TW202206554A - Resin composition, film, optical filter, solid-state image sensor, image display device, resin, and compound - Google Patents

Abstract

Provided is a resin composition that contains a color material A containing a colorant, a resin B, and a solvent C, said resin B including a resin b-1 that includes structural units represented by formula (1). Further provided are a film that uses the resin composition, an optical filter, a solid-state image sensor, an image display device, a resin, and a compound. In formula (1): X1 represents a 4+n-valent linking group; X2 represents single bond or divalent linking group; R11, R12, R21, and R22 each independently represent a hydrogen atom or a substituent; Lp1 represents divalent linking group; P1 represents a polymer chain; and n represents an integer of 1 or more.

Description

Resin composition, film, optical filter, solid-state imaging device, image display device, resin and compound

The present invention relates to a resin composition, film, optical filter, solid-state imaging element, image display device, resin and compound.

In recent years, with the spread of digital cameras, mobile phones with cameras, and the like, the demand for solid-state imaging devices such as charge-coupled device (CCD) image sensors has increased significantly. A film containing a pigment such as a color filter is used in a solid-state imaging element. A film containing a color material such as a color filter is produced using a resin composition or the like containing a pigment, a resin, and a solvent.

For example, Patent Document 1 describes the invention of a resin composition containing a pigment, a dispersant, a binder resin, an epoxy compound and a solvent and containing the following dispersant (X): the dispersant has a selected A polyester moiety X1' having a carboxyl group obtained by reacting an acid anhydride group in an acid anhydride (b) of one or more tetracarboxylic acid anhydrides (b1) and tricarboxylic acid anhydrides (b2) with a hydroxyl group in the hydroxyl group-containing compound (a), and The vinyl polymer moiety X2' which is obtained by radically polymerizing the ethylenically unsaturated monomer (c) and has a thermally crosslinkable functional group, the thermally crosslinkable functional group is selected from the group consisting of hydroxyl, oxetanyl , at least one of the group consisting of tertiary butyl group, blocked isocyanate group and (meth)acryloyl group.

[Patent Document 1] Japanese Patent Laid-Open No. 2016-170325

In the resin composition comprising the pigment, the resin and the solvent, it is preferable that the dispersibility of the pigment is good. When the dispersibility of the pigment is insufficient, the pigment aggregates in the resin composition and becomes coarse, or the viscosity of the resin composition tends to increase. Furthermore, even if the viscosity of the resin composition immediately after production is low, the viscosity may increase with the passage of time.

According to the research of the present inventors, in the resin composition described in Patent Document 1, the dispersibility of the pigment is also insufficient, and there is room for further improvement.

Therefore, the objective of this invention is to provide the resin composition which is excellent in the dispersibility of a pigment. Another object of the present invention is to provide a film, an optical filter, a solid-state imaging element, and an image display device using the resin composition. Another object of the present invention is to provide a resin.

式（1）中，X¹ 表示4+n價連結基， X² 表示單鍵或2價連結基。 R¹¹ 、R¹² 、R²¹ 及R²² 分別獨立地表示氫原子或取代基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數。 ＜2＞如＜1＞所述之樹脂組成物，其中 上述式（1）的Lp¹ 所表示之2價連結基係包含硫原子之基團。 ＜3＞如＜1＞或＜2＞所述之樹脂組成物，其中 上述式（1）的X¹ 係包含芳香族烴環之基團。 ＜4＞如＜1＞至＜3＞之任一項所述之樹脂組成物，其中 上述式（1）的X² 係包含氟原子及芳香族烴環之基團。 ＜5＞如＜1＞至＜4＞之任一項所述之樹脂組成物，其中 上述P¹ 所表示之聚合物鏈包含選自聚（甲基）丙烯酸結構、聚苯乙烯結構、聚醚結構及聚酯結構中之至少1種結構的重複單元。 ＜6＞如＜1＞至＜4＞之任一項所述之樹脂組成物，其中 上述P¹ 所表示之聚合物鏈包含由式（P1-1）～式（P1-6）中的任一個表示之重複單元， [化學式2]

式中，R^G1 及R^G2 分別表示伸烷基， R^G3 表示氫原子、甲基、氟原子、氯原子或羥甲基， Q^G1 表示-O-或-NR^q -，R^q 表示氫原子、烷基、芳基或雜環基， L^G1 表示單鍵或伸芳基， L^G2 表示單鍵或2價連結基， R^G4 表示氫原子或取代基， R^G5 表示氫原子或甲基，R^G6 表示芳基。 ＜7＞如＜6＞所述之樹脂組成物，其中 由R^G4 表示之取代基係選自含有乙烯性不飽和鍵之基團、環氧基、氧雜環丁基及三級丁基中之至少1種。 ＜8＞如＜1＞至＜7＞之任一項所述之樹脂組成物，其中 由上述式（1）表示之結構係由式（1-1）表示之結構， [化學式3]

式（1-1）中，X¹¹ 及X¹² 分別獨立地表示烴基， X¹³ 表示2+n價連結基， Lx¹¹ 及Lx¹² 分別獨立地表示單鍵或2價連結基， X² 表示單鍵或2價連結基。 R¹¹ 、R¹² 、R²¹ 及R²² 分別獨立地表示氫原子或取代基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數。 ＜9＞如＜8＞所述之樹脂組成物，其中 上述式（1-1）的X¹¹ 及X¹² 所表示之烴基係芳香族烴基。 ＜10＞如＜1＞至＜7＞之任一項所述之樹脂組成物，其中 由上述式（1）表示之結構係由式（1-2）表示之結構， [化學式4]

式（1-2）中，X¹³ 表示2+n價連結基， X² 表示單鍵或2價連結基。 R¹¹ 及R¹² 分別獨立地表示氫原子或取代基， Rx¹ 及Rx² 分別獨立地表示取代基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數， m1表示0～3的整數， m2表示0～3的整數。 ＜11＞如＜1＞至＜10＞之任一項所述之樹脂組成物，其中 上述樹脂b-1進一步包含由式（2）表示之結構， [化學式5]

式（2）中，X¹⁰¹ 表示2+m價連結基，X¹⁰² 表示2價連結基，m表示1～4的整數。 ＜12＞如＜1＞至＜7＞之任一項所述之樹脂組成物，其中 上述樹脂b-1係由式（1A）表示之結構的樹脂， [化學式6]

式（1A）中，X¹ 表示4+n價連結基， X^2a 表示單鍵， R¹¹ 、R¹² 、R²¹ 及R²² 分別獨立地表示氫原子或取代基， R^N1 及R^N2 分別獨立地表示烷基、芳基或雜環基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數。 ＜13＞如＜1＞至＜12＞之任一項所述之樹脂組成物，其中 上述溶劑C包含選自酯系溶劑、醚系溶劑、醇系溶劑及酮系溶劑中之至少1種。 ＜14＞如＜1＞至＜13＞之任一項所述之樹脂組成物，其中 上述色材A包含選自二酮吡咯并吡咯顏料及酞菁顏料中之至少1種。 ＜15＞如＜1＞至＜14＞之任一項所述之樹脂組成物，其進一步包含聚合性單體。 ＜16＞如＜1＞至＜15＞之任一項所述之樹脂組成物，其進一步包含光聚合起始劑。 ＜17＞一種膜，其使用＜1＞至＜16＞之任一項所述之樹脂組成物來獲得。 ＜18＞一種濾光器，其具有＜17＞所述之膜。 ＜19＞一種固體攝像元件，其具有＜17＞所述之膜。 ＜20＞一種圖像顯示裝置，其具有＜17＞所述之膜。 ＜21＞一種樹脂，其包含由式（1）表示之結構， [化學式7]

式（1）中，X¹ 表示4+n價連結基， X² 表示單鍵或2價連結基。 R¹¹ 、R¹² 、R²¹ 及R²² 分別獨立地表示氫原子或取代基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數。 ＜22＞一種化合物，其由式（MM1）表示， [化學式8]

式（MM1）中，X^1M 表示2+n價連結基， 上述2+n價連結基係烴基或藉由單鍵或連結基將2個以上的烴基鍵結之基團，上述連結基係-NR^M -、-N＜、-SO-、-SO₂ -、-CO-、-O-、-COO-、-OCO-、-S-、-NR^M CO-、-CONR^M -或-C（CF₃ ）₂ -， Rx^1M 及Rx^2M 分別獨立地表示鹵素原子、烷基、羧基或羥基， Lp^1M 表示烴基、-NR^M -、-SO-、-SO₂ -、-CO-、-O-、-COO-、-OCO-、-S-、-NR^M CO-、-CONR^M -或組合該等中的2個以上而成之基團， R^M 表示氫原子、烷基、芳基或雜環基， P^1M 表示包含由式（P1-1）～式（P1-4）中的任一個表示之重複單元之聚合物鏈， n表示1以上的整數， m1表示0～3的整數， m2表示0～3的整數， [化學式9]

式（P1-1）～式（P1-4）中，R^G1 及R^G2 分別表示伸烷基。 [發明效果]Hereinafter, examples of typical embodiments of the present invention are shown. <1> A resin composition comprising a pigment-containing color material A, a resin B, and a solvent C, the resin B comprising a resin b-1 having a structure represented by formula (1), [Chemical formula 1]

In formula (1), X ¹ represents a 4+n-valent linking group, and X ² represents a single bond or a divalent linking group. R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more. <2> The resin composition according to <1>, wherein the divalent linking group represented by Lp ¹ of the above formula (1) is a group containing a sulfur atom. <3> The resin composition according to <1> or <2>, wherein X ¹ of the above formula (1) is a group containing an aromatic hydrocarbon ring. <4> The resin composition according to any one of <1> to <3>, wherein X ² of the above formula (1) is a group containing a fluorine atom and an aromatic hydrocarbon ring. <5> The resin composition according to any one of <1> to <4>, wherein the polymer chain represented by the above P ¹ comprises a structure selected from the group consisting of poly(meth)acrylic acid, polystyrene, polyether A repeating unit of at least one of a structure and a polyester structure. <6> The resin composition according to any one of <1> to <4>, wherein the polymer chain represented by the above P ¹ contains any of the formulas (P1-1) to (P1-6) A repeating unit of representation, [Chem. 2]

In the formula, R ^G1 and R ^G2 respectively represent an alkylene group, R ^G3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a hydroxymethyl group, Q ^G1 represents -O- or -NR ^q -, and R ^q represents a hydrogen atom , alkyl, aryl or heterocyclic group, L ^G1 represents a single bond or extended aryl group, L ^G2 represents a single bond or a divalent linking group, R ^G4 represents a hydrogen atom or a substituent, R ^G5 represents a hydrogen atom or a methyl group, R ^G6 represents an aryl group. <7> The resin composition according to <6>, wherein the substituent represented by R ^G4 is selected from a group containing an ethylenically unsaturated bond, an epoxy group, an oxetanyl group and a tertiary butyl group at least one of them. <8> The resin composition according to any one of <1> to <7>, wherein the structure represented by the above formula (1) is a structure represented by the formula (1-1), [Chemical formula 3]

In formula (1-1), X ¹¹ and X ¹² each independently represent a hydrocarbon group, X ¹³ represents a 2+n-valent linking group, Lx ¹¹ and Lx ¹² each independently represent a single bond or a divalent linking group, and X ² represents a monovalent linking group. bond or divalent linking group. R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more. <9> The resin composition according to <8>, wherein the hydrocarbon group represented by X ¹¹ and X ¹² in the above formula (1-1) is an aromatic hydrocarbon group. <10> The resin composition according to any one of <1> to <7>, wherein the structure represented by the above formula (1) is a structure represented by the formula (1-2), [Chemical formula 4]

In formula (1-2), X ¹³ represents a 2+n-valent linking group, and X ² represents a single bond or a divalent linking group. R ¹¹ and R ¹² each independently represent a hydrogen atom or a substituent, Rx ¹ and Rx ² each independently represent a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, n represents an integer of 1 or more, m1 represents an integer from 0 to 3, and m2 represents an integer from 0 to 3. <11> The resin composition according to any one of <1> to <10>, wherein the resin b-1 further comprises a structure represented by formula (2), [Chemical formula 5]

In formula (2), X ¹⁰¹ represents a 2+m-valent linking group, X ¹⁰² represents a divalent linking group, and m represents an integer of 1-4. <12> The resin composition according to any one of <1> to <7>, wherein the above-mentioned resin b-1 is a resin having a structure represented by formula (1A), [Chemical formula 6]

In formula (1A), X ¹ represents a 4+n-valent linking group, X ^2a represents a single bond, R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, and R ^N1 and R ^N2 each independently represents an alkyl group, an aryl group or a heterocyclic group, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more. <13> The resin composition according to any one of <1> to <12>, wherein the solvent C contains at least one selected from the group consisting of ester-based solvents, ether-based solvents, alcohol-based solvents, and ketone-based solvents. <14> The resin composition according to any one of <1> to <13>, wherein the color material A contains at least one selected from the group consisting of a diketopyrrolopyrrole pigment and a phthalocyanine pigment. <15> The resin composition according to any one of <1> to <14>, which further contains a polymerizable monomer. <16> The resin composition according to any one of <1> to <15>, further comprising a photopolymerization initiator. <17> A film obtained using the resin composition according to any one of <1> to <16>. <18> An optical filter having the film described in <17>. <19> A solid-state imaging element having the film described in <17>. <20> An image display device having the film described in <17>. <21> A resin comprising a structure represented by formula (1), [Chemical formula 7]

In formula (1), X ¹ represents a 4+n-valent linking group, and X ² represents a single bond or a divalent linking group. R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more. <22> A compound represented by formula (MM1), [Chemical formula 8]

In formula (MM1), X ^1M represents a 2+n-valent linking group, the above-mentioned 2+n-valent linking group is a hydrocarbon group or a group in which two or more hydrocarbon groups are bonded by a single bond or a linking group, and the above-mentioned linking group is - NR ^M -, -N<, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^M CO-, -CONR ^M - or -C (CF ₃ ) ₂ -, Rx ^1M and Rx ^2M each independently represent a halogen atom, an alkyl group, a carboxyl group or a hydroxyl group, Lp ^1M represents a hydrocarbon group, -NR ^M -, -SO-, -SO ₂ -, -CO-, - O-, -COO-, -OCO-, -S-, -NR ^M CO-, -CONR ^M - or a group formed by combining two or more of these, R ^M represents a hydrogen atom, an alkyl group, an aryl group group or heterocyclic group, P ^1M represents a polymer chain including a repeating unit represented by any one of formulas (P1-1) to (P1-4), n represents an integer of 1 or more, m1 represents 0-3 Integer, m2 represents an integer from 0 to 3, [Chemical formula 9]

In formula (P1-1) to formula (P1-4), R ^G1 and R ^G2 each represent an alkylene group. [Inventive effect]

ADVANTAGE OF THE INVENTION According to this invention, the resin composition excellent in the dispersibility of a pigment can be provided. Furthermore, a film, an optical filter, a solid-state imaging element, and an image display device using the resin composition can be provided. Also, a resin can be provided.

Hereinafter, main embodiments of the present invention will be described. However, the present invention is not limited to the illustrated embodiments. In this specification, "-" is used in the meaning including the numerical value described before and after it as a lower limit and an upper limit. In the notation of groups (atomic groups) in this specification, the notation of substituted and unsubstituted not only includes groups (atomic groups) without substituents, but also groups with substituents (atomic groups). For example, "alkyl" includes not only unsubstituted alkyl groups (unsubstituted alkyl groups), but also substituted alkyl groups (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light, but also drawing using particle beams such as electron beams and ion beams. Moreover, as light used for exposure, the bright-line spectrum of a mercury lamp, far-ultraviolet, extreme ultraviolet (EUV light), X-rays, electron beams, and other actinic rays represented by excimer lasers, or radiation can be mentioned. In this specification, (meth)allyl represents both or either of allyl and methallyl, and "(meth)acrylate" represents both or either of acrylate and methacrylate , "(meth)acrylic acid" represents both or either of acrylic acid and methacrylic acid, and "(meth)acrylic acid" represents both or either of acrylonitrile and methacrylic acid. In this specification, the weight average molecular weight and the number average molecular weight are the polystyrene conversion values measured by the GPC (gel permeation chromatography) method. In this specification, near-infrared rays refer to light having a wavelength of 700 to 2500 nm. In this specification, the total solid content refers to the total mass of the components excluding the solvent from all the components of the composition. In this specification, the term "step" includes not only an independent step, but also in the case where it cannot be clearly distinguished from other steps, as long as the intended effect of the step is achieved. In this specification, a pigment refers to a compound that is not easily dissolved in a solvent. In this specification, the symbols (such as A, etc.) appended before or after the name are terms used to distinguish the constituent elements, and do not limit the types of constituent elements, the number of constituent elements, and the pros and cons of constituent elements.

<Resin composition> The resin composition of the present invention includes a pigment-containing color material A, a resin B, and a solvent C, wherein the resin B includes a resin b-1 (hereinafter, also referred to as a specific resin) having a structure represented by the formula (1). ).

The resin composition of the present invention is excellent in pigment dispersibility. The detailed reason for obtaining such an effect is not clear, but it is presumed as follows: the specific resin has ^an amide group (-C(=O)-NR ²¹ -, -C( =O)-NR ²² -) structure, so the adsorption of the specific resin on the surface of the pigment is promoted, and because the specific resin has a polymer chain P ¹ , the polymer chain P ¹ becomes a steric exclusion group and can inhibit the pigment Mutual aggregation etc. As a result, it can be used as a resin composition excellent in pigment dispersibility.

In addition, by using the resin composition of the present invention, it is possible to form a film having excellent heat resistance that is not easily decomposed even at high temperatures and that film shrinkage is unlikely to occur even after heat treatment at high temperatures. Therefore, after forming a film using the resin composition of the present invention, even if the obtained film is heat-treated at a high temperature (for example, 300° C. or higher), the shrinkage of the film is suppressed, and even when other films such as inorganic films are formed on the film, The generation of cracks and the like in other films can also be suppressed. Therefore, according to the resin composition of the present invention, it is possible to widen the process window of the steps after film production.

When the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200° C. for 30 minutes, the thickness of the film after heat-processing the film at 300° C. for 5 hours in a nitrogen atmosphere is the thickness of the film before the heat treatment. The thickness is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Further, the thickness of the film after heat treatment at 350° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before the heat treatment, more preferably 80% or more, and further more preferably 90% or more. good. Further, the thickness of the film after heat treatment at 400° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before the heat treatment, more preferably 80% or more, and still more preferably 90% or more. good. The above physical properties can be achieved by adjusting the type and content of the specific resin to be used.

Furthermore, when the resin composition of the present invention was used to form a film having a thickness of 0.60 μm by heating at 200° C. for 30 minutes, and the above-mentioned film was heat-treated at 300° C. for 5 hours in a nitrogen atmosphere, the lowering of the film after heat treatment The change rate ΔA of the absorbance represented by the formula (A1) is preferably 50% or less, more preferably 45% or less, further preferably 40% or less, and particularly preferably 35% or less. ΔA（%）=|100-（A2/A1）×100|･･････（A1） ΔA is the rate of change of the absorbance of the film after heat treatment, A1 is the maximum value of the absorbance of the film before heat treatment in the wavelength range of 400 to 1100 nm, A2 is the absorbance of the film after the heat treatment, and is the absorbance at the wavelength at which the film before the heat treatment shows the maximum value of the absorbance in the range of 400 to 1100 nm in wavelength. The above physical properties can be achieved by adjusting the type and content of the specific resin to be used.

Furthermore, when the resin composition of the present invention is used and heated at 200° C. for 30 minutes to form a film having a thickness of 0.60 μm, the above-mentioned film exhibits a wavelength λ1 of the maximum value of the absorbance in the wavelength range of 400 to 1100 nm, and the above-mentioned film is placed in the The absolute value of the difference between the wavelengths λ2 at which the film after heat treatment at 300°C for 5 hours in a nitrogen atmosphere is preferably 50 nm or less, more preferably 45 nm or less, and even more preferably 40 nm or less. The above physical properties can be achieved by adjusting the type and content of the specific resin to be used.

In addition, when the resin composition of the present invention was used to form a film having a thickness of 0.60 μm by heating at 200° C. for 30 minutes, and the above-mentioned film was heat-treated at 300° C. for 5 hours in a nitrogen atmosphere, the film after the heat treatment had a wavelength of 400°C. The maximum value of the absorbance change rate ΔA _λ in the range of ~1100 nm is preferably 30% or less, more preferably 27% or less, and still more preferably 25% or less. In addition, the change rate of absorbance is a value calculated by following formula (2). ΔA _λ =|100-(A2 _λ /A1 _λ )×100|･･････(2) ΔA _λ is the change rate of the absorbance at wavelength λ of the film after heat treatment, A1 _λ is the change rate of the film before heat treatment The absorbance of the film at wavelength λ, A2 _λ is the absorbance of the film after heat treatment at wavelength λ. The above physical properties can be achieved by adjusting the type and content of the specific resin to be used.

The resin composition of the present invention can be preferably used as a resin composition for optical filters. As an optical filter, a color filter, a near-infrared transmission filter, a near-infrared cut filter, etc. are mentioned, A color filter is preferable. Further, the resin composition of the present invention can be preferably used as a resin composition for solid-state imaging elements, and can be preferably used as a resin composition for pixel formation of filters used in solid-state imaging elements.

Examples of the color filter include filters having colored pixels that transmit light of a specific wavelength, and include at least one coloring selected from the group consisting of red pixels, blue pixels, green pixels, yellow pixels, cyan pixels, and magenta pixels. Pixel filters are preferred. The color filter can be formed using a resin composition containing a color material.

As a near-infrared cut filter, the filter which exists in the wavelength range of 700-1800nm with a maximum absorption wavelength is mentioned. It is preferable that the maximum absorption wavelength of the near-infrared cut filter exists within a wavelength range of 700 to 1300 nm, and it is more preferable to exist within a wavelength range of 700 to 1100 nm. In addition, the transmittance of the near-infrared cut filter in the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Moreover, it is preferable that the transmittance of at least 1 place in the wavelength range of 700-1800nm is 20% or less. In addition, the ratio of the absorbance Amax at the maximum absorption wavelength of the near-infrared cutoff filter to the absorbance A550 at the wavelength 550nm, that is, the absorbance Amax/absorbance A550 is preferably 20 to 500, more preferably 50 to 500, and 70 to 450. More preferably, 100-400 is particularly preferred. The near-infrared cut filter can be formed using a resin composition containing a near-infrared absorbing color material.

The near-infrared transmission filter is a filter that transmits at least a part of near-infrared rays. The near-infrared transmission filter is preferably a filter that shields at least part of visible light but transmits at least part of near-infrared light. As the near-infrared transmission filter, the maximum value of the transmittance in the wavelength range of 400 to 640 nm is preferably 20% or less (preferably 15% or less, more preferably 10% or less), The minimum value of the transmittance in the range of 1100 to 1300 nm is a filter with spectral characteristics of 70% or more (preferably 75% or more, more preferably 80% or more). The near-infrared transmission filter is preferably a filter satisfying any one of the following spectral characteristics (1) to (5). (1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 800 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). (2): The maximum value of transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 900 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). (3): The maximum value of transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1000 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). (4): The maximum value of transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1100 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). (5): The maximum value of transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1200 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%).

As a preferable aspect of the spectroscopic characteristics possessed by the resin composition of the present invention, when a film having a thickness of 5 μm is formed using the resin composition, the light transmittance in the thickness direction of the film is satisfied in the wavelength The maximum value in the range of 360 to 700 nm is more than 50% of the spectral characteristics. A resin composition satisfying such spectral characteristics can be preferably used as a resin composition for pixel formation of a color filter. Specifically, it can be preferably used as a resin composition for forming a colored pixel selected from a red pixel, a blue pixel, a green pixel, a yellow pixel, a cyan pixel, and a magenta pixel.

It is preferable that the resin composition possessing the above-mentioned spectroscopic properties contains a color material. For example, a resin composition containing a red color material and a yellow color material can be preferably used as the resin composition for forming a red pixel. Moreover, the resin composition containing a blue color material and a purple color material can be used suitably as the resin composition for blue pixel formation. Moreover, the resin composition containing a green color material can be used suitably as the resin composition for green or cyan pixel formation. When the resin composition is used as the resin composition for green pixel formation, it is also preferable to further contain a yellow color material in addition to the green color material.

Another preferable aspect of the spectral characteristics possessed by the resin composition of the present invention is the ratio of the minimum value Amin satisfying the absorbance within the wavelength range of 400 to 640 nm and the absorbance B at a wavelength of 1500 nm, that is, Amin/ B series is an aspect of spectral characteristics of 5 or more. A resin composition satisfying such spectroscopic properties can be preferably used as a resin composition for forming a near-infrared transmission filter. The ratio of the above-mentioned absorbance, that is, the value of Amin/B is preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more.

Here, the absorbance Aλ at the wavelength λ is defined according to the following formula (λ1). Aλ=-log(Tλ/100)･･････(λ1) Aλ is the absorbance at the wavelength λ, and Tλ is the transmittance (%) at the wavelength λ. In the present invention, the value of absorbance may be a value measured in a solution state, or may be a value of a film formed using the composition. When measuring the absorbance in the state of a film, it is preferable to use a film obtained by applying the composition on a glass substrate by a method such as spin coating and drying at 100° C. for 120 seconds using a hot plate or the like.

The resin composition of the present invention preferably satisfies any one of the following spectroscopic properties (Ir1) to (Ir5). (Ir1): The ratio of the minimum value A1 of the absorbance within the wavelength range of 400 to 640 nm to the maximum value B1 of the absorbance within the wavelength range of 800 to 1500 nm, that is, the value of A1/B1 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is more preferable. According to this aspect, it is possible to form a film that shields light within a wavelength range of 400 to 640 nm and transmits light with a wavelength greater than 750 nm. (Ir2): The ratio of the minimum value A2 of the absorbance within the wavelength range of 400 to 750 nm to the maximum value B2 of the absorbance within the wavelength range of 900 to 1500 nm, that is, the value of A2/B2 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is more preferable. According to this aspect, it is possible to form a film that shields light within a wavelength range of 400 to 750 nm and transmits light with a wavelength greater than 850 nm. (Ir3): The ratio of the minimum value A3 of the absorbance within the wavelength range of 400 to 830 nm to the maximum value B3 of the absorbance within the wavelength range of 1000 to 1500 nm, that is, the value of A3/B3 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is more preferable. According to this aspect, it is possible to form a film that shields light within a wavelength range of 400 to 830 nm and transmits light with a wavelength greater than 950 nm. (Ir4): The ratio of the minimum value A4 of the absorbance within the wavelength range of 400 to 950 nm to the maximum value B4 of the absorbance within the wavelength range of 1100 to 1500 nm, that is, the value of A4/B4 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is more preferable. According to this aspect, it is possible to form a film that shields light within a wavelength range of 400 to 950 nm and transmits light with a wavelength greater than 1050 nm. (Ir5): The ratio of the minimum value A5 of the absorbance within the wavelength range of 400 to 1050 nm to the maximum value B5 of the absorbance within the wavelength range of 1200 to 1500 nm, that is, the value of A5/B5 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is more preferable. According to this aspect, it is possible to form a film that shields light within a wavelength range of 400 to 1050 nm and transmits light with a wavelength greater than 1150 nm.

It is also preferable that the resin composition of the present invention is used for patterning by photolithography. According to this aspect, fine-sized pixels can be easily formed. Therefore, in particular, it can be preferably used as a resin composition for forming a pixel of an optical filter used in a solid-state imaging element. For example, a component containing a group containing an ethylenically unsaturated bond (for example, a resin containing a group containing an ethylenically unsaturated bond, a monomer containing a group containing an ethylenically unsaturated bond) and photopolymerization initiation The resin composition of the agent can be preferably used as a resin composition for patterning by photolithography. It is also preferable that the resin composition for patterning by photolithography further contains an alkali-soluble resin.

The resin composition of the present invention can also be used as a resin composition for forming a black matrix or a resin composition for forming a light-shielding film.

Hereinafter, each component of the resin composition used in the present invention will be described.

＜Color A＞ The resin composition of the present invention contains a color material A (hereinafter, referred to as a color material). As a color material, a white color material, a black color material, a chromatic color material, and a near-infrared absorption color material are mentioned. In addition, in the present invention, the white color material includes not only pure white, but also a color material of bright gray (eg, off-white, thin gray, etc.) close to white.

The color material preferably includes at least one selected from the group consisting of a color color material, a black color material and a near-infrared absorbing color material, including at least one selected from the group including a color color material and a near-infrared absorbing color material One is more preferable, it is further preferable to include a color material, and it is further preferable to include at least one color material selected from the group consisting of a red color material, a yellow color material, a blue color material, and a purple color material.

Moreover, it is preferable that a color material contains a color color material and a near-infrared absorption color material, and it is also preferable that it contains two or more types of color color materials and a near-infrared absorption color material. In addition, black can be formed by a combination of two or more color materials. Moreover, it is also preferable that the color material includes a black color material and a near-infrared absorbing color material. According to these aspects, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. Regarding the combination of two or more color materials to form a black color material, reference can be made to JP 2013-077009 A, JP 2014-130338 A, International Publication No. 2015/166779, and the like.

As the color material contained in the coloring composition of the present invention, one containing a pigment can be used. The pigment may be either an inorganic pigment or an organic pigment, but from the viewpoints of many color changes, ease of dispersion, safety, and the like, an organic pigment is preferred. Moreover, it is preferable that a pigment contains at least 1 sort(s) chosen from a color pigment and a near-infrared absorption pigment, and it is more preferable that a color pigment is included.

In addition, the pigment includes a pigment selected from the group consisting of phthalocyanine pigments, bismuth pigments, quinacridone pigments, anthraquinone pigments, perylene pigments, azo pigments, diketopyrrolopyrrole pigments, pyrrolopyrrole pigments, isoindoline pigments and quinoline pigments At least one kind of yellow pigment is preferred, and at least one kind selected from the group consisting of phthalocyanine pigment, diketopyrrolopyrrole pigment and pyrrolopyrrole pigment is more preferred, including phthalocyanine pigment or diketopyrrolopyrrole pigment for further better. In addition, phthalocyanine pigments are phthalocyanine pigments that do not have a central metal or phthalocyanine pigments that have copper or zinc as the central metal, because they are easy to form a film whose spectral properties are not easily changed even after being heated to a high temperature (for example, 300°C or higher). Cyanine pigments are preferred.

The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, and more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. As long as the average primary particle diameter of the pigment is within the above-mentioned range, the dispersion stability of the pigment in the resin composition will be favorable. Moreover, in this invention, the primary particle diameter of a pigment can be calculated|required based on the obtained photograph by observing the primary particle of a pigment with a transmission electron microscope. Specifically, the projected area of the primary particles of the pigment is obtained, and the equivalent circle diameter corresponding thereto is calculated as the primary particle diameter of the pigment. In addition, let the average primary particle diameter in this invention be the arithmetic mean value of the primary particle diameter of the primary particle with respect to 400 pigments. In addition, the primary particles of the pigment refer to unagglomerated independent particles.

(color material) As a color material, the color material which has a maximum absorption wavelength in the range of wavelength 400-700 nm is mentioned. For example, a yellow color material, an orange color material, a red color material, a green color material, a purple color material, a blue color material, etc. are mentioned. From the viewpoint of heat resistance, color pigments (color pigments) are preferable, red pigments, yellow pigments, and blue pigments are more preferable, and red pigments and blue pigments are further preferable. As a specific example of a color pigment, what is shown below is mentioned, for example.

CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36 , 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97 , 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139 , 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179 , 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232 (methine), 233 (quinoline), 234 (amino ketone) ), 235 (amino ketone series), 236 (amino ketone series), etc. (the above are yellow pigments), CI Pigment Orange 2, 5, 13, 16, 17: 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73 etc. (above, orange pigment), CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4 , 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3 , 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184 , 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 269, 270, 272, 279, 291 , 294 (𠮿 mouth galaxy, Organo Ultramarine (organic ultramarine), Bluish Red (blue red)), 295 (monoazo), 296 (disazo), 297 (amino ketone), etc. (the above are red pigments ), C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64 (phthalocyanine), 65 (phthalocyanine), 66 (phthalocyanine), etc. (above, green pigment), C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60 (triarylmethane series), 61 (𠮿kou galaxy), etc. (above, purple pigment), CI Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (monoazo series), 88 (methine series), etc. (the above are blue pigments).

Among these color pigments, the red pigments include CI Pigment Red 254, CI Pigment Red 264, and CI Pigment Red 272 because it is easy to form a film whose spectroscopic properties are not easily changed after heating to a high temperature (for example, 300°C or higher). , CI Pigment Red 122, CI Pigment Red 177 are preferred. Moreover, as a blue pigment, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:6, and C.I. Pigment Blue 16 are preferable.

In addition, as the green pigment, halogenated zinc phthalein having an average number of halogen atoms of 10 to 14, an average number of bromine atoms of 8 to 12, and an average number of chlorine atoms of 2 to 5 can also be used in one molecule. cyanine pigments. Specific examples include the compounds described in International Publication No. WO 2015/118720. In addition, as the green pigment, the compound described in the specification of Chinese Patent Application No. 106909027, the phthalocyanine compound having a phosphoric acid ester as a ligand described in International Publication No. 2012/102395, and Japanese Patent Laid-Open No. 2019-008014 can also be used The phthalocyanine compound described in the publication, the phthalocyanine compound described in JP 2018-180023 A, the compound described in JP 2019-038958 A, and the like.

Moreover, as a blue pigment, the aluminum phthalocyanine compound which has a phosphorus atom can also be used. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A-2012-247591 and paragraphs 0047 of JP-A-2011-157478.

In addition, as the yellow pigment, the compounds described in JP 2017-201003 A, the compounds described in JP 2017-197719 A, and 0011-0062 and 0137-1 in JP 2017-171912 A can also be used. Compounds described in paragraph 0276, compounds described in paragraphs 0010 to 0062 and 0138 to 0295 of JP 2017-171913 A, compounds described in paragraphs 0011 to 0062 and 0139 to 0190 of JP 2017-171914 , Compounds described in paragraphs 0010 to 0065 and 0142 to 0222 of JP 2017-171915 A, quinoline yellow compounds described in paragraphs 0011 to 0034 of JP 2013-054339 A, JP 2014-026228 The quinoline yellow compound described in paragraphs 0013 to 0058 of Gazette No. 2018-062644, the isoindoline compound described in JP 2018-062644 A, the quinoline yellow compound described in JP 2018-203798 A, The quinoline yellow compound described in KOKAI Publication No. 2018-062578, the quinoline yellow compound described in JP 6432076 A, the quinoline yellow compound described in JP 2018-155881 A, JP 2018-111757 The quinoline yellow compound described in JP 2018-040835 A, the quinoline yellow compound described in JP 2017-197640 A, JP 2016-145282 A The quinoline yellow compound described in JP 2014-085565 A, the quinoline yellow compound described in JP 2014-021139 A, the quinoline yellow compound described in JP 2013-209614 A The quinoline yellow compound, the quinoline yellow compound described in JP 2013-209435 A, the quinoline yellow compound described in JP 2013-181015 A, the quinoline yellow compound described in JP 2013-061622 A The quinoline yellow compound, the quinoline yellow compound described in JP 2013-032486 A, the quinoline yellow compound described in JP 2012-226110 A, the quinoline yellow compound described in JP 2008-074987 A Compounds, the quinoline yellow compound described in JP 2008-081565 A, the quinoline yellow compound described in JP 2008-074986 A, the quinoline yellow compound described in JP 2008-074985 A, The quinoline yellow compound described in Japanese Patent Laid-Open No. 2008-050420, the quinoline yellow compound described in Japanese Patent Laid-Open No. 2008-031281, The quinoline yellow compound described in Japanese Patent Publication No. Sho 48-032765, the quinoline yellow compound described in Japanese Patent Laid-Open No. 2019-008014, the quinoline yellow compound described in Japanese Patent No. 6607427, the Korean Laid-Open Patent Publication No. The compound described in 10-2014-0034963, the compound described in JP 2017-095706, the compound described in Taiwan Patent Application Publication No. 201920495, the compound described in Japanese Patent No. 6607427, the Japanese The quinoline yellow dimer described in JP-A No. 2020-033521, the compound represented by the following formula (QP1), and the compound represented by the following formula (QP2). In addition, from the viewpoint of improving the color value, those compounds that have been polymerized can also be preferably used. [Chemical formula 10]

In formula (QP1), X ¹ to X ¹⁶ each independently represent a hydrogen atom or a halogen atom, and Z ¹ represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by the formula (QP1) include the compounds described in paragraph 0016 of Japanese Patent No. 6443711. [Chemical formula 11]

In formula (QP2), Y ¹ to Y ³ each independently represent a halogen atom. n and m represent an integer of 0 to 6, and p represents an integer of 0 to 5. (n+m) is 1 or more. Specific examples of the compound represented by the formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.

As the red pigment, the diketopyrrolopyrrole compounds described in Japanese Patent Laid-Open No. 2017-201384 in which at least one bromine atom in the structure is substituted, and the diketopyrrolopyrrole compounds described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838 can also be used Pyrrolopyrrole compounds, diketopyrrolopyrrole compounds described in International Publication No. 2012/102399, diketopyrrolopyrrole compounds described in International Publication No. 2012/117965, and JP-A No. 2012-229344 Naphthol azo compounds, compounds described in Japanese Patent No. 6516119, compounds described in Japanese Patent No. 6525101, and the like. As the red color material, a compound having a structure in which an aromatic hydrocarbon ring group in which a group to which an oxygen atom, a sulfur atom or a nitrogen atom is bonded is introduced into an aromatic hydrocarbon ring and is bonded to a diketopyrrolopyrrole skeleton can also be used. . As such a compound, the compound represented by the formula (DPP1) is preferable, and the compound represented by the formula (DPP2) is more preferable. [Chemical formula 12]

In the above formula, R ¹¹ and R ¹³ each independently represent a substituent, R ¹² and R ¹⁴ each independently represent a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group, and n11 and n13 each independently represent an integer of 0 to 4 , X ¹² and X ¹⁴ independently represent an oxygen atom, a sulfur atom or a nitrogen atom, when X ¹² is an oxygen atom or a sulfur atom, m12 represents 1, when X ¹² is a nitrogen atom, m12 represents 2, and X ¹⁴ represents an oxygen atom or In the case of a sulfur atom, m14 represents 1, and when X ¹⁴ is a nitrogen atom, m14 represents 2. Examples of the substituent represented by R ¹¹ and R ¹³ include an alkyl group, an aryl group, a halogen atom, an aryl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heteroaryloxycarbonyl group, an amido group, a cyano group, A nitro group, a trifluoromethyl group, a sulfene group, a sulfo group and the like are used as preferred specific examples.

Regarding each pigment having a preferable diffraction angle, reference can be made to Japanese Patent No. 6561862, Japanese Patent No. 6413872, and Japanese Patent No. 6281345, which are incorporated in the present specification.

Examples of color dyes include pyrazole azo compounds, anilino azo compounds, triarylmethane compounds, anthraquinone compounds, anthrapyridine compounds, benzylidene compounds, oxonol compounds, and pyrazolotriazole azo compounds. , pyridone azo compounds, cyanine compounds, phenothiazine compounds, pyrrolopyrazole azomethine compounds, pyridoxine compounds, phthalocyanine compounds, benzopyran compounds, indigo compounds, pyrrolomethylene compounds . In addition, the methine dyes described in JP 2019-073695 A, the methine dyes described in JP 2019-073696 A, and the methine dyes described in JP 2019-073697 A can also be used Base dye, methine dye described in Japanese Patent Laid-Open No. 2019-073698.

The color material may be used in combination of two or more. In addition, when two or more color materials are used in combination, black can be formed by the combination of two or more color materials. As such a combination, the following aspects (1)-(7) are mentioned, for example. The resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter when two or more kinds of color materials are contained in the resin composition and black is exhibited by the combination of two or more kinds of color materials. . (1) Containing red color material and blue color material. (2) The state of containing red color material, blue color material and yellow color material. (3) Containing red color material, blue color material, yellow color material and purple color material. (4) The form of containing red color material, blue color material, yellow color material, purple color material and green color material. (5) The state of containing red color material, blue color material, yellow color material and green color material. (6) The state of containing red color material, blue color material and green color material. (7) Containing yellow color material and purple color material.

(white color material) Examples of the white color material include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silicon dioxide, talc, mica, aluminum hydroxide, calcium silicate, Inorganic pigments (white pigments) such as aluminum silicate, hollow resin particles, and zinc sulfide. The white pigment is preferably particles having titanium atoms, and more preferably titanium oxide. In addition, the white pigment is preferably a particle having a refractive index of 2.10 or more with respect to light having a wavelength of 589 nm. The aforementioned refractive index is preferably 2.10 to 3.00, more preferably 2.50 to 2.75.

Also, as the white pigment, the titanium oxide described in "Titanium Oxide Physical Properties and Applied Technology, Kiyono Gakushu, pp. 13-45, published on June 25, 1991, published by Gihodo" can also be used.

As white pigments, not only those composed of a single inorganic substance, but also particles composed of other materials can be used. For example, using particles with pores inside, other materials, particles with a plurality of inorganic particles attached to the core particles, core particles composed of polymer particles, and core particles composed of inorganic nanoparticle particles and shell layers composed of core and shell Composite particles are preferred. As core-shell composite particles including core particles composed of the above-mentioned polymer particles and shell layers composed of inorganic nanoparticle particles, for example, the descriptions in paragraphs 0012 to 0042 of JP-A No. 2015-047520 can be referred to, This content is incorporated into this manual.

Hollow inorganic particles can also be used for white pigments. The hollow inorganic particle refers to an inorganic particle having a hollow structure inside, and refers to an inorganic particle having a hollow surrounded by an outer shell. Examples of the hollow inorganic particles include hollow inorganic particles described in JP 2011-075786 A, WO 2013/061621 A, JP 2015-164881 A, and the like, which are incorporated herein.

(black color material) It does not specifically limit as a black color material, A well-known thing can be used. For example, examples of the inorganic black color material include inorganic pigments (black pigments) such as carbon black, titanium black, and graphite, and carbon black and titanium black are preferable, and titanium black is more preferable. Titanium black refers to black particles containing titanium atoms, preferably lower titanium oxide and titanium oxynitride. Titanium black can be surface-modified as necessary for the purpose of improving dispersibility, suppressing aggregation, and the like. For example, the surface of the titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide, or zirconium oxide. In addition, treatment with a water-repellent substance as disclosed in Japanese Patent Laid-Open No. 2007-302836 can also be performed. As a black pigment, a color index (C.I.) pigment black 1, 7, etc. are mentioned. Regarding titanium black, it is preferable that both the primary particle diameter and the average primary particle diameter of each particle are small. Specifically, the average primary particle size is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silica particles, and the content ratio of Si atoms and Ti atoms in the dispersion being adjusted in the range of 0.20 to 0.50, etc., can be mentioned. Regarding the above-mentioned dispersion, reference can be made to the descriptions in paragraphs 0020 to 0105 of JP 2012-169556 A, the contents of which are incorporated in the present specification. Examples of commercially available titanium blacks include titanium blacks 10S, 12S, 13R, 13M, 13M-C, 13R-N, 13M-T (product name: manufactured by Mitsubishi Materials Corporation), and Tilack D (product name: Ako Kasei Co., Ltd.) and so on.

Moreover, as an organic black color material, a bisbenzofuranone compound, an azomethine compound, a perylene compound, an azo compound, etc. are mentioned. Examples of the bisbenzofuranone compound include compounds described in JP 2010-534726 A, JP 2012-515233 A, JP 2012-515234 A, and the like; "Irgaphor Black" is obtained. Examples of the perylene compound include compounds described in paragraphs 0016 to 0020 of JP 2017-226821 A, C.I. Pigment Black 31, 32, and the like. Examples of the azomethine compound include compounds described in Japanese Patent Application Laid-Open No. 01-170601, Japanese Patent Application Laid-Open No. 02-034664, and the like. For example, it can be used as a product manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd. "CHROMO FINE BLACK A1103" obtained.

The color material used for the resin composition of the present invention may be only the above-mentioned black color material, or may further include a color color material. According to this aspect, it becomes easy to obtain the film which can form the film excellent in the light-shielding property in a visible area. As the color material, when a black color material and a color color material are used at the same time, the mass ratio of the two is black color material:color color material=100:10-300 is preferable, and 100:20-200 is more preferable. Moreover, it is preferable to use a black pigment as the said black color material, and it is preferable to use a chromatic pigment as the said color color material.

As a preferable combination of a black color material and a color color material, the following are mentioned, for example. (A-1) The state of containing organic black color material and blue color material. (A-2) Containing organic black color material, blue color material and yellow color material. (A-3) Containing organic black color material, blue color material, yellow color material and red color material. (A-4) Containing organic black color material, blue color material, yellow color material and purple color material.

In the aspect of the above (A-1), the mass ratio of the organic black color material and the blue color material is organic black color material: blue color material = 100:1～70 is preferable, 100:5～60 is more preferable, 100:10-50 is more preferable. In the aspect of the above (A-2), the mass ratio of the organic black color material, the blue color material and the yellow color material is: organic black color material: blue color material: yellow color material = 100: 10 to 90: 10 to 90 is Preferably, 100:15～85:15～80 is more preferable, and 100:20～80:20～70 is further preferable. In the aspect of (A-3) above, the mass ratio of organic black color material, blue color material, yellow color material and red color material is organic black color material: blue color material: yellow color material: red color material = 100: 20～150:1～60:10～100 is preferable, 100:30～130:5～50:20～90 is more preferable, and 100:40～120:10～40:30～80 is further preferable. In the aspect of the above (A-4), the mass ratio of organic black color material, blue color material, yellow color material and purple color material is organic black color material: blue color material: yellow color material: purple color material = 100: 20～150:1～60:10～100 is preferable, 100:30～130:5～50:20～90 is more preferable, and 100:40～120:10～40:30～80 is further preferable.

(Near-infrared-absorbing color material) The near-infrared-absorbing color material is preferably a pigment, and more preferably an organic pigment. In addition, it is preferable that the near-infrared absorbing color material has a maximum absorption wavelength in the range of wavelength greater than 700 nm and 1400 nm or less. In addition, the maximum absorption wavelength of the near-infrared absorbing color material is preferably 1200 nm or less, more preferably 1000 nm or less, and even more preferably 950 nm or less. In addition, the ratio of the absorbance _{A550 at the wavelength of 550nm of the near-infrared absorbing color material to the absorbance Amax at} the maximum absorption wavelength, that is, _A550 / _Amax is preferably less than 0.1, more preferably less than 0.05, and further less than 0.03 Preferably, below 0.02 is particularly good. The lower limit is not particularly limited, but can be, for example, 0.0001 or more, or 0.0005 or more. As long as the ratio of the above-mentioned absorbance is within the above-mentioned range, it can be used as a near-infrared absorbing color material excellent in visible light transparency and near-infrared shielding properties. In addition, in the present invention, the value of the absorbance at the maximum absorption wavelength and each wavelength of the near-infrared absorbing color material is obtained from the absorption spectrum of a film formed using the resin composition containing the near-infrared absorbing color material.

The near-infrared absorbing color material is not particularly limited, and examples thereof include pyrrolopyrrole compounds, cyanine compounds, squaraine compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, and merocyanine compounds. Compounds, ketonium compounds, oxonol compounds, imino compounds, dithiol compounds, triarylmethane compounds, pyrrole methylene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, Disulfide metal complexes, etc. Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP 2009-263614 A, compounds described in paragraphs 0037 to 0052 of JP 2011-068731 A, and International Publication No. 2015/ Compounds and the like described in paragraphs 0010 to 0033 of No. 166873. Examples of squaraine compounds include compounds described in paragraphs 0044 to 0049 of JP 2011-208101 A, compounds described in paragraphs 0060 to 0061 of JP 6065169 A, and International Publication No. 2016/181987 The compound described in paragraph 0040 of the Japanese Patent Application Laid-Open No. 2015-176046, the compound described in the paragraph 0072 of the International Publication No. 2016/190162, the compound described in the paragraphs 0196 to 0228 of the Japanese Patent Application Laid-Open No. 2016-074649 Compounds described, compounds described in paragraph 0124 of JP 2017-067963 A, compounds described in International Publication No. 2017/135359, compounds described in JP 2017-114956 A, JP 6197940 The compound described in , the compound described in International Publication No. 2016/120166, etc. Examples of the cyanine compound include compounds described in paragraphs 0044 to 0045 of JP 2009-108267 A, compounds described in paragraphs 0026 to 0030 of JP 2002-194040 A, and JP 2015-172004 The compound described in Gazette No. 2015-172102, the compound described in JP 2008-088426 A, the compound described in paragraph 0090 of International Publication No. 2016/190162, the Compounds and the like described in Kokai Publication No. 2017-031394. Examples of the ketonium compound include compounds described in JP-A No. 2017-082029. Examples of the iminium compound include compounds described in JP 2008-528706 A, compounds described in JP 2012-012399 A, compounds described in JP 2007-092060 A, and international publications. Compounds described in paragraphs 0048 to 0063 of No. 2018/043564. Examples of the phthalocyanine compound include the compound described in paragraph 0093 of JP 2012-077153 A, the titanium phthalocyanine described in JP 2006-343631 A, and 0013 described in JP 2013-195480 A. The compounds described in paragraphs to 0029, the vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, and the compounds described in International Publication No. 2020/071470. As a naphthalocyanine compound, the compound described in the 0093 paragraph of Unexamined-Japanese-Patent No. 2012-077153 is mentioned. As a metal disulfide complex compound, the compound described in Japanese Patent No. 5733804 can be mentioned.

In addition, as the near-infrared absorbing color material, the squaraine compound described in JP 2017-197437 A, the squaraine compound described in JP 2017-025311 A, and International Publication No. 2016/154782 can also be used The squaraine compound described in No. 5884953, the squaraine compound described in Japanese Patent No. 6036689, the squaraine compound described in Japanese Patent No. 5810604 , squaraine compounds described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, pyrrole ring-containing compounds described in paragraphs 0019 to 0075 of JP 2018-054760 A, JP 2018-040955 A The pyrrole ring-containing compounds described in paragraphs 0078 to 0082, the pyrrole ring-containing compounds described in paragraphs 0043 to 0069 of JP 2018-002773 A, and the pyrrole ring-containing compounds described in paragraphs 0024 to 0086 of JP 2018-041047 A A squaraine compound having an aromatic ring at the α-position of an amide, an amide-linked squaraine compound described in JP-A No. 2017-179131, and a pyrrole-bis-squarocyanine compound described in JP-A No. 2017-141215 Compounds with acid cyanine skeleton or ketonium skeleton, dihydrocarbazole bis-squaraline compounds described in JP-A-2017-082029, non-squaring compounds described in paragraphs 0027-0114 of JP-A-2017-068120 Symmetric type compound, pyrrole ring-containing compound (carbazole type) described in JP 2017-067963 A, phthalocyanine compound described in JP 6251530 A, JP 2013-077009 A, JP 2013-077009 Color materials described in Gazette 2014-130338, International Publication No. 2015/166779, or combinations of color materials described in these documents, etc.

The content of the color material in the total solid content of the resin composition is preferably 20 to 90% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more. The upper limit is preferably 80% by mass or less, more preferably 70% by mass or less. Moreover, it is preferable that content of a pigment in the total solid content of a resin composition is 20-90 mass %. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more. The upper limit is preferably 80% by mass or less, more preferably 70% by mass or less. Further, the content of the dye in the color material is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less. Moreover, it is also preferable that the resin composition of this invention does not contain a dye substantially for the reason that the film thickness change at the time of heating the obtained film to a high temperature can be suppressed more effectively. When the resin composition of the present invention does not substantially contain a dye, the content of the dye in the total solid content of the resin composition of the present invention is preferably 0.1% by mass or less, more preferably 0.05% by mass or less, and particularly preferably not contained .

式（1）中，X¹ 表示4+n價連結基， X² 表示單鍵或2價連結基。 R¹¹ 、R¹² 、R²¹ 及R²² 分別獨立地表示氫原子或取代基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數。<Resin B> (Specific resin (resin b-1)) The resin composition of this invention contains resin B (henceforth, also called resin). The resin contained in the resin composition contains resin b-1 (hereinafter, also referred to as a specific resin) containing the structure represented by the formula (1). The specific resin is also the resin of the present invention. [Chemical formula 13]

In formula (1), X ¹ represents a 4+n-valent linking group, and X ² represents a single bond or a divalent linking group. R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more.

[n] In formula (1), n represents an integer of 1 or more, preferably an integer of 1 to 4, more preferably 1 or 2, and even more preferably 1.

[X ¹ ] In the formula (1), as the 4+n-valent linking group represented by X ¹ , a group containing a hydrocarbon group is preferable. As a hydrocarbon group, an aliphatic hydrocarbon group and an aromatic hydrocarbon group are mentioned. The carbon number of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. In addition, the cycloaliphatic hydrocarbon group may have a crosslinked structure. The carbon number of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. As a substituent, the substituent T mentioned later is mentioned.

As a group containing the said hydrocarbon group, a hydrocarbon group, the group which couple|bonded two or more hydrocarbon groups by a single bond or a linking group, etc. are mentioned.

Examples of the linking group linking the above-mentioned two or more hydrocarbon groups include -NR ^M -, -N<, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^M CO-, -CONR ^M - and -C(CF ₃ ) ₂ -. R ^M represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. The carbon atom of X ¹ is preferably bonded to Lp ¹ . In addition, it is also preferable that the nitrogen atom of X ¹ is bonded to Lp ¹ .

式（X-1）中，*1表示與式（1）的P¹ 的連結鍵，*2表示與和式（100）的X¹⁰¹ 鍵結之-CO-的連結鍵，Rx¹ 及Rx² 分別獨立地表示取代基，m1表示0～3的整數，m2表示0～3的整數，n表示1以上的整數，X¹⁰⁰ 表示2+n價連結基。The 4+n-valent linking group represented by X ¹ is preferably a group containing an aromatic hydrocarbon ring because it has a strong affinity for a pigment and is unlikely to generate foreign matter. As a group containing an aromatic hydrocarbon ring, the group represented by formula (X-1) is mentioned. [Chemical formula 14]

In formula (X-1), *1 represents a bond with P ¹ of formula (1), *2 represents a bond with -CO- which is bonded to X ¹⁰¹ of formula (100), Rx ¹ and Rx ² Each independently represents a substituent, m1 represents an integer of 0 to 3, m2 represents an integer of 0 to 3, n represents an integer of 1 or more, and X ¹⁰⁰ represents a 2+n-valent linking group.

Examples of the 2+n-valent linking group represented by X ¹⁰⁰ include a hydrocarbon group, -NR ^M -, -N<, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO -, -S-, -NR ^M CO-, -CONR ^M -, -C(CF ₃ ) ₂ -, and groups obtained by combining two or more of these. As a hydrocarbon group, the above-mentioned groups are mentioned. R ^M represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.

As ^a substituent represented by Rx1 and ^Rx2 , the substituent T mentioned later is mentioned. As a specific example, a halogen atom, an alkyl group, a carboxyl group, a hydroxyl group, etc. are mentioned. When there are two or more Rx ^1s , a plurality of Rx ^1s may be bonded to each other to form a ring structure. In addition, when two or more Rx ^2s are present, a plurality of Rx ^2s may be bonded to each other to form a ring structure.

Preferably, m1 and m2 are each independently an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0.

式（X-2）、式（X-3）中，*1表示與式（1）的P¹ 的連結鍵，*2表示與和式（1）的X¹ 鍵結之-CO-的連結鍵，Rx¹ 及Rx² 分別獨立地表示取代基，m1表示0～3的整數，m2表示0～3的整數，n表示1以上的整數，X¹³ 表示2+n價連結基。The 4+n-valent linking group represented by X1 is preferably ^a group represented by the formula (X-2) or a group represented by the formula (X-3), from the viewpoint of obtaining more excellent dispersibility , the group represented by the formula (X-2) is more preferable. [Chemical formula 15]

In formula (X-2) and formula (X-3), *1 represents a bond to P ¹ of formula (1), and *2 represents a bond to -CO- which is bonded to X ¹ of formula (1) In the bond, Rx ¹ and Rx ² each independently represent a substituent, m1 represents an integer of 0 to 3, m2 represents an integer of 0 to 3, n represents an integer of 1 or more, and X ¹³ represents a 2+n-valent linking group.

Examples of the 2+n-valent linking group represented by X ¹³ include a hydrocarbon group, a group in which two or more hydrocarbon groups are linked by a single bond or a linking group, and the like. Examples of linking groups linking two or more hydrocarbon groups include -NR ^M -, -N<, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, - S-, -NR ^M CO-, -CONR ^M - and -C(CF ₃ ) ₂ -. As a hydrocarbon group, the above-mentioned groups are mentioned. R ^M represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.

Rx ¹ , Rx ² , m1 and m2 in formula (X-2) and formula (X-3) have the same meanings as Rx ¹ , Rx ² , m1 and m2 in formula (X-1).

[X ² ] In formula (1), X ² represents a single bond or a divalent linking group.

Examples of the divalent linking group represented by X ² include a hydrocarbon group or a group in which two or more hydrocarbon groups are bonded via a single bond or a linking group. As a hydrocarbon group, an aliphatic hydrocarbon group and an aromatic hydrocarbon group are mentioned. The carbon number of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. In addition, the cycloaliphatic hydrocarbon group may have a crosslinked structure. The carbon number of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. As a substituent, the substituent T mentioned later is mentioned. Examples of the linking group linking the above-mentioned two or more hydrocarbon groups include -O-, -S-, -C(CH ₃ ) ₂ -, -C(CF ₃ ) ₂ -, -CO-, -SO ₂ -, -SiR ₂ - (R each independently represents a hydrocarbon group, preferably an alkyl group or a phenyl group having 1 to 4 carbon atoms.), polysiloxane group (-Si(R)-(O-Si) _n -, R represents a hydrocarbon group, preferably an alkyl group having 1 to 4 carbon atoms or a phenyl group. n represents an integer of 1 or more, preferably 1 to 10) and the like.

上述結構中，*分別獨立地表示與其他結構的鍵結部位。The divalent linking group represented by X ² is preferably a group containing an aliphatic hydrocarbon ring or an aromatic hydrocarbon ring, and more preferably a group containing an aromatic hydrocarbon ring. In addition, the divalent linking group represented by X ² is preferably a group containing a fluorine atom or a sulfonyl group (-SO ₂ -) because the solubility of the specific resin in a solvent can be improved. Among them, the divalent linking group represented by X ² is preferably a group containing a fluorine atom and an aromatic hydrocarbon ring because it can form a film having excellent solubility in a solvent and excellent heat resistance of the specific resin. As a group containing a fluorine atom and an aromatic hydrocarbon ring, two or more aromatic hydrocarbon groups are linked by a linking group, and the linking group is a linking group containing a fluorine atom, or a single bond or a linking group A group in which two or more aromatic hydrocarbon groups are bonded and the aromatic hydrocarbon group is substituted by a group containing a fluorine atom is preferable. As the said fluorine atom-containing linking group, -C( _CF3 ) _2- etc. are mentioned. As the above-mentioned group containing a fluorine atom, a fluorinated alkyl group is preferable, and a trifluoromethyl group is more preferable. When the divalent linking group represented by X ² is a group containing a fluorine atom and an aromatic hydrocarbon ring, for example, a group having the following structure is preferable. [Chemical formula 16]

In the above structures, * each independently represents a bonding site with other structures.

[化學式18]

[化學式19]

[化學式20]

The divalent linking group represented by X ² is preferably a group derived from a diamine structure. As a diamine, the following compounds are mentioned, for example. [Chemical formula 17]

[Chemical formula 18]

[Chemical formula 19]

[Chemical formula 20]

式（1A）中，X¹ 表示4+n價連結基， X^2a 表示單鍵， R¹¹ 、R¹² 、R²¹ 及R²² 分別獨立地表示氫原子或取代基， R^N1 及R^N2 分別獨立地表示烷基、芳基或雜環基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數。When X ² of formula (1) is a single bond, it is preferable that a substituent is bonded to the front end of X ² . That is, it is preferable that the X ² side is sealed with a substituent. As a substituent, the substituent T mentioned later is mentioned, and an alkyl group, an aryl group, or a heterocyclic group is preferable. When X ² of the formula (1) is a single bond, the specific resin is preferably a resin having a structure represented by the formula (1A). [Chemical formula 21]

In formula (1A), X ¹ represents a 4+n-valent linking group, X ^2a represents a single bond, R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, and R ^N1 and R ^N2 each independently represents an alkyl group, an aryl group or a heterocyclic group, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more.

X 1 , R ¹¹ , R ¹² , R ²¹ , R ²² , Lp ¹ , P ¹ and n of formula (1A) and X ¹ , R ¹¹ , R ¹² , R ²¹ , R ²² , Lp ¹ of formula ( ¹ ) , P ¹ and n have the same meaning.

The carbon number of the alkyl group represented by R ^N1 and R ^N2 is preferably 1-30, more preferably 1-15, and still more preferably 1-8. The alkyl group may be any of straight chain, branched chain and cyclic. The carbon number of the aryl group represented by R ^N1 and R ^N2 is preferably 6-30, more preferably 6-20, and further preferably 6-12. The heterocyclic group represented by R ^N1 and R ^N2 may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclyl group is preferably a 5-membered or 6-membered ring. A nitrogen atom, an oxygen atom, a sulfur atom, etc. are mentioned as the kind of the hetero atom which comprises a heterocyclic group. The number system of the heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a condensed ring. The alkyl group, aryl group and heterocyclic group represented by R ^N1 and R ^N2 may have a substituent or may be unsubstituted. As a substituent, the substituent T mentioned later is mentioned. The substituent is preferably a carboxyl group.

[R ¹¹ , R ¹² , R ²¹ and R ²² ] In formula (1), R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent.

As a substituent, an alkyl group, an aryl group, a heterocyclic group, etc. are mentioned. The carbon number of the alkyl group is preferably 1-30, more preferably 1-15, more preferably 1-8, still more preferably 1-5, and particularly preferably 1-3. The alkyl group may be any of straight chain, branched chain and cyclic chain, straight chain or branched chain is preferred, straight chain is more preferred. The carbon number of the aryl group is preferably 6-30, more preferably 6-20, and further preferably 6-12. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclyl group is preferably a 5-membered or 6-membered ring. A nitrogen atom, an oxygen atom, a sulfur atom, etc. are mentioned as the kind of the hetero atom which comprises a heterocyclic group. The number system of the heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a condensed ring. The above-mentioned alkyl group, aryl group and heterocyclic group may have a substituent or may be unsubstituted. As a substituent, the substituent T mentioned later, the group containing an ethylenically unsaturated bond, an epoxy group, an oxetanyl group, a block isocyanate group, etc. are mentioned.

In formula (1), R ¹¹ and R ¹² are preferably hydrogen atoms. Moreover, it is preferable that R ²¹ and R ²² are also hydrogen atoms.

[Lp ¹ ] In formula (1), Lp ¹ represents a divalent linking group. Examples of the divalent linking group include a hydrocarbon group, -NR ^M -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^M CO- , -CONR ^M -, and a group formed by combining two or more of these. R ^M represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. The hydrocarbon group includes an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The carbon number of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be any of straight chain, branched chain and cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. In addition, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The carbon number of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned. The divalent linking group is preferably a group containing an oxygen atom or a sulfur atom, more preferably a group containing a sulfur atom, and even more preferably a group containing -S-.

式、式（Lp-1）及式（Lp-2）中，Lp¹¹ 表示單鍵或2價連結基，*1表示與式（1）的X¹ 的連結鍵，*2表示與式（1）的P¹ 的連結鍵。The divalent linking group represented by Lp ¹ is preferably a group represented by formula (Lp-1) or formula (Lp-2), and more preferably a group represented by formula (Lp-1). [Chemical formula 22]

In the formula, the formula (Lp-1) and the formula (Lp-2), Lp ¹¹ represents a single bond or a divalent linking group, *1 represents a link to X ¹ in the formula (1), and *2 represents a link with the formula (1). ) ^of the P1 link key.

Examples of the divalent linking group represented by Lp ¹¹ include a hydrocarbon group and a group having a structure in which two or more hydrocarbon groups are bonded by a single bond or a linking group. Examples of the linking group include -NR ^M -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^M CO-, and -CONR ^M -. As a hydrocarbon group, the above-mentioned groups are mentioned. The hydrocarbon group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned. R ^M represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.

[P ¹ ] In formula (1), P ¹ represents a polymer chain. The weight average molecular weight of P ¹ is preferably 500 to 50,000. The lower limit is preferably 800 or more, and more preferably 1000 or more. The upper limit is preferably 20,000 or less, and more preferably 10,000 or less. When the weight average molecular weight of the polymer chain is within the above range, more excellent pigment dispersibility can be easily obtained. The weight average molecular weight of the polymer chain can be determined by GPC (gel permeation chromatography) method. More specifically, it can be calculated from the weight-average molecular weight of the raw material monomers for introduction into the polymer chain.

Preferably, the polymer chain represented by P ¹ contains repeating units of at least one structure selected from the group consisting of poly(meth)acrylic acid structure, polystyrene structure, polyether structure and polyester structure. The repeating unit of at least one of the acrylic structure and the polystyrene structure is more preferred, and the repeating unit including the poly(meth)acrylic structure is further preferred from the viewpoint of pigment dispersibility and heat resistance. It is also preferable that the polymer chain represented by P ¹ contains a repeating unit of a polyether structure or a repeating unit of a polyester structure. When the polymer chain represented by P ¹ includes a repeating unit of a polyether structure, the repeating unit number of the polyether structure is preferably 9 or more. When the polymer chain represented by P ¹ includes a repeating unit of a polyester structure, the repeating unit number coefficient of the polyester structure is preferably 5 or more.

The polymer chain represented by P ¹ may have a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl, (meth)allyl, and (meth)acryloyl groups, and cyclic groups such as epoxy groups and oxetanyl groups. ether group, blocked isocyanate group, etc. In addition, in this specification, a block isocyanate group means the group which can generate|occur|produce an isocyanate group by heat, for example, the group which can react a blocking agent with an isocyanate group and protect an isocyanate group is preferably illustrated. Examples of the blocking agent include oxime compounds, lactamide compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, thiol compounds, imidazole-based compounds, imide-based compounds, and the like. As the blocking agent, the compounds described in paragraphs 0115 to 0117 of JP-A No. 2017-067930 can be exemplified, the contents of which are incorporated in the present specification. In addition, the blocked isocyanate group is preferably a group capable of generating an isocyanate group by heat at 90 to 260°C.

It is also preferable that the polymer chain represented by P ¹ has a tertiary alkyl group. As a tertiary alkyl group, a tertiary butyl group etc. are mentioned.

It is preferable that the polymer chain represented by P1 contains ^a repeating unit represented by any one of formula (P1-1) to formula (P1-6), including formula (P1-5) or formula (P1-6) The repeating unit represented is more preferable, and it is further preferable to include the repeating unit represented by the formula (P1-5). Moreover, it is also preferable that the polymer chain represented by P1 contains ^a repeating unit represented by any one of formula (P1-1) to formula (P1-4). When the polymer chain represented by P ¹ contains the repeating unit of the formula (P1-4), the repeating unit number coefficient of the formula (P1-4) is preferably 9 or more. When the polymer chain represented by P ¹ includes repeating units of the formulae (P1-1) to (P1-3), the repeating unit number of these structures is preferably 5 or more. [Chemical formula 23]

In the above formula, R ^G1 and R ^G2 each represent an alkylene group. The alkylene group represented by R ^G1 and R ^G2 is preferably a linear or branched alkylene group having 1 to 20 carbon atoms, and a linear or branched alkyl group having 2 to 16 carbon atoms. An alkylene group is more preferable, and a linear or branched alkylene group having 3 to 12 carbon atoms is further preferable.

In the above formula, R ^G3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a methylol group, preferably a hydrogen atom or a methyl group.

In the above formula, Q ^G1 represents -O- or -NR ^q -, and R ^q represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group. Q ^G1 is preferably -O-. The carbon number of the alkyl group represented by R ^q is preferably 1-30, more preferably 1-15, more preferably 1-8, still more preferably 1-5, and particularly preferably 1-3. The alkyl group may be any of straight chain, branched chain and cyclic chain, straight chain or branched chain is preferred, straight chain is more preferred. The carbon number of the aryl group represented by R ^q is preferably 6-30, more preferably 6-20, and even more preferably 6-12. The heterocyclic group represented by R ^q may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclyl group is preferably a 5-membered or 6-membered ring. A nitrogen atom, an oxygen atom, a sulfur atom, etc. are mentioned as the kind of the hetero atom which comprises a heterocyclic group. The number system of the heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a condensed ring. The above-mentioned alkyl group, aryl group and heterocyclic group may have a substituent or may be unsubstituted. As a substituent, the substituent T mentioned later is mentioned.

In the above formula, L ^G1 represents a single bond or an aryl group, preferably a single bond.

In the above formula, L ^G2 represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylidene group (preferably an arylidene group having 6 to 20 carbon atoms), -NR ^LG1 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^LG1 CO-, -CONR ^LG1 - and a combination of two or more of these Preferably, the group contains an alkylene group or an aryl group. R ^LG1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. The above-mentioned alkylene group and aryl group may have a substituent or may be unsubstituted. As a substituent, the substituent T mentioned later is mentioned.

In the above formula, R ^G4 represents a hydrogen atom or a substituent. Examples of the substituent include a hydroxyl group, a carboxyl group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic group, an alkyl sulfide group, an aryl sulfide group, and a heterocyclic sulfide group. groups, groups containing ethylenically unsaturated bonds, epoxy groups, oxetanyl groups and blocked isocyanate groups, etc. R ^G4 is preferably at least one selected from alkyl groups, aryl groups, groups containing ethylenically unsaturated bonds, epoxy groups and oxetanyl groups, and is preferably selected from groups containing ethylenically unsaturated bonds , at least one of epoxy group, oxetanyl group and tertiary butyl group is more preferable.

In the above formula, R ^G5 represents a hydrogen atom or a methyl group, and R ^G6 represents an aryl group. The carbon number of the aryl group represented by R ^G6 is preferably 6-30, more preferably 6-20, and even more preferably 6-12. The aryl group represented by R ^G6 may have a substituent. Examples of the substituent include a hydroxyl group, a carboxyl group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic group, an alkyl sulfide group, an aryl sulfide group, and a heterocyclic sulfide group. groups, groups containing ethylenically unsaturated bonds, epoxy groups, oxetanyl groups and blocked isocyanate groups, etc.

The polymer chain represented by P ¹ may contain two or more kinds of repeating units.

(substituent T) Alkyl group (preferably an alkyl group having 1 to 30 carbon atoms), alkenyl group (preferably an alkenyl group having 2 to 30 carbon atoms), alkynyl group (preferably an alkynyl group having 2 to 30 carbon atoms), aryl group (preferably an aryl group having 6 to 30 carbon atoms), an amine group (preferably an amine group having 0 to 30 carbon atoms), an alkoxy group (preferably an alkoxy group having 1 to 30 carbon atoms), an aryloxy group group (preferably an aryloxy group having 6 to 30 carbon atoms), a heteroaryloxy group (preferably a heteroaryloxy group having 1 to 30 carbon atoms), an acyl group (preferably an aryloxy group having 2 to 30 carbon atoms) ), alkoxycarbonyl (preferably alkoxycarbonyl having 2 to 30 carbon atoms), aryloxycarbonyl (preferably aryloxycarbonyl having 7 to 30 carbon atoms), aryloxy (preferably carbon acyloxy group with 2 to 30 carbon atoms), acylamino group (preferably acylamino group with 2 to 30 carbon atoms), alkoxycarbonylamino group (preferably alkoxycarbonylamino group with 2 to 30 carbon atoms) ), aryloxycarbonylamino (preferably aryloxycarbonylamino with 7-30 carbon atoms), sulfamoyl (preferably sulfamoyl with 0-30 carbons), carbamoyl (preferably an amine carboxyl group having 1 to 30 carbon atoms), alkylthio (preferably an alkylthio group having 1 to 30 carbon atoms), arylthio (preferably one having 6 to 30 carbon atoms) arylthio), heteroarylthio (preferably a heteroarylthio group having 1 to 30 carbon atoms), an alkylsulfonyl group (preferably an alkylsulfonyl group having 1 to 30 carbon atoms), Arylsulfonyl group (preferably an arylsulfonyl group having 6 to 30 carbon atoms), heteroarylsulfonyl group (preferably a heteroarylsulfonyl group having 1 to 30 carbon atoms), alkylsulfinyl Sulfonyl group (preferably an alkylsulfinyl group having 1 to 30 carbon atoms), arylsulfinyl group (preferably an arylsulfinyl group having 6 to 30 carbon atoms), heteroarylsulfinyl group group (preferably a heteroarylsulfinyl group having 1 to 30 carbon atoms), a ureido group (preferably a urea group having a carbon number of 1 to 30), a phosphoamide group (preferably a urea group having 1 to 30 carbon atoms) phosphoamide), hydroxyl, mercapto, halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom, etc.), cyano group, sulfo group, carboxyl group, nitro group, hydroxamic acid group, sulfinic acid group, hydrazine group , imino group, heterocyclic group. When these groups can be further substituted, they may further have a substituent. As a further substituent, the group demonstrated in the said substituent T is mentioned.

式（1-1）中，X¹¹ 及X¹² 分別獨立地表示烴基， X¹³ 表示2+n價連結基， Lx¹¹ 及Lx¹² 分別獨立地表示單鍵或2價連結基， X² 表示單鍵或2價連結基。 R¹¹ 、R¹² 、R²¹ 及R²² 分別獨立地表示氫原子或取代基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數。Among the specific resins, the structure represented by the above formula (1) is preferably the structure represented by the formula (1-1). [Chemical formula 24]

In formula (1-1), X ¹¹ and X ¹² each independently represent a hydrocarbon group, X ¹³ represents a 2+n-valent linking group, Lx ¹¹ and Lx ¹² each independently represent a single bond or a divalent linking group, and X ² represents a monovalent linking group. bond or divalent linking group. R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more.

R ¹¹ , R ¹² , R ²¹ , R ²² , Lp ¹ , P ¹ and n of formula (1-1) and R ¹¹ , R ¹² , R ²¹ , R ²² , Lp ¹ , P ¹ and n has the same meaning.

Examples of the hydrocarbon group represented by X ¹¹ and X ¹² in the formula (1-1) include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The carbon number of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. In addition, the cycloaliphatic hydrocarbon group may have a crosslinked structure. The carbon number of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. As a substituent, the above-mentioned substituent T is mentioned.

The hydrocarbon group represented by X ¹¹ and X ¹² is preferably an aromatic hydrocarbon group, and more preferably a benzene ring group.

Lx ¹¹ and Lx ¹² in formula (1-1) each independently represent a single bond or a divalent linking group. Examples of the divalent linking group include -NR ^M -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^M CO-, - CONR ^M -, -C(CF ₃ ) ₂ -, -O-, -COO- or -OCO- are preferred, -O- or -COO- are more preferred, and -COO- is further preferred. In addition, the bonding bond on the carbon atom side (carbonyl side) in -COO- is a bonding bond with X ¹¹ or X ¹² in formula (1-1). R ^M represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.

Examples of the 2+n-valent linking group represented by X ¹³ in the formula (1-1) include a hydrocarbon group, a group in which two or more hydrocarbon groups are linked by a single bond or a linking group, and the like. Examples of linking groups linking two or more hydrocarbon groups include -NR ^M -, -N<, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, - S-, -NR ^M CO-, -CONR ^M - and -C(CF ₃ ) ₂ -. As a hydrocarbon group, the above-mentioned groups are mentioned. R ^M represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.

式（1-2）中，X¹³ 表示2+n價連結基， X² 表示單鍵或2價連結基。 R¹¹ 及R¹² 分別獨立地表示氫原子或取代基， Rx¹ 及Rx² 分別獨立地表示取代基， Lp¹ 表示2價連結基， P¹ 表示聚合物鏈， n表示1以上的整數， m1表示0～3的整數， m2表示0～3的整數。Among the specific resins, the structure represented by the above formula (1) is preferably the structure represented by the formula (1-2). [Chemical formula 25]

In formula (1-2), X ¹³ represents a 2+n-valent linking group, and X ² represents a single bond or a divalent linking group. R ¹¹ and R ¹² each independently represent a hydrogen atom or a substituent, Rx ¹ and Rx ² each independently represent a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, n represents an integer of 1 or more, m1 represents an integer from 0 to 3, and m2 represents an integer from 0 to 3.

R ¹¹ , R ¹² , Lp ¹ , P ¹ and n in formula (1-2) have the same meanings as R ¹¹ , R ¹² , Lp ¹ , P ¹ and n in formula (1). R ¹³ in formula (1-2) has the same meaning as R ¹³ in formula (1-1).

As the substituent represented by Rx ¹ and Rx ² in the formula (1-2), the above-mentioned substituent T is exemplified. As a specific example, a halogen atom, an alkyl group, a carboxyl group, a hydroxyl group, etc. are mentioned.

In formula (1-2), m1 and m2 are each independently preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0.

The specific resin may contain an imide cyclized structure of the structure represented by the above formula (1).

式（2）中，X¹⁰¹ 表示2+m價連結基，X¹⁰² 表示2價連結基，m表示1～4的整數。It is preferable that the special case resin further contains the structure represented by the formula (2). According to this aspect, the dispersibility can be further improved. [Chemical formula 26]

In formula (2), X ¹⁰¹ represents a 2+m-valent linking group, X ¹⁰² represents a divalent linking group, and m represents an integer of 1-4.

Examples of the divalent linking group represented by X ¹⁰² in the formula (2) include the groups described as the divalent linking group represented by X ² in the above formula (1), and the preferred range is also the same.

m in formula (2) represents an integer of 1 to 4, preferably 1 or 2, more preferably 2.

As the 2+m-valent linking group represented by X ¹⁰¹ in the formula (2), a group containing a hydrocarbon group is preferable. As a hydrocarbon group, an aliphatic hydrocarbon group and an aromatic hydrocarbon group are mentioned. The carbon number of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. In addition, the cycloaliphatic hydrocarbon group may have a crosslinked structure. The carbon number of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, further preferably 6 to 10, and particularly preferably 6. The hydrocarbon group may have a substituent. As a substituent, the above-mentioned substituent T is mentioned.

As a group containing the said hydrocarbon group, a hydrocarbon group, the group which couple|bonded two or more hydrocarbon groups by a single bond or a linking group, etc. are mentioned.

Examples of the linking group linking the above-mentioned two or more hydrocarbon groups include -NR ^M -, -N<, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^M CO-, -CONR ^M - and -C(CF ₃ ) ₂ -. R ^M represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.

The 2+m-valent linking group represented by X ¹⁰¹ is preferably a group containing an aliphatic hydrocarbon ring or an aromatic hydrocarbon ring, and more preferably a group containing an aromatic hydrocarbon ring. In addition, the 2+m-valent linking group represented by X ¹⁰¹ is preferably a group containing a fluorine atom or a sulfonyl group (-SO ₂ -) because the solubility of the specific resin in a solvent can be improved. Among them, the 2+m-valent linking group represented by X ¹⁰¹ is preferably a group containing a fluorine atom and an aromatic hydrocarbon ring because it can form a film having excellent solubility in a solvent and excellent heat resistance of the specific resin . As a group containing a fluorine atom and an aromatic hydrocarbon ring, two or more aromatic hydrocarbon groups are linked by a linking group, and the linking group is a linking group containing a fluorine atom, or a single bond or a linking group A group in which two or more aromatic hydrocarbon groups are bonded and the aromatic hydrocarbon group is substituted by a group containing a fluorine atom is preferable. As the said fluorine atom-containing linking group, -C( _CF3 ) _2- etc. are mentioned. As the above-mentioned group containing a fluorine atom, a fluorinated alkyl group is preferable, and a trifluoromethyl group is more preferable.

Moreover, when the 2+m-valent linking group represented by X ¹⁰¹ is a tetravalent linking group, X ¹⁰¹ is also preferably a group represented by any one of (D-1) to formula (D-3).

式（D-1）～式（D-3）中，Cy分別獨立地表示脂肪族烴環，R^d1 表示直鏈狀或支鏈狀的脂肪族烴基，X^d1 表示單鍵或2價連結基，*¹ ～*⁴ 分別表示連結鍵。[Chemical formula 27]

In formulas (D-1) to (D-3), Cy each independently represents an aliphatic hydrocarbon ring, R ^d1 represents a linear or branched aliphatic hydrocarbon group, and X ^d1 represents a single bond or a divalent linking group , * ¹ to * ⁴ represent connection keys, respectively.

The aliphatic hydrocarbon ring represented by Cy of the formulae (D-1) to (D-3) may be a monocyclic ring or a condensed ring. Also, the aliphatic hydrocarbon ring may have a cross-linked structure. The aliphatic hydrocarbon ring represented by Cy is preferably a monocyclic aliphatic hydrocarbon ring or an aliphatic hydrocarbon ring having a cross-linked structure.

In formula (D-1), it is preferable that * ¹ and * ² , * ³ and * ⁴ are present at adjacent positions on the aliphatic hydrocarbon ring Cy.

R ^d1 in the formula (D-2) represents a linear or branched aliphatic hydrocarbon group, preferably a linear or branched aliphatic saturated hydrocarbon group. The carbon number of the aliphatic hydrocarbon group is preferably 2 to 10, more preferably 2 to 4, and even more preferably 2. In the formula (D-2), it is preferable that each of * ³ and * ⁴ exists on the adjacent carbon atoms of the aliphatic hydrocarbon group R ^d1 . In the formula (D-2), it is preferable that * ³ and * ⁴ exist in adjacent positions on the aliphatic hydrocarbon ring Cy.

In formula (D-3), X ^d1 represents a single bond or a divalent linking group, which is an aliphatic hydrocarbon group with 1 to 10 carbon atoms, -O-, -C(=O)-, which may be substituted by a single bond or a fluorine atom. -S-, -S(=O) ₂ -, -NHC(=O)- or a combination of two or more of these groups are preferred, and are selected from 1- to The group in the alkylene group of 3, -O-, -C(=O)-, -S- or -S(=O) ₂ - is better, it is -CH ₂ -, -O-, -S -, -S(=O) ₂ -, -C(CF ₃ ) ₂ - or -C(CH ₃ ) ₂ - are more preferable.

Furthermore, when the 2+m-valent linking group represented by X ¹⁰¹ is a tetravalent linking group, X ¹⁰¹ is also preferably a group represented by the formula (E-1).

式（E-1）中，Ar分別獨立地表示芳香族烴環，X^e1 表示含氟原子之2價連結基，*¹ ～*⁴ 分別表示與其他結構的鍵結部位。 式（E-1）的Ar所表示之芳香族烴環的碳數係6～30為較佳，6～20為更佳。Ar所表示之芳香族烴環係苯環為較佳。 式（E-1）的X^e1 係被氟原子取代之碳數1～10的伸烷基為較佳，被氟原子取代之碳數1～5的伸烷基為更佳，-C（CF₃ ）₂ -、-C（CF₃ ）（C₂ F₅ ）-或-C（C₂ F₅ ）₂ -為進一步較佳，-C（CF₃ ）₂ -為特佳。式（D-1）中，*¹ 及*² 、*³ 及*⁴ 存在於芳香環結構Ar上的相鄰位置為較佳。[Chemical formula 28]

In formula (E-1), Ar each independently represents an aromatic hydrocarbon ring, X ^e1 represents a divalent linking group containing a fluorine atom, and * ¹ to * ⁴ each represent a bonding site with another structure. The carbon number of the aromatic hydrocarbon ring represented by Ar in the formula (E-1) is preferably 6 to 30, more preferably 6 to 20. The aromatic hydrocarbon ring represented by Ar is preferably a benzene ring. X ^e1 of the formula (E-1) is preferably an alkylene group having 1 to 10 carbon atoms substituted by a fluorine atom, more preferably an alkylene group having 1 to 5 carbon atoms substituted by a fluorine atom, -C(CF ₃ ) _2- , -C(CF ₃ )(C ₂ F ₅ )- or -C(C ₂ F ₅ ) ₂ - is further preferred, and -C(CF ₃ ) ₂ - is particularly preferred. In formula (D-1), it is preferable that * ¹ and * ² , * ³ and * ⁴ exist in adjacent positions on the aromatic ring structure Ar.

When the 2+m-valent linking group represented by X ¹⁰¹ is a tetravalent linking group, X ¹⁰¹ is also preferably a structure represented by any one of the following formulae (I-1) to (I-28). [Chemical formula 29]

In formulas (I-1) to (I-28), X ¹ to X ³ represent a single bond or a divalent linking group, L represents -CH=CH- or -CH ₂ -, and R ¹ and R ² represent each independently A hydrogen atom or a substituent, R ¹ and R ² may be bonded to form a ring, and * represents a bond with another structure in the formula (1).

Examples of the divalent linking group represented by X ¹ to X ³ include -C(Rx) ₂ - (Rx represents a hydrogen atom or a substituent. When Rx is a substituent, they may be linked to each other to form a ring), -O- , _-SO2- , -CO-, -S-, ^-NRN- , phenylene, or a combination of these. R ^N represents a hydrogen atom, an alkyl group or an aryl group. When Rx represents a substituent, specific examples thereof include an alkyl group substituted with a fluorine atom. X ¹ to X ³ are each independently a single bond, -SO ₂ - or -C(Rx) ₂ - is preferably, -SO ₂ - or -C(Rx) ₂ - is more preferably, -C(Rx) ₂ - is further preferred. Moreover, -C(Rx) ₂ - is preferably -C(CH ₃ ) ₂ - or -C(CF ₃ ) ₂ -, and -C(CF ₃ ) ₂ - is more preferable.

L series -CH=CH- is preferable.

Preferably, R ¹ and R ² are each independently a hydrogen atom or an alkyl group, more preferably a hydrogen atom, a methyl group or an ethyl group, and even more preferably a hydrogen atom.

When the specific resin contains the structure represented by the formula (2), the ratio of the structure represented by the formula (1) to the structure represented by the formula (2) with respect to 1 mole of the structure represented by the formula (1) is given by The structure represented by the formula (2) is preferably 20 mol or less, more preferably 10 mol or less, and even more preferably 2 mol or less. The lower limit is preferably 0.1 mol or more, and more preferably 0.5 mol or more.

The specific resin may contain an imide cyclized structure of the structure represented by the above formula (2).

At least one terminal of the specific resin may be sealed with an end-capping agent, and a polymer chain having a structure different from the above-mentioned formula (1) and formula (2) may be bonded. As a blocking agent, a monoamine, an acid anhydride, a monocarboxylic acid, a monocarboxylic acid chloride, a monocarboxylic acid halide compound, a monocarboxylic acid active ester, etc. are mentioned. Examples of the monoamine include aniline, 4-aminobenzoic acid, 5-aminoisophthalic acid, 4-aminophthalic acid, 4-aminophthalimide, 5-amine benzimidazolidinone, etc. In addition, as the blocking agent, for example, the compounds described in paragraphs 0034 to 0036 of JP 2019-101440 A can also be used. In addition, by sealing the end of the specific resin with a capping agent having a hydroxyl group, a carboxyl group, a sulfonic acid group, a thiol group, a vinyl group, an ethynyl group or an allyl group, the dissolution rate of the specific resin in the alkaline solution, The mechanical properties of the obtained cured film are adjusted within a preferred range. As a polymer chain, the polymer chain etc. which contain the repeating unit of at least 1 type of structure chosen from a poly(meth)acrylic acid structure, a polystyrene structure, a polyether structure, and a polyester structure are mentioned. Specific examples of these include those described as the above-mentioned polymer chain P ¹ .

The acid value of the specific resin is preferably 10 to 150 mgKOH/g. The upper limit is preferably 100 mgKOH/g or less, and more preferably 80 mgKOH/g or less. The lower limit is preferably 20 mgKOH/g or more, and more preferably 30 mgKOH/g or more.

The weight average molecular weight (Mw) of the specific resin is preferably 2,000 to 200,000, more preferably 2,500 to 100,000, and even more preferably 3,000 to 50,000.

The 5% mass reduction temperature of the specific resin based on TG/DTA (thermal mass measurement/thermal difference measurement) in a nitrogen atmosphere is preferably 280°C or higher, more preferably 300°C or higher, and even more preferably 320°C or higher. The upper limit of the above-mentioned 5% mass reduction temperature is not particularly limited, but may be, for example, 1,000°C or lower. The above-mentioned 5% mass reduction temperature can be determined by a known TG/DTA measurement method as the temperature at which the mass reduction rate becomes 5% in a nitrogen atmosphere at a specific temperature for 5 hours. In addition, the mass reduction rate of the specific resin at 300° C. for 5 hours under a nitrogen atmosphere is preferably 10% or less, more preferably 5% or less, and even more preferably 2% or less. The lower limit of the above-mentioned mass reduction rate is not particularly limited, as long as it is 0% or more. The above-mentioned mass reduction rate is a value calculated as a ratio of mass reduction in a specific resin before and after standing at 300° C. for 5 hours under a nitrogen atmosphere.

For example, a specific resin can be synthesized by reacting a macromonomer having two acid anhydride groups (acid dianhydride macromonomer) with a diamine, and further reacting with an acid dianhydride that does not contain a polymer chain if necessary. .

For example, the acid dianhydride macromonomer can be synthesized by the following method. (1) A method of synthesizing by reacting a macromonomer obtained by radical polymerization of a radically polymerizable compound with an acid anhydride or an acid anhydride chloride using a chain transfer agent having two hydroxyl groups and one or two mercapto groups. (2) A method of synthesizing by subjecting a secondary amine having two hydroxyl groups to an aza-Michael addition reaction (Aza Michael Addition) with a terminal acrylic macromonomer, and then reacting it with an acid anhydride or an acid anhydride chloride. (3) A method of synthesizing by subjecting a compound having one hydroxyl group and two mercapto groups to an ene-thiol reaction with an acid anhydride having a group containing an ethylenically unsaturated bond, and then ring-opening polymerization of a lactone. (4) After the compound having one or two hydroxyl groups and one mercapto group is subjected to an ene-thiol reaction with an acid dianhydride having a group containing an ethylenically unsaturated bond, the lactone is subjected to ring-opening polymerization to synthesize it method. (5) A method of synthesizing by coupling reaction of a macromonomer obtained by radical polymerization of a radically polymerizable compound and an acid anhydride having a halogen atom using a chain transfer agent having two hydroxyl groups and one or two mercapto groups.

式（MM1）中，X^1M 表示2+n價連結基， 上述2+n價連結基係烴基或藉由單鍵或連結基將2個以上的烴基鍵結之基團，上述連結基係-NR^M -、-N＜、-SO-、-SO₂ -、-CO-、-O-、-COO-、-OCO-、-S-、-NR^M CO-、-CONR^M -或-C（CF₃ ）₂ -， Rx^1M 及Rx^2M 分別獨立地表示鹵素原子、烷基、羧基或羥基， Lp^1M 表示烴基、-NR^M -、-SO-、-SO₂ -、-CO-、-O-、-COO-、-OCO-、-S-、-NR^M CO-、-CONR^M -及組合該等中的2個以上而成之基團， R^M 表示氫原子、烷基、芳基或雜環基， P^1M 表示包含由式（P1-1）～式（P1-4）中的任一個表示之重複單元之聚合物鏈， n表示1以上的整數， m1表示0～3的整數， m2表示0～3的整數， [化學式31]

式（P1-1）～式（P1-4）中，R^G1 及R^G2 分別表示伸烷基。A compound represented by the formula (MM1) of the acid dianhydride macromonomer system is also preferred. The compound represented by the formula (MM1) is the compound of the present invention. [Chemical formula 30]

In formula (MM1), X ^1M represents a 2+n-valent linking group, the above-mentioned 2+n-valent linking group is a hydrocarbon group or a group in which two or more hydrocarbon groups are bonded by a single bond or a linking group, and the above-mentioned linking group is - NR ^M -, -N<, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^M CO-, -CONR ^M - or -C (CF ₃ ) ₂ -, Rx ^1M and Rx ^2M each independently represent a halogen atom, an alkyl group, a carboxyl group or a hydroxyl group, Lp ^1M represents a hydrocarbon group, -NR ^M -, -SO-, -SO ₂ -, -CO-, - O-, -COO-, -OCO-, -S-, -NR ^M CO-, -CONR ^M -, and groups formed by combining two or more of these, R ^M represents a hydrogen atom, an alkyl group, an aryl group group or heterocyclic group, P ^1M represents a polymer chain including a repeating unit represented by any one of formulas (P1-1) to (P1-4), n represents an integer of 1 or more, m1 represents 0-3 Integer, m2 represents an integer from 0 to 3, [Chemical formula 31]

In formula (P1-1) to formula (P1-4), R ^G1 and R ^G2 each represent an alkylene group.

Examples of the hydrocarbon group in X ^1M and the hydrocarbon group in Lp ^1M include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The carbon number of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. In addition, the cycloaliphatic hydrocarbon group may have a crosslinked structure. The carbon number of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. As a substituent, the above-mentioned substituent T is mentioned.

The details of the polymer chain represented by P ^1M in the formula (MM1) are the same as those described for the polymer chain represented by P ¹ in the formula (1). Preferably, n in the formula (MM1) is 1 or 2. It is preferable that m1 and m2 in formula (MM1) are each independently an integer of 0 to 2, 0 or 1 is more preferable, and 0 is still more preferable.

If hydrochloric acid remains, the acid dianhydride macromonomer may have problems such as deterioration and corrosion. Therefore, in the presence of an alkali, a polymer having 2 hydroxyl groups at the end is mixed with chlorinated trimellitic anhydride, and the resulting salt is separated. It is preferred to synthesize the acid salt. As the base, an organic base or an inorganic base may be used. In the case of an organic base, a tertiary alkylamine, a tertiary aromatic amine, a heterocyclic aromatic amine, etc. are used. For example, triethylamine, diisopropylethylamine, tributylamine, diethylaniline, pyridine, 4,4-dimethylaminopyridine, 2-picoline, 2,6-lutidine , imidazole, 1-methylimidazole, 1-ethylimidazole, triazole, tetrazole, etc. Examples of the separation method include a method of filtration using a filter (natural filtration, pressure filtration, reduced pressure filtration, centrifugal filtration), a method of separating a liquid into an organic layer and an aqueous layer, a method of centrifugal separation, and adsorption ( Silica gel column, activated carbon, etc.) method, etc.

In the synthesis of a specific resin, the molar ratio of the acid dianhydride compound (the sum of the acid dianhydride macromonomer and the acid dianhydride not containing the polymer chain) to the diamine is based on 1 mole of the diamine, the acid diamine The anhydride compound is preferably 0.5-1.5 mol, more preferably 0.7-1.3 mol, and even more preferably 0.9-1.1 mol. In addition, a blocking agent can be used when synthesizing a specific resin. The blocking agent is not particularly limited, and known blocking agents can be used, and examples thereof include monoamines, acid anhydrides, monocarboxylic acids, monocarboxylic acid chlorides, monocarboxylic acid halide compounds, and monocarboxylic acid active esters. For example, monosubstituted acid anhydrides or monosubstituted amines can be used. In addition, as the blocking agent, for example, the compounds described in paragraphs 0034 to 0036 of JP 2019-101440 A can also be used. In addition, by sealing the end of a specific resin with an end-capping agent having a hydroxyl group, a carboxyl group, a sulfonic acid group, a thiol group, a vinyl group, an ethynyl group, or an allyl group, the dissolution rate of the resin in the alkali solution, the rate of dissolution of the resin, and the The mechanical properties of the obtained cured film are adjusted within a preferred range. The amount of the end-capping agent can be adjusted according to the molecular weight of the target specific resin. For example, in diamines, macromonomers with two acid anhydride groups and acid dianhydrides, relative to the total amount of compounds bound to the end-capping agent , 1 mol% to 30 mol% can be used, preferably 2 mol% to 20 mol%, more preferably 3 mol% to 10 mol%. Moreover, the storage stability of the specific resin or the storage stability of the composition containing a specific resin can also be improved by using a terminal blocker in the synthesis|combination of a specific resin.

In addition, a specific resin can also be synthesized by reacting an acid dianhydride macromonomer and a monoamine. According to this synthesis method, the resin of the structure represented by the formula (1A) can be synthesized. Regarding the molar ratio of the acid dianhydride macromonomer to the monoamine, relative to 1 mole of the monoamine, the acid dianhydride macromonomer system is preferably 0.5 to 1.5 moles, preferably 0.7 to 1.3 moles, and 0.9 moles. ~1.1 moles is further preferred.

(other resins) The resin composition of the present invention may contain other resins other than the above-mentioned specific resins as resins. As other resins, for example, resins having alkali developability, resins as dispersants, and the like can be mentioned. Moreover, by-products at the time of synthesizing a specific resin may be included.

[Resin with alkali developability] The weight average molecular weight (Mw) of the resin having alkali developability is preferably 3,000 to 2,000,000. The upper limit is more preferably 1,000,000 or less, and even more preferably 500,000 or less. The lower limit is more preferably 4,000 or more, and further more preferably 5,000 or more.

Examples of resins having alkali developability include (meth)acrylic resins, polyimide resins, polyether resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, polyimide resins, and the like. , (meth)acrylic resin and polyimide resin are preferred, and (meth)acrylic resin is more preferred. In addition, as other resins, the resins described in paragraphs 0041 to 0060 of JP 2017-206689 A, the resins described in JP 2018-010856 A The resin described in JP 057265 A, the resin described in JP 2017-032685 A, the resin described in JP 2017-075248 A, and the resin described in JP 2017-066240 A.

Moreover, as resin which has alkali developability, it is preferable to use resin which has an acid group. According to this aspect, the developability of the resin composition can be further improved. Examples of the acid group include a phenolic hydroxyl group, a carboxyl group, a sulfo group, a phosphoric acid group, a phosphonic acid group, an active imino group, a sulfonamido group, and the like, and a carboxyl group is preferred. Moreover, as resin which has an acid group, the resin which an acid group was introduce|transduced by making an acid anhydride and the hydroxyl group generate|occur|produced by epoxy ring opening can also be used. As such a resin, the resin described in Japanese Patent No. 6349629 can be mentioned. For example, a resin having an acid group can be used as the alkali-soluble resin.

It is preferable that the resin with alkali developability contains repeating units having an acid group in the side chain, and more preferably 1-70 mol% of the repeating unit having an acid group in the side chain is contained in all repeating units of the resin. The upper limit of the content of the repeating unit having an acid group in the side chain is preferably 50 mol % or less, more preferably 40 mol % or less. The lower limit of the content of the repeating unit having an acid group in the side chain is preferably 2 mol % or more, more preferably 5 mol % or more.

The acid value of the resin with alkali developability is preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, further preferably 120 mgKOH/g or less, and particularly preferably 100 mgKOH/g or less. Further, the acid value of the resin having an acid group is preferably 5 mgKOH/g or more, more preferably 10 mgKOH/g or more, and even more preferably 20 mgKOH/g or more.

It is also preferable that the resin having alkali developability further has a group containing an ethylenically unsaturated bond. Examples of the group containing an ethylenically unsaturated bond include vinyl, allyl, (meth)acryloyl and the like, and allyl and (meth)acryloyl are preferred, and (meth)propylene Acryl-based is better.

Preferably, the resin having a group containing an ethylenically unsaturated bond contains a repeating unit having a group containing an ethylenically unsaturated bond in the side chain, and contains 5-80 mol% of the side chain in all the repeating units of the resin. More preferably, the chain has a repeating unit containing a group containing an ethylenically unsaturated bond. The upper limit of the content of the repeating unit having a group containing an ethylenically unsaturated bond in the side chain is preferably 60 mol % or less, more preferably 40 mol % or less. The lower limit of the content of the repeating unit having a group containing an ethylenically unsaturated bond in the side chain is preferably 10 mol% or more, more preferably 15 mol% or more.

The resin having alkali developability is derived from containing a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) (hereinafter, these compounds are also referred to as "ether dimers". ) is preferably the repeating unit of the monomer component.

[Chemical formula 32]

式（ED2）中，R表示氫原子或碳數1～30的有機基團。關於式（ED2）的詳細內容，能夠參考日本特開2010-168539號公報的記載，該內容編入本說明書中。In formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. [Chemical formula 33]

In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of the formula (ED2), the description of JP 2010-168539 A can be referred to, and the content is incorporated in the present specification.

As a specific example of the ether dimer, for example, reference can be made to paragraph 0317 of JP 2013-029760 A, the content of which is incorporated in the present specification.

式（X）中，R₁ 表示氫原子或甲基，R₂ 表示碳數2～10的伸烷基，R₃ 表示氫原子或可以包含苯環之碳數1～20的烷基。n表示1～15的整數。It is also preferable that the resin having alkali developability contains a repeating unit derived from a compound represented by the following formula (X). [Chemical formula 34]

In formula (X), R ₁ represents a hydrogen atom or a methyl group, R ₂ represents an alkylene group having 2 to 10 carbon atoms, and R ₃ represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may contain a benzene ring. n represents an integer of 1-15.

As resin which has alkali developability, the resin etc. of the following structures are mentioned, for example. [Chemical formula 35]

〔Dispersant〕 The resin composition of the present invention can also contain a resin as a dispersant. The dispersing agent includes an acidic dispersing agent (acidic resin) and a basic dispersing agent (basic resin). Here, the acidic dispersant (acidic resin) refers to a resin in which the amount of acid groups is larger than the amount of bases. Regarding the acidic dispersant (acidic resin), when the total amount of the amount of the acid group and the amount of the base is 100 mol%, a resin in which the amount of the acid group accounts for 70 mol% or more is preferable, and substantially only The resin composed of acid groups is more preferable. The acid group of the acidic dispersant (acidic resin) is preferably a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 40 to 105 mgKOH/g, more preferably 50 to 105 mgKOH/g, and even more preferably 60 to 105 mgKOH/g. In addition, the basic dispersant (basic resin) refers to a resin in which the amount of bases is larger than the amount of acid groups. Regarding the basic dispersant (basic resin), when the total amount of the amount of the acid group and the amount of the basic group is 100 mol %, a resin in which the amount of the basic group exceeds 50 mol % is preferable. The base-based amine group possessed by the alkaline dispersant is preferred.

It is preferable that the resin used as a dispersant contains a repeating unit having an acid group.

Resin-based graft polymers used as dispersants are also preferred. Examples of the graft polymer include resins described in paragraphs 0025 to 0094 of JP 2012-255128 A, the contents of which are incorporated in the present specification.

The resin used as the dispersant is also preferably a polyimide-based dispersant (polyimide resin) containing a nitrogen atom in at least one of the main chain and the side chain. As the polyimine-based dispersant, a resin having a main chain and a side chain and having a basic nitrogen atom in at least one of the main chain and the side chain is preferable, and the main chain includes a partial structure having a functional group of pKa14 or less. , and the number of atoms in the side chain is 40 to 10,000. The basic nitrogen atom is not particularly limited as long as it is a basic nitrogen atom. Examples of the polyimide-based dispersing agent include resins described in paragraphs 0102 to 0166 of JP 2012-255128 A, the contents of which are incorporated in the present specification.

The resin used as the dispersant is preferably a resin having a structure in which a plurality of polymer chains are bonded to the core. As such a resin, a dendrimer (including a star polymer) is mentioned, for example. Moreover, as a specific example of a dendrimer, the polymer compound C-1-C-31 etc. which are described in the paragraphs 0196-0209 of Unexamined-Japanese-Patent No. 2013-043962 are mentioned.

The dispersant can also be obtained as a commercial item, and specific examples of this include DISPERBYK series (for example, DISPERBYK-111, 161, etc.) manufactured by BYK-Chemie GmbH, and Solsperse series (for example, Solsperse 36000, etc.) manufactured by Lubrizol Wait. In addition, the pigment dispersants described in paragraphs 0041 to 0130 of JP-A-2014-130338 can also be used, and the contents are incorporated in this specification. In addition, as a dispersant, Japanese Patent Laid-Open No. 2018-150498, Japanese Patent Laid-Open No. 2017-100116, Japanese Patent Laid-Open No. 2017-100115, Japanese Patent Laid-Open No. 2016-108520, and Japanese Patent Laid-Open No. 2016-108519 can be used. , The compound described in Japanese Patent Laid-Open No. 2015-232105.

Moreover, the resin demonstrated as the said dispersing agent can also be used for the application other than a dispersing agent. For example, it can also be used as an adhesive.

The content of the resin in the total solid content of the resin composition is preferably 5 to 60 mass %. The lower limit is preferably 10% by mass or more, and more preferably 15% by mass or more. The upper limit is preferably 50 mass % or less, and more preferably 40 mass % or less.

It is preferable that content of the said specific resin in the total solid content of a resin composition is 5-60 mass %. The lower limit is preferably 10% by mass or more, and more preferably 15% by mass or more. The upper limit is preferably 50 mass % or less, and more preferably 40 mass % or less.

It is preferable that content of the said specific resin is 10-80 mass parts with respect to 100 mass parts of pigments. The lower limit is preferably 20 parts by mass or more, and more preferably 30 parts by mass or more. The upper limit is preferably 70 parts by mass or less, and more preferably 50 parts by mass or less.

In addition, the resin composition of the present invention preferably contains 20% by mass or more of the specific resin, more preferably 30% by mass or more, and more preferably 40% by mass or more, among the components excluding the color material from the total solid content of the resin composition. for further better. The upper limit can be 100 mass %, 90 mass % or less, and 85 mass % or less. As long as the content of the specific resin is within the above-mentioned range, it becomes easy to form a film excellent in heat resistance, and it becomes easier to suppress film shrinkage after heating and the like. Furthermore, when an inorganic film or the like is formed on the surface of a film obtained by using the resin composition of the present invention, even if the laminate is exposed to a high temperature, the occurrence of cracks and the like in the inorganic film can be suppressed. Moreover, it is preferable that the total content of the color material and the said specific resin in the total solid content of a resin composition is 25-100 mass %. The lower limit is more preferably 30% by mass or more, and more preferably 40% by mass or more. The upper limit is more preferably 90 mass % or less, and even more preferably 80 mass % or less.

In the resin composition, the content of the other resins is preferably 230 parts by mass or less, more preferably 200 parts by mass or less, and even more preferably 150 parts by mass or less, relative to 100 parts by mass of the specific resin. The lower limit may be 0 parts by mass, 5 parts by mass or more, or 10 parts by mass or more. Moreover, it is also preferable that the resin composition does not substantially contain the other resins described above. According to this aspect, it becomes easy to form a film excellent in heat resistance. The case where other resins are not substantially contained means that the content of other resins in the total solid content of the resin composition is 0.1 mass % or less, preferably 0.05 mass % or less, and more preferably not containing.

<Solvent C> The resin composition of the present invention contains a solvent C (hereinafter, referred to as a solvent). The solvent is basically not particularly limited as long as it satisfies the solubility of each component and the coatability of the resin composition. The solvent is preferably an organic solvent. Examples of the organic solvent include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, hydrocarbon-based solvents, and the like, selected from ester-based solvents, ether-based solvents, alcohol-based solvents, and ketone-based solvents At least one of them is preferred. For details of these, reference can be made to paragraph 0223 of International Publication No. WO 2015/166779, which is incorporated in the present specification. In addition, an ester-based solvent substituted with a cyclic alkyl group and a ketone-based solvent substituted with a cyclic alkyl group can also be preferably used. Specific examples of the organic solvent include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, and ethyl selthyl acetate. , ethyl lactate, diethylene glycol dimethyl ether ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate , propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylpropionamide, 3-butoxy-N,N-dimethylpropionamide, propylene glycol two Acetate, 3-methoxybutanol, methyl ethyl ketone, γ-butyrolactone, cyclobutane, anisole, etc. However, in some cases, for environmental reasons, it is preferable to reduce aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents (for example, it can be set to 50% by mass relative to the total amount of organic solvents) ppm (parts per million: parts per million) or less, may be 10 mass ppm or less, or 1 mass ppm or less).

In the present invention, it is preferable to use an organic solvent with less metal content, and it is preferable that the metal content of the organic solvent is, for example, 10 parts per billion (parts per billion) or less. An organic solvent of quality ppt (parts per trillion: parts per trillion) grade can be used as needed, such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd (Chemical Industry Daily, November 13, 2015). As a method of removing impurities, such as a metal, from an organic solvent, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter are mentioned, for example. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon.

Organic solvents can contain isomers (compounds with the same number of atoms but different structures). In addition, only one type of isomers may be contained, or a plurality of types may be contained.

The content of the peroxide in the organic solvent is preferably 0.8 mmol/L or less, and it is more preferably not substantially contained.

The content of the organic solvent in the resin composition is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and even more preferably 30 to 90% by mass.

＜Pigment derivatives＞ The resin composition of the present invention preferably contains a pigment derivative. As the pigment derivative, a compound having a structure in which a part of the chromophore group is substituted with an acid group, a base group, or a phthalimidomethyl group can be mentioned. As the chromophore constituting the pigment derivative, a quinoline skeleton, a benzimidazolone skeleton, a diketopyrrolopyrrole skeleton, an azo skeleton, a phthalocyanine skeleton, an anthraquinone skeleton, a quinacridone skeleton, a diketopyrrolo skeleton, skeleton, perylene skeleton, thioindigo skeleton, isoindoline skeleton, isoindolinone skeleton, quinoline yellow skeleton, reduction skeleton, metal complex skeleton, etc., quinoline skeleton, benzimidazole Ketone skeleton, diketopyrrolopyrrole skeleton, azo skeleton, quinoline yellow skeleton, isoindoline skeleton and phthalocyanine skeleton are preferred, and azo skeleton and benzimidazolone skeleton are more preferred. As the acid group of the pigment derivative, a sulfo group and a carboxyl group are preferable, and a sulfo group is more preferable. As the base of the pigment derivative, an amine group is preferable, and a tertiary amine group is more preferable.

As the pigment derivative, a pigment derivative excellent in visible light transparency (hereinafter, also referred to as a transparent pigment derivative) can also be used. The maximum value (εmax) of the molar absorption coefficient of the transparent pigment derivative in the wavelength region of 400 to 700 nm is preferably 3000L·mol ^-1 ·cm ^-1 or less, and more preferably 1000L·mol ^-1 ·cm ^-1 or less. 100L·mol ^-1 ·cm ^-1 or less is more preferable. For example, the lower limit of εmax is 1 L·mol ^-1 ·cm ^-1 or more, and may be 10 L·mol ^-1 ·cm ^-1 or more.

Specific examples of pigment derivatives include JP 56-118462 A, JP 63-264674 A, JP 01-217077 A, JP 03-009961 A, JP 03-009961 A. JP 03-026767, JP 03-153780, JP 03-045662, JP 04-285669, JP 06-145546, JP 06-212088 No., Japanese Patent Laid-Open No. Hei 06-240158, Japanese Patent Laid-Open No. 10-030063, Japanese Patent Laid-Open No. Hei 10-195326, Paragraphs 0086 to 0098 of International Publication No. 2011/024896, International Publication No. 2012/102399 Paragraphs 0063 to 0094 of International Publication No. 2017/038252, Paragraph 0171 of Japanese Patent Application Laid-Open No. 2015-151530, Paragraphs 0162 to 0183 of Japanese Patent Application Laid-Open No. 2011-252065, Japanese Patent Application Laid-Open No. 2003-081972 Gazette, JP 5299151 A, JP 2015-172732 A, JP 2014-199308 A, JP 2014-085562 A, JP 2014-035351 A, JP 2008- Compounds described in Gazette 081565 and JP 2019-109512 A.

The content of the pigment derivative is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, relative to 100 parts by mass of the pigment. One type of pigment derivative may be used alone, or two or more types may be used in combination.

<Polymerizable monomer> The resin composition of the present invention preferably contains a polymerizable monomer. As a polymerizable monomer, a well-known compound which can be crosslinked by radical, acid, or heat can be used, for example. As a polymerizable monomer, the compound which has a group containing an ethylenically unsaturated bond, the compound which has a cyclic ether group, etc. are mentioned, The compound which has a group containing an ethylenically unsaturated bond is preferable. As a group containing an ethylenically unsaturated bond, a vinyl group, a (meth)allyl group, a (meth)acryloyl group, etc. are mentioned. As a cyclic ether group, an epoxy group, an oxetanyl group, etc. are mentioned. A compound having a group containing an ethylenically unsaturated bond can be preferably used as a radical polymerizable monomer. Moreover, the compound which has a cyclic ether group can be used suitably as a cationically polymerizable monomer. The polymerizable monomer system is preferably a polyfunctional polymerizable monomer. That is, the polymerizable monomer system is preferably a monomer having two or more polymerizable groups, such as a group containing an ethylenically unsaturated bond or a cyclic ether group.

The molecular weight of the polymerizable monomer is preferably 100 to 3000. The upper limit is more preferably 2000 or less, and further more preferably 1500 or less. The lower limit is more preferably 150 or more, and more preferably 250 or more.

(Compounds with groups containing ethylenically unsaturated bonds) As a compound having a group containing an ethylenically unsaturated bond used as a polymerizable monomer, a polyfunctional compound is preferable. That is, compounds containing two or more groups containing ethylenically unsaturated bonds are preferable, compounds containing three or more groups containing ethylenically unsaturated bonds are more preferable, and 3-15 groups containing ethylenically unsaturated bonds are more preferable. The compound of the group containing a saturated bond is further preferable, and the compound containing 3-6 groups containing an ethylenically unsaturated bond is further preferable. Moreover, it is preferable that the compound which has a group containing an ethylenically unsaturated bond is a 3-15 functional (meth)acrylate compound, and a 3-6 functional (meth)acrylate compound is more preferable. Specific examples of the compound having a group containing an ethylenically unsaturated bond include paragraphs 0095 to 0108 of JP 2009-288705 A, paragraph 0227 of JP 2013-029760 A, and JP 2008 - Paragraphs 0254 to 0257 of Japanese Patent Application Laid-Open No. 292970, paragraphs 0034 to 0038 of Japanese Patent Application Laid-Open No. 2013-253224, paragraph 0477 of Japanese Patent Application Laid-Open No. 2012-208494, Japanese Patent Application Laid-Open No. 2017-048367, Japanese Patent No. 6057891 The compounds described in the gazette, Japanese Patent No. 6031807, and Japanese Patent Laid-Open No. 2017-194662 are incorporated in the present specification.

As a compound having a group containing an ethylenically unsaturated bond, dipeptaerythritol tri(meth)acrylate (commercially available, KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipival erythritol tri(meth)acrylate Tetraol tetrakis(meth)acrylate (available as a commercial item, KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), Dipionaerythritol penta(meth)acrylate (available as a commercial item, KAYARAD D -310; manufactured by Nippon Kayaku Co., Ltd.), dipivaloerythritol hexa(meth)acrylate (as a commercial item, KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK ESTER A-DPH-12E ; manufactured by Shin-Nakamura Chemical Co., Ltd.) and compounds of the structure in which these (meth)acryloyl groups are bonded via ethylene glycol and/or propylene glycol residues (for example, SR454 commercially available from SARTOMER Company, Inc. , SR499) is better. In addition, as a compound having a group containing an ethylenically unsaturated bond, diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available, M-460; TOAGOSEI CO., Ltd.), neopentaerythritol tetraacrylate (manufactured by Shin Nakamura Chemical Co., Ltd., NK ESTER A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., Ltd.), NK Oligo UA-7200 (manufactured by Shin Nakamura Chemical Co., Ltd.), 8UH -1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL Co., Ltd.), and the like.

In addition, as a compound having a group containing an ethylenically unsaturated bond, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, Tri-functional ethylene oxide modified tri(meth)acrylate, isocyanuric ethylene oxide modified tri(meth)acrylate, neopentaerythritol tri(meth)acrylate, etc. (Meth)acrylate compounds are also preferred. As a commercial item of a trifunctional (meth)acrylate compound, ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 ( Nippon Kayaku Co., Ltd.) and so on.

The compound which has an ethylenically unsaturated bond-containing group can also use the compound which has an acid group. By using the compound which has an acid group, generation|occurrence|production of a development residue can be suppressed. As an acid group, a carboxyl group, a sulfo group, a phosphoric acid group, etc. are mentioned, A carboxyl group is preferable. As a commercial item of the polymerizable monomer which has an acid group, ARONIX M-305, M-510, M-520, ARONIX TO-2349 (made by TOAGOSEI CO., LTD.) etc. are mentioned. As a preferable acid value of the polymerizable monomer which has an acid group, it is 0.1-40 mgKOH/g, More preferably, it is 5-30 mgKOH/g. When the acid value of the polymerizable compound is 0.1 mgKOH/g or more, the solubility in the developing solution is favorable, and when it is 40 mgKOH/g or less, it is advantageous in terms of production and handling.

A compound having a group containing an ethylenically unsaturated bond is a compound having a caprolactone structure as well. The compound which has a caprolactone structure is marketed as KAYARAD DPCA series by Nippon Kayaku Co., Ltd., for example, DPCA-20, DPCA-30, DPCA-60, DPCA-120 etc. are mentioned.

As the compound having a group containing an ethylenically unsaturated bond, a compound having an alkaneoxy group can also be used. The compound with alkene group is preferably the compound with ethoxy group and/or propoxy group, the compound with ethoxy group is more preferably, and the compound with 4-20 ethoxy group is 3-6 Functional (meth)acrylate compounds are further preferred. As a commercial item of the polymerizable compound which has an alkylene group, for example, SR-494 which is a tetrafunctional (meth)acrylate having 4 ethoxy groups made by SARTOMER Company, Inc., SR-494 having 3 A trifunctional (meth)acrylate of an isobutoxy group, namely KAYARAD TPA-330 and the like.

As the compound having a group containing an ethylenically unsaturated bond, a compound having a perylene skeleton can also be used. As a commercial item of the compound which has a perylene skeleton, OGSOL EA-0200, EA-0300 (Osaka Gas Chemicals Co., Ltd. make, the (meth)acrylate monomer which has a perylene skeleton) etc. are mentioned.

As a compound which has a group containing an ethylenically unsaturated bond, it is also preferable to use a compound which does not substantially contain environmental control substances such as toluene. As a commercial item of such a compound, KAYARAD DPHA LT, KAYARAD DPEA-12 LT (made by Nippon Kayaku Co., Ltd.) etc. are mentioned.

As a compound having a group containing an ethylenically unsaturated bond, Japanese Patent Publication No. 48-041708, Japanese Patent Publication No. 51-037193, Japanese Patent Publication No. 02-032293, and Japanese Patent Publication No. 02-016765 Urethane acrylates described in, Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 A urethane compound having an ethylene oxide-based skeleton is also preferred. In addition, it is also preferable to use compounds having an amine group structure or a sulfide structure in the molecule as described in Japanese Patent Application Laid-Open No. 63-277653, Japanese Patent Application Laid-Open No. 63-260909, and Japanese Patent Application Laid-Open No. 01-105238. . As the polymerizable compound, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, Commercially available products such as AH-600, T-600, AI-600, and LINC-202UA (manufactured by KYOEISHA CHEMICAL Co., LTD.).

(compounds with cyclic ether groups) As a compound having a cyclic ether group used as a polymerizable monomer, a compound having an epoxy group (hereinafter, also referred to as an epoxy compound) and a compound having an oxetanyl group (hereinafter, also referred to as an epoxy compound) can be mentioned. oxetane compounds). The epoxy compound is preferably a polyfunctional epoxy compound. That is, the epoxy compound is preferably a compound having two or more epoxy groups. The upper limit of the number of epoxy groups is preferably 20 or less, more preferably 10 or less. Further, the oxetane compound is preferably a polyfunctional oxetane compound. That is, the oxetane compound is preferably a compound having two or more oxetane groups. The upper limit of the number of oxetane groups is preferably 20 or less, more preferably 10 or less.

Commercially available epoxy compounds include JER828, JER1007, JER157S70 (manufactured by Mitsubishi Chemical Corporation), JER157S65 (manufactured by Mitsubishi Chemical Holdings Corporation), and others described in paragraph 0189 of JP-A No. 2011-221494. products, etc. Other commercially available products include ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (the above are manufactured by ADEKA CORPORATION), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (the above are manufactured by ADEKA CORPORATION), DENACOL EX-611, EX-612, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-411, EX- 421, EX-313, EX-314, EX-321, EX-211, EX-212, EX-810, EX-811, EX-850, EX-851, EX-821, EX-830, EX-832, EX-841, EX-911, EX-941, EX-920, EX-931, EX-212L, EX-214L, EX-216L, EX-321L, EX-850L, DLC-201, DLC-203, DLC- 204, DLC-205, DLC-206, DLC-301, DLC-402, EX-111, EX-121, EX-141, EX-145, EX-146, EX-147, EX-171, EX-192 ( The above are manufactured by Nagase ChemteX Corporation), YH-300, YH-301, YH-302, YH-315, YH-324, YH-325 (the above are manufactured by NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.), CELLOXIDE 2021P, 2081 , 2000, 3000, EHPE3150, EPOLEAD GT400, Serviners B0134, B0177 (made by Daicel Corporation), TETRAD-X (made by MITSUBISHI GAS CHEMICAL COMPANY, INC.), etc.

As commercially available products of oxetane compounds, OXT-201, OXT-211, OXT-212, OXT-213, OXT-121, OXT-221, OX-SQ TX-100, (the above are TOAGOSEI CO. , LTD.) and so on.

The content of the polymerizable monomer in the total solid content of the resin composition is preferably 0.1 to 40% by mass. The lower limit is preferably 0.5 mass % or more, and more preferably 1 mass % or more. The upper limit is preferably 30 mass % or less, more preferably 20 mass % or less.

When a compound having an ethylenically unsaturated bond-containing group is used as the polymerizable monomer, the content of the compound having an ethylenically unsaturated bond-containing group as the polymerizable monomer with respect to 100 parts by mass of the above-mentioned specific resin It is preferably 1 to 50 parts by mass. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less.

When a compound having a cyclic ether group is used as the polymerizable monomer, the content of the compound having a cyclic ether group as the polymerizable monomer is preferably 1 to 50 parts by mass relative to 100 parts by mass of the specific resin. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less.

When a compound having an ethylenically unsaturated bond-containing group and a compound having a cyclic ether group are used as the polymerizable monomer, in the resin composition, with respect to the compound having an ethylenically unsaturated bond-containing group, the Preferably, 10 to 500 parts by mass of the compound having a cyclic ether group is contained in 100 parts by mass. The lower limit is preferably 20 parts by mass or more, and more preferably 30 parts by mass or more. The upper limit is preferably 400 parts by mass or less, and more preferably 300 parts by mass or less. As long as the ratio of the two is within the above range, a film having more excellent heat resistance (cracking suppression and film shrinkage suppression) can be formed.

<Photopolymerization initiator> The resin composition of the present invention preferably contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited, and can be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light in the ultraviolet region to the visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (for example, compounds having a triazole skeleton, compounds having an oxadiazole skeleton, and an imidazole skeleton), acylphosphine compounds, hexaarylbiimidazoles, and oxime compounds. , organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiators are trihalomethyltriazole compounds, biimidazole compounds, benzyldimethylketal compounds, α-hydroxyketone compounds, α-aminoketone compounds, and acylphosphine Compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes , halomethyl oxadiazole compounds and 3-aryl substituted coumarin compounds are preferably selected from the group consisting of biimidazole compounds, oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds and acyl phosphine compounds The compound is more preferable, and the oxime compound is further preferable. In addition, as the photopolymerization initiator, the compounds described in paragraphs 0065 to 0111 of Japanese Patent Laid-Open No. 2014-130173, the compounds described in Japanese Patent No. 6301489, MATERIAL STAGE 37 to 60p, vol. 19 can be mentioned. , the peroxide-based photopolymerization initiator described in No.3, 2019, the photopolymerization initiator described in International Publication No. 2018/221177, and the photopolymerization initiator described in International Publication No. 2018/110179 , The photopolymerization initiator described in Japanese Patent Laid-Open No. 2019-043864, the photopolymerization initiator described in Japanese Patent Laid-Open No. 2019-044030, the peroxide system described in Japanese Patent Laid-Open No. 2019-167313 starter, which are incorporated into this specification.

As the biimidazole compound, 2,2-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-chlorophenyl)- 4,4',5,5-Tetrakis(3,4,5-trimethoxyphenyl)-1,2'-biimidazole, 2,2'-bis(2,3-dichlorophenyl)-4 ,4',5,5'-tetraphenylbiimidazole and 2,2'-bis(o-chlorophenyl)-4,4,5,5'-tetraphenyl-1,2'-biimidazole, etc. Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (the above are manufactured by IGM Resins BV), Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (the above are BASF company), etc. Commercially available α-amino ketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (the above are manufactured by IGM Resins BV), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (the above are BASF Corporation) etc. Commercially available products of the acylphosphine compound include Omnirad 819, Omnirad TPO (the above are manufactured by IGM Resins B.V.), Irgacure 819, and Irgacure TPO (the above are manufactured by BASF Corporation).

As the oxime compound, the compound described in JP 2001-233842 A, the compound described in JP 2000-080068 A, the compound described in JP 2006-342166 A, JCSPerkin II ( Compounds described in 1979, pp. 1653-1660), compounds described in JCSPerkin II (1979, pp. 156-162), Journal of Photopolymer Science and Technology (1995, pp. 202-232) the compound described in JP 2000-066385 A, the compound described in JP 2004-534797 A, the compound described in JP 2006-342166 A, JP 2017-019766 A The compound described in, the compound described in Japanese Patent No. 6065596, the compound described in International Publication No. 2015/152153, the compound described in International Publication No. 2017/051680, the compound described in Japanese Patent Laid-Open No. 2017-198865 The compound, the compound described in paragraphs 0025 to 0038 of International Publication No. 2017/164127, the compound described in International Publication No. 2013/167515, and the like. Specific examples of the oxime compound include 3-benzyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, and 3-propionoxyiminobutane-2-one. Aminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzyl Oxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one and 2-ethoxycarbonyloxyimino-1 -Phenylpropan-1-one, etc. Commercially available products include Irgacure-OXE01, Irgacure-OXE02, Irgacure-OXE03, Irgacure-OXE04 (the above are manufactured by BASF Corporation), TR-PBG-304 (manufactured by Changzhou Trolly New Electronic Materials CO., LTD.), Adeka Optomer N-1919 (manufactured by ADEKA CORPORATION, photopolymerization initiator 2 described in Japanese Patent Laid-Open No. 2012-014052). Moreover, as an oxime compound, it is also preferable to use a non-colorable compound or a compound with high transparency and not easily discolored. As a commercial item, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (the above are manufactured by ADEKA CORPORATION) etc. are mentioned.

As a photopolymerization initiator, an oxime compound having a perylene ring can also be used. As a specific example of the oxime compound which has a perylene ring, the compound described in Unexamined-Japanese-Patent No. 2014-137466 is mentioned.

Moreover, as a photoinitiator, the oxime compound which has at least one benzene ring of a carbazole ring and becomes a skeleton of a naphthalene ring can also be used. Specific examples of such oxime compounds include compounds described in International Publication No. 2013/083505.

As the photopolymerization initiator, an oxime compound having a fluorine atom can also be used. Specific examples of the oxime compound having a fluorine atom include compounds described in JP 2010-262028 A, compounds 24, 36 to 40 described in JP 2014-500852 A, and JP 2013-A Compound (C-3) and the like described in Gazette No. 164471.

As a photopolymerization initiator, an oxime compound in which a substituent having a hydroxyl group is bonded to a carbazole skeleton can also be used. As such a photopolymerization initiator, the compound described in International Publication No. 2019/088055, etc. are mentioned.

As the photopolymerization initiator, an oxime compound having a nitro group can be used. It is also preferable that the oxime compound having a nitro group is a dimer. Specific examples of the oxime compound having a nitro group include the compounds described in paragraphs 0031 to 0047 of JP 2013-114249 A, and the compounds described in paragraphs 0008 to 0012 and 0070 to 0079 of JP 2014-137466 A. The compound described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

As the photopolymerization initiator, an oxime compound having a benzofuran skeleton can also be used. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

As a photopolymerization initiator, an oxime compound in which a substituent having a hydroxyl group is bonded to a carbazole skeleton can also be used. As such a photopolymerization initiator, the compound described in International Publication No. 2019/088055, etc. are mentioned.

Specific examples of the oxime compound are shown below, but the present invention is not limited to these.

[化學式37]

[Chemical formula 36]

[Chemical formula 37]

The oxime compound is preferably a compound having a maximum absorption wavelength within a wavelength range of 350-500 nm, and more preferably a compound having a maximum absorption wavelength within a wavelength range of 360-480 nm. Also, from the viewpoint of sensitivity, the oxime compound preferably has a high molar absorption coefficient at a wavelength of 365 nm or 405 nm, more preferably 1,000 to 300,000, more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured by a known method. For example, it is preferable to measure at a concentration of 0.01 g/L with a spectrophotometer (Cary-5 spectrophotometer (spectrophotometer) manufactured by Varian) using ethyl acetate.

As the photopolymerization initiator, a bifunctional or trifunctional or more photoradical polymerization initiator can be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, so that good sensitivity can be obtained. In addition, when a compound having an asymmetric structure is used, the crystallinity decreases, the solubility in a solvent or the like increases, and precipitation becomes difficult over time, whereby the temporal stability of the resin composition can be improved. Specific examples of the bifunctional or trifunctional or more photo-radical polymerization initiators include Japanese Patent Publication No. 2010-527339, Japanese Patent Publication No. 2011-524436, International Publication No. 2015/004565, and Japanese Patent Publication No. 2010-527339. The dimers of oxime compounds described in paragraphs 0407 to 0412 of Table 2016-532675, the dimers of oxime compounds described in paragraphs 0039 to 0055 of International Publication No. 2017/033680, the compounds (E) and Compound (G), Cmpd1 to 7 described in International Publication No. 2016/034963, oxime ester-based photoinitiator described in paragraph 0007 of JP 2017-523465 A, JP 2017-167399 A The photoinitiator described in paragraphs 0020 to 0033, the photopolymerization initiator (A) described in paragraphs 0017 to 0026 of Japanese Patent Laid-Open No. 2017-151342, the oxime ester compound described in Japanese Patent No. 6469669, and the like.

The content of the photopolymerization initiator in the total solid content of the resin composition is preferably 0.1 to 30% by mass. The lower limit is preferably 0.5 mass % or more, and more preferably 1 mass % or more. The upper limit is preferably 20 mass % or less, and more preferably 15 mass % or less. Only one type of photopolymerization initiator may be used, or two or more types may be used.

＜＜Silane coupling agent＞＞ The resin composition of the present invention can contain a silane coupling agent. In this specification, the silane coupling agent refers to a silane compound having a hydrolyzable group and a functional group other than that. In addition, the hydrolyzable group refers to a substituent which is directly bonded to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. As a hydrolyzable group, a halogen atom, an alkoxy group, an acyloxy group, etc. are mentioned, An alkoxy group is preferable. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Moreover, as a functional group other than a hydrolyzable group, for example, a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an amino group, a urea group, and a thioether group are mentioned. group, isocyanate group, phenyl group, etc., amine group, (meth)acryloyl group and epoxy group are preferred. Specific examples of the silane coupling agent include compounds described in paragraphs 0018 to 0036 of JP 2009-288703 A, compounds described in paragraphs 0056 to 0066 of JP 2009-242604 A, and the like. incorporated into this manual.

The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.1 to 5 mass %. The upper limit is preferably 3 mass % or less, and more preferably 2 mass % or less. The lower limit is preferably 0.5 mass % or more, and more preferably 1 mass % or more. Only one type of silane coupling agent may be used, or two or more types may be used.

＜Hardening accelerator＞ The resin composition of the present invention can further contain a curing accelerator for the purpose of accelerating the reaction of the resin and the polymerizable compound or lowering the curing temperature. As the curing accelerator, methylol-based compounds (for example, in paragraph 0246 of JP-A No. 2015-034963, the compounds exemplified as crosslinking agents), amines, phosphonium salts, amidine salts, amide compounds ( Above, for example, the curing agent described in paragraph 0186 of JP 2013-041165 A), alkali generators (eg, the ionic compounds described in JP 2014-055114 A), cyanate ester compounds ( For example, the compounds described in paragraph 0071 of JP 2012-150180 A), alkoxysilane compounds (for example, the alkoxysilane compounds having epoxy groups described in JP 2011-253054 A) ), onium salt compounds (for example, compounds exemplified as acid generators in paragraph 0216 of JP 2015-034963 A, compounds described in JP 2009-180949 A).

When the resin composition of the present invention contains a curing accelerator, the content of the curing accelerator is preferably 0.3 to 8.9 mass %, more preferably 0.8 to 6.4 mass % in the total solid content of the resin composition.

<Polymerization inhibitor> The resin composition of the present invention can contain a polymerization inhibitor. Examples of the polymerization inhibitor include hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, gallic phenol, tertiary butylcatechol, benzoquinone, 4,4'-thiol Bis(3-methyl-6-tertiarybutylphenol), 2,2'-methylenebis(4-methyl-6-tertiarybutylphenol), N-nitrosophenylhydroxylamine salt ( ammonium salt, first cerium salt, etc.). Among them, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5% by mass.

＜Surfactant＞ The resin composition of the present invention can contain a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicon-based surfactant can be used. As a surfactant, the surfactant described in the paragraphs 0238 to 0245 of International Publication No. 2015/166779 can be mentioned, and the contents are incorporated in this specification.

The surfactant is preferably a fluorine-based surfactant. By containing the fluorine-based surfactant in the resin composition, the liquid properties (especially the fluidity) are further improved, and the liquid saving property can be further improved. Moreover, a film with little thickness variation can also be formed.

The fluorine content in the fluorine-based surfactant is preferably 3 to 40 mass %, more preferably 5 to 30 mass %, and particularly preferably 7 to 25 mass %. A fluorine-based surfactant having a fluorine content within this range is effective in terms of thickness uniformity and liquid saving properties of the coating film, and also has good solubility in the resin composition.

Examples of the fluorine-based surfactant include those described in paragraphs 0060 to 0064 of JP-A No. 2014-041318 (corresponding to paragraphs 0060-0064 of International Publication No. 2014/017669 ), etc. The surfactants described in paragraphs 0117 to 0132 of JP-A-2011-132503 and the surfactants described in JP-A-2020-008634 are incorporated in the present specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F- 144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F- 560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (the above are manufactured by DIC CORPORATION), FLUORAD FC430, FC431, FC171 (the above are Sumitomo 3M) Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (the above are AGC INC. manufactured), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (the above are manufactured by OMNOVA SOLUTIONS INC.), Futuregent 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F (the above are manufactured by NEOS COMPANY LIMITED), etc.

In addition, as the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. As such a fluorochemical surfactant, the description of Unexamined-Japanese-Patent No. 2016-216602 can be referred, and the content is incorporated in this specification.

上述化合物的重量平均分子量較佳為3000～50000，例如為14000。上述化合物中，表示重複單元的比例之%係莫耳%。A block polymer can also be used for the fluorine-based surfactant. For example, the compound described in Unexamined-Japanese-Patent No. 2011-089090 is mentioned. The fluorine-based surfactant can also preferably use a fluorine-containing polymer compound, the fluorine-containing polymer compound includes: a repeating unit derived from a (meth)acrylate compound having a fluorine atom; and a repeating unit derived from a (meth)acrylate compound having two or more ( It is preferably a repeating unit of a (meth)acrylate compound having 5 or more alkeneoxy groups (preferably etheneoxy and propoxy groups). The following compounds are also exemplified as fluorine-based surfactants used in the present invention. [Chemical formula 38]

The weight average molecular weight of the above-mentioned compound is preferably 3,000 to 50,000, for example, 14,000. In the above compounds, the % indicating the ratio of repeating units is mol%.

Moreover, the fluorine-containing polymer which has a group containing an ethylenically unsaturated bond in a side chain can also be used as a fluorine-type surfactant. Specific examples include compounds described in paragraphs 0050 to 0090 and paragraphs 0289 to 0295 of JP-A-2010-164965, for example, MEGAFACE RS-101, RS-102, RS-718K, and RS-72 manufactured by DIC Corporation. -K et al. As the fluorine-based surfactant, compounds described in paragraphs 0015 to 0158 of JP 2015-117327 A can also be used.

The content of the surfactant in the total solid content of the resin composition is preferably 0.001 to 5.0% by mass, more preferably 0.005 to 3.0% by mass. Only one type of surfactant may be used, or two or more types may be used. In the case of two or more kinds, the total amount is preferably within the above range.

＜Ultraviolet absorber＞ The resin composition of the present invention can contain an ultraviolet absorber. As the ultraviolet absorber, conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriene compounds, indole compounds, Three 𠯤 compounds, etc. For details of these, reference can be made to paragraphs 0052 to 0072 of JP 2012-208374 A, paragraphs 0317 to 0334 of JP 2013-068814 A, and paragraphs 0061 to 0080 of JP 2016-162946 A , which are incorporated into this manual. As a commercial item of an ultraviolet absorber, UV-503 (made by DAITO CHEMICAL CO., LTD.) etc. are mentioned, for example. Moreover, as a benzotriazole compound, the MYUA series (Chemical Industry Daily, February 1, 2016) manufactured by MIYOSHI OIL & FAT CO., LTD. can be mentioned. In addition, the compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967 can also be used as the ultraviolet absorber. The content of the ultraviolet absorber in the total solid content of the resin composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. Only one type of ultraviolet absorber may be used, or two or more types may be used. When using 2 or more types, it is preferable that the total amount is in the said range.

＜Antioxidants＞ The photosensitive composition of the present invention can contain an antioxidant. As an antioxidant, a phenol compound, a phosphite compound, a thioether compound, etc. are mentioned. As the phenolic compound, any phenolic compound known as a phenolic antioxidant can be used. A hindered phenol compound is mentioned as a preferable phenol compound. A compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position) is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable. Further, the antioxidant is preferably a compound having a phenol group and a phosphite group in the same molecule. In addition, phosphorus-based antioxidants can also be preferably used as antioxidants. In addition, the compound described in Korean Laid-Open Patent Publication No. 10-2019-0059371 can also be used as the antioxidant. The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Only one type of antioxidant may be used, or two or more types may be used. When using 2 or more types, it is preferable that the total amount is in the said range.

＜Other ingredients＞ The resin composition of the present invention may contain sensitizers, fillers, thermosetting accelerators, plasticizers, and other auxiliaries (for example, conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, peeling accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately containing these components, properties such as film physical properties can be adjusted. Regarding these components, for example, reference can be made to the descriptions in paragraphs 0183 and later of Japanese Patent Application Laid-Open No. 2012-003225 (corresponding to paragraph 0237 of the specification of U.S. Patent Application Publication No. 2013/0034812 ), and the descriptions in Japanese Patent Application Laid-Open No. 2008-250074 The descriptions in paragraphs 0101 to 0104, 0107 to 0109, etc., are incorporated into this specification. Moreover, the resin composition may contain a latent antioxidant as needed. Examples of potential antioxidants include compounds in which the site acting as an antioxidant is protected by a protective group, and the protective group is heated at 100 to 250°C or in the presence of an acid/base catalyst at a concentration of 80 to 200 When heated at °C, it is released and acts as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP 2017-008219 A. As a commercial item, ADEKA ARKLS GPA-5001 (made by ADEKA CORPORATION) etc. are mentioned.

The resin composition of the present invention may contain a metal oxide to adjust the refractive index of the obtained film. As a metal _oxide , _TiO2 , ZrO2, _Al2O3 , _SiO2 , etc. are _mentioned . The primary particle diameter of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, and even more preferably 5 to 50 nm. The metal oxide may have a core-shell structure. In this case, the core portion may be hollow.

The resin composition of the present invention may contain a light resistance improver. Examples of the light resistance improver include compounds described in paragraphs 0036 to 0037 of JP 2017-198787 A, compounds described in paragraphs 0029 to 0034 of JP 2017-146350 A, and JP 2017- Compounds described in paragraphs 0036 to 0037 and 0049 to 0052 of JP 129774 A, compounds described in paragraphs 0031 to 0034 and 0058 to 0059 of JP 2017-129674 A, and 0036 to JP 2017-122803 Compounds described in paragraphs 0037, 0051 to 0054, compounds described in paragraphs 0025 to 0039 of International Publication No. 2017/164127, compounds described in paragraphs 0034 to 0047 of JP 2017-186546 A, JP 2015 - the compounds described in paragraphs 0019 to 0041 of Japanese Patent Application Laid-Open No. 025116, the compounds described in paragraphs 0101 to 0125 of Japanese Patent Application Laid-Open No. 2012-145604, the compounds described in paragraphs 0018 to 0021 of Japanese Patent Application Laid-Open No. 2012-103475, The compounds described in paragraphs 0015 to 0018 of JP 2011-257591 A, the compounds described in paragraphs 0017 to 0021 of JP 2011-191483 A, and the compounds described in paragraphs 0108 to 0116 of JP 2011-145668 A The compounds described, the compounds described in paragraphs 0103 to 0153 of JP-A No. 2011-253174, and the like.

In the resin composition of the present invention, the content of free metals that are not bound or coordinated with pigments is preferably 100 ppm or less, more preferably 50 ppm or less, even more preferably 10 ppm or less, and particularly preferably not substantially contained . According to this aspect, stabilization of pigment dispersibility (suppression of aggregation), improvement of spectroscopic properties with improvement of dispersibility, stabilization of sclerosing components, suppression of conductivity variation due to elution of metal atoms/metal ions, and display of The effect of improving characteristics, etc. In addition, Japanese Patent Laid-Open No. 2012-153796, Japanese Patent Laid-Open No. 2000-345085, Japanese Patent Laid-Open No. 2005-200560, Japanese Patent Laid-Open No. 08-043620, Japanese Patent Laid-Open No. 2004-145078, JP 2014-119487 A, JP 2010-083997 A, JP 2017-090930 A, JP 2018-025612 A, JP 2018-025797 A, JP 2017- The effects described in Gazette 155228, JP 2018-036521 A, and the like. Examples of the types of the free metals include Na, K, Ca, Sc, Ti, Mn, Cu, Zn, Fe, Cr, Co, Mg, Al, Sn, Zr, Ga, Ge, Ag, Au, Pt, Cs, Ni, Cd, Pb, Bi, etc. Furthermore, in the resin composition of the present invention, the content of free halogens that are not bound or coordinated with pigments, etc. is preferably 100 ppm or less, more preferably 50 ppm or less, further preferably 10 ppm or less, and does not substantially contain Excellent. Examples of the halogen include F, Cl, Br, I, and anions of these. As a method for reducing the free metal and halogen in the resin composition, methods such as washing by ion-exchange water, filtration, ultrafiltration, and purification by ion-exchange resin are exemplified.

From the viewpoint of environmental regulation, the use of perfluoroalkyl sulfonic acid and its salts and perfluoroalkyl carboxylic acids and its salts is sometimes regulated. In the resin composition of the present invention, when the content of the above-mentioned compound is reduced, perfluoroalkyl sulfonic acid (especially, perfluoroalkyl sulfonic acid having a carbon number of 6 to 8 perfluoroalkyl group) relative to the total solid content of the resin composition Alkyl sulfonic acid) and its salts, and perfluoroalkyl carboxylic acids (especially, perfluoroalkyl carboxylic acids having a perfluoroalkyl carbon number of 6 to 8) and their salts with a content of 0.01 ppb to 1,000 ppb It is preferably within the range, more preferably within the range of 0.05ppb to 500ppb, and even more preferably within the range of 0.1ppb to 300ppb. The resin composition of the present invention may not substantially contain perfluoroalkylsulfonic acid and salts thereof, and perfluoroalkylcarboxylic acids and salts thereof. For example, by using compounds capable of being a substitute for perfluoroalkyl sulfonic acid and its salts and compounds capable of being a substitute for perfluoroalkyl carboxylic acid and its salts, it is also possible to choose to not substantially contain perfluoroalkyl groups Resin compositions of sulfonic acids and their salts and perfluoroalkyl carboxylic acids and their salts. Examples of compounds that can be used as substitutes for controlled compounds include compounds that are excluded from control due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above-mentioned content does not prevent the use of perfluoroalkylsulfonic acid and salts thereof, and perfluoroalkylcarboxylic acids and salts thereof. The resin composition of the present invention may also contain perfluoroalkylsulfonic acid and salts thereof, and perfluoroalkylcarboxylic acids and salts thereof within the maximum allowable range.

It is also preferable that the resin composition of the present invention does not substantially contain terephthalate. Here, "substantially not containing" means that the content of the terephthalate in the total amount of the resin composition is 1000 mass ppb or less, more preferably 100 mass ppb or less, and particularly preferably zero.

<Storage container> There is no restriction|limiting in particular as a container of a resin composition, A well-known container can be used. In addition, as the container, it is also preferable to use a multilayer bottle in which the inner wall of the container is composed of 6 kinds of resins and 6 layers, or a bottle in which 6 kinds of resins have a 7-layer structure for the purpose of suppressing the contamination of impurities into the raw material and the resin composition. As such a container, the container described in Unexamined-Japanese-Patent No. 2015-123351 is mentioned, for example. In addition, the inner wall of the container is preferably made of glass, stainless steel or the like for the purpose of preventing elution of metals from the inner wall of the container, improving the storage stability of the resin composition, and suppressing the deterioration of components.

<Preparation method of resin composition> The resin composition of the present invention can be prepared by mixing the aforementioned components. When preparing a resin composition, all components can be dissolved and/or dispersed in a solvent at the same time to prepare a resin composition, or each component can be appropriately divided into 2 or more parts of a solution or dispersion according to needs, and when used. (During coating) These are mixed to prepare a resin composition.

In addition, it is also preferable to include a pigment dispersion process when preparing the resin composition. In the pigment dispersion process, as the mechanical force for dispersing the pigment, compression, extrusion, impact, shearing, pitting and the like can be mentioned. Specific examples of these processes include bead milling, sand milling, roll milling, ball milling, paint stirring, microjet, high-speed impeller, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, and the like. In addition, in the grinding of the pigment in a sand mill (bead mill), it is preferable that the grinding efficiency is improved by using microbeads with a small diameter, increasing the filling rate of the microbeads, and the like. In addition, it is preferable to remove coarse particles by filtration, centrifugation, or the like after the pulverization treatment. Also, regarding the pigment dispersion process and the dispersing machine, "Compendium of Dispersion Technology, Published by JOHOKIKO CO., LTD., July 15, 2005" or "Focused on Suspension (Solid/Liquid Dispersion System)" can be preferably used. Dispersion Technology and Industrial Practical Application Comprehensive Document Collection, issued by the Publishing Department of the Management Development Center, October 10, 1978", the process and dispersing machine described in paragraph 0022 of Japanese Patent Application Laid-Open No. 2015-157893. In addition, in the pigment dispersion process, the micronization of the particles can be performed by a salt milling step. For example, the raw materials, apparatuses, processing conditions, etc. used in the salt milling step can be referred to the descriptions of Japanese Patent Laid-Open No. 2015-194521 and Japanese Patent Laid-Open No. 2012-046629.

When preparing the resin composition, it is preferable to filter the resin composition with a filter for the purpose of removing impurities and reducing defects. As a filter, if it is a filter conventionally used for filtration use etc., it can be used without a restriction|limiting in particular. For example, fluorine resins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins such as nylon (eg, nylon-6, nylon-6,6), polyethylene, polypropylene (PP) can be used. ) and other raw material filters such as polyolefin resins (including high-density, ultra-high molecular weight polyolefin resins). Among these raw materials, polypropylene (including high-density polypropylene) and nylon are preferred.

The pore size of the filter is preferably 0.01 to 7.0 μm, more preferably 0.01 to 3.0 μm, and even more preferably 0.05 to 0.5 μm. As long as the pore diameter of the filter is within the above range, fine foreign matter can be removed more reliably. Regarding the pore size value of the filter, you can refer to the nominal value of the filter manufacturer. As for the filters, various filters provided by NIHON PALL Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), KITZ MICROFILTER Corporation, and the like can be used.

Moreover, it is also preferable to use a fibrous filter medium as a filter. As a fibrous filter medium, polypropylene fiber, nylon fiber, glass fiber, etc. are mentioned, for example. Commercially available products include SBP type series (SBP008 etc.), TPR type series (TPR002, TPR005 etc.), and SHPX type series (SHPX003 etc.) manufactured by ROKI TECHNO CO., LTD.

When using filters, it is possible to combine different filters (eg 1st filter and 2nd filter etc.). At this time, the filtration using each filter may be performed only once, or may be performed twice or more. Also, filters of different pore sizes may be combined within the above-mentioned range. In addition, the filtration using the 1st filter may be performed only with respect to the dispersion liquid, and after mixing other components, filtration may be performed using the 2nd filter. In addition, the filter can be appropriately selected according to the hydrophilicity and hydrophobicity of the resin composition.

(membrane) The film of the present invention is a film obtained from the above-mentioned resin composition of the present invention. The film of the present invention can be used for filters such as color filters, near-infrared transmission filters, and near-infrared cut filters. In addition, the film of the present invention can also be used for a black matrix, a light-shielding film, and the like.

The film thickness of the film of the present invention can be appropriately adjusted according to the purpose. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

When the film of the present invention is used as a color filter, the film of the present invention preferably has a hue of green, red, blue, cyan, magenta, or yellow. In addition, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of the colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

When the film of the present invention is used as a near-infrared cutoff filter, the maximum absorption wavelength of the film of the present invention is preferably in a wavelength range of 700 to 1800 nm, more preferably in a wavelength range of 700 to 1300 nm, and The wavelength within the range of 700 to 1100 nm is more preferable. Further, the transmittance of the film in the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Moreover, it is preferable that the transmittance|permeability of the film in at least 1 place in the wavelength range of 700-1800nm is 20% or less. Also, the ratio of the absorbance Amax at the maximum absorption wavelength to the absorbance A550 at the wavelength 550nm, that is, the absorbance Amax/absorbance A550 is preferably 20 to 500, 50 to 500 is better, 70 to 450 is further better, and 100 to 100 400 is excellent.

When the film of the present invention is used as a near-infrared transmission filter, it is preferable that the film of the present invention has any one of the following spectral characteristics (i1) to (i5). (i1): The maximum value of transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 800 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). A film with such spectroscopic properties will shield light in the wavelength range of 400 to 640 nm, and allow light with wavelengths greater than 750 nm to pass through. (i2): The maximum value of transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 900 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). A film with such spectroscopic properties will block light in the wavelength range of 400 to 750 nm, and allow light with wavelengths greater than 850 nm to pass through. (i3): The maximum value of transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1000 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). A film with such spectroscopic properties will block light in the wavelength range of 400 to 830 nm, and allow light with wavelengths greater than 950 nm to pass through. (i4): The maximum value of transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1100 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). A film with such spectroscopic properties will shield light in the wavelength range of 400 to 950 nm, and allow light with wavelengths greater than 1050 nm to pass through. (i5): The maximum value of transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1200 to 1500 nm. The minimum value is a filter above 70% (preferably above 75%, more preferably above 80%). A film with such spectroscopic properties will block light in the wavelength range of 400 to 1050 nm, and allow light with wavelengths greater than 1150 nm to pass through.

Further, the thickness of the film of the present invention after heat treatment at 300° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before the heat treatment, more preferably 80% or more, and further more preferably 90% or more. More preferably, more than 95% is still more preferred, and more than 99% is particularly preferred. Further, the thickness of the film after heat treatment at 350° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before the heat treatment, more preferably 80% or more, and further more preferably 90% or more. Excellent, more than 95% is further better, and more than 99% is excellent. Further, the thickness of the film after heat treatment at 400° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before the heat treatment, more preferably 80% or more, and still more preferably 90% or more. Excellent, more than 95% is further better, and more than 99% is excellent.

<Production method of film> The film of the present invention can be produced through a step of applying the above-described resin composition of the present invention on a support. It is preferable that the manufacturing method of the film of the present invention further includes a step of forming a pattern (pixel). As a formation method of a pattern (pixel), a photolithography method and a dry etching method are mentioned, and a photolithography method is preferable.

(light lithography) First, the case where a film is produced by patterning by photolithography will be described. Pattern formation by photolithography includes a step of forming a resin composition layer on a support using the resin composition of the present invention, a step of exposing the resin composition layer in a pattern, and development to remove the unexposed portion of the resin composition layer The step of forming patterns (pixels) is preferred. The step of baking the resin composition layer (pre-baking step) and the step of baking the developed pattern (pixel) (post-baking step) can also be provided as required.

In the step of forming the resin composition layer, the resin composition layer is formed on the support using the resin composition of the present invention. It does not specifically limit as a support body, According to a use, it can select suitably. For example, a glass substrate, a silicon substrate, etc. are mentioned, and a silicon substrate is preferable. Also, a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, and the like may be formed on a silicon substrate. In addition, a black matrix for isolating each pixel is sometimes formed on a silicon substrate. In addition, in order to improve the adhesion with the upper layer, prevent the diffusion of substances, or flatten the surface of the substrate, a base layer may be provided on the silicon substrate. When measured with diiodomethane, the surface contact angle of the base layer is preferably 20 to 70°. In addition, when measuring with water, it is preferably 30 to 80°. As long as the surface contact angle of the base layer is within the above range, the wettability of the resin composition is good. For example, the surface contact angle of the base layer can be adjusted by adding a surfactant or the like.

As a coating method of a resin composition, a well-known method can be used. For example, dropping method (drop casting); slit coating method; spray method; roll coating method; spin coating method (spin coating); casting coating method; For example, the method described in Japanese Patent Application Laid-Open No. 2009-145395); inkjet (eg, drop-on-demand, piezoelectric, thermal), nozzle jetting and other jet printing, flexographic printing, screen printing, gravure printing, Various printing methods such as reverse offset printing and metal mask printing; transfer methods using molds, etc.; nanoimprinting methods, etc. The application method in inkjet is not particularly limited, for example, "Expansion and Use of Inkjet - Infinite Possibilities Appearing in Patents-, Issued in February 2005, Sumitbe Techon Research Co., Ltd." method (especially pages 115 to 133) or Japanese Patent Laid-Open No. 2003-262716, Japanese Patent Laid-Open No. 2003-185831, Japanese Patent Laid-Open No. 2003-261827, The method described in Japanese Patent Laid-Open No. 2006-169325 and the like. In addition, the method described in International Publication No. 2017/030174 and International Publication No. 2017/018419 can also be used for the coating method of the resin composition, and these contents are incorporated in this specification.

The resin composition layer formed on the support may be dried (pre-baked). When the film is fabricated by a low temperature process, prebaking may not be performed. When pre-baking is performed, the pre-baking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. For example, the lower limit can be set to 50°C or more, and can also be set to 80°C or more. The pre-baking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

Next, the resin composition layer is exposed in a pattern (exposure step). For example, pattern exposure can be performed by exposing the photosensitive composition layer through a mask having a predetermined mask pattern using a stepper, a scanning exposure machine, or the like. Thereby, the exposed portion can be hardened.

Examples of radiation (light) that can be used for exposure include g-rays, i-rays, and the like. In addition, light having a wavelength of 300 nm or less (preferably, light having a wavelength of 180 to 300 nm) can also be used. As light with a wavelength of 300 nm or less, KrF rays (wavelength 248 nm), ArF rays (wavelength 193 nm), etc. are mentioned, and KrF rays (wavelength 248 nm) are preferred. In addition, a long-wavelength light source of 300 nm or more can also be used.

In addition, at the time of exposure, light may be continuously irradiated to perform exposure, or pulsed irradiation may be performed to perform exposure (pulse exposure). In addition, the pulse exposure refers to an exposure method in which light is irradiated and paused repeatedly in a cycle of a short time (eg, milliseconds or less) to perform exposure. In the case of pulse exposure, the pulse width is preferably 100 nanoseconds (ns) or less, more preferably 50 nanoseconds or less, and even more preferably 30 nanoseconds or less. The lower limit of the pulse width is not particularly limited, and it can be set to 1 femtosecond (fs) or more, and can also be set to 10 femtoseconds or more. The frequency is preferably 1 kHz or higher, more preferably 2 kHz or higher, and further preferably 4 kHz or higher. The upper limit of the frequency is preferably 50 kHz or less, more preferably 20 kHz or less, and even more preferably 10 kHz or less. The maximum instantaneous illuminance is preferably 50000000W/m ² or more, more preferably 100000000W/m ² or more, and even more preferably 200000000W/m ² or more. Further, the upper limit of the maximum instantaneous illuminance is preferably 1000000000 W/m ² or less, more preferably 800000000 W/m ² or less, and even more preferably 500000000 W/m ² or less. In addition, the pulse width refers to the time of light irradiation in the pulse period. In addition, the frequency means the number of pulse cycles per second. In addition, the maximum instantaneous illuminance refers to the average illuminance of the light in the pulse period during the irradiation time. In addition, the pulse period refers to a period in which irradiation and pause of light in pulse exposure are regarded as one period.

For example, the irradiation dose (exposure dose) is preferably 0.03 to 2.5 J/cm ² , and more preferably 0.05 to 1.0 J/cm ² . The oxygen concentration at the time of exposure can be appropriately selected, and in addition to performing in the atmosphere, for example, exposure may be performed in a hypoxic environment with an oxygen concentration of 19 vol % or less (for example, 15 vol %, 5 vol %, or substantially no oxygen). , exposure can also be performed in a high oxygen environment (eg, 22 vol%, 30 vol% or 50 vol%) with an oxygen concentration exceeding 21 vol%. In addition, the exposure illuminance can be appropriately set, and can usually be selected from the range of 1,000 W/m ² to 100,000 W/m ² (for example, 5,000 W/m ² , 15,000 W/m ² or 35,000 W/m ² ). Oxygen concentration and exposure illuminance can be appropriately combined conditions, for example, an oxygen concentration of 10 vol % and an illuminance of 10,000 W/m ² , an oxygen concentration of 35 vol % and an illuminance of 20,000 W/m ² , and the like.

Next, the unexposed portion of the resin composition layer is removed by development to form a pattern (pixel). The development and removal of the unexposed part of the resin composition layer can be performed using a developing solution. Thereby, the resin composition of the unexposed part in an exposure process is eluted in a developing solution, and only the part which has been photohardened remains. For example, the temperature of the developer is preferably 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, in order to improve the residue removal property, the following step of removing the developer every 60 seconds and supplying a new developer may be repeated several times.

As a developing solution, an organic solvent, an alkali developing solution, etc. are mentioned, An alkali developing solution can be used suitably. As the alkali developer, an alkaline aqueous solution (alkaline developer) obtained by diluting an alkali agent with pure water is preferable. Examples of the alkaline agent include ammonia, ethylamine, diethylamine, dimethylethanolamine, diethylene glycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, and tetraethylammonium hydroxide. , Tetrapropylammonium hydroxide, Tetrabutylammonium hydroxide, Ethyltrimethylammonium hydroxide, Benzyltrimethylammonium hydroxide, Dimethylbis(2-hydroxyethyl)ammonium hydroxide, Choline , pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene and other organic basic compounds or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate , Inorganic alkaline compounds such as sodium metasilicate. From the viewpoint of the environment and safety, the alkaline agent is preferably a compound with a large molecular weight. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. In addition, the developer may further contain a surfactant. As a surfactant, the above-mentioned surfactant is mentioned, and a nonionic surfactant is preferable. From the viewpoints of ease of transportation, storage, and the like, the developer may be prepared as a concentrated solution and diluted to a desired concentration when used. The dilution ratio is not particularly limited, but can be set in the range of 1.5 to 100 times, for example. Moreover, it is also preferable to wash (rinse) with pure water after image development. Moreover, it is preferable to perform rinsing by supplying the rinse liquid to the developed resin composition layer while rotating the support on which the developed resin composition layer is formed. Moreover, it is also preferable to carry out by moving the nozzle which discharges a rinse liquid from the center part of a support body to the peripheral part of a support body. At this time, when the nozzle is moved from the center portion of the support body to the peripheral portion, the nozzle can be moved while gradually reducing the moving speed. By rinsing in this way, unevenness in the surface of the rinse can be suppressed. Also, the same effect can be obtained by gradually reducing the rotational speed of the support body while moving the nozzle from the center portion of the support body to the peripheral portion.

After image development, it is preferable to perform additional exposure treatment and heat treatment (post-baking) after drying. Additional exposure treatment and post-baking are used for curing treatment after development to obtain a completely cured product. For example, the heating temperature in the post-baking is preferably 100 to 240°C, and more preferably 200 to 240°C. The developed film can be post-baked in a continuous or intermittent manner using a heating mechanism such as a hot plate, a convection oven (hot air circulation type dryer), and a high-frequency heater so as to satisfy the above conditions. When additional exposure processing is performed, the light used for exposure is preferably light having a wavelength of 400 nm or less. In addition, the additional exposure treatment can be performed by the method described in Korean Laid-Open Patent Publication No. 10-2017-0122130.

(dry etching method) The pattern formation by dry etching preferably includes the following steps: using the resin composition of the present invention to form a resin composition layer on a support body, and curing the entire resin composition layer to form a hardened layer. The steps of forming a photoresist layer on the hardened layer, exposing the photoresist layer in a pattern and then developing to form a photoresist pattern, using the photoresist pattern as a mask, dry etching the hardened layer with an etching gas. step. When forming the photoresist layer, it is preferable to further perform a pre-baking process. In particular, as the formation process of the photoresist layer, it is preferable to perform a heat treatment after exposure and a heat treatment (post-baking treatment) after development. Regarding the content of forming a pattern by the dry etching method, reference can be made to the descriptions in paragraphs 0010 to 0067 of Japanese Patent Laid-Open No. 2013-064993, which are incorporated in the present specification.

＜Filter＞ The optical filter of the present invention has the film of the present invention described above. As a kind of optical filter, a color filter, a near-infrared transmission filter, a near-infrared cut filter etc. are mentioned as an optical filter, A color filter is preferable. As the color filter, a colored pixel having the film of the present invention as a color filter is preferable. The optical filter of the present invention can be used for solid-state imaging elements such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor), image display devices, and the like.

In the optical filter of the present invention, the film thickness of the film of the present invention can be appropriately adjusted according to the purpose. The film thickness is preferably 5 μm or less, more preferably 1 μm or less, and even more preferably 0.6 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

The width of the pixels included in the color filter is preferably 0.4 to 10.0 μm. The lower limit is preferably 0.4 μm or more, more preferably 0.5 μm or more, and even more preferably 0.6 μm or more. The upper limit is preferably 5.0 μm or less, more preferably 2.0 μm or less, still more preferably 1.0 μm or less, and even more preferably 0.8 μm or less. In addition, the Young's modulus of the pixel is preferably 0.5 to 20 GPa, and more preferably 2.5 to 15 GPa.

Preferably, each pixel included in the filter has high flatness. Specifically, the surface roughness Ra of the pixel is preferably 100 nm or less, more preferably 40 nm or less, and even more preferably 15 nm or less. The lower limit is not specified, but is preferably 0.1 nm or more, for example. The surface roughness of a pixel can be measured, for example, using AFM (atomic force microscope) Dimension3100 manufactured by Veeco. In addition, the water contact angle on the pixel can be set to an appropriate value, and it is usually in the range of 50 to 110°. For example, the contact angle can be measured using a contact angle meter CV-DT•A type (manufactured by Kyowa Interface Science Co., Ltd.). In addition, it is preferable that the volume resistance value of the pixel is high. Specifically, the volume resistance value of the pixel is preferably 10 ⁹ Ω·cm or more, and more preferably 10 ¹¹ Ω·cm or more. The upper limit is not specified, but is preferably 10 ¹⁴ Ω·cm or less, for example. For example, the volume resistance value of the pixel can be measured using an ultra-high resistance meter 5410 (manufactured by ADVANTEST CORPORATION).

In the optical filter, a protective layer may be provided on the surface of the film of the present invention. By providing the protective layer, various functions such as oxidation resistance, low reflection, hydrophilicity and hydrophobicity, and shielding of specific wavelengths of light (ultraviolet rays, near-infrared rays, etc.) can be imparted. The thickness of the protective layer is preferably 0.01 to 10 μm, more preferably 0.1 to 5 μm. As a method of forming the protective layer, a method of coating a resin composition for forming a protective layer dissolved in an organic solvent, a chemical vapor deposition method, a method of attaching the molded resin with an adhesive material, and the like can be mentioned. Examples of components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyether resins, polyether resins, polyphenylene resins, Polyarylene ether phosphine oxide resin, polyimide resin, polyimide imide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin , melamine resin, polyurethane resin, aromatic polyamide resin, polyamide resin, alkyd resin, epoxy resin, modified polysiloxane resin, fluorine resin, polycarbonate resin, polyacrylonitrile resin, cellulose resin , Si, C, W, Al ₂ O ₃ , Mo, SiO ₂ , Si ₂ N ₄ , etc., and may contain two or more of these components. For example, in the case of a protective layer for the purpose of preventing oxidation, it is preferable that the protective layer contains polyol resin, SiO ₂ and Si ₂ N ₄ . Moreover, in the case of the protective layer for the purpose of reducing reflection, it is preferable that the protective layer contains a (meth)acrylic resin and a fluororesin.

When the resin composition for forming a protective layer is applied to form a protective layer, as a method for applying the resin composition for forming a protective layer, known methods such as spin coating, casting, screen printing, and inkjet methods can be used. . As the organic solvent contained in the resin composition for forming a protective layer, a known organic solvent (for example, propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used. When the protective layer is formed by a chemical vapor deposition method, known chemical vapor deposition methods (thermal chemical vapor deposition method, plasma chemical vapor deposition method, photochemical vapor deposition method, etc.) can be used as the chemical vapor deposition method. Law).

The protective layer may contain additives such as organic/inorganic fine particles, light absorbers of specific wavelengths (eg, ultraviolet rays, near-infrared rays, etc.), refractive index modifiers, antioxidants, adhesives, and surfactants, as required. Examples of organic/inorganic fine particles include polymer fine particles (for example, polysiloxane resin fine particles, polystyrene fine particles, melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, Titanium nitride, titanium oxynitride, magnesium fluoride, hollow silicon dioxide, silicon dioxide, calcium carbonate, barium sulfate, etc. As the absorber of light of a specific wavelength, a known absorber can be used. The content of these additives can be adjusted appropriately, but is preferably 0.1 to 70% by mass, and more preferably 1 to 60% by mass relative to the total mass of the protective layer. In addition, as the protective layer, the protective layers described in paragraphs 0073 to 0092 of Japanese Patent Laid-Open No. 2017-151176 can also be used.

The optical filter may have a structure in which, for example, each pixel is embedded in a space divided into a lattice shape by a partition wall. In addition, the resin composition of the present invention can also be preferably used for the pixel structure described in International Publication No. 2019/102887.

<Solid-state imaging element> The solid-state imaging element of the present invention includes the above-described film of the present invention. The structure of the solid-state imaging element of the present invention is not particularly limited as long as it includes the film of the present invention and functions as a solid-state imaging element, and the following structures are exemplified, for example.

That is, the substrate has a plurality of photodiodes that constitute a light-receiving area of a solid-state imaging element (CCD (Charge Coupled Device) image sensor, CMOS (Complementary Metal Oxide Film Semiconductor) image sensor, etc.) The transmission electrode composed of polysilicon, etc., has a light-shielding film on the photodiode and the transmission electrode with only the light-receiving part of the photodiode opening, and the light-shielding film has a way to cover the entire surface of the light-shielding film and the light-receiving part of the photodiode An element protective film composed of silicon nitride or the like is formed, and a color filter is provided on the element protective film. Furthermore, it is also possible to have a structure in which a condensing mechanism (for example, a microlens, etc., the same below) is provided on the element protective film and on the lower side of the color filter (the side close to the substrate), or the color filter may have a light condensing mechanism. Institutional structure, etc. In addition, the color filter may have a structure in which, for example, each coloring pixel is embedded in a space divided into a lattice shape by a partition wall. The refractive index of the partition at this time is preferably lower than that of each colored pixel. Examples of imaging devices having such a structure include Japanese Patent Application Laid-Open No. 2012-227478, Japanese Patent Application Laid-Open No. 2014-179577, International Publication No. 2018/043654, and US Patent Application Publication No. 2018/0040656 device described in. In addition, as described in Japanese Patent Laid-Open No. 2019-211559, the light resistance can be improved by providing an ultraviolet absorbing layer in the structure of the solid-state imaging element. The imaging device including the solid-state imaging element of the present invention can be used not only as a digital camera, an electronic device (mobile phone, etc.) having an imaging function, but also as a vehicle-mounted camera and a surveillance camera. Furthermore, the solid-state imaging device incorporating the color filter of the present invention may further incorporate other color filters, near-infrared cut filters, organic photoelectric conversion films, and the like in addition to the color filter of the present invention.

<Image display device> The image display device of the present invention includes the above-described film of the present invention. As an image display device, a liquid crystal display device, an organic electroluminescence display device, etc. are mentioned. The definition of an image display device and the details of each image display device are described in, for example, “Electronic Display Device (Akio Sasaki, Kogyo Chosakai Publishing Co., Ltd., published in 1990)”, “Display Device (Ibuki Jun Zhang book, Sangyo Tosho Publishing Co., Ltd., issued in 1989)” and so on. In addition, the liquid crystal display device is described in, for example, "Next-generation liquid crystal display technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)." The liquid crystal display device to which the present invention can be applied is not particularly limited, and for example, it can be applied to liquid crystal display devices of various types described in the above-mentioned "next-generation liquid crystal display technology". [Example]

Hereinafter, the present invention will be described in further detail with reference to Examples. Materials, usage amounts, ratios, processing contents, processing procedures, and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

<Measurement of the weight average molecular weight (Mw) of the sample> The weight average molecular weight of the sample was measured by gel permeation chromatography (GPC) under the following conditions. Type of column: A column connecting TOSOH TSKgel Super HZM-H, TOSOH TSKgel Super HZ4000 and TOSOH TSKgel Super HZ2000 Developing solvent: tetrahydrofuran Column temperature: 40℃ Flow rate (sample injection amount): 1.0 μL (sample concentration: 0.1% by mass) Device name: HLC-8220GPC manufactured by Tosoh Corporation Detector: RI (Refractive Index) detector Calibration Curve Matrix Resin: Polystyrene Resin

<Measurement of the acid value of the sample> The acid value of the sample indicates the mass of potassium hydroxide required for neutralizing the acidic component per 1 g of solid content in the sample. The acid value of the sample was measured as follows. That is, the measurement sample was dissolved in a mixed solvent of tetrahydrofuran/water=9/1 (mass ratio), and a potentiometric titration apparatus (product name: AT-510, manufactured by KYOTO ELECTRONICS MANUFACTURING CO., LTD.) was used at 25°C. The obtained solution was subjected to neutralization titration with 0.1 mol/L potassium hydroxide aqueous solution. The acid value was calculated by the following formula using the inflection point of the titration pH curve as the titration end point. A=56.11×Vs×0.5×f/w A: Acid value (mgKOH/g) Vs: the amount of 0.1mol/L potassium hydroxide aqueous solution required for titration (mL) f: Titration amount of 0.1 mol/L potassium hydroxide aqueous solution w: mass of sample (g) (solid content conversion)

<Synthesis example of acid dianhydride macromonomer> (Synthesis example 1-1) Synthesis of acid dianhydride macromonomer MM-1 19.8 g of methyl methacrylate and 21.7 g of butyl acrylate were added to a nitrogen-substituted three-necked flask g, and diluted with 68.7 g of propylene glycol monomethyl ether acetate. It was warmed to 75°C under nitrogen. Next, 4.3 g of a chain transfer agent (compound (AAA-1)) and 0.36 g of a polymerization initiator (V-601, manufactured by FUJIFILM Wako Pure Chemical Corporation) were added, followed by heating and stirring at 75° C. for 8 hours under a nitrogen atmosphere. The acid dianhydride macromonomer MM-1 was synthesized. The weight average molecular weight of the obtained acid dianhydride macromonomer MM-1 was 3900. [Chemical formula 39]

(Synthesis examples 1-2 to 1-10) Synthesis of acid dianhydride macromonomers MM-2 to MM-10 In Synthesis Example 1-1, the types of monomers were changed, and acid dianhydride macromonomers MM-2 to MM-10 were synthesized in the same manner as in Synthesis Example 1-1.

(Synthesis example 1-11) Synthesis of acid dianhydride macromonomer MM-11 Add 5.0 g of 6-mercaptohexanol, 35 g of ε-caprolactone and 0.5 g of monobutyltin oxide to a three-necked flask replaced with nitrogen, heat and stir at 90°C for 2 hours and at 120°C for 6 hours, Thereby, a polymer having SH groups and OH groups at both ends of the polyester was obtained. After cooling to 60° C., 4.6 g of hexyl isocyanate was added, and the mixture was further stirred for 2 hours to seal the OH terminal to obtain a polymer having a single terminal SH group. Next, 6.4 g of 4,4'-(acetylene-1,2-diyl)diphthalic anhydride and 0.3 g of a polymerization initiator (V-601, manufactured by FUJIFILM Wako Pure Chemical Corporation) were added, and the mixture was heated at 80°C. The acid dianhydride macromonomer MM-11 was synthesized by stirring the ene-thiol reaction while heating for 2 hours.

(Synthesis examples 1-12 to 1-16) Synthesis of acid dianhydride macromonomers MM-12 to MM-16 In Synthesis Example 1-11, the monomer, isocyanate, and acid dianhydride containing unsaturated bonds were changed, and in the same manner as in Synthesis Example 1-11, acid dianhydride giant monomers MM-12 to MM-16 were synthesized .

(Synthesis example 1-17) Synthesis of acid dianhydride macromonomer MM-17 4.2 g of 2,3-dimercapto-1-propanol, 35 g of ε-caprolactone, and 0.5 g of monobutyltin oxide were added to a three-necked flask replaced with nitrogen, and heated and stirred at 90° C. for 2 hours, and then heated at 120° C. The mixture was heated and stirred for 6 hours, whereby a polymer having SH groups and OH groups at both ends of the polyester was obtained. After cooling to 5°C, 0.5 g of acetyl chloride was added, and the mixture was further stirred for 2 hours to seal the OH group end to obtain a polymer having a single terminal SH group. Next, 4.5 g of itaconic anhydride and 0.3 g of a polymerization initiator (V-601, manufactured by FUJIFILM Wako Pure Chemical Corporation) were added, and the ene-thiol reaction was carried out by heating and stirring at 80° C. for 2 hours, whereby acid dimethacrylate was obtained. Anhydride macromonomer MM-17.

(Synthesis example 1-18, 1-19) Synthesis of acid dianhydride macromonomers MM-18 and MM-19 In Synthesis Example 1-17, acid dianhydride macromonomers MM-18 and MM-19 were synthesized in the same manner as in Synthesis Example 1-17 by changing the monomer and the acid dianhydride containing an unsaturated bond.

(Synthesis example 1-20) Synthesis of acid dianhydride macromonomer MM-20 181.3 g of methyl methacrylate and 200.2 g of butyl acrylate were added to the three-necked flask replaced with nitrogen, and diluted with 590 g of propylene glycol monomethyl ether acetate. It was warmed to 75°C under nitrogen. Next, 16.9 g of a chain transfer agent (3-mercapto-1,2-propanediol) and 2.6 g of a polymerization initiator (V-601, manufactured by FUJIFILM Wako Pure Chemical Corporation) were added, and the mixture was heated and stirred at 75° C. under a nitrogen atmosphere for 8 Hour. The obtained polymer solution having terminal OH groups was cooled to 5°C. After adding 32.8 g of chlorinated trimellitic anhydride and 12.3 g of pyridine, and stirring at 5° C. for 4 hours, the generated hydrochloride was removed by filtration, whereby acid dianhydride macromonomer MM-20 was obtained. The weight average molecular weight of the obtained acid dianhydride macromonomer MM-20 was 4800.

(Synthesis examples 1-21 to 1-30) Synthesis of acid dianhydride macromonomers MM-21 to MM-30 In Synthesis Example 1-20, the monomers and chain transfer agents were changed, and in the same manner as in Synthesis Example 1-20, acid dianhydride macromonomers MM-21 to MM-30 were synthesized.

(Synthesis example 1-31) Synthesis of acid dianhydride macromonomer MM-31 5.6 g of compound (AAA-2), 69 g of ε-caprolactone and 0.8 g of monobutylene were added to a nitrogen-substituted three-necked flask tin oxide, heated and stirred at 90°C for 2 hours and at 120°C with stirring for 6 hours. After cooling to 5°C, 0.5 g of acetyl chloride was added, and the mixture was further stirred for 2 hours. Next, 0.1 g of pyridinium p-toluenesulfonate and 0.8 g of pure water were added at 60° C. and stirred for 10 hours to perform acetal hydrolysis, whereby a polymer having two OH groups at both ends of the polyester was obtained. The obtained polymer solution having terminal OH groups was cooled to 5°C. After adding 9.8 g of chlorinated trimellitic anhydride and 4.5 g of pyridine, and stirring at 5° C. for 4 hours, the generated hydrochloride was filtered off to obtain an acid dianhydride macromonomer MM-31. [Chemical formula 40]

(Synthesis examples 1-32 to 1-35) Synthesis of acid dianhydride macromonomers MM-32 to MM-35 In Synthesis Example 1-31, the monomers were changed, and in the same manner as in Synthesis Example 1-31, acid dianhydride macromonomers MM-32 to MM-35 were synthesized.

(Synthesis example 1-36) Synthesis of acid dianhydride macromonomer MM-36 181.3 g of BLEMMER AME-400 (manufactured by NOF CORPORATION, methoxy polyethylene glycol acrylate) was added to a three-necked flask replaced with nitrogen, and diluted with 500 g of propylene glycol monomethyl ether acetate. This was heated to 60 degreeC in nitrogen atmosphere, 19.7 g of diethanolamines were added, it heated and stirred for 2 hours, and the Michael addition reaction was performed. The obtained polymer solution having terminal OH groups was cooled to 5°C. After adding 48.5 g of chlorinated trimellitic anhydride and 18.6 g of pyridine, and stirring at 5° C. for 4 hours, the generated hydrochloride was filtered off to obtain an acid dianhydride macromonomer MM-36.

(Synthesis example 1-37～1-40) Synthesis of acid dianhydride macromonomer MM-37～MM-40 In Synthesis Example 1-36, the monomers and the chain transfer agent were changed, and in the same manner as in Synthesis Example 1-36, acid dianhydride macromonomers MM-37 to MM-40 were synthesized.

[表2]

[表3]

[表4]

[表5]

[表6]

[表7]

[表8]

The structures and weight average molecular weights (Mw) of the acid dianhydride macromonomers MM-1 to MM-40 are shown below. In addition, in Poly, marked in MM-1, MM-4～MM-6, MM-9, MM-10, MM-20, MM-23～MM-26, MM-29, MM-30, MM-37 The numerical value of the repeating unit of ~MM-40 indicates the molar ratio of the repeating unit, and the numerical value of the repeating unit marked in MM-11 to MM-19 and MM-31 to MM-36 indicates the number of the repeating unit. In addition, P ¹ of the structural formula (1) described in Poly. [Table 1]

[Table 2]

[table 3]

[Table 4]

[table 5]

[Table 6]

[Table 7]

[Table 8]

<Synthesis example of resin> (Synthesis Example 2-1) Synthesis of Resin B-1 39.0 g (solid content conversion) of acid dianhydride macromonomer MM-1 and 2.2 g of pyromellitic anhydride (acid dianhydride AA-1: Tokyo Chemical Industry Co., Ltd.) were added to a nitrogen-substituted three-necked flask. .), 0.28 g of phthalic anhydride (end-capping agent ED-1: manufactured by Tokyo Chemical Industry Co., Ltd.), 10 g of propylene glycol monomethyl ether acetate, and heated to 40°C. 2.2 g of 1,3-phenylenediamine (diamine DA-1: manufactured by Tokyo Chemical Industry Co., Ltd.) was added thereto, and the mixture was further heated and stirred at 40° C. for 6 hours, whereby 30 of resin B-1 was obtained. % propylene glycol monomethyl ether acetate solution. The weight average molecular weight of the obtained resin B-1 was 10300, and the acid value was 72 mgKOH/g.

(Synthesis Examples 2-2 to 2-93) Synthesis of Resins B-2 to B-93 The acid dianhydride macromonomer, acid dianhydride, diamine, end-capping agent are changed to the kind and addition of record in the following table, in addition, have synthesized resin B- 2 to B-93. The weight average molecular weight (Mw) and acid value of each resin are collectively described in the following table.

[Table 9] resin Acid dianhydride macromonomer Acid dianhydride Diamine end capping agent Mw Acid value (mgKOH/g) type Amount added (parts by mass) type Amount added (parts by mass) type Amount added (parts by mass) type Amount added (parts by mass) B-1 MM-1 39 AA-1 2.2 DA-1 2.2 ED-1 0.28 10300 72 B-2 MM-2 43 AA-2 2.9 DA-2 4.1 ED-2 0.18 7300 37 B-3 MM-3 34 AA-3 3.1 DA-3 4.9 ED-3 0.29 14500 51 B-4 MM-4 48 AA-2 2.9 DA-7 4.2 ED-1 0.28 10100 50 B-5 MM-5 65 AA-4 3.2 DA-3 4.9 ED-2 0.18 6600 35 B-6 MM-6 57 AA-7 3.6 DA-2 4.1 ED-2 0.18 17900 26 B-7 MM-7 45 AA-2 2.9 DA-4 6.4 ED-1 0.28 10200 26 B-8 MM-8 38 AA-8 4.4 DA-6 6.7 ED-1 0.28 15800 75 B-9 MM-9 40 AA-7 3.6 DA-2 4.1 - - 22800 64 B-10 MM-10 44 AA-7 3.6 DA-7 4.2 - - 24900 50 B-11 MM-11 32 AA-4 3.2 DA-2 4.1 ED-1 0.28 16100 39 B-12 MM-12 35 - - DA-5 7.3 ED-1 0.28 7800 16 B-13 MM-13 46 AA-2 2.9 DA-6 6.7 ED-3 0.29 13600 61 B-14 MM-14 twenty two AA-5 2.5 DA-2 4.1 ED-3 0.29 6000 71 B-15 MM-15 34 AA-7 3.6 DA-6 6.7 ED-2 0.18 14800 73 B-16 MM-16 50 AA-2 2.9 DA-6 6.7 ED-1 0.28 20900 39 B-17 MM-17 27 AA-8 4.4 DA-2 4.1 - - 23400 57 B-18 MM-18 26 AA-8 4.4 DA-2 4.1 ED-1 0.28 10600 32 B-19 MM-19 30 AA-2 2.9 DA-5 7.3 ED-1 0.28 11700 73 B-20 MM-20 48 - - DA-6 6.7 ED-1 0.28 13400 17 B-21 MM-21 39 AA-4 3.2 DA-6 6.7 ED-2 0.18 7800 75 B-22 MM-22 35 AA-3 3.1 DA-6 6.7 ED-2 0.18 22100 31 B-23 MM-23 47 AA-2 2.9 DA-5 7.3 ED-2 0.18 5100 65 B-24 MM-24 64 AA-6 2.2 DA-4 6.4 ED-2 0.18 24400 twenty two B-25 MM-25 43 AA-1 2.2 DA-4 6.4 ED-1 0.28 7500 34 B-26 MM-26 78 AA-2 2.9 DA-4 6.4 ED-2 0.18 19100 50 B-27 MM-27 66 AA-7 3.6 DA-6 6.7 ED-1 0.28 14700 60 B-28 MM-28 64 AA-2 2.9 DA-3 4.9 ED-1 0.28 23000 26 B-29 MM-29 73 - - DA-3 4.9 - - 21600 twenty three B-30 MM-30 89 AA-1 2.2 DA-4 6.4 ED-1 0.28 22600 30 B-31 MM-31 16 AA-8 4.4 DA-7 4.2 ED-1 0.28 24300 46 B-32 MM-32 41 AA-3 3.1 DA-5 7.3 ED-1 0.28 7400 71 B-33 MM-33 20 AA-7 3.6 DA-4 6.4 ED-2 0.18 21600 70 B-34 MM-34 twenty one AA-2 2.9 DA-7 4.2 ED-1 0.28 20800 34 B-35 MM-35 twenty four AA-6 2.2 DA-6 6.7 ED-2 0.18 15800 59 B-36 MM-36 9 AA-3 3.1 DA-6 6.7 ED-1 0.28 21700 73 B-37 MM-37 35 AA-2 2.9 DA-6 6.7 ED-2 0.18 15700 81 B-38 MM-38 44 AA-4 3.2 DA-2 4.1 ED-1 0.28 23300 46 B-39 MM-39 32 AA-8 4.4 DA-3 4.9 ED-2 0.18 23500 34 B-40 MM-40 38 AA-3 3.1 DA-2 4.1 - - 23500 62

[Table 10] resin Acid dianhydride macromonomer Acid dianhydride Diamine end capping agent Mw Acid value (mgKOH/g) type Amount added (parts by mass) type Amount added (parts by mass) type Amount added (parts by mass) type Amount added (parts by mass) B-41 MM-1 39 AA-4 3.2 DA-3 4.9 ED-1 0.28 12700 16 B-42 MM-4 48 AA-6 2.2 DA-6 6.7 ED-2 0.18 8800 68 B-43 MM-17 27 AA-6 2.2 DA-7 4.2 ED-2 0.18 6300 47 B-44 MM-18 26 AA-2 2.9 DA-1 2.2 ED-1 0.28 19400 84 B-45 MM-19 30 AA-1 2.2 DA-7 4.2 - - 21600 77 B-46 MM-20 48 AA-7 3.6 DA-4 6.4 ED-3 0.29 14000 74 B-47 MM-20 48 AA-8 4.4 DA-5 7.3 ED-1 0.28 22300 30 B-48 MM-21 39 AA-7 3.6 DA-6 6.7 ED-2 0.18 24200 54 B-49 MM-21 39 AA-8 4.4 DA-4 6.4 ED-1 0.28 20100 65 B-50 MM-22 35 AA-7 3.6 DA-6 6.7 - - 22600 65 B-51 MM-22 35 AA-8 4.4 DA-4 6.4 ED-2 0.18 13800 18 B-52 MM-23 47 - - - - ED-3 2.9 4900 80 B-53 MM-23 47 AA-8 4.4 DA-6 6.7 - - 24100 25 B-54 MM-23 47 AA-8 4.4 DA-4 6.4 ED-1 0.28 13500 56 B-55 MM-23 47 AA-8 4.4 DA-6 6.7 ED-1 0.28 17200 36 B-56 MM-23 47 AA-8 4.4 DA-4 6.4 ED-3 0.29 9500 47 B-57 MM-23 twenty four AA-8 6.6 DA-4 6.4 ED-1 0.28 14000 89 B-58 MM-23 71 AA-8 2.2 DA-4 6.4 ED-1 0.28 19300 29 B-59 MM-24 64 AA-7 3.6 DA-5 7.3 - - 23600 32 B-60 MM-24 64 AA-8 4.4 DA-6 6.7 ED-2 0.18 15400 50 B-61 MM-25 43 AA-7 3.6 DA-4 6.4 ED-2 0.18 18900 81 B-62 MM-25 43 - - DA-6 6.7 ED-3 0.29 12300 16 B-63 MM-26 78 AA-7 3.6 DA-4 6.4 - - 24300 64 B-64 MM-26 78 AA-8 4.4 DA-5 7.3 ED-2 0.18 7500 69 B-65 MM-27 66 AA-7 3.6 DA-6 6.7 ED-2 0.18 9500 78 B-66 MM-27 66 AA-8 4.4 DA-4 6.4 - - 25100 26 B-67 MM-28 64 - - - - ED-3 2.9 6600 40 B-68 MM-28 64 AA-8 4.4 DA-4 6.4 - - 27800 81 B-69 MM-28 64 AA-7 3.6 DA-5 7.3 - - 26200 67 B-70 MM-29 73 AA-8 4.4 DA-6 6.7 ED-2 0.18 9800 42 B-71 MM-29 73 AA-8 4.4 DA-4 6.4 ED-1 0.28 15500 56 B-72 MM-29 73 AA-8 4.4 DA-6 6.7 ED-3 0.29 18900 38 B-73 MM-29 73 AA-8 4.4 DA-4 6.4 ED-1 0.56 7400 68 B-74 MM-29 73 - - DA-5 7.3 ED-1 0.28 6200 19 B-75 MM-29 37 AA-8 6.6 DA-4 6.4 ED-1 0.28 10800 78 B-76 MM-29 110 AA-8 2.2 DA-4 6.4 ED-1 0.28 8300 32 B-77 MM-30 89 AA-8 4.4 DA-6 6.7 ED-1 0.28 13600 61 B-78 MM-30 89 AA-7 3.6 DA-4 6.4 ED-1 0.28 7700 35 B-79 MM-31 16 AA-7 3.6 DA-6 6.7 ED-1 0.28 10600 59 B-80 MM-31 16 AA-8 4.4 DA-4 6.4 ED-2 0.18 11700 56

[Table 11] resin Acid dianhydride macromonomer Acid dianhydride Diamine end capping agent Mw Acid value (mgKOH/g) type Amount added (parts by mass) type Amount added (parts by mass) type Amount added (parts by mass) type Amount added (parts by mass) B-81 MM-32 41 AA-7 3.6 DA-5 7.3 ED-1 0.28 16400 71 B-82 MM-32 41 AA-8 4.4 DA-6 6.7 ED-2 0.18 8100 43 B-83 MM-33 20 AA-7 3.6 DA-4 6.4 ED-2 0.18 14900 84 B-84 MM-33 20 AA-8 4.4 DA-6 6.7 ED-1 0.28 14500 55 B-85 MM-34 twenty one AA-7 3.6 DA-4 6.4 ED-1 0.28 15700 57 B-86 MM-34 twenty one AA-8 4.4 DA-5 7.3 ED-2 0.18 15000 36 B-87 MM-35 twenty four AA-8 4.4 DA-6 6.7 ED-1 0.28 16600 33 B-88 MM-35 twenty four AA-8 4.4 DA-4 6.4 - - 23100 75 B-89 MM-35 twenty four AA-8 4.4 DA-6 6.7 ED-2 0.18 15700 52 B-90 MM-35 twenty four AA-7 3.6 DA-4 6.4 ED-2 0.18 12500 19 B-91 MM-35 twenty four AA-8 4.4 DA-5 7.3 ED-2 0.18 17600 35 B-92 MM-35 twenty four AA-7 3.6 DA-6 6.7 - - 21500 27 B-93 MM-35 twenty four AA-8 4.4 DA-4 6.4 ED-2 0.18 7300 62

The acid dianhydride macromonomers MM-1 to MM-40 are compounds of the above structures, respectively. In addition, the acid dianhydrides AA-1 to AA-8, the diamines DA-1 to DA-7, and the terminal blocking agents ED-1 to ED-3 are compounds of the structures shown below, respectively.

[Chemical formula 41]

[Chemical formula 42]

[Chemical formula 43]

(Synthesis Example 2-94) Synthesis of Resin B-94 14.9 g (solid content conversion) of acid dianhydride macromonomer MM-23 was added to a three-necked flask replaced with nitrogen, and 10 g of propylene glycol monomethyl ether acetate was added , and heated to 40°C. 1.8 g of 4-aminophthalic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) was added thereto, and the mixture was further heated and stirred at 40° C. for 6 hours, whereby 30 of resin B-94 having the following structure was obtained. % propylene glycol monomethyl ether acetate solution. The weight average molecular weight of the obtained resin B-94 was 4900, and the acid value was 34 mgKOH/g. [Chemical formula 44]

<Production of dispersion liquid> Using a bead mill (using zirconium dioxide beads with a diameter of 0.3 mm), the mixed solution containing the raw materials listed in the following table was mixed and dispersed for 3 hours, and then a high-pressure disperser NANO- 3000-10 (manufactured by Japan BEE Co., Ltd.) was dispersed under a pressure of 2000 MPa with a flow rate of 500 g/min. This dispersion treatment was repeated 10 times to obtain each dispersion liquid.

[Table 12] Color material Pigment Derivatives Resin (dispersant) solvent PR 264 PR 254 Derivative 1 Derivative 2 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 C-1 C-2 C-3 Dispersion R1 20.8 - 5.2 - 9.2 - - - - - - - - - - 64.8 - - Dispersion R2 - 24.2 - 5.6 9.8 - - - - - - - - - - 55.6 - 4.8 Dispersion R3 11.6 10.6 - 4.6 11.2 - - - - - - - - - - - 62.0 - Dispersion R4 20.8 - 5.2 - - 9.2 - - - - - - - - - 64.8 - - Dispersion R5 21.2 - 5.2 - - - 8.9 - - - - - - - - 64.7 - - Dispersion R6 20.8 - 5.1 - - - - 9.2 - - - - - - - 64.9 - - Dispersion R7 20.8 - 5.2 - - - - - 9.2 - - - - - - 32.4 32.4 - Dispersion R8 24.2 - 4.9 - - - - - - 9.5 - - - - - 61.4 - - Dispersion R9 20.8 - 5.2 - - - - - - - 9.2 - - - - 64.8 - - Dispersion R10 20.8 - 5.2 - - - - - - - - 9.2 - - - 32.4 - 32.4 Dispersion R11 21.2 - 4.6 - - - - - - - - - 9.9 - - 64.3 - - Dispersion R12 20.8 - 5.2 - - - - - - - - - - 9.2 - 64.8 - - Dispersion R13 - 24.1 5.5 - - - - - - - - - - - 11.2 59.2 - - [Table 13] Color material Pigment Derivatives Resin (dispersant) solvent PR 264 PR 254 Derivative 1 Derivative 2 B-46 B-48 B-50 B-52 B-54 B-56 B-58 B-60 B-61 B-62 Cb-1 C-1 C-2 C-3 Dispersion R14 20.8 - 5.2 - 9.2 - - - - - - - - - - 64.8 - - Dispersion R15 - 24.2 - 5.6 9.8 - - - - - - - - - - 55.6 - 4.8 Dispersion R16 11.6 10.6 - 4.6 11.2 - - - - - - - - - - - 62.0 - Dispersion R17 20.8 - 5.2 - - 9.2 - - - - - - - - - 64.8 - - Dispersion R18 20.5 - 5.3 - - - 9.2 - - - - - - - - 65.0 - - Dispersion R19 11.6 10.6 5.2 - - - - 9.8 - - - - - - - 62.8 - - Dispersion R20 20.8 - 5.2 - - - - - 9.2 - - - - - - 44.8 - 20.0 Dispersion R21 20.8 - 5.2 - - - - - - 9.2 - - - - - 54.8 - 10.0 Dispersion R22 20.8 - 5.8 - - 4.2 - - - - 5.0 - - - - 54.2 - 10.0 Dispersion R23 11.6 10.6 5.2 - - - - - - - - 9.2 - - - 53.4 - 10.0 Dispersion R24 20.8 - 5.2 - - 4.2 - - - - - - 5.0 - - 54.8 - 10.0 Dispersion R25 20.3 - 5.3 - - 4.2 - - - - - - - 9.2 - 51.0 - 10.0 Dispersion CR1 20.8 - 4.9 - - - - - - - - - - - 9.2 65.1 - - [Table 14] Color material Pigment Derivatives Resin (dispersant) solvent PB 15:6 PB 16 Derivative 1 Derivative 2 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 C-1 C-2 C-3 Dispersion B1 22.6 - - 5.0 9.8 - - - - - - - - - - 2.6 2.6 57.4 Dispersion B2 - 22.3 - 4.2 - 10.3 - - - - - - - - - 20.1 - 43.1 Dispersion B3 5.4 22.4 - 5.6 - - 10.5 - - - - - - - - 52.9 - 3.2 Dispersion B4 - 22.3 - 4.2 10.3 - - - - - - - - - - 43.1 - 20.1 Dispersion B5 - 22.3 - 4.2 - - 10.1 - - - - - - - - 43.3 - 20.1 Dispersion B6 - 22.3 - 4.6 - - - 10.3 - - - - - - - 42.7 10.1 10.0 Dispersion B7 - 22.3 2.1 2.0 - - - - 11.5 - - - - - - 42.0 - 20.1 Dispersion B8 11.0 11.3 - 4.2 - - - - - 10.3 - - - - - 43.1 - 20.1 Dispersion B9 - 22.3 - 4.2 - - - - - - 10.2 - - - - 43.2 10.1 10.0 Dispersion B10 11.0 11.3 - 4.9 - - - - - - - 10.3 - - - 43.1 10.1 9.3 Dispersion B11 - 22.3 2.1 2.1 - - - - - - - - 10.6 - - 42.8 - 20.1 Dispersion B12 - 22.3 - 4.6 - - - - - - - - - 10.7 - 42.3 - 20.1 Dispersion B13 - 22.3 - 4.2 - - - - - - - - - - 10.3 43.1 - 20.1 [Table 15] Color material Pigment Derivatives Resin (dispersant) solvent PB 15:6 PB 16 Derivative 1 Derivative 2 B-63 B-65 B-67 B-69 B-71 B-73 B-75 B-77 B-79 B-81 cB-1 C-1 C-2 C-3 Dispersion B14 22.6 - - 5.0 9.8 - - - - - - - - - - 2.6 2.6 57.4 Dispersion B15 - 22.3 - 4.2 - 10.3 - - - - - - - - - 20.1 - 43.1 Dispersion B16 5.4 22.4 - 5.6 - - 10.5 - - - - - - - - 43.1 - 13.0 Dispersion B17 - 22.3 - 4.2 10.3 - - - - - - - - - - 43.1 - 20.1 Dispersion B18 - 22.3 - 4.2 - - 10.3 - - - - - - - - 53.1 1.0 9.1 Dispersion B19 11.0 11.3 - 5.6 - - - 10.6 - - - - - - - 43.1 1.0 17.4 Dispersion B20 - 22.3 - 4.2 - 5.0 - - 10.3 - - - - - - 43.1 1.0 14.1 Dispersion B21 22.3 - 4.2 - - - - 10.3 - - - - - 53.1 1.0 9.1 Dispersion B22 - 22.3 - 4.2 - 5.0 - - - - 5.5 - - - - 53.1 1.0 8.9 Dispersion B23 - 22.3 - 5.3 - - - - - - - 10.3 - - - 43.1 1.0 18.0 Dispersion B24 - 22.3 - 4.2 - 5.0 - - - - - - 5.5 - 43.1 1.0 18.9 Dispersion B25 - 22.3 - 3.5 - - - - - - - - - 10.3 - 43.1 1.0 19.8 Dispersion CB1 - 22.3 - 4.2 - - - - - - - - - - 10.3 43.1 - 20.1 [Table 16] Color material Pigment Derivatives Resin (dispersant) solvent PB 7 PG 36 PG 58 PY 129 PY 185 PY 215 Derivative 1 Derivative 2 B-23 B-24 B-25 B-26 B-27 B-28 B-29 B-30 B-31 B-32 B-33 C-1 C-2 Dispersion G1 12.3 - - - - - - 2.5 2.5 - - 2.3 - - - - - - - 80.4 - Dispersion G2 - 11.9 - - 2.5 - - 2.3 - 2.8 - - - - 1.1 - - - - 79.4 - Dispersion G3 10.1 - 2.0 - 2.5 - - 2.6 - - 5.3 - - - - - - - - 67.5 10.0 Dispersion G4 - - 10.2 1.5 - 1.5 - 2.3 7.6 - - - - - - - - - - 76.9 - Dispersion G5 - - 10.2 1.5 - 1.5 - 2.3 - 7.6 - - - - - - - - - 76.9 - Dispersion G6 - - 10.2 3.0 - - - 2.3 - - 7.3 - - - - - - - - 76.9 0.3 Dispersion G7 - - 10.2 3.0 - - - 2.3 - - - 7.6 - - - - - - - 76.9 - Dispersion G8 - 10.2 - - - 3.0 - 2.3 - - - - 7.9 - - - - - - 76.3 0.3 Dispersion G9 - 10.2 - - - 3.0 - 2.3 - - - - - 7.6 - - - - - 66.9 10.0 Dispersion G10 - - 10.2 3.0 - - - 2.3 - - - - - - 8.5 - - - - 66.9 9.1 Dispersion G11 - - 10.2 3.0 - - - 2.3 - - - - - - - 7.6 - - - 76.9 - Dispersion G12 - 10.2 - - - 3.0 - 2.3 - - - - - - - - 8.1 - - 76.4 - Dispersion G13 - 10.2 - - - 3.0 - 2.3 - - - - - - - - - 7.6 - 76.9 - Dispersion G14 - - 10.2 - - 3.0 - 2.3 - - - - - - - - - - 7.2 76.9 0.4 [Table 17] Color material Pigment Derivatives Resin (dispersant) solvent PB 7 PG 36 PG 58 PY 129 PY 185 PY 215 Derivative 1 Derivative 2 B-80 B-81 B-82 B-83 B-84 B-85 B-90 B-91 B-92 B-93 cB-1 C-1 C-2 Dispersion G15 12.3 - - - - - - 2.5 2.5 - - 2.3 - - - - - - - 80.4 - Dispersion G16 - 11.9 - - 2.5 - - 2.3 - 2.8 - - - - 1.1 - - - - 79.4 - Dispersion G17 10.1 - 2.0 - 2.5 - - 2.6 - - 5.3 - - - - - - - - 77.5 - Dispersion G18 - - 10.2 2.0 - 1.0 - 2.3 7.6 - - - - - - - - - - 76.9 - Dispersion G19 - - 10.2 2.0 - 1.0 - 2.3 - 7.6 - - - - - - - - - 76.9 - Dispersion G20 - - 10.2 2.0 - 1.0 - 2.3 - - 7.6 - - - - - - - - 76.9 - Dispersion G21 - - 10.2 2.0 - 1.0 - 2.3 - - - 7.7 - - - - - - - 66.9 9.9 Dispersion G22 - - 10.2 2.0 1.0 - - 2.3 - - - - 7.6 - - - - - - 76.9 - Dispersion G23 - - 10.2 2.0 1.0 - - 2.3 3.8 - - - - 7.6 - - - - - 73.1 - Dispersion G24 - - 10.2 2.0 1.0 - - 2.3 - - - - - - 7.9 - - - - 76.6 - Dispersion G25 - - 10.2 - - 3.0 - 2.3 3.8 - - - - - - 7.6 - - - 63.1 10.0 Dispersion G26 - - 10.2 - - 3.0 - 2.3 3.8 - - - - - - - 7.6 - - 63.1 10.0 Dispersion G27 - - 10.2 - 2.0 1.0 - 2.3 3.8 - - - - - - - - 7.8 - 72.9 - Dispersion CG1 - - 10.2 - 2.0 1.0 - 2.3 - - - - - - - - - - 7.6 76.9 - [Table 18] Color material Pigment Derivatives Resin (dispersant) solvent PR 264 PR 179 PB 15:6 PB 16 PY 215 PV 23 IRGAP HORE PBk32 Derivative 1 Derivative 2 B-47 B-49 B-51 B-53 B-55 B-57 B-59 B-61 B-63 C-1 C-2 C-3 Dispersion Bk1 6.8 - - 4.4 1.0 - - - 1.2 - 6.5 - - - - - - - - 62.4 - 17.7 Dispersion Bk2 - 9.9 - 1.3 - - - - - 1.5 - 4.5 - - - - - - - 62.6 20.2 - Dispersion Bk3 6.8 - - 4.4 1.0 - - - 1.2 - - - 6.5 - - - - - - 62.4 17.7 - Dispersion Bk4 - - 12.4 - - - - - 1.2 - 2.0 - - 3.2 - - - - - 62.2 9.7 9.3 Dispersion Bk5 - - - 6.3 - - 6.3 - - 2.1 2.0 - - - 3.2 - - - - 62.2 17.9 - Dispersion Bk6 - - 3.1 - - - 3.1 3.1 - 2.1 2.0 - - - - 3.2 - - - 64.8 18.6 - Dispersion Bk7 - - 4.2 - - 4.2 - - 1.0 1.0 2.0 - - - - - 2.5 - - 64.0 21.1 - Dispersion Bk8 6.8 - - 4.4 1.0 - - - 2.3 - 2.0 - - - - - - 2.2 - 62.4 18.9 - Dispersion Bk9 - 9.9 - 1.3 - - - - - 1.5 2.0 - - - - - - - 2.2 62.6 20.5 - Dispersion Bk10 6.8 - - 4.4 1.0 - - - 1.2 - - 6.5 - - - - - - - 62.4 - 17.7 Dispersion Bk11 6.8 - - 4.4 1.0 - - - 1.2 - - - 6.5 - - - - - - 62.4 - 17.7 Dispersion Bk12 6.8 - - 4.4 1.0 - - - 1.2 0.3 - - - 6.5 - - - - - 60.8 - 19.0 Dispersion Bk13 6.8 - - 4.4 1.0 - - - 1.2 0.3 - - - - 6.5 - - - - 60.8 - 19.0 Dispersion Bk14 6.8 - - 4.4 1.0 - - - 1.2 0.3 - - - - - 6.5 - - - 61.6 - 18.2 Dispersion Bk15 6.8 - - 4.4 1.0 - - - 1.2 - - - - - - - 6.5 - - 62.4 - 17.7 Dispersion Bk16 6.8 - - 4.4 1.0 - - - 1.2 0.3 - - - - - - - 6.5 - 60.5 - 19.3 Dispersion Bk17 6.8 - - 4.4 1.0 - - - 1.2 - - - - - - - - - 6.5 62.4 - 17.7 [Table 19] Color material Pigment Derivatives Resin (dispersant) solvent PR 264 PR 179 PB 15:6 PB 16 PY 215 PV 23 IRGAP HORE PBk32 Derivative 1 Derivative 2 B-65 B-66 B-68 B-94 cB-1 C-1 C-2 C-3 Dispersion Bk18 6.8 - - 4.4 1.0 - - - 1.2 - 6.5 - - - - 62.4 - 17.7 Dispersion Bk19 6.8 - - 4.4 1.0 - - - 1.2 0.2 - 6.5 - - - 60.8 - 19.1 Dispersion Bk20 6.8 - - 4.4 1.0 - - - 1.2 0.2 - - 6.5 - - 60.8 - 19.1 Dispersion Bk21 6.8 - - 4.4 1.0 - - - 1.2 0.2 - - - 6.5 - 60.8 - 19.1 Dispersion CBk1 6.8 - - 4.4 1.0 - - - - - - - - - 6.5 64.1 - 17.2 Dispersion CBk2 - 9.9 - 1.3 - - - - - 1.5 - - - - 6.5 62.6 - 18.2 Dispersion CBk3 - - - 6.3 - - 6.3 - - 2.1 - - - - 6.5 62.2 - 18.6

PBk32：C.I.顏料黑32（下述結構的化合物、苝顏料） [化學式46]

The unit of the numerical value described in the above table is parts by mass. Among the raw materials shown in the above table, the details of the raw materials represented by abbreviations are as follows. [Color material] PR264: CI Pigment Red 264 (Red Pigment, Diketopyrrolopyrrole Pigment) PR254: CI Pigment Red 254 (Red Pigment, Diketopyrrolopyrrole Pigment) PR179: CI Pigment Red 179 PB15:6: CI Pigment Blue 15: 6 (Blue Pigment, Phthalocyanine Pigment) PB16: CI Pigment Blue 16 (Blue Pigment, Phthalocyanine Pigment) PG7: CI Pigment Green 7 PG36: CI Pigment Green 36 PG58: CI Pigment Green 58 PY129: CI Pigment Yellow 129 PY185: CI Pigment Yellow 185 PY215: CI Pigment Yellow 215 PV23: CI Pigment Violet 23 IRGAPHORE: Irgaphor Black S 0100 CF (manufactured by BASF Corporation, compound of the following structure, lactamide pigment) [Chemical formula 45]

PBk32: CI Pigment Black 32 (compound of the following structure, perylene pigment) [Chemical formula 46]

衍生物2：下述結構的化合物 [化學式48]

[Pigment Derivative] Derivative 1: Compound of the following structure [Chemical formula 47]

Derivative 2: Compound of the following structure [Chemical formula 48]

[resin] (specific resin) B-1, B-2, B-3, B-4, B-5, B-6, B-7, B-8, B-9, B-10, B-11, B-12, B- 13, B-14, B-15, B-16, B-17, B-18, B-19, B-20, B-21, B-22, B-23, B-24, B-25, B-26, B-27, B-28, B-29, B-30, B-31, B-32, B-33, B-46, B-47, B-48, B-49, B- 50, B-51, B-52, B-53, B-54, B-55, B-56, B-57, B-58, B-59, B-60, B-61, B-62, B-63, B-65, B-66, B-67, B-68, B-69, B-71, B-73, B-75, B-77, B-79, B-80, B- 81, B-82, B-83, B-84, B-85, B-90, B-91, B-92, B-93, B-94: the above resins

(Comparative resin) cB-1: Resin of the following structure (weight average molecular weight is 10885, acid value is 74 mgKOH/g. The description of "Polym" means that the repeating unit of the structure represented by "Polym" is a numerical bond with the attached numerical value The case where the polymer chain of the knot structure is bonded to a sulfur atom (S).) [Chemical formula 49]

[Solvent] C-1: Propylene glycol monomethyl ether acetate C-2: Propylene Glycol Monomethyl Ether C-3: cyclohexanone

<Manufacture of resin composition> The resin compositions of Examples and Comparative Examples were prepared by mixing the raw materials described in the following tables.

[Table 20] Dispersions resin polymerizable monomer photopolymerization initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 1 Dispersion R1 54.6 Ba-1 12.0 D-1 5 E-1 5.0 C-1 23.4 Example 2 Dispersion R2 56.4 Ba-1 4.0 D-1 4 E-1 3.0 C-1 32.6 Example 3 Dispersion R3 54.6 Ba-1 2.0 D-1 3 E-2 1.0 C-3 39.4 Example 4 Dispersion R4 58.6 Ba-1 8.0 D-1 3 E-2 3.0 C-3 27.4 Example 5 Dispersion R5 55.0 Ba-1 8.0 D-1 3 E-3 3.0 C-3 31.0 Example 6 Dispersion R6 55.9 Ba-1 10.0 D-1 5 E-1 3.0 C-3 26.1 Example 7 Dispersion R7 57.2 Ba-1 10.0 D-1 5 E-2 3.0 C-3 24.8 Example 8 Dispersion R8 63.7 Ba-1 10.0 D-1 4 E-3 3.0 C-1 19.3 Example 9 Dispersion R9 56.9 Ba-1 12.0 D-1 4 E-3 3.0 C-3 24.1 Example 10 Dispersion R10 55.0 Ba-1 5.0 D-1 4 E-2 3.0 C-1 33.0 Example 11 Dispersion R11 55.0 Ba-1 5.0 D-1 3 E-2 3.0 C-1 C-2 17 17 Example 12 Dispersion R12 55.0 Ba-1 5.0 D-1 3 E-3 3.0 C-1 C-3 17 17 Example 13 Dispersion R13 55.0 Ba-2 5.0 D-2 2 E-3 3.0 C-1 35.0 Example 14 Dispersion R14 52.5 Ba-2 8.0 D-2 5 E-1 2.0 C-3 32.5 Example 15 Dispersion R15 52.0 Ba-2 8.0 D-2 5 E-1 3.0 C-3 32.0 Example 16 Dispersion R16 57.9 Ba-2 8.0 D-2 5 E-1 3.0 C-3 26.2 Example 17 Dispersion R17 52.3 Ba-2 8.0 D-2 5 E-2 3.0 C-3 31.7 Example 18 Dispersion R18 56.7 Ba-2 8.0 D-2 2 E-2 2.0 C-3 31.3 Example 19 Dispersion R19 55.1 Ba-2 8.0 D-2 5 E-2 3.0 C-1 28.9 Example 20 Dispersion R20 58.0 Ba-2 10.0 D-2 5 E-3 3.0 C-1 24.0 Example 21 Dispersion R21 53.8 Ba-2 10.0 D-2 2 E-3 3.0 C-1 31.2 Example 22 Dispersion R22 54.1 Ba-2 10.0 D-2 5 E-3 3.0 C-1 27.9 Example 23 Dispersion R23 59.2 Ba-2 10.0 D-2 5 E-1 3.0 C-3 22.9 Example 24 Dispersion R24 56.4 Ba-2 8.0 D-2 5 E-2 2.0 C-3 28.6 Example 25 Dispersion R25 56.8 Ba-3 8.0 D-3 2 E-3 3.0 C-3 30.2 Example 26 Dispersion B1 55.0 Ba-2 5.0 D-2 2 E-3 3.0 C-1 35.0 Example 27 Dispersion B2 52.5 Ba-2 8.0 D-2 5 E-1 2.0 C-3 32.5 Example 28 Dispersion B3 52.0 Ba-2 8.0 D-2 5 E-1 3.0 C-3 32.0 Example 29 Dispersion B4 57.9 Ba-2 8.0 D-2 5 E-1 3.0 C-3 26.2 Example 30 Dispersion B5 52.3 Ba-2 8.0 D-2 5 E-2 3.0 C-3 31.7 Example 31 Dispersion B6 56.7 Ba-2 8.0 D-2 2 E-2 2.0 C-3 31.3 Example 32 Dispersion B7 55.1 Ba-2 8.0 D-2 5 E-2 3.0 C-1 28.9 Example 33 Dispersion B8 58.0 Ba-2 10.0 D-2 5 E-3 3.0 C-1 24.0 Example 34 Dispersion B9 53.8 Ba-2 10.0 D-2 2 E-3 3.0 C-1 31.2 Example 35 Dispersion B10 54.1 Ba-2 10.0 D-2 5 E-3 3.0 C-1 27.9 Example 36 Dispersion B11 59.2 Ba-2 10.0 D-2 5 E-1 3.0 C-3 22.9 Example 37 Dispersion B12 56.4 Ba-2 8.0 D-2 5 E-2 2.0 C-3 28.6 Example 38 Dispersion B13 56.8 Ba-3 8.0 D-3 2 E-3 3.0 C-3 30.2 Example 39 Dispersion B14 63.7 Ba-3 9.0 D-3 5 E-1 3.0 C-3 19.3 Example 40 Dispersion B15 70.2 Ba-3 10.0 D-3 5 E-2 3.0 C-3 11.8 [Table 21] Dispersions resin polymerizable monomer photopolymerization initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 41 Dispersion B16 55.0 Ba-3 5.0 D-4 5 E-3 2.0 C-1 33.0 Example 42 Dispersion B17 55.0 Ba-3 5.0 D-4 5 E-3 3.0 C-1 32.0 Example 43 Dispersion B18 55.0 Ba-3 5.0 D-4 5 E-3 3.0 C-1 32.0 Example 44 Dispersion B19 55.0 Ba-3 5.0 D-4 5 E-3 3.0 C-1 32.0 Example 45 Dispersion B20 55.0 Ba-3 5.0 D-4 2 E-3 2.0 C-1 36.0 Example 46 Dispersion B21 55.0 Ba-3 5.0 D-4 5 E-3 3.0 C-1 32.0 Example 47 Dispersion B22 53.8 Ba-3 8.0 D-4 2 E-3 1.0 C-1 35.2 Example 48 Dispersion B23 56.6 Ba-3 8.0 D-4 5 E-1 3.0 C-1 27.5 Example 49 Dispersion B24 59.8 Ba-3 8.0 D-4 5 E-2 3.0 C-1 24.2 Example 50 Dispersion B25 60.3 Ba-3 8.0 D-4 2 E-3 1.0 C-3 28.7 Example 51 Dispersion G1 56.8 Ba-3 8.0 D-3 2 E-3 3.0 C-3 30.2 Example 52 Dispersion G2 63.7 Ba-3 9.0 D-3 5 E-1 3.0 C-3 19.3 Example 53 Dispersion G3 70.2 Ba-3 10.0 D-3 5 E-2 3.0 C-3 11.8 Example 54 Dispersion G4 55.0 Ba-3 5.0 D-4 5 E-3 2.0 C-1 33.0 Example 55 Dispersion G5 55.0 Ba-3 5.0 D-4 5 E-3 3.0 C-1 32.0 Example 56 Dispersion G6 55.0 Ba-3 5.0 D-4 5 E-3 3.0 C-1 32.0 Example 57 Dispersion G7 55.0 Ba-3 5.0 D-4 5 E-3 3.0 C-1 32.0 Example 58 Dispersion G8 55.0 Ba-3 5.0 D-4 2 E-3 2.0 C-1 36.0 Example 59 Dispersion G9 55.0 Ba-3 5.0 D-4 5 E-3 3.0 C-1 32.0 Example 60 Dispersion G10 53.8 Ba-3 8.0 D-4 2 E-3 1.0 C-1 35.2 Example 61 Dispersion G11 56.6 Ba-3 8.0 D-4 5 E-1 3.0 C-1 27.5 Example 62 Dispersion G12 59.8 Ba-3 8.0 D-4 5 E-2 3.0 C-1 24.2 Example 63 Dispersion G13 60.3 Ba-3 8.0 D-4 2 E-3 1.0 C-3 28.7 Example 64 Dispersion G14 57.1 Ba-3 8.0 D-1 5 E-1 2.0 C-3 27.9 Example 65 Dispersion G15 56.3 Ba-3 12.0 D-1 10 E-2 5.0 C-3 16.7 Example 66 Dispersion G16 55.9 Ba-3 8.0 D-1 5 E-3 5.0 C-3 26.1 Example 67 Dispersion G17 54.1 Ba-3 8.0 D-1 2 E-1 3.0 C-3 32.9 Example 68 Dispersion G18 55.9 Ba-3 8.0 D-1 2 E-2 3.0 C-3 31.1 Example 69 Dispersion G19 60.6 Ba-3 8.0 D-1 5 E-3 3.0 C-3 23.4 Example 70 Dispersion G20 55.0 Ba-3 8.0 D-1 5 E-3 3.0 C-3 29.0 Example 71 Dispersion G21 55.0 Ba-2 8.0 D-1 5 E-3 3.0 C-3 29.0 Example 72 Dispersion G22 55.0 Ba-2 5.0 D-1 2 E-2 3.0 C-1 35.0 Example 73 Dispersion G23 55.0 Ba-2 5.0 D-1 2 E-2 3.0 C-1 35.0 Example 74 Dispersion G24 55.0 Ba-2 5.0 D-1 2 E-3 3.0 C-1 35.0 Example 75 Dispersion G25 55.0 Ba-2 5.0 D-1 2 E-3 3.0 C-1 35.0 Example 76 Dispersion G26 55.0 Ba-3 8.0 D-1 5 E-3 3.0 C-3 29.0 Example 77 Dispersion G27 55.0 Ba-2 8.0 D-1 5 E-3 3.0 C-3 29.0 Example 78 Dispersion Bk1 55.0 Ba-3 8.0 D-1 5 E-3 3.0 C-3 29.0 Example 79 Dispersion Bk2 55.0 Ba-2 8.0 D-1 5 E-3 3.0 C-3 29.0 Example 80 Dispersion Bk3 55.0 Ba-2 5.0 D-1 2 E-2 3.0 C-1 35.0

[Table 22] Dispersions resin polymerizable monomer photopolymerization initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 81 Dispersion Bk4 55.0 Ba-2 5.0 D-1 2 E-2 3.0 C-1 35.0 Example 82 Dispersion Bk5 55.0 Ba-2 5.0 D-1 2 E-3 3.0 C-1 35.0 Example 83 Dispersion Bk6 55.0 Ba-2 5.0 D-1 2 E-3 3.0 C-1 35.0 Example 84 Dispersion Bk7 55.0 Ba-2 10.0 D-1 11.5 E-2 5.0 C-1 18.5 Example 85 Dispersion Bk8 55.0 Ba-2 5.0 D-1 5 E-2 3.0 C-1 32.0 Example 86 Dispersion Bk9 55.0 Ba-2 5.0 D-1 5 E-2 3.0 C-1 32.0 Example 87 Dispersion Bk10 55.0 Ba-3 5.0 D-1 5 E-3 3.0 C-1 32.0 Example 88 Dispersion Bk11 55.0 Ba-3 5.0 D-1 2 E-2 3.0 C-1 35.0 Example 89 Dispersion Bk12 55.0 Ba-3 5.0 D-1 2 E-2 3.0 C-1 35.0 Example 90 Dispersion Bk13 55.0 Ba-3 5.0 D-1 2 E-2 3.0 C-1 35.0 Example 91 Dispersion Bk14 55.0 Ba-3 5.0 D-1 3 E-3 3.0 C-1 34.0 Example 92 Dispersion Bk15 55.0 Ba-3 5.0 D-1 3 E-1 E-3 1.5 1.5 C-3 34.0 Example 93 Dispersion Bk16 55.0 Ba-3 8.0 D-4 5 E-2 E-3 1.5 1.5 C-1 29 Example 94 Dispersion Bk17 55.0 Ba-3 8.0 D-4 5 E-3 3.0 C-1 29 Example 95 Dispersion Bk18 55.0 Ba-3 8.0 D-4 5 E-3 3.0 C-1 29 Example 96 Dispersion Bk19 55.0 Ba-3 8.0 D-4 5 E-3 3.0 C-1 29 Example 97 Dispersion Bk20 55.0 Ba-3 8.0 D-4 5 E-3 3.0 C-1 29 Example 98 Dispersion R1 Dispersion B1 27.6 27.6 Ba-3 8.0 D-1 5 E-3 3.0 C-1 28.8 Example 99 Dispersion R1 Dispersion B6 27.6 27.6 Ba-3 8.0 D-1 D-4 2.5 2.5 E-3 3.0 C-1 33.8 Example 100 Dispersion R8 Dispersion B6 27.6 27.6 Ba-3 8.0 D-1 D-4 2.5 2.5 E-3 3.0 C-1 33.8 Example 101 Dispersion R20 Dispersion B20 27.6 27.6 Ba-3 8.0 D-1 D-4 2.5 2.5 E-3 3.0 C-1 33.8 Example 102 Dispersion R1 Dispersion G1 Dispersion B1 18.3 18.3 18.3 Ba-3 8.0 D-1 D-4 2.5 2.5 E-3 3.0 C-1 34.1 Example 103 Dispersion Bk21 55.0 Ba-3 8.0 D-4 5 E-3 3.0 C-1 29 Comparative Example 1 Dispersion CR1 54.6 Bb-1 12.0 D-1 5.0 E-1 5.0 C-1 23.4 Comparative Example 2 Dispersion CB1 55.0 Bb-1 5.0 D-2 2.0 E-3 3.0 C-1 35.0 Comparative Example 3 Dispersion CG1 56.8 Bb-1 8.0 D-3 2.0 E-3 3.0 C-3 30.2 Comparative Example 4 Dispersion CBk1 55.8 Bb-1 8.0 D-1 5.0 E-3 3.0 C-3 28.2 Comparative Example 5 Dispersion CBk2 55.8 Bb-1 8.0 D-1 5.0 E-3 3.0 C-3 28.2 Comparative Example 6 Dispersion CBk3 55.8 Bb-1 8.0 D-1 5.0 E-3 3.0 C-3 28.2

Among the raw materials described in the above table, the details of the raw materials represented by abbreviations are as follows.

〔Dispersions〕 Dispersions R1 to R25, B1 to B25, G1 to G27, Bk1 to Bk21, CR1, CB1, CG1, CBk1 to 3: the above dispersions

Ba-2：下述結構的樹脂（主鏈中標註之數值係莫耳比。重量平均分子量係15000） [化學式51]

Ba-3：下述結構的樹脂（主鏈中標註之數值係莫耳比。x、y及z的合計值係50。Mw=15000） [化學式52]

Bb-1：下述結構的樹脂（主鏈中標註之數值係莫耳比。重量平均分子量係13000） [化學式53]

[Resin] Ba-1: Resin of the following structure (The numerical value indicated in the main chain is the molar ratio. The weight average molecular weight is 11000) [Chemical formula 50]

Ba-2: Resin of the following structure (The numerical value indicated in the main chain is the molar ratio. The weight average molecular weight is 15000) [Chemical formula 51]

Ba-3: Resin of the following structure (The numerical value indicated in the main chain is the molar ratio. The total value of x, y and z is 50. Mw=15000) [Chemical formula 52]

Bb-1: Resin of the following structure (The numerical value indicated in the main chain is the molar ratio. The weight average molecular weight is 13000) [Chemical formula 53]

[Polymerizable monomer] D-1: Acrylate compound (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., a mixture of dipivalerythritol hexaacrylate and dipivalerythritol pentaacrylate) D-2: Epoxy compound (TETRAD-X, manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC., N,N,N',N'-tetraglycidyl-m-xylenediamine) D-3: Oxetane compound (OXT-221, manufactured by TOAGOSEI CO., LTD., 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl } oxetane) D-4: Oxetane compound (OX-SQ TX-100, manufactured by TOAGOSEI CO., LTD.)

[Photopolymerization initiator] E-1: Omnirad 379EG (manufactured by IGM Resins BV, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-meroline-4) -yl-phenyl)-butan-1-one) E-2: Irgacure OXE01 (manufactured by BASF, oxime compound) E-3: Compound of the following structure [Chemical formula 54]

[Solvent] C-1: Propylene glycol monomethyl ether acetate C-2: Propylene Glycol Monomethyl Ether C-3: cyclohexanone

＜Evaluation＞ [Evaluation of dispersibility] (Storage stability) In each of the Examples and Comparative Examples, the viscosity (mPa·s) of the resin composition was measured using "RE-85L" manufactured by Toki Sangyo Co., Ltd., respectively. After the above measurement, the resin composition was allowed to stand at 45° C., shielded from light, and for 3 days, and the viscosity (mPa·s) was measured again. The storage stability was evaluated according to the following evaluation criteria from the difference in viscosity (ΔVis) before and after standing. It can be said that the smaller the numerical value of the viscosity difference (ΔVis), the better the storage stability of the resin composition and the better the dispersibility of the pigment. The above-mentioned viscosity measurements were all measured in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, and the temperature of the resin composition was adjusted to 25°C.

-Evaluation criteria- A: ΔVis is 0.5 mPa·s or less. B: ΔVis is more than 0.5 mPa·s and 1.0 mPa·s or less. C: ΔVis is more than 1.0 mPa·s and 2.0 mPa·s or less. D: ΔVis is more than 2.0 mPa·s and 2.5 mPa·s or less. E: ΔVis is greater than 2.5 mPa·s.

(Particle Size) Using a dynamic light scattering particle size distribution measuring apparatus (manufactured by HORIBA, Ltd., LB-500) in accordance with JIS8826:2005, the resin composition obtained above was divided into 20 ml sample bottles, and propylene glycol monomethyl ether acetate was used. The dilution adjustment was performed so that the solid content concentration would be 0.2 mass %. At a temperature of 25°C, using a 2 ml quartz cell for measurement, the data of the above-mentioned diluted solution was read 50 times, and the particle diameter of the obtained pigment based on the arithmetic mean of the number of the pigments (number average particle diameter) was obtained. . It can be said that the smaller the value of the number average particle diameter of the pigment, the better the dispersibility of the pigment. -Evaluation criteria- A: The number-average particle diameter of the pigment is 0.05 μm or less. B: The number-average particle diameter of the pigment is more than 0.05 μm and 0.10 μm or less. C: The number average particle diameter of the pigment is more than 0.10 μm and 0.20 μm or less. D: The number-average particle diameter of the pigment is more than 0.20 μm and 0.50 μm or less. E: The number-average particle diameter of the pigment is more than 0.50 μm.

[Evaluation of Film Shrinkage Rate] In each of the Examples and Comparative Examples, the resin composition was applied to a glass substrate by spin coating, and dried at 100° C. for 120 seconds using a hot plate (pre-baking). A film having a thickness of 0.60 μm was produced by heating at 200° C. for 30 minutes using an oven (post-baking). Regarding the film thickness, a part of the film was removed to expose the glass substrate surface, and the level difference between the glass substrate surface and the coating film (film thickness of the coating film) was measured with a stylus type level difference meter (DektakXT, manufactured by Bruker Corporation). Next, the obtained film was heat-treated at 300° C. for 5 hours in a nitrogen atmosphere. Similarly, the film thickness of the film after heat treatment was measured, the film shrinkage rate was calculated|required by the following formula, and the film shrinkage rate was evaluated according to the following evaluation criteria. The following T ₀ and T ₁ were measured in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, and the substrate temperature was adjusted to 25°C. It can be said that the smaller the film shrinkage rate, the more suppressed the film shrinkage, which is a better result. Film shrinkage rate (%)=(1-(T ₁ /T ₀ ))×100 T ₀ : Film thickness of the film immediately after production (=0.60 μm) T ₁ : Heat-treated at 300° C. for 5 in a nitrogen atmosphere Film Thickness After Hours - Evaluation Criteria - A: The film shrinkage rate is 1% or less. B: The film shrinkage ratio is more than 1% and 5% or less. C: The film shrinkage ratio is more than 5% and 10% or less. D: The film shrinkage ratio is more than 10% and 30% or less. E: The film shrinkage rate is more than 30%.

[Evaluation of Cracks] In each of the Examples and Comparative Examples, the resin composition was applied to a glass substrate by spin coating, dried at 100° C. for 120 seconds using a hot plate (pre-baking), and then used. The oven was heated at 200° C. for 30 minutes (post-baking), whereby a film having a thickness of 0.60 μm was produced. Next, an inorganic film was formed by depositing 200 nm of SiO ₂ on the surface of the obtained film by a sputtering method. The inorganic film formed on the surface was heat-treated at 300° C. for 5 hours in a nitrogen atmosphere. The surface of the inorganic film after the heat treatment was observed with an optical microscope, the number of cracks per 1 cm ² was counted, and the presence or absence of cracks was evaluated according to the following evaluation criteria. - Evaluation Criteria - A: The number of cracks per 1 cm ² is zero. B: The number of cracks per 1 cm ² is 1 to 10. C: The number of cracks per 1 cm ² is 11 to 50. D: The number of cracks per 1 cm ² is 51 to 100. E: The number of cracks per 1 cm ² is 101 or more.

[Table 23] dispersion Film shrinkage cracked storage stability particle size Example 1 A B A B Example 2 B B A B Example 3 A B B B Example 4 B B A B Example 5 A B A B Example 6 A B B A Example 7 B A A B Example 8 A A A B Example 9 B A C B Example 10 A B B A Example 11 B A B A Example 12 A B B A Example 13 A A C B Example 14 A A B A Example 15 A A B A Example 16 A A B A Example 17 A A B A Example 18 A A A A Example 19 A B B A Example 20 A A A A Example 21 A A A A Example 22 A A A A Example 23 A A B A Example 24 A A B A Example 25 A A B A Example 26 B B C B Example 27 A A C B Example 28 B A A B Example 29 A A B A Example 30 B B B A Example 31 A B B A Example 32 A B B A Example 33 A A B B Example 34 A B B A Example 35 B A B A Example 36 A A A B Example 37 A A A B Example 38 A A A A Example 39 A A B A Example 40 A A B A

[Table 24] dispersion Film shrinkage cracked storage stability particle size Example 41 A B A A Example 42 A A A B Example 43 A B A A Example 44 A A A A Example 45 A A A A Example 46 A A A A Example 47 A A A A Example 48 A A A A Example 49 A A A A Example 50 A A A B Example 51 A A A A Example 52 A A B A Example 53 A A B A Example 54 A A B A Example 55 A A B A Example 56 A A B A Example 57 A A A B Example 58 A A A B Example 59 A A A A Example 60 A A A A Example 61 A A B A Example 62 A A B A Example 63 A A B B Example 64 A A B A Example 65 A A B A Example 66 A A B A Example 67 A A B B Example 68 A A B A Example 69 A A B A Example 70 A A B A Example 71 A A B B Example 72 A A B B Example 73 A A A A Example 74 A A A B Example 75 A A A B Example 76 A A A A Example 77 A A A A Example 78 A A A B Example 79 A A A B Example 80 A A A A

[Table 25] particle size Film shrinkage cracked storage stability particle size Example 81 A A A A Example 82 A A A A Example 83 A A A A Example 84 A A A A Example 85 A A A A Example 86 A A A B Example 87 A A A A Example 88 A A A A Example 89 A A A A Example 90 A A A A Example 91 A A A A Example 92 A A A A Example 93 A A A A Example 94 A A A B Example 95 A A A B Example 96 A A A B Example 97 A A A A Example 98 B B B B Example 99 B B B A Example 100 B B B B Example 101 A A A A Example 102 B B B A Example 103 A A B A Comparative Example 1 C D E D Comparative Example 2 C D D E Comparative Example 3 C D E D Comparative Example 4 C D D E Comparative Example 5 C D E D Comparative Example 6 C D E D

When using the resin composition of an Example, compared with the case where the resin composition of the comparative example was used, it was excellent in the evaluation of storage stability and particle diameter, and was excellent in the dispersibility of a pigment. Furthermore, when using the resin composition of an Example, compared with the case where the resin composition of a comparative example was used, the film shrinkage rate was all small, and the generation|occurence|production of a crack was suppressed. Therefore, it can be said that the process window in the steps after film production can be expanded compared to the resin composition of the comparative example.

(Example 1000: Pattern formation by photolithography) The resin composition of Example 1 was spin-coated on a silicon wafer, dried at 100° C. for 120 seconds using a hot plate (pre-baking), and then used in an oven. By heating at 200° C. for 30 minutes (post-baking), a resin composition layer having a thickness of 0.60 μm was produced. Next, a mask pattern in which a square-shaped non-mask portion with a side of 1.1 μm is interposed in a 4 mm×3 mm area is arranged with an i-ray stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.) at a rate of 500 mJ/ Exposure was performed by irradiating the resin composition layer with light having a wavelength of 365 nm at an exposure amount of cm ² . Next, the silicon wafer on which the exposed resin composition was formed was placed on the horizontal turntable of a spin/shower developer (Model DW-30, manufactured by CHEMITRONICS CO., Ltd.), and a developer (CD-2000, (manufactured by FUJIFILM Electronic Materials Co., Ltd.), and a liquid-overlap development was performed at 23° C. for 60 seconds. Next, the silicon wafer was rotated at 50 rpm, and a pattern (pixel) was formed by supplying pure water in a spray form from a discharge nozzle from above the rotation center to perform a rinsing process, followed by spray drying.

The fabricated silicon wafer with pixels was divided into two, and one of them was heated at 300°C for 5 hours in a nitrogen atmosphere (hereafter, one was used as the substrate before heat treatment at 300°C, and the other was heated at 300°C). substrate after treatment). The results of evaluating the cross-sections of the pixels formed on the substrate before heat treatment at 300°C and the substrate after heat treatment at 300°C were evaluated using a scanning electron microscope (SEM). ℃ 97% of the height (thickness) of the pixels of the substrate before heat treatment.

without.

Claims (22)

A resin composition comprising a pigment-containing color material A, a resin B, and a solvent C, the aforementioned resin B comprising a resin b-1 having a structure represented by formula (1), [chemical formula 1]

In formula (1), X ¹ represents a 4+n-valent linking group, X ² represents a single bond or a divalent linking group, R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more. The resin composition according to claim 1, wherein the divalent linking group represented by Lp ¹ of the aforementioned formula (1) is a group containing a sulfur atom. The resin composition according to claim 1 or claim 2, wherein X ¹ of the aforementioned formula (1) is a group containing an aromatic hydrocarbon ring. The resin composition according to claim 1 or claim 2, wherein X ² in the aforementioned formula (1) is a group containing a fluorine atom and an aromatic hydrocarbon ring. The resin composition according to claim 1 or claim 2, wherein the polymer chain represented by the aforementioned P ¹ comprises a structure selected from the group consisting of poly(meth)acrylic acid structure, polystyrene structure, polyether structure and polyester structure Repeating units of at least one structure. The resin composition according to claim 1 or claim 2, wherein the polymer chain represented by the aforementioned P ¹ comprises a repeating unit represented by any one of formula (P1-1) to formula (P1-6), [ Chemical formula 2]

In the formula, R ^G1 and R ^G2 respectively represent an alkylene group, R ^G3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a hydroxymethyl group, Q ^G1 represents -O- or -NR ^q -, and R ^q represents a hydrogen atom , alkyl, aryl or heterocyclic group, L ^G1 represents a single bond or extended aryl group, L ^G2 represents a single bond or a divalent linking group, R ^G4 represents a hydrogen atom or a substituent, R ^G5 represents a hydrogen atom or a methyl group, R ^G6 represents an aryl group. The resin composition according to claim 6, wherein the substituent represented by R ^G4 is at least 1 selected from the group consisting of ethylenically unsaturated bond-containing groups, epoxy groups, oxetanyl groups and tertiary butyl groups kind. The resin composition according to claim 1 or claim 2, wherein the structure represented by the aforementioned formula (1) is a structure represented by the formula (1-1), [Chemical formula 3]

In formula (1-1), X ¹¹ and X ¹² each independently represent a hydrocarbon group, X ¹³ represents a 2+n-valent linking group, Lx ¹¹ and Lx ¹² each independently represent a single bond or a divalent linking group, and X ² represents a monovalent linking group. A bond or a divalent linking group, R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more. The resin composition according to claim 8, wherein the hydrocarbon groups represented by X ¹¹ and X ¹² in the aforementioned formula (1-1) are aromatic hydrocarbon groups. The resin composition according to claim 1 or claim 2, wherein the structure represented by the aforementioned formula (1) is a structure represented by the formula (1-2), [Chemical formula 4]

In formula (1-2), X ¹³ represents a 2+n-valent linking group, X ² represents a single bond or a divalent linking group, R ¹¹ and R ¹² each independently represent a hydrogen atom or a substituent, and Rx ¹ and Rx ² respectively independently represents a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, n represents an integer of 1 or more, m1 represents an integer of 0 to 3, and m2 represents an integer of 0 to 3. The resin composition according to claim 1 or claim 2, wherein the aforementioned resin b-1 further comprises a structure represented by formula (2), [Chemical formula 5]

In formula (2), X ¹⁰¹ represents a 2+m-valent linking group, X ¹⁰² represents a divalent linking group, and m represents an integer of 1-4. The resin composition according to claim 1 or claim 2, wherein the aforementioned resin b-1 is a resin having a structure represented by formula (1A), [Chemical formula 6]

In formula (1A), X ¹ represents a 4+n-valent linking group, X ^2a represents a single bond, R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, and R ^N1 and R ^N2 each independently represents an alkyl group, an aryl group or a heterocyclic group, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more. The resin composition according to claim 1 or claim 2, wherein The said solvent C contains at least 1 sort(s) chosen from ester type solvent, ether type solvent, alcohol type solvent, and ketone type solvent. The resin composition according to claim 1 or claim 2, wherein The said color material A contains at least 1 sort(s) chosen from a diketopyrrolopyrrole pigment and a phthalocyanine pigment. The resin composition according to claim 1 or claim 2, further comprising a polymerizable monomer. The resin composition according to claim 1 or claim 2, further comprising a photopolymerization initiator. A film obtained by using the resin composition of any one of claim 1 to claim 16. An optical filter having the film of claim 17. A solid-state imaging element having the film described in claim 17. An image display device having the film of claim 17. A resin comprising a structure represented by formula (1), [Chemical formula 7]

In formula (1), X ¹ represents a 4+n-valent linking group, X ² represents a single bond or a divalent linking group, R ¹¹ , R ¹² , R ²¹ and R ²² each independently represent a hydrogen atom or a substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer of 1 or more. A compound represented by formula (MM1), [Chemical formula 8]

In formula (MM1), X ^1M represents a 2+n-valent linking group, the aforementioned 2+n-valent linking group is a hydrocarbon group or a group in which two or more hydrocarbon groups are bonded by a single bond or a linking group, and the aforementioned linking group is - NR ^M -, -N<, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^M CO-, -CONR ^M - or -C (CF ₃ ) ₂ -, Rx ^1M and Rx ^2M each independently represent a halogen atom, an alkyl group, a carboxyl group or a hydroxyl group, Lp ^1M represents a hydrocarbon group, -NR ^M -, -SO-, -SO ₂ -, -CO-, - O-, -COO-, -OCO-, -S-, -NR ^M CO-, -CONR ^M - or a group formed by combining two or more of these, R ^M represents a hydrogen atom, an alkyl group, an aryl group group or heterocyclic group, P ^1M represents a polymer chain including a repeating unit represented by any one of formulas (P1-1) to (P1-4), n represents an integer of 1 or more, m1 represents 0-3 Integer, m2 represents an integer from 0 to 3, [Chemical formula 9]

In formulas (P1-1) to (P1-4), R ^G1 and R ^G2 each represent an alkylene group.