TW202142825A - Compound wick structure of vapor chamber - Google Patents

Compound wick structure of vapor chamber Download PDF

Info

Publication number
TW202142825A
TW202142825A TW109115620A TW109115620A TW202142825A TW 202142825 A TW202142825 A TW 202142825A TW 109115620 A TW109115620 A TW 109115620A TW 109115620 A TW109115620 A TW 109115620A TW 202142825 A TW202142825 A TW 202142825A
Authority
TW
Taiwan
Prior art keywords
plate
sintered powder
uniform temperature
sintered
temperature plate
Prior art date
Application number
TW109115620A
Other languages
Chinese (zh)
Other versions
TWI803749B (en
Inventor
張健
熊惜文
賴湖興
Original Assignee
奇鋐科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奇鋐科技股份有限公司 filed Critical 奇鋐科技股份有限公司
Priority to TW109115620A priority Critical patent/TWI803749B/en
Publication of TW202142825A publication Critical patent/TW202142825A/en
Application granted granted Critical
Publication of TWI803749B publication Critical patent/TWI803749B/en

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Catching Or Destruction (AREA)

Abstract

The present invention provides a compound wick structure of a vapor chamber, which comprises a first plate and a second plate. The first plate has a first side and a second side. The second plate has a third side and a fourth side. The first plate and the second plate are assembled together to form a sealed chamber. The third side of the second plate is provided with a mesh or a fiber body; the third side has at least one heated zone having a first sintered-powder structure. The first sintered-powder structure is selected to be connected to or in contact with the mesh or the fiber body. A working liquid is disposed in the sealed chamber. By means of the arrangement of the compound wick structure, the vertical and horizontal flow-back efficiencies of the working liquid are enhanced and the efficiency of liquid-vapor cycle is increased.

Description

均溫板複合式毛細結構Compound capillary structure of uniform temperature plate

一種均溫板複合式毛細結構,尤指一種結合網格體及燒結粉末或其他複數種類毛細結構兩相流之特性的均溫板複合式毛細結構。A composite capillary structure with a uniform temperature plate, especially a composite capillary structure with a uniform temperature plate that combines the characteristics of a two-phase flow of a grid body and a sintered powder or other multiple types of capillary structures.

現行均溫板係為一種透過兩相流熱交換原理的熱傳元件,並常被應用於大面積的面與面的熱傳導工作上使用,並由於其具有大的接觸面積,故針對面與面的快速均溫熱傳導相當快速及均熱。 均溫板內部具有一氣密腔室,並於氣密腔室接觸熱源的一側上設置毛細結構作為吸水及回水使用,同時在氣密腔室抽真空同時填充入工作液體作為兩相流熱交換使用,習知均溫板毛細結構為具有較佳之毛細力大都係選用燒結粉末透過燒結之方式燒結於氣密腔室表面,燒結完成之粉末結構具有多孔隙之特性可產生毛細力,進而將冷凝後的工作液體回流及吸附於受熱蒸發區域。 均溫板受熱區域的工作液體於受熱蒸發後擴散至冷凝區域再凝結成液態,再透過重力滴落由燒結粉末所形成的毛細結構吸附回流於蒸發區域,傳統由燒結粉末所形成之毛細結構對於水平方向的工作液體回流效果較為不佳,若當均溫板整體面積以寬及長的方式設置,則因水平方向的回水效率效果較為不佳,故如何令均溫板垂直及水平方向均具有快速的回水效率則為該項業者待改善之處。The current uniform temperature plate is a kind of heat transfer element through the principle of two-phase flow heat exchange, and is often used in large-area surface-to-surface heat conduction work, and because of its large contact area, it is aimed at surface-to-surface heat transfer. The heat conduction is very fast and even heat. There is an airtight chamber inside the temperature equalizing plate, and a capillary structure is set on the side of the airtight chamber that contacts the heat source for water absorption and return. At the same time, the airtight chamber is evacuated and filled with working liquid as a two-phase flow heat Used interchangeably, the capillary structure of the conventional uniform temperature plate has better capillary force. Most of the sintered powders are sintered on the surface of the airtight chamber through sintering. The sintered powder structure has the characteristics of porosity to generate capillary force, and then The condensed working liquid is refluxed and absorbed in the heated evaporation area. The working fluid in the heated area of the uniform temperature plate diffuses to the condensing area and condenses into a liquid after being heated and evaporated, and then drops the capillary structure formed by the sintered powder by gravity to the evaporation area. The traditional capillary structure formed by the sintered powder is effective The return effect of the working fluid in the horizontal direction is relatively poor. If the overall area of the uniform temperature plate is set in a wide and long manner, the effect of the return water efficiency in the horizontal direction is relatively poor, so how to make the uniform temperature plate both vertical and horizontal The fast water return efficiency is what the industry needs to improve.

爰此,為有效解決上述之問題,本發明之主要目的,係提供一種擷取複數種毛細結構之特性並組合使用,藉以同時擁有複數種類毛細結構汽液循環之特性者。 為達上述之目的,本發明係提供一種均溫板複合式毛細結構,係包含:一第一板體、一第二板體; 所述第一板體具有一第一側及一第二側;所述第二板體具有一第三側及一第四側,所述第一、二板體對應蓋合形成一氣密腔室,所述第二板體之第三側貼設有一網格體或纖維體,並該第三側具有至少一受熱區,所述受熱區係設置一第一燒結粉末結構並選擇與前述網格體或纖維體形成接觸或連接,該氣密腔室內填充有一工作液體。 本發明綜合網格體或纖維體及燒結粉末等毛細結構之毛細特性,藉以綜合應用兩者之特性補足兩者不足之缺失,進而提升均溫板汽液循環之效率者。Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a method that captures the characteristics of multiple capillary structures and uses them in combination, thereby simultaneously possessing the characteristics of the vapor-liquid circulation of multiple types of capillary structures. In order to achieve the above objective, the present invention provides a composite capillary structure of uniform temperature plate, which includes: a first plate body and a second plate body; The first plate has a first side and a second side; the second plate has a third side and a fourth side, and the first and second plates are correspondingly covered to form an airtight chamber , The third side of the second plate body is attached with a grid body or fiber body, and the third side has at least one heated area, and the heated area is provided with a first sintered powder structure and is selected to be the same as the aforementioned grid The body or fiber body forms contact or connection, and the airtight chamber is filled with a working fluid. The present invention integrates the capillary characteristics of the capillary structure such as the mesh body or the fibrous body and the sintered powder, and uses the characteristics of the two to make up for the deficiency of the two, thereby improving the efficiency of the vapor-liquid circulation of the uniform temperature plate.

本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 請參閱第1a、1b、2圖,係為本發明之均溫板複合式毛細結構之第一實施例立體分解及組合圖,如圖所示,所述均溫板複合式毛細結構,係包含:一第一板體11、一第二板體12; 所述第一板體11具有一第一側111及一第二側112,所述第一、二側111、112分設於該第一板體11之上、下兩側。 所述第二板體12具有一第三側121及一第四側122,所述第三、四側121、122分設於該第二板體12之上、下兩側,所述第一、二板體11、12對應蓋合形成一氣密腔室13,所述第二板體12之第三側121設有一網格體2,並該第三側121具有至少一受熱區1211,所述受熱區1211具有一第一燒結粉末結構1211a,並選擇與前述網格體或纖維體2、2’ (如第1b圖)接觸或連接,本實施例係以所述第一燒結粉末結構1211a係與該網格體2接觸作為說明實施例,亦可為部分接觸部分連接,但並不引以為限,即所述網格體或纖維體2、2’(如第1b圖)環繞於第一燒結粉末結構1211a的外緣向外延伸設置,並該氣密腔室13內填充有一工作液體3。 所述受熱區1211於本實施例係選擇設於所述第二板體12靠近中央處作說明,並該受熱區1211之第一燒結粉末結構1211a燒結形成方形。 所述第一、二板體11、12係為銅、鋁、不銹鋼、陶瓷、商業純鈦、鈦合金、銅合金、鋁合金其中任一材質,並該第一、二板體11、12可為相同或相異材質之組合。 請參閱第3圖,係為本發明之均溫板複合式毛細結構之第二實施例組合剖視圖,如圖所示,本實施例與前述第一實施例部分結構相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於,該氣密腔室13內具有一支撐結構14,該支撐結構14由複數實心柱、中空環、粉末燒結柱體其中任一所組成,並該支撐結構14兩端分別抵頂該第二、三側112、121,藉此增加均溫板之氣密腔室13的支撐度避免塌陷。 請參閱第4圖,係為本發明之均溫板複合式毛細結構之第三實施例組合剖視圖,如圖所示,本實施例與前述第一實施例部分結構相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於,所述第一燒結粉末結構1211a中央處具有一第二燒結粉末結構1211c,所述第一燒結粉末結構1211a之孔隙率大於該第二燒結粉末結構1211c,藉此可透過不同孔隙率之燒結粉末增加受熱區1211含水量。 請參閱第5圖,係為本發明之均溫板複合式毛細結構之第四實施例組合剖視圖,如圖所示,本實施例與前述第一實施例部分結構相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於,所述第二板體12中央處之受熱區係形成有一凹部12a,所述凹部12a由該第二板體12之第三側121向該第四側122凸伸所形成,所述第一燒結粉末1211a係填設於該凹部12a內(可齊平或凹陷或凸出該凹部),本實施例可透過凹部12a的設置由第四側122產生凸起與一熱源4相接觸,提升與熱源4接觸之熱傳效率。 本發明上述各實施例由網格體或纖維體與燒結粉末結構共同結合使用,係可由網格體或纖維體補強均溫板水平方向之回水能力,同時再由燒結粉末結構提升受熱區域之含水量避免乾燒之情況產生,藉由本發明之複合毛細結構之組合使用進一步改善了習知均溫板僅具有垂直方向的汽液循環效果,欠缺水平方向的汽液循環效果等缺失。The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 1a, 1b, and 2, which are the three-dimensional exploded and combined diagrams of the first embodiment of the composite capillary structure of the uniform temperature plate of the present invention. As shown in the figure, the composite capillary structure of the uniform temperature plate includes :A first board body 11, a second board body 12; The first board 11 has a first side 111 and a second side 112, and the first and second sides 111 and 112 are separately provided on the upper and lower sides of the first board 11. The second board body 12 has a third side 121 and a fourth side 122. The third and fourth sides 121, 122 are separately provided on the upper and lower sides of the second board body 12. , The two plates 11 and 12 are correspondingly covered to form an airtight chamber 13. The third side 121 of the second plate 12 is provided with a mesh body 2, and the third side 121 has at least one heated area 1211, so The heated zone 1211 has a first sintered powder structure 1211a, and is selected to be in contact with or connected to the aforementioned mesh or fibrous body 2, 2'(as shown in Figure 1b). In this embodiment, the first sintered powder structure 1211a is used. The contact with the mesh body 2 is taken as an illustrative embodiment, and it can also be partly contacted partly connected, but it is not limited to that, that is, the mesh body or fiber body 2, 2'(as shown in Figure 1b) surrounds The outer edge of the first sintered powder structure 1211a extends outward, and the airtight chamber 13 is filled with a working liquid 3. The heat-receiving area 1211 is chosen to be located near the center of the second plate body 12 for illustration in this embodiment, and the first sintered powder structure 1211a of the heat-receiving area 1211 is sintered to form a square shape. The first and second plate bodies 11, 12 are made of any material of copper, aluminum, stainless steel, ceramic, commercial pure titanium, titanium alloy, copper alloy, and aluminum alloy, and the first and second plate bodies 11, 12 can be It is a combination of the same or different materials. Please refer to Figure 3, which is a combined cross-sectional view of the second embodiment of the composite capillary structure of the temperature equalizing plate of the present invention. As shown in the figure, this embodiment has the same structure as the first embodiment, so it will not be omitted here. To repeat, this embodiment is different from the foregoing first embodiment in that the airtight chamber 13 has a supporting structure 14 which is composed of any one of a plurality of solid columns, hollow rings, and powder sintered columns. , And the two ends of the supporting structure 14 respectively press against the second and third sides 112 and 121, thereby increasing the degree of support of the airtight chamber 13 of the uniform temperature plate and avoiding collapse. Please refer to Figure 4, which is a combined cross-sectional view of the third embodiment of the composite capillary structure of the temperature equalizing plate of the present invention. As shown in the figure, this embodiment has the same partial structure as the foregoing first embodiment, so it will not be omitted here. To repeat, this embodiment is different from the aforementioned first embodiment in that the first sintered powder structure 1211a has a second sintered powder structure 1211c in the center, and the porosity of the first sintered powder structure 1211a is greater than that of the second sintered powder structure 1211a. The sintered powder structure 1211c can increase the water content of the heated area 1211 through the sintered powder with different porosity. Please refer to Figure 5, which is a combined cross-sectional view of the fourth embodiment of the composite capillary structure of the temperature equalizing plate of the present invention. As shown in the figure, this embodiment is partially the same as the first embodiment, so it will not be omitted here. To repeat, this embodiment is different from the aforementioned first embodiment in that the heat receiving area at the center of the second plate body 12 is formed with a recess 12a, and the recess 12a is formed by the third side 121 of the second plate body 12. The first sintered powder 1211a is formed by protruding toward the fourth side 122. The first sintered powder 1211a is filled in the recess 12a (it can be flush or recessed or protruding from the recess). The protrusions on the four sides 122 are in contact with a heat source 4 to improve the heat transfer efficiency in contact with the heat source 4. The above embodiments of the present invention are used in combination with a grid or fiber body and a sintered powder structure. The grid or fiber can reinforce the water return capacity of the uniform temperature plate in the horizontal direction, and at the same time, the sintered powder structure can improve the heating area. The moisture content avoids dry burning. The combined use of the composite capillary structure of the present invention further improves the conventional uniform temperature plate which only has the vertical vapor-liquid circulation effect, and lacks the horizontal vapor-liquid circulation effect.

11:第一板體 111:第一側 112:第二側 12:第二板體 121:第三側 122:第四側 2、2’:網格體、纖維體 1211:受熱區 1211a:第一燒結粉末結構 1211c:第二燒結粉末結構 13:氣密腔室 14:支撐結構 12a:凹部 3:工作液體 4:熱源11: The first board 111: first side 112: second side 12: The second board 121: third side 122: fourth side 2, 2’: Mesh body, fiber body 1211: Heated area 1211a: First sintered powder structure 1211c: Second sintered powder structure 13: Airtight chamber 14: Supporting structure 12a: recess 3: working fluid 4: heat source

第1a圖係為本發明之均溫板複合式毛細結構之第一實施例立體分解圖; 第1b圖係為本發明之均溫板複合式毛細結構之第一實施例立體分解圖; 第2圖係為本發明之均溫板複合式毛細結構之第一實施例組合剖視圖; 第3圖係為本發明之均溫板複合式毛細結構之第二實施例組合剖視圖; 第4圖係為本發明之均溫板複合式毛細結構之第三實施例組合剖視圖; 第5圖係為本發明之均溫板複合式毛細結構之第四實施例組合剖視圖。Figure 1a is a three-dimensional exploded view of the first embodiment of the composite capillary structure of the uniform temperature plate of the present invention; Figure 1b is a three-dimensional exploded view of the first embodiment of the composite capillary structure of the uniform temperature plate of the present invention; Figure 2 is a combined cross-sectional view of the first embodiment of the composite capillary structure of the uniform temperature plate of the present invention; Figure 3 is a combined cross-sectional view of the second embodiment of the composite capillary structure of the uniform temperature plate of the present invention; Figure 4 is a combined cross-sectional view of the third embodiment of the composite capillary structure of the uniform temperature plate of the present invention; Figure 5 is a combined cross-sectional view of the fourth embodiment of the composite capillary structure of the uniform temperature plate of the present invention.

11:第一板體11: The first board

111:第一側111: first side

112:第二側112: second side

12:第二板體12: The second board

121:第三側121: third side

122:第四側122: fourth side

2:網格體2: Mesh

1211:受熱區1211: Heated area

1211a:第一燒結粉末結構1211a: First sintered powder structure

13:氣密腔室13: Airtight chamber

Claims (4)

一種均溫板複合式毛細結構,係包含: 一第一板體,具有一第一側及一第二側; 一第二板體,具有一第三側及一第四側,所述第一、二板體對應蓋合形成一氣密腔室,所述第二板體之第三側設有一網格體,並該第三側具有至少一受熱區,所述受熱區具有一第一燒結粉末結構,並所述第一燒結粉末結構選擇與前述網格體或纖維體連接或接觸,並該氣密腔室內填充有一工作液體。A composite capillary structure of uniform temperature plate, which contains: A first board having a first side and a second side; A second plate body has a third side and a fourth side, the first and second plates correspondingly cover to form an airtight chamber, and the third side of the second plate body is provided with a grid body, And the third side has at least one heated zone, the heated zone has a first sintered powder structure, and the first sintered powder structure is selectively connected or in contact with the aforementioned mesh body or fiber body, and the airtight chamber Filled with a working fluid. 如請求項第1項所述之均溫板複合式毛細結構,其中該氣密腔室內具有一支撐結構,該支撐結構由複數實心柱、中空環、粉末燒結柱體其中任一所組成,並該支撐結構兩端分別抵頂該第二、三側。The uniform temperature plate composite capillary structure according to claim 1, wherein the airtight chamber has a support structure, and the support structure is composed of any one of a plurality of solid columns, hollow rings, and powder sintered columns, and The two ends of the supporting structure are against the second and third sides respectively. 如請求項第1項所述之均溫板複合式毛細結構,其中所述第一燒結粉末結構中央處具有一第二燒結粉末結構,所述第一燒結粉末結構之孔隙率大於該第二燒結粉末結構。The uniform temperature plate composite capillary structure according to claim 1, wherein the center of the first sintered powder structure has a second sintered powder structure, and the porosity of the first sintered powder structure is greater than that of the second sintered powder structure. Powder structure. 如請求項第1項所述之均溫板複合式毛細結構,其中所述第一、二板體係為銅、鋁、不銹鋼、陶瓷、商業純鈦、鈦合金、銅合金、鋁合金其中任一材質,並該第一、二板體可為相同或相異材質之組合。The uniform temperature plate composite capillary structure as described in claim 1, wherein the first and second plate systems are any of copper, aluminum, stainless steel, ceramics, commercial pure titanium, titanium alloys, copper alloys, and aluminum alloys Material, and the first and second plates can be a combination of the same or different materials.
TW109115620A 2020-05-11 2020-05-11 Compound wick structure of vapor chamber TWI803749B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW109115620A TWI803749B (en) 2020-05-11 2020-05-11 Compound wick structure of vapor chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109115620A TWI803749B (en) 2020-05-11 2020-05-11 Compound wick structure of vapor chamber

Publications (2)

Publication Number Publication Date
TW202142825A true TW202142825A (en) 2021-11-16
TWI803749B TWI803749B (en) 2023-06-01

Family

ID=80783509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109115620A TWI803749B (en) 2020-05-11 2020-05-11 Compound wick structure of vapor chamber

Country Status (1)

Country Link
TW (1) TWI803749B (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1815131A (en) * 2005-02-04 2006-08-09 富准精密工业(深圳)有限公司 Capillary structure, and its manufacturing method and heat pipe
CN101639331A (en) * 2008-07-31 2010-02-03 富准精密工业(深圳)有限公司 Method for manufacturing flat-plate heat tube
CN201758510U (en) * 2010-07-05 2011-03-09 周业勋 Thin heat conducting device with capillary structure
CN105698580B (en) * 2014-11-28 2017-11-03 台达电子工业股份有限公司 Heat pipe
TWI652443B (en) * 2018-07-24 2019-03-01 奇鋐科技股份有限公司 Heat dissipation unit
TWM598934U (en) * 2020-05-11 2020-07-21 奇鋐科技股份有限公司 Compound capillary structure of vapor chamber

Also Published As

Publication number Publication date
TWI803749B (en) 2023-06-01

Similar Documents

Publication Publication Date Title
US4046190A (en) Flat-plate heat pipe
TWI398616B (en) Micro - temperature plate structure improvement
CN100547336C (en) Penetrating support structure and manufacture method thereof
TWM517314U (en) Heat dissipation apparatus
JP3164517U (en) Heat pipe composite wick structure
CN111595187A (en) Composite capillary structure of vapor chamber
US11910574B2 (en) Heat dissipation unit
TWM598934U (en) Compound capillary structure of vapor chamber
TWI819157B (en) Ultra-thin vapor chamber and manufacturing method thereof
CN107466186B (en) A kind of novel evaporator structure and its application
JP2001339026A (en) Plate-shaped heat pipe
TWI596313B (en) Heat dissipation device
CN100513975C (en) Micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat thermal tube radiator
CN212300051U (en) Composite capillary structure of vapor chamber
TW202142825A (en) Compound wick structure of vapor chamber
CN202025742U (en) Improved heat conducting device
CN100360888C (en) Cylindrical heat pipe
TWI727194B (en) Heat dissipation unit
CN202025741U (en) Heat conducting device
JP4676090B2 (en) Plate heat pipe
CN100463150C (en) Heat sink device
CN110572983B (en) Direct contact low thermal resistance type heat pipe radiator for heating device
CN210470132U (en) Direct-contact low-thermal-resistance heat pipe radiator for heating device
CN211601669U (en) Heat dissipation element combination structure
TWI652443B (en) Heat dissipation unit