JPWO2021220607A1 - - Google Patents

Info

Publication number
JPWO2021220607A1
JPWO2021220607A1 JP2022518629A JP2022518629A JPWO2021220607A1 JP WO2021220607 A1 JPWO2021220607 A1 JP WO2021220607A1 JP 2022518629 A JP2022518629 A JP 2022518629A JP 2022518629 A JP2022518629 A JP 2022518629A JP WO2021220607 A1 JPWO2021220607 A1 JP WO2021220607A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022518629A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021220607A1 publication Critical patent/JPWO2021220607A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
JP2022518629A 2020-04-28 2021-03-03 Pending JPWO2021220607A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020079499 2020-04-28
PCT/JP2021/008267 WO2021220607A1 (ja) 2020-04-28 2021-03-03 レーザ加工装置

Publications (1)

Publication Number Publication Date
JPWO2021220607A1 true JPWO2021220607A1 (ja) 2021-11-04

Family

ID=78373597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022518629A Pending JPWO2021220607A1 (ja) 2020-04-28 2021-03-03

Country Status (5)

Country Link
JP (1) JPWO2021220607A1 (ja)
KR (1) KR20230003486A (ja)
CN (1) CN115515746A (ja)
TW (1) TW202210213A (ja)
WO (1) WO2021220607A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5456510B2 (ja) 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置
JP5899513B2 (ja) * 2012-01-12 2016-04-06 パナソニックＩｐマネジメント株式会社 基板製造方法、および改質層形成装置
EP2950968A4 (en) * 2013-02-04 2016-10-19 Newport Corp METHOD AND DEVICE FOR LASER CUTTING TRANSPARENT AND SEMITRANSPARENT SUBSTRATES
JP2017071074A (ja) * 2015-10-05 2017-04-13 国立大学法人埼玉大学 内部加工層形成単結晶基板の製造方法、および、単結晶基板の製造方法
WO2019208359A1 (ja) * 2018-04-27 2019-10-31 東京エレクトロン株式会社 基板処理システム及び基板処理方法

Also Published As

Publication number Publication date
KR20230003486A (ko) 2023-01-06
CN115515746A (zh) 2022-12-23
WO2021220607A1 (ja) 2021-11-04
TW202210213A (zh) 2022-03-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240207