TW202212811A - Method of detecting a surface defect on an object and system thereof - Google Patents

Method of detecting a surface defect on an object and system thereof Download PDF

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TW202212811A
TW202212811A TW109132977A TW109132977A TW202212811A TW 202212811 A TW202212811 A TW 202212811A TW 109132977 A TW109132977 A TW 109132977A TW 109132977 A TW109132977 A TW 109132977A TW 202212811 A TW202212811 A TW 202212811A
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laser
module
axis
detection module
laser detection
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TWI779357B (en
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劉逸文
周孫甫
胡欣成
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南亞科技股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106General arrangement of respective parts
    • G01N2021/0112Apparatus in one mechanical, optical or electronic block
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N2021/8461Investigating impurities in semiconductor, e.g. Silicon

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Abstract

A method of detecting a surface defect on an object is provided in some embodiments in the present disclosure, including: providing an object; providing a system for detecting a surface defect on an object, including a laser emitting module, a laser detecting module and an analyzation module, in which the laser detecting module is linked to the laser emitting module, and the analyzation module is linked to the laser detecting module; emitting a laser to a surface of an object using the laser emitting module; detecting a plurality of emitted positions emitted by the laser using the laser detecting module; analyzing a surface feature, based on the plurality of emitted positions, using the analyzation module; identifying whether a surface detect is existed in the surface, based on the surface feature.

Description

偵測物品表面缺陷的方法及其系統Method and system for detecting surface defects of articles

本揭示內容涉及偵測表面缺陷的方法及其系統。具體來說,本揭示內容涉及使用雷射光偵測表面缺陷的方法及其系統。The present disclosure relates to methods and systems for detecting surface defects. In particular, the present disclosure relates to methods and systems for detecting surface defects using laser light.

半導體製程中,部分製程例如高溫或是元件轉移過程的摩擦或碰撞等,可能造成晶圓或是晶圓處理設備中的元件產生表面缺陷(例如熱熔痕或是刮痕),影響後續製程的良率。舉例而言,當晶圓存放載具內緣存在表面缺陷時,易造成機械手臂在存取晶圓時,受到表面缺陷的干涉,造成晶圓破片。In the semiconductor manufacturing process, some processes, such as high temperature or friction or collision during the component transfer process, may cause surface defects (such as hot melt marks or scratches) on the wafer or components in the wafer processing equipment, affecting the subsequent process. Yield. For example, when there is a surface defect on the inner edge of the wafer storage carrier, it is easy to cause the robot arm to be interfered by the surface defect when accessing the wafer, resulting in wafer breakage.

現行檢查表面缺陷的方法,主要是依靠人眼判讀或是自動光學檢測系統。然而,當表面缺陷較不明顯時,人眼判讀容易漏檢,至於自動光學檢測系統,則有燈光以及擷取角度的限制,若燈光不足或擷取角度不適當,也容易漏檢,此外,解析度也存在著限制。The current methods for inspecting surface defects mainly rely on human eye interpretation or automatic optical inspection systems. However, when the surface defects are less obvious, the human eye may easily miss the inspection. As for the automatic optical inspection system, there are limitations on the lighting and the capture angle. If the light is insufficient or the capture angle is not appropriate, it is easy to miss the inspection. In addition, Resolution is also limited.

因此,如何能提供無須燈光並且高解析度,即能偵測物品表面缺陷的方法以及系統,是亟欲解決的問題。Therefore, how to provide a method and a system for detecting surface defects of objects without lighting and with high resolution is an urgent problem to be solved.

本揭示內容中的一態樣是提供一種提供偵測物品的表面缺陷的方法,包含:提供物品;提供偵測物品表面缺陷的系統,包含:雷射發射模組、雷射偵測模組、及分析模組,雷射偵測模組電性連接雷射發射模組,分析模組電性連接雷射偵測模組;使用雷射發射模組,發射雷射光至物品的表面;步驟,使用雷射偵測模組,偵測雷射光照射至表面時的複數個照射位置;使用分析模組,基於複數個照射位置,分析表面的表面特徵;基於表面特徵,判定表面是否存在表面缺陷。One aspect of the present disclosure is to provide a method for detecting surface defects of an article, including: providing an article; providing a system for detecting surface defects of an article, including: a laser emission module, a laser detection module, and an analysis module, the laser detection module is electrically connected to the laser emission module, and the analysis module is electrically connected to the laser detection module; the laser emission module is used to emit laser light to the surface of the article; the steps are: Use the laser detection module to detect multiple irradiation positions when the laser light is irradiated to the surface; use the analysis module to analyze the surface features of the surface based on the multiple irradiation positions; based on the surface features, determine whether there are surface defects on the surface.

在一些實施方式中,物品包括晶圓、或晶圓處理設備中的元件。In some embodiments, the articles comprise wafers, or components in wafer processing equipment.

在一些實施方式中,表面缺陷包括物理性損傷。In some embodiments, the surface defects include physical damage.

在一些實施方式中,雷射光發射單束光或扇形光。In some embodiments, the laser light emits a single beam of light or a fan of light.

在一些實施方式中,若將沿雷射光的發射點垂直於表面的方向所平行的座標軸設定為X軸,並將與表面上的任一方向所平行的座標軸設定為Y軸,則複數個照射位置中任一者的資訊包括X軸座標與Y軸座標。In some embodiments, if the coordinate axis parallel to the direction of the emission point of the laser light perpendicular to the surface is set as the X axis, and the coordinate axis parallel to any direction on the surface is set as the Y axis, then a plurality of irradiation The information of any one of the positions includes an X-axis coordinate and a Y-axis coordinate.

在一些實施方式中,分析表面的表面特徵步驟,包括呈現複數個照射位置的複數個Y軸座標與對應複數個Y軸座標之複數個X軸座標。In some embodiments, the step of analyzing the surface features of the surface includes presenting a plurality of Y-axis coordinates of a plurality of irradiation positions and a plurality of X-axis coordinates corresponding to the plurality of Y-axis coordinates.

在一些實施方式中,判定表面是否存在表面缺陷步驟,包括如果第一Y軸座標以及與第一Y軸座標相鄰的第二Y軸座標,所分別對應之第一X軸座標以及第二X軸座標的差值大於特定數值,則判定表面存在表面缺陷。In some embodiments, the step of judging whether there is a surface defect on the surface includes, if the first Y-axis coordinate and the second Y-axis coordinate adjacent to the first Y-axis coordinate, the corresponding first X-axis coordinate and the second X-axis coordinate respectively If the difference between the axis coordinates is greater than a certain value, it is determined that the surface has surface defects.

本揭示內容中的另一態樣是提供一種提供偵測物品表面缺陷的系統,包含:至少一個雷射發射模組,用以發射雷射光至物品的表面、至少一個雷射偵測模組以及分析模組,雷射發射模組設置於雷射偵測模組上,雷射偵測模組用以偵測雷射光照射至表面時的複數個照射位置,以及分析模組電性連接雷射偵測模組。Another aspect of the present disclosure is to provide a system for detecting surface defects of an article, comprising: at least one laser emission module for emitting laser light to the surface of the article, at least one laser detection module, and The analysis module, the laser emission module is arranged on the laser detection module, the laser detection module is used for detecting a plurality of irradiation positions when the laser light irradiates the surface, and the analysis module is electrically connected to the laser Detection module.

在一些實施方式中,偵測物品表面缺陷的系統更包含複數個雷射發射模組、複數個雷射偵測模組或其組合,其中複數個雷射發射模組設置於其中一個雷射偵測模組上,或是複數個雷射發射模組以一對一的方式分別設置於複數個雷射偵測模組上。In some embodiments, the system for detecting surface defects of articles further includes a plurality of laser emission modules, a plurality of laser detection modules or a combination thereof, wherein the plurality of laser emission modules are disposed in one of the laser detection modules. On the measuring module, or a plurality of laser emission modules are respectively arranged on a plurality of laser detection modules in a one-to-one manner.

在一些實施方式中,分析模組包含自動化判讀元件用以根據複數個照射位置,判讀物品是否存在表面缺陷。In some embodiments, the analysis module includes an automatic interpretation element for interpreting whether the article has surface defects according to a plurality of irradiation positions.

在一些實施方式中,更包含輸送裝置,輸送裝置承載雷射發射模組以及雷射偵測模組,以輸送雷射發射模組以及雷射偵測模組至待測位置,並且雷射偵測模組藉由輸送裝置電性連接分析模組。In some embodiments, a conveying device is further included, and the conveying device carries the laser emission module and the laser detection module, so as to convey the laser emission module and the laser detection module to the position to be measured, and the laser detection module The measuring module is electrically connected to the analysis module through the conveying device.

應當理解,前述的一般性描述和下文的詳細描述都是示例,並且旨在提供對所要求保護的本揭示內容的進一步解釋。It is to be understood that both the foregoing general description and the following detailed description are examples and are intended to provide further explanation of the disclosure as claimed.

可以理解的是,下述內容提供的不同實施方式或實施例可實施本揭露之標的不同特徵。特定構件與排列的實施例係用以簡化本揭露而非侷限本揭露。當然,這些僅是實施例,並且不旨在限制。舉例來說,以下所述之第一特徵形成於第二特徵上的敘述包含兩者直接接觸,或兩者之間隔有其他額外特徵而非直接接觸。此外,本揭露在複數個實施例中可重複參考數字及/或符號。這樣的重複是為了簡化和清楚,而並不代表所討論的各實施例及/或配置之間的關係。It will be appreciated that different implementations or examples provided in the following may implement different features of the subject matter of the present disclosure. The embodiments of specific components and arrangements are used to simplify the disclosure and not to limit the disclosure. Of course, these are only examples and are not intended to be limiting. For example, the description below that the first feature is formed on the second feature includes the two being in direct contact, or there are other additional features between the two that are not in direct contact. Furthermore, the present disclosure may repeat reference numerals and/or symbols in the various embodiments. Such repetition is for simplicity and clarity and does not represent a relationship between the various embodiments and/or configurations discussed.

本說明書中所用之術語一般在本領域以及所使用之上下文中具有通常性的意義。本說明書中所使用的實施例,包括本文中所討論的任何術語的例子僅是說明性的,而不限制本揭示內容或任何示例性術語的範圍和意義。同樣地,本揭示內容不限於本說明書中所提供的一些實施方式。Terms used in this specification generally have their ordinary meanings in the art and in the context in which they are used. The examples used in this specification, including examples of any terms discussed herein, are illustrative only and do not limit the scope and meaning of the disclosure or any exemplified terms. Likewise, the present disclosure is not limited to some of the implementations provided in this specification.

將理解的是,儘管本文可以使用術語第一、第二等來描述各種元件,但是這些元件不應受到這些術語的限制。這些術語用於區分一個元件和另一個元件。舉例來說,在不脫離本實施方式的範圍的情況下,第一元件可以被稱為第二元件,並且類似地,第二元件可以被稱為第一元件。It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present embodiments.

於本文中,術語“和/或”包含一個或複數個相關聯的所列項目的任何和所有組合。As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

於本文中,術語「包含」、「包括」、「具有」等應理解為開放式,即,意指包括但不限於。As used herein, the terms "comprising", "including", "having" and the like should be construed as open ended, ie, meaning including but not limited to.

請見第1圖以及第2圖,第1圖示例性地描述根據本揭示內容的一些實施方式中偵測物品的表面缺陷的方法100的流程,而第2圖則示例性地描述根據本揭示內容的一些實施方式中偵測物品的表面缺陷的方法100的立體透視圖。在一些實施方式中,表面缺陷是任何物品300的表面不同於原始形貌的狀態。例如失去原始平整樣貌。在一些實施方式中,表面缺陷是物品300受到物理性損傷 (高溫、摩擦或撞擊等)所產生的熱熔痕或是刮痕等,但不以此為限。Please refer to FIG. 1 and FIG. 2, FIG. 1 exemplarily describes the flow of a method 100 for detecting surface defects of an article according to some embodiments of the present disclosure, and FIG. 2 exemplarily describes the process according to the present disclosure. A perspective view of a method 100 of detecting surface defects of an article in some embodiments of the disclosure. In some embodiments, a surface defect is a state in which the surface of any item 300 differs from the original topography. For example, the original flat appearance is lost. In some embodiments, the surface defect is a thermal fusion mark or a scratch caused by physical damage (high temperature, friction or impact, etc.) to the article 300, but not limited thereto.

偵測物品的表面缺陷的方法100包含步驟S110至步驟S160,分別為步驟S110,提供物品300;步驟S120,提供偵測物品表面缺陷的系統200,包含:雷射發射模組210、雷射偵測模組220、及分析模組230;步驟S130,使用雷射發射模組210,發射雷射光至物品300的表面;步驟S140,使用雷射偵測模組220,偵測雷射光照射至表面時的複數個照射位置;步驟S150,使用分析模組230,基於複數個照射位置,分析表面的表面特徵;最後,步驟S160,基於表面特徵,判定表面是否存在表面缺陷。The method 100 for detecting surface defects of an article includes steps S110 to S160, respectively step S110, providing the article 300; step S120, providing a system 200 for detecting surface defects of the article, including: a laser emission module 210, a laser detection The measurement module 220 and the analysis module 230; step S130, use the laser emission module 210 to emit laser light to the surface of the article 300; step S140, use the laser detection module 220 to detect the laser light irradiated to the surface In step S150, the analysis module 230 is used to analyze the surface features of the surface based on the plurality of irradiation positions; finally, in step S160, based on the surface features, it is determined whether the surface has surface defects.

首先,執行步驟S110,提供物品300。在一些實施方式中,物品300包括晶圓、晶圓處理設備中的元件,例如晶圓存放載體或晶圓轉移元件。First, step S110 is performed, and the article 300 is provided. In some embodiments, article 300 includes a wafer, an element in a wafer processing apparatus, such as a wafer storage carrier or wafer transfer element.

接著,執行步驟S120,提供偵測物品表面缺陷的系統200,包含:雷射發射模組210、雷射偵測模組220,以及分析模組230。在一些實施方式中,雷射偵測模組220電性連接雷射發射模組210,分析模組230電性連接雷射偵測模組220,其中雷射發射模組210用以發射雷射光至物品300的表面,雷射偵測模組220用以偵測雷射光照射至表面時的照射位置。在一些實施方式中,雷射偵測模組220設置於雷射發射模組210上。在一些實施方式中,雷射發射模組210以及雷射偵測模組220可根據待測的物品300大小調整,例如可將雷射發射模組210以及雷射偵測模組220微小化,使雷射發射模組210以及雷射偵測模組220可伸入晶圓存放載體的晶圓容置空間。Next, step S120 is performed to provide a system 200 for detecting surface defects of articles, including a laser emission module 210 , a laser detection module 220 , and an analysis module 230 . In some embodiments, the laser detection module 220 is electrically connected to the laser emission module 210, and the analysis module 230 is electrically connected to the laser detection module 220, wherein the laser emission module 210 is used for emitting laser light To the surface of the article 300, the laser detection module 220 is used for detecting the irradiation position when the laser light is irradiated to the surface. In some embodiments, the laser detection module 220 is disposed on the laser emission module 210 . In some embodiments, the laser emission module 210 and the laser detection module 220 can be adjusted according to the size of the object 300 to be tested, for example, the laser emission module 210 and the laser detection module 220 can be miniaturized, The laser emission module 210 and the laser detection module 220 can extend into the wafer accommodating space of the wafer storage carrier.

接著,執行步驟S130,使用雷射發射模組210,發射雷射光至物品300的表面。在一些實施方式中,雷射光發射單束光或扇形光,波長可以為400nm至700,例如400nm、405nm、410nm、420nm、430nm、440nm、450nm、460nm、470nm、480nm、490nm、500nm、510nm、520nm、530nm、540nm、550nm、560nm、570nm、580nm、590nm、600nm、610nm、620nm、630nm、640nm、650nm 660nm、670nm、680nm、690nm、700nm、或其組合,但不以此為限。Next, step S130 is performed, and the laser emission module 210 is used to emit laser light to the surface of the article 300 . In some embodiments, the laser light emits a single beam of light or a fan-shaped light with wavelengths ranging from 400 nm to 700, such as 400 nm, 405 nm, 410 nm, 420 nm, 430 nm, 440 nm, 450 nm, 460 nm, 470 nm, 480 nm, 490 nm, 500 nm, 510 nm, 520nm, 530nm, 540nm, 550nm, 560nm, 570nm, 580nm, 590nm, 600nm, 610nm, 620nm, 630nm, 640nm, 650nm, 660nm, 670nm, 680nm, 690nm, 700nm, or a combination thereof, but not limited thereto.

接著,執行步驟S140,使用雷射偵測模組220,偵測雷射光照射至表面時的複數個照射位置。在一些實施方式中,雷射偵測模組220將複數個照射位置的資訊即時回傳至分析模組230,供分析模組230分析表面的表面特徵(例如平坦、凹洞、突起等特徵)。在一些實施方式中,雷射偵測模組220包含拍攝元件,可供雷射偵測模組220在偵測照射位置的同時,拍攝表面的即時影像,回傳至分析模組230。Next, step S140 is executed, and the laser detection module 220 is used to detect a plurality of irradiation positions when the laser light is irradiated to the surface. In some embodiments, the laser detection module 220 transmits the information of the plurality of irradiation positions back to the analysis module 230 in real time, so that the analysis module 230 can analyze the surface features (such as flatness, concave, protrusion, etc.) of the surface. . In some embodiments, the laser detection module 220 includes a photographing element, which allows the laser detection module 220 to capture a real-time image of the surface while detecting the irradiation position, and send it back to the analysis module 230 .

在一些實施方式中,若將雷射光的發射點垂直於表面的方向所平行的座標軸設定為X軸,將與表面上的任一方向所平行的座標軸設定為Y軸,並對應X軸以及Y軸定義出Z軸(即,Z軸垂直於X軸與Y軸),則照射位置的資訊包括X軸座標與Y軸座標或是X軸座標、Y軸座標以及Z軸座標。In some embodiments, if the coordinate axis parallel to the direction of the emission point of the laser light perpendicular to the surface is set as the X axis, and the coordinate axis parallel to any direction on the surface is set as the Y axis, and corresponds to the X axis and the Y axis The axis defines the Z axis (that is, the Z axis is perpendicular to the X axis and the Y axis), and the information of the irradiation position includes the X axis coordinates and the Y axis coordinates or the X axis coordinates, the Y axis coordinates and the Z axis coordinates.

在一些實施方式中,可以手持雷射發射模組210以及雷射偵測模組220,進行表面缺陷的偵測,例如使雷射發射模組210以及雷射偵測模組220沿著Y軸或是Z軸移動,偵測雷射光的照射位置。在一些實施方式中,偵測物品300的表面缺陷的系統200還可包含輸送裝置240,請見第3圖。輸送裝置240承載雷射發射模組210以及雷射偵測模組220,輸送雷射發射模組210以及雷射偵測模組220至待測位置執行偵測,並且雷射偵測模組220藉由輸送裝置240電性連接分析模組230,以回傳照射位置的資訊。在一實施方式中,輸送裝置240可以是機器手臂。In some embodiments, the laser emission module 210 and the laser detection module 220 can be held by hand to detect surface defects, for example, the laser emission module 210 and the laser detection module 220 can be moved along the Y axis Or move the Z axis to detect the irradiation position of the laser light. In some embodiments, the system 200 for detecting surface defects of the article 300 may further include a conveying device 240 , see FIG. 3 . The conveying device 240 carries the laser emission module 210 and the laser detection module 220 , and conveys the laser emission module 210 and the laser detection module 220 to the position to be measured to perform detection, and the laser detection module 220 The analysis module 230 is electrically connected to the transmission device 240 to return the information of the irradiation position. In one embodiment, the delivery device 240 may be a robotic arm.

在一些實施方式中,雷射光至表面需維持適當的間距L,以利雷射偵測模組220偵測照射位置的資訊,間距L可大於40毫米,例如40毫米至200毫米(舉例而言40毫米、50毫米、60毫米、70毫米、80毫米、90毫米、100毫米、110毫米、120毫米、130毫米、140毫米、150毫米、160毫米、170毫米、180毫米、190毫米、200毫米、或其前述任意區間之數值),但不限於此。In some embodiments, a proper distance L needs to be maintained between the laser light and the surface, so that the laser detection module 220 can detect the information of the irradiation position, and the distance L can be greater than 40 mm, such as 40 mm to 200 mm (for example, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm, 100mm, 110mm, 120mm, 130mm, 140mm, 150mm, 160mm, 170mm, 180mm, 190mm, 200mm , or the numerical value of any of the foregoing ranges), but not limited thereto.

在一些實施方式中,雷射光為扇型光時,扇型光照射至表面時,表面接收到扇形光的寬度W至少為20毫米,例如20毫米至150毫米 (舉例而言20毫米、30毫米、40毫米、50毫米、60毫米、70毫米、80毫米、90毫米、100毫米、110毫米、120毫米、130毫米、140毫米、150毫米、或其前述任意區間之數值),但不限於此。In some embodiments, when the laser light is fan-shaped light, when the fan-shaped light irradiates the surface, the width W of the fan-shaped light received by the surface is at least 20 mm, such as 20 mm to 150 mm (for example, 20 mm, 30 mm , 40 mm, 50 mm, 60 mm, 70 mm, 80 mm, 90 mm, 100 mm, 110 mm, 120 mm, 130 mm, 140 mm, 150 mm, or any of the foregoing values), but not limited to .

在一些實施方式中,雷射偵測模組220的解析度可以為10微米至150微米(舉例而言10微米、20毫米、30毫米、40毫米、50毫米、60毫米、70毫米、80毫米、90毫米、100毫米、110毫米、120毫米、130毫米、140毫米、150毫米、或其前述任意區間之數值),但不限於此。應了解的是,雷射偵測模組220因偵測雷射光的照射位置,無須額外照光即可實施,還具有較人眼辨識或是自動光學檢測系統更高的解析度。In some embodiments, the resolution of the laser detection module 220 can be 10 microns to 150 microns (for example, 10 microns, 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, 70 mm, 80 mm , 90 mm, 100 mm, 110 mm, 120 mm, 130 mm, 140 mm, 150 mm, or any value in the aforementioned interval), but not limited thereto. It should be understood that the laser detection module 220 can detect the irradiation position of the laser light without additional illumination, and has a higher resolution than human eye recognition or automatic optical detection systems.

在一些實施方式中,偵測物品表面缺陷的系統200可以包含一或複數個雷射發射模組210以及一或複數個雷射偵測模組220。在一些實施方式中,可以將複數個雷射發射模組210設置於一個雷射偵測模組220上。例如請見第4A圖至第4F圖,例示雷射發射模組210以及雷射偵測模組210的組合的態樣。第4A圖例示將兩個雷射發射模組210呈180度水平相對設置於一個雷射偵測模組220上。第4B圖以及第4C圖例示分別設置三個或四個雷射發射模組210於一個雷射偵測模組220上,其中各雷射發射模組210位於同一水平面上,並依次以90度旋轉排列。在一些實施方式中,偵測物品表面缺陷的系統200也可以在一個雷射發射模組210搭配一個雷射偵測模組220,組成一個雷射接收群組的一對一的基礎下,將複數個雷射發射模組210與複數個雷射偵測模組220組合設置為多個雷射接收群組的態樣,據此獲得多道雷射光的照射位置的資訊,提升偵測效率。第4D圖例示兩個雷射接收群組的組合,各別雷射接收群組間以雷射偵測模組220相對排列,使得雷射發射模組210間呈180度相對排列。第4E圖則例示三個雷射接收群組的組合,三個雷射接收群組分別透過雷射偵測模組220相互貼合,使得各雷射發射模組210位於同一水平面上,並經90度旋轉或依次排列介於180度之間,例如各雷射發射模組210分別位於0度、90度、及180度的位置上。第4F圖則是例示四個雷射接收群組的組合,進一步將兩組相似於第4D圖態樣的雷射接收群組相互貼合,並微幅改變雷射發射模組210的角度,使位於同一平面相鄰的雷射發射模組210之間朝向不同方向,以期提升雷射光的可偵測範圍。以上實施態樣,可以經由使用一個雷射偵測模組220搭配多個雷射發射模組210,或是使用多個雷射接收群組 (一個雷射偵測模組220搭配一個雷射發射模組210)的方式,同時偵測複數道雷射光的照射位置的資訊,相較於只設置單個雷射發射模組210,提升偵測效率。In some embodiments, the system 200 for detecting surface defects of articles may include one or more laser emission modules 210 and one or more laser detection modules 220 . In some embodiments, a plurality of laser emission modules 210 may be disposed on one laser detection module 220 . For example, please refer to FIG. 4A to FIG. 4F , which illustrate the combination of the laser emission module 210 and the laser detection module 210 . FIG. 4A illustrates that two laser emitting modules 210 are disposed on one laser detection module 220 horizontally opposite to each other at 180 degrees. 4B and 4C illustrate that three or four laser emitting modules 210 are respectively disposed on one laser detection module 220 , wherein each laser emitting module 210 is located on the same horizontal plane and is arranged at a 90-degree angle in turn. Rotation arrangement. In some embodiments, the system 200 for detecting surface defects of articles can also combine a laser emitting module 210 with a laser detection module 220 to form a laser receiving group on a one-to-one basis. The plurality of laser emission modules 210 and the plurality of laser detection modules 220 are combined to form a plurality of laser receiving groups, thereby obtaining the information of the irradiation positions of the plurality of laser beams, thereby improving the detection efficiency. FIG. 4D illustrates the combination of two laser receiving groups. The laser detecting modules 220 are arranged opposite to each other between the respective laser receiving groups, so that the laser emitting modules 210 are arranged 180 degrees opposite each other. FIG. 4E illustrates the combination of three laser receiving groups. The three laser receiving groups are respectively attached to each other through the laser detection modules 220 , so that the laser emission modules 210 are located on the same horizontal plane, and are The 90-degree rotation or the orderly arrangement is between 180 degrees, for example, the laser emitting modules 210 are respectively located at the positions of 0 degrees, 90 degrees, and 180 degrees. Fig. 4F illustrates the combination of four laser receiving groups, and further two groups of laser receiving groups similar to those in Fig. 4D are attached to each other, and the angle of the laser emitting module 210 is slightly changed. The adjacent laser emitting modules 210 located on the same plane face different directions, so as to increase the detectable range of the laser light. In the above implementation, one laser detection module 220 can be used with multiple laser emission modules 210, or multiple laser receiving groups can be used (one laser detection module 220 is matched with one laser emission module 210). module 210 ), simultaneously detecting the information of the irradiation positions of a plurality of laser beams, compared with only setting a single laser emitting module 210 , the detection efficiency is improved.

接著,執行步驟S150,使用分析模組230,基於複數個照射位置,分析表面的表面特徵;接著,執行步驟S160,基於表面特徵,判定表面是否存在表面缺陷。在一些實施方式中,分析表面的表面特徵步驟包括呈現複數個照射位置的複數個Y軸座標與對應複數個Y軸座標之複數個X軸座標。在一些實施方式中,請見第5A圖,如果第一Y軸座標Y1以及與第一Y軸座標相鄰的第二Y軸座標Y2,所分別對應之第一X軸座標X1以及第二X軸座標X2的差值大於特定數值 (舉例而言10微米、20毫米、30毫米、40毫米、50毫米、60毫米、70毫米、80毫米、90毫米、100毫米、110毫米、120毫米、130毫米、140毫米、150毫米、或其前述任意區間之數值),則判定表面存在表面缺陷。Next, step S150 is performed, and the analysis module 230 is used to analyze the surface features of the surface based on the plurality of irradiation positions; then, step S160 is performed to determine whether the surface has surface defects based on the surface features. In some embodiments, the step of analyzing the surface features of the surface includes presenting a plurality of Y-axis coordinates of a plurality of illumination locations and a plurality of X-axis coordinates corresponding to the plurality of Y-axis coordinates. In some embodiments, please refer to FIG. 5A, if the first Y-axis coordinate Y1 and the second Y-axis coordinate Y2 adjacent to the first Y-axis coordinate, the corresponding first X-axis coordinate X1 and the second X-axis coordinate respectively The difference of the axis coordinate X2 is greater than a certain value (for example, 10 microns, 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, 70 mm, 80 mm, 90 mm, 100 mm, 110 mm, 120 mm, 130 mm mm, 140 mm, 150 mm, or the value of any of the foregoing ranges), it is determined that the surface has surface defects.

在一實施方式中,請見第5B圖,例示針對存在表面缺陷的物品300,使用配置有兩個雷射發射模組210的偵測物品表面缺陷的系統200所獲得的照射位置的統整曲線圖,其中上下兩條線條表示分別由兩個雷射發射模組210接收到的訊號,圓圈框選處為表面缺陷的存在位置,曲線圖上呈現明顯斷點,並且相鄰的Y軸照射位置所對應的X軸照射位置的差值大於特定數值,表示存在表面缺陷。例如,相鄰的Y軸照射位置為約625 μm及約650 μm,對應的X軸照射位置為約8500 μm及約8250 μm,X軸差值約250 μm,則判定存在表面缺陷。In one embodiment, please refer to FIG. 5B , which illustrates an integrated curve of the irradiation position obtained by using the system 200 for detecting surface defects of the article configured with two laser emission modules 210 for an article 300 with surface defects. In the figure, the upper and lower lines represent the signals received by the two laser emitting modules 210 respectively, the circle frame is the position where the surface defect exists, the graph shows obvious break points, and the adjacent Y-axis irradiation positions The difference between the corresponding X-axis irradiation positions is greater than a certain value, indicating the existence of surface defects. For example, if the adjacent Y-axis irradiation positions are about 625 μm and about 650 μm, the corresponding X-axis irradiation positions are about 8500 μm and about 8250 μm, and the X-axis difference is about 250 μm, it is determined that there are surface defects.

在一實施方式中,分析模組230包含自動化判讀元件,可用於整合以及分析偵測物品表面缺陷的系統200所獲得的多個照射位置的資訊,並判讀表面是否存在表面缺陷。應了解到,本領域技術人員可依偵測需求,設定用於判定存在表面缺陷的X軸座標以及Y軸座標的條件。例如可以設定當Y軸的Y1與Y2的差值為100微米,而所對應的X軸的X1與X2大於200微米時,則判定存在表面缺陷。In one embodiment, the analysis module 230 includes an automatic interpretation element, which can be used to integrate and analyze the information of multiple irradiation positions obtained by the system 200 for detecting surface defects of the article, and to determine whether the surface has surface defects. It should be understood that those skilled in the art can set the conditions of the X-axis coordinate and the Y-axis coordinate for determining the existence of surface defects according to the detection requirements. For example, when the difference between Y1 and Y2 of the Y-axis is 100 microns, and the corresponding X1 and X2 of the X-axis are greater than 200 microns, it is determined that there is a surface defect.

在一些實施方式中,偵測物品表面缺陷的系統200同時可包含輸送裝置240以及自動化判讀元件,從而無須手持以及人工分析照射位置的資訊,即可完成表面缺陷的判定;此外,偵測物品表面缺陷的系統200還可以同時包含電性連接輸送裝置240的物品轉移模組,可將待測的相同品項的物品300轉移至雷射發射模組210以及雷射偵測模組220的實施位置,並將偵測完成的物品300移出實施位置。據此,無須人力即可全自動化的判定若干待測的物品300是否存在表面缺陷,不僅節省檢查時間以及人力,還可降低人力分析的失誤風險。In some embodiments, the system 200 for detecting surface defects of an article may include a conveying device 240 and an automatic interpretation element, so that the determination of surface defects can be completed without the need for hand-held and manual analysis of the irradiation position information; The defective system 200 can also include an item transfer module electrically connected to the conveying device 240 , which can transfer the items 300 of the same item to be tested to the implementation positions of the laser emission module 210 and the laser detection module 220 , and move the detected object 300 out of the implementation position. Accordingly, it is possible to fully automatically determine whether a number of objects 300 to be tested have surface defects without manpower, which not only saves inspection time and manpower, but also reduces the risk of errors in manpower analysis.

本揭示內容之一些實施方式所揭示之偵測物品的表面缺陷的方法及其系統,利用偵測雷射光照射於表面時,照射位置的高低落差,判讀物品是否存在表面缺陷,相較於習知的自動光學檢測系統或是人眼辨識,不僅偵測解析度不會受到照明亮度或是拍攝角度的影響,並且具有更佳的解析度,可分辨更細微的表面缺陷。The method and system for detecting surface defects of an article disclosed in some embodiments of the present disclosure utilize the height difference of the irradiated position when the laser light is irradiated on the surface to determine whether the article has surface defects, compared with the conventional method. The automatic optical inspection system or human eye recognition, not only the detection resolution is not affected by the illumination brightness or the shooting angle, but also has better resolution and can distinguish more subtle surface defects.

儘管本揭示內容已根據某些實施方式具體描述細節,其他實施方式也是可行的。因此,所附請求項的精神和範圍不應限於本文所記載的實施方式。While the present disclosure has been described in detail in terms of certain implementations, other implementations are possible. Therefore, the spirit and scope of the appended claims should not be limited to the embodiments described herein.

100:偵測物品的表面缺陷的方法 200:偵測物品表面缺陷的系統 210:雷射發射模組 220:雷射偵測模組 230:分析模組 240:輸送裝置 300:物品 W:寬度 L:間距 X:X軸 X1:第一X軸座標 X2:第二X軸座標 Y:Y軸 Z:Z軸 S110、S120、S130、S140、S150、S160:步驟 100: Method for detecting surface defects of articles 200: Systems for the detection of surface defects on items 210: Laser launch module 220: Laser detection module 230: Analysis Module 240: Conveyor 300:Item W: width L: Spacing X: X axis X1: the first X-axis coordinate X2: Second X-axis coordinate Y: Y axis Z: Z axis S110, S120, S130, S140, S150, S160: Steps

通過閱讀以下參考附圖對實施方式的詳細描述,可以更完整地理解本揭示內容。 第1圖示例性地描述根據本揭示內容的一些實施方式中偵測物品的表面缺陷的方法的流程; 第2圖示例性地描述根據本揭示內容的一些實施方式中偵測物品的表面缺陷的方法的立體透視圖; 第3圖示例性地描述根據本揭示內容的另一些實施方式中偵測物品的表面缺陷的方法的立體透視圖; 第4A圖至第4F圖示例性地描述根據本揭示內容的一些實施方式中雷射發射模組以及雷射偵測模組的組合的態樣; 第5A圖示例性地描述根據本揭示內容的一些實施方式中偵測物品的表面缺陷的立體透視圖;以及 第5B圖示例性地描述根據本揭示內容的一實施方式中,針對存在表面缺陷的物品,偵測物品表面缺陷的系統所獲得之照射位置的統整曲線圖。 A more complete understanding of the present disclosure can be obtained by reading the following detailed description of embodiments with reference to the accompanying drawings. FIG. 1 exemplarily depicts the flow of a method of detecting surface defects of an article in accordance with some embodiments of the present disclosure; FIG. 2 illustrates a perspective perspective view of a method of detecting surface defects of an article in accordance with some embodiments of the present disclosure; FIG. 3 illustrates a perspective perspective view of a method of detecting surface defects of an article in accordance with further embodiments of the present disclosure; FIGS. 4A-4F exemplarily describe aspects of the combination of the laser emission module and the laser detection module according to some embodiments of the present disclosure; FIG. 5A exemplarily depicts a perspective perspective view of detecting surface defects of an article in accordance with some embodiments of the present disclosure; and FIG. 5B exemplarily depicts an integrated graph of irradiation positions obtained by a system for detecting surface defects of an article for an article with surface defects, according to an embodiment of the present disclosure.

100:偵測物品的表面缺陷的方法 100: Method for detecting surface defects of articles

S110、S120、S130、S140、S150、S160:步驟 S110, S120, S130, S140, S150, S160: Steps

Claims (11)

一種偵測物品表面缺陷的方法,包含: 提供一物品; 提供一偵測物品表面缺陷的系統,該系統包含: 一雷射發射模組; 一雷射偵測模組,電性連接該雷射發射模組;以及 一分析模組,電性連接該雷射偵測模組; 使用該雷射發射模組,發射一雷射光至該物品的一表面; 使用該雷射偵測模組,偵測該雷射光照射至該表面時的複數個照射位置; 使用該分析模組,基於該複數個照射位置,分析該表面的一表面特徵;以及 基於該表面特徵,判定該表面是否存在表面缺陷。 A method of detecting surface defects of an article, comprising: provide an item; A system for detecting surface defects of articles is provided, the system comprising: a laser launch module; a laser detection module electrically connected to the laser emission module; and an analysis module, electrically connected to the laser detection module; using the laser emission module to emit a laser light to a surface of the object; Using the laser detection module to detect a plurality of irradiation positions when the laser light is irradiated to the surface; using the analysis module to analyze a surface feature of the surface based on the plurality of irradiation positions; and Based on the surface features, it is determined whether the surface has surface defects. 如請求項1所述的方法,其中該物品包括一晶圓、或一晶圓處理設備中的一元件。The method of claim 1, wherein the article comprises a wafer, or a component in a wafer processing facility. 如請求項1所述的方法,其中該表面缺陷包括一物理性損傷。The method of claim 1, wherein the surface defect comprises a physical damage. 如請求項1所述的方法,其中該雷射光發射一單束光或一扇形光。The method of claim 1, wherein the laser light emits a single beam of light or a fan-shaped light. 如請求項1所述的方法,其中若將沿該雷射光的發射點垂直於該表面的方向所平行的座標軸設定為X軸,並將與該表面上的任一方向所平行的座標軸設定為Y軸,則該複數個照射位置中任一者的資訊包括一X軸座標與一Y軸座標。The method of claim 1, wherein a coordinate axis parallel to a direction perpendicular to the surface of the laser light emission point is set as the X axis, and a coordinate axis parallel to any direction on the surface is set as Y-axis, the information of any one of the plurality of irradiation positions includes an X-axis coordinate and a Y-axis coordinate. 如請求項5所述的方法,其中分析該表面的該表面特徵步驟,包括呈現該複數個照射位置的複數個Y軸座標與對應該複數個Y軸座標之複數個X軸座標。The method of claim 5, wherein the step of analyzing the surface features of the surface includes presenting a plurality of Y-axis coordinates of the plurality of irradiation positions and a plurality of X-axis coordinates corresponding to the plurality of Y-axis coordinates. 如請求項5所述的方法,其中判定該表面是否存在表面缺陷步驟,包括如果一第一Y軸座標以及與該第一Y軸座標相鄰的一第二Y軸座標,所分別對應之一第一X軸座標以及一第二X軸座標的差值大於一特定數值,則判定該表面存在表面缺陷。The method of claim 5, wherein the step of determining whether the surface has surface defects includes if a first Y-axis coordinate and a second Y-axis coordinate adjacent to the first Y-axis coordinate correspond to one of If the difference between the first X-axis coordinate and a second X-axis coordinate is greater than a certain value, it is determined that the surface has surface defects. 一種偵測物品表面缺陷的系統,包含: 至少一雷射發射模組,用以發射一雷射光至一物品的一表面; 至少一雷射偵測模組,其中該雷射發射模組設置於該雷射偵測模組上,該雷射偵測模組用以偵測該雷射光照射至該表面時的複數個照射位置;以及 一分析模組,電性連接該雷射偵測模組。 A system for detecting surface defects of articles, comprising: at least one laser emitting module for emitting a laser light to a surface of an object; At least one laser detection module, wherein the laser emission module is disposed on the laser detection module, and the laser detection module is used for detecting a plurality of irradiations when the laser light irradiates the surface location; and An analysis module is electrically connected to the laser detection module. 如請求項8所述的系統,其中該系統更包含複數個雷射發射模組、複數個雷射偵測模組或其組合,其中該複數個雷射發射模組設置於該複數個雷射偵測模組的其中一者上,或是該複數個雷射發射模組以一對一的方式分別設置於該複數個雷射偵測模組上。The system of claim 8, wherein the system further comprises a plurality of laser emission modules, a plurality of laser detection modules, or a combination thereof, wherein the plurality of laser emission modules are disposed on the plurality of lasers One of the detection modules, or the plurality of laser emission modules are respectively disposed on the plurality of laser detection modules in a one-to-one manner. 如請求項8所述的系統,其中該分析模組包含一自動化判讀元件,用以根據該複數個照射位置,判讀該物品是否存在表面缺陷。The system of claim 8, wherein the analysis module includes an automatic interpretation element for judging whether the article has surface defects according to the plurality of irradiation positions. 如請求項8所述的系統,更包含一輸送裝置,該輸送裝置承載該雷射發射模組以及該雷射偵測模組,以輸送該雷射發射模組以及該雷射偵測模組至一待測位置,並且該雷射偵測模組藉由該輸送裝置電性連接該分析模組。The system of claim 8, further comprising a conveying device, the conveying device carries the laser emission module and the laser detection module for conveying the laser emission module and the laser detection module to a position to be measured, and the laser detection module is electrically connected to the analysis module through the conveying device.
TW109132977A 2020-09-23 2020-09-23 Method of detecting a surface defect on an object and system thereof TWI779357B (en)

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