TW202210666A - Single crystal manufacturing apparatus and single crystal manufacturing method - Google Patents

Abstract

To improve gap measurement accuracy by means of a fusion ring method. A single crystal manufacturing apparatus 10, includes: a single crystal pulling part, for pulling a single crystal 15 from melt 13; an arithmetic part 23, for processing a image photographed by a camera 18; and a control part 26, for controlling crystal pulling conditions based on processed results of the arithmetic part 23. The arithmetic part 24, includes: a 1st arithmetic part 24, for calculating a 1st gap measurement value between a lower end of a heat shield member and a melt surface based on sizes of an opening real image of the heat shield member photographed by the camera 18 and an opening mirror image of a heat shield member 17 projected on the melt surface; and a 2nd arithmetic part 25, for relatively calculating a 2nd gap measurement value between the lower end of the heat shield member 17 and the melt surface based on a change amount in the height direction of a crystal central position, found by using a fusion ring occurring in boundaries between the single crystal and the melt, which appears on an image photographed by the camera 18. The 2nd arithmetic part 25, corrects the 2nd gap measurement value by using a previously prepared correction quantity table.

Description

Single crystal production apparatus and single crystal production method

The present invention relates to an apparatus for producing a single crystal and a method for producing a single crystal, and in particular, relates to a method for measuring the position of the melt surface in the single crystal pulling step of the Tchaikolaski method (CZ method).

Most of the single crystal silicon used as the substrate material of the semiconductor element is produced by the CZ method. In the CZ method, the seed crystal is immersed in the silicon melt contained in the quartz crucible. While the seed crystal and the quartz crucible are rotated, the seed crystal is slowly pulled up to grow a large-diameter single crystal under the seed crystal. According to the CZ method, high-quality single-crystal silicon ingots can be produced with high yields.

It is well known that the type or distribution of defects contained in single crystal silicon grown by the CZ method depends on the ratio V/G of the crystal pulling speed V and the intracrystalline temperature gradient G in the crystal pulling direction. When V/G is large, the voids are excessive, and the voids of the aggregates are generated. The void is a crystal defect generally called COP (Crystal Originated Particle). On the other hand, when V/G is small, there is an excess of silicon atoms in the lattice, and dislocation clusters of aggregates are generated. In order to grow single crystal silicon that does not contain Grown-in defects such as COP or dislocation clusters, V/G must be strictly controlled.

Even if the V/G pull-up is controlled for single-crystal silicon that does not contain COP or dislocation clusters, it contains a plurality of regions whose crystal quality is not necessarily homogeneous and behaves differently during heat treatment. For example, between the region where COP occurs and the region where dislocation clusters occur, there are three regions called OSF region, Pv region, and Pi region in order from the higher V/G.

The so-called OSF region contains plate-shaped oxygen precipitates (OSF cores) in the as-grown state (the state in which no heat treatment is performed after single crystal growth), and OSF ( Oxidation induced Stacking Fault area. The Pv region is a region where oxygen precipitates are likely to be generated when a two-stage heat treatment at low temperature and high temperature (eg, 800°C to 1000°C) is performed, including oxygen deposition nuclei in the as-grown state. The so-called Pi region is a region that hardly contains oxygen precipitates in the as-grown state, and hardly generates oxygen precipitates even if heat treatment is performed.

In the growth of high-content single crystal silicon (PvPi crystal) that separates the Pv region and the Pi region, it is necessary to control the V/G more precisely.

The V/G of the single crystal in the pulling axis direction is very large depending on the pulling speed V of the single crystal. Therefore, the V/G control in the pulling axis direction is carried out by adjusting the crystal pulling speed V. On the other hand, the V/G of the single crystal in the radial direction is greatly dependent on the temperature gradient G in the radial direction of the single crystal. Therefore, in order to control the difference between the temperature gradient G of the central portion of the single crystal and the temperature gradient G of the outer peripheral portion within a predetermined range, it is necessary to construct an appropriate hot zone in the cell. The temperature gradient G of the single crystal in the radial direction is controlled by the heat shielding member disposed above the silicon melt, whereby an appropriate hot zone can be constructed near the solid-liquid interface.

As described above, the control of V/G is mainly carried out by adjusting the crystal pulling speed V. In addition, it is known that the temperature gradient G in the crystal is greatly influenced by the distance (gap) from the lower end of the heat shielding member provided above the silicon melt to the melt surface. In order to control V/G with high accuracy, the distance between the heat shielding member and the melt surface is required to be kept constant.

On the other hand, in the CZ method, as the pulling of the single crystal proceeds, the liquid level position decreases due to the consumption of the silicon melt. In order to keep the distance between the heat shield member and the melt level constant, the liquid level position must be controlled so that the quartz Crucible rises. Therefore, the liquid level position must be measured correctly.

As described above, in order to precisely control the gap, precise measurement of the melt level position as seen from the heat shielding member is essential. Regarding the measurement method of the molten liquid level position, for example, the method described in Patent Document 1 sets the silicon molten liquid level position based on the real image and the mirror image of the heat shielding member. For example, when the single crystal silicon moves to the straight cylindrical portion, according to the The position of the liquid surface of the silicon melt is calculated from the center position of the single crystal silicon obtained from the image of the melt ring generated in the boundary between the silicon melt and the single crystal silicon. [Prior Technology Literature] [Patent Literature]

[Patent Document 1] Patent Publication No. 2012-126585

[Problems to be solved by the invention]

As described above, as a method of measuring the liquid level position, two methods called "mirror method" and "melt ring method" are known. The mirror image method is a method of geometrically calculating the position of the liquid surface according to the size of the real image of the heat shielding member reflected in the image captured by the camera and the mirror image of the heat shielding member projected on the molten liquid surface. In addition, the molten ring method (hereinafter, referred to as the "F-ring method") is based on a slightly annular high-brightness region (melt ring) generated on the boundary between the single crystal and the melt in the image captured by the camera when shooting the inside of the furnace. The method of calculating the amount of change in the position of the liquid surface by the amount of change in the coordinates.

However, the F-ring method has problems in that the gap measurement accuracy is low and the gap measurement error increases as the crystal grows. Since such a gap measurement error is associated with a quality assurance problem of single crystal silicon, improvement is required.

Therefore, an object of the present invention is to provide a single crystal manufacturing apparatus and a single crystal manufacturing method which can improve the gap measurement accuracy of the F-ring method. [means to solve the problem]

The inventors of the present application, as a result of intensive research on the cause of the deterioration of the gap measurement accuracy by the F-ring method, have found that the change in the height position of the heat shielding member due to thermal expansion is the cause. In particular, when installed at the upper end of the furnace structure composed of a plurality of furnace components, the vertical position of the furnace structure tends to change due to the thermal expansion of the furnace structure. Here, in the gap measurement by the mirror image method, in order to directly capture the real image and the mirror image of the heat shield member to obtain these height positions, the gap reflecting the vertical movement of the heat shield member may be measured. However, in principle, the F-ring method is used to obtain the relative height position of the molten liquid surface, because the gap measurement value obtained at a certain time by other methods such as the mirror method is used as a reference, and the reference value through this gap is added to the liquid surface position. When the relative change amount is obtained, an accurate gap measurement value cannot be obtained when the reference value of the gap changes due to the vertical movement of the heat shielding member due to thermal expansion. That is, the gap measurement accuracy of the F-ring method deteriorates even by the mirror image method.

The present invention is based on such technical findings, and the single crystal production apparatus of the present invention is characterized by comprising: a single crystal pulling part for pulling a single crystal from a molten liquid in a crucible; and a heat shield member provided above the molten liquid a camera for photographing the boundary between the melt and the single crystal from obliquely above; an arithmetic unit for processing the image captured by the camera; and a control unit for controlling crystal pulling conditions according to the processing result of the arithmetic unit Above-mentioned computing part has: the 1st computing part, according to the size of the above-mentioned heat-shielding member opening mirror image projected on the above-mentioned heat-shielding member opening real image and molten liquid surface reflected in the photographed image of the above-mentioned camera, calculates the above-mentioned heat-shielding member lower end and above-mentioned a first measured value of the gap between the molten liquid surfaces; and a second calculation unit based on the amount of change in the height direction of the crystal center position obtained from the image captured by the camera, reflecting the molten ring generated on the boundary between the single crystal and the molten liquid, The second gap measurement value between the lower end of the heat shielding member and the molten liquid surface is relatively calculated, and the second calculation unit corrects the second gap measurement value using a gap correction scale prepared in advance.

According to the present invention, the change in the height position of the heat shielding member due to the influence of thermal expansion in the F-ring method can be considered, whereby precise clearance control can be realized.

In the present invention, the control unit starts the crystal pulling step while controlling the crystal pulling conditions based on the first gap measurement value, and preferably starts the crystal pulling step based on the first gap measurement value. The gap control of is converted to the gap control based on the above-mentioned 2nd gap measurement value. According to the present invention, even when the gap control by the mirror method is switched to the gap control by the F-ring method, it is possible to prevent the gap measurement accuracy from being lowered.

The control unit preferably switches from the gap control based on the first gap measurement value to when the first gap measurement value is abnormal or the first gap measurement value cannot be measured during the step of growing the straight cylindrical portion of the single crystal. Gap control based on the above-mentioned second gap measurement value. In addition, when no abnormality occurs in the first gap measurement value in the middle of the step of growing the straight cylindrical portion of the single crystal, it is desirable to continue the gap control based on the first gap measurement value. In this way, according to the present invention, the F-ring method can be used as a backup means of the mirror-image method, and even when the gap control by the mirror-image method is switched to the gap control by the F-ring method, the gap measurement accuracy can be prevented from being lowered.

The control unit preferably controls the rising speed of the crucible in order to bring the first gap measurement value or the corrected second gap measurement value closer to a target value. In this way, the gap measurement value according to the mirror method is used as it is, and the gap measurement value according to the F-ring method is used in the gap control after adding the gap correction amount, even if the gap control according to the mirror method is switched to Even in the case of gap control by the F-ring method, it is possible to prevent a drop in gap measurement accuracy.

The calculation unit preferably creates the gap correction scale based on the difference between the first gap measurement value and the second gap measurement value measured in the past pulling batches. The difference between the measured first gap measurement value and the second gap measurement value measured is used to create the gap correction amount table. In this way, according to the present invention, from the difference between the gap measurement value of the mirror method, which is not affected by the change in the position of the heat shielding member obtained from the same captured image, and the gap measurement value of the F-ring method, which is affected by the change of the position of the heat shielding member, it is possible to create Gap correction amount.

It is preferable that the said calculating part creates the said gap correction amount table based on the average value of the difference of the said 1st gap measurement value and the said 2nd gap measurement value measured in the past plural pulling batches. Thereby, the measurement deviation per pulling batch is averaged, and the gap correction amount with high reliability can be calculated|required.

In addition, the method for producing a single crystal of the present invention includes controlling the gap between the lower end of the heat shielding member provided above the molten liquid and the molten liquid surface around the single crystal pulled from the molten liquid in the crucible, and pulling the above-mentioned molten liquid. A method for producing a single crystal of a single crystal by the Tchaikolaski method (CZ method), characterized in that the heat shielding member is projected on the surface of the molten liquid based on the real image of the opening of the heat shielding member reflected from the image captured by the camera. The measured value of the first gap calculated from the size of the opening mirror image, the above-mentioned gap is controlled, and the above-mentioned crystal pulling step is started. After the above-mentioned crystal pulling step is started, it is converted into the above-mentioned single crystal and the above-mentioned fusion according to the image captured by the above-mentioned camera. The gap control of the second gap measurement value calculated from the change in the height direction of the crystal center position obtained from the melt ring generated at the liquid boundary, and the gap control based on the above-mentioned second gap measurement value, using the gap correction scale prepared in advance to correct the above For the second gap measurement value, the crystal pulling conditions are controlled so that the corrected second gap measurement value is close to the target value.

According to the present invention, the change in the height position of the heat shielding member due to the influence of thermal expansion in the F-ring method can be considered, whereby precise clearance control can be realized.

In the method for producing a single crystal of the present invention, in the middle of the crystal pulling step, when an abnormality occurs in the first gap measurement value or when the first gap measurement value cannot be measured, it is preferable to control the gap based on the first gap measurement value. Switch to gap control based on the above-mentioned second gap measurement value. In addition, when no abnormality occurs in the first gap measurement value in the middle of the step of growing the straight cylindrical portion of the single crystal, it is desirable to continue the gap control based on the first gap measurement value. In this way, according to the present invention, the F-ring method can be used as a backup means of the mirror-image method, and even when the gap control by the mirror-image method is switched to the gap control by the F-ring method, the gap measurement accuracy can be prevented from being lowered.

In the crystal pulling step, in order to bring the first gap measurement value or the corrected second gap measurement value close to the target value, it is desirable to control the rising speed of the crucible. In this way, the gap measurement value according to the mirror method is used as it is, and the gap measurement value according to the F-ring method is used in the gap control after adding the gap correction amount, even if the gap control according to the mirror method is switched to Even in the case of gap control by the F-ring method, it is possible to prevent a drop in gap measurement accuracy.

In the method for producing a single crystal of the present invention, it is desirable to create the gap correction scale based on the difference between the first gap measurement value and the second gap measurement value measured in the past pulling batches, and it is particularly desirable to use the difference between the first gap measurement value and the second gap measurement value measured in the past pulling batches. The difference of the said 1st gap measurement value and the said 2nd gap measurement value measured in a pulling batch is made into the said gap correction scale table. In this way, according to the present invention, from the difference between the gap measurement value of the mirror method, which is not affected by the change in the position of the heat shielding member obtained from the same captured image, and the gap measurement value of the F-ring method, which is affected by the change of the position of the heat shielding member, it is possible to create Gap correction amount.

In the method for producing a single crystal of the present invention, it is desirable to create the gap correction scale based on the average value of the difference between the first gap measurement value and the second gap measurement value measured in a plurality of pulling batches in the past. Thereby, the measurement deviation per pulling batch is averaged, and the gap correction amount with high reliability can be calculated|required.

Furthermore, the method for producing a single crystal of the present invention is to pull the single crystal while measuring the gap between the lower end of the heat shield member provided above the molten liquid and the molten liquid surface around the single crystal pulled from the molten liquid. The manufacturing method of the single crystal of the Tchaikovsky method (CZ method) is characterized in that: using the real image of the heat shielding member reflected in the image captured by the camera when shooting the inside of the furnace and the heat shield projected on the molten liquid surface. The mirror image method of calculating the liquid level position by the mirror geometry of the component, calculate the first gap measurement value, control the gap according to the first gap measurement value, and start the crystal pulling step at the same time. The amount of change in the center coordinates of the molten ring generated on the boundary between the single crystal and the molten liquid is calculated by using the F-ring method for calculating the amount of change in the liquid level position, and the second gap measurement value is calculated. When the measured value is abnormal or when the measurement of the first gap cannot be measured, the gap control based on the measured value of the first gap is switched to the gap control based on the measured value of the second gap using the F-ring method. In the gap control of the measured value, the above-mentioned second gap measured value is corrected using a gap correction scale prepared in advance, and the crystal pulling conditions are controlled so that the corrected second gap measured value is close to the target value.

According to the present invention, the change in the height position of the heat shielding member due to the influence of thermal expansion in the F-ring method can be considered, whereby precise clearance control can be realized. [Inventive effect]

According to the present invention, it is possible to provide a single crystal manufacturing apparatus and a single crystal manufacturing method which can improve the gap measurement accuracy of the F-ring method.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, the embodiments shown below are specifically described in order to better understand the gist of the invention, and do not limit the invention unless otherwise specified. In addition, in the drawings used in the following description, in order to facilitate understanding of the characteristics of the present invention, the main part may be enlarged and shown for convenience, and the dimensional ratio of each component is not necessarily the same as the actual one.

FIG. 1 is a schematic cross-sectional view showing the structure of a single crystal production apparatus according to an embodiment of the present invention.

As shown in FIG. 1 , a single crystal production apparatus 10 is an apparatus for growing single crystal silicon, and includes a substantially cylindrical chamber 19 , and a quartz crucible 11 for storing a molten liquid 13 is provided inside the chamber 19 . The cell 19 may have, for example, a double-walled structure with a certain space formed therein. When the quartz crucible 11 is heated by flowing cooling water to the space, the cell 19 is prevented from becoming high temperature.

Inside such a cell 19, an inert gas such as argon is introduced from before to after the pulling of the single crystal silicon is started. The top of the chamber 19 includes the pulling drive device 22 . The pulling drive device 22 pulls upward while rotating the seed crystal 14 serving as the growth nucleus of the single crystal silicon ingot 15 and the single crystal silicon ingot 15 grown therefrom. In such a pulling drive device 22 , a sensor (not shown) for sending crystal growth information of the single crystal silicon ingot 15 according to the pulling amount of the single crystal silicon ingot 15 may be formed. The pull-up driving device 22 is connected to the control unit 26 and transmits crystal growth information to the control unit 26 . In the present embodiment, the components in the cell 19 such as the quartz crucible 11 and the pulling drive device 22 constitute a single crystal pulling part.

The interior of the cell 19 includes a substantially cylindrical heater 12 arranged around the quartz crucible 11 . The heater 12 heats the quartz crucible 11 . Inside the heater 12, the crucible support (black lead crucible) 16 and the quartz crucible 11 are accommodated. The quartz crucible 11 is integrally formed with quartz as a whole, and a substantially cylindrical container with an open surface is formed above.

In the quartz crucible 11, a silicon melt 13 for melting solid silicon is stored. The crucible support body 16 is formed of, for example, black lead as a whole, and is closely supported by surrounding the quartz crucible 11 . The crucible support 16 maintains the shape of the quartz crucible 11 softened when silicon is melted, and plays a role of supporting the quartz crucible 11 .

The lower side of the crucible support body 16 includes a crucible lifting device 21 . The crucible lifting device 21 moves the quartz crucible 11 up and down while supporting the crucible support body 16 and the quartz crucible 11 from the lower side, so that the silicon melt 13 that changes as the single crystal silicon ingot 15 is pulled up and down is at the liquid level of the melt surface 13a The position becomes the proper position. Thereby, the position of the melt surface 13a of the silicon melt 13 is controlled. At the same time, the crucible lifting device 21 rotatably supports the crucible supporting body 16 and the quartz crucible 11 by a predetermined number of rotations when ascending.

The upper surface of the quartz crucible 11 covers the upper surface of the silicon melt 13 , that is, the melt surface 13 a , and forms a heat shield member (heat shield cylinder) 17 . The heat shielding member 17 is constituted by, for example, a conical heat insulating plate, and a substantially circular opening 17a is formed at the lower end thereof. In addition, the outer edge portion of the upper end of the heat shielding member 17 is fixed to the inner surface side of the cell 19 .

Such a heat shielding member 17 prevents the pulled single crystal silicon ingot 15 from receiving radiant heat from the molten liquid 13 in the quartz crucible 11 , changing the heat history and deteriorating the quality. In addition, such a heat shielding member 17 controls the residual oxygen amount near the melt surface 13a of the silicon melt 13 by pulling the ambient gas introduced from the inside of the induction cell 19 from the single crystal silicon ingot 15 side to the silicon melt 13 side. The silicon vapor, SiO, or the like evaporated from the silicon melt 13 makes the single-crystal silicon ingot 15 the desired quality. It is considered that such control of the pulling ambient gas depends on the furnace pressure and the flow velocity when passing through the gap between the lower end of the heat shielding member 17 and the melt surface 13 a of the silicon melt 13 . In order for the single crystal silicon ingot 15 to be of the intended quality, the distance (gap value) ΔG from the lower end of the heat shielding member 17 to the melt surface 13 a of the silicon melt 13 must be set correctly. In addition, as the pulling atmosphere, inert gas such as argon may contain hydrogen, nitrogen, or other predetermined gas as a dopant gas.

A camera 18 is provided outside the cell 19 . The camera 18 is, for example, a CCD camera, and images the inside of the cell 19 through a viewing window formed in the cell 19 . The installation angle θc of the camera 18 forms a predetermined angle with respect to the pulling axis Z of the single crystal silicon ingot 15 , and the camera 18 has an optical axis L inclined with respect to the vertical direction. In other words, the installation angle θc of the camera 18 is the inclination angle of the optical axis L inclined in the vertical direction. The camera 18 photographs the upper surface area of the quartz crucible 11 including the opening 17a of the heat shielding member 17 and the molten liquid surface 13a from obliquely above. The camera 18 is connected to the computing unit 23 , and the image captured by the camera 18 is used in the computing unit 23 to detect the crystal diameter and the liquid level position.

The computing unit 23 includes a first computing unit 24 and a second computing unit 25 that process the image captured by the camera 18 . The first computing unit 24 calculates the liquid surface position of the silicon melt 13 based on the real image of the heat shielding member 17 captured by the camera 18 and the image of the mirror image of the heat shielding member 17 reflected on the melt surface 13 a of the silicon melt 13 . Furthermore, the second computing unit 25 calculates the liquid level position of the silicon melt 13 and the diameter of the single crystal silicon ingot 15 based on the image including the boundary between the silicon melt 13 and the single crystal silicon ingot 15 captured by the camera 18 . The calculation unit 23 is connected to the control unit 26 , and the processing result of the calculation unit 23 is sent to the control unit 26 .

The control unit 26 controls the movement amount (rising speed) of the quartz crucible 11 based on the crystal growth data of the single crystal silicon ingot 15 obtained from the sensor of the pulling drive device 22 and the crystal diameter data calculated by the second calculating unit 25 . In addition, since the movement amount of the quartz crucible 11 is controlled, the control unit 26 executes the position correction control of the quartz crucible 11 based on the liquid level position of the silicon melt 13 calculated by the first arithmetic unit 24 or the second arithmetic unit 25 .

FIG. 2 is a flow chart for illustrating a method for manufacturing single crystal silicon according to an embodiment of the present invention. FIG. 3 is a side view showing the shape of a single-crystal silicon ingot manufactured by the single-crystal silicon manufacturing method of the present embodiment.

As shown in FIG. 2 , in the production of single crystal silicon, firstly, the raw polycrystalline silicon is put into the quartz crucible 11 , and the polycrystalline silicon in the quartz crucible 11 is heated and melted by the heater 12 to generate a silicon melt 13 (step S11 ).

Next, the seed crystal 14 is lowered to contact the silicon melt 13 (step S12). After that, while maintaining the contact state with the silicon melt 13, the seed crystal 14 is gradually pulled up, and a crystal pulling step for growing a single crystal is performed (steps S13 to S16).

In the crystal pulling step, the following steps are performed in sequence: necking step S13, forming a neck 15a with a narrowed crystal diameter in order to prevent dislocation; shoulder growing step S14, forming a neck 15b with a crystal diameter gradually increasing; In the growth step S15, the straight cylinder portion 15c with the crystal diameter maintained at a predetermined diameter (for example, about 300 mm (millimeters)); and the tail growth step S16, the formation of the tail portion 15d with the crystal diameter gradually decreasing; finally, the single crystal is cut from the melt surface. According to the above, the single crystal silicon ingot 15 shown in FIG. 3 having the neck portion 15a, the neck portion 15b, the straight cylindrical portion 15c, and the tail portion 15d is completed.

In the crystal pulling step, the gap value ΔG between the melt surface 13 a of the silicon melt 13 and the heat shielding member 17 is calculated based on the image captured by the camera 18 , thereby calculating the liquid level position of the silicon melt 13 . Then, according to this gap value ΔG, the lift amount of the crucible is controlled. Thereby, the position of the molten liquid surface 13a of the furnace structures such as the heater 12 and the heat shielding member 17 can be kept constant or changed regardless of the reduction of the silicon melt 13 between the start of pulling the single crystal silicon and the end of the pulling. This can control the heat radiation distribution to the silicon melt 13 .

In addition, in the crystal pulling step, the diameter of the single crystal is calculated from the image captured by the camera 18, and the crystal pulling conditions are controlled so that the crystal diameter becomes a predetermined diameter corresponding to the crystal length. In the shoulder growth step S14, the crystal diameter is controlled to gradually increase, in the straight tube growth step S15, the crystal diameter is controlled to be constant, and in the tail growth step S16, the crystal diameter is controlled to gradually decrease. The control objects of the crystal pulling conditions are the height position of the quartz crucible 11 , the crystal pulling speed, the heater output, and the like. The crystal pulling condition control of the image captured by the camera 18 is carried out in the crystal pulling step. Specifically, it is performed from the start of the necking step S13 in FIG. 2 to the end of the tail growth step S16.

FIG. 4 is a flow chart for explaining the gap control method in the crystal pulling step.

As shown in FIG. 4 , when the crystal pulling step starts, the gap measurement by the mirror image method is started, and the gap control based on this gap measurement value (first gap measurement value) is performed (steps S21 and S22 ), which will be described in detail later, but the mirror image method , is a method of geometrically calculating the gap between the lower end of the heat shielding member and the molten liquid surface according to the size and relative positional relationship between the real image and the mirror image of the heat shielding member reflected in the captured image of the camera 18 .

Next, with the start of the straight cylindrical portion growth step, the gap measurement by the F-ring method is also started, and the gap measurement by the mirror image method and the gap measurement by the F-ring method are simultaneously performed (steps S23 and S24 ). It will be described in detail later, but the F-ring method uses geometry to calculate the center coordinates of the molten ring reflected in the image captured by the camera in the growth step of the straight cylinder portion, and calculates the amount of change in the liquid level position according to the change in the vertical direction of the center coordinates. The method of calculating the gap by the amount of change.

When the gap measurement by the mirror image method can be continued without any problem in the straight cylindrical portion growth step (step S25N), the gap control by the mirror image method is continued until the crystal pulling step is completed (steps S26 and S27). At this time, the gap measurement value (first gap measurement value) of the mirror image method and the gap measurement value (second gap measurement value) of the F-ring method can be obtained by simultaneously obtaining the gap measurement value of the mirror image method while performing the gap control of the mirror image method. The gap measurement value of the method is the gap measurement error of the F-ring method, which is the benchmark. This gap measurement error can be used as the gap correction scale (gap correction amount curve) after the next batch.

When creating a gap correction scale based on the gap measurement error between the mirror-image method and the F-ring method, ideally, it is based on the average of the difference between the gap measurement value of the mirror-image method and the gap measurement value of the F-ring method measured in the past multiple pulling batches. value, and create a gap correction scale, it is particularly desirable to use the average value of the actual results of three or more batches. This allows for more accurate gap correction than taking into account measurement variations between batches. In addition, the so-called "pull batch" refers to a series of steps for producing a single crystal using the same quartz crucible. For example, when one single crystal is produced using the same quartz crucible, the term "pulling batch" means a series of steps required to produce one single crystal. In addition, when using the same quartz crucible, for example, in the multiplication method for producing three single crystals, the term "pulling batch" means a series of steps required to produce three single crystals.

On the other hand, when the gap measurement by the mirror image method becomes difficult in the straight cylinder portion growth step (step S25Y), the gap control is switched from the mirror image method to the F-ring method (step S28 ). Here, the gap measurement by the so-called mirror method is difficult, except when the gap cannot be measured due to unexpected events, and the gap measurement by the mirror method may not always be possible in the middle of the crystal pulling step. The so-called unpredictable events include, for example, when the melt splashes and adheres to the lower end of the heat shielding member 17, the brightness distribution of the opening edge of the heat shielding member 17 reflected in the image captured by the camera 18 becomes abnormal, and the gap measurement error increases.

In addition, the so-called gap measurement by the mirror image method is not always possible, for example, the gap between the single crystal silicon ingot 15 and the heat shielding member 17 is very small, and the mirror image of the heat shielding member 17 cannot be captured by this gap. In this way, by switching from the gap control of the mirror image method to the gap control of the F-ring method, the gap control can be continued from the initial stage to the final stage of the crystal pulling step.

Next, the gap measurement method regarding the mirror image method will be described.

FIG. 5 is an image captured by the camera 18 , which is used to illustrate the relationship between the real image and the mirror image of the heat shielding member 17 .

As shown in FIG. 5, the silicon melt 13 can be seen through the opening 17a of the heat shielding member 17, and the real image 17r of the heat shielding member 17 is projected in the photographed image. In addition, the silicon melt 13 is located inside the opening 17a of the heat shielding member 17, because the melt surface 13a of the silicon melt 13 becomes a mirror surface, and the mirror image 17m of the heat shield member 17 is projected on the melt surface 13a. Since the heat shielding member 17 is fixed to the furnace structure in the cell 19, the position of the real image 17r of the heat shielding member 17 does not change greatly, but changes slightly due to the thermal expansion of the furnace structure as described above.

On the other hand, the mirror image 17m of the heat shielding member 17 reflected in the molten liquid surface 13a clearly changes according to the distance between the heat shielding member 17 and the molten liquid surface 13a. Therefore, the distance D between the real image 17r of the heat shielding member 17 and the mirror image 17m reflected in the molten liquid surface 13a is linked to the up and down fluctuation of the molten liquid surface 13a caused by the consumption of the silicon molten liquid 13 accompanying crystal growth or the rise and fall of the quartz crucible 11 . Since the position of the molten liquid surface 13a is at the midpoint of the distance D between the real image 17r and the mirror image 17m, when the molten liquid surface 13a is aligned with the lower end of the heat shielding member 17, the distance D between the real image 17r of the heat shielding member 17 and the mirror image 17m becomes zero , when the molten liquid surface 13a is gradually lowered and passed, the distance (gap value) ΔG from the lower end of the heat shielding member 17 to the molten liquid surface 13a also gradually expands. The gap value ΔG at this time can be calculated as the 1/2 value of the distance D between the real image 17r and the mirror image 17m of the heat shielding member 17 (ie, D=ΔG×2). The pixel size of the image captured by the camera 18 and the Drawing numerology calculations.

Based on the relationship between the real image 17r of the heat shielding member 17 and the mirror image 17m, in the so-called mirror image method of measuring the liquid level position, the edge patterns of the real image 17r and the mirror image 17m of the heat shield member 17 are detected from images captured by the camera 18 . Then, each opening size is calculated, and the gap value ΔG (the distance between the lower end of the heat shielding member 17 and the molten liquid surface 13a: see FIG. 1 ) is calculated from these two dimensions. Calculate the vertical distance (first distance) from the camera 18 to the real image _17r using the radius _r , and calculate the vertical distance (second distance) from the camera 18 to the mirror image 17m based on the opening radius rm of the mirror image 17m of the heat shielding member 17, From the difference between these distances, the gap value ΔG is calculated. This is because, from the position of the opening of the mirror image 17m of the heat shielding member 17 seen by the camera 18 in the vertical direction, it can be seen that the opening of the real image 17r of the heat shielding member 17 is farther 2ΔG than the opening of the real image 17r of the heat shielding member 17. The reduction ratio of the opening of the mirror image 17m of the thermal member 17 is proportional to the gap value ΔG, and it is considered that the larger the ΔG becomes, the smaller the size of the opening of the mirror image 17m becomes.

However, since the camera 18 installed outside the cell 19 captures the melt surface 13a from obliquely above, the circular opening 17a of the heat shielding member 17 is not perfectly circular in appearance, and the captured image is skewed. In order to correctly calculate the opening dimensions of the real image 17r and the mirror image 17m of the heat shielding member 17, it is necessary to correct the skew of the image. Therefore, in this embodiment, the projection conversion camera 18 captures the openings of the real image 17r and the mirror image 17m of the heat shielding member 17, respectively. On the reference plane, the size of the opening 17a when viewed from directly above is obtained.

As the opening dimensions (representative dimensions) of the real image 17r and the mirror image 17m of the heat shielding member 17, a circle radius obtained by approximating the edge pattern (sample value) of the opening to a circle according to the least squares method can be used. Based on the dimensions of the real image 17r and the mirror image 17m of the heat shielding member 17 obtained in this way, the distance D=2ΔG between the real image 17r and the mirror image 17m is clearly specified.

The position in the vertical direction of the image of the heat shielding member 17 having an arbitrary opening shape can be calculated by matching the designed opening shape of the heat shielding member 17 with the reference pattern reduced at a predetermined scaling rate. That is, a reference pattern of the opening shape of the heat shielding member 17 whose reduction ratio is changed according to the distance from the installation position of the camera 18 is prepared, and the edge pattern of the image of the heat shielding member 17 and the reference pattern are matched according to the minimum residual (maximum matching ratio) according to the pattern. The reference pattern reduction ratio was calculated as the actual distance from the installation position of the camera 18 to the image of the heat shielding member 17 . In this way, the positions in the vertical direction of the real image and the mirror image of the heat shielding member 17 with respect to the installation position of the camera 18, respectively, can be obtained.

FIGS. 6( a ) and ( b ) are schematic diagrams for explaining the method of projective conversion of the two-dimensional coordinates of the captured image to the real space coordinates.

As shown in FIG. 6( a ), since the camera 18 captures the inside of the cell 19 from obliquely above, the shape of the opening 17a of the heat shielding member 17 is distorted in the captured image, and the image has a sense of distance. That is, the image on the lower side, which is closer to the camera 18, expands more than the image on the upper side. Therefore, in order to correctly calculate the aperture size of the real image and the mirror image of the heat shielding member 17, image skew correction is required. Then, the coordinates of the image captured by the camera 18 are projected and converted to coordinates on a reference plane set at the same height as the lower end of the heat shielding member 17, and the skew is corrected.

As shown in Fig. 6(b), the coordinate system when performing image correction is displayed. In this coordinate system, the reference plane is the xy plane, and the origin Co of the XY coordinates is from the center coordinate C of the photographing element 18a of the camera 18 through the center coordinate F(0, y _f , z _f of the lens 18b of the camera 18 ) ) the intersection of the drawn line (one-point lock line) and the datum plane. This straight line is the optical axis of the camera 18 .

In addition, the pulling direction of the single crystal silicon 15 is the positive direction of the z-axis, and the center coordinates C (0, y _c , z _c ) of the camera 18a and the center coordinates F (0, y _f , z _f ) of the lens 18b in the yz plane. The coordinates (u, v) in the image shown in Fig. 6(a) are represented by the pixels of the photographic element 18a, corresponding to any point P(x _p , y _p on the photographic element 18 a shown in the following formula (1) , _zp ).

[Number 1]

Here, _αu and _αv are the pixel sizes of the camera element 18a in the horizontal and vertical directions, and yc and zc are the _y -coordinate and z-coordinate of the center coordinate _C of the camera element 18a. Also, as shown in FIG. 6( b ), θc is the angle formed by the optical axis of the camera 18 and the z axis, and is the installation angle of the camera 18 .

The center coordinate C (0, y _c , z _c ) of the photographing element 18a, using the center coordinate F (0, y _f , z _f ) of the lens 18b of the camera 18 and the focal distance f ₁ of the lens, in the following formula ( 2) to indicate.

[Number 2]

When the lens 18b is regarded as a small hole, any point P(x _p , y _p , z _p ) on the photographic element 18a is projected on the reference plane through F(0, y _f , z _f ), and the projected coordinate P (X, Y, 0) can be represented by the following formula (3).

[Number 3]

By using Equation (1), Equation (2), and Equation (3), the coordinates of the real image and the mirror image of the circular opening 17a of the heat shielding member 17 projected on the reference plane can be obtained. Then, from the coordinates of the edge position of the circular opening 17a of the heat shielding member 17 projected on the reference plane, the center coordinates of the circular opening can be obtained.

Next, a method for calculating the radius of the opening 17a of the heat shielding member 17 will be described. From the coordinates of the real image and the mirror image of the circular opening 17a of the heat shielding member 17 projected on the reference plane, as a method of calculating the center coordinates ( _xO , _yO ) and the radius r of the opening 17a, the least squares method may be used. The opening 17a of the heat shielding member 17 is circular, and the image of the opening 17a satisfies the circular equation shown in the following equation (4).

[Number 4]

Here, the least squares method is used for the calculation of (x _O , y _O ) and r in the formula (10). In order to easily perform the calculation in the least squares method, the modification shown in the following formula (5) is implemented.

[Number 5]

The variables a, b, c in this equation (5) will be obtained by the least squares method. This results in the condition that the sum of squares of the differences between Equation (5) and the measurement point becomes the smallest, which is obtained by solving the partial differential equation shown in Equation (6) below.

[Number 6]

Therefore, the solution of this equation (6) can be calculated by the simultaneous equations shown in the following equation (7).

[Number 7]

By using the least squares method in this way, the opening radii r _r , rm respectively of the real image _17r and the mirror image 17m of the heat shielding member 17 projected on the reference plane can be calculated.

FIG. 7 is a schematic diagram illustrating a method of calculating the gap value ΔG based on the opening radii r _r and rm of the real image _17r and the mirror image 17m of the heat shielding member 17 , using the gap measurement method according to the mirror method.

As shown in FIG. 7 , when the heat shielding member 17 is installed horizontally, the original central coordinates P _m (X _mc , Y _mc , Z _gap ) of the mirror image of the heat shielding member 17 exist between the heat shielding member 17 and the melt surface 13 a sandwiching the melt surface 13 a On the opposite side of the center coordinates P _r (X _hc , Y _hc , 0) of the real image 17r, the straight line L _Z connecting the two points passes through the real image center coordinates P _r (X _hc , Y _hc , 0) of the heat shielding member 17, and becomes the A straight line parallel to the Z axis of the vertical axis.

On the other hand, the central coordinates P _m ′ (X _mc , Y _mc , 0) of the mirror image 17m of the heat shielding member 17 on the reference plane are the original central coordinates P _m (X _mc , Y ) of the mirror image of the heat shielding member 17 _mc , Z _gap ) projected on the reference plane, the original center coordinates P _m (X _hc , Y _hc , Z _gap ) of the mirror image of the heat shielding member 17 , the center coordinates of the mirror image of the heat shield member 17 passing through the reference plane P _m '(X _mc , Y _mc , 0) and the center coordinate F (X _f , Y _f , Z _f ) of the lens are on the straight line.

Therefore, the distance from the lens center coordinate F (X _f , Y _f , Z _f ) of the photographic element to the opening center coordinate P _r (X _hc , Y _hc , 0) of the real image 17r of the heat shielding member 17 is L _r , and the When the distance from the lens center coordinate F (X _f , Y _f , Z _f ) to the mirror image 17m opening center coordinate P _m (X _mc , Y _mc , Z _gap ) of the heat shielding member 17 is L _m , the distances L _r , L _m It can be represented by the following formula (8).

[Number 8]

By deforming this equation (8), the gap value ΔG can be represented by the following equation (9).

[Number 9]

In this way, in order to calculate the gap value ΔG, it is understood that only the distances L _f and L _m are required.

It can be regarded that the mirror image of the heat shielding member 17 reflected in the melt surface 13a is further 2ΔG than the actual heat shielding member 17, so the opening of the mirror image 17m of the heat shielding member 17 is seen to be smaller than that of the real image 17r. In addition, in the furnace temperature environment during crystal pulling, the size of the opening of the thermal member 17 becomes larger than that at normal temperature due to thermal expansion. Then, assuming that the opening radius (theoretical value) considering thermal expansion is r _actual , the real image opening radius of the heat shielding member 17 is measured as r _r , and the mirror image opening radius of the heat shielding member 17 is measured as _rm , the distances L _r , L _m can be calculated according to the following formula (10). Also, Lc is the distance from the lens center coordinates F (X _f , Y _f , Z _f ) of the imaging element to the coordinate origin C _O on the reference plane.

[Number 10]

From the above equations (9) and (10), the gap value ΔG can be calculated as the following equation (11).

[Number 11]

In this way, the gap value _ΔG can be obtained from the real image radius r _r and the mirror image radius rm of the heat shielding member 17 .

Next, the gap measurement method regarding the F-ring method will be described.

FIG. 8 is an image captured by the camera 18 , which is used to illustrate the fusion ring diagram generated in the solid-liquid interface. Moreover, FIG. 9 is an explanatory diagram of the edge detection method of the molten ring.

As shown in FIG. 8 , a part of the heat shielding member 17 is reflected in the captured image. In addition, the single crystal silicon 15 is present inside the opening 17a of the heat shielding member 17 . The silicon melt 13 can be seen through the opening 17 a of the heat shielding member 17 , but because the single crystal silicon 15 exists in the opening 17 a , the silicon melt 13 can only be seen from the tiny gap between the heat shielding member 17 and the single crystal silicon ingot 15 . The mirror image 17m of the heat shielding member 17 is projected on the melt surface 13a of the silicon melt 13, but the visible part is a very small part, and the mirror image 17m cannot be clearly specified depending on the crystal pulling conditions. The mirror image 17m of the heat shielding member 17 changes according to the distance from the heat shielding member 17 to the melt surface 13a.

A molten ring FR is generated in the boundary portion between the single crystal silicon 15 and the silicon melt 13 . The fused ring FR is a ring-shaped high-brightness region generated by the reflection of the radiant light from the heater 12 and the like on the convex-concave lens at the solid-liquid interface. The position and size of the molten ring FR vary depending on the straightness of the crystal and the position of the liquid surface. When the liquid level position is constant, the larger the crystal diameter, the larger the molten ring FR. In addition, when the crystal diameter is constant, the lower the liquid level position is, the smaller the crystal diameter becomes. In this way, since the outline of the single crystal at the solid-liquid interface can be captured from the molten ring FR, the single crystal diameter can be calculated.

When measuring the crystal center position and crystal diameter from the melt ring FR, the edge pattern of the melt ring FR is detected from the image captured by the camera 18, and the center coordinates and diameter of the single crystal are calculated from the edge pattern of the melt ring FR. The center coordinates and diameter of the molten ring FR can be obtained from an approximate circle obtained by approximating its edge pattern (sample value) by the least squares method. By correcting the diameter of the molten ring FR obtained in this way, the single crystal diameter at room temperature can be calculated.

When the diameter of the molten ring FR is constant, the change of the center coordinates of the molten ring FR in the up-down direction in the captured image means the change of the melt surface in the up-down direction (height direction). Therefore, the relative position of the melt surface can be obtained from the amount of change in the position of the center coordinates of the melt ring FR.

When measuring the liquid level position and crystal diameter, it must be detected that the molten ring FR has stabilized. As a method of detecting a predetermined image position from image data, a method of binarization processing is generally performed by setting a threshold value according to the image brightness value. However, when the edge detection of the molten ring FR is performed by the binarization process, there is a possibility that the detection position may deviate due to the brightness change accompanying the temperature change in the furnace.

In order to eliminate this influence, instead of a general binarization method, the peak brightness in the captured image (peak brightness of the fused ring FR) is obtained. Ideally, it is a threshold value determined by multiplying this peak brightness by a value smaller than 1 (cutoff value). shear level) to detect the edge of the fused ring FR. That is, in the detection of the edge pattern (contour line) of the melt ring FR, according to the brightness of the melt ring FR in the image, by changing the threshold value (truncation level), the measurement error caused by the influence of the brightness change is reduced, and the melt ring is stably detected. Correct size for FR. Specifically, as shown in FIG. 9 , a horizontal scanning line SL that intersects with the fuse ring FR is set, and the outer intersection (close to shooting) of the luminance distribution on the horizontal scanning line SL and a threshold value (equivalent to TH in FIG. 9 ) is detected. A point on the periphery of the image) as the edge of the fused ring FR.

Since the camera 18 provided outside the cell 19 captures the molten liquid surface 13a from obliquely above, the external appearance of the molten ring FR is not round but skewed. In order to correctly calculate the diameter of the fused ring FR, it is necessary to correct the skew of the image. Therefore, in the present embodiment, the edge pattern of the fused ring FR photographed by the camera 18 is projected and converted onto the reference plane, and the diameter of the fused ring FR when viewed from directly above is obtained.

FIGS. 10( a ) and ( b ) are diagrams for explaining a method of correcting the gap measurement value. As shown in the figure, since the F-ring method is a method of obtaining the relative change amount ΔGs of the liquid surface position, in order to obtain the gap ΔGf between the lower end of the heat shielding member 17 and the molten liquid surface 13a by the F-ring method, the liquid obtained by the F-ring method The gap reference value ΔG0 must be added to the relative change ΔGs of the surface position.

However, the gap reference value ΔG0 is the distance from the lower end of the heat shielding member 17 to the molten liquid surface 13a at a certain time. Even if the lower end position of the expanding heat shielding member 17 rises due to thermal expansion, the rising amount is not added. Therefore, in the present embodiment, the gap correction amount ΔGc is added to the gap measurement value ΔGf by the F-ring method. Assuming that the gap measurement value of the F-ring method is ΔGf, the gap correction amount read from the gap correction scale is ΔGc, and the relative change of the liquid level position obtained by the F-ring method is ΔGs. When the distance (gap reference value) of the melt surface 13a is ΔG0, the gap measurement value ΔGfN after correction (offset processing) becomes the following equation (12).

[Number 12]

In this way, by adding the gap correction amount ΔGc to the gap measurement value ΔGf by the F-ring method, the gap value to which the positional change of the heat shielding member 17 due to thermal expansion is added can be calculated.

As described above, in the method for producing a single crystal of the present embodiment, the measured value of the gap is calculated from the amount of change in the liquid surface position measured by the F-ring method, and the measured value of the gap is corrected using a gap correction scale prepared in advance, because the crystal pulling conditions are controlled. By making the corrected gap measurement value close to the target value, it becomes possible to measure the gap in consideration of the change in the height position of the heat shielding member due to thermal expansion, thereby improving the reliability of the quality assurance of the single crystal. Furthermore, in the method for producing a single crystal of the present embodiment, both the gap measurement value of the mirror image method and the gap measurement value of the F-ring method are simultaneously calculated from the image captured by the camera, and then the gap measurement value of the mirror image method and the gap measurement value of the F-ring method are calculated. The difference between the measured values is obtained by obtaining a gap correction scale corresponding to the crystal length, and in the F-ring method, it is possible to measure the gap in consideration of the change in the height position of the heat shielding member due to thermal expansion.

In the method for producing a single crystal of the present embodiment, at the start of the crystal pulling step, the gap control based on the gap measurement result of the mirror method is started, and then the gap measurement by the F-ring method is started in the straight growth step of the single crystal, and the above-mentioned F When the gap measurement by the mirror image method becomes difficult after the gap measurement by the ring method is started, the crystal pulling is caused by switching from the gap control based on the gap measurement result of the mirror image method to the gap control based on the gap measurement result of the F ring method. Clearance control can be performed with certainty and high accuracy from the beginning to the end of the step, and it is possible to prevent the reduction of the clearance measurement accuracy.

The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention, and of course these are also included in the scope of the present invention.

For example, in the above-mentioned embodiment, the method for producing single crystal silicon has been described, but the present invention is not limited to the method for producing single crystal silicon, and various single crystal production methods by the CZ method can be applied. [Example]

In the straight cylinder growth step, the gap control of the mirror method is performed simultaneously, and the gap measurement of the F-ring method is performed. As a result, as shown in FIG. 11 , the gap measurement value of the F-ring method tends to be larger than the gap measurement value of the mirror image method. After comparing with the curve of the target value of the gap, it can be seen that the F-ring method can control the gap more correctly than the mirror method, but because the F-ring method only controls the liquid level position, it is obvious that the gap cannot be controlled correctly in practice.

<Example> In the middle of performing the gap control of the mirror method, intentionally switched to the liquid level position control of the F-ring method. The switching position of the gap control is 900mm from the starting end of the straight cylinder part. After switching the gap control method from the mirror method to the F-ring method, the gap measurement of the mirror method is also continued.

In the gap control of the F-ring method, use the correction scale to correct the gap measurement value, and implement the gap control according to the corrected gap measurement value. The difference between the gap measurement value of the mirror method and the gap measurement value of the F-ring method is obtained, and the average value of the actual results of the last three batches is especially used.

FIG. 12 is a graph showing the gap measurement results of the embodiment. Before the crystal length of 900 mm, the gap control was performed by the mirror method, and after the crystal length of 900 mm, the gap control by the F-ring method was performed. As is apparent from Fig. 12, the gap measurement value does not change sharply before and after the crystal length of 900 mm, and the gap can be accurately measured even by the F-ring method. <Comparative example>

The gap control transition from the mirror image method to the F-ring method is performed in the same manner as in the embodiment except for the point where the gap measurement value is not corrected using the correction scale.

FIG. 13 is a graph showing the gap measurement results of the comparative example. As apparent from FIG. 13 , the lower end position of the heat shielding member rose due to the influence of thermal expansion, and the gap measurement value tended to increase after the crystal length of 900 mm.

10: Single crystal production equipment 11: Quartz Crucible 12: Heater 13: Silicon melt 13a: Melt level 14: Seed 15: Monocrystalline silicon (ingot) 15a: Neck 15b: Neck 15c: Straight barrel 15d: tail 16: Crucible support (black lead crucible) 17: Heat shielding member (shielding cylinder) 17a: Opening 17m: Mirror image of heat shield 17r: Real image of heat shield 18: Camera 18a: Photography Yuan Niu 18b: Lens 19: Small room 21: Crucible lifting device 22: Lifting drive device 23: Operation Department 24: 1st operation department 25: 2nd Computation Section 26: Control Department

Fig. 1 is a schematic cross-sectional view showing the structure of a single crystal production apparatus according to an embodiment of the present invention; [FIG. 2] is a flow chart for illustrating a method for manufacturing single crystal silicon according to an embodiment of the present invention; [ Fig. 3 ] is a side view showing the shape of a single crystal silicon ingot manufactured by the single crystal silicon manufacturing method of the present embodiment; [Fig. 4] is a flow chart for explaining the gap control method in the crystal pulling step; [Fig. 5] is an image captured by a camera, which is used to illustrate the relationship between the real image and the mirror image of the heat shielding member; [FIG. 6(a) and (b)] are schematic diagrams for explaining the method of projective conversion of the two-dimensional coordinates of the captured images to real space coordinates; [Fig. 7] It is a schematic diagram of the gap measurement method based on the mirror image method, which is used to illustrate the method of calculating the gap value based on the opening radii of the real image and the mirror image of the heat shielding member; [Fig. 8] is the image taken by the camera to illustrate the fusion ring diagram generated in the solid-liquid interface; [ Fig. 9 ] An explanatory diagram of the edge detection method of the fused ring; [Fig. 10(a) and (b)] are explanatory diagrams of the correction method of the gap measurement value; [Fig. 11] A graph comparing the gap measurement results of the mirror image method and the gap measurement results of the F-ring method, the horizontal axis is the crystal length (relative value), and the vertical axis is the gap measurement value (relative value); [FIG. 12] is a graph showing the gap measurement results of the embodiment; and [ Fig. 13 ] is a graph showing the gap measurement results of the comparative example.

10: Single crystal production equipment

11: Quartz Crucible

12: Heater

13: Silicon melt

13a: Melt level

14: Seed

15: Monocrystalline silicon (ingot)

16: Crucible support (black lead crucible)

17: Heat shielding member (shielding cylinder)

17a: Opening

18: Camera

19: Small room

21: Crucible lifting device

22: Lifting drive device

23: Operation Department

24: 1st operation part (interval between real image and mirror image)

25: 2nd arithmetic unit (high-brightness band)

26: Control Department

L: optical axis

Z: Lifting shaft

θ c: set angle

ΔG: Gap value

Claims (15)

A single crystal manufacturing device, characterized in that: include: The single crystal pulling part pulls the single crystal from the melt in the crucible; a heat shielding member, arranged above the molten liquid, surrounding the single crystal; a camera to photograph the boundary between the melt and the single crystal from obliquely above; a computing unit for processing the images captured by the camera; and a control unit, controlling the crystal pulling conditions according to the processing result of the computing unit; Wherein, the above-mentioned computing part has: The first calculation unit calculates the distance between the lower end of the heat shielding member and the molten liquid surface based on the size of the real image of the opening of the heat shielding member reflected in the image captured by the camera and the mirror image of the opening of the heat shielding member projected on the molten liquid surface. 1st gap measurement; and The second calculation unit relatively calculates the lower end of the heat shielding member and the molten liquid based on the amount of change in the height direction of the crystal center position based on the amount of change in the height direction of the crystal center position, which is obtained from the image captured by the camera. 2nd gap measurement between faces; The second computing unit corrects the second gap measurement value using a gap correction scale prepared in advance. The single crystal production apparatus according to claim 1, wherein, The control unit starts a crystal pulling step while controlling the crystal pulling conditions based on the first gap measurement value, and switches from the gap control based on the first gap measurement value to the crystal pulling step after the single crystal growth step is started. Gap control of the above-mentioned second gap measurement value. The single crystal production apparatus according to claim 2, wherein, The control unit is configured to switch from the gap control based on the first gap measured value to the second gap based on an abnormality in the first gap measured value or when the first gap measured value cannot be measured in the middle of the straight cylindrical portion growing step. Gap control for measured values. The single crystal production apparatus according to claim 1, wherein, The control unit controls the rising speed of the crucible in order to bring the first gap measurement value or the corrected second gap measurement value closer to a target value. The single crystal production apparatus according to claim 2, wherein, The control unit controls the rising speed of the crucible in order to bring the first gap measurement value or the corrected second gap measurement value closer to a target value. The single crystal production apparatus according to claim 3, wherein, The control unit controls the rising speed of the crucible in order to bring the first gap measurement value or the corrected second gap measurement value closer to a target value. The single crystal production apparatus according to any one of claims 1 to 6, wherein The said calculation part creates the said clearance gap correction amount table based on the difference of the said 1st clearance measurement value and the said 2nd clearance measurement value measured in the past pulling batch. The single crystal production apparatus according to claim 7, wherein, The computing unit creates the gap correction amount table based on the average value of the difference between the first gap measurement value and the second gap measurement value measured in the past plural pulling batches. A method for producing a single crystal, comprising controlling a gap between a lower end of a heat shielding member provided above the molten liquid and the molten liquid surface around a single crystal pulled from a molten liquid in a crucible, and simultaneously pulling the above-mentioned single crystal from the molten liquid. The method for producing a single crystal by the Kolaski method (CZ method) is characterized in that: Based on the first gap measurement value calculated from the size of the real image of the opening of the heat shielding member reflected in the image captured by the camera and the mirror image of the opening of the heat shielding member projected on the molten surface, the crystal pulling step is started while the gap is controlled. ; After the crystal pulling step is started, it is converted into a second gap measurement value calculated from the amount of change in the height direction of the crystal center position obtained from the image captured by the camera reflecting the melt ring generated on the boundary between the single crystal and the melt. gap control; According to the gap control of the second gap measurement value, the second gap measurement value is corrected using a gap correction scale prepared in advance, and the crystal pulling conditions are controlled so that the corrected second gap measurement value is close to the target value. The method for producing a single crystal according to claim 9, wherein, When an abnormality occurs in the first gap measurement value in the middle of the crystal pulling step or when the first gap measurement value cannot be measured, the gap control based on the first gap measurement value is switched to the gap control based on the second gap measurement value. . The method for producing a single crystal according to claim 9, wherein, In the crystal pulling step, the rising speed of the crucible is controlled so that the first gap measurement value or the corrected second gap measurement value is close to a target value. The method for producing a single crystal according to claim 10, wherein, In the crystal pulling step, the rising speed of the crucible is controlled so that the first gap measurement value or the corrected second gap measurement value is close to a target value. The method for producing a single crystal according to any one of claims 9 to 12, wherein The gap correction scale is created based on the difference between the first gap measurement value and the second gap measurement value measured in the past pulling batches. The method for producing a single crystal as claimed in claim 13, wherein, The said gap correction amount table is created based on the average value of the difference of the said 1st gap measurement value and the said 2nd gap measurement value measured in the past plural pulling batches. A method for producing a single crystal, which comprises measuring the gap between the lower end of a heat shielding member and the molten liquid surface around the single crystal pulled from the molten liquid and provided above the molten liquid, while pulling the single crystal pulled from the molten liquid. A method for producing a single crystal based on the base method (CZ method), characterized in that: Calculate the first gap measurement value by using the mirror image method of calculating the liquid surface position according to the real image of the heat shielding member reflected in the image captured by the camera and the mirror image geometry of the heat shielding member projected on the molten liquid surface; According to the measurement value of the first gap, while the gap is controlled, the crystal pulling step is started; The second gap is calculated by the F-ring method that calculates the amount of liquid level position change based on the amount of change in the center coordinates of the molten ring generated on the boundary between the single crystal and the molten liquid reflected in the image captured by the camera when the inside of the furnace is captured. Measurements; When abnormality occurs in the first gap measurement value according to the mirror image method or when the first gap measurement value cannot be measured, the gap control based on the first gap measurement value is switched to the second gap measurement value according to the F-ring method. gap control; According to the gap control of the second gap measurement value, the second gap measurement value is corrected using a gap correction scale prepared in advance, and the crystal pulling conditions are controlled so that the corrected second gap measurement value is close to the target value.

Images