TW202204910A - Burn-in test device for flexibly selected modular core power supply including a burn-in board and a power distribution board - Google Patents

Abstract

A burn-in test device for a flexibly selected modular core power supply. The device comprises a burn-in board and a power distribution board, which are movably stacked with each other. The burn-in board is electrically connected to a first power source and the power distribution board is electrically connected to a second power source. The second power source is used for providing a large current of direct current. A plurality of test units is arranged at intervals on the burn-in board. Each test unit is provided with at least one test socket for testing a semiconductor element. The first power source is used to provide normal operating voltages and general standard signals for the plurality of test units on the burn-in board. A plurality of modular buck converters that can be movably replaced are arranged at intervals on the power distribution board. The plurality of modular buck converters can be arbitrarily grouped into a plurality of buck converter groups. Each buck converter group corresponds to a test unit for reducing the voltage of the second power source and increasing the current of the second power source to convert the direct current supplied by the second power source and to supply the converted direct current to the corresponding test unit on the burn-in board.

Description

Flexible selection of modular core power supply burn-in test device

The present invention relates to the technical field of burn-in devices, in particular to a burn-in test device that flexibly selects a modular core power supply.

With the advancement of technology, the design and manufacture of a new generation of high-performance chips are more complex. Because of its fast computing speed and super powerful functions, it must work under high current and consume relatively large power, so that these chips need to be subjected to burn-in test at high temperature before leaving the factory. Therefore, semiconductor factories will conduct reliability tests during production.

Since high-performance chips must consume a lot of power, if the current of each chip IC is 600A as an example, if a burn-in board (BIB) tests 4 chips at the same time, its power supply (Power Supply) must supply a current of 2400A. However, if such a large current is transmitted through the circuit board (PCB), it will produce a great voltage drop, which will affect the test, or increase the number of PCB conductive layers and increase the cost.

To this end, US Pat. No. 6,140,829 provides a DC-to-DC converter that converts high-voltage and low-current into low-voltage and high-current and sends it to a burn-in board located in an oven. Although the above problems are effectively solved, the middle of the structure has to be connected by a plurality of special high-specification connector slots, which makes the test equipment very complicated and expensive. Will cause the voltage to drop, so that the high-speed chips cannot be tested correctly.

Therefore, my country's invention patent I406346 is further improved, and the DC to DC Converter is directly integrated on the burn-in test board, but this burn-in test board requires a normal power supply and general analog control signals. In addition, the low voltage and high current supplied by the DC-DC converter must also be set, so the integrated burn-in test board must still use special specification thick copper plate and special high specification connector slot, which cannot effectively reduce the setup cost. The power supply module is simplified, and such a burn-in board can only be used for exclusive use. When facing different components, the entire burn-in board must be remanufactured and cannot be shared with each other. Inconvenience is its main disadvantage.

In addition, my country's invention patent I689240 proposes a further improvement, which uses a general ordinary power supply to supply normal DC voltage and current to the burn-in board for signal simulation and testing, and a special high-current power supply layer, which is independent from the ordinary ordinary power supply. It is set separately to provide low voltage and high current to the test unit on the burn-in board, thereby effectively reducing the conditions for the manufacture of the burn-in board and the high-current power supply layer. It is not necessary to use too many special and expensive parts and materials. It can simplify the power supply module, reduce the setting cost, make the test operation more convenient and easy to carry out, and can provide the replacement of the burn-in board with various components, so that they can all share the practical benefits of separate power supply. However, if the DC current output by the high-current power supply layer in the burn-in board structure exceeds 1000A, it will become difficult to handle and very expensive. If the burn-in board structure is to be used in the application of testing a plurality of semiconductor devices (such as power management ICs) that handle high current, the burn-in board structure will not be able to meet this requirement.

For example, as technology advances, chips consume more and more power, and the amperage of current the chips need to handle increases dramatically. For example, chips used in base stations or switch rooms typically handle currents as high as 600A. If 4 chips for base station or switch room are tested at the same time, the DC power supply provided to the test unit of the burn-in board must be able to provide a current of 2400A. As a result, to test multiple semiconductor components handling high currents, such as chips used in base stations or switch rooms, the number of conductive layers of the PCB needs to be increased to provide high currents exceeding 1000A, thus increasing the cost.

For this reason, based on overcoming the shortcomings of the conventional technology, the inventor has developed the "burn-in test device for flexible selection of modular core power supply" of the present invention after careful experiments and researches, and a spirit of perseverance. , in addition to overcoming the above-mentioned disadvantages of the prior art, but also adding many different advantages, the following is a brief description of the present invention.

In view of this, the main purpose of the present invention is to provide a burn-in test device for flexible selection of a modular core power supply, which includes a burn-in board and a power distribution board, which are movably overlapped with each other, wherein the burn-in board is electrically connected. To a first power source, the distribution board is electrically connected to a second power source, and the second power source is used for providing a large current of direct current. A plurality of test units are arranged at intervals on the burn-in board, and each test unit is provided with at least one test socket for testing a semiconductor element. The first power supply is used for providing normal operating voltages and general standard signals for the plurality of test units on the burn-in board. A plurality of modular buck converters that can be movably replaced are arranged at intervals on the power distribution board, and the plurality of modular buck converters can be arbitrarily grouped into a plurality of buck converter groups, and each buck converter The group corresponds to a test unit for reducing the voltage of the second power supply and increasing the current of the second power supply to convert the direct current supplied by the second power supply, and supply the converted direct current to the corresponding test on the burn-in board unit.

The advantages and benefits of the present invention will be explained in detail by the following examples together with the accompanying drawings.

For the convenience of the purpose of the present invention, system composition, application function features and effects, further introduction and disclosure, hereby give an embodiment to cooperate with the drawings, the detailed description is as follows: Please refer to FIG. 1 to FIG. 2, wherein FIG. 1 is the The three-dimensional appearance view of the burn-in test device of the present invention, FIG. 2 is an exploded view of the burn-in test device of the present invention. It should be noted that in the present invention, the same reference numerals refer to the same elements. As shown in FIG. 1 and FIG. 2 , the present invention proposes a burn-in test device for flexible selection of a modular core power supply, which mainly includes a burn-in board 1 and a power distribution board 2, which are movably overlapped with each other. The burn-in board 1 is installed on the upper layer of the power distribution board 2 , a plurality of test units 11 are arranged on the burn-in board 1 at intervals, and each test unit 11 is provided with at least one test socket 111 . Each test socket 111 is configured to accommodate a semiconductor device 112 to simulate and test signals of the semiconductor device 112 . The burn-in board 1 is electrically connected to the first power supply 100 (shown in FIG. 4 ) and the signal source, and the distribution board 2 is electrically connected to a second power supply 200 (shown in FIG. 4 ). The power supply 100 can provide the plurality of test units 11 with normal operating voltages and general standard signals to the burn-in board 1 for analog testing. The power supply 100 is a direct current with a normal voltage and current. Preferably, the semiconductor element 112 is a wafer. The power source 200 is a high current DC power source.

Please refer to FIGS. 2 to 6 , wherein FIG. 3 is a top view of the burn-in test device of the present invention, FIG. 4 is a cross-sectional view of the burn-in test device of the present invention along line XX of FIG. 3 , and FIG. 5 is a The burn-in test device of the present invention is a cross-sectional view taken along line YY in FIG. 3 , and FIG. 6 is a perspective view of the burn-in test device of the present invention. As shown in FIG. 2 to FIG. 6 , a plurality of modular buck converters 211 that can be removed and replaced are arranged at intervals on the power distribution board 2 , and each modular buck converter 211 is used to reduce the voltage of the second power supply 200 voltage and boost the current of the second power supply 200 . Preferably, a connector slot 401 is provided between the burn-in board 1 and the first power supply 100 , and a connector slot 402 is provided between the power distribution board 2 and the second power supply 200 . In addition, a power connector 212 is provided on the side of each step-down converter 211 of the power distribution board 2 .

By means of a plurality of modular step-down converters 211 arranged at intervals on the power distribution board 2, the modular buck converters 211 can be quickly replaced and replaced according to the different power supply specifications of different semiconductor elements 112 to be tested during application. A single power distribution board 2 can be quickly and flexibly replaced with modular buck converters 211 with different power supply specifications, so that even a variety of different power supply specifications can share the same power distribution board 2 without having to prepare separately for each different power supply specifications A switchboard 2 causes unnecessary waste of repeated configuration, and the overall effective design can achieve the practical purpose of greatly reducing costs and saving storage space.

As shown in FIG. 2 and FIG. 6 , a plurality of modular buck converters 211 are grouped into a plurality of buck converter groups 210 , and each buck converter group 210 corresponds to a test unit 11 . As shown in FIG. 2 to FIG. 6 , in this embodiment, four buck converters 211 adjacent to each other form a buck converter group 210 , which corresponds to the test unit 11 located on the upper layer thereof. Each buck converter group 210 is used to reduce the voltage of the second power source 200 and increase the current of the second power source 200 to convert the DC power supplied by the second power source 200 , and the converted DC power is passed through the power distribution board 2 . The power connector 212 supplies the corresponding test unit 11 on the burn-in board 1 .

Therefore, the DC power supplied by the second power source 200 can be converted by the step-down converters 211 in each step-down converter group 210 , that is, the DC power supplied by the second power source 200 will be stepped down several times. and up-current conversion, and then the converted direct current is supplied to the corresponding test unit 11 on the burn-in board 1 through the power connector 212 on the power distribution board 2 . In this way, the current of the direct current supplied by the second power source 200 can be greatly increased, reaching a current value exceeding 1000A or even exceeding 2000A, thereby supplying sufficient direct current to the test unit 11 on the burn-in board 1 to test semiconductors. element 112 .

Even, in the future, it is possible to provide a higher DC current value of more than 3000A or more than 4000A by the practical design of a plurality of modular buck converters 211 that can be movably and replaced at intervals on the power distribution board 2 of the present invention. It satisfies that the test unit 11 on the burn-in board 1 can have enough direct current to test the semiconductor elements 112 with higher power supply specifications in the future.

However, it should be noted that the embodiments disclosed herein are for illustrative purposes only, rather than for limiting the present invention. The protection scope of the present invention is not limited to the precise form shown in the embodiments. For example, the present embodiment shows that the grouping of the plurality of modular buck converters 211 is such that four adjacent modular buck converters 211 form a buck converter group 210 . However, a grouping manner of two, three, five or even six adjacent modular buck converters 211 to form a buck converter group 210 can also be used to provide different applications.

Furthermore, the power distribution board 2 of the present invention has a relatively high compatibility, that is, the power distribution board 2 can be matched with other different types of burn-in boards 1 . Therefore, the flexibility of applying the power distribution board 2 to the burn-in test device can be increased.

Compared with the aforementioned prior art Chinese invention patent I689240, as shown in FIG. 1 to FIG. 6 , in the present invention, a plurality of modular step-down converters 211 are arranged on the power distribution board and a plurality of modular step-down converters are arranged. 211 is grouped into a plurality of buck converter groups 210, and each buck converter group 210 is set to be responsible for performing several buck and boost operations on the DC power supplied by the second power supply 200, and then convert the converted low The direct current with high voltage and current is supplied to the corresponding socket unit 11 on the burn-in board 1 . In this way, a super-high current can be provided to the corresponding socket unit 11 on the burn-in board 1 to test the semiconductor element 112 , so as to achieve the purpose of testing a burn-in device for processing a high-current semiconductor element at a low cost.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, which also belong to the scope of the present invention. . Therefore, the protection scope of the present invention should be defined by the claims.

To sum up, the present invention can indeed achieve the aforesaid purpose, and is in compliance with the provisions of the Patent Law, and a patent application can be filed in accordance with the law. However, the above are only preferred embodiments of the present invention, and should not limit the scope of implementation of the present invention; therefore, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the patent specification, All should fall within the scope of the patent of the present invention.

1: Burn-in board 2: Distribution board 11: Test Unit 111: Test socket 112: Semiconductor components 100: First power supply 200: Second power supply 211: Modular Buck Converters 210: Buck Converter Group 212: Power connector 401: Connector Slot 402: Connector Slot

FIG. 1 is a perspective external view of the burn-in test device of the present invention. FIG. 2 is an exploded view of the burn-in test device of the present invention. FIG. 3 is a top view of the burn-in test device of the present invention. FIG. 4 is a cross-sectional view of the burn-in test device of the present invention taken along the line X-X of FIG. 3 . FIG. 5 is a cross-sectional view of the burn-in test device of the present invention taken along the line segment Y-Y in FIG. 3 . 6 is a perspective view of a burn-in test device of the present invention.

1: Burn-in board

2: Distribution board

11: Test Unit

111: Test socket

112: Semiconductor components

211: Modular Buck Converters

210: Buck Converter Group

212: Power connector

Claims (4)

A burn-in test device for flexible selection of a modular core power supply, comprising: a burn-in board and a power distribution board, which are movably stacked with each other, wherein the burn-in board is electrically connected to a first power supply and the power distribution board is electrically connected to A second power source, the second power source is used to provide a large current of direct current, characterized by: A plurality of test units are arranged on the burn-in board at intervals, each test unit is provided with at least one test socket for testing a semiconductor element, and the first power supply is used to provide the plurality of test units on the burn-in board to work normally Voltage and general standard signals; A plurality of modular buck converters that can be movably replaced are arranged at intervals on the power distribution board, and the plurality of modular buck converters are arbitrarily grouped into a plurality of buck converter groups, and each buck converter The device group corresponds to a test unit, and is used for reducing the voltage of the second power supply and increasing the current of the second power supply to convert the direct current supplied by the second power supply, and supply the converted direct current to the corresponding test unit. The burn-in test device for flexible selection of a modular core power supply according to claim 1, wherein the burn-in board is arranged on the upper layer, and the power distribution board is arranged on the lower layer of the burn-in board. The burn-in test device for flexible selection of modular core power supply as claimed in claim 1, wherein a connector slot is arranged between the burn-in board and the first power supply, and a connector slot is arranged between the power distribution board and the second power supply connector slot. The burn-in test device for flexible selection of a modular core power supply according to claim 1, wherein a plurality of power connectors are arranged on the power distribution board, and each power connector is arranged on the side of a step-down converter for converting the The direct current is supplied to the corresponding test unit on the burn-in board.

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