TW202204480A - Resin composition for gasket and gasket for secondary battery comprising the same - Google Patents
Resin composition for gasket and gasket for secondary battery comprising the same Download PDFInfo
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- TW202204480A TW202204480A TW110119538A TW110119538A TW202204480A TW 202204480 A TW202204480 A TW 202204480A TW 110119538 A TW110119538 A TW 110119538A TW 110119538 A TW110119538 A TW 110119538A TW 202204480 A TW202204480 A TW 202204480A
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- Taiwan
- Prior art keywords
- polyarylene sulfide
- sulfide resin
- group
- pps
- resin composition
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 123
- 229920000412 polyarylene Polymers 0.000 claims abstract description 362
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims abstract description 361
- 238000010943 off-gassing Methods 0.000 claims abstract description 59
- 229920005989 resin Polymers 0.000 claims description 304
- 239000011347 resin Substances 0.000 claims description 304
- 239000000654 additive Substances 0.000 claims description 79
- 238000006116 polymerization reaction Methods 0.000 claims description 71
- 125000004432 carbon atom Chemical group C* 0.000 claims description 54
- 229920001971 elastomer Polymers 0.000 claims description 46
- 239000000806 elastomer Substances 0.000 claims description 46
- 150000003464 sulfur compounds Chemical class 0.000 claims description 43
- 150000001491 aromatic compounds Chemical class 0.000 claims description 40
- 239000003112 inhibitor Substances 0.000 claims description 39
- 230000000996 additive effect Effects 0.000 claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 33
- 239000003365 glass fiber Substances 0.000 claims description 30
- 239000003017 thermal stabilizer Substances 0.000 claims description 27
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 22
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 21
- 125000000217 alkyl group Chemical group 0.000 claims description 20
- 125000000524 functional group Chemical group 0.000 claims description 20
- 239000003792 electrolyte Substances 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 125000003342 alkenyl group Chemical group 0.000 claims description 9
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 8
- 125000001424 substituent group Chemical group 0.000 claims description 8
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 claims description 7
- 125000003277 amino group Chemical group 0.000 claims description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 150000007942 carboxylates Chemical group 0.000 claims description 7
- 229940006487 lithium cation Drugs 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 125000003368 amide group Chemical group 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- 125000005017 substituted alkenyl group Chemical group 0.000 claims description 3
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical class [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 claims 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 239
- 229920000069 polyphenylene sulfide Polymers 0.000 description 239
- 238000002156 mixing Methods 0.000 description 35
- 238000002360 preparation method Methods 0.000 description 31
- 239000000203 mixture Substances 0.000 description 29
- 239000012760 heat stabilizer Substances 0.000 description 27
- -1 arylene sulfide Chemical compound 0.000 description 23
- 238000002425 crystallisation Methods 0.000 description 22
- 230000008025 crystallization Effects 0.000 description 22
- 238000006243 chemical reaction Methods 0.000 description 20
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 19
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 17
- 229910052740 iodine Inorganic materials 0.000 description 17
- 239000011630 iodine Substances 0.000 description 16
- 238000002844 melting Methods 0.000 description 16
- 230000008018 melting Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 15
- 125000005843 halogen group Chemical group 0.000 description 14
- 230000001965 increasing effect Effects 0.000 description 14
- 239000000835 fiber Substances 0.000 description 12
- 229910052717 sulfur Inorganic materials 0.000 description 11
- 229920002725 thermoplastic elastomer Polymers 0.000 description 11
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 10
- 239000011593 sulfur Substances 0.000 description 10
- 125000003118 aryl group Chemical group 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000000155 melt Substances 0.000 description 9
- 239000003381 stabilizer Substances 0.000 description 9
- 229910052783 alkali metal Inorganic materials 0.000 description 8
- 238000004817 gas chromatography Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- LBEMXJWGHIEXRA-UHFFFAOYSA-N 2-[(2-carboxyphenyl)disulfanyl]benzoic acid Chemical compound OC(=O)C1=CC=CC=C1SSC1=CC=CC=C1C(O)=O LBEMXJWGHIEXRA-UHFFFAOYSA-N 0.000 description 7
- 229910052582 BN Inorganic materials 0.000 description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 7
- 230000001976 improved effect Effects 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 125000000101 thioether group Chemical group 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 5
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 229910052977 alkali metal sulfide Inorganic materials 0.000 description 4
- 150000001340 alkali metals Chemical class 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002667 nucleating agent Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 4
- 229910052979 sodium sulfide Inorganic materials 0.000 description 4
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- LFMWZTSOMGDDJU-UHFFFAOYSA-N 1,4-diiodobenzene Chemical compound IC1=CC=C(I)C=C1 LFMWZTSOMGDDJU-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000000921 elemental analysis Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 238000004255 ion exchange chromatography Methods 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000002798 polar solvent Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- NKZCVTVIOGABTK-UHFFFAOYSA-N 1-methyl-3-propan-2-ylideneurea Chemical compound CNC(=O)N=C(C)C NKZCVTVIOGABTK-UHFFFAOYSA-N 0.000 description 2
- XBNOMKROXZGMFW-UHFFFAOYSA-N 3-[(3-hydroxyphenyl)disulfanyl]phenol Chemical compound OC1=CC=CC(SSC=2C=C(O)C=CC=2)=C1 XBNOMKROXZGMFW-UHFFFAOYSA-N 0.000 description 2
- XGKGITBBMXTKTE-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)disulfanyl]phenol Chemical compound C1=CC(O)=CC=C1SSC1=CC=C(O)C=C1 XGKGITBBMXTKTE-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- UJOHNXQDVUADCG-UHFFFAOYSA-L aluminum;magnesium;carbonate Chemical compound [Mg+2].[Al+3].[O-]C([O-])=O UJOHNXQDVUADCG-UHFFFAOYSA-L 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 239000012065 filter cake Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- PZYDAVFRVJXFHS-UHFFFAOYSA-N n-cyclohexyl-2-pyrrolidone Chemical compound O=C1CCCN1C1CCCCC1 PZYDAVFRVJXFHS-UHFFFAOYSA-N 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003495 polar organic solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002954 polymerization reaction product Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920006344 thermoplastic copolyester Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- QQFIQWBUKYSUHM-UHFFFAOYSA-N (2,3-diiodophenyl)-phenylmethanone Chemical compound IC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1I QQFIQWBUKYSUHM-UHFFFAOYSA-N 0.000 description 1
- UKWSLARRYUYQHY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoro-2-(trifluoromethyl)propane-2-sulfonic acid Chemical compound OS(=O)(=O)C(C(F)(F)F)(C(F)(F)F)C(F)(F)F UKWSLARRYUYQHY-UHFFFAOYSA-N 0.000 description 1
- DITRUDNLBLQKFX-UHFFFAOYSA-N 1,1,2,3,3,4,4,5,5,6,6,6-dodecafluoro-2-(1,1,2,2,2-pentafluoroethyl)hexane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F DITRUDNLBLQKFX-UHFFFAOYSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- LSESTAVEDKBXPP-UHFFFAOYSA-N 1,2-diiodo-3,4-dimethylbenzene Chemical group CC1=CC=C(I)C(I)=C1C LSESTAVEDKBXPP-UHFFFAOYSA-N 0.000 description 1
- BBOLNFYSRZVALD-UHFFFAOYSA-N 1,2-diiodobenzene Chemical compound IC1=CC=CC=C1I BBOLNFYSRZVALD-UHFFFAOYSA-N 0.000 description 1
- UYHYZAYIQAVJCN-UHFFFAOYSA-N 1,2-diiodonaphthalene Chemical compound C1=CC=CC2=C(I)C(I)=CC=C21 UYHYZAYIQAVJCN-UHFFFAOYSA-N 0.000 description 1
- BCNBMSZKALBQEF-UHFFFAOYSA-N 1,3-dimethylpyrrolidin-2-one Chemical compound CC1CCN(C)C1=O BCNBMSZKALBQEF-UHFFFAOYSA-N 0.000 description 1
- IVUYGANTXQVDDG-UHFFFAOYSA-N 1-(2-methylpropyl)pyrrolidin-2-one Chemical compound CC(C)CN1CCCC1=O IVUYGANTXQVDDG-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 1
- BNXZHVUCNYMNOS-UHFFFAOYSA-N 1-butylpyrrolidin-2-one Chemical compound CCCCN1CCCC1=O BNXZHVUCNYMNOS-UHFFFAOYSA-N 0.000 description 1
- JTPNRXUCIXHOKM-UHFFFAOYSA-N 1-chloronaphthalene Chemical compound C1=CC=C2C(Cl)=CC=CC2=C1 JTPNRXUCIXHOKM-UHFFFAOYSA-N 0.000 description 1
- MXEOFTCIEDUHCX-UHFFFAOYSA-N 1-cyclohexylazepan-2-one Chemical compound O=C1CCCCCN1C1CCCCC1 MXEOFTCIEDUHCX-UHFFFAOYSA-N 0.000 description 1
- GWCFTYITFDWLAY-UHFFFAOYSA-N 1-ethylazepan-2-one Chemical compound CCN1CCCCCC1=O GWCFTYITFDWLAY-UHFFFAOYSA-N 0.000 description 1
- GPYDMVZCPRONLW-UHFFFAOYSA-N 1-iodo-4-(4-iodophenyl)benzene Chemical group C1=CC(I)=CC=C1C1=CC=C(I)C=C1 GPYDMVZCPRONLW-UHFFFAOYSA-N 0.000 description 1
- SCCCFNJTCDSLCY-UHFFFAOYSA-N 1-iodo-4-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=C(I)C=C1 SCCCFNJTCDSLCY-UHFFFAOYSA-N 0.000 description 1
- GGYVTHJIUNGKFZ-UHFFFAOYSA-N 1-methylpiperidin-2-one Chemical compound CN1CCCCC1=O GGYVTHJIUNGKFZ-UHFFFAOYSA-N 0.000 description 1
- GHELJWBGTIKZQW-UHFFFAOYSA-N 1-propan-2-ylpyrrolidin-2-one Chemical compound CC(C)N1CCCC1=O GHELJWBGTIKZQW-UHFFFAOYSA-N 0.000 description 1
- DCALJVULAGICIX-UHFFFAOYSA-N 1-propylpyrrolidin-2-one Chemical compound CCCN1CCCC1=O DCALJVULAGICIX-UHFFFAOYSA-N 0.000 description 1
- VALABLHQPAMOBO-UHFFFAOYSA-N 2,4-diiodo-1-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=C(I)C=C1I VALABLHQPAMOBO-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- MHKLKWCYGIBEQF-UHFFFAOYSA-N 4-(1,3-benzothiazol-2-ylsulfanyl)morpholine Chemical compound C1COCCN1SC1=NC2=CC=CC=C2S1 MHKLKWCYGIBEQF-UHFFFAOYSA-N 0.000 description 1
- HBCBCEPGGSBSMF-UHFFFAOYSA-N 4-(4-sulfanylanilino)benzenethiol Chemical compound Sc1ccc(Nc2ccc(S)cc2)cc1 HBCBCEPGGSBSMF-UHFFFAOYSA-N 0.000 description 1
- XRHGYUZYPHTUJZ-UHFFFAOYSA-N 4-chlorobenzoic acid Chemical compound OC(=O)C1=CC=C(Cl)C=C1 XRHGYUZYPHTUJZ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910013870 LiPF 6 Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- IHBCFWWEZXPPLG-UHFFFAOYSA-N [Ca].[Zn] Chemical compound [Ca].[Zn] IHBCFWWEZXPPLG-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- XVYHFPMIBWTTLH-UHFFFAOYSA-N [Zn].[Mg].[Ca] Chemical compound [Zn].[Mg].[Ca] XVYHFPMIBWTTLH-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- SHLNMHIRQGRGOL-UHFFFAOYSA-N barium zinc Chemical compound [Zn].[Ba] SHLNMHIRQGRGOL-UHFFFAOYSA-N 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- IBSGAWQJFSDRBJ-UHFFFAOYSA-M cesium sulfanide Chemical compound [SH-].[Cs+] IBSGAWQJFSDRBJ-UHFFFAOYSA-M 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 1
- QTNDMWXOEPGHBT-UHFFFAOYSA-N dicesium;sulfide Chemical compound [S-2].[Cs+].[Cs+] QTNDMWXOEPGHBT-UHFFFAOYSA-N 0.000 description 1
- HIPNYJBGYFRVAY-UHFFFAOYSA-N diiodomethylbenzene Chemical compound IC(I)C1=CC=CC=C1 HIPNYJBGYFRVAY-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- XNFVGEUMTFIVHQ-UHFFFAOYSA-N disodium;sulfide;hydrate Chemical compound O.[Na+].[Na+].[S-2] XNFVGEUMTFIVHQ-UHFFFAOYSA-N 0.000 description 1
- XWKIXFQOFAVHQI-UHFFFAOYSA-N disodium;sulfide;pentahydrate Chemical compound O.O.O.O.O.[Na+].[Na+].[S-2] XWKIXFQOFAVHQI-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 210000004177 elastic tissue Anatomy 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 125000002346 iodo group Chemical group I* 0.000 description 1
- SNHMUERNLJLMHN-UHFFFAOYSA-N iodobenzene Chemical compound IC1=CC=CC=C1 SNHMUERNLJLMHN-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- GLNWILHOFOBOFD-UHFFFAOYSA-N lithium sulfide Chemical compound [Li+].[Li+].[S-2] GLNWILHOFOBOFD-UHFFFAOYSA-N 0.000 description 1
- HXQGSILMFTUKHI-UHFFFAOYSA-M lithium;sulfanide Chemical compound S[Li] HXQGSILMFTUKHI-UHFFFAOYSA-M 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- IMNDHOCGZLYMRO-UHFFFAOYSA-N n,n-dimethylbenzamide Chemical compound CN(C)C(=O)C1=CC=CC=C1 IMNDHOCGZLYMRO-UHFFFAOYSA-N 0.000 description 1
- IFTIBNDWGNYRLS-UHFFFAOYSA-N n,n-dipropylacetamide Chemical compound CCCN(C(C)=O)CCC IFTIBNDWGNYRLS-UHFFFAOYSA-N 0.000 description 1
- DEQZTKGFXNUBJL-UHFFFAOYSA-N n-(1,3-benzothiazol-2-ylsulfanyl)cyclohexanamine Chemical compound C1CCCCC1NSC1=NC2=CC=CC=C2S1 DEQZTKGFXNUBJL-UHFFFAOYSA-N 0.000 description 1
- BUIMWOLDCCGZKZ-UHFFFAOYSA-N n-hydroxynitramide Chemical group ON[N+]([O-])=O BUIMWOLDCCGZKZ-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000011049 pearl Substances 0.000 description 1
- GAGJNISSZMXRHX-UHFFFAOYSA-N pentan-2-ylideneurea Chemical compound CCCC(C)=NC(N)=O GAGJNISSZMXRHX-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- ZOCLAPYLSUCOGI-UHFFFAOYSA-M potassium hydrosulfide Chemical compound [SH-].[K+] ZOCLAPYLSUCOGI-UHFFFAOYSA-M 0.000 description 1
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- LXOXXUIVMOYGST-UHFFFAOYSA-M rubidium(1+);sulfanide Chemical compound [SH-].[Rb+] LXOXXUIVMOYGST-UHFFFAOYSA-M 0.000 description 1
- AHKSSQDILPRNLA-UHFFFAOYSA-N rubidium(1+);sulfide Chemical compound [S-2].[Rb+].[Rb+] AHKSSQDILPRNLA-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- ZQOXGRIKWKXDIJ-UHFFFAOYSA-M sodium;1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F ZQOXGRIKWKXDIJ-UHFFFAOYSA-M 0.000 description 1
- XGPOMXSYOKFBHS-UHFFFAOYSA-M sodium;trifluoromethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(F)(F)F XGPOMXSYOKFBHS-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/0204—Polyarylenethioethers
-
- C—CHEMISTRY; METALLURGY
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Abstract
Description
發明領域Field of Invention
本發明係關於一種用於墊片的樹脂組成物及包含其之二次電池墊片。The present invention relates to a resin composition for a gasket and a secondary battery gasket including the same.
發明背景Background of the Invention
作為用於驅動可攜帶裝置的電源,廣泛使用密封的二次電池,諸如以高容量鹼性蓄電池為典型的水性電解質二次電池及以鋰離子二次電池為典型的非水性二次電池。As a power source for driving a portable device, sealed secondary batteries such as aqueous electrolyte secondary batteries typified by high-capacity alkaline storage batteries and non-aqueous secondary batteries typified by lithium ion secondary batteries are widely used.
一般而言,密封的二次電池包含:包含陽極板、陰極板的一組電極板,及安置於陽極板與陰極板之間的隔板;以及用於浸沒該組電極板的電解質溶液,該電解質溶液容納於設置有開口的電池外殼(外部主體)內,其中電池外殼的開口被密封主體密封。舉例而言,在此類密封的二次電池中,墊片設置於陽極板與陽極端子電連接之間或陰極板與陰極端子電連接之間的接觸點處,以防止該對端子之間發生短路或防止電解質滲漏。In general, a sealed secondary battery includes: a set of electrode plates including an anode plate, a cathode plate, and a separator disposed between the anode and cathode plates; and an electrolyte solution for immersing the set of electrode plates, the The electrolyte solution is contained in a battery case (external body) provided with an opening, wherein the opening of the battery case is sealed by the sealing body. For example, in such a sealed secondary battery, a gasket is provided at the point of contact between the electrical connection between the anode plate and the anode terminal or between the electrical connection between the cathode plate and the cathode terminal to prevent the occurrence of damage between the pair of terminals short circuit or prevent electrolyte leakage.
使用聚芳硫醚樹脂作為此類墊片之材料的技術已有報導(參見專利文獻1)。聚苯硫醚為當前以商業規模出售之唯一聚芳硫醚。其生產方法為溶液聚合法,其中使對二氯苯及硫化鈉作為原料在N-甲基吡咯啶酮溶劑中聚合(參見專利文獻1);及熔融聚合法,其中使二碘芳族化合物及硫化合物作為原料在高溫下聚合而不使用溶劑。A technique using a polyarylene sulfide resin as a material of such a gasket has been reported (see Patent Document 1). Polyphenylene sulfide is the only polyarylene sulfide currently sold on a commercial scale. The production methods thereof are a solution polymerization method in which p-dichlorobenzene and sodium sulfide are polymerized as raw materials in an N-methylpyrrolidone solvent (see Patent Document 1); and a melt polymerization method in which a diiodoaromatic compound and The sulfur compound as a raw material is polymerized at high temperature without using a solvent.
已知由溶液聚合法產生之聚苯硫醚樹脂的耐熱性、耐燃性及耐久性因使用溶劑及原料中使用氯而受到大量釋氣的不利影響。It is known that the heat resistance, flame resistance and durability of polyphenylene sulfide resins produced by solution polymerization are adversely affected by large outgassing due to the use of solvents and chlorine in the raw materials.
藉由熔融聚合法產生之聚苯硫醚樹脂產生改良的效應,使得其具有極佳的生產力及成本結構,原因在於其不使用溶劑,釋氣量小,且由於其不使用基於氯的原料而具有極佳的耐腐蝕性。然而,由於其因樹脂之端基呈非極性而與處理添加劑之反應性低,因此其難以修飾成具有所需特徵,導致其用途及應用被限制。另一限制在於,自用作原料之硫化合物衍生的二硫鍵在樹脂中充當弱結構,導致機械強度不足。The polyphenylene sulfide resin produced by the melt polymerization method produces an improved effect, making it an excellent productivity and cost structure because it does not use a solvent, has a small outgassing amount, and has the advantages of Excellent corrosion resistance. However, due to its low reactivity with processing additives due to the non-polarity of the end groups of the resin, it is difficult to modify to have desired characteristics, resulting in limited use and application. Another limitation is that disulfide bonds derived from sulfur compounds used as raw materials act as weak structures in the resin, resulting in insufficient mechanical strength.
用於二次電池的此類墊片基本上必需具有針對電解質的耐化學性及極佳氣密性。另外,墊片必需具有極佳的機械強度,使得其能夠維持氣密性,即使在二次電池受到機械衝擊或內部壓力升高(當加熱使二次電池內的溶劑氣化或分解而產生氣體時)的環境中亦能夠維持氣密性。Such gaskets for secondary batteries must basically have chemical resistance against electrolytes and excellent air tightness. In addition, the gasket must have excellent mechanical strength so that it can maintain airtightness even when the secondary battery is subjected to mechanical shock or the internal pressure is increased (gas is generated when the solvent in the secondary battery is vaporized or decomposed by heating Airtightness can also be maintained in an environment with .
同時,諸如墊片等成型製品可藉由使用模具將樹脂注塑成型來製造,該模具具有多個空穴以便同時製造多個成型製品。在此類注塑成型時,若成型材料在一些空穴中填充不足,導致成型缺陷,則其降低生產力。因此,用於墊片或其類似物的樹脂必需具有良好的模穴平衡。Meanwhile, a molded article such as a gasket can be manufactured by injection molding a resin using a mold having a plurality of cavities so as to simultaneously manufacture a plurality of molded articles. In such injection molding, if the molding material is insufficiently filled in some cavities, resulting in molding defects, it reduces productivity. Therefore, the resin used for the gasket or the like must have good cavity balance.
作為充分研究解決此問題的結果,本發明人已發現,若使用經增容劑後處理的聚芳硫醚樹脂製造墊片,則可改良模穴平衡,同時維持良好的氣密性及機械強度。另外,已發現,藉由溶液聚合製備的聚芳硫醚樹脂與藉由熔融聚合製備的聚芳硫醚樹脂摻混可製造具有良好模穴平衡、同時維持極佳氣密性及機械強度的墊片,藉此已完成本發明。 [先前技術文獻] [專利文獻] (專利文獻1)日本特許公開的專利公開案第Hei 8-321287號 (專利文獻2)美國專利第2,513,188號As a result of thorough research to solve this problem, the present inventors have found that if a gasket is manufactured using a polyarylene sulfide resin post-treated with a compatibilizer, the cavity balance can be improved while maintaining good airtightness and mechanical strength . In addition, it has been found that blending a polyarylene sulfide resin prepared by solution polymerization with a polyarylene sulfide resin prepared by melt polymerization can produce mats with good cavity balance while maintaining excellent air tightness and mechanical strength sheet, whereby the present invention has been completed. [Prior Art Literature] [Patent Literature] (Patent Document 1) Japanese Laid-Open Patent Publication No. Hei 8-321287 (Patent Document 2) US Patent No. 2,513,188
發明概要技術問題 Summary of Invention Technical Problem
本發明之一目標係提供一種用於墊片的新穎聚芳硫醚樹脂組成物及包含其之二次電池墊片。問題解決方案 An object of the present invention is to provide a novel polyarylene sulfide resin composition for a gasket and a secondary battery gasket including the same. problem solution
本發明提供一種用於墊片的樹脂組成物,其包含:經後處理的第一聚芳硫醚樹脂,其中衍生自增容劑的端基被引入由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂中;及至少一種選自由玻璃纖維、彈性體及熱穩定劑組成之群的添加劑。The present invention provides a resin composition for a gasket, comprising: a post-treated first polyarylene sulfide resin, wherein end groups derived from a compatibilizer are introduced into a diiodo aromatic compound, a first sulfur compound and a polymerization inhibitor in the melt-polymerized first polyarylene sulfide resin; and at least one additive selected from the group consisting of glass fibers, elastomers and thermal stabilizers.
另外,本發明提供一種用於墊片的樹脂組成物,其包含:由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂;由二鹵素芳族化合物與第二硫化合物發生溶液聚合的第二聚芳硫醚樹脂;以及至少一種選自由玻璃纖維、彈性體及熱穩定劑組成之群的添加劑,其中以第一聚芳硫醚樹脂及第二聚芳硫醚樹脂之總重量計,第二聚芳硫醚樹脂係以0.0001至30重量%之量使用。In addition, the present invention provides a resin composition for a gasket, comprising: a first polyarylene sulfide resin melt-polymerized from a diiodo aromatic compound, a first sulfur compound, and a polymerization inhibitor; A second polyarylene sulfide resin that undergoes solution polymerization with a second sulfur compound; and at least one additive selected from the group consisting of glass fibers, elastomers and thermal stabilizers, wherein the first polyarylene sulfide resin and the second poly The second polyarylene sulfide resin is used in an amount of 0.0001 to 30% by weight based on the total weight of the arylene sulfide resin.
另外,本發明提供一種用於墊片的樹脂組成物,其包含:經後處理之第一聚芳硫醚樹脂,其中衍生自增容劑的端基被引入由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂中;由二鹵素芳族化合物與第二硫化合物經歷溶液聚合的第二聚芳硫醚樹脂;以及至少一種選自由玻璃纖維、彈性體及熱穩定劑組成之群的添加劑,其中以第一聚芳硫醚樹脂與第二聚芳硫醚樹脂的總重量計,第二聚芳硫醚樹脂係以0.0001至30重量%的量使用。In addition, the present invention provides a resin composition for a gasket, comprising: a post-treated first polyarylene sulfide resin, wherein an end group derived from a compatibilizer is introduced into a diiodo aromatic compound, a first polyarylene sulfide resin In the first polyarylene sulfide resin melt-polymerized by a sulfur compound and a polymerization inhibitor; a second polyarylene sulfide resin subjected to solution polymerization by a dihalogen aromatic compound and a second sulfur compound; and at least one selected from the group consisting of glass fiber, elastic The additive of the group consisting of a body and a thermal stabilizer, wherein the second polyarylene sulfide resin is used in an amount of 0.0001 to 30% by weight based on the total weight of the first polyarylene sulfide resin and the second polyarylene sulfide resin .
另外,本發明提供一種用於二次電池的墊片,包含獲自用於墊片之樹脂組成物的成型製品。In addition, the present invention provides a gasket for a secondary battery comprising a molded article obtained from the resin composition for the gasket.
另外,本發明提供一種二次電池,其包含:具有開口的外部主體;用於密封外部主體之開口的密封主體;陽極板、陰極板,及設置於外部主體內的電解質;設置於陽極板與陰極板之間的隔板;與陽極板電連接的陽極端子;與陰極板電連接的陰極端子;以及與陽極端子或陰極端子接觸的二次電池墊片。本發明之有利效果 In addition, the present invention provides a secondary battery comprising: an outer body having an opening; a sealing body for sealing the opening of the outer body; an anode plate, a cathode plate, and an electrolyte provided in the outer body; A separator between the cathode plates; an anode terminal electrically connected to the anode plate; a cathode terminal electrically connected to the cathode plate; and a secondary battery gasket in contact with the anode terminal or the cathode terminal. Advantageous Effects of the Invention
本發明之用於墊片的聚芳硫醚樹脂組成物可降低釋氣量、具有極佳的氣密性、模穴平衡、拉伸強度、拉伸伸長率及/或結晶度。The polyarylene sulfide resin composition for gaskets of the present invention can reduce outgassing and have excellent air tightness, cavity balance, tensile strength, tensile elongation and/or crystallinity.
較佳實施例之詳細說明DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
在下文中,詳細描述本發明。本發明不限於下文給出之揭露內容,而是可將其潤飾成各種形式,只要不改變本發明之要旨。[ 經後處理之聚芳硫醚樹脂組成物 ] Hereinafter, the present invention is described in detail. The present invention is not limited to the disclosure given below, but can be modified into various forms as long as the gist of the present invention is not changed. [ Post-treated polyarylene sulfide resin composition ]
根據一個實施例,提供一種用於墊片的樹脂組成物(下文中稱為經後處理之第一聚芳硫醚樹脂組成物),其包含:經後處理之第一聚芳硫醚樹脂,其中衍生自增容劑的端基被引入由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂中;以及添加劑。According to one embodiment, there is provided a resin composition for a gasket (hereinafter referred to as a post-treated first polyarylene sulfide resin composition), comprising: a post-treated first polyarylene sulfide resin, wherein end groups derived from the compatibilizer are introduced into the first polyarylene sulfide resin melt polymerized from the diiodo aromatic compound, the first sulfur compound, and the polymerization inhibitor; and an additive.
根據另一個實施例,提供一種用於製備墊片樹脂組成物的方法,其包含:製備由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂;將第一聚芳硫醚樹脂與添加劑混合;以及使用增容劑對第一聚芳硫醚樹脂進行後處理。第一聚芳硫醚樹脂 According to another embodiment, there is provided a method for preparing a gasket resin composition, comprising: preparing a first polyarylene sulfide resin melt-polymerized from a diiodo aromatic compound, a first sulfur compound, and a polymerization inhibitor; mixing the first polyarylene sulfide resin with additives; and post-processing the first polyarylene sulfide resin with a compatibilizer. The first polyarylene sulfide resin
第一聚芳硫醚樹脂可藉由使包含二碘芳族化合物、第一硫化合物及聚合抑制劑之組成物熔融聚合來製備。The first polyarylene sulfide resin can be prepared by melt-polymerizing a composition including a diiodo aromatic compound, a first sulfur compound, and a polymerization inhibitor.
二碘芳族化合物係指具有芳族環及二個與其直接鍵結之碘原子的化合物。二碘芳族化合物可為選自由以下組成之群的至少一者:二碘苯、二碘甲苯、二碘二甲苯、二碘萘、二碘聯苯、二碘二苯甲酮、二碘二苯醚及二碘二苯碸,但其不限於此。Diiodoaromatic compounds refer to compounds having an aromatic ring and two iodine atoms directly bonded thereto. The diiodoaromatic compound may be at least one selected from the group consisting of diiodobenzene, diiodotoluene, diiodoxylene, diiodonaphthalene, diiodobiphenyl, diiodobenzophenone, diiododi Phenyl ether and diiododiphenyl, but not limited thereto.
二碘芳族化合物中之芳族環可經至少一個選自由以下組成之群的取代基取代:鹵基、苯基、羥基、硝基、胺基、具有1至6個碳原子之烷氧基、羧基、羧酸酯、芳基碸及芳基酮,不包括碘基。當二碘芳族化合物中之芳族環經取代基取代時,自樹脂結晶度及耐熱性之觀點來看,以具有未取代之芳族環的二碘芳族化合物計,具有經取代基取代之芳族環的二碘芳族化合物可為0.0001至5重量%或0.001至1重量%。儘管二碘芳族化合物中存在的二個碘基之取代位置不受特別限制,但二個取代位置可在分子中彼此遠離地定位且可為對位或4,4'-位。The aromatic ring in the diiodoaromatic compound may be substituted with at least one substituent selected from the group consisting of halo, phenyl, hydroxy, nitro, amine, alkoxy having 1 to 6 carbon atoms , carboxyl, carboxylate, aryl and aryl ketones, excluding iodo. When the aromatic ring in the diiodo aromatic compound is substituted with a substituent, from the viewpoint of resin crystallinity and heat resistance, the diiodo aromatic compound having an unsubstituted aromatic ring has a substituent substituted The diiodo aromatic compound of the aromatic ring may be 0.0001 to 5 wt % or 0.001 to 1 wt %. Although the substitution positions of the two iodine groups present in the diiodoaromatic compound are not particularly limited, the two substitution positions may be located away from each other in the molecule and may be the para-position or the 4,4'-position.
相對於1莫耳第一硫化合物,二碘芳族化合物可以0.5至2.0莫耳、0.55至1.9莫耳、0.6至1.8莫耳、0.65至1.7莫耳、0.7至1.6莫耳、0.75至1.5莫耳或0.8至1.4莫耳的量使用。二碘芳族化合物可為例如對二碘苯。The diiodo aromatic compound may be 0.5 to 2.0 mol, 0.55 to 1.9 mol, 0.6 to 1.8 mol, 0.65 to 1.7 mol, 0.7 to 1.6 mol, 0.75 to 1.5 mol relative to 1 mol of the first sulfur compound ear or in an amount of 0.8 to 1.4 moles. The diiodoaromatic compound can be, for example, p-diiodobenzene.
第一硫化合物可為元素硫。元素硫係指由硫原子構成之化合物。元素硫可為選自由S8 、S6 、S4 及S2 組成之群的至少一者,且具體而言,其可為包含市售之S8 及S6 的混合物,但其不限於此。元素硫之純度、形式及粒度不受特別限制。舉例而言,元素硫在室溫(23℃)下可呈固體顆粒或粉末形式。另外,元素硫可具有0.001至10 mm、0.01至5 mm或0.01至3 mm之粒徑,但其不限於此。The first sulfur compound may be elemental sulfur. Elemental sulfur refers to compounds composed of sulfur atoms. The elemental sulfur may be at least one selected from the group consisting of S 8 , S 6 , S 4 and S 2 , and specifically, it may be a mixture including commercially available S 8 and S 6 , but it is not limited thereto . The purity, form and particle size of elemental sulfur are not particularly limited. For example, elemental sulfur may be in solid particulate or powder form at room temperature (23°C). In addition, the elemental sulfur may have a particle size of 0.001 to 10 mm, 0.01 to 5 mm, or 0.01 to 3 mm, but it is not limited thereto.
聚合抑制劑可不受特別限制地使用,只要其為抑制或中止第一聚芳硫醚樹脂之聚合反應的化合物即可。聚合抑制劑可為選自由以下組成之群的至少一種官能基可引入聚芳硫醚樹脂之主鏈末端的化合物:-OR、-SR、-COOR、-NHR、-SO3 R、-NHCOR及其類似基團,其中R可各自獨立地為氫基、諸如鈉或鋰之金屬陽離子、鹵基、具有1至6個碳原子之烷基,或苯基。聚合抑制劑可包含該官能基且可藉由終止聚合反應或其類似方式形成該官能基。另外,聚合抑制劑可為不包含該官能基之化合物。具體而言,其可為至少一種選自由以下組成之群的化合物:二硫化二苯、單碘苯、硫酚、2,2'-二苯并噻唑基二硫化物、2-巰基苯并噻唑、N-環己基-2-苯并噻唑次磺醯胺、2-(嗎啉硫基)苯并噻唑及N,N'-二環己基-1,3-苯并噻唑-2-次磺醯胺。The polymerization inhibitor can be used without particular limitation as long as it is a compound that inhibits or stops the polymerization reaction of the first polyarylene sulfide resin. The polymerization inhibitor may be a compound whose at least one functional group selected from the group consisting of -OR, -SR, -COOR, -NHR, -SO3R , -NHCOR and Similar groups, wherein R can each independently be a hydrogen group, a metal cation such as sodium or lithium, a halo group, an alkyl group having 1 to 6 carbon atoms, or a phenyl group. The polymerization inhibitor may contain the functional group and the functional group may be formed by terminating the polymerization reaction or the like. In addition, the polymerization inhibitor may be a compound that does not contain the functional group. Specifically, it may be at least one compound selected from the group consisting of diphenyl disulfide, monoiodobenzene, thiophenol, 2,2'-dibenzothiazolyl disulfide, 2-mercaptobenzothiazole , N-cyclohexyl-2-benzothiazole sulfenamide, 2-(morpholinylthio) benzothiazole and N,N'-dicyclohexyl-1,3-benzothiazole-2-sulfenamide amine.
另外,聚合抑制劑可為由下式1至3表示之化合物中的一或多者,且具體而言,其可為由式1表示之化合物。 [式1] In addition, the polymerization inhibitor may be one or more of the compounds represented by the following formulae 1 to 3, and specifically, it may be the compound represented by the formula 1. [Formula 1]
X1 及X2 各自獨立地選自由以下組成之群:氫基、鹵基、具有1至3個碳原子之烷基、經取代或未經取代之苯基、-OA1 、-SA2 、-COOA3 、-NA4 A5 、-SO3 A6 及-NHCOA7 ,其中A1 至A7 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子、具有1至3個碳原子之經取代或未經取代的烷基,及經取代或未經取代之苯基,Z1 至Z4 各自獨立地選自由以下組成之群:氫基、具有1或2個碳原子之經取代或未經取代的烷基,及具有1或2個碳原子之經取代或未經取代的烯基,且m1 及m2 各自獨立地為1至3的整數。X 1 and X 2 are each independently selected from the group consisting of hydrogen, halo, alkyl having 1 to 3 carbon atoms, substituted or unsubstituted phenyl, -OA 1 , -SA 2 , -COOA 3 , -NA 4 A 5 , -SO 3 A 6 and -NHCOA 7 , wherein A 1 to A 7 are each independently selected from the group consisting of: hydrogen, sodium cation, lithium cation, having 1 to 3 A substituted or unsubstituted alkyl group of carbon atoms, and a substituted or unsubstituted phenyl group, Z 1 to Z 4 are each independently selected from the group consisting of: a hydrogen group, a group having 1 or 2 carbon atoms substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl having 1 or 2 carbon atoms, and m 1 and m 2 are each independently an integer from 1 to 3.
當Z1 及Z2 為具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其能夠彼此連接而形成苯環。另外,當Z3 及Z4 為具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其能夠彼此連接而形成苯環。When Z 1 and Z 2 are alkenyl groups having 2 carbon atoms and are bonded to two adjacent carbon atoms, they can be connected to each other to form a benzene ring. In addition, when Z 3 and Z 4 are alkenyl groups having 2 carbon atoms and are bonded to two adjacent carbon atoms, they can be connected to each other to form a benzene ring.
當m1 或m2 為2或更大時,鍵結至一個芳族環的二個或更多個X1 或X2 可彼此相同或不同。另外,Z1 與Z3 可彼此相同或不同,且Z2 與Z4 可彼此相同或不同。When m 1 or m 2 is 2 or more, two or more X 1 or X 2 bonded to one aromatic ring may be the same or different from each other. Additionally, Z 1 and Z 3 may be the same or different from each other, and Z 2 and Z 4 may be the same or different from each other.
X1 或X2 中之經取代的苯基可具有-SH或-S-S-Ph的取代基。另外,A1 至A7 中具有1至3個碳原子之經取代烷基及經取代苯基可各自獨立地具有含有1或2個碳原子之烷基或苯基的取代基。The substituted phenyl group in X 1 or X 2 may have a substituent of -SH or -SS-Ph. In addition, the substituted alkyl group and the substituted phenyl group having 1 to 3 carbon atoms in A 1 to A 7 may each independently have a substituent of an alkyl group having 1 or 2 carbon atoms or a phenyl group.
Z1 及Z2 可鍵結至二個相鄰碳原子,且Z3 及Z4 可鍵結至二個相鄰碳原子。Z 1 and Z 2 can be bonded to two adjacent carbon atoms, and Z 3 and Z 4 can be bonded to two adjacent carbon atoms.
另外,Z1 至Z4 中之至少一者或二者或更多者可不為氫基。另外,X1 及X2 中之至少一者可選自由以下組成之群:-OA1 、-SA2 、-COOA3 、-NA4 A5 、-SO3 A6 及-NHCOA7 。另外,舉例而言,當X1 與X2 均為氫基時,Z1 與Z2 之組合或Z3 與Z4 之組合中的至少一者可彼此連接而形成苯環。 [式2] In addition, at least one or two or more of Z 1 to Z 4 may not be a hydrogen group. Additionally, at least one of X 1 and X 2 may be selected from the group consisting of -OA 1 , -SA 2 , -COOA 3 , -NA 4 A 5 , -SO 3 A 6 and -NHCOA 7 . In addition, for example, when X 1 and X 2 are both hydrogen groups, at least one of the combination of Z 1 and Z 2 or the combination of Z 3 and Z 4 may be connected to each other to form a benzene ring. [Formula 2]
X3 至X6 各自獨立地選自由以下組成之群:氫基、鹵基、具有1至5個碳原子之烷基、-OA8 、-SA9 、-COOA10 、-NA11 A12 、-SO3 A13 及-NHCOA14 ,其中A8 至A14 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子及具有1至3個碳原子之烷基,且R1 至R4 各自獨立地為具有1至5個碳原子之伸烷基或烷氧基。X 3 to X 6 are each independently selected from the group consisting of a hydrogen group, a halogen group, an alkyl group having 1 to 5 carbon atoms, -OA 8 , -SA 9 , -COOA 10 , -NA 11 A 12 , -SO 3 A 13 and -NHCOA 14 , wherein A 8 to A 14 are each independently selected from the group consisting of hydrogen radicals, sodium cations, lithium cations, and alkyl groups having 1 to 3 carbon atoms, and R 1 to R 4 is each independently an alkylene group or an alkoxy group having 1 to 5 carbon atoms.
X3 至X6 中之至少一者可選自由以下組成之群:-OA8 、-SA9 、-COOA10 、-NA11 A12 、-SO3 A13 及-NHCOA14 。另外,X3 至X6 中之至少一者可為-SA9 ,其中A9 為氫基。 [式3] At least one of X 3 to X 6 may be selected from the group consisting of -OA 8 , -SA 9 , -COOA 10 , -NA 11 A 12 , -SO 3 A 13 and -NHCOA 14 . In addition, at least one of X 3 to X 6 may be -SA 9 , wherein A 9 is a hydrogen group. [Formula 3]
X7 至X12 各自獨立地選自由以下組成之群:氫基、鹵基、具有1至5個碳原子之烷基、-OA15 、-SA16 、-COOA17 、-NA18 A19 、-SO3 A20 及-NHCOA21 ,其中A15 至A21 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子及具有1至5個碳原子之烷基,且R5 及R6 各自獨立地為具有1至5個碳原子之伸烷基。X 7 to X 12 are each independently selected from the group consisting of hydrogen, halogen, alkyl having 1 to 5 carbon atoms, -OA 15 , -SA 16 , -COOA 17 , -NA 18 A 19 , -SO 3 A 20 and -NHCOA 21 , wherein A 15 to A 21 are each independently selected from the group consisting of a hydrogen group, a sodium cation, a lithium cation, and an alkyl group having 1 to 5 carbon atoms, and R 5 and R 6 is each independently an alkylene group having 1 to 5 carbon atoms.
另外,相對於1莫耳第一硫化合物,聚合抑制劑可以0.0001至0.1莫耳、0.0002至0.08莫耳、0.0005至0.05莫耳或0.001至0.05莫耳之量使用。In addition, the polymerization inhibitor may be used in an amount of 0.0001 to 0.1 mol, 0.0002 to 0.08 mol, 0.0005 to 0.05 mol, or 0.001 to 0.05 mol relative to 1 mol of the first sulfur compound.
同時,熔融聚合中可另外使用催化劑。催化劑可為例如基於硝基苯之催化劑。具體而言,其可為選自由1,3-二碘-4-硝基苯及1-碘-4-硝基苯組成之群的一或多者,但其不限於此。當使用催化劑時,相對於1莫耳的第一硫化合物,其可以0.0001至0.1莫耳、0.0002至0.05莫耳或0.0005至0.01莫耳之量使用。Meanwhile, a catalyst may be additionally used in the melt polymerization. The catalyst may be, for example, a nitrobenzene-based catalyst. Specifically, it may be one or more selected from the group consisting of 1,3-diiodo-4-nitrobenzene and 1-iodo-4-nitrobenzene, but it is not limited thereto. When the catalyst is used, it may be used in an amount of 0.0001 to 0.1 mol, 0.0002 to 0.05 mol, or 0.0005 to 0.01 mol relative to 1 mol of the first sulfur compound.
可進行熔融聚合反應,只要條件能夠起始包含二碘芳族化合物及第一硫化合物之組成物的聚合反應即可。舉例而言,熔融聚合可在約180至400℃、180至350℃或180至300℃之溫度下進行,且可在約0.001至500托、0.001至450托或0.001至400托之壓力下進行。更具體而言,熔融聚合可在高溫及減壓條件下進行,在此情況下,聚合反應可進行約0.1至30小時,同時溫度上升且壓力下降(自約180至250℃之溫度及約50至450托之壓力的起始反應條件直至約270至350℃之溫度及約0.001至20托之壓力的最終反應條件)。更具體而言,熔融聚合可在約280至300℃之溫度及約0.1至2托之壓力的最終反應條件下進行。The melt polymerization can be carried out as long as the conditions are capable of initiating the polymerization of the composition comprising the diiodo aromatic compound and the first sulfur compound. For example, melt polymerization can be carried out at a temperature of about 180 to 400°C, 180 to 350°C, or 180 to 300°C, and can be carried out at a pressure of about 0.001 to 500 Torr, 0.001 to 450 Torr, or 0.001 to 400 Torr . More specifically, the melt polymerization can be carried out under conditions of high temperature and reduced pressure, in which case, the polymerization reaction can be carried out for about 0.1 to 30 hours while the temperature is increased and the pressure is decreased (from a temperature of about 180 to 250° C. and a temperature of about 50° C.). Initial reaction conditions to a pressure of 450 Torr up to final reaction conditions of a temperature of about 270 to 350°C and a pressure of about 0.001 to 20 Torr). More specifically, the melt polymerization can be carried out under final reaction conditions of a temperature of about 280 to 300°C and a pressure of about 0.1 to 2 Torr.
同時,儘管二碘芳族化合物、第一硫化合物及聚合抑制劑之混合順序不受特別限制,但可將二碘芳族化合物、第一硫化合物及聚合抑制劑同時混合,或可將聚合抑制劑添加至包含二碘芳族化合物及第一硫化合物之混合物中,藉此製備用於熔融聚合之組成物。Meanwhile, although the mixing order of the diiodo aromatic compound, the first sulfur compound, and the polymerization inhibitor is not particularly limited, the diiodo aromatic compound, the first sulfur compound, and the polymerization inhibitor may be mixed at the same time, or the polymerization may be inhibited The agent is added to the mixture comprising the diiodo aromatic compound and the first sulfur compound, thereby preparing a composition for melt polymerization.
在聚合抑制劑與二碘芳族化合物及第一硫化合物不同時混合的情況下,添加聚合抑制劑之時序不受特別限制。其可考慮目標聚芳硫醚之最終分子量來確定。舉例而言,其可在用於初始反應之二碘芳族化合物的約0至30重量%、30至70重量%或70至100重量%已被反應消耗時添加。或者,聚合抑制劑可在聚合反應產物之分子量達到某一水準時添加。舉例而言,當聚合反應產物之分子量達到目標聚芳硫醚之最終分子量的10%或更高、20%或更高、30%或更高、40%或更高、50%或更高、60%或更高、70%或更高、80%或更高、或90%或更高、或90%或更低、80%或更低、70%或更低、60%或更低、50%或更低、40%或更低、30%或更低、20%或更低、或10%或更低時,可添加聚合抑制劑。聚合反應產物之分子量可例如藉由凝膠滲透層析法測定。In the case where the polymerization inhibitor is not mixed with the diiodo aromatic compound and the first sulfur compound at the same time, the timing of adding the polymerization inhibitor is not particularly limited. It can be determined in consideration of the final molecular weight of the target polyarylene sulfide. For example, it can be added when about 0 to 30%, 30 to 70%, or 70 to 100% by weight of the diiodoaromatic compound used in the initial reaction has been consumed by the reaction. Alternatively, the polymerization inhibitor can be added when the molecular weight of the polymerization product reaches a certain level. For example, when the molecular weight of the polymerization reaction product reaches 10% or more, 20% or more, 30% or more, 40% or more, 50% or more of the final molecular weight of the target polyarylene sulfide, 60% or higher, 70% or higher, 80% or higher, or 90% or higher, or 90% or lower, 80% or lower, 70% or lower, 60% or lower, At 50% or less, 40% or less, 30% or less, 20% or less, or 10% or less, a polymerization inhibitor can be added. The molecular weight of the polymerization product can be determined, for example, by gel permeation chromatography.
另外,在添加聚合抑制劑之前,可將包含二碘芳族化合物及第一硫化合物的組成物熔融混合。在此種情況下,亦可在熔融混合步驟中將催化劑添加至組成物中。熔融混合不受特別限制,只要組成物可完全熔融混合即可。舉例而言,其可在例如約130至200℃或約160至190℃之溫度下進行。若進行此類熔融混合,則可更容易地進行後續熔融聚合。經增容劑後處理之第一聚芳硫醚樹脂 In addition, before adding the polymerization inhibitor, the composition containing the diiodo aromatic compound and the first sulfur compound may be melt-mixed. In this case, the catalyst may also be added to the composition in the melt-mixing step. Melt-mixing is not particularly limited as long as the composition can be completely melt-mixed. For example, it can be carried out at a temperature of, for example, about 130 to 200°C or about 160 to 190°C. If such melt mixing is carried out, subsequent melt polymerization can be carried out more easily. The first polyarylene sulfide resin post-treated with a compatibilizer
經後處理之第一聚芳硫醚樹脂可藉由用增容劑對第一聚芳硫醚樹脂進行後處理來製備。The post-treated first polyarylene sulfide resin can be prepared by post-treating the first polyarylene sulfide resin with a compatibilizer.
另外,經後處理之第一聚芳硫醚樹脂可包含第一聚芳硫醚樹脂及衍生自增容劑之端基。Additionally, the post-treated first polyarylene sulfide resin may include the first polyarylene sulfide resin and end groups derived from a compatibilizer.
第一聚芳硫醚樹脂如上文所述。The first polyarylene sulfide resin is as described above.
用於對第一聚芳硫醚樹脂進行後處理之增容劑可為含有至少一種選自由以下組成之群之官能基的化合物:羧基、羧酸酯基、羥基、胺基、醯胺基、矽烷基、硫醚基及磺酸酯基。具體而言,增容劑可為由下式4至6中之一者表示的一或多種化合物。 [式4] The compatibilizer used for post-treatment of the first polyarylene sulfide resin may be a compound containing at least one functional group selected from the group consisting of: carboxyl group, carboxylate group, hydroxyl group, amine group, amide group, Silyl group, thioether group and sulfonate group. Specifically, the compatibilizer may be one or more compounds represented by one of Formulas 4 to 6 below. [Formula 4]
Y1 及Y2 各自獨立地選自由以下組成之群:氫基、鹵基、-OB1 、-SB2 、-COOB3 、-NB4 B5 、-SO3 B6 及-NHCOB7 ,其中B1 至B7 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子、具有1至3個碳原子之經取代或未經取代的烷基,及經取代或未經取代之苯基,Z1' 至Z4' 各自獨立地選自由以下組成之群:氫基、具有1或2個碳原子之經取代或未經取代的烷基,及具有1或2個碳原子之經取代或未經取代的烯基,且p1 及p2 各自獨立地為1至3的整數,其限制條件為Y1 及Y2 中之至少一者選自由以下組成之群:-OB1 、-SB2 、-COOB3 、-NB4 B5 、-SO3 B6 及-NHCOB7 。Y 1 and Y 2 are each independently selected from the group consisting of hydrogen, halo, -OB 1 , -SB 2 , -COOB 3 , -NB 4 B 5 , -SO 3 B 6 and -NHCOB 7 , wherein B 1 to B 7 are each independently selected from the group consisting of hydrogen radicals, sodium cations, lithium cations, substituted or unsubstituted alkyl groups having 1 to 3 carbon atoms, and substituted or unsubstituted Phenyl, Z 1' to Z 4' are each independently selected from the group consisting of hydrogen, substituted or unsubstituted alkyl groups having 1 or 2 carbon atoms, and those having 1 or 2 carbon atoms substituted or unsubstituted alkenyl, and p 1 and p 2 are each independently an integer from 1 to 3, with the proviso that at least one of Y 1 and Y 2 is selected from the group consisting of: -OB 1 , -SB 2 , -COOB 3 , -NB 4 B 5 , -SO 3 B 6 and -NHCOB 7 .
當Z1' 及Z2' 為具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其能夠彼此連接而形成苯環。當Z3' 及Z4' 為具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其能夠彼此連接而形成苯環。When Z 1' and Z 2' are alkenyl groups having 2 carbon atoms and are bonded to two adjacent carbon atoms, they can be connected to each other to form a benzene ring. When Z 3' and Z 4' are alkenyl groups having 2 carbon atoms and are bonded to two adjacent carbon atoms, they can be connected to each other to form a benzene ring.
當p1 或p2 為2或更大時,鍵結至一個芳族環的二個或更多個Y1 或Y2 可彼此相同或不同。另外,Z1' 與Z3' 可彼此相同或不同,且Z2' 與Z4' 可彼此相同或不同。When p 1 or p 2 is 2 or more, two or more Y 1 or Y 2 bonded to one aromatic ring may be the same or different from each other. In addition, Z 1' and Z 3' may be the same or different from each other, and Z 2' and Z 4' may be the same or different from each other.
Z1' 至Z4' 中之具有1或2個碳原子的經取代之烷基或具有1或2個碳原子的經取代之烯基可各自獨立地具有含有1或2個碳原子之烷基或苯基的取代基。A substituted alkyl group having 1 or 2 carbon atoms or a substituted alkenyl group having 1 or 2 carbon atoms among Z 1' to Z 4' may each independently have an alkane having 1 or 2 carbon atoms group or phenyl substituent.
另外,B1 至B7 中具有1至3個碳原子之經取代烷基及經取代苯基可各自獨立地具有含有1或2個碳原子之烷基或苯基的取代基。In addition, the substituted alkyl group and the substituted phenyl group having 1 to 3 carbon atoms in B 1 to B 7 may each independently have a substituent of an alkyl group having 1 or 2 carbon atoms or a phenyl group.
Z1' 及Z2' 可鍵結至二個相鄰碳原子,且Z3' 及Z4' 可鍵結至二個相鄰碳原子。另外,Z1' 至Z4' 中之至少一者或二者或更多者可不為氫基。 [式5] Z 1' and Z 2' can be bonded to two adjacent carbon atoms, and Z 3' and Z 4' can be bonded to two adjacent carbon atoms. In addition, at least one or two or more of Z 1' to Z 4' may not be a hydrogen group. [Formula 5]
Y3 至Y6 各自獨立地選自由以下組成之群:氫基、鹵基、-OB8 、-SB9 、-COOB10 、-NB11 B12 、-SO3 B13 及-NHCOB14 ,其中B8 至B14 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子及具有1至3個碳原子之烷基,且R1' 至R4' 各自獨立地為具有1至5個碳原子之伸烷基,其限制條件為Y3 及Y6 中之至少一者選自由以下組成之群:-OB8 、-SB9 、-COOB10 、-NB11 B12 、-SO3 B13 及-NHCOB14 。在此,Y3 至Y6 中之至少一者可為-SB9 ,其中B9 為氫基。 [式6] Y 3 to Y 6 are each independently selected from the group consisting of hydrogen, halo, -OB 8 , -SB 9 , -COOB 10 , -NB 11 B 12 , -SO 3 B 13 and -NHCOB 14 , wherein B 8 to B 14 are each independently selected from the group consisting of a hydrogen group, a sodium cation, a lithium cation, and an alkyl group having 1 to 3 carbon atoms, and R 1' to R 4' are each independently a group having 1 to 3 carbon atoms. An alkylene group of 5 carbon atoms, with the limitation that at least one of Y 3 and Y 6 is selected from the group consisting of: -OB 8 , -SB 9 , -COOB 10 , -NB 11 B 12 , -SO 3 B 13 and -NHCOB 14 . Here, at least one of Y 3 to Y 6 may be -SB 9 , wherein B 9 is a hydrogen group. [Formula 6]
Y7 至Y12 各自獨立地選自由以下組成之群:氫基、鹵基、OB15 、-SB16 、-COOB17 、-NB18 B19 、-SO3 B20 及-NHCOB21 ,其中B15 至B21 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子及具有1至5個碳原子之烷基,且R5' 及R6' 各自獨立地為具有1至5個碳原子之伸烷基。Y 7 to Y 12 are each independently selected from the group consisting of hydrogen, halo, OB 15 , -SB 16 , -COOB 17 , -NB 18 B 19 , -SO 3 B 20 and -NHCOB 21 , wherein B 15 to B 21 are each independently selected from the group consisting of a hydrogen group, a sodium cation, a lithium cation, and an alkyl group having 1 to 5 carbon atoms, and R 5' and R 6' are each independently a group having 1 to 5 An alkyl group with a carbon atom.
另外,具體而言,增容劑可為選自由以下組成之群的至少一者:2,2'-二硫雙二苯甲酸、4,4'-胺基苯基二硫化物、雙(3-羥苯基)二硫化物及雙(4-羥苯基)二硫化物,但其不特別限於此。In addition, specifically, the compatibilizer may be at least one selected from the group consisting of: 2,2'-dithiobisdibenzoic acid, 4,4'-aminophenyl disulfide, bis(3 -hydroxyphenyl) disulfide and bis(4-hydroxyphenyl) disulfide, but they are not particularly limited thereto.
增容劑可使得可位於第一聚芳硫醚樹脂之末端處的碘原子發生取代反應,或其可在增容劑的作用而不引起反應。若第一聚芳硫醚樹脂用增容劑加以後處理,則第一聚芳硫醚樹脂之主鏈及/或末端的氛圍可自疏水性變為親水性。因此,可增強與具有親水性官能基及/或反應基之其他樹脂、無機填料及其類似物的相容性。結果,有可能增強使用其之最終產品的機械強度,且顯著減少因加熱而產生之釋氣量。The compatibilizer may cause a substitution reaction of the iodine atom that may be located at the terminal of the first polyarylene sulfide resin, or it may not cause a reaction under the action of the compatibilizer. If the first polyarylene sulfide resin is post-treated with a compatibilizer, the atmosphere of the main chain and/or the end of the first polyarylene sulfide resin can be changed from hydrophobicity to hydrophilicity. Therefore, the compatibility with other resins having hydrophilic functional groups and/or reactive groups, inorganic fillers, and the like can be enhanced. As a result, it is possible to enhance the mechanical strength of the final product using it, and to significantly reduce the amount of outgassing due to heating.
增容劑可與第一聚芳硫醚樹脂反應以將端基賦予第一聚芳硫醚樹脂。因此,經後處理之第一聚芳硫醚樹脂可具有衍生自增容劑的端基。The compatibilizer can react with the first polyarylene sulfide resin to impart end groups to the first polyarylene sulfide resin. Therefore, the post-treated first polyarylene sulfide resin may have end groups derived from the compatibilizer.
衍生自增容劑的端基可指該增容劑所具有的官能基。具體而言,由於增容劑可為含有諸如羧基、羧酸酯基、羥基、胺基、醯胺基、矽烷基、硫醚基及磺酸酯基等官能基的化合物,因此,衍生自增容劑之端基亦可為諸如羧基、羧酸酯基、羥基、胺基、醯胺基、矽烷基、硫醚基及磺酸酯基等官能基。A terminal group derived from a compatibilizer may refer to a functional group possessed by the compatibilizer. Specifically, since the compatibilizer can be a compound containing functional groups such as carboxyl group, carboxylate group, hydroxyl group, amine group, amide group, silyl group, thioether group and sulfonate group, etc. The end groups of the compatibilizer can also be functional groups such as carboxyl groups, carboxylate groups, hydroxyl groups, amine groups, amide groups, silyl groups, thioether groups and sulfonate groups.
更具體而言,衍生自增容劑的端基可具有由下式7至9中之一者表示的結構。 [式7] [式8] [式9] More specifically, the end group derived from the compatibilizer may have a structure represented by one of Formulas 7 to 9 below. [Formula 7] [Formula 8] [Formula 9]
在上述式中,Z1' 、Z2' 、Y1 、Y3 至Y5 、Y7 至Y9 、R1' 至R5' 及p1 如上文所述。In the above formula, Z 1' , Z 2' , Y 1 , Y 3 to Y 5 , Y 7 to Y 9 , R 1' to R 5' and p 1 are as described above.
以第一聚芳硫醚樹脂之總重量計,增容劑可以0.001至10重量%、0.001至5重量%、0.01至3重量%、或0.1至2重量%的量使用。若第一聚芳硫醚樹脂在其聚合之後用增容劑加以後處理,則增容劑的反應效率與在樹脂聚合期間添加相同化合物作為聚合抑制劑的情況相比明顯極佳,從而可使最終樹脂中保留的官能基含量最大化。另外,可達成經由增容劑引入最終樹脂中之官能基的目標含量,同時減少增容劑的使用量。若添加相同化合物作為聚合抑制劑,則反應效率低,原因在於其可因聚合反應所必需的高溫環境而分解或在反應期間排出。此外,在第一聚芳硫醚樹脂聚合期間添加增容劑時,可使增容劑可能形成的副產物減至最少。因此,若第一聚芳硫醚樹脂用增容劑加以後處理,則可減少可能引起釋氣之聚合抑制劑/增容劑的量以及使副產物減至最少,藉此減少釋氣量且同時增強相容性,從而使諸如拉伸強度、拉伸伸長率及氣密性等物理特性改良。另外,由於如上文所述經增容劑後處理之第一聚芳硫醚樹脂的釋氣量減少,因此可改良注塑製程之可加工性,得到極佳的模穴平衡以及產生使生產週期縮短的作用。The compatibilizer may be used in an amount of 0.001 to 10% by weight, 0.001 to 5% by weight, 0.01 to 3% by weight, or 0.1 to 2% by weight, based on the total weight of the first polyarylene sulfide resin. If the first polyarylene sulfide resin is post-treated with a compatibilizer after its polymerization, the reaction efficiency of the compatibilizer is remarkably excellent compared to the case where the same compound is added as a polymerization inhibitor during the polymerization of the resin, so that the The functional group content retained in the final resin is maximized. In addition, the target content of functional groups introduced into the final resin via the compatibilizer can be achieved while reducing the amount of compatibilizer used. If the same compound is added as a polymerization inhibitor, the reaction efficiency is low because it may be decomposed or discharged during the reaction due to the high temperature environment necessary for the polymerization reaction. In addition, when the compatibilizer is added during the polymerization of the first polyarylene sulfide resin, the possible formation of by-products of the compatibilizer can be minimized. Therefore, if the first polyarylene sulfide resin is post-treated with a compatibilizer, it is possible to reduce the amount of polymerization inhibitor/compatibilizer that may cause outgassing and minimize by-products, thereby reducing the outgassing amount and at the same time Enhanced compatibility, resulting in improved physical properties such as tensile strength, tensile elongation and air tightness. In addition, since the outgassing of the first polyarylene sulfide resin post-treated with the compatibilizer as described above is reduced, the processability of the injection molding process can be improved, excellent cavity balance can be obtained, and the production cycle can be shortened. effect.
使用增容劑進行的後處理可藉由在高溫下混合來進行。高溫混合可在290至330℃之溫度下進行。另外,其可在非氧化氛圍中進行以達成高聚合度,同時防止氧化交聯反應。在非氧化氛圍中,氣態氧濃度可小於5體積%或小於2體積%。更具體而言,基本上不含氣態氧。若經由高溫混合進行後處理,則可能存在於第一聚芳硫醚樹脂之一些末端處的碘被充分移除,且結晶度變得極佳,從而減小收縮率。從而,使用經後處理之第一聚芳硫醚製成之最終製品的尺寸穩定性可增強。The post-treatment with the compatibilizer can be carried out by mixing at high temperature. High temperature mixing can be carried out at a temperature of 290 to 330°C. Additionally, it can be performed in a non-oxidative atmosphere to achieve a high degree of polymerization while preventing oxidative crosslinking reactions. In a non-oxidizing atmosphere, the gaseous oxygen concentration may be less than 5% by volume or less than 2% by volume. More specifically, it is substantially free of gaseous oxygen. If post-processing is performed through high temperature mixing, iodine that may be present at some ends of the first polyarylene sulfide resin is sufficiently removed, and the crystallinity becomes excellent, thereby reducing shrinkage. Thus, the dimensional stability of the final article made using the post-treated first polyarylene sulfide can be enhanced.
另外,高溫混合可在能夠加熱及攪拌之反應器中進行。舉例而言,反應器可為各種材料(諸如SUS)之反應器。高溫混合可在雙螺桿擠出機中進行,且雙螺桿擠出機之長度直徑比(L/D)可為約30至50。舉例而言,第一聚芳硫醚樹脂可經由雙螺桿擠出機之主進料器進料,且其他聚合物材料,諸如熱塑性樹脂或熱塑彈性體、填料或其類似物可經由位於擠出機側面的側進料器分別添加。側進料器之位置相對於出口可為擠出機之整個機筒的約1/3至1/2,由此可防止填料被擠出機中之擠出螺桿的旋轉及摩擦破壞。另外,在將第一聚芳硫醚樹脂進給至主進料器之前,可將其與少量添加之其他添加劑混合。Alternatively, high temperature mixing can be carried out in a reactor capable of heating and stirring. For example, the reactor may be a reactor of various materials such as SUS. The high temperature mixing can be performed in a twin-screw extruder, and the length-to-diameter ratio (L/D) of the twin-screw extruder can be about 30 to 50. For example, the first polyarylene sulfide resin can be fed through the main feeder of a twin-screw extruder, and other polymeric materials, such as thermoplastic resins or thermoplastic elastomers, fillers, or the like, can be fed through a main feeder located in the extruder. The side feeders on the side of the exit machine are added separately. The position of the side feeder relative to the outlet can be about 1/3 to 1/2 of the entire barrel of the extruder, thereby preventing the filler from being damaged by the rotation and friction of the extrusion screw in the extruder. In addition, before feeding the first polyarylene sulfide resin to the main feeder, it may be mixed with other additives added in small amounts.
同時,經後處理之第一聚芳硫醚樹脂主要由芳硫醚單元構成,然而其可在其主鏈中通常包含根據由[-SS-]表示之二硫鍵且衍生自原料中之第一硫化合物的單元。包含根據二硫鍵之單元的最終聚芳硫醚樹脂結構式可具有Eastman (美國專利第4,768,000號)所提出之共聚物形式。共聚物之結構式可由下式1表示。 [式1] -(Ar-S)x -(Ar-S-S)y -Meanwhile, the post-treated first polyarylene sulfide resin is mainly composed of arylene sulfide units, but it may generally contain in its main chain a disulfide bond represented by [-SS-] and is derived from the first polyarylene sulfide in the raw material. A unit of a sulfur compound. The final polyarylene sulfide resin formula containing units based on disulfide bonds may have the copolymer form proposed by Eastman (US Pat. No. 4,768,000). The structural formula of the copolymer can be represented by the following formula 1. [Formula 1] -(Ar-S) x -(Ar-SS) y -
在經後處理之第一聚芳硫醚樹脂中,當式1中之對應於芳硫醚結構之x與對應於共聚硫醚結構之y的總和為1時,x之含量可為0.900至0.999、0.950至0.999或0.990至0.999。另外,經後處理之第一聚芳硫醚樹脂中的二硫鍵分率可為0.001至10.0重量%,具體而言,0.1重量%或更高、0.3重量%或更高、0.5重量%或更高或0.7重量%或更高,且其可為10.0重量%或更低、5.0重量%或更低、2.0重量%或更低、1.8重量%或更低、1.6重量%或更低、1.5重量%或更低、1.4重量%或更低、1.3重量%或更低、1.2重量%或更低、1.1重量%或更低,或1重量%或更低。在本說明書中,二硫鍵分率(重量%)可定義為聚芳硫醚中之理論硫含量與元素分析所量測之硫含量之間的差值相對於聚芳硫醚中之理論硫含量的分率。 [方程式1] 二硫鍵分率(重量%) = {(藉由元素分析偵測之硫總重量) - (聚芳硫醚中之理論硫重量)} / (聚芳硫醚中之理論硫重量)In the post-treated first polyarylene sulfide resin, when the sum of x corresponding to the arylene sulfide structure and y corresponding to the copolymerized sulfide structure in Formula 1 is 1, the content of x may be 0.900 to 0.999 , 0.950 to 0.999 or 0.990 to 0.999. In addition, the disulfide bond fraction in the post-treated first polyarylene sulfide resin may be 0.001 to 10.0 wt %, specifically, 0.1 wt % or higher, 0.3 wt % or higher, 0.5 wt % or higher or 0.7 wt% or higher, and it may be 10.0 wt% or lower, 5.0 wt% or lower, 2.0 wt% or lower, 1.8 wt% or lower, 1.6 wt% or lower, 1.5 wt% wt % or less, 1.4 wt % or less, 1.3 wt % or less, 1.2 wt % or less, 1.1 wt % or less, or 1 wt % or less. In this specification, the disulfide bond fraction (% by weight) can be defined as the difference between the theoretical sulfur content in the polyarylene sulfide and the sulfur content measured by elemental analysis relative to the theoretical sulfur in the polyarylene sulfide Content fraction. [Equation 1] Disulfide bond fraction (wt%) = {(total sulfur weight detected by elemental analysis) - (theoretical sulfur weight in polyarylene sulfide)} / (theoretical sulfur weight in polyarylene sulfide)
經後處理的第一聚芳硫醚樹脂可包含衍生自二碘芳族化合物的碘。以經後處理之第一聚芳硫醚樹脂的總重量計,碘含量可為100至10,000 ppm,具體而言,250 ppm或更多、500 ppm或更多、750 ppm或更多、或900 ppm或更多,且其可為9,000 ppm或更少、8,000 ppm或更少、7,000 ppm或更少、6,000 ppm或更少、5,000 ppm或更少、4,000 ppm或更少、3,000 ppm或更少、2,500 ppm或更少、2,250 ppm或更少、2,200 ppm或更少、2,100 ppm或更少、2,000 ppm或更少、1,900 ppm或更少、或1,800 ppm或更少、1,700或更少、1,600 ppm或更少,或1,500 ppm或更少。The post-treated first polyarylene sulfide resin may contain iodine derived from a diiodo aromatic compound. Based on the total weight of the post-treated first polyarylene sulfide resin, the iodine content may be 100 to 10,000 ppm, specifically, 250 ppm or more, 500 ppm or more, 750 ppm or more, or 900 ppm ppm or more, and it can be 9,000 ppm or less, 8,000 ppm or less, 7,000 ppm or less, 6,000 ppm or less, 5,000 ppm or less, 4,000 ppm or less, 3,000 ppm or less , 2,500 ppm or less, 2,250 ppm or less, 2,200 ppm or less, 2,100 ppm or less, 2,000 ppm or less, 1,900 ppm or less, or 1,800 ppm or less, 1,700 or less, 1,600 ppm or less, or 1,500 ppm or less.
經後處理的第一聚芳硫醚樹脂可具有10泊(poise)或更大、100泊或更大、500泊或更大、1,000泊或更大、5,000泊或更大、10,000泊或更大、15,000泊或更大、17,000泊或更大、18,000泊或更大、19,000泊或更大、20,000泊或更大、21,000泊或更大、大於21,000泊、22,000泊或更大、或23,000泊或更大、及70,000泊或更小、50,000泊或更小、40,000泊或更小、30,000泊或更小、25,000泊或更小、23,000泊或更小、或20,000泊或更小的熔融黏度。在本說明書中,熔融黏度可定義為當藉由頻率掃描法在300℃下用旋轉圓盤黏度計在0.6至500 rad/s之角頻率範圍內量測黏度時,在1.84 rad/s之角頻率下的黏度。The post-treated first polyarylene sulfide resin can have 10 poise or more, 100 poise or more, 500 poise or more, 1,000 poise or more, 5,000 poise or more, 10,000 poise or more Large, 15,000 poise or more, 17,000 poise or more, 18,000 poise or more, 19,000 poise or more, 20,000 poise or more, 21,000 poise or more, 21,000 poise or more, 22,000 poise or more, or 23,000 poise or more, and 70,000 poise or less, 50,000 poise or less, 40,000 poise or less, 30,000 poise or less, 25,000 poise or less, 23,000 poise or less, or 20,000 poise or less melting viscosity. In this specification, melt viscosity may be defined as the angle of 1.84 rad/s when the viscosity is measured by the frequency sweep method at 300°C with a rotating disk viscometer in the angular frequency range of 0.6 to 500 rad/s Viscosity at frequency.
另外,非線性指數可為0.001或更大、0.01或更大、0.05或更大、0.09或更大、或0.10或更大,且其可為0.50或更小、0.40或更小、0.30或更小、0.20或更小、0.15或更小、0.14或更小、0.13或更小、0.12或更小、0.11或更小、0.10或更小。在將非線性指數調節至上述範圍時,經後處理之聚芳硫醚樹脂可具有增強的可加工性及良好的模穴平衡。非線性指數可為就待量測之物體之直鏈、分支鏈或交聯而言的分子量或分子結構之指數。通常,當此值接近0時,其表示樹脂之分子結構呈線性。隨著值增加,其表示含有許多分支鏈或交聯結構。在本說明書中,當藉由頻率掃描法在300℃下用旋轉圓盤黏度計在0.03至25 s-1 之剪切速率範圍內量測黏度變化時,可藉由以下方程式2定義非線性指數。 [方程式2] 非線性指數 = 1 - (17.3 s-1 剪切速率下的熔融黏度) / (3.22 s-1 剪切速率下的熔融黏度)Additionally, the nonlinearity index can be 0.001 or more, 0.01 or more, 0.05 or more, 0.09 or more, or 0.10 or more, and it can be 0.50 or less, 0.40 or less, 0.30 or more Small, 0.20 or less, 0.15 or less, 0.14 or less, 0.13 or less, 0.12 or less, 0.11 or less, 0.10 or less. When the nonlinear index is adjusted to the above range, the post-treated polyarylene sulfide resin can have enhanced processability and good cavity balance. The nonlinear index may be an index of molecular weight or molecular structure in terms of linear, branched or cross-linked chains of the object to be measured. Generally, when this value is close to 0, it indicates that the molecular structure of the resin is linear. As the value increases, it indicates that there are many branched or cross-linked structures. In this specification, when the viscosity change is measured by the frequency sweep method at 300°C with a rotating disk viscometer in the shear rate range of 0.03 to 25 s −1 , the nonlinear exponent can be defined by the following equation 2 . [Equation 2] Nonlinear exponent = 1 - (melt viscosity at 17.3 s -1 shear rate) / (melt viscosity at 3.22 s -1 shear rate)
可獲得具有如上文所述之特定範圍內之非線性指數的經後處理之第一聚芳硫醚樹脂,此例如藉由在用於熔融聚合之混合物的熔融聚合製程中使聚芳硫醚樹脂的分子量增加至一定程度來達成,該混合物包含二碘芳族化合物、第一硫化合物及聚合抑制劑。A post-treated first polyarylene sulfide resin having a non-linear index within the specified range as described above can be obtained, for example, by using the polyarylene sulfide resin in the melt polymerization process of the mixture for melt polymerization The molecular weight is increased to a certain extent, and the mixture includes a diiodo aromatic compound, a first sulfur compound, and a polymerization inhibitor.
經後處理的第一聚芳硫醚樹脂可具有0.10或更大、0.20或更大、0.30或更大、0.40或更大、0.50或更大、0.60或更大、0.61或更大、0.62或更大、或0.65或更大、及1.00或更小、0.90或更小、0.80或更小、或0.70或更小的分支比(α)。在本說明書中,α係根據以下方程式3之馬克-霍溫克方程式(Mark-Howink equation)計算。通常,α愈接近1,則聚合物線性程度愈高。α愈接近0,則聚合物分支程度愈高。 [方程式3] [η] = K Mα The post-treated first polyarylene sulfide resin may have 0.10 or greater, 0.20 or greater, 0.30 or greater, 0.40 or greater, 0.50 or greater, 0.60 or greater, 0.61 or greater, 0.62 or greater greater, or 0.65 or greater, and 1.00 or less, 0.90 or less, 0.80 or less, or 0.70 or less branching ratio (α). In this specification, α is calculated according to the Mark-Howink equation of Equation 3 below. In general, the closer α is to 1, the more linear the polymer is. The closer α is to 0, the higher the degree of polymer branching. [Equation 3] [η] = KM α
在上述方程式中,η為固有黏度,M為重量平均分子量,且K為常數。In the above equation, η is the intrinsic viscosity, M is the weight average molecular weight, and K is a constant.
另外,經後處理之第一聚芳硫醚樹脂的熔點可為250至300℃、260至300℃、265至300℃或270至290℃。在本說明書中,熔點可如下量測:在差示掃描量熱計(DSC,TA Instrument之Q20型)中以10℃/分鐘之速率將溫度自30℃升高至320℃,且接著將溫度冷卻至30℃,隨後以10℃/分鐘之速率再次將溫度自30℃升高至320℃。In addition, the melting point of the post-treated first polyarylene sulfide resin may be 250 to 300°C, 260 to 300°C, 265 to 300°C, or 270 to 290°C. In this specification, the melting point can be measured by increasing the temperature from 30°C to 320°C at a rate of 10°C/min in a differential scanning calorimeter (DSC, model Q20 from TA Instrument), and then increasing the temperature Cool to 30°C, then increase the temperature again from 30°C to 320°C at a rate of 10°C/min.
經後處理之第一聚芳硫醚樹脂的結晶溫度可為150至300℃、200至250℃、210至240℃、215至230℃,或216至225℃。若結晶溫度增加,則不僅結晶速度增加,而且影響結晶度,藉此可增強最終組成物的機械特性。在本說明書中,結晶溫度可如下量測:在差示掃描量熱計(DSC,TA Instrument之Q20型)中以10℃/分鐘之速率將溫度自30℃升高至320℃,且接著將溫度冷卻至30℃,隨後以10℃/分鐘之速率再次將溫度自30℃升高至320℃。The crystallization temperature of the post-treated first polyarylene sulfide resin may be 150 to 300°C, 200 to 250°C, 210 to 240°C, 215 to 230°C, or 216 to 225°C. If the crystallization temperature is increased, not only the crystallization rate is increased, but also the degree of crystallinity is affected, whereby the mechanical properties of the final composition can be enhanced. In this specification, the crystallization temperature can be measured by increasing the temperature from 30°C to 320°C at a rate of 10°C/min in a differential scanning calorimeter (DSC, model Q20 from TA Instrument), and then changing the The temperature was cooled to 30°C and then again increased from 30°C to 320°C at a rate of 10°C/min.
經後處理之第一聚芳硫醚樹脂的分子量可作為重量平均分子量、數目平均分子量、峰值分子量及其類似者量測。經後處理之第一聚芳硫醚樹脂的重量平均分子量不受特別限制,只要本發明之效果不受損即可,然而自機械強度之觀點來看,其可為25,000公克/莫耳或更大、或30,000公克/莫耳或更大、40,000公克/莫耳或更大、或50,000公克/莫耳或更大,且自模穴平衡之觀點來看,其可為100,000公克/莫耳或更小、80,000公克/莫耳或更小、65,000公克/莫耳或更小、或55,000公克/莫耳或更小。另外,為了達成極佳的機械強度及良好的模穴平衡,可將經後處理之第一聚芳硫醚樹脂的重量平均分子量調節至25,000至60,000公克/莫耳、30,000至55,000公克/莫耳、30,000至80,000公克/莫耳、或60,000至100,000公克/莫耳。另外,數目平均分子量可為1,000公克/莫耳或更大、5,000公克/莫耳或更大、7,500公克/莫耳或更大、9,000公克/莫耳或更大、10,000公克/莫耳或更大、11,000公克/莫耳或更大、12,000公克/莫耳或更大、或12,400公克/莫耳或更大,及30,000公克/莫耳或更小、25,000公克/莫耳或更小、20,000公克/莫耳或更小、15,000公克/莫耳或更小、13,500公克/莫耳或更小、13,000公克/莫耳或更小、或12,000公克/莫耳或更小。峰值分子量可為10,000公克/莫耳或更大、15,000公克/莫耳或更大、20,000公克/莫耳或更大、25,000公克/莫耳或更大、27,000公克/莫耳或更大、或27,900公克/莫耳或更大、及140,000公克/莫耳或更小、100,000公克/莫耳或更小、75,000公克/莫耳或更小、50,000公克/莫耳或更小、45,000公克/莫耳或更小、43,000公克/莫耳或更小、35,000公克/莫耳或更小、或30,000公克/莫耳或更小。The molecular weight of the post-treated first polyarylene sulfide resin can be measured as weight average molecular weight, number average molecular weight, peak molecular weight, and the like. The weight-average molecular weight of the post-treated first polyarylene sulfide resin is not particularly limited as long as the effect of the present invention is not impaired, but from the viewpoint of mechanical strength, it may be 25,000 g/mol or more large, or 30,000 g/mol or more, 40,000 g/mol or more, or 50,000 g/mol or more, and from a cavity balance point of view, it may be 100,000 g/mol or more Lesser, 80,000 g/mol or less, 65,000 g/mol or less, or 55,000 g/mol or less. In addition, in order to achieve excellent mechanical strength and good cavity balance, the weight average molecular weight of the post-treated first polyarylene sulfide resin can be adjusted to 25,000 to 60,000 g/mol, 30,000 to 55,000 g/mol , 30,000 to 80,000 g/mol, or 60,000 to 100,000 g/mol. Additionally, the number average molecular weight can be 1,000 grams/mol or greater, 5,000 grams/mol or greater, 7,500 grams/mol or greater, 9,000 grams/mol or greater, 10,000 grams/mol or greater Large, 11,000 g/mol or more, 12,000 g/mol or more, or 12,400 g/mol or more, and 30,000 g/mol or less, 25,000 g/mol or less, 20,000 g/mol or less, 15,000 g/mol or less, 13,500 g/mol or less, 13,000 g/mol or less, or 12,000 g/mol or less. The peak molecular weight can be 10,000 g/mol or greater, 15,000 g/mol or greater, 20,000 g/mol or greater, 25,000 g/mol or greater, 27,000 g/mol or greater, or 27,900 g/mol or more, and 140,000 g/mol or less, 100,000 g/mol or less, 75,000 g/mol or less, 50,000 g/mol or less, 45,000 g/mol or less ear or less, 43,000 g/mol or less, 35,000 g/mol or less, or 30,000 g/mol or less.
經後處理之第一聚芳硫醚樹脂的釋氣量可為0.001至0.50重量%、0.001至0.20重量%,或0.01至0.10重量%。在本說明書中,可使用氣相層析(GC)質譜儀,以重量百分比定量釋氣量,該釋氣量為當預定量的聚芳硫醚樹脂或樹脂組成物樣品在330℃下受熱20分鐘時所產生之氣體的量。The outgassing amount of the post-treated first polyarylene sulfide resin may be 0.001 to 0.50 wt %, 0.001 to 0.20 wt %, or 0.01 to 0.10 wt %. In this specification, a gas chromatography (GC) mass spectrometer can be used to quantify the outgassing amount in weight percent when a predetermined amount of a sample of polyarylene sulfide resin or resin composition is heated at 330°C for 20 minutes The amount of gas produced.
經後處理之第一聚芳硫醚樹脂的末端可包含羧基、羧酸酯基、羥基、胺基、醯胺基、矽烷基、硫醚基、磺酸酯基,或其類似基團。具體而言,其可包含自上式4至6中之一者所示之化合物衍生的官能基。The end of the post-treated first polyarylene sulfide resin may contain a carboxyl group, a carboxylate group, a hydroxyl group, an amine group, an amide group, a silyl group, a thioether group, a sulfonate group, or the like. Specifically, it may contain a functional group derived from a compound represented by one of the above formulae 4 to 6.
經增容劑後處理之第一聚芳硫醚樹脂與具有親水性官能基及/或反應基之其他樹脂及無機填料具有極佳相容性。因此,釋氣量可低於未經後處理之聚芳硫醚樹脂的釋氣量。另外,與樹脂聚合期間使用相同化合物作為聚合抑制劑所製備的聚芳硫醚樹脂相比,可減少可引起釋氣之聚合抑制劑/增容劑的量且使副產物減至最少。從而,可降低釋氣量。The first polyarylene sulfide resin post-treated with a compatibilizer has excellent compatibility with other resins and inorganic fillers with hydrophilic functional groups and/or reactive groups. Therefore, the outgassing amount can be lower than that of the polyarylene sulfide resin without post-treatment. Additionally, the amount of polymerization inhibitor/compatibilizer that can cause outgassing can be reduced and by-products minimized compared to polyarylene sulfide resins prepared using the same compound as a polymerization inhibitor during resin polymerization. Thus, the outgassing amount can be reduced.
另外,儘管不受任何特定的理論束縛,但由於釋氣量如上文所述減少,因此聚芳硫醚樹脂用增容劑加以後處理可改良注塑製程之可加工性,得到極佳的模穴平衡以及產生使生產週期縮短的作用。Also, while not being bound by any particular theory, since outgassing is reduced as described above, the addition of compatibilizers to polyarylene sulfide resins with post-treatment can improve the processability of the injection molding process, resulting in excellent cavity balance And produce the effect of shortening the production cycle.
此外,因為經增容劑後處理之第一聚芳硫醚樹脂的相容性改良,因此其在諸如拉伸強度及拉伸伸長率等機械強度及氣密性方面可為極佳的。添加劑 In addition, because the compatibility of the first polyarylene sulfide resin post-treated with the compatibilizer is improved, it may be excellent in mechanical strength such as tensile strength and tensile elongation and air tightness. additive
添加劑不受限制,只要其不損害本發明之效果即可。特定而言,其實例包括纖維增強材料、無機填料、抗氧化劑、穩定劑、加工熱穩定劑、塑化劑、脫模劑、著色劑、潤滑劑、耐候性穩定劑、發泡劑、防銹劑、蠟、成核劑、其他樹脂組分、防滴劑,及另一種增容劑。The additive is not limited as long as it does not impair the effect of the present invention. Specifically, examples thereof include fiber reinforcements, inorganic fillers, antioxidants, stabilizers, processing heat stabilizers, plasticizers, mold release agents, colorants, lubricants, weatherability stabilizers, foaming agents, rust inhibitors agents, waxes, nucleating agents, other resin components, anti-drip agents, and another compatibilizer.
纖維增強材料之實例可包括無機纖維材料,諸如玻璃纖維、基於PAN或基於瀝青之碳纖維、二氧化矽纖維、二氧化矽-氧化鋁纖維、氧化鋯纖維、氮化硼纖維、氮化矽纖維、硼纖維、硼酸鋁纖維、鈦酸鉀纖維、金屬纖維材料(諸如不鏽鋼、鋁、鈦、銅),及珍珠;及有機纖維材料,諸如醯胺纖維(aramid fiber)。無機填料之實例可包括矽酸鹽,諸如雲母、滑石、矽灰石(wollastonite)、絹雲母(sericite)、高嶺土、黏土、皂土、石棉、矽酸鋁、沸石及葉蠟石(pyrophyllite);碳酸鹽,諸如碳酸鈣、碳酸鎂及白雲石(dolomite);硫酸鹽,諸如硫酸鈣及硫酸鋇;金屬氧化物,諸如氧化鋁、氧化鎂、二氧化矽、氧化鋯、二氧化鈦及氧化鐵;玻璃珠;玻璃片;陶瓷珠;氮化硼;碳化矽;及磷酸鈣。此等纖維增強材料及無機填料可單獨使用或以二者或更多者組合使用。Examples of fiber-reinforced materials may include inorganic fiber materials such as glass fibers, PAN-based or pitch-based carbon fibers, silica fibers, silica-alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, Boron fibers, aluminum borate fibers, potassium titanate fibers, metal fiber materials such as stainless steel, aluminum, titanium, copper, and pearls; and organic fiber materials such as aramid fibers. Examples of inorganic fillers may include silicates such as mica, talc, wollastonite, sericite, kaolin, clay, bentonite, asbestos, aluminum silicate, zeolite, and pyrophyllite; Carbonates, such as calcium carbonate, magnesium carbonate, and dolomite; sulfates, such as calcium sulfate and barium sulfate; metal oxides, such as aluminum oxide, magnesium oxide, silicon dioxide, zirconium oxide, titanium dioxide, and iron oxide; glass Beads; glass flakes; ceramic beads; boron nitride; silicon carbide; and calcium phosphate. These fiber reinforcements and inorganic fillers may be used alone or in combination of two or more.
具體而言,可對玻璃纖維進行表面處理以改良與樹脂的界面黏著,且可使用環氧樹脂及具有胺基的矽烷進行表面處理。舉例而言,玻璃纖維可為鋁硼矽酸鹽玻璃。另外,玻璃填料例如可具有6至15 µm之平均直徑及2至8 mm或2至6 mm之平均長度。Specifically, glass fibers can be surface-treated to improve interfacial adhesion with resins, and epoxy resins and silanes with amine groups can be used for surface treatment. For example, the glass fibers may be aluminoborosilicate glass. In addition, the glass filler can have, for example, an average diameter of 6 to 15 μm and an average length of 2 to 8 mm or 2 to 6 mm.
熱穩定劑可用於在樹脂製備製程期間或在其使用期間阻止樹脂因熱及光的作用而分解。當聚芳硫醚樹脂與其他添加劑或樹脂混合或成型時,其可將在高溫環境中可能發生的副反應減至最少,從而增強最終聚芳硫醚樹脂組成物的物理特性。熱穩定劑之實例包括金屬熱穩定劑,諸如基於鈣鎂鋅之熱穩定劑、基於鈣鋅之熱穩定劑、基於有機錫之熱穩定劑、基於金屬皂之熱穩定劑、基於鋇鋅之熱穩定劑、基於環氧鋅之熱穩定劑、基於碳酸鎂鋁之熱穩定劑、基於鋅之熱穩定劑、基於鉛之熱穩定劑及非金屬熱穩定劑,諸如基於環氧樹脂之熱穩定劑及基於有機亞磷酸酯之熱穩定劑。市售熱穩定劑為Dubon之CLC-120,其為基於碳酸鎂鋁之熱穩定劑。Thermal stabilizers can be used to prevent the resin from decomposing due to heat and light during the resin preparation process or during its use. When the polyarylene sulfide resin is mixed or molded with other additives or resins, it can minimize side reactions that may occur in a high temperature environment, thereby enhancing the physical properties of the final polyarylene sulfide resin composition. Examples of heat stabilizers include metal heat stabilizers such as calcium magnesium zinc based heat stabilizers, calcium zinc based heat stabilizers, organotin based heat stabilizers, metal soap based heat stabilizers, barium zinc based heat stabilizers Stabilizers, epoxy zinc based thermal stabilizers, magnesium aluminum carbonate based thermal stabilizers, zinc based thermal stabilizers, lead based thermal stabilizers and non-metallic thermal stabilizers such as epoxy based thermal stabilizers And heat stabilizers based on organic phosphites. A commercially available heat stabilizer is Dubon's CLC-120, which is a magnesium aluminum carbonate based heat stabilizer.
另外,一級酚類穩定劑、二級磷穩定劑以及一級-二級混合型穩定劑可用作熱穩定劑。較佳地,一級穩定劑與二級穩定劑均具有高分子量或其當在高溫下儲存時具有極佳熱穩定性。就此而言,較佳穩定劑包括ADEKA之AO-60及AO-80、Chemtura之Ultanox627A及Doverphos S9228及其類似物。In addition, primary phenolic stabilizers, secondary phosphorus stabilizers, and primary-secondary mixed type stabilizers can be used as thermal stabilizers. Preferably, both the primary and secondary stabilizers have high molecular weights or have excellent thermal stability when stored at elevated temperatures. In this regard, preferred stabilizers include ADEKA's AO-60 and AO-80, Chemtura's Ultanox 627A and Doverphos S9228 and the like.
另外,脫模劑具體可為基於聚矽氧之脫模劑、基於蠟之脫模劑、基於氟之脫模劑、基於界面活性劑之脫模劑,或混合型脫模劑。市售脫模劑為Mitsui之Hi-WaxTM 。In addition, the release agent may specifically be a silicone-based release agent, a wax-based release agent, a fluorine-based release agent, a surfactant-based release agent, or a mixed release agent. A commercially available release agent is Hi-Wax ™ from Mitsui.
成核劑可用於加快結晶速度。使用成核劑可提高結晶度,即使在低溫模具中亦如此,藉此增強樹脂之表面特徵。成核劑可為在高溫下具有熱穩定性之無機材料。其實例可包括滑石、矽酸鈣、二氧化矽、氮化硼及其類似物。具體而言,氮化硼可呈六方晶系形式。作為純度,可使用以氮化硼之總重量計具有0.5重量%或更小之B2 O3 含量的氮化硼。或者,可使用純度為95重量%或更高之氮化硼。Nucleating agents can be used to speed up crystallization. The use of nucleating agents increases crystallinity, even in low temperature molds, thereby enhancing the surface characteristics of the resin. Nucleating agents can be inorganic materials that are thermally stable at high temperatures. Examples thereof may include talc, calcium silicate, silicon dioxide, boron nitride, and the like. In particular, boron nitride may be in the form of a hexagonal crystal system. As the purity, boron nitride having a B 2 O 3 content of 0.5 wt % or less based on the total weight of boron nitride can be used. Alternatively, boron nitride with a purity of 95% by weight or higher may be used.
另外,可根據第一聚芳硫醚樹脂所需之特徵,使用適當量的其他樹脂。此等樹脂之實例可包括諸如以下等單體的均聚物或共聚物:乙烯、丁烯、戊烯、丁二烯、異戊二烯、氯丁二烯、苯乙烯、α-甲基苯乙烯、乙酸乙烯酯、氯乙烯、丙烯酸酯、甲基丙烯酸酯及(甲基)丙烯腈;及以下之均聚物、無規共聚物、嵌段共聚物及接枝共聚物:聚酯,諸如聚胺基甲酸酯、聚對苯二甲酸丁二酯及聚對苯二甲酸乙二酯;聚縮醛;聚碳酸酯;聚碸;聚烯丙基碸;聚醚碸;聚苯醚;聚醚酮;聚醚醚酮;聚醯亞胺;聚醯胺亞胺;聚醚醯亞胺;矽樹脂;環氧樹脂;苯氧基樹脂;液晶聚合物;及聚芳醚。In addition, other resins may be used in appropriate amounts according to the desired characteristics of the first polyarylene sulfide resin. Examples of such resins may include homopolymers or copolymers of monomers such as: ethylene, butene, pentene, butadiene, isoprene, chloroprene, styrene, alpha-methylbenzene Ethylene, vinyl acetate, vinyl chloride, acrylates, methacrylates and (meth)acrylonitrile; and homopolymers, random copolymers, block copolymers and graft copolymers of the following: polyesters, such as Polyurethane, polybutylene terephthalate and polyethylene terephthalate; polyacetal; polycarbonate; Polyetherketone; polyetheretherketone; polyimide; polyimide; polyetherimide; silicone resin; epoxy resin; phenoxy resin; liquid crystal polymer; and polyarylene ether.
具體而言,其他樹脂組分可包含彈性體以增強耐衝擊強度。彈性體可選自由以下組成之群:基於聚氯乙烯的彈性體、基於聚烯烴的彈性體、基於聚胺基甲酸酯的彈性體、基於聚酯的彈性體、基於聚醯胺的彈性體、基於聚丁二烯的彈性體,及甲基丙烯酸縮水甘油酯與甲基丙烯酸酯之三聚物。Specifically, other resin components may contain elastomers to enhance impact strength. The elastomer may be selected from the group consisting of: polyvinyl chloride based elastomers, polyolefin based elastomers, polyurethane based elastomers, polyester based elastomers, polyamide based elastomers , Polybutadiene-based elastomers, and terpolymers of glycidyl methacrylate and methacrylate.
另外,其他樹脂組分可包括熱塑性彈性體(TPE)。具體而言,熱塑性彈性體可為熱塑性聚醚嵌段醯胺(TPA)、熱塑性聚胺基甲酸酯彈性體(TPU)、熱塑性共聚酯彈性體(TPC)、基於苯乙烯嵌段共聚物的熱塑性彈性體(TPS)、由熱塑性塑膠及硫化彈性體製得之熱塑性彈性體(TPV),或其類似物。熱塑性彈性體可為含有環氧官能基之環氧彈性體。舉例而言,其可為乙烯與甲基丙烯酸縮水甘油酯之共聚物。市售熱塑性彈性體為Sumitomo之IGETABOND® BF-E。Additionally, other resin components may include thermoplastic elastomers (TPE). In particular, the thermoplastic elastomer may be thermoplastic polyether block amide (TPA), thermoplastic polyurethane elastomer (TPU), thermoplastic copolyester elastomer (TPC), based on styrene block copolymers thermoplastic elastomers (TPS), thermoplastic elastomers (TPV) made from thermoplastics and vulcanized elastomers, or the like. The thermoplastic elastomer may be an epoxy elastomer containing epoxy functional groups. For example, it can be a copolymer of ethylene and glycidyl methacrylate. A commercially available thermoplastic elastomer is IGETABOND ® BF-E from Sumitomo.
防滴劑可用於在燃燒聚芳硫醚樹脂組成物時防止滴落。防滴劑可包括基於氟之防滴劑。具體而言,防滴劑可包括基於氟之樹脂(聚四氟乙烯、聚偏二氟乙烯、聚六氟丙烯及其類似物)、全氟烷磺酸鹼金屬鹽化合物(全氟甲烷磺酸鈉鹽、全氟正丁烷磺酸鉀、全氟-三級丁烷磺酸鉀、全氟辛烷磺酸鈉、全氟-2-乙基己烷磺酸鈣及其類似物)、全氟烷磺酸鹼土金屬鹽。更具體而言,其可包括聚四氟乙烯。市售防滴劑為Hannanotech之FS-100、FS-200及FS-300。The anti-drip agent can be used to prevent dripping when the polyarylene sulfide resin composition is burned. Anti-drip agents may include fluorine-based anti-drip agents. Specifically, the anti-drip agent may include fluorine-based resins (polytetrafluoroethylene, polyvinylidene fluoride, polyhexafluoropropylene, and the like), perfluoroalkanesulfonic acid alkali metal salt compounds (perfluoromethanesulfonic acid) Sodium salt, potassium perfluoro-n-butane sulfonate, potassium perfluoro-tertiary butane sulfonate, sodium perfluorooctane sulfonate, calcium perfluoro-2-ethylhexane sulfonate and its analogs), Alkaline earth metal salt of fluorocarbon sulfonic acid. More specifically, it may include polytetrafluoroethylene. Commercially available anti-drip agents are Hannanotech's FS-100, FS-200 and FS-300.
另一種相容劑係指除用於對第一聚芳硫醚樹脂進行後處理之增容劑之外,另外添加至聚芳硫醚樹脂組成物中之增容劑。具體而言,另一種增容劑可為除上式4至6中之一者所示之化合物之外的增容劑。舉例而言,另一種增容劑可為基於環氧矽烷的增容劑。市售的另一種增容劑為Momentive Performance Materials之Silquest® A-186及A-187。Another compatibilizer refers to a compatibilizer added to the polyarylene sulfide resin composition in addition to the compatibilizer used for post-treatment of the first polyarylene sulfide resin. Specifically, another compatibilizer may be a compatibilizer other than the compound represented by one of the above formulae 4 to 6. For example, another compatibilizer may be an epoxysilane-based compatibilizer. Another commercially available compatibilizer is Silques t® A-186 and A-187 from Momentive Performance Materials.
另外,金屬添加劑尤其當與熱塑性彈性體一起使用時,可加快聚芳硫醚樹脂與熱塑性彈性體之間的相容反應。鋅鹽、鎂鹽、鈣鹽、鈉鹽、鋰鹽或其類似物可用作金屬添加劑。較佳為具有熱穩定性且可有助於彈性體之縮水甘油基官能基與聚芳硫醚樹脂之相容性官能基之間反應的金屬添加劑。滿足此等需求之較佳金屬添加劑包括硬脂酸鋅鹽(Sigma Aldrich-307564)、硬脂酸鈣鹽(Sigma Aldrich-26411)、乙酸鎂鹽(Sigma Aldrich-228648)、硬脂酸鎂鹽(Sigma Aldrich-415057)、硬脂酸鈉鹽(Sigma Aldrich-S3381)、碳酸鋰鹽(Sigma Aldrich-203629)及其類似物。In addition, the metal additive, especially when used together with the thermoplastic elastomer, can accelerate the compatibilization reaction between the polyarylene sulfide resin and the thermoplastic elastomer. Zinc salts, magnesium salts, calcium salts, sodium salts, lithium salts or the like can be used as metal additives. Preferred are metal additives that have thermal stability and can facilitate the reaction between the glycidyl functional group of the elastomer and the compatible functional group of the polyarylene sulfide resin. Preferred metal additives to meet these needs include zinc stearate (Sigma Aldrich-307564), calcium stearate (Sigma Aldrich-26411), magnesium acetate (Sigma Aldrich-228648), magnesium stearate (Sigma Aldrich-228648) Sigma Aldrich-415057), sodium stearate (Sigma Aldrich-S3381), lithium carbonate (Sigma Aldrich-203629) and the like.
添加劑可具體地包括選自由纖維增強材料、熱穩定劑及彈性體組成之群的至少一者。具體而言,添加劑可包括熱穩定劑。更具體而言,添加劑可包括玻璃纖維或可包括彈性體及熱穩定劑。經後處理之第一聚芳硫醚樹脂組成物 The additive may specifically include at least one selected from the group consisting of fiber reinforcements, thermal stabilizers, and elastomers. Specifically, the additives may include thermal stabilizers. More specifically, the additives may include glass fibers or may include elastomers and thermal stabilizers. Post-treated first polyarylene sulfide resin composition
用於墊片的樹脂組成物可包含經後處理之第一聚芳硫醚樹脂及添加劑。The resin composition for the gasket may include the post-treated first polyarylene sulfide resin and additives.
具體而言,以經後處理之第一聚芳硫醚樹脂組成物的總重量計,經後處理之第一聚芳硫醚樹脂組成物可包含0.1重量%或更大、1重量%或更大、2重量%或更大、5重量%或更大、10重量%或更大、15重量%或更大、20重量%或更大、30重量%或更大、40重量%或更大、50重量%或更大、或60重量%或更大,及99.9重量%或更小、99重量%或更小、98重量%或更小、95重量%或更小、90重量%或更小、85重量%或更小、80重量%或更小、75重量%或更小、70重量%或更小、或65重量%或更小之量的經後處理之第一聚芳硫醚樹脂。Specifically, the post-treated first polyarylene sulfide resin composition may contain 0.1 wt % or more, 1 wt % or more based on the total weight of the post-treated first polyarylene sulfide resin composition Large, 2 wt% or greater, 5 wt% or greater, 10 wt% or greater, 15 wt% or greater, 20 wt% or greater, 30 wt% or greater, 40 wt% or greater , 50 wt% or more, or 60 wt% or more, and 99.9 wt% or less, 99 wt% or less, 98 wt% or less, 95 wt% or less, 90 wt% or less Small, 85 wt% or less, 80 wt% or less, 75 wt% or less, 70 wt% or less, or 65 wt% or less of the post-treated first polyarylene sulfide resin.
同時,以經後處理之第一聚芳硫醚樹脂組成物的總重量計,經後處理之第一聚芳硫醚樹脂組成物可包含0.01重量%或更大、0.1重量%或更大、1重量%或更大、5重量%或更大、10重量%或更大、20重量%或更大或30重量%或更大,及90重量%或更小、80重量%或更小、70重量%或更小、60重量%或更小、50重量%或更小、45重量%或更小、40重量%或更小、30重量%或更小、20重量%或更小、或15重量%或更小之量的添加劑。Meanwhile, based on the total weight of the post-treated first polyarylene sulfide resin composition, the post-treated first polyarylene sulfide resin composition may contain 0.01 wt % or more, 0.1 wt % or more, 1 wt% or more, 5 wt% or more, 10 wt% or more, 20 wt% or more or 30 wt% or more, and 90 wt% or less, 80 wt% or less, 70 wt% or less, 60 wt% or less, 50 wt% or less, 45 wt% or less, 40 wt% or less, 30 wt% or less, 20 wt% or less, or Additives in an amount of 15% by weight or less.
更具體而言,以經後處理之第一聚芳硫醚樹脂組成物的總重量計,經後處理的第一聚芳硫醚樹脂組成物可包含10至70重量%、10至60重量%、10至50重量%、15至45重量%、20至40重量%、或25至35重量%之量的玻璃纖維,及0.1至20重量%、1至20重量%、5至15重量%、或7至10重量%之量的彈性體。另外,以相同的基礎計算,其可包含0.01至5重量%、0.01至2重量%、或0.05至1重量%之量的熱穩定劑。More specifically, based on the total weight of the post-treated first polyarylene sulfide resin composition, the post-treated first polyarylene sulfide resin composition may include 10 to 70 wt %, 10 to 60 wt % , 10 to 50% by weight, 15 to 45% by weight, 20 to 40% by weight, or 25 to 35% by weight of glass fibers, and 0.1 to 20% by weight, 1 to 20% by weight, 5 to 15% by weight, or elastomer in an amount of 7 to 10% by weight. Additionally, it may include a thermal stabilizer in an amount of 0.01 to 5 wt %, 0.01 to 2 wt %, or 0.05 to 1 wt % on the same basis.
另外,以經後處理之第一聚芳硫醚樹脂組成物的總重量計,經後處理之第一聚芳硫醚樹脂組成物可包含10至70重量%之量的玻璃纖維,或分別0.1至20重量%及0.01至5重量%之量的彈性體及熱穩定劑。In addition, based on the total weight of the post-treated first polyarylene sulfide resin composition, the post-treated first polyarylene sulfide resin composition may include glass fibers in an amount of 10 to 70 wt %, or 0.1 wt % respectively. Elastomers and thermal stabilizers in amounts of to 20% by weight and 0.01 to 5% by weight.
相較於未用增容劑後處理之第一聚芳硫醚樹脂組成物,經後處理之第一聚芳硫醚樹脂組成物具有良好的釋氣量且產生極佳氣密性、模穴平衡及機械強度的效果。[ 混合型聚芳硫醚樹脂組成物 ] Compared with the first polyarylene sulfide resin composition not post-treated with a compatibilizer, the post-treated first polyarylene sulfide resin composition has good outgassing and produces excellent air tightness and cavity balance and mechanical strength. [ Hybrid polyarylene sulfide resin composition ]
根據一個實施例,提供一種用於墊片的樹脂組成物(下文中稱為混合型聚芳硫醚樹脂組成物),其包含:由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂;由二鹵素芳族化合物及第二硫化合物發生溶液聚合的第二聚芳硫醚樹脂;以及添加劑。According to one embodiment, there is provided a resin composition for a gasket (hereinafter referred to as a hybrid polyarylene sulfide resin composition) comprising: melting a diiodo aromatic compound, a first sulfur compound and a polymerization inhibitor A polymerized first polyarylene sulfide resin; a second polyarylene sulfide resin solution-polymerized from a dihalogen aromatic compound and a second sulfur compound; and an additive.
根據另一實施例,提供一種用於製備墊片樹脂組成物的方法,其包含:製備由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂;製備由二鹵素芳族化合物及第二硫化合物發生溶液聚合的第二聚芳硫醚樹脂;及將第一聚芳硫醚樹脂及第二聚芳硫醚樹脂與添加劑混合。According to another embodiment, there is provided a method for preparing a gasket resin composition, comprising: preparing a first polyarylene sulfide resin melt-polymerized from a diiodo aromatic compound, a first sulfur compound, and a polymerization inhibitor; preparing a second polyarylene sulfide resin that is solution-polymerized from a dihalogen aromatic compound and a second sulfur compound; and mixing the first polyarylene sulfide resin and the second polyarylene sulfide resin with additives.
第一聚芳硫醚樹脂及添加劑如上文所述。第二聚芳硫醚樹脂 The first polyarylene sulfide resin and additives are as described above. The second polyarylene sulfide resin
第二聚芳硫醚樹脂可藉由二鹵素芳族化合物及第二硫化合物之溶液聚合來製備。The second polyarylene sulfide resin can be prepared by solution polymerization of a dihalogen aromatic compound and a second sulfur compound.
第二聚芳硫醚樹脂不受特別限制,只要其藉由二鹵素芳族化合物及第二硫化合物之溶液聚合製備即可。已知麥卡倫法(Macallum process)為用於製備此類聚芳硫醚樹脂之商業方法,其中使對二氯苯及硫化鈉在諸如N-甲基吡咯啶酮之極性有機溶劑存在下發生溶液聚合。典型方法揭露於美國專利第2,513,188號中。The second polyarylene sulfide resin is not particularly limited as long as it is prepared by solution polymerization of a dihalogen aromatic compound and a second sulfur compound. The Macallum process is known as a commercial process for the preparation of such polyarylene sulfide resins in which p-dichlorobenzene and sodium sulfide are brought into solution in the presence of a polar organic solvent such as N-methylpyrrolidone polymerization. A typical method is disclosed in US Patent No. 2,513,188.
溶液聚合可在有機極性溶劑存在下進行。有機極性溶劑可為例如選自由以下組成之群的至少一者:N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N,N-二乙基乙醯胺、N,N-二丙基乙醯胺、N,N-二甲基苯甲酸醯胺、己內醯胺、N-丙基己內醯胺、N-甲基己內醯胺、N-環己基己內醯胺、N-甲基-2-吡咯啉酮、N-乙基-2-吡咯啶酮、N-異丙基-2-吡咯啶酮、N-異丁基-2-吡咯啶酮、N-丙基-2-吡咯啶酮、N-丁基-2-吡咯啶酮、N-環己基-2-吡咯啶酮、N-甲基-3-甲基-2-吡咯啶酮、N-環己基-2-吡咯啶酮、N-甲基-2-哌啶酮、N-甲基-2-側氧基-六亞甲基亞胺、N-乙基-2-側氧基-六亞甲基亞胺、六甲基磷酸三醯胺、六乙基磷酸三醯胺、四甲基脲、1,3-二甲基伸乙基脲、1,3-二甲基伸乙基脲、1,3-二甲基伸丙基脲、1-甲基-1-側氧基環丁碸、1-乙基-1-側氧基環丁碸、1-苯基-1-側氧基環丁碸、1-甲基-1-側氧基磷烷、1-丙基-1-側氧基磷烷及1-苯基-1-側氧基磷烷。有機極性溶劑可為例如N-甲基吡咯啶酮。Solution polymerization can be carried out in the presence of an organic polar solvent. The organic polar solvent may be, for example, at least one selected from the group consisting of N,N-dimethylformamide, N,N-dimethylacetamide, N,N-diethylacetamide, N,N-dipropylacetamide, N,N-dimethylbenzoic acid amide, caprolactam, N-propylcaprolactamide, N-methylcaprolactamide, N-cyclohexyl Caprolactam, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-isopropyl-2-pyrrolidone, N-isobutyl-2-pyrrolidone , N-propyl-2-pyrrolidone, N-butyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-methyl-3-methyl-2-pyrrolidone, N-Cyclohexyl-2-pyrrolidone, N-methyl-2-piperidinone, N-methyl-2-oxo-hexamethyleneimine, N-ethyl-2-oxo - Hexamethyleneimine, hexamethylphosphoric acid triamide, hexaethyl triamide phosphate, tetramethyl urea, 1,3-dimethylethylidene urea, 1,3-dimethylethylidene urea, 1,3-dimethylpropylidene urea, 1-methyl-1-oxycyclobutane, 1-ethyl-1-oxycyclobutane, 1-phenyl-1- Pendant oxycyclobutane, 1-methyl-1-side oxyphosphine, 1-propyl-1-side oxyphosphine and 1-phenyl-1-side oxyphosphine. The organic polar solvent can be, for example, N-methylpyrrolidone.
二鹵素芳族化合物係指具有芳族環及二個與其直接鍵結之鹵基的化合物。在此,鹵基之鹵素原子可各自為氟、氯、溴及碘之原子,且二鹵素芳族化合物中存在的二個鹵基可彼此相同或不同。更具體而言,二個鹵素原子均可為氯。二鹵素芳族化合物可為例如選自由以下組成之群的至少一者:鄰二鹵素苯、間二鹵素苯、對二鹵素苯、二鹵素甲苯、二鹵素萘、甲氧基-二鹵素苯、二鹵素聯苯、二鹵素苯甲酸、二鹵素二苯醚、二鹵素二苯碸、二鹵素二苯亞碸及二鹵素二苯酮。二鹵素芳族化合物可為例如1,4-二氯苯,但其不特別限於此。Dihalogen aromatic compounds refer to compounds having an aromatic ring and two halogen groups directly bonded thereto. Here, the halogen atoms of the halogen group may each be an atom of fluorine, chlorine, bromine and iodine, and the two halogen groups present in the dihalogen aromatic compound may be the same or different from each other. More specifically, both halogen atoms can be chlorine. The dihalogen aromatic compound can be, for example, at least one selected from the group consisting of ortho-dihalobenzene, meta-dihalobenzene, para-dihalobenzene, dihalotoluene, dihalonaphthalene, methoxy-dihalobenzene, Dihalobiphenyl, dihalobenzoic acid, dihalodiphenyl ether, dihalodiphenylene, dihalodiphenylene and dihalobenzophenone. The dihalogen aromatic compound may be, for example, 1,4-dichlorobenzene, but it is not particularly limited thereto.
第二硫化合物可為選自由以下組成之群的至少一者:鹼金屬硫化物及能夠形成鹼金屬硫化物之鹼金屬硫化物形成化合物。另外,第二硫化合物可為選自由以下組成之群的至少一者:鹼金屬硫氫化物及用於形成鹼金屬硫氫化物之化合物。第二硫化合物可為例如鹼金屬硫氫化物,諸如硫氫化鋰、硫氫化鈉、硫氫化鉀、硫氫化銣及硫氫化銫,及鹼金屬硫化物,諸如硫化鋰、硫化鈉、硫化鉀、硫化銣及硫化銫,但其不特別限於此。鹼金屬硫化物形成化合物或鹼金屬硫氫化物形成化合物可為例如硫化氫。鹼金屬硫氫化物(例如NaSH)或鹼金屬硫化物(例如Na2 S)可藉由將硫化氫吹入鹼金屬氫氧化物(例如NaOH)中來製備。第二硫化合物可為選自由以下組成之群的至少一者:酸酐、水合物及水溶液。第二硫化合物可為例如硫化鈉水合物,但其不特別限於此。混合型聚芳硫醚樹脂組成物 The second sulfur compound may be at least one selected from the group consisting of alkali metal sulfides and alkali metal sulfide-forming compounds capable of forming alkali metal sulfides. Additionally, the second sulfur compound may be at least one selected from the group consisting of an alkali metal hydrosulfide and a compound for forming an alkali metal hydrosulfide. The second sulfur compound can be, for example, an alkali metal hydrosulfide such as lithium hydrosulfide, sodium hydrosulfide, potassium hydrosulfide, rubidium hydrosulfide and cesium hydrosulfide, and an alkali metal sulfide such as lithium sulfide, sodium sulfide, potassium sulfide, Rubidium sulfide and cesium sulfide, but they are not particularly limited thereto. The alkali metal sulfide-forming compound or alkali metal sulfide-forming compound may be, for example, hydrogen sulfide. An alkali metal hydrosulfide (eg, NaSH) or an alkali metal sulfide (eg, Na2S) can be prepared by blowing hydrogen sulfide into an alkali metal hydroxide (eg, NaOH). The second sulfur compound may be at least one selected from the group consisting of acid anhydrides, hydrates, and aqueous solutions. The second sulfur compound may be, for example, sodium sulfide hydrate, but it is not particularly limited thereto. Hybrid polyarylene sulfide resin composition
用於墊片的樹脂組成物可包含第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑。The resin composition for the gasket may contain the first polyarylene sulfide resin, the second polyarylene sulfide resin, and additives.
藉由二鹵素芳族化合物及硫化合物之溶液聚合製備的經溶液聚合之聚芳硫醚樹脂具有極佳的物理特性,諸如高結晶溫度及高機械強度,而其缺點在於由於使用可引起釋氣之溶劑,因此釋氣量高,導致模穴平衡低。另一方面,由於製備製程的特點,因此藉由使包含二碘芳族化合物、硫化合物及聚合抑制劑之混合物熔融聚合而製備的熔融聚合聚芳硫醚樹脂具有明顯較低的釋氣量,而其缺點在於其機械強度低,原因在於其含有作為弱結構的二硫鍵。Solution-polymerized polyarylene sulfide resins prepared by solution polymerization of dihalogen aromatic compounds and sulfur compounds have excellent physical properties, such as high crystallization temperature and high mechanical strength, but have the disadvantage of outgassing due to use Therefore, outgassing is high, resulting in low cavity balance. On the other hand, the melt-polymerized polyarylene sulfide resin prepared by melt-polymerizing a mixture comprising a diiodo aromatic compound, a sulfur compound and a polymerization inhibitor has significantly lower outgassing due to the characteristics of the preparation process, while Its disadvantage is its low mechanical strength, since it contains disulfide bonds as weak structures.
然而,本發明人已驚人地發現,可藉由將溶液聚合型聚芳硫醚樹脂與熔融聚合型聚芳硫醚樹脂混合來製備混合型聚芳硫醚樹脂組成物,其中混合樹脂具有與熔融聚合型聚芳硫醚樹脂一樣低的釋氣量,及等效於或優於具有極佳模穴平衡之溶液聚合型聚芳硫醚樹脂的機械強度及氣密性。However, the present inventors have surprisingly found that a hybrid polyarylene sulfide resin composition can be prepared by mixing a solution-polymerized polyarylene sulfide resin with a melt-polymerized polyarylene sulfide resin, wherein the hybrid resin has the same properties as the molten polyarylene sulfide resin. The outgassing amount is as low as that of the polymerized polyarylene sulfide resin, and the mechanical strength and air tightness are equivalent to or better than that of the solution polymerized polyarylene sulfide resin with excellent cavity balance.
儘管不限於特定理論,但可藉由第一聚芳硫醚樹脂與第二聚芳硫醚樹脂之反應來達成混合型樹脂組成物之效果。具體而言,當將第一聚芳硫醚樹脂與第二聚芳硫醚樹脂混合時,第一聚芳硫醚樹脂之二硫鍵可裂解以進一步與第二聚芳硫醚之末端鹵素反應。因此,由於作為第一聚芳硫醚之弱結構的二硫鍵被移除且分子量增加,並且第二聚芳硫醚之鹵素可另外加以移除,因此可增強機械特性,且可顯著減少釋氣量。Although not limited to a specific theory, the effect of the hybrid resin composition can be achieved by the reaction of the first polyarylene sulfide resin and the second polyarylene sulfide resin. Specifically, when the first polyarylene sulfide resin is mixed with the second polyarylene sulfide resin, the disulfide bond of the first polyarylene sulfide resin can be cleaved to further react with the terminal halogen of the second polyarylene sulfide resin . Therefore, since the disulfide bond, which is the weak structure of the first polyarylene sulfide, is removed and the molecular weight is increased, and the halogen of the second polyarylene sulfide can be additionally removed, the mechanical properties can be enhanced, and the release can be significantly reduced. air volume.
第一聚芳硫醚樹脂及第二聚芳硫醚樹脂與添加劑的混合可經由熔融混合進行。熔融混合可在任何條件下進行,只要該等條件能夠熔融第一聚芳硫醚樹脂及第二聚芳硫醚樹脂即可。舉例而言,熔融混合可在單螺桿或雙螺桿混料擠出機、聚合反應器、捏合機反應器或其類似裝置中進行。更具體而言,熔融混合可在雙螺桿擠出機中進行,且可在280至330℃,較佳290至310℃之溫度下進行。在此類情況下,樹脂組分之排出速率在250 rpm之轉速下可為5至50 kg/hr,且考慮到分散性可調節至20至35 kg/hr。特定而言,樹脂組分之排出速率(kg/hr)與螺桿之轉速(rpm)的比率(排出速率/螺桿轉速)較佳為0.08至0.14 kg/hr·rpm。可在混合期間藉由在配備有真空管線之反應器中進行除氣來製備釋氣量進一步減少的混合型聚芳硫醚樹脂。The mixing of the first polyarylene sulfide resin and the second polyarylene sulfide resin and the additive may be performed through melt mixing. The melt mixing can be performed under any conditions as long as the conditions can melt the first polyarylene sulfide resin and the second polyarylene sulfide resin. For example, melt mixing can be carried out in a single-screw or twin-screw compounding extruder, polymerization reactor, kneader reactor, or the like. More specifically, melt mixing can be carried out in a twin-screw extruder, and can be carried out at a temperature of 280 to 330°C, preferably 290 to 310°C. In such a case, the discharge rate of the resin component may be 5 to 50 kg/hr at a rotation speed of 250 rpm, and may be adjusted to 20 to 35 kg/hr in consideration of dispersibility. Specifically, the ratio of the discharge rate (kg/hr) of the resin component to the rotational speed (rpm) of the screw (discharge rate/screw rotational speed) is preferably 0.08 to 0.14 kg/hr·rpm. Hybrid polyarylene sulfide resins with further reduced outgassing can be prepared by degassing in a reactor equipped with a vacuum line during mixing.
以混合型聚芳硫醚樹脂組成物之總重量計,混合型聚芳硫醚樹脂組成物可包含0.1重量%或更大、1重量%或更大、2重量%或更大、5重量%或更大、10重量%或更大、15重量%或更大、20重量%或更大、30重量%或更大、40重量%或更大、45重量%或更大、50重量%或更大、60重量%或更大、或70重量%或更大、及99.9重量%或更小、99重量%或更小、98重量%或更小、95重量%或更小、90重量%或更小、89重量%或更小、85重量%或更小、80重量%或更小、75重量%或更小、70重量%或更小、65重量%或更小、60重量%或更小、55重量%或更小、或50重量%或更小之量的第一聚芳硫醚樹脂。Based on the total weight of the hybrid polyarylene sulfide resin composition, the hybrid polyarylene sulfide resin composition may contain 0.1 wt % or more, 1 wt % or more, 2 wt % or more, 5 wt % or greater, 10 wt% or greater, 15 wt% or greater, 20 wt% or greater, 30 wt% or greater, 40 wt% or greater, 45 wt% or greater, 50 wt% or greater, 60 wt% or greater, or 70 wt% or greater, and 99.9 wt% or less, 99 wt% or less, 98 wt% or less, 95 wt% or less, 90 wt% or less, 89 wt% or less, 85 wt% or less, 80 wt% or less, 75 wt% or less, 70 wt% or less, 65 wt% or less, 60 wt% or The first polyarylene sulfide resin in an amount of lesser, 55 wt % or less, or 50 wt % or less.
另外,以混合型聚芳硫醚樹脂組成物的總重量計,混合型聚芳硫醚樹脂組成物可包含以下之量的第二聚芳硫醚樹脂:0.1重量%或更大、1重量%或更大、2重量%或更大、5重量%或更大、10重量%或更大、15重量%或更大、20重量%或更大、及99.9重量%或更小、99重量%或更小、90重量%或更小、70重量%或更小、50重量%或更小、42重量%或更小、40重量%或更小、38重量%或更小、30重量%或更小、25重量%或更小、20重量%或更小、小於20重量%、15重量%或更小、或10重量%或更小。In addition, based on the total weight of the hybrid polyarylene sulfide resin composition, the hybrid polyarylene sulfide resin composition may contain the second polyarylene sulfide resin in the following amounts: 0.1 wt % or more, 1 wt % or greater, 2 wt% or greater, 5 wt% or greater, 10 wt% or greater, 15 wt% or greater, 20 wt% or greater, and 99.9 wt% or less, 99 wt% or less, 90 wt% or less, 70 wt% or less, 50 wt% or less, 42 wt% or less, 40 wt% or less, 38 wt% or less, 30 wt% or less, 25 wt% or less, 20 wt% or less, less than 20 wt%, 15 wt% or less, or 10 wt% or less.
另外,以混合型聚芳硫醚樹脂組成物之總重量計,混合型聚芳硫醚樹脂組成物可包含10至99.9重量%、更具體言之、20至99重量%、30至99重量%、30至95重量%、30至70重量%或50至70重量%之量的第一聚芳硫醚樹脂及第二聚芳硫醚樹脂。In addition, the hybrid polyarylene sulfide resin composition may contain 10 to 99.9 wt %, more specifically, 20 to 99 wt %, 30 to 99 wt %, based on the total weight of the hybrid polyarylene sulfide resin composition , the first polyarylene sulfide resin and the second polyarylene sulfide resin in an amount of 30 to 95% by weight, 30 to 70% by weight, or 50 to 70% by weight.
以第一聚芳硫醚樹脂及第二聚芳硫醚樹脂之總重量計,混合型聚芳硫醚樹脂組成物可包含30重量%或更小、具體言之、0.0001至30重量%、更具體言之、5重量%或更大、10重量%或更大、15重量%或更大、20重量%或更大、或25重量%或更大、及25重量%或更小、20重量%或更小、15重量%或更小、10重量%或更小、或5重量%或更小之量的第二聚芳硫醚樹脂。若第二聚芳硫醚樹脂在上述範圍內使用,則第一聚芳硫醚樹脂與第二聚芳硫醚樹脂混合的效果變得顯著,藉此減小釋氣量,且可增強模穴平衡及拉伸伸長率。Based on the total weight of the first polyarylene sulfide resin and the second polyarylene sulfide resin, the hybrid polyarylene sulfide resin composition may contain 30% by weight or less, specifically, 0.0001 to 30% by weight, more Specifically, 5 wt% or more, 10 wt% or more, 15 wt% or more, 20 wt% or more, or 25 wt% or more, and 25 wt% or less, 20 wt% % or less, 15 wt% or less, 10 wt% or less, or 5 wt% or less of the second polyarylene sulfide resin. If the second polyarylene sulfide resin is used within the above range, the effect of mixing the first polyarylene sulfide resin with the second polyarylene sulfide resin becomes remarkable, whereby the outgassing amount is reduced, and the cavity balance can be enhanced and tensile elongation.
另外,以混合型聚芳硫醚樹脂組成物之總重量計,該混合型聚芳硫醚樹脂組成物可包含0.01重量%或更大、0.1重量%或更大、1重量%或更大、5重量%或更大、10重量%或更大、20重量%或更大、或30重量%或更大,及90重量%或更小、80重量%或更小、70重量%或更小、60重量%或更小、50重量%或更小、45重量%或更小、40重量%或更小、30重量%或更小、20重量%或更小、或15重量%或更小之量的添加劑。In addition, based on the total weight of the mixed polyarylene sulfide resin composition, the mixed polyarylene sulfide resin composition may contain 0.01 wt % or more, 0.1 wt % or more, 1 wt % or more, 5 wt% or more, 10 wt% or more, 20 wt% or more, or 30 wt% or more, and 90 wt% or less, 80 wt% or less, 70 wt% or less , 60 wt% or less, 50 wt% or less, 45 wt% or less, 40 wt% or less, 30 wt% or less, 20 wt% or less, or 15 wt% or less amount of additives.
更具體而言,以混合型聚芳硫醚樹脂組成物的總重量計,該混合型聚芳硫醚樹脂組成物可包含10至70重量%、10至60重量%、10至50重量%、15至45重量%、20至40重量%、或25至35重量%之量的玻璃纖維,及0.1至20重量%、1至20重量%、5至15重量%、或7至10重量%之量的彈性體。另外,以相同的基礎計算,其可包含0.01至5重量%、0.01至2重量%、或0.05至1重量%之量的熱穩定劑。More specifically, based on the total weight of the mixed polyarylene sulfide resin composition, the mixed polyarylene sulfide resin composition may contain 10 to 70% by weight, 10 to 60% by weight, 10 to 50% by weight, 15 to 45% by weight, 20 to 40% by weight, or 25 to 35% by weight glass fibers, and 0.1 to 20% by weight, 1 to 20% by weight, 5 to 15% by weight, or 7 to 10% by weight amount of elastomer. Additionally, it may include a thermal stabilizer in an amount of 0.01 to 5 wt %, 0.01 to 2 wt %, or 0.05 to 1 wt % on the same basis.
另外,以混合型聚芳硫醚樹脂組成物的總重量計,該混合型聚芳硫醚樹脂組成物可包含10至70重量%之量的玻璃纖維,或分別0.1至20重量%及0.01至5重量%之量的彈性體及熱穩定劑。In addition, based on the total weight of the hybrid polyarylene sulfide resin composition, the hybrid polyarylene sulfide resin composition may contain glass fibers in an amount of 10 to 70 wt %, or 0.1 to 20 wt % and 0.01 to 0.01 wt %, respectively. Elastomer and thermal stabilizer in an amount of 5% by weight.
同時,混合型聚芳硫醚樹脂係指由第一聚芳硫醚與第二聚芳硫醚構成的樹脂,且混合型聚芳硫醚樹脂的熔融黏度、非線性指數、分支比(α)、分子量及熔點如上文關於經後處理之第一聚芳硫醚樹脂所述。Meanwhile, the hybrid polyarylene sulfide resin refers to the resin composed of the first polyarylene sulfide and the second polyarylene sulfide, and the melt viscosity, nonlinear index, branching ratio (α) of the hybrid polyarylene sulfide resin , molecular weight and melting point are as described above for the post-treated first polyarylene sulfide resin.
另外,混合型聚芳硫醚樹脂中之二硫鍵分率可為0.001至10.0重量%,具體言之,0.1重量%或更大、0.3重量%或更大、0.5重量%或更大、0.75重量%或更大,或1.0重量%或更大,且其可為10.0重量%或更小、5.0重量%或更小、2.0重量%或更小、1.8重量%或更小、1.6重量%或更小,或1.4重量%或更小。In addition, the disulfide bond fraction in the hybrid polyarylene sulfide resin may be 0.001 to 10.0 wt %, specifically, 0.1 wt % or more, 0.3 wt % or more, 0.5 wt % or more, 0.75 wt % or more % by weight or more, or 1.0% by weight or more, and it can be 10.0% by weight or less, 5.0% by weight or less, 2.0% by weight or less, 1.8% by weight or less, 1.6% by weight, or less, or 1.4 wt% or less.
混合型聚芳硫醚樹脂可包含衍生自二碘芳族化合物的碘。以混合型聚芳硫醚樹脂之總重量計,碘含量可為1至10,000 ppm,具體言之,5 ppm或更大、10 ppm或更大、20 ppm或更大、40 ppm或更大、100 ppm或更大、500 ppm或更大、或1,000 ppm或更大,且其可為9,000 ppm或更小、8,000 ppm或更小、7,000 ppm或更小、6,000 ppm或更小、5,000 ppm或更小、4,000 ppm或更小、3,000 ppm或更小、2,500 ppm或更小、小於2,300 ppm、2,000 ppm或更小、1,900 ppm或更小、或1,800 ppm或更小。The hybrid polyarylene sulfide resin may contain iodine derived from a diiodo aromatic compound. Based on the total weight of the mixed polyarylene sulfide resin, the iodine content may be 1 to 10,000 ppm, specifically, 5 ppm or more, 10 ppm or more, 20 ppm or more, 40 ppm or more, 100 ppm or more, 500 ppm or more, or 1,000 ppm or more, and it can be 9,000 ppm or less, 8,000 ppm or less, 7,000 ppm or less, 6,000 ppm or less, 5,000 ppm or less, 4,000 ppm or less, 3,000 ppm or less, 2,500 ppm or less, less than 2,300 ppm, 2,000 ppm or less, 1,900 ppm or less, or 1,800 ppm or less.
混合型聚芳硫醚樹脂的結晶溫度可與第二聚芳硫醚樹脂的結晶溫度同樣高。舉例而言,混合型聚芳硫醚樹脂可具有150至300℃、200至280℃、210至260℃、210至270℃、220至260℃、225至255℃、或230至250℃的結晶溫度。隨著混合型聚芳硫醚樹脂之結晶溫度增加,不僅結晶速度增加,而且結晶度亦受影響,藉此可增強包含樹脂之最終組成物的機械特性。The crystallization temperature of the hybrid polyarylene sulfide resin may be as high as the crystallization temperature of the second polyarylene sulfide resin. For example, the hybrid polyarylene sulfide resin may have a crystallinity of 150 to 300°C, 200 to 280°C, 210 to 260°C, 210 to 270°C, 220 to 260°C, 225 to 255°C, or 230 to 250°C temperature. As the crystallization temperature of the hybrid polyarylene sulfide resin increases, not only does the crystallization rate increase, but also the degree of crystallinity is affected, thereby enhancing the mechanical properties of the final composition comprising the resin.
混合型聚芳硫醚樹脂可具有0.001至5重量%的釋氣量,具體言之,0.001重量%或更大、0.01重量%或更大、0.1重量%或更大、0.2重量%或更大、0.3重量%或更大、或0.35重量%或更大,及3重量%或更小、2重量%或更小、1.5重量%或更小、1.4重量%或更小、1.35重量%或更小、1.3重量%或更小、1.2重量%或更小、1.1重量%或更小、1重量%或更小、0.8重量%或更小、0.6重量%或更小、或0.5重量%或更小。The hybrid polyarylene sulfide resin may have an outgassing amount of 0.001 to 5 wt %, specifically, 0.001 wt % or more, 0.01 wt % or more, 0.1 wt % or more, 0.2 wt % or more, 0.3 wt% or more, or 0.35 wt% or more, and 3 wt% or less, 2 wt% or less, 1.5 wt% or less, 1.4 wt% or less, 1.35 wt% or less , 1.3 wt% or less, 1.2 wt% or less, 1.1 wt% or less, 1 wt% or less, 0.8 wt% or less, 0.6 wt% or less, or 0.5 wt% or less .
混合型聚芳硫醚樹脂組成物具有與第一聚芳硫醚樹脂組成物一樣低的釋氣量,具有極佳的模穴平衡,且具有等效於或優於第二聚芳硫醚樹脂的拉伸強度、拉伸伸長率及氣密性。[ 經後處理之混合型聚芳硫醚樹脂組成物 ] The hybrid polyarylene sulfide resin composition has the same low outgassing as the first polyarylene sulfide resin composition, has excellent cavity balance, and has an equivalent or better performance than the second polyarylene sulfide resin. Tensile strength, tensile elongation and air tightness. [ Post-treated mixed polyarylene sulfide resin composition ]
根據一個實施例,提供一種用於墊片的樹脂組成物,其包含:經後處理的第一聚芳硫醚樹脂,其中衍生自增容劑之端基被引入由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂中;由二鹵素芳族化合物及第二硫化合物發生溶液聚合的第二聚芳硫醚樹脂;以及添加劑。According to one embodiment, there is provided a resin composition for a gasket, comprising: a post-treated first polyarylene sulfide resin, wherein end groups derived from a compatibilizer are introduced into In the first polyarylene sulfide resin melt-polymerized with a monosulfur compound and a polymerization inhibitor; the second polyarylene sulfide resin by solution polymerization of a dihalogen aromatic compound and a second sulfur compound; and an additive.
根據另一實施例,提供一種用於製備墊片樹脂組成物的方法,其包含:製備由二碘芳族化合物、第一硫化合物及聚合抑制劑熔融聚合的第一聚芳硫醚樹脂;製備由二鹵素芳族化合物及第二硫化合物進行溶液聚合的第二聚芳硫醚樹脂;將第一聚芳硫醚樹脂及第二聚芳硫醚樹脂與添加劑混合;以及使用增容劑對第一聚芳硫醚樹脂進行後處理。According to another embodiment, there is provided a method for preparing a gasket resin composition, comprising: preparing a first polyarylene sulfide resin melt-polymerized from a diiodo aromatic compound, a first sulfur compound, and a polymerization inhibitor; preparing a second polyarylene sulfide resin that is solution-polymerized from a dihalogen aromatic compound and a second sulfur compound; mixing the first polyarylene sulfide resin and the second polyarylene sulfide resin with additives; and using a compatibilizer for the second polyarylene sulfide resin A polyarylene sulfide resin is post-treated.
經後處理之第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑如上文所述。經後處理之混合型聚芳硫醚樹脂組成物 The post-treated first polyarylene sulfide resin, second polyarylene sulfide resin and additives are as described above. Post-treated mixed polyarylene sulfide resin composition
用於墊片的樹脂組成物(下文中稱為經後處理之混合型聚芳硫醚樹脂組成物)可包含經後處理之第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑。其混合如上文所述。The resin composition for the gasket (hereinafter referred to as the post-treated hybrid polyarylene sulfide resin composition) may include the post-treated first polyarylene sulfide resin, the second polyarylene sulfide resin, and additives . Its mixing is as described above.
然而,第一聚芳硫醚樹脂之後處理可在第一聚芳硫醚樹脂與第二聚芳硫醚樹脂混合之前進行,可與混合同時進行,或可在混合之後進行。另外,其可在混合之前進行且可進一步與混合同時進行或在混合之後進行,且可存在其他組合而不受限制。舉例而言,當將第一聚芳硫醚樹脂及第二聚芳硫醚樹脂進料至雙螺桿擠出機且在其中熔融混合時,可藉由將增容劑添加至雙螺桿擠出機中而對第一聚芳硫醚樹脂進行後處理。在此類情況下,雙螺桿擠出機中之條件可經設置以使得樹脂組分之排出速率(kg/hr)與螺桿轉速(rpm)的比率(排出速率/螺釘轉速)為0.02至0.2 kg/hr·rpm。However, the post-treatment of the first polyarylene sulfide resin may be performed before the first polyarylene sulfide resin and the second polyarylene sulfide resin are mixed, may be performed simultaneously with the mixing, or may be performed after the mixing. Additionally, it may be performed before mixing and may be further performed simultaneously with or after mixing, and other combinations may exist without limitation. For example, when the first polyarylene sulfide resin and the second polyarylene sulfide resin are fed to the twin-screw extruder and melt-mixed therein, the compatibilizer may be added to the twin-screw extruder by adding a compatibilizer to the twin-screw extruder. During the process, the first polyarylene sulfide resin is post-treated. In such a case, the conditions in the twin-screw extruder may be set so that the ratio of the discharge rate (kg/hr) of the resin component to the screw rotation speed (rpm) (discharge rate/screw rotation speed) is 0.02 to 0.2 kg /hr·rpm.
經後處理之混合型聚芳硫醚樹脂的末端可包含諸如羧基、羧酸酯基、羥基、胺基、醯胺基、矽烷基、硫醚基及磺酸酯基等官能基。The end of the post-treated mixed-type polyarylene sulfide resin may contain functional groups such as carboxyl groups, carboxylate groups, hydroxyl groups, amine groups, amide groups, silane groups, thioether groups, and sulfonate groups.
以混合型聚芳硫醚樹脂組成物之總重量計,經後處理之混合型聚芳硫醚樹脂組成物可包含0.1重量%或更大、1重量%或更大、2重量%或更大、5重量%或更大、10重量%或更大、15重量%或更大、20重量%或更大、30重量%或更大、40重量%或更大、45重量%或更大、50重量%或更大、60重量%或更大、或70重量%或更大、及99.9重量%或更小、99重量%或更小、98重量%或更小、95重量%或更小、90重量%或更小、89重量%或更小、85重量%或更小、80重量%或更小、75重量%或更小、70重量%或更小、65重量%或更小、60重量%或更小、55重量%或更小、或50重量%或更小之量的經後處理之第一聚芳硫醚樹脂。Based on the total weight of the mixed polyarylene sulfide resin composition, the post-treated mixed polyarylene sulfide resin composition may contain 0.1 wt % or more, 1 wt % or more, 2 wt % or more , 5 wt% or more, 10 wt% or more, 15 wt% or more, 20 wt% or more, 30 wt% or more, 40 wt% or more, 45 wt% or more, 50 wt% or more, 60 wt% or more, or 70 wt% or more, and 99.9 wt% or less, 99 wt% or less, 98 wt% or less, 95 wt% or less , 90 wt% or less, 89 wt% or less, 85 wt% or less, 80 wt% or less, 75 wt% or less, 70 wt% or less, 65 wt% or less, The post-treated first polyarylene sulfide resin in an amount of 60 wt% or less, 55 wt% or less, or 50 wt% or less.
另外,以經後處理之混合型聚芳硫醚樹脂組成物的總重量計,經後處理之混合型聚芳硫醚樹脂組成物可包含0.1重量%或更大、1重量%或更大、2重量%或更大、5重量%或更大、10重量%或更大、15重量%或更大、或20重量%或更大、及99.9重量%或更小、99重量%或更小、90重量%或更小、70重量%或更小、50重量%或更小、42重量%或更小、40重量%或更小、38重量%或更小、30重量%或更小、25重量%或更小、20重量%或更小、小於20重量%、15重量%或更小、或10重量%或更小之量的第二聚芳硫醚樹脂。In addition, based on the total weight of the post-treated mixed-type polyarylene sulfide resin composition, the post-treated mixed-type polyarylene sulfide resin composition may contain 0.1 wt % or more, 1 wt % or more, 2 wt% or more, 5 wt% or more, 10 wt% or more, 15 wt% or more, or 20 wt% or more, and 99.9 wt% or less, 99 wt% or less , 90 wt% or less, 70 wt% or less, 50 wt% or less, 42 wt% or less, 40 wt% or less, 38 wt% or less, 30 wt% or less, The second polyarylene sulfide resin in an amount of 25 wt% or less, 20 wt% or less, less than 20 wt%, 15 wt% or less, or 10 wt% or less.
另外,以經後處理之混合型聚芳硫醚樹脂組成物的總重量計,經後處理之混合型聚芳硫醚樹脂組成物可包含10至99.9重量%、更具體言之、20至99重量%、30至99重量%、30至95重量%、30至70重量%或50至70重量%之量的經後處理之第一聚芳硫醚樹脂及第二聚芳硫醚樹脂。In addition, based on the total weight of the post-treated mixed-type polyarylene sulfide resin composition, the post-treated mixed-type polyarylene sulfide resin composition may contain 10 to 99.9 wt %, more specifically, 20 to 99 wt % % by weight, 30 to 99% by weight, 30 to 95% by weight, 30 to 70% by weight, or 50 to 70% by weight of the post-treated first polyarylene sulfide resin and the second polyarylene sulfide resin.
以經後處理之第一聚芳硫醚樹脂及第二聚芳硫醚樹脂的總重量計,經後處理之混合型聚芳硫醚樹脂組成物可包含30重量%或更小、具體言之、0.0001至30重量%、更具體言之、5重量%或更大、10重量%或更大、15重量%或更大、20重量%或更大、或25重量%或更大、及25重量%或更小、20重量%或更小、15重量%或更小、10重量%或更小、或5重量%或更小之量的第二聚芳硫醚樹脂。若第二聚芳硫醚樹脂在上述範圍內使用,則將經後處理之第一聚芳硫醚樹脂與第二聚芳硫醚樹脂混合的效果變得顯著,藉此減小釋氣量,且可增強模穴平衡、拉伸強度及拉伸伸長率。Based on the total weight of the post-treated first polyarylene sulfide resin and the second polyarylene sulfide resin, the post-treated hybrid polyarylene sulfide resin composition may contain 30% by weight or less, specifically , 0.0001 to 30% by weight, more specifically, 5% by weight or greater, 10% by weight or greater, 15% by weight or greater, 20% by weight or greater, or 25% by weight or greater, and 25 The second polyarylene sulfide resin in an amount of wt % or less, 20 wt % or less, 15 wt % or less, 10 wt % or less, or 5 wt % or less. If the second polyarylene sulfide resin is used within the above range, the effect of mixing the post-treated first polyarylene sulfide resin with the second polyarylene sulfide resin becomes significant, thereby reducing the outgassing amount, and Can enhance cavity balance, tensile strength and tensile elongation.
另外,以經後處理之混合型聚芳硫醚樹脂組成物的總重量計,經後處理之混合型聚芳硫醚樹脂組成物可包含0.01重量%或更大、0.1重量%或更大、1重量%或更大、5重量%或更大、10重量%或更大、20重量%或更大、或30重量%或更大,及90重量%或更小、80重量%或更小、70重量%或更小、60重量%或更小、50重量%或更小、45重量%或更小、40重量%或更小、30重量%或更小、20重量%或更小、或15重量%或更小之量的添加劑。In addition, based on the total weight of the post-treated mixed-type polyarylene sulfide resin composition, the post-treated mixed-type polyarylene sulfide resin composition may contain 0.01% by weight or more, 0.1% by weight or more, 1 wt% or greater, 5 wt% or greater, 10 wt% or greater, 20 wt% or greater, or 30 wt% or greater, and 90 wt% or less, 80 wt% or less , 70 wt% or less, 60 wt% or less, 50 wt% or less, 45 wt% or less, 40 wt% or less, 30 wt% or less, 20 wt% or less, or additives in an amount of 15% by weight or less.
更具體而言,以經後處理之混合型聚芳硫醚樹脂組成物的總重量計,經後處理之混合型聚芳硫醚樹脂組成物可包含10至70重量%、10至60重量%、10至50重量%、15至45重量%、20至40重量%、或25至35重量%之量的玻璃纖維,及0.1至20重量%、1至20重量%、5至15重量%、或7至10重量%之量的彈性體。另外,以相同的基礎計算,其可包含0.01至5重量%、0.01至2重量%、或0.05至1重量%之量的熱穩定劑。More specifically, based on the total weight of the post-treated mixed-type polyarylene sulfide resin composition, the post-treated mixed-type polyarylene sulfide resin composition may contain 10 to 70 wt %, 10 to 60 wt % , 10 to 50% by weight, 15 to 45% by weight, 20 to 40% by weight, or 25 to 35% by weight of glass fibers, and 0.1 to 20% by weight, 1 to 20% by weight, 5 to 15% by weight, or elastomer in an amount of 7 to 10% by weight. Additionally, it may include a thermal stabilizer in an amount of 0.01 to 5 wt %, 0.01 to 2 wt %, or 0.05 to 1 wt % on the same basis.
另外,以經後處理之混合型聚芳硫醚樹脂組成物的總重量計,經後處理之混合型聚芳硫醚樹脂組成物可包含10至70重量%之量的玻璃纖維,或分別0.1至20重量%及0.01至5重量%之量的彈性體及熱穩定劑。In addition, the post-treated hybrid polyarylene sulfide resin composition may contain glass fibers in an amount of 10 to 70 wt %, or 0.1 wt %, respectively, based on the total weight of the post-treated hybrid polyarylene sulfide resin composition. Elastomers and thermal stabilizers in amounts of to 20% by weight and 0.01 to 5% by weight.
同時,經後處理之混合型聚芳硫醚樹脂係指由經後處理之第一聚芳硫醚及第二聚芳硫醚構成的樹脂,且經後處理之混合型聚芳硫醚樹脂的熔融黏度、非線性指數、分支比(α)、分子量、熔點、二硫鍵分率、碘含量、結晶溫度及釋氣量如上文關於混合型聚芳硫醚樹脂所述。Meanwhile, the post-treated mixed-type polyarylene sulfide resin refers to the resin composed of the post-treated first polyarylene sulfide and the second polyarylene sulfide resin, and the post-treated mixed-type polyarylene sulfide resin has Melt viscosity, nonlinear index, branching ratio (α), molecular weight, melting point, disulfide bond fraction, iodine content, crystallization temperature, and outgassing amount are as described above for the hybrid polyarylene sulfide resin.
經後處理之混合型聚芳硫醚樹脂組成物具有與第一聚芳硫醚樹脂組成物一樣低的釋氣量,具有極佳的模穴平衡,且具有優於第一聚芳硫醚樹脂組成物與第二聚芳硫醚樹脂組成物的機械強度及氣密性。The post-treated mixed-type polyarylene sulfide resin composition has the same low outgassing as the first polyarylene sulfide resin composition, has excellent cavity balance, and is superior to the first polyarylene sulfide resin composition The mechanical strength and air tightness of the composite and the second polyarylene sulfide resin composition.
儘管不受特定理論限制,但藉由第一聚芳硫醚樹脂與第二聚芳硫醚樹脂之反應可達成此效應。具體而言,當將第一聚芳硫醚樹脂與第二聚芳硫醚樹脂混合時,第一聚芳硫醚樹脂之二硫鍵可裂解以進一步與第二聚芳硫醚之末端鹵素反應。因此,由於作為第一聚芳硫醚之弱結構的二硫鍵被移除且分子量增加,並且第二聚芳硫醚之鹵素可另外加以移除,因此可增強機械特性,且可顯著減少釋氣量。While not being bound by a particular theory, this effect is achieved by the reaction of the first polyarylene sulfide resin and the second polyarylene sulfide resin. Specifically, when the first polyarylene sulfide resin is mixed with the second polyarylene sulfide resin, the disulfide bond of the first polyarylene sulfide resin can be cleaved to further react with the terminal halogen of the second polyarylene sulfide resin . Therefore, since the disulfide bond, which is the weak structure of the first polyarylene sulfide, is removed and the molecular weight is increased, and the halogen of the second polyarylene sulfide can be additionally removed, the mechanical properties can be enhanced, and the release can be significantly reduced. air volume.
此外,由於第一聚芳硫醚樹脂經增容劑後處理,因此與具有親水性官能基及/或反應基之其他樹脂及無機填料的相容性得到增強。從而,可增強藉由使用混合樹脂而製成之最終製品的機械強度,且顯著減少因加熱而產生之釋氣量。另外,與在樹脂聚合期間添加相同化合物作為聚合抑制劑之情況相比,增容劑之反應效率明顯極佳,使得最終樹脂中保留的官能基含量可最大化。另外,可達成經由增容劑引入最終樹脂中之官能基的目標含量,同時減少增容劑的使用量。因此,若用增容劑對其進行後處理,則可減少可引起釋氣之聚合抑制劑/增容劑的量,且使增容劑在聚合所需之高溫環境下可能形成的副產物減至最少,藉此進一步減少釋氣量且同時增強相容性,從而得到極佳的模穴平衡且使諸如拉伸強度、拉伸伸長率及氣密性等物理特性得到改良。[ 墊片 ] In addition, since the first polyarylene sulfide resin is post-treated with a compatibilizer, the compatibility with other resins and inorganic fillers having hydrophilic functional groups and/or reactive groups is enhanced. Thus, the mechanical strength of the final product made by using the mixed resin can be enhanced, and the amount of outgassing due to heating can be significantly reduced. In addition, the reaction efficiency of the compatibilizer is remarkably excellent compared to the case where the same compound is added as a polymerization inhibitor during the polymerization of the resin, so that the content of functional groups remaining in the final resin can be maximized. In addition, the target content of functional groups introduced into the final resin via the compatibilizer can be achieved while reducing the amount of compatibilizer used. Therefore, if it is post-treated with a compatibilizer, the amount of polymerization inhibitor/compatibilizer that can cause outgassing can be reduced, and by-products that the compatibilizer may form in the high temperature environment required for polymerization can be reduced At a minimum, outgassing is thereby further reduced and compatibility is enhanced at the same time, resulting in excellent cavity balance and improved physical properties such as tensile strength, tensile elongation, and air tightness. [ gasket ]
根據一個實施例,提供一種墊片,其包含一種用於墊片的樹脂組成物。According to one embodiment, there is provided a gasket including a resin composition for the gasket.
根據另一個實施例,提供一種二次電池,其包含:具有開口的外部主體;用於密封外部主體之開口的密封主體;陽極板、陰極板,及設置於外部主體內的電解質;設置於陽極板與陰極板之間的隔板;與陽極板電連接的陽極端子;與陰極板電連接的陰極端子;以及與陽極端子或陰極端子接觸的二次電池墊片。According to another embodiment, there is provided a secondary battery comprising: an outer body having an opening; a sealing body for sealing the opening of the outer body; an anode plate, a cathode plate, and an electrolyte disposed in the outer body; an anode disposed in the anode A separator between the plate and the cathode plate; an anode terminal electrically connected to the anode plate; a cathode terminal electrically connected to the cathode plate; and a secondary battery gasket in contact with either the anode terminal or the cathode terminal.
用於墊片的樹脂組成物可包含第一聚芳硫醚樹脂、經後處理的第一聚芳硫醚樹脂、第二聚芳硫醚樹脂、混合型聚芳硫醚樹脂,或經後處理的混合型聚芳硫醚樹脂,如上文所述。The resin composition for the gasket may comprise a first polyarylene sulfide resin, a post-treated first polyarylene sulfide resin, a second polyarylene sulfide resin, a hybrid polyarylene sulfide resin, or a post-treated polyarylene sulfide resin mixed polyarylene sulfide resins, as described above.
另外,用於二次電池的墊片可為由用於墊片之樹脂組成物獲得的成型製品。用於墊片的樹脂組成物可藉由不同方法成型為各種形式而不受限制。典型地,可將樹脂組成物切割成球粒,且將球粒供應至模製機且熔融成型以最終獲得具有所要形狀之成型製品。熔融成型可為例如注塑成型、擠出成型、壓縮成型或其類似方式,尤其為注塑成型。用於注塑成型之模具溫度自結晶之觀點來看可為約50℃或更高、60℃或更高,或80℃或更高,且自試樣變形之觀點來看,可為約190℃或更低、170℃或更低,或160℃或更低。成型製品可呈膜、薄片或纖維之各種形式。In addition, the gasket for a secondary battery may be a molded product obtained from the resin composition for the gasket. The resin composition for the gasket can be molded into various forms by various methods without limitation. Typically, the resin composition can be cut into pellets, and the pellets are supplied to a molding machine and melt-molded to finally obtain a molded article having a desired shape. Melt forming can be eg injection moulding, extrusion moulding, compression moulding or the like, especially injection moulding. The mold temperature for injection molding can be about 50°C or higher, 60°C or higher, or 80°C or higher from a crystallization standpoint, and can be about 190°C from a sample deformation standpoint or lower, 170°C or lower, or 160°C or lower. Shaped articles can be in various forms of films, sheets or fibers.
如上文所述之用於墊片的樹脂組成物具有良好的氣密性以及極佳的模穴平衡及機械強度。因此,由於成型缺陷減少,因此其可維持氣密性,即使在施加機械或熱衝擊時,且可改良生產力,藉此,其可有利地用作二次電池墊片。用於實施本發明之實施例 The resin composition for gaskets as described above has good air tightness and excellent cavity balance and mechanical strength. Therefore, since molding defects are reduced, it can maintain airtightness even when mechanical or thermal shock is applied, and productivity can be improved, whereby it can be advantageously used as a secondary battery gasket. Examples for Carrying Out the Invention
下文中將參照實例更詳細描述本發明。以下實例僅說明本發明,且本發明之範疇不限於此。[ 製備實例 ] 1. 第一聚芳硫醚樹脂 製備實例 a1 : PPS a1 之製備 Hereinafter, the present invention will be described in more detail with reference to examples. The following examples only illustrate the present invention, and the scope of the present invention is not limited thereto. [ Preparation Example ] 1. Preparation Example a1 of the First Polyarylene Sulfide Resin : Preparation of PPS a1
向配備有能夠量測反應器內部溫度之熱電偶及能夠進行氮氣吹掃及施加真空之真空管線的5公升反應器中裝入5,240 g對二碘苯及450 g元素硫。將反應器中包含對二碘苯及元素硫之組成物加熱至180℃以使其完全熔融且混合。隨後,進行聚合反應,同時溫度上升且壓力下降,自220℃及350托之初始反應條件逐漸地變化為300℃及1托或更小之最終反應條件。取得聚合反應產物之樣品,且藉由凝膠滲透層析法量測樣品之分子量。當聚合反應產物之重量平均分子量(Mw)達到約15,000公克/莫耳時,添加24 g二硫化二苯(Sigma Aldrich-169021)作為聚合抑制劑,且進行反應1小時。接著,將壓力逐漸降低至0.5托或更小,且進一步進行反應1小時。接著,終止反應,且使用小型線料切割機(strand cutter)將由此製備之樹脂加工成球粒,獲得PPS a1作為第一聚芳硫醚樹脂。製備實例 a2 : 製備 PPS a2 A 5 liter reactor equipped with a thermocouple capable of measuring the internal temperature of the reactor and a vacuum line capable of nitrogen purging and vacuum application was charged with 5,240 g of p-diiodobenzene and 450 g of elemental sulfur. The composition containing p-diiodobenzene and elemental sulfur in the reactor was heated to 180°C to fully melt and mix. Subsequently, the polymerization reaction was carried out while the temperature was increased and the pressure was decreased, gradually changing from the initial reaction conditions of 220°C and 350 Torr to the final reaction conditions of 300°C and 1 Torr or less. A sample of the polymerization product was taken, and the molecular weight of the sample was measured by gel permeation chromatography. When the weight average molecular weight (Mw) of the polymerization reaction product reached about 15,000 g/mol, 24 g of diphenyl disulfide (Sigma Aldrich-169021) was added as a polymerization inhibitor, and the reaction was carried out for 1 hour. Next, the pressure was gradually decreased to 0.5 Torr or less, and the reaction was further performed for 1 hour. Next, the reaction was terminated, and the resin thus prepared was processed into pellets using a small strand cutter to obtain PPS a1 as the first polyarylene sulfide resin. Preparation Example a2 : Preparation of PPS a2
以與製備實例a1相同之方式製備約1,500 g PPS a2作為第一聚芳硫醚樹脂,不同之處在於使用4.5 g 2,2'-二硫二苯甲酸(Sigma Aldrich-43761,純度為95.0%或更高)代替24 g二硫化二苯作為聚合抑制劑。2. 第二聚芳硫醚樹脂 製備實例 b : 製備 PPS b About 1,500 g of PPS a2 was prepared as the first polyarylene sulfide resin in the same manner as in Preparation Example a1, except that 4.5 g of 2,2'-dithiodibenzoic acid (Sigma Aldrich-43761, 95.0% purity was used) or higher) instead of 24 g of diphenyl disulfide as a polymerization inhibitor. 2. Second polyarylene sulfide resin preparation example b : preparation of PPS b
向反應器中裝入3,027 g五水合硫化鈉及5,400 g作為極性有機溶劑之NMP,在氮氣氛圍中將溫度升高至200℃以蒸餾掉水與NMP之混合物。接下來,將2,646 g對二氯苯及17.01 g對氯苯甲酸溶解於2,070 g NMP中之溶液添加至反應器中,且在220至240℃下、在氮氣氛圍中進行聚合反應8至12小時。在反應器冷卻之後,收集且過濾聚合反應產物。濾餅進一步用2,880 g NMP洗滌,將10公升離子交換水添加至含有NMP之濾餅中,且在高壓釜中在200℃下攪拌混合物10分鐘,進一步過濾。最後過濾之濾餅在130℃下乾燥3小時,以製備PPS b作為第二聚芳硫醚樹脂。3. 經後處理之第一聚芳硫醚樹脂 製備實例 c1 : 製備 PPS c1 The reactor was charged with 3,027 g of sodium sulfide pentahydrate and 5,400 g of NMP as a polar organic solvent, and the temperature was raised to 200° C. under a nitrogen atmosphere to distill off the mixture of water and NMP. Next, a solution of 2,646 g of p-dichlorobenzene and 17.01 g of p-chlorobenzoic acid dissolved in 2,070 g of NMP was added to the reactor, and a polymerization reaction was performed at 220 to 240° C. in a nitrogen atmosphere for 8 to 12 hours . After the reactor was cooled, the polymerization product was collected and filtered. The filter cake was further washed with 2,880 g of NMP, 10 liters of ion-exchanged water was added to the filter cake containing NMP, and the mixture was stirred in an autoclave at 200° C. for 10 minutes, and further filtered. The last filtered cake was dried at 130°C for 3 hours to prepare PPS b as the second polyarylene sulfide resin. 3. Preparation Example c1 of the Post-treated First Polyarylene Sulfide Resin : Preparation of PPS c1
將99.7重量份(1,496 g)根據製備實例a1製備之第一聚芳硫醚樹脂(PPS a1)及0.3重量份(4.5 g)作為增容劑之2,2'-二硫二苯甲酸(Sigma Aldrich-43761,純度為95.0%或更高)饋入雙螺桿混料擠出機中且在300℃之溫度下熔融摻混。使用小型線料切割機將熔融摻混的聚芳硫醚樹脂加工成球粒,以製備PPS c1作為經後處理之第一聚芳硫醚樹脂。製備實例 c2 : 製備 PPS c2 99.7 parts by weight (1,496 g) of the first polyarylene sulfide resin (PPS a1) prepared according to Preparation Example a1 and 0.3 parts by weight (4.5 g) of 2,2'-dithiodibenzoic acid (Sigma) as a compatibilizer were used. Aldrich-43761, 95.0% pure or higher) was fed into a twin screw compounding extruder and melt blended at a temperature of 300°C. The melt-blended polyarylene sulfide resin was processed into pellets using a small strand cutter to prepare PPS c1 as the post-treated first polyarylene sulfide resin. Preparation Example c2 : Preparation of PPS c2
以與製備實例c1相同之方式製備PPS c2作為經後處理之第一聚芳硫醚樹脂,不同之處在於使用0.3重量份4,4'-二硫二苯胺(Sigma Aldrich-369462,純度為98%或更高)代替0.3重量份2,2'-二硫二苯甲酸作為增容劑。製備實例 c3 : 製備 PPS c3 PPS c2 was prepared as the post-treated first polyarylene sulfide resin in the same manner as in Preparation Example c1, except that 0.3 parts by weight of 4,4'-dithiodiphenylamine (Sigma Aldrich-369462, 98 purity) was used % or higher) instead of 0.3 parts by weight of 2,2'-dithiodibenzoic acid as a compatibilizer. Preparation Example c3 : Preparation of PPS c3
以與製備實例c1相同之方式製備PPS c3作為經後處理之第一聚芳硫醚樹脂,不同之處在於使用0.3重量份雙(3-羥苯基)二硫醚(TCI (Tokyo Chemical)-B3149,純度為97.0%或更高(GC))代替0.3重量份2,2'-二硫二苯甲酸作為增容劑。製備實例 c4 : 製備 PPS c4 PPS c3 was prepared as the post-treated first polyarylene sulfide resin in the same manner as in Preparation Example c1, except that 0.3 parts by weight of bis(3-hydroxyphenyl) disulfide (TCI (Tokyo Chemical)- B3149, with a purity of 97.0% or higher (GC)) instead of 0.3 parts by weight of 2,2'-dithiodibenzoic acid as a compatibilizer. Preparation Example c4 : Preparation of PPS c4
以與製備實例c1相同之方式製備PPS c4作為經後處理之第一聚芳硫醚樹脂,不同之處在於使用0.3重量份雙(4-羥苯基)二硫醚(TCI (Tokyo Chemical)-B3827,純度為98.0%或更高(GC))代替0.3重量份2,2'-二硫二苯甲酸作為增容劑。製備實例 c5 : 製備 PPS c5 PPS c4 was prepared as the post-treated first polyarylene sulfide resin in the same manner as in Preparation Example c1, except that 0.3 parts by weight of bis(4-hydroxyphenyl)disulfide (TCI (Tokyo Chemical)- B3827, with a purity of 98.0% or higher (GC)) instead of 0.3 parts by weight of 2,2'-dithiodibenzoic acid as a compatibilizer. Preparation Example c5 : Preparation of PPS c5
以與製備實例c1相同之方式製備PPS c5作為經後處理之第一聚芳硫醚樹脂,不同之處在於使用0.3重量份3-(三乙氧基矽烷基)丙-1-硫醇(SiSiB-PC2310, 中國Power Chemical)代替0.3重量份2,2'-二硫二苯甲酸作為增容劑。製備實例 c6 : 製備 PPS c6 PPS c5 was prepared as the post-treated first polyarylene sulfide resin in the same manner as in Preparation Example c1, except that 0.3 parts by weight of 3-(triethoxysilyl)propan-1-thiol (SiSiB -PC2310, China Power Chemical) instead of 0.3 parts by weight of 2,2'-dithiodibenzoic acid as a compatibilizer. Preparation Example c6 : Preparation of PPS c6
以與製備實例c1相同之方式製備PPS c6作為經後處理之第一聚芳硫醚樹脂,不同之處在於使用0.3重量份1,2-雙(3-(三乙氧基矽烷基)丙基)二硫烷(SiSiB-PC2200, 中國Power Chemical)代替0.3重量份2,2'-二硫二苯甲酸作為增容劑。4. 聚芳硫醚樹脂組成物 PPS c6 was prepared as the post-treated first polyarylene sulfide resin in the same manner as in Preparation Example c1, except that 0.3 parts by weight of 1,2-bis(3-(triethoxysilyl)propyl) was used ) disulfane (SiSiB-PC2200, China Power Chemical) instead of 0.3 parts by weight of 2,2'-dithiodibenzoic acid as a compatibilizer. 4. Polyarylene sulfide resin composition
將根據製備實例製備的第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及經後處理之第一聚芳硫醚樹脂以下表1至5中所示的重量比饋送至雙螺桿混料擠壓機(TEM-35B,Toshiba Kikai Corporation)且在300℃下熔融摻混。使用小型線料切割機將其加工成球粒,以製備聚芳硫醚樹脂組成物(添加劑混合之前的組成物)。隨後,使用轉筒將聚芳硫醚樹脂組成物與玻璃纖維、彈性體及熱穩定劑以下表1至4中所示的重量比均一地混合且在300℃下經由雙螺桿混料擠出機(TEM-35B,Toshiba Kikai Corporation)熔融摻混。使用小型線料切割機將其加工成球粒,以製備聚芳硫醚樹脂組成物(添加劑混合之後的組成物)。The first polyarylene sulfide resin, the second polyarylene sulfide resin, and the post-treated first polyarylene sulfide resin prepared according to the preparation examples were fed to the twin-screw compound in the weight ratios shown in the following Tables 1 to 5 Extruder (TEM-35B, Toshiba Kikai Corporation) and melt blending at 300°C. This was processed into pellets using a small wire cutter to prepare a polyarylene sulfide resin composition (the composition before the additives were mixed). Subsequently, the polyarylene sulfide resin composition was uniformly mixed with glass fibers, elastomers, and heat stabilizers in the weight ratios shown in the following Tables 1 to 4 using a rotating drum and passed through a twin-screw compounding extruder at 300° C. (TEM-35B, Toshiba Kikai Corporation) melt blending. This was processed into pellets using a small wire cutter to prepare a polyarylene sulfide resin composition (the composition after additive mixing).
具體而言,獲得PPS A1-1至PPS A2作為第一聚芳硫醚樹脂組成物、PPS B1及PPS B2作為第二聚芳硫醚樹脂組成物、PPS C1-1至PPS C2作為經後處理之第一聚芳硫醚樹脂組成物、PPS D1-1至PPS D2-5作為混合型聚芳硫醚樹脂組成物,及PPS E1-1至PPS E2-4作為經後處理之混合型聚芳硫醚樹脂組成物。
[表1]
玻璃纖維、彈性體及熱穩定劑具體顯示於下表6中。
[表6]
根據以下方法,針對根據上述製備實例製備之聚芳硫醚樹脂組成物,量測/推導該等組成物在添加劑混合之前的熔點、結晶溫度、熔融黏度、非線性指數、分子量、分支比、二硫鍵分率、釋氣量及碘含量,且量測/推導該等組成物在添加劑混合之後的釋氣量、模穴平衡、拉伸強度、拉伸伸長率及氣密性。結果顯示於下表7至13中。(1) 熔點 (Tm) 及結晶溫度 (Tc) According to the following method, for the polyarylene sulfide resin composition prepared according to the above preparation example, the melting point, crystallization temperature, melt viscosity, nonlinear index, molecular weight, branch ratio, dichondral Sulfur bond fraction, outgassing and iodine content, and measuring/deriving outgassing, cavity balance, tensile strength, tensile elongation and air tightness of these compositions after additive mixing. The results are shown in Tables 7 to 13 below. (1) Melting point (Tm) and crystallization temperature (Tc)
在差示掃描量熱計(DSC,TA Instrument之Q20型)中以10℃/分鐘之速率將溫度自30℃升高至320℃,且接著以10℃/分鐘之速率將溫度冷卻至30℃,隨後以10℃/分鐘之速率再次將溫度自30℃升高至320℃,以量測熔點及結晶溫度。(2) 熔融黏度 (MV) 及非線性指數 The temperature was increased from 30°C to 320°C at a rate of 10°C/min in a differential scanning calorimeter (DSC, model Q20 from TA Instrument) and then cooled to 30°C at a rate of 10°C/min , and then the temperature was again increased from 30°C to 320°C at a rate of 10°C/min to measure the melting point and crystallization temperature. (2) Melt viscosity (MV) and nonlinear index
熔融黏度定義為當藉由頻率掃描法在300℃下用旋轉圓盤黏度計在0.6至500 rad/s之角頻率範圍內量測黏度時,在1.84 rad/s之角頻率條件下的黏度。Melt viscosity is defined as the viscosity at an angular frequency of 1.84 rad/s when the viscosity is measured by the frequency sweep method at 300°C with a rotating disk viscometer in the angular frequency range of 0.6 to 500 rad/s.
非線性指數藉由以下方程式2計算。 [方程式2] 非線性指數 = 1 - (17.3 s-1 剪切速率下的熔融黏度) / (3.22 s-1 剪切速率下的熔融黏度)(3) 數目平均分子量 (Mn) 、重量平均分子量 (Mw) 及峰值分子量 (Mp) The nonlinear index is calculated by Equation 2 below. [Equation 2] Nonlinear exponent = 1 - (melt viscosity at 17.3 s -1 shear rate) / (melt viscosity at 3.22 s -1 shear rate) (3) number average molecular weight (Mn) , weight average molecular weight (Mw) and peak molecular weight (Mp)
聚芳硫醚樹脂組成物的數目平均分子量、重量平均分子量及峰值分子量各自在以下量測條件下藉由凝膠滲透層析法量測。在分子量之所有量測方式中,使用六種類型的單分散聚苯乙烯用於校準。 [凝膠滲透層析法之量測條件] 儀器:Agilent PL-220 管柱:Agilent,PLgel孔徑105Å + 104Å + 500Å + 50Å (4個管柱) 管柱溫度:210℃ 溶劑:1-氯萘 量測方法:三重系統偵測器(RI、黏度計、光散射器15°及90°)(4) 分支比 (α) The number average molecular weight, weight average molecular weight, and peak molecular weight of the polyarylene sulfide resin composition were each measured by gel permeation chromatography under the following measurement conditions. In all measures of molecular weight, six types of monodisperse polystyrene were used for calibration. [Measurement conditions for gel permeation chromatography] Instrument: Agilent PL-220 Column: Agilent, PLgel pore size 105Å + 104Å + 500Å + 50Å (4 columns) Column temperature: 210°C Solvent: 1-chloronaphthalene Measurement method: triple system detector (RI, viscometer, light diffuser 15° and 90°) (4) Branch ratio (α)
分支比定義為藉由將三重系統偵測器所量測之黏度應用於以下方程式3之馬克-霍溫克方程式(Mark-Howink equation)而計算出的α值。馬克-霍溫克方程式為聚合物之分子量與固有黏度之間的關係式,且分支比(α)表示聚合物之分支度。亦即,值愈接近1,則聚合物線性程度愈高。值愈接近0,則聚合物分支程度愈高。 [方程式3] [η] = KХMα The branching ratio is defined as the value of alpha calculated by applying the viscosity measured by the triple system detector to the Mark-Howink equation of Equation 3 below. The Mark-Houwink equation is a relational expression between the molecular weight of the polymer and the intrinsic viscosity, and the branching ratio (α) represents the degree of branching of the polymer. That is, the closer the value is to 1, the more linear the polymer is. The closer the value is to 0, the higher the degree of polymer branching. [Equation 3] [η] = KХM α
在上述方程式中,η為固有黏度,M為重量平均分子量,且K為常數。(5) 二硫鍵 (-S-S-) 分率 In the above equation, η is the intrinsic viscosity, M is the weight average molecular weight, and K is a constant. (5) Disulfide bond (-SS-) fraction
二硫鍵分率係根據以下方程式1計算。 [方程式1] 二硫鍵分率(重量%) = {(藉由元素分析偵測之硫總重量) - (聚芳硫醚中之理論硫重量)} / (聚芳硫醚中之理論硫重量)(6) 釋氣量 The disulfide bond fraction is calculated according to Equation 1 below. [Equation 1] Disulfide bond fraction (wt%) = {(total sulfur weight detected by elemental analysis) - (theoretical sulfur weight in polyarylene sulfide)} / (theoretical sulfur in polyarylene sulfide Weight) (6) Outgassing
添加劑混合之前的組成物:使用氣相層析(GC)質譜儀對預定量之聚芳硫醚樹脂組成物樣品在330℃下加熱30分鐘時所產生之氣體的量進行定量(重量百分比)。Composition before additive mixing: The amount of gas generated when a predetermined amount of a sample of the polyarylene sulfide resin composition was heated at 330° C. for 30 minutes was quantified (weight percent) using a gas chromatography (GC) mass spectrometer.
添加劑混合之後的組成物:使用氣相層析(GC)質譜儀對預定量之聚芳硫醚樹脂組成物樣品在325℃下加熱15分鐘時所產生之氣體的量進行定量(重量百分比)。(7) 碘含量 Composition after additive mixing: The amount of gas generated when a predetermined amount of a sample of the polyarylene sulfide resin composition was heated at 325°C for 15 minutes was quantified (weight percent) using a gas chromatography (GC) mass spectrometer. (7) Iodine content
聚芳硫醚樹脂組成物中之碘含量係藉由離子層析法(IC)、使用Thermo Scientific之IC (AQF)及ICS-2500 (Mitsubishi AQF-100)來量測。(8) 模穴平衡 The iodine content in the polyarylene sulfide resin composition was measured by ion chromatography (IC) using Thermo Scientific IC (AQF) and ICS-2500 (Mitsubishi AQF-100). (8) Cavity balance
使用具有40個模穴之洗滌器模具,在最小成型條件下,將聚芳硫醚樹脂組成物各自注塑成型,其中最接近主要線軸之位置的模穴(C1)被完全填充。成型條件設置成75噸模製機、320℃之料筒溫度、140℃之模具溫度及無固持壓力。在與模穴(C1)相同流道中之模穴中,最遠離主要線軸之模穴(C10)的填充度(重量%)係按照模穴(C10)之成型產品與模穴(C1)之成型產品的重量比計算。模穴(C10)之填充度愈高,則模穴平衡愈佳。因此,各聚芳硫醚樹脂組成物之模穴平衡係根據填充度、基於以下準則評價。 AA:90重量%或更大 A:80重量%至小於90重量% B:70重量%至小於80重量% C:60重量%至小於70重量% D:小於60重量%(9) 拉伸強度及拉伸伸長率 Using a washer mold with 40 cavities, the polyarylene sulfide resin compositions were each injection molded under minimum molding conditions, wherein the cavity (C1) at the position closest to the main spool was completely filled. The molding conditions were set to a 75-ton molding machine, a barrel temperature of 320°C, a mold temperature of 140°C, and no holding pressure. Among the cavities in the same runner as the cavity (C1), the filling degree (% by weight) of the cavity (C10) farthest from the main bobbin is based on the molding product of the cavity (C10) and the molding of the cavity (C1) Product weight ratio calculation. The higher the filling degree of the cavity (C10), the better the cavity balance. Therefore, the cavity balance of each polyarylene sulfide resin composition was evaluated based on the filling degree based on the following criteria. AA: 90% by weight or more A: 80% by weight to less than 90% by weight B: 70% by weight to less than 80% by weight C: 60% by weight to less than 70% by weight D: less than 60% by weight (9) Tensile strength and tensile elongation
聚芳硫醚樹脂組成物之拉伸強度及拉伸伸長率係使用Zwick之Z010、根據ISO 527-2方法來量測。(10) 氣密性 The tensile strength and tensile elongation of the polyarylene sulfide resin composition were measured using Zwick's Z010 according to the ISO 527-2 method. (10) Air tightness
將聚芳硫醚樹脂組成物加工成具有8 mm (長度)×8 mm (寬度)×10 mm (厚度)之盒形狀的成型製品。將電解質注射至成型製品中,且在恆定應力下(在10%應變下)用壓縮應力鬆弛測試中所用的8 mm (長度)×8 mm (寬度)×3 mm (厚度)平板密封以製備樣品用於氣密性測試。在此,電解質為其中LiPF6
以1莫耳/公升之濃度溶解於碳酸伸乙酯與碳酸二甲酯混合溶劑(1:1體積比)中的溶液。用於氣密性測試的樣品在60℃的乾熱下保持100小時,且檢查電解質的滲漏程度。基於以下準則評估結果。
○: 100小時之後,電解質不滲漏
×: 100小時之後,電解質滲漏經後處理之第一聚芳硫醚樹脂組成物
[表7]
如自上表可見,相較於包含未經增容劑後處理之第一聚芳硫醚樹脂及添加劑的PPS A1-1及包含藉由使用式4化合物作為聚合抑制劑所製備之第一聚芳硫醚樹脂及添加劑的PPS A1-2,包含經增容劑後處理之第一聚芳硫醚樹脂及添加劑的PPS C1-1至PPS C1-9維持良好的釋氣量,同時其在模穴平衡、拉伸強度、拉伸伸長率及氣密性所有方面皆極佳。
[表8]
如自上表可見,相較於包含未經增容劑後處理之第一聚芳硫醚樹脂及添加劑的PPS A2,包含經增容劑後處理之第一聚芳硫醚樹脂及添加劑的PPS C2維持良好的釋氣量,同時其在模穴平衡、拉伸強度、拉伸伸長率及氣密性所有方面皆極佳。混合型聚芳硫醚樹脂組成物
[表9]
如自上表可見,相較於包含第一聚芳硫醚樹脂及添加劑的PPS A1-1,包含第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑的PPS D1-1至PPS D1-3及PPS D1-6至PPS D1-8在模穴平衡、拉伸強度、拉伸伸長率及氣密性方面極佳。相較於包含第二聚芳硫醚樹脂及添加劑的PPS B1,其在釋氣量、模穴平衡及拉伸伸長率方面極佳。As can be seen from the above table, compared to PPS A1-1 comprising the first polyarylene sulfide resin and the additive, the PPS D1-1 to PPS comprising the first polyarylene sulfide resin, the second polyarylene sulfide resin and the additive D1-3 and PPS D1-6 to PPS D1-8 are excellent in cavity balance, tensile strength, tensile elongation and air tightness. Compared to PPS B1 comprising the second polyarylene sulfide resin and additives, it is excellent in outgassing amount, cavity balance and tensile elongation.
儘管進一步包含彈性體作為添加劑之PPS D1-7及PPS D1-8的拉伸強度稍微低於PPS D1-1至PPS D1-6,但其仍具有高於PPS A1-1的拉伸強度及明顯高於PPS A1-1及PPS B1的拉伸伸長率。Although the tensile strengths of PPS D1-7 and PPS D1-8 further comprising an elastomer as an additive were slightly lower than those of PPS D1-1 to PPS D1-6, they still had higher tensile strengths and significantly higher tensile strengths than PPS A1-1. The tensile elongation is higher than that of PPS A1-1 and PPS B1.
另外,相較於以第一聚芳硫醚樹脂與第二聚芳硫醚樹脂之總重量計具有超過30重量%之第二聚芳硫醚樹脂含量的PPS D1-4及PPS D1-5,PPS D1-1至PPS D1-3及PPS D1-6至PPS D1-8在釋氣量、模穴平衡及拉伸伸長率方面明顯極佳。
[表10]
如自上表可見,相較於包含第一聚芳硫醚樹脂及添加劑的PPS A2-1,包含第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑的PPS D2-1至PPS D2-3及PPS D2-5在模穴平衡、拉伸強度、拉伸伸長率及氣密性方面極佳。相較於包含第二聚芳硫醚樹脂及添加劑的PPS B2,其在釋氣量、模穴平衡及拉伸伸長率方面極佳。As can be seen from the above table, compared to PPS A2-1 comprising the first polyarylene sulfide resin and the additive, the PPS D2-1 to PPS comprising the first polyarylene sulfide resin, the second polyarylene sulfide resin and the additive D2-3 and PPS D2-5 are excellent in cavity balance, tensile strength, tensile elongation and air tightness. Compared to PPS B2 containing the second polyarylene sulfide resin and additives, it is excellent in outgassing, cavity balance and tensile elongation.
另外,相較於以第一聚芳硫醚樹脂與第二聚芳硫醚樹脂之總重量計具有超過30重量%之第二聚芳硫醚樹脂含量的PPS D2-4,PPS D2-1至PPS D2-3及PPS D2-5在釋氣量、模穴平衡及拉伸伸長率方面明顯極佳。In addition, compared to PPS D2-4 having a second polyarylene sulfide resin content of more than 30% by weight based on the total weight of the first polyarylene sulfide resin and the second polyarylene sulfide resin, PPS D2-1 to PPS D2-3 and PPS D2-5 are clearly excellent in outgassing, cavity balance and tensile elongation.
詳言之,相較於不包含熱穩定劑的PPS D2-5,進一步包含熱穩定劑作為添加劑的PPS D2-1至PPS D2-3在拉伸強度及拉伸伸長率方面明顯極佳。經後處理之混合型聚芳硫醚樹脂組成物
[表11]
如自上表可見,相較於包含第一聚芳硫醚樹脂及添加劑的PPS A1-1,包含經後處理之第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑的PPS E1-1至PPS E1-3及PPS E1-6至PPS E1-13在模穴平衡、拉伸強度、拉伸伸長率及氣密性方面極佳。相較於包含第二聚芳硫醚樹脂及添加劑的PPS B1,其在釋氣量、模穴平衡及拉伸伸長率方面極佳。相較於包含第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑的PPS D1-2,其在模穴平衡及拉伸伸長率方面極佳。As can be seen from the above table, compared to PPS A1-1 comprising the first polyarylene sulfide resin and the additive, the PPS E1 comprising the post-treated first polyarylene sulfide resin, the second polyarylene sulfide resin and the additive -1 to PPS E1-3 and PPS E1-6 to PPS E1-13 are excellent in cavity balance, tensile strength, tensile elongation and air tightness. Compared to PPS B1 comprising the second polyarylene sulfide resin and additives, it is excellent in outgassing amount, cavity balance and tensile elongation. Compared to PPS D1-2 comprising the first polyarylene sulfide resin, the second polyarylene sulfide resin and additives, it is excellent in cavity balance and tensile elongation.
儘管進一步包含彈性體作為添加劑之PPS E1-7及PPS E1-13的拉伸強度稍微低於PPS E1-1至PPS E1-6,但其仍具有高於PPS A1-1的拉伸強度及明顯高於PPS A1-1、PPS B1及PPS D1-2的拉伸伸長率。Although the tensile strengths of PPS E1-7 and PPS E1-13 further comprising an elastomer as an additive were slightly lower than those of PPS E1-1 to PPS E1-6, they still had higher tensile strengths and significantly higher tensile strengths than PPS A1-1. Higher tensile elongation than PPS A1-1, PPS B1 and PPS D1-2.
另外,相較於以第一聚芳硫醚樹脂與第二聚芳硫醚樹脂之總重量計具有超過30重量%之第二聚芳硫醚樹脂含量的PPS E1-4及PPS E1-5,PPS E1-1至PPS E1-3及PPS E1-6至PPS E1-13在釋氣量、模穴平衡及拉伸伸長率方面極佳。
[表13]
如自上表可見,相較於包含第一聚芳硫醚樹脂及添加劑的PPS A2,包含經後處理之第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑的PPS E2-1至PPS E2-3在模穴平衡、拉伸強度、拉伸伸長率及氣密性方面極佳。相較於包含第二聚芳硫醚樹脂及添加劑的PPS B2,其在釋氣量、模穴平衡、拉伸強度及拉伸伸長率方面極佳。相較於包含第一聚芳硫醚樹脂、第二聚芳硫醚樹脂及添加劑的PPS D2-2,其在模穴平衡及拉伸伸長率方面極佳。As can be seen from the table above, the PPS E2-1 comprising the post-treated first polyarylene sulfide resin, the second polyarylene sulfide resin and the additive is compared to the PPS A2 comprising the first polyarylene sulfide resin and the additive To PPS E2-3 is excellent in cavity balance, tensile strength, tensile elongation and air tightness. Compared to PPS B2 comprising the second polyarylene sulfide resin and additives, it is excellent in outgassing, cavity balance, tensile strength and tensile elongation. Compared with PPS D2-2 comprising the first polyarylene sulfide resin, the second polyarylene sulfide resin and additives, it is excellent in cavity balance and tensile elongation.
另外,相較於以第一聚芳硫醚樹脂與第二聚芳硫醚樹脂之總重量計具有超過30重量%之第二聚芳硫醚樹脂含量的PPS E2-4,PPS E2-1至PPS E2-3在釋氣量、模穴平衡、拉伸強度及拉伸伸長率方面極佳。In addition, compared to PPS E2-4 having a second polyarylene sulfide resin content of more than 30% by weight based on the total weight of the first polyarylene sulfide resin and the second polyarylene sulfide resin, PPS E2-1 to PPS E2-3 is excellent in outgassing, cavity balance, tensile strength and tensile elongation.
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