TW202210920A - Device ensembles and coexistence management of devices - Google Patents

Abstract

Various devices (e.g., sensors and/or emitters) are disposed in a casing to form an ensemble are utilized to affect and/or control an environment of an enclosure (e.g., facility). A plurality of such ensembles may be disposed in the facility. Inter and/or intra coexistence issues may arise among the devices. Such coexistence is utilized and/or managed by a control and/or processing system. An ensemble may be integrated as a digital architectural element packaged as a capsule having a main body shell and a lid.

Description

Device set and device coexistence management

related applications

This application claims (a) from U.S. Provisional Patent Application Serial No. 63/079,851, filed September 17, 2020, entitled "DEVICE ENSEMBLES AND COEXISTENCE MANAGEMENT OF DEVICES," (b) ) from U.S. Provisional Patent Application Serial No. 63/034,792, filed June 4, 2020, entitled "DEVICE ENSEMBLES AND COEXISTENCE MANAGEMENT OF DEVICES" and (c) from May 2020 The priority of US Provisional Patent Application Serial No. 63/020,819, filed on the 6th, is entitled "DEVICE ENSEMBLES AND COEXISTENCE MANAGEMENT OF DEVICES". This application also claims International Patent Application Serial No. PCT entitled "INTERACTION BETWEEN AN ENCLOSURE AND ONE OR MORE OCCUPANTS" from April 15, 2021 application / US21/27418, which claims priority from an international patent application filed on September 21, 2020, entitled "INTERACTION BETWEEN AN ENCLOSURE AND ONE OR MORE OCCUPANTS" " of U.S. Provisional Patent Application Serial No. 63/080,899, from U.S. Patent Application Serial No. 63/080,899, filed July 16, 2020, entitled "INDIRECT INTERACTIVE INTERACTION WITH A TARGET IN AN ENCLOSURE" Provisional Application Serial No. 63/052,639 and U.S. Provisional Application Serial No. 63/ 010,977 priority. This application is also a continuation-in-part of International Patent Application Serial No. PCT/US21/15378 filed on January 28, 2021, entitled "Sensor Calibration and Operation", which International Patent Application Claims priority from US Provisional Patent Application Serial No. 62/967,204, filed January 29, 2020, entitled "SENSOR CALIBRATION AND OPERATION." Each of the above patent applications is incorporated herein by reference in its entirety.

At times, it may be beneficial to control (eg, monitor and/or adjust) the environmental characteristics of an enclosure (eg, a facility, such as a building). The building may be a smart building. For example, it may be beneficial to monitor individuals and their effects on the environmental characteristic(s) of the enclosure. For example, it may be beneficial to adjust the environmental characteristic(s) of the enclosure to accommodate, for example, the request(s) of the occupant(s). At times, communication (eg, automated communication) with the occupant(s) in the enclosure may be requested. Sensor(s) and transmitter(s) may facilitate this control and/or (eg, automatic) response.

Clusters of components (eg, sensors, transmitters, timing circuits, actuators, transmitters, and/or receivers) can be placed at various locations in an enclosure (eg, a building) for analysis, detection, and /or respond to: data, temperature, humidity, sound, electromagnetic waves, location, distance, movement, speed, vibration, volatile compounds (VOCs), dust, light, glare, color, gas and/or other enclosures manner. These components may be deployed in a collection having a common assembly (eg, a housing, such as a box) containing the components (eg, modules) of the requested grouping. The operation of different types of components in such (eg, multimodal) assemblies can sometimes deviate from the operation of at least one of the individual components. For example, near-end operation of sensors and transmitters can cause signal interference and/or erroneous readings. For example, the operation of a sensor configured to sense environmental characteristics of a signal type in close proximity to a transmitter emitting the same or similar signal type can induce false sensor readings.

A device or collection of devices, such as a module (eg, components such as sensors, transmitters, and/or processing circuits) may be configured as a multi-component assembly (also referred to herein as a "set"). Package (eg, physical integration) of the assembly and/or integration in various fixtures of the enclosure (eg, facility) imposes implications on the functionality of the component(s), the size of the set, the layout in the facility, and/or the cost challenge. Costs may include installation, maintenance, removal and/or replacement costs. For example, the installed assembly should be easily accessible when performing service, removal and/or replacement. The assembly should preferably be easy to embed via the network. Ease of installation, maintenance, removal, replacement, and/or network coupling may refer to the reduced time, effort, and/or expense required to accomplish any of these tasks. Additionally, it may be beneficial to have substantial computing power in a facility that can support the provision of services, such as data associated with components, data associated with facilities, and/or communicatively coupled to set(s) Information outside the facility.

Various aspects disclosed herein alleviate at least some of the disadvantages associated with potential interference between components deployed in close proximity.

Various aspects disclosed herein may exploit interference between components deployed in close proximity.

Various aspects disclosed herein can be related to sets (eg, assemblies, groups, and/or networks) of components deployed in close proximity, such as sensors, actuators, transmitters, transmitters, receivers or other elements (also referred to herein as "modules"), for example, to provide information and/or control functions related to occupant(s) in an enclosure (eg, a smart building). The integration of multiple components (eg, sensors, transmitters, actuators, transmitters, and/or receiver modules) in a single assembly (eg, package) allows all components to be installed at one time. Common packaging can reduce and/or simplify installation (eg, deployment) time. Two or more components of the assembly can be controlled by a controller (eg, a microcontroller), which can simplify the control architecture and/or connectivity to these components. The potential for various undesired interactions between modules may be increased, for example (i) in larger spaces and/or (ii) in spaces that require more detailed monitoring and/or mapping of the environment. At times, packaging all these components in an assembly in a manner that prevents mutual interference (eg, coexistence errors) can become time-consuming, expensive, and/or difficult.

Various aspects disclosed herein can be related to the external dimensions used to package the set as a digital architectural element. The set, configured as a digital architectural element (abbreviated herein as "DAE"), facilitates ease of installation, maintenance, removal, replacement, and/or packaging of the components. The set may provide coexistence of components in the assembly with known and/or reduced interference. The set can provide a compact, attractive and/or simple design that can be adapted to different installation positions in the facility. This set can be configured for network integration, and/or to facilitate high-speed data streaming. The set may provide computing power and may be part of a set of sets with (eg, extensive) collective computing power, depending on the number of sets in the set.

In some embodiments, a coexistence matrix is utilized to internally (eg, within close proximity) identify possible interference between modules of an assembly (also referred to herein as "internal assembly interference") and/or differences Possible interference between modules of the assembly (also referred to herein as "mutual assembly interference"). In some embodiments, the positioning and/or timing of operation of modules (eg, devices such as components) are controlled to have the potential to interfere with each other. In some embodiments, the interference data is used as a tool to map the space in which the modules are placed. A module's controller and/or "master" and "slave" assignments may be established, eg, to direct the operating cycles (eg, time periods) of the respective modules. In some embodiments, interaction and/or mutual learning (eg, using AI) is employed (i) between modules within a single group and/or (ii) within different groups of modules to define roles, timing and/or control hierarchy.

In another aspect, a method for managing the coexistence of modules (eg, devices, such as components), the method comprising: (A) generating an indication of a first plurality of devices (eg, a center) disposed in an enclosure (B) use the coexistence matrix to control (a) the first operation of at least one first device of the plurality of devices and/or (b) at least one second device of the second plurality of devices; and (c) use of the at least one first device and/or the at least one first device 2. The device changes the environment of the enclosure.

In some embodiments, the first plurality of devices are disposed in a housing in which the second plurality of devices are disposed. In some embodiments, the housing has at least one cross-section including an oblong cross-section or a rectangular cross-section. In some embodiments, the housing has a cover that snaps to the open body of the housing. In some embodiments, the housing includes a mesh. In some embodiments, the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or allotrope of elemental carbon. In some embodiments, the housing includes a transparent or non-transparent portion. In some embodiments, the shell includes a textured outer portion and a non-textured outer portion. In some embodiments, the textured portion includes a pattern. In some embodiments, the pattern comprises space-filling polygons. In some embodiments, the housing includes at least one aperture and at least a portion of the textured exterior. In some embodiments, the housing contains heat sinks or baffles inside. In some embodiments, the method further includes using the coexistence matrix to modify the interior of the housing. In some embodiments, the modification of the interior of the housing includes (i) adding a heat sink; (ii) adding a baffle; or (iii) reconfiguring at least one first device of the first plurality of devices and /or at least one second device of the second plurality of devices. In some embodiments, the first plurality of devices are disposed in a circuit board on which the second plurality of devices are disposed. In some embodiments, at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly inserted into a circuit board in which the circuit board is disposed At least one first device and/or the at least one second device. In some embodiments, at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly extracted from a circuit board in which the at least one device is disposed a first device and/or the at least one first device. In some embodiments, the first plurality of devices are disposed in a first sub-enclosure and wherein the second plurality of devices are disposed in a second sub-enclosure. In some embodiments, the first sub-enclosure is a first housing housing the first plurality of devices. In some embodiments, the second sub-enclosure is a second housing that houses the second plurality of devices. In some embodiments, the enclosure is a facility. In some embodiments, the first sub-enclosure is the first room in the facility. In some embodiments, the second sub-enclosure is the second room in the facility. In some embodiments, the first sub-enclosure is the first floor in the facility. In some embodiments, the second sub-enclosure is the second floor in the facility. In some embodiments, the first plurality of devices are potential aggressor devices, and wherein the second plurality of devices are potential victim devices. In some embodiments, any interference between a first device of the first plurality of devices and a second device of the second plurality of devices is indicated in a cell of the coexistence matrix. In some embodiments, the any interference between a first device of the first plurality of devices and a second device of the second plurality of devices is indicative of interference potential. In some embodiments, control of the environment of the enclosure is performed at least in part using at least one controller. In some embodiments, the at least one controller is part of a hierarchical control system. In some embodiments, the at least one controller is disposed in a circuit board on which the first plurality of devices and/or the second plurality of devices are disposed. In some embodiments, the coexistence matrix is used to control the first plurality of devices and/or the second plurality of devices that are indicated in the coexistence matrix as having an interference potential above a threshold value. In some embodiments, the threshold value comprises a value, a temporal dependency function, or a spatial dependency function. In some embodiments, the coexistence matrix is used to control any of the first plurality of devices and/or any of the second plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold value any device. In some embodiments, controlling the operation of the first plurality of devices and/or the second plurality of devices includes controlling (i) at least one first device of the first plurality of devices and/or (ii) the second plurality of devices The mode of operation of at least one of the two plurality of devices of a second device. In some embodiments, the mode of operation includes the timing of operations. In some embodiments, the mode of operation includes (i) an off mode or (ii) an on mode. In some embodiments, the mode of operation includes scheduling, positioning or calibrating the at least one first device of the first plurality of devices and/or the at least one second device of the second plurality of devices. In some embodiments, the method further comprises monitoring (i) at least one first device of the first plurality of devices and/or (ii) at least one second device of the second plurality of devices for any faults . In some embodiments, the method further includes alerting (i) at least one of the first plurality of devices using a control system communicatively coupled to the first plurality of devices and/or the second plurality of devices Any failure of the first device and/or (ii) at least one second device of the second plurality of devices. In some embodiments, the control system (i) provides an alert of any detected failure of at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices , and/or (ii) propose a solution to the failure. In some embodiments, the first plurality of devices include sensors and wherein the second plurality of devices include transmitters. In some embodiments, the first plurality of devices include sensors that sense the attribute, and wherein the second plurality of devices include transmitters that sense the attribute. In some embodiments, the attribute includes light, temperature, sound, pressure, gas type, gas concentration, or gas velocity.

In another aspect, a non-transitory computer program product for managing the coexistence of modules (eg, devices, such as components), the non-transitory computer program product having instructions recorded thereon, the instructions being executed by one or more The processors when executed cause the one or more processors to perform operations including: (A) generating a first plurality of devices (eg, each of the devices) indicative of being disposed in the enclosure and disposing in the enclosure A coexistence matrix for or directing the generation of any interference between the second plurality of devices (eg, each of the devices); (B) using the coexistence matrix to control (a) at least one of the first plurality of devices Operation of or instructing the use of the first device and/or (b) at least one second device of the second plurality of devices; and (c) modification using the at least one first device and/or the at least one second device the environment of the enclosure or guide its changes.

In some embodiments, the first plurality of devices are disposed in a housing in which the second plurality of devices are disposed. In some embodiments, the housing has at least one cross-section including an oblong cross-section or a rectangular cross-section. In some embodiments, the housing has a cover that snaps to the open body of the housing. In some embodiments, the housing includes a mesh. In some embodiments, the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or allotrope of elemental carbon. In some embodiments, the housing includes a transparent or non-transparent portion. In some embodiments, the shell includes a textured outer portion and a non-textured outer portion. In some embodiments, the textured portion includes a pattern. In some embodiments, the pattern comprises space-filling polygons. In some embodiments, the housing includes at least one aperture and at least a portion of the textured exterior. In some embodiments, the housing contains heat sinks or baffles inside. In some embodiments, the non-transitory computer program product further includes modifying the interior of the housing using the coexistence matrix. In some embodiments, the modification to the interior of the housing includes (i) adding a heat sink; (ii) adding a spacer; or (iii) reconfiguring at least one first device of the first plurality of devices and /or at least one second device of the second plurality of devices. In some embodiments, the first plurality of devices are disposed in a circuit board on which the second plurality of devices are disposed. In some embodiments, at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly inserted into a circuit board in which the circuit board is disposed At least one first device and/or the at least one second device. In some embodiments, at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly extracted from a circuit board in which the at least one device is disposed a first device and/or the at least one first device. In some embodiments, the first plurality of devices are disposed in a first sub-enclosure and wherein the second plurality of devices are disposed in a second sub-enclosure. In some embodiments, the first sub-enclosure is a first housing housing the first plurality of devices. In some embodiments, the second sub-enclosure is a second housing that houses the second plurality of devices. In some embodiments, the enclosure is a facility. In some embodiments, the first sub-enclosure is the first room in the facility. In some embodiments, the second sub-enclosure is the second room in the facility. In some embodiments, the first sub-enclosure is the first floor in the facility. In some embodiments, the second sub-enclosure is the second floor in the facility. In some embodiments, the first plurality of devices are potential aggressor devices, and wherein the second plurality of devices are potential victim devices. In some embodiments, the any interference between a first device of the first plurality of devices and a second device of the second plurality of devices is indicated in a cell of the coexistence matrix. In some embodiments, the any interference between a first device of the first plurality of devices and a second device of the second plurality of devices is indicative of interference potential. In some embodiments, control of the environment of the enclosure is performed at least in part using at least one controller. In some embodiments, the at least one controller is part of a hierarchical control system. In some embodiments, the at least one controller is disposed in a circuit board on which the first plurality of devices and/or the second plurality of devices are disposed. In some embodiments, the coexistence matrix is used to control the first plurality of devices and/or the second plurality of devices that are indicated in the coexistence matrix as having an interference potential above a threshold value. In some embodiments, the threshold value comprises a value, a temporal dependency function, or a spatial dependency function. In some embodiments, the coexistence matrix is used to control any of the first plurality of devices and/or any of the second plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold value any device. In some embodiments, controlling the operation of the first plurality of devices and/or the second plurality of devices includes controlling (i) at least one first device of the first plurality of devices and/or (ii) the second plurality of devices The mode of operation of at least one of the two plurality of devices of a second device. In some embodiments, the mode of operation includes the timing of operations. In some embodiments, the mode of operation includes (i) an off mode or (ii) an on mode. In some embodiments, the mode of operation includes scheduling, locating, or calibrating the at least one first device of the first plurality of devices and/or the at least one second device of the second plurality of devices. In some embodiments, the non-transitory computer program product further comprises monitoring (i) at least one first device of the first plurality of devices and/or (ii) at least one second device of the second plurality of devices Are there any faults. In some embodiments, the non-transitory computer program product further includes alerting (i) the first plurality of devices using a control system communicatively coupled to the first plurality of devices and/or the second plurality of devices any failure of at least one of the first devices and/or (ii) at least one of the second devices of the second plurality of devices. In some embodiments, the control system (i) provides an alert of any detected failure of at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices , and/or (ii) propose a solution to the failure. In some embodiments, the first plurality of devices include sensors, and wherein the second plurality of devices include transmitters. In some embodiments, the first plurality of devices include sensors that sense the attribute and wherein the second plurality of devices include transmitters that sense the attribute. In some embodiments, the attribute includes light, temperature, sound, pressure, gas type, gas concentration, or gas velocity.

In another aspect, an apparatus for managing the coexistence of modules (eg, devices, such as components), the apparatus includes one or more controllers (eg, including circuitry), the one or more controllers is configured to: (A) generate an indication of a first plurality of devices (eg, each of) disposed in the enclosure and a second plurality of devices (eg, each of) disposed in the enclosure (B) use the coexistence matrix to control (a) at least one of the first plurality of devices and/or (b) the second plurality of devices Operation of or directing the use of at least one second device of the devices; and (C) modifying or directing modification of the enclosure's environment using the at least one first device and/or the at least one second device.

In some embodiments, the one or more controllers are coupled to the first plurality of devices and the second plurality of devices, and wherein the one or more controllers are configured to be based at least in part on the coexistence matrix Any respective interference included in isolates the operation of the at least one first device from the operation of the at least one second device. In some embodiments, the operation of the at least one first device and the operation of the at least one second device are isolated when the interference potential included in the coexistence matrix is above a threshold value. In some embodiments, the coexistence matrix includes one or more cells characterizing the interference potential between the at least one first device and the at least one second device. In some embodiments, cells of the coexistence matrix provide at least one designation indicative of relative susceptibility to interference between a first device of the at least one first device and a second device of the at least one second device . In some embodiments, the at least one designation includes a high designation and a low designation based on relative sensitivities above or below a threshold value, respectively. In some embodiments, the at least one designation includes a numerical value characterizing the interference. In some embodiments, the relative sensitivity is determined in response to a performance specification. In some embodiments, the relative sensitivity is determined in response to an empirical assessment. In some embodiments, the isolation of the operation of the at least one first device and the at least one second device consists of (i) a first time of operation of the at least one first device and (ii) the at least one second device A second operating time of the device, wherein the first time is separated from the second time to prevent simultaneous operation of the at least one first device and the at least one second device. In some embodiments, the at least one first device is of the same type as the at least one second device, wherein the first plurality of devices are in a first assembly, and wherein the second plurality of devices are in a second assembly , and wherein the isolation of the operation of the at least one first device and the at least one second device consists of the one or more controls when the first assembly is above a distance threshold from the second assembly The physical distance interval created by the controller activating the at least one first device and deactivating the at least one second device. In some embodiments, the apparatus further includes a housing, wherein the first plurality of devices are disposed in the housing. In some embodiments, the housing has at least one cross-section including an oblong cross-section or a rectangular cross-section. In some embodiments, the housing has a cover that snaps to the open body of the housing. In some embodiments, the housing includes a mesh. In some embodiments, the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or allotrope of elemental carbon. In some embodiments, the housing includes a transparent or non-transparent portion. In some embodiments, the shell includes a textured outer portion and a non-textured outer portion. In some embodiments, the textured portion includes a pattern. In some embodiments, the pattern comprises space-filling polygons. In some embodiments, the housing includes at least one aperture and at least a portion of the textured exterior. In some embodiments, the housing contains heat sinks or baffles inside. In some embodiments, the apparatus further includes modifying the interior of the housing using the coexistence matrix. In some embodiments, the modification to the interior of the housing includes (i) adding a heat sink; (ii) adding a spacer; or (iii) reconfiguring at least one first device of the first plurality of devices and /or at least one second device of the second plurality of devices. In some embodiments, the first plurality of devices are disposed in a circuit board on which the second plurality of devices are disposed. In some embodiments, at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly inserted into a circuit board in which the circuit board is disposed At least one first device and/or the at least one second device. In some embodiments, at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly extracted from a circuit board in which the at least one device is disposed a first device and/or the at least one first device. In some embodiments, the first plurality of devices are disposed in a first sub-enclosure and wherein the second plurality of devices are disposed in a second sub-enclosure. In some embodiments, the first sub-enclosure is a first housing housing the first plurality of devices. In some embodiments, the second sub-enclosure is a second housing that houses the second plurality of devices. In some embodiments, the enclosure is a facility. In some embodiments, the first sub-enclosure is the first room in the facility. In some embodiments, the second sub-enclosure is the second room in the facility. In some embodiments, the first sub-enclosure is the first floor in the facility. In some embodiments, the second sub-enclosure is the second floor in the facility. In some embodiments, the first plurality of devices are potential aggressor devices, and wherein the second plurality of devices are potential victim devices. In some embodiments, the any interference between a first device of the first plurality of devices and a second device of the second plurality of devices is indicated in a cell of the coexistence matrix. In some embodiments, the any interference between a first device of the first plurality of devices and a second device of the second plurality of devices is indicative of interference potential. In some embodiments, control of the environment of the enclosure is performed at least in part using at least one controller. In some embodiments, the at least one controller is part of a hierarchical control system. In some embodiments, the at least one controller is disposed in a circuit board on which the first plurality of devices and/or the second plurality of devices are disposed. In some embodiments, the coexistence matrix is used to control the first plurality of devices and/or the second plurality of devices that are indicated in the coexistence matrix as having an interference potential above a threshold value. In some embodiments, the threshold value comprises a value, a temporal dependency function, or a spatial dependency function. In some embodiments, the one or more controllers are configured to utilize the coexistence matrix to control any of the first plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold value and/or any of the second plurality of devices. In some embodiments, the one or more controllers are configured to control (i) at least one first device of the first plurality of devices and/or (ii) the second plurality of devices, at least in part The operation mode of at least one second device in the device controls the operation of the first plurality of devices and/or the second plurality of devices. In some embodiments, the mode of operation includes the timing of operations. In some embodiments, the mode of operation includes (i) an off mode or (ii) an on mode. In some embodiments, the mode of operation includes scheduling, locating, or calibrating the at least one first device of the first plurality of devices and/or the at least one second device of the second plurality of devices. In some embodiments, the one or more controllers are configured to monitor (i) at least one of the first plurality of devices and/or (ii) at least one of the second plurality of devices Whether the second device has any faults or direct its monitoring. In some embodiments, the one or more controllers are configured to alert (i) at least one first device of the first plurality of devices and/or (ii) at least one first device of the second plurality of devices 2. Any malfunction of the device or instructions for its modification. In some embodiments, the one or more controllers are configured to (i) provide for at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices provide warnings or instructions for any detected failures, and/or (ii) propose solutions to or instruct them to propose such failures. In some embodiments, the first plurality of devices include sensors, and wherein the second plurality of devices include transmitters. In some embodiments, the first plurality of devices include sensors that sense the attribute, and wherein the second plurality of devices include transmitters that sense the attribute. In some embodiments, the attribute includes light, temperature, sound, pressure, gas type, gas concentration, or gas velocity. In some embodiments, the one or more controllers are configured to utilize control schemes including feedback, feedforward, closed loop, or open loop control schemes. In some embodiments, the one or more controllers include a controller configured to control at least two of (A), (B), and (C). In some embodiments, the one or more controllers include a first controller and a second controller, and wherein the first controller is configured to control (A), (B), and (C) Different operations.

In another aspect, an apparatus for altering an environment of an enclosure, the apparatus comprising: a plurality of devices including sensors configured to sense environmental properties of the enclosure; a circuit board, the plurality of devices coupled to the circuit board configured to be operably coupled to at least one controller configured to modify the environment using at least one of the plurality of devices; and having an open body and a A casing configured to cover a lid opening the opening of the body, the casing being configured to enclose (a) the plurality of devices and (b) at least a portion of the circuit board, the lid optionally at the exterior of the lid having a textured portion optionally surrounding at least one hole in the cover, the at least one hole optionally configured to facilitate sensing by the cover when the housing is covered by the cover during operation The device senses this environmental property.

In some embodiments, at least one device of the plurality of devices is configured to be reversibly coupled to the circuit board. In some embodiments, the reversible coupling of the at least one device includes reversible insertion of the at least one device into the circuit board, or reversible extraction of the at least one device from the circuit board. In some embodiments, the circuit board is configured to facilitate reversible coupling of at least one of the plurality of devices. In some embodiments, the housing contains heat sinks or baffles inside. In some embodiments, the circuit board includes heat sinks or holes configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation. In some embodiments, the housing has at least one cross-section including an oblong cross-section or a rectangular cross-section. In some embodiments, the cover is configured to snap to the open body of the housing to close the housing. In some embodiments, the textured portion comprises a mesh or braid. In some embodiments, the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or allotrope of elemental carbon. In some embodiments, the housing includes a transparent or non-transparent portion. In some embodiments, the cover includes a non-textured outer portion. In some embodiments, the textured portion includes a pattern. In some embodiments, the pattern comprises space-filling polygons. In some embodiments, the housing is configured to fit onto or into at least a portion of the fasteners of the enclosure. In some embodiments, the housing is configured to attach to a support structure. In some embodiments, the support structure comprises a mast, pole or frame. In some embodiments, the fixture includes a wall, ceiling or frame. In some embodiments, the frame is a window frame or a door frame.

In another aspect, an apparatus for altering the environment of an enclosure, the apparatus comprising at least one controller having circuitry, the at least one controller individually or collectively configured to: (A) communicate with coupled to a plurality of devices comprising sensors configured to sense environmental properties of the enclosure, the plurality of devices coupled to a circuit board at least partially enclosed in a housing, the housing (a ) configured to enclose the plurality of devices and (b) having an open body and a lid configured to cover the opening of the open body, the lid optionally having a textured portion at the exterior of the lid, the textured portion being circumstance surrounds at least one hole in the cover, the at least one hole optionally configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation; and (B ) uses at least one of the plurality of devices to modify or direct the modification of the environment (eg, the atmosphere and/or the lighting of the environment).

In some embodiments, at least one device of the plurality of devices is configured to be reversibly coupled to the circuit board. In some embodiments, the reversible coupling of the at least one device includes reversible insertion of the at least one device to the circuit board, or reversible extraction of the at least one device from the circuit board. In some embodiments, the circuit board is configured to facilitate reversible coupling of at least one of the plurality of devices. In some embodiments, the housing contains heat sinks or baffles inside. In some embodiments, the circuit board includes heat sinks or holes configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation. In some embodiments, the housing is configured to provide at least one cross-section including an oblong cross-section or a rectangular cross-section. In some embodiments, the cover is configured to snap to the open body of the housing to close the housing. In some embodiments, the textured portion is configured as a mesh or braid. In some embodiments, the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or allotrope of elemental carbon. In some embodiments, the housing includes a transparent or non-transparent portion. In some embodiments, the cover is configured to provide a non-textured outer portion. In some embodiments, the textured portion is configured to provide a pattern. In some embodiments, the pattern is configured to include space-filling polygons. In some embodiments, the housing is configured to fit onto or into at least a portion of the fasteners of the enclosure. In some embodiments, the housing is configured to attach to a support structure. In some embodiments, the support structure comprises a mast, pole or frame. In some embodiments, the fixture includes a wall, ceiling or frame. In some embodiments, the frame is a window frame or a door frame. In some embodiments, the housing encloses (i) a processor, (ii) memory, and/or (iii) at least one network component configured to receive and/or transmit network communications. In some embodiments, the processor and/or at least one network component are configured to be coupled to a network coupled to the device. In some embodiments, the circuit board is a first circuit board, and wherein the processor and/or at least one network component are disposed in a second circuit board. In some embodiments, the second circuit board is separate from the first circuit board. In some embodiments, the separation of the first circuit board and the second circuit board facilitates cooling of heat dissipated from the first circuit board and/or the second circuit board. In some embodiments, the separation of the first circuit board and the second circuit board facilitates active and/or passive gas flow. In some embodiments, the second circuit board is separated from the first circuit board by a shield, heat sink, cooler, and/or gas. In some embodiments, the heat sink and/or cooler are active. In some embodiments, the heat sink and/or cooler is passive. In some embodiments, the apparatus further includes at least one controller configured to utilize the processor and/or at least one network component to process information related to the plurality of devices. In some embodiments, the apparatus further includes at least one controller configured to process information independent of the plurality of devices using the processor and/or at least one network component. In some embodiments, the apparatus further includes at least one controller configured to manage power allocated to at least one of the plurality of devices. In some embodiments, the apparatus further includes at least one controller configured to distribute power allocated to at least two of the plurality of devices in sequence or in parallel. In some embodiments, the apparatus further includes at least one controller configured to evenly or unevenly distribute power allocated to at least two of the plurality of devices.

In another aspect, a method for altering an environment of an enclosure, the method comprising: (A) providing a housing having an open body and a lid configured to cover an opening of the open body; (B) adding a plurality of A device is enclosed in the housing, the plurality of devices includes sensors configured to sense environmental properties of the enclosure; (C) at least a portion of a circuit board is enclosed in the housing, the plurality of devices coupled to the circuit board configured to be operably coupled to at least one controller that modifies the environment of the enclosure using at least one of the plurality of devices; (D) optionally in the A textured portion is provided at the exterior of the cover, the textured portion optionally surrounding at least one hole in the cover, the at least one hole optionally configured to facilitate borrowing when the housing is covered by the cover during operation. Sensing environmental attributes by the sensor; and (E) modifying the environment (eg, atmosphere and/or ambient lighting) using at least one of the plurality of devices.

In some embodiments, the method further includes reversibly coupling at least one of the plurality of devices to the circuit board. In some embodiments, the reversible coupling of the at least one device includes reversibly inserting the at least one device into the circuit board, or reversibly extracting the at least one device from the circuit board. In some embodiments, the method further includes configuring the circuit board to facilitate reversible coupling of at least one of the plurality of devices. In some embodiments, the housing contains heat sinks or baffles inside. In some embodiments, the circuit board includes heat sinks or holes configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation. In some embodiments, the housing includes at least one cross-section including an oblong cross-section or a rectangular cross-section. In some embodiments, the cover is snapped to close the body of the housing. In some embodiments, the textured portion comprises a mesh or braid. In some embodiments, the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or allotrope of elemental carbon. In some embodiments, the housing includes a transparent or non-transparent portion. In some embodiments, the cover provides a non-textured outer portion. In some embodiments, the textured portion includes a pattern. In some embodiments, the pattern comprises space-filling polygons. In some embodiments, the method further comprises fitting onto or into at least a portion of the fastener of the closure. In some embodiments, the method further includes attaching the housing to the support structure. In some embodiments, the support structure comprises a mast, pole or frame. In some embodiments, the fixture includes a wall, ceiling or frame. In some embodiments, the frame is a window frame or a door frame. In some embodiments, the housing encloses (i) a processor, (ii) memory, and/or (iii) at least one network component configured to receive and/or transmit network communications. In some embodiments, the method further includes using the processor and/or at least one network component to process information related to the plurality of devices. In some embodiments, the method further includes using the processor and/or at least one network component to process information independent of the plurality of devices. In some embodiments, the method further includes managing power allocated to at least one of the plurality of devices. In some embodiments, the method further includes distributing power allocated to at least two of the plurality of devices sequentially or in parallel. In some embodiments, the method further includes distributing the power allocated to at least two of the plurality of devices, uniformly or non-uniformly. In some embodiments, the circuit board is a first circuit board, and wherein the processor and/or at least one network component are disposed in a second circuit board. In some embodiments, the second circuit board is separate from the first circuit board. In some embodiments, the method further includes cooling heat dissipated from the first circuit board and/or the second circuit board. In some embodiments, the cooling is through the use of active and/or passive gas flow. In some embodiments, the cooling is through the use of shrouds, heat sinks, coolers and/or gases. In some embodiments, the heat sink and/or cooler are active. In some embodiments, the heat sink and/or cooler are passive.

In another aspect, a non-transitory computer program product for altering the environment of an enclosure, the non-transitory computer program product having recorded thereon instructions that, when executed by one or more processors, cause the or a plurality of processors performing operations comprising: (A) sensing or directing the sensing of environmental properties of the enclosure by means of sensors included in a plurality of devices operatively coupled to the circuit board, the At least a portion of the plurality of devices and the circuit board is enclosed in a housing having an open body and a lid configured to cover the opening of the open body, the lid optionally having a textured portion at the exterior of the lid, the textured portion optionally surrounding at least one hole in the cover, the at least one hole optionally configured to facilitate sensing of environmental properties by the sensor when the housing is covered by the cover during operation; and (B ) uses at least one of the plurality of devices to modify or direct the modification of the environment (eg, the atmosphere and/or the lighting of the environment).

In some embodiments, at least one device of the plurality of devices is configured to be reversibly coupled to the circuit board. In some embodiments, the reversible coupling of the at least one device includes reversible insertion of the at least one device to the circuit board, or reversible extraction of the at least one device from the circuit board. In some embodiments, the circuit board is configured to facilitate reversible coupling of at least one of the plurality of devices. In some embodiments, the housing contains heat sinks or baffles inside. In some embodiments, the circuit board includes heat sinks or holes configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation. In some embodiments, the housing is configured to provide at least one cross-section including an oblong cross-section or a rectangular cross-section. In some embodiments, the cover is configured to snap to the open body of the housing to close the housing. In some embodiments, the textured portion is configured as a mesh or braid. In some embodiments, the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or allotrope of elemental carbon. In some embodiments, the housing includes a transparent or non-transparent portion. In some embodiments, the cover is configured to provide a non-textured outer portion. In some embodiments, the textured portion is configured to provide a pattern. In some embodiments, the pattern is configured to include space-filling polygons. In some embodiments, the housing is configured to fit onto or into at least a portion of the fasteners of the enclosure. In some embodiments, the housing is configured to attach to a support structure. In some embodiments, the support structure comprises a mast, pole or frame. In some embodiments, the fixture includes a wall, ceiling or frame. In some embodiments, the frame is a window frame or a door frame. In some embodiments, the housing encloses (i) a processor, (ii) memory, and/or (iii) at least one network component configured to receive and/or transmit network communications. In some embodiments, the processor and/or at least one network component are configured to be coupled to a network coupled to the device. In some embodiments, the circuit board is a first circuit board, and wherein the processor and/or at least one network component are disposed in a second circuit board. In some embodiments, the second circuit board is separate from the first circuit board. In some embodiments, the separation of the first circuit board and the second circuit board facilitates cooling of heat dissipated from the first circuit board and/or the second circuit board. In some embodiments, the separation of the first circuit board and the second circuit board facilitates active and/or passive gas flow. In some embodiments, the second circuit board is separated from the first circuit board by a shield, heat sink, cooler, and/or gas. In some embodiments, the heat sink and/or cooler are active. In some embodiments, the heat sink and/or cooler is passive. In some embodiments, the operations further include using the processor and/or at least one network component to process information related to the plurality of devices. In some embodiments, the operations further include using the processor and/or at least one network component to process information unrelated to the plurality of devices. In some embodiments, the operations further include managing power allocated to at least one of the plurality of devices. In some embodiments, the operations further include distributing power allocated to at least two of the plurality of devices sequentially or in parallel. In some embodiments, the operations further comprise distributing the power allocated to at least two of the plurality of devices evenly or unevenly.

In another aspect of the invention, a method manages the coexistence of a set of modules (eg, a set of devices that are components of the set) contained in an assembly unit interconnected as nodes in a processing system. A coexistence matrix is formed such that the modules are related to each other in sets, wherein the coexistence matrix includes individual cells that characterize the interference potential between each module as the aggressor paired with a different module as the victim. A coexistence controller is operated that plays a primary role on at least some of the assembly units in the processing system. The coexistence matrix controls at least one module within a pair of modules in the coexistence matrix that has an interference potential above a threshold value to isolate the operation of the pair of modules. In some embodiments, the isolation consists of a time interval to prevent the generation of operational schedules for the modules of the pair of modules operating simultaneously. In some embodiments, the isolation consists of a distance interval consisting of activating a set of modules of one type in one assembly unit while deactivating a set of modules in another assembly unit within a predetermined distance of the same assembly unit A coexistence controller for modules of the type spawns. In another aspect, the pair of modules may be in the same assembly unit or may be in different assembly units.

In another aspect, the method of the present invention a) assigns a node in the processing system the role of coexistence controller; b) assigns other nodes in the processing system the role of slave device of the coexistence controller; and c) then coexists The controller enumerates modules within the set. In some embodiments, the activity of the coexistence controller is monitored. If the coexistence controller is inactive for a predetermined time, another node in the processing system is assigned the role of the coexistence controller.

In another aspect, the isolation consists of a distance interval consisting of activating a coexistence controller that concentrates modules of one type in one assembly unit while deactivating a coexistence controller that concentrates modules of the same type in another assembly unit is generated, and the one assembly unit transmits the results obtained by activating the modules in one assembly unit to the other assembly unit. In some embodiments, the assembly unit includes individual housings that hold individual sets of modules and are suitable for installation into structures in the enclosure. In some embodiments, the centralized modules within the assembly unit consist of sensors. In some embodiments, the centralized module within the assembly unit consists of a transmitter. In some embodiments, the centralized modules within the assembly unit consist of actuators. In some embodiments, the centralized module within the assembly unit consists of a transmitter. In some embodiments, the centralized module within the assembly unit consists of a receiver. In some embodiments, the centralized module within the assembly unit consists of a plurality of sensors and a plurality of transmitters.

In some embodiments, the network is a local area network. In some embodiments, the network includes cables configured to transmit power and communications in a single cable. The communication may be one or more types of communication. The communication may include cellular communication that complies with at least second generation (2G), third generation (3G), fourth generation (4G) or fifth generation (5G) cellular communication protocols. In some embodiments, the communication includes media communication that facilitates still pictures, music or animation streaming (eg, movies or video). In some embodiments, the communication includes data communication (eg, sensor data). In some embodiments, the communication includes control communication, eg, to control one or more nodes operatively coupled to the network. In some embodiments, the network includes a first (eg, cabling) network installed in the facility. In some embodiments, the network includes a (eg, cabling) network installed in the envelope of the facility (eg, in the envelope of a building included in the facility).

In another aspect, the present disclosure provides a system, apparatus (eg, controller) and/or non-transitory computer-readable medium (eg, software) implementing any of the methods disclosed herein.

In another aspect, the present disclosure provides methods of using any of the systems, computer-readable media, and/or devices disclosed herein, eg, for their intended purposes.

In another aspect, an apparatus includes at least one controller programmed to direct a mechanism for implementing (eg, performing) any of the methods disclosed herein, the at least one controller being programmed The configuration is operably coupled to the mechanism. In some embodiments, at least two operations (eg, of the method) are directed/performed by the same controller. In some embodiments, at least two operations are directed/performed by different controllers.

In another aspect, an apparatus includes at least one controller configured (eg, programmed) to implement (eg, perform) any of the methods disclosed herein. At least one controller can implement any of the methods disclosed herein. In some embodiments, at least two operations (eg, of the method) are directed/performed by the same controller. In some embodiments, at least two operations are directed/performed by different controllers.

In some embodiments, one of the at least one controllers is configured to perform two or more operations. In some embodiments, two different ones of the at least one controller are configured to each perform different operations.

In another aspect, a system includes at least one controller programmed to direct operation of at least one other device (or component thereof) and the device (or component thereof), wherein the at least one A controller is operably coupled to the device (or components thereof). The apparatus (or components thereof) may include any apparatus (or components thereof) disclosed herein. At least one controller can be configured to direct any of the devices (or components thereof) disclosed herein. At least one controller can be configured to be operably coupled to any of the devices (or components thereof) disclosed herein. In some embodiments, at least two operations (eg, of a device) are directed by the same controller. In some embodiments, at least two operations are directed by different controllers.

In another aspect, a computer software product (eg, recorded on one or more non-transitory media) stores program instructions that, when read by at least one processor (eg, a computer), cause At least one processor directs a mechanism disclosed herein to implement (eg, perform) any of the methods disclosed herein, wherein the at least one processor is configured to be operably coupled to the mechanism. The mechanism may include any device (or any component thereof) disclosed herein. In some embodiments, at least two operations (eg, of a device) are directed/performed by the same processor. In some embodiments, at least two operations are directed/performed by different processors.

In another aspect, the present invention provides non-transitory computer-readable program instructions comprising machine-executable code (eg, included in a program product comprising one or more non-transitory media), the code being executed by One or more processors, when executed, implement any of the methods disclosed herein. In some embodiments, at least two operations (eg, of a method) are directed/performed by the same processor. In some embodiments, at least two operations are directed/performed by different processors.

In another aspect, the present invention provides a non-transitory computer-readable medium containing machine-executable code that, when executed by one or more processors, implements control of controller(s) (eg, as disclosed herein). In some embodiments, at least two operations (eg, of a controller) are directed/performed by the same processor. In some embodiments, at least two operations are directed/performed by different processors.

In another aspect, the present invention provides a computer system including one or more computer processors and a non-transitory computer readable medium coupled thereto. The non-transitory computer-readable medium includes machine-executable code that, when executed by one or more processors, implements any of the methods disclosed herein and/or performs any of the methods disclosed herein ( guidance for multiple) controllers.

In another aspect, the present invention provides non-transitory computer-readable program instructions that, when read by one or more processors, cause one or more processors to execute the text herein Any operation of the methods disclosed in, any operation performed (or configured to perform) by an apparatus disclosed herein, and/or any operation directed (or configured to direct) by an apparatus disclosed herein .

In some embodiments, the program instructions are recorded on a non-transitory computer-readable medium. In some embodiments, at least two of the operations are performed by one of the one or more processors. In some embodiments, at least two of the operations are each performed by a different one of the one or more processors.

The contents of this Summary section are provided as a simplified introduction to the invention, and are not intended to limit the scope of any invention disclosed herein or the scope of the appended claims.

Additional aspects and advantages of the present invention will become apparent to those skilled in the art from the following detailed description, in which only illustrative embodiments of the present invention are shown and described. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modification in various obvious respects, all without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative and not restrictive in nature.

These and other features and embodiments will be described in more detail with reference to the drawings. incorporated by reference

All publications, patents and patent applications mentioned in this specification are incorporated herein by reference to the same extent as if each individual publication, patent or patent application was specifically and individually indicated to be by reference way incorporated into the general.

While various embodiments of the invention have been shown and described herein, it will be apparent to those skilled in the art that these embodiments are provided by way of example only. Numerous changes, changes, and substitutions can occur to those skilled in the art without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed.

Terms such as "a/an" and "the" are not intended to refer to only the singular entity, but rather include the general class of specific instances that can be used for description. The terminology herein is used to describe specific embodiments of the invention, but their use does not delimit the invention.

Unless otherwise specified, when referring to a range, the range is intended to be inclusive. For example, a range between value 1 and value 2 is intended to be inclusive and includes both value 1 and value 2. An inclusive range will span any value from about 1 to about 2. The terms "adjacent" or "adjacent to" as used herein include "proximate," "adjacent," "contacting," and "proximity."

As used herein, including within the scope of the claims, the conjunction "and/or" in a phrase such as "including X, Y, and/or Z" is meant to include any combination or combination of X, Y, and Z. plural. For example, this phrase is intended to include X. For example, this phrase is intended to include Y. For example, this phrase is intended to include Z. For example, this phrase is intended to include X and Y. For example, this phrase is intended to include X and Z. For example, this phrase is intended to include Y and Z. For example, this phrase is intended to include multiple X's. For example, this phrase is intended to include plural Ys. For example, this phrase is intended to include multiple Z's. For example, this phrase is intended to include plural X and plural Y. For example, the phrase is meant to include a plurality of X's and a plurality of Z's. For example, this phrase is intended to include Y's and Z's. For example, this phrase is intended to include a plurality of X and Y. For example, this phrase is intended to include a plurality of X and Z. For example, this phrase is intended to include a plurality of Y and Z. For example, this phrase is intended to include X and Y's. For example, this phrase is meant to include X and a plurality of Z. For example, this phrase is meant to include Y and a plurality of Z. The conjunction "and/or" is intended to have the same effect as the phrase "X, Y, Z, or any combination or plural thereof." The conjunction "and/or" is intended to have the same effect as the phrase "one or more of X, Y, Z, or any combination thereof."

The terms "operably coupled" or "operably connected" refer to the coupling (eg, connection) of a first element (eg, mechanism) to a second element to allow communication between the second and/or first element expected operation. Coupling may include physical or non-physical coupling. Non-physical coupling may include signal-induced coupling (eg, wireless coupling). Coupling may include physical coupling (eg, a physical connection) or non-physical coupling (eg, via wireless communication). Operably coupled may include communicatively coupled.

An element (eg, a mechanism, device, or electrical component) that is "configured to" perform a function includes structural features that cause the element to perform that function. Structural features may include electrical features, such as circuitry or circuit elements. Structural features may include circuitry (eg, including electrical or optical circuitry). The electrical circuitry may contain one or more wires. Optical circuitry may include at least one optical element (eg, a beam splitter, mirror, lens, and/or optical fiber). Structural features may include mechanical features. Mechanical features may include latches, springs, closures, hinges, chassis, supports, fasteners or cantilevers, and the like. Performing functions may include utilizing logical features. Logical features may include programmed instructions. The programmed instructions are executable by at least one processor. Programming instructions can be stored or encoded on a medium that can be accessed by one or more processors. Additionally, in the following description, the phrases "operable with," "adapted with," "configured with," "designed with," "programmed with," or "capable of" may be used interchangeably as appropriate use.

In some embodiments, the enclosure includes a region bounded by at least one structure. At least one structure may comprise at least one wall. An enclosure may contain and/or enclose one or more sub-enclosures. At least one wall may comprise metal (eg, steel), clay, stone, plastic, glass, stucco (eg, gypsum), polymer (eg, polyurethane, styrene, or vinyl), asbestos, fibers Glass, concrete (eg reinforced concrete), wood, paper or ceramic. At least one wall may contain wires, bricks, blocks (eg, cinder blocks), tiles, drywall, or framing (eg, steel frames).

In some embodiments, the closure includes one or more openings. The one or more openings may be reversibly closed. One or more openings may be permanently open. The basic length dimension of the opening or openings may be relatively small relative to the basic length dimension of the wall(s) defining the closure. The basic length dimension may include the diameter, length, width or height of the bounding circle. The surface of the opening or openings may be relatively small relative to the surface of the wall(s) defining the closure. The open surface may be a percentage of the total surface of the wall(s). For example, the open surface may measure about 30%, 20%, 10%, 5%, or 1% of the wall(s). The wall(s) may comprise floors, ceilings or side walls. The closable opening may be closed by at least one window or door. The enclosure may be at least a portion of the facility. The enclosure may contain at least a portion of the building. The buildings can be private buildings and/or commercial buildings. A building can contain one or more floors. A building (eg, its floors) may include at least one of the following: rooms, halls, foyers, attics, basements, balconies (eg, interior or exterior balconies), stairwells, hallways, elevator shafts, facades, mezzanine levels , attic, garage, porch (eg, enclosed porch), patio (eg, enclosed patio), cafeteria, and/or plumbing. In some embodiments, the enclosure may be stationary and/or movable (eg, a train, plane, ship, vehicle, or rocket).

In some embodiments, the enclosure encloses the atmosphere. The atmosphere may contain one or more gases. Gases may include inert gases (eg, argon or nitrogen) and/or non-inert gases (eg, oxygen or carbon dioxide). The enclosure atmosphere can be similar to the atmosphere outside the enclosure (eg, ambient atmosphere) in at least one external atmospheric characteristic including: temperature, relative gas content, gas type (eg, humidity and/or oxygen content) ), debris (eg, dust and/or pollen), and/or gas velocity. The enclosure atmosphere may differ from the atmosphere outside the enclosure in at least one external atmospheric characteristic including: temperature, relative gas content, gas type (eg, humidity and/or oxygen content), debris (eg, , dust and/or pollen) and/or gas velocity. For example, the enclosure atmosphere may be less humid (eg, drier) than the outside (eg, ambient) atmosphere. For example, the enclosure atmosphere and the atmosphere outside the enclosure may contain the same (eg, or substantially similar) ratio of oxygen to nitrogen. The velocity of the gas in the enclosure may be (eg, substantially) similar throughout the enclosure. The velocity of the gas in the enclosure can be different in different parts of the enclosure (eg, by flowing the gas through to a vent coupled to the enclosure).

Certain disclosed embodiments provide network infrastructure in an enclosure (eg, a facility such as a building). The network infrastructure may be used for various purposes, such as for providing communication and/or power services. Communication services may include high bandwidth (eg, wireless and/or wireline) communication services. Communication services may be directed to occupants of the facility and/or users external to the facility (eg, a building). The network infrastructure may work in conjunction with or replace part of the infrastructure of one or more cellular operators. The network infrastructure may be provided in a facility that includes electrically switchable windows. Examples of components of a network infrastructure include high-speed backhaul. The network infrastructure may include at least one cable, switch, physical antenna, transceiver, sensor, transmitter, receiver, radio, processor and/or controller (which may include a processor). The network infrastructure may be operably coupled to and/or include a wireless network. Network infrastructure can include cabling. One or more sensors may be deployed (eg, installed) in the environment as part of and/or after installing the network.

In various embodiments, the network infrastructure supports a control system for one or more windows such as electrochromic (eg, tintable) windows. The control system may include one or more controllers operably coupled (eg, directly or indirectly) to the one or more windows. Although the disclosed embodiments describe electrochromic windows (also referred to herein as "optically switchable windows," "tintable windows," or "smart windows"), the concepts disclosed herein can be applied to other types of windows The switchable optical device, including liquid crystal device, electrochromic device, suspended particle device (SPD), NanoChromics display (NCD), organic electroluminescence display (OELD), suspended particle device (SPD), NanoChromics display (NCD) or Organic Electroluminescent Displays (OELDs). The display element may be attached to a portion of the transparent body, such as a window. Tintable windows may be placed in (non-transitory) installations such as buildings, and/or in temporary vehicles such as automobiles, RVs, buses, trains, airplanes, helicopters, ships, or boats.

In some embodiments, a building management system (BMS) is a computer-based control system installed in a building that controls (eg, monitors) the building's mechanical and electrical equipment, such as one or more ventilation, lighting, Electrical systems, elevators, fire protection systems and/or security systems. The controllers (eg, nodes and/or processors) described herein may be suitable for integration with a BMS. The BMS may consist of hardware including interconnection with computer(s) by means of communication channels and/or associated software for maintaining conditions in the building, eg according to preferences set by at least one user. Users can be occupiers, owners, lessors and/or building managers. For example, BMS can be implemented using a local area network such as Ethernet. The software may be based at least in part on, for example, Internet Protocol and/or open standards. An example is the software from Tridium Corporation (Richmond, Va.). One communication protocol commonly used by BMS is BACnet (Building Automation and Control Network).

In some embodiments, the BMS is housed in an enclosure, such as a facility. A facility may include a building, such as a multi-story building. A BMS can be used at least to control the environment in a building. The control system and/or BMS can control at least one environmental characteristic of the enclosure. At least one environmental characteristic may include temperature, humidity, fine mist (eg, aerosols), sound, electromagnetic waves (eg, light glare, color), gas composition, gas concentration, gas velocity, vibration, volatile compounds (VOCs), particles debris (eg, dust) or biological material (eg, airborne bacteria and/or viruses). The gas(s) may include oxygen, nitrogen, carbon dioxide, carbon monoxide, hydrogen sulfide, nitrogen oxides (NO), and nitrogen _dioxide (NO2), noble gases, Nobel gases (eg, radon), chlorophyll, ozone, Formaldehyde, methane or ethane. For example, the BMS can control the temperature, carbon dioxide content and/or humidity within the enclosure. Mechanical devices that may be controlled by the BMS and/or the control system may include lighting, heaters, air conditioners, blowers or vents. To control an enclosed (eg, building) environment, the BMS and/or control system may, for example, switch one or more of the devices it controls on and off under defined conditions. A (eg, core) function of a modern BMS and/or control system may be, for example, to maintain a comfortable environment for the occupants of the enclosure while minimizing energy consumption (eg, while minimizing heating and cooling costs/demand). Modern BMS and/or control systems can be used to control (eg, monitor) and/or optimize synergies between various systems, eg, to save energy and/or reduce enclosure (eg, facility) operating costs.

In some embodiments, the control system controls at least one environmental characteristic of the enclosure (eg, the atmosphere of the enclosure). The environmental property can be any of the environmental properties disclosed herein. In some embodiments, the control system provides an alert regarding at least one environmental characteristic of the enclosure (eg, the atmosphere of the enclosure), eg, when at least one environmental characteristic deviates from a threshold value. The threshold value can be a threshold value, a threshold function, or a threshold range (eg, a threshold value window). Alerts can be in the form of optical, written or audio messages (eg, lights or flashes, sounds or written messages).

In some embodiments, the control system is operably (eg, communicatively) coupled to a set of devices (eg, sensors and/or transmitters). In some embodiments, the set facilitates control of the environment and/or alerts. This control may utilize a control scheme such as feedback control or any of the other control schemes described herein. The set may include at least one sensor configured to sense electromagnetic radiation. The electromagnetic radiation may be (human) visible light, infrared (IR) or ultraviolet (UV) radiation. At least one sensor may comprise an array of sensors. For example, the set may include an IR sensor array (eg, such as a far infrared thermal array made by Melexis). The IR sensor array may have a resolution of at least 32x24 pixels. The IR sensor can be coupled to the digital interface. The set can contain IR cameras. The set can contain sound detectors. The set can contain microphones. The set may include any of the sensors and/or transmitters disclosed herein. The set may include _CO2 , VOC, temperature, humidity, electromagnetic light, pressure and/or noise sensors. Sensors may include gesture sensors (eg, RGB gesture sensors), acetate meters, or sound sensors. The sound sensor may include an audio decibel level detector. The sensor may include a meter driver. The set may include microphones and/or processors. The set may include a camera (eg, a 4K pixel camera), a UWB sensor and/or transmitter, a Bluetooth (BLE) sensor and/or transmitter, a processor. The camera may be of any camera resolution disclosed herein. One or more of the devices (eg, sensors) may be integrated on the chip. A set of devices (eg, sensors) may be used to determine the presence, number, and/or identity of occupants in the enclosure (eg, using cameras). The set of devices may be used to control (eg, monitor and/or adjust) one or more environmental characteristics in the enclosure environment.

Sensors coupled to the network can be configured to sense properties including temperature, relative humidity (RH), illuminance (eg, in lux), temperature (in degrees Celsius), correlated color temperature (CCT) , such as absolute temperature), carbon dioxide (e.g., parts per million (ppm)), volatile organic compounds (VOC, e.g., as an indicator value), pressure (e.g., as sound pressure in decibels) , powder materials, infrared, ultraviolet or visible light. Sensors can have accuracy. Sensors can have random variability. Stochastic variability (eg, a statistical measure of long-term stochastic variability). The random variability of the temperature sensor may be at most about 0.5 degrees Celsius (°C), 0.3°C, 0.2°C, or 0.1°C. The random variability of the RH sensor can be at most about 3%, 2%, 1.5% or 1%. The random variability of the illuminance sensor can be at most about 20 LUX, 15 LUX, 10 LUX, or 5 LUX. The random variability of a CCT sensor can be at most about 250 Kelvin (K), 220 K, 210 K, 200 K, 190 K, or 150 K. The random variability of the carbon dioxide sensor can be at most about 25 ppm, 23 ppm, 20 ppm, 19 ppm or 15 ppm. The random variability of a VOC sensor can be up to about 15 index values (IV), 12 IV, 11 IV, 10 IV, or 5 IV. The random variability of the sound pressure sensor can be up to about 10 decibels (dB), 8 dB, 5 dB, 4 dB, or 2 dB. Occasionally, the sensor set may include measuring the temperature of the set of devices (eg, the temperature of the set of internal devices) and/or the temperature outside the set of devices (eg, the temperature of the set of external devices, such as the temperature in the room in which the set of devices is housed) ). In some embodiments, data from the sensor(s) is subjected to processing and/or analysis. Data processing may include removing gaps, removing anomalies (eg, out-of-range data), performing spatial extrapolation or calibration. Data processing may vary for data obtained by different types of sensors. For example, data from a temperature sensor may undergo different processing and/or analysis than data from a VOC sensor. Data processing may include data manipulation. Data processing may include data filtering. Data filtering may be different for data obtained by different types of sensors. Data filtering may include median, mean, standard deviation, or select the minimum value as the filtering mechanism(s). Data filtering may include finding absolute deviations (eg, mean absolute deviation and/or median absolute deviation). In some cases, median-based methods can be better than mean-based methods. The medium may contain a median of absolute deviation. Sometimes, data processing and/or analysis may include finding the standard deviation of the minimum value, eg, to derive long-term variation (eg, in a particular location of a sensor). The median absolute deviation may contain the absolute distance from the median median. The mean absolute deviation can include the mean absolute distance from the mean. Filtering may include removing ambient noise (eg, fluctuations). Spatial extrapolation may have properties measured by the sensor(s) for the space in which the sensors are disposed, eg, to provide a map of sensor properties of the space. For example, the sensor data may have temperature, and the spatial map may be a temperature map of the room in which the temperature sensor is placed. The calibration engine can account for device-based long-term drift. An example of sensor calibration can be found in International Patent Application Serial No. PCT/US21/15378, filed January 28, 2021, entitled "SENSOR CALIBRATION AND OPERATION", which international patent application The application is incorporated herein by reference in its entirety. Data processing and/or analysis may be refreshed, for example, periodically. For example, sensor sampling may be performed at most every 10 seconds (s), 20 seconds, 30 seconds, 45 seconds, 60 seconds, 2 minutes (min), 5 minutes, or 10 minutes. Sensor sampling may be performed between any of the foregoing values (eg, every 10 seconds to every 10 minutes). For example, spatial mapping of the sensed attribute(s) may be performed at most every 1 minute (min), 2.5 minutes, 5 minutes, or 10 minutes. Spatial mapping can be performed between any of the foregoing values (eg, every 1 minute to every 10 minutes). Sensor sampling and/or spatial mapping may be performed during periods of high and/or low occupancy of the facility. Sensor sampling and/or spatial mapping may be performed during periods of high and/or low activity of the facility (eg, personnel and/or machinery). Sensor sampling and/or spatial mapping may be performed randomly and/or on a whim.

In some embodiments, the set (or set of sets) may be used to detect characteristics of the enclosure occupant(s). For example, the set may be used to detect abnormal physical characteristics of the enclosure occupant(s). Abnormal body characteristics may include body temperature, coughing, sneezing, sweating (eg, humidity and/or VOC emissions), _CO2 content. The set(s) may be used to locate the absolute and/or relative positioning of the enclosure(s) occupants. For example, the set(s) can be used to measure relative distances between occupants in the enclosure and/or between occupant(s) in the enclosure and hard and/or dense objects. Rigid and/or dense objects may include fixtures (eg, walls, ceilings, floors, windows, doors, shelves, ceiling or wall lamps) or mobile furniture (eg, chairs, tables, or lamps).

In some embodiments, the local (eg, window) controller may be integrated with the BMS and/or control system. The local controller can be configured to control one or more devices including tintable windows (eg, including electrochromic windows), sensors, transmitters, or antennas. In one embodiment, the electrochromic window includes at least one all solid state and inorganic electrochromic device. An electrochromic window may include more than one electrochromic device, eg, where at least two windows (eg, each window) are tintable. In one embodiment, the electrochromic window (eg, only) includes all solid state and inorganic electrochromic devices. In one embodiment, the one or more electrochromic windows comprise organic electrochromic devices. In one embodiment, the electrochromic window is a multi-state electrochromic window. An example of a tintable window and its control can be found in US Patent Application Serial No. 12/851,514, filed August 5, 2010 and entitled "MULTI-PANE ELECTROCHROMIC WINDOWS", which The US patent application is incorporated herein by reference in its entirety.

In some embodiments, a plurality of devices may be operably (eg, communicatively) coupled to the control system and/or BMS. A control system may include a hierarchy of controllers. The device may include transmitters, sensors, or windows (eg, insulating glass units or IGUs). The device can be any device disclosed herein. At least two of the plurality of devices may be of the same type. For example, two or more IGUs may be coupled to the control system. At least two of the plurality of devices may be of different types. For example, sensors and transmitters can be coupled to the control system. Sometimes, the plurality of devices can include at least about 20, 50, 100, 500, 1000, 2500, 5000, 7500, 10000, 50000, 100000, or 500000 devices. The plurality of devices can have any number between the foregoing numbers (eg, from about 20 devices to about 500,000 devices, from about 20 devices to about 50 devices, from about 50 devices to about 500 devices, from about 500 devices to about 2,500 devices, from about 1,000 devices to about 5,000 devices, from about 5,000 devices to about 10,000 devices, from about 10,000 devices to about 100,000 devices, or from about 100,000 devices to about 500,000 devices). For example, the number of windows in a floor may be at least about 5, 10, 15, 20, 25, 30, 40 or 50. The number of windows in a floor can be any number between the foregoing numbers (eg, from about 5 to about 50, from about 5 to about 25, or from about 25 to about 50). Devices can sometimes be in multistory buildings. At least a portion of the floors of the multi-story building may have device(s) controlled by the control system (eg, at least a portion of the floors of the multi-story building may be controlled by the control system). For example, a multi-story building may have at least about 2, 8, 10, 25, 50, 80, 100, 120, 140, or 160 floors controlled by the control system. The number of floors (eg, devices therein) controlled by the control system can be any number between the foregoing numbers (eg, from 2 to 50, from 25 to 100, or from 80 to 160). A floor may have an area of at least about 150 square meters, 250 square meters, 500 square meters, 1000 square meters, 1500 square meters, or 2000 square meters (m ² ). Floors can have an area between any of the foregoing floor area values (eg, from about 150 square meters to about 2000 square meters, from about 150 square meters to about 500 square meters, from about 250 square meters feet to about 1000 square meters or from about 1000 square meters to about 2000 square meters). A building may comprise an area of at least about 1,000 square feet (sqft), 2,000 square feet, 5,000 square feet, 10,000 square feet, 100,000 square feet, 150,000 square feet, 200,000 square feet, or 500,000 square feet. A building may include an area between any of the above areas (eg, from about 1,000 square feet to about 5,000 square feet, from about 5,000 square feet to about 500,000 square feet, or from about 1,000 square feet to about 500,000 square feet ). A building may comprise an area of at least about 100 square meters, 200 square meters, 500 square meters, 1,000 square meters, 5,000 square meters, 10,000 square meters, 25,000 square meters, or 50,000 square meters. A building may include an area between any of the above areas (eg, from about 100 square meters to about 1000 square meters, from about 500 square meters to about 25,000 square meters, from about 100 square meters to about 50,000 square meters). Facilities may contain commercial or residential buildings. A commercial building may include tenant(s) and/or owner(s). Residential facilities may contain multi-family or single-family buildings. Residential facilities may include residential complexes. Residential facilities may include single-family dwellings. Residential facilities may include multi-family dwellings (eg, apartments). Residential facilities may include townhouses. Facilities may contain both residential and commercial components.

FIG. 1 depicts a schematic example of an embodiment of a BMS and control system 100 . In this example, the BMS manages various systems of the building 101, including security systems, heating ventilation and air conditioning systems (abbreviated herein as "HVAC"), lighting, electrical systems, elevators, fire protection systems, and the like. Security systems may include magnetic card access, cross-shaped antennas, solenoid actuated door locks, (eg, surveillance) cameras, (eg, burglar) alarms, and/or metal detectors. The BMS and/or the control system may control at least one fire protection system and/or fire suppression system. The fire protection system(s) may include a fire alarm. The fire suppression system(s) may include water pipe controls. The lighting system may include interior lighting, exterior lighting, emergency warning lights, emergency exit signs, and/or emergency floor (eg, exit or entrance) lighting. The power system may include mains power, backup generators, and/or an uninterruptible power supply (UPS) grid for the enclosure (eg, facility). BMS manages the control system. The BMS can be managed by the control system. The BMS can be included in the control system. In the example shown in FIG. 1, main controller 103 is depicted as including main controller 103, intermediate controllers 105a and 105b (which may be floor controllers and/or network controllers), and local controllers (eg, A distributed network of end or blade controllers, such as window controllers) 110 to local (eg, window) controllers. The main controller 103 may or may not be physically proximate to the BMS 100 . At least one floor (eg, each floor) of building 101 may have one or more intermediate controllers 105a and 105b. At least one device (eg, a window) may have its own home controller 110 . The local controller can control at least 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10 devices. The control system may or may not have intermediate controller(s). The control system may have 1, 2, 3 or more hierarchical control levels. In the example shown in FIG. 2, a local controller (eg, 204) may control a plurality of devices. Devices may include windows, sensors, transmitters, antennas, receivers, or transceivers.

At least one (eg, each) local controller may be located in a location separate from or integrated into the device it controls. For simplicity, only ten electrochromic windows of building 101 are depicted as being controlled by master controller 103 . In a setup, there may be a large number of devices in the enclosure controlled by the master controller 103 .

In some embodiments, the control system may include or be operably coupled to the BMS. By incorporating feedback, the BMS and/or control system can provide enhancements to: (1) environmental control; (2) energy savings; (3) safety; (4) flexibility of control options; (5) improvements to other systems Reliability and useful life (eg, coordination of systems can reduce overall operating time of individual systems, resulting in less system maintenance); (6) information availability and diagnostics; (7) efficient use and higher productivity from staff; and any combination thereof (eg, because electrochromic windows can be automatically controlled). In some embodiments, the BMS may not exist, or the BMS may exist but may not communicate with the control system (eg, with the master controller), or communicate with the control system (eg, with the master controller) at a high level. In some embodiments, maintenance of the BMS will not interrupt control of one or more devices (eg, electrochromic windows) to which the BMS and/or the control system are coupled.

In some embodiments, the processing system has a hierarchical structure that includes a master controller at the highest level, a local controller(s) at an intermediate level, and a local controller at the lowest level (eg, window controller). FIG. 2 shows an example of a control system architecture 200 that includes a master controller 208 that controls floor controllers 206 , which in turn control home controllers 204 . In some embodiments, the local controller controls one or more IGUs, one or more sensors, one or more output devices (eg, one or more transmitters), one or more antennas, or any of these combination. FIG. 2 shows an example of a configuration in which a master controller is operably coupled (eg, wirelessly and/or wired) to a building management system (BMS) 224 and database 220 . The arrows in FIG. 2 indicate communication paths. The controller may be operably coupled (eg, directly/indirectly and/or wired and wirelessly) to the external source 210 . External sources can include networks. The external source may include one or more sensors or output devices. External sources may include cloud-based applications and/or databases. Communication may be wired and/or wireless. External sources may be located outside the facility. For example, the external source may include one or more sensors and/or antennas disposed on, for example, a wall or ceiling of a facility. Communication can be one-way or two-way. In the example shown in Figure 2, all communication arrows are intended to be bidirectional.

In some embodiments, sensors and/or other modules are operably coupled to at least one controller and/or processor in one or more separate assemblies. Sensor readings may be obtained by one or more processors and/or controllers. A controller may include a processing unit (eg, a CPU or GPU). The controller can receive input (eg, from at least one sensor). The controller may include circuitry, electrical wiring, optical wiring, sockets and/or sockets. The controller can deliver output. A controller may contain multiple (eg, sub) controllers. The controller may be part of a control system. The control system may include a master controller, a floor (eg, including a network controller) controller, or a local controller. The local controller may be a window controller (eg, controlling an optically switchable window), an enclosure controller, or a component controller. For example, the controller may be a hierarchical control system (eg, including a master controller that directs one or more controllers, such as floor controllers, local controllers (eg, window controllers), closed body controller and/or component controller). The physical location of controller types in a hierarchical control system may be changing. For example: at the first time: the first processor can assume the role of the main controller, the second processor can assume the role of the floor controller, and the third processor can assume the role of the local controller. At the second time: the second processor can assume the role of the main controller, the first processor can assume the role of the floor controller, and the third processor can maintain the role of the local controller. At the third time: the third processor can assume the role of the main controller, the second processor can assume the role of the floor controller, and the first processor can assume the role of the local controller. The controller may control one or more devices (eg, directly coupled to the devices). A controller may be positioned proximate to one or more devices it is controlling. For example, the controller may control optically switchable devices (eg, IGUs), antennas, sensors, and/or output devices (eg, light sources, sound sources, odor sources, gas sources, HVAC outlets, or heaters). In one embodiment, a floor controller may direct one or more window controllers, one or more enclosure controllers, one or more component controllers, or any combination thereof. Floor controllers may include network controllers. For example, a floor (eg, including a network) controller may control a plurality of local (eg, including a window) controller. A plurality of local controllers may be located in a portion of a facility (eg, in a portion of a building). This part of the facility may be the floor of the facility. For example, floor controllers can be assigned to floors. In some embodiments, a floor may include a plurality of floor controllers, eg, depending on the floor size and/or the number of local controllers coupled to the floor controllers. For example, a floor controller can be assigned to a portion of a floor. For example, a floor controller can be assigned to a portion of the local controllers located in the facility. For example, a floor controller can be assigned to a portion of a floor of a facility. The main controller can be coupled to one or more floor controllers. Floor controllers can be placed in the facility. The main controller can be located in the facility or outside the facility. The main controller can be located in the cloud. The controller may be part of or operably coupled to the building management system. The controller can receive one or more inputs. The controller can generate one or more outputs. The controller may be a single-input single-output controller (SISO) or a multiple-input multiple-output controller (MIMO). The controller can interpret the received input signal. The controller may obtain data from one or more components (eg, sensors). Acquiring can include receiving or extracting. Data may include measurements, estimates, determinations, generation, or any combination thereof. The controller may contain feedback control. The controller may include feedforward control. Control may include on-off control, proportional control, proportional-integral (PI) control, or proportional-integral-derivative (PID) control. Control can include open loop control or closed loop control. The controller may contain closed loop control. The controller may contain open loop control. The controller may include a user interface. The user interface may include (or be operably coupled to) a keyboard, keypad, mouse, touch screen, microphone, speech recognition package, camera, imaging system, or any combination thereof. The output may include a display (eg, a screen), speakers, or a printer.

In some embodiments, a floor controller (eg, a network controller) may have a structure as shown for a network controller, which is described in a publication entitled "For Optical Switchables" published on December 3, 2019 CONTROLLERS FOR OPTICALLY-SWITCHABLE DEVICES" in US Pat. No. 10,495,939, which is incorporated herein by reference in its entirety. In some embodiments, the floor controller may control some of the functions, processes or operations of the main controller. The floor controller may include additional functionality and/or capabilities not described with reference to the main controller.

In some embodiments, a plurality of assemblies (eg, sets) throughout a particular enclosure (eg, a building), in portions thereof (eg, rooms or floors), or across a plurality of such enclosures serve as a processing system deployment of interconnected nodes within. 3 shows a schematic example of a processing system (eg, a network of controllers) within an enclosure. In the example of FIG. 3 , enclosure 300 is a building having floor 1 , floor 2 and floor 3 . The enclosure 300 includes a network 320 (eg, a wired network) provided to communicatively couple with a group of components (eg, nodes) 310 . In the example shown in FIG. 3 , the three floors are sub-enclosures within enclosure 300 . At least two of the devices 310 may be of different types from each other. At least two of the devices 310 may be of the same type.

In some embodiments, the enclosure includes one or more sensors. Sensors can help control the environment of the enclosure so that the occupants of the enclosure can be more comfortable, desirable, beautiful, healthy, productive (eg, in terms of resident performance), easier to live (eg, work), or any of these. combined environment. The sensor(s) can be configured as low or high resolution sensors. A sensor can provide an on/off indication of the occurrence and/or presence of an environmental event (eg, a pixel sensor). In some embodiments, the accuracy and/or resolution of the sensor may be improved through analysis of the sensor's measurements by artificial intelligence (abbreviated herein as "AI"). Examples of artificial intelligence techniques that may be used include: reactivity, limited memory, theory of mind, and/or self-awareness techniques. In some embodiments, sensor data analysis includes linear regression, least squares fitting, Gaussian procedure regression, kernel regression, nonparametric multiplicative regression (NPMR), regression trees, local regression, semiparametric regression, isotonic regression, multiple Variable Adaptive Regression Splines (MARS), Logistic Regression, Robust Regression, Polynomial Regression, Stepwise Regression, Ridge Regression, Lasso Regression, Elastic Net Regression, Principal Component Analysis (PCA), Singular Value Decomposition, Fuzzy Measure Theory, Polet Borel measure, Han measure, Risk neutral measure, Lebesgue measure, Grouped data disposition method (GMDH), Naive Bayes classifier, k nearest neighbor algorithm (k-NN) ), support vector machine (SVM), neural network, support vector machine, classification and regression tree (CART), random forest, gradient boosting or generalized linear model (GLM) techniques. Sensors can be configured to process, measure, analyze, detect and/or respond to: data, temperature, humidity, sound, force, pressure, concentration, electromagnetic waves, position, distance, movement, flow, acceleration , speed, vibration, dust, light, glare, color, gas type, and/or other aspects (eg, properties) of the environment (eg, enclosure). Gases may include volatile organic compounds (VOCs). Gases may include carbon monoxide, carbon dioxide, water vapor (eg, humidity), oxygen, radon, and/or hydrogen sulfide. One or more sensors may be calibrated at the factory and/or at the facility. The sensor can be optimized to perform accurate measurements of one or more environmental characteristics that exist in factory settings and/or the facility in which the sensor is deployed.

In some embodiments, a plurality of sensors of the same type may be distributed among a plurality of nodes in the enclosure. At least one of the plurality of sensors of the same type may be part of a set. For example, at least two of the plurality of sensors of the same type may be part of at least two different sets. The sensor set may be distributed in the enclosure. Enclosures may contain meeting rooms or cafeterias. For example, a plurality of sensors of the same type can measure environmental parameters in a conference room. In response to measurements of environmental parameters of the enclosure, a parametric topology of the enclosure can be generated. The parametric topology can be generated using output signals from, for example, any type of sensor or set of sensors disclosed herein. A parametric topology can be created for any enclosure of a facility, such as meeting rooms, hallways, restrooms, cafeterias, garages, auditoriums, utility rooms, storage rooms, machine rooms, and/or elevators.

4 shows an example of a diagram 400 of a configuration of sensor sets distributed within an enclosure. In some embodiments, a set includes transmitter(s), controller(s) (eg, local), antenna(s), radar(s), or other modules. In the example shown in FIG. 4 , a group 410 of individuals are seated in a conference room 402 . The conference room includes an "X" dimension to indicate length, a "Y" dimension to indicate height, and a "Z" dimension to indicate depth. XYZ is the direction of the Cartesian coordinate system. At least two sensor sets (eg, 405A, 405B, and 405C) can be integrated into respective merged assemblies. Sensor sets 405A, 405B, and 405C may include carbon dioxide ( _CO2 ) sensors, ambient noise sensors, or any other sensor disclosed herein. In the example shown in FIG. 4, first sensor set 405A is positioned (eg, mounted) near point 415A, which may correspond to a ceiling, wall on the side of a table where group 410 of individuals are seated location or other locations. In the example shown in FIG. 4, the second sensor set 405B is positioned (eg, mounted) near a point 415B, which may correspond to above (eg, directly above) a table where the group 410 of individuals are seated ceiling, wall or other location. In the example shown in FIG. 4, the third sensor set 405C may be positioned (eg, mounted) at or near a point 415C, which may correspond to a table where the relatively small group of individuals 410 are seated side ceiling, wall or other location. Any number of additional sensors and/or sensor modules may be positioned elsewhere in meeting room 402 . The sensor set can be placed anywhere in the enclosure. The location of the sensor set in the enclosure may have coordinates (eg, in a Cartesian coordinate system). At least one coordinate (eg, of x, y, and z) may differ between two or more sets of sensors, eg, disposed in an enclosure. At least two coordinates (eg, of x, y, and z) may differ between two or more sets of sensors, eg, disposed in an enclosure. All coordinates (eg, of x, y, and z) may differ between two or more sets of sensors, eg, disposed in an enclosure. For example, two sensor sets may have the same x-coordinate and different y and z-coordinates. For example, the two sensor sets may have the same x and y coordinates, and different z coordinates. For example, the two sensor sets may have different x, y, and z coordinates.

In certain embodiments, one or more sensors in the sensor set provide readings. In some embodiments, the sensor is configured to sense the parameter. Parameters can include temperature, particulate matter, volatile organic compounds, electromagnetic energy, pressure, concentration, acceleration, time, radar, lidar, glass breakage, movement, or gas type. The gas type may include Nobel gas. The gas may be harmful to ordinary people. The gas may be a gas present in the ambient atmosphere (eg, oxygen, carbon dioxide, ozone, chlorinated carbon compounds, or nitrogen). Gases may include radon, carbon monoxide, hydrogen sulfide, phosgene, formaldehyde (or other volatile aldehydes), hydrogen, oxygen, water (eg, humidity). Electromagnetic sensors may include infrared, visible light, ultraviolet sensors. The infrared radiation may be passive infrared radiation (eg, blackbody radiation). Electromagnetic sensors can sense geographic location related signals. The electromagnetic sensor can sense UWB, GPS and/or BLE signals. Electromagnetic sensors can sense radio waves. Radio waves may include broadband or ultra-wideband (UWB) radio signals. The radio waves may include pulsed radio waves. Radio waves may include radio waves used for communication. A gas sensor can sense gas type, flow rate (eg, velocity and/or acceleration), pressure (absolute or relative, such as gas partial pressure), and/or concentration (absolute or relative). Readings can have amplitude ranges. Readings can have parameter ranges. For example, the parameter may be the wavelength of the electromagnetic wave. For example, the range can be the range of detected wavelengths.

In some embodiments, a device (eg, a transceiver) and/or a (local) network to which the device is operably coupled is configured for radio communication. In some embodiments, the transceiver and/or the area network may be configured to transmit and receive one or more signals using a personal area network (PAN) standard, such as IEEE 802.15.4. In some embodiments, the signals may include Bluetooth, Wi-Fi, or EnOcean signals (eg, wide bandwidth). The one or more signals may include ultra-wideband (UWB) signals (eg, having frequencies in the range of about 2.4 to about 10.6 gigahertz (GHz) or about 7.5 GHz to about 10.6 GHz). An ultra-wideband signal may be a signal having a fractional bandwidth greater than about 20%. Ultra-wideband signals may have bandwidths greater than about 500 megahertz (MHz). One or more signals may use low energy levels (eg, low power) for short range. Signals (eg, having radio frequencies) may employ a spectrum capable of penetrating solid structures (eg, walls, doors, and/or windows). Low power can be up to 25 milliwatts (mW), 50 mW, 75 mW, or 100 mW. The low power can be any value between the foregoing values (eg, from 25 mW to 100 mW, from 25 mW to 50 mW, or from 75 mW to 100 mW). In some embodiments, a local area network (eg, including one or more fixed sensors and/or fixed transceivers) is configured to (I) locate transient transceivers in real-time, (II) at about 20, Accuracy of 10 or 5 cm or higher to locate transient transceivers, (III) to transmit and sense ultra-wide radio waves, and/or (IV) to be operably coupled to configured to control placement A control system for an installation of a local area network with one or more fixed sensors and/or fixed transceivers.

In some embodiments, the (local) network incorporates and/or facilitates geo-location technologies (eg, Global Positioning System (GPS), Bluetooth (BLE), Ultra-Wide Band (UWB) and/or using micro-location chips, for example) or dead reckoning navigation). Geolocation technology can help determine the location of signal sources (eg, the location of a temporary tag containing a transceiver that facilitates geolocation technology) with an accuracy of at least 100 centimeters (cm), 75 centimeters, 50 centimeters, 25 centimeters , 20 cm, 10 cm or 5 cm. In some embodiments, the electromagnetic radiation of the signal includes ultra-wideband (UWB) radio waves, ultra-high frequency (UHF) radio waves, or radio waves used in global positioning systems (GPS). In some embodiments, the electromagnetic radiation includes electromagnetic waves having a frequency of at least about 300 MHz, 500 MHz, or 1200 MHz. In some embodiments, the signal includes location and/or time data. The location may have transient circuitry (eg, identification tags). Positioning may utilize one or more stationary devices (eg, including sensors, transmitters, and/or transceivers). In some embodiments, the transient circuitry to be located utilizes Bluetooth, UWB, UHF and/or Global Positioning System (GPS) technology. In some embodiments, the signal has a spatial capacity of at least about 1013 bits per second per square meter (bit/s/m²).

In some embodiments, pulse-based ultra-wideband (UWB) technology (eg, ECMA-368 or ECMA-369) is used for A wireless technology that transmits large amounts of data within 200' or 150') at low power (eg, less than about 1 millivolt (mW), 0.75 mW, 0.5 mW, or 0.25 mW). UWB signals may occupy at least about 750 MHz, 500 MHz, or 250 MHz of the bandwidth spectrum, and/or at least about 30%, 20%, or 10% of its center frequency. UWB signals may be transmitted by one or more pulses. Components that broadcast digital signal pulses can simultaneously time (eg, precisely) a carrier signal across several frequency channels. Information may be conveyed, for example, by modulating the timing and/or positioning of signals (eg, pulses). Signal information may be transmitted by encoding the polarity of the signal (eg, pulses), its amplitude, and/or by using quadrature signals (eg, pulses). The UWB signal may be a low power information transfer protocol. UWB technology can be used for (eg, indoor) location applications. The broad range of the UWB spectrum includes low frequencies with long wavelengths that allow UWB signals to penetrate a variety of materials, including various building fixtures (eg, walls). A wide frequency range (eg, including low penetration frequencies) may reduce the chance of multipath propagation errors (not wishing to be bound by theory, since some wavelengths may have line-of-sight trajectories). UWB communication signals (eg, pulses) may be short (eg, for pulses of about 600 MHz, 500 MHz, or 400 MHz wide, with at most about 70 cm, 60 cm, or 50 cm; or for pulses with about 1 GHz, 1.2 GHz , 1.3 GHz or 1.5 GHz bandwidth with up to about 20 cm, 23 cm, 25 cm or 30 cm). A short communication signal (eg, pulse) may reduce the chance that the reflected signal (eg, pulse) will overlap the original signal (eg, pulse).

In some embodiments, temporary circuitry (eg, tags) may be located in enclosures (eg, facilities such as buildings). The user may be located using one or more sensors and/or transceivers. Users and/or assets can be tagged. Tags may include radio frequency identification (eg, RFID) technology (eg, transceiver), Bluetooth technology, and/or global positioning system (GPS) technology. The radio frequencies may include ultra-wideband radio frequencies. The tag may be sensed by one or more sensors disposed in the enclosure. The sensor may be part of the transceiver. The sensor(s) may be placed in a set of devices. A set of devices may include sensors or transmitters. The sensor(s) may be operably (eg, communicatively) coupled to the network. The network may have low latency communication, eg, within a closed body. Radio waves (eg, transmitted and/or sensed by tags) may include broadband or ultra-broadband radio signals. The radio waves may include pulsed radio waves. Radio waves may include radio waves used for communication. The radio waves can be at an intermediate frequency of at least about 300 kilohertz (KHz), 500 KHz, 800 KHz, 1000 KHz, 1500 KHz, 2000 KHz, or 2500 KHz. Radio waves can be at intermediate frequencies of up to about 500 KHz, 800 KHz, 1000 KHz, 1500 KHz, 2000 KHz, 2500 KHz, or 3000 KHz. The radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 300 KHz to about 3000 KHz). Radio waves can be at high frequencies of at least about 3 megahertz (MHz), 5 MHz, 8 MHz, 10 MHz, 15 MHz, 20 MHz, or 25 MHz. Radio waves can be at high frequencies up to about 5 MHz, 8 MHz, 10 MHz, 15 MHz, 20 MHz, 25 MHz, or 30 MHz. Radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 3 MHz to about 30 MHz). Radio waves can be at very high frequencies of at least about 30 megahertz (MHz), 50 MHz, 80 MHz, 100 MHz, 150 MHz, 200 MHz, or 250 MHz. Radio waves can be at very high frequencies of up to about 50 MHz, 80 MHz, 100 MHz, 150 MHz, 200 MHz, 250 MHz, or 300 MHz. Radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 30 MHz to about 300 MHz). Radio waves can be at ultra-high frequencies of at least about 300 kilohertz (MHz), 500 MHz, 800 MHz, 1000 MHz, 1500 MHz, 2000 MHz, or 2500 MHz. Radio waves can be at ultra-high frequencies of up to about 500 MHz, 800 MHz, 1000 MHz, 1500 MHz, 2000 MHz, 2500 MHz, or 3000 MHz. Radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 300 MHz to about 3000 MHz). Radio waves can be at UHF frequencies of at least about 3 gigahertz (GHz), 5 GHz, 8 GHz, 10 GHz, 15 GHz, 20 GHz, or 25 GHz. Radio waves can be at UHF frequencies of up to about 5 GHz, 8 GHz, 10 GHz, 15 GHz, 20 GHz, 25 GHz, or 30 GHz. Radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 3 GHz to about 30 GHz).

In some embodiments, the identification tag of the occupant includes a location device. Location devices (also referred to herein as "location devices") can damage radio transmitters and/or receivers (eg, broadband or ultra-broadband radio transmitters and/or receivers). The positioning device may include a Global Positioning System (GPS) device. The positioning device may include a Bluetooth device. The positioning device may include a radio wave transmitter and/or receiver. Radio waves may include broadband or ultra-broadband radio signals. The radio waves may include pulsed radio waves. Radio waves may include radio waves used for communication. The radio waves can be at an intermediate frequency of at least about 300 kilohertz (KHz), 500 KHz, 800 KHz, 1000 KHz, 1500 KHz, 2000 KHz, or 2500 KHz. Radio waves can be at intermediate frequencies of up to about 500 KHz, 800 KHz, 1000 KHz, 1500 KHz, 2000 KHz, 2500 KHz, or 3000 KHz. The radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 300 KHz to about 3000 KHz). Radio waves can be at high frequencies of at least about 3 megahertz (MHz), 5 MHz, 8 MHz, 10 MHz, 15 MHz, 20 MHz, or 25 MHz. Radio waves can be at high frequencies up to about 5 MHz, 8 MHz, 10 MHz, 15 MHz, 20 MHz, 25 MHz, or 30 MHz. Radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 3 MHz to about 30 MHz). Radio waves can be at very high frequencies of at least about 30 megahertz (MHz), 50 MHz, 80 MHz, 100 MHz, 150 MHz, 200 MHz, or 250 MHz. Radio waves can be at very high frequencies of up to about 50 MHz, 80 MHz, 100 MHz, 150 MHz, 200 MHz, 250 MHz, or 300 MHz. Radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 30 MHz to about 300 MHz). Radio waves can be at ultra-high frequencies of at least about 300 kilohertz (MHz), 500 MHz, 800 MHz, 1000 MHz, 1500 MHz, 2000 MHz, or 2500 MHz. Radio waves can be at ultra-high frequencies of up to about 500 MHz, 800 MHz, 1000 MHz, 1500 MHz, 2000 MHz, 2500 MHz, or 3000 MHz. Radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 300 MHz to about 3000 MHz). Radio waves can be at UHF frequencies of at least about 3 gigahertz (GHz), 5 GHz, 8 GHz, 10 GHz, 15 GHz, 20 GHz, or 25 GHz. Radio waves can be at UHF frequencies of up to about 5 GHz, 8 GHz, 10 GHz, 15 GHz, 20 GHz, 25 GHz, or 30 GHz. Radio waves can be at any frequency between the aforementioned frequency ranges (eg, from about 3 GHz to about 30 GHz).

In some embodiments, the positioning device facilitates positioning within a margin of error. The error range of the positioning device may be up to about 5 meters (m), 4 m, 3 m, 2 m, 1 m, 0.5 m, 0.4 m, 0.3 m, 0.2 m, 0.1 m or 0.05 m. The error range of the positioning device can be any value between the foregoing values (eg, from about 5 m to about 0.05 m, from about 5 m to about 1 m, from about 1 m to about 0.3 m, and from about 0.3 m to about 0.3 m to about 0.05 m). The margin of error may indicate the accuracy of the positioning device.

In some embodiments, the (eg, local, such as a facility) network infrastructure has vertical data planes (between building floors) and horizontal data planes (within a single floor or multiple adjacent floors). The horizontal and vertical data planes may have (eg, substantially) similar at least one data carrying capability. The horizontal and vertical data planes may have (eg, substantially) similar network components of at least one type. In other cases, the two data planes have different data carrying capabilities. In some cases, the horizontal and vertical data planes have (eg, substantially) the same (or similar) data carrying capabilities and/or network component types. In other cases, the vertical and horizontal data planes have at least one (eg, all) data carrying capabilities and/or network components that are different from each other. For example, a vertical data plane may contain network components for fast communication (eg, data transfer) rates and/or bandwidth. Faster communication rates may be at least approximately 1 gigabit per second (Gbit/s), 10 Gbit/s, 50 Gbit/s, 100 Gbit/s, 250 Gbit/s, 500 Gbit/s, 750 Gbit/s , 1 terabit per second (Tbit/s) or 1.125 Tbit/s. The faster communication rate can be any communication rate between the foregoing rates (eg, from about 1 Gbit/s to about 1.125 Tbit/s, from about 1 Gbit/s to about 500 Gbit/s, or from about 250 Gbit/s to about 1.125 Tbit/s). Vertical network components may contain optical fibers. Horizontal network components can consist of coaxial cables or twisted pairs. A horizontal network assembly may be free of one or more fiber optic cables.

In some embodiments, the sensor data is responsive to the environment in the enclosure and/or any inducer(s) to changes in this environment (eg, any environmental disturbances). The sensor data may be in response to emitter(s) (eg, the source of the emission may be an occupant, an appliance (eg, heater, cooling) operably coupled to the enclosure (eg, in the enclosure) , ventilation and/or vacuum) and/or closure openings). For example, sensor data may be in response to air conditioning ducts, or in response to open windows. Sensor data may be responsive to activity occurring in the room. Activities may include human activities and/or non-human activities. Activities may include electronic activities, gas activities, and/or chemical activities. Activities can include sensory activities (eg, sight, touch, smell, hearing, and/or taste). Activity may include electronic and/or magnetic activity. Activity can be sensed by a person. Activity may not be sensed by humans. The sensor data may be in response to occupants in the enclosure, substance (eg, gas) flow, substance (eg, gas) pressure and/or temperature.

In one example, the sensor set (eg, 405A, 405B, and 405C) may include a carbon dioxide ( _CO2 ) sensor and an ambient noise sensor. The carbon dioxide sensor of sensor set 405A may provide readings as depicted in sensor output reading distribution 425A as shown in the example of FIG. 4 . The noise sensors of sensor set 405A may provide readings that are also depicted in sensor output reading distribution 425A. The carbon dioxide sensor of sensor set 405B may provide readings as depicted in sensor output reading distribution 425B. The noise sensors of sensor set 405B may provide readings also as depicted in sensor output reading distribution 425B. Relative to sensor output reading distribution 425A, sensor output reading distribution 425B may indicate higher levels of carbon dioxide and noise. Sensor output reading distribution 425C may indicate lower levels of carbon dioxide and noise relative to sensor output reading distribution 425B. Sensor output reading profile 425C may indicate carbon dioxide levels and noise levels similar to sensor output reading profile 425A. Sensor output reading distributions 425A, 425B, and 425C may include indications representing other sensor readings, such as temperature, humidity, particulate matter, volatile organic compounds, ambient light, pressure, acceleration, time, radar, lidar, UWB radio signals, passive infrared and/or glass breakage, motion detectors.

In some embodiments, data is collected and/or processed (eg, analyzed) from sensors in sensors in an enclosure (eg, and in a sensor set). Data processing can be done by the processor of the sensor, by the processor of the sensor set, by another sensor, by another set in the cloud, by the processor of the controller, by the processor in the enclosure, by the A processor outside the enclosure, executed by a remote processor (eg, in a different facility), by a manufacturer (eg, of sensors, windows, and/or building networks). Processing can be at least partially end-point (eg, within the set and/or the enclosure in which the set is housed). Processing may occur at least partially remotely (eg, outside the set, outside the enclosure, and/or in the cloud). Processing may be performed, at least in part, by a control system. The processing may be communicated via a network. The sensor data may have a time indicator (eg, may be time-stamped). A sensor's data may have sensor and/or location identification (eg, via a location stamp and/or a sensor stamp - such as by the sensor's identification number). The sensors may be identifiably coupled to one or more controllers.

In particular embodiments, sensor output reading distributions (eg, 425A, 425B, and 425C) may be processed. For example, as part of processing (eg, analysis), the distribution of sensor output readings may be plotted to depict sensor readings as a function of size (eg, "X" dimension) of an enclosure (eg, meeting room 402 ) and change on the graph. In an example, the carbon dioxide level indicated in the sensor output reading distribution 425A may be indicated as point 435A of the CO ₂ graph 430 of the example shown in FIG. 4 . In an example, the carbon dioxide content of sensor output reading distribution 425B may be indicated as point 435B of CO ₂ graph 430 . In an example, the carbon dioxide level indicated in sensor output reading distribution 425C may be indicated as point 435C of CO ₂ graph 430 . In an example, the ambient noise level indicated in sensor output reading distribution 425A may be indicated as point 445A of noise graph 440 . In an example, the ambient noise level indicated in sensor output reading distribution 425B may be indicated as point 445B of noise graph 440 . In an example, the ambient noise level indicated in sensor output reading distribution 425C may be indicated as point 445C of noise graph 440 .

In some embodiments, processing data derived from the sensor includes applying one or more models. Such models may include mathematical models. Processing may include fitting (eg, curve fitting) of the model(s). Models can be multi-dimensional (eg, two or three dimensional). Models can contain linear or nonlinear equations. Models can contain exponential or logarithmic equations. A model can contain one or more Boolean operations. The model can consider closed volumes. It is contemplated that the enclosure may include the structure and/or composition of the enclosure. The composition of the closure body may include the material composition of any fixtures and/or non-fixed molds in the closure body. The model may take into account building information modeling (BIM) (eg, a Revit file) of the enclosure before, during, and/or after its construction. Models may consider two-dimensional (eg, floor plans) and/or three-dimensional modeling (eg, 3D model renderings) of enclosed volumes. The model may or may not contain finite element analysis. Models can be included or used in simulations. The simulation may have at least one environmental property of the enclosure (eg, depicting the state of various locations in the enclosure). The model can be represented as a graph (eg, a 2- or 3-dimensional graph). For example, a model can be represented as a contour plot. Modeling can include one or more matrices. Models can contain topological models. The model can be related to the topology of the sensed parameter in the enclosure. The model can be related to the temporal variation of the topology of the sensed parameter in the enclosure. Models can be environment and/or enclosure specific. The model may take into account one or more properties of the enclosure (eg, size, openings, and/or environmental disruptors (eg, transmitters)). Processing of sensor data may utilize historical sensor data and/or current (eg, real-time) sensor data. Data processing (eg, using models) may be used to predict environmental changes in enclosures and/or recommend measures to mitigate, adjust, or otherwise respond to changes.

In certain embodiments, a sensor set (eg, 405A, 405B, and/or 405C) may have access to at least one model to permit curve fitting of sensor readings as a function of one or more dimensions of the enclosure. In an example, the model may be accessed to generate sensor profiles 450A, 450B, 450C, 450D, and 450E using points 435A, 435B, and 435C of _CO2 plot 430 . In an example, the model can be accessed to generate sensor profiles 451A, 451B, 451C, 451B, and 451E using points 445A, 445B, and 445C of noise graph 440 . Additional models may utilize additional readings from sensor sets (eg, 405A, 405B, and/or 405C) to provide curves other than sensor distribution curves 450 and 451 of FIG. 4 . The sensor profile generated in response to the use of the model may be a distribution of sensor output readings, indicating a function of the dimensions of the enclosure (eg, "X" dimension, "Y" dimension, and/or "Z" dimension) the value of a specific environment parameter.

In some embodiments, the parametric topology of the enclosure is modeled by generating one or more models representing the distribution of sensed parameters (eg, environmental properties), such as the sensed parameters within the enclosure. The distribution may consist of parameter values that vary according to the spatial location in the enclosure. Parameter values can be derived directly from the output of any sensor deployed in the enclosure and/or from the output of any sensor and/or available to the processor of the sensor, the processor of the sensor set, in the cloud other data computations used by the processor, the processor of the local controller, the processor in the enclosure, the processor outside the enclosure, and/or the remote processor. The distribution can be multi-dimensional (eg, similar to a topographic map or a cross-section of a topographic map).

In certain embodiments, one or more models (eg, the models used to form curves 450A-450E and 451A-451E) may provide the parametric topology of the closed volume. In an example, a parametric topology (eg, as represented by curves 450A-450E and 451A-451E) may be synthesized or generated from sensor output reading distributions. The parametric topology may be the topology of any sensed parameter disclosed herein. In an example, a parametric topology for a meeting room (eg, meeting room 402 ) may include relatively low values at locations far from the meeting room table, and locations above (eg, directly above) the meeting room table Carbon dioxide distribution with relatively high values at . In an example, a parametric topology for a conference room may include a multi-dimensional noise distribution with relatively low values at locations far from the conference table and slightly higher values above (eg, directly above) the conference room table .

In some embodiments, at least one sensor is operably coupled to a control system (eg, a computerized control system). Sensors may include light sensors, acoustic sensors, vibration sensors, chemical sensors, electrical sensors, magnetic sensors, mobility sensors, motion sensors, speed sensors, position sensors sensor, pressure sensor, force sensor, density sensor, distance sensor or proximity sensor. Sensors may include temperature sensors, weight sensors, material (eg, powder) content sensors, metrology sensors, gas sensors, or humidity sensors. Metrology sensors may include measurement sensors (eg, height, length, width, angle, and/or volume). Metrology sensors may include magnetic, acceleration, orientation, or optical sensors. Sensors can transmit and/or receive acoustic (eg, echo and/or ultrasonic), magnetic, electronic, or electromagnetic signals. Electromagnetic signals may include visible light, infrared, ultraviolet, radio waves, or microwave signals. The gas sensor can sense any of the gases described herein. The distance sensor may be one type of metrology sensor. Distance sensors may include optical sensors or capacitive sensors. Temperature sensors can include bolometers, bimetals, calorimeters, exhaust thermometers, flame detection, Gardon meters, Golay cells, heat flux sensors, infrared thermometers, micro- bolometer, microwave radiometer, net radiometer, quartz thermometer, resistance temperature detector, resistance thermometer, infrared sensor, silicon bandgap temperature sensor, special sensor microwave/imager, thermometer, thermistor , thermocouple, thermometer (eg, resistance thermometer) or pyrometer. The temperature sensor may include an optical sensor. The temperature sensor may include image processing. The temperature sensor may include a camera (eg, IR camera, CCD camera). Pressure sensors may include barometers, barometers, booster gauges, Bourdon gauges, hot filament ionization gauges, ionization gauges, McLeod gauges, U-shaped oscillating tubes , permanent downhole manometer, manometer, Pirani gauge, pressure sensor, manometer, tactile sensor or time pressure gauge. Position sensors may include growth meters, capacitive displacement sensors, capacitive sensing, free fall sensors, gravimeters, gyroscope sensors, crash sensors, inclinometers, integrated circuit piezoelectric sensing sensors, laser distance meters, laser surface velocimeters, LIDAR, linear encoders, linear variable differential transformers (LVDTs), liquid capacitance inclinometers, odometers, photoelectric sensors, piezoelectric accelerometers, rate sensors detectors, rotary encoders, rotary variable differential transformers, synchronizers, shock detectors, shock data recorders, tilt sensors, tachometers, ultrasonic thickness gauges, variable reluctance sensors, or speed receivers . Optical sensors can include charge-coupled devices, colorimeters, contact image sensors, electro-optical sensors, infrared sensors, dynamic inductance detectors, light emitting diodes (eg, light sensors), Optically addressable potentiometric sensors, Nichols radiometers, fiber optic sensors, optical position sensors, photodetectors, photodiodes, photomultipliers, phototransistors, photoinductors detector, photoionization detector, photomultiplier, photoresistor, photoelectric switch, photocell, scintillation counter, Shack-Hartmann wavefront sensor (Shack-Hartmann), single photon burst diode, ultra Conductive nanowire single-photon detectors, transition edge sensors, visible light photon counters or wavefront sensors. One or more sensors can be connected to the control system (eg, to a processor, to a computer).

Sensors and/or other devices or other modules of the set (eg, devices such as transmitters) may be organized into assembly modules. In some embodiments, a set may include a circuit board, such as a printed circuit board, with several sensors attached or attached to the circuit board. The assembly module may include a housing (eg, a shell) having an internal cavity to hold (eg, the entire) at least a portion of a circuit board and various sensors, transmitters, transmitters, receivers, integrated circuit chips, processors and/or connectors. Sensors may include temperature and/or other environmental sensors that may be adversely affected by heat generated in the assembly module. The layout of the printed circuit board and housing may include an elongated shape for placing temperature sensitive devices away from heat generating devices.

FIG. 5 shows the thermally related performance of example set module 500 during its operation. Convective diagram 501 shows the direction and velocity of air circulation around assembly module 500 when operating at a power level of about 2.5 watts. Temperature map 502 shows a side view of temperature changes outside of assembly module 500 during operation, and temperature map 503 shows a top view of temperature changes outside of assembly module 500 during its operation. Temperature map 504 depicts the temperature at the environmental sensor. Changes in temperature produced by other power dissipating components may be small enough to avoid (eg, substantially) affect the operation of the environmental sensor to a detectable extent.

In some embodiments, the centralized device may be inserted into and extracted from the circuit board, eg, using pressure. For example, the sensor may be removed from the sensor assembly. For example, the device may be inserted and/or unplugged from the circuit board. The device(s) may be individually activated and/or deactivated (eg, using switches). The circuit board may contain polymers. The circuit board may contain transparent or non-transparent portions (eg, may be transparent or non-transparent). Circuit boards may include metals (eg, elemental metals and/or metal alloys). The circuit board may contain conductors. The circuit board may contain insulators. The circuit board may contain any geometric shape (eg, rectangular or oval). The circuit board may be configured (eg, may have a shape) to allow the set to be seated in a fixture (eg, a frame or portion thereof). The frame portion may be a mullion (eg, a window mullion). The circuit board can be configured (eg, can have a shape) to allow the set to be placed in a frame (eg, door and/or window frames). The frame portion and/or cover of the set may include one or more holes to allow the sensor(s) to obtain (eg, accurate) readings. The circuit board may include electrical connectivity ports (eg, sockets). The circuit board can be connected to a power source (eg, electricity). Power sources may include renewable and/or non-renewable power sources.

A set of devices organized into a device assembly may include at least 1, 2, 4, 5, 8, 10, 20, 50, or 500 devices. A device module can include a number of devices in a range between any of the foregoing values (eg, from about 1 to about 1000, from about 1 to about 500, or from about 500 to about 1000). The sensors of the device assembly may include devices configured or designed to sense any environmental characteristic (eg, as disclosed herein), including temperature, humidity, carbon dioxide, particulate matter (eg, between between about 2.5 µm and about 10 µm), total volatile organic compounds (eg, changes in voltage potential through surface adsorption of volatile organic compounds), ambient light, audio noise levels, pressure (eg, gases and /or liquid), acceleration, time, radar, lidar, radio signals (eg, UWB radio signals), passive infrared, glass breakage, or motion detectors. The sensor set may include non-sensor devices such as buzzers and light emitting diodes. An example of a sensor set and its use can be found in the U.S. application titled "SENSING AND COMMUNICATIONS UNIT FOR OPTICALLY SWITCHABLE WINDOW SYSTEMS" filed on June 20, 2019 In patent application Ser. No. 16/447,169, the US patent application is incorporated herein by reference in its entirety.

In some embodiments, an increase in the number and/or type of sensors may be used to increase the probability that one or more measured properties are accurate and/or that a particular event measured by one or more sensors has occurred chance. In some embodiments, sensors in a sensor set may cooperate with each other. In an example, a radar sensor in a sensor set may determine that several individuals are present in the enclosure. The processor may determine that the detection of the presence of several individuals in the enclosure is positively correlated with an increase in carbon dioxide concentration. In an example, the processor-accessible memory may determine that the detected increase in infrared energy is positively correlated with the increase in temperature as detected by the temperature sensor. In some embodiments, the network interface may communicate with other sensor sets similar to the sensor sets. The network interface may additionally communicate with the controller.

6 shows an example of a diagram 600 with sensor sets organized into sensor modules. Sensors 610A, 610B, 610C, and 610D are shown included in sensor set 605 . Individual sensors in a device set (eg, sensor 610A, sensor 610D, etc.) may include and/or utilize at least one dedicated processor. A set of devices may utilize a remote processor (eg, 654) utilizing wireless and/or wired communication links. The sensor set may utilize at least one processor (eg, processor 652), which may represent a cloud-based processor coupled to the sensor set via the cloud (eg, 651). Any of the processors communicatively coupled to the set (eg, processors 652 and/or 654) may be located in the same enclosure, in different enclosures, in enclosures owned by the same or different entities, In an enclosure owned by the manufacturer of the window/controller/sensor set, or any other location. In various embodiments, as indicated by the dotted line in FIG. 6, the sensor set 605 need not include a separate processor and network interface. These entities may be separate entities and may be operably coupled to set 605 . The dotted lines in Figure 6 designate optional features. In some embodiments, on-board processing and/or memory of one or more sensor sets may be used to support other functions (eg, by allocating set memory(s) to a building's network infrastructure and/or or processing power).

7 shows an example of a controller 705 for controlling one or more sensors. Controller 705 includes sensor correlator 710 , model generator 715 , event detector 720 , processor 725 , and network interface 750 . The sensor correlator 710 is used to detect correlations between or among various sensor types. For example, an increase in infrared energy measured by an infrared radiation sensor may be positively correlated with an increase in measured temperature. The sensor correlator may establish correlation coefficients, such as coefficients for negatively correlated sensor readings (eg, correlation coefficients between -1 and 0). For example, a sensor correlator may establish a coefficient (eg, a correlation coefficient between 0 and +1) for positively correlated sensor readings.

In some embodiments, the enclosure includes at least one digital architectural element. A digital architectural element (DAE) may contain various sensors, transmitters, devices, processors (eg, microcontrollers and/or non-volatile memory), network interfaces, and/or one or more peripheral interfaces. The term DAE may refer to any device, set of devices, or interface that is configured to be mounted to and/or maintained in an enclosure to any structural component (eg, frame, beam, joist, wall of a building or room of a building) , ceilings, floors, windows, fascias, transoms and/or casement windows) in or above. For example, a DAE may include a window mullion interface, a digital wall interface, and/or a ceiling mount interface. Examples of DAE sensors include light sensors, optionally image capture sensors such as cameras, audio sensors such as voice coils or microphones, air quality sensors, and proximity sensors (eg, some some IR and/or RF sensors). The network interface may be a high bandwidth interface, such as a Gigabit (or faster) Ethernet network interface. Examples of DAE peripherals include video display monitors, additional speakers, mobile devices, battery pack chargers, and the like. Examples of peripheral interfaces include standard Bluetooth modules, ports such as USB ports and network ports. Ports may include any of a variety of dedicated ports for third-party devices.

In some embodiments, the DAE operates in conjunction with other hardware and/or software that provides an optically switchable window system to a display coupled to the window and/or a display projected on the window. In some embodiments, the DAE includes a controller (eg, any controller disclosed herein).

In some embodiments, the DAE includes one or more signal generating devices, such as speakers, light sources (eg, LEDs), beacons, antennas (eg, Wi-Fi or cellular communication antennas), and the like. The signal generating device may be a transmitter. In some embodiments, the DAE includes energy storage components and/or power harvesting components. For example, a DAE may contain one or more batteries and/or capacitors, such as energy storage devices. DAEs may include photovoltaic cells. In one example, a DAE has one or more user interface components (eg, a microphone or speaker) and one or more sensors (eg, a proximity sensor), and a network interface (eg, for high-bandwidth communications) ).

In some embodiments, the DAE is designed or configured to be attached to (or otherwise juxtaposed with) a structural element of an enclosure (eg, a building). In some embodiments, the DAE has the appearance of being fused with its associated structural elements. For example, a DAE can have a shape, size, and/or color that blends with the associated structural elements. For example, a DAE may not be readily visible to a building's occupants; eg, an element is fully or partially camouflaged in the surrounding environment in which the element is located. However, this element may interface with other component(s) that are not integrated into, for example, one or more video display monitors, touchscreens, projectors, and the like.

In some embodiments, building structural elements that can be attached to the DAE include any of a variety of building structures. In some embodiments, the building structure to which the DAE is attached is installed and/or constructed during building construction, in some cases early in the building construction, as the building framing or envelope is constructed. In some embodiments, building structural elements used in DAE are elements that function as building structural functions. Such elements may be permanent, eg, may not be easily removed from a building. Examples include columns, piers (eg, elevator, communication, or electrical piers), walls, partitions (eg, office space partitions), doors, beams, stairs, facades, moldings, mullions, and/or transoms. In various examples, the structural elements are located on the perimeter of the enclosure. In some embodiments, DAEs are provided as separate modular units or enclosures (eg, boxes) attached to building structural elements. In some cases, DAEs are provided as facades for building structural elements. For example, the DAE may be provided as a cover for a portion of a mullion, sash or door. In one example, the DAE is configured as a mullion or placed on or on a mullion. If the DAE is attached to the mullion, it may be bolted to or otherwise attached to a rigid portion of the mullion. In some embodiments, the DAE can be fastened to structural elements of the closure. In some embodiments, the DAE acts as a molding, such as a crown molding. In some embodiments, the DAE is modular; eg, it acts as a module for part of a larger system, such as a communications network, power distribution network, and/or computing system. The computing system may employ external video displays and/or other user interface components.

In some embodiments, a DAE is a digital mullion designed to be deployed on one or more mullions in a room, floor, or building. In some embodiments, the digital mullions are deployed in a regular or periodic fashion. For example, a digital mullion can be deployed on every sixth consecutive mullion.

In some embodiments, in addition to high bandwidth network connections (ports, switches and/or routers) and housing, the DAE includes one or more of the following digital and/or analog components: cameras, proximity or motion sensors, Occupancy sensors, color temperature sensors, infrared sensors, ultraviolet sensors, visible light sensors, biometric sensors, speakers, microphones, air quality sensors, for power and/or data connectivity hubs, display video drivers, Wi-Fi access points, antennas, location services via beacons or other mechanisms (eg, Bluetooth, GPS, or Ultra Wideband), power supplies, light sources, processors, memory, and/ or auxiliary processing device. One or more cameras may include sensors and processing logic for imaging features in visible light, IR (see use of thermal imagers below), or other wavelength ranges; various resolutions including HD and higher is possible. The DAE may include one or more of the devices disclosed herein.

The one or more proximity or motion sensors may include infrared sensors (abbreviated herein as "IR" sensors). In some embodiments, the proximity sensor is a radar or radar-like device that uses ranging functionality to detect distances to and between objects. Radar sensors can also be used to distinguish closely spaced occupants by detecting their biometric functions, such as detecting their different breathing movements. When using radar or radar-type sensors, it promotes better operation when placed unobstructed or behind the plastic casing of the DAE. The one or more occupancy sensors may include a multi-pixel thermal imager that, when configured with an appropriate computer-implemented algorithm, may be used to detect and/or count occupants in a room. In some embodiments, the data from the thermal imager or thermal camera is correlated with the data from the radar sensor to provide a better level of confidence when making certain decisions. In some embodiments, thermal imager measurements can be used to assess other thermal events in a particular location, such as changes in airflow due to opening of windows and doors, presence of intruders, and/or fire. One or more color temperature sensors can be used to analyze the lighting spectrum present in a particular location and provide outputs that can be used to implement changes in lighting as needed or desired, such as to improve the health or mood of an occupant. One or more biometric sensors (eg, for fingerprint, retina, or facial recognition) may be provided as separate sensors or integrated with another sensor such as a camera.

One or more speakers and associated power amplifiers may be included as part of the DAE or separately therefrom. In some embodiments, the two or more speakers and amplifiers are configured as a sound bar; eg, a bar-shaped device containing multiple speakers. The device may be designed (eg, configured) to provide high fidelity sound. One or more microphones and/or logic for detecting and processing sound may be provided as part of the DAE or separately therefrom. Microphones can be configured to detect internally and/or externally generated sounds. In some embodiments, processing and analysis of sound is performed by logic embodied in software, firmware, or hardware in one or more digital components and/or by one or more other devices coupled to a network ( For example, logic is executed in one or more controllers) coupled to a network. In some embodiments, based at least in part on the analysis, logic is configured to automatically adjust the sound output of one or more speakers to mask and/or cancel sound, frequency variations, echoes, and via one or more microphones Other factors detected, for example, which adversely affect (or are likely to adversely affect) occupants existing in a particular location within an enclosure (eg, a building). In some embodiments, the sound includes sound produced by, but not limited to, indoor machines, indoor office equipment, outdoor structures, outdoor traffic, and/or aircraft.

One or more air quality sensors (optionally capable of measuring one or more of the following air components: volatile organic compounds (VOCs), carbon dioxide temperature, humidity) may be used in conjunction with HVAC to improve air circulation control.

One or more hubs may be provided for power and/or data connectivity to sensor(s), speakers, microphones, and the like. The hub can include a USB hub or a Bluetooth hub. A hub may include one or more ports, such as a USB port, a high-definition multimedia interface (HDMI) port, or any other port, plug, or socket disclosed herein. For example, DAEs may include connector mating pieces for external sensors, lamps, peripherals (eg, cameras, microphones, speaker(s)), network connectivity, power, and the like.

One or more video drivers may be provided. The driver can be used in a display (eg, a transparent OLED device) on or near a window associated with the DAE element, such as an integrated glass unit (IGU). The driver may be physically wired or optically coupled to the DAE. For example, an optical signal can be emitted into a window by optical transmission, such as a switchable Bragg grating comprising a display with a light engine and a lens focused on a glass waveguide that transmits through the glass and travels perpendicular to the line of sight.

The one or more Wi-Fi access points and the antenna(s) may be part of the Wi-Fi access point or used for different purposes. In some embodiments, the DAE or a panel covering all or a portion of the DAE may act as an antenna. Various methods can be used to insulate the DAE and use it for directional transmission and/or reception. Prefabricated antennas can be used in the enclosure. A window antenna may be used. Examples of antennas and their integration into facilities and deployments can be found in International Patent Application Serial No. PCT/US17/31106, filed on May 4, 2017, entitled "WINDOW ANTENNAS" The application is incorporated herein by reference in its entirety.

One or more power sources may be provided, such as energy storage devices (eg, rechargeable batteries and/or capacitors) and the like. The power source can be renewable or non-renewable. In some embodiments, power collection devices are included; for example, photovoltaic cells or battery panels. This may allow the device to be self-contained or partially self-contained. The light collecting device may be transparent or opaque, eg depending on where it is attached. For example, photovoltaic cells may be attached to and partially or completely cover the exterior of the digital mullion, for example. For example, transparent photovoltaic cells can cover the display and/or user interface (eg, dials, buttons, etc.), such as on a DAE.

One or more light sources (eg, light emitting diodes) can be configured to interface with the processor to emit light under certain conditions, such as signaling when the device is active.

One or more processors can be configured to provide various embedded or non-embedded applications. The processor may include a microcontroller. In some embodiments, the processor is a low-power mobile computing unit (MCU) with memory and is configured to run a lightweight secure operating system that hosts applications and data. In some embodiments, the processor is an embedded system, a system-on-a-chip, or an add-on. One or more auxiliary processing devices, such as graphics processing units or equalizers or other audio processing devices, may be used to interpret the audio signal.

In some embodiments, a DAE (or a building structural element associated with the DAE) may include one or more antennas. The antenna(s) may be pre-configured. The antenna(s) may be attached to or embedded in the DAE, eg, on the interior of the DAE or on a surface in the DAE. The antenna can be configured such that the structure of the DAE (or building structural element) can act as an antenna component. For example, the conductive metal sheets of the mullions can act as antenna elements or ground planes. In some embodiments, a portion of the DAE or building structural element is removed (or added) such that the remaining portion acts as a tuned antenna element. For example, a portion of the mullion can be stamped out to provide a tuned antenna element. By attaching cable(s) (eg, coaxial cables or other cables), RF transmitters and/or RF receivers, building structural elements and/or associated DAEs may act as antenna elements. The antenna assembly can be designed to have an impedance that matches that of the RF transmitter (eg, at least about 50 ohms).

Depending on the construction, the antenna element may be a Wi-Fi antenna, a Bluetooth antenna, a cellular communication antenna, or the like. The antenna may be configured for at least third generation (3G), fourth generation (4G) or fifth generation (5G) communication protocols. In some embodiments, the antenna transmits and/or receives in the radio frequency portion of the electromagnetic spectrum. The antenna may be a patch antenna, a monopole antenna, a dipole antenna, or the like. It can be configured to transmit or receive electromagnetic signals in any suitable wavelength range. Examples of antennas, their components, and their integration into enclosures (eg, buildings) and their components (eg, optically switchable windows) can be found in a May 4, 2017 application entitled "WINDOW ANTENNAS )" in US Patent Application Serial No. PCT/US17/31106, which was previously incorporated herein by reference in its entirety.

In some embodiments, the cameras of the DAE are configured to capture images, eg, in the visible portion of the electromagnetic spectrum. For example, a camera may provide images at low resolution, such as low definition (eg, 24x32 pixels). For example, a camera may provide images at high resolution, such as high definition (eg, a 4K camera). The camera may have a horizontal resolution of at least about 24 pixels, 32 pixels, 720 pixels, 1080 pixels, or 3840 pixels. The camera can have a horizontal display resolution of approximately 4,000 pixels. Camera resolutions can be provided with at least 24 pixels by at least 32 pixels, at least 1280 pixels by at least 720 pixels (eg, at least about 921,600 pixels), at least 1920 pixels by at least 1080 pixels (eg, at least about 2.1 megapixels), at least about 3840 pixels Pixel by at least approximately 2160 pixels or at least 4096 pixels by at least approximately 2160 pixels. The number of pixels of the camera can be at least about 800 pixels, 0.5 megapixels (MP), 1 MP, 1.5 MP, 2 MP, 2.5 MP, 3 MP, 4 MP, 5 MP, 6 MP, 7 MP, 8 MP, 9 MP , 10 MP or 15 MP. The camera resolution can be any camera resolution between the aforementioned values (eg, from about 0.5 MP to about 15 MP). In some embodiments, the camera captures images with information about the intensity of wavelengths outside the visible range. For example, a camera may be able to capture infrared signals. For example, a camera may be able to capture ultraviolet signals. In some embodiments, the DAE includes a near infrared device, such as a forward looking infrared (FLIR) camera or a near infrared (NIR) camera. Examples of suitable infrared cameras include Boson™ or Lepton™ from FLIR Systems of Wilsonville, OR. These infrared cameras can be used to augment visible light cameras in DAEs.

In some embodiments, the camera is configured to map the thermal signature of the enclosure or part thereof (eg, a room) so that it can function as a temperature sensor, eg, with three-dimensional perception. In some embodiments, such cameras in DAEs enable occupancy detection, augment visible light cameras to facilitate detection of humans rather than hot walls, and/or provide quantitative measurements of solar heating (eg, imaging floors or desks) and see what the sun actually illuminates).

In some embodiments, speakers, microphones, and associated logic are configured to use acoustic information to characterize air quality and/or air conditions. As an example, an algorithm may emit ultrasonic pulses and detect the transmitted and/or reflected pulses back to the microphone. Algorithms can be configured to analyze detected acoustic signals, sometimes using transmitted versus received differential audio signals, to determine air density, particle deflection, and the like to characterize air quality.

Figure 8 schematically shows an example of components associated with a digital architectural element (DAE). In the illustrated example, configuration 800 includes DAE 830 and processor (eg, computer) 840 . Processor 840 is connected (eg, via an Ethernet connection) to external network 841 . External networks may include the Internet and/or cloud-based content and/or service providers. The processor's connection to the external network may include a suitable modem, router, switch, and/or high bandwidth backbone, such as a 10 GB backbone. Processor 840 may also be connected to display 809 (eg, a video display) via a high-definition multimedia interface (HDMI) link in this example. Processor 840 connects to port 811 (eg, USB, Wi-Fi, Bluetooth, or any other port, and/or the sockets disclosed herein), eg, to provide DAE 830 with additional internal and/or external resources. The DAE may include any of the devices disclosed herein (eg, various sensors and peripheral elements). In the example illustrated in FIG. 8, DAE 830 includes speaker 817, microphone 819, and various sensors 821 such as temperature, humidity, pressure, and airflow sensors. Any one or more of these components may be coupled to the computer or processor 840 via port 811 . Any of the devices can be reversibly plugged into and unplugged from the electronic circuitry of the DAE, eg, via connectors 821-823. Any of the devices may communicate via wired or wireless (eg, 825) communications. Communication may be with a network, processor 811, or any other processor configured to receive communications. Communication can be one-way or two-way. In the example shown in FIG. 8, bidirectional communication is designated by bidirectional arrows, such as 831-836. The DAE is coupled to an equalizer 813 configured to provide tone control to adjust the acoustics of the enclosure in which the DAE is placed. A DAE may also be referred to herein as a "set of devices," a "set of devices," or a "assembly of devices."

In some embodiments, the DAE is coupled to a signal (eg, sound) equalizer. In some cases, equalizers may be helpful in adjusting room acoustics using, for example, instant time delay reflectometry. Equalizers (and associated components) can compensate for unwanted audio artifacts, such as those produced by the interaction of sound waves with objects in an enclosure (eg, a room) or otherwise in close proximity to an occupant. In some embodiments, the signal pulses are generated by speakers associated with the DAE. One or more microphones may pick up the pulses (eg, directly) and be reflected and/or attenuated by objects in the room. Based at least in part on (i) the time delay between the transmitted and detected pulses and/or (ii) the tonal quality of the detected pulses, the system may infer the boundaries of the enclosed volume (eg, room boundaries), and the like. In some embodiments, the user's smartphone enables optimization of speaker output for the acoustic environment of various locations in the room. During setup mode, with the phone enabled, the user can move around the room and use the phone to detect acoustic responses. Based at least in part on the location and the detected acoustic response, the DAE can determine how to optimize the speaker output. After mapping the acoustic distribution of the room, the DAE can be programmed to tune its speaker output based on various factors such as where the user is located in the room. In some embodiments, the element may detect the user's location using any of several proximity techniques, such as described in the International Patent Application filed on May 4, 2017, which is incorporated herein by reference in its entirety Those techniques in Serial No. PCT/US17/31106.

In some embodiments, the DAE is configured as a digital wall interface that includes a chassis or enclosure designed to be mounted on a wall, ceiling, or door of a partially or fully constructed building. The wall interface can be constructed to provide a user interface that is easily seen by the user. It may have a relatively small footprint (eg, a user-facing surface area of up to about 500 square inches) and be geometrically shaped (eg, oval (eg, circular) or polygonal). In some embodiments, the digital wall interface is approximately the shape and size of a tablet computer.

In some embodiments, the DAE is installed in the enclosure (eg, a building) when the enclosure is constructed. For example, a DAE configured as a mullion mounted unit may be installed during enclosure construction, while a DAE configured as a digital wall interface may be installed in the enclosure after construction is complete or nearly complete. In one method of enclosure construction, a plurality of DAEs (eg, mullions, etc.) are installed during construction of a basic enclosure structure (eg, walls, partitions, doors, mullions, and stiles, etc.) using the appropriate external dimensions of the DAEs Install). Later, one or more digital wall interfaces are installed, eg, shortly before or at the time of tenant occupancy. Of course, once installed, all DAEs can work together, eg, as part of a mesh network by sharing sensed results, by sharing analysis and control logic, and so on.

In some embodiments, multiple devices (eg, sensors, transmitters, actuators, transmitters, and/or receivers) are integrated into a common assembly (such as on a common circuit board). The DAE set may have a single housing (eg, cover). One or more circuit boards can be housed in a single housing to form a set of devices. The circuit boards in the housing may or may not be physically coupled (eg, using wiring). The plates in the housing may be communicatively coupled. Communicatively coupled may be communicatively coupled, eg, wired or wireless, eg, using a network, either directly or indirectly. A common assembly may also be referred to herein as a "set." Multiple assemblies (eg, sets) containing such elements may be deployed in closest proximity to each other. The close proximity of at least two devices in the same set or in different sets can lead to one or more disadvantages in their operation. These one or more disadvantages may be in the course of its normal (eg, designed and/or expected) operation. One or more disadvantages may be due to (i) mutual interference between devices in the set (eg, intra-assembly interference) and/or (ii) mutual interference between devices in different sets (eg, inter-assembly interference) . The set(s) may include or be operably coupled to at least one controller. At least one controller may comprise a digital building system controller. At least one controller may be disposed in an assembly housing (also referred to herein as a "housing" or "package"). The package can be adapted to mount to a window, wall, ceiling, or any other structure and/or fixture in an enclosure (eg, a building, facility, or room) to perform various functions. Various functions may include tinted window control, environmental monitoring, building management, video communications, audio communications, lighting (eg, optical communications), and/or wireless network connectivity. For example, disturbances can occur during simultaneous operation of elements. Interference can result in reduced sensor accuracy, erroneous readings, sensor saturation, loss of consistency, signal transmission failures, power imbalance, and any combination thereof. In some embodiments, the plurality of modules (eg, devices) are combined into sets in a common housing, eg, to provide a useful package of functions to be provided to a particular user. Functionality may increase building efficiency (eg, energy and/or monetization), improve occupant health, improve occupant health, provide a network connectivity platform, and/or provide a communication platform. Examples of various modules (eg, devices) included in the combined assembly include temperature sensors, humidity sensors, carbon dioxide sensors, particle (eg, dust) sensors, volatile organic Ambient Light Sensors, Glass Break Sensors, Microphones, Speakers/Buzzers, Digital Amplifiers, Cameras, Video Displays, LED Indicators, Bluetooth Transceivers, Ultra Wide Band Transceivers, Passive Infrared Motion Sensors, Radar Sensing sensors, accelerometers and pressure sensors. The combined assembly may include power conditioning components, processing units, memory, and/or a network interface. In some embodiments, the assembly has external dimensions suitable for installation in various locations within the enclosure. For example, a corresponding mounting adapter may be provided for mounting the assembly to a fixture, such as a window mullion, at least a portion of a building wall or ceiling.

FIG. 9 shows an example of an assembly 900 with a protective housing 901 . The housing may include mounting features that enable the housing to be captured in a wall mount adapter (such as 902), window mullion section (such as 903), or ceiling mount adapter (such as 904), shown as 905 for exposure to The front of the occupant's enclosure and 904 is a side view of the rear of the enclosure facing the top panel. The housing may contain one or more features that are desirable for optimal performance of the module in the corresponding location, such as for allowing external environmental characteristics(s) to enter the housing to facilitate sensor(s) One or more openings for sensing. For example, the housing may include one or more openings (eg, holes) that facilitate air exposure to temperature, humidity, pressure, and dust sensors. The housing may include an open body and a cover. The cover may include one or more openings (eg, holes). The cover can be snapped into the open body to close the housing. Other examples of housing features include speaker or microphone grills and apertures for camera lenses, motion sensors, or ambient light sensors. One or more openings may be exposed in the front of the housing facing the occupant of the enclosure. The shell may be masked by a textured area surrounding and/or surrounding the opening. The textured regions may be patterned or irregular. Patterns can include any geometric shape, such as space-filling polygons (eg, squares, rectangles, hexagons, or triangles). Patterns can contain no space-filling polygons. Space-filling polygons can be of a single type or multiple types (eg, at least 2 or 3 types). Textured patterns can include curved or straight lines. Textured patterns can contain no curved or straight lines. The textured pattern can be a mesh. The textured pattern may be formed of the same or a different material than the rest of the housing. For example, the housing may be formed of plastic, and the textured region may be a mesh and/or braid that at least partially covers the open portion of the housing. The textured pattern may include shapes similar to openings. The openings may resemble petals or leaves. The textured pattern may cover at least one eighth, one fifth, one quarter, one third or one half of the front portion of the housing, the front portion facing the occupant. The enclosure may be attached directly to fixtures, such as walls and/or ceilings, using a frame and/or by means of posts or masts.

In some embodiments, the housing encloses at least one circuit board. A circuit board can be configured to house (eg, and house) one or more devices. The device can be reversibly integrated into the circuit board. For example, at least one device may be inserted into or extracted from a circuit board (eg, for maintenance, repair, exchange, or removal). The board may have a side on which circuitry and/or devices are disposed. One side may face the front of the housing. The front of the housing may face an occupant in the enclosure in which the housing is placed. One side may face the rear of the housing. The rear of the housing may face away from the occupant in the enclosure in which the housing is placed. The board may have two sides on which circuitry and/or devices are disposed. The plate may have one or more holes. Apertures may facilitate the transfer of at least one environmental property. Apertures may facilitate the transmission of gas, sound or electromagnetic radiation. For example, a sensor may be positioned at the back of the circuit board and sense the quality of the environment from the enclosure to the sensor through one or more holes. The board may have first device(s) disposed on a first side and circuitry disposed on a second side. The board may have first device(s) disposed on the first side and second device(s) disposed on the second side. The board may include one or more heat sinks. The fin(s) may be placed in locations prone to heat generation and/or accumulation. The plate may be operably coupled and/or include baffle(s). The spacer(s) can be used to reduce undesired consequences (eg, interference) of coexistence of devices in the housing and/or on the board. The housing may contain one or more circuit boards. The circuit boards may be communicatively coupled to each other (eg, directly or indirectly). The circuit boards may be operably (eg, communicatively) coupled to each other by wiring and/or wirelessly. The circuit board may be operably (eg, communicatively) coupled to the network by wiring and/or wirelessly.

In some embodiments, a device set (eg, a digital architectural element DAE) includes a processing unit. A processing unit may include circuitry, memory, and be configured for processing power. A device set may contain a plurality of circuit boards. At least two of the plurality of circuit boards may be (eg, substantially) disposed parallel to each other (eg, in a DAE housing). At least two of the plurality of circuit boards may be disposed (eg, substantially) in the same plane. At least two of the plurality of circuit boards may be disposed (eg, substantially) in different planes. At least two of the plurality of circuit boards may be disposed (eg, directly) adjacent to each other. Direct proximity to each other does not include intervening circuit boards. At least two of the plurality of circuit boards can be positioned to allow shielding elements, cooling elements, and/or gas to flow therebetween.

In some embodiments, at least two of the plurality of circuit boards may be positioned in a manner that facilitates the flow of gas therebetween. Gas flow can be active or passive. Heat exchange can involve conduction or convection. The gas flow can include heating of the gas surrounding at least one of the circuit boards, followed by (eg, passive) temperature equilibration. Gas flow may include hot gas flow to cooler regions. Gas flow may include laminar and/or turbulent gas flow. The gas flow may be in an upward direction (eg, relative to the center of gravity). Gas flow may include movement of the gas during its temperature equilibration. The gas flow can be active. The gas flow can be directed to the device concentration by gas pipes and/or actuators (eg, fans). At least one actuator (eg, a fan) may be positioned in the DAE housing as part of the DAE housing, or external to the DAE housing. At least one actuator can be configured to draw in external gas (eg, air) and direct it into the interior of the DAE (eg, push the gas into the DAE). At least one actuator can be configured to draw in internal gas (eg, air) and direct it out of the interior of the DAE (eg, to expel gas out of the DAE). The gas can be directed into the DAE by means of a tube. The DAE may include one or more openings through which gas may enter and exit the DAE (eg, passively and/or actively). The opening(s) may comprise slits or holes. At least one opening may be the same as the opening in the cover of the housing (eg, configured to allow functionality of the sensor(s) and/or transmitter). At least one opening can be different from the opening in the cover of the housing (eg, configured to allow functionality of the sensor(s) and/or transmitter). At least one opening may be a gap between the DAE housing and its cover. The at least one opening can be at or adjacent to the connectors (eg, sockets) of the DAE. The gas entering the DAE may be cooled. The gas may be cooled before or during its entry into the DAE. The gas cooler can be any (eg, active) cooling device disclosed herein.

In some embodiments, at least two of the plurality of circuit boards may be positioned in a manner that facilitates shielding, heat exchange and/or cooling elements positioned therebetween. At least one shielding element may be disposed (eg, directly) between the first circuit board and the second circuit board positioned adjacent to each other. Shielding elements may include electrical and/or electromagnetic (eg, radio frequency) shielding. The shields may or may not act as heat exchangers and/or heat dissipation (eg, cooling) elements. The set may include heat exchangers and/or heat dissipation (eg, cooling) elements separate from the shields. Heat exchangers and/or heat dissipation (eg, cooling) elements may include heat pipes or metal plates. Metals may comprise elemental metals or metal alloys. Metals can be configured for (eg, efficient and/or rapid) heat transfer. Metals may include copper, aluminum, brass, steel or bronze. The heat dissipating (eg, cooling) element may comprise a fluid, gas, or semi-solid (eg, gel) material. Heat dissipation (eg, cooling) elements may be active and/or passive. The heat dissipating (eg, cooling) elements may contain circulating substances. Heat dissipation (eg, cooling) elements may be operably coupled to active cooling devices (eg, thermostats, coolers, and/or freezers). The active cooling device may be positioned outside the housing of the device set. Heat dissipation (eg, cooling) elements may be placed in fixtures (eg, floors, ceilings, or walls) of an enclosure (eg, a building or room) in which the device assembly is housed. Fixtures can include mullions or traverses. The set of devices may have a temperature range from about -80°C, -40°C or -20°C to about 50°C, 100°C, 150°C or 200°C.

In some embodiments, the sensor and/or device set housing may be free of thermal insulation. In some embodiments, the sensor and/or device housing may include thermal and/or vibrational insulation. Thermal and/or vibrational insulation may comprise fibrous materials (eg, felt), foam materials (eg, polyurethane), thermoplastics, rubber, or silicone. Vibration insulation may include elastomers (eg, incorporated in grommets, pads, and/or bumpers) or mechanical springs.

30A shows an example of a side view of a device set housing (DAE housing). 3002 shows a side view of the body of the DAE, and 3001 shows a side view of the cover of the DAE. The DAE may include one or more openings and/or connectors, which may be disposed in various DAE portions, such as 3004, 3003, and 3005. The connector may be any of the connectors disclosed herein (eg, 1009, 1010, or 1011 of Figure 10). 30B shows a perspective view of two circuit boards 3051 and 3054. The circuit board can be accommodated in the DAE. The two circuit boards 3051 and 3054 are placed parallel to each other and directly adjacent to each other. When housed in a DAE enclosure, circuit board 3051 may be a front facing circuit system board closer to cover 3001 and circuit board 3054 may be a back facing circuit system board that is further from cover 3001 relative to circuit board 3051 . The circuit system board may be electrically connected or disconnected. 30B shows two sections 3057 and 3056 between circuit system boards 3051 and 3054. At least one of the two sections 3057 and 3056 may include electrical connections (eg, wires and/or cables) that electrically connect the circuitry of 3051-3054. At least one of the two sections 3057 and 3056 may include an electrical insulator that electrically separates the circuitry of 3051-3054. At least one of the circuit system boards may be via wiring (eg, cabling). Electrically connected to the external network. 30B shows an example in which the circuit board 3054 is externally connected to a network via wiring (eg, 3052, 3053, and 3055). Electrical wiring can be configured to transmit power and/or communications. In some instances, the cables that carry power are separate from the cables that carry communications. In some examples, the cables that transmit power are also cables that transmit communications (eg, coaxial cables). At least one of the wirings is configured to transmit Power over Ethernet (PoE). At least one of the wires can be an incoming communication port, and at least one of the wires can be an outgoing communication port. For example, wirings 3052 and 3053 may be incoming PoE wiring, and wiring 3055 may be outgoing PoE wiring.

In some embodiments, the DAE may have a plurality of circuit boards. Two of the plurality of circuit boards may have at least one different functionality. Both of the plurality of circuit boards may have at least one of the same functionality. For example, one circuit board (eg, 3051) may include sensor(s) that are not present in a second circuit board (eg, 3054). For example, one circuit board (eg, 3051) may include transmitter(s) (eg, buzzers) that are not present on a second circuit board (eg, 3054). For example, a circuit board (eg, 3054) may include a processor (eg, including memory) that is not present in the circuit board (eg, 3051). The processor can be any processor disclosed herein. The processor may process information related to the functionality (eg, coexistence) of the DAE in which the processor is located, related to the functionality of another DAE (eg, located in the same or another enclosure) as related to (eg, coexistence) , any) DAE or any combination thereof (eg, at different times) irrelevant.

In some embodiments, the DAE may include circuitry disposed in a circuit board (eg, a printed circuit board (PCB)). A circuit system board may include a central processing unit (CPU), a graphics processing unit (GPU), memory (eg, of the GPU and/or CPU), protocol data units (PDUs), networking components (eg, to enable wired and/or or wireless communications), and security-related components (eg, encryption and/or decryption code). The central processing unit may include a graphics processing unit. In some examples, a circuit board may include a plurality of processing units. 31 shows a schematic example of a circuit board 3102 that includes GPUs, PDUs, network components (abbreviated "network comp."), memory, and security-related information (eg, tokens).

In some examples, a set of devices may include sensors. The sensor can be placed in a circuit board. At least two sensors can be placed on the same circuit board of the DAE. At least two sensors can be placed on different circuit boards of the DAE. In some examples, a set of devices may include a transmitter. The transmitter can be housed in a circuit board. At least two transmitters can be placed on the same circuit board of the DAE. At least two transmitters can be placed on different circuit boards of the DAE. A circuit system board may contain one type of functionality, while another circuit board may contain a different functionality. For example, one circuit board may include processor and network related functionality, while another circuit board may include sensing and/or transmit functionality. For example, one circuit system board may be dedicated to devices related to sensing, while another circuit board may be dedicated to devices related to cooperation between individuals. Figure 31 shows connections to various sensors (eg, volatile organic compound (VOC), light, carbon dioxide ( _CO2 ), dust, infrared (IR), temperature and humidity (abbreviated "T/H") sensors) and an example of a circuit board section 3103 connected to cooperating related devices such as a camera, a microphone (MIC), and a speaker(s). The microphone device may include an array of microphones. The circuit board section 3101 and Each of 3102 may be a different circuit system board. Circuit board sections 3101 and 3102 may be disposed in the same physical board and/or circuit board.

A DAE may contain multiple functionalities. Functionality may include collaboration, processing, memory, storage, power, network communications, sensing, transmission, and/or security. Power may include power and/or conditioning. Sensors may include temperature, humidity, VOC, carbon dioxide, particulate matter (eg, dust), light (eg, lux), and/or vibration. The sensor can be any sensor disclosed herein. Network-related modules (eg, network-related components) may include protocol data units (PDUs), Ethernet components (eg, Gigabit Ethernet (GigE) components), ultra-wideband (UVB) components , Bluetooth (BLE) components and/or Wi-Fi components. The processing-related modules may include 1, 2, or more (eg, quad-core ARM) CPUs, random access memory (eg, 16 GB RAM), storage devices. The storage device may include flash memory. The storage device may include a solid state storage device (SSD). The storage device may comprise at least about 2, 4, 6 or 8 terabits (TB). The storage device may be operated using Total Production Maintenance (TPM). A memory module may include a temporary file storage device presented as a mounted file system (tmpfs), where data is stored in volatile memory (eg, rather than in persistent storage). The processor may include a graphics processing unit (GPU), such as an NVIDIA ^® Jetson Nano ^™ GPU. The processor may be configured to facilitate (eg, in parallel) operation of the plurality of neural networks. The processing unit can be configured for applications such as image classification, object detection, segmentation and/or speech processing. The processing unit may require up to 3, 4, 5, 8 or 10 watts to operate. DAEs (eg, processors, networking, and/or collaboration modules) can be configured for media display and/or touchscreen capabilities. Examples of media displays (eg, display structures) and touchscreens and their controls can be found in U.S. interim titled "TANDEM VISION WINDOW AND MEDIA DISPLAY" filed on February 12, 2020 In patent application Ser. No. 62/975,706, the US Provisional Patent Application is incorporated herein by reference in its entirety.

In some embodiments, the DAE includes a plurality of circuit boards. At least one of the DAE's circuit boards (eg, at least two of the circuit boards and/or all of the circuit boards) may be a double-sided circuit board (eg, both sides of the circuit board include circuitry. The DAE's circuit boards At least one (eg, at least two of the circuit boards and/or all of the circuit boards) may be a single-sided circuit board (eg, one side of the circuit board includes circuitry. Devices may reside on one side of the circuit board or Residing on one side. In some embodiments, the sensor(s) and/or the transmitter(s) reside on the same board on which the processor, storage, and/or networking functionality resides In some embodiments, processor, storage and/or network functionality resides on the side of the circuit board that includes the sensor(s) and/or the transmitter(s). In some embodiments , the side of the circuit board that contains the sensor(s) and/or the transmitter(s) is different from the side on which the processor, storage, and/or network functionality resides. In some embodiments, The circuit boards are connected (eg, back to back) to form a single unit. In some embodiments, the circuit boards are disconnected to form different units (eg, which may be electrically connected via wiring, such as shown in FIG. 30B ).

In some embodiments, the DAE includes a shield. The shield may shield the devices and/or circuitry of the DAE, eg, from external signals (eg, electrical and/or radio frequency signals). The shield may be in the form of a mesh. The shields may comprise elemental metals or metal alloys. The shield may be (i) disposed in at least a portion of the DAE enclosure; (ii) attached to at least a portion of the interior of the DAE enclosure; (iii) disposed in and disconnected from at least a portion of the DAE enclosure; (iv) ) at least partially disposed between the DAE housing and the circuit board(s); or (iv) any combination thereof. The shield and DAE housing can form a composite material (eg, a metal mesh in a plastic housing). The shield may form a DAE housing (eg, the DAE housing may be made from elemental metals (eg, aluminum) and/or metal alloys).

In some embodiments, the circuitry (eg, on a circuit board) includes electrical connectors (eg, bus bars). The electrical connector can connect at least two devices and/or functionality of the DAE (eg, disposed on a circuit board). The electrical connectors may include parallel and/or (eg, bits) series connections. Electrical connections may include multipoint (electrical paralleling), daisy-chain topologies, or connections by switching hubs. The electrical connector may be a Universal Serial Bus (USB). The electrical connector may be a high-speed electrical connector. The electrical connections can be external bus bars or internal bus bars. The electrical connectors may be at least second, third or fourth generation busbars. Electrical connectors (eg, bus bars) can operate at frequencies greater than the frequency of the memory. The frequency may be at least about 40 megahertz (MHz), 50 MHz, 60 MHz, 66 MHz, 80 MHz, 100 MHz, 200 MHz, 400 MHz, 800 MHz, or 1000 MHz. The electrical connectors may reside on the circuit board. Electrical connectors can connect at least two devices (eg, sensors and transmitters) on the circuit board. Electrical connectors may reside at least partially between the circuit boards. Electrical connectors can connect devices residing on different circuit boards.

In some embodiments, the DAE includes a power conditioning component. The power conditioning component manages the power distributed to the various components of the DAE. A DAE may contain a controller. The controller can receive the power consumption specifications of the devices in the DAE. The controller can (eg, on-the-fly) control the demand for power in the DAE. The controller may generate (eg, on-demand and/or on-the-fly) a power distribution scheme according to which power is distributed among the DAE components. The controller may reside on the DAE. The controller may be operably coupled to the network. The controller may be part of a control system (eg, as disclosed herein). The controller may be external to the DAE and communicate the power distribution scheme for the DAE to the DAE components. Power (eg, electrical power) may be distributed in parallel to at least two components in the DAE. Power can be distributed to at least two components of the DAE in sequence. The DAE may contain a battery pack. The battery pack may be a rechargeable battery pack. The battery pack can be used as a generator and/or power reserve for the DAE. The controller may seek to ensure that the battery pack is close to its maximum capacity. The controller may send an alert when the battery pack falls below a threshold value that does not allow one or more components of the DAE to operate according to its intended target.

In some embodiments, the printed circuit board mounts and interconnects the sensor and/or transmitter modules in a compact configuration. The layout of specific module(s) on a circuit board can sometimes provide sufficient separation between modules that tend to interact or interfere with each other. The effort to design an optimal layout can be time-consuming and/or expensive. Furthermore, optimal layout may still allow for detectable (eg, and undesirable) interference levels, such as due to the need to miniaturize the assembly. Sometimes, for example for calibration and/or positioning purposes, detectable interference between modules may be utilized. One or more factors may be considered in selecting electronic circuit components and arranging circuit board(s). An acceptable overall design can be achieved that achieves most of the specified requirements, but can still suffer from (eg, some) interference issues. 10A and 10B show example layouts of modules on a circuit board. FIG. 10A shows the back side 1000 of the circuit board. FIG. 10B shows the front side (user facing side) 1050 of the circuit board with the front side 1000 . The environmental sensor 1051 on the front side 1050 of the circuit board 1000 integrates temperature, humidity, VOC and pressure sensors. A CO ₂ sensor 1002 is mounted on the back side 1000 of the circuit board, the sensor 1002 receives air through an air inlet 1053 through an aperture in the circuit board. A microphone 1054 is mounted on the front side 1050 of the circuit board. In some embodiments, the sound captured by the microphone 1054 may be used to detect room occupancy and/or to detect spoken commands. LED light sources 1055 on the front side 1050 of the circuit board can be selectively illuminated to indicate various status signals, such as power status and/or faults. Ambient light sensors 1056 on the front side 1050 of the circuit board can detect light levels (eg, used to control window transmittance and/or tint levels). The UWB and/or BLE transceiver 1007 on the backside 1000 of the circuit board may also include an acceleration sensor (eg, an accelerometer). Depending on the desired functionality, many other instances of sensor and/or transmitter modules and other electronic components (eg, microcontrollers) are mounted to various locations on the circuit boards of the set. In the example shown in Figure 10A, a microcontroller unit (MCU) 1008 provides the CPU, RAM and ROM. Power and communication may be provided via one or more of micro USB connector 1009 and Ethernet connectors 1010 and 1011 . The circuit board may include a heat sink (eg, 1012).

In some embodiments, the form factor used to integrate and install DAEs (eg, device sets, sensors, transmitters, interfaces, window controllers, network controllers, etc.) is configured to use one or more Covers, adapters, trims, brackets, fasteners, and the like are mounted to pockets of structural elements of an enclosure (eg, housings, covers, circuit boards, and/or component assemblies). DAEs (eg, sets) can provide a compact, attractive and/or simple design that can be adapted to different mounting locations in the enclosure. DAEs can be configured for network integration, and/or to facilitate high-speed data streaming. A DAE can provide computing power and can be part of a set of DAEs with (eg, extensive) collective computing capabilities, depending on the number of DAEs in the set. The integration of sensors, transmitters and/or processing/controller chips into the DAE can support data collection, distribution, processing and delivery of data services in the enclosure. DAEs in the form of capsules (eg, also referred to herein as "cartridges" or "enclosure housings") can be deployed as part of the digital skin for occupant health (eg, comfort, health, and/or safety) Provide the infrastructure. In some embodiments, the DAE may be mounted on interior fixtures, such as walls, ceilings, or frames (eg, window or door frames). For example, a DAE set may be mounted within any window frame portion (eg, a mullion) and may include or be operably (eg, communicatively coupled) to a controller, such as window controls for tintable windows device functionality.

In some embodiments, the DAE includes a DAE that is configured to integrate with a plurality of building structures via respective mechanical edge(s) (eg, mullions, transoms, covers, adapters, and/or brackets) sac. The bladder may include a housing having a (eg, elongated or wide) body/shell and an interior cavity for mounting circuitry (which may include at least one printed circuit board). The cover attachable to the elongated body may be (eg, reversibly) removable or may be non-removable. Reversibly removable may refer to the removal and attachment of the cover. Sensors, transmitters, and/or other devices may be inserted (physically inserted) and unplugged from circuitry (eg, to change available functionality or to replace failed components).

In some embodiments, the exposed front fascia of the bladder (eg, the rim portion of the removable cover) includes a fenestrated area and an uninterrupted area. A fenestrated area may be provided at one longitudinal end of the housing body for gas exchange, electromagnetic transmission (eg, IR, visible light, and/or UV), environmental sensors, and/or operably coupled to at least one electrical circuit The transmitters of the boards are coincident. The sensor can sense at least one environmental characteristic. Environmental properties may include temperature, humidity, pressure, _{CO2 ,} CO, VOCs, debris (eg, smoke, particulates), radon, sound, sound emitters, temperature, or electromagnetic radiation (eg, with a range from about 10 nanometers ( nm) to UV in a wavelength range from about 400 nm, IR with a wavelength range from about 700 nm to about 1 mm, or visible light with a wavelength range from about 400 to about 700 nm). The apertures can include one or more open holes or slots (eg, various patterns or geometric shapes of one or more holes of any shape. The shape can be any geometric shape for exposure to the atmosphere, such as an oval (eg, an oval shape) , circular) or polygonal (eg, octagonal, triangular, and/or rectangular). Window apertures may include optical windows (eg, polymer, glass, sapphire, or salt optical windows comprising translucent/transparent materials) for use in Electromagnetic radiation is allowed to pass from the surrounding environment through the window into the collection housing (eg, to reach a sensor). Radiation may be allowed to enter the housing body (eg, to reach an ALS sensor for sensing ambient visible light or for detecting movement) A passive infrared (PIR) sensor of the object) and/or allow radiation to exit the housing (eg, from an LED indicator light). The aperture can be configured to allow sound (eg, from a speaker) to exit the housing. The aperture can be Configured to allow sound to enter the housing (eg, and detected by a sound sensor). At least two of the apertures may be configured in the cover in a symmetrical configuration relative to each other and/or at least one other aperture. The symmetry may be Including point symmetry, mirror symmetry or rotational symmetry. Rotational symmetry may include about 180 degrees ( ^o ), 90 degrees, 45 degrees, 60 degrees, 30 degrees, 20 degrees, 15 degrees, 10 degrees, or any multiple of it Rotation. At least two of the apertures may be arranged in the cover in an asymmetrical configuration relative to each other and/or at least one other aperture.

FIG. 18 shows an example of a lid 1800 having heart-shaped apertures 1801 arranged symmetrically through point symmetry, the apertures being disposed in the patterned portion 1802 of the lid 1800 . 18 shows an example of a cover 1850 having one of the constituent apertures 1852 and apertures 1851 arranged asymmetrically with respect to each other and with respect to the other apertures 1852 via mirror symmetry. 18 shows an example of a device set width 1860 and a device set housing length 1861.

In some embodiments, the device set housing (eg, and cover thereof) has an elongated shape. A device set may have a width (eg, Figure 18, 1860), a length (eg, Figure 18, 1861), and a depth (eg, Figure 12, 1280). The elongated shape may have an aspect ratio of length to width greater than one. For example, the length of the device set housing may be at least about 1.25 times longer than the width of the device set housing (*), 1.5*, 1.75*, 2.0*, 2.5*, 3.0*, 3.5*, 4.0*, 4.5*, 5.0* , 5.5*, 6.0*, 6.5*, 7.0*, 7.5*, 8.0*, 8.5*, 9.0*, 9.5*, or 10.0*. The length of the device set housing can be any multiple of the width by the width having the aforementioned values (eg, from about 1.25* to about 10.0*, from about 1.25* to about 3.5*, from about 3.0* to about 6.5*, or from about 6.0* to about 10.0*). The symbol "*" specifies the mathematical operation of multiplication. The depth of the set housing can be configured to fit into the frame portion, eg, such that the cover of the set housing is flush (or approximately flush) with the frame portion (eg, mullions or sills). The depth of the set housing can be configured to fit into a cavity in a fixture (eg, a wall, ceiling, or floor), eg, such that the cover of the set housing and the exposed surface of the fixture (eg, facing the fixture on which the fixture is placed) (or approximately flush) with the fixture surface of the occupants in the facility.

In some embodiments, at least one uninterrupted area (eg, at the longitudinal end of the housing body opposite the fenestrated area) is associated with a heat generating device (eg, processor, transmitter, Bluetooth, and / or UWB device) the installation position coincides. There may be at least one thermal wall (heat shield) and/or heat absorber (heat sink) in the chamber. A hot wall separates the gas exchange/environmental sensor. Heat sinks may be included in critical areas (eg, according to a simulation such as that shown in FIG. 5). A printed circuit board (PCB) or other support structure in the housing shell can include temperature sensor(s) (eg, a grid of thermistors) to monitor the thermal signature/mapping of the DAE set, and the resulting data can be used for Manage the collection and/or the heat load of the collection. Redundant heat generating sensors can be included in the same DAE or in other DAEs to manage thermal loads, eg sensor 1 can be taken offline and sensor 2 can take over the function in place of sensor 1.

In some embodiments, the front fascia (eg, the outer facing side of the cover or the covering thereon) is textured (eg, to shade(s) from the untrained eye) at the fenestrated area presence of fenestration) and optionally smoother at the opposite (no fenestration) ends. The front fascia may be a cover made of a material comprising elemental metals, metal alloys, ceramics, allotropes of elemental carbon, fiberglass, polymers or resins. For example, the lid may comprise acrylonitrile butadiene styrene (ABS) plastic (eg, machined and/or molded). Materials may comprise composite or non-composite materials. Materials may comprise organic or inorganic materials. The material may include at least a transparent portion and/or a non-transparent (eg, opaque) portion. The material may contain at least a portion that looks similar to the fixture to which it is intended to be attached. The gloss and/or unidirectional reflectivity of at least the outer portion of the DAE bladder may be similar to a fixture (eg, a structural element of the closure) attached adjacent to it (eg, metallic when positioned in a metal frame, matt in its positioning on a matte fixture such as a wall or ceiling). For example, smooth (eg, specular-like) surfaces exhibit specular reflection (eg, angle of reflection equal to angle of incidence), which appears glossy, while rough surfaces exhibit diffuse reflection (eg, scattering), which gives a matte appearance. For example, a metallic sheen with high unidirectional reflectivity (eg, high specular reflectance) can be provided on a DAE cover intended to be attached in a metal (or metal look) fixture. Unidirectional reflectivity can be characterized by the ratio of specular reflectance to total reflectance. Because diffuse reflectance is the easiest to measure, the unidirectional reflectivity of any particular material can be determined as follows: (total reflectance minus diffuse reflectance) divided by total reflectance. The metal surface can have a unidirectional reflectivity of from about 0.8 to about 0.99. The plastic surface can have a unidirectional reflectivity from about 0 to about 0.1. The unidirectional reflectivity of the painted surface can be in a wide range. The low gloss paint can have a unidirectional reflectivity of from about 0.1 to about 0.2. The semi-gloss paint can have a unidirectional reflectivity of from about 0.2 to about 0.7. The high gloss paint can have a unidirectional reflectivity of from about 0.7 to about 0.9. Gypsum or siding can have a high gloss appearance. By modifying the roughness of any surface (eg, by scratching the surface to increase the roughness or applying a coating to reduce the roughness), the unidirectional reflectivity can be increased or decreased. In some embodiments, the visible surface of the cover is formed of a specific matching material and/or treated in a manner to provide unidirectional reflectivity similar to the adjacent material to which it is ultimately installed.

The collection shell (eg, bladder) can have any three-dimensional shape. The set enclosure may have an occupant facing portion. The portion facing the occupant may be the cover of the set housing. The cover can have any shape, such as a geometric shape. The cover may be elongated or wide. The cover may be round. The cover may be a polygon (eg, triangle, rectangle, pentagon, hexagon, heptagon, or octagon). The cover may have an aspect ratio of 1:1. The cover may have an aspect ratio other than 1:1. Can have an aspect ratio of 1:x, where X is at least about 1, 2, 3, 4, 5, 6, or 8.

FIGS. 11A-C show various perspective view examples of a set housing (eg, bladder) 1100 with a housing shell having a main housing body 1101 and a lid 1102 . Body 1101 defines an interior chamber (not shown) for housing circuitry and devices including, for example, printed circuit boards, sensors, transmitters, processor(s), heat sinks, and or thermal shields. Cover 1102 covers the opening to the interior chamber of the bladder. In the illustrated example, lid 1102 and body 1101 define an elongated bladder. The lid may have a fenestrated area 1109 in zone 1103 that contains an opening. The fenestrated area can be at any area of the cover. In the example shown in Figures 11A and 11C, the apertured region is in the textured region 1103 (eg, to disguise the aperture). The fenestrated area can be partially camouflaged by a textured cover. The cover may or may not include a textured portion. In the example shown in Figures 11C and 11A, the textured region is at the first end (eg, lower end) of the capsule 1101, and the apertured region 1109 is at the via aperture and corresponding to the circuitry in the interior chamber. The locations of the exterior interactions of the capsule 1100 are formed by fenestrations (eg, physical openings and/or optical windows). The apertures can have various sizes and/or shapes, eg, according to the need to exchange atmospheric gases, acoustic waves, and/or electromagnetic radiation within and/or outside the bladder 1100 and/or according to a configuration or pattern that provides, eg, a desirable appearance. In some examples, at least two of the apertures have the same shape and/or size. In some examples, at least two of the apertures have different shapes and/or sizes. At the second end (eg, the upper end) of the bladder 1100, an untextured region 1104 is formed. Untextured areas can be windowless or windowed. In the example shown in FIGS. 11A and 11C , the untextured areas have no apertures. Apertureless regions may provide a continuous barrier over circuitry located in corresponding portions of the interior chamber. 11B shows an example of the backside 1105 of the bladder 1100 with the socket 1107 positioned, eg, to allow connectivity to a communication network and/or power. The rear portion can have one or more screws (eg, 1106) that can attach the cover and/or circuit board to the back of the bladder. In some embodiments, the screws do not attach the cover to the posterior portion of the bladder. The posterior portion of the bladder may have one or more depressions (eg, 1108). The posterior portion of the bladder may have depressions (eg, 1110 and 1111 ) and/or protrusions that facilitate proper orientation of the bladder in its intended working position.

12A and 12B show various perspective views of bladder 1200 with body 1201 having an interior chamber covered by cover 1202. An outer liner 1203 is applied along at least a portion of the outer surface of the cover 1202. The liner 1203 may consist of a laminate, mesh structure and/or mesh with a porous structure that may be able to hide the apertures in the cover 1202 while continuing to provide optics, sound between the interior of the bladder and the surrounding environment and/or gas exchange. 12A shows an example of a side view showing a socket 1205 that facilitates connectivity of the device in the bag to the communication and/or power network and screws 1206 that secure the circuit system board and/or cover to the rear of the bag; and FIG. 25B is an example of a top view of sockets 1207 that facilitate connectivity of the devices in the bag to the communication and/or power network and screws 1208 that secure the circuit system board and/or cover to the rear of the bag.

In some embodiments, the designed cover includes at least a fenestrated region that is permeable to gas and/or electromagnetic radiation. Irregular designs or patterned designs can be placed over the fenestrated portion. The designed cover may include a mesh structure, screen, and/or mesh over the fenestrated area and/or over the non-fenestrated area. In some embodiments, at least a portion of the outer surface of the lid is visible (eg, not covered by the mesh), and the visible lid surface can be smooth and/or have a design, such as an irregular design or patterned Design (eg, by inscription, embossing, or texturing).

13A shows an example of a portion of a cap that includes a design (eg, a pattern). The bladder has a first longitudinal end 1301 at which the lid portion 1300 has an area 1304 that includes the design. The designed area 1304 may include one or more holes that pass through the sheet-like or plate-like body of the cover portion 1300 (eg, formed from sheet metal or molded plastic). 13B shows an example of a portion of a cap 1310 that includes a design (eg, pattern) 1311. The design may be formed from (eg, woven) mesh. In the example shown in FIG. 13B , cover portion 1310 has a plurality of apertures (eg, holes) 1314 , 1315 , 1316 and 1317 . At least two of the apertures (eg, 1314) have the same size and circular shape. At least two of the apertures (eg, 1317 and 1316) have different sizes and different shapes. At least two of the apertures (eg, 1317 and 1314) have different sizes and the same circular shape. A window can be aligned or misaligned with the device it serves. For example, a pair of apertures 1314 (eg, openings) may provide a gas exchange port for a CO ₂ sensor on a printed circuit board mounted in the bladder 1310 that is aligned with the apertures 1314 . For example, apertures 1315 (eg, openings) can be aligned with microphones on a printed circuit board. For example, apertures 1316 (eg, openings) can be aligned with VOC sensors for measuring volatile organic compounds. For example, a window hole 1317 (eg, a translucent window) can be aligned with an ambient light sensor (ALS) on a printed circuit board to allow ambient light to be used for measurement. Design 1311 can hide the appearance of a window that consists of openings.

In some embodiments, the apertures used to pass electromagnetic radiation (eg, allowing light to reach an ambient light sensor (ALS) or to emit light from an LED) include light pipes that pass through corresponding openings in the lid of the bladder. For example, the cover may be formed of an opaque material (eg, molded plastic) with apertures at locations corresponding to the light receiving or transmitter device. A transparent or translucent body can be inserted into the aperture to at least partially seal the aperture while efficiently transmitting light. For example, the light pipe element can be heat fused to the back surface of the cover over the LEDs on the circuit board.

14A shows an example of a light pipe element 1400 with a transparent pipe body 1401 and a mounting flange 1402 with an opening 1403. The light pipe element 1400 may be formed in one piece (eg, by injection molding or 3D printing). 14B shows an example of a light pipe element 1400 installed with its pipe body 1401 inserted into the window aperture 1405 in the cover 1404. The inside of cover 1404 has mounting posts 1406 that are received by openings 1403 of mounting flange 1402 . The cover 1404 may be formed of plastic, and the posts 1403 may be partially melted to heat fuse the light pipe element 1400 in place. Cover 1404 may be formed of any material disclosed herein (eg, metal). The tube body 1401 is aligned with the ambient light sensor 1407 mounted on the printed circuit board 1408 .

In some embodiments, the DAE capsule is integrated into the window mullion. For example, the mullions can easily provide sufficient space for bladders and cable routing (eg, including connectors). In some embodiments, the mullion placement is configured for sensing the environment inside and/or outside the enclosure of the facility (eg, in which the set is installed). Mullion mounting can be unobtrusive and easy to service/replace (snap joints can be removed without tools). In some embodiments, the splines and mullion caps are configured to retain pockets for DAEs. The splines can comprise the same material as the DAE material (eg, aluminum tape, elemental metals, metal alloys, ceramics, allotropes of elemental carbon, fiberglass, polymers or resins) and can be fixedly mounted to building structural elements (eg window mounts). The mullion cap may be a U-shaped channel (eg, comprising the same set of materials, such as aluminum) with a joint configured to form a mating assembly with, eg, a spline snap fit. The open slot facing the frame (eg, mullion) cap can be configured to expose the encapsulated eaves. In some embodiments, an intermediate coupler (eg, an insert) is provided for securing the bladder to the splines and cap.

15A and 15B show different examples of views of a bladder 1500 received in a plug-in coupler 1501 to form a bladder (eg, a collection shell) and a U-shaped mullion cap 1502 with the bladder inserted therein. For example, the coupler 1501 may be composed of plastic or metal and may have features that allow it to snap over the bag 1500 with the lid side of the bag 1500 exposed by the elongated opening of the coupler 1501 . The bladder and any of its components may be formed from any of the materials disclosed herein. The splines 1510 (an example of a vertical cross-sectional view shown in FIG. 15B ) may be composed of elongated strips that are fixedly mounted on the sash structure or permanent fixture of a building. For example, the central portion of the spline 1510 may include a fastener socket 1511 that holds a threaded nut 1512. Mounting screws 1513 can be passed through the mounting holes of bladder 1500 to be tightened into nuts 1512 to hold bladder 1500 to splines 1510 . U-shaped mullion cap 1502 may include a pair of inner rails 1504 and 1505 held in guide tabs 1506 and 1507 , respectively, projecting at opposite sides of coupler 1501 . Splines 1510 may further include side rails 1514 and 1516 along opposite edges of U-shaped mullion cap 1502 having stepped profiles for receiving tabs 1516 and 1517, respectively, to provide a snap fit. Thus, the mullion cap 1502 can be removed from the splines 1510 without tools. Figure 15A shows a perspective view.

16A and 16B show various views of mullion cap 1600. FIG. The forward-facing surface 1601 includes an elongated slot 1602 for exposing at least the bladder front lid portion for DAE. The inner surface of cap 1600 provides tabs 1603 for forming a track 1604 that snap fit with window splines and mate with mating tabs on an intermediate coupler mounted above the DAE bag. Figure 16A shows an example of a mullion cap in perspective view. Figure 16B shows an example of a mullion cap as a cross-sectional view.

In some embodiments, the DAE bladder is integrated into the wall directly or using (eg, decorative) wall mounts. For example, a bladder design with features suitable for fitting into a window mullion can be mounted to a wall or other flat surface (eg, an enclosure) using appropriate hardware (eg, racks, adapters, fasteners) flat interior surfaces such as partitions, ceilings, transoms or doors). For example, the DAE capsule can be integrated into the top deck directly or via a top deck rack. Some surfaces used to support the bladder, such as roof panels, may be too far away from building occupants or other entities to be sensed within the enclosure. In some embodiments, the bladder is moved away from the support surface using a mast that extends from the surface and carries the cabling to the bladder mounted at the distal end of the mast. In some embodiments, the DAE bladder may be located at least partially behind the wall, floor or ceiling surface such that the cover front fascia is flush with the wall, floor or ceiling surface. In some embodiments, the DAE bladder may be at least partially outside the wall or ceiling surface, wherein the cover of the DAE bladder includes lateral sides in various configurations for providing the final appearance. For example, the shape of the capsule cover may include dome, crown, bevel, extrusion, or flange. The cover shape may contact the back of the bag, the sides of the bag, and/or the front of the bag (eg, lid). The front of the bladder faces the occupant of the closure and/or is the face of the bladder that is remote from the fastener to which the bladder is attached. The back of the bladder faces away from the occupant of the closure and/or is the face of the bladder closest to the fastener (eg, closest to the wall) to which the bladder is attached.

17 shows an example of a DAE bladder 1700 in which the outer surface of the bladder 1700 provides a finished cover that can be attached to a wall mount plate 1701. The wall mount plate can have any shape, such as geometric or abstract shapes. 17 shows an example of a wall mount plate 1701 having an oval shape and a wall mount shape 1711 having a rectangular shape, which attach the bladder 1710 to a fixture (eg, a wall). The geometry can be, for example, any geometry disclosed herein. For example, for bladder 1700 to extend from a mounting surface, bladder 1720 may be adapted to connect to mast 1723. The mast may be connected to the bladder via an intermediate mounting block (not shown) attached to the end of mast 1703. The outer covering surface of the bladder may be framed (eg, framed and attached to a fixture, such as a wall). A frame can have any (eg, geometric or abstract) shape. For example, the bladder 1730 has a rectangular frame. For example, the bladder 1730 has a frame 1741 with curved edges. The frame can be attached to the back of the bag or to the front of the bag. 17 shows an example of a frame 1741 attached to the rear of the bladder 1740 and a dome-shaped frame 1751 attached to the front of the bladder 1750 and extending to surround the posterior of the bladder. 1790 specifies the center of gravity pointing vector. Bladders 1700 , 1710 , 1720 , 1730 , 1740 and 1750 are aligned relative to vector 1790 .

In some embodiments, a bladder (eg, a DAE housing) is attached to the mast. The mast may or may not be configured to rotate. The mast may rotate continuously and/or intermittently (eg, including a turntable). For example, the mast may rotate continuously when subjected to a first force and intermittently when subjected to a second force that is less than the first force. The mast can be connected to a curved member (eg, dome or ball) joint. The connector can be placed in the socket. The joint can be configured to facilitate continuous or discontinuous rotation. The joint may be smooth, including recesses and/or protrusions. Recesses/protrusions can help with intermittent rotation. Rotation of the mast can help to point the DAE housing in the desired direction. Figure 32 shows an example of a rotating mast positioned in a first position 3201a and a second position 3201b. Rotation can be continuous or discrete. The rotating mast is connected to the joint with joint cover 3202. The splice cover may include screws (eg, octagonal screws as seen in the horizontal cross-section of the swivel and its cover 3207). The mast is attached to the DAE housing 3203. The mast is coupled to a wall (eg, ceiling) 3208 via a wall connector 3205 . The mast facilitates the coupling of the DAE to the network by cabling. Wall connectors 3205, joints (in housing 3202), masts 3201 (a and b), mast connectors 3206, and DAE housing 3203 allow cabling 3204 to run through and connect to a device housed in a DAE housing (not shown) electrical system. Cabling can facilitate the transmission of power and/or communications. Cabling may include Ethernet cabling (eg, CAT5e Ethernet cable). Cabling may include twisted pair, fiber optic and/or coaxial cables. The wall connector can have any (eg, geometric) shape. The wall connectors may be box, pyramid, prismatic or conical. The prisms can be triangular, pentagonal or octagonal prisms. The mast (eg, 3001a) can be of any length. The mast can be of fixed or variable length. The mast can be fixed. The mast may be retractable or extendable (eg, reversibly). The wall connector may contain one or more holes to facilitate mounting it to the wall (eg, via screw(s)). The wall may be a ceiling. The walls may be vertical walls.

In some embodiments, the DAE bladder (eg, housing) may be recessed relative to the outer surface of the fixture (eg, mullions, sills, floors, ceilings, and/or vertical walls). In some embodiments, the DAE bladder (eg, the housing) may sit flush with the outer surface of the fixture (eg, mullion, sill, floor, ceiling, and/or vertical wall). The outer surface is the surface facing the occupant of the closure in which the bladder is placed.

In some embodiments, the DAE capsule is suitable for (eg, specialized) data collection. For example, the control system may provide information on containment, eg, when at least one environmental characteristic deviates from a threshold value (eg, a maximum threshold value, a minimum threshold value, or an acceptable window range including the maximum threshold value and the minimum threshold value). Warning of at least one environmental characteristic of the body (eg, the atmosphere of the enclosed body). The threshold value can be a threshold value, a threshold function, or a threshold range (eg, a threshold value window). Alerts can be in the form of optical, written and/or audio messages (eg, lights or flashes, audible and/or written messages). The capsule may include at least one sensor configured to sense electromagnetic radiation in the form of images (eg, changes in intensity of radiation received from different locations in a room). For example, the at least one sensor may include an array of sensors, such as an array of IR sensors (eg, a thermal imager). In some embodiments, a DAE pocket (or set of pockets) can be used to detect characteristics of the enclosure occupant(s). For example, the set may be used to detect abnormal physical characteristics of enclosed body occupants, such as the March 23, 2020 application entitled "SENSING ABNORMAL BODY CHARACTERISTICS OF ENCLOSURE OCCUPANTS)" US Provisional Patent Application Serial No. 63/993,617, which is incorporated herein by reference in its entirety. Abnormal body characteristics can include body temperature, coughing, sneezing, sweating (eg, humidity and/or VOC expulsion) or _CO2 content.

Figures 19A, 19B, 19C, and 19D show various views of a printed circuit board 1900 and portions thereof configured for integration into a capsule set for a DAE having, for example, thermal imaging related Functionality of data collection and/or processing. 19A shows a top view of circuit board 1900, FIG. 19B shows an enlarged top view of a portion of circuit system board 1900, FIG. 19C shows an enlarged bottom view of a portion of circuit system board 1900, and FIG. 19D shows a side view of a portion of circuit system board 1900. The first end 1901 of the circuit board 1900 holds a thermal imaging array 1902 (eg, a Melexis MLX90640 IR imaging array or any other suitable device) in a position corresponding to the fenestrated area of the lid of the capsule (not shown). Thermal imaging array 1902 is electrically and mechanically connected to breakout boards 1903 on opposite sides of circuit board 1900. The breakout plate 1903 may have serrated holes along its edges for electrical interconnection and mounting. Circuit board 1900 may have cutout holes for leads passing through thermal imaging array 1902 to breakout board 1903 . A microphone 1904 is mounted at the first end 1901 of the circuit board 1900 for collecting the sound to be analyzed and data from the thermal imaging array 1902. The circuit board 1900 further includes a plurality of on-board thermistors 1905, eg, to characterize the temperature and heat flow at the circuit board 1900 (which can affect performance).

In some embodiments, the set of sensors, transmitters, actuators, receivers, and/or transmitters included in the combined assembly may be included in a larger network to provide data and communication services to occupants of the enclosure a node. Complex environment control, security, and advanced human-to-human collaboration are provided by the example aggregate architecture shown schematically in FIG. 20 . In some embodiments, an intelligent control unit may include hardware, firmware, and/or software components designed to cooperate with other similar units, based on the performance of predefined functions (eg, tintable windows and other environmental controls), Other local devices and/or other remote devices provide the required data processing, communication and control actions. In the example of FIG. 20, the control unit assembly 2000 includes a main application processor 2001 connected to a network controller and/or (eg, RF) transceiver 2002 (eg, a coaxial network controller and RF transceiver) . In this example, Multimedia over Coax Alliance (abbreviated herein as "MoCA") front end controller 2003 (eg, MoCA front end integrated circuit) connects network controller 2002 to coaxial connector 2004. Coaxial connectors may provide communication and/or power links to other merged assemblies (eg, located in the same enclosure or remotely). Coaxial connectors can be configured to facilitate radio frequency communication (eg, F-type coaxial connections). The front end may include integrated circuits, including monolithic microwave integrated circuits (ICs), such as ICs including GaAs. Ethernet transceiver 2005 (eg, Gigabit Ethernet transceiver) and jack (eg, Ethernet connector) 2006 via network controller 2002 and Ethernet switch 2007 Provides Ethernet communications to processors 2001 (eg, audio, voice, and video processors). The controller may include one or more Ethernet switches. The controller may include one or more sockets (eg, twisted pair and/or coaxial cables) for cabling over the Ethernet network. The network controller 2002 can communicate with the transceivers via a serial bus 2016 (eg, a bus defined for a media independent interface (MII)). In this example, set 2010 includes sensor module 2011 , video module 2012 , and audio module 2013 . The video module in Figure 20 is connected to the communication interface. The communication interface (Comm interface) can be configured to transmit images and/or video. Set 2010 further includes a processor 2014 and a controller power circuit 2015 (eg, for local controller(s), such as window controller(s)). In this example, the assembly installed to control the tintable windows can provide additional enhanced smart features to the way users/occupiers of the space (eg, video and/or audio conferencing, and/or web storage fetch) to deploy. The controller may include one or more voltage regulators (abbreviated as "VOLT REG" in Figure 20). The power in the network and/or control circuitry may be at least about 12 V, 24 V, 48 V, or 96 volts (V) DC. The controller may include a socket configured to facilitate coupling with a memory device (eg, memory card 2017). The directions of the arrows in FIG. 20 designate the communication directions, wherein the bidirectional arrows designate bidirectional communication and the unidirectional arrows designate unidirectional communication. The controller may include one or more sockets, which may be USB or HDMI sockets. Sockets can be configured to communicate audio, video, video, data and/or power. The socket can be configured to communicate with at least one external memory and/or processor. The socket can be a communication port. The communication port can be a serial port or a parallel port. The communication port may be a universal serial bus port (ie, USB). USB can be micro or mini USB. USB ports can be associated with device classes including 00h, 01h, 02h, 03h, 05h, 06h, 07h, 08h, 09h, 0Ah, 0Bh, 0Dh, 0Eh, 0Fh, 10h, 11h, DCh, E0h, EFh, FEh, or FFh . The controller may include Bluetooth technology. The controller may include a plug and/or socket (eg, power, AC power, DC power). The controller may include an adapter (eg, AC and/or DC power adapters). The controller may include, and/or be configured to connect to, a power connector. The power connector may be an electrical power connector. The power connector may include a magnetically attached power connector. The power connector may be a base connector. Connectors can be configured to include and/or connect to data and/or power connectors. The connector may contain pins. The connector may contain at least 10, 15, 18, 20, 22, 24, 26, 28, 30, 40, 42, 45, 50, 55, 80 or 100 pins. The socket can be configured to connect to at least a portion of the connector pin. The memory may be a mass storage device (eg, as a hard disk drive, an optical disk drive, and/or a solid state drive). Ports can include serial or parallel attachments. Sockets may facilitate connection to high-speed serial computer expansion buses (eg, peripheral component high-speed interconnect). The sockets may be sockets (eg, 2006), such as aligned sockets. Sockets can be configured to connect to one or more cables. The cable can be twisted pair or coaxial cable. Twisted pair and/or coaxial cables may facilitate the transmission of power and/or communications (eg, Ethernet). The communication speed over the cable can be at least about 0.1 gigabits per second (Gbit/s), 1.0 Gbit/s, 2.5 Gbit/s, 4 Gbit/s, or 5 Gbit/s. The controller may contain multiple ports. The multi-port can be a three-port network (eg, T-bias). Multiple ports can be used to set the DC bias point of some electronic components, such as to minimally interfere with other components to which they are communicatively coupled. The T-bias can be a duplexer. Multiple ports can be, for example, low frequency ports used to set bias voltages. Multiple ports may include high frequency ports that facilitate transmission of radio frequency signals (eg, and reduce transmission (eg, blocking) bias levels). Multiple ports can be connected to at least one device. The device can be exposed to both bias voltages and RF signals. The controller may be configured (eg, include hardware configured to) for asynchronous serial communication, eg, where the data format and transmission speed are configurable. For example, the controller may include a generic asynchronous receiver-transmitter. The controller may be communicatively coupled to (and/or include) random access memory (RAM).

In some embodiments, the controller may include a processor. The processor may be configured to process voice, audio, image and/or video. The images may be ultra high definition (eg, at least 4K) images. The image can be displayed on a screen (eg, a light emitting diode (LED) screen, such as a transparent organic LED (TOLED) screen). A screen may have 2000, 3000, 4000, 5000, 6000, 7000 or 8000 pixels at its basic length scale. The screen may have any number of pixels in its basic length scale between the aforementioned numbers of pixels (eg, from about 2000 pixels to about 4000 pixels, from about 4000 pixels to about 8000 pixels, or from about 2000 pixels pixels to about 8000 pixels). The basic length dimension may include the diameter, length, width or height of the bounding circle. The base length scale may be abbreviated herein as "FLS". The screen construction can include high-resolution screens. For example, the screen can have at least about 550, 576, 680, 720, 768, 1024, 1080, 1920, 1280, 2160, 3840, 4096, 4320, or 7680 pixels by at least about 550, 576, 680, 720, 768, 1024, 1080, 1280, 1920, 2160, 3840, 4096, 4320 or 7680 pixel resolution (30 Hz or 60 Hz). The first number of pixels may specify the height of the screen, and the second number of pixels may specify the length of the screen. For example, the screen may be a high-resolution screen with a resolution of 1920×1080, 3840×2160, 4096×2160, or 7680×4320. The screen may be a standard definition screen, an enhanced definition screen, a high definition screen or an ultra high definition screen. The screen may be rectangular. The image projected from the screen may be refreshed at a frequency (eg, refresh rate) of at least about 20 Hz, 30 Hz, 60 Hz, 70 Hz, 75 Hz, 80 Hz, 100 Hz, or 120 hertz (Hz). The FLS of the screen can be at least 20 inches, 25 inches, 30 inches, 35 inches, 40 inches, 45 inches, 50 inches, 55 inches, 60 inches, 65 inches, 80 inches or 90 inches ("). The FLS of the screen can have Any value between the foregoing values (eg, from about 20 inches to about 55 inches, from about 55 inches to about 100 inches, or from about 20 inches to about 100 inches). A processor may handle multiple audio channels, such as a processor Can support at least 5, 10, 15, 20, 25, or 30 audio channels (eg, about 384 KHz). The processor can include a plurality of cores (eg, at least 1, 3, or 6 cores). The processor can be used for processing Embedded systems for applications and/or real-time applications. The processor may have a clock speed of at least about 1 GHz, 1.3 GHz, 1.6 GHz, 1.9 GHz, or 2 gigahertz (GHz). The processor may have at least about 16, 32 or 64 bit CPU capability. The processor may facilitate the operation of a real-time operating system kernel (RTOS), such as for embedded device(s). The processor may include optimizations for low cost and/or power saving (eg, micro) controller one or more chips.

In some embodiments, the controller may be connected to the sensor module. The sensor module can be connected to a communication protocol (abbreviated as "comm protocol" in Figure 20). The communication protocol may include a half-duplex communication protocol (I2C) or a full-duplex communication protocol (SPI). The communication protocol may include stretching (eg, when the slave node cannot send fast data fast enough, the protocol inhibits the clock to stop communication). The communication protocol can be embedded in a programmable logic device (eg, an FPGA).

In some embodiments, the controller includes a front-end controller. The front end controller may be an analog front end controller (abbreviated herein as AFEC). The front end controller may include analog signal conditioning circuitry, eg, using one or more (eg, sensitive) analog amplifiers, filters, and/or application-specific integrated circuits (eg, for sensors, radio receivers). Front-end controllers may provide configurable and/or flexible electronic function blocks. A front-end controller may facilitate interfacing one or more sensors to at least one antenna (eg, using an analog-to-digital converter) and/or a microcontroller. The front end controller may be a radio frequency (RF) front end. The front end controller may be embedded in at least one die.

In some embodiments, the controller may include an Ethernet switch. An Ethernet switch can have a plurality (eg, at least 3, 5, or 7) ports. At least one of the ports (eg, each port) can be (eg, individually) configured to operate in one of several modes. Modes may include various media independent interface modes (eg, media independent interface (MII), simplified media independent interface (RMII), gigabit media independent interface (GMII), simplified gigabit media independent interface (RGMII) , Serial Gigabit Media Independent Interface (SGMII), High Serial Gigabit Media Independent Interface (HSGMII), Quad Serial Gigabit Media Independent Interface (QSGMII), or 10 Gigabit Media Independent interface (XGMII)). Ethernet switches may facilitate connections to various communication switches, microprocessors, and/or Fast Ethernet and Gigabit Ethernet PHYs. Ethernet switches help with scalability. Ethernet switches can be used in automotive applications (eg, gateway applications) and/or in domain controllers. The Ethernet switch supports audio, visual and/or video applications.

In some embodiments, the controller circuitry includes a serial bus, such as a bus defined for a media independent interface (MII). The serial bus may include management data input and/or output (MDIO), serial management interface (SMI), and/or media independent interface management (MIIM). The MII can be connected to a medium access control (MAC) device through Ethernet physical layer (PHY) circuitry. The MAC device can control MDIO.

The controller may be communicatively coupled to and/or include random access memory (RAM). The RAM may be low power dual data rate RAM. RAM may store short-term data such as used by application(s).

The requested capabilities of the control architecture of the controller unit may include, for example, platform independent drivers, common driver frames, bus sharing and synchronization at the transport layer, bus locking and recovery mechanisms, driver test modules, clock gates integrated into drivers Control and PM functions, CLI driver test routines, data acquisition framework (e.g. with data path between sensor driver and application layer including variable sampling interval, sample size and FIFO size), OS abstraction layer, SSL/ TLS, IP stack integration, BLE integration, FTL and wear leveling for serial inverse and gate flash, port reference implementation for wear leveling and flash translation layer, event logging system and diagnostic interface, command shell, ML Inference engine, processing engine (eg, for radar and/or sensor fusion), system health check and recovery, positioning engine, and power management. The control architecture is configured to handle extended functionality and modalities incorporated into the assembly. 21 shows an example where set 2100 is accessed by a data acquisition framework 2101 that defines sampling interval 2102, sampling frequency 2103, and sample size 2104 according to the respective elements of set 2100. A set of application programming interfaces (APIs) including sensor data read API 2105 and sensor configuration API 2106 are configured to enumerate, configure, calibrate, and access elements of set 2100 (eg, sensors ). Command (CMD) block 2107 oversees command and control. The machine learning interface engine 2108 and the set of filters and schemes 2109 can register threads with real-time data for processing schemes according to a particular sensor. Device set 2100 includes the following devices and associated connectors: Universal Asynchronous Receiver-Transmitter with Direct Memory Access (DMA), Built-in Integrated Circuit Sound ( ^I2S ) with DMA, Infrared (IR) Driver I ² C, temperature (Temp.) ADC channel, carbon dioxide (CO ₂ ) and humidity ADC, CO ₂ channel, color (RGB) I ² C, accelerometer I ² C. Device set 2100 includes the following devices (eg, sensors): radar, dust sensor, audio sensor, IR sensor, temperature (Temp.) sensor array, carbon monoxide (CO), and nitrogen dioxide ( NO2 ₎ sensor, color temperature and/or light (LUX) sensor and accelerometer. Any of the devices may include or be operably coupled to an analog-to-digital converter (ADS). For example, a device may have an ADS (eg, a temperature ADC channel) associated with and/or dedicated to it. The set may include connectors (eg, bus bars) for integrated circuits (ICs), such as multi-master bus bars (eg, I ² C). Connectors (eg, bus bars) may connect one or more devices and/or chips. The connector can act as a master device by initiating data transfer. Connectors may contain built-in integrated circuits (I ² C). Connectors may include serial bus (path) designs for digital audio devices and/or digital sound processors, such as built-in IC sound ( ^I2S ). The bus can be configured to handle audio data separately from the clock signal. The set may include circuitry configured for asynchronous serial communication, eg, where the data format and transmission speed are configurable. For example, the set may include a Universal Asynchronous Receiver-Transmitter (UART). The set may include one or more direct memory access (DMA) components configured to transfer data from a data source location (eg, a sensor), for example, without interfering with the CPU or other on-chip devices To the data destination location (eg, a memory storage device). The set may include computer programs (eg, drivers) that are configured to control devices attached to the processor. Drivers may depend on dependencies and/or operating system specific hardware (eg, devices). The driver may provide, for example, interrupt handling required for asynchronous time-dependent hardware interfaces.

In some embodiments, the coexistence matrix provides a tool or resource for evaluating, ordering, and/or honoring potential interactions (eg, interference) between modules and/or other electronic components of any particular assembly. Interactions can cause intra-assembly interference and/or inter-assembly interference. The coexistence matrix may evaluate different devices as aggressors relative to evaluating at least one other device as a victim. At each intersecting cell in the coexistence matrix, the assignment, characterization and/or quantification of interference effects during simultaneous operation of the corresponding aggressor and the corresponding victim is provided using known performance specifications and/or empirical assessments. The designation may represent sensitivity to interference (eg, high potential to relatively low potential). In some embodiments, an absolute measure that can represent interference is specified. The coexistence matrix can provide information about potentially interfering elements. A coexistence matrix can aid in the development of actionable insights. Actionable insights can be used to (i) reduce disturbances and/or (ii) map disturbance properties in order to obtain additional environmental data.

22 shows an example representation of a coexistence matrix 2200 in which aggressor devices (eg, temperature sensors (abbreviated "Temp"), humidity sensors (abbreviated "Hum"), carbon dioxide sensors (abbreviated "CO2") ”), particulate sensor (abbreviated as “PM”), total volatile organic compounds sensor (abbreviated as “tVOC”), ambient light sensor (abbreviated as “ALS”), microphone (abbreviated as “Mic” ), speaker/buzzer (abbreviated as "Buzz"), LED indicator (abbreviated as "LED"), Bluetooth transceiver (abbreviated as "BLE"), ultra-wideband transceiver (abbreviated as "UWB"), passive Infrared motion sensor (abbreviated as "PIR"), radar sensor, accelerometer (abbreviated as "acc"), and pressure sensor (abbreviated as "Press") are listed as column headers 2201 and correspond to the same The element is listed with the row header 2202 as the victim device. The diagonal of a dotted cell (such as 2203) corresponds to the comparison of each element to itself, which can be ignored. Other cells may store quantifiers and/or qualifiers representing interference (or interference potential) between the corresponding aggressor device and victim device, such as the low potential ("L") in cell 2204, which may be designated for use such as The no-existence potential ("NC" or Not Care) of the optimized pairings depicted in cell 2205 and the designation of high potential ("H") in cell 2206. Specifies that values can be included. The value can be a relative value or an absolute value.

In some embodiments, the coexistence matrix provides information about interfering modules (eg, devices) and/or facilitates the development of actionable insights that can be used to reduce interference (eg, by scheduling of modules in the environment) operation and placement) and map the interference properties in the environment by using the interference properties. In some embodiments, pairings of modules that can potentially interfere with operational levels include: (i) pressure sensors and humidity sensors; (ii) microphones and buzzers; (iii) temperature sensors and IR-based _CO2 sensors; (iv) LED modules (eg, indicators) and light sensors; and/or (v) accelerometers and buzzers. For example, some sensors can generate heat and have a thermal signature during operation. The thermal signature of another sensor can affect the read accuracy of an approaching temperature sensor. For example, some sensors may draw a certain amount of current in order to function. If both sensors are connected to the same power supply, the current draw of one sensor can affect the proper functioning of the other sensor, for example by limiting how much current the other sensor can draw. In another example, a microphone can be used to record sound levels, and a buzzer can be used to emit warning tones. In some cases, operating the microphone and buzzer simultaneously (eg, in close proximity) is not optimal because noise from the buzzer will skew accurate noise determinations by the microphone. The set of devices may include signaling lights (eg, LEDs, such as tri-color LEDs). The call light may have a visible color range and/or pulsation frequency designated for the message. For example: (a) blue may designate normal operation; (b) green may designate good data being sent; (c) red may designate bad data, poor data transfer and/or the device is otherwise defective. Good data may include calibrated, within normal range and/or non-corrupted data. Bad data can include uncalibrated, out of range and/or corrupt data. Bad data transmissions can include interrupted transmissions, infected data, suspected malicious manipulation or interrupted transmissions. A device may include a sensor or set of devices (eg, including a sensor, a sensor, and a transmitter, or a transceiver).

In some embodiments, the processing system includes a plurality of elements embodying sensors and/or transmitters for which a coexistence matrix has been constructed. At least two of the plurality of elements may be arranged in a set. There may be one or more sets operatively (eg, communicatively) coupled to or part of a control system and/or a processing system. In some embodiments, the control system and/or processing system may mitigate (eg, substantially cancel, measurably cancel, or cancel) the interference. Mitigation of interference may include scheduling the operation of various elements such that an aggressor with a predetermined potential for interference with a particular victim does not overlap (eg, operate concurrently) with the victim in operation time. A controller (eg, a coexistence controller) may include and/or may be coupled to a scheduler for operating a device (eg, a sensor and/or a transmitter). A device may include elements in one or more assemblies interconnected within a processing system and/or a control system. Scheduling can be determined manually and/or automatically, eg, based on (a) the system layout in the memory blocks and/or (b) the coexistence matrix blocks in the memory. The system layout may provide information regarding (i) the components in a particular assembly and/or (ii) the relative and/or absolute positioning (eg, separation distances) of the components. The location can be relative to and/or within an enclosure (eg, a facility, building, or room). In some embodiments, (eg, using predetermined rules), the scheduler may establish coordinated time windows for operating various devices (eg, sensors and/or transmitters) based on the relationships represented in the coexistence matrix. Operations may include intermittent, scheduled (eg, pre-scheduled), contingent, repetitive, episodic, and/or random operations. Operations may include non-simultaneous, simultaneous, or sequential operations. The rules may include the use of learning analytics (eg, artificial intelligence) performed in at least one learning block. At least one common control block may coordinate data processing tasks among various (eg, different) computing devices and/or controllers (eg, in the same or different assemblies). Coordination may be performed in one or more ways to minimize (eg, avoid) interfering operations (eg, which may be generated by power consumption or electromagnetic interference (EMI) in the assembly). For example, a common control block may coordinate the sharing of sensor data from one set to another, eg, so that the receiving assembly does not need to operate its corresponding sensor at all. For example, data from a _CO sensor in one assembly can be shared with other assemblies in the same room because there is little, if any, variation in measurements (eg, without wishing to be bound by theory, due to gas diffusion). This will help reduce (eg, avoid) potential interference conditions in the receiving assembly.

23 shows an example of a processing system 2300 including a controller 2301 including various processors, components, and memory blocks. Figure 23 shows an example of the learning module 2307, the controller 2301 communicatively coupled to the cloud 2311, the coexistence matrix 2306 in the memory block, the system layout 2305 in the memory block, the scheduler 2302 control block . Control blocks may be used to operate the device (eg, transmitter(s) and/or sensor(s)), common 2308 control block, sensor(s) 2303, transmitter(s) 2304 , component (eg, sensor) data 2310 memory blocks, and/or task(s) 2309 memory blocks. The double arrows shown in FIG. 23 designate bidirectional communication between different blocks in the system 2300.

In some embodiments, the coexistence controller function is implemented as a common process (eg, in the master node and/or intermediate (floor or network) controllers). The sharing process may guide scheduling and/or data sharing among multiple assemblies deployed within the enclosure and/or among multiple enclosures. Each assembly may provide interconnected processing and/or respective nodes within the control system.

24 shows an example of a coexistence controller 2400 connected by a network link 2401 to a plurality of assemblies 2402, 2403, 2404, 2405, and 2407. Assemblies 2402-2405 are deployed within a space 2406 of an enclosure (eg, a conference room in an office building) so that they can be in close proximity, which improves as for each (eg, mutual and/or internal assembly) derived The likelihood of the interference potential characterized in the respective coexistence matrices. Assembly 2407 is positioned outside of space 2406 and may be potentially disturbed inside and/or outside assemblies 2402-2405.

In some embodiments, the controller manages the coexistence of devices. For example, a control process for managing the coexistence of potentially interfering modules (eg, devices) may enumerate (eg, identify) devices (eg, sensors, launcher and/or other mods) to start. At least one coexistence matrix is identified that characterizes potentially interfering relationships within and/or between assemblies (eg, sensing each other, such as assemblies in proximity). For example, a buzzer in a first assembly disposed in a first enclosure may emit sound that propagates through the fastener(s) to a second enclosure in which the second assembly is located, the second enclosure The assembly has a sound sensor that senses the sound emitted by the buzzer. In some embodiments, the coexistence matrix is pre-generated according to the specific design of the assembly. In some embodiments, in response to the modules (eg, sensors and transmitters) in the enumeration assembly, predetermined data characterizing the interference potential between the various modules is used automatically in the (eg, coexistence) controller Generate a coexistence matrix. Based at least in part on the interference potential of the enumerated modules (e.g., devices), activation and/or can be scheduled, such as by establishing coordinated time windows for operating the various devices (e.g., according to the relationships characterized in the coexistence matrix). or undo activation. Operations may include intermittent, scheduled (eg, pre-scheduled), contingent, repetitive, episodic, and/or random operations. Operations may include non-simultaneous, simultaneous, or sequential operations.

In some embodiments, decisions are made regarding the operation of the device. For example, decisions about the operation of the module that measure, emit, and/or change environmental properties (eg, characteristics) can be made in the cloud and/or at the module level (eg, by using the processing of the module) coexistence controller of the device and/or controller). For example, at least about 90%, 70%, 50%, 30%, or 10% can be made on the module (eg, on the device, rather than in a processor and/or controller remote from the set (such as the cloud)) % decision. In some embodiments, parameter scaling is used in order to identify available computing power for free allocation (eg, among idle modules). Once the first module is measuring and the second module is not (eg, in an idle or inactive mode), the second module can process the information obtained by the first module. Likewise, the additional processor(s) may be grouped for computational tasks when the module containing the additional processor is not active for other purposes. For example, when an enclosure (eg, a room) is empty, then all processors of assembly units (eg, nodes) located in the enclosure may be allocated for other computing tasks. When an occupant enters a room, the occupant (eg, and/or any activity of the occupant) can be tracked by means of the assembly (eg, by radar) and used as needed to record information about the occupant modules, while the remainder of the capacity of the processor(s) and/or controller(s) is available for other tasks. In some embodiments, this configuration is dynamic as the occupant moves through the enclosure.

In some embodiments, the actionable insights of the building management system (BMS) may use data from one or more module types (eg, various sensors). The scheduling by the coexistence controller and/or processor can control the operation of the interfering sensor, eg, by separating the sensor from the transmitter of the sensed attribute and listening to each other. For example, sensors of the first type may be activated in a set disposed in the first assembly unit and deactivated transmitters of the interfering first type, while in a second assembly disposed in the second assembly unit Sensors of a first type (eg, type) are collectively deactivated and transmitters of an associated (eg, corresponding) first type are activated.

In some embodiments, the performance of the sensor and/or transmitter module is monitored for malfunctions. Faults may arise at least in part due to interference and/or detection of changes in the sensed environment. Predictable future environment. Based at least in part on the forecast, actionable terms associated with one or more future conditions can be identified, and remedies can be implemented and/or provided to the user. For example, a revised schedule of temperature sensing modules can be used to better monitor the temperature at locations where people congregate. For example, sensor modules in one assembly may be deactivated if sensor modules are predicted to fail when activating corresponding sensor modules in different adjacent assemblies, for example. For example, the measured properties can be used to generate a 3D map of the space. Attributes can be acoustic, light, environmental (eg, temperature, ventilation), and the state of building assets (eg, doors and/or windows). The performance of each sensor can be mapped as a function of time. The mapped data can be used to shape and/or predict (eg, take preventive and/or proactive actions).

25 shows an example method in which, at operation 2500, devices (eg, sensors, transmitters, and other modules) are enumerated. At operation 2501, a coexistence matrix is used to identify any interference potential. Activation and/or deactivation of any identified interfering and/or potentially interfering elements is scheduled at 2502 . Monitoring and/or mapping of the environment is performed at 2503 for attributes (eg, environmental characteristics) associated with interfering or potentially interfering device(s). At 2504, future environments are predicted for attributes in the enclosure, actionable items are detected, and/or remedial actions are taken and/or provided.

In some embodiments, the coexistence processor and/or controller distinguishes measured attributes that need to be monitored from other attributes that do not need to be monitored. Monitoring can be constant, intermittent, scheduled, episodic or random. The parameter(s) for constant, intermittent or scheduled module operation may include _CO2 , VOC, occupancy and lighting. Compared to these operating modes including _CO2 , VOC, occupancy, and lighting, other parameters change more slowly. Slower can be on the order of tens of minutes to several hours. Real-time data collection (eg, by sensors) may not be required continuously. For example, a coexistence controller and/or processor may use a scheduler to control the operation of modules that require intermittent operation, eg, to minimize (eg, avoid) their simultaneous operation.

In some embodiments, a coexistence controller and/or processor coordinates operations between individual assembly units (nodes). Information from the first assembly associated with the at least one first sensor may be associated with at least one second sensor in the second assembly (and/or with the local controller and/or processor of the second assembly) ) shared. In this way, the first assembly can cooperate with the second assembly. For example, the information from the first assembly related to the _CO2 sensor may be shared with the _CO2 sensor of the second assembly (and/or with the local controller of the second assembly). In this way, two CO ₂ sensors can cooperate. When the coverage of a sensor in one assembly (eg, a CO ₂ sensor) covers another assembly, the matching sensor type in the second assembly can be deactivated to prevent interference. If desired, sensor measurements from the first assembly can be shared with the second assembly.

In some embodiments, the role of coexistence controller and/or processor may be assigned to a node of a plurality of nodes in a processing system. For example, containerized applications including tasks associated with coexistence controllers can be managed within a clustered environment using an orchestration system. Managed services (eg, applications) can be distributed and executed to provide load balancing and can be redistributed in the event of resource (eg, node) failure or loss. In some embodiments, nodes are preconfigured to perform a process in which one assembly unit (eg, a node) is selected to assume the role of the master coexistence controller and the other assembly units assume the role of the slave coexistence controller. The pre-configuration process may continue to monitor the scheduling or other operations of coexistence tasks when the node selected to be the primary coexistence controller manages the coexistence function. If the detection of coexistence tasks (eg, scheduling) is stopped, the assignment of the role of the primary coexistence controller can be reassigned to a different assembly unit. For example, any particular node may become a master node and/or a slave node using UWB signals.

26 shows an example of a process by which an assembly unit is selected in block 2600 to fulfill the role of the coexistence scheduler. In block 1601, the roles of slaves of the assigned coexistence scheduler are assigned to other assembly units in the processing system. In block 2602, monitoring of the activity of the coexistence scheduler is performed. Continue monitoring as long as it is detected that the coexistence scheduler is not absent. If the scheduler is found not to exist in this example, the slave assembly unit (eg, node) proceeds in block 2603 according to its previously assigned operation (eg, schedule), and then returns to block 2600 for coexistence The role of the scheduler selects another assembly unit.

In some embodiments, the merging assembly unit includes a controller. A controller may monitor and/or direct (eg, physical) changes to the operating conditions of the apparatus, software, and/or methods described herein. Controlling may include regulating, manipulating, limiting, directing, monitoring, adjusting, modulating, altering, altering, restraining, checking, directing or managing. Controlling (eg, by a controller) may include attenuating, modulating, changing, managing, suppressing, discipline, regulating, constraining, supervising, manipulating, and/or directing. Controlling may include controlling control variables (eg, temperature, power, voltage, and/or profile). Control can include instant or offline control. Calculations utilized by the controller can be performed in real-time and/or offline. The controller can be manual or non-manual. The controller may be an automatic controller. The controller can operate on request. The controller may be a programmable controller. The controller can be programmed. A controller may include a processing unit (eg, a CPU or GPU). The controller can receive input (eg, from at least one sensor). The controller can deliver output. A controller may contain multiple (eg, sub) controllers. The controller may be part of a control system. The control system may include master controllers, floor controllers, local controllers (eg, enclosure controllers or window controllers). The controller can receive one or more inputs. The controller can generate one or more outputs. The controller may be a single-input single-output controller (SISO) or a multiple-input multiple-output controller (MIMO). The controller can interpret the received input signal. The controller may obtain data from one or more sensors. Acquiring can include receiving or extracting. Data may include measurements, estimates, determinations, generation, or any combination thereof. The controller may contain feedback control. The controller may include feedforward control. Control may include on-off control, proportional control, proportional-integral (PI) control, or proportional-integral-derivative (PID) control. Control can include open loop control or closed loop control. The controller may contain closed loop control. The controller may contain open loop control. The controller may include a user interface. The user interface may include (or be operably coupled to) a keyboard, keypad, mouse, touch screen, microphone, speech recognition package, camera, imaging system, or any combination thereof. The output may include a display (eg, a screen), speakers, or a printer.

The methods, systems and/or apparatus described herein may include a control system. The control system can communicate with any of the devices (eg, sensors) described herein. The sensors may be of the same type or of different types, eg, as described herein. For example, the control system may communicate with the first sensor and/or the second sensor. The control system can control one or more sensors. The control system may control one or more components of the building management system (eg, lighting, security and/or air conditioning systems). The controller can adjust at least one (eg, environmental) characteristic of the enclosure. The control system may use any component of the building management system to regulate the enclosure environment. For example, the control system may regulate the energy provided by the heating element and/or the cooling element. For example, the control system may regulate the speed of air flowing to and/or from the enclosure through the vent. The control system may include a processor. The processor may be a processing unit. The controller may include a processing unit. The processing unit may be central. The processing unit may include a central processing unit (abbreviated herein as "CPU"). The processing unit may be a graphics processing unit (abbreviated herein as "GPU"). The controller(s) or control mechanism (eg, including a computer system) may be programmed to implement one or more of the methods of the present invention. A processor can be programmed to implement the methods of the present invention. A controller may control at least one component forming the systems and/or apparatus disclosed herein.

A computer system programmed or otherwise configured to perform one or more operations of any one of the methods provided herein may control (eg, direct, monitor, and/or regulate) the methods of the present invention, Various features of equipment and systems, such as controlling heating, cooling, lighting and/or ventilation of the enclosure, or any combination thereof. The computer system may be part of, or in communication with, any sensor or set of sensors disclosed herein. A computer may be coupled to one or more of the mechanisms disclosed herein and/or any portion thereof. For example, a computer may be coupled to one or more sensors, valves, switches, lights, windows (eg, IGUs), motors, pumps, optical components, or any combination thereof.

27 shows a schematic example of a computer system 2700 programmed or otherwise configured to perform one or more operations of any of the methods provided herein. A computer system may include a processing unit (eg, 2706) ("processor", "computer" and "computer processor" are also used herein). A computer system may include memory or memory locations (eg, 2702) (eg, random access memory, read-only memory, flash memory), electronic storage units (eg, 2704) (eg, hard drives), Communication interfaces (eg, 2703) (eg, network adapters) for communicating with one or more other systems, and peripheral devices (eg, 2705), such as cache memory, other memory, data storage devices and/or electronic display adapter. In the example shown in Figure 27, memory 2702, storage unit 2704, interface 2703, and peripherals 2705 communicate with processing unit 2706 via a communication bus (solid line), such as a motherboard. The storage unit may be a data storage unit (or data repository) for storing data. The computer system may be operably coupled to a computer network ("network") (eg, 2701) by means of a communication interface. A network can be the Internet, an Internet and/or an inter-enterprise network, or a corporate intranet and/or an inter-enterprise network that communicates with the Internet. In some cases, the network is a telecommunications and/or data network. The network may include one or more computer servers that may enable decentralized computing, such as cloud computing. In some cases, a network may implement a peer-to-peer network with the aid of a computer system, which may enable devices coupled to the computer system to act as clients or servers.

The processing unit can execute a sequence of machine-readable instructions that can be embodied in a program or software. Instructions may be stored in a memory location, such as memory 2702. The instructions can be directed to a processing unit, which can then be programmed or otherwise configured to implement the methods of the present invention. Examples of operations performed by a processing unit may include fetching, decoding, executing, and writing back. The processing unit may interpret and/or execute the instructions. Processors may include microprocessors, data processors, central processing units (CPUs), graphics processing units (GPUs), system-on-chips (SOCs), co-processors, network processors, application-specific integrated circuits (ASICs) , Application Specific Instruction Set Processor (ASIP), controller, Programmable Logic Device (PLD), Chipset, Field Programmable Gate Array (FPGA) or any combination thereof. The processing unit may be part of a circuit such as an integrated circuit. One or more of the other components of system 2700 may be included in a circuit.

The storage unit can store files, such as drivers, libraries, and saved programs. The storage unit may store user data (eg, user preferences and user programs). In some cases, the computer system may include one or more additional data storage units external to the computer system, such as on a remote server that communicates with the computer system via an intranet or the Internet.

The computer system may communicate with one or more remote computer systems via a network. For example, a computer system can communicate with a remote computer system of a user (eg, an operator). Examples of remote computer systems include personal computers (eg, portable PCs), tablet or tablet PCs (eg, Apple® iPad, Samsung® Galaxy Tab), phones, smart phones (eg, Apple® iPhone, Android-enabled device, Blackberry®) or personal digital assistant. A user (eg, a client) can access the computer system via a network.

The methods as described herein may be implemented by means of machine (eg, computer processor) executable code stored on an electronic storage location of a computer system, such as in memory 2702 or an electronic storage unit 2704 on. Machine-executable or machine-readable code may be provided in the form of software. During use, processor 2706 can execute code. In some cases, the code may be retrieved from the storage unit and stored on memory ready for access by the processor. In some cases, the electronic storage unit may be eliminated, and the machine-executable instructions stored on memory.

The code may be precompiled and configured for use by a machine with a processor adapted to execute the code, or may be compiled during the execution phase. The code may be provided in a programming language that may be selected to enable the code to be executed in a precompiled or as-compiled manner.

In some embodiments, the processor includes program code. The code may be program instructions. Program instructions may cause at least one processor (eg, a computer) to direct the feedforward and/or feedback control loop. In some embodiments, the program instructions cause the at least one processor to direct a closed loop and/or open loop control scheme. Control may be based, at least in part, on one or more sensor readings (eg, sensor data). One controller can direct multiple operations. At least two operations may be directed by different controllers. In some embodiments, different controllers may direct at least two of operations (a), (b), and (c). In some embodiments, different controllers may direct at least two of operations (a), (b), and (c). In some embodiments, the non-transitory computer-readable medium causes each distinct computer to direct at least two of operations (a), (b), and (c). In some embodiments, different non-transitory computer-readable media cause each different computer to direct at least two of operations (a), (b), and (c). A controller and/or computer-readable medium may direct any of the apparatuses disclosed herein or components thereof. A controller and/or computer-readable medium may direct any operation of the methods disclosed herein.

In some embodiments, a tintable window exhibits a (eg, controllable and/or reversible) change in at least one optical property of the window, eg, upon application of a stimulus. Stimulation may include optical, electrical and/or magnetic stimulation. For example, stimulation can include applying a voltage. One or more tintable windows may be used to control lighting and/or glare conditions, eg, by adjusting the transmission of solar energy propagating therethrough. One or more tintable windows may be used to control the temperature within a building, for example, by regulating the transmission of solar energy propagating through the windows. Control of solar energy can control the thermal load imposed on the interior of a facility (eg, a building). Control can be manual and/or automatic. Controls may be used to maintain one or more requested (eg, environmental) conditions, such as occupant comfort. Controls may include reducing energy consumption of heating, ventilation, air conditioning and/or lighting systems. At least two of heating, ventilation and air conditioning can be induced by separate systems. At least two of heating, ventilation and air conditioning can be induced by one system. Heating, ventilation and air conditioning can be induced by a single system (abbreviated herein as "HVAC"). In some cases, the tintable window may be responsive to (eg, and communicatively coupled to) one or more environmental sensors and/or user controls. Tintable windows can include (eg, can be) electrochromic windows. Windows may be located in a range from the interior to the exterior of a structure (eg, a facility such as a building). However, this need not be the case. Tintable windows may be operated using liquid crystal devices, suspended particle devices, microelectromechanical systems (MEMS) devices (such as micro-shutters), or any technology now known or later developed that is configured to control the transmission of light through a window. Windows (eg, with MEMS devices for coloring) are described in an application entitled "MULTI-PANE WINDOWS INCLUDING ELECTROCHROMIC DEVICES AND ELECTROMECHANICAL SYSTEMS INCLUDING ELECTROCHROMIC DEVICES AND ELECTROMECHANICAL SYSTEMS DEVICES DEVICES)" in US Patent Application Serial No. 14/443,353, which is incorporated herein by reference in its entirety. In some cases, one or more tintable windows may be located within the building, such as between a conference room and a hallway. In some cases, one or more tinted windows may be used in automobiles, trains, airplanes, and other vehicles, eg, in place of passive and/or non-tinted windows.

In some embodiments, the tintable window comprises an electrochromic device (referred to herein as an "EC device" (abbreviated herein as ECD) or "EC"). The EC device may comprise at least one coating comprising at least one layer. At least one layer may contain an electrochromic material. In some embodiments, the electrochromic material exhibits a change from one optical state to another, such as when a potential is applied across the EC device. The transition of an electrochromic layer from one optical state to another can be caused, for example, by reversible, semi-reversible or irreversible ion insertion into the electrochromic material (eg, by means of intercalation) and corresponding injection of charge balancing electrons. For example, the transition of an electrochromic layer from one optical state to another can be caused, for example, by reversible ion insertion into the electrochromic material (eg, by means of intercalation) and corresponding injection of charge balancing electrons. Reversible may be for the life expectancy of the ECD. Semi-reversible refers to a measurable (eg, significant) degradation in the reversibility of a window's hue over one or more tinting cycles. In some cases, a portion of the ions responsible for the optical transition is irreversibly incorporated into the electrochromic material (eg, and thus the induced (altered) hue state of the window is irreversible to its original colored state). In various EC devices, at least some (eg, all) of the irreversibly bound ions can be used to compensate for "blind charges" in the material (eg, ECD).

In some implementations, suitable ions include cations. Cations can include lithium ions (Li+) and/or hydrogen ions (H+) (eg, protons). In some implementations, other ions may be suitable. Cations can be intercalated into (eg, metal) oxides. Changes in the intercalation state of ions (eg, cations) into the oxide can induce visible changes in the oxide's hue (eg, color). For example, oxides can transition from a colorless state to a colored state. For example, intercalation of lithium ions into tungsten oxide (WO3-y (0<y≤about 0.3)) can cause tungsten oxide to change from a transparent state to a colored (eg, blue) state. The EC device coating as described herein is located within the viewable portion of the tintable window so that the tint of the EC device coating can be used to control the optical state of the tintable window.

28 shows an example of a schematic cross-section of an electrochromic device 2800 in accordance with some embodiments. The EC device coating is attached to a substrate 2802, a transparent conductive layer (TCL) 2804, an electrochromic layer (EC) 2806 (also sometimes referred to as a cathodically colored layer or cathodically colored layer), an ionically conductive layer, or An area (IC) 2808 , a counter electrode (CE) 2810 (sometimes also referred to as an anodically colored layer or anodically colored layer), and a second TCL 2814 .

Elements 2804 , 2806 , 2808 , 2810 , and 2814 are collectively referred to as electrochromic stack 2820 . A voltage source 2816, operable to apply a potential across the electrochromic stack 2820, effectuates the transition of the electrochromic coating from, for example, a clear state to a colored state. In other embodiments, the order of the layers is reversed relative to the substrate. That is, the layers are in the following order: substrate, TCL, opposing electrode layer, ion conducting layer, electrochromic material layer, TCL.

In various embodiments, the ion conductor region (eg, 2808) may be formed from a portion of the EC layer (eg, 2806) and/or from a portion of the CE layer (eg, 2810). In such embodiments, the electrochromic stack (eg, 2820) can be deposited to include a cathodically dyed electrochromic material (EC layer) in direct physical contact with an anodically dyed counter electrode material (CE layer). Ionic conductor regions (sometimes referred to as interfacial regions or ionically conductive substantially electronically insulating layers or regions) can be formed where the EC and CE layers meet, eg, via heating and/or other processing steps. Examples of electrochromic devices (eg, including those fabricated without depositing phase dissimilar ionic conductor materials) can be found in a May 2, 2012 filing entitled "ELECTROCHROMIC DEVICES)" in US Patent Application Serial No. 13/462,725, which is incorporated herein by reference in its entirety. In some embodiments, the EC device coating may include one or more additional layers, such as one or more passive layers. Passive layers can be used to modify certain optical properties to provide moisture and/or to provide scratch resistance. These and/or other passive layers can be used to hermetically seal the EC stack 2820. Various layers including transparent conductive layers (such as 2804 and 2814) may be treated with anti-reflective and/or protective layers (eg, oxide and/or nitride layers).

In certain embodiments, the electrochromic device is configured to cycle (eg, substantially) reversibly between a clear state and a tinted state. Reversible can be within the expected lifetime of the ECD. The life expectancy can be at least about 5, 10, 15, 25, 50, 75 or 100 years. The life expectancy can be any value between the foregoing values (eg, from about 5 years to about 100 years, from about 5 years to about 50 years, or from about 50 years to about 100 years). A potential can be applied to the electrochromic stack (eg, 2820) such that the available ions in the stack can make the electrochromic material (eg, 2806) in a tinted state when the window is in a first hue state (eg, clear) Mainly resides in the opposite electrode (eg, 2810). When the potential applied to the electrochromic stack is reversed, ions can be transported across the ionically conductive layer (eg, 2808) to the electrochromic material and cause the material to enter a second hue state (eg, a colored state).

It should be understood that the reference to the transition between the clear state and the colored state is non-limiting and suggests only one example of many examples of electrochromic transitions that may be implemented. Unless otherwise specified, herein, whenever reference is made to a clear to colored transition, the corresponding device or process encompasses other optical state transitions, such as non-reflective to reflective and/or transparent to opaque transitions. In some embodiments, the terms "clear" and "bleached" refer to an optically neutral state, such as unpigmented, transparent, and/or translucent. In some embodiments, the "color" or "hue" of an electrochromic transition is not limited to any wavelength or range of wavelengths. Selection of suitable electrochromic materials and opposing electrode materials can control the relative optical transition (eg, from a colored state to an uncolored state).

In certain embodiments, at least a portion (eg, all) of the materials that make up the electrochromic stack are inorganic, solid (eg, in a solid state), or both inorganic and solid. Because various organic materials tend to degrade over time, especially when tinted building windows are exposed to heat and UV light, inorganic materials offer the advantage of reliable electrochromic stacks that can function for extended periods of time. In some embodiments, materials in a solid state may provide the advantage of minimal contamination and minimize leakage problems, as materials in a liquid state do sometimes. One or more of the layers in the stack may contain an amount of organic material (eg, measurable). The ECD or any portion thereof (eg, one or more of the layers) may contain little or no measurable organic matter. The ECD or any portion thereof (eg, one or more of the layers) may contain one or more liquids, which may be present in very small amounts. Few can be at most about 100 ppm, 10 ppm or 1 ppm of ECD. Solid state materials may be deposited (or otherwise formed) using one or more processes employing liquid components, such as certain processes employing sol-gel, physical vapor deposition, and/or chemical vapor deposition.

29 shows an example of a cross-sectional view of a tintable window embodied in an insulating glass unit (“IGU”) 2900, according to some implementations. The terms "IGU," "tintable window," and "optically switchable window" are used interchangeably herein. When an IGU is provided for installation in a building, it may be desirable for the IGU to serve as a basic construct for holding electrochromic panes (also referred to herein as "windows"). IGU windows can be of single-substrate or multi-substrate construction. The window may comprise, for example, a laminate of two substrates. An IGU (eg, having a two-pane or three-pane configuration) can provide several advantages over a single-pane configuration. For example, a multi-pane configuration may provide enhanced thermal isolation, noise isolation, environmental protection, and/or durability when compared to a single-pane configuration. A multi-pane configuration provides enhanced protection for ECDs. For example, an electrochromic film (eg, and associated layers and conductive interconnects) can be formed on the inner surface of a multi-pane IGU and protected by an inert gas filled in the interior volume of the IGU (eg, 2908 ) . The inert gas filling can provide at least some (thermal) insulating function to the IGU. Electrochromic IGUs can have thermal barrier capabilities, for example, by means of colorable coatings that absorb (and/or reflect) heat and light.

In some embodiments, an "IGU" includes two (or more) substantially transparent substrates. For example, an IGU may include two panes of glass. At least one substrate of the IGU can include electrochromic devices disposed thereon. One or more panes of the IGU may have a separator disposed therebetween. The IGU may be of hermetically sealed construction, eg, having an interior region isolated from the surrounding environment. A "window assembly" may include an IGU. A "window assembly" may include (eg, stand alone) laminates. A "window assembly" may include one or more electrical leads, eg, for connecting to an IGU and/or laminate. Electrical leads may operably couple (eg, connect) one or more electrochromic devices to voltage sources, switches, and the like, and may include a frame that supports the IGU or laminate. The window assembly may include a window controller, and/or components of the window controller (eg, docking pieces).

29 shows an example implementation of an IGU 2900 that includes a first pane 2904 having a first surface S1 and a second surface S2. In some implementations, the first surface S1 of the first pane 2904 faces an external environment, such as an outdoor or external environment. The IGU 2900 also includes a second pane 2906 having a first surface S3 and a second surface S4. In some implementations, the second surface (eg, S4 ) of the second pane (eg, 2906 ) faces the interior environment, such as a house, building, vehicle, or compartment thereof (eg, an enclosure therein, such as a room) the internal environment.

In some implementations, the first and second panes (eg, 2904 and 2906) are transparent or translucent, eg, transparent or translucent at least for light in the visible spectrum. For example, each of the panes (eg, 2904 and 2906) may be formed from a glass material. Glass materials may include architectural glass and/or shatterproof glass. The glass may contain silicon oxide (SO _x ). The glass may comprise soda lime glass or float glass. The glass may contain at least about 75% silicon dioxide (SiO ₂ ). _The glass may contain oxides such as Na2O or CaO. The glass may contain alkali metal or alkaline earth oxides. The glass may contain one or more additives. The first and/or second panes may comprise any material having suitable optical, electrical, thermal and/or mechanical properties. Other materials (eg, substrates) that may be included in the first and/or second panes are plastic, semi-plastic and/or thermoplastic materials such as poly(methyl methacrylate), polystyrene, polycarbonate, Allyl diethylene glycol carbonate, styrene acrylonitrile copolymer (SAN), poly(4-methyl-1-pentene), polyester and/or polyamide. The first and/or second panes may include a specular material (eg, silver). In some implementations, the first and/or second panes can be enhanced. Strengthening may include tempering, heating and/or chemical strengthening.

In some embodiments, a device set includes a plurality of devices operably coupled to one or more circuit boards, enclosed in a housing, such as disclosed herein (eg, see FIGS. 9 , 10A, and 10B ). ). Various types of enclosures, circuit boards, and device set configurations may exist. The enclosure may be dedicated to one or more sensed attributes. A device set may include processors, accelerometers, network adapters, sockets, plugs, memory, geolocation technology, or circuit system boards, such as specific attribute(s) that are not related to the device set specific sensing. For example, a set of devices dedicated to sensing powdered materials may include processors (eg, GPUs), accelerometers, network adapters, sockets, plugs, memory, geolocation technology, and circuit system boards. For example, a set of devices dedicated to sensing IR and/or visual images (eg, using a camera) may include processors (eg, GPUs), accelerometers, network adapters, sockets, plugs, memory, geographic Location technology and circuit system board(s). For example, a set of devices dedicated to sensing IR humidity, carbon dioxide, pressure, and temperature may include processors (eg, GPUs and/or CPUs), accelerometers, network adapters, sockets, plugs, memory, geographic Location technology and circuit system board(s).

33 shows an example of an assembly housing shown as a front view 3300, a front perspective view 3330, and a rear perspective view 3360. The device housing is configured to facilitate connection to sockets 3331 and 3361. The housing includes an unpatterned front side section 3301 (eg, smooth, flat, lower Ra value section) and a patterned front side section 3302 (eg, rough, patterned, higher Ra value section) . The housing may include recesses configured to mount on the fixture. The housing may have extensions 3363 configured to facilitate the incorporation of modules (eg, geolocation modules) into the device set. The housing contains a plurality of holes 3303. The plurality of holes can help to draw outside atmosphere (eg, air) into the device housing, eg, to help sense atmospheric components (eg, particulate matter). The plurality of holes may facilitate atmospheric exchange between the interior of the sensor set and the outside atmosphere. Atmospheric exchange can be passive or active. For example, one or more holes can serve as suction holes and one or more holes can serve as vent holes. In the example shown in Figure 33, the holes are arranged in four rows of three holes. One or more (eg, both) of the row of holes may serve as suction holes configured to draw atmospheric air from the enclosure into the device housing (eg, to facilitate sensing by the sensor) , and one or more (eg, both) of the row of holes may serve as exhaust holes configured to exhaust atmosphere from the device housing back into the enclosure atmosphere. At least two of the plurality of rows dedicated to an active function (eg, aspiration or expelling) can be positioned next to each other (eg, with no rows of intervention holes in between). At least two of the plurality of rows dedicated to an active function (eg, aspiration) can be positioned adjacent to each other and separated by one or more rows of holes dedicated to an opposite active function (eg, expulsion). Orifices dedicated to each function (eg, suction or discharge) are grouped (eg, squeezed) together. A group of holes dedicated to one active function (eg, suction) can be separated by a gap from a group dedicated to an opposite active function (eg, drainage). The length of the gap minimizes mixing of the exhaust air with the air drawn into the device concentration. In some embodiments, the suction of atmospheric air is performed at a first time, and the exhaust of atmospheric air from the set of devices is performed at a second time different from the first time. The first time may be separated from the second time by a time gap. The time gap minimizes mixing of the exhaust air with the air drawn into the device set. Active exhaust and suction of the atmosphere can be facilitated by actuators (eg, motors).

34 shows an example layout of modules on a circuit board. The front side of the circuit board housed in the housing shown in Figure 33 is shown at 3400, which is configured to face the user once the set housing is attached to the fixtures in the room where the user is located. The circuit board may include processors, sensors, transceivers, and/or transmitters. For example, 3410 is an emitter, ie, a light emitting diode (LED), which can act as an optional light guide and/or a beacon (eg, as disclosed herein). The rear side of the circuit board housing the housing shown in FIG. 33 is shown at 3450 and its perspective view 3490. Some parts connected to the circuit board include: 3451 is a cabling connector (eg , jacks, such as RJ 45 PoE connectors); 3452 are communication (eg, data) and/or power connectors (eg, jacks), such as universal serial bus (USB) connectors (eg, micro USB); 3457 3458 is an audio signal transformer; 3458 is a power transformer; 3453 is a controller, such as a microcontroller (eg, ARM Cortex-M, such as MCU M7); 3454 is to facilitate coupling to a network, such as an IX Ethernet connection 3455 is a cabling connector (eg, socket) for mounting to a surface such as a wall, ceiling, or floor; 3455 is a geolocation module; and 3456 is a connector to a particulate matter sensor (eg, SPS30) . The controller may include a core optimized for low cost and energy efficient integrated circuits. The controller may contain a high performance core. For example, it may include a 6-stage superscalar pipeline with branch prediction and an optional floating-point unit capable of single-precision and optionally double-precision operations. The command and data bus may include a 64-bit wide bus. Geolocation modules may include real-time location systems (RTLS). Geolocation modules may facilitate wired and/or wireless communications. A geolocation module may include a transceiver (eg, a radio). Geolocation modules (eg, DWM1001C DecaWave) may include geolocation technology (eg, facilitating UWB and BLE (eg, BLE 5.0) technology. Geolocation modules and/or device sets may include accelerometers and/or battery packs The particulate matter sensor can be configured to measure particle concentration/count as a stand-alone meter, or simultaneously by other related sensors (eg, gas sensors, such as toxic gas sensors, gases (eg, air) ) velocity sensor and/or barometric pressure sensor to measure air quality. Certain substance sensors can be configured to measure mass concentration, such as PM-X (micrograms per cubic meter µG/m ³ ) and/or The measured number concentration is NC-X (N/ ^cm3 ). The particulate matter sensor can be configured to report data as accumulated over time. The particulate matter sensor can be configured to detect a PM1.0 (corresponding to the mass concentration of particles having a diameter from about 0.5 micrometers (µm) to about 1.0 µm), PM2.5 (corresponding to the mass concentration of particles having a diameter from about 0.5 µm to about 2.5 µm) , PM4.0 (corresponding to the mass concentration of particles having a diameter from about 0.5 µm to about 4.0 µm) or PM10 (corresponding to the mass concentration of particles having a diameter from about 0.5 µm to about 10 µm). Particulate matter The sensor may provide a "typical particle size", which is calculated based on a weighted average of all PM and NC values. The particulate matter sensor may be configured to sense particles having diameters of at least about 0.2 µm, 0.3 µm, 0.5 µm, 1.0 µm Particles with diameters of µm, 2.5 µm, 4.0 µm, 5.0 µm, 8.0 µm, or 10.0 µm. The particulate matter sensor can be configured to sense values having values between any of the foregoing (eg, from about 0.2 µm to about 10.0 µm) diameter particulate matter. The device set may include additional sensors such as %RH, temperature, CO2, total VOC (TVOC), or any other sensor such as disclosed herein.

Figure 35 shows an example of a perspective view of the device assembly shown exploded. The device set has a housing with a front cover 3500 and a back cover 3560 that houses a circuit board 3530 that connects to various sensors and other modules, such as visible light sensors (eg, cameras) 3532, infrared sensors ( For example, an IR camera) 3534, a power supply 3533, a processor 3535 (eg, Nvidia Jetson), and a connector 3531 (eg, an IX Ethernet connector such as a Registered Jack) that facilitates the connection of the device's circuitry to the network (RJ) 45 PoE connector), and 3536. The circuit board is also shown as perspective view 3520. The front and back sides of the housing are coupled to each other and held together by screws (not shown) engaged in hole pairs such as 3561 and 3501 .

36A-D show examples of various views of device sets in various configurations. Figure 36A shows the front cover 3600 of the set housing 3603 engaged in the frame portion 3602 that surrounds the front cover of the set housing. Front cover 3603 includes two holes 3605 and 3604 configured for sensor measurements. For example, the holes 3605 can help a visual sensor (eg, a camera) to sense the external environment of the device set. For example, holes 3604 may facilitate infrared sensors (eg, cameras) to sense the external environment of the device set. The device housing may contain a circuit board, such as similar to 3530 of FIG. 35 . The device set may have a front cover and a back cover that are configured to be engaged, eg, using screws, snap fits, glue, pins, or any other engagement mechanism, such as disclosed herein. Engagement may be reversible (eg, engagement and disengagement). The engagement mechanism can be configured to facilitate reversible engagement (eg, for installation, maintenance, and repositioning). 36B-36D show example stages of engagement between the front and back covers of the device set. For example, Figure 36 shows a device set front portion 3620 and a device set rear portion 3622 in a disengaged configuration. The front cover includes snap pins, such as 3621, and the rear portion has four holes, such as 3623, to facilitate movement and engagement (snapping) of the pins once the front and rear covers are in close enough proximity. 36C shows an example in which the front cover 3630 of the device set is close enough to the rear cover 3632 to facilitate the access of the pins of the front portion (such as 3631) to the holes (such as 3632) of the back portion 3631. The holes are configured (eg, shaped) to facilitate pin entry into holes in the misaligned (eg, recessed) portion of the rear portion 3631 relative to the front portion 3630, as shown in FIG. 36 . Alignment of the front and rear portions is facilitated by moving the rear portion relative to the front portion in the direction along arrow 3636. Figure 36D shows an example of aligned engagement of the front cover 3640 and the rear cover 3640 of the set with all pins engaged and openings 3642 visible. Opening 3642 may facilitate coupling of the set of devices to a network (eg, via a connector (eg, a socket), such as 3454 of Figure 34).

In some embodiments, the set of devices is disposed in a frame portion (eg, a mullion or a sash). The frame may contain a frame cap. The frame cap can be a mullion or a horizontal frame. Frame caps can cover mullion or horizontal frames. In some embodiments, the framework cap comprises a polymer (eg, an organic polymer), a resin, or an allotrope of elemental carbon. In some embodiments, the frame cap includes a metal including elemental metals and/or metal alloys. In some embodiments, the frame cap comprises a composite material. In some embodiments, the frame cap comprises a non-composite material. In some embodiments, the surface of the frame cap is treated. The frame cap can be configured to be electrically resistant (eg, non-conductive). At least one surface of the frame cap may be treated. For example, the frame cap may comprise aluminum that has been surface treated to produce anodized aluminum. The surface can be configured for self-lubrication. The surface may comprise impregnated polytetrafluoroethylene (PTFE) Teflon (eg, for enhanced lubricity and/or low friction). At least the surface of the frame cap can be configured to have improved lubricity, higher corrosion resistance, and/or higher electrical resistance compared to an untreated surface. This surface treatment may facilitate, for example, tool-less installation and removal of the frame cap portions from each other (eg, via snap-fit). Tool-less installation saves time during commissioning.

In some embodiments, the frame cap and/or frame (or portions thereof) are configured for temperature regulation. The frame cap and/or frame (or portions thereof) may include one or more ventilation holes. One or more vents may be configured to facilitate gas flow within the frame cap and/or frame (or portion thereof), eg, from one end of the frame cap and/or frame (or portion thereof) to the opposite end thereof. One or more vents may be configured to facilitate temperature regulation of the interior of the frame cap and/or frame (or portion thereof). Frame caps and/or frames (or portions thereof) are part of a frame system, such as doors, walls, support structures, windows (such as tintable windows), or any combination thereof. One or more vents may be configured to facilitate temperature regulation of the frame cap and/or the interior of the frame (or portion thereof), such as during temperature changes in the frame system. The one or more vents are configured to facilitate integration with (eg, disposed in and/or on the frame cap and/or frame (or portion thereof)) at least Gas flow near a device. The device may be positioned partly inside the frame cap and/or frame (or part thereof) and partly outside the frame cap and/or frame (or part thereof). The device may be positioned partly inside the frame cap and/or frame (or part thereof) and partly at the outer surface of the frame cap and/or frame (or part thereof). A device may include a sensor set or a media display. One or more vents may be configured to facilitate temperature regulation near at least one device disposed in the frame cap portion, eg, to facilitate temperature regulation of the device (eg, to thermally equilibrate, heat, or cool the device). The device may be positioned partly inside the frame cap and/or frame (or part thereof) and partly outside the frame cap and/or frame (or part thereof). The frame cap and/or frame (or portion thereof) may include an insulating coating configured, for example, to reduce temperature variations in the interior of the frame cap and/or frame (or portion thereof), respectively. The frame cap and/or frame (or portion thereof) may include an insulating coating configured to reduce the temperature balance between the external environment and the interior of the frame cap and/or frame (or portion thereof). The frame cap and/or frame (or portion thereof) may include an insulating coating configured to reduce temperature equilibration between the frame (as part of the frame system) and the frame cap (eg, inside the frame cap). The insulating coating may be disposed in and/or at the interior of the frame cap and/or frame (or portion thereof). A frame system (eg, kit and/or frame) may include an intermediate body (eg, a thermal insulator or thermal conductor) disposed between the frame cap and the frame (which is part of the frame system). The intermediate body can be an insert, an intermediate or an insert body. The intermediate body can be configured to reduce heat transfer (eg, temperature equilibration) between the frame system and the frame cap portion (eg, that is part of the kit). The intermediate body may comprise a solid, semi-solid (eg, gel), liquid or gaseous material (eg, low thermal conductivity material). Intermediate body (eg, insulator) materials may include polymers, braids, and/or foams. The intermediate body may be a low pressure gas (eg, below ambient pressure in the environment in which the frame cap and/or frame (or portion thereof) is disposed), eg, below about one (1) atmosphere. The intermediate ontology can be passive. The passive intermediate body may contain heat conducting plates or heat conducting pipes. The intermediate ontology can be active. Active intermediate materials include thermostats, circulating coolants, heat transfer plates, heat pipes, heaters or coolers. The intermediate body may be positioned in a manner that facilitates temperature shielding, restricts heat exchange, or any combination thereof. The device, device housing, intermediate body, frame cap and/or frame (or parts thereof) may comprise insulators, heat exchangers and/or cooling elements. The heat exchanger and/or cooling element may comprise heat pipes or metal plates. The metals may comprise elemental metals or metal alloys. Metals can be configured for (eg, efficient and/or rapid) heat transfer. Metals may include copper, aluminum, brass, steel or bronze. Heat exchangers (eg, cooling elements) may contain fluid, gaseous, or semi-solid (eg, gel) materials. Heat exchangers can be active and/or passive. The heat exchanger may contain circuit substances. The heat exchanger may be operably coupled to an active cooling device (eg, a thermostat, cooler, and/or freezer). The active cooling device may be positioned outside the device, the device housing, the intermediate body, the frame cap, and/or the frame (or portions thereof), or any combination thereof. Heat exchangers may be positioned in fixtures (e.g., floors, floors, etc.) of enclosures (e.g., buildings or rooms) in which the device, device housing, intermediate body, frame cap, and/or frame (or parts thereof), or any combination thereof, are positioned. ceiling or wall). Heat exchange can involve radiation, conduction or convection. The intermediate body may comprise a polymer. For example, polyurethane, styrene, vinyl, Teflon, Capeton, nylon or polyimide. The intermediate body may comprise foam, tape, or extruded shapes (eg, sheets). The coating can be anodized (eg, anodized aluminum). The coating can be a polymer, such as any of the polymers disclosed herein. The intermediate body may contain at least one thermal fracture.

Figure 37A shows examples of various frame system parts shown in vertical cross-section and for head adjustment. The first cap portion 3734 includes two splines pointing toward each other and a pocket configured for snap-fit engagement. The first cap portion 3734 is configured to attach to an existing frame portion, such as 3736. The second cap portion 3733 includes a side portion with a snap fit configured to couple to a pocket in the first cap portion 3734. The second cap portion 3733 includes a railing. The railing may extend along the entire second cap portion or only to a portion of the second cap portion. As shown in FIG. 37A, the second cap portion 3733 is configured to engage with the first portion 3734. The interior 3732 of the frame cap is configured to hold cables and/or devices (eg, sensors, transmitters, controllers, circuitry (eg, circuit boards), and/or other electrical components), such as housing 3735, which may A housing for one or more devices. The railing side can have any length less than the width of the frame cap. The width of the frame cap can be equal to or greater than the width of existing frames, such as 3736. The width of the railing can be configured to accommodate wiring. The length of the railing can be configured to hold the wiring in place. The length of the opening to the railing cavity can be configured to allow wiring to pass through. Housing 3735 is seated partially within the interior of frame cap 3732 and partially flush with the outer surface of frame cap portion 3733 . Frame caps are positioned adjacent to frame portions 3736 (eg, mullions or stiles) as part of the frame system. The intermediate body 3731 is positioned between the frame portion 3736 and the frame cap (including 3733 and 3734). The intermediate body may be configured to reduce any device in the frame portion 3736 and (i) the frame cap (including 3733 and 3734), (ii) the interior of the frame cap 3732, (iii) the housing 3735, (iv) the housing 3735 or ( v) heat exchange between any combination thereof (eg, any combination of (i), (ii), (iii) and (iv)). For example, solar radiation 3735 may impinge upon the frame 3736 exposed to the ambient external environment of the facility, which may cause the frame 3736 (eg, and optionally the interior of the frame 3730) to heat. Intermediate body 3731 can be configured to reduce any means from frame portion 3736 toward (i) frame cap (including 3733 and 3734), (ii) interior of frame cap 3732, (iii) housing 3735, (iv) housing 3735 or (v) heat transfer in any combination thereof. The intermediate body can passively or actively reduce heat transfer. The intermediate body can reduce heat transfer by cooling and/or by insulating.

37B shows an example of a frame or frame cap portion shown in a perspective view and an example for head adjustment. Portion 3750 is a frame cap or frame portion (eg, mullion or sash) that is part of the frame system. Frame or frame cap portion 3750 is configured to receive housing 3760, which includes one or more devices (eg, a device set). The frame or frame cap portion 3750 includes an end portion 3751 , a second end portion 3752 opposite the end portion 3751 along the length of the frame or frame cap portion 3750 . The frame or frame cap portion 3750 includes a first region 3753 proximate the first end 3751 and a second region 3752 proximate the second end 3752. The first area 3753 shows perforations (holes) 3755 located on the frame or frame cap portion 3750. The second area 3754 shows perforations (holes) 3756 located on the frame or frame cap portion 3750. Frame or frame cap portion 3750 includes a third region 3758 surrounding housing 3760 and preforms 3757a, 3757b, 3757c, and 3757d in the third region. The perforations (eg, holes) may be arrays. Perforations can be grouped in groups such as 3755, 3757a/b/c/d, or 3756. Perforations in groups can be organized or unorganized (eg, randomly located). The perforations can be configured as a repeating lattice (eg, a matrix). Perforations may be placed at either side of the frame or frame cap portion 3750. In the example shown in FIG. 37B , groups of perforations are disposed on one side of the frame or frame cap portion 3750 . There may be one or more groups of perforations located anywhere along the frame or frame cap portion. 37B shows an example of a group of perforations positioned proximate each end of the frame or frame cap portion 3750 and proximate the housing 3760 disposed in the frame or frame cap portion 3750 and flush with the outer surface of the frame or frame cap portion 3750. The housing may be partially or completely within the frame or frame cap portion. The housing may be partially or completely outside the frame or frame cap portion. When the housing is fully seated outside the frame or frame cap portion, it can be attached to the frame or frame cap portion. The frame or frame cap portion may be positioned horizontally or vertically relative to the center of gravity, such as 3770. 37B shows an example of a frame or frame cap portion 3750 positioned along a gravity vector 3757 pointing to a center of gravity 3770. Heat exchange may be initiated when the frame or frame cap portion 3750 experiences heat in its interior above ambient temperature. For example, a gas (eg, air) may travel upwards in a direction from the second end 3752 towards the first end 3752 opposite to the gravity vector 3771 . A gas (eg, air) may exit any of the perforations it encounters along its path of travel in the frame or frame cap portion 3750. Gas (eg, air) may be drawn into the interior of the frame or frame cap portion 3750, eg, during cooling and/or heat exchange. For example, gas can enter via perforations (eg, 3756). Gas may preferably enter one set of perforations (eg, 3756) and exit another set of perforations (eg, 3755), eg, to create convective heat exchange. Heat may be generated by one or more of the devices in the housing, for example, during operation of the device. Heat can escape via, for example, perforations adjacent to the housing. Examples of temperature regulation, control systems, networks, sensors, and sets of devices can be found in an application filed on April 2, 2021, entitled "DISPLAY CONSTRUCT FOR MEDIA PROJECTION AND WIRELESS CHARGING )" in U.S. Provisional Patent Application Serial No. 63/170,245, which is incorporated herein by reference in its entirety.

While preferred embodiments of the invention have been shown and described herein, those skilled in the art will appreciate that such embodiments are provided by way of example only. It is not intended that the present invention be limited to the specific examples provided within this specification. While the invention has been described with reference to the foregoing specification, the description and illustration of the embodiments herein are not intended to be construed in a limiting sense. Numerous changes, changes, and substitutions will occur to those skilled in the art without departing from this invention. Furthermore, it is to be understood that all aspects of the invention are not limited to the specific depictions, configurations or relative proportions set forth herein, which depend upon various conditions and variables. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. Accordingly, it is intended that the present invention also covers any such alternatives, modifications, variations or equivalents. The following claims are intended to define the scope of the invention and to therefore cover methods and structures within the scope of this claim and its equivalents.

100: BMS and control system 101: Building 103: Main controller 105a: Intermediate controller 105b: Intermediate controller 110: Local controller 200: Control system architecture 204: Local controller 206: Floor controller 208: Main Controller 210: External Source 220: Database 224: Building Management System (BMS) 300: Enclosure 310: Device 320: Network 400: Figure 402: Meeting Room 405A: First Sensor Set 405B: Second Sensor Sensor Set 405C: Third Sensor Set 410: Groups 415A, 415B, 415C: Points 425A, 425B, 425C: Sensor Output Reading Distribution 430: CO ₂ Graphs 435A, 435B, 435C: Points 440: Miscellaneous Infographics 445A, 445B, 445C: Points 450A, 450B, 450C, 450D, 450E: Sensor Distribution Curves 451A, 451B, 451C, 451D, 451E: Sensor Distribution Curves 500: Instance Set Module/Assembly Module Group 501: Convection Graph 502: Temperature Graph 503: Temperature Graph 504: Temperature Graph 600: Graph 605: Sensor Set 610A, 610B, 610C, 610D: Sensor 651: Cloud 652: Processor 654: Remote Processor 705: Controller 710: Sensor Correlator 715: Model Generator 720: Event Detector 725: Processor 750: Network Interface 800: Configuration 809: Display 811: Port 813: Equalizer 817: Speaker 819: Microphone 821: Sensor/Connector 822: Connector 823: Connector 825: Wired or Wireless Communication 830: DAE 831: Double Arrow 832: Double Arrow 833: Double Arrow 834: Double Arrow 835: Double Arrow 836: Double Arrow 840 : Processor 841: External Network 900: Assembly 901: Protective Enclosure 902: Wall Mount Adapter 903: Window Mullion Section 904: Top Panel Mount Adapter/Rear 905: Front 1000: Rear 1002: CO ₂ Sensor 1007: Ultra Wideband and/or BLE Transceiver 1008: Microcontroller Unit (MCU) 1009: Micro USB Connector 1010: Ethernet Connector 1011: Ethernet Connector 1012: Heat Sink 1050: Front side 1051: Ambient sensor 1053: Air intake port 1054: Microphone 1055: LED light source 1056: Ambient light sensor 1100: Set case/bag 1101: Main case body/body 1102: Cover 1103: Area 1104: No Textured Area 1105: Backside 1106: Screw 1107: Socket 1108: Recess 1109: Windowed Area 1110: Recess 1111: Recess 1200: Bladder 1201: Body 1202: Cover 1203: Outer Liner 1205: Socket 1206: Screw 1207: Socket 1208 : Screw 1280: Depth 1300: Cover Part 1301: First Longitudinal End 1304: Area 1310: Cap 1311: Design 1314: Window 1315: Window 1316: Window 1317: Window 1400: Light Pipe Element 1401: Transparent Tube body 1402: mounting flange 1403: opening 1404: cover 1405: window aperture 1406: mounting post 1407: ambient light sensor 1408: printed circuit board 1500: bladder 1501: plug-in coupler 1502: U-shaped mullion cap 1504: Inner Rail 1505: Inner Rail 1506: Guide Tab 1507: Guide Tab 1510: Spline 1511: Fastener Socket 1512: Threaded Nut 1513: Mounting Screw 1514: Side Rail 1515: Side Rail 1516: Tab 1517 : protrusions 1600: mullion caps 1601: forward facing surfaces 1602: elongated slots 1603: protrusions 1604: rails 1700: DAE bladders 1701: wall mount plates 1710: bladders 1711: wall mount shapes 1720: bladders 1723: masts 1730: bladders 1740: Capsule 1741: Frame 1750: Capsule 1751: Dome Frame 1790: Center of Gravity Pointing Vector 1800: Lid 1801: Heart Window 1802: Patterned Portion 1850: Lid 1851: Window 1852: Shaped Window 1860: Device Set Width 1861: Device Set Housing Length 1900: Printed Circuit Board 1901: First End 1902: Thermal Imaging Array 1903: Breakout Board 1904: Microphone 1905: Onboard Thermistor 2000: Control Unit Assembly 2001: Main Application Processor 2002: Network Controller 2003: Front End Controller 2004: Coaxial Connector 2005: Ethernet Transceiver 2006: Jack 2007: Ethernet Switch 2010: Set 2011: Sensor Module 2012: Video Module 2013: Audio Module 2014: Processor 2015: Controller Power Circuit 2016: Serial Bus 2017: Memory Card 2100: Set 2101: Data Acquisition Framework 2102: Sampling Interval 2103: Sampling Frequency 2104: Sample Size 2105: Sensor Data Read API 2106: Sensor Configuration API 2107: Command (CMD) Block 2108: Machine Learning Interface Engine 2109: Set of Filters and Schemes 2200: Coexistence Matrix 2201: Column Header 2202: Row Header Head 2203: Dotted Cell 2204: Cell 2205: Cell 2206: Cell 2300: Processing System 2301: Controller 2302: Scheduler 2303: Sensor 2304: Transmitter 2305: System Layout 2306: Coexistence Matrix 2307 : Learning Module 2308: Shared Control Block 2309: Task Memory Block 2310: Component Data Memory Block 2311: Cloud 2400: Coexistence Controller 2401: network link 2402: assembly 2403: assembly 2404: assembly 2405: assembly 2406: space 2407: assembly 2500, 2501, 2502, 2503, 2504: operation 2600, 2601, 2602, 2603: block 2700: Computer System 2701: Computer Network 2702: Memory or Memory Location 2703: Communication Interface 2704: Electronic Storage Unit 2705: Peripheral Device 2706: Processing Unit 2800: Electrochromic Device 2802: Substrate 2804: Transparent Conductive Layer (TCL) 2806 : Electrochromic Layer (EC) 2808: Ionically Conductive Layer or Region (IC) 2810: Counter Electrode Layer (CE) 2814: Second TCL 2816: Voltage Source 2820: Electrochromic Stack 2900: IGU 2904: First Pane 2906: Second pane 2908: Internal volume 3001: Cover 3002: Body 3003: DAE section 3004: DAE section 3005: DAE section 3051: Board/circuitry 3052: Circuitry/wiring 3053: Circuitry/wiring 3054: Circuit Board/Circuit System 3055: Routing 3056: Section 3057: Section 3101: Board Section 3102: Board 3103: Board Section 3201: Mast 3201a: First Position 3201b: Second Position 3202: Connector Cover 3203 :DAE Enclosure 3204: Cabling 3205: Wall Connector 3206: Mast Connector 3207: Cover 3208: Wall 3300: Front View 3301: Unpatterned Front Section 3302: Patterned Front Section 3303: Holes 3330: Front Perspective 3331: Jack 3360: Rear Perspective 3361: Jack 3363: Extension 3400: Front 3410: Transmitter 3450: Rear 3451: Cabling Connector 3452: Communication and/or Power Connector 3453: Controller 3454: Cabling Connector 3455: Geolocation Module 3456: Connector 3457: Audio Signal Transformer 3458: Power Transformer 3490: Perspective 3500: Front Cover 3501: Hole Pair 3520: Perspective 3530: Circuit Board 3531: Connector 3532 : Visible Light Sensor 3533: Power Supply 3534: Infrared Sensor 3535: Processor 3560: Rear Cover 3561: Hole Pair 3600: Front Cover 3602: Frame Part 3603: Device Set Housing 3604: Hole 3605: Hole 3620: Front Part 3621: snap pin 3622: rear section 3623: hole 3630: front cover/front section 3631: pin/rear section 3632: rear cover/hole 3636: arrow 3640: rear cover 3641: front cover 3642: opening 3730: frame 3731 : Intermediate body 3732: Frame cap 3733: Second cap part 3734: First cap part 3735: Shell 3736: Existing Frame Section 3750: Frame or Frame Cap Section 3751: End Section 3752: Second End Section/Second Zone 3753: First Zone 3755: Perforations 3756: Perforations 3757a, 3757b, 3757c, 3757d: Preformed Object 3758: Third Zone 3760: Shell 3770: Center of Gravity 3771: Gravity Vector S1: First Surface S2: Second Surface S3: First Surface S4: Second Surface

The novel features of the present invention are set forth in detail in the appended claims. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description and accompanying drawings (also "Fig./Figs." herein) illustrating illustrative embodiments utilizing the principles of the invention ,in:

[FIG. 1] A perspective view showing an enclosure with an associated control system;

[Fig. 2] schematically shows the control system architecture;

[FIG. 3] schematically depicts network nodes (eg, devices) disposed in various enclosures, such as floors of buildings;

[FIG. 4] shows a schematic example of sensor configuration and sensor data;

[FIG. 5] shows temperature-dependent changes to the sensor set during operation;

[FIG. 6] A schematic representation of the device, its components, and connectivity options;

[Fig. 7] schematically depicts a controller;

[FIG. 8] A schematic representation of digital architectural elements and associated components;

[FIG. 9] schematically shows various views and configurations of the assembly housing;

[FIG. 10A] and [FIG. 10B] schematically show various plan views showing a device set with a plurality of modules (eg, devices) on a printed circuit board section;

[FIG. 11A, FIG. 11B] and] FIG. 11C] schematically show various views of the capsule;

[FIG. 12A] and [FIG. 12B] schematically show various views of a capsule (eg, a collection shell);

[FIG. 13A] and [FIG. 13B] schematically show front views of the bladder portion;

[FIG. 14A] and [FIG. 14B] schematically show a light pipe and it is included in the balloon portion;

[FIG. 15A] schematically shows an exploded perspective view of a frame part mount for a bladder, and [FIG. 15B] schematically shows a top cross-section showing a frame part mount attached to a spline;

[FIG. 16A] and [FIG. 16B] schematically show various views of the top cover of a farming section (eg, a mullion or a horizontal frame);

[FIG. 17] Various perspective views schematically showing the bladder and mounting configurations;

[FIG. 18] A front view schematically depicting various capsules;

[FIG. 19A, FIG. 19B, FIG. 19C] and [FIG. 19D] depict various circuit system board parts;

[FIG. 20] schematically depicts the integration of electronic components and circuitry;

[FIG. 21] schematically shows the assembly architecture;

[FIG. 22] A representation schematically showing a coexistence matrix;

[FIG. 23] schematically depicts a controller architecture for managing the coexistence of modules;

[FIG. 24] schematically depicts a coexistence controller managing a plurality of sets (eg, capsules);

[FIG. 25] A flowchart showing a method for managing coexistence of modules (eg, devices);

[FIG. 26] A flowchart showing a method for assigning scheduling roles among interconnection set(s) and/or controller(s);

[FIG. 27] schematically depicts a processing system;

[ Fig. 28 ] An electrochromic device is schematically shown;

[FIG. 29] schematically shows a cross section of an integrated glass unit (IGU);

[FIG. 30A] to [FIG. 30B] schematically show various views of the device set housing and components;

[FIG. 31] schematically shows a front view and example functionality of a device set housing;

[FIG. 32] shows an example of a design set connected to a fixture via a mast;

[FIG. 33] schematically shows various views and configurations of the assembly housing;

[FIG. 34] schematically shows various plan views showing a device set with a plurality of modules (eg, devices) on a printed circuit board section;

[FIG. 35] schematically shows an exploded view and configuration of the assembly housing;

[FIG. 36A] to [FIG. 36D] schematically show various views and configurations of the assembly housing; and

[FIG. 37A] to [FIG. 37B] show various views of parts of the frame system.

The figures and components therein may not be drawn to scale. Various components of the figures described herein may not be drawn to scale.

800:Configuration

809: Display

811: port

813: Equalizer

817: Speaker

819: Microphone

821: Sensor/Connector

822: Connector

823: Connector

825: Wired or Wireless Communication

830: DAE

831: Double Arrow

832: Double Arrow

833: Double Arrow

834: Double Arrow

835: Double Arrow

836: Double Arrow

840: Processor

841: extranet

Claims (262)

A method for managing coexistence of devices, the method comprising: (A) generating a coexistence indicating any interference between each of a first plurality of devices disposed in an enclosure and each of a second plurality of devices disposed in the enclosure matrix; (B) using the coexistence matrix to control the operation of (a) at least one first device of the first plurality of devices and/or (b) at least one second device of the second plurality of devices; and (C) Using the at least one first device and/or the at least one second device to modify an environment of the enclosure. The method of claim 1, wherein the first plurality of devices are housed in a housing in which the second plurality of devices are housed. The method of claim 2, wherein the housing has at least one cross-section including an oblong cross-section or a rectangular cross-section. The method of claim 2, wherein the housing has a cover that snaps to an open body of the housing. The method of claim 2, wherein the housing comprises a mesh. The method of claim 2, wherein the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or an allotrope of elemental carbon. The method of claim 2, wherein the housing comprises a transparent or a non-transparent portion. The method of claim 2, wherein the shell includes a textured outer portion and a non-textured outer portion. The method of claim 8, wherein the textured portion comprises a pattern. The method of claim 9, wherein the pattern comprises space-filling polygons. 8. The method of claim 8, wherein the shell includes at least one aperture, at least a portion of the textured exterior. The method of claim 2, wherein the inside of the housing includes a heat sink or a partition. The method of claim 8, further comprising using the coexistence matrix to alter the interior of one of the enclosures. The method of claim 13, wherein the modification to the interior of the housing comprises (i) adding a heat sink; (ii) adding a spacer; or (iii) reconfiguring at least one of the first plurality of devices at least one second device of the first device and/or the second plurality of devices. The method of claim 1, wherein the first plurality of devices are disposed in a circuit board in which the second plurality of devices are disposed. The method of claim 1, wherein at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices is reversibly insertable into a circuit board, the circuit board The at least one first device and/or the at least one second device are disposed. The method of claim 1, wherein at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly extracted from a circuit board in which the circuit board is disposed There is the at least one first device and/or the at least one first device. The method of claim 1, wherein the first plurality of devices are disposed in a first sub-enclosure and wherein the second plurality of devices are disposed in a second sub-enclosure. The method of claim 18, wherein the first sub-enclosure is a first housing housing the first plurality of devices. The method of claim 18, wherein the second sub-enclosure is a second housing housing the second plurality of devices. The method of claim 18, wherein the enclosure is a facility. The method of claim 21, wherein the first sub-enclosure is a first room in the facility. The method of claim 21, wherein the second sub-enclosure is a second room in the facility. The method of claim 21, wherein the first sub-enclosure is a first floor in the facility. The method of claim 21, wherein the second sub-enclosure is a second floor in the facility. The method of claim 1, wherein the first plurality of devices are potential aggressor devices, and wherein the second plurality of devices are potential victim devices. The method of claim 1, wherein the any interference between a first device of the first plurality of devices and a second device of the second plurality of devices is indicated in a cell of the coexistence matrix. The method of claim 1, wherein the any interference indication between a first device of the first plurality of devices and a second device of the second plurality of devices is an interference potential. The method of claim 1, wherein the control of the environment of the enclosure is performed at least in part using at least one controller. The method of claim 29, wherein the at least one controller is part of a hierarchical control system. The method of claim 29, wherein the at least one controller is disposed in a circuit board in which the first plurality of devices and/or the second plurality of devices are disposed. The method of claim 1, wherein the coexistence matrix is used to control the first plurality of devices and/or the second plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold. The method of claim 32, wherein the threshold value comprises a value, a temporal dependency function, or a spatial dependency function. The method of claim 1, wherein the coexistence matrix is used to control any of the first plurality of devices and/or the second plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold any of the devices. The method of claim 1, wherein controlling the operation of the first plurality of devices and/or the second plurality of devices comprises controlling (i) at least one first device of the first plurality of devices and/or (ii) An operating mode of at least one second device of the second plurality of devices. The method of claim 35, wherein the mode of operation includes a timing of operations. The method of claim 35, wherein the mode of operation comprises (i) an off mode or (ii) an on mode. The method of claim 35, wherein the mode of operation comprises scheduling, locating or calibrating the at least one first device of the first plurality of devices and/or the at least one second device of the second plurality of devices. The method of claim 1, further comprising monitoring (i) at least one first device of the first plurality of devices and/or (ii) at least one second device of the second plurality of devices for any faults . The method of claim 1, further comprising alerting (i) at least one of the first plurality of devices using a control system communicatively coupled to the first plurality of devices and/or the second plurality of devices Any failure of a first device and/or (ii) at least one second device of the second plurality of devices. The method of claim 40, wherein the control system (i) provides for any detected failure of at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices an alert, and/or (ii) propose a solution to the failure. The method of claim 1, wherein the first plurality of devices includes a sensor and wherein the second plurality of devices includes a transmitter. The method of claim 1, wherein the first plurality of devices includes a sensor that senses an attribute, and wherein the second plurality of devices includes a transmitter that senses the attribute. The method of claim 43, wherein the attribute comprises light, temperature, sound, pressure, gas type, gas concentration, or gas velocity. A non-transitory computer program product for managing the coexistence of devices having recorded thereon instructions that, when executed by one or more processors, cause the one or more processors to perform operations, Include: (A) generating a coexistence indicating any interference between each of a first plurality of devices disposed in an enclosure and each of a second plurality of devices disposed in the enclosure matrix or guide the generation; (B) using the coexistence matrix to control the operation or direct the use of (a) at least one first device of the first plurality of devices and/or (b) at least one second device of the second plurality of devices ;as well as (C) Using the at least one first device and/or the at least one second device to modify an environment of the enclosure or to direct the modification. The non-transitory computer program product of claim 45, wherein the first plurality of devices are housed in a housing and the second plurality of devices are housed in the housing. The non-transitory computer program product of claim 46, wherein the housing has at least one cross-section including an oblong cross-section or a rectangular cross-section. The non-transitory computer program product of claim 46, wherein the casing has a cover that can be snapped to an open body of the casing. The non-transitory computer program product of claim 46, wherein the housing comprises a mesh. The non-transitory computer program product of claim 46, wherein the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or an allotrope of elemental carbon. The non-transitory computer program product of claim 46, wherein the housing comprises a transparent or a non-transparent portion. The non-transitory computer program product of claim 46, wherein the housing includes a textured outer portion and a non-textured outer portion. The non-transitory computer program product of claim 52, wherein the textured portion comprises a pattern. The non-transitory computer program product of claim 53, wherein the pattern comprises space-filling polygons. The non-transitory computer program product of claim 54, wherein the housing includes at least one aperture, at least a portion of the textured exterior. The non-transitory computer program product of claim 46, wherein the housing includes a heat sink or a partition inside. The non-transitory computer program product of claim 56, further comprising using the coexistence matrix to modify an interior of the housing. The non-transitory computer program product of claim 57, wherein the modification to the interior of the housing comprises (i) adding a heat sink; (ii) adding a partition; or (iii) reconfiguring the first plurality At least one first device of the devices and/or at least one second device of the second plurality of devices. The non-transitory computer program product of claim 45, wherein the first plurality of devices are disposed in a circuit board and the second plurality of devices are disposed in the circuit board. The method of claim 1, wherein at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices is reversibly insertable into a circuit board, the circuit board The at least one first device and/or the at least one second device are disposed. The non-transitory computer program product of claim 45, wherein at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly extracted from a circuit board, The at least one first device and/or the at least one first device is disposed in the circuit board. The non-transitory computer program product of claim 45, wherein the first plurality of devices are disposed in a first sub-enclosure and wherein the second plurality of devices are disposed in a second sub-enclosure. The non-transitory computer program product of claim 62, wherein the first sub-enclosure is a first housing housing the first plurality of devices. The non-transitory computer program product of claim 62, wherein the second sub-enclosure is a second housing housing the second plurality of devices. The non-transitory computer program product of claim 62, wherein the enclosure is a facility. The non-transitory computer program product of claim 65, wherein the first sub-enclosure is a first room in the facility. The non-transitory computer program product of claim 65, wherein the second sub-enclosure is a second room in the facility. The non-transitory computer program product of claim 65, wherein the first sub-enclosure is a first floor in the facility. The non-transitory computer program product of claim 65, wherein the second sub-enclosure is a second floor in the facility. The non-transitory computer program product of claim 45, wherein the first plurality of devices are potential aggressor devices, and wherein the second plurality of devices are potential victim devices. The non-transitory computer program product of claim 45, wherein a relationship between a first device of the first plurality of devices and a second device of the second plurality of devices is indicated in a cell of the coexistence matrix of any interference. The non-transitory computer program product of claim 45, wherein the any interference indication between a first device of the first plurality of devices and a second device of the second plurality of devices is an interference potential. The non-transitory computer program product of claim 45, wherein control of the environment of the enclosure is performed at least in part using at least one controller. The non-transitory computer program product of claim 73, wherein the at least one controller is part of a hierarchical control system. The non-transitory computer program product of claim 73, wherein the at least one controller is disposed in a circuit board in which the first plurality of devices and/or the second plurality of devices are disposed. The non-transitory computer program product of claim 45, wherein the coexistence matrix is used to control the first plurality of devices and/or the second plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold multiple devices. The non-transitory computer program product of claim 76, wherein the threshold value comprises a value, a temporal dependency function, or a spatial dependency function. The non-transitory computer program product of claim 45, wherein the coexistence matrix is used to control any of the first plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold value and/or or any of the second plurality of devices. The non-transitory computer program product of claim 45, wherein controlling the operation of the first plurality of devices and/or the second plurality of devices comprises controlling (i) at least one first device of the first plurality of devices and /or (ii) an operating mode of at least one second device of the second plurality of devices. The non-transitory computer program product of claim 79, wherein the mode of operation includes a sequence of operations. The non-transitory computer program product of claim 79, wherein the mode of operation comprises (i) an off mode or (ii) an on mode. The non-transitory computer program product of claim 79, wherein the mode of operation comprises scheduling, locating, or calibrating the at least one first device of the first plurality of devices and/or the at least one of the second plurality of devices a second device. The non-transitory computer program product of claim 45, further comprising monitoring (i) at least one first device of the first plurality of devices and/or (ii) at least one second device of the second plurality of devices Whether there is any fault with the device. The non-transitory computer program product of claim 45, further comprising using a control system communicatively coupled to the first plurality of devices and/or the second plurality of devices to alert (i) the first plurality of devices Any failure of at least one first device of the plurality of devices and/or (ii) at least one second device of the second plurality of devices. The non-transitory computer program product of claim 84, wherein the control system (i) provides any of the at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices An alert of a detected failure, and/or (ii) a proposed solution to the failure. The non-transitory computer program product of claim 45, wherein the first plurality of devices includes a sensor, and wherein the second plurality of devices includes a transmitter. The non-transitory computer program product of claim 45, wherein the first plurality of devices includes a sensor that senses an attribute and wherein the second plurality of devices includes a transmitter that senses the attribute. The non-transitory computer program product of claim 87, wherein the attribute comprises light, temperature, sound, pressure, gas type, gas concentration, or gas velocity. An apparatus for managing coexistence of devices, the apparatus comprising one or more controllers configured to: (A) generating a coexistence indicating any interference between each of a first plurality of devices disposed in an enclosure and each of a second plurality of devices disposed in the enclosure matrix or guide the generation; (B) using the coexistence matrix to control the operation or direct the use of (a) at least one first device of the first plurality of devices and/or (b) at least one second device of the second plurality of devices ;as well as (C) Using the at least one first device and/or the at least one second device to modify an environment of the enclosure or to direct the modification. The apparatus of claim 89, wherein the one or more controllers are coupled to the first plurality of devices and the second plurality of devices, and wherein the one or more controllers are configured to be based, at least in part, on the Any respective interference included in the coexistence matrix isolates the operation of the at least one first device from the operation of the at least one second device. The apparatus of claim 90, wherein the operation of the at least one first device and the operation of the at least one second device are isolated when the coexistence matrix includes an interference potential above a threshold. The apparatus of claim 90, wherein the coexistence matrix includes one or more cells characterizing an interference potential between the at least one first device and the at least one second device. The apparatus of claim 92, wherein a cell of the coexistence matrix provides a relative one representing interference between a first device of the at least one first device and a second device of the at least one second device At least one specification of sensitivity. The apparatus of claim 93, wherein the at least one designation includes a high designation and a low designation based on the relative sensitivity being above a threshold value or below the threshold value, respectively. The apparatus of claim 93, wherein the at least one designation includes a value characterizing the interference. The apparatus of claim 93, wherein the relative sensitivity is determined in response to a performance specification. The apparatus of claim 93, wherein the relative sensitivity is determined in response to an empirical evaluation. The apparatus of claim 90, wherein the isolation of the operation of the at least one first device and the at least one second device consists of: (i) a first operating time of the at least one first device and (ii) the at least one first device a second time of operation of a second device, wherein the first time is separated from the second time to prevent simultaneous operation of the at least one first device and the at least one second device. The apparatus of claim 90, wherein the at least one first device and the at least one second device are of the same type, wherein the first plurality of devices are in a first assembly, wherein the second plurality of devices are in a first In two assemblies, and wherein the isolation of the operation of the at least one first device and the at least one second device consists of the following: when the first assembly is above a distance threshold from the second assembly, by A physical distance interval generated when the one or more controllers activate the at least one first device and deactivate the at least one second device. The apparatus of claim 90, further comprising a housing, wherein the first plurality of devices are disposed in the housing. 91. The apparatus of claim 91, wherein the housing has at least one cross-section including an oblong cross-section or a rectangular cross-section. The apparatus of claim 91, wherein the housing has a cover that snaps to an open body of the housing. The apparatus of claim 91, wherein the housing comprises a mesh. 91. The apparatus of claim 91, wherein the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or an allotrope of elemental carbon. The apparatus of claim 91, wherein the housing comprises a transparent or a non-transparent portion. The apparatus of claim 91, wherein the housing includes a textured outer portion and a non-textured outer portion. The apparatus of claim 106, wherein the textured portion comprises a pattern. The apparatus of claim 107, wherein the pattern comprises space-filling polygons. The apparatus of claim 106, wherein the housing includes at least one aperture, at least a portion of the textured exterior. The apparatus of claim 91, wherein the interior of the housing includes a heat sink or a partition. The apparatus of claim 91, further comprising using the coexistence matrix to modify the interior of one of the housings. The apparatus of claim 111, wherein the modification to the interior of the housing comprises (i) adding a heat sink; (ii) adding a baffle; or (iii) reconfiguring at least one of the first plurality of devices The first device and/or at least one second device of the second plurality of devices. The apparatus of claim 89, wherein the first plurality of devices are disposed in a circuit board in which the second plurality of devices are disposed. 89. The apparatus of claim 89, wherein at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices is reversibly insertable into a circuit board in which The at least one first device and/or the at least one second device are disposed. The apparatus of claim 89, wherein at least one first device of the first plurality of devices and/or at least one second device of the second plurality of devices can be reversibly extracted from a circuit board in which the circuit board is disposed There is the at least one first device and/or the at least one first device. 89. The apparatus of claim 89, wherein the first plurality of devices are disposed in a first sub-enclosure and wherein the second plurality of devices are disposed in a second sub-enclosure. The apparatus of claim 116, wherein the first sub-enclosure is a first housing housing the first plurality of devices. The apparatus of claim 117, wherein the second sub-enclosure is a second housing housing the second plurality of devices. The apparatus of claim 118, wherein the enclosure is a facility. The apparatus of claim 119, wherein the first sub-enclosure is a first room in the facility. The apparatus of claim 120, wherein the second sub-enclosure is a second room in the facility. The apparatus of claim 119, wherein the first sub-enclosure is a first floor in the facility. The apparatus of claim 122, wherein the second sub-enclosure is a second floor in the facility. The apparatus of claim 89, wherein the first plurality of devices are potential aggressor devices, and wherein the second plurality of devices are potential victim devices. The apparatus of claim 89, wherein the any interference between a first device of the first plurality of devices and a second device of the second plurality of devices is indicated in a cell of the coexistence matrix. The apparatus of claim 89, wherein the any interference indication between a first device of the first plurality of devices and a second device of the second plurality of devices is an interference potential. The apparatus of claim 89, wherein the control of the environment of the enclosure is performed at least in part using at least one controller. The apparatus of claim 127, wherein the at least one controller is part of a hierarchical control system. The apparatus of claim 127, wherein the at least one controller is disposed in a circuit board in which the first plurality of devices and/or the second plurality of devices are disposed. The apparatus of claim 89, wherein the coexistence matrix is used to control the first plurality of devices and/or the second plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold. The apparatus of claim 130, wherein the threshold value comprises a value, a temporal dependency function, or a spatial dependency function. The apparatus of claim 89, wherein the one or more controllers are configured to utilize the coexistence matrix to control the first plurality of devices indicated in the coexistence matrix as having an interference potential above a threshold any of the devices and/or any of the second plurality of devices. The apparatus of claim 89, wherein the one or more controllers are configured to control (i) at least one first device of the first plurality of devices and/or (ii) the second device, at least in part, by The operation mode of at least one second device of the plurality of devices controls the operation of the first plurality of devices and/or the second plurality of devices. The apparatus of claim 133, wherein the mode of operation includes a timing of operations. The apparatus of claim 134, wherein the mode of operation comprises (i) an off mode or (ii) an on mode. The apparatus of claim 134, wherein the mode of operation comprises scheduling, locating or calibrating the at least one first device of the first plurality of devices and/or the at least one second device of the second plurality of devices. The apparatus of claim 89, wherein the one or more controllers are configured to monitor (i) at least one of the first plurality of devices and/or (ii) one of the second plurality of devices Whether there is any failure of at least one second device or to direct this monitoring. The apparatus of claim 89, wherein the one or more controllers are configured to alert (i) at least one of the first plurality of devices and/or (ii) at least one of the second plurality of devices Any malfunction of a second device or directs the alert. The apparatus of claim 138, wherein the one or more controllers are configured to (i) provide at least one first device of the first plurality of devices and/or at least one second of the second plurality of devices An alert or guidance to the provision of any detected failure of the device, and/or (ii) a proposal for a solution to the failure or guidance to the proposal. The apparatus of claim 89, wherein the first plurality of devices includes a sensor and wherein the second plurality of devices includes a transmitter. The apparatus of claim 89, wherein the first plurality of devices includes a sensor that senses an attribute, and wherein the second plurality of devices includes a transmitter that senses the attribute. The apparatus of claim 141, wherein the attribute comprises light, temperature, sound, pressure, gas type, gas concentration, or gas velocity. The apparatus of claim 89, wherein the one or more controllers are configured to utilize a control scheme comprising a feedback, a feedforward, a closed loop, or an open loop control scheme. The apparatus of claim 89, wherein the one or more controllers comprise one controller configured to control at least two of (A), (B) and (C). The apparatus of claim 89, wherein the one or more controllers include a first controller and a second controller, and wherein the first controller is configured to control (A), Different operations of (B) and (C). A device for altering the environment of an enclosure, the device comprising: a plurality of devices including a sensor configured to sense an environmental property of the enclosure; a circuit board to which the plurality of devices are coupled, the circuit board configured to be operably coupled to at least one control configured to alter the environment using at least one of the plurality of devices device; and a housing having an open body and a lid configured to cover an opening of the open body, the housing configured to enclose (a) the plurality of devices and (b) at least a portion of the circuit board , the cover has a textured portion at an exterior of the cover, the textured portion surrounding at least one hole in the cover, the at least one hole configured to have the cover when the housing is covered by the cover during operation Helps to sense the environmental property by the sensor. The apparatus of claim 146, wherein at least one of the plurality of devices is configured to be reversibly coupled to the circuit board. The apparatus of claim 147, wherein the reversible coupling of the at least one device comprises reversible insertion of the at least one device to the circuit board, or reversible extraction of the at least one device from the circuit board. The apparatus of claim 146, wherein the circuit board is configured to facilitate reversible coupling of at least one of the plurality of devices. The apparatus of claim 146, wherein the interior of the housing includes a heat sink or a baffle. The apparatus of claim 146, wherein the circuit board includes a heat sink or a hole configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation. The apparatus of claim 146, wherein the housing has at least one cross-section including an oblong cross-section or a rectangular cross-section. The apparatus of claim 146, wherein the cover is configured to snap to the open body of the housing to close the housing. The apparatus of claim 146, wherein the textured portion comprises a mesh or a braid. The apparatus of claim 146, wherein the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or an allotrope of elemental carbon. The apparatus of claim 146, wherein the housing comprises a transparent or a non-transparent portion. The apparatus of claim 146, wherein the cover includes a non-textured outer portion. The apparatus of claim 157, wherein the textured portion comprises a pattern. The apparatus of claim 158, wherein the pattern comprises space-filling polygons. The apparatus of claim 146, wherein the housing is configured to fit onto or into at least a portion of a fixture of the enclosure. The apparatus of claim 160, wherein the housing is configured to attach to a support structure. The apparatus of claim 161, wherein the support structure comprises a mast, a pole or a frame. The apparatus of claim 160, wherein the fixture comprises a wall, a ceiling or a frame. The apparatus of claim 163, wherein the frame is a window frame or a door frame. An apparatus for modifying an environment of an enclosure, the apparatus comprising at least one controller having a circuit system, the at least one controller individually or collectively configured to: (A) communicatively coupled to a plurality of devices including a sensor configured to sense an environmental property of the enclosure, the plurality of devices coupled to a device at least partially enclosed in a housing A circuit board having the housing (a) configured to enclose the plurality of devices and (b) having an open body and a cover configured to cover an opening of the open body, the cover over one of the covers having a textured portion at the exterior surrounding at least one hole in the cover, the at least one hole configured to facilitate passage of the sensor when the housing is covered by the cover during operation sensing the environmental attribute; and (B) modifying the environment or directing the modification using at least one of the plurality of devices. The apparatus of claim 165, wherein at least one of the plurality of devices is configured to be reversibly coupled to the circuit board. The apparatus of claim 166, wherein the reversible coupling of the at least one device comprises reversible insertion of the at least one device to the circuit board, or reversible extraction of the at least one device from the circuit board. The apparatus of claim 165, wherein the circuit board is configured to facilitate reversible coupling of at least one of the plurality of devices. The apparatus of claim 165, wherein the interior of the housing includes a heat sink or a baffle. The apparatus of claim 165, wherein the circuit board includes a heat sink or a hole configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation. The apparatus of claim 165, wherein the housing is configured to provide at least one cross-section including an oblong cross-section or a rectangular cross-section. The apparatus of claim 165, wherein the cover is configured to snap to the open body of the housing to close the housing. The apparatus of claim 165, wherein the textured portion is configured as a mesh or a weave. The apparatus of claim 165, wherein the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or an allotrope of elemental carbon. The apparatus of claim 165, wherein the housing comprises a transparent or a non-transparent portion. The apparatus of claim 165, wherein the cover is configured to provide a non-textured outer portion. The apparatus of claim 176, wherein the textured portion is configured to provide a pattern. The apparatus of claim 177, wherein the pattern is configured to include space-filling polygons. The apparatus of claim 165, wherein the housing is configured to fit onto or into at least a portion of a fixture of the enclosure. The apparatus of claim 179, wherein the housing is configured to attach to a support structure. The apparatus of claim 180, wherein the support structure comprises a mast, a pole or a frame. The apparatus of claim 179, wherein the fixture comprises a wall, a ceiling or a frame. The apparatus of claim 182, wherein the frame is a window frame or a door frame. The apparatus of claim 165, wherein the housing encloses (i) a processor, (ii) memory, and/or (iii) at least one network component configured to receive and/or transmit network communications. The apparatus of claim 184, wherein the processor and/or at least one network component are configured to be coupled to a network coupled to the devices. The apparatus of claim 184, wherein the circuit board is a first circuit board, and wherein the processor and/or at least one network component are disposed in a second circuit board. The apparatus of claim 186, wherein the second circuit board is separate from the first circuit board. The apparatus of claim 187, wherein the separation of the first circuit board and the second circuit board facilitates cooling of heat dissipated from the first circuit board and/or the second circuit board. The apparatus of claim 165, wherein the separation of the first circuit board and the second circuit board facilitates active and/or passive gas flow. The apparatus of claim 189, wherein the second circuit board is separated from the first circuit board by a shield, heat sink, cooler and/or gas. The apparatus of claim 190, wherein the heat sink and/or the cooler are active. The apparatus of claim 190, wherein the heat sink and/or the cooler are passive. The apparatus of claim 184, further comprising at least one controller configured to process information related to the plurality of devices using the processor and/or at least one network component. The apparatus of claim 184, further comprising at least one controller configured to utilize the processor and/or at least one network component to process information unrelated to the plurality of devices. The apparatus of claim 184, further comprising at least one controller configured to manage power allocated to at least one of the plurality of devices. The apparatus of claim 184, further comprising at least one controller configured to distribute power allocated to at least two of the plurality of devices sequentially or in parallel. The apparatus of claim 184, further comprising at least one controller configured to evenly or unevenly distribute power allocated to at least two of the plurality of devices. A method for altering an environment of an enclosure, the method comprising: (A) providing a housing having an open body and a cover configured to cover an opening of the open body; (B) enclosing a plurality of devices in the housing, the plurality of devices including a sensor configured to sense an environmental property of the enclosure; (C) enclosing at least a portion of a circuit board in the housing, the plurality of devices coupled to the circuit board, the circuit board configured to be operably coupled to use at least one of the plurality of devices a change at least one controller of the environment of the enclosure; (D) providing a textured portion at an exterior of the lid, the textured portion surrounding at least one aperture in the lid, the at least one aperture configured to have a textured portion when the housing is covered by the lid during operation facilitating sensing of the environmental property by the sensor; and (E) modifying the environment using at least one of the plurality of devices. The method of claim 198, further comprising reversibly coupling at least one device of the plurality of devices to the circuit board. The method of claim 199, wherein the reversible coupling of the at least one device comprises reversibly inserting the at least one device into the circuit board, or reversibly extracting the at least one device from the circuit board. The method of claim 198, further comprising configuring the circuit board to facilitate reversible coupling of at least one of the plurality of devices. The method of claim 198, wherein the interior of the housing includes a heat sink or a baffle. The method of claim 198, wherein the circuit board includes a heat sink or a hole configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation. The method of claim 198, wherein the housing includes at least one cross-section including an oblong cross-section or a rectangular cross-section. As in the method of claim 198, snapping the cover closes the body of the housing. The method of claim 198, wherein the textured portion comprises a mesh or a braid. The method of claim 198, wherein the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or an allotrope of elemental carbon. The method of claim 198, wherein the housing includes a transparent or a non-transparent portion. The method of claim 198, wherein the cover is used to provide a non-textured outer portion. The method of claim 209, wherein the textured portion comprises a pattern. The method of claim 210, wherein the pattern comprises space-filling polygons. The method of claim 198, further comprising fitting onto or into at least a portion of a fastener of the enclosure. The method of claim 212, further comprising attaching the housing to a support structure. The method of claim 213, wherein the support structure comprises a mast, a pole or a frame. The method of claim 212, wherein the fixture comprises a wall, a ceiling or a frame. The method of claim 215, wherein the frame is a window frame or a door frame. The method of claim 199, wherein the housing encloses (i) a processor, (ii) memory, and/or (iii) at least one network component configured to receive and/or transmit network communications. The method of claim 217, further comprising using the processor and/or at least one network component to process information related to the plurality of devices. The method of claim 217, further comprising using the processor and/or at least one network component to process information unrelated to the plurality of devices. The method of claim 217, further comprising managing power allocated to at least one of the plurality of devices. The method of claim 217, further comprising distributing power allocated to at least two of the plurality of devices sequentially or in parallel. The method of claim 217, further comprising distributing the power allocated to at least two of the plurality of devices evenly or unevenly. The method of claim 217, wherein the circuit board is a first circuit board, and wherein the processor and/or at least one network component are disposed in a second circuit board. The method of claim 223, wherein the second circuit board is separated from the first circuit board. The method of claim 224, further comprising cooling heat dissipated from the first circuit board and/or the second circuit board. The method of claim 199, wherein the cooling is performed using active and/or passive gas flow. The method of claim 226, wherein the cooling is performed by using a shroud, heat sink, cooler and/or gas. The method of claim 227, wherein the heat sink and/or the cooler are active. The method of claim 227, wherein the heat sink and/or the cooler are passive. A non-transitory computer program product for modifying an environment of an enclosure, the non-transitory computer program product having recorded thereon instructions that, when executed by one or more processors, cause the one or more processors Perform actions, including: (A) Sensing or directing the sensing of an environmental property of the enclosure by means of a sensor included in a plurality of devices operably coupled to a circuit board, the plurality of devices and the circuit board at least a portion of which is enclosed in a housing having an open body and a lid configured to cover an opening of the open body, the lid having a textured portion at an exterior of the lid, the textured portion surrounding at least one hole in the cover configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation; and (B) modifying the environment or directing the modification using at least one of the plurality of devices. The non-transitory computer program product of claim 230, wherein at least one device of the plurality of devices is configured to be reversibly coupled to the circuit board. The non-transitory computer program product of claim 231, wherein the reversible coupling of the at least one device comprises reversible insertion of the at least one device to the circuit board, or reversible extraction of the at least one device from the circuit board. The non-transitory computer program product of claim 230, wherein the circuit board is configured to facilitate reversible coupling of at least one of the plurality of devices. The non-transitory computer program product of claim 230, wherein the housing includes a heat sink or a partition inside. The non-transitory computer program product of claim 230, wherein the circuit board includes heat dissipation configured to facilitate sensing of the environmental property by the sensor when the housing is covered by the cover during operation piece or a hole. The non-transitory computer program product of claim 230, wherein the housing is configured to provide at least one cross-section including an oblong cross-section or a rectangular cross-section. The non-transitory computer program product of claim 230, wherein the cover is configured to snap to the open body of the housing to close the housing. The non-transitory computer program product of claim 230, wherein the textured portion is configured as a mesh or a weave. The non-transitory computer program product of claim 230, wherein the housing comprises a polymer, resin, glass, ceramic, elemental metal, metal alloy, ceramic, or an allotrope of elemental carbon. The non-transitory computer program product of claim 230, wherein the housing includes a transparent or a non-transparent portion. The non-transitory computer program product of claim 230, wherein the cover is configured to provide a non-textured outer portion. The non-transitory computer program product of claim 230, wherein the textured portion is configured to provide a pattern. The non-transitory computer program product of claim 230, wherein the pattern is configured to include space-filling polygons. The non-transitory computer program product of claim 230, wherein the housing is configured to fit onto or into at least a portion of a fastener of the enclosure. The non-transitory computer program product of claim 244, wherein the housing is configured to be attached to a support structure. The non-transitory computer program product of claim 245, wherein the support structure comprises a mast, a pole or a frame. The non-transitory computer program product of claim 246, wherein the fixture comprises a wall, a ceiling, or a frame. The non-transitory computer program product of claim 247, wherein the frame is a window frame or a door frame. The non-transitory computer program product of claim 230, wherein the housing encloses (i) a processor, (ii) memory, and/or (iii) at least one configured to receive and/or transmit network communications A network component. The non-transitory computer program product of claim 249, wherein the processor and/or at least one network component are configured to be coupled to a network coupled to the devices. The non-transitory computer program product of claim 249, wherein the circuit board is a first circuit board, and wherein the processor and/or at least one network component are disposed in a second circuit board. The non-transitory computer program product of claim 251, wherein the second circuit board is separate from the first circuit board. The non-transitory computer program product of claim 252, wherein the separation of the first circuit board and the second circuit board facilitates cooling of heat dissipated from the first circuit board and/or the second circuit board. The non-transitory computer program product of claim 230, wherein the separation of the first circuit board and the second circuit board facilitates active and/or passive gas flow. The non-transitory computer program product of claim 252, wherein the second circuit board is separated from the first circuit board by a shield, heat sink, cooler and/or gas. The non-transitory computer program product of claim 255, wherein the heat sink and/or the cooler are active. The non-transitory computer program product of claim 255, wherein the heat sink and/or the cooler are passive. The non-transitory computer program product of claim 249, wherein the operations further comprise using the processor and/or at least one network component to process information related to the plurality of devices. The non-transitory computer program product of claim 249, wherein the operations further comprise using the processor and/or at least one network component to process information unrelated to the plurality of devices. The non-transitory computer program product of claim 249, wherein the operations further comprise managing power allocated to at least one of the plurality of devices. The non-transitory computer program product of claim 249, wherein the operations further comprise distributing, sequentially or in parallel, power allocated to at least two of the plurality of devices. The non-transitory computer program product of claim 249, wherein the operations further comprise evenly or unevenly distributing power allocated to at least two of the plurality of devices.

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