓模組。在各種實施例中,信號產生器45可包含經組態以傳送具有一較低電壓(諸如(例如)2,000伏)之一電流之一低電壓模組。The
回應於接收指示觸發器18之啟動(例如一啟動事件)之一信號,一控制電路向部署單元20提供一觸發信號。例如,信號產生器45可回應於自處理電路35接收一控制信號而將一電信號作為一觸發信號提供至部署單元20。在各種實施例中,觸發信號可與一刺激信號分離且不同。例如,相對於向其提供一觸發信號之一電路,CEW 1中之一刺激信號可被提供給部署單元20內之一不同電路。信號產生器45可經組態以產生一刺激信號。在各種實施例中,外殼10內之一第二單獨信號產生器、組件或電路(圖中未展示)可經組態以產生刺激信號。信號產生器45亦可針對部署單元20提供一接地信號路徑,藉此完成由信號產生器45提供至部署單元20之一電信號之一電路。接地信號路徑亦可由外殼10中之其他元件(包含電源40)提供至部署單元20。In response to receiving a signal indicating activation of trigger 18 (eg, an activation event), a control circuit provides a trigger signal to
在各種實施例中,一部署單元20可包括一推進系統25及複數個射彈,諸如一第一射彈27及一第二射彈28。部署單元20可包括任何適合或所要數目個射彈,諸如(例如)2個射彈、3個射彈、9個射彈、12個射彈、18個射彈及/或任何其他所要數目個射彈。此外,外殼10可經構形以接收任何適合或所要數目個部署單元20,諸如(例如) 1個部署單元、2個部署單元、3個部署單元等等。In various embodiments, a
在各種實施例中,推進系統25可耦合至部署單元20中之各射彈或與其通信。在各種實施例中,部署單元20可包括複數個推進系統25,其中各推進系統25耦合至一或多個射彈或與其通信。推進系統25可包括能夠在部署單元20中提供一推進力之任何裝置、推進劑(例如空氣、氣體等等)、引子或其類似者。推進力可包含由一區域或腔室內之快速膨脹氣體引起之一壓力增加。推進力可施加至部署單元20中之射彈27、28以引起射彈27、28之部署。推進系統25可回應於部署單元20接收觸發信號而提供推進力。In various embodiments,
在各種實施例中,推進力可直接施加至一或多個射彈27、28。例如,推進力可直接提供至第一射彈27或第二射彈28。推進系統25可與射彈27、28流體連通以提供推進力。例如,來自推進系統25之推進力可在部署單元20之一外殼或通道內行進至一或多個射彈27、28。推進力可經由部署單元20中之一歧管行進。In various embodiments, the propulsive force may be applied directly to one or
在各種實施例中,推進力可間接提供至第一射彈27及/或第二射彈28。例如,推進力可提供至推進系統25內之一輔助推進劑源。推進力可發射推進系統25內之輔助推進劑源,因此輔助推進劑源釋放推進劑。與經釋放推進劑相關聯之一力可繼而將一力提供至一或多個射彈27、28。由一輔助推進劑源產生之一力可引起射彈27、28自部署單元20及CEW 1部署。In various embodiments, propulsion may be provided indirectly to the
在各種實施例中,各射彈27、28可包括任何適合類型之射彈。例如,一或多個射彈27、28可為或包含一電極(例如一電極靶標)。一電極可包含經組態以刺穿或附接鄰近一目標之一組織以在電極與組織之間提供一導電路徑之一矛頭部分,如本文中先前所討論。例如,射彈27、28可各包含一各自電極。射彈27、28可同時或實質上同時自部署單元20部署。射彈27、28可由來自一共同推進系統25之一相同推進力發射。射彈27、28亦可由接收自一或多個推進系統25之一或多個推進力發射。部署單元20可包含經構形以將來自推進系統25之一推進力傳送至一或多個射彈27、28之一內部歧管。作為一進一步實例,本文中所揭示之一或多個射彈可為或包含一電極(例如一電極靶標)、一纏結射彈(例如一基於系鏈之纏結射彈、一網等等)、一有效裝載射彈(例如包括一液體或氣體物質)或其類似者。In various embodiments, each projectile 27, 28 may comprise any suitable type of projectile. For example, one or
控制介面30可包括或類似於本文中所揭示之任何控制介面。在各種實施例中,控制介面30可經組態以控制CEW 1中之發射模式之控制選擇。控制CEW 1中之發射模式之控制選擇可包含停用CEW 1之發射(例如一安全模式等等)、啟用CEW 1之發射(例如一作用模式、一發射模式、一遞增模式等等)、控制部署單元20之部署及/或類似操作,如本文中將進一步討論。
控制介面30可位於外殼10上或外殼10中之任何適合位置中。例如,控制介面30可耦合至外殼10之一外表面。控制介面30可耦合至鄰近觸發器18及/或護罩16之外殼10之一外表面。控制介面30可電性地、機械地及/或電子地耦合至處理單元35。在各種實施例中,回應於控制介面30包括電子性質或組件,控制介面30可電性耦合至電源40。控制介面30可自電源40接收電力(例如電流)以供電電子性質或組件。The
控制介面30可電子地或機械地耦合至觸發器18。例如,且如本文中將進一步討論,控制介面30可充當一安全機構。回應於控制介面30經設定成一「安全模式」,CEW 1會無法自部署單元20發射射彈27、28。例如,控制介面30可向處理電路35提供指示處理電路35停用部署單元20之部署之一信號(例如一控制信號)。作為一進一步實例,控制介面30可電子地或機械地禁止觸發器18啟動(例如,防止一使用者或使其無法下壓觸發器18;防止觸發器18發射一射彈27、28;等等)。
控制介面30可包括能夠實現發射模式之選擇之任何適合電子或機械組件。例如,控制介面30可包括一發射模式選擇器開關、一安全開關、一安全卡掣、一旋轉開關、一選擇開關、一選擇性發射機構及/或任何適合機械控制。作為一進一步實例,控制介面30可包括一滑件,諸如一手槍滑件、一往復滑件或其類似者。作為一進一步實例,控制介面30可包括一觸控螢幕或類似電子組件。
安全模式可經組態以禁止來自CEW 1中之部署單元20之一電極或其他射彈27、28之部署。例如,回應於一使用者選擇安全模式,控制介面30可將一安全模式指令傳輸至處理電路35。回應於接收安全模式指令,處理電路35可禁止來自部署單元20之一電極之部署。處理電路35可在自控制介面30接收一進一步指令(例如一發射模式指令)之前禁止部署。如先前所討論,控制介面30亦可或替代地與CEW 1之觸發器18相互作用以防止啟動觸發器18。在各種實施例中,安全模式亦可經組態以禁止來自CEW 1之信號產生器45之一刺激信號之部署,諸如(例如)一區域傳送。The safe mode can be configured to prohibit the deployment of an electrode or
發射模式可經組態以實現來自CEW 1中之部署單元20之一或多個電極或其他射彈27、28之部署。例如,且根據各種實施例,回應於一使用者選擇發射模式,控制介面30可將一發射模式指令傳輸至處理電路35。回應於接收發射模式指令,處理電路35可實現來自部署單元20之一電極之部署。就此而言,回應於觸發器18被啟動,處理電路35可引起一或多個電極之部署。處理電路35可在自控制介面30接收一進一步指令(例如一安全模式指令)之前實現部署。作為一進一步實例,且根據各種實施例,回應於一使用者選擇發射模式,控制介面30亦可機械地(或電子地)與CEW 1之觸發器18相互作用以實現觸發器18之啟動。The firing mode can be configured to enable deployment of one or more electrodes or
在各種實施例中,一CEW可包括一模組化導電武器(「MCEW」)。一MCEW可允許使用各種平台、系統、設備、附接件、手柄及/或其類似者來部署射彈,如本文中將進一步討論。一MCEW可移除地耦合至一或多個平台、系統、設備、附接件、手柄及/或其類似者,如本文中將進一步討論。就此而言,一MCEW可移動且可在經構形以接收一MCEW之平台、系統、設備、附接件、手柄及/或其類似者之間相互操作。例如,一MCEW可移除地耦合至一武器(例如一槍枝、包括一導軌介面系統之一武器等等)、一專用發射器、一輔助外殼、一車輛、一無人駕駛車輛(例如一無人機車輛(UAV)、一無人地面車輛(UGV)、一無人水面艦艇(USV)等等)、一機器人或其類似者。作為一進一步實例,一MCEW可移除地耦合至一手柄、一槍托部(例如一槍托、一肩托、一尾托等等)、一握把、一符合人體工程學之手柄或其類似者。一槍托部可包含任何適合或所要槍托部,諸如(例如)一直握槍托部、一全手槍握把槍托部、一半握把槍托部、一拇指孔握把槍托部、一符合人體工程學之握把槍托部或其類似者。In various embodiments, a CEW may include a Modular Conductive Weapon ("MCEW"). An MCEW may allow deployment of projectiles using various platforms, systems, devices, attachments, handles, and/or the like, as discussed further herein. An MCEW is removably coupled to one or more platforms, systems, devices, attachments, handles, and/or the like, as discussed further herein. In this regard, an MCEW is movable and interoperable between platforms, systems, devices, attachments, handles, and/or the like configured to receive an MCEW. For example, an MCEW is removably coupled to a weapon (eg, a firearm, a weapon including a rail interface system, etc.), a dedicated launcher, an auxiliary enclosure, a vehicle, an unmanned vehicle (eg, an unmanned vehicle) an unmanned ground vehicle (UAV), an unmanned ground vehicle (UGV), an unmanned surface vessel (USV), etc.), a robot, or the like. As a further example, an MCEW is removably coupled to a handle, a stock (eg, a stock, a shoulder stock, a stock, etc.), a grip, an ergonomic handle, or the like similar. A stock may comprise any suitable or desired stock, such as, for example, a full grip stock, a full pistol grip stock, a half grip stock, a thumb hole grip stock, a Ergonomic grip stock or similar.
在各種實施例中,一MCEW可包括複數個附接點或端部,使得MCEW可同時可移除地耦合至複數個平台、系統、設備、附接件、手柄及/或其類似者。In various embodiments, an MCEW may include a plurality of attachment points or ends such that the MCEW may be simultaneously removably coupled to a plurality of platforms, systems, devices, attachments, handles, and/or the like.
在各種實施例中,一MCEW可包括一導軌介面系統、一配件導軌或其類似者(例如一MCEW導軌介面),諸如一韋佛式(Weaver)導軌、一皮卡汀尼式(Picatinny)導軌(例如,MIL-STD-1913導軌、STANAG 2324導軌等等)或其類似者。MCEW導軌介面可經構形以與一平台、系統、設備、附接件、手柄及/或其類似者上之一對應導軌介面系統、配件導軌或其類似者介接。MCEW導軌介面可經構形以與對應導軌介面系統、配件導軌或其類似者介接以將MCEW可移除地耦合至平台、系統、設備、附接件、手柄及/或其類似者。In various embodiments, an MCEW may include a rail interface system, an accessory rail, or the like (eg, an MCEW rail interface), such as a Weaver rail, a Picatinny rail ( For example, MIL-STD-1913 rails, STANAG 2324 rails, etc.) or the like. The MCEW rail interface can be configured to interface with a corresponding rail interface system, accessory rail, or the like on a platform, system, device, attachment, handle, and/or the like. The MCEW rail interface can be configured to interface with a corresponding rail interface system, accessory rail, or the like to removably couple the MCEW to platforms, systems, devices, attachments, handles, and/or the like.
在各種實施例中,一MCEW可包括經構形以能夠客製及耦合至各種附接件及外殼之各種模組化組件。例如,一MCEW可包括經構形以提供能夠引起一射彈部署之一或多個組件之一主要外殼(例如一第一外殼、一模組化外殼等等)。主要外殼可經構形以自一第二外殼(例如一部署單元外殼、一彈匣外殼、一尾托外殼等等)接收一或多個部署單元。第二外殼可耦合至主要外殼。主要外殼可經構形以部署由第二外殼提供之一或多個射彈。在各種實施例中,一第二外殼可將一第一部署單元提供至主要外殼。主要外殼可回應於自第二外殼接收第一部署單元而接收及容置第一部署單元。第二外殼可容置下一部署單元,而主要外殼可容置第一部署單元。主要外殼可彈射第一部署單元且自第二外殼接收下一部署單元。In various embodiments, an MCEW may include various modular components configured to enable customization and coupling to various attachments and housings. For example, an MCEW may include a primary housing (eg, a first housing, a modular housing, etc.) configured to provide one or more components capable of causing a projectile to deploy. The primary housing may be configured to receive one or more deployment units from a secondary housing (eg, a deployment unit housing, a magazine housing, a stock housing, etc.). The second housing can be coupled to the primary housing. The primary housing may be configured to deploy one or more projectiles provided by the secondary housing. In various embodiments, a second housing may provide a first deployment unit to the primary housing. The primary housing can receive and house the first deployment unit in response to receiving the first deployment unit from the second housing. The second housing may house the next deployment unit, while the primary housing may house the first deployment unit. The primary housing can eject the first deployment unit and receive the next deployment unit from the second housing.
在各種實施例中,用於一MCEW之一部署單元(例如一MCEW部署單元)可包含發射射彈、透過射彈提供一刺激信號及回應於部署單元被MCEW彈射而持續提供刺激信號所需之所有組件。例如,用於一MCEW之一部署單元可包含一電源及一信號產生器。部署單元之組件可固持於(例如,含於)一外殼上或外殼中。射彈可自外殼發射。外殼可自MCEW彈射以連續發射部署單元之組件。電源及信號產生器可經構形以在部署一或多個射彈之後且在自MCEW彈射部署單元之前、自MCEW彈射部署單元期間及自MCEW彈射部署單元之後透過射彈提供刺激信號。In various embodiments, a deployment unit for an MCEW (eg, an MCEW deployment unit) may include the necessary components to fire the projectile, provide a stimulus signal through the projectile, and continue to provide the stimulus signal in response to the deployment unit being ejected by the MCEW. All components. For example, a deployment unit for an MCEW may include a power supply and a signal generator. The components of the deployment unit may be held on (eg, contained in) a housing or in the housing. Projectiles can be fired from the casing. The housing can be ejected from the MCEW to continuously fire the components of the deployment unit. The power supply and signal generator may be configured to provide stimulation signals through the projectiles after the one or more projectiles are deployed and before the deployment unit is ejected from the MCEW, during and after the deployment unit is ejected from the MCEW.
用於一MCEW之一部署單元可分階段發射。例如,且根據各種實施例,部署單元之一或多個射彈可在部署單元彈射之前發射。部署單元可包含用於發射一或多個射彈及/或透過一目標提供一或多個刺激信號之所有組件。部署單元之射彈可電線系鏈至部署單元之外殼。A deployment unit for an MCEW may be launched in stages. For example, and according to various embodiments, one or more projectiles of the deployment unit may be fired before the deployment unit is ejected. A deployment unit may include all components for launching one or more projectiles and/or providing one or more stimulation signals through a target. The projectiles of the deployment unit can be wire-tethered to the outer casing of the deployment unit.
在各種實施例中,射彈可朝向一目標發射,接著彈射部署單元之外殼之至少一部分或部署單元之其他部分。例如,射彈可在一第一發射時(或期間)自外殼發射。外殼或外殼之一部分或部署單元可在一第二發射時(或期間)自MCEW彈射。In various embodiments, the projectile may be fired toward a target, followed by ejection of at least a portion of the housing of the deployment unit or other portions of the deployment unit. For example, the projectile may be fired from the casing at (or during) a first firing. The enclosure or a portion of the enclosure or the deployment unit may be ejected from the MCEW at (or during) a second launch.
在各種實施例中,一第一發射可包含自外殼(例如部署單元外殼)部署之一或多個射彈。一第二發射(及後續發射)可包含自外殼部署之一或多個額外射彈。一最後發射可包含自MCEW之主要外殼彈射部署單元。In various embodiments, a first launch may include deploying one or more projectiles from a housing (eg, a deployment unit housing). A second shot (and subsequent shots) may include deployment of one or more additional projectiles from the housing. A final launch may involve ejecting the deployment unit from the main hull of the MCEW.
在各種實施例中,回應於部署單元自MCEW之主要外殼彈射,主要外殼可裝載(例如準備、移動、定位等等)一第二部署單元。第二部署單元可類似地分階段部署(例如電極部署、外殼彈射等等)。(第一)部署單元及第二部署單元可由一第二外殼提供至主要外殼。In various embodiments, in response to the deployment unit being ejected from the primary housing of the MCEW, the primary housing may carry (eg, prepare, move, locate, etc.) a second deployment unit. The second deployment unit may similarly be deployed in stages (eg, electrode deployment, shell ejection, etc.). The (first) deployment unit and the second deployment unit may be provided by a second housing to the main housing.
在各種實施例中,可在MCEW之主要外殼處控制MCEW之發射階段。例如,主要外殼(或耦合至主要外殼、與主要外殼通信等等)之一觸發器可經構形以引起來自容置於主要外殼中之部署單元之一或多個射彈之部署(例如第一發射)。In various embodiments, the launch phase of the MCEW may be controlled at the main housing of the MCEW. For example, a trigger of the primary enclosure (or coupled to, in communication with the primary enclosure, etc.) may be configured to cause deployment of one or more projectiles from a deployment unit housed in the primary enclosure (eg, the first a launch).
一第二觸發器(例如一閂鎖、一橫桿、一開關等等)可經構形以引起部署單元自主要外殼彈射(例如第二發射)。A second trigger (eg, a latch, a crossbar, a switch, etc.) can be configured to cause the deployment unit to eject (eg, a second launch) from the main housing.
在各種實施例中,第二觸發器之一單一啟動可引起部署單元彈射及第二部署單元載入。例如,回應於單一啟動,主要外殼可自主要外殼彈射部署單元且自第二外殼擷取及裝載第二部署單元。In various embodiments, a single actuation of a second trigger may cause the deployment unit to be ejected and the second deployment unit loaded. For example, in response to a single actuation, the primary housing can eject the deployment unit from the primary housing and retrieve and load the second deployment unit from the secondary housing.
在各種實施例中,第二觸發器可平移至一第一位置及一第二位置。在射彈部署期間,第二觸發器可處於第一位置中。第二觸發器進入第二位置中之一第一動作可彈射部署單元。第二觸發器進入第二位置中之第一動作亦可實現第二部署單元之裝載(或至少部分裝載)。第二觸發器返回至第一位置中之一第二動作可裝載第二部署單元且實現來自裝載於主要外殼中之第二部署單元之後續射彈之部署。In various embodiments, the second trigger is translatable to a first position and a second position. During deployment of the projectile, the second trigger may be in the first position. A first action of the second trigger into the second position ejects the deployment unit. The first action of the second trigger into the second position may also effect loading (or at least partial loading) of the second deployment unit. A second action of the second trigger returning to the first position can load the second deployment unit and effect deployment of subsequent projectiles from the second deployment unit loaded in the main housing.
在其他實施例中,一MCEW可包括一單一觸發器,經構形以引起來自容置於主要外殼中之部署單元之一或多個射彈之部署。在部署之後,一自動化或電子模組可引起部署單元自主要外殼彈射。替代地,在射彈部署之後,部署單元可自主要外殼手動移除。In other embodiments, an MCEW may include a single trigger configured to cause deployment of one or more projectiles from a deployment unit housed in the main housing. After deployment, an automated or electronic module can cause the deployment unit to eject from the main housing. Alternatively, after projectile deployment, the deployment unit may be manually removed from the main housing.
在各種實施例中,圖2A至圖2D描繪部署射彈及自一MCEW彈射一部署單元之一實例性序列或階段。儘管圖2A至圖2D描繪自包括一槍枝形手柄之一MCEW之一個例示性部署及彈射,但由圖2A至圖2D繪示之原理及隨附描述亦可應用於使用依任何適合配置及/或具有本文中所討論之任何所要數目個射彈、射彈之部署序列、MCEW構形、MCEW模組化設定或其類似者之一MCEW之一部署及彈射。In various embodiments, Figures 2A-2D depict an example sequence or phase of deploying a projectile and ejecting a deployment unit from an MCEW. Although FIGS. 2A-2D depict an exemplary deployment and ejection from an MCEW including a gun-shaped handle, the principles and accompanying descriptions depicted by FIGS. 2A-2D can also be applied to use in any suitable configuration and One of the MCEWs having any desired number of projectiles, deployment sequences of projectiles, MCEW configurations, MCEW modular settings, or the like discussed herein, and ejection.
具體參考圖2A,一MCEW 100可瞄準一目標105或朝向目標105定向。一第一部署單元120-1可被裝載(例如容置)於MCEW 100中且準備好部署。第一部署單元120-1可包括任何適合或所要數目個射彈,諸如(例如)一第一射彈127-1及一第二射彈128-1。Referring specifically to FIG. 2A , an
具體參考圖2B,MCEW 100之一第一啟動可被接收以部署第一射彈127-1及第二射彈128-1之一或兩者(例如一第一發射)。可回應於MCEW 100之一第一觸發器之一啟動來接收第一啟動。回應於接收第一啟動,MCEW 100可朝向目標105部署第一射彈127-1及第二射彈128-1之一或兩者。在各種實施例中,回應於第一啟動,第一部署單元120-1之一信號產生器可透過第一射彈127-1及第二射彈128-1提供一刺激信號。第一部署單元120-1之電路系統(例如電源、信號產生器、處理電路等等)操作以經由第一射彈127-1及第二射彈128-1透過目標105提供刺激信號。一刺激信號包含阻礙一目標之運動之任何類型之電信號,包含一脈衝電流。第一部署單元120-1之電路系統可提供一或多個刺激信號,如本文中將進一步討論。2B, a first activation of the
在一個實施例中,當第一射彈127-1及第二射彈128-1朝向目標105行進時,電線系鏈在第一部署單元120-1及第一射彈127-1及第二射彈128-1後面部署,使得第一射彈127-1及第二射彈128-1保持電耦合至第一部署單元120-1。回應於第一射彈127-1及第二射彈128-1耦合至目標105 (例如電耦合、形成一電路等等),刺激信號可自第一部署單元120-1透過電線系鏈、透過第一射彈127-1及第二射彈128-1且透過目標105行進。In one embodiment, as the first projectile 127-1 and the second projectile 128-1 travel toward the
具體參考圖2C,在發射第一射彈127-1及第二射彈128-1之後之某個時段,第一部署單元120-1可自MCEW 100彈射(例如一第二發射)。MCEW 100可接收一第二啟動以彈射第一部署單元120-1。可回應於MCEW 100之一第二觸發器之一啟動來接收第二啟動。回應於接收第二啟動,MCEW 100可引起第一部署單元120-1彈射。彈射第一部署單元120-1可導致第一部署單元120-1遠離MCEW 100及/或朝向目標105行進。第一部署單元120-1可著陸於地面上或耦合至目標105之電線系鏈之長度內之鄰近表面上。Referring specifically to FIG. 2C, at some time period after the first projectile 127-1 and the second projectile 128-1 are fired, the first deployment unit 120-1 may be ejected from the MCEW 100 (eg, a second shot). The
第一部署單元120-1之電路系統可在第一部署單元120-1彈射之前、第一部署單元120-1彈射期間及/或第一部署單元120-1彈射之後繼續向第一射彈127-1及第二射彈128-1提供刺激信號。在各種實施例中,第一部署單元120-1之電路系統可經組態以在任何適合之時段(包含一固定時段,諸如5秒、10秒、30秒等等)內繼續提供刺激信號。The circuitry of the first deployment unit 120-1 may continue to the first projectile 127 before the first deployment unit 120-1 is ejected, during the ejection of the first deployment unit 120-1, and/or after the first deployment unit 120-1 is ejected -1 and the second projectile 128-1 provide stimulation signals. In various embodiments, the circuitry of the first deployment unit 120-1 may be configured to continue to provide stimulation signals for any suitable period, including a fixed period, such as 5 seconds, 10 seconds, 30 seconds, etc. .
具體參考圖2D,MCEW 100可裝載(例如接合、準備、準備發射等等)一第二部署單元120-2。MCEW 100可回應於彈射第一部署單元120-1而載入第二部署單元120-2。MCEW 100可回應於第二啟動(例如,第二觸發器之啟動)而載入第二部署單元120-2。MCEW 100可回應於第三啟動(例如,第二觸發器之一第二啟動)而載入第二部署單元120-2。第二部署單元120-2可包括任何適合或所要數目個射彈,諸如(例如)一第三射彈127-2及一第四射彈128-2。2D, the
在各種實施例中,第一部署單元120-1可在第二部署單元120-2裝載之前、第二部署單元120-2裝載期間及/或第二部署單元120-2裝載之後或在如先前所討論之任何其他時段內繼續向第一射彈127-1及第二射彈128-1提供刺激信號。MCEW 100可隨後引起第三射彈127-2及第四射彈128-2之部署(例如一第三發射)、一第二刺激信號自第二部署單元120-2向第三射彈127-2及第四射彈128-2之提供及第二部署單元120-2自MCEW 100之彈射(例如一第四發射)。射彈之部署、刺激信號之提供及部署單元之彈射可類似於先前參考第一部署單元120-1、第一射彈127-1及第二彈128-1所討論之射彈之部署、刺激信號之提供及部署單元之彈射。In various embodiments, the first deployment unit 120-1 may be loaded before the second deployment unit 120-2 is loaded, during the second deployment unit 120-2 is loaded, and/or after the second deployment unit 120-2 is loaded or as before Stimulation signals continue to be provided to the first projectile 127-1 and the second projectile 128-1 for any other time period discussed. The
在各種實施例中,且參考圖3,揭示一例示性MCEW 200。MCEW 200可類似於本文中所討論之任何CEW或MCEW或具有與其類似之態樣及/或組件,包含(但不限於) CEW 1、MCEW 100及MCEW 900。為簡潔起見,可在描述MCEW 200時省略(部分或全部)本文中先前所描述之一CEW之冗餘特性或元件。In various embodiments, and with reference to FIG. 3, an
在各種實施例中,MCEW 200可包括一模組化外殼210、一梭動機構234、一轉換配接器222、一手柄270及/或一前握把216之一或多者。MCEW 200可包括或含有一或多個部署單元。MCEW 200可進一步包括經構形以向模組化外殼210提供一或多個部署單元之一第二外殼,如本文中將進一步詳細討論。梭動機構234可至少部分地安置於模組化外殼210內。轉換配接器222可耦合至模組化外殼210且可經構形以允許模組化外殼210與不同第二外殼介接以接收一或多個部署單元。手柄270可直接耦合至模組化外殼210,或可經由轉換配接器222耦合至模組化外殼210。前握把216可耦合至模組化外殼210。In various embodiments, the
在各種實施例中,參考圖4A及圖4B且繼續參考圖3,模組化外殼210 (例如一部署外殼、一主要外殼、一主外殼等等)可經構形以接收及容置一或多個部署單元。模組化外殼210可經構形以允許一部署單元自部署單元部署一或多個射彈。模組化外殼210可經構形以允許部署單元自模組化外殼210彈射。模組化外殼210可經構形以允許接收下一部署單元且允許部署一或多個下一射彈。模組化外殼210可類似於本文中所討論之任何外殼或具有與其類似之態樣及/或組件。In various embodiments, referring to FIGS. 4A and 4B and with continued reference to FIG. 3 , the modular housing 210 (eg, a deployment housing, a main housing, a main housing, etc.) may be configured to receive and house an or Multiple deployment units.
模組化外殼210可包括具有與部署端214 (例如一前端)對置之一轉換端212 (例如一後端)之一本體(例如外殼)。部署端214可類似於本文中所討論之任何部署端或具有與其類似之態樣及/或組件。轉換端212可類似於本文中所討論之任何手柄或具有與其類似之態樣及/或組件。部署端214可界定模組化外殼210之本體中之一前開口。轉換端212可界定模組化外殼210之本體中之一後開口。轉換端212可界定模組化外殼210之本體中之一底部開口。轉換端212可界定模組化外殼210之本體中之一後開口及一底部開口兩者。
在各種實施例中,模組化外殼210可包括具有一對對置側壁211之一大致八邊形形狀。儘管模組化外殼210被展示成包括一大致八邊形形狀,但可使用及預期任何適合形狀。In various embodiments, the
部署端214及轉換端212可界定一機架213。機架213可界定穿過模組化外殼210之本體之一開口(例如部署端214可與轉換端212流體連通)。模組化外殼210之本體可界定部署端214與轉換端212之間的機架213。機架213可經構形以接收及裝載(例如,準備部署射彈、彈射部署單元等等)一或多個部署單元。就此而言,機架213 (及模組化外殼210之大致形狀)可經定大小及塑形以接收及容置一或多個部署單元。The
機架213可經構形以自外部模組化外殼210接收一或多個部署單元。機架213及模組化外殼210可經構形以自各種不同輸入及構件接收一或多個部署單元。機架213可自部署端214及/或轉換端212接收部署單元。機架213可自一手動插入接收一或多個部署單元。機架213亦可自經構形以提供一或多個部署單元之一第二外殼接收一或多個部署單元。
作為一實例,且根據各種實施例,機架213可經構形以自部署端214接收一或多個部署單元。一或多個部署單元可插入至部署端214中且載入機架213中。一或多個部署單元可經手動插入至部署端214中。一部署單元可自部署端214部署一或多個射彈。一部署單元可自部署端214彈射。就此而言,部署端214可經構形以接收一部署單元,允許自部署單元部署射彈,且允許彈射部署單元。As an example, and according to various embodiments,
作為一進一步實例,且根據各種實施例,機架213可經構形以自轉換端212接收一或多個部署單元。機架213可經構形以自轉換端212之一底部或轉換端212之一後部接收一或多個部署單元。一或多個部署單元可被插入至轉換端212中且載入機架213中。一或多個部署單元可經手動插入至轉換端212中。一或多個部署單元可自一第二外殼提供至轉換端212。例如,第二外殼可包括經構形以自轉換端212之一底部提供一或多個部署單元至一底部饋送彈匣。例如,第二外殼可包括經構形以自轉換端212之一後部提供一或多個部署單元之一側饋送彈匣、一後饋送彈匣、一尾托彈匣或其類似者。As a further example, and in accordance with various embodiments,
在各種實施例中,對置側壁211之一或兩者可包括一導引通道218。導引通道218可界定各自對置側壁211中之一開口,大致沿模組化外殼210之長度。就此而言,導引通道218可與機架213及/或部署端214及/或轉換端212之一或多者流體連通。導引通道218可經定大小及塑形以接收一梭動機構之一橫桿(例如,梭動機構234之橫桿254)。導引通道218可經定大小及塑形以使一梭動機構之一橫桿能夠被操作(例如平移)至一第一位置及一第二位置,如本文中將進一步詳細討論。In various embodiments, one or both of the opposing
在各種實施例中,對置側壁211之一或兩者可包括基於一部署定向之導引通道218。例如,一右手使用者可通常使用使用者之慣用右手來固持MCEW 200之一手柄且可使用使用者之非慣用左手來操作導引通道218中之橫桿。就此而言,僅對置側壁211之一者(例如一第一對置側壁、一左對置側壁等等)可包括導引通道218(例如一右手定向)。In various embodiments, one or both of the opposing
作為一進一步實例,一左手使用者可通常使用使用者之慣用左手來固持MCEW 200之一手柄且可使用使用者之非慣用右手來操作導引通道218中之橫桿。就此而言,僅對置側壁211之一者(例如一第二對置側壁、一右對置側壁等等)可包括導引通道218(例如一左手定向)。As a further example, a left-handed user may typically use the user's left hand to hold a handle of the
作為一進一步實例,MCEW 200可包括一左右靈巧定向。就此而言,對置側壁211之各者可包括導引通道218(例如,一第一對置側壁包括一第一導引通道且一第二對置側壁包括一第二導引通道)。就此而言,MCEW 200可由一使用者使用使用者之任一隻手(或兩隻手)來操作。As a further example,
在各種實施例中,模組化外殼210可包括一安裝表面204。安裝表面204可經構形以將模組化外殼210至少部分地耦合(或幫助耦合)至一平台、系統、設備、附接件、手柄及/或其類似者(統稱「一物件」)。例如,且根據各種實施例,安裝表面204可包括一導軌介面系統、一配件導軌或其類似者(例如,一MCEW導軌介面),諸如一韋佛式導軌、一皮卡汀尼式導軌(例如,MIL-STD-1913導軌、STANAG 2324導軌等等)或其類似者。就此而言,安裝表面204可經構形以與一平台、系統、設備、附接件、手柄及/或其類似者上之一對應導軌介面系統、配件導軌或其類似者介接。安裝表面204可經構形以與對應導軌介面系統、配件導軌或其類似者介接以將MCEW可移除地耦合至平台、系統、設備、附接件、手柄及/或其類似者。作為一進一步實例,且根據各種實施例,安裝表面204可經構形以耦合至一導軌介面系統、一配件導軌或其類似者。In various embodiments, the
在各種實施例中,模組化外殼210可包括一配件埠215 (例如一前向介面)。配件埠215可界定模組化外殼210之本體中之一開口。配件埠215可在模組化外殼210之一底部上界定模組化外殼210之本體中之一開口,與安裝表面204對置。配件埠215可在各對置側壁211之間的模組化外殼210之一底部上之界定模組化外殼210之本體中之一開口。就此而言,配件埠215可與機架213及/或轉換端212及部署端214之一或多者流體連通。In various embodiments, the
配件埠215可經定大小及塑形以接收一配件、附接件、觸發器總成或其類似者,如本文中將進一步討論。就此而言,配件埠215可經構形以接收或可移除地附接至複數個可互換元件(例如配件、前向元件等等)。配件埠215可包括用於使模組化外殼210能夠耦合至一配件、附接件、觸發器總成或其類似者之結構特徵。在各種實施例中,配件埠215可定位於模組化外殼210上靠近裝載且準備好部署之一部署單元之一位置。就此而言,配件埠215可使一配件、附接件、觸發器總成或其類似者能夠經由配件埠215與部署單元介接。
在各種實施例中,模組化外殼210 (或MCEW 200)可包括用於幫助準確地部署來自一部署單元之射彈之一系統或設備(例如一瞄準系統、一瞄準設備等等)。例如,且如圖4A及圖4B中所描繪,模組化外殼210可包括一瞄準設備207。瞄準設備207可耦合至模組化外殼210之一外表面。例如,瞄準設備207可耦合至模組化外殼210之一頂面。瞄準設備207可耦合至靠近部署端214之模組化外殼210之一頂面。瞄準設備207可至少部分地耦合至安裝表面204。瞄準設備207可耦合至靠近安裝表面204之模組外殼210之一頂面。瞄準設備207可包括用於幫助瞄準MCEW 200之一瞄準器、一對瞄準器(例如,一前瞄準器及一後瞄準器)、一望遠鏡瞄準器(例如一觀測設備、一光學瞄準裝置等等)、一紅點瞄準器、一全像瞄準器、一夜視瞄準器、一光纖瞄準器及/或任何其他適合或所要系統或設備。In various embodiments, modular housing 210 (or MCEW 200) may include a system or device (eg, a targeting system, a targeting device, etc.) for assisting in accurate deployment of projectiles from a deployment unit. For example, and as depicted in FIGS. 4A and 4B , the
在各種實施例中,瞄準設備207可包括耦合至MCEW 200之不同結構之複數個瞄準設備。例如,瞄準設備207可包括一前瞄準器207-1及一後瞄準器207-2 (例如,如圖3中所描繪)。前瞄準器207-1可耦合至模組化外殼210之一外表面,諸如(例如)鄰近部署端214及對置轉換端212之模組化外殼210之一頂部。後瞄準器207-2可耦合至一第二結構遠端模組化外殼210之一外表面,例如手柄270。前瞄準器207-1可與後瞄準器207-2共線(例如,回應於模組化外殼210耦合至第二結構)。例如,後瞄準器207-2可界定一「U」形空隙、一「V」形空隙或一類似矩形空隙。在MCEW 200之操作中,一使用者可在後瞄準器207-2之空隙內視覺對準前瞄準器207-1以確保射彈被準確地部署。In various embodiments, targeting
在各種實施例中,模組化外殼210可包括一後轉換連接器(例如轉換配接器222)。後轉換連接器可包括轉換端212之一部分。例如,後轉換連接器可包括或界定轉換端212之一後開口及/或轉換端212之一底部開口。後轉換連接器可經構形以可移除地附接至複數個可互換握把。後轉換連接器可經構形以可移除地附接至複數個可互換第二外殼。In various embodiments, the
在各種實施例中,且再次參考圖3,前握把216可經構形以耦合至鄰近部署端214及/或模組化外殼210上之任何其他適合位置中之模組化外殼210之一前向區域。例如,前握把216可經構形以經由配件埠215連接至模組化外殼210。耦合至模組化外殼210可包含前握把216至少部分地插入配件埠215內。In various embodiments, and referring again to FIG. 3 , the
在各種實施例中,在MCEW 200之操作期間,前握把216可由一使用者接觸、固持、操作或其類似者。就此而言,前握把216可包括經塑形以適合一使用者之手之輪廓,例如一符合人體工程學之握把。前握把216亦可包括任何適合塗層、保護層或其類似者。例如,前握把216可包括一防滑表面、抓握墊或其類似者。作為一進一步實例,前握把216可根據期望包繞於皮革、一彩色印刷品及/或任何其他適合材料中。作為一進一步實例,前握把216可包括經構形以幫助一使用者操作、固持、抓握等等前握把216之一系列脊或類似結構。In various embodiments, the
在各種實施例中,前握把216可包括經構形以使一使用者能夠與MCEW 200互動之一或多個組件。例如,前握把216可包括一觸發器217、一雷射瞄準器219及/或任何其他適合或所要機械或電子組件。In various embodiments, the
觸發器217可安置於前握把216內。前握把216可經構形以保護觸發器217免於意外實體接觸(例如,觸發器217之一意外啟動)。觸發器217可類似於本文中所討論之任何觸發器或具有與其類似之態樣及/或組件。觸發器217耦合至前握把216之一外表面,且可經構形以在施加實體接觸之後即移動、滑動、旋轉或依其他方式被實體下壓或移動。例如,觸發器217可被由一使用者施加至觸發器217之實體接觸致動。觸發器217可包括一機械或機電開關、按鈕、觸發器或其類似者。例如,觸發器217可包括一開關、一推鈕及/或任何其他適合類型之觸發器。觸發器217可機械地、電子地或電性地耦合至一部署單元(例如,裝載於模組化外殼210之機架213中且準備好部署之一部署單元)。例如,觸發器217可經由配件埠215耦合至部署單元或與其通信。回應於觸發器217被啟動(例如,由使用者下壓、推動等等),觸發器217可與部署單元通信以引起來自部署單元之一或多個射彈之部署及/或一刺激信號透過射彈之提供。回應於下一部署單元被載入模組化外殼210之機架213中,觸發器217可機械地、電子地或電性地耦合至下一部署單元(例如,經由配件埠215)。
雷射瞄準器219可安置於前握把216內。雷射瞄準器219可類似於本文中所討論之任何其他雷射或雷射瞄準器或具有與其類似之態樣及/或組件。雷射瞄準器219可經構形以幫助使來自模組化外殼210中之一部署單元之射彈之部署朝向一目標準確地對準。雷射瞄準器219可包括任何適合或所要數目個雷射瞄準器。雷射瞄準器219可透過前握把216之一外表面安置。雷射瞄準器219可回應於前握把216耦合至模組化外殼210而在至少部分地與模組化外殼210之部署端214對準之一方向上定向。雷射瞄準器219可經構形以啟動以產生一瞄準雷射。例如,雷射瞄準器219可包括經構形以啟動雷射瞄準器219之一觸發器、開關、按鈕或其類似者。作為一進一步實例,前握把216可包括經構形以回應於使用者施加壓力或固持前握把216而啟動雷射瞄準器219之一壓力開關。雷射瞄準器219可包括任何適合雷射輸出組件。在各種實施例中,雷射瞄準器219可包括一戰術手電筒、頻閃燈或類似發光組件。The
在各種實施例中,模組化外殼210可經構形以接收、容置、裝載、引起來自一或多個部署單元之射彈之部署及/或彈射一或多個部署單元,如本文中將進一步討論。例如,且參考圖15A及圖15B,用於一MCEW之一部署單元可包括一部署單元220。部署單元220可類似於本文中所討論之任何部署單元(例如,簡要參考圖1之部署單元20、簡要參考圖2A至圖2D之部署單元120-1或120-2)或具有與其類似之態樣及/或組件)。In various embodiments, the
部署單元220可包括一外殼221 (例如一部署單元外殼221)。外殼221可經構形以至少部分地圍封部署單元220之一或多個組件。外殼221可界定一或多個內孔223。各內孔223可界定外殼221之一前向表面上之一開口且可經構形以在部署射彈227之前至少部分地容置一射彈227。
部署單元220可包含發射射彈、透過射彈提供一刺激信號及/或回應於部署單元自MCEW彈射而繼續提供刺激信號所需之所有組件。例如,部署單元220可包括一電源、一信號產生器及電路系統(圖中未描繪)。電源、信號產生器及電路系統可類似於本文中所描述之任何電源、信號產生器或電路系統。部署單元220亦可包括一或多個推進系統(圖中未描繪)及複數個射彈227 (例如,在圖15B中描繪為包含至少一第一射彈227-1及一第二射彈227-2)。推進系統可類似於本文中所討論任何推進系統(例如,推進系統25,簡要參考圖1)或具有與其類似之態樣及/或組件。推進系統可耦合至一或多個射彈227或與其通信。推進系統可經構形以提供用於部署一或多個射彈227之一推進力。推進系統之啟動可由觸發器217 (簡要參考圖3)之操作控制,如本文中所討論。例如,回應於一觸發啟動,一或多個推進系統可引起來自部署單元220之一或多個射彈227之部署(例如,如圖15B中所描繪)。回應於一或多個射彈227之觸發啟動或部署,部署單元220之信號產生器可透過一或多個射彈227提供一刺激信號,如本文中先前所討論。The
射彈227可類似於本文中所討論之任何射彈、電極、飛鏢或類似設備(例如射彈27、28,簡要參考圖1)或具有與其類似之態樣及/或組件。部署單元220可包括任何適合或所要數目個射彈227,諸如(例如) 2個射彈、3個射彈、9個射彈、12個射彈、18個射彈及/或其類似者。各射彈227可包括任何適合類型之射彈。例如,一或多個射彈227可為或包含一電極(例如一電極飛鏢)。一電極可包含經構形以刺穿或附接鄰近一目標之一組織以在電極與組織之間提供一導電路徑之一矛頭,如本文中先前所討論。射彈227可由接收自部署單元220之一或多個推進系統之一或多個推進力發射。
在各種實施例中,部署單元220可包括一或多個結構特徵,其等經構形以幫助部署單元220由一MCEW (例如,一MCEW之一模組化外殼)接收,載入一MCEW中(例如,準備用於部署射彈),自一MCEW彈射及/或其類似者。例如,外殼221可經定大小及塑形以接收及容置於一MCEW之一模組化外殼中。外殼221可包括一或多個溝槽252。各溝槽252可界定大體沿外殼221之長度安置之一通道。溝槽252可經構形以與一MCEW中之一梭動機構相互作用。梭動機構與部署單元220之一或多個溝槽252之間的相互作用可允許梭動機構擷取、載入及/或彈射部署單元220,如本文中將進一步討論。就此而言,各溝槽252可經定大小及塑形以接收梭動機構之至少一部分以允許梭動機構與部署單元220介接。In various embodiments,
溝槽252可包括具有不同尺寸之一或多個部分。例如,溝槽252可包括具有不同深度(例如,自外殼221之一外表面量測至各自溝槽部分之一內表面)之一或多個部分。例如,溝槽252可包括一第一溝槽部分252-1及一第二溝槽部分252-2。第二溝槽部分252-2可包括大於第一溝槽部分252-1之一深度。The
在各種實施例中,各溝槽部分252-1、252-2可經構形以不同地與梭動機構介接。例如,且如本文中所進一步討論,第一溝槽部分252-1可經定大小及塑形以與一梭動機構之一彈簧臂介接(例如,接收、接合等等)。一梭動機構之一「左側」彈簧臂可與一「左側」第一溝槽部分252-1介接且梭動機構之一「右側」彈簧臂可與一「右側」第一溝槽部分252-1介接。(若干)彈簧臂與一或多個第一溝槽部分252-1之間的介接可使梭動機構能夠擷取、載入及彈射部署單元220。(若干)彈簧臂與一或多個第一溝槽部分252-1之間的介接亦可在MCEW之一模組化外殼內至少部分地定向部署單元220。在模組化外殼內至少部分地定向部署單元220可使部署單元220能夠準確地部署來自部署單元220之射彈227且使部署單元220能夠自模組化外殼彈射。In various embodiments, each groove portion 252-1, 252-2 may be configured to interface with the shuttle mechanism differently. For example, and as discussed further herein, the first groove portion 252-1 may be sized and shaped to interface (eg, receive, engage, etc.) with a spring arm of a shuttle mechanism. A "left side" spring arm of a shuttle mechanism can interface with a "left side" first groove portion 252-1 and a "right side" spring arm of the shuttle mechanism can interface with a "right side" first groove portion 252 -1 for interfacing. The interface between the spring arm(s) and the one or more first groove portions 252 - 1 may enable the shuttle mechanism to capture, load, and eject the
作為一進一步實例,且如本文中所進一步討論,第二溝槽部分252-2經量定大小及塑形以與一梭動機構之一彈簧臂及一卡掣介接(例如,接收、接合等等)。梭動機構之一「左側」彈簧臂及梭動機構之一「右側」彈簧臂可各包括徑向向內延伸以界定卡掣之一機械結構(例如,一「左側」卡掣及一「右側」卡掣)。卡掣之各機械結構可與一相關聯第二溝槽部分252-2接合(例如,左側卡掣接合一「左側」第二溝槽部分252-2且右側卡掣接合一「右側」第二溝槽部分252-2)。卡掣與一或多個第二溝槽部分252-2之間的介接可使梭動機構能夠接合部署單元220且使部署單元220在MCEW之模組化外殼內移動。As a further example, and as discussed further herein, the second groove portion 252-2 is sized and shaped to interface with a spring arm and a latch of a shuttle mechanism (eg, to receive, engage, and many more). One "left" spring arm of the shuttle mechanism and one "right" spring arm of the shuttle mechanism may each include a mechanical structure extending radially inward to define the catch (eg, a "left" catch and a "right" catch). "Clamp). The mechanical structures of the latches can be engaged with an associated second groove portion 252-2 (eg, the left latch engages a "left" second groove portion 252-2 and the right latch engages a "right" second groove portion 252-2). groove portion 252-2). The interface between the detents and the one or more second groove portions 252-2 may enable the shuttle mechanism to engage and move the
在各種實施例中,第一溝槽部分252-1與第二溝槽部分252-2之間的深度差可在第一溝槽部分252-1與第二溝槽部分252-2之間產生一凸緣或類似實體結構。卡掣可緊靠(例如,接觸、接合等等)凸緣以完成卡掣與一或多個第二溝槽部分252-2之介接。就此而言,卡掣可緊靠凸緣以保持部署單元220在自卡掣之一向後方向上移動。第二溝槽部分252-2可與凸緣對置打開(例如,如圖15中所描繪)使得部署單元220可在卡掣不接觸凸緣之情況下(例如,在部署單元220自一MCEW彈射期間)在一向前方向上移動。In various embodiments, a depth difference between the first trench portion 252-1 and the second trench portion 252-2 may be created between the first trench portion 252-1 and the second trench portion 252-2 A flange or similar solid structure. The catches may abut (eg, contact, engage, etc.) the flanges to complete the interfacing of the catches with the one or more second groove portions 252-2. In this regard, the catches may abut the flanges to keep the
在各種實施例中,且再次參考圖3,梭動機構234可安置於模組化外殼210內(例如,在模組化外殼210之機架213內)。梭動機構234可與機架213連通。梭動機構234可經構形以在模組化外殼210內移動部署單元。例如,梭動機構234可收回一部署單元,將部署單元移動至一發射位置中,及/或自模組化外殼210之部署端214彈射部署單元。梭動機構234可經構形以自一第一位置移動(例如,操作、平移等等)至一第二位置。在第一位置中,梭動機構234可向前橫移(例如,如圖6A至圖6C、圖7A及圖7B、圖8A及圖8B及圖11A及圖11B中所展示)。在第一位置中,梭動機構234可與一第一(或前)部署單元接合。在第二位置中,梭動機構234可向後橫移(例如,如圖9A及圖9B及圖10A至圖10C中所展示)。在第二位置中,梭動機構234可自第一(或前)部署單元脫離,且與第二(或後)部署單元接合。In various embodiments, and referring again to FIG. 3, the
如本文中所進一步討論,機架213可經構形以容納(例如,接收、儲存、容置等等)一或多個部署單元,諸如一前向部署單元(例如第一部署單元)及一後部署單元(例如第二部署單元)。梭動機構234可經構形以在自前向部署單元部署射彈期間接合前向部署單元。梭動機構234可經構形以接合後部署單元且迫使後部署單元向前。後部署單元向前移動可迫使前向部署單元向前且離開模組化外殼210之部署端214 (例如,彈射前向部署單元)。As discussed further herein,
在各種實施例中,梭動機構234可包括一梭子236、一前向坡道239、一梭動彈簧240及一梭桿242。梭動機構234可駐留於外殼210內。在各種實施例中,梭子236可包括一上部244及界定梭子236之一下部之一對臂246。上部244及臂246可經構形以在模組化外殼210內導引梭動機構234。In various embodiments, the
前向坡道239位於上部244之一前向表面附近。例如,前向坡道239可包括自上部244之前向表面向前延伸之一結構。前向坡道239可包括一楔形或三角形形狀及/或任何其他適合形狀。在梭動機構234之操作期間,前向坡道239可經構形以控制一前向匣止動件之操作。在MCEW 200之操作期間,前向匣止動件用於將一部署單元含於梭動機構234內。例如,前向匣止動件可經構形以接觸(例如,介接、接合等等)部署單元之一前向表面。就此而言,前向匣止動件可經構形以回應於前向匣止動件經定位成接觸部署單元而防止部署單元在一向前方向上移動。
例如,根據各種實施例且參考圖3、圖8A至圖8C及圖10A至圖10C,前向坡道239可經構形以接觸及/或控制安置於模組化外殼210內之一前向匣止動件238。前向匣止動件238可包括耦合至模組化外殼210之一內表面且自其徑向向內延伸之一結構。前向匣止動件238可耦合至靠近部署端214之模組化外殼210之一內表面。前向匣止動件238可包括一樞軸點237。前向匣止動件238可圍繞樞軸點237樞轉(例如旋轉、向上偏置、向下偏置等等)。前向匣止動件238及/或樞軸點237可被彈簧載入。在一不受干擾狀態中(例如,回應於梭動機構234處於第二位置中而不與前向坡道239接觸),前向匣止動件238可被向上偏置(例如,如圖10A至圖10C中所描繪)。在不受干擾狀態中,前向匣止動件238可接觸一樞軸止動件241。樞軸止動件241可自模組化外殼210之一內表面徑向向內延伸。樞轉止動件241經量定大小及塑形以在不受干擾狀態中接觸前向匣止動件238以至少部分地阻止前向匣止動件238在一進一步向上方向上樞轉。樞軸止動件241亦可經構形以將前向匣止動件238定位於用於接收前向坡道239之一位置中。For example, according to various embodiments and with reference to FIGS. 3, 8A-8C, and 10A-10C, the
在一受干擾狀態中(例如,回應於梭動機構234處於第一位置中而接觸前向坡道239及/或自其向前偏置),前向匣止動件238可被向下偏置(例如,如圖8A至圖8C中所描繪)。例如,樞軸點237可包括具有用於前向坡道239之一互補表面之一楔形或三角形形狀。回應於前向坡道239接觸樞軸點237之互補表面或提供抵靠其之一向前偏置,前向匣止動件238可在一向下方向上樞轉以接觸一部署單元之一前向表面。前向匣止動件238可包括經構形以接觸及/或至少部分地保持一部署單元之一閂鎖或類似組件。In a disturbed state (eg, in response to
再次具體參考圖3,梭動機構234之臂246可各包括向後延伸之一彈簧臂248。彈簧臂248可向內偏置且可包括(或界定)一卡掣250。彈簧臂248及/或卡掣250可經構形以接合一部署單元之側面中之溝槽(例如,如圖7B、圖9B及圖11B中所展示)。例如,彈簧臂248可各與部署單元之任一側上之一溝槽或一第一溝槽部分接合或介接。彈簧臂248可經構形以將部署單元保持及定向於梭動機構234及/或模組化外殼210內。例如,臂246及/或彈簧臂248可界定經構形以接收一部署單元之一空腔。Referring again specifically to FIG. 3 , the
卡掣250可包括在各彈簧臂248上向內延伸(或向內偏置)之一機械結構。卡掣250可經構形以與部署單元上之一溝槽、一第二溝槽部分或溝槽之一凸緣接合或介接以幫助將部署單元保持於梭動機構234及/或模組化外殼210內。卡掣250可經構形以與部署單元上之一溝槽接合或介接以防止(至少部分地)部署單元在一向上、向下或向後方向上移動。The
就此而言,回應於一前向匣止動件接觸一部署單元之一前向表面且卡掣250接觸部署單元之一溝槽,部署單元可完全保持於梭動機構234內。In this regard, the deployment unit can be fully retained within the
在各種實施例中,一或多個橫桿254 (例如,外部橫桿)可耦合至梭動機構234之一或多個臂246或自其向外懸垂。橫桿254可由任何適合附接方法附接至梭子236。在一個實施例中,橫桿254由一對螺釘256附接至梭子236。當梭子236自一第一位置(向前橫移)移動至一第二位置(向後橫移)時,橫桿254用於在操作期間導引梭子236。就此而言,橫桿254可經構形以促進梭動機構234移動。In various embodiments, one or more rails 254 (eg, outer rails) may be coupled to or depend outwardly from one or
橫桿254可接收於外殼210中之導引通道218內。耦合至臂246之數個橫桿254可取決於MCEW 200之一部署定向,如先前所討論。例如,在一右手定向中,僅一個對置側壁211 (例如一第一對置側壁、一左對置側壁等等)可包括導引通道218 (例如一右手定向)。梭動機構234可包括經構形以透過導引通道218被接收之一相關聯橫桿254 (例如一左手橫桿、一右手定向MCEW等等)。作為一進一步實例,在一左手定向中,僅一個對置側壁211 (例如一第一對置側壁、一左對置側壁等等)可包括導引通道218 (例如一右手定向)。梭動機構234可包括經構形以透過導引通道218被接收之一相關聯橫桿254 (例如一右手橫桿、一左手定向MCEW等等)。作為一進一步實例,在一左右靈巧定向中,對置側壁211之各者可包括導引通道218 (例如,一第一對置側壁包括一第一導引通道且一第二對置側壁包括一第二導引通道)。梭動機構234可包括兩個相關聯橫桿254,各橫桿254經構形以透過一各自導引通道218被接收(例如,一第一橫桿被接收於一第一導引通道中且一第二橫桿被接收於一第二導引通道中)。就此而言,MCEW 200可由一使用者使用使用者之任一隻手(或兩隻手)操作。The
橫桿254可經定大小、塑形及/或構形以由一使用者操作。例如,橫桿254可包括一握把、一防滑表面或塗層、一滾花表面或其類似者以幫助一使用者固持及操作橫桿254。The
在各種實施例中,梭桿242之一前端可插入穿過位於梭子236之上部244之一後表面上之一孔隙258。梭桿242之前端可接觸位於鄰近部署端214之模組化外殼210之一內部中之一前向止動件(圖中未描繪)。梭桿242之一後端可接觸一後止動件。後止動件可位於模組化外殼210之內部中鄰近轉換端212 (圖中未描繪)。在其他實施例中,後止動件可位於一轉換配接器、一手柄或其他附接件中。In various embodiments, a front end of the
梭子236可經構形以在梭桿242上向前及向後平移。就此而言,梭桿242可作用類似於經構形以允許梭子236在MCEW 200之操作期間自第一位置移動至第二位置之一軌道。梭動彈簧240可定位於梭桿242之前端與後端之間的梭桿242上。梭動彈簧240可抵靠梭子236之上部244偏置,鄰近孔隙258。就此而言,梭動彈簧240可在MCEW 200之操作期間對梭子236施加一力以向前偏置梭動機構234 (例如,偏置至第一位置中),同時仍允許梭動機構234在操作期間被操作至第二位置中。
在各種實施例中,一轉換配接器可經構形以允許模組化外殼210在不同定向上接收來自各種不同來源(例如第二外殼)之部署單元,如本文中將進一步討論。就此而言,轉換配接器可經構形以允許模組化外殼210在無需對模組化外殼210進行改變之情況下接收來自不同來源或定向之部署單元。轉換配接器可在一第一端處鄰近模組化外殼210之轉換端212耦合至模組化外殼210。轉換配接器可在一第二端處耦合至一手柄或握把,諸如手柄270。轉換配接器可經構形以轉換轉換端212以自轉換端212中之一後開口、轉換端212中之一底部開口及/或轉換端212中之後開口及底部開口兩者接收部署單元。例如,轉換配接器可經構形以轉換轉換端212以自一底部饋送彈匣、一尾托彈匣及/或任何其他適合或所要第二外殼接收部署單元。In various embodiments, a conversion adapter can be configured to allow the
例如,根據各種實施例且參考圖3及圖5A,轉換配接器222可經構形以允許模組化外殼210自一底部饋送彈匣接收部署單元。轉換配接器222可包括經構形以將轉換配接器222耦合至一手柄或一第二物件或結構(諸如手柄270)之一手柄端225。與手柄端225對置之轉換配接器222之一前端可經構形以耦合至模組化外殼210之轉換端212。For example, according to various embodiments and with reference to Figures 3 and 5A, the
在各種實施例中,轉換配接器222可包括一彈匣室配接器224。彈匣室配接器224可包括經構形以接收一底部饋送彈匣之結構及開口。例如,彈匣室配接器224及模組化外殼210之轉換端212在耦合時協作以形成一彈匣室226 (簡要參考圖9A)。彈匣室226可界定MCEW 200之一下側上之一開口,共同包括模組化外殼210下側中之一開口及轉換配接器222之下側中之一開口。彈匣室226可經定大小及塑形以經由彈匣室226接收部署單元。彈匣室226可經構形以接收一底部饋送彈匣且自底部饋送彈匣接收一或多個部署單元。In various embodiments, the
例如,且根據各種實施例,彈匣室226可經構形以接受諸如一底部饋送彈匣228之一底部饋送彈匣(例如,參考圖6A至圖6C、圖7A及圖7B,及圖8A至圖8C)。底部饋送彈匣228可耦合至彈匣226,使得底部饋送彈匣228之至少一部分插入至轉換配接器222中。轉換配接器222可包括一彈匣釋放器232-1及一彈匣閂鎖232-2,其經構形以可釋放地保持底部饋送彈匣228。彈匣閂鎖232-2可包括經構形以回應於底部饋送彈匣228被插入至彈匣室226中而干擾或接合底部饋送彈匣228之一外表面之一閂鎖或類似保持構件。彈匣釋放器232-1可包括與彈匣閂鎖232-2連接之一開關、按鈕、彈簧載入機構或其類似者。回應於彈匣釋放器232-1被啟動(例如下壓、切換、拉動、按壓等等),彈匣閂鎖232-2可停止與底部饋送彈匣228接合或干擾以允許底部饋送彈匣228可釋放地脫離轉換配接器222。For example, and according to various embodiments, the
底部饋送彈匣228可經構形以向模組化外殼210提供一或多個部署單元。底部饋送彈匣228可經構形以接收任何適合或所要數目個部署單元220,諸如(例如) 1個部署單元、2個部署單元、3個部署單元等等。底部饋送彈匣228可包括經構形以將部署單元向上及/或垂直地偏置至鄰近轉換端212之模組化外殼210中之彈匣室226中的一彈簧230。例如,回應於底部饋送彈匣228定位於彈匣室226中,彈簧230可將一第一部署單元偏置至彈匣室226中,使得第一部署單元至少部分地容置於模組化外殼210及轉換配接器222中。第一部署單元可至少部分地容置於模組化外殼210中在其中梭動機構234可接合第一部署單元以載入第一部署單元之一位置中,如本文中將進一步討論(例如,使第一部署單元準備好用於部署一或多個射彈)。
在各種實施例中,且再次參考圖3,手柄270可經構形以允許一使用者固持及/或操作MCEW 200。手柄270可耦合至轉換配接器222。任何類型之握把、手柄、延伸件等等可用於變動MCEW 200之佈局以允許一使用者客製化MCEW 200。例如,手柄270可包括通常在手槍、步槍、半自動武器及其類似者上發現之任何適合或所要手柄、握把、附接件及/或耦合機構。In various embodiments, and referring again to FIG. 3 , handle 270 may be configured to allow a user to hold and/or operate
在各種實施例中,梭動機構234可經構形以自圖6A至圖6C、圖7A及圖7B、圖8A及圖8B及圖11A及圖11B中所展示之一第一位置(向前橫移)移動至如圖9A及圖9B及圖10A至圖10C中所展示之一第二位置(向後橫移)。In various embodiments, the
在操作中,底部饋送彈匣228可經載入至彈匣室226中。在載入底部饋送彈匣228時,彈簧230將一第一部署單元垂直或向上自動偏置至彈匣室226中。梭動機構234可經操作至第二位置(向後橫移)中。在第二位置中,彈簧臂248及/或卡掣250接合部署單元之側上之溝槽。梭動機構234可經操作至第一位置(向前橫移)中。在第一位置中,部署單元準備發射。當梭動機構234處於第一位置(向前橫移)中時,在第一部署單元向前移動至模組化外殼210中之後,底部饋送彈匣228中之彈簧230即將一第二部署單元垂直或向上偏置至彈匣室226中(例如,如圖8B中所描繪)。In operation, the
觸發器217之一啟動可引起部署單元220部署一或多個射彈。當梭動機構234處於第一位置(向前橫移)中時,可部署一或多個射彈。當梭動機構234處於第一位置中且前向坡道239與前向匣止動件238接觸時,前向匣止動件238可經向下偏置以使部署單元220保持於模組化外殼210內。觸發器217可接收後續啟動以基於部署單元中之可用射彈之數目來部署進一步射彈。回應於梭動機構234經操作至第二位置(向後橫移),第一部署單元可自模組化外殼210之部署端214彈射。例如,如圖9A及圖9B中所展示,回應於梭動機構234經操作至第二位置,彈簧臂248及/或卡掣250可脫離第一部署單元上之溝槽且可接合第二部署單元之側上之溝槽。如圖10A至圖10C中所展示,一旦梭動機構234處於第二位置(向後橫移)中,前向匣止動件238即脫離第一部署單元之前部。回應於梭動機構234返回至第一位置(向前橫移)之操作,如圖11A及圖11B中所展示,第二部署單元可接觸第一部署單元以引起第二部署單元自模組化外殼210之部署端214彈射。彈簧臂248及/或卡掣250可與第二部署單元之溝槽接合。前向坡道239可與前向匣止動件238接觸以引起前向匣止動件238向下偏置以接觸第二部署單元之一前表面。就此而言,第二部署單元準備好部署,且來自底部饋送彈匣228之下一部署單元可偏置至彈匣室226中。Activation of one of the
在各種實施例中,且參考圖12A至圖14B,揭示一例示性MCEW 900。MCEW 900可類似於本文中所討論之任何CEW或具有與其類似之態樣及/或組件,包含(但不限於) CEW 1、MCEW 100及MCEW 200 (簡要參考圖1、圖2A至圖2D及圖3)。為簡潔起見,可在下文描述MCEW 900時省略(部分或全部)本文中先前所描述之CEW之冗餘特性或元件。儘管未在圖12A至圖14B中全部展示,但MCEW 900含有類似於上文針對CEW 1、MCEW 100及/或MCEW 200描述之組件之組件。In various embodiments, and with reference to Figures 12A-14B, an
在各種實施例中,MCEW 900可包括一模組化外殼910、一梭動機構(圖中未描繪)、一轉換配接器922、一前握把916及/或一尾托彈匣928之一或多者。MCEW 900可包括或含有一或多個部署單元。梭動機構可至少部分地安置於模組化外殼910內。轉換配接器922可耦合至模組化外殼910,且可經構形以允許模組化外殼910與尾托彈匣928介接以接收一或多個部署單元。前握把916可耦合至模組化外殼910。In various embodiments,
在各種實施例中,模組化外殼910可類似於本文中所討論之任何外殼或具有與其類似之態樣及/或組件。模組化外殼910可類似於模組化外殼210或具有與其類似之態樣及/或組件。模組化外殼910 (例如一部署外殼、一主要外殼等等)可經構形以接收及容置一或多個部署單元。模組化外殼910可經構形以允許一部署單元部署來自部署單元之一或多個射彈。模組化外殼910可經構形以允許部署單元自模組化外殼910彈射。模組化外殼910可經構形以允許接收下一部署單元且允許部署一或多個下一射彈。In various embodiments, the
模組化外殼910可包括具有與一部署端914對置之一轉換端912之一本體。部署端914可類似於本文中所討論之任何部署端或具有與其類似之態樣及/或組件。轉換端912可類似於本文中所討論之任何轉換端或具有與其類似之態樣及/或組件。部署端914可界定模組化外殼910之本體中之一前開口。轉換端912可界定模組化外殼910之本體中之一後開口。轉換端912可界定模組化外殼910之本體中之一底部開口。轉換端912可界定模組化外殼910之本體中之一後開口及一底部開口兩者。
在各種實施例中,模組化外殼910可包括具有一對對置側壁911之一大致八邊形形狀。儘管模組化外殼910經展示為包括一大致八邊形形狀,但應瞭解,可使用及預期任何適合形狀。In various embodiments, the
由對置側壁911分離之部署端914及轉換端912可界定一機架913。機架913可界定穿過模組化外殼910之本體之一開口(例如,部署端914可與轉換端912流體連通)。機架913可經構形以接收及載入(例如,準備好部署射彈、彈射部署單元等等)一或多個部署單元。就此而言,機架913 (及模組化外殼910之大致形狀)經量定大小及塑形以接收及容置一或多個部署單元。機架913可經構形以自外部模組化外殼910 (諸如(例如)自尾托彈匣928)接收一或多個部署單元。The
在各種實施例中,對置側壁911之一或兩者可包括一導引通道918。導引通道918可類似於本文中所描述之任何其他導引通道(例如導引通道218)。導引通道918可界定各自對置側壁911中之一開口,大致沿模組化外殼910之長度。導引通道918可經定大小及塑形以接收一梭動機構之一橫桿(例如一梭動機構之橫桿954)。導引通道918可經定大小及塑形以使一梭動機構之一橫桿能夠被操作(例如平移)至一第一位置及一第二位置,如本文中將進一步詳細討論。In various embodiments, one or both of the opposing
在各種實施例中,對置側壁911之一或兩者可包括基於一部署定向之導引通道918,如本文中將進一步討論。In various embodiments, one or both of the opposing
在各種實施例中,模組化外殼910可包括一安裝表面904。安裝表面904可經構形以將模組化外殼910至少部分地耦合(或幫助耦合)至一平台、系統、設備、附接件、手柄及/或其類似者。例如,且根據各種實施例,安裝表面904可包括(或耦合至)一導軌介面系統974。導軌介面系統974可包括一導軌介面系統、一配件導軌或其類似者(例如一MCEW導軌介面),諸如一韋佛式導軌、一皮卡汀尼式導軌(例如,MIL-STD-1913導軌、STANAG 2324導軌、等等)或其類似者。就此而言,安裝表面904可經構形以與一平台、系統、設備、附接件、手柄及/或其類似者上之一對應導軌介面系統、配件導軌或其類似者介接。安裝表面904可經構形以與對應導軌介面系統、配件導軌或其類似者介接以將MCEW 900可移除地耦合至平台、系統、設備、附接件、手柄及/或其類似者。In various embodiments, the
在各種實施例中,模組化外殼910可包括一配件埠(圖中未描繪)。配件埠可類似於本文種所描述之任何其他配件埠(例如配件埠215,簡要參考圖3)。配件埠可界定模組化外殼910之本體中之一開口且可經定大小及塑形以接收一配件、附接件、觸發器總成或其類似者,如本文中將進一步討論。In various embodiments, the
在各種實施例中,模組化外殼910 (或MCEW 900)可包括用於幫助準確地部署來自一部署單元之射彈之一系統或設備(例如一瞄準系統、一瞄準設備等等)。例如,模組化外殼910可包括一瞄準設備。瞄準設備可類似於本文中所描述之任何其他瞄準設備(例如瞄準設備207,簡要參考圖3)。瞄準設備可耦合至模組化外殼910及/或MCEW 900之一外表面。瞄準設備可包括用於幫助瞄準MCEW 900之一瞄準器、一對瞄準器(例如一前瞄準器及一後瞄準器)、一望遠鏡瞄準器(例如一觀測設備、一光學瞄準裝置等等)、一紅點瞄準器、一全像瞄準器、一夜視瞄準器、一光纖瞄準器及/或任何其他適合或所要系統或設備。例如,瞄準設備可包括一前瞄準器907-1及一後瞄準器907-2。前瞄準器907-1可耦合至模組化外殼910之一外表面,諸如(例如)鄰近部署端914之模組化外殼910之一頂部。後瞄準器907-2可耦合至一第二結構遠端模組化外殼910之一外表面,諸如一尾托彈匣928。前瞄準器907-1可與後瞄準器907-2共線(例如,回應於模組化外殼910耦合至第二結構)。例如,後瞄準器907-2可界定一「U」形空隙、一「V」形空隙或一類似矩形空隙。在MCEW 900之操作中,一使用者可在後瞄準器907-2之空隙內視覺對準瞄準器907-1以確保准確地部署射彈。In various embodiments, modular housing 910 (or MCEW 900) may include a system or device (eg, a targeting system, a targeting device, etc.) for assisting in accurate deployment of projectiles from a deployment unit. For example, the
在各種實施例中,前握把916可經構形以耦合至鄰近部署端914及/或模組化外殼910上之任何其他適合位置中之模組化外殼910之一前向區域。前握把916可類似於本文中所描述之任何其他前握把(例如前握把916,簡要參考圖3)。前握把916可經構形以經由模組化外殼910之配件埠耦合至模組化外殼910。In various embodiments, the
在各種實施例中,前握把916可包括經構形以使一使用者能夠與MCEW 900互動之一或多個組件。例如,前握把916可包括一觸發器917、一雷射瞄準器919及/或任何其他適合或所要機械或電子組件。In various embodiments, the
觸發器917可安置於前握把916內。觸發器917可類似於本文中所討論之任何其他觸發器(例如觸發器217,簡要參考圖3)。觸發器917耦合至前握把916之一外表面,且可經構形以在施加實體接觸之後即移動、滑動、旋轉或依其他方式被實體下壓或移動。觸發器917可包括一機械或機電開關、按鈕、觸發器或其類似者。例如,觸發器917可包括一開關、一推鈕及/或任何其他適合類型之觸發器。觸發器917可機械地、電子地或電性地耦合至一部署單元。回應於觸發器917被啟動(例如,由使用者下壓、推動等等),觸發器917可與部署單元通信以引起來自部署單元之一或多個射彈之部署及/或一刺激信號透過射彈之提供。回應於下一部署單元被載入模組化外殼910之機架913中,觸發器917可機械地、電子地或電性地耦合至下一部署單元。
雷射瞄準器919可安置於前握把916內。雷射瞄準器919可類似於本文中所討論之任何其他雷射或雷射瞄準器(例如雷射瞄準器219,簡要參考圖3)。雷射瞄準器919可穿過前握把916之一外表面安置。雷射瞄準器919可回應於前握把916耦合至模組化外殼910而在至少部分地與模組化外殼910之部署端914對準之一方向上定向。雷射瞄準器919可經構形以啟動以產生一瞄準雷射。例如,雷射瞄準器919可包括經構形以啟動雷射瞄準器919之一觸發器、開關、按鈕或其類似者。作為一進一步實例,前握把916可包括經構形以回應於一使用者施加壓力或固持前握把916而啟動雷射瞄準器919之一壓力開關。雷射瞄準器919可包括任何適合雷射輸出組件。在各種實施例中,雷射瞄準器919可包括一戰術手電筒、頻閃燈或類似發光組件。
在各種實施例中,模組化外殼910可經構形以接收任何適合或所要數目個部署單元,諸如(例如)先前參考圖15A及圖15B所揭示之一部署單元220。In various embodiments, the
在各種實施例中,儘管圖12A至圖14B中未展示,但MCEW 900可包括一梭動機構(類似於上文所討論之梭動機構234),其經構形以將部署單元移動至發射位置中且彈射部署單元(諸如自模組化外殼910之部署端914)。梭動機構可經構形以自一第一位置(向前橫移)移動至一第二位置(向後橫移),如上文所詳細描述。In various embodiments, although not shown in Figures 12A-14B, the
在各種實施例中,梭動機構可包括一梭子、一前向坡道、一梭動彈簧及/或一梭桿。梭動機構可駐留於模組化外殼910內。在各種實施例中,梭子可包括一上部及界定梭子之一下部之一對臂。上部及臂可經構形以在模組化外殼910內導引梭動機構。In various embodiments, the shuttle mechanism may include a shuttle, a forward ramp, a shuttle spring, and/or a shuttle lever. The shuttle mechanism may reside within the
前向坡道位於鄰近上部之一前表面。例如,前向坡道可包括自上部之前表面向前延伸之一結構。前向坡道可包括一楔形或三角形形狀及/或任何其他適合形狀。在梭動機構之操作期間,前向坡道可經構形以控制一前向匣止動件之操作。在MCEW 900之操作期間,前向匣止動件用於在梭動機構內包含一部署單元。例如,前向匣止動件可經構形以接觸(例如介接、接合等等)部署單元之一前表面。就此而言,前向匣止動件可經構形以回應於前向匣止動件經定位成接觸部署單元而防止部署單元在一向前方向上移動。A forward ramp is located adjacent to one of the upper front surfaces. For example, the forward ramp may include a structure extending forward from the upper front surface. The forward ramp may comprise a wedge or triangular shape and/or any other suitable shape. During operation of the shuttle mechanism, the forward ramp can be configured to control the operation of a forward cassette stop. During operation of the
例如,前向坡道可經構形以接觸及/或控制安置於模組化外殼910內之一前向匣止動件。前向匣止動件可包括耦合至模組化外殼910之一內表面且自其徑向向內延伸之一結構。前向匣止動件可耦合至鄰近部署端914之模組化外殼910之一內表面。前向匣止動件可包括一樞軸點。前向匣止動件可圍繞樞軸點樞轉(例如旋轉、向上偏置、向下偏置等等)。前向匣止動件及/或樞軸點可經彈簧載入。在一不受干擾狀態中(例如,回應於梭動機構處於第二位置中而不與前向坡道接觸),前向匣止動件可被向上偏置。在不受干擾狀態中,前向匣止動件可接觸一樞軸止動件。樞轉止動件可自模組化外殼910之一內表面徑向向內延伸。樞轉止動件可經定大小及塑形以在不受干擾狀態中接觸前向匣止動件以至少部分地阻止前向匣止動件在一進一步向上方向上樞轉。樞轉止動件亦可經構形以將前向匣止動件定位於用於接收前向坡道之一位置中。For example, the forward ramp may be configured to contact and/or control a forward pocket stop disposed within the
在一受干擾狀態中(例如,回應於梭動機構處於第一位置中,接觸及/或自前向坡道向前偏置),可向下偏置前向匣止動件。例如,樞軸點可包括具有用於前向坡道之一互補表面之一楔形或三角形形狀。回應於前向坡道接觸樞軸點之互補表面或提供抵靠其之一前向偏置,前向匣止動件可在一向下方向上樞轉以接觸一部署單元之一前表面。前向匣止動件可包括經構形以接觸及/或至少部分地保持一部署單元之一閂鎖或類似組件。In a disturbed state (eg, in response to the shuttle mechanism being in the first position, contacting and/or biasing forward from the forward ramp), the forward cassette stop may be biased downward. For example, the pivot point may comprise a wedge or triangular shape with a complementary surface for the forward ramp. In response to the forward ramp contacting or providing a forward bias against a complementary surface of the pivot point, the forward cassette stop may pivot in a downward direction to contact a front surface of a deployment unit. The forward cassette stop may include a latch or similar component configured to contact and/or at least partially retain a deployment unit.
在各種實施例中,梭動機構之臂可各包括向後延伸之一彈簧臂。彈簧臂可向內偏置且可包括(或界定)一卡掣。彈簧臂及/或卡掣可經構形以接合部署單元之側中之溝槽。例如,彈簧臂可各與部署單元之任一側上之一溝槽或一第一溝槽部分接合或介接。彈簧臂可經構形以將部署單元保持及定向於梭動機構及/或模組化外殼910內。例如,臂及/或彈簧臂可界定經構形以接收一部署單元之一空腔。In various embodiments, the arms of the shuttle mechanism may each include a rearwardly extending spring arm. The spring arm can be biased inwardly and can include (or define) a catch. The spring arms and/or catches can be configured to engage grooves in the sides of the deployment unit. For example, the spring arms may each engage or interface with a groove or a first groove portion on either side of the deployment unit. The spring arms can be configured to hold and orient the deployment unit within the shuttle mechanism and/or the
卡掣可包括在各彈簧臂上向內延伸(或向內偏置)之一機械結構。卡掣可經構形以與部署單元上之一溝槽、一第二溝槽部分或溝槽之一凸緣接合或介接以幫助將部署單元保持於梭動機構及/或模組化外殼910內。卡掣可經構形以與部署單元上之一溝槽接合或介接以防止(至少部分地)部署單元在一向上、向下或向後方向上移動。The catch may include a mechanical structure extending inwardly (or biased inwardly) on each spring arm. The catch can be configured to engage or interface with a groove on the deployment unit, a second groove portion or a flange of the groove to help retain the deployment unit to the shuttle mechanism and/or the modular housing within 910. The catch can be configured to engage or interface with a groove on the deployment unit to prevent (at least partially) movement of the deployment unit in an upward, downward or rearward direction.
就此而言,回應於一前向匣止動件接觸一部署單元之一前表面且卡掣接觸部署單元之一溝槽,部署單元可完全保持於梭動機構內。In this regard, in response to a forward pocket stop contacting a front surface of a deployment unit and the catch contacting a groove of the deployment unit, the deployment unit may be fully retained within the shuttle mechanism.
在各種實施例中,一或多個橫桿954可耦合至梭動機構之臂之一或多者或自其向外延伸。橫桿954可由任何適合附接方法附接至梭子。當梭子自一第一位置(向前橫移)移動至一第二位置(向後橫移)時,橫桿954用於在操作期間導引梭子。橫桿954可接收於模組化外殼910中之導引通道918內。耦合至臂之數個橫桿954可取決於MCEW 200之一部署定向,如先前所討論(例如一右手定向、一左手定向、一左右靈巧定向等等)。In various embodiments, one or
在各種實施例中,梭桿之一前端可插入穿過位於梭子之上部之一後表面上之一孔隙。梭桿之前端可接觸位於鄰近部署端914之模組化外殼910之一內部中之一前向止動件。梭桿之一後端可接觸一後止動件。後止動件可位於鄰近轉換端912之模組化外殼910之內部中(圖中未描繪)。在其他實施例中,後止動件可位於轉換配接器922、一手柄或其他附接件中。In various embodiments, a front end of a shuttle bar is insertable through an aperture on a rear surface of an upper portion of the shuttle. The front end of the shuttle bar can contact a forward stop located in an interior of the
梭子可經構形以在梭桿上向前及向後平移。就此而言,梭桿可作用類似於經構形以允許梭子在MCEW 900之操作期間自第一位置移動至第二位置之一軌道。梭動彈簧可定位於梭桿之前端與後端之間的梭桿上。梭動彈簧可抵靠梭子之上部(鄰近孔隙)偏置。就此而言,在MCEW 900之操作期間,梭動彈簧可對梭子施加一力以將梭動機構向前偏置(例如,偏置至第一位置中),同時仍允許梭動機構在操作期間被操作至第二位置中。The shuttle can be configured to translate forward and backward on the shuttle bar. In this regard, the shuttle bar may function like a track that is configured to allow the shuttle to move from a first position to a second position during operation of the
在各種實施例中,轉換配接器922可經構形以允許模組化外殼910自尾托彈匣928接收部署單元。轉換配接器922可在一第一端處耦合至模組化外殼910相鄰於模組化外殼910之轉換端912。轉換配接器922可在一第二端處耦合至尾托彈匣928。轉換配接器922可經構形以轉換轉換端912以自轉換端912中之一後開口接收部署單元。In various embodiments, the
在各種實施例中,參考圖5B且繼續參考圖12A至圖14B,轉換配接器922可包括界定一轉換井925之一本體。轉換井925可經構形以自一尾托彈匣928接收一或多個部署單元,且將一或多個部署單元提供至模組化外殼910。轉換配接器922之本體亦可包括一第一鉸鏈960-1。第一鉸鏈960-1可經構形以與尾托彈匣928之一第二鉸鏈960-2介接以形成一鉸鏈960,如本文中將進一步討論。In various embodiments, referring to FIG. 5B and with continued reference to FIGS. 12A-14B , the
轉換配接器922可包括向前延伸轉換配接器922之本體之一轉換板995。轉換板995可經構形以至少部分地密封模組化外殼910之轉換端912之一底部。例如,轉換板995可至少部分地密封轉換端912之底部使得部署單元可自轉換端912之一後端接收。就此而言,轉換板995可經定大小及塑形以與轉換端912之底部對準且回應於轉換配接器922耦合至模組化外殼910而至少部分地密封轉換端912之底部。The
在各種實施例中,轉換板995可界定一通道996。通道996可界定轉換板995中之一自前至後溝槽。通道996可經定大小及塑形以自尾托彈匣928接收一部署單元。就此而言,通道996可經構形以將來自尾托彈匣928之一或多個部署單元提供至模組外殼910。In various embodiments, the
在各種實施例中,且再次具體參考圖12A至圖14B,尾托彈匣928可經構形以向模組化外殼910提供一或多個部署單元。尾托彈匣928可經構形以接收任何適合或所要數目個部署單元220,諸如(例如) 1個部署單元、2個部署單元、3個部署單元等等。尾托彈匣928可包括經構形以在朝向尾托彈匣928之一開口之一向前方向(或水平地)偏壓部署單元。就此而言,回應於尾托彈匣928耦合至轉換配接器922及/或模組化外殼910,彈簧930可將部署單元向前朝向模組化外殼910偏置。例如,回應於尾托彈匣928耦合至轉換配接器922及/或模組化外殼910,彈簧930可將一第一部署單元偏置至模組化外殼910及轉換配接器922中。第一部署單元可至少部分地容置於模組化外殼910中在其中梭動機構可接合第一部署單元以載入第一部署單元之一位置中,如本文中將進一步討論(例如,使第一部署單元準備好用於部署一或多個射彈)。In various embodiments, and referring again in particular to FIGS. 12A-14B , the
尾托彈匣928可包括與一第二端對置之一第一端。尾托彈匣928之第一端可包括一尾托配接器924。尾托配接器924可包括尾托彈匣928之一部分,其經構形以與轉換配接器922及/或模組化外殼910介接。例如,尾托配接器924可包括一第二鉸鏈960-2。第二鉸鏈960-2可經構形以與轉換配接器922之第一鉸鏈960-1接合以將尾托彈匣928耦合至轉換配接器922。第一鉸鏈960-1之齒可接合第二鉸鏈960-2之齒且一鉸鏈銷961可透過接合插入以完成鉸鏈960 (例如一鉸鏈連接)。就此而言,鉸鏈960可附接至模組化外殼910之一橫向側及尾托彈匣928之一橫向側。
使用鉸鏈960來將尾托彈匣928耦合至轉換配接器922可使MCEW 900能夠在MCEW 900之一側上打開(例如,依一水平構形打開),而非如通常在槍枝(諸如獵槍(例如,依一垂直構形打開))中所發現般在一頂部或底部上打開。鉸鏈960可允許MCEW 900可選擇地暴露尾托彈匣928 (例如尾托彈匣928之一開口)。例如,MCEW 900可經構形以自一關閉位置操作至一打開位置。圖12A展示處於一關閉位置中之MCEW 900,而圖12B及圖13A展示處於一打開位置中之MCEW 900。在打開位置中,一或多個部署單元可經載入至尾托彈匣928中。Using the
尾托配接器924可包括一釋放閂鎖962。釋放閂鎖962可經構形以接合轉換配接器922以將MCEW 900鎖定於關閉位置中。可操作釋放閂鎖962 (例如推動、拉動、平移等等)以釋放與轉換配接器922之接合以將MCEW 900解鎖至打開位置中。The
尾托配接器924可包括一彈匣釋放器932,其經構形以控制部署單元920自尾托彈匣928向前移動至模組化外殼910中。彈匣釋放器932可包括一閂鎖或經構形以自一鎖定位置樞轉至一釋放位置之類似組件。在鎖定位置中,彈匣釋放器932可接合安置於尾托彈匣928內之一部署單元之一前表面。彈匣釋放器932可接合部署單元之前表面以防止部署單元在一向前方向上移動。在釋放位置中,彈匣釋放器932可脫離部署單元之前表面以允許部署單元在一向前方向上移動。在鎖定位置中,且如圖12B中所描繪,彈匣釋放器932亦可允許MCEW 900在不使一部署單元干擾開口(例如,一部署單元卡在轉換配接器922與尾托彈匣928之間可否則至少部分地防止MCEW 900打開)之情況下移動至打開位置中。The
例如,且如圖13C中所展示,一旦部署單元220載入尾托彈匣928內,彈匣釋放器932即將部署單元220保持於其中(例如,處於鎖定位置中)。若使用者需要部署單元220載入模組化外殼910內,則使用者接合(例如,按壓)彈匣釋放器932,其引起彈匣釋放器932脫離部署單元220之前表面(例如,處於釋放位置中)。回應於彈匣釋放器932處於釋放位置中,彈簧930向部署單元220提供一向前偏置以將部署單元220向前及/或水平移動至模組化外殼910之轉換端912中。For example, and as shown in FIG. 13C, once the
在各種實施例中,且再次具體參考圖12A至圖14B,MCEW 900可包括一尾部附接件976。尾部附接件976可耦合至槍托彈匣928之一後端(例如第二端),與其中尾托彈匣928耦合至轉換配接器922之一前端(例如第一端)對置。尾部附接件976可經構形以在操作期間緊靠(例如接觸)一使用者之肩部或胸部。在各種實施例中,尾部附接件976可包括用於在操作期間幫助使用者提高舒適度之一墊、減震構件或結構或其類似者。In various embodiments, and referring again in particular to FIGS. 12A-14B , the
在各種實施例中,MCEW 900可包括一手柄970。手柄970可類似於本文中所揭示之任何手柄。手柄970可耦合至尾托彈匣928之一下側。可使用任何類型之握把、手柄、延伸件等等來變動MCEW 900之佈局以允許一使用者定制MCEW 900。In various embodiments,
在各種實施例中,MCEW 900可依類似於本文中所揭示之任何其他MCEW (諸如MCEW 200)之一方式操作。MCEW 900之一梭動機構936可相同或類似於MCEW 200之梭動機構234般操作。In various embodiments,
例如,MCEW 900可經操作至一打開位置中(例如,如圖12B中所展示)。一或多個部署單元220可載入至尾托彈匣928中。回應於接收一或多個部署單元220,彈簧930可將部署單元220水平或向前抵靠彈匣釋放器932偏置。MCEW 900可經操作至關閉位置中(例如,如圖12A中所展示)。彈匣釋放器932可經操作以將一或多個部署單元220釋放至轉換配接器922及模組化外殼910中。For example,
MCEW 900之梭動機構936可經操作以自一第一位置(向前橫移)移動至一第二位置(向後橫移)。在第二位置中,梭動機構936之彈簧臂及/或卡掣接合一第一部署單元之側上之溝槽。梭動機構936可經操作返回至第一位置(向前橫移)中。在第一位置中,第一部署單元準備發射。當梭動機構936處於第一位置(向前橫移)中時,在第一部署單元向前移動至模組化外殼910中之後,尾托彈匣928中之彈簧230即將一第二部署單元向前或水平偏置至下一位置。The
觸發器917之啟動可引起第一部署單元部署一或多個射彈。當梭動機構936處於第一位置(向前橫移)中時,可部署一或多個射彈。當梭動機構936處於第一位置中且梭動機構936之前向坡道與前向匣止動件938接觸時,模組化外殼910之前向匣止動件938可被向下偏置以將第一部署單元保持於模組化外殼910內。觸發器917可接收後續啟動以基於第一部署單元中之可用射彈之數目來部署進一步射彈。Activation of
回應於梭動機構936被操作至第二位置(向後橫移),第一部署單元可自模組化外殼910之部署端914彈射。例如,回應於梭動機構936被操作至第二位置,彈簧臂及/或卡掣可脫離第一部署單元上之溝槽且可接合一第二(或下一)部署單元之側上之溝槽。一旦梭動機構936處於第二位置(向後橫移)中,前向匣止動件938即脫離第一部署單元之前部。回應於梭動機構936返回至第一位置(向前橫移)之操作,第二部署單元可接觸第一部署單元以引起第一部署單元自模組化外殼910之部署端914彈射。彈簧臂及/或卡掣可與第二部署單元之溝槽接合。前向坡道可與前向匣止動件938接觸以引起前向匣止動件938向下偏置以接觸第二部署單元之一前表面。就此而言,第二部署單元準備好部署,且來自尾托彈匣928之下一部署單元可偏置至轉換配接器922及/或模組化外殼910中(若彈匣釋放器932打開)。The first deployment unit can be ejected from the
在各種實施例中,且參考圖16,MCEW 1600可包括經構形以執行類似於一梭動機構之一橫桿(例如橫桿254、橫桿954等等)之操作之一動作式手柄1672。MCEW 1600可類似於本文中所揭示之任何其他MCEW,諸如MCEW 200、MCEW 300及/或MCEW 900。為簡潔起見,可不參考MCEW 1600討論本文中已討論之一MCEW之組件。MCEW 1600可包括一模組化外殼1610、一梭動機構(圖中未描繪)及/或動作式握把1672之一或多者。In various embodiments, and referring to FIG. 16, the
在各種實施例中,模組化外殼1610可類似於本文中所討論之任何外殼(例如模組化外殼210、模組化外殼910等等)或具有與其類似之態樣及/或組件。In various embodiments, the
模組化外殼1610可包括具有與一部署端1614對置之一轉換端1612之一本體。部署端1614可類似於本文中所討論之任何部署端或具有與其類似之態樣及/或組件。轉換端1612可類似於本文中所討論之任何轉換端或具有與其類似之態樣及/或組件。部署端1614可界定模組化外殼1610之本體中之一前向開口。轉換端1612可界定模組化外殼1610之本體中之一後開口及一底部開口兩者。在其他實施例中,轉換端1612可包括模組化外殼1610之一封閉面,且MCEW 1600可經構形以經由部署端1614僅接收部署單元。部署端1614及轉換端1612可界定一機架1613。機架1613可界定穿過模組化外殼1610之本體之一開口。機架1613可經構形以接收及載入(例如,準備部署射彈、彈射部署單元等等)一或多個部署單元。
在各種實施例中,對置側壁1611之一或兩者可包括一導引通道1618。導引通道1618可類似於本文中所描述之任何其他導引通道(例如導引通道218)。導引通道1618可界定每一各自對置側壁1611中之一開口,大致沿模組化外殼1610之長度。導引通道1618可經定大小及塑形以實現MCEW 1600之梭動機構與動作式握把1672之間的操作。導引通道1618可經定大小及塑形以使動作式手柄1672能夠將梭動機構操作(例如平移)至一第一位置及一第二位置中,如本文中將進一步詳細討論。In various embodiments, one or both of the opposing sidewalls 1611 may include a
在各種實施例中,模組化外殼1610可包括一安裝表面1604。安裝表面1604可類似於本文中所描述之任何安裝表面。安裝表面1604可包括或耦合至本文中所描述之任何適合導軌介面系統,諸如一韋佛式導軌、一皮卡汀尼式導軌或其類似者。In various embodiments, the
在各種實施例中,動作式握把1672可耦合至MCEW 1600之梭動機構。動作式握把1672可作用類似於一梭動機構之一橫桿(例如,如先前所討論),且可經構形以將梭動機構操作至一第一位置(向前橫移)及一第二位置(向後橫移)中。動作式握把1672可類似於一標準泵式獵槍上所利用之橫桿動作握把。動作式握把1672可位於模組化外殼1600之一外表面或下側上。在各種實施例中,動作式握把1672可直接耦合至一梭動機構之一或多個橫桿。在各種實施例中,本文中所揭示之一梭動機構之橫桿可被移除,且動作式握把1672可直接耦合至梭動機構之梭子。In various embodiments, the
動作式握把1672可包括一觸發器1673。觸發器1673可類似於本文中所揭示之任何觸發器,諸如觸發器217、觸發器917或其類似者。觸發器1673可安置於動作式握把1672內。觸發器1673耦合至動作式握把1672之一外表面,且可經構形以在施加實體接觸之後即移動、滑動、旋轉或依其他方式被實體下壓或移動。例如,觸發器1673可由一使用者施加至觸發器1673之實體接觸致動。回應於觸發器1673被啟動(例如,由使用者下壓、推動等等),觸發器1673可與裝載於模組化外殼1610中之一部署單元通信以引起來自部署單元之一或多個射彈之部署及/或一刺激信號透過射彈之提供。
如上所述,一MCEW可包括各種手柄、握把、附接件及/或耦合機構。各種手柄、握把、附接件及/或耦合機構可類似於在手槍、步槍、半自動武器及其類似者上發現之手柄、握把、附接件及/或耦合機構,其等之各者可耦合至MCEW以供任何數目個組合使用。As mentioned above, an MCEW may include various handles, grips, attachments and/or coupling mechanisms. The various handles, grips, attachments and/or coupling mechanisms may be similar to those found on pistols, rifles, semi-automatic weapons and the like, each of which Can be coupled to the MCEW for use in any number of combinations.
在各種實施例中,且參考圖17,MCEW 1600可耦合至一手柄1670。圖17中之MCEW 1600可包括經構形以操作MCEW 1600之梭動機構(例如,與圖16中所展示之動作式握把1672相反)之一橫桿1654。圖17中之MCEW 1600亦可包括具有一觸發器1617之一前握把1616。前握把1616及触發器1617可各類似於本文中所揭示之任何前握把及/或觸發器。In various embodiments, and referring to FIG. 17 , the
手柄1670可直接耦合至轉換端1612 (例如,在不使用一轉換配接器之情況下)。就此而言,圖17中所描繪之MCEW 1600可經構形以僅自MCEW 1600之部署機架1614接收部署單元。手柄1670可類似於本文中所揭示之任何手柄。例如,手柄1670可包括通常在手槍、步槍、半自動武器及其類似者上發現之任何適合或所要手柄、握把、附接件及/或耦合機構。手柄1670可包括一蜂窩結構或任何其他類似結構或特性,其經構形以減輕手柄1670之重量、增加手柄1670之穩定性、增加手柄1670之減震性及/或其類似者之至少一者。The
在各種實施例中,揭示一種模組化導電武器(「MCEW」)。該MCEW可包括:一部署端,其界定一前開口;一轉換端,其界定一後開口;及一本體,其界定該部署端與該轉換端之間的一機架,其中該機架經構形以自該部署端或該轉換端接收一部署單元,且其中該部署端經構形以轉移該部署單元離開該機架且遠離該MCEW。In various embodiments, a modular conductive weapon ("MCEW") is disclosed. The MCEW may include: a deployment end defining a front opening; a conversion end defining a rear opening; and a body defining a frame between the deployment end and the conversion end, wherein the frame is is configured to receive a deployment unit from the deployment end or the conversion end, and wherein the deployment end is configured to transfer the deployment unit away from the rack and away from the MCEW.
該MCEW可進一步包括與該機架連通之一梭子,其中:該機架容納一後部署單元及一前向部署單元;該梭動機構迫使該後部署單元向前;且該後部署單元之一向前移動迫使該前向部署單元向前離開該部署端。該梭動機構可包括一外部橫桿,其中該外部橫桿促進該梭動機構移動。該梭動機構可包括經構形以接合該後部署單元以迫使該後部署單元向前之一對臂。該梭動機構可包括經構形以使該前向部署單元保持於該機架內之一前向匣止動件。該機架可包含於該機架連通之一彈匣室及一梭動機構,其中該梭動機構經構形以使該部署單元透過該前開口彈射且透過該彈匣室載入該部署單元。該彈匣室可形成於該機架之一後部中。該彈匣室可形成於該機架之一底部中。該前開口可經構形以將該部署單元轉移至該機架中。The MCEW may further include a shuttle in communication with the rack, wherein: the rack accommodates a rear deployment unit and a forward deployment unit; the shuttle mechanism forces the rear deployment unit forward; and one of the rear deployment units is directed toward Forward movement forces the forward deployment unit forward away from the deployment end. The shuttle mechanism may include an outer rail, wherein the outer rail facilitates movement of the shuttle mechanism. The shuttle mechanism may include a pair of arms configured to engage the rear deployment unit to force the rear deployment unit forward. The shuttle mechanism may include a forward pocket stop configured to retain the forward deployment unit within the frame. The rack may include a magazine chamber in communication with the rack and a shuttle mechanism, wherein the shuttle mechanism is configured to eject the deployment unit through the front opening and load the deployment unit through the magazine chamber . The magazine chamber may be formed in a rear portion of the frame. The magazine chamber may be formed in a bottom of the frame. The front opening can be configured to transfer the deployment unit into the rack.
在各種實施例中,一種模組化導電武器(「MCEW」)可包括界定一機架之一外殼、一前開口、一後開口及一底部開口。該前開口、該後開口及該底部開口之各者可經構形以容納一部署單元之轉移。該機架可經構形以透過該後開口及該底部開口之至少一者接收該部署單元。一梭動機構可安置於該機架內,其中該梭動機構經構形以使該部署單元透過該前開口彈出且將該部署單元移動至該機架中之一發射位置中。In various embodiments, a modular conductive weapon ("MCEW") can include a housing defining a frame, a front opening, a rear opening, and a bottom opening. Each of the front opening, the rear opening, and the bottom opening can be configured to accommodate transfer of a deployment unit. The rack can be configured to receive the deployment unit through at least one of the rear opening and the bottom opening. A shuttle mechanism may be positioned within the rack, wherein the shuttle mechanism is configured to eject the deployment unit through the front opening and move the deployment unit into a firing position in the rack.
該機架可容納一後部署單元及一前向部署單元;該梭動機構可迫使該後部署單元向前;且該後部署單元之向前移動可迫使該前向部署單元向前且離開該前開口。該梭動機構可包括一外部橫桿,其中該外部橫桿促進該梭動機構移動。該梭動機構可包括經構形以接合該後部署單元以迫使該後部署單元向前之一對臂。該梭動機構可包括經構形以使該前向部署單元保持於該機架內之一前向匣止動件。The rack can accommodate a rear deployment unit and a forward deployment unit; the shuttle mechanism can force the rear deployment unit forward; and forward movement of the rear deployment unit can force the forward deployment unit forward and away from the front opening. The shuttle mechanism may include an outer rail, wherein the outer rail facilitates movement of the shuttle mechanism. The shuttle mechanism may include a pair of arms configured to engage the rear deployment unit to force the rear deployment unit forward. The shuttle mechanism may include a forward pocket stop configured to retain the forward deployment unit within the frame.
在各種實施例中,一種模組化導電武器(「MCEW」)可包括一主外殼,其包括且界定:一機架,其中該機架經構形以接收至少一部署單元;一前開口,其中該至少一部署單元透過該前開口彈射;及一後開口及一底部開口之至少一者。該MCEW可包括可移除地附接至該主外殼且容置額外部署單元之一第二外殼。該MCEW可包括與該機架連通之一梭動機構,其中該梭動機構使該至少一部署單元透過該前開口彈射;且將該等額外部署單元自該第二外殼移動至該機架之一發射位置中。In various embodiments, a modular electrically conductive weapon ("MCEW") can include a main housing that includes and defines: a frame, wherein the frame is configured to receive at least one deployment unit; a front opening, wherein the at least one deployment unit is ejected through the front opening; and at least one of a rear opening and a bottom opening. The MCEW may include a second housing that is removably attached to the main housing and accommodates additional deployment units. The MCEW can include a shuttle mechanism in communication with the rack, wherein the shuttle mechanism ejects the at least one deployment unit through the front opening; and moves the additional deployment units from the second housing to the rack in a launch position.
該梭動機構可包括可滑動地安置於該機架內之一梭子;及連接至該梭子之一外部橫桿,其中該外部橫桿經構形以使該梭子可操作地滑動於該機架內。該梭動機構可進一步包括朝向該發射位置偏置該梭子及該至少一部署單元之一彈簧。該梭動機構可包括經構形以接合該至少一部署單元之一對臂。該梭動機構可包括經構形以使該至少一部署單元保持於該機架內之一前向匣止動件。The shuttle mechanism may include a shuttle slidably disposed within the frame; and an outer rail connected to the shuttle, wherein the outer rail is configured to operably slide the shuttle over the frame Inside. The shuttle mechanism may further include a spring biasing the shuttle and the at least one deployment unit toward the firing position. The shuttle mechanism may include a pair of arms configured to engage the at least one deployment unit. The shuttle mechanism may include a forward pocket stop configured to retain the at least one deployment unit within the frame.
在各種實施例中,揭示一種操作一模組化導電武器(「MCEW」)之方法。該方法可包含啟動一外殼中之一第一部署單元之操作,其中該第一部署單元透過該外殼中之一前開口發射一射彈;且使該第一部署單元透過該前開口自該外殼彈出。In various embodiments, a method of operating a modular conductive weapon ("MCEW") is disclosed. The method may include activating a first deployment unit in a housing, wherein the first deployment unit fires a projectile through a front opening in the housing; and causing the first deployment unit to exit the housing through the front opening pop up.
彈射該第一部署單元之操作可包括:將一梭動機構操作至一第二位置,其中該梭動機構接合定位於該第一部署單元後面之一第二部署單元;及將該梭動機構操作至一第一位置,其中該梭動機構迫使該第二部署單元向前抵靠該第一部署單元,且其中該第二部署單元迫使該第一部署單元透過該前開口離開該外殼。該梭動機構可包括一外部橫桿,且其中該外部橫桿促進該梭動機構移動至該第一位置或該第二位置。該梭動機構可包括經構形以接合該第二部署單元以迫使該第二部署單元向前之一對臂。The operation of ejecting the first deployment unit may include: operating a shuttle mechanism to a second position, wherein the shuttle mechanism engages a second deployment unit positioned behind the first deployment unit; and the shuttle mechanism Operates to a first position, wherein the shuttle mechanism forces the second deployment unit forward against the first deployment unit, and wherein the second deployment unit forces the first deployment unit to exit the housing through the front opening. The shuttle mechanism may include an outer rail, and wherein the outer rail facilitates movement of the shuttle mechanism to the first position or the second position. The shuttle mechanism may include a pair of arms configured to engage the second deployment unit to force the second deployment unit forward.
在各種實施例中,一種模組化導電武器(「MCEW」)可包括一主外殼,其包括一後轉換連接器。該主外殼可界定:一機架,其中該機架經構形以接收至少一部署單元;一前開口,其中該至少一部署單元透過該前開口彈射;及一底部開口。該MCEW可包括可移除地附接至後轉換連接器且經構形以容置額外部署單元之一第二外殼。In various embodiments, a modular conductive weapon ("MCEW") can include a main housing that includes a rear conversion connector. The main housing may define: a frame, wherein the frame is configured to receive at least one deployment unit; a front opening, wherein the at least one deployment unit is ejected through the front opening; and a bottom opening. The MCEW may include a second housing removably attached to the rear conversion connector and configured to accommodate additional deployment units.
該後轉換連接器可包括可移除地附接於該底部開口上方之一轉換配接器。該轉換配接器可界定一彈匣室之至少一部分;該第二外殼可界定相鄰於該彈匣室之一第二外殼開口;且該等額外部署單元可透過該第二外殼開口及該彈匣室自該第二外殼轉移至該機架中。該底部開口可界定該彈匣室之至少一部分;且該第二外殼可附接至該主外殼及該轉換配接器之至少一者之底部。該第二外殼可移除地附接至該後轉換連接器;該第二外殼可界定相鄰於該底部開口之一第二外殼開口;且該等額外部署單元可透過該第二外殼開口及該底部開口自該第二外殼轉移至該機架中。該第二外殼可包括一手柄。該第一外殼可包括一動作式握把。該後轉換連接器可移除地附接至複數個可互換握把。該後轉換連接器可移除地附接至複數個可互換第二外殼。該主外殼可進一步包括可移除地附接至複數個可互換元件之一前向介面。該複數個可互換元件可包含一前握把。該握把可包含一觸發器。該MCEW可進一步包括附接至該主外殼之一上表面之一導軌介面。The rear transition connector may include a transition adapter removably attached over the bottom opening. The conversion adapter can define at least a portion of a magazine chamber; the second housing can define a second housing opening adjacent the magazine chamber; and the additional deployment units can pass through the second housing opening and the The magazine chamber is transferred from the second housing into the frame. The bottom opening can define at least a portion of the magazine chamber; and the second housing can be attached to the bottom of at least one of the main housing and the conversion adapter. The second housing can be removably attached to the rear conversion connector; the second housing can define a second housing opening adjacent the bottom opening; and the additional deployment units can pass through the second housing opening and The bottom opening is transferred from the second housing into the rack. The second housing may include a handle. The first housing may include an action grip. The rear conversion connector is removably attached to a plurality of interchangeable grips. The rear transition connector is removably attached to a plurality of interchangeable second housings. The main housing may further include a forward interface removably attachable to one of the plurality of interchangeable elements. The plurality of interchangeable elements may include a fore grip. The grip may contain a trigger. The MCEW may further include a rail interface attached to an upper surface of the main housing.
在各種實施例中,一種用於自部署單元發射射彈之模組化導電武器(「MCEW」)可包括一主外殼。該主外殼可包括一後轉換連接器。該主外殼可界定:一機架,其經構形以接收至少一部署單元;一前開口,其中該等射彈及該等部署單元透過該前開口彈射;及一後開口。該MCEW可包括可移除地附接至該後轉換連接器且經構形以容置額外部署單元之一第二外殼。In various embodiments, a modular conductive weapon ("MCEW") for launching projectiles from a deployment unit may include a main housing. The main housing may include a rear conversion connector. The main housing may define: a frame configured to receive at least one deployment unit; a front opening through which the projectiles and the deployment units are ejected; and a rear opening. The MCEW may include a second housing removably attached to the rear conversion connector and configured to accommodate additional deployment units.
該後轉換連接器可包括可移除地附接於該後開口上方之一轉換配接器。該轉換配接器可界定一彈匣室之至少一部分;該第二外殼可界定相鄰於該彈匣室之一第二外殼開口;且該等額外部署單元可透過該第二外殼開口及該彈匣室自該第二外殼轉移至該機架中。該第二外殼可移除地附接至該後轉換連接器;該第二外殼可界定相鄰於該後開口之一第二外殼開口;且該等額外部署單元可透過該第二外殼開口及該後開口自該第二外殼轉移至該機架中。該MCEW可進一步包括該主外殼與該第二外殼之間的一鉸鏈連接,其中該鉸鏈連接可選擇地暴露該第二外殼開口。該鉸鏈連接可包含附接至該主外殼之一第一橫向側及該第二外殼之一第二橫向側之一鉸鏈。該第二外殼可包括一尾托彈匣。該後轉換連接器可移除地附接至複數個可互換第二外殼。該主外殼可進一步包括一前向介面,其中該前向介面可移除地附接至複數個可互換元件。該複數個可互換元件可包含一前握把。該握把可包含一觸發器。The rear transition connector may include a transition adapter removably attached over the rear opening. The conversion adapter can define at least a portion of a magazine chamber; the second housing can define a second housing opening adjacent the magazine chamber; and the additional deployment units can pass through the second housing opening and the The magazine chamber is transferred from the second housing into the frame. The second housing can be removably attached to the rear conversion connector; the second housing can define a second housing opening adjacent the rear opening; and the additional deployment units can pass through the second housing opening and The rear opening is transferred from the second housing into the frame. The MCEW may further include a hinged connection between the primary housing and the second housing, wherein the hinged connection selectively exposes the second housing opening. The hinged connection may include a hinge attached to a first lateral side of the main housing and a second lateral side of the second housing. The second housing may include a stock magazine. The rear transition connector is removably attached to a plurality of interchangeable second housings. The main housing may further include a front-facing interface, wherein the front-facing interface is removably attached to a plurality of interchangeable elements. The plurality of interchangeable elements may include a fore grip. The grip may contain a trigger.
在各種實施例中,揭示一種操作一模組化導電武器(「MCEW」)之方法。該方法可包含包括以下之操作:自複數個不同可互換第二外殼選擇用於容置部署單元之一第二外殼;將一選定第二外殼附接至一主外殼之一後轉換連接器;將一第一部署單元轉移至由該主外殼界定之一機架中之一發射位置中;透過界定於該主外殼中之一前開口自該第一部署單元發射一射彈;透過該前開口彈射該第一部署單元;及將一第二部署單元轉移至該發射位置中。In various embodiments, a method of operating a modular conductive weapon ("MCEW") is disclosed. The method can include operations including: selecting a second housing from a plurality of different interchangeable second housings for accommodating the deployment unit; attaching a selected second housing to one of a primary housing and converting the connector; transferring a first deployment unit into a firing position in a rack defined by the main housing; firing a projectile from the first deployment unit through a front opening defined in the main housing; through the front opening ejecting the first deployment unit; and transferring a second deployment unit into the launch position.
該方法亦可包含包括將該第二部署單元自該選定第二外殼轉移至該機架中之操作。附接該選定第二外殼之操作可包括:將一轉換配接器可移除地附接於界定於該主外殼中之一後開口及一底部開口之至少一者上方;及將該選定第二外殼可移除地附接至該轉換配接器。該轉換配接器可界定一匣彈室之至少一部分;該選定第二外殼可界定相鄰於該匣彈室之一開口,且該等操作可進一步包括將該第二部署單元透過該選定第二外殼開口及該匣彈室自該選定第二外殼轉移至該機架中。該底部開口可界定該匣彈室之至少一部分且附接該選定第二外殼之操作可包括將該選定第二外殼附接至該主外殼及該轉換配接器之至少一者之底部。該主外殼可界定一後開口;該選定第二外殼可界定一開口;附接該選定第二外殼之該操作可包括將該選定第二外殼附接至該轉換連接器且實質上對準該後開口及該選定第二外殼開口;且該等操作可進一步包括將該第二部署單元透過該選定第二外殼開口及該後開口自該選定第二外殼轉移至該機架中。該等操作可進一步包括經由該主外殼與該選定第二外殼之間的一鉸鏈連接可選擇地暴露該第二外殼開口;及將該等部署單元轉移至該選定第二外殼中。該鉸鏈連接可包含附接至該主外殼之一第一橫向側及該選定第二外殼之一第二橫向側之一鉸鏈。該選定第二外殼可包括一尾托彈匣。該選定第二外殼可包括一手柄。該等操作可進一步包括將該後轉換連接器可移除地附接至選自複數個可互換握把之一選定握把。該等操作可進一步包括自複數個可互換前向元件選擇一前向元件;及將該選定前向元件可移除地附接至該主外殼之一前向介面。該複數個可互換前向元件可包含一前握把。該握把可包含一觸發器。The method may also include operations including transferring the second deployment unit from the selected second housing into the rack. Attaching the selected second housing may include: removably attaching a conversion adapter over at least one of a rear opening and a bottom opening defined in the main housing; and the selected first housing Two housings are removably attached to the conversion adapter. The conversion adapter can define at least a portion of a magazine chamber; the selected second housing can define an opening adjacent the magazine chamber, and the operations can further include passing the second deployment unit through the selected first Two housing openings and the magazine magazine are transferred from the selected second housing into the frame. The bottom opening can define at least a portion of the magazine chamber and attaching the selected second housing can include attaching the selected second housing to the bottom of at least one of the main housing and the conversion adapter. The main housing can define a rear opening; the selected second housing can define an opening; the operation of attaching the selected second housing can include attaching the selected second housing to the transition connector and substantially aligning the a rear opening and the selected second housing opening; and the operations may further include transferring the second deployment unit from the selected second housing into the rack through the selected second housing opening and the rear opening. The operations may further include selectively exposing the second housing opening via a hinged connection between the primary housing and the selected second housing; and transferring the deployment units into the selected second housing. The hinged connection may include a hinge attached to a first lateral side of the main housing and a second lateral side of the selected second housing. The selected second housing may include a stock magazine. The selected second housing may include a handle. The operations may further include removably attaching the rear conversion connector to a selected one of a plurality of interchangeable grips. The operations may further include selecting a forward element from a plurality of interchangeable forward elements; and removably attaching the selected forward element to a forward interface of the main housing. The plurality of interchangeable forward elements may include a fore grip. The grip may contain a trigger.
在各種實施例中,揭示一種用於自至少一部署單元發射射彈之模組化導電武器(「MCEW」)。該MCEW可包括一主外殼,其包括一後轉換連接器。該主外殼可界定:一機架,其中該機架經構形以接收至少一部署單元;一前開口,其中該至少一部署單元透過該前開口彈射;及一手柄,其附接至該後轉換連接器。In various embodiments, a modular conductive weapon ("MCEW") for launching projectiles from at least one deployment unit is disclosed. The MCEW may include a main housing that includes a rear transition connector. The main housing can define: a frame, wherein the frame is configured to receive at least one deployment unit; a front opening, wherein the at least one deployment unit is ejected through the front opening; and a handle attached to the rear Conversion connector.
本文中已關於特定實施例描述益處、其他優點及問題之解決方案。此外,本文中所含之各種圖式中所展示之連接線意欲表示各種元件之間的例示性功能關係及/或實體耦合。應注意,諸多替代或額外功能關係或實體連接可存在於一實際系統中。然而,益處、優點、問題之解決方案及可能引起任何益處、優點或解決方案發生或變得更明確之任何元件並非解釋為本發明之關鍵、必需或至關重要特徵或元件。本發明之範疇因此僅限於隨附申請專利範圍及其合法等效物,其中對一單數元件之參考並非旨在意謂「一個且僅一個」而是「一或多個」,除非明確說明。再者,在申請專利範圍中使用類似於「A、B或C之至少一者」之一片語時,期望將片語解譯為僅A可存在於一實施例中,僅B可存在於一實施例中,僅C可存在於一實施例中,或元件A、B及C之任何組合可存在於一單一實施例中;例如,A及B、A及C、B及C或A及B及C。Benefits, other advantages, and solutions to problems have been described herein with respect to specific embodiments. Furthermore, the connecting lines shown in the various figures contained herein are intended to represent exemplary functional relationships and/or physical couplings between the various elements. It should be noted that many alternative or additional functional relationships or entity connections may exist in an actual system. However, benefits, advantages, solutions to problems, and any element by which any benefit, advantage, or solution might occur or become more apparent are not to be construed as critical, required, or critical features or elements of the invention. The scope of the invention is therefore limited only to the scope of the appended claims and their legal equivalents, wherein reference to a singular element is not intended to mean "one and only one" but "one or more" unless expressly stated otherwise. Furthermore, when a phrase similar to "at least one of A, B, or C" is used in the scope of the claim, it is desirable to interpret the phrase as only A may exist in an embodiment, and only B may exist in an embodiment. In embodiments, only C may be present in an embodiment, or any combination of elements A, B, and C may be present in a single embodiment; eg, A and B, A and C, B and C, or A and B and C.
本文中提供系統、方法及設備。在本文中之詳細描述中,對「各種實施例」、「一個實施例」、「一實施例」、「一實例性實施例」等等之參考指示所描述實施例可包含一特定特徵、結構或特性,但每一實施例可能未必包含特定特徵、結構或特性。再者,此等片語不必參考相同實施例。此外,當結合一實施例描述一特定特徵、結構或特性時,認為在熟習技術者之知識內結合是否明確描述之其他實施例影響此特徵、結構或特性。在閱讀描述之後,熟習相關技術者將明白如何在替代實施例中實施本發明。此外,不論元件、組件或方法步驟是否在申請專利範圍中明確敘述,該元件、組件或方法步驟不旨在貢獻給公眾。聲明元素不意欲援引35U.S.C.112(f),除非使用片語「...之方法」來明確敘述該元素。如本文所使用,術語「包含(comprise)、(comprising)」或其任何其他變體旨在覆蓋一非排他性包含,使得包括一系列元素之一程序、方法、物品或設備不僅包含該等元素,而且可包含未明確列出或此程序、方法、物品或設備所固有之其他元素。Systems, methods, and apparatus are provided herein. In the detailed description herein, references to "various embodiments," "one embodiment," "an embodiment," "an example embodiment," etc. indicate that the described embodiment may include a particular feature, structure or characteristics, but each embodiment may not necessarily include a particular feature, structure, or characteristic. Furthermore, these phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure or characteristic is described in connection with one embodiment, it is believed to be within the knowledge of those skilled in the art to affect that feature, structure or characteristic in conjunction with other embodiments whether or not explicitly described. After reading the description, those skilled in the relevant art will understand how to implement the invention in alternative embodiments. Furthermore, no element, component or method step is intended to be dedicated to the public whether or not the element, component or method step is expressly recited within the scope of the claims. A statement element is not intended to invoke 35 U.S.C. 112(f) unless the element is explicitly stated using the phrase "method of...". As used herein, the term "comprise, (comprising)" or any other variation thereof is intended to cover a non-exclusive inclusion such that a program, method, article or apparatus comprising a series of elements comprises not only those elements, And may contain other elements not expressly listed or inherent to the program, method, article or apparatus.
1:導電武器(CEW) 10:外殼 12:手柄端 14:部署端 16:護罩 18:觸發器 20:部署單元 25:推進系統 27:第一射彈 28:第二射彈 30:控制介面 35:處理電路 40:電源 45:信號產生器 100:模組化導電武器(MCEW) 105:目標 120-1:第一部署單元 120-2:第二部署單元 127-1:第一射彈 127-2:第三射彈 128-1:第二射彈 128-2:第四射彈 200:MCEW 204:安裝表面 207-1:前瞄準器 207-2:後瞄準器 210:模組化外殼 211:對置側壁 212:轉換端 213:機架 214:部署端 215:配件埠 216:前握把 217:觸發器 218:導引通道 219:雷射瞄準器 220:部署單元 221:外殼 222:轉換配接器 223:內孔 224:彈匣室配接器 225:手柄端 226:彈匣室 227:射彈 227-1:第一射彈 227-2:第二射彈 228:底部饋送彈匣 230:彈簧 232-1:彈匣釋放器 232-2:彈匣閂鎖 234:梭動機構 236:梭子 237:樞軸點 238:前向匣止動件 239:前向坡道 240:梭動彈簧 241:樞軸止動件 242:梭桿 244:上部 246:臂 248:彈簧臂 250:卡掣 252:溝槽 252-1:第一溝槽部分 252-2:第二溝槽部分 254:橫桿 256:螺釘 258:孔隙 270:手柄 300:MCEW 900:MCEW 904:安裝表面 907-1:前瞄準器 907-2:後瞄準器 910:模組化外殼 911:對置側壁 912:轉換端 913:機架 914:部署端 916:前握把 917:觸發器 918:導引通道 919:雷射瞄準器 922:轉換配接器 924:尾托配接器 925:轉換井 928:尾托彈匣 932:彈匣釋放器 936:梭動機構 938:前向匣止動件 954:橫桿 960:鉸鏈 960-1:第一鉸鏈 960-2:第二鉸鏈 961:鉸鏈銷 962:釋放閂鎖 970:手柄 974:導軌介面系統 976:尾部附接件 995:轉換板 996:通道 1600:MCEW 1604:安裝表面 1610:模組化外殼 1611:對置側壁 1612:轉換端 1613:機架 1614:部署端 1616:前握把 1617:触發器 1618:導引通道 1670:手柄 1672:動作式握把 1673:觸發器 1: Conductive Weapon (CEW) 10: Shell 12: handle end 14: Deployment side 16: Shield 18: Trigger 20: Deployment Unit 25: Propulsion System 27: First projectile 28: Second Projectile 30: Control interface 35: Processing circuit 40: Power 45: Signal generator 100: Modular Conductive Weapon (MCEW) 105: Goals 120-1: First Deployment Unit 120-2: Second Deployment Unit 127-1: First Projectile 127-2: Third Projectile 128-1: Second Projectile 128-2: Fourth Projectile 200:MCEW 204: Mounting Surface 207-1: Front Sight 207-2: Rear sight 210: Modular enclosure 211: Opposite side walls 212: Conversion terminal 213: Rack 214: Deployment side 215: Accessory port 216: Front Grip 217: Trigger 218: Guide channel 219: Laser Sight 220: Deployment Unit 221: Shell 222: Conversion adapter 223: Inner hole 224: Magazine Chamber Adapter 225: handle end 226: Magazine Room 227: Projectile 227-1: First Projectile 227-2: Second Projectile 228: Bottom Feed Magazine 230: Spring 232-1: Magazine Release 232-2: Magazine Latch 234: Shuttle mechanism 236: Shuttle 237: Pivot Point 238: Forward cassette stop 239: Forward Ramp 240: Shuttle spring 241: Pivot Stop 242: Shuttle lever 244: Upper 246: Arm 248: Spring Arm 250: Lock 252: Groove 252-1: First groove section 252-2: Second groove section 254: Crossbar 256: Screws 258: Pore 270: handle 300:MCEW 900:MCEW 904: Mounting Surface 907-1: Front Sight 907-2: Rear sight 910: Modular Housing 911: Opposite side walls 912: Conversion terminal 913: Rack 914: Deployment side 916: Front Grip 917: Trigger 918: Guide channel 919: Laser Sight 922: Conversion Adapter 924: Stock Adapter 925: Conversion Well 928: Stock Magazine 932: Magazine Release 936: Shuttle mechanism 938: Forward Cassette Stop 954: Crossbar 960: Hinge 960-1: First hinge 960-2: Second hinge 961: Hinge pin 962: Release Latch 970: handle 974: Rail Interface System 976: Tail Attachment 995: Conversion board 996: Channel 1600:MCEW 1604: Mounting Surface 1610: Modular Housing 1611: Opposite side walls 1612: conversion terminal 1613: Rack 1614: Deployment side 1616: Front Grip 1617: Trigger 1618: Guide Channel 1670: Handle 1672: Action Grip 1673: Trigger
在說明書之結尾部分中特別指出且明確主張本發明之標的。然而,可藉由參考結合以下繪示性圖式考量之詳細描述及申請專利範圍來獲得本發明之一更完整理解。在以下圖式中,貫穿圖式,相同參考符號指代類似元件及步驟。The subject matter of the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. However, a more complete understanding of the invention can be obtained by reference to the detailed description and the scope of claims considered in conjunction with the following illustrative drawings. In the following figures, the same reference numerals refer to similar elements and steps throughout the figures.
圖1繪示根據各種實施例之一導電武器之一示意圖;FIG. 1 shows a schematic diagram of a conductive weapon according to various embodiments;
圖2A至圖2D繪示根據各種實施例之部署射彈及自一模組化導電武器彈射一部署單元之階段;2A-2D illustrate stages of deploying a projectile and ejecting a deployment unit from a modular conductive weapon, according to various embodiments;
圖3繪示根據各種實施例之包括一梭動機構之一模組化導電武器之一分解透視圖;3 illustrates an exploded perspective view of a modular conductive weapon including a shuttle mechanism according to various embodiments;
圖4A及圖4B繪示根據各種實施例之用於一模組化導電武器之一模組化外殼之透視圖;4A and 4B illustrate perspective views of a modular housing for a modular conductive weapon in accordance with various embodiments;
圖5A繪示根據各種實施例之用於一模組化導電武器之一轉換配接器之一透視圖;5A shows a perspective view of a conversion adapter for a modular conductive weapon, according to various embodiments;
圖5B繪示根據各種實施例之用於一模組化導電武器之具有一轉換板之一轉換配接器之一透視圖;5B depicts a perspective view of a conversion adapter with a conversion plate for a modular conductive weapon in accordance with various embodiments;
圖6A繪示根據各種實施例之包括一底部饋送彈匣之一模組化導電武器之一分解透視圖;6A depicts an exploded perspective view of a modular conductive weapon including a bottom-fed magazine in accordance with various embodiments;
圖6B繪示根據各種實施例之圖6A之一端視圖;6B depicts an end view of FIG. 6A according to various embodiments;
圖6C繪示根據各種實施例之沿線H取得之圖6B之一橫截面圖;6C depicts a cross-sectional view of FIG. 6B taken along line H in accordance with various embodiments;
圖7A繪示根據各種實施例之具有安裝於一第一位置中之一底部饋送彈匣之一模組化導電武器之一側視圖;7A depicts a side view of a modular conductive weapon having a bottom-fed magazine mounted in a first position, according to various embodiments;
圖7B繪示根據各種實施例之沿線A取得之具有安裝於一第一位置中之一底部饋送彈匣之一模組化導電武器之一俯視橫截面圖;7B depicts a top cross-sectional view of a modular conductive weapon with a bottom-fed magazine mounted in a first position, taken along line A, in accordance with various embodiments;
圖8A繪示根據各種實施例之具有安裝於一第一位置中之一底部饋送彈匣之一模組化導電武器之一前端視圖;8A depicts a front end view of a modular conductive weapon having a bottom-fed magazine mounted in a first position, according to various embodiments;
圖8B繪示根據各種實施例之沿線D取得之具有安裝於一第一位置中之一底部饋送彈匣、具有向下偏置之一前向匣止動件之一模組化導電武器之圖8A之一側視橫截面圖;8B depicts a diagram of a modular conductive weapon with a bottom feed magazine mounted in a first position, with a forward magazine stop biased downward, taken along line D in accordance with various embodiments A side cross-sectional view of one of 8A;
圖8C繪示根據各種實施例之包含具有向下偏置之一匣止動件之一模組化導電武器之圖8B之細節F之一放大側視橫截面圖;8C depicts an enlarged side cross-sectional view of detail F of FIG. 8B including a modular conductive weapon with a cartridge stop that is biased downward, according to various embodiments;
圖9A繪示根據各種實施例之不含安裝於一第二位置中之一底部饋送彈匣之一模組化導電武器之一側視圖;9A depicts a side view of a modular conductive weapon without a bottom-fed magazine mounted in a second position, according to various embodiments;
圖9B繪示根據各種實施例之沿線B取得之處於一第二位置中之一模組化導電武器之圖9A之一俯視橫截面圖;9B depicts a top cross-sectional view of FIG. 9A of a modular conductive weapon in a second position taken along line B in accordance with various embodiments;
圖10A繪示根據各種實施例之不含安裝於一第二位置中之一底部饋送彈匣之一模組化導電武器之一前端視圖;10A illustrates a front view of a modular conductive weapon without a bottom-fed magazine mounted in a second position, according to various embodiments;
圖10B繪示根據各種實施例之沿線E取得之具有向下偏置之一前向匣止動件之處於一第二位置中之一模組化導電武器之圖10A之一側視橫截面圖;10B depicts a side cross-sectional view of FIG. 10A of a modular conductive weapon in a second position with a downwardly biased forward pocket stop, taken along line E, in accordance with various embodiments ;
圖10C繪示根據各種實施例之包含具有向下偏置之一前向匣止動件之一模組化導電武器之圖10B之細節G之一放大側視橫截面圖;10C depicts an enlarged side cross-sectional view of Detail G of FIG. 10B including a modular conductive weapon with a downwardly biased forward pocket stop, according to various embodiments;
圖11A繪示根據各種實施例之不含安裝於一第一位置(向前橫移以排出一部署單元)中之一底部饋送彈匣之一模組化導電武器之一側視圖;11A depicts a side view of a modular conductive weapon without a bottom-fed magazine installed in a first position (traversed forward to eject a deployment unit) in accordance with various embodiments;
圖11B繪示根據各種實施例之沿線C取得之處於一第一位置(向前橫移)中之一模組化導電武器之圖11A之一俯視橫截面圖;11B depicts a top cross-sectional view of FIG. 11A of a modular conductive weapon in a first position (traverse forward) taken along line C in accordance with various embodiments;
圖12A繪示根據各種實施例之包括處於一關閉操作位置中之一尾托彈匣之一模組化導電武器之一透視圖;12A depicts a perspective view of a modular conductive weapon including a stock magazine in a closed operating position, according to various embodiments;
圖12B繪示根據各種實施例之包括處於一打開裝載位置中之一尾托彈匣之一模組化導電武器之一透視圖;12B depicts a perspective view of a modular conductive weapon including a stock magazine in an open stowage position, according to various embodiments;
圖13A繪示根據各種實施例之包括處於一打開裝載位置中之一尾托彈匣之一模組化導電武器之一分解透視圖,其中部署單元裝載於一模組化外殼內,一部署單元保留於尾托彈匣內且模組化外殼與一轉換配接器分離;13A depicts an exploded perspective view of a modular conductive weapon including a stock magazine in an open stowage position with a deployment unit loaded within a modular housing, a deployment unit, according to various embodiments Retains in stock magazine and modular housing is detached from a conversion adapter;
圖13B繪示根據各種實施例之圖13A之一模組化導電武器之一前端視圖;13B depicts a front view of the modular conductive weapon of FIG. 13A in accordance with various embodiments;
圖13C繪示根據各種實施例之沿線B之圖13B之一部分橫截面圖,其中一前向匣止動件向下偏置且一部署單元保留於一尾托彈匣內;13C depicts a partial cross-sectional view of FIG. 13B along line B with a forward magazine stop biased downward and a deployment unit retained within a stock magazine in accordance with various embodiments;
圖14A繪示根據各種實施例之安裝有一尾托彈匣之一模組化導電武器之一前端視圖;14A depicts a front view of a modular conductive weapon with a stock magazine mounted in accordance with various embodiments;
圖14B繪示根據各種實施例之沿線A取得之具有向上偏置之一前向匣止動件之處於一第一位置中之一模組化導電武器之圖14A之一側視橫截面圖;14B depicts a side cross-sectional view of FIG. 14A of a modular conductive weapon in a first position with an upwardly biased forward pocket stop, taken along line A, in accordance with various embodiments;
圖15A繪示根據各種實施例之用於一模組化導電武器之一部署單元;15A illustrates a deployment unit for a modular conductive weapon in accordance with various embodiments;
圖15B繪示根據各種實施例之用於具有經部署射彈之一模組化導電武器之一部署單元;15B depicts a deployment unit for a modular conductive weapon with deployed projectiles, according to various embodiments;
圖16繪示根據各種實施例之具有一動作式握把之一模組化導電武器之一透視圖;及16 depicts a perspective view of a modular conductive weapon with an action grip in accordance with various embodiments; and
圖17繪示根據各種實施例之具有一手柄之一模組化導電武器之一透視圖。17 shows a perspective view of a modular conductive weapon with a handle in accordance with various embodiments.
圖式中之元件及步驟僅為了簡單及清楚繪示且未必根據任何特定序列來呈現。例如,圖式中繪示可同時或依不同次序執行之步驟以幫助提高對本發明之實施例之理解。The elements and steps in the figures are merely illustrated for simplicity and clarity and have not necessarily been presented according to any particular sequence. For example, the figures depict steps that may be performed simultaneously or in different orders to help improve understanding of embodiments of the invention.
200:MCEW 200:MCEW
204:安裝表面 204: Mounting Surface
207-1:前瞄準器 207-1: Front Sight
207-2:後瞄準器 207-2: Rear sight
210:模組化外殼 210: Modular enclosure
211:對置側壁 211: Opposite side walls
212:轉換端 212: Conversion terminal
213:機架 213: Rack
214:部署端 214: Deployment side
215:配件埠 215: Accessory port
216:前握把 216: Front Grip
217:觸發器 217: Trigger
218:導引通道 218: Guide channel
219:雷射瞄準器 219: Laser Sight
222:轉換配接器 222: Conversion adapter
224:彈匣室配接器 224: Magazine Chamber Adapter
232-1:彈匣釋放器 232-1: Magazine Release
234:梭動機構 234: Shuttle mechanism
236:梭子 236: Shuttle
239:前向坡道 239: Forward Ramp
240:梭動彈簧 240: Shuttle spring
242:梭桿 242: Shuttle lever
244:上部 244: Upper
246:臂 246: Arm
248:彈簧臂 248: Spring Arm
250:卡掣 250: Lock
254:橫桿 254: Crossbar
256:螺釘 256: Screws
258:孔隙 258: Pore
270:手柄 270: handle
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US202063069949P | 2020-08-25 | 2020-08-25 | |
US63/069,949 | 2020-08-25 |
Publications (1)
Publication Number | Publication Date |
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TW202217223A true TW202217223A (en) | 2022-05-01 |
Family
ID=81291743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110131493A TW202217223A (en) | 2020-08-25 | 2021-08-25 | Modular conducted electrical weapon |
Country Status (2)
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TW (1) | TW202217223A (en) |
WO (1) | WO2022086625A2 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7778004B2 (en) * | 2005-09-13 | 2010-08-17 | Taser International, Inc. | Systems and methods for modular electronic weaponry |
US8261666B2 (en) * | 2008-10-26 | 2012-09-11 | Rakesh Garg | Charging holder for a non-lethal projectile |
US8701325B1 (en) * | 2012-10-22 | 2014-04-22 | William V. S. Rayner | Duplex weapon system |
EP3911915A4 (en) * | 2019-01-18 | 2023-01-04 | Axon Enterprise, Inc. | Vehicle with a conducted electrical weapon |
-
2021
- 2021-08-25 TW TW110131493A patent/TW202217223A/en unknown
- 2021-08-25 WO PCT/US2021/047457 patent/WO2022086625A2/en active Application Filing
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WO2022086625A2 (en) | 2022-04-28 |
WO2022086625A3 (en) | 2022-06-09 |
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