TW202208869A - Inspection device - Google Patents

Abstract

The present invention provides an inspection device (10), which has a conductive member (310) having a ground surface (312); an insulator member (320) having at least a part opposing to the ground surface (312); and an antenna element (330) arranged on a surface of the insulator member (320) opposing to the ground surface (312).

Description

Inspection device

The present invention relates to an inspection device.

In recent years, various inspection apparatuses for inspecting semiconductor devices having antennas have been developed. For example, the inspection apparatus described in Patent Document 1 includes a holding unit for holding a semiconductor device as a device under test (Device Under Test, hereinafter referred to as DUT), and an antenna unit for inspecting the DUT. The antenna part performs OTA (Over-the-Air, over-the-air transmission and reception) inspection of the DUT. The antenna part includes an insulating substrate. An antenna element is provided on the lower surface side of the insulating substrate. A ground pattern is provided on the upper surface side of the insulating substrate.

[Prior Art Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Publication No. 2010-27777

Insulation between the antenna element and the conductive member such as the ground pattern via an insulating substrate or the like When the members face each other, the surface of the antenna element facing the conductive member is joined to the insulating member. Since the surface of the antenna element is bonded to the insulating member, the surface of the antenna element may be roughened. In this case, there is a concern of reducing the antenna gain.

An example of an object of the present invention is to suppress the decrease in antenna gain. Another object of the present invention will become more apparent from the description of the present specification.

One aspect of the present invention is an inspection device comprising:

a conductive member having a ground surface;

an insulating member, at least a part of which faces the ground plane; and

The antenna element is disposed on the surface of the insulating member facing the ground plane.

According to the above-described aspects of the present invention, the reduction of the antenna gain can be suppressed.

10,10B: Inspection device

20, 20B: Retention Department

30, 30A, 30K: Antenna part

110: Inspection substrate

120: socket

200, 200B: Fixed part

202, 202B: Pressurization Department

210, 210B: Holes

310, 310A, 310K: Conductive components

312, 312A, 312K: Ground plane

314: Recess

320, 320K: Insulation components

330, 330K, 510: Antenna elements

342: First Stripline

344: Second Stripline

352: first through hole

354: second through hole

360A: Spacer

500: Semiconductor Devices

X: first direction

Y: the second direction

Z: third direction

FIG. 1 is a cross-sectional view of an inspection apparatus according to an embodiment.

FIG. 2 is a perspective view of the antenna portion of the embodiment.

FIG. 3 is a perspective view of the upper surface of the semiconductor device.

4 is a graph showing an example of the relationship between the distance between the antenna element and the ground plane and the radiation efficiency of the antenna portion.

FIG. 5 is a cross-sectional view of an antenna portion of a comparative example.

FIG. 6 is a diagram showing the radiation pattern of the radio waves of the antenna part of the embodiment and the radiation pattern of the radio waves of the antenna part of the comparative example.

FIG. 7 is a graph showing the frequency characteristic of the gain of the positive angle (boresight) of the antenna part of the embodiment and the frequency characteristic of the gain of the positive angle of the antenna part of the comparative example.

FIG. 8 is a cross-sectional view of the antenna portion of Modification 1. FIG.

FIG. 9 is a cross-sectional view of the inspection apparatus of Modification 2. FIG.

Hereinafter, embodiments and modifications of the present invention will be described with reference to the drawings. In addition, in all drawings, the same code|symbol is attached|subjected to the same component and description is abbreviate|omitted suitably.

In this specification, the ordinal numbers such as "first", "second", "third", etc., unless otherwise specified in advance, are simply added notes for distinguishing the structures with the same names, and do not mean A particular feature of composition (eg, order or importance).

FIG. 1 is a cross-sectional view of an inspection apparatus 10 according to an embodiment. FIG. 2 is a perspective view of the antenna portion 30 of the embodiment. FIG. 3 is a perspective view of the upper surface of the semiconductor device 500 .

In FIGS. 1 to 3 , the arrow directions showing the first direction X, the second direction Y, or the third direction Z are shown as positive directions of the directions indicated by the arrows. On the other hand, the opposite direction of the arrow showing the first direction X, the second direction Y, or the third direction Z is the negative direction of the direction indicated by the arrow. In addition, the white circle with x indicating the second direction Y is displayed as follows: since the positive direction of the direction indicated by the white circle with x is the direction from the front side of the paper to the back side, and by The negative direction of the direction indicated by the white circle with x is the direction from the back side of the paper to the front side. The same applies to FIGS. 5 , 6 , 8 , and 9 to be described later.

The first direction X refers to a horizontal direction, that is, a direction parallel to a direction orthogonal to the vertical direction. Specifically, the first direction X refers to a direction substantially parallel to one side of the square semiconductor device 500 , which will be described later. The second direction Y refers to a direction parallel to the horizontal direction and orthogonal to the first direction X. Specifically, the second direction Y refers to a direction parallel to the other side orthogonal to the one side that is parallel to the first direction X of the semiconductor device 500 . The third direction Z is a vertical direction and is orthogonal to both the first direction X and the second direction Y. The positive direction of the third direction Z is the direction above the vertical direction. The negative direction of the third direction Z is the downward direction of the vertical direction.

In addition, the cross-section shown in FIG. 1 means the cross-section which passes the center in the 2nd direction Y of the inspection apparatus 10 along the direction perpendicular|vertical to the 2nd direction Y.

First, a semiconductor device 500 serving as a device to be inspected (DUT) of the inspection device 10 will be described with reference to FIG. 3 .

Four antenna elements 510 are provided on the upper surface of the semiconductor device 500 . The outer shape of the antenna element 510 is a plate-like square, but can be a plate-like circle or any shape. The four antenna elements 510 are arranged in a square grid with two rows and two columns to form an array antenna. By controlling conditions such as amplitude and phase of the radio waves radiated from the respective antenna elements 510 , the radio waves radiated from the semiconductor device 500 can be controlled. Furthermore, the layout of the antenna element 510 is not limited by the layout of this embodiment. For example, only one antenna element 510 may be provided on the upper surface of the semiconductor device 500 . In addition, the plurality of antenna elements 510 may be arranged in a rectangular lattice shape. In addition, a plurality of antenna elements 510 may also be arranged in a row along one direction. Alternatively, the plurality of antenna elements 510 may be arranged in a polygonal lattice such as a triangular lattice, a quadrangular lattice, and a hexagonal lattice. Alternatively, the plurality of antenna elements 510 can also be arranged in a circular ring or an elliptical ring.

Next, the inspection apparatus 10 is demonstrated using FIG.1 and FIG.2.

The inspection apparatus 10 includes a holding unit 20 and an antenna unit 30 . The holding unit 20 holds the semiconductor device 500 . The holding portion 20 includes the inspection substrate 110 , a socket 120 , and a fixing portion 200 . The antenna unit 30 inspects the semiconductor device 500 .

The inspection substrate 110 is, for example, a PCB (Printed Circuit Board). The socket 120 is provided on the upper surface of the inspection substrate 110 . The semiconductor device 500 is mounted on the upper surface of the inspection substrate 110 via the socket 120 . The inspection substrate 110 and the semiconductor device 500 are electrically connected to each other via the socket 120 . A signal input to the inspection substrate 110 is input to the semiconductor device 500 via the socket 120 . In addition, the signal output from the semiconductor device 500 is output from the inspection substrate 110 via the socket 120 .

The fixing portion 200 is formed of, for example, an insulating material such as resin. The fixing portion 200 presses (fixes) the semiconductor device 500 toward the inspection apparatus 10 . Specifically, the fixing portion 200 has a pressing portion 202 that is in contact with the edge of the upper surface of the semiconductor device 500 . The fixing portion 200 makes the pressing portion 202 contact the edge of the upper surface of the semiconductor device 500 , thereby fixing the semiconductor device 500 at a predetermined position on the socket 120 and pressing the semiconductor device 500 toward the socket 120 . Thereby, the contact between the semiconductor device 500 and the socket 120 is ensured.

The fixing portion 200 is provided with a hole 210 for exposing at least a part of the semiconductor device 500 , specifically, exposing at least a part of the upper surface of the semiconductor device 500 . Radio waves radiated from the antenna element 510 provided on the upper surface of the semiconductor device 500 reach the antenna portion 30 through the hole 210 . In addition, the radio waves radiated from the antenna unit 30 reach the antenna element 510 provided on the upper surface of the semiconductor device 500 through the hole 210 .

The antenna unit 30 performs OTA (Over-the-Air) inspection of the semiconductor device 500 . The antenna portion 30 is disposed above the semiconductor device 500 . The antenna part 30 performs at least one of the following Square: transmission of radio waves radiated to the semiconductor device 500 and reception of radio waves radiated from the semiconductor device 500 . Specifically, the antenna unit 30 is electrically connected to an external measuring device (not shown). According to a signal input to the antenna unit 30 from an external measuring instrument, radio waves are radiated from the antenna unit 30 toward the semiconductor device 500 . Furthermore, according to the radio wave radiated from the semiconductor device 500 toward the antenna unit 30, a signal is output from the antenna unit 30 toward the external measuring device.

Next, the details of the antenna unit 30 will be described with reference to FIGS. 1 and 2 .

The antenna portion 30 includes a conductive member 310 , an insulating member 320 , an antenna element 330 , a first stripline 342 , a second stripline 344 , a first via 352 , and a second via 354 .

The conductive member 310 is, for example, a conductor plate made of metal such as aluminum. When viewed from the vertical direction, the conductive member 310 is substantially square. In addition, the shape of the conductive member 310 is not limited to the shape of this embodiment. When viewed from the vertical direction, the conductive member 310 may have a substantially rectangular shape, such as a rectangle, which is different from a square shape, for example.

The lower surface of the conductive member 310 is provided with a concave portion 314 which is opened toward the bottom of the conductive member 310 . The bottom surface of the concave portion 314 becomes the ground surface 312 . The concave portion 314 is formed by, for example, cutting. In this case, compared to the case where the ground plane 312A and the antenna element 330 are separated by using the spacer 360A disposed between the conductive member 310A and the insulating member 320 as shown in FIG. The number of parts of the antenna unit 30 .

The insulating member 320 is, for example, a resin substrate. The insulating member 320 is fixed to the conductive member 310 by, for example, a screw penetrating the insulating member 320 from the lower surface of the insulating member 320 , so that the lower surface of the conductive member 310 and the upper surface of the insulating member 320 are in contact with each other. Thereby, at least a part of the insulating member 320 , specifically, the part of the upper surface of the insulating member 320 covered by the concave portion 314 of the conductive member 310 faces the ground plane 312 of the conductive member 310 . Also, in the upper surface side of the insulating member 320 The portion contacting the conductive member 310 may also have a conductive pattern formed of copper foil.

The antenna element 330 is disposed on the upper surface of the insulating member 320 . The antenna element 330 is, for example, a conductive pattern formed of metal. The antenna element 330 can also be sheet metal. The antenna element 330 is disposed on the surface side of the insulating member 320 facing the ground plane 312 of the conductive member 310 . In addition, the antenna element 330 and the ground plane 312 face each other with a space (a region where air exists) interposed therebetween.

When viewed from the direction in which the antenna element 330 faces the ground plane 312, that is, the positive direction of the third direction Z, the shape of the space between the insulating member 320 and the ground plane 312, that is, the shape of the concave portion 314 is, for example, substantially the same as that of the antenna. Element 330 is similar in shape. Furthermore, the shape of the concave portion 314 may be different from the similar shape of the antenna element 330 .

Next, a detailed example of the antenna element 330 will be described. When the wavelength of the free space is λ ₀ , the length L of one side of the antenna element 330 can be, for example, 1/3 λ ₀ <L<1/2 λ ₀ . The resonance frequency f of the antenna element 330 can be calculated by the following formula 1.

Here, c represents the speed of light in a vacuum, and ε _eff and ΔL in Formula 1 are represented by the following Formulas 2 and 3.

In Equation 2 and Equation 3, ε _r is the dielectric constant of the medium, h is the distance between the antenna element 330 and the ground plane 312 , and W is the lateral width of the antenna element 330 . The so-called lateral width refers to the width in the direction of 90 degrees from the axis supplied by the microstrip line. In the above example, since the longitudinal length and lateral width of one side of the antenna element 330 are the same, L=W, ε _r =1.37, h=0.5 mm. In the case calculated under these conditions, the resonance frequency becomes 28.5 GHz when one side of the antenna element 330 is approximately 4.0 mm.

In addition, the radiation efficiency η of the antenna portion 30 can be expressed by the following formula 4.

In Equation 4, Q _r represents the Q value obtained by space radiation, Q _sw represents the Q value obtained by the surface wave propagating horizontally in the antenna element 330 in the first direction X and the second direction Y, Q _c represents the Q value obtained by the conductor, and Q _d represents the Q value obtained by the dielectric. Since the inverse of the Q value is loss, 1/Q _r , 1/Q _sw , 1/Q _c , and 1/Q _d represent space radiation loss, surface wave loss, conductor loss, and dielectric loss, respectively. Furthermore, each of Q _r , Q _c , and Q _d is represented by the following formulae 5 to 7.

In Equation 5 to Equation 7, c represents the speed of light, μ represents magnetic permeability, a represents surface roughness, and σ represents the electrical conductivity of the conductor. The Q _sw which is the Q value of the surface wave refers to a value determined by the surrounding conditions of the antenna element 330 .

FIG. 4 is a graph showing an example of the relationship between the distance between the antenna element 330 and the ground plane 312 and the radiation efficiency of the antenna portion 30 . In FIG. 4 , the horizontal axis of the graph shows the distance between the antenna element 330 and the ground plane 312 , and the vertical axis of the graph shows the radiation efficiency of the antenna portion 30 . The switch shown in Figure 4 is calculated according to Equation 4.

In one example, the distance between the antenna element 330 and the ground plane 312 is determined by the radiation efficiency η of Equation 4. As shown in FIG. 4 , the radiation efficiency of the antenna portion 30 increases as the distance between the antenna element 330 and the ground plane 312 increases, and when the distance exceeds about 0.2 mm, the change becomes gentle and saturated. In the above-mentioned example, the distance between the antenna element 330 and the ground plane 312 is set to 0.5 mm, and this distance will make the radiation efficiency of the antenna portion 30 be 0.97, which is sufficiently large, and even if the distance varies, the radiation efficiency of the antenna portion 30 Still not going to change significantly. Furthermore, the distance between the antenna element 330 and the ground plane 312 may be 0.5 mm or less.

In one example, the area of the space between the insulating member 320 and the ground plane 312 (that is, the size of the recess 314 in the horizontal direction), such as the size of the first direction X or the size of the second direction Y, can be set as an antenna element. The size of 330 in the horizontal direction (for example, the size of the first direction X or the size of the second direction Y) is twice or less. In this case, the surface wave loss 1/Q _sw in the aforementioned Equation 4 can be suppressed by shielding the surface wave by the inner wall of the concave portion 314 . However, when the size of the concave portion 314 is excessively reduced, the inner wall of the concave portion 314 will be too close to the antenna element 330 , so the above-mentioned Equations 1 to 7 of the antenna element 330 may not hold. For this reason, as the size of the concave portion 314 , an appropriate value that holds the above-mentioned equations 1 to 7 and can suppress the surface wave loss 1/Q _sw is selected. Furthermore, the horizontal dimension of the concave portion 314 may be larger than twice the horizontal dimension of the antenna element 330 .

Power is supplied to the antenna element 330 from the first strip line 342 provided on the lower surface side of the insulating member 320 through the first through hole 352 penetrating the insulating member 320 . The first strip lines 342 extend in parallel along the first direction X. As shown in FIG. One end of the first strip line 342 is connected to the first through hole 352 . On the other hand, the other end of the first strip line 342 may be connected to an external measuring device (not shown). Further, power is supplied to the antenna element 330 from the second strip line 344 provided on the lower surface side of the insulating member 320 through the second through hole 354 penetrating the insulating member 320 . The second strip lines 344 extend in parallel along the second direction Y. One end of the second strip line 344 is connected to the second through hole 354 . The other end of the second strip line 344 may be connected to an external measuring device (not shown). The antenna unit 30 can perform at least one of the transmission and reception of the horizontally polarized wave and the vertically polarized wave through the two striplines of the first stripline 342 and the second stripline 344 . Furthermore, the number of striplines provided in the antenna portion 30 may be only one. In addition, the power supply method to the antenna element 330 can also be the power supply through non-contact electromagnetic coupling without using the first through hole 352 and the second through hole 354 .

FIG. 5 is a cross-sectional view of the antenna portion 30K of the comparative example. The antenna unit 30K of the comparative example is the same as the antenna unit 30 of the embodiment except for the following points.

In the antenna portion 30K of the comparative example, the insulating member 320K is provided on the lower surface side of the conductive member 310K. The antenna element 330K is provided on the lower surface side of the insulating member 320K.

A comparison between the antenna unit 30 of the embodiment and the antenna unit 30K of the comparative example will be described with reference to FIGS. 1 , 2 and 5 .

In the antenna portion 30K of the comparative example, since the antenna element 330K is attached to the lower surface of the insulating member 320K, the surface of the antenna element 330K facing the ground plane 312K is roughened. In this case, compared with the case where the surface of the antenna element 330K facing the ground plane 312K is not roughened, the surface of the antenna element 330K facing the ground plane 312K has a skin effect due to the skin effect. The resulting conductor loss becomes larger. On the other hand, in the antenna portion 30 of the embodiment, the surface of the antenna element 330 facing the ground plane 312 is not connected to the surface of the insulating member 320 . Therefore, the surface roughness of the surface of the antenna element 330 of the antenna portion 30 of the embodiment facing the ground plane 312 can be set to be the surface roughness of the antenna element 330K of the antenna portion 30K of the comparative example facing the ground plane 312K. The surface roughness of the surface is smaller. The conductor loss of the antenna portion is expressed by the inverse of Equation 6. In the case where the surface roughness a is used as a variable in Equation 6, in the case of no surface roughness, in other words, when a=0, the denominator of Equation 6 takes the smallest value and the Q value becomes the largest, so that the antenna The conductor loss 1/Q _c of the part is the opposite minimum. Therefore, the conductor loss of the antenna portion 30 of the embodiment can be reduced more than the conductor loss of the antenna portion 30K of the comparative example. Therefore, in the embodiment, the reduction of the antenna gain can be suppressed more than that in the comparative example.

In addition, in the antenna portion 30K of the comparative example, a dielectric loss 1/Q _d may occur due to the dielectric material, that is, the insulating member 320 between the antenna element 330K and the ground plane 312K. On the other hand, in the antenna portion 30 of the embodiment, the space between the antenna element 330 and the ground plane 312 is air. The dielectric loss is tan _δ , the reciprocal of Qd of Eq. Since the dielectric loss of air is zero, tan δ=0 in Equation 7, and the dielectric loss of the antenna portion is also zero. Therefore, the dielectric loss of the antenna portion 30 of the embodiment can be reduced more than the dielectric loss of the antenna portion 30K of the comparative example. Therefore, in the embodiment, the reduction of the antenna gain can be suppressed more than that in the comparative example.

FIG. 6 is a diagram showing the radiation pattern of the radio waves of the antenna portion 30 of the embodiment and the radiation pattern of the radio waves of the antenna portion 30K of the comparative example. In FIG. 6 , the numbers attached to the outside of the circle with scales indicate the azimuth (unit: degree) of the radiation pattern. In addition, the number attached in the direction from the center of the circle to 0 degrees indicates the gain (unit: dBi). In addition, the 0-degree direction of the radiation field pattern, that is, the positive angle (boresight) direction is the negative direction of the third direction Z. As shown in FIG.

The gain of the positive angle of the radiation pattern of the embodiment is about 3 dB higher than the gain of the positive angle of the radiation pattern of the comparative example. As a result, it means that, as described above, the conductor loss and dielectric loss of the antenna portion 30 of the embodiment are smaller than the conductor loss and dielectric loss of the antenna portion 30K of the comparative example.

7 is a graph showing the frequency characteristic of the gain of the positive angle of the antenna portion 30 of the embodiment and the frequency characteristic of the gain of the positive angle of the antenna portion 30K of the comparative example. In FIG. 7, the vertical axis of the graph shows the gain in positive angle, and the horizontal axis of the graph shows the frequency.

The gain of the positive angle of the implementation is from 26GHz to 31GHz, which is a positive gain compared to the comparative example. The horn gain is also high. As a result, it means that the conductor loss and dielectric loss of the antenna portion 30 of the embodiment have been reduced as compared with the conductor loss and dielectric loss of the antenna portion 30K of the comparative example, whereby the antenna portion 30 of the embodiment is The Q value is higher than the Q value of the antenna portion 30K of the comparative example. Thereby, the frequency band that can be used by the antenna unit 30 of the embodiment is wider than the frequency band that can be used by the antenna unit 30K of the comparative example.

FIG. 8 is a cross-sectional view of the antenna portion 30A of Modification 1. FIG. The antenna unit 30A of this modification is the same as the antenna unit 30 of the embodiment except for the following points.

The lower surface of the conductive member 310A of the antenna portion 30A is flat. The insulating member 320 is connected to the lower surface of the conductive member 310A via the spacer 360A. The spacer 360A surrounds a portion of the lower surface of the conductive member 310A when viewed from below in the vertical direction. The area surrounded by the spacer 360A in the lower surface of the conductive member 310A becomes the ground plane 312A. Thereby, at least a part of the insulating member 320 faces the ground plane 312A. In addition, the antenna element 330 is provided on the surface side of the insulating member 320 facing the ground plane 312A.

In this variation, the distance in the third direction Z between the ground plane 312A and the insulating member 320 can be adjusted by adjusting the height in the third direction Z of the spacer 360A. In this case, the distance between the ground plane 312A and the insulating member 320 can be easily adjusted compared to the case where the concave portion 314 is provided in the conductive member 310 as shown in FIG. 1 . In addition, in this modification, it is not necessary to form the concave portion 314 shown in FIG. 1 in the conductive member 310A, and the spacer 360A can be formed, for example, only by pressing sheet metal. In this case, compared to the case where the concave portion 314 is provided in the conductive member 310 as shown in FIG. 1 , the manufacturing cost of the antenna portion 30A can be suppressed.

FIG. 9 is a cross-sectional view of the inspection apparatus 10B of Modification 2. FIG. The inspection apparatus 10B of the present modification is the same as the inspection apparatus 10 of the embodiment except for the following points.

The fixing part 200B of the holding part 20B has a pressurizing part 202B, and the pressurizing part 202B is connected to the The edge contact of the upper surface of the semiconductor device 500 is made. In addition, the inner surface of the hole 210B of the fixing portion 200B has a stepped shape (a shape having a level difference) from the bottom of the hole 210B to the opening. In this case, compared with the case where the inner side surface of the hole 210 is flat in the third direction Z as shown in FIG. 1 , the deformation of the radiation field pattern of the electric wave of the semiconductor device 500 can be reduced.

The embodiments and modifications of the present invention have been described above with reference to the drawings, but these are examples of the present invention, and various configurations other than those described above may be employed.

For example, in the present embodiment, the antenna element 330 and the ground plane 312 face each other through air. However, between the antenna element 330 and the ground plane 312, a low-loss dielectric material can also be provided instead of air. Even in this case, as shown in FIG. 5 , compared with the case where the antenna element 330K is provided on the surface on the opposite side of the surface on the side where the conductive member 310K is located among the insulating members 320K, the borrowing can be reduced. Conductor losses and dielectric losses due to the skin effect of the surface of the antenna element 330 facing the ground plane 312 . Therefore, even if the antenna portion 30 of the dielectric material is provided between the antenna element 330 and the ground plane 312 , the decrease in the antenna gain can be suppressed more than the antenna portion 30K of the comparative example.

According to this specification, the following aspects are provided.

(Aspect 1)

Aspect 1 is an inspection device including:

a conductive member having a ground plane;

an insulating member, at least a part of which faces the ground plane; and

The antenna element is provided on the surface of the insulating member facing the ground plane.

According to Aspect 1, unlike the case where the antenna element is provided on the surface on the opposite side of the surface of the insulating member where the conductive member is located, the antenna element is not attached to the surface of the insulating member. Therefore, according to Aspect 1, the surface on the opposite side from the surface on the side where the conductive member is located among the insulating members is provided. When the antenna element is provided, the conductor loss due to the skin effect of the surface of the antenna element facing the ground plane can be reduced. Therefore, according to Aspect 1, compared with the case where the antenna element is provided on the surface on the opposite side of the surface on the side where the conductive member is located among the insulating members, the reduction of the antenna gain can be suppressed.

(Aspect 2)

Aspect 2 is the inspection apparatus described in Aspect 1, wherein the antenna element and the ground plane face each other with air interposed therebetween.

According to Aspect 2, compared to the case where the antenna element and the ground plane face each other through a dielectric material, the dielectric constant and the dielectric loss between the antenna element and the ground plane can be reduced. Therefore, according to the aspect 2, the reduction of the antenna gain can be suppressed compared to the case where the antenna element and the ground plane face each other with a dielectric material interposed therebetween.

(Aspect 3)

Aspect 3 is the inspection device according to Aspect 1 or 2, wherein the ground plane is a bottom surface of a recess provided on the conductive member.

According to Aspect 3, the number of parts of the antenna portion can be reduced compared to the case where the ground plane and the antenna element are separated by using the spacer disposed between the conductive member and the insulating member.

This application claims priority based on Japanese Patent Application No. 2020-143160 for which it applied on August 27, 2020, and the entire disclosure of the Japanese application is incorporated herein by reference.

10: Check the device

20: Keeping Department

30: Antenna part

110: Inspection substrate

120: socket

200: Fixed part

202: Pressurization Department

210: Hole

310: Conductive components

312: Ground plane

314: Recess

320: Insulation components

330: Antenna Element

342: First Stripline

352: first through hole

500: Semiconductor Devices

X: first direction

Y: the second direction

Z: third direction

Claims (3)

An inspection device is provided with: a conductive member having a ground plane; an insulating member, at least a part of which faces the ground plane; and The antenna element is disposed on the surface of the insulating member facing the ground plane. The inspection apparatus according to claim 1, wherein the antenna element and the ground plane face each other through air. The inspection device according to claim 1 or 2, wherein the ground plane is a bottom surface of a recess provided on the conductive member.

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