TW202210213A - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

Info

Publication number
TW202210213A
TW202210213A TW110108627A TW110108627A TW202210213A TW 202210213 A TW202210213 A TW 202210213A TW 110108627 A TW110108627 A TW 110108627A TW 110108627 A TW110108627 A TW 110108627A TW 202210213 A TW202210213 A TW 202210213A
Authority
TW
Taiwan
Prior art keywords
laser processing
laser
light
moving mechanism
along
Prior art date
Application number
TW110108627A
Other languages
English (en)
Chinese (zh)
Inventor
坂本剛志
是松克洋
Original Assignee
日商濱松赫德尼古斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商濱松赫德尼古斯股份有限公司 filed Critical 日商濱松赫德尼古斯股份有限公司
Publication of TW202210213A publication Critical patent/TW202210213A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
TW110108627A 2020-04-28 2021-03-11 雷射加工裝置 TW202210213A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020079499 2020-04-28
JP2020-079499 2020-04-28

Publications (1)

Publication Number Publication Date
TW202210213A true TW202210213A (zh) 2022-03-16

Family

ID=78373597

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110108627A TW202210213A (zh) 2020-04-28 2021-03-11 雷射加工裝置

Country Status (5)

Country Link
JP (1) JPWO2021220607A1 (ko)
KR (1) KR20230003486A (ko)
CN (1) CN115515746A (ko)
TW (1) TW202210213A (ko)
WO (1) WO2021220607A1 (ko)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5456510B2 (ja) 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置
JP5899513B2 (ja) * 2012-01-12 2016-04-06 パナソニックＩｐマネジメント株式会社 基板製造方法、および改質層形成装置
KR20150110707A (ko) * 2013-02-04 2015-10-02 뉴포트 코포레이션 투명 및 반투명 기재의 레이저 절단 방법 및 장치
JP2017071074A (ja) * 2015-10-05 2017-04-13 国立大学法人埼玉大学 内部加工層形成単結晶基板の製造方法、および、単結晶基板の製造方法
KR20210005110A (ko) * 2018-04-27 2021-01-13 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법

Also Published As

Publication number Publication date
JPWO2021220607A1 (ko) 2021-11-04
WO2021220607A1 (ja) 2021-11-04
CN115515746A (zh) 2022-12-23
KR20230003486A (ko) 2023-01-06

Similar Documents

Publication Publication Date Title
TWI837206B (zh) 雷射加工裝置
JP7311532B2 (ja) レーザ加工装置
JPWO2020090918A1 (ja) レーザ加工装置
WO2021199874A1 (ja) レーザ加工装置、レーザ加工方法及びウェハ
TW202210213A (zh) 雷射加工裝置
JP7460377B2 (ja) レーザ加工装置及びレーザ加工方法
CN117020449A (zh) 激光加工装置及激光加工方法
JP7368246B2 (ja) レーザ加工装置及びレーザ加工方法
WO2020090913A1 (ja) レーザ加工装置及びレーザ加工方法